|

INTERFACE AND CONNECTIVITY|MEMORY AND LOGIC

PCIe Payload Cardwith Rapid IO Bridge

RapidIO® Switches and Bridges|• Serial RapidIO Error Management Extension support including
Time-to-Live enables fault-tolerant systems• VITA 41, OpenVPX, and ATCA fabric mappings enable rapid
development of modular, standards-based systems

POWER MANAGEMENT

x86
CPU

Tsi721
PCIe2 to S-RIO2

x86
CPU

Tsi721
PCIe2 to S-RIO2|

TIMING AND SYNCHRONIZATION

Integrated DeviceTechnology
ANALOG AND RF

CPS-1432

S-RIO Switch
14x1,14x2,
8x4|

IDT RapidIO Switches, VME Interconnect, and Host Bridges

INTERFACE AND CONNECTIVITY|• True peer-to-peer networking allows scaling of arbitrary topology
and simplifies hot swap software implementation

18x1,18x2, 12x4

• Per-port filter feature allows blocking errant packets or malicious
attack (for example, denial of service, system memory reads
and writes)

PowerPC
PowerPC
Power
PC
C
CPU
CPU

|

POWER MANAGEMENT|

TIMING AND SYNCHRONIZATIONCOMMUNICATIONS

CPS-1848

PowerPCCPUMEMORY AND LOGIC

CPS-1848

18x1,18x2, 12x4

All RapidIO
Payload Card

ANALOG AND RF

Switching and Bridging Solutions

IDT RapidIO, VME, and EHB Switches and Bridges

Integrated DeviceTechnology

CPS-1432

S-RIO Switch
14x1,14x2,
8x4

CPS-1848

18x1,18x2, 12x4

Typical Application

ECOSYSTEM AND TOOLSA variety of software tools, and hardware platforms are available
from third party companies which support IDT RapidIO Switches.

SOFTWARE AND HARDWARE ECOSYSTEM• Serial RapidIO Development Platform Gen2 (SRDP2)• RapidFET JTAG edition software support• Serial RapidIO Gen2 Endpoint Intellectual Property for ASIC,
CPU, DSP, and FPGAs

DEFENSE• RapidIO Linux support• Power Calculator tool
• IBIS-AMI and IBIS models

INDUSTRIAL AUTOMATION• System Modeling Tool

RapidIO
Generations

S-RIO 1.3

S-RIO 2.1

Part
Numbers

Ports

Bandwidth

MEDICAL IMAGING

Features

TSI5788x4/16x1

80 Gbps

10 Gbps per port, 110 ns cut though latency, <500mW per 10 Gbps, 27x27 FCBGATSI577

4x4/16x1

40 Gbps

10 Gbps per port, 110 ns cut though latency, <500mW per 10 Gbps, 21x21 FCBGATSI5744x4/8x1

40 Gbps

10 Gbps per port, 110 ns cut though latency, <500mW per 10 Gbps, 21x21 FCBGATSI572

4x2/8x1

30 Gbps

10 Gbps per port, 110 ns cut though latency, <500mW per 10 Gbps, 21x21 FCBGACPS-1848

12x4/18x2/18x1

240 Gbps

20 Gbps per port, 100 ns cut though latency, <300mW per 10 Gbps, 29x29 FCBGACPS-1432

8x4/14x2/14x1

160 Gbps

20 Gbps per port, 100 ns cut though latency, <385mW per 10 Gbps, 25x25 FCBGACPS-1616

4x4/8x2/16x1

80 Gbps

20 Gbps per port, 100 ns cut though latency, <440mW per 10 Gbps, 21x21 FCBGASPS-1616

4x4/8x2/16x1

80 Gbps

20 Gbps per port, 100 ns cut though latency, <440mW per 10 Gbps, 21x21 FCBGA, Security

TSI721

2x4/2x2/2x1

16 Gbps

PCIe Gen2 to S-RIO Gen2 Bridge, 8 DMA and Messaging Channels, 2W 300ns store andforward latency, 13x13 FCGBA

