zSFP+ (SFP28/56) 28/56 GBPS PLUGGABLE

I/O INTERCONNECT

The zSFP+ interconnect is currently one of the fastest single-channel I/O connectors on the market today, transferring data at 28Gbps with possible expansion to 56 Gbps. Through a design that is backward-compatible to SFP/SFP+ products, the interconnect ishot-swappable with existing SFP+ connectors for fast system upgrades of 28-56 Gbps. Alternatively, users can design-in the zSFP+connector for 10-16 Gbps data rates, establishing a progressive path to higher speeds–an upgradeability that can result in longterm
cost savings as this would eliminate the need to fully redesign for higher performance.
The zSFP+ interconnect is compliant to SFF-8402 and has been adopted for Fibre Channel 32G (28.05 Gbps line rate). The entire
product family is offered as a dual source option with Molex. LLC.

DATA AND DEVICES /// zSFP+ 28/56 GBPS I/O INTERCONNECTzSFP+ 28/56 Gbps Pluggable I/O Interconnect
FEATURES• Data rates: Up to 56 Gbps, 10 Gbps Ethernet and 16 GbpsFibre Channel• Surface-mount connector design for single high 1xN cages• Press-fit 1xN cages and stacked assemblies (connector andcage) for one-step, easy PCB placement

Light pipe options include:No light pipes• Coupled, narrow-edged, blanked- and formed-contact beamgeometry and insert molding for superior signal integrity,
mechanical and electrical performance

All 4 light pipes (shown left)• Backwards-compatibility: Shares same mating interface andcage dimensions with the SFP+ connector (connector/single
high cages are also PCB footprint-compatible)

Outer light pipes [standard]• Elastomeric gasket or spring finger options for EMI
containment• Single high cages (1xN) for design flexibility; accommodates
belly-to-belly applications for increased density andPCB space savings; available in 1x1, 1x2, 1x4 or 1x6 port
configurations

Inner light pipes

Three light pipes
Outer light pipes [reversed]• Stacked assemblies offered in 2x1, 2x2, 2x4, 2x6, 2x8 or 2x12port• Heat sinks, LEDs and plating choices offered• Additional light pipe configurations available

APPLICATIONS• Telecommunications: Cellular infrastructure, central office
uplink equipment, optical transport equipment, switches/routers, access equipment (CMTS, PON, DSL, etc)
• Data Center: Data center switches and routers, servers,storage• Medical: Medical diagnostic equipment• Networking: Network interface, switches, routers• Test and Measurement Equipment

20-Pin Surface-Mount Connector
Electrical• Voltage (max.): 120V AC• Current (max.): 0.5A
• Dielectric Withstanding Voltage:

300V AC between contacts
Mechanical• Mating Force: 25N• Unmating Force: 11.5N• Durability (min.): 250 cycles

Physical• High-temperature thermoplastic housing (glass-filled, UL

94V-0 black)• High-performance copper alloy contacts• Plating:-- Nickel underplating; Tin plating on solder tail area;

Gold plating on mating area-- Plating options: 15 and 30μ” Gold or Palladium Nickel• Operating Temperature: -40 to +85oC

DATA AND DEVICES /// zSFP+ 28/56 GBPS I/O INTERCONNECT

PAGE 2zSFP+ 28/56 Gbps Pluggable I/O Interconnect

Connector P/N

Description

2170088-1

30μ” in Au or Au Flash Over PdNi

2170088-2

15μ” in Au or Au Flash Over PdNi

Cages with Elastomeric Gaskets
EMISuppression
EMI gasket

Light PipeOption

1X11X21X41X6

1X8

No

2198709-1*

2198720-1

2198722-1

2198724-1

TBD**

Yes

2198708-1*

2198719-1

2198721-1

2198723-1

TBD**

1X2

1x3

1X4

1X6

2227728-1

2349050-1

2227730-1

2227732-1

Cages with EMI Springs
EMI
Suppression

Light Pipe
OptionHeat Sink
Option

NoNo

Yes

No

2274000-1

2227727-1

TBD**

2227729-1

2227731-1

TBD**

Yes

Yes

TBD*

TBD**

TBD**

2304342-X

2293156-X

2294408-X

EMI Spring
Fingers

1X1
2274001-1
2291579-1 (PCI)

