Ambient Light Sensor IC Series

Digital 16bit Serial Output Type
Ambient Light Sensor IC
BH1750FVI

No.10046ECT01●Descriptions
2
BH1750FVI is an digital Ambient Light Sensor IC for I C bus interface. This IC is the most suitable to obtain the ambient lightdata for adjusting LCD and Keypad backlight power of Mobile phone. It is possible to detect wide range at High resolution.
( 1 - 65535 lx ).

●Features
21) I C bus Interface ( f / s Mode Support )2) Spectral responsibility is approximately human eye response
3) Illuminance to Digital Converter
4) Wide range and High resolution. ( 1 - 65535 lx )5) Low Current by power down function6) 50Hz / 60Hz Light noise reject-function7) 1.8V Logic input interface
8) No need any external parts
9) Light source dependency is little. ( ex. Incandescent Lamp. Fluorescent Lamp. Halogen Lamp. White LED. Sun Light )210) It is possible to select 2 type of I C slave-address.
11) Adjustable measurement result for influence of optical window( It is possible to detect min. 0.11 lx, max. 100000 lx by using this function. )12) Small measurement variation (+/- 20%)
13) The influence of infrared is very small.

●Applications
Mobile phone, LCD TV, NOTE PC, Portable game machine, Digital camera, Digital video camera, Car navigation, PDA,LCD display●Absolute Maximum Ratings
Parameter

SymbolLimitsUnits

Supply Voltage

Vmax

4.5

V

Operating TemperatureTopr-40～85℃

Storage Temperature

Tstg-40～100℃

SDA Sink Current

Imax

7

mA

Power Dissipation

Pd

260※

mW

※ 70mm × 70mm × 1.6mm glass epoxy board. Derating in done at 3.47mW/℃ for operating above Ta=25℃.

●Operating Conditions
Parameter

Symbol

Min.

Typ.

Max.

Units

VCC Voltage

Vcc

2.4

3.0

3.6

V

2

VDVI

1.65

-

VCC

V

I C Reference Voltage

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BH1750FVITechnical Note

●Electrical Characteristics ( VCC = 3.0V, DVI = 3.0V, Ta = 25℃, unless otherwise noted )Parameter

Symbol

Min.

Typ.

Max.

