MMC Activities..............1
BEANS Pj ....................7
Column.......................9
Overseas Trends ..........10
Member’s Profiles ........12

MMC Activities

Micro / Nano 2008: An Overview
Micromachine Center (MMC)
To promote industrial interchange in micro/nano fields (micromachines, MEMS etc.) as effectively as possible, the Micromachine Centeris sponsoring Micro/Nano 2008, an integrated event that includes an exhibition, conference and related events. Micro/Nano 2008 will provide
attendees with an overview of the latest technical and industry trends in micro/nano fields as well as the opportunity to conduct businessexchanges efficiently with micro/nano related organizations and companies from Japan and overseas countries. Micro/Nano 2008 will be held
for four days starting Tuesday, July 29, 2008 and ending Friday, August 1, 2008 with Tokyo Big Sight as the main venue.

1. Micro/Nano 2008 Organization and ScheduleExhibition

The 19th Exhibition Micromachine/MEMS
International Exhibition focusing on MEMS, Nanotechnology, Ultraprecision / Microfabrication and Biotechnology

Date
Venue
Sponsor
Organizer

July 30, 2008 (Wednesday ) - August 1, 2008 (Friday)
Tokyo Big Sight (Tokyo International Exhibition Center, West Hall 1 & 2)
Micromachine Center
Mesago Messe Frankfurt Corporation

Support (planned)
Cooperation (planned)

Ministry of Economy / Trade and Industry (METI)The Japan Machinery Federation / Japan Robot Association
Japan Analytical Instruments Manufacturers Association

Concurrent Events

The 14th International Micromachine / Nanotech Symposium
Date & Time
Venue

July 29, 2008 (Tuesday)
10:00 a.m. - 6:10 p.m.
Tokyo Bay Ariake Washington Hotel (Iris Banquet Hall)

SponsorSupport (planned)
Cooperation (planned)

Micromachine Center
Ministry of Economy, Trade and Industry (METI), New Energy and Industrial Technology Development Organization (NEDO)The Japan Machinery Federation / Japan Robot Association / Japan Analytical Instruments Manufacturers Association

Japanese-German Micro / Nano Business Forum
Date & Time
Venue
SponsorJuly 30, 2008 (Wednesday)
10:45 a.m. - 5:00 p.m.
Tokyo Big Sight (Tokyo International Exhibition Center, West Hall 1)
19th Exhibition Micromachine / MEMS special venue

IVAM Microtechnology Network

Cosponsor

Micromachine Center / MEMS Industry Forum

Meeting for announcing results of FineMEMS Project
Date & Time
Venue

July 31, 2008 (Thursday)
12:30 - 4:30 p.m.
Tokyo Big Sight (Tokyo International Exhibition Center, West Hall 1)
19th Exhibition Micromachine / MEMS special venue

SponsorFine MEMS Project Promotion Committee / Micromachine Center
Cosponsor New Energy and Industrial Technology Development Organization (NEDO)MEMS Forum
Date & Time
Venue
SponsorAugust 1, 2008 (Friday)
10:30 a.m. - 4:35 p.m.
Tokyo Big Sight (Tokyo International Exhibition Center, West Hall 1)
19th Exhibition Micromachine / MEMS special venue

Micromachine Center / MEMS Industry Forum

Internet Home Page : http://www.mmc.or.jp/

2. Overview of concurrent conferences
SThe 14 t h International Micromachine / Nanotech Symposium(1) Purpose
The International Micromachine / Nanotech Symposium is held to promote the growth of MEMS related industries and improve theinternational competitiveness of the key components manufactured in Japan. The symposium includes the exchange of information withmicromachine and nanotech researchers who are promoting research and development on the front lines of leading-edge technical fields
both at home and abroad, and it also provides MEMS researchers from Japan and overseas countries with the latest information and avenue for discussion. The theme of the 14th International Micromachine / Nanotech Symposium is “ Technology Convergence MEMS: LSI,
Nano and Bio,” and features issues such as LSI/MEMS integration efforts and their application and next-generation BEANS process
technologies and the prospects for these technologies.
(2) Program

The 14 th International Micromachine / Nanotech Symposium--- International Exhibition focusing on MEMS, Nanotechnology, Ultraprecision / Microfabrication and Biotechnology --Date & Time: July 29, 2008 (Tuesday)
10:00 a.m. - 6:10 p.m.
Venue: Tokyo Bay Ariake Washington Hotel (Iris Banquet Hall)
Sponsor: Micromachine Center
Support (planned): Ministry of Economy, Trade and Industry (METI), New Energy and Industrial Technology Development Organization (NEDO)
Cooperation (planned): The Japan Machinery Federation / Japan Robot Association / Japan Analytical Instruments Manufacturers Association
10 : 00 - 10 : 05
10 : 05 - 10 : 10
Keynote Session
10 : 10 - 10 : 55
10 : 55 - 11 : 40
11 : 40 - 12 : 40
Session 1
12 : 40 - 13 : 10
13 : 10 - 13 : 40
13 : 40 - 14 : 10
14 : 10 - 14 : 40
14 : 40 - 14 : 50
Session 2
14 : 50 - 15 : 20
15 : 20 - 15 : 50
15 : 50 - 16 : 20
16 : 20 - 16 : 30
Session 3
16 : 30 - 17 : 00
17 : 00 - 17 : 30
17 : 30 - 18 : 00
Closing
18 : 00 - 18 : 10

Chair: Keiichi Aoyagi, Micromachine Center
Opening
Tamotsu Nomakuchi, Micromachine Center
Opening Remarks
Takeshi Yoneyama, Industrial Machinery Division, Manufacturing Industries Bureau, METI
Guest Speech
Chair: Hiroyuki Fujita, The University of Tokyo
Technology Convergence on MEMS
Hidetoshi Kotera, Kyoto University
MEMS Industrialization Perspective in Japan
Roger T. Howe, Stanford University
Integrated Micro/nanosystems - Technology and Applications
Lunch
Chair: Seiji Samukawa, Tohoku University
MEMS LSI Integration
Albert Chang, Asia Pacific Microsystems (APM)
CMOS/MEMS Integration from Foundry Standpoint
Yoshiaki Toyoshima, Toshiba Corp.
MEMS and CMOS - Cooperation and Integration
Wilbur Catabay, Silicon Valley Technology Center
Opportunities and Challenges for MEMS at 200 mm
Susumu Sugiyama, Ritsumeikan University"FineMEMS" Project: Highly Integrated and Complex MEMS
Break
Chair: Kazuyoshi Furuta, Seiko Instruments
MEMS Emerging Applications
Uwe Kleinkes, IVAM
Emerging Micro / Nano Applications from Euro
Yoshio Sekiguchi, Omron Corp.
MEMS MEMS Microphone and 8 inch manufacturing
Ryo Ota, Olympus Corp.
MEMS Applications on Biotechnology and Sensing
Break
Chair: Takashi Usuda, AIST
Emerging Technology -- BEANS
Jouni Ahopelto, VTTMEMS and innovative nano-patterning
Ichiro Yamashita, Matsushita Electric Industrial
Nano-structure Design Using Protein
Koji Miyazaki, Kyushu Institute of Technology
Realizing High Efficiency Overcoming the Material Limitation in Thermoelectric Power Generation Using Nano-structure
Keiichi Aoyagi, Micromachine Center

Closing Remarks

SJapanese-German Micro / Nano Business Forum(1) Purpose
The Japanese-German Micro/Nano Business Forum has been held annually in Japan since 2003. This year’s forum, the sixth, will beheld for the first time concurrently with and within the same venue as the Micromachine/MEMS Exhibition. The forum is sponsored by
the IVAM Microtechnology Network, an organization set up in 1993 in the North Rhine-Westphalia (NRW) province of Germany with theobjective of promoting networking among small and medium-sized microtechnology companies. The forum introduces state-of-the-art
technical developments in Japan and Germany, two countries that lead the world in the microtechnology field.
(2) Program

