Report Title:

ADSP-BF701/701W, ADSPBF703/703W, ADSP-BF705/705W,ADSP-BF707/707W CSP_BGA withCu Wire at SK3 Automotive
Qualification

Report Number:17054

Revision:B

Date:

26 October 2020

Reliability Report: 17054

SummaryThis report documents the successful completion of the reliability qualification requirements
for the Automotive Grade 2 release of the ADSP-BF701, ADSP-BF703, ADSP-BF705, andADSP-BF707, ADSP-BF701W-11, ADSP-BF703W-11, ADSP-BF705W-11, ADSPBF707W-11 product in a 184-CSP_BGA package with Cu wire. The ADSP-BF70x is a Low
Power 400MHz Blackfin+ Embedded Processor with 1MByte L2 SRAM.
Rev A of the report was issued when requirements for the consumer release were met. Thisis an updated final report with the AEC Q006 requirements documented.

Table 1: ADSP-BF70x Product Characteristics
Die/FabDie Id

TMGP72 B

Die Size (mm)4.22 x 4.09

Wafer Fabrication Site

E_TSMC1412

Wafer Fabrication Process

40nm CMOS

Approximate Transistor Count

106,000,000

Passivation Layer

undoped-oxide/SiN

Bond Pad Metal Composition

AlCu

Polyimide

Yes

Package/AssemblyPackage

184-CSP_BGA

Body Size (mm)12.00 x 12.00

Solder Ball Diameter (mm)0.45

Assembly Location

SK3

Molding Compound

Kyocera KE G1280TS

Die AttachAblestik 2025D

Wire Type

PdCuAu 4N

Wire Dimension (mil)

0.8

Moisture Sensitivity Level

3Maximum Peak Reflow Temperature (°C)

260

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Reliability Report: 17054

Description / Results of Tests Performed
Table 2 provides a description of the qualification tests conducted and the associated test
results for products manufactured on the same technologies as described in Table 1. All
devices were electrically tested before and after each stress. Any device that did not meet allelectrical data sheet limits following stressing would be considered a valid (stressattributable) failure unless there was conclusive evidence to indicate otherwise.

Table 2: ADSP-BF70x Qualification Test Results
Test Name

Specification

Conditions

DeviceHigh Temperature
Storage Life(HTSL) 1

JESD22-A103

150°C, 1,000
Hours

ADSPBF705W

Temperature Cycling(TC) 1,3

JESD22-A104-55°C/+150°C,2,000 Cycles

ADSPBF705W

Temperature Humidity
Bias (THB) 1,3

JESD22-A101

Unbiased Highly
Accelerate Stress Test
(UHAST) 1,3

JESD22-A118

85°C, 85%RH,Biased, 2,000
Hours
130°C,85%RH, 2atm
Biased, 96
Hours

ADSPBF705W

ADSPBF705W

Early Life Failure Rate
(ELFR) 1

AEC-Q100008

Ta=125°C, 48
Hours

ADSPBF707

High Temperature
Operating Life(HTOL) 2,3

JESD22-A108

125°C<Tj<135°C, Biased,
P1000

ADSPBF707

Lot #Q17054.1.3
Q17054.2.1
Q17054.3.1
Q17054.1.6
Q17054.2.4
Q17054.3.4
Q17054.1.4
Q17054.2.2
Q17054.3.2
Q17054.1.5
Q17054.2.3
Q17054.3.3
QL11074ELF01
QL11074ELF02
QL11074ELF03
QL11074ELF04
QL11074ELF05
QL11074ELF06
QL11074ELF07
QL11074ELF08
QL11074ELF09
QL11074ELF10
QL11074ELF11
QL11074ELF12
QL11074ELF13
QL11074ELF14
QL11074ELF15
QL11074ELF16
QL11074ELF17
QL11074HTL03
QL11074HTL01
QL11074HTL02

SampleSize454545694
7575
75757577
77

Qty.
Failures00000000000770180180180180901808918089180891808918089180897777
7700000000000000000000Page 3 of 5Reliability Report: 17054
1 Pre- and post-stress electrical test was performed at room and hot temperatures.
2 Pre- and post-stress electrical test was performed at hot, room and cold temperatures.

3 These samples were subjected to preconditioning (per J-STD-020 Level 3) prior to the start of the stress test. Level 3

preconditioning consists of the following: Bake: 24 hrs @ 125°C, Unbiased Soak: 192 hrs @ 30°C, 60%RH, Reflow:
3 passes through an oven with a peak temperature of 260°C.
4Per AEC Q006, 77 units completed 1000 cycles with no rejects. 75 units from each lot then continued through 2000
cycles TCT. At the 2000 cycle readpoint, 6 units from the lot were damaged in the handler at electrical test caused
by a misalignment in the device carrier. See FA218035/8d20208015 for details.

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Reliability Report: 17054

ESD Test Results
The results of Human Body Model (HBM) and Field-Induced Charged Device Model(FICDM) ESD testing are summarized in Table 3. ADI measures ESD results using stringent
test procedures based on the specifications listed. Any comparison with another supplier's
results should ensure that the same ESD test procedures have been used. For further details,
please see the EOS/ESD chapter of the ADI Reliability Handbook (available via the 'Qualityand Reliability' link on Analog Devices' web site).

Table 3: ADSP-BF70x ESD Test Results
ESD Model

Package

ESD Test SpecRC Network

HighestPass Level

First FailLevel

Class±500V±750V

NA±750V

NA

NA±2000V±2500V

2184-CSP_BGAAll Pins
FICDM

JS-002

1Ω, Cpkg

184-CSP_BGA
Corner Pins Only
ESDA/JEDEC
HBM

184-CSP_BGA

1.5kΩ, 100pF

JS-001-2011

Latch-Up Test Results
Three samples of the ADSP-BF70x were latch-up tested at TA=125°C per JEDEC Standard
JESD78, Class II. Pre- and post-stress electrical test was performed at room and hottemperatures. All pins passed.
Passing Positive Current

Passing Negative Current

Passing Over-Voltage+200mA-200mA+1.8V/+2.85V/+5.205V

Approvals
Reliability Engineer: Carolyn Pipitone

Additional Information
Data sheets and other additional information are available on Analog Devices' web site

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