User's Manual

32

RX671 Group
Renesas Solution Starter Kit
Capacitive Touch Evaluation System
User’s Manual
RENESAS 32-Bit MCU
RX Family ⁄ RX600 Series

All information contained in these materials, including products and product specifications,represents information on the product at the time of publication and is subject to change byRenesas Electronics Corp. without notice. Please review the latest information published byRenesas Electronics Corp. through various means, including the Renesas Electronics Corp.
website (http://www.renesas.com).

www.renesas.com

Rev.1.10

Apr 2024

Notice1.

Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products
and application examples. You are fully responsible for the incorporation or any other use of the circuits, software, and information in the design of yourproduct or system. Renesas Electronics disclaims any and all liability for any losses and damages incurred by you or third parties arising from the use of
these circuits, software, or information.
2. Renesas Electronics hereby expressly disclaims any warranties against and liability for infringement or any other claims involving patents, copyrights, orother intellectual property rights of third parties, by or arising from the use of Renesas Electronics products or technical information described in thisdocument, including but not limited to, the product data, drawings, charts, programs, algorithms, and application examples.
3. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics orothers.
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manufacture, sales, utilization, distribution or other disposal of any products incorporating Renesas Electronics products, if required.
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and all liability for any losses or damages incurred by you or third parties arising from such alteration, modification, copying or reverse engineering.
6. Renesas Electronics products are classified according to the following two quality grades: “Standard” and “High Quality”. The intended applications foreach Renesas Electronics product depends on the product’s quality grade, as indicated below.
"Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; homeelectronic appliances; machine tools; personal electronic equipment; industrial robots; etc.
"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control (traffic lights); large-scale communication equipment; key
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Unless expressly designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas
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any and all liability for any damages or losses incurred by you or any third parties arising from the use of any Renesas Electronics product that isinconsistent with any Renesas Electronics data sheet, user’s manual or other Renesas Electronics document.
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hardware or software products, Renesas Electronics shall have absolutely no liability arising out of any vulnerability or security breach, including but notlimited to any unauthorized access to or use of a Renesas Electronics product or a system that uses a Renesas Electronics product. RENESASELECTRONICS DOES NOT WARRANT OR GUARANTEE THAT RENESAS ELECTRONICS PRODUCTS, OR ANY SYSTEMS CREATED USINGRENESAS ELECTRONICS PRODUCTS WILL BE INVULNERABLE OR FREE FROM CORRUPTION, ATTACK, VIRUSES, INTERFERENCE,
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IMPLIED WARRANTIES OF MERCHANTABILITY, OR FITNESS FOR A PARTICULAR PURPOSE.
8. When using Renesas Electronics products, refer to the latest product information (data sheets, user’s manuals, application notes, “General Notes for
Handling and Using Semiconductor Devices” in the reliability handbook, etc.), and ensure that usage conditions are within the ranges specified byRenesas Electronics with respect to maximum ratings, operating power supply voltage range, heat dissipation characteristics, installation, etc. Renesas
Electronics disclaims any and all liability for any malfunctions, failure or accident arising out of the use of Renesas Electronics products outside of suchspecified ranges.
9. Although Renesas Electronics endeavors to improve the quality and reliability of Renesas Electronics products, semiconductor products have specificcharacteristics, such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Unless designated as a high reliability
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are not subject to radiation resistance design. You are responsible for implementing safety measures to guard against the possibility of bodily injury,
injury or damage caused by fire, and/or danger to the public in the event of a failure or malfunction of Renesas Electronics products, such as safety
design for hardware and software, including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging
degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult and impractical, you areresponsible for evaluating the safety of the final products or systems manufactured by you.
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14. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas
Electronics products.
(Note1)(Note2)“Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly controlledsubsidiaries.
“Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
(Rev.5.0-1 October 2020)

Corporate Headquarters

Contact information

TOYOSU FORESIA, 3-2-24 Toyosu,
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Electronics Corporation. All trademarks and registered trademarks
are the property of their respective owners.

© 2024 Renesas Electronics Corporation. All rights reserved.

General Precautions in the Handling of Microprocessing Unit and Microcontroller
Unit Products
The following usage notes are applicable to all Microprocessing unit and Microcontroller unit products from Renesas. For detailed usage notes on the
products covered by this document, refer to the relevant sections of the document as well as any technical updates that have been issued for the products.
1.

Precaution against Electrostatic Discharge (ESD)
A strong electrical field, when exposed to a CMOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps
must be taken to stop the generation of static electricity as much as possible, and quickly dissipate it when it occurs. Environmental control must be
adequate. When it is dry, a humidifier should be used. This is recommended to avoid using insulators that can easily build up static electricity.
Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work benches and floors must be grounded. The operator must also be grounded using a wrist strap. Semiconductor devices must not betouched with bare hands. Similar precautions must be taken for printed circuit boards with mounted semiconductor devices.

2.

Processing at power-on
The state of the product is undefined at the time when power is supplied. The states of internal circuits in the LSI are indeterminate and the states ofregister settings and pins are undefined at the time when power is supplied. In a finished product where the reset signal is applied to the external resetpin, the states of pins are not guaranteed from the time when power is supplied until the reset process is completed. In a similar way, the states of pins in
a product that is reset by an on-chip power-on reset function are not guaranteed from the time when power is supplied until the power reaches the levelat which resetting is specified.

3.

Input of signal during power-off state
Do not input signals or an I/O pull-up power supply while the device is powered off. The current injection that results from input of such a signal or I/O
pull-up power supply may cause malfunction and the abnormal current that passes in the device at this time may cause degradation of internal elements.
Follow the guideline for input signal during power-off state as described in your product documentation.

4.

Handling of unused pins
Handle unused pins in accordance with the directions given under handling of unused pins in the manual. The input pins of CMOS products are
generally in the high-impedance state. In operation with an unused pin in the open-circuit state, extra electromagnetic noise is induced in the vicinity of
the LSI, an associated shoot-through current flows internally, and malfunctions occur due to the false recognition of the pin state as an input signal
become possible.

