Sample &Buy

Product
FolderSupport &Community

Tools &
SoftwareTechnical
Documents

TPS61020, TPS61024, TPS61025, TPS61026, TPS61027, TPS61028, TPS61029
SLVS451G – SEPTEMBER 2003 – REVISED DECEMBER 2014

TPS6102x 96% Efficient Synchronous Boost Converter
1 Features

3 Description••

The TPS6102x family of devices provide a power
supply solution for products powered by either a onecell, two-cell, or three-cell alkaline, NiCd or NiMH, or
one-cell Li-Ion or Li-polymer battery. Output currents
can go as high as 200 mA while using a single-cellalkaline battery, and discharge it down to 0.9 V. The
device can also be used for generating 5 V at 500
mA from a 3.3-V rail or a Li-Ion battery. The boost
converter is based on a fixed-frequency, pulse widthmodulation (PWM) controller using a synchronousrectifier to obtain maximum efficiency. At low load
currents the converter enters the power save mode tomaintain a high efficiency over a wide-load current
range. The Power Save mode can be disabled,
forcing the converter to operate at a fixed switchingfrequency. The maximum peak current in the boost
switch is limited to a value of 800 mA, 1500 mA, or
1800 mA depending on the version of the device.

1

•
•
•
•
•
•
•
•
•

96% Efficient Synchronous Boost Converter
Output Voltage Remains Regulated When Input
Voltage Exceeds Nominal Output Voltage
Device Quiescent Current: 25 µA (Typ)Input Voltage Range: 0.9 V to 6.5 V
Fixed and Adjustable Output Voltage Options Up
to 5.5 V
Power Save Mode for Improved Efficiency at Low
Output Power
Low Battery Comparator
Low EMI-Converter (Integrated Anti-ringing
Switch)Load Disconnect During Shutdown
Overtemperature Protection
Small 3-mm × 3-mm VSON-10 Package

The TPS6102x devices keep the output voltage
regulated even when the input voltage exceeds thenominal output voltage. The output voltage can be
programmed by an external resistor divider, or isfixed internally on the chip. The converter can bedisabled to minimize battery drain. During shutdown,
the load is completely disconnected from the battery.
A low-EMI mode is implemented to reduce ringing
and, in effect, lower radiated electromagnetic energy
when the converter enters the discontinuous
conduction mode. The device is packaged in a 10-pin
VSON PowerPAD™ package measuring 3 mm x 3
mm (DRC).

2 Applications
•

•
•
•
•
•

All One-Cell, Two-Cell, and Three-Cell Alkaline,
NiCd or NiMH, or One-Cell Li-Ion or Li-Polymer
Battery-Powered Products
Portable Audio Players
PDAs
Cellular Phones
Personal Medical Products
Camera White LED Flash Lights

Device Information(1)PART NUMBER
TPS6102x

PACKAGEVSON (10)BODY SIZE (NOM)
3.00 mm x 3.00 mm(1) For all available packages, see the orderable addendum atthe end of the datasheet.

4 Typical Schematic
L1
6.8 µH

SW

VOUT

VBAT
0.9-V To
6.5-V Input

C1
10 µF

R1

R3

EN

C2
2.2 µF

C3
47 µF

VO
3.3 V Up To
200 mA

FB

LBI

R4

R5

R2
PS

LBO

GND

PGND

Low Battery
OutputTPS61020

1

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

TPS61020, TPS61024, TPS61025, TPS61026, TPS61027, TPS61028, TPS61029
SLVS451G – SEPTEMBER 2003 – REVISED DECEMBER 2014

www.ti.com

Table of Contents
1
2
3
4
5
6
7
8

Features .................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Typical Schematic.................................................. 1
Revision History..................................................... 2
Device Comparison Table..................................... 3
Pin Configuration and Functions ......................... 3
Specifications......................................................... 4
8.1
8.2
8.3
8.4
8.5
8.6

Absolute Maximum Ratings ...................................... 4
ESD Ratings.............................................................. 4
Recommended Operating Conditions....................... 4
Thermal Information .................................................. 4
Electrical Characteristics........................................... 5
Typical Characteristics .............................................. 6

9 Parameter Measurement Information .................. 8
10 Detailed Description ............................................. 910.1 Overview ................................................................. 910.2 Functional Block Diagram ....................................... 9
10.3 Feature Description............................................... 1010.4 Device Functional Modes...................................... 1210.5 Programming......................................................... 1211 Application and Implementation........................ 14
11.1 Application Information.......................................... 14
11.2 Typical Application ................................................ 14
11.3 System Examples ................................................. 18

12 Power Supply Recommendations ..................... 20
13 Layout................................................................... 20
13.1 Layout Guidelines ................................................. 20
13.2 Layout Example .................................................... 21
13.3 Thermal Considerations ........................................ 21

14 Device and Documentation Support ................. 22
14.1
14.2
14.3
14.4
14.5

Device Support...................................................... 22
Related Links ........................................................ 22
Trademarks ........................................................... 22
Electrostatic Discharge Caution ............................ 22
Glossary ................................................................ 22

15 Mechanical, Packaging, and Orderable
Information ........................................................... 22

5 Revision History
Changes from Revision F (April 2012) to Revision G
•

2

Page

Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, andMechanical, Packaging, and Orderable Information section .................................................................................................. 1

Submit Documentation Feedback

Copyright © 2003–2014, Texas Instruments Incorporated

Product Folder Links: TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

TPS61020, TPS61024, TPS61025, TPS61026, TPS61027, TPS61028, TPS61029
www.ti.com

SLVS451G – SEPTEMBER 2003 – REVISED DECEMBER 2014

6 Device Comparison TableTAOUTPUT VOLTAGE DC-DC (1)NOMINAL SWITCH CURRENT LIMITPART NUMBER (2)Adjustable

1500 mA

TPS61020DRC

Adjustable

800 mATPS61028DRC

Adjustable

1800 mA

TPS61029DRC

3.0 V

1500 mA

TPS61024DRC

3.3 V

1500 mA

TPS61025DRC

5V

1800 mA

TPS61026DRC

5V

1500 mA

TPS61027DRC–40°C to 85°C

(1)
(2)

Contact the factory to check availability of other fixed output voltage versions.
The DRC package is available taped and reeled. Add R suffix to device type (for example, TPS61020DRCR) to order quantities of 3000
devices per reel. Add a T suffix to the device type (that is, TPS61020DRCT) to order quantities of 250 devices per reel.

7 Pin Configuration and Functions
EN
VOUT
FB
LBO
GND

PGND
SW
PS
LBI
VBAT

Pin Functions
PIN

I/O

DESCRIPTION

NAME

NO.

