TPS63000
TPS63001
TPS63002(3,25 mm x 3,25 mm)

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HIGH EFFICIENT SINGLE INDUCTOR BUCK-BOOST CONVERTER WITH 1.8-A SWITCHESFEATURESAPPLICATIONS• Up to 96% Efficiency• 1200-mA Output Current at 3.3V in Step Down
Mode (VIN = 3.6V to 5.5V)• Up to 800-mA Output Current at 3.3V in Boost
Mode (VIN > 2.4V)• Automatic Transition between Step Down and
Boost Mode
• Device Quiescent Current less than 50µA
• Input Voltage Range: 1.8V to 5.5V
• Fixed and Adjustable Output Voltage Options
from 1.2V to 5.5V
• Power Save Mode for Improved Efficiency at
Low Output Power• Forced Fixed Frequency Operation and
Synchronization possible• Load Disconnect During Shutdown• Over-Temperature Protection• Available in Small 3 mm × 3 mm, QFN-10
Package

•

1

23

•
•
•
•
•

All Two-Cell and Three-Cell Alkaline, NiCd or
NiMH or Single-Cell Li Battery Powered
Products
Portable Audio Players
PDAs
Cellular Phones
Personal Medical Products
White LEDs

DESCRIPTIONThe TPS6300x devices provide a power supply
solution for products powered by either a two-cell or
three-cell alkaline, NiCd or NiMH battery, or a
one-cell Li-Ion or Li-polymer battery. Output currents
can go as high as 1200 mA while using a single-cell
Li-Ion or Li-Polymer Battery, and discharge it down to
2.5V or lower. The buck-boost converter is based ona fixed frequency, pulse-width-modulation (PWM)
controller using synchronous rectification to obtainmaximum efficiency. At low load currents, theconverter enters Power Save mode to maintain highefficiency over a wide load current range. The Power
Save mode can be disabled, forcing the converter tooperate at a fixed switching frequency. The maximum
average current in the switches is limited to a typicalvalue of 1800 mA. The output voltage is
programmable using an external resistor divider, or isfixed internally on the chip. The converter can bedisabled to minimize battery drain. During shutdown,
the load is disconnected from the battery. The device
is packaged in a 10-pin QFN PowerPAD™ packagemeasuring 3 mm × 3 mm (DRC).
L1
2.2µH

VIN
1.8V to
5.5V

C1
10µF

L1

L2

VIN

VOUT

VINA
EN

FB

C2
10µF

VOUT
3.3V up to
1200mA

PS/SYNC
GND

PGND

TPS63001

1

2

3

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does notnecessarily include testing of all parameters.

Copyright © 2006–2008, Texas Instruments Incorporated

TPS63000
TPS63001
TPS63002
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

AVAILABLE OUTPUT VOLTAGE OPTIONS (1)TA

OUTPUT VOLTAGE
DC/DC
Adjustable

BPT

3.3 V

BPU

5.0 V

BPV

–40°C to 85°C

(1)
(2)

PACKAGE MARKINGPART NUMBER (2)PACKAGETPS63000DRC
10-Pin QFNTPS63001DRC
TPS63002DRC

Contact the factory to check availability of other fixed output voltage versions.
The DRC package is available taped and reeled. Add R suffix to device type (e.g., TPS63000DRCR) to order quantities of 3000 devices
per reel. Add T suffix to device type (e.g., TPS63000DRCT) to order quantities of 250 devices per reel.

ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
TPS6300x
Input voltage range on VIN, VINA, L1, L2, VOUT, PS/SYNC, EN, FB–0.3 V to 7 V

Operating virtual junction temperature range, TJ–40°C to 150°C

Storage temperature range Tstg

–65°C to 150°C(1)Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.

