Atom-chip Bose-Einstein condensation
in a portable vacuum cellby

Shengwang Du
B.S., Electrical Engineering, Nanjing University, China, 1996
M.S., Physics, Peking University, China, 1999
M.S., Electrical Engineering, University of Colorado at Boulder, 2002

A thesis submitted to the
Faculty of the Graduate School of the
University of Colorado in partial fulfillmentof the requirements for the degree ofDoctor of Philosophy
Department of Physics
2005

This thesis entitled:
Atom-chip Bose-Einstein condensation in a portable vacuum cell
written by Shengwang Du
has been approved for the Department of Physics_________________________________
Dr. Dana Z. Anderson_________________________________
Dr. Deborah S. Jin

Date____________________

The final copy of this thesis has been examined by the signatories, and we find thatboth the content and the form meet acceptable presentation standards of scholarly
work in the above mentioned discipline.

iii

Du, Shengwang (Ph.D., Physics)
Atom-chip Bose-Einstein condensation in a portable vacuum cell
Thesis directed by Prof. Dana Z. Anderson

Cold atom guiding and manipulation using lithographically patterned wires on substrates
have demonstrated the possibility of making small-scale atom-chip devices for practicalapplications. Nevertheless, like all Bose-Einstein condensate (BEC) systems developed to date,chip-scale atomic systems require an unwieldy assembly of electronic, optical, and vacuum
instrumentation. This thesis reports on the significant simplification and size reduction of thevacuum system for atom-chip-based BEC production. The atom chip itself forms one wall of thevacuum system and enables direct electrical connections outside of vacuum to the chip instead of
relying on vacuum feed-throughs. We have produced a portable system that can be assembled,
processed, and then inserted into an ultracold atom apparatus in much the same way that anelectronic vacuum tube can be plugged into an existing receiver. Our portable atom-chip cell has atotal size of less than 30 × 30 × 15 cm. The ultrahigh vacuum of 10-10 torr is maintained by a small,
8 L/s ion pump and nonevaporable getter. We have successfully achieved a 87Rb BEC in a micro
Z-wire trap. The condensate has about 2,000 87Rb atoms in the F=2, MF=2 state. All cooling andtrapping processes occur from 2 mm to 80 µm below the chip. This work suggests that achip-based BEC-compatible vacuum system can occupy a volume of less than 0.5 liter.

Dedication

To my dear wife, Lijing Ye (叶丽静),and new born son, Preston Y. Du (杜泽豪)v

Acknowledgment
In 1999, when I entered the United States and Boulder city for the first time, I knew little
about this country and this university. Like most other foreigners, I have been pursuing my own
American dream. Six years’ PhD Physics study and research at the University of Colorado at
Boulder has been filled with joy and hope. Although it is my passion and enthusiasm for physics
that led me through all the years, it was impossible to finish my PhD study and this thesis without
many people’s support.
First, I thank my advisor, Dr. Dana Z. Anderson, for all his support. Without him, I would
not have gained so much during my research work. Five years ago, I didn’t have any opticalexperimental experience: I did not know a wave plate, a beam splitter, or even a dielectric mirror.
But he trusted me and said, “I will train you to be an experimental physicist.” At many times,
when many people, including myself, doubted if it was possible to create a Bose-Einsteincondensation (BEC) in such a small cell, he always put his faith on it. Sometimes when I was sadand upset about zero progress, he encouraged me and directed me. As an advisor, Dana discoveredand explored my capability and built my confidence for the future.
Second, I would like to acknowledge Leslie Czaia. She is the one who assembles the atom
chip and quartz cell together. Without her magical hands, it would be impossible to build up the
portable atom-chip cell, and impossible for me to carry out all the experiments. What is the mostimportant is that she treats me like her younger brother and makes me feel at home in the lab. I
have learned a lot from her.
Dr. Patrick Berthoud, a previous postdoctoral associate during my first year in the group,taught me how to build and make an optical-magnetic trap (MOT). From him, I learned thefundamentals of laser cooling experimental skills. The most important inheritance he left me is thedesign of the JILA-mount external cavity laser diode system (section 4.2) with which I have built
all the lasers.
I miss Yutaka Imai, who returned to the Sony Corporation after the summer of 2003. Thevi
year I had spent with him was the most fruitful one in completing the entire optical-electronicsystem. For many nights, we worked together in debugging the system and taking measurements.
He was my best company during that period of time. Without his contribution, the optical system
could not have been completed.
Now, I want to express my appreciation to my coworker, Matthew B. Squires. We havebeen working together for the past four years on this project and experienced through all the sadand exciting moments.
I highly appreciate the cooperation with Dr. Victor M. Bright’s group at Department of
Mechanical Engineering for fabricating chips for us.
Meanwhile, I want to remember all the following people: Benjamin Luey, Brain McCarthy,
R. A. Saravanan, Evan Salim, Seth Frader-Thompson, Ying-ju Wang, Dirk Muller, Tetsuo
Kishimoto, Peter Schwindt, Quentin Diot, Stephen Segal, Paul Smith, Marty Baylor, Steven
Hughes, Edeline Fortheringham, and Hongke Ye. I thank Zhigang Chen for his magnetic wire
coils and some startup work for the project. I thank S. Inoyoe and J. Goldwin from D. Jin’s groupfor helpful discussions about RF evaporative cooling. I thank Eun Oh from US Naval Research
Lab (NRL) for his help in the English writing of this thesis and discussion of Physics. I thankJulie Phillips at Scientific Reports Office (SRO) for teaching me in scientific writing and helping
me throughout editing the thesis. I also want to thank the electronic and machine shops for theirwonderful technical services.
During the years of my study and research, I have received advice and suggestion from
Professor Eric Cornell and Carl Wieman about vacuum and cold atoms. Especially when Dana
was out of town, they used their expensive time to give us their knowledge and experience. I also
thank them for joining my compressive examination III committee. Most importantly because of
their original work on the first BEC in 1995, I now see the future of BEC atom chips.
Here, I appreciate the support from my final defense committee. They are Dr. Dana Z.
Anderson, Dr. Deborah S. Jin, Dr. Jun Ye, Dr. Senarath De Alwis, and Dr. Victor M. Bright.
I want to thank my American host family, Mr. and Mrs. Caldwell. They never hesitate toviigive me and my wife any help we need, and make us feel at home in the state.
At last, I want to thank my family in China: my mother and father. It is they who have beenencouraging me to pursue my dream for the past thirty years even though they never received any
high education at their age. Now it is time to do something for them after my graduation.
The most important support and driving force I received is from my own family: my dear
wife Lijing Ye (叶丽静), and our new born son Preston Y. Du (杜泽豪). To support my work, mywife married me as early as she could and moved with me to Boulder from China. Without her
support, I was not able to work later than midnight and overnight. For our own family, she put her
dream into mine.
My PhD study is over, but my life will move on. Thanks, JILA! Thanks, the department ofphysics at CU-Boulder! Thanks for all the people I have worked and lived with.

viii

Contents
1.

Introduction

1

2.

Theory of cooling and trapping on an atom chip3

2.1 Two-state laser-coupled system-------------------------------------------------------- 3
2.1.1

Hamiltonian------------------------------------------------------------------

2.1.2

Steady-state population----------------------------------------------------- 5

2.1.3

Photon-atom scattering cross section------------------------------------- 6

2.1.4

Optical force------------------------------------------------------------------ 10

2.2 Magneto-optical trap -------------------------------------------------------------------

3

11

2.2.1

Optical molasses------------------------------------------------------------- 11

2.2.2

MOT configurations--------------------------------------------------------- 13

2.2.3

Capture velocity-------------------------------------------------------------

2.2.4

Capture volume-------------------------------------------------------------- 17

2.2.5

Loading equation------------------------------------------------------------ 18

2.2.6

Polarization gradient cooling ---------------------------------------------- 19

16

2.3 Atom-chip magnetic trap--------------------------------------------------------------- 21
2.3.1

Chip wire micro trap-------------------------------------------------------- 22

2.4 Adiabatic compression------------------------------------------------------------------ 30
2.4.1

Linear trap-------------------------------------------------------------------- 31

2.4.2

Harmonic trap---------------------------------------------------------------- 32

2.4.3

Atom-chip Z-wire trap------------------------------------------------------ 32

2.4.4

Adiabatic requirement------------------------------------------------------

33

2.5 Trap-depth dependent lifetime--------------------------------------------------------- 34
2.6 Forced evaporative cooling------------------------------------------------------------

36

2.6.1

RF-forced evaporation------------------------------------------------------ 37

2.6.2

Surface-induced evaporation on an atom chip--------------------------- 38

ix
2.6.3

Direct evaporation on an atom chip--------------------------------------- 39

2.7 Bose-Einstein Condensation ----------------------------------------------------------

41

2.7.1

Noninteracting BEC--------------------------------------------------------- 41

2.7.2

Interaction between atoms-------------------------------------------------- 42

2.8 Measurement----------------------------------------------------------------------------- 42

3.

2.8.1

Absorption and fluorescence imaging------------------------------------ 42

2.8.2

Time of flight ---------------------------------------------------------------- 44

A portable atom-chip vacuum cell48

3.1 Introduction------------------------------------------------------------------------------

48

3.2 First generation atom-chip vacuum system------------------------------------------ 50
3.3 A portable atom-chip vacuum cell----------------------------------------------------

52

3.3.1

Fabrication of the atom-chip glass cell----------------------------------- 53

3.3.2

Rubidium dispenser---------------------------------------------------------

3.3.3

Pyrex helix-------------------------------------------------------------------- 58

3.3.4

Nonevaporable getter ------------------------------------------------------

59

3.3.5

Small ion pump -------------------------------------------------------------

60

3.3.6

Pinch-off tube---------------------------------------------------------------- 60

56

3.4 Pumping station-------------------------------------------------------------------------- 60
3.5 Baking out and pumping down procedure ------------------------------------------- 62
3.6 Conclusion ------------------------------------------------------------------------------- 63
4.

Optical system

64

4.1 Overview --------------------------------------------------------------------------------

64

4.2 JILA-mount external cavity laser diode ---------------------------------------------

66

4.3 Cooling laser-----------------------------------------------------------------------------

71

4.4 Repumping laser------------------------------------------------------------------------- 76
4.5 Pumping/probe laser--------------------------------------------------------------------

78

x
4.6 Fiber coupling --------------------------------------------------------------------------- 81
4.7 Atom-chip cell optical table------------------------------------------------------------ 82
4.8 Imaging setup---------------------------------------------------------------------------- 83

5.

4.8.1

Camera configuration------------------------------------------------------- 83

4.8.2

Atom-chip surface reflection imaging------------------------------------ 84

Electronic system

86

5.1 Computer-control system--------------------------------------------------------------- 87
5.2 Imaging control and DAQ-------------------------------------------------------------- 94
5.3 Magnetic coil hat------------------------------------------------------------------------- 97
5.3.1

Circular coil hat-------------------------------------------------------------- 98

5.3.2

Rectangular coil hat--------------------------------------------------------- 100

5.4 Current power supplies-----------------------------------------------------------------

102

5.5 RF drive----------------------------------------------------------------------------------- 105

6.

5.5.1

AOM driver------------------------------------------------------------------

105

5.5.2

RF coil driver----------------------------------------------------------------

106

Preparation and optimization

107

6.1 Atom-chip cell--------------------------------------------------------------------------- 107
6.2 Laser powers and frequencies---------------------------------------------------------- 108
6.3 External coil mirror MOT--------------------------------------------------------------

108

6.4 Dispenser operating current------------------------------------------------------------ 110
6.5 UV mirror MOT-------------------------------------------------------------------------

111

6.6 Bias coils field calibration-------------------------------------------------------------- 113
6.7 Transferring to the chip U-wire MOT------------------------------------------------- 115
6.8 Imaging camera calibration -------------------------------------------------------- ---116

6.9 Mirror CMOT --------------------------------------------------------------------------- 118
6.10 Chip CMOT optimization-------------------------------------------------------------- 118

xi
6.11 Polarization gradient cooling ---------------------------------------------------------- 118
6.12 Optical pumping------------------------------------------------------------------------- 119
6.13 ZMT loading optimization---------------------------------------------------------- ---119

6.14 Final loading optimization-------------------------------------------------------------

120

6.15 Summary and conclusion--------------------------------------------------------------- 121
7.

Bose-Einstein condensation on the chip122

7.1 Charging the cell------------------------------------------------------------------------- 123
7.2 UV mirror MOT-------------------------------------------------------------------------

123

7.3 External coil mirror CMOT------------------------------------------------------------

126

7.4 Chip U-wire CMOT--------------------------------------------------------------------- 128
7.5 Polarization gradient cooling------------------------------------------------------- ---130

7.6 Optical pumping------------------------------------------------------------------------- 132
7.7 Z-wire magnetic trap ------------------------------------------------------------------- 134
7.8 ZMT initial compression---------------------------------------------------------------

134

7.9 ZMT compression and forced evaporative cooling--------------------------------- 134
7.10 BEC on the chip-------------------------------------------------------------------------

137

7.11 Summary and conclusion--------------------------------------------------------------- 139
8.

Other atom-chip experiments

140

8.1 Atom splitting during polarization gradient cooling-------------------------------- 140
8.2 Rethermalization in the Z-wire magnetic trap--------------------------------------- 142
8.3 Surface-induced evaporative cooling------------------------------------------------- 144
8.4 Sloshing in the Z-wire magnetic trap------------------------------------------------- 146
8.5 Parametric heating in a tightly confined magnetic trap----------------------------- 148
8.6 Atom-chip BEC lifetime---------------------------------------------------------------- 150
Bibliography

153

Appendix 1

Atom-chip cell vacuum lifetime ------------------------------------------------ 160

xii
Appendix 2

A miniature atom-chip vacuum cell -------------------------------------------- 164

xiii

Figures
2.1 A two-state system coupled with a laser field --------------------------------------------

4

2.2 A finite-lifetime two-state system coupled with a laser field ---------------------------- 5
2.3 A standard six-beam MOT setup -----------------------------------------------------------

14

2.4 A Mirror MOT configuration ---------------------------------------------------------------

15

2.5 A chip U-wire surface MOT configuration ------------------------------------------------ 16
2.6 Zeeman splitting and level crossing of 87Rb 5P3/2 states F=3 and F=2 ----------------- 17
2.7 One-dimensional schematic diagram of polarization gradient cooling ---------------- 20
2.8 A two-dimensional quadrupole magnetic field generated by a single current wire augmented
with a uniform transverse bias magnetic field --------------------------------------------- 23
2.9 U-wire, Z-wire magnetic-trap configurations and potential plots -----------------------

24

2.10 A Z-wire magnetic trap ----------------------------------------------------------------------

25

2.11The transverse quadrupole two-dimensional trap center offset due to the z-directional bias
field induced by the two y-directional wires ---------------------------------------------

26

2.12 Z-wire magnetic traps ------------------------------------------------------------------------ 29
2.13 The Z-wire trap loss rate vs the mirror MOT loss rate------------------------------------ 35
2.14 Zeeman level splitting and RF evaporative cooling -------------------------------------- 37
2.15 Z-wire magnetic trap for surfaced-induced evaporative cooling------------------------ 39
2.16 An H-wire trap pattern design --------------------------------------------------------------- 39
2.17 Trap potentials of the H-wire trap as in figure 2.16 --------------------------------------- 40
3.1 Traditional BEC systems with large and complicated vacuum components ---------- 48
3.2 Apparatuses for the two first BECs on a chip reported in 2001 ------------------------ 49
3.3 Diagram of the first-generation– atom-chip cell ------------------------------------------ 51
3.4 Portable miniature vacuum cell for the production of a chip BEC --------------------- 52
3.5 The atom chip and its wire pattern ---------------------------------------------------------

54

3.6 Cell construction procedure diagram ------------------------------------------------------- 56

xiv
3.7 Results of a pulsed dispenser mode at 6 A ------------------------------------------------

57

3.8 Cell pressure P vs Rubidium dispenser current Id----------------------------------------- 58
3.9 SAES NEG ST172 configuration and activation conditions ---------------------------- 59
3.10 A portable atom-chip cell is connected to the pumping station via a pinch-off tube.

61

4.1 Laser optical setup on the optical table ---------------------------------------------------- 64
4.2 Top view of laser optical setup on the small aluminum optical board ----------------- 65
4.3 Pictures of the JILA mount ECLD laser head system -----------------------------------

67

4.4 Drawing of JILA mount ECLD mechanical components -------------------------------

68

4.5 Result of one of the JILA mount ECLD lasers -------------------------------------------- 70
4.6 87Rb D2 line hyperfine energy levels and the MOT cooling transition ----------------- 71
4.7 Cooling laser optical setup before coupled to the fiber ---------------------------------

72

4.8 Master-slave injection locking signals ----------------------------------------------------- 73
4.9 Slaver laser locked output fraction vs injected master laser power -------------------- 75
4.10 Injection locking range vs injected laser power------------------------------------------- 76
4.11 87Rb D2 line hyperfine energy levels and the MOT repumping transition ------------ 77
4.12 Repumping laser optical setup before coupled to the fiber -----------------------------

77

4.13 87Rb D2 line hyperfine energy levels and the pumping and probe transitions ------

79

4.14 Pumping/probe laser optical setup before coupled to the fiber ------------------------- 79
4.15 Schematic of the optical pumping effect --------------------------------------------------

80

4.16 Schematic of the probe absorption under a bias magnetic field -----------------------

81

4.17 Optical fiber coupling system diagram ----------------------------------------------------

82

4.18 Atom-chip cell table -------------------------------------------------------------------------

83

4.19 Camera setup for atom-chip experiments--------------------------------------------------

84

4.20 Atom-chip surface reflection imaging -----------------------------------------------------

85

5.1 Schematic diagram of the atom-chip computer-based control and DAQ system ----

86

5.2 Front panel of MirrorMOT2004V3.1.VI with single-update configuration ----------

88

xv
5.3 An example of a single channel wave form with only linear ramps ------------------- 89
5.4 An example of a 2-channel wave forms with only linear ramps -----------------------

89

5.5 Timing table editor front panel sheet ------------------------------------------------------- 91
5.6 Channel timing array editor front panel ---------------------------------------------------

91

5.7 Imaging controller front panel --------------------------------------------------------------

92

5.8 Waveform browser front panel --------------------------------------------------------------- 92
5.9 PDXI-AO-32/16 board configuration front panel sheet ---------------------------------- 93
5.10 RF sweep controller front panel (for forced evaporative cooling) --------------------- 93
5.11 Absorption and background imaging timing with a probe pulse ----------------------

95

5.12 Imaging timing for the dark frame ---------------------------------------------------------

95

5.13 Part of the Labview front panel of the absorption imaging process program ----- ---96

5.14 Part of the Labview front panel of the absorption imaging process program shows our first
BEC on the atom chip with x and y cross section plots and 2-D fitting ---------------

96

5.15 Atom-chip mirror MOT configuration ----------------------------------------------------

97

5.16 Dimensions of a circular coil pair ----------------------------------------------------------

98

5.17 Pictures of the circular coil hat -------------------------------------------------------------- 99
5.18 Dimensions of a rectangular coil pair ------------------------------------------------------ 100
5.19 Pictures of the rectangular coil hat ---------------------------------------------------------

101

5.20 Switching on and off time of X, Y, and Z bias coils vs current ------------------------- 103
5.21 The effect of the 1.9 µF capacitor to the MOT coil current stability and its switching timemeasurement -----------------------------------------------------------------------------------

104

5.22 System diagram of AOM RF driver -------------------------------------------------------- 105
5.23 System diagram of the RF coil driver ------------------------------------------------------ 106
6.1 The atom-chip wire pattern ------------------------------------------------------------------- 107
6.2 External coil mirror MOT fluorescence images ------------------------------------------ 109
6.3 The external coil mirror MOT loading vs dispenser current ---------------------------- 110

xvi
6.4 UV mirror MOT loading and lifetime measurement-------------------------------------- 112
6.5 UV LIAD cell pressure recovery time measurement ------------------------------------

113

6.6 Bias coils calibration ------------------------------------------------------------------------- 114
6.7 Chip U-wire surface mirror MOT fluorescence images --------------------------------- 115
6.8 Imaging probe beam configuration for both direct through and reflection imaging-- 117
6.9 An Apogee CCD camera image of the atom-chip wire pattern ------------------------

117

6.10 The Z-wire current and y bias field ramps during ZMT loading and compression -- 120
6.11 Reflection absorption imaging of atoms in a Z-wire trap -------------------------------

121

7.1 Time-of-flight (TOF) measurement of the external coil mirror MOTs ---------------- 124
7.2 Absorption image of the external coil mirror MOT -----------------------------------

125

7.3 TOF measurement of the external coil mirror CMOT ----------------------------------- 126
7.4 Absorption imaging of the external coil mirror CMOT ---------------------------------

127

7.5 TOF measurement of the chip U-wire CMOT -------------------------------------------- 128
7.6 Absorption imaging of the Chip U-wire CMOT ------------------------------------------ 129
7.7 TOF measurement after PGC ---------------------------------------------------------------- 130
7.8 Absorption imaging after PGC -------------------------------------------------------------- 131
7.9 TOF measurement after optical pumping--------------------------------------------------- 132
7.10 Absorption imaging after optical pumping ------------------------------------------------ 133
7.11The atom number N, temperature T, peak OD and average PSD as functions of the stopfrequency ν3 at the third RF sweep ---------------------------------------------------------- 136
7.12 RF logarithmic sweeps for forced evaporative cooling ---------------------------------- 137
7.13 Images of a Bose-Einstein Condensation -------------------------------------------------- 138
7.14 Longitudinal BEC atom cloud’s optical depth profile, taken at TOF 9ms, fitted to a double
gaussian distribution---------------------------------------------------------------------------

138

8.1 The atom cloud split into three after 4 ms polarization gradient cooling -------------

141

8.2 The long rethermalization of atoms in the Z-wire trap ----------------------------------

143

xvii
8.3 The fast rethermalization of atoms in the Z-wire trap -----------------------------------

144

8.4 Surface-induced evaporative cooling ------------------------------------------------------- 145
8.5 Axial sloshing fitted to an expotional decay oscillation --------------------------------- 147
8.6 Z-wire current modulation block diagram for parametric heating experiment ------- 149
8.7 Parametric heating effect of the Z-wire magnetic trap ------------------------------------ 149
8.8 BEC heating measurement in the compressed and decompressed traps --------------- 152
8.9 Atom-chip BEC lifetime --------------------------------------------------------------------- 152
A1.1UV MOT lifetime history after pinching off ---------------------------------------------- 160
A1.2Helium leak and diffusion test --------------------------------------------------------------

161

A1.3UV MOT lifetime of the cell without flashing -------------------------------------------- 162
A2.1Miniature atom-chip vacuum cell with a 2 L/s ion pump -------------------------------

164

xviiiTables
3.1 Atom-chip cell parts list ---------------------------------------------------------------------

52

3.2 Pumping station parts list -------------------------------------------------------------------- 61
3.3 Atom chip cell bakeable and baking temperature ---------------------------------------- 62
3.4 Pumping station bakeable and baking temperature --------------------------------------

62

4.1 Cooling laser frequencies at different cooling stages ------------------------------------ 74
4.2 Commercial part list of fiber coupling------------------------------------------------------ 82
5.1 2-D array representation of the waveform ------------------------------------------------- 89
5.2 3-D timing array for 2-channel waveforms -----------------------------------------------

90

5.3 Timing table for 2-channel waveforms ----------------------------------------------------

90

5.4 Specification of the circular coil hat -------------------------------------------------------

98

5.5 Specification of the rectangular coil hat --------------------------------------------------- 100
5.6 Commercial part list of AOM drivers purchased from Mini-Circuits -----------------

105

5.7 Commercial part list of the RF coil driver ------------------------------------------------- 106
7.1 Atom number N, temperature T, peak OD, collision rate, and PSD after each RF sweep---------------------------------------------------------------------------------------------------- 137

1

Chapter 1. Introduction
The wave nature of matter in the microscopic world has been an important topic of physics
research and a driving force in developing modern scientific technologies for the past one hundredyears. Albert Einstein proposed two well-known wave coherence theories for massless photons
and massive bosonic atoms, i.e., stimulated emission theory in 1916 [1] and the Bose-Einsteincondensation (BEC) predicted in 1924 [2]. Stimulated emission underlied the fundamental ofphoton-based lasers 40 years later. BECs are now often referred to as “atom lasers.” However, thescientific path lengths of photon and atom lasers are quite different because of their different“inertial masses.” The first maser, or called microwave laser, was realized in 1954. Now laser
optical technologies have entered into our daily life. The first BEC with dilute neutral atoms was
not accomplished until 1995 by Eric Cornell and Carl Weimann at JILA [3], and Wolfgang
Ketterle at MIT [4], and further research can only be done within atomic research labs withcomplicated and huge system setups. As we look back to the 50 years’ development of laser
optical applications, we see a clear and bright future for the atom lasers and atom optics, which
may take an even longer time to develop than photon optics. The invention and development of
portable, miniature atom-laser sources and devices are the key to transferring the scientificknowledge from atomic physicists to nonexpert engineers’ hands.
The “atom chip” is one of the key elements in minimizing atom-optics systems. In contrast
to the electronic micro chips that drive electrons, an atom chip drives and manipulates cold atoms
with magnetic field circuits on the chip surface generated by micro-patterned wires and magnets[5–12]. The use of free-standing wires for magnetic atom guiding started as early as 1992 [13].
However, the first realization of BEC on a chip did not occur until 2001 [14, 15]. This breakthrough opened the door towards micro-chip-scale coherent matter-wave devices.
Unfortunately, atom-chip systems still look complicated and huge. First, atom chips areinserted into a relatively large vacuum chamber. Second, the vacuums still require a large
pumping station that dominates the system size. In this thesis, I report our achievement of a2
portable BEC atom-chip cell system. For the first time, we use the atom chip itself to seal thevacuum cell thus dramatically simplifying the vacuum and feed-through construction. The
ultrahigh vacuum is maintained by only a nonevaporable getter (NEG) and a small, 8 L/s, ion
pump. The entire vacuum cell has a size of 30 × 30 × 15 cm [16].
The thesis is organized in the following way. Chapter 2 provides some basic theoretical
tools to understand laser cooling and trapping on a chip. Then, we describe the atom-chip cell
vacuum construction in detail in chapter 3. Chapters 4 and 5 describe the optical and electronicsystems. In chapter 6, I give the procedures for preparing and optimizing the atom-chip
experiments. The recipe for making a BEC on the atom-chip is described in chapter 7. Chapter 8
includes other atom-chip related experiments.
My thesis research work focuses on developing the portable BEC atom-chip cell system.
Our original work is described in detail from chapter 3 to chapter 8, from the vacuum cell, opticalsystem, and electronic system to the recipe of making BEC on the chip. One thing I must mention
is that the atom chip is fabricated by Dr. Victor M. Bright’s group in the Mechanical Engineering
Department at the University of Colorado. To make this thesis more complete, I summarize theirchip fabrication recipe in section 3.3.1. To help readers – most of them will be graduate students –pick up the theoretical tools quickly and understand rest of the thesis, I spend forty pages toreview and summarize some important theories of laser cooling and trapping in chapter 2, which I
also use to propose some new issues about atom chips, e.g., Z-wire trap symmetry axes (section
2.3.1), a new method in realizing atom-chip surface-induced evaporative cooling (section 2.6.2),
and direct forced evaporation without any external components (section 2.6.3). Most parts inchapter 2 are not my original work but, as part of this dissertation, are extremely important tounderstand our atom-chip system and experiments.

3

Chapter 2. Theory of cooling and trapping on an atom chip
The physics principles involved in laser cooling and trapping, which have been welldeveloped since the 1980s, are essential for understanding atom-chip experiments. The theoreticalanalysis can be found in numerous textbooks and publications [17–20]. However, most of thosebooks and review articles are written from the experimentalist’s perspective, and hence no formal
derivations are given. From my experience as a graduate student, I often find myself in darkness,
not precisely understanding the physics even though I am able to run the experiments. I attempt toclarify here some of the most important derivations step by step, while still siding on theexperimentalist’s side. This chapter reviews laser cooling and trapping mechanisms from a
two-state laser-coupled system and then explains the fundamentals of magnetic traps, evaporative
cooling, and Bose-Einstein condensation (BEC). In the last part, we discuss some concerns aboutcold-atom imaging.

