Index

Company Introduction

SSD Solutions

About Transcend

01

Product Highlights

22

USB Flash Drives

46

Our Strengths

02112-Layer 3D NAND Flash23

47

Applications

03

USB Flash Modules &eMMC

96-Layer 3D NAND Flash31

Solutions & Technologies

04

MLC NAND Flash34

Software Solutions

06

DRAM Modules

Flash Solutions

About Factory
Manufacturing Base

Memory Cards

Product Highlights

10

SD Cards

40

DDR5 DIMMs

11

microSD Cards

41

DDR4 DIMMs

13

CompactFlash Cards &CFast Cards

43

DDR3 DIMMs

16

48

AboutTranscend
30+ Years of Experience
Founded in 1989, Transcend Information Inc. is a leading global supplier of
embedded memory products and storage solutions. Transcend has been
granted over 140 patents for our award-winning products, developed by
our in-house R&D team in close cooperation with our strategic component
suppliers.

Global Support
Transcend operates 11 branch offices worldwide, including in Los Angeles,
Maryland, Hamburg, Rotterdam, London, Tokyo, Seoul, Shanghai, Beijing,
Shenzhen, and Hong Kong. Our headquarters and manufacturing site areboth located in Taipei, creating an optimum product supply system witha global reach.

Stability & Reliability
Transcend utilizes selected components from 1st tier suppliers, andleverages advanced technologies such as Corner Bond, Anti-sulfur, Wide
Temperature, SLC Mode, etc., to ensure reinforced structure, superior
durability, and longer product use life under demanding industrial
applications.

| About Transcend | 1

Our Strengths
Transcend's embedded storage solutions include SSDs, DRAM modules, memory cards, USB flash drives,and more, all designed to deliver advanced memory and storage technology. Our products can be found in
applications across various industries, such as enterprise data servers, automotive, automated manufacturing,
5G networks, AIoT, healthcare, surveillance, and smart retail.

Top Quality Storage
Solutions• Branded chips to ensure the highest quality• Exclusive software for efficient device management

R&D Expertise• More than 140 patents• 100+ person in-house R&D team
• Extensive embedded product development experience

Facilities & Production
Process• Highly automated production• Rigorous reliability and environmental testing• Stringent quality control: IQC, IPQC, FQC, OQC

Reliable Supply• Strategic alliance and direct relationship with
top-tier suppliers

Management of Product
Life Cycle

Global Operation &Worldwide Support• Embedded-grade product lifecycle management• Fixed BOM management• In-house ERP system• Regular roadmap updates• Professional technical support and failure
analysis reports• 11 branch offices worldwide• Localized sales and FAE support

2 | Our Strengths |Applications
Transcend's embedded solutions are utilized across various industries.

Transportation

Network & Telecom

Fleet Management | Event Recorders | Navigation

Industrial Switches | 5G Base Stations | Network Security
Appliances

Healthcare
Medical Tablets & AIO PCs | Medical Imaging |Embedded Computing

Patient Monitoring

Digital Signage | Fanless PCs | Embedded PCs

GamingCasino Gaming | Lottery | Player Tracking

AIoT
Edge Computing | AI Platforms

Automation

DefenseRobot Controllers | Human Machine Interfaces

Rugged Laptops & Tablets | Rugged Rackmount Devices| Applications | 3

Solutions & Technologies
Transcend utilizes various technologies to optimize the durability, reliability, and stability of our memory andstorage devices. We can also provide customized services to adapt our products to your requirements.

DURABILITY
112-layer 3D NAND Flash
112-layer 3D NAND Flash technology delivers higher capacities, performance, endurance, andlower costs, making it an ideal solution for modern storage needs. Transcend's 112-layer 3D NAND
SSDs provide high I/O performance and low latency, making them perfect for 5G, automotive,
AIoT, and cloud computing applications.

Dynamic Thermal Throttling
Our Dynamic Thermal Throttling technology ensures that our SSDs operate within a safe temperature
range, thereby protecting users' data and prolonging the product lifespan. A built-in thermal sensor
in the controller constantly monitors the drive temperature, and when the temperature exceeds asafe level, drive speeds are throttled down until a safe temperature is reached.

SLC Mode
SLC Mode SSDs strike a cost-performance balance between different flash types by emulating
the behavior of SLC NAND flash. This provides users with SLC-level endurance and performanceat a reasonable cost.

SECURITYTCG Opal Compliance
TCG Opal SEDs (self-encrypting drives) are ideal for industries where data security is of crucial
importance. Transcend’s Opal-compliant SSDs incorporate hardware-based AES 256-bit
encryption; ensuring data is safeguarded starting from the manufacture of the storage device
to system installation and management. Furthermore, TCG Opal compliant SSDs do not impact
host performance since encryption and decryption are conducted on the drives themselves.
Transcend's Opal-compliant SSDs offer sector-specific security, allowing managers to grantdifferent permissions to each user, ensuring compartmentalized data security. The SSDs also
feature pre-boot authentication; they can only be booted when the user is verified, preventing
unauthorized access.

AES Encryption
The Advanced Encryption Standard (AES) is a FIPS-approved cryptographic algorithm specificallyused to protect electronic data. Transcend's SSDs equipped with hardware-based AES provide acomprehensive solution for applications that handle sensitive data or require high data security.

4 | Solutions & Technologies |RELIABILITY
Anti-Sulfur Technology
Transcend's anti-sulfur DRAM modules meet the ISA Standard S71.04-2013 level G2 and the
ASTM B809-95 standard. Anti-sulfur resistors, which have a protective layer above vulnerable
silver alloys, are used exclusively to prevent malfunctions caused by sulfuration.

Wide Temperature
Transcend’s products are stringently tested at the component level and at the device levelwithin an extended thermal range. All wide-temperature products are required to pass rigorous
tests conducted in a temperature and humidity chamber to ensure reliable performance intemperatures ranging from -40°C to 85°C. Wide-temperature DDR4 and DDR5 memory modules
are tested to operate between -40°C to 95°C.

Extended Temperature
Products rated for extended temperatures are designed for reliable operation in temperatures
ranging from -20°C to 75°C. Transcend offers this as standard on a wide range of 112-layer and96-layer 3D NAND SSDs.

Corner Bond & Underfill
Corner Bond / Underfill are technologies used to increase reliability under high thermal stress,
high gravitational acceleration and high fatigue cycle applications. By spreading stresses
throughout the key components with a mechanical bond, less stress is concentrated on thesolder joints. It is widely used in applications where stringent thermal cycling performance andshock resistance are required.

Conformal Coating
Conformal Coating increases protection for Transcend's embedded flash modules and DRAM
products against various harsh environmental conditions such as moisture, dust, corrosion,
extreme temperature, and chemical contaminants. Acrylic coatings are the most preferredchoice for embedded applications due to their excellent moisture and electrical resistance.

STABILITY
Power Loss Protection (PLP) & Power Shield (PS)Power Loss Protection (PLP) and Power Shield (PS) are two technologies provided by Transcend
to prevent internal NAND flash data loss during a sudden power outage. When power is lost, thedrive controller will stop accepting new write commands to ensure data integrity. PLP SSDs utilize
tantalum capacitors to increase the amount of time the drive controller has to flush data from
DRAM into NAND flash. Power Shield technology provides a power loss protection mechanism
to Transcend's flash memory cards, USB flash drives, and other portable devices. The technology
ensures that the device can complete the ongoing write operation and prevent data corruption
or loss due to power interruption.
| Solutions & Technologies | 5

Embedded Software Solutions
Leverage our embedded software solutions to stand out from the others. See how Transcend can empower yourbusiness and boost your growth.

SDK

SDK Available

Software and Hardware
Integration

Software Development Kits (SDKs) can beprovided to adapt our software to many
operating systems.

Seamlessly integrate hardware andsoftware for complex applications.

From Edge to CloudBroad Support

Work in tandem between the cloud andthe edge to achieve utmost flexibility.

Our software solutions build strong
foundations for SSDs, DRAM, flash andother devices.

Management

Control CenterTranscend's Control Center allows users to easily manage and monitor multiple storage devices
deployed at the edge. Our SaaS solution is platform-agnostic and can be deployed on either public
cloud services such as AWS or Azure or on private clouds.

Cloud

CentralManagement

Management
Maintenance
Data analysis

Notification
Data collection

AIoT Devices

Control CenterOn-premise

Consolidated Information
Offers data analysis and clear
information on an intuitive interface
to help users make informed

Remote upgrade &monitoring

Early Warning System(EWS) & Instant Notices

Allows for remote monitoring ofdevice health status and firmware

decisions.

updates.

Detects potential issues and notifies
users in real-time, enabling them totake proactive measures.

6 | Software Solutions |Monitor

Scope Pro / Scope Pro CLITranscend's Scope Pro is a convenient
software package suitable for offline
embedded systems. It offers useful features
such as drive information, S.M.A.R.T.
analysis, diagnostic scans, health checks,
and system cloning.
*Scope Pro CLI for Linux OS.

Efficient Monitoring

Optimized Performance

System Clone

Monitor the health status of devices,
including available, used, and total
capacity, temperature, endurance,
bad blocks, and wear-out indicators.

Conduct speed tests and healthscans. Rearrange data stored
in SSDs or SD/microSD cards to

Perform a system clone by
duplicating the operating system(OS), programs, and user data to a
new Transcend SSD.

optimize performance.

TCG Opal Toolbox | ATA Security Toolbox |UFD Security Toolbox

Security

Transcend offers a wide range of security toolboxes for use with our embedded solutions to enhance data security.

Utilize the Opal Toolbox to configure
passwords, locking ranges, initiate preboot authentication (PBA), and revert
functions to increase drive security.

Determine the desired security
level and perform lock, unlock,and drive erase functions.

Enable write protect and OTP
functions to increase thesecurity of USB flash drives.

RescueOne Touch Recovery
One Touch Recovery safeguards
digital assets by backing up crucial
data to hidden partitions.

Enhanced Efficiency

Flexible Customization

By backing up data beforehand,
One Touch Recovery eliminates thehours spent restoring compromised

Back up and restore data fromuser-defined disks. The maximum
number of disks is tailored to fit eachsystems.

user’s requirements.