Units

Conditions

Supply Current

Icc1

－

120

190

µA

Ev = 100 lx ※1

Powerdown Current

Icc2

－

0.01

1.0

µA

No input Light

Peak Wave Length

λp

－

560

－

nm

Measurement Accuracy

S/A

0.96

1.2

1.44

times

Sensor out / Actual lx
EV = 1000 lx ※1, ※2

Dark ( 0 lx ) Sensor out

S0

0

0

3

count

H-Resolution Mode ※3

H-Resolution Mode Resolution

rHR

－

1

－

lx

L-Resolution Mode Resolution

rLR

－

4

－

lx

H-Resolution Mode Measurement
Time

tHR

－

120

180

ms

L-Resolution Mode Measurement
Time

tLR

－

16

24

ms

Incandescent / Fluorescent Sensor
out ratio

rIF

－

1

－

times

ADDR Input ‘H’ Voltage

VAH

0.7 * VCC－－V

ADDR Input ‘L’ Voltage

VAL

－

－

0.3 * VCCV

DVI Input ‘L’ Voltage

VDVL

－

－

0.4

V

SCL, SDA Input ‘H’ Voltage 1

VIH1

0.7 * DVI－－V

DVI ≧ 1.8V

SCL, SDA Input ‘H’ Voltage 2

VIH2

1.26

－

－

V

1.65V ≦ DVI ＜1.8V

SCL, SDA Input ‘L’ Voltage 1

VIL1

－

－

0.3 * DVIV

DVI ≧ 1.8V

SCL, SDA Input ‘L’ Voltage 2

VIL2

－

－

DVI – 1.26

V

1.65V ≦ DVI ＜ 1.8V

SCL, SDA, ADDR Input ‘H’ Current

IIH

－

－

10

µA

SCL, SDA, ADDR Input ‘L’ Current

IIL

－

－

10

µA

I2C SCL Clock Frequency

fSCL

－

－

400

kHz

I2C Bus Free Time

tBUF

1.3

－

－

µs

I C Hold Time ( repeated ) START
Condition

tHDSTA

0.6

－

－

µs

I2C Set up time for a Repeated
START ConditiontSUSTA

0.6

－

－

µs

I2C Set up time for a Repeated STOP
ConditiontSUSTD

0.6

－

－

µs

I2C Data Hold TimetHDDAT

0

－

0.9

µs

2

I C Data Setup TimetSUDAT

100

－

－

ns

2

I C ‘L’ Period of the SCL Clock

tLOW

1.3

－

－

µs

2

I C ‘H’ Period of the SCL Clock

tHIGH

0.6

－

－

µs

2

VOL

0

－

0.4

V

EV = 1000 lx

2

I C SDA Output ‘L’ Voltage

IOL = 3 mA

※1 White LED is used as optical source.
※2 Measurement Accuracy typical value is possible to change '1' by "Measurement result adjustment function".
※3 Use H-resolution mode or H-resolution mode2 if dark data ( less than 10 lx ) is need.

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BH1750FVITechnical Note

●Reference Data64

1.2

100000

56

Ratio

0.8

0.6

0.4

10000

48

Measurement Result

Measurement Result

1

40
32

H-Res.
H-Res.

L-Res.

24
16

100

10

L-Res.

8

0.2

1000

1

0
0
400

500

600

700

800

900

1000

0

1100

8

16

24

32

40

48

56

1

64

Wavelength [ nm ]

1.2

1.2

1

Measurement Result

0.8
+

Ratio

Ratio

-

0.6

0.6

-

0.4

1pin

-

0.4

-

+

0.2

-90
-60

-30

0

30

60

-60

-30

90

30

H-Res.

+

60

0

90

-40

ICC @ Measurement

HalogenLight

0.6

Kripton Light

0.4
Artifical Sun
Light

0.2

0

20

40

60

80

100

0.5

1

Ratio

2

2

2.5

-40

-20

0

20

40

60

80

100

Ta [ ℃ ]Fig.10 VCC – ICC@0 Lx( POWER DOWN )www.rohm.com© 2010 ROHM Co., Ltd. All rights reserved.

4

1

VCC=3V

0.8

0.01

3.5

1.2

DVI=1.8V

0.1

3
VCC [ V ]Fig.9 VCC - ICC( During measurement )

1

0.8

Ratio

Ratio

ICC @ POWER DOWN [ uA ]

1.5

1.2

1

100

50

Fig.8 Light Source Dependency( Fluorescent Light is set to '1' )

10

80

0
0

Ta [ ℃ ]Fig.7 Measurement Accuracy
Temperature Dependency

60

100

White LED

-20

40

150

0
-40

20

200

Incandescent
Light

0.8

0

Fig.6 Dark Response

Fluorescent
Light

1

-20

Ta [ ℃ ]Fig.5 Directional Characteristics 2

1.2

Ratio

0

Angle [ deg ]Angle [ deg ]Fig.4 Directional Characteristics 1

4

2

0
-90

100000

6

+

0.2

0

10000

蛍光灯白熱灯感度比

8

0.8

1000

10

1

1pin

100

Fig.3 Illuminance Measuremnet Result 2

Fig.2 Illuminance Measurement Result 1

Fig.1 Spectral Response

10

Illuminance [ lx ]Illuminance [ lx ]

