High heat resistant non-silicone
adhesive tape

（Manufactured by Korea Taconic, AGC Group, P-KT:6323）
2. Background

1. Introduction

Winter 2021
No.40

The performance required of masking tapes is higher

Due to the increased adoption of lead-free solder alloy inthan ever before due to the higher integration ofrecent years, the temperature of the mounting process iselectronic circuit boards caused by the recent trend

said to be 230℃ , and masking tape that can withstandtoward smaller and larger capacity information

this temperature is essential. Generally, polyimide tapeterminals and the adoption of lead-free solder alloy tocoated with silicone adhesive is used for masking tape

reduce substances of environmental concern. Generally,（confirmation required）, but the normal grade is 200℃ ,silicone adhesives are used for high-temperatureand even the heat-resistant grade is 260℃ . However,adhesive tapes, but since silicone adhesives are usually

since a silicone adhesive（polysiloxane）is used, low-

not recommended for temperatures above 200℃ andmolecular - weight siloxane decomposes when used atsilicone volatile components are noted as a cause ofhigh temperatures, and this causes problems such as

contamination of semiconductor chips, there is a need forcontamination of the wafer surface and contact failure inmasking tapes with non-silicone adhesives and improved

electronic circuits.

heat resistance.

Non-silicone masking tapes have traditionally had

Our company has been selling masking tapes using non-problems such as low heat resistance of the adhesive,

silicone adhesives, and we have started handling a grade

residue after use, and foaming due to decomposition gas,with further improved heat resistance, which isbut since they do not generate siloxane, they are

introduced in this report.

expected to contribute to ensuring reliability in themounting process（SMT ; Surface Mount Technology）of
circuit boards, which will become increasingly dense in
the future.

3. Product specifications
The adhesive tapes introduced here are all made of aFigure1

 roduct photo of high heat-resistant non-siliconePadhesive tape
Table1polyimide base material that is coated with a non-silicone
adhesive（Table1）.

Types of heat-resistant adhesive tapes
Type AType B

Type C

Substrate（polyimide）

μm

25252525

Adhesiveμm

38383839

Peel Strength（SUS）

gf / 25mm

Min 200

Min 300

Min 200

Min 350

Max. working temperature℃

200

200

260

160

Thicknessconventional product※ This is a product under development and specifications are subject to change.

19

Product Introductions

4. Features

5. Conclusions

In the following, we will examine the heat resistance ofThis product was designed as a masking tape for theType C, which has the highest heat resistance.

solder reflow process of surface mounting（SMT）of

After standing in an oven at 260℃ for 2 hours, as shown

rigid and flexible boards, but as stated, no residue wasin Table2, residue due to deterioration of the adhesive

observed under 260℃, and the product has sufficient

can be seen in the conventional product, but no residue

capability for masking applications.

can be seen in "Type C" with improved heat resistance

By all means, it has been confirmed that since a non-（Table2）.

silicone adhesive is used, no siloxane is detected in thedecomposition gas and we believe that this product will

Table2 R esidue check of heat-resistant adhesive tape after
heat test at 260℃ for 2 hours
After heating

Enlarged pictures

be useful in other applications where contamination bysiloxane is a problem. In addition to the solder reflow
process described in this article, we can also expect tosee the product used in wire bonding, thermosetting

conventional
product

mounting processes, dicing, and packaging processes.
Furthermore, the adhesive tape is introduced as amasking tape made of polyimide in this article, but it
could also be coated for other base materials such as

Type C

silicone release tapes for the heat-sealing process.
In addition, no residue was observed in the actual test in※ All data and values in this document are representative

a solder bath（285℃ , 10 minutes）（Table3, Figure2）.

values under a certain environment. It is necessary toTable3 R esidue check of heat-resistant adhesive tape after
solder bath test
After heating

confirm the suitability of the product when using it.

No.40

Enlarged pictures

Before solder bath
Masking area（after solder bath）
Non-masking area（after solder bath）

Takeyuki Suzuki
Figure2IR absorption spectroscopy before and after solder
bath test

Winter 2021

fluoroplastic tape, therefore it is possible to consider non-High-performance Plastics
Group20