Remote Backup &RecoveryCan be operated remotely, allowing
users to respond to emergency
situations quickly, minimizing
downtime and related costs.
| Software Solutions | 7

DRAM
Modules
Transcend’s DRAM modules are offered in avariety of form factors to accommodate different
embedded devices used in industrial applications.
Each DRAM module is manufactured using only
the highest-quality DRAM memory chips andcomponents, and is individually tested to ensurestability and compatibility.

8 |8Solutions| DRAM Modules& Technologies||

IC Grade
Transcend’s industrial-grade DRAM memory modules only utilize major-grade DRAM chips which have undergone theoriginal IC manufacture’s in-house testing procedures.






Major-grade DRAM
• Fully tested by major IC suppliers

Effectively tested DRAM
• Effectively tested but test patterns can vary among suppliers• Logo unmarked, only marked with partial IC number

Untested DRAM
• Untested• Logo unmarked

Product Line
Module Type
Unbuffered Long-DIMM /Unbuffered SO-DIMM

DDR5

ECC Long-DIMM /ECC SO-DIMM

Speed (MT/s)

Operating Temperature

Capacity

5600
8GB~32GB4800
5600
0°C~95°C / -40°C~95°C

16GB~32GB

4800
5600

Registered Long-DIMM

16GB~32GB
4800

Unbuffered Long-DIMM/
Unbuffered SO-DIMM

DDR4

ECC Long-DIMM /ECC SO-DIMM

3200

4GB~32GB

2666

2GB~32GB

3200

4GB~32GB
0°C~95°C / -40°C~95°C

2666

4GB~32GB

3200

8GB~64GB

2666

4GB~32GB

Registered Long-DIMM

Unbuffered Long-DIMM /Unbuffered SO-DIMM
DDR3

ECC Long-DIMM /ECC SO-DIMM
Registered Long-DIMM

1GB~8GB
0°C~85°C / -40°C~85°C
2GB~8GB

1600
0°C~85°C

4GB~8GB*Transcend offers technology customization options for selected models. Please contact us for more detailed information.
| DRAM Modules | 9

Product Highlights
DDR5 Memory Modules
Unlock Next-Gen Performance and Efficiency
Transcend’s embedded DDR5 DRAM modules follow JEDEC standards, featuring high I/O throughput andlow latency. The DDR5 standard introduces an on-DIMM power management integrated circuit (PMIC) thatenables optimized energy control, improved power efficiency, and reduced signal complexity. The on-die ECC
prevents bit errors, bringing together advanced data integrity and system reliability. Transcend’s embedded
DDR5 product line covers a variety of module types including Unbuffered Long-DIMM and SO-DIMM, ECC
Long-DIMM and SO-DIMM, as well as Registered Long-DIMM. With 30μ” gold finger PCBs and anti-sulfurization
technology, Transcend’s DDR5 modules deliver unmatched performance and reliability in high-performancecomputing (HPC) applications.

Key Features

Power Management
IC (PMIC)

10 | DRAM Modules |1.1V Low Power
SupplyOn-Die ECC

Major-Grade DRAM
Components

JEDEC®
Compliant30µ" PCB Gold Fingers

Anti-Sulfuration

Extra-thick gold-plated connectors
enhance signal transmission and prevent
corrosion, ensuring long-term reliability.

Anti-sulfur resistors are protected from
sulfide contamination resulting fromindustrial environments and pollution.

DDR5Long-DIMM

Module Type

SO-DIMM

Speed

5600/4800 MT/s

Capacity

8GB~32GB

Voltage

1.1V

PCB Height

1.23 inches

1.18 inches

30µ” PCB Gold Finger

Wide Temp. / ECC / Registered

Anti-Sulfuration

Wide Temp. / ECC / Registered

Operating Temperature

0°C~ 95°C / -40°C~ 95°C

DDR5-5600 Unbuffered DIMM
Standard Temp.
(0°C ~ 95°C)
Wide Temp.
(-40°C ~ 95°C)

Capacity

Component Composition

Rank x Org.

Long-DIMM

SO-DIMM

8GB(1Gx16)x4

1Rx16

TS1GLA64V6G

TS1GSA64V6G

16GB(2Gx8)x8

1Rx8

TS2GLA64V6E

TS2GSA64V6E

32GB(2Gx8)x16

2Rx8

TS4GLA64V6E

TS4GSA64V6E

8GB(1Gx16)x4

1Rx16

TS1GLA64V6G-I

TS1GSA64V6G-I

16GB(2Gx8)x8

1Rx8

TS2GLA64V6E-I

TS2GSA64V6E-I

32GB(2Gx8)x16

2Rx8

TS4GLA64V6E-I

TS4GSA64V6E-I

DDR5-4800 Unbuffered DIMM
Standard Temp.
(0°C ~ 95°C)
Wide Temp.
(-40°C ~ 95°C)

Capacity

Component Composition

Rank x Org.

Long-DIMM

SO-DIMM

8GB(1Gx16)x4

1Rx16

TS1GLA64V8G

TS1GSA64V8G

16GB(2Gx8)x8

1Rx8

TS2GLA64V8E

TS2GSA64V8E

32GB(2Gx8)x16

2Rx8

TS4GLA64V8E

TS4GSA64V8E

8GB(1Gx16)x4

1Rx16

TS1GLA64V8G-I

TS1GSA64V8G-I

16GB(2Gx8)x8

1Rx8

TS2GLA64V8E-I

TS2GSA64V8E-I

32GB(2Gx8)x16

2Rx8

TS4GLA64V8E-I

TS4GSA64V8E-I| DRAM Modules | 11

DDR5-5600 ECC DIMM
Capacity

Component Composition

Rank x Org.

Standard Temp.
(0°C ~ 95°C)

Long-DIMM

SO-DIMM

16GB(2Gx8)x10

32GB(2Gx8)x20

1Rx8

TS2GLA72V6E

TS2GSA72V6E

2Rx8

TS4GLA72V6E

TS4GSA72V6E

Wide Temp.
(-40°C ~ 95°C)

16GB
32GB

(2Gx8)x10

1Rx8

TS2GLA72V6E-I

TS2GSA72V6E-I(2Gx8)x20

2Rx8

TS4GLA72V6E-I

TS4GSA72V6E-I

Capacity

Component Composition

Rank x Org.

Long-DIMM

SO-DIMM

Standard Temp.
(0°C ~ 95°C)

16GB(2Gx8)x10

1Rx8

TS2GLA72V8E

TS2GSA72V8E

32GB(2Gx8)x20

2Rx8

TS4GLA72V8E

TS4GSA72V8E

Wide Temp.
(-40°C ~ 95°C)

16GB(2Gx8)x10

1Rx8

TS2GLA72V8E-I

TS2GSA72V8E-I

32GB(2Gx8)x20

2Rx8

TS4GLA72V8-I

TS4GSA72V8E-I

DDR5-4800 ECC DIMM

DDR5-5600 Registered DIMM
Capacity

Component Composition

Rank x Org.

Standard Temp.
(0°C ~ 95°C)

Long-DIMM

16GB(2Gx8)x10

1Rx8TS2GAR80V6E

32GB(2Gx8)x20

2Rx8

TS4GAR80V6E

Wide Temp.
(-40°C ~ 95°C)

16GB(2Gx8)x10

1Rx8TS2GAR80V6E-I

32GB(2Gx8)x20

2Rx8

TS4GAR80V6E-I

Long-DIMM

DDR5-4800 Registered DIMM
Capacity

Component Composition

Rank x Org.

Standard Temp.
(0°C ~ 95°C)

16GB(2Gx8)x10

1Rx8TS2GAR80V8E

32GB(2Gx8)x20

2Rx8

TS4GAR80V8E

Wide Temp.
(-40°C ~ 95°C)

16GB(2Gx8)x10

1Rx8TS2GAR80V8E-I

32GB(2Gx8)x20

2Rx8

TS4GAR80V8E-I

12 | DRAM Modules |DDR4Long-DIMM

Module Type

SO-DIMM

Speed

3200/2666 MT/s

Capacity

2GB~64GB

Voltage

1.2VStandard: 1.23 inches
Very Low Profile: 0.74 inches

PCB Height

1.18 inches

30µ” PCB Gold Finger

Wide Temp. / ECC / Registered

Anti-Sulfuration

Wide Temp. / ECC / Registered

Operating Temperature

0°C~ 95°C / -40°C~ 95°C

DDR4-3200 Unbuffered DIMM
Capacity

Component Composition

Rank x Org.

Long-DIMM

SO-DIMM(512Mx8)x8

1Rx8

TS512MLH64V2H2

TS512MSH64V2H2(512Mx16)x4

1Rx16

TS512MLH64V2D2

TS512MSH64V2D2(1Gx8)x8

1Rx8

TS1GLH64V2B2TS1GSH64V2B2(1Gx16)x4

1Rx16

TS1GLH64V2G2

TS1GSH64V2G2(1Gx8)x16

2Rx8

TS2GLH64V2B2

TS2GSH64V2B2(2Gx8)x8

1Rx8

TS2GLH64V2E2

TS2GSH64V2E2(2Gx8)x16

2Rx8

TS4GLH64V2E2

TS4GSH64V2E2(512Mx8)x8

1Rx8

TS512MLH64V2H-I

S512MSH64V2H-I(512Mx16)x4

1Rx16

TS512MLH64V2D-I

TS512MSH64V2D-I(1Gx8)x8

1Rx8

TS1GLH64V2B-I

TS1GSH64V2B-I(1Gx16)x4

1Rx16

TS1GLH64V2G-I

TS1GSH64V2G-I(1Gx8)x16

2Rx8

TS2GLH64V2B-I

TS2GSH64V2B-I(2Gx8)x8

1Rx8

TS2GLH64V2E-I

TS2GSH64V2E-I

4GBStandard Temp.
(0°C ~ 95°C)

8GB
16GB
32GB
4GB

Wide Temp.
(-40°C ~ 95°C)

8GB
16GB

Very Low Profile(0°C ~ 95°C)

32GB(2Gx8)x16

2Rx8

TS4GLH64V2E-I

TS4GSH64V2E-I

4GB(512Mx8)x8

1Rx8

TS512MLH64V2HL-

8GB(1Gx8)x8

1Rx8

TS1GLH64V2BL

-

16GB

(1Gx8)x16

2Rx8

TS2GLH64V2BL-*DDR4 2400MT/s and 2133MT/s are also available.
| DRAM Modules | 13

DDR4-2666 Unbuffered DIMM

Standard Temp.
(0°C ~ 95°C)

Capacity

Component Composition

Rank x Org.