EN

1

I

Enable input. (1/VBAT enabled, 0/GND disabled)

FB

3

I

Voltage feedback of adjustable versions

GND

5

LBI

7

I

Low battery comparator input (comparator enabled with EN), may not be left floating, should beconnected to GND or VBAT if comparator is not used

LBO

4

O

Low battery comparator output (open drain)

PS

8

I

Enable/disable power save mode (1/VBAT disabled, 0/GND enabled)

SW

9

I

Boost and rectifying switch input

PGND

10

VBAT

6

I

Supply voltage

VOUT

2

O

Boost converter output

PowerPAD™

——

Must be soldered to achieve appropriate power dissipation. Should be connected to PGND.

Control / logic ground

Power ground

Copyright © 2003–2014, Texas Instruments Incorporated

Submit Documentation Feedback

Product Folder Links: TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

3

TPS61020, TPS61024, TPS61025, TPS61026, TPS61027, TPS61028, TPS61029
SLVS451G – SEPTEMBER 2003 – REVISED DECEMBER 2014

www.ti.com

8 Specifications
8.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN

MAX

UNIT

Input voltage on SW, VOUT, LBO, VBAT, PS, EN, FB, LBI

–0.3

7

V

TJ

Operating virtual junction temperature

–40

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

8.2 ESD Ratings
VALUE
V(ESD)(1)(2)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)±2000

Charged-device model (CDM), per JEDEC specification JESD22C101 (2)

±750

UNIT
V

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing withless than 500-V HBM is possible with the necessary precautions.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing withless than 250-V CDM is possible with the necessary precautions.

8.3 Recommended Operating Conditions
MAX

UNIT

Supply voltage at VBAT, VI (TPS61020, TPS61024, TPS61025, TPS61028)

MIN
0.9

NOM

6.5

V

Supply voltage at VBAT, VI (TPS61026, TPS61029)

0.9

5.5

V

Operating virtual junction temperature range, TJ

–40

125

°C

8.4 Thermal Information
TPS6102x
THERMAL METRIC

(1)

SON

UNIT

10 PINS
RθJA

Junction-to-ambient thermal resistance

47.2

RθJC(top)

Junction-to-case (top) thermal resistance

67.5

RθJB

Junction-to-board thermal resistance

21.6

ψJT

Junction-to-top characterization parameter

1.7

ψJB

Junction-to-board characterization parameter

21.8

RθJC(bot)

Junction-to-case (bottom) thermal resistance

3.6

(1)

4

°C/W

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

Submit Documentation Feedback

Copyright © 2003–2014, Texas Instruments Incorporated

Product Folder Links: TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

TPS61020, TPS61024, TPS61025, TPS61026, TPS61027, TPS61028, TPS61029
www.ti.com

SLVS451G – SEPTEMBER 2003 – REVISED DECEMBER 2014

8.5 Electrical Characteristics
Over recommended junction temperature range and over recommended input voltage range. Typical values are at TJ = 25°C
(unless otherwise noted).
PARAMETERTEST CONDITIONS

MIN

TYP

MAX

UNIT

0.9

1.2

V

DC-DC STAGE
Minimum input voltage for start-up

RL = 120 Ω

Input voltage range, after start-up (TPS61020,
TPS61024, TPS61025, TPS61027, TPS61028)

0.9

6.5

V

Input voltage range, after start-up (TPS61026,
TPS61029)

0.9

5.5

V

VO

TPS61020, TPS61028 and TPS61029 output
voltage range

1.8

5.5

V

VFB

TPS61020, TPS61028 and TPS61029 feedback
voltage

490

500

510

mV

f

Oscillator frequency

480

600

720

kHz

ISW

Switch current limit (TPS61020, TPS61024,
TPS61025, TPS61027)

VOUT= 3.3 V

1200

1500

1800

mA

ISW

Switch current limit (TPS61028)

VOUT= 3.3 V

ISW

Switch current limit (TPS61026, TPS61029)

VOUT= 3.3 V

1500

1800

VI

800

Start-up current limit

mA
2100

mA

0.4 x ISWmA

SWN switch on resistance

VOUT= 3.3 V

260

mΩ

SWP switch on resistance

VOUT= 3.3 V

290

mΩ

Total accuracy (including line and load regulation)±3%

Line regulation

0.6%

Load regulation
Quiescent current

0.6%
VBAT
VOUT

Shutdown current

IO = 0 mA, VEN = VBAT = 1.2 V,
VOUT = 3.3 V, TA = 25°C
VEN = 0 V, VBAT = 1.2 V,
TA = 25°C

1

3

µA

25

45

µA

0.1

1

µA

510

mV

CONTROL STAGE
VUVLO

Under voltage lockout threshold

VLBI voltage decreasing

VIL

LBI voltage threshold

VLBI voltage decreasing

0.8
490

LBI input hysteresis

500

V

10

mV

LBI input current

EN = VBAT or GND

0.01

0.1

VOL

LBO output low voltage

VO = 3.3 V, IOI = 100 µA

0.04

0.4

V

Vlkg

LBO output leakage current

VLBO = 7 V

0.01

0.1

µA

VIL

EN, PS input low voltage

0.2 ×
VBAT

V

VIH

EN, PS input high voltage
EN, PS input current

0.8 ×
VBAT
Clamped on GND or VBAT

µA

V
0.01

0.1

µA

Overtemperature protection

140

°C

Overtemperature hysteresis

20°C

Copyright © 2003–2014, Texas Instruments Incorporated

Submit Documentation Feedback

Product Folder Links: TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

5

TPS61020, TPS61024, TPS61025, TPS61026, TPS61027, TPS61028, TPS61029
SLVS451G – SEPTEMBER 2003 – REVISED DECEMBER 2014

www.ti.com

8.6 Typical Characteristics
Table 1. Table of Graphs
FIGURE
Maximum output current

vs Input voltage (TPS61020)

Figure 1

vs Output current (TPS61020)

Figure 2

vs Output current (TPS61025)

Figure 3

vs Output current (TPS61027)

Figure 4

vs Input voltage (TPS61025)

Figure 5

vs Input voltage (TPS61027)

Figure 6

vs Output current (TPS61025)

Figure 7

vs Output current (TPS61027)

