Sample &Buy

Product
FolderSupport &Community

Tools &
SoftwareTechnical
Documents

TPS61088
SLVSCM8A – MAY 2015 – REVISED MAY 2015

TPS61088 10-A Fully-Integrated Synchronous Boost Converter
1 Features

3 Description

•
•
•
•

The TPS61088 is a high power density, fully
integrated synchronous boost converter with a 11-mΩ
power switch and a 13-mΩ rectifier switch to provide
a high efficiency and small size solution in portablesystems. The TPS61088 has wide input voltage
range from 2.7 V to 12 V to support applications withsingle cell or two cell Lithium batteries. The devicehas 10-A switch current capability and is capable ofproviding an output voltage up to 12.6 V.

1

•
•
•
•
•
•
•
•
•

Input Voltage Range: 2.7 to 12 V
Output Voltage Range: 4.5 to 12.6 V
10-A Switch Current
Up to 91% Efficiency at VIN = 3.3 V, VOUT = 9 V,
and IOUT = 3 A
Mode Selection Between PFM Mode and Forced
PWM Mode at Light Load
1.0 µA Current into VIN Pin during Shutdown
Resistor-Programmable Switch Peak Current Limit
Adjustable Switching Frequency: 200 kHz to 2.2
MHz
Programmable Soft Start
Output Overvoltage Protection at 13.2 V
Cycle-by-Cycle Overcurrent Protection
Thermal Shutdown
4.50-mm × 3.50-mm 20-Pin VQFN Package

2 Applications
•
•
•
•
•

Portable POS terminal
Bluetooth™ Speaker
E-CigaretteThunderbolt Interface
Quick Charge Power BankThe TPS61088 uses adaptive constant off-time peakcurrent control topology to regulate the output
voltage. In moderate to heavy load condition, the
TPS61088 works in the pulse width modulation(PWM) mode. In light load condition, the device has
two operation modes selected by the MODE pin. One
is the pulse frequency modulation (PFM) mode to
improve the efficiency and another one is the forced
PWM mode to avoid application problems caused bylow switching frequency. The switching frequency in
the PWM mode is adjustable ranging from 200 kHz to
2.2 MHz by an external resistor. The TPS61088 also
implements a programmable soft-start function andan adjustable switching peak current limit function. In
addition, the device provides 13.2-V output
overvoltage protection, cycle-by-cycle overcurrent
protection, and thermal shutdown protection.
The TPS61088 is available in a 4.50-mm × 3.50-mm
20-pin VQFN package.
Device Information(1)PART NUMBER
TPS61088

PACKAGEBODY SIZE (NOM)

VQFN (20)

4.50 mm × 3.50 mm(1) For all available packages, see the orderable addendum atthe end of the data sheet.

4 Typical Application Circuit
C6

L1

VIN

SW

BOOT

VOUT
VOUT

C1

R3

C2

R2

VIN

FB

VCC

COMP

EN

ILIM

PGND

SS

AGND

MODE

R5
C3
ON
OFF

C4

R1

FSW

C5

R4
C7

1

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

TPS61088
SLVSCM8A – MAY 2015 – REVISED MAY 2015

www.ti.com

Table of Contents
1
2
3
4
5
6
7

Features .................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Typical Application Circuit ................................... 1
Revision History..................................................... 2
Pin Configuration and Functions ......................... 3
Specifications......................................................... 4
7.1
7.2
7.3
7.4
7.5
7.6

8

Absolute Maximum Ratings ...................................... 4
ESD Ratings.............................................................. 4
Recommended Operating Conditions....................... 4
Thermal Information .................................................. 4
Electrical Characteristics........................................... 5
Typical Characteristics .............................................. 6

Detailed Description .............................................. 8
8.1 Overview ................................................................... 8
8.2 Functional Block Diagram ......................................... 9
8.3 Feature Description................................................... 9

8.4 Device Functional Modes........................................ 11

9

Application and Implementation ........................ 13
9.1 Application Information............................................ 13
9.2 Typical Application .................................................. 13

10 Power Supply Recommendations ..................... 20
11 Layout................................................................... 20
11.1 Layout Guidelines ................................................. 20
11.2 Layout Example .................................................... 20
11.3 Thermal Considerations ........................................ 21

12 Device and Documentation Support ................. 22
12.1
12.2
12.3
12.4
12.5

Device Support...................................................... 22
Community Resources.......................................... 22
Trademarks ........................................................... 22
Electrostatic Discharge Caution ............................ 22
Glossary ................................................................ 22

13 Mechanical, Packaging, and Orderable
Information ........................................................... 22

5 Revision History
Changes from Original (May 2015) to Revision A

Page

•

Updated device status to production data ............................................................................................................................. 1•

Updated VCCLPH and VCCLPL typical voltage ............................................................................................................................ 5•

Fixed legend of Figure 2 and Figure 4 from input to output .................................................................................................. 6

2

Submit Documentation Feedback

Copyright © 2015, Texas Instruments Incorporated

Product Folder Links: TPS61088

TPS61088
www.ti.com

SLVSCM8A – MAY 2015 – REVISED MAY 2015

6 Pin Configuration and Functions

VCC

AGND

RHL Package
20 Pin VQFN With Thermal Pad
Top View

EN

ILIM

FSW

COMP

SW

FB
VOUT

SW
RHL

VOUT

SW
SW

VOUT

PGND

MODE

BOOT
VIN
NC

SS

NC

Pin Functions
PIN
NAME

NUMBERI/O

DESCRIPTION

VCC

1

O

Output of the internal regulator. A ceramic capacitor of more than 1.0 µF is required between
this pin and ground.

EN

2

I

Enable logic input. Logic high level enables the device. Logic low level disables the device
and turns it into shutdown mode.

FSW

3

I

The switching frequency is programmed by a resister between this pin and the SW pin.

SW4, 5, 6, 7

I

The switching node pin of the converter. It is connected to the drain of the internal low-side
power MOSFET and the source of the internal high-side power MOSFET.

