Financial Results
Explanatory Materials
Security code ： 6258
August 2024

FY2024 (March 2025)
First quarter

Note : This document has been translated from the Japanese original forreference purposes only. In the event of any discrepancy between thistranslated document and the Japanese original, the original shall prevail.

Table of Contents

Ⅰ. FY2024 First Quarter Results (Consolidated)
Ⅱ. FY2024 Full Year Forecasts (Consolidated)

Ⅲ. Reference Data

※FY2024 represents the fiscal year ending March 31, 2025.

2

Company Profile
Company Name
Address

HIRATA Corporation

111 Hitotsugi, Ueki, Kita, Kumamoto, 861-0198 Japan

Representatives

Yuichiro Hirata, President

Date Established

December 29, 1951

Capital2,633 million yen

Our business
Stock Exchange
Listings
Employees

Manufacture and sales of various manufacturing line systems, Industrial
robot and logistic equipment
Tokyo Stock Exchange, Prime Market (Symbol:6258)
Consolidated 2,439名
Non-Consolidated 1,530名 ※As of June 30, 2024

Plants and office

7 bases in Japan（4 bases in Kumamoto 1 each in Tochigi, Shiga, Tokyo）

Subsidiaries

3 subsidiaries in Japan（2 in Kumamoto, 1 in Tokyo）
9 overseas subsidiaries（America、Mexico、Germany、Singapore、Thailand、Malaysia、2 in China、Taiwan）
C o py right © Hirat a C o rpo rat io n All Right s Reserv ed.

3

Ⅰ. FY2024 First Quarter
Results (Consolidated)

4

Ⅰ. FY2024 First Quarter Results (Consolidated)

Financial Summary ※First Quarter Cumulative Period
 Order
Received

Semiconductor-related business has decreased significantly. Additionally, there have been other factors such as delays in customer orders in
automobile and other automatic labor-saving equipment, resulting in a decrease in order received compared to the same period last year.

 Sales

Due to progress in production of backlogged orders, particularly in the automotive sector, there has been an increase in revenue compared to thesame period last year.

 Operating
profit

The decrease in sales in the high-profit margin semiconductor-related business and the increase in selling and administrative expenses due to baseup initiatives have affected the operating profit, resulting in a decrease compared to the same period last year.
（Units in millions of Yen)FY202３ １Q

FY202４ １Q

Actual results

Actual results

YoY Change
Amount of +/－Percentage of +/－Orders Received

24,567

19,892▲4,675▲19.0%Net Sales

19,15520,368

1,213

6.3%

Operating Profit

1,503

1,214

(Profit ratio)（7.9%）(6.0%)▲289▲19.3%

Ordinary Profit

1,580

1,279

▲300

▲19.0%

Profit attributableto owners of parent

1,105

722

▲383

▲34.6%

Backlog of Orders

67,41764,928▲2,488▲3.7%

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5

Ⅰ. FY2024 First Quarter Results (Consolidated)

Factor Analysis on Changing Operating Profit
 Operating profit decreased approximately 280 million yen from the same period of the previous year.
⁃ Main factors for increase ： Increase in sales⁃ Main factors for decrease ： Increase in cost ratio and the selling and administrative expenses, etc.
Approx.
+260milApprox.
△ 420mil

1 Impact of increase in cost
ratio

Approx.
△ 280mil

1.5bn
Increase inprofit due
to increasein salesrevenue

Impact ofincreasein costratio

Main factors for increase in costratio
• Deterioration of cost ratio forcertain projects

Approx.
△ 120mil1

Cost ratio 78.4% ⇒ 80.5%• Increase in labor and outsourcing
costs for manufacturing

1.21bn2 Impact of increase in
SG&A expenses

2 Impact ofMain factors for increase in SG&A
expenses

increasein SG&A
expenses• Increase in labor costs due towage hikes• Increase in expenses related tosystems

FY2023 1Q

FY2024 1Q
C o py right © Hirat a C o rpo rat io n All Right s Reserv ed.

• Increase in miscellaneous
overhead expenses due to sales
expansion

6

Ⅰ. FY2024 First Quarter Results (Consolidated)

Results by Segment（Units in millions of Yen)

ReceivedordersPercentage of +/-19,892▲4,675▲19.0%

Automobile

12,35512,307▲48▲0.4%

Semiconductor

9,223

4,828

▲4,395▲47.7%

Other Automatic Laborsaving Equipment

2,406

2,176

▲229

▲9.5%

582

580

▲2

▲0.3%

19,15520,368

1,213

6.3%

Automobile

8,079

9,824

1,745

21.6%

Semiconductor

7,765

7,055

▲710

▲9.2%

Other Automatic Laborsaving Equipment

2,811

2,932

120

4.3%

498

556

58

11.7%

1,503

1,214

▲289

▲19.3%

498

476

▲22

▲4.5%

Semiconductor

1,096

920

▲176

▲16.1%

Other Automatic Laborsaving Equipment

▲70

▲155

▲85

-％

Others(Including
elimination)

