User's Manual

16

RL78/G22
Renesas Solution Starter Kit
Capacitive Touch Evaluation System
User’s Manual
16-bit Single Chip Microcontrollers

All information contained in these materials, including products and product specifications,represents information on the product at the time of publication and is subject to change byRenesas Electronics Corp. without notice. Please review the latest information published byRenesas Electronics Corp. through various means, including the Renesas Electronics Corp.
website (http://www.renesas.com).

www.renesas.com

Rev.1.10

Apr 2024

Notice1.

Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products
and application examples. You are fully responsible for the incorporation or any other use of the circuits, software, and information in the design of yourproduct or system. Renesas Electronics disclaims any and all liability for any losses and damages incurred by you or third parties arising from the use of
these circuits, software, or information.
2. Renesas Electronics hereby expressly disclaims any warranties against and liability for infringement or any other claims involving patents, copyrights, orother intellectual property rights of third parties, by or arising from the use of Renesas Electronics products or technical information described in thisdocument, including but not limited to, the product data, drawings, charts, programs, algorithms, and application examples.
3. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics orothers.
4. You shall be responsible for determining what licenses are required from any third parties, and obtaining such licenses for the lawful import, export,
manufacture, sales, utilization, distribution or other disposal of any products incorporating Renesas Electronics products, if required.
5. You shall not alter, modify, copy, or reverse engineer any Renesas Electronics product, whether in whole or in part. Renesas Electronics disclaims any
and all liability for any losses or damages incurred by you or third parties arising from such alteration, modification, copying or reverse engineering.
6. Renesas Electronics products are classified according to the following two quality grades: “Standard” and “High Quality”. The intended applications foreach Renesas Electronics product depends on the product’s quality grade, as indicated below.
"Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; homeelectronic appliances; machine tools; personal electronic equipment; industrial robots; etc.
"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control (traffic lights); large-scale communication equipment; key
financial terminal systems; safety control equipment; etc.
Unless expressly designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas
Electronics document, Renesas Electronics products are not intended or authorized for use in products or systems that may pose a direct threat tohuman life or bodily injury (artificial life support devices or systems; surgical implantations; etc.), or may cause serious property damage (space system;
undersea repeaters; nuclear power control systems; aircraft control systems; key plant systems; military equipment; etc.). Renesas Electronics disclaims
any and all liability for any damages or losses incurred by you or any third parties arising from the use of any Renesas Electronics product that isinconsistent with any Renesas Electronics data sheet, user’s manual or other Renesas Electronics document.
7. No semiconductor product is absolutely secure. Notwithstanding any security measures or features that may be implemented in Renesas Electronics
hardware or software products, Renesas Electronics shall have absolutely no liability arising out of any vulnerability or security breach, including but notlimited to any unauthorized access to or use of a Renesas Electronics product or a system that uses a Renesas Electronics product. RENESASELECTRONICS DOES NOT WARRANT OR GUARANTEE THAT RENESAS ELECTRONICS PRODUCTS, OR ANY SYSTEMS CREATED USINGRENESAS ELECTRONICS PRODUCTS WILL BE INVULNERABLE OR FREE FROM CORRUPTION, ATTACK, VIRUSES, INTERFERENCE,
HACKING, DATA LOSS OR THEFT, OR OTHER SECURITY INTRUSION (“Vulnerability Issues”). RENESAS ELECTRONICS DISCLAIMS ANY AND
ALL RESPONSIBILITY OR LIABILITY ARISING FROM OR RELATED TO ANY VULNERABILITY ISSUES. FURTHERMORE, TO THE EXTENTPERMITTED BY APPLICABLE LAW, RENESAS ELECTRONICS DISCLAIMS ANY AND ALL WARRANTIES, EXPRESS OR IMPLIED, WITHRESPECT TO THIS DOCUMENT AND ANY RELATED OR ACCOMPANYING SOFTWARE OR HARDWARE, INCLUDING BUT NOT LIMITED TO THE
IMPLIED WARRANTIES OF MERCHANTABILITY, OR FITNESS FOR A PARTICULAR PURPOSE.
8. When using Renesas Electronics products, refer to the latest product information (data sheets, user’s manuals, application notes, “General Notes for
Handling and Using Semiconductor Devices” in the reliability handbook, etc.), and ensure that usage conditions are within the ranges specified byRenesas Electronics with respect to maximum ratings, operating power supply voltage range, heat dissipation characteristics, installation, etc. Renesas
Electronics disclaims any and all liability for any malfunctions, failure or accident arising out of the use of Renesas Electronics products outside of suchspecified ranges.
9. Although Renesas Electronics endeavors to improve the quality and reliability of Renesas Electronics products, semiconductor products have specificcharacteristics, such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Unless designated as a high reliability
product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics products
are not subject to radiation resistance design. You are responsible for implementing safety measures to guard against the possibility of bodily injury,
injury or damage caused by fire, and/or danger to the public in the event of a failure or malfunction of Renesas Electronics products, such as safety
design for hardware and software, including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging
degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult and impractical, you areresponsible for evaluating the safety of the final products or systems manufactured by you.
10. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas
Electronics product. You are responsible for carefully and sufficiently investigating applicable laws and regulations that regulate the inclusion or use ofcontrolled substances, including without limitation, the EU RoHS Directive, and using Renesas Electronics products in compliance with all theseapplicable laws and regulations. Renesas Electronics disclaims any and all liability for damages or losses occurring as a result of your noncompliancewith applicable laws and regulations.
11. Renesas Electronics products and technologies shall not be used for or incorporated into any products or systems whose manufacture, use, or sale isprohibited under any applicable domestic or foreign laws or regulations. You shall comply with any applicable export control laws and regulations
promulgated and administered by the governments of any countries asserting jurisdiction over the parties or transactions.
12. It is the responsibility of the buyer or distributor of Renesas Electronics products, or any other party who distributes, disposes of, or otherwise sells ortransfers the product to a third party, to notify such third party in advance of the contents and conditions set forth in this document.
13. This document shall not be reprinted, reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics.
14. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas
Electronics products.
(Note1)(Note2)“Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly controlledsubsidiaries.
“Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
(Rev.5.0-1 October 2020)

Corporate Headquarters

Contact information

TOYOSU FORESIA, 3-2-24 Toyosu,
Koto-ku, Tokyo 135-0061, JapanFor further information on a product, technology, the most up-to-dateversion of a document, or your nearest sales office, please visit:www.renesas.com/contact/.

www.renesas.com

Trademarks
Renesas and the Renesas logo are trademarks of Renesas
Electronics Corporation. All trademarks and registered trademarks
are the property of their respective owners.

