Proximity Communication Interface
Implementation Specifications
For e-Passports– Draft Proposal –Version 1.2

MARCH 2006
New Media Development Association

e-MRP Implementation Spec. V1.2

Version History
Date

Version

Notes

March 2004

1.0

Formulation.

March 2006

1.2

Changes with regard to revisions to the
ISO/IEC and other standards.

e-MRP Implementation Spec. V1.2

Foreword
The New Media Development Association (NMDA) has been involved in the effort of disseminating IC
cards for many years.
Specifically, in the field of contactless IC cards, NMDA, with consideration to the progress of discussions
concerning the ISO/IEC 14443 standard within international standardization bodies, developed a "New
Generation IC Card Common System" (in accordance with the third supplementary budget of the 1998
fiscal year). At end of the 2000 fiscal year, evolving from the fruits of the "New Generation IC Card
Common System," the "Research Project on Cities Equipped with Information Technologies throughDissemination of IC Cards" (in accordance with the third supplementary budget of the 2000 fiscal year)
was started assuming a role as forerunning issuer of basic resident register cards, installing 120 million
contactless IC cards and 8,000 proximity coupling devices (PCD. i.e. IC card reader/writers) in 21 regions
nation-wide (54 municipalities) and in each region, performing verification experiments of various services
that reflect regional attributes.
In order to improve interoperability and compatibility between IC cards and PCDs from various vendors,
NMDA established the "Proximity Communication Interface Implementation Specifications" in compliancewith the ISO/IEC 14443 standard, performed compatibility verification tests, and installed the equipment in
the regions.
From August 25th, 2003, municipalities began issuing basic resident register cards according toapplications from its residents. The methods for preparing the procurement of the IC cards and PCDs by
the local government and ensuring their compatibility reflected the outcome of the project.
This "Proximity Communication Interface Implementation Specifications for e-Passports" is a revision to
the 1.0 version which was edited and published by NMDA in March 2004 for the purpose of achieving
compatibility between e-Passport readers and ID-3 sized e-Passports that have (ISO/IEC 14443
complying) contactless IC chips embedded and that use biometric and other information throughcontactless interfaces, which are being discussed at ICAO and SC 17.
This revision includes the following changes.
-

Accommodation with regard to the latest standards considering progress of discussion of international
standards.

-

Revision to interoperability test methods based on results from the "Tsukuba e-Passport International
Interoperability Test Session" held at Tsukuba City in Japan from March 8th to March 10th of 2005.

-

Addition of reference description of the e-Passport interface specification specified by ICAO.

We hope that this Implementation Specification will assist in improving compatibility and the promoting
future proliferation of e-Passports.
Furthermore, be aware of the following when referring to or using this Implementation Specification.

e-MRP Implementation Spec. V1.2
The functions, testing methods and so forth specified in this Implementation Specification is subject toaddition, revision, or deletion during the course of the efforts scheduled to be conducted in the future bythis association.
This association is not responsible in any way for the contents of this Implementation Specification or the
results of their use, including industrial property rights and so forth.
In conclusion, the association would like to express its deep appreciation to the members of the ePassport Interoperability working group (located within the NMDA) for its numerous contributions andconstructive discussions, and to those persons at the Ministry of Foreign Affairs and the Ministry of
Economics, Trade and Industry for their generous support of those efforts pertaining to the production ofthis Implementation Specification.

MARCH 2006
New Media Development Association

e-MRP Implementation Spec. V1.2

Table of Contents
1 Scope and Characteristics of this Implementation Specification ............................................................... 1
1.1 Scope.................................................................................................................................................. 1
1.2 Assumed e-MRP and PCD ................................................................................................................. 2
1.3 Characteristics of this Implementation Specification ........................................................................... 3
1.4 Description Convention of this Implementation Specification.............................................................. 3
1.5 Structure ............................................................................................................................................. 5
2 Normative References............................................................................................................................... 5
3 Terms and Definitions, Symbols and Abbreviated Terms.......................................................................... 7
3.1 Terms.................................................................................................................................................. 7
3.2 Symbols and Abbreviated Terms ...................................................................................................... 10
4 Physical Characteristics .......................................................................................................................... 12
5 Electrical Charactristics ........................................................................................................................... 12
5.1 e-MRP............................................................................................................................................... 12
5.2 PCD .................................................................................................................................................. 13
6 Signal Transmissions .............................................................................................................................. 15
6.1 Initial Communication of the e-MRP.................................................................................................. 15
6.2 Signal Interface ................................................................................................................................. 15
6.3 Communication Signal Interface Type A........................................................................................... 15
6.4 Communication Signal Interface Type B........................................................................................... 17
7 Initialization and Anticollision................................................................................................................... 18
7.1 Polling ............................................................................................................................................... 18
7.2 Initialization and Anticollision of e-MRP Type A................................................................................ 19
7.3 Initialization and Anticollision of e-MRP Type B................................................................................ 20
8 Transmission Control Sequence ............................................................................................................. 23
8.1 Protocol Activation of e-MRP Type A................................................................................................ 23
8.2 Protocol Activation of e-MRP Type B................................................................................................ 23
8.3 Half-Duplex Block Transmission Protocol ......................................................................................... 23
8.4 Protocol Deactivation of e-MRP Type A and Type B ........................................................................ 24
8.5 Protocol Scenarios............................................................................................................................ 24
8.6 Components of the Blocks and Frames ............................................................................................ 24
8.7 T = CL Transmission Control Matrix of Protocol .............................................................................. 25
9 Unit Tests ................................................................................................................................................ 27
9.1 General Requirements...................................................................................................................... 27
9.2 Test Content ..................................................................................................................................... 28
9.3 Test Content for the e-MRP Under Test ........................................................................................... 30
9.4 Test Content for the PCD Under Test ............................................................................................... 34
9.5 Test Apparatus for Unit Tests ........................................................................................................... 37
Explanations............................................................................................................................................... 50ie-MRP Implementation Spec. V1.2
Annex A External Communication Protocol (Informative)..............................................................Annex A-1
A.1 Scope.......................................................................................................................................Annex A-1
A.2 Common Interface Specification of the PCD Control API.........................................................Annex A-2
A.2.1 Overview of the Common Interface ...................................................................................Annex A-2
A.2.2 List of Major Interface Functions........................................................................................Annex A-4
A.2.3 Procedures of Using the Common Interface......................................................................Annex A-5
A.2.4 Function Details.................................................................................................................Annex A-6
A.3 The PC/SC Specification........................................................................................................Annex A-14
Annex B Compatibility Testing Specifications (Informative)...........................................................Annex B-1
B.1 Introduction ..............................................................................................................................Annex B-1
B.2 Scope.......................................................................................................................................Annex B-1
B.3 Testing Conditions ...................................................................................................................Annex B-1
B.3.1 Selection of Test Method...................................................................................................Annex B-1
B.3.2 Test Environment ..............................................................................................................Annex B-1
B.3.3 Pre-test Considerations .....................................................................................................Annex B-1
B.3.4 Pass-Fail Decisions ...........................................................................................................Annex B-2
B.4 Compatibility Testing Methods Using PCD ..............................................................................Annex B-2
B.4.1 List of Tests .......................................................................................................................Annex B-2
B.4.2 Combination of Tests.........................................................................................................Annex B-2
B.4.3 Testing Point and Direction of e-MRP ...............................................................................Annex B-3
B.4.4 Test Contents and Pass-Fail Criteria.................................................................................Annex B-4
B.4.5 Processing Flow ................................................................................................................Annex B-5
B.5 Compatibility Test With Reference Devices (Guideline)...........................................................Annex B-8
B.5.1 Reference Device ..............................................................................................................Annex B-8
B.5.2 Test Methods.....................................................................................................................Annex B-8
Annex C e-MRP Command Interface (Informative) ...................................................................... Annex C-1
C.1 Scope...................................................................................................................................... Annex C-1
C.2 Examples of Command Sequences........................................................................................ Annex C-2
C.2.1 Select File and Read Binary ............................................................................................. Annex C-2
C.2.2 Basic Access Control and Secure Messaging .................................................................. Annex C-3
C.2.3 Odd INS (B1) Read Binary ............................................................................................... Annex C-5
C.3 Examples of Basic Access Control Availability Assessment Sequences ................................ Annex C-6
C.3.1 Example of BAC Support Availability Assessment Sequence .......................................... Annex C-6
C.3.2 Example of Extended Le Support Availability Assessment Sequence ............................. Annex C-6
Annex D e-MRP – PCD Command Interface Compatibility Tests (Informative) .......................... Annex D-1
D.1 Test Target e-MRPs and PCDs .............................................................................................. Annex D-2
ii

e-MRP Implementation Spec. V1.2
D.1.1 Test Target e-MRP........................................................................................................... Annex D-3
D.1.2 Test Target PCD .............................................................................................................. Annex D-3
D.2 Compatibility Test Methods..................................................................................................... Annex D-3
D.2.1 List of Tests ...................................................................................................................... Annex D-3
D.2.2 Tests Combinations.......................................................................................................... Annex D-5
D.2.3 Testing Points and Direction of e-MRP ............................................................................ Annex D-5
D.2.4 Test Contents and Pass-Fail Criteria................................................................................ Annex D-6
D.2.5 Data Set ........................................................................................................................... Annex D-7
D.2.6 Test Processing Flows (Examples) .................................................................................. Annex D-7

iii

e-MRP Implementation Spec. V1.2
1 Scope and Characteristics of this Implementation Specification
1.1 ScopeThis Implementation Specification assumes that communication interfaces of ID-1 sized contactless IC
cards (PICC: Proximity IC Card) will be implemented and used on ID-3 sized e-Passports (hereunderreferred to as e-MRPs [Electronic Machine Readable Passports]) and covers the areas shown in Figure 1of the communication features between e-MRPs and reader/writers (hereunder referred to as PCD[Proximity Coupling Devices]).

Upper device

e-MRP (biometric passports)

e-MRP processing
Application

Application on
e-MRP

Command Control

Command Processing

Protocol Control

Protocol Processing

Scope of Specification

e-MRP Type Processing(Type A/Type B)

ＰCD(Reader/Writer)

e-MRP Type Control

e-MRP Type Processing

PCD Control

PCD Processing

Port

Port

(Type A/Type B)

Figure 1 – Scope of the Proximity Communication Interface Implementation Specifications

The subject e-MRP and PCD of this Implementation Specification are e-MRPs with RF signal interfaces ofType A and Type B as specified in the ISO/IEC 14443-2 Specification and PCDs that are capable of driving
both types of e-MRPs.
The relationship between the subject area of this Implementation Specification and the Standard
Specifications are shown in Table 1. Standard Specifications as referred to in this Implementation
Specification are the ISO/IEC standards specified in Table 1.
1e-MRP Implementation Spec. V1.2
Table 1 – Scope of the Proximity Communication Interface Implementation Specifications
Subject Area
Physical characteristics of the e-MRP
Electrical characteristics of the e-MRP and
PCD
Verification test methods of the e-MRP and
PCD

Associated ISO/IEC Standard Specification
ISO/IEC 14443-1
ISO/IEC 14443-2, 14443-3, 14443-4
ISO/IEC 10373-6
ISO/IEC 10373-6/AM2

1.2 Assumed e-MRP and PCD
This Implementation Specification considers the interoperability and compatibility of e-MRPs based on thefollowing assumptions.
(1) e-MRP
The PICC assumed by the Standard Specification targets a communication distance of approximately 10
cm and its control circuits are configured with wired logic and other components, having a low electric
power consumption (assuming approximately 5 mW). On the other hand, PICCs that perform highlysophisticated encryption (e.g. RSA signature generation) require encryption processors for processing,and consume more power (assuming approximately 50 mW).
The e-MRP assumed in this Implementation Specification will, in anticipation of continued use in the future,
allow for rich featured PICCs that may consume much power(2) Number of Cards
Common usage will assume 1 card on 1 PCD at any one time. However, since we cannot deny thepossibility of multiple e-MRPs coming in within communication range of a PCD, anticollision procedures
are mandatory.
(3) PCD
This Implementation Specification assumes an Open type PCD capable of generating a magnetic fieldsufficient enough for high power consuming e-MRPs.
The communication distance assumed between the e-MRP and PCD is 0 mm to around 20 mm, and adisplacement diameter of up to 20 mm.
(4) Operation ModeAn e-MRP shall be activated by being brought near the surface of an operating PCD and shall continue its
communication while being left in near contact or complete contact with the PCD.
In operation mode, a situation where an e-MRP will gradually approach a generated magnetic field will
occur, and since the e-MRP and PCD will be in complete contact, the degree of coupling between theantennae will be high, affecting the power transfer and data transmission between the e-MRP and PCD.
The Standard Specification assumes communication at a distance and gives low consideration to ensuring
compatibility of complete contact situations. This Implementation Specification addresses and stipulates
provisions for improving compatibility specific to the operation mode described above.
2

e-MRP Implementation Spec. V1.2
1.3 Characteristics of this Implementation Specification
This Implementation Specification attempts to ensure interoperability and compatibility of various types of
e-MRPs and PCDs of numerous manufacturers by serving to standardize antenna characteristics,
resonance characteristics and various other parameters at the production level not defined by the Standard
Specification in order to improve compatibility of e-MRPs and PCDs.
(1) Improving Compatibility of e-MRPs and PCDs
This Implementation Specification stipulates provisions for improving compatibilities of e-MRPs and PCDs
assumed in section 1.2 of this specification. However, considerations have also been given to allow acertain degree of freedom in the design of e-MRPs and PCDs. It should therefore be noted that this
implementation specification does not unequivocally guarantee the compatibility of e-MRPs and PCDs.
(2) The Necessity for Provisions not Stipulated in Standard Specifications
The Standard Specifications specify specifications oriented toward maintaining higher levels of extendibility(or diversity).
Furthermore, the specifications assume communications at a distance. As such, for example, the operating
field of a PICC is defined to "operate as intended continuously between Hmin (1,5 A/m) and Hmax (7,5A/m)," and the diameter of a Test PC Antenna is 15 cm, which is large compared to commonly used PCDs.
Thus, the tests assume that the PICCs and PCDs are calibrated at a distance where they will not affecteach other, and assume a uniform magnetic field will be generated.
However, when the e-MRPs and PCDs come in physically close contact where the distance is such that it
will affect the physical and electrical characteristics of each other's antennae, the magnetic field sensed by
the measurement equipment with a uniform magnetic field will be different from what is sensed by actual eMRPs, requiring caution to be exercised.
(3) Required Specifications other than the Standard Specification
It is necessary to add the matters indicated below not described in the Standard Specification for thereasons described in the previous section. In other words, these are the important points of thisImplementation Specification.
– e-MRP Detail Specifications (Antenna shape, resonance frequency)– Unit verification test methods of e-MRPs (Tests with PCD-S, etc.)– Unit verification test methods of PCDs (Tests with reference PICC-S/M/L, etc.)
1.4 Description Convention of this Implementation Specification
Within this Implementation Specification, provisions specified by the Standard Specifications are only
referred to by quotation, while matters that necessary to be added are described based on the following
three perspectives.

3

e-MRP Implementation Spec. V1.2
Compatibility Improvement Specifications:
Provisions considered as necessary to improve interoperability and compatibility.
Considerations:
While not being provisions of this Implementation Specification, matters of consideration to further improve
interoperability and compatibility of t e-MRPs and PCDs.
Explanatory Notes:
Explanatory notes to deepen common understanding regarding provisions of the Standard Specifications.
While the matters added are explicitly categorized and tagged as "Compatibility Improvement
Specification," "Considerations," or "Explanatory Notes," if there are provisions not explicitly categorized,
those shall be considered as "Compatibility Improvement Specifications."
Furthermore, for major added provisions, the reasons for the additions may also be explicitly noted in the"Explanatory Notes."4e-MRP Implementation Spec. V1.2
1.5 Structure
Based on the assumptions, characteristics and description conventions as provided above, thisImplementation Specification stipulates matters of features regarding contactless communication, as
specified in Table 2.
Table 2 – Structure of this Implementation Specification
Chpt.

Subject Area

Description

4

Physicalcharacteristics

Stipulates physical specifications andoperating temperature of e-MRPs and PCDs,
and specifies some considerations.

5Electricalcharacteristics

Stipulates antenna shape and strength ofoperating/generated magnetic field of eMRPs and PCDs, and specifies someconsiderations for operational noise.

ISO/IEC 14443-2

6Signaltransmission

ISO/IEC 14443-2
ISO/IEC 14443-2/AM1

7Initialization
andanticollision

8

Transmission
protocolUnit tests

Stipulates initial communication and signal
interfaces.
In addition, describes provisions for highspeed communication.
Stipulates initial communication and signal
interfaces.
In addition, describes provisions for highspeed communication.
Stipulates the communication sequence.

9

Stipulates unit test methods for the e-MRPs
and PCDs specified in this Implementation
Specification.

