Application Note

Assembly Precautions
for the Nichia 149 Series LEDs
Table of contents
1. LED Outline Dimensions/Tape Dimensions ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 2

2. Handling Precautions

・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 3

3. Design Recommendations for Optimal Amount of Solder・ ・ ・ ・ 4

4. Precautions for Setting Up a Pick-and-Place Machine/Nozzle
5. Precautions When Reflow Soldering・ ・ 5-8・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 8

6. Evaluation of the Effect of Solder Volume ・ ・ ・ ・ ・ ・ ・ ・ ・ 9-10
7. Evaluation of Self-Alignment Performance・ ・ ・ ・ ・ ・ ・ ・ 11-12

The part number NV9W149AM in this document is the part number of our product, and does not have
any relevance or similarity to other companies' products that may have trademark rights.
This document contains tentative information, Nichia may change the contents without notice.

Light Emitting Diode

1/13

SP-QR-C2-210576-2
Mar. 12, 2024

Assembly Precautions for the Nichia 149 Series LEDs

1. LED Outline Dimensions/Tape Dimensions
Table 1. Product Specifications

Part Number

NV9W149AM
補強端子 1
Solder Joint Support Electrode

3.6
0.7

光学的中心位置
Location of the optical center

Cathode Mark

3.6

7

2.65

LED1

6.65

Cathode

1.6

6.6
7

1.5
1

5.1
6.65

Anode

3.1

Cathode Mark

Φ1.5+0.25(0.02 クロスバー凹部)(0.02 Crossbar Recess)

(8.5)

(4.5)

Embossed
CarrierTape

7.5±0.1

Cathode Mark0.35±0.05

7.2 ±0.1

2±0.1 4±0.1

12 ±0.1

16 +0.3-0.1

Φ1.5+0.1-01.75±0.1[unit: mm, Tolerance: ±0.2mm]

3.4 ±0.1(4.5)
7.2±0.1(8.5)[unit: mm]

Note:
1 The NICHIA 149 Series LEDs have metal pads on the back surface to reinforce the solder joints (i.e. solder joint support electrodes) or for polarity
recognition (i.e. cathode mark); these pads are electrically insulated from the anode/cathode electrodes which are on the same surface.
This document contains tentative information, Nichia may change the contents without notice.

Light Emitting Diode

2/13

SP-QR-C2-210576-2
Mar. 12, 2024

Assembly Precautions for the Nichia 149 Series LEDs

2. Handling Precautions

Incorrect

Handling with bare hands
Do not handle the LEDs with bare hands:- this may contaminate the LED surface and have an effect on the optical characteristics,- this may cause the LED to deform and/or the wire to break causing a catastrophic failure (i.e. the LED
not to illuminate),- the lead frame may cause injuries when the LED is handled with bare hands.
Handling with tweezers
Ensure that when handling the LEDs with tweezers, excessive force is not applied to the LED. Otherwise, it
may cause damage to the resin (e.g. cut, scratch, chip, crack, delamination and deformation) and theinternal connection to fail causing a catastrophic failure (i.e. the LED not to illuminate).
ESD Precautions
LEDs are sensitive to transient excessive voltages (e.g. ESD, lightning surge). If this excessive voltage
occurs in the circuit, it may cause the LED to be damaged causing issues (e.g. the LED to have a reductionin the radiant flux or not to illuminate [i.e. catastrophic failure]). When handling the LEDs, ensure thatnecessary measures have been taken to protect them from transient excess voltages. Refer to theapplicable specification for more details.

Caution: Do not grab/hold the LEDs
with tweezers around theencapsulating resin.

Figure 1. Example of an Improper
Holding Position

Incorrect
Caution: Do not stack assembled
PCBs on top of each other.

Stacking assembled PCBs together
Do not stack assembled PCBs together. Otherwise, it may cause damage to the resin (e.g. cut, scratch,chip, crack, delamination and deformation) and the internal connection to fail causing a catastrophic
failure (i.e. the LED not to illuminate).
Storage
The storage/packaging requirements for the NICHIA 149 Series LEDs are comparable to JEDEC MoistureSensitivity Level (MSL) 3 or equivalent. Nichia used IPC/JEDEC STD-020 as a reference to rate the MSL ofthis LED. If the “After Opening” storage time has been exceeded or any pink silica gel beads are found,ensure that the LED are baked before use. Baking should only be done once.

