〉〉 Electronics & Automotive Systems

Recrystallization Texture and Shear Band Formation
in Bending of Metal Material
Hiroshi Kaneko*1, Tatsuya Morikawa*2, Masaki Tanaka*2, Hirofumi Inoue*3, Kenji Higashida*4

The effect of controlling the crystal orientation distribution (= texture) withrespect to the bending workability of the metal materials and its mechanism arereported. In this study, at first, the crystal orientation map in the material after bending was analyzed in detail, and it was elucidated that the shear bands concentrate in the planar region at a35-40° inclination from the surface. Bending cracks occur along this shear bands and are an
important control factor for the workability. Next, it was found that by controlling the texture of
the workpiece, the development of the shear band is suppressed and the bending workability isremarkably improved. For these mechanisms, the assumption of applying the principle of theminimum plastic work to the multiple slip deformation of the crystal is effective, and the angle ofthe shear deformation and the crystal orientation in which the shear deformation hardly occurs
could be explained consistently.
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ABSTRACTINTRODUCTION
1.1.INTRODUCTION
Shear bands are an area where the shear strain is concentrated through several crystal grains. In the area, thegrains deform cooperatively despite the different geometric arrangements of the slip system in each grain. The
majority of the macroscopic strain is borne by the shear
bands. To the mechanisms of such shear bands, muchinterest has been submitted. Many researchers have usedvarious approaches to study this mechanism, including
microstructural analyses1)-5), crystallographic geometricsoftening6)-8), continuum mechanics9),10), and the crystal
plasticity finite element method (CPFEM)11)-13). Many ofthese studies have done by employing heavily rolledmaterials. The formation process of the shear bands
depends on material properties such as the ease ofoccurrence of twinning deformation or the rolling texture4).
This paper is a reprint of the paper published in “Materials
Transaction”, vol. 58 No.2 (2017) by The Japan Institute of Metals
and materials.
*1
Laboratories for Fusion of Core Technologies, R&D Division*2
Department of Materials Science and Engineering, Kyushu
University*3
Department of Materials Science, Graduate School ofEngineering, Osaka Prefecture University*4
National Institute of Technology, Sasebo College

Shear bands are observed not only during cold-rolling
but also during bending. Since the surface is free during
bending, shear plastic flow is more likely to occur. During
the plastic bending process, cracks are often initiated in
the shear bands. It has been reported that bending workability is notably influenced by a recrystallization texture14)-16). There is a need for further investigation to elucidate the mechanism behind the dependence of shear
bands on crystallographic orientation. A crystallographic
orientation markedly influences several fundamental
deformation behavior, including (i) the interaction of dislocations and the manner of dislocation accumulation17),18),(ii) the easiness of cross slip19) ,and (iii) the sum of crystal
shear due to slip deformation, i.e., the Taylor factor 20)-22).
Usually, these effects are interlaced.
In this study, to focus on the (iii), we employed polycrystalline samples of high-concentration Cu–Ni–Si alloys
with various recrystallization textures. The Cu–Ni–Si system is an alloy with high hardness due to δ-Ni2Si precipitation23)-26). To observe in detail the inhomogeneous deformation associated with the change of surface shape, the
FE-SEM/EBSD method was used. By these methods, theformation mechanism and the texture dependence of theshear bands during bending were examined.

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Recrystallization Texture and Shear Band Formation in Bending of Metal Material（a）

EXPERIMENTAL PROCEDURE
2.2. EXPERIMENTAL
PROCEDURE

3:ND

2.1

Chemical composition of samples (mass%).
Ni

Si

Zn

Sn

Cr

Mg

Cu

2.3Ni alloy [UNS 64775] 2.30 0.65 0.50 0.15 0.15 0.10 Bal.
3.8Ni alloy [UNS 64790]
3.76 0.89 0.51 0.15 0.20 0.09 Bal.
No.1-4

