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HDC1080
SNAS672A – NOVEMBER 2015 – REVISED JANUARY 2016

HDC1080 Low Power, High Accuracy Digital Humidity Sensor with Temperature Sensor
1 Features

3 Description

•
•
•
•
•
•

The HDC1080 is a digital humidity sensor withintegrated temperature sensor that provides excellent
measurement accuracy at very low power. The
HDC1080 operates over a wide supply range, and isa low cost, low power alternative to competitive
solutions in a wide range of common applications.
The humidity and temperature sensors are factory
calibrated.

1

•
•
•

Relative Humidity Accuracy ±2% (typical)
Temperature Accuracy ±0.2°C (typical)
Excellent Stability at High Humidity
14 Bit Measurement Resolution
100 nA Sleep Mode Current
Average Supply Current:– 710 nA @ 1sps, 11 bit RH Measurement– 1.3 µA @ 1sps, 11 bit RH and Temperature
Measurement
Supply Voltage 2.7 V to 5.5 V
Small 3 mm x 3 mm Device Footprint
I2C Interface

Device Information (1)PART
NUMBER
HDC1080

PACKAGEBODY SIZE (NOM)

PWSON (6-pin) DMB

3.00 mm x 3.00 mm(1) For all available packages, see the orderable addendum atthe end of the datasheet.

2 Applications
•
•
•
•
•
•
•

HVAC
Smart Thermostats and Room Monitors
White Goods
Printers
Handheld Meters
Medical Devices
Wireless Sensor (TIDA: 00374, 00484, 00524)

4 Typical Application
3.3 V
RH

HDC1080ADC

TEMPERATURE

3.3 V

VDD

Registers
+
Logic

MCU
SDA
SCL

I2C

3.3 V

VDD

2

IC
Peripheral

OTP
Calibration Coefficients
GND

GND

1

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

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Table of Contents
1
2
3
4
5
6
7

Features .................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Typical Application ................................................ 1
Revision History..................................................... 2
Pin Configuration and Functions ......................... 3
Specifications......................................................... 4
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8

8

Absolute Maximum Ratings ...................................... 4
ESD Ratings.............................................................. 4
Recommended Operating Conditions....................... 4
Thermal Information ................................................. 4
Electrical Characteristics........................................... 5
I2C Interface Electrical Characteristics ..................... 6
I2C Interface Timing Requirements ........................ 6
Typical Characteristics .............................................. 7

Detailed Description .............................................. 9
8.1 Overview ................................................................... 9
8.2 Functional Block Diagram ......................................... 9
8.3 Feature Description................................................... 9

8.4 Device Functional Modes.......................................... 9
8.5 Programming........................................................... 10
8.6 Register Map .......................................................... 14

9

Application and Implementation ........................ 17
9.1 Application Information............................................ 17
9.2 Typical Application ................................................. 17
9.3 Implementation and Usage Recommendations ..... 18

10 Power Supply Recommendations ..................... 19
11 Layout................................................................... 19
11.1 Layout Guidelines ................................................ 19
11.2 Layout Example .................................................... 19

12 Device and Documentation Support ................. 21
12.1
12.2
12.3
12.4
12.5

Documentation Support ........................................ 21
Community Resources.......................................... 21
Trademarks ........................................................... 21
Electrostatic Discharge Caution ............................ 21
Glossary ................................................................ 21

13 Mechanical, Packaging, and Orderable
Information ........................................................... 21

5 Revision History
Changes from Original (November 2015) to Revision A
•

2

Page

Product Preview to Production Data Release ....................................................................................................................... 1

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6 Pin Configuration and Functions
DMB Package
6 Pin PWSONTop View

Top View
SDA

1

GND

2

6

SCL

5

VDD

4

NC

RH
SENSORNC

3

Pin Functions
PIN

I/O TYPE (1)DESCRIPTION

NAME

NO.

SDA

1

I/O

Serial data line for I2C, open-drain; requires a pull-up resistor to VDD

GND

2

G

GroundNC

3,4-These pins may be left floating, or connected to GND

VDD

5

P

Supply Voltage

SCL

6

I

Serial clock line for I2C, open-drain; requires a pull-up resistor to VDD

DAP

DAP

-

Die Attach Pad. Should be left floating. (On bottom of the device, not shown in the figure)(1)

P=Power, G=Ground, I=Input, O=Output

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7 Specifications
7.1 Absolute Maximum Ratings (1)Input Voltage
Storage Temperature
(1)

MIN

MAX

VDD

-0.3

6

SCL

-0.3

6

SDA

-0.3

6

TSTG

-65

150

UNIT
V
°C

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings
VALUE
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
V(ESD)(1)(2)

Electrostatic discharge

(1)

UNIT

±2000

Charged-device model (CDM), per JEDEC specification JESD22C101 (2)

V

±500

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions
over operating range (unless otherwise noted)
MIN

NOM
3

MAX

UNIT

VDD

Supply Voltage

2.7

5.5

V

TA, Temperature sensor

Ambient Operating Temperature

-40

125

°C

TA, Humidity sensor (1)Ambient Operating Temperature

-20

70

°C

Functional Operating Temperature

-20

85

°C

TA, Humidity sensor
(1)

(1)

See Figure 2.