© 2024 Renesas Electronics Corporation. All rights reserved.

General Precautions in the Handling of Microprocessing Unit and Microcontroller
Unit Products
The following usage notes are applicable to all Microprocessing unit and Microcontroller unit products from Renesas. For detailed usage notes on the
products covered by this document, refer to the relevant sections of the document as well as any technical updates that have been issued for the products.
1.

Precaution against Electrostatic Discharge (ESD)
A strong electrical field, when exposed to a CMOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps
must be taken to stop the generation of static electricity as much as possible, and quickly dissipate it when it occurs. Environmental control must be
adequate. When it is dry, a humidifier should be used. This is recommended to avoid using insulators that can easily build up static electricity.
Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work benches and floors must be grounded. The operator must also be grounded using a wrist strap. Semiconductor devices must not betouched with bare hands. Similar precautions must be taken for printed circuit boards with mounted semiconductor devices.

2.

Processing at power-on
The state of the product is undefined at the time when power is supplied. The states of internal circuits in the LSI are indeterminate and the states ofregister settings and pins are undefined at the time when power is supplied. In a finished product where the reset signal is applied to the external resetpin, the states of pins are not guaranteed from the time when power is supplied until the reset process is completed. In a similar way, the states of pins in
a product that is reset by an on-chip power-on reset function are not guaranteed from the time when power is supplied until the power reaches the levelat which resetting is specified.

3.

Input of signal during power-off state
Do not input signals or an I/O pull-up power supply while the device is powered off. The current injection that results from input of such a signal or I/O
pull-up power supply may cause malfunction and the abnormal current that passes in the device at this time may cause degradation of internal elements.
Follow the guideline for input signal during power-off state as described in your product documentation.

4.

Handling of unused pins
Handle unused pins in accordance with the directions given under handling of unused pins in the manual. The input pins of CMOS products are
generally in the high-impedance state. In operation with an unused pin in the open-circuit state, extra electromagnetic noise is induced in the vicinity of
the LSI, an associated shoot-through current flows internally, and malfunctions occur due to the false recognition of the pin state as an input signal
become possible.

5.

Clock signals
After applying a reset, only release the reset line after the operating clock signal becomes stable. When switching the clock signal during program
execution, wait until the target clock signal is stabilized. When the clock signal is generated with an external resonator or from an external oscillator
during a reset, ensure that the reset line is only released after full stabilization of the clock signal. Additionally, when switching to a clock signal producedwith an external resonator or by an external oscillator while program execution is in progress, wait until the target clock signal is stable.

6.

Voltage application waveform at input pin
Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the CMOS device stays in the area between VIL (Max.)and VIH (Min.) due to noise, for example, the device may malfunction. Take care to prevent chattering noise from entering the device when the input levelis fixed, and also in the transition period when the input level passes through the area between VIL (Max.) and VIH (Min.).

7.

Prohibition of access to reserved addresses
Access to reserved addresses is prohibited. The reserved addresses are provided for possible future expansion of functions. Do not access theseaddresses as the correct operation of the LSI is not guaranteed.

8.

Differences between products
Before changing from one product to another, for example to a product with a different part number, confirm that the change will not lead to problems.
The characteristics of a microprocessing unit or microcontroller unit products in the same group but having a different part number might differ in terms ofinternal memory capacity, layout pattern, and other factors, which can affect the ranges of electrical characteristics, such as characteristic values,
operating margins, immunity to noise, and amount of radiated noise. When changing to a product with a different part number, implement a systemevaluation test for the given product.

How to Use This Manual
1. Purpose and Target ReadersThis is a manual for users to understand the outline and hardware functions of the RL78/G22 Capacitive
Touch Evaluation System (RTK0EG0042S01001BJ). This manual is intended for users who use this CPU
board. A basic knowledge of electric circuits, logical circuits, and MCUs is necessary in order to use thismanual.
Particular attention should be paid to the precautionary notes when using the manual. These notes occur within
the body of the text, at the end of each section, and in the Usage Notes section.

The revision history summarizes the locations of revisions and additions. It does not list all revisions. Refer to thetext of the manual for details.

Renesas RTK0EG0042S01001BJ Disclaimer
By using this RTK0EG0042S01001BJ, the User accepts the following terms, which are in addition to, and control in the event of disagreement, with Renesas’
General Terms and Conditions available at https://www.renesas.com/en-us/legal/disclaimer.html.
The RTK0EG0042S01001BJ is not guaranteed to be error free, and the entire risk as to the results and performance of the RTK0EG0042S01001BJ is
assumed by the User. The RTK0EG0042S01001BJ is provided by Renesas on an “as is” basis without warranty of any kind whether express or implied,
including but not limited to the implied warranties of good workmanship, fitness for a particular purpose, title, merchantability, and non-infringement ofintellectual property rights. Renesas expressly disclaims any implied warranty.
Renesas does not consider the RTK0EG0042S01001BJ to be a finished product and therefore the RTK0EG0042S01001BJ may not comply with somerequirements applicable to finished products, including, but not limited to recycling, restricted substances and electromagnetic compatibility regulations.
Refer to Certifications section, for information about certifications and compliance information for the RTK0EG0042S01001BJ. It is the kit User’s responsibility
to make sure the kit meets any local requirements applicable to their region.
Renesas or its affiliates shall in no event be liable for any loss of profit, loss of data, loss of contract, loss of business, damage to reputation or goodwill, any
economic loss, any reprogramming or recall costs (whether the foregoing losses are direct or indirect) nor shall Renesas or its affiliates be liable for any otherdirect or indirect special, incidental or consequential damages arising out of or in relation to the use of this RTK0EG0042S01001BJ, even if Renesas or its
affiliates have been advised of the possibility of such damages.
Renesas has used reasonable care in preparing the information included in this document, but Renesas does not warrant that such information is error free
nor does Renesas guarantee an exact match for every application or parameter to part numbers designated by other vendors listed herein. The information
provided in this document is intended solely to enable the use of Renesas products. No express or implied license to any intellectual property right is grantedby this document or in connection with the sale of Renesas products. Renesas reserves the right to make changes to specifications and product descriptionsat any time without notice. Renesas assumes no liability for any damages incurred by you resulting from errors in or omissions from the information included
herein. Renesas cannot verify, and assumes no liability for, the accuracy of information available on another company’s website.

