MCP9600
Thermocouple EMF to Temperature Converter,±1.5 °C Maximum Accuracy
Features

Description• Thermocouple Electromotive Force (EMF) to °C
Converter- Integrated Cold-Junction Compensation• Supported Types (designated by NIST ITS-90):- Type K, J, T, N, S, E, B and R• ±1.5°C (Max.) Hot-Junction Accuracy• Measurement Resolution:- Hot- and Cold-Junctions: 0.0625°C (typical)• Four Programmable Temperature Alert Outputs- Monitor Hot- or Cold-Junction Temperatures- Detect Rising or Falling Temperatures- Up to 255°C of Programmable Hysteresis• Programmable Digital Filter for Temperature• Low Power:- Shutdown Mode
- Burst Mode: 1 to 128 Temperature Samples• 2-Wire Interface: I2C Compatible, 100 kHz- Supports Eight Devices per I2C bus• Operating Voltage Range: 2.7V to 5.5V
• Operating Current: 300 µA (typical)• Shutdown Current: 2 µA (typical)• Package: 20-lead MQFN

Microchip Technology Inc.’s MCP9600 converts
thermocouple EMF to degree Celsius with integrated
Cold-Junction compensation. This device corrects thethermocouple nonlinear error characteristics of eight
thermocouple types and outputs ±1.5°C accurate
temperature data for the selected thermocouple. The
correction coefficients are derived from the National
Institute of Standards and Technology (NIST) ITS-90
Thermocouple Database.

Typical Applications

This sensor uses an industry standard 2-Wire, I2C
compatible serial interface and supports up to eightdevices per bus by setting the device address using the
ADDR pin.

VINTypes K, J, T,
N, E, B, S, R

ADDR

GND

SCL

GND

14 Alert 3

EP
21

13 GND

VIN- 412 Alert 2

GND 5

11 Alert 1
6

7

8

9 10
GND

GND

VIN+ 2
GND 3

GND

ADDR

TC-

15 Alert 4

VDD

MCP9600

TC+

GND 1

GND

VIN+

4
Alert

MCP9600
5x5 MQFN*

20 19 18 17 16

VDD
I2C

Package TypeGND

PIC® MCU

The temperature alert limits have multiple user
programmable configurations such as alert polarity as
either an active-low or active-high push-pull output, andoutput function as comparator mode (useful forthermostat-type operation) or interrupt mode formicroprocessor-based systems. In addition, the alerts
can detect either a rising or a falling temperature withup to 255°C hysteresis.

SDA• Petrochemical Thermal Management• Hand-Held Measurement Equipment• Industrial Equipment Thermal Management• Ovens• Industrial Engine Thermal Monitor• Temperature Detection Racks

The MCP9600 digital temperature sensor comes withuser-programmable registers which provide design
flexibility for various temperature sensing applications.
The registers allow user-selectable settings such as
Low-Power modes for battery-powered applications,adjustable digital filter for fast transient temperaturesand four individually programmable temperature alert
outputs which can be used to detect multiple
temperature zones.

* Includes Exposed Thermal Pad (EP); see Table 3-1.

 2015-2016 Microchip Technology Inc.

DS20005426B-page 1

MCP9600
MCP9600 Registers

MCP9600 Evaluation Board (ADM00665)

MCP9600

DS20005426B-page 2

 2015-2016 Microchip Technology Inc.

MCP9600
1.0

ELECTRICAL
CHARACTERISTICS

Absolute Maximum Ratings †VDD............................................................................................................................................................................ 6.0V
Voltage at all Input/Output Pins......................................................................................................... GND – 0.3V to 6.0V
Storage Temperature ..............................................................................................................................-65°C to +150°C
Ambient Temperature with Power Applied ..............................................................................................-40°C to +125°C
Junction Temperature (TJ) .................................................................................................................................... +150°C
ESD Protection on all Pins (HBM:MM)........................................................................................................... (4 kV:300V)
Latch-up Current at each Pin ............................................................................................................................. ±100 mA† Notice: Stresses above those listed under “Maximum ratings” may cause permanent damage to the device. This isa stress rating only and functional operation of the device at those or any other conditions above those indicated in
the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods
may affect device reliability.

DC CHARACTERISTICSElectrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, TA = -40°C to +125°C(where: TA = TC, defined as Device Ambient Temperature).
Parameters

Sym.

Min.

Typ.

Max.

Unit

Conditions

-1.5

±0.5

+1.5

°C

TA = 0°C to +85°C,

-3.0

±1

+3.0

°C

TA = -40°C to +125°C

Thermocouple Sensor Measurement Accuracy
TH Hot-Junction Accuracy (VDD = 3.3V)

TH_ACY

TH = TC + T∆
TC Cold-Junction Accuracy (VDD = 3.3V)

TC_ACY

-1.0

±0.5

+1.0

°C

TA = 0°C to +85°C

-2.0

±1

+2.0

°C

TA = -40°C to +125°C

-0.5

±0.25

+0.5

°C

TA = 0°C to +85°C,
VDD = 3.3V (Note 1)

T∆ Junctions Temperature Delta Accuracy
Type K: T∆ = -200°C to +1372°C
VEMF range: -5.907 mV to 54.886 mV

T∆_ACYType J: T∆ = -150°C to +1200°C
VEMF range: -3.336 mV to 47.476 mV
Type T: T∆ = -200°C to +400°C
VEMF range: -5.603 mV to 20.81 mV
Type N: T∆ = -150°C to +1300°C
VEMF range: -3.336 mV to 47.476 mV
Type E: T∆ = -200°C to +1000°C
VEMF range: -8.825 mV to 76.298 mVType S: T∆ = 250°C to +1664°C
VEMF range: -1.875 mV to 17.529 mV

TA = 0°C to +85°C,
VDD = 3.3V (Note 1, 2)

Type B: T∆ = 1000°C to +1800°C
VEMF range: -4.834 mV to 13.591 mV
Type R: T∆ = 250°C to +1664°C
VEMF range: -1.923 mV to 19.732 mV
Note 1:

2:

3:

The T_ACY temperature accuracy specification is defined as the device accuracy to the NIST ITS-90
Thermocouple EMF to Degree Celsius conversion Database. T is also defined as the temperature difference
between the Hot and Cold Junctions or temperatures from the NIST ITS-90 database.
The device measures temperature below the specified range, however the sensitivity to changes in temperature
reduces exponentially. Type R and S measure down to -50°C, or -0.226mVEMF and -0.235mVEMF, respectively.
Type B measures down to 500°C or 1.242mVEMF (see Figures 2-7, 2-8, 2-14 and Figures 2-10, 2-11 and 2-17).
Exceeding the VIN_CM input range may cause leakage current through the ESD protection diodes at thethermocouple input pins. This parameter is characterized but not production tested.

 2015-2016 Microchip Technology Inc.

DS20005426B-page 3

MCP9600
DC CHARACTERISTICSElectrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, TA = -40°C to +125°C(where: TA = TC, defined as Device Ambient Temperature).
Parameters

Sym.

Min.

Typ.

Max.

Unit

Conditions

TC and TH Temperature Resolution

TRES

—

±0.0625

Sampling Rate (TA = +25°C)

tCONV

—

320

—

°C

With max. Resolution—

ms

18-bit Resolution

—
—

80

—

ms

16-bit Resolution

20

—

ms

14-bit Resolution

Sensor Characteristics

Temperature Calculation Time

—

5

—

ms

12-bit Resolution

tCALC

—

12

—

ms

TA = +25°C

VOERR

—

±2

—

µV

VOERR_DRF

—

50

—

nV/°C

GERR

—

—

±0.04

GERR_DRF

—

±0.01

—

%FS

Thermocouple Input
Offset Error
Offset Error Drift
Full-Scale Gain Error
Full-Scale Gain Error Drift%FS TA = 0°C to +85°C

Full-Scale Integral Nonlinearity

INL

—

10

—

ppm

Voltage Resolution

VRES

—

2

—

µV

18-bit Resolution

Differential Mode Range

VIN_DF

-250

—

+250

mV

ADC input range

300

—

k

Differential Mode Impedance

ZIN_DF—

Common-Mode Range

VIN_CM

VDD-0.3—

VDD+0.3

V

Common-Mode Impedance

ZIN_CM

—

25

—

M

Common-Mode Rejection Ratio

CMRR

—

105

—

dB

Power Supply Rejection Ratio

PSRR

—

60

—

dB

Line Regulation

VLine_R

—

0.2

—

°C/V

Low-Level Voltage

VOL

—

—

0.4

V

IOL= 3 mA

High-Level Voltage

VOH

VDD-0.5——

V

IOH= 3 mA

Operating Voltage

VDD

2.7

—

5.5

V

I2C Inactive Current

IDD

—

0.3

0.5

mA

—

1.5

2.5

mA

(Note 3)

Alert 1, 2, 3, 4 Outputs

Operating Voltage and Current

I2C Active Current or during tCALCVDD=3.3V, TA = 85°C

Shutdown Current

ISHDN

—

2

5

µA

I2C Inactive

Power On Reset (POR) Thresholds

VPOR

1.0

2.1

2.6

V

Rising/Falling VDD

tRSP

—

3

—

s

Time to 63%, +25°C(Air) to +125°C (oilbath), 2x2 inch PCB

Thermal Response
5x5 mm MQFN Package (Cold-Junction)

Note 1:

2:

3:

The T_ACY temperature accuracy specification is defined as the device accuracy to the NIST ITS-90
Thermocouple EMF to Degree Celsius conversion Database. T is also defined as the temperature difference
between the Hot and Cold Junctions or temperatures from the NIST ITS-90 database.
The device measures temperature below the specified range, however the sensitivity to changes in temperature
reduces exponentially. Type R and S measure down to -50°C, or -0.226mVEMF and -0.235mVEMF, respectively.
Type B measures down to 500°C or 1.242mVEMF (see Figures 2-7, 2-8, 2-14 and Figures 2-10, 2-11 and 2-17).
Exceeding the VIN_CM input range may cause leakage current through the ESD protection diodes at thethermocouple input pins. This parameter is characterized but not production tested.

DS20005426B-page 4

 2015-2016 Microchip Technology Inc.

MCP9600
INPUT/OUTPUT PIN DC CHARACTERISTICSElectrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, TA = -40°C to +125°C(where: TA = TC, defined as Device Ambient Temperature).
Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

2

Serial Input/Output and I C Slave Address Input (ADDR)
Input (SCL, SDA)
High-Level Voltage

VIH

0.7VDD——V

Low-Level Voltage

VIL

—

—

0.3VDDV

Input Current

ILEAK

—

—

±2

µA

Low-Level Voltage

VOL

—

—

0.4

V

IOL= 3 mA

High-Level Current (leakage)

IOH

—

—

1

µA

VOH = VDD

Low-Level Current

IOL

6

—

—

mA

VOL = 0.6V

CIN

—

5

—

pF
V

Output (SDA)

CapacitanceI2C Slave Address Selection Levels (Note 1)
Command Byte <1100 000x>

VADDR

Command Byte <1100 001x>
Command Byte <1100 010x>

GND

—

—

VADDR_L(Note 2)VADDR_TYP(Note 2)VADDR_H(Note 2)

Address = 0
Address = 1
Address = 2

Command Byte <1100 011x>

Address = 3

Command Byte <1100 100x>

Address = 4

Command Byte <1100 101x>

Address = 5

Command Byte <1100 110x>

Address = 6

Command Byte <1100 111x>

Address = 7

—

—

VDD

VHYST

—

0.05VDD

—

V

TSP

—

50

—

ns

SDA and SCLK Inputs
Hysteresis
Spike Suppression
Note 1:

2:

VDD > 2VThe ADDR pin can be tied to VDD or VSS. For additional slave addresses, resistive divider network can beused to set voltage levels that are rationed to VDD. The device supports up to 8 levels (see Section 6.3.1“I2C Addressing” for recommended resistor values).
VADDR_TYP = Address*VDD/8 + VDD/16,
VADDR_L = VADDR_TYP - VDD/32, and
VADDR_H = VADDR_TYP + VDD/32 (where: Address = 1, 2, 3, 4, 5, 6).

TEMPERATURE CHARACTERISTICSElectrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground.
Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges
Specified Temperature Range

TA

-40

—

+125

°C

Operating Temperature Range

TA

-40

—

+125

°C

Storage Temperature Range

TA

-65

—

+150

°C

JA

—

38.8

—

°C/W

Note 1

Thermal Package Resistances
Thermal Resistance, MQFN
Note 1:

Operation in this range must not cause TJ to exceed the Maximum Junction Temperature (+150°C).

 2015-2016 Microchip Technology Inc.

DS20005426B-page 5

MCP9600
SENSOR SERIAL INTERFACE TIMING SPECIFICATIONSElectrical Specifications: Unless otherwise indicated, GND = Ground, TA = -40°C to +125°C, VDD = 2.7V to 5.5V
and CL = 80 pF (Note 1).
Parameters

Sym.

Min.

Max.

Units

fSCL

10

100

kHz

Low Clock (Note 2)

tLOW

4700

—

ns

High Clock

tHIGH

4000

—

ns

2-Wire I2

C Interface

Serial Port Frequency

Rise Time (Note 3)

tR

—

1000

ns

Fall Time (Note 3)

tF

20

300

ns

Data in Setup Time (Note 2)

tSU:DAT

250

—

ns

Data in Hold TimetHD:DAT0—ns

Start Condition Setup TimetSU:STA

4700

—

ns

Start Condition Hold TimetHD:STA

4000

—

ns

Stop Condition Setup TimetSU:STO

4000

—

ns

Bus Idle/FreetB-FREE

10

—

µs

Cb

—

400

pf

tSTRETCH

60

—

µs

Bus Capacitive Load
Clock Stretching

EE

P
TO

-F
R

U
-S

tB

tS

tL

O

H
IG

tH

W

H
C
TR
ET

I
-D
D

tH

tS

U

-D

AT
A

tR

,t

F

SD
A

SC

L

tS

tH

tS

U

-S
TA
R
T
D
-S
TA
R
T

3:

All values referred to VIL MAX and VIH MIN levels.
This device can be used in a Standard-mode I2C-bus system, but the requirement tSU:DAT  250 ns must
be met.
Characterized, but not production tested.

AC
K

Note 1:
2:

Start Condition

FIGURE 1-1:

DS20005426B-page 6

Data Transmission

Stop Condition

Timing Diagram.

 2015-2016 Microchip Technology Inc.

MCP9600
2.0

TYPICAL PERFORMANCE CURVESNote:

The graphs and tables provided following this note are a statistical summary based on a limited number ofsamples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

Note: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, SDA/SCL pulled-up to VDD and
TA = -40°C to +125°C.
0.500

Type K

Type K

Sensitivity (Δ°C/LSb)0.50

Tǻ_ACY (°C)

0.25

0.00

-0.25

-0.50
-200

300
800
1300
Tǻ Temperature, ITS-90 Database (°C)

Sensitivity (Δ°C/LSb)

Type J

0.25

0.00

-0.25

-0.50
-200

300
800
1300
Tǻ Temperature, ITS-90 Database (°C)

1800

FIGURE 2-2:
Typical Temperature
Accuracy from NIST ITS-90 Database, Type J.

300
800
1300
Tǻ Temperature, ITS-90 Database (°C)

1800

FIGURE 2-4:
Temperature Sensitivity with
18-Bit Resolution, Type K.
0.500

0.50

Tǻ_ACY (°C)

0.000
-200

1800

FIGURE 2-1:
Typical Temperature
Accuracy from NIST ITS-90 Database, Type K.

0.250

Type J

0.250

0.000
-200

300
800
1300
Tǻ Temperature, ITS-90 Database (°C)

1800

FIGURE 2-5:
Temperature Sensitivity with
18-Bit Resolution, Type J.
0.500

0.50

Type N

Sensitivity (Δ°C/LSb)

Type N

Tǻ_ACY (°C)

0.25

0.00

-0.25

-0.50
-200

300
800
1300
Tǻ Temperature, ITS-90 Database (°C)

1800

FIGURE 2-3:
Typical Temperature
Accuracy from NIST ITS-90 Database, Type N.

 2015-2016 Microchip Technology Inc.

0.250

0.000
-200

300
800
1300
1800
Tǻ Temperature, ITS-90 Database (°C)

FIGURE 2-6:
Temperature Sensitivity with
18-Bit Resolution, Type N.

DS20005426B-page 7

MCP9600
Note: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, SDA/SCL pulled-up to VDD and
TA = -40°C to +125°C.
0.500

0.50
Sensitivity (Δ°C/LSb)

Type S

0.25
Tǻ_ACY (°C)

Specified Range

0.00

-0.25

Specified Range

0.250

Type S

-0.50
-200

300
800
1300
Tǻ Temperature, ITS-90 Database (°C)

1800

FIGURE 2-7:
Typical Temperature
Accuracy from NIST ITS-90 Database, Type S.

1800

0.500

Type R

Specified Range

Tǻ_ACY (°C)

0.25

300
800
1300
Tǻ Temperature, ITS-90 Database (°C)

FIGURE 2-10:
Temperature Sensitivity with
18-Bit Resolution, Type S.

Sensitivity (Δ°C/LSb)

0.50

0.000
-200

0.00

-0.25

Specified Range

0.250

Type R

-0.50
-200

300
800
1300
Tǻ Temperature, ITS-90 Database (°C)

1800

FIGURE 2-8:
Typical Temperature
Accuracy from NIST ITS-90 Database, Type R.

Type E

Tǻ_ACY (°C)

0.25

0.00

-0.25

300
800
1300
Tǻ Temperature, ITS-90 Database (°C)

1800

FIGURE 2-9:
Typical Temperature
Accuracy from NIST ITS-90 Database, Type E.

DS20005426B-page 8

1800

0.500

Type E

-0.50
-200

300
800
1300
Tǻ Temperature, ITS-90 Database (°C)

FIGURE 2-11:
Temperature Sensitivity with
18-Bit Resolution, Type R.

Sensitivity (Δ°C/LSb)

0.50

0.000
-200

0.250

0.000
-200

300
800
1300
Tǻ Temperature, ITS-90 Database (°C)

1800

FIGURE 2-12:
Temperature Sensitivity with
18-Bit Resolution, Type E.

 2015-2016 Microchip Technology Inc.

MCP9600
Note: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, SDA/SCL pulled-up to VDD and
TA = -40°C to +125°C.
0.50

0.500
Sensitivity (Δ°C/LSb)

Type T

Tǻ_ACY (°C)

0.25

0.00

-0.25

-0.50
-200

300
800
1300
Tǻ Temperature, ITS-90 Database (°C)

0.250

0.000
-200

1800

FIGURE 2-13:
Typical Temperature
Accuracy from NIST ITS-90 Database, Type T.

1800

0.500

Type B
Sensitivity (Δ°C/LSb)

Type B

0.25
Specified Range

Tǻ_ACY (°C)

300
800
1300
Tǻ Temperature, ITS-90 Database (°C)

FIGURE 2-16:
Temperature Sensitivity with
18-Bit Resolution, Type T.

0.50

0.00

-0.25

-0.50
-200

300
800
1300
Tǻ Temperature, ITS-90 Database (°C)

Specified Range

0.250

0.000
-200

1800

FIGURE 2-14:
Typical Temperature
Accuracy from NIST ITS-90 Database, Type B.

300
800
1300
Tǻ Temperature, ITS-90 Database (°C)

1800

FIGURE 2-17:
Temperature Sensitivity with
18-Bit Resolution, Type B.

10

0.4
Gain Error (% of FSR)

Offset Error (µV)

Type T

50-5

VDD = 3.3V

0.3
0.2
0.1
0
-0.1
-0.2
-0.3

-10

-0.4
-40

-20

FIGURE 2-15:(VIN+, VIN-).

0

20
40
60
Temperature (°C)

80

100

120

Input Offset Error Voltage

 2015-2016 Microchip Technology Inc.

-40

-20

FIGURE 2-18:

0

20
40
60
Temperature (°C)

80

100

120

Full-Scale Gain Error.

DS20005426B-page 9

MCP9600
Note: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, SDA/SCL pulled-up to VDD and
TA = -40°C to +125°C.
0.005
Integral Nonlinearity (% of FSR)

10.0
TA = +25°C

5.0

2.5

0.0
-100

-75

-50 -2502550Input Voltage (% of Full-Scale)

75

0.003
0.002
0.001
0.000

100

Input Noise, % of Full-Scale.

FIGURE 2-19:

0.004

2.5

40%
VDD = 3.3V
722 units at -40°C, +45°C, +125°C
64 units at other temperatures

4.5

5.0

5.5

TA = -40°C to +125°C
VDD = 3.3V
2787 units

30%
Occurrences

1.0
Spec Limit

0.0
3.3V
Average

-1.0

20%

10%

+Std.
Dev.
Stdev+

Stdev-Std.
Dev.

FIGURE 2-20:
Cold-Junction Sensor
Temperature Accuracy.
400

300

1.0

0.8

0.6

0.4

0.2

0.0

Temperature Accuracy (°C)

FIGURE 2-23:
Cold-Junction Sensor
Temperature Accuracy Distribution.

T-40C
A = -40°C
35C
TA = +35°C
85C
TA = +85°C
125C
TA = +125°C

SDA, and Alert 1, 2, 3, 4 outputs

-0.2

-1.0

-20
0
20
40
60
80 100 120
Tǻ Temperature, ITS-90 Database (°C)

200

500

T-40C
A = -40°C
35C
TA = +35°C
85C
TA = +85°C
125C
TA = +125°C

Alert 1, 2, 3, 4 outputs

400
VDD - VOH (µA)

-40

-0.4

0%

-2.0

-0.6

Tǻ_ACY (°C)

3.5
4.0
VDD (V)

Integral Nonlinearity across

FIGURE 2-22:
VDD.

2.0

VOL (µA)

3.0

-0.8

Noise (µV, rms)

7.5

300

200

100

100

0
2.5

3.0

FIGURE 2-21:
across VDD.

DS20005426B-page 10

3.5

4.0
VDD (V)

4.5

5.0

5.5

SDA and Alert Outputs, VOL

2.5

3.0

FIGURE 2-24:
VDD.

3.5
4.0
VDD (V)

4.5

5.0

5.5

Alert Outputs, VOH across 2015-2016 Microchip Technology Inc.

MCP9600
Note: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, SDA/SCL pulled-up to VDD and
TA = -40°C to +125°C.
500

2.0

400

85C
TA = +85°C

300
TA = -40°C-40C
35C
TA = +35°C
85C
TA = + 85°C
125C
TA = +125°C

200

2.5

3.0

3.5

4.0
VDD (V)

4.5

5.0

0.0
2.5

5.5

I2C Inactive IDD across VDD.

FIGURE 2-25:-40C
TA = -40°C
35C
TA = +35°C
85C
TA = + 85°C
125C
TA = +125°C

1500

1000

3.5

4.0
VDD (V)

4.5

5.0

5.5

T-40C
A = -40°C
TA = +35°C
35C
85C
TA = +85°C
125C
TA = +125°C

40.0
tSTRETCH (µs)

2000

3.0

FIGURE 2-28:
SDA, SCL and ADDR Input
Pins Leakage Current, ILEAK across VDD.
60.0

2500

I2C Active, IDD (µA)

TA = +125°C
125C

1.0

100

20.0

0.0

500
2.5

3.0

FIGURE 2-26:

5.0

3.5
4.0
VDD (V)

4.5

5.0

2.5

5.5

I2C Active IDD across VDD.

