Front cover

IBM Power S1014, S1022s,
S1022, and S1024
Technical Overview and Introduction

Giuliano Anselmi
Young Hoon Cho
Andrew Laidlaw
Armin Röll
Tsvetomir Spasov

RedpaperIBM Redbooks
IBM Power S1014, S1022s, S1022, and S1024 Technical
Overview and Introduction
August 2022

REDP-5675-00

Note: Before using this information and the product it supports, read the information in “Notices” onpage vii.

First Edition (August 2022)
This edition applies to the IBM Power S1014 (9105-41B), IBM Power S1022s (9105-22B), IBM Power S1022(9105-22A), and IBM Power S1024 (9105-42A) servers.
This document was created or updated on October 5, 2023.
© Copyright International Business Machines Corporation 2022. All rights reserved.
Note to U.S. Government Users Restricted Rights -- Use, duplication or disclosure restricted by GSA ADP Schedule
Contract with IBM Corp.

Contents
Notices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . vii
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . viii
Preface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ix
Authors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .x
Now you can become a published author, too! . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xi
Comments welcome. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xi
Stay connected to IBM Redbooks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xi
Chapter 1. IBM Power S1014, S1022s, S1022, and S1024 overview . . . . . . . . . . . . . . . . 1
1.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 Systems overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2.1 Power S1014 server . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2.2 Power S1022s server . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.2.3 Power S1022 server . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.2.4 Power S1024 server . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1.3 Operating environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.4 Physical package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
1.4.1 Tower model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
1.4.2 Rack-mount models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
1.5 System features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1.5.1 Power S1014 server features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1.5.2 Power S1022s server features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
1.5.3 Power S1022 server features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
1.5.4 Power S1024 server features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
1.6 Minimum configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
1.7 PCIe adapter slots. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
1.8 Operating system support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
1.8.1 AIX operating system . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
1.8.2 IBM i operating system . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
1.8.3 Linux operating system distributions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
1.8.4 Red Hat OpenShift Container Platform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
1.8.5 Virtual I/O Server . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
1.8.6 Entitled System Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
1.8.7 Update Access Keys . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
1.9 Hardware Management Console overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
1.9.1 HMC 7063-CR2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
1.9.2 Virtual HMC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
1.9.3 BMC network connectivity rules for 7063-CR2 HMC . . . . . . . . . . . . . . . . . . . . . . 31
1.9.4 High availability HMC configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
1.9.5 HMC code level requirements: Power S1014, S1022s, S1022, and S1024 . . . . . 32
1.9.6 HMC currency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
1.10 IBM Power solutions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
1.10.1 IBM PowerSC 2.1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
1.10.2 IBM PowerSC Multi-Factor Authentication . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
1.10.3 IBM Cloud PowerVC for Private Cloud . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
1.10.4 IBM VM Recovery Manager DR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
1.10.5 IBM Cloud Management Console . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
1.11 IBM Power platform modernization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
© Copyright IBM Corp. 2022.

iii

1.11.1 IBM Power Virtual Servers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
1.11.2 Red Hat OpenShift Container Platform for Power. . . . . . . . . . . . . . . . . . . . . . . . 38
1.11.3 Hybrid Cloud Management Edition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Chapter 2. Architecture and technical overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
2.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
2.2 IBM Power10 processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
2.2.1 Power10 processor overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
2.2.2 Processor modules for S1014, S1022s, S1022, and S1024 servers . . . . . . . . . . 49
2.2.3 Power10 processor core . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
2.2.4 Simultaneous multithreading. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
2.2.5 Matrix math accelerator AI workload acceleration . . . . . . . . . . . . . . . . . . . . . . . . 57
2.2.6 Power10 compatibility modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
2.2.7 Processor module options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
2.2.8 On-chip L3 cache and intelligent caching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
2.2.9 Open memory interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
2.2.10 Pervasive memory encryption. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
2.2.11 Nest accelerator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
2.2.12 SMP interconnect and accelerator interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
2.2.13 Power and performance management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
2.2.14 Comparing Power10, Power9, and Power8 processors . . . . . . . . . . . . . . . . . . . 74
2.3 Memory subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
2.3.1 Memory feature and placement rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
2.3.2 Memory bandwidth . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
2.4 Internal I/O subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
2.4.1 Slot configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
2.4.2 System port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
2.5 Enterprise Baseboard Management Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
2.5.1 Managing the system by using the ASMI GUI . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
2.5.2 Managing the system by using DMTF Redfish . . . . . . . . . . . . . . . . . . . . . . . . . . 105
2.5.3 Managing the system by using the Intelligent Platform Management Interface . 108
Chapter 3. Available features and options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
3.1 Processor module features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
3.1.1 Power S1014 processor Feature Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
3.2 Memory features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
3.3 Power supply features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
3.4 Peripheral Component Interconnect adapters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
3.4.1 Local area network adapters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
3.4.2 Fibre Channel adapters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
3.4.3 SAS adapters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
3.4.4 USB adapters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
3.4.5 Cryptographic coprocessor adapters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
3.5 Internal storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
3.5.1 S1022s and S1022 Backplane . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
3.5.2 S1014 and S1024 Backplane . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
3.5.3 NVMe JBOF to backplane cabling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
3.5.4 NVMe support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
3.5.5 RAID support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
3.6 External SAS ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
3.7 Media drawers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
3.7.1 External DVD drives . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
3.7.2 RDX removable disk drives. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132

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IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

3.8 Disk and media features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
3.9 External IO subsystems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
3.9.1 PCIe Gen3 I/O expansion drawer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
3.9.2 NED24 NVMe Expansion Drawer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
3.9.3 EXP24SX SAS Storage Enclosure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146
3.9.4 IBM Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150
3.10 System racks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150
3.10.1 IBM Enterprise 42U Slim Rack 7965-S42 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
3.10.2 AC power distribution units . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152
3.10.3 Rack-mounting rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154
3.10.4 Useful rack additions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154
3.10.5 Original equipment manufacturer racks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156
Chapter 4. Enterprise solutions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159
4.1 PowerVM virtualization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160
4.1.1 IBM Power Hypervisor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160
4.1.2 Multiple shared processor pools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164
4.1.3 Virtual I/O Server . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165
4.1.4 Live Partition Mobility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166
4.1.5 Active Memory Mirroring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167
4.1.6 Remote Restart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167
4.1.7 POWER processor modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167
4.1.8 Single Root I/O virtualization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 169
4.2 IBM PowerVC overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170
4.2.1 IBM PowerVC functions and advantages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171
4.3 Digital transformation and IT modernization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172
4.3.1 Application and services modernization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172
4.3.2 System automation with Ansible . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174
4.4 Protect trust from core to cloud . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177
4.4.1 Power10 processor-based, technology-integrated security ecosystem . . . . . . . 178
4.4.2 Cryptographic engines and transparent memory encryption . . . . . . . . . . . . . . . 179
4.4.3 Quantum-safe cryptography support. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180
4.4.4 IBM PCIe3 Crypto Coprocessor BSC-Gen3 4769 . . . . . . . . . . . . . . . . . . . . . . . 180
4.4.5 IBM PowerSC support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181
4.4.6 Secure and Trusted boot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182
4.4.7 Enhanced CPU: BMC isolation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182
4.5 Running AI where operational data is created, processed, and stored. . . . . . . . . . . . 183
4.5.1 Train anywhere, deploy on Power10 processor-based server . . . . . . . . . . . . . . 184
4.6 Oracle Database Standard Edition 2 on Power S1014 . . . . . . . . . . . . . . . . . . . . . . . . 185
Related publications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187
IBM Redbooks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187
Online resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188
Help from IBM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188

Contentsv

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Notices
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viii

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and IntroductionPreface
This IBM® Redpaper™ publication is a comprehensive guide that covers the
IBM Power® S1014 (9105-41B), IBM Power S1022s (9105-22B), IBM Power S1022(9105-22A), and IBM Power S1024 (9105-42A) servers that use the latest IBM Power10
processor-based technology and support the IBM AIX®, IBM i, and Linux operating systems.
The goal of this paper is to provide a hardware architecture analysis and highlight thechanges, new technologies, and major features that are introduced in these systems, such as
the following examples:򐂰 The latest IBM Power10 processor design, including the Dual Chip Module (DCM) and
Entry Single Chip Module (eSCM) packaging, which is available in various configurationsof 4 - 24 cores per socket.
򐂰 Native Peripheral Component Interconnect® Express (PCIe) 5th generation (Gen5)
connectivity from the processor socket to deliver higher performance and bandwidth forconnected adapters.
򐂰 Open Memory Interface (OMI) connected differential DIMM (DDIMM) memory cards thatdeliver increased performance, resilience, and security over industry-standard memory
technologies, including the implementation of transparent memory encryption.
򐂰 Enhanced internal storage performance with the use of native PCIe connected
Non-Volatile Memory Express (NVMe) devices in up to 16 internal storage slots to deliver
up to 102.4 TB of high-performance, low-latency storage in a single, two-socket system.
򐂰 Consumption-based pricing in the Power Private Cloud with Shared Utility Capacitycommercial model that allows customers to use resources more flexibly and efficiently,
including IBM AIX, IBM i, Red Hat Enterprise Linux, SUSE Linux Enterprise Server, andRed Hat OpenShift Container Platform workloads.
This publication is intended for the following professionals who want to acquire a better
understanding of IBM Power server products:
򐂰
򐂰
򐂰
򐂰
򐂰

IBM Power customers
Sales and marketing professionals
Technical support professionals
IBM Business Partners
Independent software vendors (ISVs)

This paper expands the set of IBM Power documentation by providing a desktop reference
that offers a detailed technical description of the Power10 processor-based Scale Out server
models.

© Copyright IBM Corp. 2022.

ix

Authors
This paper was produced by a team of specialists from around the world working at IBM
Redbooks, Poughkeepsie Center.
Giuliano Anselmi is an IBM® Power Digital Sales Technical Advisor in IBM Digital Sales
Dublin. He joined IBM and focused on Power processor-based technology. For almost 20
years, he covered several technical roles. He is an important resource for the mission of hisgroup and serves a reference for Business Partners and customers.
Young Hoon Cho is IBM Power Top Gun with the post-sales Technical Support Team for IBM
in Korea. He has over 10 years of experience working on IBM RS/6000, IBM System p, andPower products. He provides second-line technical support to Field Engineers who are
working on IBM Power and system management.
Andrew Laidlaw is a Senior Power Technical Seller in the United Kingdom. He has 9 years ofexperience in the IBM IT Infrastructure team, during which time he worked with the latest
technologies and developments. His areas of expertise include open source technologies,
including Linux and Kubernetes, open source databases, and artificial intelligenceframeworks, and tooling. His current focus area is on the Hybrid Cloud tools and capabilities
that support IBM customers in delivering modernization across their Power estate. He haspresented extensively on all of these topics across the world, including at the IBM Systems
Technical University conferences. He has been an author of many other IBM Redbooks®
publications.
Armin Röll works as a IBM Power IT specialist in Germany. He holds a degree inExperimental Physics from the University of Hamburg, Germany. Armin has 25 years ofexperience in IBM Power and AIX® pre-sales technical support. He has written several IBM
Redbooks publications about AIX and IBM Power systems hardware and is a Platinum
Redbooks author.
Tsvetomir Spasov is a IBM Power SME at IBM Bulgaria. His main area of expertise is FSP,eBMC, HMC, POWERLC, and GTMS. He has been with IBM since 2016, providing reactive
break-fix, proactive, preventative, and cognitive support. He has conducted several technicaltrainings and workshops.
The project that produced this material was managed by:
Scott Vetter
PMP, IBM Poughkeepsie, US
Thanks to the following people for their contributions to this project:
Ryan Achilles, Brian Allison, Ron Arroyo, Joanna Bartz, Bart Blaner, Gareth Coates,
Arnold Flores, Austin Fowler, George Gaylord, Douglas Gibbs, Nigel Griffiths,
Daniel Henderson, Markesha L Hill, Stephanie Jensen, Kyle Keaty,
Rajaram B Krishnamurthy, Charles Marino, Michael Mueller, Vincent Mulligan,
Hariganesh Muralidharan, Kaveh Naderi, Mark Nellen, Brandon Pederson,
Michael Quaranta, Hassan Rahimi, Ian Robinson, Todd Rosedahl, Bruno Spruth,
Nicole Schwartz, Bill Starke, Brian W. Thompto, Madhavi Valluri, Jacobo Vargas,
Madeline Vega, Russ YoungIBM
A special thanks to John Banchy for his relentless support of IBM Redbooks and his
contributions and corrections to them over the years.

x

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

Now you can become a published author, too!
Here’s an opportunity to spotlight your skills, grow your career, and become a publishedauthor—all at the same time! Join an IBM Redbooks residency project and help write a bookin your area of expertise, while honing your experience using leading-edge technologies. Yourefforts will help to increase product acceptance and customer satisfaction, as you expand
your network of technical contacts and relationships. Residencies run from two to six weeks
in length, and you can participate either in person or as a remote resident working from yourhome base.
Find out more about the residency program, browse the residency index, and apply online at:
ibm.com/redbooks/residencies.html

Comments welcome
Your comments are important to us!
We want our papers to be as helpful as possible. Send us your comments about this paper orother IBM Redbooks publications in one of the following ways:
򐂰 Use the online Contact us review Redbooks form found at:
ibm.com/redbooks
򐂰 Send your comments in an email to:
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򐂰 Mail your comments to:
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Prefacexi

xii

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

1

Chapter 1.

IBM Power S1014, S1022s,
S1022, and S1024 overview
In this chapter, we introduce the IBM Power S1014 (9105-41B), IBM Power S1022s(9105-22B), IBM Power S1022 (9105-22A), and IBM Power S1024 (9105-42A) server
models. These servers are built upon the Power10 processor architecture to deliver a
uniquely designed platform that is designed to help securely and efficiently scale core
operational and AI applications in a Hybrid Cloud environment.
This chapter includes the following topics:
򐂰
򐂰
򐂰
򐂰
򐂰
򐂰
򐂰
򐂰
򐂰
򐂰
򐂰

1.1, “Introduction” on page 2
1.2, “Systems overview” on page 3
1.3, “Operating environment” on page 8
1.4, “Physical package” on page 10
1.5, “System features” on page 11
1.6, “Minimum configurations” on page 16
1.7, “PCIe adapter slots” on page 16
1.8, “Operating system support” on page 19
1.9, “Hardware Management Console overview” on page 29
1.10, “IBM Power solutions” on page 33
1.11, “IBM Power platform modernization” on page 37© Copyright IBM Corp. 2022.

1

1.1 Introduction
The Power10 processor-based Scale Out servers use the capabilities of the latest Power10
processor technology to deliver unprecedented security, reliability, and manageability for yourcloud and cognitive strategy and delivers industry-leading price and performance for yourmission-critical workloads.
The inclusion of PCIe Gen5 interconnects allows for high data transfer rates to provide higher
I/O performance or consolidation of the I/O demands of the system to fewer adapters runningat higher rates. This situation can result in greater system performance at a lower cost,
particularly when I/O demands are high.
The Power S1022s and S1022 servers deliver the performance of the Power10 processor
technology in a dense 2U (EIA units), rack-optimized form factor that is ideal for consolidating
multiple workloads with security and reliability. These systems are ready for hybrid cloud
deployment, with Enterprise grade virtualization capabilities built in to the system firmware
with the PowerVM hypervisor.
Figure 1-1 shows the Power S1022 server. The S1022s chassis is physically the same as theS1022 server.

Figure 1-1 The Power S1022 is a 2U rack mount server

The Power S1014 server provides a powerful single-socket server that can be delivered in a
4U (EIA units) rack-mount form factor or as a desk-side tower model. It is ideally suited to themodernization of IBM i, AIX, and Linux workloads to allow them to benefit from theperformance, security, and efficiency of the Power10 processor technology. This server easily
integrates into an organization’s cloud and cognitive strategy and delivers industry-leading
price and performance for your mission-critical workloads.
The Power S1024 server is a powerful one- or two-socket server that includes up to 48
Power10 processor cores in a 4U (EIA units) rack-optimized form factor that is ideal for
consolidating multiple workloads with security and reliability. With the inclusion of PCIe Gen5
connectivity and PCIe attached NVMe storage, this server maximizes the throughput of data
across multiple workloads to meet the requirements of modern hybrid cloud environments.

2

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

Figure 1-2 show the Power S1024 server.

Figure 1-2 The Power S1024 is a 4U rack mount server

1.2 Systems overview
The following sections provide more information about the Power S1014 (9105-41B), PowerS1022s (9105-22B), Power S1022 (9105-22A), and Power S1024 (9105-42A) servers.

1.2.1 Power S1014 server
The Power S1014 (9105-41B) server is a powerful one-socket server that is available with a4-core Power10 processor that is running at a typical 3.0 - 3.90 GHz (maximum), an 8-core
Power10 processor that is running at a typical 3.0 - 3.90 GHz (maximum), or a 24-core
Power10 processor that is running at a typical 2.75 - 3.90 GHz (maximum). All processor
cores can run up to eight simultaneous workload threads to deliver greater throughput.
This system is available in a rack-mount (4U EIA units) form factor, or as a desk-side tower
configuration, which offers flexibility in deployment models. The 8-core and 24-core processor
options are only supported in the rack-mount form factor.
The Power S1014 with the 24-core processor module is especially suited for use bycustomers running Oracle Database running Oracle Database Standard Edition 2 (SE2).
Oracle Database SE2 is a specialized entry level license offering from Oracle. Oracle
Database SE2 can be licensed and used on servers with a maximum capacity of 2 CPUsockets. There is no limit to the number of cores. The S1014 with the DCM meets the socket
requirement for running SE2 and with its high core density of Power 10 processors it provides
an excellent way of consolidating multiple small databases into a single server with thepotential of significant savings in license costs.
The Power S1014 server includes eight Differential DIMM (DDIMM) memory slots, each ofwhich can be populated with a DDIMM that is connected by using the new Open Memory
Interface (OMI). These DDIMMs incorporate DDR4 memory chips while delivering increased
memory bandwidth of up to 204 GBps peak transfer rates.
They also support transparent memory encryption to provide increased data security with nomanagement setup and no performance impact. The system supports up to 1 TB memory
capacity with the 8-core or 24-core processors installed, with a minimum requirement of
32 GB memory installed. The maximum memory capacity with the 4-core processor installedis 64 GB.

Chapter 1. IBM Power S1014, S1022s, S1022, and S1024 overview

3Note: The 128 GB DDIMMs will be made available on 9 December 2022; until that date,the maximum memory capacity of an 8-core S1014 server is 512 GB.
Active Memory Mirroring is not supported on the Power S1014 model.
The Power S1014 server includes five usable PCIe adapter slots, four of which support PCIe
Gen5 adapters, while the fifth is a PCIe Gen4 adapter slot. These slots can be populated witha range of adapters that cover LAN, Fibre Channel, SAS, USB, and cryptographic
accelerators. At least one network adapter must be included in each system. The 8-core or
24-core models can deliver more PCIe adapter slots through the addition of a PCIe
Expansion drawer (#EMX0) for a maximum of 10 PCIe adapter slots.
Internal storage for the Power S1014 is exclusively NVMe based, which connects directly into
the system PCIe lanes to deliver high performance and efficiency. A maximum of 16 U.2
form-factor NVMe devices can be installed, which offers a maximum storage capacity of
102.4 TB in a single server. More hard disk drive (HDD) or solid-state device (SSD) storage
can be connected to the 8-core system by way of SAS expansion drawers (the EXP24SX) or
Fibre Channel connectivity to an external storage array.
Note: The 4-core Power S1014 model does not support the connection of PCIe expansion
or storage expansion drawers.
The Power S1014 server includes PowerVM Enterprise Edition to deliver virtualized
environments and to support a frictionless hybrid cloud experience. Workloads can run theAIX, IBM i, and Linux operating systems, including Red Hat OpenShift Container Platform.

1.2.2 Power S1022s server
The Power S1022s (9105-22B) server is a powerful one- or two-socket server that is available
with one or two processors per system, with an option of a 4-core eSCM Power10 processor
running at a typical 3.0 - 3.90 GHz (maximum) or an 8-core eSCM Power10 processor
running at a typical 3.0 - 3.90 GHz (maximum). All processor cores can run up to eight
simultaneous threads to deliver greater throughput. When two sockets are populated, bothmust be the same processor model.
This system is a rack-mount (2U EIA units) form factor with an increased depth over previous
2U Power servers. A rack extension is recommended when installing the Power S1022s
server into an IBM Enterprise S42 rack.
The Power S1022s server includes 16 DDIMM memory slots, of which eight are usable when
only one processor socket is populated. Each of the memory slots can be populated with a
DDIMM that is connected by using the new OMI.
These DDIMMs incorporate DDR4 memory chips while delivering increased memory
bandwidth of up to 409 GBps peak transfer rates per socket. They also support transparent
memory encryption to provide increased data security with no management setup and no
performance impact.
The system supports up to 2 TB memory capacity with both sockets populated, with aminimum requirement of 32 GB installed per socket.
Note: The 128 GB DDIMMs will be made available on 9 December 2022; until that date,the maximum memory capacity of an S1022s server is 1 TB.

4IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

Active Memory Mirroring is available as an option to enhance resilience by mirroring criticalmemory that is used by the PowerVM hypervisor.
The Power S1022s server includes 10 usable PCIe adapter slots, of which five are usable
when only one processor socket is populated. Eight of the PCIe adapter slots support PCIe
Gen5 adapters, while the remaining two (one per socket) are PCIe Gen4 adapter slots. Theseslots can be populated with a range of adapters covering LAN, Fibre Channel, SAS, USB, andcryptographic accelerators. At least one network adapter must be included in each system.
A system with one socket that is populated can deliver more PCIe adapter slots through theaddition of a PCIe expansion drawer (#EMX0) for a maximum of 10 PCIe adapter slots. A
system with two sockets that are populated can support up to 30 PCIe adapters with theaddition of PCIe expansion drawers.
Internal storage for the Power S1022s is exclusively NVMe-based, which connects directly
into the system PCIe lanes to deliver high performance and efficiency. A maximum of eight
U.2 form-factor NVMe devices can be installed, which offers a maximum storage capacity of
51.2 TB in a single server. More HDD or SSD storage can be connected to the 8-core system
by way of SAS expansion drawers (the EXP24SX) or Fibre Channel connectivity to an
external storage array.
The Power S1022s server includes PowerVM Enterprise Edition to deliver virtualized
environments and to support a frictionless hybrid cloud experience. Workloads can run theAIX, IBM i, and Linux operating systems, including Red Hat OpenShift Container Platform.
Multiple IBM i partitions are supported to run on the Power S1022s server with the 8-coreprocessor feature, but each partition is limited to a maximum of four cores. These partitions
must use virtual I/O connections, and at least one VIOS partition is required. These partitions
can be run on systems that also run workloads that are based on the AIX and Linux operating
systems.
Note: The IBM i operating system is not supported on the Power S1022s model with
four-core processor option.

1.2.3 Power S1022 server
The Power S1022 (9105-22A) server is a powerful one- or two-socket server that is available
with one or two processors per system, with the following options:򐂰 One or two 12-core Power10 processors running at a typical 2.90 - 4.0 GHz (maximum)򐂰 Two 16-core Power10 processors running at a typical 2.75 - 4.0 GHz (maximum)򐂰 Two 20 core Power10 processor running at a typical 2.45 - 3.90 GHz (maximum)
All processor cores can run up to eight simultaneous threads to deliver greater throughput.
When two sockets are populated, both must be the same processor model.
The Power S1022 supports Capacity Upgrade on Demand, where processor activations canbe purchased when they are required by workloads. A minimum of 50% of the installed
processor cores must be activated and available for use, with activations for the otherinstalled processor cores available to purchase as part of the initial order or as a future
upgrade. Static activations are linked only to the system for which they are purchased.
The Power S1022 server also can be purchased as part of a Power Private Cloud with
Shared Utility Capacity pool. In this case, the system can be purchased with one or morebase processor activations, which are shared within the pool of systems. More base

Chapter 1. IBM Power S1014, S1022s, S1022, and S1024 overview

5

processor activations can be added to the pool in the future. A system with static activations
can be converted to become part of a Power Private Cloud with Shared Utility Capacity pool.
This system is a rack-mount (2U EIA units) form factor with an increased depth over previous
2U Power servers. A rack extension is recommended when installing the Power S1022 server
into an IBM Enterprise S42 rack.
The Power S1022 server includes 32 DDIMM memory slots, of which 16 are usable when
only one processor socket is populated.
Each of the memory slots can be populated with a DDIMM that is connected by using the new
OMI. These DDIMMs incorporate DDR4 memory chips while delivering increased memory
bandwidth of up to 409 GBps peak transfer rates per socket. They also support transparent
memory encryption to provide increased data security with no management setup and no
performance impact.
The system supports up to 4 TB memory capacity with both sockets populated, with aminimum requirement of 32 GB installed per socket.
Note: The 128 GB DDIMMs will be made available on 9 December 2022; until that date,the maximum memory capacity of an S1022 server is 2 TB.

Active Memory Mirroring is available as an option to enhance resilience by mirroring criticalmemory that is used by the PowerVM hypervisor
The Power S1022 server includes 10 usable PCIe adapter slots, of which five are usable
when only one processor socket is populated. Eight of the PCIe adapter slots support PCIe
Gen5 adapters, while the remaining two (one per socket) are PCIe Gen4 adapter slots. Theseslots can be populated with a range of adapters that covers LAN, Fibre Channel, SAS, USB,and cryptographic accelerators. At least one network adapter must be included in eachsystem.
A system with one socket that is populated can deliver more PCIe adapter slots through theaddition of a PCIe expansion drawer (#EMX0) for a maximum of 10 PCIe adapter slots. A
system with two sockets that are populated can deliver up to 30 PCIe adapters with theaddition of PCIe expansion drawers.
Internal storage for the Power S1022 is exclusively NVMe based, which connects directly into
the system PCIe lanes to deliver high performance and efficiency. A maximum of eight U.2
form-factor NVMe devices can be installed, which offers a maximum storage capacity of
51.2 TB in a single server. More HDD or SSD storage can be connected to the system byusing SAS expansion drawers (the EXP24SX) or Fibre Channel connectivity to an external
storage array.
The Power S1022 server includes PowerVM Enterprise Edition to deliver virtualized
environments and to support a frictionless hybrid cloud experience. Workloads can run theAIX, IBM i, and Linux operating systems, including Red Hat OpenShift Container Platform.
Multiple IBM i partitions are supported to run on the Power S1022 server, but each partition islimited to a maximum of four cores. These partitions must use virtual I/O connections, and at
least one VIOS partition is required. These partitions can be run on systems that also run
workloads that are based on the AIX and Linux operating systems.

6

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

1.2.4 Power S1024 server
The Power S1024 (9105-42A) server is a powerful one- or two-socket server that is available
with one or two processors per system, with an option of a 12 core Power10 processor
running at a typical 3.40 - 4.0 GHz (maximum), a 16 core Power10 processor running at a
typical 3.10 - 4.0 GHz (maximum) or a 24 core Power10 processor running at a typical 2.75 3.90 GHz (maximum).
All processor cores can run up to eight simultaneous threads to deliver greater throughput.
When two sockets are populated, both must be the same processor model. A maximum of 48
Power10 cores are supported in a single system, which delivers up to 384 simultaneous
workload threads.
The Power S1024 supports Capacity Upgrade on Demand, where processor activations canbe purchased when they are required by workloads. A minimum of 50% of the installed
processor cores must be activated and available for use, with activations for the otherinstalled processor cores available to purchase as part of the initial order or as a future
upgrade. These static activations are linked only to the system for which they are purchased.
The Power S1024 server also can be purchased as part of a Power Private Cloud with
Shared Utility Capacity pool. In this case, the system can be purchased with one or morebase processor activations that are shared within the pool of systems. More base processor
activations can be added to the pool in the future. It is possible to convert a system with static
activations to become part of a Power Private Cloud with Shared Utility Capacity pool.
This system is a rack-mount (4U EIA units) form factor.
The Power S1024 server includes 32 DDIMM memory slots, of which 16 are usable when
only one processor socket is populated. Each of the memory slots can be populated with a
DDIMM that is connected by using the new OMI. These DDIMMs incorporate DDR4 memory
chips while delivering increased memory bandwidth of up to 409 GBps peak transfer rates
per socket.
They also support transparent memory encryption to provide increased data security with nomanagement setup and no performance impact. The system supports up to 8 TB memory
capacity with both sockets populated, with a minimum requirement of 32 GB installed per
socket.
Note: The 128 GB and 256 GB DDIMMs will be made available on November 2022; untilthat date, the maximum memory capacity of an S1024 server is 2 TB.

Active Memory Mirroring is available as an option to enhance resilience by mirroring criticalmemory that is used by the PowerVM hypervisor
The Power S1024 server includes 10 usable PCIe adapter slots, of which five are usable
when only one processor socket is populated. Eight of the PCIe adapter slots support PCIe
Gen5 adapters, while the remaining two (one per socket) are PCIe Gen4 adapter slots. Theseslots can be populated with a range of adapters that covers LAN, Fibre Channel, SAS, USB,and cryptographic accelerators. At least one network adapter must be included in eachsystem.
A system with one socket that is populated can deliver more PCIe adapter slots through theaddition of a PCIe expansion drawer (#EMX0) for a maximum of 10 PCIe adapter slots. A
system with two sockets that are populated can support up to 30 PCIe adapters with theaddition of PCIe expansion drawers.

Chapter 1. IBM Power S1014, S1022s, S1022, and S1024 overview

7Internal storage for the Power S1024 is exclusively NVMe-based, which connects directly into
the system PCIe lanes to deliver high performance and efficiency. A maximum of eight U.2
form-factor NVMe devices can be installed, which offers a maximum storage capacity of
102.4 TB in a single server. HDD or SSD storage can be connected to the system by using
SAS expansion drawers (the EXP24SX) or Fibre Channel connectivity to an external storagearray.
The Power S1024 server includes PowerVM Enterprise Edition to deliver virtualized
environments and support a frictionless hybrid cloud experience. Workloads can run the AIX,IBM i, and Linux operating systems, including Red Hat OpenShift Container Platform.

1.3 Operating environment
The Power10 processor-based Scale Out servers are installed in industry-standard, 19-inchracks that are housed in data centers. The exception is the Power S1014, which also isavailable in a desk-side tower form factor.
Table 1-1 lists the electrical characteristics of the Power S1014, S1022s, S1022, and S1024
servers.
Table 1-1 Electrical characteristics for Power S1014, S1022s, S1022, and S1024 servers
Electricalcharacteristics

Properties
Power S1014 server

Power S1022s server

Power S1022 server

Power S1024 server

Operatingvoltage

1200 W power supply
100 - 127 V AC or 200- 240 V ACor
1600 W power supply
200 - 240 V AC

1000 W power supply
100 - 127 V AC or 200 240 V AC

2000 W power supply
200 - 240 V AC

1600 W power supply
200 - 240 V AC

Operatingfrequency

50/60 ±3 Hz

50/60 ±3 Hz

50/60 ±3 Hz

50/60 ±3 Hz

Thermal output

3668 Btu/hour(maximum)7643 Btu/hour(maximum)7643 Btu/hour(maximum)9383 Btu/hour(maximum)Power
consumption

1075 watts(maximum)

2240 watts (maximum)

2240 watts(maximum)2750 watts(maximum)Power-sourceloading

1.105 kVa (maximum
configuration)

2.31 kVa (maximum
configuration)

2.31 kVa (maximum
configuration)

2.835 kVa (maximum
configuration)

Phase

SingleSingleSingleSingleNote: The maximum measured value is the worst-case power consumption that is
expected from a fully populated server under an intensive workload. The maximum
measured value also accounts for component tolerance and non ideal operating
conditions. Power consumption and heat load vary greatly by server configuration andutilization. The IBM Systems Energy Estimator can be used to obtain a heat output
estimate that is based on a specific configuration.

8

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

Table 1-2 lists the environment requirements for the Power10 processor-based Scale Out
servers.
Table 1-2 Environment requirements for Power S1014, S1022s, S1022 and S1024
Environment

Recommended
operatingAllowable operating

Non operating

Temperature

18 - 27°C(64.4 - 80.6°F)

5 - 40°C (41 - 104°F)

5 - 45°C (41 - 113°F)

Humidity range

9.0°C (48.2°F) dew
point (DP) to 60%
relative humidity (RH)or 15°C (59°F) DP

8% - 85% RH

8% - 85% RH

Maximum DP

N/A

24°C (75.2°F)

27°C (80.6°F)

Maximum operating
altitudeN/A

3050 m (10000 ft)

N/A

Note: IBM does not recommend operation above 27C, however, one can expect full
performance up to 35C for these systems. Above 35C, the system is capable of operating,but possible reductions in performance may occur to preserve the integrity of the systemcomponents. Above 40C there may be reliability concerns for components within thesystem.
Table 1-3 lists the noise emissions for the systems.
Table 1-3 Noise emissions for Power S1014, S1022s, S1022 and S1024
Product

Declared A-weighted soundpower level, LWAda (B)b

Declared A-weighted soundpressure level, LpAm (dB)cOperating

Idle

Operating

Idle

Power S1014 (tower)

6.4

6.4

48

48

Power S1014 (rack)

7.5

7.5

62

62

Power S1022s

7.4

6.9

62

57

Power S1022

7.4

6.9

62

57

Power S1024

7.7

7.7

64

64

a. Declared level LWAd is the upper-limit A-weighted sound power level. Declared level LpAm is
the mean A-weighted emission sound pressure level that is measured at the 1-meter bystander
positions.
b. All measurements are made in conformance with ISO 7779 and declared in conformance with
ISO 9296.
c. 10 dB (decibel) equals 1 B (bel).

Chapter 1. IBM Power S1014, S1022s, S1022, and S1024 overview

9

Important: NVMe PCIe adapters (EC5G, EC5B, EC5C, EC5D, EC5E, EC5F, EC6U, EC6V,
EC6W, EC6X, EC6Y, and EC6Z) require higher fan speeds to compensate for their higher
thermal output. This issue might affect the acoustic output of the server, depending on theconfiguration. The e-config tool can be used to ensure a suitable configuration (log-in
required).
NVMe U.2 drives (ES1G, EC5V, ES1H, and EC5W) also require more cooling tocompensate for their higher thermal output, which might increase the noise emissions of
the servers.
NVMe Flash Adapters (EC7B EC7D EC7F EC7K EC7M EC7P EC5B EC5D EC5F EC6V
EC6X EC6Z) are not supported when using the 24-core processor due to thermal
limitations.

1.4 Physical package
The Power S1014 server is available in rack-mount and tower form factors. The
Power S1022s, Power S1022, and Power S1024 servers are available in rack-mount form
factor only.

1.4.1 Tower model
Table 1-4 lists the physical dimensions of the Power S1014 tower chassis.
Table 1-4 Physical dimensions of the Power S1014 tower chassis
Dimension

Power S1014 server (9105-41B)

Width

329 mm (13 in.)

Depth

815 mm (32 in.)

Height522 mm (20.6 in.)

Weight47.6 kg (105 lb)

1.4.2 Rack-mount models
Table 1-5 lists the physical dimensions of the Power S1022s and S1022 rack-mounted
chassis. These server models are available only in a rack-mounted form factor and take 2U ofrack space each.
Table 1-5 Physical dimensions of the Power S1022 rack-mounted chassis

10

Dimension

Power S1022s server (9105-22B)

Power S1022 server (9105-22A)

Width

482 mm (18.97 in.)

482 mm (18.97 in.)Depth

813 mm (32 in.)

813 mm (32 in.)

Height86.5 mm (3.4 in.)86.5 mm (3.4 in.)

Weight31.75 kg (70 lb)

31.75 kg (70 lb)

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

Figure 1-3 shows the front view of the Power S1022 server.

Figure 1-3 Front view of the Power S1022 server

Table 1-6 lists the physical dimensions of the rack-mounted Power S1014 and Power S1024
chassis. The server is available only in a rack-mounted form factor and takes 4U of rack
space.
Table 1-6 Physical dimensions of the rack-mounted Power S1014 and Power S1024 chassis
Dimension

Power S1014 server (9105-41B)

Power S1024 server (9105-42A)

Width

482 mm (18.97 in.)

482 mm (18.97 in.)Depth

712 mm (28 in.)

712 mm (28 in.)

Height

173 mm (6.48 in.)

173 mm (6.48 in.)

Weight42.6 kg (94 lb)

42.6 kg (94 lb)

Figure 1-4 shows the front view of the Power S1024 server.

Figure 1-4 Front view of the Power S1024 server

1.5 System features
This section covers the standard system features that are included in the Power10
processor-based Scale Out server models. Each model has a different base feature set.

1.5.1 Power S1014 server features
The following standard features are available on the Power S1014 (9105-41B) server model:򐂰 One entry single-chip module (eSCM) processor per system server:– 3.0 - 3.90 GHz, 4-core Power10 processor– 3.0 - 3.90 GHz, 8-core Power10 processor– 2.75 - 3.90 GHz 24-core Power10 processor1

Chapter 1. IBM Power S1014, S1022s, S1022, and S1024 overview

11򐂰 Processor core activation features available on a per-core basis: Static processor core
activations for all installed cores򐂰 Up to 1 TB of system memory distributed across eight DDIMM slots per system server,
made up of one to eight DDR4 memory features. Each memory feature includes twomemory DDIMM parts:––––

32 GB (2 x 16 GB DDIMMs)
64 GB (2 x 32 GB DDIMMs)
128 GB (2 x 64 GB DDIMMs)
256 GB (2 x 128 GB DDIMMs)2

򐂰 Active Memory Mirroring for Hypervisor is available as an option to enhance resilience by
mirroring critical memory that is used by the PowerVM hypervisor
򐂰 PCIe slots:––––

One x16 Gen4 or x8 Gen5 full-height, half-length slot (CAPI)
Two x8 Gen5 full-height, half-length slots (with x16 connectors) (CAPI)
One x8 Gen5 full-height, half-length slot (with x16 connector)
One x8 Gen4 full-height, half-length slot (with x16 connector) (CAPI)򐂰 Up to two storage backplanes each with eight NVMe U.2 drive slots:– Up to 16 NMVe U.2 cards (800 GB, 1.6 TB, 3.2 TB)– Optional internal RDX drive򐂰 Integrated:
–
–
–
–
–
–
–
–

Baseboard management/service processor
EnergyScale technology
Hot-swap and redundant cooling
Redundant hot-swap AC power supplies
One front and two rear USB 3.0 ports
Two 1 GbE RJ45 ports for HMC connection
One system port with RJ45 connector
19-inch rack-mounting hardware (4U)򐂰 Optional PCIe I/O expansion drawer with PCIe slots on eight-core and twenty four-coremodels only:– One PCIe Gen3 I/O Expansion Drawer– I/O drawer holds one 6-slot PCIe fan-out module– Fanout module attaches to the system node through a PCIe optical cable adapter

1.5.2 Power S1022s server features
The following standard features are available on the Power S1022s (9105-22B) server model:򐂰 One or two entry single-chip module (eSCM) processors per system server:– One 3.0 - 3.90 GHz, 4-core Power10 processor– One or two 3.0 - 3.90 GHz, 8-core Power10 processors
򐂰 Processor core activation features available on a per-core basis: Static processor core
activations for all installed cores򐂰 Up to 2 TB of system memory that is distributed across 16 DDIMM slots per system
server, made up of one to eight DDR4 memory features per populated socket. Eachmemory feature includes two memory DDIMM parts:– 32 GB (2 x 16 GB DDIMMs)
1

This option is currently not supported for Linux or IBM i operating systems.

2 The 128 GB DDIMMs will be made available on 9 December 2022

12

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

– 64 GB (2 x 32 GB DDIMMs)– 128 GB (2 x 64 GB DDIMMs)– 256 GB (2 x 128 GB DDIMMs)3
򐂰 Active Memory Mirroring for Hypervisor is not available as an option to enhance resilienceby mirroring critical memory used by the PowerVM hypervisor
򐂰 PCIe slots with a single processor socket populated:––––

One x16 Gen4 or x8 Gen5 half-height, half-length slot (CAPI)
Two x8 Gen5 half-height, half-length slots (with x16 connector) (CAPI)
One x8 Gen5 half-height, half-length slot (with x16 connector)
One x8 Gen4 half-height, half-length slot (with x16 connector) (CAPI)򐂰 PCIe slots with two processor sockets populated:
–
–
–
–
–

Two x16 Gen4 or x8 Gen5 half-height, half-length slots (CAPI)
Two x16 Gen4 or x8 Gen5 half-height, half-length slots
Two x8 Gen5 half-height, half-length slots (with x16 connectors) (CAPI)
Two x8 Gen5 half-height, half-length slots (with x16 connectors)
Two x8 Gen4 half-height, half-length slots (with x16 connectors) (CAPI)򐂰 Up to two storage backplanes each with four NVMe U.2 drive slots: Up to eight NMVe U.2
cards (800 GB, 1.6 TB, 3.2 TB, and 6.4 TB)
򐂰 Integrated:
–
–
–
–
–
–
–
–

Baseboard management/service processor
EnergyScale technology
Hot-swap and redundant cooling
Redundant hot-swap AC power supplies
One front and two rear USB 3.0 ports
Two 1 GbE RJ45 ports for HMC connection
One system port with RJ45 connector
19-inch rack-mounting hardware (2U)򐂰 Optional PCIe I/O expansion drawer with PCIe slots on eight-core model only:– Up to two PCIe Gen3 I/O Expansion Drawers– Each I/O drawer holds up to two 6-slot PCIe fan-out modules– Each fanout module attaches to the system node through a PCIe optical cable adapter

1.5.3 Power S1022 server features
The following standard features are available on the Power S1022 (9105-22A) server model:򐂰 One or two dual-chip module (DCM) processors per system server:– One or two 2.90 - 4.0 GHz, 12-core Power10 processors– Two 2.75 - 4.0 GHz, 16-core Power10 processor– Two 2.45 - 3.90 GHz, 20-core Power10 processor
򐂰 Processor core activation features available on a per-core basis. These exclusive options
cannot be mixed in a single server:– Static processor core activations for all installed cores– Capacity Upgrade on-Demand core activations for a minimum of half the installed
processor cores– Base processor activations for Pools 2.0 for between one and all installed cores

3 The 128 GB DDIMMs will be made available on 9 December 2022

Chapter 1. IBM Power S1014, S1022s, S1022, and S1024 overview

13򐂰 Up to 4 TB of system memory distributed across 32 DDIMM slots per system server,which consist of 1 - 16 DDR4 memory features per populated socket. Each memory
feature includes two memory DDIMM parts:––––

32 GB (2 x 16 GB DDIMMs)
64 GB (2 x 32 GB DDIMMs)
128 GB (2 x 64 GB DDIMMs)
256 GB (2 x 128 GB DDIMMs)4

򐂰 Active Memory Mirroring for Hypervisor is available as an option to enhance resilience by
mirroring critical memory used by the PowerVM hypervisor
򐂰 PCIe slots with a single processor socket populated:––––

One x16 Gen4 or x8 Gen5 half-height, half-length slot (CAPI)
Two x8 Gen5 half-height, half-length slots (with x16 connector) (CAPI)
One x8 Gen5 half-height, half-length slot (with x16 connector)
One x8 Gen4 half-height, half-length slot (with x16 connector) (CAPI)򐂰 PCIe slots with two processor sockets populated:
–
–
–
–
–

Two x16 Gen4 or x8 Gen5 half-height, half-length slots (CAPI)
Two x16 Gen4 or x8 Gen5 half-height, half-length slots
Two x8 Gen5 half-height, half-length slots (with x16 connectors) (CAPI)
Two x8 Gen5 half-height, half-length slots (with x16 connectors)
Two x8 Gen4 half-height, half-length slots (with x16 connectors) (CAPI)򐂰 Up to two storage backplanes each with four NVMe U.2 drive slots: Up to eight NMVe U.2
cards (800 GB, 1.6 TB, 3.2 TB, and 6.4 TB)
򐂰 Integrated:
–
–
–
–
–
–
–
–

Baseboard management/service processor
EnergyScale technology
Hot-swap and redundant cooling
Redundant hot-swap AC power supplies
One front and two rear USB 3.0 ports
Two 1 GbE RJ45 ports for HMC connection
One system port with RJ45 connector
19-inch rack-mounting hardware (2U)򐂰 Optional PCIe I/O expansion drawer with PCIe slots:– Up to two PCIe Gen3 I/O Expansion Drawers– Each I/O drawer holds up to two 6-slot PCIe fan-out modules– Each fanout module attaches to the system node through a PCIe optical cable adapter

1.5.4 Power S1024 server features
The following standard features are available on the Power S1024 (9105-42A) server model:򐂰 One or two dual-chip module (DCM) processors per system server:– One or two 3.40 - 4.0 GHz, 12-core Power10 processors– Two 3.10 - 4.0 GHz, 16-core Power10 processor– Two 2.75 - 3.90 GHz, 24-core Power10 processor

4 The 128 GB DDIMMs will be made available on 9 December 2022.

14

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction򐂰 Processor core activation features available on a per-core basis. These exclusive options
cannot be mixed in a single server:– Static processor core activations for all installed cores– Capacity Upgrade on-Demand core activations for a minimum of half the installed
processor cores– Base processor activations for Pools 2.0 for between one and all installed cores򐂰 Up to 8 TB of system memory that is distributed across 32 DDIMM slots per system
server, made up of one to 16 DDR4 memory features per populated socket. Each memory
feature includes two memory DDIMM parts:
–
–
–
–
–

32 GB (2 x 16 GB DDIMMs)
64 GB (2 x 32 GB DDIMMs)
128 GB (2 x 64 GB DDIMMs)
256 GB (2 x 128 GB DDIMMs)5
512 GB (2 x 256 GB DDIMMs)5

򐂰 Active Memory Mirroring for Hypervisor is available as an option to enhance resilience by
mirroring critical memory used by the PowerVM hypervisor
򐂰 PCIe slots with a single processor socket populated:––––

One x16 Gen4 or x8 Gen5 full-height, half-length slot (CAPI)
Two x8 Gen5 full-height, half-length slots (with x16 connector) (CAPI)
One x8 Gen5 full-height, half-length slot (with x16 connector)
One x8 Gen4 full-height, half-length slot (with x16 connector) (CAPI)򐂰 PCIe slots with two processor sockets populated:
–
–
–
–
–

Two x16 Gen4 or x8 Gen5 full-height, half-length slots (CAPI)
Two x16 Gen4 or x8 Gen5 full-height, half-length slots
Two x8 Gen5 full-height, half-length slots (with x16 connectors) (CAPI)
Two x8 Gen5 full-height, half-length slots (with x16 connectors)
Two x8 Gen4 full-height, half-length slots (with x16 connectors) (CAPI)򐂰 Up to two storage backplanes each with eight NVMe U.2 drive slots:– Up to 16 NMVe U.2 cards (800 GB, 1.6 TB, 3.2 TB, and 6.4 TB)– Optional internal RDX drive򐂰 Integrated:
–
–
–
–
–
–
–
–

Baseboard management/service processor
EnergyScale technology
Hot-swap and redundant cooling
Redundant hot-swap AC power supplies
One front and two rear USB 3.0 ports
Two 1 GbE RJ45 ports for HMC connection
One system port with RJ45 connector
19-inch rack-mounting hardware (2U)򐂰 Optional PCIe I/O expansion drawer with PCIe slots:– Up to two PCIe Gen3 I/O Expansion Drawers– Each I/O drawer holds up to two 6-slot PCIe fan-out modules– Each fanout module attaches to the system node through a PCIe optical cable adapter

5 The 128 GB and 256 GB DDIMMs will be made available on 9 December 2022.

Chapter 1. IBM Power S1014, S1022s, S1022, and S1024 overview

151.6 Minimum configurations
The minimum Power_S1014, S1022s, S1022, and S1024 servers initial order must include
the following components:
򐂰
򐂰
򐂰
򐂰
򐂰
򐂰
򐂰

Processor module
One LAN adapter
At least two power supplies and power cords
An operating system indicator
An Operator-panel (required only for IBM i; optional for AIX/Linux)
A cover set indicator
Language Group Specify

The minimum initial order also must include one of the following memory options and one of
the following power supply options:򐂰 Memory options:– One processor module: Minimum of two DDIMMs (one memory feature)– Two processor modules: Minimum of four DDIMMs (two memory features)
򐂰 Storage options:– For boot from NVMe for AIX, Linux, or VIO Server: One NVMe drive slot and one
NVMe drive, or one PCIe NVMe add-in adapter must be ordered.
– For boot from NVMe for IBM i: Two NVMe drive slots and two NVMe drives, or two
PCIe NVMe add-in adapters must be ordered.
An internal NVMe drive, RAID card, and storage backplane, are not required if otherboot sources are available and configured.
– For boot from SAN: Boot from SAN (#0837) feature must be selected and a Fibre
Channel adapter must be ordered.
– For boot from SAS attached hard drives (HDDs) or solid state devices (SSDs): Remote
Load Source (#EHR2) must be ordered, and at least one HDD or SSD drive must bepresent in a connected EXP24SX (#ESLS or #ELLS) drawer and at least one SAS
adapter must be ordered.
– For boot from iSCSI for AIX: The iSCSI SAN Load Source (#ESCZ) option must be
selected and at least one LAN adapter must be ordered.
򐂰 Power supply options (for more information, see 3.3, “Power supply features” onpage 117):– S1022 and S1022s need two power supplies.
– S1014 needs two power supplies for the rack-mounted version; four power supplies forthe tower version.
– S1024 needs four power supplies.

1.7 PCIe adapter slots
The Power10 processor-based Scale Out server models each include 10 physical PCIe
adapter slots in the chassis. The number of slots that are available for use depends on thenumber of processor sockets in the system that are populated; for example:
򐂰 With one processor socket populated, five of the PCIe adapter slots are available for use򐂰 With two processor sockets populated, all 10 of the PCIe adapter slots can be used

16

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

These internal PCIe adapter slots support a range of different adapters. More information
about the available adapters, see 3.4, “Peripheral Component Interconnect adapters” onpage 117.
The adapter slots are a mix of PCIe Gen5 and PCIe Gen4 slots, with some running at x8
speed and others at x16. Some of the PCIe adapter slots also support OpenCAPI functions
when OpenCAPI is used enabled adapter cards. All PCIe adapter slots support hot-plugcapability when used with Hardware Management Console (HMC) or eBMC based
maintenance procedures.
Two other slots are available in the rear of each server. One of these slots is dedicated to theeBMC management controller for the system, and the other is a dedicated slot for OpenCAPI
connected devices. These slots cannot be used for any other PCIe adapter type.
Each system requires at least one LAN adapter to support connection to local networks. Thisrequirement allows for initial system testing and configuration, and the preinstallation of any
operating systems, if required. By default, this server is the #5899 in the S1014 server, the#EC2T in the S1022s or S1022 servers, or the #EC2U in the S1024 server. Alternative LAN
adapters can be installed instead. This required network adapter is installed by default in slot
C10.
Table 1-7 lists the adapter slots that are available in the Power10 processor-based Scale Out
servers in various configurations.
Table 1-7 PCIe slot details for Power S1014, S1022s, S1022, and S1024 servers
Adapter slot

Type

Sockets populated

OpenCAPI enabled

P0-C0

PCIe4 x16 or PCIe5 x8
slots

2 onlyNo

P0-C1

PCIe4 x8 with x16
connector

2 onlyYes

P0-C2

PCIe5 x8 with x16
connector

2 onlyNo

P0-C3

PCIe4 x16 or PCIe5 x8
slots

2 onlyYes

P0-C4

PCIe4 x16 or PCIe5 x8
slots

2 onlyNo

P0-C5aeBMC

All systems

N/A

P0-C6b

OpenCAPI x16
connector

1 or 2

Yes

P0-C7

PCIe5 x8 with x16
connector

1 or 2

Yes

P0-C8

PCIe4 x8 with x16
connector

1 or 2

Yes

P0-C9

PCIe5 x8 with x16
connector

1 or 2

Yes

P0-C10

PCIe4 x16 or PCIe5 x8
slots

1 or 2

Yes

P0-C11

PCIe5 x8 with x16
connector

1 or 2

No

Chapter 1. IBM Power S1014, S1022s, S1022, and S1024 overview

17

a. Used for eBMC only.
b. Used for devices with OpenCAPI connections only.

The Power S1014 and S1024 servers are 4U (EIA units), and support the installation of
full-height PCIe adapters. Figure 1-5 shows the PCIe adapter slot locations for thePower S1014 and S1024 server models.

