InvenSense Inc.
1197 Borregas Ave, Sunnyvale, CA 94089 U.S.A.
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104
Website: www.invensense.com

Document Number: PS-MPU-9150A-00
Revision: 4.3
Release Date: 9/18/2013

MPU-9150
Product Specification
Revision 4.3

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MPU-9150 Product Specification

Document Number: PS-MPU-9150A-00
Revision: 4.3
Release Date: 9/18/2013

CONTENTS
1REVISION HISTORY ...................................................................................................................................52

PURPOSE AND SCOPE .............................................................................................................................6

3

PRODUCT OVERVIEW ...............................................................................................................................7
3.1

MPU-9150 OVERVIEW ........................................................................................................................74

APPLICATIONS...........................................................................................................................................85

FEATURES ..................................................................................................................................................9

6

7

5.1

GYROSCOPE FEATURES .......................................................................................................................95.2

ACCELEROMETER FEATURES ...............................................................................................................9

5.3

MAGNETOMETER FEATURES.................................................................................................................9

5.4

ADDITIONAL FEATURES ........................................................................................................................95.5

MOTIONPROCESSING.........................................................................................................................10

5.6

CLOCKING .........................................................................................................................................10

ELECTRICAL CHARACTERISTICS .........................................................................................................11
6.1

GYROSCOPE SPECIFICATIONS ............................................................................................................11

6.2

ACCELEROMETER SPECIFICATIONS.....................................................................................................12

6.3

MAGNETOMETER SPECIFICATIONS ......................................................................................................13

6.4

ELECTRICAL AND OTHER COMMON SPECIFICATIONS............................................................................14

6.5

ELECTRICAL SPECIFICATIONS, CONTINUED .........................................................................................15

6.6

ELECTRICAL SPECIFICATIONS, CONTINUED .........................................................................................16

6.7

ELECTRICAL SPECIFICATIONS, CONTINUED .........................................................................................17

6.8

I C TIMING CHARACTERIZATION..........................................................................................................18

6.9

ABSOLUTE MAXIMUM RATINGS ...........................................................................................................192

APPLICATIONS INFORMATION ..............................................................................................................20
7.1

PIN OUT AND SIGNAL DESCRIPTION ....................................................................................................20

7.2

TYPICAL OPERATING CIRCUIT.............................................................................................................21

7.3

BILL OF MATERIALS FOR EXTERNAL COMPONENTS ..............................................................................21

7.4

RECOMMENDED POWER-ON PROCEDURE ...........................................................................................22

7.5

BLOCK DIAGRAM ...............................................................................................................................23

7.6

OVERVIEW ........................................................................................................................................23

7.7

THREE-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING................................24

7.8

THREE-AXIS MEMS ACCELEROMETER WITH 16-BIT ADCS AND SIGNAL CONDITIONING ........................24

7.9

THREE-AXIS MEMS MAGNETOMETER WITH 13-BIT ADCS AND SIGNAL CONDITIONING .........................24

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MPU-9150 Product Specification

7.10

DIGITAL MOTION PROCESSOR ............................................................................................................24

7.11

PRIMARY I C .....................................................................................................................................24

7.12

AUXILIARY I C SERIAL INTERFACE ......................................................................................................25

7.13

SELF-TEST ........................................................................................................................................25

7.14

MPU-9150 SOLUTION FOR 10-AXIS SENSOR FUSION USING I C INTERFACE ........................................26

7.15

PROCEDURE FOR DIRECTLY ACCESSING THE AK8975 3-AXIS COMPASS .............................................28

7.16

INTERNAL CLOCK GENERATION ..........................................................................................................28

7.17

SENSOR DATA REGISTERS .................................................................................................................29

7.18

FIFO ................................................................................................................................................29

7.19

INTERRUPTS ......................................................................................................................................29

7.20

DIGITAL-OUTPUT TEMPERATURE SENSOR ..........................................................................................29

7.21

BIAS AND LDO ..................................................................................................................................30

7.22

CHARGE PUMP ..................................................................................................................................30

2

2

2

8

PROGRAMMABLE INTERRUPTS............................................................................................................31

9

DIGITAL INTERFACE ...............................................................................................................................322

9.1

I C SERIAL INTERFACE .......................................................................................................................32

9.2

I C INTERFACE ..................................................................................................................................32

9.3

I C COMMUNICATIONS PROTOCOL ......................................................................................................32

9.4

I C TERMS ........................................................................................................................................352
2
2

10 SERIAL INTERFACE CONSIDERATIONS ...............................................................................................36
10.1

MPU-9150 SUPPORTED INTERFACES.................................................................................................36

10.2

LOGIC LEVELS ...................................................................................................................................36

10.3

LOGIC LEVELS DIAGRAM ....................................................................................................................37

11 ASSEMBLY ...............................................................................................................................................38
11.1

ORIENTATION OF AXES ......................................................................................................................38

11.2

PACKAGE DIMENSIONS ......................................................................................................................39

11.3

PCB DESIGN GUIDELINES: .................................................................................................................40

11.4

ASSEMBLY PRECAUTIONS ..................................................................................................................41

11.5

REFLOW SPECIFICATION ....................................................................................................................43

11.6

STORAGE SPECIFICATIONS.................................................................................................................44

11.7

PACKAGE MARKING SPECIFICATION ....................................................................................................44

11.8

TAPE & REEL SPECIFICATION .............................................................................................................45

11.9

LABEL ...............................................................................................................................................46

11.10

PACKAGING...................................................................................................................................47

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MPU-9150 Product Specification

11.11

Document Number: PS-MPU-9150A-00
Revision: 4.3
Release Date: 9/18/2013

REPRESENTATIVE SHIPPING CARTON LABEL ...................................................................................48

12 RELIABILITY .............................................................................................................................................49
12.1

QUALIFICATION TEST POLICY .............................................................................................................49

12.2

QUALIFICATION TEST PLAN ................................................................................................................49

13 ENVIRONMENTAL COMPLIANCE...........................................................................................................50

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MPU-9150 Product Specification

1

Document Number: PS-MPU-9150A-00
Revision: 4.3
Release Date: 9/18/2013

Revision History

RevisionDate
05/27/2011
06/14/2011

Revision
1.0
2.0

10/21/2011

2.1

10/24/2011

3.0

12/23/2011

3.1

05/14/2012

4.0

8/28/2013

4.1

9/13/2013

4.2

Added Gyroscope specifications (section 6.1)
Added Accelerometer specifications (section 6.2)
Updated Electrical Other Common Specifications (section 6.3)
Updated latch-up information (section 6.9)
Updated Block Diagram (section 7.5)
Update Self-Test description (section 7.13)
Updated PCB design guidelines (section 11.3)
Updated packing and shipping information (sections 11.8, 11.9, 11.10, 11.11)
Updated reliability references (section 12.2)
Removed “Advanced Information” watermark. Updated section 2.0, 6.5, 6.7,
1.7, 7.2, 7.15, 8, 10.3 and 11.8. Removed section 8.1.
Updated Section 6.

9/18/2013

4.3

Updated Section 5.5 & 8.

Description
Initial Release of Product Specification
Modified for Rev C Silicon (sections 5.2, 6.2, 6.4, 6.6, 8.2, 8.3, 8.4)
Edits for clarity (several sections)
Updated Supply current vs. operating modes (sections 5.3, 5.4, 6.4)
Modified Self-Test Response of Accelerometers (section 6.2)
Modified absolute maximum rating for acceleration (section 6.9)
Updated latch up current rating (sections 6.9, 12.2)
Modified package dimensions and PCB design guidelines (sections 11.2, 11.3)
Updated assembly precautions (section 11.4)
Updated qualification test plan (section 12.2)
Edits for clarity (several sections)
Modified for Rev D Silicon (sections 6.2, 8.2, 8.3, 8.4)
Edits for Clarity (several sections)
Updated package dimensions (section 11.2).

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Document Number: PS-MPU-9150A-00
Revision: 4.3
Release Date: 9/18/2013

Purpose and Scope

This product specification provides information regarding the electrical specification and design related
information for the MPU-9150™ Motion Processing Unit™ or MPU™.
Electrical characteristics are based upon design analysis and simulation results only. Specifications are
subject to change without notice. For references to register map and descriptions of individual registers,
please refer to the MPU-9150 Register Map and Register Descriptions document.

