www.transcend-info.com

Embedded Solutions

DRAM Modules

DDR4

Transcend's DDR4 DRAM modules operate at a nominal voltage of just 1.2V, offering higher energy efficiency andexceptional clock speeds to cater to the demands of the embedded industry. The modules are available in multiple
form factors and technologies, such as ECC and wide-temperature support. All components are of the highest
quality, having been sourced directly from the world's first-tier supplier of DRAM chips and stringently tested for
unparalleled compatibility, reliability, and performance.

Features

Advanced Technologies• JEDEC standard 1.2V ± 0.06V power supply• High energy efficiency• 8 bit pre-fetch• Burst Length: 4, 8Anti-Sulfur
Technology

Corner Bond &Underfill

WideTemperature

30 µGold Finger• 16 Banks (4 Bank Groups)• Support DBI mode
• Support Command/Address parity detection• Support Data Cyclic Redundancy Check (CRC) for improved datareliability• On-die termination with ODT pin• Serial presence detect with EEPROM• 100% tested for stability, compatibility and performance© Transcend Information, Inc. All Rights Reserved.

ConformalCoating

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DDR4 Unbuffered DIMMs
DDR4

Module Type

Long-DIMM

SO-DIMM

Product Image

Standard

JEDECFrequency

3200/2666/2400/2133 MHz

Capacity

2GB~32GB

Voltage

1.2V

Pin CountLong-DIMM: 288 pin

SO-DIMM: 260 pin

PCB HeightStandard: 1.23 inches
Very Low Profile: 0.74 inches

1.18 inches

Standard Temperature: 0°C~ 85°C
Wide Temperature: -40°C~ 85°C

Operating Temperature

Ordering Information
DDR4-3200 Long-DIMM
Component Rank x Org.
Capacity Composition
8GB(1Gx8)x8
1Rx8
16GB

1Gx8

2Rx8

Standard(1.2V)
TS1GLH64V2B2

Wide Temp.
(-40°C~ 85°C)-Very Low Profile(VLP)-

TS2GLH64V2B2--Standard(1.2V)

Wide Temp.
(-40°C~ 85°C)

Very Low Profile(VLP)

DDR4-3200 SO-DIMM
Component Rank x Org.
Capacity Composition
8GB(1Gx8)x8

1Rx8

TS1GSH64V2B2--

16GB

1Gx8

2Rx8

TS2GSH64V2B2--© Transcend Information, Inc. All Rights Reserved.

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DDR4-2666 Long-DIMM
Component Rank x Org.
Capacity Composition
2GB(256Mx16)x4
1Rx16
4GB
(512Mx16)x4
1Rx16
4GB(512Mx8)x8
1Rx88GB(512Mx8)x16
2Rx88GB(1Gx8)x81Rx88GB(1Gx8)x8
1Rx816GB(1Gx8)x16
2Rx816GB(1Gx8)x16
2Rx832GB(2Gx8)x16
2Rx832GB(2Gx8)x16
2Rx8Standard(1.2V)
TS256MLH64V6X
TS512MLH64V6D
TS512MLH64V6H
TS1GLH64V6H
TS1GLH64V6B
TS1GLH64V6B2T S2GLH64V6B
TS2GLH64V6B2TS4GLH64V6E
TS4GLH64V6E2Wide Temp.
(-40°C~ 85°C)
TS256MLH64V6X-I
TS512MLH64V6D-I
TS512MLH64V6H-I
TS1GLH64V6H-I
TS1GLH64V6B-I
TS2GLH64V6B-I
TS4GLH64V6E-I-Standard(1.2V)
TS256MSH64V6X
TS512MSH64V6DTS512MSH64V6H
TS1GSH64V6H
TS1GSH64V6B
TS1GSH64V6B2TS2GSH64V6B
TS2GSH64V6B2TS4GSH64V6E