5.

Clock signals
After applying a reset, only release the reset line after the operating clock signal becomes stable. When switching the clock signal during program
execution, wait until the target clock signal is stabilized. When the clock signal is generated with an external resonator or from an external oscillator
during a reset, ensure that the reset line is only released after full stabilization of the clock signal. Additionally, when switching to a clock signal producedwith an external resonator or by an external oscillator while program execution is in progress, wait until the target clock signal is stable.

6.

Voltage application waveform at input pin
Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the CMOS device stays in the area between VIL (Max.)and VIH (Min.) due to noise, for example, the device may malfunction. Take care to prevent chattering noise from entering the device when the input levelis fixed, and also in the transition period when the input level passes through the area between VIL (Max.) and VIH (Min.).

7.

Prohibition of access to reserved addresses
Access to reserved addresses is prohibited. The reserved addresses are provided for possible future expansion of functions. Do not access theseaddresses as the correct operation of the LSI is not guaranteed.

8.

Differences between products
Before changing from one product to another, for example to a product with a different part number, confirm that the change will not lead to problems.
The characteristics of a microprocessing unit or microcontroller unit products in the same group but having a different part number might differ in terms ofinternal memory capacity, layout pattern, and other factors, which can affect the ranges of electrical characteristics, such as characteristic values,
operating margins, immunity to noise, and amount of radiated noise. When changing to a product with a different part number, implement a systemevaluation test for the given product.

How to Use This Manual
1. Purpose and Target ReadersThis is a manual for users to understand the outline and hardware functions of the RX671 Group
Capacitive Touch Evaluation System (RTK0EG0044S01001BJ). This manual is intended for users who
use this CPU board. A basic knowledge of electric circuits, logical circuits, and MCUs is necessary in order
to use this manual.
Particular attention should be paid to the precautionary notes when using the manual. These notes occur within
the body of the text, at the end of each section, and in the Usage Notes section.

The revision history summarizes the locations of revisions and additions. It does not list all revisions. Refer to thetext of the manual for details.

Renesas RTK0EG0044S01001BJ Disclaimer
By using this RTK0EG0044S01001BJ, the User accepts the following terms, which are in addition to, and control in the event of disagreement, with Renesas’
General Terms and Conditions available at https://www.renesas.com/en-us/legal/disclaimer.html.
The RTK0EG0044S01001BJ is not guaranteed to be error free, and the entire risk as to the results and performance of the RTK0EG0044S01001BJ is
assumed by the User. The RTK0EG0044S01001BJ is provided by Renesas on an “as is” basis without warranty of any kind whether express or implied,
including but not limited to the implied warranties of good workmanship, fitness for a particular purpose, title, merchantability, and non-infringement ofintellectual property rights. Renesas expressly disclaims any implied warranty.
Renesas does not consider the RTK0EG0044S01001BJ to be a finished product and therefore the RTK0EG0044S01001BJ may not comply with somerequirements applicable to finished products, including, but not limited to recycling, restricted substances and electromagnetic compatibility regulations.
Refer to Certifications section, for information about certifications and compliance information for the RTK0EG0044S01001BJ. It is the kit User’s responsibility
to make sure the kit meets any local requirements applicable to their region.
Renesas or its affiliates shall in no event be liable for any loss of profit, loss of data, loss of contract, loss of business, damage to reputation or goodwill, any
economic loss, any reprogramming or recall costs (whether the foregoing losses are direct or indirect) nor shall Renesas or its affiliates be liable for any otherdirect or indirect special, incidental or consequential damages arising out of or in relation to the use of this RTK0EG0044S01001BJ, even if Renesas or its
affiliates have been advised of the possibility of such damages.
Renesas has used reasonable care in preparing the information included in this document, but Renesas does not warrant that such information is error free
nor does Renesas guarantee an exact match for every application or parameter to part numbers designated by other vendors listed herein. The information
provided in this document is intended solely to enable the use of Renesas products. No express or implied license to any intellectual property right is grantedby this document or in connection with the sale of Renesas products. Renesas reserves the right to make changes to specifications and product descriptionsat any time without notice. Renesas assumes no liability for any damages incurred by you resulting from errors in or omissions from the information included
herein. Renesas cannot verify, and assumes no liability for, the accuracy of information available on another company’s website.

Precautions
This Evaluation Kit is only intended for use in a laboratory environment under ambient temperature and humidity conditions. A safe separation distanceshould be used between this and any sensitive equipment. Its use outside the laboratory, classroom, study area, or similar such area invalidates conformity
with the protection requirements of the Electromagnetic Compatibility Directive and could lead to prosecution.
The product generates, uses, and can radiate radio frequency energy and may cause harmful interference to radio communications. There is no guaranteethat interference will not occur in a particular installation. If this equipment causes harmful interference to radio or television reception, which can be
determined by turning the equipment off or on, you are encouraged to try to correct the interference by one or more of the following measures:• Ensure attached cables do not lie across the equipment.
• Reorient the receiving antenna.
• Increase the distance between the equipment and the receiver.
• Connect the equipment into an outlet on a circuit different from that which the receiver is connected.
• Power down the equipment when not in use.
• Consult the dealer or an experienced radio/TV technician for help.
Note: It is recommended that wherever possible shielded interface cables are used.
The product is potentially susceptible to certain EMC phenomena. To mitigate against them it is recommended that the following measures be undertaken:• The user is advised that mobile phones should not be used within 10 m of the product when in use.
• The user is advised to take ESD precautions when handling the equipment.
The Evaluation Kit does not represent an ideal reference design for an end product and does not fulfill the regulatory standards for an end product.

Safety Items
Definitions of Symbols
A variety of symbols are used in this document and on the product itself to prevent in advance danger toyou the user or any third parties and to prevent in advance damage to any physical property.
This section, Safety Items, presents these symbols and their meanings. It also presents safety notes toassure that this produce is used safely and correctly.
This product should only be used after fully understanding the material presented in this section.