▲21

▲26

▲5

-%

Total

67,41764,928▲2,488▲3.7%

Automobile

35,91941,632

5,713

15.9%

Semiconductor

23,21017,243▲5,967▲25.7%

7,615

5,540

▲2,075▲27.3%▲159▲23.8%

Others
Total
Automobile

Backlog ofordersAmount of +/-24,567

Total

OperatingprofitFY２０２４ １Q

Total

OthersNet Sales

FY2023 １Q

Other Automatic Laborsaving Equipment

OthersC o py right © Hirat a C o rpo rat io n All Right s Reserv ed.

672

512

7

Ⅰ. FY2024 First Quarter Results (Consolidated)

Results by Segment ： Automobile-related
 Received orders were at a similar level compared to the same period last year. We have received orders for large-scale projects
related to battery charging and discharging equipment, and inquiries for EV and internal combustion engines are strong.
 Sales has increased compared to the same period last year. The contribution to sales comes from previously ordered EV-related
projects (mainly EDU and battery-related) and internal combustion engine projects from the previous period.
 Operating profit has decreased compared to the same period last year. This is due to the deterioration of cost ratio for certain
projects and increase of SG&A and manufacturing costs.
（Units in millions of Yen)FY202３ １Q
Results

FY2024 1Q

Segment
composition

Results

YoY Change

Segment
composition

Amount of +/-Percentage of+/-

12,355-12,307

-

▲48

▲0.4%

EV

11,315

91.6%

8,828

71.7%

▲2,486▲22.0%

Others

1,040

8.4%

3,478

28.3％

2,438

234.3％

8,079

-

9,824

-

1,745

21.6%

EV

6,141

76.0%

7,192

73.2%

1,050

17.1％

Others

1,937

24.0%

2,632

26.8%

694

35.9％

Backlog of orders

35,919-41,632

-

5,713

15.9%

Operating profit

498

-

476

-

▲22

▲4.5%

Operating profit ratio※

6.2 %

-

4.8 %

-

-

-

Received orders

Net Sales※Operating profit / Sales

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8

Ⅰ. FY2024 First Quarter Results (Consolidated)

Results by Segment ： Semiconductor-related
 Received orders has decreased compared to the same period last year. Although the market is gradually recovering, it is lower
than the previous year's same period when there was an increase in orders other than wafer transport.
 Sales has decreased compared to the same period last year. While there is an increase in wafer transport, other areas such as
inspection equipment and PLP are experiencing a decline, which has had an impact.
 Operating profit has decreased compared to the same period last year. This is due to the decrease in sales and increase in SG&A
and manufacturing costs.
（Units in millions of Yen)FY202３ １Q
Results

FY2024 1Q

Segment
composition

Results

YoY Change

Segment
composition

Amount of +/-Percentage of+/-

Received orders

9,223

-

4,828

-

▲4,395▲47.7%

Wafer
transfer

5,151

55.9%

4,269

88.4%

▲882

▲17.1%

Others

4,072

44.1%

558

11.6％

▲3,513▲86.3%

7,765

-

7,055

-

▲710

▲9.2%

Wafer
transfer

4,588

59.1%

4,970

70.5%

381

8.3％

Others

3,177

40.9%

2,084

29.5%

▲1,092▲34.4％

Backlog of orders

23,210-17,243-▲5,967▲25.7%

Operating profit

1,096

-

920

-

▲176

▲16.1%

Operating profit ratio※

14.1 %-

１３.0 %---Net Sales※Operating profit / Sales

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9Ⅰ. FY2024 First Quarter Results (Consolidated)

Results by Segment ： Other Automatic Labor-saving Equipment
 Received orders has decreased compared to the same period last year. The order amount fell below the previous year's same
period, supported by orders for organic EL. This is also due to factors such as customers deferring their investments.
 Sales has increased compared to the same period last year. This is due to the contribution of sales from previously orderedorganic EL-related projects from the previous period.
 Operating profit has decreased compared to the same period last year. This is due to the deterioration of cost ratio for certain
projects and and increase in SG&A and manufacturing costs.
（Units in millions of Yen)FY202３ １Q
Results

FY2024 1Q

Segment
composition

Results

YoY Change

Segment
composition

Amount of +/-Percentage of+/-

Received orders

2,406

-

2,176

-

▲229

▲9.5%

Net Sales

2,811

-

2,932

-

120

4.3%

Backlog of orders

7,615

-

5,540

-

▲2,075▲27.3%

Operating profit

▲70

-

▲155

-

▲85

-%

Operating profit
ratio※▲2.5 %-▲5.3 %---

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10

Ⅰ. FY2024 First Quarter Results (Consolidated)

Balance Sheet（Units in millions of Yen)

Assets

FY202３

FY2024 １Q

YoY change

88,554

92,376

Cash & deposits

10,652

Trade receivables,
etc.

