RS73xx-1

300mA Low Power LDO
1 FEATURES

3 DESCRIPTIONSLow Quiescent Current IQ:

300mA Output Current

Low Dropout Voltage



Low Temperature CoefficientHigh Input Voltage (up to 45V)

Output Voltage Accuracy: ±2%

Fixed 1.8 V, 2.5 V, 3.0 V, 3.3 V, 3.6 V andThe RS73xx-1 series is a set of low dropout linear
regulators implemented in CMOS technology. Which canprovide 300mA output current. The device allows input
voltage as high as 45V. It is very suitable for multicell
battery systems, bus voltage power supply systems andother high DC voltage systems. Wide input voltage canmake it well withstand the impact of surge voltage andensure the stability of output voltage.

3μA Typical at Light Loads

5 V Output Voltage
Over temperature protection and overcurrent protection functionMicro Size Packages: SOT23-3, SOT89-3(L-Type)The RS73xx-1 series only 3μA (typical) current isconsumed by itself, which is especially important in multibattery power supply systems and can reduce the standby
power consumption of the whole system.
The RS73xx-1 is available in Green SOT23-3 and SOT893 (L-Type) packages. Meet the requirements of dissipative
power for different applications.

Device Information (1)2 APPLICATIONSSmart Power Network Equipment

Portable Power Tools

PART NUMBER
RS73xx-1

BMS Systems
Motor Control System/Industrial Control
SystemPower Meter/Instrument



Vehicle-Mounted System

Firefighting / Security EquipmentConsumer Products(1)PACKAGEBODY SIZE(NOM)

SOT23-3

1.60mm×2.92mm

SOT89-3

2.45mm×4.50mm

For all available packages, see the orderable addendum at the endof the data sheet.

4 TYPICAL APPLICATION SCHEMATIC
VIN

VIN

CIN
1μF

VOUT

RS73xx-1

VOUTCOUT
1μF

GND

REV A.5

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RS73xx-1
Table of Contents
1 FEATURES ............................................................................................................................................................................... 12 APPLICATIONS ...................................................................................................................................................................... 13 DESCRIPTIONS ...................................................................................................................................................................... 1
4 TYPICAL APPLICATION SCHEMATIC ............................................................................................................................. 15 REVISION HISTORY ............................................................................................................................................................. 36 PACKAGE/ORDERING INFORMATION (1) ..................................................................................................................... 47 PIN CONFIGURATION AND FUNCTIONS ..................................................................................................................... 58 SPECIFICATIONS ................................................................................................................................................................... 6
8.1 Absolute Maximum Ratings .......................................................................................................................................... 6
8.2 ESD Ratings ...................................................................................................................................................................... 6
8.3 Recommended Operating Conditions ......................................................................................................................... 6
8.4 Electrical Characteristics ................................................................................................................................................ 7
8.5 Typical Characteristics ................................................................................................................................................... 89 FUNCTION INTRODUCTION ...........................................................................................................................................11
9.1 Functional Block Diagram............................................................................................................................................119.2 Precautions for Heat Dissipation Design .................................................................................................................11
9.3 Other Application Considerations .............................................................................................................................1110 PACKAGE OUTLINE DIMENSIONS .............................................................................................................................1211 TAPE AND REEL INFORMATION .................................................................................................................................142 / 15

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RS73xx-1
5 REVISION HISTORY
Note: Page numbers for previous revisions may different from page numbers in the current version.
VersionChange Date

A.4

2024/03/07

A.5

2024/06/03

Change Item
(1) Change SOT23-3 and SOT89-3 (L-Type) Thermal Information on Page 4 @A.3 Version.
(2) Add the TAPE AND REEL INFORMATION(3) Modify packaging naming
1. Add MSL on Page 5@RevA.4
2. Add Package thermal impedance on Page 4@RevA.4
3. Update PACKAGE note