Long-DIMM

SO-DIMM

2GB(256Mx16)x4

1Rx16

TS256MLH64V6X

TS256MSH64V6X(512Mx16)x4

1Rx16

TS512MLH64V6D

TS512MSH64V6D(512Mx8)x8

1Rx8

TS512MLH64V6H

TS512MSH64V6H(1Gx8)x8

1Rx8

TS1GLH64V6B

TS1GSH64V6B(512Mx8)x16

2Rx8

-

TS1GSH64V6H

16GB(1Gx8)x16

2Rx8

TS2GLH64V6B

TS2GSH64V6B

32GB(2Gx8)x16

2Rx8

TS4GLH64V6E

TS4GSH64V6E(512Mx16)x4

1Rx16

4GB
8GB

4GB
Wide Temp.
(-40°C ~ 95°C)

Very Low Profile(0°C ~ 95°C)-

TS512MSH64V6D-I(512Mx8)x8

1Rx8

-

TS512MSH64V6H-I

8GB(1Gx8)x8

1Rx8-

TS1GSH64V6B-I

16GB(1Gx8)x16

2Rx8

TS2GLH64V6B-I

TS2GSH64V6B-I

32GB(2Gx8)x16

2Rx8

TS4GLH64V6E-I

TS4GSH64V6E-I

2GB(256Mx16)x4

1Rx16

TS256MLH64V6XL-

4GB(512Mx8)x8

1Rx8

TS512MLH64V6HL-

8GB(1Gx8)x8

1Rx8

TS1GLH64V6BL

-

16GB

(1Gx8)x16

2Rx8

TS2GLH64V6BL-

Capacity

Component Composition

Rank x Org.

Long-DIMM

SO-DIMM

4GB(512Mx8)x9

1Rx8

-

TS512MSH72V2H(1Gx8)x9

1Rx8

TS1GLH72V2B

TS1GSH72V2B(512Mx8)x18

2Rx8

-

TS1GSH72V2H(1Gx8)x18

2Rx8

TS2GLH72V2B

TS2GSH72V2B(2Gx8)x9

1Rx8

TS2GLH72V2E

TS2GSH72V2E(2Gx8)x18

2Rx8

TS4GLH72V2E

TS4GSH72V2E(1Gx8)x9

1Rx8

TS1GLH72V2B-I

TS1GSH72V2B-I(512Mx8)x18

2Rx8

-

TS1GSH72V2H-I(1Gx8)x18

2Rx8

TS2GLH72V2B-I

TS2GSH72V2B-I

DDR4-3200 ECC DIMM

Standard Temp.
(0°C ~ 95°C)

8GB
16GB
32GB
8GB

Wide Temp.
(-40°C ~ 95°C)

Very Low Profile(0°C ~ 95°C)

16GB(2Gx8)x9

1Rx8-

TS2GSH72V2E-I

32GB(2Gx8)x18

2Rx8

TS4GLH72V2E-I

TS4GSH72V2E-I

8GB(1Gx8)x9

1Rx8

TS1GLH72V2BL

-

16GB

(1Gx8)x18

2Rx8

TS2GLH72V2BL-*DDR4 2400MT/s and 2133MT/s are also available.

14 | DRAM Modules |DDR4-2666 ECC DIMM
Standard Temp.
(0°C ~ 95°C)

Wide Temp.
(-40°C ~ 95°C)
Very Low Profile(0°C ~ 95°C)

Capacity

Component Composition

Rank x Org.

Long-DIMM

SO-DIMM

4GB(512Mx8)x9

1Rx8

TS512MLH72V6H

TS512MSH72V6H

8GB(1Gx8)x9

1Rx8

TS1GLH72V6B

TS1GSH72V6B

16GB(1Gx8)x18

2Rx8

TS2GLH72V6B

TS2GSH72V6B

32GB(2Gx8)x18

2Rx8

TS4GLH72V6E

TS4GSH72V6E

4GB(512Mx8)x9

1Rx8

-

TS512MSH72V6H-I

8GB(1Gx8)x9

1Rx8-

TS1GSH72V6B-I

16GB(1Gx8)x18

2Rx8-

TS2GSH72V6B-I

32GB(2Gx8)x18

2Rx8-

TS4GSH72V6E-I

8GB(1Gx8)x9

1Rx8

TS1GLH72V6BL

-

16GB

(1Gx8)x18

2Rx8

TS2GLH72V6BL-

DDR4-3200 Registered DIMM

Standard Temp.
(0°C ~ 95°C)

Capacity

Component Composition

Rank x Org.

8GB

(1Gx8)x9

1Rx8

TS1GHR72V2B(1Gx8)x18

2Rx8

TS2GHR72V2B2(2Gx8)x9

1Rx8

TS2GHR72V2E(2Gx8)x18

2Rx8

TS4GHR72V2E(2Gx4)x36

2Rx4

TS4GHR72V2C-SAM

64GB(4Gx4)x36

2Rx4

TS8GHR72V2F-SAM

16GB(1Gx8)x18

2Rx8

TS2GHR72V2B-I

32GB(2Gx8)x18

2Rx8

TS4GHR72V2E-I

8GB(1Gx8)x9

1Rx8

TS1GHR72V2BL(1Gx8)x18

2Rx8

TS2GHR72V2BL(2Gx8)x9

1Rx8

TS2GHR72V2EL

32GB(2Gx8)x18

2Rx8

TS4GHR72V2EL

32GB(2Gx8)x18

2Rx8

TS4GHR72V2EL-I

16GB
32GB

Wide Temp.
(-40°C ~ 95°C)
Very Low Profile(0°C ~ 95°C)
Very Low Profile+
Wide Temp.
(-40°C ~ 95°C)

16GB

Long-DIMM

DDR4-2666 Registered DIMM
Standard Temp.
(0°C ~ 95°C)

Wide Temp.
(-40°C ~ 95°C)
Very Low Profile(0°C ~ 95°C)

Capacity

Component Composition

Rank x Org.

Long-DIMM

4GB(512Mx8)x9

1Rx8

TS512MHR72V6H(512Mx8)x18

2Rx8

TS1GHR72V6H

8GB(1Gx8)x9

1Rx8

TS1GHR72V6B

16GB(1Gx8)x18

2Rx8

TS2GHR72V6B

16GB(1Gx8)x18

2Rx8

TS2GHR72V6B-I

32GB(2Gx8)x18

2Rx8

TS4GHR72V6E-I

16GB(1Gx8)x18

2Rx8

TS2GHR72V6BL*DDR4 2400MT/s and 2133MT/s are also available.
| DRAM Modules | 15

DDR3
Long-DIMM

Module Type

SO-DIMM

Speed

1600 MT/s

Capacity

1GB~8GB

VoltageStandard: 1.5V
Low Voltage: 1.35V
Standard: 1.18 inches
Very Low Profile: 0.74 inches

PCB Height

1.18 inches

30µ” PCB Gold Finger

Wide Temp. / ECC / Registered

Anti-Sulfuration

Wide Temp. / ECC / Registered

Operating Temperature

0°C~ 85°C / -40°C~ 85°C

DDR3-1600 Unbuffered DIMM

Standard Temp.
(0°C ~ 85°C)

Wide Temp.
(-40°C ~ 85°C)

Capacity

Component Composition

Rank x Org.

Long-DIMM

SO-DIMM

2GB(256Mx8)x8

1Rx8

TS256MLK64V6N

TS256MSK64V6N(256Mx8)x16

2Rx8

TS512MLK64V6N

TS512MSK64V6N(512Mx8)x8

1Rx8

TS512MLK64V6H

TS512MSK64V6H

8GB(512Mx8)x16

2Rx8

TS1GLK64V6H

TS1GSK64V6H

8GB(512Mx8)x16

2Rx8

-

TS1GSK64V6H-I(256Mx8)x8

1Rx8

TS256MLK64W6N

TS256MSK64W6N(256Mx16)x4

1Rx16

-

TS256MSK64W6X(256Mx8)x16

2Rx8

TS512MLK64W6N

TS512MSK64W6N(512Mx8)x8

1Rx8

TS512MLK64W6H

TS512MSK64W6H

8GB(512Mx8)x16

2Rx8

TS1GLK64W6H

TS1GSK64W6H

1GB(128Mx8)x8

1Rx8

-

TS128MSK64W6U-I

2GB(256Mx8)x8

1Rx8

-

TS256MSK64W6N-I(256Mx8)x16

2Rx8

-

TS512MSK64W6N-I(512Mx8)x8

1Rx8

-

TS512MSK64W6H-I

8GB(512Mx8)x16

2Rx8

-

TS1GSK64W6H-I

4GB(512Mx8)x8

1Rx8

TS512MLK64W6HL

-

4GB

2GB
Low Voltage(0°C ~ 85°C)

Low Voltage+
Wide Temp.
(-40°C ~ 85°C)

Low Voltage+
Very Low Profile(0°C ~ 85°C)

4GB

4GB

*DDR3 1866MT/s and 1333MT/s are also available.

16 | DRAM Modules |DDR3-1600 ECC DIMM

Standard Temp.
(0°C ~ 85°C)

Low Voltage(0°C ~ 85°C)
Low Voltage+
Wide Temp.
(-40°C ~ 85°C)
Low Voltage+
Very Low Profile(0°C ~ 85°C)

Capacity

Component Composition

Rank x Org.