Figure 1-5 PCIe adapter slot locations on the Power S1014 and S1024 server models

The Power S1022s and S1022 servers are 2U (EIA units), and support the installation of
low-profile PCIe adapters. Figure 1-6 shows the PCIe adapter slot locations for thePower S1022s and S1022 server models.

Figure 1-6 PCIe adapter slot locations on the Power S1022sand S1022 server models

The total number of PCIe adapter slots available can be increased by adding PCIe Gen3 I/O
expansion drawers. With one processor socket populated (except the S1014 four core
option), one I/O expansion drawer that is installed with one fan-out module is supported.
When two processor sockets are populated, up to two I/O expansion drawers with up to four
fanout modules are supported. The connection of each fan out module in a PCIe Gen3
expansion drawer requires the installation of a PCIe optical cable adapter in one of theinternal PCIe x16 adapter slots (C0, C3®, C4, or C10).
For more information about the connectivity of the internal I/O bus and the PCIe adapter slots,see 2.4, “Internal I/O subsystem” on page 90.

18

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

1.8 Operating system support
The Power10 processor-based Scale Out servers support the following families of operating
systems:
򐂰 AIX
򐂰 IBM i򐂰 Linux
In addition, the Virtual I/O Server (VIOS) can be installed in special partitions that provide
virtualization of I/O capabilities, such as network and storage connectivity. Multiple VIOS
partitions can be installed to provide support and services to other partitions running AIX,IBM i, or Linux, such as virtualized devices and Live Partition Mobility capabilities.
For more information about the Operating System and other software that is available on
Power, see this IBM Infrastructure web page.
The minimum supported levels of IBM AIX, IBM i, and Linux at the time of announcement aredescribed in the following sections. For more information about hardware features andOperating System level support, see this IBM Support web page.
This tool helps to plan a successful system upgrade by providing the prerequisite information
for features that are in use or planned to be added to a system. A machine type and model
can be selected and the prerequisites, supported operating system levels and otherinformation can be determined.
The machine types and model for the Power10 processor-based Scale Out systems are listed
given in Table 1-8.
Table 1-8 Machine types and models of S1014, S1022s, S1022, and S1024 server models
Server nameMachine type and model

S1014

9105-41B

S1022s9105-22B

S1022

9105-22A

S1024

9105-42A

1.8.1 AIX operating system
At announcement, the Power S1014, S1022s, S1022, and S1024 servers support thefollowing minimum levels of the AIX operating system when installed with virtual I/O:򐂰򐂰򐂰򐂰AIX Version 7.3 with Technology Level 7300-00 and Service Pack 7300-00-01-2148
AIX Version 7.2 with Technology Level 7200-05 and Service Pack 7200-05-01-2038
AIX Version 7.2 with Technology Level 7200-04 and Service Pack 7200-04-02-2016
AIX Version 7.1 with Technology Level 7100-05 and Service Pack 7100-05-06-2016

At announcement, the Power S1014, S1022s, S1022, and S1024 servers support thefollowing minimum levels of the AIX operating system when installed by using direct I/Oconnectivity:
򐂰 AIX Version 7.3 with Technology Level 7300-00 and Service Pack 7300-00-02-2220
򐂰 AIX Version 7.2 with Technology Level 7200-05 and Service Pack 7200-05-04-2220
򐂰 AIX Version 7.2 with Technology Level 7200-04 and Service Pack 7200-04-06-2220

Chapter 1. IBM Power S1014, S1022s, S1022, and S1024 overview

19Note: AIX Version 7.2 with Technology Level 7200-04 and Service Pack 7200-04-06-2220
is planned to be available from 16 September 2022.
Consider the following points:
򐂰 AIX 7.1 instances must run in an LPAR in IBM POWER8® compatibility mode with
VIOS-based virtual storage and networking.
򐂰 AIX 7.2 instances can use physical and virtual I/O adapters, but must run in an LPAR in
IBM POWER9™ compatibility mode.
򐂰 AIX 7.3 instances can use physical and virtual I/O adapters, and can run in an LPAR in
native Power10 mode.
IBM periodically releases maintenance packages (service packs or technology levels) for the
AIX operating system. For more information about these packages, downloading, andobtaining the installation packages, see this IBM Support Fix Central web page.
For more information about hardware features compatibility and the corresponding AIX
Technology Levels, see this IBM Support web page.
The Service Update Management Assistant (SUMA), which can help you automate the taskof checking and downloading operating system downloads, is part of the base operating
system. For more information about the suma command, see this IBM Documentation web
page.
The AIX Operating System can be licensed by using different methods, including the following
examples:򐂰 Stand-alone as AIX Standard Edition
򐂰 With other software tools as part of AIX Enterprise Edition򐂰 As part of the IBM Power Private Cloud Edition software bundle

Subscription licensing model
AIX Standard Edition also is available under a subscription licensing model that provides
access to an IBM program and IBM software maintenance for a specified subscription term(one or three years). The subscription term begins on the start date and ends on the
expiration date, which is reflected in Entitled Systems Support (IBM Enterprise Storage
Server®).
Customers are licensed to run the product through the expiration date of the 1- or 3-year
subscription term. Then, they can renew at the end of the subscription to continue the use
other product. This model provides flexible and predictable pricing over a specific term, withlower up-front costs of acquisition.
Another benefit of this model is that the licenses are customer-number entitled, which means
they are not tied to a specific hardware serial number as with a standard license grant.
Therefore, the licenses can be moved between on-premises and cloud if needed, somethingthat is becoming more of a requirement with hybrid workloads.
The subscription licenses are orderable through IBM configurator. The standard AIX license
grant and monthly term licenses for standard edition are still available.

20

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

1.8.2 IBM i operating system
At announcement, the Power S1014, S1022s, S1022, and S1024 servers support thefollowing minimum levels of IBM i:
򐂰 IBM i 7.5
򐂰 IBM i 7.4 Technology Release 6 or later򐂰 IBM i 7.3 Technology Release 12 or later
Some limitations exist when running the IBM i operating system on the Power S1022s orPower S1022 servers. Virtual I/O by way of VIOS is required, and partitions must be set to“restricted I/O” mode.
The maximum size of the partition also is limited. Up to four cores (real or virtual) per IBM i
partition are supported. Multiple IBM i partitions can be created and run concurrently, andindividual partitions can have up to four cores.
Note: The IBM i operating system is not supported on the Power S1022s model with asingle four-core processor option. For information on new support of the Power S1022s
with two four-core processors see “New IBM Power10 S1022s with Native IBM i Support”
on page 21.
IBM periodically releases maintenance packages (service packs or technology releases) for
the IBM i. For more information about these packages, downloading, and obtaining the
installation packages, see this IBM Support Fix Central web page.
For more information about hardware feature compatibility and the corresponding IBM i
Technology Releases, see this IBM Support web page.

New IBM Power10 S1022s with Native IBM i Support
In October of 2022 IBM announced a new Power10 S1022s configuration utilizing thefour-core processor option. This feature was generally available in December of 2022.
IBM Power now offers a Power S1022s (MTM 9105-22B) configuration with two sockets
populated with 4-core processors (#EPGR) with a maximum of eight cores active. Thisconfiguration is available at a P10 IBM i software tier and will support IBM natively, virtualized,
or as a combination of both.
Multiple IBM i partitions can be created and run concurrently, and there is no partition size
limitation regarding the number of cores. This configuration requires feature code EEPZ for
IBM i support which requires FW1030 or later. Supported operating system levels are IBM i
7.5 TR1 or later, IBM i 7.4 TR7 or later and IBM i 7.3 TR13 or later.
Note: This does not change that IBM i is not supported on the Power S1022s (MTM
9105-22B) configuration with one 4-core processor.

IBM i operating system transfer
IBM i customers can move IBM i entitlements to new Power10 processor-based Scale Out
servers, just as with previous new system, preserving upgrades or replacements if therequired criteria are met.
IBM i license terms and conditions require that IBM i operating system license entitlements
remain with the machine for which they were originally purchased. Under qualifying
conditions, IBM allows the transfer of IBM i processor and user entitlements from one

Chapter 1. IBM Power S1014, S1022s, S1022, and S1024 overview

21

machine to another. This capability helps facilitate machine replacement, server
consolidation, and load rebalancing while protecting a customer’s investment in IBM i
software.
When requirements are met, IBM i license transfer can be configured by using IBM
configurator tools.
The following prerequisites must be met for transfers:
򐂰 The IBM i entitlements are owned by the user’s enterprise.
򐂰 The donor machine and receiving machine are owned by the user’s enterprise.
򐂰 The donor machine was owned in the same user’s enterprise as the receiving machine fora minimum of one year.
򐂰 Current Software Maintenance (SWMA) is on the donor machine. Each software
entitlement that is to be transferred includes SWMA coverage.
򐂰 An electronic Proof of Entitlement (ePoE) exists for the entitlements to be transferred.
򐂰 The donor machine entitlements are for IBM i 5.4 or later.
򐂰 The receiving machine includes activated processors that are available to accommodate
the transferred entitlements.
A charge is incurred for the transfer of IBM i entitlements between servers. Each IBM iprocessor entitlement that is transferred to a target machine includes one year of new SWMA
at no extra charge. Extra years of coverage or 24x7 support are available options for an extra
charge.

IBM i virtual serial numbers
IBM now offers a customer the ability to acquire a Virtual Serial Number (VSN) and assign it
to a logical partition. IBM i software can then be ordered against or transferred to the VSN
instead of being tied to a physical IBM Power machine’s serial number.
Having the IBM i entitlement, keys, and support entitlement on a VSN provides the flexibility
to move the partition to a different Power machine without transferring the entitlement.
Note: VSNs can be ordered in specific countries. For more information, see the local
announcement letters.
With VSNs, each partition can have its own serial number that is not tied to the hardware
serial number. If VSNs are not used, an IBM i partition still defaults to the use of the physicalhost serial number.
In the first phase of VSN deployment, only one partition can use a single VSN at any time;
therefore, multiple IBM i LPARs cannot use the same VSN. In the first phase, VSNs are notsupported within Power Private Cloud (Power Enterprise Pools 2.0) environments.
VSNs are supported for partitions that are running any version of IBM i that is supported on
the Power10 processor-based Scale Out servers, although some other PTFs might berequired.

22

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

IBM i software tiers
The IBM i operating system is licensed per processor core that is used by the operating
system, and by the number of users that are interacting with the system. Different licensing
requirements depend on the capability of the server model and processor performance.
These systems are designated with a software tier that determines the licensing that isrequired for workloads running on each server, as listed in Table 1-9.
Table 1-9 IBM i software tiers for the Power S1014, S1022s, S1022, and S1024
Server model

Processor

IBM i software tierS1014

4-core (#EPG0)

P05

S1014

8-core (#EPG2)

P10

S1022s4-core (#EPGR)

N/Aa

S1022sDual 4-core (#EPGR)

P10b

S1022s8-core (#EPGQ)

P10c

S1022

12-core (#EPG9)

P10c

S1022

16-core (#EPG8)

P10c

S1022

20-core (#EPPGA)

P10c

S1024

12-core (#EPGM)

P20

S1024

16-core (#EPGC)

P30

S1024

24-core (#EPGE)

P30

a. IBM i does not support a single 4-core processor (#EPGR) in the S1022s server.
b. Native IBM i support with dual 4-core processor only. No partition size limitation.
c. IBM i partitions are limited to four cores on the S1022s and S1022 models.

Subscription licensing model for IBM i
In May of 2022, IBM announced the subscription licensing model for IBM i. This provides IBM
i clients with a new method of acquiring IBM i licenses with a monthly cost option. The
subscription option provides a way to acquire new IBM i licenses for a predictable costthrough the length of the contract and also includes SWMA 9x5 support (upgradeable to24x7).
This subscription option provides all the same technical capabilities as the existing IBM ilicense offering and provides the following benefits:– Pay for what you need on a term basis, with IBM Software Subscription and Support(S&S) included in the price.
– One-year, two-year, three-year, four-year, and five-year subscription terms areavailable.
Initially, the subscription option was limited in scope, but announcements since then haveprovided support for all IBM i processor tiers on Power 9 and Power 10 based servers. In
addition, IBM provided the IBM i this subscription term planning insight: “IBM intends to offer
subscription term pricing for the IBM i operating system and Licensed Program Products for
IBM i across the P05 through P30 IBM i software tiers.”
IBM also announced the withdrawal of the ability to acquire new non-expiring IBM ientitlements for the P05 and P10 software tiers effective March 26, 2024. See the withdrawal
letter for more details.

Chapter 1. IBM Power S1014, S1022s, S1022, and S1024 overview

23

1.8.3 Linux operating system distributions
Linux is an open source, cross-platform operating system that runs on numerous platforms
from embedded systems to mainframe computers. It provides an UNIX-like implementation
across many computer architectures.
The Linux distributions that are described next are supported on the Power S1014, S1022s,
S1022, and S1024 server models. Other distributions, including open source releases, canrun on these servers, but do not include any formal Enterprise Grade support.

Red Hat Enterprise LinuxThe latest version of the Red Hat Enterprise Linux (RHEL) distribution from Red Hat is
supported in native Power10 mode, which allows it to access all of the features of thePower10 processor and platform.
At announcement, the Power S1014, S1022s, S1022, and S1024 servers support thefollowing minimum levels of the Red Hat Enterprise Linux operating system:򐂰 Red Hat Enterprise Linux 8.4 for Power LE, or later򐂰 Red Hat Enterprise Linux for SAP with Red Hat Enterprise Linux 8.4 for Power LE, or later򐂰 Red Hat Enterprise Linux 9.0 for Power LE, or later
Red Hat Enterprise Linux is sold on a subscription basis, with initial subscriptions and support
available for one, three, or five years. Support is available directly from Red Hat or IBM
Technical Support Services.
Red Hat Enterprise Linux 8 for Power LE subscriptions cover up to four cores and up to four
LPARs, and can be stacked to cover a larger number of cores or LPARs.
When you order RHEL from IBM, a subscription activation code is automatically published inEnterprise Storage Server. After retrieving this code from Enterprise Storage Server, you use
it to establish proof of entitlement and download the software from Red Hat.

SUSE Linux Enterprise Server
The latest version of the SUSE Linux Enterprise Server distribution of Linux from SUSE is
supported in native Power10 mode, which allows it to access all of the features of thePower10 processor and platform.
At announcement, the Power S1014, S1022s, S1022, and S1024 servers support thefollowing minimum levels of the SUSE Linux Enterprise Server operating system:򐂰 SUSE Linux Enterprise Server 15 Service Pack 3, or later
򐂰 SUSE Linux Enterprise Server for SAP with SUSE Linux Enterprise Server 15 Service
Pack 3, or later
SUSE Linux Enterprise Server is sold on a subscription basis, with initial subscriptions andsupport available for one, three, or five years. Support is available directly from SUSE or fromIBM Technical Support Services.
SUSE Linux Enterprise Server 15 subscriptions cover up to one socket or one LPAR, and canbe stacked to cover a larger number of sockets or LPARs.
When you order SLES from IBM, a subscription activation code is automatically published inEnterprise Storage Server, you use it to establish proof of entitlement and download thesoftware from SUSE.

24

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and IntroductionLinux and Power10 technology
The Power10 specific toolchain is available in the IBM Advance Toolchain for Linux version
15.0, which allows customers and developers to use all new Power10 processor-based
technology instructions when programming. Cross-module function call overhead was
reduced because of a new PC-relative addressing mode.
One specific benefit of Power10 technology is a 10x to 20x advantage over Power9
processor-based technology for AI inferencing workloads because of increased memory
bandwidth and new instructions. One example is the new special purpose-built matrix mathaccelerator (MMA) that was tailored for the demands of machine learning and deep learning
inference. It also supports many AI data types.
Network virtualization is an area with significant evolution and improvements, which benefit
virtual and containerized environments. The following recent improvements were made forLinux networking features on Power10 processor-based servers:
򐂰 SR-IOV allows virtualization of network adapters at the controller level without the need tocreate virtual Shared Ethernet Adapters in the VIOS partition. It is enhanced with virtual
Network Interface Controller (vNIC), which allows data to be transferred directly from thepartitions to or from the SR-IOV physical adapter without transiting through a VIOS
partition.
򐂰 Hybrid Network Virtualization (HNV) allows Linux partitions to use the efficiency andperformance benefits of SR-IOV logical ports and participate in mobility operations, suchas active and inactive Live Partition Mobility (LPM) and Simplified Remote Restart (SRR).
HNV is enabled by selecting a new migratable option when an SR-IOV logical port isconfigured.

Security
Security is a top priority for IBM and our distribution partners. Linux security on IBM Power isa vast topic; however, improvements in the areas of hardening, integrity protection,
performance, platform security, and certifications are introduced with this section.
Hardening and integrity protection deal with protecting the Linux kernel from unauthorized
tampering while allowing upgrading and servicing to the kernel. These topics become evenmore important when in a containerized environment is run with an immutable operating
system, such as RHEL CoreOS, as the underlying operating system for the Red Hat
OpenShift Container Platform.
Performance also is an important security topic because specific hardening mitigation
strategies (for example, against side-channel attacks) can have a significant performance
effect. In addition, cryptography can use significant compute cycles.

1.8.4 Red Hat OpenShift Container Platform
The Red Hat OpenShift Container Platform (OCP) is supported to run on IBM Power servers,
including the Power10 processor-based Scale Out server models. OCP is a container
orchestration and management platform that provides a resilient and flexible environment inwhich to develop and deploy applications. It extends the open source Kubernetes project toprovide an Enterprise grade platform to run and manage workloads that uses Linux container
technology.

Chapter 1. IBM Power S1014, S1022s, S1022, and S1024 overview

25

A Red Hat OpenShift Container Platform cluster consists of several nodes, which can run on
physical or virtual machines. A minimum of three control plane nodes are required to support
the cluster management functions. At least two compute nodes are required to provide thecapacity to run workloads. During installation, another bootstrap node is required to host thefiles that are required for installation and initial setup.
The bootstrap and control plane nodes are all based on the Red Hat Enterprise LinuxCoreOS operating system, which is a minimal immutable container host version of the Red
Hat Enterprise Linux distribution. It and inherits the associated hardware support statements.
The compute nodes can run on Red Hat Enterprise Linux or RHEL CoreOS.
The Red Hat OpenShift Container Platform is available on a subscription basis, with initialsubscriptions and support available for one, three, or five years. Support is available directlyfrom Red Hat or from IBM Technical Support Services. Red Hat OpenShift Container Platform
subscriptions cover two processor cores each, and can be stacked to cover many cores. Only
the compute nodes require subscription coverage.
At announcement, the Power S1014, S1022s, S1022, and S1024 servers support thefollowing minimum levels of the operating systems that are supported for Red Hat OpenShiftContainer Platform:򐂰 Red Hat Enterprise Linux CoreOS 4.9 for Power LE, or later򐂰 Red Hat Enterprise Linux 8.4 for Power LE, or later
Red Hat OpenShift Container Platform 4.9 for IBM Power is the minimum level of the Red Hat
OpenShift Container Platform on the Power10 processor-based Scale Out servers.
When you order Red Hat OpenShift Container Platform from IBM, a subscription activation
code automatically is published in Enterprise Storage Server, you use it to establish proof ofentitlement and download the software from Red Hat.
For more information about running Red Hat OpenShift Container Platform on IBM Power,
see this Red Hat OpenShift Documentation web page.

1.8.5 Virtual I/O Server
The minimum required level of VIOS for the Power S1014, S1022s, S1022 and S1024 server
models is VIOS 3.1.3.21 or later.
IBM regularly updates the VIOS code. For more information, see this IBM Fix Central web
page.

1.8.6 Entitled System Support
IBM’s Enterprise Storage Server web page is available to view and manage Power andStorage software and hardware. In general, most products that are offered by IBM Systems
that are purchased through our IBM Digital Sales representatives or Business Partners areaccessed on this site when the IBM Configurator is used.
The site features the following three main sections:򐂰 My entitled software: Activities are listed that are related to Power and Storage software,
including the ability to download licensed, free, and trial software media, place software
update orders, and manage software keys.

26

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction򐂰 My entitled hardware: Activities are listed related to Power and Storage hardware
including the ability to renew Update Access Keys, buy and use Elastic Capacity on
Demand, assign or buy credits for new and existing pools in a Power Private Cloudenvironment (Enterprise Pools 2.0), download Storage Capacity on-Demand codes, andmanage Hybrid Capacity credits.
򐂰 My inventory: Activities related to Power and Storage inventory including the ability tobrowse software license, software maintenance, and hardware inventory, manage
inventory retrievals by way of Base Composer or generate several types of reports.

1.8.7 Update Access Keys
Since the introduction of the Power8 processor-based servers, IBM uses the concept of an
Update Access Key (UAK) for each server.
When system firmware updates are applied to the system, the UAK and its expiration date arechecked. System firmware updates include a release date. If the release date for the firmware
updates is past the expiration date for the update access key when attempting to apply
system firmware updates, the updates are not processed.
As update access keys expire, they must be replaced by using the Hardware Management
Console (HMC) or the ASMI on the eBMC.
By default, newly delivered systems include an UAK that expires after three years. Thereafter,
the UAK can be extended every six months, but only if a current hardware maintenancecontract exists for that server. The contract can be verified on the Enterprise Storage Server
web page.
Checking the validity and expiration date of the current UAK can be done through the HMC oreBMC graphical interfaces or command-line interfaces. However, the expiration date also canbe displayed by using the suitable AIX or IBM i command.

UAK expiration date by using AIX 7.1
In the case of AIX 7.1, use the following command:
lscfg -vpl sysplanar0 | grep -p "System Firmware"
The output is similar to the output that is shown in Example 1-1 (the Microcode Entitlement
Date represents the UAK expiration date).
Example 1-1 Output of the command to check UAK expiration date by way of AIX 7.1$ lscfg -vpl sysplanar0 | grep -p "System Firmware"
System Firmware:...
Microcode Image.............NL1020_035 NL1020_033 NL1020_035
Microcode Level.............FW1020.00 FW1020.00 FW1020.00
Microcode Build Date........20220527 20220527 20220527
Microcode Entitlement Date..20220515
Hardware Location Code......U9105.42A.XXXXXXX-Y1
Physical Location: U9105.42A.XXXXXXX-Y1

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27

UAK expiration date by using AIX 7.2 and 7.3
In the case of AIX 7.2 and 7.3, the output is slightly different from AIX 7.1. Use the following
command:lscfg -vpl sysplanar0 |grep -p "System Firmware"
The output is similar to the output that is shown in Example 1-2 (the Update Access Key Exp
Date represents the UAK expiration date).
Example 1-2 Output of the command to check UAK expiration date by way of AIX 7.2 and 7.3$ lscfg -vpl sysplanar0 |grep -p "System Firmware"
System Firmware:...
Microcode Image.............NL1020_035 NL1020_033 NL1020_035
Microcode Level.............FW1020.00 FW1020.00 FW1020.00
Microcode Build Date........20220527 20220527 20220527
Update Access Key Exp Date..20220515
Hardware Location Code......U9105.42A.XXXXXXX-Y1
Physical Location: U9105.42A.XXXXXXX-Y1

UAK expiration date by using IBM i
When IBM i is used as an operating system, the status of the UAK can be checked by using
the Display Firmware Status window.
If the update access key expired, proceed to the Enterprise Storage Server web page toreplace your update access key. Figure 1-7 shows the output in the IBM i 7.1 and 7.2
releases. In the 7.3 and 7.4 releases, the text changes to Update Access Key Expiration
Date. The line that is highlighted in Figure 1-7 is displayed whether the system is operating
system managed or HMC managed.

Figure 1-7 Display Firmware Status window

28

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

1.9 Hardware Management Console overview
The HMC can be a hardware or virtual appliance that can be used to configure and manage
your systems. The HMC connects to one or more managed systems and provides capabilities
for the following primary functions:򐂰 Provide systems management functions, including the following examples:
–
–
–
–
–
–
–
–

Power off
Power on
System settings
Capacity on DemandEnterprise Pools
Shared Processor Pools
Performance and Capacity Monitoring
Starting Advanced System Management Interface (ASMI) for managed systems

򐂰 Deliver virtualization management through support for creating, managing, and deleting
Logical Partitions, Live Partition Mobility, Remote Restart, configuring SRIOV, managing
Virtual IO Servers, dynamic resource allocation, and operating system terminals.
򐂰 Acts as the service focal point for systems and supports service functions, including callhome, dump management, guided repair and verify, concurrent firmware updates for
managed systems, and around-the-clock error reporting with Electronic Service Agent for
faster support.
򐂰 Provides appliance management capabilities for configuring network, users on the HMC,
and updating and upgrading the HMC.
We discuss the available HMC offerings next.

1.9.1 HMC 7063-CR2
The 7063-CR2 IBM Power HMC (see Figure 1-8 on page 30) is a second-generation Power
processor-based HMC. It includes the following features:
򐂰 6-core Power9 130W processor chip
򐂰 64 GB (4x16 GB) or 128 GB (4x32 GB) of memory
򐂰 1.8 TB of internal disk capacity with RAID1 protection
򐂰 4-ports 1 Gbps Ethernet (RJ-45), 2-ports 10 Gbps Ethernet (RJ-45), two USB 3.0 ports(front side) and two USB 3.0 ports (rear side), and 1 Gbps IPMI Ethernet (RJ-45)
򐂰 Two 900W power supply units򐂰 Remote Management Service: IPMI port (OpenBMC) and Redfish application
programming interface (API)򐂰 Base Warranty is 1-year 9x5 with available optional upgrades
A USB Smart Drive is not included.
Note: The recovery media for V10R1 is the same for 7063-CR2 and 7063-CR1.

Chapter 1. IBM Power S1014, S1022s, S1022, and S1024 overview

29

Figure 1-8 HMC 7063-CR2

The 7063-CR2 is compatible with flat panel console kits 7316-TF3, TF4, and TF5.
Note: The 7316-TF3 and TF4 were withdrawn from marketing.

1.9.2 Virtual HMC
Initially, the HMC was sold only as a hardware appliance, including the HMC firmware
installed. However, IBM extended this offering to allow the purchase of the hardware
appliance or a virtual appliance that can be deployed on ppc64le architectures or x86
platforms.
Any customer with a valid contract can download the HMC from the Enterprise Storage
Server web page, or it can be included within an initial Power S1014, S1022s, S1022, orS1024 order.
The virtual HMC supports the following hypervisors:򐂰 On x86 processor-based servers:
– KVM
– Xen
– VMware򐂰 On Power processor-based servers: IBM PowerVM®
The following minimum requirements must be met to install the virtual HMC:򐂰򐂰򐂰򐂰

16 GB of Memory
4 virtual processors
2 network interfaces (maximum 4 allowed)
1 disk drive (500 GB available disk drive)

For an initial Power S1014, S1022s, S1022 or S1024 order with the IBM configurator(e-config), HMC virtual appliance can be found by selecting add software → Other System
Offerings (as product selections) and then:򐂰 5765-VHP for IBM HMC Virtual Appliance for Power V10
򐂰 5765-VHX for IBM HMC Virtual Appliance x86 V1030

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

For more information and an overview of the Virtual HMC, see this web page.
For more information about how to install the virtual HMC appliance and all requirements, see
this IBM Documentation web page.

1.9.3 BMC network connectivity rules for 7063-CR2 HMC
The 7063-CR2 HMC features a baseboard management controller (BMC), which is a
specialized service processor that monitors the physical state of the system by using sensors.
OpenBMC that is used on 7063-CR2 provides a graphical user interface (GUI) that can beaccessed from a workstation that includes network connectivity to the BMC. This connection
requires an Ethernet port to be configured for use by the BMC.
The 7063-CR2 provides two network interfaces (eth0 and eth1) for configuring network
connectivity for BMC on the appliance.
Each interface maps to a different physical port on the system. Different management tools
name the interfaces differently. The HMC task Console Management → Console
Settings → Change BMC/IPMI Network Settings modifies only the Dedicated interface.
The BMC ports are listed in Table 1-10.
Table 1-10 BMC ports
Management tool

Logical port

Shared/DedicatedCR2 physical port

OpenBMC UI

eth0

Sharedeth0

OpenBMC UI

eth1

Dedicated

Management port only

ipmitoollan1

Sharedeth0

ipmitoollan2

Dedicated

Management port only

HMC task (change
BMC/IPMI Network
settings

lan2

Dedicated

Management port only

Figure 1-9 shows the BMC interfaces of the HMC.

Figure 1-9 BMC interfaces

Chapter 1. IBM Power S1014, S1022s, S1022, and S1024 overview

31

The main difference is the shared and dedicated interface to the BMC can coexist. Each has
its own LAN number and physical port. Ideally, the customer configures one port, but both canbe configured. The rules for connecting Power Systems to the HMC remain the same as forprevious versions.

1.9.4 High availability HMC configuration
For the best manageability and redundancy, a dual HMC configuration is suggested. Thisconfiguration can be two hardware appliances, or one hardware appliance and one virtual
appliance or two virtual appliances.
The following requirements must be met:
򐂰 Two HMCs are at the same version.
򐂰 The HMCs use different subnets to connect to the BMCs.
򐂰 The HMCs can communicate with the servers’ partitions over a public network to allow for
full synchronization and function.

1.9.5 HMC code level requirements: Power S1014, S1022s, S1022, and S1024
The minimum required HMC version for the Power S1014, S1022s, S1022, and S1024 are
V10R1.1020. V10R1 is supported on 7063-CR1, 7063-CR2, and Virtual HMC appliances
only. It is not supported on 7042 machine types. HMC with V10R1 cannot manage POWER7processor-based systems.
An HMC that is running V10R1 M1020 includes the following features:
򐂰 HMC OS Secure Boot support for the 7063-CR2 appliance򐂰 Ability to configure login retries and suspended time and support for inactivity expiration inpassword policy
򐂰 Ability to specify HMC location and data replication for groups
򐂰 VIOS Management Enhancements:– Prepare for VIOS Maintenance:•

Validation for redundancy for the storage and network that is provided by VIOS tocustomer partitions•

Switch path of redundant storage and network to start failover•

Roll back to original configuration on failure of prepare•

Audit various validation and prepare steps performed•

Report any failure that is seen during prepare– Command Line and Scheduled operations support for VIOS backup or restore VIOS
Configuration and SSP Configuration– Option to back up or restore Shared Storage Pool configuration in HMC– Options to import or export the backup files to external storage– Option to fail over all Virtual NICs from one VIOS to another򐂰 Support 128 and 256 MB LMB sizes
򐂰 Automatically choose the fastest network for LPM memory transfer

32

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction򐂰 HMC user experience enhancements:––––

Usability and performance
Help connect global search
Quick view of serviceable events
More progress information for UI wizards

򐂰 Allow LPM/Remote Restart when virtual optical device is assigned to a partition
򐂰 UAK support
򐂰 Scheduled operation function: In the Electronic Service Agent, a new feature that allows
customers to receive message alerts only if scheduled operations fail (see Figure 1-10).

Figure 1-10 HMC alert feature

Log retention of the HMC audit trail also is increased.

1.9.6 HMC currency
In recent years, cybersecurity emerged as a national security issue and an increasingly
critical concern for CIOs and enterprise IT managers.
The IBM Power processor-based architecture always ranked highly in terms of end-to-end
security, which is why it remains a platform of choice for mission-critical enterprise workloads.
A key aspect of maintaining a secure Power environment is ensuring that the HMC (or virtual
HMC) is current and fully supported (including hardware, software, and Power firmware
updates).
Outdated or unsupported HMCs represent a technology risk that can quickly and easily be
mitigated by upgrading to a current release.

1.10 IBM Power solutions
The Power10 processor-based, scale-out servers are delivered cloud-enabled with integrated
PowerVM Enterprise capabilities.
The IBM Power Private Cloud Edition V1.8 is a complete package that adds flexible licensing
models in the cloud era. It helps you to rapidly deploy multi-cloud infrastructures with acompelling set of cloud-enabled capabilities. The Power Private Cloud Edition primarily
provides value for clients that use AIX and Linux on Power, with simplified licensing models
and advanced features.

Chapter 1. IBM Power S1014, S1022s, S1022, and S1024 overview

33

The IBM Private Cloud Edition (5765-ECB) includes:򐂰򐂰򐂰򐂰IBM PowerSC 2.1
IBM Cloud® PowerVC for Private Cloud
IBM VM Recovery Manager DR
IBM Cloud Management Console for IBM PowerIf you use IBM AIX as a primary OS, a specific offering is available: IBM Private Cloud Edition
with AIX 7 1.8.0 (5765-CBA). The offering includes:
򐂰
򐂰
򐂰
򐂰
򐂰

IBM AIX 7.3 or IBM AIX 7.2
IBM PowerSC 2.1
IBM Cloud PowerVC for Private Cloud
IBM VM Recovery Manager DR
IBM Cloud Management Console for IBM Power1.10.1 IBM PowerSC 2.1
IBM PowerSC 2.1 (5765-SC2) provides a security and compliance solution that is optimized
for virtualized environments on IBM Power running IBM PowerVM and IBM AIX, IBM i, orLinux on Power. Security control and compliance are some of the key components that areneeded to defend virtualized data centers and a cloud infrastructure against evolving data
security threats.
The PowerSC 2.1 product contains the following enhancements:
򐂰 Blocklisting anti-virus feature to allow selective, on-demand hash searches acrossendpoints that are managed through PowerSC.
򐂰 Linux on Intel support for PowerSC endpoints, including Multi-Factor Authentication on
Power (MFA).
򐂰 Single sign-on (SSO) support
Users can log in to PowerSC through SSO with their OpenID Connect (OIDC) Enterprise
identity provider and MFA, which enables integration with any application user interface(UI).
򐂰 MFA support for RSA web API
User MFA includes RSA through the web API and no longer uses the access control entry(ACE) protocol.
򐂰 User-defined alt-disk for technology level (TL) and service pack (SP) updates
Users can specify alt-disk through Trusted Network Connect (TNC) for TL and SP updates
on AIX endpoints.
For more information, see this Announcement letter.

1.10.2 IBM PowerSC Multi-Factor Authentication
IBM PowerSC Multi-Factor Authentication (MFA) provides alternative authentication
mechanisms for systems that are used with RSA SecurID-based authentication systems, andcertificate authentication options, such as Common Access Card (CAC) and Personal
Identification Verification (PIV) cards. IBM PowerSC MFA allows the use of alternative
authentication mechanisms instead of the standard password.
You can use IBM PowerSC MFA with various applications, such as Remote Shell (RSH),
Telnet, and Secure Shell (SSH).

34

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

IBM PowerSC Multi-Factor Authentication raises the level of assurance of your mission-criticalsystems with a flexible and tightly integrated MFA solution for IBM AIX and Linux on Powervirtual workloads that are running on Power servers.
IBM PowerSC MFA is part of the PowerSC 2.1 software offering; therefore, it also is includedin the IBM Power Private Cloud Edition software bundle.
For more information, see this Announcement Letter.

1.10.3 IBM Cloud PowerVC for Private Cloud
IBM PowerVC for Private Cloud (PowerVC for Private Cloud) works with IBM Power
Virtualization Center to provide an end-to-end cloud solution. PowerVC for Private Cloud
allows you to provision workloads and manage virtual images.
With PowerVC for Private Cloud, you can perform several operations, depending on your role
within a project.
Administrators can perform the following tasks:
򐂰 Create projects and assign images to projects to give team-specific access to images
򐂰 Set policies on projects to specify default virtual machine expiration, and so on
򐂰 Authorize users to projects
򐂰 Create expiration policies to reduce abandoned virtual machines򐂰 Specify which actions require approvals and approving requests
򐂰 Create, edit, delete, and deploy templates򐂰 Deploy an image from a template򐂰 Approve or deny user requests
򐂰 Perform life-cycle operations on virtual machines, such as capture, start, stop, delete,resume, and resize򐂰 Monitor usage (metering) data across the project or per user
Users can perform the following tasks on resources to which they are authorized. Someactions might require administrator approval. When a user tries to perform a task for whichapproval is required, the task moves to the request queue before it is performed (or rejected):򐂰 Perform life-cycle operations on virtual machines, such as capture, start, stop, delete,resume, and resize򐂰 Deploy an image from a deploy template򐂰 View and withdraw outstanding requests
򐂰 Request virtual machine expiration extension
򐂰 View their own usage data

PowerVC version 2.0.0 UIIBM Power Virtualization Center version 2.0.0 introduces an all new user interface that isbased on the Carbon framework. Carbon is an open source design system from IBM for
products and digital experiences. With the IBM Design Language as its foundation, thesystem consists of working code, design tools and resources, human interface guidelines,
and a vibrant community of contributors.

Chapter 1. IBM Power S1014, S1022s, S1022, and S1024 overview

35

IBM Power Virtualization Center version 2.0.0 features a new UI, and many new features andenhancements. IBM listens to our client requirements and implements them along with ourbenchmark innovation strategies that take PowerVC to the next level every release.
Because IBM Power Virtualization Center is built on the OpenStack technology, you mightsee some terminology in messages or other text that is not the same as you might see
elsewhere in PowerVC. Some terminology also might be used that can be different from what
you are used to seeing in other IBM Power software products.

Feature support for PowerVC editions
PowerVC offers different functions, depending on the edition that is installed.
IBM Cloud PowerVC for Private Cloud includes all the functions of the PowerVC Standard
Edition plus the following features:
򐂰 A self-service portal that allows the provisioning of new VMs without direct systemadministrator intervention. An option is for policy approvals for the requests that arereceived from the self-service portal.
򐂰 Templates can be deployed that simplify cloud deployments.
򐂰 Cloud management policies are available that simplify managing cloud deployments.
򐂰 Metering data is available that can be used for chargeback.
For more information, see this Announcement Letter.

1.10.4 IBM VM Recovery Manager DR
IBM VM Recovery Manager DR is an automated DR solution that enables Power users toachieve low recovery times for both planned and unplanned outages. It introduces support for
more storage replication solutions and for an extra guest operating system, which broadens
the offering’s applicability to a wider range of client requirements.
IBM VM Recovery Manager DR offers support for:
򐂰 IBM i as a guest operating system, which adds to the current support for IBM AIX andLinux򐂰 IBM DS8000® Global Mirror
򐂰 IBM SAN Volume Controller and IBM Storwize® Metro and Global Mirror as used in IBM
FlashSystem® storage arrays
򐂰 EMC Symmetrix Remote Data Facility (SRDF) synchronous replication
򐂰 Hitachi Virtual Storage Platform (VSP) G1000 and Hitachi VSP G400
򐂰 Boot device selection for IBM Power8 and later processor-based systems
For more information, see this Announcement Letter.

36

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

1.10.5 IBM Cloud Management Console
IBM Cloud Management Console for Power (CMC) runs as a hosted service in the IBM
Cloud. It provides a view of the entire IBM Power estate that is managed by a customer,
covering traditional and private cloud deployments of workloads.
The CMC interface collates and presents information about the IBM Power hardware
environment and the virtual machines that are deployed across that infrastructure. The CMC
provides access to tools for:
򐂰
򐂰
򐂰
򐂰
򐂰

Monitor the status of your IBM Power inventory
Access insights from consolidated logging across all workloads
Monitor the performance and see use trends across the estate
Perform patch planning for hardware, operating systems, and other software
Manage the use and credits for a Power Private Cloud environment

Data is collected from on-premises HMC devices by using a secure cloud connector
component. This configuration ensures that the CMC provides accurate and current
information about your IBM Power environment.
For more information, see IBM Power Systems Private Cloud with Shared Utility Capacity:
Featuring Power Enterprise Pools 2.0, SG24-8478.

1.11 IBM Power platform modernization
Cloud capabilities are a prerequisite for the use of enterprise-level IT resources. In addition to
the Power Private Cloud Edition offering that is described in 1.10, “IBM Power solutions” onpage 33, a rich infrastructure around IBM Power is available to help modernize services withthe strategic initiatives of your business.
The most important products are:
򐂰 IBM Power Virtual Servers
򐂰 Red Hat OpenShift Container Platform for Power1.11.1 IBM Power Virtual Servers
IBM Power Virtual Server (PowerVS) on IBM Cloud is an infrastructure as a service (IaaS)
offering that you can use to deploy a virtual server, also known as a logical partition (LPAR),in a matter of minutes.
Power clients who often relied on an on-premises only infrastructure can now quickly andeconomically extend their Power IT resources into the cloud. The use of IBM Power VirtualServer on IBM Cloud is an alternative to the large capital expense or added risk whenreplatforming and moving your essential workloads to another public cloud.
PowerVS on IBM Cloud integrates your IBM AIX and IBM i capabilities into the IBM Cloudexperience, which means you get fast, self-service provisioning, flexible management
on-premises and off, and access to a stack of enterprise IBM Cloud services all with
pay-as-you-use billing that lets you easily scale up and out.

Chapter 1. IBM Power S1014, S1022s, S1022, and S1024 overview

37You can quickly deploy an IBM Power Virtual Server on IBM Cloud instance to meet yourspecific business needs. With IBM Power Virtual Server on IBM Cloud, you can create ahybrid cloud environment that allows you to easily control workload demands.
For more information, see this IBM Cloud Docs web page.

1.11.2 Red Hat OpenShift Container Platform for PowerRed Hat OpenShift Container Platform for Power (5639-OCP) provides a secure,enterprise-grade platform for on-premises, private platform-as-a-service (PaaS) clouds on
IBM Power servers. It brings together industry-leading container orchestration from
Kubernetes, advanced application build and delivery automation, and Red Hat EnterpriseLinux certified containers for Power.
Red Hat OpenShift Container Platform brings developers and IT operations together with acommon platform. It provides applications, platforms, and services for creating and delivering
cloud-native applications and management so IT can ensure that the environment is secureand available.
Red Hat OpenShift Container Platform for Power provides enterprises the same functions as
the Red Hat OpenShift Container Platform offering on other platforms. Key features include:򐂰 A self-service environment for application and development teams.
򐂰 Pluggable architecture that supports a choice of container run times, networking, storage,
Continuous Integration/Continuous Deployment (CI-CD), and more.
򐂰 Ability to automate routine tasks for application teams.
Red Hat OpenShift Container Platform subscriptions are offered in two core increments thatare designed to run in a virtual guest.
For more information, see 5639-RLE Red Hat Enterprise Linux for Power, little endian V7.0.

1.11.3 Hybrid Cloud Management Edition
Many enterprises continue to develop hybrid cloud environments as they host many of theircore business workloads on-premises while creating or migrating newer workloads to public
cloud or private cloud environments.
Managing these environments can be a daunting task. Organizations need the right tools totackle the challenges that are posed by these heterogeneous environments to accomplish
their objectives.
Collectively, the capabilities that are listed in this section work well together to create aconsistent management platform between client data centers, public cloud providers, andmultiple hardware platforms (fully inclusive of IBM Power), all of which provide all of thenecessary elements for a comprehensive hybrid cloud platform.
The following capabilities are available:
򐂰
򐂰
򐂰
򐂰
򐂰
򐂰

38

IBM Cloud Pak® for Watson AIOps
IBM Observability by Instana®
IBM Turbonomic®
Red Hat Advanced Cluster Management for Kubernetes (RHACM)
IBM Power servers
IBM Power Virtual Server

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

Chapter 1. IBM Power S1014, S1022s, S1022, and S1024 overview

39

40

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

2

Chapter 2.

Architecture and technicaloverview
This chapter describes the overall system architecture for the Power10 processor-based
scale-out servers IBM Power S1014 (9105-41B), IBM Power S1022s (9105-22B),
IBM Power S1022 (9105-22A), and IBM Power S1024 (9105-42A).
This chapter includes the following topics:
򐂰
򐂰
򐂰
򐂰
򐂰

2.1, “Overview” on page 42
2.2, “IBM Power10 processor” on page 46
2.3, “Memory subsystem” on page 75
2.4, “Internal I/O subsystem” on page 90
2.5, “Enterprise Baseboard Management Controller” on page 99© Copyright IBM Corp. 2022.

41

2.1 Overview
All scale-out servers share a common system planar design that provides the physicalresources for the following features and options:򐂰 Two sockets to support 1- or 2-socket configurations
򐂰 32 physical slots to accommodate memory modules of various capacity specifications
򐂰 10 physical slots to support PCI Express (PCIe) adapter cards
򐂰 One physical slot that is dedicated to the enterprise baseboard management controller(eBMC)
򐂰 One physical internal connector to hold the system’s Trusted Platform Module (TPM) card򐂰 Six open coherent accelerator processor interface (OpenCAPI) ports
򐂰 Two internal receptacles to hold the voltage regulator modules (VRMs) for configured
sockets
The Power10 processor-based scale-out servers introduce two new Power10 processor
module packages. System planar sockets of a scale-out server are populated with dual-chipmodels (DCMs) or entry single chip modules (eSCMs).
The DCM module type combines two Power10 processor chips in a tightly integrated unit andeach chip contributes core, memory interface, and PCIe interface resources.
The eSCM also consists of two Power10 chips, but differs from the DCM by the fact that coreand memory resources are provided by only one (chip-0) of the two chips. The otherprocessor chip (chip-1) on the eSCM only facilitates access to more PCIe interfaces,
essentially a switch.
Figure 2-1 on page 43 shows a logical diagram of Power S1022 and Power S1024 in a
2-socket DCM configuration.
Figure 2-1 on page 43 also shows the following components:
򐂰 All interface ports (OP) that are used for intra-DCM and inter-DCM chip-to-chipconnections
򐂰 Open memory interfaces (OMIs), which includes the location codes for the associated 32
DIMM slots
򐂰 OpenCAPI connectors
򐂰 PCIe slots (C0 - C4 and C6 - C11) and their respective number of PCIe lanes򐂰 eBMC card in slot C5 and all available 1 Gbps Ethernet and USB ports
The relevant busses and links are labeled with their respective speeds.

42

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

P0-C19 DDR4 Differential DIMM OMI0A
P0-C20 DDR4 Differential DIMM OMI0B

P0-C21 DDR4 Differential DIMM OMI1A
P0-C40 DDR4 Differential DIMM OMI1B

P0-C41 DDR4 Differential DIMM OMI3A
P0-C42 DDR4 Differential DIMM OMI3B

8 OMI links@ 32 Gbps
OpenCAPI x8 port @ 25 Gbps

OpenCAPI SlimSAS connector

OpenCAPI SlimSAS connector

E0

C4 - PCIe Gen4 x16 or PCIe Gen5 x8 FHHL slot

E1

C3 - PCIe Gen4 x16 or PCIe Gen5 x8 FHHL slot

DCM-1
P2 / Chip-0
OP7

E0

OP3A

OP7

DCM-0
P0 / Chip-0

C11 - PCIe Gen5 x8 FHHL slot w/ x16 connectors

OMI1

SMP 2 x9
@ 32 Gbps

OMI0

OP4

E1

OMI2

OMI3

OMI0

OMI2

OMI1

C10 - PCIe Gen4 x16 or PCIe Gen5 x8 FHHL slot

OP3A
OP3B

OMI3

OpenCAPI SlimSAS connector

OP4

1 GbE Controller

OP4

OP1

USB 3.0 (rear)

SMP 2 x9
@ 32 Gbps

OP4

OP1

Host USB 3.0
OP7

E1
OMI4

OP7
OMI5

OP0A
OP0B

SMP 2 x9
@ 32 Gbps

C2 - PCIe Gen5 x8 FHHL slot w/ x16 connectors
C1 - PCIe Gen4 x8 FHHL slot w/ x16 connectors

C0 - PCIe Gen4 x16 or PCIe Gen5 x8 FHHL slot

OP0B
OpenCAPI SlimSAS connector

8 OMI links@ 32 Gbps
P0-C18 DDR4 Differential DIMM OMI4A
P0-C17 DDR4 Differential DIMM OMI4B

P0-C37 DDR4 Differential DIMM OMI6A
P0-C36 DDR4 Differential DIMM OMI6B
P0-C16 DDR4 Differential DIMM OMI5A
P0-C35 DDR4 Differential DIMM OMI5B

P0-C34 DDR4 Differential DIMM OMI7A
P0-C33 DDR4 Differential DIMM OMI7B

OpenCAPI x8 ports @ 25 Gbps

OpenCAPI x8 port @ 25 Gbps
8 OMI links@ 32 Gbps
P0-C25 DDR4 Differential DIMM OMI4A
P0-C26 DDR4 Differential DIMM OMI4B

OpenCAPI SlimSAS connector

P0-C46 DDR4 Differential DIMM OMI6B
P0-C48 DDR4 Differential DIMM OMI5A
P0-C43 DDR4 Differential DIMM OMI5B

OpenCAPI SlimSAS connector

OP6

DCM-1
P3 / Chip-1

OMI7

C6 - OpenCAPI only FHHL slot w/ x16 connectors

E0

E0

OP6

P0-C47 DDR4 Differential DIMM OMI6A

C8 - PCIe Gen4 x8 FHHL slot w/ x16 connectors

OMI7

C9 - PCIe Gen5 x8 FHHL slot w/ x16 connectors

DCM-0
P1 / Chip-1

OMI6

E1

C7 - PCIe Gen5 x8 FHHL slot w/ x16 connectors

OMI5

USB 3.0 (front)
RDX (internal)

SMP 2 x9
@ 32 Gbps

1 GbE Controller

SMP 2 x9
@ 32 Gbps

RJ45 (rear)

SMP 2 x9
@ 32 Gbps

BMC USB / UPS (rear)

OP6

OP2

OP6

OP2
eBMC
Chip

P0-C44 DDR4 Differential DIMM OMI7A
P0-C45 DDR4 Differential DIMM OMI7B

BMC Display Port (rear)

OMI4

RJ45 (rear)

OMI6

C5

P0-C38 DDR4 Differential DIMM OMI2A
P0-C39 DDR4 Differential DIMM OMI2B

P0-C12 DDR4 Differential DIMM OMI0A
P0-C13 DDR4 Differential DIMM OMI0B

P0-C31 DDR4 Differential DIMM OMI3A
P0-C30 DDR4 Differential DIMM OMI3B

P0-C27 DDR4 Differential DIMM OMI1A
P0-C23 DDR4 Differential DIMM OMI1B
P0-C28 DDR4 Differential DIMM OMI2A
P0-C29 DDR4 Differential DIMM OMI2B

8 OMI links@ 32 Gbps
OpenCAPI x8 ports @ 25 Gbps

Figure 2-1 Logical diagram of Power S1022 or Power S1024 servers in 2-socket configurations

The logical diagram of Power S1022 and Power S1024 1-socket configurations can be
deduced by conceptually omitting the second socket (DCM-1). The number of memory slots
and PCIe slots is reduced by half if only one socket (DCM-0) is populated.
The logical architecture of a 2-socket Power S1022s configuration is shown in Figure 2-2 onpage 44.
Unlike the Power S1022 and Power S1024 servers, the sockets do not host DCM modules;
instead, they are occupied by eSCM models. This configuration implies that the number ofactive memory interfaces decreases from 16 to 8, the number of available memory slots
decreases from 32 to 16, and all memory DDIMMs are connected to the first Power10 chip
(chip-0) of each eSCM.