Figure 8

No load supply current into VBATvs Input voltage

Figure 9

No load supply current into VOUT

vs Input voltage

Figure 10

Efficiency

Output voltage

100

1400

VO = 5 V

80

1000

70
Efficiency - %Maximum Output Current - mA

VO = 3.3 V

800

600
VO = 1.8 V

400

VO = 1.8 V

VBAT = 0.9 V

90

1200

VBAT = 1.8 V

60
50
40
30
20

200
10
0
0.9

1.7

4.9
2.5
3.3
4.1
VI - Input Voltage - V

5.7

0

6.5

Figure 1. TPS61020 Maximum Output Current vs Input
Voltage

1

100

100

90

90
80
VBAT = 2.4 V

70
60
50

VBAT = 1.2 V

70

VBAT = 1.8 V
Efficiency - %Efficiency - %1000

Figure 2. TPS61020 Efficiency vs Output Current

80

VBAT = 0.9 V

40

VBAT = 2.4 V

VBAT = 1.8 V

60

VBAT = 3.6 V

50
40
30

30

20

20
10

VO = 3.3 V
1

10
100
IO - Output Current - mA

1000

Figure 3. TPS61025 Efficiency vs Output Current

Submit Documentation Feedback

VO = 5 V

10

0

6

10
100
IO - Output Current - mA

0
1

10
100
IO - Output Current - mA

1000

Figure 4. TPS61027 Efficiency vs Output Current

Copyright © 2003–2014, Texas Instruments Incorporated

Product Folder Links: TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

TPS61020, TPS61024, TPS61025, TPS61026, TPS61027, TPS61028, TPS61029
www.ti.com

SLVS451G – SEPTEMBER 2003 – REVISED DECEMBER 2014
100
95

100
VO = 3.3 V

IO = 100 mA

90

90
85

85
IO = 10 mA

80

Efficiency - %Efficiency - %IO = 100 mA

95

75
IO = 250 mA
70

70
65

60

60

55

55

50
0.9

50

1.9

2.4

2.9

3.4

3.9

4.4 4.9

IO = 250 mA

75

65

1.4

IO = 10 mA

80

VO = 5 V

VI - Input Voltage - V

0.9 1.4 1.9 2.4 2.9 3.4 3.9 4.4 4.9 5.4 5.9 6.4
VI - Input Voltage - V

Figure 5. TPS61025 Efficiency vs Input Voltage

Figure 6. TPS61027 Efficiency vs Input Voltage

3.35

5.10
VO = 3.3 V

VO = 5 V

VO - Output Voltage - V

VO - Output Voltage - V

5.05

3.30
VBAT = 2.4 V

3.25

5
VBAT = 3.6 V
4.95

4.90

4.85

3.20

4.80
1

10

100

1000

IO - Output Current - mA

1

10
100
IO - Output Current - mA

Figure 7. TPS61025 Output Voltage vs Output Current

Figure 8. TPS61027 Output Voltage vs Output Current

1.6

34.8
TA = 85°C
No Load Supply Current Into VOUT - µ A

No Load Supply Current Into VBAT - µ A

TA = 85°C
1.4
1.2
1
0.8
TA = 25°C

TA = -40°C

0.6
0.4
0.2
0
0.9 1.5

1000

29.8

24.8

TA = -40°C
TA = 25°C

19.8
14.8
9.8
4.8
-0.2

2

2.5 3 3.5 4 4.5 5
VI - Input Voltage - V

5.5

6

6.5

Figure 9. No Load Supply Current Into VBAT vs Input
Voltage

Copyright © 2003–2014, Texas Instruments Incorporated

0.9 1.52

2.5 3 3.5 4 4.5 5
VI - Input Voltage - V

5.5

6

6.5

Figure 10. No Load Supply Current Into VOUT vs Input
Voltage

Submit Documentation Feedback

Product Folder Links: TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

7

TPS61020, TPS61024, TPS61025, TPS61026, TPS61027, TPS61028, TPS61029
SLVS451G – SEPTEMBER 2003 – REVISED DECEMBER 2014

www.ti.com

9 Parameter Measurement Information
L1
6.8 µH

SW

VOUT

VBAT
Power
Supply

R1

C1
10 µF

R3

EN

C2
2.2 µF

C3
47 µF

VCC
Boost Output

FB

LBI

R5

R4

R2
PS
GND
List of Components:
U1 = TPS6102xDRC
L1 = EPCOS B82462−G4682
C1, C2 = X7R/X5R Ceramic
C3 = Low ESR Tantalum

LBO

Control Output

PGND
TPS6102x

Figure 11. Parameter Measurement Schematic

8

Submit Documentation Feedback

Copyright © 2003–2014, Texas Instruments Incorporated

Product Folder Links: TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

TPS61020, TPS61024, TPS61025, TPS61026, TPS61027, TPS61028, TPS61029
www.ti.com

SLVS451G – SEPTEMBER 2003 – REVISED DECEMBER 201410 Detailed Description
10.1 Overview
TPS6102x is based on a fixed frequency, pulse-width-modulation (PWM) controller using synchronousrectification to obtain maximum efficiency. Input voltage, output voltage, and voltage drop on the NMOS switch
are monitored and forwarded to the regulator. So changes in the operating conditions of the converter directly
affect the duty cycle. At low load currents, the converter enters Power Save Mode to ensure high efficiency overa wide load current range. The Power Save mode can be disabled, forcing the converter to operate at a fixedswitching frequency.

