RS2227

High-Speed USB 2.0 (480-Mbps)
1:2 Multiplexer/Demultiplexer Switch
1 FEATURES

3 DESCRIPTIONS

-3dB Bandwidth: 550MHz

Supply Range: +1.8V to +5.5VRON is Typically 6Ω

Fast Switching Times:

The RS2227 is a high-speed, low-power doublepole/double-throw (DPDT) analog switch with single
Enable. It is designed to operate from 1.8 V to 5.5 V.
The RS2227 has a bus-switch enable pin, ̅̅̅̅OE, that canplace the signal paths in high impedance. This allows theuser to isolate the bus when it is not in use and consumeless current.

tON 20ns
tOFF 15nsBreak-Before-Make Switching

Low Power Consumption (1μA Maximum)

Rail-to-Rail Input and Output Operation

Extended Industrial Temperature Range:-40°C to +85°C

Micro Size Packages: MSOP10,

The RS2227 is a high-bandwidth switch speciallydesigned for the switching of high-speed USB2.0 signals
in handset and consumer applications, such as cellphones, digital cameras, and notebooks with hubs orcontrollers with limited USB I/Os.
The RS2227 is available MSOP10 and UQFN1.4X1.8-10
package. It operates over an ambient temperature rangeof -40°C to +85°C.

UQFN1.4X1.8-10

2 APPLICATIONSRoutes Signals for USB 1.0, 1.1, and 2.0

MP3 and Other Personal Media Players

Portable Instrumentation

USB Switching

Digital Cameras



Set-Top Box

Cell Phones



PDAs

Device Information (1)PART
NUMBER
RS2227(1)

PACKAGEBODY SIZE (NOM)UQFN1.4X1.8-10

1.80mm×1.40mm

MSOP103.00mm×3.00mm

For all available packages, see the orderable addendum at the endof the data sheet.

4 FUNCTIONAL BLOCK DIAGRAM
HSD1+D+HSD2+

HSD1–D–

HSD2–SOE

REV B.5Control

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RS2227
Table of Contents
1 FEATURES ............................................................................................................................................................................... 12 APPLICATIONS ...................................................................................................................................................................... 13 DESCRIPTIONS ...................................................................................................................................................................... 1
4 FUNCTIONAL BLOCK DIAGRAM ..................................................................................................................................... 1
5 REVISION HISTORY ............................................................................................................................................................. 3
6 PACKAGE/ORDERING INFORMATION (1) ..................................................................................................................... 4
7 PIN CONFIGURATIONS ...................................................................................................................................................... 5
7.1 Pin Description ................................................................................................................................................................ 5
7.2 Function Table ................................................................................................................................................................. 5
8 SPECIFICATIONS ................................................................................................................................................................... 7
8.1 Absolute Maximum Ratings .......................................................................................................................................... 7
8.2 ESD Ratings ...................................................................................................................................................................... 7
8.3 Recommended Operating Conditions ......................................................................................................................... 7
8.4 Electrical Characteristics ................................................................................................................................................ 89 PARAMETER MEASUREMENT INFORMATION ........................................................................................................1010 APPLICATION NOTES .....................................................................................................................................................13
11 PACKAGE OUTLINE DIMENSIONS .............................................................................................................................1412 TAPE AND REEL INFORMATION .................................................................................................................................162 / 17

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RS2227
5 REVISION HISTORY
Note: Page numbers for previous revisions may different from page numbers in the current version.
VERSION

Change Date

B.4

2023/05/19

B.4.1

2024/03/11

B.5

2024/05/10

Change Item
1. Added the TAPE AND REEL INFORMATION
2. Update package marking
Modify packaging naming
1. Add MSL on Page 6@RevB.4.1
2. Add Package thermal impedance on Page 5@RevB.4.1
3. Update PACKAGE note

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RS2227
6 PACKAGE/ORDERING INFORMATION (1)PRODUCTRS2227

ORDERING
NUMBER
RS2227XN

TEMPERATURE
RANGE-40°C ~+85°C

RS2227XUTQK10-40°C ~+85°C

MSOP10PACKAGEMARKING (2)RS2227UQFN1.4X1.8-10

2227

PACKAGE LEAD

MSL (3)

PACKAGE OPTIONMSL3Tape and Reel, 4000

MSL3

Tape and Reel, 4000

NOTE:
(1) This information is the most current data available for the designated devices. This data is subject to change without notice and revisionof this document. For browser-based versions of this data sheet, refer to the right-hand navigation.
(2) There may be additional marking, which relates to the lot trace code information (data code and vendor code), the logo or theenvironmental category on the device.
(3) MSL, The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications.