Because of recrystallization during the solution treatment, the influence of dislocations prior to bending wasable to be ignored. The mean grain size measured with
the intercept method including twin boundaries were 3.7
μm, 4.0 μm, 3.8 μm, 3.5 μm, and 4.6 μm for Nos. 1–4 andthe 2.3% Ni alloy, respectively. These values were similar
to one another, and thus, their influence could be
ignored27). Because the solution treatment and aging conditions were identical for Nos. 1–4, the precipitation
states were also identical. In this way, these Nos. 1-4
allowed for evaluation of only the influence of the recrystallization texture.
The tensile test was performed at room temperatureusing the specimen of JIS-13B, in which the rolling direction was parallel to the tensile direction and the strain rate
was 3.3 × 10–3s–1.
2.2 Shear Band Analysis by FE-SEM/EBSD Method
Bending test, in which the sample was bent into a
W-shape, was performed using a press metal die asshown in Figure 1 (a). To change the surface strain due tobending, the bending radius R was changed from 0 mm
to 0.4 mm. (These bending conditions are indicated as 0R
and 0.4R, respectively, in this paper.) The smaller the bending radius, the larger the strain induced on the surface.
The sample coordinate systems are shown in Figure 1 (b):1 is the longitudinal direction (LD) of bending, 2 is thetransversal direction (TD) of bending, and 3 is the normal
direction (ND) of the sample surface. The rolling directionin the sample preparation corresponds to the LD. The
width and the thickness of the sample were 10 mm and
0.2 mm, respectively. Because the sample width is sufficiently greater than the thickness, contraction in the TD
was negligible near the center along the width28).

2:TD

1:LD

R

90°

90°

R

Table 190°
R

Sample Preparation and Evaluation on the
Bending Workability
After melting and homogenizing the Cu-Ni-Si systemalloys, the alloys were hot rolled and milled to remove
surface scale. The chemical compositions are shown in
Table 1. Then, the 0.2-mm-thick strips were obtained bycold rolling and annealing. Test samples were then prepared by solution treatment and aging. Four kinds ofsamples with different textures in a 3.8%Ni alloy wereprepared by the arrangement of conditions in the above
process. Based on the {111}, {100} and {110} pole figures
measured on the sample surface16) by the Schulz reflection method using the CuKα radiation, we analyzed theorientation distribution function (ODF) at the 22nd rank.

（b）Figure 1 (a) Press metal die used in the 90° W-type bending
test and (b) sample coordinate system in the bending
sample.

The deformation microstructures and crystallographic
orientations in the bent samples were observed using thefield emission scanning electron microscopy/electron
back-scattering diffraction (FE-SEM/EBSD) method. Thisobservation was performed on the TD cross section at
the apex of bending. The cross section was obtained byargon ion irradiation to minimize the influence of theaffected layer. The scan step was set to 0.1 μm, and themeasurement points with confidential index (CI) values ofless than 0.05 were not reliable and were excluded29).
These points were shown in black on the crystal direction
and image quality (IQ) maps. Using the crystal grainboundaries as a marker in the EBSD map, we examined
the localized shear deformation. Specifically, we used thegrain boundaries that were perpendicular to the shear
direction. In addition, based on the distribution of the IQ,
we qualitatively identified the strain distribution. The IQ isa measure of the clarity of the Kikuchi pattern, and themore the lattice becomes strained, the more it decreases.
However, because the IQ depends on the crystallographic orientation and minor unevenness of the surface, weused this parameter along with the crystal direction map.
The plane strain compression and the two types ofshear strains were defined as shown in Figure 2, where
positive and negative shear were defined based on themethod used by Dillamore, et al.6). The angle between the
LD and the shear direction was defined as β.

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Recrystallization Texture and Shear Band Formation in Bending of Metal Material（a）plane strain compression

Contour Levels: 3 6 9 12 15 18 21 24 27 30 33 36 39 42 45
10
45
5
10
9 9

10

（b）
positive shear strain

9

β
10

（c）
negative shear strain

9

10

β
3:ND
2:TD

（a）
7

3

1:LD
16

Figure 2 Definition of strain mode in the schematic viewed
from the TD: (a) plane strain compression, (b) positive
shear strain, and (c)negative shear strain.

（b）

4

16

4

16

3
4

RESULTS
3.3.RESULTS
3.1. Orientation distribution functions (ODFs)
Figure 3 shows the ODF analysis. The Euler angles of typical texture components are displayed at the bottom rightof the figures. Figure 3(a) shows the strong developmentof the Cube orientation {001}<100> and the R orientation{231}<346> in No. 1. Figure 3(c) shows the developmentof the BR orientation {362}<853> and the RDW(RD-rotated Cube) orientation {012}<100> in No. 3. Figure3(b) shows that No. 2 has the same texture component as
those in No. 1 and No. 3. Figures 3(d) and (e) show thatthe maximum orientation density was 4, indicating a random texture in No. 4 and the 2.3% Ni alloy. These fourkinds of texture components are commonly observed incopper alloys30)-32).