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3

Product Overview

3.1

MPU-9150 Overview

Document Number: PS-MPU-9150A-00
Revision: 4.3
Release Date: 9/18/2013

MotionInterface™ is becoming a “must-have” function being adopted by smartphone and tablet
manufacturers due to the enormous value it adds to the end user experience. In smartphones, it finds use inapplications such as gesture commands for applications and phone control, enhanced gaming, augmented
reality, panoramic photo capture and viewing, and pedestrian and vehicle navigation. With its ability to
precisely and accurately track user motions, MotionTracking technology can convert handsets and tablets
into powerful 3D intelligent devices that can be used in applications ranging from health and fitness
monitoring to location-based services. Key requirements for MotionInterface enabled devices are small
package size, low power consumption, high accuracy and repeatability, high shock tolerance, and application
specific performance programmability – all at a low consumer price point.
The MPU-9150 is the world’s first integrated 9-axis MotionTracking device that combines a 3-axis MEMS
gyroscope, a 3-axis MEMS accelerometer, a 3-axis MEMS magnetometer and a Digital Motion Processor™
(DMP™) hardware accelerator engine. The MPU-9150 is an ideal solution for handset and tablet
applications, game controllers, motion pointer remote controls, and other consumer devices. The MPU9150’s 9-axis MotionFusion combines acceleration and rotational motion plus heading information into asingle data stream for the application. This MotionProcessing™ technology integration provides a smaller
footprint and has inherent cost advantages compared to discrete gyroscope, accelerometer, plus
magnetometer solutions. The MPU-9150 is also designed to interface with multiple non-inertial digital2
sensors, such as pressure sensors, on its auxiliary I C port to produce a 10-Axis sensor fusion output. Therd
MPU-9150 is a 3 generation motion processor and is footprint compatible with the MPU-60X0 and MPU30X0 families.
The MPU-9150 features three 16-bit analog-to-digital converters (ADCs) for digitizing the gyroscope outputs,
three 16-bit ADCs for digitizing the accelerometer outputs and three 13-bit ADCs for digitizing themagnetometer outputs. For precision tracking of both fast and slow motions, the parts feature a userprogrammable gyroscope full-scale range of ±250, ±500, ±1000, and ±2000°/sec (dps), a userprogrammable accelerometer full-scale range of ±2g, ±4g, ±8g, and ±16g, and a magnetometer full-scale
range of ±1200µT.
The MPU-9150 is a multi-chip module (MCM) consisting of two dies integrated into a single LGA package.
One die houses the 3-Axis gyroscope and the 3-Axis accelerometer. The other die houses the AK8975 3Axis magnetometer from Asahi Kasei Microdevices Corporation.
An on-chip 1024 Byte FIFO buffer helps lower system power consumption by allowing the system processor
to read the sensor data in bursts and then enter a low-power mode as the MPU collects more data. With all
the necessary on-chip processing and sensor components required to support many motion-based use
cases, the MPU-9150 uniquely supports a variety of advanced motion-based applications entirely on-chip.
The MPU-9150 thus enables low-power MotionProcessing in portable applications with reduced processing
requirements for the system processor. By providing an integrated MotionFusion output, the DMP in the
MPU-9150 offloads the intensive MotionProcessing computation requirements from the system processor,
minimizing the need for frequent polling of the motion sensor output.
2

Communication with all registers of the device is performed using I C at 400 kHz. Additional features include
an embedded temperature sensor and an on-chip oscillator with ±1% variation over the operating
temperature range.
By leveraging its patented and volume-proven Nasiri-Fabrication platform, which integrates MEMS wafers
with companion CMOS electronics through wafer-level bonding, InvenSense has driven the MPU-9150
package size down to a revolutionary footprint of 4x4x1mm (LGA), while providing the highest performance,
lowest noise, and the lowest cost semiconductor packaging required for handheld consumer electronic
devices. The part features a robust 10,000g shock tolerance, and has programmable low-pass filters for thegyroscopes, accelerometers, magnetometers, and the on-chip temperature sensor.

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Document Number: PS-MPU-9150A-00
Revision: 4.3
Release Date: 9/18/2013

Applications
















BlurFree™ technology (for Video/Still Image Stabilization)
AirSign™ technology (for Security/Authentication)
TouchAnywhere™ technology (for “no touch” UI Application Control/Navigation)
MotionCommand™ technology (for Gesture Short-cuts)
Motion-enabled game and application framework
InstantGesture™ iG™ gesture recognition
Location based services, points of interest, and dead reckoning
Handset and portable gaming
Motion-based game controllers
3D remote controls for Internet connected DTVs and set top boxes, 3D mice
Wearable sensors for health, fitness and sports
Toys
Pedestrian based navigation
Navigation
Electronic Compass

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Document Number: PS-MPU-9150A-00
Revision: 4.3
Release Date: 9/18/2013

Features5.1

Gyroscope Features

The triple-axis MEMS gyroscope in the MPU-9150 includes a wide range of features:








5.2

Digital-output X-, Y-, and Z-Axis angular rate sensors (gyroscopes) with a user-programmable fullscale range of ±250, ±500, ±1000, and ±2000°/sec
External sync signal connected to the FSYNC pin supports image, video and GPS synchronization
Integrated 16-bit ADCs enable simultaneous sampling of gyros
Enhanced bias and sensitivity temperature stability reduces the need for user calibration
Improved low-frequency noise performance
Digitally-programmable low-pass filter
Factory calibrated sensitivity scale factor
User self-test
Accelerometer Features

The triple-axis MEMS accelerometer in MPU-9150 includes a wide range of features:







5.3

Digital-output 3-Axis accelerometer with a programmable full scale range of ±2g, ±4g, ±8g and ±16g
Integrated 16-bit ADCs enable simultaneous sampling of accelerometers while requiring no external
multiplexer
Orientation detection and signaling
Tap detection
User-programmable interrupts
High-G interrupt
User self-test
Magnetometer Features

The triple-axis MEMS magnetometer in MPU-9150 includes a wide range of features:






5.4

3-axis silicon monolithic Hall-effect magnetic sensor with magnetic concentrator
Wide dynamic measurement range and high resolution with lower current consumption.
Output data resolution is 13 bit (0.3 µT per LSB)
Full scale measurement range is ±1200 µT
Self-test function with internal magnetic source to confirm magnetic sensor operation on end
products
Additional Features

The MPU-9150 includes the following additional features:










9-Axis MotionFusion via on-chip Digital Motion Processor (DMP)
2
Auxiliary master I C bus for reading data from external sensors (e.g., pressure sensor)
2
Flexible VLOGIC reference voltage supports multiple I C interface voltages
Smallest and thinnest package for portable devices: 4x4x1mm LGA
Minimal cross-axis sensitivity between the accelerometer, gyroscope and magnetometer axes
1024 byte FIFO buffer reduces power consumption by allowing host processor to read the data inbursts and then go into a low-power mode as the MPU collects more data
Digital-output temperature sensor
User-programmable digital filters for gyroscope, accelerometer, and temp sensor
10,000 g shock tolerant

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


5.5

Document Number: PS-MPU-9150A-00
Revision: 4.3
Release Date: 9/18/2013

2400kHz Fast Mode I C for communicating with all registers
MEMS structure hermetically sealed and bonded at wafer level
RoHS and Green compliant
MotionProcessing








5.6

Internal Digital Motion Processing™ (DMP™) engine supports 3D MotionProcessing and gesturerecognition algorithms
The MPU-9150 collects gyroscope, accelerometer and magnetometer data while synchronizing data
sampling at a user defined rate. The total dataset obtained by the MPU-9150 includes 3-Axis
gyroscope data, 3-Axis accelerometer data, 3-Axis magnetometer data, and temperature data.
The FIFO buffers the complete data set, reducing timing requirements on the system processor byallowing the processor burst read the FIFO data. After burst reading the FIFO data, the systemprocessor can save power by entering a low-power sleep mode while the MPU collects more data.
Programmable interrupt supports features such as gesture recognition, panning, zooming, scrolling,
tap detection, and shake detection
Digitally-programmable low-pass filters.
Low-power pedometer functionality allows the host processor to sleep while the DMP maintains thestep count.
ClockingOn-chip timing generator ±1% frequency variation over full temperature range
Optional external clock inputs of 32.768kHz or 19.2MHz

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MPU-9150 Product Specification

6

Electrical Characteristics

6.1

Gyroscope Specifications

Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.465V, VLOGIC= 1.8V±5% or VDD, TA = 25°C
PARAMETERGYROSCOPE SENSITIVITY
Full-Scale Range

Gyroscope ADC Word Length
Sensitivity Scale Factor

Sensitivity Scale Factor Tolerance
Sensitivity Scale Factor Variation Over
Temperature
Nonlinearity
Cross-Axis Sensitivity
GYROSCOPE ZERO-RATE OUTPUT (ZRO)
Initial ZRO Tolerance
ZRO Variation Over Temperature
GYROSCOPE NOISE PERFORMANCE
Total RMS Noise
Rate Noise Spectral Density

CONDITIONSMIN

FS_SEL=0
FS_SEL=1
FS_SEL=2
FS_SEL=3

TYP

MAX

±0.04

º/s
º/s
º/s
º/s
bits
LSB/(º/s)
LSB/(º/s)
LSB/(º/s)
LSB/(º/s)%%/°CBest fit straight line; 25°C

0.2
±2

%
%

Component level (25°C)-40°C to +85°C
FS_SEL=0
DLPFCFG=2 (92Hz)
At 10Hz

±20
±20

º/s
º/s

0.06
0.005

º/s-rmsº/s/√Hz

FS_SEL=0
FS_SEL=1
FS_SEL=2
FS_SEL=3
25°C-40°C to +85°C

GYROSCOPE MECHANICALFREQUENCIES
X-AxisY-AxisZ-AxisLOW PASS FILTER RESPONSE

±250
±500
±1000
±2000
16
131
65.5
32.8
16.4

UNITS

-3

30
27
24

+3

33
30
27

36
33
30

kHz
kHz
kHz

Programmable Range

5

256

Hz

Programmable
DLPFCFG=0
to ±1º/s of Final

4

8,000

Hz

OUTPUT DATA RATEGYROSCOPE START-UP TIMEZRO Settling

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30

ms

NOTES

Document Number: PS-MPU-9150A-00
Revision: 4.3
Release Date: 9/18/2013

MPU-9150 Product Specification

6.2

Accelerometer Specifications

Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.465V, VLOGIC= 1.8V±5% or VDD, TA = 25°C
PARAMETERACCELEROMETER SENSITIVITY
Full-Scale Range

