Version 2.0

Proximity Communication Interface
Implementation Specifications
Version 2.0

MARCH 2004
New Media Development Association

Version 2.0

Foreword
The New Media Development Association (NMDA) has been involved in the effort of disseminating IC
cards for many years.
Specifically, since the year 1998, with consideration to the progress of standardization work regarding
contactless IC cards (ISO/IEC 14443) within international standardization bodies, NMDA proceeded with
developing a "New Generation IC Card Common System" (in accordance with the third supplementarybudget of the 1998 fiscal year) based upon an innovative architecture which foundation lays in feature richhighly secure contactless IC cards that are expected to become popular in the future, and as a result
published the the first version of this document as "Proximity Communication Interface Implementation
Specification Version 1.0" on December of the year 2000.
Within this Implementation Specification, where it is difficult to ensure compatibility by only complying with
International Standards, we have categorized International Standards in progress of standardization as"Basic Specifications", and to ensure compatibility, added specifications reflecting results of verification
experiments as "Extended Specifications" and "Informative" specifications, so that this Specification willserve its purpose as an implementation specification.
At end of the 2000 fiscal year, evolving from the fruits of the "New Generation IC Card Common System,"the "Research Project on Cities Equipped with Information Technologies through Dissemination of IC
Cards" (in accordance with the third supplementary budget of the 2000 fiscal year) was started assuming arole as forerunning issuer of basic resident register cards. This project went to install 120 million
contactless IC cards and 8,000 proximity coupling devices (PCD. i.e. IC card reader/writers) in 21 regions
nation-wide (54 municipalities) and in each region, performed verification experiments of various services
that reflect regional attributes, and ensuring interoperability and compatibility among the different
combinations of products from various vendors was an important verification factor. This lead to thedecision of revising the Implementation Specification, adding specifications such as those for Open type
PCDs which are capable of operating by placing card on the device or holding it near the device. The
revised edition was published as "Proximity Communication Interface Implementation Specification
Version 1.1" on July of the year 2001.
From August 25th, 2003, municipalities began issuing basic resident register cards according toapplications from its residents. Preparation for the procurement of the IC cards and PCDs by the local
government and securement of their compatibility reflected the outcome of the previously mentioned
project.
This Specification is a revised version of the previous version 1.1. The following factors were taken into
consideration in the production of this revised edition.
– Although Version 1.1 was produced on the basis of the latest documents available relating to
ISO/IEC 14443 as of February 2001, since that time, work at ISO and standardization as JIS haveprogressed, and it became necessary to comply with those standards.

Version 2.0– After the public release of Version 1.1 of the specification, ensuring compatibility of IC cards that use
contactless interfaces, such as those used for resident basic register cards, has become
increasingly important, which made it necessary to produce an even more precise Implementation
Specification.
– Based on these background necessities, enhancements and additions they may affect compatibility,
such as updating specifying to accommodate the latest standards, revising according to theamendments to the domestic Radio Law, addition of specifications regarding noise and antenna
coupling levels, addition of specifications regarding resonance frequency, addition of retry methods
and number of retries, addition of compatibility test methods, and addition of references to highspeed specifications under discussion at international standardization bodies, have been made to
the provisions to eliminate ambiguity and to provide notes of consideration.
– The format and contents of this specification have been revised significantly so that the BasicSpecifications portion will refer to JIS and ISO by quoting their provisions, and with focus on"Compatibility Improvement Specifications" to ensure compatibility and "Operation Diversification
Specifications" to accommodate diversification in operation of proximity IC cards, areas of caution
and consideration have been noted, and background information leading to these provisions havebeen added.
We hope that this specification will assist in the future proliferation of IC cards and IC card systems.
Furthermore, be aware of the following when referring to or using this Implementation Specification.
– The functions, testing methods and so forth specified in this Implementation Specification is subject
to addition, revision, or deletion during the course of the efforts scheduled to be conducted in the
future by this association.
– This association is not responsible in any way for the contents of this Implementation Specificationor the results of their use, including industrial property rights and so forth.
In conclusion, the association would like to express its deep appreciation to the members of the"Compatibility WG" (located within the NMDA) for its numerous contributions and constructive discussions,and to those persons at the Ministry of Economics, Trade and Industry for their generous support of thoseefforts pertaining to the revision of this Implementation Specification.

MARCH 2004
New Media Development Association

Version 2.0

Table of Contents
1 Scope and Characteristics of this Implementation Specification ............................................................... 1
1.1 Scope.................................................................................................................................................. 1
1.2 Assumed PICC and PCD.................................................................................................................... 2
1.3 Characteristics of this Implementation Specification ........................................................................... 4
1.4 Description Convetion of this Implementation Specification............................................................... 5
1.5 Structure ............................................................................................................................................. 6
2 Normative References............................................................................................................................... 6
3 Terms and Definitions, Symbols and Abbreviated Terms.......................................................................... 8
3.1 Terms.................................................................................................................................................. 8
3.2 Symbols and Abbreviated Terms ...................................................................................................... 11
4 Physical Characteristics .......................................................................................................................... 13
4.1 PICC ................................................................................................................................................. 13
4.2 PCD .................................................................................................................................................. 13
5 Electrical Charactristics ........................................................................................................................... 13
5.1 PICC ................................................................................................................................................. 13
5.1.1 Antenna Shape........................................................................................................................... 13
5.1.2 Operating Noise ......................................................................................................................... 14
5.1.3 Resonance Frequency ............................................................................................................... 14
5.1.4 Operating Field........................................................................................................................... 14
5.2 PCD .................................................................................................................................................. 15
5.2.1 Antenna Shape........................................................................................................................... 15
5.2.2 Operating Noise ......................................................................................................................... 16
5.2.3 Coupling Degree between Antennea.......................................................................................... 16
5.2.4 Generated Magnetic Field .......................................................................................................... 16
6 Signal Transmission ................................................................................................................................ 16
6.1 Initial Communication of the PICC .................................................................................................... 16
6.2 Signal Interface ................................................................................................................................. 16
6.3 Communication Signal Interface Type A........................................................................................... 18
6.3.1 Signal transmission from PCD to PICC ...................................................................................... 18
6.3.2 Signal transmission from PICC to PCD ...................................................................................... 20
6.4 Communication Signal Interface Type B........................................................................................... 20
6.4.1 Signal transmission from PCD to PICC ...................................................................................... 21
6.4.2 Signal transmission from PICC to PCD ...................................................................................... 22
7 Initialization and Anticollision................................................................................................................... 23
7.1 Polling ............................................................................................................................................... 23
7.2 Initialization and Anticollision of PICC Type A .................................................................................. 25
7.2.1 Bit Rate ...................................................................................................................................... 25
7.2.2 Frame Format and Timing .......................................................................................................... 25iVersion 2.0
7.2.3 PICC States Description............................................................................................................. 28
7.2.4 Select Sequence ........................................................................................................................ 28
7.3 Initialization and Anticollision of PICC Type B .................................................................................. 31
7.3.1 Character, Frame Format and Timing ........................................................................................ 31
7.3.2 REQB/WUPB Command ............................................................................................................ 33
7.3.3 Answer to Request (ATQB) ........................................................................................................ 33
7.3.4 ATTRIB Command ..................................................................................................................... 34
8 Transmission Control Sequence ............................................................................................................. 35
8.1 Protocol Activation of PICC Type A .................................................................................................. 35
8.2 Protocol Activation of PICC Type B .................................................................................................. 35
8.3 Half-Duplex Block Transmission Protocol ......................................................................................... 35
8.4 Protocol Deactivation of PICC Type A and Type B ........................................................................... 35
8.5 Protocol Scenarios............................................................................................................................ 36
8.6 Components of the Blocks and Frames ............................................................................................ 36
8.7 １４４４３−４ Transmission Control Matrix of Protocol ................................................................ 37
9 Unit Tests ................................................................................................................................................ 39
9.1 General Requirements...................................................................................................................... 39
9.1.1 Test Environment ....................................................................................................................... 39
9.1.2 Pre-conditioning ......................................................................................................................... 39
9.1.3 Default Tolerance ....................................................................................................................... 39
9.1.4 Total Measurement Uncertainty ................................................................................................. 39
9.2 Test Content ..................................................................................................................................... 39
9.3 Test content for the PICC under test................................................................................................. 42
9.3.1 PICC Load Modulation Amplitude Test ...................................................................................... 42
9.3.2 Reception Test ........................................................................................................................... 44
9.3.3 Resonance Frequency ............................................................................................................... 44
9.3.4 Maximum Field Strength Application Test .................................................................................. 45
9.3.5 Power Transmit Interference Test for Double Card Operations.................................................. 46
9.3.6 PICC Dynamic Test (Informative)............................................................................................... 46
9.3.7 Protocol Timing Characteristics (Informative)............................................................................. 48
9.4 Test Content for the PCD Under Test ............................................................................................... 50
9.4.1 Field Strength ............................................................................................................................. 50
9.4.2 Power Transfer Test................................................................................................................... 50
9.4.3 Modulation Waveform ................................................................................................................ 51
9.4.4 Reception Ability of Load Modulation Signal (Informative) ......................................................... 52
9.4.5 Temperature Rise Test (Informative).......................................................................................... 53
9.5 Test Apparatus for Unit Tests ........................................................................................................... 53
9.5.1 Calibration Coil ........................................................................................................................... 53
9.5.2 Test PCD.................................................................................................................................... 54
9.5.3 Test PCD-S ................................................................................................................................ 54ii

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9.5.4 Reference PICC ......................................................................................................................... 57
10 External Communication Protocol (Informative) .................................................................................... 63
10.1 Scope.............................................................................................................................................. 63
10.2 Interface Specification of the Reader/Writer Device Control API .................................................... 65
10.2.1 Overview of the Common Interface .......................................................................................... 65
10.2.2 List of Major Interface Functions .............................................................................................. 66
10.2.3 Procedures of Using the Common Interface ............................................................................ 67
10.2.4 Function Details........................................................................................................................ 68
10.3 Communication Sequence.............................................................................................................. 75
10.3.1 Normal Sequence Examples .................................................................................................... 75
10.3.2 Abnormal Sequence Examples ............................................................................................... 80
10.3.3 Notes on Communication Sequence ........................................................................................ 84
11 Cross Tests (Informative) ...................................................................................................................... 86
11.1 Common Testing Conditions........................................................................................................... 86
11.1.1 Selection of Test Method.......................................................................................................... 86
11.1.2 Test Environment ..................................................................................................................... 86
11.1.3 Pre-test Considerations............................................................................................................ 86
11.1.4 Pass-Fail Decisions.................................................................................................................. 87
11.2 Compatibility Test of Single Card Operations with Insertion Type PCDs ........................................ 87
11.2.1 List of Tests .............................................................................................................................. 87
11.2.2 Test Combinations ................................................................................................................... 88
11.2.3 PICC Insertion Direction........................................................................................................... 88
11.2.4 Test Contents and Pass-Fail Criteria........................................................................................ 88
11.2.5 Processing Flow ....................................................................................................................... 89
11.3 Compatibility Test of Single Card Operations with Open Type PCDs ............................................. 92
11.3.1 List of Tests .............................................................................................................................. 92
11.3.2 Test Combinations ................................................................................................................... 92
11.3.3 Testing Point and Direction of PICC......................................................................................... 92
11.3.4 Test Contents and Pass-Fail Criteria........................................................................................ 94
11.3.5 Processing Flow ....................................................................................................................... 95
11.4 Compatibility Test for Double Card Operations............................................................................... 98
Explanations............................................................................................................................................... 99
Purpose of Stipulation............................................................................................................................. 99
Purpose of Revision................................................................................................................................ 99
Issues that were raised during discussion ............................................................................................ 100
Document Format.............................................................................................................................. 100
Description Regarding Radio Law ..................................................................................................... 100
Measurement of Field Using Calibration Coil .................................................................................... 100
Compatibility of Open Type PCDs and PICCs .................................................................................. 101
Calibration of Test PCD-S ................................................................................................................. 101
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External Communication Protocol (High Level Interface) .................................................................. 102
Reasons for stipulating individual provisions ........................................................................................ 102
Subject area: PICC operation noise .................................................................................................. 102

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1 Scope and Characteristics of this Implementation Specification
1.1 ScopeThis Implementation Specification covers the areas shown in Figure 1.1 regarding communication featuresof Proximity IC Cards (PICCs) and Proximity Coupling Devices (PDCs).
Upper device

PICC (Proximity IC Card)

Card processing
Application

Application on
PICC

Command Control

Command Processing

Protocol Control

Protocol Processing

Scope of Specification

Card Type Processing(Type A/Type B)

ＰCD(Reader/Writer)

Card Type Control

Card Type Processing(Type A/Type B)

PCD Control

PCD Processing

Port

Port

Figure 1.1 – Scope of the Proximity Communication Interface Implementation
Specifications
The subject PICC and PCD of this Implementation Specification are PICC with RF signal interfaces ofType A and Type B as specified in the ISO/IEC 14443-2 (JIS X 6322-2) Specification and PCDs that arecapable of driving both types of PICCs.
The relationship between the subject area of this Implementation Specification and the Standard
Specifications are shown in Table 1.1. Standard Specifications as referred to in this Implementation
Specification are the JIS and ISO/IEC standards specified in Table 1.1.

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Table 1.1 – Scope of the Proximity Communication Interface Implementation Specifications
Subject Area
Physical characteristics of PICC
Electrical characteristics of the PICC and PCD

Associated Standard Specification
JIS
ISO/IECJIS X 6322-1
ISO/IEC 14443-1
JIS X 6322-2,
ISO/IEC 14443-2,
6322-3, 6322-4
14443-3, 14443-4

Verification test methods of the PICC and PCD

JIS X 6305-6

ISO/IEC 10373-6
ISO/IEC 10373-6/AM2

Interface between PCD and upper device

No applicable standard

Cross test methods of the PICC and PCD

No applicable standard

1.2 Assumed PICC and PCD
This Implementation Specification assumes PICCs with enhanced security features enabling them to be
used for a wide variety of purposes. The following are considered.
(1) PICCs with encryption coprocessors
The PICC assumed by the Standard Specification targets a communication distance of approximately 10
cm and its control circuits are configured with wired logic and other components, having a low electric
power consumption (assuming approximately 5 mW). On the other hand, PICCs that perform highlysophisticated encryption (ex. RSA signature generation) require encryption processors for processing, andconsume more power (assuming approximately 50 mW).
This Implementation Specification specifically assumes PICCs with encryption coprocessors enabling them
to be used for a wide variety of purposes.
(2) Single Card Operations and Double Card Operations
Along with operations using a combination of a single PCD and a single PICC (single card operations),
operations using multiple PICCs could also be assumed as a general way of using the cards. This
specification mainly addresses operations using two PICCs (double card operations) which are especiallyin demand.
– Single card operations
Operation using 1 PICC on 1 PCD at any one time.
This operation mode is used for systems that assume specific application processing, such as autofeeding slot-in type PCDs and gate processing with special purpose PICCs.
– Double card operations
Of operations that process and communicate with multiple PICCs simultaneously, this type of operation
assumes that a maximum of two PICCs are involved in the operation.
This assumption has been decided on the basis that, of the operations that use multiple PICCs,
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operations using two PICCs are in higher demand, for example in cases where one PICC would be
used for applications while the other will be used for settling payments.
While the Standard Specifications assume single card operation, caution is required in that, depending on
which of these operation forms is assumed, the resonance frequency of the PICC and other design
conditions vary.
Although a PICCs premised on double card operations can also be used for single card operations
enabling it to cover both forms of operations, since a system with the longest communication distance aspossible may be implemented on the premise of single card operations, this Implementation Specificationconsiders and describes both PICCs premised on single card operations and PICCs premised on two card
operation.
(3) PCD types
This specification addresses Open type PCDs and Insertion type PCDs.
– Open type PCDs
These are PCDs that communicate by being touched with the PICC or by bringing the PICC into close
proximity of the PCD operating range. Other than "touch-and-go" type PCDs that are used in gateapplications, there are types that are operated by placing the PICC appressed on top.
– Insertion type PCDs
These are PCDs that communicate by having the PICC inserted into a designated slot of the PCD.
There are PCDs that require manual insertion and extraction as well as those that feed PCDs
automatically.
(4) Touch operations and appressed operations
There are two types of PICC operations depending on the system.
– Touch operations
This is an operation type where activation and communication are performed during the approaching
and touching of the PICC on the surface of the PCD.
Major application areas are ticket gate admittance processing for gate passing (touch-and-go) andadmittance certification processing for room entry management. In these cases, a situation where a
PICCs gradually approach a field generated by the PCD will occur.
The communication distance assumed is 0 mm to over 20 mm, and a displacement diameter of over 20mm.
– Appressed operations
This is an operation type where communication is performed when the PICC is appressed against thesurface of a PCD.
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Major applications include update of important date such as financial settlements, card issuing, anddownloading. In this case, the distance between the PICC and PCD is very near making the couplinglevel between the antennae high, which may have effect on the power and data transmit between the
PICC and PCD.
The communication distance assumed is 0 mm to approximately 5mm, and a displacement diameter ofapproximately 5 mm.
The Standard Specification assumes touch operations and gives low consideration to ensuring
compatibility of appressed operation situations. This Implementation Specification addresses andstipulates provisions for improving compatibility specific to both operation modes described above.
1.3 Characteristics of this Implementation Specification
This Implementation Specification attempts to ensure interoperability and compatibility of various types of
PICCs and PCDs of numerous manufacturers by serving to standardize antenna characteristics,
resonance characteristics and various other parameters at the production level not defined by theStandard Specification in order to improve compatibility of PICCs and PCDs.
(1) Improving Compatibility of PICCs and PCDs
This Implementation Specification stipulates provisions for improving compatibilities of PICCs and PCDs
assumed in section 1.2 of this specification. However, considerations have also been given to allow acertain degree of freedom in the design of PICCs and PCDs. It should therefore be noted that this
implementation specification does not unequivocally guarantee the compatibility of PICCs and PCDs.
In order to guarantee compatibility, users of this Implementation Specification are expected to perform the
PICC and PCD unit tests indicated in Chapters 9, along with the operation tests (cross tests) of PICCs and
PCDs which will actually be used in the IC card system to be applied. The details of the methods for crosstests are specified in Chapter 11.
(2) The Necessity for Provisions not Stipulated in Standard Specifications
The Standard Specifications specify specifications oriented toward maintaining higher levels of extendibility(or diversity).
Furthermore, the specifications assume touch operations. As such, for example, the operating field of a
PICC is defined to "operate as intended continuously between Hmin (1,5 A/m) and Hmax (7,5 A/m)," andthe diameter of a Test PC Antenna is 15 cm, which is large compared to commonly used PCDs.
Thus, the tests assume that the PICCs and PCDs are calibrated at a distance where they will not affecteach other, and assume a uniform magnetic field will be generated.
However, when the PICCs and PCDs come in physically close contact where the distance is such that it
will affect the physical and electrical characteristics of each other's antennae, the magnetic field sensed by
the measurement equipment with a uniform magnetic field will be different from what is sensed by actual
PICCs, requiring caution to be exercised.
4Version 2.0(3) Interface to Upper Applications
The application interface (API) is described in terms of revised content, based on the "Research Project on
Cities Equipped with Information Technologies – Proximity Coupling Device Common Interface
Specification Version 1.1" which has actually been adopted by municipalities.
(4) Required Specifications other than the Standard Specification
It is necessary to add the matters indicated below not described in the Standard Specification for thereasons described in the previous section. In other words, these are the important points of thisImplementation Specification.
PICC Detail Specifications (Antenna shape, resonance frequency)
Unit verification test methods of PICCs (Power transfer interference, dynamic tests, etc.)
Unit verfication test methods of PCDs (Tests using reference PICC-S/M/L, etc.)
PCD upper interface (informative)
Cross test methods of the PICC and PCD (informative)
1.4 Description Convetion of this Implementation Specification
Within this Implementation Specification, provisions specified by the Standard Specifications are only
referred to by quotation, while matters that are necessary to be added, such as considerations to diverse
implementation methods and operation modes, are described based on the following four perspectives.
Compatibility Improvement Specifications:
Provisions considered as necessary to improve interoperability and compatibility of PICCs and PCDs.
Operation Diversification Specifications:
Provisions considered as necessary when assuming diverse operation modes.
Specifically, provisions pertaining to each of the single card operations/double card operations, Open type
PCDs/Insertion type PCDs, touch operation modes/appressed operation modes.
Considerations:
While not being provisions of this Implementation Specification, matters of consideration to further improve
interoperability and compatibility of PICCs and PCDs.
Explanatory Notes:
Explanatory notes to deepen common understanding regarding provisions of the Standard Specifications.
While the matters added are explicitly categorized and tagged as "Operation Diversification
Specifications," "Compatibility Improvement Specifications," "Considerations," or "Explanatory Notes," ifthere are provisions not explicitly categorized, those shall be considered as "Compatibility Improvement
Specifications."
Furthermore, for major added provisions, the reasons for the additions may also be explicitly noted in the"Explanatory Notes."5Version 2.0
1.5 Structure
Based on the assumptions, characteristics and description conventions as provided above, thisImplementation Specification stipulates matters of features regarding contactless communication, as
specified in Table 1.2.

