SPECIAL FEATURE

LINTEC’sSemiconductor-Related Business
LINTEC’s semiconductor-related business began in 1986 with the development of a fixing tape for use in the wafer cutting
process in the manufacture of semiconductors—a UV curable dicing tape. Such tapes adhere strongly to thin wafers, holding
them firm when they are being diced into chips. Adhesion is then reduced through UV irradiation after dicing for easy
removal when the chips are picked up. This tape radically changed the semiconductor industry. Since then, we have developed many semiconductor-related tapes. We have also developed semiconductor-related equipment that fully leverages thespecial features of our tapes. In such ways, we have established our own unique position within the industry.

The manufacture of semiconductors involves the formation of anumber of electronic circuits on the surface of a wafer sliced fromcolumnar silicon ingot. The wafer is then ground on the backside to
make it thinner and cut into individual chips, which are then mounted
and stacked on a substrate. All of our semiconductor-related

Single crystal
silicon ingot

SliceCircuit
formation

Wafer

Front-end
process

adhesive tapes and equipment are used in back-end processes after
circuit formation.

Lamination of surface
protective tapeBack-end
process

Back grinding(wafer thinning)

Reverse1

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Lamination ofdicing tape

Removal of surface
protective tape

Dicing(wafer cutting)Reverse2

Back grinding

DicingThis is the process of using a grinding wheel to grind the backside of the wafer to make it thinner. Tape is affixed to protect
the circuit-carrying front from grinding water and dust.

Dicing is the process of cutting the wafers into individual chips.
Tape is placed on the backsides of wafers to fix them to a ringframe, thereby preventing chips from scattering during cutting.

Tapes that protect the surface of wafer circuits and tape laminator

Dicing tapes and wafer mounter that secure wafers to ring frames

LINTEC ANNUAL REPORT 2018

FocusFlip chip mounting and backside coating tape for chips

Various methods for mounting chips

In recent years, as smartphones and other electronic devices have

ワイヤー
ワイヤー
Wire
粘着剤with flip chips, which are connected to the substrate by bumps (protruding electrodes on the circuit) and with the circuit facing downward, have

粘着剤
Adhesive

Wire bonding

come into widespread use instead of wire bonding (in which the chip is基板
基板

Substrate
チップ
Chipチップ

mounted and wires are used to connect the chip to the substrate).
Flip chip mounting has the advantage of enhancing electrical properties and reducing the mounting area. However, because the backside ofOVERVIEW

チップ
Chipチップ

become thinner and advanced in performance, semiconductor packages

Flip chip

the chip is exposed, reinforcing the chip became an issue as chips

バンプBump
バンプ electrode
粘着剤
粘着剤
Adhesive
基板
Substrate
基板

became thinner. In response, we came up with the idea of using tapes toチップ
チップ

protect and reinforce the backside surfaces of flip chips. The result was貫通電極
貫通電極
バンプ
バンプ

that LINTEC was the first mover in developing backside coating tapes for

粘着剤
粘着剤
チップ
チップ

that enable detection of imperfections in chips through infrared rays and基板
基板

STRATEGY

flip chips. Tailored to meeting customer needs, our lineup spans tapes
tapes with outstanding heat dissipation qualities. Our global share inbackside coating tape for flip chips is almost 100%.

Backside coating tapes for flip chips

テープ
テープ

UV irradiation of tape

Picking up

Mounting

Molding

ESG

34

Picking up and Mounting

Molding
This process involves connecting
the mounted and stacked chips
on a substrate with wires andsealing with liquid resin.

FINANCIAL INFORMATIONThis process involves picking up thecut chips, and mounting and stacking
on the substrate with adhesive. Aftercutting, the tape’s adhesion is reduced
through UV irradiation so that chips
can be picked up easily. We also offer a
proprietary process that transfers theadhesive of the fixing tape, which isused at the time of wafer cutting, tothe back of the chip when it is picked
up so that it can be mounted on thesubstrate directly.

Equipment for UV irradiation A multifunction tape that has theof the dicing tape to reduce
functions of a dicing tape as well as a
its adhesion
function that transfers adhesive for use
in die bonding

LINTEC ANNUAL REPORT 201819