RS1G32

RS1G32 Single 2-Input Positive-OR Gate
1 FEATURES•

Operating Voltage Range:1.65V to 5.5V

•Low Power Consumption:1µ A (Max)•Operating Temperature Range:

3 DESCRIPTIONSThe RS1G32 single 2-input positive-OR gate isdesigned for 1.65V to 5.5V VCC operation.
The RS1G32 device performs the Boolean function̅̅̅̅̅̅̅̅̅̅Y=A + B or Y=A
• B in positive logic. The device isfully specified for partial-power-down applications
using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through thedevice when it is powered down.

-40°C to 125°C•Inputs Accept Voltage to 5.5V•

High Output Drive: ±24mA at VCC=3.0V•Micro SIZE PACKAGES: SOT23-5, SC70-5,
XDFN1X1-6

The RS1G32 is available in Green SOT23-5, SC70-5
and XDFN1X1-6 packages. It operates over anambient temperature range of -40°C to 125°C.

2 APPLICATIONS•AV Receiver•

Blu-ray Player and Home Theater•

Digital Picture Frame (DPF)•High-Speed Data Acquisition and Generation•

Personal Navigation Device (GPS)•Portable Media PlayerDevice Information (1)PART NUMBER

PACKAGEBODY SIZE (NOM)

SOT23-5

2.92mm×1.60mm

SC70-52.10mm×1.25mm

XDFN1X1-6

1.00mm×1.00mm

RS1G32(1)

LOGIC SYMBOLFor all available packages, see the orderable addendum at theend of the data sheet.

4 FUNCTION TABLE
INPUTSOUTPUT

A

B

YH

H

H

L

H

H

H

L

H

L

L

L

Y=A+B
H=High Voltage Level
L=Low Voltage Level

REV A.3.3

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RS1G32
Table of Contents
1 FEATURES ............................................................................................................................................................................... 1
2 APPLICATIONS ...................................................................................................................................................................... 1
3 DESCRIPTIONS ...................................................................................................................................................................... 1
4 FUNCTION TABLE ................................................................................................................................................................ 15 REVISION HISTORY ............................................................................................................................................................. 36 PACKAGE/ORDERING INFORMATION (1) ..................................................................................................................... 47 PIN CONFIGURATIONS ...................................................................................................................................................... 58 SPECIFICATIONS ................................................................................................................................................................... 68.1 Absolute Maximum Ratings .......................................................................................................................................... 68.2 ESD Ratings ...................................................................................................................................................................... 69 ELECTRICAL CHARACTERISTICS...................................................................................................................................... 79.1 Recommended Operating Conditions ......................................................................................................................... 79.2 DC Characteristics .......................................................................................................................................................... 89.3 AC Characteristics ........................................................................................................................................................... 810 PARAMETER MEASUREMENT INFORMATION ........................................................................................................ 911 PACKAGE OUTLINE DIMENSIONS .............................................................................................................................1012 TAPE AND REEL INFORMATION .................................................................................................................................132 / 14

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RS1G325 REVISION HISTORY
Note: Page numbers for previous revisions may different from page numbers in the current version.
VersionChange Date

A.1

2021/01/25

A.2

2022/04/01

A.3

2022/04/27

A.3.1

2024/02/28

A.3.2

2024/05/09

A.3.3

2024/09/23

Change Item
Initial version completed
1.Added the TAPE AND REEL INFORMATION
2.Modify Machine model ESD
Update PACKAGE MARKING on Page 5 in RevA.2
1.Add MSL on Page 5 in RevA.3
2.Added Marking Information on Page 5 in RevA.3
3.Modify packaging naming
Add XDFN1X1-6 PACKAGE
1. Update MSL NOTE
2. Update XDFN1X1-6 Pin1 Quadrant on Page 13 in RevA.3.2
3. Update the description of ESD Ratings

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RS1G32
6 PACKAGE/ORDERING INFORMATION (1)PRODUCT

RS1G32ORDERING
NUMBERTEMPERATURE
RANGE

PACKAGELEAD

PACKAGEMARKING (2)MSL(3)

PACKAGE OPTION

RS1G32XF5-40°C ~+125°C

SOT23-5

1G32

MSL3

Tape and Reel,3000

RS1G32XC5-40°C ~+125°C

SC70-5 (4)

1G32

MSL3

Tape and Reel,3000

XDFN1X1-632 (5)MSL3Tape and Reel,5000

RS1G32XUTDN6-40°C ~+125°C

NOTE:(1) This information is the most current data available for the designated devices. This data is subject to change without notice and revisionof this document. For browser-based versions of this data sheet, refer to the right-hand navigation.
(2) There may be additional marking, which relates to the lot trace code information (data code and vendor code), the logo or theenvironmental category on the device.
(3) RUNIC classify the MSL level with using the common preconditioning setting in our assembly factory conforming to the JEDEC
industrial standard J-STD-20F, Please align with RUNIC if your end application is quite critical to the preconditioning setting or if you
have special requirement.
(4) Equivalent to SOT353.
(5) 32: ldentification Code.