10.2 Functional Block Diagram
SW
Backgate
Control

AntiRinging

VBAT

VOUT
10 kΩ

VOUT
Vmax
Control

20 pF

Gate
Control

PGND
PGND

Regulator

PGND

Error
Amplifier _FB+
Vref = 0.5 V
Control Logic

+
_

GND
Oscillator
Temperature
Control

EN
PS

GND

Low Battery
Comparator
_

LBI

LBO

+
+
_

Vref = 0.5 V
GND

Copyright © 2003–2014, Texas Instruments Incorporated

Submit Documentation Feedback

Product Folder Links: TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

9

TPS61020, TPS61024, TPS61025, TPS61026, TPS61027, TPS61028, TPS61029
SLVS451G – SEPTEMBER 2003 – REVISED DECEMBER 2014

www.ti.com

10.3 Feature Description
10.3.1 Controller Circuit
The controller circuit of the device is based on a fixed frequency multiple feed forward controller topology. Input
voltage, output voltage, and voltage drop on the NMOS switch are monitored and forwarded to the regulator. Sochanges in the operating conditions of the converter directly affect the duty cycle and must not take the indirect
and slow way through the control loop and the error amplifier. The control loop, determined by the error amplifier,only has to handle small signal errors. The input for it is the feedback voltage on the FB pin or, at fixed output
voltage versions, the voltage on the internal resistor divider. It is compared with the internal reference voltage togenerate an accurate and stable output voltage.
The peak current of the NMOS switch is also sensed to limit the maximum current flowing through the switch andthe inductor. An internal temperature sensor prevents the device from getting overheated in case of excessive
power dissipation.
10.3.2 Synchronous Rectifier
The device integrates an N-channel and a P-channel MOSFET transistor to realize a synchronous rectifier.
Because the commonly used discrete Schottky rectifier is replaced with a low RDS(ON) PMOS switch, the power
conversion efficiency reaches 96%. To avoid ground shift due to the high currents in the NMOS switch, twoseparate ground pins are used. The reference for all control functions is the GND pin. The source of the NMOS
switch is connected to PGND. Both grounds must be connected on the PCB at only one point close to the GND
pin. A special circuit is applied to disconnect the load from the input during shutdown of the converter. In
conventional synchronous rectifier circuits, the backgate diode of the high-side PMOS is forward biased in
shutdown and allows current flowing from the battery to the output. This device however uses a special circuit
which takes the cathode of the backgate diode of the high-side PMOS and disconnects it from the source when
the regulator is not enabled (EN = low).
The benefit of this feature for the system design engineer is that the battery is not depleted during shutdown of
the converter. No additional components have to be added to the design to make sure that the battery is
disconnected from the output of the converter.
10.3.3 Down Regulation
In general, a boost converter only regulates output voltages which are higher than the input voltage. This device
operates differently. For example, it is able to regulate 3.0 V at the output with two fresh alkaline cells at the input
having a total cell voltage of 3.2 V. Another example is powering white LEDs with a forward voltage of 3.6 V froma fully charged Li-Ion cell with an output voltage of 4.2 V. To control these applications properly, a down
conversion mode is implemented.
If the input voltage reaches or exceeds the output voltage, the converter changes to the conversion mode. In thismode, the control circuit changes the behavior of the rectifying PMOS. It sets the voltage drop across the PMOS
as high as needed to regulate the output voltage. This means the power losses in the converter increase. Thishas to be taken into account for thermal consideration. The down conversion mode is automatically turned off assoon as the input voltage falls about 50 mV below the output voltage. For proper operation in down conversion
mode the output voltage should not be programmed below 50% of the maximum input voltage which can beapplied.
10.3.4 Device Enable
The device is put into operation when EN is set high. It is put into a shutdown mode when EN is set to GND. In
shutdown mode, the regulator stops switching, all internal control circuitry including the low-battery comparator isswitched off, and the load is isolated from the input (as described in the Synchronous Rectifier Section). This
also means that the output voltage can drop below the input voltage during shutdown. During start-up of theconverter, the duty cycle and the peak current are limited in order to avoid high peak currents drawn from thebattery.

10

Submit Documentation Feedback

Copyright © 2003–2014, Texas Instruments Incorporated

Product Folder Links: TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

TPS61020, TPS61024, TPS61025, TPS61026, TPS61027, TPS61028, TPS61029
www.ti.com

SLVS451G – SEPTEMBER 2003 – REVISED DECEMBER 2014

Feature Description (continued)
10.3.5 Undervoltage Lockout
An undervoltage lockout function prevents device start-up if the supply voltage on VBAT is lower thanapproximately 0.8 V. When in operation and the battery is being discharged, the device automatically enters the
shutdown mode if the voltage on VBAT drops below approximately 0.8 V. This undervoltage lockout function is
implemented in order to prevent the malfunctioning of the converter.
10.3.6 Softstart and Short Circuit Protection
When the device enables, the internal startup cycle starts with the first step, the precharge phase. During
precharge, the rectifying switch is turned on until the output capacitor is charged to a value close to the input
voltage. The rectifying switch is current limited during that phase. The current limit increases with the output
voltage. This circuit also limits the output current under short circuit conditions at the output. Figure 12 shows the
typical precharge current vs output voltage for specific input voltages:
0.35
VBAT = 5 V

Precharge Current − A

0.3
0.25
0.2
VBAT = 3.6 V
0.15
VBAT = 2.4 V
0.1
VBAT = 1.8 V

0.05

VBAT = 1.2 V
0
0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

VO − Output Voltage − V

Figure 12. Precharge and Short Circuit Current
After charging the output capacitor to the input voltage, the device starts switching. If the input voltage is below
1.4 V the device works with a fixed duty cycle of 50% until the output voltage reaches 1.4 V. After that the duty
cycle is set depending on the input output voltage ratio. Until the output voltage reaches its nominal value, theboost switch current limit is set to 40% of its nominal value to avoid high peak currents at the battery during
startup. As soon as the output voltage is reached, the regulator takes control and the switch current limit is set
back to 100%.
10.3.7 Low Battery Detector Circuit—LBI/LBO
The low-battery detector circuit is typically used to supervise the battery voltage and to generate an error flag
when the battery voltage drops below a user-set threshold voltage. The function is active only when the device isenabled. When the device is disabled, the LBO pin is high-impedance. The switching threshold is 500 mV at LBI.
During normal operation, LBO stays at high impedance when the voltage, applied at LBI, is above the threshold.
It is active low when the voltage at LBI goes below 500 mV.
The battery voltage, at which the detection circuit switches, can be programmed with a resistive divider
connected to the LBI pin. The resistive divider scales down the battery voltage to a voltage level of 500 mV,
which is then compared to the LBI threshold voltage. The LBI pin has a built-in hysteresis of 10 mV. See theapplication section for more details about the programming of the LBI threshold. If the low-battery detection
circuit is not used, the LBI pin should be connected to GND (or to VBAT) and the LBO pin can be left
unconnected. Do not let the LBI pin float.

Copyright © 2003–2014, Texas Instruments Incorporated

Submit Documentation Feedback

Product Folder Links: TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

11

TPS61020, TPS61024, TPS61025, TPS61026, TPS61027, TPS61028, TPS61029
SLVS451G – SEPTEMBER 2003 – REVISED DECEMBER 2014

www.ti.com

Feature Description (continued)
10.3.8 Low-EMI Switch
The device integrates a circuit that removes the ringing that typically appears on the SW node when theconverter enters discontinuous current mode. In this case, the current through the inductor ramps to zero and therectifying PMOS switch is turned off to prevent a reverse current flowing from the output capacitors back to thebattery. Due to the remaining energy that is stored in parasitic components of the semiconductor and theinductor, a ringing on the SW pin is induced. The integrated antiringing switch clamps this voltage to VBAT and
therefore dampens ringing.

10.4 Device Functional Modes
10.4.1 Undervoltage Lockout
An undervoltage lockout function prevents device start-up if the supply voltage on VBAT is lower thanapproximately 0.8 V. When in operation and the battery is being discharged, the device automatically enters the
shutdown mode if the voltage on VBAT drops below approximately 0.8 V. This undervoltage lockout function is
implemented in order to prevent the malfunctioning of the converter.
10.4.2 Power Save Mode
The PS pin can be used to select different operation modes. To enable power save, PS must be set low. Powersave mode is used to improve efficiency at light load. In power save mode the converter only operates when the
output voltage trips below a set threshold voltage. It ramps up the output voltage with one or several pulses andgoes again into power save mode once the output voltage exceeds the set threshold voltage. This power savemode can be disabled by setting the PS to VBAT. In down conversion mode, power save mode is always active
and the device cannot be forced into fixed frequency operation at light loads.

