USER’S MANUALZL6105-1CH-DEMO1Z

UG014
Rev 0.00
December 18, 2014

Demonstration Board User Guide

Introduction

Key Features

The ZL6105 is an innovative power conversion andmanagement IC that combines integrated MOSFET drivers
with key power and fault management functions in a small
package, resulting in a flexible and integrated solution. The
ZL6105-1CH-DEMO1Z platform allows quick evaluation of thehighly configurable ZL6105’s performance and features ineither stand-alone mode or via the SMBus™ interface using
Intersil’s PowerNavigator™ GUI software.

• Optimized for small circuit footprint

Specifications• ZL6105, Datasheet• Onboard enable switch• Power-good indicator• SMBus control interface• Interconnectivity with other Intersil demo boards

References• AN2010, “Thermal and Layout Guidelines for Digital-DCTM
Products”

This board has been configured and optimized for the following
range of operating conditions:• AN2035, “Compensation Using CompZLTM”• VIN = 5.5V to 14V• AN1779, “Configuring Current Sharing on the ZL6105 and
ZL8101”• VOUT = 0.6V to 3.6V
• IMAX = 40A• TB389, “PCB Land Pattern and Surface Mount Guidelines for
QFN Packages”• fSW = 300kHz to 1333kHz• Peak efficiency: >90% at 50% load

Ordering Information• Output ripple: <1% at 50% load

PART NUMBER
ZL6105-1CH-DEMO1ZDESCRIPTION
ZL6105 Evaluation Kit, one
channel (EVB, USB adapter,
Cable, Software

V IN
EN
SYNC

ZL6105ENABLE

V OUT

DDC
SMBus

SW1

ENABLE
SYNC
SMBus
DDC

ENABLE
SYNC
SMBus
DDC
FIGURE 1. ZL6105-1CH-DEMO1Z SIMPLIFIED SCHEMATIC

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ZL6105-1CH-DEMO1ZZL6105-1CH-DEMO1Z BOARD

FIGURE 2. TOP SIDEFIGURE 3. BOTTOM SIDE

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ZL6105-1CH-DEMO1Z

Functional Description

Quick Start Guide

The ZL6105-1CH-DEMO1Z provides all of the circuitry required todemonstrate features of the ZL6105. The ZL6105-1CH-DEMO1Z
has a functionally optimized layout that allows efficient
operation up to the maximum output current. Power and load
connections are provided through plug-in sockets. Standalone
operation is achieved using a combination of pin-strap settingsand stored settings. The pin-strap setting details are described in
the ZL6105 datasheet. The stored settings are listed on “Default
Configuration Settings” on page 14.

Stand Alone Operation

The ZL6105-1CH-DEMO1Z Demonstration Board schematics areshown in Figures 4 and 5. The hardware enable function iscontrolled by a toggle switch. The Power-Good (PG) LED indicatesthat VOUT is regulating. The right angle headers at opposite endsof the board are for connecting a USB to SMBus control board orfor daisy chaining of multiple Intersil evaluation boards.
Connecting multiple Intersil Digital boards allows the user to setup
many shared features such as clock synchronization, controlled
sequencing, phase spreading and fault spreading within Intersil’sPowerNavigator™ software as part of a single power project. This
document provides operational instructions, schematics, bill ofmaterials and PCB layers with layout notes for reference.
Figures 14 through 19 show performance data taken using thishardware in its optimized configuration. The configuration settings
that the hardware ships with are shown on page 14.

1. Ensure that the board is properly connected to the supply andloads before applying any power.
2. Set Enable switch to “DISABLE”.
3. Apply Load to VOUT+/VOUT-.
4. Connect the USB adapter cable to the host computer.
5. Connect the USB to SMBus adapter to J2 (Required to provide
external power for enable switch).
6. Connect the input power supply to VIN+/VIN-.
7. Turn input supply on.
8. Set Enable switch to “ENABLE”.
9. Test ZL6105 operation.

USB (PMBus) Operation
1. Follow steps 1 through 7 of Stand Alone Operation.
2. Download PowerNavigator software from the Intersil website
and install.
3. Use the GUI to operate at VOUT up to 3.6V.
4. Set the Enable switch to “ENABLE”.
5. Monitor and configure the ZL6105 using the PowerNavigator
software.