Precautions
This Evaluation Kit is only intended for use in a laboratory environment under ambient temperature and humidity conditions. A safe separation distanceshould be used between this and any sensitive equipment. Its use outside the laboratory, classroom, study area, or similar such area invalidates conformity
with the protection requirements of the Electromagnetic Compatibility Directive and could lead to prosecution.
The product generates, uses, and can radiate radio frequency energy and may cause harmful interference to radio communications. There is no guaranteethat interference will not occur in a particular installation. If this equipment causes harmful interference to radio or television reception, which can be
determined by turning the equipment off or on, you are encouraged to try to correct the interference by one or more of the following measures:• Ensure attached cables do not lie across the equipment.
• Reorient the receiving antenna.
• Increase the distance between the equipment and the receiver.
• Connect the equipment into an outlet on a circuit different from that which the receiver is connected.
• Power down the equipment when not in use.
• Consult the dealer or an experienced radio/TV technician for help.
Note: It is recommended that wherever possible shielded interface cables are used.
The product is potentially susceptible to certain EMC phenomena. To mitigate against them it is recommended that the following measures be undertaken:• The user is advised that mobile phones should not be used within 10 m of the product when in use.
• The user is advised to take ESD precautions when handling the equipment.
The Evaluation Kit does not represent an ideal reference design for an end product and does not fulfill the regulatory standards for an end product.

Safety Items
Definitions of Symbols
A variety of symbols are used in this document and on the product itself to prevent in advance danger toyou the user or any third parties and to prevent in advance damage to any physical property.
This section, Safety Items, presents these symbols and their meanings. It also presents safety notes toassure that this produce is used safely and correctly.
This product should only be used after fully understanding the material presented in this section.

Warning
CautionWarning items indicate things that, if not avoided, could lead to death orserious injury.
Caution items indicate both latent dangers that can lead to minor or moderately
severe injury and latent dangers that can lead to property damage if not
avoided.

In addition to the above two markings, the following are displayed at the same time if appropriate.
[Important] Indicates a point that can lead to equipment failure or malfunction if incorrectly set when setting
up this product.
A triangular mark △ indicates a warning or caution.
Example:The

Electrical Shock Hazard

mark indicates something that is forbidden.
Example:：Do Not Disassemble

Warning

Warning

Handling related warnings:
Do not disassemble or modify this product. Renesas does not guarantee this product if it
has been disassembled or modified.
The power supply for this product can be selected to be either the USB bus or a DC jack. A
jumper is used to select the power supply.
If, during either use or storage of this product, any abnormality in the product itself(including abnormal odors, heating, color changes, or shape changes to the product itself)
are observed, disconnect the USB cable and power supply cable immediately.
Installation:
Do not install this equipment in a location that has a high humidity or where water or otherfluids could get on it. This equipment may be damaged if water or other fluids could geton it.
Ambient temperature:
The upper limit for the ambient temperature under which this product may be used is
35°C.
This maximum rated ambient temperature must not be exceeded.

Caution

CautionHandling related cautions:
Use the antistatic band. Failure to do so could cause malfunction or unstable motion or bedamaged Internal components.
This product must be handled carefully. Do not drop, knock over, or apply any strong
mechanical shocks to this product.
When connecting or disconnecting cables from this product, hold the parts of the cableintended to be grasped (such as the plugs) and avoid putting stress on the cable. Do notpull on this product when it is connected to a communications cable or user system
connection cable. Stress on the cable can result in internal disconnections in the cable.
When connecting a cable to a connector, be careful not to insert the plug in the reverse
orientation. Reverse insertion can result in damage to this product itself or to connected
equipment.
The power supply for this product can be selected from two options (the DC jack or theUSB cable). The jumper JP1 (on the top side of the circuit board) is used to select thepower supply. Always check the jumper position before connecting a power source. An
incorrect jumper position can result in damage to this product or the PC connected over
the USB cable.
Do not handle this product with wet hands. This can lead to failure of the product.
Transport methods:
When transporting this product, use the product’s packing box and cushioning materials andship it with precision equipment handling. If the products packing is insufficient, it may bedamaged during shipping.
If it must be transported by some other method, pack it carefully as precision equipment.
When packing this product, always use the antistatic pouch included with this product.
If some other pouch is used, damage to the product may be caused by electrostatic
discharge.
Abnormal operation:
If operation of this product becomes abnormal due to interference from, for example,
external noise, apply the following procedure.
1. Turn off the power.
2. Wait 10 seconds and then turn the power back on.
Disposal:
When disposing of this product, handle it as industrial waste according to all applicablelaws.
European Union regulatory notices:

The WEEE （Waste Electrical and Electronic Equipment） regulations put
responsibilities on producers for the collection and recycling or disposal of electrical andelectronic waste. Return of WEEE under these regulations is applicable in the European
Union only. This equipment （including all accessories） is not intended for householduse. After use the equipment cannot be disposed of as household waste, and the WEEE
must be treated, recycled and disposed of in an environmentally sound manner. Renesas
Electronics Europe GmbH can take back end of life equipment, register for this service at“http://www.renesas.eu/weee”.

Electromagnetic Environment

Electromagnetic Environment
 This product generates electromagnetic emissions in an industrial environment. Use in a
residential environment may affect other equipment.
 This product requires special EMC precautions and should be used in accordance with the EMC
information provided below.