2.1

Two-state laser-coupled system
Laser cooling and trapping are based on the quantum theory of a two-state system, eventhough all experimental systems actually involve many levels. The simple picture of a two-statesystem not only allows physicists to interpret the fundamentals, but also opens the door to
discovering the secrets of the atomic world.

2.1.1

Hamiltonian

The Hamiltonian of a system takes different forms in specific reference frames, hence
finding the simplest Hamiltonian becomes extremely important to physicists. In a two-state
quantum system driven by a laser field, the Hamiltonian in the lab reference frame is timedependent. However, as shown later in this section, such a Hamiltonian can be expressed time
independently by applying a unitary transformation. After transform, the new frame is referred toas the dressed-state picture [21] or the rotational reference frame.

4

Figure 2.1: A two-state system coupled with a laser field that has a frequency detuning Δ.
The diagram of a two-state system coupled with a laser field is shown in figure 2.1. The
laser field with a single frequency ω is dealt with as a classical electric field

r r
r r
1 r r
1 r r
E (r , t ) = [ E (r )e iωt + E (r ) * e −iωt ] = [ E (r )e iωt + c.c.] .
2
2

(2.1)

When the electric field couples the two-state quantum system, the Hamiltonian can be writtenfrom the lab reference frame as⎡ε1Hˆ (t ) = ⎢ 1* − iωt⎣ 2 hΩ e12hΩe iωt ⎤
⎥,
ε2 ⎦

(2.2)

where we use “^” to represent an operator, and ε 1 , ε 2 are energy eigenvalues of the states |1>
and |2> without any external fields. The Rabi frequency Ω is defined byrˆ r rhΩ = e < 1 | E ( r ) ⋅ rˆ | 2 > ,(2.3)
where e is the absolute value of an electron charge. Thus the time-dependant Schrödinger
equation isih∂| Ψ; t > S = Hˆ (t ) | Ψ; t > S .
∂t

(2.4)

The Hamiltonian (2.2) can be transformed into a time independent operator by applying thefollowing unitary transform ofˆUˆ d = e iH d t / h

(2.5)

0 ⎤
⎡ε
Hˆ d = ⎢ 1⎥.
⎣ 0 ε 1 + hω ⎦

(2.6)

with

Under this transformation, in the new reference frame, the Hamiltonian and wave function go to5⎡ εHˆ 1 = Uˆ d Hˆ Uˆ d+ = ⎢ 1 1 *⎣ 2 hΩ

12hΩ⎤
ε 2 ⎥⎦

(2.7)

and
ˆ
| Ψ; t > d = Uˆ d | Ψ; t > S = e iH d t / h | Ψ; t > S .

(2.8)

The new Schrödinger equation becomes

ih

~ˆ
∂
∂
| Ψ ; t > d = ih U d | Ψ ; t > S = H d | Ψ ; t > d ,
∂t
∂t

(2.9)

where the new Hamiltonian is
1
hΩ⎤
⎡ 0
~ˆ
2
ˆ
ˆ
H d = H1 − H d = ⎢ 1⎥,*⎣ 2 hΩ − h∆ ⎦where ∆ = ω − ω 21 = ω − ( E 2 − E1 ) / h is the frequency detuning.

(2.10)The new Hamiltonian equation (2.10) is the key to studying the two-state system. In thefollowing sections, by solving the population steady-state equation of the quantum ensemble, we
understand how the laser field changes the atom population in the states |1> and |2>, how theatoms scatter the photons, and what the origin of optical trapping forces is.

2.1.2

Steady-state population

Figure 2.2: A finite-lifetime two-state system coupled with a laser field that has a frequency
detuning ∆. The atoms in the excited state |2> decay to the ground state |1> and the other stateswith decay rates Γ21 and Γ2j (j≠1), respectively.
To derive the evolution of the population density matrix, we must take into account thefinite atom lifetime at the excited state |2> due to spontaneous emission and other processes. The
decay rate from the excited state |2> to the ground state |1> is denoted as Γ21, and the decay rates
from |2> to other non-|1> states are represented by Γ2j (j≠1), as shown figure 2.2. Then the total
decay rate is6Γ2 = ∑ Γ2 j = Γ21 + ∑ Γ2 j .

(2.11)j ≠1

jWe define the decay operator as⎡0 0 ⎤
Γˆ = ⎢⎥.
⎣0 Γ2 ⎦

(2.12)The population evolution equation can be written down as

1 ~ˆ
d
⎛ 1
⎞
ρ ij = ⎜ − {Γˆ , ρˆ } + [ H d , ρˆ ] ⎟ , (i, j ) ≠ (1,1) ,
dt
ih
⎝ 2
⎠ ij

(2.13)d1 ~⎞⎛ 1
ρ11 = ⎜ − {Γˆ , ρˆ } + [ Hˆ d , ρˆ ] ⎟ + Γρ 22 ,
dt
ih
⎠11
⎝ 2

(2.14)

under the conservation conditions ofTrρ = ρ11 + ρ 22 = 1 .

(2.15)At the steady state, the atom populations reach equilibrium, i.e.,

ρ& ij = 0 , ( i , j =1,2).

(2.16)

Solving the above equations (2.13)–(2.16), we get the following steady-state solutions:2Γ2 + 4∆2 + | Ω | 2

ρ11 =

2

Γ2 + 4∆ + 2 | Ω |ρ 22 =

ρ12 =ρ 21 =2=

2+S,
2(1 + S )(2.17)=

S,
2(1 + S )(2.18)

=

iΩ
1
, and
⋅
Γ2 − i 2∆ 1 + S(2.19)=
2− iΩ *
1*⋅= ρ12 .
Γ2 + i 2∆ 1 + S(2.20)

2| Ω |22

Γ2 + 4∆ + 2 | Ω |22(iΓ2 + 2∆)Ω
2

Γ2 + 4∆ + 2 | Ω |2(−iΓ2 + 2∆ )Ω *2

Γ2 + 4∆2 + 2 | Ω |2Here the saturation factor S is given byS0| Ω |2| Ω |2 / 2
,
≡
= 2
S≡
2
2
2
2 | Γ2 / 2 − i∆ |∆ + Γ2 / 4 1 + (2∆ / Γ2 )(2.21)

where the last step defines the on-resonance saturation parameterS0 ≡2 | Ω |2
Γ2

2.

(2.22)The meanings of the saturation factor and parameter will be further explained in the next section.

2.1.3

Photon-atom scattering cross section
The photon-atom scattering cross section is a frequently used parameter to characterize the7interaction strength between photons and atoms. In general laser physics, the light scatteringcross-section σ s is defined through the following population evolution equation [22]:σ Idρ 22 = −Γ2 ρ 22 − s ( ρ 22 − ρ11 ) ,(2.23)hωdt
where I is the laser intensity and σ s I / hω is the number of photons per unit time absorbed by asingle ground-state atom or emitted from a single excited-state atom because of the laser field.
Therefore, the first term on the right side of equation (2-23) represents the spontaneous emission,and the second term represents the stimulated emission and absorption. At the steady-state
condition, equation (2.23) goes to

σ Idρ 22 = −Γ2 ρ 22 − s ( ρ 22 − ρ11 ) = 0 .
dthω(2.24)

Using the conservation condition equation (2.15), the steady-state solution is given by

σsI
σsI
Γ2
hν
hν
=
ρ 22 =.
2σ s I2σ s I
2
Γ2 +
Γ2 +
Γ2
hν
hν

(2.25)

Solving equations (2.18) and (2.25), we find the expression for σ sσs =Γ2 hν | Ω | 2
2

I (Γ2 + 4∆2 ).

(2.26)

When only spontaneous emission is considered, we have the relationship between the decay raterr

Γ21 and electric dipole element d12 =< 1 | rˆ | 2 > [23]:8π 2 d 12,
Γ21 =3ε 0 hλ32(2.27)

where ε 0 is the vacuum electric constant and λ is the transition wavelength. The Rabi frequency
defined in equation (2.3) can be rewritten asr rΩ = E ⋅ d 12 / h .

From the intensity expression I =(2.28)

1cε 0 E 2 , we get283λ3 Γ213λ3 Γ21|Ω| = I,
(2.29)=I
2πhc
4π 2 hc
where we have used h = 2πh and c is the speed of light in vacuum. Then we rewrite the cross2

section equation (2.26) asσs =3λ2 Γ21 (Γ2 / 2) 2
Γ1
=σ0
= σ 0 g N (ν ) ,2
2
2
2π Γ2 ∆ + (Γ2 / 2)4
1+ δ

(2.30)

where we use ω = 2π ν, ∆ = 2π ∆ν = 2π (ν-ν0). The on-resonance cross section isσ0 =3λ2 Γ21,2π Γ2(2.31)

the dimensionless frequency detuning is defined by

δ≡

∆
∆ν
,
=
Γ2 / 2 γ 2 / 2(2.32)and the Lorentz line-shape function is

Γ2
γ2
1
=
,
2
2
2π (ν − ν 0 ) + (γ 2 / 2) 2
∆ + (Γ2 / 2)with a natural line width γ 2 = Γ2 / 2π .
g N (ν ) =2(2.33)

To calculate the net absorption, we must take into account both the absorption andstimulated emission. From the steady-state equation (2.24), we havehωΓ2 ρ 22 = Iσ s ( ρ11 − ρ 22 ) ≡ Iσ abs ,(2.34)

where σabs is the net absorption cross section. Equation (2.34) shows the energy conservation law
that the net absorbed light power (right side of equation) equals the spontaneous emission power(left side of equation). Using the solutions (2.17) and (2.18), we express the net absorption crosssection as

σ abs = σ 0

1,
1 + δ + I / I s02(2.35)

where the on-resonance saturation intensity is

I s0 ≡

1 Γ2 πhcΓ2 hνΓ2=.
3 Γ21 λ32σ 0(2.36)As shown in equation (2.35), the laser intensity plays the same role as the frequency detuning andbroadens the effective line width. The line width broadening caused by the laser power is called
the power broadening effect [24, 25]. To separate the natural line-shape function and the power
broadening effect, equation (2.35) can be rewritten as

9σ abs = σ 0
=σ0

1
1
1
=σ0
2
1 + δ + I / I s0
1 + δ 1 + I / I s (ν )2Γ1,g N (ν )4
1 + I / I s (ν )(2.37)

where the frequency-dependent saturation intensity is

I s (ν ) = I s 0 (1 + δ 2 ) .

(2.38)The on-resonance saturation parameter defined in equation (2.22) can be expressed by laser
intensity

S0 ≡I
2 | Ω |2
=
,
2
I s0
Γ

(2.39)and the saturation factor S defined in equation (2.21) is given by

S≡

S0
I
I
=
=
.
2
2
1+ δ
I s 0 (1 + δ ) I s (ν )(2.40)As shown in equation (2.37), a large intensity I>Is0 reduces the net absorption cross-section andbroadens the line width, i.e., the absorption is saturated. This saturation comes from the saturationof the atom population in the excited state and ground state as shown in equations (2.17) and(2.18). The higher the laser intensity, the more atoms that are pumped from the ground state |1> tothe excited state |2>, and thus the fewer atoms are left for net absorption.
Now, let’s look at some examples of 87Rb transitions. When the atoms are polarized by an
external bias magnetic field, the transition from |1>=|5S1/2, F=2, MF=2> to |2>=|5P3/2, F=3,
MF=3> (λ=780 nm) is a pure closed two-state system, where Γ21 = Γ2 = 2π × 6 MHz. Its
on-resonance saturation intensity is Is0 = 1.65 mW/cm2, and its on-resonance cross section isσ 0 = 3λ2 / 2π = 0.29 µm 2 .

(2.41)

This transition is often used to image cold atom clouds in a magnetic trap because of its closed
cycle transition and large cross section.
However, if there is no external magnetic field, the atoms are nonpolarized and all Zeeman
sublevels are degenerate. One example is atoms in a magneto-optical trap (MOT). The 87Rb MOT

10cooling transition is from |1>=|5S1/2, F=2> to |2>=|5P3/2, F=3>. In this case, we average the decayrate Γ21 to the degeneracy of ground states g1 = 5. The total decay rate Γ2 is averaged over thedegeneracy of the excited states g2 = 7, with a sum of three photon-spin polarizations of the
spontaneous emission:< Γ21 >1 =and < Γ2 > 2 =1∑ Γ2i ,1 j ,g1 i , j(2.42)g1
3
Γ x 2ixj =Γ2i ,1 j = 3 1 < Γ21 >1 ,∑∑g 2 i, j ,x
g 2 i, jg2(2.43)

where x corresponds to 3 polarization freedoms and gi (i=1, 2) is the degeneracy. Then we obtaing 2 λ2< σ 0 >=.
g1 2π

(2.44)

With g1 = 5 and g2 = 7, we get the on-resonance cross section σ0 = 7λ2/10π = 0.136 µm2 and theon-resonance saturation intensity Is0 = 3.54 mW/cm2. The saturation intensity is 35.4 mW/cm2
with a red detuning ∆ = 2π × 9 MHz in our MOT configuration. Our cooling laser has a diameterof 8 mm, and we find that the additional laser power does not help to increase the atom number inthe trap if the total power is more than 30 mW. This experimental result is consistent with atheoretical saturation intensity of 35.4 mW/cm2.
Comparing the cross section equations (2.41) and (2.44), we find there is a factor of 3
difference in the on-resonance cross sections as g1 = g2. This difference is simply caused by thepolarization freedoms of spontaneous emission. For a pure two-state closed system, thespontaneous emission can take only one polarization, the same as the absorbed photons. However,in a degenerate two-state system like the MOT cooling transition, the spontaneous emission
occurs in all three polarization degrees of freedom.

2.1.4

Optical force
In laser cooling and trapping, understanding where the damping cooling and trapping forces

come from is essential. These optical forces may vary completely in different configurations.
However, there is only one fundamental physics equation.

11
From the expression (2.10), we get the force operator

rˆ
h⎡ 0
~ˆ
F = −∇H d = ⎢2 ⎣∇Ω *

∇Ω ⎤
.
0 ⎥⎦

(2.45)

The average force on an atom by the laser field can be calculated byrrˆ< F >= Tr ⎛⎜ ρˆF ⎞⎟ .
⎝ ⎠(2.46)

In general, the Rabi frequency Ω is a complex function asrˆ r r r
re(2.47)Ω(r ) = < 1 | E (r − ra ) ⋅ rˆa | 2 > ,hrwhere ra is the relative displacement from the atom. The amplitude gradient of the Rabi
frequency gives the dipole force necessary for optical traps [26–28]. The phase gradient raises theradiation pressure force in a MOT as shown in section 2.2.

2.2

Magneto-optical trap
Since the first magneto-optical trap (MOT) was demonstrated in 1987 [29], the MOT has

become the most widely used trap for neutral atoms. In most BEC experiments, the MOT is used
for initial cooling and trapping to capture a large number of atoms with a temperature range of
10–1000 µK. Then the precooled atoms are transferred into a magnetic or optical trap for
evaporative cooling. The MOT is a very robust trap that does not require very precise opticalalignment. In the MOT, the radiation interaction between atoms and photons provides bothcooling and trapping. The Doppler frequency shift results in an optical molasses to cool atoms [30,31], and the frequency modulation from inhomogeneous magnetic fields produces a restoration
force to trap atoms [29]. In our atom-chip system, the magnetic field gradients are modest and canreadily be achieved with simple coils and atom-chip wires.

2.2.1

Optical molasses
First, we look at the atoms in a plane wave optical field that propagates along the z

direction. The complex electric field and Rabi frequency are represented by

12

r r
r
E (r ) = E 0 e −ikz ,(2.48)Ω( z ) = Ω 0 e − ikz ,(2.49)

where

Ω0 =

r r
e
< 1 | E0 ⋅ r | 2 > .
h(2.50)

Then the Hamiltonian in equation (2.10) can be expressed as⎡ 0~ˆ
H d = h⎢ 1 *
⎣2 Ω

⎡ 0
Ω⎤
= h ⎢ 1 * ikz⎥− ∆⎦⎣ 2 Ω0 e
12

12Ω 0 e − ikz ⎤⎥.
−∆ ⎦(2.51)

From equation (2.45), we derive the force operator

ikΩ⎤
h⎡ 0
∂
Fˆ = − Hˆ d = ⎢
*
0 ⎥⎦
∂z
2 ⎣− ikΩ(2.52)and its average expected value)
F =< Fˆ >= Tr ( ρˆF ) = hk Im{ρ12 Ω * } .

(2.53)

From equations (2.18) and (2.19), we getIm{ρ12 Ω * } =Γ2 | Ω | 22

Γ2 + 4∆2 + 2 | Ω | 2= Γ2 ρ 22 ≡ γ p ,(2.54)

where γp is defined as the pumping rate. Then the force is expressed by

F = hkγ p = hkρ 22 Γ2 =2

hkΓ2 | Ω | 2

Γ2 + 4∆2 + 2 | Ω |

=
2

hkΓ2
2

S0
⎛ ∆ ⎞
⎟⎟
1 + S 0 + ⎜⎜
Γ
/
2
⎝ 2 ⎠

2

.

(2.55)

From equation (2.34) under the steady-state condition, equation (2.55) can be rewritten as

F = hkIσ s ( ρ11 − ρ 22 )= hk × net absorbed photon # per unit time
hω

2.56)

The physics of equation (2.56) is very clear: the force comes from momentum transferred fromthe net absorbed photons.
A one-dimensional(1D)

opticalmolasses

(OM)

can

be

producedbytwocounter-propagating laser beams with red frequency detuning, i.e., ∆ = -|∆| < 0. For atoms moving
along the z direction with a velocity v, there is a Doppler shift in the frequency in the atom’s
moving reference frame:∆ → ∆ m kv (to the ±z propagating beam).

(2.57)

13
The expression (2.57) gives the forces from the two individual laser beams

F± = ±hkΓ
2

S0⎛ ∆ m kv ⎞1 + S0 + ⎜⎟⎝ Γ/2 ⎠

2,

(2.58)

where ± represents beam propagating directions. The net damping force from the optical molasses
can be written by:

FOM = F+ + F− ≅ − βv ,(2.59)

where the damping coefficient is

dFOM
4hk 2 S 0 (2 | ∆ | / Γ)β ≡−.
|v =0 =
dv
(1 + S 0 + (2∆ / Γ) 2 )2

(2.60)

The 1D model can be easily extended to a 3D case with three pairs of laser beams.

2.2.2

MOT configurations
The damping force of the optical molasses provides a Doppler cooling mechanism.

However, to trap atoms, there must be a position-dependant restoration force. This restoration
force can be obtained by adding a position-dependant frequency modulation into the Doppler shift
in equations (2.57) in the following way:

∆ → ∆ m kv m ξz (±z propagation beam).

(2.61)

Then the force equation (2.58) can be corrected to become:

F± = ±hkΓ
2

S0⎛ ∆ m kv m ξz ⎞1 + S0 + ⎜⎟⎝ Γ/2 ⎠

2.

(2.62)The net force from the two counter-propagating beams becomes

FMOT = F+ + F− =≅ − βv − Kz ,(2.63)

where

K ≡−

∂FMOT
ξ
| v =0, z =0 = β .
k∂z(2.64)In a MOT, as described later, the position-dependant frequency modulations shown inequations (2.61) are accomplished with different circular polarizations in a quadruple magnetic

14
field.

2.2.2.1 Standard six-beam MOT
A standard six-beam MOT configuration is shown in figure 2.3. It consists of ananti-Helmhotz coil pair and six red-detuned laser beams [29]. As discussed previously, the six
red-detuned laser beams and the quadrupole magnetic field provide three-dimensional opticalmolasses cooling and trapping. As shown in figure 2.3(b), the Zeeman energy level splitting andcrossing in the quadrupole magnetic field meet the requirements of equation (2.61) for two
counter-propagating laser beams with σ+ and σ- polarizations. The position-dependant radiation
optical force provides a restoration-trapping force toward the coil center, i.e., the atoms at adisplacement x>0 (or x<0) absorb more light from the σ+ (or σ-) beam such that they get a net
force toward the origin.

(a)(b)
Figure 2.3: A standard six-beam MOT setup. (a) Field configuration. (b) Energy level splitting andcrossing due to the Zeeman effect at a linear magnetic field. |g> is the ground states. M is themagnetic momentum quantum number.

2.2.2.2 Mirror MOT
There is a reflection symmetry in the standard six-beam MOT geometry. As shown in figure
2.4 where we rotate the system by 45 o for convenience, the atoms do not experience any
difference in the magneto-optical field if the two upper laser beams [figure 2.4(a)] are replaced

15
with a mirror [figure 2.4(b)]. The MOT configuration with a mirror is called a mirror MOT [6]and requires only four laser beams. The mirror MOT does not only reduce the number of laser
beams, but also prepares the cold atoms on the mirror surface for atom-chip loading.

(a)

(b)
Figure 2.4: A Mirror MOT configuration (b) vs a standard six-beam MOT (a)2.2.2.3 Chip U-wire surface MOT
The anti-Helmholtz coil is not the only way to produce the quadrupole magnetic field for a
MOT. In the mirror-MOT configuration, the 45 o MOT coils can be replaced by a U-shaped wireon the back of the mirror, as shown in figure 2.5. The U-wire current and a y-bias magnetic fieldcreate a three-dimensional quadrupole magnetic field below the wire [32]. The beauty of thisU-wire is that we can integrate it into an atom-chip.
The U-wire dimension in our BEC atom chip has L = 0.8 mm and d = 200 µm. With the16current IU = 2 A and y-bias field By = 1 G, we create a chip MOT at 1 mm below the chip surface.
With the integrated U-wire chip MOT, it is possible to precisely move atoms to the location of an
atom-chip micro trap (section 2.3).
Wire currentdLFigure 2.5: A chip U-wire surface MOT configuration.

2.2.3

Capture velocity
The capture velocity is defined as the maximum velocity that can be cooled and trapped by

the MOT. It is not obvious how to determine the capture velocity because it is influenced by manyfactors such as beam alignment and laser power. Here a very simple one-dimensional model isprovided to estimate the order of the capture velocity.
The maximum force can be calculated from equation (2.55) in a saturation case:

Fmax = hkγ p max = hkΓρ ee max = hkΓ / 2 .

(2.65)

Then the average force can be estimated as

Fav ≈ Fmax / 2 = hkΓ / 4 .

(2.66)We then consider the energy conservation:

1
1
2
mv c = Fav L = hkΓL ,2
4
where L is the optical molasses dimension size. The capture velocity vc is determined by(2.67)

17

vc ≅

hkΓL
.
2m

(2.68)

Equation (2.68) gives the maximum possible capture velocity in a MOT saturated by laser power.
A more precise capture range can be obtained by Monte-Carlo simulations.

2.2.4

Capture volume
One of the big issues in designing a MOT system is the capture volume. The atom number

N in a MOT depends on the capture dimension size L [33]:N ∝ L4 .

(2.69)The ultimate limit of the capture volume comes from level crossing of cooling excited states andtheir neighbor hyperfine structures. For 87Rb, the cooling transition is from |5S1/2, F=2> to |5P1/2,
F=3>. As shown in figure 2.6, the level |F=3, MF=-3> crosses with |F=2, MF=2> at x=L if we stilltake the picture of figure 2.3(b). To keep the Zeeman splitting in figure 2.3(b) valid, the L, i.e., themaximum MOT capture dimension, is decided by:

L=

∆E
,
( Fg F + F ′g ′F ) µ B B ′(2.70)

where ∆E is the hyperfine energy splitting between F=3 and F'=2, g F is the landau factor, µB is

EnergyF=3, g F =3/2

∆E
F'=2, g F '=3/2
Lx

Figure 2.6: Zeeman splitting and level crossing of 87Rb 5P3/2 states F=3 and F=2
due to a linear magnetic field B(x)=B'x.

18
the Bohr magneton, and B' is the magnetic field gradient. For 87Rb F=3 and F'=2 states, ∆E = 267
MHz, g F µ B = g ′F µ B = 0.93 MHz/G. For a typical field with B' = 10 G/cm, L = 5.74 cm. For a
big chamber MOT system, whose capture volume is mostly limited by laser beam size, equation(2.70) can be used to optimize the magnetic field gradient.
A standard six-beam MOT and mirror MOT with external coils typically have large capture
volume, limited only by the laser beam sizes. “For a beam diameter of <2 cm, 10-G/cm gradientand detuning of 10–15 MHz yield the most trapped atoms. For larger beams, however, larger
detunings and smaller gradients trap the largest number of atoms. [33]” The capture volume of a
U-wire MOT is limited by the U-wire dimensions.

2.2.5

Loading equation

The MOT loading can be described by the following equationrdN
N= R − − β ∫ n 2 (r )d 3 r .
τdt(2.71)

The first term R on the right side is the loading rate, defined as the number of atoms per
second entering the trap volume V with low enough velocities (v<vc) to be captured. It is afunction of trap volume V, capture velocity vc, trappable atom partial pressure Patom, andtemperature T [34]:

P
m ⎞
4⎛
⎟⎟
R ≅ atom V 2 / 3 vc ⎜⎜
2K BT
2
K
T
B
⎝
⎠

3/ 2

.

(2.72)The second and third terms of the left side of equation (2.71) are the losses caused byelastic collisions between trapped atoms and background atoms and light-assisted inelastic
collisions between trapped atoms [35]. For typical MOT systems, the loss rate from the trap, i.e.,
1/τ, is primarily limited by the elastic collisions between trapped atoms and background gases:

1/τ =3K B T
nσ =
m

3Pσ

.

mK B T

Therefore, we ignore the third term in equation (2.71) and get(2.73)

19dN
N= R− .
τdt(2.74)For Rb atoms with average atomic mass 85.4678 and atomic radius 2.98 Å, the collisioncross section can be estimated by

σ = π (2rRb ) 2 = 4πrRb2 = 1.12 × 10 −18 m 2 .

(2.75)

This leads to

mK BT

P=

3τσ

9.44 × 10 −8=
torr ,
τ / sec ond(2.76)

which has the same order as the experimental formula [36]:Pexp ≈

3 × 10 −8
torrτ / sec ond.

(2.77)The steady-state atom number Ns is then given by

P V 2 / 3 vc
N s = Rτ = atom
P
6σ

4

2

⎛ m ⎞
⎜⎜
⎟⎟ .
2
K
T
B
⎝
⎠

(2.78)

The atom number in an 87Rb MOT is determined by the ratio of the 87Rb partial pressure to thetotal pressure. At very low pressure, non-87Rb atoms in vacuum are not negligible; thus the total
number in the MOT increases with increasing 87Rb pressure. The MOT atom number getssaturated as Patom→P.

2.2.6

Polarization gradient cooling
Unfortunately, Doppler cooling can not cool atoms below the limit

TD ≡ hΓ / 2 K B(2.79)

resulting from heating of the discrete size of the momentum steps the atoms undergo with each
emission or absorption in a two-state system [19]. To overcome the Doppler cooling limit, wemust use non-Doppler mechanisms. Polarization gradient cooling (PGC) with σ+ and σconfiguration is one such sub-Doppler cooling technique [37].
Using 87Rb cooling transition from |F=2> to |F=3> as an example, the PGC coolingschematic diagram is shown in figure 2.7. The two laser beams are red-detuned for the atoms at

20rest (v=0) [figure 2.7(b)]. The atoms moving toward the σ+ beam, i.e., v>0, see different
frequency shifts to the σ+ and σ- beams. Thus there are more atoms in the MF=+2 state than
MF=-2 state because of the optical pumping effect [figure 2.7(c)]. This population difference
makes atoms absorbing more photons from the σ+ beam than the σ- beam, resulting in a net
damping force along the σ+ propagation, i.e., F<0. In a similar way, the atoms moving with v<0
get a net force F>0 [figure 2.7(d)]. Therefore, the atoms feel a damping force opposite to theirmotion depending on the differential scattering of light from the two laser beams. This damping
force is able to cool atoms below the Doppler limit because it is caused by the population
imbalance of ground-state Zeeman sub levels rather than a Doppler shift.