DISSIPATION RATINGS TABLE
PACKAGETHERMAL RESISTANCE
ΘJA

POWER RATINGTA≤ 25°C

DERATING FACTOR ABOVE
TA = 25°C

DRC

48.7°C/W

2054 mW

21 mW/°C

RECOMMENDED OPERATING CONDITIONS
MIN

NOM

MAX UNIT

Supply voltage at VIN, VINA

1.8

5.5

V

Operating free air temperature range, TA

–40

85

°C

Operating virtual junction temperature range, TJ

–40

125

°C

2

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ELECTRICAL CHARACTERISTICS
over recommended free-air temperature range and over recommended input voltage range (typical at an ambient temperature
range of 25°C) (unless otherwise noted)
DC/DC STAGE
MAX

UNIT

VI

Input voltage range

PARAMETERTEST CONDITIONS

MIN
1.8

5.5

V

VI

Input voltage range for startup

1.9

5.5

V

VO

TPS63000 output voltage range

1.2

VFB

TPS63000 feedback voltage

495

f

Oscillator frequency

1250

Frequency range for synchronization
ISW

TYP

500

1250

Switch current limit

VIN = VINA = 3.6 V, TA = 25°C

1600

1800

High side switch on resistance

VIN = VINA = 3.6 V

100

Low side switch on resistance

VIN = VINA = 3.6 V

100

Line regulation

IO = 0 mA, VEN = VIN = VINA = 3.6 V,
VOUT = 3.3 V

VINA
VOUT (adjustable output voltage)

FB input impedance (fixed output voltage)
IS

1500

kHz

1800

kHz

2000

mA
mΩ
mΩ

0.5%

VIN
Iq

V
mV

0.5%

Load regulation
Quiescentcurrent

5.5
505

Shutdown current

1

1.5

µA

40

50

µA

4

6

1
VEN = 0 V, VIN = VINA = 3.6 V

µA
MΩ

0.1

1

µA

1.7

1.8

V

0.4

V

0.1

µA

CONTROL STAGE
VUVLO

Under voltage lockout threshold

VIL

EN, PS/SYNC input low voltage

VIH

EN, PS/SYNC input high voltage

VINA voltage decreasing

1.5
1.2

EN, PS/SYNC input current

Clamped on GND or VINA

V
0.01

Overtemperature protection

140

°C

Overtemperature hysteresis

20°C

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PIN ASSIGNMENTS
DRC PACKAGE(TOP VIEW)

VOUT
L2
PGND
L1
VIN

FB
GND
VINA
PS/SYNC
EN

Terminal Functions
TERMINAL
NAME

NO.

I/O

DESCRIPTION

EN

6

I

Enable input. (1 enabled, 0 disabled)

FB

10

I

Voltage feedback of adjustable versions, must be connected to VOUT on fixed output voltage versions

GND

9

PS/SYNC

7

I

Enable / disable power save mode (1 disabled, 0 enabled, clock signal for synchronization)

L1

4

I

Connection for Inductor

L2

2

I

Connection for Inductor

PGND

3

VIN

5

I

Supply voltage for power stage

VOUT

1

O

Buck-boost converter output

VINA

8

I

Supply voltage for control stage

PowerPAD™

4Control / logic ground

Power ground

Must be soldered to achieve appropriate power dissipation. Should be connected to PGND.

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FUNCTIONAL BLOCK DIAGRAM (TPS63000)
L1

L2

VIN

VOUT
Current
SensorVBAT
VOUT

PGND PGND
GateControl_

VINA

Modulator

PS/SYNC

Oscillator

+

+
_

FB
VREF
+
-

DeviceControlEN

Temperature
Control

PGND
PGND

GND

TYPICAL CHARACTERISTICS
TABLE OF GRAPHSDESCRIPTIONFIGURE

Maximum output current

vs Input voltage

1

Efficiency

vs Output current (TPS63001)

2

vs Output current (TPS63002)

3

vs Input voltage (TPS63001)

4

vs Input voltage (TPS63002)

5

vs Output current (TPS63001)

6

vs Output current (TPS63002)

7

Output voltage in continuous current mode (TPS63001, VIN > VOUT)

8

Output voltage
Waveforms

Output voltage in continuous current mode (TPS63001, VIN < VOUT)

9Output voltage in continuous current mode (TPS63001, VIN = VOUT)

10Output voltage in power save mode (TPS63001, VIN > VOUT)

11

Output voltage in power save mode (TPS63001, VIN < VOUT)

12

Load transient response (TPS63001, VIN > VOUT)

13

Load transient response (TPS63001, VIN < VOUT)

14Line transient response (TPS63001, Iout = 300mA)

15Line transient response (TPS63001, Iout = 600mA)

16

Startup after enable (TPS63000, VOUT = 2.5V)

17

Startup after enable (TPS63002)

18

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MAXIMUM OUTPUT CURRENTvsINPUT VOLTAGE

EFFICIENCYvsOUTPUT CURRENT (TPS63001)
100

1800

90
80

1400
1200
1000
800
TPS63001,
VO = 3.3 V

600

TPS63002,
VO = 5 V

40
30

200

10

4.2
3.4
VI - Input Voltage - V

0.1

1

I O - Output Current - A

Figure 2.

