MCP1640/B/C/D
0.65V Start-up Synchronous Boost Regulator with True
Output Disconnect or Input/Output Bypass Option
Features

General Description• Up to 96% Typical Efficiency• 800 mA Typical Peak Input Current Limit:- IOUT > 100 mA @ 1.2V VIN, 3.3V VOUT
- IOUT > 350 mA @ 2.4V VIN, 3.3V VOUT
- IOUT > 350 mA @ 3.3V VIN, 5.0V VOUT
• Low Start-up Voltage: 0.65V, typical 3.3V VOUT
@ 1 mA• Low Operating Input Voltage: 0.35V, typical
3.3VOUT @ 1 mA
• Adjustable Output Voltage Range: 2.0V to 5.5V
• Maximum Input Voltage  VOUT < 5.5V
• Automatic PFM/PWM Operation (MCP1640/C):- PFM Operation Disabled (MCP1640B/D)- PWM Operation: 500 kHz• Low Device Quiescent Current: 19 µA, typical
PFM Mode• Internal Synchronous Rectifier• Internal Compensation• Inrush Current Limiting and Internal Soft-Start• Selectable, Logic Controlled, Shutdown States:- True Load Disconnect Option (MCP1640/B)- Input to Output Bypass Option (MCP1640C/D)• Shutdown Current (All States): < 1 µA
• Low Noise, Anti-Ringing Control• Overtemperature Protection• Available Packages:- SOT23-6- 2x3 8-Lead DFN

The MCP1640/B/C/D is a compact, high-efficiency,
fixed frequency, synchronous step-up DC-DC converter. It provides an easy-to-use power supply solution
for applications powered by either one-cell, two-cell, or
three-cell alkaline, NiCd, NiMH, one-cell Li-Ion or
Li-Polymer batteries.
Low-voltage technology allows the regulator to start up
without high inrush current or output voltage overshootfrom a low 0.65V input. High efficiency is accomplishedby integrating the low resistance N-Channel Boost
switch and synchronous P-Channel switch. All
compensation and protection circuitry are integrated tominimize external components. For standby
applications, the MCP1640 operates and consumes
only 19 µA while operating at no load and provides atrue disconnect from input to output while shut down
(EN = GND). Additional device options are available
that operate in PWM only mode and connect input tooutput bypass while shut down.
A “true” load disconnect mode provides input to output
isolation while disabled by removing the normal boost
regulator diode path from input to output. A bypass
mode option connects the input to the output using the
integrated low resistance P-Channel MOSFET, which
provides a low bias keep alive voltage for circuits
operating in Deep Sleep mode. Both options consumeless than 1 µA of input current.
Output voltage is set by a small external resistor
divider. Two package options, SOT23-6 and 2x3
DFN-8, are available.

Package Types
Applications• One, Two and Three Cell Alkaline and NiMH/NiCd
Portable Products• Single Cell Li-Ion to 5V Converters• Li Coin Cell Powered Devices• Personal Medical Products• Wireless Sensors• Handheld Instruments• GPS Receivers• Bluetooth Headsets• +3.3V to +5.0V Distributed Power Supply

 2010 Microchip Technology Inc.

MCP1640
6-Lead SOT23

MCP1640
2x3 DFN*

SW 1

6 VIN

VFB 1

GND 2

5 VOUT

SGND 2

EN 3

4 VFB

PGND 3
EN 4

8 VIN
EP
9

7 VOUTS
6 VOUTP
5 SW* Includes Exposed Thermal Pad (EP); see Table 3-1.

DS22234A-page 1

MCP1640/B/C/D
L1
4.7 µH

VIN
0.9V To 1.7V

VOUT
3.3V @ 100 mA

SW V
OUT
VIN

ALKALINE+

CIN
4.7 µF

976 K

COUT
10 µF

VFB

EN

562 K

-GND

L1
4.7 µH

VIN
3.0V To 4.2V

LI-ION+

VOUT
5.0V @ 300 mA

SW V

OUTS

CIN
4.7 µF

VIN

VOUTP

EN

VFB

976 K

COUT
10 µF

309 K

-PGND SGND

Efficiency vs. IOUT for 3.3VOUT
100.0

Efficiency (%)

V IN = 2.5V

80.0

V IN = 0.8V

V IN = 1.2V

60.0

40.0
0.1

1.0

10.0

100.0

1000.0

Output Current (mA)

DS22234A-page 2

 2010 Microchip Technology Inc.

MCP1640/B/C/D
1.0

ELECTRICAL
CHARACTERISTICS† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of
the device at those or any other conditions above thoseindicated in the operational sections of thisspecification is not intended. Exposure to maximum
rating conditions for extended periods may affectdevice reliability.

Absolute Maximum Ratings †EN, FB, VIN, VSW, VOUT - GND ........................... +6.5V
EN, FB ...........<greater of VOUT or VIN > (GND - 0.3V)
Output Short Circuit Current....................... Continuous
Output Current Bypass Mode........................... 400 mA
Power Dissipation ............................ Internally Limited
Storage Temperature .........................-65oC to +150oC
Ambient Temp. with Power Applied......-40oC to +85oC
Operating Junction Temperature........-40oC to +125oC
ESD Protection On All Pins:
HBM........................................................ 3 kV
MM........................................................ 300 V

DC CHARACTERISTICSElectrical Characteristics: Unless otherwise indicated, VIN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, IOUT = 15 mA,
TA = +25°C.
Boldface specifications apply over the TA range of -40oC to +85oC.