EMI: Electro Magnetic InterferenceStandard

Level

Guidance for EMC protection

Group1 Class A

This product has no intentional
external emissions, but internal
RF emissions may affect nearby
electromagnetically sensitiveelectronic equipment.

Test Item
EN 55011:2016/A1:2017/A2:2021

Radiated Emissions
Conducted Emissions

EMS: Electro Magnetic Susceptibility
Standard

Level

Radio Frequency
Electromagnetic Field

EN 61000-4-3:
2006/A1:2008/A2:2010

A*1

Electrical Fast Transient / Burst

EN 61000-4-4:2012

B*2

Surge

EN 61000-4-5:2014/A1:2017

B*3

Conducted Disturbance,
Induced by Radio Frequency

EN 61000-4-6:2014

A

Power Frequency
Magnetic Field

EN 61000-4-8:2010

A*5

Voltage Dips and Interruptions

EN IEC 61000-4-11:2020*4

B or C*6

Guidance for EMC protection

This product is intended for use inelectromagnetic environments inindustrial settings. The user of the
product should pay particularattention to the following
electromagnetic immunity.
・Power supply quality
・Protection against static electricity
・Protection against external highpower radio waves
・Protection against external
magnetic fields

*1

Test Condition of Radio Frequency Electromagnetic Field
Test Level
3V/m (80MHz - 1.0GHz)
3V/m (1.4GHz – 6.0GHz)

*2

*3

*4

*5

Modulation

Frequency
Step

Antenna
Polarization

1.0sec1kHz
AM 80%

1.0%

Horizontal/ Vertical

Test Condition of Electrical Fast Transient / Burst
Test Level

Wave Form±1.0kV

Rise time: 5.0nsec
Pulse Duration: 50nsec

Repetition
Frequency
5kHz

Testing
Duration
60sec

100kHzResultPass
Pass

Result
Pass
Pass

Test Condition of Surge
Test Level

Wave form Specification

Phase Angle±0.5kV

Front time: 1.2 / 8.0 μsec
Time to half value: 50 / 20 μsec

0º, 90º,180º, 270º

Test condition of Conducted Disturbance, Induced by Radio Frequency
Test Level

Dwell Time

Modulation

3V (0.15MHz – 80MHz)

1.0 sec

1kHz
AM 80%

ResultPass
Pass

Frequency
Step

Result

1.0%

Pass

Test Condition of Power Frequency Magnetic Field
Test Level

Applied Power Frequency
50Hz

3A/m (rms)*6

Dwell Time

60Hz

Test Duration
60sec

Result
Pass
Pass

Test Condition of Voltage Dips and Interruptions
Test Item

Voltage Dips

Voltage
Interruptions

Test Level
0%

Duration

Phase Angle

0.5 cycles
1.0 cycles

70%

25 cycles0%

250 cycles

ResultPass

0º, 180º

Pass
Pass
Pass

Table of Contents
1.

Purpose and Target Readers........................................................................................ 2

1. Overview............................................................................................................................ 1
1.1
1.2
1.3
1.4

Purpose................................................................................................................................................1
Main Characteristics and Functions ......................................................................................................1
Board Specifications .............................................................................................................................2
Regulatory Compliance Notices ............................................................................................................3
1.4.1
European Union regulatory notices ..............................................................................................3

2. CPU Board......................................................................................................................... 4
2.1
2.2
2.3

System Block Diagram .........................................................................................................................4
Product Configuration ...........................................................................................................................5
Hardware Details ..................................................................................................................................6
2.3.1
Default Jumper Settings ..............................................................................................................6
2.3.2
Power Supply ..............................................................................................................................7
2.3.3
Clock Circuit ................................................................................................................................8
2.3.4
Reset Circuit ...............................................................................................................................9
2.3.5
Push Switch & LEDs ...................................................................................................................92.3.6
USB Serial Conversion ..............................................................................................................10
2.3.7
Debug Interface.........................................................................................................................11
2.3.8
Application Header ....................................................................................................................122.3.9
CTSU Related Circuits ..............................................................................................................13

3. Application Board (Self-Capacitance Electrode Board) ................................................... 14
3.1
3.2

Board Layout ......................................................................................................................................14
Application Headers ...........................................................................................................................14

4. Reference Materials......................................................................................................... 16
5. Additional Information ...................................................................................................... 17
Appendix: Self-Capacitance Touch Electrode Board Connection ........................................ 18

RL78/G22
Capacitive Touch Evaluation System User’s Manual

1.

Overview

1.1

PurposeThe RL78/G22 Capacitive Touch Evaluation System (RTK0EG0042S01001BJ) is a kit created for evaluating
the Renesas Electronics RL78/G22 of MCUs. This manual describes the RL78/G22 Cap Touch Evaluation
System’s hardware.

1.2

Main Characteristics and Functions

The main functions of the RL78/G22 Capacitive Touch Evaluation System are as follows:•

Renesas Microcontroller programming and debugging
 E2/E2 Lite debugger connector•

General purpose switches and LEDs
Capacitive Touch Sensor (CTSU2La)
 29channels available
Connects to Renesas Capacitive Touch Evaluation System Application Board (option)
 Includes self-capacitance touch electrode application board••

R12UZ0110EJ0110
Apr.26.24

Rev.1.10

Page 1 of 19

RL78/G22
Capacitive Touch Evaluation System User’s Manual

1.3

1.

Overview

Board Specifications

Table 1-1.