0.6

0.6

0.4

0.4

0.2

0.2

0

0
2

2.5

3

VCC [ V ]3.5

4

Fig.11 Measurement Result
VCC Dependency

3/17

1.5

2

2.5

DVI [ V ]3

3.5

Fig.12 Measurement Result
DVI Dependency

2010.04 - Rev.C

BH1750FVITechnical Note

●Block Diagram
DVI

VCC

AMP

Logic
+
I C Interface

ADC

2

SCL
SDA

PD
OSC
GND

ADDR

●Block Diagram Descriptions
・PD
Photo diode with approximately human eye response.
・AMP
Integration-OPAMP for converting from PD current to Voltage.
・ADC
AD converter for obtainment Digital 16bit data.
2・Logic + I C Interface
Ambient Light Calculation and I2C BUS Interface. It is including below register.
Data Register → This is for registration of Ambient Light Data. Initial Value is "0000_0000_0000_0000".
Measurement Time Register → This is for registration of measurement time. Initial Value is "0100_0101".
・OSCInternal Oscillator ( typ. 320kHz ). It is CLK for internal logic.
●Measurement Procedure
Power supply
Initial state is Power Down mode after
VCC and DVI supply.

State is automatically changed toPower Down mode.
Power Down

Power On

Measurement Command

Continuous Measurement

One Time Measurement

State Transition by I2C write-command.
Automatically State Transition*www.rohm.com© 2010 ROHM Co., Ltd. All rights reserved.

4/17"Power On" Command is possible to omit.

2010.04 - Rev.C

BH1750FVITechnical Note

●Instruction Set Architecture
Instruction

OpecodeComments

Power Down

0000_0000

No active state.

Power On

0000_0001

Waiting for measurement command.

Reset

0000_0111

Continuously H-Resolution Mode

0001_0000

Continuously H-Resolution Mode2

0001_0001

Continuously L-Resolution Mode

0001_0011

One Time H-Resolution Mode

0010_0000

One Time H-Resolution Mode2

0010_0001

One Time L-Resolution Mode

0010_0011

Change Measurement time
( High bit )Change Masurement time
( Low bit )01000_MT[7,6,5]
011_MT[4,3,2,1,0]

Reset Data register value. Reset command is not acceptable inPower Down mode.
Start measurement at 1lx resolution.
Measurement Time is typically 120ms.
Start measurement at 0.5lx resolution.
Measurement Time is typically 120ms.
Start measurement at 4lx resolution.
Measurement Time is typically 16ms.
Start measurement at 1lx resolution.
Measurement Time is typically 120ms.
It is automatically set to Power Down mode after measurement.
Start measurement at 0.5lx resolution.
Measurement Time is typically 120ms.
It is automatically set to Power Down mode after measurement.
Start measurement at 4lx resolution.
Measurement Time is typically 16ms.
It is automatically set to Power Down mode after measurement.
Change measurement time.
※ Please refer "adjust measurement result for influence of optical window."

Change measurement time.
※ Please refer "adjust measurement result for influence of optical window."※ Don't input the other opecode.

●Measurement mode explanation
Measurement Mode
Measurement Time.

Resolurtion

H-resolution Mode2

Typ. 120ms.

0.5 lx

H-Resolution Mode

Typ. 120ms.

1 lx.

L-Resolution Mode

Typ. 16ms.

4 lx.

We recommend to use H-Resolution Mode.
Measurement time ( integration time ) of H-Resolution Mode is so long that some kind of noise( including in 50Hz / 60Hz
noise ) is rejected. And H-Resolution Mode is 1 l x resolution so that it is suitable for darkness ( less than 10 lx )H-resolution mode2 is also suitable to detect for darkness.
●Explanation of Asynchronous reset and Reset command "0000_0111"
1) Asynchronous reset
All registers are reset. It is necessary on power supply sequence. Please refer "Timing chart for VCC and DVI power
supply sequence" in this page. It is power down mode during DVI = 'L'.
2) Reset command
Reset command is for only reset Illuminance data register. ( reset value is '0' ) It is not necessary even power supply
sequence.It is used for removing previous measurement result. This command is not working in power down mode, sothat please set the power on mode before input this command.

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BH1750FVITechnical Note

●Timing chart for VCC and DVI power supply sequence
DVI is I2C bus reference voltage terminal. And it is also asynchronous reset terminal. It is necessary to set to 'L'
supplied. In DVI 'L' term, internal state is set to Power Down mode.

after VCC is1) Recommended Timing chart1 for VCC and DVI supply.

