Chair: Bernard COURTOIS, CMP, Grenoble, France

Co-Chair: Jean-Michel KARAM, MEMSCAP, Bernin, France
C O N F E R E N C E S

CAD, Design and Test Conference
Chair: Bernard COURTOIS, CMP, Grenoble, France
Co-Chair: Arturo AYON, Univ. of Texas at San Antonio, USA

Microfabrication, Integration and Packaging Conference
Chair: Toshihiro ITOH, AIST, Tsukuba, Japan
Co-Chair: Benoit CHARLOT, IES, Montpellier, FranceREGISINVITATRA

TION TOPARTI T

TION
Circuits Multi-Projets
46 Avenue Félix Viallet
38031 Grenoble Cedex France
Tel. : +33 4 76 57 46 22
Fax : +33 4 76 47 38 14

DTIP 2013 registration fee covers admission to all sessions, luncheons, coffee breaks,
the social event and the Symposium proceedings (copy paper and CDRom).

his Symposium will be a follow-up to the very successful issues held in 1999 and 2000 in Paris and in 2001, 2002
and 2003 in Mandelieu-La Napoule, in 2004 and 2005 in
Montreux, Switzerland in 2006 and 2007 in Stresa, Italy, in 2008
in Nice, France, in 2009 in Rome, Italy in 2010 in Seville, Spain, in2011 in Aix-en-Provence, France and in 2012 in Cannes, France.
This serie of Symposia is a unique single-meeting event expressly planned to bring together
participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures.

CIPATE					

Bernard COURTOIS & Jean-Michel KARAM

VEN T

HOTEL

he Symposium is hosted at the Novotel Barcelona City. The
Hotel is located right in the heart of the city on Avenida Diagonal(one of the city’s main streets), next to Plaza Glòries and 55 yards(50 m) from the Jean Nouvel Tower.
Barcelona is the cultural, administrative, economic and historic capitalof Catalonia province of Spain. Due to its huge importance in finance,
publication, arts, entertainment and Medias, Barcelona is considered as a world culture town.
The city is served by air, train, bus or boat and it flavours, sounds and smells, emphasized by
awesome landscapes, will make your DTIP attendance unforgettable.

PLEASE ARRANGE ACCOMMODATION TIMELY

HOTEL
INFOR

Registrations should be done online at:
 http://cmp.imag.fr/Conferences/dtip/dtip2013

ACCOMMODATION
Novotel Barcelona City
(http://www.accorhotels.com/gb/hotel-5560-novotel-barcelona-city)
Address:
Avinguda Diagonal 201, (entrada por ciutat de Granada)
08018 Barcelona – Spain
Phone: +34 93 326 24 99
Fax: +93 320 87 79
Informations and reservations:
Call Center: 902 15 15 16
Att: Marta MIMOSO // H5560-na@accor.com
Fax Number: + 93 320 87 79
Hotel reservation form available on the web site of DTIP’13

 http://cmp.imag.fr/Conferences/dtip/dtip2013

UE

MATION
Novotel Barcelona City
Avda Diagonal 201,
(entrada por ciutat
de Granada)
08018 Barcelona
Spain

#

PLEASE ARRANGE ACCOMMODATION TIMELY(http://cmp.imag.fr/Conferences/dtip/dtip2013)

AC

PRO
CEE

CES

DINGS

By airInternational Airport
El Prat to 22 Km.
There are two terminals T1 and T2. T1 is the main one, corresponding to most of themain companies and T2 for low cost.
Aerobus: Connections between Barcelona and the airport and back: Aerobús (A1and A2, respectively for T1 and T2). Daily service between Plaça de Catalunya andBarcelona Airport. Frequency: every 10 minutes. Approximate journey time:
35 minutes. They Link the terminals with downtown, this means Placa España andPlaza Catalunya. They Link the terminals with down-town, this means Placa España
and Plaza Catalunya.
By train - Cercanías (Rodalies in Catalan)
Between the commuter train to destinations and metro stops for its central (Plaça
de Catalunya, Passeig de Gràcia, Sants Estacio, Arc de Triomf, Estacio de França, etc.),
The Cercanías is somewhat equivalent to the RER Paris.
Managed by RENFE lines are named C1, C2, etc. (attention, in some ways, their
number is preceded by an R and not a C). All pass through Sants Estacio, and theneither serve Passeig de Gràcia is Plaça de Catalunya.
• The R2 line serves the airport (the safest solution to peak): Departures from
Passeig de Gràcia. Take care the train goes only to T2. From T2 to T1 there is a freehigh frequency shuttle.
• FGC (Ferrocarrils de la Generalitat de Catalunya). The FGC is between thecommuter and regional services, numbered L6 to L8, or R + S + number or number.
Two terminals in the city: Plaça d’Espanya and Plaça Catalunya.
By bus Barcelona North Bus Station to 1 Km.
By car The city has excellent road links and you can get to the Barcelona
Sants Station conveniently using the motorway and road network. Underground(Line 1), TRAMbesòs (Glòries) and urban buses (line 7, 56, 92). All of them stopped
next to the hotel.

INSU
RANCE

While the Symposium organisation
makes every effort in order toensure the safety and well being of
all the Symposium participants andassociates, the Symposium cannot
take responsibility for any accident
or damage that may occur during
the Symposium.