EFFICIENCYvsOUTPUT CURRENT (TPS63002)

EFFICIENCYvsINPUT CURRENT (TPS63001)
100

90

95

80

90

70

IO = 500 mA

85
VI = 2.4 V

VI = 4.2 V

Efficiency - %Efficiency - %0.01

Figure 1.

VI = 3.6 V

50
40
30

IO = 100 mA

80
75
70

IO = 10 mA

65

20

60
TPS63002
VO = 5 V

10

0.1
0.01
IO - Output Current - A
Figure 3.

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TPS63001
VO = 3.3 V

55

0
0.001

TPS63001
VO = 3.3 V

0
0.001

5

100

60

VI = 4.2 V

50

20

2.6

VI = 3.6 V

60

400

0
1.8

6

VI = 2.4 V

70

Efficiency - %IO - maximum output current - mA

1600

TPS63000,
VO = 1.8 V

1

50
1.8

2.3

2.8

3.3

3.8

4.3

4.8

5.3

VI - input voltage - V

Figure 4.

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EFFICIENCYvsINPUT CURRENT (TPS63002)

OUTPUT VOLTAGEvsOUTPUT CURRENT (TPS63001)

100
95

3.400
TPS63001
VO = 3.3 V

IO = 500 mA

90
3.350

VO - Output Voltage - V

Efficiency - %

85
80
75
70
65

IO = 100 mA
IO = 10 mA

3.300

VI = 3.6 V

3.250

60
TPS63002
VO = 5 V

55
50
1.8

2.3

2.8

3.3
3.8
4.3
VI - Input Voltage - V

4.8

3.200
0.001

5.3

0.01

0.1
IO - Output Current - A

Figure 5.

1

Figure 6.
OUTPUT VOLTAGEvsOUTPUT CURRENT (TPS63002)

5.150
TPS63002
VO = 5 V

VO - Output Voltage - V

5.100

5.050
VI = 3.6 V
5

4.950

4.900

4.850
0.001

0.01
0.1
IO - Output Current - A

1

Figure 7.

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OUTPUT VOLTAGE IN CONTINUOUS
CURRENT MODE (TPS63001, VIN > VOUT)OUTPUT VOLTAGE IN CONTINUOUS
CURRENT MODE (TPS63001, VIN > VOUT)
Output Voltage
10 mV/div

Output Voltage
10 mV/div
L1 Voltage
5 V/div

L1 Voltage
5 V/div

L2 Voltage
5 V/div

L2 Voltage
5 V/div

Inductor Current
500 mA/div

Inductor Current
500 mA/div
TPS63001
VO = 3.3 V

VI = 4.2 V,
IO = 500 mA

TPS63001,
VO = 3.3 V

Timebase 500 ns/div
Figure 8.

VI = 2.4 V, IO = 500 mA

Timebase 500 ns/Div
Figure 9.

OUTPUT VOLTAGE IN CONTINUOUS
CURRENT MODE (TPS63001, VIN = VOUT)OUTPUT VOLTAGE IN POWER
SAVE MODE (TPS63001, VIN > VOUT)

Output Voltage
10 mV/div
Output Voltage
100 mV/div

L1 Voltage
5 V/div
L2 Voltage
5 V/div

Inductor Current
500 mA/div,dc

Inductor Current
500 mA/div
TPS63001,
VO = 3.3 V

VI = 3.3 V, IO = 500 mA
Timebase 500 ns/div
Figure 10.

8

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TPS63001,
VO = 3.3 V

VI = 4.2 V, IO = 50 mA
Timebase 5 ms/Div

Figure 11.