1X82304921-12295325-6*Tooling in process **Not yet tooled, but planned

Ganged 1xN Cages
MechanicalPhysical• Transceiver insertion force (max.): 34 N without heat sink and clip;• Cage material: Nickel Silver

45.37 N with heat sink and clip

• PCB thickness (min.): 1.50mm in single sided• Transceiver extraction force (max.): 12.5 N without heat sink andapplications; 2.25mm (EMI springs) or 3.0mm(elastomeric gasket) in belly-to-belly applications

clip; 14.36 N with heat sink and clip
• SFP+ module to surface-mount connector and zSFP+ cage.
• Cage press fit insertion force (max.): 44.5 N for single port cage,• Operating Temperature: -40 to +85oC

54.3 N for ganged cage
• Cage press fit extraction force (min.): 8.9 N for single port andganged cages• Durability (min.): 100 cycles
Ganged SFP+ 1x4 vs. zSFP+ 1x4

Radiated source RF leakage (dB)0-10-20-30-40

Ganged SFP+ 1x4 —Ganged zSFP+ 1x4 —-50-60-70-80
051015202530GHzDATA AND DEVICES /// zSFP+ 28/56 GBPS I/O INTERCONNECT

PAGE 3zSFP+ 28/56 Gbps Pluggable I/O Interconnect
Stacked 2xN Assemblies
Electrical

Stacked SFP+ vs. zSFP+0• Current (max.): 0.5A
• Dielectric Withstanding Voltage: 300V AC

between contacts
Mechanical• Durability (min.): 100 cycles

Physical• Cage material: Nickel Silver-- High-temperature thermoplastic housing(glass-filled, UL 94V-0 black)-- High-performance copper alloy contacts

Radiated source RF leakage (dB)

• Voltage (max.): 120V AC-10-20-30-40-50

Stacked SFP+ —Stacked zSFP+ —-60-70-80-- Plating: Nickel underplating; Tin plating0on solder tail area; 30μ” Gold plating on
mating area

51015202530GHz• PCB thickness (min.): 1.57mm• Operating Temperature: -40 to +85oC

Upper contact row —Lower contact row —EMI gasket

EMI
Suppression

PerformanceStandard

Thermally

EMI spring fingers

Enhanced

Standard

Thermally
Enhanced

Light Pipe
Configuration

2x1

2x2

2x4

2x6

2x8

2x12

2198318-(x)2198325-(x)2180324-(x)2198339-(x)2198346-(x)2288172-(x)None2198318-1

2198325-1

2180324-1

2198339-1

2198346-1

2288172-1

All 42198318-2

2198325-2

2180324-2

2198339-2

2198346-2

2288172-2

Inner2198318-3

2198325-3

2180324-3

2198339-3

2198346-3

2288172-3

Outer

2198318-4

2198325-4

2180324-4

2198339-4

2198346-4

2288172-4

3

1-2198318-7

1-2198325-7

1-2180324-7

1-2198339-7

1-2198346-7

1-2288172-7

Outer (reversed)

1-2198318-8

1-2198325-8

1-2180324-8

1-2198339-8

1-2198346-8

1-2288172-8

Multiple----

3-2180324-0----2227838-8

None2198318-5

2198325-5

2180324-5

2198339-5

2198346-5

2288172-5

All 42198318-6

2198325-6

2180324-6

2198339-6

2198346-6

2288172-6

Inner

2198318-7

2198325-7

2180324-7

2198339-7

2198346-7

2288172-7

Outer

2198318-8

2198325-8

2180324-8

2198339-8

2198346-8

2288172-8

3

1-2198318-9

1-2198325-9

1-2180324-9

1-2198339-9

1-2198346-9

1-2288172-9

Outer (reversed)