Chapter 2. Architecture and technical overview

43

OMI0

OMI2

OMI1

E0

C4 - PCIe Gen4 x16 or PCIe Gen5 x8 FHHL slot

E1

C3 - PCIe Gen4 x16 or PCIe Gen5 x8 FHHL slot

eSCM-1P2 / Chip-0
OP7

OP4

OP1

OP4

OP6
SMP 2 x9
@ 32 Gbps

SMP 2 x9
@ 32 Gbps

1 GbE Controller

USB 3.0 (rear)

OP2

OP6

SMP 2 x9
@ 32 Gbps

OP2
eBMC
Chip

SMP 2 x9
@ 32 Gbps

BMC USB / UPS (rear)USB 3.0 (front)
RDX (internal)

OP7

1 GbE Controller

BMC Display Port (rear)

RJ45 (rear)

SMP 2 x9
@ 32 Gbps

eSCM-0P0 / Chip-0
E0

RJ45 (rear)

OMI3

OP4

E1

C11 - PCIe Gen5 x8 FHHL slot w/ x16 connectors
C5

8 OMI links@ 32 Gbps

OMI0

OMI1

OMI2

OMI3

C10 - PCIe Gen4 x16 or PCIe Gen5 x8 FHHL slot

P0-C19 DDR4 Differential DIMM OMI0A
P0-C20 DDR4 Differential DIMM OMI0B

P0-C21 DDR4 Differential DIMM OMI1A
P0-C40 DDR4 Differential DIMM OMI1B
P0-C38 DDR4 Differential DIMM OMI2A
P0-C39 DDR4 Differential DIMM OMI2B
P0-C41 DDR4 Differential DIMM OMI3A
P0-C42 DDR4 Differential DIMM OMI3B

P0-C12 DDR4 Differential DIMM OMI0A
P0-C13 DDR4 Differential DIMM OMI0B

P0-C27 DDR4 Differential DIMM OMI1A
P0-C23 DDR4 Differential DIMM OMI1B
P0-C28 DDR4 Differential DIMM OMI2A
P0-C29 DDR4 Differential DIMM OMI2B
P0-C31 DDR4 Differential DIMM OMI3A
P0-C30 DDR4 Differential DIMM OMI3B

8 OMI links@ 32 Gbps

OP1

OP4

Host USB 3.0
E1

C7 - PCIe Gen5 x8 FHHL slot w/ x16 connectors
C9 - PCIe Gen5 x8 FHHL slot w/ x16 connectors
C8 - PCIe Gen4 x8 FHHL slot w/ x16 connectors

E0

eSCM-0SwitchP1 / Chip-1

OP7

OP6

OP6

SMP 2 x9
@ 32 Gbps

OP7

eSCM-1
SwitchP3 / Chip-1

E0E1

C2 - PCIe Gen5 x8 FHHL slot w/ x16 connectors
C1 - PCIe Gen4 x8 FHHL slot w/ x16 connectors

C0 - PCIe Gen4 x16 or PCIe Gen5 x8 FHHL slot

Figure 2-2 Logical diagram of the Power S1022s server in a 2-socket configuration

Also, the eSCM-based systems do not support OpenCAPI ports. However, the PCIe
infrastructure of the Power S1022s is identical to PCIe layout of the DCM-based Power S1022
and Power S1024 servers and the number and the specification of the PCIe slots is the same.
The logical diagram of Power S1022s 1-socket configurations can be deducted byconceptually omitting the second socket (eSCM-1) from the logical diagram. The number ofmemory slots and the number of PCIe slots is reduced by half if only one socket (eSCM-0) is
populated.
By design the Power S1014 is a 1-socket server. The 4-core and 8-core modules are basedon eSCM modules and the design is shown in Figure 2-3 on page 45 while the 24-core
module is DCM based and its design is shown in Figure 2-4 on page 45. Four memory
interfaces and the associated eight DDIMM slots are present in Chip-0 for both the eSCM andthe DCM modules to provide main memory access and memory capacity. Similar to the one
socket implementation in the two socket servers, the number of available PCIe slots is
reduced to five, which is half of the PCIe slots that are offered by Power10 scale-out serversin 2-socket configurations.

44

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

Figure 2-3 Logical diagram of the Power S1014 server with eSCM

Figure 2-4 Logical diagram of the Power S1014 server with DCM

Chapter 2. Architecture and technical overview

45

Note: The bandwidths that are provided throughout the chapter are theoretical maximums
that are used for reference. The speeds that are shown are at an individual component
level. Multiple components and application implementation are key to achieving the best
performance. Always conduct the performance sizing at the application workload
environment level and evaluate performance by using real-world performancemeasurements and production workloads.

Restriction: When using the 24-core processor option in the S1014 the following adapters
are not supported in slots p7 and p8:
–
–
–
–
–
–
–
–

EJ14 - PCIe3 12GB Cache RAID PLUS SAS Adapter Quad-port 6Gb x8
EJ0L - PCIe3 12GB Cache RAID SAS Adapter Quad-port 6Gb x8
EJ0J - PCIe3 RAID SAS Adapter Quad-port 6Gb x8
EJ10 - PCIe3 SAS Tape/DVD Adapter Quad-port 6Gb x8
EN1E - PCIe3 16Gb 4-port Fibre Channel Adapter
EN1C - PCIe3 16Gb 4-port Fibre Channel Adapter
EJ32 - PCIe3 Crypto Coprocessor no BSC 4767
EJ35 - PCIe3 Crypto Coprocessor no BSC 4769

2.2 IBM Power10 processor
The IBM Power10 processor was introduced to the general public on 17 August 2020 at the32nd HOT CHIPS1 semiconductor conference. At that meeting, the new capabilities andfeatures of the latest POWER processor microarchitecture and the Power Instruction Set
Architecture (ISA) v3.1B were revealed and categorized according to the following Power10
processor design priority focus areas:򐂰 Data plane bandwidthTerabyte per second signaling bandwidth on processor functional interfaces, petabyte
system memory capacities, 16-socket symmetric multiprocessing (SMP) scalability, andmemory clustering and memory inception capability.
򐂰 Powerful enterprise core
New core micro-architecture, flexibility, larger caches, and reduced latencies.
򐂰 End-to-end security
Hardware-enabled security features that are co-optimized with PowerVM hypervisor
support.
򐂰 Energy efficiency
Up to threefold energy-efficiency improvement in comparison to Power9 processor
technology.
򐂰 Artificial intelligence (AI)-infused core
A 10-20x matrix math performance improvement per socket compared to the Power9
processor technology capability.

1

46

https://hotchips.org/

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

The remainder of this section provides more specific information about the Power10
processor technology as it is used in the Power S1014, S1022s, S1022, and S1024 server.
The IBM Power10 Processor session material as presented at the 32nd HOT CHIPS
conference is available at this web page.

2.2.1 Power10 processor overview
The Power10 processor is a superscalar symmetric multiprocessor that is manufactured incomplimentary metal-oxide-semiconductor (CMOS) 7 nm lithography with 18 layers of metal.
The processor contains up to 15 cores that support eight simultaneous multithreading (SMT8)
independent execution contexts.
Each core has private access to 2 MB L2 cache and local access to 8 MB of L3 cache
capacity. The local L3 cache region of a specific core also is accessible from all other coreson the processor chip. The cores of one Power10 processor share up to 120 MB of latency
optimized nonuniform cache access (NUCA) L3 cache.
The processor supports the following three distinct functional interfaces that all can run with asignaling rate of up to 32 Gigatransfers per second (GTps):򐂰 Open memory interface
The Power10 processor has eight memory controller unit (MCU) channels that support
one open memory interface (OMI) port with two OMI links each2. One OMI link aggregateseight lanes that are running at 32 GTps and connects to one memory buffer-based
differential DIMM (DDIMM) slot to access main memory.
Physically, the OMI interface is implemented in two separate die areas of eight OMI links
each. The maximum theoretical full-duplex bandwidth aggregated over all 128 OMI lanes
is 1 TBps.
򐂰 SMP fabric interconnect (PowerAXON)
A total of 144 lanes are available in the Power10 processor to facilitate the connectivity toother processors in a symmetric multiprocessing (SMP) architecture configuration. EachSMP connection requires 18 lanes, eight data lanes plus one spare lane per direction(2 x(8+1)). In this way, the processor can support a maximum of eight SMP connections
with a total of 128 data lanes per processor. This configuration yields a maximum
theoretical full-duplex bandwidth aggregated over all SMP connections of 1 TBps.
The generic nature of the interface implementation also allows the use of 128 data lanes
to potentially connect accelerator or memory devices through the OpenCAPI protocols.
Also, it can support memory cluster and memory interception architectures.
Because of the versatile characteristic of the technology, it is also referred to as

PowerAXON interface (Power A-bus/X-bus/OpenCAPI/Networking3). The OpenCAPI andthe memory clustering and memory interception use cases can be pursued in the future
and as of this writing are not used by available technology products.

2

The OMI links are also referred to as OMI subchannels.

3 A-busses (between CEC drawers) and X-busses (within CEC drawers) provide SMP fabric ports.

Chapter 2. Architecture and technical overview

47򐂰 PCIe Version 5.0 interface
To support external I/O connectivity and access to internal storage devices, the Power10
processor provides differential Peripheral Component Interconnect Express version 5.0
interface busses (PCIe Gen 5) with a total of 32 lanes.
The lanes are grouped in two sets of 16 lanes that can be used in one of the following
configurations:
–
–
–
–
–

1 x16 PCIe Gen 4
2 x8 PCIe Gen 4
1 x8, 2 x4 PCIe Gen 4
1 x8 PCIe Gen 5, 1 x8 PCIe Gen 4
1 x8 PCIe Gen 5, 2 x4 PCIe Gen 4

Figure 2-5 shows the Power10 processor chip with several functional units labeled. A total of
16 SMT8 processor cores are shown, but only 4-, 6-, 8-,10-, or 15-core processor options areavailable for Power10 processor-based scale-out server configurations.

Figure 2-5 The Power10 processor chip48

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

Important Power10 processor characteristics are listed in Table 2-1.
Table 2-1 Summary of the Power10 processor chip and processor core technology
Technology

Power10 processor

Processor die size

602 mm2

Fabrication technology򐂰򐂰Maximum processor cores per chip

15

Maximum execution threads per core / chip

8/120

Maximum L2 cache core

2 MB

Maximum On-chip L3 cache per core / chip

8 MB/120 MB

Number of transistors

18 billion

Processor compatibility modes

Support for Power ISAb of Power8 and Power9

CMOSa 7-nm lithography
18 layers of metala. Complimentary metal-oxide-semiconductor (CMOS)
b. Power instruction set architecture (Power ISA)

2.2.2 Processor modules for S1014, S1022s, S1022, and S1024 servers
For the Power10 processor-based scale-out servers, the Power10 processor is packaged asa DCM or as an eSCM:
򐂰 The DCM contains two directly coupled Power10 processor chips (chip-0 and chip-1) plus
more logic that is needed to facilitate power supply and external connectivity to themodule.
򐂰 The eSCM is a special derivative of the DCM where all active compute cores run on thefirst chip (chip-0) and the second chip (chip-1) contributes only extra PCIe connectivity,
essentially a switch:– Power S1022 and the Power S1024 servers use DCM modules– Power S1014 24-core processor option is a DCM module.
– Power S1014 (4-core and 8-core options) and the Power S1022s servers are based on
eSCM technology
A total of 36 X-bus lanes are used for two chip-to-chip, module internal connections. Eachconnection runs at 32 GTps (32 Gbps) speed and bundles 18 lanes, eight data lanes plus one
spare lane per direction (2 x(8+1)).
In this way, the DCM’s internal total aggregated full-duplex bandwidth between chip-0 andchip-1 culminates at 256 GBps.
The DCM internal connections are implemented by using the interface ports OP2 and OP6 on
chip-0 and OP1 and OP4 on chip-1:
򐂰 2 × 9 OP2 lanes of chip-0 connect to 2 x 9 OP1 lanes of chip-1
򐂰 2 × 9 OP6 lanes of chip-0 connect to 2 × 9 OP4 lanes of chip-1
In addition to the interface ports OP2 and OP6 on chip-0 and OP1 and OP4 on chip-1, theDCM offers 216 A-bus/X-bus/OpenCAPI lanes that are grouped in 12 other interface ports:
򐂰 OP0, OP1, OP3, OP4, OP5, OP7 on chip-0
򐂰 OP0, OP2, OP3, OP5, OP6, OP7 on chip-1

Chapter 2. Architecture and technical overview

49Power10 dual-chip module
Figure 2-6 shows the logical diagram of the Power10 DCM.

OP7

OP5

OP6

OP3

OP2

OP0

OP7

OP4

OP5

OP3

OP1

OP0

216 A-bus/X-bus/OpenCAPI lanes to bottom of module74.5 mm x 85.75 mm
64 OMI lanes
to bottom
of module

OMI0

Power10
Chip-0

OMI1
OMI2

OMI4

OP2

Power10
Chip-1

OP1
OP6
OP4

OMI3

E0

E1

OMI5
OMI6
OMI7

E0

64 OMI lanes
to bottom
of module

E1

64 PCIe5 lanes
to bottom of module

Figure 2-6 Power10 dual-chip module logical diagram

In the Power S1014 with the 24-core DCM module, only the memory interfaces in Chip-0 are
used. In 2-socket configurations of the Power S1022 or Power S1024 server, the interface
ports OP4 and OP7 on chip-0 and OP6 and OP7 on chip-1 are used to implement direct
chip-to-chip SMP connections across the two DCM modules.
The interface port OP3 on chip-0 and OP0 on chip-1 implement OpenCAPI interfaces that areaccessible through connectors that are on the mainboard of Power S1022 and Power S1024
servers.
Note: Although the OpenCAPI interfaces likely can be used in the future, they are not usedby available technology products as of this writing.
The interface ports OP0, OP1, and OP5 on chip-0 and OP2, OP3, and OP5 on chip-1 arephysically present, but not used by DCMs in Power S1022 and Power S1024 servers. This
status is indicated by the dashed lines that are shown in Figure 2-1 on page 43.
In addition to the chip-to-chip DCM internal connections, the cross DCM SMP links, and the
OpenCAPI interfaces, the DCM facilitates eight open memory interface ports (OMI0 - OMI7)
with two OMI links each to provide access to the buffered main memory differential DIMMs(DDIMMs):򐂰 OMI0 - OMI3 of chip-0
򐂰 OMI4 - OMI7 of chip-1

50

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

Note: The OMI interfaces are driven by eight on-chip memory controller units (MCUs) andare implemented in two separate physical building blocks that lie in opposite areas at theouter edge of the Power10 processor chip. One MCU directly controls one OMI port.
Therefore, a total of 16 OMI ports (OMI0 - OMI7 on chip-0 and OMI0 - OMI7 on chip-1) arephysically present on a Power10 DCM. However, because the chips on the DCM are tightly
integrated and the aggregated memory bandwidth of eight OMI ports culminates at
1 TBps, only half of the OMI ports are active. OMI4 to OMI7 on chip-0 and OMI0 to OMI3 ofchip-1 are disabled.
Finally, the DCM also offers differential Peripheral Component Interconnect Express version
5.0 interface busses (PCIe Gen 5) with a total of 64 lanes. Every chip of the DCM contributes
32 PCIe Gen5 lanes, which are grouped in two PCIe host bridges (E0, E1) with 16 PCIe Gen5
lanes each:򐂰 E0, E1 on chip-0
򐂰 E0, E1 on chip-1
Figure 2-7 shows the physical diagram of the Power10 DCM. Interface ports that are not used
by Power S1022 and Power S1024 servers (OP0, OP1, and OP5 on chip-0 and OP2, OP3,
and OP5 on chip-1) are shown, but no specification labels are shown.

64 open memory interface
lanes (8 x8) 32 Gbps
2 x9 SMP 32 Gbps

OP6

Chip-1AXON

OMI [4:7]

AX

OP0
E0

AXON
AXON

OP0
E0
E1

PCIe

AX

PCIe

OP5
OP7

AXON

OMI

Power10OP6

1 x16 Gen4 or
2 x8 Gen4 or
1 x8, 2 x4 Gen4 or
1 x8 Gen5, 1 x8 Gen4 or
1 x8 Gen5, 2 x4 Gen4
2 x8 OpenCAPI 32 Gbps

OP1

AXON

I/O MISC

AXON

OP4

2 x9 SMP 32 Gbps

AX

1 x16 Gen4 or
2 x8 Gen4 or
1 x8, 2 x4 Gen4 or
1 x8 Gen5, 1 x8 Gen4 or
1 x8 Gen5, 2 x4 Gen4

OP2

OP3

OP7

AXON

OMI

AXON

E1

Chip-02 x9 SMP 32 Gbps

PCIe

Power10

OP3

PCIe

AX

AXON

OMI [0:3]

AXON

OP5

OP1

AXON

I/O MISC

AXON

OP4

OP2

2 x8 OpenCAPI 32 Gbps
1 x16 Gen4 or
2 x8 Gen4 or
1 x8, 2 x4 Gen4 or
1 x8 Gen5, 1 x8 Gen4 or
1 x8 Gen5, 2 x4 Gen4
1 x16 Gen4 or
2 x8 Gen4 or
1 x8, 2 x4 Gen4 or
1 x8 Gen5, 1 x8 Gen4 or
1 x8 Gen5, 2 x4 Gen4

2 x9 SMP 32 Gbps

64 open memory interface
lanes (8 x8) 32 Gbps

Figure 2-7 Power10 dual-chip module physical diagram

Chapter 2. Architecture and technical overview

51

To conserve energy, the unused OMI on the lower side of chip-0 and on the upper side ofchip-1 are grounded on the DCM package. For the same reason, the interface ports OP0 and
OP1 in the upper right corner of chip-0 and OP2 and OP3 in the lower right corner of chip-1
are grounded on the system planar.

Entry single chip module
The Power S1014 4-core and 8-core modules and the Power S1022s server are based on theeSCM processor package. Figure 2-8 shows the logical diagram of the Power10 eSCM.
The main differences between the eSCM and the DCM structure include the following
examples:򐂰򐂰򐂰򐂰All active cores are on chip-0 and no active cores are on chip-1.
Chip-1 works with chip-0 as a switch to facilitate more I/O connections.
All active OMI interfaces are on chip-0 and no active OMI interfaces on chip-1.
No OpenCAPI connectors are supported through any of the interface ports.

The eSCM internal chip-to-chip connectivity, the SMP links across the eSCM in 2-socket
configurations, and the PCIe Gen5 bus structure are identical to the Power10 DCM
implementation.
As with the Power10 DCM 36 X-bus, lanes are used for two chip-to-chip connections. TheseeSCM internal connections are implemented by the interface ports OP2 and OP6 on chip-0
and OP1 and OP4 on chip-1:
򐂰 2 × 9 OP2 lanes of chip-0 connect to 2 x 9 OP1 lanes of chip-1
򐂰 2 × 9 OP6 lanes of chip-0 connect to 2 × 9 OP4 lanes of chip-1
The eSCM module internal chip-to-chip links exhibit the theoretical maximum full-duplex
bandwidth of 256 GBps.

OP7

OP6

OP7

OP4

72 A-bus/X-bus/OpenCAPI lanes to bottom of module74.5 mm x 85.75 mm
64 OMI lanes
to bottom
of module

OMI0

Power10
Chip-0

OMI1
OMI2

OP2

Power10
SwitchChip-1

OP1
OP6
OP4

OMI3

E0

E1

E0

E1

64 PCIe5 lanes
to bottom of module

Figure 2-8 Power10 entry single chip module logical diagram

The Power S1014 servers are available only in 1-socket configurations and no other interface
ports than OP2 and OP6 on chip-0 and OP1 and OP4 on chip-1 are operational. The sameinterface port constellation applies to 1-socket configurations of the Power S1022s server.

52

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

Figure 2-3 on page 45 shows the logical system diagram of the Power S1014 1-socket server
based on a single eSCM.
However, in 2-socket eSCM configurations of the Power S1022s server, the interface ports
OP4 and OP7 on chip-0 and OP6 and OP7 on chip-1 of the processor module are active andused to implement direct chip-to-chip SMP connections between the two eSCM modules.
Figure 2-2 on page 44 shows logical system diagram of the Power S1022s 2-socket serverthat is based on two eSCM modules. (The 1-socket constellation can easily be deduced from
Figure 2-2 on page 44 if eSCM-1 is conceptually omitted.)
As with the DCM, the eSCM offers differential PCIe Gen 5 with a total of 64 lanes. Every chipof the eSCM contributes 32 PCIe Gen5 lanes, which are grouped in two PCIe host bridges(E0, E1) with 16 PCIe Gen5 lanes each:򐂰 E0, E1 on chip-0
򐂰 E0, E1 on chip-1
Figure 2-9 shows the physical diagram of the Power10 entry single chip module. The mostimportant difference in comparison to the physical diagram of the Power10 DCM that isshown in Figure 2-7 on page 51 is that chip-1 has no active cores or memory interfaces. Also,
because the eSCM does not support any OpenCAPI connectivity, the interface port OP3 on
chip-0 and OP0 on chip-1 are disabled.

64 open memory interface
lanes (8 x8) 32 Gbps
2 x9 SMP 32 Gbps

OP6

OP7

AXON

OMI [4:7]

AXON

OP0
E0
E1
E0

PCIe

AX

E1

SwitchPCIe

OP5

I/O MISC

AXON

AXPower10AXON

1 x16 Gen4 or
2 x8 Gen4 or
1 x8, 2 x4 Gen4 or
1 x8 Gen5, 1 x8 Gen4 or
1 x8 Gen5, 2 x4 Gen4

OP1
OMI

Chip-1
2 x9 SMP 32 Gbps

1 x16 Gen4 or
2 x8 Gen4 or
1 x8, 2 x4 Gen4 or
1 x8 Gen5, 1 x8 Gen4 or
1 x8 Gen5, 2 x4 Gen4

OP2

OP4
AXON

AX

PCIe

OMI

OP6

OP3

OP7

AXON

AXON

OP3

Chip-02 x9 SMP 32 Gbps

AXON

Power10

OP0

PCIe

AX

AXON

OMI [0:3]

AXON

OP5

OP1

AXON

I/O MISC

AXON

OP4

OP2

1 x16 Gen4 or
2 x8 Gen4 or
1 x8, 2 x4 Gen4 or
1 x8 Gen5, 1 x8 Gen4 or
1 x8 Gen5, 2 x4 Gen4
1 x16 Gen4 or
2 x8 Gen4 or
1 x8, 2 x4 Gen4 or
1 x8 Gen5, 1 x8 Gen4 or
1 x8 Gen5, 2 x4 Gen4

2 x9 SMP 32 Gbps

Figure 2-9 Power10 entry single chip module physical diagram

Chapter 2. Architecture and technical overview

53

2.2.3 Power10 processor core
The Power10 processor core inherits the modular architecture of the Power9 processor core,
but the redesigned and enhanced micro-architecture that significantly increases theprocessor core performance and processing efficiency.
The peak computational throughput is markedly improved by new execution capabilities andoptimized cache bandwidth characteristics. Extra matrix math acceleration engines candeliver significant performance gains for machine learning, particularly for AI inferencing
workloads.
The Power10 processor-based scale-out servers uses the Power10 enterprise-classprocessor variant in which each core can run with up to eight independent hardware threads.
If all threads are active, the mode of operation is referred to as 8-way simultaneous
multithreading (SMT8) mode. A Power10 core with SMT8 capability is named Power10 SMT8
core (SMT8 core). The Power10 core also supports modes with four active threads (SMT4),
two active threads (SMT2), and one single active thread (ST).
The SMT8 core includes two execution resource domains. Each domain provides thefunctional units to service up to four hardware threads.
Figure 2-10 shows the functional units of an SMT8 core where all eight threads are active.
The two execution resource domains are highlighted with colored backgrounds in two
different shades of blue.

Figure 2-10 Power10 SMT8 core

Each of the two execution resource domains supports 1 - 4 threads and includes four vector
scalar units (VSU) of 128-bit width, two matrix math accelerator (MMA) units, and one
quad-precision floating-point (QP) and decimal floating-point (DF) unit.
One VSU and the directly associated logic are called an execution slice. Two neighboring
slices also can be used as a combined execution resource, which is then named super-slice.
When operating in SMT8 mode, eight SMT threads are subdivided in pairs that collectively
run on two adjacent slices, as indicated by colored backgrounds in different shades of green
in Figure 2-10.
In SMT4 or lower thread modes, one to two threads each share a four-slice resource domain.
Figure 2-10 also shows other essential resources that are shared among the SMT threads,
such as instruction cache, instruction buffer, and L1 data cache.

54

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

The SMT8 core supports automatic workload balancing to change the operational SMT
thread level. Depending on the workload characteristics, the number of threads that is runningon one chiplet can be reduced from four to two and even further to only one active thread. An
individual thread can benefit in terms of performance if fewer threads run against the core’s
executions resources.
Micro-architecture performance and efficiency optimization lead to a significant improvementof the performance per watt signature compared with the previous Power9 core
implementation. The overall energy efficiency per socket is better by a factor of approximately
2.6, which demonstrates the advancement in processor design that is manifested by thePower10 processor.
The Power10 processor core includes the following key features and improvements that affectperformance:
򐂰
򐂰
򐂰
򐂰
򐂰

Enhanced load and store bandwidth
Deeper and wider instruction windows
Enhanced data prefetch
Branch execution and prediction enhancements
Instruction fusion

Enhancements in the area of computation resources, working set size, and data accesslatency are described next. The change in relation to the Power9 processor core
implementation is provided in square parentheses.

Enhanced computation resources
The following computational resource enhancements are available:
򐂰 Eight vector scalar unit (VSU) execution slices, each supporting 64-bit scalar or 128-bit
single instructions multiple data (SIMD) [+100% for permute, fixed-point, floating-point,and crypto (Advanced Encryption Standard (AES)/SHA) +400% operations].
򐂰 Four units for matrix math accelerator (MMA) acceleration each capable of producing a
512-bit result per cycle (new) [+400% Single and Double precision FLOPS plus support for
reduced precision AI acceleration].
򐂰 Two units for quad-precision floating-point and decimal floating-point operations instruction
types

Larger working sets
The following major changes were implemented in working set sizes:
򐂰 L1 instruction cache: 2 x 48 KB 6-way (96 KB total); +50%
򐂰 L2 cache: 2 MB 8-way; +400%
򐂰 L2 translation lookaside buffer (TLB): 2 x 4K entries (8K total); +400%

Data access with reduced latencies
The following major changes reduce latency for load data:򐂰 L1 data cache access at four cycles nominal with zero penalty for store-forwarding;(- 2 cycles) for store forwarding򐂰 L2 data access at 13.5 cycles nominal (-2 cycles)򐂰 L3 data access at 27.5 cycles nominal (-8 cycles)򐂰 Translation lookaside buffer (TLB) access at 8.5 cycles nominal for effective-to-realaddress translation (ERAT) miss, including for nested translation (-7 cycles)

Chapter 2. Architecture and technical overview

55

Micro-architectural innovations that complement physical and logic design techniques andspecifically address energy efficiency include the following examples:򐂰 Improved clock-gating򐂰 Reduced flush rates with improved branch prediction accuracy
򐂰 Fusion and gather operating merging
򐂰 Reduced number of ports and reduced access to selected structures
򐂰 Effective address (EA)-tagged L1 data and instruction cache yield ERAT access on acache miss only
In addition to significant improvements in performance and energy efficiency, security
represents a major architectural focus area. The Power10 processor core supports thefollowing security features:
򐂰 Enhanced hardware support that provides improved performance while mitigating forspeculation-based attacks
򐂰 Dynamic Execution Control Register (DEXCR) support
򐂰 Return oriented programming (ROP) protection

2.2.4 Simultaneous multithreading
Each core of the Power10 processor supports multiple hardware threads that represent
independent execution contexts. If only one hardware thread is used, the processor core runsin single-threaded (ST) mode.
If more than one hardware thread is active, the processor runs in SMT mode. In addition to
the ST mode, the Power10 processor core supports the following SMT modes:
򐂰 SMT2: Two hardware threads active
򐂰 SMT4: Four hardware threads active
򐂰 SMT8: Eight hardware threads active
SMT enables a single physical processor core to simultaneously dispatch instructions from
more than one hardware thread context. Computational workloads can use the processor
core’s execution units with a higher degree of parallelism. This ability significantly enhances
the throughput and scalability of multi-threaded applications and optimizes the computedensity for single-threaded workloads.
SMT is primarily beneficial in commercial environments where the speed of an individualtransaction is not as critical as the total number of transactions that are performed. SMT
typically increases the throughput of most workloads, especially those workloads with large or
frequently changing working sets, such as database servers and web servers.
Table 2-2 on page 57 lists a historic account of the SMT capabilities that are supported byeach implementation of the IBM Power Architecture® since Power4.

56

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

Table 2-2 SMT levels that are supported by IBM POWER® processors
Technology

Maximum cores
per system

Supported hardware
threading modes

Maximum hardware
threads per partition

IBM Power4

32

ST

32

IBM Power5

64

ST, SMT2

128

IBM POWER664

ST, SMT2

128

IBM POWER7256

ST, SMT2, SMT41024

IBM Power8

192

ST, SMT2, SMT4, SMT81536

IBM Power9192

ST, SMT2, SMT4, SMT81536

IBM Power10

240

ST, SMT2, SMT4, SMT8

1920aa. The PHYP hypervisor supports a maximum 240 x SMT8 = 1920. AIX supports up to 1920
(240xSMT8) total threads in a single partition, starting with AIX v7.3 on Power10 based
systems.

All Power10 processor-based scale-out servers support the ST, SMT2, SMT4, and SMT8
hardware threading modes. Table 2-3 lists the maximum hardware threads per partition foreach scale-out server model.
Table 2-3 Maximum hardware threads supported by Power10 processor-based scale-out servers
ServerMaximum cores per system

Maximum hardware threads
per partition

Power S1014

8

64Power S1022s

16

128

Power S1022

40

320

Power S1024

48

384

2.2.5 Matrix math accelerator AI workload acceleration
The matrix math accelerator (MMA) facility was introduced by the Power Instruction Set
Architecture (ISA) v3.1. The related instructions implement numerical linear algebra
operations on small matrices and are meant to accelerate computation-intensive kernels,
such as matrix multiplication, convolution, and discrete Fourier transform.
To efficiently accelerate MMA operations, the Power10 processor core implements a dense
math engine (DME) microarchitecture that effectively provides an accelerator for cognitive
computing, machine learning, and AI inferencing workloads.
The DME encapsulates compute efficient pipelines, a physical register file, and associateddata-flow that keeps resulting accumulator data local to the compute units. Each MMA
pipeline performs outer-product matrix operations, reading from and writing back a 512-bit
accumulator register.
Power10 implements the MMA accumulator architecture without adding a designed state.
Each designed 512-bit accumulator register is backed by four 128-bit Vector Scalar eXtension(VSX) registers.

Chapter 2. Architecture and technical overview

57

Code that uses the MMA instructions is included in OpenBLAS and Eigen libraries. Thislibrary can be built by using the most recent versions of GNU Compiler Collection (GCC)
compiler. The latest version of OpenBLAS is available at this web page.
OpenBLAS is used by Python-NumPy library, PyTorch, and other frameworks, which makes it
easy to use the performance benefit of the Power10 MMA accelerator for AI workloads.
The Power10 MMA accelerator technology also is used by the IBM Engineering and Scientific
Subroutine Library for AIX on POWER 7.1 (program number 5765-EAP).
Program code that is written in C/C++ or Fortran can benefit from the potential performancegains by using the MMA facility if compiled by the following IBM compiler products:
򐂰 IBM Open XL C/C++ for AIX 17.1 (program numbers 5765-J18, 5765-J16, and 5725-C72)
򐂰 IBM Open XL Fortran for AIX 17.1 (program numbers 5765-J19, 5765-J17, and 5725-C74)
For more information about the implementation of the Power10 processor’s high throughput
math engine, see the white paper A matrix math facility for Power ISA processors.
For more information about fundamental MMA architecture principles with detailed instruction
set usage, register file management concepts, and various supporting facilities, seeMatrix-Multiply Assist Best Practices Guide, REDP-5612.

2.2.6 Power10 compatibility modes
The Power10 core implements the Processor Compatibility Register (PCR) as described in
the Power instruction set architecture (ISA) version 3.1, primarily to facilitate live partition
mobility (LPM) to and from previous generations of IBM Power hardware.
Depending on the specific settings of the PCR, the Power10 core runs in a compatibility modethat pertains to Power9 (Power ISA version 3.0) or Power8 (Power ISA version 2.07)
processors. The support for processor compatibility modes also enables older operating
systems versions of AIX, IBM i, Linux, or Virtual I/O server environments to run on Power10
processor-based systems.
The Power10 processor-based scale-out servers support the Power8, Power9 Base, Power9,
and Power10 compatibility modes.

2.2.7 Processor module options
Power10 processor-based scale-out servers use DCMs or eSCMs:
򐂰 Power S1014 (four core and eight core options) and Power S1022s server sockets are
populated with eSCM modules.
򐂰 Power S1022, Power S1024 and Power S1014 (twenty four core option) server sockets
are populated with DCM modules.
Depending on the scale-out server model and the number of populated sockets, the following
core densities are available for the supported processor module types:
򐂰 Power S1014 server is offered with four or eight functional cores per eSCM and also isoffered with a twenty four core DCM option. The Power S1014 is available only as 1-socket
server. The Power S1022s supports the 4-core eSCM only in a 1-socket configuration, andthe 8-core eSCM in 1- and 2-socket configurations.

58

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction򐂰 Power S1022 servers can be configured with 12, 16, or 20 functional cores per DCM. The
12-core DCM module is available for 1-socket and 2-socket configurations. The 16-coreand 20-core DCM modules are supported only in configurations in which both sockets are
populated.
򐂰 Power S1024 servers support 12, 16, or 24 functional cores per DCM. Regarding the
12-core DCM, the Power S1024 allows configurations with one or two populated sockets.
However, both sockets of the Power S1024 server must be configured if 16-core or 24-core
DCMs are chosen.
Note: In 2-socket Power10 processor-based scale-out servers, the processor module
types must be identical in terms of the number of functional cores and the related
processor typical frequency range of operation.
The supported processor activation types and use models vary with the Power10
processor-based scale-out server model type:򐂰 Static processor activations
The eSCM models with 4-core or 8-core processor density in Power S1014 andPower S1022s servers support the classical static processor activation model as does the
24-core DCM based S1014. All functional cores of the configured modules are delivered
with processor activation features at initial order. This use model provides static andpermanent processor activations and is the default for the named servers.
򐂰 Capacity Upgrade on Demand (CUoD) processor activations
The Power S1022 and Power S1024 servers support the Capacity Upgrade on Demand(CUoD) technology option. For these servers, a minimum of 50% of the configured total
processor capacity must be activated through the related CUoD processor activation
features at the time of initial order.
Later, more CUoD processor activations can be purchased through a miscellaneous
equipment specification (MES) upgrade order. The CUoD is the default use model ofPower S1022 and Power S1024 servers. It offers static and permanent processor
activations with the added flexibility to adjust the processor capacity between half of thephysically present cores and the maximum of the configured processor module capacity
as required by the workload demand.
򐂰 Power Private Cloud with Shared Utility Capacity use model
The Power S1022 and Power S1024 servers also support the IBM Power Private Cloudwith Shared Utility Capacity solution (Power Enterprise Pools 2.0), which is an
infrastructure offering model that enables cloud agility and cost optimization with
pay-for-use pricing.
This use model requires the configuration of the Power Enterprise Pools 2.0 Enablement
feature (#EP20) for the specific server and a minimum of one Base Processor Activation
for Pools 2.0 feature is needed. The base processor activations are permanent and sharedwithin a pool of servers. More processor resources that are needed beyond the capacitythat is provided by the base processor activations are metered by the minute and paid
through capacity credits.
To assist with the optimization of software licensing, the factory deconfiguration feature(#2319) is available at initial order for all scale-out server models to permanently reduce thenumber of active cores that is less than the minimum processor core activation requirement.
Factory deconfigurations are permanent and they are available only in the context of the static
processor activation use model and the CUoD processor activation use model.

Chapter 2. Architecture and technical overview

59Note: The static activation usage model, the CUoD technology usage model, and thePower Private Cloud Shared Utility Capacity (Power Enterprise Pools 2.0) offering models
are all mutually exclusive in respect to each other.
Table 2-4 lists the processor module options that are available for Power10 processor-based
scale-out servers. The list is sorted by increasing order of the processor module capacity.
Table 2-4 Processor module options for Power10 processor-based scale-out servers
Modulecapacity

Moduletype

CUoD
supportPools 2.0
optionTypicalfrequency
range
[GHz]

Minimumquantity
perserver

Power
S1014

Power
S1022s

Power
S1022

Power
S1024

4-core

eSCM

No

No

3.0 - 3.9

1

X

X

—

—

8-core

eSCM

No

No

3.0 - 3.9

1

X

X

—

—

12-core

DCM

Yes

Yes

2.9 - 4.0

1

—

—

X

—

3.4 - 4.0

1

—

—

—

X

2.75 - 4.0

2

—

—

X

—

3.1 - 4.0

2

—

—

—

X

16-core

DCM

Yes

Yes

20-core

DCM

Yes

Yes

2.45 - 3.9

2

—

—

X

—

24-core

DCM

No

No

2.75 - 3.9

1

X

—

—

—

24-core

DCM

Yes

Yes

2.75 - 3.9

2

—

—

—

X

For each processor module option the module type (eSCM / DCM), the support for CUoD, theavailability of the Pools 2.0 option, and the minimum number of sockets that must be
populated are indicated.
Power10 processors automatically optimize their core frequencies based on workload
requirements, thermal conditions, and power consumption characteristics. Therefore, eachprocessor module option that is listed is associated with a processor core frequency range
within which the DCM or eSCM cores typically operate.
Depending on the different physical characteristics of the Power S1022 and Power S1024
servers. two distinct, model-specific frequency ranges are available for processor modules
with 12- and 16-core density.
The last four columns of Table 2-4 list the availability matrix between a specific processor
module capacity and frequency specification on one side and the Power10 processor-basescale-out server models on the other side. (Available combinations are labeled with “X” andunavailable combinations are indicated by a “—” hyphen.)

2.2.8 On-chip L3 cache and intelligent caching
The Power10 processor includes a large on-chip L3 cache of up to 120 MB with a NUCA
architecture that provides mechanisms to distribute and share cache footprints across a set of
L3 cache regions. Each processor core can access an associated local 8 MB of L3 cache. It
also can access the data in the other L3 cache regions on the chip and throughout thesystem.

60

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

Each L3 region serves as a victim cache for its associated L2 cache and can provide
aggregate storage for the on-chip cache footprint.
Intelligent L3 cache management enables the Power10 processor to optimize the access to
L3 cache lines and minimize cache latencies. The L3 includes a replacement algorithm withdata type and reuse awareness.
It also supports an array of prefetch requests from the core, including instruction and data,
and works cooperatively with the core, memory controller, and SMP interconnection fabric tomanage prefetch traffic, which optimizes system throughput and data latency.
The L3 cache supports the following key features:
򐂰 Enhanced bandwidth that supports up to 64 bytes per core processor cycle to each SMT8
core.
򐂰 Enhanced data prefetch that is enabled by 96 L3 prefetch request machines that service
prefetch requests to memory for each SMT8 core.
򐂰 Plus-one prefetching at the memory controller for enhanced effective prefetch depth andrate.
򐂰 Power10 software prefetch modes that support fetching blocks of data into the L3 cache.
򐂰 Data access with reduced latencies.

2.2.9 Open memory interface
The Power10 processor introduces a new and innovative OMI. The OMI is driven by eighton-chip MCUs and is implemented in two separate physical building blocks that lie in opposite
areas at the outer edge of the Power10 die. Each area supports 64 OMI lanes that aregrouped in four OMI ports. One port in turn consists of two OMI links with eight lanes each,
which operate in a latency-optimized manner with unprecedented bandwidth and scale at
32 Gbps speed.
One Power10 processor chip supports the following functional elements to access main
memory:򐂰򐂰򐂰򐂰Eight MCUs
Eight OMI ports that are controlled one-to-one through a dedicated MCU
Two OMI links per OMI port for a total of 16 OMI links
Eight lanes per OMI link for a total of 128 lanes, all running at 32 Gbps speed

The Power10 processor provides natively an aggregated maximum theoretical full-duplex
memory interface bandwidth of 1 TBps per chip.

Memory interface architecture for dual-chip modules
The DCM, which is used in Power S1022, Power S1024 servers, and the 24-core module in
the Power S1014 combines two Power10 processor chips in one processor package.
Therefore, a total of 2 x 8 = 16 OMI ports and 2 x 16 = 32 OMI links are physically present ona Power10 DCM.
However, because the chips on the DCM are tightly integrated and the aggregated memory
bandwidth of eight OMI ports culminates at a maximum theoretical full-duplex bandwidth of
1 TBps, only half of the OMI ports are active when used in the Power S1022 and PowerS1024. When used in the 24-core module of the Power S1014, only the four OMI ports andeight OMI links on Chip-0 are available.

Chapter 2. Architecture and technical overview

61Each chip of the DCM contributes four OMI ports and eight OMI links to facilitate main
memory access. For more information about the OMI port designation and the physicallocation of the active OMI units of a DCM, see Figure 2-6 on page 50 and Figure 2-7 onpage 51.
In summary, one DCM supports the following functional elements to access main memory in
the Power S1022 and Power S1024:
Four active MCUs per chip for a total of eight MCUs per module
Each MCU maps one-to-one to an OMI port
Four OMI ports per chip for at total of eight OMI ports per module
Two OMI links per OMI port for a total of eight OMI links per chip and 16 OMI links per
module򐂰 Eight lanes per OMI link for a total of 128 lanes per module, all running at 32 Gbps
򐂰 The Power10 DCM provides an aggregated maximum theoretical full-duplex memory
interface bandwidth of 512 GBps per chip and 1 TBps per module.
򐂰򐂰򐂰򐂰For the Power S1014 with the 24-core module, one DCM supports the following functional
elements to access main memory:
򐂰
򐂰
򐂰
򐂰
򐂰
򐂰

Four active MCUs on Chip-0
Each MCU maps one-to-one to an OMI port
Four OMI ports on Chip-0
Two OMI links per OMI port for a total of eight OMI links on Chip-0
Eight lanes per OMI link for a total of 64 lanes per module, all running at 32 Gbps
The Power10 DCM provides an aggregated maximum theoretical full-duplex memory
interface bandwidth of 512 GBps per module.

Memory interface architecture of single-chip modules
Because the eSCM as used in Power S1014 4-core and 8-core modules and thePower S1022s servers is a derivative of the DCM module, it combines two Power10
processor chips in one processor package. However, unlike the DCM package. only one of
the chips (chip-0) hosts active processor cores and active memory interfaces. Thisconfiguration implies that 16 OMI ports and 32 OMI links are physically present on the eSCM,
but only the first Power10 chip (chip-0) contributes four OMI ports and eight OMI links.
The second Power10 chip (chip-1) is dedicated to drive PCIe Gen5 and Gen4 interfaces
exclusively. For more information about for the OMI port designation and physical location of
the active OMI units of an eSCM, see Figure 2-8 on page 52 and Figure 2-9 on page 53.
In summary, one eSCM supports the following elements to access main memory:
򐂰
򐂰
򐂰
򐂰
򐂰

Four active MCUs per module
Each MCU maps one-to-one to an OMI port
Four OMI ports per module
Two OMI links per OMI port for a total of eight OMI links per module
Eight lanes per OMI link for a total of 64 lanes, all running at 32 Gbps speed

The Power10 eSCM provides an aggregated maximum theoretical full-duplex memory
interface bandwidth of 512 GBps per module.

62

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

The OMI physical interface enables low-latency, high-bandwidth, technology-agnostic hostmemory semantics to the processor and allows attaching established and emerging memory
elements.
With the Power10 processor-based scale-out servers, OMI initially supports one main tier,low-latency, enterprise-grade Double Data Rate 4 (DDR4) DDIMM per OMI link. Thisarchitecture yields a total memory module capacity of:򐂰 8 DDIMMs per socket for eSCM-based Power S1014 and Power S1022s server
򐂰 8 DDIMMs per socket for DCM-based Power S1014 server򐂰 16 DDIMMs per socket for DCM-based Power S1022 and Power S1024 servers
The memory bandwidth and the total memory capacity depend on the DDIMM density andthe associated DDIMM frequency that is configured for a specific Power10 processor-basescale-out server.
Table 2-5 list the maximum memory bandwidth for Power S1014, Power S1022s,
Power S1022, and Power S1024 servers under the assumption that the maximum number of
supported sockets are configured and all available slots are populated with DDIMMs of thenamed density and speed.
Table 2-5 Maximum theoretical memory bandwidth for Power10 processor-based scale-out servers
Server model

DDIMM
density(GB)

DDIMM
frequency(MHz)

Maximum memory
capacity(GB)

Maximum theoreticalmemory bandwidth(GBps)

Power S1014

128a

2666

1024

170

64, 32, 16

3200

512b

204

128

2666

2048

341

64, 32, 16

3200

1024

409

128

2666

4096

682

64, 32, 16

3200

2048

818

256, 128

2933

8192c

750

64, 32, 16

3200

2048

818

Power S1022s

Power S1022

Power S1024

a. The 128 GB and 256 GB DDIMMs are planned to be available from 9 December 2022.
b. Based on DDIMMs of 64 GB density.
c. Based on DDIMMs of 256 GB density.

2.2.10 Pervasive memory encryption
The Power10 MCU provides the system memory interface between the on-chip symmetricmultiprocessing (SMP) interconnect fabric and the OMI links. This design qualifies the MCU
as ideal functional unit to implement memory encryption logic. The Power10 on-chip MCU
encrypts and decrypts all traffic to and from system memory that is based on the AES
technology.
The Power10 processor supports the following modes of operation:
򐂰 AES XTS mode
The xor–encrypt–xor (XTS)-based tweaked-codebook mode features ciphertext stealing.
AES XTS provides a block cipher with strong encryption, which is useful to encrypt
persistent memory.
Chapter 2. Architecture and technical overview

63Persistent DIMM technology retains the data that is stored inside the memory DIMMs,
even if the power is turned off. A malicious attacker who gains physical access to theDIMMs can steal memory cards. The data that is stored in the DIMMs can leave the data
center in the clear, if not encrypted.
Also, memory cards that leave the data center for repair or replacement can be a potential
security breach. Because the attacker might have arbitrary access to the persistent DIMM
data, the stronger encryption of the AES XTS mode is required for persistent memory. The
AES XTS mode of the Power10 processor is supported for future use if persistent memory
solutions become available for IBM Power servers.
򐂰 AES CTR mode
The Counter (CTR) mode of operation designates a low-latency AES bock cipher.
Although the level of encryption is not as strong as with the XTS mode, the low-latency
characteristics make it the preferred mode for memory encryption for volatile memory.
AES CTR makes it more difficult to physically gain access to data through the memory
card interfaces. The goal is to protect against physical attacks, which becomesincreasingly important in the context of cloud deployments.
The Power10 processor-based scale-out servers support the AES CTR mode forpervasive memory encryption. Each Power10 processor holds a 128-bit encryption key
that is used by the processor’s MCU to encrypt the data of the differential DIMMs that are
attached to the OMI links.
The MCU crypto engine is transparently integrated into the data path, which ensures thatthe data fetch and store bandwidth are not compromised by the AES CTR encryption
mode. Because the encryption has no noticeable performance effect and because of theobvious security benefit, the pervasive memory encryption is enabled by default andcannot be switched off through any administrative interface.
Note: Consider the following points:򐂰

The pervasive memory encryption of the Power10 processor does not affect the encryption statusof a system memory dump content. All data from the DDIMMs is decrypted by the memory
controller unit before it is passed onto the memory dump devices under the control of the memory
dump program code. This statement applies to the traditional system dump under the operating
system control and the firmware assist dump utility.

򐂰

The PowerVM Live Partition Mobility (LPM) data encryption does not interfere with the pervasive
memory encryption. Data transfer that occurs during an LPM operation uses the following generalflow:
a. On the source server, the Mover Server Partition (MSP) provides the hypervisor with a buffer.
b. The hypervisor of the source system copies the partition memory into the buffer.
c. The MSP transmits the data over the network.
d. The data is received by the MSP on the target server and copied in to the related buffer.
e. The hypervisor of the target system copies the data from the buffer into the memory space ofthe target partition.

To facilitate LPM data compression and encryption, the hypervisor on the source system presents
the LPM buffer to the on-chip nest accelerator (NX) unit as part of process in Step b. The reverse
decryption and decompress operation is applied on the target server as part of process in Step d.
The pervasive memory encryption logic of the MCU decrypts the memory data before it iscompressed and encrypted by the NX unit on the source server. It also encrypts the data before it is
written to memory, but after it is decrypted and decompressed by the NX unit of the target server.

64

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

2.2.11 Nest accelerator
The Power10 processor features an on-chip accelerator that is called the nest accelerator
unit (NX unit). The coprocessor features that are available on the Power10 processor are
similar to the features of the Power9 processor. These coprocessors provide specialized
functions, such as the following examples:򐂰򐂰򐂰򐂰IBM proprietary data compression and decompression
Industry-standard Gzip compression and decompression
AES and Secure Hash Algorithm (SHA) cryptography
Random number generation

Figure 2-11 shows a block diagram of the NX unit.

Figure 2-11 Block diagram of the NX unit

Each one of the AES/SHA engines, data compression, and Gzip units consist of a
coprocessor type and the NX unit features three coprocessor types. The NX unit also
includes more support hardware to support coprocessor invocation by user code, use ofeffective addresses, high-bandwidth storage access, and interrupt notification of job
completion.
The direct memory access (DMA) controller of the NX unit helps to start the coprocessors
and move data on behalf of coprocessors. SMP interconnect unit (SIU) provides the interface
between the Power10 SMP interconnect and the DMA controller.
The NX coprocessors can be started transparently through library or operating system kernel
calls to speed up operations that are related to:򐂰򐂰򐂰򐂰Data compression
Live partition mobility migration
IPsec
JFS2 encrypted file systems

Chapter 2. Architecture and technical overview

65򐂰 PKCS11 encryption
򐂰 Random number generation
򐂰 The most recently announced logical volume encryption
In effect, this on-chip NX unit on Power10 systems implements a high throughput engine thatcan perform the equivalent work of multiple cores. The system performance can benefit by
off-loading these expensive operations to on-chip accelerators, which in turn can greatly
reduce the CPU usage and improve the performance of applications.
The accelerators are shared among the logical partitions (LPARs) under the control of thePowerVM hypervisor and accessed by way of a hypervisor call. The operating system, alongwith the PowerVM hypervisor, provides a send address space that is unique per process thatis requesting the coprocessor access. This configuration allows the user process to directly
post entries to the first in-first out (FIFO) queues that are associated with the NX accelerators.
Each NX coprocessor type features a unique receive address space that corresponds to aunique FIFO for each of the accelerators.
For more information about the use of the xgzip tool that uses the Gzip accelerator engine,see the following resources:
򐂰 IBM support article: Using the POWER9 NX (gzip) accelerator in AIX
򐂰 IBM Power community article: Power9 GZIP Data Acceleration with IBM AIX
򐂰 AIX community article: Performance improvement in openssh with on-chip datacompression accelerator in power9
򐂰 IBM Documentation: nxstat Command

2.2.12 SMP interconnect and accelerator interface
The Power10 processor provides a highly optimized, 32 Gbps differential signaling
technology interface that is structured in 16 entities. Each entity consists of eight data lanes
and one spare lane. This interface can facilitate the following functional purposes:򐂰 First- or second-tier, symmetric multiprocessing link interface, which enables up to 16
Power10 processors to be combined into a large, robustly scalable, single-system image.
򐂰 Open Coherent Accelerator Processor Interface (OpenCAPI) to attach cache coherent
and I/O-coherent computational accelerators, load or store addressable host memory
devices, low latency network controllers, and intelligent storage controllers.
򐂰 Host-to-host integrated memory clustering interconnect, which enabling multiple Power10
systems to directly use memory throughout the cluster.
Note: The OpenCAPI interface and the memory clustering interconnect are Power10
technology options for future use.

Because of the versatile nature of signaling technology, the 32 Gbps interface also is referred
to as Power/A-bus/X-bus/OpenCAPI/Networking (PowerAXON) interface. The IBM
proprietary X-bus links connect two processors on a board with a common reference clock.
The IBM proprietary A-bus links connect two processors in different drawers on different
reference clocks by using a cable.

66

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

OpenCAPI is an open interface architecture that allows any microprocessor to attach to thefollowing components:
򐂰 Coherent user-level accelerators and I/O devices
򐂰 Advanced memories that are accessible through read/write or user-level DMA semantics
The OpenCAPI technology is developed, enabled, and standardized by the OpenCAPIConsortium. For more information about the consortium’s mission and the OpenCAPI
protocol specification, see OpenCAPI Consortium.
The PowerAXON interface is implemented on dedicated areas that are at each corner of thePower10 processor die.
The Power10 processor-based scale-out servers use this interface to implement:򐂰򐂰򐂰򐂰DCM internal chip-to-chip connections
eSCM internal chip-to-chip connections
Chip-to-chip SMP interconnects between DCMs and eSCMs in 2-socket configurations
OpenCAPI accelerator interface connections

The chip-to-chip DCM internal (see Figure 2-6 on page 50) and eSCM internal (seeFigure 2-8 on page 52) chip-to-chip connections are implemented by using the interface ports
OP2 and OP6 on chip-0 and OP1 and OP4 on chip-1:
򐂰򐂰

2 × 9 OP2 lanes of chip-0 connect to 2 x 9 OP1 lanes of chip-1
2 × 9 OP6 lanes of chip-0 connect to 2 × 9 OP4 lanes of chip-1

The processor module internal chip-to-chip connections feature the following common
properties:
򐂰 Two (2 x 9)-bit buses implement two independent connections between the module chips
򐂰 Eight data lanes, plus one spare lane in each direction per chip-to-chip connection
򐂰 32 Gbps signaling rate that provides 128 GBps per chip-to-chip connection bandwidth,
which yields a maximum theoretical full-duplex bandwidth between the two processor
module chips of 256 GBps
In addition to the interface ports OP2 and OP6 on chip-0 and OP1 and OP4 on chip-1, theDCM offers 216 A-bus/X-bus/OpenCAPI lanes that are grouped in 12 other interface ports:
򐂰 OP0, OP1, OP3, OP4, OP5, OP7 on chip-0
򐂰 OP0, OP2, OP3, OP5, OP6, OP7 on chip-1
Each OP1 and OP2 interface port runs as a 2 × 9 SMP bus at 32 Gbps whereas the OP0,
OP3, OP4, OP5, OP6, and OP7 interface ports can run in one of the following two modes:
򐂰 2 × 9 SMP at 32 Gbps
򐂰 2 × 8 OpenCAPI at 32 Gbps

Chapter 2. Architecture and technical overview

67

SMP topology and accelerator interfaces for DCM-based servers
Figure 2-12 shows the flat, one-hop SMP topology and the associated interface ports forPower S1022 and Power S1024 servers in 2-socket configurations (all interfaces that do notcontribute to the SMP fabric were omitted for clarity).

