HYBRID IC

VLA500K-11R
DRIVER FOR IGBT MODULESDESCRIPTION
VLA500K-01R is a hybrid integrated circuit designed for driving

OUTLINE DRAWING

n-channel IGBT modules in any gate-amplifier application.

Dimensions: mmElectrical isolation voltage between input and output is 4000Vrms
83.0 MAX(for 1minute).This device include the isolated type DC-DC
converter for a Gate drive. Therefore design of the gate power

33.0MAXsupply is not required.
The system of built-in short circuit protection provide a margin
to time by function to maintain reverse bias for a predeterminedtime after the detection of short circuit.
Recommended IGBT modules:
VCES = 600V series up to 600A class
VCES = 1200V series up to 1400A class
VCES = 1700V series up to 1000A class

5.0MAX

5.0 MAXFEATURES

11.5MAX

5.0MAX

2.54

17.0MAX

130•Built-in the isolated type DC-DC converter for gate drive•SIP outline allows more space on mounting area
•Built-in short circuit protection (With fault output)•Variable fall time on activity of short circuit protection•Electrical isolation voltage between input and output is 4000Vrms (for 1minute)•Input can be driven by HCMOS.

APPLICATIONS
To drive IGBT modules for a general industrial use apparatus.

BLOCK DIAGRAM
19 Vcc

1VD

2
DC－AC

REGULATORLATCHCONVERTER

Gittrip

DETECT

29

CIRCUIT

30 DETECTPIN

CONTROL PIN

3420
TIMER&RESETCIRCUIT

VI + 625
26 COLLECTOR

23

INTERFACE

GND

Vo

24
GATE SHUTDOWN CIRCUIT

240 ohm

VI -7⑤、⑰、⑱：N.C.

27

SHUT-DOWNSPEED
CONTROL28

FAULT
OUTPUT

21VEE

22Apr. 2023

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HYBRID IC

VLA500K-11R
DRIVER FOR IGBT MODULES

MAXIMUM RATINGS (Unless otherwise noted, Ta=25°C)
SymbolRatings

Unit

VD

Supply voltage

DC-1 ~ 16.5

VVI

Input signal voltage

Applied between pin 6 – 7
50% duty cycle, pulse width 1ms-1 ~ +7VVO

Output voltage

When the output voltage is “H”

V

Output current

Pulse width 2µs

VCC
-12

Viso

Isolation voltage

T C1

IOHP
IOLP

Parameter

Conditions

A12A

Sine wave voltage 60Hz, for 1min. , R.H.<60%

4000

Vrms

Case temperature1

Surface temperature(opto-coupler mounting part) (*3)

85°C

T C2

Case temperature2

Surface temperature(excepting opto-coupler mounting part)

100°C

Topr

Operating temperature

No condensation allowable-25 ~ +60°C

Tstg

Storage temperature-25 ~ +100 (*1)

°C

IFO

Fault output current

No condensation allowable
Applied pin 28

20mA

VR30

Input voltage to pin 30

Applied pin 30

50V

210 (*2)mA

Gate drive current
Gate average current
Idrive(*1) Differs from H/C condition(*2) Refer to Idrive-Ta CHARACTERISTICS.
(*3) Refer to the below figure.
Tc1 measurement point(opto-coupler mounting part)Marking side

ELECTRICAL CHARACTERISTICS (Unless otherwise noted, Ta=25°C, VD=15V, RG=2.2 ohm)
SymbolParameterConditions

LimitsTyp15Max
15.8

Unit

VD

Supply voltage

Recommended range

Min
14.2

VIN

Pull-up voltage on input side

Recommended range

4.75

55.25

V

IIH
ｆ

“H” input current

Recommended range

101216mA

Switching frequency

Recommended range--20kHz

RG

Gate resistance

Recommended range

1--ohmIIH“H” input current

VIN = 5V-12-mAV

Vcc

Gate positive supply voltage―15.2-

17.5VVEEGate negative supply voltage―-6--11.5

VEta

Gate supply efficiency

Load current = 210mA
Eta = (Vcc+lVEE l) x 0.21 / (15 x ID) x 100

6075-%VOH“H” output voltage

10k ohm connected between pin 23-20

1415.3

16.5

V

VOL

“L” output voltage

10k ohm connected between pin 23-20-5.5--11VtPLH“L-H” propagation time

IIH = 12mA

0.3-

1µs

tr

“L-H” rise time

IIH = 12mA-0.3

1µs

tPHL

“H-L” propagation time

IIH = 12mA

0.2-1µstf“H-L” fall time

-

0.31-

12

ms

µs

ttimerTimer

IIH = 12mA
Between start and cancel (under input sign “L”)

