From Eye to Insight

LAS X
for Applied Microscopy only

Release Notes LAS 3.0.14

LAS X 3.0.14 Release Notes for Applied Systems

1Release documentation for LAS X 3.0.14
This document describes the 3.0.14 release of the Leica Application Suite X imaging andanalysis software for applied microscopy. You should read this document before installing yourcopy of this software.
All reasonable steps have been taken to ensure that this publication is correct and complete,
but should any user be in doubt about any detail, clarification may be sought from Leica
Microsystems CMS GmbH, or their accredited representative. The information in thisdocument is subject to change without notice and should not be construed, as a commitment
by Leica Microsystems CMS GmbH. Leica Microsystems CMS GmbH accepts no
responsibility for any errors that may appear in this document.

Copyright © 2020 Leica Microsystems CMS GmbHAll rights reserved. The contents of this publication may not be reproduced in any form orcommunicated to a third party without prior written permission of Leica Microsystems CMS
GmbH. Due to a policy of continuous development, we reserve the right to change
specifications without notice. Microsoft and MS-DOS are registered trademarks and Windows,
the Windows logo, the Windows 2000 logo, the Windows XP logo, the Windows Vista logo,
the Windows 7 logo and the Windows 10 logo are trademarks of Microsoft Corporation.

Date: October 16thth, 2020, applying to build number 23224

LAS X 3.0.14 Release Notes for Applied Systems

2

Contents
1.

Compatible Microscopes and Cameras ...................................................................... 4•

1.1 Compatible Microscopes* ................................................................................. 4•

1.2 Compatible Cameras ........................................................................................ 6

2.

Technical Requirements and Installation .................................................................... 7•

2.1 Compatibility to LAS, LAS AF, former LAS X versions and LMD ....................... 7•

2.2 Installing the Correct Firmware Versions ........................................................... 9•

2.3 PC Requirements ............................................................................................ 113.

Data Security Fix ...................................................................................................... 14•

Update of WIBU / Codemeter to Version 7.10a for security reasons ..................... 14•

Please see the official communication for detailed information ............................. 14•
https://www.leica-microsystems.com/company/product-security/product-securityupdates/ ....................................................................................................................... 14
4.

Restrictions/ Known Issues....................................................................................... 15

LAS X 3.0.14 Release Notes for Applied Systems

31. Compatible Microscopes and Cameras•

1.1 Compatible Microscopes*
Microscope/ System

Compatibility

Inverted Microscopes
Leica DMi8
Leica DMi8 M/ C/ A
Leica DMI6000 B/ with AFC
Leica DMI5000 M
Leica DMI4000 B
Leica DMI3000 B/ M
Leica DM IL/ M
Leica DMI1 with integrated camera

NO
YES
NO
YES
NO
YES
YES
NO

Upright Research Microscopes
Leica DM4 B/ M/ P
Leica DM6 B/ M/ as LMD base
Leica DM12000 M
Leica DM8000 M
Leica DM6000 B/ M/ as LMD base
Leica DM5500 B
Leica DM5000 B
Leica DM4500 B
Leica DM4000 B/ M/ P /LED

YES
YES
YES
YES
YES
NO
NO
NO
YES

Fixed Stage Microscopes
Leica DM6 FS
Leica DM6000 FS

NONOStereos and Macroscopes
Leica M205 C/ A/ FA/ FCA
Leica M165 C/ FC
Leica M125/ M125 C
Leica M80
Leica M60
Leica M50
MZ16 F/ A/ FA
MZ10 FZ16 APO/ APO A
Z6 APO/ APO A
S8 APO
S6 D
S APO
S9D / S9i

YES
YES
YES
YES
YES
YES
YES
YES
YES
YES
YES
YES
YES
YES

Digital Microscopes
DVM6
DMS 1000
DMS 300
VZ 700C (DVM2500)

YES
YES
YES
YES

LAS X 3.0.14 Release Notes for Applied Systems

Comments

only supported in Windows 7, Windows 10
implementation is ongoingstands with production date >=2008 only
stands with BZ >= 03 only
stands with production date >=2008 only
stands with production date >=2008 only4