Associated Standard
Specification
ISO/IEC 7501-1
ISO/IEC 7810
ISO/IEC 14443-1

ISO/IEC 14443-3
ISO/IEC 14443-3/AM1
ISO/IEC 14443-3/FPDAM3
ISO/IEC 14443-4
ISO/IEC 14443-4/FPDAM1
ISO/IEC 10373-6
ISO/IEC 10373-6/FPDAM1
ISO/IEC 10373-6/AM2
ISO/IEC 10373-6/FPDAM3
ISO/IEC 10373-6/FPDAM4
ISO/IEC 10373-6/FPDAM5

2 Normative References
The following normative documents contain provisions referenced in this text. While the following
normative documents are the most recent at the time of the stipulation of this Implementation Specification,
parties are encouraged to investigate the possibility of applying the most recent editions of the normative
documents indicated below.
ISO/IEC 7501-1:1997,
Identification cards - Machine readable travel documents - Part 1: Machine readable passport
ISO/IEC 7810:2003,
Identification cards - Physical characteristics

5e-MRP Implementation Spec. V1.2
ISO/IEC 10373-6:2001,
Identification cards - Test methods - Part6: Proximity cards
ISO/IEC 10373-6/AM2:2003,
Identification cards - Test methods - Part6: Proximity cards, Amendment 2: Improved RF test
methods
ISO/IEC 14443-1:2000,
Identification cards - Contactless integrated circuit(s) cards - Proximity cards - Part1: Physicalcharacteristics
ISO/IEC 14443-2:2001,
Identification cards - Contactless integrated circuit(s) cards - Proximity cards - Part 2: Radio
frequency power and signal interface
ISO/IEC 14443-2/AM1:2005,
Bit rate of fc/64, fc/32, fc/16
ISO/IEC 14443-3:2001,
Identification cards - Contactless integrated circuit(s) cards - Proximity cards - Part 3:
Initialization and anticollision
ISO/IEC 14443-3/AM1:2005,
Bit rate of fc/64, fc/32, fc/16
ISO/IEC 14443-4:2001,
Identification cards - Contactless integrated circuit(s) cards - Proximity cards - Part 4:
Transmission protocol
ICAO "ANNEX K of ICAO NTWG BIOMETRICS DEPLOYMENT TECHNICAL REPORT",
Version 2 (Date: July 6, 2005)
Considerations:
While the following documents are not yet approved as an International Standard at the time of the
stipulation of this Implementation Standard, certain portions have been referenced within thisImplementation Standard. Note that these may be revised since they are still under discussion.
ISO/IEC 14443-3:2001/FPDAM3 (Date: November 2, 2004), Identification cards - Contactless integrated
circuit(s) cards - Proximity cards - Part 3: Initialization and anticollision, Amendment 3: Handling ofreserved fields and values
ISO/IEC 14443-4:2001/FPDAM1 (Date: November 2, 2004), Identification cards - Contactless integrated
circuit(s) cards - Proximity cards - Part 4: Transmission protocol, Amendment 1: Handling of reserved
fields and values

6e-MRP Implementation Spec. V1.2
ISO/IEC 10373-6:2001/FPDAM1 (Date: May 5, 2005), Identification cards - Test methods - Part6:
Proximity cards, Amendment 1: Protocol test methods for proximity cards
ISO/IEC 10373-6:2001/FPDAM3 (Date: December 9, 2004), Identification cards - Test methods - Part6:
Proximity cards, Amendment 3: Protocol test methods for proximity coupling devices
ISO/IEC 10373-6:2001/FPDAM4 (Date: April 7, 2005), Identification cards - Test methods - Part6:
Proximity cards, Amendment 4: Additional test methods for PCD RF interface and PICC alternating field
exposure
ISO/IEC 10373-6:2001/FPDAM5 (Date: April 21, 2005), Identification cards - Test methods - Part6:
Proximity cards, Amendment 5: Bit rates of fc/64, fc/32, and fc/16

3 Terms and Definitions, Symbols and Abbreviated Terms
3.1 Terms
Definitions for major terms used in this Implementation Specification are as follows.
Proximity IC Card (PICC)
A terminal-less IC card that communicates by coupling in a proximity magnetic field of a coupling device.
e-MRP (Electronic Machine Readable Passport)
A passport with PICC features which is capable of electronically reading stored biometric information
through the use of the PICC's communication interface.
Proximity Coupling Device (PCD)
Generally referred to as reader/writer devices, PCDs use inductive coupling to provide power to the eMRP and also to control the data exchange with the e-MRP.
Coupling Degree between Antennae
The degree of coupling between the e-MRP antenna and the PCD antenna when electromagnetic
induction is performed.
Byte
A byte consists of 8 bits of data which are designated as b1 through b8. b8 is the most significant bit(MSB) while b1 is the least significant bit (LSB).
Bit duration
Time for a single bit to determine its logical state. The bit length unit (time) is defined by "etu" where etu iscalculated according to the following formula.
1 etu = 128 / (D × fc), where D is either 1,2,4, or 8
Since the initial value of divisor D is 1, the initial value of etu is as shown below.
7e-MRP Implementation Spec. V1.2
1etu = 128 f/c
Where fc is the carrier frequency as defined in ISO/IEC 14443-2.
Modulation Index
If the modulated signal peak amplitude is "a" and minimum amplitude is "b", the modulation index is asfollows.
Modulation index = (a - b)/(a + b)
Modulation index is normally expressed in percentage.
Binary phase shift keying
Phase modulation method to associate two phase state possibilities 180° apart with a logical value.
NRZ-L
A method of bit coding whereby a logical state of a signal during a bit duration is represented by one of thetwo defined physical states of a carrier frequency (fc).
Subcarrier
A frequency (fs) which modulates a carrier frequency (fc).
Frame
A frame is a series of data bits and optional error detection bits, with frame delimiters at start and end.
Note: Type A e-MRPs use standard frames defined as Type A e-MRPs and Type B e-MRPs use
standard frames defined as Type B e-MRPs.
TR0
Guard time beginning at the end of transmission by a PCD and ending when generation of subcarrier isdone by an e-MRP.
TR1
Synchronization time beginning at the time the subcarrier is generated by an e-MRP and ending when the
e-MRP begins modulation.
TR2Time beginning at the time when an e-MRP begins sending EOF and ending when a PCD begins SOF.
Operating field
The range of magnetic field strength where an e-MRP is capable of conducting normal operations.
Polling
The operation of a PCD to repetitively emit Request commands in order to sense e-MRPs within theoperating field.
Collision

8e-MRP Implementation Spec. V1.2
Transmission by two or more e-MRPs that are within the same operating field of a PCD during the sametime period, such that the PCD is unable to distinguish from which e-MRP the data originated.
Anticollision
The process of avoiding transmission at the same time by two or more PICCs that are within the same
operating field of a PCD.
Anticollision sequence
The procedure to select one or more e-MRPs from the multiple e-MRPs within the same operating field of
a PCD that have answered to a Request command, and establishing communication between the e-MRP
and PCD.
Load modulation
To generate modulation signals by putting load on and off an e-MRP.
Request command
A command requesting an answer from a corresponding type of e-MRP when the e-MRP is capable ofinitializing.
Block
A special form of frame that includes a valid protocol data format.
Note: A valid protocol data format includes I-Blocks, R-Blocks or S-Blocks.
Test PCDA device for testing e-MRPs. Stipulated in the Standard Specification.
Test PCD-S
A PCD stipulated for the purpose of this Implementation Specification. Used for tests assuming close
contact.
Calibration CoilA device for testing PCDs. Stipulated in the Standard Specification.
Reference PICC
A device for testing PCDs. Stipulated in the Standard Specification.
Reference PICC-S/M/L
A generic designation the three types of reference PICCs stipulated for the purpose of this Implementation
Specification which are the reference PICC-S, reference PICC-M, and reference PICC-L.

9

e-MRP Implementation Spec. V1.2
3.2 Symbols and Abbreviated Terms
The following symbols and abbreviated terms shall be used in this Implementation Specification.
AFI

Application Family Identifier Card
pre-selection criteria by application, Type B

ANTICOLLISION

anticollision command, Type A

ASK

Amplitude Shift KeyingATSAnswer To SelectATTRIB

PICC selection command, Type B

ATQA

Answer To Request, Type A

ATQB

Answer To Request, Type B

BPSK

Binary Phase Shift Keying

CID

Card Identifier

CLnCascade Level n, Type A

CT

Cascade Tag, Type A

D

Divisor

DUT

Device Under Testetu

elementary time unit

E

End of communication, Type A

EGT

Extra Guard Time, Type B

EOF

End Of Frame, Type B

FDT

Frame Delay Time, Type A

fc

frequency of operating field (carrier frequency)fs

frequency of sub-carrier modulation

FWI

Frame Waiting time Integer

FWT

Frame Waiting Time

FWTTEMP

temporary Frame Waiting Time

HLTA

Halt command, Type A

HLTB

Halt command, Type B

Hmax

Maximum field strength of the PCD antenna field

Hmin

Minimum field strength of the PCD antenna field

NRZ-L

Non-Return to Zero, (L for level)

OOK

On/Off Keying

PCD

Proximity Coupling Device

PICC

Proximity IC Card

PUPI

Pseudo-Unique PICC Identifier

REQA

Request command, Type A

REQB

Request command, Type B

RFU

Reserved for Future ISO/IEC Use

SStart of communication, Type A
10

e-MRP Implementation Spec. V1.2
Slot_MARKER

Slot marker command, Type B

WTX

Waiting Time eXtension

WTXM

Waiting Time eXtension Multiplier

WUPA

Wake Up command, Type A

WUPB

Wake Up command, Type B

For the purpose of the Implementation Specification, the following notation applies:
b“xxxx xxxx”

Data bit representation“XX”

Hexadecimal11

e-MRP Implementation Spec. V1.2

4 Physical Characteristics
The size and shape of the e-MRP shall comply with the provisions of ISO/IEC 7501-1. Additionally, otherphysical characteristics shall comply with the provisions of ISO/IEC 14443-1.

5 Electrical Characteristics
Shall comply with the "Power transfer" and "PICC minimal coupling zone" of ISO/IEC 14443-2 and shall
add the following provisions.
5.1 e-MRP
5.1.1 Antenna Shape
Compatibility Improvement Specifications:
The implementation zone of a ID-1 size as shown in Figure 2 shall be applied as the implementation zoneof the antenna of an e-MRP which center shall be concentric with the center of the ID-3 sized booklet as
stipulated in ISO/IEC 7501-1 and the center of the ID-1 size as stipulated in ISO/IEC 7810 when the short

4-R3

125 ± 0,75 (4,92 ± 0,03)
2,0 (0,08)85,62,0 (0,08)

34
49
64
81

88,0 ± 0,75 (3,46 ± 0,03)

2,0(0,08)53,98

2,0 (0,08)(or long) side of one is parallel with the other.

R 3,18 ± 0,30 (0,125 ± 0,0012)

Units in mm (inch)

Figure 2 – Antenna Implementation Zone

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e-MRP Implementation Spec. V1.2
5.1.2 Operational Noise
Considerations:
The e-MRP should suppress the following load fluctuation while processing commands:– Continuous load fluctuation with a cycle near preamble.
– Load fluctuation other than load modulation during e-MRP response processing.
– Large load fluctuation that cannot be ignored when compared with load modulation during response.
– Load fluctuation immediately before e-MRP response activity.
– Load fluctuation occurring during low or excess power supplied to e-MRP.
The following load fluctuation should be suppressed as much as possible while the e-MRP is processing
the following commands:– Load fluctuation occurring during processing of Resend Request of protocol.
– Load fluctuation during processing of initial response between the time the request was made until thetime the processing of the protocol begins.
5.1.3 Resonance Frequency
Compatibility Improvement Specifications:
The resonance frequency of an e-MRP shall be over 13,56 MHz. However, consideration shall be given tosituations when coming into close proximity of PCDs.
5.1.4 Operating Field
Compatibility Improvement Specifications:
The minimum non-modulated operating field of an e-MRP shall be Hmin and has a value of 4 A/m (rms).
5.2 PCD
5.2.1 Antenna Shape
Compatibility Improvement Specifications:
Antenna position will no be stipulated. However, the chosen antenna position shall able to sufficecommunication requirements without regard to the operation direction (fore-side, back-side, front
approach, rear approach) and coil position.
Furthermore, the PCD antenna and e-MRP antenna shall be positioned in a parallel opposed position.
An example of an antenna position of a PCD where the center of the antenna is aligned with the center ofthe e-MRP is shown in Figure 3.

13

e-MRP Implementation Spec. V1.2
Center of PCD antenna

Center of e-MRP

e-MRP antenna

PCD antennaparallelFigure 3 – Antenna Position
Considerations:(1)

Considering the actual operational procedures, the antenna size of the PCD should be larger than
the antenna size of the e-MRP.

(2)

The shape of the PCD antenna should be symmetric on the X and Y axis with their origin at thecenter of the antenna so that the communication zone of the e-MRP is not largely affected by theoperation direction and communication position.

Examples of PCD antenna shapes are shown in Figure 4.
Y axis[Legend]

X axisCenter ofantennaFigure 4 – Antenna Shape
5.2.2 Operational Noise
Considerations:
The design of the PCD should reflect consideration to the operational noise emitted from the e-MRP sothat it will not erroneously receive noise which are not communication signals. Furthermore, PCDs shallgive consideration to avoid noise getting into carriers.
5.2.3 Coupling Degree between Antennae
Considerations:(1) The coupling degree between the antennae will increase when an e-MRP comes into close proximityof a PCD.
(2) Since the operational point of a PCD will alter largely when the coupling degree between theantennae is in excess, the operating range of a PCD shall be considered with the following in mind.

14

e-MRP Implementation Spec. V1.2
– The generated magnetic field might become too strong.
Thus, consideration shall be given to characteristics of maximum magnetic field generated.
– A situation where field or power becomes too weak might occur.
Thus, consideration shall be given to characteristics of minimum magnetic field generated andpower transmission.
– The modulation index might change.
Thus, consideration shall be given to the modulation waveform.
5.2.4 Generated Magnetic Field
Compatibility Improvement Specifications:
The minimum non-modulated operating field of a PCD shall be Hmin and has a value of 4 A/m (rms).

6 Signal Transmissions
Based on ISO/IEC 14443-2 and ISO/IEC 14443-2/AM1, the modulation method, modulation waveform andcoding scheme of the signal transmission from a PCD to an e-MRP and vice versa shall be stipulated
herein. Type A and Type B communication formats are specified.
Considerations:
Since the specification for high-speed communication (ISO/IEC 14443-2/FPDAM2) exceeding fc/64(approximately 212 kbit/s) was not approved yet as an International Standard at the time when version 1.0of this Implementation Specification was formulated (March 2004), the provisions regarding this matterwithin the Implementation Specifications was designated as "Compatibility Improvement Specification(Informative)". However, since the specification is now approved as an International Standard ISO/IEC
14443-2/AM1, the specification is noted as references.
Note that certain parts referenced in the 1.0 version of this Implementation Specification have been revisedin accordance with the International Standardization of the specification of high-speed communication.
6.1 Initial Communication of the e-MRP
Shall comply with the "Initial dialogue for proximity cards" of ISO/IEC 14443-2.
6.2 Signal Interface
Shall comply with the "Signal Interface" of ISO/IEC 14443-2 and with ISO/IEC 14443-2/AM1.
6.3 Communication Signal Interface Type A
Shall comply with the "Communication Signal Interface Type A" of ISO/IEC 14443-2 and with ISO/IEC
14443-2/AM1.

15

e-MRP Implementation Spec. V1.2
Explanatory Notes:
The following are stipulated in ISO/IEC 14443-2.
– Signal transmission from PCD to PICC
・ Bit Rate
・ Modulation
・

Bit Representation and Coding– Signal transmission from PICC to PCD・ Bit Rate
・ Load Modulation
・ Subcarrier・ Subcarrier Modulation
・

Bit Representation and Coding

6.3.1 Signal transmission from PCD to e-MRP
6.3.1.1 Bit Rate
Shall comply with the "Data rate" of ISO/IEC 14443-2 and with ISO/IEC 14443-2/AM1.
6.3.1.2 Modulation
Shall comply with the "Modulation" of ISO/IEC 14443-2 and with ISO/IEC 14443-2/AM1.
Considerations:
Note that the values in Table 3, "Modulation Timing" of the 1.0 version of this Implementation Specification
which had been based on reference to ISO/IEC 14443-2/FPDAM2, have been revised as follows inaccordance with the International Standardization of the specification.
Table 3 – Modulation Timing
Bit Rate
Timing Parameter

fc/64

fc/32

fc/16

Min

Max

Min

Max

Min

Max

t1

15/fc

20/fc

8/fc

10/fc

4/fc

5/fc

t2

8/fc

T1

4/fc

T1

2/fc

t1

t3

0

12/fc

0

10/fc

0

8/fc

16

e-MRP Implementation Spec. V1.2
6.3.2 Signal transmission from e-MRP to PCD
6.3.2.1 Bit Rate
Shall comply with the "Data rate" of ISO/IEC 14443-2 and with ISO/IEC 14443-2/AM1.
6.3.2.2 Subcarrier Modulation
Shall comply with the "Subcarrier modulation" of ISO/IEC 14443-2 and with ISO/IEC 14443-2/AM1.
6.3.2.3 Bit Representation and Coding
Shall comply with the "Bit representation and coding" of ISO/IEC 14443-2 and with ISO/IEC 14443-2/AM1.
6.4 Communication Signal Interface Type B
Shall comply with the "Communication Signal Interface Type B" and with ISO/IEC 14443-2/AM1.
Explanatory Notes:
The following are stipulated in ISO/IEC 14443-2.
– Signal transmission from PCD to PICC
・ Bit Rate
・ Modulation
・

Bit Representation and Coding– Signal transmission from PICC to PCD・ Bit Rate
・ Load Modulation
・ Subcarrier・ Subcarrier Modulation
・

Bit Representation and Coding

6.4.1 Signal transmission from PCD to e-MRP
6.4.1.1 Bit Rate
Shall comply with the "Data rate" of ISO/IEC 14443-2 and with ISO/IEC 14443-2/AM1.
6.4.1.2 Modulation
Shall comply with the "Modulation" of ISO/IEC 14443-2 and with ISO/IEC 14443-2/AM1.
6.4.2 Signal transmission from e-MRP to PCD
6.4.2.1 Bit Rate
Shall comply with the "Data rate" of ISO/IEC 14443-2 and with ISO/IEC 14443-2/AM1.
6.4.2.2 Subcarrier
Shall comply with the "Subcarrier" of ISO/IEC 14443-2 and with ISO/IEC 14443-2/AM1.
6.4.2.3 Subcarrier Modulation
Shall comply with the "Subcarrier modulation" of ISO/IEC 14443-2 and with ISO/IEC 14443-2/AM1.
17

e-MRP Implementation Spec. V1.2

7 Initialization and Anticollision
Shall comply with "Initialization and anticollision" of ISO/IEC 14443-3.
7.1 Polling
Shall comply with the "Polling" of ISO/IEC 14443-3 and with the ISO/IEC 14443-2/AM1, and shall add thefollowing provisions.
Considerations:
An e-MRP that will operate with an Open type PCD shall consider cases ranging from slow rising time tofast rising time for the operating field to attain minimum operational level. The e-MRP shall also consider
the case where the operating field is modulated upon attaining minimum operational level. Both 100%ASK(Type A) and 10%ASK (Type B) are possible for the modulated operating field.
Furthermore, if the Open type PCD will repetitively send Request commands, the interval time for sendingout commands shall be longer than the time it takes for the e-MRP to begin accepting requests (5 ms).
Explanatory Notes:
When an e-MRP is exposed to a non-modulated operating field it shall be able to accept a Request
command within 5 ms.

