MULTILAYER CERAMIC CAPACITORSPRECAUTIONS AND GUIDELINES

The circuits described as examples in this catalog and the "delivery specifications" are featured in order to show the operations
and usage of our products, however, this fact does not guarantee that the circuits are available to function in your equipment
systems.
We are not in any case responsible for any failures or damage caused by the use of information contained herein.
You should examine our products, of which the characteristics are described in the "delivery specifications" and other documents, and determine whether or not our products suit your requirements according to the specifications of your equipment
systems. Therefore, you bear final responsibility regarding the use of our products.
Please make sure that you take appropriate safety measures such as use of redundant design and malfunction prevention
measures in order to prevent fatal accidents and/or fires in the event any of our products malfunction.

1 In designing device circuits(1) Conﬁrming the installation and operating environment of capacitors, use them within the rated performance limits prescribedin their catalog or product speciﬁcations. Otherwise, excessive use conditions cause the capacitors to have catastrophic
failure such as short circuit, open circuit or ﬁring.
(2) Do not apply a DC voltage which exceeds the full rated voltage. The peak voltage of a superimposed AC voltage (ripplevoltage) on the DC voltage must not exceed the full rated voltage.
(3) By considering the temperature characteristic and the DC bias characteristic of the ceramic capacitors, please determine
the right capacitance. The capacitance of the capacitors changes in low and high temperature ambiences and depends
on the applied bias voltages. The capacitance change (i.e. reduction) may affect the performance of the circuit which iscontaining the capacitors. Therefore, please examine the capacitors in the actual operational conditions to verify that theyare right ones.
(4) The common failure mode of multilayer ceramic capacitors is contingent insulation breakdown or short circuit. When thecapacitors are used in a high-power circuit, they may damage the surroundings of the capacitors when failed. Therefore, thehigh-power circuit should have protective device/protective devices to shut down the circuit from the capacitor/capacitors.
The reliability of the capacitors improves when the ambient temperatures are in the normal temperature range and theapplied voltages are low.
Size Code L × W (mm)(kHz)(5) When large high frequency ripple current acrosses multilayer
ceramic capacitor, the capacitor can vibrate. The phenomenon
31
3.2× 1.6650, 1200, 1600
occurs as the capacitor, has natural vibration frequency due to the32650, 850, 1200
3.2× 2.5
mechanical dimensions, resonates to the large high frequency ripple
43450, 650, 1200
4.5× 3.2
5.7× 5.055
350, 450, 850
current.
7.5× 6.376350, 600, 750
To prevent the resonance, please select the capacitor or change the ripple
10.0× 9.080
230, 320, 620
current frequency.
20.0×12.7
90100, 170, 450
For your information, we indicate the following resonance frequency to
25.0×12.79980, 160, 250
each chip size.
(6) The capacitance of the capacitors depends on the ambient temperatures and bias voltages. Therefore, please examine thecapacitors when they are to be used in a time-constant circuit before the use.
(7) Consult us for devices that requires high reliability. For components which are used to the devices whose failure affects
human life or causes social loss by serious damage, higher reliable designs than general purpose components are required.
(8) Please contact us,when you use it for AC use.

2 In designing PC boards(1) Put the proper volume of solder (the size of ﬁllet) on PC boards for installing surface mount capacitors, because it directly
affects the installed capacitors. The design of copper pad patterns and dimensions should be set so that the proper volumeof solder can be provided. The standard land dimensions are shown below.
Chip Capacitor
LandC(2) Land width of PC boards shall not exceed the width of chip capacitors.
Solder resist

d●Chip type

CodeSize Codeabcd

31
2.2 to 2.5
4.2 to 5.8
1.2 to 1.6
0.4 to 0.8

32
2.2 to 2.5
4.2 to 5.8
1.8 to 2.5
0.5 to 1.0

43
3.5 to 3.7
5.5 to 6.1
2.3 to 3.2
0.6 to 1.1

(mm)
5576
4.5 to 4.7 5.0 to 5.2
6.7 to 8.3 8.8 to 10.8
3.5 to 5.0 4.7 to 6.3
0.7 to 1.2 0.8 to 1.3●Metal Cap typeCodeSize Codeabcdab55
3.5 to 4.5
6.5 to 7.5
4.0 to 5.0
0.5 to 1.5(mm)76
5.5 to 6.5
8.8 to 9.8
5.5 to 6.5
0.8 to 1.8(3) When the multilayer ceramic capacitors are mounted on a substrate, the chips may crack when mechanical stress isput. Also, when the substrate is bent, they may also crack. Therefore, please make sure that the material and size of thesubstrate and the capacitor positions are right.
(4) For a leaded capacitor, design the PC boards with the correct terminal hole space equal to the lead space of the capacitor.
Product specifications in this catalog are subject to change without notice.Request our product specifications before purchase and/or use. Please use our products based on the information contained in this catalog and product specifications.