Parameters

Sym

Min

Typ

Max

Units

Conditions

Input Characteristics
Minimum Start-Up Voltage

VIN

—

0.65

0.8

V

Note 1Minimum Input Voltage After
Start-Up

VIN

—

0.35

—

V

Note 1

Output Voltage Adjust Range

VOUT

2.0

5.5

V

VOUT  VIN; Note 2

Maximum Output Current

IOUT

150

—

mA

1.2V VIN, 2.0V VOUT

150

—

mA

1.5V VIN, 3.3V VOUT

350

—

mA

3.3V VIN, 5.0V VOUT

100
Feedback Voltage

VFB

1.175

1.21

1.245

V

—

Feedback Input Bias Current

IVFB

—

10

—

pA

—

Quiescent Current – PFM
Mode

IQPFM

—

19

30

µA

Measured at VOUT = 4.0V;
EN = VIN, IOUT = 0 mA;
Note 3

Quiescent Current – PWM
Mode

IQPWM

—

220

—

µA

Measured at VOUT; EN = VIN
IOUT = 0 mA; Note 3

Quiescent Current – Shutdown

IQSHDN

—

0.7

2.3

µA

VOUT = EN = GND;
Includes N-Channel and
P-Channel Switch Leakage

NMOS Switch Leakage

INLK

—

0.3

1

µA

VIN = VSW = 5V; VOUT =5.5V VEN = VFB = GND

PMOS Switch Leakage

IPLK

—

0.05

0.2

µA

VIN = VSW = GND;VOUT = 5.5V

NMOS Switch ON ResistanceRDS(ON)N

—

0.6

—



VIN = 3.3V, ISW = 100 mA

PMOS Switch ON ResistanceRDS(ON)P

—

0.9

—



VIN = 3.3V, ISW = 100 mA

Note 1:
2:
3:
4:
5:

3.3 K resistive load, 3.3VOUT (1 mA).
For VIN > VOUT, VOUT will not remain in regulation.
IQ is measured from VOUT; VIN quiescent current will vary with boost ratio. VIN quiescent current can be
estimated by: (IQPFM * (VOUT/VIN)), (IQPWM * (VOUT/VIN)).
220 resistive load, 3.3VOUT (15 mA).
Peak current limit determined by characterization, not production tested.

 2010 Microchip Technology Inc.

DS22234A-page 3

MCP1640/B/C/D
DC CHARACTERISTICS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, VIN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, IOUT = 15 mA,
TA = +25°C.
Boldface specifications apply over the TA range of -40oC to +85oC.

Parameters

Sym

Min

Typ

Max

Units

Conditions

NMOS Peak Switch Current
Limit

IN(MAX)

600

850

—

mA

Note 5

VOUT Accuracy

VOUT%

-3

—

+3

%

Includes Line and Load
Regulation; VIN = 1.5V

Line Regulation

VOUT/
VOUT) /
VIN|

-1

0.01

1

%/V

VIN = 1.5V to 3V
IOUT = 25 mA

Load Regulation

VOUT /
VOUT|

-1

0.01

1

%

IOUT = 25 mA to 100 mA;
VIN = 1.5V

Maximum Duty Cycle

DCMAX

88

90

—

%

Switching Frequency

fSW

425

VIH

EN Input Logic Low

VIL

90
—

575
—

kHz

EN Input Logic High

500
—
—

20

%of VIN IOUT = 1 mA%of VIN IOUT = 1 mA

EN Input Leakage Current

IENLK

—

0.005

VEN = 5V

tSS

—

750

—
—

µA

Soft-start TimeµS

EN Low to High, 90% of
VOUT; Note 4

Thermal Shutdown Die
Temperature

TSD

—

150

—

C

TSDHYS

—

10

—

C

Die Temperature Hysteresis
Note 1:
2:
3:
4:
5:

3.3 K resistive load, 3.3VOUT (1 mA).
For VIN > VOUT, VOUT will not remain in regulation.
IQ is measured from VOUT; VIN quiescent current will vary with boost ratio. VIN quiescent current can be
estimated by: (IQPFM * (VOUT/VIN)), (IQPWM * (VOUT/VIN)).
220 resistive load, 3.3VOUT (15 mA).
Peak current limit determined by characterization, not production tested.

TEMPERATURE SPECIFICATIONSElectrical Specifications:Parameters

Sym

Min

Typ

Max

Units

Conditions

Operating Junction Temperature
Range

TJ

-40

—

+125

°C

Storage Temperature Range

TA

-65

—

+150

°C

Maximum Junction Temperature

TJ

—

—

+150

°C

Transient

Thermal Resistance, 5L-TSOT23

JA

—

192

—

°C/W

EIA/JESD51-3 Standard

Thermal Resistance, 8L-2x3 DFN

JA

—

93

—

°C/W

Temperature Ranges
Steady State

Package Thermal Resistances

DS22234A-page 4

 2010 Microchip Technology Inc.

MCP1640/B/C/D
2.0

TYPICAL PERFORMANCE CURVESNote:

The graphs and tables provided following this note are a statistical summary based on a limited number ofsamples and are provided for informational purposes only. The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

Note: Unless otherwise indicated, VIN = EN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, ILOAD = 15 mA, TA = +25°C.

Efficiency (%)

80

22.5
VOUT = 3.3V

20.0
17.5
15.0

VOUT = 2.0V

70

VIN = 0.8V

60
VIN = 1.2V

50
40
30

PWM / PFM

20

12.5

PWM ONLY

10
0
0.01

10.0
-40

-25

-10

5

20

35

50

65

80

0.1

1

100

300

1000

V OUT = 3.3V

V IN = 2.5V

90

VOUT = 5.0V
V IN = 1.2V

80

Efficiency (%)

IQ PWM Mode (µA)

100

FIGURE 2-4:
2.0V VOUT PFM / PWM
Mode Efficiency vs. IOUT.

FIGURE 2-1:
VOUT IQ vs. Ambient
Temperature in PFM Mode.

250
225

VOUT = 3.3V

200

70

VIN = 0.8V

60

VIN = 1.2V

50
40
30

PWM / PFM

20175

PWM ONLY

10
0
0.01

150
-40

-25

-10

5

20

35

50

65

80

0.1

1

FIGURE 2-2:
VOUT IQ vs. Ambient
Temperature in PWM Mode.

100
VOUT = 5.0V
VOUT = 3.3V

VOUT = 5.0V

VIN = 2.5V

Efficiency (%)

80

VOUT = 2.0V

200

VIN = 1.2V

70
50
40
30

PWM / PFM
PWM ONLY

10
0
0.5

1

1.5

2

2.5

3

3.5

4

4.5

VIN (V)FIGURE 2-3:

Maximum IOUT vs. VIN.