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OUTPUT VOLTAGE IN POWER
SAVE MODE (TPS63001, VIN < VOUT)

LOAD TRANSIENT RESPONSE(TPS63001, VIN > VOUT)

Output Voltage
100 mV/div, ac

Output Voltage
100 mV/div, ac

Output Current
200 mA/div, dc

Inductor Current
500 mA/div, dc
TPS63001,
VO = 3.3 V

TPS63001,
VO = 3.3 V

VI = 2.4 V, IO = 50 mA
Timebase 5 m s/div

VI = 3.6 V,
IO = 200 mA to 600 mA
Timebase 2 ms/div
Figure 13.

Figure 12.
LOAD TRANSIENT RESPONSE(TPS63001, VIN < VOUT)

LINE TRANSIENT RESPONSE(TPS63001, Iout = 300mA)

Output Voltage
100 mV/div, ac

Output Voltage
10 mV/div,acOutput Current
200 mA/div,dc

Input Voltage
1 V/div,dc
TPS63001,
VO = 3.3 V

VI = 3 V,
IO = 200 mA to 600 mA
Timebase 2 ms/div
Figure 14.

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VI = 3 V to 3.6 V,
IO = 300 mA

TPS63001,
VO = 3.3 V

Timebase 2 ms/div
Figure 15.

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LINE TRANSIENT RESPONSE(TPS63001, Iout = 600mA)

STARTUP AFTER ENABLE(TPS63000, VOUT = 2.5V)
Enable2 V/div,dc
Output Voltage
1 V/div,dc

Output Voltage
20 mV/div,acInductor Current
200 mA/div,dc

Input Voltage
1 V/div,dc
TPS63001,
VO = 3.3 V

Voltage at L1
2 V/div, dc

TPS63000,
VO = 2.5 V

VI = 3 V to 3.6 V,
IO = 600 mA

VI = 3.3 V, IO = 300 mA

Timebase 2 ms/div

Timebase 50 ms/div

Figure 16.

Figure 17.
STARTUP AFTER ENABLE(TPS63002)
Enable2 V/div, dc
Output Voltage
2 V/div, dc

Inductor Current
500 mA/div, dc

Voltage at L2
2 V/div,dc

TPS63002,
VO = 5 V
VI = 2.4 V, IO = 300 mA
Timebase 100 ms/div

Figure 18.

10

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PARAMETER MEASUREMENT INFORMATION
L1

