Hetero-functional Integrated Device
HeteroTechnology Development®

Bio Electro-mechanical Autonomous Nano Syｓ
ｓtems

BEANS Laboratory
The University of Tokyo
Kyushu University
Ritsumeikan University
Advanced Industrial Science and Technology

BEANS Project is sponsored by NEDO( New Energy and Industrial Technology Development Organization

MEMS Future =•••In Japan, we say semiconductor
chips are rice for the industry.
Rice provide energy for the body.

Beans contain proteins for bio
functions, such as eyes for sensing
and muscle for actuation. We hope
MEMS to be beans for the industry.
Fujita, Int. Sympo. Micromachine/Nanotech ‘07

MEMS Technology & Market Development Roadmap

2New Lifestyles being Enabled byTarget of BEANS Project3

Categories & Subjects of BEANS① Bio/Organic Materials Integration Process
Nano-scale Interfaces Treatment
Bio/Organic Integrated Higher-Order Structure Formation② Novel fabrication technology for 33-D NanoNano-structures
Top-down fabrication of monolayer-flat, defect-free 3D structure
Bottom-up technology for heterogeneous integration of materials
and functions on 3-D platform3-D nano-fabrication for aerospace applications③ Large Area Continuous Process of Micro/NanoMicro/Nano StructureNon-vacuum large-area deposition techniques of high-quality
nano/micro materials
Continuous nano/micro -machining and integration Process forfiber substrates④ Building up of Knowledge Databasein Heterogeneous Technology Convergence Process Development

BEANS Research Initiative

Macro BEANS Center
Large Area Continuous
Process of Micro/NanoStructures
AIST

Life BEANS Center
Bio Integration Process

The University of Tokyo

BEANS Laboratory

3D BEANS Center
Novel fabrication
Technology for 3D Nanostructures
The University of Tokyo

Project Management
Knowledge DB

Life BEANS Center
KyushuOrganic Materials
Integration Process
Kyushu University

3D BEANS Center Shiga
3D Nano-structures for
Aero-Space Applications
Ritsumeikan University

Project Leader: Atsushi YUSA
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① -A Bio Materials Integration Process : Life BEANS Center
S.Takeuchi, Univ. of Tokyo

Market,Social Needs
Technology Requirements

Health, Medicine ⇒ Implantable Device,Highly Sensitive Chemical Sensors
Environment⇒ Energy Harvesting Device
Harnessing Bio and Organic materials for MEMS

Research Overview

Implantable continuous
glucose monitoring systems

Impacts
Applications

3D tissues

・ Implantable glucose sensors
・ Single molecular Level, Ultra highly sensitive chemical sensors
・ Sensors for drug kinetics with minimal load of animal experiments① -B Organic Materials Integration Process : Life BEANS Center Kyushu
Nano--Process Technology Enables Innovative Organic Devices
Nano
C.Adachi, Kyushu Univ.

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② Novel fabrication technology for 33-D nanonano-structures : 3D BEANS Center
M. Sugiyama, Univ. of Tokyo
Sensor network for safe, secured and healthy life
High-sensitivity sensing, energy harvesting, high-density recording

Needs
Seeds

Research items

A monolayer-flat, defect-free 3Dstructure (Si, SiO2 etc…)(1) Top-down fabrication of monolayer-flat,
defect-free 3D structureNeutral beam etchingNano-domain modification by fs-laser
100nm

3nm

Surface functionalization by foreign materials
and nano-structures(2) Bottom-up technology for heterogeneous
integration of materials and functions
on 3-D platform Supercritical-fluid deposition and coating Assembly ofnanoparticles, nanodots and nanotubes on 3-Dplatforms
Alignment ofnanoparticles on trenches

Supercritical-fluid
conformal deposition

Multi-scale&uniform nano-fabrication(3) 3-D nano-fabrication for aerospace
applications