 2010 Microchip Technology Inc.

5

VIN = 1.8V

60

20

100

0

1000

90

400
300

100

FIGURE 2-5:
3.3V VOUT PFM / PWM
Mode Efficiency vs. IOUT.

600
500

10

IOUT (mA)

Ambient Temperature (°C)

IOUT (mA)

10

IOUT (mA)

Ambient Temperature (°C)

275

VIN = 1.6V

90

VOUT = 5.0V

VIN = 1.2V

25.0

IQ PFM Mode (µA)

VOUT = 2.0V

100

27.5

0
0.01

0.1

1

10

100

1000

IOUT (mA)

FIGURE 2-6:
5.0V VOUT PFM / PWM
Mode Efficiency vs. IOUT.

DS22234A-page 5

MCP1640/B/C/D
Note: Unless otherwise indicated, VIN = EN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, ILOAD = 15 mA, TA = +25°C.
3.33

1.00

VIN = 1.2V

IOUT = 15 mA

VOUT = 3.3V

3.325
3.32

0.85

VIN = 1.8V

Startup

VIN (V)

VOUT (V)

3.315
3.31
3.305

0.70
0.55

3.3

Shutdown

VIN = 0.8V

3.295

0.40

3.29
0.25

3.285
-40

-25

-10

5

20

35

50

65

0

80

20

40

Ambient Temperature (°C)

FIGURE 2-7:
Temperature.

525

Switching Frequency (kHz)

VIN = 1.5V

3.36
IOUT = 5 mA

VOUT (V)

3.34
3.32
3.30
IOUT = 15 mA
3.28
IOUT = 50 mA
3.26

100

VOUT = 3.3V

520
515
510
505
500
495
490
485
480

-40

-25

-10

5

20

35

50

65

80

-40

-25

-10

Ambient Temperature (°C)

FIGURE 2-8:
Temperature.

5

20

35

50

65

80

Ambient Temperature (°C)

3.3V VOUT vs. Ambient

FIGURE 2-11:
Temperature.

3.40

FOSC vs. Ambient

4.5
TA = 85°C

IOUT = 5 mA

4

3.36

VOUT = 5.0V

3.53
TA = 25°C

3.32

VIN (V)

VOUT (V)80

FIGURE 2-10:
Minimum Start-up andShutdown VIN into Resistive Load vs. IOUT.

3.3V VOUT vs. Ambient

3.38

60

IOUT (mA)

3.28
TA = - 40°C

V OUT = 3.3V

2.5
2

VOUT = 2.0V

1.5
1

3.24

0.5
3.20

0
0.8

1.2

1.6

2

2.4

VIN (V)FIGURE 2-9:

DS22234A-page 6

3.3V VOUT vs. VIN.

2.8

0

1

2

3

4

5

6

7

8

9

10

IOUT (mA)

FIGURE 2-12:
PWM Pulse Skipping Mode
Threshold vs. IOUT.

 2010 Microchip Technology Inc.

MCP1640/B/C/D
Note: Unless otherwise indicated, VIN = EN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, ILOAD = 15 mA, TA = +25°C.
10000

PWM / PFM
PWM ONLY
VOUT = 5.0V

IIN (µA)

1000

VOUT = 3.3V

VOUT = 2.0V
100

VOUT = 2.0V

VOUT = 3.3V

VOUT = 5.0V

10
0.8

1.1

1.4

1.7

2

2.3

2.6

2.9

3.2

3.5

VIN (V)FIGURE 2-13:
VIN.

Input No Load Current vs.

FIGURE 2-16:
MCP1640 3.3V VOUT PFM
Mode Waveforms.

Switch Resistance (Ohms)

5
4
P - Channel

32
1
N - Channel

0
1

1.5

2

2.5

3

3.5

4

4.5

5

> VIN or VOUT

FIGURE 2-14:
N-Channel and P-Channel
RDSON vs. > of VIN or VOUT.

FIGURE 2-17:
MCP1640B 3.3V VOUTPWM Mode Waveforms.

16
VOUT = 5.0V
14

V OUT = 3.3V

VOUT = 2.0V

IOUT (mA)

12
10
8
6
4
2
0
0

0.5

1

1.5

2

2.5

3

3.5

4

VIN (V)FIGURE 2-15:
Current vs. VIN.

PFM / PWM Threshold 2010 Microchip Technology Inc.

FIGURE 2-18:
Waveforms.

MCP1640/B High Load

DS22234A-page 7

MCP1640/B/C/D
Note: Unless otherwise indicated, VIN = EN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, ILOAD = 15 mA, TA = +25°C.

FIGURE 2-19:

3.3V Start-up After Enable.

FIGURE 2-22:
MCP1640B 3.3V VOUT Load
Transient Waveforms.

FIGURE 2-20:
VENABLE.

3.3V Start-up when VIN =FIGURE 2-23:
MCP1640B 2.0V VOUT Load
Transient Waveforms.

FIGURE 2-21:
MCP1640 3.3V VOUT Load
Transient Waveforms.

DS22234A-page 8

FIGURE 2-24:
Waveforms.

3.3V VOUT Line Transient 2010 Microchip Technology Inc.

MCP1640/B/C/D
3.0

PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1:
Pin No.

PIN FUNCTION TABLE

MCP1640/B/C/D MCP1640/B/C/D
SOT23
2x3 DFN

SW

1

GND

2

5

Description
Switch Node, Boost Inductor Input Pin
Ground Pin

EN

3

4

Enable Control Input Pin

FB

4

1

Feedback Voltage Pin

VOUT

5

VIN

6

8

Input Voltage Pin

SGND

2

Signal Ground Pin

PGND

3

Power Ground Pin

VOUTS

7

Output Voltage Sense Pin

VOUTP

6

Output Voltage Power Pin

9

Exposed Thermal Pad (EP); must be connected to VSS.

