Thermalnite added AlN substratewith both high thermal conductivity and high fracture toughness1Company
A materials start-up company from Nagoya University
with cutting-edge technology in heat-dissipating materials
Name

U-MAP Co., Ltd.

Foundation

December 12, 2016

Board memberCEOÿKenji Nishitani

Employees
CapitalCOOÿTakahiro MaedaCTOÿToru Ujihara20$ 1,000,000

U-MAP Co., Ltd.

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History
Establishment of R&D infrastructure and pilot production basefor commercialization of new materials
2018

Adopted for "New Aichi Research and Development Subsidy" by Aichi Prefecture*
Accepted by the Ministry of Economy, Trade and Industry (METI) for the "Strategic Support for Advanced
Technology (Supporter) Project "*Won "Grand Prix" at ILS Award 2018 / "Grand Prize" at CNB Venture Award 20182019

Selected for NEDO's "Support Project for R&D-based Startups in Seed Stage (STS) "*Selected for "New Aichi Creative R&D Subsidy" by Aichi Prefecture*
Selected as one of the five hands-on companies in the <Aichi-Austin program <Selected for <Aichi Core Project III (2019-2021)=
Won the Deep Tech Grand Prix "Grand Prize" and two "Company Awards

2020

Selected for <NEDO's Strategic Energy Conservation Technology Innovation Program=*
Selected as "J-Startup CENTRAL" in the Global COE Program; Subsidized projects by national
professional organizations, etc.

U-MAP Co., Ltd.

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Heat problems in all electronic devices
In order to dissipate the heat, the size of the equipment is increased
and enormous cooling energy loss occurs.
EVûPower Device
Auto-driving5Gû
Next5GHigh brightness
Data center
LED

Wireless

Smart phoneAIûIoTcharging<Heat generation=is the biggest enemy of electronic
devices causing&ø Performance degradation
ø Decreased device lifeø Reduced safety

The key to achieving high heat dissipation performance is the filler material used indevice components. U-MAP has developed a new filler material,
which makes it possible to provide optimal components for electronic devices.
U-MAP Co., Ltd.

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About Thermalnite

It is a fiber-like aluminum nitride single crystal, which achieves high thermal
conductivity and high water resistance.
As a filler material, it is expected to be applied to ceramics/resin composite materials.

ü High Thermal conductivityü insulation properties ü High aspect ratio

Thermalnite's high quality mass production isÿFiber shapeÿ

the world's only original U-MAP technology.

U-MAP Co., Ltd.

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New Functional Composite Materials Using
Thermalnite

Realization of ceramic/resin composites
with unconventional thermal and mechanical properties
Composite materials added to ceramics

Composite materials added to resin and rubber

High thermal conductivity ÿ³
ÿ³ÿ High mechanical strength

High thermal conductivity ÿ³
ÿ³ÿ Resin characteristics

AlN polycrystalline
material

Thermalnite

Improved properties by fiber reinforcement

High strength ceramics businessResin/Rubber

Thermalnite

Create highly efficient heat paths

High thermal conductivity resin materials businessThis document introduces ceramic products.
U-MAP Co., Ltd.

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Ceramic Substrates with High Heat Dissipation

Physical properties of substrates are the key to improving the heatdissipation performance of conventional ceramic substrates.
Target products of ceramic substrates•

Power modules (for electric vehicles, railroads, power supply equipment, industrial motor equipment, etc.)•LED/LD modules (headlights, LEDs for sterilization, optical transceivers for communication, etc.)

To improve the heat dissipation performance

Power module
schematic diagram.

Power semiconductors
MetalHEAT

Ceramic Substrates

MetalHeat sinkof ceramic substrates
Improve the Thermal Conductivityof the material itself
þ Make the substrate thinner
Reliability to withstand heat cycles³Improvement of mechanical strength
U-MAP Co., Ltd.

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Features of Thermalnite added Ceramics
Adding Thermalnite to aluminum nitride powder improves the strength.
AlN polycrystalline material

Thermalnite

It improves the Mechanical Properties of AlN,
which is a weak point of AlN,

Thermalnite added AlN Substrates

by realizing a columnar structure inside the substrate.

U-MAP Co., Ltd.

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Competitive Advantages ofThermalnite added AlN Substrates

Achieves BOTH high mechanical properties (fracture toughness) andhigh thermal conductivity not found in conventional products.

Characteristic Benchmarking of Ceramic Substrates
ThermalConductivity

Mechanicalstrength(Fracturetoughness)

Dielectricbreakdown
voltage

Silicon nitride (Si3N4)80

5ÿ7>15

Aluminum nitride (AlN)

g200

2ÿ3>15200

5ÿ720

Thermalnite added Aluminum
Nitride (AlN) Substrates

g(n=1)U-MAP Co., Ltd.

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Thermal cycling test results for DBC substrates
ð Sample size
Structure: Copper 0.3t/AlN 0.635t/Copper 0.3t

Commercial product AlN

Cracking occurs at 500 cycles.

ð Cold and heat cycle test conditions
Temperature range: -55~150°C

Thermalnite added AlN

No cracking at 1500 cycles

High reliability was confirmed for U-MAP products by cold and heat cycle tests.
U-MAP Co., Ltd.

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Ecosystem for commercialization
Building an integrated supply chain.

We partner with material manufacturers to provide the best materials for our users.
Production Partners
Sales

ceramics

Technology Licensing

DevicemakerSales

metalizeroyalty

PoC/Co-development

R&D

U-MAP Co., Ltd.

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If you are interested in our technology and would like to help us with our project,please contact us!

Contact Infou-contact@umap-corp.com
https://umap-corp.com/
https://www.linkedin.com/company/umap-corp

Web Site

LinkedIn