ADI General RoHS Compliance Information
1.

RoHS compliant definition
ADI defines RoHS compliant to mean Pb, Hg, Cd, Cr (+6), PBB, PBDE, DEHP, BBP, DBP and DIBP are not intentionally added
during the manufacturing process and have upper concentration limits as defined below. In addition, RoHS compliantindicates the packages can withstand a peak reflow temperature of 255 +5/-0 deg C.
RoHS Banned Substance

CAS Number

Maximum Concentration Value

Hg (Mercury)

7439-92-1

1000 ppm

Pb (Lead)7439-97-6

1000 ppm

Cd (Cadmium)7440-43-9

100 ppmCr(+6) (Hexavalent Chromium)

18540-29-91000 ppm

PBB (Polybrominated Biphenyl)-

1000 ppm

PBDE (Polybrominated Diethyl Ether)-

1000 ppm

DEHP (Bis(2-Ethylhexyl) phthalate )-1000 ppm

BBP (Benzyl butyl phthalate)-

1000 ppm

DBP (Dibutyl phthalate)-

1000 ppm

DIBP (Diisobutyl phthalate)-

1000 ppm

2.

RoHS compliant package materials and terminal finishes
ADI offers RoHS compliant solutions for most of its products. Material sets have been qualified to withstand a +255°C(+5/-0°C) peak reflow temperature. The primary terminal finishes for plastic encapsulated and hermetic products arematte Sn plating with a post plating bake (1 hour at 150°C within 24 hours of plating, implemented between EIA datecode 0518-0522), SnAgCu solder spheres, and Au plating. NiPdAu is also available for select products.

3.

Part naming convention for RoHS compliance
The ADI legacy standard naming convention for RoHS compliant products requires the letter "Z" as a suffix to the existing
part number.
All Hittite legacy products are RoHS Compliant. However, the Hittite Federal products standard naming convention for
RoHS compliant products requires the letter "E" as a suffix to the existing part number.
All LTC legacy products bearing the suffix "#PBF OR #TRPBF” after the part number are RoHS compliant.
The suffix “Z”, “E” and "#PBF or #TRPBF" generally appears at the end of the part name (i.e. after the character that
denotes the package style). For example:
ADI Legacy Products
Hittite Legacy Products
LTC Legacy ProductsStandard Part Name
ADM1024ARU-REEL
AD648KRHMC6407LP5
HMC199AMS8TR
LTC1517CS5-3.3
LTC6993MPS6-4#TR

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RoHS Compliant Part Name
ADM1024ARUZ-REEL
AD648KRZ
HMC6407LP5E
HMC199MS8ETR
LTC1517CS5-3.3#PBF
LTC6993MPS6-4#TRPBFADI General RoHS Compliance Information
Certain products introduced to the market as RoHS compliant only (i.e. there is no standard SnPb or SnPbAg finish onthese parts) do not carry a "Z" suffix, but the data sheet, web product page, part marking, and labeling clearly indicate
these products as RoHS compliant.
All models intended to be offered as RoHS compliant are visible to customers through the WWW ordering guide.
Customers should contact Local Sales or Distributors with any new product transition requests.
4.

Part marking convention for RoHS compliance
RoHS compliant devices have a "#" symbol marked on the top or bottom of the package. Smaller packages, such as
SOT23, SC70 and TSOT, are too small to accommodate an additional character, and as a result, there is no "#" marking onthe package. For these smaller packages, a unique brand code is used to denote RoHS compliance.

5.

China RoHS
Analog Devices products considered as EU RoHS Compliant part, do not contain any China RoHS substance above theindicated levels set forth in the People’s Republic of China Electronic Industry Standard SJ/T 11364-2006 for theRequirements for Concentration Limits for Certain Hazardous Substances in Electronic Information Product.

6.

Labeling for RoHS compliance
Shipping containers for products compliant with RoHS regulations are labeled with “RoHS Compliant” and China
environment-friendly logos. The labels also contain the Pb free external finish code (i.e., e3, e1, etc) as specified in JEDECJESD97 standard and MSL ratings.
Shipping LabelLOGOSRoHS

China Environment-Friendly Use Period or EFUP *RoHSCompliant

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ADI General RoHS Compliance Information

RoHS NonCompliantExample* EFUP = environment-friendly-use-period, 50 years for components and 25 years for components containing a PCB.
7.

RoHS compliance transition history
ADI transitioned products to RoHS compliance under PCN #02_0011 and #04_0065.
PCN #02_0011 (closed 2004): LFCSP, LQFP, MQFP, miniSO, PDIP, QSOP, SOIC, SOT-23, SSOP, TQFP, TSSOPPCN #04_0065 (closed 2007): CSP_BGA, Header, LQFP 24x24, LQFP integrated heat sink, MQFP 32x32, MQFP integratedheat sink, PBGA, PLCC, PSOP, QSOP exposed pad, SBDIP, SBGA, SC70, SOIC exposed pad, SOT-143, SOT-223, TO-92, TQFP
exposed pad, TSSOP exposed pad, TSOT, WLCSP

8.