DCM-0
P0 / Chip-0

SMP 2 x9
@ 32 Gbps

OP2

OP6

SMP 2 x9
@ 32 Gbps

SMP 2 x9
@ 32 Gbps

SMP 2 x9
@ 32 Gbps

OP1

OP1

OP4

OP6

OP6

OP4

OP6

OP7

DCM-0
P1 / Chip-1

DCM-1
P2 / Chip-0
OP4

OP7
OP2

OP7

SMP 2 x9
@ 32 Gbps

OP4

SMP 2 x9
@ 32 Gbps

DCM-1
P3 / Chip-1
OP7

Figure 2-12 SMP connectivity for Power S1022 or Power S1024 servers in 2-socket configurations

The interface ports OP4, OP6, and OP7 are used to implement direct SMP connections
between the first DCM chip (DCM-0) and the second DCM chip (DCM-1), as shown in thefollowing example:򐂰򐂰򐂰򐂰

2 x 9 OP4 lanes of chip-0 on DCM-0 connect to 2 x 9 OP7 lanes of chip-0 on DCM-1
2 x 9 OP7 lanes of chip-0 on DCM-0 connect to 2 x 9 OP6 lanes of chip-1 on DCM-1
2 x 9 OP7 lanes of chip-1 on DCM-0 connect to 2 x 9 OP4 lanes of chip-0 on DCM-1
2 x 9 OP6 lanes of chip-1 on DCM-0 connect to 2 x 9 OP7 lanes of chip-1 on DCM-1

Each inter-DCM chip-to-chip SMP link provides a maximum theoretical full-duplex bandwidthof 128 GBps.
The interface port OP3 on chip-0 and OP0 on chip-1 of the DCM are used to implement
OpenCAPI interfaces through connectors that are on the mainboard of Power S1022 andPower S1024 servers. The relevant interface ports are subdivided in two bundles of eightlanes, which are designated by the capital letters A and B respectively. Therefore, the named
ports OP3A, OP3B, OP0A, and OP0B represent one bundle of eight lanes that can support
one OpenCAPI interface in turn.
In a 1-socket Power S1022 or Power S1024 server, a total of 4 OpenCAPI interfaces are
implemented through DCM-0, as shown in the following example:򐂰 OP3A and OP3B on chip-0 of DCM-0
򐂰 OP0A and OP0B on chip-1 of DCM-0
In a 2-socket Power S1022 or Power S1024 server, two other OpenCAPI interfaces areprovided through DCM-1, as shown in the following example:򐂰 OP3A on chip-0 of DCM-1
򐂰 OP0B on chip-1 of DCM-1

68

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

The 2-socket logical diagram of the Power S1022 and the Power S1024 server that is shownin Figure 2-1 on page 43 shows the OpenCAPI interfaces that are represented by their
SlimSAS connectors. The 1-socket constellation can be deduced from Figure 2-1 on page 43
if DCM-1 is conceptually omitted.
Note: The implemented OpenCAPI interfaces can be used in the future and are not usedby available technology products as of this writing.

SMP topology for eSCM based servers
The flat, one-hop SMP topology and the associated interface ports for the Power S1022s2-socket configuration is shown in Figure 2-13. All active interface ports contribute to the SMP
fabric. Unlike the DCM, no other interface ports are enabled to support OpenCAPI interfaces.

eSCM-0P0 / Chip-0

SMP 2 x9
@ 32 Gbps

OP2

OP6

SMP 2 x9
@ 32 Gbps

SMP 2 x9
@ 32 Gbps

SMP 2 x9
@ 32 Gbps

OP1

OP1

OP4

eSCM-0SwitchP1 / Chip-1

OP6

OP7

OP6

eSCM-1P2 / Chip-0
OP4

OP7
OP2

OP7

SMP 2 x9
@ 32 Gbps

OP6
SMP 2 x9
@ 32 Gbps

OP4

OP4

eSCM-1
SwitchP3 / Chip-1

OP7

Figure 2-13 SMP connectivity for a Power S1022s server in 2-socket configuration

In 2-socket eSCM configurations of the Power S1022s server, the interface ports OP4 andOP7 on chip-0 and OP6 and OP7 on chip-1 of the processor module are active. They areused to implement direct SMP connections between the first eSCM (eSCM-0) and the second
eSCM (eSCM-1) in the same way for the 2-socket DCM configurations of the Power S1022
and Power S1024 servers.
However, the eSCM constellation differs by the fact that no active cores (0-cores) are on
chip-1 of eSCM-0 and chip-1 of eSCM-1. These chips operate as switches. For more
information about the Power S1022s 2-socket server that is based on two eSCM modules,
see Figure 2-2 on page 44.
In summary, the SMP interconnect between the eSCMs of a Power S1022s server in 2-socket
configuration and between the DCMs of a Power S1022 or Power S1024 server in 2-socket
configuration features the following properties:
򐂰 One (2 x 9)-bit buses per chip-to-chip connection across the processor modules
򐂰 Eight data lanes plus one spare lane in each direction per chip-to-chip connection

Chapter 2. Architecture and technical overview

69򐂰 Flat, 1-hop SMP topology through direct connection between all chips
򐂰 32 Gbps signaling rate, which provides 128 GBps bandwidth per chip-to-chip connection
an increase of 33% compared to the Power9 processor-based scale-out servers
implementation

2.2.13 Power and performance management
Power10 processor-based servers implement an enhanced version of the power
management EnergyScale technology. As in the previous Power9 EnergyScale
implementation, the Power10 EnergyScale technology supports dynamic processor
frequency changes that depend on several factors, such as workload characteristics, thenumber of active cores, and environmental conditions.
Based on the extensive experience that was gained over the past few years, the Power10
EnergyScale technology evolved to use the following effective and simplified set ofoperational modes:
򐂰 Power saving mode
򐂰 Static mode (nominal frequency)
򐂰 Maximum performance mode (MPM)
The Power9 dynamic performance mode (DPM) has many features in common with thePower9 maximum performance mode (MPM). Because of this redundant nature ofcharacteristics, the DPM for Power10 processor-based systems was removed in favor of anenhanced MPM. For example, the maximum frequency is now achievable in the Power10
enhanced maximum performance mode (regardless of the number of active cores), which
was not always the case with Power9 processor-based servers.
The Power10 processor-based scale-out servers feature MPM enabled by default. This mode
dynamically adjusts processor frequency to maximize performance and enable a much higher
processor frequency range. Each of the power saver modes deliver consistent system
performance without any variation if the nominal operating environment limits are met.
For Power10 processor-based systems that are under control of the PowerVM hypervisor, theMPM is a system-wide configuration setting, but each processor module frequency is
optimized separately.
The following factors determine the maximum frequency at which a processor module canrun:򐂰 Processor utilization: Lighter workloads run at higher frequencies.
򐂰 Number of active cores: Fewer active cores run at higher frequencies.
򐂰 Environmental conditions: At lower ambient temperatures, cores are enabled to run at
higher frequencies.
The following Power10 EnergyScale modes are available:򐂰 Power saving mode
The frequency is set to the minimum frequency to reduce energy consumption. Enabling
this feature reduces power consumption by lowering the processor clock frequency andvoltage to fixed values. This configuration reduces power consumption of the system while
delivering predictable performance.

70

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction򐂰 Static mode
The frequency is set to a fixed point that can be maintained with all normal workloads andin all normal environmental conditions. This frequency is also referred to as nominal
frequency.
򐂰 Maximum performance mode
Workloads run at the highest frequency possible, depending on workload, active core
count, and environmental conditions. The frequency does not fall below the static
frequency for all normal workloads and in all normal environmental conditions.
In MPM, the workload is run at the highest frequency possible. The higher power draw
enables the processor modules to run in an MPM typical frequency range (MTFR), where
the lower limit is greater than the nominal frequency and the upper limit is given by thesystem’s maximum frequency.
The MTFR is published as part of the system specifications of a specific Power10 system
if it is running by default in MPM. The higher power draw potentially increases the fan
speed of the respective system node to meet the higher cooling requirements, which inturn causes a higher noise emission level of up to 15 decibels.
The processor frequency typically stays within the limits that are set by the MTFR, but canbe lowered to frequencies between the MTFR lower limit and the nominal frequency athigh ambient temperatures greater than 27 °C (80.6 °F).
If the data center ambient environment is less than 27 °C, the frequency in MPM isconsistently in the upper range of the MTFR (roughly 10% - 20% better than nominal). At
lower ambient temperatures (less than 27 °C, or 80.6 °F), MPM mode also provides
deterministic performance. As the ambient temperature increases above 27 °C,
determinism can no longer be ensured. This mode is the default mode for all Power10
processor-based scale-out servers.
򐂰 Idle power saver mode (IPS)
IPS mode lowers the frequency to the minimum if the entire system (all cores of all
sockets) is idle. It can be enabled or disabled separately from all other modes.
Figure 2-14 shows the comparative frequency ranges for the Power10 power saving
mode, static or nominal mode, and the maximum performance mode. The frequency
adjustments for different workload characteristics, ambient conditions, and idle states arealso indicated.

Figure 2-14 Power10 power management modes and related frequency ranges
Chapter 2. Architecture and technical overview

71

Table 2-6, Table 2-7, Table 2-8, and Table 2-9 show the power saving mode, the static mode
frequencies, and the frequency ranges of the MPM for all processor module types that areavailable for the Power S1014, Power S1022s, Power S1022, and Power S1024 servers.
Note: For all Power10 processor-based scale-out systems, the MPM is enabled by default.
Table 2-6 Characteristic frequencies and frequency ranges for Power S1014 servers
Featurecode

Cores permodulePower saving
mode frequency[GHz]

Static mode
frequency[GHz]

Maximum performance mode
frequency range
[GHz]

#EPG0

4a

2.0

3.0

3.0 to 3.90 (max)

#EPG2

8

2.0

3.0

3.0 to 3.90 (max)

#EPH8

24b

2.0

2.75

2.75 - 3.90 (max)a. Processor is eSCM basedb. Processor is DCM based
Table 2-7 Characteristic frequencies and frequency ranges for Power S1022s servers
Featurecode

Cores pereSCM

Power saving
mode frequency[GHz]

Static mode
frequency[GHz]

Maximum performance mode
frequency range
[GHz]

#EPGR

4

2.0

3.0

3.0 to 3.90 (max)

#EPGQ

8

2.0

3.0

3.0 to 3.90 (max)Table 2-8 Characteristic frequencies and frequency ranges for Power S1022 servers
Featurecode

Cores perdual-chipmodulePower saving
mode frequency[GHz]

Static mode
frequency[GHz]

Maximum performance mode
frequency range
[GHz]

#EPG9

12

2.0

2.90

2.90 to 4.0 (max)

#EPG8

16

2.0

2.75

2.75 to 4.0 (max)

#EPGA

20

2.0

2.45

2.45 to 3.9 (max)Table 2-9 Characteristic frequencies and frequency ranges for Power S1024 servers
Featurecode

Cores perdual-chipmodulePower saving
mode frequency[GHz]

Static mode
frequency[GHz]

Maximum performance mode
frequency range
[GHz]

#EPGM

12

2.0

3.40

3.40 - 4.0

#EPGC

16

2.0

3.10

3.10 - 4.0

#EPGD

24

2.0

2.75

2.75 - 3.9

The controls for all power saver modes are available on the Advanced System Management
Interface (ASMI) and can be dynamically modified. A system administrator can also use the
Hardware Management Console (HMC) to set power saver mode or to enable static mode or
MPM.

72

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

Figure 2-15 shows the ASM interface menu for Power and Performance Mode Setup on a
Power10 processor-based scale-out server.

Figure 2-15 ASMI menu for Power and Performance Mode setup

Figure 2-16 shows the HMC menu for power and performance mode setup.

Figure 2-16 HMC menu for Power and Performance Mode setup

Chapter 2. Architecture and technical overview

732.2.14 Comparing Power10, Power9, and Power8 processors
The Power10 processor-based systems are available in three different processor module
packages:򐂰 Single-chip modules (SCMs), which are based on one Power10 chip. These modules
allow for the highest core performance.
򐂰 Dual-chip modules (DCMs), which combine two Power10 chips where both Power10 chips
contribute active processor cores. This configuration allows for processors with thememory and I/O bandwidth of two Power10 chips in a single socket.
򐂰 eSCMs, which combine two Power10 chips but all active processor core resources arebundled on one of the two chips. This configuration allows for processors with a lower core
count, but the full I/O bandwidth of both Power10 chips.
The Power E1080 enterprise class systems exclusively use SCM modules with up to 15
active SMT8 capable cores. These SCM processor modules are structural and performance
optimized for usage in scale-up multi-socket systems.
The Power E1050 enterprise class system exclusively uses DCM modules with up to 24
active SMT8 capable cores. This configuration maximizes the core density and I/Ocapabilities of these servers.
DCM modules with up to 24 active SMT8-capable cores are used in 1 socket Power S1014, 1or 2-socket Power S1022 and Power S1024 servers. eSCMs with up to eight active
SMT8-capable cores are used in 1-socket Power S1014 and 1- or 2-socket Power S1022s
servers.
DCM and eSCM modules are designed to support scale-out 1- to 4-socket Power10
processor-based servers.
Table 2-10 compares key features and characteristics of the Power10, Power9, and Power8
processor implementations as used in the range of Power10 processor-based servers.
Table 2-10 Comparison of the Power10 processor technology to prior processor generations
Characteristics

Power10DCM

eSCM

Power9Power8

14 nm

22 nm

SCM

Technology

7 nm

Die size

2 x 602 mm2

2 x 602 mm2

602 mm2

693 mm2

649 mm2

Processor module size

74.5 mm x85.75 mm74.5 mm x85.75 mm68.5 mm x
77.5 mm68.5 mm x
68.5 mm71.5 mm x
71.5 mm

Number of transistors

2 x 18 billion

2 x 18 billion

18 billion

8 billion

4.2 billion

Maximum cores

24

8

15

12

12

Maximum hardware threads
per core888Maximum static frequency /high-performance frequency
rangea3.4 - 4.0 GHz

3.9 - 4.0 GHz

4.15 GHz

L2 Cache per core2048 KB

512 KB

512 KB74

3.0 - 3.9 GHz

3.6 - 4.15 GHz

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

Characteristics

Power10DCM

eSCM

Power9Power8SCM

L3 Cache

8 MB of L3 cache per core with each core having
access to the full 120 MB of L3 cache, on-chiphigh-efficiency SRAMb

10 MB of L3
cache per corewith each core
having accessto the full
120 MB of L3
cache, on-chipeDRAMc8 MB of L3
cache per corewith each core
having accessto the full
96 MB of L3
cache, on-chipeDRAM

Supported
memory technology

DDR4d: Packaged on differential DIMMs with more
performance and resilience capabilities

DDR4 and
DDR3e

DDR3 andDDR4

I/O bus

PCIe Gen 5

PCIe Gen 4

PCIe Gen 3

a. Best of class typical frequency range where the lower limit of the range coincides with the maximum
static/nominal frequency.
b. Static random-access memory.
c. Embedded dynamic random-access memory.
d. The Power10 processor memory logic and the memory subsystem of Power10 processor-based servers can
support DDR5 or other memory technologies in the future.
e. Only DDR3 memory CDIMMs, which are transferred in the context of a model upgrade from Power E870, Power
E870C, Power E880, or Power E880C systems to a Power E980 server, are supported.

2.3 Memory subsystem
The Power10 processor contains eight independent MCUs that provide the system memory
interface between the on-chip SMP interconnect fabric and the OMI links. Each MCU maps ina one-to-one relation to an OMI port, which is also referred to as memory channel. Each OMI
port in turn supports two OMI links, for a total of 16 OMI links per chip. The OMI links of a
specific OMI port are also referred to as memory subchannel A and B.
As used in Power S1022 and Power S1024 servers, the Power10 DCM only half of the MCUs
and OMI links on each Power10 chip are used, which results in 16 total OMI links per DCM.
One IBM DDIMM connects to each OMI link, for a total of 32 DDIMMs when two DCM
modules are configured.
As used in Power S1014 and Power S1022s servers, the Power10 eSCM and the Power10
DCM on the 24-core processor supports only eight configured OMI links per module, which is
the total available for one socket servers. When using the second socket in a two socket
server there are a total of 16 DDIMMs.
The DDIMM cards are available in two rack unit (2U) and four rack unit (4U) form factors andare based on DDR4 DRAM technology. Depending on the form factor and the module
capacity of 16 GB, 32 GB, 64 GB, 128 GB, or 256 GB data rates of 2666 MHz, 2933 MHz, or
3200 MHz are supported.
DDIMM cards contain an OMI attached memory buffer, power management interface
controllers (PMICs), an Electrically Erasable Programmable Read-only Memory (EEPROM)
chip for vital product data, and the DRAM elements.
The PMICs supply all voltage levels that are required by the DDIMM card so that no separate
voltage regulator modules are needed. For each 2U DDIMM card, one PMIC plus one spareare used.

Chapter 2. Architecture and technical overview

75

For each 4U DDIMM card, two PMICs plus two spares are used. Because the PMICs operate
as redundant pairs, no DDIMM is called for replacement if one PMIC in each of the redundantpairs is still functional.
Figure 2-17 shows the memory logical diagram for DCM-based Power S1022 and PowerS1024 scale-out servers.
D1P1-OMI4A DDR4 Differential DIMM: P0-C25
D1P1-OMI4B DDR4 Differential DIMM: P0-C26
OMI4A
OMI4B
OMI5A
OMI5B

P1D1-OMI5A DDR4 Differential DIMM: P0-C48
P1D1-OMI5B DDR4 Differential DIMM: P0-C43

OMI6A
OMI6B

D1P1-OMI6A DDR4 Differential DIMM: P0-C47
D1P1-OMI6B DDR4 Differential DIMM: P0-C46

OP4

OMI7A
OMI7B
OP1

D1P1-OMI7A DDR4 Differential DIMM: P0-C44
D1P1-OMI7B DDR4 Differential DIMM: P0-C45

OP6

OP2

DCM-1
P1 / Chip-1

DCM-1
P0 / Chip-0

OMI3B
OMI3A

D1P0-OMI3B DDR4 Differential DIMM: P0-C42
D1P0-OMI3A DDR4 Differential DIMM: P0-C41

OMI2B
OMI2A

D1P0-OMI2B DDR4 Differential DIMM: P0-C39
D1P0-OMI2A DDR4 Differential DIMM: P0-C38

OMI1B
OMI1A

D1P0-OMI1B DDR4 Differential DIMM: P0-C40

OMI0B
OMI0A

D1P0-OMI1A
P0-C21DDR4 Differential DIMM: P0-C21
D1P0-OMI0B
P0-C20 DDR4 Differential DIMM: P0-C20
D1P0-OMI0A DDR4 Differential DIMM: P0-C19
D0P1-OMI4A DDR4 Differential DIMM: P0-C18
P0-C17 DDR4 Differential DIMM: P0-C17
D0P1-OMI4B

OMI4A
OMI4B
DCM-0
P1 / Chip-1

OMI5A
OMI5B

D0P1-OMI5B DDR4 Differential DIMM: P0-C35

OMI6A
OMI6B

D0P1-OMI6A DDR4 Differential DIMM: P0-C37
D0P1-OMI6B DDR4 Differential DIMM: P0-C36

OMI7A
OMI7B

D0P1-OMI7A DDR4 Differential DIMM: P0-C34
D0P1-OMI7B DDR4 Differential DIMM: P0-C33

OP4

OP1

OP6

OP2

DCM-0
P0 / Chip-0

P0-C16DDR4 Differential DIMM: P0-C16
D0P1-OMI5A

OMI3B
OMI3A

D0P0-OMI3B DDR4 Differential DIMM: P0-C30
D0P0-OMI3A DDR4 Differential DIMM: P0-C31

OMI2B
OMI2A

D0P0-OMI2B DDR4 Differential DIMM: P0-C29
D0P0-OMI2A DDR4 Differential DIMM: P0-C28

OMI1B
OMI1A

D0P0-OMI1B DDR4 Differential DIMM: P0-C32
D0P0-OMI1A DDR4 Differential DIMM: P0-C27

OMI0B
OMI0A
D0P0-OMI0B DDR4 Differential DIMM: P0-C13
D0P0-OMI0A DDR4 Differential DIMM: P0-C12

Figure 2-17 Memory logical diagram of DCM-based Power S1022 and Power S1024 servers

All active OMI subchannels are indicated by the labels OMI1A/OMI1B to OMI7A/OMI7B for
the respective DCM chips.
The DDIMM label begins with the DCM-chip-link designation. For example, D1P1-OMI4A
refers to a memory module that is connected to the OMI link OMI4A on chip-1 (processor-1)
of DCM-1.
The DDIMM label concludes with the physical location code of the memory slot. In our
example of the D1P1-OMI4A connected DDIMM, the location code P0-C25 reveals that the
DDIMM is plugged into slot connector 25 (C25) on the main board (P0). Although Figure 2-17
resembles the physical placement and the physical grouping of the memory slots, some slot
positions were moved for the sake of improved clarity.
The memory logical diagram for 1-socket DCM-based Power10 scale-out servers easily canbe seen in Figure 2-17 if you conceptually omit the DCM-1 processor module, including all of
the attached DDIMM memory modules.

76

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

Figure 2-18 shows the memory logical diagram for eSCM-based Power10 scale-out servers
and the DCM based 24-core module in the Power S1014. Only half of the OMI links areavailable for eSCMs when compared to DCMs in the Power S0122 and Power S1024 and allactive OMI links are on chip-0 of each eSCM or 24-core DCM.

eSCM-1P1 / Chip-1

OP4

OP1

OP6

OP2

eSCM-1P0 / Chip-0

OMI3B
OMI3A

S1P0-OMI3B DDR4 Differential DIMM: P0-C42
S1P0-OMI3A DDR4 Differential DIMM: P0-C41

OMI2B
OMI2A

S1P0-OMI2B DDR4 Differential DIMM: P0-C39
S1P0-OMI2A DDR4 Differential DIMM: P0-C38

OMI1B
OMI1A

S1P0-OMI1B DDR4 Differential DIMM: P0-C40

OMI0B
OMI0A

S1P0-OMI1A
P0-C21DDR4 Differential DIMM: P0-C21
S1P0-OMI0B
P0-C20 DDR4 Differential DIMM: P0-C20
S1P0-OMI0A DDR4 Differential DIMM: P0-C19

eSCM-0P1 / Chip-1

OP4

OP1

OP6

OP2

eSCM-0P0 / Chip-0

OMI3B
OMI3A

S0P0-OMI3B DDR4 Differential DIMM: P0-C30
S0P0-OMI3A DDR4 Differential DIMM: P0-C31

OMI2B
OMI2A

S0P0-OMI2B DDR4 Differential DIMM: P0-C29
S0P0-OMI2A DDR4 Differential DIMM: P0-C28

OMI1B
OMI1A

S0P0-OMI1B DDR4 Differential DIMM: P0-C32
S0P0-OMI1A DDR4 Differential DIMM: P0-C27

OMI0B
OMI0A
S0P0-OMI0B DDR4 Differential DIMM: P0-C13
S0P0-OMI0A DDR4 Differential DIMM: P0-C12

Figure 2-18 Memory logical diagram of eSCM-based Power S1022s server

Again, the memory logical diagram for 1-socket eSCM-based Power10 scale-out servers caneasily be deduced from Figure 2-18 if you conceptually omit the eSCM-1 processor module
including all of the attached DDIMM memory modules. The memory logical diagram of the
24-core S1014 can also be deduced by taking the single socket view, but using a second fully
functional Power10 chip in Chip-1 position while all of the memory connections remain on
Chip-0.
Physically, the memory slots are organized into the following groups, as shown in Figure 2-19
on page 78:
򐂰 C12 and C13 are placed at the outward-facing side of eSCM-0/DCM-0 and are connected
to chip-0 of the named processor modules.
򐂰 C25 and C26 are placed at the outward-facing side of eSCM-1/DCM-1 and are connected
to chip-1 of the named processor modules.
򐂰 C27 to C37 (11 slots) are placed toward the front of the server and are assigned to the firstprocessor module (eSCM-0/DCM-0).
򐂰 C38 to C48 (11 slots) are placed toward the front of the server and are assigned to thesecond processor module (eSCM-1/DCM-1).

Chapter 2. Architecture and technical overview77򐂰 C16 to C21 (six slots) are placed between the processor modules where the first half (C16
to C18) is wired to eSCM-0/DCM-0 and the second half (C19 to C21) to eSCM-1/DCM-1.

P0-C0

P0-C26

P0-C25

P0-C1
P0-C2

DCM-1 /eSCM-1

P0-C3
P0-C4

P0-C21
P0-C20P0-C19
P0-C18
P0-C17
P0-C16

Power Supply Units

P0-C5 eBMC
P0-C6 OpenCAPI

DCM-0 /eSCM-0

P0-C7
P0-C8
P0-C9
P0-C10P0-C11

P0-C12

P0-C13

P0-C48
P0-C47
P0-C46
P0-C45
P0-C44
P0-C43
P0-C42
P0-C41
P0-C40P0-C39
P0-C38

P0-C37
P0-C36
P0-C35
P0-C34
P0-C33
P0-C32
P0-C31
P0-C30P0-C29
P0-C28
P0-C27

Optional
NVMe
Devices

Optional
NVMe
DevicesFigure 2-19 Memory module physical slot locations and DDIMM location codes

Figure 2-19 also shows the physical location of the ten PCIe adapter slots C0 to C4 and C7 toC11. Slot C5 is always occupied by the eBMC and slot C6 reserves the option to establish an
external OpenCAPI based connection in the future.

2.3.1 Memory feature and placement rules
This section discusses the memory feature codes, memory feature order rules, and memory
placement rules for the Power10 processor-based scale-out servers:
򐂰 Power S1014 memory feature and placement rules򐂰 Power S1022s memory feature and placement rules򐂰 Power S1022 and Power S1024 memory feature and placement rules
In general, the preferred approach is to install memory evenly across all processor modules inthe system. Balancing memory across the installed processor modules enables memory
access in a consistent manner and typically results in the best possible performance for yourconfiguration. Account for any plans for future memory upgrades when you decide whichmemory feature size to use at the time of the initial system order.

Power S1014 memory feature and placement rules
Table 2-11 on page 79 lists the available memory feature codes for Power S1014 servers. No
specific memory enablement features are required and the entire physical DDIMM capacity ofa memory feature is enabled by default. The memory placement rules are the same for boththe eSCM modules and the DCM module.

78

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

Table 2-11 Memory feature codes for Power S1014 servers
Feature code

Description#EM6N

32 GB (2x16GB) DDIMMs, 3200 MHz, 8 Gbit DDR4 memory#EM6W

64 GB (2x32 GB) DDIMMs, 3200 MHz, 8 Gbit DDR4 memory#EM6X

128 GB (2x64 GB) DDIMMs, 3200 MHz, 16 Gbit DDR4 memory#EM6Ya256 GB (2x128 GB) DDIMMs, 2666 MHz, 16 Gbit DDR4 memorya. The 128 GB DDIMM parts in feature code #EM6Y are planned to be available on 9 December
2022.

The memory DDIMMs must be ordered in pairs by using the following feature codes:򐂰򐂰򐂰򐂰

16 GB: #EM6N
32 GB: #EM6W
64 GB: EM6X
128 GB: EM6Y

The minimum ordering granularity is one memory feature and all DDIMMs must be of thesame feature code type for a Power S1014 server. A maximum of four memory feature codes
can be configured to cover all of the available eight memory slots.
The minimum memory capacity requirement of the Power S1014 server is 32 GB, which canbe fulfilled by one #EM6N feature.
The maximum memory capacity is 64 GB if the 4-core eSCM module (#EPG0) was chosen
and IBM i is the primary operating system for the server. This configuration can be realized byusing one #EM6W memory feature or two #EM6N memory features.
If the Power S1014 server is based on the 8-core eSCM module or the 24-core DCM module,
a maximum memory capacity of 1 TB is supported. This specific maximum configuration
requires four #EM6Y memory features. Until the availability of the 128 GB memory DDIMMs(planned for 18 November 2022), the maximum memory capacity is 512 GB.
Figure 2-20 shows the DDIMM plug sequence for Power S1014 servers.
Power10 eSCM-0 Chip-0
OMI0
OMI1
OMI2
OMI3
A
B
A
B
A
B
A
B
C12 C13 C27 C32 C28 C29 C31 C30
1
1
2
2
3
3
4
4

Figure 2-20 DDIMM plug sequence for Power S1014 servers

All memory modules are attached to the first chip (chip-0) and are of the same type as
highlighted by the cells that are shaded in green in Figure 2-20.
The memory controllers and the related open memory interface (OMI) channels arehighlighted in bright yellow in Figure 2-20 and labeled OMI0, OMI1, OMI2, and OMI3.
The related OMI links (subchannels A and B) are highlighted in light yellow in Figure 2-20 andthe physical memory slot location codes are highlighted in light blue:򐂰 First DDIMM pair is installed on links OMI1A and OMI1B in slots C27 and C32
Chapter 2. Architecture and technical overview

79򐂰 Second DDIMM pair is installed on links OMI1A and OMI1B in slots C12 and C13
򐂰 Third DDIMM pair is installed on links OMI2A and OMI2B in slots C28 and C29
򐂰 Fourth DDIMM pair is installed on links OMI3A and OMI3B in slots C31 and C30

Power S1022s memory feature and placement rules
Table 2-12 lists the available memory feature codes for Power S1022s servers. No specificmemory enablement features are required and the entire physical DDIMM capacity of amemory feature is enabled by default.
Table 2-12 Memory feature codes for Power S1022s servers
Feature code

Description#EM6N

32 GB (2x16GB) DDIMMs, 3200 MHz, 8 Gbit DDR4 memory#EM6W

64 GB (2x32GB) DDIMMs, 3200 MHz, 8 Gbit DDR4 memory#EM6X

128 GB (2x64GB) DDIMMs, 3200 MHz, 16 Gbit DDR4 memory#EM6Ya256 GB (2x128GB) DDIMMs, 2666 MHz, 16 Gbit DDR4 memorya. The 128 GB DDIMM parts in feature code #EM6Y are planned to be available on 9 December
2022

The memory DDIMMs are bundled in pairs by using the following feature codes:򐂰򐂰򐂰򐂰

16 GB: #EM6N
32 GB: #EM6W
64 GB: #EM6X
128 GB: #EM6Y

The Power S1022s server supports the Active Memory Mirroring (AMM) feature #EM8G.
AMM requires a minimum four configured memory feature codes with a total of eight DDIMM
modules.

Memory rules for 1-socket Power S1022s servers
The minimum ordering granularity is one memory feature and all DDIMMs must be of thesame feature code type for a Power S1022s server in 1-socket configuration. A maximum offour memory feature codes can be configured to cover all of the available eight memory slots.
The minimum memory capacity limit of the Power S1022s 1-socket server is 32 GB, which
can be fulfilled by one #EM6N feature.
The maximum memory capacity of the 1-socket Power S1022s is 1 TB. This specificmaximum configuration requires four #EM6Y memory features. Until the availability of the
128 GB memory DDIMMs (planned for 9 December 2022), the maximum memory capacity is
512 GB.

80

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

Figure 2-21 shows the DDIMM plug sequence for Power S1022s servers in 1-socket
configurations (the rules are identical to the previously described for Power S1014 servers).
Power10 eSCM-0 Chip-0
OMI0
OMI1
OMI2
OMI3
A
B
A
B
A
B
A
B
C12 C13 C27 C32 C28 C29 C31 C30
1
1
2
2
3
3
4
4

Figure 2-21 DDIMM plug sequence for Power S1022s 1-socket servers

All memory modules are attached to the first chip (chip-0) of the single eSCM (eSCM-0) andare of the same type as highlighted in green in Figure 2-21.
The memory controllers and the related open memory interface (OMI) channels arehighlighted in bright yellow in Figure 2-21 and labeled OMI0, OMI1, OMI2, and OMI3.
The related OMI links (subchannels A and B) are highlighted in light yellow in Figure 2-21 andthe physical memory slot location codes are highlighted in light blue:򐂰򐂰򐂰򐂰First DDIMM pair is installed on links OMI1A and OMI1B in slots C27 and C32
Second DDIMM pair is installed on links OMI1A and OMI1B in slots C12 and C13
Third DDIMM pair is installed on links OMI2A and OMI2B in slots C28 and C29
Fourth DDIMM pair is installed on links OMI3A and OMI3B in slots C31 and C30

Memory rules for 2-socket Power S1022s servers
If only one memory feature type is used throughout the Power S1022s server, the minimum
ordering granularity is one memory feature. In this scenario, all of the DDIMMs adhere to thesame technical specification.
Figure 2-22 shows the DDIMM plug sequence for Power S1022s servers in 2-socket
configuration when only a single memory feature code type is used.
Power10 eSCM-0 Chip-0
Power10 eSCM-1 Chip-0
OMI0
OMI1
OMI2
OMI3
OMI0
OMI1
OMI2
OMI3
A
B
A
B
A
B
A
B
A
B
A
B
A
B
A
B
C12 C13 C27 C32 C28 C29 C31 C30 C19 C20 C21 C40 C38 C39 C41 C42
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8

Figure 2-22 DDIMM plug sequence for Power S1022s 2-socket servers with single memory feature

The memory modules are attached to the first chip (chip-0) of the first eSCM (eSCM-0) or to
the first chip (chip-0) of the second eSCM (eSCM-1) and are of the same type, as highlighted
in green in Figure 2-22.
The memory controllers and the related open memory interface (OMI) channels arehighlighted in bright yellow in Figure 2-22 and labeled OMI0, OMI1, OMI2, and OMI3.

Chapter 2. Architecture and technical overview

81

The related OMI links (subchannels A and B) are highlighted in light yellow in Figure 2-22 on
page 81 and the physical memory slot location codes are highlighted in light blue:򐂰 First DDIMM pair is installed on links OMI1A and OMI1B in slots C27 and C32 of eSCM-0
򐂰 Second DDIMM pair is installed on links OMI1A and OMI1B in slots C21 and C40 ofeSCM-1
򐂰 Third DDIMM pair is installed on links OMI0A and OMI0B in slots C12 and C13 of eSCM-0
򐂰 Fourth DDIMM pair is installed on links OMI0A and OMI0B in slots C19 and C20 ofeSCM-1
򐂰 Fifth DDIMM pair is installed on links OMI2A and OMI2B in slots C28 and C29 of eSCM-0
򐂰 Sixth DDIMM pair is installed on links OMI2A and OMI2B in slots C38 and C39 of eSCM-1
򐂰 Seventh DDIMM pair is installed on links OMI3A and OMI3B in slots C31 and C30 ofeSCM-0򐂰 Eighth DDIMM pair is installed on links OMI3A and OMI3B in slots C41 and C42 of
eSCM-1
If the 2-socket configuration is based on two different memory feature types, the minimum
ordering granularity is two identical memory feature codes (4 DDIMMs). All DDIMMs that are
attached to a eSCM must be of the same technical specification, which implies that they areof the same memory feature code type.
It is not required to configure equal quantities of the two memory feature types. A maximum offour configured entities of each memory feature type (eight DDIMMs of equal specification)
can be used.
Configurations with more than two memory feature types are not supported.
Figure 2-23 shows the DDIMM plug sequence for Power S1022s servers in 2-socket
configuration when that two different memory feature code types are used.
Power10 eSCM-0 Chip-0
Power10 eSCM-1 Chip-0
OMI0
OMI1
OMI2
OMI3
OMI0
OMI1
OMI2
OMI3
A
B
A
B
A
B
A
B
A
B
A
B
A
B
A
B
C12 C13 C27 C32 C28 C29 C31 C30 C19 C20 C21 C40 C38 C39 C41 C42
1
1
1
1
2
2
2
2
3
3
3
3
4
4
4
4
Figure 2-23 DDIMM plug sequence for Power S1022s 2-socket servers with two memory feature types

The memory modules of the first feature type are attached to the first chip (chip-0) of the firsteSCM (eSCM-0) and are highlighted in green in Figure 2-23. The memory modules of thesecond feature type are attached to the first chip (chip-0) of the second eSCM (eSCM-1) andare highlighted in purple.
The memory controllers and the related open memory interface (OMI) channels arehighlighted in bright yellow in Figure 2-23 and labeled OMI0, OMI1, OMI2, and OMI3 for botheSCMs.

82

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

The related OMI links (subchannels A and B) are highlighted in light yellow in Figure 2-23 on
page 82 and the physical memory slot location codes are highlighted in light blue. EacheSCM can be viewed as an independent memory feature type domain with its own inherent
plug sequence.
The following plug sequence is used for the memory feature type for eSCM-0:
򐂰 First DDIMM pair is installed on links OMI1A and OMI1B in slots C27 and C32 of eSCM-0
򐂰 Second DDIMM pair is installed on links OMI1A and OMI1B in slots C12 and C13 ofeSCM-0򐂰 Third DDIMM pair is installed on links OMI2A and OMI2B in slots C28 and C29 of eSCM-0
򐂰 Fourth DDIMM pair is installed on links OMI3A and OMI3B in slots C31 and C30 ofeSCM-0The following plug sequence is used for the memory feature type for eSCM-1:
򐂰 First DDIMM pair is installed on links OMI1A and OMI1B in slots C21 and C40 of eSCM-1
򐂰 Second DDIMM pair is installed on links OMI0A and OMI0B in slots C19 and C20 ofeSCM-1
򐂰 Third DDIMM pair is installed on links OMI2A and OMI2B in slots C38 and C39 of eSCM-1
򐂰 Fourth DDIMM pair is installed on links OMI3A and OMI3B in slots C41 and C42 of
eSCM-1
The maximum memory capacity of the 2-socket Power S1022s is 2 TB. This specificmaximum configuration requires eight #EM6Y memory features with a total of 16 128-GB
DDIMM modules. Until the availability of the 128 GB memory DDIMMs (planned for
18 November 2022), the maximum memory capacity is 1 TB.

Power S1022 and Power S1024 memory feature and placement rules
Table 2-13 lists the available memory feature codes for Power S1022 servers. No specificmemory enablement features are required and the entire physical DDIMM capacity of amemory feature is enabled by default.
Table 2-13 Memory feature codes for Power S1022 servers
Feature code

Description#EM6N

32 GB (2x16GB) DDIMMs, 3200 MHz, 8 Gbit DDR4 memory#EM6W

64 GB (2x32GB) DDIMMs, 3200 MHz, 8 Gbit DDR4 memory#EM6X

128 GB (2x64GB) DDIMMs, 3200 MHz, 16 Gbit DDR4 memory#EM6Ya256 GB (2x128GB) DDIMMs, 2666 MHz, 16 Gbit DDR4 memorya. The 128 GB DDIMM parts in feature code #EM6Y are planned to be available on November
18th 2022

The 16 GB, 32 GB, 64 GB, and 128 GB memory DDIMMs for Power S1022 servers arebundled in pairs through the related memory feature codes #EM6N, #EM6W, EM6X, and
EM6Y.
The DDIMMs of all memory features are in a form factor suitable for two rack units (2U) highPower S1022 servers.

Chapter 2. Architecture and technical overview

83Table 2-14 lists the available memory feature codes for Power S1024 servers. No specificmemory enablement features are required and the entire physical DDIMM capacity of amemory feature is enabled by default.
Table 2-14 Memory feature codes for Power S1024 servers
Feature code

Description#EM6N

32 GB (2x16GB) DDIMMs, 3200 MHz, 8-bit DDR4 memory#EM6W

64 GB (2x32GB) DDIMMs, 3200 MHz, 8-Gbit DDR4 memory#EM6X

128 GB (2x64GB) DDIMMs, 3200 MHz, 16-Gbit DDR4 memory#EM6Ua256 GB (2x128GB) DDIMMs, 2933 MHz, 16-Gbit DDR4 memory#EM78

512 GB (2x256GB) DDIMM, 2933 MHz, 16-Gbit DDR4 memorya. The 128 GB DDIMM parts in feature code #EM6U and 256 GB DDIMM parts in feature code
#EM78 are planned to be available on November 18th 2022

The memory DDIMMs for Power S1024 servers are bundled by using the following memory
feature codes:
򐂰
򐂰
򐂰
򐂰
򐂰

16 GB: #EM6N
32 GB: #EM6W
64 GB: #EM6X
128 GB: #EM6U
256 GB: #EM78

The DDIMMs of the memory features #EM6N, #EM6W, and #EM6X are in a form factor of two
rack units (2U). The DDIMMs of this types are extended by spacers to fit in four rack units(4U) high Power S1024 servers.
The 128 GB and 256 GB DDIMMs of memory features #EM6U and #EM78 are of higher
capacity that is compared with their 16 GB, 32 GB, and 64 GB counterparts; therefore, theymust fully use the 4U height of Power S1024 servers.
The Power S1024 server does not support a memory configuration that includes DDIMMs ofdifferent form factors. All memory modules must be 2U DDIMM memory feature codes(#EM6N, EM6W, and EM6X) or all memory modules must be 4U DDIMM memory featurecodes (EM6U and EM78).
Note: Power S1024 servers in 2-socket configuration do not support the 4U DDIMM
memory feature codes #EM6U and #EM78 if the RDX USB Internal Docking Station for
Removable Disk Cartridge feature is installed.
The Power S1022 and Power S1024 servers support the Active Memory Mirroring (AMM)
Feature Code #EM8G. AMM requires a minimum four configured memory feature codes witha total of eight DDIMM modules.
The Power S1022 and Power S1024 server share most of the memory feature and placement
rules, which are described next.

Memory rules for 1-socket Power S1022 and Power S1024 servers
The minimum ordering granularity is one memory feature (two DDIMMs) and all DDIMMs
must be of the same Feature Code type for a Power S1022 or Power S1024 server in
1-socket configuration. A maximum of eight memory feature codes can be configured to cover
all of the available (16) memory slots.
84

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

The minimum memory capacity limit of the Power S1022 or the Power S1024 1-socket serveris 32 GB, which can be fulfilled by one #EM6N feature.
The maximum memory capacity of the Power S1022 in 1-socket configuration is 2 TB. This
specific maximum configuration requires eight #EM6Y memory features. Until the availabilityof the 128 GB memory DDIMMs (planned for 9 December 2022), the maximum memory
capacity is 1 TB.
The maximum memory capacity of the Power S1024 in 1-socket configuration is 4 TB. This
specific maximum configuration requires eight #EM78 memory features. Until the availabilityof the 128 GB memory DDIMMs and 256 GB memory DDIMMs (planned for 9 December2022), the maximum memory capacity is 1 TB.
Figure 2-24 shows the DDIMM plug sequence for Power S1022 or Power S1024 servers in
1-socket configuration.
Power10 DCM-0
Chip-0Chip-1
OMI0
OMI1
OMI2
OMI3
OMI4
OMI5
OMI6
OMI7
A
B
A
B
A
B
A
B
A
B
A
B
A
B
A
B
C12 C13 C27 C32 C28 C29 C31 C30 C18 C17 C16 C35 C37 C36 C34 C33
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
Figure 2-24 DDIMM plug sequence for Power S1022 and Power S1024 1-socket servers

The memory modules are attached to the first chip (chip-0) or the second chip (chip-1) of theconfigured DCM (DCM-0). All memory modules are of the same type as highlighted in green
in Figure 2-24.
The memory controllers and the related OMI channels are highlighted in bright yellow in
Figure 2-24 and labeled OMI0, OMI1, OMI2, OMI3, OMI4, OMI5, OMI6, OMI7, and OMI8.
The related OMI links (subchannels A and B) are highlighted in light yellow in Figure 2-24 andthe physical memory slot location codes are highlighted in light blue:򐂰 First DDIMM pair is installed on links OMI1A and OMI1B in slots C27 and C32 of chip-0
򐂰 Second DDIMM pair is installed on links OMI5A and OMI5B in slots C16 and C35 of chip-1
򐂰 Third DDIMM pair is installed on links OMI0A and OMI0B in slots C12 and C13 of chip-0
򐂰 Fourth DDIMM pair is installed on links OMI4A and OMI4B in slots C18 and C17 of chip-1
򐂰 Fifth DDIMM pair is installed on links OMI2A and OMI2B in slots C28 and C29 of chip-0
򐂰 Sixth DDIMM pair is installed on links OMI6A and OMI6B in slots C37 and C36 of chip-1
򐂰 Seventh DDIMM pair is installed on links OMI3A and OMI3B in slots C31 and C30 ofchip-0򐂰 Eighth DDIMM pair is installed on links OMI7A and OMI7B in slots C34 and C33 of chip-1

Chapter 2. Architecture and technical overview

85

Memory rules for 2-socket Power S1022 and Power S1024 servers
The minimum ordering granularity is two identical memory feature codes (four DDIMMs) forPower S1022 or Power S1024 server in 2-socket configuration.
The minimum memory capacity limit of the Power S1022 or the Power S1024 2-socket serveris 64 GB, which can be fulfilled by two #EM6N features.
The maximum memory capacity of the Power S1022 in 2-socket configuration is 4 TB. This
specific maximum configuration requires 16 #EM6Y memory features. Until the availability of
the 128 GB memory DDIMMs (planned for 9 December 2022), the maximum memory
capacity is 2 TB.
The maximum memory capacity of the Power S1024 in 2-socket configuration is 8 TB. This
specific maximum configuration requires 16 #EM78 memory features. Until the availability of
the 128 GB memory DDIMMs and 256 GB memory DDIMMs (planned for 9 December 2022),
the maximum memory capacity is 2 TB.
Regarding the memory plugging rules, the following configuration scenarios are supported
and must be considered separately:򐂰 Only one memory feature type is used across both sockets and all of the DDIMMs adhere
to the same technical specification.
򐂰 Two different memory feature codes with the corresponding different DDIMM
characteristics are configured. Each memory feature code type is assigned in a
one-to-one relation to one of the two DCM sockets.
It is not required to configure equal quantities of the two memory feature types. A
maximum of eight configured entities of each memory feature type (16 DDIMMs of equal
specification) are allowed.
Note: The Power S1022 nor the Power S1024 servers support memory configurations thatare based on more than two memory feature types.
Figure 2-25 shows the DDIMM plug sequence for Power S1022 and Power S1024 servers in
2-socket configuration when only a single memory feature code type is used. Each chip
(chip-0 and chip-1) of each DCM (DCM-0 and DCM-1) provide four memory channels formemory module access. All memory DDIMMs are of the same type, as highlighted in green in
Figure 2-25.
Power10 DCM-1

Power10 DCM-0
Chip-0Chip-0Chip-1Chip-1

OMI0

OMI1

OMI2

OMI3

OMI4

OMI5

OMI6

OMI7

OMI0

OMI1

OMI2

OMI3

OMI4

OMI5

OMI6

OMI7

A

A B

A

A

A

A

A

A

A

A

A

A

A

A

A

A

B

B

B

C12 C13 C27 C32 C28 C29 C31 C30 C18

1

B

B

B

B

1

1

B

B

B

2

3
4
5

6

4

5

6

6

7

7
8

6

7

8

Figure 2-25 DDIMM plug sequence for Power S1022 and Power S1024 2-socket servers

86

B

1

4

5
7

B

2
3

4

B

2

3
5

B

C17 C16 C35 C37 C36 C34 C33 C19 C20 C21 C30 C38 C39 C41 C42 C25 C26 C48 C43 C47 C46 C44 C45

23B

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

88

The memory controllers and the related OMI channels are highlighted in bright yellow in
Figure 2-25 on page 86 and labeled OMI0, OMI1, OMI2, OMI3, OMI4, OMI5, OMI6, OMI7,
and OMI8 for each configured DCM. The related OMI links (subchannels A and B) arehighlighted in light yellow in Figure 2-25 on page 86 and the physical memory slot location
codes are highlighted in light blue:򐂰 First double DDIMM pair is installed on links OMI1A and OMI1B in slots C27 and C32 ofchip-0 on DCM-0 and OMI1A and OMI1B in slots C21 and C30 of chip-0 on DCM-1
򐂰 Second double DDIMM pair is installed on links OMI5A and OMI5B in slots C16 and C35
of chip-1 on DCM-0 and OMI5A and OMI5B in slots C48 and C43 of chip-1 on DCM-1
򐂰 Third double DDIMM pair is installed on links OMI0A and OMI0B in slots C12 and C13 ofchip-0 on DCM-0 and OMI0A and OMI0B in slots C19 and C20 of chip-0 on DCM-1
򐂰 Fourth double DDIMM pair is installed on links OMI4A and OMI4B in slots C18 and C17 ofchip-1 on DCM-0 and OMI4A and OMI4B in slots C25 and C26 of chip-1 on DCM-1
򐂰 Fifth double DDIMM pair is installed on links OMI2A and OMI2B in slots C28 and C29 ofchip-0 on DCM-0 and OMI2A and OMI2B in slots C38 and C39 of chip-0 on DCM-1
򐂰 Sixth double DDIMM pair is installed on links OMI6A and OMI6B in slots C37 and C36 ofchip-1 on DCM-0 and OMI6A and OMI6B in slots C47 and C46 of chip-1 on DCM-1
򐂰 Seventh double DDIMM pair is installed on links OMI3A and OMI3B in slots C31 and C30
of chip-0 on DCM-0 and OMI3A and OMI3B in slots C41 and C42 of chip-0 on DCM-1
򐂰 Eighth double DDIMM pair is installed on links OMI7A and OMI7B in slots C34 and C33 ofchip-1 on DCM-0 and OMI7A and OMI7B in slots C44 and C45 of chip-1 on DCM-1
Figure 2-26 shows the DDIMM plug sequence for Power S1022 and Power S1024 servers in
2-socket configuration when two different memory feature code types are used.
P o we r 10

D C M -0

C hip-0

P o we r 10
C hip-1

D C M -1

C hip-0

C hip-1

OM I0

OM I1

OM I2

OM I3

OM I4

OM I5

OM I6

OM I7

OM I0

OM I1

OM I2

OM I3

OM I4

OM I5

A

B

A

A

A

A

B

A

B

A

A

B

A

B

A

A

B

A

A

B

A

C12

C13

C27

C18

C17

C16

C35

C34

C33

C19

C20

C38

C39

C25

C26

4

4

1

B

C32 C28B
C29B

C31 C30

C37 C36

1

5

P o we r 10

8

D C M -0

P o we r 10
C hip-1

C hip-0

OM I2

OM I3

OM I4

OM I5

OM I6

OM I7

OM I0

OM I1

OM I2

OM I3

OM I4

OM I5

A

A

A

B

A

B

A

A

B

A

B

A

A

B

A

A

B

A

C12

C13

C27

C18

C17

C16

C35

C34

C33

C19

C20

C38

C39

C25

C26

1

1

2

2

2

2

1

C32 C28C29

C31 C30

1

C37 C36

C21 C30

1
2

2

2
3

3

B

C41 C421B

C48 C43

1

OM I6
A

B

C47

C46

3

3

OM I7
A

B

C44 C45

1

3
3

4

B

2
3

4

8

C hip-1

OM I1
A

B

B

D C M -1

B

B

6

A

7

OM I0

B

6

OM I7
C44 C45

8

A

B

B
C46

5
7

C hip-0

A

2

6

7
8

OM I6
C47

3

4
6

B

C48 C431

5
7

C41 C42

2
3

5

B

2

3
4

B

C21 C30

1
2

3

B

4

3

4
4

4

4

4

Figure 2-26 DDIMM plug sequence for Power S1022 and Power S1024 2-socket servers

The memory modules of the first memory feature type are attached to the first chip (chip-0)
and second chip (chip-1) of the first DCM (DCM-0) as highlighted in green in FIGURE. The
memory modules of the second memory feature type are attached to the first chip (chip-0)
and second chip (chip-1) of the second DCM (DCM-1) as highlighted purple in Figure 2-26.
Each DCM can be viewed as an independent memory feature type domain with its own
inherent plug sequence.
The following plug sequence is used for the memory feature type for DCM-0:
򐂰 First double DDIMM pair is installed on links OMI1A and OMI1B in slots C27 and C32 ofchip-0 and OMI5A and OMI5B in slots C16 and C35 of chip-1 on DCM-0

Chapter 2. Architecture and technical overview

87򐂰 Second double DDIMM pair is installed on links OMI0A and OMI0B in slots C12 and C13
of chip-0 and OMI4A and OMI4B in slots C16 and C35 of chip-1 on DCM-0
򐂰 Third double DDIMM pair is installed on links OMI2A and OMI2B in slots C28 and C29 ofchip-0 and OMI6A and OMI6B in slots C37 and C36 of chip-1 on DCM-0
򐂰 Fourth double DDIMM pair is installed on links OMI3A and OMI3B in slots C31 and C30 ofchip-0 and OMI7A and OMI7B in slots C34 and C33 of chip-1 on DCM-0
The following plug sequence is used for the memory feature type for DCM-1:
򐂰 First double DDIMM pair is installed on links OMI1A and OMI1B in slots C21 and C40 ofchip-0 and OMI5A and OMI5B in slots C48 and C43 of chip-1 on DCM-1
򐂰 Second double DDIMM pair is installed on links OMI0A and OMI0B in slots C19 and C20
of chip-0 and OMI4A and OMI4B in slots C25 and C26 of chip-1 on DCM-1
򐂰 Third double DDIMM pair is installed on links OMI2A and OMI2B in slots C38 and C39 ofchip-0 and OMI6A and OMI6B in slots C47 and C46 of chip-1 on DCM-1
򐂰 Fourth double DDIMM pair is installed on links OMI3A and OMI3B in slots C41 and C42 ofchip-0 and OMI7A and OMI7B in slots C44 and C45 of chip-1 on DCM-1

2.3.2 Memory bandwidth
The Power10 DCM supports 16 open memory interface (OMI) links, and the Power10 eSCM
supports eight OMI links. One DDIMM is driven by each OMI link in turn. One OMI linkrepresents a bundle of eight lanes that can transfer 1 byte with one transaction per direction.
The Power10 processor-based scale-out servers offers four different DDIMM sizes for all
server models: 16 GB, 32 GB, 64 GB, and 128 GB. The 16 GB, 32 GB, and 64 GB DDIMMs
run at a data rate of 3200 Mbps.
The DDIMMs of 128 GB capacity and 2U form factor are configurable for Power S1014,
Power S1022s, and Power S1024 servers and run at a data rate of 2666 Mbps.
The 128 GB DDIMMs of 4U form factor are exclusively available for Power S1024 servers,
which run at a slightly higher data rate of 2933 Mbps. Only Power S1024 servers can use another 4U form factor DDIMM type that holds 256 GB of data and is running at 2933 Mbps.
Table 2-15 lists the available DDIMM capacities and their related maximum theoretical
bandwidth figures per OMI link, Power10 eSCM, and Power10 DCM.
Table 2-15 Memory bandwidth of supported DDIMM sizes
DDIMM capacity

DRAM data
rate

Maximumtheoretical
bandwidth per
OMI link

Maximumtheoretical
bandwidth pereSCMa

Maximumtheoretical
bandwidth per
DCM

16 GB, 32 GB, 64 GB

3200 Mbps

25.6 GBps

204.8 GBps

409.6 GBps

128 GB

2666 Mbps

21.3 GBps

170.4 GBps

340.8 GBps

128 GB, 256 GB

2933 Mbps

23.5 GBps

187.7 GBps

375.4 GBps

a. DDIMM modules that are attached to one DCM or eSCM must be all of the same size.