Warning
CautionWarning items indicate things that, if not avoided, could lead to death orserious injury.
Caution items indicate both latent dangers that can lead to minor or moderately
severe injury and latent dangers that can lead to property damage if not
avoided.

In addition to the above two markings, the following are displayed at the same time if appropriate.
[Important] Indicates a point that can lead to equipment failure or malfunction if incorrectly set when setting
up this product.
A triangular mark △ indicates a warning or caution.
Example:The

Electrical Shock Hazard

mark indicates something that is forbidden.
Example:：Do Not Disassemble

Warning

Warning

Handling related warnings:
Do not disassemble or modify this product. Renesas does not guarantee this product if it
has been disassembled or modified.
The power supply for this product can be selected to be either the USB bus or a DC jack. A
jumper is used to select the power supply.
If, during either use or storage of this product, any abnormality in the product itself(including abnormal odors, heating, color changes, or shape changes to the product itself)
are observed, disconnect the USB cable and power supply cable immediately.
Installation:
Do not install this equipment in a location that has a high humidity or where water or otherfluids could get on it. This equipment may be damaged if water or other fluids could geton it.
Ambient temperature:
The upper limit for the ambient temperature under which this product may be used is
35°C.
This maximum rated ambient temperature must not be exceeded.

Caution

CautionHandling related cautions:
Use the antistatic band. Failure to do so could cause malfunction or unstable motion or bedamaged Internal components.
This product must be handled carefully. Do not drop, knock over, or apply any strong
mechanical shocks to this product.
When connecting or disconnecting cables from this product, hold the parts of the cableintended to be grasped (such as the plugs) and avoid putting stress on the cable. Do notpull on this product when it is connected to a communications cable or user system
connection cable. Stress on the cable can result in internal disconnections in the cable.
When connecting a cable to a connector, be careful not to insert the plug in the reverse
orientation. Reverse insertion can result in damage to this product itself or to connected
equipment.
The power supply for this product can be selected from two options (the DC jack or theUSB cable). The jumper JP4 (on the top side of the circuit board) is used to select thepower supply. Always check the jumper position before connecting a power source. An
incorrect jumper position can result in damage to this product or the PC connected over
the USB cable.
Do not handle this product with wet hands. This can lead to failure of the product.
Transport methods:
When transporting this product, use the product’s packing box and cushioning materials andship it with precision equipment handling. If the products packing is insufficient, it may bedamaged during shipping.
If it must be transported by some other method, pack it carefully as precision equipment.
When packing this product, always use the antistatic pouch included with this product.
If some other pouch is used, damage to the product may be caused by electrostatic
discharge.
Abnormal operation:
If operation of this product becomes abnormal due to interference from, for example,
external noise, apply the following procedure.
1. Turn off the power.
2. Wait 10 seconds and then turn the power back on.
Disposal:
When disposing of this product, handle it as industrial waste according to all applicablelaws.
European Union regulatory notices:

The WEEE （Waste Electrical and Electronic Equipment） regulations put
responsibilities on producers for the collection and recycling or disposal of electrical andelectronic waste. Return of WEEE under these regulations is applicable in the European
Union only. This equipment （including all accessories） is not intended for householduse. After use the equipment cannot be disposed of as household waste, and the WEEE
must be treated, recycled and disposed of in an environmentally sound manner. Renesas
Electronics Europe GmbH can take back end of life equipment, register for this service at“http://www.renesas.eu/weee”.

Electromagnetic Environment

Electromagnetic Environment
 This product generates electromagnetic emissions in an industrial environment. Use in a
residential environment may affect other equipment.
 This product requires special EMC precautions and should be used in accordance with the EMC
information provided below.

EMI: Electro Magnetic InterferenceStandard

Level

Guidance for EMC protection

Group1 Class A

This product has no intentional
external emissions, but internal
RF emissions may affect nearby
electromagnetically sensitiveelectronic equipment.

Test Item
EN 55011:2016/A1:2017/A2:2021

Radiated Emissions
Conducted Emissions

EMS: Electro Magnetic Susceptibility
Standard

Level

Radio Frequency
Electromagnetic Field

EN 61000-4-3:
2006/A1:2008/A2:2010

A*1

Electrical Fast Transient / Burst

EN 61000-4-4:2012

B*2

Surge

EN 61000-4-5:2014/A1:2017

B*3

Conducted Disturbance,
Induced by Radio Frequency

EN 61000-4-6:2014

A

Power Frequency
Magnetic Field

EN 61000-4-8:2010

A*5

Voltage Dips and Interruptions

EN IEC 61000-4-11:2020*4

B or C*6

Guidance for EMC protection

This product is intended for use inelectromagnetic environments inindustrial settings. The user of the
product should pay particularattention to the following
electromagnetic immunity.
・Power supply quality
・Protection against static electricity
・Protection against external highpower radio waves
・Protection against external
magnetic fields

*1

Test Condition of Radio Frequency Electromagnetic Field
Test Level
3V/m (80MHz - 1.0GHz)
3V/m (1.4GHz – 6.0GHz)

*2

*3

*4

*5

Modulation

Frequency
Step

Antenna
Polarization

1.0sec1kHz
AM 80%

1.0%

Horizontal/ Vertical

Test Condition of Electrical Fast Transient / Burst
Test Level

Wave Form±1.0kV

Rise time: 5.0nsec
Pulse Duration: 50nsec

Repetition
Frequency
5kHz

Testing
Duration
60sec

100kHzResultPass
Pass

Result
Pass
Pass

Test Condition of Surge
Test Level

Wave form Specification

Phase Angle±0.5kV

Front time: 1.2 / 8.0 μsec
Time to half value: 50 / 20 μsec

0º, 90º,180º, 270º

Test condition of Conducted Disturbance, Induced by Radio Frequency
Test Level

Dwell Time

Modulation

3V (0.15MHz – 80MHz)

1.0 sec

1kHz
AM 80%

ResultPass
Pass

Frequency
Step

Result

1.0%

Pass

Test Condition of Power Frequency Magnetic Field
Test Level

Applied Power Frequency
50Hz

3A/m (rms)*6

Dwell Time

60Hz

Test Duration
60sec

Result
Pass
Pass

Test Condition of Voltage Dips and Interruptions
Test Item

Voltage Dips

Voltage
Interruptions

Test Level
0%

Duration

Phase Angle

0.5 cycles
1.0 cycles

70%

25 cycles0%

250 cycles

ResultPass

0º, 180º

Pass
Pass
Pass

Table of Contents
Corporate Headquarters ........................................................................................................ 1
1.