VIN
C1

L1

L2

VIN

VOUT

VINA

R3

R1

EN
GND

C2

FB

PS/SYNC

C3

VOUT

R2
PGND

TPS6300X

List of Components
REFERENCEDESCRIPTIONMANUFACTURER

TPS6300 0 / 1 / 2Texas Instruments

L1

VLF4012-2R2

TDK

C1

10 µF 6.3V, 0603, X7R ceramic

C2

2 × 10 µF 6.3V, 0603, X7R ceramic

C3

0.1 µF, X7R ceramic

R3

100 Ω

R1, R2

Depending on the output voltage at TPS63000, not used at TPS6300 1 / 2

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DETAILED DESCRIPTIONCONTROLLER CIRCUIT
The controlling circuit of the device is based on an average current mode topology. The average inductor current
is regulated by a fast current regulator loop which is controlled by a voltage control loop. The controller also uses
input and output voltage feedforward. Changes of input and output voltage are monitored and immediately canchange the duty cycle in the modulator to achieve a fast response to those errors. The voltage error amplifier
gets its feedback input from the FB pin. At adjustable output voltages a resistive voltage divider must beconnected to that pin. At fixed output voltages FB must be connected to the output voltage to directly sense thevoltage. Fixed output voltage versions use a trimmed internal resistive divider. The feedback voltage will becompared with the internal reference voltage to generate a stable and accurate output voltage.
The controller circuit also senses the average input current as well as the peak input current. With this, maximum
input power can be controlled as well as the maximum peak current to achieve a safe and stable operation under
all possible conditions. To finally protect the device from overheating, an internal temperature sensor is
implemented.
Synchronous Operation
The device uses 4 internal N-channel MOSFETs to maintain synchronous power conversion at all possible
operating conditions. This enables the device to keep high efficency over a wide input voltage and output power
range.
To avoid ground shift problems due to the high currents in the switches, two separate ground pins GND and
PGND are used. The reference for all control functions is the GND pin. The power switches are connected to
PGND. Both grounds must be connected on the PCB at only one point ideally close to the GND pin. Due to the
4-switch topology, the load is always disconnected from the input during shutdown of the converter.
Buck-Boost Operation
To be able to regulate the output voltage properly at all possible input voltage conditions, the device
automatically switches from step down operation to boost operation and back as required by the configuration. It
always uses one active switch, one rectifying switch, one switch permanently on, and one switch permanently off.
Therefore, it operates as a step down converter (buck) when the input voltage is higher than the output voltage,
and as a boost converter when the input voltage is lower than the output voltage. There is no mode of operationin which all 4 switches are permanently switching. Controlling the switches this way allows the converter tomaintain high efficiency at the most important point of operation; when input voltage is close to the output
voltage. The RMS current through the switches and the inductor is kept at a minimum, to minimize switching andconduction losses. Switching losses are also kept low by using only one active and one passive switch.
Regarding the remaining 2 switches, one is kept permanently on and the other is kept permanently off, thus
causing no switching losses.
Power Save Mode and Synchronization
The PS/SYNC pin can be used to select different operation modes. To enable power save, PS/SYNC must be
set low. Power save mode is used to improve efficiency at light load. If power save mode is enabled, theconverter stops operating if the average inductor current gets lower than about 300 mA and the output voltage isat or above its nominal value. If the output voltage decreases below its nominal value, the device ramps up theoutput voltage again by starting operation using a programmed average inductor current higher than required by
the current load condition. Operation can last for one or several pulses. The converter again stops operating
once the conditions for stopping operation are met again.
The power save mode can be disabled by programming high at the PS/SYNC. Connecting a clock signal at
PS/SYNC forces the device to synchronize to the connected clock frequency. Synchronization is done by a PLL,
so synchronizing to lower and higher frequencies compared to the internal clock works without any issues. The
PLL can also tolerate missing clock pulses without the converter malfunctioning. The PS/SYNC input supports
standard logic thresholds.

12

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Device Enable
The device is put into operation when EN is set high. It is put into a shutdown mode when EN is set to GND. In
shutdown mode, the regulator stops switching, all internal control circuitry is switched off, and the load is
disconnected from the input. This also means that the output voltage can drop below the input voltage during
shutdown. During start-up of the converter, the duty cycle and the peak current are limited in order to avoid highpeak currents flowing from the input.
Softstart and Short Circuit Protection
After being enabled, the device starts operating. The average current limit ramps up from an initial 400mA
following the output voltage increasing. At an output voltage of about 1.2 V, the current limit is at its nominal
value. If the output voltage does not increase, the current limit will not increase. There is no timer implemented.
Thus the output voltage overshoot at startup, as well as the inrush current, is kept at a minimum. The device
ramps up the output voltage in a controlled manner even if a very large capacitor is connected at the output.
When the output voltage does not increase above 1.2 V, the device assumes a short circuit at the output andkeeps the current limit low to protect itself and the application. At a short at the output during operation thecurrent limit also will be decreased accordingly. At 0 V at the output, for example, the output current will not
exceed about 400 mA.
Undervoltage Lockout
An undervoltage lockout function prevents device start-up if the supply voltage on VINA is lower thanapproximately its threshold (see electrical characteristics table). When in operation, the device automaticallyenters the shutdown mode if the voltage on VINA drops below the undervoltage lockout threshold. The device
automatically restarts if the input voltage recovers to the minimum operating input voltage.
Overtemperature Protection
The device has a built-in temperature sensor which monitors the internal IC temperature. If the temperature
exceeds the programmed threshold (see electrical characteristics table) the device stops operating. As soon as
the IC temperature has decreased below the programmed threshold, it starts operating again. There is a built-in
hysteresis to avoid unstable operation at IC temperatures at the overtemperature threshold.

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APPLICATION INFORMATIONDESIGN PROCEDURE
The TPS6300x dc/dc converters are intended for systems powered by one-cell Li-Ion or Li-Polymer battery with atypical voltage between 2.3 V and 4.5 V. They can also be used in systems powered by a double or triple cell
Alkaline, NiCd, or NiMH battery with a typical terminal voltage between 1.8 V and 5.5 V . Additionally, any othervoltage source with a typical output voltage between 1.8 V and 5.5 V can power systems where the TPS6300x is
used.