2.0%

ΔtCALC (%)

1.0%

3.0
2.0

3.0

3.5
4.0
VDD (V)

4.5

5.5

Conditions:tCALC = 12 ms (typical)
VDD = 3.3V
TA = Room Temperature

0.0%
-40C
TA = -40°C
35C
TA = +35°C
85C
TA = + 85°C
125C
TA = +125°C

-1.0%

1.0

5.0

FIGURE 2-29:
I2C Interface Clock Stretch
Duration, tSTRETCH across VDD.

-40C
TA = -40°C
35C
TA = +35°C
85C
TA = + 85°C
125C
TA = +125°C

4.0
ISHDN (µA)

T-40C
A = -40°C
35C
TA = +35°C

ILEAK (µA)

I2C Inactive, IDD (µA)

ADDR/SDA/SCL pins

-2.0%

0.0
2.5

3.0

FIGURE 2-27:
across VDD.

3.5

4.0
VDD (V)

4.5

5.0

5.5

Shutdown Current, ISHDN 2015-2016 Microchip Technology Inc.

2.5

3.0

3.5
4.0
VDD (V)

4.5

5.0

5.5

FIGURE 2-30:
Temperature Calculation
Duration, tCALC change across VDD.

DS20005426B-page 11

MCP9600
NOTES:

DS20005426B-page 12

 2015-2016 Microchip Technology Inc.

MCP9600
3.0

PIN DESCRIPTION

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1:

3.1

PIN FUNCTION TABLE

5x5 MQFN

SymbolPin Function

1, 3, 5,13, 17

GND

Electrical ground

2

VIN+

Thermocouple Positive Terminal input

4

VIN-

Thermocouple Negative Terminal input

6, 7, 9, 10, 18

GND

Not electrical ground; must be tied to ground

8

VDD

Power

11

Alert 1

Alert Output 1

12

Alert 2

Alert Output 2

14

Alert 3

Alert Output 3

15

Alert 4

Alert Output 4

16

ADDR

I2C Save Address selection voltage input

19

SCL

I2C Clock Input

20

SDA

I2C Data Input

21

EP

Exposed Thermal Pad (EP); must be connected to GND

Ground Pin (GND)

3.6

Serial Clock Line (SCL)The GND pin is the system ground pin. Pins 1, 3, 5, 13
and 17 are system ground pins and they are at thesame potential. However, pins 6, 7, 9, 10 and 18 must
be connected to ground for normal operation.

The SCL is a clock input pin. All communication andtiming is relative to the signal on this pin. The clock isgenerated by the host or master controller on the bus(see Section 4.0 “Serial Communication”).

3.2

3.7

Thermocouple Input (VIN+, VIN-)

The thermocouple wires are directly connected tothese inputs. The positive node is connected to the
VIN+ pin while the negative node connects to the VINnode. The thermocouple voltage is converted to degree
Celsius.

3.3

Serial Data Line (SDA)

SDA is a bidirectional input/output pin used to seriallytransmit data to/from the host controller. This pin
requires a pull-up resistor (see Section 4.0 “Serial
Communication”).

Power Pin (VDD)

VDD is the power pin. The operating voltage range, as
specified in the DC Electrical Specification table, isapplied on this pin.

3.4

Push-Pull Alert Outputs(Alert 1, 2, 3, 4)

The MCP9600’s Alert pins are user-programmablepush-pull outputs which can be used to detect rising or
falling temperatures. The device outputs signals whentheambient
temperature
exceeds
theuser-programmed temperature alert limit.

3.5

I2C Slave Address Pin (ADDR)This pin is used to set the I2C slave address. This pin
can be tied to VDD, GND, or a ratio of VDD can beselected to set up to eight address levels using a
resistive voltage divider network.

 2015-2016 Microchip Technology Inc.

DS20005426B-page 13

MCP9600
NOTES:

DS20005426B-page 14

 2015-2016 Microchip Technology Inc.

MCP9600
4.0

SERIAL COMMUNICATION

4.1

2-Wire Standard Mode I2C
Protocol-Compatible Interface

The MCP9600’s serial clock input (SCL) and thebidirectional serial data line (SDA) form a 2-Wirebidirectional data communication line (refer to the
Input/Output Pin DC Characteristics table and Sensor
Serial Interface Timing Specifications table).
The following bus protocol has been defined:

TABLE 4-1:

MCP9600 SERIAL BUS
PROTOCOL DESCRIPTIONS

Term

Description

Master

The device that controls the serial bus,
typically a microcontroller

Slave

The device addressed by the master,such as the MCP9600

Transmitter Device sending data to the bus
ReceiverDevice receiving data from the bus

START

A unique signal from master to initiate
serial interface with a slave

STOP

A unique signal from the master toterminate serial interface from a slave

Read/Write A read or write to the MCP9600
registers
ACK

A receiver Acknowledges (ACK) thereception of each byte by polling the
bus

NAK

A receiver Not-Acknowledges (NAK) or
releases the bus to show End-of-Data
(EOD)

Busy

Communication is not possible
because the bus is in use

Not Busy

The bus is in the idle state, both SDA
and SCL remain highData Valid

SDA must remain stable before SCL
becomes high in order for a data bit tobe considered valid. During normal
data transfers, SDA only changes state
while SCL is low.

4.1.1

DATA TRANSFER

Data transfers are initiated by a Start condition(START), followed by a 7-bit device address and aread/write bit. An Acknowledge (ACK) from the slave
confirms the reception of each byte. Each access must
be terminated by a Stop condition (STOP).

This device supports the Receive Protocol. The
register can be specified using the pointer for the initial
read. Each repeated read or receive begins with a Start
condition and address byte. The MCP9600 retains thepreviously selected register. Therefore, it outputs datafrom the previously-specified register (repeated pointerspecification is not necessary).

4.1.2

MASTER/SLAVEThe bus is controlled by a master device (typically amicrocontroller) that controls the bus access andgenerates the Start and Stop conditions. The MCP9600
is a slave device and does not control other devices inthe bus. Both master and slave devices can operate as
either transmitter or receiver. However, the masterdevice determines which mode is activated.

4.1.3

START/STOP CONDITION

A high-to-low transition of the SDA line (while SCL ishigh) is the Start condition. All data transfers must be
preceded by a Start condition from the master. A
low-to-high transition of the SDA line (while SCL ishigh) signifies a Stop condition.
If a Start or Stop condition is introduced during datatransmission, the MCP9600 releases the bus. All datatransfers are ended by a Stop condition from themaster.

4.1.4

ADDRESS BYTE

Following the Start condition, the host must transmit an
8-bit address byte to the MCP9600. The address forthe
MCP9600
Temperature
Sensoris‘11,0,0,A2,A1,A0’ in binary, where the A2, A1 andA0 bits are set externally by connecting thecorresponding VADDR voltage levels on the ADDR pin(see Section “Input/Output Pin DC Characteristics”). The 7-bit address transmitted in the serial bit
stream must match the selected address for the
MCP9600 to respond with an ACK. Bit 8 in the address
byte is a read/write bit. Setting this bit to ‘1’ commands
a read operation, while ‘0’ commands a write operation(see Figure 4-1).

Command Byte
SCL

1

2

3

4

SDA

1 1

0

0 A2 A1 A0

Start

6

7

Slave
Address

8

9
A
C
K

R/W

MCP9600 Response

Repeated communication is initiated after tB-FREE.

FIGURE 4-1:

 2015-2016 Microchip Technology Inc.

5

Device Addressing.

DS20005426B-page 15

MCP9600
4.1.5

DATA VALID

After the Start condition, each bit of data intransmission needs to be settled for a time specified bytSU-DATA before SCL toggles from low-to-high (see theSensor Serial Interface Timing Specifications section).

4.1.6

ACKNOWLEDGE (ACK/NAK)

Each receiving device, when addressed, is expected togenerate an ACK bit after the reception of each byte.
The master device must generate an extra clock pulse
for ACK to be recognized.
The acknowledging device pulls down the SDA line fortSU-DATA before the low-to-high transition of SCL fromthe master. SDA also needs to remain pulled-down for
tHD-DAT after a high-to-low transition of SCL.
During read, the master must signal an End-of-Data(EOD) to the slave by not generating an ACK bit (NAK)
once the last bit has been clocked out of the slave. In
this case, the slave will leave the data line released toenable the master to generate the Stop condition.

4.1.7

CLOCK STRETCHING
2

During the I C read operation, this device will hold theI2C clock line low for tSTRECH after the falling edge of
the ACK signal. In order to prevent bus contention, themaster controller must release or hold the SCL line low
during this period.
In addition, the master controller must provide eight
consecutive clock cycles after generating the ACK bit
from a read command. This allows the device to pushout data from the SDA output shift registers. Missing
clock cycles could result in bus contention. At the endof the data transmission, the master controller must
provide the NAK bit, followed by a STOP bit toterminate communication.
MCP9600 Clock Stretching – tSTRETCH
7

8

A
0

R C
K

A

1

2

3

4

5

6

7

8

X

X

X

X

X

X

X

X

A
C
K

TH MSB Data
MCP9600

FIGURE 4-2:
4.1.8

MasterClock Stretching.

SEQUENTIAL READ

During sequential read, the device transmits data fromthe proceeding register starting from the previously set
register pointer. The MCP9600 maintains an internal
address pointer, which is incremented at thecompletion of each read-data transmission followed by
ACK from the master. A stop bit terminates thesequential read.

DS20005426B-page 16

 2015-2016 Microchip Technology Inc.

MCP9600
1

2

3

4

5

6

7

8

1

1

0

0

A
2

A
1

A
0

W C
K

1

2

3

4

5

6

7

8

0

0

0

0

0

0

X

X

SCL

SDA

S

A

Address Byte

TABLE 4-2:

POINTERS

Read Only
Registers

Pointer

TH0000 0000

T∆

0000 0001

TC

0000 0010

MCP9600

1

2

3

4

5

6

7

8

1

1

0

0

A
2

A
1

A
0

R C

A
C P
K

MCP9600 Clock Stretching

1

2

3

4

5

6

7

8

0

0

0

0

0

0

0

1

1

2

3

4

5

6

7

8

1

0

0

1

0

1

0

0

SCL

SDA

S

A
K

Address Byte

A
C
K

P

LSB Data

MSB Data
Master

MCP9600

N
A
K

MasterNote: this is an example pseudo routine:i2c_start();i2c_write(b’1100 0000’);// send START command// WRITE Command// also, make sure bit 0 is cleared ‘0’i2c_write(b’0000 00XX’);
i2c_stop();i2c_start();i2c_write(b’1100 0001’);// Write TH, T∆, or TC registers// send STOP command// send START command// READ Command// also, make sure bit 0 is set ‘1’

UpperByte = i2c_read(ACK);// READ 8 bits// and Send ACK bit

LowerByte = i2c_read(NAK);// READ 8 bits// and Send NAK bit

i2c_stop();// send STOP command//Convert the temperature dataif ((UpperByte & 0x80) == 0x80){//TA  0°C
UpperByte = UpperByte & 0x7F;//Clear SIGN
Temperature = 1024 - (UpperByte x 16 + LowerByte / 16);}else//TA  0°C
Temperature = (UpperByte x 16 + LowerByte / 16);//Temperature = Ambient Temperature (°C)

FIGURE 4-3:

Timing Diagram to Set a Register Pointer and Read a Two Byte Data.

 2015-2016 Microchip Technology Inc.