Figure 2. Example of Improper
Stacking

Table 2. Storage/Baking Conditions
Storage

Conditions
Before Opening Aluminum Bag

Temperature≤ 30°C

Humidity≤ 90% RH

Time
Within 1 Year from Delivery Date

After Opening Aluminum Bag≤ 30°C≤ 70% RH

≤ 168 hours-≥24 hours

Baking65±5°CThis document contains tentative information, Nichia may change the contents without notice.

Light Emitting Diode

3/13

SP-QR-C2-210576-2
Mar. 12, 2024

Assembly Precautions for the Nichia 149 Series LEDs

3. Design Recommendations for Optimal Amount of Solder
Soldering Pad Pattern/Metal Solder Stencil Aperture

Table 3. Recommended Soldering Pad Pattern/Metal Solder Stencil Aperture

Soldering Pad Pattern

Stencil Aperture⋯ LED outline■ Soldering Pad Pattern■ Stencil Aperture[unit：mm][unit：mm]

Table 4. Recommended Solder/Metal Solder Stencil Conditions

Item

Recommended
Condition

Solder Stencil Thickness

120 [μm]

Solder Paste

Sn-3.0Ag-0.5Cu
This document contains tentative information, Nichia may change the contents without notice.

Light Emitting Diode

4/13

SP-QR-C2-210576-2
Mar. 12, 2024

Assembly Precautions for the Nichia 149 Series LEDs

4. Precautions for Setting Up a Pick-and-Place Machine/Nozzle
Table 5. Cautions/Suggestions for setting up equipment

Item

Recommended Conditions/Specifications

Cautions/Suggestions

Pick-and-place machine2

Modular mounter

Pick-and-place nozzle

Specially designed nozzle(see Figure 3)

See “Pick-and-Place Nozzle” on
Page 6 for the details.

Tape-and-reel feeder

Electrical (motorized) feeder
Tape width: 16mm
Feed length: 12mm

See “Tape-and-Reel Feeder” onPage 6 for the details.

Nozzle height for pick-up
operations

The contact surface of the nozzle head for pick
operations should be adjusted to 1.8mm below the edgeof the embossed carrier tape pocket.

See “Recommended Nozzle Heightfor Pick-up Operations” on Page 7
for the details.

Nozzle height for placement
operations (i.e. placement depth)

1.7mm for placement depth

See “Recommended Nozzle Heightfor Placement Operations(Placement Depth)” on Page 7 forthe details.

Imaging-based Automatic
Inspection

Using the electrode as a reference is recommended tolocate the center of the LED.

See "Imaging-based Automatic
Inspection" on Page 8 for thedetails.

Note:
2 The recommended conditions/specifications above have been determined under the following verification conditions:
Pick-and-place machine (modular mounter):- YS100 High-Speed General-Purpose Modular (manufactured by Yamaha Motor Co., Ltd.)This document contains tentative information, Nichia may change the contents without notice.

Light Emitting Diode

5/13

SP-QR-C2-210576-2
Mar. 12, 2024

Assembly Precautions for the Nichia 149 Series LEDs

3.75

4-1. Pick-and-Place Nozzle

A

0.5

Φ8.2
Φ7.5
Φ7.2

0.15

A部拡大
Expansion of A

[Unit: mm]

Figure 4. Cross-sectionalview of a nozzle whentransporting an NICHIA 149(単位 Unit: mm)
Series LED to a PCB

Figure 3. Recommended Nozzle Dimensions• As shown in Figure 4, the nozzle tip should only touch theflat corners of the LED’s top surface to hold the LEDs.
Ensure that it does not come in contact with the lens. The
LEDs uses a silicone resin for the lens and internal precoating resin; the silicone resin is soft. If pressure is applied
to the lens, it may cause the lens to be damaged, chipped
and/or delaminated. If the lens is damaged, chipped,delaminated and/or deformed, it may cause the internal
connection to fail causing a catastrophic failure (i.e. the LED
not to illuminate) and/or reliability issues (e.g. the LED tocorrode and/or to become dimmer, the color/directivity tochange, etc.) Ensure that no amount of pressure is applied
to the lens.