BOOT

8

O

Power supply for high-side MOSFET gate driver. A ceramic capacitor of 0.1 µF must beconnected between this pin and the SW pin

VIN

9

I

IC power supply input

SS

10

O

Soft-start programming pin. An external capacitor sets the ramp rate of the internal error
amplifier's reference voltage during soft-startNC

11, 12—

No connection inside the device. Connect these two pins to ground plane on the PCB for
good thermal dissipation

MODE

13

I

Operation mode selection pin for the device in light load condition. When this pin is connected
to ground, the device works in PWM mode. When this pin is left floating, the device works in
PFM mode.

VOUT14, 15, 16

O

Boost converter output

FB

17

I

Voltage feedback. Connect to the center tape of a resistor divider to program the output
voltage.

COMP

18

O

Output of the internal error amplifier, the loop compensation network should be connected
between this pin and the AGND pin.

ILIM

19

O

Adjustable switch peak current limit. An external resister should be connected between thispin and the AGND pin.

AGND

20

—

Signal ground of the IC

PGND

21

—

Power ground of the IC. It is connected to the source of the low-side MOSFET.

Submit Documentation Feedback

Copyright © 2015, Texas Instruments Incorporated

Product Folder Links: TPS61088

3

TPS61088
SLVSCM8A – MAY 2015 – REVISED MAY 2015

www.ti.com

7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature (unless otherwise noted) (1)
MIN

MAX

BOOT

–0.3

SW + 7

VIN, SW, FSW, VOUT

–0.3

14.5

EN, VCC, SS, COMP, MODE

–0.3

7

ILIM, FB

–0.3

3.6

TJ

Operating junction temperature

–40

150

°C

Tstg

Storage temperature

–65

150

°C

Voltage (2)

(1)
(2)

UNIT

V

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal.

7.2 ESD Ratings
VALUE
Electrostatic
discharge

V(ESD)(1)(2)

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1)±2000

Charged device model (CDM), per JEDEC specification JESD22-C101, all pins (2)

±500

UNIT
V

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MAX

UNIT

VIN

Input voltage range

MIN
2.7

NOM

12

V

VOUT

Output voltage range

4.5

12.6

V

L

Inductance, effective value

0.47

2.2

10

µH

CI

Input capacitance, effective value

10CO

Output capacitance, effective value

6.8

47

1000

µF

TJ

Operating junction temperature

–40

125

°C

µF

7.4 Thermal Information
TPS61088
THERMAL METRIC(1)

RHL (VQFN)

UNIT

20 PINS
RθJA

Junction-to-ambient thermal resistance

38.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

39.8

°C/W

RθJB

Junction-to-board thermal resistance

15.5

°C/W

ψJT

Junction-to-top characterization parameter

0.6

°C/W

ψJB

Junction-to-board characterization parameter

15.5

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

3.1

°C/W

(1)

4

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.

Submit Documentation Feedback

Copyright © 2015, Texas Instruments Incorporated

Product Folder Links: TPS61088

TPS61088
www.ti.com

SLVSCM8A – MAY 2015 – REVISED MAY 2015

7.5 Electrical Characteristics
Minimum and maximum values are at VIN = 2.7 V to 5.5 V and TJ = -40°C to 125°C. Typical values are at VIN = 3.6 V and TJ =25°C
PARAMETERTEST CONDITIONS

MIN

TYP

MAX

UNIT

12

V

2.7

V

POWER SUPPLY
VIN

Input voltage range

VIN_UVLO

Undervoltage lockout (UVLO)
threshold

VIN_HYS

VIN UVLO hysteresis

VCC_UVLOUVLO threshold

IQ

Operating quiescent current from the
VIN pinOperating quiescent current from the
VOUT pin

2.7
VIN rising
VIN falling

2.4

VCC falling
IC enabled, VEN = 2 V, no load, RILIM = 100kΩ , VFB = 1.3 V, VOUT = 12 V, TJ up to 85°C

ISD

Shutdown current into the VIN pin

IC disabled, VEN = 0 V, no load, no feedback
resistor divider connected to the VOUT pin, TJ
up to 85°C

VCC

VCC regulation

IVCC = 5 mA, VIN = 8 V

2.5

V

200

mV

2.1

V

1

3

µA

110

250

µA

1

3

µA

5.8

V

EN AND MODE INPUT
VENH

EN high threshold voltage

VCC = 6 V

VENL

EN low threshold voltage

VCC = 6 V

REN

EN internal pull-down resistance

VCC = 6 V

VMODEH

MODE high threshold voltage

VCC = 6 V

VMODEL

MODE low threshold voltage

VCC = 6 V

RMODE

MODE internal pull-up resistance

VCC = 6 V

1.2
0.4

V
V

800

kΩ
4.0

1.5

V
V

800

kΩ

OUTPUT
VOUT

Output voltage range

VREF

Reference voltage at the FB pin

ILKG_FBFB pin leakage current

ISS

Soft-start charging current

4.5
PWM mode

1.186

PFM mode

12.6
1.204

1.222

1.212

VFB = 1.2 V

100

V
V
nA

5

μA

20

µA
µA

ERROR AMPLIFIERISINKCOMP pin sink current

VFB = VREF +200 mV, VCOMP = 1.5 V

ISOURCECOMP pin source current

VFB = VREF –200 mV, VCOMP = 1.5 V

20

VCCLPHHigh clamp voltage at the COMP pin

VFB = 1 V, RILIM = 100 kΩ

2.3

VCCLPLLow clamp voltage at the COMP pin

VFB = 1.5 V, RILIM = 100 kΩ, MODE pin floating

1.4

GEA

Error amplifier transconductance

VCOMP = 1.5 V

190High-side MOSFET on-resistance

VCC = 6 V

13

18

mΩ

Low-side MOSFET on-resistance

VCC = 6 V

11

16.5

mΩ

V
µA/V

POWER SWITCHRDS(on)CURRENT LIMIT

ILIM

VILIM

Peak switch current limit in PFM
mode

RILIM = 100 kΩ, VCC = 6 V, MODE pin floating

10.6

11.9

13

A

Peak switch current limit in FPWM
mode

RILIM = 100 kΩ, VCC = 6 V, MODE pin short toground

9.0

10.3

11.4

A

Reference voltage at the ILIM pin

1.204

V

SWITCHING FREQUENCYƒSW

Switching frequency

RFREQ = 301 kΩ, VIN = 3.6 V, VOUT = 12 V

500

tON_min

Minimum on-time

RFREQ = 301 kΩ, VIN = 3.6 V, VOUT = 12 V

90

180

kHz
ns

13.2

13.6

V

PROTECTION
VOVP

Output overvoltage protection
threshold

VOUT rising

12.7

Submit Documentation Feedback

Copyright © 2015, Texas Instruments Incorporated

Product Folder Links: TPS61088

5

TPS61088
SLVSCM8A – MAY 2015 – REVISED MAY 2015

www.ti.com

Electrical Characteristics (continued)
Minimum and maximum values are at VIN = 2.7 V to 5.5 V and TJ = -40°C to 125°C. Typical values are at VIN = 3.6 V and TJ =25°C
PARAMETERVOVP_HYS

