RS75xx-1

150mA, Low Power Consumption,High Voltage CMOS LDO Regulator
1 FEATURES

3 DESCRIPTIONS•

Low Quiescent Current IQ:
2μA Typical at Light Loads•150mA Nominal Output Current•

Low Dropout Voltage•

Low Temperature Coefficient•High Input Voltage (up to 36V)

•Output Voltage Accuracy: ±2%•Fixed 2.5 V, 3.0 V, 3.3 V, 3.6 V and 5 V

The RS75xx-1 series is a set of low power high voltage
regulators implemented in CMOS technology. Whichcan provide 150mA output current. The device allows
input voltage as high as 36V.It is very suitable for multicell battery systems, bus voltage power supply systems
and other high DC voltage systems. Wide input voltage
can make it well withstand the impact of surge voltage
and ensure the stability of output voltage.
The RS75xx-1 series only 2μA (typical) current isconsumed by itself, which is especially important in
multi-battery power supply systems and can reduce thestandby power consumption of the whole system.

Output Voltage•Over temperature protection•

Short Circuit Protection•

Micro Size Packages: SOT23-3 and SOT89-3

The RS75xx-1 is available in Green SOT23-3 andSOT89-3 packages. The over temperature is 150 °C.

2 APPLICATIONS

Device Information (1)•Audio/Video Equipment•Communication Equipment•

Battery-Powered Equipment•Automotive Head Unit•

Laptop, Palmtops, Notebook Computers

PART NUMBER
RS75xx-1(1)

PACKAGEBODY SIZE (NOM)

SOT23-3

1.60mm×2.92mm

SOT89-3

2.45mm×4.50mm

For all available packages, see the orderable addendum at theend of the data sheet.

4 TYPICAL APPLICATION SCHEMATIC
VIN

VINCIN
1 F

VOUT

RS75xx-1

VOUTCOUT1~22 F

GND

REV A.11

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RS75xx-1
Table of Contents
1 FEATURES ............................................................................................................................................................................... 12 APPLICATIONS ...................................................................................................................................................................... 13 DESCRIPTIONS ...................................................................................................................................................................... 14 TYPICAL APPLICATION SCHEMATIC ............................................................................................................................. 15 REVISION HISTORY ............................................................................................................................................................. 36 PACKAGE/ORDERING INFORMATION (1) ..................................................................................................................... 47 PIN CONFIGURATION AND FUNCTIONS ..................................................................................................................... 58 SPECIFICATIONS ................................................................................................................................................................... 68.1 Absolute Maximum Ratings .......................................................................................................................................... 68.2 ESD Ratings ...................................................................................................................................................................... 68.3 Recommended Operating Conditions ......................................................................................................................... 6
8.4 Electrical Characteristics ................................................................................................................................................ 78.5 Typical Characteristics ................................................................................................................................................... 99 DETAILED DESCRIPTION .................................................................................................................................................119.1 Overview .........................................................................................................................................................................119.2 Functional Block Diagram............................................................................................................................................119.3 Thermal Considerations ...............................................................................................................................................11
9.4 Applications Note: .........................................................................................................................................................1110 PACKAGE OUTLINE DIMENSIONS .............................................................................................................................1211 TAPE AND REEL INFORMATION .................................................................................................................................142 / 15

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RS75xx-1
5 REVISION HISTORY
Note: Page numbers for previous revisions may different from page numbers in the current version.
VERSION

Change Date

A.10

2023/05/08

A.10.12024/03/07

A.11

2024/06/12

Change Item
1.Update Typical Application Schematic on Page 1 @A.9 Version.
2.Increase Power Dissipation and Junction Temperature Range on Page 4 @A.9 Version.
3.Increase RS7533-1YF3-G ORDERING NUMBER on Page 3 @A.9 Version.
Modify packaging naming
1. Add MSL on Page 4@RevA.10.1
2. Add Package thermal impedance on Page 6@RevA.10.1
3. Update PACKAGE note
4. Delete RS7533-1YF3-G ORDERING NUMBER