PROGRAMMING THE OUTPUT VOLTAGE
Within the TPS6300X family there are fixed and adjustable output voltage versions available. To properly
configure the fixed output voltage devices, the FB pin is used to sense the output voltage. This means that it
must be connected directly to VOUT. At the adjustable output voltage versions, an external resistor divider isused to adjust the output voltage. The resistor divider must be connected between VOUT, FB and GND. Whenthe output voltage is regulated properly, the typical value of the voltage at the FB pin is 500mV. The maximum
recommended value for the output voltage is 5.5V. The current through the resistive divider should be about 100
times greater than the current into the FB pin. The typical current into the FB pin is 0.01 µA, and the voltage
across the resistor between FB and GND, R2, is typically 500 mV. Based on those two values, the recommended
value for R2 should be lower than 500kΩ, in order to set the divider current at 1µA or higher. It is recommended
to keep the value for this resistor in the range of 200kΩ. From that, the value of the resistor connected between
VOUT and FB, R1, depending on the needed output voltage (VOUT), can be calculated using Equation 1:
R 1 + R2

ǒ

VOUT
V FB

Ǔ

*1

(1)

If as an example, an output voltage of 3.3 V is needed, a 1.0 MΩ resistor should be chosen for R1. To improve
control performance using a feedforward capacitor in parallel to R1 is recommended. The value for thefeedforward capacitor can be calculated using Equation 2.
2.2 msC ff +
R1
(2)
L1

VIN
R3

C1

L1

L2

VIN

VOUT

VINA

R1

EN
C3

C2

FB

PS/SYNC
GND

VOUT

R2
PGND

TPS6300X

Figure 19. Typical Application Circuit for Adjustable Output Voltage Option

INDUCTOR SELECTION
To properly configure the TPS6300X devices, an inductor must be connected between pin L1 and pin L2. To
estimate the inductance value Equation 3 and Equation 4 can be used.

14

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TPS63000
TPS63001
TPS63002
www.ti.com........................................................................................................................................................... SLVS520B – MARCH 2006 – REVISED JULY 2008

L1 +

L2 +

ǒVIN1 * VOUTǓ

VOUT
V IN1
Vin2

f

0.3 A

(3)

ǒVOUT * VIN2Ǔ

V OUT

f

0.3 A

(4)

In both equations f is the minimum switching frequency. In Equation 3 the minimum inductance value, L1 for step
down mode operation is calculated. VIN1 is the maximum input voltage. In Equation 4 the minimum inductance,
L2, for boost mode operation is calculated. VIN2 is the minimum input voltage. The recommended minimum
inductor value is either L1 or L2 whichever is higher. As an example, a suitable inductor for generating 3.3V froma Li-Ion battery with a battery voltage range from 2.5V up to 4.2V is 2.2 µH. The recommended inductor value
range is between 1.5 µH and 4.7 µH. In general, this means that at high voltage conversion rates, higher inductor
values offer better performance.
With the chosen inductance value, the peak current for the inductor in steady state operation can be calculated.
Equation 5 shows how to calculate the peak current I1 in step down mode operation and Equation 6 shows how
to calculate the peak current I2 in boost mode operation.
VOUTǒV IN1 * V OUTǓI
I 1 + OUT )0.8
2 V IN1 f L(5)

ǒV OUT * V IN2ǓV
I OUT VIN2
I 2 + OUT)
2
0.8 V IN2

VOUT

f

L

(6)

The critical current value for selecting the right inductor is the higher value of I1 and I2. It also needs to be taken
into account that load transients and error conditions may cause higher inductor currents. This also needs to betaken into account when selecting an appropriate inductor. The following inductor series from different suppliers
have been used with TPS6300x converters:
Table 1. List of Inductors
VENDOR
Coilcraft

