RS2G07

RS2G07 Dual Buffer and Driver with Open-Drain Outputs
1 FEATURES

3 DESCRIPTIONSOperating Voltage Range:1.65V to 5.5V

Low Power Consumption:1µ A (Max)Operating Temperature Range:

The RS2G07 dual buffer and driver is designed for
1.65V to 5.5V VCC operation.
The RS2G07 device is open drain and can beconnected to other open-drain outputs to implement
active-low wired-OR or active-high wired-ANDfunctions. The device is fully specified for partialpower-down applications using Ioff. The Ioff circuitry
disables the outputs, preventing damaging current
backflow through the device when it is powered
down.

-40°C to +125°C
Inputs and Open-Drain Outputs
Accept Voltage to 5.5V

High Output Drive: ±24mA at VCC=3.0V

Micro SIZE PACKAGES: SOT23-6, SC70-6

2 APPLICATIONS

Blu-ray Players and Home Theaters

Desktops or Notebook PCs

Digital Video Cameras (DVC)Mobile PhonesPersonal Navigation Device (GPS)Portable Media Player

The RS2G07 is available in Green SOT23-6 and SC706 packages. It operates over an ambient temperature
range of -40°C to +125°C.

Device Information (1)PART NUMBER
RS2G07(1)Functional Block Diagram
1A

2A

13

REV A.6.1

64

PACKAGEBODY SIZE (NOM)

SOT23-6

2.92mm×1.60mm

SC70-62.10mm×1.25mm

For all available packages, see the orderable addendum at theend of the data sheet.

4 FUNCTION TABLE

1Y

2Y

1 / 13INPUTOUTPUTA

YL

LH
H=High Voltage Level
L=Low Voltage Level
Z=High-impedance OFF-stateZwww.run-ic.com

RS2G07
Table of Contents
1 FEATURES ............................................................................................................................................................................... 1
2 APPLICATIONS ...................................................................................................................................................................... 1
3 DESCRIPTIONS ...................................................................................................................................................................... 1
4 FUNCTION TABLE ................................................................................................................................................................ 15 Revision History ..................................................................................................................................................................... 36 PACKAGE/ORDERING INFORMATION (1) ..................................................................................................................... 47 PIN CONFIGURATIONS ...................................................................................................................................................... 58 SPECIFICATIONS ................................................................................................................................................................... 68.1 Absolute Maximum Ratings .......................................................................................................................................... 68.2 ESD Ratings ...................................................................................................................................................................... 69 ELECTRICAL CHARACTERISTICS...................................................................................................................................... 79.1 Recommended Operating Conditions ......................................................................................................................... 7
9.2 DC Characteristics .......................................................................................................................................................... 8
9.3 AC Characteristics ........................................................................................................................................................... 810 Parameter Measurement Information ........................................................................................................................... 911 PACKAGE OUTLINE DIMENSIONS .............................................................................................................................1012 TAPE AND REEL INFORMATION .................................................................................................................................122 / 13

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RS2G07
5 Revision History
Note: Page numbers for previous revisions may different from page numbers in the current version.
VersionChange Date

Change Item

A.1

2021/04/20

A.2

2021/11/26

A.3

2022/03/29

A.4

2022/04/27

Initial version completed
Added the TAPE AND REEL INFORMATION
Update the ESD Ratings on page 4@A.1 Version
1. Modify VO on page 4@A.2 Version
2. Delete VOH on page 7@A.2 Version
3. Modify Parameter Measurement Information on page 8@A.2 Version
4. Update the ESD Ratings
Update PACKAGE MARKING on Page 5@RevA.3

A.5

2022/07/13

Change ORDERING NUMBER on Page 5@RevA.4

A.6

2023/11/02

Added Marking Information on Page 4@RevA.5A.6.1

2024/02/29

Modify packaging naming

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RS2G07
6 PACKAGE/ORDERING INFORMATION (1)PRODUCT
RS2G07

ORDERING
NUMBERTEMPERATURE
RANGE

PACKAGE LEAD

PACKAGEMARKING (2)MSL(3)