Nano-pores

 Nano-structure imprint on a3-D microstructure Filters for multi-band selection

μm topologySimulation, nano-tribology
Super-capacitors, Ultra-high-sensitivity sensors, Tbit/cm 2 recording, nmresolution high-throughput lithography, Multiband-spectroscopy from space

Applications③ Large Area Continuous Process of Micro/Nano Structure : Macro BEANS Center
Large-area energy
harvesting devices

Large-areacommunication
devices

Large-areadisplay devices

Sheet-type health-care(monitoring) devices

SwitchT. Itoh, AIST

信号伝送繊維画素に対応した導電性繊維をAntenna

芯線に巻きつける（色は画素に対応）Ultrasonic
Probe Sheet

Sheet-type シート型ディスプレイDisplay

超音波プローブシート

MEMS Reconfigurable Antenna
Ultrasonic wave sending
and receiving electrode
超音波送受信用電極
Movable electrode

MeterMeter-size devices

Piezoelectric可動接点
thin film
圧電薄膜
導電性繊維
Electro-conductive fiber

To develop new fabrication process which deposits
high quality nano/micro materials on meter-size
substrate without vacuum process equipment

Flexible sheetsheet-type devices

Wearable energy
harvesting devices

To develop new fabrication process that realizes flexible
sheet-type large-area devices utilizing micromachining
and weaving integration of fiber substrates instead of
micromachining of large substrates
Smart jackets forsafety and security

Non-vacuum large-areadeposition techniques of highquality nano/micro materials

Continuous nano/micro-machining
and integration process for fiber
substrates

6Flexible touch sensor

Outcome of 2008

Item

Life BEANS
Headquarter Center

Life BEANS
CenterKyushu

3D BEANS
Center

3D BEANS
CenterShiga

MacroBEANSCenter

Total

Patents

01+(3)

4+(2)(1)

23+(2)

10+(8)

Press
Release3200

308

Publications
Conference711

23+(7)

0427+(7)

Publications
Journal0(1)20002+(1)( )under Applications

BEANS Laboratory
Establish

March 24, 2009

Mission・Executing BEANS Project ( Hetero-functional Integrated device Technology Development Project)
・Sending researchers who are assigned from the member companies of BEANS Laboratory to BEANSCenters, and collaborating with researchers of universities and National Institutes

Chairperson

Hisao SAKUTA

Executive Director

Keiichi AOYAGIDirector

Atsushi YUSA (Project Leader)

Members

20 Organizations (Companies and Institutions) as of July, 2009
DENSO Corp.

FUJI Electric Systems Co., Ltd.

FUJUKURA Ltd.

FURUKAWA Electric Co., Ltd.

LINTEC Corp.

Mathematical Systems, Inc.

MITSUBISHI Chemical Medience Corp.

MITSUBISHI Electric Corp.

MIZUHO Information & Research Institute, Inc.

OLYMPUS Corp.

OMRON Corp.

PANASONIC Electric Works, Ltd.

SEIKO Instruments Inc.

TERUMO Corp.

TOSHIBA Corp.

TOSHIBA Machine Corp.

Institute for Unmanned Space Experiment Free Flyer
Institute of System, Information Technologies and Nanotechnologies
Japan Resources Observation System & Space Utilization Organization
Micromachine Center
Number of researchers

81（Including affiliates)

BEANS Center Life BEANS Center, 3D BEANS Center: Institute of Industrial Science, The University of Tokyo
Life BEANS Center Kyushu: Center for Future Chemistry, Kyushu University
3D BEANS Center Shiga: Ritsumeikan University
Macro BEANS Center: Advanced Industrial Science and Technology

7July, 2009

BEANS Laboratory

BEANS Laboratory

MBR99 Bldg. 6F
67, Kanda-sakumagashi, Chiyoda-ku, Tokyo, 101-0026 Japan
Phone : +81-3-5835-1870
Fax : +81-3-5835-1873
http://www.beanspj.org/lab/

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BEANS Laboratory all right reserved November, 2009