Wide Temp.
(-40°C~ 85°C)
TS256MSH64V6X-I
TS512MSH64V6D-I
TS512MSH64V6H-I
TS1GSH64V6H-I
TS1GSH64V6B-I-Very Low Profile(VLP)
TS256MLH64V6XLTS512MLH64V6DL
TS512MLH64V6HL
TS1GLH64V6HL
TS1GLH64V6BL
TS2GLH64V6BL
TS4GLH64V6EL-DDR4-2666 SO-DIMM
Component Rank x Org.
Capacity Composition
2GB(256Mx16)x4
1Rx16
4GB
(512Mx16)x4
1Rx16
4GB
(512Mx8)x8
1Rx88GB(512Mx8)x16
2Rx88GB(1Gx8)x8
1Rx88GB(1Gx8)x8
1Rx816GB(1Gx8)x16
2Rx816GB(1Gx8)x16
2Rx832GB(2Gx8)x162Rx832GB(2Gx8)x16
2Rx8

TS4GSH64V6E2TS2GSH64V6B-I
TS4GSH64V6E-I-Standard(1.2V)

Wide Temp.
(-40°C~ 85°C)

Very Low Profile(VLP)

TS256MLH64V4X
TS512MLH64V4D
TS512MLH64V4H
TS1GLH64V4H
TS1GLH64V4B
TS2GLH64V4B
TS4GLH64V4E

TS256MLH64V4X-I
TS512MLH64V4D-I
TS512MLH64V4H-I
TS1GLH64V4H-I
TS1GLH64V4B-I
TS2GLH64V4B-ITS4GLH64V4E-I

TS256MLH64V4XL
TS512MLH64V4DL
TS512MLH64V4HL
TS1GLH64V4HL
TS1GLH64V4BL
TS2GLH64V4BL
TS4GLH64V4EL

Standard(1.2V)

Wide Temp.
(-40°C~ 85°C)

TS256MSH64V4X
TS512MSH64V4D
TS512MSH64V4H
TS1GSH64V4H
TS1GSH64V4B
TS2GSH64V4B
TS4GSH64V4E

TS256MSH64V4X-I
TS512MSH64V4D-I
TS512MSH64V4H-I
TS1GSH64V4H-I
TS1GSH64V4B-I
TS2GSH64V4B-I
TS4GSH64V4E-I

DDR4-2400 Long-DIMM
Component Rank x Org.
Capacity Composition
2GB
4GB
4GB
8GB
8GB
16GB
32GB

(256Mx16)x4(512Mx16)x4(512Mx8)x8(512Mx8)x16(1Gx8)x8(1Gx8)x16(2Gx8)x16

1Rx16
1Rx16
1Rx8
2Rx8
1Rx8
2Rx8
2Rx8

DDR4-2400 SO-DIMM
Component Rank x Org.
Capacity Composition
2GB4GB
4GB8GB
8GB
16GB
32GB

(256Mx16)x4(512Mx16)x4(512Mx8)x8(512Mx8)x16(1Gx8)x8(1Gx8)x16(2Gx8)x16

1Rx16
1Rx16
1Rx8
2Rx8
1Rx8
2Rx8
2Rx8

© Transcend Information, Inc. All Rights Reserved.

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DDR4-2133 Long-DIMM
Component Rank x Org.
Capacity Composition
4GB(512Mx16)x41Rx164GB(512Mx8)x8
1Rx88GB(512Mx8)x16
2Rx88GB(1Gx8)x8
1Rx816GB(1Gx8)x16
2Rx8Standard(1.2V)
TS512MLH64V1D
TS512MLH64V1H
TS1GLH64V1H
TS1GLH64V1B
TS2GLH64V1B

Wide Temp.
(-40°C~ 85°C)
TS512MLH64V1D-I
TS512MLH64V1H-I
TS1GLH64V1H-I
TS1GLH64V1B-I
TS2GLH64V1B-I

Standard(1.2V)
TS256MSH64V1X
TS512MSH64V1D
TS512MSH64V1H
TS1GSH64V1H
TS1GSH64V1B
TS2GSH64V1B

Wide Temp.
(-40°C~ 85°C)
TS256MSH64V1X-I
TS512MSH64V1D-I
TS512MSH64V1H-ITS1GSH64V1H-I
TS1GSH64V1B-I
TS2GSH64V1B-I

DDR4-2133 SO-DIMM
Component Rank x Org.
Capacity Composition
2GB(256Mx16)x4
1Rx164GB(512Mx16)x4
1Rx164GB(512Mx8)x8
1Rx88GB(512Mx8)x16
2Rx88GB(1Gx8)x8
1Rx816GB(1Gx8)x16
2Rx8© Transcend Information, Inc. All Rights Reserved.