18

e-MRP Implementation Spec. V1.2
The duration until the operating field attains the minimum level shall include cases ranging from slow risingtime to fast rising time as shown in Figure 5. If the operating field is modulated upon attaining minimum
operational level, the e-MRP shall be able to accept a Request command within 5 ms after the operating
field becomes non-modulated above the minimum operational level.

5ms
Operating
Field
Hmin

5ms
Accept Request

Accept Request

Slow Rising Field

Fast Rising Field

5ms

5ms
Accept Request

Operating
Field
Hmin

Accept Request

Modulated Field
PeriodModulated Field
PeriodModulation during rise (1)Modulation during rise (2)Figure 5 – Variations of Operating Field Rising Forms
7.2 Initialization and Anticollision of e-MRP Type A
Shall comply with the "Type A – Initialization and Anticollision" of ISO/IEC 14443-3 and shall add thefollowing provisions.
Explanatory Notes:
The following are stipulated in ISO/IEC 14443-3.
– Frame Format and Timing– PICC States Description– Command Set– Select Sequence
7.2.1 Bit Rate
Shall comply with ISO/IEC 14443-3/AM1.

19

e-MRP Implementation Spec. V1.2
7.2.2 Frame Format and Timing
Shall comply with ISO/IEC 14443-3/AM1.
7.2.3 e-MRP States
Shall comply with ISO/IEC 14443-3/AM1.
7.2.4 Select Sequence
Shall comply with ISO/IEC 14443-3/AM1.
Considerations:
Since the definition of b9 – b11 ATQA high bit rate indicators and higher bit rate selection procedure using
the SEL command have been removed from ISO/IEC 14443-3/AM1, they are not stipulated in thisSpecification.
7.3 Initialization and Anticollision of e-MRP Type B
Shall comply with the "Type B – Initialization and Anticollision" of ISO/IEC 14443-3 and shall add thefollowing provisions.
Explanatory Notes:
The following are stipulated in ISO/IEC 14443-3.
– Character, Frame Format and Timing– Anticollision Sequence– PICC States Description– Command Set– Anticollision Command Format– REQB/WUPB Command– Slot_MARKER Command– Answer to Request (ATQB)– ATTRIB Command– Answer to ATTRIB Command– HLTB Command and Answer
7.3.1 Character, Frame Format and Timing
Shall comply with ISO/IEC 14443-3/AM1.
7.3.2 REQB/WUPB Command
7.3.2.1 Coding of AFI
Compatibility Improvement Specifications:
The AFI set for the e-MRP shall be "00".

20e-MRP Implementation Spec. V1.2
In addition, the PCD shall set AFI to "00" and send a REQB/WUPB command.
7.3.2.2 Coding of PARAM
Considerations:
The PCD should set N to 1 and send a REQB/WUPB command.
7.3.3 Answer to Request (ATQB)
7.3.3.1 Pseudo-Unique e-MRP Identifier (PUPI)
Considerations:
The PUPI used for the initial anticollision after entering the IDLE state from a POWER-OFF state of an eMRP which had been in an ACTIVE state should have a different value from the value of the PUPI used in
the previous anticollision procedure.
7.3.3.2 Application Data
Compatibility Improvement Specifications:(1) AFI (1 byte)
The AFI set for the e-MRP shall be "00".
(2) CRC_B (AID) (2 bytes)
Shall be any value.
(3) Application count (1 byte)
Shall be any value.
7.3.3.3 Protocol Info
Compatibility Improvement Specifications:(1) Bit rate capability (8 bits)
e-MRP shall support at least fc/32 (approximately 424 kbit/s).
(2) Maximum frame size (4 bits)
e-MRP shall be capable of receiving a maximum frame size of 256 bytes.
(3) Protocol type (4 bits)
Shall support ISO/IEC 14443-4.
(4) FWI (4 bits)
Shall be less than or equal to 12 (FWT approx. 1,24s).
(5) Application data coding (2 bits)
The value of application data coding (ADC) shall be b"00". However, the value for the AFI of "7.3.3.2
Application Data" shall be set to the specified value ("00").
(6) Frame option (2 bits)
With e-MRP, support for CID shall be mandatory and NAD shall not be supported.

21

e-MRP Implementation Spec. V1.2
7.3.4 ATTRIB Command
7.3.4.1 Coding of Param 1
Shall comply with ISO/IEC 14443-3/AM1.
Considerations:(1) Minimum value of TR0
Should use the default value (64/fs).
(2) Minimum value of TR1
Should use the default value (80/fs).
(3) EOF/SOF
The PCD should request EOF/SOF to the e-MRP to ensure compatibility.
7.3.4.2 Coding of Param 2
Compatibility Improvement Specifications:
PCD shall be capable of receiving a maximum frame size of 256 bytes.
PCD shall support at least fc/32 (approximately 424 kbit/s).
7.3.4.3 Coding of Param 3
Compatibility Improvement Specifications:
Shall support ISO/IEC 14443-4.
7.3.4.4 High Layer INF
Compatibility Improvement Specifications:High Layer INF shall not be used.
7.3.5 Answer to ATTRIB Command
Considerations:
Since the minimum memory size of an e-MRP is established, it is not required to output the information
regarding maximum internal buffer size using MBLI.

22

e-MRP Implementation Spec. V1.2

8 Transmission Control Sequence
Communication frames and the basic communication sequence are specified with the transmission
protocol of the e-MRP and PCD on the basis of ISO/IEC 14443-4. Type A and Type B communication
formats are specified.
8.1 Protocol Activation of e-MRP Type A
Shall comply with "Protocol activation of PICC Type A" of ISO/IEC 14443-4.
Explanatory Notes:
The following are stipulated in ISO/IEC 14443-4.
– Request for Answer To Select (RATS)– Answer To Select (ATS)– Protocol and Parameter Selection Request– Protocol and Parameter Selection Response– Activation Frame Waiting Time– Error Detection and Recovery
8.2 Protocol Activation of e-MRP Type B
Shall comply with "Protocol activation of PICC Type B" of ISO/IEC 14443-4.
8.3 Half-Duplex Block Transmission Protocol
Shall comply with "Half-Duplex Block Transmission Protocol" of ISO/IEC 14443-4.
Explanatory Notes:
The following are stipulated in ISO/IEC 14443-4.
– Block Format– Frame Waiting Time
– Frame Waiting Time Extension– Power Level Indication– Protocol Operation
Explanatory Notes 2:
The following is added in ISO/IEC 14443-4/AM1.
– The CID bytes b6-b5 shall be '00'. PCDs or e-MRPs that set values other than '00', or those do not
generate a protocol error on receiving values other than '00', shall be considered non-conforming. When
implementing products, considerations should be given to existence of e-MRPs or PCDs that conform toprevious ISO standards with implementations that do not generate this protocol error.

23

e-MRP Implementation Spec. V1.2
8.3.1 Frame Waiting TimeCompatibility Improvement Specifications:
The Frame Waiting Time (FWT) for e-MRP shall be less than or equal to 1,24 s (FWI = 12).
Explanatory Notes:
FWI shall be less than or equal to 12, in accordance with the requirement described in the ICAO TR(Technical Report) Annex K.
8.3.2 Frame Waiting Time Extension
Compatibility Improvement Specifications:
The temporary FWT (FWTTEMP) that corresponds with the Frame Waiting Time Extension (WTX) of the eMRP shall be less than or equal to the value stipulated in "8.3.1 Frame Waiting Time."
Explanatory Notes:
WTX shall follow the same specification, based on the stipulations for FWI.
Explanatory Notes 2:
The following is added in ISO/IEC 14443-4/AM1.
– PCDs shall handle frames received with WTXM = 0, 60-63 as protocol errors. Any PCDs that handle
otherwise shall be considered non-conforming. Considerations should be given to existence of PCDs that
conform to previous ISO standards which may not generate this protocol error.
8.3.3 Power Level Indication
Compatibility Improvement Specifications:Power Level Indication shall not be used.
Even if the e-MRP indicates a value other than b"00", the PCD may ignore that indication.
8.4 Protocol Deactivation of e-MRP Type A and Type B
Shall comply with "Protocol Deactivation of PICC Type A and Type B" of ISO/IEC 14443-4.
Explanatory Notes:
The following are stipulated in ISO/IEC 14443-4.
– Deactivation Frame Waiting Time– Error Detection and Recovery
8.5 Protocol Scenarios
Shall comply with "Annex B (Informative) Protocol Scenarios" of ISO/IEC 14443-4.
8.6 Components of the Blocks and Frames
Shall comply with "Annex C (Informative) Block and Frame Coding Overview" of ISO/IEC 14443-4.
24

e-MRP Implementation Spec. V1.2
8.7 T = CL Transmission Control Matrix of Protocol
The following Tables 4 and 5 are Transmission Control Matrices to help in understanding the Protocol.
Table 4 – Transmission Control Protocol on the e-MRP Side (Towards Upper Device)State

0 Protocol
start state
1 I(0)0 (NonChaining)
After send
Wait receive
2 I(0)1 (NonChaining)
After send
Wait receive
3 I(1)0(Chaining)
After send
Wait receive
4 I(1)1(Chaining)
After send
Wait receive
5 R(ACK)0After send
Wait receive

Receive I block (from PCD)A
B
CD
No-Chain No-Chain
Chain
Chain
Received Received
Received Received
I(0)0
I(0)1
I(1)0
I(1)1
I(0)0 -> 1 Rule 10
I(1)0 -> 3 Rule 10
1)
S(WTX) -> 7 Rule 9
I(0)1 -> 2 Rule 10
I(1)1 -> 4 Rule 10
1)
S(WTX) -> 7 Rule 9

R(ACK)0 -> 5 Rule 2S(WTX) -> 7 Rule 9

I(0)0 -> 1 Rule 10
I(1)0 -> 3 Rule 10
S(WTX) -> 7 Rule 9

R(ACK)0 -> 5 Rule 2S(WTX) -> 7 Rule 9

No operation
Return to prev. stat.

No operation
Return to prev. stat.

1)

1)

R(ACK)1 -> 6 Rule 2S(WTX) -> 7 Rule 91)

1)

I(0)1 -> 2 Rule 10
I(1)1 -> 4 Rule 10
1)
S(WTX) -> 7 Rule 9

R(ACK)1 -> 6 Rule 2S(WTX) -> 7 Rule 9

6 R(ACK)1After send
Wait receive

I(0)0 -> 1 Rule 10
I(1)0 -> 3 Rule 10
1)
S(WTX) -> 7 Rule 9

R(ACK)0 -> 5 Rule 2S(WTX) -> 7 Rule 9

7 Request
S(WTX)
After send
Wait receive

No operation
Return to prev. stat.

No operation
Return to prev. stat.

E
R(ACK)0
Received
No operation
Return to
prev. stat.
Last block
I(0)0 Resend-> 1
Rule 11:
No operation
Return to
prev. stat.
Last block
I(1)0 Resend-> 3
Rule 11:
I(0)0 -> 1
I(1)0 -> 3
1)
Rule 13:

Event
Receive R block (from PCD)F
G
R(ACK)1
R(NAK)0
Received
Received

H
R(NAK)1
Received

No operation
Return to prev.
stat.
No operation
Return to prev.
stat.

R(ACK)1 -> 6
Rule 12:

Last block
I(0)1 Resend-> 2
Rule 11:
I(0)1 Send-> 2
I(1)1 Send-> 4
1)
Rule 13:

R(ACK)1 -> 6
Rule 12:

Last block
I(0)1 Resend -> 2
Rule 11:

Last block
I(1)0 Resend -> 3
Rule 11:

No operation
Return to prev.
stat.

Last block
I(1)1 Resend-> 4Rule 11:

No operation
Return to prev.
stat.

Last block
I(1)1 Resend -> 4
Rule 11:

Last block
R(ACK)0
Resend -> 5
Rule 11:
R(ACK)1-> 6
Rule 12:R(ACK)0-> 5
Rule 12:No operation
Return to prev. stat.

1)

1)

No operation
Return to prev. stat.

Last block
I(0)0 Resend -> 1
Rule 11:

Receive error
K
L
Error
Error
(PCB error)(CRC error,
EGT timeout)

No operation
Return to prev.
stat.
R(ACK)0 -> 5
Rule 12:

Last block
R(ACK)1
Resend -> 6
Rule 11:
Request S(WTX) Resend -> 7

NOTE "Rule" refers to rules as stipulated in "Block Numbering Rules" of ISO/IEC 14443-4.
1) e-MRP shall update its internal block number for the block number it will assign to the block that it will send next.

25

Receive S block (from PCD)
I
J
Response
RequestS(WTX)
S(DESELECT)
Received
ReceivedNo
operation
Return to
prev. stat.
Response
S(DESELECT)-> protocol end
Rule 3:

Send whatshould be
sent out
beforeentering thisstate andthen enter
the state.

No
operation
Return to
prev. stat.

No operation
Return to
prev. stat.

e-MRP Implementation Spec. V1.2
Table 5 – Transmission Control Protocol on the (Upper Device) PCD Side (Towards e-MRP)
1 I(0)0 (No-Chain)
After send
Wait receive
2 I(0)1 (No-Chain)
After send
Wait receive
3 I(1)0 (Chain)
After send
Wait receive
4 I(1)1 (Chain)
After send
Wait receive
5 R(ACK)0After send
Wait receive
6 R(ACK)1After send
Wait receive
7 R(NAK)0
After send
Wait receive

Normaltermination ->1)
0
Block number
Violation -> 0

BlocknumberViolation -> 0
Normaltermination
1)-> 0

R(ACK)1 ->6
1)Rule 2:BlocknumberViolation -> 0

Block number
Violation -> 0
R(ACK)0 -> 5
1)
Rule 2:

I(0)1 -> 2
I(1)1 -> 4
1)
Rule 7:Block number
Violation -> 0

Protocol Error-> 0
Normaltermination -> 0
1)

Block number
Violation -> 0
Normaltermination ->1)
0

Protocol Error
-> 0

Block
R(ACK)1 -> 61)
numberRule 2:
Violation -> 0
NormalBlocktermination
number1)-> 0
Violation -> 0
Block
R(ACK)1 -> 61)
numberRule 2:
Violation -> 0

Block number
Violation -> 0

Normaltermination
1)-> 0

R(ACK)0 -> 5
1)
Rule 2:8 R(NAK)1
After send
Wait receive

Block number
Violation -> 0

9 Request
S(DESELECT)
After send
Wait receive

S(DESELECT) -> 0
Rule 8:BlocknumberViolation -> 0

R(ACK)0 -> 5
1)
Rule 2:Block number
Violation -> 0

Block number
Violation -> 0
I(0)0 -> 1
I(1)0 -> 3
1)
Rule 7:

Response
S(WTX)
Sent Rule3

Protocol Error-> 0

Protocol Error-> 0
I(0)1 -> 2
I(1)1 -> 4
1)
Rule 7:

Last block
I(0)0 Resend -> 1
I(1)0 Resend -> 3
1)
Rule 6:
Last block
I(0)0 -> 1
I(0)1 Resend -> 2 I(1)0 -> 3
1)
I(1)1 Resend -> 4 Rule 7:
3)
Rule 6:
protocol end

FormatError-> 0

R(NAK)0 -> 7
2)
Rule 4:R(NAK)0 -> 7
2)
Rule 4:R(NAK)1 -> 8
2)
Rule 4:R(NAK)1 -> 8
2)
Rule 4:R(NAK)0 -> 7
2)
Rule 4:R(NAK)0 -> 7
2)
Rule 4:R(NAK)1 -> 8
2)
Rule 4:R(NAK)1 -> 8
2)
Rule 4:

R(ACK)0 ->5
2)
Rule 5:
R(ACK)1 ->6
2)
Rule 5:R(NAK)0 -> 7
2)
Rule 4:

R(ACK)0 ->5
2)
Rule 5:
R(ACK)1 ->6
2)
Rule 5:R(NAK)0 -> 7
2)
Rule 4:R(NAK)1 -> 8
2)
Rule 4:R(NAK)1 -> 8
2)
Rule 4:S(DESELECT) Resend -> 0
Rule 8:

NOTE1 "Rule" refers to rules as stipulated in "Block Numbering Rules" of ISO/IEC 14443-4.
NOTE2 The initial value of the error counter shall be 0. If the error counter equals the maximum value N (can be set to an appropriate value when building system), PCD (upper device)
shall end the protocol and return to state 0.
1) PCD shall update its internal block number for the block number it will assign to the block that it will send next, and shall clear the error counter.
2) Increment error counter.
3) Clear error counter26

e-MRP Implementation Spec. V1.2

9 Unit Tests
Since the electrical characteristics of an e-MRP are the same as those of the PICC, Unit Tests for the eMRP shall refer to ISO/IEC 10373-6 as the "Standard Specification." In order to improve compatibility of eMRPs and PCDs, this Implementation Specification includes additional tests as "Compatibility
Improvement Specifications." This Implementation Specification also reflects provisions stipulated in
ISO/IEC 10373-6/AM2.
Explanatory Notes:
The following standards specify the corresponding tests
ISO/IEC 10373-6/FPDAM4–

Additional test methods for PCD RF interface and PICC maximum applied magnetic field.

–

Alternating current magnetic field tests and electrostatic discharge tests.

–

Effects of maximum load Class 1 PICC.

–

Magnetic field strength of PCDs that support operation of Class 1 PICC.

ISO/IEC 10373-6/FPDAM5–

Additional protocol test methods for data rates of fc/64, fc/32, and fc/16.

9.1 General Requirements
9.1.1 Test Environment
Unless otherwise specified, the test environment as specified in Table 6 shall apply.
Table 6 – Test Environment
Subject Area

Condition

Temperature

23±3°C

Humidity

Relative humidity from 40% to 60%

9.1.2 Pre-conditioning
The e-MRP and PCD to be tested shall be conditioned to the test environment that satisfies the provisionsof the test environment for a period of 24 h before testing.
9.1.3 Default Tolerance
Unless otherwise specified, a default tolerance of ±5 % shall be applied to the quantity values given to
specify the characteristics of the test equipment (e.g. linear dimensions) and the test method procedure(e.g. test equipment adjustments).

27

e-MRP Implementation Spec. V1.2
9.1.4 Total Measurement Uncertainty
The total measurement uncertainty for each quantity determined by these test method shall be stated in
the test report.
Note:

Basic information is given in "ISO Guide to the Expression of Uncertainty in Measurement" ISBN92-67-10188, 1993.