Visit us on the web: www.idt.com

For technical or marketing support
http://idt.com/support/technical-support

DISCLAIMER Integrated Device Technology, Inc. (IDT) and its subsidiaries reserve the right to modify the products and/or specifications described herein at any time and at IDT’s sole discretion. All information in this document, including descriptions of product features and performance, is subject to change without notice. Performance specifications and the operating parametersof the described products are determined in the independent state and are not guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT’s products for any particular purpose, an implied
warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any third parties. IDT’s products are not intended for use in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably
expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.
Integrated Device Technology, IDT and the IDT logo are registered trademarks of IDT. Other trademarks and service marks used herein, including protected names, logos and designs, are the property of IDT or their respective third party owners. © Copyright 2014. All rights reserved.

IDT | THE ANALOG + DIGITAL COMPANY

IDT is the industry leader
in SRIO, VME, and EHB
switching and bridging
technology. Our chips set
the standard in Military,
Aerospace, Communication,and Industrial segments foreach of these product lines.
With strong technical support,
established products and longterm proven technology, IDT
is the pre-eminent company
in SRIO, VME and EHB
switching and bridging.

RAPIDIO SWITCHES AND BRIDGES – With performance up to 20Gbps per-port throughput and theability to scale to thousands of processors over any topology, open-standard RapidIO is the embedded
fabric of choice. IDT offers RapidIO Gen1 and Gen2 switch families. This sub-microsecond interconnect (100ns switch latency), with its specification-standard backplane support, enables high performance computing and carrier-class wireless infrastructure. Military, aerospace, and industrial control
systems benefit from RapidIO’s hot-swap support and fault tolerance in these mission critical systems.
Green microserver and storage systems leverage RapidIO’s best power efficiency (as low as 300mW /10Gbps) and hardware-based RDMA and Messaging. In datacenter-class systems, any processor canbe supported. Even x86 can take advantage of the RapidIO network when connected via IDT’s PCIe-toSRIO bridge devices.
VME INTERCONNECT – IDT is the market leader in VME Interconnect technology with more than twenty
years experience in providing VME solutions and technical support to the embedded systems industry.
The VME System Interconnect products, such as IDT TSI148, dominate the VME market and enhance
the performance of traditional VME-based applications for military, communications, industrial automation, and medical imaging. IDT’s VME bridges provide a high performance, direct connect interface
between the VMEbus backplane and the local PCI bus. The VME bridges are ideally suited for processor
and peripheral I/O boards that function as both a master and slave in the VMEbus system.
EHB – Embedded Host Bridges (EHB) by IDT play a critical system role acting as a hub between thehost processor, the system memory, and the system input/output (I/O).Through the host bridge, the hostprocessor is able to configure and effectively manage the system I/O resources. The host processor
and the system I/O peripherals both use the host bridge to access common system memory.

