Customer Guidelines forExternal Failure Analysis Request (EFAR)

Rev.3.0
Jun 2024

Page 1

68AON47979H・Guidelines for EFAR

Table of Contents
1. Purpose and Scope
2. Failure Analysis Request
3. Failure Analysis Units
3-1 Targeted Units Removal from Printed Circuit Board
3-2 Targeted Units, Damage, and Testability
3-3 Shipment and Handling of the Failure Analysis Units

4. Verification by Customer
4-1 ABA Swap
4-2 Waveform
4-3 Schematic/Circuit Information
4-4 Imaging Products Comparison with Outgoing Defect Specification (ODS)

5. Feedback from Past Failure Analysis Results
5-1 Massive, Visible EOS Failure
5-2 Repeated EOS Failure
5-3 Repeated No Trouble Found (NTF) Failure
5-4 Same Failure Mode and Root Cause Confirmed in Past Failure Analysis
5-5 Visual / Cosmetic Failure
5-6 Logistic Issues
5-7 Soldering / Board Mount Related Failure

6. Data Analytics
7. Failure Analysis Support
7-1 End of Life (EOL) Parts Failure Analysis
7-2 Parts from Unauthorized Sales Channels
7-3 Prototype Devices, Engineering Samples (ES)
7-4 Customer evaluation samples for failure analysis
7-5 Failure Analysis Request Through Authorized Sales Channels
7-6 Misusing Non-automotive Grade Device for Automotive Applications

8. Electrostatic Discharge (ESD) Control

Page 2

68AON47979H・Guidelines for EFAR

1.

Purpose and Scope
The purpose of this document is to provide guidelines to be used bycustomers when requesting failure analysis from onsemi when a customer
incident is encountered. Use of these guidelines will help in providing
customers with accurate and timely information related to a reported customer
incident or product failure.
The onsemi failure analysis process is focused on formal problem-solving
techniques and responsiveness. The 8D Problem Solving Methodology isutilized to determine containment, root cause, and corrective/preventive
actions. The customer incident process is mapped in the figure below.

The guidelines can be used for incidents related to electrical, mechanical,
and logistical issues e.g., shipment packing damage.
Failure analysis is a process entailing vast analytical methods andtechniques to help identify the reliability and quality issues that may occur ineither the manufacturing or application of our products. The process can be acomplicated endeavor due to the many aspects of the ever-advancing
semiconductor and packaging technologies; and the numerous engineering
disciplines involved. The accuracy and detail of the information provided toonsemi will help identify the proper resources and analysis techniques to
produce the correct root cause analysis and corrective actions.

Page 3

68AON47979H・Guidelines for EFAR

2.

Failure Analysis Request
onsemi seeks to continuously improve the quality and the reliability of our
products. We do this internally with continuous improvement programs, yield
improvement programs and other initiatives. Another important tool we utilize
is the processes involved in post-sales support to our customers. Eachcustomer complaint is studied in detail and in the context of past history of thespecific product, the product and package family, and other related attributes
such as the wafer fabrication process. If the specific customer complaint(External Failure Analysis request or EFAR) represents an opportunity to
improve the quality or reliability of our products, we make every effort tothoroughly investigate the units under the EFAR and implement corrective andpreventative actions. If, however, the issue related to the complaint is a wellunderstood historical issue, the company may elect to signature analyze theincident. In all cases, we are sensitive to the specific circumstances each
EFAR represents and will work with our customers in order to resolve thecomplaint in a manner that is satisfactory to both onsemi and the customer.
To help with this objective, we kindly ask for a detailed description of theincident and provide as much data as possible to allow us to expedite theinvestigative process. onsemi requests the following information with any
returns:
Basic information
onsemi Part Number
Customer Part Number
Purchase source (onsemi or distributor name)
Device marking (clear photo of top mark is helpful)
Date code
LOT number on label and purchase order number (clear photo oflabel is helpful)
Total number of units being returned for analysis (equals thenumber of suspect failures + number of reference (good) devices)
Detection
Point of failure (incoming inspection, module assembly, outgoing
test, field, etc.
Usage conditions in which failure was observed (voltage,
temperature, frequency, etc.)

