THC63LVDR84B_Rev.2.30_E

THC63LVDR84B
24bit COLOR LVDS RECEIVER (Rising Edge Clock)

General DescriptionFeatures

The THC63LVDR84B receiver supports wide VCC range as 2.5
to 3.6V. At single 2.5V supply, the THC63LVDR84B reduces
EMI and power consumption.
The THC63LVDR84B converts the four LVDS data streams
back into 24bits of CMOS/TTL data with Rising edge clock.
At a transmit clock frequency of 85MHz, 24bits of RGB data
and 4bits of timing and control data (HSYNC, VSYNC, DE,CNTL1, CNTL2) are transmitted at an effective rate of 2.38Gbps.

･1:7 LVDS to CMOS/TTL De-Serializer･Operating Temperature Range : -10 to +70C･Spread Spectrum Clocking Tolerant up to 100kHz Frequency
Modulation and +/-2.5% Deviations.
･Input Clock Range: 15 to 85MHz･56pin TSSOP Package･Power Down Mode.

･Rising Edge Clock･EU RoHS Compliant.

Application･Medium and Small Size Panel･Tablet PC / Notebook PC･Security Camera / Industrial Camera･Multi Function Printer･Industrial Equipment･Medical Equipment Monitor

Block Diagram. Copyright©2023 THine Electronics, Inc.

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Pin Diagram

Pin Description
Pin Name
RA+, RARB+, RBRC+, RCRD+, RDRCLK+,RCLKRA0 ~ RA6
RB0 ~ RB6
RC0 ~ RC6
RD0 ~ RD6
CLKOUT

Pin #10, 912, 1116, 15
20, 1918, 17

Direction

TypeInput

LVDS

27, 29, 30, 32, 33, 35, 37
38, 39, 43, 45, 46, 47, 51
53, 54, 55, 1, 3, 5, 6
7, 34, 41, 42, 49, 50, 2
26

Output

/PDWN

25

Input

VCC

31, 40, 48, 56

GND

4, 28, 36, 44, 52

LVDSVCC

13

LVDSGND

8, 14, 21

PLLVCCPLLGND2322, 24Description
4ch Serial Data Inputs

Clock Inputs

28bits Parallel Data Outputs
CMOS/TTLPower-. Copyright©2023 THine Electronics, Inc.

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Clock Output
H : Normal Operation
L : Power Down (all outputs are pulled toground)
Digital circuit and CMOS/TTL I/O Power
SupplyDigital circuit and CMOS/TTL I/OGround
LVDS circuit and input buffer Power
Supply
LVDS circuit and input buffer Ground
PLL circuit Power Supply
PLL circuit Ground

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THC63LVDR84B_Rev.2.30_E

Absolute Maximum Ratings
Parameter
Supply Voltage (VCC)
CMOS/TTL Input VoltageCMOS/TTL Output Voltage
LVDS Input PinJunction Temperature
Storage Temperature
Reflow Peak Temperature
Reflow Peak Temperature Time
Maximum Power Dissipation @+25CMin-0.3-0.3-0.3-0.3-55-Max+4.0
VCC + 0.3
VCC + 0.3
VCC + 0.3
+125+150+260
10
1.9

Unit
VVVV
C
C
Csec
W

Recommended Operating Conditions
VCC=LVDSVCC=PLLVCC
SymbolTa-Parameter
All Supply Voltage
Operating Ambient Temperature
VCC = 2.5V to 2.7V
Clock Frequency
VCC = 2.7V to 3.0V
VCC = 3.0V to 3.6VMin
2.5-10201515Typ+25-Max
3.6+70707085UnitVCMHzMHzMHz“Absolute Maximum Ratings” are those values beyond which the safety of the device can not be guaranteed. They
are not meant to imply that the device should be operated at these limits. The tables of “Electrical Characteristics”
specify conditions for device operation.
“Absolute Maximum Rating” value also includes behavior of overshooting and undershooting.

Equivalent LVDS Input Schematic Diagram

LVDS_InPAMP
LVDS_InNLVDS Input Schematic Diagram. Copyright©2023 THine Electronics, Inc.