EP

3.1

—

Output Voltage Pin

Switch Node Pin (SW)

Connect the inductor from the input voltage to the SW
pin. The SW pin carries inductor current and can be as
high as 800 mA peak. The integrated N-Channel switch
drain and integrated P-Channel switch source are internally connected at the SW node.

3.2

Ground Pin (GND)

The ground or return pin is used for circuit ground connection. Length of trace from input cap return, output
cap return and GND pin should be made as short as
possible to minimize noise on the GND pin. In the
SOT23-6 package, a single ground pin is used.

3.3

Enable Pin (EN)The EN pin is a logic-level input used to enable ordisable device switching and lower quiescent current
while disabled. A logic high (>90% of VIN) will enable
the regulator output. A logic low (<20% of VIN) will
ensure that the regulator is disabled.

3.4

Feedback Voltage Pin (FB)The FB pin is used to provide output voltage regulationby using a resistor divider. The FB voltage will be 1.21V
typical with the output voltage in regulation.

3.5

Output Voltage Pin (VOUT)

The output voltage pin connects the integrated
P-Channel MOSFET to the output capacitor. The FB
voltage divider is also connected to the VOUT pin forvoltage regulation.

 2010 Microchip Technology Inc.

3.6

Power Supply Input Voltage Pin(VIN)

Connect the input voltage source to VIN. The input
source should be decoupled to GND with a 4.7 µF
minimum capacitor.

3.7

Signal Ground Pin (SGND)

The signal ground pin is used as a return for the
integrated VREF and error amplifier. In the 2x3 DFN
package, the SGND and power ground (PGND) pins areconnected externally.

3.8

Power Ground Pin (PGND)

The power ground pin is used as a return for the highcurrent N-Channel switch. In the 2x3 DFN package, the
PGND and signal ground (SGND) pins are connected
externally.

3.9

Output Voltage Sense Pin (VOUTS)The output voltage sense pin connects the regulated
output voltage to the internal bias circuits. In the 2x3
DFN package, VOUTS and VOUTP are connected
externally.

3.10

Output Voltage Power Pin (VOUTP)The output voltage power pin connects the output voltage to the switch node. High current flows through the
integrated P-Channel and out of this pin to the output
capacitor and output. In the 2x3 DFN package, VOUTS
and VOUTP are connected externally.
3.11

Exposed Thermal Pad (EP)There is no internal electrical connection between the
Exposed Thermal Pad (EP) and the PGND and SGND
pins. They must be connected to the same potential on
the Printed Circuit Board (PCB).

DS22234A-page 9

MCP1640/B/C/D
NOTES:

DS22234A-page 10

 2010 Microchip Technology Inc.

MCP1640/B/C/D
4.0

DETAILED DESCRIPTION

4.1.3

4.1

Device Option Overview

The MCP1640/B devices incorporate a true output
disconnect feature. With the EN pin pulled low, theoutput of the MCP1640/B is isolated or disconnectedfrom the input by turning off the integrated P-Channel
switch and removing the switch bulk diode connection.
This removes the DC path typical in boost converters,
which allows the output to be disconnected from the
input. During this mode, less than 1 µA of current isconsumed from the input (battery). True output disconnect does not discharge the output; the output voltage
is held up by the external COUT capacitance.

The MCP1640/B/C/D family of devices is capable oflow start-up voltage and delivers high efficiency over awide load range for single cell, two cell, three cellalkaline, NiMH, NiCd and single cell Li-Ion battery
inputs. A high level of integration lowers total systemcost, eases implementation and reduces board area.
The devices feature low start-up voltage, adjustable
output voltage, PWM/PFM mode operation, low IQ,
integrated synchronous switch, internal compensation,
low noise anti-ring control, inrush current limit and soft
start. There are two feature options for the MCP1640/
B/C/D family: PWM/PFM mode or PWM mode only,and “true output disconnect” or input bypass.

4.1.1

PWM/PFM MODE OPTION

The MCP1640/C devices use an automatic switchoverfrom PWM to PFM mode for light load conditions tomaximize efficiency over a wide range of output
current. During PFM mode, higher peak current is used
to pump the output up to the threshold limit. While
operating in PFM or PWM mode, the P-Channel switch
is used as a synchronous rectifier, turning off when the
inductor current reaches 0 mA to maximize efficiency.
In PFM mode, a comparator is used to terminate
switching when the output voltage reaches the upper
threshold limit. Once switching has terminated, theoutput voltage will decay or coast down. During thisperiod, very low IQ is consumed from the device andinput source, which keeps power efficiency high at lightload. The disadvantages of PWM/PFM mode arehigher output ripple voltage and variable PFM mode
frequency. The PFM mode frequency is a function of
input voltage, output voltage and load. While in PFM
mode, the boost converter pumps the output up at aswitching frequency of 500 kHz.

4.1.2

4.1.4

TRUE OUTPUT DISCONNECT
OPTIONINPUT BYPASS OPTION

The MCP1640C/D devices incorporate the input
bypass shutdown option. With the EN input pulled low,
the output is connected to the input using the internal
P-Channel MOSFET. In this mode, the current draw
from the input (battery) is less than 1 µA with no load.
The Input Bypass mode is used when the input voltage
range is high enough for the load to operate in Sleep or
low IQ mode. When a higher regulated output voltage isnecessary to operate the application, the EN input ispulled high enabling the boost converter.

TABLE 4-1:

PART NUMBER SELECTION

Part
NumberPWM/
PFM

MCP1640X

MCP1640B
MCP1640C
MCP1640D

PWM

True Dis Bypass
X

X
X

X
X

X

X

PWM MODE ONLY OPTION

The MCP1640B/D devices disable PFM modeswitching, and operate only in PWM mode over theentire load range. During periods of light load operation, the MCP1640B/D continues to operate at a constant 500 kHz switching frequency keeping the output
ripple voltage lower than PFM mode. During PWM only
mode, the MCP1640B/D P-Channel switch acts as asynchronous rectifier by turning off to prevent reverse
current flow from the output cap back to the input inorder to keep efficiency high. For noise immunity, theN-Channel MOSFET current sense is blanked forapproximately 100 ns. With a typical minimum duty
cycle of 100 ns, the MCP1640B/D continues to switch
at a constant frequency under light load conditions.
Figure 2-12 represents the input voltage versus load
current for the pulse skipping threshold in PWM onlymode. At lighter loads, the MCP1640B/D devices begin
to skip pulses.

