INTRODUCTION
On behalf of the IEEE Electronic Components and ECTC Program
Committee, it is my pleasure to invite you to submit an abstract for theanniversary 75th ECTC, to be held May 27–30, 2025, at the Gaylord
Texan Resort and Convention Center in Dallas, Texas. This premierinternational conference, sponsored by the IEEE Electronics Packaging
Society (EPS), covers a broad range of topics, including components,
materials, assembly, reliability, modeling, interconnect design andtechnology, device and system packaging, heterogeneous integration,
wafer level packaging, photonics and optoelectronics, IoT, 5G, quantum computing and systems,
2.5D and 3D integration technology, and other emerging technologies in electronics packaging.
The ECTC Program Committee consists of over 200 experts from diverse technical fields and isdedicated to creating an engaging technical program. The 74th ECTC was an outstanding success,setting new records with 704 abstract submissions, a record number of exhibitors, and 2,005
registered attendees from 26 countries. It featured 383 technical papers presented in 36 oral
sessions and five interactive sessions, including a session dedicated to students. Additionally, ninespecial sessions covered a variety of advanced packaging topics, such as industry-government coinvestments in North America, Asia, and Europe, advanced metrology, thermal management for
AI/ML applications, RF packaging for communication and sensing, the Young Professional Network
Panel, challenges of chiplets, workforce diversity, and a brand-new session on Emerging Start-Ups
for Advanced Packaging. On Tuesday, the first full-day of the conference we held a Heterogeneous
Integration Roadmap (HIR) workshop.

MAJOR TOPICS
Highly rated abstracts are accepted for presentation at the ECTC conference. During abstract
submission, authors are asked to choose the subcommittees whose topic areas best fit theirabstracts. Please select two different program subcommittees in order of preference that should
evaluate your submission for acceptance. Abstracts are rated according to the included original andpreviously unpublished, non-confidential, and non-commercial information on new developments,
technology, and knowledge in the areas including, but not limited to, those given in the next ten
paragraphs, one for each of ECTC’s technical subcommittees.
Packaging Technologies: 2.XD/3D architectures/designs for energy efficient HPC, C2C links,
structures, thermal solutions, and methods & processes; heterogeneous (chiplet) integration for
2.5D, 3D-IC for AI, neural nets, HBM, CPU, GPU, ASIC, and CPO; silicon, glass, diamond & organicinterposer and advanced package technology; dual-Damascene Cu, Cu TSV, hybrid bonding, andbackside power; embedded die, bridge, and passives; flexible, advanced substrates & modules; fanout wafer and panel level packaging, advanced flip-chip, SiP, CSP, PoP; RF, wireless, MEMS, Sensors &loT, automotive, wireless power and power electronics; SiC, GaN, PMIC, SPS; bio, medical, flexible,
wearable & extreme environments packaging.
Applied Reliability: Reliability of 2D, 2.5D, Si bridge, 3D, chiplets, WLCSP, FOWLP, FOPLP &heterogeneous integration and co-packaged optics (CPO); interconnect reliability in micro-bump,
micro-pillar, Cu-pillar, TSV, RDL, stacked-die, hybrid-bond, flip chip & wire bonded packages, novel
reliability test methods, life models, FA techniques & materials characterization, component andboard level reliability in computing, HPC, mobile, networking, automotive, power electronics, harsh/hi-temp environments, IoT, sensors, AI, autonomous vehicles, medical, wearable electronics, LEDs,
displays and memory; reliability and test methods for thermal materials (TIM) and reliability related toliquid cooling and immersion cooling.
Assembly & Manufacturing Technology: Assembly and manufacturing challenges for newmarkets; die bonding methods and process challenges: D2D, D2W, W2W; wafer level process/materials technologies; die and package singulation manufacturing; new & next generation substrates;
smart factory/manufacturing; assembly related test/yield hardware development/improvement;
integrating advanced thermal solutions in manufacturing: design/performance, integrating solutions,
thermal materials, low stress/high thermal; process advancements/yield enhancements; costof inspection, sampling, metrology, new processes for fine RDL, small via fabrication, transfer/compression/injection mold; heterogeneous integration and process: flip chip, chiplets, 3D stacking,bridge technology, large body, warpage management; shielding/protection technologies andmanufacturing and market requirements.
Electrical Design & Analysis: 5G/6G, IoT, cloud computing, autonomous vehicles, AI/ML; antennas,
sensors, power transfer, wired/wireless communications, RF to THz; multiphysics/multiscale modeling& characterization of interconnects, modules, components, and systems; chiplet, heterogeneous
integration, chip-to-chip, die-to-die, SiP/MCM/system co-design (chip/package/board), UCIe, HBM/
HPC; opto-electronic (OE) hybrid integration, analog packaging, power electronics modeling/
characterization; high-speed/frequency (RF, mm-wave, THz) signal integrity, power integrity, and EMI/
EMC.
Emerging Technologies: Packaging for quantum computing and other cryogenic applications;metrology for advanced packaging and emerging technologies; AI in electronics packaging and its
applications; challenges in hardware security; AI electronics packaging and its applications; power