88

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

Memory bandwidth considerations
Power10 processor-based scale-out servers are memory performance-optimized with eight
DDIMM slots that are available per eSCM processor module and 16 DDIMM slots per DCM
processor module.
Each DDIMM slot is serviced by one OMI link (memory subchannel). The maximum
bandwidth of the system depends on the number of OMI links that are used and the data rateof the DDIMMs that populate the configured links.
To calculate the maximum memory bandwidth of a system, use the following formula:򐂰 1-socket and 2-socket configurations are based on one memory feature code type:
Maximum Bandwidth = Number of DDIMMs x maximum bandwidth per OMI link as
determined by the DRAM data rate
򐂰 2-socket configurations based on two memory feature code type:
Maximum Bandwidth = Number of DDIMMs of the first memory feature code type x
maximum bandwidth per OMI link as determined by the related DRAM data rate + Numberof DDIMMs of the second memory feature code type x maximum bandwidth per OMI link
as determined by the related DRAM data rate.
Important: For the best possible performance, it is generally recommended that memory
is installed evenly in all memory slots and across all configured processor modules.
Balancing memory across the installed system planar cards enables memory access in aconsistent manner and typically results in better performance for your configuration.
Table 2-16 lists the maximum memory bandwidth for the Power S1014 and Power S1022s
servers, depending on the number of DDIMMs that are used and the DRAM data rate of theselected DDIMM type. The listing accounts for the minimum memory feature code order
granularity. Unsupported configurations are indicated by a “—” hyphen.
Table 2-16 Maximum memory bandwidth for the Power S1014 and Power S1022s servers
Maximum bandwidth based on
3200 Mbps data rate DDIMMs (GBps)a

Maximum bandwidth based on
2666 Mbps data rate DDIMMs (GBps)

Power S1014

Power S1022s

Power S1014

Power S1022s

2

51

51

43

43

4

102

102

85

85

6

154

154

128

128

8

205

205

170

170

10

—

256

—

213

12

—

307

—

256

14

—

358

—

298

16

—

410

—

341

DDIMM
quantitya. Numbers are rounded to the nearest integer.

Chapter 2. Architecture and technical overview

89Table 2-17 lists the maximum memory bandwidth for the DCM-based Power S1022 andPower S1024 servers, depending on the number of DDIMMs that are used, the DRAM data
rate of the selected DDIMM type, and the number of configured sockets. The listing accounts
for the minimum memory feature code order granularity and pertains to configurations thatare based on only one single memory feature code type. Unsupported configurations areindicated by a “—” hyphen.
Table 2-17 Maximum memory bandwidth for the Power S1022 and Power S1024 servers
Power S1022 and Power S1024
maximum bandwidth based on
3200 Mbps data rate DDIMMs (GBs)aPower S1024 maximum bandwidth basedon 2933 Mbps data rate DDIMMs (GBs)

1-socketconfiguration

2-socketconfiguration

1-socketconfiguration

2-socketconfiguration

2

51

—

47

—

4

102

102

94

94

6

154

—

141

—

8

205

205

188

188

10

256

—

235

—

12

307

307

282

282

14

358

—

329

—

16

410

410

376

376

18

—

—

—

—

20

—

512

—

470

22

—

—

—

—

24

—

614

—

564

26

—

—

—

—

28

—

717

—

658

30

—

—

—

—

32

—

819

—

752

DDIMM
quantitya. Numbers are rounded to the nearest integer.

2.4 Internal I/O subsystem
The internal I/O subsystem of the Power S1014, S1022s, S1022, and S1024 servers isconnected to the PCIe Express controllers on the Power10 chips in the system. Each chip
features two PCI Express controllers (PECs), which support up to three PCI host bridges(PHBs) that directly connect to a PCIe slot or device.
PEC0 and PEC1 can be configured as shown in the following example:򐂰 1 x16 Gen4 PHB/1 x8 Gen5 PHB
򐂰 OR 1 x8 Gen5 and 1 x8 Gen4 PHB
򐂰 OR 1 x8 Gen5 PHB and 2 x4 Gen4 PHBs

90

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

The Power10 chip is installed in pairs in a DCM or eSCM that plugs into a socket in thesystem board of the systems.
The following versions of Power10 processor modules are used on the Power10
processor-based scale-out servers:
򐂰 A DCM in which both chips are fully functional with cores, memory, and I/O.
򐂰 A DCM in which the first chip (P0) is fully function with cores, memory, and I/O and thesecond chip (P1) provides cores and I/O only, but no memory.
򐂰 An eSCM in which the first chip (P0) is fully function with cores, memory, and I/O and thesecond chip (P1) supports I/O only.
The PCIe slot internal connections of 2 DCM server are shown in Figure 2-27.

C 4 = G 4 x 1 6 o r G 5 x 8 s lo t
C 1 1 = G 5 x 8 w / x 1 6 c s lo t

PEC 0

PEC 0

C 3 = G 4 x 1 6 o r G 5 x 8 s lo t

D C M -0P 0 / C h i p -0
C 1 0 = G 4 x 1 6 o r G 5 x 8 s lo t

C 9 = G 5 x 8 w / x 1 6 c s lo t

PEC 1

PEC 1

C 2 = G 5 x 8 w / x 1 6 c s lo t

PEC 0

C 8 = G 4 x 8 w / x 1 6 c s lo t

C 7 = G 5 x 8 w / x 1 6 c s lo t

D C M -1
P 2 / C h i p -0

PEC 0

C 1 = G 4 x 8 w / x 1 6 c s lo t

D C M -0
P 1 / C h i p -1

D C M -1
P 3 / C h i p -1

( f u lly f u n c t io n o r I/O o n ly)( f u lly f u n c t io n o r I/O o n ly)
PEC 1

PEC 1

C 0 = G 4 x 1 6 o r G 5 x 8 s lo t

Figure 2-27 PCIe slot internal connections of a 2-socket DCM server

All PCIe slots support hot-plug adapter installation and maintenance when service
procedures are used that are activated by way of the eBMC or HMC interfaces, and enhanced
error handling (EEH).
PCIe EEH-enabled adapters respond to a special data packet that is generated from theaffected PCIe slot hardware by calling system firmware, which examines the affected bus,
allows the device driver to reset it, and continues without a system restart.
For Linux, EEH support extends to most of the frequently used devices, although somethird-party PCI devices might not provide native EEH support.
All PCIe adapter slots support hardware-backed network virtualization through single root IO
virtualization (SR-IOV) technology. Configuring an SR-IOV adapter into SR-IOV shared modemight require more hypervisor memory. If sufficient hypervisor memory is not available, therequest to move to SR-IOV shared mode fails. The user is then instructed to free up extra
memory and attempt the operation again.
The server PCIe slots are allocated DMA space that use the following algorithm:
򐂰 All slots are allocated a 2 GB default DMA window.
򐂰 All I/O adapter slots (except the embedded USB) are allocated Dynamic DMA Window(DDW) capability that is based on installed platform memory. DDW capability is calculated
assuming 4 K I/O mappings. Consider the following points:– For systems with less than 64 GB of memory, slots are allocated 16 GB of DDW
capability.

Chapter 2. Architecture and technical overview

91

– For systems with at least 64 GB of memory, but less than 128 GB of memory, slots areallocated 32 GB of DDW capability.
– For systems with 128 GB or more of memory, slots are allocated 64 GB of DDW
capability.
– Slots can be enabled with Huge Dynamic DMA Window capability (HDDW) by using
the I/O Adapter Enlarged Capacity setting in the ASMI.
– HDDW enabled slots are allocated enough DDW capability to map all of installed
platform memory by using 64 K I/O mappings.
– Minimum DMA window size for HDDW enabled slots is 32 GB.
– Slots that are HDDW enabled are allocated the larger of the calculated DDW and
HDDW capability.
The x16 slots can provide up to twice the bandwidth of x8 slots because they offer twice as
many PCIe lanes. PCIe Gen5 slots can support up to twice the bandwidth per lane of a PCIe
Gen4 slot, and PCIe Gen4 slots can support up to twice the bandwidth per lane of a PCIe
Gen3 slot.
The servers are smart about energy efficiency when cooling the PCIe adapter environment.
They sense which IBM PCIe adapters are installed in their PCIe slots and, if an adapter
requires higher levels of cooling, they automatically speed up fans to increase airflow acrossthe PCIe adapters. Faster fans increase the sound level of the server. Higher wattage PCIe
adapters include the PCIe3 SAS adapters and SSD/flash PCIe adapters (#EJ10, #EJ14, and#EJ0J).

2.4.1 Slot configuration
The various slot configurations are described in this section. For each server model, the PCIe
slot locations are listed by the slot type and the OpenCAPI capability. The I/O adapter
enlarged capacity enablement order is provided for each individual PCIe adapter slot.

Slot configuration for the Power S1014 server
The Power S1014 server features up to 21 PCIe hot-plug slots (16 U.2 NVMe plus up to five
PCIe add-in cards), which provides excellent configuration flexibility and expandability. The
PCIe slots are enabled to support the cable adapter (#EJ2A) that is used to attach the EMX0
PCIe Gen3 I/O expansion drawer.
With one Power10 processor, five PCIe slots are available:򐂰򐂰򐂰򐂰One PCIe x16 Gen4 or x8 Gen5, full-height, half length slot (OpenCAPI)
Two PCIe x8 (x16 connector) Gen5, full-height, half-length slots (OpenCAPI)One PCIe x8 (x16 connector) Gen5, full-height, half-length slot
One PCIe x8 (x16 connector) Gen4, full-height, half-length slot (OpenCAPI)

Table 2-18 lists the available PCIe slot types and the related slot location codes in PowerS1014 server.
Table 2-18 PCIe slot locations for a slot type in the Power S1014 server

92

Slot type

Number of slots

Location codes

Adapter size

PCIe4 x16 or PCIe5 x8
slots

1

P0-C10Full-height, half-length

PCIe5 x8 with x16
connector

3

P0-C7, P0-C9, andP0-C11

Full-height, half-length

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

Slot type

Number of slots

Location codes

Adapter size

PCIe4 x8 with x16
connector

1

P0-C8

Full-height, half-length

eBMC

1

P0-C5

OpenCAPI Only

1

P0-C6

Full-height, half-length

Table 2-19 lists the PCIe adapter slot locations and related characteristics for the PowerS1014 server.
Table 2-19 PCIe slot locations and capabilities for the Power S1014 server
Location code

Description

Processor
module

OpenCAPIcapableI/O adapter
enlargedcapacityenablement
orderaP0-C5beBMC

P0-C6cOpenCAPI x16
connector

P0-C7

PCIe5 x8 withx16 connector

DCM0-P1-E1-PH
B3

Yes

3

P0-C8dPCIe4 x8 withx16 connector

DCM0-P1-E0-PH
B1

Yes

4

P0-C9

PCIe5 x8 withx16 connector

DCM0-P1-E0-PH
B0

Yes

5

P0-C10

PCIe4 x16 or
PCIe5 x8 slots

DCM0-P0-E1-PH
B3

Yes

1

P0-C11e

PCIe5 x8 withx16 connector

DCM0-P0-E0-PH
B0

No

2

Yes

a. Enabling the I/O adapter enlarged capacity option affects only Linux partitions.
b. Only used for eBMC.
c. OpenCAPI only.
d. The NVMe JBOF adapter that is cabled to drive backplane P1 is supported in slot P0-C8 or
P0-C10.
e. The NVMe JBOF adapter that is connected to drive backplane P2 is supported in slot P0-C11.

Note: Consider the following points:
򐂰 Slot P0-C7 is a slot with PCIe x8 buses direct from the system processor modules andcan be used to install high-performance adapters. The adapter priority for this slot is forthe high-performance adapters, followed by any other adapters.
򐂰 Slot P0-C8 is a slot with PCIe x16 buses direct from the system processor modules andcan be used to install high-performance adapters. The adapter priority for these slots is
for CAPI accelerator adapters, PCI accelerator adapters, high-performance adapters,
followed by any other adapters.
Figure 2-28 on page 94 shows the rear view of the Power S1014 server with the location
codes for the PCIe adapter slots.

Chapter 2. Architecture and technical overview

93Restriction: The following adapters are not supported in the Power S1014 when the
24-core processor is installed:
–
–
–
–
–
–
–
–
–
–
–
–
–
–

#EC2S) -PCIe3 2-Port 10Gb NIC&ROCE SR/Cu Adapter(#EC2U) -PCIe3 2-Port 25/10Gb NIC&ROCE SR/Cu Adapter(#EC7B) -PCIe4 1.6TB NVMe Flash Adapter x8 for AIX/Linux(#EC7D) -PCIe4 3.2TB NVMe Flash Adapter x8 for AIX/Linux(#EC7F) -PCIe4 6.4TB NVMe Flash Adapter x8 for AIX/Linux(#EC7K) -PCIe4 1.6TB NVMe Flash Adapter x8 for IBM i(#EC7M) -PCIe4 3.2TB NVMe Flash Adapter x8 for IBM i(#EC7P) -PCIe4 6.4TB NVMe Flash Adapter x8 for IBM i(#EC5B) -PCIe3 x8 1.6 TB NVMe Flash Adapter for AIX/Linux(#EC5D) -PCIe3 x8 3.2 TB NVMe Flash Adapter for AIX/Linux(#EC5F) -PCIe3 x8 6.4 TB NVMe Flash Adapter for AIX/Linux(#EC6V) -PCIe3 x8 1.6 TB NVMe Flash Adapter for IBM i(#EC6X) -PCIe3 x8 3.2 TB NVMe Flash Adapter for IBM i(#EC6Z) -PCIe3 x8 6.4 TB NVMe Flash Adapter for IBM i

Figure 2-28 Rear view of a Power S1014 server with PCIe slots location codes

Restriction: When the 24-core module is installed in the Power S1014 the following
adapters cannot be installed in slots C7 or C8
–
–
–
–
–
–
–
–

(#EJ14) -PCIe3 12GB Cache RAID PLUS SAS Adapter Quad-port 6Gb x8(#EJ0L) -PCIe3 12GB Cache RAID SAS Adapter Quad-port 6Gb x8(#EJ0J) -PCIe3 RAID SAS Adapter Quad-port 6Gb x8(#EJ10) -PCIe3 SAS Tape/DVD Adapter Quad-port 6Gb x8(#EN1E) -PCIe3 16Gb 4-port Fibre Channel Adapter(#EN1C) -PCIe3 16Gb 4-port Fibre Channel Adapter(#EJ32) -PCIe3 Crypto Coprocessor no BSC 4767(#EJ35) -PCIe3 Crypto Coprocessor no BSC 4769

Slot configuration for the Power S1022s and S1022 servers
The Power S1022s and S1022 servers feature up to 18 PCIe hotplug slots (eight U.2 NVMe
plus up to 10 PCIe add-in cards), which provides excellent configuration flexibility andexpandability. The PCIe slots are enabled to support the cable adapter (#EJ24) that is used toattach the EMX0 PCIe Gen3 I/O expansion drawer.
With two Power10 processors, 10 PCIe slots are available:
򐂰 Two x16 Gen4 or x8 Gen5 half-height, half-length slots (OpenCAPI)򐂰 Two x16 Gen4 or x8 Gen5 half-height, half-length slots
򐂰 Two x8 Gen5 half-height, half-length slots (with x16 connectors) (OpenCAPI)94

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction򐂰 Two x8 Gen5 half-height, half-length slots (with x16 connectors)
򐂰 Two x8 Gen4 half-height, half-length slots (with x16 connectors) (OpenCAPI)
With one Power10 processor, five PCIe slots are available:򐂰򐂰򐂰򐂰One PCIe x16 Gen4 or x8 Gen5, half-height, half-length slots (OpenCAPI)
Two PCIe x8 (x16 connector) Gen5, half-height, half-length slots (OpenCAPI)One PCIe x8 (x16 connector) Gen5, half-height, half-length slots
One PCIe x8 (x16 connector) Gen4, half-height, half-length slots (OpenCAPI)

Table 2-20 lists the available PCIe slot types and the related slot location codes in PowerS1022s and S1022 servers.
Table 2-20 PCIe slot locations for a slot type in the Power S1022s and S1022 servers
Slot type

Number of slots

Location codes

Adapter size

PCIe4 x16 or PCIe5 x8
slots

4

P0-C0, P0-C3, P0-C4,
and P0-C10

Half-height, half-length

PCIe5 x8 with x16
connector

4

P0-C2, P0-C7, P0-C9,
and P0-C11

Half-height, half-length

PCIe4 x8 with x16
connector

2

P0-C1 and P0-C8

Half-height, half-length

eBMC

1

P0-C5

OpenCAPI Only

1

P0-C6

Half-height, half-length

Table 2-21 lists the PCIe adapter slot locations and related characteristics for the PowerS1022s and S1022 servers.
Table 2-21 PCIe slot locations and capabilities for the Power S1022s and S1022 servers
Location code

Description

Processor
module

OpenCAPIcapableI/O adapter
enlargedcapacityenablement
orderaP0-C0

PCIe4 x16 or
PCIe5 x8 slots

DCM1-P1-E1-PH
B3

No

2

P0-C1

PCIe4 x8 withx16 connector

DCM1-P1-E0-PH
B1

Yes

8

P0-C2

PCIe5 x8 withx16 connector

DCM1-P1-E0-PH
B0

No

10

P0-C3

PCIe4 x16 or
PCIe5 x8 slots

DCM1-P0-E1-PH
B3

Yes

3

P0-C4

PCIe4 x16 or
PCIe5 x8 slots

DCM1-P0-E0-PH
B0

No

4

P0-C5beBMC

P0-C6cOpenCAPI x16
connector

P0-C7

PCIe5 x8 withx16 connector

Yes
DCM0-P1-E1-PH
B3

Yes

6

Chapter 2. Architecture and technical overview

95Location code

Description

Processor
module

OpenCAPIcapableI/O adapter
enlargedcapacityenablement
orderaP0-C8dPCIe4 x8 withx16 connector

DCM0-P1-E0-PH
B1

Yes

7

P0-C9

PCIe5 x8 withx16 connector

DCM0-P1-E0-PH
B0

Yes

9

P0-C10

PCIe4 x16 or
PCIe5 x8 slots

DCM0-P0-E1-PH
B3

Yes

1

P0-C11e

PCIe5 x8 withx16 connector

DCM0-P0-E0-PH
B0

No

5

a. Enabling the I/O adapter enlarged capacity option affects only Linux partitions.
b. Only used for eBMC.
c. OpenCAPI only.
d. The NVMe JBOF adapter that is cabled to drive backplane P1 is supported in slot P0-C8 or
P0-C10.
e. The NVMe JBOF adapter that is connected to drive backplane P2 is supported in slot P0-C11.

Note: Consider the following points:
򐂰 Slots P0-C1 and P0-C7 are slots with PCIe x8 buses direct from the system processor
modules and can be used to install high-performance adapters. The adapter priority forthis slot is for the high-performance adapters, followed by any other adapters.
򐂰 Slots P0-C2, P0-C3, and P0-C8 are slots with PCIe x16 buses direct from the systemprocessor modules and can be used to install high-performance adapters. The adapter
priority for these slots is for CAPI accelerator adapters, PCI accelerator adapters,
high-performance adapters, followed by any other adapters.
Figure 2-29 shows the rear view of the Power S1022s and S1022 servers with the location
codes for the PCIe adapter slots.

Figure 2-29 Rear view of Power S1022s and S1022 servers with PCIe slots location codes

Slot configuration for the Power S1024 server
The Power S1024 server features up to 26 PCIe hotplug slots (16 U.2 NVMe plus up to 10
PCIe add-in cards), which provides excellent configuration flexibility and expandability. The
PCIe slots are enabled to support the cable adapter (#EJ2A) that is used to attach the EMX0
PCIe Gen3 I/O expansion drawer.
With two Power10 processor DCMs, 10 PCIe slots are available:
򐂰 Two x16 Gen4 or x8 Gen5 full-height, half-length slots (CAPI)򐂰 Two x16 Gen4 or x8 Gen5 full-height, half-length slots
򐂰 Two x8 Gen5 full-height, half-length slots (with x16 connectors) (CAPI)96

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction򐂰 Two x8 Gen5 full-height, half-length slots (with x16 connectors)
򐂰 Two x8 Gen4 full-height, half-length slots (with x16 connectors) (CAPI)
With one Power10 processor DCM, five PCIe slots are available:򐂰򐂰򐂰򐂰One PCIe x16 Gen4 or x8 Gen5, full-height, half-length slots (CAPI)
Two PCIe x8 Gen5, full-height, half-length slots (with x16 connector) (CAPI)One PCIe x8 Gen5, full-height, half-length slots (with x16 connector)
One PCIe x8 Gen4, full-height, half-length slots (with x16 connector) (CAPI)

Table 2-22 lists the available PCIe slot types and related slot location codes in the PowerS1024 server.
Table 2-22 PCIe slot locations for each slot type in the Power S1024 server
Slot type

Number of slots

Location codes

Adapter size

PCIe4 x16 or PCIe5 x8
slots

4

P0-C0, P0-C3, P0-C4,
and P0-C10

Full-height, half-length

PCIe5 x8 with x16
connector

4

P0-C2, P0-C7, P0-C9,
and P0-C11

Full-height, half-length

PCIe4 x8 with x16
connector

2

P0-C1 and P0-C8

Full-height, half-length

eBMC

1

P0-C5

OpenCAPI Only

1

P0-C6

Full-height, half-length

Table 2-23 lists the PCIe adapter slot locations and related characteristics for the PowerS1024 server.
Table 2-23 PCIe slot locations and capabilities for the Power S1024 servers
Location code

Description

Processor
module

OpenCAPIcapableI/O adapter
enlargedcapacityenablement
orderaP0-C0

PCIe4 x16 or
PCIe5 x8 slots

DCM1-P1-E1-PH
B3

No

2

P0-C1

PCIe4 x8 withx16 connector

DCM1-P1-E0-PH
B1

Yes

8

P0-C2

PCIe5 x8 withx16 connector

DCM1-P1-E0-PH
B0

No

10

P0-C3

PCIe4 x16 or
PCIe5 x8 slots

DCM1-P0-E1-PH
B3

Yes

3

P0-C4

PCIe4 x16 or
PCIe5 x8 slots

DCM1-P0-E0-PH
B0

No

4

P0-C5beBMC

P0-C6cOpenCAPI x16
connector

P0-C7

PCIe5 x8 withx16 connector

Yes
DCM0-P1-E1-PH
B3

Yes

6

Chapter 2. Architecture and technical overview

97Location code

Description

Processor
module

OpenCAPIcapableI/O adapter
enlargedcapacityenablement
orderaP0-C8dPCIe4 x8 withx16 connector

DCM0-P1-E0-PH
B1

Yes

7

P0-C9

PCIe5 x8 withx16 connector

DCM0-P1-E0-PH
B0

Yes

9

P0-C10

PCIe4 x16 or
PCIe5 x8 slots

DCM0-P0-E1-PH
B3

Yes

1

P0-C11e

PCIe5 x8 withx16 connector

DCM0-P0-E0-PH
B0

No

5

a. Enabling the I/O adapter enlarged capacity option affects only Linux partitions.
b. Only used for eBMC.
c. OpenCAPI only.
d. The NVMe JBOF adapter that is cabled to drive backplane P1 is supported in either slot P0-C8
or P0-C10.
e. The NVMe JBOF adapter that is connected to drive backplane P2 is supported in slot P0-C11.

Note: Consider the following points:
򐂰 Slots P0-C1 and P0-C7 are slots with PCIe x8 buses direct from the system processor
modules and can be used to install high-performance adapters. The adapter priority forthis slot is for the high-performance adapters, followed by any other adapters.
򐂰 Slots P0-C2, P0-C3, and P0-C8 are slots with PCIe x16 buses direct from the systemprocessor modules and can be used to install high-performance adapters. The adapter
priority for these slots is for CAPI accelerator adapters, PCI accelerator adapters,
high-performance adapters, followed by any other adapters.
Figure 2-30 shows the rear view of the Power S1024 server with the location codes for the
PCIe adapter slots.

Figure 2-30 Rear view of a Power S1024 server with PCIe slots location codes

2.4.2 System port
The Power S1014, S1022s, S1022, and S1024 servers do not include a system port.

98

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

2.5 Enterprise Baseboard Management Controller
The Power10 scale-out systems use an eBMC for system service management, monitoring,
maintenance, and control. The eBMC also provides access to the system event log files(SEL).
The eBMC is a specialized service processor that monitors the physical state of the system
by using sensors. A system administrator or service representative can communicate with theeBMC through an independent connection.

2.5.1 Managing the system by using the ASMI GUI
The ASMI is the GUI to the eBMC. It is similar in terms of its function to the ASMI of Flexible
Service Processor (FSP)-managed servers (for example, the Power E1080 server), but it is acomplete redesign of the UI that was driven by customer feedback that was received during a
Design Thinking workshop.
To enter the ASMI GUI, you can use the HMC by selecting the server and then selecting
Operations → Launch Advanced System Management. A window opens that displays thename of the system; model, type, and serial; and the IP of the service processor (eBMC).
Click OK and the ASMI window opens.
If the eBMC is connected to a network that also is accessible from your workstation, you canconnect directly by entering https://<eBMC IP> in your web browser.
Figure 2-31 shows the ASMI login window.

Figure 2-31 ASMI login window
Chapter 2. Architecture and technical overview

99After you log in, the Overview window is shown, which includes server, firmware, network,
power, and status information, as shown in Figure 2-32.
When you log in for the first time, the default username and password is admin, but
invalidated. That is, after the first login, you must immediately change the admin password.
This change also must be made after a factory reset of the system. This policy change helps
to enforce that the eBMC is not left in a state with a well-known password, which improves the
security posture of the system.
The password must meet specific criteria (for example, a password of abcd1234 is invalid).
For more information about password rules, see this IBM Documentation web page.

Figure 2-32 ASMI overview window

The new ASMI for eBMC managed servers feature some important differences from the ASMI
version that is used by FSP-based systems. It also delivers some valuable new features:򐂰 Update system firmware
A firmware update can be installed for the server by using the ASMI GUI, even if thesystem is managed by an HMC. In this case, the firmware update always is disruptive.
To install a concurrent firmware update, the HMC must be used, which is not possible byusing the ASMI GUI.

100

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction򐂰 Download memory dumps
Memory dumps can be downloaded by using the HMC. Also, they also download themfrom the ASMI menu if necessary.
It also is possible to start a memory dump from the ASMI. Click Logs → Dumps and then,select the memory dump type and click Initiate memory dump. The following memory
dump types are available:– BMC memory dump (nondisruptive)– Resource memory dump
– System memory dump (disruptive)򐂰 Network Time Protocol (NTP) server support
򐂰 Lightweight directory access protocol (LDAP) for user management򐂰 Host console
By using the host console, you can monitor the server’s start process. The host console
also can be used to access the operating system when only a single LPAR uses all of theresources.
Note: The host console also can be accessed by using an SSH client over port 2200
and logging in as the admin user.
򐂰 User management
You can create your own users in the eBMC. This feature also can be used to create anindividual user that can be used for the HMC to access the server.
A user features the following types privileges:– Administrator– ReadOnly (you cannot modify anything (except the password of that user); therefore, auser with this privilege level cannot be used for HMC access to the server.
򐂰 IBM security by way of Access Control Files
To get “root access” to the service processor by using the user celogin in FSP-managed
servers, the IBM support team generated a password by using the serial number and thedate.
In eBMC managed systems, the support team generates an Access Control File (ACF).
This file must be uploaded to the server to get access. This procedure is needed (forexample) if the admin password must be reset. This process requires physical access tothe system.
򐂰 Jumper reset
Everything on the server on be reset by using a physical jumper. This factory reset
process resets everything on the server, such as LPAR definitions, eBMC settings, and the
NVRAM.
Next, we discuss some functions of the ASMI.

Realtime progress indicator
The ASMI of an eBMC server also provides a real-time progress indicator to see the operator
panel codes. To open the window that shows the codes, click Logs → Progress logs andthen, click View code in real time.

Chapter 2. Architecture and technical overview

101Inventory and LEDs
Under Hardware status → Inventory and LEDs, you can find most of the hardware
components with their current state, and controls for an identification LED for eachcomponent, the system identification LED, and the system attention LED. You can switch all
identification LEDs on and off individually. The system attention LED can be turned off only.
A component also can be displayed. This feature is helpful to see details; for example, thesize of a DDIMM or the part number of a component if something must be exchanged.

Sensors
The ASMI features data from various sensors that are available within the server and many
components by clicking Hardware status → Sensors. The loading of the sensor data takessome time, during which you see a progress bar on the top of the window.
Note: Although the progress bar might be finished, it can take some extra time until the
sensor data is shown.
Figure 2-33 shows an example of the sensors window.

Figure 2-33 ASMI sensors

Network settings
The default network settings for the two eBMC ports are to use DHCP. Therefore, when you
connect a port to a private HMC network with the HMC as a DHCP server, the new system
receives its IP address from the HMC during the start of the firmware. Then, the new system
automatically appears in the HMC and can be configured.
DHCP is the recommended way to attach the eBMC of a server to the HMC.

102

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

If you do not use DHCP and want to use a static IP, you can set the IP in the ASMI GUI.
However, before you can make this change, you must connect to the ASMI. Because nodefault IPs are the same for every server, you first must determine the configured IP.
To determine the configured IP, use the operator window. This optional component includes
the recommendation that one operator window is purchased per rack of Power10
processor-based scale-out servers.
In the control window, complete the following steps:
1. Use the Increment or Decrement options to scroll to function 02.
2. Click Enter until the value changes from N (normal) to M (manual).
This process activates access to function 30.
3. Scroll to function 30 and click Enter until 30** appears.
4. Scroll to 3000 and click Enter, which displays the IP of the ETH0 port. If you scroll to 3001
and click Enter, the IP of ETH1 is displayed.
5. After you determine the IP, scroll again to function 02 and set the value back from M to N.
For more information about function 30 in the operator window, see this IBM Documentation
web page.
Now that you determined the IP, you can configure any computer with a web browser to an IP
in the same subnet (class C) and connect the computer to the correct Ethernet port of theserver.
Hint: Most connections work by using a standard Ethernet cable. If you do not see a linkwith the standard Ethernet cable, use a crossover cable where the send and receive wires
are crossed.
After connecting the cable, you can now use a web browser to access the ASMI withhttps://<IP address> and then, configure the network port address settings.
To configure the network ports, click Settings → Network and select the correct adapter toconfigure.
Figure 2-34 on page 104 shows and example of changing eth1. Before you can configure astatic IP address, switch off DHCP. Several static IPs can be configured on one physical
Ethernet port.
In the ASMI network settings window, you cannot configure the VMI address. The VMI
address is another IP that is configured on the physical eBMC Ethernet port of the server tomange the Virtualization of the server. The VMI address can be configured in the HMC only.

Chapter 2. Architecture and technical overview

103

Figure 2-34 ASMI network settings

Using an Access Control FileIf you lost the access password for the ASMI service user, you can access the ASMI by using
an ACF. The ACF is a digital certificate that is provided by IBM support when you open a
support case. To use the ACF, the system must be enabled at the server by using the operator
panel.
Complete the following steps:
1. On the operator panel, use the Increment or Decrement buttons to scroll to function 74.
2. Click Enter and then, select 00 to accept the function (FF rejects it). Now, the ACF
function is active for 30 minutes. To use it, complete the following steps:
a. Enter the ASMI login window.
b. Click Upload service login certificate to upload the ACF into the system and allow
the user to enter the ASMI with the associated password that aso is supplied by IBM
support.
For more information, see this IBM Documentation web page.

Policies
In Security and access → Policies, you can switch security related functions on and off; forexample, whether management over Intelligent Platform Management Interface (IPMI) is
enabled.

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IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

Some customers require that the USB ports of the server must be disabled. This change canbe made in the Policies window. Switch off Host USB enablement, as shown in Figure 2-35.

Figure 2-35 Switching off the USB ports of the server

2.5.2 Managing the system by using DMTF Redfish
eBMC-based systems also can be managed by using the DMTF Redfish APIs. Redfish is a
REST API that is used for platform management and is standardized by the Distributed
Management Task Force, Inc. For more information, see this web page.
You can work with Redfish by using several methods, ll of which require an https connection
to the eBMC. One possibility is to use the curl operating system command. The following
examples show how to work with curl and Redfish.
Before you can acquire data from the server or run systems management tasks by using
Redfish, you must authenticate against the server. In return for supplying a valid username
and password, you receive a token that is used to authenticate requests (see Example 2-1).
Example 2-1 Receiving a token from Redfish# export eBMC=<IP># export USER=admin# export PASSWORD=<PW># export TOKEN=`curl -k -H "Content-Type: application/json" -X POST https://${eBMC}/login-d "{\"username\" : \"${USER}\", \"password\" : \"${PASSWORD}\"}" | grep token | awk'{print $2;}' | tr -d '"'`

Chapter 2. Architecture and technical overview

105With this token, you now can receive data from the server. You start by requesting data of the
Redfish root with /Redfish/v1. You receive data with other branches in the Redfish tree; forexample, Chassis.
For more data, you can use the newly discovered odata.id field information/Redfish/v1/Chassis, as shown in Example 2-2.
Example 2-2 Get chassis data from Redfish#curl -s -k -H "X-Auth-Token: $TOKEN" -X GET https://${eBMC}/redfish/v1{"@odata.id": "/redfish/v1","@odata.type": "#ServiceRoot.v1_12_0.ServiceRoot","AccountService": {"@odata.id": "/redfish/v1/AccountService"},"Cables": {"@odata.id": "/redfish/v1/Cables"},"CertificateService": {"@odata.id": "/redfish/v1/CertificateService"},"Chassis": {"@odata.id": "/redfish/v1/Chassis"},# curl -k -H "X-Auth-Token: $TOKEN" -X GET https://${eBMC}/Redfish/v1/Chassis{"@odata.id": "/Redfish/v1/Chassis","@odata.type": "#ChassisCollection.ChassisCollection","Members": [{"@odata.id": "/Redfish/v1/Chassis/chassis"}],"Members@odata.count": 1,"Name": "Chassis Collection"# curl -k -H "X-Auth-Token: $TOKEN" -X GET https://${eBMC}/Redfish/v1/Chassis/chassis{"@odata.id": "/Redfish/v1/Chassis/chassis","@odata.type": "#Chassis.v1_16_0.Chassis","Actions": {...
"PCIeSlots": {"@odata.id": "/Redfish/v1/Chassis/chassis/PCIeSlots"},...
"Sensors": {"@odata.id": "/Redfish/v1/Chassis/chassis/Sensors"},...

Under Chassis, another chassis is available (with lower case c). We can now use the tree with
both; that is, /Redfish/v1/Chassis/chassis. After running the tool, you can see in
Example 2-2 PCIeSlots and Sensors are available as examples of other resources on theserver.

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IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

In Example 2-3, you see what is available through the Sensors endpoint. Here, you can findthe same sensors as in the ASMI GUI (see Figure 2-33 on page 102).
For example, in the output, you find the sensor total_power. When you ask for more
information about that sensor (see Example 2-3), you can see that the server needed 1.426
watts at the time of running the command. Having programmatic access to this type of data
allows you to build a view of the electrical power consumption of your Power environment inreal time, or to report usage over a period.
Example 2-3 Sensor data from Redfish# curl -k -H "X-Auth-Token: $TOKEN" -X GET
https://${eBMC}/Redfish/v1/Chassis/chassis/Sensors{"@odata.id": "/Redfish/v1/Chassis/chassis/Sensors","@odata.type": "#SensorCollection.SensorCollection","Description": "Collection of Sensors for this Chassis","Members": [{"@odata.id": "/Redfish/v1/Chassis/chassis/Sensors/Altitude"},{"@odata.id": "/Redfish/v1/Chassis/chassis/Sensors/1V1CS_0167_p1_rail_iout"},...
{"@odata.id": "/Redfish/v1/Chassis/chassis/Sensors/total_power"},# curl -k -H "X-Auth-Token: $TOKEN" -X GET \https://${eBMC}/Redfish/v1/Chassis/chassis/Sensors/total_power{"@odata.id": "/Redfish/v1/Chassis/chassis/Sensors/total_power","@odata.type": "#Sensor.v1_0_0.Sensor","Id": "total_power","Name": "total power","Reading": 1426.0,"ReadingRangeMax": null,"ReadingRangeMin": null,"ReadingType": "Power","ReadingUnits": "W",
"Status": {"Health": "OK","State": "Enabled"}

The following other strings are useful:򐂰 Type/Model of the server:# curl -s -k -H "X-Auth-Token: $TOKEN" -X GET
https://${eBMC}/Redfish/v1/Systems/system | grep Model | grep -v SubModel |grep \ -v \"\"
"Model": "9043-MRX",
򐂰 Serial number:# curl -s -k -H "X-Auth-Token: $TOKEN" -X GET
https://${eBMC}/redfish/v1/Systems/system | grep SerialNumber \"SerialNumber": "<SN>",

Chapter 2. Architecture and technical overview

107򐂰 Type/Model/SN:#curl -s -k -H "X-Auth-Token: $TOKEN" -X GET
https://${eBMC}/redfish/v1/Systems/system | grep AssetTag"AssetTag": "Server-9043-MRX-<SN>",
򐂰 System indicator LED:#curl -s -k -H "X-Auth-Token: $TOKEN" -X GET
https://${eBMC}/redfish/v1/Systems/system | grep IndicatorLED"IndicatorLED": "Off",򐂰 Total Memory:# curl -s -k -H "X-Auth-Token: $TOKEN" -X GET
https://${eBMC}/redfish/v1/Systems/system | grep TotalSystemMemoryGiB"TotalSystemMemoryGiB": 8192
򐂰 Power State:# curl -s -k -H "X-Auth-Token: $TOKEN" -X GET
https://${eBMC}/redfish/v1/Systems/system | grep PowerState"PowerState": "On",Operations also can be run on the server by using the POST method to the Redfish API
interface. The following curl commands can be used to start or stop the server (thesecommands work only if you are authenticated as a user with administrator privileges):򐂰Power on server:# curl -k -H "X-Auth-Token: $TOKEN" -X POST https://${eBMC}/redfish/v1/Systems/
system/Actions/Reset -d '{"ResetType":"On"}'򐂰 Power off server:# curl -k -H "X-Auth-Token: $TOKEN" -X POST https://${eBMC}/redfish/v1/Systems/
system/Actions/Reset -d '{"ResetType":"ForceOff"}'
For more information about Redfish, see this IBM Documentation web page.
For more information about how to work with Redfish in Power systems, see this IBM
Documentation web page.

2.5.3 Managing the system by using the Intelligent Platform Management
Interface
The server can also be managed by using the IPMI, although for security reasons the IPMI isdisabled by default on the system.
Because inherent security vulnerabilities are associated with the IPMI, consider the use of
Redfish APIs or the GUI to manage your system.
If you want to use IPMI, this service must be enabled first. This process can be done byclicking Security and access → Policies. There, you find the policy Network IPMI
(out-of-band IPMI) that must be enabled to support IPMI access.
For more information about common IPMI commands, see this IBM Documentation web
page.

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IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

3

Chapter 3.

Available features and options
In this chapter, we discuss the major features and options that are available.
This chapter includes the following topics:
򐂰
򐂰
򐂰
򐂰
򐂰
򐂰
򐂰
򐂰
򐂰
򐂰

3.1, “Processor module features” on page 110
3.2, “Memory features” on page 116
3.3, “Power supply features” on page 117
3.4, “Peripheral Component Interconnect adapters” on page 117
3.5, “Internal storage” on page 124
3.6, “External SAS ports” on page 131
3.7, “Media drawers” on page 131
3.8, “Disk and media features” on page 132
3.9, “External IO subsystems” on page 136
3.10, “System racks” on page 150© Copyright IBM Corp. 2022.

1093.1 Processor module features
This section describes all processor-related Feature Codes for the Power10 processor-based
scale-out servers Power S1014, Power S1022s, Power S1022, and Power S1024.

3.1.1 Power S1014 processor Feature Codes
The Power S1014 provides one socket to accommodate one Power10 entry single-chipmodule (eSCM). Two different eSCM types with a core density of four (Feature Code #EPG0)or eight (Feature Code #EPG2) functional processors are offered. In addition a DCM based
processor module is available with twenty four cores (Feature Code #EPH8).
Power S1014 servers do not support any Capacity on Demand (CoD) capability; therefore, allavailable functional cores of the processor modules are activated by default.
The 4-core eSCM #EPG0 requires four static processor activation features #EPFT and the
8-core eSCM #EPG2 requires eight static processor activation features #EPF6. The 24-core
DCM #EPH8 requires twenty four static processor activation features #EPFZ. To assist withthe optimization of software licensing, the factory deconfiguration feature #2319 is available atinitial order to permanently reduce the number of active cores, if wanted.
Table 3-1 lists the processor card Feature Codes that are available at initial order forPower S1014 servers.
Table 3-1 Processor card Feature Code specification for the Power S1014 server
Processor
card feature
code

Processor
moduletype

Numberof cores

Typicalfrequency
range (GHz)

Static processor core
activation Feature
Code

#EPG0

eSCM

4

3.0 - 3.9

#EPFT

#EPG2

eSCM

8

3.0 - 3.9

#EPF6

#EPH8

DCM

24

2.75 to 3.9#EPFZ

Table 3-2 lists all processor-related Feature Codes for Power S1014 servers.
Table 3-2 Processor-related features of the Power S1014 server

110

Feature code

Description#EPG04-core typical 3.0 to 3.90 GHz (maximum) Power10 processor card

#EPG28-core typical 3.0 to 3.90 GHz (maximum) Power10 processor card

#EPH824-core Typical 2.75 to 3.90 GHz (maximum) Power10 Processor card

#EPFT

Entitlement for one processor core activation for #EPG0#EPF6

Entitlement for one processor core activation for #EPG2#EPFZ

Entitlement for one processor core activation for #EPH8#2319

Factory deconfiguration of one core for EPG0 or #EPG2

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and IntroductionPower S1022s processor Feature Codes
The Power S1022s provides two sockets to accommodate one or two Power10 eSCMs. Two
eSCM types with a core density of four (Feature Code #EPGR) or eight (Feature Code#EPGQ) functional cores are offered.
Power S1022s servers do not support any CoD capability; therefore, all available functionalcores of an eSCM type are activated by default.
The 4-core eSCM processor module #EPGR requires four static processor activation features#EPFR, and the 8-core eSCM processor module #EPGQ requires eight static processor
activation features #EPFQ. To assist with the optimization of software licensing, the factory
deconfiguration Feature Code #2319 is available at initial order to permanently reduce thenumber of active cores. if wanted.
The Power S1022s server can be configured with one 4-core processor, one 8-coreprocessor, or two 8-core processors. An option for a system with two 4-core processors thatare installed is not available.
Table 3-3 lists the processor card Feature Codes that are available at initial order forPower S1022s servers.
Table 3-3 Processor card Feature Code specification for the Power S1022s server
Processor
card Feature
Code

Processor
module type

Number ofcores

Typicalfrequency
range (GHz)

Static processor core
activation Feature
Code

#EPGR

eSCM

4

3.0 to 3.9

#EPFR

#EPGQ

eSCM

8

3.0 to 3.9#EPFQ

Table 3-4 lists all processor-related Feature Codes for Power S1022s servers.
Table 3-4 Processor-related features of the Power S1022s server
Feature code

Description#EPGR

4-core typical 3.0 to 3.90 GHz (maximum) Power10 processor card

#EPGQ

8-core typical 3.0 to 3.90 GHz (maximum) Power10 processor card

#EPFR

Entitlement for one processor core activation for #EPGR#EPFQEntitlement for one processor core activation for #EPGQ#2319

Factory deconfiguration of one core for #EPGR or #EPGQ

Power S1022 processor Feature Codes
The Power S1022 provides two sockets to accommodate one or two Power10 dual-chipmodules (DCMs). The following DCM core densities are available:
򐂰 12-core: Feature Code #EPG9
򐂰 16-core: Feature Code #EPG8
򐂰 20-core: Feature Code #EPGA
The 12-core #EPG9 DCM can be used in 1-socket or 2-socket Power S1022 configurations.
The higher core density modules with 16 or 20 functional cores are available only in 2-socket
configurations and both sockets must be populated by the same processor feature.

Chapter 3. Available features and options

111

Power S1022 servers support the Capacity Upgrade on Demand (CUoD) capability bydefault. At an initial order, a minimum of 50% of configured physical processor cores must becovered by CUoD static processor core activations:򐂰 The 12-core DCM processor module #EPG9 requires a minimum of six CUoD static
processor activation features #EPF9 in a 1-socket and a minimum of 12 #EPF9 features ina 2-socket configuration.
򐂰 The 16-core DCM processor module #EPG8 is supported only in 2-socket configurations.
It requires a minimum of eight CUoD static processor activation features #EPF8.
Therefore, a minimum of 16 CUoD static processor activations are needed per server.
򐂰 The 20-core DCM processor module #EPGA is supported only in 2-socket configurations.
It requires a minimum of 10 CUoD static processor activation features #EPFA. Therefore,a minimum of 20 CUoD static processor activations are needed per server.
Extra CUoD static activations can be purchased later after the initial order until all physicallypresent processor cores are entitled.
To assist with the optimization of software licensing, the factory deconfiguration feature #2319
is available at initial order to permanently reduce the number of active cores that are below
the imposed minimum of 50% CUoD static processor activations, if wanted.
As an alternative to the CUoD processor activation use model and to enable cloud agility andcost optimization with pay-for-use pricing, the Power S1022 server supports the IBM PowerPrivate Cloud with Shared Utility Capacity solution (also known as Power Enterprise Pools 2.0
or Pools 2.0). This solution is configured at initial system order by including Feature Code#EP20.
When configured as a Power Private Cloud system, each Power S1022 server requires aminimum of one base processor core activation. The maximum number of base processor
activations is limited by the physical capacity of the server.
Although configured against a specific server, the base activations can be aggregated acrossa pool of servers and used on any of the systems in the pool. When a system is configured inthis way, all processor cores that are installed in the system become available for use. Any
usage above the base processor activations that are purchased across a pool is monitored by
the IBM Cloud Management Console for Power and is debited from the customers cloudcapacity credits, or is invoiced monthly for total usage across a pool of systems.
A system that is initially ordered with a configuration that is based on the CUoD processor
activations can be converted to the Power Private Cloud with Shared Utility Capacity model
later. This process requires the conversion of existing CUoD processor activations to baseactivations, which include different feature codes. The physical processor feature codes do
not change.
A system cannot be converted from the Power Private Cloud with Shared Utility Capacity
model to CUoD activations.
Table 3-5 on page 113 lists the processor card feature codes that are available at initial orderfor Power S1022 servers.

112

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

Table 3-5 Processor feature code specification for the Power 1022 server
Processor
cardfeaturecode

Processor
moduletype

Numberof cores

Typicalfrequency
range
[GHz]

CUoDa static
processor core
activation
Feature CodeBase processor
core activation
Feature Code for
Pools 2.0

Base core
activations
convertedfrom CUoD
staticactivations

#EPG9

DCM

12

2.90 to 4.0

#EPF9

#EUCB

#EUCH

#EPG8

DCM

16

2.75 to 4.0

#EPF8

#EUCA

#EUCG

#EPGA

DCM

20

2.45 to 3.9

#EPFA

#EUCC

#EUCJ

a. Capacity Upgrade on Demand

Table 3-6 lists all processor-related feature codes for Power S1022 servers.
Table 3-6 Processor-related features of the Power S1022 server
Feature CodeDescription#EPG912-core typical 2.90 to 4.0 GHz (maximum) Power10 processor card, available inquantity of one (1-socket configuration) or two (2-socket configuration)#EPG816-core typical 2.75 to 4.0 GHz (maximum) Power10 processor card, available inquantity of two (2-socket configuration) only

#EPGA

20-core typical 2.45 to 3.90 GHz (maximum) Power10 processor card, available inquantity of two (2-socket configuration) only

#EPF9

One CUoD static processor core activation for #EPG9#EPF8

One CUoD static processor core activation for #EPG8#EPFA

One CUoD static processor core activation for #EPGA#2319

Factory deconfiguration of one core for #EPG9, #EPG8, or #EPGA#EP20

Power Enterprise Pools 2.0 enablement#EUCB

One base processor core activation on processor card #EPG9 for Pools 2.0 to
support any operating system#EUCA

One base processor core activation on processor card #EPG8 for Pools 2.0 to
support any operating system#EUCC

One base processor core activation on processor card #EPGA for Pools 2.0 to
support any operating system#EUCH

One base processor core activation on processor card #EPG9 for Pools 2.0 to
support any operating system (converted from #EPF9)#EUCG

One base processor core activation on processor card #EPG8for Pools 2.0 to
support any operating system (converted from #EPF8)#EUCJ

One base processor core activation on processor card #EPGA for Pools 2.0 to
support any operating system (converted from #EPFA)

Chapter 3. Available features and options

113

Power S1024 processor feature codes
The Power S1024 provides two sockets to accommodate one or two Power10 DCMs. The
following DCM core densities are available:
򐂰 12-core: Feature Code #EPGM
򐂰 16-core: Feature Code #EPGC
򐂰 24-core Feature Code #EPGD
The 12-core #EPGM DCM can be used in 1-socket or 2-socket Power S1024 configurations.
The higher core density modules with 16 or 24 functional cores are available only for 2-socket
configurations and both sockets must be populated by the same processor feature.
Power S1024 servers support the CUoD capability by default. At an initial order, a minimum of
50% of configured physical processor cores must be covered by CUoD static processor core
activations:򐂰 The 12-core DCM processor module #EPGM requires a minimum of six CUoD static
processor activation features #EPFM in a 1-socket and 12 #EPFM features in a 2-socket
configuration.
򐂰 The 16-core DCM processor module #EPGC is supported only in 2-socket configurations
and requires a minimum of eight CUoD static processor activation features #EPFC.
Therefore, a minimum of 16 CUoD static processor activations are needed per server.
򐂰 The 24-core DCM processor module #EPGD is supported only in 2-socket configurations
and requires a minimum of 12 CUoD static processor activation features #EPFD.
Therefore, a minimum of 24 CUoD static processor activations are needed per server.
To assist with the optimization of software licensing, the factory deconfiguration feature #2319
is available at initial order to permanently reduce the number of active cores that are below
the imposed minimum of 50% CUoD static processor activations, if wanted.
As an alternative to the CUoD processor activation use model and to enable cloud agility andcost optimization with pay-for-use pricing, the Power S1024 server also supports the IBM
Power Private Cloud with Shared Utility Capacity solution (also known as Power Enterprise
Pools 2.0, or just Pools 2.0). This solution is configured at initial system order by including
Feature Code #EP20.
When configured as a Power Private Cloud system, each Power S1024 server requires aminimum of one base processor core activation. The maximum number of base processor
activations is limited by the physical capacity of the server.
Although configured against a specific server, the base activations can be aggregated acrossa pool of servers and used on any of the systems in the pool. When a system is configured inthis way, all processor cores that are installed in the system become available for use. Any
usage above the base processor activations that are purchased across a pool is monthly for
total usage across a pool of systems.
A system that is initially ordered with a configuration that is based on the CUoD processor
activations can be converted to the Power Private Cloud with Shared Utility Capacity model
later. This process requires the conversion of existing CUoD processor activations to baseactivations, which include different feature codes. The physical processor feature codes do
not change.
A system cannot be converted from the Power Private Cloud with Shared Utility Capacity
model to CUoD activations.