DS20005426B-page 17

MCP9600
1

2

3

4

5

6

7

8

1

1

0

0

A
2

A
1

A
0

W C
K

1

2

3

4

5

6

7

8

0

0

0

0

0

1

0

X

1

2

3

4

5

6

7

8

X

X

X

X

X

X

X

X

SCL

SDA

S

A

A
C
K

A
C
K

P

Register Data

Address Byte

TABLE 4-3:

POINTERS

Read/Write
Registers

Pointer

Status0000 0100

Configuration

0000 0101

MCP9600

0000 0110

MCP9600 Clock Stretching
1

2

3

4

5

6

7

8

1

1

0

0

A
2

A
1

A
0

R C

1

2

3

4

5

6

7

8

X

X

X

X

X

X

X

X

SCL

SDA

S

A
K

Address Byte

N
A
K

P

LSB Data
Master

MCP9600

Note: this is an example pseudo routine:i2c_start();i2c_write(b’1100 0000’);// send START command// WRITE Command// also, make sure bit 0 is cleared ‘0’i2c_write(b’0000 01XX’);
i2c_write(b’XXXX XXXX’);
i2c_stop();i2c_start();i2c_write(b’1100 0001’);// Write Status or Configuration registers// Write register data// send STOP command// send START command// READ Command// also, make sure bit 0 is set ‘1’

Data = i2c_read(NAK);// READ 8 bits// and Send NAK bit

i2c_stop();

FIGURE 4-4:

DS20005426B-page 18// send STOP command

Timing Diagram to Set a Register Pointer and Read a Two Byte Data.

 2015-2016 Microchip Technology Inc.

MCP9600
1

2

3

4

5

6

7

8

1

1

0

0

A
2

A
1

A
0

W C
K

1

2

3

4

5

6

7

8

0

0

0

1

0

0

X

X

1

2

3

4

5

6

7

8

X

X

X

X

X

X

X

X C

SCL

SDA

S

A

Address Byte

A
CK

TABLE 4-4:

POINTERS

Alert Limit
Registers

Pointer

Alert 10001 0000

Alert 20001 0001

Alert 30001 0010

Alert 40001 0011

MCP9600

A
K

Alert 1, 2, 3, 4 MSB
1

2

3

4

5

6

7

8

X

X

X

X

X

X

X

X

A
C P
K

Alert 1, 2, 3, 4 LSB

MCP9600 Clock Stretching

1

2

3

4

5

6

7

8

1

1

0

0

A
2

A
1

A
0

R C

1

2

3

4

5

6

7

8

X

X

X

X

X

X

X

X

1

2

3

4

5

6

7

8

X

X

X

X

X

X

X

X

SCL

SDA

S

Address Byte

A
K

MCP9600

MSB Data

A
C
K

MasterLSB Data

N
A
K

P

MasterNote: this is an example pseudo routine:i2c_start();i2c_write(b’1100 0000’);// send START command//WRITE Command//also, make sure bit 0 is cleared ‘0’i2c_write(b’0001 00XX’);
i2c_write(b’XXXX XXXX’);
i2c_write(b’XXXX XXXX’);
i2c_stop();i2c_start();i2c_write(b’1100 0001’);// Write Alert registers// Write register Upper Byte// Write register Lower Byte// send STOP command// send START command//READ Command//also, make sure bit 0 is set ‘1’

UpperByte = i2c_read(ACK);// READ 8 bits//and Send ACK bit

LowerByte = i2c_read(NAK);// READ 8 bits//and Send NAK bit

i2c_stop();

FIGURE 4-5:// send STOP command

Timing Diagram to Set a Register Pointer and Read a Two Byte Data.

 2015-2016 Microchip Technology Inc.

DS20005426B-page 19

MCP9600
MCP9600 Clock Stretching
1

2

3

4

5

6

7

8

1

1

0

0

A
2

A
1

A
0

R

1

2

3

4

5

6

7

8

0

0

0

0

0

0

0

0

SCL

SDA

S

Address Byte

A
C
K

A
C
K

TH MSB Data

MCP9600

MCP9600 Clock Stretching
Note 1
1

2

3

4

5

6

7

8

X

X

X

X

X

X

X

X

A
C
K

1

2

3

4

5

6

7

8

X

X

X

X

X

X

X

X

TH LSB Data

A
C
K

X

X

X

X

MasterMaster

TC MSB Data

X

X

N
A
K

P

MasterTC LSB Data

Device ID LSBNote 1: All registers can be read sequentially starting from the previously set register pointer.

Note: this is an example pseudo routine:i2c_start();i2c_write(b’1100 0000’);// send START command// WRITE Command// also, make sure bit 0 is cleared ‘0’i2c_write(b’0000 0000’);
i2c_stop();i2c_start();i2c_write(b’1100 0001’);// Write TH register to set the starting register for sequential read// send STOP command// send START command// READ Command// also, make sure bit 0 is set ‘1’for (i=0; i<29, i++){
Data_Buffer[i] = i2c_read(ACK);// READ 8 bits// and Send ACK bit}
Data_Buffer[i] = i2c_read(NAK);// READ 8 bits// and Send NAK bit

i2c_stop();

FIGURE 4-6:

DS20005426B-page 20// send STOP command

Timing Diagram to Sequential Read all Registers Starting from TH Register.

 2015-2016 Microchip Technology Inc.

MCP9600
5.0

FUNCTIONAL DESCRIPTION

The MCP9600 temperature sensor consists of an 18-bit
delta-sigma analog-to-digital converter which is used tomeasure the thermocouple voltage or EMF, a digitaltemperature sensor used to measure cold-junction orambient temperature and a processor core which isused to compute the EMF to degree Celsius conversion
using coefficients derived from NIST ITS-90
coefficients. Figure 5-1 shows a block diagram of how
these functions are structured in the device.

+

VIN+

Thermocouple

VIN-

ADC core
Del Sig

User Registers:
Thermocouple Hot-Junction, TH
Error correction

Thermocouple Junctions Delta, T∆Thermocouple Cold-Junction, TC
DigitalFilter
Thermocouple
Type
Selection

Sensor Status
Sensor Configuration
Device Resolution & Power Modes
Configuration

Alert 1 Limit

Alert 1 Output

Alert 2 Limit

Alert 2 Output

Alert 3 Limit

Alert 3 Output

Alert 4 Limit

Alert 4 Output

Hysteresis
Configuration
Hysteresis
Configuration
Hysteresis
Configuration
Hysteresis
Device ID

I2C Module

SCL
SDA
ADDR

FIGURE 5-1:

Functional Block Diagram.

 2015-2016 Microchip Technology Inc.

DS20005426B-page 21

MCP9600
The MCP9600 device has several registers that areuser-accessible. These registers include thethermocouple
temperature(cold-junction
compensated), hot-junction temperature, cold-junction
temperature, raw ADC data, user programmable Alert
limit registers, and status and configuration registers.
The temperature and the raw ADC data registers are
read-only registers, used to access the thermocouple
and the ambient temperature data. In addition, the four
Alert Temperature registers are individually controlled
and can be used to detect a rising and/or a falling
temperature change. If the ambient temperature drifts
beyond the user-specified limits, the MCP9600 device
outputs an alert flag at the corresponding pin (refer to

REGISTER 5-1:

Section 5.3.3 “Alert configuration Registers”). The
Alert limits can also be used to detect criticaltemperature events.
The MCP9600 also provides a status and configuration
registers which allow users to detect device statuses.
The configuration registers provide various features
such as adjustable temperature measurement resolution and Shutdown modes. The thermocouple types
can also be selected using the configuration registers.
The registers are accessed by sending a Register
Pointer to the MCP9600 using the serial interface. Thisis an 8-bit write-only pointer. Register 5-1 describes thepointer definitions.

REGISTER POINTER

U-0

U-0

U-0

U-0

W-0

W-0

W-0

W-0

—

—

—

—

P3

P2

P1

P0

bit 7

bit 0

Legend:R = Readable bit

W = Writable bit

U = Unimplemented bit, read as ‘0’-n = Value at POR‘1’ = Bit is set‘0’ = Bit is cleared

bit 7-4

Unimplemented: Write ‘0’

bit 3-0

P<3:0>: Pointer bits
0000 0000 = Thermocouple Hot-Junction Register - TH
0000 0001 = Junctions Temperature Delta Register - T∆
0000 0010 = Cold-Junction Temperature Register - TC
0000 0011 = Raw ADC Data
0000 0100 = Status0000 0101 = Thermocouple Sensor Configuration
0000 0110 = Device Configuration
0000 1000 = Alert 1 Configuration
0000 1001 = Alert 2 Configuration
0000 1010 = Alert 3 Configuration
0000 1011 = Alert 4 Configuration
0000 1100 = Alert 1 Hysteresis - THYST10000 1101 = Alert 2 Hysteresis - THYST20000 1110 = Alert 3 Hysteresis - THYST30000 1111 = Alert 4 Hysteresis - THYST40001 0000 = Temperature Alert 1 Limit - TALERT1
0001 0001 = Temperature Alert 2 Limit - TALERT20001 0010 = Temperature Alert 3 Limit - TALERT30001 0011 = Temperature Alert 4 Limit - TALERT40010 0000 = Device ID/Rev Register

DS20005426B-page 22

x = Bit is unknown 2015-2016 Microchip Technology Inc.

MCP9600
TABLE 5-1:

SUMMARY OF REGISTERS AND BIT ASSIGNMENTS
Pointer

bit 7

bit 6

bit 5

bit 4

bit 3

bit 2

bit 1

bit 0

Hot-Junction
Temperature – TH

Register

00000000

SIGN

1024°C

512°C

256°C

128°C

64°C

32°C

16°C

8°C

4°C

2°C

1°C

0.5°C

0.25°C

0.125°C

0.0625°C

Junctions Temperature Delta – T∆

00000001

SIGN

1024°C

512°C

256°C

128°C

64°C

32°C

16°C

8°C

4°C

2°C

1°C

0.5°C

0.25°C

0.125°C

0.0625°C

Cold-Junction
Temperature – TC

00000010
8°C

4°C

2°C

1°C

Raw data ADC

00000011

SIGN

128°C

64°C

32°C

16°C

0.5°C

0.25°C

0.125°C

0.0625°C

bit 17

bit 16SIGN
bit 15

bit 8

bit 7
Status00000100 Flag, Burst
Complete

Thermocouple
00000101
Sensor Configuration—

DeviceConfiguration

00000110 Cold-Junc.

Alert 1 Configuration

00001000
00001001
00001010
00001011
00001100
00001101
0000111000001111
00010000

Alert 2 Configuration
Alert 3 Configuration
Alert 4 Configuration
Alert 1 Hysteresis
Alert 2 Hysteresis
Alert 3 Hysteresis
Alert 4 Hysteresis
Alert 1 Limit

bit 0
Flag, TH
Updated—

Flag, Input
Range

Thermocouple Type SelectType K, J, T, N, S, E, B, R

Alert 4
StatusAlert 3
Status—Alert 2
StatusAlert 1
StatusFilter Coefficients

ADC Resolution

Burst Mode Temperature Samples

Interrupt
Clear

—

—

Monitor TH
or TC

DetectRising or
Falling
Temps

128°C

64°C

32°C

16°C

8°C

SIGN

1024°C

512°C

256°C

8°C

4°C

2°C

1°C

1024°C

512°C

256°C

Shutdown Modes

Resolution
Active- High Comparator
oror
Active-Low
Interrupt
OutputMode

EnableAlert
Output

4°C

2°C

1°C

128°C

64°C

32°C

16°C

0.5°C

0.25°C

—

—

128°C

64°C

32°C

16°C

Alert 2 Limit

00010001

SIGN
8°C

4°C

2°C

1°C

0.5°C

0.25°C——

Alert 3 Limit

00010010

SIGN

1024°C

512°C

256°C

128°C

64°C

32°C

16°C

8°C

4°C

2°C

1°C

0.5°C

0.25°C——

Alert 4 Limit

00010011

SIGN

1024°C

512°C

256°C

128°C

64°C

32°C

16°C

8°C

4°C

2°C

1°C

0.5°C

0.25°C——

Device ID/Rev

00100000

0

1

0

0

0

0

0

0

Rev ID Major

 2015-2016 Microchip Technology Inc.