On Wednesday morning, Professor Keren Bergman delivered an excellent plenary talk on Petascale
Photonic Chip Connectivity for Energy-Efficient AI Computing. The ECTC Exhibits showcased
products and services from 128 companies, with invaluable support from our generous sponsors.
The 75th ECTC will continue with the same tradition of being the premium venue to showcase all
the latest developments in the electronic components industry where packaging has become a way
to achieve device and system performance scaling.
In 2025 we will celebrate the 75th anniversary of the ECTC. The 75th ECTC will include Special
Sessions such as an HIR workshop and, concurrently, a diverse array of Professional Development
Courses (PDCs) on the first day of the conference (Tuesday). Esteemed leaders in their respective
fields will curate the Special Sessions, providing high-level introductions into the cutting-edge topics
within electronics packaging. Renowned experts will conduct the PDCs, enabling participants to
expand their technical expertise. During the following three days, six parallel technical sessions
will offer the most recent research and advancements in electronics packaging R&D, along withspecial panel discussions that highlight industry trends and best practices. Complementing thetechnical program, the ECTC Exhibits will feature leading companies specializing in electronic
components, materials, and packaging, showcasing their latest innovations. The anniversary 75th
ECTC will continue with the same tradition of being the premium venue to showcase all the latest
developments in the electronic components industry where packaging has become a way to achieve
device and system performance scaling.
On behalf of the ECTC Program Committee, I look forward to seeing you at the 75th anniversaryof ECTC, during May 27–30, 2025, at the Gaylord Texan Resort and Convention Center in Dallas,
Texas.
Przemyslaw Gromala, 75th ECTC Program Chairelectronics and energy storage; MEMS & NEMS; emerging, novel and unique flexible/stretchable/
wearable hybrid electronics, medical devices and bioelectronics; additive, hybrid, nano, and smart
manufacturing for electronics packaging; green and sustainable electronics, net zero strategy/
technology; digital twins.
Interconnections: Interconnects for chiplets, heterogeneous integration, hybrid bonding, C2W,
W2W, fan-out, panel-level, TSV, TGV; interconnects for 2.5D/3D, Si/glass/organic interposers, finepitch/multi-layer RDL, SiP, wafer-level system integration; interconnects for thermo-compression/laser assisted/transient liquid phase bonding, low temperature solder, flip-chip, micro-bump, Cu pillar,
wirebond, Al ribbon bond; printable interconnects, flexible interconnect, quantum interconnects,
optical interconnects, interconnects for SiC/GaN or WBG; interconnection materials, chemistries,
metrology, characterization and reliability; conductive/non-conductive adhesives, ACF, underfill,molding compounds; chiplet interconnect design and validation, UCIe/BoW/etc. standards; thermalinterface materials, thermal/mechanical/electrical tests and reliability.
Materials & Processing: Advanced materials and processes for hybrid bonding, fan-out, Siinterposer, 2.5D/3D, chiplets, HI, TSV; advanced materials and processes for thermal and mechanicalimprovement for packaging; wafer & panel level packaging materials and process advancements;
dielectrics and underfills, molding compounds, thermal interface materials; harsh environment
resistant materials; temporary wafer bond/debond materials and processes, TCB and hybrid bonding,conductive adhesives; emerging electronic materials and processes; novel solder metallurgies; novel
materials and processes for high density interconnect.
Photonics: Photonic components packaging for computing, communications, data processing,mobility, healthcare, green energy photonics, agriculture, horticulture, food, environmental, climate
and atmosphere monitoring, space, automobile, underwater, industrial, defense, process integration,co-packaging (photonics, electronics, and laser integration), free space optics, microscopy andadvanced spectroscopy, 3D printing of micro-optical components for packaging, assembly andmanufacturing; packaging for the quantum photonics world; packaging of new photonics materials;
optical characterization of packaging components; equipment and tools for photonics packaging;detachable fiber array unit; ultra-low power photonics and materials; heterogeneous materials;
quantum dots; meta-surfaces and meta-materials.
Thermal/Mechanical Simulation & Characterization: Thermal/mechanical simulation andcharacterization at component, board, and system levels for all packaging technologies; reliability
related modeling including fracture mechanics, fatigue, electromigration, warpage, delamination,
moisture, drop, shock and vibration, and modeling for harsh environments (thermal, chemical,etc.); material constitutive relations; chip-package interaction for heterogeneous integration, wafer
fabrication and package assembly process related modeling; novel modeling techniques including
multi-scale physics, co-design approaches; quantum computing; measurement methodologies,
characterization and correlations, model order reduction, sensitivity analysis, optimization, statisticalanalysis; application of artificial intelligence on modeling, characterization, and digital twins; credible
simulations; CFD simulation.
Interactive Presentations: Abstracts may be submitted related to any of the nine major programcommittee topics. Interactive presentations of technical papers are highly encouraged at ECTC.
They allow for significant interaction between the presenter and attendees, which is especially suitedfor material that benefits from more explanation than is practical in oral presentations. Interactive
presentation session papers are published and archived in equal merit with the other ECTC
conference papers.