Long-DIMM

SO-DIMM

2GB(256Mx8)x9

1Rx8

TS256MLK72V6N

TS256MSK72V6N(512Mx8)x9

1Rx8

TS512MLK72V6H-(256Mx8)x18

2Rx8

TS512MLK72V6N-

8GB(512Mx8)x18

2Rx8

TS1GLK72V6H

TS1GSK72V6H

2GB(256Mx8)x9

1Rx8

TS256MLK72W6N-

4GB(512Mx8)x9

1Rx8

TS512MLK72W6H

TS512MSK72W6H

8GB(512Mx8)x18

2Rx8

TS1GLK72W6H

TS1GSK72W6H

2GB(256Mx8)x9

1Rx8

-

TS256MSK72W6N-I

4GB(512Mx8)x9

1Rx8

-

TS512MSK72W6H-I

8GB(512Mx8)x18

2Rx8

-

TS1GSK72W6H-I

4GB(512Mx8)x9

1Rx8

TS512MLK72W6HL-

8GB(512Mx8)x18

2Rx8

TS1GLK72W6HL-

4GB

DDR3-1600 Registered DIMM
Capacity

Component Composition

Rank x Org.

Long-DIMM

Standard Temp.
(0°C ~ 85°C)

4GB(256Mx8)x18

2Rx8

TS512MKR72V6N

8GB(512Mx8)x18

2Rx8

TS1GKR72V6H

Low Voltage(0°C ~ 85°C)

4GB(512Mx8)x9

1Rx8

TS512MKR72W6H

8GB(512Mx8)x18

2Rx8

TS1GKR72W6H

8GB(512Mx8)x18

2Rx8

TS1GKR72V6HL

Very Low Profile(0°C ~ 85°C)*DDR3 1866MT/s and 1333MT/s are also available.
| DRAM Modules | 17

SSD
Solutions
Transcend’s Solid-State Drive (SSD) solutions offer fastand reliable performance in a wide variety of form factors,
interfaces, and storage capacities suitable for devices
operating in extreme industrial conditions. With support forTranscend's Power Shield (PS), Dynamic Thermal Throttling,
and S.M.A.R.T. analysis technologies, our SSDs are designed
for durability and reliability in large-scale embedded
deployments.
Transcend also provides SSDs with technologies such as
Power Loss Protection (PLP) to ensure data integrity inapplications with unstable power supply; TCG Opal 2.0 toenhance data security; and SLC Mode to increase endurance
and performance. These special product lines help address
issues commonly encountered in embedded computing
applications.

18 | SSD Solutions |SSD Solutions
M.2 2280/2260/2242/2230
Top Component

0.88 mm (Max.)

PCB
Bottom Component

Height= PCB+Top+Bottom
An example: Type 2280-D2-M, D2=3.58 mm (0.88+1.35+1.35)
80
mm

60
mm
42
mm

22 mm

22 mm

Top (Max.)

Bottom (Max.)

S2
S3
D2
D5

1.35 mm1.50 mm
1.35 mm1.50 mm

1.35 mm1.50 mm

30
mm

22 mm

(S: Single Sided, D: Double Sided)

22 mm

U.2 / 2.5”

69.85
mm

Type IDmSATA / mSATA mini

50.8
mm
26.8
mm
100 mm

29.85 mm29.85 mm

Half-Slim
69.85
mm

39.8
mm

100 mm

54 mm| SSD Solutions | 19

112-Layer 3D NAND FlashInterface

PCIe Gen4

PCIe Gen3

Form Factor

Model

DRAM

Capacity

U.2

UTE210T●

512GB~8TB

MTE720T●

512GB~4TB

MTE760T-

256GB~4TB

MTE712A●

256GB~2TB

TCG Opal

MTE712P●

256GB~2TB

TCG Opal & PLP

MTE560I●

80GB~640GB

TCG Opal & SLC ModeM.2 2242

MTE480T-

256GB~2TB

M.2 2230

MTE380T-

256GB~2TB

M.2 2280

MTE672A-

128GB~2TB

MTE460T-

128GB~1TB

MTE470A-

128GB~2TB

MTE370T-

256GB~1TB

MTS970T●

128GB~4TB

MTS960T-

64GB~2TB

MTS970A●

128GB~4TB

TCG Opal

MTS970P●

128GB~1TB

PLP

MTS260I●

40GB~1280GB

SLC Mode

MTS250I-

20GB~640GB

SLC Mode

MTS570T●

128GB~1TB

MTS560T-

64GB~2TB

MTS570A●

128GB~1TB

TCG Opal

MTS570P●

128GB~512GB

PLP

MTS210I●

40GB~320GB

SLC Mode

MTS200I-

20GB~320GB

SLC Mode

SSD910T●

240GB~960GB

PLP, Enterprise SSD

SSD470N●

1TB~4TB

Direct Write

SSD472K●

128GB~4TB

SSD460K-

64GB~2TB

SSD470A●

128GB~4TB

TCG Opal

SSD470P●

128GB~1TB

PLP

SSD550I●

40GB~1280GB

SLC Mode

MSA470T●

128GB~1TB

MSA460T-

64GB~1TB

MSA470A●

128GB~1TB

TCG Opal

MSA470P●

128GB~1TB

PLP

MSA520I●

40GB~320GB

SLC Mode

HSD460I-

64GB~2TB

M.2 2280

M.2 2242
M.2 2230

M.2 2280

M.2 2242

SATA III

2.5”

mSATA

Half-Slim*Wide-temp. models (-40°C~85°C) & Advanced Encryption Standard (AES) provided upon request. Please contact us to know more.

20 | SSD Solutions |FeaturePLP

TCG Opal
TCG Opal

96-Layer 3D NAND FlashInterface

Form Factor

Model

DRAM

MTE662T2●

128GB~2TB

MTE652T2●

64GB~512GB

MTE662P●

128GB~1TB

M.2 2242

MTE452T2●

128GB~512GB

M.2 2230

MTE352T-

128GB~512GB

MTS952T2●

64GB~2TB

MTS952P●

128GB~1TB

MTS552T2●

64GB~512GB

MTS532T-

64GB

SSD452K2●

64GB~2TB

SSD452P●

64GB~1TB

PLP

SSD530K●

64GB~128GB

SLC Mode

MSA452T2●

64GB~1TB

MSA452P●

64GB~128GB

Model

DRAM

Capacity

MTS810M●

32GB~256GB

MTS802M●

32GB~1TB

MTS862K●

16GB~32GB

MTS602M●

32GB~512GB

MTS410M●

16GB~128GB

MTS402M●

16GB~512GB

MTS400P

●

32GB

PLP

MTS462K●

8GB~16GBSLC Mode

SSD422K●

32GB~1TB

SSD420K●

16GB~1TB

SSD420P●

32GB~256GB

PLP

SSD510K●

16GB~128GB

SLC Mode

MSA380M●

16GB~256GB

MSA372M●

16GB~1TB

mSATA mini

MSM362M-

16GB~128GB

Half-Slim

HSD372M●

16GB~128GB

M.2 2280
PCIe

M.2 2280
M.2 2242
SATA III
2.5”

mSATA

Capacity

Feature

PLP

PLP

PLP

MLC NAND FlashInterface

Form Factor

M.2 2280
M.2 2260

M.2 2242
SATA III
2.5”

mSATA

FeatureSLC ModeStandard Temp.: 0°C ~ 70°C
Extended Temp.: -20°C ~ 75°C
Wide Temp.: -40°C ~ 85°C
*Wide-temp. models (-40°C~85°C) & Advanced Encryption Standard (AES) provided upon request. Please contact us to know more.
| SSD Solutions | 21

Product Highlights
112-Layer 3D NAND SSDs
Experience the SSD revolution with Transcend's 112-layer 3D NAND flash technology, boasting high diedensity, large capacity, superior performance, and low cost per bit. With quality flash from top-tier suppliers,
our 112-layer SSDs can withstand extended temperatures (-20°C~75°C) and provide industrial-grade reliability
to tackle heavy workloads.

Key Features

Great
Endurance

Better I/O
Performance

U.2 SSDs

ThermalManagement

Rigorously
TestedKey Features

Heat
Dissipation

Hot
Swapping

Model

Introducing

Transcend's

latestembedded-

grade U.2 SSD series, UTE210T. These highcapacity solid-state drives deliver competitive
NVMe performance, perfect for data centers,
hyperscale computing, media streaming, andbig data analytics. With blazing-fast PCIe Gen
4x4 speeds, UTE210T U.2 SSDs ensure lightning-

Power Loss
Protection(PLP)
UTE210T

Interface

PCIe Gen4 x4 (8CH)

Capacity

512GB~8TB

Operating Temperature-20°C~75°C

DRAM Cache
Power Loss Protection (PLP)●●

Performance (Sequential R/W*)

7,000/6,300 MB/s

Endurance (TBW*)

13,040 TB

Reliability (MTBF*)

3,000,000 hours

quick data processing and significantly improve

DWPD*

1.48 (3 years)

system responsiveness under heavy workloads.

