AES 100 Laminate

Product Information
Description

Key Features and Benefits

AES 100 Laminate, an offering within our Advanced
Electronic Solutions portfolio, is designed to meet next
generation needs of 5G and 6G platforms, anticipating
requirements for both wireless and digital future designs.
The AES 100 Laminate is an extremely low dielectric
constant and low loss circuit material. The product is a
fluoropolymer-based copper clad laminate that is thin,
flexible, and is manufactured with a woven reinforcement.

• Low loss dielectric combined with high peel strength on
ED and RA copper foil.

The AES 100 Laminate offers benefits of superior
electrical and thermal performance, typical offluoropolymers, and overcomes traditional limitations
associated with current PTFE laminates. The AES 100
Laminate is UV and CO2 laser compatible, offers superior
plating adhesion using standard industry techniques andhas manageable and repeatable dimensional control.
Additionally, a high level of metal adhesion enables thelaminate to be offered with the smoothest and highest
performing ED and rolled copper foils available in theindustry.
The AES 100 Laminate UL file number is E535604.

• Excellent compatibility with standard PCB processing.
• Minimal variance in dielectric thickness which leads toexcellent reproducibility of results.
• UV/CO2 and UV laser compatible.
• Excellent mechanical drilling in standard and hybrid
constructions.
Construction Options• Copper Cladding: 12 µm and 18 µm rolled andelectrodeposited copper foils• Thickness: 50 µm, 125 µm• Panel Sizes: Rolls up to 500 mm wide. Sheeted productwith 500 mm maximum transverse dimension

AES 100 Laminate

Table 1. Properties of AES 100 Laminate1Property

50 µm125 µm

Direction

Units

Dielectric Constant

2.29

2.21

Dissipation Factor

0.00090.0008

Dielectric Constant

2.44

2.34

Dissipation Factor

0.00110.0009Dielectric Strength

197.2(5,008.9)

Melting Temperature (Tm)

Test Conditions

Test Method

Z axis—X/Y axis—

202.3(5,137.4)

Z axisV/µm(V/mil)

23 °C/24 hr/50% RH

ASTM D149

307

307

—°C

1 heat method

ASTM D3418

Decomposition Temperature (Td)

506

506

—°C

5% weight loss

IPC TM-650 2.3.40

Coefficient of Thermal Expansion

12.1/16.0

19.6/23.9

MD/TDppm/°C

25 °C to 250 °C

IPC TM-650 2.4.41

Copper Peel Strength

1.5/1.8(8.6/10.3)

2.2/2.2(12.6/12.6)

ZSide 1/Side 2N/mm(pli)

Condition A
12 µm copper

IPC TM-650 2.4.8

Tensile Strength

117/101

71/73

MD/TD

Mpa

23 °C/50% RH

IPC TM-650 2.4.19c

Tensile Modulus

4,649/3,951

2,667/2,524

MD/TD

Mpa

23 °C/50% RH

IPC TM-650 2.4.19c

Tensile Elongation

2.9/2.8

3.3/3.5

MD/TD%

23 °C/50% RH

IPC TM-650 2.4.19c

0.00/0.06–0.12/–0.04

MD/TD%after etch–0.04/–0.07–0.16/–0.14

MD/TD

%

after etch + bakeNominal Thickness

52.4

127.9

Zµm

After etch

IPC TM-650 2.2.18

Solder Float Resistance

PassPass——

288 °C/60 sec

IPC TM-650 2.4.13

Flammability

V-0

V-0

—

—

—

UL94

Moisture Absorption

0.02

0.02

—

%

E1/105 + D48/50

IPC TM-650 2.6.21

Density

2.18

2.18

—

g/cm3C-24/23/50

IPC TM-650 2.3.5

Electrical Properties
10GHz
23 °C/24 hr/50% RH
10GHz
23 °C/24 hr/50% RH

IPC TM-650 2.5.5.5

IPC TM-650 2.5.5.15Thermal Properties

Mechanical Properties

Dimensional Stability

IPC TM-650 2.2.4c

Physical Properties

This table gives properties (not specifications) based on production performance. Chemours does not make any express or implied warranty that these products will have thesetypical properties.

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C-11968

NO PART OF THIS MATERIAL MAY BE REPRODUCED, STORED IN A RETRIEVAL SYSTEM OR TRANSMITTED IN ANY FORM OR BY ANY MEANS ELECTRONIC, MECHANICAL, PHOTOCOPYING, RECORDING OR OTHERWISEWITHOUT THE PRIOR WRITTEN PERMISSION OF CHEMOURS.

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The information set forth herein is furnished free of charge and based on technical data that Chemours believes to be reliable. It is intended for use by persons having technical skill, at their own
discretion and risk. The handling precaution information contained herein is given with the understanding that those using it will satisfy themselves that their particular conditions of use present
no health or safety hazards. Because conditions of product use are outside our control, Chemours makes no warranties, express or implied, and assumes no liability in connection with any useof this information. As with any material, evaluation of any compound under end-use conditions prior to specification is essential. Nothing herein is to be taken as a license to operate under or arecommendation to infringe any patents.