CPU Board Specifications
Item

Specifications

Board part No

RTK0EG0041C01001BJ

MCU

Model No.: R7F102GGE2DFB
Package: 48pin LFQFP
On-chip memory: ROM 64KB, RAM 4KB, Data Flash 2KB
High-speed on-chip oscillator (fIH): 32MHz

External resonator connection

Main clock: 20MHz (option)
Sub clock: 32.768KHz (option)

Power supply

Operation voltage: 5.0 to 3.3V
• DC jack (2.1mm Center Positive): 5.0 to 3.3V input• USB bus powered (VBUS): 5V

Debug interface

Renesas Electronics E2/E2 Lite 14-pin box header

Slide switch

CTSU temperature compensation circuit selection: 1 pole x 1
Board function selection：2pole×3

Push switches

Reset switch: x 1
User switches: x 2

LEDs

Power status: red x 1
User LEDs: green x 1, yellow x 1

USB serial conversion interface

Connector: USB Micro B
Driver: FT234XD USB serial IC manufactured by FTDI

Application board interface (GPIO)

2.54mm pitch, 16 pins x 1 (CN1)

Application board interface (CTSU)

2.54mm pitch, 40 pins x 1 (CN2)Current consumption

500mA or less (Total with all interfaces in use)

Operating Temperature Range

When operating: 10 to 35˚C, in storage: -10 to 50˚C (no condensation)

Board dimensions (L x W x H)

89mm x 95mm x 18mm (including connectors)

Table 1-2.

Application Board Specifications
Item

Specifications

Board part No

RTK0EG0019B01002BJ

Self-capacitance detection touchelectrodes

Buttons: 3
Wheel (4-electrode configuration): 1
Sliders (5-electrode configuration): 1

Touch electrode shields

Button, wheel, and slider areas: 1 shield each

LEDs

16

Renesas MCU Cap Touch CPU
board interface

2.54mm pitch, 16 pins x 1 (CN1)
2.54mm pitch, 40 pins x 1 (CN2)Overlay panel

2mm-thick acrylic panel

Current consumption

500mA or less

Operating Temperature Range

When operating: 10 to 35˚C, in storage: -10 to 50˚C (no condensation)

Board dimensions (L x W x H)

110mm x 116mm x 11mm (including connectors)

R12UZ0110EJ0110
Apr.26.24

Rev.1.10

Page 2 of 19

RL78/G22
Capacitive Touch Evaluation System User’s Manual

1.4

1.

Overview

Regulatory Compliance Notices
1.4.1

European Union regulatory notices

This product complies with the following EU Directives. (These directives are only valid in the European Union.)

CE Certifications:・ Electromagnetic Compatibility (EMC) Directive 2014/30/EU
EN IEC 61326-1: 2021 Group1 Class A
WARNING:

This is a Class A product. This equipment can cause radio frequency noise when used in theresidential area. In such cases, the user/operator of the equipment may be required to takeappropriate countermeasures under his responsibility.

・ Information for traceability
・ Authorised representative
Name:
Renesas Electronics Corporation
Address: Toyosu Foresia, 3-2-24, Toyosu, Koto-ku, Tokyo 135-0061, Japan・ Manufacturer
Name:
Renesas Electronics Corporation
Address: Toyosu Foresia, 3-2-24, Toyosu, Koto-ku, Tokyo 135-0061, Japan・ Person responsible for placing on the market
Name:Renesas Electronics Europe GmbH
Address: Arcadiastrasse 10, 40472 Dusseldorf, Germany
・ Trademark and Type nameTrademark:Renesas
Product name: RL78/G22 Capacitive Touch Evaluation System
Type name:
RTK0EG0042S01001BJ
Environmental Compliance and Certifications:・ Waste Electrical and Electronic Equipment (WEEE) Directive 2012/19/EU

R12UZ0110EJ0110
Apr.26.24

Rev.1.10

Page 3 of 19

RL78/G22
Capacitive Touch Evaluation System User’s Manual

2.

CPU Board

2.1

System Block Diagram

2.

CPU Board

Figure 2-1 shows the system block diagram of the CPU board.

Figure 2-1. System Block Diagram

R12UZ0110EJ0110
Apr.26.24

Rev.1.10

Page 4 of 19

RL78/G22
Capacitive Touch Evaluation System User’s Manual

2.2

2.

CPU Board

Product Configuration

Figure 2-2 shows the parts location. Figure 2-3 shows the board dimensions.

Figure 2-2. Parts Location

Figure 2-3. Board Dimensions
R12UZ0110EJ0110
Apr.26.24

Rev.1.10

Page 5 of 19

RL78/G22
Capacitive Touch Evaluation System User’s Manual

2.3

Hardware Details

2.3.1

Default Jumper Settings

2.

CPU Board

Figure 2-4. shows the default positions of the jumpers.Table 2-1 lists the default jumper settings.

JP1

SW4

SW5
SW6

SW1
(RESET)

SW7

Figure 2-4. Default Jumper Positions
Table 2-1.

Default Jumper Settings

Reference

Circuit Group

Default State

Description

JP1

Power supply

Shorted Pin 1-2

Supplies USB power to board USB

SW4

USB Serial Conversion /Application Header (CN2)OFF

Uses P00/TS26/TxD1 and P01/TS27/RxD1
as serial communication pins.

SW5

Clock Circuit / Application
Header (CN1)

OFF

Uses P121/X1 and P122/X2 as GPIO
(CN1) pins.

SW6

Push Switch & LED /OFF

Uses P61 and P62 as GPIO (CN1) pins.

OFF

Sets TS01 as normal CTSU pin.

Application Header (CN1)SW7

Capacitive Touch

R12UZ0110EJ0110
Apr.26.24

Rev.1.10

Page 6 of 19

RL78/G22
Capacitive Touch Evaluation System User’s Manual
2.3.2

2.

CPU Board

Power Supply

Table 2-2 provides the power supply jumper settings. This CPU board can be supplied with 5V power by USB
or a 2.1mm center positive DC barrel jack connector.
Table 2-2.

Power Source Jumper Settings

Reference

Jumper Setting

JP1

Shorted Pins 1-2

Default
Setting (X)Description

X

Supplies USB power source to board power.

Shorted Pins 2-3
JP2 / PAD1

Shorted Pins 1-2

Supplies DC jack (CN5) to board power source.
X

Supplies board power source to MCU.

OpenMCU current consumption measurement setting

Figure 2-5 shows the power source system diagram.