ADC Word Length
Sensitivity Scale Factor

Initial Calibration Tolerance
Sensitivity Change vs. Temperature
Nonlinearity
ZERO-G OUTPUT
Initial Calibration Tolerance

Change over specified temperature –Component level -25°C to 85°C

CONDITIONSMIN

AFS_SEL=0
AFS_SEL=1
AFS_SEL=2
AFS_SEL=3
Output in two’s complement format
AFS_SEL=0
AFS_SEL=1
AFS_SEL=2
AFS_SEL=3

TYP

MAX

UNITS

AFS_SEL=0, -40°C to +85°C
Best Fit Straight Line

±2
±4
±8
±16
16
16,384
8,192
4,096
2,048
±3
±0.02
0.5

g
g
g
g
bits
LSB/g
LSB/g
LSB/g
LSB/g
%
%/°C
%

X and Y axes
Z axis

±80
±150

mg
mg

X & Y Axis
Z Axis

±0.75

mg/°C
mg/°C

±1.50

NOISE PERFORMANCEPower Spectral Density
Total RMS Noise

X, Y & Z Axes, @10Hz,
AFS_SEL=0 & ODR=1kHz
AFS = 0 @100Hz

400

g/√Hz4

mg-rmsLOW PASS FILTER RESPONSE
Programmable Range

5

260

Hz

Programmable Range

4

1,000

Hz

OUTPUT DATA RATEINTELLIGENCE FUNCTION
INCREMENT

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Revision: 4.3
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MPU-9150 Product Specification

6.3

Magnetometer Specifications

Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.465V, VLOGIC= 1.8V±5% or VDD, TA = 25°C
The information in the following table is from the AKM AK8975 datasheet.
PARAMETERMAGNETOMETER SENSITIVITY
Full-Scale Range
ADC Word Length
Sensitivity Scale Factor
ZERO-FIELD OUTPUT
Initial Calibration Tolerance

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CONDITIONS

MIN

TYP

0.285

±1200
13
0.3

Output in two’s complement format-1000

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MAX

UNITS

0.315

µT
bits
µT /LSB

1000

LSB

NOTES

MPU-9150 Product Specification

6.4

Document Number: PS-MPU-9150A-00
Revision: 4.3
Release Date: 9/18/2013

Electrical and Other Common Specifications

Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.465V, VLOGIC= 1.8V±5% or VDD, TA = 25°C
PARAMETERTEMPERATURE SENSOR
Range

CONDITIONS

Sensitivity
Temperature Offset
Linearity
VDD POWER SUPPLY
Operating Voltages
Power Supply Ramp Rate
OPERATING CURRENT

Untrimmed
35oC
Best fit straight line (-40°C to +85°C)

Accel at 1kHz
sample rate
Magnetometer at
8Hz repetition rate

Power Supply Ramp Rate
Normal Operating Current
TEMPERATURE RANGE
Specified Temperature
Range

Units
°C
LSB/ºC
LSB
°C

3.465
100

V
ms

Gyro + Accel(Magnetometer and DMP disabled)
Accel + Magnetometer(Gyro and DMP disabled)

3.9

mA

900

µA

Magnetometer only
(DMP, Gyro, and Accel disabled)

350

µA

10
20
70
140

µA
µA
µA
µA

6

mA

6

µA

1.25 Hz update rate
5 Hz update rate
20 Hz update rate
40 Hz update rate
100% Duty Cycle

Full-Chip Idle Mode Supply
Current
VLOGIC REFERENCE
VOLTAGE
Voltage RangeMAX-40 to
+85
340
-521
±1
2.375

Gyro at all rates

Magnetometer Full Power
Mode Current

TYP

Monotonic ramp. Ramp rate is 10% to 90% of the final value

Normal Operating Current

Accelerometer Low Power
Mode Current

MIN

VLOGIC must be ≤VDD at all times
Monotonic ramp. Ramp rate is 10% to 90% of the final value

1.71

VDD

V

3

ms

100
Performance parameters are not applicable beyond Specified
Temperature Range

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-40

µA
+85

°C

Notes

MPU-9150 Product Specification

6.5

Document Number: PS-MPU-9150A-00
Revision: 4.3
Release Date: 9/18/2013

Electrical Specifications, Continued

Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.465V, VLOGIC= 1.8V±5% or VDD, TA = 25°C
PARAMETERSERIAL INTERFACEI2C Operating Frequency

CONDITIONSI2C ADDRESS

AD0 = 0AD0 = 1MIN

TYP

All registers, Fast-mode
All registers, Standard-mode

MAX

Units

400
100

kHz
kHz

0.3*VLOGIC

V
V

1101000
1101001

DIGITAL INPUTS (SDA, AD0,
SCL, FSYNC, CLKIN)
VIH, High Level Input Voltage
VIL, Low Level Input Voltage

0.7*VLOGIC

CI, Input Capacitance<5

pF

DIGITAL OUTPUT (INT)
VOH, High Level Output Voltage

RLOAD=1MΩ

VOL1, LOW-Level Output Voltage

RLOAD=1MΩ

VOL.INT1, INT Low-Level Output
Voltage
Output Leakage Current

OPEN=1, 0.3mA sink
Current
OPEN=1

100

nA

tINT, INT Pulse Width

LATCH_INT_EN=050µs

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0.9*VLOGIC

15 of 50

V
0.1*VLOGIC

V

0.1

V

Notes

MPU-9150 Product Specification

6.6

Document Number: PS-MPU-9150A-00
Revision: 4.3
Release Date: 9/18/2013

Electrical Specifications, Continued

Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.465V, VLOGIC= 1.8V±5% or VDD, TA = 25°C
Parameters
Primary I2C I/O (SCL, SDA)
VIL, LOW Level Input Voltage
VIH, HIGH-Level Input Voltage
Vhys, Hysteresis
VOL1, LOW-Level Output Voltage
IOL, LOW-Level Output Current
Output Leakage Current
tof, Output Fall Time from VIHmax to VILmax
CI, Capacitance for Each I/O pin
Auxiliary I2C I/O (ES_CL, ES_DA)
VIL, LOW-Level Input Voltage
VIH, HIGH-Level Input Voltage
Vhys, Hysteresis
VOL1, LOW-Level Output Voltage
IOL, LOW-Level Output Current
Output Leakage Current
tof, Output Fall Time from VIHmax to VILmax
CI, Capacitance for Each I/O pin

Proprietary and Confidential

Conditions

3mA sink current
VOL = 0.4V
VOL = 0.6V
Cb bus capacitance in pF

1mA sink current
VOL = 0.4V
VOL = 0.6V
Cb bus cap. in pF

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TypicalUnits-0.5V to 0.3*VLOGIC
0.7*VLOGIC to VLOGIC + 0.5V
0.1*VLOGIC
0 to 0.4
35
100
20+0.1Cb to 250
< 10

V
V
V
V
mA
mA
nA
ns
pF

-0.5 to 0.3*VDD
0.7*VDD to VDD+0.5V
0.1*VDD
0 to 0.4
1
1

V
V
V
V
mA
mA

100
20+0.1Cb to 250
< 10

nA
ns
pF

Notes

Document Number: PS-MPU-9150A-00
Revision: 4.3
Release Date: 9/18/2013

MPU-9150 Product Specification

6.7

Electrical Specifications, Continued

Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.465V, VLOGIC= 1.8V±5% or VDD, TA = 25°C
Parameters

Conditions

INTERNAL CLOCK SOURCE
Gyroscope Sample Rate, Fast

CLK_SEL=0,1,2,3
DLPFCFG=0
SAMPLERATEDIV = 0

Gyroscope Sample Rate, Slow

DLPFCFG=1,2,3,4,5, or 6
SAMPLERATEDIV = 0

Min

Accelerometer Sample Rate
Clock Frequency Initial Tolerance
Frequency Variation over Temperature
PLL Settling Time

CLK_SEL=0, 25°C
CLK_SEL=1,2,3; 25°C
CLK_SEL=0
CLK_SEL=1,2,3
CLK_SEL=1,2,3

EXTERNAL 32.768kHz CLOCK
External Clock Frequency
External Clock Allowable Jitter
Gyroscope Sample Rate, Fast

CLK_SEL=4

Gyroscope Sample Rate, Slow

DLPFCFG=1,2,3,4,5, or 6
SAMPLERATEDIV = 0

Accelerometer Sample Rate
PLL Settling Time
CLK_SEL=5

Gyroscope Sample Rate, Slow Mode

DLPFCFG=1,2,3,4,5, or 6
SAMPLERATEDIV = 0

Max

Units

8

kHz

1

kHz

1

kHz

-5
-1

Cycle-to-cycle rms
DLPFCFG=0
SAMPLERATEDIV = 0

EXTERNAL 19.2MHz CLOCK
External Clock Frequency
Gyroscope Sample Rate
Gyroscope Sample Rate, Fast Mode

Typical+5+1-15 to +10
±1
1

%
%
%
%
ms

32.7681 to 2
8.192

kHz
µs
kHz

1.024

kHz

1.024

kHz

1

ms

8

MHz
Hz
kHz

1

kHz

Accelerometer Sample Rate

1kHz

PLL Settling Time1

ms

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19.2
Full programmable range
DLPFCFG=0
SAMPLERATEDIV = 0

