Tapes for Semiconductor ProcessWhat is UV Tape ?
UV Tape is adhesive tape for semiconductor process. It is suitable to protect
surface of semiconductor wafer during backgrinding process, and to holdsemiconductor wafer with ring frame during dicing process. It is also applicable forvarious workpieces such as ceramics, glass, sapphire and so on.

Adhesive StrengthHighLow

Backgrinding
DicingBefore UV

The advantage of UV tape
UV tape has stronger adhesivestrength and can hold wafer firmlyin backgrinding process or dicingprocess. After UV irradiation,adhesive strength decreases
drastically and easy de-taping or die
pick up can be achieved.

De-taping
Pick up
UV
Irradiation

After UVStructure
Tape consists of backing film and adhesive layer, and the surface of the adhesive
layer is covered with a release film. Backing film, adhesive layer, and release film
are mainly made of polyolefin, acrylic adhesive and PET, respectively.
Release Film
Adhesive
Backing Film

Process

Backgrinding

DicingTapeSP Series

CP Series

UC Series

FC Series

Features

UV TypeNon-UV TypeUV Type

UV TypeRelease Film

PETPET
Polypropylene

PETPET

Adhesive

Acrylic

Acrylic

Acrylic

Acrylic

Backing Film

Polyolefin

Polyolefin

Polyolefin

Polyolefin＊ Data shown in this brochure are typical values and not guaranteed values.
＊ For any other special application, please contact our representatives.

SP Series
CP Series
SP Series

UV Tape for Wafer Backgrinding

・SP series is designed for surface protection of semiconductor wafer during backgrinding process.
・Easily de-taped from wafer without stress after UV irradiation.
Tape

SP-594M-130

SP-541B-205

SP5156B-130

SP-537T-230

Backing Film Thickness(µm)
Adhesive Thickness(µm)

10030165
4011020100130

8.6

2.7

1.4

5.0

0.1

0.5

0.40.7#280- Before UVSUS After UV

AdhesiveStrength(N/25mm)

Before UV
SiWafer After UV

3.3

1.6

0.6

1.9

0.1

0.2

0.1

0.1

TensileStrength(N/10mm)MD

23262121TD

22231718

Elongation(%)

MD

800

430

450570

TD

930

570

620

730

・Low Warpage
・For Thin Wafer

・For Bumped
Wafer

・Standard
・Low Warpage
・Etching Durable ・For Thin Wafer

Features

CP Series

Non-UV Tape for Wafer Backgrinding

・CP series is designed for surface protection of semiconductor wafer during backgrinding process.
・Easily de-taped from wafer without stress by optimized adhesive strength.
Tape

CP9007B-130

CP9003B-205B

CP9079B-200

Backing Film Thickness(µm)
Adhesive Thickness(µm)

100
30165
40165
35

AdhesiveStrength(N/25mm)#280-SUS

0.9

1.80.6Si-Wafer

0.7

1.60.4

Tensile Strength(N/10mm)MD

214434TD

193436

Elongation(%)

MD

550

600

500

TD

710

710

690

・StandardRoughness・Surface
Absorption(<20µm)
・Low Warpage
・For Thin Wafer
・Acid Etching Durable

・Silicone Free Release
Film(No release agent)Features

UC Series
FC Series
UC Series

UV Tape for Wafer Dicing

・UC series is designed to hold semiconductor wafer with ring frame, during dicing process.
・Easy die pick up without stress after UV irradiation.
TapeBacking Film Thickness(µm)
Adhesive Thickness(µm)
AdhesiveStrength(N/25mm)
TensileStrength(N/10mm)
Elongation(%)#280- Before UVSUS After UV
Si- Before UV
Wafer After UVMDTDMDTD

UC-353EP-110A100
10UC3026M-11010010UC3044M-110B100
10UC-334EP-858057.1
0.4
2.7
0.1
49
44750820

5.00.51.6
0.1
2626310
410

2.7
0.2
1.2
0.1
4139740
800

2.2
0.3
1.1
0.2
2218360520

・Standard・For Die Separation ・For In-Line Process ・For Metalized
By Expansion ・For Thin Wafer
Wafer
・For Thick Wafer

Features

FC Series

UV Tape for Package Dicing

・Optimized tackiness holds packages during dicing process.
・Easy die pick up for BGA, QFN, and other package types, after UV irradiation.
TapeFC-217M-170

FC-224M-170

FC2143M-165

FS-8304-170

Backing Film Thickness(µm)
Adhesive Thickness(µm)

1502015020150
1515020#280- Before UVSUS After UV

AdhesiveStrength(N/25mm)
AdhesiveStrength(N/10mm)
TensileStrength(N/10mm)

