千住金属工业株式会社

SENJU METAL INDUSTRY CO., LTD.

东京都足立区千住桥戸町 23 番地 〒 120-8555
Phone +81-3-3888-5151
URL
www.senju.com/cn

Senju Hashido-cho 23, Adachi-ku, Tokyo 120-8555, Japan
Phone +81-3-3888-5151
URL www.senju.com/en

注 ：关于
“无铅”和
“无卤”的定义 ，
无铅 ：根据 EU RoHS 规定，铅含有率在 1000ppm（0.1wt%）以下即为无铅。
无卤 ：根据 IPC 规格 4101B1，符合下述标准即为无卤。
1. 氯 (Cl) 含有率 ：0.09wt%(900ppm) 以下
2 . 溴 (Br) 含有率 ：0.09wt%(900ppm) 以下
3. 氯及溴含有量总量 ：0.15wt%(1500ppm) 以下

Note: Regarding the definition of “lead-free” and “halogen-free”,
Lead-free: According to EU RoHS regulations, lead content is below 1000ppm (0.1wt%) is lead-free.
Halogen-free: According to IPC specification 4101B1, halogen-free.
1. Chlorine (Cl) content rate: 0.09wt% (900ppm) or less
2. Bromine (Br) content rate: 0.09wt% (900ppm) or less
3. The total content of chlorine and bromine: 0.15wt% (1500ppm) or less※ 仿造品相关注意事项
经证实，以海外为中心，市场上充斥着各种仿造我公司产品的焊料产品。
如需采购，请从我公司的子公司或授权经销商处购买。

Attention to counterfeit products.
Counterfeit flux cored and other inauthentic SMIC solder products have been distributed abroad.
Please purchase genuine SMIC products from SMIC subsidiaries or authorized distributors.

© 2020 Senju Metal Industry Co., Ltd. All rights reserved.
983K-C0520

千住金属工业 FA 设备 综合产品目录＊也可选择N2规格

1＊N₂ specification can also be selected

Spray Fluxer

for Component Soldering

Solder Recycle System

STR-2010....................................P09

Air Atmosphere

Compact desktop reflow oven焊锡回收装置小型桌上回流炉

Air Atmosphere

SOLZEUSLPD.......................................................P18

静压式整体焊接装置
Static pressure typefull soldering machine

SOLZEUSLPF ........................................................P19

SOLZEUS
SNF........................................................P19喷雾式
助焊剂涂覆装置部件实装用SAR-825GT........................P09

空气

性能优越的回流炉

Internal heat circulation
soldering machine喷嘴宽度自动调整局部焊接装置

Void reduction by vacuum zone
in heating section

Industry's leading thermal performance design

内部热循环式浸焊接装置

Static pressure and nozzle width automatic
adjusted type selective soldering machine

通过加热部的减压区域减少空洞

SVR-625GT-C.................P08

SOLZEUSMPF......................................................P17

Dip Solderingfor High-Temperature
Soldering

Flow Soldering Machines

Reflow Oven

SNR-MB.....................................P07

Mac hines

ECOPASCAL
SPF2.............................................P13-16

静压式局部焊接装置空气

Breeze of hot air is ideal for small
solder ball soldering

焊锡球用

热风温和，
非常适合小焊锡球封装FA

稳压式自动焊接装置

Stable pressure flow automatic
soldering machine

Static pressure typeselective soldering machine浸焊

SNR-GT-H...............................P07

高温焊锡用

420℃高温规格
420℃ high-temperature
specifications

回流炉

SNR-GT-W.............................P06

N2

设备

N2

for Solder Balls

Non-stop operation with independent
double chamber

Nitrogen Atmosphere

通过独立的双炉膛实现不间断运作

FA

Air & Nitrogen Atmosphere

Wave soldering

for Component Soldering

SNR-GT-D...............................P05

空气＆

部件实装用

通过双通道使产量倍増
Dual lanes can provide twice of
production output

流焊装置

SNR-GT................................P03-04

波峰焊接

实现节能和高生产率

Superior energy-saving combined withhigh productivity

采用定量泵，可稳定涂覆助焊剂
Metering pump controls coating amount

SSF2 ..................................................P20

使用加工过的芝麻实现回收Enables recycling solder from drossSDS2-5N..................................P20
2

Reflow Oven

Reflow Oven

N₂回流炉

助焊剂回收系统 Flux Management System

SNR-GT Series

N₂ Atmosphere Reflow Oven

追求节能与高生产率的通用回流炉
Superior energy-saving and highly productive general purpose reflow oven通过交叉喷嘴和双重断热结构，实现节能化

标准化装配全区域助焊剂回收系统

Equipped with a flux management system in all zones as a standard feature

免工具轻松维护结构Tool-free easy maintenance通过双重回收系统大幅提升回收率Significantly higher flux collection efficiency by the dual flux collection unit焊膏废弃容器可用于助焊剂回收Reuse an abundant paste container for flux collection

曲径密封机构削减了N 2的使用量
助焊剂回收机构提高了生产效率
Saves more energy with cross nozzle anddouble heat insulation structure
Labyrinth curtain reduces N₂ consumption
Flux management system enhances productivity

助焊剂回收系统OFF状态
Flux management system OFF运转一个月
After one month of use

刚完成清洁时
After cleaning

通过交叉喷嘴提升加热性能助焊剂回收系统ON状态
Flux management system ON

Heating capacity improved by the cross-nozzles
低耗电量

Improves rectilinear propagation of hot air

提高热风的直进性Stability and energy-saving effect at the motor low rotation

具备电机低速旋转时的稳定性及节能效果

Low power consumption
Power optimization through ECO-mode control developedby SMIC搭载SMIC开发的环保模式控制系统实现节电环保通过双重断热结构大幅提升保温力Significant increased heat retention by the double insulation structure

SNR-825GT

温度(℃)
Temperature(℃)

250实现全区域稳定的低氧气浓度

Stable low oxygen concentration in all zones

出入口上下曲径密封机构

Vertical labyrinth curtain at inlet/outlet

Ｎ₂屏障机构

N² curtain
Optimization of N₂ input

Ｎ₂投入量优化
曲径密封机构
Labyrinth Curtain

常规机器Conventional
Conventional
machinemachine100

缩短30分钟
30-minuteshortening

0

10

20
时间(min.)