9.2 Test Content–

Test content for the e-MRP under test
are shown in Table 7, and–Test content for the PCD under test
are shown in Table 8.

Details of each test content listed in Tables 7 and 8 are described from section 9.3 onward.
There are several Compatibility Improvement Specifications designate as "Informative" which tests can be
added according to the usage environment of the application.
Table 7 – Test Content (for e-MRP under test)
Item

Test content

Test Apparatus[Generated Magnetic
Field Strength]
Test PCD [1,5 A/m]
Test PCD [4,0 A/m]

9.3.1

e-MRP load
modulation
amplitude test

Category
Rule

30/H^1,2 mVp-p
or more.

Test PCD [7,5 A/m]

Test PCD-S (Informative)
A REQA/REQB[4,0 A/m]
response is
Test PCD-S (Informative) received.
[7,5 A/m]
Test PCD [1,5 A/m]
A REQA/REQB
Test PCD [4,0 A/m]
9.3.2 Reception test
response is
Test PCD [4,5 A/m]
received.
Test PCD [7,5 A/m]
No rule.
Resonance
Impedance analyzer or
9.3.3
13,56 MHz or
Frequency
LCR meter
more.
The e-MRP shallfunction normally
Maximum Applied Test PCD
9.3.4
after applying theMagnetic Field Test [Apply 10 A/m]magnetic field of
10 A/m.
ProtocolThe timing values
Timingshall satisfy the
9.3.5
Test PCD [No rule]characteristics
rules.
(Informative)

Standard Compatibility
Specification Improvement
Normative
Normative
Normative
Informative
Informative
Normative
Normative
1)

Normative
Normative
Informative

Normative

Normative

Informative

1) Test PCD [4,5 A/m] shall be omitted from the Compatibility Improvement Specifications.

28

e-MRP Implementation Spec. V1.2

Table 8 – Test Content (for PCD under test)
Test Apparatus
Category[Reference
PICC
Item
Test content
RuleStandard Compatibility
Resonance
Specification Improvement
Frequency]
Reference PICC
3 V (dc) or less
Normative[19 MHz](7,5 A/m)
Magnetic Field
Reference PICC-S
Strength[19 MHz]
Maximum
3 V (dc) or less
Generated Magnetic Reference PICC-M
Normative
[19
MHz]
Field
(7,5 A/m)
Reference PICC-L[19 MHz]
9.4.1
Reference PICC
3 V (dc) or more
Normative[13,56 MHz]
(1,5 A/m)
Reference PICC-S
Magnetic Field[13,56 MHz]
Strength
Minimum Generated Reference PICC-M
3 V (dc) or more
Normative
Magnetic Field(4 A/m)[13,56 MHz]
Reference PICC-L[13,56 MHz]
Reference PICC
[19 MHz]
Reference PICC-S
Power Transmission [19 MHz]
9.4.2
Test
Reference PICC-M[19 MHz]
Reference PICC-L[19 MHz]1,8 kOhm load,
3 V (dc) or more

Normative

910 Ohm load,
6,8 V (dc) or
more

Calibration CoilInformative

Normative

Reference PICC
The results
9.4.3 Modulation Waveform (Annex I)
shall satisfy the[19 MHz]
rules.
Reference PICC-S/M/L[19 MHz]
Reference PICC
[19 MHz]
Reference PICC-S
Reception ability of[19 MHz]
Shall be able to9.4.4 load modulation
receive.
Reference
PICC-Msignal (Informative)[19 MHz]
Reference PICC-L[19 MHz]
Protocol Timing
Timing value
9.4.5 Characteristics
N/A
shall satisfy(Informative)
specification.

29

Informative
Normative
Informative
Informative
Informative
Informative
Informativee-MRP Implementation Spec. V1.2
9.3 Test Content for the e-MRP Under Test
Shall comply with "Testing of PICC" of ISO/IEC 10373-6 and ISO/IEC 10373-6/AM2.
9.3.1 e-MRP Load Modulation Amplitude Test
Shall comply with "PICC load modulation amplitude" of ISO/IEC 10373-6 and ISO/IEC 10373-6/AM2.
Compatibility Improvement Specifications:
The minimum operating field Hmin shall be equal to the value as specified in "5.1.4 Operating Field."Compatibility Improvement Specifications (Informative):
Functional test of an e-MRP in close contact is performed by verifying whether the e-MRP satisfies therules while using a Test PCD-S.
(1)

Test procedure
Place the e-MRP on the Test PCD-S and send a REQA or REQB from the Test PCD-S.
Verify the modulated signal received from the e-MRP using an oscilloscope connected to a calibration
coil.

(2)

Measurements
Check the receipt of modulation signal from the e-MRP when the e-MRP is within the operating rangeof the test PCD-S.
Operating range of Test PCD-S
Distance: from 0 mm to 5mm.
Displacement: within diameter of 5 mm.

(3)

Rule
A modulation signal shall be received from the e-MRP within the operating range of the test PCD-S.

9.3.2 Reception Test
Shall comply with "PICC reception" of ISO/IEC 10373-6/AM2.
Compatibility Improvement Specifications:(1) Test procedure
Adjust the modulation waveform from the Test PCD to satisfy the conditions specified in Table 9 and
10.

30

e-MRP Implementation Spec. V1.2
Verify the response from the e-MRP according to the test method stipulated in ISO/IEC 10373-6.
Table 9 – Type A Testing Conditions
Condition

H (A/m)t1 (µs)t2 (µs)

1

4,0

3

0,5

2

4,0

2

0,7

3

7,5

3

0,5

4

7,5

2

0,7

Table 10 – Type B Testing Conditions
Condition

H (A/m)Modulation

tr (µs)tf (µs)index (%)
1

4,0

8

2

2

2

4,0

14

2

2

3

7,5

8

2

2

4

7,5

14

2

2

(2) Rule
A response shall be emitted from the e-MRP.
Explanatory Notes:
The following is specified in ISO/IEC 10373-6/FPDAM5.
–

Test conditions for acceleration.

9.3.3 Resonance Frequency
Shall comply with "PICC resonance frequency (informative)" of ISO/IEC 10373-6/AM2.
Compatibility Improvement Specifications:
Results shall satisfy the Compatibility Improvement Specifications of "5.1.3 Resonance Frequency."
9.3.4 Maximum Field Strength Application Test
The purpose of this test is to verify that the e-MRP under test does not have any anomaly after applying
maximum field strength on the e-MRP.
Compatibility Improvement Specifications:(1) Test procedure31e-MRP Implementation Spec. V1.2
Place an e-MRP into the DUT position on the Test PCD and after applying a field with an average (forthe span of 30 seconds) strength of 10 A/m rms at 13,56 MHz, verify the operation of the e-MRP.
(2) Rule
e-MRP shall function normally after applying field.
9.3.5 Protocol Timing Characteristics (Informative)
Compatibility Improvement Specification (Informative): <Refer to ISO/IEC 10373-6:2001/FPDAM1>(1) Test procedure
Refer to ISO/IEC 10373-6:2001/FPADM1 and measure each protocol timing specified in Table 11 and
12.
(2) Rule
The measurements of each protocol timing shall satisfy the values specified in Table 11 and 12.
Table 11 – Excerpt from
No.
1
2

3

4

< ISO/IEC 10373-6:2001/FPDAM1. Table G.33 – Type A Specific Timing Table>
Parameter
ISO Reference
Required Test Value
Measured
Value(s)Frame delay time
ISO/IEC 14443At least 1172/fc
PICC to PCD
3:2001, 6.1.3
Frame delay time
ISO/IEC 14443Last bit (1)b->1236/fc
PCD to e-MRP
3:2001, 6.1.2
Last bit (0)b->1172/fc(for REQA,WUPA,ANTICOLLISION,SELECT
commands)
Frame delay time
ISO/IEC 14443Last bit (1)b ->PCD to e-MRP
3:2001, 6.1.2(n × 128 + 84) / fc
(for all commands, exclude
Last bit (0)b ->ones from previous row)(n × 128 + 20) / fc
Deactivation frame waiting
ISO/IEC 14443See Table G.34 No.12
Time
4:2001, 8.1(same values)

NOTE All timing values are calculated for carrier frequency fc equal 13,56 MHz and bit rate equal to fc/128(~106 kbit/s).

32

e-MRP Implementation Spec. V1.2
Table 12 – Excerpt from
No.
1
2
3
4
5
6
7
8

9

10

11

< ISO/IEC 10373-6:2001/FPDAM1. Table G.34 – Type B Specific Timing Table>
Name
ISO Reference
Std MinStd Max
Measured
Value(s)SOF low
ISO/IEC 1444310 etu
11 etu3:2001, 7.1.4(~94,40 µs)(~103,83 µs)
SOF high
ISO/IEC 144432 etu
3 etu
3:2001, 7.1.4(~18,88 µs)(~28,32 µs)
EOF low
ISO/IEC 1444310 etu
11 etu3:2001, 7.1.5(~94,40 µs)(~103,38 µs)
Bit boundaries
ISO/IEC 14443(n - 1/8) etu(n + 1/8) etu
3:2001, 7.1.1
EGT PICC to
ISO/IEC 144430 µs
19 µs
PCD
3:2001, 7.1.2
TR0 for ATQB
ISO/IEC 1444364/fs
256/fs3:2001, 7.1.6(~75,52 µs)(~302,06 µs)
TR1 for ATQB
ISO/IEC 1444380/fs
200/fs3:2001, 7.1.6(~94,40 µs)(~235,99 µs)
TR0 Not
ISO/IEC 1444364/fs(256/fs) × 2FWI FWI =ATQB
3:2001, 7.1.6(~75,52 µs)
TR1
Max TR0 =ISO/IEC 14443or(~302,06 × 2FWI) 3:2001, 7.10.3
May be Reduced
TR1 µsTR1 Not
ISO/IEC 1444380/fs
200/fs
ATQB
3:2001, 7.1.6(~94,40 µs)(~235,99 µs)
ISO/IEC 14443or
3:2001, 7.10.3
May be Reduced
Delay from the ISO/IEC 144430 µs
2 etu
end of EOF
3:2001, 7.1.7
and Subcarrier
off
Deactivation
ISO/IEC 1444364/fs + 80/fs
65536/fs
frame waiting
4:2001, 8.1(~169,92 µs)(~4,8 ms)time

NOTE All timing values are calculated for carrier frequency fc equal 13,56 MHz and bit rate equal to fc/128 (~106kbit/s).

33

e-MRP Implementation Spec. V1.2
9.4 Test Content for the PCD Under Test
9.4.1 Field Strength
Shall comply with the "PCD field strength" of ISO/IEC 10373-6.
Compatibility Improvement Specifications:(1) Test procedure
Using the Reference PICC -S/M/L, measure minimum and maximum field generated. Test procedureand measurements shall be the same as those stipulated in "PCD field strength" of ISO/IEC 103736, and minimum field strength (Hmin) shall be equal to the value stipulated in "5.2.4 Generated
Magnetic Field."(2) Rulea)Maximum field generated
Receive voltage of 3 V (dc) or less within the operating range of the PCD.

b)

Minimum field generated
Receive voltage of 3 V (dc) or more within the operating range of the PCD.

9.4.2 Power Transfer Test
Shall comply with the "Power transfer PCD to PICC" of ISO/IEC 10373-6.
Compatibility Improvement Specifications (Informative):(1) Test procedure
Using the Reference PICC -S/M/L for power transfer tests, measure the voltage. Test procedure shallbe the same as the procedure stipulated in "Power transfer PCD to PICC" of ISO/IEC 10373-6.
Connect jumper to resistor R3 of the reference PICC-S/M/L and tune the resonance frequency to 19
MHz. Measure the voltage generated at both ends of R3 with a high input impedance voltmeter.
Measurement shall be performed with all reference PICC-S/M/L.
(2) Measurements
Measure the voltage generated at both ends of R3 within the operating range of the PCD.
(3) Rule
Receive voltage of reference PICC shall be 6,8 V (dc) or more
9.4.3 Modulation Waveform
Shall comply with the "Modulation index and waveform" of ISO/IEC 10373-6.

34

e-MRP Implementation Spec. V1.2
Compatibility Improvement Specifications:
The modulation waveform shall be measured with the reference PICC set in place.
(1) Test procedure
Measure the modulation waveform on the calibration coil with the reference PICC placed within theoperating range of the PCD.
Using the Reference PICC -S/M/L for modulation waveform tests, measure the specified
measurements.
a)Tune the reference PICC so as to synchronize at 19 MHz.

b)

Place the calibration coil over the reference PICC-S/M/L coil, place the reference PICC in theoperating range of the PCD, and measure the modulation waveform by monitoring the voltage
waveform induced on the calibration coil.

(2) Measurements
Measure the modulation waveform in the operating range of the PCD, along with measurement of themodulation index, rise time, fall time, and overshoot.
(3) Rule
The modulation index and modulation waveform shall satisfy the provisions stipulated in "Modulation"of ISO/IEC 14443-2.
Compatibility Improvement Specifications (Informative): <Refer to ISO/IEC 10373-6:2001/FPDAM4>
The modulation waveform shall be measured with the reference PICC (Annex I) set in place.
(1) Test procedure
Measure the modulation waveform on the pickup coil with the reference PICC (Annex I) for modulation
waveform tests placed within the operating range of the PCD.
a) The calibration coil shall be placed above the reference PICC (Annex I) coil and the PCD shall becalibrated to generate maximum generated magnetic field above the calibration coil.
b) The jumper J1 of the reference PICC (Annex I) shall be connected to resistance R1 and adjusted
to synchronize at 19 MHz.
c) After the reference PICC (Annex I) is placed within the operating range of PCD, and the jumper
J1 is connected to resistance R2, and R2 is adjusted so as to receive 6 V (dc) at capacitor C4,
measure the modulation waveform from the voltage waveform induced at the pickup coil.

35

e-MRP Implementation Spec. V1.2
(2) Measurements
Measure the modulation waveform within the operating range of the PCD, and measure themodulation level, rising and falling time, and other values such as over-shoot.
(3) Rule
Modulation level and waveform shall satisfy "Modulation" of ISO/IEC 14443-2.
9.4.4 Reception Ability of Load Modulation Signal (Informative)
Shall comply with the "Load modulation reception (informative only)" of ISO/IEC 10373-6.
Compatibility Improvement Specifications:(1) Test procedure
Using the Reference PICC -S/M/L for modulation waveform tests, measure the specified
measurements.
Other test procedure shall be the same as the procedure stipulated in "Load modulation reception(informative only)" of ISO/IEC 10373-6.
(2) Measurements
Measure the load modulation signal that can be received by the PCD within the operating range of the
PCD.
(3) Rule
The PCD shall be capable of receiving load modulation signal stipulated in "Load modulation" of
ISO/IEC 14443-2.
Explanatory Notes:
The following is specified in ISO/IEC 10373-6/FPDAM4.
–

Details of test procedures.

9.4.5 Protocol Timing Characteristics (Informative)
Compatibility Improvement Specifications (Informative): <Refer to ISO/IEC 10373-6:2001/FPDAM3>(1) Test procedure
Refer to ISO/IEC 10373-6:2001/FPDAM3 and measure each protocol timing specified in Table 13 and
14.
(2) Rule
Measurements shall satisfy the protocol values specified in Table 13 and 14.

36

e-MRP Implementation Spec. V1.2
Table 13 – Excerpt from
No
1

2
3

<ISO/IEC 10373-6:2001/FPDAM3. Table H.4 – Type A Specific Timing Table>
MeasuredParameter
ISO Reference
Reference Value
Value

Frame delay time
PICC to PCD(for REQA,WUPA,ANTICOLLISION,
SELECT commands)
Request Guard Time
Deactivation frame
waiting time

ISO/IEC144433:2001, 6.1.3

at least 1172/fc(~86 µs)

ISO/IEC144433:2001, 6.1.4
ISO/IEC144434:2001, 8.1

at least 7000/fc(~512 µs)
Min 64/fs + 80/fs(~169.92 µs)
Max 65536/fc(~4.8 ms)

NOTE All timing values are calculated for carrier frequency fc equal 13,56 MHz and bit rate equal to fc/128 (~106kbit/s).

Table 14 – Excerpt from
No
SE
Q1
2
SE
Q2
SE
Q3
SE
Q4

<ISO/IEC 10373-6:2001/FPDAM3. Table H.5 – Type B Specific Timing Table>
Measured Value
Parameter
ISO Reference
Minimum
Maximum
SOF low
ISO/IEC1444310etu
11etu
3:2001, 7.1.4(~94.40µs)(~103.83 µs)
EOF low
ISO/IEC1444310etu
11 etu3:2001, 7.1.5(~94.40µs)(~103.83 µs)
Bit boundaries
ISO/IEC14443(n - 0.125) etu(n + 0.125) etu
3:2001, 7.1.1
EGT PCD to PICC ISO/IEC144430 etu
6 etu
3:2001, 7.1.2
Minimum delay
ISO/IEC1444310etu + 32/fs
No maximum
between the PICC 3:2001, 7.1.7
EOF start and PCD
SOF start

NOTE All timing values are calculated for carrier frequency fc equal 13,56 MHz and bit rate equal to fc/128 (~106kbit/s).
Note: All timing values are calculated for carrier frequency fc = 13.56 MHz and bit rate ~106 kbit/s

9.5 Test Apparatus for Unit Tests
9.5.1 Calibration CoilShall comply with "Calibration coil" of ISO/IEC 10373-6 and ISO/IEC 10373-6/AM2.
Explanatory Notes:
Note that changes have been applied in accordance with ISO/IEC 10373-6/AM2.
Major changes are the following.
・

Change in Note: Change of standard inductor value and resistance value.

・

Addition of Note: Note of caution related to connection of oscilloscope added.

37

e-MRP Implementation Spec. V1.2
9.5.2 Test PCD
9.5.2.1 Assembly of Test PCD
Shall comply with "Assembly of test PCD" and Annex of ISO/IEC 10373-6 and ISO/IEC 10373-6/AM2.
Explanatory Notes:(1) Note that changes have been applied in accordance with ISO/IEC 10373-6/AM2.
Major changes are the following.
Changed resistance value in Figure 6.
・

Note of Annex A Test PCD Antenna: Added note of caution regarding capacitor and resistor ratings.

Figure 6 – Initial Settings of Test PCD(2) Be aware that certain parts have been revised in accordance with ISO/IEC 10373-6/FPDAM5.
Major changes are the following.
・

Annex A: Impedance matching network added for cases where bit data rate are fc/64, fc/32, or fc/16.