Very Low Profile(VLP)
TS512MLH64V1DL
TS512MLH64V1HL
TS1GLH64V1HL
TS1GLH64V1BL
TS2GLH64V1BL

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DDR4 ECC DIMMs
DDR4Module Type

ECC Long-DIMM

ECC SO-DIMM

Product ImageStandard

JEDECFrequency

2666/2400/2133 MHz

Capacity

4GB~32GB

Voltage

1.2V

Pin Count

ECC Long-DIMM: 288 pin

ECC SO-DIMM: 260 pin

PCB HeightStandard: 1.23 inches
Very Low Profile: 0.74 inches

1.18 inches

PCB Gold Finger Thickness

30μ”

Anti-Sulfuration

Default

Operating TemperatureStandard Temperature: 0°C~ 85°C
Wide Temperature: -40°C~ 85°C

Ordering Information
DDR4-2666 ECC Long-DIMM
Component Rank x Org.
Capacity Composition
4GB8GB
8GB
16GB
32GB

(512Mx8)x9(512Mx8)x18(1Gx8)x9(1Gx8)x18(2Gx8)x18

1Rx8
2Rx8
1Rx8
2Rx82Rx8Standard(1.2V)

Wide Temp.
(-40°C~ 85°C)

Very Low Profile(VLP)

TS512MLH72V6H
TS1GLH72V6H
TS1GLH72V6B
TS2GLH72V6B
TS4GLH72V6E

TS512MLH72V6H-I
TS1GLH72V6H-I
TS1GLH72V6B-I
TS2GLH72V6B-I
TS4GLH72V6E-I

TS512MLH72V6HL
TS1GLH72V6HL
TS1GLH72V6BL
TS2GLH72V6BL
TS4GLH72V6EL

Standard(1.2V)

Wide Temp.
(-40°C~ 85°C)
TS512MSH72V6H-I
TS1GSH72V6H-I
TS1GSH72V6B-I
TS2GSH72V6B-I
TS4GSH72V6E-I

DDR4-2666 ECC SO-DIMM
Component Rank x Org.
Capacity Composition
4GB8GB8GB
16GB
32GB

(512Mx8)x9(512Mx8)x18(1Gx8)x9(1Gx8)x18(2Gx8)x18

1Rx8
2Rx8
1Rx8
2Rx8
2Rx8

TS512MSH72V6H
TS1GSH72V6H
TS1GSH72V6B
TS2GSH72V6B
TS4GSH72V6E

32GB(2Gx8)x18

2Rx8

TS4GSH72V6E2© Transcend Information, Inc. All Rights Reserved.

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DDR4-2400 ECC Long-DIMM
Component Rank x Org.
Capacity Composition

Standard(1.2V)

Wide Temp.
(-40°C~ 85°C)

Very Low Profile(VLP)

4GB
8GB

(512Mx8)x9(512Mx8)x18

1Rx8
2Rx8

TS512MLH72V4HTS1GLH72V4H

TS512MLH72V4H-I
TS1GLH72V4H-I

TS512MLH72V4HL
TS1GLH72V4HL

8GB
16GB
32GB

(1Gx8)x9(1Gx8)x18(2Gx8)x18

1Rx8
2Rx8
2Rx8

TS1GLH72V4B
TS2GLH72V4B
TS4GLH72V4E

TS1GLH72V4B-I
TS2GLH72V4B-I
TS4GLH72V4E-I

TS1GLH72V4BL
TS2GLH72V4BL-Standard(1.2V)

Wide Temp.
(-40°C~ 85°C)

TS512MSH72V4H
TS1GSH72V4H
TS1GSH72V4B
TS2GSH72V4B
TS4GSH72V4E

TS512MSH72V4H-I
TS1GSH72V4H-I
TS1GSH72V4B-I
TS2GSH72V4B-I
TS4GSH72V4E-I

Standard(1.2V)

Wide Temp.
(-40°C~ 85°C)

Very Low Profile(VLP)

TS512MLH72V1H
TS1GLH72V1H
TS1GLH72V1B
TS2GLH72V1B

TS512MLH72V1H-I
TS1GLH72V1H-I
TS1GLH72V1B-I
TS2GLH72V1B-I

TS512MLH72V1HL
TS1GLH72V1HL
TS1GLH72V1BL
TS2GLH72V1BL

Standard(1.2V)