PACKAGE OPTION

RS2G07XH6-40°C ~+125°C

SOT23-6

2G07

MSL3

Tape and Reel,3000

RS2G07XC6-40°C ~+125°C

SC70-6 (4)

2G07

MSL3

Tape and Reel,3000

NOTE:(1) This information is the most current data available for the designated devices. This data is subject to change without notice and revisionof this document. For browser-based versions of this data sheet, refer to the right-hand navigation.
(2) There may be additional marking, which relates to the lot trace code information (data code and vendor code), the logo or theenvironmental category on the device.
(3) MSL, The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications.
(4) Equivalent to SOT363.

Marking Information(1) SOT23-6, SC70-6(Top View)
6Part Number

5

4

2G07
XYWWL
12

X: Internal Code
Y: Year,0-9
WW: Week: 01~52;52
represents 52 and 53 week
L: Lot Code34 / 13

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RS2G07
7 PIN CONFIGURATIONSTOP VIEW

1A

161YGND

25Vcc

2A

342Y

SOT23-6/SC70-6

PIN DESCRIPTION
PIN

NAME

I/O (1)

11AIInput 12GND

PGround

32A

I

Input 242YO

Open-drain output 2

5VCC

P

Power pin

61YO

Open-drain output 1

SOT23-6/SC70-6(1)

FUNCTION

I = Input, O = Output, P = Power

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RS2G07
8 SPECIFICATIONS
8.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)

(1)

(2)
(3)
(4)

MIN

MAXUNIT

VCC

Supply voltage range

-0.5

6.5

VVI

Input voltage range (2)

-0.5

6.5

VVo

Output voltage range (2)

6.5

V

IIK

Input clamp current

VI<0-50mA

IOK

Output clamp current

VO<0-50mA

IO

Continuous output current±50mA

Continuous current through VCC or GND±100mA-0.5

SOT23-6230

SC70-6265

θJA

Package thermal impedance (3)TJ

Junction temperature (4)-65

150°CTstg

Storage temperature-65150°C°C/WStresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
The package thermal impedance is calculated in accordance with JESD-51.
The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (T J(MAX) - TA) / RθJA. All numbers apply for packages soldered directly onto a PCB.

8.2 ESD Ratings
The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only.

V(ESD)

Electrostatic discharge

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±6000

V

Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002(2)±1500

VMachine model (MM)

±350

V

(1) JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process.

ESD SENSITIVITY CAUTION
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its publishedspecifications.

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RS2G07
9 ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range (Full= -40°C to +125°C, TYP values are at TA = +25°C, unlessotherwise noted.) (1)9.1 Recommended Operating Conditions
PARAMETER
Supply voltage

High-level input voltage

Low-level input voltage

SYMBOL
VCC

VIH

VIL

MIN

MAX

Operating

TEST CONDITIONS

1.65

5.5

Data retention only

1.5

VCC=1.65V to 1.95V

0.65xVCC

VCC=2.3V to 2.7V

1.7

VCC=3V to 3.6V

2.2

VCC=4.5V to 5.5V

0.7xVCC

UNIT
VV

VCC=1.65V to 1.95V0.15xVCC

VCC=2.3V to 2.7V

0.3

VCC=3V to 3.6V

0.4

VCC=4.5V to 5.5V

0.15xVCC

VInput voltage

VI05.5

VOutput voltage

VO05.5V

Input transition rise or fall
Operating temperature

Δt/Δv

VCC=1.8V± 0.15V,2.5V ± 0.2V

20

VCC=3.3V± 0.3V

10

VCC=5V± 0.5V

5TA-40ns/V+125°C(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation.