Upright Routine Microscopes
Leica DM3000 / LED
Leica DM2700 M/ P
Leica DM2500 M/ P/ LED
Leica DM2000 / LED
Leica DM1750
Leica DM1000 / LED

YES
YES
YES
YES
YES
YES

Educational Microscopes
Leica DM750
Leica DM500
Leica EZ4E
Leica EZ4HD
Leica EZ4W

YES
YES
YES
YES
YES

TIRF and GSD Systems
Leica AM TIRF MC
Leica AM TIRF MC with AFC
Leica SR GSD

NO
NO
NO

Confocal systems in combination
with Leica AM TIRF MC

only USB connection, Ethernet notsupported
only USB connection, Ethernet and Wifi
not supported

NO

Forensic Stands
FSC
FSM
FS CB
FS 4000

NO
NO
NO
NO

LIBS
LIBS Modul

YES* = operating with standard LAS X 3.0.14. LAS X 3.0.14 also contains a new user interface
that is designed only for the DVM6 referred to as LAS X.next, this new interface is only
compatible with the DVM6.

LAS X 3.0.14 Release Notes for Applied Systems

5•

1.2 Compatible Cameras

Leica Color Camera

Leica Monochrome
Cameras

DFC295 (3)DFC3000 G (1)DFC310 FX (3)DFC365 FX (3)DFC450 (3)DFC9000 GT/GTC (1/4)

DFC450 C (3)DFC495 (3)DFC550 (3)DFC7000 T (1)DMC2900 (1)DMC4500 (1)DMC5400 (1)DMC6200 (1)IC80 HD (2)IC90E (2)
ICC50 HD/W/E (2)MC120 HD (2)MC170 HD (2)MC190 HD (2)FLEXACAM C1 (1)(1) USB 3(2) USB 2(3) Firewire B(4) Camlink

No more supported as of LAS X Version 3.0.14:
DFC340 FX, DFC345 FX, DFC350 FX, DFC360 FX
DFC 420/420 C, DFC 425/425 C, DFC 490

Note 1) DMC2900 is only supported with 8 Bit. It will work with a USB2.0 interface but withlimited functionality
Note 2) DMC4500 will work with USB2.0 interface but only a single image format available(full frame)
Note 3) DFC3000G & DFC 7000T requires a USB3.0 interface and will not work with USB2.0
interfaces.
Note 4) Wi-Fi and Ethernet connection are not supported in LAS X

LAS X 3.0.14 Release Notes for Applied Systems

62. Technical Requirements and Installation
Warnings
Warning!! LAS X 3.0.14 is an Industry release only. Do not installon Confocal or Widefield systems.

Warning!! Do not install LAS X version 3.0.14 on systems withLAS AF version 2.x or lower.

Warning!! Do not upgrade firmware via LAS
Perform firmware updates only via the Leica Hardware Configurator tool
installed together with this LAS X release.

Operating System
LAS X 3.0.14 is a genuine 64-bit program and runs on Windows 10 only.

•

2.1 Compatibility to LAS, LAS AF, former LAS X versions and LMD

2.1.1 Compatibility to former LAS X versions
LAS X 2.0.0 can be upgraded with LAS X 3.0.14
LAS X 3.0.x can be upgraded with LAS X 3.0.14
All LAS X 1.x versions can be upgraded with LAS X 3.0.14
Before installation of LAS X 3.0.14 on a workstation running LAS X 1.7.x or LAS X
1.6.x, it is necessary to uninstall LAS X.
LAS X 1.x dongles used on DVM6 systems need to be upgraded, before using themwith LAS X 3.0.8 or higher (otherwise some functions will be missing).
LAS X 3.0.11 or higher can read and process files generated with LAS X 1.x

2.1.2 Compatibility to LAS
LAS X 3.0.14 can read and process single images generated with LAS versions.
However, image series generated with LAS need to be imported with the LAS X fileimporter by entering the metadata manually.
LAS X 3.0.14 Release Notes for Applied Systems

7

LAS versions cannot read data acquired with LAS AF or LAS X software versions.