INDUCTOR SERIESLPS3015
LPS4012

MurataLQH3NP

Tajo Yuden

NR3015
VLF3215

TDK

VLF4012CAPACITOR SELECTION
Input Capacitor
At least a 4.7 µF input capacitor is recommended to improve transient behavior of the regulator and EMI
behavior of the total power supply circuit. A ceramic capacitor placed as close as possible to the VIN and PGND
pins of the IC is recommended.
Output Capacitor
For the output capacitor, it is recommended to use small ceramic capacitors placed as close as possible to the
VOUT and PGND pins of the IC. If, for any reason, the application requires the use of large capacitors which can
not be placed close to the IC, using a smaller ceramic capacitor in parallel to the large one is recommended.
This small capacitor should be placed as close as possible to the VOUT and PGND pins of the IC.
To get an estimate of the recommended minimum output capacitance, Equation 7 can be used.

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15

TPS63000
TPS63001
TPS63002
SLVS520B – MARCH 2006 – REVISED JULY 2008........................................................................................................................................................... www.ti.com

C OUT + 5

L

mF
mH

(7)

A capacitor with a value in the range of the calculated minimum should be used. This is required to maintaincontrol loop stability. There are no additional requirements regarding minimum ESR. There is also no upper limit
for the output capacitance value. Larger capacitors will cause lower output voltage ripple as well as lower output
voltage drop during load transients.

LAYOUT CONSIDERATIONS
As for all switching power supplies, the layout is an important step in the design, especially at high peak currents
and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems aswell as EMI problems. Therefore, use wide and short traces for the main current path and for the power groundtracks. The input capacitor, output capacitor, and the inductor should be placed as close as possible to the IC.
Use a common ground node for power ground and a different one for control ground to minimize the effects ofground noise. Connect these ground nodes at any place close to one of the ground pins of the IC.
The feedback divider should be placed as close as possible to the control ground pin of the IC. To lay out thecontrol ground, it is recommended to use short traces as well, separated from the power ground traces. Thisavoids ground shift problems, which can occur due to superimposition of power ground current and control
ground current.

THERMAL INFORMATION
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect thepower-dissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below.
• Improving the power dissipation capability of the PCB design• Improving the thermal coupling of the component to the PCB by soldering the PowerPAD• Introducing airflow in the system
The maximum recommended junction temperature (TJ) of the TPS6300x devices is 125°C. The thermal
resistance of the 10-pin QFN 3 × 3 package (DRC) is RθJA = 48.7°C/W, if the PowerPAD is soldered. Specified
regulator operation is assured to a maximum ambient temperature TA of 85°C. Therefore, the maximum power
dissipation is about 820mW, as calculated in Equation 8. More power can be dissipated if the maximum ambient
temperature of the application is lower.
T*T
J(MAX)
A
P++ 125°C * 85°C + 820 mW
D(MAX)
R
48.7 °CńW
qJA
(8)

16

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PACKAGE OPTION ADDENDUM
www.ti.com