38

e-MRP Implementation Spec. V1.2

Figure 7 – Impedance Matching Network for Data Rates of fc/64, fc/32, and fc/16
9.5.2.2 Settings of Test PCD
Shall comply with Annex of ISO/IEC 10373-6 and ISO/IEC 10373-6/AM2.
9.5.3 Test PCD-S
9.5.3.1 Assembly of Test PCD-S
Table 15 shows the antenna specifications of the PCD-S.
Table 15 – Antenna Specification of Test PCD-S
Description
Coil outer(38 ± 0,2) mm
diameter
Pattern width
0,5 mmPattern interval 0,5 mm
Pattern
35 µm
thickness
No. of turns
3 turns
Structure
The coil shall be made as a printed coilon PCB plated with copper.
Antenna board
Size
120 mm × 100 mm
Thickness
1,6 mmMaterial
FR4
Impedance matching
Impedance is matched between the antenna coil andnetwork
output circuit at 50 Ohm.
Name
Antenna coil39

e-MRP Implementation Spec. V1.2
Figure 8 shows the Test PCD-S circuit and Figure 9 shows the structure of the Test PCD-S.
The calibration coil and test PCD-S antenna shall be arranged in parallel so that the central axis of thecalibration coil and test PCD-S antenna coil are concentric. At this time, the test PCD-S shall beassembled so that the distance between the effective conductor surfaces is 15 mm as shown in Figure 9.
In addition, a 5 mm spacer shall be arranged between the Test PCD-S and measured PICC, and thespacer surface shall be defined as the reference surface (distance: 0 mm) of the Test PCD-S, while theantenna center of the Test PCD-S shall be defined as the central position.

To oscilloscope
Calibrationcoil

50Ω driver
Antennacoil

Impedance
Matching
Network
C3
C2

Z=50Ω
C1

Rext
Rａｎｔ

C4 C5 C6

Lａｎｔ

Figure 8– Test PCD-S Circuit

40

e-MRP Implementation Spec. V1.2

displancement+X direction

Calibran coilcircuit board shape

Measured card
center of shape
Measured card

Antenna coil centerof Test PCD-S

displacement+Y direction
120mm

Antenna coil for
Test PCD-S

Calibration coil

100mm

Measured card
Reference Surface

5mm

15mm

Calibration coilSpacer (distance 0)

Antenna coil of TestPCD-S

Figure 9 – Test PCD-S Structure
9.5.3.2 Settings of Test PCD-S
9.5.3.2.1 Calibration of Generated Field
Compatibility Improvement Specifications:
Using the reference PICC-S and reference PICC-L, the field strength H of the Test PCD-S shall becalibrated to the maximum generated field and minimum generated field as specified in the Compatibility
Improvement Specifications of 9.4.1.
The center of the reference PICC shall be concentric with the center of the Test PCD-S antenna at a
distance of 0 mm (reference surface) with no disposition.
(1) Calibration of maximum generated fieldOn the Test PCD, the output voltage of the reference PICC-S shall be tuned to measure 3 V (dc)under a field strength of 7,5 A/m. After placing this reference PICC-S in the DUT position of the PCDS, the Test PCD-S shall be tuned so that the output voltage of the reference PICC-S measures 3 V(dc).
(2) Calibration of minimum generated fieldOn the Test PCD, the output voltage of the reference PICC-L shall be tuned to measure 3 V (dc) under41

e-MRP Implementation Spec. V1.2
a field strength of 4,0 A/m. After placing this reference PICC-L in the DUT position of the PCD-S, theTest PCD-S shall be tuned so that the output voltage of the reference PICC-L measures 3 V (dc).
9.5.3.2.2 Modulation Waveform
By measuring the modulation waveform at the calibration coil, the modulation waveform shall be calibrated
so that the modulation waveform matches the stipulated waveform. The center of the calibration coil shallbe concentric with the center of the Test PCD-S antenna at a distance of 0 mm (reference surface) with nodisposition.
9.5.4 Reference PICC
Shall comply with the "Reference PICCs" of SO/IEC 10373-6 and ISO/IEC 10373-6/AM2 and shall add
the following provisions.
Explanatory Notes:
Note that changes have been applied to relevant areas in accordance with ISO/IEC 10373-6/AM2.
Major changes are the following.
–

Field strength as well as the adjustment range of R2 within the circuit of the reference PICC for
measuring voltage was changed.

–

The adjustment method of the resonance frequency of the reference PICC was changed.

Compatibility Improvement Specifications:(1) Size, thickness and material of the reference PICC-S/M/L
Size, thickness and material of the reference PICC-S/M/L shall be the same as the reference PICC.
(2) Coil Characteristics

42

e-MRP Implementation Spec. V1.2
Table 16 shows the size and other characteristics of the reference PICC-S/M/L.

Table 16 – Characteristics of Reference PICC-S/M/L
Subject Area
Coil dimensions

Description
Reference PICC-M
Coil outer diameter:

Reference PICC-S
Coil inner diameter:(66,6 ± 2%) mm × (31± 2%) mm

(72 ± 2%) mm × (42 ±2%) mmReference PICC-L
Coil outer diameter:(83,6 ± 2%) mm × (52± 2%) mm

Corner radius: (8,5 ± Corner radius: (5 ± 2%) Corner radius: (5 ± 2%)2%) mmNo. of turns

4

Pattern width(0,5 ± 20%) mm

Pattern interval(0,5 ± 20%) mm

Pattern material

Copper plated.

Pattern thickness

35 µm

mm

mm

NOTE The coil characteristics of the reference PICC-M is the same as those of the reference PICC
of the Standard Specification.

Compatibility Improvement Specifications (Informative): <Refer to ISO/IEC 10373-6/PFADM4>
The antenna layout, circuit layout, and component table of the reference PICC (Annex I) for modulationlevel tests and modulation waveform tests are shown in Figure 10, Figure 11, and Table 17, respectively.

43

e-MRP Implementation Spec. V1.2

Front Face: Pickup CoilBack Face: Main CoilFigure 10 – Antenna Layout

Figure 11 – Circuit Diagram of Reference PICC (Annex I) for Modulation Level Tests and Module
Waveform Tests

44

e-MRP Implementation Spec. V1.2
Component

Table 17 – Characteristics of Reference PICC-S/M/L
Value

L (main coil)
L (pickup coil)
C1
C2
D1, D2, D3, D4
C3
R1
R2
Dz
R3
C4

See Figure 10.
See Figure 10.
Stray capacitance < 5 pF
Variable capacitance (ex. From 3 pF to 20 pF)
See characteristics in Table 19 (BAR43 or equivalent)
1 nF
1.8 kOhm
From 0 to 200 Ohm
Zener diode 15 V (BZX84C15 or equivalent)
10 kOhm
1 nF

9.5.4.1 Reference PICC-S/M/L for Power Transfer Tests
9.5.4.1.1 Assembly of PICC-S/M/L
Figure 12 shows the circuit, and Table 18 shows the components of the reference PICC-S/M/L for powertransfer tests.

L

C1

D1

D2

D3

D4

C2
C3

C1: Stray
capacitance < 5pF

R3

R2

R1
a

b

VDC
ｃ

J1

J1: Jumpera:Power transfer (5 mW)
b:
Min/Max generated fieldc:
For power transfer (50 mW) and resonancefrequency adjustment

Figure 12 – Circuit of Reference PICC-S/M/L for Power Transfer Tests

45

e-MRP Implementation Spec. V1.2
Table 18 – Components
Component

Value

L (coil)See Table 16

C1
C2
C3
D1, D2, D3, D4

Stray capacitance < 5 pF
From 6 pF to 60 pF
10 nF
See Table 19 (BAR43 orequivalent)
1.8 kOhm (5 mW)
From 0 to 1 kOhm 1)
910 Ohm

R1
R2
R3

Comparison with Standard
Specification
Reference PICC-S/M/L isdefined.
Same.

Newly added.

1) Changed according to ISO/IEC 10373-6/AM2

Table 19 – Basic Characteristics of Diode D1, D2,D3, and D4
Subject Test condition Standard Maximum Unit
Forward voltage dropVF
Area
(Tj = 23°C)
Reverse voltage
VR
VF

IF = 2 mA

C

VR = 1 V
F = 1 MHz

trr

IF = 10 mA
IR = 1 mA
Irr = 1 mA

0,33
7

V
pF

5

ns

IF
IR
trr
Irr
Tj
F
C

Forward current
Reverse current
Recovery time
Recovery current
Juncture temperature
Frequency
Juncture capacity

9.5.4.1.2 Resonance Frequency Setting of PICC-S/M/L
The resonance frequency shall be set based on the method for setting the resonance frequency of thereference PICC as stipulated in "PCD field strength" and "Power transfer PCD to PICC" of ISO/IEC
10373-6/AM2, with modifications as stipulated below in the Compatibility Improvement Specifications.
Explanatory Notes:
The method for setting resonance frequency was changed by ISO/IEC 10373-6/AM2. The changes are
summarized below.
Drive the calibration coil directly from the signal generator using the frequency to set, set the jumper to a,and tune C2 so that the voltage at both ends of the resistance (1,8 kOhm) becomes largest. Here, thesignal generator output and C2 shall be tuned so that the maximum voltage at both ends of resistance R1
is 3 V (dc).
Compatibility Improvement Specifications:
Drive the calibration coil directly from the signal generator using the frequency to set, set the jumper to c,
and tune C2 so that the voltage at both ends of the resistance R3 (910 kOhm) becomes largest. Here, thesignal generator output and C2 shall be tuned so that the maximum voltage at both ends of resistance R3
is 3 V (dc).
46e-MRP Implementation Spec. V1.2
9.5.4.1.3 Setting Resistor R2 of PICC-S/M/L
Shall comply with the method of setting resistor R2 of the reference PICC stipulated in "PCD fieldstrength" of ISO/IEC 10373-6/AM2.
Explanatory Notes:
Resistance R2 shall be set as follows.
(1) Calibrate the field generated by the test PCD using a calibration coil.
(2) Set the resonance frequency.
(3) Place the reference PICC in the DUT position on the test PCD and connect jumper to resistor R2.
Measure the voltage at both ends of R2 with a high input impedance voltmeter, and adjust the voltage
to 3 V (dc).
Observe the state of the operating field by monitoring the voltage generated on the calibration coil.
9.5.4.2 Reference PICC-S/M/L for Load Modulation Tests
9.5.4.2.1 Assembly of PICC-S/M/L
Figure 13 shows the circuit, and Table 20 shows the components of the reference PICC-S/M/L for load
modulation tests.
J1 ab

C1: Stray
capacitance < 5pF

Rmod
1

N1

Cmod1

R2
R3

L

D2

D1

R1

R6

C1
C2

Laod modulation
signal847 kHz

D4

D3

C3

C4

D5

Rmod
2
a
J1, J2: Jumpers
a: resistance loadb: capacity load

J2

b

R4
N2

Cmod2

R5

Figure 13 – Circuit of Reference PICC-S/M/L for Load Modulation Tests

47

e-MRP Implementation Spec. V1.2
Table 20 – Components
Adjustment Components
Component
Function

Value

R1

adjust Q

0 Ohm

C2

Requiresadjustments.

Comparison with Standard
Specification
Within range of ISO (from 0
Ohm to 10 Ohm)

Value that makesSame.
the resonancefrequency 19 MHz.
Cmod1, Cmod2 Capacitor modulation 0 pF (None)
Remove since it is performed
with resistive modulation.
Rmod1, Rmod2 Resistive modulation From 400 Ohm to Same.
12 kOhm
R6
Shunt resistance
100 Ohm
Within range of ISO (from 10
Ohm to 5 kOhm)
D5
Adjusts shunt
5,1 V
Within range of ISO (from 2,7 V
voltage.
to 15 V)

Fixed Components
Component
Value

Comparison with Standard
Specification
Same.

R2, R3, R4, R5 1 MOhm
D1, D2, D3, D4 See Table 19 (BAR43 or equivalent)L
See Table 16
C1
C2
C3
C4

Stray capacitance < 5 pF
From 6 pF to 60 pF
100 pF
10 nF

N1, N2

N-MOS transistor with earth capacitance of
10 pF or less9.5.4.2.2 Resonance Frequency Setting of PICC-S/M/L
Use the same method as stipulated in 9.5.4.1.2.
Explanatory Notes:
Resonance frequency is not stipulated in ISO/IEC 10373-6.
9.5.4.3 Reference PICC-S/M/L for Modulation Waveform Tests

48

Reference PICC-S/M/L isdefined.
Same.

e-MRP Implementation Spec. V1.2
9.5.4.3.1 Assembly of PICC-S/M/L
Figure 14 shows the circuit, and Table 21 shows the components of the reference PICC-S/M/L formodulation waveform tests.

Matching circuit

L

CV1

R1

Stray capacitance
up to 5 pF
Figure 14 – Circuit of Reference PICC-S/M/L for Modulation Waveform Tests
Table 21 – Components
Component

Value

L (coil)
CV1
R1

See Table 16
From 6 pF to 60 pF
910 Ohm

Comparison with Standard
Specification
Newly added.

9.5.4.3.2 Resonance Frequency Setting of PICC-S/M/L
CV1 shall be tuned using the same measurement method as for the resonance frequency of PICC.

49

e-MRP Implementation Spec. V1.2

Explanations
This explanation describes contents stipulated or written in the main and Annex portions as wells as
related information, and does not constitute part of the Implementation Specification.
Purpose of Stipulation
This Implementation Specification titled "Proximity Communication Interface Implementation Specificationfor e-Passports," is a compilation of a communication interface that will be required to ensure compatibilityof biometric passports (e-Passports or e-MRP) and proximity coupling devices (PCD) while complying with
International Standards, and is based on the "Proximity Communication Interface Implementation
Specification Version 2.0" which was established as an implementation specification complementing theStandard Specification in order to ensure compatibility between contactless IC cards.
It is expected that this Implementation Specification will be respected by the e-MRP, PCD and vendors ofsystems that use these devices when considering interoperability.
Issues that were raised during discussion
Antenna size and antenna position of e-MRP
An issue that the compatibility with a PCD will be largely affected by the size of the antenna implemented
on an ID-3 sized e-MRP was raised.
If an ID-3 sized antenna is allowed to be implemented on an e-MRP, redefinition of the field strength, andwith that, a new effort for establishing an International Standard will be required, and considering the factthat ID-1 sized contactless ID cards have proven track record of compatibility, it was decided that e-MRPs
shall implement Class-1 sized antennae.
Furthermore, while the antenna size to be implemented on an e-MRP shall be Class-1 sized, theimplementation location will affect compatibility, which led to the decision that the antenna position of the eMRP shall be concentric with the center of a booklet.
Range of e-MRP operating field
The operating field of the e-MRP shall be in the proven range (from 4,0 A/m to 7,5 A/m) of the contactless
IC card, anticipating adaptation to advanced demands (authentication features using coprocessors)
expected in the future.
Initial response parameters of e-MRP
In ISO/IEC 14443-3:2001/FPADM3, the AFI value of an e-MRP Type B was specified as 'E1'. However,since e-MRPs issued before this specification was defined are likely to exist, it was decided to require that
PCDs should set the value of AFI to "00" and send a REQB/WUPB command.

50

e-MRP Implementation Spec. V1.2
Issues that were raised when establishing the "Proximity Communication Interface Implementation
Specification Version 2.0"
Measurement of Field Using Calibration CoilIn version 1.1 of the implementation specification, the description for calibrating the generated field of atest PCD-S and for measuring the strength of the generated field included specifications to measure theopen-circuit voltage using a calibration coil and calculating the field strength using a conversion factor.
However, while fields generated by large antennae (uniform field) such as those used in test PCDs, andthe fields at proximity of relatively small sized antennae (non-uniform field) such as those used in general
PCDs and test PCD-Ss might have same measurement values, the fact that fields that a PICC senses are
not necessarily the same became an issue.
Thus, the intended use of calibration coils was organized as follows to exclude measurement using thecalibration coil.
The intended use of the calibration coil is to calibrate the measurement test environment (test PCD,
reference PICC, etc.) for the purpose of calculation of field strength at a distance of 37,5 mm from the test
PCD antenna. Direct measurement of fields of PCDs and test PCD-Ss with other antenna sizes and atother distances are not considered as the intended use of the calibration coil in this Implementation
Specification.
PCD Test Environment

Not intended
use ofcalibration coil

Tests

Tests

PCD

PICC

Reference
PICC

Calibration
coil
Intended useof calibration
coil

PICC Test Environment

Calibration
coil

Test
PCD-S

Not intended
use ofcalibration coil

Test
PCD
Adjustment ofreference PICC

Figure 15 – Intended Use of Calibration CoilCompatibility of Open Type PCDs and PICCs
Methods on how to ensure compatibility of a situation where a PICC gradually approaches an open type
PCD were discussed.
Basic concept was organized and the following tests were added.
51

e-MRP Implementation Spec. V1.2
– Behavior when card approaches: Test for PICC characteristics (functional test) invocation– Communication after card begins operation: Static cross test of open type PCDs
Calibration of Test PCD-S
When calibrating the generated field in accordance with Compatibility Improvement Specifications ofSubclause 9.4.1, the maximum generated field of the test PCD-S is determined by the reference PICC-S,
and the minimum generated field is determined by the reference PICC-L. Thus, it was decided that thesetting for the generated field of the test PCD-S shall be performed using the reference PICC-S andreference PICC-L.
Reasons for stipulating individual provisions
Subject area: PICC operation noiseThis was specified in anticipation of establishing stable operation during high-speed communication whichis expected to become popular in the future.
Load fluctuation during operation of an IC on a PICC will be considered as load fluctuation of the PICC
itself, which will be received by the PCD as operational noise similar to load modulation. This may affectcommunication quality.
Since the margin of communication quality for high-speed communication is small than slower-speed
communication, this noise may become an issue.
Therefore, in order to evoke caution at design time, areas that may be affected by load fluctuation werelisted and a guideline to enable reprocessing by the system was introduced as one method to evade
disturbance pertaining to load fluctuation.
Note that since methods for measuring noise are currently not established, no numbers are specified.

52

e-MRP Implementation Spec. V1.2

Annex A
External Communication Protocol(Informative)

This informative document describes the communication protocol between PCDs and external equipment(upper devices).
Communication protocol between PCDs and upper devices are stipulated in the specifications for eachnation's upper device.