4-2. Tape-and-Reel Feeder
Recommended Tape
Removal Position

Correct• Recommended setting for the tape-and-reel feeder.
Tape width:
Feed length:
LED pick up position

16mm
12mm

• Use a tape-and-reel feeder that ensures it does not create
excessive vibrations causing assembly issues.
Example: Electrical (motorized) feeder

Feed Speed: Slow Vibration: Small• When removing the top cover tape, it should be done
adjacent to the target LED (See Figure 5). Otherwise, it may
shake the embossed carrier tape and cause the LED to move
within the tape pocket. This may cause

Incorrect

LED pick up position

Feed Speed: Fast Vibration: Large

Figure 5. Examples of Correct/Incorrect Top Cover Tape Removal Positions- the nozzle to fail to pick up the LED or not to pick it up
properly and shift while on the nozzle during thetransport to the PCB (i.e. pick-up/placement failure)- the LED to hit the feeder cover and become damaged.
This document contains tentative information, Nichia may change the contents without notice.

Light Emitting Diode

6/13

SP-QR-C2-210576-2
Mar. 12, 2024

Assembly Precautions for the Nichia 149 Series LEDs
4-3. Recommended Nozzle Height for
Pick-up Operations
Pick-and-Place Nozzle•

Ensure that the nozzle goes down onto the LED in the tape pocket until the
tip touches the flat surface around the lens.
Pick-up depth: 1.8mm3•

The recommended nozzle height for pick-up operations has been
determined by Nichia under the verification conditions (See Table 5 Note)and may not function as expected with some other pick-and-place machines.
If the pick-up operations are unstable even with using the recommended
nozzle height, adjust the nozzle height appropriate for the pick-and-placemachine being used.

1.8mm below theedge of the tapepocket (i.e. Pick-up
depth)

LED

If the pick point of the nozzle is too high,- it may cause insufficient suction power leading to picking errors (e.g.
the nozzle’s failure to pick/lift the LED into the air, incorrect picking
causing the LED to tilt when in the air).

Embossed Carrier Tape
(Pocket)If the pick point of the nozzle is too low,
- it may cause issues (e.g. causing the embossed carrier tape to shake,causing the tape pocket to deform) leading to picking failures.

Figure 6. Recommended Nozzle Height for Pick-up Operations

4-4. Recommended Nozzle Height forPlacement Operations (Placement Depth)•

If the pick-and-place machine uses the part height as a reference, then therecommended placement depth (i.e. nozzle’s release point) is 1.7mm4 (i.e.
1.7mm below the reference point).
If the release point of the nozzle is too high,- it may cause placement issues (e.g. the LED to stick to the nozzle
after placement, the LED to become soldered to the PCB in a tilted
position, etc.) .

Pick-and-Place Nozzle

1.5mm
3.1mm

PCB
Figure 7. Recommended Nozzle Height for Placement(Placement Depth)Light Emitting DiodeIf the release point of the nozzle is too low,
- excessive forces may be applied to the LED during placement and it
may cause the LED to become damaged.

Placement Depth
1.7mm

Note:
3 If the reference level for the nozzle setting is at the edge of the tape pocket
4 The part height of the NICHIA 149 Series LEDs (i.e. 3.1mm) include the height of thelens protruding out on the package (i.e. 1.5mm). Since the nozzle tip should travel
down to the package surface to hold the LED, the lens height needs to be consideredwhen setting the placement depth. To ensure a better spread of solder paste andprevent issues after reflow soldering, an additional force (i.e. approx. a depth of
0.2mm) should be included in the placement depth settings.
This document contains tentative information, Nichia may change the contents without notice.

7/13

SP-QR-C2-210576-2
Mar. 12, 2024

Assembly Precautions for the Nichia 149 Series LEDs
4-5. Imaging-based Automatic Inspection
Figure 8. Example ofautomatic polarity
detection/recognition
from an image: themachine extracts
information from theimage and determines
the polarity (i.e. Anodeor Cathode)Polarity Detection/Recognition Points

5. Precautions When Reflow
Soldering
1 to 5°C per sec
Pre-heat
180 to 200°C• If a high level of accuracy is required for positioning the LEDs at thetime of placement, Nichia recommends using the electrodes as areference to locate the center of the LED. Since the electrode position
against the outline may vary depending on the LED (i.e.
manufacturing variation) the LED outline should not be used forlocation/positioning purposes.
• If an automatic polarity detector is used for the LEDs, set up theimaging device to detect the mark adjacent to the cathode electrode(i.e. cathode mark). In the example in Figure 8, the equipment
measures the difference in brightness between the two points on thescreen (i.e. green circles in the upper-left and lower right corners in
Figure 11) and determines the polarity. Adjust the equipment settings
to ensure that the cathode mark is in the correct position on thescreen during the imaging-based automatic inspection.