Marking Information(1) SOT23-5, SC70-5(Top View)
5Part Number

41G32
XYWWL
12

X: Internal Code
Y: Year,0-9
WW: Week: 01~52;52
represents 52 and 53 week
L: Lot Code34 / 14www.run-ic.com

RS1G32
7 PIN CONFIGURATIONSTOP VIEW
A

1B

2TOP VIEW
54

GND 3

VCC

Y

A

16VCC

B

25

NC

GND

34Y

XDFN1X1-6

SOT23-5/SC70-5

PIN DESCRIPTION
PIN

NAME

I/O TYPE (1)A

IInputBI

Input

GND-

Ground Pin

YO

Y Output

5NC-

Not connected

6VCC-

Power Pin

SOT23-5/SC70-5

XDFN1X1-6

112233445

FUNCTION(1) I=input, O=output, P=power.

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RS1G32
8 SPECIFICATIONS
8.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)

(1)

(2)
(3)
(4)
(5)

MIN

MAX

UNIT

VCC

Supply voltage range

-0.5

6.5

VVI

Input voltage range (2)

-0.5

6.5

VVo

Voltage range applied to any output in the high-impedance or power-off state(2)-0.5

6.5VVoVoltage range applied to any output in the high or low state (2)(3)-0.5

VCC+0.5

VIIKInput clamp current

VI<0-50mA

IOK

Output clamp current

VO<0-50mA

IO

Continuous output current±50mA

Continuous current through VCC or GND±100mA

SOT23-5230

SC70-5380

XDFN1X1-6438

θJA

Package thermal impedance (4)TJ

Junction temperature (5)-65

150°CTstg

Storage temperature-65

150°C°C/W

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended OperatingConditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
The value of VCC is provided in the Recommended Operating Conditions table.
The package thermal impedance is calculated in accordance with JESD-51.
The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (T J(MAX) - TA) / RθJA. All numbers apply for packages soldered directly onto a PCB.

8.2 ESD Ratings
The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only.
VALUEV(ESD)Electrostatic discharge

Human-body model (HBM), per EIA/JESD22-a114, all pins

±8000

Charged-device model (CDM), per JS-002, all pins

±1500

Machine model (MM), per EIA/JESD22-a115, all pins

±350

UNITVESD SENSITIVITY CAUTION
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its publishedspecifications.

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RS1G32
9 ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range (TYP values are at TA = +25°C, unless otherwise noted.) (1)9.1 Recommended Operating Conditions
PARAMETER
Supply voltage

High-level input voltage

SYMBOLVCC

VIH

TEST CONDITIONS

MIN

MAX

Operating

1.65

5.5

Data retention only

1.5

5.5

VCC=1.65V to 1.95V

0.65 x VCC

VCC=2.3V to 2.7V

1.7

VCC=3V to 3.6V

2.2

VCC=4.5V to 5.5V

0.7 x VCC

UNIT
V

V

VCC=1.65V to 1.95V

0.15 x VCC

VCC=2.3V to 2.7V

0.3

VCC=3V to 3.6V

0.4

Low-level input voltage

VIL

Input voltage

VI05.5V

Output voltage

VO

0VCC

V

Input transition rise or falltr, tf

Operating temperature

TA

VCC=4.5V to 5.5V

V

0.15 x VCC

VCC=1.8V± 0.15V,2.5V ± 0.2V

20

VCC=3.3V± 0.3V

10

VCC=5V± 0.5V

5-40

ns/V+125°C(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation.