Japanese-German Micro / Nano Business Forum
Date & Time: July 30, 2008 (Wednesday) 10:30 a.m. - 5:00 p.m.
Venue: Tokyo Big Sight (Tokyo International Exhibition Center, West Hall 1)
19th Exhibition Micromachine/MEMS special venue
Sponsor: IVAM Microtechnology Network
Cosponsor: Micromachine Center / MEMS Industry Forum(Attendance free / Simultaneous interpretation provided)

Opening (Registration Starts 10:30 -)10 : 45 - 11 : 00
Opening Remarks
Session 1
Solutions for Production of Microsystems
11 : 00 - 11 : 20
Electrical vias for multi-stack MEMS and packaging issues
Michael Schilling, Plan Optik AG (Germany)
11 : 20 - 11 : 40
Equipment Solutions for Automatic Assembly of Microsystems
Manfred Glantschnik, Datacon Technologies (Austria)
11 : 40 - 12 : 00
Micro machining system for cutting and laser processing
Naoki Iwamura, Leybold Co., Ltd. (Japan) / Kugler GmbH (Germany)
12 : 00 - 13 : 00
Lunch
Session 2
Business development for Micro and Nano
13 : 00 - 13 : 40
Innovations for industry- market chances for micro and nano in Europe
Dr. Uwe Kleinkes, IVAM Microtechnology Network (Germany)
13 : 40 - 14 : 00
Technology Transfer Europe-Japan
Dr. Robert Harrison, 24IP LAW GROUP Sonnenberg Fortmann (Germany)
14 : 00 - 14 : 20
MEMS Industry Forum plays a key role of technology and business development on microtechnology in cooperation with the academia and the government
Junji Adachi, Micromachine Center
14 : 20 - 14 : 40
- to be announced Dr. Heiko Kopf, MST. factory Dortmund (Germany)
14 : 40 - 15 : 00
Break
15 : 00 - 15 : 20
- to be announced Session 3
Innovation in Measuring and Analysis
15 : 20 - 15 : 40
- to be announced 15 : 40 - 16 : 00
Optical 3D Surface Measurement Tools for Micro Production
Heinz-Peter Hippler, NanoFocus AG (Germany)
16 : 00 - 16 : 20
Complex Miniaturized Analysis System for Nuclear Magnetic Resonance Spectroscopy
Stefan Leidich, Fraunhofer IZM (Germany)
Closing
16 : 20 - 16 : 40
Towards successful MEMS business by open collaboration
Prof. Masayoshi Esashi, Tohoku Universty
16 : 40 - 17 : 00
Q&A

2

S Meeting for announcing results of FineMEMS Project(1) Purpose
This conference is held to disclose the interim achievements of the “Highly Integrated and Complex MEMS Manufacturing
Technology Development Project,” a three-year project that has been implemented since FY 2006 by NEDO. This project, also known as
the “Fine MEMS” project, seeks to develop key manufacturing technologies for the creation of complex and integrated functions throughthe creation of advanced tiny three-dimensional structure processing technologies and the use of nanomaterials and different types ofmaterials. This is a key technology supporting the development of the MEMS industry.
(2) Program
Highly Integrated and Complex MEMS Manufacturing Technology Development Project (FY 2006 - 2008) (commissioned by / subsidy
provided by NEDO)

Meeting for announcing results of FineMEMS Project
Date & Time: July 31, 2008 (Thursday) 12:30 - 4:30 p.m.
Venue: Tokyo Big Sight (Tokyo International Exhibition Center, West Hall 1)
19th Exhibition Micromachine/MEMS special venue
Sponsor: New Energy and Industrial Technology Development Organization (NEDO) / Micromachine Center
Support: Ministry of Economy, Trade and Industry (planned)
Attendance: Free of charge but first-come-first-serve due to limited seating capacity (200)and quantity of extended abstracts
Session 1
12 : 30 - 12 : 35
12 : 35 - 12 : 50
12 : 50 - 13 : 10
Session 2
13 : 15 - 13 : 35
13 : 35 - 13 : 55
13 : 55 - 14 : 15
14 : 15 - 14 : 35
14 : 35 - 14 : 45
Session 3
14 : 45 - 15 : 05
15 : 05 - 15 : 25
15 : 25 - 15 : 45
15 : 45 - 16 : 05
16 : 05 - 16 : 15
Closing
16 : 20 - 16 : 30

Opening
Chair: Tomoyuki Koike, Micromachine Center
Opening Remarks
Akira Uehara, NEDOMEMS industry strategies and expectations for the Fine MEMS Project
Motoki Korenaga, Ministry of Economy, Trade and Industry
Overview of Fine MEMS Project
Isao Shimoyama, The University of Tokyo
Achievements of Fine MEMS Project consignment projects (1)Chair: Mitsumasa Koyanagi, Tohoku University
Selective nanomachine structure formation technology
Isao Shimoyama, University of Tokyo
Selective modification technologies for biomaterials (proteins, etc.)
Yoshio Suzuki, AIST
Selective formation technologies for nanomaterials (CNT, etc.)
Kenji Hata, AIST
Low-stress dicing technology for multilayer wafer level joints
Masayuki Fujita, Institute for Laser Technology
BreakAchievements of Fine MEMS Project consignment projects (2)Chair: Susumu Sugiyama, Fine MEMS Project Subleader
Development of a fine MEMS system design platform
Professor Gen Hashiguchi, Shizuoka University
General monolithic manufacturing technologies for MEMS - semiconductor processing (the search for a new sensing principle)
Hisayuki Toriyama, Ritsumeikan University
MEMS - semiconductor transverse wiring technologies (high-density low temperature laminate integration mounting technologies)
Jun Akedo, AISTMEMS - semiconductor transverse wiring technologies (high-density low temperature laminate integration mounting technologies) Mitsumasa Koyanagi, Tohoku University
Fine MEMS knowledge databaseToshio Sakamizu, Micromachine Center
Closing Remarks

Keiichi Aoyagi, Micromachine Center

S Micro / Nano 2008 MEMS Forum(1) Purpose
The MEMS Forum is a forum for the exchange of information and views regarding the various activities of the MEMS Industry Forum.
Its purpose is to achieve a deeper common recognition of the issues that must be resolved for the expansion and development of MEMS
related industries. The Forum introduces the status of activities by the MEMS Industry Forum and affiliate members (local clusters,
publicly funded laboratories and academia), from the perspective of building an infrastructure for the MEMS industry and the creationand development of a MEMS technical infrastructure through industry-academic collaboration.
(2) Program

Micro / Nano 2008 MEMS Forum--- For the Development of MEMS Industries --Date & Time: August 1, 2008 (Friday) 10:30 a.m. - 4:35 p.m.
Venue: Tokyo Big Sight (Tokyo International Exhibition Center, West Hall 1)
19th Exhibition Micromachine/MEMS special venue
Sponsor: MEMS Industry Forum / Micromachine Center
Attendance: Free
Chair: Shun'ichi Adegawa, Micromachine Center
Opening
10 : 30 - 10 : 35
Session 1
10 : 35 - 10 : 50
10 : 50 - 11 : 20
11 : 20 - 11 : 40
11 : 40 - 12 : 00
12 : 00 - 13 : 10
Session 2
13 : 10 - 13 : 20
13 : 20 - 13 : 40
13 : 40 - 14 : 00
14 : 00 - 14 : 20
14 : 20 - 14 : 30
Session 3
14 : 30 - 14 : 50
14 : 50 - 15 : 10
15 : 10 - 15 : 30
15 : 30 - 15 : 50
15 : 50 - 16 : 10
16 : 10 - 16 : 30
Closing
16 : 30 - 16 : 35