2.1.3 Compatibility to Leica LMD Laser Microdissection
LAS X is fully compatible to Leica LMD application software and can be installed on
the same workstation.
Important note: Use only one software at a time. The LMD application software and
LAS X software cannot be used simultaneously.
LMD application software V8.x supports Win10.

LAS X 3.0.14 Release Notes for Applied Systems

8•

2.2 Installing the Correct Firmware Versions

In most cases, the LAS X installation takes care of installing the required microscope
firmware. However, in some cases, the updating of the firmware may not take place. The
firmware then must be updated manually via the LAS X Hardware Configurator.
The correct versions of firmware for use with LAS X 3.0.14 are:
DMI 8:DMI8 Master (XE167FH200F100L_MASTER.HEX)DMI8 Master FPGA (XP2_17_MASTER.HEX)
SBM I2C (DSPIC33FJ128_SBM_I2C.HEX)
motCORR (DSPIC33FJ128_MOT_CORR.HEX)
AFC (TMS320F28335_AFC.HEX)
SmartMove (TMS320F28023_SMARTMOVE.HEX)
Sideports (DSPIC33FJ128_DC_TURRETII.HEX)
Bottomport (DSPIC33FJ128_DC_TURRETII.HEX)
Z Axis (DSPIC24HJ064_STEPPERA.HEX)XY Axes (DSPIC24HJ064_STEPPERA.HEX)
Buttons Left (DSPIC33FJ128_BUTTONS_LEFT.HEX)
Buttons Right (DSPIC33FJ128_BUTTONS_RIGHT.HEX)
Nosepiece 2 positions (DSPIC33FJ128_NOSEPIECE_2POS.HEX)
Nosepiece (DSPIC33FJ128_NOSEPIECE.HEX)IL Turret (DSPIC33FJ128_DC_TURRETII.HEX)
Mag. Changer (DSPIC33FJ128_DC_TURRETII.HEX)
T-House Splitter (DSPIC33FJ128_DC_TURRETII_B.HEX)
DIC (DSPIC33FJ128_STEPPERB.HEX)IL Diaphragms (DSPIC33FJ128_STEPPERB.HEX)PIC GSD (PIC_GIST.HEX)
FRAP (DSPIC24HJ064_STEPPERA.HEX)
Lamphouse (STM32F301K8_LAMP2.HEX)WF Scanner (DSPIC24HJ064_STEPPERA.HEX)
Sequencer 2 (STM32F303CCTX_SEQUENCER2.HEX)
Sequencer 2 FPGA (XP2_17_SEQUENCER2.HEX)
Touch Panel 2nd Generation (TPC-G2.exe)

V02.71.9705
V210
V01.01
V01.08
V02.21
V01.10
V01.06
V01.06
V01.15
V01.15
V01.08
V01.04
V01.01
V01.14
V01.06
V01.06
V01.05
V01.05
V01.05
V01.01
V01.15
V01.01.9999
V01.15
V01.02
V01.242.14.0.9705

Compound (except DMI 8):
Master Module (DM4000, DM4500, DM5000) (MAN1.HEX)
Leica Screen Module (DM5000) (MAN2.HEX)
Master Module (DM5000, DM5500, DM6000, DM6) (SYS.HEX)
Master Module (DM4000, DM4500, DM4) (BM-16Bit.HEX)
Master Module (DMI6000, DMI5000, DMI4000) (DMI.HEX)
Master Module (DM8000, DM12000) (DM8_12000.HEX)
Touch Panel 2nd Generation (TPC-G2.exe)
Touch Panel (STP6000) (TPC6000.exe)
DM3000 Master (DM3000.HEX)
Condenser Module (PH/DIC) (KONDSCH.HEX)
Condenser Module II (PH/DIC) (KONDSCH01.HEX)
Condenser Module III (PH/DIC) (KONDSCH02.HEX)XYZ Module (DM6000, DM5500) (XYZ_DIS.HEX)
Advanced XYZ Module (XYZ_ADV.HEX)
Advanced Z Module (Z_ADV.HEX)
LMD 6000 Head (LMD_6000.HEX)
Master Module LED4000 (LED4_7000.HEX)
LED7000 (LED7000.HEX)AFC DSP (AFC_DSP.HEX)
PIC motCORR (PIC_Corr.HEX)PIC GSD (PIC_GIST.HEX)LAS X 3.0.14 Release Notes for Applied Systems