8CAT. No. E1002D 2024

MULTILAYER CERAMIC CAPACITORSPRECAUTIONS AND GUIDELINES

3 Installation(1) When installing leaded capacitors in the PC boards by means of an automatic insertion machine, minimize the mechanicalshock applied to the capacitors by the lead clinch unit of the machine.
(2) When the capacitors are to be mounted on a substrate, please minimize the shock and weight to the capacitor bodies. The
nozzle pressure during the mounting process should be adjusted to 1N～3N maximum in static load.
(3) Periodically maintain and inspect installation machines.
(4) Where an adhesive is used to pre-anchor capacitors on PC boards, use appropriate copper pad dimensions,type ofadhesive, coating volume, curing temperature and time, etc. to prevent the capacitors from deteriorating.

4 Soldering(1) Use ﬂux with a halogen content of less than 0.1 wt. %. Do not use strong acid ﬂux.
(2) Minimize a volume of ﬂux to coat the PC boards with.
(3) Follow the soldering conditions prescribed in the catalog or product speciﬁcations. Excessive thermal stress affects theperformance of the capacitors.
(4) Note that surface mount capacitors with the size 3.2×1.6 or smaller tend to stand up during vapor phase reﬂow soldering.
(5) For reﬂow soldering, place surface mount capacitors on the PC boards as soon as possible after solder paste was coated.
(6) Please be aware that thermal deformation of substrates during mounting process cause stress to the substrates.
Especially, substrates which are mounting chip capacitors are to be flow soldered to solder leaded parts or solder
other parts onto the substrates, please make sure that the deformation during the soldering causes no harm. In fact,
the deformation may cause stress to the substrates which leads to the capacitor element cracks/insulation-layer break
down/insulation resistance degradation.The effect of the stress due to the deformation depends on the material of thesubstrates. Therefore, please be aware of the following infor mation.
a) Ceramic substrates
The stress due to the deformation of ceramic substrates is thought be the minimum. Heat contract difference during
solder hardening can be the effect to ceramic capacitors mounted on the substrates. So, please avoid forced cooling
during the hardening.
b) Glass epoxy substrates
The stress due to the deformation and warp of glass epoxy substrates affects ceramic capacitors mounted. The
stress depends on the size and material of the substrates, pattern positions and thermal gradient during soldering.
Temperature difference between the both sides of the substrates may also cause the stress. When the material of thesubstrates, which are mounting ceramic capacitors, is FR-4 or the equivalent and other parts are to be ﬂow soldered,
the surface of the side with the capacitors shall be sufﬁciently preheated to 150℃ or over before the ﬂow soldering.
During the soldering, the temperature difference between the side with the capacitors and the other side of thesubstrate should be 100℃ maximum.
c) Metal substrates
The deformation and warp of metal substrates considerably affect ceramic capacitors mounted. Therefore, please use
metal caps which can moderate the stress of the substrates.
(7) After reﬂow/ﬂow soldering, please cool the PC boards which mounted capacitors naturally in the air.
(8) Ceramic chip capacitors are solderable by twice maximum in reﬂow or ﬂow soldering. When the capacitors are to be reﬂow
soldered and then ﬂow soldered, there shall be no additional soldering to the capacitors. However, the capacitors
having a size of 5.7×5.0 or larger should be soldered by one time only.
(9) Metal cap type capacitors (NTJ series) is two times reflow.
(10)Due to the nature of ceramic, radical heating or cooling and partial heating may crack the ceramic capacitor element.
Please have enough pre-heating process before soldering.
(11)Ultrasonic cleaning time shall be ten minutes maximum.
When the power of ultrasonic cleaner is too high, the strength of terminations may drop.
Therefore, carefully examine the cleaning conditions before use.
(12)Adjust the amount of solder cream in order that solder ﬁllet shall be 1/2 to 2/3 height of chips. If ﬁllet can conﬁrm, size of
4.5×3.2 or larger is not this limit.
(13)When more than two chips are mounted on a common land, please separate the chips by the solder resist.
(14)In hand soldering, please take into consideration the following items.
1. Fully pre-heat on a heating plate whose surface temperature is 100℃ to 150℃ .
2. Soldering iron power shall not exceed 30W.
3. Soldering iron tip diameter shall not exceed 3mm.
4. Temperature of iron tip shall be adjusted to not exceed 300℃,3sec.
5. The soldering iron tip shall not touch ceramic body directly.
6. After soldering, let the products to be room temperature to cool gradually.
Product specifications in this catalog are subject to change without notice.Request our product specifications before purchase and/or use. Please use our products based on the information contained in this catalog and product specifications.

9CAT. No. E1002D 2024

MULTILAYER CERAMIC CAPACITORSPRECAUTIONS AND GUIDELINES

5 Soldering proﬁleFlow Soldering ProﬁleReﬂow Soldering ProﬁleGradual cooling
Natural cooling at R.T.
250℃ max., 10 sec.max.

