Activities of the Micromachine Center

Overview of FY 2009 Project Planning
Micromachine Center
knowledge database according to the results of this analysis anddiscussing the role of MEMSPedia, which will serve as acomprehensive knowledge base for MEMS fields.
(3) Dissemination of the MEMS equivalent circuit generator
One of the products of development in the Fine MEMS
Project is the MEMS equivalent circuit generator. The generator
is scheduled for release at the end of May 2009 as a Web-based
service. There has been an increase in R&D activity on theintegration of MEMS and electric circuits and on integration
through combinations of different types of MEMS. As more andmore successful products emerge through this research, theMEMS equivalent circuit generator will play an important role
as a new design tool capable of compensating for theshortcomings in the conventional design methods that focus
primarily on MEMS mechanical components. We recognize thatcreating a better environment for MEMS research through aWeb-based service capable of replacing MEMS with equivalent
electric circuits will be essential to the growth of fine MEMS.
Therefore, we are working hard to make this service available toall MEMS researchers in Japan.
(4) Support for the BEANS ProjectWith the primary responsibility of the BEANS Project (FY2008–2012) shifting to the BEANS Laboratory in 2009, MMC
will now participate as a member of the association. We will
provide personnel and financial resources and other suitablesupport for implementation of the BEANS Project in order toensure the project produces adequate results in the remainingyears.
(5) Examination of new projects for technologicaldevelopment
Since technological development on circuit integration andthe merging of dissimilar fields has recently gained momentum
in micro/nano-related fields through the Fine MEMS Project
and the BEANS Project, it will be necessary to establish centers
for MEMS research, development, and prototype manufacturing
to keep pace with this trend. In light of this, we will collaborate
with the relevant organizations and businesses to study
potential new projects for technological development.

1. Basic Policy for Project Planning
The Highly Integrated, Complex MEMS Production
Technology Development Project, more commonly referred toas the Fine MEMS Project, is a three-year project that began in2006 and concluded in the last fiscal year having achieved its
original goals satisfactorily. Thus, in 2009 we have turned ourattention to promoting and disseminating the project’sachievements. Further, as the BEANS Laboratory has now
assumed its new role as the primary association responsible forcontinuing implementation of the Project to Develop NextGeneration Device Manufacturing Technologies That Use
Different Fields, a five-year project initiated in 2008 and morecommonly referred to as the BEANS project, the MMC will now
serve as a member of this association and will continue toprovide human and financial resources and other support forthe project.
In light of the current troubling economic conditions, werecognize the importance of strengthening Japan’s industrial
competitiveness, which is currently reliant on advancedtechnologies. Accordingly, we will step up our efforts to create
a better environment for further stimulating industrialization
and research in the MEMS field through activities of the MEMS
Industry Forum (MIF) founded in April 2006, which activities
will include policy recommendations and the encouragement ofindustrial exchange and vitalization. We also remain firmly
committed to continuing activities from the previous year;
namely, investigative research, and activities to promote
standardization and to encourage the dissemination of researchfindings.
2. Major Projects

1. National / NEDO projects
This year, MMC will aggressively continue activities topromote and disseminate MemsONE, a product of theMemsONE Project, and will begin vigorous promotion anddissemination of the fine MEMS knowledge database and thenew MEMS equivalent circuit generator developed in the Fine
MEMS Project. In addition, we will work to formulate aframework for bases from which we can firmly establish highly
integrated, complex MEMS in Japan’s industry, and to write up
drafts and proposals for plans related to relevant R&D projects.
(1) Promotion and dissemination of MemsONE
In 2009 MMC will work more closely with software vendors
to provide support for MemsONE and will carry out activities todisseminate MemsONE with an emphasis on stabilizing theinfrastructure for future sales and distribution. Part of thedissemination activities will involve discussions with theCommittee for the Promotion and Dissemination of MemsONE
regarding promotion and dissemination challenges andstrategies. We will also work to strengthen cooperation between
the MIF and the Foundry Service Industry Committee (FSIC).
(2) Compilation of MEMSPedia
In order to disseminate the knowledge database of highly
integrated, complex MEMS created as part of the Fine MEMS
Project and to promote further accumulation of knowledge,
MMC plans to make the database available to the general public
on the Internet and to use events such as this year’s Exhibition
Micromachine/MEMS as venues for introducing the database.
We will also be establishing a new MEMSPedia Compilation
Committee this year aimed at further upgrading and expanding
the database. The committee will function as a vehicle foridentifying and analyzing technical fields and knowledge ofinterest to users based on server activity at MMC andmanagement of user registration, and for exploring issues andoperations relevant to the highly integrated, complex MEMS

2. Investigative research and standardization
MMC will be conducting investigative research to get a clear
picture of technological and industrial trends in micromachineand MEMS technologies, which are emerging as key
technologies in the manufacturing industry. We will also
investigate new issues in micro/nano technology that arise whenmerging nanotechnology with technologies in other fields. We
hope to demonstrate our initiative on the international stage
while promoting standardization in the fields of micromachines
and MEMS.
(1) Investigative research on strengthening production
centers for highly integrated MEMS
(2) Surveying of technological trends at home and abroad(3) Surveying of industrial trends(4) Upgrading of the micro/nano database(5) Joint research for the purpose of proposinginternational standards(6) Follow-up on the international standardization ofaccelerating life tests, bonding strength tests for
MEMS materials, and standard test pieces forcalibration conducted in 2006–2008 under theproject title “Measurement and evaluation ofmechanical properties of MEMS materials and theirstandardization” ; the project is referred to as apriority follow-up and has been consigned to JSA(7) Follow-up to a proposal of standards for testing2

a. Opening of the MEMS Mallb. Holding of the MicroNano 2009 general exhibitionc. Holding of Exhibition Micromachine/MEMS
d. Expansion of the international affiliate network
e. Participation in the 15th World Micromachine Summit
f. Participation as exhibitor as Hannover Messe
g. Dispatch of overseas fact-finding missions and exchangeof researchers