18-Feb-2010

PACKAGING INFORMATION
Orderable Device

Status (1)Package
Type

Package
Drawing

Pins Package Eco Plan (2)Qty

Lead/Ball Finish

MSL Peak Temp (3)TPS63000DRCR

ACTIVE

SON

DRC

10

3000 Green (RoHS &no Sb/Br)CU NIPDAU

Level-2-260C-1 YEAR

TPS63000DRCRG4ACTIVE

SON

DRC

10

3000 Green (RoHS &no Sb/Br)CU NIPDAU

Level-2-260C-1 YEAR

TPS63000DRCTACTIVE

SON

DRC

10

1

Green (RoHS &no Sb/Br)CU NIPDAU

Level-2-260C-1 YEAR

TPS63000DRCTG4ACTIVE

SON

DRC

10

1

Green (RoHS &no Sb/Br)CU NIPDAU

Level-2-260C-1 YEAR

TPS63001DRCR

ACTIVE

SON

DRC

10

3000 Green (RoHS &no Sb/Br)CU NIPDAU

Level-2-260C-1 YEAR

TPS63001DRCRG4ACTIVE

SON

DRC

10

3000 Green (RoHS &no Sb/Br)CU NIPDAU

Level-2-260C-1 YEAR

TPS63001DRCTACTIVE

SON

DRC

10

250

Green (RoHS &no Sb/Br)CU NIPDAU

Level-2-260C-1 YEAR

TPS63001DRCTG4ACTIVE

SON

DRC

10

250

Green (RoHS &no Sb/Br)CU NIPDAU

Level-2-260C-1 YEAR

TPS63002DRCR

ACTIVE

SON

DRC

10

3000 Green (RoHS &no Sb/Br)CU NIPDAU

Level-2-260C-1 YEAR

TPS63002DRCRG4ACTIVE

SON

DRC

10

3000 Green (RoHS &no Sb/Br)CU NIPDAU

Level-2-260C-1 YEAR

TPS63002DRCTACTIVE

SON

DRC

10

250

Green (RoHS &no Sb/Br)CU NIPDAU

Level-2-260C-1 YEAR

TPS63002DRCTG4ACTIVE

SON

DRC

10

250

Green (RoHS &no Sb/Br)CU NIPDAU

Level-2-260C-1 YEAR

(1)

The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be solderedat high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die andpackage, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHScompatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it isprovided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to theaccuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to takereasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.

Addendum-Page 1

PACKAGE OPTION ADDENDUM
www.ti.com

18-Feb-2010

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TPS63000 :• Automotive: TPS63000-Q1
NOTE: Qualified Version Definitions:• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

Addendum-Page 2

PACKAGE MATERIALS INFORMATION
www.ti.com

14-Jul-2012

TAPE AND REEL INFORMATION*All dimensions are nominal

DevicePackage Package Pins
Type Drawing

SPQ

Reel
Reel
A0
Diameter Width (mm)(mm) W1 (mm)

B0
(mm)

K0
(mm)

P1
(mm)

W
Pin1
(mm) Quadrant

TPS63000DRCR

SON

DRC

10

3000

330.0

12.4

3.3

3.3

1.1

8.0

12.0

Q2

TPS63000DRCR

SON

DRC

10

3000

330.0

12.4

3.3

3.3

1.1

8.0

12.0

Q2

TPS63000DRCT

SON

DRC

10

250

180.0

12.4

3.3

3.3

1.1

8.0

12.0

Q2

TPS63000DRCT

SON

DRC

10

250

180.0

12.4

3.3

3.3

1.1

8.0

12.0

Q2

TPS63001DRCR

SON

DRC

10

3000

330.0

12.4

3.3

3.3

1.1

8.0

12.0

Q2

TPS63001DRCR

SON

DRC

10

3000

330.0

12.4

3.3

3.3

1.1

8.0

12.0

Q2

TPS63001DRCT

SON

DRC

10

250

180.0

12.4

3.3

3.3

1.1

8.0

12.0

Q2

TPS63002DRCR

SON

DRC

10

3000

330.0

12.4

3.3

3.3

1.1

8.0

12.0

Q2

TPS63002DRCR

SON

DRC

10

3000

330.0

12.4

3.3

3.3

1.1

8.0

12.0

Q2

TPS63002DRCT

SON

DRC

10

250

180.0

12.4

3.3

3.3

1.1

8.0

12.0

Q2

TPS63002DRCT

SON

DRC

10

250

330.0

12.4

3.3

3.3

1.1

8.0

12.0

Q2

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION
www.ti.com

14-Jul-2012*All dimensions are nominal

DevicePackage Type

Package Drawing

Pins

SPQ

Length (mm)Width (mm)Height (mm)TPS63000DRCR

SON

DRC

10

3000

367.0

367.0

35.0

TPS63000DRCR

SON

DRC

10

3000

367.0

367.0

35.0

TPS63000DRCT

SON

DRC

10

250

210.0

185.0

35.0

TPS63000DRCT

SON

DRC

10

250

210.0

185.0

35.0

TPS63001DRCR

SON

DRC

10

3000

367.0

367.0

35.0

TPS63001DRCR

SON

DRC

10

3000

367.0

367.0

35.0

TPS63001DRCT

SON

DRC

10

250

210.0

185.0

35.0

TPS63002DRCR

SON

DRC

10

3000

367.0

367.0

35.0

TPS63002DRCR

SON

DRC

10

3000

367.0

367.0

35.0

TPS63002DRCT

SON

DRC

10

250

210.0

185.0

35.0

TPS63002DRCT

SON

DRC

10

250

340.5

338.1

20.6

Pack Materials-Page 2

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