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3.9

8000

Notes

Document Number: PS-MPU-9150A-00
Revision: 4.3
Release Date: 9/18/2013

MPU-9150 Product Specification

6.8

2

I C Timing Characterization

Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.465V, VLOGIC= 1.8V±5% or VDD, TA = 25°C
Parameters

Conditions

I2C TIMINGfSCL, SCL Clock Frequency
tHD.STA, (Repeated) START Condition HoldTime
tLOW, SCL Low PeriodtHIGH, SCL High PeriodtSU.STA, Repeated START Condition Setup
Time
tHD.DAT, SDA Data Hold TimetSU.DAT, SDA Data Setup Timetr, SDA and SCL Rise Timetf, SDA and SCL Fall Time
tSU.STO, STOP Condition Setup Time

I2C FAST-MODE

Cb bus cap. from 10 to 400pF
Cb bus cap. from 10 to 400pF

tBUF, Bus Free Time Between STOP and
START Condition
Cb, Capacitive Load for each Bus LinetVD.DAT, Data Valid Time
tVD.ACK, Data Valid Acknowledge Time

Typical

Max

Units

400
0.6

kHz
µs

1.3
0.6
0.6

µs
µs
µs

0
100
20+0.1Cb
20+0.1Cb
0.6

µs
ns
ns
ns
µs

300
300

1.3

µs
< 400
0.9
0.9

2

I C Bus Timing Diagram

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Min

18 of 50

pF
µs
µs

Notes

MPU-9150 Product Specification

6.9

Document Number: PS-MPU-9150A-00
Revision: 4.3
Release Date: 9/18/2013

Absolute Maximum Ratings

Stress above those listed as “Absolute Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only and functional operation of the device at these conditions is not implied.
Exposure to the absolute maximum ratings conditions for extended periods may affect device reliability.
Parameter

RatingSupply Voltage, VDD-0.5V to +6V

VLOGIC Input Voltage Level-0.5V to VDD + 0.5V

REGOUT-0.5V to 2V

Input Voltage Level (CLKIN, AUX_DA,
INT, SCL, SDA)

AD0, FSYNC,

CPOUT (2.5V ≤ VDD ≤ 3.6V )-0.5V to VDD + 0.5V
-0.5V to 30V

Acceleration (Any Axis, unpowered)

10,000g for 0.2ms

Operating Temperature Range-40°C to +85°C

Storage Temperature Range-40°C to +125°C

Electrostatic Discharge (ESD) Protection
Latch-up

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2kV (HBM);
250V (MM)JEDEC Class II (2),125°C±100mA

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Document Number: PS-MPU-9150A-00
Revision: 4.3
Release Date: 9/18/2013

MPU-9150 Product Specification

7
7.1

Applications Information
Pin Out and Signal Description
Pin Number
1
6
7
8
9
10
11
12
3, 13
15, 17,18
20
22
23
24
2, 4, 5, 14,
16, 19, 21

Pin Name
CLKIN
ES_DA
ES_CL
VLOGICAD0
REGOUT
FSYNC
INT
VDD
GND
CPOUT
RESV
SCL
SDA
RESV

Pin Description
Optional external reference clock input. Connect to GND if unused.
Auxiliary I2C master serial data
Auxiliary I2C Master serial clock
Digital I/O supply voltage
I2C Slave Address LSB (AD0)Regulator filter capacitor connection
Frame synchronization digital input. Connect to GND if unused.
Interrupt digital output (totem pole or open-drain)
Power supply voltage and Digital I/O supply voltage
Power supply ground
Charge pump capacitor connection
Reserved. Do not connect
I2C serial clock (SCL)
I2C serial data (SDA)
Reserved. Do not connect.

Top View

SDA

SCL

RESV

RESV

CPOUT

RESV

24

23

22

21

20

19

+Z

CLKIN

1

18

GND

RESV

2

17

GND

VDD

3

16

RESV

MPU-9150
RESV

4

15

GND

RESV

5

14

RESV

ES_DA

6

13

VDD

MP
U-

+Y
91

50

+X

7

8

9

10

11

12

ES_CL

VLOGICAD0

REGOUTFSYNC

INT

LGA Package
24-pin, 4mm x 4mm x 1mm

Proprietary and Confidential

+X

+Y

+Z

MP
U91

50

+Y

+X
+Z

Orientation of Axes of Sensitivity andPolarity of Rotation for Accel & Gyro

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Orientation of Axes of Sensitivity for
Magnetometer

Document Number: PS-MPU-9150A-00
Revision: 4.3
Release Date: 9/18/2013

MPU-9150 Product Specification

7.2

Typical Operating Circuit

GND
SDA

SCL

CLKIN

24

23

C3
2.2nF

22

21

20

19

1

18

2

17
GND

VDD

3

16

MPU-9150

4

15
VDD

5

14

6

ES_DA

13
7

8

9

10

11

12

C2
0.1µF

ES_CL
GND
C1
0.1µF

VLOGIC

GND

INT

FSYNC

AD0

C4
10nF

GND

Typical Operating Circuit

7.3

Bill of Materials for External Components
Component

LabelSpecification

Quantity

Regulator Filter Capacitor (Pin 10)

C1

Ceramic, X7R, 0.1µF ±10%, 2V

1

VDD Bypass Capacitor (Pin 13)

C2

Ceramic, X7R, 0.1µF ±10%, 4V

1Charge Pump Capacitor (Pin 20)

C3

Ceramic, X7R, 2.2nF ±10%, 50V

1

VLOGIC Bypass Capacitor (Pin 8)

C4*

Ceramic, X7R, 10nF ±10%, 4V

1

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MPU-9150 Product Specification

Recommended Power-on Procedure
All Voltages at 0V

7.4

Document Number: PS-MPU-9150A-00
Revision: 4.3
Release Date: 9/18/2013

Power-Up Sequencing
1. VLOGIC amplitude must always be ≤VDD
amplitude
TVDDR

2. TVDDR is VDD rise time: Time for VDD to risefrom 10% to 90% of its final value

90%

VDD

3. TVDDR is ≤100msec

10%

4. TVLGR is VLOGIC rise time: Time for
VLOGIC to rise from 10% to 90% of its final
value

TVLGR
90%

5. TVLGR is ≤3msec
VLOGIC

6. TVLG-VDD is the delay from the start of VDD
ramp to the start of VLOGIC rise

10%

7. TVLG-VDD is ≥0ms;
TVLG - VDD

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8. VDD and VLOGIC must be monotonic
ramps

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Document Number: PS-MPU-9150A-00
Revision: 4.3
Release Date: 9/18/2013

MPU-9150 Product Specification

7.5

Block Diagram

CLKIN
CLKOUT

1
CLOCK

22

MPU-9150

Clock

Self
test

X Accel

ADC

Self
test

Y Accel

ADC

12Interrupt
StatusRegister

9
Slave I2C

FIFO
Self
test

Z AccelX GyroSelf
test

Y GyroADC

24

Signal Conditioning

Self
test

ADC

ADC

ConfigRegisters

CPOUT

Z GyroADC

Temp Sensor

ADC

SensorRegisters

Bias & LDO
13
VDD

7.6

18

10

GND

REGOUT

Digital Motion
Processor
(DMP)

ADC

ADC

ADC

X
CompassY
CompassZ
Compass

8
VLOGIC

Overview

The MPU-9150 is comprised of the following key blocks and functions: Three-axis MEMS rate gyroscope sensor with 16-bit ADCs and signal conditioning Three-axis MEMS accelerometer sensor with 16-bit ADCs and signal conditioning Three-axis MEMS magnetometer sensor with 13-bit ADCs and signal conditioning
 Digital Motion Processor (DMP) engine
2
 Primary I C serial communications interface
2rd Auxiliary I C serial interface for 3 party sensors
 Clocking
 Sensor Data Registers
 FIFO Interrupts
 Digital-Output Temperature Sensor
 Gyroscope, Accelerometer and Magnetometer Self-test
 Bias and LDO
 Charge Pump

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7
6

11

Signal Conditioning

ChargePump

20

SerialInterface
Bypass
Mux

Master I2C
SerialInterface

Factory
Calibration
Self
test

23

23 of 50

INT

AD0
SCL
SDA

ES_CL
ES_DA

FSYNC

MPU-9150 Product Specification

7.7

Document Number: PS-MPU-9150A-00
Revision: 4.3
Release Date: 9/18/2013

Three-Axis MEMS Gyroscope with 16-bit ADCs and Signal Conditioning

The MPU-9150 includes a 3-Axis vibratory MEMS rate gyroscope, which detect rotations about the X-, Y-,
and Z- Axes. When the gyro is are rotated about any of the sense axes, the Coriolis Effect causes a
vibration that is detected by a capacitive pickoff. The resulting signal is amplified, demodulated, and filteredto produce a voltage that is proportional to the angular rate. This voltage is digitized using individual on-chip
16-bit Analog-to-Digital Converters (ADCs) to sample each axis. The full-scale range of the gyro sensor may
be digitally programmed to ±250, ±500, ±1000, or ±2000 degrees per second (dps). The ADC sample rate isprogrammable from 8,000 samples per second, down to 3.9 samples per second, and user-selectable lowpass filters enable a wide range of cut-off frequencies.