σ-

σ+

σ+

σ-

σ-

σ+

Figure 2.7: One-dimensional schematic diagram of polarization gradient cooling. (a) Two
counter-propagating laser beams with σ+ and σ- polarizations and an atom moving with velocity v.
(b) v=0, F=0 for rest atoms. (c)v>0, F<0 for atoms moving toward the σ+ beam. (c)v<0, F>0 for
atoms moving toward the σ- beam.

21

2.3

Atom-chip magnetic trap
Magnetic trapping of neutral atoms [38] has been proven to be an efficient way to trap andcompress precooled atoms for BEC production and manipulation. Moreover, integration ofmagnetic traps and wave guides with a microfabricated wire substrate surface, i.e., atom chip,provides a new way to make and manipulate cold atom optics [5–9, 14, 15, 32].

r

A magnetic trap makes use of the interaction between the magnetic moment µ of ar rneutral atom and external magnetic field B (r ) asrr r r
U (r ) = − µ ⋅ B (r ) .

(2.80)For an atom trapped in a pure Zeeman sublevel |F, MF>, the potential can be rewritten as

r
r r r
r
U (r ) = − µ ⋅ B (r ) = M F g F µ B B(r ) ,(2.81)
where g F and µ B are the Lande g-factor and Bohr magneton, respectively. Depending on thesign of g F MF, atoms are trapped to either the maximum ( g F MF<0, strong-field-seeking state)or the minimum ( g F MF>0, weak-field-seeking state) of the field magnitude. Since there is no
maximum point of magnetic-field magnitude allowed in free space [39, 99], a stable magnetic trap
must work with weak-field-seeking state atoms. The two lowest-order magnetic traps arequadrupole [38] and Ioffe-Pritchard (IP) traps [40, 41]. The quadrupole trap is a linear (first-order)
potential trap that has a zero crossing of the magnetic field; The IP (second-order, i.e., harmonic)
trap has a non-zero minimum.
Quadrupole linear traps offer very tight three dimensional confinements. Unfortunately,
atoms entering the zero magnetic-field crossing get “confused” about the direction of the field thatthey follow. The zero magnetic-field crossing results in a trap loss due to spin flips, i.e., Majorana
flops.
The most commonly used magnetic traps for BEC experiments have become IP traps thatavoid spin flip loss at the trap center. As we know in both classical and quantum mechanics, theatoms’ magnetic moment adiabatically follows the direction of the magnetic field if the directionof the field changes slowly enough, i.e.,

22

ω=

r
dθ
<< ω L = g F µ B | B | h ,dt(2.82)

where ω is the trap frequency and ωL is the Larmor precession frequency.

rr

Applying Maxwell’s equations ( ∇ ⋅ B = 0 , ∇ × B = 0 ), an IP type trap magnetic field withaxial symmetry can be expressed by [42]″′⎡⎤( B⊥ − 12 B z z ) x
⎢
⎥
r
′
″
⎥
B=⎢
− ( B⊥ + 12 B z z ) y⎢⎥″ 2 1 ″ 22
1⎢⎣ B z 0 + 2 B z z − 4 B z ( x + y )⎥⎦
− xz
⎤
⎡ x ⎤
⎡0 ⎤
″⎡
′ ⎢ ⎥ Bz ⎢
⎥,
⎥
⎢
− yz
= B z 0 ⎢0 ⎥ + B ⊥ ⎢ − y ⎥ +⎢⎥2⎢⎣ z 2 − 12 ( x 2 + y 2 )⎥⎦⎢⎣ 0 ⎥⎦⎢⎣1⎥⎦(2.83)

where the z-axis is the longitudal symmetry axis and the x-y plane is the transverse plane. Aroundthe trap center,1″″
B ≅ B z 0 + ⎛⎜ B ρ ρ 2 + B z z 2 ⎞⎟ ,⎠2⎝

(2.84)

where

Bρ

2.3.1

″

′2
″
B⊥
Bz
≡
−
.
2
Bz 0

(2.85)

Chip wire micro trap
An atom chip uses its lithographically fabricated circuit patterns to generate magnetic traps

on its substrate surface. An atom chip has two major advantages over the traditional coil setup: (1)Very tight confinements on the chip surface, where atoms are very close to the micro wires, canbe achieved with low current of several A; (2) Many different types of traps, e.g., waveguides,
beam splitters, and interferometers, can be integrated into a small scale chip. The first advantage
results directly from the fact that the magnetic field gradient scales as 1/r2 where r is the distancefrom a wire. In a coil system, typically r is >1 cm and it requires many turns and a large current(>100 A). However, on an atom chip, the distance from a trap to the chip surface can be easily

23
reduced down to <100 µm and only a very low current (~1 A) is required to create a much tighter
trap that dramatically reduces the evaporation time (Section 2.6) to BEC. The second advantage
holds the key to developing practical cold atom small-scale sensors in the future. The
disadvantage of an atom chip is the small capture volume that requires care in loading atoms onto
the chip. Atoms in an atom-chip micro trap are also more sensitive to current noise than those infree space [43, 44].

zyFigure 2.8: A two-dimensional quadrupole magnetic field generated by a single current wireaugmented with a uniform transverse bias magnetic field.
This section reviews the principle of atom-chip wire traps, and two basic atom-chip-trapwire structures, i.e., the U-wire magnetic trap (UMT) and Z-wire magnetic trap (ZMT) [32].
As shown in figure 2.8, a two-dimensional quadrupole magnetic field is produced below asingle wire of current I with a bias magnetic field Bbias perpendicular to the current. The totalmagnetic field can be expressed by

r r
r
r
µ I
B = Bwire + Bbias = 0 ( ρˆ × xˆ ) + Bbias ,2πρ
22where ρ = y + z 2 . The fields are canceled atµ I
z0 = − 0 ,2πBbias(2.86)(2.87)

24
where the field gradient isrrrr
d | Bwire + Bbias |d | Bwire |
µ I
d |B|
B⊥ =
=
=
= 0 2
dρ z0
dρ
dρ z0 2πz 0
z0

′

=

Bbias
| z0 |=

2π Bbias.
µ0 I(2.88)(2.89)
2(2.90)

Figure 2.9: U-wire, Z-wire magnetic-trap configurations and potential plots.
Depending how the wire is bent, a single wire in a U shape can create a three-dimensional
quadrupole trap, and a Z-shaped wire can create an IP type trap, as shown in figure 2.9. The
two-dimensional quadrupole field is produced by the x-directional current and the y-directional
bias field. In the U-wire, the two opposite currents along the y direction cancel each other at thetrap center. This results in a three-dimensional quadrupole trap that has a zero-field crossing point.
In the Z-wire configuration, the two y-directional currents are in the same sign and provide an
x-directional field minimum at the trap center. We discuss only the Z-wire trap in detail here
because the IP type trap without spin-flip loss is a better candidate for making a BEC on chip.

25
A typical Z-wire Magnetic Trap (ZMT) is shown in figure 2.10, where I is the wire currentrand B yBias is the y-directional external bias field. We find that the symmetry axis of the trap is notexactly along the x direction. As shown in figure 2.10 (c), at the trap center (0, 0, z0) the magnetic
field is really along the x direction because of canceling of the z-directional fields. However,considering some offset from the trap center (x, 0, z0), the z-directional fields do not cancel
completely and the magnetic field does not point along the x direction any more. As shown later,
this position-dependent z-directional field rotates the IP trap slow axis through an angle θ with tothe x direction as shown in figure 2.10(a). Knowing what the symmetry axis is and in which
direction it points are important to calculate the trap frequencies.

r
ByBiasr
ByBiasFigure 2.10: A Z-wire magnetic trap. The trap center lies at (0, 0, z0).

First, we look at the magnetic field produced by two half-infinite y-directional wires [figure2.10(c)]:r⎤)| z0 || z0 |
1 µ0 I ⎡Ba = −
x
+
⎢
2
2
2
2 ⎥
2 2π ⎣ ( L / 2 + x) + z 0 ( L / 2 − x) + z 0 ⎦−⎤)L/2+ xL/2− x1 µ0 I ⎡
z.
−
⎢
2
2
2
2 ⎥
2 2π ⎣ ( L / 2 + x) + z 0 ( L / 2 − x) + z 0 ⎦(2.91)The tilted angle θ can be obtained from expression (2.91) combined with the y bias field. The
z-directional field of equation (2.91) can be expressed by

26

Baz = −⎤
µ0 I ⎡
L/2+ xL/2− x
−
⎢
2
2
2
2 ⎥
4π ⎣ ( L / 2 + x) + z 0 ( L / 2 − x) + z 0 ⎦µ 0 I ( L / 2) 2 − z 02x.
≅
2π [( L / 2) 2 + z 02 ]2(2.92)

r≈z0

r
Baz

r
Be

α

r
Be
α

Δy

r
B yBiasFigure 2.11: The transverse quadrupole two-dimensional trap center offset due
to the z-directional bias field induced by the two y-directional wires.

As shown in figure 2.11, the transverse two-dimensional quadrupole trap center offset Δy due tothis z-directional field can be obtained by ( Baz << B yBias )∆y ≅| z 0 | sin α ≅| z 0 | α ≅| z 0 |Bazµ I ( L / 2) 2 − z 02 | z 0 | x= 0.
B yBias2π ( L / 2) 2 + z 02 2 B yBias[](2.93)The tilted angle θ of the slow axis [figure 2.10 (a)] then can be calculated by:θ≅∆y µ 0 I ( L / 2) 2 − z 02 | z 0 |=.
x
2π ( L / 2) 2 + z 02 2 B yBias[](2.94)For z0<<L/2, i.e., the trap is very close to the chip surface, equation (2.94) then goes toL/2θ ⎯z⎯<<⎯
⎯→
0

2
2
z0
z0
µ0 I 1
µ0 I
z0
1
1
B
=
=
yBias
2π ( L / 2) 2 B yBias 2πz 0 ( L / 2) 2 B yBias( L / 2) 2 B yBias
2⎛ z ⎞=⎜ 0 ⎟ .
⎝ L/2⎠(2.95)

When θ is a very small angle, we can use the x-directional component of expression (2.91) toestimate the longitudinal trap frequency. From27

Bax = −⎤
µ0 I ⎡| z0 || z0 |
+
⎢
2
2
2
2 ⎥
4π ⎣ ( L / 2 + x) + z 0 ( L / 2 − x) + z 0 ⎦(2.96)[]z 02
8 z 02 3( L / 2) 2 − z 02 2
1
≅ − B yBias− B yBiasx ,3( L / 2) 2 + z 02 2
( L / 2) 2 + z 02[]

(2.97)

we getz 02
B0 = B yBias, and( L / 2) 2 + z 02′′
BLongitudnial = B yBias(2.98)[

8 z 02 3( L / 2) 2 − z 02[( L / 2) + z ]
2

2 3

].

(2.99)

0

In the transverse x-y plane, we have

B yBias′ µ I
B⊥ = 0 2 =and| z0 |
2πz 0(2.100)[]′ 2 B ′′⎛ ( L / 2) 2 + z 2 4 z 2 3( L / 2) 2 − z 2 ⎞Longitudinal″ (B )0 ⎟0Bρ = ⊥−= B yBias ⎜
− 0
.
4
3
2
2
⎜
⎟
2
B0
z
(
L
/
2
)
z
+
0
0
⎝
⎠

[

]

(2.101)

For a trap very close to the surface, i.e., z0<<L/2, the above expressions can be simplified to
0 << L / 2
B0 ⎯z⎯⎯⎯→ B yBias

z 02,( L / 2) 2

z 0 << L / 2′′
Blongitudin⎯→ B yBias
al ⎯⎯ ⎯

Bρ″

(2.102)24 z 02, and( L / 2) 4

⎛ ( L / 2) 2
12 z 02 ⎞⎟.
⎜⎯⎯ ⎯⎯→ B yBias ⎜
−
4 ⎟
4
z
(
L
/
2
)
0
⎠
⎝
z0 << L / 2(2.103)(2.104)

The trap frequencies areω longitudin al =

ωρ =

′′
g F M F µ B B Longitudinalm

g F M F µ B Bρ′′
m

.

and

(2.105)(2.106)

Now let’s design a Z-wire trap that can load atoms directly from a surface MOT with atemperature T and position z0 below the chip. To reduce the trap loss caused by the finite trap
depth, we require that the ZMT trap depth is α times higher than the cloud temperature, i.e.,∆U ≅ M F g F µ B B ybias ≥ αK B T ,(2.107)

28

or

B ybias ≥αK B T.
M F gF µB(2.108)On the other hand, the magnetic field gradient force toward the chip must be larger than thegravity force that pulls atoms down:

M F g F µ B B ′ ≥ mg .

(2.109)Inserting formula (2.89) into the above equation, we get

M F gF µB

B ybias≥ mg| z0 |
mg | z 0 |.
or B ybias ≥M F gF µB(2.110)(2.111)

Combining equations (2.108) and (2.111), we get the requirement for the y-bias field

B ybias ≥ B ybias min =Max{αK B T , mg | z 0 |}.
M F gF µB(2.112)

Then using equation (2.90), we get the current requirement

I=

2π

µ0

B yBias | z 0 |≥2πµ0

B yBias min | z 0 |= I min .

(2.113)

To obtain a minimum field magnitude point at the trap center, equations (2.97) and (2.99) require
that:

′′
BLongitudnial = B yBias[

8 z 02 3( L / 2) 2 − z 02[( L / 2) + z ]
2

2 3

]≥ 0

(2.114)0orL ≥ Lmin = 2 | z 0 | .

(2.115)

However, from equation (2.103), a longer L results in a looser confinement in the slow axis whenatoms are compressed toward the chip surface. On one hand, we like to have a larger Z size, i.e.,
longer L, to simplify the loading procedure because it is not easy to bring an external MOT close
to the surface. On the other hand, we prefer the smaller Z size to get very tight confinement forforced evaporative cooling. There are several solutions to this problem. The first solution is tohave two ZMTs of different sizes and adiabatically transfer atoms from the bigger ZMT to thesmaller ZMT after initial loading. In our atom chip, we have demonstrated that we are able to
make BEC on a chip with a single Z wire of L = 2 mm by using a U-wire MOT to move atoms

29very close the surface (|z0| = 500–800 µm) before loading into the ZMT.
For typical parameters, such as T = 30 µk, z0 = -1 mm and α = 20 for 87Rb in the state |5S1/2,
F=2, MF=2> ( g F = 1/2 and M F g F µ B /KB = 67.2 µk/G), we can solve equations (2.112),(a)Figure 2.12: Z-wire magnetic
traps. (a) The central part of
the atom-chip design. The
black wire labeled withcurrent IZ is the Z-wire. The
thickness of the wire on an
AlN substrate is about 10µm. (b) B-field cross section
plots. The red curve is theinitial trap: IZ = 4 A, biasrfield Bbias = (0, 14, 0) G, trap
frequency 2πω = (36, 215,
215) Hz, and trap position
from the surface z0 = -500
µm. The green curve is theintermediate trap during thecompression: IZ = 4 A, biasrfield Bbias = (-4, 60, 0) G,
trap frequency 2πω = (30,
2500, 2500) Hz, and trap
position from the surface z0 =-120 µm. The black curve isthe final trap: IZ = 2.75 A,rbias field Bbias = (-4, 60, 0)
G, trap frequency 2πω = (23,3600, 3600) Hz, and trap
position from the surface z0 =-82 µm. The calculation
takes into account the wire
width.

(b)30(2.113) and (2.114) to get Bybiasmin=9 G, Imin=4.5 A, and Lmin= 2|z0|=2 mm. In the real chip, we
make copper wire patterns on an AlN aubstrate with L=2 mm, wire width w=100 µm, andthickness d=10 µm. This Z wire can take 4 A for at least 4 minutes before it breaks.
Figure 2.12 shows the dimensions of the Z wire in our atom chip and its potential plots.
High trap frequencies (23, 3600, 3600) Hz are obtained with only IZ=2.75 A and Bbias=(-4, 60, 0)
G. A traditional coil BEC system can only achieve <1000 Hz with a current >100 A. As shown inchapter 7, we have achieved BEC in this compressed ZMT with only about a 4 s RF evaporation.

2.4

Adiabatic compression
In a lifetime-limited atom trap, a fast and efficient forced evaporative cooling toward BEC

requires a high collision rate for rethermalization. Adiabatic compression of a magnetic trap
allows an increase in the atom elastic collision rate by several orders of magnitude while
maintaining the phase-space density (PSD). This section derives the conditions for adiabatic
compression in a magnetic trap, and describes how the compression affects physics quantities, e.g.,temperature, collision rate, and PSD.
For an ideal gas, we have the state equation

PV = NK B T(2.116)

and work-energy conservation for an adiabatic compression− PdV = CdT ,(2.117)

where P is the pressure, V is the volume, N is the total atom number, KB is the Boltzman constant,
T is the temperature, and C = 3 NK B / 2 is the heat capacity. From equations (2.116) and(2.117), we get

NK B

dP
dT
,
= (C + NK B )P
T(2.118)with the solution given by

T = APorNK B
C + NK B

2= AP 5(2.119)31
2⎛ Pf ⎞ 5= ⎜⎜ ⎟⎟ .
Ti ⎝ Pi ⎠Tf(2.120)Using the state equation (2.116) and equation (2.119), we obtain
2

V =

3

−1
−
NK B T= ANK B P 5 = ANK B P 5 .
P(2.121)

Solving equations (2.119) and (2.121), we express the volume V with the temperature as follows:
52

V = A NK B T

−

3
2

∝T

−

3
2

.

(2.122)The collision rate isγ = nσv =N
σv ∝ V −1v ∝ T 3 / 2T 1 / 2 = T 2 ,V(2.123)where n=N/V is the atom number density, σ is the elastic collision rate, and v is the
root-mean-square (RMS) thermal speed. The PSD stays constant

PSD = nλT ∝ T 3 / 2T -3/2 = 1 =constant,3(2.124)

where the thermal wavelength is defined byλT ≡h2πmK B T.

(2.125)

Duing the adiabatic compression, the collision rate increases because of increasing density
and temperature due to the external work, but the PSD stays constant. The general equations(2.119)–(2.124) work for all types of trapped noninteracting atom-gas systems.

2.4.1

Linear trap
A three-dimensional linear trap potential can be described asr
U (r ) = β1 x1 + β 2 x 2 + β 3 x3 ,(2.126)

where xi (i=1, 2, 3) are coordinates, and βi (i=1, 2, 3) are potential gradients. At the thermal
equilibrium, each dimension has equal potential energy, i.e.,

1
1/ 3
1/ 3
K B T = β i Li = (β 1 β 2 β 3 L1 L2 L3 ) = (β 1 β 2 β 3V )2orT ∝ (β1 β 2 β 3V ) ,1/ 3(2.127)(2.128)where Li (i=1, 2, 3) are effective trap dimension sizes and V is the effective volume. Solving
equations (2.128) and (2.122), we get32

T ∝ (β x β y β z ) 2 / 9 ,
Li ∝

T

= βi

−7 / 9(2.129)β j 2 / 9 β k 2 / 9 , and the collision rateβiγ ∝ T 2 ∝ (β x β y β z ) 4 / 9 .
2.4.2(2.130)(2.131)

Harmonic trap

A three-dimensional harmonic trap potential can be described as

r
1
1
1
2
2
2
2
2
2
U (r ) = mω1 x1 + mω 2 x 2 + mω 3 x3 ,22
2

(2.132)where ωi (i=1, 2, 3) are trap frequencies. Following the same procedure as in section 2.4.1, we get
the following results:1

T ∝ (ω1 f ω 2 f ω 3 f ) 3

and(2.133)23γ ∝ (ω1 f ω 2 f ω 3 f ) .
2.4.3(2.134)Atom-chip Z-wire trap

As discussed in section 2.3, the atom-chip Z-wire trap is an IP type trap. When atoms arevery cold and most of them sit on the bottom of the trap, they see a three-dimensional harmonic
trap. However, when atoms are thermally hot, i.e., >100 µK, most atoms experience a
two-dimensional linear trap potential in the transverse plane and one-dimensional harmonic
potential along the slow axis. In this region, the potential can be described byr
1
2
2
U (r ) = mω1 x1 + β 2 x 2 + β 3 x3 .
2(2.135)The trap dimensions are

L1 ∝T 1/ 2

ω1, L2 ∝

V = L1 L2 L3 ∝T

β2

, L3 ∝

T 5/ 2ω1 β 2 β 3

.

T

β3

and

(2.136)(2.137)

Solving (2.137) and (2.122) we get

T ∝ (ω1 β 2 β 3 )1 / 4(2.138)and the following:

L1 ∝ ω1−7 / 8β 2 1 / 8 β 31 / 8 ,(2.139)33

β 31 / 4 , L3 ∝ ω11 / 4 β 21 / 4 β 3 −3 / 4 andγ ∝ T 2 ∝ (ω1 β 2 β 3 )1 / 2 .
L2 ∝ ω1 β 2
1/ 4

2.4.4

−3 / 4(2.140)(2.141)

Adiabatic requirement

We have derived many results from the adiabatic compression, but not touched one question:
what compression can be called an adiabatic compression? What’s the requirement to make anadiabatic compression in a magnetic trap? This section uses a spherical harmonic trap as an
example to derive the adiabatic condition requirement. The result can be easily extended tonon-spherical cases and other type traps.
In a spherical harmonic trap with an initial trap frequency ω0, its trap frequency ω increases
during the compression. The adiabatic condition means that the atoms do not feel the smallchange of potential because they move much faster than the compression speed, i.e., the velocitychange caused by the compression is far less than the velocity itself so that the modification of thecompression is very small. In this case, the atoms can follow the slow change of compression andfit themselves to a compressed trap. We require that the change of the trap size be less than the
average atom velocitydL<< v .
dt(2.142)

From equations (2.122) and (2.133), we get

L =V

1/ 3

⎛T ⎞
= L0 ⎜⎜ ⎟⎟⎝ T0 ⎠−1 / 2⎛ω ⎞= L0 ⎜⎜ ⎟⎟⎝ ω0 ⎠−1 / 2(2.143)and the mean velocity⎛ω ⎞v = v0 ⎜⎜ ⎟⎟⎝ ω0 ⎠

1/ 2.

(2.144)

Then inserting equations (2.143) and (2.144) into equation (2.142), we get

and

dω
1
−1 / 2
1/ 2
L0 ω 0 ω − 3 / 2<< v0ω 0 ω 1 / 2
dt
2(2.145)vdω<< 2 0 ω 2 .
dt
L0ω 0

(2.146)Using the fact thatv 0 = a 0ω 0 =1
L0ω 0 ,
2

(2.147)

34
equation (2.146) becomes [45]:dω<< ω 2 .
dt(2.148)Equation (2.148) can be used to design an adiabatic compression by solving the following
equation:dω= ηω 2dt(η<<1).

(2.149)The solution isω (t ) =ω0.
1 − ηω 0 t(2.150)An interesting aspect of equation (2.150) is that it takes a finite time tm to compress the trap to an
infinitely tight trap (ω→∞):

tm =

1

ηω 0

.

(2.151)For example, if we start a trap from ω0=100 Hz and require η=0.1, it takes less than tm=100 ms tofinish the adiabatic compression.

2.5

Trap-depth-dependent lifetime
Atom-trap lifetime is always limited by background room temperature gas collisions due tothe shallow trap depth. In Section 2.2.5, we briefly discussed background collision-caused trap
loss by assuming that the collision cross section was constant and the collision loss rate could be
simply expressed by

γ = nv σ eff ,(2.152)

Where n is the background vapor gas density, v is the average speed of background thermal
atoms, and σ eff is the effective collision cross section for an atom in the vapor to eject a trapped
atom. However, this situation does not always hold true in real systems. When a vapor gas atom
collides with a trapped atom, some kinetic energy is transferred to the trapped atom; it escapes if
this transferred energy is larger than the trap depth. Since atoms are not hard spheres but diffuse
objects with long interactions, the effective collision cross section to transfer a small amount of

35
energy is bigger than the cross section to transfer a large amount of energy. This means that theeffective collision cross section and the collision loss rate weakly depend on the trap depth. This
explains why we observe differences in the Mirror MOT, Chip MOT and Z-wire magnetic trap
lifetimes, as well as other early experiments [34, 46].
It can be proven that with an atom-atom interaction potential of

U (r ) = C n / r n ,(2.153)the collision loss rate γ depends on the trap depth U0 [47]γ ∝ U 0 −1 / n .

(2.154)

With a typical potential of n=5 [47], we have

τ = 1 / γ ∝ U 01 / 5 .

(2.155)In our atom chip system, we measure the difference between the Z-wire magnetic trap andexternal coil mirror MOT lifetimes by varying the background pressure. From theoretical
calculation, the Z-wire trap and mirror MOT have trap depths of 3 mK and 1 K, respectively. The
experimental data in figure 2.13 show a factor of 2.77 difference between the

mirror MOT and

the Z-wire magnetic trap loss rates. This result is consistent with the theoretical expectation of 3.2= (1 K / 3 mK)1/5.

Figure 2.13: The Z-wire trap loss rate vs the mirror MOT loss rate at different vacuum level.

36

2.6

Forced evaporative cooling
Evaporative cooling is neither a new idea nor a physics patent, but always part of our daily

life. For thousands of years, people have used this technology to cool boiled water. Just as
high-temperature molecules escape from hot water so that the remaining water is cooled down,
evaporation continuously removes atoms in the high-energy tail of the thermal distribution fromthe trap. Collisions rethermalize the remaining atoms to a new thermal equilibrium and repopulate
atoms into the high-energy tail, furthering the cooling process. To maintain a high cooling rate
within the lifetime of a trap, the trap depth, or truncation energy, must be ramped down over time.
This process is called forced evaporative cooling. The ramping must be slow enough to allow
rethermalization. Evaporative cooling also helps to increase phase space density, which is the key
to achieve a Bose-Einstein Condensation [section 2.7]. By now, gaseous Bose-Einsteincondensates have so far only been obtained by using evaporative cooling.
Thus, the lifetime and rethermalization rate of a trap play important roles in forced
evaporative cooling. Monte Carlo simulation study shows that a complete rethermalization takes
about 2.7 collisions per atom [48, 100]. Thus the rethermalization rate is simply the collision rate
divided by a factor of 2.7:

γ th = γ col / 2.7 .

(2.156)

Runaway evaporation is defined as a situation in which the collision rate increases as the cloudcools [49]. What makes such runway evaporation is having the product of trap lifetime andrethermalization rate of at least 100-200 [35], orτγ th > 100 .

(2.157)

A straightforward way to realize forced evaporative cooling for trapped neutral atoms is
only to reduce the trap depth and keep its tightness untouched. This method keeps a high enoughcollision rate to maintain a continuous cooling process. However, in early magnetic trap
configurations using current coils, the trap frequencies became smaller when the trap depth went

37
down because of reducing the current in the coils.
Pritchard [50] and Walraven [51] suggested using RF-induced spin flip to effectively reduce
the trap depth and get forced evaporation. The first RF-forced evaporative cooling wasdemonstrated by an MIT group [52]. Another more direct way, surface evaporation, is to use a flat
solid surface as a knife to cut the trap depth from top to bottom [54, 55]. In this section, we will
also propose a direct evaporation without any external components.

2.6.1

RF-forced evaporation
To understand physics of RF-forced evaporation, we assume the atoms are trapped in MF=2

state, as shown in figure 2.14. If we apply a rotating magnetic field that can drive transitions with
∆MF=±1, the on-resonance trapped atoms will be transferred to untrapped states. Forced
evaporative cooling can be achieved by changing the RF frequency to lower the effective trap
depth. In practice, a rotating magnetic field may be difficult to produce experimentally.
Fortunately, a vertically (respect to the quantum axis) oscillating magnetic field, for instance, inthe x-direction, can be decomposed into positive and negative circular polarizations.

r⎧1⎫
B RF = Re B RF xˆe iωt = Re ⎨ B RF [( xˆ + iyˆ ) + ( xˆ + iyˆ )]e iωt ⎬
⎩2
⎭
⎧1
⎫ 1
= Re ⎨ B RF [σˆ + + σˆ − ]e iωt ⎬ = B RF [σˆ + + σˆ − ]e iωt + c.c.
⎩2
⎭ 2

{

}

(2.158)(a)(b)
Figure 2.14: Zeeman level splitting and RF evaporative cooling. (a) Zeeman level splitting underan external magnetic field for F=2 states. (b) Potentials of a magnetic trap for all trapped anduntrapped states.