10.5 Programming
10.5.1 Programming the Output Voltage
The output voltage of the TPS61020 DC-DC converter can be adjusted with an external resistor divider. The
typical value of the voltage at the FB pin is 500 mV. The maximum recommended value for the output voltage is
5.5 V. The current through the resistive divider should be about 100 times greater than the current into the FB
pin. The typical current into the FB pin is 0.01 µA, and the voltage across R4 is typically 500 mV. Based on those
two values, the recommended value for R4 should be lower than 500 kΩ, in order to set the divider current at 1
µA or higher. Because of internal compensation circuitry the value for this resistor should be in the range of 200
kΩ. From that, the value of resistor R3, depending on the needed output voltage (VO), can be calculated using
Equation 1:

æ V
ö
æ VO
ö
R3 = R4 ´ ç O - 1÷ = 180kW ´ ç
- 1÷
V
500mV
è
ø
è FB
ø

(1)

If as an example, an output voltage of 3.3 V is needed, a 1.0-MΩ resistor should be chosen for R3. If for any
reason the value for R4 is chosen significantly lower than 200 kΩ additional capacitance in parallel to R3 isrecommended, in case the device shows unstable regulation of the output voltage. The required capacitancevalue can be easily calculated using Equation 2:
200kW
- 1)
CparR3 = 20pF ´ ((2)
R4
10.5.2 Programming the LBI/LBO Threshold Voltage
The current through the resistive divider should be about 100 times greater than the current into the LBI pin. The
typical current into the LBI pin is 0.01 µA, and the voltage across R2 is equal to the LBI voltage threshold that is
generated on-chip, which has a value of 500 mV. The recommended value for R2 is therefore in the range of 500
kΩ. From that, the value of resistor R1, depending on the desired minimum battery voltage VBAT, can becalculated using Equation 3.
VBATV
R1 = R2 ´ (- 1) = 390k W ´ ( BAT - 1)
VLBI- threshold
500mV
(3)
12

Submit Documentation Feedback

Copyright © 2003–2014, Texas Instruments Incorporated

Product Folder Links: TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

TPS61020, TPS61024, TPS61025, TPS61026, TPS61027, TPS61028, TPS61029
www.ti.com

SLVS451G – SEPTEMBER 2003 – REVISED DECEMBER 2014

Programming (continued)
The output of the low battery supervisor is a simple open-drain output that goes active low if the dedicatedbattery voltage drops below the programmed threshold voltage on LBI. The output requires a pull up resistor witha recommended value of 1 MΩ. If not used, the LBO pin can be left floating or tied to GND.

Copyright © 2003–2014, Texas Instruments Incorporated

Submit Documentation Feedback

Product Folder Links: TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

13

TPS61020, TPS61024, TPS61025, TPS61026, TPS61027, TPS61028, TPS61029
SLVS451G – SEPTEMBER 2003 – REVISED DECEMBER 2014

www.ti.com

11 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.

11.1 Application Information
The devices are designed to operate from an input voltage supply range between 0.9 V (Vin rising UVLO is 1.2
V) and 6.5 V with a maximum switching current limit up to 1.8 A. The devices operate in PWM mode for medium
to heavy load conditions and in power save mode at light load currents. In PWM mode the TPS6102x converter
operates with the nominal switching frequency of 600 kHz typically. As the load current decreases, the converter
enters power save mode, reducing the switching frequency and minimizing the IC quiescent current to achieve
high efficiency over the entire load current range. The Power Save mode can be disabled when connecting PS
pin to logic high, forcing the converter to operate at a fixed switching frequency.

11.2 Typical Application
Figure 13 shows a typical application of TPS6102x with 1.2-V to 6.5-V input range and 800-mA output current.
L1
SW

VOUT
C2

VBAT
Power
Supply

C1

R1

C3

VCC
Boost Output

R3

EN

FB

LBI

R4

R5

R2
PS

LBO

GND

PGND

Control Output

TPS61020

Figure 13. Typical Application Circuit for Adjustable Output Voltage Option
11.2.1 Design Requirements
The TPS6102x DC-DC converters are intended for systems powered by a single up to triple cell Alkaline, NiCd,
NiMH battery with a typical terminal voltage between 0.9 V and 6.5 V. They can also be used in systems
powered by one-cell Li-Ion or Li-Polymer with a typical voltage between 2.5 V and 4.2 V. Additionally, any othervoltage source with a typical output voltage between 0.9 V and 6.5 V can power systems where the TPS6102x isused.
11.2.2 Detailed Design Procedure
11.2.2.1 Inductor Selection
A boost converter normally requires two main passive components for storing energy during the conversion. A
boost inductor and a storage capacitor at the output are required. To select the boost inductor, it isrecommended to keep the possible peak inductor current below the current limit threshold of the power switch inthe chosen configuration. For example, the current limit threshold of the TPS61029 switch is 1800 mA at an
output voltage of 5 V. The highest peak current through the inductor and the switch depends on the output load,
the input (VBAT), and the output voltage (VOUT). Estimation of the maximum average inductor current can be doneusing Equation 4:
VOUT
IL = IOUT ´
VBAT ´ 0.8(4)14

Submit Documentation Feedback

Copyright © 2003–2014, Texas Instruments Incorporated

Product Folder Links: TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

TPS61020, TPS61024, TPS61025, TPS61026, TPS61027, TPS61028, TPS61029
www.ti.com

SLVS451G – SEPTEMBER 2003 – REVISED DECEMBER 2014

Typical Application (continued)
For example, for an output current of 200 mA at 3.3 V, at least 920 mA of average current flows through theinductor at a minimum input voltage of 0.9 V.
The second parameter for choosing the inductor is the desired current ripple in the inductor. Normally, it isadvisable to work with a ripple of less than 20% of the average inductor current. A smaller ripple reduces themagnetic hysteresis losses in the inductor, as well as output voltage ripple and EMI. But in the same way,
regulation time at load changes rises. In addition, a larger inductor increases the total system costs. With thoseparameters, it is possible to calculate the value for the inductor by using Equation 5:V´ (VOUT - VBAT )L = BATDIL ´ f ´ VOUT
(5)
Parameter f is the switching frequency and ΔIL is the ripple current in the inductor, i.e., 20% × IL. In this example,
the desired inductor has the value of 5.5 µH. With this calculated value and the calculated currents, it is possible
to choose a suitable inductor. In typical applications a 6.8-µH inductance is recommended. The device has been
optimized to operate with inductance values between 2.2 µH and 22 µH. Nevertheless operation with higher
inductance values may be possible in some applications. Detailed stability analysis is then recommended. Care
has to be taken that load transients and losses in the circuit can lead to higher currents as estimated in
Equation 5. Also, the losses in the inductor caused by magnetic hysteresis losses and copper losses are a major
parameter for total circuit efficiency.
The following inductor series from different suppliers have been used with the TPS6102x converters:
Table 2. List of Inductors
VENDOR
SumidaWurth Elektronik
EPCOS
Cooper Electronics Technologies

11.2.2.2

INDUCTOR SERIESCDRH4D28
CDRH5D28
7447789744042
B82462-G4
SD25
SD20

Input Capacitor Selection

At least a 10-µF input capacitor is recommended to improve transient behavior of the regulator and EMI behaviorof the total power supply circuit. A ceramic capacitor or a tantalum capacitor with a 100-nF ceramic capacitor inparallel, placed close to the IC, is recommended.
11.2.2.3