Form Factor

U.2

Dimensions

100 x 69.85 x 7 mm

Ordering Information

22 | SSD Solutions |TS512GUTE210T⋮

TS8TUTE210T

112-Layer 3D NAND Flash

PCIe Gen4 M.2 2280
Model

MTE720T

MTE760T

Interface

PCIe Gen4 x4 (8CH)

PCIe Gen4 x4

Capacity

512GB~4TB

256GB~4TB

Operating Temperature-20°C~75°C-

DRAM Cache●TCG Opal-●Corner Bond

●
●

●
●

7,500/6,700 MB/s

5,000/4,300 MB/s

5,920 TB

5,280 TB

30µ” PCB Gold Finger
Performance (Sequential R/W*)
Endurance (TBW*)
Reliability (MTBF*)

3,000,000 hours

DWPD*

1.35 (3 years)

1.2 (3 years)

Form Factor

2280-D2-M

2280-S2-M

Dimensions

80 x 22 x 3.58 mm

80 x 22 x 2.23 mm

TS512GMTE720T

TS256GMTE760T⋮
TS4TMTE760T

Ordering Information

Model

⋮

TS4TMTE720T

MTE712A

MTE712P

Interface

MTE560I

PCIe Gen4 x4

Capacity

256GB~2TB

Operating Temperature
DRAM Cache-20°C~75°C●●

TCG OpalPower Loss Protection (PLP)SLC Mode
Corner Bond30µ” PCB Gold Finger
Performance (Sequential R/W*)
Endurance (TBW*)

80GB~640GB--40°C~85°C

●
●
●

●
●

-

-

●

●
●

●
●

●
●

3,800/3,000 MB/s

3,800/3,100 MB/s

3,800/3,200 MB/s

4,480 TB

4,320 TB

38,000 TB

Reliability (MTBF*)

3,000,000 hours

DWPD*

1.99 (3 years)

1.97 (3 years)

54.2 (3 years)

Form Factor

2280-D2-M

2280-D5-M

2280-D2-M

Dimensions

80 x 22 x 3.58 mm

80 x 22 x 3.88 mm

80 x 22 x 3.58 mm

TS256GMTE712A

TS256GMTE712P

TS80GMTE560I

TS2TMTE712A

TS2TMTE712P

TS640GMTE560I

Ordering Information

⋮

⋮

⋮

Graphene heatsink

Optional Graphene or Aluminum Heatsink
Transcend offers optional ultra-thin graphene or high performance aluminumheatsink options to improve heat dissipation.
Aluminum heatsink*Value varies by capacity, user hardware, system configuration, and calculation method.
| SSD Solutions | 23

112-Layer 3D NAND Flash

PCIe Gen4 M.2 2242
Model

MTE480T

Interface

PCIe Gen4 x4

Capacity

256GB~2TB

Operating Temperature-20°C~75°C

DRAM Cache-TCG Opal●●●Corner Bond30µ” PCB Gold Finger
Performance (Sequential R/W*)

5,000/4,300 MB/s

Endurance (TBW*)

2,640 TB

Reliability (MTBF*)

3,000,000 hours

DWPD*

1.2 (3 years)

Form Factor

2242-S2-M

Dimensions

42 x 22 x 2.23 mm
TS256GMTE480T⋮

Ordering Information

TS2TMTE480T

PCIe Gen4 M.2 2230
Model

MTE380T

Interface

PCIe Gen4 x4

Capacity

256GB~2TB

Operating Temperature-20°C~75°C

DRAM Cache-

Corner Bond●●30µ” PCB Gold Finger
Performance (Sequential R/W*)

5,000/3,500 MB/s

Endurance (TBW*)

2,640 TB

Reliability (MTBF*)

3,000,000 hours

DWPD*

1.2 (3 years)

Form Factor

2230-S3-M

Dimensions

30 x 22 x 2.38 mm
TS256GMTE380T

Ordering Information⋮

TS2TMTE380T

R/W: Read/Write
TBW: Terabytes Written
MTBF: Mean Time Between Failures
DWPD: Drive Writes Per Day*Value varies by capacity, user hardware, system configuration, and calculation method.

24 | SSD Solutions |112-Layer 3D NAND Flash

PCIe Gen3 M.2 2280/2242
Model

MTE672A

MTE460T

MTE470A

Interface

PCIe Gen3 x4

PCIe Gen3 x2

PCIe Gen3 x4

Capacity

128GB~2TB

128GB~1TB

128GB~2TB

Operating Temperature-20°C~75°C

DRAM Cache-TCG Opal

●
●
●

●
●

●
●
●

2,100/1,700 MB/s

1,700/1,500 MB/s

2,000/1,700 MB/s

1,800 TB

900 TB

1,800 TB

Corner Bond30µ” PCB Gold Finger
Performance (Sequential R/W*)
Endurance (TBW*)-

Reliability (MTBF*)

3,000,000 hours

DWPD*

0.86 (3 years)-

Form Factor

2280-S2-M

2242-D2-B-M

2242-S2-M

Dimensions

80 x 22 x 2.23 mm

42 x 22 x 3.58 mm

42 x 22 x 2.23 mm

TS128GMTE672A

TS128GMTE460T

TS128GMTE470A

TS2TMTE672A

TS1TMTE460T

TS2TMTE470A

Ordering Information

⋮

⋮

⋮

PCIe Gen3 M.2 2230
Model

MTE370T

Interface

PCIe Gen3 x4

Capacity

256GB~1TB

Operating Temperature-20°C~75°C

DRAM Cache-

Corner Bond●●30µ” PCB Gold Finger
Performance (Sequential R/W*)

2,000/1,700 MB/s

Endurance (TBW*)

960 TB

Reliability (MTBF*)

3,000,000 hours

DWPD*

0.88 (3 years)

Form Factor

2230-S3-M

Dimensions

30 x 22 x 2.38 mm
TS256GMTE370T

Ordering Information⋮

TS1TMTE370T*Value varies by capacity, user hardware, system configuration, and calculation method.
| SSD Solutions | 25

112-Layer 3D NAND FlashSATA III M.2 2280
Model

MTS970T

Interface
Capacity

MTS960T

128GB~4TB

Operating Temperature

64GB~2TBTCG Opal-Corner Bond

●
●

●
●

30µ” PCB Gold Finger
Performance (Sequential R/W*)
Endurance (TBW*)

128GB~4TB-20°C~75°C-

DRAM Cache

MTS970A

SATA III 6Gb/s●

560/520 MB/s
9,680 TB

Reliability (MTBF*)●●●●
560/500 MB/s

4,376 TB

9,680 TB

3,000,000 hours

DWPD*

2.21 (3 years)

1.95 (3 years)

2.21 (3 years)

Form Factor

2280-D2-B-M

2280-S2-B-M

2280-D2-B-M

Dimensions

80 x 22 x 3.58 mm

80 x 22 x 2.23 mm

80 x 22 x 3.58 mm

TS128GMTS970T

TS64GMTS960T

TS128GMTS970A

TS4TMTS970T

TS2TMTS960T

TS4TMTS970A

MTS970P

MTS260I

MTS250I

Ordering Information

Model

⋮

Interface
Capacity⋮⋮

SATA III 6Gb/s
128GB~1TB

Operating Temperature

40GB~1280GB

20GB~640GB-40°C~85°C●●●

Power Loss Protection (PLP)-SLC Mode--

Corner Bond

●
●

●
●
●

●
●
●

560/520 MB/s

560/520 MB/s

560/500 MB/s

2,400 TB

73,248 TB

31,240 TB

DRAM Cache

30µ” PCB Gold Finger
Performance (Sequential R/W*)
Endurance (TBW*)
Reliability (MTBF*)
DWPD*

3,000,000 hours
2.14 (3 years)

52.3 (3 years)

44.6 (3 years)

Form Factor

2280-D5-B-M

2280-D2-B-M

2280-S2-B-M

Dimensions

80 x 22 x 3.88 mm

80 x 22 x 3.58 mm

80 x 22 x 2.23 mm

TS128GMTS970P

TS40GMTS260I

TS20GMTS250I

TS1TMTS970P

TS1280GMTS260I

TS640GMTS250I

Ordering Information⋮*Value varies by capacity, user hardware, system configuration, and calculation method.

26 | SSD Solutions |⋮⋮112-Layer 3D NAND FlashSATA III M.2 2242
Model

MTS570T

Interface
Capacity

MTS560T

MTS570A

SATA III 6Gb/s
128GB~1TB

Operating Temperature

64GB~2TB

128GB~1TB-20°C~75°C

TCG Opal--Corner Bond

●
●

●
●

●
●
●
●

560/520 MB/s

560/510 MB/s

560/500 MB/s

4,376 TB

2,420 TBDRAM Cache

30µ” PCB Gold Finger
Performance (Sequential R/W*)
Endurance (TBW*)●

2,420 TB

Reliability (MTBF*)
DWPD*

3,000,000 hours
2.16 (3 years)

2 (3 years)

2.16 (3 years)

Form Factor

2242-D2-B-M

Dimensions

42 x 22 x 3.58 mm

Ordering Information

Model

TS128GMTS570T

TS64GMTS560T

TS128GMTS570A

TS1TMTS570T

TS2TMTS560T

TS1TMTS570A

MTS570P

MTS210I

MTS200I⋮

Interface
Capacity⋮⋮

SATA III 6Gb/s
128GB~512GB

Operating Temperature

40GB~320GB

20GB~320GB-40°C~85°C●●●

Power Loss Protection (PLP)-SLC Mode--

Corner Bond

●
●

●
●
●

●
●
●

560/490 MB/s

560/520 MB/s

560/500 MB/s

1,150 TB

16,710 TB

18,000 TB

DRAM Cache

30µ” PCB Gold Finger
Performance (Sequential R/W*)
Endurance (TBW*)
Reliability (MTBF*)

3,000,000 hours

DWPD*

1.46 (3 years)

Form Factor

2242-D5-B-M

Dimensions
Ordering Information

52.3 (3 years)

51.4 (3 years)
2242-D2-B-M

42 x 22 x 3.58 mm
TS128GMTS570P

TS40GMTS210I

TS20GMTS200I

TS512GMTS570P

TS320GMTS210I

TS320GMTS200I

⋮

⋮

⋮

*Value varies by capacity, user hardware, system configuration, and calculation method.
| SSD Solutions | 27

112-Layer 3D NAND FlashSATA III 2.5”
Enterprise
SSDs

Model

Transcend's SSD910T is a high-performance 2.5" Enterprise
SSD designed for data-intensive workloads. Boasting 3D
NAND flash, SATA III 6Gb/s interface, and a DRAM cache,
it delivers fast data transfer with superior Quality ofService, ultra-low latency, and exceptional endurance. The
integrated Power Loss Protection ensures data integrity
during power fluctuations.
SSD910T

Interface

SATA III 6Gb/s

Capacity

240GB~960GB

Operating Temperature

0°C~70°C

Enterprise SSD

Client SSD

Power Loss Protection (PLP)●●

Workload(JESD219)

Enterprise

ClientPerformance (Sequential R/W*)

530/500 MB/s

NAND
Endurance

High (PE: 10K)

Low (PE: 1~3K)

Reliability

Featured with PLP

Simple ECC function

Latency

0.2 ms(QoS=99.9%, SSD910T)

5.7 ms(QoS=99.6%, SSD452K)

99.9~99.99%

Not Required

DRAM Cache

Endurance (TBW*)

1,725 TB

Reliability (MTBF*)

2,000,000 hours

DWPD*
Dimensions

1 (5 years)
100 x 69.85 x 7 mm
TS240GSSD910T

Ordering Information⋮

TS960GSSD910T

Direct Write
SSDs

Model

Transcend's SSD470N is tailored for heavy write demands,
boasting advanced ECC protection, robust construction
with anti-sulfur resistors, and a specialized Direct Write
firmware for consistently high speeds. Ideal for applications
with frequent and intensive data writing, this SATA III
2.5" SSD ensures reliability and performance in tasks like
extensive data processing or continuous write operations.
SSD470N

Interface

SATA III 6Gb/s

Capacity

1TB~4TB

Operating Temperature-20°C~75°C

DRAM Cache
Performance (Sequential R/W*)

7,600 TB

Reliability (MTBF*)

3,000,000 hours

DWPD*

1.73 (3 years)⋮

TS4TSSD470N*Value varies by capacity, user hardware, system configuration, and calculation method.

