Signal and Power Isolated RS-485
Transceiver with ±15 kV ESD Protection
ADM2582E/ADM2587E
FEATURESFUNCTIONAL BLOCK DIAGRAM
VCC

VISOOUT
isoPower DC-TO-DC CONVERTEROSCILLATORRECTIFIERVISOINREGULATORDIGITAL ISOLATION iCoupler

TRANSCEIVERY

TxD

ENCODEDECODEDZ

DE

ENCODEDECODERxD

DECODEENCODE

A
R
B

ADM2582E/ADM2587E

RE
GND1

ISOLATIONBARRIER

GND208111-001

Isolated RS-485/RS-422 transceiver, configurable as half orfull duplex
isoPower® integrated isolated dc-to-dc converter±15 kV ESD protection on RS-485 input/output pins
Complies with ANSI/TIA/EIA-485-A-98 and ISO 8482:1987(E)ADM2582E data rate: 16 Mbps
ADM2587E data rate: 500 kbps
5 V or 3.3 V operation
Connect up to 256 nodes on one bus
Open- and short-circuit, fail-safe receiver inputs
High common-mode transient immunity: >25 kV/μs
Thermal shutdown protection
Safety and regulatory approvals
UL recognition: 2500 V rms for 1 minute per UL 1577
VDE Certificates of Conformity
DIN EN 60747-5-2 (VDE 0884 Part 2): 2003-01
VIORM = 560 V peak
Operating temperature range: −40°C to +85°C
Highly integrated, 20-lead, wide-body SOIC package

Figure 1.

APPLICATIONSIsolated RS-485/RS-422 interfaces
Industrial field networks
Multipoint data transmission systems

GENERAL DESCRIPTION
The ADM2582E/ADM2587E are fully integrated signal andpower isolated data transceivers with ±15 kV ESD protection
and are suitable for high speed communication on multipointtransmission lines. The ADM2582E/ADM2587E include an
integrated isolated dc-to-dc power supply, which eliminates theneed for an external dc-to-dc isolation block.
They are designed for balanced transmission lines and comply
with ANSI/TIA/EIA-485-A-98 and ISO 8482:1987(E).
The devices integrate Analog Devices, Inc., iCoupler® technology to
combine a 3-channel isolator, a three-state differential line driver, adifferential input receiver, and Analog Devices isoPower dc-todc converter into a single package. The devices are powered by asingle 5 V or 3.3 V supply, realizing a fully integrated signal andpower isolated RS-485 solution.

The ADM2582E/ADM2587E driver has an active high enable.
An active low receiver enable is also provided, which causes thereceiver output to enter a high impedance state when disabled.
The devices have current limiting and thermal shutdown
features to protect against output short circuits and situations
where bus contention may cause excessive power dissipation.
The parts are fully specified over the industrial temperature
range and are available in a highly integrated, 20-lead, widebody SOIC package.
The ADM2582E/ADM2587E contain isoPower technology thatuses high frequency switching elements to transfer power throughthe transformer. Special care must be taken during printed circuitboard (PCB) layout to meet emissions standards. Refer toApplication Note AN-0971, Control of Radiated Emissions with
isoPower Devices, for details on board layout considerations.

Rev. C
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or otherrights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113 ©2009–2011 Analog Devices, Inc. All rights reserved.

ADM2582E/ADM2587E
TABLE OF CONTENTS
Features .............................................................................................. 1

Switching Characteristics .............................................................. 13

Applications....................................................................................... 1

Circuit Description......................................................................... 14

Functional Block Diagram .............................................................. 1

Signal Isolation ........................................................................... 14

General Description ......................................................................... 1

Power Isolation ........................................................................... 14

Revision History ............................................................................... 2

Truth Tables................................................................................. 14

Specifications..................................................................................... 3

Thermal Shutdown .................................................................... 14

ADM2582E Timing Specifications ............................................ 4

Open- and Short-Circuit, Fail-Safe Receiver Inputs.............. 14

ADM2587E Timing Specifications ............................................ 4

DC Correctness and Magnetic Field Immunity........................... 14

ADM2582E/ADM2587E Package Characteristics................... 4

Applications Information .............................................................. 16

ADM2582E/ADM2587E Regulatory Information .................. 5

PCB Layout ................................................................................. 16

ADM2582E/ADM2587E Insulation and Safety-Related
Specifications ................................................................................ 5

EMI Considerations................................................................... 16

ADM2582E/ADM2587E VDE 0884 Insulation
Characteristics .............................................................................. 5

Isolated Power Supply Considerations .................................... 17

Absolute Maximum Ratings............................................................ 6
ESD Caution.................................................................................. 6
Pin Configuration and Function Descriptions............................. 7

Insulation Lifetime ..................................................................... 16
Typical Applications................................................................... 18
Outline Dimensions ....................................................................... 20
Ordering Guide .......................................................................... 20

Typical Performance Characteristics ............................................. 8
Test Circuits..................................................................................... 12

REVISION HISTORY
6/11—Rev. B to Rev. C
Changes to Features Section and Figure 1..................................... 1
Changes to Table 4............................................................................ 4
Changes to Table 5............................................................................ 5
Deleted Table 6; Renumbered Sequentially .................................. 5
Added Thermal Resistance θJA Parameter, Table 8....................... 6
Changes to Table 9............................................................................ 6
Changes to Table 10.......................................................................... 7
Changes to Table 13........................................................................ 14
Moved DC Correctness and Magnetic Field Immunity
Section.............................................................................................. 14
Changes to PCB Layout Section and Figure 35 .......................... 16
Changes to Figure 39...................................................................... 17
Changes to Typical Applications Section and Figure 40 ........... 18

3/11—Rev. A to Rev. B
Removed Pending from Safety and Regulatory
Approvals........................................................................ Throughout
Changed Minimum External Air Gap (Clearance) Value andMinimum External Tracking (Creepage) Value............................5
Added Text to the ADM2582E/ADM2587E VDE 0884
Insulation Characteristics Section ..................................................5
9/10—Rev. 0 to Rev. A
Changes to Features Section ............................................................1
Changes to Differential Output Voltage, Loaded Parameter,
Table 1 .................................................................................................3
Changes to Table 5.............................................................................5
Added Table 6; Renumbered Sequentially .....................................5
Change to Pin 8 Description, Table 11 ...........................................7
Changes to Figure 5 and Figure 6....................................................8
Changes to Table 13 and Table 14 ................................................ 14
9/09—Revision 0: Initial Version