OV_SRIO_VME_EHB_REVA0414

IDT SRIO/VME/EHB OVERVIEW 4

IDT | THE ANALOG + DIGITAL COMPANYIDT SRIO/VME/EHB OVERVIEW 1

IDT RapidIO, VME, and EHB Switches and Bridges

Integrated Device Technology

PACKAGE KEY
Package
Code

JEDEC ID

Class

2.33

24

M-034

Plastic

37.50

2.33

21

MO-151

Plastic

35.00

35.00

2.33

24

M-034

Plastic

1.27

37.50

37.50

2.33

21

MO-151

Plastic

L

1.00

17.00

17.00

1.61

90

MO-151

Plastic

Green

LV

1.00

17.00

17.00

1.61

90

MO-151

Plastic

PBGA
23.0 X 23.0 MM
1.0 MM Pitch

Green

LV

1.00

23.00

23.00

2.03

60

MS-034

Plastic

456

PBGA
27mm x 27mm
1.0mm Pitch

Pb

L

1.00

27.00

27.00

2.65

40

MS-034

Plastic

PBGA

456

PBGA
27mm x 27mm
1.0mm Pitch

RoHS

LY

1.00

27.00

27.00

2.65

40

MS-034

Plastic

BG256

PBGA

256

PBGA
27mm x 27mm
1.27mm Pitch

Pb

E

1.27

27.00

27.00

2.00

40

MO-151

Plastic

BG313

PBGA

313

PBGA
35mm x 35mm
1.27mm Pitch

Pb

E

1.27

35.00

35.00

2.30

24

MS-034

Plastic

BGG256

PBGA

256

PBGA
27mm x 27mm
1.27mm Pitch

Green

EV

1.27

27.00

27.00

2.00

40

MO-151

Plastic

BGG313

PBGA

313

PBGA
35mm x 35mm
1.27mm Pitch

Green

EV

1.27

35.00

35.00

2.30

24

MS-034

Plastic

HC503

FCBGA

503

Flip Chip BGA
33mm x 33mm

Pb

E

1.27

33.00

33.00

2.75

24

—

Plastic

HM1023

FCBGA

1023

Flip Chip BGA
33mm x 33mm
1.0mm Pitch

Pb

L

1.00

33.00

33.00

2.00

24

—

Plastic

RC503

FCBGA

503

Flip Chip BGA
33mm x 33mm

RoHS

EY

1.27

33.00

33.00

2.75

24

—

Plastic

RM1023

FCBGA

1023

Flip Chip BGA
33mm x 33mm
1.0mm Pitch

RoHS

LY

1.00

33.00

33.00

2.00

24

—

Plastic

Pin
Count

Description

AE420

TEPBGA420

AE480

TEPBGAAEG420

Pb/RoHS/
Green

Top
Mark

Thermal35mm x 35mm
1.27mm Pitch

Pb

480

Thermal37.5mm x 37.5mm
1.27mm Pitch

TEPBGA420

AER480TEPBGA

AM256

Pitch (mm)Length
(mm)

Width
(mm)

Thickness
(mm)

E

1.27

35.00

35.00

Pb

E

1.27

37.50

Thermal35mm x 35mm
1.27mm Pitch

Green

EV

1.27

480

Thermal37.5mm x 37.5mm
1.27mm Pitch

RoHS

EY

PBGA

256

PBGA
17mm x 17mm
1.0mm Pitch

Pb

AMG256

PBGA

256

PBGA
17mm x 17mm
1.0mm Pitch

AMG376

PBGA

376

BB456

PBGA

BBR456

Use forPackage Search

HOST BRIDGES (EHB) – The IDT Host Bridge product family support the PowerQUICC and PowerPC
processor families. The host bridge is the central component that interconnects the processor with thesystem memory (DRAM and FLASH) and a wide range of I/O peripheral devices that reside on the PCI/X
Bus. They also contain integrated DMA controllers so the task of moving data within the system can beoffloaded from the processor.

VME FEATURES AND BENEFITS• VMEbus bridge products support the
VME64, VME64 Extension, and 2eSST
standards, enabling data transfer rates
up to 320Mbytes/s.
• Local bus, support exists for a 33MHz,
32-bit PCI bus up to a 133MHz, 64-bit
PCI-X bus.

VME INTERCONNECT – The Universe II (CA91C142D) is fully compliant with the VME64 bus standard,
and is tailored to support advanced PCI processors and peripherals. With a zero-wait state implementation for write transactions, and the capability to support prefetch reads and multi-beat transactions,the Universe II provides high performance on the PCI bus and eases development of VMEbus systems
by providing direct connection to a local PCI bus. The device is ideally suited for CPU or peripheral
boards functioning as both master and slave in the VMEbus system. Bridging is accomplished througha decoupled architecture with independent FIFOs for inbound, outbound, and DMA traffic. System performance is enhanced by our efficient architecture, and throughput is maximized• Use of a companion bridge such as IDT’s
TSI384 alongside the TSI148 provides aneasy and straightforward solution to bridge
the latest generation of PCI Express enabled
processors to the VME bus.
• Three independent data paths (PCI to
VMEbus, VMEbus to PCI, and DMA) exist ineach bridging solution to enable effective,
high-performance data transfers to occur
within the VME bus system.

