Datasheet SHT3x-DIS
Humidity and Temperature Sensor▪ Fully calibrated, linearized, and temperaturecompensated digital output▪ Wide supply voltage range, from 2.15 V to 5.5 V▪ I2C Interface with communication speeds up to 1
MHz and two user selectable addresses▪ Typical accuracy of  1.5 %RH and  0.1 °C for
SHT35▪ NIST traceability▪ Very fast start-up and measurement time
▪ Tiny 8-Pin DFN package
Product Summary
SHT3x-DIS is the next generation of Sensirion’s temperature and humidity sensors. It builds on a new CMOSens® sensor
chip that is at the heart of Sensirion’s new humidity and temperature platform. The SHT3x-DIS has increased intelligence,
reliability and improved accuracy specifications compared to its predecessor. Its functionality includes enhanced signal
processing, two distinctive and user selectable I2C addresses and communication speeds of up to 1 MHz. The DFN
package has a footprint of 2.5 x 2.5 mm2 while keeping a height of 0.9 mm. This allows for integration of the SHT3x-DIS
into a great variety of applications. Additionally, the wide supply voltage range of 2.15 V to 5.5 V guarantees compatibility
with diverse assembly situations. All in all, the SHT3x-DIS incorporates 15 years of knowledge of Sensirion, the leader inthe humidity sensor industry.

Benefits of Sensirion’s CMOSens® Technology▪

High reliability and long-term stability▪

Industry-proven technology with a track record of
more than 15 years▪

Designed for mass production▪

High process capability▪

High signal-to-noise ratio

RH Sensor T Sensor

ADC
ADC

VDD

Power on
Reset

VSS

Calibration
MemoryContent
1

Sensor Performance.............................................2

2

Specifications .......................................................63

Pin Assignment ....................................................84

Operation and Communication .............................95

Packaging...........................................................16

6

Shipping Package ..............................................18

7

Quality ................................................................19

8

Ordering Information...........................................19

9

Further Information .............................................19www.sensirion.com

nRESET

Data processing& Linearization

RESET

Digital Interface

Alert Logic

ADDR

SDA SCL

Alert

Figure 1 Functional block diagram of the SHT3x-DIS. The
sensor signals for humidity and temperature are factory
calibrated, linearized and compensated for temperatureand supply voltage dependencies.

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Datasheet SHT3x-DIS

1

Sensor Performance

Humidity Sensor Specification
Parameter

Condition

Value

Units

Typ.
Max.
Typ.
Max.
Typ.
Max.
Low, typ.
Medium, typ.
High, typ.
Typ.
at 25°C
extended4
63%
Typ.7

2
Figure 2
2
Figure 3±1.5
Figure 4
0.21
0.15
0.08
0.01
0.8
0 to 100
86
<0.25

%RH
%RH
%RH
%RH
%RH
%RH
%RH
%RH
%RH
s
%RH/yrCondition

Value

Units

SHT30 Accuracy tolerance1

typ., 0°C to 65°C

0.2
Figure 8°C

SHT31 Accuracy tolerance1

typ., 0°C to 90°C

0.2
Figure 9±0.1
Figure 10
0.15
0.08
0.04
0.01
-40 to 125

°C

>2

s

<0.03

°C/yr

SHT30 Accuracy tolerance1
SHT31 Accuracy tolerance1
SHT35 Accuracy tolerance1
Repeatability2
Resolution
Hysteresis
Specified range3
Response time5
Long-term drift
Table 1 Humidity sensor specification.

Temperature Sensor Specification
ParameterMax.

SHT35 Accuracy tolerance1

Repeatability2
Resolution
Specified Range
Response time 8Long Term DriftMax.
typ., 20°C to 60°C
Max.
Low, typ.
Medium, typ.
High, typ.
Typ.
63%
max

°C
°C
°C
°C
°C
°C

Table 2 Temperature sensor specification.

1 For definition of typical and maximum accuracy tolerance, please refer to the document “Sensirion Humidity Sensor Specification Statement”.
2 The stated repeatability is 3 times the standard deviation (3σ) of multiple consecutive measurements at the stated repeatability and at constant ambient conditions. It

is a measure for the noise on the physical sensor output. Different measurement modes allow for high/medium/low repeatability.
3 Specified range refers to the range for which the humidity or temperature sensor specification is guaranteed.
4 For details about recommended humidity and temperature operating range, please refer to section 1.1.
5 Time for achieving 63% of a humidity step function, valid at 25°C and 1m/s airflow. Humidity response time in the application depends on the design-in of the sensor.
6 With activated ART function (see section 4.7) the response time can be improved by a factor of 2.
7 Typical value for operation in normal RH/T operating range, see section 1.1. Maximum value is < 0.5 %RH/yr. Higher drift values might occur due to contaminantenvironments with vaporized solvents, out-gassing tapes, adhesives, packaging materials, etc. For more details please refer to Handling Instructions.
8 Temperature response times strongly depend on the type of heat exchange, the available sensor surface and the design environment of the sensor in the final
application.

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Humidity Sensor Performance Graphs±8

DRH (%RH)±8maximal tolerance
typical tolerance

±6

±4

±2

±2

±0
20

30

40

50

60

70

maximal tolerance
typical tolerance

±6

±4

0
10
SHT30

DRH (%RH)

80

90

±0

100

0
10
SHT31

Relative Humidity (%RH)

Figure 2 Tolerance of RH at 25°C for SHT30.

20

30

40

50

60 70 80 90 100
Relative Humidity (%RH)

Figure 3 Tolerance of RH at 25°C for SHT31.

DRH (%RH)±6maximal tolerance
typical tolerance
±4

±2

±0
0
10
SHT35

20

30

40

50

60 70 80 90 100
Relative Humidity (%RH)

Figure 4 Tolerance of RH at 25°C for SHT35.