Output Capacitor Selection

The major parameter necessary to define the output capacitor is the maximum allowed output voltage ripple ofthe converter. This ripple is determined by two parameters of the capacitor, the capacitance and the ESR. It is
possible to calculate the minimum capacitance needed for the defined ripple, supposing that the ESR is zero, byusing Equation 6:I´ (VOUT - VBAT )Cmin = OUT
f ´ DV ´ VOUT
(6)Parameter f is the switching frequency and ΔV is the maximum allowed ripple.
With a chosen ripple voltage of 10 mV, a minimum capacitance of 24 µF is needed. The total ripple is larger due
to the ESR of the output capacitor. This additional component of the ripple can be calculated using Equation 7:
DVESR = IOUT ´ RESR
(7)

Copyright © 2003–2014, Texas Instruments Incorporated

Submit Documentation Feedback

Product Folder Links: TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

15

TPS61020, TPS61024, TPS61025, TPS61026, TPS61027, TPS61028, TPS61029
SLVS451G – SEPTEMBER 2003 – REVISED DECEMBER 2014

www.ti.com

An additional ripple of 16 mV is the result of using a tantalum capacitor with a low ESR of 80 mΩ. The total ripple
is the sum of the ripple caused by the capacitance and the ripple caused by the ESR of the capacitor. In thisexample, the total ripple is 26 mV. Additional ripple is caused by load transients. This means that the output
capacitor has to completely supply the load during the charging phase of the inductor. A reasonable value of theoutput capacitance depends on the speed of the load transients and the load current during the load change.
With the calculated minimum value of 24 µF and load transient considerations the recommended output
capacitance value is in a 47 to 100 µF range. For economical reasons, this is usually a tantalum capacitor.
Therefore, the control loop has been optimized for using output capacitors with an ESR of above 30 mΩ.
Additionally, a ceramic output capacitor of 2.2 µF must be added in parallel with the tantalum output capacitor.
The device is not designed to operate with ceramic capacitors only, unless a discrete resistor is added in series
with them to replicate the required ESR. Large amounts of low ESR capacitance on the output causes instability.

Inductor Current
200 mA/div

Output Voltage
20 mV/div

VI = 1.2 V,
RL = 33 W,
VO = 3.3 V

Inductor Current
200 mA/div

Output Voltage
20 mV/div

11.2.3 Application Curves

t - Time - 1 ms/div

Figure 14. TPS61025 Output Voltage in Continuous Mode

Figure 15. TPS61027 Output Voltage in Continuous Mode

VI = 1.2 V,
RL = 330 W,
VO = 3.3 V

Output Voltage
50 mV/div, AC

Output Voltage
20 mV/div, ACt - Time - 1 ms/div

VI = 3.6 V,
RL = 250 W,
VO = 5 V

Inductor Current
200 mA/div, DC

Inductor Current
100 mA/div, DC

16

VI = 3.6 V,
RL = 25 W,
VO = 5 V

t - Time - 50 ms/div

t - Time - 50 ms/div

Figure 16. TPS61025 Output Voltage in Power Save Mode

Figure 17. TPS61027 Output Voltage in Power Save Mode

Submit Documentation Feedback

Copyright © 2003–2014, Texas Instruments Incorporated

Product Folder Links: TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

TPS61020, TPS61024, TPS61025, TPS61026, TPS61027, TPS61028, TPS61029

Output Current
100 mA/div, DC

SLVS451G – SEPTEMBER 2003 – REVISED DECEMBER 2014

t - Time - 2 ms/div

t - Time - 2 ms/div

Figure 18. TPS61025 Load Transient Response

Figure 19. TPS61027 Load Transient Response

VI = 3 V to 3.6 V,
RL = 25 W,
VO = 5 V

Output Voltage
20 mV/div, AC

Input Voltage
500 mV/div, AC

VI = 1.8 V to 2.4 V,
RL = 33 W,
VO = 3.3 V

Output Voltage
20 mV/div, AC

Input Voltage
500 mV/div, AC

VI = 3.6 V,
IL = 100 mA to 200 mA,
VO = 5 V

Output Voltage
20 mV/div, AC

VI = 1.2 V,
IL = 100 mA to 200 mA,
VO = 3.3 V

Output Voltage
20 mV/div, AC

Output Current
100 mA/div, DC

www.ti.com

t - Time - 2 ms/div

Figure 20. TPS61025 Line Transient Response

Figure 21. TPS61027 Line Transient Response

Figure 22. TPS61025 Start-Up After Enable

Copyright © 2003–2014, Texas Instruments Incorporated

Inductor Current
200 mA/div, DC
Voltage At SW
2 V/div, DCt - Time - 1 ms/div

VI = 3.6 V,
RL = 50 W,
VO = 5 V

Voltage At SW
2 V/div, DC

Inductor Current
200 mA/div, DC

Output Voltage
1 V/div, DC

VI = 2.4V,
RL = 33 W,
VO = 3.3 V

Output Voltage
2 V/div, DC

Enable5 V/div, DC

Enable5 V/div, DCt - Time - 2 ms/div

t - Time - 500 ms/div

Figure 23. TPS61027 Start-Up After Enable

Submit Documentation Feedback

Product Folder Links: TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

17

TPS61020, TPS61024, TPS61025, TPS61026, TPS61027, TPS61028, TPS61029
SLVS451G – SEPTEMBER 2003 – REVISED DECEMBER 2014

www.ti.com

11.3 System Examples
L1
6.8 µH
Battery
Input

SW

VOUT
C2
2.2 µF

VBAT
R1

C1
10 µF

EN

C3
100 µFVCC 5 V
Boost Output

FB
R5

LBI
R2
PS
GND

LBO

LBO
PGND
TPS61027

List of Components:
U1 = TPS61027DRC
L1 = EPCOS B82462-G4682
C1, C2 = X7R,X5R Ceramic
C3 = Low ESR Tantalum

Figure 24. Power Supply Solution for Maximum Output Power Operating From a Single Alkaline Cell
L1
6.8 µH
Battery
Input

SW

VOUT
C2
2.2 µF

VBAT
C1
10 µF

R1

EN

C3
47 µF

VCC 5 V
Boost Output

FB
R5

LBI
R2
PS
GND

LBO

LBO

PGND
TPS61027

List of Components:
U1 = TPS61027DRC
L1 = EPCOS B82462-G4682
C1, C2 = X7R,X5R Ceramic
C3 = Low ESR Tantalum

Figure 25. Power Supply Solution for Maximum Output Power Operating From a Dual/Triple Alkaline Cellor Single Li-Ion Cell