Purpose and Target Readers........................................................................................ 2

1. Overview............................................................................................................................ 1
1.1
1.2
1.3
1.4

Purpose................................................................................................................................................1
Main Characteristics and Functions ......................................................................................................1
Board Specifications .............................................................................................................................2
Regulatory Compliance Notices ............................................................................................................3
1.4.1
European Union regulatory notices ..............................................................................................3

2. CPU Board......................................................................................................................... 4
2.1
2.2
2.3

System Block Diagram .........................................................................................................................4
Product Configuration ...........................................................................................................................5
Hardware Details ..................................................................................................................................6
2.3.1
Default Jumper Settings ..............................................................................................................6
2.3.2
MCU Operating Mode Settings ....................................................................................................7
2.3.3
Power Supply ..............................................................................................................................8
2.3.4
Clock Circuit ..............................................................................................................................10
2.3.5
Reset Circuit .............................................................................................................................11
2.3.6
Push Switch ..............................................................................................................................11
2.3.7
LEDs .........................................................................................................................................12
2.3.8
USB Serial Conversion ..............................................................................................................12
2.3.9
Debug Interface.........................................................................................................................122.3.10 Application Header ....................................................................................................................132.3.11 CTSU Related Circuits ..............................................................................................................142.3.12 Pmod Interface..........................................................................................................................14

3. Application Board (Self-Capacitance Electrode Board) ................................................... 16
3.1
3.2

Board Layout ......................................................................................................................................16
Application Headers ...........................................................................................................................16

4. Reference Materials......................................................................................................... 18
5. Additional Information ...................................................................................................... 19
Appendix: Self-Capacitance Touch Electrode Board Connection ........................................ 20

RX671 Group
Capacitive Touch Evaluation System User’s Manual

1.

Overview

1.1

PurposeThe RX671 Group Capacitive Touch Evaluation System (RTK0EG0044S01001BJ) is a kit created forevaluating the Renesas Electronics RX671 Group of MCUs. This manual describes the RX671 Cap Touch
Evaluation System’s hardware.

1.2

Main Characteristics and Functions

The main functions of the RX671 Group Capacitive Touch Evaluation System are as follows:•

Renesas Microcontroller programming and debugging
 E2/E2 Lite debugger connector•

General purpose switches and LEDs
Capacitive Touch Sensor (CTSUa)
 17 channels available
Pmod™ interface
 PMOD1: Pmod Type 2A, Type 3A, and Type 6A
 PMOD2: Pmod Type 2A

•

•

•

Connects to Renesas Capacitive Touch Evaluation System Application Board (option)
 Includes self-capacitance touch electrode application board

R12UZ0103EJ0110
Apr.26.24

Rev.1.10

Page 1 of 21

RX671 Group
Capacitive Touch Evaluation System User’s Manual

1.3

1.

Overview

Board Specifications

Table 1-1

CPU Board Specifications
Item

Specifications

Board part No

RTK0EG0043C01001BJ

MCU

Model No.: R5F5671EHDFP
Package: 100pin LFQFP
On-chip memory: ROM 2MB, RAM 384KB, DataFlash 8KB
High-speed on-chip oscillator (HOCO):
Selectable from 16MHz, 18MHz, and 20MHz

External resonator connection

Main clock: 12MHz (option)
Sub clock: 32.768KHz (option)

Power supply

Operation voltage: 5.0V
• DC jack (2.1mm Center Positive): 5.0V input• USB bus powered (VBUS): 5V
Board Device Porer: 3.3V
• Voltage regulator (LDO): 3.3V
Renesas Electronics E2/E2 Lite 14-pin box header

Debug interface
Slide switch

MCU operating mode selection: 1 pole x 1
TS pins / SCI Boot Mode programming pins switch: 2 poles x 1, 1 pole x 1

Push switches

Reset switch: x 1
User switches: x 2

LEDs

Power status: red x 1
User LEDs: green x 1, yellow x 1

USB serial conversion interface

Connector: USB Micro B
Driver: FT234XD USB serial IC manufactured by FTDI

Application board interface (GPIO)

2.54mm pitch, 16 pins x 1 (CN1)

Application board interface (CTSU)

2.54mm pitch, 40 pins x 1 (CN2)

Pmod interface

Current consumption

2.54mm pitch, 12 pins x 2• PMOD1: Pmod Type 2A, Type3A, Type 6A (with switch circuit)• PMOD2: Pmod Type 2A
500mA or less (Total with all interfaces in use)

Operating Temperature Range

When operating: 10 to 35˚C, in storage: -10 to 50˚C (no condensation)

Board dimensions (L x W x H)

89mm x 95mm x 18mm (including connectors)

Table 1-2 Application Board Specifications
Item

Specifications

Board part No

RTK0EG0019B01002BJ

Self-capacitance detection touchelectrodes

Buttons: 3
Wheel (4-electrode configuration): 1
Sliders (5-electrode configuration): 1

Touch electrode shields

Button, wheel, and slider areas: 1 shield each

LEDs

16

Renesas MCU Cap Touch CPU
board interface

2.54mm pitch, 16 pins x 1 (CN1)
2.54mm pitch, 40 pins x 1 (CN2)Overlay panel

2mm-thick acrylic panel

Current consumption

500mA or less

Operating Temperature Range

When operating: 10 to 35˚C, in storage: -10 to 50˚C (no condensation)

Board dimensions (L x W x H)

110mm x 116mm x 11mm (including connectors)

R12UZ0103EJ0110
Apr.26.24

Rev.1.10

Page 2 of 21

RX671 Group
Capacitive Touch Evaluation System User’s Manual

1.4

1.