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Datasheet SHT3x-DIS
SHT30
RH (%RH)
100
90
80
70
60
50
40
30
20
10
0
0

±4
±3
±2
±2
±2
±2
±2
±2
±2
±3
±4
10

±4
±3
±2
±2
±2
±2
±2
±2
±2
±3
±4
20

SHT31

±4 ±4 ±4 ±4±3 ±3 ±3 ±3±2 ±2 ±2 ±2±2 ±2 ±2 ±2±2 ±3 ±2 ±2±2 ±2 ±2 ±2±2 ±2 ±2 ±2±2 ±2 ±2 ±2±2 ±2 ±2 ±2±3 ±3 ±3 ±3±4 ±4 ±4 ±430 40 50 60
Temperature (°C)

±4
±3
±2
±2
±2
±2
±2
±2
±2
±3
±4
70

RH (%RH)
100 ±2
90 ±2
80 ±2
70 ±2
60 ±2
50 ±2
40 ±2
30 ±2
20 ±2
10 ±2
0 ±2
0

±4
±3
±2
±2
±2
±2
±2
±2
±2
±3
±4
80

Figure 5 Typical tolerance of RH over T for SHT30.

±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
10

±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
20
30
40
50
Temperature (°C)

±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
60

±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
70

±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
80

Figure 6 Typical tolerance of RH over T for SHT31.
SHT35

RH (%RH)
100
90
80
70
60
50
40
30
20
10
0

±2
±2
±2
±1.5
±1.5
±1.5
±1.5
±1.5
±1.5
±1.5
±1.5
0

±2
±2

±2
±2

±2
±2

±2
±2

±2
±2

±1.5
±1.5
±1.5
±1.5
±1.5
±1.5
±1.5
±1.5
10

±1.5 ±1.5 ±1.5 ±1.5
±1.5 ±1.5 ±1.5 ±1.5
±1.5 ±1.5 ±1.5 ±1.5
±1.5 ±1.5 ±1.5 ±1.5
±1.5 ±1.5 ±1.5 ±1.5
±1.5 ±1.5 ±1.5 ±1.5
±1.5 ±1.5 ±1.5 ±1.5
±1.5 ±1.5 ±1.5 ±1.5
20
30
40
50
Temperature (°C)

±2
±2
±2
±1.5
±1.5
±1.5
±1.5
±1.5
±1.5
±1.5
±1.5
60

±2
±2
±2
±2
±2
±2
±1.5
±1.5
±1.5
±1.5
±1.5
70

±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
80

Figure 7 Typical tolerance of RH over T for SHT35.

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Temperature Sensor Performance Graphs
SHT30

SHT31

DT (°C)DT (°C)±1.5±1.5
maximal tolerance

maximal tolerance

typical tolerance

typical tolerance

±1.0

±1.0

±0.5

±0.5

±0.0

±0.0
-40

-20

0

20

40

60

80

100

120

-40

-20

0

20

Temperature (°C)

Figure 8 Temperature accuracy of the SHT30 sensor.

40

60

80

100

120

Temperature (°C)

Figure 9 Temperature accuracy of the SHT31 sensor.

SHT35
DT (°C)±1.5
maximal tolerance
typical tolerance
±1.0

±0.5

±0.0
-40

-20

0

20

40

60

80

100

120

Temperature (°C)

Figure 10 Temperature accuracy of the SHT35 sensor.

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Datasheet SHT3x-DIS

1.1

Recommended Operating Condition

The sensor shows best performance when operated within recommended normal temperature and humidity range of 5 °C
– 60 °C and 20 %RH – 80 %RH, respectively. Long-term exposure to conditions outside normal range, especially at highhumidity, may temporarily offset the RH signal (e.g. +3%RH after 60h kept at >80%RH). After returning into the normal
temperature and humidity range the sensor will slowly come back to calibration state by itself. Prolonged exposure to
extreme conditions may accelerate ageing. To ensure stable operation of the humidity sensor please refer to the document“Handling instructions SHT” Please note as well that this does apply not only to transportation and manufacturing, but also
to operation of the SHT3x-DIS.

2

Specifications

2.1

Electrical Specifications

Parameter

SymbolSupply voltage
Power-up/down level

VDD
VPOR

Slew rate change of the
supply voltage

Condition

VDD,slewidle state(single shot mode)
T=25°C
idle state(single shot mode)
T=125°C

Supply current

IDD

IOH

Heater power

PHeater

Typ.

Max.

2.15
1.8

3.3
2.10

5.5
2.15

V
V
Voltage changes on the
VDD line between
VDD,min and VDD,max
V/ms should be slower thanthe maximum slew rate;
faster slew rates maylead to reset;

-

-

20

-

0.2

2.0

Units Comments

A
-

-

6.0

idle state(periodic dataacquisition mode)

-

45

-

A

Measuring

-

600

1500

A

1.7

-

A

Average

Alert Output driving
strengthMin.

-

1.5x VDD
Heater running

3.6

-

33

Current when sensor is
not performing ameasurement during
single shot mode
Current when sensor is
not performing ameasurement during
periodic data acquisition
mode
Current consumption
while sensor ismeasuring
Current consumption(operation with one
measurement per
second at lowest
repeatability, single shot
mode)

mA

See also section 3.5

mW

Depending on the
supply voltage

Table 3 Electrical specifications, typical values are valid for T=25°C, min. & max. values for T=-40°C … 125°C

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2.2

Timing Specification for the Sensor System

Parameter

SymbolConditions

Min.

Typ.

Max.

Power-up timetPU

After hard reset,
VDD ≥ VPOR

-

0.5

1

Soft reset timetSR

After soft reset.

-

0.5

1.5

tRESETNtMEAS,ltMEAS,mLow repeatability
Medium repeatability

1
-

2.5
4.5

4
6

tMEAS,hHigh repeatability

-

12.5

15

Time between VDD reaching
ms VPOR and sensor entering idle
stateTime between ACK of soft
ms reset command and sensor
entering idle stateµs See section 3.6
ms The three repeatability modes
ms differ with respect tomeasurement duration, noise
ms level and energy consumption.

Units Comments

Duration of reset pulse
Measurement duration

Units Comments

Table 4 System timing specification, valid from -40 °C to 125 °C and 2.4 V … 5.5 V.

Parameter

SymbolConditions

Min.