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RS75xx-1
6 PACKAGE/ORDERING INFORMATION (1)PRODUCT
RS7525-1
RS7530-1

RS7533-1

RS7536-1

RS7550-1

ORDERING
NUMBER
RS7525-1YF3

VOUT(V)

PACKAGE LEAD

2.5

SOT23-3

PACKAGEMARKING (2)7525-1

RS7525-1YE3L

2.5

SOT89-3(L-Type)

RS7530-1YF3

3.0

SOT23-3

RS7530-1YE3L

3.0

MSL (3)

PACKAGE OPTIONMSL3Tape and Reel, 3000

7525-1MSL3

Tape and Reel, 1000

7530-1MSL3

Tape and Reel, 3000

SOT89-3(L-Type)7530-1MSL3

Tape and Reel, 1000

RS7533-1YF3

3.3

SOT23-37533-1MSL3

Tape and Reel, 3000

RS7533-1YE3

3.3

SOT89-37533-E

MSL3

Tape and Reel, 1000

RS7533-1YE3L

3.3

SOT89-3(L-Type)7533-1MSL3

Tape and Reel, 1000

RS7536-1YF3

3.6

SOT23-37536-1MSL3

Tape and Reel, 3000

RS7536-1YE3L

3.6

SOT89-3(L-Type)7536-1MSL3

Tape and Reel, 1000

RS7550-1YF3

5.0

SOT23-3

7550-1MSL3

Tape and Reel, 3000

RS7550-1YE3

5.0

SOT89-3

7550-E

MSL3

Tape and Reel, 1000

RS7550-1YE3L

5.0

SOT89-3(L-Type)

7550-1MSL3

Tape and Reel, 1000

NOTE:
(1) This information is the most current data available for the designated devices. This data is subject to change without notice and revisionof this document. For browser-based versions of this data sheet, refer to the right-hand navigation.
(2) There may be additional marking, which relates to the lot trace code information (data code and vendor code), the logo or theenvironmental category on the device.
(3) MSL, The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications.

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RS75xx-1
7 PIN CONFIGURATION AND FUNCTIONS
VIN

VIN

GND

75XX-175XX-E

375XX-1
xxxxxx

12

GND

VOUT

xxxxxxSOT23-3XXXXXX

123

1

GND

VIN

VOUT

VOUT

SOT89-3(L-Type)

23

GND

VIN

SOT89-3

PIN DESCRIPTION
NAME

PIN
SOT23-3

SOT89-3(L-Type)SOT89-3

GND112VIN

323VOUT

231FUNCTION
Ground.
Regulator Input. Up to 36V input voltage. At least 1μF
supply bypass capacitor is recommended.
Regulator Output. Recommended output capacitor range:
1μF to 10μF.

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RS75xx-1
8 SPECIFICATIONS
8.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)MIN

MAXUNIT

-0.3

40

V

VIN

Input voltage

θJA

Package thermal impedance (3)TJ

PN Junction temperature (4)-40150°CTstg

Storage temperature range-65

150°C

(1)
(2)(3)(4)

SOT89-3(L-Type)210

SOT89-3

75

SOT23-3

315°C/W

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended OperatingConditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to the GND pin.
The package thermal impedance is calculated in accordance with JESD-51.
The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX) - TA) / RθJA. All numbers apply for packages soldered directly onto a PCB.

8.2 ESD Ratings
The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only.

V(ESD)

Electrostatic discharge

VALUE

UNIT

Human-Body Model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)±4000

VMachine Model (MM)

±100

V

(1) JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process.

ESD SENSITIVITY CAUTION
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its publishedspecifications.

8.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) (1)
MINMAXUNIT

VIN

Input supply voltage

2.536V

IOUT

Output current

0150mA

COUT

Capacitor of VOUT pin

122μFTJJunction Temperature Range (2)-40+85°C-40+85 (3)°CTA

Operating temperature(1) All voltage is with respect to the GND pin.
(2) The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (T J(MAX) - TA) / RθJA. All numbers apply for packages soldered directly onto a PCB.
(3) The chip’s operating temperature is determined by the junction temperature (TJ), the relationship between TA and TJ, Please refer to theapplication note as below.

