ARTIFACT GUIDE

PrintedCircuit Board
Films

ProtectingYour Images

I N T RO D U C T I O NPrinted Circuit Board Films – Artifact Guide
Minimizing artifacts to maximize quality
While many factors can affect image quality, microscopic defects known
as artifacts degrade film images. If the images are seriously degraded, it’s
likely that the printed circuit boards made from those images will berejected.
Rejected boards can’t be sold. They cost you money. And doing themover wastes time and resources.Your productivity suffers.You lose capacity.
To make sure you achieve the highest quality images – and operate costeffectively – it is critical to minimize the number and types of artifacts
that appear on processed films. The solution is simple – Proper film
handling practices will prevent nearly all artifacts that cause rejects on
printed circuit board films.
Film defects fall into two main categories:• D-max Artifacts – a clear mark in the black part of the film
• D-min Artifacts – a mark in clear areas of the film
We have also included a third section describing less common varieties ofphysical artifacts which may be found anywhere on the phototool.
In all cases, artifacts can be drastically reduced with proper careand consideration of your:• Facility set-up – Cleanliness is critical in darkrooms andphotoplotter rooms.
• Film handling and processing methods – Keep equipment andworkspaces clean. Rigorously maintain film processors andhandle film with care.
This guide will help you identify a wide variety of artifacts andshow you how to avoid each of them.
Each of the following pages explains one type of artifact. Examples areshown along with a description of how and where that type of artifact
may form. Detailed troubleshooting procedures are offered to help you
prevent similar artifacts in the future.
We hope you find this useful. If you have any questions, please e-mail us
at pcbproducts@kodak.com or visit www.kodak.com/go/pcbproducts

TA B L E O F C O N T E N T S

Printed Circuit Board Films – Artifact Guide

I
IISections

Page

General
Guidelines

1

Film handling practices in cleanroom
environments

7
8
10
11
12
13
15

Introduction
Pinholes - emulsion pickoff
Abrasion Lines - gouges and scratches
Pinholes - dust & shadow images
Pinhole Diagnosis Test
Emulsion Desensitization – iron oxide
rust contamination/alkali contamination
Restricted Development

17
18
19
21
22
23
24

Introduction
Pepper Fog Spots
Chucking Abrasions
Photo Abrasions
Kinking
Static Marks
Splash Marks

25
26
27
28

Introduction
Bioslime
Water Spots
Lamination Bubbles entrapped particles

D-max
Artifacts

III

D-min
Artifacts

IV

Other Physical
Artifacts

I. GENERAL GUIDELINES

I

GENERAL GUIDELINES

GENERAL GUIDELINES

Film handling practices
in cleanroom environments
To minimize the possibility of creating artifacts, make sure your darkrooms
and photoplotter rooms are clean, maintain film processors regularly, andalways handle films with care and common sense. Artifacts can be virtuallyeliminated by following these guidelines.
Film handling• Be careful of metal surfaces.
• Handle film only by its edges.
• Use the fingertips of both hands.
• To carry a single sheet, fold film in half and hold it in a "3-point grip"
between thumb and middle finger, with index finger in the center to keep
film surfaces separated.
• Give yourself room to spread out.
• Carry film flat in trays or boxes.
• Wear gloves.
• Avoid jewelry that may have sharp edges.
• Clean film as recommended– Wipe in one direction, not in a circular motion.
– Use cleanroom wipes, environmentally safe film cleaners,
TEKNEK (or equivalent) Rollers.
In the photolab• Be careful removing raw film from the original package as well as taking
film in or out of humidity conditioning racks.
• Avoid sharp burrs or grit on racks.
• Only use pre-conditioning cabinets with a circulating fan and HEPA filterssuch as those available from DEXON.
• Keep the inside of the humidity conditioning cabinet and inside of thephotoplotter free of dust – vacuum weekly.
• Load cassettes with care.
• Minimize exposure to dirt and dust when handling and transporting film.
• Carefully package and deliver film to the resist imaging dept.
• Store film in its original foil bag. Do not bring cardboard boxes
into cleanroom.
In resist imaging• Exercise care when:– Removing films from packaging during setup.
– Carrying films from worktables to work stations.
– Positioning the phototool in exposure frames.
– Removing the phototool from register pins.
Printed Circuit Board Films – Artifact Guide