Inventories

Current
AssetsYoYchangeLiabilities

FY202３

FY2024 １Q

3,822

Current liabilities

49,864

48,522 ▲1,342

8,924▲1,728Fixed liabilities

15,621

20,8235,202

59,50465,093

5,589

Total
Liabilities

65,48569,346

3,860

14,264

14,638374

65,302

65,276▲25

Net Assets
OthersTangible
Assets

4,131

3,719

▲412

42,23342,24512

27,43727,229

▲208

904

1,033

128

Investment & otherassets13,891

13,98392

Total Assets

130,787

134,622

3,834

Total net
assetsMain factors for increase/decrease
Tangible fixed assets

Intangible fixed
assets• Trade receivables, etc. have increased due to an increase inlarge-scale projects and long-term-projects.
• Current liabilities have decreased due to the payment offactory expansion expenses and bonuses, resulting in adecrease in accounts payable and accrued expenses.
• Long-term liabilities have increased due to an increase inlarge-scale projects and long-term projects.

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11

Ⅱ. FY2024 Full Year
Forecasts (Consolidated)

12

Ⅱ. FY2024 Full Year Forecasts (Consolidated)

Full Year Forecast We anticipate an increase in revenue to 100 billion yen and an operating profit of 7.5 billion yen,
indicating growth in both sales and profits. ※The information remains unchanged from the fiscal year 2023 financial
statement announcement (May 10, 2024).
（Units in millions of Yen)FY2023

FY2024

vs. FY2023

Results

Full year forecast

Amount of +/-Percentage of +/-82,839100,000

17,16020.7%

Automobile-related

36,98450,00013,01535.2%

Semiconductorrelated

27,39029,000

1,609

5.9%

Other Automatic Laborsaving Equipment

16,08319,000

2,916

18.1%

2,381

2,000

△381

△16.0%

Operating Profit （x）

6,047 (7.3%)

7,500 (7.5%)

1,452

24.0%

Ordinary Profit （x）

6,259 (7.6%)

7,300 (7.3%)

1,040

16.6%

Profit attributable toowners of parent （x）

4,344 (5.2%)

4,700 (4.7%)

355

8.2%

Net Sales

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13

Ⅱ. FY2024 Full Year Forecasts (Consolidated)

Key Points of Full-Year Forecast (Net Sales) In addition to securing the highest level of order backlog at the beginning of the fiscal year 2024, we
anticipate continued strong orders in the EV and semiconductor sectors, and we expect an increase inrevenue compared to the same period of the previous year. ※The information remains unchanged from the fiscal year 2023
financial statement announcement (May 10, 2024).
（Units in millions of Yen)FY2023

FY2024

Results

Full year forecast

Net Sales

82,839100,000

vs. FY2023
Amount of +/-17,160Percentage of +/-20.7%<Outlook by segment>
Automobile-related

Semiconductor-related• While there is a slowdown in thegrowth of the EV market in North
America, we will leverage ourstrengths in being able to cater to EVs,internal combustion engines, andhybrids to capture demand effectively.

• We will ensure to capture theexpanded demand resulting fromincreased investment in postprocessing equipment for AI
manufacturing and power
semiconductors for automotive
applications.

• We expect an increase in orders by
establishing a dedicated department
for EV battery charging anddischarging-related equipment
starting from the fiscal year 2024, andby participating in customer productdevelopment from the early stages.

• We will proceed with establishing a
production cooperation system withlocal subsidiaries in Southeast Asia, in
addition to existing ones in China andTaiwan, in order to expand our
production capacity.
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Other Automatic Laborsaving Equipment• We will specialize in the production of
the core components with the scaling
up of OLED panels.
• The assembly equipment project forhome appliance manufacturers iscurrently being developed by thecustomer. We will work to recoverfrom any delays and mitigate theimpact.

14

Ⅱ. FY2024 Full Year Forecasts (Consolidated)

Key Points of Full-Year Forecast (Operating Profit) We will actively implement investments in human resources and growth to achieve “profitability
enhancement” and “strengthening of management foundation” for the next phase of growth.
 We anticipate an increase in operating profit compared to the previous period. ※The information remains
unchanged from the fiscal year 2023 financial statement announcement (May 10, 2024).