（c）
2

4

（d）

ϕ2 =0°

10°

15°

30°

35°

50°

55°

65°

70°

75°

85°

90°

5°
25°

4

20°
45°

2

40°
4

60°

（e）
Cube
（001）
［100］
WT
（122）
［221］

80°

Goss
（011）
［100］
BR（252）
［743］

ϕ1

Φ

RDW（012）［100］
R（132）［643］

Figure 3 Orientation distribution function (ODF) analysis:(a) No. 1, (b) No. 2, (c) No. 3, (d) No. 4, and (e) the 2.3%
Ni-alloy. Euler angles of the typical texture component
are displayed at the bottom right of the figures.

3.2. Mechanical tests
Figure 4 shows stress–strain curves. In this figure, a result
from ordinary tough pitch copper (TPC) is also displayedfor comparison. Although the slope of the elastic region
was different33), the plastic flow stresses for Nos. 1–4 withdifferent textures were nearly the same. Compared to thatof the 2.3% Ni alloy, the yield strength of Nos. 1-4 was
100 MPa higher, and the hardening rates of these samples were also higher. Compared to TPC, the yield stressand work hardening rate of the Cu-Ni-Si alloys were very
high by the effect of the fine precipitates. The breaking
strains were from 0.14-0.15 for all five samples. These
were mostly uniform elongation.

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Recrystallization Texture and Shear Band Formation in Bending of Metal Material

1100

Figures 5 (a)-(e) show the optical micrographs obtained
from the TD section after the 0R bend test of Nos. 1-4
and the 2.3% Ni alloy, respectively. A low magnification
micrograph is also displayed at the bottom right of the
figures, in which the observed region corresponds to theapex of bending. No. 1 showed a particularly favorable
bent outer surface that was slightly wrinkled. In contrast,a large crack was observed in No. 3 and No. 4. In No. 2
and the 2.3% Ni alloy, a small crack was observed. The
shapes of the cracks from the surface were linear as indicated by the white arrows in Figs. 5 (b)-(e). The cracks
from the surface were not generated along the grainboundaries. They developed in a direction inclined at35-40° to the upper surface.

1000
900

True Stress, σ / MPa

800
700

No.1

600

No.2
No.3

500

No.4
2.3Ni alloy

400

TPC

300
200
100

（a）

0
0.00

0.04

0.08
True Strain, ε

0.12

0.16

BR

Figure 4 Stress-strain curves from the uniaxial tensile test.
Tough-pitch copper (TPC) is shown for comparison.

Table 2 shows the results of observing the bent surface
from the ND with the optical microscope. Under 0R and
0.1R conditions, large cracks formed in No. 3 and No. 4,
whereas small cracks formed in No. 2 and no crack
formed in No. 1. Specifically, No. 1 was found to havebetter bending workability than the 2.3% Ni alloy with low
flow stress. A comprehensive determination based on thescale of the cracks indicated that the order of bending
workability was as follows: No. 1 > the 2.3% Ni alloy >No. 2 > No. 4 > No. 3. Specifically, a correlation wasobserved between the volume of the BR orientation anddecreasing bending workability. In this way, the bending
workability was notably different depending on the texture and had no correlation with the breaking strain in thetensile test.
Table 2

Bent surface observations. Conditions observed with
the FE-SEM/EBSD are underlined.
0R

0.1R

0.2R
good

0.3R

（d）

820Ra
（e）

50µm
ND
LD

Figure 5 Forms after the 0R bending test on the TD crosssection at the central part of the sample’s width:(a) No. 1, (b) No. 2, (c) No. 3, (d) No. 4, and (e) the 2.3%
Ni alloy. White arrows indicate the cracks.

0.4R

good

good

No.2

crack

crack

good

good

good

No.3

large
crack

large
crack

large
crack

crack

good

No.4

large
crack

→ EBSD

crack

crack

crack

2.3Ni
alloy

crack

good

good

good

good

（c）

good

No.1

→ EBSD（b）→ EBSD

good→ EBSD

good

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Recrystallization Texture and Shear Band Formation in Bending of Metal Material

3.3.