轨线
输送速度
目标基板

SNR-725GT

部件高度

冷却部
搭载余量
（选择式）
N₂气供应

2,000

电源

1,500
装置尺寸(L×W×H)
轨线

1,000

输送速度
目标基板
部件高度

1

压制外气流入，保持N₂氛围
Prevents inflow of outside air and outflow of N₂ atmosphere

3

4

5

区域 Zone
助焊剂回收杯Flux collection cup

3

2

6

7

8

冷却部

冷却
cooling

搭载余量
（选择式）
N₂气供应
电源

保温力 提升！

60

Improved heat retention

SNR-840GT

SNR-850GT

5,700 x 1,490 x 1,460 mm

0.3 - 2.0 m/min

0.3 - 2.0 m/min

0.3 - 2.0 m/min

0.3 - 2.0 m/min

900±20 mm

900±20 mm

900±20 mm

900±20 mm

W: 50 - 250, L: 100 - 300,

W: 50 - 250, L: 100 - 400,

W: 50 - 400, L: 100 - 500,

W: 50 - 500, L: 100 - 500,

≦10mm [OP: 35mm],≦10mm [OP: 35mm],≦10mm [OP: 35mm],≦10mm [OP: 35mm],

7

8

8

8

1

3 or 4 or 5 mm

T: 0.8 - 3.0 mm≧5 mm [OP: 25mm]
1

3 or 4 or 5 mm

T: 0.8 - 3.0 mm≧5 mm [OP: 25mm]
1

3 or 4 or 5 mm

T: 0.8 - 3.0 mm≧5 mm [OP: 25mm]
1

3 or 4 or 5 mm

≧99.999％, ≧0.4MPa,≧99.999%, ≧0.4MPa,≧99.999%, ≧0.4MPa,99.999%, ≧0.4MPa,

200V, max. 30kW, 90A, 3-phase

200V, max. 30kW, 90A, 3-phase

200V, max. 30kW, 90A, 3-phase

200V, max. 48kW, 140A, 3-phase

250L/min

SNR-1025GT

200L/min

SNR-1050GT

300L/min

SNR-1065GT

350L/min

SNR-1450GT

6,200 x 1,240 x 1,460 mm

6,500 x 1,490 x 1,460 mm

6,800 x 1,790 x 1,460 mm

7,900 x 1,490 x 1,460 mm

0.3 - 2.0 m/min

0.3 - 2.0 m/min

0.3 - 2.0 m/min

0.3 - 2.0 m/min

900±20 mm

900 20 mm

900±20 mm

900 20 mm

W: 50 - 250, L: 100 - 400,

W: 50 - 500, L: 100 - 500,

W: 50 - 650, L: 100 - 700,

W: 50 - 500, L: 100 - 500,

≦10mm [OP: 35mm],≦10mm [OP: 35mm],≦10mm [OP: 30mm],≦10mm [OP: 35mm],

10

10

10

14

≧5mm [OP: 25mm]

加热部

SNR-825GT50

5,300 x 1,390 x 1,460 mm

T: 0.8 - 3.0 mm

500

40

5,300 x 1,240 x 1,460 mm≧5mm [OP: 25mm]

2,500

30
Time(min.)3,000 x 1,326 x 1,430 mm

T: 0.8 - 3.0 mm

加热部

氧气浓度 (ppm)
Oxygen concentration (ppm)

150

0

氧气浓度曲线Oxygen concentration profile

3,000

200

50

装置尺寸(L×W×H)

双重隔热结构
Double insulation structure

Actual starting time实际启动时间
300

1

3 or 4 or 5 mm

T: 0.8 - 3.0 mm≧5mm [OP: 25mm]
2

3 or 4 or 5 mm

T: 0.8 - 3.0 mm≧5mm [OP: 25mm]
2

3 or 4 or 5 mm

T: 0.8 - 3.0 mm≧5mm [OP: 25mm]
2

3 or 4 or 5 mm

≧99.999％, ≧0.4MPa,99.999％, ≧0.4MPa,≧99.999%, ≧0.4MPa,≧99.999%, ≧0.4MPa,

200V, max. 48kW, 140A, 3-phase

200V, max. 48kW, 140A, 3-phase

200V, max. 48kW, 140A, 3-phase

200V, max. 48kW, 200A, 3-phase

200L/min

350L/min

400L/min

400L/minDimensions (L×W×H)
Conveyor height
Conveyor speed

Board dimensions
Component height
Heated zones

Cooling zones

Side edge clearance (select one)N ² (Nitrogen) gas supply
Power requirement

Dimensions (L×W×H)
Conveyor height
Conveyor speed

Board dimensions
Component height
Heated zones

Cooling zones

Side edge clearance (select one)N ² (Nitrogen) gas supply
Power requirement

4Reflow Oven

Reflow Oven

N2回流炉 双通道型

SNR-GT-D Series

N₂ Atmosphere Reflow Oven - Dual Lane TypeN₂回流炉 独立双炉膛型

SNR-GT-W Series

N₂ Atmosphere Reflow Oven - Independent Double Chamber Type

采用双通道使产量倍増通过独立双炉膛实现不间断运作

Dual lanes provide twice the production output

Non-stop Operation with Independent Double Chamber实现不间断运作
可执行自由的温度曲线
提高维护性
节省50％的空间Non-stop operation
Independent temperature profile setting by lane
Improved maintainability

单通道模式下也能应对大型基板

50% space reduction

Compatible with a large size PCB in single mode

Non-stop operation实现不间断运作
通过调整传送带的速度也可应对不同尺寸的基板
Compatible with boards in different sizes with conveyor speed adjustment

Non-stop operation and maintenance by independent
muffle open/close2个上部外壳独立升降，维护时无需停止生产

温度曲线 Temperature profile
300

200
150
100
50
0

50

0

100

时间 (sec.)150

SNR-720GT-D

3,610 x 1,550 x 1,430 mm

目标基板

W: (双重/Dual) 50 - 200 x 2 lanes, (单一/Single) 200.1 - 350 x 1 lane,

部件高度≦10mm [OP: 35mm], ≧5mm [OP: 25mm]

N₂气供应

装置尺寸(L×W×H)
轨线
输送速度
目标基板

5,600

1,790

1,460 ｍｍ

900 20 mm

0.3 - 2.0 m/min

W: (双重/Dual) 50 - 300 x 2 lanes, (单一/Single) 300.1 - 590 x 1 lane,
L: 100 - 400, T: 0.8 - 3.0 mm