Proceedings of thisSymposium will
be available at themeeting as part of
the registration fee.
If you cannot attend,
you may still order
Proceedings at theprice of 35€ (orderform available on theconference web site,
the sending of theProceedings package
will be done after
the Symposium, andif the payment isreceived).
DTIP is happy toacknowledge theservices of
MOLESYSTEMS(http://www.
molesystems.com/)
for the technicalmanagement of the
Symposium.

SPECIFICEVENTSPONSORING

If you wish to sponsor an event
like a reception, a lunch, or
any specific event during the
Symposium, please contact the
Symposium Chair.

Adinner will be served for amemorable evening, in the
Restaurant El Tuneldel Port in beautiful surroundings andin a unique atmosphere with views of thebeaches and Olympic Port. The Olympic
harbor is one of the areas that attracts most
tourists the night. So participants may staythere after dinner to enjoy the atmosphereof Barcelona.
Restaurant El Tunel del Port is on the beach,at 20’ walking distance from the Novotel
Barcelona City.

CONT

ACTS

DTIP
Chair:
Bernard COURTOIS
CMP, Grenoble - France
Tel.: +33 4 76 57 46 15(22 secr.)
Fax: +33 4 76 47 38 14
Email: DTIP@imag.fr

CAD, Design
and Test
Conference
Chair:
Bernard COURTOIS
CMP, Grenoble - France
Email:DTIP@imag.fr

Symposium Co-Chair:Jean-Michel KARAMMEMSCAP, Bernin France
Tel.: +33 4 76 92 85 00
Fax: +33 4 76 92 85 10
Email: Jean-Michel.
Karam@memscap.com

Co-Chair:
Arturo AYON
Univ. of Texas at San
Antonio - USA
Email:
Arturo.Ayon@utsa.edu

Microfabrication,
Integration andPackaging
Conference
Chair:
Toshihiro ITOH
AIST, Tsukuba - Japan
Email:
toshihiro-itoh@aist.go.jp
Co-Chair:
Benoit CHARLOT
IES, Montpellier - France
Email:
benoit.charlot@
ies.univ-montp2.fr

CAD
DESIGN& test

CONFE
RENCE
The topics for this Conference
include: Technology CAD in general Modeling and simulation of


















fabrication processes
Devices and components (sensors,
actuators, …)
MEMS/MOEMS libraries and IP
Signal processing
Integrated CAD tools
Numerical simulation
Yield estimation
Failure mechanisms
Fault modeling
Fault simulation and test pattern 		
generation
Mechanical simulation
Thermal evaluation
Interoperability of CAD/CAE tools
Multiphysics simulation
Structured design methodologies
Languages for designs and tool
Model order reduction
3D Integration of MEMS

Chair:
Bernard COURTOIS, CMP, Grenoble - France
Co-Chair:
Arturo AYON, Univ. of Texas at San Antonio - USA
The CAD, Design and Test Conference willbring together researchers, engineers andpractitioners involved in the development of
CAD tools and design methodologies for MEMS
and MOEMS.
The participants will also have the opportunity tointeract with the other Conference by the meansof plenary talks.

Programme Committee:
Pascal NOUET, LIRMM, Montpellier, France
Anis Nurashikin NORDIN, Int’ Islamic Univ, Kuala Lumpur, Malaysia
Francis PRESSECQ, CNES, Toulouse, France
Gerold SCHROEPFER, Coventor, France
Libor RUFER, TIMA Lab., Grenoble, France
Mahnaz SHAMSHIRSAZ, Amirkabir Univ. of Tech., Tehran, IranMarta RENCZ, BUTE, Budapest, Hungary
Rainer LAUR, Univ. of Bremen, Germany
Robert RUDD, Lawrence Livermore National Lab. Livermore, USA
Souhil MEGHERBI, Univ. Paris Sud, France
Thomas ZAHNER, OSRAM Opto Semiconductors, Germany
Aurelio SOMA, Politecnico di Torino, Italy
Romolo MARCELLI, CNR-IMM Roma, Italy
Gerhard WACHUTKA, Munich Univ. of Technology, Germany
Bart ROMANOWICZ, Nano Science & Technology Institute, Cambridge, USA
Gaelle LISSORGUES, ESIEE, Noisy-le-Grand, France
Franck CHOLLET, Femto-ST, France
Ai Qun LIU, Nanyang Techn. U., Singapore
Andrew RICHARDSON, Lancaster University, UK
Igor BALK, TDC LLC, USA
Jian ZHU, Nanjing Electronic Devices Institute, China
Yung C. LIANG, National Univ. of Singapore
Shawn BLANTON, Carnegie Mellon Univ., Pittsburgh, USA
Narayan R. ALURU, Univ. of Illinois Champaign, Urbana, USA
Ash PARAMESWARAN, SFU, Canada
Ray ROOP, Freescale Semiconductor, Inc., USA
Kazuhiro HANE, Sendai University, Japan
Hisham HADDARA, Si-Ware Systems, Cairo, Egypt
Vladimir SOBOLEV, South Dakota School of Mines and Technology(SDSMT) USA
Tamal MUKHERJEE, Carnegie Mellon Univ., Pittsburgh, USA
Jan MEHNER, TU Chemnitz, GermanyPeter SCHNEIDER, Fraunhofer IIS/EAS, Dresden, Germany

MICRO
FABRICATIONINTEGRATION& PACK

AGING
CONFERENCE
The topics for this Conference
include: Integrated processes(micromachining, micromolding, …)
 Process integration between MEMS

and electronics
 Microlithography issues unique

to MEMS/MOEMS Manufacturing
 Materials
 Assembly technologies
 Packaging for harsh environments
 MOEMS packaging
 RF and microwave packaging
 Test structures
 Devices and components (sensors,








actuators, …)
Dimensional measurements
Physical measurements
Failure analysis
Reliability
Characterization
Process monitoring
Non destructive evaluation

Chair:
Toshihiro ITOH, AIST, Tsukuba - Japan
Co-Chair:
Benoit CHARLOT, IES, Montpellier - France
The Microfabrication, Integration andPackaging Conference will bring together
researchers, engineers and practitioners involvedin the development of integration technologies
and packaging for MEMS and MOEMS.
The participants will also have the opportunity tointeract with the other Conference by the meansof plenary talks.