Rev. C | Page 2 of 20

ADM2582E/ADM2587E
SPECIFICATIONS
All voltages are relative to their respective ground; 3.0 ≤ VCC ≤ 5.5 V. All minimum/maximum specifications apply over the entire
recommended operation range, unless otherwise noted. All typical specifications are at TA = 25°C, VCC = 5 V unless otherwise noted.
Table 1.
Parameter
ADM2587E SUPPLY CURRENT
Data Rate ≤ 500 kbps

SymbolICC

ADM2582E SUPPLY CURRENT
Data Rate = 16 Mbps

ICC

ISOLATED SUPPLY VOLTAGE
DRIVER
Differential Outputs
Differential Output Voltage, Loaded

VISOUT

Δ|VOD| for Complementary Output States
Common-Mode Output Voltage
Δ|VOC| for Complementary Output States
Short-Circuit Output Current
Output Leakage Current (Y, Z)

Min

Typ

Max

Unit

Test Conditions

120

mA
mA
mA
mA
mA

VCC = 3.3 V, 100 Ω load between Y and Z
VCC = 5 V, 100 Ω load between Y and Z
VCC = 3.3 V, 54 Ω load between Y and Z
VCC = 5 V, 54 Ω load between Y and Z
120 Ω load between Y and Z

150
230

mA
mA

120 Ω load between Y and Z
54 Ω load between Y and Z

3.6
3.6
3.6
0.2
3.0
0.2
200
30

V
V
V
V
V
V
mA
μA

RL = 100 Ω (RS-422), see Figure 23
RL = 54 Ω (RS-485), see Figure 23−7 V ≤ VTEST1 ≤ 12 V, see Figure 24
RL = 54 Ω or 100 Ω, see Figure 23
RL = 54 Ω or 100 Ω, see Figure 23
RL = 54 Ω or 100 Ω, see Figure 23

90
72
125
98

|VOD2||VOD3|
Δ|VOD|VOC
Δ|VOC|
IOS
IO

3.3

2.0
1.5
1.5

−30
Logic Inputs DE, RE, TxD
Input Threshold Low
Input Threshold High
Input Current
RECEIVER
Differential Inputs
Differential Input Threshold Voltage
Input Voltage Hysteresis
Input Current (A, B)
Line Input Resistance
Logic Outputs
Output Voltage Low
Output Voltage High
Short-Circuit Current
COMMON-MODE TRANSIENT IMMUNITY 1
1

μA

VIL
VIH
II

0.3 × VCC
−10

0.01

VTH
VHYS
II

−200

−125
15

0.7 × VCC
10

−30
125

RIN

−100
96

VOL
VOH

VCC − 0.3

0.2
VCC − 0.2

0.4
100

25

DE = 0 V, RE = 0 V, VCC = 0 V or 3.6 V,
VIN = 12 V
DE = 0 V, RE = 0 V, VCC = 0 V or 3.6 V,
VIN = −7 VVVμA

DE, RE, TxD
DE, RE, TxD
DE, RE, TxD

mV
mV
μA
μA
kΩ

−7 V < VCM < +12 V
VOC = 0 V
DE = 0 V, VCC = 0 V or 3.6 V, VIN = 12 V
DE = 0 V, VCC = 0 V or 3.6 V, VIN = −7 V
−7 V < VCM < +12 V

V
V
mA
kV/μs

IO = 1.5 mA, VA − VB = −0.2 V
IO = −1.5 mA, VA − VB = 0.2 V
VCM = 1 kV, transient magnitude = 800 V

CM is the maximum common-mode voltage slew rate that can be sustained while maintaining specification-compliant operation. VCM is the common-mode potential
difference between the logic and bus sides. The transient magnitude is the range over which the common-mode is slewed. The common-mode voltage slew rates
apply to both rising and falling common-mode voltage edges.

Rev. C | Page 3 of 20

ADM2582E/ADM2587E
ADM2582E TIMING SPECIFICATIONSTA = −40°C to +85°C.
Table 2.
Parameter
DRIVER
Maximum Data Rate
Propagation Delay, Low to High
Propagation Delay, High to Low
Output Skew
Rise Time/Fall Time
Enable Time
Disable Time
RECEIVER
Propagation Delay, Low to High
Propagation Delay, High to Low
Output Skew 1
Enable Time
Disable Time1

Symbol

Min

Typ

Max

Unit

Test Conditions

tDPLH
tDPHL
tSKEW
tDR, tDF
tZL, tZH
tLZ, tHZ

63
64
1

100
100
8
15
120
150

Mbps
ns
ns
ns
ns
ns
ns

RL = 54 Ω, CL1 = C L2 = 100 pF, see Figure 25 and Figure 29
RL = 54 Ω, CL1 = C L2 = 100 pF, see Figure 25 and Figure 29
RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 25 and Figure 29
RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 25 and Figure 29
RL = 110 Ω, CL = 50 pF, see Figure 26 and Figure 31
RL = 110 Ω, CL = 50 pF, see Figure 26 and Figure 31

tRPLH
tRPHL
tSKEW
tZL, tZH
tLZ, tHZ

94
95
1

110
110
12
15
15

ns
ns
ns
ns
ns

CL = 15 pF, see Figure 27 and Figure 30
CL = 15 pF, see Figure 27 and Figure 30
CL = 15 pF, see Figure 27 and Figure 30
RL = 1 kΩ, CL = 15 pF, see Figure 28 and Figure 32
RL = 1 kΩ, CL = 15 pF, see Figure 28 and Figure 32

Typ

Max

Unit

Test Conditions

503
510
7

700
700
100
1100
2.5
200

kbps
ns
ns
ns
ns
μs
ns

RL = 54 Ω, CL1 = C L2 = 100 pF, see Figure 25 and Figure 29
RL = 54 Ω, CL1 = C L2 = 100 pF, see Figure 25 and Figure 29
RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 25 and Figure 29
RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 25 and Figure 29
RL = 110 Ω, CL = 50 pF, see Figure 26 and Figure 31
RL = 110 Ω, CL = 50 pF, see Figure 26 and Figure 31

91
95
4

200
200
30
15
15

ns
ns
ns
ns
ns

CL = 15 pF, see Figure 27 and Figure 30
CL = 15 pF, see Figure 27 and Figure 30
CL = 15 pF, see Figure 27 and Figure 30
RL = 1 kΩ, CL = 15 pF, see Figure 28 and Figure 32
RL = 1 kΩ, CL = 15 pF, see Figure 28 and Figure 32

16

Guaranteed by design.