4.35bn710milMain factors for increase/decrease
compared to the previous period

1 Personnel investment
710 million yen• Increase in hiring to meet future demand
growth780milAffected by

1 increase in

human
investments

Affected by

2 increase in

futureinvestments
・R&D
510mil・Facilities
investment
270mil6.04bn• Increase in personnel expenses to address
the rapid increase in prices and ensure stabletalent acquisition, etc.

1.41bn2 Growth investment

7.5bn

780 million yen

Approx.

Affected by

3 increase in+1.46bn

SG&A
expensesand others• Capital investment for improving productivity,
etc.

Other selling, general, andIncreased profits
due to higher
sales revenue

FY2023• Accelerating the development of nextgeneration product in existing businesses

3 administrative expenses
1.41 billion yen

FY2024• Increase in selling, general, andadministrative expenses due to sales
expansion• Increase in procurement cost, etc.

*The impact amount: increase/decrease for full year 2024 compared to full year 2023 results
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15

Ⅱ. FY2024 Full Year Forecasts (Consolidated)

Transition and Forecast of Dividends and Dividend Ratio per Share（Units in Yen)FY2019Dividends per
Share
Dividend
Ratio （％）

FY2020

FY2021

FY2022

FY2023

FY2024
forecast

40.00

65.00

65.00

90.00

100.00120.00

23.8

16.6

25.2

21.9

23.9

26.5

Note: Dividend ratio is on a consolidated basis.

<Our approach to dividends>
We consider the return of profits to shareholders as one of the most important management challenges andstrive to strengthen our financial position. Taking into account our consolidated performance and futurebusiness development, we aim for a consolidated dividend payout ratio of 20% or more as a general guideline,
and we strive to provide stable and continuous dividends.
For the current fiscal year, we anticipate a year-end dividend of 120 yen.
Regarding our future approach to dividends, we will continue to consider it as part of our capital policy, which
includes shareholder return strategies.

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16

Ⅲ. Reference Data

17

Ⅲ. Reference Data ①

Net Sales Composition Ratio by Business Segment

Automob
ile

100%

Home
appliances& others

Semiconductor

2.4%

4.5%

18.7%

21.7%

20.2%

39.6%

33.5%

39.9%

3.0%

3.1%

15.8%

13.1%

45.1%

44.9%

50%

37.1%

FY201742.4%

FY2018

35.4%

36.1%

38.9%

FY2019FY2020

FY2021

事業区分の変 更Change in businessclassifications

4.6%

Other automatic laborsaving equipment

OthersNet
sales(axis)

2.9%

2.9%

21.6%

19.4%

36.9%

33.1%

2.7%

100 billion yen

14.4%

34.7%
50 billion yen

38.6%

FY2022

44.6%

48.2%

FY2023

FY2024 1Q*We changed our business classifications effective from FY2022.
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18

Ⅲ. Reference Data ②

Quarterly Trends by Business Segment 【Received Orders】
Automobile

Semicond
uctor

Other automatic laborsaving equipment

Others（Units in millions of Yen)

29,058279

25,55024,071
795

9,267

683
3,500

24,567

24,254

582
2,406

481
2,276

3,864

18,156
7,177

15,076

7,681

9,223

663
2,490

12,644

410

5,431

580
2,176

3,989
4,828

5,685
5,837
4,614

6,544
11,83014,188

6,767

1Q

808

19,892

19,25916,066
12,355
7,048

5,378

2Q

3Q

FY2022

4Q

12,307

1Q

2Q

9,022

3Q

FY2023C o py right © Hirat a C o rpo rat io n All Right s Reserv ed.

4Q

1Q

FY202419

Ⅲ. Reference Data ③

Quarterly Trends by Business Segment 【Net Sales】
Automobile

Semicond
uctor

Other automatic laborsaving equipment

Others（Units in millions of Yen)

23,26023,613578

754

20,514
17,92916,739
474

206

978

516
4,992

19,155
498

4,099

2,811

18,239

5,906

3,908

20,368
556
2,932

611
3,456

4,323

3,536
8,543
7,765

7,614
6,430

21,830

6,695

7,263

7,055

10,257

10,142

9,824

3Q

4Q

1Q

5,665

6,366

6,298

7,031

7,822

1Q

2Q

3Q

FY2022

9,145

4Q

8,079

8,506

1Q

2Q

FY2023C o py right © Hirat a C o rpo rat io n All Right s Reserv ed.

