ON Semiconductor
Is Now

To learn more about onsemi™, please visit our website atwww.onsemi.com

onsemi andand other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/orsubsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi
product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without
notice. The information herein is provided “as-is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality,or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and allliability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws,regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application
by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized
for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for
implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees,
subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or deathassociated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/AffirmativeAction Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others.

TND6231/DRev. 1, MAY − 2018Motor Drive Modules Support
Rapid Design Cycles andEnhanced Efficiency and Reliability© Semiconductor Components Industries, LLC, 2017

May, 2018 − Rev. 1

1Publication Order Number:
TND6231/D

Motor Drive Modules
Support Rapid DesignCycles and Enhanced
Efficiency and Reliability

thermal performance, available board space, and ease ofdesign. Once the optimum motor has been chosen, it
becomes important to carefully select the approach fordriving the system.
Many designers prefer using fully integrated,
off-the-shelf solutions that reduce design time and risk.
Leading semiconductor manufacturers are addressing thisrequirement by combining expertise in power
semiconductor
technology,
advancedpackagingtechniques, and application knowledge to create dedicated,
integrated solutions for motor control and industrial inverter
applications. Integrating motor drive and protection
circuitry into a single package, for example, createsa module that can significantly simplify and accelerate
system design. These modules are ‘pre-optimized’ with
important issues such as EMI already addressed. And byintegrating all of the semiconductor devices into a single
package, thermal issues are reduced and less PCB space isrequired.
Additional commercial advantages arise from the fact
that, once the design enters the manufacturing phase, thelowered component count reduces assembly and inventory
management costs.
When selecting a supplier, designers need to pay attention
to the specific solution for the existing design but should also
keep in mind other factors; for example, does the supplieroffer a broad range of solutions that allow the design to bescaled up and down to meet future application requirements.

The growth of motion control applications, coupled withenvironmental, commercial and legislative pressure to
reduce energy consumption, means that efficiency is at thetop of the design agenda for motor-based systems.
The International Energy Agency estimates that electricmotors account for almost half (46%) of total global energy
consumption, thus making them a focus for energy
efficiency initiatives. Energy efficiency is sufficiently
important that, in 2009, the European Union issued anenergy-related products directive (ErP) 2009/125/EC.
While the directive focused on multiple energy-consuming
devices, EU regulation 640/2009 specifically relates toelectric motors, whether they are sold as stand-alone devices
or as part of larger equipment.
Making the situation more complex is the fact that there
is an extremely wide range of electric motor applications
covering multiple sectors, all of which require reliable,energy-efficient solutions.
In the home, motors are found in white goods such as
refrigerators, kitchen appliances, washers and dryers.
Cooling devices such as air conditioners and fans are also
popular applications.
Industrial and commercial applications such as thosefound in factories and large offices also use motors forcooling and heating (HVAC). However, there are many
more applications to be found including pumps and fans, airand liquid compression, large computers, escalators,elevators, conveyors, hoists, cranes, tools, industrial-gradelaundry, cleaning and cooking equipment.
Electric vehicles use high voltage electric motors not only
for traction but also for air-conditioning compressors,
coolant circulation pumps and transmission oil pumps inhybrid electric vehicles.
Engineers can choose from many types of electric motors
based on factors such as efficiency, power, size, reliability,ease of control, and cost. The most commonly used motors
include AC induction motors (ACIM), brushed DC motors,
stepper motors, brushless DC motors (BLDC) andpermanent magnet synchronous motors (PMSM).

A Broad Range of Modular Motor Control Solutions

Figure 1 illustrates the elements of a high voltage motor
control system. ON Semiconductor’s broad productportfolio includes all of the key elements required for the key
functional blocks:• Motion Power Module − integrated solutions that
support designs from low-power (20 W) to high-power(10 kW)• BLDC Controller (Brushless DC/Permanent Magnet
Synchronous Motor) − mixed-signal ICs exclusively for
motor control that eliminate the need for complex andexpensive DSPs (Digital Signal Processors)• PFC (Power Factor Correction) − PFC modules thatminimize input current distortion, reduce power loss,
and save energy and cost
• Optocouplers − provide isolation from high-voltage
devices in motor control designs• SMPS (Switched Mode Power Supply) − power
management devices used in Flyback converter designs

Critical Choices for Designers

Critical design factors and challenges for motor controlarchitectures are efficiency, reliability, noise reduction,www.onsemi.com
2

Figure 1. Motor Control Systems Contain Multiple Functional Blocks

The motion power modules provide a fully-featured,
high-performance three-phase inverter output stage andoptimized gate drive technology to minimize EMI andlosses, and provide multiple on-module protection features.

Figure 2. Board Power Module Range Covers Multiple Applications up to 10 kW

While the power module range offers key benefits such as
UL certification (UL1557), improved thermal performancedue to direct-bond copper (DBC), and better reliability withhigher noise / surge immunity across the range, each device
is optimized to suit a specific application set.

www.onsemi.com
3

SPM 2 Series

reinforced by using low-loss NPT and field-stop trench
IGBTs with DBC package technologies that achieve greaterthan 10% reduction in module losses, with longer
short-circuit rating capabilities and embedded protection
circuits.

Typically used in HVAC, industrial inverters,servomotors, pumps or fan motors, the 600 V and 1200 V
SPM 2 module series addresses three-phase inverter based
motor drive applications up to 10 kW. Reliability isFigure 3. SPM 2 Block Diagram
SPM 3 Series

is compatible with AC induction, BLDC, and PMSM motortypes. Separate open emitter terminals are available for eachphase to support the widest variety of control algorithms.
SPM 3 modules are offered in very low thermal resistancepackaging AL2O3 DBC, ceramic substrate, and FullPAK
options.