28 | SSD Solutions |Stable sustained write speedswith Direct Write ﬁrmware

Saturation of SLC cache resultsin decreased write performance

100 x 69.85 x 6.8 mm
TS1TSSD470N

Ordering Information

MB/s●
560/510 MB/s

Endurance (TBW*)

Dimensions

Qos

Direct Write ﬁrmware
Buﬀered Write ﬁrmwareGB112-Layer 3D NAND FlashSATA III 2.5”
Model

SSD472K

SSD460K

Interface

SATA III 6Gb/s

Capacity

128GB~4TB

64GB~2TB

Operating Temperature-20°C~75°C●-

560/520 MB/s

560/500 MB/s

9,680 TB

4,376 TBDRAM Cache
Performance (Sequential R/W*)
Endurance (TBW*)
Reliability (MTBF*)

3,000,000 hours

DWPD*

2.16 (3 years)

Dimensions
TS128GSSD472K

TS64GSSD460K

TS4TSSD472K

TS2TSSD460K⋮

Ordering Information

Model

1.95 (3 years)
100 x 69.85 x 6.8 mm⋮

SSD470A

SSD470P

Interface
Capacity

SATA III 6Gb/s
128GB~4TB

Operating Temperature
DRAM CacheTCG OpalPower Loss Protection (PLP)SLC Mode

128GB~1TB-20°C~75°C-40°C~85°C

●

●

-

●

-

-

●

560/520 MB/s
9,680 TB

2,420 TB

Reliability (MTBF*)

66,840 TB

3,000,000 hours

DWPD*

2.16 (3 years)

Dimensions
Ordering Information

40GB~1280GB●●

Performance (Sequential R/W*)
Endurance (TBW*)SSD550I

47.7 (3 years)

100 x 69.85 x 6.8 mm
TS128GSSD470A

TS128GSSD470P

TS40GSSD550I

TS4TSSD470A

TS1TSSD470P

TS1280GSSD550I

⋮

⋮

⋮

*Value varies by capacity, user hardware, system configuration, and calculation method.
| SSD Solutions | 29

112-Layer 3D NAND FlashSATA III mSATA
Model

MSA470T

MSA460T

Interface
Capacity

MSA470A

SATA III 6Gb/s
128GB~1TB

64GB~1TB

Operating Temperature

128GB~1TB-20°C~75°C

-

-

●
●

Corner Bond

●

●

●

30µ” PCB Gold Finger

●

●

●

560/520 MB/s

560/500 MB/s

560/500 MB/s

2,420 TB

2,142 TB

2,420 TBDRAM Cache●TCG Opal

Performance (Sequential R/W*)
Endurance (TBW*)
Reliability (MTBF*)
DWPD*

3,000,000 hours
2.16 (3 years)

1.95 (3 years)

Form Factor

MO-300A

Dimensions

50.8 x 29.85 x 4.85 mm

Ordering Information

2.16 (3 years)

TS128GMSA470T

TS64GMSA460T

TS128GMSA470A

TS1TMSA470T

TS1TMSA460T

TS1TMSA470A

⋮

⋮

⋮

SATA III mSATA/Half-Slim
Model

MSA470P

MSA520I

Interface
Capacity

128GB~1TB

40GB~320GB

Operating Temperature
DRAM Cache

HSD460I

SATA III 6Gb/s
64GB~2TB-40°C~85°C

-

●
●

●

Power Loss Protection (PLP)SLC Mode-

Corner Bond

●
●

●
●
●

●

560/520 MB/s

560/520 MB/s

560/490 MB/s

2,400 TB

16,710 TB

3,744 TB

30µ” PCB Gold Finger
Performance (Sequential R/W*)
Endurance (TBW*)-

Reliability (MTBF*)
DWPD*

-

3,000,000 hours
2.14 (3 years)

52.3 (3 years)

1.75 (3 years)

Form Factor

MO-300A

MO-297

Dimensions

50.8 x 29.85 x 4.85 mm

54 x 39.8 x 4 mm

Ordering Information

TS128GMSA470P

TS40GMSA520I

TS64GHSD460I

TS1TMSA470P

TS320GMSA520I

TS2THSD460I⋮*Value varies by capacity, user hardware, system configuration, and calculation method.

30 | SSD Solutions |⋮⋮96-Layer 3D NAND Flash

PCIe Gen3 M.2 2280
Model

MTE662T2

MTE652T2

128GB~2TB

64GB~512GBInterface
Capacity

MTE662P

PCIe Gen3 x4

Operating Temperature

128GB~1TB-20°C~75°C

Power Loss Protection (PLP)

-

-

●
●

Corner Bond

●
●

●
●

●
●

3,500/2,700 MB/s

2,100/1,250 MB/s

3,400/2,300 MB/s

4,400 TB

1,080 TB

2,200 TBDRAM Cache

30µ” PCB Gold Finger
Performance (Sequential R/W*)
Endurance (TBW*)●●

Reliability (MTBF*)

3,000,000 hours

DWPD*

2 (3 years)

Form Factor

2280-D2-M

2280-D5-M

Dimensions

80 x 22 x 3.58 mm

80 x 22 x 3.88 mm

Ordering Information

TS128GMTE662T2

TS64GMTE652T

TS128GMTE662P

TS2TMTE662T2

TS512GMTE652T

TS1TMTE662P

⋮

⋮

⋮

PCIe Gen3 M.2 2242/2230
Model

MTE452T2

MTE352T

Interface

PCIe Gen3 x2

Capacity

128GB~512GB

Operating Temperature-20°C~75°C

DRAM Cache●-

Corner Bond

●
●

●
●

30µ” PCB Gold Finger
Performance (Sequential R/W*)

1,700/1,250 MB/s

Endurance (TBW*)
Reliability (MTBF*)
DWPD*

1,700/1,000 MB/s
1,080 TB
3,000,000 hours

2 (3 years)

1.93 (3 years)

Form Factor

2242-D2-B-M

2230-S3-B-M

Dimensions

42 x 22 x 3.58 mm

30 x 22 x 2.38 mm

TS128GMTE452T2

TS128GMTE352T

TS512GMTE452T2

TS512GMTE352T

Ordering Information⋮⋮*Value varies by capacity, user hardware, system configuration, and calculation method.
| SSD Solutions | 31

96-Layer 3D NAND FlashSATA III M.2 2280
Model

MTS952T2

Interface

MTS952P
SATA III 6Gb/s

Capacity

64GB~2TB

128GB~1TB

Operating Temperature-20°C~75°C-20°C~75°C

DRAM Cache●●

Power Loss Protection (PLP)-●

Corner Bond●●30µ” PCB Gold Finger●●

560/520 MB/s

560/520 MB/s

3,520 TB

1,760 TB

Performance (Sequential R/W*)
Endurance (TBW*)
Reliability (MTBF*)

3,000,000 hours

DWPD*

1.61 (3 years)

1.61 (3 years)

Form Factor

2280-D2-B-M

2280-D5-B-M

Dimensions

80 x 22 x 3.58 mm

80 x 22 x 3.88 mm

Ordering Information

TS64GMTS952T2⋮
TS2TMTS952T2

TS128GMTS952P⋮
TS1TMTS952P

SATA III M.2 2242
Model

MTS552T2

Interface

MTS532T
SATA III 6Gb/s

Capacity

64GB~512GB

64GB

Operating Temperature-20°C~75°C

0°C~70°C

DRAM Cache●

Corner Bond●30µ” PCB Gold Finger●-

560/510 MB/s

500/200 MB/s

Performance (Sequential R/W*)
Endurance (TBW*)

880 TB

Reliability (MTBF*)
DWPD*

80 TB
3,000,000 hours

1.61 (3 years)

1.16 (3 years)

Form Factor

2242-D2-B-M

Dimensions

42 x 22 x 3.58 mm

Ordering Information

TS64GMTS552T2⋮
TS512GMTS552T2*Value varies by capacity, user hardware, system configuration, and calculation method.