7.4 Thermal Information
HDC1080
THERMAL METRIC (1)PWSON (DMB)UNIT

6 PINS
RθJA

Junction-to-ambient thermal resistance

49.4

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

29.8

°C/W

RθJB

Junction-to-board thermal resistance

23.1

°C/W

ψJT

Junction-to-top characterization parameter

3.3

°C/W

ψJB

Junction-to-board characterization parameter

23.1

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

4.2

°C/W

(1)

4

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.

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7.5 Electrical Characteristics (1)The electrical ratings specified in this section apply to all specifications in this document, unless otherwise noted. TA = 30°C,
RH = 40%, and VDD = 3V.
TEST CONDITION (2)TYP (4)

MAX (3)UNIT

RH measurement, bit 12 of 0x02 register =
0 (5)

190

220

µA

Temperature measurement, bit 12 of 0x02
register = 0 (5)

160

185

µA

Sleep Mode

100

200

nA

Average @ 1 measurement/second, RH (11bit), bit 12 of 0x02 register = 0 (5) (6)

710

nA

Average @ 1 measurement/second, Temp
(11 bit), bit 12 of 0x02 register = 0 (5) (6)

590

nA

Average @ 1 measurement/second, RH(11bit) +temperature (11 bit), bit 12 of 0x02
register = 1 (5) (6)

1.3

µA

Startup (average on Start-up time)

300

µA

Peak current

7.2

mA

Average @ 1 measurement/second, RH(11bit) +temperature (11 bit), bit 12 of 0x02
register = 1 (5) (6)

50

µA

±2

%RH

PARAMETER

MIN (3)POWER CONSUMPTION
IDD

IHEAT

Supply Current

Heater Current (7)RELATIVE HUMIDITY SENSOR
RHACCAccuracy

Refer to Figure 2 in Typical Characteristics
section.

RHREP

Repeatability (7)14 bit resolution

±0.1

%RH

RHHYS

Hysteresis (8)10% ≤ RH ≤ 70%

±1

%RH

(9)

RHRT

Response Time

RHCT

Conversion Time (7)

(10)

15

s

8 bit resolution

2.50

ms

11 bit resolution

3.85

ms

t 63%

14 bit resolution
RHOR

Operating Range (11)RHLTDLong Term Drift (12)Non-condensing

6.50
0

ms
100

±0.25

%RH
%RH/yr

TEMPERATURE SENSORTEMPACC

Accuracy (7)5°C < TA< 60°C

±0.2

TEMPREP

Repeatability (7)14 bit resolution

±0.1

°C

TEMPCT

Conversion Time (7)11 bit accuracy

3.65

ms

14 bit accuracy

6.35

ms

±0.4

°C

(1)

Electrical Characteristics Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions
result in very limited self-heating of the device such that TJ = TA. No guarantee of parametric performance is indicated in the electricaltables under conditions of internal self-heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond
which the device may be permanently degraded, either mechanically or electrically.
(2) Register values are represented as either binary (b is the prefix to the digits), or hexadecimal (0x is the prefix to the digits). Decimalvalues have no prefix.
(3) Limits are ensured by testing, design, or statistical analysis at 30°C. Limits over the operating temperature range are ensured throughcorrelations using statistical quality control (SQC) method.
(4) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may varyover time and will also depend on the application and configuration. The typical values are not tested and are not guaranteed on
shipped production material.
(5) I2C read/write communication and pull-up resistors current through SCL and SDA not included.
(6) Average current consumption while conversion is in progress.
(7) This parameter is specified by design and/or characterization and it is not tested in production.
(8) The hysteresis value is the difference between an RH measurement in a rising and falling RH environment, at a specific RH point.
(9) Actual response times will vary dependent on system thermal mass and air-flow.
(10) Time for the RH output to change by 63% of the total RH change after a step change in environmental humidity.
(11) Recommended humidity operating range is 10% to 70% RH. Prolonged operation outside this range may result in a measurement
offset. The measurement offset will decrease after operating the sensor in this recommended operating range.
(12) Drift due to aging effects at typical conditions (30°C and 20% to 50% RH). This value may be impacted by dust, vaporized solvents, outgassing tapes, adhesives, packaging materials, etc.
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7.6 I2C Interface Electrical Characteristics
At TA=30°C, VDD=3V (unless otherwise noted)
PARAMETERTEST CONDITION

MIN

TYP

MAX

UNIT

I2C INTERFACE VOLTAGE LEVEL
VIH

Input High Voltage

VIL

Input Low Voltage

VOL

Output Low Voltage

0.7xVDD
Sink current 3mA

(1)

HYS

Hysteresis

CIN

Input Capacitance on all digital pins

(1)V
0.3xVDD

V

0.4

V

0.1xVDD

V
0.5

pF

This parameter is specified by design and/or characterization and it is not tested in production.