38
As shown in figure 2.14(b), the RF-induced spin flips (∆MF=±1) transfer atoms fromtrapped states to untrapped states after several cycles. For more about this induced spin transition,please check J.J. Sakurai’s Modern Quantum Mechanics [53].

2.6.2

Surface-induced evaporation on an atom chip
Surface-induced evaporation has a more direct picture than RF evaporation: a flat surface

removes hot atoms when the trap moves close to the surface. Hansch’s group did the first surface
evaporation with a chip U-wire trap by increasing the bias field and keep U-wire current fixed [6],and a cooling effect was observed. However, no BEC has been reported using this method
because the field gradients and curvatures are increased so much that they induce three-bodyinelastic collisions (due to increasing density) and spin-flip losses.
An efficient forced evaporative cooling to the BEC range requires keeping trap gradientsand frequencies constant during reduction of the trap depth. This can be obtained if a conventional
IP trap configuration is combined with a flat surface. The position of the trap can be adjusted byapplying additional bias fields without affecting the trap frequencies. This work was recently doneby one of Eric Cornell’s labs at JILA and BEC was achieved by purely using surface-induced
evaporation [54]. An alternative way to achieve surface evaporative cooling toward BEC is to
move the atom cloud very close to an atom-chip substrate surface while keeping the trap
frequencies constant by applying time-varying wire currents and bias fields [55].
Here I propose a simple way to carry out surface evaporative cooling by only adjusting
external bias fields. As shown in figure 2.15, a wire with current I along the negative x-direction
and a magnetic bias field in the y-z plane produce a two-dimensional quadupole magnetic trap inthe y-z plane. If the bias field rotates with an angular frequency of Ω in the y-z plane:r))
Bbias (t ) = Bb 0 ( y cos Ωt + z sin Ωt ) ,(2.159)the position of the trap center moves along a circular orbitr))r (t ) = r0 ( y sin Ωt − z cos Ωt ) .

(2.160)

39
The field gradient stays constant2
Bb 0 2πBb 0
µ0 I
B′ =
=
=
= constant.
2
r0
µ0 I
2πr0

(2.161)

The trap frequency in the axial x direction does not change so much because it is mainly
determined by the current itself and the separation of the two y directional currents.

(a)(b)
Figure 2.15: Z-wire magnetic trap for surfaced-induced evaporative cooling. (a) Z-wire withcurrent I. (b) Trap position orbit when bias fields change properly.

2.6.3

Direct evaporation on an atom chip
Lx
I1

I1

I0
Ly
w
y

x

By0

Figure 2.16: An H-wire trap pattern design.
Direct evaporative cooling without RF and surface collisions will be very attractive if it canbe done simply by lowering the trap depth. The advancement of microchip wire-trap technology
provides the possibility of realizing this. Here, I propose direct evaporation by adjusting the wire

40
current and bias fields based on an H-trap, as shown in figure 2.16. The negative x-directional
current I0 and an external bias field By0 produce a y-z plane two-dimensional quadupole magnetic
trap. Two y-directional currents, I1, give an axial confinement. As shown in equation (2.161), thequadupole field gradient is only determined by the bias field By0 and the current I0B′ =2πB y 02

µ0 I 0.

(2.162)The trap depth is controlled by the bias field strength. Therefore, we can keep the trap tightness byjust holding the ratio of By02 and I0 constant while the trap depth is lowered.

Initial
trap

Final
trap

Initial
trap

Final
trap

Figure 2.17: Trap potentials of the
H-wire trap as in figure 2.16, with w=50
µm, Lx=3mm, Ly=6mm, and I1=5A. I0
ramps from 5 to 1.25A while the bias
field By0 ramps from 50 to 25 G. The
initial trap has trap frequencies are {97,2555, 2573} Hz, with a distance of 198µm from the surface. The final trap
frequencies are {137, 3550, 3578} Hz,with a distance of 97 µm from thesurface. The trapped state is 87Rb 5S1/2,
F=2, MF=2.

Initial
trap

Final
trap

Figure 2.17 shows the trap potentials with w=50 µm, Lx=3 mm, Ly=6 mm, I1=5 A. I0 ramps

41from 5 to 1.25A while the bias field By0 ramps from 50 to 25 G. The y-z plane trap depth andfrequencies change as expected, though in the x direction the trap depth increases. The trap depth
is determined by the y and z directions.

2.7

Bose-Einstein Condensation
In 1925, Einstein predicted ideal gas Bose-Einstein Condensation (BEC) with Bosestatistics [2]. The quantum physics picture of BEC is very simple to understand. From quantum
mechanics, we know that every particle with momentum p is associated with a matter wavelength
λ=h/p, where h is Planck constant. In a many-body system, the atoms interfere with each otherand become identical when their matter wavelengths are comparable to their separations, i.e., thephase-space density (PSD)

PSD = λT n ≥ 1 ,3(2.163)

where

λT =

h

(2.164)2πmK B T

is the thermal wavelength and n is the number density. Similar to photons that are attracted into
the bright “condensate” spots of interference, atoms tend to occupy a single quantum state andform a condensate. From equations (2.163) and (2.164), BEC requires a high atom density and avery low temperature. The first BEC in a dilute neutral atom gas was demonstrated at JILA [3]and MIT [4] groups in 1995 after laser cooling and evaporative cooling made it possible toapproach the nano-Kelvin temperature region.

2.7.1

Noninteracting BEC
rNoninteracting BEC atoms in a trap occupy a single particle state ψ ( r ) and follow thegeneral linear time-independent Schrödinger equation⎡ Pˆ 2r ⎤ rr+ U (r )⎥ψ (r ) = Eψ (r ) .
⎢⎣ 2m⎦
For a harmonic trap described by(2.165)42r
1 3 2 2U ( r ) = m∑ ω i xi ,2 i =1(2.166)its ground-state solution is⎛ xi 2 ⎞⎟,Exp⎜⎜ −
1/ 2
1/ 4
⎟
4
σ
π
σ
(
2
)
i =1
i ⎠
i
⎝

3
r
ψ (r ) = ∏1(2.167)where

σ i = h / 2mω i(i=1, 2, 3).

(2.168)The time-dependent Schrödinger equation isih⎡ Pˆ 2rr ⎤ r∂+ U (r )⎥ψ (r , t ) .
ψ (r , t ) = ⎢
∂t
⎦
⎣ 2m

2.7.2

Interaction between atoms(2.169)All real atom-trap systems have atom-atom interaction that may not be ignored in somecases. A single Bose atom satisfies the nonlinear Gross-Pitaevskii equations [56–58]

r
r
r
r
∂
4πh 2
ψ (r , t ) = Hˆ 0ψ (r , t ) + ( N − 1)
a | ψ (r , t ) | 2 ψ (r , t ) , and
∂t
m
2
r
r
r
r
4πh
µψ (r ) = Hˆ 0ψ (r ) + ( N − 1)
a | ψ (r ) | 2 ψ (r ) .
mwhere a is the S-wave scattering length and µ is the chemical potential..

ih

2.8

(2.170)(2.171)

Measurement
Interpreting the experimental data and results relies on how measurements are taken. In cold

atom research, imaging, including fluorescence and absorption, is the most important technicaltool for studying the temperature, number and density distribution of an atom cloud. In thissection, we describe the physics involved in both fluorescence and absorption imaging, and derive
time-of-flight (TOF) pictures of thermal and BEC clouds.

2.8.1

Absorption and fluorescence imaging

To measure cold-atom density distribution, we record an image with a CCD camera. As wediscussed earlier, light scattering, including absorption and reemission, happens when a laser
beam passes through the atoms. The fluorescence imaging measures the scattered light, and the43absorption detection measures the missing light from the laser beam. They are the two sides of theenergy conservation equation:
Energy of Scattered light = Energy of Spontaneous Emission= Absorbed Energy - Stimulated Emission Energy = Net Absorbed Energy.

(2.172)For a two-state system described in section 2.1, the fluorescence power, scattered (ormissing) from the incident laser beam, is determined by the spontaneous emission:

P = nΓ2 ρ 22 hω = nIσ abs .

(2.173)The density distribution can be calculated from the imaging of fluorescence:

r
r
P(r )
,
n( r ) =Iσ abs(2.174)and the total number is given byr
P (r )dVrΦ
∫,
N = ∫ n(r )dV ==Iσ absIσ abs(2.175)where Φ is the total fluorescence power.
For absorption imaging, on the other hand, the laser intensity after passing through an atom
cloud can be described as

I out = I in e∫

−σ abs ndz~= I in e −σ abs n = I in e −OD ,(2.176)

where Iin and Iout are the incident and output laser intensities, z is the laser beam propagation~ = ndz is the two-dimensional density, and OD=σ n~ is the optical depth.
direction, nabs∫

Therefore the two-dimensional density distribution is given by measuring the output, i.e., theshadow of the atom cloud after absorption:I ( x, y )1
OD( x, y )=ln inn~( x, y ) = ∫ n( x, y, z )dz =,σ abs
σ abs I out ( x, y )(2.177)and the total number is given by

N = ∫∫ n~ ( x, y )dxdy .

(2.178)44
2.8.2

Time of flight
A common way to measure a cold atom cloud is to watch its free-space expansion after

releasing the trap potential. The time-of-flight (TOF) measurement provides information about thecloud, including its momentum distribution, temperature, PSD and entropy. The nonisotropic
shape evolution during TOF from a nonisotropic trap is a clear signature of BEC.
The following sections show the derivation of the TOF evolution of both the thermal and
BEC clouds after the atoms are released from a harmonic trap. A thermal atom cloud in free spacesatisfies the Boltzman-Maxwell distribution, and there is equal thermal energy in every dimension,i.e, it expands equally fast in all directions. After sufficiently long expansion time, the thermal
atom cloud looks isotropic. However, in a BEC state, atoms must be described by quantum
mechanics; thus energy in different dimensions depends on the cloud’s shape, i.e., the wave
function. It will be shown later that the time evolution of a BEC in the free space is exactly thesame as a Gaussian laser beam propagating in free space [22]. Only one-dimension case isdiscussed here because a three-dimensional harmonic trap can be separated as three
one-dimensional traps.

2.8.2.1 Thermal atom cloudA thermal atom cloud (ideal gas) satisfies the Maxwell velocity distributionf (v ) =⎛ mv 2 ⎞m⎟⎟ .
exp⎜⎜ −
2πK BT⎝ 2 K BT ⎠(2.179)With the transformationx = vt

and

∂v 1
= ,
∂x t

(2.180)

we rewrite equation (2.179) and get the expression in position space:h( x; t ) = f (v)=with σ ht =

∂v
∂x

⎛
m 1
mx 2 ⎞⎟=
exp⎜⎜ −
2 ⎟2πK B T t
⎝ 2 K B Tt ⎠

K BT
t.
m

⎛
x 2 ⎞⎟,
exp⎜⎜ −2 ⎟2π σ ht⎝ 2σ ht ⎠1(2.181)(2.182)

45
Equation (2.181) is the expansion or propagation function of a point cold-atom source. For an
atom cloud with a finite initial size and distribution, we apply the convolution as the following:u ( x; t ) = ∫ u 0 (ξ ) h( x − ξ ) dξ = u 0 ∗ h ,(2.183)where u 0 ( x; t ) = u ( x; t = 0) is the initial density distribution.
Considering an initial Gaussian atom cloud:u 0 ( x) =⎛ x2 ⎞⎟,
exp⎜⎜ −2 ⎟2σ
2π σ 00 ⎠⎝1(2.184)and using the Fourier transform F, we getu ( x; t ) = u 0 ∗ h = F −1{F {u 0 ∗ h}} = F −1{F {u 0 }F {h}} = F −1{U 0 H } ,(2.185)where⎛ σ 2 ( 2πf ) 2 ⎞⎟ and
U 0 ( f ) = F {u 0 } = exp⎜⎜ − 0⎟2⎠⎝(2.186)⎛ σ ht 2 ( 2πf ) 2 ⎞⎟.
H ( f ; t ) = F {h} = exp⎜⎜ −⎟2⎝⎠(2.187)

We have then

⎛ (σ 0 2 + σ ht 2 )( 2πf ) 2 ⎞⎟U ( f ; t ) = F {u ( x; t )} = H ( f ; t )U 0 ( f ) = exp⎜⎜ −⎟2⎝⎠⎛ σ 2 ( 2πf ) 2 ⎞⎟,= exp⎜⎜ − t⎟
2⎝⎠(2.188)where

σ t 2 = σ 0 2 + σ ht 2 .

(2.189)Therefore the final distribution at time t is also a Gaussian distributionu ( x, t ) = F −1{U } =⎛ x2 ⎞⎟.
exp⎜⎜ −2 ⎟2σ
2π σ tt ⎠⎝1(2.190)2.8.2.2 BEC atom cloud
For a BEC atom cloud without atom-atom interaction, we need to solve the time-dependent
Schrödinger equation

46

ih

∂
h2 ∂2
ψ ( x, t ) = −ψ ( x, t )∂t
2m ∂x 2

(2.191)

It can be proven that, if the initial wave packet is a Gaussian function as⎡ x2 ⎤
ψ ( x, t = 0) = C exp ⎢− 2 ⎥ ,⎢⎣ w0 ⎥⎦

(2.192)where C is the normalization factor and

w0 = 4σ 022(2.193)is the initial waist size, the solution to equation (2.8-49) is given by [22]

ψ ( x, t ) = C⎡ x2 ⎤⎡
w0
kx 2 ⎤⎡ 1⎤−1
exp⎢− 2 ⎥ exp⎢− i⎥ exp⎢i tan (t / t 0 )⎥ ,
w(t )
⎣ 2
⎦
⎣ w (t ) ⎦⎣ 2 R(t ) ⎦(2.194)where

1m
4σ 02 = 2mσ 02 / h ,2hw 2 (t ) = 4σ 2 (t ) , and2t 0 = kw0 / 2 =⎡σ 2 (t ) = σ 0 [1 + (t / t 0 ) 2 ] = σ 02 ⎢1 + (⎣(2.195)(2.196)ht 2 ⎤) ⎥.
2mσ 02 ⎦(2.197)

If the atoms are released from a harmonic trap with frequency ω, we have2

σ 0 = h / 2 mω ,(2.198)t0 = 1/ ω ,(2.199)σ 2 (t ) = σ 02 [1 + (t / t 0 ) 2 ] = σ 02 [1 + ω 2 t 2 ] , and(2.200)R (t ) = −t[1 + (t 0 / t ) ] = −t (t 0 / t ) [1 + (t / t 0 ) ]2

2

2t 0 σ 02t0
σ 2 (t ) t 0
2
2= −t 2 2 [1 + (t / t 0 ) ] = − 2 σ (t ) = −t σ 02
t σ0
tσ 0
2

2

σ 2 (t ) 1 4m 2σ 04=−
t σ 02 h 2
σ 2 (t ) 4m 2σ 02
=−

t

h2

.

2

(2.201)

Finally, solution (2.194) can be rewritten as⎡ x 2 ht
⎤
2
⎡ 1
⎤
⎢
⎡
2mσ 0 ⎥σ0tx ⎤−1
ψ ( x, t ) = C
exp ⎢−
exp
exp
tan
(
)
−
i
i
⎢
⎥
⎢
⎥
⎥
2
2
2
σ (t )
2mσ 0 / h ⎦⎥⎣ 4σ (t ) ⎦⎣⎢ 2⎢ 4σ (t ) ⎥
⎣
⎦
2

47

=C

⎡ ⎧1
⎡
σ0
x2 ⎤
x 2 ωt ⎫⎤−1ω
exp ⎢−
exp
i
tan
(
t
)
−
−
⎬⎥ .
⎢ ⎨
⎥
2
2
σ (t )
2
4
σ
(
t
)
⎭⎦
⎩
⎣ 4σ (t ) ⎦⎣(2.202)Thus, the TOF after releasing a BEC cloud from a harmonic trap satisfies Gaussian evolution
similar to optical Gaussian beam propagation.

As a summary, we have reviewed the mechanisms of laser cooling and trapping on theatom-chip. Although most cooling and trapping technologies have been well developed in the past
twenty years, understanding them precisely are important and crucial to our BEC production in
the portable atom-chip vacuum cell, described in next chapter, because of its ultimate small
capture volume of the MOT.

48

Chapter 3. A portable atom-chip vacuum cell
3.1

Introduction
The term “atom chip” connotes a picture of microscale atom-optics devices, perhaps

integrated with optics and electronics on a single substrate. Our effort in developing a portable
and compact vacuum cell system for Bose-Einstein condensation (BEC) atom-chip production is asignificant step toward realizing this picture. We have produced a portable system that can beassembled, processed, and inserted into an ultracold atom apparatus in much the same way that anelectronic vacuum tube can be plugged into an existing receiver. By separating the vacuum
processing from the remaining BEC instrumentation, we seek to speed-up ultracold atom-chipdevelopment and, eventually, to make ultracold atom science more accessible to those without
expertise in ultrahigh-vacuum (UHV) systems.

(a)(b)
Figure 3.1: Traditional BEC systems with large and complicated vacuum components. (a) an MIT
BEC system [69]. (b) A JILA standard BEC system [70].
As we know, different stages in a BEC experiment require different vapor pressures. For
instance, the magneto-optical trap (MOT) requires high rubidium vapor pressure (~10-8 torr) to
capture a large number of atoms, while evaporative cooling toward final BEC creation requires
UHV (<10-11 torr) to maintain a long magnetic-trap lifetime. The conflict between the twodifferent pressure ranges can be solved with a double-chamber design consisting of a vapor cell

49
chamber and a science chamber [59, 60]. After the atoms are loaded into the MOT in thehigh-pressure vapor cell chamber, they are mechanically moved into the UHV science chamberwhere the atoms are further cooled toward BEC. The two chambers are connected via a small tube
of low conductance that maintains the pressure difference. Another example of double chamber
BEC systems, using Zeeman slower, consists of a hot oven high pressure chamber and a UHVchamber [101]. As shown in figure 3.1, such traditional BEC vacuum systems are large andcomplicated, normally occupying more than half of an optical table (1.22 × 3.66 m).
Some atom-chip research groups still take advantage of this double-chamber structure [61,62]. To reduce the complexity of the vacuum system, an alternative solution is to control thepressure temporally, i.e., to separate the MOT and BEC at different times instead of different
spaces. Several technologies have been developed to make controllable atom sources such asdispensers [63], and light-induced atomic-desorption (LIAD) [64–66]. These atom sources can beturned on to increase the vapor pressure at the MOT stage and off to recover the pressure for themagnetic trap in a single chamber. The realization of the first two chip-based BECs in 2001 [14,15], using pulsed atom sources, was a scientific and technical milestone towards chip-scalecoherent atom-chip devices. However, as shown in figure 3.2, these two BEC atom-chip vacuum
systems are still not compact because they insert or embed their atom-chips into large vacuum(a)(b)
Figure 3.2: Apparatuses for the two first BECs on a chip reported in 2001. (a) System of W.
Hänsel et al. [14]. The pumps are not drawn here. (b) System of C. Zimmermann et al. [67]. The
vacuum chamber, not seen in the picture, is surrounded by huge water-cooled coils.

50chambers that are backed by much larger pumping stations. Thus, atom-chip technology has
successfully reduced BEC atom cloud sizes but until now has done little to simplify the entire
vacuum system.
Our portable BEC atom-chip cell uses LIAD, one of the pulsed atom sources, but isconstructed in a completely different way from all other atom-chip groups. In the following
sections, we will present our first-generation vacuum setup where we learned how to assemble thechip to the cell. Then, we will provide the details of our unique portable atom-chip system.

3.2

First generation atom-chip vacuum system
A BEC atom-chip vacuum cell with a single chamber design must meet two general

requirements:(1) It must be able to temporarily control cell vapor pressure to meet the pressure
requirements at both the MOT and BEC stages. The pulsed atom source must be
switched on and off within a few seconds. We use UV LIAD to realize this goal.
(2) It must be able to maintain a UHV base pressure below 10-10 torr. A traditional BEC
system requires a pressure of <10-11 torr. However, an atom chip makes BEC production
possible at 10-10 torr because of its higher magnetic-trap compression and shorter forced
evaporation time.
We designed our first generation atom-chip vacuum system to meet these two requirements
but did not attempt to make it portable. The system diagram is shown in figure 3.3. The
breakthrough at this stage was to simplify the way in which an atom chip is integrated into an
entire system. For the first time, we successfully used the chip itself to seal a glass cell, thus
making the chip part of the vacuum wall. The pin structure from the chip provided a directconnection to external current sources without requiring any vacuum feed-through. The details for
integrating a chip with a glass cell are given in the next section.
As shown in figure 3.3, the system is comprised of most standard components for a UHV

51system, including a turbo pump, an all-metal valve to separate the turbo pump after systembaking-out and pumping-down, an ion pump (20 L/s), a Titanium sublimation pump (TSP), and an
ion gauge. The whole system has a size of about 70 × 50 cm on an optical table. The ion gauge
reads < 3 × 10-11 torr after the system is baked out.
The first generation system is still far from portable. On the other hand, the effective
pumping speed at the chip port is very low because of the long distance from the chip to the
Titanium sublimation pump (TSP) and ion pump. We have used this system to study atom-chiptraps but not to achieve BEC. Our next step was to develop a functional portable atom-chip cellfor BEC production.

Figure 3.3: Diagram of the first-generation−atom-chip cell.

52

3.3

A portable atom-chip vacuum cell
Our portable vacuum cell system, shown in figure 3.4, consists of a single four-way crossthat is attached to a small (8 L/s) ion pump, a four-pin feed-through providing connections to arubidium dispenser and nonevaporable getter (NEG), a pinch-off tube, and a glass cell (the BEC
chip cell). A 0.5 mm thick aluminum nitride (AlN) wafer (the atom-chip) closes the cell top,
completing an ultrahigh-vacuum-compatible seal. A pyrex helix is used to increase the Rb atom
adsorption surface for UV LIAD.

Figure 3.4: Portable vacuum cell for the production of a chip BEC. (a) Complete vacuum cellsystem. (b) Detail of cell assembly.

Part Name
Atom chip
Quartz cell
Rubidium
dispenser
Pyrex helix
NEG
Pinch-off tube

Table 3.1:Atom-chip cell parts list.
Company
Description
Dept of Mechanical Engineering, Lithographically patterned copper on an
Univ. of Colorado at Boulder.
0.5 mm aluminum-nitride chip. The wire
thickness is about 10–15 µm.
NSG Precision Cells, Inc.
Inner cross section 1 × 1 cm, type 3FL(UV or IR), 4 cm long
SAES
Model RB/NF/3.4/12FT10+10
JILA
SAES
Huntington MechanicalLaboratories, Inc.
http://vacuumfeedthru.com/

Home built
ST172/HI/16-10/300C
Model CPT-275-075, 1.91 cm (3/4 inch)tube diameter, copper. It can be modified
by JILA mechanical shop if nocompression port is used in other side.

53
The whole cell system measures 30 × 30 × 15 cm, and a person can hold it with two hands.
As far as we know, it is the world’s smallest BEC cell. The primary components are commercial
products, as listed in table 3.1.

3.3.1

Fabrication of the atom-chip glass cell
The atom-chip glass cell consists of an atom chip and a quartz cell. The two components

are prepared separately and then integrated in a final step of atom-chip–glass-cell assembly.
Atom-chip

fabrication

is

done

by

Dr.

VictorM.

Bright’s

lab

at

the

Micro-Electro-Mechanical Systems (MEMS) group at their facilities in the MechanicalEngineering Department at the University of Colorado at Boulder. The chips consist ofelectroplated copper wires on an aluminum nitride (AlN) substrate.
The AlN substrates are purchased from TFT (Thin Film Technology, Inc.). They come witha TiW adhesion layer (30–40 nm thickness) and a Cu seed layer (~250 nm thickness). The
root-mean-square (rms) roughness of the Cu seed layer is measured to be 8–20 nm using a Zygo
white-light interferometer. The properties of AlN, including its great thermal performance, lowthermal expansion, and nontoxicity, make it a desirable electronic substrate material.
The wire pattern mask is ordered from Infinite Graphics (Infinite Graphics, 4611 E. Lake
Street, Minneapolis, MN 55406). The mask consists of ink on a plastic sheet that is transferred toa glass mask using a standard lithographic technique on a blank sodalime glass mask. The
transferred glass mask is then used as a primary mask for further patterning and etching. This
technique has been used for feature sizes down to 10 µm.
The first step in the chip fabrication process is to spin-coat the chip with photoresist. We
use AZP 4620 photoresist (Clariant Corporation, Business Unit Electronic Materials, Somerville,
NJ]. After coating, the thickness is about 14 µm. Once coated, photolithography is used inconjunction with the previously created mask to remove the photoresist where Cu wiring will becreated. The patterned substrate is then electroplated using an electrolytic acid Cu bath process in54
a tank purchased from Technical Inc. The final thickness of the Cu wires ranges from 8–14µm.
After electroplating, the photoresist is stripped using acetone. The final step is to etch theremaining adhesion and seed layers that are not covered by electroplated Cu wiring. The Cu seedlayer is removed using Cu etchant, and the TiW is removed using a hydrogen peroxide solution.
The above chip fabrication recipe is provided by Dr. Victor M. Bright’s group. The atom
chip and its wire pattern are shown in figure 3.5. The pins on the top and bottom sides provide a
direct connection between the chip and current power supplies. The center area of the chip, 1 × 1
cm, is used to seal the top of the glass cell.

(a)(b)
Figure 3.5: The atom chip and its copper wire pattern. (a) View of the whole copper chip pattern.
(b) Center detail of wires where the BEC is produced. The widths of the U-wire (IU) and Z-wireare 200 µm and 100 µm, respectively. The height of the wires is about 10 µm
As soon as the chip is fabricated, we prepare the quartz cell at our lab for cell integration(by Leslie Czaia). A quartz cell is chosen to enhance the UV LIAD effect. Because LIAD is a
non-thermal process (much like the photon-electron effect) and responds to short lightwavelengths, the glass cell must be UV transparent. We use both UV and IR quartz cells fromNSG Precision Cells, Inc. (inner cross section 1 × 1 cm, length 4 cm, type 3FL). The only
difference between UV and IR quartz cells is that the transmission on the IR quartz cell is higher
at IR wavelengths. Experimentally we don’t see any significant difference in loading the MOTwith UV LIAD. The cell in which we have achieved BEC is a UV quartz cell.
Unfortunately, the thermal expansion coefficient (0.59 × 10-6 oC-1) of quartz does not match55
that of the AlN substrate (4.6×10-6 oC-1) very well. The thermal mismatching gives an upper limitof the bakeable temperature of the cell about 170 oC in our system.
We use the chip to form a UHV seal on one end of our BEC cell and to provide a reflective
surface to create a mirror MOT [6]. Thus, there are a number of steps involved in integrating thechip with the cell (figure 3.7).
First, connector pins from Digikey (ED8850-ND) are soldered to the Cu wire leads at thechip edges using a soldering iron set to 850 ºC. Generic tin-lead solder is used. Care is taken toprevent solder from reaching the area where the chip will be attached to the BEC cell. Once theconnectors are attached, the chip can no longer sit flat on the table. We mount it onto a heat sink
for support. We can attach the chips to the heat sinks either with glue (Epotek H77) or withdouble-sided tape.
Once the chip is properly supported, a silver mirror is epoxied to the surface containing theCu wiring. The mirrors are created by evaporating ~250 nm of silver onto a glass block without
any sort of adhesion layer underneath. Thus, the silver is only weakly bonded to the block and canbe transferred to the atom chip. First, a drop of Epotek 353ND all-solids epoxy, free of air bubbles,
is applied to the chip surface. Then an 8 µm thick piece of kapton film, the same size as the mirror,is placed on top of the epoxy and smoothed out to remove excess glue. Another drop of epoxy is
applied before placing the brass block on the chip, mirror side down, as shown in figure 3.6 (a–b).
Then excess epoxy is removed from the edges and the seal junction cures at 100 ºC for 15 min.
The block can now be removed, leaving the mirror behind, as shown in figure 3.6 (c).
The chip is now ready to be attached to the square quartz cell, as shown in figure 3.6 (d).
We place 353ND epoxy between glass slides and smear it to a thin layer. A small amount is thentransferred to all edges of the cell, which is then seated on the chip on top of the mirror. The cell isweighted down with a brass block and baked at 100 ºC for 1.5 h using a minimum of 1.5 h for
ramping up and down.
Finally, this assembly is epoxied to a UHV glass-to-metal transition using a glass disk with

56
a 1 cm bore to compensate for the size mismatch. Now the atom-chip glass cell looks exactly as
shown in figure 3.4 (b) if we add a rubidium dispenser, Pyrex helix, and NEG.