FY202420

Ⅲ. Reference Data ④

Quarterly Trends by Business Segment 【Operating Profit】*Others includes elimination.
AutomobileOther automatic
labor-saving
equipment

Semicond
uctor

Operating profit ratio（right axis）

Others（Units in millions of Yen)

12%

2,792
482

2,096

8

8%

492

1,446

1,365 0
1,011
251

1,607

1096

1143

1411

1,214

213

1190

820

144

841

592
175
△8

1,503

310

405

667
△ 26
△ 15

903
498

516

△ 70
△ 21

△ 36
△ 15

920

4%

797
476

△5

△ 266
△ 255

△ 155
△ 26

△ 131

1Q

2Q

3Q

FY2022

4Q

1Q

2Q

3Q

FY2023C o py right © Hirat a C o rpo rat io n All Right s Reserv ed.

4Q

1Q

FY202421

Ⅲ. Reference Data ⑤

R&D, CAPEX, Depreciation and Amortization
FY2023
results

FY20241Q
results

FY2024 plan

(Units in 100 millions of Yen)

52.0
22.5

18.9

13.8

3.6

2.6
R&D expenses

Capitalinvestment

Capital Expenditure

20.9
4.8

Depreciation and amortization

FY2023Results

FY2024plan

Next generation productdevelopment in existing businesses

Approx. 9.2

Approx. 12.3

Promoting development of mass-produced productsPlant genetic resource related
business

Approx. 4.5

Approx. 6.6

Increased in depreciation and personnel expenses

Plant rebuilding and expansion

Approx. 22.6

Approx. 3.6

Large-scale rebuilding and expansion have
temporarily halted until the previous period.

Plant genetic resource related
business

Approx. 15.3

Approx. 0.1

The introduction of major equipment was completed
by the previous period.

Approx. 1.8

The implementation of the next-generation coresystem has been ongoing since the previous fiscal
year.

Approx. 17.1

There is a gathering of small-scale investments,
among other things, for the purpose of improving
productivity.

Main investments

R&D expenses

18.1

Information system related

OthersApprox. 2.1
Approx. 12.0

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Reasons for increase/decrease22

Ⅲ. Reference Data ⑥

Production space (Non-consolidated ・End of period) We are actively working on the continuous expansion of production space to increase our production
capacity.
 We will secure additional production space in Yamaga City, which is adjacent to Kumamoto City, for the fiscal
year 2024 as well.
(units in ㎡)

Total floor area

・ Rebuilding of Kansai plant
・ Expansion of Shichijo plant
・ Expansion of warehouse at
Kanto plant

・ Expansion of production
space near Kumamoto plant(Yamaga, Kumamoto)137,388
132,316

134,391
vs. FY2022+3.8％(vs. FY2019+28.1％）FY2022

FY2023C o py right © Hirat a C o rpo rat io n All Right s Reserv ed.

FY202423

Ⅲ. Reference Data ⑦

Number of recruits ・employees (Non-consolidated ・End of period) In anticipation of business expansion, we are committed to ensuring a continuous supply of talented
professionals.
 We are working on talent retention through various measures such as wage improvements, workstyle reforms,
enhancing employee benefits, and providing quality education and training opportunities.
Number of employees (including fulltime, part-time and temporary
employees)

1,530(Unit in person)

Number of career hires
Number of new graduate hires

1,350

1,419
1,359

69
55

13
24
FY2021

78
47
FY2022

FY2023C o py right © Hirat a C o rpo rat io n All Right s Reserv ed.

FY2024 Q1
24

Ⅲ. Reference Data ⑧‐1

Potential opportunities/risks from the main external environment and countermeasures
Assumed main
external environment

Strengthening countries’
efforts to decarbonize andbecome carbon neutral

Slowdown in environmentalrelated investments due tochange of government inNorth America

Mass-production of new
type batteries

Proliferation of generative
AI

Assumed opportunities / risks

Opportunity
Risk

Risk



Improvement of QCD to obtain continuous inquiries from existingcustomers

Positioning EVs and semiconductors as growth areas andconcentrating resources

Actions taken to reduce GHG emissions(cost increase)＝Upfront investment in human resources and production capacity inanticipation of increased ordersMissed orders due to lack of production
capacity and human resources（Increase in personnel, Kansai plant reconstruction, Shichijo plant
expansion, etc.)

Decreased capital investment by customers
due to EV market contractionEstablishment of GHG emission reduction targets and study of optimal
target achievement measures

Understand capital investment trends through close informationexchange with customers



Securing new customers and projects by expanding the areas ofservice

Diversify core businesses and optimize resource allocation

Participating from the research and development stage of ourcustomers and developing and proposing that meet their requirements

OpportunityExpanding business opportunities through the
pursuit of new technologies and the ability tomass-production
Deterioration in profitability due to theburden of development factors



Reducing R&D expenses through external sourcing/procurement

Risk

Increase in demand related to semiconductor
related businessImprovement of QCD to obtain continuous inquiries from existingcustomers

Resource investment in semiconductor field＝Pre-investment in human resources and production capacity inanticipation of an expansion in orders.