Operating Range
By default, the ZL6105-1CH-DEMO1Z is configured to provide 1V
at up to 40A at 400kHz fSW. The board can also support a wider
operating range and modifying the operating conditions willchange the performance results.
The board VIN range is 4.5V to 14V. The board VOUT setting isfixed at 1V by PMBus setting, but the range is programmablefrom 0.54V to 3.6V (including margin high/low) using the
VOUT_COMMAND PMBus command. The maximum value of 3.6V
is limited by pin strap. The board IOUT range is 0 to 40A. For
continuous operation at 40A, airflow across the board may beneeded.
The switching frequency (fSW) is set to 400kHz by PMBus
command, but the fSW setting can be changed by using the
FREQUENCY_SWITCH PMBus command (while the device isdisabled). The fSW range is 300kHz to 1.33MHz.

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Page 3 of 15

VIN

VIN

C10 C11 C1222µF 22µF 22µF
16V 16V 16V

VDD
R13
C13
10µF

SCL
SDA
DDC
PG
SYNC

EN

SCL
SDA
DDC
PG
SYNC

EN

7
8
30
36
15
16
31
34
29
6
32
35
5
10
11
14
9
33

2

3
28

C22
10µF
6.3V

Address = Ox16

1

27
VDD

Q2
BSC050NE2LS5U2ZL6105-02
GH

SCL
SDA
DDC
PG

SW

25 GH

L1
470nH

24 SW

SYNC
22 GL
GL
SS
VTRK
20 SENAMGN
ISENA
ISENB 19 SENB
PH_EN
XTEMP
CFG0
CFG1
CFG2
17 FB+
VSEN+ 18ILIM
VSEN- 26
FC0
BST
FC1
UVLO
SALRT
EN
21
VR
SA0
VR
V25
DGND 1SA1 V1 V0 SGND PGND
4
13
12
37
23

R14
698

XX4
R19 3.48k

C15
1µF
16V

Q3
BSC010NE2LS

D4
BAT54

R17
61.9k

J7
VOUT 1

VOUT

XX5
C14
1µF
16V

XX1

XX2

+

VOUT
C19
C20
C21
C18
C17
C16
100µF 100µF 100µF 100µF 100µF 1500µF
6.3V 6.3V 6.3V 6.3V 6.3V 4V
-

C23
10µF
6.3V

XX3
R15 R16100k 100k

ZL6105-1CH-DEMO1Z

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ZL6105-1CH-DEMO1Z Schematics

J8
1

SG

FIGURE 4. ZL6105-1CH-DEMO1Z DEMO BOARD

Page 4 of 15

VAUX

R6 - R9 = 4.75k
R1 R2 R3 R4

C1
10µF

VIN

FROM PREQUEL
J2
1 SDA
2 SALRT
3 SCL
4 GND
5 VI2C
6 MSTR_EN

SDA
SALRT
SCL
GND
VI2C
MSTR_ENTO SEQUEL
J3
1
2
3
4
5
6

MSTR_SYNC
RSVD1
GND
DDC
RSVD2
RSVD3

1
2
3
4
5
6

J4

R8
49.9

R9
10.0k

VIN
- -

SYNC
SDA
SCL
DDC

R10
10.0k
R11
392

3 ESW
2 MSTR_EN
1
DISABLEMONITORENABLE

C8
1µF
25V

EN
C9
0.1µF
10V

D3

+

VAUX

SW1

PG

J1

J5
1 MSTR_SY NC
2 RSVD1
3 GND
4 DDC
5 RSVD2
6 RSVD3

VIN

R12
100k

FIGURE 5. ZL6105-1CH-DEMO1Z INTERFACE

C5
330µF
16V

C2
22µF
16V

C3
22µF
16V

C4
10µF
25V

R18
1.5k

ZL6105-1CH-DEMO1Z

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ZL6105-1CH-DEMO1Z Schematics (Continued)

Page 5 of 15

ZL6105-1CH-DEMO1ZBill of Materials
VALUE

TOL
(%)

