ULVAC, Inc.

1. The Challenge of MEMSULVAC has been supplying advanced vacuum
technology products, such as semiconductor production
equipment, flat panel displays and other production
equipment based on myriad technical development in thecore of vacuum technologies Some ULVAC Group
companies have been involved in such advanced
materials as ultrafine particles, and surface analysis
equipment. In addition, ULVAC plans to enter new fields,
including biotechnology, fine mechatronics, and finechemicals. We have added to our equipment lineup with
the SME-200 sputtering device for forming high-dielectricfilms and SAW device electrodes, the CME-200 CVD
device for forming silicon oxide films and nitride films,
and the NLD-6000, which demonstrates its efficiency inthe deep etching of quartz.

Hiroyuki Yamakawa,
Managing Director and General Manager of the Tsukuba
Institute for Super Materials

water-shedding quality, hydrophilicity, biocompatibility,
antifungal properties and other properties to various
types of samples. It also provides excellent step coverage
enabling the formation of a uniform polymerization film
over the details of a fine processing shape. Using thesetechnologies, ULVAC has undertaken some processingsof brought -in materials for deposition and etching onto
customer's wafers.
We have received an increasing number of requests
from customers to manufacture MEMS devices in
addition to these processing services. To meet suchdemands, we have prepared lithography and other MEMS
processing lines and have established an integrated
production line from design to dicing and bonding, to say
nothing of the deposition and etching processes, in orderto launch our MEMS foundry service.

2. Launching a MEMS Foundry Service
ULVAC develops distinctive semiconductor wafer
processing technologies, including deposition of highdielectric films, magnetic films, and other functional
materials that are difficult to form with conventional
equipment, as well as deep etching of quartz, and dry
etching of materials that could not be etched until now
due to low vapor pressure. The vapor deposition
polymerization method developed by ULVAC can add a

Vacuum chamber

Evacuation

Substrate

3. Features of the ULVAC Foundry Service
Our foundry service has the following two features:
1. Utilizing ULVAC's distinctive technologies for vapor
deposition polymerization, dielectric deposition, andNLD dry etching, we fabricate MEMS devices andmanufacture and provide materials. The ULVAC
foundry also provides a wide range of materials forpurposes other than silicon processing.
2. Utilizing our technologies and know-how to develop
equipment and processes as an equipment
manufacturer, we provide rapid services for processingthat requires new processes and equipment to meetcustomer demands.

Monomer A

Monomer B

NLD-6000 MEMS dry etcherand processed sample

Our own vapor deposition polymerization
technology for forming uniform polymer
film over complex substrates

4. Future Challenges

SME-200 PVD device forforming high-dielectric films
and MEMS electrodes

In addition to these technologies, ULVAC has carbon
nanotube and ultrafine particle manufacturing
technologies and powerful surface analysis tools.
Through the integrated application of our technologies,
we hope to provide our foundry service, while
simultaneously developing MEMS devices and processes.

CME-200 PE-CVD device forforming SiO2 and SiNx films

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