Opening remarks
Koichi Imanaka, Assistant Director, MEMS Industry Forum
Advancement of MEMS industries and technologies
Overview of MEMS Industry Forum activities
Keiichi Aoyagi, Micromachine Center
Strengthening of MEMS industry infrastructure
Isao Shimoyama, The University of Tokyo
Toward MEMS market expansion: 1st generation MEMS - 3rd generation MEMS (BEANS)
Junji Adachi, Micromachine Center
Technical strategy roadmap for the MEMS field
Hideaki Watanabe, NEDO
Lunch / breakIndustry-Academic Collaboration Session
Organizer: Professor Kazuo Sato, Nagoya University
Remarks at the beginning of the industry-academic collaboration session
Kazuo Sato, Nagoya University
Wearable microsensors: an advanced general sensing technology for achieving a safe and secure society
Kazusuke Maenaka, University of Hyogo
Mass production of next-generation optical elements through ultra-precision micro three-dimensional machine processing
Eiji Shamoto, Nagoya University
Introduction to the Micro Energy Research Council, Micro/Nano Optical Specialist Forum, Japan Society of Mechanical Engineers
Hiroki Kuwano, Tohoku University
BreakIssues for MEMS Industry Development
International standardization trends in MEMS fields
Professor Kunie Owada, Teikyo University
AIST training of micro/nano manufacturing personnel, focusing on industry-academic personnel training partnership projects
Ryutaro Maeda, AIST
Strengthening of MEMS Foundry infrastructure
Susumu Sugiyama, Ritsumeikan University
Activities for the establishment of a MEMS foundry network
Fumihiko Sato, Omron Corporation
Case studies of the use of MEMS technologies in research and development assistance by the Kanagawa Industrial Technology Center
Manabu Yasui, Kanagawa Industrial Technology Center
MemsONE functions and future plans (MEMS design and analysis support system) Ver. 1.1
Yukihisa Maeda, MemsONE Consortium, Nihon Unisys Excelutions
Closing Remarks

Keiichi Aoyagi, Micromachine Center

3

MMC Activities

Activities of the Micromachine Center in FY 2007
industry, the MEMS Industry Forum was established in April
2006 as a Special Projects Committee with a membership madeup primarily of companies involved in the MEMS industry. The
MEMS Industry Forum also works to establish ties withacademies, local centers, overseas institutions and the like asaffiliates. The Forum makes policy proposals to relevant
institutions and promotes a variety of activities aimed atindustry interchange and stimulation.

Overview
The Micromachine Center (MMC) actively promotes
technical development projects commissioned by the national
government and the New Energy and Industrial Technology
Development Organization (NEDO) in an effort to establish thecore technologies in the micromachine, Micro Electro
Mechanical Systems (MEMS) and other micro/nano fields. At
the same time, in order to promote widespread use andindustrialization of these core technologies, the Center also
aggressively pursues activities to improve the environment for
micro/nano technologies. The Center’s activities include policy
proposal activities, industry interchange / stimulation projects,
research projects, standardization promotion projects anddissemination and publicity projects designed to promoteindustrial development in micro/nano fields and contribute to
the international community.
In FY 2007, the Micromachine Center conducted thefollowing activities.

(1) Policy recommendation activities
On November 8, 2007, members of the MEMS Industry
Forum Promotion Committee and representatives from thegovernment and related agencies exchanged views on MEMS. In
addition, a MEMS Forum was held at the Micro-Nano 2007
general exhibition in July 2007. Various issues were raised withregard to design (MemsONE), manufacturing (MEMS Foundry)
and MEMS personnel training, with the aim of strengthening
the infrastructure for the MEMS industry. These policy
recommendation activities were conducted to promote thedevelopment of MEMS-related industries.

1. National / NEDO projects
In FY 2007, the Micromachine Center vigorously promoted
the Highly Integrated and Complex MEMS Manufacturing
Technology Development Project, a three-year project initiatedin FY 2006. The Center also actively promoted thedissemination of MemsOne, the research and development
achievement of the MEMS Design and Analysis Support System
Development Project (commissioned by the national
government and NEDO) that concluded in March 2007.

(2) Industry-academia liaison activities
Micro/Nano Cutting Edge Technology Exchange meetings
were held three times during the fiscal year (in July, November
and March), in order to deepen understanding and recognitionof state-of-the-art technologies in various fields relating tomicro/nano technology, and to disseminate micro/nanotechnologies and promote industry-academia interchange. For
each session, two knowledgeable persons from universities, theNational Institute of Advanced Industrial Science andTechnology (AIST) and so on were invited to give presentations
and provide technical consultation.

(1) Highly
Integrated
andComplex
MEMS
Manufacturing Technology Development Project(Project commissioned by NEDO)In FY 2007, as in the previous fiscal year, active
development efforts continued to focus on gathering, organizing
and building a database of knowledge data in three areas:
1 Combination of MEMS / nanofunctions
2 Integrated formation of MEMS / semiconductors
3 High integration of MEMS with other MEMS
A new project to research and develop a fine MEMS
integrated design platform was also initiated in FY 2007 as asingle-year FY 2007 special financial resource for project
promotion. A web browsing system was also created byorganizing information relating to research and development
issues 1 - 3 as well as information peripherally related to theseissues involving an equivalent circuit model as a design platform
suitable for highly integrated and complex MEMS devices.

(3) Creation of an infrastructure for MEMS development
1 Expansion and upgrading of MEMS Foundry Network
systems
2 Promotion of MemsONE dissemination
3 Strengthening of collaboration with public foundries ineach area and local clusters
4 Promotion of personnel training projects(4) MEMS business interchange activities both at home
and abroad
1 Opening of a MEMS Malll
Study of basic activities and site configuration for MEMS
Mall and preparation of a MEMS Mall draft proposal.
2 Holding of Micro/Nano 2007 general exhibition
Micro/Nano 2007 was held July 25 - 27 primarily at Tokyo
Big Sight.
3 Participation in 13th World Micromachine Summit
The 13th World Micromachine Summit was held Thursday,
April 26, 2007 through Saturday, April 28, 2007 in Venice,
Italy (at the Telecom Future Centre).
4 Formation of an international affiliate network
The establishment of cooperative ties with overseas
MEMS related organizations was promoted. As of FY 2007,
there were 11 overseas affiliates.
5 Dispatch of overseas missions and researcher interchange
In FY 2007, the Micromachine Center participated in a
micro/nano related event in Germany (Hannover Messe), andalso dispatched missions to overseas countries and promoted
interchange with both research institutions/organizations andindividual researchers.

(2) Promotion of MemsONE dissemination
MemsONE was the research and development achievementof the MEMS Design and Analysis Support System Development
Project, a project commissioned by the national government
and NEDO that concluded in March 2007. The Center worked
with the MEMS Industry Forum to energetically promote thedissemination of MemsONE.
(3) MemsONE Achievements Dissemination Project(commissioned by NEDO)The Center initiated a MemsONE achievements
dissemination project (commissioned by NEDO) to disseminate
MemsONE in order to achieve the project's stated objective ofpromoting the expansion of the MEMS industry base and thedevelopment of new MEMS products.
More than 450 licenses for the beta version have been
issued, and the training course was attended by more than 150
persons. These activities made a major contribution toestablishing an infrastructure for dissemination.