 2010 Microchip Technology Inc.

DS22234A-page 11

MCP1640/B/C/D
4.2

Functional Description

Figure 4-1 depicts the functional block diagram of the
MCP1640/B/C/D.

The MCP1640/B/C/D is a compact, high-efficiency,
fixed frequency, step-up DC-DC converter thatprovides an easy-to-use power supply solution for
applications powered by either one-cell, two-cell, or
three-cell alkaline, NiCd, or NiMH, or one-cell Li-Ion or
Li-Polymer batteries.
VOUT

VIN

INTERNAL
BIAS

IZERO
DIRECTIONCONTROLSW

SOFT-START.3V
GATE DRIVEAND
SHUTDOWNCONTROL
LOGIC

EN

0V

ILIMITISENSEGND

OSCILLATOR



SLOPE
COMP.

PWM/PFM
LOGIC
1.21V

FB
EA

FIGURE 4-1:
4.2.1

MCP1640/B/C/D Block Diagram.

LOW-VOLTAGE START-UP

The MCP1640/B/C/D is capable of starting from a low
input voltage. Start-up voltage is typically 0.65V for a
3.3V output and 1 mA resistive load.
When enabled, the internal start-up logic turns therectifying P-Channel switch on until the output
capacitor is charged to a value close to the input
voltage. The rectifying switch is current limited during
this time. After charging the output capacitor to the
input voltage, the device starts switching. If the input
voltage is below 1.6V, the device runs open-loop with afixed duty cycle of 70% until the output reaches 1.6V.
During this time, the boost switch current is limited toDS22234A-page 12

50% of its nominal value. Once the output voltage
reaches 1.6V, normal closed-loop PWM operation is
initiated.
The MCP1640/B/C/D charges an internal capacitor
with a very weak current source. The voltage on thiscapacitor, in turn, slowly ramps the current limit of theboost switch to its nominal value. The soft-startcapacitor is completely discharged in the event of acommanded shutdown or a thermal shutdown.
There is no undervoltage lockout feature for the
MCP1640/B/C/D. The device will start up at the lowest
possible voltage and run down to the lowest possible
voltage. For typical battery applications, this may resultin “motor-boating” for deeply discharged batteries.

 2010 Microchip Technology Inc.

MCP1640/B/C/D
4.2.2

PWM MODE OPERATION

In normal PWM operation, the MCP1640/B/C/D
operates as a fixed frequency, synchronous boost
converter. The switching frequency is internally
maintained with a precision oscillator typically set to
500 kHz. The MCP1640B/D devices will operate in
PWM only mode even during periods of light load
operation. By operating in PWM only mode, the output
ripple remains low and the frequency is constant.
Operating in fixed PWM mode results in lower
efficiency during light load operation (when compared
to PFM mode (MCP1640/C)).
Lossless current sensing converts the peak current signal to a voltage to sum with the internal slope compensation. This summed signal is compared to the voltage
error amplifier output to provide a peak current control
command for the PWM signal. The slope
compensation is adaptive to the input and output
voltage. Therefore, the converter provides the properamount of slope compensation to ensure stability, but is
not excessive, which causes a loss of phase margin.
The peak current limit is set to 800 mA typical.

4.2.3

PFM MODE OPERATIONThe MCP1640/C devices are capable of operating innormal PWM mode and PFM mode to maintain highefficiency at all loads. In PFM mode, the output ripple
has a variable frequency component that changes with
the input voltage and output current. With no load, thequiescent current draw from the output is typically
19 µA. The PFM mode can be disabled in selected
device options.
PFM operation is initiated if the output load current falls
below an internally programmed threshold. The output
voltage is continuously monitored. When the output
voltage drops below its nominal value, PFM operation
pulses one or several times to bring the output backinto regulation. If the output load current rises above
the upper threshold, the MCP1640/C transitions
smoothly into PWM mode.

4.2.4

ADJUSTABLE OUTPUT VOLTAGE

The MCP1640/B/C/D output voltage is adjustable witha resistor divider over a 2.0V minimum to 5.5V
maximum range. High value resistors arerecommended to minimize quiescent current to keep
efficiency high at light loads.

4.2.5

ENABLE

4.2.6

INTERNAL BIAS

The MCP1640/B/C/D gets its start-up bias from VIN.
Once the output exceeds the input, bias comes fromthe output. Therefore, once started, operation iscompletely independent of VIN. Operation is only
limited by the output power level and the input source
series resistance. Once started, the output will remain
in regulation down to 0.35V typical with 1 mA output
current for low source impedance inputs.

4.2.7

INTERNAL COMPENSATIONThe error amplifier, with its associated compensation
network, completes the closed loop system bycomparing the output voltage to a reference at the
input of the error amplifier, and feeding the amplified
and inverted signal to the control input of the innercurrent loop. The compensation network provides
phase leads and lags at appropriate frequencies tocancel excessive phase lags and leads of the power
circuit. All necessary compensation components andslope compensation are integrated.

4.2.8

SHORT CIRCUIT PROTECTION

Unlike most boost converters, the MCP1640/B/C/D
allows its output to be shorted during normal operation.
The internal current limit and overtemperature
protection limit excessive stress and protect the device
during periods of short circuit, overcurrent and overtemperature. While operating in Bypass mode, theP-Channel current limit is inhibited to minimize
quiescent current.

4.2.9

LOW NOISE OPERATIONThe MCP1640/B/C/D integrates a low noise anti-ringswitch that damps the oscillations typically observed at
the switch node of a boost converter when operating in
the discontinuous inductor current mode. This removes
the high frequency radiated noise.