Overview

Regulatory Compliance Notices
1.4.1

European Union regulatory notices

This product complies with the following EU Directives. (These directives are only valid in the European Union.)

CE Certifications:・ Electromagnetic Compatibility (EMC) Directive 2014/30/EU
EN IEC 61326-1: 2021 Group1 Class A
WARNING:

This is a Class A product. This equipment can cause radio frequency noise when used in theresidential area. In such cases, the user/operator of the equipment may be required to takeappropriate countermeasures under his responsibility.

・ Information for traceability
・ Authorised representative
Name:
Renesas Electronics Corporation
Address: Toyosu Foresia, 3-2-24, Toyosu, Koto-ku, Tokyo 135-0061, Japan・ Manufacturer
Name:
Renesas Electronics Corporation
Address: Toyosu Foresia, 3-2-24, Toyosu, Koto-ku, Tokyo 135-0061, Japan・ Person responsible for placing on the market
Name:Renesas Electronics Europe GmbH
Address: Arcadiastrasse 10, 40472 Dusseldorf, Germany
・ Trademark and Type nameTrademark:Renesas
Product name: RX671 Group Capacitive Touch Evaluation System
Type name:
RTK0EG0044S01001BJ
Environmental Compliance and Certifications:・ Waste Electrical and Electronic Equipment (WEEE) Directive 2012/19/EU

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RX671 Group
Capacitive Touch Evaluation System User’s Manual

2.

CPU Board

2.1

System Block Diagram

2.

CPU Board

Figure 2-1 shows the system block diagram of the CPU board.

E2/E2Lite
Connector

5.0V

DC Jack
USB Micro-B

VBUS

Power
SupplySelector

3.3V
LDO

DP/DM

USB - Serial
Converter

Level
Converter

GPIO,A/D

UART
(SCI)

RX671
(R5F5671EHDFP)

Main Clock(Option)Sub Clock(Option)3
Push Switchs

GPIO,A/DRESET, IRQ

CTSU
GPIO

12

4

19

GPIO,SCIMD
GPIO

Temperature
Correction
Resister17
Pin Header
(CN2)

PMOD1

GPIO,SCI
Operating Modes
Selector

Pin Header
(CN1)

PMOD2
2
LEDs

Figure 2-1. System Block Diagram

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RX671 Group
Capacitive Touch Evaluation System User’s Manual

2.2

2.

CPU Board

Product Configuration

Figure 2-2 shows the parts location. Figure 2-3 shows the board dimensions.

Power Supply Selector
PMOD2

PMOD1
LED1

CN1

Application Board
Interface (GPIO)

CN2

Application Board
Interface (CTSU)

JP5
J1

USB-Serial Interface/ Board Power Supply

CN5
JP4

DC Power Connector(DC Barrel Jack)

CN6

JP3

E2/E2Lite
Connector

SW6

CN4

U1

LED2

SW4

SW2 SW3

User Push Switch

X1

X2

Reset Switch

LED3

SW1

SW5

User LED

Figure 2-2. Parts Location

Figure 2-3. Board Dimensions
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RX671 Group
Capacitive Touch Evaluation System User’s Manual

2.3

Hardware Details

2.3.1

Default Jumper Settings

2.

CPU Board

Figure 2-4. shows the default positions of the jumpers.Table 2-1 lists the default jumper settings.

JP4

SW6

SW4
(RESET)
SW1

Figure 2-4.
Table 2-1.

Default Jumper Settings

Reference

Circuit Group

SW5

Default Jumper Positions

Default State

Description

JP4

Power supply

Shorted Pin 1-2

Supplies USB power to board USB

SW1

Capacitive touch / DebuginterfaceOFF

Uses P34/TS0/TRST# as TS pin.

OFF

Uses P27/TS2/TCK and P26/TS3/TXD1 as
TS pins..

SW6

MCU operating modesettings

OFF

MCU operates in Single Chip Mode

R101

Pmod (PMOD1)

Short

Uses CN3 as Pmod Type 2A or
Type 3A

SW5

R102

Short

R103

Open

R104

Open

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RX671 Group
Capacitive Touch Evaluation System User’s Manual
2.3.2

2.

CPU Board

MCU Operating Mode Settings

Table 2-2 provides the RX671 operating mode settings.
Table 2-2. RX671 Operating Mode Settings
Reference
SW6

Position
OFF (pins 2-3)

Default
Setting (X)X

ON (pins 1-2)

MCU Operating Mode
Single Chip Mode
SCI Boot Mode

Table 2-3 lists the switch specifications for capacitive touch and debug interface settings..
Table 2-3. Switch Specifications for Capacitive Touch and Debug Interface Settings
Reference
SW1

Position
OFF (2-3 pin)Default
Setting (X)X

ON (1-2 pin)SW5OFF
(1-2, 4-5 pin)ON(2-3, 5-6 pin)

Description
Uses P34/TS0/TRST# as TS pin. (Note1)
Uses P34/TS0/TRST# as debug pin. (Note2)

X

Uses P27/TS2/TCK and P26/TS3/TXD1 as TS pins.
(Note1)
Uses P27/TS2/TCK and P26/TS3/TXD1 as debug pins.
(Note2)

Note1: FINE connection is available for the debugger. JTAG connection is not available.
Note2: FINE or JTAG connection is available for the debugger. Cannot be used as TS pins.

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RX671 Group
Capacitive Touch Evaluation System User’s Manual

2.

CPU Board

Figure 2-5 shows the RX671 operating mode setting circuit. Use these settings.