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RS73xx-1
6 PACKAGE/ORDERING INFORMATION (1)PRODUCT
RS7318-1
RS7325-1
RS7330-1
RS7333-1
RS7336-1
RS7350-1

ORDERING
NUMBER
RS7318-1YF3

VOUT(V)

PACKAGE LEAD

1.8

SOT23-3

PACKAGEMARKING (2)7318

RS7318-1YE3L

1.8

SOT89-3(L-Type)MSL (3)

PACKAGE OPTIONMSL3

Tape and Reel, 3000

7318

MSL3

Tape and Reel, 1000

RS7325-1YF3

2.5

SOT23-3

7325

MSL3

Tape and Reel, 3000

RS7325-1YE3L

2.5

SOT89-3(L-Type)

7325

MSL3

Tape and Reel, 1000

RS7330-1YF3

3.0

SOT23-3

7330

MSL3

Tape and Reel, 3000

RS7330-1YE3L

3.0

SOT89-3(L-Type)

7330

MSL3

Tape and Reel, 1000

RS7333-1YF3

3.3

SOT23-3

7333

MSL3

Tape and Reel, 3000

RS7333-1YE3L

3.3

SOT89-3(L-Type)

7333

MSL3

Tape and Reel, 1000

RS7336-1YF3

3.6

SOT23-3

7336

MSL3

Tape and Reel, 3000

RS7336-1YE3L

3.6

SOT89-3(L-Type)

7336

MSL3

Tape and Reel, 1000

RS7350-1YF3

5.0

SOT23-3

7350

MSL3

Tape and Reel, 3000

RS7350-1YE3L

5.0

SOT89-3(L-Type)

7350

MSL3

Tape and Reel, 1000

NOTE:
(1) This information is the most current data available for the designated devices. This data is subject to change without notice and revisionof this document. For browser-based versions of this data sheet, refer to the right-hand navigation.
(2) There may be additional marking, which relates to the lot trace code information (data code and vendor code), the logo or theenvironmental category on the device.
(3) MSL, The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications.

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RS73xx-1
7 PIN CONFIGURATION AND FUNCTIONS
VIN
3VIN

73XX-173XX-1

1

2

GND

VOUT

SOT23-3

123

GND

VIN

VOUT

SOT89-3(L-Type)NOTE: XX indicate Output Voltage, xx indicate Date CodeFor example: 7333-1(VOUT=3.3V)

PIN DESCRIPTION
NAME

PIN

FUNCTION

SOT23-3

SOT89-3(L-Type)

GND

11Ground.

VOUT

23Output Pin. Recommended output capacitor range: 1μF to 10μF.

VIN

32EN//NC//Input Pin. At least 1μF supply bypass capacitor is recommended.
Enable Pin. EN pin voltage is higher than VEN(H) enable output andlower than VEN (L) close output.
No connection

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RS73xx-1
8 SPECIFICATIONS
8.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)
MIN

MAX

UNIT

VIN

Input voltage-0.3

48VVENVEN voltage range-0.3

VINV

θJA

Package thermal impedance (3)TJ

PN Junction temperature (4)PDContinuous power dissipation (5)Tstg

Storage temperature range

SOT23-3

315

SOT89-3(L-Type)

210°C/W-40
175
Internal thermal protection
temperature limit
-55
150°C
W°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only,and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the GND pin.
(3) The package thermal impedance is calculated in accordance with JESD-51.
(4) The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX) - TA) / RθJA. All numbers apply for packages soldered directly onto a PCB.
(5) Internal thermal shutdown circuitry protects the device from permanent damage. The actual chip output current is subject to the inputoutput voltage difference, ambient temperature and PCB heat dissipation design.

8.2 ESD Ratings
The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only.

V(ESD)

Electrostatic discharge

VALUEUNIT

Human-Body Model (HBM)±4000

VCharge Device Model (CDM)

±1500

V

ESD SENSITIVITY CAUTION
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its publishedspecifications.

8.3 Recommended Operating Conditionsover operating free-air temperature range (unless otherwise noted) (1)MINMAXUNIT

VIN

Input supply voltage

2.545VIOUT

Output current

0300mACIN

Input pin capacitance

110μF

COUTOutput pin capacitance

110μF

ESRCapacitance equivalent resistance

5100mΩ

-40+85 (2)°CTA

Operating temperature(1) All voltage is with respect to the GND pin.
(2) The operating temperature of the actual chip depends on the PN junction temperature. Please refer to the detailed calculation methodin the application precautions section.

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RS73xx-1
8.4 Electrical Characteristics(VIN = VOUT + 2V, CIN = COUT = 1μF, Full = -40°C to +85°C, typical values are at TA = +25°C, unless otherwise noted.)
PARAMETER
Input Voltage (1)SYMBOL

Shutdown Current

TEMP MIN (2)45

V

IOUT = 10mA

+25°C

-2.0

2.0%

IQ

IOUT = 0mA

+25°C

3.0

4.0μA

IQ-OFF

VEN =0V

+25°C

0.1

1.0μA

300

350-

mA-

450

550-

385485-350450-335435-

300

400

+25°C

-

0.05

0.2%/V+25°C-

520mV+25°C

300

450-

mA+25°C

-

100-

mA-

72-

-77-

-60-

1.2-

-

V--

0.4

V-

100-

ppm/°C-

100-

μVrms

TSHDN-

170-°C

TSDH-

20-°C

+25°C
VOUT =1.8V

Line Regulation
Load Regulation
Output Limiting Current
Short-Circuit Current
Power Supply Rejection
Ratio

VOUT =2.5V
VDROP
VOUT =3.0V
IOUT = 100mA
VOUT =3.3V

Output Noise Voltage
Thermal Shutdown
Temperature
Thermal Shutdown
Hysteresis Temperature+25°C

VOUT =5.0V
ΔVOUT
VIN = VOUT + 2V to 36V,
ΔVIN × VOUT IOUT = 1mA
VIN =VOUT+1V,
ΔVOUT
IOUT = 1mA to 50mA
I_LMT
VIN =VOUT+1V
IshortVOUT = 0

PSRR

VOUT = 3.3V,
IOUT = 10mA

f = 217Hz
f = 1KHz

+25°C

VENL
ΔVOUT
ΔTA × VOUT
en+25°Cf = 10KHz

VENH

Enable Pin Threshold
Output Voltage
Temperature Coefficient (6)MAX (2) UNITS

2.5 (1)

Output Current (4)Dropout Voltage (5)TYP (3)

+25°C

VIN

Output Voltage Accuracy
Static Power Consumption

CONDITIONSIOUT = 1mA

FULL

VIN =VOUT+1V, IOUT =1mA,
VOUT=3.0V, f = 10Hz to 100KHzmVdB

NOTES:(1) VIN = VOUT (NOMINAL) or 2.5V, or higher voltage.
(2) Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlations using statisticalquality control (SQC) method.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may varyover time and will also depend on the application and configuration.
(4) The maximum output current of the actual chip is subject to PCB heat dissipation design, input voltage, output voltage difference andambient temperature.
(5) Under the condition of VIN = VOUT + 2V and a fixed load, the output voltage decreases by 2%. At this time, the input voltage minus theoutput voltage is the dropout voltage.
(6) Output voltage temperature coefficient is defined as the worst-case voltage change divided by the total temperature range.

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RS73xx-1
8.5 Typical Characteristics
NOTE: The graphs and tables provided following this note are a statistical summary based on a limited number of samples
and are provided for informational purposes only.
(VIN = VOUT + 2V, CIN = COUT = 1μF, VOUT = 3.3V, typical values are at TA = +25°C, unless otherwise noted.)

VIN=0V to 5.3V,IOUT=50mA

VIN=5.3V to 6.3V,IOUT=50mA

2V/div

VOUT

2V/div

VIN

50mV/div

VOUT

1V/div

VINTime(100 s/div)

Time(1ms/div)

Figure 1. Line Transient Response

Figure 2. Power-Up/Power-Down Output
Waveform

VOUT=3.3V

VOUT=3.3V

VOUT

50mA/div

100mA/div

IOUT

20mV/div

50mV/div

VOUT

IOUT

IOUT=1mA to 100mA

IOUT=10mA to 50mA

Time(500 s/div)

Time(500 s/div)

Figure 3. Load Transient Response

3.31

3.31

VOUT=3.3V

VOUT=3.3V

Output Voltage(V)Output Voltage(V)Figure 4. Load Transient Response

3.305

3.3

3.295

3.29

3.3

3.29

3.28

3.27
4

14

24

34

44

54

0

Input Voltage(V)

50100

150

200

250

300

Output Current(mA)

Figure 5. Line Regulation

Figure 6. Load Regulation

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RS73xx-1
Typical Characteristics (Continued)
NOTE: The graphs and tables provided following this note are a statistical summary based on a limited number of samples
and are provided for informational purposes only.
(VIN = VOUT + 2V, CIN = COUT = 1μF, VOUT = 3.3V, typical values are at TA = +25°C, unless otherwise noted.)

Figure 7. Vdrop vs Iout

Figure 8. Vout vs Temperature

Figure 9. Iq vs Temperature

Figure 10. Vdrop – Iout vs Temperature

Figure 11. Vout – Vin vs Temperature(Iout=1mA)

Figure 12. Vout – Vin vs Temperature(Iout=10mA)

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RS73xx-1
Typical Characteristics (Continued)
NOTE: The graphs and tables provided following this note are a statistical summary based on a limited number of samples
and are provided for informational purposes only.
(VIN = VOUT + 2V, CIN = COUT = 1μF, VOUT = 3.3V, typical values are at TA = +25°C, unless otherwise noted.)

Figure 13. PSRR@30mA

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RS73xx-1
9 FUNCTION INTRODUCTION
RS73xx-1 series low dropout linear regulator (LDO) consumes only 3μA of current and has excellent linear
adjustment and load characteristics to meet the requirements of lower output noise and higher PSRR, making it
more suitable for applications requiring ultra-low standby power consumption of the whole machine.

9.1 Functional Block Diagram

9.2 Precautions for Heat Dissipation Design
When the junction temperature of PN junction is too high and reaches the set temperature value, it will trigger
the thermal protection circuit to send a signal to the control logic to turn off the chip output. When the PN
junction temperature is lower than the set protection temperature, the chip will restart automatically. Themaximum output power actually provided by the chip depends on the heat dissipation design of the system,including ambient temperature, wiring thickness and layout, and cooling design, such as adding heat sink and aircooling. Increasing the PCB area of GND pin can also obtain better heat dissipation performance.

9.3 Other Application Considerations(1) The phase compensation circuit and ESR of the output capacitor are used inside the circuit to compensate,
so a capacitor larger than 1.0μF must be connected to the ground.
(2) It is recommended to use 1μF polar capacitors for input and output, and to keep the capacitors as close tothe VIN and VOUT pins of LDO as possible.
(3) Pay attention to the service conditions of input and output voltage and load current to make the junction
temperature of PN junction lower than the overheat protection temperature.
Approximate estimation method of PN junction temperature:
TPN =(VIN-VOUT) × IOUT×RθJA+T
IOUT is Load current;
T is ambient temperature.
(4) When the input voltage VIN is greater than 2.5V, if VIN is also higher than the output set value plus the device
dropout voltage, VOUT is equal to the set value. Otherwise, VOUT is equal to VIN minus the dropout voltage. If VINlower than 2.5V, the VOUT is:
VOUT = VIN - VDropout
VDropout is converted according to the actual load current and basically maintains a linear relationship.

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RS73xx-1
10 PACKAGE OUTLINE DIMENSIONSSOT23-3 (3)
D

1.90

b

2.59

E1

E
0.99

0.95

0.69
ee1

RECOMMENDED LAND PATTERN (Unit: mm)

0.2
A A2cθ
L

A1

Dimensions In Millimeters

Dimensions In Inches

MinMaxMinMaxA (1)

1.050

1.250

0.041

0.049

A1

0.000

0.100

0.000

0.004

A2

1.050

1.150

0.041

0.045

b0.300

0.500

0.012

0.020

c0.100

0.200

0.004

0.008

D (1)

2.820

3.020

0.111

0.119

E (1)

1.500

1.700

0.059

0.067

E1

2.650

2.950

0.104

0.116

Symbol0.950(BSC) (2)e0.037(BSC) (2)

e1

1.800

2.000

0.071

0.079

L

0.300

0.600

0.012

0.024

θ

0°

8°

0°

8°

NOTE:
1. Plastic or metal protrusions of 0.15mm maximum per side are not included.
2. BSC (Basic Spacing between Centers), "Basic" spacing is nominal.
3. This drawing is subject to change without notice.

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RS73xx-1
SOT89-3 (4)SymbolDimensions In Millimeters

Dimensions In Inches

MinMaxMinMax

A (1)

1.400

1.600

0.055

0.063

b0.320

0.520

0.013

0.020

b1

0.400

0.580

0.016

0.023

c0.350

0.440

0.014

0.017

D (1)

4.400

4.600

0.173

0.181

1.550 REF (2)

D1
E (1)

2.300

E1

3.940

0.061 REF (2)
2.600

0.091

4.250

0.155

0.102
0.167

e

1.500 BSC (3)0.060 BSC (3)e13.000 BSC (3)0.118 BSC (3)

L

0.900

1.200

0.035

0.047

NOTE:
1. Plastic or metal protrusions of 0.15mm maximum per side are not included.
2. REF is the abbreviation for Reference.
3. BSC (Basic Spacing between Centers), "Basic" spacing is nominal.
4. This drawing is subject to change without notice.

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RS73xx-1
11 TAPE AND REEL INFORMATIONREEL DIMENSIONSTAPE DIMENSION

ReelDiameter

Reel Width(W1)

DIRECTION OF FEEDNOTE: The picture is only for reference. Please make the object as the standard.

KEY PARAMETER LIST OF TAPE AND REEL
SOT23-3

Reel
Diameter7’’

Reel
Width(mm)9.0A0(mm)3.20

B0(mm)
3.30

K0(mm)
1.30

P0(mm)
4.0

P1(mm)
4.0

P2(mm)
2.0W(mm)8.0

Pin1
Quadrant
Q3

SOT89-3

7’’

13.2

4.85

4.45

1.85

4.0

8.0

2.0

12.0

Q3

Package TypeNOTE:
1. All dimensions are nominal.
2. Plastic or metal protrusions of 0.15mm maximum per side are not included.

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RS73xx-1
IMPORTANT NOTICE AND DISCLAIMER
Jiangsu RUNIC Technology Co., Ltd. will accurately and reliably provide technical and reliability data (includingdata sheets), design resources (including reference designs), application or other design advice, WEB tools, safety
information and other resources, without warranty of any defect, and will not make any express or implied
warranty, including but not limited to the warranty of merchantability Implied warranty that it is suitable for a
specific purpose or does not infringe the intellectual property rights of any third party.
These resources are intended for skilled developers designing with RUNIC products You will be solely
responsible for: (1) Selecting the appropriate products for your application; (2) Designing, validating and testing
your application; (3) Ensuring your application meets applicable standards and any other safety, security or otherrequirements; (4) RUNIC and the RUNIC logo are registered trademarks of RUNIC INCORPORATED. All
trademarks are the property of their respective owners; (5) For change details, review the revision history
included in any revised document. The resources are subject to change without notice. Our company will not beliable for the use of this product and the infringement of patents or third-party intellectual property rights due
to its use.

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