Improvement of QCD to obtain continuous inquiries from existingcustomers

OpportunityRisk

Concentration ofsemiconductor-relatedindustries in Kumamoto andKyushuIncrease in demand related to EV andsemiconductor related business

Main countermeasures

Missing orders due to lack of production
capacity and human resources

OpportunityIncrease in demand related to semiconductor
related business



Risk

Shortage of human resources due tocompetition of talent acquisition

Resource investment in semiconductor field＝Pre-investment in human resources and production capacity inanticipation of an expansion in orders.



Recruiting new talent actively

Implementing wage revisions and retention measures taking into

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Ⅲ. Reference Data ⑧‐2

Potential opportunities/risks from the main external environment and countermeasures
Assumed main
external environment
Escalation of tensions in the
Middle East

Assumed opportunities / risks

Risk

Increase in personnel
expenses based on social
demands

Risk

Soaring and stagnating raw
materials and component
pricesRisk

Shortage of parts andmaterials

Risk

Risk

The logistics “2024 problem”

Exchange rate
（Rapid appreciation of theyen）Soaring of crude oil prices, cost increases intransportation and procurement

Main countermeasures

Incorporating estimates for increased transportation costs andprocurement costs, as well as implementing price revisions

Developing new suppliers

Reduction in the number of required parts and materials throughstandardization

Deterioration in profit margin

Decrease in competitiveness due to sales
price increase

Incorporating estimates for increased labor costs and implementing
price adjustments to pass on the costsEstablishing competitive advantages other than price

Incorporating estimates for increased procurement costs andimplementing price adjustments to pass on the costs

Developing and launching high-value-added products

Developing new suppliers

Reduction in the number of required parts and materials throughstandardization



Securing parts inventory by making advance arrangements



Developing new suppliers

Reduction in the number of required parts and materials throughstandardization

Incorporating estimates for increased procurement costs andimplementing price adjustments to pass on the costsReduction in the number of required parts and materials throughstandardization



Logistics arrangements anticipating prolonged lead times



Securing competitive advantage through value-added improvements

Promoting local production overseas

Deterioration in profit margin

Decrease in competitiveness due to sales
price increase

Decreased sales, deterioration in cost ratio,
and increased inventory assets due to
production schedule delays and prolonged
lead times

Increased procurement costs due to risingtransportation fees

Prolonged lead times for procurement andshipment

Opportunity

Decrease in the actual procurement priceof overseas procured goods such as raw
materials and parts

Risk



Decreased price competitiveness relative
to competitors

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Ⅲ. Reference Data ⑨

Topic ： Receipt of large project orders
The list of large-scale purchase order projects we disclosed starting from FY2023 and onwards
Business segment

Automobile-related

Disclosure date

Outline of the equipment

AmountEDU assembly equipment for EVs

More than 8billion yen

January

Battery charging and discharging related
equipment for EVs

More than 4billion yen

February

Engine assembly equipment for internal
combustion engines

Approximately
13 billion yen

MayBattery charging and discharging related
equipment for EVs

Approximately
2.5 billion yen

2023

June

2024

Orders record of battery charging and discharging related equipment for EVs
The cumulative order amount since the fiscal year 2022
has exceeded 9 billion yen.（7 lines）• Regarding the battery charging and discharging related equipment, we have started full-scale orders fromthe fiscal year 2022. (Orders for two lines until December 2023 amount to approximately 2.5 billion yen).
• Our ability to handle large-scale projects and the track record of delivering battery charging anddischarging related equipment for EVs have been highly evaluated, leading to continuous order acquisition.
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Ⅲ. Reference Data ⑩

Strengthening our efforts in ESG management
2022

Oct.

Human Rights Policy is formulated and Procurement Basic Policy is revised.

2023

Apr.

The Sustainability Promotion Committee is established.
Sustainability page is established in our web page and the dissemination of
ESG information is been strengthened.

2024

Sep.

We signed the UN Global Compact.

Oct.

Human rights due diligence is implemented.

Nov.

We express our support for the Keidanren's "Corporate Code of Conduct."Jan.

Code of Conduct of the Hirata Group is established.
Human Rights Respect Working Group within
the Sustainability Promotion Committee is established.

Jun.

Hirata has been selected as a constituent stock
for the followings:「FTSE Blossom Japan Index」「FTSE Blossom Japan Sector Relative Index」
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Ⅲ. Reference Data ⑪

Business Overview ： Main products of automobile-related business Continued orders from North American automakers (big three), North American emerging EV
manufacturers, domestic electronic components manufacturers, focusing on EV related

Main/Expansion Fields of EV-related business
Production equipment handled
by Hirata

1

EDU assembly equipment

Main field

Manufacturing EV-drive parts assembly equipment called
EDU (ELECTRIC DRIVE UNIT) combined with in-vehicle
motors and gearboxes

2
3
2

IGBT・Inverter assembly equipment

Main field

Manufacturing of in-vehicle electronic components mounted
on EVs and transmissions such as IGBT and inverters

1
3

Battery-related assembly equipment

Manufacturing of conveying equipment for charging anddischarging processes that are part of the battery cell progress.