ADM2587E TIMING SPECIFICATIONSTA = −40°C to +85°C.
Table 3.
Parameter
DRIVER
Maximum Data Rate
Propagation Delay, Low to High
Propagation Delay, High to Low
Output Skew
Rise Time/Fall Time
Enable Time
Disable Time
RECEIVER
Propagation Delay, Low to High
Propagation Delay, High to Low
Output Skew
Enable Time
Disable Time

Symbol

tDPLH
tDPHL
tSKEW
tDR, tDF
tZL, tZH
tLZ, tHZ
tRPLH
tRPHL
tSKEW
tZL, tZH
tLZ, tHZ

Min
500
250
250
200

ADM2582E/ADM2587E PACKAGE CHARACTERISTICS
Table 4.
Parameter
Resistance (Input-to-Output) 1
Capacitance (Input-to-Output)1
Input Capacitance 2
1
2

Symbol
RI-O
CI-O
CI

Min

Typ
1012
3
4

Max

Device considered a 2-terminal device: short together Pin 1 to Pin 10 and short together Pin 11 to Pin 20.
Input capacitance is from any input data pin to ground.

Rev. C | Page 4 of 20

Unit
Ω
pF
pF

Test Conditions
f = 1 MHzADM2582E/ADM2587E
ADM2582E/ADM2587E REGULATORY INFORMATION
Table 5. ADM2582E/ADM2587E Approvals
Organization
UL

VDE

Approval Type
Recognized under the Component
Recognition Program of Underwriters
Laboratories, Inc.
Certified according to DIN EN 60747-5-2(VDE 0884 Part 2): 2003-01

Notes
In accordance with UL 1577, each ADM2582E/ADM2587E is proof tested
by applying an insulation test voltage ≥ 3000 V rms for 1 second.
In accordance with DIN EN 60747-5-2, each ADM2582E/ADM2587E isproof tested by applying an insulation test voltage ≥ 1050 VPEAK for
1 second.

ADM2582E/ADM2587E INSULATION AND SAFETY-RELATED SPECIFICATIONS
Table 6.
Parameter
Rated Dielectric Insulation Voltage
Minimum External Air Gap (Clearance)

SymbolL(I01)

Value
2500
7.7

Unit
V rms
mm

Minimum External Tracking (Creepage)

L(I02)

7.6mm

Minimum Internal Gap (Internal Clearance)
Tracking Resistance (Comparative Tracking Index)
Isolation Group

CTI

0.017 min
>175
IIIa

mm
V

Conditions
1-minute duration
Measured from input terminals to output terminals,
shortest distance through air
Measured from input terminals to output terminals,
shortest distance along bodyInsulation distance through insulation
DIN IEC 112/VDE 0303-1
Material Group (DIN VDE 0110: 1989-01, Table 1)

ADM2582E/ADM2587E VDE 0884 INSULATION CHARACTERISTICS
This isolator is suitable for basic electrical isolation only within the safety limit data. Maintenance of the safety data must be ensured bymeans of protective circuits.
An asterisk (*) on packages denotes VDE 0884 Part 2 approval.
Table 7.
Description
CLASSIFICATIONS
Installation Classification per DIN VDE 0110 for
Rated Mains Voltage≤150 V rms≤300 V rms≤400 V rms
Climatic Classification
Pollution Degree
VOLTAGE
Maximum Working Insulation Voltage
Input-to-Output Test Voltage
Method b1
Method a
After Environmental Tests, Subgroup 1
After Input and/or Safety Test,
Subgroup 2/Subgroup 3
Highest Allowable Overvoltage
SAFETY-LIMITING VALUES
Case Temperature
Input Current
Output Current
Insulation Resistance at TS

Conditions

SymbolCharacteristic

Unit

I to IV
I to IIII to II
40/85/21
2

DIN VDE 0110, see Table 1
VIORM
VPR

560

V peak

VIORM × 1.875 = VPR, 100% production tested,
tm = 1 sec, partial discharge < 5 pC

1050

V peak

VIORM × 1.6 = VPR, tm = 60 sec, partial discharge < 5 pC
VIORM × 1.2 = VPR, tm = 60 sec, partial discharge < 5 pC

896
672

V peakV peakVTR

4000

V peakTS
IS, INPUT
IS, OUTPUT
RS

150
265
335
>109

°C
mA
mA
Ω

Transient overvoltage, tTR = 10 sec
Maximum value allowed in the event of a failure

VIO = 500 V

Rev. C | Page 5 of 20

ADM2582E/ADM2587E
ABSOLUTE MAXIMUM RATINGSTA = 25°C, unless otherwise noted. All voltages are relative totheir respective ground.
Table 8.
Parameter
VCC
Digital Input Voltage (DE, RE, TxD)
Digital Output Voltage (RxD)
Driver Output/Receiver Input Voltage
Operating Temperature Range
Storage Temperature Range
ESD (Human Body Model) on
A, B, Y, and Z pins
ESD (Human Body Model) on Other Pins
Thermal Resistance θJA
Lead Temperature
Soldering (10 sec)
Vapor Phase (60 sec)
Infrared (15 sec)

Rating−0.5 V to +7 V
−0.5 V to VDD + 0.5 V−0.5 V to VDD + 0.5 V−9 V to +14 V−40°C to +85°C−55°C to +150°C±15 kV±2 kV
50°C/W

Table 9. Maximum Continuous Working Voltage1
Parameter
AC Voltage
Bipolar Waveform

Max

Unit

Reference Standard

424

V peak50-year minimum
lifetime

Unipolar Waveform
Basic Insulation

560

V peakMaximum approved
working voltage per
VDE 0884 Part 2

DC Voltage
Basic Insulation

560

V peakMaximum approved
working voltage per
VDE 0884 Part 2

1

260°C
215°C
220°C

Refers to continuous voltage magnitude imposed across the isolation
barrier. See the Insulation Lifetime section for more details.

ESD CAUTION

Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stressrating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affectdevice reliability.

