THTVS514_Rev.1.03_E

THTVS514
Transient Voltage Suppressor for I/O Protection

General Description
THTVS514 4ch TVS arrays are ultra-low capacitance
ESD protection devices designed to protect sensitiveor high speed I/O. THine THTVS series has been
specifically designed to protect sensitive components
which are connected to digital transmission lines fromovervoltage caused by ESD (electrostatic discharge),
CDE (Cable Discharge Events), and EFT (electricalfast transients).
THTVS514 has a 0.3pF(typ) small capacitance
between I/O pins. ESD are highlighted by high ESD
withstand voltage (Contact ±12kV per IEC 61000-42), It will protect four lines operating at 5.5V(Vrwm).
THTVS514 is in a 2.5 x 1.0 x 0.55mm 10-Leadstandard package and flow- through pin layout foreasy and simple PCB design.
The THTVS514 four-channel TVS is for sensitive or
high speed I/O which designed to protect ASIC,FPGA, SoC, ASSP, LVDS, PECL, CML digital I/O
and HDMI, Display port, USB3.0 high speed
standard I/O.
They may be used to meet the ESD immunity
requirements of IEC 61000- 4-2/4/5.
The THTVS514 protects four single-end lines or two
differential lines.

Features
ESD protection for high-speed data lines to
IEC61000-4-2(ESD) ±17kV (air), ±12kV (contact)
IEC61000-4-4(EFT) 40A (5/50ns)
IEC61000-4-5(Surge) 6A (8/20μs)








Protect four high speed lines
Flow-through pin configuration
Low capacitance: 0.3pF typ (I/O to I/O)
Low dynamic resistance: 0.19 Ohm typ
Operating voltage: Vrwm 5.5V
10 pin standard package (2.5 x 1.0 x 0.55mm)
Packaging: Tape and ReelApplications
Applications for sensitive and high speed I/Oprotection as followed.


FPGA/SoC/ASSP high speed I/O.
CML/PECL/LVDS physical layer
HDMI/DVI/DisplayPortTM
PCI Express /eSATA
USB3.0/3.1
V-by-One® HS
Sensitive Sensor I/O
Connector and cable I/F

Schematic and Package Dimension

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Pin Configuration

THTVS514 package pin configuration (Top view)

Pin Description
Pin NoType
Description
1IInput
2I
Input
Ground. Must be tied to the PCB ground plane
3, 8GND*1
4I
Input
5I
Input
6 ,7,NC
No internal connection
9 ,10*1: Low impedance connection to Ground required.

Absolute Maximum Rating
Parameter

SymbolValue

Unit

IPP

6A

VESD+/- 17+/- 12kV

Operating Junction Temperature

TJ-55 to +125°C

Storage Temperature

TSTG-55 to +150°C

Peak Pulse Current (tp = 8/20μs)
ESD per IEC 61000-4-2 (Air) (1)
ESD per IEC 61000-4-2 (Contact)(1)

Notes:(1) ESD gun return path connected to Ground Reference Plane (GRP)

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Electrical Characteristics (Tj = 25 ℃)
Parameter

SymbolCondition

MinTypMax

Unit

Reverse Stand-OffVoltage

VRWM

I/O pin to ground

--

5.5

V

Reverse Breakdown
Voltage

VBR

It = 1mA
I/O pin to ground

6--

V

Clamping Voltage

VC

Ipp = 1A
tp = 8/20µs
Any I/O pin to GND--15V

Reverse Leakage Current

IRVRWM = 5.5V

--

0.1μA

Ipp = 4A
tp = 0.2/100ns (TLP)
Any I/O pin to GND-10.8-Ipp = 16A
tp = 0.2/100ns (TLP) Any
I/O pin to GND-13.0-

tp = 0.2/100ns (TLP)-0.19---

0.8

ESD Clamping Voltage(2)Dynamic Resistance (2)(3)

VC

RDYN

VR = 0V, f = 1MHz
Junction Capacitance

VI/O Pins to ground
Cj

VR = 0V, f = 1MHz
between I/O pins

ΩpF
-

0.3

0.4

Notes:(2) Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, I_TLP and V_TLP averaging window: t1 = 70ns to t2 =90ns.
(3) Dynamic resistance calculated from I_TLP = 4A to I_TLP = 16A

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Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time

8/20us Surge Clamping Characteristic

ESD Clamping (8kV Contact per IEC 61000-4-2)

ESD Clamping (-8kV Contact per IEC 61000-4-2)

TLP Characteristic (Positive Pulse)

TLP Characteristic (Negative Pulse)

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Typical Characteristics
Insertion Loss (Line to GND)

Capacitance vs. Reverse Voltage

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Package
D

1PIN INDEXETOP VIEWA
aaa

SEATING
PLAE

CC
A1

SIDE VIEW
R0.092b1(0.025-0.075)