Rev ID Minor

DS20005426B-page 23

MCP9600
5.1

Thermocouple Temperature
Sensor Registers

This device integrates three temperature registers thatare used to read the cold and hot-junction
temperatures and the sum of the two junctions to
output the absolute thermocouple temperature. In
addition, the raw ADC data which is used to derive thethermocouple temperature is available. The following
sections describe each register in detail.

5.1.1

The temperature bits are in two’s complement format,
therefore, positive temperature data and negative temperature data are computed differently. Equation 5-1
shows how to convert the binary data to temperature indegree Celsius.

Temperature
Sensor core

THERMOCOUPLE TEMPERATURE
REGISTER – THThis register contains the cold-junction compensatedand error-corrected Thermocouple temperature indegree Celsius. The temperature data from thisregister is the absolute Thermocouple Hot-Junction
Temperature TH to the specified accuracy, Section 1.0“Electrical Characteristics”. TH is the sum of thevalues in T∆ and TC registers as shown in Figure 5-2.

EQUATION 5-1:



Delta
Sigma
18-bit

VIN-

TH
Thermocouple
Temperature

T∆

ADC core
VIN+

Error Corrected
Temperature
ADC

Thermocouple Register’s

FIGURE 5-2:
Block Diagram.

TEMPERATURECONVERSION

TC

Temperature  0°C
TH = (UpperByte x 24 + LowerByte x 2-4)
Temperature  0°C
TH = 1024 - (UpperByte x 24 + LowerByte x 2-4)

REGISTER 5-2:

THERMOCOUPLE TEMPERATURE REGISTER (READ ONLY)

R-0

R-0

R-0

R-0

R-0

R-0

R-0

R-0

SIGN

1024°C

512°C

256°C

128°C

64°C

32°C

16°C

bit 15

bit 8

R-0

R-0

R-0

R-0

R-0

R-0

R-0

R-0

8°C

4°C

2°C

1°C

0.5°C

0.25°C

0.125°C

0.0625°C

bit 7

bit 0

Legend:R = Readable bit

W = Writable bit

U = Unimplemented bit, read as ‘0’-n = Value at POR‘1’ = Bit is set‘0’ = Bit is clearedx = Bit is unknown

bit 15SIGN:
1 = TA  0°C
0 = TA 0°C

bit 14-0

TH: Data in two’s complement format
This register contains the error corrected and cold-junction compensated Thermocouple temperature.

DS20005426B-page 24

 2015-2016 Microchip Technology Inc.

MCP9600
5.1.2

THERMOCOUPLE JUNCTIONSDELTA TEMPERATURE REGISTER –T∆This register contains the error corrected
Thermocouple Hot-Junction temperature without theCold-Junction compensation. The error correction
methodology uses several coefficients to convert thedigitized Thermocouple EMF voltage to degree
Celsius. Each Thermocouple type has a unique set of
coefficients as specified by NIST, and thesecoefficients are available in the configuration registerfor user selection as shown in Figure 5-3.

EQUATION 5-2:

ADC core
VIN+
VIN-

Thermocouple Types:-

Temperature  0°C
T∆ = (UpperByte x 24 + LowerByte x 2-4)

Type K
Type J
Type T
Type N
Type SType E
Type B
Type RADC code todegree Celsius
conversion using
coefficients
derived fromNIST look-up
table database.
T∆(see Register 5-6)

T∆ = 1024 - (UpperByte x 24 + LowerByte x 2-4)

The temperature bits are in two’s complement format,
therefore, positive temperature data and negative
temperature data are computed differently, as shownin Equation 5-2.

REGISTER 5-3:

Check if the ADC
code is within
range for theselected thermocouple typeUser-Selectable,

TEMPERATURECONVERSION

Temperature  0°C

ADC

Delta
Sigma
18-bit

Thermocouple
Junctions Delta
Temperature – T∆

FIGURE 5-3:
Thermocouple Hot-Junction
Register – T∆ Block Diagram.

HOT-JUNCTION TEMPERATURE REGISTER (READ ONLY)

R-0

R-0

R-0

R-0

R-0

R-0

R-0

R-0

SIGN

1024°C

512°C

256°C

128°C

64°C

32°C

16°C

bit 15

bit 8

R-0

R-0

R-0

R-0

R-0

R-0

R-0

R-0

8°C

4°C

2°C

1°C

0.5°C

0.25°C

0.125°C

0.0625°C

bit 7

bit 0

Legend:R = Readable bit

W = Writable bit

U = Unimplemented bit, read as ‘0’-n = Value at POR‘1’ = Bit is set‘0’ = Bit is cleared

bit 15SIGN:
1 = TA  0°C
0 = TA 0°C

bit 14-0

T∆: Data in two’s complement format
This register contains Thermocouple Hot-Junction temperature data.

 2015-2016 Microchip Technology Inc.

x = Bit is unknown

DS20005426B-page 25

MCP9600
5.1.3

COLD-JUNCTION/AMBIENTTEMPERATURE REGISTER (TC)TABLE 5-2:

The MCP9600 integrates an ambient temperature
sensor which can be used to measure theThermocouple Cold-Junction temperature. For
accurate measurement, the MCP9600 will have to beplaced at close proximity to the Thermocouple
cold-junction to detect the junction ambient
temperature. This is a 16-bit double buffered read-only
register. The temperature resolution is user selectable
to 0.0625°C/LSb or 0.25°C/LSb resolutions and setting
the resolution determines the temperature update rate
as shown in Table 5-2.

EQUATION 5-3:

TEMPERATURECONVERSION

Resolution

Conversion
Time(typical)

Register Bits
(Note 1)

0.0625°C

250 msSSSS XXXX XXXX XXXX

0.25°C

63 ms

SSSS XXXX XXXX XX00

Note 1:‘S’ is Sign and ‘X’ is unknown bit.

TC

Ambient Temperature
Sensor Core

Thermocouple
Cold-Junction
Temperature -TC

Selectable Resolution

Temperature  0°C- 0.0625°C- 0.25°C

TC = (UpperByte x 24 + LowerByte x 2-4)

(see Register 5-8)

Temperature  0°C
TC

RESOLUTION VS.
CONVERSION TIME

= 1024 - (UpperByte x 24 + LowerByte x 2-4)

FIGURE 5-4:
Thermocouple
Cold-Junction Register – TC Block Diagram.

The temperature bits are in two’s complement format,
therefore, positive temperature data and negative temperature data are computed differently, as shown inEquation 5-3.

REGISTER 5-4:
R-0

COLD-JUNCTION TEMPERATURE REGISTER
R-0

R-0

R-0

SIGN

R-0

R-0

R-0

R-0

128°C

64°C

32°C

16°C

bit 15

bit 8

R-0

R-0

R-0

R-0

R-0

R-0

R-0

R-0

8°C

4°C

2°C

1°C

0.5°C

0.25°C

0.125°C

0.0625°C

bit 7

bit 0

Legend:R = Readable bit

W = Writable bit

U = Unimplemented bit, read as ‘0’-n = Value at POR‘1’ = Bit is set‘0’ = Bit is clearedx = Bit is unknown

bit 15-12

SIGN:
1 = TA  0°C
0 = TA 0°C

bit 11-0

TC: Data in two’s complement format
This register contains Thermocouple Cold-Junction temperature or the device ambient temperaturedata. Bits 1 and 0 may remain clear ‘0’ depending on the status of the resolution register.

DS20005426B-page 26

 2015-2016 Microchip Technology Inc.

MCP9600
5.1.4

ANALOG TO DIGITAL CONVERTER– ADC

ADC Core

The MCP9600 uses an 18-bit Delta Sigma Analog-to-Digital converter to digitize the Thermocouple
EMF voltage and the data is available in the ADC register. The ADC measurement resolution is selectable
which enables the user choose faster conversion times
with reduced resolution. This feature is useful to detect
fast transient temperatures.

TABLE 5-3:

Conversion
Time(typical)Raw ADC Register
Bit Format(Note 1)18 bit/2 µV

320 msSSSS SSSX XXXX XXXXXXXX XXXX

16 bit/8 µV

80 ms

SSSS SSSX XXXX XXXXXXXX XX00

14 bit/32 µV

20 ms

SSSS SSSX XXXX XXXXXXXX 0000

12 bit/128 µV

5 ms

SSSS SSSX XXXX XXXX
XX00 0000

2:

ADC

Delta
Sigma

VIN-

Raw ADC
Code Register

Selectable Resolutions:

ADC RESOLUTION (Note 2)

Resolution/
Sensitivity(typical)

Note 1:

VIN+- 18 bit- 16 bit- 14 bit- 12 bit(see Register 5-7)

FIGURE 5-5:
Delta Sigma Analog to
Digital Converter, ADC Core – Block Diagram.

‘S’ is the Sign bit and ‘X’ is the ADC databit.
See Section 6.2.2 “Conversion Timevs. Self-Heat”.

REGISTER 5-5:
R-0

SAMPLE: 24-BIT REGISTER
R-0

R-0

R-0

R-0

R-0

R-0

SIGN

R-0
ADC Data

bit 23

bit 16

R-0

R-0

R-0

R-0

R-0

R-0

R-0

R-0

ADC Data
bit 15

bit 8

R-0

R-0

R-0

R-0

R-0

R-0

R-0

R-0

ADC Data
bit 7

bit 0

Legend:R = Readable bit

W = Writable bit

U = Unimplemented bit, read as ‘0’-n = Value at POR‘1’ = Bit is set‘0’ = Bit is cleared

bit 23-0

x = Bit is unknown

ADC Data<23:0>: Raw ADC Data, including sign bits

 2015-2016 Microchip Technology Inc.

DS20005426B-page 27

MCP9600
5.2

Sensor Status and Configuration
Registers

This device provides various temperature andmeasurement status bits which can be monitored
regularly by the master controller. In addition, thisdevice integrates various user programmable features
which can be useful to develop complex thermal
management applications. The following sections
describe each features in detail.

REGISTER 5-6:

5.2.1

STATUS REGISTERThe Status register contains several flag bits that indicate statuses, such as temperature alert, the ADC input
range status for the selected thermocouple type andthe temperature register update status for both single
conversion or burst mode conversions.