Output overvoltage protection
hysteresis

TEST CONDITIONS

MIN

TYP

MAX

UNIT

VOUT falling below VOVP

0.25

V

THERMAL SHUTDOWN
TSD

Thermal shutdown threshold

TJ rising150°C

TSD_HYS

Thermal shutdown hysteresis

TJ falling below TSD

20

°C

100%

100%

90%

90%

80%

80%

70%

70%

60%

60%

Efficiency

Efficiency

7.6 Typical Characteristics

50%
40%

20%

20%

3-V Input
3.6-V Input
4.2-V Input

10%
0.001

0.01
0.1 0.2 0.5 1
Output Current (A)00.00012 3 5 710

90%

90%

80%

80%

70%

70%

60%
50%
40%

0.01
0.1 0.2 0.5 1
Output Current (A)2 3 5 710
D002

Figure 2. Efficiency vs Output Current, VIN = 3.6 V, FPWM
100%

Efficiency

Efficiency

0.001

D001

100%

60%
50%
40%

3-V Input
3.6-V Input
4.2-V Input30%
20%0.0001

5-V Output
9-V Output
12-V Output

10%

Figure 1. Efficiency vs Output Current, VOUT = 9 V, FPWM

0.001

0.01
0.1 0.2 0.5 1
Output Current (A)5-V Output
9-V Output
12-V Output

30%

2 3 5 710

20%0.0001

D003

Figure 3. Efficiency vs Output Current, VOUT = 9 V, PFM

6

40%
30%

30%

0
0.0001

50%

0.001

0.01
0.1 0.2 0.5 1
Output Current (A)2 3 5 710
D004

Figure 4. Efficiency vs Output Current, VIN = 3.6 V, PFM

Submit Documentation Feedback

Copyright © 2015, Texas Instruments Incorporated

Product Folder Links: TPS61088

TPS61088
www.ti.com

SLVSCM8A – MAY 2015 – REVISED MAY 2015

Typical Characteristics (continued)
2500

14
PFM Mode
FPWM Mode

12

Frequency (kHz)Current Limit (A)

2000
10
8
6

1500

1000

4

500
2
0
80

0
120

160

200
240
Resistance (k:)

280

320

0

360

100

200

300

D005

Figure 5. Current Limit vs Setting Resistance

400 500 600
Resistance (k:)

700

800

900
D006

Figure 6. Switching Frequency vs Setting Resistance
140

1.21
1.209

120
Quiescent Current (PA)Reference Votlage (V)

1.208
1.207
1.206
1.205
1.204
1.203

100
80
60
40

1.202

20

1.201
1.2
-40

-20

0

20
40
60
Temperature (°C)

80

100

1201300-40 -30 -20 -10

010 20 30 40 50 60 70 80 90
Temperature (°C)
D008

D007

Figure 7. Reference Voltage vs Temperature

Figure 8. Quiescent Current vs Temperature1
0.9

Shutdown Current (PA)

0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-40

-20

0

20
40
Temperature (°C)

60

80

100
D009

Figure 9. Shutdown Current vs Temperature

Submit Documentation Feedback

Copyright © 2015, Texas Instruments Incorporated

Product Folder Links: TPS61088

7

TPS61088
SLVSCM8A – MAY 2015 – REVISED MAY 2015

www.ti.com

8 Detailed Description
8.1 Overview
The TPS61088 is a fully-integrated synchronous boost converter with a 11-mΩ power switch and a 13-mΩ
rectifier switch to output high power from a single cell or two-cell Lithium batteries. The device is capable ofproviding an output voltage of 12.6 V and delivering up to 30-W power from a single cell Lithium battery.
The TPS61088 uses adaptive constant off-time peak current control topology to regulate the output voltage. In
moderate to heavy load condition, the TPS61088 works in the quasi-constant frequency pulse width modulation(PWM) mode. The switching frequency in the PWM mode is adjustable ranging from 200 kHz to 2.2 MHz by an
external resistor. In light load condition, the device has two operation modes selected by the MODE pin. Whenthe MODE pin is left floating, the TPS61088 works in the pulse frequency modulation (PFM) mode. The PFM
mode brings high efficiency at the light load. When the MODE pin is short to ground, the TPS61088 works in theforced PWM mode (FPWM). The FPWM mode can avoid the acoustic noise and other problems caused by the
low switching frequency. The TPS61088 implements cycle-by-cycle current limit to protect the device fromoverload conditions during boost switching. The switch peak current limit is programmable by an external
resistor. The TPS61088 uses external loop compensation, which provides flexibility to use different inductors andoutput capacitors. The adaptive off-time peak current control scheme gives excellent transient line and load
response with minimal output capacitance.