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IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

Table 3-7 lists the processor card feature codes that are available at initial order forPower S1024 servers.
Table 3-7 Processor feature code specification for the Power S1024 server
Processor
cardfeaturecode

Processor
moduletype

Numberof cores

Typicalfrequency
range
[GHz]

CUoD static
processor core
activation
Feature CodeBase processor
core activation
Feature Code for
Pools 2.0

Base core
activations
convertedfrom CUoD
staticactivations

#EPGM

DCM

12

3.40 - 4.0

#EPFM

#EUBX

#EUBZ

#EPGC

DCM

16

3.10 - 4.0

#EPFC

#EUCK

#EUCR

#EPGD

DCM

24

2.75 - 3.9

#EPFD

#EUCS

#EUCT

Table 3-8 lists all processor-related feature codes for Power S1024 servers.
Table 3-8 Processor-related features of the Power S1024 server
Feature code

Description#EPGM

12-core typical 3.40 to 4.0 GHz (maximum) Power10 processor card, available inquantity of one (1-socket configuration) or two (2-socket configuration)#EPGC

16-core typical 3.10 to 4.0 GHz (maximum) Power10 processor card, available inquantity of two (2-socket configuration) only

#EPGD

24-core typical 2.75 to 3.9 GHz (maximum) Power10 processor card, available inquantity of two (2-socket configuration) only

#EPFM

One CUoD static processor core activation for #EPGM#EPFC

One CUoD static processor core activation for #EPGC#EPFD

One CUoD static processor core activation for #EPGD#2319

Factory deconfiguration of one core for #EPGM, #EPGC, or #EPGD#EP20Power Enterprise Pools 2.0 enablement#EUBX

One base processor core activation on processor card #EPGM for Pools 2.0 to
support any operating system#EUCK

One base processor core activation on processor card #EPGC for Pools 2.0 to
support any operating system#EUCL

One base processor core activation on processor card #EPGD for Pools 2.0 to
support any operating system#EUBZ

One base processor core activation on processor card #EUGM for Pools 2.0 to
support any operating system converted from #EPFM#EUCR

One base processor core activation on processor card #EUGC for Pools 2.0 to
support any operating system converted from #EPFC#EUCTOne base processor core activation on processor card #EUGD for Pools 2.0 to
support any operating system converted from #EPFD

Chapter 3. Available features and options115

3.2 Memory features
All available memory feature codes for the Power10 processor-based scale-out servers
Power S1014, Power S1022s, Power S1022, and Power S1024 are listed by Table 3-9. Eachmemory feature code relates to two differential DIMM (DDIMM) cards of identicalspecifications.
Table 3-9 Memory Feature Codes for Power10 processor-based scale-out servers
Featurecode

Capacity

PackagingDRAM
density

DRAM
data rateFormfactorSupported
servers

#EM6N

32 GB

2 x 16 GB
DDIMMs

8 Gbit3200 MHz2U

All scale-out
models

#EM6W

64 GB

2 x 32 GB
DDIMM

8 Gbit3200 MHz2U

All scale-out
models#EM6X

128 GB2 x 64 GB
DDIMM

16 Gbit

3200 MHz2U

All scale-out
models#EM6Y

256 GB2 x 128 GB
DDIMM

16 Gbit2666 MHz

2U

򐂰
򐂰
򐂰

#EM6U

256 GB2 x 128 GB
DDIMM

16 Gbit2933 MHz

4U

Power S1024#EM78

512 GB2 x 256 GB
DDIMM

16 Gbit2933 MHz

4U

Power S1024

Power S1014
Power S1022s
Power S1022

The memory module cards for the scale-out servers are manufactured in two different form
factors, which are used in servers with 2 rack units (2U) or 4 rack units (4U). The 2U memory
cards can be extended through spacers for use in 4U servers, but the 4U high cards do not fit
in 2U servers.
All Power10 processor-based scale-out servers can use the following configurations:򐂰 2U 16 GB capacity DDIMMs of memory feature #EN6N
򐂰 2U high 32 GB capacity DDIMMs of memory feature #EM6W
򐂰 2U high 64 GB capacity DDIMMs of memory feature #EM6X.
The 2U 128 GB capacity DDIMMs of feature #EM6Y can be used in all of the Power10
scale-out servers except for Power S1024 systems. The 4U high 128 GB capacity DDIMMs offeature #EM6U and the 4U high 256 GB capacity DDIMMs of feature #EM78 are exclusively
provided for Power S1024 servers.
All memory slots that are connected to a DCM or an eSCM must be fitted with DDIMMs of thesame memory feature code:򐂰 For 1-socket Power10 scale-out server configurations, all memory modules must be of thesame capacity, DRAM density, DRAM data rate and form factor.
򐂰 For 2-socket Power10 scale-out server configurations two different memory feature codes
can be selected, but the memory slots that are connected to a socket must be filled with
DDIMMs of the same memory feature code, which implies that they are of identicalspecifications.
The minimum memory capacity limit is 32 GB per eSCM or DCM processor module that canbe fulfilled by one #EM6N memory feature.

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IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

No specific memory enablement features are required for any of the supported Power10
scale-out server memory features. The entire physical DDIMM capacity of a memory
configuration is enabled by default.
All Power10 processor-based scale-out servers (except the Power S1014) support the Active
Memory Mirroring (AMM) feature #EM8G. AMM is available as an optional feature to enhance
resilience by mirroring critical memory that is used by the PowerVM hypervisor so that it cancontinue operating if a memory failure occurs.
A portion of available memory can be operatively partitioned such that a duplicate set can beused if noncorrectable memory errors occur. This partitioning can be implemented at the
granularity of DDIMMs or logical memory blocks.

3.3 Power supply features
The Power S1014 server supports the following power supply options:򐂰 Four 1200 W 100 - 127 V AC or 200 - 240 V AC power supplies (#EB3W) that support a
tower chassis. Two power supplies are required during the boot phase and for normal
system operation; and the third and fourth are for redundancy.
򐂰 Two 1600 W 200 - 240 V AC power supplies (#EB3S) that support a rack chassis. One
power supply is required during the boot phase and for normal system operation; thesecond is for redundancy.
The Power S1022s server supports two 2000 W 200 - 240 V AC power supplies (#EB3N).
Two power supplies are always installed. One power supply is required during the boot phaseand for normal system operation, and the second is for redundancy.
The Power S1022 server supports two 2000 W 200 - 240 V AC power supplies (#EB3N). Twopower supplies are always installed. One power supply is required during the boot phase andfor normal system operation, and the second is for redundancy.
The Power S1024 server supports four 1600 W 200 - 240 V AC (#EB3S) power supplies. Fourpower supplies are always installed. Two power supplies are required during the boot phaseand for normal system operation, and the third and fourth are for redundancy.

3.4 Peripheral Component Interconnect adapters
This section discusses the various types and functions of the PCIe adapters that aresupported by the following servers:򐂰򐂰򐂰򐂰Power S1014 (9105-41B)
Power S1022s (9105-22B)
Power S1022 (9105-22A)
Power S1024 (9105-42A) servers

This list is subject to change as more PCIe adapters are tested and certified, or listed
adapters are no longer available. For more information about the supported adapters, see theAdapter Reference.
The following sections describe the supported adapters and provide tables of orderable andsupported feature numbers. The tables indicate operating system support (AIX, IBM i, andLinux) for each of the adapters.

Chapter 3. Available features and options

117

The Order type table column in the following subsections is defined as:
InitialDenotes the orderability of a feature only with the purchase of a new
system.

MES

Denotes the orderability of a feature only as part of an MES upgradepurchase for an existing system.

Both

Denotes the orderability of a feature as part of new and MES upgradepurchases.

Supported

Denotes that feature is not orderable with a system, but is supported;that is, the feature can be migrated from existing systems, but cannot
be ordered new.

3.4.1 Local area network adapters
To connect the IBM Power S1014, S1022s, S1022, and S1024 server models to a local area
network (LAN), you can use the LAN adapters that are supported in the PCIe slots of thesystem. Various connection speeds and physical connections are supported.
Table 3-10 lists the low profile (LP) LAN adapters that are supported within the Power S1022s
and Power S1022 server models.
Table 3-10 Low profile LAN adapters that are supported in the S1022s and S1022
Featurecode

CCIN

Description

Operatingsystem support

Order type

5260

576F

PCIe2 LP 4-port 1 GbE Adapter

AIX, Linux, IBM ia

Supported

EC2R

58FA

PCIe3 LP 2-Port 10Gb NIC&ROCE
SR/Cu Adapter

AIX, Linux, IBM ia

Supported

EC2T

58FB

PCIe3 LP 2-Port 25/10 Gb NIC&ROCE
SR/Cu Adapterb

AIX, Linuxc, IBM ia

Both

EC67

2CF3

PCIe4 LP 2-port 100 Gb ROCE EN LP
adapterd

AIX, Linuxc , IBM ia

Both

EC75

2CFB

PCIe4 LP 2-port 100Gb No Crypto
Connectx-6 DX QFSP56

AIX, Linux, IBM ia

Both

EN0T

2CC3

PCIe2 LP 4-Port (10 Gb+1 GbE)
SR+RJ45 Adapter

AIX, Linux, IBM ia

Supported

EN0V

2CC3

PCIe2 LP 4-port (10 Gb+1 GbE) Copper
SFP+RJ45 Adapter

AIX, Linux, IBM ia

Supported

EN0X

2CC4

PCIe2 LP 2-port 10/1 GbE BaseT RJ45
Adapter

AIX, Linux, IBM ia

Both

EN2X

2F04

PCIe3 LP4-port 10GbE BaseT RJ45
Adapter

AIX, Linuxe, IBM ia

Botha. The IBM i operating system is supported through VIOS only with the exception of the dual
four-core S1022s which provides native support.
b. The #EC2T adapter requires one or two suitable transceivers to provide 10 Gbps SFP+(#EB46), 25 Gbps SFP28 (#EB47), or 1 Gbps RJ45 (#EB48) connectivity as required.
c. Linux support requires Red Hat Enterprise Linux 8.4 or later, Red Hat Enterprise Linux for SAP
8.4 or later, SUSE Linux Enterprise Server 15 Service Pack 3 or later, SUSE Linux EnterpriseServer for SAP with SUSE Linux Enterprise Server 15 Service Pack 3 or later, or Red Hat
OpenShift Container Platform 4.9 or later. All require Mellanox OFED 5.5 drivers or later.

118

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

d. To deliver the full performance of both ports, each 100 Gbps Ethernet adapter must beconnected to a PCIe slot with 16 lanes (x16) of PCIe Gen4 connectivity. In the Power S1022s
and Power S1022 server models this limits placement to PCIe slots C0, C3, C4, and C10. In
systems with only a single socket populated, a maximum of one 100 Gbps Ethernet adapter is
supported. The 100 Gbps Ethernet adapters are not supported in PCIe expansion drawers.
e. Linux support requires SUSE Linux Enterprise Server 15 Service Pack 4 or later, Red Hat
Enterprise Linux 8.6 for POWER LE or later, or Red Hat OpenShift Container Platform 4.11, or
later.

Table 3-11 lists the full-height LAN adapters that are supported within the Power S1014 andPower S1024 server models, and within the PCIe expansion drawer (EMX0) connected to anyof the Power10 processor-based scale-out server models.
Table 3-11 Full-height LAN adapters supported in the S1014, S1024, and PCIe expansion drawers
Featurecode

CCIN

Description

Operatingsystem support

Order type

5899

576F

PCIe2 4-port 1 GbE Adapter

AIX, Linux, IBM ia

Supported

EC2S

58FA

PCIe3 2-Port 10Gb NIC&ROCE SR/Cu
Adapter

AIX, Linux, IBM ia

Supported

EC2U

58FB

PCIe3 2-Port 25/10 Gb NIC&ROCE
SR/Cu Adapterb

AIX, Linuxc, IBM ia

Both

EN0S

2CC3

PCIe2 4-Port (10 Gb+1 GbE) SR+RJ45
Adapter

AIX, Linux, IBM i(through VIOS)

Supported

EN0U

2CC3

PCIe2 L4-port (10 Gb+1 GbE) Copper
SFP+RJ45 Adapter

AIX, Linux, IBM i(through VIOS)

Supported

EN0W

2CC4

PCIe2 2-port 10/1 GbE BaseT RJ45
Adapter

AIX, Linux, IBM i(through VIOS)

Both

EN2W

2F04

PCIe3 4-port 10GbE BaseT RJ45
Adapter

AIX, Linux, IBM i(through VIOS)

Botha. When this adapter is installed in an expansion drawer that is connected to an S1022s or S1022 server,
IBM i is supported through VIOS only with the exception of the dual four-core S1022s which
provides native support.
b. The #EC2U adapter requires one or two suitable transceivers to provide 10 Gbps SFP+ (#EB46), 25 Gbps
SFP28 (#EB47), or 1 Gbps RJ45 (#EB48) connectivity as required.
c. Linux support covers Requires Red Hat Enterprise Linux 8.4 or later, Requires Red Hat Enterprise Linuxfor SAP 8.4 or later, SUSE Linux Enterprise Server 15 Service Pack 3 or later, SUSE Linux EnterpriseServer for SAP with SUSE Linux Enterprise Server 15 Service Pack 3 or later, or Red Hat OpenShiftContainer Platform 4.9 or later. All require Mellanox OFED 5.5 drivers or later.

Two full-height LAN adapters with 100 Gbps connectivity are available that are supported only
when they are installed within the Power S1014 or Power S1024 server models. To deliver thefull performance of both ports, each 100 Gbps Ethernet adapter must be connected to a PCIe
slot with 16 lanes (x16) of PCIe Gen4 connectivity.
In the Power S1014 or the Power S1024 with only a single socket that is populated, thisrequirement limits placement to PCIe slot C10. In the Power S1024 with both sockets
populated, this requirement limits placement to PCIe slots C0, C3, C4, and C10. These 100
Gbps Ethernet adapters are not supported in PCIe expansion drawers.

Chapter 3. Available features and options

119

Table 3-12 lists the 100 Gbps LAN adapters that are supported within the Power S1014 andPower S1024 servers only.
Table 3-12 Full-height 100 Gbps LAN adapters that are supported in the S1014 and S1024 only
Featurecode

CCIN

Description

Operatingsystem support

Order type

EC66

2CF3

PCIe4 2-port 100 Gb ROCE EN adapter

AIX, Linuxa, IBM i(through VIOS)

Both

EC78

2CFA

PCIe4 2-port 100 Gb Crypto ConnectX-6
DX QFSP56

IBM i onlyb

a. Linux support covers Requires Red Hat Enterprise Linux 8.4 or later, Requires Red Hat Enterprise Linuxfor SAP 8.4 or later, SUSE Linux Enterprise Server 15 Service Pack 3 or later, SUSE Linux EnterpriseServer for SAP with SUSE Linux Enterprise Server 15 Service Pack 3 or later, or Red Hat OpenShiftContainer Platform 4.9 or later. All require Mellanox OFED 5.5 drivers or later.
b. The #EC78 adapter is supported only by IBM i 7.3 or later and runs in dedicated mode only (no PowerVM
virtualization). RoCE and IP Security (IPsec) are supported only by IBM i 7.4 or later (RoCE and IPsec aresupported only by IBM i Db2® Mirror).

3.4.2 Fibre Channel adapters
The Power10 processor-based scale-out servers support connection to devices that use
Fibre Channel connectivity directly or through a Storage Area Network (SAN). A range of
PCIe-connected Fibre Channel adapters are available in low profile and full-height form
factors.
All supported Fibre Channel adapters feature LC connections. If you are attaching a switch ora device with an SC type fiber connector, an LC-SC 50-Micron Fibre Converter Cable or an
LC-SC 62.5-Micron Fiber Converter Cable is required.
Table 3-13 lists the low profile Fibre Channel adapters that are supported within thePower S1022s and Power S1022 server models.
Table 3-13 Low profile FC adapters that are supported in the S1022s and S1022

120

Featurecode

CCIN

Description

Operatingsystem support

Order type

EN1B

578F

PCIe3 LP 32 Gb 2-port Fibre Channel
Adapter

AIX, Linux, IBM i(through VIOS)

Both

EN1D

578E

PCIe3 LP 16 Gb 4-port Fibre Channel
Adapter

AIX, Linux, IBM i(through VIOS)

Both

EN1F

579A

PCIe3 LP 16 Gb 4-port Fibre Channel
Adapter

AIX, Linux, IBM i(through VIOS)

Both

EN1H

579B

PCIe3 LP 2-Port 16 Gb Fibre Channel
Adapter

AIX, Linux

Both

EN1K

579C

PCIe4 LP 32 Gb 2-port Optical Fibre
Channel Adapter

AIX, Linux, IBM i(through VIOS)

Both

EN1M

2CFC

PCIe4 LP 32Gb 4-port Optical Fibre
Channel Adapter

AIX, Linux, IBM i(through VIOS)

Both

EN1P

2CFD

PCIe4 64Gb 2-port Optical Fibre Channel
Adapter

AIX, Linux, IBM i(through VIOS)

Both

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

Feature
code

CCIN

Description

Operatingsystem support

Order type

EN2B

579D

PCIe3 LP 16 Gb 2-port Fibre Channel
Adapter

AIX, Linux, IBM i(through VIOS)

Both

Table 3-14 lists the full-height Fibre Channel adapters that are supported within thePower S1014 and Power S1024 server models, and within the PCIe expansion drawer(EMX0) that is connected to any of the Power10 processor-based scale-out server models.
Table 3-14 Full-height FC adapters supported in the S1014, S1024, and PCIe expansion drawers
Featurecode

CCIN

Description

Operatingsystem support

Order type

EN1A

578F

PCIe3 LP 32 Gb 2-port Fibre Channel
Adapter

AIX, Linux, IBM i(through VIOS)

Both

EN1C

578E

PCIe3 LP 16 Gb 4-port Fibre Channel
Adapter

AIX, Linux, IBM i(through VIOS)

Both

EN1E

579A

PCIe3 LP 16 Gb 4-port Fibre Channel
Adapter

AIX, Linux, IBM i(through VIOS)

Both

EN1G

579B

PCIe3 LP 2-Port 16 Gb Fibre Channel
Adapter

AIX, Linux

Both

EN1J

579C

PCIe4 LP 32 Gb 2-port Optical Fibre
Channel Adapter

AIX, Linux, IBM ia

Both

EN1L

2CFC

PCIe4 32Gb 4-port Optical Fibre Channel
Adapter

AIX, Linux, IBM i(through VIOS)

Both

EN1N

2CFC

PCIe4 32Gb 4-port Optical Fibre Channel
Adapter

AIX, Linux, IBM i(through VIOS)

Both

EN2A

579D

PCIe3 16 Gb 2-port Fibre Channel
Adapter

AIX, Linux, IBM i(through VIOS)iBotha. IBM i support is limited to IBM i 7.5 or later, or IBM i 7.4 TR6 or later.

3.4.3 SAS adapters
The internal storage in the Power10 processor-based, scale-out servers is all based on
nonvolatile memory express (NVMe) devices that are connected over PCIe directly. Morestorage expansion drawers can be connected to the system by using Serial Attached SCSI(SAS) connections.
Table 3-15 lists the low profile SAS adapters that are supported within the Power S1022s andPower S1022 server models.
Table 3-15 Low profile SAS adapters that are supported in the S1022s and S1022
Featurecode

CCIN

Description

OperatingsystemsupportOrder type

EJ0M

57B4

PCIe3 LP RAID SAS Adapter Quad-Port 6
Gb x8

AIX, Linux, IBM i(through VIOS)

Both

EJ11

57B4

PCIe3 LP SAS Tape/DVD Adapter
Quad-port 6 Gb x8

AIX, Linux, IBM i(through VIOS)

Both

Chapter 3. Available features and options

121

Feature
code

CCIN

Description

OperatingsystemsupportOrder type

EJ2C

57F2

PCIe3 LP 12Gb x8 SAS Tape HBA Adapter

IBM i only

Both

Table 3-16 list the full-height SAS adapters that are supported within the Power S1014 andPower S1024 server models, and within the PCIe expansion drawer (EMX0) that is connected
to any of the Power10 processor-based scale-out server models.
Table 3-16 Full-height SAS adapters supported in the S1014, S1024, and PCIe expansion drawers
Featurecode

CCIN

Description

OperatingsystemsupportOrder type

EJ0J

57B4

PCIe3 RAID SAS Adapter Quad-Port 6 Gb
x8

AIX, Linux, IBM i(through VIOS)

Both

EJOL

57CE

PCIe3 12 GB Cache SAS RAID quad-port 6
Gb adapter

AIX, Linux, IBM i(through VIOS)

Both

EJ10

57B4

PCIe3 SAS Tape/DVD Adapter Quad-port 6
Gb x8

AIX, Linux, IBM i(through VIOS)

Both

EJ14

57B1

PCIe3 12 GB Cache RAID PLUS SAS
Adapter Quad-port 6 Gb x8

AIX, Linux, IBM i(through VIOS)

Both

EJ2B

57F2

PCIe3 12Gb x8 SAS Tape HBA Adapter

IBM i only

Both

3.4.4 USB adapters
Universal Serial Bus (USB) adapters are available to support the connection of devices, suchas external DVD drives to the Power10 processor-based scale-out server models.
Table 3-17 lists the low profile USB adapter that is supported within the Power S1022s andPower S1022 server models.
Table 3-17 Low profile USB adapter that is supported in the S1022s and S1022
Featurecode

CCIN

Description

Operating system support

Order
type

EC6J

590F

PCIe2 LP 2-Port USB 3.0
Adapter

AIX, Linux, IBM i (through
VIOS)

Both

Table 3-18 lists the full-height USB adapter that is supported within the Power S1014 andPower S1024 server models, and within the PCIe expansion drawer (EMX0) connected to anyof the Power10 processor-based scale-out server models.
Table 3-18 Full-height USB adapter supported in the S1014, S1024, and PCIe expansion drawers

122

Featurecode

CCIN

Description

Operating system support

Order
type

EC6K

590F

PCIe2 LP 2-Port USB 3.0
Adapter

AIX, Linux, IBM i (through
VIOS)

Both

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

3.4.5 Cryptographic coprocessor adapters
Two different Cryptographic coprocessors or accelerators are supported by the Power10
processor-based scale-out server models, both of which are full-height adapters. These
adapters work with the IBM Common Cryptographic Architecture (CCA) to deliveracceleration to cryptographic workloads.
For more information about the cryptographic coprocessors, the available associatedsoftware, and the available CCA, see this IBM Security® web page.

PCIe Gen3 cryptographic coprocessor 4767
Secure-key adapter provides cryptographic coprocessor and accelerator functions in a single
PCIe card. The adapter is suited to applications that require high-speed, security-sensitive,
RSA acceleration; cryptographic operations for data encryption and digital signing; securemanagement, and the use of cryptographic keys or custom cryptographic applications.
It provides secure storage of cryptographic keys in a tamper-resistant hardware security
module that meets FIPS 140-2 Level 4 security requirements. The adapter is a PCIe Gen3 x4
full-height, half-length card. The adapter runs in dedicated mode only (no PowerVM
virtualization).
This adapter is available only in full-height form factor, and is available in two variations withtwo different Feature Codes:
򐂰 #EJ32 does not include a Blind Swap Cassette (BSC) and can be installed only within the
chassis of a Power S1014 or Power S1024 server.
򐂰 #EJ33 includes a Blind Swap Cassette housing, and can be installed only in a PCIe Gen3
I/O expansion drawer enclosure. This option is supported only for the Power S1022s andPower S1022 server models.

PCIe Gen3 cryptographic coprocessor 4769
The 4769 PCIe Cryptographic Coprocessor features a PCIe local bus-compatible interface.
The coprocessor holds a security-enabled subsystem module and batteries for backup power.
The hardened encapsulated subsystem contains redundant IBM PowerPC® 476 processors,custom symmetric key and hashing engines to perform AES, DES, TDES, SHA-1 and SHA2, MD5 and HMAC, and public key cryptographic algorithm support for RSA and Elliptic Curve
Cryptography.
Other hardware support includes a secure real-time clock, a hardware random number
generator, and a prime number generator. It also contains a separate service processor thatis used to manage self-test and firmware updates. The secure module is protected by atamper responding design that protects against various system attacks.
It includes acceleration for: AES; DES; Triple DES; HMAC; CMAC; MD5; multiple SHA
hashing methods; modular-exponentiation hardware, such as RSA and ECC; and full-duplex
direct memory access (DMA) communications.
A security-enabled code-loading arrangement allows control program and application
program loading and refreshes after coprocessor installation in your server. IBM offers anembedded subsystem control program and a cryptographic application programming
interface (API) that implements the IBM Common Cryptographic Architecture.
The IBM 4769 is verified by NIST at FIPS 140-2 Level 4, the highest level of certification thatis achievable as of this writing for commercial cryptographic devices.

Chapter 3. Available features and options

123

This adapter is available only in full-height form factor, and is available in two variations withtwo different Feature Codes:
򐂰 #EJ35 does not include a Blind Swap Cassette (BSC) and can be installed only within the
chassis of a Power S1014 or Power S1024 server.
򐂰 #EJ37 includes a Blind Swap Cassette housing, and can be installed only in a PCIe Gen3
I/O expansion drawer enclosure. This option is supported only for the Power S1022s andPower S1022 server models.
Table 3-19 lists the cryptographic coprocessor and accelerator adapters that are supported in
the Power10 processor based scale-out servers.
Table 3-19 Cryptographic adapters supported in the Power S1014, S1024, and PCIe expansion drawer
Featurecode

CCIN

Description

OperatingsystemsupportOrder type

EJ32

4767

PCIe3 Crypto Coprocessor no BSC 4767
(S1014 or S1024 chassis only)

AIX, Linux, IBM i
Direct onlya

Both

EJ33

4767

PCIe3 Crypto Coprocessor BSC-Gen34767 (PCIe expansion drawer only)

AIX, Linux, IBM i
Direct onlya

EJ35

C0AF

PCIe3 Crypto Coprocessor no BSC 4769
(S1014 or S1024 chassis only)

AIX, Linux, IBM i
Direct only

EJ37

C0AF

PCIe3 Crypto Coprocessor BSC-Gen34769 (PCIe expansion drawer only)

AIX, Linux, IBM i
Direct only

a. PowerVM virtualization is not supported for this adapter.

Restriction: Restriction: Feature code EJ35 must not be installed in the same slot groupas either cable card feature EJ2A or NVMe expansion card feature EJ1Y. This effects thefollowing feature codes:– PCIe4 4-port NVMe JBOF adapter (FC EJ1Y; CCIN 6B87)– PCIe4 cable adapter (FC EJ2A; CCIN 6B99)– 4769-001 Cryptographic Coprocessor (FC EJ35; CCIN C0AF)
The cryptographic adapter can cause either the PCIe4 cable adapter or the PCIe4 4-port
NVMe JBOF adapter to fail if installed in the same slot group.
For information on the slot groups in the Power S1014 and the Power S1024 see this
support alert.

3.5 Internal storage
NVMe solid-state devices (SSD) are used for internal storage in the Power S1014, S1022s,
S1022, and S1024 servers. The Power S1014 and S1024 servers support up to 16 NVMe
drives and the Power S1022s and S1022 servers support up to 8 NVMe drives.
General PCIe slots (C10/C8 and C11) support NVMe just a bunch of flash (JBOF) adaptersand are cabled to the NVMe backplane. Each NVMe JBOF card contains a 52-lane PCIe
Gen4 switch. The connected NVMe devices are individually addressable, and can beallocated individually to LPARs that are running on the system.
Table 3-20 on page 125 lists the available internal storage options.
124

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

Table 3-20 Internal storage summary
Power S1022s and
S1022

Power S1014

Power S1024

NVMe 8-device
backplane without
RDX

N/A

1-2
Up to 16 devices

1-2
Up to 16 devices

NVMe 8-device
backplane with RDX

N/A

1-2
Up to 16 devices

1-2
Up to 16 devices

NVMe 4-device
backplane

1-2
Up to 8 devices

N/A

N/A

NVMe U.2 7 mm
devices (Max 4)

800 GB

NVMe U.2 15 mm
devices

0.8, 1.6, 3.2, and 6.4 TB

Concurrently
Maintainable NVMe

Yes

RDX (optional)

No

Yes

Yes

3.5.1 S1022s and S1022 Backplane
The Storage backplane with four NVMe U.2 drive slots (#EJ1X) is the base storage
backplane. The internal NVMe is attached to the processor by using a plug-in PCIe NVMe
JBOF card that is included with each storage backplane.
Up to 2 NVMe JBOF cards can be populated in the Power S1022s and S1022 servers with a
1:1 correspondence between the card and the storage backplane. Each JBOF card contains
four connectors that are cabled to connectors on a single 4-device backplane, with each cablecontaining signals for two NVMe devices. Only two cables are installed to support a total offour devices per backplane.
The NVMe JBOF card and storage backplane connection is shown in Figure 3-1.

Storage
Backplane

NVMe JBOF Card

Cables
2 x4

Gen452-laneSwitchU.2 drive slot
U.2 drive slot

2 x4

U.2 drive slot
U.2 drive slot

G4 x16

PCIe G4 x16 slot

Figure 3-1 NVMe JBOF card and storage backplane connection
Chapter 3. Available features and options

125

The NVMe JBOF card is treated as a regular cable card, with the similar EEH support as aplanar switch. The card is not concurrently maintainable because of the cabling that isrequired to the NVMe backplane.

3.5.2 S1014 and S1024 Backplane
The Storage backplane with eight NVMe U.2 device slots (#EJ1Y) is the base storage
backplane. The internal NVMe is attached to the processor by using a plug-in PCIe NVMe
JBOF card that ship with each storage backplane.
Up to two NVMe JBOF cards can be populated in the Power S1014 and S1024 servers with a
1:1 correspondence between the card and the storage backplane. Each JBOF card contains
four connectors that are cabled to four connectors on a single 8-device backplane, with eachcable containing signals for two NVMe devices.
The NVMe JBOF card and storage backplane connection is shown in Table 3-2.

NVMe JBOF Card

Storage
Backplane
Cables2 x4

U.2 drive slot
U.2 drive slot

2 x4

Gen4
52-laneSwitchU.2 drive slot
U.2 drive slot

2 x4

U.2 drive slot
CablesU.2 driveslot

G4 x162 x4

U.2 drive slot
U.2 drive slot

PCIe G4 x16 slot

Figure 3-2 NVMe JBOF card and storage backplane connection

The NVMe JBOF card is treated as a regular cable card, with the similar EEH support as aplanar switch. The card is not concurrently maintainable because of the cabling that isrequired to the NVMe backplane.

3.5.3 NVMe JBOF to backplane cablingThree PCIe slots support NVMe JBOF cards: C8, C10, and C11. Each of these PCIe slots
can be cabled only to one single NVMe Backplane location. C8 and C10 are mutually
exclusive, such that if a JBOF card is plugged in C10, a JBOF card cannot be in C8. Also, if a
JBOF card is plugged in C8, a JBOF card cannot be in C10.
PCIe slots C8 and C10 can be cabled only to NVMe backplane P1 and PCIe slot C11 can becabled only to NVMe backplane P2. A JBOF card never can be plugged in a lower numberedslot than an OpenCAPI adapter.

126

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

Table 3-21 lists the NVMe JBOF card slots that are cabled to NVMe backplanes under various
configurations.
Table 3-21 NVMe JBOF to backplane mappings
NVMe backplane
P1 (Left)

P2 (Middle)

Default JBOF card locationa

C10

C11

JBOF card location when x16 adapter isrequired in C10

C8

C11

JBOF card location when OpenCAPI is in
C10b

N/A

C11

a. JBOF cards are plugged in x16 slot first by default.
b. JBOF card is not allowed in lower slot than OpenCAPI.

Each connector on the JBOF card cables to the corresponding connector on the backplane:򐂰򐂰򐂰򐂰

C0 provides signaling for NVMe drives 0 and 1
C1 provides signaling for drives 2 and 3
C2 provides signaling for drives 4 and 5
C3 provides signaling for drives 6 and 7

In the Power S1022s and S1022 servers, only C1 and C2 are connected. The otherconnectors on the JBOF and backplane are left unconnected.
Figure 3-3 shows the connector numbering on the NVMe JBOF card on the left and theNVMe backplane on the right.

T0 = NVMe C0/C1
T1 = NVMe C2/C3
T3 = NVMe C4/C5
T4 = NVMe C6/C7

Figure 3-3 Connector locations for JBOF card and NVMe backplane

The following methods are used to reduce the likelihood of mis-cabling:򐂰 Cable lengths allow cabling only from a specific PCIe slot to a specific backplane.
򐂰 Labeling connectors 0 - 3 on the NVMe JBOF card and the backplane indicates how to
install the cables.
򐂰 Four bits in each cable are used by the hypervisor for topology checking to confirm
whether the JBOF card is cabled to the correct backplane and that each of the fourconnectors on the JBOF card is cabled to the corresponding connectors on the backplane.

Chapter 3. Available features and options

127

3.5.4 NVMe support
This section provides information about the available PCIe based NVMe storage devices for
the Power S1014, S1022s, S1022, and S1024 servers. These servers are based on the same
PCIe form factor as other PCIe adapters, and are connected to the PCIe slots in the rear ofeach server. These servers are different from the U.2 form factor NVMe devices that are
installed in the front of the system and are connected by using the JBOF adapters andstorage backplanes.
For more information about the U.2 form factor NVMe storage devices, see 3.8, “Disk andmedia features” on page 132.
Table 3-22 lists the PCIe based NVMe storage devices that are available for the PowerS1022s and S1022 servers.
Table 3-22 PCIe-based NVMe storage devices for the Power S1022s and S1022 servers
Feature Code

CCIN

Description

Minimum

Maximum

Operatingsystem support

EC5C

58FD

PCIe3 x8 LP 3.2 TB NVMe Flash adapter for
AIX and Linux

0

9

EC5E

58FE

PCIe3 x8 LP 6.4 TB NVMe Flash adapter for
AIX and Linux

0

9

򐂰
򐂰
򐂰

EC5G

58FC

PCIe3 x8 LP 1.6 TB NVMe Flash Adapter for
AIX and Linux

0

9

EC7A

594A

PCIe4 LP 1.6 TB NVMe Flash Adapter x8 for
AIX and Linux

0

9

EC7C

594B

PCIe4 LP 3.2 TB NVMe Flash Adapter x8 for
AIX and Linux

0

9

EC7E

594C

PCIe4 LP 6.4 TB NVMe Flash Adapter x8 for
AIX and Linux0

9

IBM iaLinux
AIX

a. IBM i supported through VIOS.

Table 3-23 lists the PCIe-based NVMe storage devices that are available for the Power S1014
server.
Table 3-23 PCIe based NVMe storage adapters for the Power S1014 server
Feature Code

CCIN

Description

Minimum

Maximum

Operatingsystem support

EC5B

58FC

PCIe3 x8 1.6 TB NVMe Flash Adapter for
AIX/Linux

0

4

EC5D

58FD

PCIe3 x8 3.2 TB NVMe Flash Adapter for
AIX/Linux

0

4

򐂰
򐂰
򐂰

EC5F

58FE

PCIe3 x8 6.4 TB NVMe Flash Adapter for
AIX/Linux

0

4

128

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

IBM iaAIX
Linux

Feature Code

CCIN

Description

Minimum

Maximum

Operatingsystem support

EC6V

58FC

PCIe3 x8 1.6 TB NVMe Flash Adapter for
IBM i

0

4

IBM ibEC6X

58FD

PCIe3 x8 3.2 TB NVMe Flash Adapter for
IBM i

0

4

EC6Z

58FE

PCIe3 x8 6.4 TB NVMe Flash Adapter for
IBM i

0

4

EC7B

594A

PCIe4 1.6 TB NVMe Flash Adapter x8 for
AIX/Linux

0

4

EC7D

594B

PCIe4 3.2 TB NVMe Flash Adapter x8 for
AIX/Linux

0

4

EC7F

594C

PCIe4 6.4 TB NVMe Flash Adapter x8 for
AIX/Linux

0

4

EC7K

594A

PCIe4 1.6 TB NVMe Flash Adapter x8 for
IBM i

0

4

IBM ib

EC7M

594B

PCIe4 3.2 TB NVMe Flash Adapter x8 for
IBM i

0

4

IBM ib

EC7P

594C

PCIe4 6.4 TB NVMe Flash Adapter x8 for
IBM i

0

4

򐂰
򐂰
򐂰

IBM i
AIX
Linux

a. IBM i supported through VIOS.
b. IBM i 7.5, or later, IBM i 7.4 TR6.

Table 3-24 lists the PCIe-based NVMe storage devices that are available for the Power S1024
server.
Table 3-24 PCIe based NVMe storage devices for the Power S1024 server
Feature code

CCIN

Description

Min

Max

Operatingsystem support

EC5B

58FC

PCIe3 x8 1.6 TB NVMe Flash
Adapter for AIX/Linux

0

9

EC5D

58FD

PCIe3 x8 3.2 TB NVMe Flash
Adapter for AIX/Linux

0

9

򐂰
򐂰
򐂰

EC5F

58FE

PCIe3 x8 6.4 TB NVMe Flash
Adapter for AIX/Linux

0

9

EC6V

58FC

PCIe3 x8 1.6 TB NVMe Flash
Adapter for IBM i

0

9

EC6X

58FD

PCIe3 x8 3.2 TB NVMe Flash
Adapter for IBM i

0

9

EC6Z

58FE

PCIe3 x8 6.4 TB NVMe Flash
Adapter for IBM i

0

9

IBM iaAIX
Linux

IBM ib

Chapter 3. Available features and options

129

Feature code

CCIN

Description

Min

Max

Operatingsystem support

EC7B

594A

PCIe4 1.6 TB NVMe Flash Adapter
x8 for AIX/Linux

0

9

EC7D

594B

PCIe4 3.2 TB NVMe Flash Adapter
x8 for AIX/Linux

0

9

򐂰
򐂰
򐂰

EC7F

594C

PCIe4 6.4 TB NVMe Flash Adapter
x8 for AIX/Linux

0

9

EC7K

594A

PCIe4 1.6 TB NVMe Flash Adapter
x8 for IBM i

0

9

EC7M

594B

PCIe4 3.2 TB NVMe Flash Adapter
x8 for IBM i

0

9

EC7P

594C

PCIe4 6.4 TB NVMe Flash Adapter
x8 for IBM i

0

9

IBM iaAIX
Linux

IBM iba. IBM i supported through VIOS.
b. IBM i 7.5, or later, IBM i 7.4 TR6.

3.5.5 RAID support
Data protection functions for NVMe storage devices in the system unit are provided byoperating system mirroring. Typically, NVMe devices support mirroring (RAID1), with devices
plugged in multiples of two. Operating systems can successfully mirror by using an odd
number of NVMe devices that use “namespaces” on the NVMe devices and mirroring thename spaces.
Several protection options are available for hard disk drives (HDDs) or SSDs that are in
disk-only I/O drawers. Although protecting drives is always preferred, AIX and Linux users canchoose to leave a few or all drives unprotected at their own risk. IBM supports these
configurations.

Supported RAID functions
The following supported PCIe based SAS adapters (see 3.4.3, “SAS adapters” on page 121)
provide hardware support for RAID 0, 5, 6, and 10:
򐂰 RAID 0 provides striping for performance, but does not offer any fault tolerance.
The failure of a single drive results in the loss of all data on the array. This version of RAID
increases I/O bandwidth by simultaneously accessing multiple data paths.
򐂰 RAID 5 uses block-level data striping with distributed parity.
RAID 5 stripes both data and parity information across three or more drives. Fault
tolerance is maintained by ensuring that the parity information for any block of data isplaced on a drive that is separate from the ones that are used to store the data. Thisversion of RAID provides data resiliency if a single drive fails in a RAID 5 array.
򐂰 RAID 6 uses block-level data striping with dual distributed parity.
RAID 6 is the same as RAID 5, except that it uses a second level of independently
calculated and distributed parity information for more fault tolerance. A RAID 6
configuration requires N+2 drives to accommodate the added parity data, which makes itless cost-effective than RAID 5 for equivalent storage capacity.

130

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

This version of RAID provides data resiliency if one or two drives fail in a RAID 6 array.
When you work with large capacity disks, RAID 6 enables you to sustain data parity during
the rebuild process.
򐂰 RAID 10 is a striped set of mirrored arrays.
RAID 10 is a combination of RAID 0 and RAID 1. A RAID 0 stripe set of the data is createdacross a two-disk array for performance benefits. A duplicate of the first stripe set is thenmirrored on another two-disk array for fault tolerance.
This version of RAID provides data resiliency if a single drive fails, and it can provide
resiliency for multiple drive failures.

3.6 External SAS ports
No external SAS ports are available in the Power S1014, S1022s, S1022, and S1024 servers.

3.7 Media drawers
The IBM System Storage 7226 Model 1U3 Multi-Media Enclosure can accommodate up to
two LTO tape drives, two RDX removable disk drive docking stations, or up to four DVD-RAM
drives. The 7226 offers SAS, USB, and FC electronic interface drive options for attachment to
the Power S1014, S1022s, S1022, and S1024 servers.
The 7226-1U3 multi-media expansion enclosure is a 1U rack-mountable dual bay enclosure
with storage device options of LTO7, 8, and 9 tape drives with SAS or Fibre Channel interface.
The 7226 also offers DVD-RAM SAS and USB drive features and RDX 3.0 docking station
options. Up to two devices (or four DVD-RAM drives) can be installed in any combination in
the 7226 enclosure.
The 7226 offers the following drive features:
򐂰
򐂰
򐂰
򐂰
򐂰
򐂰
򐂰
򐂰
򐂰

RDX 3.0 Removable Disk Drive Docking Station (#EU03)
DVD Sled with DVD-RAM SATA/SAS Drive (#1420)
DVD Sled with DVD-RAM USB Drive (#5762)
Half-High LTO Ultrium 7 SAS Tape Drive (#8441)
Half-High LTO Ultrium 7 FC Tape Drive (#8446)
Half-High LTO Ultrium 8 SAS Tape Drive (#8541)
Half-High LTO Ultrium 8 FC Tape Drive (#8546)
Half-High LTO Ultrium 9 SAS Tape Drive (#8641)
Half-High LTO Ultrium 9 FC Tape Drive (#8646)

For more information about the 7226-1U3 multi-media expansion enclosure and supported
options, see 3.10.4, “Useful rack additions” on page 154.

3.7.1 External DVD drives
The Stand-alone USB DVD drive (#EUA5) is an optional, stand-alone external USB-DVD
device. It requires high current at 5V and must use the front USB 3.0 port on the PowerS1014, S1022s, S1022, and S1024 servers. This device includes a USB cable, which
provides the data path and power to this drive.

Chapter 3. Available features and options1313.7.2 RDX removable disk drives
The RDX USB External Docking Station (#EUA4) accommodates RDX removable disk
cartridges of any capacity. The disk is in a protective rugged cartridge enclosure that plugs
into the docking station. The docking station holds one removable rugged disk drive or
cartridge at a time. The rugged removable disk cartridge and docking station can be used in asimilar way to a tape drive.
The RDX USB External Docking Station attaches to a Power server by way of a USB cable,
which carries data and control information. It is not powered by the USB port on the Power
server or Power server USB adapter, but has a separate electrical power cord.
Physically, the docking station is a stand-alone enclosure that is approximately 2.0 x 7.0 x
4.25 inches and can sit on a shelf or on top of equipment in a rack.
Various disk drives are available, as listed in Table 3-25.
Table 3-25 RDX removable disk drives
Feature code

Description

1107

USB 500 GB Removable Disk Drive

EU01

1TB Removable Disk Drive Cartridge

EU08a

RDX 320 GB Removable Disk Drive

EU15a

1.5TB Removable Disk Drive Cartridge

EU2T

2TB Removable Disk Drive Cartridgea. Supported only. The feature can be migrated from existing systems only.

3.8 Disk and media features
NVMe SSDs are used for internal storage in the Power S1014, S1022s, S1022, and S1024
servers. The Power S1014 and S1024 servers support up to 16 NVMe drives and the PowerS1022s and S1022 servers support up to eight NVMe drives.
General PCIe slots (C10/C8, C11) support NVMe JBOF cards that are cabled to an NVMe
backplane. NVMe JBOF cards contain a 52-lane PCIe Gen4 switch.
The Power S1014 and S1024 servers also support an optional internal RDX drive that is
attached by way of the USB controller.
Table 3-26 lists the available internal storage options that can be installed in the Power S1014
and S1024 servers.
Table 3-26 Internal storage options in the Power S1014 and S1024 servers
Feature code

Description

Maximum

EJ1Ya

Storage backplane with eight NVMe U.2 drive slots

2

EUA0

RDX USB Internal Docking Station

1a. Each backplane ships with 1 NVMe JBOF card that plugs into a PCIe slot.

The Power S1014 and S1024 servers with two storage backplanes and RDX drive are shownin Figure 3-4 on page 133.
132

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

Figure 3-4 The Power S1014 and S1024 servers with two storage backplanes and RDX drive

Table 3-27 lists the available U.2 form factor NVMe drive Feature Codes for the Power S1014
and S1024 servers. These codes are different from the PCIe based NVMe storage devices
that can be installed in the PCIe slots in the rear of the server. For more information about theavailable PCIe-based NVMe adapters, see 3.5.4, “NVMe support” on page 128.
Table 3-27 U.2 form factor NVMe device features in the Power S1014 and S1024 servers
Feature code

CCIN

Description

Minimum

Maximum

Operating system
support

EC5V

59BA

Enterprise 6.4 TB SSD PCIe4 NVMe
U.2 module for AIX/Linux

0

16

AIX, IBM ia, and Linux

EC5W

59BA

Enterprise 6.4 TB SSD PCIe4 NVMe
U.2 module for IBM i

016

IBM ibEC5X

59B7

Mainstream 800 GB SSD PCIe3 NVMe
U.2 module for AIX/Linux0

4

AIX and Linux

EC7T

59B7

800 GB Mainstream NVMe U.2 SSD 4k
for AIX/Linux

0

4

EKF2

5B53

Enterprise 800 GB SSD PCIe4 NVMe
U.2 module for IBM i

0

16

IBM i

EKF3

5B52

Enterprise 1.6 TB SSD PCIe4 NVMe
U.2 module for AIX/Linux

0

16

AIX, IBM ia , and Linux

EKF4

5B52

Enterprise 1.6 TB SSD PCIe4 NVMe
U.2 module for IBM i

0

16

IBM i

EKF5

5B51

Enterprise 3.2 TB SSD PCIe4 NVMe
U.2 module for AIX/Linux

0

16

AIX, IBM ia , and Linux

EKF6

5B51

Enterprise 3.2 TB SSD PCIe4 NVMe
U.2 module for IBM i

0

16

IBM i

Chapter 3. Available features and options

133

Feature code

CCIN

Description

Minimum

Maximum

Operating system
support

EKF7

5B50

Enterprise 6.4 TB SSD PCIe4 NVMe
U.2 module for AIX/Linux

0

16

AIX, IBM ia , and Linux

EKF8

5B50

Enterprise 6.4 TB SSD PCIe4 NVMe
U.2 module for IBM i

016

IBM iaES1E

59B8Enterprise 1.6 TB SSD PCIe4 NVMe
U.2 module for AIX/Linux

0

16

AIX, IBM ia , and Linux

ES1F

59B8

Enterprise 1.6 TB SSD PCIe4 NVMe
U.2 module for IBM i

0

16

AIX and IBM ib

ES1G

59B9

Enterprise 3.2 TB SSD PCIe4 NVMe
U.2 module for AIX/Linux

0

16

AIX, IBM ia , and Linux

ES1H

59B9

Enterprise 3.2 TB SSD PCIe4 NVMe
U.2 module for IBM i

016

IBM ib

ES1K

5947

Enterprise 800 GB SSD PCIe4 NVMe
U.2 module for IBM i

016

IBM ib

ES3A

5B53

Enterprise 800 GB SSD PCIe4 NVMe
U.2 module for IBM i

0

16

IBM i

ES3B

5B34

Enterprise 1.6 TB SSD PCIe4 NVMe
U.2 module for AIX/Linux

0

16

AIX, IBM ia , and Linux

ES3C

5B52

Enterprise 1.6 TB SSD PCIe4 NVMe
U.2 module for IBM i

0

16

IBM i

ES3D

5B51

Enterprise 3.2 TB SSD PCIe4 NVMe
U.2 module for AIX/Linux

0

16

AIX, IBM ia , and Linux

ES3E

5B51

Enterprise 3.2 TB SSD PCIe4 NVMe
U.2 module for IBM i

0

16

IBM i

ES3F

5B50

Enterprise 6.4 TB SSD PCIe4 NVMe
U.2 module for AIX/Linux

0

16

AIX, IBM ia , and Linux

ES3G

5B50

Enterprise 6.4 TB SSD PCIe4 NVMe
U.2 module for IBM i

016

IBM iba. IBM i supported through VIOS.
b. IBM i 7.5, or later, IBM i 7.4 TR6, or later.

Table 3-28 lists the available internal storage option that can be installed in the Power S1022s
and S1022 servers.
Table 3-28 Internal storage option in the Power S1022s and S1022 servers
Feature code
EJ1X

a

Description

Maximum

Storage backplane with four NVMe U.2 drive slots

2

a. Each backplane ships with 1 NVMe JBOF card that plugs into a PCIe slot.

134

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

Table 3-29 lists the available U.2 form factor NVMe drive Feature Codes for thePower S1022s and S1022 servers. These codes are different from the PCIe based NVMe
storage devices that can be installed in the PCIe slots in the rear of the server. For more
information about the available PCIe-based NVMe adapters, see 3.5.4, “NVMe support” onpage 128.
Table 3-29 U.2 form factor NVMe device features in the Power S1022s and S1022 servers
Feature code

CCIN

Description

Minimum

Maximum

Operating system
support

EC5V

59BA

Enterprise 6.4 TB SSD PCIe4 NVMe
U.2 module for AIX/Linux

0

8

򐂰
򐂰
򐂰

EC5X

59B7

Mainstream 800 GB SSD PCIe3
NVMe U.2 module for AIX/Linux0

4

AIX and Linux

EC7T

59B7

800 GB Mainstream NVMe U.2 SSD
4k for AIX/Linux

0

4

EKF3

5B52

Enterprise 1.6 TB SSD PCIe4 NVMe
U.2 module for AIX/Linux

0

8

EKF5

5B51

Enterprise 3.2 TB SSD PCIe4 NVMe
U.2 module for AIX/Linux

0

8

EKF7

5B50

Enterprise 6.4 TB SSD PCIe4 NVMe
U.2 module for AIX/Linux

0

8

ES1E

59B8

Enterprise 1.6 TB SSD PCIe4 NVMe
U.2 module for AIX/Linux

0

8

ES1G

59B9

Enterprise 3.2 TB SSD PCIe4 NVMe
U.2 module for AIX/Linux

0

8

ES3B

5B34

Enterprise 1.6 TB SSD PCIe4 NVMe
U.2 module for AIX/Linux

0

8

ES3D

5B51

Enterprise 3.2 TB SSD PCIe4 NVMe
U.2 module for AIX/Linux

0

8

ES3F

5B50

Enterprise 6.4 TB SSD PCIe4 NVMe
U.2 module for AIX/Linux

0

8

򐂰
򐂰
򐂰

AIX
IBM iaLinuxAIXIBM iaLinux

a. IBM i supported through VIOS.