The IDT Tsi148 device is the next-generation component in our industry leading, high performance VMEbus system interconnect product family and is fully compliant with the 2eSST and VME64 Extension
standards. This enables you to take advantage of the higher performance VME protocols, while preserving your existing investment in VME boards that implement legacy protocols.

• The VME bridges also contain complete
VMEbus system controller functionality
enabling single board computers to be
used within any slot in the VME system.

The Tsi148 increases a system’s usable bus bandwidth because its local bus interface is designed forthe next generation PCI/X processors and peripherals that support either a 66 MHz PCI bus or a 133 MHz
PCI-X bus interface. It also eases design constraints of VME Single Board Computers (SBCs) by requiring less board real estate and power than the previous generation of VME-to-PCI bridge components.

• Architecture allows customer flexibility
implementing system level software toensure the optimal VME bus performance.

HOST BRIDGES (EHB)
Part Number

Processor Bus

Memory Interface

PCI BusTemp. Range

Power Max (W)Pkg. CodeCA91L750

PowerPC (MPC7xx)
100MHzSDRAM - 100MHz—-40 to 85°C

1.5

AMG37623.0 x 23.0 x 2.03

CA91L8200B

PowerQUICC II (MPC82xx)
100MHzNA

66MHz/64 bit PCI;
66MHz/32-bit PCI

0 to 70°C

3

AE480, AER480

37.5 x 37.5 x 2.33

CA91L8260B

PowerQUICC II (MPC82xx)
100MHzNA

66MHz/64 bit PCI

0 to 70°C

1.9

AE420, AEG420

35.0 x 35.0 x 2.33

CA91L862A

PowerQUICC (MPC8xx)
50MHz

NA

33MHz/32-bit PCI-40 to 85°C

0.9

AM256, AMG256,
BG256, BGG256

17.0 x 17.0 x 1.61,
27.0 x 27.0 x 2.0

TSI108

PowerPC 7xx/7448
200MHzDDR2 - 400 MHz

133MHz/64-bit
PCI-X

0 to 70°C

3.7

HM1023, RM1023

33.0 x 33.0 x 2.0

TSI109PowerPC 7xx/7448
200MHzDDR2 - 400 MHz

133MHz/64-bit
PCI-X-40 to 85°C, 0 to 70°C

3.7

HM1023, RM1023

33.0 x 33.0 x 2.0

TSI110PowerPC 7xx/7448
167MHzDDR2 - 333 MHz

133MHz/64-bit
PCI-X

0 to 70°C

2.27

HM1023, RM1023

33.0 x 33.0 x 2.0

Package

VME INTERCONNECT
Part Number

VME Bus

PCI BusTemp. Range

Power Max (W)Pkg. CodePkg. Dimensions

CA91C142D

VME64

33MHz/64-bit PCI (5.0V)-55 to 125°C, -40 to 85°C, 0 to 70°C

3.2

BG313, BGG313

35.0 x 35.0 x 2.3

TSI148

VME64, 2eVME,
2eSST

133MHz/64-bit PCI-X
66MHz/64-bit PCI-40 to 85°C, 0 to 70°C

1.8

BB456, BBR456

27.0 x 27.0 x 2.65

2IDT | THE ANALOG + DIGITAL COMPANY

Dimensions

Devices
Per Tray /Tube

Package
Description

Pb - RoHS 5, may contain Lead > 1000 PPM | RoHS - RoHS 6, Flip Chip may have Lead (Pb) Solder Bumps | Green - RoHS 6, Lead (Pb) < 100PPMIDT SRIO/VME/EHB OVERVIEW 3IDT RapidIO, VME, and EHB Switches and Bridges