1

GENERAL GUIDELINES

I

GENERAL GUIDELINESIn resist imaging – continued– Cleaning the phototool between exposures.
– Lifting film off pins.
– Repackaging phototool after use.
– Removing two-sided sticky tape.
Avoid:• Copper burrs, resist chips, laminate slivers.
• Sharp edges of panels.
Make sure to:• Replace wipes often.
• Clean TEKNEK Rollers after use.
Film processing
Make sure you are processing film at the recommended development time
and temperature. Kodak recommends 35o C at 45 seconds for all KODAK
ACCUMAX photoplotter films. Underdeveloping will cause low dmax andaffect line quality. Also make sure processor guides and rollers are properlyaligned and crossovers adjusted correctly. Clean tanks of bioslime and maintain the processor to avoid:• Dirty entrance rollers.
• Dirty top rollers.
• Salt crystals on crossover guides.
• Dirty squeegee rollers at entrance to dryer.
• Particulates on dryer rollers.

Developer andFixer Filtration

Use 10µm filter. Change weekly.

Water Filtration

10µm filter is best. Change weekly.
No larger than 25µm.

Daily Maintenance

Clean all top rollers, entrance rollers, crossovers,
wash to dryer squeegee rollers.

Weekly Maintenance

Remove all racks, developer, fixer, and clean withhigh-pressure hot water. Use Brushes to clean.
Avoid scratching stainless steel with SCOTCHBRITE Pads.

KODAK Roller
Transport
Cleanup Film 4955

Use daily to remove particles. Especially important to use
immediately after cleaning racks and after systems
cleaning.

2 Printed Circuit Board Films – Artifact Guide

I

GENERAL GUIDELINES

GENERAL GUIDELINES

Processor maintenanceControlling bioslime growth• Minimize bioslime which is a major cause of pinhole emulsion pick off.
• Daily addition of 30mL (1-oz) of household bleach will help to dissolve
gelatin particles, preventing redeposits and minimising bioslime growth.
• WASHCLEAR, from Rothtech Ecological, has also proven to be very effective.
• PHOTOBROME, from Raynostix, is also effective with a convenient auto-feed
dispenser to the processor.
Cleaning film for phototooling applications
To clean film, use only isopropyl alcohol (91 percent) or heptane.
Soft, lint-less, absorbent cotton pads, WEBRIL Handi-Pads, or their equivalent
should be used. Never use water because it will soften the gelatin.
• Apply cleaner to the cleaning wipe, not directly to the film.
• Wipe film in a single up-and-down direction, NOT in a circular motion.
• Fold the cleaning wipe frequently to keep dirt particles away fromthe film surface.
• Change wipes often.
Cleanroom conditions: practice and maintenance
Cleanroom practice may be considered under several categories:
Materials• Exterior packages should conform to a certain clean standard to be
admitted to the cleanroom.
• Avoid shedding materials such as paper, or cardboard boxes.
• Use intermediate containers to transport materials to cleanroom,such as plastic containers.
• Decontaminate larger items in a preparation room before enteringclean area.
• Material transportation equipment should conform to the samecleanroom standard.
• Avoid large storage areas near to the cleanroom.
• Practice Just-In-Time delivery.
Equipment• Should not generate contaminants – such as rust.
• Should not interfere with filtered air flow and/or cause turbulence.
• Surfaces should be easy to clean. (e.g. smooth, glossy, no crevices)• Perform maintenance outside the clean environment when possible.
• Use trained maintenance personnel with awareness of cleanroom
requirements.
• Stainless steel tables and wire coated racks are good choices for use incleanrooms.
Printed Circuit Board Films – Artifact Guide