32 | SSD Solutions |TS64GMTS532T

96-Layer 3D NAND FlashSATA III 2.5”
Model

SSD452K2

SSD452P

Interface
Capacity

SATA III 6Gb/s
64GB~2TB

64GB~1TB

Operating Temperature●●Power Loss Protection (PLP)-●
560/520 MB/s

3,520 TB●
560/490 MB/s

1,760 TB

Reliability (MTBF*)

6,400 TB

3,000,000 hours

DWPD*

1.61 (3 years)

Dimensions
Ordering Information●-

Performance (Sequential R/W*)
Endurance (TBW*)

64GB~128GB-20°C~75°C

DRAM Cache
SLC Mode

SSD530K

45.7 (3 years)

100 x 69.85 x 6.8 mm
TS64GSSD452K2

TS64GSSD452P

TS2TSSD452K2

TS1TSSD452P⋮⋮

TS64GSSD530K
TS128GSSD530K

SATA III mSATA
Model

MSA452T2

Interface
Capacity

SATA III 6Gb/s
64GB~1TB

Operating Temperature
DRAM Cache

MSA452P
64GB~128GB-20°C~75°C●●

Power Loss Protection (PLP)-●

Corner Bond

●
●

●
●

560/520 MB/s

560/410 MB/s

1,760 TB

220 TB30µ” PCB Gold Finger
Performance (Sequential R/W*)
Endurance (TBW*)
Reliability (MTBF*)

3,000,000 hours

DWPD*

1.61 (3 years)

Form Factor

MO-300A

Dimensions

50.8 x 29.85 x 4.85 mm
TS64GMSA452T2

Ordering Information⋮

TS1TMSA452T2

TS64GMSA452P
TS128GMSA452P*Value varies by capacity, user hardware, system configuration, and calculation method.
| SSD Solutions | 33

MLC NAND FlashSATA III M.2 2280
Model

MTS810M

MTS802M

Interface
Capacity

MTS862K

SATA III 6Gb/s
32GB~256GB

32GB~1TB

Operating Temperature

16GB~32GB

0°C~70°C

SLC Mode

-

-

●
●

Corner Bond

●
●

●
●

●
●

550/420 MB/s

530/460 MB/s

530/150 MB/s

2,360 TB

580 TB

DRAM Cache

30µ” PCB Gold Finger
Performance (Sequential R/W*)
Endurance (TBW*)●●

740 TB

Reliability (MTBF*)

2,500,000 hours

DWPD*

2.6 (3 years)

14.8 (3 years)

Form Factor

2280-D2-B-M

Dimensions

80 x 22 x 3.58 mm

Ordering Information

TS32GMTS810M

TS32GMTS802M

TS256GMTS810M

TS1TMTS802M⋮⋮

SATA III M.2 2260
Model

MTS602M

Interface

SATA III 6Gb/s

Capacity

32GB~512GB

Operating Temperature

0°C~70°C

DRAM Cache●

Corner Bond●●30µ” PCB Gold Finger
Performance (Sequential R/W*)

530/450 MB/s

Endurance (TBW*)

1,480 TB

Reliability (MTBF*)

2,500,000 hours

DWPD*

2.6 (3 years)

Form Factor

2260-D2-B-M

Dimensions

60 x 22 x 3.58 mm
TS32GMTS602M

Ordering Information⋮

TS512GMTS602M*Value varies by capacity, user hardware, system configuration, and calculation method.

34 | SSD Solutions |TS16GMTS862K
TS32GMTS862K

MLC NAND FlashSATA III M.2 2242
Model

MTS410M

Interface
Capacity

MTS402M
SATA III 6Gb/s

16GB~128GB

Operating Temperature

16GB~512GB
0°C~70°C

DRAM Cache●●

Corner Bond

●
●

●
●

550/260 MB/s

530/470 MB/s

30µ” PCB Gold Finger
Performance (Sequential R/W*)
Endurance (TBW*)

360 TB

Reliability (MTBF*)
DWPD*

1,100 TB
2,500,000 hours

2.6 (3 years)

2 (3 years)

Form Factor

2242-D2-B-M

Dimensions

42 x 22 x 3.58 mm

Ordering Information

Model

TS16GMTS410M

TS16GMTS402M

TS128GMTS410M

TS512GMTS402M

MTS400P

MTS462K⋮

Interface
Capacity⋮

SATA III 6Gb/s
32GB

Operating Temperature

8GB~16GB
0°C~70°C●●●

SLC Mode-●

Corner Bond

●
●

●
●

280/50 MB/s

300/150 MB/s

DRAM Cache
Power Loss Protection (PLP)30µ” PCB Gold Finger
Performance (Sequential R/W*)
Endurance (TBW*)

90 TB

Reliability (MTBF*)
DWPD*

-

260 TB
2,500,000 hours

2 (3 years)

15.2 (3 years)

Form Factor

2242-D5-B-M

2242-D2-B-M

Dimensions

42 x 22 x 3.88 mm

42 x 22 x 3.58 mm

Ordering Information

TS32GMTS400P

TS8GMTS462K
TS16GMTS462K*Value varies by capacity, user hardware, system configuration, and calculation method.
| SSD Solutions | 35

MLC NAND FlashSATA III 2.5”
Model

SSD422K

Interface
Capacity

SATA III 6Gb/s
32GB~1TB

Operating Temperature
DRAM Cache
Performance (Sequential R/W*)

SSD420K
16GB~1TB
0°C~70°C●●

550/460 MB/s

530/470 MB/s

Endurance (TBW*)

2,940 TB

Reliability (MTBF*)

2,000,000 hours

DWPD*

2.6 (3 years)

Dimensions
Ordering Information

Model

100 x 69.85 x 6.8 mm
TS32GSSD422K

TS16GSSD420K

TS1TSSD422K

TS1TSSD420K

SSD420P

SSD510K⋮

Interface
Capacity⋮

SATA III 6Gb/s
128GB~256GB

16GB~128GB-20°C~75°C

0°C~70°C●

Power Loss Protection (PLP)●●SLC Mode-●

530/400 MB/s

530/440 MB/s

720 TB

2,840 TB

Operating Temperature
DRAM Cache

Performance (Sequential R/W*)
Endurance (TBW*)
Reliability (MTBF*)
DWPD*

2,000,000 hours
2.6 (3 years)

Dimensions
Ordering Information

15.2 (3 years)
100 x 69.85 x 6.8 mm

TS128GSSD420P
TS256GSSD420P*Value varies by capacity, user hardware, system configuration, and calculation method.

36 | SSD Solutions |-TS16GSSD510K⋮

TS128GSSD510K

MLC NAND FlashSATA III mSATA
Model

MSA380M

Interface
Capacity

SATA III 6Gb/s
16GB~256GB

Operating Temperature
DRAM Cache

MSA372M
16GB~1TB
0°C~70°C●●

SLC Mode--

Corner Bond

●
●

●
●

550/420 MB/s

550/450 MB/s

740 TB

2,360 TB

30µ” PCB Gold Finger
Performance (Sequential R/W*)
Endurance (TBW*)
Reliability (MTBF*)

2,500,000 hours

DWPD*

2.6 (3 years)

Form Factor

MO-300A

Dimensions

50.8 x 29.85 x 4.85 mm

Ordering Information

TS16GMSA380M

TS16GMSA372M

TS256GMSA380M

TS1TMSA372M⋮⋮

SATA III mSATA mini/Half-Slim
Model

MSM362M

HSD372M

Interface

SATA III 6Gb/s

Capacity

16GB~128GB

Operating Temperature

0°C~70°C

DRAM Cache-●

Corner Bond●●●

520/220 MB/s

530/200 MB/s

168 TB360 TB30µ” PCB Gold Finger
Performance (Sequential R/W*)
Endurance (TBW*)
Reliability (MTBF*)
DWPD*

-

2,500,000 hours
1.19 (3 years)

2.6 (3 years)

Form Factor

MO-300B

MO-297

Dimensions

26.85 x 26.8 x 3.85 mm

54 x 39.8 x 4 mm

TS16GMSM362M

TS16GHSD372M

TS128GMSM362M

TS128GHSD372M

Ordering Information⋮⋮*Value varies by capacity, user hardware, system configuration, and calculation method.
| SSD Solutions | 37

Memory
Cards
Transcend's memory cards combine the advantages of highperformance and exceptional endurance, making them idealfor demanding industrial applications. Our memory card series
includes SD, microSD, CompactFlash, and CFast 2.0 cards.

38 | Memory Cards |Memory Cards
SD

microSD

CompactFlash

36.4
mm

32
mm

CFast

36.4
mm

11
mm
24 mm

15 mm

42.8 mm

42.8 mm

Product Line
Form Factor

SD

Model

64GB~1TB-25°C~85°C

SDC240I

112-layer 3D TLC (SLC Mode)

20GB~40GB-40°C~85°C

SDC420T

96-layer 3D TLC

16GB~256GB-25°C~85°C

2GB~32GB-25°C~85°C

8GB~64GB-40°C~85°C

SDC410M

MLC

SDC220I

MLC (SLC Mode)

128MB~4GB-40°C~85°C

USD460T / USD460I

112-layer 3D TLC

64GB~512GB-25°C~85°C / -40°C~85°C

USD240I

112-layer 3D TLC (SLC Mode)

20GB~160GB-40°C~85°C

USD420T

96-layer 3D TLC

16GB~256GB-25°C~85°C

USD230I

96-layer 3D TLC (SLC Mode)

2GB~4GB-40°C~85°C

2GB~32GB-25°C~85°C

8GB~64GB-40°C~85°C

USD400I

Cfast

Operating Temperature

112-layer 3D TLC

USD410M

CompactFlash

Capacity

SDC460T

SDC400I

microSD

Flash TypeMLC

USD220I

MLC (SLC Mode)

2GB~16GB-40°C~85°C

CF170

MLC

8GB~64GB-25°C~85°C

CF180 / CF180I

MLC (SLC Mode)

128MB~16GB-25°C~85°C / -40°C~85°C

CFX602 / CFX602I

MLC

8GB~256GB-5°C~70°C / -40°C~85°C

MLC (SLC Mode)

4GB~128GB-40°C~85°C

CFX722I| Memory Cards | 39

SD Cards
Model

SDC460T

SDC240I

SDC420TFlash

112-layer 3D TLC

112-layer 3D TLC (SLC Mode)

96-layer 3D TLC**

Capacity

64GB~1TB

20GB~40GB

16GB~256GB

Operating Temperature-25°C~85°C-40°C~85°C-25°C~85°C

Performance (Sequential R/W*)

100/85 MB/s

100/80 MB/s

95/40 MB/s

Endurance (TBW*)

2,660 TB

3,381 TB

640 TB

Standard

SD 6.1/5.1

SD 6.1

SD 6.1/3.01

Connector

9 pin

Dimensions

24 x 32 x 2.1 mm
TS64GSDC460T

Ordering Information

TS1TSDC460T

Model

SDC410M

Flash

TS16GSDC420T

TS20GSDC240I
TS40GSDC240I⋮⋮

TS256GSDC420T

SDC400I

SDC220I

MLC

MLC (SLC Mode)

Capacity

2GB~32GB

Operating Temperature-25°C~85°C

Performance (Sequential R/W*)

95/30 MB/s

75/17 MB/s

22/20 MB/s

86 TB

128 TB

66 TB

SD 5.1/3.0

SD 3.01

SD 3.01/2.0

Endurance (TBW*)Standard

8GB~64GB-40°C~85°C

Connector

9 pin

Dimensions

24 x 32 x 2.1 mm

Ordering Information

TS2GSDC410M

TS8GSDC400I

TS128MSDC220I

TS32GSDC410M

TS64GSDC400I

TS4GSDC220I⋮

R/W: Read/Write
TBW: Terabytes Written*Value varies by capacity, user hardware, system configuration, and calculation method.
**TS16GSDC420T utilizes 64-layer 3D TLC.