*Completed product image

Main customers, competitors, superiority
EDU assembly
equipment

IGBT・assembly
equipment

North America
Customers

・North American automakers(Big Three)・North American emerging
EV manufacturers

Expansion field（Cell charging / discharge process）

Battery-related
assembly equipment(cell charging/discharging process)

Japan

Japan

Customers

Customers

Domestic electronic
components manufacturers

Domestic battery
manufacturers

Hirata’s superiority• Ability to handle large facilities, some of which exceed 1 km in
total length, solely in-house• A vast factory that allows us to build the customer’s production
line in our factory and install it on site after verifying the
production capacity and quality• Integrated system from development to production andmaintenance• Engineering ability to respond to customer requests

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All rights reserved.

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Ⅲ. Reference Data ⑫

Business Overview ： Charging and discharging related equipment
 We have charge and discharge equipment that handles the final process of cell manufacturing, which is
the “charging and discharging” process.
 We have a competitive advantage in systematization utilizing conveyance and stocking technologies.

Battery manufacturing process

STEP

1

Process in which ourcharging anddischarging related
equipment is used

Cell process

STEP

Roll process
Mixing・Coating・Slitter・Compression

Assembly
Rolling up・
assembly

Charging anddischarging・
Aging

2

STEP

Module process3

Packaging process(excluding inspection process)

Focused on
winning orders

Proven trackrecordTransport system

This system provides optimal transfer between
processes according to recipes (process procedures).

• The process of activating a assembled cell (battery) by
repeatedly charging and discharging it to give it thefunctionality of a battery

Warehouse system
for aging

The system performs tests in high-temperatureenvironments and measures the performance of cellvoltages after a certain period of time in an automatedwarehouse.

• We deliver the system to the customer by incorporating thecharging and discharging machines procured from external
suppliers into the transport lines and automated warehouses
manufactured by us.

Warehouse systemfor charging anddischarging

It is used in a process in which a full charge anddischarge are repeated several times. It takes several
hours to set the charging capacity, charging speed,
and number of repetitions.

Our products：
Charging and discharging related equipment

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All rights reserved.

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Ⅲ. Reference Data ⑬

Business Overview ： Main products of semiconductor-related business Continuing orders mainly for wafer transport devices for domestic device manufacturers and handlingdevices between inspection devices

Main/Expansion Fields of Semiconductor-related business
主力分野
Main field

Wafer transport
deviceEFEM

Load port

Transfer
robot

Manufacturing road port that incorporates siliconwafers into various treatment devices, wafertransport robot that can support the air andvacuum environment, and an integrated EFEM

HirataExpansion field

Main field

Manufacturin
g equipment
Maker

Transport device between
inspection device

PLP

Manufacturing handling equipment thattransports the finished IC chips and inspection
device to another tray

Manufacturing of EFEM, load port, and wafertransfer robots for panel substrate transfer andtransfer equipment for panel manufacturing
used in the PLP process, etc.

Inspection
devicemaker

Substrate
maker

Devicemaker

HirataDevicemaker

HirataDevicemaker

Main customers, competitors, superiority
Wafer transport
deviceJapan
Customers

Domestic manufacturing
equipment manufacturers

Transport device between
inspection device

PLP

North America, Japan

North America, Europe, Japan

Customers
・North American device makers

Customers
・North American device makers
・Domestic/European substrate
manufacturers

・Domestic inspection equipment
manufacturers

Hirata’s superiority• A wealth of component lineup• Knowledge technology required for customization andoptimization to meet customer requirements• Integrated system from development to production andmaintenance• Engineering ability to respond to customer requests

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All rights reserved.

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Ⅲ. Reference Data ⑭

Business Overview ：Wafer transport device
 Manufacturing of load ports that take wafers into various processing equipment mainly used in the front-end
process of semiconductor manufacturing, wafer transfer robots that transfer wafers, and EFEMs that integratethem

Semiconductor manufacturing process
Process in which our
PLP is primarily used
Design• Design for circuit andpattern• Photomask creation

Image of our
product installation

Front-end process

Back-end process• Wafer creation• Dicing• Circuit pattern creation• Die bonding

・Oxidation of wafer
surface• Wire bonding

・Thin film formation• Commercializationand final inspection

・Pattern transcriptionof photomask

Our main products
FOUP （made ofother company）
Variousprocessing
equipment（made ofothercompany）• Packaging

・ Ion implantation

1

2

Loat port

3

2

EFEM （Equipment Front End Module)
It is placed for each processing unit, with a wafertransfer robot inside and a load port on the front.

Image of our product installation

EFEM

1

FFU
(Fan Filter Unit)

Multiple EFEM/load
ports are used on asingle line because
EFEM/load ports are
installed at eachprocessing unit.

Load port
It opens and closes the lid on the back side of the
FOUP ※, a device that makes up the EFEM, but isalso sold as a stand-alone item.

3

Wafer transport robot
Wafers are removed from the FOUP and transferredto the processing equipment. After processing, thewafers are stocked back in the FOUP. It is a device
that makes up the EFEM, but is also sold as a standalone item.

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※FOUP ： It is a container for wafers that holds multiple wafers andmoves them between processes.
All rights reserved.

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Ⅲ. Reference Data ⑮

Business Overview ： PLP Designing and manufacturing conveyance equipment used in PLP, an advanced packaging technologythat is expected to expand

Semiconductor
manufacturing process
Design• Design for circuit andpattern• Photomask creation

Difference of packaging process
Process in which our
PLP is primarily used

Front-end process

Back-end process• Wafer creation• Dicing• Circuit pattern creation• Die bonding

・Oxidation of wafer
surface• Wire bonding

・Thin film formation• Commercializationand final inspection

・Pattern transcriptionof photomask

Circuits are formed on wafters, and after cutting theConventional
packagingchips into smaller pieces, they are individually
bonded and encapsulated onto substrates tocomplete the product.

WLP（Wafer Level Package）• Packaging

PLP（Panel Level Package）

・ Ion implantation

What is PLP (Panel Level Packaging) about?

After cutting the chips individually, only the good
chips are rearranged on the wafer, and then they
are bonded and encapsulated onto the substrate
while the chips are still on the wafer. They are thencut individually.
After cutting the chips individually, only the good
chips are rearranged on a square-shaped panel, andthen they are bonded and encapsulated onto thesubstrate while the chips are still on the panel. They
are then cut individually.

Panel

The chips that have beenrearranged.

• The packaging process involves rearranging numerous chips thathave been individually cut after circuit formation onto thin,square-shaped substrates and then collectively molding them.
This is a packaging technology called “PLP”.
• In PLP, panel substrates larger than the standard 300mm wafer
size, such as 510x515mm square, are commonly used.
• The panel substrate uses printed circuit boards, glass substrates
for LCD panel manufacturing, and copper plates.
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200mm

WLP

300mm

510 × 515mm
600 × 600mm

PLP
All rights reserved.

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Ⅲ. Reference Data ⑯

Business Overview ： Other Automatic Labor-saving Equipment
 Manufacturing products for various industrial fields such as organic EL vapor equipment, assembly
equipment for home appliances, and medical・physics and chemical equipment

Main/New Fields of Other Automatic Labor-saving Equipment
Main field

Main field

Medical physiology and chemical
equipment

Assembly equipment for home
appliances

Manufacturing a system for sample tests(pathological tissue specimen device and fully
automatic continuous thinning device)

Manufacturing all equipment, including motor
assembly equipment built into high-performancehome appliances

Organic EL Vapor Equipment
Contracted the manufacturing of vacuum vapor
equipment for organic EL panels• Focused ultrasound therapy equipment for Pancreatic Cancer Under Development with
SONIRE Therapeutics Inc. (Headquarters: Shinjuku-ku, Tokyo, SONIRE, hereinafter, Sonia)

New field formonetization

Focused ultrasoundtherapy equipment• Aiming for non-invasive cancer treatment that fuses SONIRE's Ultrasonic Technology with ourrobot technology• Started clinical trials in a person and started developing the next mass production device

Main customers, competitors, superiority
Medical physiology andchemical equipment
Japan
Customers

Domestic medical specialty
manufacturers

Assembly equipment
for home appliances
Asia
Customers

Asian home appliancemanufacturers

Organic EL
Vapor equipment
Japan
Customers

Domestic manufacturing
device manufacturers

Hirata’s superiority• Extensive knowledge and expertise in production
facilities and equipment in various fields• Integrated system from development to production andmaintenance• Engineering ability to respond to customer requests

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All rights reserved.

34

Cautionary statement with this document

Please be aware that the performance forecasts and future predictions
mentioned in this document are based on the information available to us at thetime of its creation. They are subject to potential risks and uncertainties, suchas changes in economic conditions, competition with other companies, andexchange

rates.

Therefore,

pleasenote

that

actualperformancemaysignificantly differ from the future outlook mentioned or described in thisdocumentdue

tovariousfactors,

includingchangesinthebusiness

environment.

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