Confidential

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U-MAP pitch deck
-Ultimatematerial

Thermalnite®

and（ Fibrous Aluminum Nitride Single-Crystal ）U-MAP Co., Ltd.

2024.1.24 verprocessing-Confidential

Overview

2Name

U-MAP Co., Ltd.

Location

Nagoya University Incubation Facility 207, Furo-machi, Chikusa-ku,
Nagoya, Aichi, JapanFoundedDecember 12, 2016 Founding

Board
Member

CEO Kenji Nishitani
COO Takahiro Maeda
CTO Toru Ujihara

Number ofemployees

25Awards
ILS Award 2018
「 Grand Prix 」

U-MAP Co., Ltd.

Deep Tech
DEEP TECHCNB Venture Awards
Grand Prix 2019
PIONEER 2021
2018
「 Grand Prix 」「 Grand Prix 」「 Corporate Awards 」

Real Tech Venture ofthe Year 2021
「Growth Award」

Confidential

The ”Heat Problem” in the Electronics Industry
Due to the heat generated from internal components of electronic devices,
the inside of the devices becomes excessively hot.
As the demand for higher performance and miniaturization increases,
the issue of heat generation in electronic devices is becoming more serious.
Smartphones・PCs
AI・IoT
Data Center

renewable energy
Power Devices

Eﬀects of Heat Generation in Devices:

Decrease in performance

5G・Next5G

Shortened device lifespan
Reduced safety
EVs and electric trains

Contribution to energy-saving in all electronic devices
with new materials
U-MAP Co., Ltd.

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Thermalnite
Fibrous Aluminum Nitride Single-Crystal

High thermalconductivity

Insulatingproperties

Fiber shapeWorld's only original U-MAP technology
U-MAP Co., Ltd.

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U-MAP's Business

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Creating novel ceramics and functional composites with Thermalnite.

Thermalnite Business

U-MAP's proprietary material "Thermalnite" developedProducts:
 Thermalnite (Standard/High Water Resistance Grades)

Achieving new materials with "high thermal conductivity + α" by adding Thermalnite.

Resin Component Business
Launching composite components with
Thermalnite in resin and rubber
Products:

 Low thermal resistance TIM Sheet

Efficient heat path formation

High-Strength Ceramics Business
Developing composite materials with
Thermalnite added to AlN
Products:

Enhanced properties throughfiber reinforcement
 High-strength aluminum nitride (AlN) substrates

U-MAP Co., Ltd.

Thermalnite Characteristics

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Beneﬁts of Thermalnite: "Minimal Additive Amount"
Enhances the heat dissipation of insulating resin by incorporating thermal conductive ﬁllers.
Traditionally, over 80% of the resin is ﬁlled with ﬁllers, making further thermal conductivity improvement
challenging.

amount of addition

Conventional
Filler• Not bendable• Not workable• Heavy

80%

Ceramics
FillerRealizes high thermalconductivity

Thermalnite

with just a 1/4 ﬁller

20%
Thermalnite

Conventional

U-MAP

Increased strength
FlexibleHighly workable
Lightweight
High adhesion
Low dielectric, etc.

Achieves high thermal conductivity while maintaining resin characteristics
U-MAP Co., Ltd.
with minimal additive amount.

6Thermalnite Characteristics

Confidential

Characteristics of composites added to resin
In-plane oriented (X-Y) structure

Randomly oriented structure

Filler oriented in X-Y axis direction.

By hybrid structure with spherical ﬁller,
creates isotropic heat conduction paths.

Small amount of Thermalnite only

(Thermal conductivity in Z-axis direction is inferior.)
High Thermal
Conductivity
ResinsCeramic filler
Additiveamount

Thermalconductivity[W/mK]

10%

4.1

20%

7.5

U-MAP

30%

8.1

40％

9DENKA※170~80%

3.3

HenkelAG※170~80%

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住友大阪セメント※170~80%

7U-MAP Co., Ltd.

Hybrid addition of spherical filler

Spherical
FillerEffect of TN* hybrid addition[*TN: Thermalnite]

Silicone resin increased

from 2.3 to 3.7 W/mKAl2O3

BNby adding a few percent of TN
Thermal conductivity increasedby 2.2 times when 3 wt% TN wasadded to epoxy resin.
Addition of 2 wt% TN to silicone
resin Thermal conductivity increased

from 10 to 14 W/mK7

Product Introduction 1 : Low Thermal Resistance TIM Sheet

Thermalnite-added TIM* sheet*TIM (Thermal interface material) Lowest thermal resistance in industry
history - 15% reduction

 Industry's thinnest 0.1 mm (insulating) 4 times the mechanical strengthof conventional products

 Advantages of replacing the new product with a new product

U-MAP Co., Ltd.

Current
TIM
Sheet"Enhanced Cooling Efficiency and Reliability"
・Increase in power output due to lowered temperatures
・Wide range of use up to high surface pressure due to strong
mechanical strength

Current
heat
dissipation
grease"Improved Reliability and Productivity"
・Eliminates pump-out issues with increased longevity.
・Enhances labor efficiency and resolves uneven application.

Confidential8Product Introduction 1 : Low Thermal Resistance TIM Sheet

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Device cooling effect of TIM sheet

9Reduced by 4℃

compared to commercial products*When used as TIM sheet for LEDs

807076.9°C
71.7°C

LEDHeat sink

67.7°C

60
Temperature (℃)

TIM sheet

504030Without sheet

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Commercially available (best in the industry

U-MAP

10005101520Time (min)Confirmation of temperature reduction effectby using U-MAP products (TIM sheets) in devices
U-MAP Co., Ltd.

Product Introduction 2: High-Strength Ceramic Substrates

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Thermalnite-added aluminum nitride substrate
By adding Thermalnite to aluminum nitride powder (polycrystalline body),
This improves mechanical properties andovercomes the weak points of conventional products.
AlN polycrystalline body

Thermalnite

Thermalnite-doped aluminum nitride white plate

Double the mechanical strength of conventional products,
the highest in the history of AlN.

 Prevents cracking and chipping of substrates when bolted together

 High output and downsizing due to improved cooling efficiency
with thinner plate
U-MAP Co., Ltd.

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プロダクト紹介 2 : 高強度セラミックス基板

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Features of Thermalnite-doped AlN Substrates
Ceramics that combine high strength and high thermal conductivity are in demand.
Thermalnite is added to aluminum nitride powder
to increase strength through fiber reinforcement.

Characteristics of U-MAP Ceramic Substrates
Thermalconductivity
Si3N4AlN

Thermalnite-added
AlN substrate

Fracture
toughness[W/mK][Mpa・m1/2]△○

80~90 W/mK

5~7 MPa・m1/2○

×170~200 W/mK

2〜3 MPa・m1/2〇〇≧200 W/mK

5~7 MPa・m1/2"Achieves both mechanical properties (fracture toughness) and thermal conductivity notfound in conventional products.
Improved mechanical properties enable thinner designs, enhancing heat dissipation."
U-MAP Co., Ltd.

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Thermalnite Production Roadmap

12Production Output (ton/year)

Thermalnite® production volume
22
20181614121086420

U-MAP Co., Ltd.

19.0

Introductionof large 10.0
furnaceStart of mass
production

4.0
0.2

0.3

0.9

2022

2023

2024

2025

2026

2027

2024: Start mass production
2025: Scale up and reduce costs by installing a large
furnace.

Confidential

13Thank you!
Contact us hereh t t p s : / / u m a p corp.com/en/contact/U-MAP Co., Ltd.