7.8

Three-Axis MEMS Accelerometer with 16-bit ADCs and Signal Conditioning

The MPU-9150’s 3-axis accelerometer uses separate proof masses for each axis. Acceleration along aparticular axis induces displacement on the corresponding proof mass, and capacitive sensors detect thedisplacement differentially. The MPU-9150’s architecture reduces the accelerometer’s susceptibility tofabrication variations as well as to thermal drift. When the device is placed on a flat surface, it will measure
0g on the X- and Y-axes and +1g on the Z-axis. The accelerometer’s scale factor is calibrated at the factoryand is nominally independent of supply voltage. Each sensor has a dedicated sigma-delta ADC for providing
digital outputs. The full scale range of the digital output can be adjusted to ±2g, ±4g, ±8g, or ±16g.

7.9Three-Axis MEMS Magnetometer with 13-bit ADCs and Signal Conditioning

The 3-axis magnetometer uses highly sensitive Hall sensor technology. The compass portion of the IC
incorporates magnetic sensors for detecting terrestrial magnetism in the X-, Y-, and Z- Axes, a sensor driving
circuit, a signal amplifier chain, and an arithmetic circuit for processing the signal from each sensor. Each
ADC has a 13-bit resolution and a full scale range of ±1200 µT.

7.10 Digital Motion Processor
The embedded Digital Motion Processor (DMP) is located within the MPU-9150 and offloads computation of
motion processing algorithms from the host processor. The DMP acquires data from accelerometers,rd
gyroscopes, magnetometers and additional 3 party sensors such as pressure sensors, and processes thedata. The resulting data can be read from the DMP’s registers, or can be buffered in a FIFO. The DMP has
access to one of the MPU’s external pins, which can be used for generating interrupts.
The purpose of the DMP is to offload both timing requirements and processing power from the hostprocessor. Typically, motion processing algorithms should be run at a high rate, often around 200Hz, in orderto provide accurate results with low latency. This is required even if the application updates at a much lower
rate; for example, a low power user interface may update as slowly as 5Hz, but the motion processing shouldstill run at 200Hz. The DMP can be used as a tool in order to minimize power, simplify timing, simplify thesoftware architecture, and save valuable MIPS on the host processor for use in the application.
2

7.11 Primary I C
2The MPU-9150 communicates to a system processor using an I C serial interface. The MPU-9150 always
acts as a slave when communicating to the system processor. The logic level for communications to the2master is set by the voltage on the VLOGIC pin. The LSB of the of the I C slave address is set by pin 9(AD0).

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MPU-9150 Product Specification

Document Number: PS-MPU-9150A-00
Revision: 4.3
Release Date: 9/18/2013

2

7.12 Auxiliary I C Serial Interface
2

The MPU-9150 has an auxiliary I C bus for communicating to off-chip sensors. This bus has two operating
modes:

2

I C Master Mode: The MPU-9150 acts as a master to any external sensors connected to the2
auxiliary I C bus
2
Pass-Through Mode: The MPU-9150 directly connects the primary and auxiliary I C buses together,allowing the system processor to directly communicate with any external sensors.
2

Auxiliary I C Bus Modes of Operation:
2

I C Master Mode: Allows the MPU-9150 to directly access the data registers of external digitalsensors, such as a pressure sensor. In this mode, the MPU-9150 directly obtains data from auxiliary
sensors, allowing the on-chip DMP to generate sensor fusion data without intervention from thesystem applications processor.
2

For example, In I C Master mode, the MPU-9150 can be configured to perform burst reads, returning
the following data from a triple-Axis external sensor:

X-Axis data (2 bytes)
Y-Axis data (2 bytes)
Z-Axis data (2 bytes)



The I C Master can be configured to read up to 24 bytes from up to 3 auxiliary sensors. A fourth
sensor can be configured to work single byte read/write mode.

Pass-Through Mode: Allows an external system processor to act as master and directly
2
communicate to the external sensors connected to the auxiliary I C bus pins (ES_DA and ESCL). In
2rdthis mode, the auxiliary I C bus control logic (3 -party sensor interface block) of the MPU-9150 is22
disabled, and the auxiliary I C pins ES_DA and ES_CL (Pins 6 and 7) are connected to the main I C
bus (Pins 23 and 24) through analog switches.

2

Pass-Through Mode is useful for configuring the external sensor, or for keeping the MPU-9150 in a
low-power mode when only the external sensors are used. In Pass-Through Mode the system
2processor can still access MPU-9150 data through the I C interface.
2

Auxiliary I C Bus IO Logic Level
2

The logic level of the auxiliary I C bus is VDD.
For further information regarding the MPU-9150’s logic level, please refer to Section 10.2.

7.13 Self-Test
Please refer to the MPU-9150 self-test applications note and MPU-9150 register map for more details on
self-test.
Self-test allows for the testing of the mechanical and electrical portions of the sensors. The self-test for eachmeasurement axis can be activated by controlling the bits of the Gyro and Accel control registers.
When self-test is activated, the electronics cause the sensors to be actuated and produce an output signal.
The output signal is used to observe the self-test response.
The self-test response is defined as follows:
Self-test response = Sensor output with self-test enabled – Sensor output without self-test enabled

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MPU-9150 Product Specification

Document Number: PS-MPU-9150A-00
Revision: 4.3
Release Date: 9/18/2013

The self-test response for each accelerometer axis is defined in the accelerometer specification table(Section 6.2), while that for each gyroscope axis is defined in the gyroscope specification table (Section 6.1).
When the value of the self-test response is within the min/max limits of the product specification, the part has
passed self-test. When the self-test response exceeds the min/max values, the part is deemed to havefailed self-test. Code for operating self-test code is included within the MotionApps software provided by
InvenSense.
2

7.14 MPU-9150 Solution for 10-Axis Sensor Fusion Using I C Interface
2

In the figure below, the system processor is an I C master to the MPU-9150. In addition, the MPU-9150 is an
2
2
I C master to the optional external pressure sensor. The MPU-9150 has limited capabilities as an I C Master,and depends on the system processor to manage the initial configuration of any auxiliary sensors. The MPU29150 has an interface bypass multiplexer, which connects the system processor I C bus pins 23 and 24
2(SDA and SCL) directly to the auxiliary sensor I C bus pins 6 and 7 (ES_DA and ES_CL).
Once the auxiliary sensors have been configured by the system processor, the interface bypass multiplexer
2
2should be disabled so that the MPU-9150 auxiliary I C master can take control of the sensor I C bus andgather data from the auxiliary sensors.
2

For further information regarding I C master control, please refer to Section 10.

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Document Number: PS-MPU-9150A-00
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MPU-9150 Product Specification

Interrupt
StatusRegister

12

MPU-9150
Slave I2C
or SPI
SerialInterface

I2C Processor Bus: for reading all
sensor data from MPU and for
configuring external sensors (i.e.
compass in this example)

INT

8

/CS

9

AD0/SDO23

SCL/SCLKSCL

24

SDA/SDISDA

VDD
VDD or GND

FIFO
Sensor I2C Bus: forconfiguring and readingfrom external sensors

ConfigRegister

Optional
SensorMaster I2C
SerialInterface

SensorRegisterInterface
Bypass
Mux

7

ES_CL

SCL

6

ES_DA

SDA

Pressure
Sensor

Factory
Calibration
DigitalMotionProcessor(DMP)
Interface bypass mux allows
direct configuration ofcompass by system processor

Bias & LDO
13
VDD

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18

10

GND

REGOUT

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SystemProcessor

MPU-9150 Product Specification

Document Number: PS-MPU-9150A-00
Revision: 4.3
Release Date: 9/18/2013

7.15 Procedure for Directly Accessing the AK8975 3-Axis Compass
2

The AK8975 3-Axis Compass is connected to the MPU-9150 through the MPU’s Auxiliary I C Bus. In order toaccess this compass directly, the MPU-9150 should be put into Pass-Through Mode.
For further information regarding MPU-9150 Pass-Through Mode, please refer to Section 7.12.
The slave address for AK8975 is 0x0C or 12 decimal.

The MPU-9150 pin configuration for Direct Access to the AK8975 is described in the table below.
Pin Configuration for Direct Access to AK8975 3-Axis Compass
Pin Number
1
6

Pin Name
CLKIN
ES_DA

7

ES_CL

8
9
10
11
12
3, 13
15, 17,18
20
22
23
24
2, 4, 5, 14,
16, 19, 21

VLOGICAD0
REGOUT
FSYNC
INT
VDD
GND
CPOUT
RESV
SCL
SDA
RESV

Pin Description
Inactive. Connect to GND.
Active. Leave as NC.
(provision for option external pull-up resistor to VDD)
Active. Leave as NC.
(provision for option external pull-up resistor to VDD)
Active. Digital I/O supply voltage.
Active. Connect to GND.
Active. Connect a 100nF bypass capacitor on the board.
Inactive. Connect to GND.
Inactive. Leave as NC.
Power supply voltage and Digital I/O supply voltage
Power supply ground.
Active. Connect a 10nF bypass capacitor on the board.
Reserved. Do not connect.
Active. I2C serial clock (SCL)
Active. I2C serial data (SDA)
Reserved. Do not connect.

For detailed information regarding the Register Map of the AK8975, please refer to the MPU-9150 Register
Map and Register Descriptions document.