Typ.

Max.

Power-up timetPU

After hard reset,
VDD ≥ VPOR

-

0.5

1.5

Measurement durationtMEAS,ltMEAS,mLow repeatability
Medium repeatability

-

2.5
4.5

4.5
6.5

tMEAS,hHigh repeatability

-

12.5

15.5

Time between VDD reaching
ms VPOR and sensor entering idlestate
ms The three repeatability modes
ms differ with respect tomeasurement duration, noise
ms level and energy consumption.

Table 5 System timing specification, valid from -40 °C to 125 °C and 2.15 V … < 2.4V.

2.3

Absolute Minimum and Maximum Ratings

Stress levels beyond those listed in Table 6 may cause permanent damage to the device or affect the reliability of thesensor. These are stress ratings only and functional operation of the device at these conditions is not guaranteed. Ratings
are only tested each at a time.
Parameter

RatingSupply voltage VDD-0.3 to 6
Max Voltage on pins (pin 1 (SDA); pin 2 (ADDR); pin 3 (ALERT); pin 4 (SCL); pin 6-0.3 to VDD+0.3(nRESET))
Input current on any pin±100
Operating temperature range-40 to 125
Storage temperature range-40 to 150
9
ESD HBM (human body model)
4
ESD CDM (charge device model)10750
Table 6 Minimum and maximum ratings; voltages may only be applied for short time periods.

Units
V
V
mA
°C
°C
kV
V

9 According to ANSI/ESDA/JEDEC JS-001-2014; AEC-Q100-002.
10 According to ANSI/ESD S5.3.1-2009; AEC-Q100-011.

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3

Communication frequencies up to 1 Mhz are supported
following the specifications given in Table 21.

Pin Assignment

The SHT3x-DIS comes in a 8-pin DFN package – seeTable 7.
Name

Comments

1

SDA

2

ADDR

3

ALERT

4
5

SCL
VDD

6

nRESET

7

R

8

VSS

Serial data; input / output
Address pin; input; connect to either
logic high or low, do not leave floating
Indicates alarm condition; output; mustbe left floating if unused
Serial clock; input / output
Supply voltage; input
Reset pin active low; input; if not used itis recommended to be left floating; canbe connected to VDD with a series
resistor of R ≥2 kΩ
No electrical function; to be connected
to VSSGround

1

8

2

7

3

6

4

5

VDD

nRESET(6)VDD(5)

ALERT(3)

SCL(4)ADDR(2)

SDA(1)die

VSS(8) pad

100nF

Pin

Both SCL and SDA lines are open-drain I/Os with diodes
to VDD and VSS. They should be connected to external
pull-up resistors (please refer to Figure 11). A device on
the I2C bus must only drive a line to ground. The external
pull-up resistors (e.g. Rp=10 kΩ) are required to pull thesignal high. For dimensioning resistor sizes please takebus capacity and communication frequency into account(see for example Section 7.1 of NXPs I2C Manual for
more details11). It should be noted that pull-up resistors
may be included in I/O circuits of microcontrollers. It is
recommended to wire the sensor according to theapplication circuit as shown in Figure 11.

RP

RP

R(7)

Figure 11 Typical application circuit. Please note that thepositioning of the pins does not reflect the position on thereal sensor. This is shown in Table 7.

Table 7 SHT3x-DIS pin assignment (transparent top view).
Dashed lines are only visible if viewed from below. The die
pad is internally connected to VSS.

3.3

Die Pad (center pad)

The electrical specifications of the SHT3x-DIS are shownin Table 3. The power supply pins must be decoupledwith a 100 nF capacitor that shall be placed as close to
the sensor as possible – see Figure 11 for a typicalapplication circuit.

The die pad or center pad is visible from below andlocated in the center of the package. It is electricallyconnected to VSS. Hence electrical considerations do
not impose constraints on the wiring of the die pad.
However, due to mechanical reasons it is recommended
to solder the center pad to the PCB. For more
information on design-in, please refer to the document“SHTxx_STSxx Design Guide”.

3.2

3.4

3.1

Power Pins (VDD, VSS)

Serial Clock and Serial Data (SCL, SDA)SCL is used to synchronize the communication between
microcontroller and the sensor. The clock frequency canbe freely chosen between 0 to 1000 kHz. Commands
with clock stretching according to I2C Standard11 aresupported.
The SDA pin is used to transfer data to and from thesensor. Communication with frequencies up to 400 kHz
must meet the I2C Fast Mode11 standard.

ADDR Pin

Through the appropriate wiring of the ADDR pin the I2C
address can be selected (see Table 8 for the respective
addresses). The ADDR pin can either be connected tologic high or logic low. The address of the sensor can bechanged dynamically during operation by switching thelevel on the ADDR pin. The only constraint is that thelevel has to stay constant starting from the I2C start
condition until the communication is finished. This allows
to connect more than two SHT3x-DIS onto the same bus.

11 http://www.nxp.com/documents/user_manual/UM10204.pdf

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The dynamical switching requires individual ADDR lines
to the sensors.
Please note that the I2C address is represented throughthe 7 MSBs of the I2C read or write header. The LSB
switches between read or write header. The wiring forthe default address is shown in Table 8 and Figure 11.
The ADDR pin must not be left floating. Please note that
only the 7 MSBs of the I2C Read/Write header constitutethe I2C Address.
SHT3x-DIS

I2C Address in Hex.
representation

I2C address A

0x44 (default)

I2C address B

0x45

Condition
ADDR (pin 2)
connected to logic
low
ADDR (pin 2)
connected to logic
highTable 8 I2C device addresses.

3.5

ALERT Pin

The alert pin may be used to connect to the interrupt pinof a microcontroller. The output of the pin depends onthe value of the RH/T reading relative to programmable
limits. Its function is explained in a separate applicationnote. If not used, this pin must be left floating. The pin
switches high, when alert conditions are met. The
maximum driving loads are listed in Table 3. Be awarethat self-heating might occur, depending on the amountof current that flows. Self-heating can be prevented if theAlert Pin is only used to switch a transistor.