Table of Contents
A.1 Scope.......................................................................................................................................Annex A-1
A.2 Common Interface Specification of the PCD Control API.........................................................Annex A-2
A.2.1 Overview of the Common Interface ...................................................................................Annex A-2
A.2.2 List of Major Interface Functions........................................................................................Annex A-4
A.2.3 Procedures of Using the Common Interface......................................................................Annex A-5
A.2.4 Function Details.................................................................................................................Annex A-6
A.3 The PC/SC Specification........................................................................................................ Annex A 14

e-MRP Implementation Spec. V1.2

A.1 Scope
The external communication protocol described herein is informative since it is not specified in theStandard Specification and will depend on the application using it. Thus implementing the interface
described in this document on a PCD is not a requirement. However, in order to accommodate thedifferences between PCD vendors and to standardize service application software at the upper device
level, PCD vendors should provide driver software that implement the common interface specification
described in chapter 2, or PC/SC driver described in chapter 3.

Annex A-1

e-MRP Implementation Spec. V1.2

A.2 Common Interface Specification of the PCD Control API
This chapter describes the specification of the PCD common interface (API functions) as seen from theupper device and will not specify interface specifications particular to PCDs.
Note that service applications of upper devices shall use particular interfaces when using PCD specificfeatures.
Figure A.1 shows the scope of the specification described in Chapter 2.
Upper Device

Scope of
Chapter 2

e-MRP (biometric passports)

e-MRP processing
Application

Application on
e-MRP

Command Control

Command Processing

Protocol Control

Protocol Processing

Scope of Specification

e-MRP Type Processing(Type A/Type B)

PCD(Reader/Writer)

e-MRP Type Control

e-MRP Type Processing(Type A/Type B

PCD Control

PCD Processing

Port

Port

Figure A.1 – Scope of the Interface Specification of the PCD Control API

A.2.1 Overview of the Common Interface
A summary of the common interface is described below.
(1) Purpose of the Common Interface
To absorb differences in PCDs and to provide common interface functions to service applications.
To simplify procedures for controlling PCDs and e-MRP communication.

Annex A-2

e-MRP Implementation Spec. V1.2
(2) Form of the Common Interface
Dynamic Link Library (DLL)(3) Common Interface Driver Name
EMRPPCDDRV.DLL

Annex A-3

e-MRP Implementation Spec. V1.2
A.2.2 List of Major Interface Functions
Table A.1 shows a list of major functions supported by the common interface, and Table A.2 shows a listof error codes.

№
1
2
3
4
5
6
7
8

№
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21

Function name
RW_Open
RW_Close
RW_Insert
RW_Eject
RW_Sense
RW_Activate
RW_Transmit
RW_Deactivate

Error code
0x0000A001
0x0000A002
0x0000A003
0x0000A004
0x0000A101
0x0000A102
0x0000A201
0x0000A202
0x0000A203
0x0000A301
0x0000A302
0x0000A303
0x0000A304
0x0000A305
0x0000A306
0x0000A901
0x0000A902
0x0000A903
0x0000AE01
0x0000AE02
0x0000AE03

Table A.1 – List of Major Interface Functions
Description
Open communication port of PCD.
Close communication port of PCD.
Enable detection of e-MRP by PCD.
Disable detection of e-MRP by PCD.
Detect e-MRP.
Set e-MRP to ACTIVE state.
Perform data transmission between e-MRP.
Set e-MRP to inactive state.
Table A.2 – Common Error Code List
Description
Number error of specified port.
Open failure on specified port.
Close failure on specified port.
Specified port not open.
Error occurred during transmission to PCD.
Error occurred during transmission from PCD.
Error occurred during transmission to e-MRP.
Error occurred during transmission from e-MRP.
Timeout occurred during transmission from e-MRP.
Number error (other than 1) of specified slot 1)
Specified communication speed not supported by PCD.
Specified communication speed not supported by e-MRP.
Specified communication speed not supported by PCD.
Specified operation mode not supported by PCD.
Cannot initialize e-MRP with specified operation mode.
Specified port already open.
Specified port already closed.
INSERT command already received.
e-MRP is not set in the detectable range of PCD.
e-MRP no activated.
Preserved for future use.

NOTE Error codes values for PCD specific interface code shall be defined avoiding the range
from 0x0000A000 to 0x0000AFFF.
1) In this document "slot" refers to e-MRP detectable range of PCD.

Annex A-4

e-MRP Implementation Spec. V1.2
A.2.3 Procedures of Using the Common Interface
Figure A.2 shows the usage procedure of the common interface functions during basic operations of an eMRP.
START

RW_Open( )RW_Insert( )RW_Sense( )e-MRP setNo

Yes
RW_Activate( )Activation
success?

No

Yes
RW_Transmit( )End transmit

No

Yes
RW_Eject( )RW_Close( )END
NOTE The procedure shows basic operations only and does not show all procedures.
Figure A.2 – Usage of Function During Basic Operations

Annex A-5

e-MRP Implementation Spec. V1.2
A.2.4 Function Details
Details of the common interface functions are described herein. Note that the operating environment of theexamples of functions shown below assumes a device that run a Windows environment.
Note: Windows is a trademark or registered trademark of Microsoft Corporation in the United States ofAmerica and other countries.
(1) Function Name: RW_Open
Description
Directs a PCD to open a connected communication port.
When using a COM port, the communication speed between the upper device (PC) and the eMRP should be set to the maximum communication speed the PCD supports.
Synopsis
DWORD WINAPI RW_Open(BYTE bPortNumber)Arguments
bPortNumber : The port to open.
COM port : 1 though 9 (COM1 through COM9)
USB port : 101 through 109
Note: Ports other than the above are vendor specific.
Return value
0 : Normal termination.
Non 0 : Error occurred.
0x0000A001 : Number error of specified port.
0x0000A901 : Specified port already open.
0x0000A002 : Open failure on specified port.

(2) Function Name: RW_Close
Description
Directs a PCD to close a connected communication port.
Synopsis
DWORD WINAPI RW_Close(BYTE bPortNumber)Arguments
bPortNumber : The port to close.

Annex A-6

e-MRP Implementation Spec. V1.2
COM port : 1 though 9 (COM1 through COM9)
USB port : 101 through 109
Note: Ports other than the above are vendor specific.
Return value
0 : Normal termination.
Non 0 : Error occurred.
0x0000A001 : Number error of specified port.
0x0000A902 : Specified port already closed.
0x0000A003 : Close failure on specified port.

(3) Function Name: RW_Insert
Description
Enables detection of e-MRP by PCD.
Synopsis
DWORD WINAPI RW_Insert(BYTE bPortNumber,BYTE bSlotNumber)Arguments
bPortNumber : Communication Port.
COM port : 1 though 9 (COM1 through COM9)
USB port : 101 through 109
Note: Ports other than the above are vendor specific.
bSlotNumber : Slot number (fixed to 1).
Return value
0 : Normal termination.
Non 0 : Error occurred.
0x0000A001 : Number error of specified port.
0x0000A004 : Specified port not open.
0x0000A101 : Error occurred during transmission to PCD.
0x0000A102 : Error occurred during transmission from PCD.
0x0000A301 : Slot Number (other than 1) error of specified port.
0x0000A302 : Specified slot number not supported.
0x0000A902 : INSERT command already executed.
NOTE:
PCDs that do not support the enable e-MRP detection command shall return a normal termination
value if there are no errors in the arguments passed to it.
Annex A-7

e-MRP Implementation Spec. V1.2
The enable e-MRP detection state shall be reset by issuing the RW_Eject function.

(4) Function Name: RW_Eject
Description
Disables detection of e-MRP by PCD.
Synopsis
DWORD WINAPI RW_Eject(BYTE bPortNumber, BYTE bSlotNumber)Arguments
bPortNumber : Communication Port.
COM port : 1 though 9 (COM1 through COM9)
USB port : 101 through 109
Note: Ports other than the above are vendor specific.
bSlotNumber : Slot number (fixed to 1).
Return value
0 : Normal termination.
Non 0 : Error occurred.
0x0000A001 : Number error of specified port.
0x0000A004 : Specified port not open.
0x0000A101 : Error occurred during transmission to PCD.
0x0000A102 : Error occurred during transmission from PCD.
0x0000A301 : Slot Number (other than 1) error of specified port.
0x0000A302 : Specified slot number not supported.
NOTE:
Disables detection of e-MRP by PCD after turning carrier off.
If there are no errors in the arguments passed, reset the enable e-MRP detection state.

(5) Function Name: RW_Sense
Description
Detects whether an e-MRP is set within the detectable range of the PCD and detects theoperating status of the e-MRP.

Annex A-8

e-MRP Implementation Spec. V1.2
Synopsis
DWORD WINAPI RW_Sense(BYTE bPortNumber,BYTE bSlotNumber,LPLONG IccStatus1,
LPLONG IccStatus2)
Arguments
bPortNumber : Communication Port.
COM port : 1 though 9 (COM1 through COM9)
USB port : 101 through 109
Note: Ports other than the above are vendor specific.
bSlotNumber : Slot number (fixed to 1).
IccStatus1 : The storage buffer for the set state and operating state of e-MRP number 1.
IccStatus2 : Ignore value since it is currently not used with e-MRP operations.
Return value
0 : Normal termination.
Non 0 : Error occurred.
0x0000A001 : Number error of specified port.
0x0000A004 : Specified port not open.
0x0000A101 : Error occurred during transmission to PCD.
0x0000A102 : Error occurred during transmission from PCD.
NOTE:The set state and operating state of e-MRP (IccStatus1 1))******** ******** 0******* ********B: e-MRP set state: not set******** ******** 1******* ********B: e-MRP set state: already set******** ******** *000**** ********B: e-MRP type: contactless Type B******** ******** *001**** ********B: e-MRP type: contactless Type A******** ******** *111**** ********B: e-MRP type: unknown******** ******** ****0000 ********B: e-MRP state: IDLE******** ******** ****0001 ********B: e-MRP state: READY******** ******** ****0010 ********B: e-MRP state: ACTIVE******** ******** ****1000 ********B: e-MRP state: HALT******** ******** ******** ******00B: Communication speed: PCD to e-MRP 1× speed (106 kbit/s)******** ******** ******** ******01B: Communication speed: PCD to e-MRP 2× speed (212 kbit/s)******** ******** ******** ******10B: Communication speed: PCD to e-MRP 4× speed (424 kbit/s)******** ******** ******** ******11B: Communication speed: PCD to e-MRP 8× speed (847 kbit/s)******** ******** ******** ****00**B: Communication speed: e-MRP to PCD 1× speed (106 kbit/s)******** ******** ******** ****01**B: Communication speed: e-MRP to PCD 2× speed (212 kbit/s)******** ******** ******** ****10**B: Communication speed: e-MRP to PCD 4× speed (424 kbit/s)******** ******** ******** ****11**B: Communication speed: e-MRP to PCD 8× speed (847 kbit/s)

Annex A-9

e-MRP Implementation Spec. V1.2

1) Code of IccStatus1 may differ depending on the particular PCD.
Communication speed shows the speed state at that particular moment and is not the speed specification(ability) supported by the PCD or e-MRP. If the e-MRP type is unknown, the communication speed
information is invalid.
(6) Function Name: RW_Activate
Description
Initializes the e-MRP set on the PCD to the specified operation mode and communication speed,
and sets the e-MRP to ACTIVE state.
Synopsis
DWORD WINAPI RW_Activate(BYTE bPortNumber, BYTE bSlotNumber,
BYTE bCardNumber, BYTE IccMode, BYTE IccSpeed)
Arguments
bPortNumber : Communication Port.
COM port : 1 though 9 (COM1 through COM9)
USB port : 101 through 109
Note: Ports other than the above are vendor specific.
bSlotNumber : Slot number (fixed to 1).
bCardNumber : e-MRP number (fixed to 1).
IccMode : The operation mode to specify.
Contactless Type B (0x00), Contactless Type A (0x01)
IccSpeed : The communication speed between the PCD and e-MRP to set.
1× communication speed (0x00), 2× communication speed (0x01),
4× communication speed (0x02), 8× communication speed (0x03).
Auto set communication speed (0x80. Set the communication speed to the maximum speed
both PCD and e-MRP support).
Return value
0 : Normal termination.
Non 0 : Error occurred.
0x0000A001 : Number error of specified port.
0x0000A004 : Specified port not open.
0x0000A101 : Error occurred during transmission to PCD.
0x0000A102 : Error occurred during transmission from PCD.
0x0000A201 : Error occurred during transmission to e-MRP.

Annex A-10

e-MRP Implementation Spec. V1.2
0x0000A202 : Error occurred during transmission from e-MRP.
0x0000A203 : Timeout occurred during transmission from e-MRP.
0x0000A301 : Slot Number (other than 1) error of specified port.
0x0000A302 : Specified slot number not supported.
0x0000A303 : Specified communication speed not supported by e-MRP.
0x0000A304 : Specified communication speed not supported by PCD.
0x0000A305 : Specified operation mode not supported by PCD.
0x0000A306 : Cannot initialize e-MRP with specified operation mode.
0x0000AE01 : e-MRP not set.
NOTE:
The initialization of the e-MRP shall follow the procedures stipulated in the appropriate
specification in accordance with the specified operating mode.
Example: In Type B operating mode, following the procedures specified in the ISO/IEC 14443
standard, send the REQB command and then the ATTRIB commando to the e-MRP, and set theoperating state of the e-MRP to ACTIVE state.
If the e-MRP type retrieved using the RW_Sense command specified in item (5) is unknown, for
IccMode, an RW_Activate command shall be issued for contactless type A and contactless type B.
And for IccSpeed, when errors occur, the RW_Activate command shall be issued with varying
parameters until successful.

(7) Function Name: RW_Transmit
Description
Process the protocol in accordance with the operating mode of the e-MRP set in the specified
PCD and transmit to and from the e-MRP.
Synopsis
DWORD WINAPI RW_Transmit(BYTE bPortNumber, BYTE bSlotNumber,
BYTE bCardNumber, DWORD dwLenSend, LPBYTE lpbSendBuf,
LPDWORD lpdwLenRecv, LPBYTE lpbRecvBuf)
Arguments
bPortNumber : Communication Port.
COM port : 1 though 9 (COM1 through COM9)
USB port : 101 through 109
Note: Ports other than the above are vendor specific.
bSlotNumber : Slot number (fixed to 1).
bCardNumber : e-MRP number (fixed to 1).
dwLenSend : Number of bytes in send data (1 or more bytes).

Annex A-11

e-MRP Implementation Spec. V1.2
lpbSendBuf : Buffer to store send data.
lpdwLenRecv : Buffer to store received number of data bytes.
lpbRecvBuf : Buffer to store received data.
Return value
0 : Normal termination.
Non 0 : Error occurred.
0x0000A001 : Number error of specified port.
0x0000A004 : Specified port not open.
0x0000A101 : Error occurred during transmission to PCD.
0x0000A102 : Error occurred during transmission from PCD.
0x0000A201 : Error occurred during transmission to e-MRP.
0x0000A202 : Error occurred during transmission from e-MRP.
0x0000A203 : Timeout occurred during transmission from e-MRP.
0x0000A301 : Slot Number (other than 1) error of specified port.
0x0000A302 : Specified slot number not supported.
0x0000AE01 : e-MRP not set.
0x0000AE03 : e-MRP not in ACTIVE state.
NOTE:
Response data from the e-MRP including those is SW1 and SW2 shall be stored in the received
data buffer.

(8) Function Name: RW_Deactivate
Description
Sets e-MRP placed in the PCD to inactive state.

Synopsis
DWORD WINAPI RW_Deactivate(BYTE bPortNumber, BYTE bSlotNumber,
BYTE bCardNumber)Arguments
bPortNumber : Communication Port.
COM port : 1 though 9 (COM1 through COM9)
USB port : 101 through 109
Note: Ports other than the above are vendor specific.
bSlotNumber : Slot number (fixed to 1).
bCardNumber : e-MRP number (fixed to 1).

Annex A-12

e-MRP Implementation Spec. V1.2
Return value
0 : Normal termination.
Non 0 : Error occurred.
0x0000A001 : Number error of specified port.
0x0000A004 : Specified port not open.
0x0000A101 : Error occurred during transmission to PCD.
0x0000A102 : Error occurred during transmission from PCD.
0x0000A301 : Slot Number (other than 1) error of specified port.
0x0000A302 : Specified slot number not supported.
NOTE:
The behavior of this API function depends upon the particular PCD.
The PCD may halt transferring power to the e-MRP.

Annex A-13

e-MRP Implementation Spec. V1.2

A.3 The PC/SC Specification
PC/SC is an acronym of Personal Computer/Smart Card, and specifies the standards for using IC cards ona PC.
The PC/SC Specification is published at the PC/SC Workgroup web page(http://www.pcscworkgroup.com/). The 1.0 version of this specification for IC cards with contact terminals
was published in December 1997, and the 2.01 version which added contactless IC cards as its target was
published June 2005. The version to apply needs to be selected depending on the support for theoperating system of the upper device. When applying version 1.0, a contact terminal equipped IC cardshall be simulated to support the version.
Figure A-3 depicts the components of PC/SC version 2.01. The differences of the reader/writers (IFD)
shall be accommodated through IFD Handlers (driver software) that are provided by each reader/writer
vendor.
ICC-Aware Applications

ICC Service Provider
SPE for class 2/3
Readers

IFD Service Provider

ICC Resource Manager

IFD

IFD

IFD

Handler

Handler

Handler

IFD

IFD

IFD

ICC

ICC

ICC

IFD: InterFace Device
Corresponds withreader/writers in thisSpecification
ICC: IC Card
Corresponds with e-MRPs
in this Specification
SPE: Secure PIN Entry

Figure A.3 – Components of the PC/SC Specification
Note that, for details of the PC/SC interface, certain reference material should also be consulted. For
example, when using Windows platform PCs, consult the following materials.
–

Microsoft Windows Software Development Kit (SDK)–

Microsoft Windows Driver Development Kit (DDK)

Annex A-14

e-MRP Implementation Spec. V1.2

Annex A-15

e-MRP Implementation Spec. V1.2

Annex B
Compatibility Testing Specifications(Informative)

Table of Contents
B.1 Introduction ..............................................................................................................................Annex B-1
B.2 Scope.......................................................................................................................................Annex B-1
B.3 Testing Conditions ...................................................................................................................Annex B-1
B.3.1 Selection of Test Method...................................................................................................Annex B-1
B.3.2 Test Environment ..............................................................................................................Annex B-1
B.3.3 Pre-test Considerations .....................................................................................................Annex B-1
B.3.4 Pass-Fail Decisions ...........................................................................................................Annex B-2
B.4 Compatibility Testing Methods Using PCD ..............................................................................Annex B-2
B.4.1 List of Tests .......................................................................................................................Annex B-2
B.4.2 Combination of Tests.........................................................................................................Annex B-2
B.4.3 Testing Point and Direction of e-MRP ...............................................................................Annex B-3
B.4.4 Test Contents and Pass-Fail Criteria.................................................................................Annex B-4
B.4.5 Processing Flow ................................................................................................................Annex B-5
B.5 Compatibility Test With Reference Devices (Guideline)...........................................................Annex B-8
B.5.1 Reference Device ..............................................................................................................Annex B-8
B.5.2 Test Methods.....................................................................................................................Annex B-8

e-MRP Implementation Spec. V1.2

B.1 Introduction
This Annex specifies methods to verify compatibility by performing operation tests using e-MRPs and
PCDs that will actually be used on biometric (e-MRP) systems.
While performing cross-tests using actual e-MRPs and PCDs would be the most reliable method to ensureinteroperability, the fact that e-MRPs are developed and deployed by various nations world-wide makes it
difficult if not impossible to bring together all of the various types of devices developed in each nations to
one place and perform cross-tests. Nevertheless, since it is desirable and anticipated that a single nationor several agreeing nations would perform cross-tests, test methods that should be applied in such cases
are specified hereunder. Furthermore, in anticipation of performing global interoperability tests in the
future, a guideline is provided for interoperability tests using reference devices as an alternative to crosstests.