Programme Committee:
Adrian IONESCU, EPFL, Lausanne, Switzerland
Alain BOSSEBOEUF, IEF, Paris-Orsay, France
Andrew TAY, National Univ. of Singapore
Christian A. ZORMAN, Case Western Reserve Univ., Cleveland, USA
Erik JUNG, Fraunhofer IZM, Germany
Giancarlo BARTOLUCCI, Roma «Tor Vergata» University, Italy
Gou-Jen WANG, National ChungHsing Univ., Taiwan
Henri CAMON, LAAS, Toulouse, France
Hsiharng YANG, National Chung Hsing Univ., Taiwan
Juerg DUAL, ETH Zentrum, Zürich, Switzerland
Masayoshi ESASHI, Tohoku Univ., Japan
Philippe RENAUD, EPFL, Lausanne, Switzerland
Susumu KAMINAGA, Sumitomo Precision Products Co., Japan
Xuechuan SHAN, SIMTech, Singapore
Yuelin WANG, SIMIT, Shanghai, China
Yves-Alain PETER, EPM, Montréal, Canada
Zhenfeng WANG, SIMTech, Singapore
Dong F. WANG, Ibaraki Univ., Japan
Alexandra GARRAUD, Univ. Florida, USA
Emanuela PROIETTI, IMM Roma, Italy
Victor M. BRIGHT, Univ. of Colorado at Boulder, USA
Eng Hock (Francis) TAY, National Univ. of Singapore
Geok Ing NG, Nanyang Technological Univ., Singapore
Jyh-Cheng (Jason) YU, Nat’l Kaohsiung 1st U. of Sc.& Tech., Taiwan
Xuming[AP] ZHANG, The Hong Kong Polytechnic Univ., China
Philippe BASSET, ESIEE, Noisy-le-Grand, France
Matthias WORGULL, KIT, Karlsruhe, Germany
Virginia CHU, INESC MN, Portugal
Robert PUERS, KU Leuven, Belgium

PLENARY

INVITEDSPEAKERSELECTROMAGNETIC
PHENOMENA: CONTROL OFMAGNETIC PROPERTIES VIA
ELECTRICAL INPUT Melanie W. COLE from US Army ResearchLaboratory
Voltage control of magnetism (converse
magnetoelectric effect) through spinpolarized charge screening (charge
mediated voltage induced magnetism)holds much promise to enable a new classof voltage tunable RF/microwave magnetic
devices for RF/microwave communication
and radar systems. The device structures(FM/FE-dielectric heterostructures),performance metrics, approaches for
performance optimization, and thefabrication strategies to enable the controlof magnetic properties of materials/devices
via electrical input will be discussed in thispresentation.
MEMS TACTILE SENSORS FORROBOTS Isao SHIMOYAMA from the University ofTokyo
Micro-cantilevers and double-supported
micro-beams with piezo-resistors provide
sensitive force measurement. The
cantilevers/beams embedded in organic
material like epoxy become tiny tactile
sensors which measure not only normal
force but also shear force. The fabrication
process and the performance of the sensors
are shown in this report. Finally, the sensor
is applied to a robotic hand.

SPE

CIAL
SESSIONS
Special Session on Reliability
Criteria in MEMS/NEMS
Design, Manufacturing and
Test
MEMS/NEMS production needsinterdisciplinary skills, especially concerning
the integration of micro- and nanotechnologies. For this reason, novel
reliability criteria have to be defined for
obtaining aging and failure ofmanufactured devices, and new protocols
are needed with respect to well establishedprocedures known in microelectronics.
This special session is organized by Romolo
MARCELLI from CNR-IMM Roma, Italy.
Special Session on In-Vitro
Diagnostic Devices
In-Vitro Diagnostics (IVD) plays an essential
and valuable role in the global healthcare
industry. Recent advancements in micro/
nano technologies have benefited thedevelopment of IVD devices that are low
cost, sensitive, specific, easy to use, rapid androbust, and disposable, as well as consuming
only a small sample. This special session
focuses on the implementation of micro/
nano technologies in the conception, design,
fabrication and analysis of IVD devices.
This special session is co-organized by
Erik JUNG, FhG IZM, Berlin, Germany and by
Gou-Jen WANG, National ChungHsing Univ.,
Taiwan.
FOR MORE INFORMATION:

http://cmp.imag.fr/Conferences/dtip/dtip2013

TUES

Ap TECHNICAL

DAY 16 ril PROGRAMME

08:00-08:50		
08:50-09:00		

Registration – Welcome coffee
Opening session

		Bernard COURTOIS, CMP, Grenoble - France

09:00-09:40		
Invited talk 1
Electromagnetic phenomena: control of magnetic
properties via electrical input