Visit the ECTC website (www.ectc.net) for additional conference information.

Abstract and Manuscript Submission

ECTC Exhibits

As the Program Chair of the 75th ECTC, I extend a warm invitation for you to electronicallysubmit your abstract at www.ectc.net, utilizing the “Author Info” tab. Your abstract should
provide comprehensive details of your proposed technical paper, including findings and results,
within a maximum limit of 700 words. Additionally, please include a concise paragraph, notexceeding 50 words, highlighting the novelty of your work. You also have the option to submit
a supporting figure or table if desired. The deadline for abstract submission is October 7, 2024.

We invite you to be part of the ECTC Exhibits and showcase your products and services toengineers and managers from all areas of the microelectronics packaging industry. Over 2,000
attendees are expected for the 75th ECTC, representing companies from around the world.

During the submission process, please ensure to provide the affiliation, contact telephone
number, and e-mail address for all co-authors in the desired order. Additionally, include themailing address of the contact author and specify the name of the presenting author. Please
note that only co-authors are permitted to serve as presenters at ECTC. Submitted abstracts
become the property of ECTC, and ECTC reserves the right to publish the abstracts
accepted for the conference. ECTC also reserves the right to prohibit, limit, or decline any
editing of submitted abstracts.
Prior to all submissions, please ensure that you have received the necessary clearance frommanagement and co-authors, where applicable. By December 9, 2024, authors are notified ofabstract acceptance along with instructions for manuscript preparation and paper presentation.
Contact authors of accepted abstracts are kindly requested to confirm the acceptance, whichsignifies the commitment to submit the manuscript within the specified timeframe and present
the paper in-person as an author on-site at the conference. The Program Committee may,at their discretion, consider submitted abstracts for inclusion in the Interactive Presentation
sessions.
Upon acceptance of your abstract, please submit your manuscript (4-8 full pages) for review
by February 21, 2025. Manuscripts not submitted by this date may be removed andreplaced in the final program at the discretion of the Program Committee. To be
included in the Conference Proceedings, your abstract must be accepted and your manuscript
must fulfill all requirements, including timely response to reviewer requests following themanuscript submission deadline. Our Technical Committee members conduct a thoroughreview process to ensure content quality and scientific accuracy for all accepted manuscripts.
All abstracts and manuscripts must be original, previously unpublished, devoid ofcommercial content, and non-confidential. It is essential that your manuscript adheresto the specified ECTC format and upholds the principles of academic integrity by avoiding
any instances of plagiarism and excessive redundancy (use of previously published work). All
submitted manuscripts are checked for such plagiarism utilizing the IEEE CrossCheck service.
Similar to last year, first-time leading authors of successfully presented papers have theopportunity to participate in a special raffle prize drawing during the conference. Furthermore,
following the conference, a collection of outstanding papers may be invited (with appropriate
revisions) for peer-reviewed publication in special sections of the prestigious IEEE Transactions
on Components, Packaging, and Manufacturing Technology.
If you have any questions, contact:
Przemyslaw Gromala, 75th ECTC Program Chair
E-mail: pgromala@ieee.org

Special Paper Recognition
Best Paper Award: Each year the ECTC selects the best paper whose first author receives
an ECTC personalized certificate and a check for $3,000.
Best Interactive Presentation Award: Each year the ECTC selects the best Interactive
Presentation paper whose first author receives an ECTC personalized certificate and a check
for $2,000.
Outstanding Paper Award: An outstanding conference paper is also selected for special
recognition by the ECTC. The first author receives a personalized certificate and a check for$2,000.
Outstanding Interactive Presentation Award: An outstanding Interactive Presentation
paper is also selected for special recognition by the ECTC. The first author receives apersonalized certificate and a check for $1,500.
Intel Best Student Paper Awards: Intel Corporation is sponsoring awards for the best
papers submitted and presented by a student at ECTC. The winning student will be presented
with a certificate and a check for $2,500 (Best Student Paper) or $1,500 (Outstanding Student
Paper).

Exhibit Dates: May 28–29, 2025
For more information, contact:
Sam Karikalan, ECTC Exhibits Chair
Phone: +1-949-926-7296
E-mail : samkarikalan@ieee.org; exhibits@ectc.net
The 2025 exhibit electronic application form link and exhibit information brochure will be
posted online at www.ectc.net under the “Exhibits” section in August 2024. Prospective
exhibitors should fill out an application via the form link to start the process of reserving an
exhibit space for 2025. Please contact Sam Karikalan at samkarikalan@ieee.org for more
information or with any questions.