3

GENERAL GUIDELINES

I

GENERAL GUIDELINES
Physical layout• Locate equipment to optimize process flow. Steps of the workflow should
physically follow each other and not traverse back and across the work area.
• Minimize traveling from area to area by optimizing the flow of people
and materials.
• Control access to areas that are frequently used during the process.
• Operations that require cleanest conditions should be performed closest
to filtered air supply.
• Maintenance personnel should be able to work with minimum accessto the cleanroom.
Controlled access• Tacky mats should be used at the entrances of both support rooms.
• All personnel should be required to change shoes or wear shoe covers
before entering the clean area.
• Use intercom system to facilitate communications in the cleanroom andminimize personnel movements.
• Establish written policies to control cleanroom access for people, materials,
and equipment.
Training• Operators should understand why the cleanroom is necessary and how
they can contribute to keeping it clean.
• Encourage people to spot problems and provide solutions to maintaincleanroom standards.
Clothing• Wear cleanroom clothing in cleanroom only.
• Cleanroom clothing should be worn properly – coats buttoned,
hair inside cap, etc.
• Use the recommended cleanroom clothes for the specified cleanroom level.
Personal habits• Avoid use of products that generate airborne particles, e.g., body powders,talc, baby powder, foot powder, etc.
• Avoid use of products that give residual contaminants, e.g., hand andbody lotions or creams.
• Avoid use of products that give off vapors and/or particulates into the air,e.g., colognes, perfumes, after-shave, cosmetics, nail polish, or hair sprays.
Supplies• Use special covered notebooks, made of special paper for cleanrooms.
• Use pens rather than pencils.
• Detergents and other cleaning supplies must meet cleanroom specifications.
• Give special attention to waste disposal.

4 Printed Circuit Board Films – Artifact Guide

I

GENERAL GUIDELINES

Printed Circuit Board Films – Artifact Guide

GENERAL GUIDELINES

Working methods• Restrict or minimize body movements when handling equipment.
• Any movement generates a flow of air that carries dust; most of it isinvisible to the human eye.
• Avoid movements such as touching your face and then touching the
product; this transfers oil, grease, and skin flakes to product.
• Minimize gestures and conversation.
• Eating and smoking must be forbidden in support rooms and cleanrooms.
• Provide an appropriate break room for eating and smoking.
Facility• Inspect all surfaces of the facility and equipment; tables, chairs, etc.
• Inspect and remove rust, corrosion, and flaking paint.
• Repaint with epoxy paint where necessary or use high-gloss paint foreasy cleaning.
• Use hard surface materials for flooring, never carpet.
• Use laminate coated ceiling tiles.
• Maintain cleanroom to 50% RH.
Cleaning• Schedule cleaning so it does not interfere with production.
• Cleaners should wear appropriate garments.
• Cleaning should proceed from highest surface level to lowest, andfrom cleanest areas to less clean.
• Cleaning should be followed by a period of time to allow dust to settle;
do this before restarting production.
• All materials and equipment used in the clean operations must be approved.
Support rooms• Areas of access to the cleanroom.
• Very important in controlling contamination.
• Used for changing to cleanroom clothes and their storage.
• Use support rooms to clean materials and equipment before entering
the cleanroom.
• Support rooms provide a boundary of near cleanroom conditions;a buffer zone.
Facilities• Lighting must meet needs of the process and product.
• Light fixtures should not interfere with air flow and should not takesignificant HEPA space in an overhead laminar flow area.
• All piped-in services such as gases, liquids, etc. should have final in-line
filtration to reduce contamination.
• Delivery systems and conduits should be made of non-shedding
inert material.

5

I I . D - M A X A R T I FAC T S

D-MAX ARTIFACTS IIINTRODUCTIONINTRODUCTION – D-MAX ARTIFACTS

These defects appear as anomalous clear
areas in the maximum density image areas
on the film.
There are four main causes considered here:• Actual removal of the emulsion before
or after exposure• Dust or fibers interfering during plotting• Emulsion desensitization• Restricted processing

Printed Circuit Board Films – Artifact Guide

7

PINHOLES – EMULSION PICKOFFII D-MAXARTIFACTSPINHOLES – EMULSIONPICKOFFW H AT A R E T H E Y ?

Emulsion pickoff pinholes are actual holes in the image where the emulsion
has been physically picked off the polyester base. These pinholes usually havean irregular shape and sharp edges, unlike pinhole shadow images caused by
dust (see page 11).
Small pinholes (less than 25 µm or 1 mil) normally will not produce animage on the final circuit board. Larger pinholes (greater than 50 µm or
2 mil) WILL produce an image.
You can use the test on page 12 to determine whether pinholes are caused byemulsion pickoff or dust.

