Datasheet

Single-Channel Ultra-Fast Gate Driver
For Automotive
BD2311NVX-C
General Description

Key Specifications

BD2311NVX-C is a single gate driver capable of driving
GaN HEMTs at Ultra-Fast with narrow pulses, which cancontribute to the long-range and high accuracy of LiDAR.
It can supply 5.4 A output current in a small 6-pin SON
package. As a protection function, the driver includes anUndervoltage Lockout (UVLO) between VCC and GND.

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Gate Driver Voltage Range:
4.5 V to 5.5 V
Output Current IOH / IOL:
5.4 A / 2.7 A (Typ)Turn-on / Turn-off Delay Time: 3.4 ns / 3.0 ns (Typ)Operating Temperature Range: -40 °C to +125 °C

Package
SSON06RX2020

Features

W (Typ) x D (Typ) x H (Max)
2.0 mm x 2.0 mm x 0.6 mm

AEC-Q100 Qualified(Note 1)
Gate Driver Voltage Range 4.5 V to 5.5 V
Minimum Input Pulse Width 1.25 ns (220 pF load)
Typical Rise Time 0.65 ns (220 pF load)
Typical Fall Time 0.70 ns (220 pF load)
Built-in Undervoltage Lockout (UVLO) between VCC
and GND◼ Inverting and Non-inverting Inputs◼ Small Package SSON06RX2020
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◼
◼
◼
◼
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(Note 1) Grade 1

Applications◼
◼
◼
◼

Automotive Equipment
Automotive LiDAR
DC / DC Converters
Augmented Reality

Typical Application Circuit

C〇Product structure : Silicon integrated circuit
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Pin Configuration(TOP VIEW)

Pin Descriptions
Pin No.

Pin Name

1IN+

Logic input pin.

Function

2

GND

Ground.

3

VCC

Power supply.

4

OUTH

Pull-up gate drive output.

5

OUTL

Pull-down gate drive output.

6

EN

-

EXP-PAD

Enable pin. (Low active)
Connect EXP-PAD to the internal PCB ground plane.
Exposed pad for thermal cooling and internal not connected to GND.

Block Diagram

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Absolute Maximum Ratings (Ta = 25 °C)
Parameter

SymbolRating

Unit

Supply Voltage

VCC-0.3 to +6.5

V

Input Voltage (IN+)

VIN+-5.0 to +7.0

V

Input Voltage (EN)VEN

-5.0 to +7.0

V

Maximum Junction Temperature

Tjmax

150

°C

Storage Temperature Range

Tstg-55 to +150

°C

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of theproperties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasingboard size and copper area so as not to exceed the maximum junction temperature rating.

Thermal Resistance (Note 1)
Parameter

SymbolThermal Resistance (Typ)1s(Note 3)

2s2p(Note 4)

Unit

SSON06RX2020
Junction to Ambient

θJA

284.5

83.2

°C/W

Junction to Top Characterization Parameter(Note 2)

ΨJT

35.0

22.0

°C/W

(Note 1) Based on JESD51-2A (Still-Air).
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surfaceof the component package.
(Note 3) Using a PCB board based on JESD51-3.
(Note 4) Using a PCB board based on JESD51-5, 7.

Layer Number ofMeasurement Board
SingleMaterial

Board Size

FR-4

114.3 mm x 76.2 mm x 1.57 mmt

TopCopper Pattern

Thickness

Footprints and Traces

70 μm

Layer Number ofMeasurement Board
4 Layers

Material

Board Size

FR-4

114.3 mm x 76.2 mm x 1.6 mmt

Thermal Via(Note 5)
Pitch
Diameter
1.20 mm
Φ0.30 mm

2 Internal Layers

BottomTop
Copper Pattern

Thickness

Copper Pattern

Thickness

Copper Pattern

Thickness

Footprints and Traces

70 μm

74.2 mm x 74.2 mm

35 μm

74.2 mm x 74.2 mm

70 μm(Note 5) This thermal via connect with the copper pattern of layers 1,2, and 4. The placement and dimensions obey a land pattern.