Ch
pt.
4
5

Subject
Area
PhysicalcharacteristicsElectricalcharacteristics6

Signaltransmission

7

Initialization
andanticollision

8

Transmission
protocolUnit tests

9

10
11

External
communicati
on protocol
Cross tests

Table 1.2 – Structure of this Implementation Specification
Description
Associated Standard
Specification
Stipulates physical specifications and operating
JIS X 6322-1
temperature of PICCs and PCDs, and specifies
ISO/IEC 14443-1
some considerations.
Stipulates antenna shape and strength of
JIS X 6322-2
operating/generated magnetic field of PICCs andISO/IEC 14443-2
PCDs, and specifies some considerations for
operational noise.
Stipulates initial communication and signal
JIS X 6322-2
interfaces.
ISO/IEC 14443-2
In addition, describes informative provisions for
ISO/IEC 14443-2/ FPDAM2
high-speed communication.
Stipulates initial communication and signal
JIS X 6322-3
interfaces.
ISO/IEC 14443-3
In addition, describes informative provisions for
ISO/IEC 14443-3/ FPDAM1
high-speed communication.
Stipulates the communication sequence.
JIS X 6322-4
ISO/IEC 14443-4
Stipulates unit test methods for the PICCs and
JIS X 6305-6
PCDs specified in this Implementation
ISO/IEC 10373-6
Specification.
ISO/IEC 10373-6/ FPDAM1
ISO/IEC 10373-6/AM2
Stipulates informative interface specifications of
the PCD control API.
Stipulates test methods for evaluatinginteroperability and compatibility of a PICCs and
PCDs.

2 Normative References
The following normative documents contain provisions referenced in this text. While the following
normative documents are the most recent at the time of the stipulation of this Implementation
Specification, parties are encouraged to investigate the possibility of applying the most recent editions of
the normative documents indicated below.
JIS X 6305-6:2001

Test Methods for Identification Cards – Part 6: IC Cards Without External Terminals– Proximity Cards

JIS X 6322-1:2001

IC Cards Without External Terminals – Part 1: Physical Characteristics

JIS X 6322-2:2001

IC Cards Without External Terminals – Part 2: Power Transfer and Signal Interface

JIS X 6322-3:2001

IC Cards Without External Terminals – Part 3: Initialization and Anticollision

JIS X 6322-4:2002

IC Cards Without External Terminals – Part 4: Transmission Protocol

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ISO/IEC 10373-6:2001
Identification cards – Test methods – Part6: Proximity cards
ISO/IEC 10373-6/AM2:2003
Identification cards – Test methods– Part6: Proximity cards
Amendment 2: Improved RF test methods
ISO/IEC 14443-1:2000
Identification cards – Contactless integrated circuit(s) cards – Proximity cards– Part1: Physical characteristics
ISO/IEC 14443-2:2001
Identification cards – Contactless integrated circuit(s) cards – Proximity cards– Part 2: Radio frequency power and signal interface
ISO/IEC 14443-3:2001
Identification cards – Contactless integrated circuit(s) cards – Proximity cards– Part 3: Initialization and anticollision
ISO/IEC 14443-4:2001
Identification cards – Contactless integrated circuit(s) cards – Proximity cards– Part 4: Transmission protocol
Explanatory Notes:
While ISO/IEC 10373-6/AM2:2003 is already published (approved as International Standard) at the time ofthe stipulation of this Implementation Standard, it is not yet approved as a Japanese Industry Standard.
Considerations:
While the following documents are not yet approved as an International Standard at the time of the
stipulation of this Implementation Standard, certain portions have been referenced within thisImplementation Standard. Note that these may be revised since they are still under discussion.
ISO/IEC 10373-6:2001/FPDAM1 (Date: 2003-07-03)
Identification cards - Test methods – Part6: Proximity cards
Amendment 1: Protocol test methods for proximity cards
ISO/IEC 14443-2:2001/FPDAM2 (Date: 2003-07-22)
Identification cards – Contactless integrated circuit(s) cards – Proximity cards– Part 2: Radio frequency power and signal interface
Amendment 2: Bit rates of fc/64, fc/32 and fc/16
ISO/IEC 14443-3:2001/FPDAM1 (Date: 2003-07-18)
Identification cards – Contactless integrated circuit(s) cards – Proximity cards– Part 3: Initialization and anticollision
Amendment 1: Bit rates of fc/64, fc/32 and fc/16

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3 Terms and Definitions, Symbols and Abbreviated Terms

3.1 Terms
Definitions for major terms used in this Implementation Specification are as follows.
Proximity IC Card (PICC)
A terminal-less IC card that communicates by coupling in a proximity magnetic field of a coupling device.
Proximity Coupling Device (PCD)
Generally referred to as reader/writer devices, PCDs use inductive coupling to provide power to PICCs
and also to control the data exchange with PICCs.
Coupling Degree between Antennae
The degree of coupling between the PICC antenna and the PCD antenna when electromagnetic
induction is performed.
Single Card Operations
Operation using 1 PICC on 1 PCD at any one time.
Double Card Operations
Of operations that process and communicate with multiple PICCs simultaneously, this type of operation
assumes that a maximum of two PICCs are involved in the operation.
Open Type PCD
PCDs that communicate by touching or bringing the PICC into close proximity of the PCD operating
range.
Insertion Type PCD
PCDs that communicate by inserting the PICC into a designated slot of the PCD.
Touch Operation
An operation type where activation and communication are performed during the approaching andtouching of the PICC on the surface of the PCD.
Appressed Operation
An operation type where communication is performed when the PICC is appressed against the surface
of a PCD.
Byte
A byte consists of 8 bits of data which are designated as b1 through b8. b8 is the most significant bit(MSB) while b1 is the least significant bit (LSB).
Bit duration
Time for a single bit to determine its logical state. The bit length unit (time) is defined by "etu" where etu
is calculated according to the following formula.
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1 etu = 128 / (D × fc), where D is either 1, 2, 4, or 8.
Since the initial value of divisor D is 1, the initial value of etu is as shown below.
1etu = 128 /fc
Where fc is the carrier frequency as defined in JIS X 6322-2.
Modulation Index
If the modulated signal peak amplitude is "a" and minimum amplitude is "b", the modulation index is asfollows.
Modulation index = (a - b)/(a + b)
Modulation index is normally expressed in percentage.
Binary phase shift keying
Phase modulation method to associate two phase state possibilities 180° apart with a logical value.
NRZ-L
A method of bit coding whereby a logical state of a signal during a bit duration is represented by one of
the two defined physical states of a carrier frequency (fc).
Subcarrier
A frequency (fs) which modulates a carrier frequency (fc).
Frame
A frame is a series of data bits and optional error detection bits, with frame delimiters at start and end.
Note: Type A PICCs use standard frames defined as Type A PICCs and Type B PICCs use standard
frames defined as Type B PICCs.
TR0
Guard time beginning at the end of transmission by a PCD and ending when generation of subcarrier
begins by a PICC.
TR1
Synchronization time beginning at the time the subcarrier is generated by a PICC and ending when the
PICC begins modulation.
TR2Time beginning at the time when a PICC begins sending EOF and ending when a PCD begins SOF.

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Operating field
The range of magnetic field strength where a PICC is capable of conducting normal operations.
Polling
The operation of a PCD to repetitively emit Request commands in order to sense PICCs within theoperating field.
Collision
Transmission by two or more PICCs that are within the same operating field of a PCD during the sametime period, such that the PCD is unable to distinguish from which PICC the data originated.
Anticollision
The process of avoiding transmission at the same time by two or more PICCs that are within the same
operating field of a PCD.
Anticollision sequence
The procedure to select one or more PICCs from the multiple PICCs within the same operating field of a
PCD that have answered to a Request command, and establishing communication between the PICC
and PCD.
Load modulation
To generate modulation signals by putting load on and off a PICC.
Request command
A command requesting an answer from a corresponding type of PICC when the PICC is capable ofinitializing.
Block
A special form of frame that includes a valid protocol data format.
Note: A valid protocol data format includes I-Blocks, R-Blocks or S-Blocks.
Test PCDA device for testing PICCs. Stipulated in the Standard Specification.
Test PCD-S
A PCD stipulated for the purpose of this Implementation Specification.
appressed operations.
Calibration CoilA device for testing PCDs. Stipulated in the Standard Specification.
Reference PICC
A device for testing PCDs. Stipulated in the Standard Specification.

10

Used for tests assuming

Version 2.0
Reference PICC-S/M/L
A generic designation of the three types of reference PICCs stipulated for the purpose of thisImplementation Specification which are the reference PICC-S, reference PICC-M, and reference PICCL.
Dummy PICCA PICC stipulated for the purpose of this Implementation Specification. Used for temperature rise tests.
3.2 Symbols and Abbreviated Terms
The following symbols and abbreviated terms shall be used in this Implementation Specification.
AFI

Application Family Indentifier Card
pre-selection criteria by application, Type B

ANTICOLLISION
Anticollision command, Type A
ASK

Amplitude Shift KeyingATSAnswer to SelectATTRIB

PICC selection command, Type B

ATQA

Answer To Request, Type A

ATQB

Answer To Request, Type B

BPSK

Binary Phase Shift Keying

CID

Card Identifier

CLnCascade Level n, Type A

CT

Cascade Tag, Type A

D

Divisor

DUT

Device Under Testetu

elementary time unit

E

End of communication Type A

EGT

Extra Guard Time, Type B

EOF

End Of Frame, Type B

FDT

Frame Delay Time, Type A

fc

Frequency of operating field (carrier frequency)fs

frequency of sub-carrier modulation

FWI

Frame Waiting time Integer

FWT

Frame Waiting Time

HLTA

Halt command, Type A

HLTB

Halt command, Type B

Hmax

Maximum field strength of the PCD antenna field

Hmin

Minimum field strength of the PCD antenna field

I-Blocks

Information blocks

LSB

Least Significant Bit
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Version 2.0
MAX

Index to define a MAXimum value

MIN

Index to define a MINimum value

MSB

Most Significant Bit

NRZ-L

Non-Return to Zero (L for Level)

OOK

On/Off Keying

PCD

Proximity Coupling Device

PICC

Proximity IC Card

PCB

Protocol Control Byte

PUPI

Pseudo-Unique PICC Identifier

R-Blocks Receive ready blocks
R(ACK)

R-Block containing a positive acknowledge

R(NAK)

R-block containing a negative acknowledge

RATS

Request for Answer To Select

REQA

Request command, Type A

REQB

Request command, Type B

RFRadio Frequency

RFU

Reserved for Future ISO/IEC Use

S-Blocks

Supervisory blocks

S

Start of communication, Type A

SAK

Select AcKnowledge, Type A

SEL

SELect code, Type A

SELECT

SELECT command, Type A

Slot_MARKER
Slot marker command, Type B
SOF

Start Of Frame, Type B

UID

Unique Identifier, Type A

Uid n

Byte number n of Unique Identifier where n >= 0

WTX

Waiting Time eXtension

WTXM

Waiting Time eXtension Multiplier

WUPA

Wake Up command, Type A

WUPB

Wake Up command, Type B

For the purpose of the Implementation Specification, the following notation applies:
b“xxxx xxxx”

Data bit representation“XX”

Hexadecimal

12Version 2.0
4 Physical Characteristics
Shall comply with the "Physical characteristics" of ISO/IEC 14443-1 (JIS X 6322-1) and shall add thefollowing provisions.
4.1 PICC
Operation Diversification Specifications:
Allow for thickness below dimensions specified for ID-1.
Explanatory Notes:
The operating temperature of a PICC is stipulated as shown below.
– PICCs should operate normally within the temperature range of 0°C to 50°C.
4.2 PCD
Considertations:
For Insertion type PCDs, under a room temperature environment, the area where the PICC will be placedshall be under 50°C for at least 5 minutes after becoming capable of communicating, without consideration
to temperature rise due to the PICC's heat generation.
5 Electrical Charactristics
Shall comply with the "Power transfer" and "PICC minimal coupling zone" of ISO/IEC 14443-2 (JIS X
6322-2) and shall add the following provisions.
5.1 PICC
5.1.1 Antenna Shape
Compatibility Improvement Specifications:
In order to operate the PICC in four direction (fore-side, back-side, front approach, rear approach), theselected antenna mounting position shall be capable of ensuring the minimum coupling range with respect
to all directions. The antenna positioning range is shown with diagonal lines in Figure 5.1.

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65.6

Figure 5.1 – Antenna Implementation Zone

5.1.2 Operating Noise
Considertations:
The PICC should suppress the following load fluctuation while processing commands:– Continuous load fluctuation with a cycle near preamble.
– Load fluctuation other than load modulation during PICC response processing.
– Large load fluctuation that cannot be ignored when compared with load modulation during response.
– Load fluctuation immediately before PICC response activity.
– Load fluctuation occurring during low or excess power supplied to PICC.
The following load fluctuation should be suppressed as much as possible while the PICC is processing thefollowing commands:– Load fluctuation occurring during processing of Resend Request of protocol.
– Load fluctuation during processing of initial response between the time the request was made until thetime the processing of the protocol begins.
5.1.3 Resonance Frequency
Compatibility Improvement Specifications:
For PICCs assuming single card operations, the resonance frequency shall be equal to or greater than
13.56 MHz. However, consideration shall be given to situations when coming into close proximity of PCDs.
Operation Diversification Specifications (Informative):
For PICCs assuming double card operations, the resonance frequency shall be equal to or greater than
13.56 MHz in situations where they are placed on top of the other.
5.1.4 Operating Field
Compatibility Improvement Specifications:
The minimum non-modulated operating field of a PICC shall be Hmin which value is 4 A/m (rms).

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5.2 PCD
5.2.1 Antenna Shape
Compatibility Improvement Specifications:
Although there are no particular specifications for antenna position, antenna position shall be decided so
as to satisfy communication performance independent of the operating direction (front, back, up, down) of
the PICC within the communication range or the coil position. In addition, the antenna shall be aligned in a
direction such that the antenna of the PCD and the antenna of the PICC face each other in parallel.
An example of an antenna position of a PCD where the center of the antenna is aligned with the center of
the PICC is shown in Figure 5.2.

Center of PCD antenna

Center of PICC

PICC antenna

PCD antennaparallelFigure 5.2 – Antenna Position
Considerations:
The shape of the PCD antenna should be symmetric on the X and Y axis with their origin at the center of
the antenna so that the communication zone of the PICC is not largely affected by the operation direction
and communication position.
Examples of PCD antenna shapes are shown in Figure 5.3.
Y axis[Legend]

X axisCenter ofantennaFigure 5.3 – Antenna Shape15

Version 2.0
5.2.2 Operating Noise
Considerations:
The design of the PCD should reflect consideration to the operating noise emitted from the PICC so that it
will not erroneously receive noise which are not communication signals. Furthermore, PCDs shall giveconsideration to avoid noise getting into carriers.
5.2.3 Coupling Degree between Antennea
Considertations:(1) The coupling degree between the antennae will increase when a PICC comes into close proximity of a
PCD. Especially with Open type PCDs, PICCs may come into closer proximity than expected, resulting
in excess coupling degree between the antennae.
(2) Since the operational point of a PCD will alter largely when the coupling degree between the antennae
is in excess, the operating range of a PCD shall be considered with the following in mind.
– The generated magnetic field might become too strong.
Thus, consideration shall be given to characteristics of maximum magnetic field generated.
– A situation where field or power becomes too weak might occur.
Thus, consideration shall be given to characteristics of minimum magnetic field generated andpower transmission.
– The modulation index might change.
Thus, consideration shall be given to the modulation waveform.
5.2.4 Generated Magnetic Field
Compatibility Improvement Specifications:
The minimum non-modulated operating field of a PCD shall be Hmin which value is 4 A/m (rms).
6 Signal Transmission
Based on ISO/IEC 14443-2 (JIS X 6322-2), the modulation method, modulation waveform and coding
scheme of the signal transmission from PCD to PICC and vice versa shall be stipulated herein. Type A andType B communication formats are specified.
6.1 Initial Communication of the PICC
Shall comply with "Initial dialogue for proximity cards" of ISO/IEC 14443-2 (JIS X 6322-2).
6.2 Signal Interface
Shall comply with the "Signal Interface" of ISO/IEC 14443-2 (JIS X 6322-2) and shall add the following
provisions.