Wide Temp.
(-40°C~ 85°C)

TS512MSH72V1H
TS1GSH72V1H
TS1GSH72V1B
TS2GSH72V1B

TS512MSH72V1H-I
TS1GSH72V1H-I
TS1GSH72V1B-I
TS2GSH72V1B-I

DDR4-2400 ECC SO-DIMM
Component Rank x Org.
Capacity Composition
4GB
8GB
8GB
16GB
32GB

(512Mx8)x9(512Mx8)x18(1Gx8)x9(1Gx8)x18(2Gx8)x18

1Rx8
2Rx8
1Rx8
2Rx8
2Rx8

DDR4-2133 ECC Long-DIMM
Component Rank x Org.
Capacity Composition
4GB8GB
8GB
16GB(512Mx8)x9(512Mx8)x18(1Gx8)x9(1Gx8)x18

1Rx8
2Rx8
1Rx8
2Rx8

DDR4-2133 ECC SO-DIMM
Component Rank x Org.
Capacity Composition
4GB8GB8GB
16GB(512Mx8)x9(512Mx8)x18(1Gx8)x9(1Gx8)x18

1Rx8
2Rx8
1Rx8
2Rx8

© Transcend Information, Inc. All Rights Reserved.

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DDR4 Registered DIMMs
DDR4

Module Type

Registered DIMM

Product Image

Standard

JEDEC

Frequency

2666/2400/2133 MHz

Capacity

4GB~32GB

Voltage

1.2V

Pin Count

R-DIMM: 288 pin

PCB HeightStandard: 1.23 inches
Very Low Profile: 0.74 inches

PCB Gold Finger Thickness

30μ”

Anti-Sulfuration

Default

Operating TemperatureStandard Temperature: 0°C~ 85°C

Ordering Information
DDR4-2666 Registered DIMM
Capacity

Component
Composition

Rank x Org.

Standard(1.2V)

Very Low Profile
(VLP)

4GB
8GB
8GB
16GB

(512Mx8)x9(512Mx8)x18(1Gx8)x9(1Gx8)x18

1Rx8
2Rx8
1Rx82Rx8

TS512MHR72V6H
TS1GHR72V6H
TS1GHR72V6B
TS2GHR72V6B

-32GB
32GB
32GB

(2Gx4)x36(2Gx8)x18(2Gx8)x18

2Rx4
2Rx8
2Rx8

TS4GHR72V6C
TS4GHR72V6E
TS4GHR72V6E2© Transcend Information, Inc. All Rights Reserved.

TS2GHR72V6BL
TS4GHR72V6EL

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DDR4-2400 Registered DIMM
Capacity

Component
Composition

Rank x Org.

Standard(1.2V)

Very Low Profile
(VLP)

4GB
8GB
8GB
16GB
32GB
32GB

(512Mx8)x9(512Mx8)x18(1Gx8)x9(1Gx8)x18(2Gx4)x36(2Gx8)x18

1Rx82Rx8
1Rx8
2Rx8
2Rx4
2Rx8

TS512MHR72V4H
TS1GHR72V4H
TS1GHR72V4B
TS2GHR72V4B
TS4GHR72V4C
TS4GHR72V4E

TS1GHR72V4HL
TS2GHR72V4BL
TS4GHR72V4EL

DDR4-2133 Registered DIMM
Capacity

Component
Composition

Rank x Org.

Standard(1.2V)

Very Low Profile
(VLP)

4GB
8GB
8GB
16GB
32GB

(512Mx8)x9(512Mx8)x18(1Gx8)x9(1Gx8)x18(2Gx4)x36

1Rx8
2Rx8
1Rx8
2Rx8
2Rx4

TS512MHR72V1H
TS1GHR72V1H
TS1GHR72V1B
TS2GHR72V1B
TS4GHR72V1C

TS512MHR72V1HL
TS1GHR72V1HLTS1GHR72V1BL
TS2GHR72V1BL-Product specifications are subject to change without notice. Pictures shown may differ from actual products. Due to the complexity and variety of industrial applications, Transcend cannot
guarantee 100% compatibility with all platforms and under all scenarios. For special applications and environments, it is strongly suggested that you contact Transcend beforehand for clarification.

Please feel free to contact us with any special requests you might have.
Tel: +886-2-2792-8000
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