3.6

nRESET Pin

The nReset pin may be used to generate a reset of thesensor. A minimum pulse duration of 1 µs is required toreliably trigger a reset of the sensor. Its function is
explained in more detail in section 4. If not used it isrecommended to leave the pin floating or to connect it to
VDD with a series resistor of R ≥2 kΩ. However, thenRESET pin is internally connected to VDD with a pullup resistor of R = 50 kΩ (typ.).

4

Operation and Communication

The SHT3x-DIS supports I2C fast mode (andfrequencies up to 1000 kHz). Clock stretching can be
enabled and disabled through the appropriate usercommand. For detailed information on the I2C protocol,
refer to NXP I2C-bus specification12.

After sending a command to the sensor a minimal
waiting time of 1ms is needed before another command
can be received by the sensor.
All SHT3x-DIS commands and data are mapped to a 16bit address space. Additionally, data and commands areprotected with a CRC checksum. This increases
communication reliability. The 16 bits commands to thesensor already include a 3 bit CRC checksum. Data sentfrom and received by the sensor is always succeeded byan 8 bit CRC.
In write direction it is mandatory to transmit thechecksum, since the SHT3x-DIS only accepts data if it isfollowed by the correct checksum. In read direction it isleft to the master to read and process the checksum.

4.1

Power-Up and Communication Start

The sensor starts powering-up after reaching the powerup threshold voltage VPOR specified in Table 3. Afterreaching this threshold voltage the sensor needs thetime tPU to enter idle state. Once the idle state is entered
it is ready to receive commands from the master(microcontroller).
Each transmission sequence begins with a START
condition (S) and ends with a STOP condition (P) as
described in the I2C-bus specification. Whenever thesensor is powered up, but not performing ameasurement or communicating, it automatically entersidle state for energy saving. This idle state cannot be
controlled by the user.

4.2

Starting a Measurement

A measurement communication sequence consists of a
START condition, the I2C write header (7-bit I2C device
address plus 0 as the write bit) and a 16-bit
measurement command. The proper reception of eachbyte is indicated by the sensor. It pulls the SDA pin low(ACK bit) after the falling edge of the 8th SCL clock toindicate the reception. A complete measurement cycle isdepicted in Table 9.
With the acknowledgement of the measurement
command, the SHT3x-DIS starts measuring humidity
and temperature.

4.3

Measurement Commands for Single Shot
Data Acquisition ModeIn this mode one issued measurement command
triggers the acquisition of one data pair. Each data pairconsists of one 16 bit temperature and one 16 bit
humidity value (in this order). During transmission eachdata value is always followed by a CRC checksum, seesection 4.4.

12 http://www.nxp.com/documents/user_manual/UM10204.pdf

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In single shot mode different measurement commands
can be selected. The 16 bit commands are shown in
Table 9. They differ with respect to repeatability (low,medium and high) and clock stretching (enabled or
disabled).
The repeatability setting influences the measurement
duration and thus the overall energy consumption of thesensor. This is explained in section 2.
Condition
Repeatability

Clockstretching

Hex. code
MSB

LSB

High
06
Mediumenabled
0x2C
0D
Low
10
High
00
Mediumdisabled
0x24
0B
Low
16
e.g. 0x2C06: high repeatability measurement with clock
stretching enabled

sensor does not receive an ACK from the master after
any byte of data, it will not continue sending data.
The sensor will send the temperature value first and thenthe relative humidity value. After having received thechecksum for the humidity value a NACK and stop
condition should be sent (see Table 9).
The I2C master can abort the read transfer with a NACK
condition after any data byte if it is not interested insubsequent data, e.g. the CRC byte or the second
measurement result, in order to save time.
In case the user needs humidity and temperature data
but does not want to process CRC data, it isrecommended to read the two temperature bytes of datawith the CRC byte (without processing the CRC data);
after having read the two humidity bytes, the readtransfer can be aborted with a with a NACK.

No Clock Stretching
When a command without clock stretching has been
issued, the sensor responds to a read header with a not
acknowledge (NACK), if no data is present.

Clock Stretching
When a command with clock stretching has been issued,
the sensor responds to a read header with an ACK andsubsequently pulls down the SCL line. The SCL line ispulled down until the measurement is complete. As soon
as the measurement is complete, the sensor releases
the SCL line and sends the measurement results.

4.5

Table 9 Measurement commands in single shot mode. The
first “SCL free” block indicates a minimal waiting time of 1ms.
(Clear blocks are controlled by the microcontroller, grey
blocks by the sensor).

4.4

Readout of Measurement Results forSingle Shot Mode

After the sensor has completed the measurement, themaster can read the measurement results (pair of RH&T) by sending a START condition followed by an I2C
read header. The sensor will acknowledge the receptionof the read header and send two bytes of data
(temperature) followed by one byte CRC checksum andanother two bytes of data (relative humidity) followed by
one byte CRC checksum. Each byte must be
acknowledged by the microcontroller with an ACK
condition for the sensor to continue sending data. If thewww.sensirion.com

Measurement Commands for Periodic
Data Acquisition ModeIn this mode one issued measurement command yields
a stream of data pairs. Each data pair consists of one 16
bit temperature and one 16 bit humidity value (in thisorder).
In periodic mode different measurement commands canbe selected. The corresponding 16 bit commands areshown in Table 10. They differ with respect torepeatability (low, medium and high) and dataacquisition frequency (0.5, 1, 2, 4 & 10 measurements
per second, mps). Clock stretching cannot be selected inthis mode.
The data acquisition frequency and the repeatability
setting influences the measurement duration and thecurrent consumption of the sensor. This is explained in
section 2 of this datasheet.
If a measurement command is issued, while the sensor
is busy with a measurement (measurement durations
see Table 4), it is recommended to issue a breakcommand first (see section 4.8). Upon reception of the

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Datasheet SHT3x-DIS
break command the sensor abort the ongoingmeasurement and enter the single shot mode.

5

6

7

8

9

W

I2C write header

1

2

3

4

5

6

7

Command MSB

8

9

The ART (accelerated response time) feature can be
activated by issuing the command in Table 12. Afterissuing the ART command the sensor will start acquiring
data with a frequency of 4Hz.

