September 2022

Renesas Electronics
Corporation
Green Bond Report 2022

[Date]

Renesas Electronics Corporation

CONTENTSGREEN BOND OVERVIEW ............................................................................................ 2
1

ALLOCATION REPORTING ..................................................................................... 32

IMPACT REPORTING ............................................................................................. 4

Page 1Green Bond Report 2022

GREEN BOND OVERVIEW•••On November 26, 2021, Renesas Electronics Corporation (“Renesas”) issued its first green bondo USD 500,000,000 1.543% Notes due November 26, 2024 (ISIN USJ4881VAA55 /US75972BAA98)
o The Green Bond was issued under Renesas’ Green Bond Framework (“Framework”), which isavailable on its corporate website
o The Framework is aligned with the International Capital Markets Association (ICMA) Green Bond
Principles 2021, with a second-party opinion provided by Sustainalytics
As of September 2022, 100% of the net proceeds of the Green Bond have been allocated to Eligible
Green Projects defined in the Framework• In the Green Bond Report 2022, Renesas reports the environmental impacts of the projects fundedwith the Green Bond proceeds to the extent feasible
Sustainalytics has provided verification on the Green Bond Report 2022

Page 2Renesas Electronics Corporation

1 ALLOCATION REPORTINGUSE OF PROCEEDS FOR ELIGIBLE GREEN PROJECTS(as of September, 2022)
Eligible Green Projects

Amount (in millions) USD

Clean Transportation

317

Smart Electric Vehicles Solutions

34

Smart Autonomous Drive Solutions

283

Energy Efficiency

183

Smart Data Center Solutions

53

Smart Cellular Solutions

11

Smart Society Solutions

96

Renesas’s Green Devices and Technology

23

Renewable Energy/
Sustainable water and waste water management
Projects related to alleviating environmental impacts
through our business activities

00Total500Unallocated funds

0Status as of September, 2022
Percentage of net proceeds of Green Bond allocated toEligible Green Project
Percentage of net proceeds of Green Bond allocated toExisting Eligible Green ProjectGreen Funding

100%100%

Amount (in millions) USD

USD 500,000,000 1.543% Notes due November 26, 2024

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Green Bond Report 2022

2 IMPACT REPORTING
At Renesas, we aspire to be the world`s leading semiconductor company, developing sustainable products
and solutions that benefit all humankind. Through provision of our products and solutions, we aim to achieve
high energy efficiency and robust safety and security in various end applications, ultimately contributing to agreener society. The proceeds raised from the green bond will help us achieve this goal, by investing inresearch and development (R&D) activities aimed at providing positive environmental impacts.
At Renesas, we provide devices and solutions that contribute to making our customers` electronicequipment and systems energy efficient. Our products include devices that offer extremely low power
consumption themselves and devices that contribute to enhancing the energy efficiency of customersystems through adoption of such devices.
In addition to making contributions through the development of sustainable products and solutions, Renesas
also makes efforts to reduce negative impacts made through our own business activities.

1. Smart Electronic Vehicle Solutions
xEVs are becoming increasingly popular with more restrictions being placed on vehicle CO2 emissions, as ameasure to deal with global warming and achieving a “sustainable society” that is environmentally friendly,
safe and easy to live on. EVs and PHEVs can reduce GHG (Green House Gas) emission compared to
traditional gasoline/diesel cars, and Renesas offers a wide range of solutions and evaluation kits to help
accelerate xEV advancements with better power efficiency.
Renesas offers solutions and evaluation kits, more specifically semiconductors such as MCU, analog, andpower semiconductors that is used to manufacture and run xEVs. Our xEV Inverter Reference Solutions,which converts DC power to AC power and maximizes PHEV/EV motor performance, offers superior power
efficiency and 99% maximum inverter efficiency (1).
On November 9, 2021, Renesas announced a new group of MCUs, the RH850/U2B MCUs, built for therigorous workloads required by vehicle motion in terms of hybrid ICE and xEV traction inverter, as well as
high-end zone control, connected gateway, and domain control applications (2). Renesas` internal data has
shown that the MCUs used for controlling Battery Management Systems (BMS) such as the RH850,
achieves 60-65% reduction in power consumption compared to competitor products. Another example of ourenergy-efficient solutions is the IGBT technology that reduces switching loss from AE3 to AE5 by 20% andconductive loss by 10%, reducing overall system level loss by 15% (3).
On June 2, 2022, Renesas introduced an AUTOSAR-compliant complex device driver (CDD) softwaremodule for designers of automotive battery management systems (BMS) in electric vehicles (EVs)(4). The
new software pairs with Renesas’ industry-leading ISL78714 Li-Ion battery management IC optimize
performance of next-generation systems to maximize range, save electric power consumption, and extend
battery life.