V01.31
V01.07
V02.50.9705
V02.80.9705
V02.80.9705
V02.20.9705
2.14.0.9705
1.46.0.9705
V02.30.9705
V01.06
V01.01
V01.03
V01.10V03.10.9705
V03.10.9705
V01.24.9705
V01.04.9705
V01.04.9705
V01.25
V01.03
V01.01

9

Stereo:
Product
DMS
DVM 2500

DVM6 A / S / C / M

Coded Zoom Knob for
S9 series
Macroscope

Dragon Zoom

CAN
to
RS232
Converter-Cable
Stereo Zoom
UMC
Fluo Combi
Objective Revolver
Fluo Revolver
Fluo Combi
Objective Revolver
Fluo Revolver
Focus
Dragon Focus
MF Hand Control
TL RCI Base
TL 5000 Ergo Base /LSI
TL 3000 Ergo BaseIso Pro StageXY JoystickFootswitch
TCU
LED 3000 BLI

TradenameApplication

Bootloader

1.9.25

1.3.004.01.320196
3.01.162839
3.01.218256
5.00.498432
5.00.484890
5.00.533950
5.00.569227
1.38.480849
5.00.381414

no BL
3.01.162696
3.01.215563
5.00.400691
5.00.377379
5.00.377379
5.00.377368
no BL
5.00.381452

MEL89/MAZ1

5.00.458206

5.00.437655

Z6 / Z16 APO A (V51)
Z6 / Z16 APO A (C51)
M125C / M165C / M165FC / M205C / M205FCA
Revision 1
M205A / M205FA Revision 1
M125C / M165C / M165FC / M205C / M205FCA
M205A / M205FA
M-Zoom Display
M205FA / FCA - Automated Filter Wheel Revision 1
M165FC-F Revision 1
M205FA / FCA - Automated Filter Wheel

4.01.281758
4.01.281758

4.00.231498
3.02.128967

5.00.560177

5.00.559779

4.00.400935

4.00.217723

4.02.511469
5.00.560772
5.00.559736
3.03.481710

no BL
5.00.532274
5.00.532274
4.00.217862

M165FC-F

3.01.120368

3.01.117634

MEL90

5.00.479890

5.00.474771

MZ16A / MZ16FA
MZ16FA-F
MZ16xA-D
MHS3
MRE17 Revision 1
MRE18 Revision 1
MRE19 Revision 1
MRE17
MRE18
MRE19
MST31
MST66/67 Focus Revision 1

2.1
2.14
2.11
2.12

no BL
no BL
no BL
no BL

5.00.560185

5.00.559591

4.00.320268

3.02.207905

MST5x-DCI
MHS7
MDG30

1.32
5.00.549848
3.02.492813
3.01.116855
4.01.534019
3.01.267191
4.01.338410

no BL
5.00.519383
3.02.126882<-POF File
no BL
no BL
4.01.263201

MDG4x/MDG4xi

4.01.438080

no BL

MDG43

5.00.446074
3.01.167675????
3.01.133449
3.01.119315

5.00.439523
3.02.147234<-POF File
3.01.117634
3.01.117634

3.03.255036
3.03.255036
5.00.537513
3.01.321686

4.00.254686
3.02.147234
no BL
4.00.309569

DMS300DMS1000
MEL82 / 85 DCI
MEB121 / 122
MEB128Sirius XYZ
DVM 6 A / S
Sirius Base Conn
DVM 6 A / S / C
Sirius Arm LED
DVM 6 A / S / C / M
Sirius Zoom Main
DVM 6 A / S / C / M
Sirius Camera
DVM 6 A / S / C / M
Sirius Camera MCU DVM 6 A / S / C / M