VCC

DVI

Reset Term ( more than 1us )2) Timing chart2 for VCC and DVI supply.
( If DVI rises within 1µs after VCC supply )

VCC

DVI

Reset Term ( more than 1us )Don't care state
ADDR, SDA, SCL is not stable if DVI 'L' term ( 1us ) is not given by systems.
In this case, please connect the resisters ( approximately 100kOhm ) to ADDR without directly
connecting to VCC or GND,
because it is 3 state buffer for Internal testing.

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BH1750FVITechnical Note

●Measurement sequence example from "Write instruction" to "Read measurement result"ex1) Continuously H-resolution mode ( ADDR = 'L' )from Slave to Masterfrom Master to Slave① Send "Continuously H-resolution mode " instruction
ST

01000110

Ack00010000Ack

SP② Wait to complete 1st H-resolution mode measurement.( max. 180ms. )③ Read measurement result.
ST

0100011

1

Ack

Low Byte [ 7:0 ]High Byte [ 15:8 ]

Ack

Ack

SP

How to calculate when the data High Byte is "10000011" and Low Byte is "10010000"( 215 + 29 + 28 + 27 + 24 ) / 1.2 ≒ 28067 [ lx ]The result of continuously measurement mode is updated.( 120ms.typ at H-resolution mode, 16ms.typ at L-resolution
mode )ex2 ) One time L-resolution mode ( ADDR = 'H' )① Send "One time L-resolution mode " instruction
ST

1011100

0Ack

00100011

Ack

SP② Wait to complete L-resolution mode measurement.( max. 24ms. )③ Read measurement result
ST

1011100

1

Ack

Low Byte [ 7:0 ]High Byte [ 15:8 ]

Ack

Ack

SP

How to calculate when the data High Byte is "00000001" and Low Byte is "00010000"
84( 2 + 2 ) / 1.2 ≒ 227 [ lx ]In one time measurement, Statement moves to power down mode after measurement completion.If updated result is needthen please resend measurement instruction.

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BH1750FVITechnical Note

●Application circuit example of DVI terminal
The DVI terminal is an asynchronous reset terminal. Please note that there is a possibility that IC doesn't operate normallyif the reset section is not installed after the start-up of VCC.
(Please refer to the paragraph of "Timing chart for VCC and DVI power supply sequence" )The description concerning SDA and the terminal SCL is omitted in this application circuit example. Please design theapplication the standard of the I2C bus as it finishes being satisfactory. Moreover, the description concerning the terminal
ADDR is omitted. Please refer to the paragraph of "Timing chart for VCC and DVI power supply sequence" about the terminal
ADDR design.
ex 1) The control signal line such as CPU is connected.
BH1750FVI
0.1µF

VCC

SCL

ADDR

DVI

GND

SDA

Micro
Controller

0.1µF

ex 2) Reset IC is used.
1, For Reset IC of the Push-Pull type
BH1750FVI

0.1µF

VCC

SCL

ADDR

DVI

GND

SDA

0.1µF

RESET
Reset IC( Push-Pull type )2, For Reset IC of the Open drain output
BH1750FVI
VCC
0.1µF

1kOhm

SCL

ADDR

DVI

GND

SDA

0.1µF

RESET
Reset IC( Open drain type )ex 3) A different power supply is used.

BH1750FVI
VCC

0.1µF

V1

SCL

ADDR

DVI

GND

SDA

V2

0.1µF

※ Power supply of DVI must stand up later than power supply of VCC stand up, because it is necessary to secure reset section ( 1µs or more ).