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8.4 Electrical Characteristics(VIN = VOUT + 2V, CIN = COUT = 1μF, VOUT = 3.3V, Full = -40°C to +85°C, typical values are at TA = +25°C, unless otherwisenoted.)
PARAMETER
Input Voltage (1)SYMBOL
VIN

CONDITIONSTEMPMIN(2) TYP(3) MAX(2) UNITSVOUT = 3.3V

+25°C

--36

Output Voltage Accuracy

IOUT = 10mA+25°C-202%

Ground Pin Current

No load+25°C

-23μA

+25°C

70100-mA+25°C-526800mV

+25°C

0.05

0.2%/V

+25°C

2560

mV

Maximum Output Current (4)Dropout Voltage (5)Line Regulation
Load Regulation
Power Supply Rejection
Ratio

VDROP
IOUT =100mA, ΔVo=2%
ΔVOUT
VIN = VOUT + 2V to 36V, IOUT = 1mA
ΔVIN × VOUT
ΔVOUT
VIN =VOUT+2V, IOUT = 1mA to 50mA
PSRR

VOUT = 3.3V,
IOUT = 10mA

f = 217Hz
f = 1KHz

ΔVOUT
Output Voltage Temperature
IOUT = 1mA(6)Coefficient
ΔTA × VOUTTHERMAL PROTECTION
Thermal Shutdown
TSHDN
Temperature

+25°C
FULL

5840VdB100ppm/°C150°C

NOTES:(1) VIN >= VOUT (NOMINAL), whichever is greater.
(2) Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlations using statisticalquality control (SQC) method.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may varyover time and will also depend on the application and configuration.
(4) Maximum output current is affected by the PCB layout, size of metal trace, the thermal conduction path between metal layers, ambient
temperature and the other environment factors of system. Attention should be paid to the dropout voltage when VIN < VOUT + VDROP.
(5) The dropout voltage is defined as VIN - VOUT, when VOUT is 100mV below the value of VOUT for VIN = VOUT (NOMINAL) + 2V.
(6) Output voltage temperature coefficient is defined as the worst-case voltage change divided by the total temperature range.

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RS75xx-1
Electrical Characteristics(VIN = VOUT + 2V, CIN = COUT = 1μF, VOUT = 5.0V, Full = -40°C to +85°C, typical values are at TA = +25°C, unless otherwisenoted.)
PARAMETER
Input Voltage (1)SYMBOL
VIN

CONDITIONSVOUT = 5.0V

Output Voltage Accuracy

IOUT = 10mA

Ground Pin Current

No load

VIN = VOUT + 2V

Maximum Output Current (4)Dropout Voltage (5)Line Regulation
Load Regulation
Power Supply Rejection Ratio
Output Voltage Temperature
Coefficient (6)THERMAL PROTECTION
Thermal Shutdown
Temperature

VDROP
IOUT = 100mA, ΔVo = 2%
ΔVOUT
VIN = VOUT + 2V to 36V, IOUT = 1mA
ΔVIN × VOUT
ΔVOUT
VIN =VOUT+2V, IOUT = 1mA to 150mA
PSRR

VOUT = 5.0V,
IOUT = 10mA

f = 217Hz
f = 1KHz

ΔVOUT
IOUT = 1mA
ΔTA × VOUT

TEMP+25°C--36

V+25°C

-202%

+25°C

-

23μA

+25°C

100150-mA+25°C-440

700

mV+25°C

0.05

0.2%/V

+25°C

2560

mV+25°C
FULL

TSHDN

MIN(2) TYP(3) MAX(2) UNITS

5840dB

100ppm/°C

150°C

NOTES:(1) VIN >= VOUT (NOMINAL), whichever is greater.
(2) Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlations using statisticalquality control (SQC) method.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may varyover time and will also depend on the application and configuration.
(4) Maximum output current is affected by the PCB layout, size of metal trace, the thermal conduction path between metal layers, ambient
temperature and the other environment factors of system. Attention should be paid to the dropout voltage when VIN < VOUT + VDROP.
(5) The dropout voltage is defined as VIN - VOUT, when VOUT is 100mV below the value of VOUT for VIN = VOUT (NOMINAL) + 2V.
(6) Output voltage temperature coefficient is defined as the worst-case voltage change divided by the total temperature range.