4.2.10OVERTEMPERATURE
PROTECTION

Overtemperature protection circuitry is integrated in the
MCP1640/B/C/D. This circuitry monitors the device
junction temperature and shuts the device off if thejunction temperature exceeds the typical +150oC
threshold. If this threshold is exceeded, the device willautomatically restart once the junction temperaturedrops by 10oC. The soft start is reset during an
overtemperature condition.

The enable pin is used to turn the boost converter onand off. The enable threshold voltage varies with input
voltage. To enable the boost converter, the EN voltage
level must be greater than 90% of the VIN voltage. To
disable the boost converter, the EN voltage must be
less than 20% of the VIN voltage.

 2010 Microchip Technology Inc.

DS22234A-page 13

MCP1640/B/C/D
NOTES:

DS22234A-page 14

 2010 Microchip Technology Inc.

MCP1640/B/C/D
5.0

APPLICATION INFORMATION

5.1

Typical Applications

The MCP1640/B/C/D synchronous boost regulator
operates over a wide input voltage and output voltage
range. The power efficiency is high for several decadesof load range. Output current capability increases with
input voltage and decreases with increasing output
voltage. The maximum output current is based on the
N-Channel peak current limit. Typical characterization
curves in this data sheet are presented to display thetypical output current capability.

5.2

Adjustable Output Voltage
Calculations

To calculate the resistor divider values for the
MCP1640/B/C/D, the following equation can be used.
Where RTOP is connected to VOUT, RBOT is connected
to GND and both are connected to the FB input pin.

EQUATION 5-1:

V OUT R TOP = R BOT   -----------–1
 V - FB
Example A:
VOUT = 3.3V
VFB = 1.21V
RBOT = 309 k
RTOP = 533.7 k (Standard Value = 536 k)

5.3

Input Capacitor Selection

The boost input current is smoothed by the boost
inductor reducing the amount of filtering necessary at
the input. Some capacitance is recommended toprovide decoupling from the source. Low ESR X5R or
X7R are well suited since they have a low temperature
coefficient and small size. For most applications,
4.7 µF of capacitance is sufficient at the input. For highpower applications that have high source impedance orlong leads, connecting the battery to the input 10 µF of
capacitance is recommended. Additional input
capacitance can be added to provide a stable input
voltage.
Table 5-1 contains the recommended range for the
input capacitor value.

5.4

Output Capacitor Selection

The output capacitor helps provide a stable output
voltage during sudden load transients and reduces theoutput voltage ripple. As with the input capacitor, X5R
and X7R ceramic capacitors are well suited for thisapplication.
The MCP1640/B/C/D is internally compensated so
output capacitance range is limited. See Table 5-1 forthe recommended output capacitor range.
While the N-Channel switch is on, the output current is
supplied by the output capacitor COUT. The amount of
output capacitance and equivalent series resistancewill have a significant effect on the output ripple
voltage. While COUT provides load current, a voltage
drop also appears across its internal ESR that resultsin ripple voltage.

Example B:
VOUT = 5.0V

EQUATION 5-2:

VFB = 1.21V

dV
I OUT = C OUT   -------dt

RBOT = 309 k
RTOP = 967.9 k (Standard Value = 976 k)There are some potential issues with higher value
resistors. For small surface mount resistors,
environment contamination can create leakage paths
that significantly change the resistor divider that effectthe output voltage. The FB input leakage current canalso impact the divider and change the output voltage
tolerance.

Where dV represents the ripple voltage and dt
represents the ON time of the N-Channel switch (D * 1/
FSW).
Table 5-1 contains the recommended range for the
input and output capacitor value.

TABLE 5-1:

CAPACITOR VALUE RANGE
CIN

 2010 Microchip Technology Inc.

COUT

Min

4.7 µF

10 µF

Max

none

100 µFDS22234A-page 15

MCP1640/B/C/D
5.5

Inductor Selection

The MCP1640/B/C/D is designed to be used with small
surface mount inductors; the inductance value canrange from 2.2 µH to 10 µH. An inductance value of
4.7 µH is recommended to achieve a good balance
between inductor size, converter load transient
response and minimized noise.

TABLE 5-2:
Part
Number

MCP1640/B/C/D
RECOMMENDED INDUCTORS
Value
(µH)

DCR
 (typ)

ISAT
(A)

Size
WxLxH (mm)SD3110

4.7

0.285

0.68

3.1x3.1x1.0

SD3112

4.7

0.246

0.80

3.1x3.1x1.2

SD3114

4.7

0.251

1.14

3.1x3.1x1.4

Coiltronics®

SD3118

4.7

0.162

1.31

3.8x3.8x1.2

SD3812

4.7

0.256

1.13

3.8x3.8x1.2

SD25

4.7

0.04671.83

5.0x5.0x2.5

Part
Number

Value
(µH)

DCR

(max)

ISAT
(A)

Size
WxLxH (mm)Wurth Elektronik®

Peak current is the maximum or limit, and saturation
current typically specifies a point at which the inductance has rolled off a percentage of the rated value.
This can range from a 20% to 40% reduction in inductance. As inductance rolls off, the inductor ripple current increases as does the peak switch current. It is
important to keep the inductance from rolling off too
much, causing switch current to reach the peak limit.

5.6

Thermal Calculations

The MCP1640/B/C/D is available in two different
packages (SOT23-6 and 2x3 DFN8). By calculating thepower dissipation and applying the package thermal
resistance, (JA), the junction temperature is estimated. The maximum continuous junction temperature
rating for the MCP1640/B/C/D is +125oC.
To quickly estimate the internal power dissipation forthe switching boost regulator, an empirical calculation
using measured efficiency can be used. Given themeasured efficiency, the internal power dissipation isestimated by Equation 5-3.