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RS2G07
9.2 DC Characteristics
PARAMETERTEST CONDITIONSVOLVCC

MIN (2)TYP (3)

MAX (2)

IOL = 100μA

1.65V to 5.5V

0.1

IOL = 4mA

1.65V

0.45

IOL = 8mA

2.3V

IOL = 16mA

0.3

Full

0.4

3V

IOL = 24mA
IOL = 32mA
II

TEMP

VI=5.5V or GND

0V to 5.5V

Ioff

VI or VO=5.5V

0ICC

VI=5.5V or GND, IO=0

1.65V to 5.5V

ΔICC

One input at VCC-0.6V,
Other inputs at VCC orGND

3V to 5.5V

V

0.55

4.5V

A or B inputs

UNIT

0.55+25C±0.1

Full±1±5+25C±0.1

Full±1±10+25C

0.1

1

Full

10Full500

µA
µA
µA
µA

(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation.
(2) Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlations using statisticalquality control (SQC) method.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may varyover time and will also depend on the application and configuration.

9.3 AC Characteristics
PARAMETERPropagation
Delay
Input
Capacitance

SYMBOLtpd

Ci

TEST CONDITIONSTEMPCpd

TYP (3)

VCC=1.8V±0.15V

CL=30pF, RL=1kΩ

Full

6.4

VCC=2.5V±0.2V

CL=30pF, RL=500Ω

Full

4.5

VCC=3.3V±0.3V

CL=50pF, RL=500Ω

Full

4.2

VCC=5V±0.5V

CL=50pF, RL=500Ω

Full

3.7

VCC=3.3V

VI=VCC or GND

+25C

4

VCC=1.8V
Power
dissipation
capacitanceMIN (2)

VCC=2.5V
VCC=3.3V

MAX (2)

UNIT

nspF

3f=10MHz

VCC=5V+25C

34pF

6(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation.
(2) This parameter is ensured by design and/or characterization and is not tested in production.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may varyover time and will also depend on the application and configuration.

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RS2G07
10 Parameter Measurement Information
RL

From Output
Under Test

VLOAD

S1OpenGND

CL

RL

TEST

S1

tPLH/tPHL

OpentPLZ/tPZL

VLOADtPHZ/tPZH

GND

INPUTS

VCC

VM

VLOAD

CL

≤2ns

VCC/2

2 x VCC

≤2ns

VCC/2

2 x VCC

3V≤2.5ns

1.5V

VCC≤2.5ns

VCC/2VItr/tf

1.8V±0.15V

VCC

2.5V±0.2V

VCC

3.3V±0.3V
5V±0.5V

RL

VΔ

30pF

1kΩ

0.15V

30pF

500Ω

0.15V

6V

50pF

500Ω

0.3V

2 x VCC

50pF

500Ω

0.3V
VI

Timing Input

VM
0V
tsu

tw
VI
Input

VM

VI

Data Input

VM

0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES

0V

VI
VM

0V
tPHL
VOH
VM
tPHL

VMtPLHVM

OutputWaveform 1S1 at V LOA D(see Note B)VOL

VOHOutput

OutputControl

VM

tPLH
OutputVM

VM

VOLTAGE WAVEFORMSPULSE DURATIONInputthVM
VOLVOLTAGE WAVEFORMS PROPAGATION DELAY
TIMES INVERTION AND NON INVERTING OUTPUTS

OutputWaveform 2
S1 at GND
(see Note B)

VM

VI

VM

0V
tPZL

tPLZ
VM

tPZH

VLOA D/2
VOL + V

VOL

tPHZ
VM

VOH – V

VOH
0V

VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMESLOW-AN D HIGH-LEVEL ENABLINGNOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
1. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50Ω.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.