60 sec. max.
(Max. period of time over 220℃)
160～190℃
120 sec. max.
3 min. max.

PreheatTemperatuer(℃)

Temperatuer(℃)

Preheatover 2 min.

ΔT≦100℃

2 min. max.

(1) Do not expose the product to temperatures of 250℃ or higher.

Gradual cooling
Natural cooling at R.T.

250℃ max., 5 sec. max.

over 2 min.

*Flow Soldering
Tin plating(Size code : 31, 32, 43)

6 Cleaning(1) In the case that the assembly boards are washed, choose the appropriate cleaning agent for the washing purpose.
(2) To determine the cleaning conditions, make sure by means of the actual washing equipment that the performance of thecapacitors is not affected.
(3) In the case that water-soluble ﬂux was used, sufﬁciently wash the assembly boards.

7 Coating materials(1) When ceramic capacitors are to be resin coated or molded, please pay enough attention. Ceramic capacitors molded inresin, and please do not use it. There is fear to destroy a capacitor by stress to occur by the expansion / the shrinkage
when resin stiffens. When a thermal expansion shrinkage coefﬁcient in hardening uses big resin, coating in the resin
which is soft with capacitors, please make that stress is added to capacitors small as much as possible.
(2) Conﬁrm that harmful resolution or formation gasses are not generated from the coating materials during the curing
process or by spontaneously leaving the coated assembly boards.
(3) If a coating material is cured at higher temperatures than the Category temperature of the capacitor, the exterior resin will
deteriorate resulting in the capacitor damage.

8 Handling(1) When cutting off a multi-board to make individual units, curving or twisting the board may crack the capacitors. Appropriate
tools should be used to cut it off.
(2) Excessive mechanical shock to capacitors or their assembly boards may make the capacitors crack.
(3) Use leaded capacitors without bending their lead wires as much as possible.
(4) When ceramic capacitors are stored with no load, the capacitance reduces during the storage (named "aging
character istic"). As for the product that capacitance decreased, capacity recovers in an initial value by heat-treating it.
(5) When the electrodes of the ceramic capacitors are made of silver, needle crystals may form on the electrodes in an
ambience containing sulfur compounds.

9 Storage(1) Do not store and use capacitors in the following environment. Water or salt water splashes, dew wets or toxic gasses(hydrogen sulﬁde, sulfurous acid,chlorine, ammonium) ﬁlls, Vibration or mechanical shock exceeding the limits prescribedin the catalog or product speciﬁcations.
(2) Do not store capacitors in places that direct sunlight pours down or dewy places.
(3) Avoid high temperature and humidity.
The storage conditions should be : Temperature=Lower than 40℃
Humidity=Lower than 70% RH(4) The storage life is two years from the time of purchase as a general rule.
Product specifications in this catalog are subject to change without notice.Request our product specifications before purchase and/or use. Please use our products based on the information contained in this catalog and product specifications.

10CAT. No. E1002D 2024

MULTILAYER CERAMIC CAPACITORSPRECAUTIONS AND GUIDELINES

10 About AEC-Q200

The Automotive Electronics Council (AEC) was originally established by American major automotive manufactures. Today,
the committees are composed of representatives from the sustaining Members of manufacturing companies in automotiveelectrical components. It has standardized the criteria for "stress test qualification" and "reliability test" for the electroniccomponents.
AEC-Q200 is the reliability test standard for approval of passive components, it has been specified test subjects and quantityetc. for each components. Criteria of reliability tests such as our main products "Multilayer Ceramic Capacitors" are also
described in this.
As customer requirement, Chemi-Con has submits the test results according to AEC-Q200 for the Multilayer Ceramic
Capacitors used in automotive applications to increase in recent years.
AEC-Q200 compliant product is the product which we evaluated by AEC-Q200 standard.
Please contact us for more information.
Please obtain and verify our product specification sheet before you use our product.

11 Catalogs
Product specifications in this catalog are subject to change without notice.
Please request and make sure our product specifications before purchase and/or use.

12 Response to the Substances of Concern(1) Nippon Chemi-Con aims for developing products that meet laws and regulations concerning substances of concern.
(Some products may contain regulated substances for exempted application. )Please contact us for more information about law-compliance status.
(2) According to the content of REACH handbook (Guidance on requirements for substances in articles which is publishedon May 2008), our electronic components are "articles without any intended release". Therefore they are not applicablefor "Registration" for EU REACH Regulation Article 7 (1).
Reference: Electrolytic Condenser Investigation Society"Study of REACH Regulation in EU about Electrolytic Capacitor" (publicized on 13 March 2008)

For the details, refer to Guideline of notabilia for ﬁxed multilayer ceramic capacitors for use in electronic equipment,
EIAJ RCR-2335 issued by Electronic Industries Association of Japan.

Product specifications in this catalog are subject to change without notice.Request our product specifications before purchase and/or use. Please use our products based on the information contained in this catalog and product specifications.

11CAT. No. E1002D 2024