International Electrotechnical Commission
IEC/TC47 Delft Conference Reportquestions raised by British and American
representatives about the English phrasing, inrecognition of the fact that such questions wereunrelated to the essence of the proposals, therepresentatives said that they would accept theproposals. Since this eliminated the basicproblems, approval was given to proceed on to thenext step of developing a committee draft and it
was decided that Japan would submit a draft inMarch 2004. Both proposals thereby advanced asingle step further towards approval.

Description of conference
The TC47/WG4 meeting was held in the city ofDelft in the Netherlands on October 28, 2003.
Three proposals for international standardization
Three representatives from Japan attended theIEC/TC47 (International ElectrotechnicalCommission Technical Committee Meeting No. 47)
held in Delft in the Netherlands on October 28,
2003. In addition to participating in discussions
concerning proposals for international
standardization currently being put forth by Japanstandards for the terminology to be used for
micromachines and MEMS, tensile testing methods
for thin film materials, a proposal for international
standardization developed from the results of theR&D for Standards Project conducted from 1999
until 2001, and standard specimens for testing-areport was also delivered on plans for fatigue
testing of thin film materials to be performed aspart of the energy usage management systemstandardization research survey begun this year,
and a request was made for international
cooperation in this regard. It was reported thatthese are the only three proposals being put forthat the present time by Japan in the field of
nanotechnology materials.

Holding of a new WG meeting
The Korean delegation proposed that a WG
meeting be held in June 2004 in Geneva or Phoenix
to discuss the creation of generic specifications forMEMS. The stated purpose of this meeting would
be to start to establish a position for lists oftechnical terms, tensile testing methods, fatigue
testing methods, and other MEMS standards to be
developed in the future. The Japanese delegation
expressed its agreement with this proposal and it
was decided that the WG meeting would be held.
Persons in attendance
The persons who attended the meeting are as
listed below:
R. Turner (Convenor,UK KBCI)
Kuniki Owada(International Standardization EngineeringLaboratory)
Akira Umeda(Japan, National Institute of Advanced Industrial
Science and Technology)
M. Konno (Japan, Micromachine Center)Sekwang Park
(Korea, Kyungpook National University)
Sang-Geun Lee(Korea, Agency for Technology and Standards)
Bo Cui(China, Heibei Semiconductor Research Institute)
Miao Lu(China, Heibei Semiconductor Research Institute)

Discussion of individual proposals
A discussion was held on comments submitted
by Korea and China concerning the proposal for
micromachine and MEMS terminology submitted
by the Micromachine Center in July of 2002 now at
the stage of a committee draft and it was decided
that the terms would be prepared as a committeedraft for vote. However it was requested thatclarification be made of the scheduling ofmaintenance before a final draft for vote bewritten.
As for the two proposals concerning thin film
materials tensile testing, these proposals had
already been presented in July earlier this year,
and while they had only been adopted as new
proposals as of October 10, although there were4