CN4(E2/E2Lite I/F) VCC
8

RX671

VCC
4.7k
4.7k

OFF SW6

MD/FINED

ON

EMLE

7

MD/FINED

4.7k

4

EMLE

10

UB

CN2.26SW5

TCK
TDO/RxD
TDI/TxD

1

5

TMS

RES
GND

OFF

TS3

OFF

P27/TS2/TCK

ON

P26/TS3/TDO/TXD1

ON

11

3

TRST#

TS2

PC7/UB
4.7k

TS0

OFF

P30/TDI/RXD1

SW1

P34/TS0/TRST#

ON

9

TMS

Reset
Circuit

13

RES

2,12,14

VCC

CN9
(CTS)
TXD1
RXD1
(RTS)
VSS
VCC

Figure 2-5. RX671 Operating Mode Setting CircuitPower Supply
2.3.3

Power Supply

Table 2-4 provides the power supply jumper settings. This CPU board can be supplied with 5V power by USB
or a 2.1mm center positive DC barrel jack connector. The device on this CPU board is designed to run at
3.3V. The total current available from the onboard 3.3V Low Dropout Regulator (LDO) is 400 mA. Any power
supply can be connected to J1 to provide more current to the board power supply. Open JP5/PAD3 whenusing J1.
Table 2-4.

Power Source Jumper Settings

Reference
JP4

Jumper Setting
Shorted Pins 1-2

Default Setting (X)X

Shorted Pins 2-3
JP5 / PAD3

Shorted Pins 1-2
Shorted Pins 1-2
Open

Supplies USB power source to LDO.
Supplies DC jack (CN5) to LDO

X

Open
JP3 / PAD1

Description

Supplies LDO power source to board power source
Disconnect LDO and board power source

X

Supplies board power source to MCU
MCU current consumption measurement
setting

Figure 2-6 shows the power source system diagram. Figure 2-7 shows the J1 pin assignments
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RX671 Group
Capacitive Touch Evaluation System User’s Manual

Power SupplyUSB
micro BDC Jack

VBUS(5V)

JP4
LDO

5.0V

2.

Board Power
JP3 / PAD1
Vcc
JP5 / PAD3
3.3V

RX671

[Legends]： Power Supply
Direction

CN1： Jumper(Shorted)

Pmod 1： Jumper(Open)J1(No Mount)

CPU Board

Pmod 2USB-Serial IC
and other ICs
E2/E2Lite
Connector

Figure 2-6.

(Board Power)
VCC
1

2

Power Source System Diagram

Pin

Connection

1

VCC（ Board Power）

2

GND

GND

Figure 2-7. J1 Pin Assignments

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RX671 Group
Capacitive Touch Evaluation System User’s Manual
2.3.4

2.

CPU Board

Clock Circuit

Table 2-5 lists the clock specifications of the CPU board. Figure 2-8 shows the clock circuit.
Table 2-5.

Clock Specifications

Clock

Function

Default State

Frequency

Package

X1

Main clock (crystal
resonator)

Not mounted

12MHz

3.2mm x 2.5mm SMD

X2

Sub clockNot mounted

32.768kHz

1.88mm x 6.00mm
Cylinder type, wire lead product

RX671
P37/XTAL
C21(10pF)

X1(No Mount)
P36/EXTAL

C22(10pF)

XCIN
C23
(8pF)

X2
(No Mount)
XCOUT
R62
*Note

10k

C24
(8pF)

*Note : Remove when mounting the X2.

Figure 2-8. Clock Circuit

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RX671 Group
Capacitive Touch Evaluation System User’s Manual
2.3.5

2.

CPU Board

Reset Circuit

The RX671 CPU Board is equipped with a reset switch (SW4) which generates a reset signal to restart themain MCU.
2.3.6

Push Switch

Table 2-6. lists the push switch specifications. Figure 2-9 shows the push switch circuit.
Table 2-6.

Push Switch Specifications

Reference

MCU Control Port

Function

SW4（Reset）

RES#

Resets the MCU.

SW2

PJ3 / IRQ11

User controllable switch.

SW3

P32 / IRQ2-DS

User controllable switch.

VCC

VCC

RX671
SW4

D2

10k

R7
RES#

C20
1uF

SW2

CN4.13VCC

VCC

10k R510k R6
PJ3/IRQ11

SW3
P32/IRQ2-DS

Figure 2-9. Push Switch Circuit

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RX671 Group
Capacitive Touch Evaluation System User’s Manual
2.3.7

2.

CPU Board

LEDs

Table 2-7 provides the connection port and function of each LED. Figure 2-10 shows the LED circuit.
Table 2-7. LED Functions and ConnectionsLED

MCU Control Port

Function

Color

LED1 (Power)

VCC

Power status display

Red

LED2

P07

User LED

Green

LED3

P05

User LED

Yellow

VCC

VCC
LED2
(Green)

LED1
(Red)
560

VCC

560

LED3
(Yellow)

560

RX671
P07
P05

Figure 2-10. LED Circuit

2.3.8

USB Serial Conversion

Table 2-8 lists connections for USB serial IC and MCU controller. The RX671 Cap Touch Evaluation System
Board is equipped with USB serial IC FT234XD (FTDI Ltd.) for USB serial conversion. The FT234XD isconnected to the RX671’s serial communication interface (SCI) module.
Table 2-8

USB Serial Conversion

Signal NameMCU Control Port

Function

TXD

PE1 / TXD12

SCI12 transmit data signal

RXD

PE2 / RXD12

SCI12 receive data signal

2.3.9

Debug Interface

The CPU board is equipped with an E2/E2 Lite connector (14-pin box connector) for use as debugging
interface. For details, refer to Reference Materials [2].

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RX671 Group
Capacitive Touch Evaluation System User’s Manual
2.3.102.

CPU Board

Application Header

The two application headers, CN1 and CN2, can be used as interface for the user’s own board.
CN1 is used for GPIO pins. For more details regarding peripheral functions not listed here, refer to the User’s
Manual Hardware Version.
CN2 is mainly used for CTSU pins. Fix the GPIO pins to low by software. Do not connect anything to TSCAP.
Table 2-9.

Application Header (CN1)

CN1

MCU

Pin

Port

16

VSS（GND）

14

P47

12

CN1
Peripheral

MCU

Pin

Port

Peripheral

15

VCC

13

P46

P45

11

P44

10

PA0

9

PA5

8

PA6

7

PA7

6

PE0

5

PE3

4

PE4

3

PE7

MISOB-B

2

PE5

1

PE6

MOSIB-B

Table 2-10.