• Reflow soldering must not be performed more than twice.
• Using the recommended reflow soldering conditions (See Figure 9 to the left) as areference, modify if necessary, the recommended reflow conditions specified by the
manufacturer of the solder paste being used.

260°CMax
10sec Max

60sec Max
Above 220°C
120sec Max

Figure 9. Recommended Reflow Soldering Condition(Lead-free Solder)Note:
To ensure that these reflow conditions have no negative effect on the LEDs,
perform sufficient verification prior to use.
• When cooling the LEDs from the peak temperature a gradual cooling slope isrecommended; do not cool the LEDs rapidly.
• During reflow soldering, the heat and atmosphere in the reflow oven may cause theoptical characteristics to degrade. In particular, reflow soldering performed with an
air atmosphere may have a greater negative effect on the optical characteristics
than if a nitrogen atmosphere is used; Nichia recommends using a nitrogen reflow
atmosphere.
This document contains tentative information, Nichia may change the contents without notice.

Light Emitting Diode

8/13

SP-QR-C2-210576-2
Mar. 12, 2024

Assembly Precautions for the Nichia 149 Series LEDs

6. Evaluation of the Effect of Solder Volume
6-1. Evaluation Method/Conditions
The effect of solder volume on the workmanship of the reflow-soldered LEDs (i.e. LED emission failure, number ofsolder balls and amount of LED tilt) was evaluated using nine different evaluation configurations (i.e. three aperture
ratios, three stencil thicknesses) to control the amount of solder paste.
Metal Solder Stencil Aperture Ratio5:
31%, 56% (Nichia’s recommendation), 77%

Metal Solder Stencil Thickness:
100μm, 120μm (Nichia’s recommendation), 150μm

6-2. Evaluation Results
Emission failure, and solder wettability/void percentage- There were no issues with the evaluation conditions (i.e. volume of the solder paste) used.
For more details, refer to Table 6 on the next page.
LED tilt- The amount of LED tilt became larger as the aperture size and thickness of the stencil increased.
- The average amount of LED tilt with the recommended conditions (i.e. 120μm for the stencil thickness, 56% for
the aperture ratio) was 0.052mm.
For more details, refer to Figures 10 and 11 on the next page.

Note:
5 Aperture ratio [%]: Ratio of the metal stencil aperture size to the soldering pad size
This document contains tentative information, Nichia may change the contents without notice.

Light Emitting Diode

9/13

SP-QR-C2-210576-2
Mar. 12, 2024

Assembly Precautions for the Nichia 149 Series LEDs
6-2. Evaluation Results (continued)
Table 6. Evaluation Results (LED Emission/Solder Ball)

Sample size: 60 LEDs per condition

31%

56%
(Recommend)77%

LED emitted

LED emitted

LED emitted

No solder balls were formed

No solder balls were formed

No solder balls were formed

LED emitted

LED emitted

LED emitted

No solder balls were formed

No solder balls were formed

No solder balls were formed

LED emitted

LED emitted

LED emitted

No solder balls were formed

No solder balls were formed

No solder balls were formed

Metal Solder Stencil
Aperture Ratio5

100μm
StencilThickness

120μm(recommend)
150μm

Amount of LED Tilt [mm]

0.20
0.15

Aperture Ratio: 31%
Aperture Ratio: 56%

maxAperture Ratio: 77%
AverageAmount of LED Tilt (mm) = max. – min.

min

0.10

Figure 11. How to Measure the Amount of LED Tilt
0.05

Figure 10. Evaluation Results (LED Tilt)

0.00

100μm

120μm

150μm

Sample size: 60 LEDs per condition (i.e. stencil thickness)
This document contains tentative information, Nichia may change the contents without notice.

Light Emitting Diode

10/13

SP-QR-C2-210576-2
Mar. 12, 2024

Assembly Precautions for the Nichia 149 Series LEDs

7. Evaluation of Self-Alignment Performance
7-1. Evaluation Method/Conditions
The self-alignment performance of the reflow-soldered LEDs was evaluated using the following evaluation
method/conditions:- Nine different evaluation configurations (i.e. three aperture ratios, three stencil thicknesses) to control the amountof solder paste- Evaluation LEDs were placed on a specified point (i.e. ∆x,y = 0.2mm) and then intentionally rotated (i.e. ∆θ = 5°)- The amounts of parallel/angular deviation from the center of the soldering pad pattern were measured for eachstencil thickness/aperture ratio (i.e. solder volume).
Metal Solder Stencil Aperture Ratio5:
31%, 56% (Nichia’s recommendation), 77%

Metal Solder Stencil Thickness:
100μm, 120μm (Nichia’s recommendation), 150μm

LED Parallel/Angular Misalignment:
See Figure 7 on the next page.