Call for Professional Development Courses
Proposals are solicited from individuals interested in teaching educational, four-hour long
Professional Development Courses (PDCs) on topics described on the previous page. Fromthe proposals received, up to 16 PDCs will be selected for offering at the 75th ECTC on
Tuesday, May 27, 2025. Each selected course will be given a minimum honorarium of $1,500.
In addition, instructors of the selected courses will be offered the speaker discount rate forthe conference. Attendees of the PDCs will be offered Continuing Education Units (CEUs)
or Professional Development Hours (PDHs). These CEUs and PDHs are recognized by
employers as a formal measure of participation and attendance in “noncredit” self-study
courses, tutorials, symposia, and workshops.
Using the format “Course Objectives, Course Outline, Who Should Attend,” 200-word
proposals must be submitted via the ECTC website at www.ectc.net by October 7, 2025.
Authors will be notified of course acceptance with instructions by December 9, 2025. If you
have any questions, contact:
Kitty Pearsall, ECTC Professional Development Courses Chair
Boss Precision, Inc.
E-mail: kitty.pearsall@gmail.com

IEEE EPS Society Travel Grant Program
IEEE EPS is pleased to continue the IEEE EPS Travel Grant Program for the 75th ECTC. The
goals of this award are to foster maximum student participation in ECTC and to recognize
students with superior ECTC papers. We encourage all student authors to apply for thisprestigious grant that will allow you to participate fully in the premier conference for electronic
packaging.
Description: Grants are available to apply towards actual travel expenses, including airfare,
hotel, and meals. Grants will be awarded competitively, based on abstracts submitted by
student authors. The student who is named as the primary author of each winning abstract
will receive a travel grant.
Eligibility: The competition is open to all full-time graduate students enrolled at an accredited
institution in a program of study within the scope of ECTC. The student must be listed as theprimary author on the abstract. A maximum of two authors (one per paper) from any one
institution will receive a travel grant.
Application Process: To apply, check the “IEEE EPS Society Travel Grant” box in the“Awards” section of the online abstract submission form. Pre-selected abstracts based ontechnical committee scores will be requested to submit an extended abstract.

Intel Student Paper Awards
Intel Corporation is sponsoring awards for the best paper and an outstanding paper
submitted, first authored, and presented by a student at the ECTC. The winning student will
be presented with a certificate and a check for $2,500 for Best Student Paper and $1,500 for
Outstanding Student Paper.

Sponsorship Opportunities to Enhance Your Presence at ECTC

Eligibility: To be considered for the award, the student must be a full-time student for at least
one semester after the conference conclusion. The student must be the lead author (contact
author and first author) and present the paper at the upcoming conference. Finalists will be
determined by a review of the completed manuscripts by the judging committee. Manuscripts
will be reviewed for relevance to the competition topics, technical content, and originality.

ECTC offers many unique sponsorship opportunities that provide highly visible exposure foryour company. Additional information is available at www.ectc.net under “Sponsors”. Pleasecontact:

The author of the best and the outstanding student paper will be notified after the conference
and must submit an affidavit from the student’s faculty advisor certifying that the student
meets the eligibility requirements.

Alan Huffman, ECTC Sponsorship Chair
Phone: +1-336-380-5124
E-mail: alan.huffman@ieee.org; sponsorship@ectc.net

Application Process: To enter the Intel Student Paper Awards competition, please checkthe “Intel Best Student Paper Award” box in the “Awards” section of the online abstract
submission form.

Texas Instruments Outstanding Student Interactive Presentation Award: Texas
Instruments is sponsoring an award for the best student Interactive Presentation at ECTC. The
winning student will be presented with a certificate and a check for $1,000.

2025 Executive Committee
General Chair
Florian Herrault
PseudolithIC, Inc.
floherrault@gmail.com
Vice-General Chair
Michael Mayer
University of Waterloo
mmayer@uwaterloo.ca
Program Chair
Przemyslaw Gromala
Robert Bosch GmbHpgromala@ieee.org
Assistant Program Chair
Bora Baloglu
Intel Corporation
borabal@ieee.org
Jr. Past General Chair ECTC
Karlheinz BockTU Dresden
karlheinz.bock@tu-dresden.de
Sr. Past General Chair ECTC
Ibrahim Guven
Virginia Commonwealth University
iguven@vcu.edu
Sponsorship Chair
Alan Huffman
SkyWater Technology
alan.huffman@ieee.org
Finance Chair
Patrick Thompson
Texas Instruments, Inc.
patrick.thompson@ti.com
Publications Chair
Henning BraunischIntel Corporation
braunisch@ieee.org
Publicity Chair
Eric Perfecto
IBM Researcheric.perfecto.us@ieee.org
Treasurer
Tom Reynolds
T3 Group LLC
t.reynolds@ieee.org
Exhibits Chair
Sam Karikalan
Exhibits Chair
Broadcom Limitedsamkarikalan@ieee.org
Web Administrator
Tanja Braun
Fraunhofer IZM
tanja.braun@izm.fraunhofer.deProfessional Development Course Chair
Kitty Pearsall
Boss Precision, Inc.
kitty.pearsall@gmail.com
Conference Management
Lisa Renzi Ragar
Renzi & Company, Inc.
lrenzi@renziandco.com
EPS Representative
Annette Teng
AIM Photonics
ateng@ny-creates.org