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RS75xx-1
8.5 Typical Characteristics
NOTE: The graphs and tables provided following this note are a statistical summary based on a limited number of samples
and are provided for informational purposes only.
VIN = 5.3V, VOUT = 3.0V, CIN = COUT = 1μF, TA = 25°C unless otherwise noted.
IOUT=10mA to 100mA

VIN=5.3V to 6.3V, IOUT=50mA

50mV/div

IOUT

100mV/div

1V/div

VOUT

100mA/div

VIN

VOUT

Time(2ms/div)

Time(1ms/div)

Figure 2. Load-Transient Response

Figure 1. Line-Transient Response

VIN

100mA/div

2V/div

VOUT

2V/div

2V/div

VOUT

IOUT

VIN=0V to 5.3V, IOUT=50mA
Time(1ms/div)

Time(2ms/div)

Figure 3. Power-Up/Power-Down Output
Waveform

1000

IOUT=50mA

Dropout Voltage(mV)

Dropout Voltage(mV)

400

Figure 4. Output Short Waveform

350

300

250200800
600
4002000-50-2502550Temperature(°C)

751000255075100125150

Output Current(mA)

Figure 5. Dropout Voltage vs Temperature

Figure 6. Dropout Voltage vs Output Current

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RS75xx-1
Typical Characteristics
NOTE: The graphs and tables provided following this note are a statistical summary based on a limited number of samples
and are provided for informational purposes only.
VIN = 5.3V, VOUT = 3.0V, CIN = COUT = 1μF, TA = 25°C unless otherwise noted.
3

Ground Pin Current(μA)

Ground Pin Current(μA)

2.5
21.5
10.5

2.5
21.5
10.5
004812162024283203650

75100125150

Output Current(mA)

Input Voltage(V)Figure 7. Ground Pin Current vs Input Voltage

25

Figure 8. Ground Pin Current vs Load Current

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RS75xx-1
9 DETAILED DESCRIPTION
9.1 Overview
The RS75xx-1 low-dropout regulators (LDO) consumes only 2µ A of quiescent current at light load and delivers
excellent line and load transient performance. These characteristics, combined with low noise and good PSRR
with low dropout voltage, make this device ideal for portable consumer applications.

9.2 Functional Block Diagram

9.3 Thermal Considerations
When the junction temperature is too high, the thermal protection circuitry sends a signal to the control logic
that will shut down the IC. The IC will restart when the temperature has sufficiently cooled down. The maximum
power dissipation is dependent on the thermal resistance of the case and the circuit board, the temperature
difference between the die junction and the ambient air, and the rate of air flow. The GND pin must be connectedto the ground plane for proper dissipation.

9.4 Applications Note:
1) The phase compensation circuit and ESR of the output capacitor are used inside the circuit to compensate, soa capacitor larger than 1.0μF must be connected to the ground.
2) It is recommended to use 1μF polar capacitors for input and output, and to keep the capacitors as close to theVIN and VOUT pins of LDO as possible.
3) Pay attention to the use conditions of input and output voltages and load currents to avoid the power
consumption (PD) inside the IC exceeding the maximum power consumption allowed by the package.
PD=(VIN-VOUT) × IOUT
TPN = PD×RθJA+T
TPN is junction temperature
T is ambient temperature4) When the input voltage VIN is greater than 2.5V, if VIN is also higher than the output set value plus the device
dropout voltage, VOUT is equal to the set value. Otherwise, V OUT is equal to VIN minus the dropout voltage. If
VIN lower than 2.5V, the VOUT is:
VOUT = VIN - VDropout