Power Supply
SelectorUSB
micro BDC Jack

VBUS(5V)

JP1

Board Power
JP2/PAD1
VDD

RL78/G22

3.3V – 5.0V
CN1
USB-Serial IC
and other ICs[Legends]： Power Supply
Direction： Jumper(Shorted)： Jumper(Open)

E2/E2Lite
Connector

Figure 2-5. Power Source System Diagram

R12UZ0110EJ0110
Apr.26.24

Rev.1.10

Page 7 of 19

RL78/G22
Capacitive Touch Evaluation System User’s Manual
2.3.3

2.

CPU Board

Clock Circuit

Table 2-3 lists the clock specifications of the CPU board. Figure 2-6 shows the clock circuit.
Table 2-3.

Clock Specifications

Clock

Function

Default State

Frequency

Package

X1

Main clock(crystal resonator)

Not mounted

20MHz

HC-49/S

X2

Sub clockNot mounted

32.768kHz

3.2mm x 2.5mm SMD

Table 2-4 lists the switch specifications for board function selection switch (SW5). P121/X1 and P122/X2 of
RL78/G22 are connected to the clock circuit or CN1 by slide switch SW5.
Table 2-4.

Switch Specifications for Board Function Selection Switch Setting（SW5）

Reference

Position

Default

Function

Setting (X)
SW5

OFF

X

P121/X1 and P122/X2 are connected to CN1.

(1-2, 4-5 pin)ON

P121/X1 and P122/X2 are connected to the clock
circuit.

(2-3, 5-6 pin)

RL78/G22

CN1.4

SW5

CN1.5

OFF
ON

C18
(No mount)

X1(No Mount)

OFF
ON

C19
(No mount)

P121/X1

P122/X2

R46(No mount)P123/XT1

C20(No mount)

C21(No mount)

X2(No Mount)
R47(No mount)

P124/XT2

Figure 2-6. Clock Circuit

R12UZ0110EJ0110
Apr.26.24

Rev.1.10

Page 8 of 19

RL78/G22
Capacitive Touch Evaluation System User’s Manual
2.3.4

2.

CPU Board

Reset Circuit

The RL78/G22 CPU Board is equipped with a reset switch (SW1) which generates a reset signal to restart themain MCU.

VDD

VDD

RL78/G22
SW1

D2

1k R40

R41
10k

RESET

C17
1uF
CN4.10, 13

Figure 2-7. Reset Circuit
2.3.5

Push Switch & LEDs

Table 2-5. lists the push switch specifications. Figure 2-8 lists the LED specifications.
Table 2-5.

Push Switch Specifications

Reference

MCU Control Port

Function

SW1（Reset）

RES#

Resets the MCU.

SW2

P61

User controllable switch.

SW3

P60

User controllable switch.

Table 2-6. LED Specifications
Reference

MCU Control Port

Function

Color

LED1 (Power)

VCC

Power status display

Red.

LED2

P62

User LED

Green

LED3

P63

User LED

Yellow

Table 2-7 lists the switch specifications for board function selection switch (SW6). P61and P62 of RL78/G22
are connected to the push switch and LED or CN1 by slide switch SW6.
Table 2-7.

Switch Specifications for Board Function Selection Switch (SW6)

Reference

Position

Default

Function

Setting (X)
SW6

OFF

X

(1-2, 4-5 pin)

P61 and P62 are connected to LED2 (P61) andSW2 (P62).

ON

P61 and P62 are connected to CN1 (GPIO).

(2-3, 5-6 pin)

R12UZ0110EJ0110
Apr.26.24

Rev.1.10

Page 9 of 19

RL78/G22
Capacitive Touch Evaluation System User’s Manual

2.

CPU Board

Figure 2-8 shows the push switch and LED circuit

Figure 2-8. Push Switch and LED Circuit
2.3.6

USB Serial Conversion

Table 2-8 lists connections for USB serial IC and MCU controller. The RL78/G22 Cap Touch Evaluation
System Board is equipped with USB serial IC FT234XD (FTDI Ltd.) for USB serial conversion. The FT234XD
is connected to the RL78/G22’s Serial Array Unit (SAU) module.
Table 2-8 USB Serial Conversion
Signal NameMCU Control Port

Function

TXD1

P00/TS26/TxD1

SAU transmit data signal

RXD1

P01/TS27/RxD1

SAU receive data signal

Table 2-9 lists the switch specifications for board function selection switch (SW4). P00/TS26/TxD1 and
P01/TS27/RxD1 of RL78/G22 are connected to USB-serial conversion or TS pins by slide switch SW4.
Table 2-9.

Switch Specifications for Board Function Selection Switch (SW4)

Reference

Position

Default

Function

Setting (X)SW4OFF(1-2, 4-5 pin)ON(2-3, 5-6 pin)

R12UZ0110EJ0110
Apr.26.24

Rev.1.10

X

P00/TS26/TxD1 and P01/TS27/RxD1 are connected
to USB-Serial conversion.
TS26 and TS27 of CN2 cannnot be used.
P00/TS26/TxD1 and P01/TS27/RxD1 are connected
to CN2 (TS26 and TS27).
USB-Serial communication cannnot be used.

Page 10 of 19

RL78/G22
Capacitive Touch Evaluation System User’s Manual

2.

CPU Board

Figure 2-9 shows the board function selection switch circuit (SW4)
TS26
TS27

RL78/G22
SW4
OFF
ON

USB-Serial
CircuitOFFON

P00/TS26/TxD1
P01/TS27/RxD1

Figure 2-9. Board Function Selection Switch Circuit (SW4)

2.3.7

Debug Interface

The CPU board is equipped with an E2/E2 Lite connector (14-pin box connector) for use as debugging
interface. For details, refer to Reference Materials [2].

R12UZ0110EJ0110
Apr.26.24

Rev.1.10

Page 11 of 19

RL78/G22
Capacitive Touch Evaluation System User’s Manual
2.3.8

2.

CPU Board

Application Header

The two application headers, CN1 and CN2, can be used as interface for the user’s own board.
CN1 is used for GPIO pins. For more details regarding peripheral functions not listed here, refer to the User’s
Manual Hardware Version.
Table 2-10.