3. Research projects
The Micromachine Center conducted research relating tomicromachine and MEMS technologies in order to accurately
determine technical and industry trends and study newtechnical issues in the areas in which micro- andnanotechnologies are becoming integrated.

2. MEMS Industry Forum projects (policy proposal
and industry interchange / stimulation projects)
In order to support the further development of the MEMS

4

1 General Principles of MEMS (CDV)
2 RF-MEMS switch (CD)
3 Bonding test method (CD)(1) Implementation of research relating to the BEANS Project
The BEANS project represents the achievement of the“MEMS Frontiers: Study of Future Device Technologies Made
Possible by Fusion with Nanodevices” project implemented in
FY 2006. In order to make the BEANS project into a national
project, a “BEANS Project Research Council” was establishedand study was conducted of the project scheme, organization,
research content and the like.

(5) Creation of JIS standards for thin film material
tensile test method standard
Work was begun on the creation of JIS standards for thetensile test method and standard test specimens standardized
by the IEC in 2006.

(2) Study of technical trends in Japan and other countries
In the first half of the fiscal year, study focused on the typeof presentations made at TRANSDUCERS ’07 and the trends inoral presentations for each field. In the second half of the year,
as in past years, a study was conducted of the type ofpresentations featured at MEMS2008 and the trends for eachindustry.

(6) In June 2007, the Micromachine Center became theJapanese review body in the MEMS field for IEC/TC47(specialist committee for semiconductor devices). The Center
also proposed that Working Group 4 (WG4) in the MEMS field
be upgraded to a subcommittee (SC).

5. Dissemination and publicity projects(3) Study of industry trends
To stimulate MEMS industries and expand the MEMS
industry base, a study was conducted to determine the current
status and market trends relating to the MEMS foundry
industry in Japan, as well as the state of MEMS foundries inother countries. In addition, basic data needed to upgrade
MEMS foundry functions in the future was compiled.

The Micromachine Center issued and distributed anewsletter and sponsored exhibitions and the like in an effort topromote widespread dissemination and education regarding
micromachines and MEMS. The Center also collected
micro/nano information and reference materials fromuniversities, industry, public institutions and so on both athome and abroad and organized these materials together withthe reference materials from studies conducted by the Center.
These materials can be viewed and searched in the MMC
library, and they have also been made available to researchers
both at home and abroad via the MMC website.

(4) Periodic survey of MEMS technology strategy map
As a periodic survey of the technical strategy map for the
MEMS industry, a roadmap for improving the environment for
MEMS personnel training was established in order toaccommodate MEMS market expansion.

(1) Improved dissemination and exchange of information
through the MCC website
The Micromachine Center worked to provide informationand conduct interchange activities using the MMC website. The
content available to supporting members has also been
upgraded.

(5) Upgrading of micro/nano database
An effort was made to further enhance the database on theMicromachine Center website by provide a search function for
documents made available to supporting members as well as byincluding survey reports, mini-survey reports, a map of research
centers and so on.

(2) Publication of “MICRONANO” quarterly
The Center published a quarterly magazine entitled“MICRONANO” in April, July, October and January anddistributed it to supporting members and other relevant entities,
and also posted English and Japanese editions on its website.

4. Projects to promote standardization
Standardization projects were pursued with our international
initiatives in micromachine/MEMS technology fields.
(1) Standardization priority review
With regard to standardization candidate topics in corecommon fields and device fields, studies were conducted of thecurrent status and the need for technical verification, the needfor development of new measurement methods, research anddevelopment organizations, priorities, existing standards and soon. Accordingly, in the device field it was decided to give top
priority to angular velocity sensors (gyro) and geomagnetic
sensors.

(3) Publication of monthly newsletter
The Center published a monthly newsletter in Japaneseentitled MMC/MIF News and distributed it to supporting
members, MEMS Industry Forum members and other entities
via the Micro/Nano Net. The newsletter provides MMC-related
news for the previous month, information on upcoming eventsand so on.
(4) Publication of MicroNano Express newsletter
The Center published an electronic newsletter in Japanese
to provide information on special events and the like anddistributed it to supporting members, MEMS Industry Forum
members and other entities via the MicroNano mailing list.

(2) Research and development activities relating to certificationof standards for the purpose of proposing international standards
With regard to life acceleration tests, test specimens forindividual universities were prepared from the same test
materials and fatigue tests were conducted using various
methods and the results were compared. With regard tobonding strength tests, testing equipment was developed and aqualitative determination of the current state of bonding
strength evaluation research was conducted for microstructure
members, and a study of existing standards was conducted.

(5) Maintaining and upgrading of the MMC library(by upgrading the academic paper abstract database, etc.)
The Center summarized abstracts of technical papers andreferences in the Micro/Nano Index newsletter (Japaneseonly) and distributed the newsletter in electronic form tosupporting members, related institutions etc.
The Center also upgraded the library by organizing andstoring the technical documentation and references that had
been gathered and making these materials available for viewing.

(3) Follow-up activities relating to proposal of standards
for thin film material fatigue testing
The views of various countries were accommodated andfollow-up activities were conducted up through the submissionof a committee draft for vote (CDV).

(6) Micromachine/MEMS Exhibition
The 18th Micromachine/MEMS Exhibition was held as part ofMicro/Nano 2007 at Tokyo Big Sight Wednesday, July 25
through Friday, July 27, 2007. Total attendance was 12,424
persons, the largest yet (last year’s attendance was 11,736
persons). The exhibition featured 362 organizations exhibiting
at 484 booths.

(4) Study of overseas standards
Following a review of the following standards proposed by
Korea, voting and the submission of comments from Japan wereconducted.

5Personnel Training and Improvement of Foundry Functions to Accommodate MEMS Market Expansion
expansion of the MEMS market. Taking this into
account, the Micromachine Center studied the statusof personnel training programs in the MEMS field thatare currently being implemented by MEMS relatedcompanies, as well as the MEMS personnel training
programs being promoted and supported by thenational government. Based on the results, theobjectives have been divided into two areas(“improving the environment for company in-housepersonnel training policies” and “improving theenvironment to enable personnel in other fields toeasily enter the MEMS field”). A conceptual diagramof a MEMS personnel training system has also been
prepared and this has been reflected in the technicalstrategy roadmap for MEMS fields.

The market for Micro Electro Mechanical Systems(MEMS) – tiny, highly sensitive key devices withexcellent energy conservation properties – is expected
to expand in diverse fields such as
telecommunications, automobiles, robots, medical careand biotechnology. However, knowledge andtechnologies in a wide array of fields including
machinery, electricity, chemistry, physics, materials,
optics and medical care will be needed for thedevelopment and manufacture of MEMS. The trainingof MEMS personnel who can take a comprehensive
view of the entire technical development process will
also be essential.
Securing of personnel in the MEMS field is a matterof pressing urgency in order to accommodate the

MEMS Personnel Training System
Improvement of environment
to allow personnel in otherindustries to easily enter
the MEMS fieldUtilization ofsenior citizen
personnel

Improvementof MEMS foundryfunctions

MEMS managers
Dispatched to different
fields and different
industries

Senior citizen
personnel bankAble to view MEMS development/design
and production from a cross-sectional
perspective and plan and propose
appropriate MEMS applications

MEMS research &development personnel
MEMS prototyping
consultants /coordinators(MEMS joint
prototyping center)
Improvement of
MEMS systems
infrastructure

Use of MemsONE

Improvement /upgrading of
Use of MemsPedia
knowledge
database
Expansion of internships

Enhancement ofcompany in-housetraining

Senior citizen personnel(industry-academic collaboration coordinators, etc.)