MST51/52/59/66/67 Focus

MTI91 Iso Pro 6x4"
MTI91 XY-DCI
MHS5
MFS17 Revision 1
MFS17 (V51)
MFS17 (C51)MHS6
MEB137LAS X 3.0.14 Release Notes for Applied Systems

10

LED 5000 CXI
LED 5000 CXI
LED 3000 HDI
LED 5000 HDI
LED 3000 MCI

MEB112
MEB133
MEB136
MEB111
MEB1253.01.136125
3.01.285257
3.01.321335
3.01.267922
3.01.267778

3.01.136125
4.00.290100
4.00305195
4.00.290100
4.00.290100

LED 5000 MCI
LED 5000 MCI
LED 5000 MCI
LED 3000 NVI
LED 3000 NVI
LED 5000 NVI
LED 5000 NVI
LED 5000 RL
LED 3000 RL
LED 5000 RL
LED RL (Spider)
LED 3000 SLI
LED 5000 SLIMEB109
MEB129 Revision 1
MEB129
MEB113
MEB132
MEB134
MEB135
MEB110
MEB115
MEB124
MEB123
MEB126
MEB1273.01.212854

3.01.117634

3.01.216808
3.01.136125
3.01.285050

4.00.215703
3.01.136125
4.00.290100

3.01.321246

4.00.309569

3.01.128263
3.01.591555
3.01.408218
3.01.321686

3.02.126882
4.00.290100
4.00.291245
4.00.309569

3.01.386468

4.00.290100•

2.3 PC Requirements

2.3.1 General Requirements:
Win 10 Group policies:
Microsoft introduced with Windows 10 build 1803 „Camera Privacy Settings”. There is thepossibility to disable/enable the usage of UVC cameras. Please ensure when using DVM6,
ICC50 W, S9i, or EZ4 W/E that “Let apps use my camera” is enabled.

USB3 cameras:
Leica USB3 cameras are tested with USB3 PCIe cards from DeLock. These cards have a
Renesas PD720202 chipset. Leica strongly recommends using these cards. The majority of
the Leica USB3 cameras are delivered with this USB3 PCIe card.
If you plan to use a different card or an onboard-USB port with a different chipset, please makesure you have the latest drivers from the card manufacturer and the latest Windows updates
installed. Leica cannot guarantee that there is no issue when not using the recommended
USB3 PCIe card.
LAS X 3.0.14 Release Notes for Applied Systems

11

Please also branch the internal power supply when using a card.
Some cameras have considerable power demanding and deliver large amounts of data. Leica
recommends using each camera on a separate card. Leica recommends not to use other
instruments with high power requirements, such as external hard drives, on the same USB
socket.
Some computers have a USB3 charging port (USB3 with a flash sign). We do not recommend
using this port, since the camera will never power off and can prevent the computer fromrebooting.

2.3.2 PC Requirements (except Leica DVM6)
Recommended PC Configuration (except Leica DVM6):
Operating System:

Win10 64bit

CPU:Intel Core i7 CPU 4-Core 3.50GHzRAM:

16 GB DDR4-2133 4C

Hard drive:

256 GB SSD/1TB HDD

Graphics board:

NVIDIA QUADRO P1000 4GB

PC minimum requirements (except Leica DVM6)
Operating System:

Win10 64bit

CPU:Intel Core-I5 3,20 GHz

RAM:

16 GB DDR3-1333 ECC

Hard drive:

500 GB HDD

Graphics board:

NVIDIA QUADRO P1000 4GB

Graphics board Nvidia NVS 315 (1GB) is sufficient for systems without
3D Visualization
Monitor:minimum screen resolution is 1000 lines vertically

2.3.3 PC Requirements for Leica DVM6
Recommended PC Configuration Leica DVM6:
Operating System:

Win10 64bit

CPU:Intel Core i7 CPU 4-Core 4.0GHz

RAM:

16 GB DDR3-1867MHzLAS X 3.0.14 Release Notes for Applied Systems

12

Hard drive:

128 GB SSD/2TB HDD (or full SSD min 512 GB, Windows and
LAS X are to be installed on the SSD drive)

Graphics board:

AMD Radeon R9 M390 (2 GB)