Application Header (CN1)

CN1

MCU

Pin

Port

CN1
Peripheral

MCU

Pin

Port

Peripheral

16

VSS（GND）

15

VCC

14

P21

13

P20

12

P120

11

P41

10

P27 (Note1)

TS25

9

P147 (Note1)

8

P146 (Note1)

TS09

7

P62 (Note2)

6

P61(Note2)

5P122 (Note3)

X2

4

P121 (Note3)

X1

3

P22 (Note1)

TS20

2

P24 (Note1)

TS22

1

P25 (Note1)

TS23

TS10

Note1 : Not connected by board default. Can be used by connecting a resistor. See Figure 2-10 for details.
Note2 : Not connected by board default. Can be switched by SW6. See “2.3.5 Push Switch & LEDs” section for details.
Note3 : Not connected by board default. Can be switched by SW6. See “2.3.3 Clock Circuit” section for details.

VCC

RL78/G22

15
14

P21

13

P20

12

P120

11

P41
P27/TS25

R48

P147/TS10

R49

P146/TS09
P62

CN1

R50

SW6

P61

9
8
7
6

SW5

P122/X2

10

5
4P121/X1
P22/TS20

R51

P24/TS22

R52

P25/TS23

R53

3
2
1
16

TS20
TS22
TS23
SW2,
LED2

X1

Note :
1) The board default settings are shown in bold blue text.
2) R48 to R53 are not mounted. (0 Ohm register）
3) Unconnected functions are shown with dotted lines.

Figure 2-10.

R12UZ0110EJ0110
Apr.26.24

Rev.1.10

TS25
TS10
TS09

CN1 Circuit Diagram

Page 12 of 19

RL78/G22
Capacitive Touch Evaluation System User’s Manual

2.

CPU Board

CN2 is mainly used for CTSU pins. Fix the GPIO pins to low by software. Do not connect anything to TSCAP.
Table 2-11.

Application Header (CN2)

CN2

MCU

Pin

Port

CN2
CTSU

MCU

Pin

Port

CTSU

40

P30

TSCAP

39

－

－

38

－

－

37

－

－

36

P140

TS08

35

P00/TxD1

TS26 (Note)

34

P130

TS19

33

P01/RxD1

TS27 (Note)

32

P22

TS20

31

P23

TS21

30

P24

TS22

29

P25

TS23

28

P26

TS24

27

VSS (GND)－

26

VSS (GND)

－

25

P27

TS25

24

P147

TS10

23

P146

TS09

22

P10

TS11

21

P11

TS12

20

P12

TS13

19

P13

TS14

18

P14

TS15

17

P15

TS16

16

P16

TS17

15

VSS (GND)－

14

VSS (GND)－

13

VSS (GND)－

12

VSS (GND)－

11

VSS (GND)

－

10

P17

TS18

9

P51

TS28

8

P50

TS00

7

P70

TS02

6

P71

TS03

5

P72

TS04

4

P73

TS05

3

P74

TS06

2

P75

TS07

1

P31

TS01

－ : Not Applicable
Note :Not connected by board default. Can be switched by SW6. See “2.3.6 USB Serial Conversion” section for details.

2.3.9

CTSU Related Circuits

2.3.9.1 CTSU correction circuit
This circuit improves the absolute accuracy of the CTSU’s capacitive measurement. This function requiresthe
use of additional control software (sold separately). When using the CTSU pin in normal conditions make sure
you it set to the OFF position.
Table 2-12.

CTSU Correction Circuit Settings

Reference
SW7

Position
OFF (2-3 pin)ON (1-2 pin)

R12UZ0110EJ0110
Apr.26.24

Rev.1.10

Default
Setting (X)X

Function
Uses TS01 as the normal CTSU pin.
Uses TS01as the CTSU correction pin.

Page 13 of 19

RL78/G22
Capacitive Touch Evaluation System User’s Manual

3.
Application Board(Self-Capacitance Electrode Board)

3.

Application Board (Self-Capacitance Electrode Board)

3.1

Board Layout

Figure 3-1 shows the layout of the application board.

Wheel Electrode

LED1
LED2

GPIO
Interface

CN1

LED8

TS-B1

TS-W1

TS-W2
LED3

LED7
TS-B2

LED4

Self-capacitance
Button Electrodes
LED6

CN2

LED15

TS-W4

TS-W3

CTSU
Interface

LED14

TS-B3

LED16

LED5

SliderElectrode
TS-S1

TS-S2

TS-S3

TS-S4

TS-S5

Figure 3-1. Board Layout and TS Pin Assignments

3.2

Application Headers

Application headers CN1 and CN2 are the interface for connection to the Renesas Capacitive Touch
Evaluation System CPU board. Table 2-10 lists the pin assignments for CN1. Table 2-11 lists the pin
assignments for CN2.
Table 3-1.

Application Header (CN1)PinFunction

MCU Connection

PinFunction

MCU Connection

15

LED_VCC

VCC

16

LED_VSS（GND）

VSS（GND）

13

LED_ROW0

P20

14

LED_ROW1

P21

11

LED_ROW2

P41

12

LED_ROW3

P120

9

－

－

10

－

－

7

LED_COL3

P62

8

－

－

5

LED_COL1

P122

6

LED_COL2

P61

3

－

－

4

LED_COL0

P121

1

－

－

2

－

－

－ : Not Applicable

R12UZ0110EJ0110
Apr.26.24

Rev.1.10

Page 14 of 19

RL78/G22
Capacitive Touch Evaluation System User’s Manual
Table 3-2.

3.
Application Board(Self-Capacitance Electrode Board)

Application Header (CN2)PinTouch Electrode

CTSU (RL78/G22)(Note1)

Pin

Touch
Electrode

CTSU (RL78/G22)(Note1)

39

－

－

40

－

TSCAP

37

－

－

38

－

－

35

－

－

36

TS-W1

TS08

33

－

－

34

TS-W2

TS19

31

TS-W3

TS21

32

－

－

29

－

－

30

－

－

27

－

－

28

TS-W4

TS24

25

－

－

26

－

－

23

－

－

24

－

－

21

－

－

22

SHIELD-W1

TS11 (Note2)

19

－

－

20

－

－

17

－

－

18

－

－

15

－

－

16

－

13

－

－

14

－

－

11

－

－

12

－

－

9

TS-B1

TS28

10

TS-B2

TS18

7

SHIELD-B1

TS02 (Note2)

8

TS-B3

TS00

5

TS-S1

TS04

6

SHIELD-S1

TS03 (Note2)

3

TS-S3

TS06

4

TS-S2

TS05

1

TS-S5

TS01

2

TS-S4

TS07

－ : Not Applicable
Note 1: Set output of all unassigned pins to low by software.
Note 2: SHIELD-S1, SHIELD-W1 and SHIELD-B1 are shield electrodes. To enable the function, set the pin to shieldsignal output mode by software.