7.7

I2C Interface Timing Requirements
PARAMETERTEST CONDITION

MIN

NOM

MAX

UNIT

400

kHz

I2C INTERFACE VOLTAGE LEVELfSCLClock Frequency

10

tLOW

Clock Low Time

1.3

µs

tHIGH

Clock High Time

0.6

µs

tSP

Pulse width of spikes that must be
suppressed by the input filter (1)tSTART

Device Start-up time

(1)
(2)

From VDD ≥ 2.7 V to ready for aconversion (1) (2)

10

50

ns

15

ms

This parameter is specified by design and/or characterization and it is not tested in production.
Within this interval it is not possible to communicate to the device.

SDA
tLOW
tSP

SCL
tHIGH

START

REPEATED
START

STOP

START

Figure 1. I2C Timing

6

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7.8 Typical Characteristics
Unless otherwise noted. TA = 30°C, VDD = 3V.
10

1
0.9

8

0.8

7

0.7

Accuracy (r°C)

RH Accuracy (+/- %RH)

TypicalTypical

9

6
5
4

0.6
0.5
0.4

3

0.3

2

0.2

1

0.1
0
-40

0
0

10

20

30

40

50
60
RH (%)

70

80

90

100

5

20

35

50

65

80

95

110

125

D001

Figure 3. Temperature Accuracy vs. Temperature

300

300

T= -20°C
T= 25°C
T= 40°C
T= 85°C
T= 125°C

275
250

250

225

225

200

200

175

175

150

150

125

125

100
2.7

Vdd=2.7V
Vdd=3V
Vdd=3.3V
Vdd=5V275

Idd (PA)Idd (PA)-10

Temp (°C)

Figure 2. RH Accuracy vs. RH

100

3

3.3

3.6

3.9

4.2

4.5

4.8

5

0

25

50

75

100

125

Vdd (V)

Temp (°C)

Figure 4. Supply Current vs. Supply Voltage, RH
Measurement Active

Figure 5. Supply Current vs. Temperature, RH Measurement
Active

300
275

300

T= -20°C
T= 25°C
T= 40°C
T= 85°C
T= 125°C

250

250

225

225

200

200

175

175

150

150

125

125

100
2.7

Vdd=2.7V
Vdd=3V
Vdd=3.3V
Vdd=5V275

Idd (PA)Idd (PA)

-25

100

3

3.3

3.6

3.9

4.2

4.5

4.8

5

0

25

50

75

100

125

Vdd (V)

Temp (°C)

Figure 6. Supply Current vs. Supply Voltage, Temp
Measurement Active

Figure 7. Supply Current vs. Temperature, Temp
Measurement Active
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Typical Characteristics (continued)
Unless otherwise noted. TA = 30°C, VDD = 3V.
1200

1000

1200

T= -20°C
T= 25°C
T= 40°C
T= 85°C
T= 125°C

1000

8

800

Idd (nA)

Idd (nA)

800

600

600

400

400

200

200

0
2.7

Vdd=2.7V
Vdd=3V
Vdd=3.3V
Vdd=5V

0

3

3.3

3.6

3.9

4.2

4.5

4.8

5

0

25

50

75

100

125

Vdd (V)

Temp (°C)

Figure 8. Supply Current vs. Supply Voltage, Sleep Mode

Figure 9. Supply Current vs. Temperature, Sleep Mode

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8 Detailed Description
8.1 Overview
The HDC1080 is a digital humidity sensor with integrated temperature sensor that provides excellent
measurement accuracy at very low power. The sensing element of the HDC1080 is placed on the top part of thedevice. Measurement results can be read out through the I2C compatible interface. Resolution is based on themeasurement time and can be 8, 11, or 14 bits for humidity; 11 or 14 bits for temperature.

8.2 Functional Block Diagram
RH

HDC1080ADC

TEMPERATURE

VDDRegisters
+
Logic

SDA
SCL
I2C

OTP
Calibration CoefficientsGND

8.3 Feature Description
8.3.1 Power Consumption
One of the key features of the HDC1080 is its low power consumption, which makes the device suitable inbattery or power harvesting applications. In these applications the HDC1080 spends most of the time in sleep
mode: with a typical 100nA of current consumption in sleep mode, the averaged current consumption is minimal.
Its low consumption in measurement mode minimizes any self-heating.
8.3.2 Voltage Supply Monitoring
The HDC1080 monitors the supply voltage level and indicates when the voltage supply of the HDC1080 is lessthan 2.8V. This information is useful in battery-powered systems in order to inform the user to replace thebattery. This is reported in the BTST field (register address 0x02:bit[11]) which is updated after POR and after
each measurement request.
8.3.3 Heater
The heater is an integrated resistive element that can be used to test the sensor or to drive condensation off thesensor. The heater can be activated using HEAT, bit 13 in the Configuration Register. The heater helps in
reducing the accumulated offset after long exposure at high humidity conditions.
Once enabled the heater is turned on only in the measurement mode. To accelerate the temperature increase itis suggested to increase the measurement data rate.