Step-up

Personnel who can multiple technologies
in different specialist areas and then fuse themin MEMS development and design
Step-up
Personnel who have a fair knowledgeof MEMS manufacturing process analysis,
structural analysis and systems analysis
and can see the connection with design
and production technology

MEMS Meister

Personnel who understandcutting-edge production technologies(MEMS, fine nanoprocessing)and can lead the manufacturing workplace
by not only handling advanced
equipment operation but improving
the equipment as well

Step-up policies- On-the-job training- Company in-house
MEMS training andcourses- Study groups /seminars- Joint industry-academic research- Collection andteaching of
knowledge fromdifferent fields
Hiring of seniorcitizens
by companies(review ofretirement system)

Step-up
Step-up
Personnel who have a deep specialist
knowledge and technical ability with regard
to MEMS and can use their knowledge
and skill to conduct development
and design.

Personnel training at
industry-academia-government
collaboration centers
MEMS courses for working people

Operator
Personnel who are familiar with MEMS
manufacturing equipment and can handle
advanced equipment operation

Practical MEMS training

Enhancement of MEMS
specialist education
at universities, etc.

Improvement of technical guidance and practical training courses
at national research centers and publicly-run laboratories

6 -1

Establishmentof skill
certification
programMEMS Personnel Training Roadmap
2000

2005

2010

Objectives- Maintaining and strengthening the international competitiveness of the parts industry

2015

2025

- Ensuring safety and peace of mind and helping to build a comfortable society - Creating new lifestyles- Advancement of MEMS manufacturing technologies (high performance, high reliability, low cost) - Establishment of comprehensive micro/nano manufacturing technologies

Market trends

Single function MEMS

Advanced single
function MEMS

Highly integrated MEMS
(highly functional and complex)

Revolutionary MEMS
(nano/bio fusion and autonomous distributed)

Market scale JPY 440 billion yen

Market scale JPY 1.17 trillion yen

Market scale JPY 2.4 trillion yen

Approximately 23,000

Approximately 48,000

MEMS personnel objectives Approximately 9,000

Personnel training

Improvement of environment

Improvementof company
in-house training policy

Improvement of environment to enable in-house personnel to step-up to MEMS training- On-the-job training - In-house MEMS training and courses - Study groups andand seminars - Personnel training through joint industry-academic research

Establishment of MEMS skill certification program- Designated testing organization

Improvement of
personnel training
policy throughindustry-academia
cooperation- Certification program

Expansion of MEMS lectures and training courses for working people- Earning
Earning ofof credits
credits atat graduate
graduateschool
schoolbybyworking
workingpeople
people - -Expansion
Expansionofofpracticalpracticaltraining
training
coursescourses
at atnational
national
research
research
centers
centers
andandpublicly-run
publicly-run
laboratories???
laboratories

Enhancement of MEMS personnel training at industry-academic collaboration centers- Interdisciplinary program

Improvement ofenvironment toenable personnel
in other industries
to easily enter
the MEMS field- Personnel cooperation with different departments
departmen and companies - Awarding of degrees

Utilization of senior citizen personnel- "Senior citizen personnel bank"- MEMS prototyping consultants / coordinators
coordinInfrastructure improvement in MEMS fields- Systems infrastructure (to promote dissemination of MemsONE)- Construction / upgrading of knowledge database (use of MemsPedia)

Expansion of MEMS internships- Establishment of MEMS program

Moreover, to accommodate the expansion of the
MEMS market, it is essential to upgrade MEMS foundry
services to make it easy for even companies that do notpossess manufacturing equipment to actively engage in
MEMS business. For this reason, a study of the current
state of MEMS foundry business in Japan was also
conducted. This study determined that the scale of useof MEMS foundries in Japan is currently estimated at
approximately JPY 35 billion yen, and this is expected
to increase each year along with the expansion of thescale of the MEMS market. However, the study made it
clear that shortened durations and cost reductions are
the biggest issues that must be resolved to enable the
MEMS applications needed for creating new markets tobe prototyped and verified as quickly as possible.
Moreover, as overseas dedicated MEMS foundrycompanies are beginning to appear, the Micromachine
Center put together a proposal emphasizing that there
is an urgent need in Japan as well to upgrade MEMS
foundry functions, through the creation of entities suchas a MEMS joint prototyping center with MEMS
development and prototyping functions as a mechanism
for producing and supporting MEMS ventures.
The Micromachine Center also conducted a study
for the purpose of establishing a mechanism by which,in cooperation with foundry companies, small andmedium-sized companies and the like with little

knowledge of MEMS manufacturing methods can
submit a request to MEMS foundries and order MEMS
of feasible shapes and sizes created using basic
manufacturing processes. The Center also compiled adraft collection of standard process recipes (readymade processes). The use of these standard process
recipes is expected to reduce the cost of new MEMS
manufacture and shorten deadlines and so on. A study
will be conducted together with the use of theserecipes in MemsONE.
Overview of Draft Collection of Process Recipes
Platform
Device:Piezoelectric
acceleration
sensorDevice:Electrostatic
capacity type
acceleration
sensorDevice:Micromirror
poweredby static
electricity
Device:Piezoelectricpressure
sensor

6 -2

Process
RecipeDeviceStructureSampleMemsONE
emulation

Starting the BEANS ProjectAtsushi Yusa, President, BEANS Laboratory
This month, the Project to Develop Technologies for the
Manufacture of Next-Generation Devices That Fuse Different
Fields – a FY 2008 research and development project of the
Ministry of Economy, Trade and Industry – was initiated. The“next generation devices that fuse different fields” referred toin the project’s title are none other than the Bio & Electromechanical Autonomous Nano Systems (BEANS), therevolutionary devices of the future that the Micromachine
Center has been studying for the past four years. As you know,
BEANS is a concept for the creation of third-generation Micro
Electro Mechanical Systems (MEMS) devices. A committee
chaired by Professor Hiroyuki Fujita of the University of Tokyo
was established and specialists from companies, universities
and national reserch institute that are supporting members of
the BEANS Research Center have pooled their knowledge andexpertise to create these devices.
I am most gratified that BEANS have been selected as oneof the candidates for application of the device manufacturing
technologies that is the aim of the new project. I salute theenthusiasm and the efforts of all of you who have contributed
their energies to involvement in BEANS research up to now.
Thanks to your hard work, the Micromachine Center has been
selected by the Ministry of Economy, Trade and Industry as theresearch promotion entity for the new project. In response, theBEANS Laboratory has been set up within the Micromachine
Center to plan and propose new projects and conduct researchpromotion activities. This paper will provide an overview of the
BEANS Laboratory and will cover its research management
policy, research areas and research promotion organization inthat order.

integration of technologies in different fields, combining MEMS
(which is the title of one of the research and development
projects) with nanotechnology and biotechnology. The projectwill also work to establish ties between state-of-the-art
technology centers and integrate company management with
cutting-edge research. Another goal is to accomplish theheretofore difficult task of establishing a framework for fusion
research. Moreover, since the research areas are precompetitive research areas, a knowledge database containing
both academic achievements and test data will be compiled tomake the achievements and data widely available. In addition,
steps will be taken to make licenses widely available for thepatents and other intellectual property rights that have beenacquired, to ensure that the research achievements contributeto the growth of domestic industries and the creation of new
businesses. In addition, as personnel training and development
is also considered to be of crucial importance, research
management that integrates industry and academia will be
conducted and an effort will be made to create interchange
between young university researchers and company engineers.
For this purpose, many managers that previously worked atcompanies and have experience in research management will
be recruited to accelerate and effectively promote research.