(1)
(2)
(3)
(4)

https://www.renesas.com/jp/en/application/winning-combinations-automotive/xev-inverter-reference-solution
https://www.renesas.com/jp/en/about/press-room/renesas-expands-lineup-28nm-cross-domain-automotive-control-microcontrollers
https://www.renesas.com/jp/en/blogs/worlds-best-performance-igbt-product-responds-energy-saving-and-high-performance-xev-electric
https://www.renesas.com/jp/en/about/press-room/renesas-introduces-complex-device-driver-software-ease-development-battery-managementsystems

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Renesas Electronics Corporation
2. Smart Autonomous Drive Solutions
Autonomous driving or “AD”, and Advanced driver assistance system “ADAS”, is the future of vehicletransportation, and is predicted to dynamically change the automobile market. In addition to enhancement ofsafety, AD and ADAS also contributes to reduction of energy consumption and CO2 emission as a tool for
promoting eco-driving, by assisting the driver in moving the car more efficiently, optimizing the use of engine
and battery power (1)(2).
Renesas’ processor line acts as a platform for safe cognitive computing, contributing to sensing anddecision-making, as well as body control and infotainment towards level 3 and 4 autonomous driving. Inaddition to such processors and sensors, Renesas offers a variety of energy efficient solutions such as theradar MMIC, which reduces power consumption by 67% compared to current SiGe processes, and by 40%
compared to larger scale RFCMOS processes according to in-house research.
On February 17, 2021, Renesas announced the development of processor technologies for automotive
SoCs used in autonomous driving and ADAS that aims to optimize both performance and power efficiency.
The newly developed technology used in the new SoC, the high-performance CNN hardware accelerator,
achieves best-in-class power efficiency of 13.8 TOPS/W (3). Later on March 30, 2021, Renesas alsoannounced a new power and functional safety solution for systems based on the R-Car V3H SoC for ADAS
automotive front cameras and driver monitor cameras (4). These R-Car solutions improve CNN performanceefficiency by 20% compared to previous models, in addition to our PMIC solutions which reduces power loss
by up to 33% compared to competitive PMICs under comparable operating conditions.

On March 3, 2022, Renesas announced the expansion of its collaboration with Honda in the field ofadvanced driver-assistance systems (ADAS)(5). Honda adopted Renesas’ R-Car automotive system on achip (SoC) and RH850 automotive MCU for its Honda SENSING Elite system featured in the Legend, which
went on sale in March 2021. Honda SENSING Elite incorporates advanced technology that qualifies forLevel 3 automated driving (conditional automated driving in limited areas). Now Honda has again selected
R-Car and RH850 for use in the Honda SENSING 360 omnidirectional safety and driver assistance system,
which builds on the knowledge and expertise gained through research and development work on the earlier
technology. The first automobile model equipped with Honda SENSING 360 is scheduled for release in
China in 2022, with adoption in a broader range of models to follow.
On January 28, 2022, Renesas announced that its "development of technology to reduce power
consumption of LSI for autonomous driving by model-based design method" won the Outstanding Business
Operator Award at the 2021 NEDO Energy Conservation Technology Development Award sponsored by theNew Energy and Industrial Technology Development Organization (NEDO)(6).
NEDO conducts the Strategic Energy Conservation Technology Innovation Program, in which technology
development themes that contribute to energy conservation are publicly invited and a portion of thedevelopment costs are subsidized. This award recognizes research and development projects conducted
between FY 2012 and FY 2022 that have resulted in innovative technological development that contributes
to energy conservation.
The newly awarded model-based design technique to reduce the power consumption of on-vehicle LSIs hasrealized low power consumption by optimizing the specifications of dedicated circuits by utilizing the modelbased design technique so that image recognition required for autonomous driving systems can beprocessed in a hybrid structure consisting of a General Purpose Processor (CPU) + Dedicated Circuit(Accelerator IP) and more processing can be performed in dedicated circuits with low power consumption.
As autonomous driving systems and ADAS (advanced driver assistance systems) become morePage 5

Green Bond Report 2022
widespread, dramatic performance improvements are required for image recognition processing, while
reducing power consumption of the LSI that performs the processing is an urgent issue. To address thesechallenges, Renesas implemented an image recognition algorithm on a hardware model and quickly
repeated evaluations to achieve an optimal hardware design, thereby optimizing dedicated circuits thatsimultaneously improve performance and reduce power consumption.