STATUS REGISTER

R/W-0

R/W-0

R-0

R-0

R-0

R-0

R-0

R-0

Flag,
Burst Complete

Flag,
TH Update—

Flag,
Input Range

Alert 4 Status

Alert 3 Status

Alert 2 Status

Alert 1 Status

bit 7

bit 0

Legend:R = Readable bit

W = Writable bit

U = Unimplemented bit, read as ‘0’-n = Value at POR‘1’ = Bit is set‘0’ = Bit is clearedx = Bit is unknown

bit 7

Burst Complete, Flag bit: Burst mode Conversions Status flag
1 = T∆ register Burst mode Conversions Complete
0 = Writing 0 has no effectOnce Burst mode is enabled, this bit is normally set after the first Burst is complete. User can clear it
and poll the bit periodically until the next Burst of temperature conversions is complete (seeRegister 5-8).

bit 6

TH update, Flag bit: Temperature Update flag
1 = Temperature Conversion Complete
0 = Writing 0 has no effectThis bit is normally set. User can clear it and poll the bit until the next temperature conversion iscomplete.

bit 5

Unimplemented: Read as “0”.

bit 4

Input Range, Flag bit: ADC Input Voltage Range Detection bit (READ ONLY)
1 = The input voltage (or the Thermocouple EMF Voltage) exceeds the range for the selected Thermocouple type
0 = The input voltage (or the Thermocouple EMF Voltage) is within measurement range for theselected Thermocouple type
If this bit is set, then the MCP9600 does not convert the input voltage (EMF) to Degree Celsius (Temperature data conversion is bypassed). Both T∆ and TH registers hold the previous temperature data.

bit 3

Alert 4 Status (READ ONLY)
1 = TX TALERT4
0 = TX ≤TALERT4
Where: TX is either TH or TC (User selectable, see Register 5-10)

bit 2

Alert 3 Status (READ ONLY)
1 = TX TALERT3
0 = TX ≤TALERT3
Where: TX is either TH or TC (User selectable, see Register 5-10)

bit 1

Alert 2 Status (READ ONLY)
1 = TX TALERT2
0 = TX ≤TALERT2
Where: TX is either TH or TC (User selectable, see Register 5-10)

bit 0

Alert 1 Status (READ ONLY)
1 = TX TALERT1
0 = TX ≤TALERT1
Where: TX is either TH or TC (User selectable, see Register 5-10)

DS20005426B-page 28

 2015-2016 Microchip Technology Inc.

MCP9600
THERMOCOUPLE SENSORCONFIGURATION REGISTEREQUATION 5-4:

The MCP9600 sensor configuration register is used to
select the thermocouple sensor types and to select thedigital filter options. This device supports eight thermocouple types. Each type has a unique set of error correction coefficients that are derived from the NIST
Thermocouple EMF voltage conversion database.
In addition, this device integrates a first order recursive
Infinite Impulse Response (IIR filter), also known as
Exponential Moving Average (EMA). The filter uses thecurrent new temperature sample and the previous filter
output to calculate the next filter output. It also adds
more weight to the current temperature data, allowing
a faster filter response to the immediate change intemperature. This feature can be used to filter out fast
thermal transients or thermal instability at the
Thermocouple Hot-Junction temperature. Writing thisregister resets the filter.
The filter equation is shown in Equation 5-4 and thefilter coefficient n is user selectable from level 0 to 7. A
coefficient of 0 disables the filter function, and 7
provides maximum digital filter. Figure 5-6 shows thefilter response to a step function, which can be used to
extrapolate the filter performance to various
temperature changes.

REGISTER 5-7:
R-0—

DIGITAL FILTERY = k  X +  1 – k   Y–1n

k = 2  2 + 1Where:
Y = New filtered temperature in T∆
X = Current, unfiltered hot-junction
temperatures
Y-1 = Previous filtered temperaturen = User selectable filter coefficient
1.0

Filter Output (°C)

5.2.2

n=0
n=1
n=2
n=3
n=4
n=5
n=6
n=7

0.5

0.0
0.0

32.0
64.0
96.0
Number of Temperature Samples

FIGURE 5-6:

128.0

Filter Step Response.

SENSOR CONFIGURATION REGISTER
R/W-0

R/W-0

R/W-0

Thermocouple Type Select Type K, J, T,
N, S, E, B, R

R-0
—

R/W-0

R/W-0

R/W-0

Filter Coefficients

bit 7

bit 0

Legend:R = Readable bit

W = Writable bit

U = Unimplemented bit, read as ‘0’-n = Value at POR‘1’ = Bit is set‘0’ = Bit is cleared

bit 7

Unimplemented: Write ‘0’

bit 6-4

Thermocouple Type:000 = Type K
001 = Type J
010 = Type T
011 = Type N
100 = Type S
101 = Type E
110 = Type B
111 = Type R

bit 3

Unimplemented:

bit 2-0

Filter coefficient - n:
000 = n = 0 - Filter Off
001 = n = 1 - Minimum Filter
010 = n = 2
011 = n = 3
100 = n = 4 - Mid Filter
101 = n = 5
110 = n = 6
111 = n = 7 - Maximum Filter 2015-2016 Microchip Technology Inc.

x = Bit is unknown

DS20005426B-page 29

MCP9600
5.2.3

DEVICE CONFIGURATIONREGISTERThe Device Configuration register allows user to configure various functions such as sensor measurement
resolutions and power modes. The resolution register
is used to select the sensor resolution for the desired
temperature conversion time. When resolutions arechanged, the change takes effect when the next measurement cycle begins.
This device integrates two low-power operating modes,
Shutdown Mode and Burst Mode, which can beselected using bit 0 and bit 1. When the shutdown
mode is executed, all power consuming activities are
disabled and the operating current remains at ISHDN.
During the Shutdown mode all registers are accessible,
however, I2C activity on the bus increases the current.

The Burst mode enables users to execute a given number of temperature samples (defined by bits 4-2) before
entering Shutdown mode. Each temperature sample iscompared to the user set alert temperature limits, andif the alert conditions are true then the device asserts
the corresponding alert output. In addition, if the filter
option is enabled, then the filter engine is applied toeach temperature sample. The alert thresholds arealso compared to the filtered temperature data. Thisfeature is useful for battery power applications where
temperature is sampled upon request from the master
controller.
Burst Mode Command
Shutdown Mode

Shutdown Mode

Normal Operation1←samples→128

Burst Mode Operation.

FIGURE 5-7:
REGISTER 5-8:
R/W-0

DEVICE CONFIGURATION REGISTER
R/W-0

Cold-Junction
Resolution

R/W-0

ADC Resolution

R/W-0

R/W-0

R/W-0

R/W-0

Burst Mode Temperature Samples

R/W-0

Shutdown Modes

bit 7

bit 0

Legend:R = Readable bit

W = Writable bit

U = Unimplemented bit, read as ‘0’-n = Value at POR‘1’ = Bit is set‘0’ = Bit is cleared

bit 7

Cold-Junction / Ambient Sensor Resolution (see Table 5-2):
0 = 0.0625°C
1 = 0.25°C

bit 6-4

ADC Measurement Resolution (see Table 5-3):
00 = 18-bit Resolution
01 = 16-bit Resolution
10 = 14-bit Resolution
11 =12-bit Resolution

bit 3

Number of Temperature Samples:
000 = 1 Sample
001 = 2 Samples
010 = 4 Samples
011 = 8 Samples
100 = 16 Samples
101 = 32 Samples
110 = 64 Samples
111 = 128 Samples

bit 2-0

Shutdown Modes:
00 = Normal Operation
01 = Shutdown Mode
10 = Burst Mode
11 = Unimplemented: this setting has no effect

DS20005426B-page 30

x = Bit is unknown 2015-2016 Microchip Technology Inc.

MCP9600
5.3

Temperature Alert Registers

TABLE 5-4:

This device provides four temperature alert registers
that are individually configured, which allow users tomonitor multiple temperature zones with a single
device. The following sections describe each alert features in detail.

5.3.1

ALERT LIMIT REGISTERSALERT LIMIT REGISTERS

Register

Register PointerAlert 1 Limit – TALERT1

0001 0000

Alert 2 Limit – TALERT20001 0001

Alert 3 Limit – TALERT30001 0010

Alert 4 Limit – TALERT40001 0011

This device integrates four individually-controlledtemperature Alert Limit Registers. Each alert limit isindividually set to detect a rising or a falling
temperature or either the Thermocouple temperatureregister TH or the Cold-Junction TC registers. The
corresponding Alert Limit Outputs can also be enabled
for temperature status indicators. All alert functions are
configured using the Alert Limit configuration registers,
Register 5-11, and the alert output hysteresis is set
using the Alert Hysteresis registers, Register 5-10.

REGISTER 5-9:

ALERT LIMITS 1, 2, 3 AND 4 REGISTERS

R/W-0

R/W-0

R/W-0

R/W-0

R/W-0

R/W-0

R/W-0

R/W-0

SIGN

1024°C

512°C

255°C

128°C

64°C

32°C

16°C

bit 15

bit 8

R/W-0

R/W-0

R/W-0

R/W-0

R/W-0

R/W-0

R/W-0

R/W-0

8°C

4°C

2°C

1°C

0.5°C

0.25°C

—

—

bit 7

bit 0

Legend:R = Readable bit

W = Writable bit

U = Unimplemented bit, read as ‘0’-n = Value at POR‘1’ = Bit is set‘0’ = Bit is cleared

bit 15SIGN:
1 = TA  0°C
0 = TA 0°C

bit 14-2

Alert 1, 2, 3 and 4: Data in two’s complement format

bit 1-0

Unimplemented:

TH

0

TC

1

x = Bit is unknown

Output Mode Control
Comparator

00Interrupt

1

1

Digital Comparator

TH/TC

Alert Output

Alert Limit+/Alert Hysteresis
Rise/Fall

FIGURE 5-8:

Int. Clear

Active High/Low

Comparator/Interrupt Mode

Alert Limits Set to Detect TH and TC.

 2015-2016 Microchip Technology Inc.

DS20005426B-page 31

MCP9600
 TALERT1TALERT1

 TALERT1 - THYST1

 TALERT2TALERT2

 TALERT3 + THYST3
TH

 TALERT2 - THYST2TALERT3

 TALERT3TALERT4

Interrupt(Active-Low)

Int. Clear
Comparator
Interrupt
Int. Clear

Comparator
Interrupt

FIGURE 5-9:

DS20005426B-page 32(Active-Low)

Int. Clear

Alert 3 Output(Active-Low)

Alert 2 Output

 TALERT4 + THYST4Comparator

Alert 4 Output(Active-Low)

Alert 1 Output

 TALERT4

Comparator
Interrupt
Int. Clear

Alert Limits Boundary Conditions and Output Characteristics when Set to Detect TH.

 2015-2016 Microchip Technology Inc.

MCP9600
5.3.2

ALERT HYSTERESIS REGISTERTABLE 5-5:This device integrates four individually controlledtemperature Alert Hysteresis registers for each alert
output, with a range of 0°C to 255°C.
The alert hysteresis directions are set using bit 3 of thecorresponding
Alert
Configuration
registers(Register 5-10) to detect rising or falling temperatures.
For rising temperatures, hysteresis range is below thealert limit where as for falling temperatures, the hysteresis range is above the alert limit as shown on
Figure 5-10.

REGISTER 5-10:

ALERT HYSTERESISREGISTERSRegister

Register PointerAlert 1 Hysteresis – THYST10000 1100

Alert 2 Hysteresis – THYST20000 1101

Alert 3 Hysteresis – THYST30000 1110

Alert 4 Hysteresis – THYST40000 1111

ALERT 1, 2, 3 AND 4 HYSTERESIS REGISTER

R/W-0

R/W-0

R/W-0

R/W-0

R/W-0

R-0

R-0

R-0

128°C

64°C

32°C

16°C

8°C

4°C

2°C

1°C

bit 7

bit 0

Legend:R = Readable bit

W = Writable bit

U = Unimplemented bit, read as ‘0’-n = Value at POR‘1’ = Bit is set‘0’ = Bit is cleared

bit 7-0

Alert Hysteresis: Alert Hysteresis range 0x00 to 0xFF, which represents 1°C to 255°C.

is
es
ter
s
Hy

is
es
ter
s
Hy

Alert Output

ACtive -Low

ACtive -Low

Alert Output

THYST

cold

Hot

Rising Temperature

ACtive -High

H

THYST

cold

sis
ere
yst

Hot

Falling Temperature

Alert Output
H

is
es
ter
s
y

ACtive -High

Alert Output

THYST

TALERTTALERT

cold

TALERTHot

Rising Temperature

FIGURE 5-10:

x = Bit is unknown

TALERT

THYST

cold

Hot

Falling Temperature

Graphical Description of Alert Output Hysteresis Direction.

 2015-2016 Microchip Technology Inc.

