Special Issue on Advanced Micro/Nanomaterials for Various Sensor
Applications (Selected Papers from ICASI 2024)
Special Issue Information
The 10th IEEE International Conference on Applied System Innovation 2024 (IEEE ICASI2024, https://2024.icasi-conf.net/) will be held in Kyoto, Japan on April 17-21, 2024. Theconference will provide a unified communication platform for a wide range of topics ofelectrical engineering, material science, and related fields.
Various sensors and flexible optoelectronics have been attracting a great deal of attention
in recent years due to their potential applications in healthcare monitoring, biomedicine,electronic skin, wearable sensing technology, soft robotics, flat panel displays, safety
equipment, smart systems, and future space applications. The aim of this special issue is to
publish novel and high-quality research papers (experimental, theoretical, or simulationworks)
as well as review articles addressing recent advances in cutting-edge flexible electronics andsensors based on micro/nanomaterials. Research and review articles should provide acomprehensive insight into the characterization and understanding of functional
micro/nanomaterial properties with the application of scanning techniques. Manuscripts
submitted to Sensors and Materials must be not published previously or under consideration
for publication elsewhere. Potential topics include, but are not limited to:● Design, synthesis, and characterization of functional micro/nanomaterials forsensing applications and electronic devices● Chemical and gas sensors based on micro/nano sensing materials
Advanced materials for mechatronics applications● Molecular dynamics simulations and quantum chemical calculations for
micro/nanomaterials related to sensing applications and flexible electronics● Theories and principles related to micro/nanomaterials, chemical and gas sensing,and flexible electronics● Sensors and flexible electronics for future food and agricultural applications● Advanced scanning techniques for characterization of sensors and flexible electronics

Schedule
Manuscript Due: September 30, 2024
First Round of Reviews: October 31, 2024
Second Round of Reviews: November 30, 2024
Acceptance of Final papers: January 31, 2025
Publication (planned): February 28, 2025

Guest Editor
Sheng-Joue Young, Professor
Department of Electronic Engineering, National United University, Miaoli, Taiwan
youngsj@nuu.edu.tw(Attention)

As stated in Instructions to Authors in the Guidelines, the author(s) will be obliged to pay thepublication fee upon the acceptance of the manuscript for publication. If the quality of
the English of yourmanuscript does not satisfy the journal standards, the authors will bear
the proofreading fee, which will be charged with the publicationfee. Please refer to theSection 4 of the Instructions to Authors for detailed information on specific price amounts at
our website below.
https://sensors.myu-group.co.jp/permanent/Instructions%20to%20authors2019%20EN.pdf
If you have any questions, please feel free to contact the editorial staff at the address below.

Editorial Department of Sensors and Materials
MYU K.K.
1-23-3-303 Sendagi, Bunkyo-ku, Tokyo 113-0022, Japan
Tel: +81-3-3827-8549, Fax: +81-3-3827-8547
E-mail: myukk@myu-inc.jp