X7056RS
In-Line X-ray and
Optical Inspection forElectronic Assemblies

AOI/AXIWiMXth&D3!
DFPLeading Edge Inspection Technology
Optical and simultaneous
2D, 2.5D and
3D X-ray inspection
AOI – AXI compared:
Simultaneous optical and
X-ray inspection
3D X-ray inspection
with resolutions from5 up to 20 µm per pixel
Only recognizable with
AOI: OCR application

High performance, tomosynthesisbased 3D X-ray back calculation
Optical inspection
with up to 8 µm resolution
Short handling time

Only recognizable withAOI: SOIC polarity

Compact housing dimensions:only 1.3 m (X7056RS)
or 1.7 m (X7056RL) wide
Worldwide competent service:on site, hotline and remote support
Customer support section
on Viscom‘s website

Only recognizable withAXI: BGA bridge

Reduce false alarmswith AXI OnDemandHR
New electronic products are arriving to the market today at increasingly
rapid cycles. Time allowed for development and modeling is getting shorter,as demands for top quality rise. The automatic optical inspection (AOI) ofprinted circuit boards is accepted worldwide. Manufacturers with miniaturized components such as BGAs, µBGAs, CSPs and FlipChips require a positive and cost-effective quality inspection process that also locates concealed
defects—with extensive inspection depth and high throughput.

Only recognizable withAXI: defect in THTconnection

X7056RS with XM camera technology—
the new AXI standard, fast and flexible
The core of X-ray technology—a high performance closed microfocus X-ray tube—
provides selectable resolutions from 5 up to 20 µm per pixel for X-ray inspections.
Depending on the application, flat panel detectors (FPD) or image intensifiers areused for the 3D, 2.5D or 2D X-ray techniques.
The 3D results are based on tomosynthesis and facilitate an outstanding
image quality and optimum contrasts. Thus, complex overlap on
printed circuit boards populated on both sides can be resolved andeasy-to-analyze features generated. Through integration of the AOI—
with XM 3D or 8M camera technology—this system also offers thehigh inspection depth of the Viscom AOI systems with comparable
throughput. With the OnDemandHR function, the AOI resolution
for orthogonal analysis can be flexibly switched to as high as 8 µm/
pixel at full image field depth. In addition, the inspection systemprovides the option of color evaluation.
With its simultaneous optical and X-ray inspection, thehigh-performance combo system sets a new standard in quality
assurance. Through this simultaneous inspection very fast inspection and minimum handling times are achieved. The system is fully modular, so it can be used as a combined system or
as a pure AXI system. These different inspection concepts display
the ultimate in flexibility that can be directly employed tocustomer requirements.
EasyPro presents a user interface that is concise and convenientin both AOI mode and X-ray operation. Program generation andoptimization can be conducted quickly and easily, and is compa­
tible with existing Viscom systems. As an option, high performance SPC software with a variety of filtering functions isavailable for process control and optimization.
For this system too, the unique Viscom Quality Uplink for effective
process control as well as a wide range of proprietary Viscom analysis algorithms are available, such as those for BGAs, FlipChips or surface soldering (voiding calculation).

2D X-ray – 3D X-ray compared:

2D image of a BGA:
Structures from the rear side
are present in the image

3D image of a BGA:
Sectioned image without
interfering structures

Technical Specifications
Variants
Inspection concept

AXI
2D AXIAOI/AXI

3D AXI

2D AXI + AOI

3D AXI + AOI

X-ray technology
X-ray tube
High voltage
Tube current
Detector		
Resolution
Z-axis adjustment
X-ray cabinet		

Closed X-ray tube
60–130 kV		
50–300 µA
Viscom 2D, 2.5D and 3D detector, 12-bit grayscale depth
Flat panel detector, 14-bit grayscale depth
Image intensifier: 5, 7, 10 µm/pixel, FPD: 8, 10, 20 µm/pixel, switchable
Powered Z-axis tube adjustment
In compliance with the German X-ray Regulations (RöV)
regarding fully protected devices. Leakage radiation < 1µSv/hCamera technology
Orthogonal camera module XM
Field of view	40 mm x 40 mm (1.6" x 1.6")
Resolution
16 µm (standard), 8 µm (high) switchable with OnDemandHR
Number of mega pixel cameras 1
Angled view camera module XM
Resolution
16 µm (standard)
Number of megapixel cameras 4/8 (optional)
XM 3D camera technology
RangeZ-resolution

Up to 30 mm (1.2")
0.5 µm8M camera technology (optional)
SoftwareUser interface
Verification station
SPC
Remote diagnosis
Off-line programming
Systematic defect analysis andcontinuous system monitoring

Viscom EasyPro/vVision-ready
Viscom HARAN
Viscom SPC (statistical process control), open interface (optional)
Viscom SRC (software remote control) (optional)
Viscom PST34 (external programming station) (optional)
Viscom PDC (ProcessDataControl),TCM (TechnicalChainManagement)

Operating system
Processor

Windows®
Intel® Core™ i7

System computer

PCB handling
PCB dimensions*		
Transport height
Width adjustment
Handling unit
Dual track operation
PCB clamping
PCB edge clearance
Upper transport clearance
Lower transport clearance

X7056RS: 450 mm x 350 mm (18" x 13.8") (L x W)
X7056RL: 610 mm x 508 mm (24" x 20") (L x W) 		
850–980 mm ± 20 mm (33.5"–38.6" ± 0.8")
AutomaticGantry system with maintenance-free high speed drives
Optional with external PCB modules
During inspection
3 mm (0.1")
Up to 35 mm (1.4") (FPD: 20 mm/0.8")
55 mm (2.2")

Inspection speed
30–50 cm2/s, no handling time
Depends on application

AOI
AXI
Other system dataInterfaces
SMEMA, SV70, customer specificPower requirements
400 V (other voltages on request), 3P/N/PE, 8 A
System dimensions	X7056RS: approx. 1266 x 1626 x 2184 mm (49.8" x 64" x 86") (W x H x D)		X7056RL: approx. 1738 x 1626 x 3166 mm (68.4" x 64" x 124.6") (W x H x D)	Line integration dimensions
X7056RS: +25 mm (1"), X7056RL: +25 mm (1")
Weight
X7056RS: approx. 2500 kg (5511 lbs)		
X7056RL: approx. 3600 kg (7936 lbs)
Side view

Top view

Dimensions in mm

Headquarters:
Viscom AG
Carl-Buderus-Straße 9–15 · 30455 Hanover · Germany
Tel.: +49 511 94996-0 · Fax: +49 511 94996-900
info@viscom.com · www.viscom.com

Visit our website to find international subsidiaries andrepresentatives in Europe, USA and Asia:

www.viscom.com*3D X-ray inspection: dimensional restrictions may occur
Specifications subject to change without notice. Windows® and Intel® Core™ i7 are registered trademarks. April 2016

# Viscom_SYS_X7056RS_EN16040009

Front view