部件高度
加热部
冷却部
搭载余量（选择式）
N₂气供应
电源

5

Side edge clearance (select one)N ² (Nitrogen) gas supply

200V, max. 30kW, 90A, 3-phase

SNR-830GT-D≦10mm [OP: 30mm], ≧5mm [OP: 25mm]
8
1

3 or 4 or 5 mm

≧99.999%, 0.3 - 0.5 MPa, 500L/min
200V, max. 48kW, 140A, 3-phase

高
高

高
高

低

低

低
低

低

低

炉膛独立，不受相邻炉膛的热影响No heat interferes by independent double chamber

Cooling zones≧99.999 %, 0.3 - 0.5 MPa, 300L/min电源高Heated zones

3 or 4 or 5 mm

搭载余量（选择式）高Component height

1

300

Low

Board dimensions

7

冷却部

温度曲线 Temperature profile

Hi

Conveyor speed

L: 100 - 400, T: 0.8 - 3.0 mm

加热部

SNR-GT-W

Conveyor height

0.3 - 2.0 m/min

输送速度

基板（小）
Board (small)

250

Dimensions (L×W×H)

900 20 mm

轨线200Time (sec.)基板（大）Board (large)

装置尺寸(L×W×H)

Independent temperature profile setting by lane执行自由的温度曲线

温度 (℃)
Temperature (℃)

温度 (℃)
Temperature (℃)

250

250
200
150
100
50
0

0

50

100

时间(sec.)Power requirement

SNR-1030GT-D

6,300 x 1,790 x 1,460 mm
900 20 mm

0.3 - 2.0 m/min

W: (双重/Dual) 50 - 300 x 2 lanes, (单一/Single) 300.1 - 590 x 1 lane,
L: 100 - 400, T: 0.8 - 3.0 mm≦10mm [OP: 30mm], ≧5mm [OP: 25mm]
102

3 or 4 or 5 mm

≧99.999%, 0.3 - 0.5 MPa, 500L/min
200V, max. 48kW, 140A, 3-phase

SAC

Dimensions (L×W×H)
Conveyor height
Conveyor speed

Board dimensions

装置尺寸(L×W×H)
输送速度
目标基板

Component height
Heated zones

Cooling zones

部件高度

0.3 - 2.0 m/min

0.3 - 2.0 m/min

Power requirement

电源

N₂气供应

900 20 mm

W： 50 - 300 mm, L： 100 - 400 mm, T: 0.8 - 3.0 mm

W： 50 - 330 mm, L： 100 - 400 mm, T: 0.8 - 3.0 mm

81010mm [OP: 30mm],

5mm [OP: 25mm]

10mm [OP: 30mm],[ 99.999%,5 mm

0.4MPa, 250L/min] x 2[200V, max. 30kW, 140A, 3-phase] x 2

5mm [OP: 25mm]

1

1

冷却部
搭载余量（选择式）SNR-1033GT-W

6,900 x 1,930 x 1,454 mm

900 20 mm

加热部Side edge clearance (select one)N ² (Nitrogen) gas supply

SNR-830GT-W

6,000 x 1,930 x 1,480 mm

轨线[ 99.999％,5mm

0.4MPa, 250L/min] x 2

150

Time (sec.)[200V, max. 48kW, 140A, 3-phase] x 2

200

250

SnBi
Dimensions (L×W×H)
Conveyor height
Conveyor speed

Board dimensions

Component height
Heated zones

Cooling zones

Side edge clearance

N ² (Nitrogen) gas supply
Power requirement

6Reflow Oven

Reflow Oven

Ｎ₂回流炉 熱風
超高温型
大気リフロー炉

SNR-GT-H
Series
SNR-GT-H Series

N₂ AtmosphereAir
Reflow
Atmosphere
Oven - Ultra
Hot-Air
High
Reflow
Temperature
Oven
Type

SNR-GT-H Series实现了420℃的温度曲线热风减压N₂回流炉掌握焊锡材料特性，研发出的设计可减少空洞

The SNR-GT-H Series achieves the 420℃ temperature profile“Void free” design by knowledge of solder material characteristics

达到420℃设定的耐热结构减压控制机构可防飞溅，减少空洞通过交叉喷嘴省实现节能化

联机输送方式提高了生产效率
上下交叉喷嘴的热风加热机构可实现节能化

Heat-resistant structure enables up to 420℃ temperature profile

支持高温焊接（设定MAX350℃）

Cross nozzle saves more energy
温度曲线

温度 (℃)
Temperature (℃)

400

SVR-625GT-C

N₂ Atmosphere Reflow Oven - Vacuum Type

Temperature profile

Void free and splash-proof by vacuum chamber
Enhanced production efficiency throughunique inline conveyance system

350
300

Convection heating by the cross nozzles
on top and bottom of the tunnel saves more energy

250
200

Support high temperature soldering (350℃ max.)

150
100
20
0

耐热结构
0

60

120

180

240

300

360

交叉喷嘴

Heat-resistant
structure

420

Cross-nozzles

时间(sec.) Time (sec.)

SNR-725GT-H

3,000 x 1,326 x 1,430 mm

装置尺寸(L×W×H)

Dimensions (L×W×H)

900 20 mm

轨线

0.3 - 2.0 m/min

输送速度

10mm [OP: 35mm],

部件高度

7

加热部

Board dimensions

5mm [OP: 25mm]

Component height
Cooling zones

420 ℃

搭载余量（选择式）
N₂气供应

冷却区域
Cooling zone

Upper limit temperature setting

3 or 4 or 5 mm

Soldering margin

99.999 %, 0.3 - 0.5 MPa, 200L/min电源热风加热 5 区域
Five convection heated zones

Heated zones

1

冷却部

Furnace configuration

Conveyor speed

W: 50 - 250, L: 100 - 300, T: 0.8 - 3.0 mm

目标基板

炉体构成

Conveyor height

减压区域
Vacuum zone

N ² (Nitrogen) gas supply

200V, max. 30 kW, 90A, 3-phase

Power requirement

Ｎ₂回流炉 Bump形成型

曲径密封区域
Labyrinth zone

SNR-MB Series

N₂ Atmosphere Reflow Oven - Bump Formation Type

采用减压炉，实现減少空洞

温和的热风很常适合小焊锡球封装

Void-free vacuum oven
Optimal time/vacuum degree control prevents solder splashingand improves conveyor takt time
Further prevented void by the combination with most suitablesolder materials
Large-size substrate soldering is available by convection
heating mechanism with cross-nozzles

通过控制适当的时间/减压度，減少焊锡飞溅，
提高输送节拍使用合适的材料，进一步減少空洞
通过上下交叉喷嘴的热风加热方式可应对各种大型基板的实装

Breeze of hot air is ideal for reflow process of micro solder balls远红外线/热风并用加热
低氧气浓度（可在100ppm以下）
环境洁净标准（10,000级）
适用于100μm以下的小焊锡球减压控制Vacuum control