18

Submit Documentation Feedback

Copyright © 2003–2014, Texas Instruments Incorporated

Product Folder Links: TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

TPS61020, TPS61024, TPS61025, TPS61026, TPS61027, TPS61028, TPS61029
www.ti.com

SLVS451G – SEPTEMBER 2003 – REVISED DECEMBER 2014

System Examples (continued)
C5

VCC2 10 V
Unregulated
Auxiliary Output

DS1
C6
1 µF

0.1 µFL1
6.8 µH
Battery
Input

SW

C2
2.2 µF

VBAT
R1

C1
10 µF

VCC1 5 V
Boost Main Output

VOUT
C3
47 µF

EN
R5

FB

LBI
R2
PS

LBO

LBO

PGND

GND
List of Components:
U1 = TPS61027DRC1
L1 = EPCOS B82462-G4682
C3, C5, C6, = X7R,X5R Ceramic
C3 = Low ESR Tantalum
DS1 = BAT54STPS61027

Figure 26. Power Supply Solution With Auxiliary Positive Output Voltage

C5

DS1

VCC2 -5 V
Unregulated
Auxiliary Output

C6
1 µF

0.1 µFL1
6.8 µH
Battery
Input

SW

C2
2.2 µF

VBAT
C1
10 µF

R1

VCC1 5 V
Boost Main Output

VOUT
C3
47 µF

EN
FB

LBI

R5

R2
PS
GND
List of Components:
U1 = TPS61027DRC
L1 = EPCOS B82462-G4682
C1, C2, C5, C6 = X7R,X5R Ceramic
C3 = Low ESR Tantalum
DS1 = BAT54S

LBO

LBO

PGND
TPS61027

Figure 27. Power Supply Solution With Auxiliary Negative Output Voltage

Copyright © 2003–2014, Texas Instruments Incorporated

Submit Documentation Feedback

Product Folder Links: TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

19

TPS61020, TPS61024, TPS61025, TPS61026, TPS61027, TPS61028, TPS61029
SLVS451G – SEPTEMBER 2003 – REVISED DECEMBER 2014

www.ti.com

12 Power Supply Recommendations
This input supply should be well regulated with the rating of TPS6102x. If the input supply is located more than a
few inches from the device, additional bulk capacitance may be required in addition to the ceramic bypass
capacitors. An electrolytic or tantalum capacitor with a value of 47 μF is a typical choice.

13 Layout13.1 Layout Guidelines
As for all switching power supplies, the layout is an important step in the design, especially at high peak currents
and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems aswell as EMI problems. Therefore, use wide and short traces for the main current path and for the power groundtracks. Use a common ground node for power ground and a different one for control ground to minimize theeffects of ground noise. Connect these ground nodes at any place close to one of the ground pins of the IC. The
most critical current path for all boost converters is from the switching FET, through the synchronous FET, thenthe output capacitors, and back to ground of the switching FET. Therefore, both output capacitors and theirtraces should be placed on the same board layer as close as possible between the IC’s VOUT and PGND pin.
Especially at output voltages above 4.5 V, adding an RC snubber from the SW pin to PGND pin may assist in
further reducing the parasitic inductance impact of this critical current path. Refer to the application report(SLVA255) for details of implementing a snubber. In addition, the input capacitor should be placed as close as
possible between the IC’s VBAT and PGND pin. Placing the inductor close to the SW pin with a wide but short
trace helps to improve efficiency and minimize EMI. To lay out the control ground, it is recommended to use
short traces as well, separated from the power ground traces. This avoids ground shift problems that can occur
due to superimposition of power ground current and control ground current. The recommended layout is shownin Layout Example.

20

Submit Documentation Feedback

Copyright © 2003–2014, Texas Instruments Incorporated

Product Folder Links: TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

TPS61020, TPS61024, TPS61025, TPS61026, TPS61027, TPS61028, TPS61029
www.ti.com

SLVS451G – SEPTEMBER 2003 – REVISED DECEMBER 201413.2 Layout Example

Top Layer

xxx
Bottom Layer

VIA connect with Ground

VIA connect with LBO, LBI, EN

LBO Resistorx

Feedback
Resistors2

Feedback
Resistors1
x

Ground
x

xxxx

VOUT

x

OutputCapacitor

EN

VOUT

FB

LBO

PGND

SW

PS

xxxx
LBI

VBAT

VIN

GND

Input
Capacitor

ExposedThermal PAD

Groundx

Inductorx

LBI Resistor 2

LBI Resistor 1x

Figure 28. PCB Layout Recommendation

13.3 Thermal Considerations
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the powerdissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below.
• Improving the power dissipation capability of the PCB design• Improving the thermal coupling of the component to the PCB• Introducing airflow in the system
The maximum recommended junction temperature (TJ) of the TPS6102x devices is 125°C. The thermal
resistance of the 10-pin VSON 3 × 3 package (DRC) is RΘJA = 47.2°C/W, if the PowerPAD is soldered. Specified
regulator operation is assured to a maximum ambient temperature TA of 85°C. Therefore, the maximum power
dissipation is about 847 mW. More power can be dissipated if the maximum ambient temperature of theapplication is lower.
TJ(MAX) - TA 125°C - 85°C=
= 847 mW
PD(MAX) =RqJA
47.2°C / W(8)

Copyright © 2003–2014, Texas Instruments Incorporated

Submit Documentation Feedback

Product Folder Links: TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

21

TPS61020, TPS61024, TPS61025, TPS61026, TPS61027, TPS61028, TPS61029
SLVS451G – SEPTEMBER 2003 – REVISED DECEMBER 2014

www.ti.com

14 Device and Documentation Support
14.1 Device Support
14.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOTCONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHERALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

14.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 3. Related LinksPARTS

PRODUCT FOLDERSAMPLE & BUY

TECHNICALDOCUMENTS

TOOLS &SOFTWARE

SUPPORT &COMMUNITY

TPS61020

Click here

Click here

Click here

Click here

Click here

TPS61024

Click here

Click here

Click here

Click here

Click here

TPS61025

Click here

Click here

Click here

Click here

Click here

TPS61026

Click here

Click here

Click here

Click here

Click here

TPS61027

Click here

Click here

Click here

Click here

Click here

TPS61028

Click here

Click here

Click here

Click here

Click here

TPS61029

Click here

Click here

Click here

Click here

Click here

14.3 Trademarks
PowerPAD is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.

14.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

14.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.

15 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the mostcurrent data available for the designated devices. This data is subject to change without notice and revision ofthis document. For browser-based versions of this data sheet, refer to the left-hand navigation.