(1)
(2)
(3)
(4)
(5)
(6)

https://css.umich.edu/factsheets/autonomous-vehicles-factsheet
https://www.asiaeec-col.eccj.or.jp/specialreport202006/
https://www.renesas.com/jp/en/about/press-room/renesas-develops-automotive-soc-functional-safety-technologies-cnn-acceleratorcores-and-asil-d
https://www.renesas.com/jp/en/about/press-room/renesas-introduces-complete-power-and-functional-safety-solution-r-car-v3h-adascamera-systems
https://www.renesas.com/jp/en/about/press-room/renesas-automotive-semiconductors-selected-honda-adas
https://www.renesas.com/jp/en/node/1571901 (Japanese only)

3. Smart Data Center Solution
As data centers increase in size and amount, it becomes increasingly important for these data centers to be
run as efficiently as possible, due to the enormous global data center electricity demand. Renesas leads theindustry with its high-quality memory interface chips and timing devices used for data centers, enabling thetransition from DDR4 to DDR5, the new generation of data centers that not only increases bandwidth, butalso improves bandwidth power efficiency by 16% (1).
On November 4, 2021, Renesas introduced the industry’s first industrial temperature DDR4 and DDR5
registered clock drivers (RCDs). This device delivers 2x channel speed improvement, low latency andexcellent power management, enabling DDR5 industrial temp dual inline memory modules (DIMMs) andmemory-down applications, while providing wide temperature range reliability for existing DDR4 applications(2).
On May 31, 2022, Renesas unveiled the industry’s first I3C intelligent switch devices targeting next
generation server motherboards and other infrastructure equipment. The new chips vastly enhance
scalability and reliability while reducing the complexity of high-performance system designs. They offer
advantages of high performance, improved reliability, very low power, and low electromagnetic interference(EMI)(3).

(1)
(2)
(3)

https://www.renesas.com/us/en/about/press-room/renesas-introduces-ddr5-data-buffer-high-performance-server-and-cloud-serviceapplications
https://www.renesas.com/jp/en/about/press-room/renesas-introduces-industry-s-first-industrial-temperature-grade-ddr5-and-ddr4registered-clock
https://www.renesas.com/jp/en/about/press-room/renesas-unveils-industry-s-first-i3c-intelligent-switch-family-next-generation-serverstorage-and

4. Smart Cellular Solutions
5G is the next generation wireless network technology, which compared to the previous 4G network, offers
faster connections and allows for more devices to be connected at a time. It could hold positive implications
on climate change, due to its ability to support companies and industries in implementing the most efficient

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Renesas Electronics Corporationand flexible allocation of resources, through computation and AI analysis. Furthermore, it optimizes datatransmission efficiency that reduces the amount of CO2 emission per data transferred. Renesas offers acomplete portfolio of industry-leading products for 4G and 5G infrastructure.
On November 10, 2021, Renesas announced expansion of the 5G beamformer IC family with two new dualpolarization mmWave devices optimized for 2x2 antenna architecture for 5G and broadband wirelessapplications with best-in-class performance at n257, n258, and 261 bands. The highly integrated F5288 andF5268 transmitter/receiver (8T8R) chipsets sit on a small 5.1mm x 5.1mm BGA package and feature theindustry’s highest Tx output power capability in silicon – delivering more than 15.5dBm linear output power
per channel (1). The F5288 has 33% lower power consumption and leads to 8.4Kt of reduced/avoided GHG
per year, compared to similar products by industry competitors.
(1)

https://www.renesas.com/jp/en/about/press-room/renesas-expands-5g-mmwave-beamformer-portfolio-industry-leading-transmitteroutput-power-capability