7-2. Evaluation Results
The LEDs with the deviations above moved to positions that were sufficiently close to the correct one (i.e. the centerof the soldering pad pattern) by themselves during reflow soldering (i.e. surface tension-driven self-alignment) andno issues (e.g. causing the LED not to illuminate) were observed. For more details, refer to Tables 12 and 13 on thenext page.

This document contains tentative information, Nichia may change the contents without notice.

Light Emitting Diode

11/13

SP-QR-C2-210576-2
Mar. 12, 2024

Assembly Precautions for the Nichia 149 Series LEDs
7-2. Evaluation Results (continued)
Placement with a Misalignment of ∆x,y = 0.2mm
Stencil Thickness：100μm

Stencil Thickness：120μm

0.30

0.20

0.10

0.10

0.10

-0.10

Aperture Ratio: 56%
LED Placement Position

-0.30

-0.20

-0.10

0.00

0.10

0.20

Aperture Ratio: 56%
LED Placement Position

-0.30

0.30

-0.20

-0.10

0.00

0.10

0.20

Aperture Ratio: 31%
Aperture Ratio: 56%-0.20

Aperture Ratio: 77%

-0.30

0.00
-0.10

Aperture Ratio: 31%-0.20

Aperture Ratio: 77%

-0.30

0.00
-0.10

Aperture Ratio: 31%-0.20⊿y [mm]

0.20

0.00

Stencil Thickness：150μm

0.30

0.20

⊿y [mm]⊿y [mm]0.30

Aperture Ratio: 77%
LED Placement Position

-0.30
0.30

-0.30

⊿x [mm]⊿x [mm]

-0.20

-0.10

0.00

0.10

0.20

0.30

⊿x [mm]Figure 12. Evaluation Results (Parallel misalignment)
Sample size: 10 LEDs for each condition

Amount of Rotation from theReference Angle [°]0.5

Placement with a Misalignment of θ=+5°
Aperture Ratio: 31%
Aperture Ratio: 56%
Aperture Ratio: 77%
Average LED Rotation

0.4
0.3

Table 7. LED Misalignment Conditions
Parallel (LED Placement Position)∆x,y = 0.2mm

Angular (LED Rotation)∆θ = 5°

0.2
0.1

0.0
100μm

120μm
Stencil Thickness

150μm

Figure 13. Evaluation Results (Angular misalignment)
Sample size: 10 LEDs for each condition＋ Center of the soldering pad pattern＋ LED center for placement (i.e. center determined based on the electrodes’ position)
This document contains tentative information, Nichia may change the contents without notice.

Light Emitting Diode

12/13

SP-QR-C2-210576-2
Mar. 12, 2024

Assembly Precautions for the Nichia 149 Series LEDs
Disclaimer
This application note is a controlled document of Nichia Corporation (Nichia) published to provide technical information/data forreference purposes only. By using this application note, the user agrees to the following:• This application note has been prepared solely for reference on the subject matters incorporated within it and Nichia makes noguarantee that customers will see the same results for their chosen application.
• The information/data contained herein are only typical examples of performances and/or applications for the product. Nichia
does not provide any guarantees or grant any license under or immunity from any intellectual property rights or other rights
held by Nichia or third parties.
• Nichia makes no representation or warranty, express or implied, as to the accuracy, completeness or usefulness of any
information contained herein. In addition, Nichia shall not be liable for any damages or losses arising out of exploiting, using,or downloading or otherwise this document, or any other acts associated with this document.
• The content of this application note may be changed without any prior or subsequent notice.
• Copyrights and all other rights regarding the content of this document are reserved by Nichia or the right holders who havepermitted Nichia to use the content. Without prior written consent of Nichia, republication, reproduction, and/or redistributionof the content of this document in any form or by any means, whether in whole or in part, including modifications or derivative
works hereof, is strictly prohibited.

491 Oka, Kaminaka-Cho, Anan-Shi,
TOKUSHIMA 774-8601, JAPAN
Phone: +81-884-22-2311 Fax: +81-884-21-0148

NICHIA CORPORATION
http://www.nichia.co.jp

This document contains tentative information, Nichia may change the contents without notice.

Light Emitting Diode

13/13

SP-QR-C2-210576-2
Mar. 12, 2024