WHEN CAN THESE OCCUR?
Emulsion pickoff pinholes can happen at just about any point in the film
handling process, including:• Pre-exposure handling• Plotting• Processing• Post-process handling including resist exposure

W H AT C AU S E S T H E M ?
A simple nick of the emulsion during pre-process handling will do it.
So will an abrasion during processing, and many types of damage canoccur when films are handled immediately after processing. If films are
not laminated, considerable care is needed during the use of the film forphototooling. Be careful at every stage.
8 Printed Circuit Board Films – Artifact Guide

D-MAX ARTIFACTS IIPINHOLES – EMULSION PICKOFFPINHOLES – EMULSION PICKOFF

Here is a list of opportunities for the film to come into contact with sharpedges or abrasive materials, which could damage the film.
Pre-processing• Unloading film from packages.
• Loading film into conditioning cabinets.
• Removing film from cabinets.
• Loading film into cassettes or plotter drum/bed.
• Unloading film from plotter.
• Transferring film to processor.
Processing• Dirt on processor rollers.
• Misaligned film guides.
• Salt on crossover guides.
• Bioslime in wash tank.
Post-processing• Removing film from drying bin.
• Dirt on light table.
• Burrs on microscope base.
• Grit in plastic bags.
• Burrs or grit on cutting boards.
Resist exposure• Placing or removing film in exposure frame.
• Adjusting alignment of film in exposure frame.
• Placing or removing board in exposure frame (usually a problem onlywith manual exposure units).
• Dirt in exposure frame .

H OW C A N T H E Y B E P R E V E N T E D ?
• Take care when handling film near metal surfaces.
• Handle film only by the edges.
• Avoid jewelry with sharp edges.
• Practice good processor maintenance to eliminate buildup of dirt, salt,
and bioslime; maintain film guides.
• In post-process handling, eliminate dust and burrs in areas where you
handle, inspect, cut, retouch, and expose film.

Printed Circuit Board Films – Artifact Guide

9ABRASION LINES – GOUGES AND SCRATCHESII D-MAXARTIFACTS
ABRASION LINES – GOUGESAND SCRATCHESW H AT A R E T H E Y ?

These are basically the same as
emulsion pick off pinholes except ona larger scale. You may be able tosee them with the naked eye or ahand lens. A scratch line that has
removed emulsion can generally
easily be distinguished from a fiber,
which causes a shadow image.
Superficial scratches that have not removed emulsion are usually not a
problem, as they will not image on the final circuit board.

WHEN CAN THESE OCCUR?
The film surface can be scratched or gouged at almost any point in the film
handling process. See Emulsion pickoff pinholes (page 8).

W H AT C AU S E S T H E M ?
Abrasion from sharp surfaces at any stage in the production and useof the film.

H OW C A N T H E Y B E P R E V E N T E D ?
The simplest and most effective way is to practice good housekeeping
anywhere and everywhere you store or handle film. See film handlingpractices (page 1).
10 Printed Circuit Board Films – Artifact Guide

D-MAX ARTIFACTS IIPINHOLES – DUST & SHADOW IMAGES

These image “holes” are caused
when dust on the film prevents
exposure of the emulsion. Likeemulsion pickoff pinholes, they
have an irregular shape. Unlike
pickoff pinholes, they tend to havesoft, diffused edges. Quite often
they are clearly caused by fibers.

PINHOLES – DUST & SHADOW IMAGESW H AT A R E T H E Y ?

The size of these defects can range from microscopic to easily visible with
the naked eye.
The test on page 12 will help you determine whether pinholes are caused by
pickoff or dust.

WHEN CAN THESE OCCUR?
Dust is primarily a problem during two key processes:• Pre-exposure handling• Plotting

W H AT C AU S E S T H E M ?
During pre-process handling, problems arise due to:• Dust particles from packaging.
• Dust accumulation in conditioning cabinets.
During plotting, most artifacts are caused by:• Accumulation of dust in cassettes or the plotter drum/bed.
• Particles of dust inside the plotter.
Printed Circuit Board Films – Artifact Guide

11

PINHOLES – DUST & SHADOW IMAGESII D-MAXPINHOLES—DUST &ARTIFACTSSHADOW IMAGESH OW C A N T H E Y B E P R E V E N T E D ?
The simplest and most effective way is to practice good housekeeping
anywhere and everywhere you store or handle film prior to processing.
• Weekly vacuuming of the inside of the photoplotter and film cassette isespecially important.
Review all cleanroom operations – see page 3 on cleanroom practice andmaintenance.

