AN4672
Application note
LPS22HB/LPS25HB digital pressure sensors: hardware
guidelines for system integration

Introduction
The purpose of this application note is to introduce guidelines for the hardware integration of
STMicroelectronics's LPS22HB and LPS25HB pressure sensors in the final customer's application.

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Contents

AN4672

Contents
1

System integration .......................................................................... 5

2

Mechanical design rules ................................................................. 7
2.1

Sensor placement ............................................................................. 7
2.1.1

Exposition to the environment ............................................................ 7

2.1.2

Heat propagation ................................................................................ 8

2.1.3

Mechanical stress ............................................................................. 12

2.2

Sensor embodiment and housing.................................................... 13

2.3

Sensor protection ............................................................................ 15

3
Reference design: integration and housing on a personal
device...................................................................................................... 16
4

Use case and configuration example for the LPS22HB .............. 18
4.1

5

Use case and configuration example for the LPS25HB .............. 22
5.1

6

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Main device settings ........................................................................ 20
Main device settings ........................................................................ 22

Revision history ............................................................................ 25

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List of tables

List of tables
Table 1: ODR configuration ...................................................................................................................... 18
Table 2: FIFO mode selection .................................................................................................................. 21
Table 3: ODR configuration ...................................................................................................................... 22
Table 4: Temperature resolution configuration ......................................................................................... 23
Table 5: FIFO coefficient filter ................................................................................................................... 23
Table 6: FIFO MEAN MODE configurations for different application scenarios ....................................... 24
Table 7: Document revision history .......................................................................................................... 25

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List of figures

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List of figures
Figure 1: Pressure sensor system integration ............................................................................................ 5
Figure 2: Pressure sensor integration and embodiment reference ............................................................ 8
Figure 3: Pressure sensor integration and embodiment with vent channel ................................................ 8
Figure 4: Heating isolation implemented for protecting the sensor ............................................................ 9
Figure 5: Top view of the sensor housing: on the left a correct design with the heat isolation, on the righta wrong design .......................................................................................................................................... 10
Figure 6: Sensor with a correct sensor placement on the PCB to get the appropriate isolation from heatsources ..................................................................................................................................................... 10
Figure 7: Sensor with a bad wiring on the PCB ........................................................................................ 11
Figure 8: Sensor wiring with wrong placement on the PCB ..................................................................... 11
Figure 9: Bad configuration for mechanical stress (a) .............................................................................. 12
Figure 10: Bad configuration for mechanical stress (b) ............................................................................ 12
Figure 11: Good configuration for avoiding mechanical stress and reducing the dead volume (a) ......... 12
Figure 12: Good configuration for avoiding mechanical stress and reducing the dead volume (b) ......... 13
Figure 13: Example of good sensor embodiment and housing ................................................................ 14
Figure 14: Example of good sensor embodiment and housing with airflow channel ............................... 14
Figure 15: Example of a bad sensor embodiment and housing ............................................................... 15
Figure 16: Integration of the digital pressure sensor device in a sensor chamber with two vent apertures.................................................................................................................................................................. 16
Figure 17: Device integration reference in a portable device ................................................................... 17
Figure 18: CTRL_REG1 writing procedure ............................................................................................... 19
Figure 19: One Shot procedure ................................................................................................................ 20
Figure 20: FIFO moving average filter scheme ........................................................................................ 23

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System integration

System integration
The LPS22HB/LPS25HB pressure and temperature sensors' integration in application
systems such as portable devices like smartphones, wearable devices, weather stations orindustrial equipments shall be implemented without compromising the sensor
performances. The system integration can be done by looking at the main mechanical andgeometrical parameters and the factors that influence the sensor performance and thus
optimizing those.
The typical sensor integration scenario is described in Figure 1: "Pressure sensor system
integration" where the embodiment of the sensor has to be designed in order to get asmuch as possible the correspondence between the pressure (Px) and temperature (Tx)conditions of the environment under test, and (Ps, Ts) that represent the conditions aroundthe sensor sensing area, nearby the air inlet houses.
Figure 1: Pressure sensor system integration