EQUATION 5-3:
OUT  I OUTV------------------------------ –  V OUT  I OUT  = P Dis
 Efficiency 

WE-TPCType TH

4.7

0.200

0.8

2.8x2.8x1.35

WE-TPCType S

4.7

0.105

0.90

3.8x3.8x1.65

WE-TPCType M

4.7

0.082

1.65

4.8x4.8x1.8

WE-TPCType X

4.7

0.046

2.00

6.8x6.8x2.3

Part
Number

Value
(µH)

DCR

(max)

ISAT
(A)

Size
WxLxH (mm)

CMH23

4.7

0.537

0.70

2.3x2.3x1.0

CMD4D06

4.7

0.216

0.75

3.5x4.3x0.8

5.7

CDRH4D

4.7

0.09

0.800

4.6x4.6x1.5

B82462A2
472M000

4.7

0.084

2.00

6.0x6.0x2.5

B82462G4
472M

4.7

0.04

1.8

6.3x6.3x3.0

Good printed circuit board layout techniques areimportant to any switching circuitry and switching
power supplies are no different. When wiring theswitching high current paths, short and wide traces
should be used. Therefore it is important that the input
and output capacitors be placed as close as possible to
the MCP1640/B/C/D to minimize the loop area.

Sumida®

EPCOS®

Several parameters are used to select the correct
inductor: maximum rated current, saturation current
and copper resistance (ESR). For boost converters, theinductor current can be much higher than the output
current. The lower the inductor ESR, the higher theefficiency of the converter, a common trade-off in size
versus efficiency.

DS22234A-page 16

The difference between the first term, input power, andthe second term, power delivered, is the internal
MCP1640/B/C/D power dissipation. This is an estimate
assuming that most of the power lost is internal to the
MCP1640/B/C/D and not CIN, COUT and the inductor.
There is some percentage of power lost in the boost
inductor, with very little loss in the input and output
capacitors. For a more accurate estimation of internal
power dissipation, subtract the IINRMS2*LESR power
dissipation.

PCB Layout Information

The feedback resistors and feedback signal should berouted away from the switching node and the switchingcurrent loop. When possible, ground planes and traces
should be used to help shield the feedback signal andminimize noise and magnetic interference.

 2010 Microchip Technology Inc.

MCP1640/B/C/D
Via to GND Plane

RBOT RTOP

+VIN

+VOUT
CIN

L

MCP1640
1

GND

GND
FIGURE 5-1:

COUT

Via for Enable

MCP1640/B/C/D SOT23-6 Recommended Layout.

Wired on Bottom
Plane

L

+VIN
+VOUT
CIN

COUT

GND

MCP1640

RTOP

1

RBOT
EnableGND
FIGURE 5-2:

MCP1640/B/C/D DFN-8 Recommended Layout.

 2010 Microchip Technology Inc.

DS22234A-page 17

MCP1640/B/C/D
NOTES:

DS22234A-page 18

 2010 Microchip Technology Inc.

MCP1640/B/C/D
6.0

TYPICAL APPLICATION CIRCUITS
L1
4.7 µHVOUTMANGANESE LITHIUMDIOXIDE BUTTON CELL+
2.0V TO 3.2V-

5.0V @ 5 mA

SW V
OUT
VIN
CIN
4.7 µF

976 K

VFB

EN

COUT
10 µF

309 K
®

FROM PIC MCU I/O
Note:

FIGURE 6-1:

GND

For applications that can operate directly from the battery input voltage during Sleep mode andrequire a higher voltage during normal run mode, the MCP1640C device provides input to output
bypass when disabled. The PIC Microcontroller is powered by the output of the MCP1640C. One
of its I/O pins is used to enable and disable the MCP1640C to control its bias voltage. While
operating in Sleep mode, the MCP1640C input quiescent current is typically less than 1 uA.

Manganese Lithium Coin Cell Application using Bypass Mode.

L1
10 µH

VIN
3.3V To 4.2V

LI-ION+-FIGURE 6-2:

CIN
10 µF

SW V

VOUT
5.0V @ 350 mA
OUTS

VIN

VOUTP

EN

VFB

976 K

COUT
10 µF

309 K

PGND SGND

USB On-The-Go Powered by Li-Ion.

 2010 Microchip Technology Inc.

DS22234A-page 19

MCP1640/B/C/D
NOTES:

DS22234A-page 20

 2010 Microchip Technology Inc.

MCP1640/B/C/D
7.0

PACKAGING INFORMATION

7.1

Package Marking Information (Not to Scale)

6-Lead SOT-23

XXNN
8-Lead DFN

XXX
YWW
NN

Legend: XX...X
Y
YY
WW
NNN

e3

*

Note:

ExampleBZNN
Example

AHM
945
25

Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability codePb-free JEDEC designator for Matte Tin (Sn)This package is Pb-free. The Pb-free JEDEC designator ( e3)can be found on the outer packaging for this package.

In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.

 2010 Microchip Technology Inc.

DS22234A-page 21

MCP1640/B/C/D    

/$  !$% $ 0
$$ ,33...   3

" . !1 
0 

! !

$  2 0 

& $ $ " $

b

4

N

E
E1
PIN 1 ID BY
LASER MARK
1

2

3

e
e1
D

A

A2

c

φ

L

A1

L1
4$!

6% 9 &2!

!5 $!

55##
6





*+2$
7%$!" 58)*+"2$

7-  :  $" "2 00 !!

$ "&&7-  ="$" "2 0
7-  5  $

 
 
 

67

6

="$





;



<

;

)






;

)


#



;

#



;

<





;



/$5  $

5



;



/$ $

5

)

;

<

/$ 



>

;

>

5

"0 !!



<

;



5

"="$

9



;

)

!! "#"$%"  "& ! $%!!"& ! $%!!! $ '
!  "$    #()
*+, * ! !  $  ' $- % !..$%$$   !

"



!" 

     . + <*DS22234A-page 22

 2010 Microchip Technology Inc.

MCP1640/B/C/D
Note:

For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

 2010 Microchip Technology Inc.

DS22234A-page 23

MCP1640/B/C/D!  " #  $ %&'())*+,-."#/$  !$% $ 0
$$ ,33...   3

" . !1 
0 

! !

$  2 0 

& $ $ " $

e

D

b

N

N
L

K
E2

E

EXPOSED PADNOTE 1NOTE 1
2

1

1

2
D2

BOTTOM VIEWTOP VIEWA

A3NOTE 2

A1

4$!