8

Submit Documentation Feedback

Copyright © 2015, Texas Instruments Incorporated

Product Folder Links: TPS61088

TPS61088
www.ti.com

SLVSCM8A – MAY 2015 – REVISED MAY 2015

8.2 Functional Block Diagram
L1

VIN

C3

C1
VIN

BOOT

SW
VOUT

VOUT

C2

Deadtime
Control Logic

Q

VCC

Shutdown

LDO

C4

PGND

Comp

R3

S
R

C5

Comp

CLMIT

FSW

FB

Comp
gm

R1

R4
SS

1/K
Comp
SW

VIN

COMP

Vref

R2

SS VrefEN

C6

C7

Shutdown
ControlON/
OFF

Shutdown
Vref

AGND

CLMIT

VOUT

OVP

VIN

UVLO

ILIM
Mode
Selection

ThermalShutdown

R5MODE

8.3 Feature Description
8.3.1 Enable and Startup
The TPS61088 has an adjustable soft start function to prevent high inrush current during start-up. To minimize
the inrush current during start-up, an external capacitor, connected to the SS pin and charged with a constantcurrent, is used to slowly ramp up the internal positive input of the error amplifier. When the EN pin is pulled
high, the soft-start capacitor CSS (C7 in the Typical Application Circuit) is charged with a constant current of 5 μA
typically. During this time, the SS pin voltage is compared with the internal reference (1.204 V), the lower one is
fed into the internal positive input of the error amplifier. The output of the error amplifier (which determines theinductor peak current value) ramps up slowly as the SS pin voltage goes up. The soft-start phase is completed
after the SS pin voltage exceeds the internal reference (1.204 V). The larger the capacitance at the SS pin, theslower the ramp of the output voltage and the longer the soft-start time. A 47-nF capacitor is usually sufficient formost applications. When the EN pin is pulled low, the voltage of the soft-start capacitor is discharged to ground.
Use Equation 1 to calculate the soft-start time.

Submit Documentation Feedback

Copyright © 2015, Texas Instruments Incorporated

Product Folder Links: TPS61088

9

TPS61088
SLVSCM8A – MAY 2015 – REVISED MAY 2015

www.ti.com

Feature Description (continued)
VREF u CSS
ISS

t SS

where
•
•
•
•

tSS is the soft start time.
VREF is the internal reference voltage of 1.204 V.
CSS is the capacitance between the SS pin and ground.
ISS is the soft-start charging current of 5 µA.

(1)

8.3.2 Undervoltage Lockout (UVLO)The UVLO circuit prevents the device from malfunctioning at low input voltage and the battery from excessive
discharge. The TPS61088 has both VIN UVLO function and VCC UVLO function. It disables the device fromswitching when the falling voltage at the VIN pin trips the UVLO threshold VIN_UVLO , which is typically 2.4 V. The
device starts operating when the rising voltage at the VIN pin is 200-mV above the VIN_UVLO. It also disables thedevice when the falling voltage at the VCC pin trips the UVLO threshold VCC_UVLO, which is typically 2.1 V.
8.3.3 Adjustable Switching Frequency
This device features a wide adjustable switching frequency ranging from 200 kHz to 2.2 MHz. The switchingfrequency is set by a resistor connected between the FSW pin and the SW pin of the TPS61088. A resistor must
always be connected from the FSW pin to SW pin for proper operation. The resistor value required for a desired
frequency can be calculated using Equation 2.
V1
4u(
 tDELAY u OUT )
¦SW
9IN
RFREQ
CFREQ
where
•
•
•
•
•
•

RFREQ is the resistance connected between the FSW pin and the SW pin.
CFREQ = 23 pF
ƒSW is the desired switching frequency.
tDELAY = 89 ns
VIN is the input voltage.
VOUT is the output voltage.

(2)

8.3.4 Adjustable Peak Current Limit
To avoid an accidental large peak current, an internal cycle-by-cycle current limit is adopted. The low-side switch
is turned off immediately as soon as the switch current touches the limit. The peak switch current limit can be set
by a resistor at the ILIM pin to ground. The relationship between the current limit and the resistance depends on
the status of the MODE pin.
When the MODE pin is floating, namely the TPS61088 is set to work in the PFM mode at light load, use
Equation 3 to calculate the resistor value:
ILIM

1190000
RILIM

where
•
•

RILIM is the resistance between the ILIM pin and ground.
ILIM is the switch peak current limit.

(3)

When the resistor value is 100 kΩ, the typical current limit is 11.9 A.
When the MODE pin is connected to ground, namely the TPS61088 is set to work in the forced PWM mode atlight load, use Equation 4 to calculate the resistor value.
ILIM

10

1190000
 1.6
RILIM

(4)

Submit Documentation Feedback

Copyright © 2015, Texas Instruments Incorporated

Product Folder Links: TPS61088

TPS61088
www.ti.com

SLVSCM8A – MAY 2015 – REVISED MAY 2015

Feature Description (continued)
When the resistor value is 100 kΩ. the typical current limit is 10.3 A.
Considering the device variation and the tolerance over temperature, the minimum current limit at the worst casecan be 1.3 A lower than the value calculated by above equations.
8.3.5 Overvoltage Protection
If the output voltage at the VOUT pin is detected above 13.2 V (typical value), the TPS61088 stops switching
immediately until the voltage at the VOUT pin drops the hysteresis value lower than the output overvoltage
protection threshold. This function prevents overvoltage on the output and secures the circuits connected to the
output from excessive overvoltage.
8.3.6 Thermal Shutdown
A thermal shutdown is implemented to prevent damages due to excessive heat and power dissipation. Typically,
the thermal shutdown happens at a junction temperature of 150°C. When the thermal shutdown is triggered, thedevice stops switching until the junction temperature falls below typically 130°C, then the device starts switching
again.