AN007

RSPCKB-B

Application Header (CN2)

CN2

MCU

Pin

Port

CN2
CTSU

MCU

Pin

Port

CTSU

40

PC4

TSCAP

39

－

－

38

－

－

37

－

－

36

PC0

TS16

35

PB5

－

34

PC1

TS15

33

PB6

－

32

PB7

－

31

PC5

TS14

30

PC3

－

29

PC2

－

28

PC6

TS13

27

P50

－

26

PC7/UB (Note)

－

25

P51

－

24

P52

－

23

P54

－

22

P53

TS12

21

P14

TS11

20

P55

－

19

PH1

－

18

PH2

－

17

P12

－

16

P15

TS10

15

P13

－

14

P16

－

13

P31/TMS－

12

P30/TDI/RXD1

－

11

P17

－

10

P20

TS9

9

P21

TS8

8

P22

TS7

7

P23

TS6

6

P24

TS5

5

P25

TS4

4

P33

TS1

3

P26/TDO/TXD1

TS3

2

P34/TRST#

TS0

1

P27/TCK

TS2－ : Not Applicable
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RX671 Group
Capacitive Touch Evaluation System User’s Manual
2.3.11

2.

CPU Board

CTSU Related Circuits

2.3.11.1 CTSU correction circuit
This circuit improves the absolute accuracy of the CTSU’s capacitive measurement. The resistor and control
software required for the correction function are sold separately. When not using the correction control
software, no resistor is necessary.
Table 2-11.

CTSU Correction Circuit Settings

Reference

MCU Control Port

Default Setting

Spec

R10

P43

Not mounted

100K Ohm

R11

P42

Not mounted

68K Ohm

R12

P41

Not mounted

51K Ohm

R13

P40 / AN000

Not mounted

0 Ohm

2.3.12

Package
1.6mm x 0.8mm SMD

Pmod Interface

Table 2-12 lists connections PMOD1 pin assignments. Header PMOD1 is the interface for Pmod Type 2A andType 3A. PMOD1 can also be used for Pmod Type 6A by using the Pmod interface switch circuit. Whenconnecting the Pmod module, check the pin position and be careful not to misalign the pin position or stick it
backwards.
Table 2-12.

PMOD1 Pin Assignments

PinType 2A/3A
Function

1

CS/CTS

2MCU Port

Pin

Type 6A
Function

MCU Port

PB2/CTS6#/SS6#

1NC

PB2/CTS6#/SS6#

MOSI/TXD

PB1/SMOSI6/TXD6/SSDA6(Note)

2NC

PB3/SCK6 (Note)

3

MISO/RXD

PB0/SMISO6/RXD6/SSCL6

3SCL

PB0/SMISO6/RXD6/SSCL6

4SCK/RTSPB3/SCK6 (Note)

4

SDA

PB1/SMOSI6/TXD6/SSDA6 (Note)5GND

VSS(GND)

5GND

VSS(GND)

6

VCC

VCC

6

VCC

VCC

7

GPIO

PA2

7

GPIO

PA2

8

GPIO

PA4/TXD58GPIO

PA4/TXD59GPIO

PA3/RXD59GPIO

PA3/RXD510GPIO

PA1/SCK510GPIO

PA1/SCK511GND

VSS(GND)11GND

VSS(GND)

12

VCC

VCC

12

VCC

VCC

Note: Replace resistors of R101, R102, R103, and R104.
RX671

PMOD1

Type2A/3A(default)

PB1/SMOSI6/TXD6/SSDA6R101

PB3/SCK6

R102

2
4

R103
R104
Type6A(No Mount)

Figure 2-11. PMOD1 Interface Switch Circuit
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RX671 Group
Capacitive Touch Evaluation System User’s Manual

2.

CPU Board

Table 2-13 lists connections PMOD2 pin assignments.
Table 2-13. PMOD2 Pin Assignments
Pin

Type2A Function

MCU Port

1

CS

PD4/SSLC0-A

2

MOSI

PD1/MOSIC-A

3

MISO

PD2/MISOC-A

4

SCK

PD3/RSPCKC-A5GNDVSS(GND)

6

VCC

VDD

7

GPIO

PD0/IRQ08GPIO

PD5/SSLC1-A

9

GPIO

PD6/SSLC2-A

10

GPIO

PD7/SSLC3-A

11

GND

VSS(GND)

12

VCC

VCC

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RX671 Group
Capacitive Touch Evaluation System User’s Manual

3.
Application Board(Self-Capacitance Electrode Board)

3.

Application Board (Self-Capacitance Electrode Board)

3.1

Board Layout

Figure 3-1 shows the layout of the application board.

Wheel Electrode

LED1
LED2

GPIO
Interface

CN1

LED8

TS-B1

TS-W1

TS-W2
LED3

LED7
TS-B2

LED4

Self-capacitance
Button Electrodes
LED6

CN2

LED15

TS-W4

TS-W3

CTSU
Interface

LED14

TS-B3

LED16

LED5

SliderElectrode
TS-S1

Figure 3-1.

3.2

TS-S2

TS-S3

TS-S4

TS-S5

Board Layout and TS Pin Assignments

Application Headers

Application headers CN1 and CN2 are the interface for connection to the Renesas Capacitive Touch
Evaluation System CPU board. Table 2-9 lists the pin assignments for CN1. Table 2-10 lists the pin
assignments for CN2.
Table 3-1.

Application Header (CN1)PinFunction

MCU Connection

PinFunction

MCU Connection

15

LED_VCC

VCC

16

LED_VSS（GND）

VSS（GND）

13

LED_ROW0

P46

14

LED_ROW1

P47

11

LED_ROW2

P44

12

LED_ROW3

P45

9

－

－

10

－

－

7

LED_COL3

PA7

8

－

－

5

LED_COL1

PE3

6

LED_COL2

PE0

3

－

－

4

LED_COL0

PE4

1

－

－

2

－

－

－ : Not Applicable
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RX671 Group
Capacitive Touch Evaluation System User’s Manual
Table 3-2.