8.4 Device Functional Modes
The HDC1080 has two modes of operation: sleep mode and measurement mode. After power up, the HDC1080
is in sleep mode. In this mode, the HDC1080 waits for I2C input including commands to configure the conversion
times, read the status of the battery, trigger a measurement, and read measurements. Once it receives acommand to trigger a measurement, the HDC1080 moves from sleep mode to measurement mode. Aftercompleting the measurement the HDC1080 returns to sleep mode.

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8.5 Programming
8.5.1 I2C Interface
The HDC1080 operates only as a slave device on the I2C bus interface. It is not allowed to have on the I2C bus
multiple devices with the same address. Connection to the bus is made via the open-drain I/O lines, SDA, andSCL. The SDA and SCL pins feature integrated spike-suppression filters and Schmitt triggers to minimize theeffects of input spikes and bus noise. After power-up, the sensor needs at most 15 ms, to be ready to start RH
and temperature measurement. During this power-up time the HDC1080 is only able to provide the content of theserial number registers (0xFB to 0xFF) if requested. After the power-up the sensor is in the sleep mode until acommunication or measurement is performed. All data bytes are transmitted MSB first.
8.5.1.1 Serial Bus Address
To communicate with the HDC1080, the master must first address slave devices via a slave address byte. The
slave address byte consists of seven address bits, and a direction bit that indicates the intent to execute a reador write operation. The I2C address of the HDC1080 is 1000000 (7-bit address).
8.5.1.2 Read and Write Operations
To access a particular register on the HDC1080, write the desired register address value to the Pointer Register.
The pointer value is the first byte transferred after the slave address byte with the R/W bit low. Every write
operation to the HDC1080 requires a value for the pointer register (refer to Figure 10).
When reading from the HDC1080, the last value stored in the pointer by a write operation is used to determine
which register is accessed by a read operation. To change the pointer register for a read operation, a new value
must be written to the pointer register. This transaction is accomplished by issuing the slave address byte with
the R/W bit low, followed by the pointer byte. No additional data is required (refer to Figure 11).
The master can then generate a START condition and send the slave address byte with the R/W bit high toinitiate the read command. Note that register bytes are sent MSB first, followed by the LSB. A write operation ina read-only register such as (DEVICE ID, MANUFACTURER ID, SERIAL ID) returns a NACK after each databyte; read/write operation to unused address returns a NACK after the pointer; a read/write operation withincorrect I2C address returns a NACK after the I2C address.
1

9

1

9

SCL

SDA

A6

A5

A4

A3

A2

A1

A0

P7

R/W

Start byMaster

P6

P5

P4

P3

P2

P1

P0

Ack bySlave

Ack bySlave

Frame 17-bit Serial Bus Address Byte

Frame 2
Pointer Register Byte

1

9

1

9

SCL

SDA

D15

D14

D13

D12

D11

D10

D9

D8

D7

D6

D5

D4

D3

D2

D1

Ack bySlave
Frame 3
Data MSB from
MASTERD0
Ack bySlave

Stop byMasterFrame 4
Data LSB from
MASTER

Figure 10. Writing Frame (Configuration Register)