5. Smart Society Solutions
The solutions that Renesas provides through its semiconductors and sensor solutions not only increases
energy efficiency of each product, but can also enhance performance of end applications and systems aswhole, contributing to reduction in CO2 emission and energy consumption, as well as improvement in thewell-being of people. Our MCU/MPU/SoC solutions, sensors, analog and power semiconductors is used in avariety of applications from industrial sectors, renewable energy to home appliances and IoT devices.
One example of these applications is renewable energy. Renesas` 8th generation IGBTs, which utilizes ourlow-power design expertise, allows for more than 30% reduction in power loss and increases energy
efficiency of all systems.
Another example of these applications, is factory automation. In the industrial sector, digitalization andsmartification is now implemented, and demand towards end point computing for factory automation isincreasing. Renesas' AI technology designed for factories, adds processing capabilities to MCU/MPUs andachieves the same processing power as high-end AI chips using only a few watts of electricity in theprocess. In addition, Renesas provides sensors and MCUs needed to control and operate these factory
automations, such as our latest RZ/V MPU series announced on May 19, 2021, and can reduce power
consumption by 80% compared to previous generations (1).
Additional examples of these applications is IoT and home appliance. Thanks to IoT, home appliances andindustrial machinery are attaining greater functionality from network connectivity and human machineinterface (HMI) enhancements. This added functionality also leads to greater energy efficiency, which couldbe seen in technology like air conditioners with inverters included in them, which have 58% less power
consumption compared to air conditioners without. The RL78, RX, and RA products from Renesas` MCU
portfolio, announced on April 13, 2021, achieves 30% less electricity consumption compared to past
products. (2).
On June 22, 2022, Renesas is changing the way designers build sensor-connected IoT applications with arange of new solutions targeted at faster design cycles, improved accuracy, and reduced system cost. In
addition to the new HS4XXX family of relative humidity and temperature sensors, Renesas is introducing theZSSC3281 sensor signal conditioning (SSC) IC for highly accurate amplification, digitization, and sensorspecific correction of sensor signals(3). By combining these temperature and humidity sensors and sensor
signal conditioners with MPUs and MCUs, Building Automation (BA) and Home Appliance (HA) air
conditioning control can be achieved with high precision, fast measurement response time, and ultra-low
power consumption, contributing to power savings for BA and HA.

Page 7Green Bond Report 2022(1)(2)(3)

https://www.renesas.com/jp/en/about/press-room/renesas-launches-entry-level-rzv2l-mpus-best-class-power-efficiency-and-highprecision-ai
https://www.renesas.com/jp/en/about/press-room/renesas-strengthens-rl78-family-low-power-mcus-16-bit-general-purpose-rl78g23
https://www.renesas.com/jp/en/about/press-room/renesas-delivers-industry-s-most-complete-intelligent-sensor-solutions-iot-applications

6. Renesas’ Green Devices and Technology
For a long time Renesas has been a world-leading supplier of low-power MPUs and MCUs, and recently has
expanded its power-efficient analog and power portfolio through the acquisitions of Intersil, IDT and Dialog.
Achieving high energy efficiency in our products is a principal goal in each step of our research anddevelopment, as well as design processes.
Renesas has taken many initiatives internally, in order to develop green devices and technology. On June
16, 2022, Renesas announced that it has developed circuit technologies for an embedded spin-transfer
torque magnetoresistive random-access memory (STT-MRAM, hereinafter MRAM) test chip with fast readand write operations fabricated using a 22-nm process(1). The test chip includes a 32-megabit (Mbit)
embedded MRAM memory cell array and achieves 5.9-nanosecond (ns) random read access at a maximum
junction temperature of 150°C, and a write throughput of 5.8-megabyte-per-second (MB/s). Faster rewritingtime reduces system downtime during over-the-air (OTA), which is essential for endpoint devices, reducescode rewriting time at set manufacturers, and contributes to efficiency and energy savings by applying thelatest applications through code rewriting.
On February 24, 2022, Renesas announced the development of two 2.4 GHz RF transceiver technologies
that support the Bluetooth® Low Energy (LE) low-power, near-field communication standard(2). The newtechnologies also achieve a smaller mounting area and better power efficiency. In addition to being
compact, low cost, and power efficient, IoT devices must provide flexible support for Bluetooth LE regardlessof their implementation format. Renesas has developed two new technologies to address theserequirements: 1) a matching circuit technology that covers a wide impedance range and enables the IC tomatch a variety of antenna and board impedances without an external impedance-matching circuit; 2) asignal correction technology for locally generated reference signals that uses a small circuit to self correctinconsistencies in the circuit elements and variations in surrounding conditions without calibration. They offer
best-in-class power efficiency, with power consumption of 3.6 mW and 4.1 mW during reception andtransmission respectively. These advances enable the small size, low cost, and low power consumption ofBluetooth LE, which is widely applied in IoT devices.

(1)
(2)

https://www.renesas.com/jp/en/about/press-room/renesas-develops-circuit-technologies-22-nm-embedded-stt-mram-faster-read-andwrite-performance-mcus
https://www.renesas.com/jp/en/about/press-room/renesas-develops-bluetooth-low-energy-rf-transceiver-technologies-simplify-boarddesign-reduce

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