Heated by far infrared radiant and convection
Clean environment specification (10,000 class)Compatible with micro solder balls under 100μm

熔融后Immediately after melting

装置尺寸(L×W×H)
轨线
输送速度
目标基板
部件高度
加热部
冷却部
搭载余量（选择式）
N₂气供应
电源

7

SNR-725MB

3,000 x 1,326 x 1,430 mm
900 20 mm

0.3 - 2.0 m/min

W: 50 - 250, L: 100 - 300, T: 0.8-3.0 mm
10mm [OP: 30mm],

75mm [OP: 25mm]

1

3 or 4 or 5 mm

99.999%, 0.3 - 0.5 MPa, 250L/min
200V, max. 30kW, 90A, 3-phase

SNR-1346MB

6,820 x 1,440 x 1,390 mm
900 20 mm

0.3 - 2.0 m/min

W: 50 - 460, L: 100 - 500, T: 0.8 - 3.0 mm
10mm [OP: 20mm], 5mm [OP: 20mm]
132

3 or 4 or 5 mm

99.999%, 0.3 - 0.5 MPa, 600L/min

200V, max. 63kW, 200A, 3-phase

装置尺寸(L×W×H)
Dimensions (L×W×H)

轨线

Conveyor speed目标基板Component height加热部

Cooling zones

搭载余量（选择式）N ² (Nitrogen) gas supply电源Conveyor height

输送速度

Board dimensions

部件高度Heated zones

冷却部Side edge clearance (select one)

N₂气供应Power requirement

减压后In vacuum

任意（P3）
任意（P4）
00减压区域

Vacuum zone

焊锡熔点

Solder melting point200

任意（P1）
Random
任意（P5）
任意（P2）

温度 (℃)
Temperature (℃)

压力
（kPa）
Vacuum degree（kPa）

Low oxygen concentration (under 100ppm)

温度曲线
Temperature profile

250

150
100
50

任意
（T1）

任意
（T2）

任意
（T3）
时间
Time

任意 任意
（T4）（T5）

SVR-625GT-C

5,550 x 1,440 x 1,540 mm
900 20 mm

销链条/Pin-chain type

W: 100 - 250, L: 100 - 300, T: 0.8 - 3.0 mm
10mm [OP: 50mm], 5mm [OP: 25mm]
51
199.999％,5mm

0.4MPa, 600L/min

200V, max 31kW, 90A, 3-phase

0

0

60

120
180
240
300
时间(sec.) Time (sec.)

360

420

Dimensions (L×W×H)
Conveyor heightTransfer form

Board dimensions (W×L)
Component height
Heating zone

Vacuum zones
Cooling zone

Side edge clearance

N ² (Nitrogen) gas supply
Power requirement8

Reflow Oven

Reflow Oven

空气回流炉

SAR-825GT

Air Atmosphere Reflow Oven

回流炉 标准规格

Reflow Oven - Standard Specifications

凭借多年的经验和实际成果制造出性能优越的回流炉
SV
R62
5G
TC
SA
R82
5G
T

●

●

●

●

●

●

-

Laptop PC + PLC control

加热部助焊剂
回收系统

●

●

●

●

●

●

●

-

Flux management systemin the heated zone

基板掉落/停顿感应器

●

●

●

●

●

●

●

-

PCB fall/congestion sensor

基板张数计数器

●

●

●

●

●

●

●

-

PCB counter

氧气浓度计

●

●

●

●

●

●

-

●*

Oxygen analyzer

氧气浓度自动控制机构

●

●

●

●

●

●

-

-

Automatic oxygen
concentration control

智能待机模式

●

●

●

●

-

-

-

-

Intelligent stand-by mode

温度曲线
测定模式

●

●

●

●

●

-

●

-

Temperature profile
measurement mode

3区域风机控制

●

●

●

●

●

●

●

-

3-block fan control

输送配件的特殊表面处理（链条、键材、链轮）

●

●

●

●

●

●

●

-

Conveyor special surface
treatment (chain, key materials
and sprockets)

维护计时器

●

●

●

●

●

●

●

-

Maintenance timer

信号塔

●

●

●

●

●

●

●

-

Signal tower

装置/生产历史记录系统

●

●

●

●

●

●

●

-

Machine/production
history record system

冷却横流风机

-

-

-

-

-

-

●

-

Cooling cross flow fan

ST
R20
10

SN
RM
B

●

SN
RGT
-H

SN
RGT
-D

笔记本PC+PLC控制

通用性高，易于管理

SN
RGT
-W

SN
RGT

Industry's leading reflow oven designed by years of experience and success by SMIC

也可用作粘合剂硬化炉
High versatility and easy maintenanceCan also be used as an adhesive metallization oven

Cutting-edge cross-nozzle heater冷却风机加热部助焊剂回收机构

Cooling fan

Heated zone flux management system

SAR-825GT

3,800 x 1,330 x 1,460 mm

装置尺寸(L×W×H)

Dimensions (L×W×H)

900 20 mm轨线Conveyor height

0.3 - 2.0 m/min

输送速度

Conveyor speed

W: 50 - 250, L: 100 - 400, T: 0.8 - 3.0 mm

目标基板Board dimensions≦35mm, ≧25mm

部件高度Component height8加热部

Heated zones

上边2台、下边1台/Top side2, bottom side1

冷却部（横流风机方式）

Cooling zones (cross flow fan system)

3 or 4 or 5 mm

搭载余量（选择式）Side edge clearance (select one)

200V, max. 30kW, 90A, 3-phase电源Standard Specifications

标准规格交叉喷嘴加热器

Power requirement

桌上回流炉

STR-2010 Series

Desktop Reflow Oven结构紧凑，可实现高可靠性焊接Compact, yet delivers highly reliable soldering*仅限N2 M型

远红外线加热

*Only for N2M

也可选择N₂规格
很适合于研发、验证用途
Far infrared heating
N2 specification can also be selected选项

Also suitable for development or experimentation

架台加热部助焊剂回收系统
无需工具即可轻松维护氧气浓度计（N 2规格时）Rack

Flux management system
Tool-free easy maintenance

Oxygen analyzer (for N₂ specification)

装置尺寸(L×W×H)

STR-2010 N 2M

1,700 × 720 × 534 mm

335 - 385 mm [根据/From FL]

335 - 385 mm [根据/From FL]