10

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Programming (continued)
1

9

1

9

SCL
SDA

A6

A5

A4

A3

A2

A1

A0 R/W

Start byMaster

P7

P6

P5

P4

P3

P2

P1

P0
Ack bySlave

Ack bySlave
Frame 1

Frame 27-bit Serial Bus Address Byte

Pointer Register Byte

1

9

1

9

1

9

SCL
A6

SDA

A5

A4

A3

A2

A1

D15 D14 D13 D12 D11 D10

A0 R/W

Start byMasterD9

D8

Ack by
Slave

D7

D6

D5

D4

D3

D2

Frame 3

D0
Nack by Stop by
Master MasterAck byMasterFrame 4
Data MSB fromSlave

7-bit Serial Bus Address Byte

D1

Frame 5
Data LSB from
Slave

Figure 11. Reading Frame (Configuration Register)
8.5.1.3 Device Measurement Configuration
By default the HDC1080 will first perform a temperature measurement followed by a humidity measurement. On
power-up, the HDC1080 enters a low power sleep mode and is not actively measuring. Use the following steps
to perform a measurement of both temperature and humidity and then retrieve the results:
1. Configure the acquisition parameters in register address 0x02:(a) Set the acquisition mode to measure both temperature and humidity by setting Bit[12] to 1.
(b) Set the desired temperature measurement resolution:– Set Bit[10] to 0 for 14 bit resolution.
– Set Bit[10] to 1 for 11 bit resolution.
(c) Set the desired humidity measurement resolution:– Set Bit[9:8] to 00 for 14 bit resolution.
– Set Bit[9:8] to 01 for 11 bit resolution.
– Set Bit[9:8] to 10 for 8 bit resolution.
2. Trigger the measurements by executing a pointer write transaction with the address pointer set to 0x00.
Refer to Figure 12.
3. Wait for the measurements to complete, based on the conversion time (refer to Electrical Characteristics (1)for the conversion time).
4. Read the output data:
Read the temperature data from register address 0x00, followed by the humidity data from register address
0x01 in a single transaction as shown in Figure 14. A read operation will return a NACK if the contents of theregisters have not been updated as shown in Figure 13.
To perform another acquisition with the same measurement configuration simply repeat steps 2 through 4.
If only a humidity or temperature measurement is desired, the following steps will perform a measurement andretrieve the result:
1. Configure the acquisition parameters in register address 0x02:(a) Set the acquisition mode to independently measure temperature or humidity by setting Bit[12] to 0.
(b) For a temperature measurement, set the desired temperature measurement resolution:– Set Bit[10] to 0 for 14 bit resolution.
– Set Bit[10] to 1 for 11 bit resolution.
(1)

Electrical Characteristics Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions
result in very limited self-heating of the device such that TJ = TA. No guarantee of parametric performance is indicated in the electricaltables under conditions of internal self-heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond
which the device may be permanently degraded, either mechanically or electrically.
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Programming (continued)(c) For a humidity measurement, set the desired humidity measurement resolution:– Set Bit[9:8] to 00 for 14 bit resolution.
– Set Bit[9:8] to 01 for 11 bit resolution.
– Set Bit[9:8] to 10 for 8 bit resolution.
2. Trigger the measurement by executing a pointer write transaction. Refer to Figure 12– Set the address pointer to 0x00 for a temperature measurement.
– Set the address pointer to 0x01 for a humidity measurement.
3. Wait for the measurement to complete, based on the conversion time (refer to Electrical Characteristics (1) forthe conversion time).
4. Read the output data:
Retrieve the completed measurement result from register address 0x00 or 0x01, as appropriate, as shown in
Figure 11. A read operation will return a NACK if the measurement result is not yet available, as shown in
Figure 13.
To perform another acquisition with the same measurement configuration repeat steps 2 through 4.
It is possible to read the output registers (addresses 0x00 and 0x01) during a Temperature or Relative Humidity
measurement without affecting any ongoing measurement. Note that a write to address 0x00 or 0x01 while ameasurement is ongoing will abort the ongoing measurement.
1

9

1

9

SCL
SDA

A6

A5

A4

A3

A2

A1

A0 R/W

Start byMaster

P7

P6

P5

P4

P3

P2

P1

P0
Ack bySlave

Ack bySlave
Frame 1

Frame 27-bit Serial Bus Address Byte

Pointer Register Byte

Figure 12. Trigger Humidity/Temperature Measurement
1

9

SCL
A6

SDA

A5

A4

A3

A2

A1

A0 R/W

Start byMasterNack bySlave
Frame 3
7-bit Serial Bus Address Byte

Figure 13. Read Humidity/Temperature Measurement (Data Not Ready)12

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Programming (continued)
1

1

9

9

1

9

SCL
A6

SDA

A5

A4

A3

A2

A1

D15 D14 D13 D12 D11 D10

A0 R/W

Start byMasterD9

D8

Ack by
Slave

D7

D6

Frame 3
7-bit Serial Bus Address Byte

9

D4

D3

D2

D1

D0

Ack byMaster

Ack byMasterFrame 4
Data MSB from
Slave

1

D5

Frame 5
Data LSB from
Slave

1

9

SCL
SDA

D15 D14 D13 D12 D11 D10

D9

D8

D7

D6

D5

D4

D3

D2

D1

Frame 6
Data MSB from
Slave

D0
Nack by Stop by
Master MasterAck byMasterFrame 7
Data LSB from
Slave

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8.6 Register Map
The HDC1080 contains data registers that hold configuration information, temperature and humidity
measurement results, and status information.
Table 1. Register Map
Pointer