		Melanie W. COLE, US Army Research Lab - USA  Chair: Arturo AYON, U. of Texas at San Antonio - USA

09:40-10:00
Coffee break
10:00-11:40			 10:00-12:00
Session C1: MEMS devices andSession T1: Sensors
Components
 Chair: Benoit CHARLOT, IES, Montpellier - France Chair: Jean-Michel KARAM, MEMSCAP, Bernin - France
10:00 Multiparametric mems biosensor forcell culture monitoring
10:00 Influence of excitation waveform andoscillator geometry on the resonant pull-in of
Fei LIU, Ioana VOICULESCU (City College of New York - USA),capacitive MEMS oscillators
Anis Nurashikin NORDIN (International Islamic U. - Malaysia)
Jerome JUILLARD (SUPELEC - France), Gregory ARNDT (TI - Norway),
10:20 Ionic gel based carbon dioxide gas sensor
Julien ARCAMONE (CEA-LETI - France), Eric COLINET (APIX
Technologies - France)

10:20 Electrostatic actuation Gap reduction
method and analysis for square plate resonator on
SOI substrates
Srinivasa KUPPI REDDI, Oddvar SOERAASEN (U. of Oslo - Norway)

10:40 Comparative analysis of zinc oxide andaluminium doped ZnO for GHz CMOS MEMS surface
acoustic wave resonator
Aliza MD RALIB, Anis NORDIN (International Islamic U. Malaysia Malaysia)

11:00 Reversible acoustical transducers in MEMS
technology
Christoph GLACER, Rainer LAUR (U. of Bremen - Germany),
Alfons DEH, Mohsin NAWAZ (Infineon Technologies AG, Munich Germany)

11:20 From MEMS to NEMS: smart chips withsenses and muscles

Ali JAZAIRY (World Intellectual Property Organization - Switzerland)

Yusuke TAKEI, Kotaro ISHIZU, Kentaro NODA, Akira INABAV, Kiyoshi
MATSUMOTO, Isao SHIMOYAMA (The U. of Tokyo - Japan), Masahito
HONDA, (NMEMS Technology Research Organization, Ibaraki-ken Japan/ OMRON Yasu, Shiga - Japan), Toshihiro ITOH, Ryutaro MAEDA,(NMEMS Technology Research Organization, Ibaraki-ken - Japan/AIST,
Tsukuba - Japan)

10:40 AlGaAs/InGaAs thermopiles for infrared
imaging using surface bulk micromachining technology
Kian Siong ANG, Louis Nicholas RETNAM (TL@NTU/Nanyang
Technological U. - Singapore), Rene HOFSTETTER, Hong WANG, Geok I.
NG (NOVITAS/Nanyang Technological U. - Singapore), Masayuki ABE(3D-bio - Singapore)

11:00 Developing MEMS DC electric current sensor
for end-use monitoring of DC power supply: part III integration with actuating and sensing elements

Yasuhiro SUZUKI, Dong F. WANG, Yosuke SUWA, (Micro Engineering &Micro Systems Lab/Ibaraki U., Hitachi - Japan), Dong F. WANG, Takeshi
KOBAYASHI, Toshihiro ITOH, Ryutaro MAEDA (UMEMSME/AIST, Tsukuba Japan)

11:20 Measurement of an airflow velocity changeusing a cantilever with Pb(Zr, Ti)O3

Yutaka TOMIMATSU (NMEMS Technology Research Organization,
Tsukuba - Japan), Kenta KUWANA (Tokyo Denki U. - Japan), Toshihiro
ITOH, Takeshi KOBAYASHI (AIST, Tsukuba- Singapore), Hidetoshi
TAKAHASHI, Kiyoshi MATSUMOTO, Isao SHIMOYAMA (The U. of Tokyo- Japan), Ryutaro MAEDA (UMEMSME/AIST Tsukuba - Japan)

11:40 Pyroelectric PZT sensors screen printed on
glass

Benoit CHARLOT, Denis COUDOUEL, Philippe COMBETTE, Alain GIANI(IES, Montpellier - France)

TUES

Ap

DAY 16 ril
12:00-13:30		
13:30-15:30		

Special Session on in-Vitro Diagnostic Device

16:00-18:20			 16:00-18:20
Session C2: Modeling and
Session T2: Materials andManufacturing
characterization

		 Chairs: Erik JUNG, FhG IZM, Berlin - Germany and Gou-Jen WANG National ChungHsing U. - Taiwan

 Chair: Souhil MEGHERBI, Univ. Paris Sud - France

13:30		

13:50				14:10				

Lunch

Finite element analysis of piezoelectric millimeter-sized mass sensors

Amir Abbas KASHI, Mahdi ZAMANI, Mahnaz SHAMSHIRSAZ, Mostafa KHELGHATDOOST (Amirkabir U. of Technology Tehran - Iran)A highly sensitivity biosensor based on a 3D gold nanostructure modified screen-printed
electrode for glucose detection

His-Chien LIU, Chung-Che TSAI, Gou-Jen WANG (National Chung-Hsing U., Taichung - Taiwan), Kang J. CHANG (California State U.,
Northridge - USA)

Protein preconcentration using nanofissures generated by nanoparticle-facilitaed electric
breakdown at the junction gaps

Chun-Ping JEN, Chen-Chi KUO, Pei-Ju CHIANG (National Chung Cheng U. - Taiwan)