10 11 12 13 14 15 16 17 18

Command LSB

ART Command

16-bit command

Table 10 Measurement commands for periodic dataacquisition mode (Clear blocks are controlled by the
microcontroller, grey blocks by the sensor). N.B.: At thehighest mps setting self-heating of the sensor might occur.

The ART command is structurally similar to any othercommand in Table 10. Hence section 4.5 applies forstarting a measurement, section 4.6 for reading out dataand section 4.8 for stopping the periodic data acquisition.
The ART feature can also be evaluated using the
Evaluation Kit EK-H5 from Sensirion.
CommandHex Code

Periodic Measurement withART

0x2B32

1

S

2

3

4

5

6

I2C Address
I2C write header

4.6

Readout of Measurement Results for
Periodic Mode

Transmission of the measurement data can be initiatedthrough the fetch data command shown in Table 11. If
no measurement data is present the I2C read header is
responded with a NACK (Bit 9 in Table 11) and thecommunication stops. After the read out command fetch
data has been issued, the data memory is cleared, i.e.
no measurement data is present.

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7

8

9

W

1

2

3

4

5

6

7

Command MSB

89

10 11 12 13 14 15 16 17 18

Command LSB

ACK

4

4.7

ACK

3

Table 11 Fetch Data command (Clear blocks are controlled
by the microcontroller, grey blocks by the sensor).

ACK

mps

ACK

2

I2C Address

ACK

1

0x E0 00

Hex. code
MSB
LSB

High
32
Medium
0.5
0x20
24
Low
2F
High
30
Medium
1
0x21
26
Low
2D
High
36
Medium
2
0x22
20
Low
2B
High
34
Medium
4
0x23
22
Low
29
High
37
Medium
10
0x27
21
Low
2A
e.g. 0x2130: 1 high repeatability mps - measurement per
secondS

Hex code

Fetch Data

ACK

Condition
Repeatability

Command16-bit command

Table 12 Command for a periodic data acquisition with

the ART feature (Clear blocks are controlled by the
microcontroller, grey blocks by the sensor).

4.8

Break command / Stop Periodic Data
Acquisition Mode

The periodic data acquisition mode can be stopped using
the break command shown in Table 13. It is
recommended to stop the periodic data acquisition prior
to sending another command (except Fetch Data
command) using the break command. Upon reception of
the break command the sensor will abort the ongoingmeasurement and enter the single shot mode. This takes
1ms.

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Datasheet SHT3x-DIS
0x3093

Table 13 Break command (Clear blocks are controlled by
the microcontroller, grey blocks by the sensor).

4.9

Reset

A system reset of the SHT3x-DIS can be generated
externally by issuing a command (soft reset) or by
sending a pulse to the dedicated reset pin (nReset pin).
Additionally, a system reset is generated internallyduring power-up. During the reset procedure the sensor
will not process commands.
In order to achieve a full reset of the sensor without
removing the power supply, it is recommended to use thenRESET pin of the SHT3x-DIS.

Interface ResetIf communication with the device is lost, the following
signal sequence will reset the serial interface: Whileleaving SDA high, toggle SCL nine or more times. This
must be followed by a Transmission Start sequence
preceding the next command. This sequence resets theinterface only. The status register preserves its content.

functionally identical to using the nReset pin. It is
important to understand that a reset generated in thisway is not device specific. All devices on the same I2C
bus that support the general call mode will perform areset. Additionally, this command only works when thesensor is able to process I2C commands. The
appropriate command consists of two bytes and isshown in Table 15.
Command

Code

Address byte
Second byte
Reset command using thegeneral call address

0x00
0x06

1

2

3

4

5

6

7

8

S General Call Address
General Call 1st byte

0x0006
9

1

2

3

4

5

6

7

Reset Command

8

9

ACK

Hex Code

Break

ACK

CommandGeneral Call 2nd byte

Table 15 Reset through the general call address (Clear
blocks are controlled by the microcontroller, grey blocks by
the sensor).

Reset through the nReset Pin
Pulling the nReset pin low (see Table 7) generates areset similar to a hard reset. The nReset pin is internallyconnected to VDD through a pull-up resistor and hence
active low. The nReset pin has to be pulled low for aminimum of 1 µs to generate a reset of the sensor.

Soft Reset / Re-Initialization

Hard Reset

The SHT3x-DIS provides a soft reset mechanism thatforces the system into a well-defined state without
removing the power supply. When the system is in idle
state the soft reset command can be sent to the SHT3xDIS. This triggers the sensor to reset its system
controller and reloads calibration data from the memory.
In order to start the soft reset procedure the commandas shown in Table 14 should be sent.

A hard reset is achieved by switching the supply voltage
to the VDD Pin off and then on again. In order to prevent
powering the sensor over the ESD diodes, the voltage topins 1 (SDA), 4 (SCL) and 2 (ADDR) also needs to be
removed.

It is worth noting that the sensor reloads calibration dataprior to every measurement by default.
CommandHex Code

Soft Reset

0x30A24.10 Heater
The SHT3x is equipped with an internal heater, whichis meant for plausibility checking only. The temperature
increase achieved by the heater depends on various
parameters and lies in the range of a few degrees
centigrade. It can be switched on and off by command,see table below. The status is listed in the status register.
After a reset the heater is disabled (default condition).

Table 14 Soft reset command (Clear blocks are controlled
by the microcontroller, grey blocks by the sensor).

Reset through General Call
Additionally, a reset of the sensor can also be generatedusing the “general call” mode according to I2C-bus
specification12. This generates a reset which iswww.sensirion.com
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Datasheet SHT3x-DIS
CommandHeater Enable
Heater Disabled

Hex Code
MSB
LSB
0x30

6D
66

Bit

Field description

15

Alert pending status'0': no pending alerts'1': at least one pending alert
Reserved
Heater status‘0’ : Heater OFF‘1’ : Heater ON
Reserved
RH tracking alert‘0’ : no alert‘1’ . alert
T tracking alert‘0’ : no alert‘1’ . alert

14
13
Table 16 Heater command (Clear blocks are controlled by
the microcontroller, grey blocks by the sensor).