Therefore, in order to get a reliable and consistent measurement, all the parameters
involved in the mechanical design must be dimensioned to get the maximum sensor
exposition to the external environment, to get a faster response time, in terms of pressure
and temperature, compatible with the required design specifications.
Every change in the condition under test must be reflected as a sensor consistentmeasurement, also in the case of fast pressure and temperature variations. Therefore, theintegration design must guarantee the environment conditions matching with the sensing
area conditions not only in “steady-state” (static conditions) but also in dynamic conditions.
Deviations between the conditions under test and the conditions around the sensing area
are also influenced by heating sources, like other devices close the sensing area, the selfheating of the sensor. Changes in temperature are critical because not only thetemperature is influenced but, changes in temperature will also determine pressure
deviations and, as a consequence, a slower response of the system.
Based on the considerations above, the design optimization consists of determining:
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System integration
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1. the placement of the sensor in the system
2. the sensor embodiment and housing
3. sensor protection from dust, water, or chemical solvent by a sensor chamber, inpresence of harsh environment
The above elements are further described in the following section of this document.

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2

Mechanical design rules

Mechanical design rules
For the mechanical design, the main constraints and features to be considered aredescribed below, to provide a set of basic rules such as good design practices for a
successfull integration of the sensor in the final application context.

2.1

Sensor placement
The sensor placement has a direct impact on the sensor performance as follows, in termsof sensor link to the environment, thermal propagation mechanism, and mechanical stress.

2.1.1

Exposition to the environment
To maximize the exposition with the environment where to measure pressure andtemperature, the sensor has to be placed in static and dynamic working condition.
In static conditions, or steady-state, after a change of the pressure and the temperatureenvironment and their stabilization, sensing conditions must be the same as the conditions
under test, or very close to the target value, depending on the application tolerance andspecifications.
In dynamic conditions, in the presence of fast changes of the conditions under test, thesensor must be able to provide a reliable measurement output able to follow the dynamic of
the environment. At the end of the sensor integration design, the overall response time will
be modified, and the final performance shall match the target specifications. In general,target is to avoid design with a response time lower than the product specifications. In
order to maximize the sensor performance in static and dynamic conditions after system
integration, depending on the design specifications the below guidelines are suggested,with reference to Figure 2: "Pressure sensor integration and embodiment reference":
1.
2.

3.
4.

Place the sensor to get the best connection with the environment under test, as close
as possible to the vent aperture
Large dead volume will increase the response time, with a bigger contribute to thepressure response time; therefore is recommended to minimize the volume, trying toshape a tailored housing around the sensor geometry
Vent aperture should be as large as possible; an order of magnitude lower than thesensing element geometry represents a reasonable integration form factor.
The depth of the vent aperture must be minimized.

As a reference for integration design, Figure 2: "Pressure sensor integration andembodiment reference" describes an example of the above recommendations. In order tomaximize the environment connection and therefore to get a fast response time, thevolume around the sensor (dead volume) is minimized and the vent size aperture has thesame order of magnitude of the sensing area. A filter membrane protection has been
added, for protecting the sensor from water or harsh environment.

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Figure 2: Pressure sensor integration and embodiment reference

A different implementation , more expensive but more efficient in terms of sensing
performances is the design with an air flow structure, described in Figure 3: "Pressure
sensor integration and embodiment with vent channel". The design with multiple vent
apertures is a more expensive solution, but providing , depending on the design
specifications, a faster response time.
Figure 3: Pressure sensor integration and embodiment with vent channel

It is useful to underline that the sensor can work properly even if it is placed in customer's
application system without considering any dedicated hole (vent aperture) unless that one
is not hermetically sealed. The design guidelines reported above are for getting out top
performances.

2.1.2

Heat propagation
The presence of heating sources near the sensor can deteriorate the performances bymodifying pressure and temperature measurement as well as generating thermal gradientsaround the sensing area affecting the correct measurement in static and dynamic
conditions.
We report design guidelines for avoiding this effect, but, we remark that the increasing
temperature impacts on performances and is strongly attenuated by the embedded
temperature compensation of LPS22HB and LPS25HB devices.

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Mechanical design rules
From a physical point of view, these local sources act like a thermal capacitor placed inparallel to the thermal model of the LPS25HB and they can give a contribution to the local
temperature that is different from the environmental one.
Depending on the heat sources location and the heating mechanism propagation, we candistinguish the propagation related to different mechanisms as described below.