14:30		Detection of base pairs in single-nucleotide polymorphisms (SNP) using a nanostructured
		biosensor
14:50		

Yu-Ting CHIN, Gou-Jen WANG (National Chung-Hsing U. - Taiwan)

Diamond micro-electrode arrays (MEAs): a new route for in-vitro applications

Myline COTTANCE, Sébastien NAZEER, Lionel ROUSSEAU, Gaëlle LISSORGUES (ESIEE, Noisy-le-Grand - France),
		Alexandre BONGRAIN, Raphaël KIRAN, Emmanuel SCORSONE, Philippe BERGONZO (CEA LIST, Gif-sur-Yvette - France),
Amel BENDALI, Serge PICAUD (Inserm/UPMC, Paris - France), Sébastien JOUCLA, Blaise YVERT (U. de Bordeaux/INCIA, Talence France)

15:10				Protein preconcentration using nanofissures generated by nanoparticle-facilitaed electric
breakdown at the junction gaps

Chun-Ping JEN, Chen-Chi KUO, Pei-Ju CHIANG (National Chung Cheng U. - Taiwan)

15:30-16:00		

NO
TES

Break

16:00 Characterization of temperature effects on
single-photon avalanche diodes fabricated in a HVCMOS conventional technology
Eva VILELLA-FIGUERAS, Oscar ALONSO, Andreu MONTIEL, AngelDIEGUEZ (U. of Barcelona - Spain)

16:20 DRIE process modelling – a mems casestudy on a real design

Julien PAGAZANI, Frédéric MARTY, Gaelle LISSORGUES, (ESIEE, Noisyle-Grand - France), Artem BABAYAN, Andreas HOESSINGER, Ahmed
NEJIM (Silvaco Europe Cambridgeshire - UK)

16:40 Energy harvesting from human motion with
piezo fibers for the body monitoring by MEMS
sensors
Giorgio De PASQUALE, A. SOMA (Politecnico di Torino - Italy)

17:00 Active control of effective mass, damping,and stiffness of MEMS
Jason CLARK, Shehrin SAYED (Purdue U., West Lafayette - USA)

17:20 Minimizing the variation in
performance by optimizing the design parameters
Xing JIN, Jason CLARK (Purdue U., West Lafayette - USA)17:40 Modeling of chemical mechanical polishingprocesses by cellular automata and finite element/matlab integration methods
Kuo-Shen Chen, Shang-Lun WU (National Cheng-Kung U, - Taiwan)

18:00 High performance nanopillars array siliconsolar cells
Pushpa Raj PUDASAINI, Arturo AYON (U. of Texas at San Antonio USA)

 Chair: Henri CAMON, LAAS, Toulouse - France

16:00 Suspended integration of pyrolytic carbon
membrane on C-MEMS
Shuang XI, Tielin SHI, Hu LONG, Liangliang XU, Zirong TANG
(Huazhong U. of Science and Technology - China)

16:20 Mems 3-axis inertial sensor process

Sophia DEMPWOLF, Roy KNECHTEL (X-FAB Semiconductor Foundries,
Erfurt - Germany)

16:40 A novel fabrication method of tapered-cone
microneedle for drug delivery by using the microlens
mask and UV contact printing
Tsung Hung LIN, Ching-Kong CHAO (National Taiwan U. of Scienceand Technology - Taiwan)

17:00 Synthesis of Sn nanoparticles and its size
effect on melting point

Yang JU, Takafumi TASAKA, Hayato YAMAUCHI, Tomoki NAKAGAWA(Nagoya U. - Japan)

17:20 Fabrication of AFM probe with CuO
nanowire formed by stress-induced method

Atsushi HOSOI, Hisataka KOTO, Yang JU (Nagoya U. - Japan)

17:40 Development of TSV interposer with 300mm
wafer for 3D packaging
Seiichi YOSHIMI (NMEMS Technology Research Organization,
Ibaraki-ken - Japan), Koji FUJIMOTO, Miyuki AKAZAWA, Hidenobu
MATSUMOTO, Hiroshi MAWATARI, Kousuke SUZUKI (Dai Nippon
Printing, Chiba-ken - Japan), Toshihiro ITOH (AIST, Tsukuba - Japan),
Ryutaro MAEDA (UMEMSME/AIST Tsukuba - Japan)

18:00 Preparation and characterization of theferroelectric thin films based on the statistical analysis
in the justification of the experimental parameters

Kazutaka SUESHIGE, Tadatomo SUGA (the U. of Tokyo - Japan),
Masaaki ICHIKI, Toshihiro ITOH (AIST, Tsukuba - Japan)

WEDNES Ap

DAY 17 ril
09:00-10:00			 09:00-10:00
Session C3: Microfluidics
Session T3: Test and Reliability
 Chair: Andrew RICHARDSON, Lancaster U. - UK

12:30-14:00
14:00-16:00		

 Chair: Marta RENCZ, BUTE, Budapest - Hungary

LunchSpecial session on reliability criteria in MEMS/NEMS design,
manufacturing and test

09:00 Operation placement for application-specificdigital microfluidic biochips

09:00 Reliability of a typical TSV structure withthermal bias

Mirela ALISTAR, Paul POP, Jan MADSEN (Denmark Technical U.,
Lyngby - Denmark)Ben-Je LWO, Kuo-Hao TSENG (National Defense U. - Taiwan),
Kun-Fu TSENG (Asia-Pacific Institute of Creativity - Taiwan)