40 | Memory Cards |128MB~4GB⋮⋮microSD Cards
Model

USD460T

Flash

USD460I
112-layer 3D TLC

112-layer 3D TLC (SLC Mode)

64GB~512GB

20GB~160GB

Capacity
Operating Temperature

USD240I-25°C~85°C-40°C~85°C

Performance (Sequential R/W*)

100/80 MB/s

Endurance (TBW*)

1,343 TB

13,526 TB

Standard

SD 6.1/5.1

SD 6.1Connector

8 pin

Dimensions

11 x 15 x 1 mm

Ordering Information

TS64GUSD460T

TS64GUSD460I

TS20GUSD240I

TS512GUSD460T

TS512GUSD460I

TS160GUSD240I

⋮

⋮

⋮

Model

USD420T

USD230IFlash

96-layer 3D TLC**

96-layer 3D TLC** (SLC Mode)

Capacity

16GB~256GB

2GB~4GBOperating Temperature-25°C~85°C-40°C~85°C

Performance (Sequential R/W*)

95/40 MB/s

22/21 MB/s

640 TB

98 TB

Endurance (TBW*)Standard

SD 5.1/3.01

Connector

8 pin

Dimensions

11 x 15 x 1 mm
TS16GUSD420T

Ordering Information⋮

TS256GUSD420T

TS2GUSD230I
TS4GUSD230I*Value varies by capacity, user hardware, system configuration, and calculation method.
**TS16GUSD420T, TS2GUSD230I, and TS4GUSD230I utilize 64-layer 3D TLC.
| Memory Cards | 41

microSD Cards
Model

USD410M

Flash

USD400I
MLC

Capacity

2GB~32GB

8GB~64GB

Operating Temperature-25°C~85°C-40°C~85°C

Performance (Sequential R/W*)

95/50 MB/s

95/70 MB/s

86 TB

125 TBSD 5.1/3.0

SD 3.01

Endurance (TBW*)Standard
Connector

8 pin

Dimensions

11 x 15 x 1 mm

Ordering Information

TS2GUSD410M

TS8GUSD400I

TS32GUSD410M

TS64GUSD400I

⋮

⋮

Model

USD220I

Flash

MLC (SLC Mode)

Capacity

2GB~16GB

Operating Temperature-40°C~85°C

Performance (Sequential R/W*)

80/45 MB/s

Endurance (TBW*)

300 TB

Standard

SD 3.01/2.0

Connector

8 pin

Dimensions

11 x 15 x 1 mm
TS2GUSD220I

Ordering Information⋮

TS16GUSD220I*Value varies by capacity, user hardware, system configuration, and calculation method.

42 | Memory Cards |CompactFlash Cards
Model

CF170

Flash

MLC

Capacity

Endurance (TBW*)

CF180I
MLC (SLC Mode)

8GB~64GB

Operating Temperature
Performance (Sequential R/W*)

CF180

4GB~16GB

128MB~16GB-25°C~85°C-40°C~85°C

87/67 MB/s

85/75 MB/s

85/75 MB/s

85 TB

210 TB

210 TB

Standard

True IDE

Connector

50 pinDimensions

42.8 x 36.4 x 3.3 mm

Ordering Information

TS8GCF170

TS4GCF180

TS128MCF180I

TS64GCF170

TS16GCF180

TS16GCF180I

CFX602I

CFX722I⋮⋮⋮

CFast Cards
Model

CFX602

Flash
Capacity
Operating Temperature

MLC

MLC (SLC Mode)

8GB~256GB

4GB~128GB-5°C~70°C

Performance (Sequential R/W*)
Endurance (TBW*)-40°C~85°C
510/340 MB/s

540/425 MB/s

360 TB

1,800 TB

Standard

SATA III 6Gb/s

Connector

24 pinDimensions

42.8 x 36.4 x 3.3 mm

Ordering Information

TS8GCFX602

TS8GCFX602I

TS4GCFX722I

TS256GCFX602

TS256GCFX602I

TS128GCFX722I

⋮

⋮

⋮

*Value varies by capacity, user hardware, system configuration, and calculation method.
| Memory Cards | 43

FlashSolutions
Transcend’s flash solutions include USB flash drives, USB
flash modules, and eMMC. Our USB flash drives feature
a compact and portable design, ideal for applications
where reliability and data retention are crucial. Our flash
modules offer a simple solution for integrating SSD storage
technology into legacy PC- and laptop-based systems.

44 | Flash Solutions |Flash Solutions
USB Flash Drive

37.8
mm
18.6
mm

30.2
mm

12.2
mm
61.5 mmeMMC

USB Flash Module

11.5
mm
22.4 mm26.65 mm

22 mm

13 mm

Product Line
Form Factor

USB Flash Drives

Model

Flash TypeCapacity

Operating Temperature

JF282T

112-layer 3D TLC

64GB~512GB

0°C~70°C

JF180I

112-layer 3D TLC(SLC Mode)

8GB~16GB-40°C~85°C

JF280T

96-layer 3D TLC

16GB~128GB

0°C~70°C

JF270M

MLC

8GB~32GB

0°C~70°C

JF740K

MLC(SLC Mode)

2GB~16GB

0°C~70°C

2GB~32GB

0°C~70°C

8GB~32GB

0°C~70°C

UFM510H
USB Flash Modules

MLC
UFM510V

EMC410T

96-layer 3D TLC

32GB-25°C~85°C

EMC310M

MLC

8GB~16GB-25°C~85°C

eMMC| Flash Solutions | 45

USB Flash Drives
Model

JF282T

JF180I

JF280TFlash

112-layer 3D TLC

112-layer 3D TLC**(SLC Mode)

96-layer 3D TLC**

64GB~512GB

8GB~16GB

16GB~128GB

0°C~70°C-40°C~85°C

0°C~70°C

Performance (Sequential R/W*)

255/115 MB/s

155/135 MB/s

140/40 MB/s

InterfaceUSB 3.1 Gen 1

USB 3.0

USB 3.1 Gen 1

Capacity
Operating Temperature

Connector

USB Type-A

Dimensions

61.5 x 18.6 x 8.7 mm
TS64GJF282T

Ordering Information⋮

TS512GJF282T

TS8GJF180I
TS16GJF180I

TS16GJF280T⋮

TS128GJF280T

Model

JF270M

JF740K

Flash

MLC

MLC (SLC Mode)

8GB~32GB

2GB~16GB

Capacity
Operating Temperature

0°C~70°C

Performance (Sequential R/W*)

160/40 MB/s

119/86 MB/s

InterfaceUSB 3.1 Gen 1

Connector

USB Type-A

Dimensions

61.5 x 18.6 x 8.7 mm

22.4 x 12.2 x 6 mm

TS8GJF270M

TS2GJF740K

TS32GJF270M

TS16GJF740K

Ordering Information⋮

R/W: Read/Write*TS8GJF180I utilizes 96-layer 3D TLC. TS16GJF280T utilizes 64-layer 3D TLC.
**Value varies by capacity, user hardware, system configuration, and calculation method.

46 | Flash Solutions |⋮USB Flash Modules
Model

UFM510H

Flash
Capacity

UFM510V
MLC

2GB~32GB

8GB~32GB

Operating Temperature

0°C~70°C

Performance (Sequential R/W*)

42/21 MB/s

InterfaceUSB 2.0

Connector

10 pin USB port

Dimensions

37.8 x 26.65 x 5.81 mm

30.2 x 22 x 6 mm

TS2GUFM510H

TS8GUFM510V

TS32GUFM510H

TS32GUFM510V

Model

EMC410T

EMC310M

Flash

96-layer 3D TLC

MLC

32GB

8GB~16GB

Ordering Information

⋮

⋮

eMMC
Capacity
Operating Temperature
Performance (Sequential R/W*)-25°C~85°C
290/155 MB/s

280/100 MB/s

Form Factor

e.MMC5.1 (BGA-153)

Dimensions

11.5 x 13 x 1 mm

Bus Speed Mode

HS400

Bus Width Supported

x1, x4, x8

Clock Frequency Supported
Ordering Information

0MHz~200MHz
TS32GEMC410T

TS8GEMC310M
TS16GEMC310M*Value varies by capacity, user hardware, system configuration, and calculation method.

| Flash Solutions | 47

World-Class
Manufacturing
Base
High-Speed SMT Lines
Transcend operates 16 high-speed Surface Mount Technology(SMT) production lines in its Taipei factory. Highly automated facilities
are widely implemented to guarantee consistent quality, high capacity,and to minimize human errors.

Proven Quality
From product development to mass production, Transcend follows
rigorous procedures to ensure products deliver advanced reliability
and stability. We conduct environmental testing in walk-in chambers
where different temperatures and humidity can be simulated. We
also carry out full-scale burn-in tests to identify defective components.
Certified by ISO 9001, ISO 14001, and QC080000 certifications,we operate our manufacturing process under internationallyacknowledged standards.

Quality Control
Transcend adopts a stringent quality control process in production.
The process includes four stages: Incoming Quality Control (IQC),
In-Process Quality Control (IPQC), Final Quality Control (FQC), andOutgoing Quality Control (OQC). The entire QC process covers
material checking at the very beginning, through to final inspection
before the products are shipped to our customers.

48 | About Factory |