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2010.04 - Rev.C

BH1750FVITechnical Noteex 4) LPF using CR is inserted between VCC and DVI.
This method has the possibility that the Reset section of turning on the power supply can not satisfied. cannot be satisfied.
Please design the set considering the characteristic of the power supply enough.
R1 : 1kOhm
BH1750FVI
0.1µF

VCC

SCL

ADDR

DVI

GND

SDA

C1 : 1µF◆ Notes when CR is inserted between VCC and DVI※ Please note that there is a possibility that reset section ( 1µs ) can not be satisfied because the power supply is turned on when the rise time of VCC is slow
※ When VCC is turned off, the DVI voltage becomes higher than VCC voltage but IC destruction is not occred if recommended constant( R1 = 1kOhm, C1 = 1µF ) is used.
※ Please note that there is a possibility that Reset section (1µsec) cannot be satisfied if wait time is not enough long after turning off VCC.
(It is necessary to consider DVI voltage level after turning off VCC.)

t1

VCC

t2

DVI
2.4V

0.4V
Reset

0V

Section : 1us or more

* Please do the application design to secure Reset section 1us or more after the reclosing of the power supply.

◆ Example of designing set when CR ( C = 1µF, R = 1kΩ ) is inserted between VCC and DVI with VCC=2.8V①The rise time to 0→2.4V of VCC must use the power supply of 100µs or less.
②Please wait 25ms or more after VCC turn off ( VCC <= 0.05V ), because it is necessary to secure reset section( 1µs or more ).

Rise time of power supply : 100us or less
2.8V

Time to power supply reclosing : 25ms or more
れ

VCC
DVI

2.4V

0.4V
0V

0.05V
Reset Section : 1us or more*

Please do the application design to secure Reset section 1us or more after the reclosing of the power supply.

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BH1750FVITechnical Note

●I2C Bus Access
1 ) I2C Bus Interface Timing chart
2
Write measurement command and Read measurement result are done by I C Bus interface. Please refer the formally2
specification of I C Bus interface, and follow the formally timing chart.

SDAtSU ; DAT

tr

tf

tf

tHD ; STA
HD

tLOW

tr

tBUF

SCL
tSU ; STAtHD ; STAS

S

tSU;STOtHD ; DAT

P

Sr

tHIGH
t

S

S

2) Slave Address
Slave Address is 2 types, it is determined by ADDR Terminal
ADDR = ‘H’ ( ADDR ≧ 0.7VCC ) → “1011100“
ADDR = 'L' ( ADDR ≦ 0.3VCC ) → “0100011“
3 ) Write Format
BH1750FVI is not able to accept plural command without stop condition. Please insert SP every 1 Opecode.
R/W
0

Slave Address

ST

Ack

OpecodeAck

SP4 ) Read Format
ST

R/W
1

Slave Address

7

2

26

Ack

Low Byte [7:0]
25 24 23 22

15

2

21

20

High Byte [15:8]
214 213 212 211 210 29 28

Ack

Ack

SP

from Slave to Masterfrom Master to Slaveex )High Byte = "1000_0011"
Low Byte = "1001_0000"
15
9
8
7
4
( 2 + 2 + 2 + 2 + 2 ) / 1.2 ≒ 28067 [ lx ]* I2C BUS is trademark of Phillips Semiconductors. Please refer formality specification.

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BH1750FVITechnical Note

●Adjust measurement result for influence of optical window. ( sensor sensitivity adjusting )BH1750FVI is possible to change sensor sensitivity. And it is possible to cancel the optical window influence ( difference with/ without optical window ) by using this function. Adjust is done by changing measurement time. For example, whentransmission rate of optical window is 50% ( measurement result becomes 0.5 times if optical window is set ), influence of
optical window is ignored by changing sensor sensitivity from default to 2 times
Sensor sensitivity is shift by changing the value of MTreg ( measurement time regisiter ). MTreg value has to set 2 times iftarget of sensor sensitivity is 2 times. Measurement time is also set 2 times when MTreg value is changed from default to 2
times.
ex) Procedure for changing target sensor sensitivity to 2 times.
Please change Mtreg from ”0100_0101” ( default ) to ”1000_1010” ( default * 2 ).
1) Changing High bit of MTreg
ST

Slave Address

R/W
0

Ack

01000_100

Ack

SP

R/W
0

Ack

011_01010

Ack

SP

R/W
0

Ack

0001_0000

Ack

SP2) Changing Low bit of MTreg
ST

Slave Address3) Input Measurement Command
ST

Slave Address* This example is High Resolution mode, but it accepts the other measurement.