Heating convection

Local thermal sources around the sensor can modify the pressure and temperature
measurement by heating radiation.
Typical sources are as follows:other sensors and devices like close the pressure sensor
power management devices
processors and microcontrollers
LCD displays that, in particular provide a significant temperature gradient between theenvironment and the dead volume inside the system

Therefore the sensor has to be placed at the correct distance from these sources, and toguarantee the appropriate isolation, it is recommended to adopt inside the embodiment,
heating isolation structures as described in Figure 4: "Heating isolation implemented forprotecting the sensor". It also suggested, according to the specific layout to implement aswell vent aperture close the heat source, acting as cooling channels.
Figure 4: Heating isolation implemented for protecting the sensor

Looking at a section of the sensor housing, Figure 5: "Top view of the sensor housing: on
the left a correct design with the heat isolation, on the right a wrong design" shows a good
design with the heating isolation structure on the left; the heat source is far from the sensor
and a thermal protection structure is placed in the middle. On the right, a wrong design isdescribed, determining the sensor heating because of the heat radiation coming from thecomponent nearby.

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Figure 5: Top view of the sensor housing: on the left a correct design with the heat isolation,on the right a wrong design

Heating conduction
Thermal conduction mostly occurs through the metal lines on the PCB and PCB itself.
In order to reduce this effect, we recommend adopting thin metal lines around the sensor,
at appropriate distance among the sensor and potential heat sources, avoiding metal areas
near and under the device.
A good design rule is provided in Figure 6: "Sensor with a correct sensor placement on the
PCB to get the appropriate isolation from heat sources". As an example of good design, it
describes the positioning of the devices on the left, generating heat as far as possible fromthe sensor, and in Figure 8: "Sensor wiring with wrong placement on the PCB" a wrong
layout with the devices generating heat too close to the sensor. In both cases thinner metallines are adopted.
Figure 6: Sensor with a correct sensor placement on the PCB to get the appropriate isolationfrom heat sources

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Mechanical design rules
Figure 7: Sensor with a bad wiring on the PCB

In Figure 7: "Sensor with a bad wiring on the PCB "a wrong metal lines size is adopted, thebigger dimensions will provide higher level of heating conduction. In Figure 8: "Sensor
wiring with wrong placement on the PCB", the wrong placement of the sensor, close to a
device generating too much heating deteriorates the sensor performance.
Figure 8: Sensor wiring with wrong placement on the PCB

In both cases of thermal mechanism propagation, the infrared based thermal analysis of
the whole system, running in different working condition, is the right approach for identifying
the appropriate sensor location.

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Mechanical design rules

2.1.3

AN4672Mechanical stress
The sensor placement shall avoid any mechanical force applied on the sensor, direct due
to a wrong mechanical system design, or indirect due to the user interaction with thesystem like in the case of wearable or portable device.
Figure 9: Bad configuration for mechanical stress (a)Figure 10: Bad configuration for mechanical stress (b)Figure 11: Good configuration for avoiding mechanical stress and reducing the dead volume
(a)

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Mechanical design rules
Figure 12: Good configuration for avoiding mechanical stress and reducing the dead volume(b)

The figures above show correct and incorrect integration cases where, with the goal toreduce the dead volume around the sensor to improve the pressure response time, theembodiment structure is directly in contact with the sensor package, creating a mechanicalstress that can deteriorate the sensor performance. A minimal clearance has to be
maintained as in Figure 11: "Good configuration for avoiding mechanical stress andreducing the dead volume (a)" and Figure 12: "Good configuration for avoiding mechanicalstress and reducing the dead volume (b)" to avoid any force applied on the sensor andminimize the dead volume as well.

2.2

Sensor embodiment and housing
The sensor embodiment in the system shall match as much as possible therecommendations highlighted above for the sensor placement and, on top of that, has toprovide all the features of specific application like waterproof, water resistant or resistant toharsh environment, in case it is required.
Furthermore, the customer device design shall guarantee the air circulation from theenvironment till the sensing area, first from the environment (outside) to the customer
device (inside), then internally from the aperture to the sensor housing and sensing
element as well. More efficient is the air circulation in this path, better the performances willbe.
The air path shall be well identified and sized in order to maximize the airflow, and as aresult, the final performance of the integrated system.
The pictures below represent a summary of a good case versus a bad case of sensor
embodiment and housing. In Figure 13: "Example of good sensor embodiment andhousing" a good design is described including also an optional filter membrane and PCB
cut to increase the thermal decoupling, that is a solution for specific case where thedevices around the pressure sensor are generating too much heating.