输送速度

10 - 100±5% cm/min

10 - 100±5% cm/min

目标基板160 x 200 mm

160 x 200 mm

部件高度

≦10mm

≦10mm

5

5

冷却部

冷却风机/Cooling fan

冷却风机/Cooling fan输送形态链网输送/Mesh conveyor

链网输送/Mesh conveyor

N₂气供应

-

≧99.999%, 0.3 - 0.5 MPa,150NL/min

200V, max. 12kW, 50A, 3-phase

200V, max. 12 kW, 50A, 3-phase加热部(远红外线面板)电源

9STR-2010M

1,700 × 720 × 534 ｍｍ

轨线Dimensions (L×W×H)
Conveyor height
Conveyor speed

Board dimensions

Component height

Heated zones (far infrared panel)

Cooling zones
Transfer form

N ² (Nitrogen) gas supply
Power requirement

笔记本PC + PLC控制
通过3Ｄ显示实现高可操作性
Laptop PC + PLC Control
3D display for easy operation
10

Reflow Oven

Reflow Oven

回流炉 选项

SV
R62
5G
TC
SA
R82
5G
T
ST
R20
10

●

●

●

●

-

●

-

PCB warpage prevention
mechanism

炉体中央排热用管道

●

●

●

●

●

●

●

-

Oven center exhaust duct传送用自转辊

●

●

●

●

●

-

●

-

In-out feeder rollers

UPS电源

●

●

●*1

●

●

●*1

●

-

UPS

外置冷风单元 *2

●

●

●

●

●

●

-

-

External chiller unit ＊2

SN
RGT
硬件

●

●

●

●

●

●

-

Safety light curtain链网输送 *3

●

●

●

●

●

-

●

●*1

Mesh conveyor ＊3

上下曲径密封机构

●

●

●

●

●

●

-

-

Vertical labyrinth curtain

指定涂镀色

●

●

●

●

●

●

●

-

Custom color

马弗炉水平升降开关

＊5

●

●*1

-

-

-

-

-

Muffle elevating system轨线变更（基座/机架）

●

●

●

●

●

●

●

-

Variable conveyor height(spacer/frame)

缺氧监测仪

●

●

●

●

●

●

-

-

Oxygen deficiency monitor

KIC系统
协作

●

●

●

●

-

-

●

-

KIC system collaboration

条形码程序
变更功能

●

●

●

●

●

●

●

-

Automatic changeoverby barcode软
+件8区域风机控制

●

●

●

●

●

●

●

-

8-block fan control

全区域风机控制

●

●

●

●

●

●

●

-

All block fan control

B（微风）规格

●

-

-

-

-

-

-

-

B (breeze) specification

SMEMA信号线

●

●

●

●

●

●

●

-

SMEMA signal wires宽度自动调节机构构 *4（输送轨道）

●

●

●

●

●

●*1

●

-

Automatic width adjustment＊4(conveyor rail)宽度自动调节机构构 *4（防翘曲轨道轨道）

●

●

●

●

●

-

●

-

Automatic width adjustment＊4(warpage prevention rail)

操作员模式/
工程师模式

●

●

●

●

●

●

●

-

Operator mode/
Engineer mode

中英文显示

●

●

●

●

●

●

●

-

Display in English/Chinese

炉体中途停止
开关功能

●

●

●*1

●

●

●*1

●

-

The intermediate stopof the oven cover

Hardware

●

硬件

*1

安全光幕

Hardware + Software

Options选项Software软件

*1 作为标准规格配备*2 也可选择内置型（SNR-GT-W除外）*3 和 *4 不可组合
*5 请联系我们的销售人员
11

SN
RGT
-H

●

SN
RGT
-W

防基板翘曲机构

SN
RGT
-D

SN
RM
B

Reflow Oven - Options
KIC系统协作

条形码程序变更功能

防基板翘曲机构KIC system collaboration

Automatic changeover by barcode

PCB warpage prevention mechanism

炉体中央排热用管道传送用自转辊UPS电源

Oven center exhaust duct

In-out feeder rollers

UPS

外置冷风单元8区域或全区域风机控制

安全光幕

External chiller unit

8 or all block fan control

Safety light curtain

链网输送

（微风）
规格

SMEMA信号线Mesh conveyor

B (breeze) specification

SMEMA signal wires*1 Equipped as a standard specification*2 Built-in type can also be selected (excluding SNR-GT-W)*3 and *4 cannot be selected together*5 Please contact our sales representative12

Flow Soldering Machine

Flow Soldering Machine

波峰焊接装置ECOPASCAL SPF2 Series

Wave Soldering Machine

Stable higher wave realized by the NH deflecting plate

NH偏流板实现了更高更稳定的波即使是超过10 mm的喷流您可以保持稳定的波高

采用稳压流动方式的自动焊接系统，实现了节能

Stable flow wave is compatible with a flow wave height of over 10 mm

Energy-saving automatic stable pressure flow type soldering system通过增强预热能力和加大喷流压力，提升TH部上锡高度喷流波状态 Comparison of wave conditions

采用NH偏流板，实现稳压和镜面喷流
Enhanced through-hole fillings by strengthened preheaters
and stronger wave pressure
Adoption of NH deflect plate makes stable pressure and mirror
surface-like solder flow

19

Stable Pressure Flow

喷流高度 常规偏流板
Flow wave height with a conventional deflecting plate喷流高度 NH偏流板
Flow wave height with a NH deflecting plate

18

17

17

16

16

15
14
13
12
11
10

无整流板

Eliminates the need for a stabilizing plate减少需进行槽内拆卸维护

Allows easy pot cleaning without disassembly

8

稳定喷流

Stable flow wave

6

9稳定的焊锡流动
Uniform flow of solder

泵
Pump

100

200

300

13
12
11
10
9

6

400

宽度方向位置 (mm)Position in the width direction (mm)喷流电机输出频率

0

100

装置近前侧
Front side

装置最里侧
Back side

200

300

宽度方向位置 (mm)Position in the width direction (mm)

400

装置最里侧
Back side

Flow wave motor output

30Hz=36%
正常使用时
Normal output

Without a stabilizing plate, no clogging of oxide occurs and offering stable solder flow

50Hz=60%
正常使用时
High output10

喷流高度（mm）
Flow wave height (mm)

P.W.B.