Rev. C | Page 6 of 20

ADM2582E/ADM2587E
PIN CONFIGURATION AND FUNCTION DESCRIPTIONSGND1 1

20

GND2

VCC 2

19

VISOINGND1 3

18

A

RE 5
DE 6
TxD 7

ADM2582E 17 B
ADM2587E 16

GND2
TOP VIEW(Not to Scale) 15 Z
14 GND2

VCC 8

13

Y

GND1 912

VISOOUTGND1 10

11

GND2

NOTES
1. PIN 12 AND PIN 19 MUST BE
CONNECTED EXTERNALLY.

08111-002

RxD 4

Figure 2. Pin Configuration

Table 10. Pin Function Description
Pin No.
12Mnemonic
GND1
VCC

3
4

GND1
RxD

5

RE

6
7
8

DE
TxD
VCC

9
10
11
12

GND1
GND1
GND2
VISOOUT

13
14
15
16
17
18
19

Y
GND2
Z
GND2
B
A
VISOIN20

GND2

Description
Ground, Logic Side.
Logic Side Power Supply. It is recommended that a 0.1 μF and a 0.01 μF decoupling capacitor be fitted between
Pin 2 and Pin 1.
Ground, Logic Side.
Receiver Output Data. This output is high when (A − B) ≥ −30 mV and low when (A − B) ≤ –200 mV.
The output is tristated when the receiver is disabled, that is, when RE is driven high.
Receiver Enable Input. This is an active-low input. Driving this input low enables the receiver; driving ithigh disables the receiver.
Driver Enable Input. Driving this input high enables the driver; driving it low disables the driver.
Driver Input. Data to be transmitted by the driver is applied to this input.
Logic Side Power Supply. It is recommended that a 0.1 μF and a 10 μF decoupling capacitor be fitted between
Pin 8 and Pin 9.
Ground, Logic Side.
Ground, Logic Side.
Ground, Bus Side.
Isolated Power Supply Output. This pin must be connected externally to VISOIN. It is recommended that a reservoir
capacitor of 10 μF and a decoupling capacitor of 0.1 μF be fitted between Pin 12 and Pin 11.
Driver Noninverting Output
Ground, Bus Side.
Driver Inverting Output
Ground, Bus Side.
Receiver Inverting Input.
Receiver Noninverting Input.
Isolated Power Supply Input. This pin must be connected externally to VISOOUT. It is recommended that a
0.1 μF and a 0.01 μF decoupling capacitor be fitted between Pin 19 and Pin 20.
Ground, Bus Side.

Rev. C | Page 7 of 20

ADM2582E/ADM2587E
TYPICAL PERFORMANCE CHARACTERISTICS
180

140
120

RL = 54Ω

140

SUPPLY CURRENT, ICC (mA)120
RL = 120Ω
100
80
NO LOAD

60
40

100
80
60
40
NO LOAD

60

85

0
–40

–15

10
35
TEMPERATURE (°C)

608508111-105

10
35
TEMPERATURE (°C)

08111-103–15

Figure 3. ADM2582E Supply Current (ICC) vs. Temperature(Data Rate = 16 Mbps, DE = 3.3 V, VCC = 3.3 V)

85

Figure 6. ADM2587E Supply Current (ICC) vs. Temperature(Data Rate = 500 kbps, DE = 3.3 V, VCC = 3.3 V)

140

72
70

DRIVER PROPAGATION DELAY (ns)

RL = 54Ω

120
SUPPLY CURRENT, ICC (mA)

RL = 120Ω

20

20
0
–40

RL = 54Ω

08111-107

SUPPLY CURRENT, ICC (mA)

160

100
RL = 120Ω
80
60
NO LOAD
40
20

68
66
64

tDPHL

62

tDPLH

60
58
56
54
52

–15

10
35
TEMPERATURE (°C)

60

85

50
–40

08111-104

0–40

Figure 4. ADM2582E Supply Current (ICC) vs. Temperature(Data Rate = 16 Mbps, DE = 5 V, VCC = 5 V)

–15

10
35
TEMPERATURE (°C)

60

Figure 7. ADM2582E Differential Driver Propagation Delay vs. Temperature

120

600

DRIVER PROPAGATION DELAY (ns)580

RL = 54Ω
80
RL = 120Ω

60

40
NO LOAD
20

560
540

tDPLH

520

tDPHL

500
480
460
440

–15

10
35
TEMPERATURE (°C)

60

Figure 5. ADM2587E Supply Current (ICC) vs. Temperature(Data Rate = 500 kbps, DE = 5 V, VCC = 5 V)

85

400
–40

–15

10
35
TEMPERATURE (°C)

608508111-108

420

0
–40

08111-106

SUPPLY CURRENT, ICC (mA)

100

Figure 8. ADM2587E Differential Driver Propagation Delay vs. Temperature

Rev. C | Page 8 of 20

ADM2582E/ADM2587E
60

TxD
OUTPUT CURRENT (mA)

50

1

Z
Y

40

30

20

CH2 2.0V

M10.00ns

A CH1

1.28V

0

08111-109

CH1 2.0V
CH3 2.0V

Figure 9. ADM2582E Driver Propagation Delay

0

1

2
3
OUTPUT VOLTAGE (V)4508111-112

103

Figure 12. Receiver Output Current vs. Receiver Output Low Voltage
4.75
4.74

OUTPUT VOLTAGE(V)

4.73

TxD

1

Z
Y

4.72
4.71
4.70
4.69
4.68
4.67

3

M200ns

A CH1

2.56V

4.65
–40

Figure 10. ADM2587E Driver Propagation Delay

10
35
TEMPERATURE (°C)

60

85

85

Figure 13. Receiver Output High Voltage vs. Temperature

0

0.32

–10

0.30

–20

OUTPUT VOLTAGE (V)OUTPUT CURRENT (mA)

–1508111-113

CH2 2.0V

08111-110

CH1 2.0V
CH3 2.0V

08111-114

4.66

–30
–40
–50

0.28

0.26

0.24

0.22

–60

0

1

2
3
OUTPUT VOLTAGE (V)

4

5

0.20
–40

08111-111–70

Figure 11. Receiver Output Current vs. Receiver Output High Voltage

–15

10
35
TEMPERATURE (°C)

60

Figure 14. Receiver Output Low Voltage vs. Temperature

Rev. C | Page 9 of 20

ADM2582E/ADM2587E
B

A
1

RxD

3

CH2 2.0V

M10.00ns

A CH1

2.56V

98
97
96

tRPHL

95
94
93
92

tRPLH

91
90
–40

08111-115

CH1 2.0V
CH3 2.0V

99

–15

10
35
TEMPERATURE (°C)