Figure 3.6: Cell construction procedure diagram.

3.3.2

Rubidium dispenser
Rubidium dispensers have been widely used to provide pure atom sources in atomic

research systems [59] and pulsed atom sources in some atom-chip groups [15, 68]. In thedispenser, rubidium atoms are released from a metal surface when it reaches a critical temperatureduring heating by an electric current. After the current is switched off and the dispenser cools
below the critical temperature, it stops dispensing. Heat loss dominated by radiation results in avery fast switch-off time constant of less than 10 s. Since the temperature of the dispenser directly
depends on the electric current strength and the operating time length, a low dispenser current
cannot provide enough Rb atoms to coat the cell wall for UV LIAD. On the other hand, a highdispenser current can lead to a high vapor pressure that quickly saturates the ion pump and NEG.
Thus, it is very important to find out critical-temperature-related–operating-current parameters,
which are not provided by the manufacturer, to run our portable vacuum chamber.
Our rubidium dispenser is a commercial product from SAES (RB/NF/3.4/12FT10+10).
Figure 3.7 shows the experimental results of the dispenser at pulsed modes. We find there is a

57
threshold pulse length tth=15 s for observing rubidium from the dispenser at 6 A. This tth is strong
evidence for the existence of a critical temperature. It can also be clearly seen from the 20 and 30
s pulse curves in figure 3.7 (a) that there are no big pressure changes in the first 15 s. However,the pressure decreases after the current is switched off without any delay because of radiation heatloss. The exponential (1/e) time constant of switching off is typically 5–10 seconds. These results
show that the Rb dispenser can work as a fast atom-pulse source. However, we must wait for atleast tth=15 s, the pulse length to reach the critical temperature for dispensing, to start a MOT.
Therefore, the pulsed dispenser does not work for a fast MOT and BEC production. In our BEC
experiment, we use the UV LIAD method to load our MOT within 3 seconds instead ofcontrolling the dispenser current.

(a)

(b)
Figure 3.7: Results of a pulsed dispenser mode at 6 A. (a) Pressure response with different
pulse lengths from 5 to 30 s. (b) The peak pressure vs pulse length. The pressure is measured
by the small 8 L/s ion pump. A current pulse with length ∆t starts at t=0 and ends at t=∆t.

58
Other indirect evidence for the existence of a critical temperature comes from measuring
steady-state pressure vs dispenser current, as shown in figure 3.8. The threshold current of about 3
A indicates that the rubidium atoms do not come out until the dispenser reaches a higher
temperature. In our daily experiments, we use 3 A as the operating current to coat Rb atoms to thequartz cell wall for 15 to 30 minutes before starting a series of BEC experiments using the UVLIAD method. The operating current varies from 3 to 3.5 A for individual dispensers. In reality,
we define an operating current Idopt as one in which the MOT loading time is about 3 s (P = 1.0 ×
10-8 torr and magnetic trap life time about 0.8 s). Under the condition, typically 6–8 × 106 atoms
are loaded into the MOT at the dispenser operating current, and 3 × 106 atoms are transferred into
the Z-wire magnetic trap.

Figure 3.8: Cell pressure P vs Rubidium dispenser current Id. The pressure is obtained frommeasuring the MOT loading time. A 3 × 10-8 Torr pressure results in a 1 s MOT loading time. The
threshold current of the dispenser is about 3 A.
The above discussion assumes that the dispenser has been well prepared inside the vacuum.
To use the dispenser in a UHV condition, it needs to be burned at high current, i.e., 6−7 A for
several minutes to get rid of the protection layer.

3.3.3

Pyrex helix
The UV (or IR) quartz cell is transparent to UV light but has a low adsorption rate for Rb

atoms to its inner wall. To use UV LIAD to control the Rb vapor pressure, we must use a material

59
like Pyrex with a high atomic adsorption rate. As shown in figure 3.4 (b), a Pyrex helix provides agood Rb desorption source with its large surface area. The atom number in a MOT loaded by UV
is improved by a factor of two with the help of a Pyrex helix.

3.3.4

Nonevaporable getter
In NEG pumps, the getter material removes active gas from a vacuum via surface chemical

adsorption and bulk diffusion. NEG pumps have some interesting advantages in UHV vacuum
applications. They pump hydrogen better than other kinds of pumps. They usually operate without
power. They are clean, lightweight, and compact. They can help provide lower ultimate vacuum
than is achievable without them. They are vibration-free. They operate unaffected by magnetic
fields and do not generate magnetic fields.
900
800
Temperature (C )

700
600
500
400
300
200
100
0
0

(a)

1

2

3

4

6
5
Current (A)

7

8

9

10

(b)

(c)
(d)
Figure 3.9: SAES NEG ST172 configuration and activation conditions. (a) A typical configurationof a zirconium-based, sintered porous getter. (b) A typical heating curve. (c) The gettering
efficiency (expressed as a percentage of the initial gettering rate of a fully activated getter) after
various activation conditions. (d) Sorption curves for CO and H2 at room temperature and at 400o
C after an activation at 900 oC for 10 minutes. (The specification information about ST172 comesfrom SAES Getters.)

60
In our portable atom-chip cell system, we use a zirconium-based, sintered porous NEGfrom SAES (ST172/HI/16-10/300C). The ST172 is designed for low-temperature activation. At
the recommended activation condition of 450 oC (5.2 A) for 10 minutes under a vacuum <10-3 torr,
the getter reaches a degree of activation of about 35% with respect to a fully activated getter.
Higher temperatures always yield better activation, e.g., a full activation can be reached with 900oC (10 A) for 10 minutes [figure 3.9 (c)]. From our experience, the activation of ST172 NEG at

10-9 torr always results in some extra gas load into the system that is extremely difficult to bepumped away. H2 sorption capacity is reversible by activation but other gases are not because of
their high-energy chemical bonding.

3.3.5

Small ion pump (8 L/s)
The conductance of the square quartz cell for Rb atoms at room temperature is 2.2 L/s, andthe conductance of the glass-to-metal transition tube (diameter 2.5 cm and length 9 cm) is 12.4
L/s. For air, they are 3.9 L/s and 21.2 L/s, respectively. Therefore, the small square quartz cell
limits overall system conductance. A Varian 8 L/s small ion pump is enough to maintain the UHV
pressure of the cell after pinch-off.

3.3.6

Pinch-off tube
Pinch-off tubes are purchased from Huntington Mechanical Laboratories, Inc. (Model

CPT-275-075, 0.75-inch tube diameter, copper). They provide a connection between theatom-chip cell and the pumping station. After the cell vacuum is prepared, the tube is pinched off
and the atom-chip system becomes independent and portable.

3.4

Pumping station
The portable atom-chip vacuum cell must be prepumped before the 8 L/s small ion pumpand NEG can take charge of the UHV pressure. The portable cell is connected to a pumping
station through the pinch-off tube (figure 3.10). The pumping station includes an ion gauge, an61
all-metal valve, a turbo pump, a TSP, and a big ion pump (20 L/s). Backed by a mechanical roughpump (Varian SH-100), the pumping station is able to pump down the chip-cell chamber to 10-10
torr after baking out. The system is assembled by using a torque wrench with a close torque of 90
ft-lbs. A Varian leak detector (model 979) is used to make sure there are no measurable leaks. The
commercial parts list for the pumping station is shown in table 3.2.

Figure 3.10: A portable atom-chip cell is connected to the pumping station via a pinch-off tube.
Table 3.2: Pumping station parts list.
Part Name
Big ion pump
Small ion pump
Turbo pump
TSP
Ion gauge

Company
VarianVarianVarianVarianVarianConvecTorr gauge

VarianAll-metal valve
Rough pump
UHV compression
port

VarianVarianVarianDescription
Vaclon Plus 40, controlled by Varian MidiVac Controller.
8 L/s pump, controlled by Varian MicroVac Controller
Turbo-V 70LP
Filament-type TSP, Varian TSP Controller.
UHV-24p
extended-range
nude
Bayard-Alpert-typeionization gauge tube with a dual thoria-coated iridium
filament. Controlled by SenTorr Vacuum Gauge Controller.
ConvecTorr Simulator, controlled by SenTorr Vacuum
Gauge Controller.
UHV All-Metal Valve, right angle
SH-100, single scroll pump.
3/4 inch port on 2.75 (NW35) ConFlat, part number
FCP0075UHV. Used if the pinch-off tube is not modified.

62

3.5

Baking out and pumping down procedure
Baking out is an effective way to degas the vacuum chamber and remove most of theparticles attached to the chamber wall, especially water. The turbo pump is used to pump thesystem during baking out, and the ion pumps and TSP are turned on when the system is cooled
down to room temperature. The bakeable and baking temperatures of different components areshown in tables 3.3 and 3.4. In the baking schedule, first, the quartz cell is heated up with a slow
temperature ramp, followed by heating the cell cross and the small ion pump. The pumping
station is the last. The order is reversed when the system is cooled down. From our experience, theturbo pump itself can pump down to 1–5 × 10-8 torr when the system is still baking out and 2–5 ×
10-10 torr after it cools down.
Table 3.3: Atom chip cell bakeable and baking temperature.
Part name
Quartz cell
Cell cross
Small ion pump

Bakeable temperature (oC)
130
>450
400

Baking temperature (oC)
120
250
300

Table 3.4: Pumping station bakeable and baking temperature.
Baking temperature (oC)Part name
Bakeable temperature (oC)
Big ion pump
350
300
TSP
400
300
System cross>450
300
Ion gauge
450
300
All-metal valve
450300
Turbo pump120
Water cooled
The dispenser and the getter must be well prepared before pinch-off so that they do notrelease excess contaminants. We prepare the dispenser and getter according to manufacture’s
instructions while the chip cell is hot and connected to the pumping station. The cell baking takes
typically 2–5 weeks. After the cell cools down to room temperature, we clean the quartz cell’s
inner wall with a flash lamp (Perkin Elmer, Model # FYD-4400) and leave leave a fresh, uncoatedsurface for accepting Rb atoms. Then we do fluorescence test by turning on the dispenser to makesure the dispenser has been prepared properly. Finally the atom-chip cell is pinched off from thepumping station, and only the nonevaporable getter and the small ion pump will maintain the

63vacuum in the cell of about 10-10 Torr.

3.6

Conclusion
We have built a portable atom-chip cell system ready for laser cooling and trapping. After

2−5 weeks of preparation, the self-vacuum-contained cell reaches 10-10 torr, which is suitable foratom-chip BEC production. We present the details of making a BEC on the chip in chapter 7.

64

Chapter 4. Optical system
4.1

Overview
Developing the laser optical subsystem constitutes one of the most important parts inbuilding a Bose-Einstein condensation (BEC) system. From the magneto-optical trap (MOT) to
the final BEC creation and detection, precise and rapid control of laser frequencies and powers is
required.

Figure 4.1: Laser optical setup on the optical table. PD: photodector; λ/n: λ/n wave plate; L:lens; OI: optical insulator; FR: faraday rotator; AOM: acousto-optical modulator; PBS:
polarization beam splitter.

65

Figure 4.2: Top view of laser optical setup on the small aluminum optical board where we plugin the portable atom-chip cell.

In our atom-chip system, only about a 30 mW of magneto-optical trap (MOT) cooling laser
power is required because of the small beam diameter of 8 mm. Such low power consumption
allows for utilizing only inexpensive semiconductor laser diodes. We use injection locking with adouble-path acousto-optical modulator (AOM) configuration for the cooling laser system, whichallows us to change the laser frequency very rapidly (up to 80 MHz) without affecting thefiber-coupling efficiency. The master laser for the injection locking, repumping laser, andpumping/probe laser are home-built JILA-mount external cavity laser diodes (ECLD). The laser

66
system optical setup on the main optical table is shown in figure 4.1. After coupling topolarization-maintaining (PM) single-mode (SM) fibers, all the lasers are brought onto a small 61
× 61 cm aluminum board where we plug in the portable atom-chip cell, as shown in figure 4.2.
When we switch to a new atom-chip cell, we only need to do a few adjustments on the small
optical board to optimize the MOT setup. Reflection absorption imaging with an Apogee CCD
camera is used to image and measure cold atoms on the chip.

4.2

JILA-mount external cavity laser diodeOur atom-chip experiment requires a total of three tunable single mode lasers: cooling laser,

repumping laser, and pumping/probe laser. We have designed and built cheap diode laser systems
based on a tunable Littrow configuration [71, 72] on a JILA mount. The output is single mode,with a reasonable tunable range (10 GHz), narrow linewidth (<100 kHz), and high power (50–60
mW). The JILA mount ECLD was originally designed by Dr. Patrick Berthoud, one of ourprevious postdoctoral associate.
In most ECLD systems, temperature stabilization is obtained by controlling the temperatureof the entire cavity structure [73, 74] or even the enclosure [75]. The temperature servo systemcannot respond adequately to very fast perturbations because of the large thermal mass. Although
we follow the simplified mechanical idea of Arnold et al. [73], we only servo the temperature of
the laser diode placed in its small mount instead of controlling the temperature of the wholeexternal cavity to reduce heat dissipation. In our ECLD system, we modify a JILA mirror mount[component 1 in figure 4.3(a)] to integrate the laser diode (LD), grating and piezoelectric actuator(PZT) into one solid unit. The JILA mount, comparing to flexure structures in commercial ECLD
products, works as a very stable mechanical cavity holder.
Our ECLD mechanical system is shown in figure 4.3. A cut in the back plate of the blackanodized JILA mirror mount is made to accept the laser diode support [component 2 in figure 4.3(a)], which includes a collimation tube. A thermoelectric heater/cooler (Peltier) is sandwiched

67
between the JILA mount and the laser mount to regulate only the temperature of the laser mount.
The diffraction grating is glued on an adequate mount [component 3 in figure 4.3(a)] screwed on
the front plate of the JILA mount. The three micro-control screws on the JILA mount provide very
precise three-dimensional cavity feedback adjustment. The fine rotation of the grating is provided
by a stacked piezoelectric actuator preloaded between the grating mount and one of the
microcontrol screws by the restoring spring of the JILA mount.

(a)

(b)

(c)
(d)
Figure 4.3: Pictures of the JILA mount ECLD laser head system. (a) (1) modified JILA mount,(2) laser diode collimation tube mount, (3) grating mount, (4) base. (b) top view. (c) side view.
(d) An overview of the entire box.

68

JILA mountfront part
Grating mountFigure 4.4: Drawing of the JILA mount ECLD mechanical components.
The mechanical drawings of the JILA mount, the laser diode collimation tube mount, and thegrating mount are shown in figure 4.4. The following is a list of commercial elements of our
ECLD system:(1) One JILA mount (solid back plate, L-shape front plate).

69(2) One Sony laser diode SLD252VL. The measured wavelength of this diode at room
temperature is 782 nm. The maximum specified output power is 100 mW at its operating
current of 120 mA.
(3) One Schottky diode 1N5711 for laser diode protection (optional).
(4) One Thorlabs collimation tube LT230P-B, which includes an aspheric lens C230TM-B witha focal length f=4.5 mm and a numerical aperture NA=0.55.
(5) One Marlow Industries Inc. TEC thermoelectric heater/cooler (Peltier) DT3-2.5 provided byThorlabs (item # TEC3-2.5) with Imax=2.5A, Vmax=3.6V, and a size of 16 × 16 × 4 mm.
(6) One precision thermistor YSI44008 for the temperature servo loop.
(7) One thermometer AD590 to monitor the temperature on the top of the laser diode mount.
(8) One Edmund Scientific holographic diffraction grating L43-775, 1800 l/mm, VIS, 12.5 ×
12.5 mm.
(9) One Thorlabs piezoelectric stack actuator AE0505D16 to tune the laser output wavelength.
(10) One JILA laser diode current controller and temperature controller AD014-07.
After all the mechanical parts have been machined and the entire ECLD system has beenassembled, we start to align the grating external cavity, adjust the lasing to the right wavelength,and optimize the mode-hop free range. The rough alignment of the cavity can be done byadjusting the three microcontrol screws of the JILA mount while watching the first-order feedback
from the grating to the laser diode through a pinhole. Then the following two-step fine adjustment
can be repeated to optimize the cavity feedback and obtain the right output wavelength:(1) We monitor the curve of the ECLD output power vs laser diode current by modulating thecurrent around the threshold current Ith value. We minimize Ith by adjusting the cavity
feedback with the upper microcontrol screw of the JILA mount.
(2) We change the output wavelength and move it closer to 780.24 nm by adjusting the side
microcontrol screw of JILA mount to change the grating angle and stop where the laser
wavelength becomes unstable and multi mode. The wavelength is measured by a wavemeter(EXFO WA-1500).

70
Repeating the above two-step procedures, we successfully achieve a single mode output at 780.24
nm. In some of our ECLD systems, we have successfully pushed a 785 nm laser diode down to
780 nm (Rb D2 line) and 776 nm (87Rb transition from 5P3/2 to 5D3/2), and up to 795 nm (Rb D1line) without adjusting the LD temperature. A final optimization of the central frequency andmod-hop free range can be obtained by adjusting the LD temperature and current slightly. Figure
4.5 shows some results from one of our ECLD lasers. The mode-hop free range, in which the laser
frequency can be freely tuned by the PZT, is about 10 GHz, as shown in figure 4.5(a). The
threshold current Ith is lowered from the free-space-running value of 32 to 28 mA with theexternal cavity, as shown in figure 4.5(b). The output power at operating current 110 mA is 60
mW. For more about the ECLD design, please see references [76–78].

(a)

(b)
Figure 4.5: Result of one of the JILA mount ECLD lasers. (a) Rb Doppler-broadened D2
absorption spectrum. (b) Laser output power vs LD current.

71

4.3

Cooling laser
Our atom-chip mirror-MOT cooling laser is locked to the 87Rb D2 closed transition, from

|5S1/2, F=2> to |5P1/2, F'=3>, with a certain amount of red detuning of ∆ν, as shown in figure 4.6.
Limited by our atom-chip size of 1 × 1 cm, the saturation power with a typical detuning of 9 MHz
is about 35 mW. This low power requirement makes a diode laser suitable for obtaining coolinglaser power without using any high power amplifiers. On the other hand, atom number andcooling efficiency are more important to us because of the small MOT capture volume. We must
control the cooling frequency very rapidly with great precision, at different laser cooling stages,e.g., MOT, compressed MOT (CMOT), and polarization gradient cooling (PGC). Frequency
control is readily achieved in our system with an injection locking method [79, 80] employing a
two-diode-laser (master-slave) configuration.

Figure 4.6: 87Rb D2 line hyperfine energy levels and the MOT cooling transition. The master laser
is locked to the crossover of the transitions F=2 to F'=3 and F'=1. The slave laser is injection
locked by the master laser beam after a double-path AOM that shifts the master laser frequency.
The slave output, i.e., the MOT cooling laser, is red-detuned with ∆ν from the cycling transition
from F=2 to F'=3.

72

Figure 4.7: Cooling laser optical setup before coupled to the fiber. ML: master laser; SL: slavelaser; PD: photodector; λ/n: λ/n wave plate; L: lens; OI: optical insulator; FR: faraday rotator.
AOM: acusto-optical modulator; PBS: polarization beam splitter.

The layout of the optical setup for the cooling laser is shown in figure 4.7. The master laser
is a JILA-mount ECLD diode laser with a SONY 780 nm laser diode. It has an output power of 54
mW at its operating current of 106 mA. The slave laser is a bare SONY LD without an external
grating cavity. As shown in figure 4.7, the master laser output is injected into the slave laser after
passing through a double-path AOM setup, which shifts the master laser frequency with a double
AOM RF frequency. The two lenses (L1, f=35 mm, Thorlabs achromatic boublet LAC628-B) areused to shape the master laser beam. In a general system, not in our specific case, ananamorphic-prism pair may be used to shape the master laser beam for mode matching between
the injected master laser beam and the slave laser field. The double-path AOM configuration witha mirror at one of the focal planes of the lens L2 (f=150 mm, Thorlabs achromatic doublet
LAC789-B) compensates for the change of beam direction that occurs after the beam passes
through the AOM when changing the AOM RF frequency. The double passed λ/4 wave plate

73changes the polarization of the master laser from horizontal to vertical so that the master laser
beam can be totally reflected by the polarization beam splitter (PBS) to overlap with the slavelaser output. The λ/2 wave plate and Faraday 45 o rotator are used to match the linear
polarizations between the injected master laser and slave laser fields. The slave laser frequency ismonitored by a Doppler-free saturation absorption setup [81]. We use a mechanical shutter(Uniblitz LS2T2, 2 mm aperture) to switch the cooling laser on or off. To increase the switching
speed of the shutter, We use two lenses to focus the beam at the shutter center. The optical switch
rising (falling) time is about 200 (300) µs. The final output of cooling laser beam is coupled to asingle-mode PM fiber that directs the laser beam to our atom-chip cell system.

(a)

(b)

Figure 4.8: Master-slave injection locking signals. (a) Double-path AOM frequency shift is
δ=2f=203 MHz. (b) Double-path AOM frequency shift is δ=2f=133 MHz. The red-detunings ofthe slave laser output to the cooling transition are 9 MHz and 79 MHz, respectively.
The master laser is locked to the crossover of the transitions F=2 to F'=3 and F'=1, i.e., 212
MHz red-detuned from the cooling transition F=2 to F'=3, as shown in figure 4.6. The slave laser
has an output power of 60 mW at the operating current of 92 mA. The operating RF frequency
range of the AOM1 (Crystal Technology Inc, part number 3080-122, central RF frequency
80MHz, wavelength 780–850nm) is 60–110 MHz. The red-detuning of the cooling laser iscalculated by∆ν = 212MHz − 2δ ,(4.1)

where δ is the AOM RF frequency. As shown in figure 4.8, we can freely tune the injection lockedslave laser frequency red-detuning ∆ν from 9 MHz to 79 MHz. The operating cooling laser
frequencies of different cooling stages are shown in table 4.1.

74
Table 4.1: Cooling laser frequency detuning at different cooling stages
δ (MHz)∆ν (MHz)
Mirror MOT

101.5

9

CMOT

94.5

23

PGC

70

72

To evaluate the performance of injection locking, we define two parameters: (1) the locking
fraction (LF) and (2) the locking range (LR). The LF is defined as the ratio of the slave output
power, locked to the injected master laser frequency, to the total slave-laser output power. The LR
is defined as the frequency locking range, in which the slave laser stays locked while thefrequency detuning ∆ν changes from 9 MHz to 9 MHz + LR by adjusting the AOM RF
frequency. The LF tells us how well the slave laser is injection locked at some specific frequency,
and the LR is crucial for obtaining a large frequency detuning ranges, as shown in table 4.1.
Figure 4.9 shows the LF vs the injected master laser power at ∆ν = 9 MHz. The LF ismeasured with Doppler-free saturation absorption and compared to a reference ECLD output. At
each point of injected master laser power, the injected laser beam alignment is optimized tomaximize the LF. The required injected power to lock the slave laser with LF=1 is very low (<0.1mW), as shown in figure 4.9.
In the experiment, we find that the injected master laser power only drops by a factor of 1/2
when changing ∆ν from 9 MHz to 72 MHz. Thus, from figure 4.9, we deduce that the LR islarger than 60 MHz if the injected laser power at ∆ν = 9 MHz is more than 1 mW. However, thisis not true because the double-path AOM setup is not ideal and the injected master laser beamchanges its direction and wave front when we change the AOM frequency. As a result, the mode
matching between the slave laser and master laser varies at different AOM frequencies. The LR vs
the injected master laser power at ∆ν = 9 MHz is shown in figure 4.10, which shows how the LR
starts to drop linearly when the injected master laser power drops below 4 mW.

75

Figure 4.9: Slave laser locked output fraction vs injected master laser power.
Therefore, in the injection locking system, mode matching is more crucial than the injected
master laser power. Mode mismatching dramatically reduces the locking range and requires muchhigher power to lock the slave laser. Mode mismatching in a real system is caused by manyfactors, including beam alignment, waveform distortion from the AOM, and the slave laser diodetemperature. We find that, among these factors, the stability of the slave laser diode temperature is
the most important. If the temperature controller cannot servo the LD temperature very well,changing laser power while switching the AOM frequency significantly affects the slave LD
internal cavity modes. We have tested our system with more than 50 mW of injected master laser
power, and we have not seen any improvement when compared to lower injected power (20 mW).
However, a high injected master laser power makes it more difficult for the controller to stabilize

76
the LD temperature.
In our optimized injection locking system, the injected master laser power at ∆ν = 9 MHz
is about 24 mW. We run the slave laser diode at 92 mA, which is lower than the recommended
operating current of 110 mA, to optimize temperature stability. The slave laser output is about 60
mW, and the final output after the fiber is about 30 mW. The system is capable of output up to 50
mW of power after fiber coupling if we operate the slave LD at 120 mA.

Figure 4.10: Injection locking range vs injected laser power.

4.4

Repumping laser
In an ideal two-state closed system, one cooling laser with six beams and a quadrupole

magnetic field are enough to form a MOT. However, as shown in figure 4.6, there are many
hyperfine levels in the real 87Rb D2 transitions where the cooling transition is not completely
isolated. The cooling laser beam not only couples the ground state |5S1/2, F=2> with the excitedstate |5P3/2, F'=3> but also pumps the atoms from |5S1/2, F=2> to other excited hyperfine states|5P3/2, F'=2> and |5P3/2, F'=1> through nonresonance pumping effect. The atoms pumped to theF'=2 and F'=1 states have decay channels to the dark ground state |5S1/2, F=1>. Thus, all atoms
finally fall away from the cooling transition. To have a continuous cooling process, we must
repump the atoms back to the cooling transition. We do this by adding a repumping laser beam,
which is locked to the on-resonance transition from F=1 to F'=2, as shown in figure 4.11. The

77
on-resonance saturation intensity of the repumping transition is 5.94 mW/cm2.

Figure 4.11: 87Rb D2 line hyperfine energy levels and the MOT repumping transition. The
repumping laser, locked to the on-resonance transition F=1 to F'=2, is used to repump atoms fromthe dark ground state |5S1/2, F=1> to the state |5S1/2, F=2>.

Figure 4.12: Repumping laser optical setup before coupled to the fiber. λ/2: λ/2 wave plate; L:lens; OI: optical insulator; AOM: acusto-optical modulator; PBS: polarization beam splitter.

78
The repumping laser output optical setup is shown in figure 4.12. The repumping laser is
one of our home built ECLD with a low power Sharp laser diode (LT024MD) and outputs about
12–15 mW. The laser frequency is locked to the crossover of the transitions from F=1 to F'=2 andF'=1 and thus is 78.6 MHz red-detuned from the repumping transition F=1 to F'=2. This frequency
detuning is compensated by taking the first order diffraction beam from the AOM2 (Crystal
Technology Inc, part number 3080-122, central RF frequency 80MHz, wavelength 780-850nm)
operated at 78.6 MHz. The combination of the AOM2 and the optical mechanical shutter, shownin figure 4.12, provides rapid control of the repumping laser power.
After the shutter, the repumping laser is coupled, together with the pumping laser beam
(section 4.5), into a single mode PM fiber that directs the laser to the atom-chip system. The
power of the repumping laser from the fiber output is about 6 mW.