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Version 2.0
Compatibility Improvement Specification (Informative): <Refer to ISO/IEC 14443-2/FPDAM2>
Figure 6.1 shows a summary of the two types of communication methods for fc/128 (approximately 106
kbit/s), fc/64 (approximately 212 kbit/s), fc/32 (approximately 424 kbit/s), and fc/16 (approximately 847
kbit/s).

Figure 6.1 – Communication Examples of Type A and Type B

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Version 2.0
6.3 Communication Signal Interface Type A
Shall comply with the "Communication Signal Interface Type A" of ISO/IEC 14443-2 (JIS X 6322-2) andshall add the following provisions.
Explanatory Notes:
The following are stipulated in ISO/IEC 14443-2 (JIS X 6322-2).
– Signal transmission from PCD to PICC
• Bit Rate
• Modulation• Bit Representation and Coding– Signal transmission from PICC to PCD• Bit Rate
• Load Modulation• Subcarrier• Subcarrier Modulation Method• Bit Representation and Coding
6.3.1 Signal transmission from PCD to PICC
6.3.1.1 Bit Rate
Compatibility Improvement Specification (Informative): <Refer to ISO/IEC 14443-2/FPDAM2>
The bit rate for initialization and anticollision shall be one of the following.
– fc/128 (approximately 106 kbit/s)– fc/64 (approximately 212 kbit/s)– fc/32 (approximately 424 kbit/s)– fc/16 (approximately 847 kbit/s)
6.3.1.2 Modulation
Compatibility Improvement Specification (Informative): <Refer to ISO/IEC 14443-2/FPDAM2>
Communication between PCD to PICC at bit rates fc/64, fc/32, fc/16 takes place using the modulation
principle of ASK modulation of the RF operating field to create a "pause" as shown in Figure 6.2.

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Version 2.0
The envelope of the PCD field shall decrease monotonically to less than 60 % of its initial value HINITIAL asshown in Figure 6.2.
Overshoots shall remain within ±0,1 × (1-a) of HINITIAL.
Parameter a of Figure 6.2 shall be less than 0,6 for bit rates fc/64, fc/32, fc/16.
Envelope ofCarrier Amplitude
H/HINITIAL
1,1-0,1a10,9+0,1a(1+a)/2a0ta(1+a)/2
0,9+0,1a1
1,1-0,1at3

t2
t1

Figure 6.2 – "Pause" waveform at bit rate of fc/64, fc/32, fc/16

Table 6.1 – Modulation Timing
Timing

fc/64

fc/32

fc/16

Parameter

Min

Max

Min

Max

Min

Max

t1

17/fc

21/fc

10/fc

12/fc

6/fc

7/fc

t2

5/fc

t1

4/fc

t1

3/fc

t1

t3

0

10/fc

0

9/fc

0

8/fc

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Version 2.0
6.3.2 Signal transmission from PICC to PCD
6.3.2.1 Bit Rate
Compatibility Improvement Specification (Informative): <Refer to ISO/IEC 14443-2/FPDAM2>
The bit rate for initialization and anticollision shall be one of the following.
– fc/128 (approximately 106 kbit/s)– fc/64 (approximately 212 kbit/s)– fc/32 (approximately 424 kbit/s)– fc/16 (approximately 847 kbit/s)
6.3.2.2 Subcarrier Modulation Method
Compatibility Improvement Specification (Informative): <Refer to ISO/IEC 14443-2/FPDAM2>
At bit rates fc/64, fc/32, fc/16, the subcarrier shall be BPSK modulated as described in 6.3.2.3.
6.3.2.3 Bit Representation and Coding
Compatibility Improvement Specification (Informative): <Refer to ISO/IEC 14443-2/FPDAM2>
At bit rates fc/64, fc/32, fc/16, bit coding shall be NRZ-L as stipulated below.
Logical "1":

The carrier is modulated with the subcarrier for one bit duration.

Logical "0":The carrier is modulated with the inverse of the subcarrier for one bit duration.

Start of communication: After the 32 periods of subcarrier (phase of logical "1"), the inverse of thesubcarrier (phase of logical "0") shall continue for one bit duration.
End of communication:

The carrier is not modulated with the subcarrier for one bit duration.

No information:

The carrier is not modulated with the subcarrier.

6.4 Communication Signal Interface Type B
Shall comply with the "Communication Signal Interface Type B" of ISO/IEC 14443-2 (JIS X 6322-2) andshall add the following provisions.
Explanatory Notes:
The following are stipulated in ISO/IEC 14443-2 (JIS X 6322-2).
– Signal transmission from PCD to PICC
• Bit Rate
• Modulation• Bit Representation and Coding– Signal transmission from PICC to PCD• Bit Rate
• Load Modulation
20

Version 2.0• Subcarrier• Subcarrier Modulation Method• Bit Representation and Coding
6.4.1 Signal transmission from PCD to PICC
6.4.1.1 Bit Rate
Compatibility Improvement Specification (Informative): <Refer to ISO/IEC 14443-2/FPDAM2>
The bit rate for initialization and anticollision shall be one of the following.
– fc/128 (approximately 106 kbit/s)– fc/64 (approximately 212 kbit/s)– fc/32 (approximately 424 kbit/s)– fc/16 (approximately 847 kbit/s)
6.4.1.2 Modulation
Compatibility Improvement Specification (Informative): <Refer to ISO/IEC 14443-2/FPDAM2>
The modulation waveform for each bit rate shall comply with Figure 6.3.
hfa=carrier
amplitude

y
y

hr
tr

b

21

tf

Version 2.0

Parameter

Bit Rate
fc/128

fc/64

fc/32

fc/16

1 etu (approx)

9,44 µs

4,72 µs

2,36 µs

1,18 µs

tf max

2 µs

2 µs

1 µs

0,8 µstr max

2 µs

2 µs

1 µs

0,8 µsy0,1 (a-b)0,1 (a-b)0,1 (a-b)0,1 (a-b)

hf, max hr max

0,1 (a-b)0,1 (a-b)0,1 (a-b)0,1 (a-b)

Figure 6.3 – Modulation Waveform for Type B

6.4.2 Signal transmission from PICC to PCD
6.4.2.1 Bit Rate
Compatibility Improvement Specification (Informative): <Refer to ISO/IEC 14443-2/FPDAM2>
The bit rate for initialization and anticollision shall be one of the following.
– fc/128 (approximately 106 kbit/s)– fc/64 (approximately 212 kbit/s)– fc/32 (approximately 424 kbit/s)– fc/16 (approximately 847 kbit/s)
6.4.2.2 Subcarrier
Compatibility Improvement Specification (Informative): <Refer to ISO/IEC 14443-2/FPDAM2>
The frequency fs of the subcarrier shall be fc/16 (approximately 847 kHz). Consequently, duringinitialization and anticollision, one bit period is equivalent to 8 periods of the subcarrier.
The periods of the subcarrier after initialization and anticollision shall depend on the bit rate.
6.4.2.3 Subcarrier Modulation Method
Compatibility Improvement Specification (Informative): <Refer to ISO/IEC 14443-2/FPDAM2>

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Version 2.0
The subcarrier shall be BPSK modulated, as seen in the example in Figure 6.4.

Phase Shift Point

Figure 6.4 – Phase Shift Point

7 Initialization and Anticollision
Shall comply with "Initialization and anticollision" of ISO/IEC 14443-3 (JIS X 6322-3).
7.1 Polling
Shall comply with the "Polling" of ISO/IEC 14443-3 (JIS X 6322-3) and shall add the following provisions.
Compatibility Improvement Specifications:
After disappearance of the operating field, the PICC shall enter POWER-OFF state within 10 ms. After
that, the PICC shall perform the operations stipulated in this section when it enters an operating field.
Considerations:A PICC that will operate with an Open type PCD shall consider cases ranging from slow rising time to fastrising time for the operating field to attain minimum operational level. The PICC shall also consider thecase where the operating field is modulated upon attaining minimum operational level. Both 100%ASK(Type A) and 10%ASK (Type B) are possible for the modulated operating field.
Furthermore, if the Open type PCD will repetitively send Request commands, the interval time for sendingout commands shall be longer than the time it takes for the PICC to begin accepting requests (5 ms).
Explanatory Notes:
When a PICC is exposed to a non-modulated operating field it shall be able to accept a Request commandwithin 5 ms.
The duration until the operating field attains minimum level shall include cases ranging from slow risingtime to fast rising time as shown in Figure 7.1. If the operating field is modulated upon attuning minimum
23Version 2.0
operational level, the PICC shall be able to accept a Request command within 5 ms after the operating
field becomes non-modulated above the minimum operational level.

5ms
Operating
Field
Hmin

5ms
Accept Request

Accept Request

Slow Rising Field

Fast Rising Field

5ms

5ms
Accept Request

Operating
Field
Hmin

Accept Request

Modulate Field
PeriodModulated Field
PeriodModulation during rise (1)Modulation during rise (2)Figure 7.1 – Variations of Operating Field Rising Forms

Compatibility Improvement Specification (Informative): <Refer to ISO/IEC 14443-3/FPDAM1>(1) When a PICC of Type A is exposed to a non-modulated operating field it shall be able to accept a
REQA within 5 ms.
When a PICC of Type A receives a Type B command, it shall enter IDLE state in order to receive a
REQA, or shall retain the current state capable of communication.
(2) When a PICC of Type B is exposed to a non-modulated operating field it shall be able to accept a
REQB within 5 ms.
When a PICC of Type B receives a Type A command, it shall enter IDLE state in order to receive a
REQB, or shall retain the current state capable of communication.

After disappearance of the operating field, the PICC shall enter POWER-OFF state within 100 ms. After
that, the PICC shall perform the operations stipulated in this section when it enters an operating field.
Explanatory Notes:
It should be noted that the reset time (100 ms) of the PICC is currently under discussion and is subject tochange.

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Version 2.0
7.2 Initialization and Anticollision of PICC Type A
Shall comply with the "Type A – Initialization and Anticollision" of ISO/IEC 14443-3 (JIS X 6322-3) andshall add the following provisions.
Explanatory Notes:
The following are stipulated in ISO/IEC 14443-3 (JIS X 6322-3).
– Frame Format and Timing– PICC States Description– Command Set– Select Sequence
7.2.1 Bit Rate
Compatibility Improvement Specification (Informative): <Refer to ISO/IEC 14443-3/FPDAM1>
Four bit rates shown in Table 7.1 shall be stipulated for the bit rate between the PCD and PICC. Bit rates
fc/64, fc/32, and fc/16 are optional.
Table 7.1 – Bit Rates
Divisor Detu

Bit rate

12 (optional)
4 (optional)
8 (optional)

128/fc (~9,4 µs)
128/(2fc) (~4,7 µs)
128/(4fc) (~2,4 µs)
128/(8fc) (~1,2 µs)

fc/128 (~106 kbit/s)
fc/64 (~212 kbit/s)
fc/32 (~424 kbit/s)
fc/16 (~847 kbit/s)

NOTE fc/128 is the initial bit rate and shall be used for all initialization and anticollision procedures.
7.2.2 Frame Format and Timing
Compatibility Improvement Specification (Informative): <Refer to ISO/IEC 14443-3/FPDAM1>
The time between the end of the last pause transmitted by the PCD and the first modulation edge within
the start bit transmitted by the PICC shall respect the timing defined in Figure 7.2.

25

Version 2.0

Figure 7.2 – Frame Delay Time from PCD to PICC

26

Version 2.0
Table 7.2 defines the values for n and FDT depending on the command type and the logic state of the lasttransmitted data bit in the command.
Table 7.2 – Frame Delay Time from PCD to PICC

Command typeFDTn(integer value)

last bit = (1)blast bit = (0)b1236/fc

1172/fc>=9(n × 128 + 84)/ fc(n × 128 +20) / fc>=8

(n × 128 +
138) / fc(n × 128 +
106) / fc>=8(n × 128 +
106) / fc(n × 128 +90) / fc>=8

(n × 128 + 97)/ fc(n × 128 +89) / fc>=1113/fc>=1113/fc

REQA Command
WUPA Command
ANTICOLLISION Command
SELECT Command
All other commands at bit rates
PCD –> PICC fc/128
PCD <– PICC fc/128
All other commands at bit rates
PCD –> PICC fc/64
PCD <– PICC fc/128
All other commands at bit rates
PCD –> PICC fc/32
PCD <– PICC fc/128
All other commands at bit rates
PCD –> PICC fc/16
PCD <– PICC fc/128
All other commands at bit rates
PCD –> PICC fc/128 or fc/64 or fc/32 or fc/16
PCD <– PICC fc/64 or fc/32 or fc/16
NOTE To prevent collision, all PICCs shall respond in a synchronous way to REQA, WUPA,ANTICOLLISION, and SELECT commands.
For bit rates of fc/64, fc/32 and fc/16, there is an exception where the final parity bit of a PICC standard
frame is inverted.

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Version 2.0

Figure 7.3 – PICC Standard Frame
7.2.3 PICC States Description
Compatibility Improvement Specification (Informative): <Refer to ISO/IEC 14443-3/FPDAM1>
Change the designation of "ISO/IEC 14443-4" in the PICC state diagram to "PROTOCOL state".
7.2.4 Select Sequence
Compatibility Improvement Specification (Informative): <Refer to ISO/IEC 14443-3/FPDAM1>The Answer To Request (ATQA) is coded as shown in Table 7.3.
Table 7.3 – Coding of Answer To Request (ATQA)
b16 b15 b14 b13

RFU

b12
Proprietar
y

b11

b10

b9

HB2

HB1

HB0

b8

b7

b6

b5

b4 b3 b2

b1

RFU

Bit frame anticollision

UID size
Bit frame

As shown in Tables 7.4, 7.5, and 7.6, high speed bit rate factors HB0, HB1, and HB2 describe whether
PICC supports option Select Codes.

28Version 2.0
Table 7.4 – Coding of High Speed Bit Rate Factor HB0
b9

Meaning

0

PICC does not support Select Code “92”1

PICC supports Select Code “92”

Table 7.5 – Coding of High Speed Bit Rate Factor HB1
b10

Meaning

0

PICC does not support Select Code “94”1

PICC supports Select Code “94”

Table 7.6 – Coding of High Speed Bit Rate Factor HB2
b11

Meaning

0

PICC does not support Select Code “98”1

PICC supports Select Code “98”The coding for SEL (Select Code) shall be one of the values shown in Table 7.7.
Table 7.7 – Coding of SEL
b8

b7

b6

b5

b4

b3

b2

b1

Meaning

1

0

0

1

0

0

1

1

“93”: Select cascade level 1

1

0

0

1

0

1

0

1

“95”: Select cascade level 2

1

0

0

1

0

1

1

1

“97”: Select cascade level 3
Optional “92”: Select cascade level 1 and

1

0

0

1

0

0

1

0

1

0

0

1

0

1

0

0

1

0

0

1

0

1

1

0

switch bit rate to fc/64 after receive SAK
Optional “94”: Select cascade level 2 andswitch bit rate to fc/32 after receive SAK
Optional “98”: Select cascade level 3 andswitch bit rate to fc/16 after receive SAK

If the PICC indicates that it supports high speed bit rates using the information specified in Table 7.3"Coding of Answer To Request (ATQA)," the PCD shall be able to select a new bit rate by using SEL
29

Version 2.0
values of "92", "94", or "98". After transmitting SAK, the PCD and PICC shall begin transmitting using the
new bit rate.
Note: An alternate method of selecting bit rates is stipulated in ISO/IEC 14443-4 (JIS X 6322-4). The
selection method allow for the PCD and PICC to select bit rates individually.
Table 7.8 – Single Size UIDs
uid 0

Description“08”

uid1 to uid3 is a random number which is dynamically generated"x0" ~ "x7"

Proprietary number"x9" ~ "xE"'

Proprietary number"18" ~ "F8"

RFU

"xF"

RFU

The value "88" of the cascade tag CT shall not be used for uid3 in double sized UID.
The usage of cascade levels is shown in Figure 7.4.

Figure 7.4 – Usage of Cascade Levels
NOTE SEL values "92", "94", and "98" are optional and can be used to switch to fc/64, fc/32, or fc16.

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Version 2.0
7.3 Initialization and Anticollision of PICC Type B
Shall comply with the "Type B – Initialization and Anticollision" of ISO/IEC 14443-3 (JIS X 6332-3) andshall add the following provisions.
Explanatory Notes:
The following are stipulated in ISO/IEC 14443-3 (JIS X 6322-3).
– Character, Frame Format and Timing– Anticollision Sequence– PICC States Description– Command Set– Anticollision Command Format– REQB/WUPB Command– Slot_MARKER Command– Answer to Request (ATQB)– ATTRIB Command– Answer to ATTRIB Command– HLTB Command and Answer
7.3.1 Character, Frame Format and Timing
Compatibility Improvement Specification (Informative): <Refer to ISO/IEC 14443-3/FPDAM1>
Bit boundaries within a character shall occur between (n - 0,125) etu and (n + 0,125) etu where n is thenumber of bit boundaries after the start bit falling edge (1 <= n <= 9).
For transmissions from PICCs to PCDs, the bit boundaries within a character shall occur only at the phaseshift point of the rising edge or the falling edge of the carrier specified in "6.4.2.3 Subcarrier Modulation
Method."Table 7.9 – Bit Boundaries from PCD to PICC

Bit boundaries from
PICC to PCD

fc/128(1 etu = 8/fs)

PICC to PCD bit rate
fc/64
fc/32
(1 etu = 4/fs)(1 etu = 2/fs)

n etu ± 1/fs

n etu ± 1/(2fs)

fc/16(1 etu = 1/fs)

n etu

n etu

A character is separated from the next sent one by the extra guard time EGT as follows.
The EGT between two consecutive characters sent by the PCD to the PICC shall be any value between 0
and 6 etu.
The EGT between two consecutive characters sent by the PCD to the PICC shall be any value between 0
and 2 etu.
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Version 2.0
Note: The EGT is not limited to an integer value of etu.