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Recommended Operating Conditions
Parameter

Symbol

Min

Typ

Max

Unit

Supply Voltage

VCC

4.5

5.0

5.5

V

Input Voltage (IN+)

VIN+

-0.3

-

VCC

V

Input Voltage (EN)

VEN

-0.3

-

VCC

V

Operating Temperature

Topr

-40

+25

+125

°C

Electrical Characteristics (Unless otherwise specified VCC = 5 V, Tj = -40 °C to +125 °C)
Parameter

Symbol

Min

Typ

Max

Unit

Conditions

VCC Operating Current

ICC

-

38.7

46.0

mA

VCC Shutdown Current

ICCSHD

-

0.61

1.00

mA

30 MHz (50 % duty),
2 Ω as ROUTH and ROUTL,
100 pF load
VIN+ = VEN = 0 V

UVLO Detect Threshold Voltage

VUVDOWN

2.9

3.6

4.3

V

VCC falling

UVLO Reset Threshold Voltage

VUVUP

3.1

3.9

4.5

V

VCC rising

UVLO Hysteresis Voltage

VUV_HYS

-

0.3

-

V

VIH

1.7

2.1

-

V

IN+, EN Pin Low Threshold Voltage

VIL

-

1.3

1.8

V

Hysteresis Voltage

VHYS

-

0.8

1.0

V

Peak Source Current(Note 1)

IOH

-

5.4

-

A

Peak Sink Current(Note 1)

IOL

-

2.7

-

A

Turn-on Propagation Delay Time

tON

-

3.4

5.0

ns

100 pF load

Turn-off Propagation Delay Time

tOFF

-

3.0

4.6

ns

100 pF load

Output Rise Time

tR

-

0.65

-

ns

0 Ω series 220 pF load

Output Fall Time

tF

-

0.70

-

ns

0 Ω series 220 pF loadtINMIN

-

1.25

-

ns

0 Ω series 220 pF load

Circuit Current

Undervoltage Lockout (UVLO)

Input
IN+, EN Pin High Threshold Voltage

OutputMinimum Input Pulse Width(Note 1) Not Tested

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Typical Performance Curves

VUVUP

VUVDOWN

Figure 1. VCC Undervoltage Lockout vs Ambient
Temperature(VCC = 5 V, 2 Ω as ROUTH and ROUTL, 100 pF load)

Figure 2. VCC Operating Current vs Frequency(VCC = 5 V, 2 Ω as ROUTH and ROUTL, 100 pF load)

Figure 3. VCC Operating Current vs Ambient
Temperature(VCC = 5 V, 2 Ω as ROUTH and ROUTL, 100 pF load)

Figure 4. VCC Shutdown Current vs Ambient
Temperature(VCC = 5 V, VIN+ = VEN = 0 V)

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Typical Performance Curves – continued

VIH

tF
tR

VIL

Figure 5. Input Pin Threshold Voltage vs Ambient
Temperature

Figure 6. Output Rise/Fall Time vs Ambient
Temperature(VCC = 5 V, 0 Ω as ROUTH and ROUTL, 220 pF load)

tON

tOFF

μs

μs

μs

μs

μs

Figure 8. Startup Time(0 Ω as ROUTH and ROUTL, 220 pF load)

Figure 7. Turn-on/off Propagation Delay Time vsAmbient Temperature(VCC = 5 V, 0 Ω as ROUTH and ROUTL, 100 pF load)www.rohm.com© 2022 ROHM Co., Ltd. All rights reserved.
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μs

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Typical Performance Curves – continued

μs

μs

μs

μs

μs

μs

Figure 9. Shutdown Time(0 Ω as ROUTH and ROUTL, 220 pF load)

Figure 10. Minimum Input Pulse Width(VCC = 5 V, 0 Ω as ROUTH and ROUTL, GNE1040TB(Note 1))(Note 1) Caution, GNE1040TB can’t be applied for Automotive

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Timing Chart

Figure 11. Timing Chart

Figure 12. UVLO Timing Chart

Function Table
Table 1. The device will operate in following mode when in UVLO state.
IN+
EN
OUTH
OUTL
X(Note 6)
X(Note 6)
OPEN
L(Note 6) X is not dependent on the value.

Table 2. The device will operate in following mode when not in UVLO state.
IN+
EN
OUTH
OUTL
L
L
OPEN
L
H
L
H
OPEN
L
H
OPEN
L
H
H
OPEN
L

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Application Components Selection Method(1) Gate Resistor
The gate resistor RG(ON/OFF) is selected to the switching
speed of the power device. The switching time (tSW) is
defined as the time spent to reach the end of the plateau
voltage, so the turn-on gate resistor RG(ON) can becalculated using the following formulas.

𝐼𝐺 =𝑄𝑔𝑠 +𝑄𝑔𝑑[1]𝑡𝑆𝑊

𝑅𝑇𝑂𝑇𝐴𝐿(𝑂𝑁) = 𝑅𝑃𝑂𝑁 + 𝑅𝐺(𝑂𝑁) =𝑡𝑆𝑊 =𝑄𝑔𝑠 +𝑄𝑔𝑑
𝐼𝐺=

𝑉𝐶𝐶−𝑉𝐺𝑆(𝑇𝐻)𝐼𝐺(𝑄𝑔𝑠 +𝑄𝑔𝑑 )(𝑅𝑃𝑂𝑁 +𝑅𝐺(𝑂𝑁) )

[2]

[3]

(𝑉𝐶𝐶−𝑉𝐺𝑆(𝑇𝐻) )-C

Where:
𝐼𝐺 is the gate current of the power device.

Figure 13. Gate Driver Equivalent Circuit

𝑄𝑔𝑠 is the charge between gate and source of the power device.
𝑄𝑔𝑑 is the charge between gate and drain of the power device.
𝑉𝐺𝑆(𝑇𝐻) is the threshold voltage of the power device.
The turn-on gate resistance can be changed to control
output slew rate (dVD/dt). The slew rate of the power device
is determined by the following equation.
𝑑𝑉𝐷
𝑑𝑡

𝐼

= 𝐶𝐺

Qgs

Qgd

VDS

[4]

dVD/dt𝑟𝑠𝑠

where:
𝐶𝑟𝑠𝑠 is the feedback capacitance.

ID

VGS

The gate resistance is determined as follows by
substituting equation [4] into equation [2].

𝑅𝑇𝑂𝑇𝐴𝐿(𝑂𝑁) = 𝑅𝑃𝑂𝑁 + 𝑅𝐺(𝑂𝑁) =𝑅𝐺(𝑂𝑁) =𝑉𝐶𝐶−𝑉𝐺𝑆(𝑇𝐻)𝐶𝑟𝑠𝑠 ×𝑑𝑉𝐷
𝑑𝑡− 𝑅𝑃𝑂𝑁

𝑉𝐶𝐶−𝑉𝐺𝑆(𝑇𝐻)𝐶𝑟𝑠𝑠 ×

𝑑𝑉𝐷
𝑑𝑡

[5]

tSW
[6]

Figure 14. Gate Charge Transfer Characteristics

When other power devices are turned on, current flows in the power device which is off through Cgd. At this point, thegate resistance (RG(OFF)) should be set so that the gate voltage does not exceed the threshold of the power device andturn on the power device itself.
𝑑𝑉

𝑉𝐺𝑆(𝑇𝐻) ≥ (𝑅𝑁𝑂𝐹𝐹 + 𝑅𝐺(𝑂𝐹𝐹) ) × 𝐼𝐺 = (𝑅𝑁𝑂𝐹𝐹 + 𝑅𝐺(𝑂𝐹𝐹) ) × 𝐶𝑔𝑑 × 𝑑𝑡𝐷
𝑅𝐺(𝑂𝐹𝐹) ≤𝑉𝐺𝑆(𝑇𝐻)
𝐶𝑔𝑑 ×

𝑑𝑉𝐷
𝑑𝑡

− 𝑅𝑁𝑂𝐹𝐹

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Application Components Selection Method – continued(2) Input Capacitor
A low-ESR ceramic capacitor should be used near the VCC pin to reduce input ripple voltage. In considering of the DC
bias characteristic, it is recommended 0.5 µF or more between VCC and GND.