4.5

Pumping/probe laser
The optical pumping and imaging probe laser beams do not require high power and allow

us to use a single home-built JILA mount ECLD to provide power for both of them. The pumping
and probe transitions are shown in figure 4.13. The pumping/probe laser is locked to the crossoverof the transitions from F=2 to F'=3 and F'=2. As shown in figure 4.14, the laser output from the
ECLD is split in two with a PBS: a pumping laser beam and a probe laser beam, whose
frequencies are controlled by the AOMs (Crystal Technology Inc, part number 3110-120, central
RF frequency 110MHz). The pumping beam, together with the repumping laser beam, is coupled
to a single-mode PM fiber. The probe beam is coupled to another single-mode PM fiber.
In the MOT, the atoms on average populate all Zeeman sublevels of state |5S1/2, F=2>
because of the degeneracy caused by spherical symmetry. However, in the atom-chip magnetic
trap, only atoms in weak-field-seeking states MF=2 and MF=1 can be trapped. To improve themagnetic trap loading efficiency, we optically pump all atoms to a single Zeeman sublevel |5S1/2,
F=2, MF=2> by applying a circularly polarized σ+ pumping laser beam and a magnetic bias fieldalong the beam direction.

79

Figure 4.13: 87Rb D2 line hyperfine energy levels and the pumping and probe transitions.

Figure 4.14: Pumping/probe laser optical setup before coupled to the fiber. λ/2: λ/2 wave plate; L:lens; OI: optical insulator; AOM: acusto-optical modulator; PBS: polarization beam splitter.

80
Figure 4.15 shows the pumping effect schematically. Before optical pumping, the atoms on
average populate all ground state Zeeman sublevels [figure 4.15(a)]. These Zeeman sublevels split
under a uniform bias magnetic field B, and all the atoms are pumped into the dark state MF=2
after applying a σ+ circularly polarized beam [figure 4.15(b)]. The average frequency detuning ∆ν
can be determined by

∆ν =

1
1
Bµ B ∑ [g F ' ( M F + 1) − g F M F ] = B × 0.815MHz / G ,4
M F = −2

(4.2)

where g F =1/2 and g F ' =2/3 are the Lande factors, and µB is the Bohr magneton. In our
experiment, we fix the frequency detuning of the pumping laser at 12.6 MHz and optimize thebias field at 13 G, which is fairly consistent with equation (4.2).

(a)

(b)

Figure 4.15: Schematic of the optical pumping effect. (a) Before optical pumping, the atoms on
average populate the degenerated Zeeman sublevels. (b) With optical pumping, all the atoms are
pumped to the MF=2 state.

The probe transition is from |F=2, MF=2> to |F'=3, MF'=3>. Figure 4.16 shows the Zeeman
sublevel splitting under a uniform bias magnetic field B. The frequency detuning ∆ν can be
determined by∆ν = Bµ B (3g F ' − 2 g F ) = B × 1.39MHz / G .

(4.3)

81

Figure 4.16: Schematic of the probe absorption under a bias magnetic field.

4.6

Fiber coupling
From the laser sources to the atom-chip system, the laser beam wave front is distorted bymany optical components, including AOMs, isolators, and mirrors. We use single-mode PM fibers
to get very clean Gaussian beam shapes. On the other hand, the fiber coupling is also part of our“plug-in” concept. We disconnect all the fibers before we assemble the atom-chip cell to the small
table (figure 4.2). After the cell has been plugged in, we connect the fibers back to the atom-chiptable directly.
Here we design an inexpensive PM fiber-coupling kit based on the commercially available
components listed in table 4.2. The system setup diagram is shown in figure 4.17. The laser beam
input comes from the forwarded AOM and mechanical shutter output. We use the two lenses tonot only focus the laser beam onto the shutter plane to increase the shutter speed, but also toreshape the laser beam to optimize the mode matching for fiber coupling. The two mirrors areused to adjust the beam height and direction. The PBS works as a linear polarizer to remove thedistortion of polarization before being coupled to the single-mode PM fiber. The λ/2 wave plate infront of the coupling package is used to rotate the linear polarization to match the PM fiber axes.
The coupling package, purchased separately from Thorlabs, includes a SM1 Z translator, a SM1

82
FC fiber adaptor, an aspheric lens, and other components as listed in table 4.2. The output,
mounted on the atom-chip cell table, is collimated by an achromatic lens.
We have demonstrated that the above compact, simple, and inexpensive fiber-couplingsystem provides a coupling efficiency >70% and an output extinction ratio of >30 dB.

Figure 4.17: Optical fiber coupling system diagram. L: lens; M: mirror; PBS: polarization beam
splitter; SMF: single mode fiber.
Table 4.2: Commercial part list of fiber coupling.
Name
Description
CompanyM
New Focus NIR Mirror 5102
New Focus
λ/2
PBS
Coupling
package

SMF
L

4.7

Half-wave plate, NH-100-0780

Meadowlark
opticsThorlabs
Thorlabs

Polarization Beam Splitter.
• Thorlabs SM1 Z translator (SM1Z)• Thorlabs SM1 FC fiber adaptor (SM1FC)• Thorlabs SM1 thread cage plate (CP02)• Thorlabs SM1 retaining ring (SM1RR)• Thorlabs lens f=11.00mm 0.25NA Mounted
Geltech™ Aspheric Lens (C220TM-B)• Thorlabs SM1 Aspheric Lens Adapter (S1TM09)
Single Mode Fibler, OZ Optics PMJ-3838-850-5/125-3-2-1
OZ Optics
Lens, f=35mm, Thorlabs achromatic boublet LAC628-B
Thorlabs

Atom-chip cell optical table
We use a 61 × 61 × 1.9 cm aluminum optical board to accept the atom-chip cell andpolarization optical setup for laser cooling, trapping and imaging. A photo graph of the atom-chipcell table is shown in figure 4.18. Tthe optical polarization configuration is shown in figure 4.2.

83
All laser inputs come from the fiber coupling described in section 4.7. The cooling laser
splits into four beams for the mirror MOT configuration. The repumping and pumping laser
beams, from the same fiber, are separated by a λ/2 wave plate and the PBS. The circularly
polarized imaging beam, along the y direction, reflects from the atom-chip mirror and goes to an
Apogee CCD camera, which is not shown in figure 4.18.

Figure 4.18: Atom-chip cell table (61 × 61 cm ).

4.8

Imaging setup

4.8.1

Camera configuration
The camera system shown in figure 4.19 includes three video CCD cameras (WATEC

censor WAT-902C), one PixeLink CMOS camera (PixelLINK PL-A633), and one Apogee CCD
camera (AP1E). In the MOT alignment, video cameras 1, 2 and 3 are involved. Video cameras 1
and 3 are used to adjust the coil hat (defined in section 5.3) to optimize the mirror MOT position.
After the mirror MOT is located at the center of the chip, the coil hat is locked down. Then we
adjust the laser beams to optimize the MOT atom number by looking at the images from video
cameras 1 and 3. This is a coarse adjustment. Further optimization of the mirror MOT and chip84
MOT require video camera 2, with a large zoom and an interference filter. The PixelLink camera,
with a calibration of 50µm/pixel, is used to take absorption images for the MOT, which istypically >0.8 mm away from the chip surface. The Apogee camera with a calibration of 5~6µm/pixel is used to take reflection images of the microchip traps very close to the chip surface(<0.5 mm).

Figure 4.19: Camera setup for atom-chip experiments.

4.8.2

Atom-chip surface reflection imaging

It is a challenge to image an atom cloud very close to a surface directly because of thediffraction pattern of the chip. A typical technical limit of the distance from the chip surface isabout 100 µm. To image an atom cloud beyond this limit with a probe-beam passing through, thecloud must be moved farther away from the chip surface, e.g., 200 µm. In our atom-chip cell, thelimiting condition is even worse because the chip is used to seal the glass cell and there isroughness in the junction between the chip and the glass cell due to the use of epoxy. This

85
condition prevents us from imaging atoms directly less than 500 µm away from the surface.
Fortunately, we can use the sliver mirror integrated on top of the chip surface for theabsorption reflection imaging as shown in figure 4.20(a). We get two atom clouds in images
because of the reflection, as shown in figure 4.20(b). The distance from the surface can be
determined precisely by measuring the separation of the two cloud images.

(a)

(b)
Figure 4.20: Atom-chip surface reflection imaging. (a) Absorption reflection imaging setup. (b)An atom-chip in-trap reflection image.

86

Chapter 5. Electronic system
We take advantage of commercial electronic technologies such as high speed computers,
multiple-channel analog output boards, imaging data acquisition (DAQ) systems, and ultrastablecurrent power supplies. Without them, we would not be able to run our atom-chip experiments.
The schematic block diagram of our computer-based electronic system is shown in figure5.1. We use two Gateway computers, a controller computer and a DAQ computer, to run our
atom-chip experiments. By sending commands from the controller computer via the NI PXI-1002
chassis, we use a 32-channel analog output board, PDXI-AO-32/16, to control all terminal devices,
including current power supplies, optical shutters, AOM drivers, and the camera trigger, etc.. The
DAQ computer takes imaging data from the camera and does data processing. We developed
LabView programs with user friendly interfaces for controlling the atom-chip experiment, DAQ,
and file management.

Figure 5.1: Schematic diagram of the atom-chip computer-based control and DAQ system. NI
PXI-1002: National Instrument PXI Chassis; PDXI-AO-32/16: UEIDAQ 16-bit 32-channel PXI
analog output board.

87
In the following sections, we describe in detail the most important parts of the electronicsystem for controlling and DAQ. Then we provide technical information about the magnetic coilhat, current power supplies, and RF drivers.

5.1

Computer-control system
The computer-control system includes the controller computer, the NI PXI-1002 chassis,

the PDXI-AO-32/16 board (shown on the left side of figure 5.1), and the LabView control
programs. The NI PXI-1002 is a 4-slot, 3U PXI chassis that forms the basis for low-cost PXI
systems. The PDXI-AO-32/16 board, purchased from UEIDAQ, has 32-channel analog outputs(±10V, 16 bit). The analog output can be operated at a very fast speed of <100 µs per channeleven when all 32 channels are on simultaneously. We have demonstrated that such an analog
output board can be used to control BEC experiments, replacing the many-channel DIO (digital
input output) board used in most cold-atom systems. Using the PDXI-AO-32/16 analog output
board dramatically reduces the work load and cost of developing user software.
The PDXI-AO-32/16 board can be configured to work in either single update mode orbuffered output mode. When the board works at single update mode, the analog output channels
change value only when they receive a command from the computer; thus the speed is limited by
the software and the computer. In the buffered output mode, the computer fills the on-board
buffers first, and then the board starts to output waveforms when it receives a software trigger
signal. The output speed of the buffered mode, determined by the configuration of the on-board
internal clock, is independent of the computers and their operating systems. Inside the analog
board, there are a total of four buffers to allow cycling the buffers without interrupting the output
with infinitely long wave forms. The single update mode has a typical response time of >1 ms,
and the buffered mode of <100 µs.
We use the single update mode to control the experiment continuously from the computer
front panel, as shown in figure 5.2. This program is used to optimize the atom-chip mirror MOT.

88

Figure 5.2: Front panel of MirrorMOT2004V3.1.VI with single update
We use the buffered output for running atom-chip BEC experiments, where it is critical tocontrol different devices with precise relative timing. In this mode, the computer generates all the
waveform data once before the output. For the buffered output mode, we have developed anddemonstrated the concept of universal many-channel timing management, which is independentof hardware. The key feature of this management concept is how it represents and edits arbitrary
wave forms. Here we consider only the wave forms with linear ramps such as the one shown infigure 5.3. We represent the single wave form as a 2D array vector, as shown in table 5.1.
For many channels, we use two methods to represent timing vector array information. The
first method uses a 3D array to record all channel timing vectors, and the second extends the 2D
array to a 2D table. Here we take a two-channel output, as shown in figure 5.4, as an example.
The 3D array representation has two independent 2D arrays (see table 5.2), and the extended
timing table has only one 2D array (see table 5.3).

89

Figure 5.3: An example of a single channel wave form with only linear ramps.
Table 5.1: 2D array representation of the wave form shown in figure 5.1-2.
Time
t0
t1
t2
t2
t3
t4
t4
t5
t6

Output
V0
V1
V1
V2
V3
V4
V5
V5
V6

Figure 5.4: An example of a 2-channel wave forms with only linear ramps.

90

Time
t0
t1
t2
t2
t4
t5
t5
t7
t8

Table 5.2: 3D timing array for 2-channel waveforms shown in figure 5.4.
Output 1
Time
Output 2
V10
t0
V20
V11
t3
V23
V11
t6
V26
V12
t8
V26
V14
V15
V16
V16
V17
Table 5.3: Timing table for 2-channel waveforms shown in figure 5.4.
TimeOutput1
Output2
t0
V10
V20
t1
V11
V21
t2
V11
V22
t2
V12
V22
t3
V13
V23
t4
V14
V24
t5
V15
V25
t5
V16
V25
t6
V16
V26
t7
V16
V26
t8
V17
V26

We use both timing representations in the user interface. The timing table is used to edit andmonitor the global timing between different channels, and the timing channel arrays are used toedit and monitor individual channels without affecting others. After the timing vector array iscreated, it is converted into 2D 16 bit integrals, the format required by the analog output board,when we run atom-chip experiments.
Our single LabView program provides a user interface not only for timing management, butalso for configuring all hardware in the experiment, as shown in figures 5.5–5.10. The timing
vector array information and channel configuration can be saved to files both in the timing tableformat (*.txt) and the channel timing array format (*.tim).

91

Figure 5.5: Timing table editor front panel sheet

Figure 5.6: Channel timing array editor front panel.

92

Figure 5.7: Imaging controller front panel.

Figure 5.8: Wave form browser front panel.

93

Figure 5.9: PDXI-AO-32/16 board configuration front panel sheet.

Figure 5.10: RF sweep controller front panel (for RF forced evaporative cooling).

94

5.2

Imaging control and DAQ
In our atom-chip experiments, we detect cold atom clouds using absorption imaging. The

controller computer system, described in section 5.1, generates a 100 µs probe laser pulse bycontrolling the AOM and mechanical shutters (described in chapter 4) to illuminate the atom
cloud on the chip. When the Apogee camera receives the trigger signal associated with the probe
pulse, it sends the imaging data to the DAQ computer for data processing.
For each measurement, we take three shots to determine atom cloud optical depth (OD).
The first shot is an absorption frame with the atom cloud, described as I abs ( x, y ) , where x and y
are two-dimensional imaging plane coordinates. The second shot, called the background frame,

I back ( x, y ) , is taken in the same way as the first one but without atoms present. The third shot isthe dark frame, I dark ( x, y ) , made without flashing the probe pulse, that represents the bias
reading from the CCD sensor. The OD can be calculated by⎛I− I dark ⎞⎟⎟ .
OD( x, y ) = ln⎜⎜ back−I
I
dark ⎠
⎝ abs

(5.1)

The three shots are taken within a very short time interval, 1.5 s in our experiment, to reduce thesystematic noise between different shots. The control timings are shown in figures (5.11) and(5.12). The probe and repumping pulses are 100 µs long. The camera shutter (25 mm aperture,
Vincent Associates, Uniblitz VS35) is mounted in front of the camera lens without touching any
part of the optical table. After an OD image is obtained from the three frames using equation (5.1),
it is fitted to a 2D Gaussian profile. Combining the trap parameters, we get the atom number, atom
density distribution, temperature, phase-space density, and other physics quantities from the OD
absorption measurement (for details, see chapter 2). The Labview program front panel is shown infigures 5.13 and 5.14.

95

Figure 5.11: Absorption and background imaging timing with a probe pulse.

Figure 5.12: Imaging timing for the dark frame.

96

Figure 5.13: Part of the Labview front panel of the absorption imaging process

Figure 5.14: Part of the Labview front panel of the absorption imaging process program shows
our first BEC on the atom chip with x and y cross-section plots and 2D fitting.

97

5.3

Magnetic coil hat
As discussed in chapter 2, we use the atom-chip mirror and external 45o anti-Helmholtz coilpair to load cold atoms into the mirror MOT. At the atom-chip U-wire surface MOT and theZ-wire microtrap, we apply external bias fields generated by the magnetic coils. The external
magnetic bias fields are also used to manipulate the cold atoms. Therefore, the coils play one of
the important roles in the entire atom-chip system.

Figure 5.15: Atom-chip mirror MOT configuration with the coil hat.
The small size of the atom-chip cell (1 × 1 cm) allows us to easily assemble all the coils
into a compact and rigid unit without using water cooling setup. Another advantage of small coils
is that we can build them with very low inductances. Low coil inductances are important for
switching the external magnetic fields on and off rapidly because the atom-chip experiments havemuch shorter time scales than traditional large BEC systems due to the shorter trap lifetime.
Figure 5.15 shows the coils and laser beams configuration schematically. The assembly of all four
pairs of coils, together with their mount structure, is called the atom-chip magnetic coil hat.
We have built two different versions of coil hats: one with circular coils and a second withrectangular coils. The circular coil hat was built in 2002 for 1 × 1 cm atom-chip cells. Afterdemonstrating atom-chip BEC in the 1 × 1 cm cell, we built a second version, the rectangular coilhat, which is capable of accepting a larger cell with a size of 2 × 2 cm. The following two
subsections give detailed specifications for the two coil hats. However, all the experimental results

98and measurements that do not specify the coils in this thesis are done with the circular coil hat.

5.3.1

Circular coil hat
The circular coil-pair dimensions are defined in figure 5.16. The coil hat specifications areshown in table 5.4. We use 18 AWG (American Wire Gauge, diameter 1 mm) magnetic wires and
BIPAX Tra-bond epoxy (Tra-con, BA-2151, blue color) to make the coils. Then the MOT coils
are mounted to an aluminum frame. The three pairs of bias coils are glued together by Devcon 5
minute epoxy. Finally, we assemble the bias coil set and MOT coils with the aluminum mountstructure to form our coil hat, as shown in figure 5.17. The coil hat has a clear aperture size of 25
× 25 mm for plugging an atom-chip cell vertically.

Figure 5.16: Dimensions of a circular coil pair. r: average radius; ∆: difference of the radius; d:separation of the two coils; t: thickness of a single coil.
Table 5.4: Specifications of the circular coil hat
X bias coilr (mm)∆ (mm)t (mm)d (mm)N (turns per coil)R, resistance
27 oC
100 oC(Ω, per coil)
L, inductance(µH, per coil)
Field at the center

23.5
5
5
34
16
0.045
0.062
29
4.55 G/A

Y bias
coil
33.5
7
7
34
36
0.14
0.2
229
9.5 G/AZ bias coil

MOT coil

23.5
7
7
81
36
0.1
0.14
148
2.4 G/A

56.72
13
13
54
100
0.68
0.94
3377
3.35 G/cm A

99

Figure 5.17: Pictures of the circular coil hat.

100
5.3.2

Rectangular coil hat
We built the second version of the coil hat with rectangular coils. The dimensions andspecifications of the coils are given in figure 5.18 and table 5.5. There are two sets of x-bias coils
which allow both high resolution and high field magnitude for many purposes. The rectangularcoils are much easier to integrate into one hat unit because they have more contact area. Figure
5.19 shows two views of the entire coil hat with a size of 12 × 12 × 16 cm. The rectangular one issmaller than the circular coil hat (14 × 14 × 17 cm, as shown in figure 5.17). However, it provides
a larger aperture (35 × 45 mm) with more flexibility to accept different sizes of atom-chip cells.

Figure 5.18: Dimensions of a rectangular coil pair. a: average width; b: average height; ∆: wire
coil thickness in the coil plane; d: separation of the two coils; t: thickness of a single coil.

Table 5.5: Specifications of the rectangular coil hat.

a×b (mm)∆ (mm)t (mm)d (mm)N (turns per coil)R, resistance 27 oCo(Ω, per coil) 100 C
L, inductance(µH, per coil)
Field at the center

Small X
bias coil
38×77
5
5
40
15
0.07
0.09
39

Big X
bias coil
50×82
10
6.5
56
35
0.18
0.24
257

Y bias
coil
40×80
8
8
51
50
0.23
0.32
460

Z bias coil

MOT coil

41×50
5
5
94
20
0.07
0.1
53

120×120
10
13
48
120
1.1
1.52
6405

3.33 G/A

5.66 G/A

8.58 G/A

1.06 G/A

2.74 G/cmA

101

Figure 5.19: Pictures of the rectangular coil hat.

102

5.4

Current power supplies
Magnetic field fluctuations induced by current noise not only cause atom-trap loss due tospin flips, but also parametrically heats atoms in a magnetic trap [82]. Moreover, because theatoms in a chip trap are much closer to the wires, they are more sensitive to the current noise thanthose in a traditional large BEC system. Therefore, atom-chip experiments require ultrastablecurrent sources to run the chip microwires and external bias-field coils. On the other hand, ourx-direction optical-pumping time is only 100 µs, which requires us to switch the x-bias field on
and off fast enough that its rising and falling times are less than the pumping laser’s pulse length.
As we know, ultrastability often conflicts with high speed requirement. The faster the current canbe switched off and on, the larger the bandwidth; the larger bandwidth a current source has, themore noise its controller cannot suppress. Fortunately, we find that KEPCO power supplies meetboth requirements. We use unipolar KEPCO power supplies for the coil hat: one ATE 15-15M forthe MOT coil and three ATE 6-10M for the bias coils. We use two bipolar KEPCO power supplies(BOP 20-10D) to run the U and Z wires on the atom chip.
We run the atom-chip wires with the full speed of the power supplies, i.e., 0.4 A/µs. The
current modulation bandwidth of the bias coils is limited by their low inductance, i.e., < 300 µH(Table 5.4), and their rising and falling time vs current is shown in figure 5.20. To the MOT coil,
its large inductance (3.4 mH per coil) not only reduces the current modulation speed, but also
induces a 4.0 kHz oscillation because of phase shift caused by the inductance. We connect a 1.9µF capacitor in parallel to the MOT coil to compensate for the phase shift. Figure 5.21 shows thedifference between running the MOT coil without and with the capacitor.

103

Figure 5.20: Switching on and off time of the x, y, and z-bias coils vs current.

104

Figure 5.21: The effect of adding the 1.9 µF capacitor to the MOT coil current stability and its
switching time measurement.

105

5.5

RF drivers
We designed and built RF drivers for the AOMs and RF-forced evaporative cooling, using

commercial RF components from Mini-Circuits.

5.5.1

AOM driver
We use four AOM drivers to control cooling laser injection locking, repumping laser power

and frequency, pumping laser, and probe laser frequencies. The AOM RF driver block diagram isshown in figure 5.22, and its commercial components are listed in table 5.6. The
voltage-controlled oscillator (VCO) generates a sine-wave RF signal in which the frequency iscontrolled by voltage at the control (CON) input port. The output of the VCO passes through, inorder, a transistor-transistor logic (TTL) switch, an attenuator, and an amplifier. We use the TTL
switch to turn the RF output on and off, and the attenuator to adjust the RF power level. The
output power after the amplifier ranges from 1 to 2 W. The CON inputs are designed to be
operated by either its front panel knobs or via remote voltage inputs.

Figure 5.22: System diagram of the AOM RF driver.
Table 5.6: Commercial parts list of the AOM drivers purchased from Mini-Circuits.
Name
VCO

Model NO.
(Mini-Circuits)
ZOS-100
ZOS-150

Attenuator
SwitchAmplifier

ZMAS-3
ZYSW-2-50DR
ZHL-1-2W

Description
50-100 MHz, for repumping laser
75-150 MHz, for cooling laser double path
AOM, pumping and probe lasers
Bandwidth 1-200 MHz
SPDT with TTL Driver, DC to 5 GHz
5-500 MHz, up to 2W output

106
5.5.2

RF coil driver
The difference between the RF coil driver (the dashed box part in figure 5.23) and the AOM

driver, is that the RF source of the RF coil driver comes from an external function generator(Agilent 33250A, 80 MHz function/arbitrary wave form generator), instead of the VCO used in
the AOM drivers. We use the external function generator because a single VCO does not cover thewide bandwidth from DC to 50 MHz, the operating range of RF-forced evaporative cooling. The
function generator is remotely configured by the Labview program (section 5.1) via a GPIP card,and the frequency is controlled by one of the outputs from the PDXI-AO-32/16 analog board, as
described in section 5.1. The RF coil is a single turn of a 18 AWG magnetic wire with a diameterof 13 mm, mounted at the top of the atom chip.

Figure 5.23: System diagram of the RF coil driver (the dashed box) and its input and output.
Table 5.7: Commercial parts list for the RF coil driver purchased from Mini-Circuits.
Name
Function
generator
Attenuator
SwitchAmplifer

Model NO.
Agilent 33250A
Mini-Circuits ZMAS-3
Mini-Circuits ZYSW-2-50DR
Mini-Circuits ZHL-1-2W

Description
80 MHz function/arbitrary wave form
generator
Bandwidth 1-200 MHz
SPDT with TTL driver, DC to 5 GHz
5-500 MHz, up to 2 W output

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Chapter 6. Preparation and optimization
This chapter describes in detail how to prepare and optimize the atom-chip system for
Bose-Einstein condensation (BEC) experiments when a new chip cell is plugged in. It typicallytakes one week to optimize a new chip-cell system for making a successful BEC on the chip.

6.1

Atom-chip cell
After the portable atom-chip cell is pinched off from the pumping station, we plug it into

the small atom-chip optical table (section 4.7) where the coil hat (section 5.3.1) has been removed.
We carefully adjust the chip height to 101.6 mm above the table surface. Then we align all four
magneto-optical trap (MOT) laser beams. The laser beams have a diameter of 8 mm. The twohorizontal cooling beams are cutoff by the chip, leaving 2/3 of them inside the cell in the verticaldirection. The central part of the atom-chip wire pattern is shown in figure 6.1.

Figure 6.1: The atom-chip wire pattern. The U wire (IU, 200 µm wide) is used to create chipsurface magneto-optical trap, and the Z wire (IZ, 100 µm wide) is used to create an IP typemagnetic trap by applying a y-bias field. The wires have a height of about 10 µm.

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6.2

Laser powers and frequencies
After the cell has been plugged into the system and the MOT laser beams aligned, we checkthe laser powers and frequencies before searching for the first mirror MOT.
The cooling laser, initially configured with 9 MHz red detuning from the 87Rb D2 transition
F=2 to F'=3, has 30 mW of power after the fiber output. The master laser is locked to thecrossover of F=2 to F'=3 and F'=1. Because the different laser cooling stages, such as the MOT,
compressed MOT (CMOT), and polarization gradient cooling (PGC), require different
cooling-laser frequency detunings, the cooling laser injection locking must be able to freely jumpfrom a red detuning of 9 MHz down to 70 MHz by changing the AOM frequency.
The repumping laser, fiber output has 6 mW of power at the on-resonance transition from
F=1 to F'=2. The pumping laser, blue detuned at 12.6 MHz from the transition F=2 to F=2, has 1
mW of power after its fiber output. The required probe laser power is less than 1 mW. To probe
nonpolarized atoms in the MOT, CMOT and PGC, the probe laser is locked to the on-resonancetransition from F=2 to F'=3. To probe spin-polarized atoms in a magnetic trap, the circularly
polarized probe laser is 10 MHz blue detuned from the transition F=2 to F'=3 and accompanied abias magnetic field of 7.2 G along the beam direction, i.e., the y direction as shown in figure 4.2.

6.3

External coil mirror MOT
Now we are ready to search for the first mirror MOT using external coils after putting thecoil hat on the atom-chip cell. The MOT coil center is prealigned to 99.6 mm above the table and2 mm below the chip. Before starting to search for the mirror MOT, we turn on the dispenser to 3
A for more than 2 hours to charge the entire vacuum cell, especially the stainless steel part thatacts like a rubidium pump before it is fully coated. After that, we see a very weak MOT from thevideo cameras if everything is all right. Because of our small chip size, the key point in making amirror MOT is to locate the magnetic zero-field position precisely. The error between thegeometric center of our MOT coil and the real magnetic zero-field position must be within 1 mm.