Support for materials with Pb
ADI encourages customers to transition to RoHS compliant products but will continue to support SnPb plating andSnPbAg solder spheres where manufacturing capability exists at our supplier base. ADI has no plan to make cerdip or
cerpack packages RoHS compliant.
ADI continues to use Pb in die attach adhesives, glass, and flip chip interconnection where regulations allow anexemption until reliable alternatives are available. ADI defines “RoHS Compliant with Exemption” or “RoHS Exempt” asproducts that contain lead but are compliant with the Directive 2015/863/EU that applies to a specific EU RoHS
Exemption. Under Article 4 of the following conditions applies to the following exemption
Ceramic MEMS products in LCC package, as well as Bumped Chip WLCSP, TO-220, DDPAK, SOT223 and TO247 andCeramic BGA packages labeled as “RoHS with Exemption” are assembled using a Soft Solder Die attach material
containing more than 90%Pb. These fall under Exemption 7(a) Lead in high melting temperature type solders (i.e. leadbased alloys containing 85 % by weight or more lead).
Glass capped MEMS products in LCC, LGA, LGA CAV, SOIC_CAV, SOIC_N_EP, SOIC_W, and Ceramic BGA Packages labeled
as “RoHS with Exemption” uses seal glass that fall under Exemption 7(c)-1, Electrical and electronic components
containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezo electronic devices, or in a glassor ceramic matrix compound.

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ADI General RoHS Compliance Information
SOT23 FCOL, , Flip chip CSP BGA and Flip chip BGA_ED labeled as “RoHS with Exemption” use lead contained solder
bumps that fall under Exemption 15 Lead in solders to complete a viable electrical connection between semiconductor
die and carrier within integrated circuit flip chip packages
9.

Reflow Profile
ADI advises reflow profiles should conform to JEDEC J-STD-020 standard which can be downloaded from the JEDEC
website under “Free Standards”.
http://www.jedec.org/

9.

Backward and forward compatibility
Backward compatibility for matte Sn, NiPdAu and Au: ADI products with matte Sn, NiPdAu, and Au finishes are backward
compatible with optimized SnPb reflow processes.
Backward compatibility for SnAgCu: ADI products with SnAgCu solder finishes are not backward compatible with SnPb
reflow processes.
Forward compatibility for SnPb: ADI products with SnPb finish are not forward compatible with +255°C (+5/-0°C) reflow
processes. Concerns include weak solder joints caused by Bi in the solder paste reacting with Pb delamination resulting
from package material sets that are not +255°C (+5/-0°C) compatible, and solder ball voiding caused by Pb free solder
paste outgassing into the solder ball.

10. Matte Sn whisker dataMatte Sn is a widely available industry standard that has been in production for many years with excellent quality andreliability. All matte Sn plated devices undergo a post plating bake for 1 hour at 150 degrees C within 24 hours of plating
to mitigate Sn whisker growth. Sn whisker testing is done based on the test methodology outlined in JEDEC JESD22A121
standard (Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes) with read-point intervals of1000 hours or 500 cycles. Test results are in the table below.
Criteria 

Package

LFCSP
LQFP
MQFP
MINISOPDIP

Maximum 20 um(Class 1a)

Preconditioning

Temperature Humidity
Storage(30/60%RH, 4000 Hrs)

No precon
Precon @ 215-220'C
Precon @ 260'C
No precon
Precon @ 215-220'C
Precon @ 260'C
No precon
Precon @ 215-220'C
Precon @ 260'C
No precon
Precon @ 215-220'C
Precon @ 260'C
No precon
Precon @ 215-220'C
Precon @ 260'C

Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
AcceptableAcceptable
Acceptable
See QSOP results
See QSOP results
Acceptable
Acceptable
Acceptable
Acceptable
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Maximum 40 um(Class 2)
High Temperature
Humidity Storage(55'C/85%RH, 4000 Hrs)
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
See QSOP results
See QSOP results
Acceptable
Acceptable
Acceptable
Acceptable

Maximum 45 um(Class 2)
Temperature Cycle(-55/+85'C,1500 Cyc)
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
See QSOP results
See QSOP results
AcceptableAcceptable
Acceptable
Acceptable

ADI General RoHS Compliance Information
Criteria Package

PLCC
PSOP
QSOP
SC70/
SOT143/
SOT23-3Ld
SOIC_N
SOIC_W
SOT223
SOT23
SSOP
TQFP
TSSOP

Maximum 20 um(Class 1a)

Preconditioning

Temperature Humidity
Storage(30/60%RH, 4000 Hrs)

No precon
Precon @ 215-220'C
Precon @ 260'C
No precon
Precon @ 215-220'C
Precon @ 260'C
No precon
Precon @ 215-220'C
Precon @ 260'C
No precon
Precon @ 215-220'C
Precon @ 260'C
No precon
Precon @ 215-220'C
Precon @ 260'C
No precon
Precon @ 215-220'C
Precon @ 260'C
No precon
Precon @ 215-220'C
Precon @ 260'C
No precon
Precon @ 215-220'C
Precon @ 260'C
No precon
Precon @ 215-220'C
Precon @ 260'C
No precon
Precon @ 215-220'C
Precon @ 260'C
No precon
Precon @ 215-220'C
Precon @ 260'C

Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
See QSOP results
See QSOP results
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
AcceptableMaximum 40 um(Class 2)
High Temperature
Humidity Storage(55'C/85%RH, 4000 Hrs)
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
See QSOP results
See QSOP results
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable

Maximum 45 um(Class 2)
Temperature Cycle(-55/+85'C,1500 Cyc)
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
See QSOP results
See QSOP results
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable
Acceptable

11. RoHS Compliance for Evaluation Boards
Analog Devices evaluation boards are specifically designed for the purpose of research and development and are madeavailable solely on a business-to-business basis and are therefore excluded from the scope of the RoHS 2 Directive.

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