B.2 Scope
The interoperability test methods described herein shall be applied to the scope defined in ISO/IEC 144433 and ISO/IEC 14443-4. Furthermore, in order to verify compliance with 14443-4, a minimum command
send and receive test shall be performed.

B.3 Testing Conditions
B.3.1 Selection of Test Method
For e-MRP both Type A and Type B shall be tested.
PCD shall be an open type capable of handling both Type A and Type B.
B.3.2 Test Environment
Testing shall take place in an environment of temperature 25°C ± 3°C and of relative humidity (50 ± 20) %.
However, since it is anticipated that the actual operating environments will exceed this range, the devices'guaranteed range of operation shall be decided with consideration to the actual operating environment.
B.3.3 Pre-test Considerations
The following shall be decided before performing the tests. Value specifications designated as "standard"
are recommended values or assumed specification values. These can be changed according to system
requirements.
・

Number of PCDs for each type of PCD and number of e-MRPs for each type of e-MRP
Multiple PCDs and multiple e-MRPs should be used. The standard number of PCDs and e-MRPs to
use is 2 and 3 respectively.

Annex B-1

e-MRP Implementation Spec. V1.2
・The time from turning on the power of the PCD to time the test is started
A time shall be decided to avoid unstable behavior that may occur immediately after turning on the
power of the PCD.

・Communication speed from PCD to e-MRP
During the period from insertion of e-MRP into PCD until activation, the communication speed shall be
106 kbit/s. Communication speed for sending and receiving commands shall be set to the maximum
speed supported. The standard speed is 424 kbit/s.

・The direction of e-MRP・The direction of PCD

・

The test point on the PCD・

Number of test iteration and pass/fail decision criteria

・

Other parameters that will affect the tests

B.3.4 Pass-Fail Decisions
When a failure occurs for a certain combination, the e-MRP or PCD that caused the failure shall be
determined carefully after thoroughly investigating the situation and performing analysis.

B.4 Compatibility Testing Methods Using PCD
B.4.1 List of Tests
Table B.1 lists the tests to perform.
Table B.1 – List of Tests
No.

Test name

Test description

Notes

After placing the e-MRP on a PCD,
T1

Activation test

verify whether the e-MRP canenter the activated state.

T2

Command

Verify that commands operate

The SELECT FILE (DF)send/receive test

correctly.

command shall be used.

B.4.2 Combination of Tests
・Cross tests using all PCD types and all e-MRP types shall be performed.

・For each PCD, perform the test using each e-MRP sequentially.

Table B.2 shows the combinations of the PCD and e-MRP for each test.

Annex B-2

e-MRP Implementation Spec. V1.2

Table B.2 – Combinations
No.

Test nameT1

Activation test

T2

Combination of PCD and e-MRP
to perform test

Notes

Perform tests using combinationsof all PCDs and all e-MRPs
Perform tests using all

Commandsend/receive test

combinations that have passed the
T1 test.

B.4.3 Testing Point and Direction of e-MRP(1) Testing Point
The testing point shall be determined with consideration to the operating conditions of the applied e-MRP
system.
Examples of testing points are shown below.
Considering a cylinder with its center axis concentric with the center of the PCD at "o", a total of 10 test
points (shown with a black filled circle) shall be selected at the center points and at each intersection pointof the X axis and Y axis with the surface of the cylinder. The center point, X axis, Y axis, and Z axis
positions shall be determined at test time. However, the standard Z axis test position shall be 20 mm.

z
y
O

x

PCD
Figure B.1 – Testing Points (Example)(2) Direction of e-MRP
The standard direction of e-MRP shall be the position that the PCD vendor specifies. Otherwise, refer tothe following.
When viewing the PCD from directly above, the long edge of the e-MRP shall be parallel with the X axis.

Annex B-3

e-MRP Implementation Spec. V1.2
PCD

e-MRP (ID-3 size)
Antenna (ID-1 size)

Figure B.2 – Direction of e-MRP (Example)

B.4.4 Test Contents and Pass-Fail Criteria(1) T1 Tests– Verify that transition from REQ command to activation is performed correctly complying with ISO/IEC
14443-3.
– For each e-MRP, the standard shall be to perform the test multiple times for each direction on each test
position for all specified directions on all test points. The number of times shall be specified
independently at each test occasion (three times or more is desirable).
– The pass criteria would be to pass every test. If results are unstable, review and fix the problematicarea, and then aim to pass the tests multiple times.
(2) T2 Tests– Verify that e-MRP test commands are sent and received correctly.
– For each e-MRP, the standard shall be to perform the test multiple times for each direction on each test
position for all specified directions on all test points. The number of times shall be specified
independently at each test occasion (three times or more is desirable).
– The pass criteria would be to pass every test. If results are unstable, review and fix the problematicarea, and then aim to pass the tests multiple times.

Annex B-4

e-MRP Implementation Spec. V1.2
B.4.5 Processing Flow
(1) Basic Processing Flow
Figure B.3 shows the basic test processing flow.
START

Place e-MRP
T1 TestT1 Passed ?

NO

YES
T2 TestNO

All points
Measured?

YES
NO

All
Directions?

YES
YES

Next

e-MRP
NO
END

Figure B.3 – Basic Test Processing Flow

Annex B-5

e-MRP Implementation Spec. V1.2
(2) T1 Test Processing Flow
BEGIN

RF ON(1)

REQ Command to
Activation

NGOK
T1 Passed

T1 Failed

RF OFF(2)Place e-MRPNO

Multiple
Times ?

YES
RETURN(1)

If the PCD not controllable through commands, this may be achieved by moving the e-MRP to a position

where the PCD and e-MRP can communicate with each other.
(2)

If the PCD not controllable through commands, this may be achieved by moving the e-MRP to a position

where the PCD and e-MRP cannot communicate with each other.
Figure B.4 – T1 Test Processing Flow

Annex B-6

e-MRP Implementation Spec. V1.2
(3) T2 Test Processing Flow
BEGIN

Place e-MRP
RF ON(1)
REQ Command to ActivationNG
RF OFF(2)OK

e-MRP Command
Execution

NG

Serially Failmultiple times?

OK

YES

Passed 1
Time

Failed 1 Time Failed 1 TimeNO

RF OFF(2)NO

Multiple
Times?

YES
RETURN(1)

If the PCD not controllable through commands, this may be achieved by moving the e-MRP to a position

where the PCD and e-MRP can communicate with each other.
(2)

If the PCD not controllable through commands, this may be achieved by moving the e-MRP to a position

where the PCD and e-MRP cannot communicate with each other.
Figure B.5 – T2 Test Processing Flow

Annex B-7

e-MRP Implementation Spec. V1.2

B.5 Compatibility Test With Reference Devices (Guideline)
Perform compatibility tests of target device with a reference e-MRP and a reference PCD as an alternative
to performing cross tests with other target e-MRPs and PCDs.

B.5.1 Reference Device
Prepare a reference PCD and a reference e-MRP that satisfy the following specifications. Note that asingle reference device may not necessarily provide all features.
・The device shall be capable of setting parameters complying with ISO/IEC 14443-2, ISO/IEC 14443-3,
and ISO/IEC 1444-4.

・Commands can be sent and received against the parameters mentioned above.

B.5.2 Test Methods
Perform tests in accordance with the following test specifications.
・e-MRP shall be tested against the reference PCD.

・

PCD shall be tested against the reference e-MRP.

・Decide on the parameter values to set and the combination of parameter values to use. To decide thevalues, information such as results from cross tests shall be used.

・For each combination of parameter values, perform tests by applying the test methods for the e-MRP
compatibility tests that use open type PCDs.

Devices that passed the test for all combinations of the specified parameters shall be considered as
devices that passed the compatibility test.

Annex B-8

e-MRP Implementation Spec. V1.2

Annex Ce-MRP Command Interface(Informative)

The e-MRP command interface is described in "Logical Data Structure (LDS) version 1.7, PKI for Machine
Readable Travel Documents offering ICC read only access V1.1, Supplement to Doc9303-epassports
Ver2005-4V3.0". This informative document describes topics such as examples of recommended
command sequences, items that were raised as issues during past ICAO interoperability tests, andconsiderations for improving interoperability.

Table of Contents
C.1 Scope...................................................................................................................................... Annex C-1
C.2 Examples of Command Sequences........................................................................................ Annex C-2
C.2.1 Select File and Read Binary ............................................................................................. Annex C-2
C.2.2 Basic Access Control and Secure Messaging .................................................................. Annex C-3
C.2.3 Odd INS (B1) Read Binary ............................................................................................... Annex C-5
C.3 Examples of Basic Access Control Availability Assessment Sequences ................................ Annex C-6
C.3.1 Example of BAC Support Availability Assessment Sequence .......................................... Annex C-6
C.3.2 Example of Extended Le Support Availability Assessment Sequence ............................. Annex C-6

e-MRP Implementation Spec. V1.2
Referenced Standards:[1] ICAO"MACHINE READABLE TRAVEL DOCUMENTDEVELOPMENT OF A LOGICAL DATA STRUCTURE For OPTIONAL CAPACITY EXPANSIONTECHNOLOGIES" Ver1.7 (May 18, 2004)[2] ICAO"MACHINE READABLE TRAVEL DOCUMENT

PKI for Machine Readable Travel Documents offering ICC Read-Only Access"Ver1.1 (October 1, 2004)[3] ICAO"MACHINE READABLE TRAVEL DOCUMENT

Supplement to Doc9303-epassports" Ver2005-4 V3.0 (2005.6.12)

C.1 ScopeThis informative document describes the application level command interface within the communication
function between the e-MRP and upper device.
Figure C.1 shows the scope of this document
Upper Device

e-MRP (biometric passports)

e-MRP processing
Application

Application on
e-MRP

Command Control

Command Processing

Scope of this Informative Document
Protocol Control

Protocol Processing
e-MRP Type Processing(Type A/Type B)

ＰCD(Reader/Writer)
e-MRP Type Control

e-MRP Type Processing(Type A/Type B)

PCD Control

PCD Processing

Port

Port

Figure C.1 – Scope of this Informative Document

Annex C-1

e-MRP Implementation Spec. V1.2

C.2 Examples of Command Sequences
This chapter describes examples of recommend command sequences for the e-MRP command interface
as well as considerations regarding compatibility.
C.2.1 Select File and Read Binary
The e-MRP command interface complies with "Logical Data Structure (LDS) version 1.7".
Compatibility Improvement Specifications:
The e-MRP shall support SFI to ensure compatibility.
Considerations:
It should be noted that transmission efficiency of the upper device will decline if the Le in the Read Binarycommand is set to "00" within the Data-Group reading sequence.
Le should be set to an optimal data size that will prevent the transmission efficiency to decline.
Explanatory Notes:
While the receive buffer size of PICCs (e-MRPs) and PCDs defined in ISO/IEC 14443 include the six (6)bytes comprised of PCB, CID, SW1, SW2 and CRC, the data size defined in ISO/IEC 7816-4 does notinclude these bytes.
Therefore, when Le is set to "00" when issuing read command to retrieve 256 bytes, and e-MRP will, in
accordance with the ISO/IEC 14443 specification, divide the data using the chaining function and send
them as response data.
Table C.1 shows the responses when the data size is set to 256 bytes using Short Le (Le = 1 byte) under
the condition where buffer size = 256 bytes, CID exists, and NAD does not. In this case, the 256 bytes ofdata would require 2 frames thus reducing the efficiency of the data transmission.
Table C.1 – Read Binary Response (when Le set to "00')st

1 Response by READ BINARY command

nd

2

PCB

CID

DATA

CRC

1

1

252

2

Response by ‘next’ of PCB (Command Chaining)
PCB

CID

DATA

SW1

SW2

CRC

1

1

4

1

1

2

* For a single Read Binary command, this block will be sent until the last byte of the data is read.

Annex C-2

e-MRP Implementation Spec. V1.2
Compared to the above, when Le is set to a data size that does not cause chaining (250 bytes), the 250
byte data can be sent in a single frame as shown in Table C.2 thus improving efficiency of the datatransmission.
Table C.2 – Read Binary Response (when Le set to "FA')
1st Response by READ BINARY command
PCB

CID

DATA

SW1

SW2

CRC

1

1

250

1

1

2

2nd Response by ‘next’ of PCB (Command Chaining)
PCB

CID

DATA

SW1

SW2

CRC

1

1

250

1

1

2

Table C.3 and C.4 shows examples of read command sequences for Data-Group2 consideringtransmission efficiency.
Table C.3 – Example Command Sequence When Using FID
CLA

INS

P1

P2

Lc

“00”

“A4”

“04”

“0C”

“07”

“00”

“A4”

“02”

“0C”

“02”

“00”

“B0”

“00”

“00”

“00”

“B0”

“00”

“00”

“B0”

“00”

“B0”

Data

Le

Notes

-

Select DF“01 02”-

Select DG2

-

-

“FA”

Read first 250 byte

“FA”

-

-

“FA”

Read next 250 byte

“01”

“F4”

-

-

“FA”

Read next 250 byte

“02”

“EE”

-

-

“FA”

:

“A0 00 00 02
47 10 01”

Table C.4 – Example Command Sequence When Using SFI
CLA

INS

P1

P2

Lc

Data

“00”

“A4”

“04”

“0C”

“07”

“00”

“B0”

“82”

“00”

-

-

“FA”

“00”

“B0”

“00”

“FA”

-

-

“FA”

Read next 250 byte

“00”

“B0”

“01”

“F4”

-

-

“FA”

Read next 250 byte

“00”

“B0”

“02”

“EE”

-

-

“FA”

:

“A0 00 00 02
47 10 01”

Le

Notes

-

Select DF
Direct Read of 250
byte

C.2.2 Basic Access Control and Secure Messaging
The command sequence complies with "Logical Data Structure (LDS) version 1.7" and "PKI for Machine
Readable Travel Documents offering ICC read only access V1.1".

Annex C-3

e-MRP Implementation Spec. V1.2
Compatibility Improvement Specifications:
The e-MRP shall support SFI to ensure compatibility.
Considerations:
It should be noted that compatibility of the upper device will be affected depending on the data size that is
set to the Le in the Read Data Group command for Secure Messaging.
Explanatory Notes:
When instructing to read with Short Le (Le = 1 byte) to perform Read Data-Group for Secure Messaging,the data size accepted by the upper device for Le is restricted according to ISO/IEC 7816-4.
Under the condition where buffer size = 256 bytes, CID exists, and NAD does not, the data transmission ismost efficient when Le is set to the data size of 231 bytes. Table C.5 shows the response when Le is set tothe data size of 231 bytes.
However, when a data size equal to or larger than 231 bytes is set to Le, depending on the interpretation of
ISO/IEC 7816-4, the expected response may vary in multiple ways.
Therefore, upper devices should set a value less than 231 bytes for Le.
Table C.5 – Read Binary Response (when Le set to "E7')st

1 Response by READ BINARY command

PCB(1)1nd2

CID(1)1

TCG(1)VCG

TSW(1)

TCC(1)

LCG(2)

Encrypted

LSW(1)

LCC(1)PI(1)Data(232)

VSW(2)

VCC(8)

4

232

4

10

TCG(1)VCG

TSW(1)

TCC(1)

LCG(2)

Encrypted

LSW(1)

LCC(1)PI(1)Data(232)

VSW(2)

VCC(8)

4

232

4

10

SW1(1)
SW2(1)
2

CRC(2)
2

Response by READ BINARY command

PCB(1)
1

CID(1)1

SW1(1)
SW2(1)
2

CRC(2)
2* Encrypted Data consist of the specified DATA (231) and an additional Padding (1), and is encrypted.
* Padding consist of a single byte that must be added to the DATA and has the value of "80" plus additional"00" bytes so that the sum of the number of bytes are a multiple of 8. (If DATA is a multiple of 8, "80 00 00
00 00 00 00 00" [8 bytes] would be added).
* LCG is 2 bytes if Encrypted Data exceeds 127 bytes, and 3 bytes if it exceeds 255 bytes.
On the other hand, when using Extended Le, there are no restrictions like the above, a single frame cantransmit 252 bytes of data, transmission efficiency improves.
Table C.6 shows the responses when the data size is set to 256 bytes or more using Extended Le under
the condition where buffer size = 256 bytes, CID exists, and NAD does not.
Annex C-4

e-MRP Implementation Spec. V1.2

Table C.6 – Read Binary Response (when Le set to "E7')
1st Response by READ BINARY command

PCB(1)
1

CID(1)

TCG(1)VCG

LCG(3)

Encrypted

PI(1)Data(247)

5

247

1

CRC(2)
2

2nd Response by ‘next’ of PCB (Command Chaining)
VCG
PCB(1)

CID(1)

Encrypted

CRC(2)

Data(252)
1

1

252

2

* The above block is returned as response until the last byte of the Data is read.
Last Response by READ BINARY command (Command Chaining)

PCB(1)
1

CID(1)1

VCG

TSW(1)

TCC(1)

Encrypted

LSW(1)

LCC(1)

Data(xxx)

VSW(2)

VCC(8)xxx

4

10

SW1(1)
SW2(1)
2

CRC(2)
2

C.2.3 Odd INS (B1) Read Binary
The command specification of Odd INS (B1) Read Binary complies with "Logical Data Structure (LDS)
version 1.7" and "Supplement to Doc9303-epassports Ver2005-4V3.0".
Considerations:
From past ICAO interoperability test results, it was found that three different interpretations in theimplementation of Read Binary with Odd INS Byte exist. Therefore, it is desirable for upper devices tosupport the following three types.
1) The Le byte includes only V
2) The Le byte includes TL and V (where L is coding by Simple-TLV)
3) The Le byte includes an extended TL and V (where L is coding by BER-TLV)

Annex C-5

e-MRP Implementation Spec. V1.2

C.3 Examples of Basic Access Control Availability Assessment Sequences
C.3.1 Example of BAC Support Availability Assessment Sequence
The sequence to determine whether or not BAC is supported by an e-MRP complies with "Supplement toDoc9303-epassports Ver2005-4V3.0".
C.3.2 Example of Extended Le Support Availability Assessment Sequence
Explanatory Notes:
The upper device should be capable of determining whether or not BAC is supported by the e-MRPs fromthe various nations, as well as determining whether or not Extended Le is supported.
Actually, it is possible to determine whether or not Extended Le is supported by an e-MRP by reading thefirst two bytes of the DATA stored in EF.COM.
An example of an assessment sequence is shown below.
1) Perform BAC processing.
2) With Extended Le (Le = "00 00 02"), read the header portion of EF.COM.
3) Depending on the response from the e-MRP, determine as follows:* If SW = "9000" and the returned response data length is 2 bytes, it can be said that the e-MRP has
processed the Extended Le correctly.
* If SW = "9000" and the returned response data length is NOT 2bytes, it can be said that the e-MRP has
NOT processed the Extended Le correctly.
* If the response is other than the above two, decide that e-MPR does not support Extended Le and after
performing BAC processing again, read the header portion of EF.COM with Short Le (Le = "02").
Figure C.2 presents a process flow diagram of the above.