12
11

4.11 Status Register10

The status register contains information on theoperational status of the heater, the alert mode and on
the execution status of the last command and the last
write sequence. The command to read out the status
register is shown in Table 17 whereas a description of
the content can be found in Table 18.
Command

Hex code

Read Out of status register

0xF32D

9:5

Reserved

4

System reset detected

‘1’
‘0’
‘0’
‘0’
‘0
‘0’

‘xxxxx’‘1’'0': no reset detected since last ‘clear
status register’ command

3:2
1

0

Table 17 Command to read out the status register (Clear
blocks are controlled by the microcontroller, grey blocks by
the sensor).

Default
value'1': reset detected (hard reset, soft reset
command or supply fail)Reserved
Command status'0': last command executed successfully'1': last command not processed. It waseither invalid, failed the integrated
command checksum
Write data checksum status'0': checksum of last write transfer wascorrect'1': checksum of last write transfer failed

‘00’
‘0’

‘0’

Table 18 Description of the status register.

Clear Status RegisterAll flags (Bit 15, 11, 10, 4) in the status register can becleared (set to zero) by sending the command shown in
Table 19.
CommandHex Code

Clear status register0x 30 41

Table 19 Command to clear the status register (Clear
blocks are controlled by the microcontroller, grey blocks by
the sensor).

4.12 Checksum Calculation
The 8-bit CRC checksum transmitted after each data
word is generated by a CRC algorithm. Its properties are
displayed in Table 20. The CRC covers the contents ofthe two previously transmitted data bytes. To calculate
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Datasheet SHT3x-DIS
the checksum only these two previously transmitted databytes are used.
Property

Value

Name
Width
Protected data
Polynomial
Initialization
Reflect input
Reflect output
Final XORExamples

CRC-8
8 bit
read and/or write data
0x31 (x8 + x5 + x4 + 1)
0xFF
False
False
0x00
CRC (0xBEEF) = 0x92

and compensated for temperature and supply voltage
effects. Converting those raw values into a physicalscale can be achieved using the following formulas.
Relative humidity conversion formula (result in %RH):
RH = 100 

SRH
2 16 − 1Temperature conversion formula (result in °C & °F):S
T C  = − 45 + 175  16 T
2 −1
S
T F  = − 49 + 315  16 T
2 −1

SRH and ST denote the raw sensor output for humidity
and temperature, respectively. The formulas work only
correctly when SRH and ST are used in decimal
representation.

Table 20 I2C CRC properties.

4.13 Conversion of Signal Output
Measurement data is always transferred as 16-bit values(unsigned integer). These values are already linearized

4.14 Communication Timing
Parameter

SymbolSCL clock frequency
Hold time (repeated) START
condition
LOW period of the SCL
clock
HIGH period of the SCL
clock

fSCL

Min.

Typ.

Max.

Units

0

-

1000

kHz

0.24

-

-

µs

tLOW

0.53

-

-

µs

tHIGH

0.26

-

-

µs

-

250
300
300
0.9

ns
ns
ns
ns
ns
µs

tHD;STA

Conditions
After this period, the firstclock pulse is generated

SDA hold time

tHD;DATSDA set-up time
SCL/SDA rise time
SCL/SDA fall time
SDA valid timeSet-up time for a repeated
START condition
Set-up time for STOP
condition
Capacitive load on bus line
Low level input voltage
High level input voltage
Low level output voltage

tSU;DATtR
tF
tVD;DAT00100-tSU;STA

0.26

-

-

µs

tSU;STO

0.26

-

-

µs

CB
VIL
VIH
VOL

0
0.7xVDD--

400
0.3xVDD
1xVDD
0.4

pF
V
V
V

3 mA sink current

Comments

Transmitting data
Receiving data

Table 21 Timing specifications for I2C communication, valid for T=-40°C … 125°C and VDD = VDDmin … VDDmax. The nomenclature
above is according to the I2C (UM10204, Rev. 6, April 4, 2014).

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Datasheet SHT3x-DIS
1/fSCL
tHIGH

tR

tLOW

tF
70%

SCL
tSU;DAT30%
tHD;DATDATA IN

70%

SDA

30%
tVD;DATtF

DATA OUT

tR
70%

SDA

30%

Figure 12 Timing diagram for digital input/output pads. SDA directions are seen from the sensor. Bold SDA lines arecontrolled by the sensor, plain SDA lines are controlled by the micro-controller. Note that SDA valid read time is triggered
by falling edge of preceding toggle.

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Datasheet SHT3x-DIS

5

Packaging

SHT3x-DIS sensors are provided in an open-cavity DFN
package. DFN stands for dual flat no leads. The humidity
sensor opening is centered on the top side of the
package.
The sensor chip is made of silicon and is mounted to alead frame. The latter is made of Cu plated with
Ni/Pd/Au. Chip and lead frame are overmolded by anepoxy-based mold compound leaving the central die pad
and I/O pins exposed for mechanical and electricalconnection. Please note that the side walls of the sensor
are diced and therefore these diced lead frame surfaces
are not covered with the respective plating.
The package (except for the humidity sensor opening)
follows JEDEC publication 95, design registration 4.20,
small scale plastic quad and dual inline, square andrectangular, No-LEAD packages (with optional thermalenhancements) small scale (QFN/SON), Issue D.01,
September 2009.

The top line consists of the pin-1 indicator which islocated in the top left corner and the product name. The
small letter x stands for the accuracy class.
The bottom line consists of 6 letters. The first two digits
XY (=DI) describe the output mode. The third letter (A)represents the manufacturing year (4 = 2014, 5 = 2015,etc). The last three digits (BCD) represent analphanumeric tracking code. That code can be decodedby Sensirion only and allows for tracking on batch level
through production, calibration and testing – and will be
provided upon justified request.
If viewed from below pin 1 is indicated by triangularshaped cut in the otherwise rectangular die pad. The
dimensions of the triangular cut are shown in Figure 14
through the labels T1 & T2.