Integrated Device Technology

PACKAGE KEY
Package
Code

JEDEC ID

Class

2.33

24

M-034

Plastic

37.50

2.33

21

MO-151

Plastic

35.00

35.00

2.33

24

M-034

Plastic

1.27

37.50

37.50

2.33

21

MO-151

Plastic

L

1.00

17.00

17.00

1.61

90

MO-151

Plastic

Green

LV

1.00

17.00

17.00

1.61

90

MO-151

Plastic

PBGA
23.0 X 23.0 MM
1.0 MM Pitch

Green

LV

1.00

23.00

23.00

2.03

60

MS-034

Plastic

456

PBGA
27mm x 27mm
1.0mm Pitch

Pb

L

1.00

27.00

27.00

2.65

40

MS-034

Plastic

PBGA

456

PBGA
27mm x 27mm
1.0mm Pitch

RoHS

LY

1.00

27.00

27.00

2.65

40

MS-034

Plastic

BG256

PBGA

256

PBGA
27mm x 27mm
1.27mm Pitch

Pb

E

1.27

27.00

27.00

2.00

40

MO-151

Plastic

BG313

PBGA

313

PBGA
35mm x 35mm
1.27mm Pitch

Pb

E

1.27

35.00

35.00

2.30

24

MS-034

Plastic

BGG256

PBGA

256

PBGA
27mm x 27mm
1.27mm Pitch

Green

EV

1.27

27.00

27.00

2.00

40

MO-151

Plastic

BGG313

PBGA

313

PBGA
35mm x 35mm
1.27mm Pitch

Green

EV

1.27

35.00

35.00

2.30

24

MS-034

Plastic

HC503

FCBGA

503

Flip Chip BGA
33mm x 33mm

Pb

E

1.27

33.00

33.00

2.75

24

—

Plastic

HM1023

FCBGA

1023

Flip Chip BGA
33mm x 33mm
1.0mm Pitch

Pb

L

1.00

33.00

33.00

2.00

24

—

Plastic

RC503

FCBGA

503

Flip Chip BGA
33mm x 33mm

RoHS

EY

1.27

33.00

33.00

2.75

24

—

Plastic

RM1023

FCBGA

1023

Flip Chip BGA
33mm x 33mm
1.0mm Pitch

RoHS

LY

1.00

33.00

33.00

2.00

24

—

Plastic

Pin
Count

Description

AE420

TEPBGA420

AE480

TEPBGAAEG420

Pb/RoHS/
Green

Top
Mark

Thermal35mm x 35mm
1.27mm Pitch

Pb

480

Thermal37.5mm x 37.5mm
1.27mm Pitch

TEPBGA420

AER480TEPBGA

AM256

Pitch (mm)Length
(mm)

Width
(mm)

Thickness
(mm)

E

1.27

35.00

35.00

Pb

E

1.27

37.50

Thermal35mm x 35mm
1.27mm Pitch

Green

EV

1.27

480

Thermal37.5mm x 37.5mm
1.27mm Pitch

RoHS

EY

PBGA

256

PBGA
17mm x 17mm
1.0mm Pitch

Pb

AMG256

PBGA

256

PBGA
17mm x 17mm
1.0mm Pitch

AMG376

PBGA

376

BB456

PBGA

BBR456

Use forPackage Search

HOST BRIDGES (EHB) – The IDT Host Bridge product family support the PowerQUICC and PowerPC
processor families. The host bridge is the central component that interconnects the processor with thesystem memory (DRAM and FLASH) and a wide range of I/O peripheral devices that reside on the PCI/X
Bus. They also contain integrated DMA controllers so the task of moving data within the system can beoffloaded from the processor.