IFO

Fault output current

Applied pin 28, R = 4.7k ohm-5-mA

ttrip1

Controlled time detect short circuit 1

Pin 30 : 15V and more,

-

2.8-

µs

ttrip2Controlled time detect short circuit 2(*4)

Pin 30 : 15V and more, pin 29-21,22 : 10pF
(connective capacitance)

-

3.2-

µsVSCSC detect voltage

Collector voltage of module15--Vpin 29 : open(*4) Length of wiring of condenser controlled time detect short-circuit is within 5cm from pin 21,22 and 29 coming and going.

2HYBRID IC

VLA500K-11R
DRIVER FOR IGBT MODULESPERFORMANCE CURVES

VCC,|VEE|-IO CHARACTERISTICS（TYPICAL）

VCC、|VEE|-Ta CHARACTERISTICS（TYPICAL）

24242020

VCC

181616

VD=14.2V

14141212

VD=15.8V

10108664020

4060

VD=14.2V

0.00

80

0.05

0.20

0.25

96.0

VD=15V
VD=15V
Ta=25℃
Ta=25℃

8CONTROLLED TIME DETECTSHORT CIRCUIT ttrip(μs)(μs)

VD=15V
VD=15V
RG=1Ω
RG=1Ω
Load:C=0.47uF

Load：C=0.47uF

4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0-200.15

ｔｔｒｉｐ－Ｃｔｒｉｐ CHARACTERISTICS（TYPICAL）

ｔｔｒｉｐ - Ｔａ CHARACTERISTICS（TYPICAL）

5.0

0.10

LOAD CURRENT IO(A)（Pin：１９－２１、２２）

AMBIENT TEMPERATURE Ta(℃)

5.5

VD=15V

8

|VEE|

-20

CONTROLLED TIME DETECTSHORT CIRCUIT ｔｔｒｉｐ1,ｔｔｒｉｐ２（μｓ）(μs)

VD=15V

VD=15.8V

18

VCC、|VEE|(V)22

VCC、|VEE|(V)

Ta=25℃
DC Load22
VD=15VRG=1ΩΩ
Load：C=0.47uF
f=10KHz D.F.=50%7654321000204060
AMBIENT TEMPERATURE Ｔａ（℃）

80255075100125

CONNECTIVE CAPACITANCE Ｃｔｒｉｐ（ｐＦ）（Pin:２９－２１）

3HYBRID IC

VLA500K-11R
DRIVER FOR IGBT MODULES

VOH,|VOL|-Ta CHARACTERISTICS（TYPICAL）

ID-IO CHARACTERISTICS（TYPICAL）

0.522
VD=15V
Ta=25℃“H” OUTPUT VOLTAGE VOH(V)“L” OUTPUT VOLTAGE |VOL|(V)INPUT CURRENT ID(A)

0.60.40.30.2

0.1

00.00

18VOH

16141210|VOL|8640.05

0.10

0.15

0.20

0.25

-20020406080

LOAD CURRENT Io(A)(Pin：１９－２１、２２)

AMBIENT TEMPERATURE Ta(℃)ηη-Idrive
CHARACTERISTICS（TYPICAL）

VCC、|VEE|-VD CHARACTERISTICS（TYPICAL）

2080
70

VD=15V
RG=1ΩΩ
Load：C=0.47uF

20

VD=15V
Ta=25℃

Io=0.1A
Ta=25℃

18

VCC

60

14

VCC、|VEE|(V)EFFICIENCY ηη（％）

1650

1240

1030

|VEE|

8620

410200.00

0.05

0.10

0.15

0.20

00.25

14.0

GATE DRIVE CURRENT Idrive(A)