MEMS wafer-to-wafer bonding strength(8) Investigative study on overseas standards
Conducted a study on Japan’s response to the escalating
number of proposals for MEMS standards in South Korea andother countries overseas (including standards related to RFMEMS and bending test methods).
(9) Adoption of thin film material tensile test method
standard as a JIS

3. MEMS Industry Forum projects (for policy
recommendations and industrial exchange andvitalization)

4. Dissemination and publicity projects
MMC will continue to publish and distribute newsletters, holdexhibitions, and otherwise disseminate information on
micromachines and MEMS to educate the public and make suchinformation widely available. We are collecting referencematerials and documentation related to micro/nano technologies
from universities, industrial circles, public organizations, andother sources in Japan and overseas. This documentation will beconsolidated with reference materials for surveys studies
conducted at MMC and will be made available at the MMC
archives for browsing and searching. Information will also beprovided internally and externally through MMC’s Web site.
We will continue to perform dissemination and publicity
activities in 2009, striving for efficiency and effectiveness. Inaddition to our Web site and the quarterly magazine
MICRONANO, the MMC-MIF Monthly (Japanese only), and theMicro-Nano Express newsletter issued in collaboration with theBEANS Laboratory, we will also jointly operate an exhibit with
the BEANS Laboratory at Exhibition Micromachine/MEMS.
The 20th Exhibition Micromachine/MEMS will be held at
Tokyo Big Sight as part of MicroNano 2009. The event isscheduled for July 29–31.

MIF was established as a special project committee with thegoals of supporting the further development of MEMS
industries and contributing to the international competitivenessof Japan’s industry. Membership in MIF is composed primarilyof companies in MEMS-related industries. MIF performs theactivities listed below in collaboration with affiliated academies,
regional centers, and overseas institutions. This year’s goals are
to improve its administrative function and further expand its
activities.
(1) Policy recommendations(2) Collaboration with industry and academia(3) Improvement of the infrastructure for MEMS
development
a. Expansion and upgrading of the MEMS foundry network systemb. Promotion and dissemination of MemsONE (mentioned earlier)c. Strengthening of collaboration among regional public
foundries and local clusters
d. Implementation of personnel training projects(4) Information exchange among businesses in MEMS
and other industries

Research Studies and Standardization Activities
1. Survey of Technological Trends at Home and Abroadfrom the above surveys were summarized in the FY 2008 Survey
Results for Field-Specific Trends.

This survey has been conducted every year since 1993 tocollect and analyze in detail the latest technological data in Japanand overseas in order to follow trends in technology. Recognizing
the growing importance of such trends in Asia, the MMC
conducted surveys of presentation categories and trends in fieldspecific presentations at APCOT 2008 in the first half of last fiscalyear. The same surveys were conducted in the second half of theyear for MEMS 2009, which is an annual focus of our surveys.
The Asia-Pacific Conference on Transducers and MicroNano Technology (APCOT) is an international conference heldin the Asia-Pacific region to present R&D findings in the MEMS
and nanotechnology fields. The conference has convened
biannually since 2002 when the first conference was held inXiamen, China. Since then, the conference has been held inSapporo, Japan in 2004, Singapore in 2006, and, most recently,Tainan, Taiwan on June 22–25, 2008 (Sun-Wed). A total of 589
papers (compared to 571 at the previous conference) weresubmitted for APCOT 2008, with 205 submissions from Taiwan(109 previously), 117 from Japan (66 previously), 111 fromChina (137 previously), 51 from South Korea (48 previously),and 10 from Singapore (110 previously). Of the 589
submissions, 377 papers were accepted, resulting in anacceptance ratio of 64.0%.
MEMS 2009, the 22nd IEEE international conference on
Micro Electro Mechanical Systems (MEMS) was held inSorrento, Italy on January 25–29, 2009 (Sun-Thu). A recordhigh 856 papers were submitted for the conference, withsubmissions from Asia accounting for more than half the total(405 papers, or 47%). Asia was followed by North America with
254 submissions and Europe with 197. As usual, the conference
organizers were very selective, choosing only 276 of thesubmitted papers for a mere 32% acceptance ratio. The findings

2. Standardization(1) IEC status
A Final Draft International Standard (FDIS) for Japan’s
proposal on fatigue testing methods of thin film materials wasreferred to the IEC, put to vote on March 20, and adopted as an
IEC international standard on April 7, becoming the fifthinternational standard related to MEMS and the fourthsubmitted by Japan. We also submitted a draft to the IEC inFebruary on fatigue testing methods using resonant vibration,
developed under METI’s activities for standards certification.
While committee drafts (CDs) on RF MEMS switches, FBAR
filters, bending test methods, and testing methods for wafer-towafer bonding strength proposed by South Korea are currentlyunder review, Japan has submitted many comments, which arebeing weighed to reflect Japan’s opinion. Japan has drafted
proposals on a die shear text, 3-point bending test, and blister
test as the primary testing methods for wafer-to-wafer bonding
strength. Testing methods for micro-pillar compression andthermal expansion coefficients recently proposed by South
Korea in August of last year were not approved, because thenumber of participating nations in the project remains at three,short of the required four.
(2) Research and development
METI has commissioned the MMC to perform researchstudies on standards certification for accelerating life tests(2006–08), standard test pieces for calibration (2006–08),
bonding strength tests for MEMS materials (2007–08), andmicro-gyroscopes and electronic compasses (2008–10). A draft
proposal for a standard on accelerating life tests has alreadybeen submitted to the IEC, while drafts on standard test pieces3