DS20005426B-page 33

MCP9600
5.3.3

ALERT CONFIGURATIONREGISTERS

The microcontroller will have acknowledged theinterrupt signal from the corresponding alert output by
clearing the interrupt using bit 7 of the corresponding
configuration register.

This device integrates four individually-controlledtemperature Alert Outputs. Each output is configured
for the corresponding alert output using the Alert Output configuration registers.

The Rise/Fall bit (bit 3) and the temperature selection
bit (bit 4) can be used to detect and maintain the
Thermocouple temperature or the Cold-Junction
temperature to the desired temperature window.

The configuration registers are used to enable each
output, select the alert function mode as Comparator orInterrupt mode, Active-High or Active-Low output,
detect rising or falling temperatures, and detect TH or
TC temperature registers.

TABLE 5-6:

The Comparator mode is useful for thermostat-typeapplications, such as on/off switches for fan controllers,buzzer or LED indicators. The Alert output asserts anddeasserts when the temperature exceeds theuser-specified limit and the user-specified hysteresis
limit. The Interrupt mode is useful for interrupt driven
microcontroller-based systems. The Alert Outputs areasserted each time the temperature exceeds the user
specified Alert limit and Hysteresis limits.

REGISTER 5-11:

ALERT CONFIG. REGISTERS

Register

Register PointerAlert 1 Configuration

0000 1000

Alert 2 Configuration

0000 1001

Alert 3 Configuration

0000 1010

Alert 4 Configuration

0000 1011

ALERT 1, 2, 3 AND 4 CONFIGURATION REGISTER

R/W-0

R/W-0

R/W-0

R/W-0

R/W-0

R-0

R-0

R-0

Interrupt Clear——

Monitor
TH/TC

Rise/Fall

Active Hi/Lo

Comp/Int.

Alert Enable

bit 7

bit 0

Legend:R = Readable bit

W = Writable bit

U = Unimplemented bit, read as ‘0’-n = Value at POR‘1’ = Bit is set‘0’ = Bit is clearedx = Bit is unknown

bit 7

Interrupt Clear:
1 = Clears Interrupt flag (forced ‘0’ by device)
0 = Normal State or Cleared Statebit 6-5

Unimplemented: Read as ‘0’

bit 4

Monitor TH or TC:
1 = Alert Monitor for TC Cold-Junction Sensor
0 = Alert Monitor for TH Thermocouple Temperature

bit 3

Alert Temperature Direction, Rise/Fall:
1 = Alert Limit for Rising or Heating Temperatures
0 = Alert Limit for Falling or Cooling Temperatures

bit 2

Alert State:
1 = Active High
0 = Active Low

bit 1

Alert Mode:
1 = Interrupt Mode: Interrupt Clear bit (bit 7) must be set to deassert the alert output
0 = Comparator Mode

bit 0

Alert Enable:
1 = Alert Output is Enabled
0 = Alert Output is Disabled

DS20005426B-page 34

 2015-2016 Microchip Technology Inc.

MCP9600
5.3.4

DEVICE ID AND REVISION ID
REGISTERThe Device ID and Revision ID register is a 16-bit
read-only register, which can be used to identify thisdevice among other devices on the I2C bus. The upper
8-bit indicates the device ID of 0x40, while the lower
8-bit indicates the device revision. The device revisionbyte is divided to the nibbles, where the upper nibble
indicates the major revision and the lower nibble
indicates minor revisions for each major revision. The
initial release is indicated by a major revision of 1 anda minor revision of 0, or 0x4010.

REGISTER 5-12:
R-0.

DEVICE ID AND REVISION ID REGISTER
R-1

R-0

R-0

R-0

R-0

R-0

R-0

Device ID
bit 15

bit 8

R-0

R-0

R-0

R-1

R-0

Major

R-0

R-0

R-0

Minor

bit 7

bit 0

Legend:R = Readable bit

W = Writable bit

U = Unimplemented bit, read as ‘0’-n = Value at POR‘1’ = Bit is set‘0’ = Bit is cleared

bit 15-8

Device ID: 0x40 (hex)

bit 7-0

Revision: 0x10 (hex)Release, Revision 1.0

 2015-2016 Microchip Technology Inc.

x = Bit is unknown

DS20005426B-page 35

MCP9600
NOTES:

DS20005426B-page 36

 2015-2016 Microchip Technology Inc.

MCP9600
6.0

APPLICATION INFORMATION

6.1

Layout Considerations

The MCP9600 does not require any additional
components to digitize thermocouples. However, it isrecommended that a decoupling capacitor of 0.1 µF to
1 µF be used between the VDD and GND pins. A
high-frequency ceramic capacitor is recommended. It
is necessary for the capacitor to be located as close as
possible to the VDD and ground pins of the device inorder to provide effective noise protection.
In addition, good PCB layout is key for better thermal
conduction from the PCB temperature to the sensor
die. The PCB provides thermal conduction from the dieto the thermocouple cold-junction, therefore the component placement positioning and the copper layout
techniques are key for optimum cold-junction compensation. The recommended implementation for optimum
temperature sensitivity is to extend copper ground padaround the device pins, as shown in Figure 6-1.
Thermal Pad

VIN+/VIN-

FIGURE 6-2:
Placement.

6.2

6.1.1

Recommended PCB

COLD-JUNCTION COMPENSATION

Copper provides better thermal conductivity than PCB
FR4 to the ambient temperature. It also provides better
thermal conduction than the 5 mm x 5 mm MQFN
plastic package which houses the temperature sensor
die. Therefore, when connecting the thermocouple wire
to the PCB, it is recommended to place ground copper
between the thermocouple connector footprint, where
dissimilar conductive material is attached to the PCB
and the MCP9600 exposed pad. This allows
temperature to stabilize to the local ambient
temperature (between the thermocouple connector
junction and the PCB copper) and the copper trace
conducts the temperature to the package exposed padwhere the temperature sensor die is placed. The
placement of the sensor exposed pad to thethermocouple connector junction greatly determines
the temperature sensor’s sensitivity to the local
junction
temperaturechanges.
Figure 6-2
demonstrates the recommended techniques.

 2015-2016 Microchip Technology Inc.

Thermal Considerations

The potential for self-heating errors exist if the
MCP9600 SDA, SCL and Alert outputs are heavily
loaded (high current) with pull-up resistors and circuits
such as high-current LEDs or buzzer loads. The temperature rise due to self-heat increases the ambient
temperature sensor output, resulting in an increased
temperature offset error compared to the thermocouple
cold-junction ambient temperature.

6.2.1

FIGURE 6-1:
Layout.

Recommended Component

SELF-HEAT DURING OPERATION

During normal operation, the typical self-heating error
is negligible due to the relatively small current
consumption of the MCP9600. However, this device
integrates a processor to compute the equations
necessary to convert the thermocouple EMF voltage todegrees Celsius. The processor also maintains the I2C
bus. During I2C communication, the device operating
current increases to IDD = 1.5 mA (typical), I2C Active
specification. If the bus is continually polled for data at
frequent intervals, then the processor power dissipates
heat to the temperature sensor and the effect ofself-heat can be detected. Therefore, therecommended implementation is to maintain polling to
no more than three times per temperature conversion
period of 320 ms, or use the Burst Mode feature to
manage self heat (Section 6.2.3 “Using Burst Modeto Manage Self-Heat”). Equation 6-1 can also be used
to determine the effect of self-heat.

DS20005426B-page 37

MCP9600
EQUATION 6-1:

EFFECT OF
SELF-HEATING
T

T

6.2.3

 =  JA  V DD  I DD 

 =  J C  V DD  I DD T = TJ– TA

Where:
TJ = Junction Temperature
TA = Ambient Temperature
JA = Package Thermal Resistance- Junction to AmbientJC = Package Thermal Resistance- Junction to CaseAt room temperature (TA = +25°C) with maximum
IDD = 2.5 mA (maximum) and VDD = 3.3V, theself-heating due to power dissipation T is 0.32°C for
the MQFN package.

6.2.2

CONVERSION TIME VS.
SELF-HEAT

Once the ADC completes digitization, the processor initiates the data computation routine for tCALC which also
increases IDD. During the 18-bit ADC conversion time
(3 SPS, Samples per Second), the increased current
lasts for approximately 5% of the one second period.
The effect of self-heat for the total power consumed per
second, including the 5% tCALC period, is negligible.
However, as the ADC resolution is reduced from 18-bit
to 16-bit, the power consuming tCALC period increases
to 20% per second. This change in resolution adds
approximately 0.04°C (typical) temperature error due
to self-heat. Table 6-1 provides an estimate forself-heat for all resolutions using Equation 6-1.
In order to reduce the effects of self heat for lower
resolution settings, the Burst Mode feature isrecommended to manage the effects of self-heat.

TABLE 6-1:
Resolution

ADC RESOLUTION VS.
SELF-HEAT
SPS(typ.)

tCALC Duration
per Second

The Burst mode feature is useful to manage power
dissipation while maintaining the device sensitivity tochanges in temperature (Section 5.2.3 “Device
Configuration Register”). While the device is in low
power, or Shutdown mode, the master controller
executes Burst-mode to sample temperature. The
number of temperature samples and the measurement
resolution settings are selected while executing thecommand. While in Burst-mode, if the temperature
data exceeds the Alert Limits the device asserts thecorresponding Alert Output. The alert outputs are used
so the master controller does not need to continuallypoll the latest temperature data, and potentially
increase the temperature error.
In addition, with some applications monitoring several
hundred degrees of temperature changes, 18-bit
resolution may not be necessary. In this case, a fewer
number of Burst samples with reducing the resolution
enables the user to monitor fast transient temperaturesat the Burst intervals. 12-bit ADC resolution provides
approximately 3°C resolution (for Type K), and a new
sample of temperature data is computed at
approximately 20 ms intervals. Therefore, the numberof Burst mode samples per second can be selected to
manage the effects of self-heat using these estimates.
The temperature conversion status during Burst mode
can also be momentarily polled (using bit 7 of theSection 5.2.1 “Status Register”) to detect whether
the on-going sample bursts are completed. The master
controller may terminate an on-going burst by executing a Shutdown Command or reset the Burst mode bysending another Burst Command.

6.2.4

ALERT OUTPUTSThe Alert outputs are intended to drive high impedanceloads. Typically, the outputs are connected to a microcontroller input pin. However, if the outputs are used todrive indicators, such as LEDs or buzzers, then a buffer
circuit is recommended in order to minimize the effects
of self-heat due to the applied load (see Figure 6-3).

T

18 bit3

5%0.0096°C

16 bit15

20%0.0384°C

14 bit60

80%0.1536°C

12 bit240

100%

0.1920°C

Note:

USING BURST MODE TO MANAGESELF-HEATVDD = 3.3V, and IDD = 1.5 mA (typical).

VDD

Active HighNPN

Alert Output

FIGURE 6-3:

DS20005426B-page 38

Alert Output Buffer.

 2015-2016 Microchip Technology Inc.

MCP9600
6.3

Device Features

6.3.2

I2C ADDRESSING

6.3.1

The MCP9600 supports up to eight devices on the I2C
bus. Applications such as large thermal management
racks with several thermocouple sensor interfaces areable to monitor various temperature zones with minimal
pin-count microcontrollers. This reduces the total solution cost, while providing a highly accurate thermal
management solution using the MCP9600.
VDD

R2B

R2A

®
PIC
microcontroller
Alert
4

ADDR

VIN+

MCP9600
Unit 2/8

VIN-

GND

Types K, J, T,
N, E, B, S, R

The MCP9600 uses a switched-capacitor amplifier
input stage to gain the input signal to a maximum
resolution of 2 µV/LSb at 18-bit ADC setting. Aninternal input capacitor is used for charge storage. The
differential input impedance ZIN_DF is dominated by the
sampling capacitor and the switched-capacitor
amplifier sampling frequency. During sampling period,
the charging and discharging of the sampling capacitor
creates dynamic input currents at the input pins.
Adding a 10-100 nF capacitor between the inputs canimprove stability.
Since the sampling capacitor is only switching to the
input pins during a conversion process, the input
impedance is only valid during conversion periods.
During low-power or Shutdown mode, the input amplifier stage is disabled, therefore the input impedance is
ZIN_CM, which is due to the leakage current from ESD
protection diodes, as shown in Figure 6-5.