14.5

15.0750.25RG=1ΩΩ
Load：C=0.47uF

7015V

ηEFFICIENCY η（％）

GATE DRIVE CURRENT Idrive(A)

16.0

16.5

17.0

η-Vη D CHARACTERISTICS（TYPICAL）

Idrive-Ta CHARACTERISTICS（MAXIMUM RATING）

0.20

15.5

SUPPLY VOLTAGE VD(V)

0.15
16.5V
0.10

Io=0.1A
Ta=25℃

6560
55
50

0.05
4540
14.0

0.00
02040

60

80

14.5

15.0

15.5

16.0

16.5

SUPPLY VOLTAGE VD(V)AMBIENT TEMPERATURE Ta（℃）

417.0

HYBRID IC

VLA500K-11R
DRIVER FOR IGBT MODULES

DEFINITION OF CHARACTERISTICS(1)SWITCHING OPERATION(2)OPERATION OF SHORT CIRCUIT PROTECTION

VI
VI 0V

VOtrtf

VO 0V-5V

90%ttrip1,2ttimer

50%

10V0V

tPHL

tPLH

10V

Pin 28 output

10%

APPLICATION EXAMPLE
D130123

2C124＋

Dz2

VD

Dz3

19

3

CM1000DU-34NF etc.

RG

25
4

VLA500K

2620

CMOS etc.

＋

6Control signal→＋ C2

21

C3Dz1

227Ctrip

2927

Cs

3.3k ohm

28
EXAMPLE OF INPUT CIRCUIT

VIN

4.7k ohm
6pin
HC04 etc.

VD=15V +/-5%
VIN=5V +/-5%
C1 : 100uF (Low impedance)
C2 : 1mF (Low impedance)
C3 : 1mF (Low impedance)
Ctrip : Depend on RG
Cs : Depend on surge voltage
Dz1 : 30V
Dz2,3 : 18V
D1 : Fast recovery diode (trr : 300ns Max)
RGP02-20E(VISHAY) etc.

PRECAUTION(1)Voltage compensate capacitors are expected to be located as close as possible to the Hybrid IC.

(2)

Minimize the area of closed circuit of gate circuit so as not to be affected by induction noise.

(3)

D1 requires approximately the same voltage of power modules.

(4)

When recovery current flow in D1 , pin 30 is applied high voltage .
In that case , counterplan for protection which insert a zener diode between pin21,22 and 30 are necessary like above diagram.

(5)

When you make late speed of reverse bias at the time of short circuit protection operation,please adjust and connect a capacitor between the 21,22 and 27.

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HYBRID IC

VLA500K-11R
DRIVER FOR IGBT MODULES

OPERATION OF PROTECTION CIRCUIT
(1)

(2)

ADJUSTMENT OF OUTPUT FALL TIME

In case the gate voltage is “H” and the collector voltage is high,(When the protection circuit is operating)this Hybrid IC will recognize the circuit as short circuit and immediately

In case you want to decrease the speed of reverse bias when thereduce the gate voltage . Besides, put out a fault sign (“L”) which

protection circuit is operating, you can adjust that speed by connecting

inform that protection circuit is operating at the same time from pin 28 .

the capacitor (Cs) between pin 21,22 and 27.

The protection circuit reset and resorted to ordinary condition if input(Please refer to under figures. )sign is “L” when the predetermined time(1 ~ 2ms) passed.
(“L” period needs 15us or more )
(3)

INPUT
SIGNAL

When the output rises, the controlled time detect short circuit(Typ 2.8us) is set up so that on-time of IGBT can be secured properly.

t2

t1

It is possible to adjust that time by connecting the capacitor (Ctrip)
between pin 21,22 and 29.

90%
50%

OPERATION FLOW ON DETECTING SHORT CIRCUIT
0%10%VoSTART

FALL TIME ON ACTIVITY OF SHORT CIRCUITPROTECTION t1. t2 (us)t1,t2 VS. Cs CHARACTERISTICS
DETECTION OFSHORT CIRCUITGATE SHUTDOWNCIRCUIT OPERATETIMER STARTOUTPUT FAULT SIGNEND OF TIMER

1 ~ 2msNO(TYPICAL)

5045

VD=15V

40Ta=25deg

35t23025201510t1500CONNECTIVE CAPACITANCE Cs (pF)
(PIN:27-21)

YES

INPUT SIGN IS “L”

100 200 300 400 500 600 700 800

NOYES
RESET

Note : “L” output voltage with protection circuit operating is about VEE + 2V.

