AN90019

LFPAK MOSFET thermal resistance - simulation, test andoptimization of PCB layout
Rev. 1.0 — 20 July 2020

application note

Document information
Information

Content

Keywords

thermal resistance, LFPAK

Abstract

This application note explains the parameter thermal resistance from junction to ambient and how
it can be reduced by careful PCB layout.

AN90019

Nexperia

LFPAK MOSFET thermal resistance - simulation, test and optimization of PCB layout

1. Introduction
Nexperia MOSFET data sheets contain a parameter Rth(j-a) which is the thermal resistance fromjunction to ambient. This is a guide to how much heat can be dissipated from the device to its
surroundings in a typical application. For a surface-mounted device such as an LFPAK MOSFET
this is highly dependent on the type of Printed Circuit Board (PCB) on which it is mounted. The typeof material, the thickness of copper and the shape of the copper footprint all contribute to Rth(j-a).
This application note looks at the structure of an LFPAK MOSFET and the way it is mounted on a
PCB. It uses thermal modelling techniques to analyse how heat, generated inside the device, istransferred to its surroundings. Various circuit layouts are considered and tested so that developers
can use a value for Rth(j-a) that closely reflects practical applications.

2. Definition of thermal resistance Rth(j-a)
Rth(j-a) is the thermal resistance from the active surface of the silicon crystal to the surrounding
environment. It is a value that represents the net effect of all the possible series and parallelpaths from the semiconductor junction to ambient and includes heat transfer by means such as
conduction, convection and radiation.
Rth(j-a) is defined as the temperature difference between junction and ambient that transfers one
watt of power to the environment. It is given by:

Tj - TaRth(j-a) = −P(1)

where Rth(j-a) is measured in K/W
Tj is the junction temperature (°C)
Tamb is the ambient temperature (°C)
P is the heating power dissipated inside the MOSFET (W)

2.1. Test method
The method used to measure Rth(j-a) is defined by JEDEC standard 51-1 and 51-2A. The approachis a static implementation, meaning heating power is applied on continuous basis while monitoring
the junction temperature. The formula for Rth(j-a) shown above can be used once a known power
is applied and steady state is reached. The Device Under Test (DUT) is soldered to a FR4 test
board and placed in the geometric centre of the test enclosure as shown in Fig. 1 and Fig. 2.
The enclosure comprises a 305 mm cube made from low thermal conductivity materials such as
cardboard, polycarbonate, polypropylene, wood, etc.

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Dimensions in mm.
Wiring not shown, but will be placed to avoid interferingwith the convection air flow.
Fig. 1.

Side view of the test fixture and enclosure

Fig. 2.

Isometric view of the test board and fixture
without the enclosure

2.2. Heat transfer in the JEDEC enclosure
Within the JEDEC enclosure, heat is transferred from the DUT to the PCB and surroundings by
three basic mechanisms; conduction, convection, and radiation.
Conduction is the process by which heat transfers from high temperature regions to lowtemperature regions that are in contact with each other. Fig. 3 shows how heat is transferred fromthe semiconductor junction to the copper clip and from the clip to the encapsulant. Also, from thejunction through the silicon die to the mounting base, and from the mounting base to the PCB.
Convection refers to the heat transfer process caused by displacement of air surrounding the test
fixture. The movement is caused by the tendency of hotter and therefore less dense air to rise, andcolder, denser air to sink under the influence of gravity, which consequently results in transfer ofheat.
Radiation does not depend on contact as heat conduction and convection do. Thermal radiation
is when an object loses energy in the form of electromagnetic radiation in the infrared part of thespectrum. In the example shown in Fig. 3, heat is radiated from the surfaces of the MOSFET and
the PCB into the space inside the box.

Fig. 3.

LFPAK MOSFET - heat transfer model

The measured thermal resistance of a MOSFET, Rth(j-a), depends upon the package size, thematerial properties and the internal structure of the device. It also depends on the PCB that is usedin the test fixture. Modern surface-mount MOSFETs are designed to use the PCB as a heat sinkand rely on the copper traces to spread the heat over a large area to assist with cooling.

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LFPAK MOSFET thermal resistance - simulation, test and optimization of PCB layout
Nexperia power MOSFET data sheets usually specify two values for Rth(j-a) – one with a minimum
footprint that conforms with the JEDEC standard, and another with a 25.4 mm (1") square of 70 µm
thick (2 oz) copper on the top surface. See Table 1 also Fig. 4 and Fig. 5 below.
Table 1. Thermal characteristics
SymbolParameter

Min

Typ

Max

Unit

Rth(j-mb)

thermal resistance fromjunction to mounting
base

Conditions

-

0.56

0.63

K/W

Rth(j-a)thermal resistance from Fig. 4junction to ambient
Fig. 5

-

50

-

K/W

-

125

-

K/W

aaa-005751

aaa-005750

Fig. 4.

PCB layout for thermal resistance junction toambient 1” square pad; FR4 Board; 2oz copper

Fig. 5.

PCB layout for thermal resistance junction toambient minimum footprint; FR4 Board; 2ozcopper

3. MOSFET drain-source current pathModern power MOSFETs have an on-state resistance in the order of milliohms and surface-mountvariants are capable of switching hundreds of amps. In these cases consideration must be given to
the Joule heating effect, i.e. induced heat due to current flowing through the conductor, in this casecurrent through the device and the PCB traces.
Fig. 6, below, shows the current path through a LFPAK MOSFET. The clip is attached directly tothe semiconductor junction and at low current it acts as a heat sink, conducting heat away fromthe junction to the PCB. At high current, however, it becomes heated by its own resistance andrequires cooling by being connected to a cooling surface connected to the source terminal.

Fig. 6.

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LFPAK package MOSFET current path

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LFPAK MOSFET thermal resistance - simulation, test and optimization of PCB layout

4. PCB layout optimization
4.1. PCB trace width calculation
To examine the heating effect of the PCB trace let us consider as an example a Nexperia LFPAKMOSFET; PSMN1R0-30YLD. This has an on-state resistance RDSon = 1 mΩ (VGS = 10 V; Tj =25 °C).
2

2

At a typical current of 55 A, the simplified power dissipation, given by I R will be 55 x 0.001 = 3 W.
This power can be dissipated with the appropriate PCB layout applying the right amount of copper
to spread the heat.
Many PCB manufacturers websites include a trace width calculation tool based on the IPC-2221
Generic Standard on Printed Board Design. Using an IPC-2221 trace width calculator we candetermine the size of trace required to carry 55 A.
Assuming 70 µm (2 oz) thick copper and allowing for manageable 30 °C rise in the trace
temperature, Fig. 7 shows that a trace almost 20 mm wide is required.

Fig. 7.

Example IPC-2221 trace width calculator

4.2. PCB layout simulations
A number of thermal simulations have been carried out using a PSMN1R0-30YLD as an example
to find the optimum PCB layout that extracts the maximum amount of heat from the device andtherefore gives the lowest possible value for Rth(j-a). All the simulations were on a 25.4 mm squareof 70 µm thick copper. The MOSFET was fully turned on with a constant current that produced a
3 W power loss in the device.
The investigation examined different positions of the MOSFET within the copper square. It
also considered allocating different percentages of the copper square to the source and drain.

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LFPAK MOSFET thermal resistance - simulation, test and optimization of PCB layout
Finally, it examined the heating effect of trace width on the temperature of the MOSFET and theconsequences for Rth(j-a) measurement.

Test layout 1
In Fig. 8 the device is mounted on the edge of a 25.4 mm square copper pad.
Rth(j-a) = 41.8 K/W according to the simulation result.
This layout assumes that the main heat transfer path is from the junction, through the silicon die tothe mounting base. All of the copper pad is allocated to cooling the mounting base. We see fromthe thermal profile that very little heat reaches parts of the copper furthest away from the MOSFET
and these contribute little to the cooling. The source trace is very hot because of inefficient coolingof the source pins. This is evidently not an optimum solution resulting in a relatively high value forRth(j-a).

Fig. 8.

Test layout 1 and surface temperature profile

Test layout 2
The test layout of Fig. 9 shows the MOSFET mounted in the middle of the 25.4 mm copper squarewith the copper area divided equally between source and drain.
The simulation result gives: Rth(j-a) = 39.1 K/W
Placing the device in the middle of the copper has improved the cooling and reduced the thermal
resistance. However, the copper area connected to the drain tab is hotter than that connected tothe source pins which suggest that more heat flows through the drain tab. Selecting the proper ratioof source to drain copper is important to obtain the optimum Rth(j-a) value.

Fig. 9.

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Test PCB layout 2 and surface temperature profile

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LFPAK MOSFET thermal resistance - simulation, test and optimization of PCB layout

Test layouts 3, 4 and 5
In Fig. 10, Fig. 11and Fig. 12 different layouts examine the effect of various trace widths for thesource connection.
Layout 3 has the MOSFET located in the centre of the copper pad and the Joule heating effect of
the source trace is not considered
The simulated result gives: Rth(j-a) = 38.6 K/W.

Fig. 10. Test PCB layout 3 and surface temperature profile
However in a practical working circuit when low RDSon MOSFETs are fitted, the drain-source current
can reach tens or even hundreds of amperes, and the heat generated in the PCB traces cannot be
neglected.
Layout 4 shows what happens when the Joule heating of the source trace is taken into account.
In this case the trace width is 0.8 mm. The power loss in the MOSFET is 3 W as before, but thepower loss in the trace is 8.8 W. Fig. 11 shows the rise in temperature of the source trace which ishigher than the die temperature of the MOSFET and is therefore heated significantly.

Fig. 11. Test PCB layout 4 and surface temperature profile
Layout 5 has the source trace increased to 3 mm. The test conditions are the same as in layout
4. This time the power loss in the source trace is reduced to 2.4 W but Fig. 12 shows that thetemperature still exceeds that of the die.
The simulated result gives: Rth(j-a) = 56.7 K/W.

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LFPAK MOSFET thermal resistance - simulation, test and optimization of PCB layout

Fig. 12. Test PCB layout 5 and surface temperature profile
We can deduce from test layouts 4 and 5 that in a practical application involving an LFPAKMOSFET careful consideration must be given to trace thickness and width so that the Joule
heating of the current path does not contribute to the heating of the MOSFET.

Optimal PCB layout - layout 6
Layout 6, shown in Fig. 13, attempts to optimise the copper traces to obtain the lowest possible
Rth(j-a). Approximately 1/3 of the 25.4 mm copper pad is allocated to the source pins whilst thewidth of the source trace is a maximum.
The simulation result gives: Rth(j-a) = 37.1 K/W.

Fig. 13. Test PCB layout 6 and surface temperature profile

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LFPAK MOSFET thermal resistance - simulation, test and optimization of PCB layout

5. Conclusion
NEXPERIA LFPAK MOSFETs are designed to handle high levels of current, 300 A in the case of
PSMN1R0-30YLD and in excess of 400 A for packages such as LFPAK88. To take full advantageof the MOSFET's ability to handle these levels of current, designers are faced with the challenge ofdissipating the resulting power through the PCB and therefore care must be taken in the design ofthe layout.
A larger amount of copper and a larger area used under the MOSFET's drain tab will provide better
thermal performance and thus better power dissipation. Perhaps less obvious is the PCB layout/
trace for source pins and the importance of the amount/area of copper used. LFPAK packages
provide a good thermal path from the junction to the source pins as they use one piece copperclip (i.e. not two pieces of copper soldered together or copper-ribbon combination). It is therefore
very important, for an efficient thermal design to consider a layout with the right amount and area ofcopper for the source pins.
As shown in this application note the best Rth(j-a) can be achieved when this layout approach isapplied. Another important factor to consider is the width and thickness necessary for PCB traces
providing the electrical connections to the MOSFETs, in order to handle the high currents.

6. Revision history
Table 2. Revision history
Revision
Date
numberDescription

1.0

Initial version.

20200720

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7. Legal information
Definitions
Draft — The document is a draft version only. The content is still underinternal review and subject to formal approval, which may result in
modifications or additions. Nexperia does not give any representations or
warranties as to the accuracy or completeness of information included hereinand shall have no liability for the consequences of use of such information.

Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, Nexperia does not give any
representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for theconsequences of use of such information. Nexperia takes no responsibility
for the content in this document if provided by an information source outsideof Nexperia.
In no event shall Nexperia be liable for any indirect, incidental, punitive,
special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removalor replacement of any products or rework charges) whether or not suchdamages are based on tort (including negligence), warranty, breach ofcontract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, Nexperia’s aggregate and cumulative liability towards customer
for the products described herein shall be limited in accordance with theTerms and conditions of commercial sale of Nexperia.
Right to make changes — Nexperia reserves the right to make changes
to information published in this document, including without limitation
specifications and product descriptions, at any time and without notice. This
document supersedes and replaces all information supplied prior to the
publication hereof.
Suitability for use — Nexperia products are not designed, authorized or
warranted to be suitable for use in life support, life-critical or safety-criticalsystems or equipment, nor in applications where failure or malfunctionof an Nexperia product can reasonably be expected to result in personal
injury, death or severe property or environmental damage. Nexperia and its
suppliers accept no liability for inclusion and/or use of Nexperia products insuch equipment or applications and therefore such inclusion and/or use is at
the customer’s own risk.
Applications — Applications that are described herein for any of theseproducts are for illustrative purposes only. Nexperia makes no representation
or warranty that such applications will be suitable for the specified use
without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using Nexperia products, and Nexperia accepts no liability forany assistance with applications or customer product design. It is customer’ssole responsibility to determine whether the Nexperia product is suitableand fit for the customer’s applications and products planned, as well as
for the planned application and use of customer’s third party customer(s).
Customers should provide appropriate design and operating safeguards tominimize the risks associated with their applications and products.
Nexperia does not accept any liability related to any default, damage, costs
or problem which is based on any weakness or default in the customer’s
applications or products, or the application or use by customer’s third party
customer(s). Customer is responsible for doing all necessary testing for thecustomer’s applications and products using Nexperia products in order toavoid a default of the applications and the products or of the application or
use by customer’s third party customer(s). Nexperia does not accept any
liability in this respect.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a priorauthorization from competent authorities.
Translations — A non-English (translated) version of a document is forreference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.

Trademarks
Notice: All referenced brands, product names, service names andtrademarks are the property of their respective owners.

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List of Tables
Table 1. Thermal characteristics.......................................... 4
Table 2. Revision history......................................................9

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List of Figures
Fig. 1. Side view of the test fixture and enclosure............... 3
Fig. 2. Isometric view of the test board and fixture
without the enclosure........................................................... 3
Fig. 3. LFPAK MOSFET - heat transfer model.....................3
Fig. 4. PCB layout for thermal resistance junction toambient 1” square pad; FR4 Board; 2oz copper..................4
Fig. 5. PCB layout for thermal resistance junction toambient minimum footprint; FR4 Board; 2oz copper............4
Fig. 6. LFPAK package MOSFET current path.................... 4
Fig. 7. Example IPC-2221 trace width calculator................. 5
Fig. 8. Test layout 1 and surface temperature profile........... 6
Fig. 9. Test PCB layout 2 and surface temperature profile... 6
Fig. 10. Test PCB layout 3 and surface temperature profile. 7
Fig. 11. Test PCB layout 4 and surface temperature profile. 7
Fig. 12. Test PCB layout 5 and surface temperature profile. 8
Fig. 13. Test PCB layout 6 and surface temperature profile. 8

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Contents
1. Introduction................................................................... 2
2. Definition of thermal resistance Rth(j-a)....................... 2
2.1. Test method................................................................. 2
2.2. Heat transfer in the JEDEC enclosure.........................3
3. MOSFET drain-source current path............................ 4
4. PCB layout optimization.............................................. 5
4.1. PCB trace width calculation.........................................5
4.2. PCB layout simulations................................................5
5. Conclusion.................................................................... 9
6. Revision history............................................................9
7. Legal information........................................................10© Nexperia B.V. 2020. All rights reserved

For more information, please visit: http://www.nexperia.com
For sales office addresses, please send an email to: salesaddresses@nexperia.com
Date of release: 20 July 2020

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