EBSD analysis in the randomly oriented sample(No. 4)
The results from No. 4, which had a random texture show
how multiple crystal grains deform cooperatively. Figures
6(a)-(c) show the crystal direction map in the LD and TD
and an IQ map obtained from No. 4 after the 0.4R bending test, respectively. The sets of arrows and numbers
underlined in Figure 6 (b) indicate the shear direction andthe shear displacement in micrometers estimated bysteps of the grain boundaries, respectively. These steps
were confirmed at 16 locations and were 0.3-0.9 μm in
length. Among them, a row of the shear displacements
was observed from the upper center (indicated by grain A
in Figure 6 (b)) to the bottom right (indicated by grain B).
Also, due to the local orientation change around the TD,
we were able to see the shear strain. In the shear deformation areas in grains A and B, the crystal direction along
the LD changed substantially compared to the surroundings: from purple to watery in grain A and form damask tofaint yellow in grain B (Figure 6 (a)). Whereas, the crystal
directions along the TD were nearly unchanged (Figure 6(b)). In this way, the shear bands through several grains
were confirmed even under the small strain. In addition,
the yellow arrows in Figure 6 (c) indicate the surface steps
formed by the shear bands, which were demonstrated bya relatively dark band-like contrast in the IQ map. The
shear bands were in a direction inclined at 36° to the LD.

ND

111

LD

Σ3 grain boundary

001

101

Figures 7 (a)-(c) show the crystal direction map in theLD, an IQ map, and an optical micrograph of the same
region after the 0.2R bending test, respectively. We wereable to see the negative shear band from the curvature of
the parallel twin boundary in the n-region and the positive
shear band from the steps of the grain boundary in thep-region as shown in Figure 7 (a). The width of theseshear bands was approximately 5 μm. In the n-region,
there were sets of grains with the same orientations on
both sides of the crack. This indicated that the mode-2
crack developed inside the shear band in the n-region.

ND

LD

111
Σ3 grain boundary

001

101

5µm

（a）

n

p

（b）

5µm

（a）
×
grain A（c）×grain B

（b）

0.3
0.3
0.6

0.3
0.3

0.6
0.3

0.9
0.3

0.3
0.4

0.6
0.5
0.8 0.4
0.8

0.4

37
＝
β

°

shear displacement / µm（c）Figure 7 FE-SEM/EBSD images of sample No. 4 after the 0.2R
bending test: (a) crystal direction map in the LD,(b) image quality map, and (c) optical microscope
image. White triangles indicate the end point of thecrack. The ‘n’ and ‘p’ in (a) indicate the negative andpositive shear bands, respectively.

Figure 6 FE-SEM/EBSD image of sample No. 4 after the 0.4R
bending test: (a) crystal direction map in the LD, (b)crystal direction map in the TD, and (c) image quality
map. The ‘x’ in (a) indicates grains A and B. The setof arrows and the underlined numbers in (b) indicate
the shear direction and the shear displacement,
respectively. The yellow arrows in (c) indicate thesurface steps formed by the shear bands.

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Recrystallization Texture and Shear Band Formation in Bending of Metal Material〉〉 Electronics & Automotive Systems

Figure 8 shows an enlarged image near the crack in
Figure 7, demonstrating the state of the sample before
the displacement due to shear banding generated thecrack. We cropped the image in the upper left of thecrack that is surrounded by a dotted yellow line andphysically moved it along the crack (along the yellow
arrow) so that the grains of the same orientation would
meet. Figure 8 shows the formation of an angular groove
with a depth of approximately 4 μm just before shear
banding generated the crack. This depression wasformed by both the negative and positive shear bands
and then, acted as a stress concentration point. Thus,
this groove triggered concentration of the shear and generation of the crack.

aged at the groove on the surface [vi], and then, the generation of a mode II crack was induced in the shear bandwith a large amount of shear displacement [v]. Thus, theshear bands and the surface shape change formed a
vicious circle towards the generation of a crack.

5µm

（a）

sh

e

ar

ra
st

in

,ε
po

ti
si

on

,x

［i］

［ii］

stress concentration［iii］

grain C×
grain D ××grain E［vi］
stress concentration

5µm

（b）
grain C×

grain D ×［v］

sharp shear bandand mode2 crack

Figure 9 Schematic diagram of the plastic flow and the surface
shape change during bending. [i]-[v] present the
progress of bending.

×
grain E

3.4.