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RS75xx-1
10 PACKAGE OUTLINE DIMENSIONSSOT23-3 (3)
D

1.90

b2.59

E1

E
0.99
0.69

0.95

ee1

RECOMMENDED LAND PATTERN (Unit: mm)

0.2
A A2c

θ
L

A1

Dimensions In Millimeters

Dimensions In Inches

MinMaxMin

Max

A (1)

1.050

1.250

0.041

0.049

A1

0.000

0.100

0.000

0.004

A2

1.050

1.150

0.041

0.045

b0.300

0.500

0.012

0.020

c

0.100

0.200

0.004

0.008

D (1)

2.820

3.020

0.111

0.119

E (1)

1.500

1.700

0.059

0.067

E1

2.650

2.950

0.1040.116

Symbol0.950(BSC) (2)e0.037(BSC) (2)

e1

1.800

2.000

0.071

0.079

L

0.300

0.600

0.012

0.024

θ

0°

8°

0°8°

NOTE:
1. Plastic or metal protrusions of 0.15mm maximum per side are not included.
2. BSC (Basic Spacing between Centers), "Basic" spacing is nominal.
3. This drawing is subject to change without notice.

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RS75xx-1
SOT89-3 (4)SymbolDimensions In Millimeters

Dimensions In Inches

MinMaxMinMaxA (1)

1.400

1.600

0.055

0.063

b0.320

0.520

0.013

0.020b1

0.400

0.580

0.016

0.023

c0.350

0.440

0.014

0.017

D (1)

4.400

4.600

0.173

1.550 REF (2)D1E (1)

2.300

E1

3.940

0.181
0.061 REF (2)

2.600

0.091

4.250

0.155

0.102
0.167

e

1.500 BSC (3)0.060 BSC (3)e13.000 BSC (3)0.118 BSC (3)

L

0.900

1.200

0.035

0.047

NOTE:
1. Plastic or metal protrusions of 0.15mm maximum per side are not included.
2. REF is the abbreviation for Reference.
3. BSC (Basic Spacing between Centers), "Basic" spacing is nominal.
4. This drawing is subject to change without notice.

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RS75xx-1
11 TAPE AND REEL INFORMATIONREEL DIMENSIONSTAPE DIMENSION

Reel
DiameterReel Width(W1)

DIRECTION OF FEEDNOTE: The picture is only for reference. Please make the object as the standard.

KEY PARAMETER LIST OF TAPE AND REEL
SOT23-3

Reel
Diameter
7’’ReelWidth(mm)9.0

A0(mm)
3.20

B0(mm)
3.30

K0(mm)
1.30

P0(mm)
4.0

P1(mm)
4.0

P2(mm)
2.0W(mm)
8.0

Pin1Quadrant
Q3SOT89-3

7’’

13.2

4.85

4.451.85

4.0

8.0

2.0

12.0

Q3

Package TypeNOTE:
1. All dimensions are nominal.
2. Plastic or metal protrusions of 0.15mm maximum per side are not included.

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RS75xx-1
IMPORTANT NOTICE AND DISCLAIMER
Jiangsu RUNIC Technology Co., Ltd. will accurately and reliably provide technical and reliability data (includingdata sheets), design resources (including reference designs), application or other design advice, WEB tools, safety
information and other resources, without warranty of any defect, and will not make any express or implied
warranty, including but not limited to the warranty of merchantability Implied warranty that it is suitable for aspecific purpose or does not infringe the intellectual property rights of any third party.
These resources are intended for skilled developers designing with RUNIC products You will be solely
responsible for: (1) Selecting the appropriate products for your application; (2) Designing, validating and testing
your application; (3) Ensuring your application meets applicable standards and any other safety, security or otherrequirements; (4) RUNIC and the RUNIC logo are registered trademarks of RUNIC INCORPORATED. All
trademarks are the property of their respective owners; (5) For change details, review the revision history
included in any revised document. The resources are subject to change without notice. Our company will not beliable for the use of this product and the infringement of patents or third-party intellectual property rights dueto its use.

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