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HYBRID IC

VLA500K-11R
DRIVER FOR IGBT MODULESFOR SAFETY USINGGreat detail and careful attention are given to the production activity of Hics, such as the development, the quality of production, andin it’s reliability. However the reliability of Hics depends not only on their own factors but also in their condition of usage. Whenhandling Hics, please note the following cautions.

CAUTIONS

Packing

Carrying

The materials used in packing Hics can only withstand normal external conditions.
When exposed to outside shocks, rain and certain environmental contaminators, the packing materials
will deteriorates. Please take care in handling.
1)
2)
3)
4)
5)

Don’t stack boxes too high. Avoid placing heavy materials on boxes.
Boxes must be positioned correctly during transportation to avoid breakage.
Don't throw or drop boxes.
Keep boxes dry. Avoid rain or snow.
Minimal vibration and shock during transportation is desirable.

Storage

When storing Hics, please observe the following notices or possible deterioration of their electricalcharacteristics, risk of solder ability, and external damage may occur.
1) Devices must be stored where fluctuation of temperature and humidity is minimal, and must not
be exposed to direct sunlight. Store at the normal temperature of 5 to 30 degrees Celsius withhumidity at 40 to 60%.
2) Avoid locations where corrosive gasses are generated or where much dust accumulates.
3) Storage cases must be static proof.
4) Avoid putting weight on boxes.

Extended storage

When extended storage is necessary, Hics must be kept non-processed. When using Hics whichhave been stored for more than one year or under severe conditions, be sure to check that the exterior
is free from flaw and other damages.

Maximum ratings

To prevent any electrical damages, use Hics within the maximum ratings. The temperature, current,voltage, etc. must not exceed these conditions.

Polarity

To protect Hics from destruction and deterioration due to wrong insertion, make sure of polarity ininserting leads into the board holes, conforming to the external view for the terminal arrangement.

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HYBRID IC

VLA500K-11R
DRIVER FOR IGBT MODULES

Keep safety first in your circuit designs!
·ISAHAYA Electronics Corporation puts the maximum effort into making semiconductor products better and more reliable, butthere is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire orproperty damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures
such as (1) placement of substitutive, auxiliary circuits, (2) use of non-flammable material or (3) prevention against any
malfunction or mishap.
Notes regarding these materials·These materials are intended as a reference to our customers in the selection of the ISAHAYA products best suited to thecustomer’s application; they don't convey any license under any intellectual property rights, or any other rights, belonging toISAHAYA or a third party.
·ISAHAYA Electronics Corporation assumes no responsibility for any damage, or infringement of any third party's rights,originating in the use of any product data, diagrams, charts or circuit application examples contained in these materials.
·All information contained in these materials, including product data, diagrams and charts, represent information on products
at the time of publication of these materials, and are subject to change by ISAHAYA Electronics Corporation without notice
due to product improvements or other reasons. It is therefore recommended that customers contact ISAHAYA Electronics
Corporation or an authorized ISAHAYA products distributor for the latest product information before purchasing product listedherein.
·ISAHAYA Electronics Corporation products are not designed or manufactured for use in a device or system that is used
under circumstances in which human life is potentially at stake. Please contact ISAHAYA Electronics Corporation or anauthorized ISAHAYA products distributor when considering the use of a product contained herein for any specific purposes, suchas apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
·The prior written approval of ISAHAYA Electronics Corporation is necessary to reprint or reproduce in whole or in part thesematerials.
·If these products or technologies are subject to the Japanese export control restrictions, they must be exported under alicense from the Japanese government and cannot be imported into a country other than the approved destination.
Any diversion or re-export contrary to the export control laws and regulations of Japan and/or the country of destination isprohibited.
·Please contact ISAHAYA Electronics Corporation or authorized ISAHAYA products distributor for further details on thesematerials or the products contained therein.

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