Annex C-6

e-MRP Implementation Spec. V1.2

GET CHALLENGE
MUTUAL AUTHENTICATEREAD BINARY with
Le=00 00 02

OthersPerform BAC

READ EF.COM header
with Le=3 bytes

Check SW&
response length
SW =9000 &Data length = 2

Le=3 supported =false
GET CHALLENGE
MUTUAL AUTHENTICATE

Le=3 supported =true

Perform BAC

READ EF.COM header
with Le=1 byte

OthersCheck SW
SW =9000

Error handling

READ EF.COM

Figure C.2 –Extended Le Assessment Process Flow Diagram

Annex C-7

e-MRP Implementation Spec. V1.2

Annex De-MRP – PCD Command Interface Compatibility Tests(Informative)

This informative document describes the interoperability test procedures of cross tests between biometrice-Passports (hereunder referred to as "e-MRP") and PCDs to test the e-MRP command interface of an eMRP system.

Table of Contents
Abbreviations and Symbols ........................................................................................................... Annex D-2
D.1 Test Target e-MRPs and PCDs .............................................................................................. Annex D-2
D.1.1 Test Target e-MRP........................................................................................................... Annex D-3
D.1.2 Test Target PCD .............................................................................................................. Annex D-3
D.2 Compatibility Test Methods..................................................................................................... Annex D-3
D.2.1 List of Tests ...................................................................................................................... Annex D-3
D.2.2 Tests Combinations.......................................................................................................... Annex D-5
D.2.3 Testing Points and Direction of e-MRP ............................................................................ Annex D-5
D.2.4 Test Contents and Pass-Fail Criteria................................................................................ Annex D-6
D.2.5 Data Set ........................................................................................................................... Annex D-7
D.2.6 Test Processing Flows (Examples) .................................................................................. Annex D-7

Annex D-1

e-MRP Implementation Spec. V1.2

Abbreviations and Symbols
The abbreviations and symbols used in this Specification are as follows.
AA

Active Authentication

BAC

Basic Access Control

SOD

Document Security Object

PA

Passive Authentication

DG1

Data group 1 stored in e-MRP (MRZ information)

DG2

Data group 2 stored in e-MRP (Facial and other image information)

DG15

Data group 15 stored in e-MRP (Public key information for AA)

MRZ (Machine Readable Zone) information
Personal information and passport information of e-MRP owner written on thee-MRP
Referenced Standards:[1] ICAO"MACHINE READABLE TRAVEL DOCUMENTDEVELOPMENT OF A LOGICAL DATA STRUCTURE For OPTIONAL CAPACITY EXPANSIONTECHNOLOGIES" Ver1.7 (May 18, 2004)[2] ICAO"MACHINE READABLE TRAVEL DOCUMENT

PKI for Machine Readable Travel Documents offering ICC Read-Only Access"Ver1.1 (October 1, 2004)

D.1 Test Target e-MRPs and PCDs
The test target e-MRPs and PCDs shall satisfy the common conditions described below.
This test focuses on testing the interoperability of the command interface and is not for the purpose of
performance tests (see chapter 9 of this Specification) or initial response compatibility tests (see "T1 Test"of this Specification [Informative]) of individual e-MRPs or PCDs. e-MRPs and PCD that have passed theunit tests and initial response compatibility tests shall selected as test target e-MRPs and PCDs for thisTest. (See figure below.)
STEP 2

STEP 1
Unit Test

Pass

Initial Response
Compatibility Test

STEP 3 (this test)
Pass

Cross Test ofCommand Interface

Wave characteristic tests
using 10373-6 verification
tools
Figure D.1 – Conditions that Test Target e-MRPs and PCDs Must Satisfy
Annex D-2

e-MRP Implementation Spec. V1.2
D.1.1 Test Target e-MRP
The e-MRP must comply with this Specification. (Major specifications are shown below.)–

Supports Type A or Type B (complying with ISO/IEC 14443-1 – ISO/IEC 14443-4).

–

Supports a quadruple communication speed (424 kbps) from PCD to e-MRP or vice-versa.

–

PA (SOD Structure Verification) processing is possible.

–

e-MRPs capable of processing BAC can undergo Basic Access Control tests.

–

e-MRPs capable of AA can undergo Active Authentication tests.

–

Arbitrary data can be stored in an e-MRP. (examples of data sets shall refer to reference standards [1]and [2].)–

Data structure within the test target e-MPR shall refer to reference standards [1] and [2].

The e-MRP shall implement the following commands.
–

Initial response command–

SELECT FILE command–

READ BINARY command–

GET CHALLENGE command (for Basic Access Control test targets only)–

Mutual Authenticate (Mutual Auth) command (for Basic Access Control test targets only)–Internal Authenticate command (for Active Authentication test targets only)

D.1.2 Test Target PCD
The PCD must comply with this Specification. (Major specifications are shown below.)–

Open type PCD.

–

Supports Type A or Type B (complying with ISO/IEC 14443-1 – ISO/IEC 14443-4).

–

Supports a quadruple communication speed (424 kbps) from PCD to e-MRP or vice-versa.

D.2 Compatibility Test Methods
D.2.1 List of Tests
Below is a list of tests to be performed for this test.
Table D.1 – List of Tests

Annex D-3

e-MRP Implementation Spec. V1.2
Test
Test NameNo.

Details

T3

SOD Structure
Verification Test

T4

BAC +
SOD Structure
Verification Test

T3AA

SOD Structure
Verification Test +
AA

T4AA

BAC +
SOD Structure
Verification Test +
AA

Note

Performs SOD structure verification
processing and verifies that information
stored on the e-MRP can be read. Also
measure processing time for reference.
Perform BAC processing, create session
key and share. Using this session key,
verify that information stored on the e-MRP
can be read by performing SOD structure
verification processing under secure
messaging processing. Also measureprocessing time for reference.
In addition to the T3 Test, perform AA
processing to verify that the AA processing
feature is correctly implemented on the eMRP.
In addition to the T4 Test, perform AA
processing to verify that the AA processing
feature is correctly implemented on the eMRP.

Only for e-MRPs
without BAC
processing features.

Only for e-MRPs with
BAC processing
features.
For e-MRPs without
BAC processing
features but with AA
processing features.
For e-MRPs with BAC
processing features aswell as AA processing
features.

START

T1/T2 Test(1)End

T1/T2 Test(1)

Fail

Pass
BAC Function

Yes

No
AA Function

No
T3 TestAA Function

No

Yes

T4 TestT4AA Test

Yes
T3AA Test

END(1)

T1, T2 Tests: Refer to Chapter 4 of this Specification (Informative).
Figure D.2 – Entire Flow of the Test

Annex D-4

e-MRP Implementation Spec. V1.2
D.2.2 Tests Combinations
D.2.2.1 Combinations of e-MRPs and PCDs–

A single test target PCD shall be tested by applying e-MRPs one by one.

–

Tests shall be performed on one PCD per PCD type. (Variance among the same type of PCD is nottested.)–e-MRPs used for the test shall be one piece per e-MRP type. (Variance among the same type of eMRP is not tested.)
Table D.1 – List of Tests
Test

Combination of Test Target
PCD and e-MRP

Notes

All combinations that havepassed T1/T2 shall be tested.

Only for e-MRPs without
BAC processing features.

All combinations that havepassed T1/T2 shall be tested.

Only for e-MRPs with BAC
processing features.

T3AA

SOD Structure
Verification Test +AA

All combinations that havepassed T1/T2 shall be tested.

For e-MRPs without BAC
processing features butwith AA processing
features.

T4AA

BAC +
SOD Structure
Verification Test +AA

All combinations that havepassed T1/T2 shall be tested.

For e-MRPs with BAC
processing features as well
as AA processing features.

No.
T3
T4

Test NameSOD Structure
Verification TestBAC +SOD Structure
Verification Test

D.2.3 Testing Points and Direction of e-MRP
D.2.3.1 Testing Point
The testing point shall be determined with consideration to the operating conditions of the applied e-MRP
system.
Examples of testing points are shown below.
Considering a cylinder with its center axis concentric with the center of the PCD at "o", a total of 10 testing
points (shown with a black filled circle) shall be selected at the center points and at each intersection pointof the X axis and Y axis with the surface of the cylinder. The center point, X axis, Y axis, and Z axis
positions shall be determined at test time. However, the standard Z axis testing position shall be 20 mm.

Annex D-5

e-MRP Implementation Spec. V1.2
(0,0,20)(0,10, 20)z(-10,0, 20)(10,0,20)(0,−10, 20)(0,0,0)y(0,10, 0)xO(-10,0,0)(0,−10, 0)(10,0,0)

PCD
Coordinates are shownin ( ) [unit: mm]

Figure D.3 – Testing Points (Informative)

D.2.3.2 Direction of e-MRP
The position specified by the PCD vendor shall be used as the standard e-MRP direction. Otherwise thedirections shall refer to the following:
When viewing the PCD directly from above, the long edge of the e-MRP shall be parallel with the X axis.

PCD

e-MRP (ID-3 size)
Antenna (ID-1 size)

Figure D.4 – Direction of e-MRP (Informative)
D.2.4 Test Contents and Pass-Fail Criteria
D.2.4.1 Test Contents
D.2.4.1.1 T3 Tests–

SOD read and SOD verification processing of information stored on the e-MRP, which are part of the
PA process of the e-MRP shall be verified.

–Tests shall be performed on e-MRPs that have passed T1/T2 tests and do not have BAC features.

–

e-MRPs with AA features shall be tested with the T3AA Test.

–

Each test target e-MRP shall store data that is defined for each test.

–

In order to estimate the processing time for actual operations, the total processing time shall bemeasured for reference and the facial data size of DG2 shall be described.

Annex D-6

e-MRP Implementation Spec. V1.2–

The commands and internal processing procedures shall comply with the referred standards [1] and[2].

–

The standard procedure shall be to test the target e-MRP multiple times for each and all testing points,
in all specified directions. The number of times to test shall be determined at each testing occasion(three times or more is desirable). The pass criteria would be to pass every attempt. If results are
unstable, review and fix the problematic area, and then aim to pass the tests multiple times.

D.2.4.1.2 T4 Tests–

A session key for secure messaging shall be created according to the BAC procedure. Under secure
messaging, SOD structure verification processing shall be performed in the same manner as T3 Tests,
and whether information can be read from the e-MRP shall be verified.

–

Test shall be performed on e-MRPs that have passed T1/T2 Tests and have BAC features.

–

e-MRPs with AA features shall be tested with the T4AA Test.

–

Each test target e-MRP shall store multiple types of data that is defined for each test.

–

In order to estimate the processing time for actual operations, the total processing time (of T4 andT4AA Tests) shall be measured for reference and the facial data size of DG2 shall be described.

–

The commands and internal processing procedures shall comply with the referred standards [1] and[2].

–

The standard procedure shall be to test the target e-MRP multiple times for each and all testing points,
in all specified directions. The number of times to test shall be determined at each testing occasion(three times or more is desirable). The pass criteria would be to pass every attempt. If results are
unstable, review and fix the problematic area, and then aim to pass the tests multiple times.

D.2.5 Data Set
Data sets are sets of data that shall be written into the internal files of the test target e-MRPs before
performing tests and may have anything written in accordance with the referred standards [1] and [2].
D.2.6 Test Processing Flows (Examples)
D.2.6.1 Entire Test Processing Flow
The following shows the entire test processing flow for reference.

Annex D-7

e-MRP Implementation Spec. V1.2
START

Place e-MRP
T1 TestNO

T1 Passed ?
YES
T2 TestNO

Move to next point

All points
Measured?

YESNO

Next specified direction

All
Directions?

YES
T1/T2
Test Passed ?

NO

YES
NO

BAC Feature

YES
AA Feature

AA Feature

YES

NO
T3 TestYES

NO
T3AA Test

YES

T4 TestT4AA Test

Next

e-MRP
NO
STOP

Figure D.5 – Entire Test Processing Flow

Annex D-8

e-MRP Implementation Spec. V1.2
D.2.6.2 T3 Test Processing Flow

BEGIN

2

1

REQ Command to
ActivationOKNG

DG2 HASH

SELECT FILE (DF)DG2 hash val
And Hash val in
SOD match?

SELECT FILE (COM)

YES
READ BINARY (COM)

Success

SELECT FILE (SOD)

FailREAD BINARY (SOD)
RF OFFSOD Signature Verify

SOD Sig
Verify OK？

END

YES
SELECT FILE (DG1)READ BINARY (DG1)NG
OK

DG1 HASH

DG1 hash val
And Hash val in
SOD match?

YES
SELECT FILE (DG2)READ BINARY (DG2)

12

Figure D.6 – T3 Test Processing Flow

Annex D-9

e-MRP Implementation Spec. V1.2
D.2.6.3 T4 Test Processing Flow

BEGIN

Read MRZ Info
Generate Kenc / KmacREQ Command to
Activation
OK

2

1

SELECT FILE (DG1)NG
READ BINARY (DG1)

SELECT FILE (DF)DG1 HASH

Get Challenge
DG1 hash Val
Hash Val in
SOD Match?

Generate 8B rand (RndIfd)/ 16B
rand (Kifd), MAC processing

YES
SecureMessaging

SELECT FILE (DG2)
Mutual Authenticate
READ BINARY (DG2)
Generate session key(Kｓenc / KSmac)

SecureMessaging

DG2 HASH

SELECT FILE (COM)DG2 hash Val
Hash Val in
SOD Match?

READ BINARY (COM)YES
Success

SELECT FILE (SOD)

FailREAD BINARY (SOD)
RF OFFSOD Sig verify

SOD Sig

END

Verify OK?

YES
1

NG

2

Figure D.7 – T4 Test Processing Flow

Annex D-10

OK

e-MRP Implementation Spec. V1.2
D.2.6.4 T3AA Test Processing Flow
2

1

BEGIN

REQ Command to
ActivationOKNG
DG2 HASH

SELECT FILE (DF)SELECT FILE (COM)DG2 hash Val
Hash Val in
SOD Match?

READ BINARY (COM)

SELECT FILE (DG15)YES

SELECT FILE (SOD)

READ BINARY (DG15)

READ BINARY (SOD)

DG15 HASHSOD Sig Verify
DG15 hash Val
Hash Val in
SOD Match?
SOD Sig
Verify OK?
Generate 8B random num.

YES
SELECT FILE (DG1)

INTERNAL AUTH.
READ BINARY (DG1)

Auth code
match?

DG1 HASH

YES
DG1 hash Val
Hash Val in
SOD Match?

Fail

Success

YES
SELECT FILE (DG2)
RF OFF
READ BINARY (DG2)

NG
1

2

END

Figure D.8 – T3AA Test Processing Flow

Annex D-11

OK

e-MRP Implementation Spec. V1.2
D.2.6.5 T4AA Test Processing Flow
BEGIN

Read MRZ Info
Generate Kenc / KmacREQ Command to
Activation
OK

2

1

DG1 hash Val
Hash Val in
SOD Match?

YES

NG

SELECT FILE (DG2)

SELECT FILE (DF)READ BINARY (DG2)
Get Challenge
DG2 HASH
Generate 8B rand (RndIfd) / 16B
rand (Kifd), MAC processing

DG2 hash Val
Hash Val in
SOD Match?

Mutual Authenticate

YES
SELECT FILE (DG15)

Generate session key(Kｓenc / KSmac)READ BINARY (DG15)
SecureMessaging

SELECT FILE (COM)
DG15 HASHREAD BINARY (COM)
DG15 hash Val
Hash Val in
SOD Match?

SELECT FILE (SOD)

YESREAD BINARY (SOD)

Generate 8B random num.

SOD Sig Verify

INTERNAL AUTHSOD Sig
Verify OK?

Auth code
Match ?

YES

SecureMessaging

YES

SELECT FILE (DG1)

Fail

Success
READ BINARY (DG1)
DG1 HASH

RF OFF

NG
1

2

END

Figure D.9 – T4AA Test Processing Flow
Annex D-12

OK