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The real magnetic field position can be shifted if there is any stray field. We move the coil hat to
make the MOT as big and bright as possible and then lock the hat on the table. After the dispenser
has been turned on for more than 4–5 hours, the cell vacuum is fully coated and the MOT
saturates. Such a long time for coating the cell wall is only required the first time we start a MOT
experiment. From then on, we only need 15–30 minutes to load the cell with the rubidium
dispenser.
After the cell rubidium vapor pressure reaches a steady state, we start to optimize the MOT
fluorescence power by aligning the laser beams, adjusting the bias magnetic fields to move the
MOT position, and changing the magnetic field gradient and the cooling laser frequency. The
optimized MOT magnetic field gradient along its axis is 14 G/cm, and cooling laser red detuning
is 9–10 MHz. Since the MOT fluorescence power is a function of both atom number and coolinglaser frequency detuning, optimizing the cooling laser frequency to maximize the MOT
fluorescence power does not necessarily mean maximizing the atom number. Further optimizationof the cooling laser frequency detuning is done by measuring the atom number with absorption
imaging, or optimizing the atom number in the chip Z-wire magnetic trap loading (see section
6.14).

Fluorescence pictures of the mirror MOT are shown in figure 6.2.

(a)(b)
Figure 6.2: External coil mirror MOT fluorescence images. The video camera setup is shownin figure 4.19. (a) is taken by video camera 1 from the front side, and (b) is taken by video
camera 2 from the back side. The dispenser is at 3.0 A.

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We find that more than 30 mW of cooling laser power does not help much in loading more
atoms, but rather makes the MOT unstable. With the total cooling laser power of 30 mW, theintensity is about 60 mW/cm2, which consistent with the theoretical saturation intensity value of
35 mW/cm2 with 9 MHz frequency detuning. The instability of the mirror MOT comes from thefact that we do not have any control over the two 45 o reflection beams and cell wall reflection. As
discussed later in section 6.7, this condition will be more serious for the chip U-wire surface MOT
because of its much shallower trap depth.

6.4

Dispenser operating current
After optimizing the MOT, we determine the dispenser operating current for charging thecell for future experiments. If the dispenser is run at too high a current, the small ion pump will besaturated quickly and the dispenser lifetime will be shortened. On the other hand, a current that is
too low cannot coat the cell wall efficiently for UV LIAD loading because of low rubidium partialpressure. To determine the optimal operating current, we measure the MOT loading vs dispenser
current, as shown in figure 6.3. The operating current is defined as the value at which the loading
time is about 2–4 s. The typical range of operating currents for different SAES Rb dispensers is
3.0–3.5 A. At the operating current, we load 6–8×106 atoms in the external coil mirror MOT.

Figure 6.3: The external coil mirror MOT loading vs dispenser current. The threshold current Ith isabout 2.75 A above which the Rb vapor pressure dominates the background. The operating current
Iop is about 3.0 A.

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6.5

UV mirror MOT
One of the questions frequently asked is how we know our atom-chip cell is good enoughto achieve BEC on the chip. Answering this question is important because it saves time inevaluating the cell quality. In our atom-chip cell, the UV mirror MOT loading plays a key role in
the final BEC on a chip production. Successful BEC production requires that the UV mirror MOT
load at least 6–8×106 atoms and have a lifetime of more than 30 s. The atom number N andlifetime τ are two parameters for judging how good the cell is and what the UV LIAD loading
efficiency and the cell vacuum are.
The UV mirror MOT is loaded by a 3 s UV pulse that desorbs atoms from the cell wall toincrease the rubidium vapor pressure by a factor of more than 30, followed with a 5 s holding time
for recovering the cell pressure. The atom number N is defined as the atom number in the MOT at
the end of the 8 s, and the UV MOT lifetime is the 1/e decay time of the MOT atom number after
the UV is switched off. The atom number N directly determines how many atoms can be loaded tothe chip Z-wire magnetic trap and the initial collision rate for the evaporative cooling toward BEC.
The UV MOT lifetime, determined by the base pressure and the vacuum recovery speed, indicatesthe vacuum pressure of the cell, which limits the final magnetic trap lifetime. On the other hand, along UV MOT lifetime also leads to more atoms left at the end of the 8 s mirror MOT. Typicalmeasured lifetimes are on the order of 30 s. We verify that the MOT lifetime is not determined by
the Rb pressure decay after the LIAD loading. This is done by noting the number loaded into the
MOT after introducing a delay between the UV lamp turn-off and MOT field turn-on. By thismethod, we observe that the Rb partial pressure in the cell decays very rapidly compared to the
MOT lifetime, as shown in figure 6.5. Thus the MOT lifetime is determined by the backgroundpressure in the cell. From the MOT lifetime, we infer the background pressure in the absence of
the UV sources to be 10−10 torr. From the MOT loading 1/e time (~1 s), we estimate the UV
light-induced pressure increase to be a factor of 30.
A typical UV mirror MOT loading and decay curve is shown in figure 6.4, where we also

112
measure the loading time from the background. The consistency between the UV MOT lifetimeand background MOT loading time shows that the cell pressure recovers sufficiently rapidly that
the UV MOT lifetime is determined only by the background pressure. Therefore, in our atom-chipcell, the UV MOT lifetime measurement is a reliable method for measuring the cell vacuum
pressure.

Figure 6.4: UV mirror MOT loading and lifetime measurement. The MOT atom number decay
after the UV pulse is switched off is fitted to an exponential. The background MOT is loaded byturning the MOT magnetic field off and on again after several seconds.

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(a)

(b)
Figure 6.5: UV LIAD cell pressure recovery time measurement. (a) Experimental timing: theMOT fields switch on at δt after the UV pulse turns off. (b) MOT loading steady-state atom
number vs δt shows a very short recovery time (<5 s) after the UV light switches off.

6.6

Bias coils field calibration
After the external coil mirror MOT has been optimized and the coil hat is locked on thetable, we calibrate the bias coils and background stray magnetic fields. The background straymagnetic field shifts the chip U-wire surface MOT position, reduces the cooling efficiency at PGC,
and affects the absorption imaging. Calibrating the bias coils can balance the stray fieldcompletely if the stray field is uniform spatially. On the other hand, the calibration gives a much
more precise relationship between the magnetic field and setting current because in the realsystem, the chip is not centered to the bias coils and the current power supplies have zero shifting.
The calibration is done by measuring the magnetic field vs current with a Gaussmeter (F.W.
Bell 9500). However, there is some bias reading from the Gaussmeter even though it is zeroedcarefully. To measure the absolute magnetic field, we take two measurements by flipping the

114

Figure 6.6: Bias coils calibration.
probe to cancel the bias reading. For example, the first measurement gives a reading

B1 = B + B0 ,(6.1)

where B1 is the reading from the Gaussmeter, B is the unknown magnetic field, and B0 is theunknown bias reading. Then we flip the probe to take the second measurement that gives

115
B2 = − B + B0

(6.2)

From equations (6.1) and (6.2), we get the magnetic field and bias readingB=

B1 − B2
and
2

(6.3)

B1 + B2
.
2

(6.4)

B0 =

The x, y and z-bias coils calibration result is shown in figure 6.6.

6.7

Transferring to the chip U-wire MOT
After the atoms are loaded into the external coil mirror MOT, we transfer the atoms to thechip U-wire surface mirror MOT by replacing the external coil quadrupole magnetic field with thefield generated by the U-wire on the chip (figure 6.1).

(a)(b)
Figure 6.7: Chip U-wire surface mirror MOT fluorescence images. The video camera setup is
shown in figure 4.19. (a) is taken by video camera 1 from the front side and (b) is taken byvideo camera 2 from the back side. The dispenser is at the operating current 3.0 A.
Often, because of the chip UMOT’s small capture volume and light field defects, the chip
UMOT does not show up visually. If this happens, transferring from the external mirror MOT to
the chip UMOT helps us to locate the UMOT position. We have a Labview program that is able toswitch between the external mirror MOT magnetic fields and the chip UMOT magnetic fields. By

116
observing where the atoms move when we switch the magnetic fields from the external mirror
MOT to the chip UMOT, we can find where the UMOT zero potential is. Meanwhile, we adjust
the bias fields until we get a visible chip UMOT. As soon as the chip UMOT is observed and its
bias fields optimized, we optimize the cooling laser beams to make the UMOT as bright as
possible. Remember, when we optimize the cooling laser beam alignments for the UMOT, weneed to make sure that we do not reduce the atom number in the external coil mirror MOT. It
takes some time to optimize the cooling laser beams to both the external coil mirror MOT and thechip UMOT. The power balancing plays a very important role in getting the chip UMOT becauseof its shallow trap depth.
A direct loading of the chip U-wire MOT (UMOT), with U-wire current IU=2 A, y bias field
By0=1 G, from the vacuum background is shown in figure 6.7. Although the direct chip MOT itself
is tiny due to its small capture volume, it does not cause loss in transferring atoms from theexternal coil MOT onto the chip.
To load the atoms from the external coil mirror MOT to the chip U-wire CMOT, we firstcompress the external mirror MOT by increasing its axial magnetic field gradient from 14 G/cm
to 21 G/cm. At the same time, we adjust the bias fields to overlap the compressed external mirror
MOT with the chip U-wire MOT.

6.8

Imaging camera calibration
After the atoms are transferred from the external coil mirror MOT onto the atom chip, we

use the absorption imaging method to probe and detect the cold atoms. We setup two cameras forabsorption imaging, as shown in figure 4.19. The pixelLink CMOS camera is used to image theatoms before they are loaded into the chip Z-wire magnetic trap (ZMT), and the Apogee CCD
camera is used to image the atoms at the ZMT, which is very close to the surface. The probe laser
beam configuration is shown in figure 6.8. The probe beam to the PixelLink CMOS camera ispassing directly through the chip, and the probe laser beam to the Apogee camera is reflected fromthe chip surface.

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We calibrate the pixelLink CMOS camera image scale (50.42 µm/pixel) by imaging the pin
connectors that have 1.27 mm separation. The Apogee CCD camera (6 µm/pixel) is calibrated tothe atom-chip wire pattern dimensions measured by reflection imaging, as shown in figure 6.9.
PixelLink
CMOS
cameraAtom chip

Probe beam forthrough imaging

Cell

ApogeeCCD
cameradirectProbe beam for reflection
imaging

Figure 6.8: Imaging probe beam configuration for both direct-through and reflection
imaging.

Figure 6.9: An Apogee CCD camera image of the atom-chip wire pattern.

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6.9

Mirror CMOTTo transfer all the atoms from the external coil mirror MOT to the chip U-wire MOT, wemust compress the atom cloud to fit the smaller chip MOT volume. We ramp the magnetic field
gradient from 14 G/cm to 21 G/cm, which is determined by transferring from the Mirror MOT to
the chip MOT in section 6.8. We optimize the ramp time, cooling laser frequency, and repumping
power to achieve the maximum cooling efficiency. The optimized ramp time is 20 ms, and thecooling laser frequency is 23 MHz red detuned from the transition from F=2 to F'=3, and therepumping power is 100 µW. The mirror compressed MOT (CMOT) not only compresses the
MOT into a smaller volume ready for loading to the atom chip, but also efficiently cools theatoms from 150–400 µK down to 120 µK by suppressing the light scattering with a further
detuning of the cooling laser and a reduction of the repumping laser power.

6.10

Chip CMOT optimization

After the atoms are transferred from the external coil mirror CMOT to the chip U-wire
CMOT (IU=2 A, By=1 G), rethermalization takes 5 ms because of a slight mode mismatching.
Then the atoms are further cooled and compressed by ramping the bias field from (0, 1, 0) G to (0,2.6, -1.2) G and moved closer to the chip surface in 3 ms. The distance of the final chip CMOT
from the chip surface is about 700 µm. After a total of 8 ms in the U-wire chip CMOT, the atoms
have a temperature of 100–110 µK.

6.11

Polarization gradient cooling
After the chip U-wire CMOT, we use polarization gradient cooling (PGC) to cool the atoms

below the Doppler limit. The CMOT cooling efficiency is very sensitive to any stray magnetic
field and laser power balancing. The bias coil calibration described in section 6.6 helps us to set
the magnetic field very close to zero. Further optimization of the magnetic field is done (as119described in section 6.14) by maximizing the loading efficiency of the atom-chip magnetic trap.
The power unbalancing of the cooling laser beams adds additional heating to the atoms andpushes the cloud to one side. The fine balancing between the four cooling laser beams can be doneby correcting the cloud position shift after a long time PGC, e.g., 20 ms. The PGC time is
optimized to maximize the ZMT loading efficiency (as described in section 6.14) because bothmode matching and temperature are important for ZMT loading. At the end of the PGC, the atoms
are cooled down to 20–50 µK.

6.12

Optical pumping

At this time, we simply add 100 µs of an optical pumping pulse with a bias magnetic fieldof about 13 G after the PGC. The optimization can not be done until we have the chip magnetic
trap. For more about optical pumping, please check section 4.5 in chapter 4.

6.13

ZMT loading optimization

Now we are ready to load the atoms into the chip Z-wire magnetic trap (ZMT). At first, we
calculate the required Z-wire current and bias field to overlap the chip CMOT position byrequiring the trap depth to be 10 times higher than the temperature after PGC. Then we take areasonable amount of time to compress the atoms to some place where the trap has a high enoughtrap depth. After this initial configuration, we start to optimize the ZMT loading efficiency.
We first optimize the loading parameters when the atoms are transferred into the ZMT.
Since the modes are completely mismatched from an isotropic cloud to the high nonisotropic
ZMT, it takes a long time for rethermalization. First, we like to have a large trap volume initially,
but a larger trap volume requires a larger Z-wire current and a smaller y bias field, which
produces a shallower trap depth and lower trap frequencies. Thus, the atoms experience a trap loss
and a low rethermalization rate. To increase the loading efficiency and reduce the rethermalization
time, we ramp the Z-wire current from zero to some current within 1 ms. This Z-wire current

120
ramp scans the trap position from the chip surface to some distance away from the surface insteadof just sitting at some fixed position, and effectively increases the trap volume. This ramp also
forces a large volume of atoms into the trap center quickly and increases the rethermalizaion rate.
After the fast Z-wire current ramp, we ramp the bias field to increase the trap depth. After thisnonadiabatic loading, we adiabatically compress the ZMT with a long sweep by increasing y-bias
field. The loading and compression are schematically shown in figure 6.10. The optimized values
are t1 = 0.3 ms, t2 = 10 ms, t3 = 110 ms, IZ1 = 2–4 A, IZ2 = 2.75 A, By0 = 10 G, By1 = 14 G, and By2= 40–60 G.
Adiabatic compression

Nonadiabatic loading

IZ1

By2

IZ1

By1

By0

IZ2
t3

0
t1

t2

time (ms)Figure 6.10: The Z-wire current and y bias field ramps during ZMT loading andcompression.

6.14

Final loading optimization

As soon as we have a ZMT, we are able to perform a final optimization of the CMOT, PGC,
and optical pumping to maximize the loading efficiency and mode matching.
We optimize the final ramp value of the chip CMOT y-bias field to maximize the ZMTloading efficiency.
We optimize the PGC cooling time and laser frequency to maximize the ZMT loading
efficiency.
We optimize the optical pumping (pulse time length, power, frequency, and magnetic fieldstrength) to maximize the ZMT loading efficiency.

121
Finally, we do the ZMT loading optimization described in section 6.13 again to optimize
both loading efficiency and mode matching. The mode matching is critical to reduce therethermalization time that will be discussed in section 8.2 of chapter 8. Experimentally, we simply
maximize the aspect ratio of the atom cloud at the end of the compression. An optimized Z-trapreflection absorption image is shown in figure 6.11, where the Z-wire current is Iz=4A and y bias
field is 40 G. The image is taken after a 1 ms time of flight (TOF).

Figure 6.11: Reflection absorption image of atoms in a Z-wire trap initially loaded with UV
mirror MOT. Atom number N = 2.55 × 106. Peak optical depth (OD) is 1.55.

6.15

Summary and conclusion

The above optimization procedures are for beginners who are starting atom-chip
experiments without any previous experience. As soon as the control timing has been determined,
we do not need to repeat all the optimization procedures above for a new atom-chip cell. After a
new cell is plugged into, we only need to redo the procedures from sections 6.3 to 6.7 to find theright operating parameters for the MOTs; then we can load the optimized timing file directly.
The optimized control timing recipe for atom-chip BEC production will be described inchapter 7. We find that this recipe works well for plugging in different cells. Only slightfine-tuning of the optimization is required.

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Chapter 7. Bose-Einstein condensation on the chip
As soon as the first Bose-Einstein condensate (BEC) in a neutral atom gas wasdemonstrated in 1995 [3, 4], J.D.Weinstein and K.G. Libbrecht proposed to use chip-patternedcurrents for microscopic magnetic traps and integrated atom optics [83]. Then the realization ofcold-atom guiding [5, 7] and manipulation [6, 9, 10, 84] using lithographically patterned wires onsubstrates, or atom chips, attracted research interest in chip-scale cold-atom optics. However,
because of the difficulty in loading large numbers of atoms to atom-chip traps, which have small
volumes and shallow depths, the first BEC on a chip was not realized until 2001 [14, 15]. The
realization of a chip-based BEC was a scientific and technical milestone towards chip-scalecoherent atom-optics devices, opening the door for integrated matter-wave sensors and quantum
computation. The number of BEC atom-chip systems developed around the world continues togrow[16, 61, 68, 85–87].
With the exception of our portable cell, all the chips in BEC atom-chip systems areembedded into large vacuum chambers, which enable them to load a large numbers of atoms into
magneto-optical traps (MOT) [14, 15, 61, 68, 86], and transfer evaporative-precooled atoms oreven BEC clouds from macroscopic traps into chip micropotentials [15, 85, 87]. Our portable 1 ×
1 cm atom-chip cell is the smallest BEC system in the world. We are pushing ultracold atom
research and applications to an extreme limit and trying to answer the question how small of avacuum cell can be used to achieve a suitable vacuum level and MOT capture volume for direct
BEC production on an atom-chip. As in the rapid development of electronic and opticaltechnologies in the past century (e.g., micro chip processors, semiconductor laser diodes, andoptical fibers), portability and low cost will be the keys to real atom-chip applications in the future.
Our work suggests that a chip-based BEC-compatible vacuum system can occupy a volume ofless than 0.5 liter.
The vacuum cell has been described in detail in chapter 3. The atom-chip wire pattern has
been shown in figure 6.1. This chapter presents how to create a BEC on the portable atom-chip123cell. It is organized by following the experimental procedures in order, from the magneto-opticaltrap (MOT), to the compressed MOT (CMOT), polarization gradient cooling (PGC), opticalpumping (OP), chip Z-wire magnetic trap (ZMT), compression, RF-forced evaporation, and thefinal formation of a BEC.

7.1

Charging the cell
Before we start an atom-chip experiment, we turn on the dispenser at its operating current(see section 6.4) for 30 min to charge the cell by coating Rb on the cell wall and Pyrex helix spiral.
This half hour is also a good time to check the system performance, e.g., the laser powers and
ZMT loading efficiency. Then the dispenser is turned off, and we are ready to make a BEC on theatom chip.

7.2

UV mirror MOT
When the cell pressure has recovered after turning off the dispenser for 15–30 minutes, westart to load the external coil mirror MOT with UV light-induced atomic desorption (LIAD)[reference 6, 64–66, or see section 6.5 for details]. The mirror MOT is loaded by applying a 3 s
UV pulse, which increases the cell rubidium vapor pressure by a factor of 30, followed by a 5 s
holding time for recovering the pressure before going to the next cooling stage. The MOT
magnetic field gradient along the external coil axis is 14 G/cm. The cooling laser is 30 mW and 9
MHz red detuned from the transition from F=2 to F'=3. The repumping laser, locked to theon-resonance transition from F=1 to F'=2, has a power of 6 mW. The UV mirror MOT traps about
6–8 × 106 87Rb atoms, 2 mm away from the chip’s sliver mirror surface. The MOT temperature,depending on the laser beam alignment, varies from 150 to 400 µK, shown in figure 7.1. At the
UV mirror MOT stage, the atom number is the most important parameter for optimization, not thetemperature. The MOT temperature of 150–400 µK is considered as “normal” and can be cooled
down to below 50 µK after the CMOT and PGC. The external coil mirror MOT is optimized to124
obtain as large as possible number of atoms. A typical 330 µK MOT absorption image, taken by
the PixeLink CMOS camera, is shown in figure 7.2. The phase-space density (PSD) is about 3.7 ×
10-9.

Figure 7.1: Time-of-flight (TOF) measurement of the external coil mirror MOT at T = 161 µK,
255 µK, and 330 µK.

125Figure 7.2: Absorption image of the external coil mirror MOT. N = 6.1 × 106, Peak OD = 1.4, σx =239 µm, σz = 409 µm, T = 330 µK, average PSD = 3.7 × 10-9, and Collision rate = 0.8 Hz.

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7.3

External coil Mirror CMOT
After the UV pulse is switched off and the external coil mirror MOT is held for 5 s, the cell

ultrahigh-vacuum (UHV) pressure recovers and the atoms then undergo a compressed MOT(CMOT) stage. The cooling laser’s red detuning jumps from 9 to 23 MHz. The repumping laser
power is reduced from 6 mW to 100 µW. Then we immediately ramp the external coil quadrupole
magnetic field gradient from 14 to 21 G/cm in 20 ms. At the same time, by adjusting the bias
fields, the atoms are moved toward the surface to overlap where the chip U-wire CMOT takes
place at the next stage, about 1 mm away from the chip surface. The mirror CMOT not only
compresses the MOT into a smaller volume ready for loading to the atom chip, but also efficiently
cools the atoms from 150–400 µK down to 120 µK by suppressing the light scattering with anincrease in the detuning of the cooling laser and a reduction of the repumping laser power. The
time of flight (TOF) absorption measurement is shown in figure 7.3. It tells us the temperature at
the end of the external coil mirror CMOT is about 123 µK. The 3D surface and cross-section plots
are shown in figure 7.4. The external coil mirror CMOT has a PSD of 6.7 × 10-8, which isincreased by one order of magnitude from the UV mirror MOT.

Figure 7.3: TOF measurement of the external coil mirror CMOT.

127

Figure 7.4: Absorption imaging of the external coil mirror CMOT. N = 6.3 × 106, Peak OD = 3.4,
σx = 193 µm, σz = 228 µm, T= 123 µK, average PSD =6.7 × 10-8, and Collision rate = 2 Hz.

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7.4

Chip U-wire CMOTAt the end of the external mirror CMOT, the atoms are ready to be loaded into the chip

U-wire CMOT. The external coil quadrupole magnetic field is switched off and replaced with thefield generated by the U-wire (IU = 2 A) and the y bias field (By = 1 G). The chip CMOT is about 1
mm below the chip surface. The atoms are held in this chip CMOT for 5 ms for rethermalization,and then are further cooled and compressed by ramping the bias field from (0, 1, 0) to (0, 2.6, -1.2)
G and moved closer to the chip surface. The distance of the final chip CMOT from the chipsurface is about 700 µm. After the total 8 ms U-wire chip CMOT, the atoms have a temperature of
100–110 µK. The TOF measurement result is shown in figure 7.5 and absorption images in figure
7.6. The PSD, increased by another order of magnitude, now is 1.9 × 10-7.

Figure 7.5: TOF measurement of the chip U-wire CMOT.

129

Figure 7.6: Absorption imaging of the Chip U-wire CMOT. N = 5.9 × 106, Peak OD = 5.0, σx =142 µm, σz = 166 µm, T = 110 µK, average PSD = 1.9 × 10-7, and Collision rate = 4.5 Hz.

130

7.5

Polarization gradient cooling
After the chip U-wire CMOT, we apply a 1.7 ms polarization gradient cooling (PGC) by

increasing the cooling laser red detuning to 70 MHz and switching off all magnetic fields. Thisfurther cools the atoms to 20–40 µK, as shown in figure 7.7. The atom cloud’s 3D surface andcross-section plots are shown in figure 7.8. As compared to the previous chip CMOT, the size ofthe cloud expands slightly because of the missing spatial magnetic field confinement, but thetemperature drops significantly due to the sub-Doppler cooling. The PSD after the PGC is
improved by another order of magnitude to 6.2 × 10-6.

Figure 7.7: TOF measurement after PGC.

131

Figure 7.8: Absorption imaging after PGC. N = 6.2 × 106, Peak OD = 4.6, σx = 154 µm, σz = 171µm, T = 33 µK, average PSD = 1.0 × 10-6, and Collision rate = 2.3 Hz.

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7.6

Optical pumping
During the laser cooling stages from the mirror MOT to the chip surface PGC, no

substantial atom loss is observed, the temperature drops from several hundred µK to 30 µK, and
the PSD increases by three orders of magnitude, from 10-9 to 10-6. Before loading the atoms to thechip Z-wire magnetic trap (ZMT), we optically pump the atoms into the F=2, MF=2
weak-field-seeking state to increase the loading efficiency. The 100 µs pumping laser pulse, witha power of 1 mW and frequency of 12.6 MHz blue detuned from the transition F=2 to F'=2, isaccompanied by an x-bias field of -13 G. During optical pumping, the repumping laser beam is onwith its full power of 6 mW. As shown in figures 7.9 and 7.10, the optical pumping heats theatoms slightly. This heating is unavoidable in a real system where the laser circular polarizationand magnetic field orientation are not ideal. The only goal of the optical pumping is to pump theatoms into the right single Zeeman state for the next atom-chip ZMT. With the help of opticalpumping, the loading efficiency is improved by a factor of more than two, which is crucial to ourportable system because we start with a minimal number of atoms from the mirror MOT.

Figure 7.9: TOF measurement after optical pumping.

133

Figure 7.10: Absorption imaging after optical pumping. N = 6.1 × 106, Peak OD = 4.5, σx = 163µm, σz = 176 µm, T = 40 µK, average PSD = 7.0 × 10-7, and Collision rate = 2.2 Hz.

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7.7

Z-wire magnetic trap (ZMT)
After optical pumping, we turn on the chip Z-wire current and y-bias field to starttransfering the atoms to an initial Z-wire magnetic trap (ZMT). The Z-wire current, Iz, ramps from0 to 4 A within 0.3 ms. The y-bias field, By, ramps from 10 to 14 G within 10 ms. The 10 ms
initial ZMT loading typically traps about 2.5–3×106 atoms with a loading efficiency of more than
40%. At the end of 10 ms, we trap the atoms at a distance of 500 µm below the chip surface, withtrap frequencies of (36, 215, 215) Hz and a temperature of 100 µK. Instead of turning on the ZMTimmediately, our ramp loading schedule increases the effective trap loading volume by scanning
the trap position back and forth to load as many atoms as possible. The PSD is about 2 × 10-7, andthe collision rate is about 5 Hz.

7.8

ZMT initial compression
Immediately after the ZMT initial loading, we start to compress the trap. At first, we keep

the Z-wire current at 4 A and ramp the y-bias field from 14 to 60 G in 100 ms. At the same time,
the x-bias field increases from 0 to -4 G to reduce the spin-flip loss at the trap bottom. At the endof this initial compression, the atoms are brought to 126 µm below the chip surface, with trap
frequencies of (30, 2500, 2500) Hz at the trap center. This initial 100 ms compression increases
the trap depth and collision rate. The atoms, at this moment, mostly experience the linear trap
slope rather than the harmonic trap bottom in the y-z plane. In the x axis, the second-orderharmonic potential is not enough to describe the trap. The atom temperature in the compressed
trap is about 400 µK, measured by TOF images. The PSD is about 2 × 10-7, and the collision rate
is about 77 Hz.

7.9

ZMT compression and forced evaporative cooling
After the ZMT initial compression, we further compress the trap by reducing the Z-wire135current Iz from 4 to 2.75 A in 2 s and keeping the x, y-bias fields constant. The final trap positionis 82 µm away from the surface with trap frequencies of (23, 3600, 3600) Hz. The important goalof this compression is not only to increase the trap frequencies, but also reduce the Z-wire current
to minimize heat dissipation. At the beginning of this compression, we also start the first RF
sweep from 45 to 13 MHz for 2.46 s. It is then followed by a 1 s sweep from 13 to 5 MHz, a 500
ms sweep from 5 to 3.5 MHz, and a final 250 ms sweep from 3.5 to 2.85 MHz, as shown in figure
7.12. We must keep in mind that, during the compression and the first RF sweep, both
surface-induced and RF-forced evaporation exist. The total RF evaporative cooling takes 4.21 s.
However, it is hard to observe evaporative cooling effect directly from the highly
compressed ZMT. For example, after the first RF sweep, we have only 0.5 µ 106 atoms (T = 158µK) left and 1 ms TOF image has a peak OD of less than 0.1, which is below the backgroundnoise. To measure the cooling effect and the enhancement of PSD, we decompress the trap by
ramping the y-bias field from 60 G to 36 G and the Z-wire current from 2.75 A to 4A in 100 ms
before absorption imaging. The decompressed trap has frequencies of (35, 890, 890) Hz and a trap
distance of 200 µm from the chip surface. The adiabatic decompression improves the imaging
quality dramatically by cooling the atoms to a lower temperature and moving the trap far awayfrom the chip surface. On the other hand, the adiabatic decompression maintains the PSD.
Therefore, all quantities reported in this thesis after the RF evaporation are measured after thedecompression.
The four RF sweeps are optimized to maximize the peak OD at TOF imaging but not the
PSD, because the OD is proportional to the collision rate [88]. The optimization of the RF sweeps
is crucial to achieve run-away evaporation. If the collision rate drops all the way through the RF
evaporation (i.e., there is no runaway evaporation), the PSD may not able to reach the BEC
transition before evaporating away all the atoms. In our atom-chip experiment, by carefully
optimizing RF sweeps, we demonstrate that the runaway evaporation condition and BEC arereached with 2.5–3.0 × 106 atoms at the initial ZMT. For the first logarithmic sweep, we fix theRF frequency from 45 MHz to ν1 = 13 MHz and optimize the sweep time. During the

136
optimization of the first sweep, we measure the bottom RF frequency νb to be about 2.9 MHz.
After the first sweep of 2.46 s (t1), we extend the sweep with the same linear slope to the bottom
frequency νb to determine the next stop time t2. Then we optimize the second logarithmic sweep
from t1 to t2 with the stop RF frequency ν2 where the peak OD at 5 ms TOF starts to drop. Thenwe fix the stop RF frequency ν2 to optimize t2 for the final optimization of the second sweep. In asimilar way, we optimize all RF sweeps until finally we observe a BEC phase transition at 2.85
MHz.
Figure 7.11 shows the peak OD and PSD as functions of the stop frequency ν3 at the third
RF sweep. The tuning point, 3.5 MHz, where the OD starts to drop, is the optimized stopfrequency ν3. Table 7.1 gives the atom number N, temperature T, peak OD, collision rate γ, and
PSD after each RF sweep and shows clearly the efficient cooling. The phase transition at the lastRF sweep vs the final stop frequency is shown in figure 7.13(a).

Figure 7.11: The atom number N, temperature T, peak OD, and average PSD as functions of thestop frequency ν3 at the third RF sweep (TOF 5ms images).

137
Table 7.1: Atom number N, temperature T, peak OD, collision rate γ, and PSD after each RF
sweep. T1, γ1 are the temperature and collision rate before the imaging decompression; and T2,γ2 measured after the decompression.
RF sweep
(MHz)
45
45→13
13→5
5→3.5
3.5→2.85

Time
(ms)
2460
2460
1000
500
250

Atom number
N (103)
850
500
186
42
3

Temperature
T1 : T2 (µK)
246 : 100
158 : 64
32 : 13
11 : 4.4
0.57 : 0.23

Collision rate
γ1 : γ2 (Hz)111 : 18
102 : 17
186 : 31
124 : 21NA

PSD
1.0×10-6
2.0×10-6
9.0×10-5
5.3×10-4>10Figure 7.12: RF logarithmic sweeps for forced evaporative cooling.

7.10

BEC on the chip

At the end of the final sweep, we observe a Bose-Einstein condensate of 2000 87Rb atoms at
a transition temperature of about 300 nK [Figure 7.13(a)]. As shown in figure 7.13(b), thenonisotropic shape during a 9 ms TOF is a clear signature of a Bose-Einstein condensate. The
BEC lifetime is about 300 ms, limited by the heating from technical noises and mechanicalvibrations (will be discussed in section 8.6 of the next chapter).

138

Figure 7.13: Images of a Bose-Einstein Condensation on the atom chip. (a) Absorption images aretaken after a 5 ms TOF with different final RF frequencies. From left to right: (1) ν = 3.5 MHz, N3-43= 42 ä 10 , T = 4.4 µk, <PSD> º 6 ä 10 ; (2) ν = 3.0 MHz, N = 20 ä 10 , T = 1.4 µk, <PSD> º 7
-3
3
-1
3
ä 10 ; (3) ν = 2.9 MHz, N = 10 ä 10 , T = 515 nk, <PSD> º 10 ; (4) ν = 2.85 MHz, N = 3 ä 10 ,T = 230 nk, <PSD> º 10. (b) TOF images of BEC cloud after release with final RF frequency
2.85MHz. From left to right: TOF (1) 1 ms, (2) 3 ms, (3) 5 ms, (4) 7 ms, and (5) 9 ms. The
nonisotropic shape during TOF is a key signature of BEC.

Figure 7.14: Longitudinal BEC atom cloud’s optical depth profile, taken at TOF 9 ms, fitted to adouble gaussian distribution.

139

7.11

Summary and conclusion
We have successfully demonstrated Bose-Einstein condensation in our compact andportable atom-chip vacuum cell. At the low-cost input side, we have a 1 × 1 cm glass cell pumped
by a small 8 L/s ion pump, total laser power of less than 40 mW, and low current power supplies(<7 A). At the output side, we load 6–8 × 106 atoms in the mirror MOT, transfer about 40 % of theatoms into the chip ZMT, and finally create 2 × 103 atoms in a pure condensation. The total timeof a cycle, including the 8 s UV mirror MOT loading and 4 s forced evaporative cooling, is only
about 12 s.

140

Chapter 8. Other atom-chip experiments
8.1

Atom splitting during polarization gradient cooling
Atom beam splitting is one of the important steps in realizing an atom interferometer. It

plays a role much like that of optical beam splitting in photon-based interferometers. However,coherently splitting a Bose-Einstein condensate (BEC) or cold atom cloud is not as obvious as the
optical beam splitting. So far, all coherent cold-atom splitting are only realized by optical methods,e.g., Raman transitions and Bragg diffractions [87, 89–91]. Here we report an observation ofcoherent atom splitting during polarization gradient cooling (PGC) below the atom-chip surface,induced by red-detuned optical standing waves.
As we described in section 7.5, the PGC time is optimized at 1.7 ms. Under the same
cooling and repumping laser powers and frequencies, we observe that a cold atom cloud splits
into three parts when we increase the PGC time up to 4 ms, as shown in figure 8.1. The different
ratios, shown in figures 8.1(a), (b) and (c), are obtained by controlling the cooling laser power
balancing in the horizontal direction. The result indicates that the splitting is induced by the Bragg
diffraction effect of the optical standing wave.
The experiment also shows that it is possible to coherently split a cold atom cloud at atemperature higher than 20 µK by using an optical standing wave. A BEC ultracold atom cloud is
not a necessary condition for observing Bragg diffraction splitting. Our result also suggests that
coherent atom-beam splitting can be achieved by a near-resonance (∆ν = 50–70 MHz) opticalstanding wave field.

141

(a)

(b)

(c)
Figure 8.1: One atom cloud split into three after 4 ms polarization gradient cooling (PGC).
Different ratios as shown in (a), (b), and (c) are obtained by adjusting the cooling laser power
balancing in the horizontal direction.

142

8.2

Rethermalization in a Z-wire magnetic trap
In general, a Z-wire atom-chip micro magnetic trap is neither a three-dimensional (3D)

harmonic trap nor a 3D linear trap because of its magnetic field pattern. The IP type trap
approximation, i.e., 3D harmonic trap with axial rotation symmetry, is only valid for the atoms
near the trap center, and thus only valid for very cold atoms. To the atoms far away from the trap
center, they experience a linear trap slope on the transverse plane where the effective trap
frequencies are position dependent. On the other hand, the atom number density varies a lot insuch a trap. The difference of thermalization and collision rate, which are not uniform over thewhole trap volume and may be up to several orders of magnitude. In this section, we report ourobservation of two different orders of rethermalization times in a single Z-wire trap.
In chapter 7, we described the compression procedure. In the experiment for measuring therethermalization times, the final trap has a Z-wire current Iz = 4 A, y-bias field By0 = 50 G, andcompression time of 100 ms. The trap is 150 µm away from the chip surface where the atoms arefree from surface-induced evaporation (section 8.3). Because of the mode-mismatching and low
trap frequencies at the initial loading, the atoms distribute over a large volume. Thus, during the
100 ms compression, atoms far away from the trap center experience a longer rethermalization
time than the atoms at the trap center. The long rethermalization time is measured at more than
100 ms and depends on the loading procedure. The fast rethermalization time is about 12 ms andcorresponds to most of the atoms being at the trap center.
As shown in figure 8.2(a), when the initial loading is not optimized, i.e., more atoms are
initially far away from the trap center, it takes about 1 s (1/e time constant is 500 ms) torethermalize the whole cloud after compression. Figure 8.2(b) shows the aspect ratio as a functionof time for different loading procedures. The optimized loading, which is used to achieve BEC on
the atom chip, has the fastest rethermalization (150 ms).
To measure the fast rethermalization near the trap center, we perturb the atom cloud along
the transverse direction by ramping the Iz from 4 to 2A and back to 4 A quickly. Each ramp takes

143
10 ms. The axial size of a 1 ms TOF, σx, after the 20 ms perturbation is shown in figure 8.3. The
rethermalization time constant is about 2–10 ms. We also observe a 70 Hz oscillation of σx excitedby the perturbation. This oscillation frequency is consistent with the axial trap frequency of 35
Hz.

(a)

(b)
Figure 8.2: The long rethermalization of atoms in the Z-wire trap. (a) The atom cloud size vs time
when the loading is not optimized. (b) the aspect ratio of atom cloud size vs time with different
loading procedures. The size of cloud is measured after a 1 ms time of flight (TOF). The Z-wirecurrent is 4 A, y bias field is 50 G, and the compression time is 100 ms.
In summary, we observe two different orders of rethermalization time in a compressed
Z-wire micro magnetic trap. The longer thermalization time (>100 ms) is contributed by atoms
initially loaded off center of the trap. We optimize the initial loading and compression time tomaximize the cloud aspect ratio and reduce this long rethermalization time. On the other hand, we
use a transverse perturbation to detect the rethermalization time along the axial direction. The

144
atom cloud’s axial size changes with time, giving not only the trap center rethermalization time of
2–10 ms, but also the axial trap frequency of 35 Hz.

Figure 8.3: The fast rethermalization of atoms in the Z-wire trap. The size of the cloud ismeasured after 1 ms TOF. The Z-wire current is 4 A, y-bias field is 50 G, and the compression
time is 100 ms.

8.3

Surface-induced evaporative coolingInchapter2(section

2.6.2),

wediscussed

theoreticallythesurface-induced

evaporative-cooling mechanism. In this section, we report results from our one-stepsurface-induced evaporation, which provides some insight into the cooling efficiency ofsilver-mirror surface-induced evaporative cooling.

145
The Z-wire magnetic trap loading is the same as the procedure described in chapter 7. At
the end of a 100 ms compression, the final Z-wire current is 2 A, and the bias field is (-4, 50, 0) G.
The trap distance from the silver mirror surface is 70 µm. After holding the atoms there for an
amount of time, we ramp the Z-wire current from 2 A to 4 A in 100 ms for absorption imaging (1ms TOF). The atom number and axial size after a 1 ms TOF expansion as functions of the holding
time are shown in figure 8.4.

Because the cloud size is proportional to its temperature, thedecrease of the axial size with the holding time indicates a surface-induced cooling effect, asshown in figure 8.4(b).

(a)

(b)
Figure 8.4: Surface-induced evaporative cooling. (a) Atom number N vs holding time on thechip mirror surface. (b) Atom cloud axial size after a 1 ms TOF, σx, vs holding time.

A further forced evaporative cooling can be achieved by moving the trap close to thesurface continuously while keeping the trap frequencies constant, as described in section 2.6.2.

146
However, because of the limitation of the two-dimensional plane surface, the cooling efficiency ofthe surface-induced evaporation is much lower than the traditional RF evaporation that removes
hot atoms from a curved surface. Therefore, a successful forced surface-induced evaporative
cooling toward BEC production requires either a very long magnetic trap lifetime [92] or RF
pre-evaporative cooling [55]. Instead of using only one forced-evaporative cooling method, we
implement the surface-induced evaporative cooling into our RF-forced evaporation toward
production of BEC on a chip. As described in section 7.9, during the first RF sweep, the atom
cloud is compressed and brought closer and closer to the mirror surface such that both the RF- andsurface-induced evaporative cooling are utilized simultaneously.

8.4

Sloshing in the Z-wire magnetic trap
It is important to detect the magnetic trap parameters experimentally. For example, we havecalibrated the magnetic fields produced by the bias coils with a Gaussmeter probing outside of thecell. However, ascertaining the exact field inside the cell is still a challenge. Measuring the trap
frequencies and other parameters can help to reveal errors in calibration. The experimental results
can also help us to see if we are working in the right physics regime and to understand the atomic
physics more deeply.
We use two different measurements to determine the Z-wire nonisotropic trap frequencies.
The sloshing method described in this section is used to measure the x-direction axial slow
frequency, which is typically below 100 Hz.
To introduce a sloshing mode to the Z-wire magnetic trap, we shift the chip U-wire CMOT
along the x direction before loading the atoms to the Z-wire trap. The final Z-wire trap has trap
frequencies of (37, 215, 215) Hz with a 4 A Z-wire current and (0, 14, 0) G bias field, located 500µm away from the chip surface. We observe a decay oscillation of the center of mass along theaxial direction, as shown in figure 8.5. The experimental data is fitted to the following curvexcm (t ) = a sin(2πft + φ 0 ) exp(−t / τ ) + b ,

(8.1)

147
where the fitted parameters are a = 105 µm, f = 40 Hz, φ0 = 0.1, τ = 47 ms, and b = 0.05 µm. The
40 Hz sloshing frequency is consistent with the theoretically calculated 37 Hz axial trap frequency.
The oscillation amplitude’s exponential decay time constant of 47 ms is the same order ofmagnitude as the trap rethermalization time.

Figure 8.5: Axial sloshing fitted to an exponential decay oscillation. The oscillation frequency is
40 Hz, and the exponential decay time constant is 47 ms.
Thus, we can use the sloshing excitation along the trap’s axial direction not only to obtain
the axial slow trap frequency precisely, but also to get the trap rethermalization information. The
rethermalization of the Z-wire trap, or the damping of the sloshing, provides an experimental way
to study collision and scattering physics in a nonisotropic trap with a large aspect ratio.
Meanwhile, we also take the sloshing measurement to optimize the trap loading procedure byminimizing the sloshing amplitude introduced by mode mismatching.
To detect the higher transverse trap frequency requires not only a second camera imaging
system along the axial direction, but also a shorter imaging time resolution. Moreover, thecomplex magnetic field pattern in the transverse plane, mixing with the harmonic trap bottom andlinear slope, makes it more difficult to observe a transverse sloshing mode. We use parametricheating, described in next section, to measure the transverse trap frequency of more than 100 Hz.

148

8.5

Parametric heating in a tightly confined magnetic trap
Parametric excitations have been widely used to study cold atoms in both optical andmagnetic traps [93–96]. When harmonic trap parameters, such as trap frequencies, trap depth, ortrap center position, are periodically modulated by external fields, the excitation spectrum shows
narrow peaks at the modulation frequency f = f0 and 2f0, where f0 is the trap frequency [97]. In our
atom-chip experiment, we measure the heating induced by parametric excitations to detect theZ-wire magnetic trap transverse frequency.
We study parametric heating with an ultracold atom cloud just above the BEC transition
temperature in a Z-wire magnetic trap with trap frequencies of (10, 830, 830) Hz. The Z-wire trap,
generated by a 0.68 A Z-wire current and a (-6.4, 15.74, 0) G bias field, locates at 76 µm below
the atom-chip surface. To modulate the trap parameters, we add a single frequency sine-wave
modulation to the Z-wire current

I z (t ) = I z 0 + ∆I sin(2πft + φ 0 ) ,(8.2)

where Iz0 is the 0.68 A Z-wire trap current, ∆I is the current modulation amplitude, and f is themodulation frequency. The hardware block diagram for controlling the modulation is shown infigure 8.6, where a transistor-transistor logical (TTL) switch is used to turn the modulation on andoff.
Figure 8.7 shows the parametric heating results with ∆I = 10 mA and a total of 90 ms
modulation time window. There are two narrow peaks at f = 0.85 and 1.7 kHz in the parametricheating spectrum. Thus, the measured transverse frequency is f0exp = 850 Hz, which is consistent
with the theoretically calculated value of f0the = 830 Hz. The heating rate of the two peaks is about
15 µK/s, and no observable heating is detected among other frequencies.
In conclusion, we have measured the Z-wire trap transverse frequency using a parametricheating method and observed two narrow parametric heating peaks at f = f0 and 2f0. The
parametric heating is also an experimental tool to study the heating from current noise and othertechnical noises. By changing the trap frequencies to reduce the parametric heating from noises

149
and mechanical vibrations, we increase our atom-chip BEC lifetime from 100 ms to 300 ms, asreported in detail in the next section.
Fromanalogoutput+To
current
control
input

TTL
switchcotrolModulation
input
Figure 8.6: Z-wire current modulation block diagram for parametric heating experiment.

Figure 8.7: Parametric heating effect of the Z-wire magnetic trap with a 90 ms current modulationon the Z-wire. (a) Final temperature T and (b) heating rate vs modulation frequency f.

150

8.6

Atom-chip BEC lifetime
A BEC in a magnetic trap has a finite lifetime because of the loss of phase-space density(PSD) caused by the atom number loss and trap heating from background collisions, three-bodyrecombination, atom-chip surface effects, and technical noises. Our atom-chip BEC has a lifetimeof 100–300 ms, which is much shorter than the 3–5 s magnetic trap lifetime. Within the BEC
lifetime, we observe no atom number loss; thus the loss of PSD is only caused by trap heating.
This observation suggests that the atoms are far away from the three-body recombination region
which induces both trap loss and heating [98]. On the other hand, our BEC trap distance from thechip surface ranges from 70 to 200 µm, and is free from surface effects [54, 86]. Our measured
trap frequency dependant heating rate indicates that the heating problem arise from some kind oftechnical noises.
We study the heating in both a tightly compressed trap and a decompressed trap after the
RF evaporation. In the first experiment, we hold the BEC cloud in the compressed trap andmeasure the temperature as a function of the holding time. The compressed trap has trap
frequencies of (23, 3600, 3600) Hz, and is 82 µm away from the surface, generated by a Z-wirecurrent of 2.75 A and a bias field of (-4, 60, 0) G, as described in detail in section 7.9. In thesecond experiment, we decompress the trap by ramping down the Z-wire current from 2.75 to
0.68 A and the bias field from (-4, 60, 0) to (-6.4, 15.7, 0) G rapidly after the RF evaporation. The
decompressed trap has trap frequencies of (10, 830, 830) Hz and is 76 µm away from the chipsurface. To compare the heating effects, we adiabatically ramp the compressed trap to thedecompressed trap for TOF absorption imaging and temperature measurement in the firstexperiment. The results are shown in figure 8.8, where we observe no atom number losses within
1 s in both traps, which exhibit different heating rates. The tightly compressed trap has a heating
rate of more than 3 µK/s, and the decompressed trap has a heating rate of 0.5 µK/s.
The trap frequency-dependent heating rates lead to 100 and 300 ms BEC lifetimes,
respectively. Figure 8.9 shows the PSD as a function of holding time in the decompressed trap.

151
After 300 ms, the PSD drops below 1 [figure 8.9(a)], and after a 9 ms TOF, the cloud becomesisotropic [figure 8.9(b)].
Considering this observation and the results from section 8.5, we suspect that the BEC
lifetime is limited by parametric heating from magnetic field fluctuations and mechanicalvibration. There are two types of sources of magnetic field noises: current noises of the bias coils
and atom-chip wires and background RF radiation. Battery-powered current power supplies may
provide a good solution to suppressing 60 Hz noise in the KEPCO AC-powered supplies.
Meanwhile, inserting notch filters at the trap’s single and double frequencies to the current output
channels can effectively reduce the on-resonance and second-order parametric heating. It is most
likely that the chip itself acts as an antenna in receiving RF noise from the background. This
problem does not exist in a traditional atom-chip system where the chip is installed inside of a big
stainless steel chamber that shields background RF radiation. We are not sure how seriously thisRF pick-up affects the atom-chip experiments. The mechanical vibrations can be suppressed bycarefully mounting and insulating the cell vacuum from the table.

152

Figure 8.8: BEC heating measurement in the compressed and decompressed traps.

(a)

(b)
Figure 8.9: Atom-chip BEC lifetime. (a) Phase-space density PSD vs time. (b) 9 ms TOF
absorption images with different holding times in the trap.

153

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160

Appendix 1. Atom-chip cell vacuum lifetime
The vacuum of our first portable Bose-Einstein condensation (BEC) atom-chip cell was
broken when we changed the wire connector by putting too much force incidentally on the side of
the chip, two months after we pinched off the cell, and one month after we achieved BEC. After
that, we have built and tested more than three cells. However, we consistently observe finite
vacuum lifetimes for these cells. Right after baking out and pinching off, we are able to achieve agood enough vacuum level for BEC production with a UV magneto-optical trap (MOT) lifetimeof about 30 s. However, after one month, the cell vacuum becomes worse and worse and the UV
MOT lifetime drops below 15 s and no BEC is achievable at this level.

Figure A1.1: UV MOT lifetime history after pinching off.

Figure A1.1 shows the histories of UV MOT lifetime of three different cells. The UV MOT
lifetime decay and finite vacuum lifetime reduce the possibility for further atom-chip BEC
applications. My last year’s research focuses on finding out what causes the problem. Here, I
summarize what we have found out related to the cell vacuum lifetime:161
1. The finite vacuum lifetime is consistent with cells prepared at different times, as
shown in figure A1.1.
2. The finite vacuum lifetime is not caused by the negligible leak and diffusion ofhelium from air through the cell glass walls. At the experiment, we put helium gas
around the quartz cell, and observe a rapid drop of the UV MOT lifetime. The
helium leak and diffusion time constant is about 2–4 days, as shown in figure A1.2,
much shorter than the UV MOT lifetime decay. After the helium source is turnedoff, the UV MOT lifetime recovers and follows its previous decay slope. This is agreat way to measure the helium diffusion rate through the quartz cell if the heliumpressure is well known. The difference between the vacuum lifetime (about 1
month) and the short helium diffusion/leak time constant (2–4 days) suggests thatthe finite vacuum lifetime is not caused by the negligible leaks and diffusion ofhelium in air through the cell glass walls.

Figure A1.2: Helium leak and diffusion test. After we turn on the helium gas around thecell, the UV MOT lifetime reduces rapidly. After we turn off the helium source, thevacuum recovers and the UV MOT lifetime increases back in about 4 days.
3.

The finite vacuum lifetime is not caused by the finite capacity of the small, 8 L/s,
ion pump. From the manufacturer’s specification, it is far from saturation under our162
operating vacuum pressure level. We have built a miniature cell with a 2 L/ssmaller ion pump, as described in appendix 2, and get the same long vacuum
lifetime as 8 L/s ion pump, as shown in figure A1.1.
4. The finite vacuum lifetime is not caused by running the rubidium dispenser in daily
routing for charging the cell (section 7.1) because the vacuum becomes worse even
without running the dispenser.
5. The UV MOT lifetime goes back to 30 s after rebaking the cell at about 110 oC for
48 hours. However, it decays down again to the value before rebaking in about one
week.
6. The procedure of cleaning the quartz cell inner walls with a flash lamp, as
described in section 3.5, has influence on the vacuum lifetime. We have tested acell without the flashing-cleaning procedure, and observe no decay of the UV
MOT lifetime up to one month, as shown in figure A1.3. However, in such a cellwithout the flashing-cleaning procedure, we are not able to load enough atoms into
the mirror MOT with UV light-induced atomic desorption (section 7.2).

Figure A1.3: UV MOT lifetime of the cell without flashing.

163
Based on the above facts, we suspect that the “deterioration” of the cell vacuum, which
reduces the UV MOT lifetime, results from the epoxy used to seal the vacuum with the atom chip.
From the evidence shown in figure A1.3, we suspect that the high power flash light in the
flashing-cleaning procedure may affect the properties of the epoxy such that the epoxy slowly
releases something, which is difficult to be pumped away by the ion pump and nonevaporable
getter, in the cell. Moreover, because of using epoxy, we are only able to bake the quartz cell part
below 200 oC, which is not sufficient to remove all the water layers on the quartz walls and limits
the vacuum pressure.
Our future improvement of the cell vacuum will rely on avoiding using the epoxy andbaking the glass cell at a higher temperature. Cooperating with Rockwell Scientific Company andSarnoff Corporation, we are developing atom via-chip and anodic bonding [A1-1–A1-6]
technologies. The chip via avoids passing the wire pattern through the sealing junction and makes
it possible to anodically bond the chip directly to a Pyrex cell without using any epoxy. The
anodic bonding cell also allows for a high baking temperature of more than 450 oC.

[A1-1] T.R. Anthony, “Anodic Bonding of Imperfect Surfaces,” J. Appl. Phys. 54, 2419 (1983).
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Borosilicate Glass,” J. Electrochem Soc. 138, 3089 (1991).
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[A1-5] A. Gerlach, D. Mass, D. Seidel, H. Bartuch, S. Schundau, K. Kaschilk, “Low-Temperature
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Microsystem Technologies 5, 144 (1999).
[A1-6] H.J. Quenzer, A.V. Schulz, T. Kinkopf, and T. Helm, “Anodic Bonding on Glass Layers
Prepared by a Spin-on Glass Process: Preparation Process and Experimental Results,” The 11th
International Conference on Solid-State Sensors and Actuators, Munich, Germany, June 10-14(2001).

164

Appendix 2. A miniature atom-chip vacuum cell
As previously discussed in section 3.3.5, the conductance of the square quartz cell (1 × 1 ×4 cm) for Rb atoms at room temperature is 2.2 L/s, and the conductance of the glass-to-metaltransition tube (diameter 2.5 cm and length 9 cm) is 12.4 L/s. For air, they are 3.9 L/s and 21.2 L/s,
respectively. Therefore, the small square quartz cell limits the overall system conductance and an
ion pump with a pumping speed lower than 8 L/s is enough to maintain the UHV pressure of thecell after pinching off.

Figure A2.1: Miniature atom-chip vacuum cell with a 2 L/s ion pump.
We have designed, built, and tested a miniature version atom-chip vacuum cell with a 2 L/smini ion pump, as shown in figure A2.1. The system size is much smaller than the portableatom-chip cell presented in chapter 3. After baking out and pinching off, the miniature cell has thesame performance as the portable one with 8 L/s ion pump. Unfortunately, because of the finite
vacuum lifetime issue (appendix 1), we have not been able to achieve Bose-Einstein condensation(BEC) in this miniature atom-chip cell. As discussed in appendix 1, the dimension of the vacuum
system is not the cause of the finite vacuum lifetime. Therefore, in the future, after solving thevacuum deterioration problem possibly by via-chip and anodic bonding technologies, we expect
to create BEC in the miniature cell.