Name

Reset value

Description

0x00

Temperature

0x0000Temperature measurement output

0x01

Humidity

0x0000Relative Humidity measurement output

0x02

Configuration

0x1000

HDC1080 configuration and status

0xFB

Serial ID

device dependentFirst 2 bytes of the serial ID of the part

0xFC

Serial ID

device dependent

Mid 2 bytes of the serial ID of the part

0xFD

Serial ID

device dependent

Last byte bit of the serial ID of the part

0xFE

Manufacturer ID

0x5449ID of Texas Instruments

0xFF

Device ID

0x1050

ID of the device

Registers addresses 0x03 to 0xFA are reserved and should not be written.
The HDC1080 has an 8-bit pointer used to address a given data register. The pointer identifies which of the dataregisters should respond to a read or write command on the two-wire bus. This register is set with every write
command. A write command must be issued to set the proper value in the pointer before executing a readcommand. The power-on reset (POR) value of the pointer is 0x00, which selects a temperature measurement.
8.6.1 Temperature Register
The temperature register is a 16-bit result register in binary format (the 2 LSBs D1 and D0 are always 0). The
result of the acquisition is always a 14 bit value. The accuracy of the result is related to the selected conversion
time (refer to Electrical Characteristics (1)). The temperature can be calculated from the output data with:§ TEMPERATURE>15:00@ ·Temperature(qC) ¨¸ *165qC - 40qC
216©
¹

Table 2. Temperature Register Description (0x00)
Name

Bits

TEMPERATURE(1)Description[15:02]Temperature

Temperature measurement (read only)[01:00]Reserved

Reserved, always 0 (read only)

Electrical Characteristics Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions
result in very limited self-heating of the device such that TJ = TA. No guarantee of parametric performance is indicated in the electricaltables under conditions of internal self-heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond
which the device may be permanently degraded, either mechanically or electrically.

8.6.2 Humidity Register
The humidity register is a 16-bit result register in binary format (the 2 LSBs D1 and D0 are always 0). The resultof the acquisition is always a 14 bit value, while the accuracy is related to the selected conversion time (refer toElectrical Characteristics (1)). The humidity can be calculated from the output data with:§ HUMIDITY >15 :00 @ ·Relative Humidity(% RH) ¨¸ *100%RH
216©
¹

Table 3. Humidity Register Description (0x01)
Name

Bits

HUMIDITY(1)

14

Description[15:02]

Relative
Humidity

Relative Humidity measurement (read only)[01:00]Reserved

Reserved, always 0 (read only)

Electrical Characteristics Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions
result in very limited self-heating of the device such that TJ = TA. No guarantee of parametric performance is indicated in the electricaltables under conditions of internal self-heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond
which the device may be permanently degraded, either mechanically or electrically.
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8.6.3 Configuration Register
This register configures device functionality and returns status.
Table 4. Configuration Register Description (0x02)
NAME
RST

Bits
[15]

DESCRIPTION
Software resetbit0

Normal Operation, this bit self clears

1

Software Reset

Reserved[14]

Reserved

0

Reserved, must be 0

HEAT

[13]

Heater0

Heater Disabled

1

Heater Enabled

MODE

[12]

Mode ofacquisition0

Temperature or Humidity is acquired.

1

Temperature and Humidity are acquired in sequence, Temperature first.

BTST

[11]

Battery Status

0

Battery voltage > 2.8V (read only)

1

Battery voltage < 2.8V (read only)

Temperature
Measurement
Resolution

0

14 bit1

11 bitHumidity
Measurement
Resolution

00

14 bit01

11 bit

10

8 bit

0

Reserved, must be 0

TRES

HRES

Reserved

[10]

[9:8]

[7:0]

Reserved

8.6.4 Serial Number Registers
These registers contain a 40bit unique serial number for each individual HDC1080.
Table 5. Serial Number Register Description (0xFB)
Name
SERIAL ID[40:25]

Bits[15:0]

Description
Serial Id bits

Device Serial Number bits from 40 to 25 (read only)

Table 6. Serial Number Register Description (0xFC)
Name
SERIAL ID[24:9]

Bits[15:0]

Description
Serial Id bits

Device Serial Number bits from 24 to 9(read only)

Table 7. Serial Number Register Description (0xFD)
Name
SERIAL ID[8:0]

Bits

Description[15:7]

Serial Id bits

Device Serial Number bits from 8 to 0 (read only)[6:0]

Reserved

Reserved, always 0 (read only)

8.6.5 Manufacturer ID Register
This register contains a factory-programmable identification value that identifies this device as being
manufactured by Texas Instruments. This register distinguishes this device from other devices that are on thesame I2C bus. The manufacturer ID reads 0x5449.
Table 8. Manufacturer ID Register Description (0xFE)
Name
MANUFACTURER
ID

Bits[15:0]

Description
Manufacturer
ID0x5449Texas instruments ID (read only)

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8.6.6 Device Register ID
This register contains a factory-programmable identification value that identifies the device. This register
distinguishes this device from other devices that are on the same I2C bus. A reading of the Device ID register
returns 0x1050.
Table 9. Device ID Register Description (0xFF)
Name

Bits

DEVICE ID

16[15:0]

Description
Device ID

0x1050Device ID (read only)

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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.