Figure 7.5 – From PICC EOF to PCD SOF
Table 7.10 – Compliance With ISO/IEC 14443
b11

Meaning

1

PICC Compliant with ISO/IEC 14443-4

0

PICC not Compliant with ISO/IEC 14443-4

The minimum value of TR2 shall be coded by the Protocol_Type of Protocol Info within ATQB.
The minimum value of TR2 (the delay between PICC EOF start and PCD SOF start) shall be defined bybits 2 and 3 of Protocol_Type as shown in Table 7.11.

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Version 2.0
Table 7.11 – Coding of Minimum Value of TR2b3b2

Minimum TR2 for PICC to PCD
fc/64
fc/32
fc/128(1 etu = 4/fs)(1 etu = 2/fs)(1 etu = 8/fs)

fc/16(1 etu = 1/fs)

0

0

10 etu + 32/fs

10 etu + 32/fs

10 etu + 32/fs

10 etu + 32/fs

0

1

10 etu + 32/fs

10 etu + 32/fs

10 etu + 32/fs

26 etu1

0

10 etu + 32/fs

18 etu18 etu18 etu1

1

10 etu + 32/fs

14 etu14 etu14 etu7.3.2 REQB/WUPB Command
Considerations:
It is not clear to what value the AFI of a multipurpose PICC Type B should be set, which might lead toconfusion. In order to ensure compatibility, this Implementation Specification recommends setting the valueof the AFI of PICCs to "00", and for PCDs, setting the value of the AFI to "00" and sending a REQB/WUPB
command.
However, for single-purpose PICC Type B, if the AFI can be determined uniquely, the value shall comply
with the provisions of "Initialization and Anticollision" of ISO/IEC 14443-3 (JIS X 6322-3).
7.3.3 Answer to Request (ATQB)
7.3.3.1 Pseudo-Unique PICC Identifier (PUPI)
Considertations:
The PUPI used for the initial anticollision after entering the IDLE state from a POWER-OFF state of a PICC
which had been in an ACTIVE state, should have a different value from the value of the PUPI used in theprevious anticollision procedure.

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Version 2.0
7.3.4 ATTRIB Command
Compatibility Improvement Specification (Informative): <Refer to ISO/IEC 14443-3/FPDAM1>
After Answer to ATTRIB, the parameters selected by the ATTRIB command shall be applied.
Table 7.12 – Coding of Minimum Value of TR0
Minimum TR0 for PCD to PICC
b8

b7

0

fc/128

fc/64

fc/32

fc/1

0

64/fs

64/fs

64/fs

64/fs

0

1

48/fs

32/fs

16/fs

16/fs

1

0

16/fs

8/fs

4/fs

4/fs

1

1

RFU

RFU

RFU

RFU

Table 7.13 – Coding of Minimum Value of TR1
Minimum TR1 for PCD to PICC
b5

b6

0

fc/128

fc/64

fc/32

fc/16

0

80/fs

80/fs

80/fs

80/fs

0

1

64/fs

32/fs

32/fs

32/fs

1

0

16/fs

8/fs

8/fs

8/fs

1

1

RFU

RFU

RFU

RFU

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Version 2.0
8 Transmission Control Sequence
Shall comply with ISO/IEC 14443-4 (JIS X 6322-4).
8.1 Protocol Activation of PICC Type A
Shall comply with "Protocol activation of PICC Type A" of ISO/IEC 14443-4 (JIS X 6322-4).
Explanatory Notes:
The following are stipulated in ISO/IEC 14443-4 (JIS X 6322-4).
– Request for Answer To Select (RATS)– Answer To Select (ATS)– Protocol and Parameter Selection Request– Protocol and Parameter Selection Response– Activation Frame Waiting Time– Error Detection and Recovery
8.2 Protocol Activation of PICC Type B
Shall comply with "Protocol activation of PICC Type B" of ISO/IEC 14443-4 (JIS X 6322-4).
8.3 Half-Duplex Block Transmission Protocol
Shall comply with "Half-Duplex Block Transmission Protocol" of ISO/IEC 14443-4 (JIS X 6322-4).
Explanatory Notes:
The following are stipulated in ISO/IEC 14443-4 (JIS X 6322-4).
– Block Format– Frame Waiting Time
– Frame Waiting Time Extension– Power Level Indication– Protocol Operation
Considerations:
When considering operations using Open type PCDs or when considering speed up, the values for PICC
Frame Wait Time FWI and WTXM (when using WTX) should be decided with consideration to operability.
8.4 Protocol Deactivation of PICC Type A and Type B
Shall comply with "Protocol Deactivation of PICC Type A and Type B" of ISO/IEC 14443-4 (JIS X 63224).

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Version 2.0
Explanatory Notes:
The following are stipulated in ISO/IEC 14443-4 (JIS X 6322-4).
– Deactivation Frame Waiting Time– Error Detection and Recovery
8.5 Protocol Scenarios
Shall comply with "Annex B (Informative) Protocol Scenarios" of ISO/IEC 14443-4 (JIS X 6322-4).
8.6 Components of the Blocks and Frames
Shall comply with "Annex C (Informative) Block and Frame Coding Overview" of ISO/IEC 14443-4 (JISX 6322-4).

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Version 2.0
8.7 １４４４３−４ Transmission Control Matrix of Protocol
The following Tables 8.1 and 8.2 are Transmission Control Matrices to help in understanding the Protocol.
Table 8.1 – Transmission Control Protocol on the PICC Side (Towards Upper Device)State

0 Protocol
start state
1 I(0)0 (NonChaining)
After send
Wait receive
2 I(0)1 (NonChaining)
After send
Wait receive
3 I(1)0(Chaining)
After send
Wait receive
4 I(1)1(Chaining)
After send
Wait receive
5 R(ACK)0After send
Wait receive

Receive I block (from PCD)A
B
CD
No-Chain No-Chain
Chain
Chain
Received Received
Received Received
I(0)0
I(0)1
I(1)0
I(1)1
I(0)0 -> 1 Rule 10
I(1)0 -> 3 Rule 10
1)
S(WTX) -> 7 Rule 9
I(0)1 -> 2 Rule 10
I(1)1 -> 4 Rule 10
1)
S(WTX) -> 7 Rule 9

R(ACK)0 -> 5 Rule 2S(WTX) -> 7 Rule 9

I(0)0 -> 1 Rule 10
I(1)0 -> 3 Rule 10
S(WTX) -> 7 Rule 9

R(ACK)0 -> 5 Rule 2S(WTX) -> 7 Rule 9

No operation
Return to prev. stat.

No operation
Return to prev. stat.

1)

1)

R(ACK)1 -> 6 Rule 2S(WTX) -> 7 Rule 91)

1)

I(0)1 -> 2 Rule 10
I(1)1 -> 4 Rule 10
1)
S(WTX) -> 7 Rule 9

R(ACK)1 -> 6 Rule 2S(WTX) -> 7 Rule 9

6 R(ACK)1After send
Wait receive

I(0)0 -> 1 Rule 10
I(1)0 -> 3 Rule 10
1)
S(WTX) -> 7 Rule 9

R(ACK)0 -> 5 Rule 2S(WTX) -> 7 Rule 9

7 Request
S(WTX)
After send
Wait receive

No operation
Return to prev. stat.

No operation
Return to prev. stat.

E
R(ACK)0
Received
No operation
Return to
prev. stat.
Last block
I(0)0 Resend-> 1
Rule 11
No operation
Return to
prev. stat.
Last block
I(1)0 Resend-> 3
Rule 11
I(0)0 -> 1
I(1)0 -> 3
1)
Rule 13

Event
Receive R block (from PCD)F
G
R(ACK)1
R(NAK)0
Received
Received

H
R(NAK)1
Received

No operation
Return to prev.
stat.
No operation
Return to prev.
stat.

R(ACK)1 -> 6
Rule 12

Last block
I(0)1 Resend-> 2
Rule 11
I(0)1 Send-> 2
I(1)1 Send-> 4
1)
Rule 13

R(ACK)1 -> 6
Rule 12

Last block
I(0)1 Resend -> 2
Rule 11

Last block
I(1)0 Resend -> 3
Rule 11

No operation
Return to prev.
stat.

Last block
I(1)1 Resend-> 4Rule 11

No operation
Return to prev.
stat.

Last block
I(1)1 Resend -> 4
Rule 11:

Last block
R(ACK)0
Resend -> 5
Rule 11
R(ACK)1-> 6
Rule 12R(ACK)0-> 5
Rule 12No operation
Return to prev. stat.

1)

1)

No operation
Return to prev. stat.

Last block
I(0)0 Resend -> 1
Rule 11

Receive error
K
L
Error
Error
(PCB error)(CRC error,
EGT timeout)

No operation
Return to prev.
stat.
R(ACK)0 -> 5
Rule 12

Last block
R(ACK)1
Resend -> 6
Rule 11
Request S(WTX) Resend -> 7

NOTE "Rule" refers to rules as stipulated in "Block Numbering Rules" of ISO/IEC 14443-4 (JIS X 6322-4).
1) PICC shall update its internal block number for the block number it will assign to the block that it will send next.

37

Receive S block (from PCD)
I
J
Response
RequestS(WTX)
S(DESELECT)
Received
ReceivedNo
operation
Return to
prev. stat.
Response
S(DESELECT)-> protocol end
Rule 3

Send whatshould be
sent out
beforeentering thisstate andthen enter
the state.

No
operation
Return to
prev. stat.

No operation
Return to
prev. stat.

Version 2.0
Table 8.2 – Transmission Control Protocol on the (Upper Device) PCD Side (Towards PICC)

State

A
No-ChainI(0)0Received

Receive I block (from PICC)
B
C
Non-Chain
Chain
I(0)1
I(1)0
Received
Received

0 Wait command
N/A
N/A
N/A
from upper device
1 I(0)0 (No-Chain)
NormalBlock
R(ACK)1 ->After send
termination ->number6
1)
1)
Wait receive
0
Violation -> 0 Rule 2
2 I(0)1 (No-Chain)
Block number
NormalBlockAfter send
Violation -> 0
termination
number1)
Wait receive-> 0
Violation -> 0
3 I(1)0 (Chain)
After send
Protocol Error
Wait receive-> 0
4 I(1)1 (Chain)
After send
Wait receive
5 R(ACK)0
NormalBlock
R(ACK)1 -> 6
1)
After send
termination -> 0 number
Rule 2
1)
Wait receive
Violation -> 0
6 R(ACK)1
Block number
NormalBlockAfter send
Violation -> 0
termination
number1)
Wait receive-> 0
Violation -> 0
7 R(NAK)0
NormalBlock
R(ACK)1 -> 6
1)
After send
termination ->numberRule 2
1)
Wait receive
0
Violation -> 0
8 R(NAK)1
After send
Wait receive

Block number
Violation -> 0

Normaltermination
1)-> 0

9 Request
S(DESELECT)
After send
Wait receive

S(DESELECT) -> 0
Rule 8BlocknumberViolation -> 0

D
Chain
I(1)1
Received
N/A

Event
Receive R block (from PICC)
E
F
R(ACK)0R(ACK)1
Received
Received

N/A

N/A

Receive S block (from PICC)
G
H
RequestResponse
S(WTX)
S(DESELECT)
Received
Received

I
Error
(PCB
error)

Receive error
J
Error(CRC error,
EGT
timeout)

N/A

N/A

N/A

N/A

R(NAK)0 -> 7
2)
Rule 4R(NAK)0 -> 7
2)
Rule 4R(NAK)1 -> 8
2)
Rule 4R(NAK)1 -> 8
2)
Rule 4R(NAK)0 -> 7
2)
Rule 4R(NAK)0 -> 7
2)
Rule 4R(NAK)1 -> 8
2)
Rule 4R(NAK)1 -> 8
2)
Rule 4

R(ACK)0 ->5
2)
Rule 5
R(ACK)1 ->6
2)
Rule 5R(NAK)0 -> 7
2)
Rule 4

R(ACK)0 ->5
2)
Rule 5
R(ACK)1 ->6
2)
Rule 5R(NAK)0 -> 7
2)
Rule 4R(NAK)1 -> 8
2)
Rule 4R(NAK)1 -> 8
2)
Rule 4

N/A

Block number
Violation -> 0
R(ACK)0 -> 5
1)
Rule 2

Protocol Error-> 0
I(0)1 -> 2
I(1)1 -> 4
1)
Rule 7Block number
Violation -> 0

Block number
Violation -> 0
I(0)0 -> 1
I(1)0 -> 3
1)
Rule 7

Response
S(WTX)
Sent Rule3

Protocol Error-> 0

Block number
Violation -> 0
R(ACK)0 -> 5
1)
Rule 2Block number
Violation -> 0
R(ACK)0 -> 5
1)
Rule 2

Protocol Error-> 0
I(0)1 -> 2
I(1)1 -> 4
1)
Rule 7

Last block
I(0)0 Resend -> 1
I(1)0 Resend -> 3
1)
Rule 6
Last block
I(0)0 -> 1
I(0)1 Resend -> 2 I(1)0 -> 3
1)
I(1)1 Resend -> 4 Rule 7
3)
Rule 6
protocol end

Format
Error
-> 0

K
FWT
Timeout

S(DESELECT) Resend -> 0
Rule 8

NOTE1 "Rule" refers to rules as stipulated in "Block Numbering Rules" of ISO/IEC 14443-4 (JIS X 6322-4).
NOTE2 The initial value of the error counter shall be 0. If the error counter equals the maximum value N (can be set to an appropriate value when building system), PCD (upper device)
shall end the protocol and return to state 0.
1) PCD shall update its internal block number for the block number it will assign to the block that it will send next, and shall clear the error counter.
2) Increment error counter.
3) Clear error counter.
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Version 2.0
9 Unit Tests
While the test methods are stipulated in ISO/IEC 10373-6 (JIS X 6305-6), this Implementation
Specification adds tests aimed to improve compatibility and accommodate diversification of operation
modes (appressed operations, dynamic operations, and double card operations). This Implementation
Specification also reflects provisions stipulated in ISO/IEC 10373-6/AM2.
9.1 General Requirements
9.1.1 Test Environment
Unless otherwise specified, the test environment as specified in Table 9.1 shall apply.
Table 9.1 – Test Environment
Subject Area

Condition

Temperature

23±3°C

Humidity

Relative humidity from 40% to 60%

9.1.2 Pre-conditioning
The PICC and PCD to be tested shall be conditioned to the test environment that satisfies the provisions of
the test environment for a period of 24 h before testing.
9.1.3 Default Tolerance
Unless otherwise specified, a default tolerance of ±5 % shall be applied to the quantity values given to
specify the characteristics of the test equipment (e.g. linear dimensions) and the test method procedure(e.g. test equipment adjustments).
9.1.4 Total Measurement Uncertainty
The total measurement uncertainty for each quantity determined by these test method shall be stated in
the test report.
Note: Basic information is given in "ISO Guide to the Expression of Uncertainty in Measurement" ISBN92-67-10188, 1993.
9.2 Test Content– Test content for the PICC under test
are shown in Table 9.2, and– Test content for the PCD under test
are shown in Table 9.3.

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Version 2.0
Details of each test content listed in Tables 9.2 and 9.3 are described from section 9.3 onward.
There are several Compatibility Improvement Specifications and Operation Diversification Specifications
designate as "Informative" which tests can be added according to the usage environment of theapplication.
Table 9.2 – Test Content (for PICC under test)
Item

Test
content

Test Apparatus[Generated
Magnetic Field
Strength]
Test PCD [1,5 A/m]

Category
Paired use conditions

Rule

Single (not paired)Standard

PICC load
modulation
9.3.1
amplitude
test

Test PCD [7,5 A/m]
Test PCD-S(Informative)[4,0 A/m]

Test PCD [4,0 A/m]
Test PCD [4,5 A/m]

30/H^1,2Reference PICC-S/M/L mVp-p or
more.
Single (not paired)

Normative
Informative

Informative
InformativeA
REQA/REQB
response isreceived.
No rule.
13,56 MHz or
more.

Normative
Normative
Normative

1)

Normative
Informative
Normative

13 MHz or
more.

Single (not paired)

Test PCD

Informative
Informative

Reference PICC-S/M/L

Paired PICC

Test PCD[Apply 10 A/m]InformativeA
Reference PICC-S/M/L REQA/REQB
response isSingle (not paired)received.
Paired PICC

Resonance Impedance analyzer Single (not paired)
Frequency or LCR meter

PICC
dynamic
9.3.6 test
(informative)Normative

Paired PICC

Single (not paired)Powertransmit
interferenc
9.3.5 e test for
doublecard
operations

Normative
Normative

Single (not paired)

Test PCD [7,5 A/m]

Maximum
Applied9.3.4 Magnetic
Field
Test

Normative

Paired PICC

Single (not paired)doubleNormative

Paired PICC

Test PCD [1,5 A/m]

9.3.3

singleReference PICC-S/M/L

Test PCD-S(Informative)[7,5 A/m]

Reception
9.3.2
test

Diversification

Normative

Single (not paired)
Test PCD [4,0 A/m]

Compatibility
Improvement

The PICC
shall function
normally after
applying theReference PICC-S/M/L magnetic fieldof 10 A/m.

Informative
Normative

Paired PICC

Normative
Normative

Receive
voltage ofReference PICC-S/M/L (6,8) V or
more at loadof 910 Ohm

Test PCD [No rule]

Single (not paired)A
REQA/REQB
response isreceived.

ProtocolTimingCharacteris
9.3.7
Test PCD [No rule]tics(Informative)Single (not paired)

The timing
values shallsatisfy therules.

Normative

Informative

Informative

1) Test PCD [4,5 A/m] shall be omitted from the Compatibility Improvement Specifications.

40

Version 2.0

Table 9.3 – Test Content (for PCD under test)
Item

Test
content

Test Apparatus[Reference PICC
Resonance
Frequency]

Magnetic
Field
Strength

Reference PICC
[19 M]

Maximum
Generated
Magnetic
Field

Reference PICC-M[19 M]

9.4.1
Magnetic
Field
Strength
Minimum
Generated
Magnetic
Field

Reference PICC-S[19 M]

Category
Paired use conditions

3 V or less
(7,5 A/m)Single (not paired)

Reference PICC
[13,56 M]

Reference PICC-M[13,56 M]

Single (not paired)

Single (not paired)

Normative

Normative

Reference PICC-L[19 M]
Reference PICC pair
S-S / S-M / S-L
M-S / M-M / M-L
L-S / L-M / L-L

Calibration Coil

Reference PICC-M[19 M]

Informative

Normative

Reference PICC-S/M/L
The results[19 M]
shall satisfy
Reference PICC-S/M/L
the rules.
[19 M] pair
S-S / S-M / S-L
M-S / M-M / M-L
L-S / L-M / L-L

Normative

Normative

Informative

Single (not paired)

Shall be able
to receive.