VME FEATURES AND BENEFITS• VMEbus bridge products support the
VME64, VME64 Extension, and 2eSST
standards, enabling data transfer rates
up to 320Mbytes/s.
• Local bus, support exists for a 33MHz,
32-bit PCI bus up to a 133MHz, 64-bit
PCI-X bus.

VME INTERCONNECT – The Universe II (CA91C142D) is fully compliant with the VME64 bus standard,
and is tailored to support advanced PCI processors and peripherals. With a zero-wait state implementation for write transactions, and the capability to support prefetch reads and multi-beat transactions,the Universe II provides high performance on the PCI bus and eases development of VMEbus systems
by providing direct connection to a local PCI bus. The device is ideally suited for CPU or peripheral
boards functioning as both master and slave in the VMEbus system. Bridging is accomplished througha decoupled architecture with independent FIFOs for inbound, outbound, and DMA traffic. System performance is enhanced by our efficient architecture, and throughput is maximized• Use of a companion bridge such as IDT’s
TSI384 alongside the TSI148 provides aneasy and straightforward solution to bridge
the latest generation of PCI Express enabled
processors to the VME bus.
• Three independent data paths (PCI to
VMEbus, VMEbus to PCI, and DMA) exist ineach bridging solution to enable effective,
high-performance data transfers to occur
within the VME bus system.

The IDT Tsi148 device is the next-generation component in our industry leading, high performance VMEbus system interconnect product family and is fully compliant with the 2eSST and VME64 Extension
standards. This enables you to take advantage of the higher performance VME protocols, while preserving your existing investment in VME boards that implement legacy protocols.

• The VME bridges also contain complete
VMEbus system controller functionality
enabling single board computers to be
used within any slot in the VME system.

The Tsi148 increases a system’s usable bus bandwidth because its local bus interface is designed forthe next generation PCI/X processors and peripherals that support either a 66 MHz PCI bus or a 133 MHz
PCI-X bus interface. It also eases design constraints of VME Single Board Computers (SBCs) by requiring less board real estate and power than the previous generation of VME-to-PCI bridge components.

• Architecture allows customer flexibility
implementing system level software toensure the optimal VME bus performance.