9.1 Application Information
An HVAC system thermostat control is based on environmental sensors and a micro-controller. The
microcontroller acquires data from humidity sensors and temperature sensors and controls the heating/coolingsystem. The collected data are then shown on a display that can be easily controlled by the micro controller.
Based on data from the humidity and temperature sensor, the heating/cooling system then maintains theenvironment at customer-defined preferred conditions.

9.2 Typical Application
In a battery-powered HVAC system thermostat, one of the key parameters in the selection of components is thepower consumption. The HDC1080, with 1.3μA of current consumption (average consumption over 1s for RH
and Temperature measurements), in conjunction with an MSP430, represents an excellent choice for low power
consumption, which extends the battery life. A system block diagram of a battery powered thermostat is shown in
Figure 15.
Display
T emp 29°C-

Lithium Ion
Battery

RH 40%+TPL5110
VDD

TIME xx:xx

EN/
ONE_SHOT

Date xx/xx/xxxx

DRV
DELAY/
M_DRIVE
DONE
GND

Keyboard
RH

VDD

HDC1080

ADC

Temperature

Registers
+
Logic

VDD
SDA
SCL

GND

ButtonI2C
Peripheral

I2C

OTP
Calibration Coefficients

MCU

GPIO
GPIO
GPIO
GPIO
GPIO

GPIO
GND

ButtonButtonTo Airconditioning
SystemFigure 15. Typical Application Schematic HVAC
9.2.1 Design Requirements
In order to correctly sense the ambient temperature and humidity, the HDC1080 should be positioned away fromheat sources on the PCB. Generally, it should not be close to the LCD and battery. Moreover, to minimize any
self-heating of the HDC1080 it is recommended to acquire at a maximum sample rate of 1sps (RH + Temp). In
home systems, humidity and the temperature monitoring rates of less than 1sps (even 0.5sps or 0.2sps) can be
still effective.

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Typical Application (continued)
9.2.2 Detailed Design Procedure
When a circuit board layout is created from the schematic shown in Figure 15 a small circuit board is possible.
The accuracy of a RH and temperature measurement depends on the sensor accuracy and the setup of thesensing system. The HDC1080 samples relative humidity and temperature in its immediate environment, it istherefore important that the local conditions at the sensor match the monitored environment. Use one or more
openings in the physical cover of the thermostat to obtain a good airflow even in static conditions. Refer to thelayout below ( Figure 18) for a PCB layout which minimizes the thermal mass of the PCB in the region of the
HDC1080, which can improve measurement response time and accuracy.
9.2.3 Application Curve
The data shown below was acquired with the HDC1080EVM. A humidity chamber was used to control theenvironment.

Figure 16. RH vs. Time

9.3 Implementation and Usage Recommendations
9.3.1 Soldering
When soldering the HDC1080 use the standard soldering profile IPC/JEDEC J-STD-020 with peak temperaturesof 260 °C.
When soldering the HDC1080 it is mandatory to use no-clean solder paste and no board wash should beapplied. The HDC1080 should be limited to a single IR reflow and no rework is recommended.
9.3.2 Chemical Exposure and Sensor Protection
The humidity sensor is not a standard IC and therefore should not be exposed to particulates or volatile
chemicals such as solvents or other organic compounds. If any type of protective coating must be applied to thecircuit board, the sensor must be protected during the coating process.
9.3.3 High Temperature and Humidity Exposure
Long exposure outside the recommended operating conditions may temporarily offset the RH output. Table 10shows the RH offset values that can be expected for exposure to 85 °C and 85 % RH for durations between 12
and 500 hours (continuous).

18

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Table 10. Induced RH Offset Due to Extended Exposure to High Humidity and High Temperature(85°C/85% RH)
85°C/85% RH Duration (hours)

12

24

168

500

RH Offset (%)

3

6

12

15

When the sensor is exposed to less severe conditions, Figure 17 shows the typical RH offset at othercombinations of temperature and RH.
100
±6%

±4%

90

RH Offset (%)

80
70

±5%

±3%

60
50
40

±2%

±4%

30
20
10
±3%

0
10

20

30

40

50

60

70

Temperature (°C)

Figure 17. Relative Humidity Accuracy vs Temperature

10 Power Supply Recommendations
The HDC1080 requires a voltage supply within 2.7V and 5.5V. A multilayer ceramic bypass X7R capacitor of
0.1µF between the VDD and GND pins is recommended.

11 Layout11.1 Layout Guidelines
The Relative Humidity sensor element is located on the top side of the package.
It is recommended to isolate the sensor from the rest of the PCB by eliminating copper layers below the device(GND, VDD) and creating a slot into the PCB around the sensor to enhance thermal isolation.

11.2 Layout Example
The only component next to the device is the supply bypass capacitor. Since the relative humidity is dependent
on the temperature, the HDC1080 should be positioned away from hot spots present on the board, such as abattery, display or micro-controller. Slots around the device can be used to reduce the thermal mass, for aquicker response to environmental changes. The DAP may be soldered to a floating pad on the board, but theboard pad should NOT be connected to GND.