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RS2227
7 PIN CONFIGURATIONSRS2227
V+

1

10 OE

S

29

HSD2+

D+

3

8

HSD2-

D-

4

7

HSD1+

GND 5

6

HSD1-MSOP10

7.1 Pin Description
PIN

NAME

MSOP10FUNCTION

V+1

Power Supply

GND5GroundS

2Select Input

OE

10Output Enable

HSD1+, HSD2+

7,9

HSD1-, HSD2-

6,8

D+, D-

3,4

Data Port

7.2 Function Table
̅̅̅̅𝐎𝐄S

HSD1+, HSD1-

HSD2+, HSD2-00ONOFF

01OFFON

1X

OFF

OFF

Note: X =Don’t care

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RS2227
PIN CONFIGURATIONS(TOP VIEW)

OE

8V+

9

HSD2+

HSD2-

76

LOGIC

S 10
12

D+D-

5

HSD1+

4

HSD1-

3

GND

UQFN1.4X1.8-10

Pin Description
PIN

NAME

UQFN1.4X1.8-10

FUNCTIONV+

9Power Supply

GND

3GroundS10Select InputOE

8Output Enable

HSD1+, HSD2+5,7

HSD1-, HSD2-

4,6D+, D-1,2

Data Port

Function Table
̅̅̅̅𝐎𝐄S

HSD1+, HSD1-

HSD2+, HSD2-00ONOFF01OFFON1XOFFOFF

Note: X =Don’t care

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RS2227
8 SPECIFICATIONS
8.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted) (1)SYMBOLMIN

MAX

Supply Voltage

-0.3

6.0

Analog, Digital Voltage Range (2)-0.3(V+)+0.3

Continuous Current HSDn or Dn-100+100IPEAKPeak Current HSDn or Dn-150+150

θJA

Package thermal impedance (3)TJ

Junction Temperature (4)-40

150Tstg

Storage temperature-65+150V+PARAMETERMSOP10200

UQFN1.4X1.8-10115

UNITVmA°C/W°C(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond thosespecified is not implied.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3V beyond the supply rails should
be current-limited to 10mA or less.
(3) The package thermal impedance is calculated in accordance with JESD-51.
(4) The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX) - TA) / RθJA. All numbers apply for packages soldered directly onto a PCB.

8.2 ESD Ratings
The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only.

V(ESD)

Electrostatic discharge

VALUEUNIT

Human-Body Model (HBM)±3000

VMachine Model (MM)

±200

V

ESD SENSITIVITY CAUTION
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its publishedspecifications.

8.3 Recommended Operating Conditions
Over operating free-air temperature range (unless otherwise noted)
SYMBOLPARAMETERMINMAXUNIT

VCCSupply Voltage

1.85.5VTA

Operating temperature-40+85°C

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RS2227
8.4 Electrical Characteristics(V+ = +1.8V to +5.5V, GND = 0V, VIH = +1.5V, VIL = +0.5V, TA = -40°C to + 85°C. Typical values are at V+ = +3.3V, TA =+25°C, unless otherwise noted.)
PARAMETERANALOG SWITCH
Analog I/O Voltage(HSD1+, HSD1-, HSD2+, HSD2-)

SYMBOL

CONDITIONS

VIS

TA-40°C to +85°C

RON

V+ = 3.0V, VIS = 0V to 0.4V,ID = 8mA, See Figure 1-40°C to +85°C

On-Resistance Match Between
Channels∆RON

V+ = 3.0V, VIS = 0V to 0.4V,
ID = 8mA, See Figure 1-40°C to +85°C

On-Resistance Flatness

RFLAT(ON)

V+ = 3.0V, VIS = 0V to 1.0V,
ID = 8mA, See Figure 1

Power Off Leakage Current (D+,D-)
Increase in I+ per Control Voltage

V+ = 0V, VD = 0V to 3.6 V,
VS, VOE
̅̅̅̅ = 0V or 3.6 V
V+ = 4.3V, VS or VOE
ICCT̅̅̅̅ = 2.6 V
IHSD2(OFF) V+ = 3.6V, VIS = 3.3V/ 0.3V,
IHSD1(OFF) VD = 0.3V/ 3.3V
IHSD2(ON) V+ = 3.6V, VIS = 3.3V/ 0.3V,
IHSD1(ON) VD = 0.3V/ 3.3V or floating

Source Off Leakage Current
Channel On Leakage Current

0+25°C

On-ResistanceIOFF

MIN(2) TYP(3) MAX(2) UNIT

V+6

10
10.5+25°C

0.15+25°C

5V
Ω

0.6

Ω

1.6

Ω

7

Ω

-40°C to +85°C

8-40°C to +85°C

1μA-40°C to +85°C

40μA-40°C to +85°C

1μA-40°C to +85°C

1μA

DIGITAL CONTROL INPUTS (1)Input High Voltage

VIH-40°C to +85°C

Input Low Voltage

VIL-40°C to +85°C

0.5VInput Leakage Current

IIN-40°C to +85°C

1μA

V+ = 3.0V, VS, VOE̅̅̅̅ = 0V or V+1.6

V(1) All unused digital inputs of the device must be held at VIO or GND to ensure proper device operation.
(2) Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlations using statisticalquality control (SQC) method.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may varyover time and will also depend on the application and configuration.