8.4 Device Functional Modes
8.4.1 Operation
The synchronous boost converter TPS61088 operates at a quasi-constant frequency pulse width modulation(PWM) in moderate to heavy load condition. Based on the VIN to VOUT ratio, a circuit predicts the required offtime of the switching cycle. At the beginning of each switching cycle, the low-side N-MOSFET switch, shown inFunctional Block Diagram, is turned on, and the inductor current ramps up to a peak current that is determinedby the output of the internal error amplifier. After the peak current is reached, the current comparator trips, and itturns off the low-side N-MOSFET switch and the inductor current goes through the body diode of the high-side
N-MOSFET in a dead-time duration. After the dead-time duration, the high-side N-MOSFET switch is turned on.
Because the output voltage is higher than the input voltage, the inductor current decreases. The high-side switch
is not turned off until the fixed off-time is reached. After a short dead-time duration, the low-side switch turns on
again and the switching cycle is repeated.
In light load condition, the TPS61088 implements two operation modes, PFM mode and forced PWM mode, tomeet different application requirements. The operation mode is set by the status of the MODE pin. When the
MODE pin is connected to ground, the device works in the forced PWM mode. When the MODE pin is left
floating, the device works in the PFM mode.
8.4.1.1 PWM ModeIn the forced PWM mode, the TPS61088 keeps the switching frequency unchanged in light load condition. Whenthe load current decreases, the output of the internal error amplifier decreases as well to keep the inductor peakcurrent down, delivering less power from input to output. When the output current further reduces, the current
through the inductor will decrease to zero during the off-time. The high-side N-MOSFET is not turned off even if
the current through the MOSFET is zero. Thus, the inductor current changes its direction after it runs to zero.
The power flow is from output side to input side. The efficiency will be low in this mode. But with the fixedswitching frequency, there is no audible noise and other problems which might be caused by low switchingfrequency in light load condition.
8.4.1.2 PFM Mode
The TPS61088 improves the efficiency at light load with the PFM mode. When the converter operates in lightload condition, the output of the internal error amplifier decreases to make the inductor peak current down,delivering less power to the load. When the output current further reduces, the current through the inductor will
decrease to zero during the off-time. Once the current through the high side N-MOSFET is zero, the high-side
MOSFET is turned off until the beginning of the next switching cycle. When the output of the error amplifiercontinuously goes down and reaches a threshold with respect to the peak current of ILIM / 12, the output of theerror amplifier is clamped at this value and does not decrease any more. If the load current is smaller than what

Submit Documentation Feedback

Copyright © 2015, Texas Instruments Incorporated

Product Folder Links: TPS61088

11

TPS61088
SLVSCM8A – MAY 2015 – REVISED MAY 2015

www.ti.com

Device Functional Modes (continued)
the TPS61088 delivers, the output voltage increases above the nominal setting output voltage. The TPS61088
extends its off time of the switching period to deliver less energy to the output and regulate the output voltage to
0.7% higher than the nominal setting voltage. With the PFM operation mode, the TPS61088 keeps the efficiency
above 80% even when the load current decreases to 1 mA. In addition, the output voltage ripple is much smaller
at light load due to low peak current. Refer to Figure 10.
Output Voltage

PFM mode at light load

1.007 × VOUT_NOM

VOUT_NOM

PWM mode at heavy load

Figure 10. PFM Mode Diagram

12

Submit Documentation Feedback

Copyright © 2015, Texas Instruments Incorporated

Product Folder Links: TPS61088

TPS61088
www.ti.com

SLVSCM8A – MAY 2015 – REVISED MAY 2015

9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.

9.1 Application Information
The TPS61088 is designed for outputting voltage up to 12.6 V with 10-A switch current capability to deliver morethan 30-W power. The TPS61088 operates at a quasi-constant frequency pulse-width modulation (PWM) in
moderate to heavy load condition. In light load condition, the converter can either operate in the PFM mode or in
the forced PWM mode according to the mode selection. The PFM mode brings high efficiency over entire load
range, but the PWM mode can avoid the acoustic noise as the switching frequency is fixed. The converter uses
the adaptive constant off-time peak current control scheme, which provides excellent transient line and load
response with minimal output capacitance. The TPS61088 can work with different inductor and output capacitor
combination by external loop compensation. It also supports adjustable switching frequency ranging from 200
kHz to 2.2 MHz.

9.2 Typical Application
C6
0.1 µF
L1

VOUT = 9 V
IOUT = 3 A

1.2 µH

VIN = 3.3 to 4.2 V
SW

BOOT

VOUT

R3

C9
1 µF

C4
3× 22 µF

R2

FSW
FB

255 k

C1
C2
C3
2.2 µF

ON
OFF

56 k

C8

VIN

10 µF
0.1 µF

R1
360 k

VCC

COMP

EN

ILIM

PGND

SS

R5

C5

R4 100 k

AGND

C7
47 nF

MODE

Figure 11. TPS61088 3.3 V to 9-V/3-A Output Converter
9.2.1 Design Requirements
Table 1. Design Parameters
Design Parameters

Example Values

Input voltage range

3.3 to 4.2 V

Output voltage

9V

Output voltage ripple

100 mV peak to peak

Output current rating

3A

Operating frequency

600 kHzOperation mode at light load

PFM

Submit Documentation Feedback

Copyright © 2015, Texas Instruments Incorporated

Product Folder Links: TPS61088

13

TPS61088
SLVSCM8A – MAY 2015 – REVISED MAY 2015

www.ti.com

9.2.2 Detailed Design Procedure
9.2.2.1 Setting Switching Frequency
The switching frequency is set by a resistor connected between the FSW pin and the SW pin of the TPS61088.
The resistor value required for a desired frequency can be calculated using Equation 5.
V14u(
 tDELAY u OUT )
¦SW
9IN
RFREQ
CFREQ
where
•
•
•
•
•
•

RFREQ is the resistance connected between the FSW pin and the SW pin.
CFREQ = 23 pF
ƒSW is the desired switching frequency.
tDELAY = 89 ns
VIN is the input voltage.
VOUT is the output voltage.

(5)

9.2.2.2 Setting Peak Current Limit
The peak input current is set by selecting the correct external resistor value correlating to the required current
limit. Because the TPS61088 is configured to work in the PFM mode in light load condition, use Equation 6 to
calculate the correct resistor value:
ILIM

1190000
RILIM

where
•
•

RILIM is the resistance connected between the ILIM pin and ground.
ILIM is the switching peak current limit.