2025 Program Committee
Applied Reliability
Chair
Vikas Gupta
ASE US, Incgvikas.gupta@outlook.com
Assistant Chair
Sandy Klengel
Fraunhofer Institute for Microstructure ofMaterials and Systems
sandy.klengel@imws.fraunhofer.de
Seung-Hyun Chae
SK Hynix
seunghyun1.chae@sk.com
Tz-Cheng Chiu
National Cheng Kung University
tcchiu@mail.ncku.edu.tw
Deepak Goyal
Intel Corporation
deepak.goyal@intel.com
Nokibul Islam
JCET Groupnokibul.islam@jcetglobal.com
Choong-Un Kim
The University of Texas at Arlington
choongun@uta.edu
Tae-Kyu Lee
Cisco Systems, Inc.
taeklee@cisco.com
Yan LiSamsung Semiconductor Inc.
yan.a.li@samusung.com
Pilin LiuIntel Corporation
pilin.liu@intel.com
Varughese Mathew
NXP Semiconductors
varughese.mathew@nxp.com
Keith Newman
AMDkeith.newman@amd.com
Donna M. Noctor
Nokia
donna.noctor@nokia.com
S. B. Park
Binghamton University
sbpark@binghamton.edu
Scott Savage
Medtronic Microelectronics Centerscott.savage@medtronic.com
Jeffrey Suhling
Auburn University
jsuhling@auburn.edu
Paul Tiner
Texas Instruments
p-tiner@ti.com
Pei-Haw Tsao
Mediatekph.tsao@mediatek.com
Dongji Xie
NVIDIA Corporation
dongjix@nvidia.com
Assembly & Manufacturing Technology
Chair
Paul Houston
Engentpaul.houston@engentaat.com
Assistant Chair
Christo Bojkov
cbojkov.ectc@gmail.com
Sai Ankireddi
Maxim Integrated
sai.ankireddi@alumni.purdue.edu
Pascale Gagnon
IBM Canada
pgagnon@ca.ibm.com
Mark Gerber
Advanced Semiconductor Engineering, Inc.
mark.gerber@aseus.com
Omkar Gupte
AMD
Omkar.Gupte@amd.com
Timo Henttonen
Microsoft
timo.henttonen@microsoft.com
Habib Hichri
Ajinomoto Fine-Techno USA Corporation
hichrih@ajiusa.com
Li Jiang
Texas Instruments
l-jiang1@ti.com

Zia Karim
Yield Engineering Systems
zkarim@yieldengineering.com
Wei KohPacrim Technology
kohmail@gmail.com
Siddarth Krishnan
Applied Materials
sidkris@gmail.com
Wenhao (Eric) LiIntel Corporation
wenhao.li@intel.com
Venkata Mokkapati
AT&S
v.mokkapati@ats.net
Jae-Woong Nah
IBM Corporation
jnah@us.ibm.com
Valerie Oberson
IBM Canada Ltd.
voberson@ca.ibm.com
Jason Rouse
Taiyo America, Inc.
jhrouse@taiyo-america.com
A R Nazmus Sakib
Renesassakib.arnazmus@gmail.com
Andy Tseng
Qualcomm Technologies, Inc.
andytseng2000@yahoo.com
Jobert Van Eisden
ATOTECH USA LLC.
Jobert.van-Eisden@atotech.com
Jan Vardaman
TechSearch International
jan@techsearchinc.com
Shaw Fong WongIntel Corporation
shaw.fong.wong@intel.com
Jin Yang
Samsung Electronics
jin1.yang@ieee.org
Cong Zhao
Metazhaocong@meta.com
Ralph Zoberbier
Evatec AG
ralph.zoberbier@evatecnet.com
Electrical Design & Analysis
Chair
Jaemin Shin
Qualcomm Technologies, Inc.
jaemins@qti.qualcomm.com
Assistant Chair
Hideki Sasaki
Rapidus Corporation
hideki.sasaki@rapidus.co.jp
Amit P. AgrawalAMDamit.agrawal@amd.com
Kemal Aygun
Intel Corporationkemal.aygun@intel.com
Wendem Beyene
Facebook
wendem@gmail.com
Eric Beyne
IMECeric.beyne@imec.bePrem Chahal
Michigan State University
chahal@msu.edu
Harrison Chang
ASE
harrison_chang@aseglobal.com
Zhaoqing Chen
IBM Corporation
zhaoqing@us.ibm.com
Charles Nan-Cheng Chen
Shanghai Jiao Tong University
hi2018.charles@gmail.com
Craig GawNXP Semiconductor
c.a.gaw@ieee.org
Xiaoxiong (Kevin) Gu
Astrobeam
xgu@ieee.org
Rockwell Hsu
Cisco Systems, Inc.
rohsu@cisco.com
Lianjun Liu
NXP Semiconductor, Inc.
lianjun.liu@NXP.com