Reference PICC-L[19 M]

Temperatur
e rise test
Dummy PICC
(Informative)Informative

910 Ohmload, 6,8 V
or moreReference PICC
[19 M]
Reference PICC-S[19 M]

Normative

910 Ohmload, 6,8 V
or moreSingle calibration coil(not paired)

9.4.5

Normative

3 V or more
(4 A/m)1,8 kOhmload, 3 V or
more

Reference PICC-M[19 M]

Reference PICCS/M/L[19 M]pair

Receptionability ofload
9.4.4 modulation
signal(Informative)doubleReference PICC-L[13,56 M]

Reference PICC-S[19 M]

Modulation
9.4.3
Waveform

Diversification
singleNormative

3 V or less

3 V or more
(1,5 A/m)

Reference PICC
[19 M]

Power
9.4.2 Transmission TestStandard

Compatibility
Improvement(7,5 A/m)

Reference PICC-L[19 M]

Reference PICC-S[13,56 M]

RuleInformative
Informative
Informative

None

Target:Insertion TypePCD
Surrounding
temperature ofdummy PICC
is 50°C or
lower

41

Informative

Version 2.0
9.3 Test content for the PICC under test
Shall comply with "Testing of PICC" of ISO/IEC 10373-6 and ISO/IEC 10373-6/AM2 (JIS X 6305-6).
Explanatory Notes:
Note that changes have been applied in accordance with ISO/IEC 10373-6/AM2.
Major changes are the following.
– Clarification of test content: The content of "Test of PICC" has become "PICC load modulation amplitudetest."– Clarification of test method: The procedures of "Test of PICC" has become "PICC load modulation
amplitude test" have been stipulated in detail.
– Addition of test content: The following tests have been added.
PICC reception test
PICC Resonance Frequency (informative)
9.3.1 PICC Load Modulation Amplitude Test
Shall comply with "PICC load modulation amplitude" of ISO/IEC 10373-6 and ISO/IEC 10373-6/AM2(JIS X 6305-6).
Compatibility Improvement Specifications:
The minimum operating field Hmin shall be equal to the value as specified in "5.1.4 Operating Field."
Operation Diversification Specifications:
These test items only apply to PICCs premised on double card operation.
(1) Test Method
Testing is performed using two test target PICCs, placing one PICC on top of the other.
Perform test under minimum operating field Hmin and maximum operating field Hmax. Hmin shall be equal
to the value specified in "5.1.4 Operating Field" and Hmax shall be equal to the value specified in theStandard Specification.
a) Case of Pairing two PICCs
Place the paired PICCs on the Test PCD and send a REQA or REQB from the Test PCD. Verify themodulated signal received from the PICC using an oscilloscope connected to a calibration coil. If the
response from the two PICCs result in a collision, perform anticollision procedures to perform the test
under a condition where no collisions occur.
b) Case of Pairing a PICC with a Reference PICC
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Version 2.0
Place the PICC paired with a reference PICC-S/M/L for power transmit testing on the Test PCD and send a
REQA or REQB from the Test PCD. Verify the modulated signal received from the PICC using anoscilloscope connected to a calibration coil.
(2) Measurements
Measure the amplitude values of the upper and lower band frequencies of (fc + fS) and (fc - fS) of the
response signal generated by the PICC.
Considerations:
Keep in mind that characteristics will change depending on the order within the combination of the PICC
under test and the reference PICC.
Operation Diversification Specifications (Informative):
Functional test of a PICC for appressed operations is performed by verifying whether the PICC satisfies
the rules while using a Test PCD-S.
(1) Test Method
Place the PICC in the Test PCD-S and send a REQA or REQB from the Test PCD-S. Verify the modulated
signal received from the PICC using an oscilloscope connected to a calibration coil. Perform tests using asingle PICC and using paired PICCs. When performing tests using paired PICCs, test with the combinationof two PICCs under test as well as the combination of a PICC under test and a reference PICC-S/M/L.
(2) Measurements
Check the receipt of modulation signal from the PICC when the PICC is within the operating range of thetest PCD-S.
Operating range of Test PCD-S
Distance: from 0 mm to 5mm.
Displacement: within diameter of 5 mm.
(3) Rule
A modulation signal shall be received from the PICC within the operating range of the test PCD-S.
Considerations:
Keep in mind that characteristics will change depending on the order within the combination of the PICC
under test and the reference PICC.

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Version 2.0
9.3.2 Reception Test
Shall comply with "PICC reception" of ISO/IEC 10373-6/AM2.
Explanatory Notes:
The method for measuring reception characteristics was added by ISO/IEC 10373-6/AM2. The changes
are summarized below.
Specify multiple test conditions within the range of the modulation waveform stipulated in ISO/IEC 14443-2(JIS X 6322-2). Then, verify responses to REQA/REQB for each condition.
Compatibility Improvement Specifications:(1) Test Method
Adjust the modulation waveform from the Test PCD to satisfy the conditions specified in Table 9.4 and 9.5.
Verify the response from the PICC according to the test method stipulated in ISO/IEC 10373-6 (JIS X
6305-6).
Table 9.4 – Type A Testing Conditions
Condition

H (A/m)t1 (µs)t2 (µs)

1

4,0

3

0,5

2

4,0

2

0,7

3

7,5

3

0,5

4

7,5

2

0,7

Table 9.5 – Type B Testing Conditions
Condition

H (A/m)Modulation

tr (µs)tf (µs)index (%)
1

4,0

8

2

2

2

4,0

14

2

2

3

7,5

8

2

2

4

7,5

14

2

2

(2) Rule
A response shall be emitted from the PICC.
9.3.3 Resonance Frequency
Shall comply with "PICC resonance frequency (informative)" of ISO/IEC 10373-6/AM2.
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Version 2.0
Explanatory Notes:
The method for measuring resonance frequency was added by ISO/IEC 10373-6/AM2. The changes are
summarized below.
The resonance frequency of a PICC is measured using an impedance analyzer connected to a calibrationcoil, or an LCR-meter. The coil of the PICC shall as close as possible to the calibration coil with their center
axis being concentric. The resonance frequency is the frequency where the resistant component of the
impedance is at its maximum.
Compatibility Improvement Specifications:
Results shall satisfy the Compatibility Improvement Specifications of "5.1.3 Resonance Frequency."
Operation Diversification Specifications (Informative):
Results shall satisfy the Operation Diversification Specifications of "5.1.3 Resonance Frequency."
9.3.4 Maximum Field Strength Application Test
The purpose of this test is to verify that the PICC under test does not have any anomaly after applying
maximum field strength on the PICC.
Compatibility Improvement Specifications:(1) Test procedure
Place a PICC into the DUT position on the Test PCD and after applying a field with an average (for the
span of 30 seconds) strength of 10 A/m rms at 13,56 MHz, verify the operation of the PICC.
(2) Rule
PICC must function normally after applying magnetic field
Operation Diversification Specifications:
These test items only apply to PICCs premised on double card operation.
(1) Test procedurea) Case of pairing two PICCs
Place the paired PICCs into the DUT position on the Test PCD and after applying a field with an average(for the span of 30 seconds) strength of 10 A/m rms at 13,56 MHz, verify the operation of the PICCs.
b) Case of Pairing a PICC with a Reference PICC
Place the PICC under test paired with a reference PICC-S/M/L into the DUT position on the Test PCD andafter applying a field with an average (for the span of 30 seconds) strength of 10 A/m rms at 13,56 MHz,
verify the operation of the PICCs.
45

Version 2.0(2) Rule
PICC must function normally after applying magnetic field
Considerations:
Keep in mind that characteristics will change depending on the order within the combination of the PICC
under test and the reference PICC.
9.3.5 Power Transmit Interference Test for Double Card Operations
Operation Diversification Specifications:
These test items only apply to PICCs premised on double card operation. The tests measure the effect of
the PICC on the Reference PICC -S/M/L.
(1) Test Method
Connect jumper J1 to resistor R3 of the power transmission testing reference PICC, then pair the same
type of power transmission testing reference PICC and place them on the DUT position of the test PCD,
and adjust the output of the test PCD so that the voltage at both ends of R3 of the power transmission
testing reference PICC is 6,8 V.
Next, pair a PICC with a single power transmission testing reference PICC and place them on the DUT
position of the test PCD, and measure power received by the power transmission testing reference PICC.
(2) Rule
The received voltage of the reference PICC-S/M/L shall be 6,8 V or more.
9.3.6 PICC Dynamic Test (Informative)
This test is for PICCs used in systems utilizing Open type PCDs.
The test measures whether the PICC is activated successfully depending on the change in field strength
received by the PICC when the PICC is dynamically approaching the communicating range of the PCD.

Operation Diversification Specifications (Informative):(1) Test Method
Based on the test method specified in "9.3.1 Load Modulation Amplitude Test," the PICC shall maintain aparallel position with regard to the test PCD antenna while dynamically approaching the test PCD antenna,
and after 5 ms has passed since receiving the minimum operating field, the PICC shall receive REQA or
REQB generated by the test PCD as specified in "7.1 Polling" from the test PCD antenna. After that,connect the output of the test PCD to an oscilloscope to verify the load modulation signal emitted by the
PICC.
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Version 2.0
Note that the approaching speed of the PICC depends on the usage and operation of each system. As
such, the speed shall be determined depending on the individual systems.
(2) Rule
A response shall be emitted from the PICC.

Field strength
PICC receives

H[A/m]The PICC must be able
to receive commands
and process themsuccessfully.

Minimum
OperatingField (Hmin)

t0

Time

5 ms or more

Figure 9.1 – Verification on PICC Activation

Considerations:– Case using Open type PCDs
(PCD and upper system)
Considering performing communication while moving the PICC within the polling field, the behavior f the
PICC may become unstable when the PICC is approaching the PCD and the operating field is below
minimum, or when after entering the stipulated field, the operating field becomes lower than the stipulated
strength due to the PICC moving away. Thus, anticipating situations where the PICC does not respondduring communication, it is desirable to prepare a mechanism that will reset the PICC by switching thecarrier OFF and ON at the system side including the PCD and then retry communicating.
(PICC)The PICC shall operate successfully within the range of Hmin and Hmax

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Version 2.0
9.3.7 Protocol Timing Characteristics (Informative)
Compatibility Improvement Specification (Informative): <Refer to ISO/IEC 10373-6:2001/FPDAM1>(1) Test Method
Refer to ISO/IEC 10373-6:2001/FPADM1 and measure each protocol timing specified in Table 9.6 and 9.7.
(2) Rule
The measurements of each protocol timing shall satisfy the values specified in Table 9.6 and 9.7.

Table 9.6 – Excerpt from< ISO/IEC 10373-6:2001/FPDAM1. Table G.4 – Type A Specific Timing Table>
No
1

2

3
4

Name
Frame delay time
PCD to PICC
(for REQA,WUPA,ANTICOLLISION,SELECT
commands)
Frame delay time
PCD to PICC
(for all commands, exclude
ones from previous row)
Request Guard Time
Deactivation frame waitingtime

ISO Reference(ISO/IEC144433:2001)
Clause 6.1.2

Clause 6.1.2

Clause 6.1.4
Clause 8.1

Required Test Value

Measured
Value(s)Last bit (1)b-> 1 236/fc
Last bit (0)b-> 1 172/fc

Last bit (1)b ->(n × 128 + 84) / fc
Last bit (0)b ->(n × 128 + 20) / fc
Min. 7 000/fc
See Table G. 5 No.12(same values)

NOTE All timing values are calculated for carrier frequency fc equal 13,56 MHz and bit rate equal fc/128 (~106 kbit/s).

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Version 2.0
Table 9.7 – Excerpt from
<ISO/IEC 10373-6:2001/FPDAM1. Table G0.5 – Type A Specific Timing Table>
No

Name

1

SOF low

ISO Reference(ISO/IEC144433:2001)
Clause 7.1.4

Std MinStd Max
11 etu(~103,83 µs)

Clause 7.1.1

10 etu(～94,40 µs)
2 etu(～18,88 µs)
10 etu(～94,40 µs)(n -1/8) etu

2

SOF high

Clause 7.1.4

3

EOF low

Clause 7.1.5

4

Bit boundaries(n + 1/8) etu

5

Bit rate
Clause 7.1.2

19 µs

7

EGT PICC
to PCDTR0 for ATQB

fc/128(~106 kbit/s)
0 µs

6

8

TR1 for ATQB

Clause 7.1.6

9

TR0 Not
ATQB

Clause 7.1.6
Clause 7.10.3

10

TR1 Not
ATQB

Clause 7.1.6
Clause 7.10.3

11Delay from theend of EOF
and Subcarrier
off
Deactivation
frame waiting
time

Clause 7.1.7

12

Clause 7.1.6

Clause 8.1

Measured
Value(s)3 etu(~28,32 µs)
11 etu(~103,38 µs)

64/fs(～75,52 µs)
80/fs(～94,40 µs)
64/fs(～75,52 µs)
orMay be Reduced
80/fs(～94,40 µs)
orMay be Reduced
0 µs

256/fs(~302,06 µs)

64/fs + 80/fs(～169,92 µs)

65 536/fs(~4,8 ms)

200/fs(~235,99 µs)(256/fs) × 2FWI TR1(~302,06 × 2FWI) TR1 µs

FWI =Max TR0 =200/fs(~235,99 µs)

2 etu

NOTE All timing values are calculated for carrier frequency fc equal 13,56 MHz and bit rate equal fc/128 (~106 kbit/s).

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Version 2.0
9.4 Test Content for the PCD Under Test
9.4.1 Field Strength
Shall comply with the "PCD field strength" of ISO/IEC 10373-6 (JIS X 6305-6).
Compatibility Improvement Specifications:(1) Test Method
Using the Reference PICC -S/M/L, measure minimum and maximum field generated. Test procedure andmeasurements shall be the same as those stipulated in "PCD field strength" of ISO/IEC 10373-6 (JIS X
6305-6), and minimum field strength (Hmin) shall be equal to the value stipulated in "5.2.4 Generated
Magnetic Field."(2) Rulea) Maximum generated fieldReceive voltage of 3 V or less within the operating range of the PCD.
b) Minimum generated fieldReceive voltage of 3 V or more within the operating range of the PCD.
9.4.2 Power Transfer Test
Shall comply with the "Power transfer PCD to PIC" of ISO/IEC 10373-6 (JIS X 6305-6).
Compatibility Improvement Specifications (Informative):(1) Test Method
Using the Reference PICC -S/M/L for power transfer tests, measure the voltage. Test procedure shall be
the same as the procedure stipulated in "Power transfer PCD to PIC" of ISO/IEC 10373-6 (JIS X 6305-6).
Connect jumper to resistor R3 of the reference PICC-S/M/L and tune the resonance frequency to 19 MHz.
Measure the voltage generated at both ends of R3 with a high input impedance voltmeter. Measurement
shall be performed with all reference PICC-S/M/L.
(2) Measurements
Measure the voltage generated at both ends of R3 within the operating range of the PCD.
(3) Rule
Receive voltage of reference PICC shall be 6,8 V or more
Operation Diversification Specifications (Informative):
These test items only apply to PCDs premised on double card operation.
50Version 2.0(1) Test Method
Using the Reference PICC -S/M/L for power transfer tests, measure the voltage. Test procedure shall be
the same as the procedure stipulated in "Power transfer PCD to PIC" of ISO/IEC 10373-6 (JIS X 6305-6).
Connect jumper to resistor R3 of the reference PICC-S/M/L and tune the resonance frequency to 19 MHz.
(Tuning shall be done against the two reference PICCs used in the test) Place the paired reference PICCs
in the operating range of the PCD and measure the voltage generated at both ends of R3 with a high input
impedance voltmeter. Check for all combinations of reference PICCs.
(2) Measurements
Measure the voltage generated at both ends of R3 within the operating range of the PCD.
(3) Rule
Receive voltage of reference PICC shall be 6,8 V or more
9.4.3 Modulation Waveform
Shall comply with the "Modulation index and waveform" of ISO/IEC 10373-6 (JIS X 6305-6).
Compatibility Improvement Specifications:
The modulation waveform shall be measured with the reference PICC set in place.
(1) Test Method
Measure the modulation waveform on the calibration coil with the reference PICC placed within theoperating range of the PCD.
Using the Reference PICC -S/M/L for modulation waveform tests, measure the specified measurements.
i)

Tune the reference PICC so as to synchronize at 19 MHz.

ii)

Place the calibration coil over the reference PICC-S/M/L coil, place the reference PICC in theoperating range of the PCD, and measure the modulation waveform by monitoring the voltage
waveform induced on the calibration coil.

(2) Measurements
Measure the modulation waveform in the operating range of the PCD, along with measurement of themodulation index, rise time, fall time, and overshoot.
(3) Rule
The modulation index and modulation waveform shall satisfy the provisions stipulated in "Modulation" of
ISO/IEC 14443-2 (JIS X 6322-2).

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Version 2.0
Operation Diversification Specifications:
These test items only apply to PCDs premised on double card operation.
Using all combinations of Reference PICC -S/M/L for modulation waveform tests, measure the modulation
waveform by placing the paired PICCs in position.
(1) Test Methodi)

Adjust the reference PICC so as to synchronize at 19 MHz. (Adjust for the two reference PICCs
used in testing.)

ii)

Place the paired reference PICCs so that one is on the other, and measure the modulation
waveform from the voltage waveform induced on the calibration coil.

(2) Measurements
Measure the modulation waveform in the operating range of the PCD, along with measurement of themodulation index, rise time, fall time, and overshoot.
(3) Rule
The modulation index and modulation waveform shall satisfy the provisions stipulated in "Modulation" of
ISO/IEC 14443-2 (JIS X 6322-2).
9.4.4 Reception Ability of Load Modulation Signal (Informative)
Shall comply with the "Load modulation reception (informative only)" of ISO/IEC 10373-6 (JIS X 63056).
Compatibility Improvement Specifications:(1) Test Method
Using the Reference PICC -S/M/L for power modulation tests, measure the voltage.
Other test procedure shall be the same as the procedure stipulated in "Load modulation reception(informative only)" of ISO/IEC 10373-6 (JIS X 6305-6).
(2) Measurements
Measure the load modulation signal that can be received by the PCD within the operating range of the
PCD.
(3) Rule
The PCD shall be able to receive the load modulation signal stipulated in "Load modulation" of ISO/IEC
14443-2 (JIS X 6322-2).

