THTVS411_Rev.1.01_E

THTVS411
Transient Voltage Suppressor for I/O protection

General Description

Features

THine THTVS Transient Voltage Suppressor family
is designed to protect sensitive interconnect I/O fromovervoltage caused by ESD (Electrostaticdischarge),CDE (Cable Discharge Events) and EFT(Electrical fast transients).

•The THTVS411 single-channel TVS is low
capacitance ESD protection device which designed
to protect sensitive CML, PECL LVDS physicallayer for ASIC, FPGA, SOC, ASSP and Display
port ,HDMI ,PCIe and USB3.0 standard I/O.
The THTVS411 have a small capacitance of 0.45pF(Typ) and working voltage of 4V Vrwm.
This allows to be used on circuits operating around
up to 8GHz with signal integrity. They may be used
to meet the ESD immunity requirements of IEC
61000- 4-2.
The dynamic resistance is extremely low 0.12 Ohms
(Typ) providing optimum protection of sensitivecircuits.
The THTVS411 is designed to protect a single-endlines. For differential lines, two THTVS411s will beemployed.
The THTVS411 is in a small 2-pin 0.6 x 0.3 x
0.25mm package. Low capacitance, small package,and high level of ESD protection will makes aflexible solution for high speed applications.

•••••••

ESD protection IEC 61000-4-2(ESD)±25kV(air), ±20kV(contact)
Ultra-small package
Protect one line
Low capacitance: 0.45pF Typ
Low dynamic resistance: 0.12 Ohm typ
Operating voltage: Vrwm 4.0V
Two pin package (0.6 x 0.3 x 0.25mm)
Packaging: Tape and Reel

Applications
Applications for sensitive and high speed I/Oprotection as followed.
••••••••

FPGA/SoC/ASSP high Seed I/O.
CML/PECL/LVDS physical layer
HDMI/DVI/DisplayPortTM
PCI Express /eSATA
USB3.0/3.1
V-by-One® HS
Sensitive Sensor I/OConnector and cable I/F

Schematic and package Diagram

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Pin Configuration

Package pin configuration (Top view)

Pin Description
Pin No12TypeII

Description
Input or Ground*1
Input or Ground*1*1: Ground must be tied to the PCB ground plane. Low impedance connection required.

Absolute Maximum Rating
Parameter

SymbolValueUnit

Peak Pulse Power (tp = 1.2/50µs)

PPk30

W

ESD per IEC 61000-4-2 (Air)*1
ESD per IEC 61000-4-2 (Contact)*1VESD+/- 25+/- 20kV

Operating Junction Temperature

TJ-40 to +125°C

Storage Temperature

TSTG-55 to +150°C

Notes.
*1: Measured with a 20dB attenuator, 50 Ohm scope input impedance, 2GHz bandwidth. ESD gun return path connected
to ESD ground plane.

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Electrical Characteristics (Tj = 25 ℃)
ParameterSymbolCondition

Min

TypMaxUnit

Reverse Stand-Off Voltage

VRWM---

4.0

V

Reverse Breakdown Voltage

VBR

It = 1mA

5.5

7.5

8.5

V

Reverse Leakage Current

IR

VRWM = 4.0V--50nA

Holding Current

IH-50

120-mA

VC

tp = 1.2/50μs OpenCircuit,8/20µs Short
Circuit Combination
Waveform
VS = 16V,RS = 2Ω ,I SC = 8A-

58V

I=4A,tlp=0.2/100ns

-

4.5-

I=16A,tlp=0.2/100ns-6-

tlp=0.2/100ns-

VR = 0V, f = 1MHz,-

0.12
0.45

0.55

Clamping Voltage*2ESD Clamping Voltage*3VC

Dynamic Resistance *4RDYNJunction CapacitanceCjVpFNotes*2 Measured using a 1.2/50us voltage, 8/20us current combination waveform, RS = 8 Ohms. Clamping is defined as the peak voltage across thedevice after the device snaps back to a conducting state.
*3 Transmission Line Pulse Test (TLP) Settings tp = 100ns, tr = 0.2ns, TLP I and V averaging window: t1 = 70ns to t2 = 90ns.
*4 Dynamic resistance calculated from I TLP = 4A to I TLP = 16ACopyright(C)2022 THine Electronics,Inc.

