AES 200 Prepreg

Product Information
Description

Lamination

AES 200 Prepreg, an offering within the Advanced
Electronic Solutions portfolio, is designed to meet next
generation needs of 5G and 6G platforms, anticipating
requirements for both wireless and digital future designs.
AES 200 Prepreg is an extremely low dielectric constantand low loss circuit material.

As with any thermoplastic material, AES 200 Prepreg issuitable for single lamination constructions and designs.
However, where multiple lamination cycles may be necessary,
review of the design, including copper area, thickness
and number of sequential lamination cycles necessary, isrecommended, prior to production commitment.

This product comprises fluoropolymer-based resin, preimpregnated into glass reinforcement to provide a thinand flexible adhesive prepreg.

A suggested lamination press cycle is shown in Figure 1.
Pressure can be varied to balance circuit registration,
layer to layer adhesion, remaining copper area and fillrequirements. Suitability for use should be verified for eachnew design. AES 200 Prepreg requires no drying or special
storage conditions; room temperature with dust protectionis adequate. Care should be taken to ensure that adhesive
surfaces are clean and particle free prior to lamination.

AES 200 Prepreg offers benefits of superior electricaland thermal performance, typical of fluoropolymers, andovercomes traditional limitations associated with current
PTFE laminates.
Key Features and Benefits• Low loss tangent and dielectric constant.

Figure 1. Recommended AES 200 Prepreg
Lamination Press Cycle• Excellent compatibility with standard PCB processing.

• Negligible variance in dielectric constant and thicknessfor excellent reproducibility of results.
Construction Options

Temperature• Complete encapsulation of traces and outstanding
adhesion to copper foil.

2 °C/min

2 °C/min

5 min
40 °CPressure• Improved adhesion to plating chemistries over“standard” PTFE.

60 min280 °C

40 °C

100–200 psi(6.9–13.8 bar)
5 min

• Panel Sizes: 12” x 18”

0 atm(0 kPa)0 psi (0 bar)
0 atm
(0 kPa)Vacuum• Thickness: 125 μm

0 psi (0 bar)

1 atm (101.3 kPa)

TimeAES 200 Prepreg

Table 1. Properties of AES 200 Prepreg1Property

125 µmDirection

Units

Test ConditionsTest Method

Dielectric Constant

2.310.0008—

10 GHz
23 °C/24 hr/50% RH

IPC TM-650 2.5.5.15

Dissipation Factor

In-plane(X/Y)

IPC TM-650 2.5.5.15

Melting Temperature (Tm)

260

—°C

1 heat method

ASTM D3418

Decomposition Temperature (Td)

471

—°C

5% weight loss

IPC TM-650 2.3.40

Thickness

125.0

Zµm

—

IPC TM-650 2.2.18

Flammability

V-0—

—

—

UL94

Moisture Absorption

0.02

—

%E1/105 + D48/50

IPC TM-650 2.6.2.1

Density

2.16

—g/cm

C-24/23/50

IPC TM-650 2.3.5

Electrical Properties

Thermal Properties

Physical Properties

3This table gives properties (not specifications) based on production performance. Chemours does not make any express or implied warranty that these products will have thesetypical properties.

1For more information, visit www.teflon.com/electronics© 2024 The Chemours Company FC, LLC. Chemours™ and the Chemours Logo are trademarks of The Chemours Company.

C-11969

NO PART OF THIS MATERIAL MAY BE REPRODUCED, STORED IN A RETRIEVAL SYSTEM OR TRANSMITTED IN ANY FORM OR BY ANY MEANS ELECTRONIC, MECHANICAL, PHOTOCOPYING, RECORDING OR OTHERWISEWITHOUT THE PRIOR WRITTEN PERMISSION OF CHEMOURS.

0324

The information set forth herein is furnished free of charge and based on technical data that Chemours believes to be reliable. It is intended for use by persons having technical skill, at their own
discretion and risk. The handling precaution information contained herein is given with the understanding that those using it will satisfy themselves that their particular conditions of use present
no health or safety hazards. Because conditions of product use are outside our control, Chemours makes no warranties, express or implied, and assumes no liability in connection with any useof this information. As with any material, evaluation of any compound under end-use conditions prior to specification is essential. Nothing herein is to be taken as a license to operate under or arecommendation to infringe any patents.