The Stand-alone USB DVD drive (#EUA5) is an optional, stand-alone external USB-DVD
device. This device includes a USB cable. The cable provides the data path and power to thisdrive.
SAS backplane is not supported on the Power S1014, S1022s, S1022, and S1024 servers.
SAS drives can be placed only in IBM EXP24SX SAS Storage Enclosures, which areconnected to system units by using a serial-attached SCSI (SAS) ports in PCIe based SAS
adapters.
For more information about the available SAS adapters, see 3.4.3, “SAS adapters” onpage 121.

Chapter 3. Available features and options

1353.9 External IO subsystems
If more PCIe slots beyond the system node slots are required, the Power S1014, S1022s,
S1022, and S1024 servers support adding I/O expansion drawers.
If you need more directly connected storage capacity than is available within the internal
NVMe storage device bays, you can attach external disk subsystems to the Power S1014,
S1022s, S1022, and S1024 servers:
򐂰 NED24 NVMe expansion drawer
򐂰 EXP24SX SAS Storage Enclosures򐂰 IBM System Storage

3.9.1 PCIe Gen3 I/O expansion drawer
This 19-inch, 4U (4 EIA) enclosure provides PCIe Gen3 slots outside of the system unit. It has
two module bays. One 6-slot fan-out Module (#EMXH) can be placed in each module bay.
Two 6-slot modules provide a total of 12 PCIe Gen3 slots. Each fan-out module is connected
to a PCIe3 Optical Cable adapter that is installed in the system unit over an active optical
CXP cable (AOC) pair or CXP copper cable pair.
The PCIe Gen3 I/O Expansion Drawer has two redundant, hot-plug power supplies. Eachpower supply has its own separately ordered power cord. The two power cords plug into a
power supply conduit that connects to the power supply. The single-phase AC power supply is
rated at 1030 W and can use 100 - 120 V or 200 - 240 V. If 100 - 120 V is used, the maximum
is 950 W. It is a best practice that the power supply connects to a power distribution unit
(PDU) in the rack. IBM Power PDUs are designed for a 200 - 240 V electrical source.
A blind swap cassette (BSC) is used to house the full-height adapters that are installed inthese slots. The BSC is the same BSC that is used with previous generation 12X attached I/O
drawers (#5802, #5803, #5877, and #5873). The drawer includes a full set of BSCs, even if
the BSCs are empty.
Concurrent repair, and adding or removing PCIe adapters, is done by HMC-guided menus orby operating system support utilities.
Figure 3-5 shows a PCIe Gen3 I/O expansion drawer.

Figure 3-5 PCIe Gen3 I/O expansion drawer

136

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

Figure 3-6 shows the back view of the PCIe Gen3 I/O expansion drawer.

PCIe Optical Interface to CEC

Fan-out Module
6 PCIe G3 Slots
4 x8 & 2 x16

PCIe Optical Interface to CEC

Fan-out Module
6 PCIe G3 Slots
4 x8 & 2 x16

Dual Power Cords

Figure 3-6 Rear view of the PCIe Gen3 I/O expansion drawer

I/O drawers and usable PCI slots
Figure 3-7 shows the rear view of the PCIe Gen3 I/O expansion drawer that is equipped with
two PCIe3 6-slot fan-out modules with the location codes for the PCIe adapter slots.

P1-C1
P1-C2
P1-C3

P1-C6
P1-C5
P1-C4

P2-C3
P2-C2
P2-C1

P2-C4
P2-C5
P2-C6

Figure 3-7 Rear view of a PCIe Gen3 I/O expansion drawer with PCIe slots location codes

Chapter 3. Available features and options

137

Table 3-30 lists the PCI slots in the PCIe Gen3 I/O expansion drawer that is equipped with two
PCIe3 6-slot fan-out modules.
Table 3-30 PCIe slot locations for the PCIe Gen3 I/O expansion drawer with two fan-out modules
Slot

Location code

Description

Slot 1

P1-C1

PCIe3, x16

Slot 2

P1-C2

PCIe3, x8

Slot 3

P1-C3

PCIe3, x8

Slot 4

P1-C4

PCIe3, x16

Slot 5

P1-C5

PCIe3, x8

Slot 6

P1-C6

PCIe3, x8

Slot 7

P2-C1

PCIe3, x16

Slot 8

P2-C2

PCIe3, x8

Slot 9

P2-C3

PCIe3, x8

Slot 10

P2-C4

PCIe3, x16

Slot 11

P2-C5

PCIe3, x8

Slot 12

P2-C6

PCIe3, x8

Consider the following points about Table 3-30:
򐂰 All slots support full-length, full-height adapters or short (LP) adapters with a full-height tailstock in single-wide, Gen3, BSC.
򐂰 Slots C1 and C4 in each PCIe3 6-slot fan-out module are x16 PCIe3 buses, and slots C2,
C3, C5, and C6 are x8 PCIe buses.
򐂰 All slots support enhanced error handling (EEH).
򐂰 All PCIe slots are hot-swappable and support concurrent maintenance.
Table 3-31 lists the maximum number of I/O drawers that are supported and the total numberof PCI slots that are available to the server.
Table 3-31 Maximum number of I/O drawers that are supported and total number of PCI slots
ServerMaximum number of
I/O exp drawers

Maximum number of
I/O fan-out modules

Maximum PCIe
slots

Power S1014 (1-socket)a

1b

1

10

Power S1022s (1-socket)

1b

1

10

Power S1022s (2-socket)

2

4

30

Power S1022 (1-socket)

1b

1

10

Power S1022 (2-socket)

2

4

30

Power S1024 (1-socket)

1b

1

10

Power S1024 (2-socket)

2

4

30

a. The PCIe expansion drawer (#EMX0) cannot be used with the four-core configuration PowerS1014 server.
b. The empty PCIe module bay must be populated by a filler module.

138

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

PCIe3 x16 to CXP Converter Adapter
The PCIe3 x16 to CXP Converter adapter provides two ports for the attachment of two
expansion drawer cables. One adapter supports the attachment of one PCIe3 6-slot fanout
module in an EMX0 PCIe Gen3 I/O expansion drawer.
Table 3-32 lists the available converter adapters that can be installed in the Power S1022s
and S1022 servers.
Table 3-32 Available converter adapter in the Power S1022s and S1022
Feature code

Slot priorities(one processor)

Maximum
number ofadapters
supported

Slot priorities(two
processors)

Maximum
number ofadapters
supported

EJ24a

10

1

3, 0, 4, 10

4a. single-wide, low-profile

Table 3-33 lists the available converter adapter that can be installed in the Power S1014 andS1024 servers.
Table 3-33 Available converter adapter in the Power S1014 and S1024
Feature code

Slot priorities(one processor)

Maximum
number ofadapters
supported

Slot priorities(two
processors)

Maximum
number ofadapters
supported

EJ2Aa

10

1

3, 0, 4, 10

4a. single-wide, full-height

The PCIe3 x16 to CXP Converter Adapter (#EJ24) is shown in Figure 3-8.

T1

T2

Figure 3-8 PCIe3 x16 to CXP Converter Adapter (#EJ24)

Chapter 3. Available features and options

139

PCIe Gen3 I/O expansion drawer optical cabling
I/O drawers are connected to the adapters in the system node through data transfer cables:򐂰 3 m Active Optical Cable Pair for PCIe3 Expansion Drawer (#ECCX)
򐂰 10 m Active Optical Cable Pair for PCIe3 Expansion Drawer (#ECCY)򐂰 3 m Copper CXP Cable Pair for PCIe3 Expansion Drawer (#ECCS)
Although these cables are not redundant, the loss of one cable reduces the I/O bandwidth(that is, the number of lanes that are available to the I/O module) by 50%.
Note: Consider the following points:
򐂰 Use the 3 m cables for intra-rack installations. Use the 10 m cables for inter-rackinstallations.
򐂰 You cannot mix copper and optical cables on the same PCIe Gen3 I/O drawer. Bothfan-out modules use copper cables or both use optical cables.
A minimum of one PCIe3 x16 to CXP Converter adapter for PCIe3 Expansion Drawer isrequired to connect to the PCIe3 6-slot fan-out module in the I/O expansion drawer. The
fan-out module has two CXP ports. The top CXP port of the fan-out module is cabled to the
top CXP port of the PCIe3 x16 to CXP Converter adapter. The bottom CXP port of the fan-out
module is cabled to the bottom CXP port of the same PCIe3 x16 to CXP Converter adapter.
To set up the cabling correctly, complete the following steps:
1. Connect an optical cable or copper CXP cable to connector T1 on the PCIe3 x16 to CXPConverter adapter in your server.
2. Connect the other end of the optical cable or copper CXP cable to connector T1 on one of
the PCIe3 6-slot fan-out modules in your expansion drawer.
3. Connect another cable to connector T2 on the PCIe3 x16 to CXP Converter adapter inyour server.
4. Connect the other end of the cable to connector T2 on the PCIe3 6-slot fan-out module inyour expansion drawer.
5. Repeat steps 1 - 4 for the other PCIe3 6-slot fan-out module in the expansion drawer, if
required.
Drawer connections: Each fan-out module in a PCIe3 Expansion Drawer can beconnected only to a single PCIe3 x16 to CXP Converter adapter for PCIe3 Expansion
Drawer.

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Figure 3-9 shows the connector locations for the PCIe Gen3 I/O Expansion Drawer.

Figure 3-9 Connector locations for the PCIe Gen3 I/O expansion drawer

Figure 3-10 shows the typical optical cable connections.

ServerI/O Expansion Drawer

Optical cable adapter
T1
T2

Fanout module
Optical cables

Optical cable adapter
T1
T2

T1
T2

Fanout module
Optical cables

T1
T2

Figure 3-10 Typical optical cable connections

Chapter 3. Available features and options

141

PCIe Gen3 I/O expansion drawer system power control network cabling
No system power control network (SPCN) is used to control and monitor the status of powerand cooling within the I/O drawer. SPCN capabilities are integrated into the optical cables.

3.9.2 NED24 NVMe Expansion Drawer
IBM continues to provide industry leading I/O capabilities with the a new PCIe direct-attachedexpansion drawer, the NED24. The new NED24 NVMe Expansion Drawer (#ESR0) is astorage expansion enclosure with 24 U.2 NVMe bays.
Each of the 24 NVMe bays in the NED24 drawer are separately addressable and each can be
assigned to a specific LPAR or VIOS providing native boot support for up to 24 partitions.
Currently each drawer can support up to 153 TB.
The NED24 NVMe Expansion Drawer is supported on the IBM Power S1024, IBM PowerS1022, and Power S1022s servers by IBM AIX, IBM i, Linux, and VIOS. The NED24 drawer is
not supported on the IBM Power S1014. A maximum of one NED24 is supported on each ofthese servers.
Figure 3-11is a view of the front of the NED24 NVMe Expansion Drawer.

Figure 3-11 NED24 NVMe Expansion Drawer front view

Up to 24 U.2 NVME devices can be installed in the NED24 drawer using 15 mm Gen3
carriers. The 15 mm carriers can accommodate either 7 mm or 15 mm NVMe devices. The
devices shown in Table 3-34 are currently supported in the NED24 drawer.
Table 3-34 Devices supported in the NED24 expansion drawer
FeatureDescription

ES3H

Enterprise 800GB SSD PCIe4 NVMe U.2 module for AIX/Linux

ES3A

Enterprise 800GB SSD PCIe4 NVMe U.2 module for IBM i

ES3BEnterprise 1.6 TB SSD PCIe4 NVMe U.2 module for AIX/Linux

ES3C

Enterprise 1.6 TB SSD PCIe4 NVMe U.2 module for IBM i

ES3DEnterprise 3.2 TB SSD PCIe4 NVMe U.2 module for AIX/Linux

ES3E

Enterprise 3.2 TB SSD PCIe4 NVMe U.2 module for IBM i

ES3FEnterprise 6.4 TB SSD PCIe4 NVMe U.2 module for AIX/Linux

ES3G

Enterprise 6.4 TB SSD PCIe4 NVMe U.2 module for IBM i

Each NED24 NVMe Expansion Drawer contains two redundant AC power supplies. The AC
power supplies are part of the enclosure base.

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IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

Prerequisites and support
This section provides details on the operating system and firmware requirements for the
NED24 drawer.

Power10 servers
The NED24 drawer is only supported in the Power S1022, Power S1022s and Power S1024
with two processors, single processor configurations are not supported due to card
placement requirements for the PCie4 cable adapter.
Two PCIe4 cable adapters are required to connect each NED24 drive enclosure. This adapter
is available in both a full height (EJ2A) for the Power S1024 and a low profile version (EJ24)
for the Power S1022 and Power S1022s. This is the same adapter which is used to connect
the PCIe Gen3 I/O expansion drawer. For more details on installation of the EJ2A and EJ24
adapters see “PCIe3 x16 to CXP Converter Adapter” on page 139.

Operating system support
The NED24 drawer is supported by the operating systems shown in Table 3-35 at the time ofrelease.
Table 3-35 Operating support for NED24 drawer
Operating system

Levels supported

AIX

7.2 and 7.3

IBM i

7.4 and 7.5

Linux

SLES 15 and SLES 16
RHEL 8 and RHEL 9

VIOS

3.1.4.21

Firmware requirements
The minimum system firmware level required to support the NED24 drawer is FW1040, which
requires HMC version 10.2.1040 or higher.
Important: The NED24 requires FW1040 to be installed on the system connected. The
following adapters were recently announced which require FW1030.20 and are NOT
supported by FW1040 and as such are currently not concurrently installable with the
NED24 drawer.
–
–
–
–
–

PCIe3 12 Gb x8 SAS Tape HBA adapter(#EJ2B/#EJ2C)
PCIe4 32 Gb 4-port optical FC adapter (#EN2L/#EN2M)
PCIe4 64 Gb 2-port optical FC adapter (#EN2N/#EN2P)
Mixed DDIMM support for the Power E1050 server (#EMCM)
100 V power supplies support for the Power S1022s server (#EB3R)

This restriction will be removed in a future system firmware release.

Installation considerations
This section describes installation considerations for installing and connecting the NED24
drawer to your Power10 scale out server.

Chapter 3. Available features and options

143

Connecting the NED24 NVMe Expansion Drawer
The NED24 NVMe Expansion Drawer is connected to a Power server through dual CXPConverter adapters (#EJ24 or #EJ2A). The adapters are connected to the Expansion Service
Manager (ESM) modules in the NED24 drawer using either copper cables (up to 3 m) or
optical cables (up to 20 m).The back of the NED24 drawer is shown in Figure 3-12 where you
can see the locations to plug in the cables.

Figure 3-12 Back view of NED24 drawer

Both CXP Converter adapters require one of the following cable features:
–
–
–
–
–

#ECLR - 2.0 M Active Optical Cable x16 Pair for PCIe4 Expansion Drawer#ECLS - 3.0 M CXP x16 Copper Cable Pair for PCIe4 Expansion Drawer#ECLX - 3.0 M Active Optical Cable x16 Pair for PCIe4 Expansion Drawer#ECLY - 10 M Active Optical Cable x16 Pair for PCIe4 Expansion Drawer#ECLZ - 20 M Active Optical Cable x16 Pair for PCIe4 Expansion Drawer

Note: Each feature code provides two cables which would connect from the server adapter
to one of the ESMs. The same feature code should be used to connect the second server
adapter to the other ESM. Each drawer requires two identical cable feature codes to connect.
At the time of GA, only mode 1 single connect is supported for the NED24 NVMe Expansion
drawer. In mode 1, the NVMe drives are configured as single-path devices with only 1 ESM
controlling each device. The switch in each of the ESMs is configured to logically drive only 12of the 24 NVMe drives. No device failover capability is available.
OS level mirroring is recommended to avoid a single point of failure in the connection to thedrives in the NED24 enclosures. See “Drive installation order” for recommended drive
locations within the drawer for availability and reliability.
At time of GA both ESMs must be connected to the same server, single connections andmultiple server connections are not supported.

Drive installation order
While there is no performance difference for drives in any of the NED24 slots, there is arecommended order for installation of drives within the enclosure. This is to provide good
separation for the suggested mirroring between drives and to also provide optimal coolingand airflow within the enclosure. Figure 3-13 on page 145 shows the suggested placement for
the first four drives and Table 3-36 on page 145 shows the suggested placement of all drives.

144

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

Figure 3-13
Table 3-36 Recommended drive installation order
Drive pairFirst drive slot

Second drive slot

1

1

13

2

7

19

3

2

14

4

8

20

5

3

15

6

9

21

7

4

16

8

10

22

9

5

17

10

11

23

11

6

18

12

12

24

Summary
The NED24 drawer provides an excellent method of increasing the internal NVMe storage in
the Power10 processor family and should be considered instead of external SAS. NVMe
provides significantly lower price per GB than SAS based enclosures and also provides
significantly better performance.
Table 3-37 Summary of the NED24 specifications
External Storage Drawer
Specifications

ESR0 PCIe NED24

Rack mount2U 19" rack

Devices Supported

24 SFF 15mm U.2 NVMe devices

Max Enterprise Class Storage
Capacity

153.6TBInternal Connectivity

PCIe Gen4

External Connectivty

Dual PCIe Gen4 CXP Cable Adapters

Cables

Copper cables up to 3m
Active Optical cables up to 20m

Electronics service module

Dual redundant ESMs with 24 PCIe Gen4 lanes each

Chapter 3. Available features and options

145

External Storage Drawer
Specifications

ESR0 PCIe NED24

ESM RASHot insert/removalPower Fault Tolerant

Power Supply

Dual ‘EU Regulation 2019 42' Compliant Power Supply

–
–
–
–

180-264 VAC 50/60 MHz
No DC option
N-1 Power & Cooling
Hot swappable

Operating Systems

AIX, IBM i, Linux, VIOS

Platforms Supported

Power10Major FRU-able Parts

NVMe Devices, Cable Card, ESM, PSU & PDB, Cables,
Mid-Plane

Concurrent Maintenance

NVMe Devices, ESM, PSUs, Cables

Cooling & Power

Redundant Cooling and Power

Code Updates

Concurrent Code Download

3.9.3 EXP24SX SAS Storage Enclosure
The EXP24SX SAS storage enclosure (#ESLS) is the only direct attached storage device(DASD) drawer that is available for the Power S1014, S1022s, S1022, and S1024 servers toprovide non-NVMe storage device capacity.
The EXP24SX drawer is a storage expansion enclosure with 24 2.5-inch SFF SAS drive bays.
It supports up to 24 hot-plug HDDs or SSDs in only 2 EIA rack units (2U) of space in a 19-inch
rack. The EXP24SX SFF bays use SFF Gen2 (SFF-2) carriers or trays.
The EXP24SX drawers feature the following high-reliability design points:
򐂰 SAS bays that support hot-swap
򐂰 Redundant and hot-plug power and fan assemblies򐂰 Dual power cords
򐂰 Redundant and hot-plug Enclosure Services Managers (ESMs)
򐂰 Redundant data paths to all drives
򐂰 LED indicators on drives, bays, ESMs, and power supplies that support problem
identification
򐂰 Through the SAS adapters and controllers, drives can be protected with RAID andmirroring and hot-spare capability

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IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

Figure 3-14 shows the EXP24SX drawer.

Figure 3-14 EXP24SX drawer

With AIX/Linux/VIOS, the EXP24SX can be ordered as configured with four sets of 6 bays
(mode 4), two sets of 12 bays (mode 2), or one set of 24 bays (mode 1). With IBM i, one set of
24 bays (mode 1) is supported. It is possible to change the mode setting in the field by using
software commands along with a documented procedure.
Note: Consider the following points:
򐂰 For the EXP24SX drawer, a maximum of 24 2.5-inch SSDs or 2.5-inch HDDs aresupported in the 24 SAS bays. HDDs and SSDs cannot be mixed in the same mode-1
drawer. HDDs and SSDs can be mixed in a mode-2 or mode-4 drawer, but they cannot
be mixed within a logical split of the drawer. For example, in a mode-2 drawer with two
sets of 12 bays, one set can hold SSDs and one set can hold HDDs, but SSDs and
HDDs cannot be mixed in the same set of 12 bays.
򐂰 When changing modes, a skilled, technically qualified person must follow the special
documented procedures. Improperly changing modes can destroy RAID sets, which
prevents access to data, or might allow partitions to access data from another partition.

Chapter 3. Available features and options

147

The front view of the #ESLS storage enclosure with mode group and drive locations is shownin Figure 3-15.

1
-D
1
P

2
-D
1
P

3
-D
1
P

4
-D
1
P

5
-D
1
P

6
-D
1
P

7
-D
1
P

8
-D
1
P

MODE 1

MODE 2

MODE 4

9
-D
1
P

0
1
-D
1
P

1
1
-D
1
P

2
1
-D
1
P

3
1
-D
1
P

4
1
-D
1
P

5
1
-D
1
P

6
1
-D
1
P

7
1
-D
1
P

8
1
-D
1
P

9
1
-D
1
P

0
2
-D
1
P

1
2 2
2
-D
-D
1
P 1
P

3
2
-D
1
P

4
2
-D
1
P

24 disks x1

GROUP 1GROUP 1GROUP 1GROUP 2

GROUP 2

GROUP 3

GROUP 4

12 disks x2

6 disks x4

Figure 3-15 Front view of the ESLS storage enclosure with mode groups and drive locations

Four mini-SAS HD ports on the EXP24SX are attached to PCIe Gen3 SAS adapters. The
following PCIe3 SAS adapters support the EXP24SX:򐂰 PCIe3 RAID SAS Adapter Quad-port 6 Gb x8 (#EJ0J)
򐂰 PCIe3 12 GB Cache RAID Plus SAS Adapter Quad-port 6 Gb x8 (#EJ14)
򐂰 PCIe3 LP RAID SAS Adapter Quad-port 6 Gb x8 (#EJ0M)
The attachment between the EXP24SX drawer and the PCIe Gen 3 SAS adapter is throughSAS YO12 or X12 cables. The PCIe Gen 3 SAS adapters support 6 Gb throughput. The
EXP24SX drawer can support up to 12 Gb throughput if future SAS adapters support thatcapability.
The following cable options are available:
򐂰 X12 cable: 3-meter copper (#ECDJ), 4.5-meter optical (#ECDK), 10-meter optical(#ECDL)򐂰 YO12 cables: 1.5-meter copper (feature ECDT), 3-meter copper (#ECDU)
򐂰 1 M 100 GbE Optical Cable QSFP28 (AOC) (#EB5K)
򐂰 1.5 M 100 GbE Optical Cable QSFP28 (AOC) (#EB5L)
򐂰 2 M 100 GbE Optical Cable QSFP28 (AOC) (#EB5M)
򐂰 3 M 100 GbE Optical Cable QSFP28 (AOC) (#EB5R)
򐂰 5 M 100 GbE Optical Cable QSFP28 (AOC) (#EB5S)
򐂰 10 M 100 GbE Optical Cable QSFP28 (AOC) (#EB5T)
򐂰 15 M 100 GbE Optical Cable QSFP28 (AOC) (#EB5U)
148

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction򐂰 20 M 100 GbE Optical Cable QSFP28 (AOC) (#EB5V)
򐂰 30 M 100 GbE Optical Cable QSFP28 (AOC) (#EB5W)
򐂰 50 M 100 GbE Optical Cable QSFP28 (AOC) (#EB5X)
Six SAS connectors are at the rear of the EXP24SX drawers to which SAS adapters orcontrollers are attached. They are labeled T1 T2, and T3; two T1s, two T2s, and two T3sconnectors. Consider the following points:
򐂰 In mode 1, two or four of the six ports are used. Two T2 ports are used for a single SAS
adapter, and two T2 and two T3 ports are used with a paired set of two adapters or a dual
adapters configuration.
򐂰 In mode 2 or mode 4, four ports are used, two T2s and two T3 connectors to access all the
SAS bays.
򐂰 The T1 connectors are not used.
Figure 3-16 shows the connector locations for the EXP24SX storage enclosure.

MODE 1

MODE 2

1

1
2

T3

2

T2

5
6

T1

3
4

7
8
9
10
11

T3

T3

T2

T2

4
5

1

T3
T2

6
7

T1

12
13
14
15
16
17
18
19
20
21
22
23
24

ESM1

3

MODE 4

ESM2

T1

T3
T2

2
3
4
5

8
9

8
9
10

T1

T1

11
12
13

14

14

15
16
17

15
16
17

18

18

19
20
21

19
20
21

22

22

23
24

23
24

ESM1

ESM2

T2

6
7

10
11
12
13

T3

ESM1

tsr
o se dP l re
i
d b
a u
e
r C q
a X e
R
h
S

T1

ESM2

Figure 3-16 Rear view of the EXP24SX with location codes and different split modes

For more information about SAS cabling and cabling configurations, see this IBM
Documentation web page.

Chapter 3. Available features and options

149

3.9.4 IBM Storage
With IBM Storage, every bit of your organization’s data is available to you in the most secureand insightful way possible, so that you can take informed action on it quickly andconsistently.
For more information about the various offerings, see Data Storage Solutions.
The following sections highlight some of the offerings.

IBM Elastic Storage System
IBM Elastic Storage® System is a modern implementation of software-defined storage (SDS).
The IBM Elastic Storage System 3500 and IBM Elastic Storage System 5000 make it easierfor you to deploy fast, highly scalable storage for AI and big data.
With the low latency and high-performance NVMe storage technology and up to 8 YB global
file system and global data services of IBM Spectrum® Scale, the IBM Elastic Storage
System 3500 and 5000 nodes can grow to multi-yottabyte configurations. They also can be
integrated into a federated global storage system.
For more information, see IBM Elastic Storage System.

IBM FlashSystem: Flash data storage
The IBM FlashSystem family is a portfolio of cloud-enabled storage systems that can beeasily deployed and quickly scaled to help optimize storage configurations, streamline issue
resolution, and reduce storage costs.
IBM FlashSystem is built with IBM Spectrum Virtualize software to help deploy sophisticatedhybrid cloud storage solutions, accelerate infrastructure modernization, address
cybersecurity needs, and maximize value by using the power of AI. New IBM FlashSystemmodels deliver the performance to facilitate cyber security without compromising production
workloads.
For more information, see IBM FlashSystem.

IBM DS8000 Storage system
IBM DS8900F is the next generation of enterprise data systems, which are built withadvanced Power9 processor technology. Designed for data-intensive and mission-critical
workloads, DS8900F adds next-level performance, data protection, resiliency, and availability
across your hybrid cloud solutions. It accomplishes this goal by using ultra-low latency, better
than 99.99999 (seven nines) availability, transparent cloud tiering, and advanced dataprotection against malware and ransomware.
For more information, see IBM DS8000 Storage system.

3.10 System racks
Except for the S1014 tower model IBM Power S1014, the S1022s, S1022, and S1024 servers
fit into a standard 19-inch rack. These server models are all certified and tested in the IBM
Enterprise racks (7965-S42, 7014-T42, or 7014-T00). Customers can choose to place theserver in other racks if they are confident that those racks have the strength, rigidity, depth,
and hole pattern characteristics that are needed. Contact IBM Support to determine whether
other racks are suitable.

150

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and IntroductionOrder information: Only the IBM Enterprise 42U slim rack (7965-S42) is available andsupported for factory integration and installation of the server. The other Enterprise racks(7014-T42 and 7014-T00) are supported only for installation into existing racks. Multiple
servers can be installed into a single IBM Enterprise rack in the factory or field.
If a system is installed in a rack or cabinet that is not from IBM, ensure that the rack meets therequirements that are described in 3.10.5, “Original equipment manufacturer racks” onpage 156.
Responsibility: The customer is responsible for ensuring the installation of the server inthe preferred rack or cabinet results in a configuration that is stable, serviceable, and safe.
It also must be compatible with the drawer requirements for power, cooling, cablemanagement, weight, and rail security.

3.10.1 IBM Enterprise 42U Slim Rack 7965-S42
The 2.0-meter (79-inch) Model 7965-S42 is compatible with past and present IBM Power
servers and provides an excellent 19-inch rack enclosure for your data center. Its 600 mm(23.6 in.) width combined with its 1100 mm (43.3 in.) depth plus its 42 EIA unit enclosure
capacity provides great footprint efficiency for your systems. It can be placed easily on
standard 24-inch floor tiles.
The 7965-S42 rack includes space for up to four PDUs in side pockets. Extra PDUs beyond
four are mounted horizontally and each uses 1U of rack space.
The Enterprise Slim Rack comes with options for the installed front door:򐂰 Basic Black/Flat (#ECRM)
򐂰 High-End appearance (#ECRT)򐂰 OEM Black (#ECRE)
All options include perforated steel, which provides ventilation, physical security, and visibilityof indicator lights in the installed equipment within. All options also include a lock andmechanism that is identical to the lock on the rear doors.
Only one front door must be included for each rack ordered. The basic door (#ECRM) andOEM door (#ECRE) can be hinged on the left or right side.
Orientation: #ECRT must not be flipped because the IBM logo is upside down.
At the rear of the rack, a perforated steel rear door (#ECRG) can be installed. The basic door(#ECRG) can be hinged on the left or right side, and includes a lock and mechanism identicalto the lock on the front door. The basic rear door (#ECRG) must be included with the order ofa new Enterprise Slim Rack.
Because of the depth of the S1022s and S1022 server models, the 5-inch rear rack extension(#ECRK) is required for the Enterprise Slim Rack to accommodate these systems. Thisextension expands the space available for cable management and allows the rear door toclose safely.

Chapter 3. Available features and options151

3.10.2 AC power distribution units
The IBM Enterprise Slim Rack can be ordered with a selection of different Power Distribution
Units (PDUs) that deliver power to the individual servers from an incoming AC power source.
The choice and number of PDUs to install in the rack depends on the incoming power supply
available on site, the number of systems being powered, and the power consumption of thosesystems.
Rack-integrated system orders require at least two PDU devices be installed in the rack tosupport independent connection of redundant power supplies in the server.

Standard Power Distribution Unit
The standard PDU (#7188) mounts in a 19-inch rack and provides 12 C13 power outlets. The
PDU has six 16 A circuit breakers, with two power outlets per circuit breaker.
To connect to the standard PDU, and system units and expansion units must use a power
cord with a C14 plug to connect to #7188. One of the following power cords must be used to
distribute power from a wall outlet to the #7188 PDU: #6489, #6491, #6492, #6653, #6654,#6655, #6656, #6657, #6658, or #6667.

High-function Power Distribution Unit
High-function PDUs provide more electrical power per PDU and offer better “PDU footprint”
efficiency. In addition, they are intelligent PDUs that provide insight to power usage byreceptacle and remote power on and off capability for easier support by individual receptacle.
The following high-function PDUs are orderable as #ECJJ, #ECJL, #ECJN, and #ECJQ:
򐂰 High Function 9xC19 PDU plus (#ECJJ)
This intelligent, switched 200 - 240 volt AC PDU includes nine C19 receptacles on thefront of the PDU and three C13 receptacles on the rear of the PDU. The PDU is mounted
on the rear of the rack, which makes the nine C19 receptacles easily accessible.
򐂰 High Function 9xC19 PDU plus 3-Phase (#ECJL)This intelligent, switched 208-volt 3-phase AC PDU includes nine C19 receptacles on thefront of the PDU and three C13 receptacles on the rear of the PDU. The PDU is mounted
on the rear of the rack, which makes the nine C19 receptacles easily accessible.
򐂰 High Function 12xC13 PDU plus (#ECJN)This intelligent, switched 200 - 240 volt AC PDU includes 12 C13 receptacles on the frontof the PDU. The PDU is mounted on the rear of the rack, which makes the 12 C13
receptacles easily accessible.
򐂰 High Function 12xC13 PDU plus 3-Phase (#ECJQ)
This intelligent, switched 208-volt 3-phase AC PDU includes 12 C13 receptacles on thefront of the PDU. The PDU is mounted on the rear of the rack, which makes the 12 C13
receptacles easily accessible.
Table 3-38 lists the Feature Codes for the high-function PDUs.
Table 3-38 High-function PDUs available with IBM Enterprise Slim Rack (7965-S42)

152

PDUs

1-phase or 3-phasedepending on country wiring
standards

3-phase 208 V depending on
country wiring standards

Nine C19 receptacles

ECJJ

ECJL

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction

PDUs

1-phase or 3-phasedepending on country wiring
standards

3-phase 208 V depending on
country wiring standards

Twelve C13 receptacles

ECJN

ECJQ

The PDU receives power through a UTG0247 power-line connector. Each PDU requires one
PDU-to-wall power cord. Various power cord features are available for various countries andapplications by varying the PDU-to-wall power cord, which must be ordered separately.
Each power cord provides the unique design characteristics for the specific power
requirements. To match new power requirements and save previous investments, thesepower cords can be requested with an initial order of the rack, or with a later upgrade of therack features.
Table 3-39 lists the available PDU-to-wall power cord options for the PDU features, whichmust be ordered separately.
Table 3-39 PDU-to-wall power cord options for the PDU features
Featurecode

Wall plug

Rated voltage(V AC)

Phase

Rated amperage

Geography

6489

IEC 309, 3P+N+G,
32 A

230

3

32 amps/phase

EMEA

6491

IEC 309, P+N+G,
63 A

230

1

63 amps6492

IEC 309, 2P+G,
60 A

200 - 208, 240

1

48 amps

US, Canada, LA,
and Japan

6653

IEC 309, 3P+N+G,
16 A

230

3

16 amps/phase

Internationallyavailable

6654

NEMA L6-30

200 - 208, 240

1

24 amps

6655

RS 3750DP(watertight)

200 - 208, 240

1

24 amps

US, Canada, LA,
and Japan

6656

IEC 309,P+N+G,
32 A

230

1

24 amps

EMEA

6657

PDL

230-2401

32 ampsAustralia, New
Zealand6658

Korean plug220

1

30 amps

North and South
Korea

6667

PDL

380-4153

32 ampsAustralia, New
ZealandNotes: Ensure that a suitable power cord feature is configured to support the power that isbeing supplied. Based on the power cord that is used, the PDU can supply 4.8 - 19.2 kVA.
The power of all the drawers that are plugged into the PDU must not exceed the power
cord limitation.
For maximum availability, a preferred approach is to connect power cords from the same
system to two separate PDUs in the rack, and to connect each PDU to independent powersources.
Chapter 3. Available features and options

153

For more information about power requirements of and the power cord for the 7965-S42 rack,
see this IBM Documentation web page.

PDU installation
The IBM Enterprise Slim Rack includes four side mount pockets to allow for the verticalinstallation of PDUs. This configuration frees up more of the horizontal space in the rack forthe installation of systems and other equipment. Up to four PDU devices can be installedvertically in each rack, so any other PDU devices must be installed horizontally. When PDUs
are mounted horizontally in a rack, they each use 1 EIA (1U) of rack space.
Note: When a new IBM Power server is factory installed in an IBM rack that also includes a
PCIe expansion drawer, all of the PDUs for that rack are installed horizontally by default.
This configuration allows for extra space in the sides of the rack to enhance cablemanagement.

3.10.3 Rack-mounting rules
Consider the following primary rules when you mount the system into a rack:򐂰 The system can be placed at any location in the rack. For rack stability, start filling the rackfrom the bottom.
򐂰 IBM recommends the use of an IBM approved lift tool for installation of systems into any
IBM or non-IBM rack.
򐂰 IBM does not support installation of the server nodes higher than the 29U position.
򐂰 Any remaining space in the rack can be used to install other systems or peripheraldevices. Ensure that the maximum permissible weight of the rack is not exceeded and theinstallation rules for these devices are followed.
򐂰 Before placing the system into the service position, follow the rack manufacturer’s safety
instructions regarding rack stability.

3.10.4 Useful rack additions
This section highlights several rack addition solutions for IBM Power rack-based systems.

IBM System Storage 7226 Model 1U3 Multi-Media Enclosure
The IBM System Storage 7226 Model 1U3 Multi-Media Enclosure can accommodate up to
two tape drives, two RDX removable disk drive docking stations, or up to four DVD-RAM
drives.
The IBM System Storage 7226 Multi-Media Enclosure supports LTO Ultrium and DAT160
Tape technology, DVD-RAM, and RDX removable storage requirements on the following IBM
systems:򐂰򐂰򐂰򐂰򐂰IBM POWER6 processor-based systems
IBM POWER7 processor-based systems
IBM POWER8 processor-based systems
IBM POWER9 processor-based systems
IBM POWER10 processor-based systems

The IBM System Storage 7226 Multi-Media Enclosure offers the drive feature options that arelisted in Table 3-40 on page 155.

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Table 3-40 Supported drive features for the 7226-1U3
Feature code

Description

1420

DVD-RAM SATA/SAS optical drive

1422

Extra DVD-RAM SATA/SAS optical drive for #1420

5762

DVD-RAM USB optical drive

5757

Extra DVD-RAM USB optical drive for #5762

8441

LTO Ultrium 7 half height SAS tape drive

8446

LTO Ultrium 7 half height Fibre Channel tape drive8541

LTO Ultrium 8 half height SAS tape drive

8546

LTO Ultrium 8 half height Fibre Channel tape drive

8641

LTO Ultrium 9 half height SAS tape drive

8646

LTO Ultrium 9 half height Fibre Channel tape drive

EU03

RDX 3.0 Removable Disk Docking Station

The following options are available:
򐂰 The LTO Ultrium 7 drive offers a data rate of up to 300 MBps with compression. It also
provides read/write compatibility with Ultrium 7 and Ultrium 6 media formats, andread-only compatibility with Ultrium 5 media formats. By using data compression, an
LTO-7 cartridge can store up to 15 TB of data.
򐂰 The LTO Ultrium 8 drive offers a data rate of up to 750 MBps with compression. It also
provides read/write compatibility with Ultrium 8 and Ultrium 7 media formats. It is not reador write compatible with other Ultrium media formats. By using data compression, an
LTO-8 cartridge can store up to 30 TB of data.
򐂰 The LTO Ultrium 9 drive offers a data rate of up to 1000 MBps with compression. It also
provides read/write compatibility with Ultrium 9 and Ultrium 8 media formats. It is not reador write compatible with other Ultrium media formats. By using data compression, an
LTO-9 cartridge can store up to 45 TB of data.
򐂰 DVD-RAM: The 9.4 GB SAS Slim Optical Drive with a SATA/SAS or USB interface option
is compatible with most standard DVD disks.
򐂰 RDX removable disk drives: The RDX USB docking station is compatible with most RDX
removable disk drive cartridges when it is used in the same operating system. The 7226
offers the following RDX removable drive capacity options:– 500 GB (#1107)– 1.0 TB (#EU01)– 2.0 TB (#EU2T)
Removable RDX drives are in a rugged cartridge that inserts in to an RDX removable (USB)disk docking station (#EU03). RDX drives are compatible with docking stations, which areinstalled internally in Power8, Power9, and Power10 processor-based servers (whereapplicable) or the IBM System Storage 7226 Multi-Media Enclosure (7226-1U3).

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155

Figure 3-17 shows the IBM System Storage 7226 Multi-Media Enclosure with a single RDX
docking station and two DVD-RAM devices installed.

Figure 3-17 IBM System Storage 7226 Multi-Media Enclosure

The IBM System Storage 7226 Multi-Media Enclosure offers a customer-replaceable unit
(CRU) maintenance service to help make the installation or replacement of new drives
efficient. Other 7226 components also are designed for CRU maintenance.
The IBM System Storage 7226 Multi-Media Enclosure is compatible with most Power8,
Power9, and Power10 processor-based systems that offer current level AIX, IBM i, and Linux
operating systems.
Unsupported: IBM i does not support 7226 USB devices.

For a complete list of host software versions and release levels that support the IBM System
Storage 7226 Multi-Media Enclosure, see System Storage Interoperation Center (SSIC).

Flat panel display options
The IBM 7316 Model TF5 is a rack-mountable flat panel console kit that also can be
configured with the tray pulled forward and the monitor folded up, which provides full viewing
and keying capability for the HMC operator.
The Model TF5 is a follow-on product to the Model TF4 and offers the following features:
򐂰 A slim, sleek, and lightweight monitor design that occupies only 1U (1.75 in.) in a 19-inch
standard rack
򐂰 A 18.5-inch (409.8 mm x 230.4 mm) flat panel TFT monitor with truly accurate images andvirtually no distortion򐂰 The ability to mount the IBM Travel Keyboard in the 7316-TF5 rack keyboard tray

3.10.5 Original equipment manufacturer racks
The system can be installed in a suitable OEM rack if that the rack conforms to the EIA-310-D
standard for 19-inch racks. This standard is published by the Electrical Industries Alliance. For
more information, see this IBM Documentation web page.
The IBM Documentation provides the general rack specifications, including the following
information:򐂰 The rack or cabinet must meet the EIA Standard EIA-310-D for 19-inch racks that was
published 24 August 1992. The EIA-310-D standard specifies internal dimensions; forexample, the width of the rack opening (width of the chassis), the width of the module
mounting flanges, and the mounting hole spacing.

156

IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction򐂰 The front rack opening must be a minimum of 450 mm (17.72 in.) wide, and therail-mounting holes must be 465 mm +/- 1.6 mm (18.3 in. +/- 0.06 in.) apart on center(horizontal width between vertical columns of holes on the two front-mounting flanges andon the two rear-mounting flanges).
Figure 3-18 is a top view showing the rack specification dimensions.

Figure 3-18 Rack specifications (top-down view)򐂰 The vertical distance between mounting holes must consist of sets of three holes that are
spaced (from bottom to top) 15.9 mm (0.625 in.), 15.9 mm (0.625 in.), and 12.7 mm(0.5 in.) on center, which makes each three-hole set of vertical hole spacing 44.45 mm(1.75 in.) apart on center.
Figure 3-19 shows the vertical distances between the mounting holes.

Figure 3-19 Vertical distances between mounting holes
Chapter 3. Available features and options157

򐂰 The following rack hole sizes are supported for racks where IBM hardware is mounted:– 7.1 mm (0.28 in.) plus or minus 0.1 mm (round)– 9.5 mm (0.37 in.) plus or minus 0.1 mm (square)
The rack or cabinet must support an average load of 20 kg (44 lb.) of product weight per EIA
unit. For example, a four EIA drawer has a maximum drawer weight of 80 kg (176 lb.).

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4

Chapter 4.

Enterprise solutions
In this chapter, we describe the major pillars that can help enterprises achieve their businessgoals and the reasons why Power10 processor-based scale-out servers provide a significant
contribution to that end.
This chapter includes the following topics:򐂰 4.1, “PowerVM virtualization” on page 160
򐂰 4.2, “IBM PowerVC overview” on page 170
򐂰 4.3, “Digital transformation and IT modernization” on page 172
򐂰 4.4, “Protect trust from core to cloud” on page 177
򐂰 4.5, “Running AI where operational data is created, processed, and stored” on page 183© Copyright IBM Corp. 2022.

159

4.1 PowerVM virtualization
The PowerVM platform is the family of technologies, capabilities, and offerings that delivers
industry-leading virtualization for enterprises. It is the umbrella branding term for the Power
processor-based server virtualization products, including the following examples:
򐂰
򐂰
򐂰
򐂰
򐂰

IBM Power Hypervisor
Logical partitioning
IBM Micro-Partitioning®
VIOS
Live Partition Mobility (LPM)

PowerVM is a combination of hardware enablement and software.
Note: PowerVM Enterprise Edition license entitlement is included with each Power10
processor-based, scale-out server. PowerVM Enterprise Edition is available as a hardware
feature (#5228) and supports up to 20 partitions per core, VIOS, and multiple sharedprocessor pools (SPPs), and offers LPM.

4.1.1 IBM Power Hypervisor
Power processor-based servers are combined with PowerVM technology and offer thefollowing key capabilities that can help to consolidate and simplify IT environments:
򐂰 Improve server usage and share I/O resources to reduce the total cost of ownership(TCO) and better use IT assets.
򐂰 Improve business responsiveness and operational speed by dynamically reallocating
resources to applications as needed to better match changing business needs or handle
unexpected changes in demand.
򐂰 Simplify IT infrastructure management by making workloads independent of hardware
resources so that business-driven policies can be used to deliver resources that are basedon time, cost, and service-level requirements.
Combined with features in the Power10 processor-based scale-out servers, the IBM Power
Hypervisor delivers functions that enable other system technologies, including the following
examples:
򐂰
򐂰
򐂰
򐂰
򐂰
򐂰

Logical partitioning (LPAR)
Virtualized processors
IEEE virtual local area network (VLAN)-compatible virtual switches
Virtual SCSI adapters
Virtual Fibre Channel adapters
Virtual consoles

The Power Hypervisor is a basic component of the system’s firmware and offers the following
functions:򐂰 Provides an abstraction between the physical hardware resources and the LPARs that usethem.
򐂰 Enforces partition integrity by providing a security layer between LPARs.
򐂰 Controls the dispatch of virtual processors to physical processors.
򐂰 Saves and restores all processor state information during a logical processor context
switch.
򐂰 Controls hardware I/O interrupt management facilities for LPARs.
򐂰 Provides VLAN channels between LPARs that help reduce the need for physical Ethernet
adapters for inter-partition communication.
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򐂰 Monitors the enterprise baseboard management controller (eBMC) or the flexible service
processor (FSP) of the system and performs a reset or reload if it detects the loss of oneof the eBMC or FSP controllers, and notifies the operating system if the problem is notcorrected.
The Power Hypervisor is always active, regardless of the system configuration or whether it isconnected to the managed console. It requires memory to support the resource assignmentof the LPARs on the server.
The amount of memory that is required by the Power Hypervisor firmware varies according to
the following memory usage factors:
򐂰 For hardware page tables (HPTs)
򐂰 To support I/O devices
򐂰 For virtualization

Memory usage for hardware page tables
Each partition on the system includes its own HPT that contributes to hypervisor memory
usage. The HPT is used by the operating system to translate from effective addresses tophysical real addresses in the hardware. This translation allows multiple operating systems to
run simultaneously in their own logical address space.
Whenever a virtual processor for a partition is dispatched on a physical processor, thehypervisor indicates to the hardware the location of the partition HPT that can be used whentranslating addresses.
The amount of memory for the HPT is based on the maximum memory size of the partition
and the HPT ratio. The default HPT ratio is 1/128th (for AIX, Virtual I/O Server [VIOS], andLinux partitions) of the maximum memory size of the partition. AIX, VIOS, and Linux use
larger page sizes (16 and 64 KB) instead of the use of 4 KB pages.
The use of larger page sizes reduces the overall number of pages that must be tracked;
therefore, the overall size of the HPT can be reduced. For example, the HPT is 2 GB for an
AIX partition with a maximum memory size of 256 GB.
When defining a partition, the maximum memory size that is specified is based on the amountof memory that can be dynamically added to the dynamic partition (DLPAR) without changing
the configuration and restarting the partition.
In addition to setting the maximum memory size, the HPT ratio can be configured. The
hpt_ratio parameter for the chsyscfg Hardware Management Console (HMC) command canbe issued to define the HPT ratio that is used for a partition profile. The following values arevalid:
򐂰
򐂰
򐂰
򐂰
򐂰

1:32
1:64
1:128
1:256
1:512

Specifying a smaller absolute ratio (1/512 is the smallest value) decreases the overallmemory that is assigned to the HPT. Testing is required when changing the HPT ratio
because a smaller HPT might incur more CPU consumption because the operating system
might need to reload the entries in the HPT more frequently. Most customers choose to use
the IBM provided default values for the HPT ratios.

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Memory usage for I/O devices
In support of I/O operations, the hypervisor maintains structures that are called thetranslation control entities (TCEs), which provide an information path between I/O devices
and partitions.
The TCEs also provide the address of the I/O buffer, which is an indication of read versus
write requests, and other I/O-related attributes. Many TCEs are used per I/O device, so
multiple requests can be active simultaneously to the same physical device. To provide better
affinity, the TCEs are spread across multiple processor chips or drawers to improve
performance while accessing the TCEs.
For physical I/O devices, the base amount of space for the TCEs is defined by the hypervisor
that is based on the number of I/O devices that are supported. A system that supports
high-speed adapters also can be configured to allocate more memory to improve I/O
performance. Linux is the only operating system that uses these extra TCEs so that the
memory can be freed for use by partitions if the system uses only AIX or IBM i operating
systems.

Memory usage for virtualization features
Virtualization requires more memory to be allocated by the Power Hypervisor for hardware
statesave areas and various virtualization technologies. For example, on Power10
processor-based systems, each processor core supports up to eight simultaneous
multithreading (SMT) threads of execution, and each thread contains over 80 different
registers.
The Power Hypervisor must set aside save areas for the register contents for the maximum
number of virtual processors that are configured. The greater the number of physicalhardware devices, the greater the number of virtual devices, the greater the amount of
virtualization, and the more hypervisor memory is required.
For efficient memory consumption, wanted and maximum values for various attributes(processors, memory, and virtual adapters) must be based on business needs, and not set tovalues that are significantly higher than requirements.

Predicting memory that is used by the Power Hypervisor
The IBM System Planning Tool (SPT) can be used to estimate the amount of hypervisor
memory that is required for a specific server configuration. After the SPT executable file isdownloaded and installed, you can define a configuration by selecting the correct hardware
platform and the installed processors and memory, and defining partitions and partition
attributes. SPT can estimate the amount of memory that is assigned to the hypervisor, whichassists you when you change a configuration or deploy new servers.
The Power Hypervisor provides the following types of virtual I/O adapters:򐂰 Virtual SCSIThe Power Hypervisor provides a virtual SCSI mechanism for the virtualization of storage
devices. The storage virtualization is accomplished by using two paired adapters: a virtual
SCSI server adapter and a virtual SCSI customer adapter.
򐂰 Virtual Ethernet
The Power Hypervisor provides a virtual Ethernet switch function that allows partitions fastand secure communication on the same server without any need for physicalinterconnection or connectivity outside of the server if a Layer 2 bridge to a physical
Ethernet adapter is set in one VIOS partition, also known as Shared Ethernet Adapter(SEA).

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IBM Power S1014, S1022s, S1022, and S1024 Technical Overview and Introduction򐂰 Virtual Fibre Channel
A virtual Fibre Channel adapter is a virtual adapter that provides customer LPARs with a
Fibre Channel connection to a storage area network through the VIOS partition. The VIOS
partition provides the connection between the virtual Fibre Channel adapters on the VIOS
partition and the physical Fibre Channel adapters on the managed system.
򐂰 Virtual (tty) console
Each partition must have access to a system console. Tasks, such as operating systeminstallation, network setup, and various problem analysis activities, require a dedicatedsystem console. The Power Hypervisor provides the virtual console by using a virtual tty
and a set of hypervisor calls to operate on them. Virtual tty does not require the purchaseof any other features or software, such as the PowerVM Edition features.

Logical partitions
LPARs and the use of virtualization increase the usage of system resources while adding alevel of configuration possibilities.

Logical partitioning is the ability to make a server run as though it were two or more
independent servers. When you logically partition a server, you divide the resources on theserver into subsets, called LPARs. You can install software on an LPAR, and the LPAR runs
as an independent logical server with the resources that you allocated to the LPAR.
LPARs are also referred to in some documentation as virtual machines (VMs), which makethem appear to be similar to what other hypervisors offer. However, LPARs provide a higher
level of security and isolation and other features.
Processors, memory, and I/O devices can be assigned to LPARs. AIX, IBM i, Linux, and VIOS
can run on LPARs. VIOS provides virtual I/O resources to other LPARs with general-purpose
operating systems.
LPARs share a few system attributes, such as the system serial number, system model, andprocessor FCs. All other system attributes can vary from one LPAR to another.