6.7

6.2

9.8

4.7

0.4

0.4

0.2

0.5

Si- Before UV
Wafer After UV

6.6

4.8

7.3

5.5

0.3

0.3

0.1

0.3

Before UV

0.5

0.6

1.3

0.6

After UV

0.1

0.1

0.1

0.1

MD

34

4463

48

TD

32

4260

46

MD

790

340

780

650

TD920

400

820

680

・Standard

・Burr Suppressed
Backing Film

・For Small
Package

PKG

Elongation(%)
Features・Anti-ESD
Before UV:9E+10After UV:5E+11

UV Tape for Special
Application
UV Tape for Special Application
UV Tapefor Wafer Dicing
UC Series

UV Tapefor Wafer Backgrinding
SP Series

Tape forGlass/Resin Film

Backgrinding Tapefor Sapphire/SiC/GaAs Wafer

Core Material
Technologies

Transparent Tape

Heat Resistant Tape

Double Sided TapeUV Tape for Package Dicing
FC Series

Non-UV Tapefor Wafer Backgrinding
CP Series

Tape

UC3160M-95

UC3145M-170

UC3166M-115

UC3098M-110

Backing Film Thickness(µm)
Adhesive Thickness(µm)

8015150
2010015100
10#280- Before UVSUS After UV

1.8

11.4

8.1

6.1

0.3

0.4

0.3

0.4

Before UV
SiWafer After UV

0.5

10.4

7.7

2.5

0.1

0.1

0.2

0.1

Before UV

0.5

8.1

7.1

2.3

After UV

0.1

0.1

0.1

0.1

Adhesive
Strength(N/25mm)

GlassFeatures

・For Glass Chip
Separation
By Expansion
・For Glass Chip
Carrier

Tape
Backing Film Thickness(µm)
Adhesive Thickness(µm)

UC3162T-120
10020

Adhesive
Strength(N/25mm)#280- Before UVSUS After UV
Before UV
SiWafer After UVFeatures

・For Glass Blade ・For Glass Chip ・For Glass/ResinDicing
Carrier/Cleaning Film Blade Dicing

UC-228W-110
7020+20

SP-537T-130
10030SP6101T-40
25154.4
114.1
1.4
0.2
0.2
1.6
0.1
2.2
3.3
1.7
0.9
0.1
0.1
0.1
0.1
・Transparent
・For Sapphire/
・For Laser Dicing/・Heat Resistant
SiC/GaAs Wafer
・Double Sided
Marking Through・For Sputter
Backgrinding
Tape【Tensile Strength/Elongation Test Conditions】【Adhesive Strength Test Conditions】
Sampling : Before UV Stretching Speed : 300mm/min
Substrate : Mirror-Polished Silicon Wafer(Si-Wafer),
MD : Machine Direction TD : Transvers Direction#280-Polished Stainless Steel Plate(#280-SUS),
Package(PKG), Glass
Peeling Angle : 90° Peeling Speed : 50mm/min (SP, UC, FC Series)
Peeling Angle : 180° Peeling Speed : 300mm/min (CP Series)

ISO 9001 Certification

Furukawa Electric has acquired theISO 9001 certification for Global Quality
Management System about design,development and manufacture of tapes
for semiconductor process.

ISO 14001 Certification

Hiratsuka Works, Mie Works
Furukawa Electric recognizes
that preservation of the global
environment is a criticalissue for society, and shallincorporate consideration ofenvironmental preservation
issues into every phase ofcorporate activity, to contributeforwards the sustainable
development of prosperous
and bright society.

https://www.furukawa.co.jp/uvtape/en/
AT Technical Support & Sales Department, AT & Functional Plastics Division
Hiratsuka Works:
5-1-9, Higashi-yawata, Hiratsuka, 254-0016, Japan
TEL: +81-463-24-8333 FAX: 81-463-24-8338
E-mail fec.at-tape@furukawaelectric.com* Please understand that contents of this catalog may change without notice.
* Company and product names appearing in this publication are registered trademarks or trademarks of respective companies.
Export Control Regulations	The products and/or technical information presented in this publication may be subject to the application of the Foreign Exchange and Foreign
Trade Act and other related laws and regulations in Japan. In addition, the Export Administration Regulations (EAR) of the United States may
be applicable. In cases where exporting or reexporting the products and/or technical information presented in this publication, customers arerequested to follow the necessary procedures at their own responsibility and cost. Please contact the Ministry of Economy, Trade and Industryof Japan or the Department of Commerce of the United States for details about procedures.

PE-063 2204 TR 100 D