Page 4

68AON47979H・Guidelines for EFAR

How it failed; detailed description of failure including all available
symptoms; and how the symptoms are related to the returned unit.
Length of time in the application including the conditions upon
failure.
Failure rate: ppm(how many units failed, out of total numbers of units)
Customer application. Is the product new or have any changes
occurred if an existing product?
Did any other components fail at the same time, and if so, how did
they fail?
Are there any devices of this same date code/same lot stillavailable?
Problem Description
Include the related failing parameter from the product specification,
datasheet or any shared application diagram. For image sensor
products, please include Outgoing Defect Specification (ODS) of
failing parameter if applicable.
Describe the part of the circuit where the problem exists
What is the application’s failure mode and how can it be related tothe device?
How do you perceive the device is failing (short, open, stuck logic
levels)?
How was the device handled before receipt at onsemi? Wereprecautions taken in removing and handling (ESD/thermal) the
devices to ensure that electrical or physical damage does notoccur, and the package’s testability is maintained?
What investigation has already been done by the customer?
Photos of failure analysis units and evaluation environment
Waveform of evaluation (failure case vs normal case)
Schematic of application and evaluation environment. If entire
schematic cannot be provided, the section containing thecomponent and any connections to it is needed.
Setting conditions. Register setting.
Imaging Products: Lens condition (w/wo, F#),
Image streaming mode, Brightness condition
Measurement equipment, conditions.
Evaluation result report
Page 5

68AON47979H・Guidelines for EFAR

A minimum set of background information significantly impacts the overall
quality and cycle time of the problem-solving process so the more information,
the better.
The cost of failure analysis is high due to the extensive instrumentation,highly technical staff, continual training and development, and associatedanalysis expenses (chemicals, fixtures). The background documentation must
be completed upon receipt to enable those resources’ most efficient utilization.
An open communication channel between onsemi and our customers exists
to ensure a timely resolution of the problem on either end.

Page 6

68AON47979H・Guidelines for EFAR

3.

Failure Analysis Units
Proper care of the failure analysis units is imperative to preserve the failure
mechanism and ensure all analysis techniques can be used to identify the root
cause of failure.
3-1. Failure Analysis Units Removal from Printed Circuit Board
It is preferred to have failure analysis units removed from the customer’s
printed circuit board (PCB). Care should be taken when removing devices fromthe PCB to ensure electrical (ESD) damage or physical damage does notoccur. For example, for moisture sensitive devices, follow industry MSL
requirements. onsemi can provide further guidance upon request. So, anotherfailure mechanism is not introduced and the package’s testability on
automated test equipment is maintained. Please refer to Section 8 of thisguide for ESD control and prevention.
3-2. Targeted Units, Damage, and Testability
To ensure failure analysis units can be tested,Desolder parts (do not cut-off leads/pins)
Prevent mechanical damage to the leads/pins or package
Remove solder residues (especially between pins)
Remove coating material

The following examples of components are not acceptable for failure
analysis due to missing leads, leads cut too short, bent leads and excess
solder on the leads:

Page 7

68AON47979H・Guidelines for EFARIn this example, a coating material covering the leads prevents testing on
automated test equipment (ATE).

As noted previously, damage to leads/pins makes it much more difficult toperform ATE testing for confirmation of electrical conditions and comparison
with production test data.
3-3. Shipping and Handling the Failure Analysis Units
During handling of semiconductors, it is recommended to use antistatic
material and conductive packing for storage as well as moisture control. The
onsemi primary containers i.e., trays, tape and reels, tubes, etc., are static
dissipative so shipping the failure analysis units in these containers is
recommended to prevent development of a static electrical charge. Do notuse standard plastic bags for shipments as these bags allow electricalcharges to build on the units inside the bag. Static protective bags may be
Page 8

68AON47979H・Guidelines for EFAR

used and can be identified by symbols and wording on the outside of the bag
as in the example below:

It is recommended to minimize movement of parts inside of the shipping
box with appropriate packing materials.
Having reference devices (known good units or KGUs) often aids thefailure analysis so including 2 to 3 KGUs along with the failing devices isrecommended. The number of reference devices should be noted in the
failure analysis request form in the field provided. The good reference
samples should be identified “reference devices” and be separated from thefailing units. The number of reference devices should not be included in thenumber of failing devices.
onsemi may choose not to support a failure analysis request if the failure
analysis units do not meet the above requirements.

Page 968AON47979H・Guidelines for EFAR

4. Verification by Customer
It is beneficial for analysis efficiency if the customer conducts their own
initial verification if possible or practical to isolate the failure to thecomponent.
4-1. ABA Swap
If the package does not have physical damage (see Section 5-1) aswould occur from a large EOS event, an ABA swap is recommended toconfirm the failure of the suspected unit/units:
 “A”: Remove suspected unit from the “failing” board.
 “B”: Place known good unit onto “failing” board and confirm failingboard is now working correctly under the same conditions.
 “A”: Place the suspect unit onto known good board and confirm
same failure under same conditions.

Failingpart(A)

Failing board

Known
good unit(B)

Known good board

Page 10

68AON47979H・Guidelines for EFAR

4-2. Waveform
Confirm failure with waveform of passing and failing cases using thesame conditions, (supply voltage, temperature, setup condition,
sequence until failure, etc.).

4-3. Schematic/Circuit Information
It is recommended to provide a schematic/circuit illustration which isrelated to the failure analysis unit as in the following example.

4-4. Imaging Products: Comparison with Outgoing Defect Specification(ODS)
Regarding imaging products, the ODS contains the image quality
data and conditions in which they were tested noting the image quality
using the following keywords:

Page 11

68AON47979H・Guidelines for EFAR







White Dots, Black Dots, Color Dots, Bright Dot, Dark Dot
Dead Pixel, Dark pixel, Bright Pixel, Pixel Defect
Cluster Defect
Horizontal Line
Row/Column FPN

Please note there is a certain number of these defects allowed as
noted in the product ODS. Please verify before declaring a productdefective and requesting analysis. A customer must compare failed
images and conditions with ODS and not processed RAW images toverify images are outside the ODS when the failure mode relates to
keywords shown above. RAW images should be provided when failure
analysis request is submitted.

5. Feedback from Past Failure Analysis Results
5-1. Massive, Visible Electrical Overstress Failure
Visible electrical overstress (EOS) damage as shown in thephotographs below may mask the root cause of the incident of failure. It
will be difficult to understand the root cause without an investigation of
the application conditions. onsemi will review the customer request withthe past data of failure analysis to potentially determine next course ofaction.

Page 12

68AON47979H・Guidelines for EFAR

5-2. Repeated EOS Failure
For repeated EOS failures occurring on the same component andsame application, an application-level approach will be most effective forthe investigation.
The customer design team and onsemi application engineers may
be needed to support the investigation into the root cause of EOS rather
than to perform another device level failure analysis. Repeatedly
analyzing at the component level without investigating EOS causes at theapplication-level only addresses one side of the coin i.e., a systems
approach is necessary.

If onsemi receives a 2nd failure analysis request whose previous
result was EOS with the same application, onsemi may request theresults from your application-level investigation from the 1st failure
analysis report prior to proceeding with the 2nd failure analysis.
5-3. Repeated No Trouble Found (NTF) Failure
The customer’s design team will need to investigate the application
for the root cause when the result of component level analysis by onsemi
is NTF. Without a confirmed component failure, device level failure
analysis by onsemi is not possible.
An NTF result from FA can be due to the reasons listed below. If theresult is NTF, it is advised the items below are reviewed to ensure
onsemi was provided with the full details of the failure.
Page 13

68AON47979H・Guidelines for EFAR









lack of detailed information
setting and condition of failure on the application
other device failure on the application
gaps between customer condition and onsemi condition
required special sequence to create the failure
special environmental conditions
wrong information

For imaging products, a common hardware platform between thecustomer and onsemi is helpful with the analysis. A demo kit can be used
for the common platform so if the customer has one, reproduction of the
failure using the kit and providing the INI file and register settings from thefailure reproduction can accelerate the analysis.
5-4. Same Failure Mode and Root Cause Confirmed in Past Failure
Analysis
If a new failure analysis request is received for a component with thesame failure mode attributed to an onsemi root cause, onsemi will checkthe implementation dates for the corrective actions (CA) to verify if the
new failures are from before or after the CA implementation. If pre-CA, thereport issued in the past will be provided again. For these types ofrequests, the analysis is redundant and will not be effective for improving
the quality of the component or the customer’s product. If it is the same
issue occurring after the implementation of corrective actions, onsemi will
investigate the incident.
5-5. Visual/Cosmetic Failure or Contamination Issue
When a visual or cosmetic failure on a device is detected, photos of
the affected part will be effective to investigate the incident. The photos
should be of the whole part and close-up of the failure area. Please
identify the defect or area of concern in all photos with circles or arrows
along with an explanation of the concern.

Page 14

68AON47979H・Guidelines for EFAR

These images show the whole part along with the concerns marked
by arrows or circles but do not have the required close-up image of theconcern.

The image below is not effective with communicating the concern
since it does not include a picture of the whole part nor does it identify theconcern with an arrow or circle.

If the device is an imaging product, all visual/cosmetic failures andcontamination issues affecting image quality except moving particle onactive pixels (e.g. scratch/contamination on a glass lid or active pixels),the concern should be verified against the ODS to establish validity forrequesting failure analysis.

Page 15

68AON47979H・Guidelines for EFAR

Generally, failure analysis is not valid for these cosmetic issues withimage sensors:Cannot be visible with up to 20x magnification microscopeVisible only by tilting or by inspecting at an angleCan be cleaned by onsemi recommended cleaning methodOutside of active pixels the defect is <50um (on top of activearray), and does not impact image quality under ODS conditions

Defect is <100um on top of periphery (not on top of active array)

A visual or cosmetic related incident may have a risk which could
impact multiple units. Information of affected lots and reference lots will
help onsemi investigate the root cause quickly. The onsemi packing label
as shown below is effective when investigating the lot so photos of thelabel should be provided to onsemi.

5-6. Logistic Issues
Logistic issues are related to labeling, wrong deliveries, damaged
shipping boxes, tape/reel damage, etc. When a packing problem or
damage on the shipment is detected, the photos of the concern will be
helpful to investigate the root cause. Photos should identify the concern
using circles or arrows. A description of the concern is also required.
Packing label information should also be provided as it is effective indetermining the cause.

Page 16

68AON47979H・Guidelines for EFAR

The images below are effective at identifying the concern visually.

5-7. Soldering or Board Mount Related Failure
Soldering and board mounting related failures may be component
related but might have multiple factors on the application side like board
layout, chemicals, materials, solder stencil thickness, temperature
conditions, reflow profile, and device conditions to name a few. A systemapproach, i.e., component-level and application-level analysis, is best for
determining the root cause so the customer and onsemi will need to work
together closely to investigate processes at both companies.
The onsemi “Soldering and Mounting Techniques Reference Manual”
contains valuable guidelines for mounting components to boards as well
as removal techniques. This manual can be downloaded from the onsemi
web site, www.onsemi.com. The manual can be searched by the title orthe item number SOLDERRM from the main search box.

Page 17

68AON47979H・Guidelines for EFAR

6. Data Analytics
Data Driven Signature Analysis (DDSA)
As a technology company, onsemi uses advanced data driven
analytics to improve the effectiveness and efficiency of our customer
returns process. Our decades of device data, advanced analytic
techniques and experienced analysts allow for accurate data mining andthe quick assessment of many issues. By employing data analytics earlyin the process, we can significantly reduce our overall response time andincrease the accuracy of product analysis. Data analysis is conductedutilizing an analytics engine which includes attributes such as date code,
package type, wafer fabrication facility, wafer process technology,
assembly site, and test site information. When data analytics are utilized,
the customer returned product is retained intact in case further analysis
becomes critical in the future.
The three possible outcomes of a “DDSA” investigation are:1) Electrically Passing Unit,
2) Electrical Overstress with a high degree of confidence, or3) Random defect not related to a systemic manufacturing issue.

7. Failure Analysis Support
7-1. End of Life (EOL) Parts Failure Analysis
Because EOL devices are no longer in production, corrective actions
will not be generated for the failure analysis report. For EOL product, only
the failure analysis will be performed using limited resource to primarily
determine if the parts meet specification and if not, identify what is failingin the device. If a more in-depth analysis is required, the reasoning toperform the deeper failure analysis must be provided. The determination
to move forward with the deeper analysis will be at the discretion of
onsemi after reviewing the reasoning.