09:20 A robust repair-aware test method for
multi-memory

14:20		Fabrication of large area sub-wavelength structure for anti-reflection and self-cleaning optical		plateMorten FOGED SCHMIDT, Wajid HASSAN MINHASS, Paul POP, Jan
MADSEN (Denmark Technical U., Lyngby - Denmark)Gang WANG (Institute of Computing Technology, Chinese Academy of
Sciences - China)

14:40		

09:20 Modeling and simulation framework forflow-based microfluidic biochips
09:40 Performance evaluation of PEMC liquid
level detection sensors subjected to temperature
variation
Amir Abbas KASHI, Mahdi ZAMANI, Mahnaz SHAMSHIRSAZ(Amirkabir U. of Technology Tehran - Iran)

10:00-10:40		

09:40 A novel robust repair-aware test flow andmethods for multi-memory

Gang WANG, Yuan XUE (Inst of Computing Tech./Chinese Academy of
Sciences - China)

Invited talk 2
MEMS tactile sensors for robots

		 Isao SHIMOYAMA, The U. of Tokyo - JAPAN  Chair: Toshihiro ITOH, AIST, Tsukuba - JAPAN

10:40-11:10

Coffee break

11:10-12:10			 11:10-12:30
Session C4: RF MEMS
Session T4: Characterization
 Chair: Hisham HADDARA, Si-Ware Systems, Cairo - Egypt

 Chair: Francis PRESSECQ, CNES, Toulouse - France

11:10 A novel approach to RF MEMS device - andsystem-level simulation based on MEMS+ andmatlab-simulink

11:10 The effect of sensing area position on
the mechanical response of mass – detecting
cantilever sensor

Julien PAGAZANI, Gaelle LISSORGUES (ESIEE, Noisy-le-Grand France), Alexandre MEHDAOUI, Gerold SCHROEPFER (Coventor,
Villebon sur Yvette - France)

Marius PUSTAN, Cristian DUDESCU, Corina BIRLEANU (TU. of ClujNapoca - Romania)

Giancarlo BARTOLUCCI, Giorgio DE ANGELIS, Andrea LUCIBELLO,
Romolo MARCELLI, Emanuela PROIETTI (U. of Roma “Tor Vergata” /CNR-IMM Roma - Italy)

Takahiro YAMASHITA (Macro BEANS Center, Tsukuba - Japan), Seiichi
TAKAMATSU, Takeshi KOBAYASHI, Toshihiro ITOH (AIST, Tsukuba - Japan)

11:30 An analytic approach for the synthesisof RF MEMS capacitive switches

11:50 Reliability of RF MEMS capacitive andohmic switches for space redundancy
configurations

Andrea LUCIBELLO, Romolo MARCELLI, Emanuela PROIETTI (CNRIMM Roma - Italy), Giancarlo BARTOLUCCI (U. of Roma “Tor Vergata“and CNR-IMM Roma - Italy), Viviana MULLONI, Benno MARGESIN(Fondazione B. Kessler, Trento - Italy)

11:30 Characterization of an all polymer
piezoelectric film using a reel-to-reel continuous
fiber process

11:50 Characterization of the piezoelectric power
generation of PZT ceramics under mechanical force

Shohei YAMAGISHI (Tokyo City U. - Japan), Shigeru FUJIMOTO (Tokyo
City U. - Japan), Masaaki ICHIKI (UMEMSME/ AIST, Ibaraki - Japan),
Tokio KITAHARA (Shonan Inst. of Tech., Kanagawa - Japan), Takeshi
MORITA (The Univ. of Tokyo, Chiba - Japan)

12:10 Investigation of nonlinear thermal
parameters of compound semiconductor devices

Zoltan SARKANY, Marta RENCZ (Budapest U. of Technology andEconomics - Hungary)		

14:00		

 Chairs: Romolo MARCELLI, CNR-IMM Roma - Italy

RF-MEMS switch design optimization for long-term reliability

Viviana MULLONI, Francesco SOLAZZI, Giuseppe RESTA, Flavio GIACOMOZZI, Benno MARGESIN (Fondazione B. Kessler, Trento Italy)

15:00				15:20		

15:40		

Cheng-Hsin CHUANG, Wen-Yu LEE, Feng-Fu CHUANG (Southern Taiwan U. of Science and Technology - Tainan - Taiwan)

Design and Simulation of a 1.78GHz CMOS MEMS oscillator based on MEMS SAW resonator

Fei LIU, Ioana VOICULESCU (City College of New York - USA), Anis Nurashikin NORDIN (International Islamic U. - Malaysia)

Model and measurement technique for temperature dependent electrothermal parametersof microbolometer structures

Fabian UTERMOEHLEN, Ingo HERRMANN (Robert Bosch GmbH, Gerlingen-Schillerhoehe - Germany)

Imaging and reliability of capacitive RF MEMS switches in III/V technology

Anna PERSANO, Fabio QUARANTA, Pietro SICILIANO, Adriano COLA (IMM-CNR, Lecce - Italy), Augusto TAZZOLI (U. of Padova,
Padova - Italy / Carnegie Mellon U., Pittsburgh - USA), Gaudenzio MENEGHESSO (U. of Padova, Padova - Italy / IUNET, Bologna Italy)

MEMS for space: the real story...