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Typical Characteristics
ESD Clamping (8kV Contact per IEC 61000-4-2)

ESD Clamping (-8kV Contact per IEC 61000-4-2)

TLP Characteristic (Positive Pulse)

TLP Characteristic (Negative Pulse)

Clamping Characteristic

Capacitance vs. Reverse Voltage

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Typical Characteristics
Insertion Loss - S21

Capacitance vs. Temperature

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Package

DETOP VIEWA
SEATING
PLANE

aaa CA1C

SIDE VIEW
e/2

R0.025TYPbLe
BOTTOM VIEW

Unit: mmSymbol
A
A1b
DEe
Laaa

Items
Mounting HeightStandoffTerminal Width
Body Length
Body Width
Pitch
Coplanarity

Min.
0.235
0.000
0.200
0.580
0.280
0.140

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Nom.
Max.
0.250
0.265
0.010
0.050
0.220
0.240
0.600
0.620
0.300
0.320
0.355 BSC
0.160
0.180
0.08

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0.675
0.270

0.175(0.425)

Land Pattern

0.250(Note)
Please carefully consider your SMT conditions (Material of substrate, Solder Composition, Reflow Condition and so on),and adjusts the Land Pattern at your own risk.

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Notices and Requests
1. The product specifications described in this material are subject to change without prior notice.
2. The circuit diagrams described in this material are examples of the application which may not always apply tothe customer’s design. THine Electronics, Inc. (“THine”) is not responsible for possible errors and omissions inthis material. Please note even if errors or omissions should be found in this material, THine may not be able tocorrect them immediately.
3. This material contains THine’s copyright, know-how or other intellectual property rights. Copying, reverseengineer or disclosing to third parties the contents of this material without THine’s prior written permission isprohibited.
4. Note that even if infringement of any third party’s intellectual property rights should occur by using this product,
THine will be exempted from the responsibility unless it directly relates to the production process or functions ofthe product.
5. This product is not designed for applications that require extremely high-reliability/safety such as aerospacedevice, nuclear power control device, or medical device related to critical care, excluding when this product isspecified for automotive use by THine and used it for that purpose. THine accepts no liability whatsoever for any
damages, claims or losses arising out of the uses set forth above.
6. Despite our utmost efforts to improve the quality and reliability of the product, faults will occur with a certain
small probability, which is inevitable to a semi-conductor product. Therefore, you are encouraged to havesufficiently fail-safe design principles such as redundant or error preventive design applied to the use of theproduct so as not to have our product cause any social or public damage.
7. This product may be permanently damaged and suffer from performance degradation or loss of mechanicalfunctionality if subjected to electrostatic charge exceeding capacity of the ESD (Electrostatic Discharge)
protection circuitry. Safety earth ground must be provided to anything in contact with the product, including any
operator, floor, tester and soldering iron.
8. Please note that this product is not designed to be radiation-proof.
9. Testing and other quality control techniques are used to this product to the extent THine deems necessary tosupport warranty for performance of this product. Except where mandated by applicable law or deemednecessary by THine based on the user’s request, testing of all functions and performance of the product is notnecessarily performed.
10. Customers are asked, if required, to judge by themselves if this product falls under the category of strategic
goods under the Foreign Exchange and Foreign Trade Act in Japan and the Export Administration Regulations in
the United States of America on export or transit of this product. This product is prohibited for the purpose ofdeveloping military modernization, including the development of weapons of mass destruction (WMD), and thepurpose of violating human rights.
11. The product or peripheral parts may be damaged by a surge in voltage over the absolute maximum ratings ormalfunction, if pins of the product are shorted by such as foreign substance. The damages may cause a smoking
and ignition. Therefore, you are encouraged to implement safety measures by adding protection devices, such asfuses. THine accepts no liability whatsoever for any damage or loss caused to the user due to use under acondition exceeding the limiting values.

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12. All patents or pending patent applications, trademarks, copyrights, layout-design exploitation rights or otherintellectual property rights concerned with this product belong to THine or licensor(s) of THine. No license orright is granted to the user for any intellectual property right or other proprietary right now or in the future owned
by THine or THine’s licensor. The user must enter into a license agreement with THine or THine’s licensor to be
granted of such license or right.

THine Electronics, Inc.
https://www.thine.co.jp

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