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Power Consumption
VCC=LVDSVCC=PLLVCC
SymbolParameter

IRCCG

LVDS Receiver
Operating Current
16 Gray Scale Pattern

IRCCW

IRCCS

LVDS Receiver
Operating Current
Worst Case Pattern
LVDS ReceiverPower Down Current

Conditions

Typ*Max

Unit

RL=100, CLoad=8pF, f=65MHz, VCC=3.3V

4153mA

RL=100, CLoad =8pF, f=85MHz, VCC=3.3V

5264mA

RL=100, CLoad =8pF, f=65MHz, VCC=2.5V

3042mA

RL=100, CLoad =8pF, f=65MHz, VCC=3.3V7294mA

RL=100, CLoad =8pF, f=85MHz, VCC=3.3V

8496mA

RL=100, CLoad =8pF, f=65MHz, VCC=2.5V

4264

mA

/PDWN=L-10µA*Typ values are at the conditions of Ta = +25ºC

CLKIN

fTA0, TB1, TC2

f/16

TA1, TB2, TC3

f/8

TA2, TB3, TC4

f/4

TA3, TB4, TC5

f/2

TA4-6, TB0,5,6
TC0,1,6, TD0-2

Steady State Low

TD3-6

Steady State High

16 Grayscale Pattern

CLKIN

Tx0-6

x=A,B,C,D
Worst Case Pattern. Copyright©2023 THine Electronics, Inc.

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Electrical Characteristics
CMOS/TTL DC Specifications
VCC=LVDSVCC=PLLVCC
Symbol
VIH
VIL
VOH1
VOL1
VOH2
VOL2
IIN

Parameter
High Level Input Voltage
Low Level Input Voltage
High Level Output Voltage
Low Level Output Voltage
High Level Output Voltage
Low Level Output Voltage
Input Current

Conditions
VCC = 3.0V to 3.6V
IOH = -4mA
VCC = 3.0V to 3.6V
IOL = 4mA
VCC = 2.5V to 3.0V
IOH = -2mA
VCC = 2.5V to 3.0V
IOL = 2mA
GND  VIN  VCC

Min2.0GND

Typ*-Max
VCC
0.8

Unit
VV

2.4--V--

0.4

V

2.1--V--

0.4V--10

A

LVDS DC Specifications
VCC=LVDSVCC=PLLVCC
SymbolVTH
VTLIIN

Parameter
Differential Input High Threshold
Differential Input Low Threshold
Input Current

Conditions
RL=100Ω,
VIC=+1.2V
VIN = +2.4 / 0V
VCC = 3.6V

Min-100

Typ*-Max
100-

Unit
mVmV--

10

A

Conditions
VCC = 2.5V to 2.7V
VCC = 2.7V to 3.0V
VCC = 3.0V to 3.6V

Min
14.3
14.311.8-TypTTT
4T/7
3T/7
5T/7

Max
50.0
66.6
66.6
-Unit

0.35T - 0.3--ns

0.45T – 1.6--ns

CLoad=8pF, 20-80%

-

2.0

3.0ns

CLoad=8pF, 80-20%

-1.8

3.0

ns-0.4
T/7-0.4
2T/7-0.4
3T/7-0.4
4T/7-0.4
5T/7-0.4
6T/7-0.4
-0.0
T/7
2T/7
3T/7
4T/7
5T/7
6T/7
-+0.4
T/7+0.4
2T/7+0.4
3T/7+0.4
4T/7+0.4
5T/7+0.4
6T/7+0.4
10.0

nsnsnsnsnsnsnsmsCMOS/TTL & LVDS AC Specifications
VCC=LVDSVCC=PLLVCC
SymboltRCP
tRCHtRCLtRCDtRStRHtTLHtTHLtRIP1tRIP0tRIP6tRIP5tRIP4tRIP3tRIP2tRPLL

Parameter
CLKOUTTransition Time
CLKOUT High Time
CLKOUT Low TimeRCLK IN to CLKOUT +/- Delay
CMOS/TTL Data Setup to
CLKOUT
CMOS/TTL Data Hold from
CLKOUT
CMOS/TTL Low to High Transition
TimeCMOS/TTL High to Low Transition
TimeLVDS Input Data Position0
LVDS Input Data Position1
LVDS Input Data Position2
LVDS Input Data Position3
LVDS Input Data Position4
LVDS Input Data Position5
LVDS Input Data Position6
Phase Lock Loop Set

T=11.76ns
T=11.76ns
T=11.76ns
T=11.76ns
T=11.76ns
T=11.76ns
T=11.76ns
T=11.76ns

nsns
ns
ns

*Typ values are at the conditions of VCC/LVDSVCC/PLLVCC=3.3V and Ta = +25ºC. Copyright©2023 THine Electronics, Inc.