2) Research Areas
Fig.2 shows the research areas planned for implementation
at the BEANS Laboratory. Under this Basic Project Plan, there
will be three major research areas:(1) Bio and organic materials fusion process technologies(2) 3-dimensional structure formation process
technologies(3) Micro/nanostructure large-area / continuous
manufacturing processes
To these will be added one common research area: thecompiling of a database of manufacturing technology
development knowledge.

1) Research Management Policy
A basic policy for research management has been
established in order to guide the project to success and ensurethat its research achievements provide wide-ranging benefits tosociety. (Fig.1). The watchwords for this policy are“integration” and “open.” The goal of the project is the

INTE
GR
AT
EG
RA
T ED
ED

OPEN

Coordination of research centers
and technologies

Open access to technologies
and facilities

Three leading-edge research centers
Three research and development topics

Collection of technical data in pre-competitive domains
Use of both in-house and outside research facilities

Integration of technologies
in other fields

Open access to achievements

18 companies, 11 universities
and 2 research centers participating
Electricity/electronics, machine,materials, bio/medical/pharmaceuticalAchievement licensing
Construction of knowledge databasethat integrates different fields

Integration of company management
and state-of-the-art technology

Open access to personnel

Top management from the corporate world
Leading researchers in cutting-edge fields

Appointment of young person to serve as Center director
Personnel interchange among research centers

Fig 1 BEANS Research Center Policy: Integrated and Open

7

Research Topic 1 Bio and organic materials fusion process technologies(1) Process technologies for nano-interface fusion(2) Process technologies for the formation of bio and organic material higher-order structures

Research Topic 2 3-dimensional structure formation process technologies(1) Ultra-low damage / high-density three-dimensional nanostructure formation technologies(2) Three-dimensional nanostructure formation technologies for integrating different types of functions(Note: implemented by the Institute(3) Three-dimensional nanostructure formation technologies for use in aerospace applications
for Unmanned Space Experiment Free Flyer)

Research Topic 3 Micro/nanostructure large-area / continuous manufacturing processes(1) Process technologies for the formation of high-grade nanofunction membranes over a large area in non-vacuum environments(2) Process technologies for continuous fine processing / integration of fibrous substrates

Research Topic 4 Creation of a knowledge database for next-generation device manufacturing technologies that integrate different fields
Fig 2 Research Topics Studied by the Beans Research Center(1) Bio and organic materials fusion process technologies
The goal in this area is the development of process
technologies for achieving the device functions and mechanisms
needed in next-generation health, medicine and environmental
fields. In addition to the conventional inorganic dry materials
such as silicon, research and development will be conducted forfusion processes that utilize the unique functions of bio andorganic materials such as synthetic organic molecules,
biomolecules, cells, structures, microorganisms and so on. One
example is technologies to enable biological organic materials(such as lipid bilayer membranes, hydrogels and peptide
synthesis) to be handled freely within microsystems.

Macro BEANS
Center (AIST)

ing
tch
re e and etc.
,
ctu
tru ions ling
nos lat de
Na Simu le mo
sca
lti-

(4) Knowledge database mProjec&
ana t nedge
Simulations
gem eds
e
l
ow e
ent
Kn pertis
Researchplanning
s
d
K
e
ex
now
e nt
n
t
e
jec me and management xpe ledg
rtis e &Pro nage
e
ma

yo
ok

Ultra-low damage methods for modification,
arrangement etc. of bio and organic materials
on 3-dimensional nanostructures

Ce n

U s
he Kyu ic m

f us

3(2) ter (3- d② Th D B E
ime e UANnnsi
Sona iversl st
pro
ruc ity ofcestses ure f o Tokyorm
at io )nmu

Knowledge &expertise

BEANS Research Center
Main Research Centerf T ty)NS
EA ty o ersi
e B r si, iv s
L if nive hu Un ateri al(1)(3) Micro/nanostructure large-area / continuous manufacturing
processes
One of the efforts in this area involves the development ofprocess technologies for the continuous manufacture, over alarge area and in non-vacuum environments, of microstructurehigh-grade functional materials for use in electronic devices.
This can be achieved by combining atmospheric pressureplasma equipment with nanomaterial coating technologies andself-assembly technologies. Another effort is the developmentof processing technologies capable of continuously
nanoimprinting or forming functional membranes on glass fibers
and other fibrous substrates. There are also plans to develop
weaving technologies to turn these fibrous substrates into cloth.
This would create an applied technology with wide-ranging
applications for industry.

(T d K anes
ter an nd org rocess
a
p
Ce n
ion
Bio

(2) 3-dimensional structure formation process technologies
As a core technology for BEANS devices, process
technologies will be developed for integrating inorganic andorganic nanostructure materials on silicon, glass or other 3dimensional structures to achieve functions not possible withsilicon alone. The ultra-low damage etching conducted up to
now using neutral particle beams has been developed into amethod of creating 3-dimensional nanostructures that achievesurface smoothness at the atomic layer level, enabling theformation of “bottom up” structures through the self-assemblyof nanomaterials on the surface of three-dimensional
nanostructures. This will make it easy to manufacture terabit
class high-density recorders and ultra-sensitive sensing devices.

Project needs
managementAppli
in s cation
elforg of fle
form anizin xible s
ing g pr heet
, et oce sc.
ss(3) Micro/nanostructure large-area /continuous manufacturing processes

Fig 3 BEANS Research Center: Cooperation with Other Research Centers
research activities of the BEANS Laboratory will be conductedin three separate locations, but the research planning andbudgeting for project areas, personnel allocation and otheraspects of project management will be centralized at the
BEANS Laboratory. Moreover, project management will live up
to the “Fuse Different Fields” part of its name by accelerating
integration and coordination among the three centers withregard to research areas, and by ensuring close cooperation
among these centers. During this fiscal year, 18 companies, 11
universities and 2 research centers are scheduled to participate
in the project, with the involvement of a total of 102 researchers
from companies, universities and research centers. Apart fromthe research achievements, it is project management that willbe the key to the success of the project. As we move forwardwith this project, I hope we can count on the continued
understanding and cooperation of all who are involved in the
BEANS project.

3) Research Promotion Organization
This project will be promoted by the BEANS Laboratory, a
new entity set up within the Micromachine Center. The BEANS
Laboratory will include three research centers, one for eachresearch area: Life BEANS, 3D BEANS and Macro BEANS.
These three research centers will be set up outside theMicromachine Center. Life BEANS will be located at the
University of Tokyo and Kyushu University. 3D BEANS will belocated at the University of Tokyo as well. Macro BEANS will belocated at the National Institute of Advanced Industrial Scienceand Technology (AIST) in Tsukuba (see Fig. 3). In this way, the8Column

Where is MEMS Headed Next?
Tsuneyuki Miyake, Deputy Editor of Nikkei Microdevices, Nikkei Business Publications, Inc.
It is clear that numerous industries involved insemiconductors, electronic parts and components,
cellular telephones, broadcasting, and the like haveinvested human and financial resources in MEMS. Thisis likely because recent advances in MEMS technology
and improvements in the infrastructure (design andproduction) have lowered the entry level required fordeveloping MEMS devices. The continuous massproduction of inkjet heads and mass-production ofdevices used in consumer equipment, such as
accelerometers and silicon microphones (see left
diagram below), are two factors that have facilitatedthe use of MEMS.
Recently companies have begun integrating MEMS ofvarious types from other industries into their own corebusinesses. I think this is particularly embodied bytrends in the semiconductor industry over the past year.
For those readers who have followed MEMS andmicromachines over the years, it must feel that thematerialization of such trends was a long time in coming.
The question is where is MEMS headed next? In
this IT (information technology) age, wireless sensor
networks will be used to incorporate enormous
amounts of information from the real world into thecomputer world, enabling anyone to reference andmanage this information. There have been many
predictions on when this scenario might come about(see right diagram below), but there is great potential
for MEMS contributing to sensors and tiny powersources in these circumstances. Corporate players
who can harvest the added value of MEMS are still
looking forward to this day with anticipation.