Monitor:

5k Display resolution

PC minimum requirements Leica DVM6
Operating System:

Win10 64bit

CPU:Intel Core i7 CPU 4-Core 4.0GHz

RAM:

16 GB DDR3-1867MHz

Hard drive:

128 GB SSD/1TB HDD (or full SSD min 512 GB, Windows and
LAS X are to be installed on the SSD drive)

Graphics board:

AMD Radeon R9 (2 GB)

Monitor:

3k Display resolution

LAS X 3.0.14 Release Notes for Applied Systems

13

3. Product Security Fix•

Update of license component to a new secure version•

Please see the official communication for detailed information•

https://www.leica-microsystems.com/company/product-security/product-securityupdates/

LAS X 3.0.14 Release Notes for Applied Systems

14

4. Restrictions/ Known Issues•

See Error! Reference source not found.

•

Mobile Connection: iPads require iOS10 to connect with LAS X.

•

Using Windows 10, in some special conditions, the 3D Surface Viewer function will not
be available in the Easy Operation Mode. Restarting the system (computer + SW) willsolve the issue. This issue appears only on rare occasions, and there are efforts
implemented to remediate it for the next release.

•

Specimen Overview: if camera image is set to flip X/Y the effect of flipping in thespecimen overview image will be displayed after overview acquisition is completed.
However, navigation directions are not flipped.

•

DMC2900 camera: only 8-bit readout per color channel is supported.

•

Restriction for DMI series with manual transmitted light arm: the light intensity of atransmitted light channel can drop to ZERO when changing between channels in the lightpath settings interface. This restriction does not apply to DMi8.
Workaround: keep live image always on when changing between channels•

2D Analysis (2D Image Analysis) and all related Materials Applications (including
Cleanliness Expert and Steel Expert) are restricted to Analysis of Mosaic images << 4
GB raw format size due to windows library caused memory size restrictions.
! Important note: these restrictions are independent of compression factors the individual
file formats offer. Mosaic images saved in .jpg or .png file formats may experience theserestrictions also for significantly lower files sizes due to the considerably higher raw
format size these images will require during processing.
Workaround: reduce tilescan size or camera resolution•

Users upgrading from LAS X 1.7.x to 3.0.x might have a flipped image. This might
happen also if LAS X was started with “Simulator” as imaging source.
Workaround: flip the stage axis in the Stage Configuration menu.

LAS X 3.0.14 Release Notes for Applied Systems

15

•Image Preview requires auto exposure to be manually switched off before starting thefunction (DVM6)•

Default capture location is deselected in Easy Operation mode, if a subfolder of thecapture location is renamed.
Workaround: set the capture location new•

After a SW crash, sometimes DVM6 delivers just a black image.
Workaround: restart both, HW and SW•

At the first SW start, the live image might miss some functionality (no XYZ controls, no
AF and no WB). This can happen in very rare occasions.
Workaround: Pause and restart live image•

SW Crash with first launch after fresh system installation (combination of DVM6 + iMac)
Workaround: Starting the software again after the crash. Crash will not appear again.

•

False positive virus scanner alarms can appear during installation.
Workaround: Deactivation of virus scanner during the installation.

•

3D viewer not working (Surface viewer is working correctly!) -> 3D viewer icon is hiddenin 3.0.8.

LAS X 3.0.14 Release Notes for Applied Systems

16•

Leica Map would not display the Z scale in a 3D image – If using Leica Map 7.4.x
and higher with LAS X 3.0.6 and higher, there might be some Z scale display issues
after exporting the image. This influences only the display (Z scale not shown), themeasurements are NOT affected.

Workaround: To resolve this issue, please install Leica Map 7.4.x from the Leica DVD anddownload / install the latest update (7.4.8495 or higher) from the website of Digital Surf:
http://www.digitalsurf.com/en/downloads.html(Easy update 32-bit or Easy update 64-bit, depending on your system)•“-1” is added to the end of the Multifocus Image (Z stacks only).

Workaround: image name can be edited manually; issue will be corrected for next release.

LAS X 3.0.14 Release Notes for Applied Systems

17