SHT 3 x

SHT3x-DIS has a Moisture Sensitivity Level (MSL) of 1,
according to IPC/JEDEC J-STD-020. At the same time,
it is recommended to further process the sensors within
1 year after date of delivery.

5.1

XYABCD

Traceability

All SHT3x-DIS sensors are laser marked for easy
identification and traceability. The marking on the sensor
top side consists of a pin-1 indicator and two lines of text.

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Figure 13 Top view of the SHT3x-DIS illustrating the laser
marking.

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Datasheet SHT3x-DIS

5.2

Package Outline

Figure 14 Dimensional drawing of SHT3x-DIS sensor package

Parameter
Package height
Leadframe height
Pad width
Package widthCenter pad length
Package length
Center pad width
Pad pitch
Pad length

Symbol

Min

Nom.

Max

Units Comments

A
A3
b
D
D2
E
E2
e
L
S

0.8
0.2
2.4
1
2.4
1.7
0.25
-

0.9
0.2
0.25
2.5
1.1
2.5
1.8
0.5
0.35
-

1
0.3
2.6
1.2
2.6
1.9
0.45
1.5

mm
mm
mm
mm
mm
mm
mm
mm
mm
mm

T1xT2

-

0.3x45°-mm

Max cavity
Center pad marking

Only as guidance. This value includes all tolerances,including displacement tolerances. Typically the opening
will be smaller.
indicates the position of pin 1

Table 22 Package outline.

5.3

Land PatternFigure 15 shows the land pattern. The land pattern isunderstood to be the open metal areas on the PCB, onto
which the DFN pads are soldered.
The solder mask is understood to be the insulating layer
on top of the PCB covering the copper traces. It is
recommended to design the solder pads as a NonSolder Mask Defined (NSMD) type. For NSMD pads, thesolder mask opening should provide a 60 μm to 75 μm
design clearance between any copper pad and solder
mask. As the pad pitch is only 0.5 mm we recommend tohave one solder mask opening for all 4 I/O pads on one
side.

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For solder paste printing it is recommended to use alaser-cut, stainless steel stencil with electro-polishedtrapezoidal walls and with 0.1 or 0.125 mm stencil
thickness. The length of the stencil apertures for the I/O
pads should be the same as the PCB pads. However,the position of the stencil apertures should have an offset
of 0.1 mm away from the center of the package. The die
pad aperture should cover about 70 – 90 % of the die
pad area –thus it should have a size of about 0.9 mm x
1.6 mm.
For information on the soldering process and further
recommendation on the assembly process please
consult the Handlin Instruction SHT, which can be foundon the Sensirion webpage.

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Datasheet SHT3x-DIS

Recommended Stencil Aperture

2.35

2.55

0.5

1.6

0.25

0.5

0.5

1.7

0.5

0.25

0.5

0.5

Recommended Land Pattern

0.2

1

0.3

0.55

0.9

0.55

Figure 15 Recommended metal land pattern (left) and stencil apertures (right) for SHT3x-DIS. The dashed lines represent the outerdimension of the DFN package. The PCB pads (left) and stencil apertures (right) are indicated through the shaded areas.

6

Shipping Package
Ø1.5 +.1 /-0.0
4.00
2.00 ±.05 SEE Note 2

Ø1.00 MIN
1.75 ±.1

4.00 SEE Note 10.30 ±.05

A

5.50 ±.05
SEE NOTE 2

R 0.2 MAX.
B0
B

12.0 +0.3/-0.1
A

R 0.25 TYP.

K0
A0

SECTION A - A

A0 = 2.75
B0 = 2.75
K0 = 1.20
TOLERANCES - UNLESSNOTED 1PL ±.2 2PL ±.10

NOTES:
1. 10 SPROCKET HOLE PITCH CUMULATIVE TOLERANCE ±0.2
2. POCKET POSITION RELATIVE TO SPROCKET HOLE MEASURED
AS TRUE POSITION OF POCKET, NOT POCKET HOLE
3. A0 AND B0 ARE CALCULATED ON A PLANE AT A DISTANCE "R"ABOVE THE BOTTOM OF THE POCKETDETAIL B

Figure 16 Technical drawing of the packaging tape with sensor orientation in tape. Header tape is to the right and trailer tape to theleft on this drawing. Dimensions are given in millimeters.

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Datasheet SHT3x-DIS

7details about the shipping package is available uponrequest.

Quality

Qualification of the SHT3x-DIS is performed basedon the JEDEC JESD47 qualification test method.

7.1

Material Contents

The device is fully RoHS and WEEE compliant, e.g.
free of Pb, Cd, and Hg.

8Ordering Information

The SHT3x-DIS can be ordered in tape and reelpackaging with different sizes, see Table 23. The
reels are sealed into antistatic ESD bags. The
document “SHT3x shipping package” that shows the

9

Name

Quantity

Order Number

SHT30-DIS-B2.5kS
SHT30-DIS-B10kS
SHT31-DIS-B2.5kS
SHT31-DIS-B10kS
SHT35-DIS-B2.5kS
SHT35-DIS-B10kS

2500
10000
2500
10000
2500
10000

1-101400-01
1-101173-01
1-101386-01
1-101147-01
1-101388-01
1-101479-01

Table 23 SHT3x-DIS ordering options.

Further Information

For more in-depth information on the SHT3x-DIS and its application please consult the documents in Table 24.
Parameter values specified in the datasheet overrule possibly conflicting statements given in references cited inthis datasheet.
Document Name

Description

SourceSHT3x Shipping Package

Information on Tape, Reel and shipping bags
(technical drawing and dimensions)

Available upon request

SHTxx_STSxx Design Guide

Design guidelines for designing SHTxx
humidity sensors into applications

Available for download at the Sensirion
humidity sensors download center:www.sensirion.com/humidity-download

SHTxx Handling Instructions

Guidelines for proper handling of SHTxx
humidity sensors

Available for download at the Sensirion
humidity sensors download center:www.sensirion.com/humidity-download

Sensirion Humidity Sensor
Specification Statement

Definition of sensor specifications.