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AC Timing Diagram/-x=A,B,C,D

Data and Clock Input to Output AC Timing Diagram/PDWN

Power on Sequence. Copyright©2023 THine Electronics, Inc.

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LVDS Data Mapping

LVDS Data Mapping

Pixel Data Mapping for JEIDA Format (6bit, 8bit Application)
TX PinTA0
TA1
TA2TA3
TA4
TA5
TA6TB0
TB1
TB2
TB3
TB4
TB5
TB6
TC0
TC1
TC2TC3TC4TC5TC6
TD0
TD1
TD2
TD3TD4TD5
TD66bit
R2
R3
R4
R5
R6
R7
G2
G3G4G5G6G7B2B3B4B5B6B7Hsync
Vsync
DE-8bit
R2
R3
R4R5
R6R7G2G3G4G5G6G7B2B3B4B5B6B7Hsync
VsyncDER0
R1G0G1
B0
B1
N/A. Copyright©2023 THine Electronics, Inc.

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RX PinRA0
RA1
RA2
RA3RA4RA5RA6RB0RB1RB2RB3RB4RB5RB6RC0RC1
RC2
RC3
RC4
RC5RC6RD0
RD1RD2
RD3
RD4
RD5
RD6

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THC63LVDR84B_Rev.2.30_E

Pixel Data Mapping for VESA Format (6bit, 8bit Application)
TX Pin
TA0
TA1
TA2
TA3
TA4
TA5
TA6
TB0
TB1
TB2
TB3
TB4
TB5
TB6
TC0
TC1
TC2
TC3
TC4
TC5
TC6
TD0
TD1TD2
TD3
TD4TD5
TD66bit
R0
R1
R2
R3R4R5G0G1G2G3G4G5B0B1B2B3B4B5Hsync
Vsync
DE-8bit
R0R1R2R3R4R5G0G1G2G3G4G5B0B1B2B3B4B5Hsync
Vsync
DER6R7G6G7
B6
B7
N/A

. Copyright©2023 THine Electronics, Inc.

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RX Pin
RA0
RA1
RA2
RA3
RA4
RA5
RA6
RB0
RB1
RB2
RB3
RB4
RB5
RB6
RC0
RC1
RC2
RC3
RC4
RC5
RC6RD0RD1
RD2
RD3RD4RD5RD6

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THC63LVDR84B_Rev.2.30_E

Typical Connection Diagram

Typical Connection Diagram with JEIDA Format. Copyright©2023 THine Electronics, Inc.

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Package. Copyright©2023 THine Electronics, Inc.

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THC63LVDR84B_Rev.2.30_E

Reference Land Pattern
CY1=10.34

HE=

e=8.100

0.500

E=
6.10
Package
Land PatternTtyp.=
0.60
Gmin=
5.50

1.90

b=0.200

Zmax=

Xmax=0.470

9.30

Zmax/2
Unit mm

The recommendation mounting method of THine device is reflow soldering.
The reference pattern is using the calculation result on condition of reflow soldering.
Notes
This land pattern design is a calculated value based on JEITA ET-7501.
Please take into consideration in an actual substrate design about enough the ease of mounting, the intensity ofconnection, the density of mounting, and the solder paste used, etc… The optimal land pattern size changes
with these parameters. Please use the value shown by the land pattern as reference data.

. Copyright©2023 THine Electronics, Inc.

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Notes1) Cable Connection and Disconnection
Do not connect and disconnect the LVDS cable, when the power is supplied to the system.

2) GND Connection
Connect each GND of the PCB which LVDS Tx device and THC63LVDR84B on it.
reduction to place GND cable as close to LVDS cable as possible.