Micro-Partitioning
When you use the Micro-Partitioning technology, you can allocate fractions of processors to
an LPAR. An LPAR that uses fractions of processors is also known as a shared processor
partition or micropartition. Micropartitions run over a set of processors that is called a sharedprocessor pool (SPP), and virtual processors are used to enable the operating system tomanage the fractions of processing power that are assigned to the LPAR.
From an operating system perspective, a virtual processor cannot be distinguished from aphysical processor, unless the operating system is enhanced to determine the difference.
Physical processors are abstracted into virtual processors that are available to partitions.
On the Power10 processor-based server, a partition can be defined with a processor capacity
as small as 0.05 processing units. This number represents 0.05 of a physical core. Eachphysical core can be shared by up to 20 shared processor partitions, and the partition’s
entitlement can be incremented fractionally by as little as 0.05 of the processor.
The shared processor partitions are dispatched and time-sliced on the physical processors
under the control of the Power Hypervisor. The shared processor partitions are created andmanaged by the HMC.

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Note: Although the Power10 processor-based scale-out server supports up to 20 sharedprocessor partitions per core, the real limit depends on application workload demands thatare used on the server.

Processing mode
When you create an LPAR, you can assign entire processors for dedicated use, or you canassign partial processing units from an SPP. This setting defines the processing mode of the
LPAR.

Dedicated mode
In dedicated mode, physical processors are assigned as a whole to partitions. The SMT
feature in the Power10 processor core allows the core to run instructions from one, two, four,or eight independent software threads simultaneously.

Shared dedicated mode
On Power10 processor-based servers, you can configure dedicated partitions to become
processor donors for idle processors that they own, which allows for the donation of spare
CPU cycles from dedicated processor partitions to an SPP.
The dedicated partition maintains absolute priority for dedicated CPU cycles. Enabling thisfeature can help increase system usage without compromising the computing power for
critical workloads in a dedicated processor mode LPAR.

Shared mode
In shared mode, LPARs use virtual processors to access fractions of physical processors.
Shared partitions can define any number of virtual processors (the maximum number is 20
times the number of processing units that are assigned to the partition).
The Power Hypervisor dispatches virtual processors to physical processors according to thepartition’s processing units entitlement. One processing unit represents one physicalprocessor’s processing capacity. All partitions receive a total CPU time equal to theirprocessing unit’s entitlement.
The logical processors are defined on top of virtual processors. Therefore, even with a virtual
processor, the concept of a logical processor exists, and the number of logical processors
depends on whether SMT is turned on or off.

4.1.2 Multiple shared processor pools
Multiple SPPs are supported on Power10 processor-based servers. This capability allows asystem administrator to create a set of micropartitions with the purpose of controlling theprocessor capacity that can be used from the physical SPP.
Micropartitions are created and then identified as members of the default processor pool or auser-defined SPP. The virtual processors that exist within the set of micropartitions aremonitored by the Power Hypervisor. Processor capacity is managed according touser-defined attributes.
If the Power server is under heavy load, each micropartition within an SPP is assured of its
processor entitlement, plus any capacity that might be allocated from the reserved poolcapacity if the micropartition is uncapped.

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If specific micropartitions in an SPP do not use their processing capacity entitlement, theunused capacity is ceded, and other uncapped micropartitions within the same SPP can use
the extra capacity according to their uncapped weighting. In this way, the entitled poolcapacity of an SPP is distributed to the set of micropartitions within that SPP.
All Power servers that support the multiple SPP capability have a minimum of one (thedefault) SPP and up to a maximum of 64 SPPs. This capability helps customers reduce the
TCO significantly when the costs of software or database licenses depend on the number ofassigned processor-cores.

4.1.3 Virtual I/O Server
The VIOS is part of PowerVM. It is the specific appliance that allows the sharing of physicalresources among LPARs to allow more efficient usage (for example, consolidation). In thiscase, the VIOS owns the physical I/O resources (SCSI, Fibre Channel, network adapters, or
optical devices) and allows client partitions to share access to them, which minimizes andoptimizes the number of physical adapters in the system.
The VIOS eliminates the requirement that every partition owns a dedicated network adapter,disk adapter, and disk drive. The VIOS supports OpenSSH for secure remote logins. It also
provides a firewall for limiting access by ports, network services, and IP addresses.
Figure 4-1 shows an overview of a VIOS configuration.

Figure 4-1 Architectural view of the VIOS

It is a preferred practice to run dual VIO servers per physical server to allow for redundancy of
all I/O paths for client LPARs.

Shared Ethernet Adapter
A SEA can be used to connect a physical Ethernet network to a virtual Ethernet network. The
SEA provides this access by connecting the Power Hypervisor VLANs to the VLANs that areon the external switches.
Because the SEA processes packets at Layer 2, the original MAC address and VLAN tags ofthe packet are visible to other systems on the physical network. IEEE 802.1 VLAN tagging is
supported.

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165

By using the SEA, several customer partitions can share one physical adapter. You also canconnect internal and external VLANs by using a physical adapter. The SEA service can behosted only in the VIOS (not in a general-purpose AIX or Linux partition) and acts as aLayer 2 network bridge to securely transport network traffic between virtual Ethernet
networks (internal) and one or more (Etherchannel) physical network adapters (external).
These virtual Ethernet network adapters are defined by the Power Hypervisor on the VIOS.

Virtual SCSI
Virtual SCSI is used to view a virtualized implementation of the SCSI protocol. Virtual SCSI isbased on a customer/server relationship. The VIOS LPAR owns the physical I/O resources
and acts as a server or in SCSI terms, a target device. The client LPARs access the virtual
SCSI backing storage devices that are provided by the VIOS as clients.
The virtual I/O adapters (a virtual SCSI server adapter and a virtual SCSI client adapter) are
configured by using an HMC. The virtual SCSI server (target) adapter is responsible forrunning any SCSI commands that it receives, and is owned by the VIOS partition. The virtual
SCSI client adapter allows a client partition to access physical SCSI and SAN-attacheddevices and LUNs that are mapped to be used by the client partitions. The provisioning ofvirtual disk resources is provided by the VIOS.

N_Port ID Virtualization
N_Port ID Virtualization (NPIV) is a technology that allows multiple LPARs to access one ormore external physical storage devices through the same physical Fibre Channel adapter.
This adapter is attached to a VIOS partition that acts only as a pass-through that manages
the data transfer through the Power Hypervisor.
Each partition features one or more virtual Fibre Channel adapters, each with their own pairof unique worldwide port names. This configuration enables you to connect each partition to
independent physical storage on a SAN. Unlike virtual SCSI, only the client partitions see thedisk.
For more information and requirements for NPIV, see IBM PowerVM Virtualization Managingand Monitoring, SG24-7590.

4.1.4 Live Partition Mobility
LPM allows you to move a running LPAR from one system to another without disruption.
Inactive partition mobility allows you to move a powered-off LPAR from one system to anotherone.
LPM provides systems management flexibility and improves system availability by avoiding
the following situations:򐂰 Planned outages for hardware upgrade or firmware maintenance.
򐂰 Unplanned downtime. With preventive failure management, if a server indicates a potential
failure, you can move its LPARs to another server before the failure occurs.
For more information and requirements for LPM, see IBM PowerVM Live Partition Mobility,
SG24-7460.
HMCV10.1.1020.0 and VIOS 3.1.3.21 or later provide the following enhancements to the
LPM feature:򐂰 Automatically choose fastest network for LPM memory transfer
򐂰 Allow LPM when a virtual optical device is assigned to a partition

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4.1.5 Active Memory Mirroring
Active Memory Mirroring (AMM) for Hypervisor is available as an option (#EM8G) to enhance
resilience by mirroring critical memory that is used by the PowerVM hypervisor so that it cancontinue operating if a memory failure occurs.
A portion of available memory can be proactively partitioned such that a duplicate set can beused upon noncorrectable memory errors. This feature can be implemented at the granularityof DDIMMs or logical memory blocks.

4.1.6 Remote Restart
Remote Restart is a high availability option for partitions. If an error occurs that causes a
server outage, a partition that is configured for Remote Restart can be restarted on a different
physical server. At times, it might take longer to start the server, in which case the Remote
Restart function can be used for faster reprovisioning of the partition. Typically, this process
can be done faster than restarting the server that stopped and then restarting the partitions.
The Remote Restart function relies on technology that is similar to LPM where a partition is
configured with storage on a SAN that is shared (accessible) by the server that hosts thepartition.
HMC V10R1 provides an enhancement to the Remote Restart Feature that enables remoterestart when a virtual optical device is assigned to a partition.

4.1.7 POWER processor modes
Although they are not virtualization features, the POWER processor modes are describedhere because they affect various virtualization features.
On Power servers, partitions can be configured to run in several modes, including thefollowing modes:
򐂰 POWER8This native mode for Power8 processors implements Version 2.07 of the IBM Power ISA.
For more information, see this IBM Documentation web page.
򐂰 POWER9This native mode for Power9 processors implements Version 3.0 of the IBM Power ISA.
For more information, see this IBM Documentation web page.
򐂰 Power10
This native mode for Power10 processors implements Version 3.1 of the IBM Power ISA.
For more information, see this IBM Documentation web page.

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Figure 4-2 shows the available processor modes on a Power10 processor-based scale-out
server.

Figure 4-2 Processor modes

Processor compatibility mode is important when LPM migration is planned between different
generations of server. An LPAR that might be migrated to a machine that is managed by aprocessor from another generation must be activated in a specific compatibility mode.
Note: Migrating an LPAR from a POWER7 processor-based server to a Power10
processor-based scale-out server by using LPM is not supported; however, the following
steps can be completed to accomplish this task:
1. Migrate LPAR from POWER7 processor-based server to Power8 or Power9
processor-based server by using LPM.
2. Migrate then the LPAR from the Power8 or Power9 processor-based server to a
Power10 processor-based scale-out server.
The operating system that is running on the POWER7 processor-based server must be
supported on Power10 processor-based scale-out server, or must be upgraded to asupported level before starting the above steps.

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4.1.8 Single Root I/O virtualization
Single Root I/O Virtualization (SR-IOV) is an extension to the Peripheral Component
Interconnect Express (PCIe) specification that allows multiple operating systems tosimultaneously share a PCIe adapter with little or no runtime involvement from a hypervisor orother virtualization intermediary.
SR-IOV is a PCI standard architecture that enables PCIe adapters to become self-virtualizing.
It enables adapter consolidation through sharing, much like logical partitioning enables server
consolidation. With an adapter capable of SR-IOV, you can assign virtual slices of a single
physical adapter to multiple partitions through logical ports, which does not require a VIOS.
Table 4-1 shows the list of SR-IOV adapters supported in both the servers and the I/O
expansion drawer.
Table 4-1 Supported SR-IOV adapters
Server & Attached EMX0
I/O Expansion Drawer
Adapters
SR-IOV Capable Network I/O Adapters

S1022,
S1022s,(EMX0)

S1014,
S1024,(EMX0)

PCIe3 2-Port 10GbE NIC & RoCE SR/Cu Adaptera

EC2R(EC2S)

EC2S(EC2S)

PCIe3 2-Port 25/10GbE NIC & RoCE SR/Cu Adapter

EC2T(EC2U)EC2U(EC2U)

PCIe4 2-port 100/40GbE NIC & RoCE QSFP28 Adapter x16

EC67

EC66

PCIe4 x16 2-port 100/40GbE NIC & RoCE QSFP28 Adapterb

EC75

EC76

a. Withdrawn
b. SR-IOV support available on Power10 Servers with FW1030

Using SR-IOV provides a high performance connection with performance very close to what
is provided by a dedicated network adapter while allowing the sharing of an adapter acrossmultiple partitions. However, since the SR-IOV virtual port is dedicated to a partition, the useof SR-IOV prevents a partition from being eligible for logical partition migration (LPM).
There are two different solutions available within PowerVM to allow the use of SR-IOV
functionality within a partition and still maintain the ability to use advanced virtualization
techniques such as LPM. Both solutions require the use of VIOS.

Virtual network interface controller
Virtual Network Interface Controller (vNIC) is a new PowerVM virtual networking technologythat delivers enterprise capabilities and simplifies network management. It is a highperformance, efficient technology that when combined with SR-IOV NIC provides bandwidth
control Quality of Service (QoS) capabilities at the virtual NIC level. Use of vNIC significantly
reduces virtualization overhead resulting in lower latencies and less server resources (CPU,memory) required for network virtualization.
Using vNIC technology, the virtual slice of the physical adapter or Virtual Function (VF) is
assigned to the VIOS directly and within the VIOS is connected with a vNIC for the clientpartition. Since the SR-IOV VF is assigned to the VIOS directly, the LPAR is LPM capable.
There is a one-to-one mapping or connection between vNIC adapter in the client LPAR and

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the backing logical port in the VIOS and using logically redirected DMA packet data is moved
from the client LPAR memory to the SR-IOV adapter directly without being copied to the VIOS
memory. This results in lower overhead and latency due to the direct memory copy and areduction in the CPU and VIOS memory consumption.
In addition to the optimized data path, the vNIC device supports multiple transmit and receive
queues, like many high performance NIC adapters. These design points enable vNIC toachieve performance that is comparable to direct attached logical port, even for workloads
dominated with packets of small sizes.

Hybrid network virtualization
While vNIC minimizes networking overhead from virtualizing an SR-IOV network adapter,there are some workloads that benefit from the even better performance of the SR-IOV VF
directly attached to the partition. Those clients should consider the use of hybrid network
virtualization (HNV) to allow them to get the best performance out of their network connection
and still support LPM.
HNV uses a concept called a migratable SR-IOV logical port. The migratable port is definedby creating an active/backup configuration between a native SR-IOV VF connection and avNIC connection. This creates an active-backup configuration within a partition where theprimary device is an SR-IOV logical port and the backup device is a virtual device such as a
Virtual Ethernet adapter or virtual Network Interface Controller (vNIC). As the primary device,
the SR-IOV logical port provides high performance, low overhead network connectivity.
During an LPM operation, or when the primary device cannot provide network connectivity,
network traffic will flow through the backup virtual device.
When a partition is configured with a Migratable SR-IOV logical port and an LPM operation isstarted, the Hardware Management Console (HMC) will dynamically remove the SR-IOV
logical port as part of the migration operation. This forces network traffic to flow through thevirtual backup device and once the SR-IOV logical ports are removed, the HMC is able tomigrate the partition. Prior to migration, the HMC will provision SR-IOV logical ports on thedestination system to replace the previously remove logical ports and once the partition is on
the destination system the HMC will dynamically add the provisioned logical ports to thepartition where they will be integrated into the active-backup configuration (e.g. NIB or VIPA).
For more information about the virtualization features, see the following publications:򐂰򐂰򐂰򐂰IBM PowerVM Best Practices, SG24-8062
IBM PowerVM Virtualization Introduction and Configuration, SG24-7940
IBM PowerVM Virtualization Managing and Monitoring, SG24-7590
IBM Power Systems SR-IOV: Technical Overview and Introduction, REDP-5065

4.2 IBM PowerVC overview
IBM Power Virtualization Center (PowerVC) is an advanced virtualization and cloud
management offering that provides simplified virtualization management and cloud
deployments for IBM AIX, IBM i, and Linux VMs, including Red Hat OpenShift (CoreOS) thatis running on IBM Power. It is built on the Open Source OpenStack project to ensure
consistent APIs and interfaces with other cloud management tools. PowerVC is designed to
improve administrator productivity and to simplify the cloud management of VMs on Power
servers.

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By using PowerVC, the following tasks can be performed:
򐂰
򐂰
򐂰
򐂰
򐂰
򐂰
򐂰
򐂰
򐂰
򐂰
򐂰
򐂰
򐂰
򐂰

Create VMs and resize the VMs CPU and memory.
Attach disk volumes or other networks to those VMs.
Import VMs and volumes so that they can be managed by IBM PowerVC.
Deploy new VMs with storage and network from an image in a few minutes.
Monitor the use of resources in your environment.
Take snapshots of a VM or clone a VM.
Migrate VMs while they are running (live migration between physical servers).
Automated Remote restart VMs if a server failure occurs.
Automatically balance cloud workloads by using the Dynamic Resource Optimizer (DRO).
Use advanced storage technologies, such as VDisk mirroring, IBM HyperSwap, and IBM
Global mirror.
Put a server into maintenance mode with automatic distribution of LPARs to other serverand back using LPM.
Create a private cloud with different projects or tenants that are independent from eachother but use the same resources.
Create a self-service portal with an approval workflow.
Meter resource usage as basis for cost allocation.

The use of PowerVC management tools in a Power environment includes the following
benefits:
򐂰
򐂰
򐂰
򐂰
򐂰

Improve resource usage to reduce capital expense and power consumption.
Increase agility and execution to respond quickly to changing business requirements.
Increase IT productivity and responsiveness.
Simplify Power virtualization management.
Accelerate repeatable, error-free virtualization deployments.

IBM PowerVC can manage AIX, IBM i, and Linux-based VMs that are running underPowerVM virtualization and are connected to an HMC or by using NovaLink. As of this writing,the release supports the scale-out and the enterprise Power servers that are built on IBM
Power8, IBM Power9, and Power10.
Note: The Power S1014, S1022s, S1022, and S1024 servers are supported by PowerVC
2.0.3 or later. More fix packs might be required. For more information, see this IBM
Support Fix Central web page.

4.2.1 IBM PowerVC functions and advantages
When more than 70% of IT budgets are spent on operations and maintenance, IT customers
expect vendors to focus their new development efforts to reduce IT costs and foster
innovation within IT departments.
IBM PowerVC gives IBM Power customers the following advantages:
򐂰 It is deeply integrated with IBM Power hardware and software.
򐂰 It provides virtualization management tools.
򐂰 It eases the integration of servers that are managed by PowerVM in automated IT
environments, such as clouds.
򐂰 It is a building block of IBM Infrastructure as a Service (IaaS), based on Power.
򐂰 PowerVC integrates with other cloud management tools, such as Ansible, Terraform, or
Red Hat OpenShift, and can be integrated into orchestration tools, such as VMware
vRealize, or the SAP Landscape Management (LaMa).
򐂰 PowerVC also provides an easy exchange of VM images between private andpublic clouds by using the integration of Cloud Object Storage into PowerVC.
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IBM PowerVC is an addition to the PowerVM set of enterprise virtualization technologies thatprovide virtualization management. It is based on open standards and integrates server
management with storage and network management.
Because IBM PowerVC is based on the OpenStack initiative, Power can be managed by toolsthat are compatible with OpenStack standards. When a system is controlled by IBM
PowerVC, it can be managed in one of three ways:
򐂰 By a system administrator that uses the IBM PowerVC graphical user interface (GUI)򐂰 By a system administrator that uses scripts that contain the IBM PowerVC
Representational State Transfer (REST) APIs
򐂰 By higher-level tools that call IBM PowerVC by using standard OpenStack API
The following PowerVC offerings are available:
򐂰 IBM PowerVC򐂰 IBM PowerVC for Private Cloud
The PowerVC for Private Cloud edition adds a self-service portal with which users can deploy
and manage their own LPARs and workloads, and offers further cloud management functions.
These functions include more project level metering, approval flows, and notification
capabilities.
PowerVC provides a systems management product that enterprise customers require toeffectively manage the advanced features that are offered by IBM premium hardware. It
reduces resource use and manages workloads for performance and availability.
For more information about PowerVC, see IBM PowerVC Version 2.0 Introduction andConfiguration, SG24-8477.

4.3 Digital transformation and IT modernization
Digital transformation is the process of the use of digital technologies to create businessprocesses, or modify processes. It also means changing the culture and experiences to meetthe changing needs of the business and the market. This reimagining of business in the digitalage is at the heart of digital transformation.
In the IBM vision, digital transformation takes a customer-centric and digital-centric approach
to all aspects of business: from business models to customer experiences, processes andoperations. It uses artificial intelligence, automation, hybrid cloud, and other digitaltechnologies to use data and drive intelligent workflows, enable faster and smarter decision
making, and a real-time response to market disruptions. Ultimately, it changes customer
expectations and creates business opportunities.
To date, one of the main technologies that is recognized as an enabler to digitaltransformation and as the path to application modernization, is the Red Hat OpenShiftContainer Platform. Associating OpenShift Container Platform with the IBM Power
processor-based platform realizes several advantages, which are described next.

4.3.1 Application and services modernization
Modernizing established and cloud native applications and services by using containers thatare deployed by way of a platform that is designed with Kubernetes orchestration at its core isarguably the most forward-looking strategy from which any business benefits. Unsurprisingly,

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it is also at the heart of the IBM and Red Hat strategy for the hybrid multicloud reality of thedigital landscape of tomorrow.
Red Hat OpenShift Container Platfom is a container orchestration platform that is based on
Kubernetes that helps develop containerized applications with open source technology that isready for the Enterprise. Red Hat OpenShift Container Platfom facilitates management anddeployments in hybrid and multicloud environments by using full-stack automated operations.
Containers are key elements of the IT transformation journey toward modernization.
Containers are software executable units in which the application code is packaged (alongwith its libraries and dependencies) in common and consistent ways so that it can be run
anywhere on desktop computers and any type of server or on the cloud.
To do this, containers take advantage of a form of operating system virtualization, in which
operating system functions are used effectively to isolate processes and control the amountof CPU, memory, and disk to which those processes can access.
Containers are small, fast, and portable because, unlike a VM, they do not need to include a
guest operating system in every instance. Instead, they can instead use the functions andresources of the host operating system.
Containers first appeared decades ago with releases, such as FreeBSD jails and AIX
Workload Partitions (WPARs). However, most modern developers remember 2013 as the
beginning of the modern container era with the introduction of Docker.
One way to better understand a container is to understand how it differs from a traditional VM.
In traditional virtualization (on-premises and in the cloud), a hypervisor is used to virtualize
the physical hardware. Therefore, each VM contains a guest operating system and a virtual
copy of the hardware that the operating system requires to run, with an application and its
associated libraries and dependencies.
Instead of virtualizing the underlying hardware, containers virtualize the operating system(usually Linux) so that each individual container includes only the application and its libraries
and dependencies. The absence of the guest operating system is the reason why containers
are so light and therefore, fast and portable.
In addition to AIX WPARs, IBM i projects came from the 1980s. The IBM i team devised an
approach to create a container for objects (that is, programs, databases, security objects, andso on). This container can be converted into an image that can be transported from adevelopment environment to a test environment, another system, or the cloud. A significant
difference between this version of containers and the containers that we know today is thename: on IBM i they are called libraries and a container image is called a backup file.
The IBM Power platform delivers a high container density per core, with multiple CPU threads
to enable higher throughput. By using PowerVM virtualization, cloud native applications also
can be colocated alongside applications that are related to AIX or IBM i worlds. This ability
makes available API connections to business-critical data for higher bandwidth and lower
latency than other technologies.
Only with IBM Power can you have a flexible and efficient use of resources, manage peaks,
and support traditional and modern workloads with the capabilities of capacity on demand or
shared processor pools. Hardware is not just a commodity; rather, it must be carefully
evaluated.

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4.3.2 System automation with Ansible
Enterprises can spend large amounts of IT administrative time performing repetitive tasks andrunning manual processes. Tasks, such as updating, patching, compliance checks,
provisioning new VMs or LPARs, and ensuring that the correct security updates are in place,
are taking time away from more valuable business activities.
The ability to automate by using Red Hat Ansible returns valuable time to the systemadministrators.
The Red Hat Ansible Automation Platform for Power is fully enabled, so enterprises can
automate several tasks within AIX, IBM i, and Linux all the way up to provisioning VMs anddeploying applications. Ansible also can be combined with HMC, PowerVC, and Power VirtualServer to provision infrastructure anywhere you need, including cloud solutions from other
IBM Business Partners or third-party providers that are based on Power processor-based
servers.
A first task after the initial installation or set-up of a new LPAR is to ensure that the correct
patches are installed. Also, extra software (whether it is open source software, ISV software,or perhaps their own enterprise software) must be installed. Ansible features a set ofcapabilities to roll out new software, which makes it popular in Continuous
Integration/Continuous Delivery (CI/CD) pipeline environments. Orchestration and integrationof automation with security products represent other ways in which Ansible can be applied
within the data center.
Despite the wide adoption of AIX and IBM i in many different business sectors by different
types of customers, Ansible can help introduce the Power processor-based technology tocustomers who believe that AIX and IBM i skills are a rare commodity that is difficult to locate
in the marketplace, but want to take advantage of all the features of the hardware platform.
The Ansible experience is identical across Power or x86 processor-based technology and thesame tools can be used in IBM Cloud and other cloud providers.
AIX and IBM i skilled customers can also benefit from the extreme automation solutions thatare provided by Ansible.
The Power processor-based architecture features unique advantages over commodity server
platforms, such as x86, because the engineering teams that are working on the processor,
system boards, virtualization. and management appliances collaborate closely to ensure an
integrated stack that works seamlessly. This approach is in stark contrast to the multivendor
x86 processor-based technology approach, in which the processor, server, management, andvirtualization must be purchased from different (and sometimes competing) vendors.
The Power stack engineering teams partnered closely to deliver the enterprise server
platform, which results in an IT architecture with industry-leading performance, scalability, andsecurity (see Figure 4-3 on page 175).

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Figure 4-3 Power stack

Every layer in the Power stack is optimized to make the Power10 processor-based technology
the platform of choice for mission-critical enterprise workloads. This stack includes theAnsible Automation Platform, which is described next.

Ansible Automation Platform
The Ansible Automation Platform integrates with IBM Power processor-based technology,
which is included in the Certified Integrations section of the Red Hat Ansible website.
Many Ansible collections are available for IBM Power processor-based technology, which (atthe time of this writing) were downloaded more than 25,000 times by customers, are now
included in the Red Hat Ansible Automation Platform. As a result, these modules are covered
by Red Hat’s 24x7 enterprise support team, which collaborates with the respective Power
processor-based technology development teams.

IBM Power in the Ansible ecosystem
A series of Ansible collections is available for the Power processor-based platform. A
collection is a group of modules, Playbooks, and roles. Embracing Ansible in the Power
community, our AIX and IBM i community feature a comprehensive set of modules available.
Some examples are development of tools to manage AIX logical volumes, which put moduleinterfaces over the installation key command, or managing the AIX init tab entries.
From an IBM i perspective, a pertinent example is the ability to run SQL queries against the
integrated IBM Db2 database that is built into the IBM i platform, manage object authorities,
and so on. All of these modules and playbooks can be combined by an AIX administrator or
IBM i administrator to perform complex tasks rapidly and consistently.

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The IBM operating system development teams, alongside community contributors, develop
modules that are sent to an open source community (named Ansible Galaxy). Everydeveloper can post any object that can be a candidate for a collection in the open Ansible
Galaxy community and possibly certified to be supported by IBM with a subscription to Red
Hat Ansible Automation Platform (see Figure 4-4).

Figure 4-4 Power content in the Ansible ecosystem

Ansible modules for AIX
As part of the broader offering of Ansible Content for IBM Power, the IBM Power - AIX
collection is available from Ansible Galaxy and has community support.
The collection includes modules and sample playbooks that help to automate tasks and isavailable at this web page.

Ansible modules for IBM i
Ansible Content for IBM Power - IBM i provides modules, action plug-ins, roles, and sample
playbooks to automate tasks on IBM i workloads, including the following examples:
򐂰
򐂰
򐂰
򐂰
򐂰

Command execution
System and application configuration
Work management
Fix management
Application deployment

For more information about the collection, see this web page.

Ansible modules for HMC
The IBM Power - HMC collection provides modules that can be used to manage
configurations and deployments of HMC systems and the servers that they manage. The
collection content helps to include workloads on Power processor-based platforms as part ofan enterprise automation strategy through the Ansible ecosystem.
For more information about this collection, see this web page.

Ansible modules for VIOS
The IBM Power - VIOS collection provides modules that can be used to manage
configurations and deployments of Power VIOS systems. The collection content helps toinclude workloads on Power processor-based platforms as part of an enterprise automation
strategy through the Ansible system.
For more information, see this web page.

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Ansible modules for Oracle on AIXThis repository contains a collection that can be used to install and manage Oracle single
instance database 19c on AIX operating system and creates test database on AIX file systemand on Oracle ASM. This collection automates Oracle 19c database installation and creation
steps.
For more information, see this web page.

Ansible modules for Oracle RAC on AIXThis collection provides modules that can be used to install and manage Oracle 19c RAC on
AIX operating system. This collection also automates Oracle 19c RAC installation andcreation steps.
For more information, see this web page.

Ansible modules for SAP on AIX
The Ansible Content for SAP Software on AIX provides roles to automate administrator tasks
for SAP installations on AIX, such as installing the SAP Host Agent, starting and stopping
SAP instances, and upgrading the SAP kernel.
For more information, see this web page.

Ansible modules for SAP on IBM i
The Ansible Content for SAP Software on IBM i provides roles to automate administrator
tasks for SAP installations on IBM i, such as installing the SAP Host Agent, starting andstopping SAP instances, and upgrading the SAP kernel.
For more information, see this web page.

4.4 Protect trust from core to cloud
The IT industry has long relied on perimeter security strategies to protect its most valuableassets, such as user data and intellectual property. The use of firewalls and othernetwork-based tools to inspect and validate users that are entering and leaving the network is
no longer enough as digital transformation and the shift to hybrid cloud infrastructure arechanging the way industries do business.
Many organizations also are adapting their business models, and have thousands of people
that are connecting from home computers that are outside the control of an IT department.
Users, data, and resources are scattered all over the world, which makes it difficult to connect
them quickly and securely. Also, without a traditional local infrastructure for security,
employees’ homes are more vulnerable to compromise, which puts the business at risk.
Many companies are operating with a set of security solutions and tools, even without them
being fully integrated or automated. As a result, security teams spend more time on manualtasks. They lack the context and information that is needed to effectively reduce the attack
surface of their organization. Rising numbers of data breaches and increasing global
regulations make securing networks difficult.
Applications, users, and devices need fast and secure access to data, so much so that an
entire industry of security tools and architectures was created to protect them.

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Although enforcing a data encryption policy is an effective way to minimize the risk of a data
breach that, in turn, minimizes costs, only a few enterprises at the worldwide level have an
encryption strategy that is applied consistently across the entire organization. This is true inlarge part because such policies add complexity and cost, and negatively affect performance,
which can mean missed SLAs to the business.
The rapidly evolving cyberthreat landscape also requires focus on cyber-resilience. Persistentand end-to-end security is the best way to reduce exposure to threats.

Prevention is the best protection
Because prevention is the best protection, Power10 processor-based servers provide
industry-leading isolation, and integrity that help prevent ransomware from being installed.
The following features and implementation help IBM Power customers to protect theirbusiness:
Host and firmware secure and trusted boot.
Guest operating system secure boot (AIX now, Linux upcoming).
Built-in operating system runtime integrity: AIX Trusted Execution and Linux IMA.
Most secure multi-tenant environment with orders of magnitude lower Common
Vulnerabilities and Exposures (CVE) versus x86 hypervisors.
򐂰 Orders of magnitude lower operating system CVEs for AIX and IBM i.
򐂰 Simplified patching with PowerSC.
򐂰 Multi-Factor Authentication with PowerSC.
򐂰򐂰򐂰򐂰Early Detection is critical
Integrated security and compliance management with PowerSC makes it more difficult to
misconfigure systems and easier to detect anomalies. Third-party offerings, for example, IBM
Security QRadar®, enhance inherent security with early anomaly detection.

Fast and Efficient Recovery
It is easier to deploy resiliency strategies with IBM PowerHA® and IBM Storage safeguarded
copies, while also using the collaboration with IBM Storage and security services for fast
detection and automated recovery of affected data.

4.4.1 Power10 processor-based, technology-integrated security ecosystem
The IBM Power processor-based platform offers the most secure and reliable servers in theirclass. Introducing Power10 processor-based technology in 2021, IBM further extended theindustry-leading security and reliability of the Power processor-based platform, with focus onprotecting applications and data across hybrid cloud environments.
Also introduced were significant innovations along the following major dimensions:򐂰 Advanced Data Protection that offers simple to use and efficient capabilities to protect
sensitive data through mechanisms, such as encryption and multi-factor authentication.
򐂰 Platform Security ensures that the server is hardened against tampering, continuously
protecting its integrity, and ensuring strong isolation among multi-tenant workloads.
Without strong platform security, all other system security measures are at risk.
򐂰 Security Innovation for Modern Threats provides the ability to stay ahead of new types ofcybersecurity threats by using emerging technologies.
򐂰 Integrated Security Management addresses the key challenge of ensuring correct
configuration of the many security features across the stack, monitoring them, andreacting if unexpected changes are detected.

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The Power10 processor-based servers are enhanced to simplify and integrate security
management across the stack, which reduces the likelihood of administrator errors.
In the Power10 processor-based scale-out servers, all data is protected by a greatly simplified
end-to-end encryption that extends across the hybrid cloud without detectable performance
impact and prepares for future cyberthreats.
Power10 processor-core technology features built-in security integration:
򐂰 Stay ahead of current and future data threats with better cryptographic performance andsupport for quantum-safe cryptography and fully homomorphic encryption (FHE).
򐂰 Enhance the security of applications with more hardened defense against return-oriented
programming (ROP) attacks.
򐂰 Simplified single-interface hybrid cloud security management without any required setup.
򐂰 Protect your applications and data with the most secure VM isolation in the industry withorders of magnitude lower CVEs than hypervisors related to x86 processor-based servers.
Also, workloads on the Power10 processor-based scale-out servers benefit from
cryptographic algorithm acceleration, which allows algorithms, such as Advanced Encryption
Standard (AES), SHA2, and SHA3 to run significantly faster than Power9 processor-based
servers on a per core basis. This performance acceleration allows features, such as AIX
Logical Volume Encryption, to be enabled with low-performance overhead.

4.4.2 Cryptographic engines and transparent memory encryption
Power10 processor technology is engineered to achieve significantly faster encryption
performance in comparison to IBM Power9 processor-based servers. Power10
processor-based scale-out servers are updated for today’s most demanding encryption
standards and anticipated future cryptographic standards, such as post-quantum and FHE,
and brings new enhancements to container security.
Transparent memory encryption is designed to simplify the deployment of encryption, andsupport end-to-end security without affecting performance by using hardware features for aseamless user experience. The protection that is introduced in all layers of an infrastructure isshown in Figure 4-5.

Figure 4-5 Protect data in memory with transparent memory encryption

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4.4.3 Quantum-safe cryptography support
To be prepared for the Quantum era, the Power S1014, S1022s, S1022, and S1024 are built
to efficiently support future cryptography, such as Quantum-safe cryptography and FHE. The
software libraries for these solutions are optimized for the Power10 processor-chip instruction
set architecture (ISA) and are to be available in the respective open source communities.

Quantum-safe cryptography refers to the efforts to identify algorithms that are resistant to
attacks by classical and quantum computers in preparation for the time when large-scalequantum computers are built.
Homomorphic encryption refers to encryption techniques that permit systems to perform
computations on encrypted data without decrypting the data first. The software libraries forthese solutions are optimized for the Power processor-chip ISA.

4.4.4 IBM PCIe3 Crypto Coprocessor BSC-Gen3 4769
IBM PCIe3 Crypto Coprocessor BSC-Gen3 4769 (#EJ35 or #EJ37) provides hardware
security protection for the most sensitive secrets. As described in 3.4.5, “Cryptographic
coprocessor adapters” on page 123, this adapter supports IBM AIX, IBM i without the use of
the VIO server, or supported distribution of Linux operating systems.
It provides a comprehensive set of cryptographic functions, including the common AES,
TDES, RSA, and ECC functions for data confidentiality and data integrity support. In addition,
CCA features extensive functions for key management and many functions of special interest
to the banking and finance industry.
The coprocessor holds a security-enabled subsystem module and batteries for backup power.
The hardened encapsulated subsystem contains two sets of two 32-bit PowerPC 476FP
reduced-instruction-set-computer (RISC) processors running in lockstep with cross-checking
to detect soft errors in the hardware.
It also contains a separate service processor that is used to manage:
򐂰 Self-test and firmware updates.
򐂰 RAM, flash memory and battery-powered memory.
򐂰 Secure time-of-day.
򐂰 Cryptographic quality random number generator.
򐂰 AES, DES, triple DES, HMAC, CMAC, MD5, and multiple SHA hashing methods.
򐂰 Modular-exponentiation hardware, such as RSA and ECC.
򐂰 Full-duplex direct memory access (DMA) communications.
A security-enabled code-loading arrangement allows control program and application
program loading and refreshes after coprocessor installation in your server.
IBM offers an embedded subsystem control program and a cryptographic API that
implements the IBM Common Cryptographic Architecture (CCA) Support Program that canbe accessed from the internet at no charge to the user.
Feature #EJ35 and #EJ37 are feature codes that represent the same physical card with thesame CCIN of C0AF. Different feature codes are used to indicate whether a blind swap
cassette is used and its type: #EJ35 indicates no blind swap cassette, #EJ37 indicates a
Gen 3 blind swap cassette.

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The 4769 PCIe Cryptographic Coprocessor is designed to deliver the following functions:򐂰 X.509 certificate services support
򐂰 ANSI X9 TR34-2019 key exchange services that use the public key infrastructure (PKI)򐂰 ECDSA secp256k1
򐂰 CRYSTALS-Dilithium, a quantum-safe algorithm for digital signature generation andverification
򐂰 Rivest-Shamir-Adleman (RSA) algorithm for digital signature generation and verification
with keys up to 4096 bits
򐂰 High-throughput Secure Hash Algorithm (SHA), MD5 message digest algorithm,
Hash-Based Message Authentication Code (HMAC), Cipher-based Message
Authentication Code (CMAC), Data Encryption Standard (DES), Triple Data Encryption
Standard (Triple DES), and Advanced Encryption Standard (AES)-based encryption fordata integrity assurance and confidentiality, including AES Key Wrap (AESKW) that
conforms to ANSI X9.102.
򐂰 Elliptic-curve cryptography (ECC) for digital signature and key agreement.
򐂰 Support for smart card applications and personal identification number (PIN) processing.
򐂰 Secure time-of-day.
򐂰 Visa Data Secure Platform (DSP) point-to-point encryption (P2PE) with standard Visa
format-preserving encryption (FPE) and format-preserving, Feistel-based Format
Preserving Encryption (FF1, FF2, FF2.1). Format Preserving Counter Mode (FPCM), as
defined in x9.24 Part 2.

4.4.5 IBM PowerSC support
The Power10 processor-based scale-out servers benefit from the integrated security
management capabilities that are offered by IBM PowerSC. This Power software portfolio
manages security and compliance on every Power processor-based platform that is runningthe following operating systems:
򐂰 AIX
򐂰 IBM i򐂰 The supported distributions and versions of LinuxPowerSC is introducing more features to help customers manage security end-to-end acrossthe stack to stay ahead of various threats. Specifically, PowerSC 2.0 adds support for
Endpoint Detection and Response (EDR), host-based intrusion detection, block listing, andLinux.
Security features are beneficial only if they can be easily and accurately managed. Power10
processor-based scale-out servers benefit from the integrated security management
capabilities that are offered by IBM PowerSC.
PowerSC is a key part of the Power solution stack. It provides features, such as compliance
automation, to help with various industry standards, real-time file integrity monitoring,
reporting to support security audits, patch management, trusted logging, and more.
By providing all of these capabilities within a clear and modern web-based user interface,
PowerSC simplifies the management of security and compliance significantly.
The PowerSC Multi-Factor Authentication (MFA) capability provides more assurance that only
authorized people access the environments by requiring at least one extra authentication
factor to prove that you are the person you say you are. MFA is included in PowerSC 2.0.
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Because stolen or guessed passwords are still one of the most common ways for hackers toaccess systems, having an MFA solution in place allows you to prevent a high percentage ofpotential breaches.
This step is important on the journey toward implementing a zero trust security posture.
PowerSC 2.0 also includes Endpoint Detection and Response (EDR), which provides thefollowing features:
򐂰
򐂰
򐂰
򐂰
򐂰

Intrusion Detection and Prevention (IDP)
Log inspection and analysis
Anomaly detection, correlation, and incident response
Response triggers
Event context and filtering

4.4.6 Secure and Trusted bootIBM Power servers provide a highly secure server platform. IBM Power10 processor-based
hardware and firmware includes PowerVM features to provide a more secure platform foron-premises and cloud deployments.
The key PowerVM features include the following examples:򐂰 A secure initial program load (IPL) process feature that is called Secure Boot allows only
suitably signed firmware components to run on the system processors. Each componentof the firmware stack, including host boot, the Power Hypervisor (PHYP), and partition
firmware (PFW), is signed by the platform manufacturer and verified as part of the IPL
process.
򐂰 A framework to support remote attestation of the system firmware stack through a
hardware trusted platform module (TPM).
The terms Secure Boot and Trusted Boot have specific connotations. The terms are used as
distinct, yet complementary concepts, as described next.

Secure Boot
This feature protects system integrity by using digital signatures to perform a
hardware-protected verification of all firmware components. It also distinguishes between thehost system trust domain and the eBMC or FSP trust domain by controlling service processor
and service interface access to sensitive system memory regions.

Trusted Boot
This feature creates cryptographically strong and protected platform measurements thatprove that specific firmware components ran on the system. You can assess themeasurements by using trusted protocols to determine the state of the system and use that
information to make informed security decisions.

4.4.7 Enhanced CPU: BMC isolation
Separating CPU and service processor trust domains in Power10 processor-based scale-out
servers improves the protection from external attacks.
Power10 technology introduces innovations to address emerging threats, specifically withextra features and enhancements to defend against application domain vulnerabilities, suchas return-oriented programming (ROP) attacks (a security leverage technique is used byattackers to run code on a target system). This capability uses a new in-core hardware
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architecture that imparts minimal performance overhead (approximately only 1 - 2% for somesample workloads tested).
In the Power10 processor-based scale-out servers, the eBMC chip is connected to the two
network interface cards by using NCSI (to support the connection to HMCs) and also have a
PCIe x1 connection that connects to the backplane. This connection is used by PowerVM for
partition management traffic, but cannot be used for guest LPAR traffic. A guest LPAR needs
its own physical or virtual network interface PCIe card (or cards) for external connection.
Hardware assist is necessary to avoid tampering with the stack. The Power platform addedfour instructions (hashst, hashchk, hashstp, and hashchkp) to handle ROP in the Power ISA
3.1B.

4.5 Running AI where operational data is created, processed,
and stored
Maintaining separate platforms for AI and business applications make deploying AI inproduction difficult. The following results are possible:
򐂰 Reduced end-to-end availability for applications and data access򐂰 Increased risk of violating service level agreements because of overhead of sending
operational data and receiving predictions from external AI platforms
򐂰 Increased complexity and cost of managing different environments and external
accelerators
Because AI is set to deploy everywhere, attention is turning from how fast data science teams
can build AImodels to how fast inference can be run against new data with those trained AI
models. Enterprises are asking their engineers and scientists to review new solutions andnew business models where the use of GPUs is no longer fundamental, especially because
this method became more expensive.
To support this shift, the Power10 processor-based server delivers faster business insights byrunning AI in place with four Matrix Math Accelerator (MMA) units to accelerate AI in eachPower10 technology-based processor-core. The robust execution capability of the processor
cores with MMA acceleration, enhanced SIMD, and enhanced data bandwidth, provides analternative to external accelerators, such as GPUs.
It also reduces the time and cost that is associated with the related device management for
execution of statistical machine learning and inferencing workloads. These features, which
are combined with the possibility to consolidate multiple environments for AI model execution
on a Power10 processor-based server together with other different types of environments,
reduces costs and leads to a greatly simplified solution stack for the deployment of AI
workloads.
Operationalizing AI inferencing directly on a Power10 processor-based server brings AI closer
to data. This ability allows AI to inherit and benefit from the Enterprise Qualities of Service(QoS): reliability, availability, and security of the Power10 processor-based platform andsupport a performance boost. Enterprise business workflows can now readily andconsistently use insights that are built with the support of AI.
The use of data gravity on Power10 processor-cores enables AI to run during a database
operation or concurrently with an application, for example. This feature is key fortime-sensitive use cases. It delivers fresh input data to AI faster and enhances the quality andspeed of insight.
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As no-code application development, pay-for-use model repositories, auto-machine learning,
and AI-enabled application vendors continue to evolve and grow, the corresponding software
products are brought over to the Power10 processor-based platform. Python and code frommajor frameworks and tools, such as TensorFlow, PyTorch, and XGBoost, run on thePower10 processor-based platform without any changes.
Open Neural Network Exchange (ONNX) models can be brought over from x86 or Arm
processor-based servers or other platforms and small-sized VMs or Power Virtual Server(PowerVS) instances for deployment on Power10 processor-based servers. This Power10
technology gives customers the ability to train models on independent hardware but deploy
on enterprise grade servers.
The Power10 processor-core architecture includes an embedded MMA. This MMA isextrapolated for a Power10 processor-based server to provide up to 5x faster AI inference for
32-bit floating point (FP32) precision to infuse AI into business applications and drive greater
insights. Up to 10x faster AI inference can be realized by using reduced precision data types,
such as 16-bit brain float (Bfloat16) and 8-bit integer (INT8), when compared with a previous
generation Power9 processor-based server.
The IBM development teams optimized common math libraries so that AI tools benefit fromthe acceleration that is provided by the MMA units of the Power10 chip. The benefits of MMA
acceleration can be realized for statistical machine learning and inferencing, which provides a
cost-effective alternative to external accelerators or GPUs.

4.5.1 Train anywhere, deploy on Power10 processor-based server
IBM Power10 processor-based technology addresses challenges through hardware andsoftware innovation. Machine learning and deep learning models that are trained on any
system or cloud that is based on Power or x86 processor-based servers (even with different
endianness) can be deployed on the Power10 processor-based server and run without any
changes.
Because Power10 cores are equipped with four MMAs for matrix and tensor math,applications can run models against colocated data without the need for external
accelerators, GPUs, or separate AI platforms. Power10 technology uses the “train anywhere,
deploy here” principle to operationalize AI.
A model can be trained on a public or private cloud and then deployed on a Power server (seeFigure 4-6 on page 185) by using the following procedure:
1. The trained model is registered with its version in the model vault. This vault is a VM or
LPAR with tools, such as IBM Watson® OpenScale, BentoML, or Tensorflow Serving, tomanage the model lifecycle.
2. The model is pushed out to the destination (in this case, a VM or an LPAR that is runninga database with an application). The model might be used by the database or theapplication.
3. Transactions that are received by the database and application trigger model execution
and generate predictions or classifications. These predictions also can be stored locally.
For example, these predictions can be the risk or fraud that is associated with thetransaction or product classifications that are to be used by downstream applications.
4. A copy of the model output (prediction or classification) is sent to the model operations(ModelOps) engine for calculation of drift by comparison with Ground Truth.

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5. If the drift exceeds a threshold, the model retrain triggers are generated, and a new modelis trained by using a current data set. Otherwise, a new model is not trained.
6. Retrained models are then taken through steps 1 - 5.

Figure 4-6 Operationalizing AI

By using a combination of software and hardware innovation, the Power10 processor-based
scale-out server models can meet the model performance, response time, and throughput
KPIs of databases and applications that are infused with AI.

4.6 Oracle Database Standard Edition 2 on Power S1014
Databases have been a critical component in running your business for several years. Many
enterprises have turned to Oracle to provide the database technology that they require. The
challenge is that for small to medium size applications, the cost of the database is asignificant part of the total application cost and the number of databases is expanding rapidly
as new applications come online.
Oracle has multiple options for running your database. For high end databases, the best
option is using Oracle Enterprise Edition which has all of the features to support yourenterprise class applications. For smaller databases, Oracle has another option that can save
up to 33% of the costs on each DB instance, Oracle Standard Edition 2 (SE2).
The savings opportunity when using Oracle SE2 comes from the fact while Oracle Enterprise
Edition is charged per core (based on a core factor for the processor type being used) Oracle
SE2 is charged per socket, no matter how many cores are provided per socket. For
consolidating a number of smaller databases, Oracle SE2 is a good option.
There are some restrictions involved with running Oracle SE2. The first one is that it is limited
to servers with a maximum of two sockets. Oracle considers a single Power10 DCM to be twosockets, so the only Power10 server eligible to run SE2 is the S1014. The other restriction isthat SE2 limits each database to a maximum of sixteen threads. With Power10 utilizing
SMRT8, this is even a stronger reason to consider consolidating multiple databases to asingle Power10 server - especially now that we have the 24 core option available.

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The Power S1014 brings all of the benefits of Power 10 to the Oracle environment. With thebuilt in power hypervisor, described in 4.1.1, “IBM Power Hypervisor” on page 160,
consolidation of multiple servers is easy and efficient and does not have the overhead ofsoftware virtualization products as seen in the x86 world. Add to that the proven reliability andsecurity of the Power platform over time and you have even more advantages compared tox86 alternatives.
Power10 adds additional benefits with its built in transparent memory encryption, described in
4.4.2, “Cryptographic engines and transparent memory encryption” on page 179, further
adding to the security or your enterprise critical databases. If you are looking to add AI
capabilities, Power 10 provides built in AI inferencing capability as discussed in 4.5.1, “Trainanywhere, deploy on Power10 processor-based server” on page 184.
For smaller environments, the Power S1014 with the 8-core processor might be a good fit andthis could replace older Power8 and Power9 servers currently running SE2. With the 2.8x
performance per core advantage of Power10 over x86 options, this might also be a good
option for upgrading your x86 SE2 implementations. With the 24-core Power S1014
processor option you can support 50% more database instances compared to the best x86
competitor or you can run additional workloads along with your database instances.

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Related publications
The publications that are listed in this section are considered particularly suitable for a moredetailed discussion of the topics that are covered in this paper.

IBM Redbooks
The following IBM Redbooks publications provide more information about the topics in thisdocument. Some publications that are referenced in this list might be available in softcopy
only:򐂰 IBM Power Private Cloud with Shared Utility Capacity: Featuring Power Enterprise Pools
2.0, SG24-8476
򐂰 SAP HANA Data Management and Performance on IBM Power Systems, REDP-5570
򐂰 IBM PowerAI: Deep Learning Unleashed on IBM Power Systems Servers, SG24-8409
򐂰 IBM Power E1080 Technical Overview and Introduction, REDP-5649
򐂰 IBM Power E1050 Technical Overview and Introduction, REDP-5684
򐂰 IBM Power System AC922 Technical Overview and Introduction, REDP-5494
򐂰 IBM Power System E950: Technical Overview and Introduction, REDP-5509
򐂰 IBM Power System E980: Technical Overview and Introduction, REDP-5510
򐂰 IBM Power System L922 Technical Overview and Introduction, REDP-5496
򐂰 IBM Power System S822LC for High Performance Computing Introduction and Technical
Overview, REDP-5405
򐂰 IBM Power Systems H922 and H924 Technical Overview and Introduction, REDP-5498
򐂰 IBM Power Systems LC921 and LC922: Technical Overview and Introduction,
REDP-5495
򐂰 IBM Power Systems S922, S914, and S924 Technical Overview and Introduction
Featuring PCIe Gen 4 Technology, REDP-5595
򐂰 IBM PowerVM Best Practices, SG24-8062
򐂰 IBM PowerVM Virtualization Introduction and Configuration, SG24-7940
򐂰 IBM PowerVM Virtualization Managing and Monitoring, SG24-7590
򐂰 IBM PowerVC Version 2.0 Introduction and Configuration, SG24-8477
You can search for, view, download, or order these documents and other Redbooks
publications, Redpapers, web docs, drafts, and additional materials, at the following website:
ibm.com/redbooks© Copyright IBM Corp. 2022.

187

Online resources
The following websites are also relevant as further information sources:
򐂰 IBM Fix Central:
http://www.ibm.com/support/fixcentral/򐂰 IBM documentation:
https://www.ibm.com/docs/en
򐂰 IBM Power10 documentation:
https://www.ibm.com/docs/en/power10
򐂰 IBM Portal for OpenPOWER - POWER9 Monza Module:
https://www.ibm.com/systems/power/openpower/tgcmDocumentRepository.xhtml?aliasI
d=POWER9_Monza򐂰 IBM Power:
https://www.ibm.com/it-infrastructure/power򐂰 IBM Storage:
https://www.ibm.com/it-infrastructure/storage
򐂰 IBM Systems Energy Estimator:
https://ibm.biz/energy-estimator򐂰 IBM System Planning Tool:
https://www.ibm.com/support/pages/ibm-system-planning-tool-power-processor-based-systems-0
򐂰 OpenCAPI:
http://opencapi.org/technical/use-cases/򐂰 OpenPOWER Foundation:
https://openpowerfoundation.org/
򐂰 Power Systems Capacity on Demand:
http://www.ibm.com/systems/power/hardware/cod/򐂰 Support for IBM Systems:
https://www.ibm.com/mysupport/s/?language=en_US

Help from IBM
IBM Support and downloads
ibm.com/support
IBM Global Services
ibm.com/services

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Back cover

REDP-5675-00
ISBN 0738460761

Printed in U.S.A.

ibm.com/redbooks®