HOST BRIDGES (EHB)
Part Number

Processor Bus

Memory Interface

PCI BusTemp. Range

Power Max (W)Pkg. CodeCA91L750

PowerPC (MPC7xx)
100MHzSDRAM - 100MHz—-40 to 85°C

1.5

AMG37623.0 x 23.0 x 2.03

CA91L8200B

PowerQUICC II (MPC82xx)
100MHzNA

66MHz/64 bit PCI;
66MHz/32-bit PCI

0 to 70°C

3

AE480, AER480

37.5 x 37.5 x 2.33

CA91L8260B

PowerQUICC II (MPC82xx)
100MHzNA

66MHz/64 bit PCI

0 to 70°C

1.9

AE420, AEG420

35.0 x 35.0 x 2.33

CA91L862A

PowerQUICC (MPC8xx)
50MHz

NA

33MHz/32-bit PCI-40 to 85°C

0.9

AM256, AMG256,
BG256, BGG256

17.0 x 17.0 x 1.61,
27.0 x 27.0 x 2.0

TSI108

PowerPC 7xx/7448
200MHzDDR2 - 400 MHz

133MHz/64-bit
PCI-X

0 to 70°C

3.7

HM1023, RM1023

33.0 x 33.0 x 2.0

TSI109PowerPC 7xx/7448
200MHzDDR2 - 400 MHz

133MHz/64-bit
PCI-X-40 to 85°C, 0 to 70°C

3.7

HM1023, RM1023

33.0 x 33.0 x 2.0

TSI110PowerPC 7xx/7448
167MHzDDR2 - 333 MHz

133MHz/64-bit
PCI-X

0 to 70°C

2.27

HM1023, RM1023

33.0 x 33.0 x 2.0

Package

VME INTERCONNECT
Part Number

VME Bus

PCI BusTemp. Range

Power Max (W)Pkg. CodePkg. Dimensions

CA91C142D

VME64

33MHz/64-bit PCI (5.0V)-55 to 125°C, -40 to 85°C, 0 to 70°C

3.2

BG313, BGG313

35.0 x 35.0 x 2.3

TSI148

VME64, 2eVME,
2eSST

133MHz/64-bit PCI-X
66MHz/64-bit PCI-40 to 85°C, 0 to 70°C

1.8

BB456, BBR456

27.0 x 27.0 x 2.65

2IDT | THE ANALOG + DIGITAL COMPANY

Dimensions

Devices
Per Tray /Tube

Package
Description

Pb - RoHS 5, may contain Lead > 1000 PPM | RoHS - RoHS 6, Flip Chip may have Lead (Pb) Solder Bumps | Green - RoHS 6, Lead (Pb) < 100PPMIDT SRIO/VME/EHB OVERVIEW 3|

INTERFACE AND CONNECTIVITY|MEMORY AND LOGIC

PCIe Payload Cardwith Rapid IO Bridge

RapidIO® Switches and Bridges|• Serial RapidIO Error Management Extension support including
Time-to-Live enables fault-tolerant systems• VITA 41, OpenVPX, and ATCA fabric mappings enable rapid
development of modular, standards-based systems

POWER MANAGEMENT

x86
CPU

Tsi721
PCIe2 to S-RIO2

x86
CPU

Tsi721
PCIe2 to S-RIO2|

TIMING AND SYNCHRONIZATION

Integrated DeviceTechnology
ANALOG AND RF

CPS-1432

S-RIO Switch
14x1,14x2,
8x4|

IDT RapidIO Switches, VME Interconnect, and Host Bridges

INTERFACE AND CONNECTIVITY|MEMORY AND LOGIC|

POWER MANAGEMENT|

TIMING AND SYNCHRONIZATION

CPS-1848

18x1,18x2, 12x4

CPS-1848

18x1,18x2, 12x4

• True peer-to-peer networking allows scaling of arbitrary topology
and simplifies hot swap software implementation• Per-port filter feature allows blocking errant packets or malicious
attack (for example, denial of service, system memory reads
and writes)

All RapidIO
Payload Card

ANALOG AND RF

Switching and Bridging Solutions

IDT RapidIO, VME, and EHB Switches and Bridges

Integrated DeviceTechnology

PowerPCCPU
PowerPC
PowerPC
Power
PC
C
CPU
CPU

CPS-1432

S-RIO Switch
14x1,14x2,
8x4

CPS-1848

18x1,18x2, 12x4

Typical Application

ECOSYSTEM AND TOOLSA variety of software tools, and hardware platforms are available
from third party companies which support IDT RapidIO Switches.

SOFTWARE AND HARDWARE ECOSYSTEM• Serial RapidIO Development Platform Gen2 (SRDP2)• RapidFET JTAG edition software support• Serial RapidIO Gen2 Endpoint Intellectual Property for ASIC,
CPU, DSP, and FPGAs

DEFENSE• RapidIO Linux support• Power Calculator tool
• IBIS-AMI and IBIS models• System Modeling Tool