It is better for EMI

3) Multi Drop Connection
Multi drop connection is not recommended.

4) Asynchronous use
Asynchronous using such as following systems is not recommended.

. Copyright©2023 THine Electronics, Inc.

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Notices and Requests
1.

The product specifications described in this material are subject to change without prior notice.

2.

The circuit diagrams described in this material are examples of the application which may not always apply to the customer’s
design. THine Electronics, Inc. (“THine”) is not responsible for possible errors and omissions in this material. Please noteeven if errors or omissions should be found in this material, THine may not be able to correct them immediately.

3.

This material contains THine’s copyright, know-how or other intellectual property rights. Copying, reverse-engineer ordisclosing to third parties the contents of this material without THine’s prior written permission is prohibited.

4.

THINE ACCEPTS NO LIABILITY FOR ANY DAMAGE OR LOSS IN CONNECTION WITH ANY DISPUTERELATING TO INTELLECTUAL PROPERTY RIGHTS BETWEEN THE USER AND ANY THIRD PARTY, ARISINGOUT OF THIS PRODUCT, EXCEPT FOR SUCH DAMAGE OR LOSS IN CONNECTION WITH DISPUTESSUCCESSFULLY PROVED BY THE USER THAT SUCH DISPUTES ARE DUE SOLELY TO THINE. NOTE,HOWEVER, EVEN IN THE AFOREMENTIONED CASE, THINE ACCEPTS NO LIABILITY FOR SUCH DAMAGE ORLOSS IF THE DISPUTE IS CAUSED BY THE USER’S INSTRUCTION.

5.

This product is not designed for applications that require extremely high-reliability/safety such as aerospace device, nuclear
power control device, or medical device related to critical care, excluding when this product is specified for automotive use by
THine and used it for that purpose. THine accepts no liability whatsoever for any damages, claims or losses arising out of theuses set forth above.

6.

Despite our utmost efforts to improve the quality and reliability of the product, faults will occur with a certain small
probability, which is inevitable to a semi-conductor product. Therefore, you are encouraged to have sufficiently fail-safe
design principles such as redundant or error preventive design applied to the use of the product so as not to have our productcause any social or public damage.

7.

This product may be permanently damaged and suffer from performance degradation or loss of mechanical functionality if
subjected to electrostatic charge exceeding capacity of the ESD (Electrostatic Discharge) protection circuitry. Safety earth
ground must be provided to anything in contact with the product, including any operator, floor, tester and soldering iron.

8.

Please note that this product is not designed to be radiation-proof.

9.

Testing and other quality control techniques are used to this product to the extent THine deems necessary to support warranty
for performance of this product. Except where mandated by applicable law or deemed necessary by THine based on the user’s
request, testing of all functions and performance of the product is not necessarily performed.

10. This product must be stored according to storage method which is specified in this specifications. THine accepts no liability
whatsoever for any damage or loss caused to the user due to any storage not according to above-mentioned method.
11. Customers are asked, if required, to judge by themselves if this product falls under the category of strategic goods under theForeign Exchange and Foreign Trade Act in Japan and the Export Administration Regulations in the United States of America
on export or transit of this product. This product is prohibited for the purpose of developing military modernization, including
the development of weapons of mass destruction (WMD), and the purpose of violating human rights.
12. The product or peripheral parts may be damaged by a surge in voltage over the absolute maximum ratings or malfunction, if
pins of the product are shorted by such as foreign substance. The damages may cause a smoking and ignition. Therefore, youare encouraged to implement safety measures by adding protection devices, such as fuses. THine accepts no liability
whatsoever for any damage or loss caused to the user due to use under a condition exceeding the limiting values.
13. All patents or pending patent applications, trademarks, copyrights, layout-design exploitation rights or other intellectual
property rights concerned with this product belong to THine or licensor(s) of THine. No license or right is granted to the user
for any intellectual property right or other proprietary right now or in the future owned by THine or THine’s licensor. The user
must enter into a license agreement with THine or THine’s licensor to be granted of such license or right.

THine Electronics, Inc.
https://www.thine.co.jp. Copyright©2023 THine Electronics, Inc.

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