7.16 Internal Clock Generation
The MPU-9150 has a flexible clocking scheme, allowing a variety of internal or external clock sources to be
used for the internal synchronous circuitry. This synchronous circuitry includes the signal conditioning and
ADCs, the DMP, and various control circuits and registers. An on-chip PLL provides flexibility in theallowable inputs for generating this clock.
Allowable internal sources for generating the internal clock are:

An internal relaxation oscillator
Any of the X, Y, or Z gyros (MEMS oscillators with a variation of ±1% over temperature)

Allowable external clocking sources are:

32.768kHz square wave
19.2MHz square wave

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MPU-9150 Product Specification

Document Number: PS-MPU-9150A-00
Revision: 4.3
Release Date: 9/18/2013

Selection of the source for generating the internal synchronous clock depends on the availability of externalsources and the requirements for power consumption and clock accuracy. These requirements will most
likely vary by mode of operation. For example, in one mode, where the biggest concern is power
consumption, the user may wish to operate the Digital Motion Processor of the MPU-9150 to processaccelerometer data, while keeping the gyros and magnetometer off. In this case, the internal relaxation
oscillator is a good clock choice. However, in another mode, where the gyros are active, selecting the gyros
as the clock source provides for a more accurate clock source.
Clock accuracy is important, since timing errors directly affect the distance and angle calculations performedby the Digital Motion Processor (and by extension, by any processor).
There are also start-up conditions to consider. When the MPU-9150 first starts up, the device uses its
internal clock until programmed to operate from another source. This allows the user, for example, to wait
for the MEMS oscillators to stabilize before they are selected as the clock source.

7.17 Sensor Data Registers
The sensor data registers contain the latest gyro, accelerometer, magnetometer, and temperature
measurement data. They are read-only registers, and are accessed via the serial interface. Data from theseregisters may be read anytime. However, the interrupt function may be used to determine when new data isavailable.
For a table of interrupt sources please refer to Section 8.

7.18 FIFOThe MPU-9150 contains a 1024-byte FIFO register that is accessible via the Serial Interface. The FIFO
configuration register determines which data is written into the FIFO. Possible choices include gyro data,
accelerometer data, temperature readings, auxiliary sensor readings, and FSYNC input. A FIFO counter
keeps track of how many bytes of valid data are contained in the FIFO. The FIFO register supports burst
reads. The interrupt function may be used to determine when new data is available.
For further information regarding the FIFO, please refer to the MPU-9150 Register Map and Register
Descriptions document.

7.19 Interrupts
Interrupt functionality is configured via the Interrupt Configuration register. Items that are configurable include
the INT pin configuration, the interrupt latching and clearing method, and triggers for the interrupt. Items that
can trigger an interrupt are (1) new data is available to be read (from the FIFO and Data registers); (2)accelerometer event interrupts; and (3) the MPU-9150 did not receive an acknowledge from an auxiliary2
sensor on the secondary I C bus. The interrupt status can be read from the Interrupt Status register.
For further information regarding interrupts, please refer to the MPU-9150 Register Map and Register
Descriptions document.
For information regarding the MPU-9150’s accelerometer event interrupts, please refer to Section 8.

7.20 Digital-Output Temperature Sensor
An on-chip temperature sensor and ADC are used to measure the MPU-9150 die temperature. The readings
from the ADC can be read from the FIFO or the Sensor Data registers.

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7.21 Bias and LDO
The bias and LDO section generates the internal supply and the reference voltages and currents required by
the MPU-9150. Its two inputs are an unregulated VDD and a VLOGIC logic reference supply voltage. The
LDO output is bypassed by a capacitor at REGOUT. For further details on the capacitor, please refer to theBill of Materials for External Components (Section 7.3).

7.22 Charge Pump
An on-board charge pump generates the high voltage required for the MEMS oscillators. Its output is
bypassed by a capacitor at CPOUT. For further details on the capacitor, please refer to the Bill of Materials
for External Components (Section 7.3).

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MPU-9150 Product Specification

8

Document Number: PS-MPU-9150A-00
Revision: 4.3
Release Date: 9/18/2013

Programmable Interrupts

The MPU-9150 has a programmable interrupt system which can generate an interrupt signal on the INT pin.
Status flags indicate the source of an interrupt. Interrupt sources may be enabled and disabled individually.
Table of Interrupt Sources
Interrupt Name

ModuleFIFO Overflow

FIFO

Data ReadySensor Registers

I2C Master errors: Lost Arbitration, NACKs

I2C MasterI2C Slave 4

I2C Master

For information regarding the interrupt enable/disable registers and flag registers, please refer to the MPU9150 Register Map and Register Descriptions document.

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9
9.1

Document Number: PS-MPU-9150A-00
Revision: 4.3
Release Date: 9/18/2013

Digital Interface
2

I C Serial Interface
2

The internal registers and memory of the MPU-9150 can be accessed using either I C at 400 kHz.
Serial Interface

9.2

Pin Number

Pin Name

Pin Description

8

VLOGIC

Digital I/O supply voltage. VLOGIC must be ≤ VDD at all times.

9

AD0

I2C Slave Address LSB

23

SCL

I2C serial clock

24

SDA

I2C serial data

2

I C Interface

2

I C is a two-wire interface comprised of the signals serial data (SDA) and serial clock (SCL). In general, the2lines are open-drain and bi-directional. In a generalized I C interface implementation, attached devices canbe a master or a slave. The master device puts the slave address on the bus, and the slave device with thematching address acknowledges the master.
The MPU-9150 always operates as a slave device when communicating to the system processor, which thus
acts as the master. SDA and SCL lines typically need pull-up resistors to VDD. The maximum bus speed is
400 kHz.
The slave address of the MPU-9150 is b110100X which is 7 bits long. The LSB bit of the 7 bit address is2
determined by the logic level on pin AD0. This allows two MPU-9150s to be connected to the same I C bus.
When used in this configuration, the address of the one of the devices should be b1101000 (pin AD0 is logiclow) and the address of the other should be b1101001 (pin AD0 is logic high).

9.3

2

I C Communications Protocol

START (S) and STOP (P) Conditions
2

Communication on the I C bus starts when the master puts the START condition (S) on the bus, which isdefined as a HIGH-to-LOW transition of the SDA line while SCL line is HIGH (see figure below). The bus isconsidered to be busy until the master puts a STOP condition (P) on the bus, which is defined as a LOW to
HIGH transition on the SDA line while SCL is HIGH (see figure below).
Additionally, the bus remains busy if a repeated START (Sr) is generated instead of a STOP condition.

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SDA

SCL
S

P

START condition

STOP condition

START and STOP Conditions

Data Format / Acknowledge
2

I C data bytes are defined to be 8-bits long. There is no restriction to the number of bytes transmitted per
data transfer. Each byte transferred must be followed by an acknowledge (ACK) signal. The clock for the
acknowledge signal is generated by the master, while the receiver generates the actual acknowledge signal
by pulling down SDA and holding it low during the HIGH portion of the acknowledge clock pulse.
If a slave is busy and cannot transmit or receive another byte of data until some other task has been
performed, it can hold SCL LOW, thus forcing the master into a wait state. Normal data transfer resumes
when the slave is ready, and releases the clock line (refer to the following figure).

DATA OUTPUT BY
TRANSMITTER (SDA)
not acknowledge
DATA OUTPUT BYRECEIVER (SDA)
acknowledge
SCL FROM
MASTER

1

2

8

clock pulse for
acknowledgement

START
condition
2

Acknowledge on the I C Bus

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Communications
After beginning communications with the START condition (S), the master sends a 7-bit slave addressthfollowed by an 8 bit, the read/write bit. The read/write bit indicates whether the master is receiving data fromor is writing to the slave device. Then, the master releases the SDA line and waits for the acknowledge
signal (ACK) from the slave device. Each byte transferred must be followed by an acknowledge bit. To
acknowledge, the slave device pulls the SDA line LOW and keeps it LOW for the high period of the SCL line.
Data transmission is always terminated by the master with a STOP condition (P), thus freeing thecommunications line. However, the master can generate a repeated START condition (Sr), and address
another slave without first generating a STOP condition (P). A LOW to HIGH transition on the SDA line while
SCL is HIGH defines the stop condition. All SDA changes should take place when SCL is low, with the
exception of start and stop conditions.

SDA

SCL

1–7

8

1–7

9

8

9

1–7

8

9

S

P

START ADDRESS
condition

R/W

ACK

DATA

ACK

DATA

ACK

STOP
condition

2

Complete I C Data Transfer
2

To write the internal MPU-9150 registers, the master transmits the start condition (S), followed by the I C
thaddress and the write bit (0). At the 9 clock cycle (when the clock is high), the MPU-9150 acknowledges thetransfer. Then the master puts the register address (RA) on the bus. After the MPU-9150 acknowledges thereception of the register address, the master puts the register data onto the bus. This is followed by the ACK
signal, and data transfer may be concluded by the stop condition (P). To write multiple bytes after the last
ACK signal, the master can continue outputting data rather than transmitting a stop signal. In this case, theMPU-9150 automatically increments the register address and loads the data to the appropriate register. The
following figures show single and two-byte write sequences.