QTY

REFERENCE

RATING

TYPE

1

U2

2

C2, C3

22µF

20

16V

X5R

SM1206

MurataGRM31CR61C226ME15L

1

C4

10µF

10

25V

X5R

SM1206

Panasonic - ECG

ECJ-3YB1E106K

1

C5

330µ

20

16V

1

C8

1µF

10

25V

X5R

SM0603

Taiyo Yuden

TMK107BJ105KA-T

1

C9

0.1µF

10

10V

X7R

SM0603

Kemet

C0603C104K8RACTU

3

C10, C11,
C12

22µF

20

16V

X5R

SM1206

Panasonic - ECG

ECJ-3YB1C226M

ZL6105PCB FOOTPRINT
MLF36_6X6BX

MANUFACTURERPART NUMBER

Intersil Corporation

AL POLY SM_CAP_10.5X10.5_PX United Chemi-Con
A_FLD

APXA160ARA331MJC0G

1

C13

10µF

10

25V

X7R

SM1206

Taiyo Yuden

TMK316B7106KL-TD

2

C14, C15

1µF

10

16V

X7R

SM0603

AVX Corporation

0603YC105KAT2A

5

C16, C17,
C18, C19,
C20

100µF

20

6.3V

X5R

SM1206TDK Corporation

C3216X5R0J107M

1

C211500µF

20

4V

2

C22, C23

10µF

10

6.3V

1

D4

BAT54

30V

Schottky SOD_523

ON Semiconductor BAT54XV2T1OS

1

L1

470nH

0.8mΩ

Inductor IND_HCM1305_XX

Cooper Bussmann

1

Q2

BSC050NE2LS530V

PG_TDSON_8_LAS

Infineon

1

Q3

BSC010NE2LS

30V

PG_TDSON_8_LAS

Infineon4

R1, R2, R3, 4.75k
R4AL POLY SM7343_KEMET_T530_ AVX
BC
X7R

SM0805TDK Corporation

TPME158K004R0018
CGA4J1X7R0J106K125AC

HCM1305-R47-R

1

1/16W SM0402

Panasonic - ECG

ERJ-2RKF4751X

1

R13

1

1

1/16W SM0603

Panasonic - ECG

ERJ-3RQF1R0V

1

R14

953

1

1/16W SM0603

Panasonic

ERJ-3EKF9530V

2

R15, R16

100k

1

1/16W SM0402

Vishay/Dale

CRCW0402100KFKED

1

R17

133k

1

1/16W SM0402

Panasonic - ECG

ERJ-2RKF1333X

1

R19

3.48k

1

1/16W SM0402

Panasonic - ECG

ERJ-2RKF3481X

X7R

SM0805

Taiyo Yuden

LMK212B7106KG-TD

DIO_LG_T67K

Osram

LG T67K-H2K1-24-Z

ANCILLARY PARTS SPECIFIC TO DEMO BOARD OPERATION
1

C1

10µF

1

D3

GRN

2

J2, J4

HDR_3x2_RA

RA

HDRM3DUALRA100X10 SAMTEC
0

TSW-103-08-T-D-RA

2

J3, J5

SKT_3x2_RA

RA

HDRF3DUALRA100X100 SAMTEC

SSQ-103-02-T-D-RA

1

R8

49.9

1

100mW

THK
FILM

SM0402PANASONIC-ECG

ERJ-2RKF49R9X

2

R9, R10

10.0k

1

63mW

THK
FILM

SM0402

Panasonic - ECG

ERJ-2RKF1002X

1

R11

392

1

100mW

THK
FILM

SM0402

Panasonic

ERJ-2RKF3920X

1

R12

100k

1

63mW

THK
FILM

SM0402

Panasonic - ECG

ERJ-2RKF1003X

1

R18

1.5K

1

63mW

THK
FILM

SM0603

Panasonic - ECG

ERJ-3EKF1501V

1

SW1

SW_SPDT

PCB
VERT

SW_TOG_ULTRAMIN_SP NKKDT

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10

10V
1.8V

G13AP-RO

Page 6 of 15

ZL6105-1CH-DEMO1ZBill of Materials (Continued)
REFERENCE

4

J1A, J1B, J7, JACK_BANANA
J8

4STANDOFF_#440.75LG

STANDOFF_4-40_NDH

4SCREW_#440.25"

SCREW_4-40

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December 18, 2014

VALUE

TOL
(%)

QTY

RATINGTYPE

PCB FOOTPRINT
JACK_KEYSTONE_575-4

MANUFACTURER
Keystone
Electronics

PART NUMBER
575-4

Page 7 of 15

ZL6105-1CH-DEMO1Z
The following data was obtained using a ZL6105-1CH-DEMO1Z evaluation board. VIN = 12V for all data.

95

100

90

95

85
VOUT = 3.3V

80

VOUT = 1.8V

EFFICIENCY (%)

EFFICIENCY (%)

Measured Data

VOUT = 1.5V
VOUT = 1V

75

VOUT = 2.5V

70

VOUT = 3.3V

85

VOUT = 1.8V

80

VOUT = 1V

VOUT = 1.2V
10

0

VOUT = 1.2V

65
20

30

60

40

0

10

40

30

FIGURE 7. EFFICIENCY DATA AT 400kHz

FIGURE 6. EFFICIENCY DATA AT 300kHz

100

99

95
EFFICIENCY (%)

94
89
VOUT = 3.3V

84

VOUT = 2.5V

VOUT = 1.8V

79

VOUT = 1.5V
VOUT = 1.2V

10

20

30

OUTPUT CURRENT (A)FIGURE 8. EFFICIENCY DATA AT 500kHz

UG014 Rev 0.00
December 18, 201485

VOUT = 3.3V

80

VOUT = 2.5V

VOUT = 1.5V

75

VOUT = 1.8V

VOUT = 1.2V
VOUT = 1.0V

65

VOUT = 1V
0

90

70

74
69

20
OUTPUT CURRENT (A)OUTPUT CURRENT (A)EFFICIENCY (%)

VOUT = 1.5V

VOUT = 2.5V

75
70

65
60

90

40

60

0

10

30

20
OUTPUT CURRENT (A)FIGURE 9. EFFICIENCY DATA AT 600kHz

Page 8 of 15

40

ZL6105-1CH-DEMO1Z

Measured Data

The following data was obtained using a ZL6105-1CH-DEMO1Z evaluation board. VIN = 12V for all data. (Continued)

ZL6105-1CH-DEMO1Z
VIN = 12V, VOUT = 1V
IOUT = 20A, fSW = 400kHz

ZL6105-1CH-DEMO1Z
VIN = 12V, VOUT = 1V
IOUT = 20A, fSW = 400kHz

VOUT

tON_DELAY

ENABLE

5ms

ENABLEtON_DELAY

tOFF

5ms

5ms

TYPICAL RAMP ARTIFACT

VOUT

FIGURE 11. TYPICAL TURN-OFF RAMP, tFALL = 5ms,tOFF_DELAY = 5ms

FIGURE 10. TYPICAL TURN-ON RAMP, TRISE = 5ms,
tON_DELAY = 5ms

ZL6105-1CH-DEMO1ZMEASURED ACROSS C21
VIN = 12V, VOUT = 1V
IOUT = 20A, fSW =400kHz

ZL6105-1CH-DEMO1ZTYPICAL STATIC VOUT RIPPLE PROFILE
VIN = 12V, VOUT = 1V
IOUT = 20A, fSW = 400kHz
100 mV

VOUT = 1V

STATIC RIPPLE = 8mV

INDUCTIVE LOAD CABLE ARTIFACTFIGURE 12. TRANSIENT RESPONSE 5 TO 15A, 5A/µ

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FIGURE 13. STATIC RIPPLE

Page 9 of 15

ZL6105-1CH-DEMO1ZZL6105 PCB Layout Guidelines
Device Ground Pins
- SGND is the analog reference for VDD, VR, V25, XTEMP and
the pin straps. Very little current passes through this pathnormally.
- DGND is the high current digital GND return path for thecontroller. It is isolated internally from SGND to avoid noise
coupling.
- PGND is the high current GND return for the MOSFET drivers
and the bootstrap circuit. It is isolated internally from SGND
to avoid noise coupling.

ZL6105 Voltage, Current and Temperature
Sense Connections• Ensure that the current sense signals are routed differentiallyand that the averaging circuit is Kelvin connected to thesensing element for most accurate current sense.
• Ensure that the voltage sense signals are routed differentiallyand are Kelvin connected to the final capacitor away from theinductor for best noise performance.
• Ensure that the XTEMP and SGND traces are routed
differentially to the temperature sensing transistor.

Ground Pin Usage- The pins are isolated within the device only to avoid noise
coupling through the package and bond wires. They should
be tied together on the PCB with a very low impedanceconnection for best operation. If the DGND pin is not closely
coupled to SGND, the SGND pin will become a current pathfor digital circuits and will get noisy.

Device Power Supply Pins
- VDD is the input supply pin. It provides power to the internal
VR regulator.
- VR is the internal 5V regulator used to power the MOSFET
drivers and the V25 regulator.
- V25 is the internal 2.5V regulator used to power the digital
circuits.

Power Supply Pin Usage- VDD, VR and V25 are all referenced to SGND and all need tohave capacitors placed closely to the pins.

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ZL6105-1CH-DEMO1ZTop Layer
ZL6105-1CH-DEMO1ZBoard Layout - 6 Layers
VOUT
TIGHT SWITCHING LOOPPGND PIN TO COMMON GND
PLANE DIRECTLY AT LS FETMANY GND VIAS FOR GOOD
ELECTRICAL AND THERMALPERFORMANCEVDD CAPACITOR TO COMMONGND PLANECOMMON GND PLANE ON
ALL LAYERS
DGND PIN TIED TO COMMONGND PLANE ON ALL LAYERS
WITH A VIA

ALL PIN STRAPS CLOSE TO
DEVICE AND TIED TO INTERNAL
SGND PLANE

VIN

7Inner layer 1

FIGURE 14. PCB TOP LAYERVOUTCOMPLETE GND PLANE
THROUGHOUT THIS LAYERPROVIDES A REFERENCEFOR ROUTED LAYERS

GND

ISOLATED SGND PLANE
IS RECONNECTED TO
GND DIRECTLY UNDERPGND PIN

SGND PLANE

GND

8

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FIGURE 15. INNER LAYER 1

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ZL6105-1CH-DEMO1Z

Inner Layer 2 Board Layout - 6 Layers
ZL6105-1CH-DEMO1ZVOUTVSENSE LINES ARE ROUTEDDIFFERENTIALLY TO THE
FINAL OUTPUT CAPACITOR

GND

SGND PLANE IS ISOLATEDTHROUGH ALL LAYERS EXCEPT 1

GND

Inner Layer 3

FIGURE 16. INNER LAYER 2

9

VOUT
GND

VOUT SHAPE REPLICATEDFOR LOWER LOSSSGND PLANE
REMAINS ISOATED
VIN SHAPE REPLICATEDFOR LOWER LOSS

VIN

GND

FIGURE 17. INNER LAYER 3

10

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ZL6105-1CH-DEMO1ZZL6105-1CH-DEMO1Z
Inner Layer 4 Board Layout - 6 Layers
VOUT
GND

REPLICATION OF
INNER LAYER 3
FOR LOWER LOSS

VIN

11
BottomLayer

GND

FIGURE 18. INNER LAYER 4

VOUTISENSE LINES ARE ROUTEDDIFFERENTIALLY AND KELVIN
CONNECTED TO THE INDUCTOR

GND

V25 CAPACITOR CLOSE TO THE
DEVICE AND TIED TO
SGND PLANE

VR CAPACITOR CLOSE TO THE
DEVICE AND TIED TO SGND
PLANE NEAR THE SGND/GND
RECONNECTION POINT

VIN

12

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GND

FIGURE 19. BOTTOM LAYER

Page 13 of 15

ZL6105-1CH-DEMO1Z

Default Configuration Settings
The following configuration file is loaded into the ZL6105 on the ZL6105-1CH-DEMO1Z in the Default Store. The # symbol is used todenote comments. Anything following the # symbol is ignored.
PMBus COMMAND

VALUE

NOTES

ON_OFF_CONFIG

0x17#Pin Enable, immediate off

MFR_IDIntersil

MFR_MODELZL6105-1CH-DEMO1Z

MFR_LOCATION

Austin, TX

MFR_REVISION

Rev 1.0

VOUT_COMMAND

1#V

VOUT_UV_FAULT_RESPONSE

0x80#Immediate shutdown

OVUV_CONFIG

0x00#Disabled

IOUT_CAL_GAIN

0.84

#mΩ

IOUT_OC_FAULT_LIMIT

50#AIOUT_AVG_OC_FAULT_LIMIT

50#AIOUT_UC_FAULT_LIMIT

-30

#A

IOUT_AVG_UC_FAULT_LIMIT

-30

#A

FREQUENCY_SWITCH

400

#kHz

DEADTIME

0x2020#32ns

DEADTIME_CONFIG

0x0606#2ns Min, Dynamic

DEADTIME_MAX

0x2020#32,56ns Max

INDUCTOR

0.47

#µH

MFR_CONFIG

0x8412

USER_CONFIG

0x0011

TEMPCO_CONFIG

0x28

MISC_CONFIG

0x2000

AUTO_COMP_CONFIG

0x79#Enabled, 80% Gain

STORE_DEFAULT_ALL
RESTORE_DEFAULT_ALL
RESTORE_USER_ALL

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Page 14 of 15

Notice1.

Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible forthe incorporation or any other use of the circuits, software, and information in the design of your product or system. Renesas Electronics disclaims any and all liability for any losses and damages incurred by
you or third parties arising from the use of these circuits, software, or information.

2.

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examples.

3.

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product’s quality grade, as indicated below.
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When using Renesas Electronics products, refer to the latest product information (data sheets, user’s manuals, application notes, “General Notes for Handling and Using Semiconductor Devices” in thereliability handbook, etc.), and ensure that usage conditions are within the ranges specified by Renesas Electronics with respect to maximum ratings, operating power supply voltage range, heat dissipation
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8.

Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. You are responsible for carefully andsufficiently investigating applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive, and using Renesas Electronics
products in compliance with all these applicable laws and regulations. Renesas Electronics disclaims any and all liability for damages or losses occurring as a result of your noncompliance with applicablelaws and regulations.

9.

Renesas Electronics products and technologies shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws
or regulations. You shall comply with any applicable export control laws and regulations promulgated and administered by the governments of any countries asserting jurisdiction over the parties ortransactions.

10. It is the responsibility of the buyer or distributor of Renesas Electronics products, or any other party who distributes, disposes of, or otherwise sells or transfers the product to a third party, to notify such third
party in advance of the contents and conditions set forth in this document.
11. This document shall not be reprinted, reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics.
12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products.
(Note 1)

“Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly controlled subsidiaries.

(Note 2)

“Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
(Rev.4.0-1 November 2017)

http://www.renesas.com

SALES OFFICES
Refer to "http://www.renesas.com/" for the latest and detailed information.
Renesas Electronics America Inc.
1001 Murphy Ranch Road, Milpitas, CA 95035, U.S.A.
Tel: +1-408-432-8888, Fax: +1-408-434-5351
Renesas Electronics Canada Limited
9251 Yonge Street, Suite 8309 Richmond Hill, Ontario Canada L4C 9T3
Tel: +1-905-237-2004
Renesas Electronics Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K
Tel: +44-1628-651-700, Fax: +44-1628-651-804
Renesas Electronics Europe GmbH
Arcadiastrasse 10, 40472 Düsseldorf, Germany
Tel: +49-211-6503-0, Fax: +49-211-6503-1327
Renesas Electronics (China) Co., Ltd.
Room 1709 Quantum Plaza, No.27 ZhichunLu, Haidian District, Beijing, 100191 P. R. China
Tel: +86-10-8235-1155, Fax: +86-10-8235-7679
Renesas Electronics (Shanghai) Co., Ltd.
Unit 301, Tower A, Central Towers, 555 Langao Road, Putuo District, Shanghai, 200333 P. R. China
Tel: +86-21-2226-0888, Fax: +86-21-2226-0999
Renesas Electronics Hong Kong Limited
Unit 1601-1611, 16/F., Tower 2, Grand Century Place, 193 Prince Edward Road West, Mongkok, Kowloon, Hong Kong
Tel: +852-2265-6688, Fax: +852 2886-9022
Renesas Electronics Taiwan Co., Ltd.
13F, No. 363, Fu Shing North Road, Taipei 10543, Taiwan
Tel: +886-2-8175-9600, Fax: +886 2-8175-9670
Renesas Electronics Singapore Pte. Ltd.
80 Bendemeer Road, Unit #06-02 Hyflux Innovation Centre, Singapore 339949
Tel: +65-6213-0200, Fax: +65-6213-0300
Renesas Electronics Malaysia Sdn.Bhd.
Unit 1207, Block B, Menara Amcorp, Amcorp Trade Centre, No. 18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: +60-3-7955-9390, Fax: +60-3-7955-9510
Renesas Electronics India Pvt. Ltd.
No.777C, 100 Feet Road, HAL 2nd Stage, Indiranagar, Bangalore 560 038, India
Tel: +91-80-67208700, Fax: +91-80-67208777
Renesas Electronics Korea Co., Ltd.
17F, KAMCO Yangjae Tower, 262, Gangnam-daero, Gangnam-gu, Seoul, 06265 Korea
Tel: +82-2-558-3737, Fax: +82-2-558-5338© 2018 Renesas Electronics Corporation. All rights reserved.
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