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Version 2.0
9.4.5 Temperature Rise Test (Informative)
This test only applies to Insertion type PCDs.
Verify that the temperature surrounding the PICC inserted into the Insertion type PCD does not exceed theguaranteed maximum operating temperature of the PICC.
(1) Test parameters
On performing this test, the parameters below shall be determined according to the actual use
environment.
a)Surrounding temperature of the PCD

b)Interval between PCD carrier ON to the moment the temperature within the PCD is measured(2) Test Method
The test shall be conducted as follows.
a)Turn ON the PCD and wait 30 minutes in a carrier OFF state.

b)Insert the dummy PICC into the PICC and switch the carrier state to ON.

c)After the specified time has passed, measure the surrounding temperature of the dummy PICC
within the PCD.

Explanatory Notes:– The dummy PICC shall be the same shape as the actual PICC to be used and shall not emit heat.
(Usually, a plastic card, etc. without an embedded IC chip is used.)– Temperature measurement devices are not specifically stipulated.
(3) Rule
The surrounding temperature of the dummy PICC shall be 50°C or lower.
9.5 Test Apparatus for Unit Tests
9.5.1 Calibration CoilShall comply with "Calibration coil" of ISO/IEC 10373-6 and ISO/IEC 10373-6/AM2 (JIS X 6305-6).
Explanatory Notes:
Note that changes have been applied in accordance with ISO/IEC 10373-6/AM2.
Major changes are the following.
– Change in Note: Change of standard inductor value and resistance value.
53

Version 2.0– Addition of Note: Note of caution related to connection of oscilloscope added.
9.5.2 Test PCD
9.5.2.1 Assembly of Test PCD
Shall comply with "Assembly of test PCD" and Annex of ISO/IEC 10373-6 and ISO/IEC 10373-6/AM2(JIS X 6305-6).
Explanatory Notes:
Note that changes have been applied in accordance with ISO/IEC 10373-6/AM2.
Major changes are the following.
– Changed resistance value in Figure 9.2.
– Note of Annex A Test PCD Antenna: Added note of caution regarding capacitor and resistor ratings.

Figure 9.2 – Initial Settings of Test PCD

9.5.2.2 Settings of Test PCD
Shall compy with Annex of ISO/IEC 10373-6 and ISO/IEC 10373-6/AM2 (JIS X 6305-6).
9.5.3 Test PCD-S
9.5.3.1 Assembly of Test PCD-S
Table 9.8 shows the antenna specifications of the PCD-S.

54

Version 2.0
Name
Antenna coil

Antenna board
Impedance
matching network

Table 9.8 – Antenna Specification of Test PCD-S
Description
Coil outer diameter(38 ± 0,2) mm
Pattern width
0,5 mmPattern interval
0,5 mmPattern thickness
35 µm
No. of turns
3 turns
Structure
The coil shall be made as a printed coilon PCB plated with copper.
Size
120 mm × 100 mm
Thickness
1,6 mmMaterial
FR4
Impedance is matched between the antenna coil and output
circuit at 50 Ohm.

Figure 9.3 shows the Test PCD-S circuit and Figure 9.4 shows the structure of the Test PCD-S.
The calibration coil and test PCD-S antenna shall be arranged in parallel so that the central axis of thecalibration coil and test PCD-S antenna coil are concentric. At this time, the test PCD-S shall beassembled so that the distance between the effective conductor surfaces is 15 mm as shown in Figure
9.4.
In addition, a 5 mm spacer shall be arranged between the Test PCD-S and measured PICC, and thespacer surface shall be defined as the reference surface (distance: 0 mm) of the Test PCD-S, while theantenna center of the Test PCD-S shall be defined as the central position.

55

Version 2.0
To oscilloscope
Calibrationcoil

50 Ohm driver
Antennacoil

Impedance
Matching
Circuit
C3
C2

Z=50 Ohm
C1

Rext
Rant

C4 C5 C6

Lant

Figure 9.3 – Test PCD-S Circuit

Calibran coilcircuit board shapedisplancement+X direction

Measured card
center of shape
Measured card

Antenna coil centerof Test PCD-S

displacement+Y direction
120mm

Antenna coil for
Test PCD-S

Calibration coil

100mm

Measured card
Reference Surface

5mm

15mm

Calibration coilSpacer (distance 0)

Antenna coil of Test PCD-S

Figure 9.4 – Test PCD-S Structure56

Version 2.0

9.5.3.2 Settings of Test PCD-S
9.5.3.2.1 Calibration of Generated Field
Compatibility Improvement Specifications:
Using the reference PICC-S and reference PICC-L, the field strength H of the Test PCD-S shall becalibrated to the maximum generated field and minimum generated field as specified in the Compatibility
Improvement Specifications of 9.4.1.
The center of the reference PICC shall be concentric with the center of the Test PCD-S antenna at a
distance of 0 mm (reference surface) with no disposition.
(1) Calibration of maximum generated fieldOn the Test PCD, the output voltage of the reference PICC-S shall be tuned to measure 3 V under a fieldstrength of 7,5 A/m. After placing this reference PICC-S in the DUT position of the PCD-S, the Test PCD-S
shall be tuned so that the output voltage of the reference PICC-S measures 3 V.
(2) Calibration of minimum generated fieldOn the Test PCD, the output voltage of the reference PICC-L shall be tuned to measure 3 V under a fieldstrength of 4,0 A/m. After placing this reference PICC-L in the DUT position of the PCD-S, the Test PCD-S
shall be tuned so that the output voltage of the reference PICC-L measures 3 V.
9.5.3.2.2 Modulation Waveform
By measuring the modulation waveform at the calibration coil, the modulation waveform shall be calibrated
so that the modulation waveform matches the stipulated waveform. The center of the calibration coil shallbe concentric with the center of the Test PCD-S antenna at a distance of 0 mm (reference surface) with nodisposition.
9.5.4 Reference PICC
Shall comply with the "Reference PICCs" of SO/IEC 10373-6 and ISO/IEC 10373-6/AM2 (JIS X 6305-6)
and shall add the following provisions.
Explanatory Notes:
Note that changes have been applied to relevant areas in accordance with ISO/IEC 10373-6/AM2.
Major changes are the following.
– Field strength as well as the adjustment range of R2 within the circuit of the reference PICC for
measuring voltage was changed.
– The adjustment method of the resonance frequency of the reference PICC was changed.

57

Version 2.0
Compatibility Improvement Specifications:
1) Size, thickness and material of the reference PICC-S/M/L
Size, thickness and material of the reference PICC-S/M/L shall be the same as the reference PICC.
2) Coil Characteristics
Table 9.9 shows the size and other charecteristics of the reference PICC-S/M/L.

Subject Area
Coil dimensions

Table 9.9 – Characteristics of Reference PICC-S/M/L
Description
Reference PICC-S
Reference PICC-M
Reference PICC-L
Coil inner diameter:
Coil outer diameter:
Coil outer diameter:(66,6 ± 2%) mm ×
(31 ± 2%) mm(72 ± 2%) mm ×
(42 ± 2%) mm(83,6 ± 2%) mm ×
(52 ± 2%) mm

Corner radius:(8,5 ± 2%) mm

Corner radius:(5 ± 2%) mm

Corner radius:(5 ± 2%) mm

No. of turns

4

Pattern width(0,5 ± 20%) mm

Pattern interval(0,5 ± 20%) mm

Pattern material

Copper plated.

Pattern thickness

35 µm

NOTE The coil characteristics of the reference PICC-M is the same as the reference PICC of theStandard Specification.
9.5.4.1 Reference PICC-S/M/L for Power Transfer Tests 9.5.4.1.1 Assembly of PICC-S/M/L
Figure 9.5 shows the circuit, and Table 9.10 shows the components of the reference PICC-S/M/L for
power transfer tests.

L

C1

D1

D2

D3

D4

C2
C3

C1: Stray
capacitance < 5pF

R2

R1
a

R3
b

VDC
ｃ

J1

J1: Jumpera:Power transfer (5 mW)
b:
Min/Max generated fieldc:
For power transfer (50 mW) and resonancefrequency adjustment

Figure 9.5 – Circuit of Reference PICC-S/M/L for Power Transfer Tests

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Version 2.0
Table 9.10 – Components
Comparison with Standard
Specification
L (coil)See Table 9.9
Reference PICC-S/M/L isdefined.
C1
Stray capacitance < 5 pF
Same.
C2
From 6 pF to 60 pF
C3
10 nF
D1, D2, D3, D4 See Table 9.11 (BAR43 orequivalent)
R1
1.8 kOhm (5 mW)
R2
From 0 to 1 kOhm 1)
R3
910 Ohm
Newly added.
Component

Value1) Changed according to ISO/IEC 10373-6/AM2
Table 9.11 – Basic Characteristics of Diode D1, D2,D3, and D4
Subject Test condition Standard Maximum Unit
Forward voltage dropVF
Area
(Tj = 25°C)
Reverse voltage
VR
Forward current
IF
VF
IF = 2 mA
0,33
V
Reverse current
IR
VR = 1 V
Recovery time
trr
C
7
pF
F = 1 MHz
Recovery current
Irr
IF = 10 mA
Tj
Juncture temperaturetrr5ns
IR = 1 mA
F
Frequency
Irr = 1 mA
C
Juncture capacity

9.5.4.1.2 Resonance Frequency Setting of PICC-S/M/L
The resonance frequency shall be set based on the method for setting the resonance frequency of thereference PICC as stipulated in "PCD field strength" and "Power transfer PCD to PICC" of ISO/IEC
10373-6/AM2, with modifications as stipulated below in the Compatibility Improvement Specifications.
Explanatory Notes:
The method for setting resonance frequency was changed by ISO/IEC 10373-6/AM2. The changes are
summarized below.
Drive the calibration coil directly from the signal generator using the frequency to set, set the jumper to a,and tune C2 so that the voltage at both ends of the resistance (1,8 kOhm) becomes largest. Here, thesignal generator output and C2 shall be tuned so that the maximum voltage at both ends of resistance R1
is 3 V.
Compatibility Improvement Specifications:
Drive the calibration coil directly from the signal generator using the frequency to set, set the jumper to c,
and tune C2 so that the voltage at both ends of the resistance R3 (910 kOhm) becomes largest. Here, thesignal generator output and C2 shall be tuned so that the maximum voltage at both ends of resistance R3
is 3 V.
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Version 2.0
9.5.4.1.3 Setting Resistor R2 of PICC-S/M/L
Shall comply with the method of setting resistor R2 of the reference PICC stipulated in "PCD fieldstrength" of ISO/IEC 10373-6/AM2.
Explanatory Notes:
Resistance R2 shall be set as follows.
1) Calibrate the field generated by the test PCD using a calibration coil.
2) Set the resonance frequency.
3) Place the reference PICC in the DUT position on the test PCD and connect jumper to resistor R2.
Measure the voltage at both ends of R2 with a high input impedance voltmeter, and adjust the voltage to 3
V (dc). Observe the state of the operating field by monitoring the voltage generated on the calibration coil.
9.5.4.2 Reference PICC-S/M/L for Load Modulation Tests
9.5.4.2.1 Assembly of PICC-S/M/L
Figure 9.6 shows the circuit, and Table 9.12 shows the components of the reference PICC-S/M/L formodulation waveform tests.
J1 ab

C1: Stray
capacitance < 5pF

Rmod
1

N1

Cmod1

R2
R3

L

D2

D1

R1

R6

C1
C2

Laod modulation
signal847 kHz

D4

D3

C3

a
J1, J2: Jumpers
a: resistance loadb: capacity load

J2

b

C4

D5

Rmod
2

R4
N2

Cmod2

R5

Figure 9.6 – Circuit of Reference PICC-S/M/L for Load Modulation Tests

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Version 2.0
Table 9.12 – Components
Adjustment Components
Component
Function

Value

R1

adjust Q

0 Ohm

C2

Requiresadjustments.

Cmod1,
Cmod2
Rmod1,
Rmod2
R6

Capacitor
modulation
Resistive
modulation
Shunt resistance

Value that makes
the resonancefrequency 19
MHz.
0 pF (None)

D5

Adjusts
voltage.

From 400 Ohm to
12 kOhm
100 Ohmshunt 5,1 V

Comparison with Standard
Specification
Within range of ISO (from 0
Ohm to 10 Ohm)
Same.

Remove since it is performed
with resistive modulation.
Same.
Within range of ISO (from 10
Ohm to 5 kOhm)
Within range of ISO (from 2,7 V
to 15 V)

Fixed Components
Component
Value
R2, R3, R4, R5 1 MOhm
D1, D2, D3, D4 See Table 9.11 (BAR43 or equivalent)L
See Table 9.9
C1
C2
C3
C4
N1, N2

Stray capacitance < 5 pF
From 6 pF to 60 pF
100 pF
10 nF
N-MOS transistor with earth capacitance of
10 pF or less9.5.4.2.2 Resonance Frequency Setting of PICC-S/M/L
Use the same method as stipulated in 9.5.4.1.2.
Explanatory Notes:
Resonance frequency is not stipulated in ISO/IEC 10373-6 (JIS X 6322-6).

61

Comparison withStandard Specification
Same.
Reference
defined.
Same.

PICC-S/M/L

isVersion 2.0
9.5.4.3 Reference PICC-S/M/L for Modulation Waveform Tests
9.5.4.3.1 Assembly of PICC-S/M/L
Figure 9.7 shows the circuit, and Table 9.13 shows the components of the reference PICC-S/M/L formodulation waveform tests.

Matching circuit

CV1

L

R1

Stray capacitance
up to 5 pF
Figure 9.7 – Circuit of Reference PICC-S/M/L for Modulation Waveform Tests

Component
L (coil)
CV1
R1

Table 9.13 – Components
Value
Comparison with Standard
Specification
See Table 9.9
Newly added.
From 6 pF to 60 pF
910 Ohm

9.5.4.3.2 Resonance Frequency Setting of PICC-S/M/L
CV1 shall be tuned using the same measurement method as for the resonance frequency of PICC.

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10 External Communication Protocol (Informative)

10.1 Scope
Section 10.2 of this chapter "10 External Communication Protocol," stipulates API functions required to
implement the proximity communication interface for the communication protocol between the reader/writerdevice and external device (upper device). Also Section 10.3 describes command based communication
sequences between the upper device and the reader/writer device and card.
The scope of the provisions in this chapter includes contact-type cards reader/writer devices. Thus, inorder not to limit the provisions to contactless-type cards, the terms "card" and "reader/writer device" shallbe used.
The external communication protocol described herein is informative since it is not specified in theStandard Specification and will depend on the application using it.

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Figure 10.1 shows the scope of the specification described in Section 10.2.
Card

Upper Device
Card processing
Application(Service Application)

Application on
Card

Command Control

Scope of
Section
10.2

Command Processing
Protocol Processing(１４４４３−４/T=0/T=1/FeliCa)

Protocol Control
Scope of Specification

Card Type Processing(Type A/B/FeliCa/Contact)

Reader/Writer
Card Type Processing

Card Type Control(Type A/B/FeliCa/Contact)

Reader/Writer Control

Reader/Writer Processing

Port

Port

Note: FeliCa is a technology method for contactless IC cards developed by Sony Corporation,and is a registered trademark of Sony Corporation.
Figure 10.1 – Scope of the Interface Specification of the Reader/Writer Device Control API

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10.2 Interface Specification of the Reader/Writer Device Control API
The descriptions herein stipulate the specification of the reader/writer device common interface (APIfunctions) as seen from the upper device and will not specify interface specifications particular toreader/writer devices.
Note that service applications of upper devices shall use particular interfaces when using reader/writerdevice specific features.
A summary of the common interface is described below.
10.2.1 Overview of the Common Interface
A summary of the common interface is described below.
(1) Purpose of the Common Interface
To absorb differences in reader/writer devices and to provide common interface functions to service
applications.
To simplify procedures for controlling reader/writer devices and card communication.
(2) Form of the Common Interface
Dynamic Link Library (DLL)(3) Common Interface Driver Name
ITRWDRIVER.DLL

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10.2.2 List of Major Interface Functions
Table 10.1 shows a list of major functions supported by the common interface, and Table 10.2 shows a listof error codes.

№
1
2
3
4
5
6
7
8

Function name
RW_Open
RW_Close
RW_Insert
RW_Eject
RW_Sense
RW_Activate
RW_Transmit
RW_Deactivate

Table 10.1 – List of Major Interface Functions
Description
Open communication port of reader/writer device.
Close communication port of reader/writer device.
Allow insertion of card.
Eject card.
Detect card.
Set card to ACTIVE state.
Perform data transmission between card.
Set card to inactive state.

№
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21

Error code
0x0000A001
0x0000A002
0x0000A003
0x0000A004
0x0000A101
0x0000A102
0x0000A201
0x0000A202
0x0000A203
0x0000A301
0x0000A302
0x0000A303
0x0000A304
0x0000A305
0x0000A306
0x0000A901
0x0000A902
0x0000A903
0x0000AE01
0x0000AE02
0x0000AE03

Table 10.2 – Common Error Code List
Description
Number error of specified port.
Open failure on specified port.
Close failure on specified port.
Specified port not open.
Error occurred during transmission to reader/writer device.
Error occurred during transmission from reader/writer device.
Error occurred during transmission to card.
Error occurred during transmission from card.
Timeout occurred during transmission from card.
Number error (other than 1 or 2) of specified slot
Specified communication speed not supported by reader/writer.
Specified communication speed not supported by card.
Specified communication speed not supported by reader/writer.
Specified operation mode not supported by reader/writer device.
Cannot initialize card with specified operation mode.
Specified port already open.
Specified port already closed.
INSERT command already received.
Card not inserted.
Card not initialized.
Card is jammed.

NOTE Error codes for reader/writer device specific interface code shall be defined avoiding therange from 0x0000A000 to 0x0000AFFF.

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10.2.3 Procedures of Using the Common Interface
Figure 10.2 shows the usage procedure of the common interface functions during basic operations of a
card.
START

RW_Open( )RW_Insert( )RW_Sense( )Card Insert

No

Yes
RW_Activate( )RW_Transmit( )End transmit

No

Yes
RW_Eject( )RW_Close( )END

Note: The procedure shows basic operations only and does not show all procedures.
Figure 10.2 – Usage of Function During Basic Operations

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10.2.4 Function Details
Details of the common interface functions are described herein. Note that the operating environment of theexamples of functions shown below assumes a device that run a Windows environment.
Note: Windows is a trademark or registered trademark of Microsoft Corporation in the United States ofAmerica and other countries.
(1) Function Name: RW_Open
Description
Directs a reader/writer device to open a connected communication port.
When using a COM port, the communication speed between the upper device (PC) and the cardshould be set to the maximum communication speed the reader/writer device supports.