When glancing through recent industrial news on
MEMS and micromachines, I noticed that thesetechnologies have drawn attention from various
industries and that there is a trend toward
undertaking MEMS business activities. The following isjust a sample of some of the headlines over the past
six months (all taken from the MEMS International
news Web site at http://techon.nikkeibp.co.jp/MEMS/).
“RFMD Introduces MEMS Switches for Use in
Mobile Phones and Announces Plans to Build a New
Facility” (Nov. 28, 2007), “OMRON to Construct a
200-mm line for MEMS Production” (Dec. 13), “U.S.
Company Technitrol Acquires Denmark-based Sonion”(Jan. 10, 2008), “Wireless Crop-Monitoring Network
Deployed in Vineyards” (Jan. 30), “Mitsumi Show:
Mitsumi Electric Developing a 3-axis Accelerometerwith 2.8 mm per side” (Feb. 21), “ST and Veredus
Market Lab-on-chip for Rapid Detection of Influenza”(Mar. 24), “iSuppli to Conduct Market Research on
MEMS and Solar Cells” (Apr. 7), “NHK Proposes a
New User Interface for TV Remote Controller with
Built-in Motion Sensor” (Apr. 24), “NTT DoCoMo
Invests in MEMS Gyro Startup” (Apr. 30), “TSMC
Announces Full-Entry into MEMS Market” (Apr. 30),
“EPCOS Acquires NXP's RF MEMS Business” (May2), “Toshiba Jointly Develops a DNA Chip for
Monitoring Infectious Disease in Animals” (May 30),and “Toshiba Unveils Technology to Encapsulate
MEMS Devices in Front-end Process” (May 31).

PeriodApplications

1990 -tMEMS built into equipment

tEstablish mass-productiontMEMS devices

tAccelerate low-cost technologies

tIntegrated MEMS

tDevelop standards for productiontMEMS integrated devices

tDeveloping an IP core for MEMS

(inkjet heads, etc.)

2000 -(accelerometers, etc.)

2005 -(devices merging CMOS and LSI, etc.)2010 -

from semiconductor manufacturers

Impact on the MEMS industry

Major players in production
Equipment manufacturers
Automobile manufacturers

and expand production infrastructure

Semiconductor manufacturers
Parts manufacturers
Semiconductor manufacturers
MEMS foundries

processes and advance integration
with LSI production

Silicon/MEMS foundries
Semiconductor manufacturers

functions

Real world information systems
2010s

Application
Start of industry

Personal computers
1980s

Digital consumer electronics
2000s

Leading players

Intel Corp.,
Microsoft Corp.

Apple Inc.,
Matsushita Electric Industrial Co., Ltd. (Panasonic), Google Inc.
Nokia Corp., Sony, etc.

High added value players Intel
Required devices
Microprocessors, DRAM, HDDs

Apple, ARM Ltd.
SoC, flash memory, wireless chips

Google Inc.?
Sensors, wireless chips, tiny power sources
MEMS foundries
MEMS technology

Major infrastructureof industry

Silicon foundries
Miniaturization technologies and their roadmap

9Overseas Trends

Exhibition at Hannover Messe 2008 (April 21 - 25)
The Hannover Messe, the largest industrial products sample fair in Europe, was held in the city of Hannover, Germany forfive days from April 21 through April 25, 2008. The Micromachine Center was one of the exhibitors and worked to publicize
MEMS related research in Japan and industry trends, in cooperation with MEMS Industry Forum members Omron
Corporation, Olympus Corporation, Matsushita Electric Works, Ltd., Mitsubishi Electric Corporation, the New Energy andIndustrial Technology Development Organization (NEDO) and the University of Tokyo. IVAM Microtechnology Network, a
MEMS Industry Forum overseas affiliate, sponsored a “Micro Technology Fair” sub-exhibition at the Hannover Messe. In thespirit of mutual cooperation with the Micromachine Center, IVAM has exhibited at the exhibition since 2006.
Each year a country is designated as the partner country for the Hannover Messe and a variety of events relating to thatcountry are held during the period of the exhibition. Japan was the partner country for this year’s exhibition, and JETRO andthe Ministry of Economy, Trade and Industry played a leading role in coordinating these events. More than double the usual
number of companies and organizations from Japan exhibited at the exhibition and related events were held almost daily.
On April 20, prior to the start of the exhibition, an opening celebration was held at the Hannover Congress Centrum in
Hannover. Welcoming addresses were given by former Prime Minister Shinzo Abe of Japan and current Chancellor Angela
Merkel of Germany. The featured entertainment was a troupe of dancers performing the famous “Awa-odori” folk dance.
This was the third year that the Micromachine Center has exhibited at Hannover Messe. The Center was able to secure alarger exhibition booth than last year, and exhibits from primarily MEMS Industry Forum members presented information
about the MEMS industry in Japan. The exhibits focused on activities to promote industrialization and were divided into
sections according to the following categories

1) Overview of the MEMS Industry Forum

5) MEMS packaging technologies (Matsushita
Electric Works, Ltd.)- Promotional activities (through exhibitions, etc.)- Policy recommendation activities for the planning of national
government projects for next fiscal year
- Participation in NEDO / METI projects, promotional assistance andfollow-up relating to project achievements- Foundry service network activities- Formation of network with universities, research centers, clusters,
academies and other relevant organizations in Japan- Formation of international affiliate network- Low-heat stress wafer level packaging- Multilayer ceramic MID packaging- Video: Introduction to MIPTEC

6) MEMS Foundry (Olympus Corporation)- Features of Olympus foundry- Presentation of equipment and case studies

7) Project development in the optical field(Olympus Corporation)2) Introduction of Micro/Nano 2008
- The 19th Exhibition Micromachine / MEMS
- 14th International Micromachine / Nanotech Symposium- Optical scanner- AFM cantilever- MEMS flap actuator- Exhibition of MEMS scanner samples

3) Development of industrial technologies
through NEDO projects

8) Sensing technologies(Mitsubishi Electric Corporation)- Assistance for development of industrial technologies by means ofindustry-academia-government collaboration- Scenarios for technical and industrial development in MEMS fields
by means of a technical strategy map- Pressure Sensor, Accelerometer, Air Flow Sensor- MEMS Switch, MEMS Package, Switched Capacitor Array- Core processes: bulk micromachining, surface micromachining, 3D
integration

4) Overview of NEDO projects- Overview of Highly Integrated and Complex MEMS (Fine MEMS)
Manufacturing Technology Development Project- Development of selective nanomachine structure formation
technology (University of Tokyo)- Demonstration (device cross-sectional structure model currently
under development)

9) Project development in the telecommunications
field (Omron Corporation)- Features of MEMS Microphone- Applications- MEMS microdemo

On the first day of the fair, Tamotsu Nomakuchi, director of the Micromachine Center visited the venue and expressedwords of appreciation to all of the exhibitors for their hard work. He also had informal talks with Mr. Kleikens representing
IVAM Microtechnology Network, a sponsor of the fair and a MEMS Industry Forum affiliate. On April 24, the economic
minister from the North Rhine-Westphalia (NRW) province of Germany visited the booth and discussed the status of MEMS
industrialization promotion activities in Japan and Japanese industry expectations with respect to IVAM’s activities.