147
0

无整流板，氧化物不容易堵塞孔眼，喷流稳定无需整流板No need for a stabilizing plate

15

8

7

装置近前侧
Front side稳压流动方式(Stable Pressure Flow)

1918

喷流高度（mm）

稳压流动方式喷流高度（mm）
Flow wave height (mm)

二次波
Second wave

NH偏流板
With a NH deflecting plate

Flow wave height (mm)

一次波First wave

常规偏流板With a conventional deflecting plate应对氮气 N系列

9无整流板
Without a stabilizing
plate

8

有整流板
With a stabilizing
plate

7

6

1

2

3

4

N-Series for N² ambient wave soldering

全罩方式

Full chamber system标准搭载有助焊剂回收系统

Equipped with a flux management system as a standard feature品质提升Ensures high quality of the product

减少氧化物

Reduces oxide of solder5经过时间（H）
Elapsed time (H)SPF2系列通过增强喷流压力和强化加热性能，提升了TH部上锡高度SPF2 Series offers enhanced through-hole fillings by increasing wave pressure and enhancing heat capacity of preheaters
入口传送带Inlet conveyor

旧型号(Previous model)SPF

13

SPF2

旧型号(Previous model)SPF

SPF2

SPF2-400N

出口传送带
Exit conveyor

14

Flow Soldering Machine

Flow Soldering Machine选项标准规格·选项

Standard Specifications

标准规格选项Options

防基板翘曲机构（仅焊锡槽上部/入口～出口)
PCB warpage prevention mechanism(only on the upper solder bath/from inlet to outlet)

上部预热器（仅3、4区域）
Upper preheater (only 3 and 4 zones)

冷却用定点冷却器
Spot cooler unit

UPS电源
UPS

焊锡丝自动供给机Automatic wire solder feeder

基板掉落/停顿感应器
PCB fall/congestion sensor

焊锡槽高度测量卡尺
Solder bath height measuring caliper热风预热器Convection preheater装置内部照明Lighting in machine

耐高温树脂爪Heat resistant resin fingers

自动灭火装置Automatic fire extinguishing system

防火阀
Fire damper

SK感应器
SK sensor

SK感应器（显示屏）SK sensor (monitor)SK喷嘴
SK nozzle

触摸面板+PLC控制●●

Touch panel + PLC control

预热器：远红外线面板4张

●●Preheater: 4 IR panels

输送高度780±20mm●●

Conveyor height 780±20mm

助焊剂回收系统

●●Flux management system

喷流外部体积

●●External flow volume

宽度可调指示器●●

Width adjustment indicator

基板下部冷却风机单元●-

PCB bottom surface cooling fan unit

信号塔

●

●

Signal tower

带入口/出口护套链式传送带●●

Loading/unloading chain conveyor with flanges

输送轨道上下机构●●

Vertical conveyor rail

输送树脂爪

●

●

Conveyor resin fingers

输送爪清洗机构●●

Cleaning mechanism for conveyor fingers

*

●

●

Automatic solder bath up/down and in/out

防焊锡飞溅外罩*●●Solder splash protection cover

防基板翘曲机构●●

PCB warpage prevention mechanism

上部预热器

●

●

Top preheaters

冷却用定点冷却器●-

Spot cooler unit

UPS电源

●

●

UPS

焊锡条自动供给机●-Automatic solder bar feeder

焊锡丝自动供给机●●Automatic wire solder feeder

基板掉落/停顿感应器●●

PCB fall/congestion sensor

焊锡槽高度测量卡尺●●

Solder bath height measuring caliper

SK感应器

●

-

SK sensor

SK喷嘴

●

-

SK nozzle

自动灭火装置●●Automatic fire extinguishing system

防火阀

●

●

Fire damper

装置尺寸(L×W×H)

焊锡槽接口规格

●●Solder bath connector specification

输送速度

轨线变更（基座/机架）●●

Variable conveyor height (spacer/frame)

部件高度

断续喷流

●

●

Pulsating jet flow

焊锡槽容量（约）耐高温树脂爪●●Heat resistant resin fingers

波高侧导板

●

●

Wave-height side guide

全氮化处理

●

●

Full nitride coating

装置尺寸(L×W×H)

热风预热器

●

-

Convection preheater

输送速度装置内部照明●●Lighting in machine

助焊剂发泡装置●-

Forming fluxer

装置/生产历史记录系统●●

Machine/production history record system

备用焊锡槽

●

●

Spare solder bath

指定涂镀色

●

●

Custom color

焊锡槽自动升降/拉出

N₂冷冻器

-

支持PC

-

缺氧监测仪
* 可作为选项应对
15

SP
F2
-N

SP
F2

Standard Specifications・Options* Available as an option●●●

Nitrogen chiller
Compatible with PC
Oxygen deficiency monitor轨线目标基板(W×L)预热器单元（加热区域长度）
N 2气应
空气应
电源

轨线
目标基板(W×L)
部件高度预热器单元（加热区域长度）焊锡槽容量（约）
N 2气应
空气应
电源

装置尺寸(L×W×H)轨线
输送速度
目标基板(W×L)
部件高度预热器单元（加热区域长度）焊锡槽容量（约）
N 2气应
空气应
电源

SPF2-300

SPF2-300N

4,340 x 1,340 x 1,540 mm

4,340 x 1,340 x 1,540 mm

0.5 - 2.0 m/min

0.5 - 2.0 m/min

780 20 mm

780 20 mm

50 x 100 - 300 x 450 mm

50 x 100 - 300 x 450 mm

1,600 (400/zone x 4) mm

1,600 (400/zone x 4) mm≦100mm, ≧5mm

360kg (M705, Sn - 3.0Ag - 0.5Cu)≦50mm, ≧5mm

360kg (M705, Sn - 3.0Ag - 0.5Cu)−≧99.999%, 0.3MPa, ≧300NL/min (18m³/Hr)

200V, approx. 32.5kW, 100A, 3-phase

200V, approx. 32.9kW, 100A, 3-phase−

SPF2-400

4,340 x 1,340 x 1,540 mm
780 20 mm

0.5 - 2.0 m/min

50 x 100 - 400 x 450 mm≦100mm, ≧5mm

1,600 (400/zone x 4) mm

360kg (M705, Sn - 3.0Ag - 0.5Cu)−−

200V, approx. 32.5kW, 100A, 3-phase

SPF2-500≧0.5MPa

SPF2-400N

4,340 x 1,340 x 1,540 mm
780 20 mm

0.5 - 2.0 m/min

50 x 100 - 400 x 450 mm≦50mm, ≧5mm

1,600 (400/zone x 4) mm

360kg (M705, Sn - 3.0Ag - 0.5Cu)≧99.999%, 0.3MPa, ≧300 NL/min (18m³/Hr)≧0.5MPa

200V, approx. 32.9kW, 100A, 3-phase

SPF2-500N

4,640 x 1,440 x 1,540 mm

4,640 x 1,440 x 1,540 mm

0.5 - 2.0 m/min

0.5 - 2.0 m/min

780 20 mm

780 20 mm

50 x 100 - 500 x 600 mm

50 x 100 - 500 x 600 mm

1,600 (400/zone x 4) mm

1,600 (400/zone x 4) mm≦100mm, ≧5mm

520kg (M705, Sn - 3.0Ag - 0.5Cu)≦50mm, ≧5mm

520kg (M705, Sn - 3.0Ag - 0.5Cu)−≧99.999%, 0.3MPa, ≧450NL/min (27m³/Hr)