22

Submit Documentation Feedback

Copyright © 2003–2014, Texas Instruments Incorporated

Product Folder Links: TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029

PACKAGE OPTION ADDENDUM

www.ti.com

30-Sep-2014

PACKAGING INFORMATION
Orderable Device

Status(1)

Package Type Package Pins Package
Drawing
Qty

Eco Plan

Lead/Ball Finish

MSL Peak Temp

(2)

(6)

(3)

Op Temp (°C)

Device Marking(4/5)

TPS61020DRCR

ACTIVE

VSON

DRC

10

3000

Green (RoHS& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 85

BDR

TPS61020DRCRG4ACTIVE

VSON

DRC

10

3000

Green (RoHS& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 85

BDR

TPS61024DRCR

ACTIVE

VSON

DRC

10

3000

Green (RoHS& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 85

BDS

TPS61024DRCRG4ACTIVE

VSON

DRC

10

3000

Green (RoHS& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 85

BDS

TPS61025DRCR

ACTIVE

VSON

DRC

10

3000

Green (RoHS& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 85

BDT

TPS61025DRCRG4ACTIVE

VSON

DRC

10

3000

Green (RoHS& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 85

BDT

TPS61026DRCR

ACTIVE

VSON

DRC

10

3000

Green (RoHS& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 85

BRD

TPS61026DRCTACTIVE

VSON

DRC

10

250

Green (RoHS& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 85

BRD

TPS61026DRCTG4ACTIVE

VSON

DRC

10

250

Green (RoHS& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 85

BRD

TPS61027DRCR

ACTIVE

VSON

DRC

10

3000

Green (RoHS& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 85

BDU

TPS61027DRCRG4ACTIVE

VSON

DRC

10

3000

Green (RoHS& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 85

BDU

TPS61027DRCRSYACTIVE

VSON

DRC

10

3000

Green (RoHS& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 85

BDU

TPS61028DRCR

ACTIVE

VSON

DRC

10

3000

Green (RoHS& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 85

BNE

TPS61028DRCRG4ACTIVE

VSON

DRC

10

3000

Green (RoHS& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 85

BNE

TPS61029DRCR

ACTIVE

VSON

DRC

10

3000

Green (RoHS& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 85

BRF

TPS61029DRCRG4ACTIVE

VSON

DRC

10

3000

Green (RoHS& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 85

BRF

TPS61029DRCTACTIVE

VSON

DRC

10

250

Green (RoHS& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 85

BRF

Addendum-Page 1

SamplesPACKAGE OPTION ADDENDUM

www.ti.com

Orderable Device

30-Sep-2014

Status(1)

TPS61029DRCTG4

Package Type Package Pins Package
Drawing
Qty

ACTIVE

VSON

DRC

10

250

Eco Plan

Lead/Ball Finish

MSL Peak Temp

(2)

(6)

(3)

Green (RoHS& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAROp Temp (°C)

Device Marking(4/5)-40 to 85

BRF

(1)

The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weightin homogeneous material)(3)

MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)

Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuationof the previous line and the two combined represent the entire Device Marking for that device.
(6)

Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TPS61029 :Addendum-Page 2

SamplesPACKAGE OPTION ADDENDUM

www.ti.com

30-Sep-2014• Automotive: TPS61029-Q1
NOTE: Qualified Version Definitions:• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

Addendum-Page 3

PACKAGE MATERIALS INFORMATION
www.ti.com

24-Jul-2015

TAPE AND REEL INFORMATION*All dimensions are nominal

DevicePackage Package Pins
Type Drawing

SPQ

Reel
Reel
A0
Diameter Width (mm)(mm) W1 (mm)

B0
(mm)

K0
(mm)

P1
(mm)

W
Pin1
(mm) Quadrant

TPS61020DRCR

VSON

DRC

10

3000

330.0

12.4

3.3

3.3

1.1

8.0

12.0

Q2

TPS61020DRCR

VSON

DRC

10

3000

330.0

TPS61024DRCR

VSON

DRC

10

3000

330.0

12.4

3.3

3.3

1.1

8.0

12.0

Q2

12.4

3.3

3.3

1.1

8.0

12.0

TPS61025DRCR

VSON

DRC

10

3000

Q2

330.0

12.4

3.3

3.3

1.1

8.0

12.0

TPS61026DRCR

VSON

DRC

10

Q2

3000

330.0

12.4

3.3

3.3

1.1

8.0

12.0

Q2

TPS61026DRCT

VSON

DRC

10

250

180.0

12.4

3.3

3.3

1.1

8.0

12.0

Q2

TPS61027DRCR

VSON

DRC

10

3000

330.0

12.4

3.3

3.3

1.1

8.0

12.0

Q2

TPS61028DRCR

VSON

DRC

10

3000

330.0

12.4

3.3

3.3

1.1

8.0

12.0

Q2

TPS61029DRCR

VSON

DRC

10

3000

330.0

12.4

3.3

3.3

1.1

8.0

12.0

Q2

TPS61029DRCT

VSON

DRC

10

250

180.0

12.4

3.3

3.3

1.1

8.0

12.0

Q2

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION
www.ti.com

24-Jul-2015*All dimensions are nominal

DevicePackage Type

Package Drawing

Pins

SPQ

Length (mm)Width (mm)Height (mm)TPS61020DRCR

VSON

DRC

10

3000

367.0

367.0

35.0

TPS61020DRCR

VSON

DRC

10

3000

367.0

367.0

35.0

TPS61024DRCR

VSON

DRC

10

3000

367.0

367.0

35.0

TPS61025DRCR

VSON

DRC

10

3000

367.0

367.0

35.0

TPS61026DRCR

VSON

DRC

10

3000

367.0

367.0

35.0

TPS61026DRCT

VSON

DRC

10

250

210.0

185.0

35.0

TPS61027DRCR

VSON

DRC

10

3000

367.0

367.0

35.0

TPS61028DRCR

VSON

DRC

10

3000

338.0

355.0

50.0

TPS61029DRCR

VSON

DRC

10

3000

367.0

367.0

35.0

TPS61029DRCT

VSON

DRC

10

250

210.0

185.0

35.0

Pack Materials-Page 2

IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and otherchanges to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of salesupplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products andapplications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, orother intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of thethird party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alterationand is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altereddocumentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards whichanticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the useof any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is tohelp enable customers to design and create their own end-product solutions that meet applicable functional safety standards andrequirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use inmilitary/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal andregulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use ofnon-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products

Applications

Audio

www.ti.com/audio

Automotive and Transportation

www.ti.com/automotive

Amplifiers

amplifier.ti.com

Communications and Telecom

www.ti.com/communications

Data Converters

dataconverter.ti.com

Computers and Peripherals

www.ti.com/computers

DLP® Products

www.dlp.com

Consumer Electronics

www.ti.com/consumer-apps

DSP

dsp.ti.com

Energy and Lighting

www.ti.com/energy

Clocks and Timers

www.ti.com/clocks

Industrial

www.ti.com/industrial

Interfaceinterface.ti.com

Medicalwww.ti.com/medical

Logic

logic.ti.com

Security

www.ti.com/security

Power Mgmt

power.ti.com

Space, Avionics and Defense

www.ti.com/space-avionics-defense

Microcontrollers

microcontroller.ti.com

Video and Imaging

www.ti.com/video

RFID

www.ti-rfid.com

OMAP Applications Processors

www.ti.com/omap

TI E2E Community

e2e.ti.com

Wireless Connectivity

www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated