UM90001

Store and transport requirements
Rev. 1.0 — 5 March 2018

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Document information

Information

Content

Keywords

Storage, transport, shelf life, dry-baking, drying, dry-packing

Abstract

This document describes the store and transport requirements of final commercial andsemi‑finished products of Nexperia Semiconductors

UM90001

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Store and transport requirements

1

Introduction
This specification describes the technical conditions of shelf life and transport of final
commercial and semi-finished products of Nexperia Semiconductors. Other aspects likesales, warranty, legal and commercial issues are regulated by Nexperia’s “Terms andConditions of commercial Sale“, see Ref. 7.

2

Objectives
It is essential that the quality of products entering store areas is maintained and thatthe products are easily identified. The quality of stored products must not deteriorate byadditional handling while in store.
Transport conditions must be such that the quality and reliability of the product and its
packing shall not be harmed in any way.

3

Definitions
Bake to seal time — The maximum time after bake that components may be exposed toambient conditions prior to being sealed in MBBs
Desiccant — An absorbent material used to maintain a low relative humidity
ESD — ElectroStatic Discharge
FFC — Film Frame Carrier
Floor life — The permissible time period between removing the MBB and soldering
HIC — Humidity Indicator Card
IC — Integrated Circuit
MBB — Moisture Barrier Bag
MSL — Moisture Sensitivity Level
PQ-box — The box for containing and protecting the prescribed Packing Quantity of final
product (also called Inner Box)
RH — Relative Humidity
Shelf life — The possible storage life before the product is used
SMD — Surface-Mount Device
Transport — In this standard, transport includes the whole path and temporary storage
from the sending warehouse to the receiving point, which can be a warehouse or thecustomer
WVTR — Water Vapor Transmission Rate

4

General conditions
Products have to be packed in a way that ensures protection against mechanical,
environmental and electrical influences during transport and storage.
Store and transport conditions should be such that the integrity of the product and its
packing are not harmed in any way.

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5

Receiving inspection
Dry-packed packages should be inspected for a bag seal date on the caution or bar codelabel to determine remaining shelf life. The bags should be inspected to verify that there
are no holes, gouges, tears, punctures, or openings of any kind that would expose either
the contents or an inner layer of a multilayer bag. If openings are found and the humidity
indicator card (HIC) indicates that the maximum humidity has been exceeded, then theparts should be baked using the bake times of Table 3 or Table 4. This resets the floor
life if the parts to be used and shelf life if the parts are to be dry-packed.

6Store conditions
Secure and clean store areas shall be provided to isolate and protect the products.
Conditions in the store areas shall be such that the quality of the products does notdeteriorate due to, among others, harmful gasses or electrical fields.
The following conditions have to be taken into account:• Temperature:– Min. +8 °C– Max. +45 °C• Humidity– Min. 25 %– Max 75 %– No condensation under any condition is allowed.
• Light intensity– No direct sunlight

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7

Transport conditions
In the case of transporting, the following conditions have to be observed.

7.1 General transport conditions
During transport the packing and the products should be protected against extreme
temperatures, humidity and mechanical forces.
The following conditions have to be taken into account:• Temperature:– Min. +8 °C– Max. +60 °C(Higher temperature causes a serious risk of deformation of the packing material andlower temperature the risk of condensation within the package).
– In tropical conditions, the packing shall not be placed in direct sunlight.
• Humidity:– Direct contact of packing boxes with water is prohibited.
• Mechanical forces:– Transport must be done in such a way that the PQ-boxes are not deformed andforces are not directly passed on to PQ-boxes.
• Time:– The total transport time should be as short as possible. When transport time exceeds
5 days the transport conditions shall be the same as store conditions, or the products
have to be sealed with inclusion of a dry-agent.

7.2 Conditioned air transport
Air transport is possible with conditioned cargo rooms. This conditional air transport isadvised for all products, but mandatory for air transport of products in sealed bags, likedry pack.
• Temperature:– Min. +8 °C– Max. +45 °C• Humidity:– Avg. 16 %• Air pressure:– Min. 700 mbar
– Max. 1060 mbar

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Store and transport requirements

8

Shelf life conditions
8.1 Packed end products
The shelf life for packed end products is 4 years after the date code. This includes
encapsulated products in standard packing, encapsulated products in dry pack.
For products in dry pack, the dry conditions are guaranteed for one year (this is not
shelf life, see above). When the HIC shows a relative humidity of higher than 10 %, theproducts have to be baked before use (see Section 10).

8.2 Wafers and bare die
Wafers and bare die have to be packed in dry pack, or stored under the following
conditions:• Inert gas• Dry air or dry nitrogen• No sources of corrosive material such as halogenic contamination• Temperature 18 °C to 24 °C
The shelf life for wafers or bare die is 3 years (excluding wafers with Au/Ge backside andassuming condition of <60 % relative humidity) after diffusion process end (Fab. datecode).
The shelf life for products on FFC (Film Frame Carrier) is 6 months due to the FFC
material.

8.2.1 Maximum shelf life versus humidity
Parts of bare wafers and bare die products that are sensitive for aging are aluminum andbackside metal surfaces (e.g. Ti, Ni, Ag or AuGe). Shelf life of wafers and bare die with a
combination of given bond and back side material at different humidity levels are given in
Table 1.
Table 1. Shelf life of wafers and bare die
The indicated humidity levels in the table should not be exceeded.

Relative humidity[1]

Bond pad material

Back side

Technical shelf life

< 10 %

all types

all types> 15 years< 30 %

all types

all types

6 years< 50 %

Al

all types (not AuGe)

4 years< 50 %

all types

AuGe

1 year< 60 %

Al

all types (not AuGe)

3 years< 60 %

AgAg

4 years< 60 %Au

AuAs> 15 years< 80 %

Al

all types

0.1 years

[1]
[2]

[2]

[2]

RH % should be monitored or evidence (humidity indicator card) should be available that RH % requirement was really met during the storage period.
The life time at such low humidity is limited only by the amount of desiccant added and the integrity of the MBB over time.

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Store and transport requirements
The shelf life time of bare wafer and bare die products is determined by the halogen(F, Cl, Br) contamination level in the product environment and the humidity which affectthe degradation of aluminum bond pads. At low humidity, the halogen contamination has
no aging effect, but at higher humidity, the halogens become volatile.
Humidity is the most important aging factor in the aging of wafers with backside metal.
Additionally, gold contamination on Ti/Ni/Ag backside metal surface accelerates theaging process.
Silver surfaces are very sensitive for sulphur contamination. MBB will be a barrier for
airborne sulphur contamination and therefore wafers packed in a sealed MBB are safe.

9

Floor life and bake to seal time
The floor life starts with opening the MBB. The floor life and the bake to seal time of IC
products are dependent on the MSL (see Table 2). If the bake to seal time is exceeded,
the products must be baked again.

Table 2. Moisture Classification Level, floor life, and bake to seal time

Moisture
Sensitivity Level(MSL)
1[1][2]

2

[3]

2a

[3]

4

[3]

5

[3]

6

Temperature

RH≤ 90 %

Bake to seal time

no limit

no limit

4 weeks
30 °C

7 days168 hours≤ 60 %

72 hours
48 hours[3]

24 hours

24 hours

[4]

[1]
[2]
[3]
[4]

Floor life
(out of bag time)

1 year[3]

3

5aAmbient conditions

6 hours

no limit

Products with MSL1 are not dry packed.
Wafers and bare die are rated as MSL 1. They do not require baking but require dry packing to avoid oxidation.
Products that are moisture sensitive (MSL 2 through MSL 6) shall be baked prior dry-packed.
Products of MSL 6 must be baked before use within 6 hours at the customer.

If partial lots are used, the remaining products must be resealed or placed in safe storage
within 1 hour of bag opening. If the bag opening time or the floor life has expired or an
excess moisture exposure happened, the products have to be backed prior dry-packing.
For information about storing in a dry atmosphere cabinet or a dry cabinet, see Ref. 4“IPC/JEDEC J-STD-033C”.

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Store and transport requirements

10 Dry-baking and drying
Before sealing product devices in MBBs, the products must be dry. This can be done by
dry-baking or drying.

10.1 Dry-baking
Dry-bake conditions are:• Bake temperature: +125 °C + 0 °C/ -5 °C• Bake time, see Table 3– Packages, not mentioned in this table, are baked 5 times the package thickness (inmm), see Table 4 and Ref. 4 “IPC/JEDEC J-STD-033C”– The x’s in a package name in Table 3 cover all versions except specificallymentioned versions
Table 3. Dry-bake time per package type
Bake temperature +125 °C + 0 °C/-5 °C.

Package familyDry-bake time in hours

SO

8

SSOP, HSOP, VSO

10

TSSOP, HTSSOP

5

HBCC

5

xxQFP packages

12

LQFP, HLQFP, TQFP, HTQFP

8

PLCC, HSSON

12
2

10

2

15

xxBGA packages, <40 x 40 mm
xxBGA packages, ≥40 x 40 mm
TFBGA, LBGA, LFBGA5

HVQFN, HVSON

5

SOJ

24

Remark: Baking deteriorates the solderability; do not bake for longer and not more often
than required.

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10.2 Drying
Products, packed in tubes or tapes cannot be baked at 125 ºC and therefore must be
dried at lower temperatures, see Ref. 4 “IPC/JEDEC J-STD-033C”.
Table 4. Reference conditions for drying mounted or unmounted SMD packages according to Ref. 4 “IPC/JEDEC J‑STD‑033C”

Packagebody

MSL

Bake at+125 ºC +10 ºC/-0 ºC+90 ºC +8 ºC/-0 ºC≤5 % RH+40 ºC +5 ºC/-0 ºC≤5 % RH

Exceeding floor life by
Thickness≤1.4 mmThickness>1.4 mm≤2.0 mmThickness>2.0 mm≤4.5 mm

BGA package>17 mm x
17 mm or any
stacked die
package

UM90001

User manual>72 hours≤72 hours>72 hours≤72 hours>72 hours≤72 hours

2

5 hours

3 hours

17 hours

11 hours

8 days

5 days2a

7 hours

5 hours

23 hours

23 hours

9 days7 days3

9 hours

7 hours

33 hours

33 hours

13 days

9 days4

11 hours

7 hours

37 hours

37 hours

15 days

9 days5

12 hours

7 hours

41 hours

41 hours

17 days

10 days5a

16 hours

10 hours

54 hours

54 hours

22 days

10 days2

18 hours

15 hours

63 hours

2 days25 days

20 days2a

21 hours

16 hours

3 days2 days29 days

22 days3

27 hours

17 hours

4 days2 days37 days

23 days4

34 hours

20 hours

5 days3 days47 days

28 days5

40 hours

25 hours

6 days4 days57 days

35 days

5a

2 days40 hours

8 days6 days79 days56 days2

2 days2 days10 days

7 days79 days

67 days2a

2 days2 days10 days

7 days79 days

67 days3

2 days2 days10 days

8 days79 days

67 days4

2 days2 days10 days

10 days

79 days

67 days5

2 days2 days10 days

10 days

79 days

67 days

5a

2 days2 days10 days

10 days

79 days

67 days

2 to 5a96 hours

as abovenot
per package applicable
thicknessand moisturelevel

as abovenot
per package applicable
thicknessand moisturelevel

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Store and transport requirements

11 Dry-packing
11.1 Material requirements
Moisture absorbing packing materials that are used in the MBB (e.g. the cardboard guardband for reels and the Humidity Indicator or HIC), shall be dry, before packing in the
moisture barrier bag. Moisture absorbing packing material should therefore be kept dry
in a drying box or an oven, with sufficient capacity to store (and dry) the required packing
material for at least 24 hours, before use.
Remark: Exposure of the desiccant, HIC and paper guard band to the environment shallbe for no more than 5 minutes, before packing and sealing the MBB.

11.1.1 Desiccant requirements• The desiccant must meet Ref. 5 “MIL-D-3464E”, Type II. The desiccant shall be
dustless, noncorrosive, and absorbent to the amounts specified in the standard.
• The desiccant capacity at 10 % RH and 25 °C per unit shall be ≥2.5 grams. The
desiccant capacity at 10 % RH and 25 °C per unit shall be provided by desiccant
supplier.
• If desiccant capacity is <2.5 grams, then desiccant amounts shown in Table 5 andTable 6 must be recalculated, see Ref. 4 “IPC/JEDEC J-STD-033C”.
• The desiccant type shall be bentonite clay.
• The desiccant bag shall be moisture permeable Tyvek.
• Desiccant is typically supplied in packs containing two units but this is not arequirement and different size desiccant packs can be used.
The desiccant shall be stored in closed containers as received. After taking out therequired quantity of desiccant, the container shall be closed immediately. A humidity
indicator with a 5 % RH measuring spot shall be used in the desiccant container tocheck the humidity. Once this spot is showing another color than is specified for “dry”,
the desiccant shall be reactivated (baked) first, in an oven according to suppliers
recommendation before using. Desiccants made of so-called Molecular Sieve, cannot bereactivated.

Table 5. Desiccant requirement for wafer pack

MBB size (cm)

Typical wafer size (mm)Total units of desiccant required

30

37

10

5

36

38

125

5

40

48.3

125;150

7

50.5

77.5

200

12

76

82

300

19

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Table 6. Desiccant requirement for finished products

MBB size (cm)Pack type

Total units of desiccant required

20.5

47.5

5 tray4

17

43

1 tray

4

22.5

30

reel, 180 x 12/16/24

4

38.1

45.7

reel, 330 x 12/16/24

6

40

48.3

reel, 330 x 32/44

6

9

61

SO-S tube

4

13.5

65

SO-L tube

4

20

67

PLCC tube

5

20

75

SMS tube

6

11

61

HSOP20 tube

4

11.1.2 Humidity Indicator Card (HIC) requirements• The HIC shall have three color spots with sensitivity values of 5 %, 10 % and 60 % RH.
• The HIC shall comply with Ref. 4 “IPC/JEDEC J-STD-033C” and be Cobalt freeversion.

11.1.3 Moisture Barrier Bag (MBB) requirements
The moisture barrier bag shall meet Ref. 6 “MIL-PRF-81705E (W/AMENDMENT 1)”,
Type I requirements for flexibility, ESD protection, mechanical strength, and puncture
resistance. The bags shall be heat sealable. The Water Vapor Transmission Rate
2
2
(WVTR) shall be ≤0.0310 g/m (0.002 g/100 in ) in 24 hours at 40 °C after flex testing
per condition ‘‘E’’ Ref. 1 “ASTM F392 / F392M-11”. The WVTR is measured using Ref. 2“ASTM F1249-13”.

11.1.4 Requirements for a material drying oven
• Temperature: +55 °C +0 °C / -5 °C.
3• A dry air inlet, producing 10 liters of dry air per minute per 1 m cabinet space. Dry air
can be obtained from e.g. the standard high pressure (>4 ATO) air supply, the use of adust and oil filter is obligatory.
• The heating system is in the bottom part of the oven. This results in an RH of 1/4th ofthe original RH from the air inlet, or 1/5th at Tamb = 20 °C.
2• Sufficient ventilation by openings in bottom and top, total 50 cm .
• Use a humidity indicator to check the RH in the cabinet.

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11.2 Dry-pack process requirements
In the dry-pack process, the carriers (trays, tubes, and reels) are placed in a qualified
moisture barrier bag, with desiccants and a humidity indicator (HIC). The bag is preprinted (if not: labeled) with a moisture caution label and the packing (PQ) box is
identified (pre-printed) with a moisture warning sticker/printed logo.
Remark: The Moisture Barrier Bag must not be folded or creased. Do not use any MBB
that has been creased or crumpled.
Remark: When, at repacking, a new bag and new desiccant is packed, the Bag Seal
Date line on the moisture caution label must be filled in.

11.3 Sealing requirements• Seal the MBB using “light vacuum” to reduce packing bulk, refer to Ref. 4 “IPC/JEDEC
J-STD-033C”. The sealing condition should be adjusted for proper sealing quality,
based on visual inspection.
– The minimum vacuum condition is when the MBB is pulled closely around the wafer
box, trays, tubes, or reels with no air pockets between that MBB and the wafer box,
trays, tubes, or reels.
– The vacuum condition is too severe if the MBB is damaged or the wafer box, tubes,
or reels are deformed.
– For Wafer packs, the vacuum condition is too severe if the wafers show increased
breakage rates during handling.
• The sealed packs need a consistent and uniform appearance.
• Wafer packs should have the excess MBB folded and taped around the wafer box.
• The bag shall be sealed at 7 mm to 10 mm from the open edge to allow an additional
3 seal operation of this bag.
• Use heat sealing conditions recommend by MBB supplier.
• Establish and routinely run seal quality monitor on the MBB seal operation.
• To enable a visual check on the presence of a HIC, the HIC can be placed on top of thedesiccant bag that in turn is placed on top of the wafer box.
• For partial packing in tape and reel, recommend inserting the additional guard bandat the outer layer nearby the edge of reel (especially for lightweight reel) before dry
packing to minimize the possibility of reel flank bent.

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12 References
1. ASTM F392 / F392M-11 — Standard Practice for Conditioning Flexible Barrier
Materials for Flex Durability
2. ASTM F1249-13 — Standard Test Method for Water Vapor Transmission Rate
Through Plastic Film and Sheeting Using a Modulated Infrared Sensor
3. IPC/JEDEC J-STD-020 — Moisture/Reflow sensitivity classification for Non hermetic
solid state Surface Mount Devices
4. IPC/JEDEC J-STD-033C — Handling, Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices
5. MIL-D-3464E — MILITARY SPECIFICATION: DESICCANTS, ACTIVATED,BAGGED, PACKAGING USE AND STATIC DEHUMIDIFICATION
6. MIL-PRF-81705E (W/AMENDMENT 1) — PERFORMANCE SPECIFICATION:BARRIER MATERIALS, FLEXIBLE, ELECTROSTATIC PROTECTIVE, HEATSEALABLE
7. Terms and conditions of commercial sale — http://www.nexperia.com/about/termsand-policies/terms-and-conditions.html

13 Revision history
Table 7. Revision history

Revision number

Date

Description

1.0

2018-04-05

initial version; based on NXP document
UM10569

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14 Legal information
14.1 Definitions
Draft — The document is a draft version only. The content is still underinternal review and subject to formal approval, which may result in
modifications or additions. Nexperia does not give any representations or
warranties as to the accuracy or completeness of information included hereinand shall have no liability for the consequences of use of such information.

14.2 Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, Nexperia does not give any
representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for theconsequences of use of such information. Nexperia takes no responsibility
for the content in this document if provided by an information source outsideof Nexperia. In no event shall Nexperia be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removalor replacement of any products or rework charges) whether or not suchdamages are based on tort (including negligence), warranty, breach ofcontract or any other legal theory. Notwithstanding any damages that
customer might incur for any reason whatsoever, Nexperia's aggregate andcumulative liability towards customer for the products described herein shallbe limited in accordance with the Terms and conditions of commercial sale of
Nexperia.
Right to make changes — Nexperia reserves the right to make changes
to information published in this document, including without limitation
specifications and product descriptions, at any time and without notice. This
document supersedes and replaces all information supplied prior to the
publication hereof.
Suitability for use — Nexperia products are not designed, authorized or
warranted to be suitable for use in life support, life-critical or safety-criticalsystems or equipment, nor in applications where failure or malfunctionof an Nexperia product can reasonably be expected to result in personal
injury, death or severe property or environmental damage. Nexperia and its
suppliers accept no liability for inclusion and/or use of Nexperia products insuch equipment or applications and therefore such inclusion and/or use is at
the customer’s own risk.
Applications — Applications that are described herein for any of theseproducts are for illustrative purposes only. Nexperia makes no representation
or warranty that such applications will be suitable for the specified use
without further testing or modification. Customers are responsible for thedesign and operation of their applications and products using Nexperia
products, and Nexperia accepts no liability for any assistance withapplications or customer product design. It is customer’s sole responsibility
to determine whether the Nexperia product is suitable and fit for thecustomer’s applications and products planned, as well as for the planned
application and use of customer’s third party customer(s). Customers should
provide appropriate design and operating safeguards to minimize the risks
associated with their applications and products. Nexperia does not accept
any liability related to any default, damage, costs or problem which is basedon any weakness or default in the customer’s applications or products, or

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the application or use by customer’s third party customer(s). Customer is
responsible for doing all necessary testing for the customer’s applications
and products using Nexperia products in order to avoid a default of theapplications and the products or of the application or use by customer’s third
party customer(s). Nexperia does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above thosegiven in the Recommended operating conditions section (if present) or theCharacteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — Nexperia products are
sold subject to the general terms and conditions of commercial sale, as
published at http://www.nexperia.com/profile/terms, unless otherwise agreed
in a valid written individual agreement. In case an individual agreement isconcluded only the terms and conditions of the respective agreement shallapply. Nexperia hereby expressly objects to applying the customer’s generalterms and conditions with regard to the purchase of Nexperia products bycustomer.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or
the grant, conveyance or implication of any license under any copyrights,
patents or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a priorauthorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific Nexperia product is automotive qualified, theproduct is not suitable for automotive use. It is neither qualified nor tested inaccordance with automotive testing or application requirements. Nexperia
accepts no liability for inclusion and/or use of non-automotive qualified
products in automotive equipment or applications. In the event that customer
uses the product for design-in and use in automotive applications toautomotive specifications and standards, customer (a) shall use the productwithout Nexperia's warranty of the product for such automotive applications,use and specifications, and (b) whenever customer uses the product for
automotive applications beyond Nexperia's specifications such use shall besolely at customer’s own risk, and (c) customer fully indemnifies Nexperia
for any liability, damages or failed product claims resulting from customer
design and use of the product for automotive applications beyond Nexperia's
standard warranty and Nexperia's product specifications.
Translations — A non-English (translated) version of a document is forreference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.

14.3 Trademarks
Notice: All referenced brands, product names, service names andtrademarks are the property of their respective owners.

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TablesTab. 1.
Tab. 2.
Tab. 3.

Shelf life of wafers and bare die ....................... 5
Moisture Classification Level, floor life, andbake to seal time .............................................. 6
Dry-bake time per package type ....................... 7

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Tab. 4.
Tab. 5.
Tab. 6.
Tab. 7.

Reference conditions for drying mounted
or unmounted SMD packages according toRef. 4 “IPC/JEDEC J‑STD‑033C” ......................8
Desiccant requirement for wafer pack ...............9
Desiccant requirement for finished products ....10
Revision history ...............................................12

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Contents
1
2
3
4
5
6
7
7.1
7.2
8
8.1
8.2
8.2.1
9
10
10.1
10.2
11
11.1
11.1.111.1.2
11.1.311.1.4
11.2
11.3
12
13
14

Introduction ......................................................... 2
Objectives ............................................................ 2
Definitions ............................................................2
General conditions ..............................................2
Receiving inspection .......................................... 3
Store conditions ..................................................3Transport conditions .......................................... 4
General transport conditions ............................. 4
Conditioned air transport ................................... 4
Shelf life conditions ............................................5
Packed end products .........................................5
Wafers and bare die ..........................................5
Maximum shelf life versus humidity ................... 5
Floor life and bake to seal time ......................... 6
Dry-baking and drying ........................................7
Dry-baking ..........................................................7
Drying .................................................................8
Dry-packing ..........................................................9
Material requirements ........................................ 9
Desiccant requirements ..................................... 9
Humidity Indicator Card (HIC) requirements .... 10
Moisture Barrier Bag (MBB) requirements ....... 10
Requirements for a material drying oven ......... 10
Dry-pack process requirements .......................11
Sealing requirements .......................................11
References ......................................................... 12
Revision history ................................................ 12
Legal information .............................................. 13

Please be aware that important notices concerning this document and the product(s)described herein, have been included in section 'Legal information'.

© Nexperia B.V. 2018.

All rights reserved.

For more information, please visit: http://www.nexperia.com
For sales office addresses, please send an email to: salesaddresses@nexperia.com
Date of release: 5 March 2018
Document identifier: UM90001