Laurent MARCHAND (European Space Agency - France)

16:00-20:00		
20:00		

Free Time
DinnerAdinner will be served for amemorable evening, in the
Restaurant El Tunel del Port inbeautiful surroundings and in a uniqueatmosphere with views of the beaches andOlympic Port. The Olympic harbor is one of
the areas that attracts most tourists thenight. So participants may stay there after
dinner to enjoy the atmosphere of Barcelona.

THURSAp

DAY 18 ril
08:30-09:00

Coffee break

09:00-10:40			 09:00-10:40
Session C5: MEMS accelerometers
Session T5: Devices andComponents
 Chair: Peter SCHNEIDER, Fraunhofer IIS/EAS, Dresden Germany

 Chair: Aurelio SOMÀ, Politecnico di Torino - Italy

Leonardo BALDASARRE, Alessandro TOCCHIO, Mikel AZPEITIA URQUIA,Sarah ZERBINI (STMicroelectronics, Cornaredo - Italy)

Weiqun LIU, Adrien BADEL, Fabien FORMOSA, Yipeng WU, Amen
AGBOSSOU (Lab SYMME/U. de Savoie-LOCIE, Annecy le Vieux France), Amen AGBOSSOU (Lab LOCIE/U. de Savoie-LOCIE, Annecy
le Vieux - France)

09:00 Lattice structure for a critically damped
high-G MEMS accelerometer
09:20 Sensitivity modeling of dual-axis cmos mems
convective accelerometers using fem and sphericalmodel
Brahim MEZGHANI, Fares TOUNSI, Mohamed MASMOUDI (ENIS,
Sfax - Tunisia)

09:40 Nondestructive diagnosis of mechanicalmisalignments in dual axis accelerometers
Alvaro GOMEZ-PAU, Luz BALADO, Joan FIGUERAS (UPC Barcelona Spain)

10:00 Design of a monolithic 3-axis thermal
convective accelerometer

Huy Binh NGUYEN, Frédérick MAILLY, Laurent LATORRE, Pascal
NOUET, (LIRMM /U. Montpellier II - France)

10:20 Self-test and self-calibration of a MEMS
convective accelerometer
Ahmed Amine REKIK, Florence AZAIS, Frédérick MAILLY, Pascal
NOUET (LIRMM /U. Montpellier II - France), Ahmed Amine REKIK,Mohamed Masmoudi (ENIS/U. of Sfax - Tunisia)

09:00 Design and optimization of a novel bistable
power generator for autonomous sensor nodes

09:20 A multi-channel integrated readout circuit
chip for small capacitance sensors

Xiang HE, Theodore A. FRITZ, Ronald W. KNEPPER, Anton MAVRETIC(Boston U. - USA)

09:40 Synchronized oscillation in micromechanically coupled oscillator system: part II non-synchronized super harmonic oscillation

Mamoru NAKAJIMA, Dong F. WANG, Takumi ITOH (Ibaraki U., Hitachi,
Ibaraki - Japan), Dong F. WANG, Tsuyoshi IKEHARA, Ryutaro MAEDA(UMEMSME/AIST, Ibaraki - Japan)

10:00 Thermal matching designed CMOS MEMSbased thermoelectric generator for naturally coolingcondition
Xiao YU, Yanxiang LIU, Hong ZHOU, Yi WANG, Tie LI, Xiuli GAO, Fei
FENG, Yuelin WANG (SIMIT, Shanghai - China)

10:20 New electro-thermally actuatedmicromanipulator with optimized design and FEM
simulations analyses

10:40-11:10

Coffee break

11:10-12:50			 11:10-13:10
Session T6: Process Integration
Session T7: Assembly andPackaging Chair: Pascal NOUET, LIRMM, Montpellier - France
11:10 Growth and characterization of anodized
 Chair: Alain BOSSEBOEUF, IEF, Paris-Orsay - France
aluminum oxide thin film on paper-based substrate
11:10 Assembly of super compact wireless sensor
nodes for environmental monitoring applications
Mamadou BALDE, Fabien BIBI, Benoit CHARLOT, Philippe COMBETTE,
Brice SORLI (IES/U. Montpellier II - France)

Jian LU, Hironao OKADA, Toshihiro ITOH (AIST, Tsukuba - Japan),Takeshi HARADA (NMEMS Technology Research Organization,
Ibaraki - Japan), Ryutaro MAEDA (UMEMSME/AIST, Tsukuba - Japan)

11:30 IC design of an adaptive high-voltage
electrostatic vibration energy harvester

11:30 Solder paste for highly dissipative powerelectronic assemblies

Andrii DUDKA, Dimitri GALAYKO (LIP6/UPMC, Noisy-le-Grand France), Philip BASSET (ESYCOM/ESIEE, Noisy-le-Grand - France)

11:50 Novel 3-dimensional integration techniqueof chip-on-wafer (COW) for MEMS applications

Koji FUJIMOTO, Seiichi YOSHIMI, Nobuhide MAEDA, Shoichi KODAMA,
Young Suk KIM, Hideki KITADA, Yoriko MIZUSHIMA, Takayuki OHBA(The U. of Tokyo - Japan), Tomoji NAKAMURA, (Fujitsu Lab., Kanagawa Japan), Koji FUJIMOTO, Seiichi YOSHIMI, Kousuke SUZUKI, (Dai Nippon
Printing, Chiba - Japan)

12:10 Using proximity exposure to produce
asymmetrical lens for light control films

Tung-Yu CHANG, Chien-Hsin HUNG, Zhen-Jie LIAN, Hsiharng YANG
(National Chung Hsing U., Taichung - Taiwan)