3.
Application Board(Self-Capacitance Electrode Board)

Application Header (CN2)PinTouch Electrode

CTSU (RX671) (Note1)

Pin

Touch
Electrode

CTSU (RX671) (Note1)

39

－

－

40

－

TSCAP

37

－

－

38

－

－

35

－

－

36

TS-W1

TS16

33

－

－

34

TS-W2

TS15

31

TS-W3

TS14

32

－

－

29

－

－

30

－

－

27

－

－

28

TS-W4

TS13

25

－

－

26

－

－

23

－

－

24

－

－

21

－

－

22

SHIELD-W1

P53 (Note2)

19

－

－

20

－

－

17

－

－

18

－

－

15

－

－

16

－

13

－

－

14

－

－

11

－

－

12

－

－

9

TS-B1

TS8

10

TS-B2

TS9

7

SHIELD-B1

P23 (Note2)

8

TS-B3

TS7

5

TS-S1

TS4

6

SHIELD-S1

P24 (Note2)

3

TS-S3

TS3

4

TS-S2

TS1

1

TS-S5

TS2

2

TS-S4

TS0

－ : Not Applicable
Note 1: Set output of all unassigned pins to low by software.
Note 2: SHIELD-S1, SHIELD-W1 and SHIELD-B1 are shield electrodes. To enable the function, set the pin to low bysoftware.

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RX671 Group
Capacitive Touch Evaluation System User’s Manual

4.
[1].
[2].

4.

Reference Materials

Reference Materials
Renesas RX671 Group User's Manual: Hardware (01UH0899)
E1/E20/E2 Emulator, E2 Emulator Lite Additional Document for User’s Manual (Notes on Connectionof RX Devices) (R20UT0399)

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RX671 Group
Capacitive Touch Evaluation System User’s Manual

5.

5.

Additional Information

Additional Information

Support
Refer to the Integrated Development Environment help menu for more information on how to use the IDE.
Refer to the RX671 Group User’s Manual Hardware Version for more information on RX671 Group MCUs.

For general information on Renesas microcontrollers, visit : https://www.renesas.com/

Trademarks
All trade names and product names used in this document are trademarks or registered trademarks of theirrespective companies or organizations.

Copyright
All or part of this manual may be changed without notice.
Renesas Electronics Corporation holds the copyright for this document.
Reproduction, in whole or in part, without the written consent of Renesas Electronics Corporation isprohibited.

© 2022(2024) Renesas Electronics Corporation.

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RX671 Group
Capacitive Touch Evaluation System User’s Manual

Appendix:
Self-Capacitance Touch Electrode Board Connection

Appendix: Self-Capacitance Touch Electrode Board Connection
The following describes how to use the Renesas Self-Capacitance Touch Electrode Board(RTK0EG0019B01002BJ).

LED1

SHIELD-W1
(P53)
LED8

LED2
TS-W1
(TS16)TS-W2(TS15)LED7

LED3

SHIELD-B1
(P23)

TS-B1
(TS8)

TS-B2
(TS9)

LED15

TS-B3
(TS7)

LED16

TS-W4
(TS13)

TS-W3(TS14)
LED4

LED6

LED14

LED5

SHIELD-S1
(P24)

TS-S1
(TS4)

TS-S2
(TS1)

TS-S3
(TS3)

TS-S4
(TS0)

TS-S5
(TS2)

Figure 2. Board Layout and TS Pin Assignments
Table 1. TS Pin (CN2) Assignments
Touch Electrode

CTSU (RX671)

Description

TS-W1

TS16

TS-W2

TS15

Wheel Electrode

TS-W3

TS14

TS-W4

TS13

SHIELD-W1

P53 (Note)

Wheel Shield Electrode

TS-B1

TS8

Button Electrode

TS-B2

TS9

TS-B3

TS7

SHIELD-B1

P23 (Note)

Button Shield Electrode

TS-S1

TS4

Slider Electrode

TS-S2

TS1

TS-S3

TS3

TS-S4

TS0

TS-S5

TS2

SHIELD-S1

P24 (Note)

Slider Shield ElectrodeNote: Set the pin to low by software.
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RX671 Group
Capacitive Touch Evaluation System User’s Manual

Appendix:
Self-Capacitance Touch Electrode Board Connection

Table 2. TS Pin (CN2) Assignments
Signal

RX671 Port

Description

LED_ROW0

P46

LED Matrix, High Side Transistor
Drive

LED_ROW1

P47

LED_ROW2

P44

LED_ROW3

P45

LED_COL0

PE4

LED_COL1

PE3

LED_COL2

PE0

LED_COL3

PA7

LED_VCC

VCC

VCC

LED_GND

GND

GND

LED Matrix, Low Side Transistor
Drive

Table 3. LED Matrix Table
LED_COL0

LED_COL1

LED_COL2

LED_COL3

LED_ROW0

LED1

LED5

LED13

LED9

LED_ROW1

LED2

LED6

LED14

LED10

LED_ROW2

LED3

LED7

LED15

LED11

LED_ROW3

LED4

LED8

LED16

LED12

Table 4. LED Status and Pin Output Settings
LED

LED_ROWn Connection Pin

LED_COLn Connection Pin

On

Low

High

Off

High

Low

Note: n=0~3

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RX671 Group Capacitive Touch Evaluation System

Revision History
Rev.

User’s Manual

Date

Description
Page

Summary

1.00

Sep.30.22

First Edition issued

1.10

Apr.26.24

Additions and changes due to updated EMC standard.

3・How to Use This Manual
Added description of electromagnetic environment
・1.4 Regulatory Compliance Notices
Added description of conformity standard.

C- 1

RX671 Group Renesas Solution Starter Kit
Capacitive Touch Evaluation System User’s Manual
Publication Date:

Rev. 1.00
Rev. 1.10

Sep.30.2022
Apr.26.2024

Published by:Renesas Electronics Corporation

RX671 Group
Renesas Solution Starter Kit
Capacitive Touch Evaluation System
User’s Manual

R12UZ0103EJ0110