Available for download at the Sensirion
humidity sensors download center:www.sensirion.com/humidity-download

Table 24 Documents containing further information relevant for theSHT3x-DIS.

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Datasheet SHT3x-DIS

Revision History
Date

VersionOctober 2015

1

June 20162

August 2016

March 2017www.sensirion.com

3

4

Page(s)Changes-

2-4Specifications for SHT35 added

6

ESD specifications updated

7

Table 7 “Comments” section updated

7

Figure 11 updated according to Table 7

11

Updated information about data memory to: “After the read out command“fetch data” has been issued, the data memory is reset, i.e. no measurement
data is present.

17

Ordering information in Table 23 updated

6

Updated Table 3

7Updated Table 4

7Updated information on ESD testing norm

8

Updated Table 7

8

Figure 11 and Table 7 updated

4

Figure 7 updated

2-5

Updated RH&T accuracy specifications, see Table 1, Table 2, Figure 2,
Figure 5, Figure 8, Figure 9 and Figure 10

9

Table 8 updated

6

Table 3 updated

8

Figure 11 updated

15

Table 21 updated

17

Table 22 updated

18

Figure 15 land pattern drawing simplified (no parameter changed)

19

Inlcuded: “Parameter values specified in the datasheet overrule possibly
conflicting statements given in references cited in this datasheet.“

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Datasheet SHT3x-DIS
22 May 20185multiple

VDDmin=2.15V

multiple

Typo & formatting correction

2

Updated RH repeatability values in Table 1

2

Updated T repeatability and resolution in Table 2

6

Table 3Updated VDDmin and POR levels
Updated supply current values
Updated specification range

7

Updated soft reset time in Table 4

7

Introduced Table 5

7Introduced “Ratings are only tested each at a time.” in section 2.3

9Introduced “After sending a command to the sensor a minimal waiting timeof 1ms is needed before another command can be received by the sensor.”
In section 4

9Removed: “The stop condition is optional.” in section 4.1

10

Updated label of Table 9 with “The first “SCL free” block indicates a minimal
waiting time of 1ms.”

10

Updated section 4.5 to “Upon reception of the break command the sensor
abort the ongoing measurement and enter the single shot mode.”11

Updated section 4.8 to “Upon reception of the break command the sensor
will abort the ongoing measurement and enter the single shot mode. Thistakes 1ms.”

14

Updated Table 21

February 2019619

Revised qualification test method in section 7

December

7

19

Updated Table 24 due to obsolete document: Info covered in Handling
Instructionwww.sensirion.com

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Datasheet SHT3x-DIS

Important Notices
Warning, Personal Injury
Do not use this product as safety or emergency stop devices
or in any other application where failure of the product could
result in personal injury. Do not use this product for
applications other than its intended and authorized use.
Before installing, handling, using or servicing this product,
please consult the data sheet and application notes. Failure
to comply with these instructions could result in death orserious injury.
If the Buyer shall purchase or use SENSIRION products for any
unintended or unauthorized application, Buyer shall defend,
indemnify and hold harmless SENSIRION and its officers,
employees, subsidiaries, affiliates and distributors against all
claims, costs, damages and expenses, and reasonable attorneyfees arising out of, directly or indirectly, any claim of personal
injury or death associated with such unintended or unauthorizeduse, even if SENSIRION shall be allegedly negligent with respect
to the design or the manufacture of the product.
ESD Precautions
The inherent design of this component causes it to be sensitive
to electrostatic discharge (ESD). To prevent ESD-induced
damage and/or degradation, take customary and statutory ESD
precautions when handling this product.
See application note “ESD, Latchup and EMC” for more
information.
Warranty
SENSIRION warrants solely to the original purchaser of thisproduct for a period of 12 months (one year) from the date ofdelivery that this product shall be of the quality, material andworkmanship defined in SENSIRION’s published specificationsof the product. Within such period, if proven to be defective,
SENSIRION shall repair and/or replace this product, in
SENSIRION’S discretion, free of charge to the Buyer, provided
that:•notice in writing describing the defects shall be given to
SENSIRION within fourteen (14) days after theirappearance;•such defects shall be found, to SENSIRION’s reasonablesatisfaction, to have arisen from SENSIRION’s faulty
design, material, or workmanship;•
the defective product shall be returned to SENSIRION’s
factory at the Buyer’s expense; and•the warranty period for any repaired or replaced productshall be limited to the unexpired portion of the original
period.
This warranty does not apply to any equipment which has notbeen installed and used within the specifications recommended
by SENSIRION for the intended and proper use of theequipment. EXCEPT FOR THE WARRANTIES EXPRESSLYSET FORTH HEREIN, SENSIRION MAKES NO WARRANTIES,EITHER EXPRESS OR IMPLIED, WITH RESPECT TO THE
PRODUCT. ANY AND ALL WARRANTIES, INCLUDINGWITHOUT
LIMITATION,WARRANTIESOFMERCHANTABILITY OR FITNESS FOR A PARTICULARPURPOSE, ARE EXPRESSLY EXCLUDED AND DECLINED.
SENSIRION is only liable for defects of this product arising under
the conditions of operation provided for in the data sheet andproper use of the goods. SENSIRION explicitly disclaims all
warranties, express or implied, for any period during which thegoods are operated or stored not in accordance with the technicalspecifications.
SENSIRION does not assume any liability arising out of any
application or use of any product or circuit and specificallydisclaims any and all liability, including without limitationconsequential or incidental damages. All operating parameters,
including without limitation recommended parameters, must be
validated for each customer’s applications by customer’s
technical experts. Recommended parameters can and do vary in
different applications.
SENSIRION reserves the right, without further notice, (i) tochange the product specifications and/or the information in thisdocument and (ii) to improve reliability, functions and design ofthis product.
Copyright © 2019, by SENSIRION.
CMOSens® is a trademark of Sensirion
All rights reserved

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phone: +1 312 690 5858
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info-kr@sensirion.com
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phone:
fax:

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info@sensirion.com
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phone: +41 44 306 40 00

info-us@sensirion.com

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