4) After about 240ms, measurement result is registered to Data Register.
( High Resolution mode is typically 120ms, but measurement time is set twice. )The below table is seeing the changable range of MTreg.

changable
range of MTreg

binarydecimalMin.
0001_1111( sensitivity : default * 0.45 )31( sensitivity : default * 0.45 )Typ.
0100_0101
default
69
default

Max.
1111_1110( sensitivity : default * 3.68 )254( sensitivity : default * 3.68 )It is possilbe to detect 0.23lx by using this function at H-resolution mode. And it is possilbe to detect 0.11lx by using thisfunction at H-resolution mode2.
The below formula is to calculate illuminance per 1 count.
H-reslution mode : Illuminance per 1 count ( lx / count ) = 1 / 1.2 *( 69 / X )H-reslution mode2 : Illuminance per 1 count ( lx / count ) = 1 / 1.2 *( 69 / X ) / 2
1.2 : Measurement accuracy
69 : Default value of MTreg ( dec )X : MTreg value
The below table is seeing the detail of resolution.
Mtreg の値

lx / countat H-resolutin modelx / countat H-resolution mode2

0001_1111

1.85

0.93

0100_0101

0.83

0.42

1111_1110

0.23

0.11

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11/17

2010.04 - Rev.C

BH1750FVITechnical Note

●H-Resolution Mode2
H-resolution mode2 is 0.5lx ( typ. ) resolution mode. It is suitable if under less than 10 lx measure ment data is necessary.
This measurement mode supports " Adjust measurement result for influence of optical window ". Please refer it. It is possible
to detect min. 0.11 lx by using H-resolution mode2.
○ Instruction set architecture for H-resolution mode2
Instruction
OpecodeContinuously H-Resolution Mode2

0001_0001

One Time H-Resolution Mode2

0010_0001

Comments
Start measurement at 0.5lx resolution.
Measurement Time is typically 120ms.
Start measurement at 0.5lx resolution.
Measurement Time is typically 120ms.
It is automatically set to Power Down mode after measurement.

○ Measurement sequence example from "Write instruction" to "Read measurement result"ex) Continuously H-resolution mode2 ( ADDR = 'L' )from Slave to Masterfrom Master to Slave① Send "Continuously H-resolution mode2 " instruction
ST

01000110

Ack00010001

Ack

SP② Wait to complete 1st H-resolution mode2 measurement.( max. 180ms. )③ Read measurement result.

ST

0100011

1

26

25

Ack

Low Byte [7:0]
24 23 22 21

20High Byte [15:8]
214 213 212 211 210 29 28 27

2-1

Ack

Ack

SP

How to calculate when the data High Byte is "00000000" and Low Byte is "00010010"( 23+ 20 ) / 1.2 ≒ 7.5 [ lx ]www.rohm.com© 2010 ROHM Co., Ltd. All rights reserved.

12/17

2010.04 - Rev.C

BH1750FVITechnical Note●Terminal Description
PIN No.
Terminal Name

1

Equivalent Circuit

VCC

Function

Power Supply Terminal

2

VCC

2

ADDR

I C Slave-address Terminal
ADDR = ‘H’ ( ADDR ≧ 0.7VCC )“1011100“ADDR = 'L' ( ADDR ≦ 0.3VCC )“0100011“
ADDR Terminal is designed as 3 state buffer forinternal test. So that please take care of VCC
and DVI supply procedure.Please see P6.

3

GND

GND Terminal

4

SDA

I2C bus Interface SDA Terminal

5

DVI

SDA, SCL Reference Voltage Terminal
And DVI Terminal is also asynchronous Resetfor internal registers.So that please set to 'L'( at least 1µs, DVI <= 0.4V ) after VCC is
supplied. BH1750FVI is pulled down by
150kOhm while DVI = 'L'.

6

SCL

150kΩ

I2C bus Interface SCL Terminal※These values are design-value, not guaranteed.