R12UZ0110EJ0110
Apr.26.24

Rev.1.10

Page 15 of 19

RL78/G22
Capacitive Touch Evaluation System User’s Manual

4.
[1].
[2].

4.

Reference Materials

Reference Materials
Renesas RL78/G22 User's Manual: Hardware (01UH0978)
E1/E20/E2 Emulator, E2 Emulator Lite Additional Document for User’s Manual (Notes on Connectionof RL78 Devices) (R20UT1994)

R12UZ0110EJ0110
Apr.26.24

Rev.1.10

Page 16 of 19

RL78/G22
Capacitive Touch Evaluation System User’s Manual

5.

5.

Additional Information

Additional Information

Support
Refer to the Integrated Development Environment help menu for more information on how to use the IDE.
Refer to the RL78/G22 User’s Manual Hardware Version for more information on RL78/G22 MCUs.

For general information on Renesas micrcontrollers, visit : https://www.renesas.com/

Trademarks
All trade names and product names used in this document are trademarks or registered trademarks of theirrespective companies or organizations.

Copyright
All or part of this manual may be changed without notice.
Renesas Electronics Corporation holds the copyright for this document.
Reproduction, in whole or in part, without the written consent of Renesas Electronics Corporation isprohibited.

© 2022(2024) Renesas Electronics Corporation.

R12UZ0110EJ0110
Apr.26.24

Rev.1.10

Page 17 of 19

RL78/G22
Capacitive Touch Evaluation System User’s Manual

Appendix:
Self-Capacitance Touch Electrode Board Connection

Appendix: Self-Capacitance Touch Electrode Board Connection
The following describes how to use the Renesas Self-Capacitance Touch Electrode Board(RTK0EG0019B01002BJ).

SHIELD-W1(TS11)

LED1

LED8

LED2
TS-W1
(TS08)

TS-W2(TS19)LED7

LED3

SHIELD-B1(TS02)

TS-B1(TS28)

TS-B2(TS18)

LED15

TS-B3
(TS00)

LED16

TS-W4
(TS24)TS-W3(TS21)
LED4

LED6

LED14

LED5

SHIELD-S1(TS03)TS-S1(TS04)

TS-S2 TS-S3(TS05) (TS06)

TS-S4 TS-S5(TS07) (TS01)

Figure 1. Board Layout and TS Pin Assignments
Table 1. TS Pin (CN2) Assignments
Touch Electrode

CTSU (RL78/G22)

Description

TS-W1

TS08

Wheel Electrode

TS-W2

TS19

TS-W3

TS21

TS-W4

TS24

SHIELD-W1

TS11 (Note)

Wheel Shield Electrode

TS-B1

TS28

Button Electrode

TS-B2

TS18

TS-B3

TS00

SHIELD-B1

TS02 (Note)

Button Shield Electrode

TS-S1

TS04

Slider Electrode

TS-S2

TS05

TS-S3

TS06

TS-S4

TS07

TS-S5

TS01

SHIELD-S1

TS03 (Note)

Slider Shield ElectrodeNote: Set the pin to shield signal output mode by software

R12UZ0110EJ0110
Apr.26.24

Rev.1.10

Page 18 of 19

RL78/G22
Capacitive Touch Evaluation System User’s Manual

Appendix:
Self-Capacitance Touch Electrode Board Connection

Table 2. TS Pin (CN2) Assignments
Signal

RL78/G22 Port

Description

LED_ROW0

P20

LED Matrix, High Side Transistor

LED_ROW1

P21

Drive

LED_ROW2

P41

LED_ROW3

P120

LED_COL0

P121

LED Matrix, Low Side Transistor

LED_COL1

P122

Drive

LED_COL2

P61

LED_COL3

P62

LED_VCC

VCC

VCC

LED_GND

VSS (GND)

GND

Table 3. LED Matrix Table
LED_COL0

LED_COL1

LED_COL2

LED_COL3

LED_ROW0

LED1

LED5

LED13

LED9

LED_ROW1

LED2

LED6

LED14

LED10

LED_ROW2

LED3

LED7

LED15

LED11

LED_ROW3

LED4

LED8

LED16

LED12

Table 4. LED Status and Pin Output Settings
LED

LED_ROWn Connection Pin

LED_COLn Connection Pin

On

Low

High

Off

High

Low

Note: n=0~3

R12UZ0110EJ0110
Apr.26.24

Rev.1.10

Page 19 of 19

RL78/G22 Capacitive Touch Evaluation System

Revision History
Rev.

User’s Manual

Date

Description
Page

Summary

1.00

Sep.30.22

First Edition issued

1.10

Apr.26.24

Additions and changes due to updated EMC standard.

3・How to Use This Manual
Added description of electromagnetic environment
・1.4 Regulatory Compliance Notices
Added description of conformity standard.

9

Fix information about 2.3.5 Push Switch & LEDs.
・Table 2-5 Fix SW2 connection point
・Table 2-6 Fix LED2 connection point

10

・Table 2-7 Fix function description
・Figure 2-8 Fix SW2 and LED2 connections

C- 1

RL78/G22 Renesas Solution Starter Kit
Capacitive Touch Evaluation System User’s Manual
Publication Date:

Rev. 1.00
Rev. 1.10

Sep.30.2022
Apr.26.2024

Published by:Renesas Electronics Corporation

RL78/G22
Renesas Solution Starter Kit
Capacitive Touch Evaluation System
User’s Manual

R12UZ0110EJ0110