Synopsis
DWORD WINAPI RW_Open(BYTE bPortNumber)Arguments
bPortNumber: The port to open.
COM port: 1 though 9 (COM1 through COM9)
USB port: 101 through 109
Note: Ports other than the above are vendor specific.
Return value
0: Normal termination.
Non 0: Error occurred.
0x0000A001: Number error of specified port.
0x0000A901: Specified port already open.
0x0000A002: Open failure on specified port.

(2) Function Name: RW_Close
Description
Directs a reader/writer device to close a connected communication port.

Synopsis
DWORD WINAPI RW_Close(BYTE bPortNumber)Arguments
bPortNumber: The port to close.
COM port: 1 though 9 (COM1 through COM9)
USB port: 101 through 109
Note: Ports other than the above are vendor specific.
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Return value
0: Normal termination.
Non 0: Error occurred.
0x0000A001: Number error of specified port.
0x0000A902: Specified port already closed.
0x0000A003: Close failure on specified port.
(3) Function Name: RW_Insert
Description
Allow insertion of card into slot of designated reader/writer device.

Synopsis
DWORD WINAPI RW_Insert(BYTE bPortNumber,BYTE bSlotNumber)Arguments
bPortNumber: Communication port.
COM port: 1 though 9 (COM1 through COM9)
USB port: 101 through 109
Note: Ports other than the above are vendor specific.
bSlotNumber: Slot number (1 or 2).

Return value
0: Normal termination.
Non 0: Error occurred.
0x0000A001: Number error of specified port.
0x0000A004: Specified port not open.
0x0000A101: Error occurred during transmission to reader/writer device.
0x0000A102: Error occurred during transmission from reader/writer device.
0x0000A301: Slot Number (other than 1 or 2) error of specified port.
0x0000A302: Specified slot number not supported.
0x0000A902: INSERT command already executed.
NOTE:
Reader/writer devices that do not support the allow card insertion command shall return a normal
termination value if there are no errors in the arguments passed to it.
The allow card insertion state shall be reset by issuing the RW_Eject function.

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Version 2.0(4) Function Name: RW_Eject
Description
Allow ejection of card from slot of designated reader/writer device.

Synopsis
DWORD WINAPI RW_Eject(BYTE bPortNumber, BYTE bSlotNumber)Arguments
bPortNumber: Communication port.
COM port: 1 though 9 (COM1 through COM9)
USB port: 101 through 109
Note: Ports other than the above are vendor specific.
bSlotNumber: Slot number (1 or 2).

Return value
0: Normal termination.
Non 0: Error occurred.
0x0000A001: Number error of specified port.
0x0000A004: Specified port not open.
0x0000A101: Error occurred during transmission to reader/writer device.
0x0000A102: Error occurred during transmission from reader/witer device.
0x0000A301: Slot Number (other than 1 or 2) error of specified port.
0x0000A302: Specified slot number not supported.
0x0000AE02: Card is jammed.
NOTE:
For contact-type cards, cards shall be ejected only after inactivating them.
For contactless cards, cards shall be ejected only after turning their carrier OFF.
For manual insertion-type reader/writer devices, perform the above operation to prepare for card
extraction.
If there are no errors in the arguments passed, reset the allow card insertion state.

(5) Function Name: RW_Sense
Description
Detects whether a card is inserted in the slot of the reader/writer device and detects the operating
status of the card.

Synopsis
DWORD WINAPI RW_Sense(BYTE bPortNumber,BYTE bSlotNumber,LPLONG IccStatus1,
LPLONG IccStatus2)

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Arguments
bPortNumber: Communication port.
COM port: 1 though 9 (COM1 through COM9)
USB port: 101 through 109
Note: Ports other than the above are vendor specific.
bSlotNumber: Slot number (1 or 2).
IccStatus1: The storage buffer for the insertion state and operating state of card number 1.
IccStatus2: The storage buffer for the insertion state and operating state of card number 2.

Return value
0: Normal termination.
Non 0: Error occurred.
0x0000A001: Number error of specified port.
0x0000A004: Specified port not open.
0x0000A101: Error occurred during transmission to reader/writer device.
0x0000A102: Error occurred during transmission from reader/writer device.
NOTE:
The insertion state and operating state of card (IccStatus1, IccStatus2 1))******** *******1 ******** ********B: card insertion state: card jammed******** *******0 ******** ********B: card insertion state: card not jammed******** ******** 0******* ********B: card insertion state: not inserted******** ******** 1******* ********B: card insertion state: inserted******** ******** *000**** ********B: card type: contactless Type B******** ******** *001**** ********B: card type: contactless Type A******** ******** *010**** ********B: card type: FeliCa technology method******** ******** *100**** ********B: card type: Contact type (T=0)******** ******** *101**** ********B: card type: Contact type (T=1)******** ******** *111**** ********B: card type: unknown******** ******** ****0000 ********B: card state: IDLE******** ******** ****0001 ********B: card state: READY******** ******** ****0010 ********B: card state: ACTIVE******** ******** ****1000 ********B: card state: HALT******** ******** ******** ******00B: Communication speed: reader/writer to card 1× speed (106 kbit/s)******** ******** ******** ******01B: Communication speed: reader/writer to card 2× speed (212 kbit/s)******** ******** ******** ******10B: Communication speed: reader/writer to card 4× speed (424 kbit/s)******** ******** ******** ******11B: Communication speed: reader/writer to card 8× speed (847 kbit/s)******** ******** ******** ****00**B: Communication speed: card to reader/writer 1× speed (106 kbit/s)******** ******** ******** ****01**B: Communication speed: card to reader/writer 2× speed (212 kbit/s)******** ******** ******** ****10**B: Communication speed: card to reader/writer 4× speed (424 kbit/s)******** ******** ******** ****11**B: Communication speed: card to reader/writer 8× speed (847 kbit/s)

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The communication speed of contact-type cards shall be 9 600 bit/s for 1× speed, 19 200 bit/s for 2×
speed, 38 400 bit/s for 4× speed, and 76 800 bit/s for 8× speed.
For single card operations, the value of argument IccStatus2 shall be set to 0.
1) Code of IccStatus1 and IccStatus2 may differ depending on the particular reader/writer device.

(6) Function Name: RW_Activate
Description
Initializes the card inserted into the slot of the reader/writer device to the specified operation modeand communication speed, and sets the card to ACTIVE state.

Synopsis
DWORD WINAPI RW_Activate(BYTE bPortNumber, BYTE bSlotNumber,
BYTE bCardNumber, BYTE IccMode, BYTE IccSpeed)

Arguments
bPortNumber: Communication port.
COM port: 1 though 9 (COM1 through COM9)
USB port: 101 through 109
Note: Ports other than the above are vendor specific.
bSlotNumber: Slot number (1 or 2).
bCardNumber: Card number (1 or 2).
IccMode: The operation mode to specify.
Contactless Type B (0x00), Contactless Type A (0x01),
Felica technology type (0x02), Contact type (0x10)
IccSpeed: The communication speed between the reader/writer device and card to set.
1× communication speed (0x00), 2× communication speed (0x01), 4× communication speed(0x02), 8× communication speed (0x03).
Autoset communication speed (0x80. Set the communication speed to the maximum speed
both reader/writer device and card support).
Return value
0: Normal termination.
Non 0: Error occurred.
0x0000A001: Number error of specified port.
0x0000A004: Specified port not open.
0x0000A101: Error occurred during transmission to reader/writer device.
0x0000A102: Error occurred during transmission from reader/writer device.
0x0000A201: Error occurred during transmission to card.
0x0000A202: Error occurred during transmission from card.
0x0000A203: Timeout occurred during transmission from card.
0x0000A301: Slot Number (other than 1 or 2) error of specified port.
0x0000A302: Specified slot number not supported.
0x0000A303: Specified communication speed not supported by card.
0x0000A304: Specified communication speed not supported by reader/writer device.
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0x0000A305: Specified operation mode not supported by reader/writer device.
0x0000A306: Cannot initialize card with specified operation mode.
0x0000AE01: Card not inserted.
NOTE:
The initialization of the card shall follow the procedures stipulated in the appropriate specificationin accordance with the specified operating mode.
Example: In Type B operating mode, following the procedures specified in the ISO/IEC 14443
standard, send the REQB command and then the ATTRIB commando to the card, and set the theoperating state of the card to ACTIVE state.

(7) Function Name: RW_Transmit
Description
Process the protocol in accordance with the operating mode of the card inserted in the slot of thespecified reader/writer device and transmit to and from the card.
Synopsis
DWORD WINAPI RW_Transmit(BYTE bPortNumber，BYTE bSlotNumber,
BYTE bCardNumber, DWORD dwLenSend，LPBYTE lpbSendBuf，
LPDWORD lpdwLenRecv，LPBYTE lpbRecvBuf)
Arguments
bPortNumber: Communication port.
COM port: 1 though 9 (COM1 through COM9)
USB port: 101 through 109
Note: Ports other than the above are vendor specific.
bSlotNumber: Slot number (1 or 2).
bCardNumber: card number (1 or 2).
dwLenSend: Number of bytes in send data (1 or more bytes).
lpbSendBuf: Buffer to store send data.
lpdwLenRecv: Buffer to store received number of data bytes.
lpbRecvBuf: Buffer to store received data.
Return value
0: Normal termination.
Non 0: Error occurred.
0x0000A001: Number error of specified port.
0x0000A004: Specified port not open.
0x0000A101: Error occurred during transmission to reader/writer device.
0x0000A102: Error occurred during transmission from reader/writer device.
0x0000A201: Error occurred during transmission to card.
0x0000A202: Error occurred during transmission from card.
0x0000A203: Timeout occurred during transmission from card.
0x0000A301: Slot Number (other than 1 or 2) error of specified port.
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Version 2.0
0x0000A302: Specified slot number not supported.
0x0000AE01: Card not inserted.
0x0000AE03: card not in ACTIVE state.
NOTE:
Response data from the card including those is SW1 and SW2 shall be stored in the received data
buffer.

(8) Function Name: RW_Deactivate
Description
Deactivate card inserted in the slot of designated reader/writer device.

Synopsis
DWORD WINAPI RW_Deactivate(BYTE bPortNumber, BYTE bSlotNumber,
BYTE bCardNumber)Arguments
bPortNumber: Communication port.
COM port: 1 though 9 (COM1 through COM9)
USB port: 101 through 109
Note: Ports other than the above are vendor specific.
bSlotNumber: Slot number (1 or 2).
bCardNumber: card number (1 or 2).

Return value
0: Normal termination.
Non 0: Error occurred.
0x0000A001: Number error of specified port.
0x0000A004: Specified port not open.
0x0000A101: Error occurred during transmission to reader/writer device.
0x0000A102: Error occurred during transmission from reader/writer device.
0x0000A301: Slot Number (other than 1 or 2) error of specified port.
0x0000A302: Specified slot number not supported.
NOTE:
The behavior of this API function depends upon the particular reader/writer device.
The reader/writer device may halt transferring power to the card. Thus when operating with two
cards in a single slot, caution must be exercised on calling this function.

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10.3 Communication Sequence
Command based communication sequences between the upper device and the reader/writer device andcard are described herein.
10.3.1 Normal Sequence Examples
Examples of normal communication sequences are shown below.
(1) Reader/Writer Device Initialization
Figure 10.3 shows the sequence from initialization of the reader/writer device to enabling communication
with the card.
Upper Dev

Reaeader/Writer(Power On Reader Writer)

Upper Info Retrieval Command

Reader/Writer Info Retrieval
Response

Upper Communication Speed
Change Command

Upper Communication Speed
Change Response(Change Communication Speed)(Change Communication Speed)

Carrier Control Command(Carrier Output ON)(Carrier Output ON)
Carrier Control Response

Figure 10.3 – Initialization Sequence75

Version 2.0(2) Type B Card Detection (One Card)
Figure 10.4 shows the sequence to detect a card Type B after initialization of the reader/writer device iscompleted. (Case of single card)
Upper Device
Request B Command

Card

Reader/Writer
REQB Command
Slot-MARKERCommand(n - 1 times)
Request B Response(No Card)

･･･

･･･

Request B Command

REQB Command(Insert Card)

Slot-MARKER Command(n - 1 times)
ATQB Response (1)Request B Response(Card (1))
Attribute Command (1)ATTRIB Command (1)Attribute Response (1)Answer to ATTRIB
Response (1)The numbers in parentheses are the number of the card for the sake of convenience, and indicate that the
information of the corresponding card is sent.
Figure 10.4 – Card Type B Detection Sequence76Version 2.0(3) Type B Card Detection (Multiple Cards)
Figure 10.5 shows the sequence to detect a card Type B after initialization of the reader/writer device iscompleted. (Case of two cards)
Upper Device
Request B Command

Reader/Writer

Card

REQB Command
Slot-MARKERCommand(n - 1 times)[Collision]

ATQB Response(1), (2)Request B Response(Collision)
Request B Command

REQB Command
Slot-MARKERCommand(n - 1 times)[No Collision]

ATQB Response(1), (2)Request B Response(Card (1), (2))
Attribute Command (1)ATTRIB Command (1)Attribute Response (1)Attribute Command (2)Answer to ATTRIB
Response (1)ATTRIB Command (2)Attribute Response (2)Answer to ATTRIB
Response (2)Note: The numbers in parentheses are the number of the card for the sake of convenience, and indicatethat the information of the corresponding card is sent.
Figure 10.5 – Card Type B Detection Sequence 2(4) Type A Card Detection (Multiple Cards)
Figure 10.6 shows the sequence to detect a card Type A after initialization of the reader/writer device iscompleted. (Case of two cards)
77

Version 2.0
Upper Device

Reader/Writer

Card Communication
Setting Change
Command (A)(Communication Type: A)

Request A Command

REQA_t Command

Card

Card Communication
Setting Change
Command

REQ-ID Command
Request A Response(No Card)...
Request A Command(Insert Card)
REQA_t Command
ATQA_t Response(1), (2)REQ-ID Command[Collision]

ATQ-ID Response(1), (2)Request A Response(Collision)
Request A Command

REQA_t Command
ATQA_t Response(1), (2)REQ-ID Command[No Collision]

ATQ-ID Response(1), (2)Request A Response(Card (1), (2))
Select A Command (1)SEL_t Command (1)Select A Response (1)ATS Request
Command (1)RATS Command (1)ATS Request Response

Parameter Changecommand (1)SAK Response (1)ATS Response (1)PPS Command (1)Parameter Change
Response (1)78

PPS Response (1)Version 2.0
Upper Device

Card

Reader/Writer

Select A Command (2)SEL_t Command (2)SAK Response (2)Select A Response (2)ATS Request Command (2)RATS Command (2)ATS Response (2)ATS Request Response (2)Parameter Change
Command (2)PPS Command (2)Parameter Change
Response (2)PPS Response (2)Note: The numbers in parentheses are the number of the card for the sake of convenience, and indicatethat the information of the corresponding card is sent.
Figure 10.6 – Card Type A Detection Sequence(5) 10.3.1.5 Card Deactivation
Figure 10.7 shows the sequence to deactivate a card after detection of the card is completed.

Upper Device
Command for Card
(DESELECT)

Card

Reader/Writer
DESELECT Command

OK Response

Response of Card
(OK)

(Transition to HALT state)
Figure 10.7 – Card Deactivation Sequence

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10.3.2 Abnormal Sequence Examples
The following indicates communication sequences on event of an error.
(1) Reader/Writer Device Receive Error
Figure 10.8 show the processing sequence when the reader/writer device has judged that a commandreceived from an upper device was a receive error.
Upper Device

Reader/Writer

Command(Receive Error)
Receive Error Response(Command Processing)Command (Resend)

Response
Figure 10.8 – Reader/Writer Device Receive Error Sequence(2) Upper Device Receive Error
Figure 10.9 show the processing sequence when the upper device has judged that a response received
from a reader/writer device was a receive error.
Upper Device

Reader/Writer(Command Processing)Command

Response(Receive Error)
Request Resend Command

Response (Resend)
Figure 10.9 – Upper Device Receive Error Sequence

80Version 2.0(3) Upper Communication Speed Change Error 1
Figure 10.10 shows the processing sequence when the upper device has judged that a response received
from a reader/writer device was a receive error when performing an upper communication speed changecommand.
Upper Device

Reader/Writer

Upper Communication Speed
Change Command(Command Processing)Response(Receive Error)(Communication Speed Change)(Communication Speed Change)

Request Resend Command
Response (Resend)
Figure 10.10 – Upper Communication Speed Change Error Sequence 1
If the upper device receives any response, it considers the reader/writer device has performed processing
normally and changes the communication speed.

81Version 2.0(4) Upper Communication Speed Change Error 2
Figure 10.11 shows the processing sequence when the reader/writer device has judged that a commandreceived from an upper device was a receive error when performing an upper communication speed
change command, and the upper device has judged that a response received from the reader/writerdevice was a receive error.
Upper Device

Reader/Writer

Upper Communication
Speed Change Command(Receive Error)
Receive Error Response(Receive Error)(Communication Speed Change)
Request Resend Command(Receive Error)(Receive Error)

Receive Error Response(Restore Original Speed)(Command Processing)Upper Communication

Response(Normal Receipt)(Communication Speed Change)(Communication Speed Change)

Figure 10.11 – Upper Communication Speed Change Error Sequence 2
If the upper device receives any response, it considers the reader/writer device has performed processing
normally and changes the communication speed. If a receive error occurs again when sending a request in
response to the resend command, the communication speed returns to its original speed.

82Version 2.0(5) Card Communication Error 1
Figure 10.12 show the processing sequence when the reader/writer device has judged that a response
received from a card was a receive error when performing a command upon the card.
Upper Device

Reader/Writer

Command for Card

Send DAT Portion to
Card

Card
(Command Processing)Response

Receive Error(Receive Error by Card)

Send Successful
Portions as Response

Resend According to
Sequence

Send DAT Portion to
Card(Command Processing)Response for Card

Response

Figure 10.12 – Card Communication Error Sequence 1
If the upper device has judged that there was a receive error from the card, the command is resent
according to the transmission sequence of the card.