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Figure 13: Example of good sensor embodiment and housing

Figure 14: Example of good sensor embodiment and housing with airflow channel

Figure 14: "Example of good sensor embodiment and housing with airflow channel"
describes a good design, related to the more efficient implementation with two vent
apertures to get a better connection with the external environment under test that results ina higher efficiency in terms of response time and an extremely small dead volume. In thisexample the vent apertures size is an order magnitude lower than the sensor dimension,for example an aperture of 0.5 mm provides a good response time and an excellent level ofintegration for PD application.
In Figure 15: "Example of a bad sensor embodiment and housing" a wrong design isdescribed, with a very low efficiency of the final design, in terms of response time and thesensor under the effects of heating coming from other devices.

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Mechanical design rules
Figure 15: Example of a bad sensor embodiment and housing

2.3

Sensor protection
An optional filter can be adopted as sensor protection from dust, water, or chemical solvent
by a sensor chamber, in presence of harsh environment or for water proof application. The
key parameter for this kind of implementation is the appropriate choice of the membrane,according to the design requirements and taking into account that the membrane material
will provide a slower response time, in particular in term of pressure response time. The
sensor integration should protect the sensor from the light as well, therefore inside theapplication; the sensor should be housed in a dark place, where the light cannot reach thesensing element.

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Reference design: integration and housing ona personal device

3

AN4672

Reference design: integration and housing on a
personal device
The example below describes how the sensor placement is implemented by following thebasic rules described in this document above; in other words by mounting the sensor as far
as possible from the main heating sources present on the board like display LDO andmicrocontroller that represent the more critical sources of heating. In Figure 16: "Integrationof the digital pressure sensor device in a sensor chamber with two vent apertures" isshown the integration of the sensor in a sensor chamber isolated from the heating and withtwo vent apertures covered with filter membranes. This solution provides at the same timean efficient response time and a good protection from dust and light. In case of waterproof
device, a sensor chamber with one vent aperture is preferred.
Figure 16: Integration of the digital pressure sensor device in a sensor chamber with two vent
apertures

Based on the above recommendation, Figure 17: "Device integration reference in a
portable device" describes the integration in a portable device of the digital pressure sensor
in the bottom left corner. In this solution, a single vent aperture has been adopted (diameterin the range of 0.5 mm) placing the sensor in the left corner, to simplify the integration withthe mechanical case and to maintain the right distance from other heating sources. A filter
membrane is also inserted for dust and water protection, depending on the specificapplication.

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Reference design: integration and housing ona personal device
Figure 17: Device integration reference in a portable device

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Use case and configuration example for the
LPS22HB

4

AN4672Use case and configuration example for the
LPS22HB
The LPS22HB provides great flexibility to the designer and can be configured dependingon the specific application requirements. Requisites such as resolution, power
consumption, acquisition and measurement times can be set accordingly to the application
context.LPS22HB can operate in two different modalities:Power Down modality
Continuous modality

In Power Down modality, no measurements are taken; this is the default sensor
configuration:”. ODR bit [6:4] of CTRL_REG1(0x10h) set to 000.
In Continuous mode, the device is able to detect pressure and temperature data,
depending on the defined data output frequency. In particular 2 operation modes areavailable as continuous modality:One-shot mode
Active mode

In continuous modality, measurements data output are available on the output register witha refresh frequency defined by the selected output data rate (ODR [2, 0] bits of
CTRL_REG1 (0x10)) as described in table:
Table 1: ODR configuration
ODR2

ODR1

ODR0

Pressure (Hz)Temperature (Hz)

0

0

0

0

0

1

1 Hz

1 Hz

0

1

0

10 Hz

10 Hz

0

1

1

25 Hz

25 Hz

1

0

0

50 Hz

50 Hz

1

0

1

75 Hz

75 Hz

One shot

Modification of configuration of CTRL_REG1 (10h) register has to be done with thefollowing writing procedure: – write CTE bit in CONFIG (43h) register to 0x00 (default valueis ‘0’)– write CTRL_REG1– wait 10 usec– write CTE bit n CONFIG (43h) register to 0x20
After these operations, it is possible read output data (pressure and temperature) as
showed in the following figure;

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Use case and configuration example for the
LPS22HB
Figure 18: CTRL_REG1 writing procedure