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RS1G32
9.2 DC Characteristics
PARAMETERTEST CONDITIONS

VOH

VCC
1.65V to 5.5V

VCC-0.1

IOH = -4mA

1.65V

1.2

IOH = -8mA

2.3V

Full

3V

IOH = -24mA

TYP(3)MAX(2)1.92.3

4.5V

IOL = 100μA

1.65V to 5.5V

0.1

IOL = 4mA

1.65V

0.45

IOL = 8mA

2.3V

IOL = 16mA

3.80.3

Full

0.4

3V

IOL = 32mA
VI=5.5V or GND

0V to 5.5V

Ioff

VI or VO=5.5V

0ICC

VI=5.5V or GND, IO=0

1.65V to 5.5V

ΔICC

One input at VCC-0.6V,
Other inputs at VCC or GND

3V to 5.5V

V

0.55

4.5V

A or B inputs

UNIT

V

2.4

IOH = -32mA

IOL = 24mA

II

MIN(2)

IOH = -100μA

IOH = -16mA

VOL

TEMP0.55±0.1+25C
Full±1±5±0.1+25C
Full±1±100.1+25C1

Full10Full500µAµAµAµA(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation.
(2) Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlations using statisticalquality control (SQC) method.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may varyover time and will also depend on the application and configuration.

9.3 AC Characteristics
PARAMETER

Propagation Delay

Input Capacitance

SYMBOLtpd

Ci

TEST CONDITIONS

TEMP

Cpd

TYP(3)

VCC=1.8V±0.15V

CL=30pF, RL=1kΩ

Full

8.0

VCC=2.5V±0.2V

CL=30pF, RL=500Ω

Full

3.7

VCC=3.3V±0.3V

CL=50pF, RL=500Ω

Full

2.5

VCC=5V±0.5 V

CL=50pF, RL=500Ω

Full

2.7

VCC=3.3V

VI=VCC or GND

Full

VCC=1.8V
Power dissipation
capacitanceMIN(2)

VCC=2.5V
VCC=3.3V

4MAX(2)

UNIT

nspF20
f=10MHz

VCC=5V+25°C

2122pF

25(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation.
(2) This parameter is ensured by design and/or characterization and is not tested in production.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may varyover time and will also depend on the application and configuration.

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RS1G32
10 PARAMETER MEASUREMENT INFORMATIONRLFrom Output
Under Test

VLOAD

S1Open
GND

CL

RL

TEST

S1tPLH/tPHL

Open

tPLZ/tPZL

VLOAD

tPHZ/tPZH

GND

INPUTS

VCC

VM

VLOAD

CL

≤2ns

VCC/22 x VCC

≤2ns

VCC/2

2 x VCC

3V≤2.5ns

1.5V

VCC≤2.5ns

VCC/2VItr/tf

1.8V±0.15V

VCC

2.5V±0.2V

VCC

3.3V±0.3V
5V±0.5V

RL

VΔ

30pF

1kΩ

0.15V

30pF

500Ω

0.15V

6V

50pF

500Ω

0.3V

2 x VCC

50pF

500Ω

0.3V
VI

Timing Input

VM
0V
tsu

tw
VI
Input

VM

VI

Data Input

VM

0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES

0V

VI
VM
tPLH

tPHL
VOH
VM

tPHL

VM
tPLH

VM

OutputWaveform 1S1 at V LOA D(see Note B)

VOLVOH
OutputOutputControl

VM
0VOutput

VM

VM

VOLTAGE WAVEFORMSPULSE DURATION

Input

thVM
VOL

VOLTAGE WAVEFORMS PROPAGATION DELAY
TIMES INVERTION AND NON INVERTING OUTPUTS

OutputWaveform 2
S1 at GND
(see Note B)

VM

VI

VM

0V
tPZL

tPLZ
VM

tPZH

VLOA D/2
VOL + V

VOL

tPHZ
VM

VOH – V

VOH
0V

VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMESLOW-AN D HIGH-LEVEL ENABLINGNOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
1. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50Ω.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.

Figure 1. Load Circuit and Voltage Waveforms
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RS1G32
11 PACKAGE OUTLINE DIMENSIONSSOT23-5 (3)
D

1.90
b2.59

E1

E

0.99
0.95

0.69

ee1

RECOMMENDED LAND PATTERN (Unit: mm)

0.2
A A2cθ
L

A1

SymbolDimensions In Millimeters

Dimensions In Inches

MinMaxMinMaxA (1)

1.050

1.250

0.041

0.049

A10.0000.100

0.000

0.004

A2

1.050

1.150

0.041

0.045

b0.300

0.500

0.012

0.020

c

0.100

0.200

0.004

0.008

D (1)

2.820

3.020

0.111

0.119

E (1)

1.500

1.700

0.059

0.067

E1

2.650

2.950

0.104

0.116

0.950(BSC) (2)e0.037(BSC) (2)

e1

1.800

2.000

0.071

0.079

L

0.300

0.600

0.012

0.024

θ

0°

8°

0°

8°

NOTE:
1. Plastic or metal protrusions of 0.15mm maximum per side are not included.
2. BSC (Basic Spacing between Centers), "Basic" spacing is nominal.
3. This drawing is subject to change without notice.