Sungwook Moon
Samsung Electronics
sw2013.moon@samsung.com
Rajen M Murugan
Texas Instruments
r-murugan@ti.com
Ivan Ndip
Fraunhofer IZM and Brandenburg University ofTechnology (BTU)
ivan.ndip@izm.fraunhofer.de
P. Markondeya Raj
Florida International University
mpulugur@fiu.edu
Li-Cheng Shen
Universal Scientific Industrial Co. Ltd. (USI)
li-cheng_shen@usiglobal.com
Srikrishna Sitaraman
Marvell Technology
srikrishna.sitaraman@gmail.com
Xiao Sun
IMEC
xiao.sun@imec.be
Manos M. Tentzeris
Georgia Institute of Technology
etentze@ece.gatech.edu
Chuei-Tang Wang
Taiwan Semiconductor Manufacturing
Company (TSMC)
ctwang10492@hotmail.com
Maciej Wojnowski
Infineon Technologies AG
maciej.wojnowski@infineon.com
Yong-Kyu Yoon
University of Florida
ykyoon@ece.ufl.edu
Emerging Technologies
Chair
Tengfei Jiang
University of Central Florida
tengfei.jiang@ucf.edu
Assistant Chair
Xinpei Cao
Henkel Corporation
xinpei.cao@henkel.com
Isaac Robin Abothu
Siemens Healthineers
isaac.abothu@siemens-healthineers.com
Karlheinz BockTU Dresden
karlheinz.bock@tu-dresden.deBenson Chan
Binghamton University
chanb@binghamton.edu
Vaidyanathan Chelakara
Cisco
cvaidy@cisco.com
Rabindra N. Das
MIT Lincoln Labs
rabindra.das@ll.mit.edu
Maria Gorchichko
Applied Materials
maria.gorchichko@gmail.com
Dongming He
Qualcomm Technologies, Inc.
dhe@qti.qualcomm.com
Florian Herrault
PseudolithIC, Incfloherrault@gmail.com
Jae-Woong Jeong
KAIST
jjeong1@kaist.ac.kr
Hee Seok Kim
University of Washington Tacoma
heeskim@uw.edu
Jong-Hoon Kim
Washington State University Vancouver
jh.kim@wsu.edu
Ramakrishna Kotlanka
Analog Devices
rama.krishna@analog.com
Santosh Kudtarkar
Analog Devices
santosh.kudtarkar@analog.com
Kevin J. Lee
Qorvo Corporation
kevinj.lee@qorvo.com
Zhuo Li
Fudan University
zhuo_li@fudan.edu.cn
Yang Liu
Nokia Bell Labs
yang3d@gmail.com
Chukwudi Okoro
Corningokoroc@corning.com

Dishit ParekhInteldishit.parekh@intel.com
C. S. Premachandran
GlobalFoundries
319prem@gmail.com
Jintang ShangSoutheast University
shangjintang@hotmail.com
Rohit Sharma
IIT Ropar
rohit@iitrpr.ac.in
Nancy Stoffel
National Institute of Standards and Technology
nstoffel1194@gmail.com
Ran Tao
National Institute of Standards and Technology
ran.tao@nist.gov
W. Hong Yeo
Georgia Institute of Technology
whyeo@gatech.edu
Hongqing Zhang
IBM Corporation
zhangh@us.ibm.com
Interconnections
Chair
Ou Li
Advanced Semiconductor Engineering, Inc.
ou.li@aseus.com
Assistant Chair
Gang DuanIntel Corporation
gang.duan@intel.com
Jian Cai
Tsinghua University
jamescai@tsinghua.edu.cn
C. Key Chung
TongFu Microelectronics Co. Ltd.
chungckey@hotmail.com
David Danovitch
University of Sherbrooke
david.danovitch@usherbrooke.ca
Bernd Ebersberger
Infineon Technologies
bernd.ebersberger@infineon.com
Takafumi Fukushima
Tohoku University
fukushima@lbc.mech.tohoku.ac.jp
Thom GregorichZeisstmgregorich@gmail.com
Yoshihisa Kagawa
Sonyyoshihisa.kagawa@sony.com
Seung Yeop Kook
GlobalFoundries
seung-yeop.kook@globalfoundries.com
Kangwook Lee
SK Hynix
steward.lee@sk.com
Li Li
Infinera
packaging@yahoo.com
Changqing Liu
Loughborough University
c.liu@lboro.ac.uk
Wei-Chung Lo
Industrial Technology Research Institute (ITRI)
lo@itri.org.tw
Nathan Lower
Consultant
nplower@hotmail.com
James Lu
Rensselaer Polytechnic Instituteluj@rpi.edu
Vempati Srinivasa Rao
IME A-star
vempati@ime.a-star.edu.sg
Katsuyuki Sakuma
IBM Researchksakuma@us.ibm.com
Jean-Charles Souriau
CEA Leti
jcsouriau@cea.fr
Chuan Seng Tan
Nanyang Technological University
tancs@alum.mit.edu
Chih-Hang Tung
Taiwan Semiconductor Manufacturing
Company
chtungc@tsmc.com
Tiwei Wei
Purdue University
tiwei@purdue.edu

Matthew Yao
GE Aerospace
matthew.yao@ge.com
Chaoqi Zhang
Qualcomm Technologies, Inc.
chaoqi.gt.zhang@gmail.com
Dingyou Zhang
Broadcom Inc.
dingyouzhang.brcm@gmail.com
Wei ZhouMicronzhouwei@micron.com
Materials & Processing
Chair
Qianwen Chen
Broadcomwendy.chen@broadcom.com
Assistant Chair
Vidya Jayaram
Intel Corporation
vidya.jayaram@intel.com
Tanja Braun
Fraunhofer IZM
tanja.braun@izm.fraunhofer.de
Yu-Hua Chen
Unimicronyh_chen@unimicron.com
Jae Kyu Cho
GlobalFoundries
jaekyu.cho@globalfoundries.com
Bing Dang
IBM Corporation
dangbing@us.ibm.com
Gibran Liezer Esquenazi
LQDX
gibranesquenazi@gmail.com
Lewis Huang
Senju Electronic
lewis@senju.com.tw
C. Robert Kao
National Taiwan University
crkao@ntu.edu.tw
Alvin Lee
Brewer Science
alee@brewerscience.com
Yi LiIntel Corporation
yi.li@intel.com
Ziyin Lin
Intel Corporation
ziyin.lin@intel.com
Yan Liu
Medtronic Inc. USA
yan.x.liu@medtronic.com
Mikel Miller
Apple Inc.
mikel_miller@apple.com
Praveen Pandojirao-S
Johnson & Johnson
praveen@its.jnj.com
Mark Poliks
Binghamton University
mpoliks@binghamton.edu
Dwayne Shirley
Marvell Semiconductor, Inc.
shirley@ieee.org
Ivan Shubin
Raytheon Technologies
ishubin@gmail.com
Bo Song
HP Inc.
bo.song@hp.com
Yoichi Taira
Keio University
taira@appi.keio.ac.jp
Frank Wei
DISCO Corporation
frank_w@discousa.com

Lingyun (Lucy) Wei
Dupontlingyun.wei@dupont.com
Kimberly Yess
Brewer Sciencekyess@brewerscience.com
Myung Jin Yim
Apple Inc.
myung27@hotmail.com
Hongbin Yu
Arizona State University
yuhb@asu.edu
Zhangming Zhou
Qualcomm
zhou.zhming@gmail.com
Packaging Technologies
Chair
Mike Gallagher
DuPont Electronic Materials
michael.gallagher@dupont.com
Assistant Chair
Peng Su
Juniper Networks
pensu@juniper.net
Lihong Cao
Advanced Semiconductor Engineering, Inc.
lihong.cao@aseus.com
Jie FuApple Inc.
fujie6@gmail.com
Glenn Ning Ge
TetraMemglenn.ge@tetramem.com
Kuldip JohalMKS Instruments- MSD
kuldip.johal@atotech.com
Sam Karikalan
Broadcom Inc.
sam.karikalan@broadcom.com
Beth Keser
Zero Asic
bethk@kesers.com
Young-Gon Kim
Renesas Electronics America
young.kim.jg@renesas.com
Andrew Kim
Apple
hkim34@apple.com
John Knickerbocker
IBM Corporation
knickerj@us.ibm.com
Steffen Kroehnert
ESPAT Consulting, Germany
steffen.kroehnert@espat-consulting.com
Albert Lan
Applied Materials
albert_lan@amat.com
John H. Lau
Unimicron Technology Corporation
john_lau@unimicron.com
Jaesik Lee
SK Hynix USA
jaesik.lee@us.skhynix.com
Kyu-Oh LeeIntel Corporation
kyu-oh.lee@intel.com
Markus Leitgeb
AT&S
m.leitgeb@ats.net
Monita Pau
Ontomonita.pau@ontoinnovation.com
Luu Nguyen
Psi Quantum
lnguyen@psiquantum.com
Raj Pendse
Facebook FRL (Facebook Reality Labs)
rajd@fb.com

Min Woo Rhee
Samsung
mw.daniel.lee@gmail.com
Subhash L. Shinde
Notre Dame University
sshinde@nd.edu
Joseph W. Soucy
Draper Laboratory
jsoucy@draper.com
Eric Tremble
Marveletremble@marvell.com
Kuo-Chung Yee
Taiwan Semiconductor Manufacturing
Corporation, Inc.
kcyee@tsmc.com
Photonics
Chair
Takaaki Ishigure
Keio University
ishigure@appi.keio.ac.jp
Assistant Chair
Christopher Striemer
AIM Photonics
cstriemer@sunypoly.edu
Ankur Agrawal
Intel Corporation
ankur.agrawal@intel.com
Jacob Ajey
University of Southern California
ajey@isi.edu
Stephane Bernabe
CEA Leti
stephane.bernabe@cea.fr
Surya Bhattacharya
IMEbhattass@ime.a-star.edu.sg
Christopher Bower
X-Display Company, Inc.
chris@xdisplay.com
Nicolas Boyer
Ciena
nboyer@ciena.com
Mark Earnshaw
Nokiamark.earnshaw@nokia-bell-labs.com
Gordon Elger
Technische Hochschule Ingolstadt
gordon.elger@thi.de
Z. Rena Huang
Rensselaer Polytechnic Institutezrhuang@ecse.rpi.edu
Ajey Jacob
University of Southern California (USC)ajey@isi.edu
Aditya Jain
Lightmatterajain@lightmatter.coSoon JangficonTEC USA
soon.jang@ficontec.com
Harry G. Kellzi
Micropac Industries
harrykellzi@micropac.com
Hideyuki Nasu
Furukawa Electric
hideyuki.nasu@furukawaelectric.com
Richard Pitwon
Resolute Photonics Ltd
richard.pitwon@resolutephotonics.com
Vivek Raghuraman
Broadcom Corporation
vivek.raghuraman@gmail.com
Dadi Setiadi
Lightelligencedadi.setiadi@lightelligence.ai
Hiren Thacker
Cisco Systems