At device boot, the ODR[2,0] bits default configuration loaded is ‘000’ and the device goesin Power down mode-To get a single measurement of pressure and temperature the
ONE_SHOT bit in CTRL_REG2 (0x11h) has to be set. Once the measurement is acquired,
the ONE_SHOT bit is self-cleared to the default value “0” (Idle), the new data are available
in the output registers, the STATUS_REG(0x27h) bits are updated and the device goesback in power-down mode.The one shot procedure is described below and showed infigure 16.– write CTE bit in CONFIG (43h) register = ‘1’– start One-Shot conversion by
toggling the ONE_SHOT bit in CTRL_REG2 (0x11h)

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Figure 19: One Shot procedure

In active mode, according to the ODR configuration selected, different pressure andtemperature resolution profiles are available as described in the next section.

4.1

Main device settings
In Active and One shot mode, depending on the specific application, a set of configuration
settings is available, ranging from low power to ultra-high resolution profiles. The righttrade-off among, resolution, output data rate and power consumption has to be identified, inorder to make the sensor suitable for the specific design requirements.
The main parameters that can be configured for the specific usage are as follows:Resolution
Current consumption
FIFO Mode Output Data Rate
Low Pass Filter

In The register RES_CONF (0x1Ah), the LC_EN bit allows to select two possible
configurations: Low Noise Mode (default) or Low Current Mode.
The configuration can be modified for adapting the output resolution and the power
consumption of the sensor to the design specifications.In the first case the resolution ishigher than resolution in Low Current mode. Conversely the low current mode is suggested
for applications in which the power consumption has to be low at disadvantage of theoutput resolution.
In addition, to further improving the power saving, the embedded 32-slot of 40-bit data
FIFO, to store the pressure and temperature output values, can be utilized by setting the
FIFO mode. This allows consistent power saving for the system, since the host processor
does not need to continuously poll data from the sensor, but it can wake up only whenneeded and burst the significant data out from the FIFO. This buffer can work according to
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Use case and configuration example for the
LPS22HB
seven different modes as described in table 1. The FIFO buffer is enabled when the
FIFO_EN bit in CTRL_REG2 (11h) is set to '1' and each mode is selected by the
FIFO_MODE[2:0] bits in FIFO_CTRL (14h). Programmable FIFO threshold status, FIFO
overrun events and the number of unread samples stored are available in the
FIFO_STATUS (26h)register and can be set to generate dedicated interrupts on the
INT_DRDY pad using the CTRL_REG3 (12h) register.
Table 2: FIFO mode selection
F_MODE2

F_MODE1

FMODE0

FIFO mode selection

0

0

0

Bypass mode

0

0

1

FIFO mode010Stream mode

0

1

1

Stream to FIFO mode

1

0

0

Bypass to Stream mode

1

0

1

Reserved1

1

0

Dynamic stream mode

1

1

1

Bypass to FIFO mode

As far as the ODR setting is concerned, ranging in active mode among 1,10,25,50, 75 Hz,
it has to be defined looking at the target power consumption, and the appropriate data
output refresh time. Finally, a low pass filter on pressure data can be enabled by setting the
EN_LPFP bit in CTRL_REG1 (10h) with two possible selectable cutoff ODR/9 and ODR/20(bit LPF_CFG of CTRL_REG1). Keep in mind that in order to modify CTRL_REG1 registerthe procedure described in figure 15 has to be used.

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Use case and configuration example for the
LPS25HB5

AN4672Use case and configuration example for the
LPS25HB
The LPS25HB provides great flexibility to the designer and can be configured dependingon the specific application requirements. Requisites such as resolution, power
consumption, acquisition and measurement times can be set accordingly to the application
context.
The LPS25HB can operate in two different modalities:Power Down modality
Continuous modality

In Power Down modality, no measurements are taken; this is the default sensor
configuration PD [7] bit of CTRL_REG1 (0x20) set to “0”.
In Continuous mode, the device can detect pressure and temperature data, depending on
the defined data output frequency.
In particular, two operation modes are available as continuous modality:One-shot mode
Active mode

In continuous modality, measurements data output are available on the output register witha refresh frequency defined by the selected output data rate (ODR [2, 0] bits of
CTRL_REG1 (0x20)) as described in table
Table 3: ODR configuration
ODR2

ODR1

ODR0

Pressure (Hz)Temperature (Hz)