Pinhole Diagnosis Test
To determine whether pinholes are caused by emulsion pickoff (page 8) or ashadow image produced by dust or fibers (page 11), apply food coloring
to the film you want to test.
1. Apply dye to the pinhole with an artist’s brush or a cotton swab.
2. After 10 seconds, blot excess dye. Wipe the film gently with a soft cloth.
3. Examine the pinhole to see whether it stays clear or absorbs color.
• If the pinhole stays clear, no gelatin is present to absorb the dye.
This indicates a pickoff pinhole.
• If the pinhole turns the color of the dye, gel is present to absorb the dye.
This indicates a pinhole caused by a dust shadow.

If a Pinhole is due to: shadow image• Gelatin is present to absorb dye• Pinhole turns color of dye

If a Pinhole is due to: pickoff• No gelatin is present to absorb dye• Pinhole stays clear

SHADOW

PICKOFF
CLEAR OVERCOAT
D-MAX IMAGE
7 MIL SUPPORT

Note: Images not to scale (emulsion layers are only 5 µm thick; the base is 178 µm thick)

12 Printed Circuit Board Films – Artifact Guide

D-MAX ARTIFACTS IIOXIDE RUST CONTAMINATIONEMULSION DESENSITIZATION – IRON
OR ALKALI CONTAMINATION

Iron spot contamination is characterized as a perfectly clear circle with adiameter up to a few hundred microns. If examined microscopically, the circle
has fuzzy edges and evenly spaced lines at the edge. These are raster lines fromimaging in the plotter. Sometimes the rust particle can still be seen stuck on
the surface of the film.

EMULSION DESENSITIZATIONW H AT A R E T H E Y ?

Desensitization due to other chemicals
may also occur. Spots may not be
perfectly circular and may be muchlarger than those due to iron – up to
several millimeters in extent.

WHEN CAN THESE OCCUR?
These types of contamination happen before the development stage inthe processor.

W H AT C AU S E S T H E M ?
In exposed areas the image should be perfectly black (D-max). However a rustspot has contaminated the film; iron has diffused out from the contaminationand desensitized the silver halide grains making them unresponsive or only
partially responsive to the laser exposure. It is the partially responsive areasthat are responsible for the faint images of the raster lines at the circle’s
perimeter. This type of contamination is rare.

Printed Circuit Board Films – Artifact Guide

13

II D-MAX
ARTIFACTS
EMULSION DESENSITIZATION–EMULSION DESENSITIZATIONIRON OXIDE RUST CONTAMINATIONOR ALKALI CONTAMINATION

Contamination by other chemicals such as strong alkali may decolorize thelight-sensitive dye, preventing image formation during the plotting stage.
The silver halide crystals no longer respond to the light.

H OW C A N T H E Y B E P R E V E N T E D ?
Contamination of the film usually occurs in the steps prior tophotoplotting. Inspect film storage areas and inside the photoplotter for
evidence of corrosion. Review film handling practices on page 1 of this guide.

14 Printed Circuit Board Films – Artifact Guide

D-MAX ARTIFACTS II

RESTRICTED DEVELOPMENT

RESTRICTED DEVELOPMENTW H AT I S I T ?

This defect appears as a clear
patch(es) or streak(s) in the D-max
area of the film. The shape is always
irregular and the edges will probably
not be sharp. These artifacts areusually visible with the naked eye.

WHEN CAN IT OCCUR?
The contamination will have happened prior to processing, during film
handling before plotting, or perhaps in the plotter itself. Oily substances are
the most likely contaminants.

W H AT C AU S E S I T ?
It occurs when some substance or contamination on the surface of the film
has prevented penetration of the developer during processing.