Single-Byte Write Sequence
Master

S

AD+W

Slave

RA
ACK

DATA
ACK

P
ACK

Burst Write Sequence
Master
Slave

S

AD+W

RA
ACK

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ACK

DATA
ACK

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MPU-9150 Product Specification2

To read the internal MPU-9150 registers, the master sends a start condition, followed by the I C address anda write bit, and then the register address that is going to be read. Upon receiving the ACK signal from the
MPU-9150, the master transmits a start signal followed by the slave address and read bit. As a result, theMPU-9150 sends an ACK signal and the data. The communication ends with a not acknowledge (NACK)
signal and a stop bit from master. The NACK condition is defined such that the SDA line remains high at theth
9 clock cycle. The following figures show single and two-byte read sequences.

Single-Byte Read Sequence
Master

S

AD+W

Slave

RA
ACK

S

AD+R

ACK

NACK
ACK

P

DATA

Burst Read Sequence
Master

S

AD+W

Slave

9.4

RA
ACK

S

AD+R

ACK

ACK
ACK

DATA

2

I C Terms

Signal
S
AD
W
R
ACK
NACK
RA
DATA
P

Description
Start Condition: SDA goes from high to low while SCL is high2
Slave I C address
Write bit (0)Read bit (1)Acknowledge: SDA line is low while the SCL line is high at theth
9 clock cycleth
Not-Acknowledge: SDA line stays high at the 9 clock cycle
MPU-9150 internal register address
Transmit or received data
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NACK
DATA

P

MPU-9150 Product Specification

Document Number: PS-MPU-9150A-00
Revision: 4.3
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10 Serial Interface Considerations
10.1 MPU-9150 Supported Interfaces
2

The MPU-9150 supports I C communications.

10.2 Logic Levels
The MPU-9150’s I/O logic levels are set to be either VDD or VLOGIC, as shown in the table below.

I/O Logic Levels
MICROPROCESSOR LOGIC LEVELSAUXILIARY LOGIC LEVELS(Pins: SDA, SCL, AD0, CLKIN, INT)

(Pins: ES_DA, ES_CL)VLOGICVDD

VLOGIC may be set to be equal to VDD or to another voltage. However, VLOGIC must be ≤ VDD at all
times. VLOGIC is the power supply voltage for the microprocessor system bus and VDD is the supply for the2
auxiliary I C bus, as shown in the figure of Section 10.3.

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10.3 Logic Levels Diagram
2

The figure below depicts a sample circuit with a third party pressure sensor attached to the auxiliary I C bus.
It shows logic levels and voltage connections. Note: Actual configuration will depend on the auxiliary sensors
used.
VLOGIC(0V - VLOGIC)SYSTEM BUS

SystemProcessor
IO

VDD
VLOGIC(0V - VLOGIC)

VDD(0V - VLOGIC)(0V - VLOGIC)VLOGIC

INT
SDA

CLKIN

VDD_IOSCLVLOGIC(0V - VLOGIC)(0V - VLOGIC)

VDD

FSYNC

MPU-9150

VDD

VLOGIC

INT 1
ES_DA

(0V, VLOGIC)

AD0

ES_CL

0V - VDD
0V - VDD

INT 2(0V - VLOGIC)(0V - VLOGIC)

SDA
SCL
ADDR

3rd Party
Pressure sensor

0V - VDD

I/O Levels and Connections
Notes:
1. The IO voltage levels of ES_DA and ES_CL are set relative to VDD.
2. Third-party auxiliary device logic levels are referenced to VDD. Setting INT1 and INT2 to open drain
configuration provides voltage compatibility when VDD ≠ VLOGIC. When VDD = VLOGIC, INT1 and
INT2 may be set to push-pull outputs, and external pull-up resistors are not needed.
3. All other MPU-9150 logic IO is always referenced to VLOGIC.

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11 AssemblyThis section provides general guidelines for assembling InvenSense Micro Electro-Mechanical Systems(MEMS) gyros packaged in Lead Grid Array package (LGA) surface mount integrated circuits.

11.1 Orientation of Axes
The diagram below shows the orientation of the axes of sensitivity and the polarity of rotation. Note the pin 1
identifier (•) in the figure.

+Z
+Y
MP
U91

50

+X

Orientation of Axes of Sensitivity
and Polarity of Rotation for
Gyroscopes and Accelerometers
+X
MP
U91

50

+Y
+Z

Orientation of Axes of Sensitivity
for Compass

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11.2 Package Dimensions

SYMBOLS
A
c
D
E
D1/E1
D2/E2
e
b
f
L
s
x

DIMENSIONS IN MILLIMETERS
MIN.
NOM.
MAX.
0.90
0.106
3.90
3.90
------0.22
0.22
0.32
--0.32

1.00
0.136
4.00
4.00
2.50
3.41
0.50
0.25
0.25
0.35
0.12
0.35

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0.166
4.10
4.10
------0.28
0.28
0.38
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Document Number: PS-MPU-9150A-00
Revision: 4.3
Release Date: 9/18/2013

11.3 PCB Design Guidelines:
The Pad Diagram using a JEDEC type extension with solder rising on the outer edge is shown below. The
Pad Dimensions Table shows pad sizing (mean dimensions) recommended for the MPU-9150 product.

JEDEC type extension with solder rising on outer edge

PCB Lay-out Diagram

SYMBOLS
e
b
L1
L3
D
E
D2
E2
c
Tout
Tin
L2
L4

DIMENSIONS IN MILLIMETERS
Nominal Package I/O Pad Dimensions

NOM

Pad Pitch
Pad Width
Pad Length
Pad Length
Package Width
Package Length
I/O Land Design Dimensions (Guidelines )I/O Pad Extent Width
I/O Pad Extent Length
Land Width
Outward Extension
Inward Extension
Land Length
Land Length

0.50
0.25
0.35
0.40
4.00
4.00
4.80
4.80
0.35
0.40
0.05
0.80
0.85

PCB Dimensions Table (for PCB Lay-out Diagram)

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11.4 Assembly Precautions
11.4.1 Surface Mount Guidelines
InvenSense MEMS motion sensors are sensitive to mechanical stress coming from the printed circuit board(PCB). This PCB stress can be minimized by adhering to certain design rules.
When using MEMS components in plastic packages, PCB mounting and assembly can cause package
stress. This package stress in turn can affect the output offset and its value over a wide range oftemperatures. This stress is caused by the mismatch between the Coefficient of Linear Thermal Expansion(CTE) of the package material and the PCB. Care must be taken to avoid package stress due to mounting.
Traces connected to pads should be as symmetric as possible. Maximizing symmetry and balance for pad
connection will help component self alignment and will lead to better control of solder paste reduction after
reflow.
Any material used in the surface mount assembly process of the MEMS product should be free of restricted
RoHS elements or compounds. Pb-free solders should be used for assembly.

11.4.2 Exposed Die Pad Precautions
The MPU-9150 has very low active and standby current consumption. The exposed center die pad is not
required for heat sinking, and should not be soldered to the PCB. Under-fill should also not be used. Failure
to adhere to this rule can induce performance changes due to package thermo-mechanical stress. There isno electrical connection between the pad and the CMOS.

11.4.3 Trace Routing
Routing traces or vias under the gyro package such that they run under the exposed die pad is prohibited.
Routed active signals may harmonically couple with the gyro MEMS devices, compromising gyro response.
These devices are designed with the drive frequencies as follows: X = 33±3kHz, Y = 30±3kHz, and
Z=27±3kHz. To avoid harmonic coupling don’t route active signals in non-shielded signal planes directly
below, or above the gyro package. Note: For best performance, design a ground plane under the e-pad to
reduce PCB signal noise from the board on which the gyro device is mounted. If the gyro device is stacked
under an adjacent PCB board, design a ground plane directly above the gyro device to shield active signals
from the adjacent PCB board.

11.4.4 Component Placement
Do not place large insertion components such as keyboard or similar buttons, connectors, or shielding boxes
at a distance of less than 6 mm from the MEMS gyro. Maintain generally accepted industry design practices
for component placement near the MPU-9150 to prevent noise coupling and thermo-mechanical stress.

11.4.5 PCB Mounting and Cross-Axis Sensitivity
Orientation errors of the gyroscope and accelerometer mounted to the printed circuit board can cause crossaxis sensitivity in which one gyro or accel responds to rotation or acceleration about another axis,
respectively. For example, the X-axis gyroscope may respond to rotation about the Y or Z axes. The
orientation mounting errors are illustrated in the figure below.

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Z

Φ
Y

MP
U91

50

Θ

Package Gyro & Accel Axes (X) Relative to PCB Axes () with Orientation Errors (Θ and Φ)

The table below shows the cross-axis sensitivity as a percentage of the specified gyroscope or
accelerometer’s sensitivity for a given orientation error, respectively.

Cross-Axis Sensitivity vs. Orientation Error
Orientation Error

Cross-Axis Sensitivity(θ or Φ)(sinθ or sinΦ)

0º

0%

0.5º

0.87%

1º

1.75%

The specifications for cross-axis sensitivity in Section 6.1 and Section 6.2 include the effect of the dieorientation error with respect to the package.

11.4.6 MEMS Handling Instructions
MEMS (Micro Electro-Mechanical Systems) are a time-proven, robust technology used in hundreds ofmillions of consumer, automotive and industrial products. MEMS devices consist of microscopic moving
mechanical structures. They differ from conventional IC products, even though they can be found in similar
packages. Therefore, MEMS devices require different handling precautions than conventional ICs prior tomounting onto printed circuit boards (PCBs).
The MPU-9150 has been qualified to a shock tolerance of 10,000g. InvenSense packages its gyroscopes as
it deems proper for protection against normal handling and shipping. It recommends the following handlingprecautions to prevent potential damage.