Page 18

68AON47979H・Guidelines for EFAR

7-2. Parts from Unauthorized Sales Channels
onsemi provides no warranty for our product(s) purchased throughunauthorized sales channels. As such, failure analysis services are notoffered for products purchased from unauthorized sales channels.
7-3. Prototype Devices, Engineering Samples (ES)Prototype devices and engineering samples (ES) are for the purposeof evaluating function only. The devices may not have completed all
production related requirements or reliability testing. No or limited failure
analysis for these devices is available. All samples provided free ofcharge are categorized as engineering samples. Failure analysis on freesamples will be at the discretion of onsemi.
7-4. Customer Evaluation Samples for Failure Analysis
onsemi cannot support the failure analysis for components
evaluated under special conditions like reliability testing which does NOT
follow public industry standards such as JEDEC/AEC conditions.
7-5. Failure Analysis Request Through Authorized Sales Channels
For indirect purchases:
Customers purchasing parts through an onsemi authorized sales
channel (distributor) requesting failure analysis should contact the
distributor from whom parts were purchased to arrange the return ofsamples to onsemi. The distributor will handle the product return with
the Quality Center (QCenter) at onsemi based on the country where
the product was shipped. The distributor will manage the formal
failure analysis request with the QCenter but will likely have thecustomer to complete the onsemi Failure Analysis Request form withthe required information about the complaint. When the form isreceived by the QCenter, an EFAR number will be created, andshipping instructions will be emailed. After the samples have shipped
to onsemi, a regional Customer Quality Engineer (CQE) in either EU,
US, Asia, or Japan will manage the case. The email with shipping
Page 19

68AON47979H・Guidelines for EFAR

instructions will include the name and email for the CQE managing
the case.
For direct business with onsemi:
1. When onsemi product needs to be returned for failure
analysis and/or credit, first contact the onsemi QCenter using the
QCenter group email address below according to the region
where product was shipped.
2. Complete the form provided by onsemi including detailed
information regarding your complaint.
3. Email the completed Failure Analysis Request form back to
the QCenter.
4. Once the completed form is received by onsemi, the
QCenter will provide the shipping address with routing
instructions.
QCenters:
QCenters are the initial point of contact for analysis requests. For
all product returns, please send an email to the QCenter groupaddress below based on the region where product was shippedfor directions on the returns process and shipping instructions. A
regional Customer Quality Engineer/Manager or other onsemi
employee will assist in the product returns process.
The email addresses for the regional QCenters are listed below:
USA:
Europe:Asia:
Japan:

QCenter_AMERICAS@onsemi.com
QCenter_EMEA@onsemi.com
QCenter_ASIA@onsemi.com
QCenter_Japan@onsemi.com

7-6. Misusing Non-automotive Grade Device for Automotive Applications
onsemi does not support failure analysis for customers usage of
non-automotive grade devices for automotive applications.

Page 20

68AON47979H・Guidelines for EFAR

8. Electrostatic Discharge (ESD) Control
Semiconductors are sensitive to ESD and therefore need to have special
care during handling. Improper handling of failure analysis samples can
induce ESD damage in addition to the original cause of failure potentiallyleading to errors with the root cause analysis. Basic ESD control is meant toeliminate the source of static electrical charge. The following are generic
actions for reducing static electrical charge. These actions should be
implemented for assembly, test, packing, shipping and transportation,delivery, incoming, rework and storage. After mounting parts on PCB, thesame controls will be required.
1) Environment, Equipment, Facility
Static electrical charge can be generated under low relative humidity
conditions. The recommended humidity for handling semiconductors is
between 45 to 55%RH. Do not put material that generates static
electricity around the device or PCB. Regular monitoring of ESD
controls is important to assure compliance with ESD control systems.
For preventing static electrical charge, any measurement system, test
system, worktable and tool must be connected to ground. A conductivemat (105 to 109Ω) is required on worktables and floors. If sufficiently
low ESD conditions can’t be achieved, an ionizer is helpful in removing
electric charge.
2) HumanOperators must wear wrist strap or foot strap connected to
conductive mats on worktables, floors or ESD grounding locations. Forprotecting humans and products, a resistor (1M to 10MΩ) for preventionof electric shock and voltage drop of discharge needs to be connected
in series to ground. When handling products, antistatic gloves orfingercots are required for preventing direct contact with products. Work
clothes and work shoes will charge by friction, so it is recommended touse conductive smock and shoes (or shoe coverings). Generally, a 1M
to 100MΩ resistivity is recommended for smocks and shoe/shoecovering. When wearing conductive clothing, avoid contacting high DC
currents in equipment to prevent electric shock.
Page 21

68AON47979H・Guidelines for EFAR

3) Working Method
When using a soldering iron, a low voltage spec like 12V to 24V for
semiconductors is recommended. The tip of solder iron must be
grounded through 1M to 10MΩ resistor.
During handling of semiconductors, use antistatic material andconductive packing for storage. It is recommended to use trays andtubes; however, the anti-static properties of trays and tubes can changeover time with repeated usage and from contaminants so attention totheir condition is needed. Friction during transportation will generatestatic electrical charge so minimizing movement of parts inside the box
is recommended.

Page 22

68AON47979H・Guidelines for EFAR