Sampling
SwitchUp to eight
MCP9600 on
I2C bus

I2C
VDD

INPUT IMPEDANCE

RSS

VIN+,VIN-SS

RS

R7A R7B
ADDR

CSAMPLE(3.2 pF)

V
VIN+

MCP9600
4Alert

TABLE 6-2:

Unit 7/8
GND

VINTypes K, J, T,
N, E, B, S, R

RECOMMENDEDRESISTOR VALUES FOR
I2C ADDRESSING
ValuesFIGURE 6-5:
6.3.3

Thermocouple Input Stage.

OPEN AND SHORT DETECTION
CIRCUITS

External circuits can be added to detect thethermocouple status as open (physically disconnected)
or as short (thermocouple wire in contact with thesystem ground or VDD). If a passive circuit is added tothe input stage, then the circuit loading effect to the
MCP9600 ADC inputs must be considered. Systemcalibration is also required to ensure proper accuracy.
In addition, external loads can degrade the device
performance, such as input offset, gain, and Integral
Nonlinearity (INL) errors. If a low impedance active
circuit is added, then both offset and gain errors must
be calibrated.

Device #CommandByte

11100 000X

ADDR pin tied to GND

21100 001X

R2A = 10R2B = 2.2

31100 010X

R3A = 10

R3B = 4.3

41100 011X

R4A = 10

R4B = 7.551100 100X

R5A = 10R5B = 1361100 101X

R6A = 10R6B = 226.3.3.1

71100 110X

R7A = 10R7B = 4381100 111X

ADDR pin tied to VDD

For open circuit detection, the Input Range Flag bit,
bit 4 of the Status Register (Register 5-6), can be used
to detect open-circuit conditions. This would require a
few external resistors as shown in Figure 6-6. The
passive circuit does not affect the MCP9600 accuracy(The recommended value for RB set to 10 k. When
the Thermocouple is connected, the input
common-mode voltage is 0.5*VDD. And when the
Thermocouple is disconnected, the voltage at VIN+Note:

RXA (k)RXB (k)Standard 5% tolerance resistors are used in
the table, however, 1% tolerance resistors
provide better ratio matching.

FIGURE 6-4:
Implementation.

I2C Address Selection

 2015-2016 Microchip Technology Inc.

Open-Circuit Detection TechniqueDS20005426B-page 39

MCP9600
input is 0.66*VDD and the voltage at the VIN- input ispulled-down to VSS. This change forces the Input
Range Flag bit to be set. The master controller canmomentarily poll the status bit to detect the open-circuit
condition.
2RB RB VDD

6.3.5

ESD PROTECTION USING FERRITE
BEADSFerrite beads are highly recommended to protect the
MCP9600 and other circuits from ESD discharge
through the thermocouple wire. The beads suppress
fast transient signals such as ESD and can be added
in-line to the ADC inputs, as shown in Figure 6-9.

MCP9600
2RB RB VDD

VIN+

+

MCP9600
Del Sig

Thermocouple+

VIN2RBRB = 10 k

Thermocouple

FIGURE 6-6:
Adding Open-Circuit
Detection Resistors.
6.3.4

+

Thermocouple

RA

VIN+

ADC core
Del Sig

RA

C
VIN-

L

2RB

ALIASING AND ANTI-ALIASINGFILTER

Aliasing occurs when the input signal contains
time-varying signal with frequency greater than half thesample rate. In the aliasing conditions, the ADC canoutput unexpected codes. The ADC integrates a firstorder sinc filter, however, an external anti-aliasing filter
can provide an added filter for high noise applications.
This can be done with a simple RC low-pass filter at the
inputs as shown in Figure 6-7. Open-circuit detection
resistors can also be added as shown in Figure 6-8.

L

FIGURE 6-9:

RA

VIN+

RA

C
VIN-

Del Sig

RB = 10 k
RA = 100
C = 0.1 µF
L = Ferrite Bead

Adding Ferrite Beads.

RA = 100
C = 0.1 µF

Adding a Low-Pass Filter.

FIGURE 6-7:

2RB RB VDD
MCP9600+

Thermocouple

2RB

RA

VIN+

RA

C
VIN-

Del Sig

RB = 10 k
RA = 100
C = 0.1 µF

FIGURE 6-8:
Adding Open-Circuit
Detection Resistors with an Input Low-Pass
Filter.

DS20005426B-page 40

 2015-2016 Microchip Technology Inc.

MCP9600
7.0

PACKAGING INFORMATION

7.1

Package Marking Information

20-Lead MQFN (5x5x1.0 mm)

PIN 1

ExamplePIN 1

Legend: XX...X
Y
YY
WW
NNN

e3

*
Note:

MCP9600
E/MX e^^31520256

Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability codePb-free JEDEC® designator for Matte Tin (Sn)This package is Pb-free. The Pb-free JEDEC designator ( e3 )can be found on the outer packaging for this package.

In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.

 2015-2016 Microchip Technology Inc.

DS20005426B-page 41

MCP9600
20-Lead More Thin Plastic Quad Flat, No Lead Package (NU) - 5x5x1.0 mm Body
[MQFN] - (Also called VQFN)Note:

For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

D
NOTE 1

A

B

N

1
2

E
(DATUM B)(DATUM A)
2X
0.10 C2X

TOP VIEW

0.10 C

0.10 CCSEATING
PLANE

A1

A
20X
(A3)

0.08 CSIDE VIEW
D2

E2
2

K

1

NOTE 1
N

20X b
0.10
0.05

L
e

C A B
C

BOTTOM VIEW
Microchip Technology Drawing C04-186A Sheet 1 of 2

DS20005426B-page 42

 2015-2016 Microchip Technology Inc.

MCP9600
20-Lead More Thin Plastic Quad Flat, No Lead Package (NU) - 5x5x1.0 mm Body
[MQFN] - (Also called VQFN)Note:

For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

Units
Dimension Limits
Number of Pins
N
e
Pitch
A
Overall HeightStandoff
A1
Terminal Thickness
A3
Overall Length
D
Exposed Pad Length
D2
Overall Width
E
Exposed Pad WidthE2bTerminal Width
Terminal Length
L
K
Terminal-to-Exposed-Pad

MIN

0.90
0.00

3.15
3.15
0.25
0.35
0.20

MILLIMETERS
NOM
20
0.65 BSC
0.95
0.02
0.20 REF
5.00 BSC
3.25
5.00 BSC
3.25
0.30
0.40
-

MAX

1.00
0.05

3.35
3.35
0.35
0.45
-

Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-186A Sheet 2 of 2

 2015-2016 Microchip Technology Inc.

DS20005426B-page 43

MCP9600
20-Lead More Thin Plastic Quad Flat, No Lead Package (NU) - 5x5x1.0 mm Body
[MQFN] - (Also called VQFN)Note:

For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

C1
X2
EV
20

1
Y2
C2

ØV

2

G

EV
Y1

E
X1

SILK SCREEN

RECOMMENDED LAND PATTERN
Units
Dimension Limits
Contact Pitch
E
W2
Optional Center Pad Width
Optional Center Pad Length
T2
Contact Pad Spacing
C1
C2
Contact Pad Spacing
Contact Pad Width (X20)
X1
Contact Pad Length (X20)
Y1
Distance Between Pads
G
Thermal Via Diameter
V
Thermal Via PitchEVMIN

MILLIMETERS
NOM
0.65 BSC

MAX
3.35
3.35

4.50
4.50
0.40
0.55
0.20
0.30
1.00

Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
Microchip Technology Drawing C04-286B

DS20005426B-page 44

 2015-2016 Microchip Technology Inc.

MCP9600
APPENDIX A:REVISION HISTORY

Revision B (June 2016)
The following is the list of modifications:
1.
2.
3.

4.

Corrected the pin description error for pins 19
and 20 on page 1.
Added the MCP9600 Evaluation Board picture
on page 2.
Added Section 6.3.3.1 “Open-Circuit Detection Technique” and updated Section 6.3.4“Aliasing and Anti-Aliasing Filter” andSection 6.3.5 “ESD Protection using Ferrite
Beads”.
Updated the Product Identification System
section.

Revision A (August 2015)• Original release of this document.

 2015-2016 Microchip Technology Inc.

DS20005426B-page 45

MCP9600
NOTES:

DS20005426B-page 46

 2015-2016 Microchip Technology Inc.

MCP9600
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.(1)[X](2)X/XX

DeviceTape and Reel
OptionTemperature
Range

Package

Device:

MCP9600: Signal Conditioning IC(1)MCP9600T: Signal Conditioning IC(1) (Tape and Reel)

Tape and Reel
Option:T

Examples:a)

MCP9600-E/MX:b)

MCP9600T-E/MX:

Extended temperature,
20LD MQFN package
Tape and Reel,
Extended temperature,
20LD MQFN package= Tape and Reel(2)Note 1:

Temperature Range:E= -40°C to +125°C

Package:

MX = More Thin Plastic Quad Flat, MQFN, 20-lead 2015-2016 Microchip Technology Inc.

2:

For custom Thermocouple Types or custom
features, please contact your local Microchip
sales office. Minimum purchase volumes are
required.
Tape and Reel identifier only appears in the
catalog part number description. This
identifier is used for ordering purposes and is
not printed on the device package. Check
with your Microchip Sales Office for package
availability with the Tape and Reel option.

DS20005426B-page 47

MCP9600
NOTES:

DS20005426B-page 48

 2015-2016 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:•

Microchip products meet the specification contained in their particular Microchip Data Sheet.

•

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in theintended manner and under normal conditions.

•

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to ourknowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

•

Microchip is willing to work with the customer who is concerned about the integrity of their code.

•

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does notmean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such actsallow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device
applications and the like is provided only for your convenienceand may be superseded by updates. It is your responsibility toensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely atthe buyer’s risk, and the buyer agrees to defend, indemnify andhold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses areconveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.

Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,
SST, SST Logo, SuperFlash and UNI/O are registeredtrademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch areregistered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O,
Total Endurance, TSHARC, USBCheck, VariSense,
ViewSpan, WiperLock, Wireless DNA, and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark ofMicrochip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of theirrespective companies.
© 2015-2016, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
ISBN: 978-1-5224-0655-6

QUALITY MANAGEMENT SYSTEMCERTIFIED BY DNV== ISO/TS 16949 == 2015-2016 Microchip Technology Inc.

Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler andTempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and proceduresare for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory andanalog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.

DS20005426B-page 49

Worldwide Sales and Service
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Tel: 774-760-0087
Fax: 774-760-0088

China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500

ChicagoItasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
DallasAddison, TX
Tel: 972-818-7423
Fax: 972-818-2924
DetroitNovi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509

China - Dongguan
Tel: 86-769-8702-9880
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116

Germany - KarlsruheTel: 49-721-625370

India - Pune
Tel: 91-20-3019-1500

Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44

Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310

Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781

Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771

Italy - Venice
Tel: 39-049-7625286

Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302

Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340

China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431

Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934

China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470

Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859

China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205

Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068

China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066

Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069

China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393

Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850

China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760

Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955

China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118

Taiwan - Kaohsiung
Tel: 886-7-213-7828

China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256

Poland - Warsaw
Tel: 48-22-3325737
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820

Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
07/14/15

DS20005426B-page 50

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