L1

L2

E/2
Leb

D/2
R0.050

BOTTOM VIEW

Unit: mmSymbol
A
A1bb1
DEe
L
L1
L2
aaa

Items
Mounting HeightStandoff
Body Length
Body Width
Pitch
Coplanarity

Min.
0.50
0.00
0.15
0.35
2.45
0.95
0.25
0.30
0.194

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Nom.
0.55
0.03
0.20
0.40
2.50
1.00
0.50 BSC
0.30
0.35
0.244
0.08

Max.
0.60
0.05
0.25
0.45
2.575
1.075
0.35
0.40
0.294

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Land Pattern

0.20

1.55

(0.875)

0.50

0.20
0.40
Note:
Please carefully consider your SMT conditions (Material of substrate, Solder Composition, Reflow Condition and so on), andadjusts the Land Pattern at your own risk.

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THTVS514_Rev.1.03_ENotices and Requests
1.

The product specifications described in this material are subject to change without prior notice.

2.

The circuit diagrams described in this material are examples of the application which may not always apply to thecustomer’s design. THine Electronics, Inc. (“THine”) is not responsible for possible errors and omissions in this material.
Please note even if errors or omissions should be found in this material, THine may not be able to correct them
immediately.

3.

This material contains THine’s copyright, know-how or other intellectual property rights. Copying, reverse-engineer ordisclosing to third parties the contents of this material without THine’s prior written permission is prohibited.

4.

THINE ACCEPTS NO LIABILITY FOR ANY DAMAGE OR LOSS IN CONNECTION WITH ANY DISPUTERELATING TO INTELLECTUAL PROPERTY RIGHTS BETWEEN THE USER AND ANY THIRD PARTY,ARISING OUT OF THIS PRODUCT, EXCEPT FOR SUCH DAMAGE OR LOSS IN CONNECTION WITHDISPUTES SUCCESSFULLY PROVED BY THE USER THAT SUCH DISPUTES ARE DUE SOLELY TOTHINE. NOTE, HOWEVER, EVEN IN THE AFOREMENTIONED CASE, THINE ACCEPTS NO LIABILITYFOR SUCH DAMAGE OR LOSS IF THE DISPUTE IS CAUSED BY THE USER’S INSTRUCTION.

5.

This product is not designed for applications that require extremely high-reliability/safety such as aerospace device,nuclear power control device, or medical device related to critical care, excluding when this product is specified forautomotive use by THine and used it for that purpose. THine accepts no liability whatsoever for any damages, claims orlosses arising out of the uses set forth above.

6.

Despite our utmost efforts to improve the quality and reliability of the product, faults will occur with a certain small
probability, which is inevitable to a semi-conductor product. Therefore, you are encouraged to have sufficiently fail-safe
design principles such as redundant or error preventive design applied to the use of the product so as not to have ourproduct cause any social or public damage.

7.

This product may be permanently damaged and suffer from performance degradation or loss of mechanical functionality
if subjected to electrostatic charge exceeding capacity of the ESD (Electrostatic Discharge) protection circuitry. Safety
earth ground must be provided to anything in contact with the product, including any operator, floor, tester and soldering
iron.

8.

Please note that this product is not designed to be radiation-proof.

9.

Testing and other quality control techniques are used to this product to the extent THine deems necessary to support
warranty for performance of this product. Except where mandated by applicable law or deemed necessary by THine
based on the user’s request, testing of all functions and performance of the product is not necessarily performed.

10. This product must be stored according to storage method which is specified in this specifications. THine accepts noliability whatsoever for any damage or loss caused to the user due to any storage not according to above-mentioned
method.
11. Customers are asked, if required, to judge by themselves if this product falls under the category of strategic goods under
the Foreign Exchange and Foreign Trade Act in Japan and the Export Administration Regulations in the United States ofAmerica on export or transit of this product. This product is prohibited for the purpose of developing militarymodernization, including the development of weapons of mass destruction (WMD), and the purpose of violating humanrights.

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12. The product or peripheral parts may be damaged by a surge in voltage over the absolute maximum ratings or malfunction,
if pins of the product are shorted by such as foreign substance. The damages may cause a smoking and ignition.
Therefore, you are encouraged to implement safety measures by adding protection devices, such as fuses. THine accepts
no liability whatsoever for any damage or loss caused to the user due to use under a condition exceeding the limiting
values.
13. All patents or pending patent applications, trademarks, copyrights, layout-design exploitation rights or other intellectual
property rights concerned with this product belong to THine or licensor(s) of THine. No license or right is granted to theuser for any intellectual property right or other proprietary right now or in the future owned by THine or THine’s licensor.
The user must enter into a license agreement with THine or THine’s licensor to be granted of such license or right.

THine Electronics, Inc.
https://www.thine.co.jp

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