Figure 1. Load Circuit and Voltage Waveforms
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RS2G07
11 PACKAGE OUTLINE DIMENSIONSSOT23-6 (3)
D

1.90

b

2.59

E

E1

0.99
Pin1
Index Area

0.95

0.69
ee1

RECOMMENDED LAND PATTERN (Unit: mm)

0.2

A A2cθ
L

A1

Dimensions In Millimeters

Dimensions In Inches

MinMaxMin

MaxA (1)

1.050

1.250

0.041

0.049

A10.000

0.100

0.000

0.004

A2

1.050

1.150

0.041

0.045b

0.300

0.500

0.012

0.020

c

0.100

0.200

0.004

0.008

D (1)

2.820

3.020

0.111

0.119

E (1)

1.500

1.700

0.059

0.067

E1

2.650

2.950

0.104

Symbol0.950(BSC) (2)

e

0.116
0.037(BSC) (2)

e1

1.800

2.000

0.071

0.079

L

0.300

0.600

0.012

0.024

θ

0°

8°

0°

8°

NOTE:
1. Plastic or metal protrusions of 0.15mm maximum per side are not included.
2. BSC (Basic Spacing between Centers), "Basic" spacing is nominal.
3. This drawing is subject to change without notice.

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RS2G07
SC70-6 (3)
D

1.30

b1.9

EE10.75
Pin1
Index Area

0.65

0.4ee1RECOMMENDED LAND PATTERN (Unit: mm)

0.2

A A2c

θ
L

A1

L1

Dimensions In Millimeters

Dimensions In Inches

MinMax

Min

Max

A (1)

0.900

1.100

0.035

0.043

A1

0.000

0.100

0.000

0.004

A2

0.900

1.000

0.035

0.039

b0.150

0.350

0.006

0.014

c

0.080

0.150

0.003

0.006

D (1)

2.000

2.200

0.079

0.087

E (1)

1.150

1.350

0.045

0.053

E1

2.150

2.450

0.085

0.096Symbole

0.650(BSC) (2)0.026(BSC) (2)e11.300(BSC) (2)0.051(BSC) (2)

L

0.260

L1θ

0.460

0.010

0.525
0°

0.018
0.021

8°

0°8°

NOTE:
1. Plastic or metal protrusions of 0.15mm maximum per side are not included.
2. BSC (Basic Spacing between Centers), "Basic" spacing is nominal.
3. This drawing is subject to change without notice.

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RS2G07
12 TAPE AND REEL INFORMATIONREEL DIMENSIONSTAPE DIMENSION

ReelDiameter

Reel Width(W1)

DIRECTION OF FEEDNOTE: The picture is only for reference. Please make the object as the standard.

KEY PARAMETER LIST OF TAPE AND REEL
SC70-6

Reel
Diameter7’’

Reel
Width(mm)9.5

A0(mm)
2.40

B0(mm)
2.50

K0(mm)
1.20

P0(mm)
4.0

P1(mm)
4.0

P2(mm)
2.0

W(mm)
8.0

Pin1
Quadrant
Q3

SOT23-6

7’’

9.5

3.17

3.23

1.37

4.0

4.0

2.0

8.0

Q3

Package TypeNOTE:
1. All dimensions are nominal.
2. Plastic or metal protrusions of 0.15mm maximum per side are not included.

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RS2G07IMPORTANT NOTICE AND DISCLAIMER
Jiangsu RUNIC Technology Co., Ltd. will accurately and reliably provide technical and reliability data (includingdata sheets), design resources (including reference designs), application or other design advice, WEB tools, safety
information and other resources, without warranty of any defect, and will not make any express or implied
warranty, including but not limited to the warranty of merchantability Implied warranty that it is suitable for a
specific purpose or does not infringe the intellectual property rights of any third party.
These resources are intended for skilled developers designing with RUNIC products You will be solely
responsible for: (1) Selecting the appropriate products for your application; (2) Designing, validating and testing
your application; (3) Ensuring your application meets applicable standards and any other safety, security or otherrequirements; (4) RUNIC and the RUNIC logo are registered trademarks of RUNIC INCORPORATED. All
trademarks are the property of their respective owners; (5) For change details, review the revision history
included in any revised document. The resources are subject to change without notice. Our company will not beliable for the use of this product and the infringement of patents or third-party intellectual property rights due
to its use.

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