Do not drop individually packaged gyroscopes, or trays of gyroscopes onto hard surfaces. Components
placed in trays could be subject to g-forces in excess of 10,000g if dropped.

Printed circuit boards that incorporate mounted gyroscopes should not be separated by manuallysnapping apart. This could also create g-forces in excess of 10,000g.

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MPU-9150 Product Specification

Do not clean MEMS gyroscopes in ultrasonic baths. Ultrasonic baths can induce MEMS damage if thebath energy causes excessive drive motion through resonant frequency coupling.

11.4.7 ESD Considerations
Establish and use ESD-safe handling precautions when unpacking and handling ESD-sensitive devices.
Store ESD sensitive devices in ESD safe containers until ready for use. The Tape-and-Reel moisturesealed bag is an ESD approved barrier. The best practice is to keep the units in the original moisturesealed bags until ready for assembly.



Restrict all device handling to ESD protected work areas that measure less than 200V static charge.
Ensure that all workstations and personnel are properly grounded to prevent ESD.

11.5 Reflow Specification
Qualification Reflow: The MPU-9150 was qualified in accordance with IPC/JEDEC J-STD-020D.1. This
standard classifies proper packaging, storage and handling in order to avoid subsequent thermal andmechanical damage during the solder reflow attachment phase of PCB assembly.
The qualification preconditioning process specifies a sequence consisting of a bake cycle, a moisture soak
cycle (in a temperature humidity oven), and three consecutive solder reflow cycles, followed by functional
device testing.
The peak solder reflow classification temperature requirement for package qualification is (260 +5/-0°C) for
lead-free soldering of components measuring less than 1.6 mm in thickness. The qualification profile and atable explaining the set-points are shown below:

SOLDER REFLOW PROFILE FOR QUALIFICATION
LEAD-FREE IR/CONVECTION
F

Temperature [°C]

TPmax
TPmin

G

E
10-30sec

D

TLiquidus
Tsmax

C

Liquidus60-120sec

Tramp-upB( < 3 C/sec)

Tsmin

Tramp-down( < 4 C/sec)

Preheat60-120sec

Troom-Pmax(< 480sec)

A
Time [Seconds]

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Temperature Set Points Corresponding to Reflow Profile Above
CONSTRAINTS
Step Setting
Temp (°C)
Time (sec)Max. Rate (°C/sec)
A
B
C
D

Troom
TSmin
TSmax
TLiquidus

25
150
200
217

E

TPmin [255°C, 260°C]

255

F
G

TPmax [ 260°C, 265°C]
TPmin [255°C, 260°C]

260
255

H
I
Notes:

60 < tBC < 120r(TLiquidus-TPmax) < 3r(TLiquidus-TPmax) < 3
tAF < 480
10< tEG < 30r(TLiquidus-TPmax) < 3r(TPmax-TLiquidus) < 4

TLiquidus
217
60 < tDH < 120
Troom
25
Customers must never exceed the Classification temperature (TPmax = 260°C).
All temperatures refer to the topside of the QFN package, as measured on the package body surface.

Production Reflow: Check the recommendations of your solder manufacturer. For optimum results, use
lead-free solders that have lower specified temperature profiles (Tpmax ~ 235°C). Also use lower ramp-up andramp-down rates than those used in the qualification profile. Never exceed the maximum conditions that weused for qualification, as these represent the maximum tolerable ratings for the device.
11.6 Storage Specifications
The storage specification of the MPU-9150 conforms to IPC/JEDEC J-STD-020D.1 Moisture Sensitivity Level(MSL) 3.

Calculated shelf-life in moisture-sealed bag

12 months -- Storage conditions: <40°C and <90% RH

After opening moisture-sealed bag

168 hours -- Storage conditions: ambient ≤30°C at 60%RH

11.7 Package Marking Specification

TOP VIEWInvenSense
Part number
Lot traceability code

MPU9150

XXXXXX-XXXX YYWW X

Foundry code

Rev Code
YY = Year CodeWW = Work Week

Package Vendor CodePackage Marking Specification

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11.8 Tape & Reel Specification

Tape Dimensions

Reel Outline Drawing

Reel Dimensions and Package Size
PACKAGEREEL (mm)

SIZE

L

V

W

Z

4x4

330

102

12.8

2.3

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MPU-9150 Product Specification

Package Orientation

Document Number: PS-MPU-9150A-00
Revision: 4.3
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User Directionof FeedPin 1
INVENSENSEINVENSENSE

Cover Tape
(Anti-Static)
Carrier Tape
(Anti-Static)

Reel
-f r

Pb

ca

DE

enS

VIC

E (1

LO

T1

en s

P ):

(1 T

LO

T2

M

): Q

(1 T

Re

e

- 605
PU

2R

):

el D

784

V
Q3

a te

PO

0

:H

D /C

: 111
(D )

D /C
215

: 18

or

EL

(D )

7

e4

Y (Q

Y (Q

QT

8

: 110

y (

QT

QT

UB

-F 1

ee

te g

RE

Inv

HF

)

): 500) : 300

Y(

Q ):

QC

0

0

200

ST

AM

0

Terminal Tape

P:

-G 1

/ 05

/11

Label
Tape and Reel Specification

Reel Specifications
Quantity Per Reel

5,000

Reels per Box

1

Boxes Per Carton (max)5

Pcs/Carton (max)

25,00011.9 Label

Location of Label

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11.10 Packaging

REEL – with Barcode &Caution labels

Vacuum-Sealed Moisture
Barrier Bag with ESD, MSL3,
Caution, and Barcode Labels

MSL3 Label

Caution Label

ESD Label

Inner Bubble Wrap

Pizza Box

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11.11 Representative Shipping Carton Label

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Document Number: PS-MPU-9150A-00
Revision: 4.3
Release Date: 9/18/2013

12 Reliability
12.1 Qualification Test Policy
InvenSense’s products complete a Qualification Test Plan before being released to production. The
Qualification Test Plan for the MPU-9150 followed the JESD 47I Standards, “Stress-Test-Driven Qualificationof Integrated Circuits,” with the individual tests described below.
12.2 Qualification Test Plan
Accelerated Life Tests
TEST

Method/Condition

Lot
Quantity

Sample /Lot

Acc /RejectCriteria(HTOL/LFR)High Temperature Operating LifeJEDEC JESD22-A108D
Dynamic, 3.63V biased, Tj>125°C[read-points 168, 500, 1000 hours]

3

77

(0/1)

(HAST)
Highly Accelerated Stress Test (1)JEDEC JESD22-A118A
Condition A, 130°C, 85%RH, 33.3 psia., unbiased,[read-point 96 hours]

3

77

(0/1)

(HTS)
High Temperature Storage LifeJEDEC JESD22-A103D
Condition A, 125°C Non-Bias Bake
[read-points 168, 500, 1000 hours]

3

77

(0/1)

Device Component Level Tests
TEST

Method/Condition

Lot
Quantity

Sample /Lot

Acc /RejectCriteria(ESD-HBM)
ESD-Human Body ModelJEDEC JS-001-2012
(2KV)

1

3

(0/1)

(ESD-MM)ESD-Machine ModelJEDEC JESD22-A115C(250V)

1

3

(0/1)

(LU)
Latch UpJEDEC JESD-78DClass II (2), 125°C; ±100mA

1

6

(0/1)

(MS)
Mechanical ShockJEDEC JESD22-B104C, Mil-Std-883
Method 2002.5, Cond. E, 10,000g’s, 0.2ms,±X, Y, Z – 6 directions, 5 times/direction

3

5

(0/1)

(VIB)
Vibration

JEDEC JESD22-B103B
Variable Frequency (random), Cond. B, 5-500Hz,
X, Y, Z – 4 times/direction

1

5

(0/1)

(TC)
Temperature Cycling (1)

JEDEC JESD22-A104D
Condition G [-40°C to +125°C],
Soak Mode 2 [5’],[Read-Points 1000 cycles]

3

77

(0/1)

(1) Tests are preceded by MSL3 Preconditioning in accordance with JEDEC JESD22-A113F

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13 Environmental Compliance
The MPU-9150 is RoHS and Green compliant.
The MPU-9150 is in full environmental compliance as evidenced in report HS-MPU-9150, Materials
Declaration Data Sheet.

Environmental Declaration Disclaimer:
InvenSense believes this environmental information to be correct but cannot guarantee accuracy or completeness. Conformity
documents for the above component constitutes are on file. InvenSense subcontracts manufacturing and the information contained
herein is based on data received from vendors and suppliers, which has not been validated by InvenSense.

This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense
for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject tochange without notice. InvenSense reserves the right to make changes to this product, including its circuits and software, in order toimprove its design and/or performance, without prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding
the information and specifications contained in this document. InvenSense assumes no responsibility for any claims or damages arisingfrom information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited
to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights.

Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by
implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information
previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors
should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or for
any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,
transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime
prevention equipment.
InvenSense®, MotionCommand®, TouchAnywhere®, and AirSign® are registered trademarks of InvenSense, Inc. MPU™, MPU9150™, Motion Processing Unit™ , MotionFusion™, MotionProcessing™, MotionApps™, Digital Motion Processor™, Digital Motion
Processing™, DMP™, BlurFree™, and InstantGesture™ are trademarks of InvenSense, Inc.

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