(6)

For a typical current limit of 11.9 A, the resistor value is 100 kΩ. Considering the device variation and thetolerance over temperature, the minimum current limit at the worst case can be 1.3 A lower than the value
calculated by Equation 6. The minimum current limit must be higher than the required peak switch current at thelowest input voltage and the highest output power to make sure the TPS61088 does not hit the current limit andstill can regulate the output voltage in these conditions.
9.2.2.3 Setting Output Voltage
The output voltage is set by an external resistor divider (R1, R2 in the Typical Application Circuit). Typically, aminimum current of 20 μA flowing through the feedback divider gives good accuracy and noise covering. A
standard 56-kΩ resistor is typically selected for low-side resister R2.
The value of R1 is then calculated as:(VOUT  VREF ) u R2
R1
VREF

(7)

9.2.2.4 Inductor Selection
Because the selection of the inductor affects the power supply’s steady state operation, transient behavior, loop
stability, and boost converter efficiency, the inductor is the most important component in switching power
regulator design. Three most important specifications to the performance of the inductor are the inductor value,
DC resistance, and saturation current.
The TPS61088 is designed to work with inductor values between 0.47 and 10 µH. A 0.47-µH inductor is typicallyavailable in a smaller or lower-profile package, while a 10-µH inductor produces lower inductor current ripple. If
the boost output current is limited by the peak current protection of the IC, using a 10-µH inductor can maximize
the controller’s output current capability.

14

Submit Documentation Feedback

Copyright © 2015, Texas Instruments Incorporated

Product Folder Links: TPS61088

TPS61088
www.ti.com

SLVSCM8A – MAY 2015 – REVISED MAY 2015

Inductor values can have ±20% or even ±30% tolerance with no current bias. When the inductor current
approaches saturation level, its inductance can decrease 20% to 35% from the value at 0-A current depending
on how the inductor vendor defines saturation. When selecting an inductor, make sure its rated current,
especially the saturation current, is larger than its peak current during the operation.
Follow Equation 8 to Equation 10 to calculate the peak current of the inductor. To calculate the current in theworst case, use the minimum input voltage, maximum output voltage, and maximum load current of theapplication. To leave enough design margin, TI recommends using the minimum switching frequency, theinductor value with –30% tolerance, and a low-power conversion efficiency for the calculation.
In a boost regulator, calculate the inductor DC current as in Equation 8 .
VOUT u IOUTIDC
VIN u K
where
•
•
•
•

VOUT is the output voltage of the boost regulator.
IOUT is the output current of the boost regulator.
VIN is the input voltage of the boost regulator.
η is the power conversion efficiency.

(8)

Calculate the inductor current peak-to-peak ripple as in Equation 9.
1
IPP
1
1

u ¦SW
/u
VOUT  VIN VIN
where
•
•
•
•
•

IPP is the inductor peak-to-peak ripple.
L is the inductor value.
ƒSW is the switching frequency.
VOUT is the output voltage.
VIN is the input voltage.

(9)

Therefore, the peak current, ILpeak, seen by the inductor is calculated with Equation 10.
I
ILpeak IDC  PP
2

(10)

Set the current limit of the TPS61088 higher than the peak current ILpeak. Then select the inductor with saturation
current higher than the setting current limit.
Boost converter efficiency is dependent on the resistance of its current path, the switching loss associated withthe switching MOSFETs, and the inductor’s core loss. The TPS61088 has optimized the internal switch
resistance. However, the overall efficiency is affected significantly by the inductor’s DC resistance (DCR),
equivalent series resistance (ESR) at the switching frequency, and the core loss. Core loss is related to the corematerial and different inductors have different core loss. For a certain inductor, larger current ripple generates
higher DCR and ESR conduction losses and higher core loss. Usually, a data sheet of an inductor does notprovide the ESR and core loss information. If needed, consult the inductor vendor for detailed information.
Generally, TI would recommend an inductor with lower DCR and ESR. However, there is a tradeoff among theinductor’s inductance, DCR and ESR resistance, and its footprint. Furthermore, shielded inductors typically havehigher DCR than unshielded inductors. Table 2 lists recommended inductors for the TPS61088. Verify whether
the recommended inductor can support the user's target application with the previous calculations and benchevaluation. In this application, the Sumida's inductor CDMC8D28NP-1R2MC is selected for its small size and low
DCR.

Submit Documentation Feedback

Copyright © 2015, Texas Instruments Incorporated

Product Folder Links: TPS61088

15

TPS61088
SLVSCM8A – MAY 2015 – REVISED MAY 2015

www.ti.com

Table 2. Recommended Inductors
Part Number

L (µH)DCR Max (mΩ)

Saturation Current / Heat
Rating Current (A)Size Max(L × W × H mm)

Vendor

CDMC8D28NP-1R2MC

1.2

7.0

12.2 / 12.9

9.5 x 8.7 x 3.0

Sumida744311150

1.5

7.2

14.0 / 11.0

7.3 x 7.2 x 4.0

Wurth

PIMB104T-2R2MS

2.2

7.0

18 / 1211.2 × 10.3 × 4.0

CyntecPIMB103T-2R2MS

2.2

9.0

16 / 1311.2 × 10.3 × 3.0

Cyntec

PIMB065T-2R2MS

2.2

12.5

12 / 10.5

7.4 × 6.8 × 5.0

Cyntec9.2.2.5 Input Capacitor Selection
For good input voltage filtering, TI recommends low-ESR ceramic capacitors. The VIN pin is the power supply for
the TPS61088. A 0.1-μF ceramic bypass capacitor is recommended as close as possible to the VIN pin of the
TPS61088. The VCC pin is the output of the internal LDO. A ceramic capacitor of more than 1.0 μF is required at
the VCC pin to get a stable operation of the LDO.
For the power stage, because of the inductor current ripple, the input voltage changes if there is parasite
inductance and resistance between the power supply and the inductor. It is recommended to have enough input
capacitance to make the input voltage ripple less than 100mV. Generally, 10-μF input capacitance is sufficient formost applications.
NOTE
DC bias effect: High-capacitance ceramic capacitors have a DC bias effect, which has astrong influence on the final effective capacitance. Therefore, the right capacitor value
must be chosen carefully. The differences between the rated capacitor value and theeffective capacitance result from package size and voltage rating in combination withmaterial. A 10-V rated 0805 capacitor with 10 μF can have an effective capacitance of less
5 μF at an output voltage of 5 V.
9.2.2.6 Output Capacitor Selection
For small output voltage ripple, TI recommends a low-ESR output capacitor like a ceramic capacitor. Typically,
three 22-μF ceramic output capacitors work for most applications. Higher capacitor values can be used to
improve the load transient response. Take care when evaluating a capacitor’s derating under DC bias. The bias
can significantly reduce capacitance. Ceramic capacitors can lose most of their capacitance at rated voltage.
Therefore, leave margin on the voltage rating to ensure adequate effective capacitance. From the required output
voltage ripple, use the following equations to calculate the minimum required effective caapctance COUT:(VOUT  VIN _ MIN ) u IOUT
Vripple _ dis
9OUT u ¦SW u &OUT
(11)

Vripple _ ESR

ILpeak u RC _ ESR

where
•
•
•
•
•
•
•
•

Vripple_dis is output voltage ripple caused by charging and discharging of the output capacitor.
Vripple_ESR is output voltage ripple caused by ESR of the output capacitor.
VIN_MIN is the minimum input voltage of boost converter.
VOUT is the output voltage.
IOUT is the output current.
ILpeak is the peak current of the inductor.
ƒSW is the converter switching frequency.
RC_ESR is the ESR of the output capacitors.

(12)

9.2.2.7 Loop Stability
The TPS61088 requires external compensation, which allows the loop response to be optimized for eachapplication. The COMP pin is the output of the internal error amplifier. An external compensation network
comprised of resister R5, ceramic capacitors C5 and C8 is connected to the COMP pin.
16

Submit Documentation Feedback

Copyright © 2015, Texas Instruments Incorporated

Product Folder Links: TPS61088

TPS61088
www.ti.com

SLVSCM8A – MAY 2015 – REVISED MAY 2015

The power stage small signal loop response of constant off time (COT) with peak current control can be modeledby Equation 13.
§
·§
·
S
S
¨1 
¸¨ 1 
¸
u
S
u
u
S
u
5O u   '¦¦ESRZ ¹ ©
RHPZ ¹u©
GPS (S)S
2 u Rsense1
 u S u ¦P
where
•
•
•

D is the switching duty cycle.
RO is the output load resistance.
Rsense is the equivalent internal current sense resistor, which is 0.08 Ω.

(13)

2
2S u RO u CO

¦P

where
•

¦ESRZ

CO is output capacitor.

(14)

1
2S u RESR u CO

where
•

¦RHPZ

RESR is the equivalent series resistance of the output capacitor.

RO u 1  D

(15)

2

2S u L(16)

The COMP pin is the output of the internal transconductance amplifier. Equation 17 shows the small signaltransfer function of compensation network.

Gc(S)

§
·
S
¨1 
¸
 u S u ¦COMZ ¹
GEA u REA u VREF
©
u
VOUT
§
·§
·
S
S
¨1 
¸¨ 1 
¸

¦

¦
u
S
u
u
S
u
COMP1 ¹©
COMP2 ¹
©

where
•
•
•
•
•
•

GEA is the amplifier’s transconductance
REA is the amplifier’s output resistance
VREF is the refernce voltage at the FB pin
VOUT is the output voltageƒCOMP1, ƒCOMP2 are the poles' frequency of the compensation network.
ƒCOMZ is the zero's frequency of the compensation network.

(17)

The next step is to choose the loop crossover frequency, ƒC. The higher in frequency that the loop gain stays
above zero before crossing over, the faster the loop response is. It is generally accepted that the loop gain crossover no higher than the lower of either 1/10 of the switching frequency, ƒSW, or 1/5 of the RHPZ frequency,ƒRHPZ.
Then set the value of R5, C5, and C8 (in Figure 11) by following these equations.
S u 9OUT u 5sense u ¦C u &O
R5
 ± ' u 9REF u *EA
where•ƒC is the selected crossover frequency.

(18)

The value of C5 can be set by Equation 19.
RO u CO
C5
2R5

(19)
Submit Documentation Feedback

Copyright © 2015, Texas Instruments Incorporated

Product Folder Links: TPS61088

17

TPS61088
SLVSCM8A – MAY 2015 – REVISED MAY 2015

www.ti.com

The value of C8 can be set by Equation 20.
RESR u CO
C8
R5

(20)

If the calculated value of C8 is less than 10 pF, it can be left open.
Designing the loop for greater than 45° of phase margin and greater than 10-dB gain margin eliminates output
votlage ringing during the line and load transient.
9.2.3 Application Curves

Vout(AC)
100 mV/div

Vout(AC)
20 mV/div

Inductor
Current
2 A/div

SW
5 V/div

SW
5 V/div

Inductor
Current
1 A/div

Figure 13. Switching Waveforms in DCM

Figure 12. Switching Waveforms in CCM

Vout(AC)
20 mV/divEN
1 V/div

SW
5 V/div

Vout
2 V/div

Inductor
Current
1 A/div

Inductor
Current
2 A/div

Figure 14. Switching Waveforms in PFM Mode

Figure 15. Startup Waveforms

EN
1 V/div
OutputCurrent
1 A/div

Vout
2 V/div
Inductor
Current
2 A/div

Vout(AC)
500 mV/div

Figure 16. Shutdown Waveforms

18

Figure 17. Load Transient (VOUT = 9 V, IOUT = 1 to 2 A)

Submit Documentation Feedback

Copyright © 2015, Texas Instruments Incorporated

Product Folder Links: TPS61088

TPS61088
www.ti.com

SLVSCM8A – MAY 2015 – REVISED MAY 2015

Input
Voltage
500 mV/div

Vout(AC)
100 mV/div

Figure 18. Line Transient (VOUT = 9 V,VIN = 3.3 to 3.6 V)

Submit Documentation Feedback

Copyright © 2015, Texas Instruments Incorporated

Product Folder Links: TPS61088

19

TPS61088
SLVSCM8A – MAY 2015 – REVISED MAY 2015

www.ti.com

10 Power Supply Recommendations
The device is designed to operate from an input voltage supply range between 2.7 V to 12 V. This input supply
must be well regulated. If the input supply is located more than a few inches from the converter, additional bulk
capacitance may be required in addition to the ceramic bypass capacitors. A typical choice is an electrolytic ortantalum capacitor with a value of 47 μF.

11 Layout11.1 Layout Guidelines
As for all switching power supplies, especially those running at high switching frequency and high currents,
layout is an important design step. If layout is not carefully done, the regulator could suffer from instability andnoise problems. To maximize efficiency, switch rise and fall times are very fast. To prevent radiation of highfrequency noise (for example, EMI), proper layout of the high-frequency switching path is essential. Minimize thelength and area of all traces connected to the SW pin, and always use a ground plane under the switchingregulator to minimize interplane coupling.
The input capacitor needs to be close to the VIN pin and GND pin in order to reduce the Iinput supply ripple.
The layout should also be done with well consideration of the thermal as this is a high power density device. A
thermal pad that improves the thermal capabilities of the package should be soldered to the large ground plate,using thermal vias underneath the thermal pad.

11.2 Layout Example
The bottom layer is a large ground plane connected to the PGND plane and AGND plane on top layer by vias.

AGND

AGND
VCC

L1
VIN

EN

ILIM

FSW

COMP

SW

FB

SW

VOUT

SW

VOUT

SW

MODE

PGND

VIN
NC

NC
SS

CIN

VOUT

VOUT

BOOT

PGND

COUT

Figure 19. Bottom Layer

20

Submit Documentation Feedback

Copyright © 2015, Texas Instruments Incorporated

Product Folder Links: TPS61088

TPS61088
www.ti.com

SLVSCM8A – MAY 2015 – REVISED MAY 2015

11.3 Thermal Considerations
The maximum IC junction temperature should be restricted to 125°C under normal operating conditions.
Calculate the maximum allowable dissipation, PD(max), and keep the actual power dissipation less than or equal toPD(max). The maximum-power-dissipation limit is determined using Equation 21.
125  TAPD(max)
RTJA
where
•
•

TA is the maximum ambient temperature for the application.
RθJA is the junction-to-ambient thermal resistance given in the Thermal Information table.

(21)

The TPS61088 comes in a thermally-enhanced VQFN package. This package includes a thermal pad that
improves the thermal capabilities of the package. The real junction-to-ambient thermal resistance of the package
greatly depends on the PCB type, layout, and thermal pad connection. Using thick PCB copper and soldering thethermal pad to a large ground plate enhance the thermal performance. Using more vias connects the groundplate on the top layer and bottom layer around the IC without solder mask also improves the thermal capability.

Submit Documentation Feedback

Copyright © 2015, Texas Instruments Incorporated

Product Folder Links: TPS61088

21

TPS61088
SLVSCM8A – MAY 2015 – REVISED MAY 2015

www.ti.com

12 Device and Documentation Support
12.1 Device Support
12.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOTCONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHERALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

12.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms ofUse.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools andcontact information for technical support.

12.3 Trademarks
E2E is a trademark of Texas Instruments.
Bluetooth is a trademark of Bluetooth SIG.
All other trademarks are the property of their respective owners.

12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the mostcurrent data available for the designated devices. This data is subject to change without notice and revision ofthis document. For browser-based versions of this data sheet, refer to the left-hand navigation.

22

Submit Documentation Feedback

Copyright © 2015, Texas Instruments Incorporated

Product Folder Links: TPS61088

PACKAGE OPTION ADDENDUM

www.ti.com

12-May-2015

PACKAGING INFORMATION
Orderable Device

Status(1)

Package Type Package Pins Package
Drawing
Qty

Eco Plan

Lead/Ball Finish

MSL Peak Temp

(2)

(6)

(3)

Op Temp (°C)

Device Marking(4/5)

TPS61088RHLR

ACTIVE

VQFN

RHL

20

3000

Green (RoHS& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 85

S61088A

TPS61088RHLTACTIVE

VQFN

RHL

20

250

Green (RoHS& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 85

S61088A(1)

The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weightin homogeneous material)(3)

MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)

Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuationof the previous line and the two combined represent the entire Device Marking for that device.
(6)

Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

Addendum-Page 1

SamplesPACKAGE OPTION ADDENDUM

www.ti.com

12-May-2015

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

PACKAGE MATERIALS INFORMATION
www.ti.com

13-May-2015

TAPE AND REEL INFORMATION*All dimensions are nominal

DevicePackage Package Pins
Type Drawing

SPQ

Reel
Reel
A0
Diameter Width (mm)(mm) W1 (mm)TPS61088RHLR

VQFN

RHL

20

3000

330.0

12.4

TPS61088RHLT

VQFN

RHL

20

250

180.0

12.4

Pack Materials-Page 1

B0
(mm)

K0
(mm)

P1
(mm)

W
Pin1
(mm) Quadrant

3.71

4.71

1.1

8.0

12.0

Q1

3.71

4.71

1.1

8.0

12.0

Q1

PACKAGE MATERIALS INFORMATION
www.ti.com

13-May-2015*All dimensions are nominal

DevicePackage Type

Package Drawing

Pins

SPQ

Length (mm)Width (mm)Height (mm)TPS61088RHLR

VQFN

RHL

20

3000

367.0

367.0

35.0

TPS61088RHLT

VQFN

RHL

20

250

210.0

185.0

35.0

Pack Materials-Page 2

IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and otherchanges to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of salesupplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products andapplications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, orother intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of thethird party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alterationand is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altereddocumentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards whichanticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the useof any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is tohelp enable customers to design and create their own end-product solutions that meet applicable functional safety standards andrequirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use inmilitary/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal andregulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use ofnon-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products

Applications

Audio

www.ti.com/audio

Automotive and Transportation

www.ti.com/automotive

Amplifiers

amplifier.ti.com

Communications and Telecom

www.ti.com/communications

Data Converters

dataconverter.ti.com

Computers and Peripherals

www.ti.com/computers

DLP® Products

www.dlp.com

Consumer Electronics

www.ti.com/consumer-apps

DSP

dsp.ti.com

Energy and Lighting

www.ti.com/energy

Clocks and Timers

www.ti.com/clocks

Industrial

www.ti.com/industrial

Interfaceinterface.ti.com

Medicalwww.ti.com/medical

Logic

logic.ti.com

Security

www.ti.com/security

Power Mgmt

power.ti.com

Space, Avionics and Defense

www.ti.com/space-avionics-defense

Microcontrollers

microcontroller.ti.com

Video and Imaging

www.ti.com/video

RFID

www.ti-rfid.com

OMAP Applications Processors

www.ti.com/omap

TI E2E Community

e2e.ti.com

Wireless Connectivity

www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated