A Revolution in Resolution:
KODAK Functional Printing Solutions
for unrivaled detail in your next productMAKING YOUR VISION REAL

With world class expertise in materials science,
Kodak can help you create the next generationof flexible, high-resolution electronic products.
Whether it’s antennas, heaters, sensors, or the cutting-edge concept that’s
still on your drawing board, we have the global capabilities, clean room
facilities, and proprietary technology to be the perfect partner for massproduction roll-to-roll print products – enabling your manufacturing line,
manufacturing your products, or working with you on your prototypes todiscover what’s possible.

3 ways to partner 100s of years
KODAK EKTAFLEX Prepress Solutions,printed electronics contract manufacturing& transparent copper micro-wire products.

Combined experience in functional printing

12,800dpi < 1,000 particles
KODAK EKTAFLEX Imagers pattern at
ultra-high resolution

Class 1,000 / ISO 6 clean room manufacturing

1000s SQM 17”
Manufacturing-scale plant capacity

Maximum width of substrate for contract
manufactured and copper micro-wire products< 1Ohm/□6μm

Less than 1 Ohm/□ at >80% visual
light transmission with copper
micro-wire products

Achievable printed line width

Pushing flexo to print
the impossible
Our KODAK EKTAFLEX Technology takes
flexography in a whole new direction: using it todeliver ultra-high-resolution, high-speed functional
printing. We can produce features that simply
aren’t possible with screen or inkjet printing
to deliver your designs with high fidelity in fullproduction quantities.

READY TO ROLL

TRANSPARENT ADVANTAGE

We can use our roll-to-roll additive
manufacturing process to deliver printed
conductive films or multi-layer electroniccomponents. These components will beof the highest quality and ready to be
integrated into your products —whether you require rolls of material
or die-cut parts.

We can deliver products with superior
conductivity and optical transparency
through the use of our proprietary process
for copper micro-wire formation. By
using a high-resolution printed catalyst
with electroless plated copper, we have
independent control of the micro-wirepattern and the copper thickness.

CLEAN ROOM MANUFACTURING

CLOSE CONSULTANCY

Our manufacturing operations are 100%
clean room from prepress throughpackaging. High-quality patterned
flexographic plates and films with finefeatures require tight control over themanufacturing environment.

Our seasoned specialists will remain by yourside throughout the process, giving you
the confidence to integrate your functional
print innovations, seize new opportunities,
and make even your most future-facing
ideas a reality — fast. From flexo plates toprototypes to production, we can work withyou to optimize your manufacturing – inyour facility or ours.

ADVANCING TRANSPARENTCONDUCTIVE PRODUCTSENABLING HIGH RESOLUTIONFLEXOGRAPHIC PRINTING

At Kodak, we’ve spent years developing
our expertise and assets in the design andmanufacture of fully additive, transparent,
flexible electronic components. If yourproducts can benefit from very low
resistivity and high transparency, you’rein the right place.

We developed best in-class high-resolution
patterning for flexographic plates used in
our manufacturing process – and now
we’re sharing that high-resolution capability
with you. From custom patterned plates
to prepress equipment, we can partner todecrease the minimum feature size fromyour manufacturing press.

Working on something else?
Let us know.

REDUCE YOUR FINANCIAL RISK
You may be looking to develop yourown proof of concept or prototypes.
You may even be ready for full-scale
production. Whatever your vision, ourconsultancy and commercialization
service can propel you on your path,
without you having to risk major
capital investment.

BE FIT FOR THE FUTURE
The future of tech is about being
powerful but small, connected
but invisible. Whether you want anundetectable antenna or heater,
hidden security features, or just more
devices per area, Kodak can help you
print smaller, at higher resolution andwith faster throughput.

HARNESS KODAK’S EXPERTISE
We’d love this to be the first step inan ongoing partnership where we
guide you towards smaller, better,
faster, more ambitious print, using
our history and excellence in roll-toroll manufacturing.
But it all starts with a conversation.
So, tell us: What are you working on?

The following specifications are typical for our process.
But if your ideas go in a different direction, don’t hesitate to get in touch.
KODAK EKTAFLEX Plate Patterning (Custom Patterned Plates, Contract Manufacturing & Copper Micro-Wire Products)
Imaging resolution

12,800 dpi imager, 2 µm edge definition

On-plate resolution

2 µm for edge definition of larger areas; 4 µm for isolated features

Plate size

800 x 1067 mm (31.5 x 42.0 in.)

Relief

100 to 400 µm

Ink compatibility

Aqueous, solvent-based, and UV-cured

Imager file type

TIFF @ resolution

Design Services (Custom Patterned Plates, Contract Manufacturing & Copper Micro-Wire Products)
Supported file types

Most vector formats, such as: DXF, PDF, other CAD applications; Preferred multi-layered DWG/DXF; wire-frame, closed polyline for contract manufacturing and copper micro-wire products

Design translation

Optimization for performance and transparency for copper micro-wire products

Screening

Custom KODAK DIGICAP and other NX Screening patterns can be applied for better print quality

Separations

Custom specification of the combination or separation of layers between customer-defined plates

Substrate Specifications (Contract Manufacturing & Copper Micro-Wire Products)
Standard

PET, 50 µm to 125 µm (2-mil to 5-mil)

Alternative substrates

Certification of customer specified substrates from 50 µm to 125 µm (2-mil to 5-mil)

WidthStandard roll width @ 17"

Standard design area

337 mm x 566 mm

Supporting Graphics Content (Contract Manufacturing & Copper Micro-Wire Products)
Inks / colors / etc.

UV curable preferred; black and yellow graphics inks standard

Logos, labels, etc.

Customer defined process color possible

Camouflage

Pattern and color matched to copper micro-wire patterns for improved covert integration

Marks for downstream processing

Customer defined marks and fiducials for downstream integration (black ink standard)

Serialization

Unique 2D data matrix barcode & human readable text inkjet printed on each part (black)

Functional Patterns (Contract Manufacturing Products)
Functional inks

Conductive Ag inks available

Customer supplied/defined inks

Standard process for ink certification for contract manufactured products

Functional Patterns (Copper Micro-Wire Products)
Copper thickness

Cu thickness from .5 µm to 1.5 µmPassivation

Standard option for environmental stability and color neutralization

Copper minimum feature size

10 µm standard; below 7-10 µm available depending on design

Delivered Product Specifications (Contract Manufacturing & Copper Micro-Wire Products)
Release testingElectrical, optical and/or dimensional testing available

Finished format

Roll, sheet, or die cut

Protective liner

Optional on one or both sides

Contact us at sales.printedelectronics@kodak.com
Eastman Kodak Company
343 State Street Rochester, NY 14650 USA
Produced using KODAK Technology.
© Kodak, 2023. Kodak, Digicap, Ektaflex and the Kodak logo are trademarks. Subject to technical change without notice. K-999-23.01.10.EN.02