12:30 Development and process optimization of
C2W self-alignment and temporary bonding system
Yuta NAKANO, Masanori HAYASE (Tokyo U. of Science - Japan), Jian
LU, Hideki TAKAGI, Ryutaro MAEDA (UMEMSME /AIST, Tsukuba Japan)

Rodica-Cristina VOICU, Raluca MULLER (IMT Bucharest - Romania)

Kateryna KIRYUKHINA, Frederic COURTADE, Sophie DAREYS (CNES,
Toulouse - France/Vietnam National University-HoChiMinh City Viet Nam), Hoa LE TRONG, Philippe TAILHADES, Jacques LACAZE(CIRIMAT, Toulouse - France), Olivier VENDIER, Lidwine RAYNAUD(Thales Alenia Space, Toulouse - France)

11:50 Miniaturization of the packaging for
an implantable heart monitoring device

Anh-Tuan NGUYEN, Fjodors TJULKINS, Knut E. AASMUNDTVEIT, Nils
HOIVIK, Lars HOFF, Kristin IMENES (IMST/Vestfold University College,
Tønsberg - Norway)

12:10 Characterization of bonding interface
prepared by room temperature bonding after
flattening by thermal imprint process

Yuichi KURASHIMA, Atsuhiko MAEDA, Hideki TAKAGI (UMEMSME/
AIST, Tsukuba - Japan)

12:30 RF-MEMS devices packaging by using quartz
caps and epoxy polymer sealing rings

Flavio GIACOMOZZI, Viviana MULLONI, Sabrina COLPO, Alessandro
FAES , Guido SORDO, Stefano GIRARDI (Fondazione Bruno Kessler,
Trento - Italy)

12:50 Variable focus liquid lens module using
direct current electromagnetic driving

Yi-Chun LEE, Hsiharng YANG (National Chung Hsing U., Taichung Taiwan), Wang-Lin LIU (Precision Machinery Research Develpt
Center Taichung - Taiwan)

13:15-13:25		

Closing remarks

		

Bernard COURTOIS, CMP, Grenoble - France

13:30-14:30

Lunch

at a
Gla
nce
WEDNESDAY 17 APRIL 2013
09:00-10:00 Session T3
Test and Reliability
Chair: Marta RENCZ
BUTE, Budapest - Hungary
10:00-11:40
INVITED TALK 2
MEMS Tactile Sensors for Robots
Isao SHIMOYAMA, The U. of Tokyo - Japan
Chair: Toshihiro ITOH, AIST, Tsukuba - Japan
10:40-11:10
Coffee break
09:00-10:00 Session C3
Microfluidics
Chair: Andrew RICHARDSON
Lancaster U. - UK

10:00-12:00 Session T1
10:00-11:40 Session C1
MEMS devices andSensors
Components
Chair: Benoit CHARLOT
Chair: Jean-Michel KARAM
IES, Montpellier - France
MEMSCAP, Bernin - France
12:00-13:30
Lunch
13:30-15:30

Special Session on
In-Vitro Diagnostic Device
Chairs: Erik JUNG, FhG IZM, Berlin - Germany
and Gou-Jen WANG, National ChungHsing U. - Taiwan
15:30-16:00
Break
16:00-18:20 Session T2
16:00-18:20 Session C2
Materials andModeling andManufacturing
characterization
Chair: Henri CAMON
Chair: Souhil MEGHERBI
LAAS, Toulouse - France
Univ. Paris Sud - France

11:10-12:10 Session C4
RF MEMS
Chair: Hisham HADDARA
Si-Ware Systems, Cairo - Egypt

11:10-12:30 Session T4
Characterization
Chair: Francis PRESSECQ
CNES, Toulouse - France

12:30-14:00
14:00-16:00

Lunch
Special Session on Reliability
Criteria in MEMS/NEMS NEMS
Design, Manufacturing and Test
Chair: Romolo MARCELLI, CNR-IMM Roma - Italy
16:00
Free time
20:00-22:00
A dinner will be served in the Restaurant
El Tunel del Port in beautiful surroundings and in a uniqueatmosphere with views of the beaches and Olympic Port.

THURSDAY 18 APRIL 201308:30-09:00
Coffee09:00-10:40 Session C5
MEMS
accelerometers
Chair: Peter SCHNEIDER
Fraunhofer IIS/EAS, Dresden Germany

09:00-10:40 Session T5
Devicesand Components
Chair: Aurelio SOMÀPolitecnico di Torino - Italy

10:40-11:10
Coffee break
11:10-13:10 Session T7
11:10-12:50 Session T6
Assembly
Processand Packaging
Integration
Chair: Alain BOSSEBOEUF
Chair: Pascal NOUETIEF, Paris-Orsay - France
LIRMM, Montpellier - France
13:15-13:25
Closing remarks
Bernard COURTOIS, CMP, Grenoble - France
13:30-14:30
Lunch

Printed in France. Photos DR - CMP

08:00-08:50
Registration - Welcome coffee
08:50-09:00
Opening Session
Bernard Courtois, CMP, Grenoble - France
09:00-09:40
INVITED TALK 1
Electromagnetic Phenomena: Control of
Magnetic Properties via Electrical Input
Melanie W. COLE, US Army Research Lab - USA
Chair: Arturo AYON, U. of Texas at San Antonio - USA
09:40-10:00
Coffee break

DesignTUESDAY 16 APRIL 2013