200V, approx. 32.5kW, 100A, 3-phase

200V, approx. 32.9kW, 100A, 3-phase−≧0.5MPa

Dimensions (L×W×H)
Conveyor height
Conveyor speed

Board dimensions (W×L)

Component height (highest)

Preheater (heated zone length)
Solder bath capacity (approx.)
N ² (Nitrogen) gas supply
Air supply

Power requirement

Dimensions (L×W×H)
Component height
Conveyor speed

Board dimensions (W×L)

Component height (highest)

Preheater (heated zone length)
Solder bath capacity (approx.)
N ² (Nitrogen) gas supply
Air supply

Power requirement

Dimensions (L×W×H)
Component height
Conveyor speed

Board dimensions (W×L)

Component height (highest)

Preheater (heated zone length)
Solder bath capacity (approx.)
N ² (Nitrogen) gas supply
Air supply

Power requirement

16

Flow Soldering Machine

Flow Soldering Machine

局部浸焊装置SOLZEUS MPF Series

Selective Dip Soldering Machine内部热循环式浸焊装置

SOLZEUS LPD Series

Internal heat circulation Dip Soldering Machine

静压式局部焊接实现节能和高品质化

通过独特的内部热循环方法提高焊接质量

Static pressure type selective soldering offers energy-saving and high quality

Soldering quality with unique internal heat circulation system will inprove

静压式喷流方式提高了TH部上锡高度新开发内部热循环系统兼顾了热量均衡和抑制氧化物。

采用间距进给方式，实现量产化模板托盘预热系统实现工件的加热稳定。

根据基板尺寸和形状，也可设计异型喷嘴

多角度控制，可满足多种浸焊条件

Customized static pressure wave method enhances through-hole fillings
Use of pitch-feed mechanism enables mass production

Internal heat circulation system balances soaking and suppress
dross generation

Customized nozzle design available according toboard size and/or shape

Mask pallet preheating system achieves soaking of work
Multi-angle control that enables various dip soldering

在保持镜面的同时实现内部热循环
Internal heat circulation while keep
the mirror surface

利用焊锡浴对模板托盘进行预热时的热源，
实现对工件的热量均衡。
Utilize heat source of solder bathfor preheating mask pallet Efficientsoaking of work

MPF-2077ST

车载应用工件

Examples of automotive application
EPS (Electric Power Steering)

EPS（电动助力转向）Internal heat circulation system

Junction box

接线盒稳定的表面压力分布Realizes stable surface pressure distribution

EV control

EV控制

Power devices

功率器件

Features

内部热循环方式

ECU (Electronic Control Unit)

ECU（电子控制单元）Compressors for air conditioners

空调用压缩机缝隙Slit101375

Slit101370101365101360101355101350

Head lamp / Rear lamp

前照灯/后照缝隙

101380Power windows / Wipers

电动窗/刮雨器

内部热循环式焊锡槽的图像
Image diagram of Internal heat circulation system solder bath101390101385

ABS

ABS

标准规格

特点

101345101340
圧力 [Pa]
圧力:コンターStandard specifications

触摸面板+PLC控制

Touch panel + PLC control

信号塔

Signal tower

周计时器

Weekly timer

预热器（热风/卤素）Preheater (convection/halogen lamps)

助焊剂装置：X-Y伺服控制

Fluxer: XY-axis servo control

加压式助焊剂装置

Pressurized flux tank焊锡表面压力分布数据Solder pressure distribution data

4轴机器人（MPF-2077ST）
4-axis robot (MPF-2077ST)

免工具模板托盘更换机构
Tool-free mask pallet changing
mechanism

通过4轴机器人进行多角度控制
Multi-angle control by 4-axis robot

XY驱动式喷雾装置
XY drive spray fluxer选项上部预热器（热风/卤素）Upper preheater (convection/halogen lamps)

冷却风机单元

Cooling fan unit焊锡倾斜切断机构

Solder inclination cutting mechanism

焊锡波高管理机构

Wave height control mechanism

控制焊锡渣的装置（使用氮气）Solder dross prevention N₂ cover system输送返回结构

Return conveyor
单点喷嘴（MPF-2077ST）
Point nozzle (MPF-2077ST)

MPF-2003ST (联机型/in-line type)

MPF-2077ST (焊盘型/round type)效用

3-phase, AC 200V, 19kVA, Air: φ10joint

3-phase, AC 200V, 44kVA, Air: φ10joint目标基板*

W: 80 - 250, L: 80 - 330, T: max. 50mm

W: 80 - 250, L: 80 - 330, T: max. 50mm

(230 x 310 mm [自基板中央/From the board center])(230 x 310 mm [自基板中央/From the board center])助焊剂装置单元

X-Y程序方式/XY axis programmable

X-Y程序方式/XY axis programmable预热器单元

6kW [OP:卤素加热器/Halogen heater]卤素加热器/Halogen heater (1.2kW × 7)

控制方式

PLC控制/PLC control

PLC控制/PLC control

N₂气体供应**5NL/min [射流轴/Flow shaft part]

5NL/min [射流轴/Flow shaft part]

工件冷却外气冷却风机/Cooling fan with air

外气冷却风机/Cooling fan with air

装置尺寸(L×W×H)（可焊接范围 W×L）

3,070 x 1,206 x 1,650 mm

2,800 x 1,460 x 1,650 ｍｍ

可设定各种浸焊条件

在没有模板的情况下向目标区域涂敷助焊剂

Switch models in a short time

Various dip soldering can be set

Flux to target location can be applied

Dimensions (L×W×H)
Utility

Board dimensions*(solderable range W×L)
Fluxer unit

Preheater unit
Control unit

N ² (Nitrogen) gas supply**

装置尺寸(L×W×H)
效用LPD-2019M

3,310 x 1,550 x 1,650 mm
3-phase, AC 200V, 26kVA, AIR: φ10joint目标基板

W: 150 - 250, L: 150 - 330, T: max.50mm (自基板上表面/Frome PCB topside), 基板下方插入部件的露出部分/Bottom clearance:max. 10mm

输送方式

基板直接搬运、
机器人卡盘
（自动宽度调节类型）/PCB traveling by robot with chuck

助焊剂装置单元
预热器单元焊接

Cooling unit

* H: 基板下部高度/Under the board ** OP: 另需N₂外罩/Optional N₂ cover is required separately.