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RS1G32
SC70-5 (3)
D

1.30

b1.9

E

E10.75
Pin1Index Area

0.65

0.4ee1RECOMMENDED LAND PATTERN (Unit: mm)

0.2

A A2c

θ
L

A1

L1

Dimensions In Millimeters

Dimensions In Inches

MinMaxMinMax

A (1)

0.900

1.100

0.035

0.043

A1

0.000

0.100

0.000

0.004

A2

0.900

1.000

0.035

0.039

b0.150

0.350

0.006

0.014

c0.080

0.150

0.003

0.006

D (1)

2.000

2.200

0.079

0.087

E (1)

1.150

1.3500.045

0.053

E12.150

2.450

0.085

Symbol

0.096

e0.650(BSC) (2)0.026(BSC) (2)e11.300(BSC) (2)0.051(BSC) (2)

L

0.260

L1
θ

0.460

0.010

0.525
0°

0.018
0.021

8°

0°

8°

NOTE:
1. Plastic or metal protrusions of 0.15mm maximum per side are not included.
2. BSC (Basic Spacing between Centers), "Basic" spacing is nominal.
3. This drawing is subject to change without notice.

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RS1G32
XDFN1X1-6 (3)0.6

D10.176E

LASER MA RK
PIN 1 I.D.

0.35

430.8

TOP VIEWLAND PATTERN EXAMPLE

HM

L1
L20. 07

L

1

SIDE VIEW

bA1e

A

A30.05k

SIDE VIEW

BOTTOM VIEW

Dimensions In Millimeters

Dimensions In Inches

MinMax

Min

Max

A (1)

0.340

0.400

0.013

0.016

A1

0.000

0.050

0.000

0.002

Symbol0.100 (REF) (2)A30.004 (REF) (2)b0.100

0.200

0.004

0.008

D (1)

0.950

1.050

0.037

0.041

E (1)

0.950

1.050

0.037

0.041

e0.300

0.400

0.012

0.016

0.100 (REF) (2)

HK

0.150

L0.350

L10.350

L20.004 (REF) (2)
0.006
0.450

0.014

0.450

0.014

0.075 (REF) (2)

0.018
0.018
0.003 (REF) (2)NOTE:
1. Plastic or metal protrusions of 0.075mm maximum per side are not included.
2. REF is the abbreviation for Reference.
3. This drawing is subject to change without notice.

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RS1G32
12 TAPE AND REEL INFORMATIONREEL DIMENSIONSTAPE DIMENSION

ReelDiameter

Reel Width(W1)

DIRECTION OF FEEDNOTE: The picture is only for reference. Please make the object as the standard.

KEY PARAMETER LIST OF TAPE AND REEL
SC70-5

Reel
Diameter7’’

Reel
Width(mm)9.5A0(mm)2.25

B0(mm)
2.55K0(mm)1.20

P0(mm)
4.0

P1(mm)
4.0

P2(mm)
2.0W(mm)8.0

Pin1
Quadrant
Q3

SOT23-5

7’’

9.5

3.20

3.20

1.40

4.0

4.0

2.0

8.0

Q3

XDFN1X1-67’’

9.5

1.14

1.17

0.56

4.0

4.0

2.0

8.0

Q3

Package TypeNOTE:
1. All dimensions are nominal.
2. Plastic or metal protrusions of 0.15mm maximum per side are not included.

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RS1G32
IMPORTANT NOTICE AND DISCLAIMER
Jiangsu RUNIC Technology Co., Ltd. will accurately and reliably provide technical and reliability data (includingdata sheets), design resources (including reference designs), application or other design advice, WEB tools, safety
information and other resources, without warranty of any defect, and will not make any express or implied
warranty, including but not limited to the warranty of merchantability Implied warranty that it is suitable for aspecific purpose or does not infringe the intellectual property rights of any third party.
These resources are intended for skilled developers designing with RUNIC products You will be solely
responsible for: (1) Selecting the appropriate products for your application; (2) Designing, validating and testing
your application; (3) Ensuring your application meets applicable standards and any other safety, security or otherrequirements; (4) RUNIC and the RUNIC logo are registered trademarks of RUNIC INCORPORATED. All
trademarks are the property of their respective owners; (5) For change details, review the revision history
included in any revised document. The resources are subject to change without notice. Our company will not beliable for the use of this product and the infringement of patents or third-party intellectual property rights due
to its use.

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