PCB Layout
The voltage of VCC pin may be risen by the parasitic inductance of the PCB and the bonding wire in the IC.
The mechanism by which VCC voltage rises is Figure 15.
(1) When the signal with short pulse width is input as an input signal, it is turned off in the state that Pch-FET of the final
stage is turned on and flows current.
(2) When Pch-FET is turned off while current is flowing, VCC voltage is risen by the parasitic inductance.
When VCC voltage is risen and over absolute maximum ratings, it can damage the IC.
To reduce the rising of VCC voltage, please locate a ceramic capacitor which is low-ESR near the VCC pin and the GND pin,and connect it so that parasitic inductance L VCC and LGND in the PCB becomes small. It is recommended 1 nH or less each
LVCC and LGND.

(1)

(2)
Parasitic inductance of the bonding
wire in the IC and the PCB
VCC

The voltage of VCC pin is roseby parasitic inductance

LVCC

VCC

ON

LVCC

OFF
OUT

OFF

OUT

GND

ON

LGND

GND

LGND

Input capacitor

Figure 15. Mechanism of Overshootwww.rohm.com© 2022 ROHM Co., Ltd. All rights reserved.
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I/O Equivalence Circuits

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VCC

IN+ / EN

OUTH

OUTL

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BD2311NVX-C
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity whenconnecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electricalcharacteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routingof connections.
7. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport andstorage.

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Operational Notes – continued
8. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result indamaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) andunintentional solder bridge deposited in between pins during assembly to name a few.
9. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance andextremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
10. Regarding the Input Pin of the ICThis monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep themisolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating aparasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutualinterference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes tooperate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor

Transistor (NPN)

Pin A

Pin B

C

E

Pin A
N

P+

P
N

N

P+

N

Pin B

B

Parasitic
Elements

N

P+

N P

N

P+

B
N

C
E
Parasitic
Elements

P Substrate

P Substrate

GND

GND
Parasitic
Elements

GND

Parasitic
Elements

GND
N Regionclose-byFigure 16. Example of Monolithic IC Structure

11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance withtemperature and the decrease in nominal capacitance due to DC bias and others.

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BD2311NVX-C
Ordering Information

B

D

2

3

1

1

N

V

X

-

Package
NVX: SSON06RX2020

C E2
Product Class
C: for Automotive
Packaging and Forming Specification
E2: Embossed Tape and Reel

Marking Diagram
SSON06RX2020 (TOP VIEW)

Part Number Marking

D23

LOT Number

11 C

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Physical Dimension and Packing Information

Package Namewww.rohm.com© 2022 ROHM Co., Ltd. All rights reserved.
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Revision History
Date

Revision

12.Mar.2024

001

Changes
New Releasewww.rohm.com© 2022 ROHM Co., Ltd. All rights reserved.
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Notice
Precaution on using ROHM Products
1.

If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ

2.

ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, whicha failure or malfunction of our Products may cause. The following are examples of safety measures:[a] Installation of protection circuits or other protective devices to improve system safety[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3.

Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from theuse of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items[f] Sealing or coating our Products with resin or other coating materials[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering[h] Use of the Products in places subject to dew condensation

4.

The Products are not subject to radiation-proof design.

5.

Please verify and confirm characteristics of the final or mounted products in using the Products.

6.

In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affectproduct performance and reliability.

7.

De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.

8.

Confirm that operation temperature is within the specified range described in the product specification.

9.

ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined inthis document.

Precaution for Mounting / Circuit board design
1.

When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect productperformance and reliability.

2.

In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PAA-E© 2015 ROHM Co., Ltd. All rights reserved.

Rev.004

Precautions Regarding Application Examples and External Circuits
1.

If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of thecharacteristics of the Products and external components, including transient characteristics, as well as static
characteristics.

2.

You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not beapplied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation
1.

Product performance and soldered connections may deteriorate if the Products are stored in the places where:[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation[d] the Products are exposed to high Electrostatic

2.

Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time isexceeding the recommended storage time period.

3.

Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.

4.

Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products ofwhich storage time is exceeding the recommended storage time period.

Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights
1.

All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.

2.

ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).

3.

No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution
1.

This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2.

The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior writtenconsent of ROHM.

3.

In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.

4.

The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.

Notice-PAA-E© 2015 ROHM Co., Ltd. All rights reserved.

Rev.004

Datasheet
General Precaution

1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any priornotice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.

3.

The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of orconcerning such information.

Notice – WE

© 2015 ROHM Co., Ltd. All rights reserved.

Rev.001