(6) Card Communication Error 2
Figure 10.13 shows the processing sequence when the reader/writer device has judged that a response
from an upper device timed-out (due to a card receive error) when performing a command upon the card.
Upper Device

Reader/Writer

Command for Card

Send DAT Portion to
Card(Wait BWT)
(Send to Card Error)
Resend According to
Sequence

Card(Receive Error)

Send DAT Portion to
Card(Command Processing)Response for Card

Response

Figure 10.13 – Card Communication Error Sequence 2
If the upper device has judged that there was no response from the card, the command is resent according
to the transmission sequence of the card.

83Version 2.0(7) Card Communication Error 3
Figure 10.14 shows the processing sequence when the reader/writer device has judged that a response
from an upper device timed-out (due to absence of the card) when performing a command upon the card.
Upper Device

Reader/Writer

Command for Card

Send DAT Portion to
Card(Wait BWT)

Card

(Send to Card Error)
Resend According to
Sequence

Send DAT Portion to
Card(Wait BWT)
(Judge Card as Absent,
End Processing)
Figure 10.14 – Card Communication Error Sequence 3
If the upper device judges there is no response from the card and there is no response even after
resending, according to the transmission sequence of the card, it is judged that the card is absent.
10.3.3 Notes on Communication Sequence
When requesting resend (NAK) or waiting for response from the card, several communication sequences
between the upper device (application), reader/writer device and card can be possible. In such case,documentation such as operation manuals accompanying the reader/writer device or reader/writer device
driver should specify the communication sequences implemented by the reader/writer device so that users
can understand the sequences used.

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Examples of how to describe communication sequences are shown below.
(1) Communication Sequence Description Example 1
Figure 10.15 shows an example of a communication sequence of an upper device (application) requestinga resend.
Upper Device
Command for Card

Reader/Writer
Send DAT Portion to
Card(Monitor Timer)

Card(Command Processing)

Card does not respond or
Reader/Writer cannot receive response(Command Processing)Response

Response for Card

Figure 10.15 – An Example of a Communication Sequence of an Upper Device(Application) Requesting a Resend(2) Communication Sequence Description Example 2
Figure 10.16 shows an example of a communication sequence of a reader/writer device driver requestinga resend.
Upper Device

Reader/Writer

Command for
Card

Send DAT Portion to
Card

Card
(Command Processing)Response
Card does not respond or
Reader/Writer cannot receive response(Monitor Timer)
NAK Command(Command Processing)Response for Card

Response

Figure 10.16 – An Example of a Communication Sequence of a Reader/Writer Device
Driver Requesting a Resend85Version 2.0
11 Cross Tests (Informative)
The operating compatibility PICCs and PCDs shall be verified by performing functional cross tests using
PICCs and PCDs that will actually be used with the applied IC card system.
The cross tests described herein are informative since they are not specified in the Standard Specification
and will depend on the application using it.
11.1 Common Testing Conditions
11.1.1 Selection of Test Method
The test method shall be selected according to the operation mode (single card operation or double card
operation) and the type of PCD (Open type, Insertion type). (See table below.)
Table 11.1 – List of Applied Test Methods
OperatingmodeSingle Card
Operations
Double Card
Operations

PCD type
Insertion TypeOpen TypeInsertion TypeOpen Type

Test method to apply
11.2 Compatibility Test of Single Card Operations with
Insertion Type PCDs
11.3 Compatibility Test of Single Card Operations with
Open Type PCDs
11.4 Compatibility Test for Double Card Operations

11.1.2 Test Environment
The temperature and humidity of the test environment shall be determined considering the actual
operating environment of the applied IC card system.
11.1.3 Pre-test Considerations
The following shall be decided before performing the tests.
– The number of PCDs for each type of PCD and the number of PICCs for each type of PICC
It is recommended to use multiple PCDs and multiple PICCs.
– The interval between powering on the PCD and beginning the test
Specify the time required to avoid the instability that may occur immediately after powering on the PCD.
– The types of card commands to use for the tests
For the purpose of verifying compatibility, tests shall be performed using as many commands as
possible.

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Commands that entail maximum current and commands that emit strong noise shall be included in thecommands selected.
– The number of retries of the ISO/IEC 14443-4 transmission protocol– Communication speed between the PCD and PICC
– The direction of PICC (especially, for PICCs with no terminals and no printing, determine according to
the location of the IC chip, etc.)– The direction of PCD (for Open type PCDs)– The test poin on the PCD (for Open type PCDs)– Other parameters that will affect the tests

11.1.4 Pass-Fail Decisions
When a failure occurs for a certain combination, the PICC or PCD that caused the failure shall be
determined carefully after thoroughly investigating the situation and performing analysis.
11.2 Compatibility Test of Single Card Operations with Insertion Type PCDs
11.2.1 List of Tests
Table 11.2 lists the tests to perform.
Table 11.2 – List of Tests
No.

Test nameT1

Activation test

T2

Commandsend/receive test

Test description
After inserting the PICC into a
PCD, verify whether the PICC
can enter the activated state.

Verify that card commands
operate correctly.

87

Notes

Version 2.0
11.2.2 Test Combinations– Cross tests using all PCD types and all PICC types shall be performed.
– For each PCD, perform the test using each PICC sequentially.
Table 11.3 shows the combinations of the PCD and PICC for each test.
Table 11.3 – Combinations
Combination of PCD and PICCNo.

Test nameT1

Activation test

T2

Commandsend/receive test

to perform test
Perform tests using
combinations of all PCDs and all
PICCs
Perform tests using all
combinations that have passed
the T1 test.

Notes

11.2.3 PICC Insertion Direction
Perform insertion tests on PCDs from 4 directions.
– The 4 insertion directions
Forward and backward directions with front surface faced up and the same with back surface faced up.
11.2.4 Test Contents and Pass-Fail Criteria(1) T1 Tests– Verify that transition from REQ command to activation is performed correctly complying to ISO/IEC
14443-3.
– For each PICC, perform 10 times for 1 direction totaling 40 times with all 4 directions.
Table 11.4 shows the pass-fail criteria of the tests.
Table 11.4 – T1 Tests Pass-Fail Criteria
Evaluation
Pass
Fail

Criteria
More than 9 out of 10 attempts are
successful for all test points of all
combinations.
All other cases.

Notes(2) T2 Tests– Verify that card commands are sent and received correctly.
– For each PICC, perform 10 times for 1 direction totaling 40 times with all 4 directions.

88Version 2.0
Table 11.5 shows the pass-fail criteria of the tests.
Table 11.5 – T2 Tests Pass-Fail Criteria
Evaluation
Pass
Fail

Criteria
More than 9 out of 10 attempts are
successful for all commands of all
combinations.
All other cases.

Notes

11.2.5 Processing Flow
(1) Basic Processing Flow
Figure 11.1 shows the basic test processing flow.
START

Insert PICC
T1 TestT1 Passed?

NO

YES
T2 TestNO

All
Directions?

YES
YES

Next
PICC

NO
END

Figure 11.1 – Basic Test Processing Flow89

Version 2.0(2) T1 Test Processing Flow
BEGIN

RF ON

REQ Command to
Activation

NGOK
T1 Passed

T1 Failed

RF OFF

Insert PICC

Eject PICC

NO

10Times ?

YES
RETURN

Figure 11.2 – T1 Test Processing Flow90

Version 2.0(3) T2 Test Processing Flow

BEGIN

Insert PICC
RF ON
REQ Command to ActivationNG
RF OFF
Eject PICC

OK

Card Command Execution

NG

Repeat Fail
10 times?

OK

YES

Passed 1
Time

Failed 1 Time Failed 1 TimeRF OFF
Eject PICC

NO

10Times?

YES
RETURN

Figure 11.3 – T2 Test Processing Flow

91

NO

Version 2.0
11.3 Compatibility Test of Single Card Operations with Open Type PCDs
11.3.1 List of Tests
Table 11.6 lists the tests to perform.
Table 11.6 – List of Tests
No.

Test nameT1

Activation test

T2

Commandsend/receive test

Test description
After inserting the PICC into a
PCD, verify whether the PICC
can enter the activated state.

Notes

Verify that card commands
operate correctly.

11.3.2 Test Combinations– Cross tests using all PCD types and all PICC types shall be performed.
– For each PCD, perform the test using each PICC sequentially.
Table 11.7 shows the combinations of the PCD and PICC for each test.
Table 11.7 – Combinations
No.

Test nameT1

Activation test

T2

Commandsend/receive test

Combination of PCD and PICC
to perform test
Perform tests using
combinations of all PCDs and all
PICCs
Perform tests using all
combinations that have passed
the T1 test.

Notes

11.3.3 Testing Point and Direction of PICC
Testing points shall be determined with consideration to the operating conditions of the applied IC card
system.
Examples of testing points are shown below.

92

Version 2.0(1) Testing Point
Considering a cylinder with its center axis concentric with the center of the PCD at "o", a total of 10 test
points (shown with a black filled circle) shall be selected at the center points and at each intersection pointof the X axis and Y axis with the surface of the cylinder. (The positions of center point "o", the X, Y, and Z
axes shall be determined separately.)

z
y
O

x

PCD
Figure 11.4 – Testing Points (Example)(2) Direction of PICC
When viewing the PCD from directly above, the long edge of the PICC shall be parallel or orthogonal with
the X axis. (See Figure 11.5 below.)

PCD

PCD

PICC

PICC

Figure 11.5 – Directions of PICC

93

Version 2.0
11.3.4 Test Contents and Pass-Fail Criteria(1) T1 Tests– Verify that transition from REQ command to activation is performed correctly complying to ISO/IEC
14443-3.
– For each PICC, perform test for a total of 20 times for the two directions (10 times for each direction) on
each test point for all specified directions on all test points.
Table 11.9 shows the pass-fail criteria of the tests.

Evaluation
Pass
Fail

Table 11.9 – T1 Tests Pass-Fail Criteria
Criteria
More than 9 out of 10 attempts are
successful for all test points of all
combinations.
All other cases.

Notes(2) T2 Tests– Verify that card commands are sent and received correctly.
– For each PICC, perform test for a total of 20 times for the two directions (10 times for each direction) on
each test point for all specified directions on all test points.
Table 11.10 shows the pass-fail criteria of the tests.

Evaluation
Pass
Fail

Table 11.10 – T2 Tests Pass-Fail Criteria
Criteria
More than 9 out of 10 attempts are
successful for all commands of all
combinations for all test points.
All other cases.

94

Notes

Version 2.0
11.3.5 Processing Flow
(1) Basic Processing Flow
Figure 11.6 shows the basic test processing flow.
START

Insert PICC
T1 TestT1 Passed?

NO

YES
T2 TestNO

All points
Measured?

YES
NO

All
Directions?

YES
YES

Next
PICC

NO
END

Figure 11.6 – Basic Test Processing Flow95

Version 2.0(2) T1 Test Processing Flow
BEGIN

RF ON

REQ Command to
Activation

NGOK
T1 Passed

T1 Failed

RF OFF

Insert PICC

Eject PICC

NO

10Times ?

YES
RETURN

Figure 11.7 – T1 Test Processing Flow96

Version 2.0(3) T2 Test Processing Flow

BEGIN

Insert PICC
RF ON
REQ Command to ActivationNG
RF OFF
Eject PICC

OK

Card Command Execution

NG

Repeat Fail
10 times?

OK

YES

Passed 1
Time

Failed 1 Time Failed 1 TimeRF OFF
Eject PICC

NO

10Times?

YES
RETURN

Figure 11.8 – T2 Test Processing Flow

97

NO

Version 2.0
11.4 Compatibility Test for Double Card Operations
Regarding compatibility tests for double card operations, tests using a single card and test using paired
cards can be assumed. The following compatibility tests shall be performed.
– For compatibility test of using a single card, apply compatibility tests for single card operations.
– For compatibility test of using two cards, perform the tests for single card operations with the two cards
placed on one another.
The following ways of pairing two PICCs can be assumed.
(1) Place one precisely on top of the other with no displacement.
(2) Place one on top of the other with displacement towards each of the X, Y, and Z axes directions.
(3) Rotate the PICC placed on the other to a relative angle.
(4) Exchange the positions of the PICCs so that the one on top is placed at the bottom.
There are numerous ways to place the paired PICCs, especially for Open type PCDs, and the test for eachtype of placement will increase in proportion to the power of two of the number of placements. Thus
consideration is required to determine the placement before performing the tests.

98Version 2.0
Explanations
This explanation describe contents stipulated or written in the Main and Annex portions as wells as related
information, and does not constitute part of the Implementation Specification.
Purpose of Stipulation
Considering the future promotion and dissemination of contactless proximity IC card systems, ensuring thecompatibility and interoperability of PICCs and PCDs was most important issue. Since the Standard
Specifications is not sufficient to ensure compatibility of contactless interfaces, an Implementation
Specification that would complement the Standard Specifications was in need to ensure compatibility.
To fulfill this need, NMDA, based on fruits it had bore from performing investigations for the Implementation
Specification in their development projects and verification experiment projects, compiled this "Proximity
Communication Interface Implementation Specification."
Purpose of Revision
Purpose of Revision for Version 1.1– Although Version 1.0 was produced on the basis of the latest documents available relating to ISO/IEC
14443 as of March 2000, since that time, work at ISO have progressed, and with some exceptions,were released in the form of ISO standards, which made it necessary to align with the ISO standards.
– Following the release of Version 1.0, requests were made from various fields asking for implementation
specifications for PCDs (Open type PCDs) that were capable of being operated by placing cards on itor holding cards over it. Implementation specifications were therefore added and revised in order toaccommodate these needs.
Purpose of Revision for Version 2.0– Although Version 1.1 was produced on the basis of the latest documents available relating to ISO/IEC
14443 as of February 2001, since that time, work at ISO and standardization as JIS have progressed,
and it became necessary to comply with those standard specifications.
– After the publication of Version 1.1, the issuing of the resident basic register card started. Thus,
ensuring compatibility has become increasingly important and an even more precise implementation
specification was in need.
– Based on such background, this version seeks to update its provisions to comply with Standard
Specifications, revise provisions to comply with the revision of the domestic Radio Law, and for areasthat were not stipulated or not clear enough, clarify provisions and caution points that are required toensure compatibility and reduce issues regarding interoperability to further promote dissemination ofcontactless IC cards.

99

Version 2.0– It is expected that this Implementation Specification will be respected by the PICC, PCD and vendors ofsystems that use these devices when considering interoperability.
Issues that were raised during discussion
Document Format
When Version 1.1 of the Implementation Specification was published, ISO/IEC standards were still no
published. However, currently standardization as ISO/IEC and also as JIS are complete. This led to theissue that there were a lot of duplication of those standards within the document adding up to a lot ofpages.
Therefore, it was decided to form the document as a common specification document, and structure it sothat provisions will be clear.
Description Regarding Radio Law
There was a description regarding the Radio Law in Version 1.1 of the Implementation Specification. How
to handle this description was raised as an issue.
At the time when Version 1.1 of the Implementation Specification was published, it was required tosuppress the radiated field intensity of the PCD to a weak level in order to avoid the necessity of applying
as wireless radio stations. This was one of the challenges then, and specific explanations were provided.
However, currently at the time of this publication, PCDs are considered as radio frequency equipment due
to the revision of the Radio Law, and does not require any installation permission. Thus the need tosuppress the radiated field intensity to a weak level is obsolete. Within this Implementation Specification,
descriptions pertaining to this aspect are provided as notes.
Measurement of Field Using Calibration CoilIn version 1.1 of the implementation specification, the description for calibrating the generated field of atest PCD-S and for measuring the strength of the generated field included specifications to measure theopen-circuit voltage using a calibration coil and calculating the field strength using a conversion factor.
However, while fields generated by large antennae (uniform field) such as those used in test PCDs, andthe fields at proximity of relatively small sized antennae (non-uniform field) such as those used in general
PCDs and test PCD-Ss might have same measurement values, the fact that fields that a PCD senses are
not necessarily the same became an issue.
Thus, the intended use of calibration coils was organized as follows to exclude measurement using thecalibration coil.

100Version 2.0
The intended use of the calibration coil is to calibrate the measurement test environment (test PCD,
reference PICC, etc.) for the purpose of calculation of field strength at a distance of 37,5 mm from the test
PCD antenna. Direct measurement of fields of PCDs and test PCD-Ss with other antenna sizes and atother distances are not considered as the intended use of the calibration coil in this Implementation
Specification.
PCD Test Environment

Not intended
use ofcalibration coil

Tests

Tests

PCD

PICC

Reference
PICC

Calibration
coil
Intended useof calibration
coil

PICC Test Environment

Calibration
coil

Test
PCD-S

Not intended
use ofcalibration coil

Test
PCD
Adjustment ofreference PICC

Figure – Intended Use of Calibration CoilCompatibility of Open Type PCDs and PICCs
Methods on how to ensure compatibility of a situation where a PICC gradually approaches an Open type
PCD were discussed.
Basic concepts were organized and the following tests were added.
– Behavior when card approaches: Test for PICC characteristics (functional test) invocation– Communication after card begins operation: Static cross test of open type PCDs
Calibration of Test PCD-S
When calibrating the generated field in accordance with Compatibility Improvement Specifications of 9.4.1,
the maximum generated field of the test PCD-S is determined by the reference PICC-S, and the minimum
generated field is determined by the reference PICC-L. Thus, it was decided that the setting for thegenerated field of the test PCD-S shall be performed using the reference PICC-S and reference PICC-L.

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Version 2.0
External Communication Protocol (High Level Interface)
In Version 1.1 of the Implementation Specification, descriptions were provided from the physical level (RS232C) as informative specifications.
Regarding this, there was discussion over what in fact should be stipulated and the following were
decided.
– Details of the physical interface shall not be stipulated. (To allow for all types of expansibility)– Revise and describe the high level interface based on the "Research Project on Cities Equipped with
Information Technologies – Proximity Coupling Device Common Interface Specification Version 1.1"
which has actually been adopted by municipalities.
Reasons for stipulating individual provisions
Subject area: PICC operation noiseThis was specified in anticipation of establishing stable operation during high-speed communication whichis expected to become popular in the future.
Load fluctuation during operation of an IC on a PICC will be considered as load fluctuation of the PICC
itself, which will be received by the PCD as operational noise similar to load modulation. This may affectcommunication quality.
Since the margin of communication quality for high-speed communication is small than slower-speed
communication, this noise may become an issue.
Therefore, in order to evoke caution at design time, areas that may be affected by load fluctuation werelisted and a guideline to enable reprocessing by the system was introduced as one method to evade
disturbance pertaining to load fluctuation.
Note that since methods for measuring noise are currently not established, no numbers are specified.

102