Mr. Kleikens of iVAM and MMC
Director Nomakuchi

Business negotiations

Environment Minister from NRW
Province visits the MMC booth

At the Forum held at the Microtechnology Fair venue, the second day of the exhibition (April 22) was designated Japan
Day. The day’s events opened with words of welcome from MMC Executive Director Keiichi Aoyagi, and this was followed byten presentations (listed below) from both Japan and Germany regarding technical developments and project development.
Next year, the Hannover Messe will be held April 20 - 24, 2009. Korea will be the partner country.

10

14th World Micromachine Summit (April 30 - May 3)
The
14 t hWorld
Micromachine Summit washeld for four days fromThursday, April 30 throughSaturday, May 3, 2008 at
the Hotel Riviera (DynastyHall) in Daejeon, Korea.
Since
the
first
Micromachine Summit washeld in 1995 in Kyoto, thesummit has been held eachyear in a different country
chosen from among thosewishing to act as host. This
year’s 14th summit featured
the addition of the Iberian
region and Romania, making
a total of 18 countries orregions (Australia, theBenelux countries, Canada,
China, the EC, France,
Germany, the Iberian
region, India, Japan, Korea,
the Mediterranean region, the Nordic region, Romania,
Singapore, Switzerland, Taiwan and the UnitedStates). 56 representatives and 43 observers from 26of these nations and regions attended for a total of 99
participants.
This year’s summit began with a review of thesituation in each country or region, presented by thechief representative from that country/region. Thiswas followed by presentations from 32 representatives
on the status of activities in each region and future
prospects. The presentations were divided into fivecategories:(1) Technical overview(2) Cutting-edge technologies(3) Market standardization and industrialization trends(4) Education and technology platforms(5) Foundry and cluster networks
The chief delegate from Japan was Professor Isao
Shimoyama of the University of Tokyo. There were 10
participants in all including observers. Threepresentations were made by the Japanese delegation.
In the country/region review, Professor Shimoyama
of Tokyo University gave a presentation covering theposition of MEMS in Japan’s science and technology
policy, a technical strategy map for the MEMS
industry, a roadmap for standardization, the role andactivities of the MEMS Industry Forum, MemsONE,
Fine MEMS, BEANS and other aspects of the status ofnational project promotion in Japan. Kazuo Kyuma,
senior managing officer at Mitsubishi Electric
Corporation, presented an overview of the nextgeneration BEANS project. Koichi Karaki, executive
officer at Olympus Corporation, presented an
introduction of MEMS technologies.

At this year’s summit, the presentations from eachcountry regarding the current state of MEMS
technology covered such matters as the constructionof a new 8” line and accelerated mass production that
includes CMOS MEMS. With regard to next-generation
MEMS technologies, the presentations focused on thecreation of new processes and devices throughnanotechnology, biotechnology and the fusing ofdifferent fields. It was clear from the presentations
that countries around the world are moving in roughly
the same direction in their pursuit of
micro/nanotechnology research and development.
Moreover, the emergence of MEMS developing nations
and regions such as India, Iberia and China thanks toactive support by national and local governments inthese nations and regions was also noteworthy.
Technical tours were conducted on the first andfourth days of the summit, before and after the twoday conference. Tour participants visited LG
Electronics Institute of Technology, Samsung ElectroMechanics, the Korea Institute of Machinery &Materials(KIMM),
theElectronics
andTelecommunications Research Institute (ETRI), theKorea Research Institute of Bioscience andBiotechnology (KRIBB), and National Nanofab.
Next year’s summit will be held in Edmunton,
Canada May 5 - 8, 2009.
The World Micromachine Summit is expected tocontinue to grow in influence as a forum forinternational interchange relating to MEMS andnanotechnology. The Micromachine Center hopes that
this summit will continue to prove valuable to people
around the world.

11

Okmetic K.K.
Sunrise Mita 8F
3-16-12, Shiba
Minato-ku, Tokyo 105-0014
Tel. +81-3-3798-1400
Fax +81-3-3798-1402

Members’ Profiles

Okmetic Oyj
1. Okmetic in general

Cavity SOI advantages

Okmetic is the world’s leading supplier of silicon wafers
for high-performance MEMS sensor manufacturing. We haveacted on the MEMS-market for over twenty years and inJapan since late 1980s.
Okmetic has a global
customer base and sales
network, productions plants
in Finland and the US, andcontract manufacturers inJapan and in China.
Okmetic K.K. in Tokyo
serves our Japanese Okmetic’s solution is our 100200 mm SOI product range withcustomers and gives preprocessed structures
technical support. Our teamis ready to respond to the growing demand for MEMS wafers
in Japan.

1. More freedom in element design.
2. Simplified manufacturing process
3. Improved electrical and mechanical properties
4. Integration of IC and MEMS process possible
5. Yield and material responsibilities at material supplier
Okmetic G-SOI (Gettered SOI) wafers support full CMOSMEMS integration. Their enhanced gettering performanceensures effective binding of impurities to guarantee
maximized yield and design flexibility in CMOS processes.

Key figures

2. Products designed for MEMS
sensor manufacturing(1 Jan – 31 Dec 2007 1,000 euro)
Net sales
Operating profit

64,652
7,121

11
By
developing
more % of net sales
357
intelligent substrates a silicon Personnel at the end of the period
wafer supplier can help to save costs and streamline
microsystem fabrication. Okmetic BSOI (Bonded Silicon on
Insulator) product family includes enhanced SOI productsthat meet the most demanding customer requirements. They
enable the development of smaller devices, while allowing
for greater freedom of design and improved yield. We supply
all wafer sizes from 100 mm to 200 mm.
Okmetic BSOI wafers improve cost-efficiency acrossprocesses and boost
performance. Together
withmodernmanufacturing processes(e.g. DRIE) they provide
new opportunities forinnovation
andexceptional design. For
the most demanding Device layer thickness variation (9points measurements) of 150 mm
designs, Okmetic 0.3-SOI SOI wafer.
wafers with tighter
device layer thickness tolerance offers even more benefits interms of device performance.
Okmetic C-SOI (Cavity SOI) is a bonded SOI wafer withpre-etched cavities. Embedded under the thin silicondiaphragm, these cavities take device design to the nextlevel. Our C-SOI solutions are optimized to fit the customer’s
device design.

Gettered SOI advantages
1. Proven gettering ability
2. Better gate oxide integrity than in standard BSOI wafers
3. Compatible with CMOS processing on thick SOI
4. No impact on active layer thickness uniformity orother BSOI characteristics

Epitaxial wafers
Okmetic epitaxial wafers offer superior layer uniformity
and surface quality, as well as ideal epi thickness. In
anisotropic wet etching of silicon, Okmetic epitaxial layers canbe used as an etch stop in both electrochemical (N/P interface)and chemical (stress-free Ge co-doped P++) etch processes.

Double and single side polished wafers
Okmetic SSP (single side polished) and DSP (doubleside polished) wafers both feature outstanding offorientation accuracy and MEMS-optimized crystal quality. In
addition, our DSP wafers boast superior flatness andthickness variation that enable accurate bulk
micromachining and double-sided lithography.
DSP wafers are also widely used as cap wafers in wafer
level packaging.

Center point thickness variation Total thickness variation (TTV) ofof 150 mm DSP wafer.
150 mm ultra flat DSP wafer.

Boost performance with MEMS-optimized silicon wafers
Okmetic’s way of conducting business is based onmonitoring and analyzing the future needs and material
solutions of our customers industries. With the widest
product selection on the market, we offer silicon solutions
for the rapidly growing and evolving MEMS market.
For more information please contact Okmetic K.K. andvisit www.okmetic.com

MICRONANO No. 64
MICRONANO is published quarterly by Micromachine Center (MMC) to promote the international exchange of
information related to micromachines, R&D and other technical topics, and is circulated free of change. Please send
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