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Z Series
The Z Series family of high-density, board-to-board or flex circuit stacking
applications is unique, offering users a reliable one-piece contact system. Its
solder-less interconnect is compressed or “sandwiched” under pressure between
parallel printed wiring boards or between a printed wiring board and otherelectronic components such as an IC or multichip module.

• 0.050” staggered grid array• Up to 400 contacts per square inch
• BeCu contacts for reliable mating• Standard heights from 0.100” to 0.350”• Custom configurations available to meet your specific design needs.

www.airborn.com
1(512 ) 863-5585

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Z Series

DIMENSIONS

Vertical Compression(Z-axis), Open-Pin Field

Contact spacing: 0.050” (1.27 mm)
A high-density, open-field, verticallycompressed connector utilizing a patented z-axis
contact system configured for between-board(board-to-board) compression applications.

Sample Part Number Format: RZ250-320-115-1000

RZSERIES
Vertical(Z-Axis)
Compression
Multi-Rows0.050” SpacingOpen-Field

HEIGHT
100 – 0.100”
150 – 0.150”
200 – 0.200”
250 – 0.250”
300 – 0.300”
350 – 0.350”

COLUMNS
10 – 10 Columns
15 – 15 Columns
20 – 20 Columns
25 – 25 Columns
ROWS
2 – 2 Rows
3 – 3 Rows
4 – 4 Rows
5 – 5 Rows
6 – 6 Rows
7 – 7 Rows

TYPE
00 – No polarization

PLATING5 – 50 µ” Au
3 – 30 µ” Au

CONTACT
11 – Double
compression

VARIATION
Blank – None
XXX – Consult
factory

HARDWARE
10 – Ø.090” Thru-hole
20 – Ø.050” Guide pin

PLEASE CONSULT THE AIRBORN WEBSITE FOR THE LATEST REVISION OF THIS DOCUMENT PRIOR TO BEGINNING ANY DESIGN WORK.

MATED HEIGHT

Mated height is defined as the space between the hardware clamping surfaces (top hardwaresurface to bottom hardware surface.) See Table 1.

MATERIALS and FINISHES

Contact: ����������������������������������������������������������������� BeCu C17200 per ASTM B194 (brush alloy 190)
Contact Finish: �������������������������������������Gold per ASTM B488 over nickel per SAE AMS-QQ-N-290
Molded Insulator: ��������������������������������� Glass-filled polyphenylene sulfide (PPS) per MIL-M-24519
Hardware: . . . . . . . . . . . . . .  Stainless steel per ASTM A582/582M, passivated per SAE AMS-2700

NOTE: AirBorn can manufacture special configurations to your exact specifications.

PERFORMANCESI DATA – Differential 100 Ohm
1Diff. Insertion Loss		

3.0 GHz @ -3 dB

2Diff. Return Loss		

1.0 GHz @ -20 dB

3NEXT		

2.0 GHz @ -50 dB

4FEXT		

2.0 GHz @ -48 dB

Contact Compression: ���������������������������������������������� 0.010 inches per side (nominal) for 0.100” and0.150” connector heights; 0.015” per side (nominal)
for 0.200”, 0.250”, 0.300” and 0.350” connector heights
Compression Force: �����������������������������������������25-40 grams per contact having a 0.010” deflection
35-50 grams per contact having a 0.015” deflection
Contact Wipe: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ≈0.007” for 0.100” and 0.150” connector heights≈0.014” for 0.200”, 0.250”, 0.300” and 0.350” connector heights
Current Rating: ��������������������������������������������������������������������������������������������������������������0.5 amperes
Contact Resistance: ������������������������������������������������0.025 ohms typical (contact height-dependent)
Operating Temperature: ����������������������������������������������������������������������������������������-65° C to +125° C
Insulation Resistance: �������������������������������������������������������� 5,000 megaohms minimum @ 100 VDC
Durability: ���������������������������������������������������������������������������������������������� 50 connector mating cycles
Dielectric Withstanding: ��������������������������������������������������250 VDC @ sea level, 100 VDC @ altitude

NOTE: Performance values are estimates at this time. Actual values will be determined when
final product testing is complete.

www.airborn.com(512 ) 863-5585

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Z SERIES DIMENSIONS
Guide Pin Hardware Option

PWB Layout (Recommended)

Note: All dimensions are in inches.

PWB-PLATED PAD RECOMMENDATIONS:
Board to be made in accordance with ANSI/EIA-616
Laminate material per MIL-P-13949, Type GFCopper foil thickness: 1 oz per square footPlate all surface features with 50 µ”, minimum, electrolytic hard gold over 50-150 µ” nickel.
(Optionally, plate all surface features with 50 µ”, minimum, electrolytic hard gold over 5-10 µ” of electrolytic soft gold over 100 µ”, minimum, nickel.)www.airborn.com
3(512 ) 863-5585

RZ-DIM-1C

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Z SERIES DIMENSIONS
Thru-Hole Hardware Option

PWB Layout (Recommended)

Note: All dimensions are in inches.

PWB-PLATED PAD RECOMMENDATIONS:Board to be made in accordance with ANSI/EIA-616
Laminate material per MIL-P-13949, Type GF
Copper foil thickness: 1 oz per square footPlate all surface features with 50 µ”, minimum, electrolytic hard gold over 50-150 µ” nickel.
(Optionally, plate all surface features with 50 µ”, minimum, electrolytic hard gold over 5-10 µ” of electrolytic soft gold over 100 µ”, minimum, nickel.)www.airborn.com(512 ) 863-5585

RZ-DIM-2C
4

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Z SERIES DRAWINGS
Board Footprint

PWB-PLATED PAD RECOMMENDATIONS:
Board to be made in accordance with ANSI/EIA-616
Laminate material per MIL-P-13949, Type GF
Copper foil thickness: 1 oz per square footPlate all surface features with 50 µ”, minimum, electrolytic hard gold over 50-150 µ” nickel.
(Optionally, plate all surface features with 50 µ”, minimum, electrolytic hard gold over 5-10 µ” of electrolytic soft gold over 100 µ”, minimum, nickel.)www.airborn.com
5(512 ) 863-5585

RZ-PCB-1A