608508111-118

RECEIVER PROPAGATION DELAY (ns)100

Figure 18. ADM2587E Receiver Propagation Delay vs. Temperature

Figure 15. ADM2582E Receiver Propagation Delay

3.33

ISOLATED SUPPLY VOLTAGE (V)

A

B
1

RxD

A CH1

2.56V

3.29
NO LOADRL = 120Ω
RL = 54Ω

3.28

3.26
–40

–15

10
35
TEMPERATURE (°C)

60

85Figure 19. ADM2582E Isolated Supply Voltage vs. Temperature(VCC = 3.3 V, Data Rate = 16 Mbps)

Figure 16. ADM2587E Receiver Propagation Delay
98

3.36
3.35

96

tRPHL
95

tRPLH
94

93

3.34
3.33
3.32
3.31
3.30
3.29
NO LOADRL = 120Ω
RL = 54Ω

3.28
3.27

92
–40

–15

10
35
TEMPERATURE (°C)

60

85Figure 17. ADM2582E Receiver Propagation Delay vs. Temperature

3.26
–40

–15

10
35
TEMPERATURE (°C)

60

85Figure 20. ADM2582E Isolated Supply Voltage vs. Temperature(VCC = 5 V, Data Rate = 16 Mbps)

Rev. C | Page 10 of 20

08111-120

ISOLATED SUPPLY VOLTAGE (V)97

08111-117

RECEIVER PROPAGATION DELAY (ns)3.30

08111-119

M10.00ns

08111-116

CH2 2.0V

3.31

3.27

3

CH1 2.0V
CH3 2.0V

3.32

ADM2582E/ADM2587E
40
RL = 54Ω

40

ISOLATED SUPPLY CURRENT (mA)

50

RL = 120Ω

30
NO LOAD20

1030
RL = 120Ω

25
20
15
10

NO LOAD
5

–15

10
35
TEMPERATURE (°C)

60

85Figure 21. ADM2582E Isolated Supply Current vs. Temperature(VCC = 3.3 V, Data Rate = 16 Mbps)

0
–40

–15

10
35
TEMPERATURE (°C)

60

85Figure 22. ADM2587E Isolated Supply Current vs. Temperature(VCC = 3.3 V, Data Rate = 500 kbps)

Rev. C | Page 11 of 20

08111-122

0–40

RL = 54Ω

35

08111-121

ISOLATED SUPPLY CURRENT (mA)60

ADM2582E/ADM2587E
TEST CIRCUITS
RL
2

VOD2

RL
2

VOUT
Y

VOC

TxD
08111-003

Z

S1

Figure 23. Driver Voltage Measurement

Y

Figure 26. Driver Enable/Disable

375Ω
A

60Ω
VTEST

B

Figure 24. Driver Voltage Measurement

Y
TxD

CL

Figure 27. Receiver Propagation Delay

CL

+1.5V

CL

–1.5V

VCC
S1

RL

08111-005

Z

VOUT

RE

RL
RE

S2
CL

VOUT

RE IN

Figure 25. Driver Propagation Delay

Figure 28. Receiver Enable/Disable

Rev. C | Page 12 of 20

08111-008

375Ω

Z

08111-004

VOD3

TxD

S2

CL
50pF

Z

DE

VCC

RL
110Ω

08111-007

TxD

08111-006

YADM2582E/ADM2587E
SWITCHING CHARACTERISTICS
VCC
VCC/2

VCC/2

0V

tDPLH

tDPHL

VCC

Z
VO

1/2VO

DE

tLZ

2.3V

Y, Z

90% POINT

VDIFF

VOL + 0.5V

90% POINT

VDIFF = V(Y) – V(Z)

VOL

tZH
10% POINT

tDF

tDR

tHZ

2.3V

VOH
VOH – 0.5V

Y, Z

08111-011

10% POINT

08111-009–VO

0.5VCC
0V

tZL

Y

+VO

0.5VCCtSKEW = │tDPHL – tDPLH │Figure 31. Driver Enable/Disable Timing

Figure 29. Driver Propagation Delay, Rise/Fall Timing

0.7VCC
RE

tZL

tLZ

0.3VCC
0V

0V

tRPLH

tRPHL

1.5V

RO

VOH

VOL + 0.5V

OUTPUT LOWtZHtSKEW = |tRPLH – tRPHL |

1.5V

VOL

RO

1.5V

VOH – 0.5V

0V

Figure 32. Receiver Enable/Disable Timing

Figure 30. Receiver Propagation Delay

Rev. C | Page 13 of 20

VOL

tHZ
OUTPUT HIGH

1.5V

08111-010

RxD

0.5VCC

VOH
08111-012

A–B

0.5VCCADM2582E/ADM2587E
CIRCUIT DESCRIPTIONSIGNAL ISOLATION

Table 13. Receiving (see Table 11 for Abbreviations)

The ADM2582E/ADM2587E signal isolation is implemented on
the logic side of the interface. The part achieves signal isolationby having a digital isolation section and a transceiver section(see Figure 1). Data applied to the TxD and DE pins andreferenced to logic ground (GND1) are coupled across an
isolation barrier to appear at the transceiver section referenced
to isolated ground (GND2). Similarly, the single-ended receiver
output signal, referenced to isolated ground in the transceiversection, is coupled across the isolation barrier to appear at the
RXD pin referenced to logic ground.

POWER ISOLATIONThe ADM2582E/ADM2587E power isolation is implemented
using an isoPower integrated isolated dc-to-dc converter. The
dc-to-dc converter section of the ADM2582E/ADM2587E works
on principles that are common to most modern power supplies.
It is a secondary side controller architecture with isolated pulsewidth modulation (PWM) feedback. VCC power is supplied toan oscillating circuit that switches current into a chip-scale aircore transformer. Power transferred to the secondary side isrectified and regulated to 3.3 V. The secondary (VISO) side
controller regulates the output by creating a PWM control
signal that is sent to the primary (VCC) side by a dedicatediCoupler data channel. The PWM modulates the oscillator
circuit to control the power being sent to the secondary side.
Feedback allows for significantly higher power and efficiency.

TRUTH TABLES
The truth tables in this section use the abbreviations found in
Table 11.
Table 11. Truth Table Abbreviations
LetterH
L
X
ZNC

Description
High level
Low level
Don’t careHigh impedance (off )Disconnected

Inputs
TxD
H
L
X
X

Y
H
L
Z
Z

InputsRE

OutputRxD≥ −0.03 V≤ −0.2 V−0.2 V < A − B < −0.03 V
Inputs open
X

L or NC
L or NC
L or NC
L or NC
H

H
L
X
H
Z

THERMAL SHUTDOWNThe ADM2582E/ADM2587E contain thermal shutdown circuitrythat protects the parts from excessive power dissipation during
fault conditions. Shorting the driver outputs to a low impedancesource can result in high driver currents. The thermal sensing
circuitry detects the increase in die temperature under thiscondition and disables the driver outputs. This circuitry isdesigned to disable the driver outputs when a die temperatureof 150°C is reached. As the device cools, the drivers are reenabled
at a temperature of 140°C.

OPEN- AND SHORT-CIRCUIT, FAIL-SAFE RECEIVERINPUTS
The receiver inputs have open- and short-circuit, fail-safefeatures that ensure that the receiver output is high when the
inputs are open or shorted. During line-idle conditions, when no
driver on the bus is enabled, the voltage across a terminating
resistance at the receiver input decays to 0 V. With traditionaltransceivers, receiver input thresholds specified between −200 mV
and +200 mV mean that external bias resistors are required on the
A and B pins to ensure that the receiver outputs are in a known
state. The short-circuit, fail-safe receiver input feature eliminates
the need for bias resistors by specifying the receiver input threshold
between −30 mV and −200 mV. The guaranteed negative thresholdmeans that when the voltage between A and B decays to 0 V, thereceiver output is guaranteed to be high.

DC CORRECTNESS AND MAGNETIC FIELD IMMUNITY

Table 12. Transmitting (see Table 11 for Abbreviations)
DE
H
H
L
X

A−B

Outputs
Z
L
H
Z
Z

The digital signals transmit across the isolation barrier using
iCoupler technology. This technique uses chip-scale transformer
windings to couple the digital signals magnetically from one
side of the barrier to the other. Digital inputs are encoded into
waveforms that are capable of exciting the primary transformer
winding. At the secondary winding, the induced waveforms are
decoded into the binary value that was originally transmitted.
Positive and negative logic transitions at the isolator input cause
narrow (~1 ns) pulses to be sent to the decoder via the transformer.
The decoder is bistable and is, therefore, either set or reset by thepulses, indicating input logic transitions. In the absence of logictransitions at the input for more than 1 μs, periodic sets of refresh
pulses indicative of the correct input state are sent to ensure dc
correctness at the output. If the decoder receives no internal pulsesof more than approximately 5 μs, the input side is assumed to be
Rev. C | Page 14 of 20

ADM2582E/ADM2587E
unpowered or nonfunctional, in which case, the isolator output
is forced to a default state by the watchdog timer circuit.
This situation should occur in the ADM2582E/ADM2587E devices
only during power-up and power-down operations. The limitationon the ADM2582E/ADM2587E magnetic field immunity is set
by the condition in which induced voltage in the transformer
receiving coil is sufficiently large to either falsely set or reset the
decoder. The following analysis defines the conditions underwhich this can occur.
The 3.3 V operating condition of the ADM2582E/ADM2587E
is examined because it represents the most susceptible mode ofoperation. The pulses at the transformer output have an amplitudeof >1.0 V. The decoder has a sensing threshold of about 0.5 V,
thus establishing a 0.5 V margin in which induced voltages canbe tolerated. The voltage induced across the receiving coil isgiven byV = (−dβ/dt)Σπrn2; n = 1, 2, … , N

The preceding magnetic flux density values correspondto specific current magnitudes at given distances from theADM2582E/ADM2587E transformers. Figure 34 expresses
these allowable current magnitudes as a function of frequency
for selected distances. As shown in Figure 34, the ADM2582E/
ADM2587E are extremely immune and can be affected only byextremely large currents operated at high frequency very close
to the component. For the 1 MHz example, a 0.5 kA current must
be placed 5 mm away from the ADM2582E/ADM2587E to affectcomponent operation.

100

10

DISTANCE = 1m
100

10
DISTANCE = 100mm
1
DISTANCE = 5mm
0.1

0.01

1k

10k

100k

1M

10M

100M

MAGNETIC FIELD FREQUENCY (Hz)1

Figure 34. Maximum Allowable Current for Various Current-toADM2582E/ADM2587E Spacings

Note that in combinations of strong magnetic field and highfrequency, any loops formed by printed circuit board (PCB)
traces can induce error voltages sufficiently large to trigger thethresholds of succeeding circuitry. Take care in the layout ofsuch traces to avoid this possibility.

0.1

10k
100k
10M
1M
MAGNETIC FIELD FREQUENCY (Hz)100M

08111-019

0.01

0.001
1k

08111-020

Given the geometry of the receiving coil in the ADM2582E/
ADM2587E and an imposed requirement that the induced
voltage be, at most, 50% of the 0.5 V margin at the decoder, amaximum allowable magnetic field is calculated as shown in
Figure 33.

MAXIMUM ALLOWABLE CURRENT (kA)

1kwhere:β is magnetic flux density (gauss).
N is the number of turns in the receiving coil.
rn is the radius of the nth turn in the receiving coil (cm).

MAXIMUM ALLOWABLE MAGNETIC FLUXDENSITY (kGauss)

For example, at a magnetic field frequency of 1 MHz, themaximum allowable magnetic field of 0.2 kgauss induces avoltage of 0.25 V at the receiving coil. This is about 50% of thesensing threshold and does not cause a faulty output transition.
Similarly, if such an event occurs during a transmitted pulse(and is of the worst-case polarity), it reduces the received pulse
from >1.0 V to 0.75 V, which is still well above the 0.5 V sensing
threshold of the decoder.

Figure 33. Maximum Allowable External Magnetic Flux Density

Rev. C | Page 15 of 20

ADM2582E/ADM2587E
APPLICATIONS INFORMATIONPCB LAYOUT
The ADM2582E/ADM2587E isolated RS-422/RS-485 transceivercontains an isoPower integrated dc-to-dc converter, requiringno external interface circuitry for the logic interfaces. Powersupply bypassing is required at the input and output supply pins(see Figure 35). The power supply section of the ADM2582E/
ADM2587E uses an 180 MHz oscillator frequency to pass power
efficiently through its chip-scale transformers. In addition, thenormal operation of the data section of the iCoupler introduces
switching transients on the power supply pins.
Bypass capacitors are required for several operating frequencies.
Noise suppression requires a low inductance, high frequency
capacitor, whereas ripple suppression and proper regulation
require a large value capacitor. These capacitors are connected
between Pin 1 (GND1) and Pin 2 (VCC) and Pin 8 (VCC) andPin 9 (GND1) for VCC. The VISOIN and VISOOUT capacitors areconnected between Pin 11 (GND2) and Pin 12 (VISOOUT) and
Pin 19 (VISOIN) and Pin 20 (GND2). To suppress noise and reduce
ripple, a parallel combination of at least two capacitors is requiredwith the smaller of the two capacitors located closest to the device.
The recommended capacitor values are 0.1 μF and 10 μF for
VISOOUT at Pin 11 and Pin 12 and VCC at Pin 8 and Pin 9. Capacitor
values of 0.01 μF and 0.1 μF are recommended for VISOIN at
Pin 19 and Pin 20 and VCC at Pin 1 and Pin 2. The recommended
best practice is to use a very low inductance ceramic capacitor,
or its equivalent, for the smaller value. The total lead length
between both ends of the capacitor and the input power supply
pin should not exceed 10 mm.
10nF
100nF

10nF
100nF

GND2

1

20

VCC

2

19

GND1

3

18

A

RxD

4

17

B

RE

5

16

GND2

DE

6

15

Z

TxD

7

14

GND2

VCC

8

13

Y

GND1

9

12

10

11

GND1

10µF
100nF

VISOINVISOOUT
GND2

08111-125

GND1

10µF
100nF

Figure 35. Recommended PCB Layout

In applications involving high common-mode transients, ensurethat board coupling across the isolation barrier is minimized.
Furthermore, design the board layout such that any couplingthat does occur equally affects all pins on a given component
side. Failure to ensure this can cause voltage differentials between
pins exceeding the absolute maximum ratings for the device,
thereby leading to latch-up and/or permanent damage.

The ADM2582E/ADM2587E dissipate approximately 650 mW
of power when fully loaded. Because it is not possible to apply
a heat sink to an isolation device, the devices primarily dependon heat dissipation into the PCB through the GND pins. If thedevices are used at high ambient temperatures, provide a thermal
path from the GND pins to the PCB ground plane. The board
layout in Figure 35 shows enlarged pads for Pin 1, Pin 3, Pin 9,
Pin 10, Pin 11, Pin 14, Pin 16, and Pin 20. Implement multiple
vias from the pad to the ground plane to reduce the temperatureinside the chip significantly. The dimensions of the expandedpads are at the discretion of the designer and dependent on theavailable board space.

EMI CONSIDERATIONS
The dc-to-dc converter section of the ADM2582E/ADM2587E
components must, of necessity, operate at very high frequency
to allow efficient power transfer through the small transformers.
This creates high frequency currents that can propagate in circuitboard ground and power planes, causing edge and dipole radiation.
Grounded enclosures are recommended for applications that use
these devices. If grounded enclosures are not possible, good RF
design practices should be followed in the layout of the PCB.
See Application Note AN-0971, Control of Radiated Emissions
with isoPower Devices, for more information.

INSULATION LIFETIME
All insulation structures eventually break down when subjected tovoltage stress over a sufficiently long period. The rate of insulation
degradation is dependent on the characteristics of the voltage
waveform applied across the insulation. Analog Devices conducts
an extensive set of evaluations to determine the lifetime of theinsulation structure within the ADM2582E/ADM2587E.
Accelerated life testing is performed using voltage levels higher
than the rated continuous working voltage. Acceleration factors forseveral operating conditions are determined, allowing calculationof the time to failure at the working voltage of interest. The values
shown in Table 9 summarize the peak voltages for 50 years ofservice life in several operating conditions. In many cases, theworking voltage approved by agency testing is higher than the
50-year service life voltage. Operation at working voltages higher
than the service life voltage listed leads to premature insulation
failure.
The insulation lifetime of the ADM2582E/ADM2587E depends
on the voltage waveform type imposed across the isolation barrier.
The iCoupler insulation structure degrades at different rates,
depending on whether the waveform is bipolar ac, unipolar ac,
or dc. Figure 36, Figure 37, and Figure 38 illustrate these different
isolation voltage waveforms.
Bipolar ac voltage is the most stringent environment. A 50-year
operating lifetime under the bipolar ac condition determines
the Analog Devices recommended maximum working voltage.

Rev. C | Page 16 of 20

ADM2582E/ADM2587E
In the case of unipolar ac or dc voltage, the stress on the insulation
is significantly lower. This allows operation at higher working
voltages while still achieving a 50-year service life. The working
voltages listed in Table 9 can be applied while maintaining the
50-year minimum lifetime, provided the voltage conforms to either
the unipolar ac or dc voltage cases. Any crossinsulation voltage
waveform that does not conform to Figure 37 or Figure 38 shouldbe treated as a bipolar ac waveform, and its peak voltage should
be limited to the 50-year lifetime voltage value listed in Table 9.

ISOLATED POWER SUPPLY CONSIDERATIONS
The typical output voltage of the integrated isoPower dc-to-dc
isolated supply is 3.3 V. The isolated supply in the ADM2587E
is capable of supplying a current of 55 mA when the junction
temperature of the device is kept below 120°C. It is important
to note that the current available on the VISOOUT pin is the total
current available and includes the current required to supply theinternal RS-485 circuitry.
The ADM2587E can typically supply 15 mA externally on
VISOOUT when the driver is switching at 500 kbps loaded with 54 Ω,
while the junction temperature of the part is less than 120°C.

08111-021

RATED PEAK VOLTAGE
0V

Table 14. Typical Maximum External Current Available
on VISOOUT

Figure 36. Bipolar AC Waveform

08111-023

RATED PEAK VOLTAGE

0V

Figure 37. DC Waveform
RATED PEAK VOLTAGE

RT
54 Ω

29
46

120 Ω
Unloaded

System Configuration
Double terminatedbus with RT = 110 Ω
Single terminated bus
Unterminated bus

The ADM2582E typically has no current available externallyon VISOOUT.
When external current is drawn from the VISOOUT pin, there isan increased risk of generating radiated emissions due to thehigh frequency switching elements used in the isoPower dc todc converter. Special care must be taken during PCB layout tomeet emissions standards. See Application Note AN-0971,
Control of Radiated Emissions with isoPower Devices, for details
on board layout considerations.

08111-022

0V
NOTES
1. THE VOLTAGE IS SHOWN AS SINUSODIAL FOR ILLUSTRATIONPURPOSES ONLY. IT IS MEANT TO REPRESENT ANY VOLTAGE
WAVEFORM VARYING BETWEEN 0 AND SOME LIMITING VALUE.
THE LIMITING VALUE CAN BE POSITIVE OR NEGATIVE, BUT THE
VOLTAGE CANNOT CROSS 0V.

External Load Current (mA)
15

Figure 38. Unipolar AC Waveform

VCC
EXTERNALLOAD

VISOOUT

VCC
isoPower DC-TO-DC CONVERTERGND1OSCILLATORGNDRECTIFIERGND2VISOINREGULATOR

TRANSCEIVER

DIGITAL ISOLATION iCoupler

Y

TxD

500kbps

ENCODEDECODEENCODEDECODEDECODEENCODE

D

Z

VCC
DE

RT

A
R

B

ADM2582E/ADM2587E

RE

GND1

ISOLATIONBARRIER

GND2

Figure 39. ADM2587E Typical Maximum External Current Measurements
Rev. C | Page 17 of 20

08111-038

RxD

ADM2582E/ADM2587E
TYPICAL APPLICATIONS
Figure 41 and Figure 42 show typical applications of the
ADM2582E/ADM2587E in half duplex and full duplex RS-485
network configurations. Up to 256 transceivers can be connected to
the RS-485 bus. To minimize reflections, terminate the line at thereceiving end in its characteristic impedance and keep stub lengths
off the main line as short as possible. For half-duplex operation, thismeans that both ends of the line must be terminated because either
end can be the receiving end.

An example application of the ADM2582E/ADM2587E for a fullduplex RS-485 node is shown in the circuit diagram of Figure 40.
Refer to the PCB Layout section for the recommended placementof the capacitors shown in this circuit diagram. Placement of the RT
termination resistors depends on the location of the node and the
network configuration. Refer to Application Note AN-960, RS-485/
RS-422 Circuit Implementation Guide, for guidance on termination.

3.3V/5V POWER
SUPPLY

100nF

10µF

100nF

10nF

VCC

VCC

VISOOUT

100nF

10µF

isoPower DC-TO-DC CONVERTEROSCILLATORRECTIFIERVISOIN
100nF

REGULATORDIGITAL ISOLATION iCoupler

TxD

DE

ENCODEDECODEENCODEDECODEDECODEENCODE

D

Y
Z

A

RxD

RE

R

B

RT

ADM2582E/ADM2587E
GND1

ISOLATIONBARRIER

GND2

GND1

Figure 40. Example Circuit Diagram Using the ADM2582E/ADM2587E

Rev. C | Page 18 of 20

08111-124

MICROCONTROLLER
AND UART

TRANSCEIVER

10nF

ADM2582E/ADM2587E
MAXIMUM NUMBER OF TRANSCEIVERS ON BUS = 256

ADM2582E/
ADM2587E
RxD

R

A

A

B

B

RE

RE

Z
D

RxD

R

RT

RT

DE
TxD

ADM2582E/
ADM2587E

DE

Z

Y

Y
A

B

ADM2582E/
ADM2587E

R

Z

Y

A

D

RxD REB

ADM2582E/
ADM2587E

DE TxD

R

Z

D

TxD

D

TxD

Y

D

RxD REDE TxD
08111-027

NOTES
1. RT IS EQUAL TO THE CHARACTERISTIC IMPEDANCE OF THE CABLE.
2. ISOLATION NOT SHOWN.

Figure 41. ADM2582E/ADM2587E Typical Half Duplex RS-485 Network

MAXIMUM NUMBER OF NODES = 256

MASTER

SLAVE

A
R

RxD

B

Y

RT

Z

RE

DE
Z
D

RT

Y

A

ADM2582E/
ADM2587E

RE
R

RxD

ADM2582E/
ADM2587E
A

B

Z

Y

A

B

Z

Y

SLAVE

SLAVE

R

ADM2582E/
ADM2587E
RxD RERD

DE TxDRxD RED

ADM2582E/
ADM2587E

DE TxD

NOTES
1. RT IS EQUAL TO THE CHARACTERISTIC IMPEDANCE OF THE CABLE.
2. ISOLATION NOT SHOWN.

Figure 42. ADM2582E/ADM2587E Typical Full Duplex RS-485 Network

Rev. C | Page 19 of 20

08111-028

DE
TxD

B

ADM2582E/ADM2587E
OUTLINE DIMENSIONS
13.00 (0.5118)
12.60 (0.4961)

1120

7.60 (0.2992)
7.40 (0.2913)
10

2.65 (0.1043)
2.35 (0.0925)

0.30 (0.0118)
0.10 (0.0039)
COPLANARITY
0.10

10.65 (0.4193)
10.00 (0.3937)

1.27(0.0500)
BSC

0.51 (0.0201)
0.31 (0.0122)

SEATING
PLANE

0.75 (0.0295)
45°
0.25 (0.0098)
8°0°0.33 (0.0130)
0.20 (0.0079)

COMPLIANT TO JEDEC STANDARDS MS-013-AC
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FORREFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

1.27 (0.0500)
0.40 (0.0157)

06-07-2006-A

1

Figure 43. 20-Lead Standard Small Outline Package [SOIC_W]
Wide Body(RW-20)Dimensions shown in millimeters and (inches)

ORDERING GUIDE
Model 1
ADM2582EBRWZ
ADM2582EBRWZ-REEL7
ADM2587EBRWZ
ADM2587EBRWZ-REEL7
EVAL-ADM2582EEBZEVAL-ADM2587EEBZ
1Data Rate (Mbps)
16
16
0.5
0.5

Temperature Range−40°C to +85°C−40°C to +85°C−40°C to +85°C−40°C to +85°C

Z = RoHS Compliant Part.

©2009–2011 Analog Devices, Inc. All rights reserved. Trademarks andregistered trademarks are the property of their respective owners.
D08111-0-6/11(C)Rev. C | Page 20 of 20

Package Description
20-Lead SOIC_W
20-Lead SOIC_W
20-Lead SOIC_W
20-Lead SOIC_W
ADM2582E Evaluation Board
ADM2587E Evaluation Board

Package Option
RW-20
RW-20
RW-20
RW-20