6% 9 &2!

!5 $!

55##
6

6

67

8

<

2$

)*+7-  :  $



<





$ "&&







)

+$ $0 !!

#/7-  5  $*+7-  ="$##' ! "2 "5  $





;

#' ! "2 "="$

#

)

;

)

+$ $="$

9



)



+$ $5  $

5





)

+$ $ $ #' ! "2 "

?



;

;

*+  2-!% " '& $%  - 19%$ %!$9  $ ".$$  $ "   2 0  -     ' ! "$ 9 ! $ "!
 2 0
!! .! % $ "  !  "$    #()
*+, * ! !  $  ' $- % !..$%$$   !
#/,  &    !1%!% .$%$$   1&& $ % ! !

))     . + +DS22234A-page 24

 2010 Microchip Technology Inc.

MCP1640/B/C/D!  " #  $ %&'())*+,-."#/$  !$% $ 0
$$ ,33...   3

 2010 Microchip Technology Inc.

" . !1 
0 

! !

$  2 0 

& $ $ " $DS22234A-page 25

MCP1640/B/C/D
NOTES:

DS22234A-page 26

 2010 Microchip Technology Inc.

MCP1640/B/C/D
APPENDIX A:REVISION HISTORY

Revision A (February 2010)• Original Release of this Document.

 2010 Microchip Technology Inc.

DS22234A-page 27

MCP1640/B/C/D
NOTES:

DS22234A-page 28

 2010 Microchip Technology Inc.

MCP1640/B/C/D
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.

X

X

/XX

DeviceTapeand Reel

Temperature
Range

Package

Device0.65V, PWM/PFM True Disconnect,
Sync Boost Regulator
MCP1640T: 0.65V, PWM/PFM True Disconnect,
Sync Boost Regulator (Tape and Reel)
MCP1640B: 0.65V, PWM Only True Disconnect,
Sync Boost Regulator
MCP1640BT: 0.65V, PWM Only True Disconnect,
Sync Boost Regulator (Tape and Reel)
MCP1640C: 0.65V, PWM/PFM Input to Output Bypass,
Sync Boost Regulator
MCP1640CT: 0.65V, PWM/PFM Input to Output Bypass,
Sync Boost Regulator (Tape and Reel)
MCP1640D: 0.65V, PWM Only Input to Output Bypass,
Sync Boost Regulator
MCP1640DT: 0.65V, PWM Only Input to Output Bypass,
Sync Boost Regulator (Tape and Reel)

Examples:a)

MCP1640-I/MC:b)

MCP1640T-I/MC:c)

MCP1640B-I/MC:d)

MCP1640BT-I/MC:e)

MCP1640C-I/MC:f)

MCP1640CT-I/MC:g)

MCP1640D-I/MC::

MCP1640:

Temperature RangeI= -40C to+85C(Industrial)

Package

CH = Plastic Small Outline Transistor (SOT-23), 6-lead
MC = Plastic Dual Flat, No Lead (2x3 DFN), 8-lead

0.65V, Sync Reg.,
8LD-DFN pkg.
Tape and Reel,
0.65V, Sync Reg.,
8LD-DFN pkg.
0.65V, Sync Reg.,
8LD-DFN pkg.
Tape and Reel,
0.65V, Sync Reg.,
8LD-DFN pkg.

h)0.65V, Sync Reg.,
8LD-DFN pkg.
MCP1640DT-I/MC:: Tape and Reel,
0.65V, Sync Reg.,
8LD-DFN pkg.

i)

MCP1640T-I/CHY:

j)

k)

l)

 2010 Microchip Technology Inc.

0.65V, Sync Reg.,
8LD-DFN pkg.
Tape and Reel,
0.65V, Sync Reg.,
8LD-DFN pkg.

Tape and Reel,
0.65V, Sync Reg.,6LD SOT-23 pkg.
MCP1640BT-I/CHY: Tape and Reel,
0.65V, Sync Reg.,6LD SOT-23 pkg.
MCP1640CT-I/CHY: Tape and Reel,
0.65V, Sync Reg.,6LD SOT-23 pkg.
MCP1640DT-I/CHY: Tape and Reel,
0.65V, Sync Reg.,6LD SOT-23 pkg.

DS22234A-page 29

MCP1640/B/C/D
NOTES:

DS22234A-page 30

 2010 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:•

Microchip products meet the specification contained in their particular Microchip Data Sheet.

•

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in theintended manner and under normal conditions.

•

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to ourknowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

•

Microchip is willing to work with the customer who is concerned about the integrity of their code.

•

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does notmean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such actsallow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device
applications and the like is provided only for your convenienceand may be superseded by updates. It is your responsibility toensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely atthe buyer’s risk, and the buyer agrees to defend, indemnify andhold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses areconveyed, implicitly or otherwise, under any Microchip
intellectual property rights.

Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,rfPIC and UNI/O are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, PIC32 logo, REAL ICE, rfLAB, Select Mode, Total
Endurance, TSHARC, UniWinDriver, WiperLock and ZENA
are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of theirrespective companies.
© 2010, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.

ISBN: 978-1-60932-019-5

Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler andTempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and proceduresare for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory andanalog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.

 2010 Microchip Technology Inc.

DS22234A-page 31

WORLDWIDE SALES AND SERVICEAMERICAS

ASIA/PACIFIC

ASIA/PACIFICEUROPE

Corporate Office2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:www.microchip.com

Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431

India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632

Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829

India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513

France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79

Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122

Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44

Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
BostonWestborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
ChicagoItasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
DallasAddison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
KokomoKokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
TorontoMississauga, Ontario,
CanadaTel: 905-673-0699
Fax: 905-673-6509

Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889

Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302

China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500

Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934

China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431

Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859

China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470

Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068

China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205

Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069

China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066

Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850

China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393

Taiwan - Hsin Chu
Tel: 886-3-6578-300
Fax: 886-3-6578-370

China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760

Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803

China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118

Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102

China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256

Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350

Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820

China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049

01/05/10

DS22234A-page 32

 2010 Microchip Technology Inc.