Teflon™ FFR 750
Fluoroplastic Foam Resin

Product Information
Description
Teflon FFR 750 is a fluoroplastic resin compounded witha foam nucleating package. This resin is supplied as whitepellets and is used in a nitrogen gas-injected foam extrusion
process to produce uniform foam cells in the dielectric
insulation. Foaming the fluoroplastic reduces its dielectric
constant, providing opportunities for miniaturization andweight savings. Foamed insulation of Teflon™ FFR 750
produces cables for high frequency signal transmission withminimal distortion.
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Teflon™ FFR 750 is ideal for producing coaxial cable coresin a broad range of sizes. A typical coaxial cable core would
have conductor sizes of 30 AWG or greater, wall thickness of
0.010 in or greater, with void content from 20% to 60%.
These voids are closed cell in nature and range from
0.0007 in (0.018 mm) to 0.005 in (0.127 mm) in diameter.
Achievable void content will vary based on wall thickness andprocessing conditions.

Safety Precautions
Before using Teflon™ FFR 750 resin, refer to the Safety
Data Sheet and the latest edition of “The Guide to the Safe
Handling of Fluoropolymer Resins,” published by The Societyof the Plastics Industry, Inc. (www.fluoropolymers.org) or by
PlasticsEurope (www.plasticseurope.org).
Open and use containers only in well-ventilated areasusing local exhaust ventilation (LEV). Vapors and fumes
liberated during hot processing of Teflon™ FFR 750 should
be exhausted completely from the work area. Contaminationof tobacco with these polymers should be avoided. Vapors
and fumes liberated during hot processing that are notproperly exhausted, or from smoking tobacco or cigarettes
contaminated with Teflon™ FFR 750, may cause flu-likesymptoms, such as chills, fever, and sore throat. This may notoccur until several hours after exposure and will typically passwithin about 24 hours.
Mixtures of Teflon™ fluoroplastic resin with some finely divided
metals, such as magnesium or aluminum, can be flammable or
explosive under some conditions.

Authorization
Chemours has developed technology for the compounding
and processing of these products. Some of that technology
is protected by patents. Customers wishing to purchase andprocess these products should consult their Chemours sales
representative with a view to obtaining a license authorizing
the purchaser to process the resin into cable primaries ofvarious dimensions and to sell these foamed primaries infinal cables.

Processing
Teflon™ FFR 750 can be fed directly to a conventional singlescrew extruder with nitrogen gas injection. The processcontact metals must be high-nickel, low-iron alloys suitablefor fluoroplastic processing. The process should include
devices to monitor diameter, capacitance, and gas flow.
When adding color concentrate, use one compounded in FEP
fluoroplastic. Color addition may affect cell formation andcapacitance, requiring process adjustment.
Insulation performance is determined by extruder output,
wire line speed, and void content. Void content is controlled
by nitrogen flow rate, process temperatures, and quench
point. It is best for the voids to grow after the melt is drawn
down onto the wire. Elongated voids in the insulation indicate
early growth of the cells in the draw-down cone.
More detailed processing information is available tocustomers through their Chemours sales representative.

Teflon™ FFR 750

Fluoroplastic Foam Resin

Packaging

Storage and Handling

Teflon FFR 750 is supplied as pellets packaged in 55-lb(25-kg) bags or 1,000-kg boxes.

The properties of Teflon™ FFR 750 resin are not affected bystorage time. Ambient storage conditions should be designed
to avoid airborne contamination and water condensation on
the resin when it is removed from containers.

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Table 1: Typical Property Data for Teflon™ FFR 750 Fluoroplastic Foam Resin
Property

Test Method1

Unit

Typical Value

PROCESSING
Melt Flow Rate (MFR at 372 °C [702 °F]/5.0 kg)

ISO 12086

D 2116g/10 min12Melting Point—D 4591°C (°F)

260–290 (500–554)

Specific Gravity

ISO 1183

D 792—

2.14

1 kHz

IEC 250

D 150—

2.04

1 MHz

IEC 250

D 150—

2.04

1 GHz

IEC 250

D 2520—

2.04

ELECTRICAL
Dielectric ConstantDissipation Factor
1 kHz

IEC 250

D 150—

0.0001

1 MHz

IEC 250

D 150—

0.0003

1 GHz

IEC 250

D 2520—0.0004

Typical properties are not suited for specification purposes.
ASTM method unless otherwise specified

1

HOW TO USE THE TEFLON™ BRAND NAME WITH YOUR PRODUCT
Teflon™ is a registered trademark of Chemours for its brand of fluoroplastic resins, coatings, films, and dispersions. The Teflon™ brand name is licensed by Chemours in association with approved applications.
Without a trademark license, customers may not identify their product with the Teflon™ brand name, as Chemours does not sell such offerings with the Teflon™ trademark. Unlicensed customers may refer tothe Chemours product offering with only the Chemours name and product code number descriptor as Chemours sells its product offerings. There are no fair use rights or exhaustion of rights to use the Teflon™
trademark from buying from Chemours, a Chemours customer, or a distributor without a trademark license from Chemours.
If you are interested in applying for a trademark licensing agreement for the Teflon™ brand, please visit www.teflon.com/license
CAUTION: Do not use or resell Chemours™ materials in medical applications involving implantation in the human body or contact with internal body fluids or tissues unless agreed to by Seller in a writtenagreement covering such use. For further information, please contact your Chemours representative. For medical emergencies, spills, or other critical situations, call (866) 595-1473 within the UnitedStates. For those outside of the United States, call (302) 773-2000.
The information set forth herein is furnished free of charge and based on technical data that Chemours believes to be reliable. It is intended for use by persons having technical skill, at their own
discretion and risk. The handling precaution information contained herein is given with the understanding that those using it will satisfy themselves that their particular conditions of use present
no health or safety hazards. Because conditions of product use are outside our control, Chemours makes no warranties, express or implied, and assumes no liability in connection with any useof this information. As with any material, evaluation of any compound under end-use conditions prior to specification is essential. Nothing herein is to be taken as a license to operate under or arecommendation to infringe any patents.
NO PART OF THIS MATERIAL MAY BE REPRODUCED, STORED IN A RETRIEVAL SYSTEM OR TRANSMITTED IN ANY FORM OR BY ANY MEANS ELECTRONIC, MECHANICAL, PHOTOCOPYING, RECORDING OR OTHERWISEWITHOUT THE PRIOR WRITTEN PERMISSION OF CHEMOURS.

For more information, visit teflon.com/industrial
For sales and technical support contacts, visit teflon.com/industrialglobalsupport© 2020 The Chemours Company FC, LLC. Teflon™ and any associated logos are trademarks or copyrights of The Chemours Company FC, LLC. Chemours™ and the Chemours Logo aretrademarks of The Chemours Company.
Replaces: K-22041-2
C-10100 (3/20)