Figure 8 Enlarged image near the crack in Figure7
demonstrating the state before the displacement due
to shear banding with generation of the crack. The
yellow arrow indicates the vector of parallel movingof the cropped area surrounded by yellow dashedline. The ‘x’ indicates grains C, D, and E.

In this way, the localized shear deformation and resulting surface shape changes occurred in conjunction. At
the locations where cracks were observed, the positive
and negative shear bands developed in two directions,which is a typical configuration11),15). The formation process of these shear bands and the crack are schematically illustrated in Figure 9. First, localized shear deformation
occurred [i], which induced the steps on the sample surface. The steps caused a stress concentration [ii] and theinitiation of new shear deformation [iii]. With the formationof the new shear band, the stress concentration encour-

EBSD analysis in the Cube-orientation developed sample (No. 1)
Figures 10 (a) and (b) show the crystal direction map in
the LD and the IQ map of No. 1 after the 0.4R bending
test, respectively. The sets of arrows and the numbers
underlined in Figure 10 (a) are labeled in the same way as
in Figure 6 (b). There were very few shears in this casecompared to No. 4. Figures. 11 (a)-(c) show the crystal
direction map in the LD and TD and the IQ map after the
0.2R bending test, respectively. The shear bands and surface unevenness were quite minor compared with No. 4.
Specifically, in the Cube grains, local shearing was notconfirmed. In addition, the shading in the IQ map wasdense, indicating uniform deformation. Even if the bending deformation progressed, the crystallographic orientation close to the Cube orientation was maintained,
although there was dispersion around the TD.

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Recrystallization Texture and Shear Band Formation in Bending of Metal Material

ND

LD

111
Σ3 grain boundary

（a）

001

5µm

101

0.9

(1)
0.3

0.3

(2)
shear displacement / µm

and

（b）

(3)

Figure 10 FE-SEM/EBSD images of sample No. 1 after the 0.4R
bending test: (a) crystal direction map in LD and(b) image quality map. The set of arrows and theunderlined numbers in (a) indicate the shear direction
and shear displacement, respectively.

where
is a scalar measure of the strain rate. The strain
velocity D in L is the combination of multiple {111}<110>slip deformations.
(4)

ND

LD

111
Σ3 grain boundary

001

101

5µm

（a）

（b）

is the slip rate, m is the slip plane normal vecwhere
tor, s is the slip direction vector, and i is the number of theslip system. Based on the full constraint (FC) model, fiveor more slip systems are active. Among the combinationsof the slips that satisfy the equation (4), we selected theone with the minimum sum of slip shear as the Taylor factor20).
(5)

（c）

Then, the flow stress σ is expressed in terms of the critical resolved shear stress of the slip systemτ.
(6)

Figure 11 FE-SEM/EBSD observation of sample No. 1 after the
0.2R bending test: (a) crystal direction map in theLD, (b) crystal direction map in the TD, and (c) image
quality map.

DISCUSSION
4.4.DISCUSSION
4.1

Consideration based on Taylor’s Theory
Assuming Both Strain Modes on the Plane
Strain Compression and the Shear Strain
It was experimentally revealed in this study that bending
workability was related to inhomogeneous microstructures such as shear bands, which were significantly influenced by the sample’s preferred crystallographic orientation distribution. To examine the formation conditions of
the shear bands, we will discuss the Taylor factor M as acriterion of the change in deformation modes. The velocity gradient tensor L is as follows:

Because it was thought that the influence of the crystallographic orientation onτshould be small enough to beignored in the Cu-Ni-Si alloys, we considered the influence of M on the flow stress and the plastic work.
First, we derived M pla from Lpla and M shear from L shear forsome grains in the randomly oriented sample (No. 4).
Figure 12 shows the M pla and M shear of grains A and B
shown in Figure 6 and grains C, D, and E shown in Figure 8
as a function of the shear angle β. The values of M pla are
indicated by dashed lines in the figures. We substituted
the crystallographic orientations at the point near the
shear bands indicated with an ‘x’ in Figure 6 (a) and
Figure 8 for the crystallographic orientations at the timethat the shear deformation had started. As shown in
Figure 12 (a), grains A and B had a very different M pla andM shear depending on the different crystallographic orientation. On the other hand, both grains had a common rangeof β where M shear was lower than M pla for β=30-40°. This
indicated that the shear deformation along 30-40° was
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Recrystallization Texture and Shear Band Formation in Bending of Metal Material〉〉 Electronics & Automotive Systems