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Layout Example (continued)

Figure 18. Layout

20

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SNAS672A – NOVEMBER 2015 – REVISED JANUARY 201612 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
Texas Instruments Humidity Sensors, SNAA216, provides a general description of humidity sensing andimportant design guidelines.
Humidity and Temp Sensor Node for Star Networks Enabling 10+ Year Coin Cell Battery Life Ref Design TIDA00374
Humidity and Temp Sensor Node for Sub-1GHz Star Networks Enabling 10+ Year Coin Cell Battery Life TIDA00484
Ultralow Power Multi-sensor Data Logger with NFC Interface Reference Design TIDA-00524

12.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms ofUse.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools andcontact information for technical support.

12.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.

12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the mostcurrent data available for the designated devices. This data is subject to change without notice and revision ofthis document. For browser-based versions of this data sheet, refer to the left-hand navigation.

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PACKAGE OPTION ADDENDUM

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28-Jan-2016

PACKAGING INFORMATION
Orderable Device

Status(1)

Package Type Package Pins Package
Drawing
Qty

Eco Plan

Lead/Ball Finish

MSL Peak Temp

(2)

(6)

(3)

Op Temp (°C)

Device Marking(4/5)

HDC1080DMBRACTIVE

WSON

DMB

6

3000

Green (RoHS& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM-40 to 125

1R

HDC1080DMBTACTIVE

WSON

DMB

6

250

Green (RoHS& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM-40 to 125

1R

(1)

The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weightin homogeneous material)(3)

MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)

Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuationof the previous line and the two combined represent the entire Device Marking for that device.
(6)

Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

Addendum-Page 1

SamplesPACKAGE OPTION ADDENDUM

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28-Jan-2016

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

PACKAGE MATERIALS INFORMATION
www.ti.com

20-Aug-2016

TAPE AND REEL INFORMATION*All dimensions are nominal

DevicePackage Package Pins
Type Drawing

SPQ

Reel
Reel
A0
Diameter Width (mm)(mm) W1 (mm)

HDC1080DMBR

WSON

DMB

6

3000

330.0

15.4

HDC1080DMBT

WSON

DMB

6

250

178.0

12.4

Pack Materials-Page 1

B0
(mm)

K0
(mm)

P1
(mm)

W
Pin1
(mm) Quadrant

3.3

3.3

1.1

8.0

12.0

Q2

3.3

3.3

1.1

8.0

12.0

Q2

PACKAGE MATERIALS INFORMATION
www.ti.com

20-Aug-2016*All dimensions are nominal

DevicePackage Type

Package Drawing

Pins

SPQ

Length (mm)Width (mm)Height (mm)

HDC1080DMBR

WSON

DMB

6

3000

335.0

335.0

32.0

HDC1080DMBT

WSON

DMB

6

250

336.6

336.6

41.3

Pack Materials-Page 2

PACKAGE OUTLINE

DMB0006A

WSON - 0.8 mm max height
SCALE 4.000

PLASTIC SMALL OUTLINE - NO LEAD

3.1
2.9

B

A

PICK AREANOTE 4
PIN 1 INDEX AREA
3.1
2.9

(0.45)(1.3)(1.2)(0.22)

C

0.8 MAX0.08 CSEATING PLANE(0.2) TYP
0.05
0.00

1.5 0.1

EXPOSEDTHERMAL PAD
3

2X
2

4

7

2.4 0.1

4X 1
6

1

6X
PIN 1 ID
(OPTIONAL)

0.5
6X
0.3

0.45
0.35
0.1
0.05

C A B
C
4221225/B 08/2016

NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
4. Pick and place nozzle 0.9 mm or smaller recommended.

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EXAMPLE BOARD LAYOUT

DMB0006A

WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD

(1.5)
SYMM

6X (0.6)

6

1
6X (0.4)

SYMM

7

(2.4)
(0.95) TYP

4X (1)
3
4(R0.05) TYP( 0.2)TYP(1) TYP(2.8)

LAND PATTERN EXAMPLESCALE:20X

0.07 MIN
ALL AROUND

0.07 MAXALL AROUNDSOLDER MASKOPENINGMETALMETAL UNDERSOLDER MASKNON SOLDER MASKDEFINED(PREFERRED)SOLDER MASKOPENINGSOLDER MASKDEFINEDSOLDER MASK DETAILS

4221225/B 08/2016
NOTES: (continued)
5. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
6. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shownon this view. It is recommended that vias under paste be filled, plugged or tented.

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EXAMPLE STENCIL DESIGNDMB0006A

WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD

SYMM
6X (0.6)

METAL
TYP

6

1
6X (0.4)(0.63)

7

SYMM

4X (1)
2X (1.06)
3
4(R0.05) TYP
2X (1.38)(2.8)

SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCILEXPOSED PAD 7:
81% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGESCALE:20X

4221225/B 08/2016

NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.

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