RapidIO
Generations

S-RIO 1.3

S-RIO 2.1

Part
Numbers

Ports

Bandwidth

MEDICAL IMAGING

Features

TSI5788x4/16x1

80 Gbps

10 Gbps per port, 110 ns cut though latency, <500mW per 10 Gbps, 27x27 FCBGATSI577

4x4/16x1

40 Gbps

10 Gbps per port, 110 ns cut though latency, <500mW per 10 Gbps, 21x21 FCBGATSI5744x4/8x1

40 Gbps

10 Gbps per port, 110 ns cut though latency, <500mW per 10 Gbps, 21x21 FCBGATSI572

4x2/8x1

30 Gbps

10 Gbps per port, 110 ns cut though latency, <500mW per 10 Gbps, 21x21 FCBGACPS-1848

12x4/18x2/18x1

240 Gbps

20 Gbps per port, 100 ns cut though latency, <300mW per 10 Gbps, 29x29 FCBGACPS-1432

8x4/14x2/14x1

160 Gbps

20 Gbps per port, 100 ns cut though latency, <385mW per 10 Gbps, 25x25 FCBGACPS-1616

4x4/8x2/16x1

80 Gbps

20 Gbps per port, 100 ns cut though latency, <440mW per 10 Gbps, 21x21 FCBGASPS-1616

4x4/8x2/16x1

80 Gbps

20 Gbps per port, 100 ns cut though latency, <440mW per 10 Gbps, 21x21 FCBGA, Security

TSI721

2x4/2x2/2x1

16 Gbps

PCIe Gen2 to S-RIO Gen2 Bridge, 8 DMA and Messaging Channels, 2W 300ns store andforward latency, 13x13 FCGBA

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DISCLAIMER Integrated Device Technology, Inc. (IDT) and its subsidiaries reserve the right to modify the products and/or specifications described herein at any time and at IDT’s sole discretion. All information in this document, including descriptions of product features and performance, is subject to change without notice. Performance specifications and the operating parametersof the described products are determined in the independent state and are not guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT’s products for any particular purpose, an implied
warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any third parties. IDT’s products are not intended for use in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably
expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.
Integrated Device Technology, IDT and the IDT logo are registered trademarks of IDT. Other trademarks and service marks used herein, including protected names, logos and designs, are the property of IDT or their respective third party owners. © Copyright 2014. All rights reserved.

IDT | THE ANALOG + DIGITAL COMPANY

IDT is the industry leader
in SRIO, VME, and EHB
switching and bridging
technology. Our chips set
the standard in Military,
Aerospace, Communication,and Industrial segments foreach of these product lines.
With strong technical support,
established products and longterm proven technology, IDT
is the pre-eminent company
in SRIO, VME and EHB
switching and bridging.

RAPIDIO SWITCHES AND BRIDGES – With performance up to 20Gbps per-port throughput and theability to scale to thousands of processors over any topology, open-standard RapidIO is the embedded
fabric of choice. IDT offers RapidIO Gen1 and Gen2 switch families. This sub-microsecond interconnect (100ns switch latency), with its specification-standard backplane support, enables high performance computing and carrier-class wireless infrastructure. Military, aerospace, and industrial control
systems benefit from RapidIO’s hot-swap support and fault tolerance in these mission critical systems.
Green microserver and storage systems leverage RapidIO’s best power efficiency (as low as 300mW /10Gbps) and hardware-based RDMA and Messaging. In datacenter-class systems, any processor canbe supported. Even x86 can take advantage of the RapidIO network when connected via IDT’s PCIe-toSRIO bridge devices.
VME INTERCONNECT – IDT is the market leader in VME Interconnect technology with more than twenty
years experience in providing VME solutions and technical support to the embedded systems industry.
The VME System Interconnect products, such as IDT TSI148, dominate the VME market and enhance
the performance of traditional VME-based applications for military, communications, industrial automation, and medical imaging. IDT’s VME bridges provide a high performance, direct connect interface
between the VMEbus backplane and the local PCI bus. The VME bridges are ideally suited for processor
and peripheral I/O boards that function as both a master and slave in the VMEbus system.
EHB – Embedded Host Bridges (EHB) by IDT play a critical system role acting as a hub between thehost processor, the system memory, and the system input/output (I/O).Through the host bridge, the hostprocessor is able to configure and effectively manage the system I/O resources. The host processor
and the system I/O peripherals both use the host bridge to access common system memory.

OV_SRIO_VME_EHB_REVA0414

IDT SRIO/VME/EHB OVERVIEW 4

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