0

0

0

0

0

1

1 Hz

1 Hz

0

1

0

7 Hz

7 Hz

0

1

1

12.5 Hz12.5 Hz

1

0

0

25 Hz

25 Hz

One shotAt device boot, the ODR[2,0] bits default configuration loaded is ‘000’ and the device goesin one-shot mode, that allows to get a single measurement of pressure and temperature, by
toggling the ONE_SHOT bit in CTRL_REG2 (0x21). Once the measurement is acquired,
the ONE_SHOT bit is self-cleared to the default value “0” (Idle), the new data are available
in the output registers, the STATUS_REG(0x27) bits are updated and the device goes backin power-down mode.
In active mode, power-down bit set to “1”, according to the ODR configuration selected,
different pressure and temperature resolution profiles are available as described in the next
section.

5.1

Main device settings
In Active and One shot mode, depending on the specific application, a set of configuration
settings is available, ranging from low power to ultra-high resolution profiles. The righttrade-off among, resolution, output data rate and power consumption has to be identified,
to make the sensor suitable for the specific design requirements.

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Use case and configuration example for the
LPS25HB
The main parameters that can be configured for the specific usage are as follows:Resolution
FIFO moving average filter
Output Data Rate

The register RES_CONF (0x10), bits AVGT [1: 0] e AVGP[ 1:0] allows to select the numberof Pressure and Temperature samples acquired on each measurement cycle(oversampling) for implementing an average by the internal DSP. As a result of this internal
processing, according to the selected number of samples, the noise figure can be modified
for adapting the output resolution of the sensor to the design specifications.
Table 4: Temperature resolution configuration
AVGT1 bit [3] @(0x10)

AVGT0 bit [3] @(0x10)

Nr of samples

0

0

8

0

1

16

1

0

32

1

1

64

In addition, to further improve the resolution by changing the noise figure, the hardware
moving average filter can be utilized by setting the FIFO mean mode FIFO_CTRL (0x2E)
bits F_MODE [2:0]. In this FIFO configuration, called “low noise mode”, the datameasurements processed by the internal DSP are stored in the FIFO and then filteredaccording to the selected number of samples, that represents the FIFO filter coefficients(through the bits WTM_POINT[4:0] , FIFO_CTRL (0x2E) ), as described in not found.
Table 5: FIFO coefficient filter
WTM_POINT[4..0]

FIFO Coefficient filter

00001

2

00011

4

00111

8

01111

16

11111

32

The figure below provides a schematic description of the FIFO moving average filter.
Figure 20: FIFO moving average filter scheme

As far as the ODR setting is concerned, ranging in active mode among 1, 7, 12.5, 25 Hz, it
has to be defined looking at the target power consumption, and the appropriate data output
refresh time.
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LPS25HB
Based on these three main device settings, in order to make simpler the sensor use in theapplication context, some recommendations are provided, as a guidelines for different
applications in the domain of portable device (PD) such as smartphone or wearable, ofweather stations for applications like barometric pressure measurement, or more in
general, of elevator and floor change detection functions, drop detection and indoor
navigation as well.
Table 6: FIFO MEAN MODE configurations for different application scenarios
RMS

Use case

Devicemode
description

FIFO filter
coefficient

Pressureoversampling

Temperatureoversampling

ODR
[Hz]

noise
(hPa)

Indoornavigation

Ultra highresolution

32

512

64

25

0.008

Portable
devicedynamic

Very highresolution

16

512

64

25

0.011

Portable
deviceLow Power

High
resolution

8

512

64

25

0.015

Elevator /Floorchangedetection

Standard
resolution

4

512

64

25

0.020

Fall
detection

Standard
resolution

2

512

64

25

0.027

Weathermonitoring

Low
resolution

off

8

8

12.5

0.15

Weathermonitoring
PDA
Low power

Low power
and low
resolution

off

8

8

1

0.15

In the column ”Device mode description”, the recommended configurations when thedevice is working in FIFO MEAN MODE are provided, as combination of FIFO length,
temperature and pressure oversampling for optimizing the noise figure accordingly to theselected “use case”. An appropriate ODR setting is suggested to optimize thecorresponding power consumption.
Of course, together with the suggested use cases, different configurations can be chosen,
in terms of oversampling, ODR and FIFO coefficients, to better match the specificapplication scenario.

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Revision history

Revision history
Table 7: Document revision history
Date

Revision

Changes

20-Aug-2015

1

Initial release.

16-Dec-2015

2

Document updated to include LPS22HB.

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