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RS2227
Electrical Characteristics (continued)(V+ = +1.8V to +5.5V, GND = 0V, VIH = +1.5V, VIL = +0.5V, TA = -40°C to + 85°C. Typical values are at V+ = +3.3V, TA =+25°C, unless otherwise noted.)
PARAMETERSYMBOL

CONDITIONSTAMIN

TYP MAX UNIT

DYNAMIC CHARACTERISTICS
Turn-On TimetON

Turn-Off TimetOFF+25°C

20ns+25°C

15ns

Break-Before-Make Time DelaytD+25°C

4nsPropagation DelaytPD+25°C

0.35

ns

Off Isolation

OISO+25°C-35dB

Channel-to-Channel Crosstalk

XTALK+25°C-40dB-3dB Bandwidth

BW+25°C

550

MHz

Channel-to-Channel Skew
Charge Injection Select Input
to Common I/O
HSD+, HSD-, D+, D- ON
Capacitance
POWER REQUIREMENTS

tSKEW

+25°C

0.05

ns+25°C

11pC

CON+25°C

7pF

Power Supply Range

V+-40°C to +85°C

Power Supply Current

I+Q

VIS = 0.8V, RL = 50Ω,
CL = 10pF, See Figure 2
VIS = 0.8V, RL = 50Ω,
CL = 10pF, See Figure 3
RL = 50Ω, CL = 10pF
Signal = 0dBm, RL = 50Ω,
f = 250MHz, See Figure 4Signal = 0dBm, RL = 50Ω,
f = 250MHz, See Figure 5Signal = 0dBm, RL = 50Ω,
CL = 5pF, See Figure 6
RL = 50Ω, CL = 10pF
VG = GND, CL = 1.0nF, RG = 0Ω,
Q = CL x VOUT, See Figure 7

V+ = 3.0V, VS, VOE̅̅̅̅ = 0V or V+

9 / 17-40°C to +85°C

1.8

5.5V1μA

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RS2227
9 PARAMETER MEASUREMENT INFORMATION
V+VHSD1n

HSD1nVHSD2n

HSD2n

VIS

Dn+Channel ON
R ON

VSELID

SVIS- VHSD1nI orVHSD2nΩ
D

VSEL = VIH or V IL+GND

Figure 1. ON-State Resistance (RON)

V+

V+

HSD1n

50%50%
Dn

HSD2n

VOUT

0.1μF

VOH
RL
VS

90%

90%

CL

VOL

GND

tOFF

tON

Figure 2. Turn-On (tON) and Turn-Off Time (tOFF)

V+

HSD1n

V+

VS
Dn

HSD2n

VOUT

0.1μ F
RL

CL

VS

50%00

GND

90% of VOH

VOUT

tD

Figure 3. Break-Before-Make Time (tD)

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RS2227
PARAMETER MEASUREMENT INFORMATION
V+0.1μF

V+

HSD1n

Dn

VOUT

HSD2n
SourceSignalRLS
GND

Figure 4. OFF Isolation (OISO)
V+

0.1μ F

V+HSDnDn
RL

SourceSignal
HSDn

N.C.

Dn

VOUT
RL

S
GND

Channel To Channel Crosstalk = -20 × log

VHSDn
VOUT

Figure 5. Channel-to-Channel Crosstalk
0.1μF

V+

V+
HSDn
SourceSignal

Dn

VOUT

RL

S

CL

GND

Figure 6. -3dB Bandwidth

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RS2227
PARAMETER MEASUREMENT INFORMATION

V+

HSD1n
RG
VG

0Dn
VOUT

HSD2n

CLS

Δ OUT

VOUT

GND

Q = ΔVOUT× CLFigure 7. Charge Injection (Q)12 / 17

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RS2227
10 APPLICATION NOTESThere are many USB applications in which the USB hubs or controllers have a limited number of USB I/Os. The
RS2227 solution can effectively expand the limited USB I/Os by switching between multiple USB buses in order
to interface them to a single USB hub or controller. RS2227 can also be used to connect a single controller totwo USB connectors or controllers.
Design requirements of the USB 1.0, 1.1, and 2.0 standards should be followed. It is recommended that thedigital control pins S and ̅̅̅̅OE be pulled up to V+ or down to GND to avoid undesired switch positions that could
result from the floating pin.
V+

RS2227HSD1+
USB2.0Controller

D+
HSD1USB
Connector

Processor
D–HSD2+Controller

HSD2-Control

SOE

Figure 8. Application Diagram

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RS2227
11 PACKAGE OUTLINE DIMENSIONSMSOP10 (3)
be

E

4.65

E1

1.02
D

0.5

0.31

RECOMMENDED LAND PATTERN (Unit: mm)

cA2

A

A1LθDimensions In Millimeters

Dimensions In Inches

MinMaxMinMaxA (1)0.820

1.1000.032

0.043

A1

0.020

0.150

0.001

0.006

A2

0.750

0.950

0.030

0.037

b0.180

0.280

0.007

0.011

c0.090

0.230

0.004

0.009

D (1)

2.900

3.100

0.114

0.122

Symbol0.500(BSC) (2)e0.020(BSC) (2)

E (1)

2.900

3.100

0.114

0.122

E1

4.750

5.050

0.187

0.199

L

0.400

0.800

0.016

0.031

θ

0°

6°

0°6°

NOTE:
1. Plastic or metal protrusions of 0.15mm maximum per side are not included.
2. BSC (Basic Spacing between Centers), "Basic" spacing is nominal.
3. This drawing is subject to change without notice.

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RS2227
UQFN1.4X1.8-10 (3)EL1ce

PIN #1 IDENTIFICATIONCHAMFER 0.350 × 45°(× 9)

DPIN #1 DOT
BY MARKINGdL2

TOP VIEWba

BOTTOM VIEW
2.100

0.563

A

1.700

A2
A1

0.663
0.225

SIDE VIEW
0.20

0.40

RECOMMENDED LAND PATTERN

SymbolDimensions In Millimeters

Dimensions In Inches

MinMaxMin

MaxA (1)

0.500

0.600

0.020

0.024

A10.000

0.050

0.000

0.002

0.203 REF (2)A20.008 REF (2)a0.0500.1500.002

0.006

b0.150

0.250

0.006

0.010

c0.450

0.550

0.018

0.022

0.800 REF (2)d0.031 REF (2)

D (1)

1.350

1.450

0.053

0.057

E (1)

1.750

1.850

0.069

0.073

e0.400 TYP

0.016 TYP

L1

0.350

0.450

0.014

0.018

L2

0.450

0.550

0.018

0.022

NOTE:
1. Plastic or metal protrusions of 0.075mm maximum per side are not included.
2. REF is the abbreviation for Reference.
3. This drawing is subject to change without notice.

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RS2227
12 TAPE AND REEL INFORMATIONREEL DIMENSIONSTAPE DIMENSION

ReelDiameter

Reel Width(W1)

DIRECTION OF FEEDNOTE: The picture is only for reference. Please make the object as the standard.

KEY PARAMETER LIST OF TAPE AND REEL
MSOP10

Reel
Diameter
13’’

Reel Width
(mm)
12.4

A0(mm)
5.20

B0(mm)
3.30

K0(mm)
1.20

P0(mm)
4.0

P1(mm)
8.0

P2(mm)
2.0

W
(mm)
12.0

Pin1
Quadrant
Q1

UQFN1.4X1.8-10

7’’

9.0

1.60

2.00

0.85

4.0

4.0

2.0

8.0

Q1

Package TypeNOTE:
1. All dimensions are nominal.
2. Plastic or metal protrusions of 0.15mm maximum per side are not included.

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RS2227
IMPORTANT NOTICE AND DISCLAIMER
Jiangsu RUNIC Technology Co., Ltd. will accurately and reliably provide technical and reliability data (including
data sheets), design resources (including reference designs), application or other design advice, WEB tools, safety
information and other resources, without warranty of any defect, and will not make any express or implied
warranty, including but not limited to the warranty of merchantability Implied warranty that it is suitable for aspecific purpose or does not infringe the intellectual property rights of any third party.
These resources are intended for skilled developers designing with RUNIC products You will be solely
responsible for: (1) Selecting the appropriate products for your application; (2) Designing, validating and testing
your application; (3) Ensuring your application meets applicable standards and any other safety, security or otherrequirements; (4) RUNIC and the RUNIC logo are registered trademarks of RUNIC INCORPORATED. All
trademarks are the property of their respective owners; (5) For change details, review the revision history
included in any revised document. The resources are subject to change without notice. Our company will not beliable for the use of this product and the infringement of patents or third-party intellectual property rights due
to its use.

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