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13/17

2010.04 - Rev.C

BH1750FVITechnical Note

●Package OutlinesAA

Lot No.

Product No.

WSOF6I ( Unit : mm )●About an optical design on the device
0.8 mm

1.3 mm
Min.0.4 mm
Min.0.4 mm

PD area ( 0.25 mm x 0.3 mm )Please design the optical window so thatlight can cover at least this area.
Min.0.4 mm

Min.0.4 mm

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14/17

2010.04 - Rev.C

BH1750FVITechnical Note

●The method of distinguishing 1pin.
There is some method of distinguishing 1pin.
① Distinguishing by 1Pin wide-lead② Distinguishing by die pattern③ Distinguishing by taper part of 1-3pin side
② (by die patern) is the easiest method to distinguish by naked eye.

A

A

②

③
Production code①

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2010.04 - Rev.C

BH1750FVITechnical Note

●Cautions on use
1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage ( Vmax ), temperature range of operating conditions( Topr ), etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open
circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to takephysical safety measures including the use of fuses, etc.
2) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electrictransient.
3) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting canbreak down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between
the terminal and the power supply or the GND terminal, the ICs can break down.
4) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
5) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig.
After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition,
for protection against static electricity, establish a ground for the assembly process and pay thorough attention to thetransportation and the storage of the set PCB.
6) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of theparasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals; such as to apply to the input terminals avoltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage tothe input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage isapplied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value ofelectrical characteristics.
7) Thermal design
Perform thermal design in which there are adequate margins by taking into account the power dissipation ( Pd ) in actual
states of use.
8) Treatment of package
Dusts or scratch on the photo detector may affect the optical characteristics. Please handle it with care.
9) Rush current
When power is first supplied to the CMOS IC, it is possible that the internal logic may be unstable and rush current may
flow instantaneously. Therefore, give special consideration to power coupling capacitance, power wiring, width of GND
wiring, and routing of connections.
10) The exposed central pad on the back side of the package
There is an exposed central pad on the back side of the package. But please do it non connection. ( Don't solder, anddon't do electrical connection ) Please mount by Footprint dimensions described in the Jisso Information for WSOF6I. This
pad is GND level, therefore there is a possibility that LSI malfunctions and heavy-current is generated.

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16/17

2010.04 - Rev.C

BH1750FVITechnical Note

●Ordering part number

B

H

1

Part No.

7

5

0

F

Part No.

V

I

Package
FVI: WSOF6I

-

T

R

Packaging and forming specification
TR: Embossed tape and reel

WSOF6I<Tape and Reel information>

1.6 ± 0.1
(MAX1.8 include BURR)
0.5 0.5

0.3
4

4

5

0.75MAX
0.27 ±0.05

23000pcsTR
The direction is the 1pin of product is at the upper right when you hold( reel on the left hand and you pull out the tape on the right hand

(1.2)

2

0.3

)

1pin

(1.4)
3

3

0.5

Embossed carrier tape

Quantity6(1.5)(0.45)
1

0.525

Tape

Directionof feed(0.15)

3.0 ±0.15

2.6 ±0.1(MAX2.8 include BURR)

6

0.3

1

0.275

0.145 ±0.05

S0.08 S
0.22 ± 0.05
0.08 M

Direction of feed
(Unit : mm)

www.rohm.com© 2010 ROHM Co., Ltd. All rights reserved.

Reel

17/17

∗ Order quantity needs to be multiple of the minimum quantity.

2010.04 - Rev.C

Notice

Notes
No copying or reproduction of this document, in part or in whole, is permitted without theconsent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter"Products"). If you wish to use any such Product, please be sure to refer to the specifications,which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of suchinformation, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of andexamples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM andother parties. ROHM shall bear no responsibility whatsoever for any dispute arising from theuse of such technical information.
The Products specified in this document are intended to be used with general-use electronicequipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, aProduct may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device orsystem which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of anyof the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required toobtain a license or permit under the Law.

Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.

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R1010A