2-2198318-0

2-2198325-02-2180324-0

2-2198339-0

2-2198346-0

2-2288172-0

Multiple----3-2180324-1

2291491-1--DATA AND DEVICES /// zSFP+ 28/56 GBPS I/O INTERCONNECT

2227838-7
2301210-2

PAGE 4zSFP+ 28/56 Gbps Pluggable I/O Interconnect
SFP28/56 Passive Copper Cable Assemblies
Our SFP28/56 passive copper cable assembly features two differential copper pairs, providing one data transmission channel
at speeds up to 56 Gbps per channel.
Offered in a broad range of wire gages – from 30AWG through 32AWG – this next generation copper cable assembly features
low insertion loss and low cross talk. Our SFP28/56 assemblies share the same mating interface with SFP+ form factors,
making them backward compatible with existing SFP+ I/O ports. SFP28/56 cable assemblies can be used with legacy 10G
Ethernet and 16G Fibre Channel applications with substantial signal integrity margin.
In addition to SFP28/56 straight cables, we offer break out assemblies with a 100G QSFP28 or 200G QSFP56 module on one
end splitting to four SFP28/56 modules on the opposite end of the assembly. In-line signal integrity (SI) based production
testing ensures that each cable assembly meets the electrical performance requirements of the applicable industry standardspecification.
Features and Benefits• Compatible with IEEE 802.3by and Fibre Channel industry standards• Supports single lane data rate up to 56 Gbps
• Optimized construction to minimize insertion loss and cross talk• Customized cable braid termination limits EMI radiation• Backward compatible with existing SFP+ form factor connectors and cages• Pull-to-release latch design• 30AWG through 32AWG cable

SFP28/56 to SFP28/56 Straight CableAssembly• Straight and breakout cable assembly configurations available• Customizable EEPROM mapping for cable signature• RoHS compliantIndustry Standards• 25G Ethernet (IEEE 802.3by)• Fibre Channel• SFF-8402 SFP+ 1X 28Gb/s Pluggable Transceiver Solution (SFP28)• SFF-8665 QSFP+ 28G 4X Pluggable Transceiver Solution (QSFP28)

QSFP28/56 to 4x SFP28/56 Breakout
Cable Assembly

SFP28 Part Number DetailBasePart
NumberDescription

2334985

AWG

Dash to Length (meters)
0.5

1

1.5232-1-2-3-4

2.5

3

3.542821222

SFP28 to SFP2830-5-3-4-2-6-1-12821223

Straight Assembly

28-1-2-3-4-5-6-7-8-1-5-3-4-5-6-72.5

32821224

265-8SFP56 Part Number Detail
BasePart
NumberDash to Length (meters)

Description

AWG

2334985

32-41-42-432821222

SFP56 to SFP56

30-41-43-44-452821223

Straight Assembly

28-41-42-43-44-45-41-42-43-442821224

260.5

11.5

2-45

Contact your TE Representative for customized lengths and breakouts.

DATA AND DEVICES /// zSFP+ 28/56 GBPS I/O INTERCONNECT

PAGE 5

For More Information
te.com/products/zsfp+

TE Technical Support Center
USA:+1 (800) 522-6752

Canada:+1 (905) 475-6222

Mexico+52 (0) 55-1106-0800

Latin/S. America: +54 (0) 11-4733-2200
Germany:+49 (0) 6251-133-1999

UK:+44 (0) 800-267666

France:+33 (0) 1-3420-8686

Netherlands:+31 (0) 73-6246-999

China:+86 (0) 400-820-6015

Part numbers in this brochure are RoHS Compliant*, unless marked otherwise.
*as defined www.te.com/leadfreete.com© 2019 TE Connectivity Ltd. family of companies. All Rights Reserved.
1-1773707-6 DND PDF 02/19
TE Connectivity, TE and TE connectivity (logo) are trademarks of the TE Connectivity Ltd. family of companies.
zSFP+ is a part of the ZXP® family of connectors and uses the ZXP technology.
ZXP is a registered trademark of Molex LLC.
Other logos, product and company names mentioned herein may be trademarks of their respective owners.

While TE has made every reasonable effort to ensure the accuracy of the information in this brochure, TE does not guarantee that it iserror-free, nor does TE make any other representation, warranty or guarantee that the information is accurate, correct, reliable or current. TEreserves the right to make any adjustments to the information contained herein at any time without notice. TE expressly disclaims all implied
warranties regarding the information contained herein, including, but not limited to, any implied warranties of merchantability or fitness for aparticular purpose. The dimensions in this brochure are for reference purposes only and are subject to change without notice. Specifications
are subject to change without notice. Consult TE for the latest dimensions and design specifications.

DATA AND DEVICES /// zSFP+ 28/56 GBPS I/O INTERCONNECT