H OW C A N I T B E P R E V E N T E D ?
• This defect can be avoided by careful film handling procedures as describedat the beginning of this document and well-maintained cleanroom facilities.
• Do not underdevelop the film. Short processing times will increase thelikelihood of restricted development artifacts. A minimum 45 seconds ofdevelopment time is strongly recommended.

Printed Circuit Board Films – Artifact Guide

15

I I I . D - M I N A R T I FAC T S

D-MIN ARTIFACTS III

INTRODUCTION

There are six main causes considered here:• Pepper fog spots• Chucking abrasions• Photo abrasions• Kinking• Static marks• Splash marks

Printed Circuit Board Films – Artifact Guide

INTRODUCTION – D-MIN ARTIFACTS

These defects appear as marks in the clear
areas on the film.

17

PEPPER FOG SPOTSIII D-MIN
ARTIFACTS
PEPPER FOG SPOTSW H AT A R E T H E Y ?

Pepper fog is made up of perfectlyround dark spots, 5 to 30 micrometers
in diameter, which resemble pepper.

WHEN CAN THESE OCCUR?
Pepper fog occurs during processing.

W H AT C AU S E S T H E M ?
The spots are the result of spontaneous development of silver halide
grains in the emulsion.
Pepper fog is usually caused by problems in processing, such as:• Developer temperature too high• Under replenishment of developer• Oxidized developer due to low utilization/tank turnover• Development time too long
• Developer contaminated by fixer
Pepper fog can also be caused by poor safelight conditions.

H OW C A N T H E Y B E P R E V E N T E D ?
• Make sure that you process film according to the correct specifications fortime, temperature, and replenishment. These are described in the film data
sheets.
• In periods of low processor turnover, adjust replenishment to compensate foroxidation and evaporation. Evaporation is best managed by adding water
into the tanks.
• Avoid contamination of the developer with fixer. When adding fixer directly
into the processor, cover the developer section with a splash guard or pieceof film to catch spatters.
• Inspect safelights and make sure there is no “white-light” leakage in thedarkroom.Cover plotter display panels when film is being loaded into the plotter.
18 Printed Circuit Board Films – Artifact GuideD-MIN ARTIFACTSCHUCKING ABRASIONSCHUCKING ABRASIONSW H AT A R E T H E Y ?

III

These defects can have a highlyvariable appearance and havebeen described as zigzag patterns,
lightning bolts, or paint splashes.
They are not usually detected with
the naked eye but are seen in AOIscans or microscopic examinationof processed films.
The whole defect is usually no more than a few hundred micrometers acrossand consists of spots of developed silver connected wholly or partially bydeveloped silver lines.

WHEN CAN THESE OCCUR?
Chucking abrasions usually happen during film transport, but may also
result from film handling before processing.
If films are not vacuum-sealed in their bags, it is possible that film surfaces rub
against each other during transit. Usually only the films near the top andbottom of the stack, near the outer edges of the sheets, are affected. It is more
likely to occur in non-vacuum sealed packages where films can more easily rub
against each other.

Printed Circuit Board Films – Artifact Guide

19

CHUCKING ABRASIONSIII D-MIN
ARTIFACTS
CHUCKING ABRASIONSW H AT C AU S E S T H E M ?
If tiny particles of grit are trapped between sheets that rub against eachother during transit, the abrasion or pressure of the particle canphysically fog the silver-halide grains. When the film is processed, a developed
silver image of the particle’s path is seen.

H OW C A N T H E Y B E P R E V E N T E D ?
• If an opened film bag needs to be transported, make sure that the bag istightly wrapped so that sheets do not rub against each other.
• Make sure that all film handling areas are free from dust.
Remove packaging from film handling areas.
• Handle film carefully to reduce the risk of sheets sliding against
each other. Do not jog the film stack.
• Cut film bag down the center and fold open the bag to reveal anundisturbed stack of film. Carefully lift the entire film stack and load into
the plotter – be careful not to allow the stack to slide.
• Never load a partial stack of film into the plotter – always load an entire foil
package of film at a time to eliminate excessive film handling. Use a large
film loading table in the darkroom to accomplish this task.

20 Printed Circuit Board Films – Artifact GuideD-MIN ARTIFACTS
PHOTO ABRASIONS

These are thin black lines, usuallystraight, sometimes continuous, othertimes interrupted. They are developed silver, and are sometimes called
photoabrasion marks. Unlike chucking abrasions, they can usually beseen with the naked eye. If heavy
enough, they could appear on the
final board.

PHOTO ABRASIONSW H AT A R E T H E Y ?

III

The orientation of the marks on the film is often an indication of their origin.
For example, centimeter-long lines parallel to the machine travel of the film
indicate a scratch event associated with film transport before the developmenttank of the processor. Lines at random angles to the edges of the film suggest
dirt-induced scratches during film handling.

WHEN CAN THESE OCCUR?
They can happen at any time during film handling prior to processing.

W H AT C AU S E S T H E M ?
Sharp edges can cause abrasion lines during film handling before processing.
As in chucking abrasion, the silver halide crystals respond to pressure as tolight, resulting in an image of the abrasion event.

H OW C A N T H E Y B E P R E V E N T E D ?
Follow all recommendations for film handling and cleanroom practice inSection I.
Check film transport rollers and guides inside the plotter in-line conveyancesystems and processor for debris build-up and burrs.

Printed Circuit Board Films – Artifact Guide

21

KINKING

III D-MIN
ARTIFACTS
KINKINGW H AT A R E T H E Y ?

These are short (maybe up to a few
millimeters) curved black lines in theD-min area of the film.

WHEN CAN THESE OCCUR?
They can happen at any time during film handling prior to processing.

W H AT C AU S E S T H E M ?
Bending or folding the film around a small radius causes these marks. The
intense pressure of these events fractures the silver halide grains, leading totheir development as silver grains during film processing.

H OW C A N T H E Y B E P R E V E N T E D ?
Careful film handling, especially of large sheets, will prevent kink marks.
Handle film only by the edges, using the fingertips of both hands.
• Carry film flat in trays or boxes.
• To carry a single unprocessed sheet, fold the film loosely in half and hold it
in a three-point grip, i.e., between your thumb and middle finger with yourindex finger in the center to keep the film surfaces separated.
• Allow plenty of room to spread out materials in the darkroom.

22 Printed Circuit Board Films – Artifact GuideD-MIN ARTIFACTS III

STATIC MARKSSTATIC MARKSW H AT A R E T H E Y ?

Two types occur; one is almost circular with very fuzzy edges, the otherconsists of short, fuzzy lines. Both are microscopic and will be picked up only
by AOI. These marks are extremely rare.

WHEN CAN THESE OCCUR?
They can happen at any time during film handling prior to processing, but
most likely during removal of film from packaging or loading of the plotter.

W H AT C AU S E S T H E M ?
An electrostatic discharge acts like light, causing silver halide grains to develop into metallic silver during processing.

H OW C A N T H E Y B E P R E V E N T E D ?
Today’s films have anti-static protection that helps to prevent such discharges.
Customers should follow the plotter manufacturer’s recommendations for
operating humidity (usually 50 to 60% RH).

Printed Circuit Board Films – Artifact Guide

23

SPLASH MARKSIII D-MIN
SPLASH MARKS ARTIFACTSW H AT A R E T H E Y ?

Black circular or drop-shaped marks,
possibly visible to the naked eye, in theD-min areas of the film.

WHEN CAN THESE OCCUR?
These can occur anytime prior to processing.

W H AT C AU S E S T H E M ?
Typically they are caused by minute splashes of developer or other sensitizing
chemical on the unexposed/unprocessed film.

H OW C A N T H E Y B E P R E V E N T E D ?
Good film handling procedures and adherence to cleanroom practice will
prevent these defects. Most manufacturers keep the processor and associatedchemicals separate from the plotter and film handling areas, and this practiceis recommended.

24 Printed Circuit Board Films – Artifact Guide

I V. OT H E R P H YS I C A L A R T I FAC T S

OTHERINTRODUCTIONPHYSICAL ARTIFACTS IV

There are three main causes considered here:• Bioslime• Water spots• Lamination bubbles

Printed Circuit Board Films – Artifact Guide

INTRODUCTION – OTHER PHYSICAL ARTIFACTS

These artifacts may be found anywhereon the film but tend to be more visible
in the D-min areas.

25

BIOSLIMEIV OTHERPHYSICAL ARTIFACTSBIOSLIMEW H AT I S I T ?

Bacteria and fungi feed on gelatin in wash water solutions. These microscopic
contaminants can accumulate to the point where they appear as dirt andslime. These particles can adhere to film and form an image that results in a
rejected circuit board.

WHEN CAN IT OCCUR?
Bioslime forms in wash tanks systems where it will contaminate film.

W H AT C AU S E S I T ?
Microbes that form bioslime can come from people, water, air, solutions, or
equipment. Bioslime – and debris from bioslime – can contaminate film.
In addition, bioslime can form in the processor due to use of recycledwash water.

H OW C A N I T B E P R E V E N T E D ?
• Add 30 ml of household bleach to wash water tank every day (see page 3).
• Drain processor wash tank when not in use, and remove lid of processor toallow the inside of the processor to dry out.
• With recycled wash water, change out water holding tanks frequently –at least every two days.
WARNING:
DO NOT allow concentrated sodium hypochlorite bleach, e.g., CLOROX bleachor SUNNY SOL detergent,to come in contact with photoprocessing solutions –especially fixer. DO NOT process sensitized products while sodium hypochlorite
bleach remains in the system – bleach will remove emulsion layers.

26 Printed Circuit Board Films – Artifact GuideOTHER
WATER SPOTS PHYSICAL ARTIFACTS IV
Water spots appear as small, often
whitish rings, a millimeter or less indiameter, most visible in the D-max
areas, but can also be seen byreflected light in clear areas. They
are not usually a serious defect thatwill cause a problem.

WATER SPOTSW H AT A R E T H E Y ?

WHEN CAN THESE OCCUR?
These marks occur during processing, in the wash and drying stages.

W H AT C AU S E S T H E M ?
These spots are caused during the wash and dry steps during film processing
as not all water is removed from the back side of the film. They are more likely
to occur in a hard water area. If the final set of squeegee rollers, just prior to
the dryer section, is not working efficiently, water spots are more likely to occur.
• Processing systems set up with wash water recyling are especially prone towater spots.
• Besides hard water, fixer can carryover into the wash tank and can also
cause a spotting problem when used with recyled water system.

H OW C A N T H E Y B E P R E V E N T E D ?
Use of a water softener may help their prevention. If wash water is being
recycled, a small amount of added detergent or KODAK PhotoFlow will also
improve water spot-free drying.
Correct alignment or possibly replacement (if they are worn or damaged) of
the final pair of squeegee rollers in the wash rack can often prevent theiroccurrence.
• Change wash water in holding tanks frequently.

27

LAMINATION BUBBLES – ENTRAPPED PARTICLESIV OTHERPHYSICALLAMINATION BUBBLES– ENTRAPPEDARTIFACTS
PARTICLESW H AT A R E T H E Y ?

These are tiny (around a millimeteror less in diameter) bubbles of air
trapped between the protective
laminate and the emulsion surfaceof the film. Often there is a piece ofdebris that has caused the bubble.

WHEN CAN THESE OCCUR?
These arise during the application of protective laminate film to the emulsion
side of the film.

W H AT C AU S E S T H E M ?
Dust or dirt on the film will increase the likelihood of an air bubble forming.

H OW C A N T H E Y B E P R E V E N T E D ?
Use a tacky roller (e.g., TEKNEK roller) to clean the film before lamination.
The usual recommendations mentioned in previous sections on film
handling and cleanroom maintenance apply. Make sure that the laminator isoperating efficiently.

28 Printed Circuit Board Films – Artifact Guide

For more information on Kodak’s Printed Circuit Board
products or other products for imaging, contact your local
Kodak sales representative or visit

www.kodak.com/go/pcbproducts
Or contact us at:
Eastman Kodak Company
Aerial & Industrial Materials
Printed Circuit Board Products
1447 St. Paul Street
Rochester, NY 14653-7128
pcbproducts@kodak.com©EASTMAN KODAK COMPANY, 2003.
Kodak, Accumax, and Take Pictures. Further. are trademarks of Eastman Kodak Company. IMC-945 CAT No. 846-2517