hithacke@cisco.com
Masao Tokunari
IBM Corporation
tokunari@jp.ibm.com
Stefan Weiss
II-VI Laser Enterprise GmbHstefan.weiss@II-VI.com
Ping Zhou
LDX Optronics, Inc.
pzhou@ldxoptronics.com
Thermal/Mechanical Simulation &Characterization
Chair
Karsten Meier
TU Dresden
karsten.meier@tu-dresden.de
Assistant Chair
Rui ChenEastern Michigan University
rchen7@emich.edu
Christopher J. Bailey
Arizona State University
christopher.j.bailey@asu.edu
Liangbiao Chen
On Semiconductorbill.chen@onsemi.com

Ning Ye
Western Digitalning.ye@wdc.com
G. Q. (Kouchi) Zhang
Delft University of Technology (TUD)
g.q.zhang@tudelft.nl
Xiaowu Zhang
Institute of Microelectronics (IME)xiaowu@ime.a-star.edu.sg
Tieyu Zheng
Microsoft Corporation
tizheng@microsoft.com
Jiantao Zheng
Hisiliconzheng.jiantao@hisilicon.com
Interactive Presentations
Chair
Frank Libsch
IBM
libsch@us.ibm.com
Assistant Chair
Karan Bhangaonkar
Intel Corporation
karan.r.bhangaonkar@intel.com

Kuo-Ning Chiang
National Tsinghua University
knchiang@pme.nthu.edu.tw

Rao Bonda
Amkor Technology
rao.bonda@amkor.com

Ercan (Eric) Dede
Toyota Research Institute of North America
eric.dede@toyota.com

Biao Cai
IBM Corporation
biaocai@us.ibm.com

Xuejun Fan
Lamar University
xuejun.fan@lamar.edu

Joshua Dillon
Marvell Govt. Solutions
joshuafdillon@gmail.com

Przemyslaw Gromala
Robert Bosch GmbHpgromala@ieee.org

Mark Eblen
Kyocera International SC
mark.eblen@kyocera.com

Pradeep Lall
Auburn University
lall@auburn.edu
Chang-Chun Lee
National Tsinghua University (NTHU)
cclee@pme.nthu.edu.tw
Guangxu Li
Texas Instruments
guangxu3559@gmail.com
Ruiyang Liu
TeraDAR Inc.
ruiyang.liu9@gmail.com
Yong Liu
ON Semiconductor
yong.liu@onsemi.com
Erdogan Madenci
University of Arizonamadenci@email.arizona.edu
Tony Mak
Wentworth Institute of Technology
t.mak@ieee.org
Patrick McCluskey
University of Maryland
mcclupa@umd.edu
Jiamin Ni
IBMnijiamin8910@gmail.com
Erkan Oterkus
University of Strathclyde
erkan.oterkus@strath.ac.uk
Suresh K. Sitaraman
Georgia Institute of Technology
suresh.sitaraman@me.gatech.edu

Mohammad Enamul Kabir
Intel Corporation
enamul101b@yahoo.com
Ibrahim Guven
Virginia Commonwealth University
iguven@vcu.edu
Alan Huffman
SkyWater Technology
alan.huffman@ieee.org
Amanpreet Kaur
Oakland University
kaur4@oakland.edu
Jeffrey Lee
iST-Integrated Service Technology Inc.
jeffrey_lee@istgroup.com
Stephen Lee
NXP Semiconductors
stephen.lee@nxp.com
Michael Mayer
University of Waterloo
mmayer@uwaterloo.ca
Saikat Mondal
Intel Corporationsaikat.mondal@intel.com
Pavel Roy Paladhi
IBM Corporation
rpaladhi01@gmail.com
Mark Poliks
Binghamton University
mpoliks@binghamton.edu

Wei Wang
Qualcomm Technologies, Inc.
weiwang.cu@gmail.com

Patrick Thompson
Texas Instruments, Inc.
patrick.thompson@ti.com

Zhi YangGroqzyang@groq.com

Kristina Young
Synopsys Inc
kristina.youngfisher@gmail.com