relatively likely to occur. M shear for β=32-36° was particularly low. The result of this calculation corresponded wellwith the observation that the shear band penetrated bothgrains with β=36° (Figure 6). A similar tendency was
shown in Figure 12 (b), in which the shear deformation
was relatively likely to occur with a range of β=31-44° in
grain C and β=33-44° in grain D and E. A particularly low
common angle was 36°, which corresponded well with ashear band and crack penetrating these grains at 37°(Figure 7). Even if the texture was random, there was acommonly advantageous deformation mode in neighboring grains, which induced the generation of a shear band
penetrating these grains.

Future Issues for the Microstructure Change
During the Bending and for the Factors
Affecting the Flow Stress
In the above discussion, we assumed that the strain
velocity tensor D was only composed of the crystal slip
deformation. On the other hand, orientation gradientswere clearly observed in the deformed grains with EBSD
analysis. This suggested that a part of D was compensated for by the geometrically necessary dislocations(GNDs). The GNDs should increase the flow stressthrough curvature and twisting of the lattice34) while also
corresponding to a decrease in the sum of the slip shear
strains than that of full constraint condition35). At present,
however, the clear dependence of crystallographic orientation on the density of the GNDs has not been confirmed. More strictly, examination of this influence is necessary. In addition, in the shear band, it is possible tochange τin Equation (6) if a dynamic recovery or morphological change of precipitate were to occur. The influences of the deformation microstructure on slip resistanceshould be included in any future macroscopic deformation analyses.

FC Taylor factor, M pla, M shear

（a）

（b）

4
3.5
3

2.5

grain Agrain Bgrain Cgrain D
grain E2plane
25 35 45 55 plane
25 35 45 55
comprecompreβ/degreeβ/degree-ssion-ssion
shear
shear
L
L

Figure 12 Relationship between the FC (full constraint) Taylor
factor and strain mode: (a) grains A and B and (b) grain
pla
C, D, and E. Dashed lines indicate the values of M .

Second, assuming that the orientation distribution did
not change significantly as the bending progressed, M planeand M shear were calculated regarding typical recrystallization orientations. With regard to the orientation near the
shear
Cube and the RDW orientations, M pla≒M min ≒2.5. This
indicated that a shear was not favorable, which was thereason that No. 1 did not form shear bands easily and thereason for the good bending workability of No. 1 and No.
2. On the other hand, for the BR orientation, where a correlation with lowering bending workability was observed,shear
M pla=3.8 and M min =3.3. This indicated that the shear
mode was advantageous in this case. This was likely thereason for the largest cracks in No. 3. For the R orientashear
tion, M pla=3.5 and M min =3.4. These results were intermediate when selecting a deformation mode.
Last, we calculated the average Taylor factor M pla using
the ODF analysis coefficients16), which were 3.08, 3.22,
3.33, and 3.29 for Nos. 1–4, respectively. A small M pla
correlated with a good bending workability. Since M pla
was relatively low for the M shear, the shear band was further prevented. In this way, we were able to interpret theseries of experimental results with the FC Taylor theory
assuming L pla and L shear.

4.2

CONCLUSION
5.5.CONCLUSION
Inhomogeneous deformation in the bending for the highconcentration Cu–Ni–Si alloys with various recrystallization textures was examined.
1) In the sample with a random texture, shear banding
was observed even under a small strain. The shear
bands caused a change in the surface shape, at which
point, a crack was initiated. The crack propagated in
the shear bands.
2) In the sample with a strongly developed Cube orientation, the shear bands and the accompanying surface
roughness were notably suppressed. Compared to the
2.3% Ni alloy with a random orientation, the bending
workability was better and the strength was ≥20%
higher. As such, texture control was shown to be auseful technique that could achieve both a highstrength and excellent bending workability.
3) The dependence of crystallographic orientation on theformation of the shear band was discussed using thefull constraint Taylor model based on the premise ofboth the plane strain compression and shear strain
modes. Even if the texture was random, there was acommon favorable shear mode in neighboring grains,which induced a shear band. The Cube and the RDW
orientations were advantageous for suppression of theshear, whereas the BR orientation was not.

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Recrystallization Texture and Shear Band Formation in Bending of Metal Material〉〉 Electronics & Automotive Systems

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