Supporting a broad range of applications including
HVAC, commercial air conditioners, compact industrial
level inverters, servo-drivers, fan motors and pumps, the500 V, 600 V, and 1200 V SPM 3 module series covers
a wide range of power applications up to 3 kW. This solution

Figure 4. SPM 3 Block Diagram

www.onsemi.com
4

SPM 45 Series

offering ceramic substrate packaging with built-in bootstrap
diodes. System reliability is further enhanced by a built-in
NTC for temperature monitoring, integrated under-voltage
lock-out (UVLO) function and over-current protection
input.
Three separate open-emitter pins for low-side IGBTs
enable three-leg current sensing. Built-in bootstrap diodes
and dedicated Vs pins simplify PCB layout.

Aimed primarily at residential applications including
appliance inverters (such as residential A/C), washingmachines, refrigerators, pumps, industrial fans and compact
inverters, the 600 V SPM 45 module series provides
compact and high-performance inverter solutions for AC
motor drives in lower power applications up to ±2 kW. The
series targets cost-sensitive applications below 30 A,Figure 5. SPM 45 Block Diagram
SPM 55 Series

Also intended for residential use − including applianceinverters (such as residential A/C), washing machines andrefrigerators − the 600 V SPM 55 modules provide
a fully-featured, high-performance inverter output stage forlower power AC Induction, BLDC, and PMSM motors up
to 1 kW. The built-in, high-speed HVIC requires onlya single supply voltage and translates the incoming
logic-level gate inputs to the high-voltage, high-current
drive signals required to properly drive the modules’ robust
short-circuit-rated IGBTs. Separate negative IGBT
terminals are available for each phase to support the widest
variety of control algorithms.

Figure 6. SPM 55 Block Diagram

www.onsemi.com
5

SPM 5 Series

losses for three-phase motor drive applications below
200 W. Modules are offered in package options of DIP,
double DIP and SMD. Separate open-source MOSFET
terminals for each phase support the widest variety ofcontrol algorithms.

Serving a broad application set including dishwashers,
ceiling fans, pumps and fans for lower power air
conditioners, the 250 V, 500 V, and 600 V SPM 5 module
series provides optimized gate drive to minimize EMI andFigure 7. SPM 5 Block Diagram
SPM 7 Series

providing multiple protection features. The built-in HVIC
translates incoming logic-level gate inputs to thehigh-voltage, high-current drive signals required to properly
drive the internal MOSFETs. Separate open-source
MOSFET terminals are available for each phase to support
the widest variety of control algorithms. The PQFN package
can deliver board space savings of up to 50%, while
minimizing EMI and losses.

Intended for lower power applications such as small
pumps, pedestal and ceiling fans below 100 W, the advanced
SPM 7 (250 V, 500 V, 600 V) modules provide
a fully-featured, high-performance three-phase inverter
output stage for AC induction, BLDC and PMSM motors.
These modules integrate the optimized gate drive of thebuilt-in MOSFETs to minimize EMI and losses, while also

Figure 8. SPM 7 Block Diagram

www.onsemi.com
6Packaging Considerations

minimize PCB area, yet provide a simple method for adding
additional cooling for high-power applications. The devices
offer a far simpler mechanical and thermal arrangement thana discrete solution that would contain multiple ‘hot spots’.

The complete SPM range comprises multiple packaging
options including dual-in-line package (DIP) andsurface-mount (SMD). Each of these is optimized toFigure 9. The SPM Range Offers a Wide Variety of Packaging, Including SMD

have a flatness not exceeding −50/+100 mm, and a 150 mm
layer of thermally conductive grease should be applied
evenly across the contact surface, ensuring there is no dustor debris present.
Excessive and / or uneven fastening force must be avoided
as this could apply stress to the silicon, thereby damaging thedevice. The correct procedure involves using M4 SEMS
screws with a plain and spring washer and pre-tightening
both screws to approximately 25% of the final torque, before
final tightening with a torque-controlled screwdriver.

By following a few simple guidelines, designers caneasily create a thermally efficient solution that meets therequired safety spacing guidelines. This can be illustrated
with a more detailed examination of the SPM 2 package.
Creepage and clearance distances ensure safety andcompliance with all relevant safety standards. The package
itself defines the distances for the power and control
terminals (as shown in the table below); the designer needs
to ensure that the PCB layout maintains these distances.

SummaryMotor control can be challenging for the less-experienced
designers, not least due to stringent efficiency and reliability
targets as well as standards-driven safety requirements.
A modular approach is an obvious choice for newcomers to
motor control, yet many experienced designers also value
the multitude of benefits that modules offer. These include
a pre-optimized design, reduced size, reduced BOM costand component count, and assurance that reliability, safety,and efficiency targets will be met.

Figure 10. Recommended Spacings
for SPM 2 Module

When mounting a module to a heatsink, adhering tosimple procedures will ensure success. The heatsink should

ON Semiconductor andare trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/orspecifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are notdesigned, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, andexpenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if suchclaim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/CanadaFax: 303−675−2176 or 800−344−3867 Toll Free USA/CanadaEmail: orderlit@onsemi.com◊N. American Technical Support: 800−282−9855 Toll FreeUSA/CanadaEurope, Middle East and Africa Technical Support:
Phone: 421 33 790 2910

www.onsemi.com
7

ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative

TND6231/D