17实现短时间内的机种切换加压式喷雾单元
（XY驱动)/Pressurized spraying nozzle (XY Drive)
卤素灯/Halogen lump(1.0kWx23本/1st：上５本,下9本/2st:下9本), 耐热玻璃/Heat-resistant glass
内部热循环方式/Internal heat circulation, 焊锡槽容量/Solder bath:500kg, 电动喷射泵/Motor system for soldering pump,

Dimensions (L×W×H)
Utility

Board dimensions
Transfer system
Fluxer unit

Preheater unit
Soldering耐腐蚀表面处理/Corrosion-proof surface treatment
工件冷却外气冷却风机/Cooling fan with air

Cooling unit

18

OtherFlow Soldering Machine

全面浸焊装置SOLZEUS LPF Series

Surface Dip Soldering Machine喷雾式助焊剂装置

SSF2 Series

Spray Fluxer

采用定量泵，可稳定涂覆助焊剂装置设定方便，可进行单一条件下的混流生产

Equipped with a metering pump for stable flux coating

Mixed production under single condition with easy machine setting

槽较深，可用于长引线部件
The Deep soldering bath accepts long lead shape items

焊锡槽
Solder pot

标准规格Standard specifications

通过喷流马达维持一定的液面高度，持续的供热实现高可靠性实装触摸面板 + PLC控制

信号塔

输送传送带

喷嘴清洗功能Achieves highly reliable mounting
by wave motors that keep stablesurface with fresh heat输送链条清洗机构

涂覆流量计

集尘单元

上部预热单元（卤素灯6根）Upper pre-heater unit (6 halogen lamps)

助焊剂流量计（泄露检测）

Flux Flowmeter (leak detection)

冷却风机单元

Cooling fan unit

入口插入导轨（手动用 长度300mm）
入口转移传送带（长度300mm）
出口转移传送带（角度调整式长度300mm）
1次空气的压力按钮卷帘式过滤器规格LPF-2008L目标基板

W: 50 - 360, L: 50 - 410, T: max. 90mm (自基板上表面/From PCB topside), 基板下方插入部件的露出部分/Bottom clearance: max. 50mm

输送方式

输送载体纵循环方式/Conveyor palette vertical rotation system

Transfer system
Fluxer unit加压式喷雾单元/Pressurized spraying nozzle预热器单元Preheater unit

卤素灯/Halogen lump (1.0kW x 12), 耐热玻璃/Heat-resistant glass焊接Board dimensions

Soldering

全面流焊、焊锡槽容量： 400kg、电机式喷射泵、
耐腐蚀表面处理
Whole-surface wave soldering, Solder bath capacity: 400kg, Motor system wave pump, Corrosion-proof surface treatment

Cooling unit外气冷却风机/Cooling fan with air

工件冷却局部浸焊装置SOLZEUS SNF Series

Selective Dip Soldering Machine很适合多种少量生产的局部自动流焊装置

Inlet insertion guide (manual feed, length: 300 mm)
Inlet transfer conveyor(length: 300 mm)
Outlet transfer conveyor (angle adjustable, length: 300 mm)
Primary air pressure switch
Roll filter specification

SSF2-400

Utility3-phase, AC 200V, 24kVA, AIR: φ10joint

助焊剂装置单元

IPA槽的液量管理（喷嘴清洗用)指定涂镀色输送高度变更防火阀

Dimensions (L×W×H)

4,380 x 1,060 x 1,570 mm

效用Signal towerNozzle cleaning function
Flowmeter选项选项

装置尺寸(L×W×H)

Touch panel + PLC Control
Conveyor
Conveyor chain cleaning mechanism
Spray mist collection unit

装置尺寸(L×W×H)

IPA tank liquid amount management(for nozzle cleaning)
Custom color
Specific conveyor heightFire damper

SSF2-500

1,350 x 1,299 x 1,378 mm

1,350 x 1,299 x 1,378 mm

轨线

780±20 mm

780±20 mm

输送速度

0.5 - 2.0 m/min

0.5 - 2.0 m/min

50 x 100 - 400 x 400 mm

50 x 100 - 500 x 400 mm

部件高度≦100mm, ≧15mm≦150mm, ≧15mm

空气供给≧0.5MPa≧0.5MPa

200V, approx. 1.3 kW, 10A, 3-phase

200V, approx. 1.3kW, 10A, 3-phase目标基板(W×L)电源焊锡回收装置Dimensions (L×W×H)
Conveyor height

Conveyor Speed

Board dimensions (W×L)
Component height
Air supply

Power requirement

SDS2-5N

Solder Recycle System靠近焊锡槽，节省空间，实现再利用

Automatic selective dip-soldering machine best suited for high mix, low volume production

Small footprint machine placed near the solder bath for solder recovery喷嘴宽度可自动调节Automatic width adjustable nozzle无需更换喷嘴No nozzle change is required已获专利Patented

在保持基板状态的条件下，
在6～30 mm的范围内，
自动变更为与焊接部位匹配的喷嘴的宽度
焊接连接器时
(宽15mm)焊接电解电容器时(宽 6mm)Automatic width adjustment nozzle between
6 to 30 mm according to the soldering partwith holding PCB

When soldering connectors(width of 15mm)

When soldering electrolytic
capacitors (width of 6mm)

※ Wave speed also changed to keep the same wave height标准规格※喷流转速也会自动切换，以保持相同的喷流高度

支持100V排气管φ100搅拌单元焊锡槽容量12kg选项输送轨道、机器人卡盘宽度自动调整机构助焊剂流量计（泄露检测）上部预热单元（卤素灯3根）应对规格外基板尺寸（请联系我们）

装置尺寸(L×W×H)
效用Automatic width adjust of PCB conveyor rail and holders
Flux Flowmeter (leak detection)
Upper pre-heater unit (3 halogen lamps)
PCB size for out of specification (please consult）＊其他特殊规格请咨询我们的销售人员。
*Please contact our sales representative for any requests.

SNF-2017ST
2,150 x 1,300 x 1,500 mm
3-phase, 200V, 19kVA, AIR: 40L/min (φ10joint), N₂: 10L/min (φ10joint)目标基板

W: 100 - 250, L: 100 - 200, T: max. 40mm (自基板上表面/From PCB topside), 基板边缘死区/PCB edge dead space: 3mm or more

输送方式

基板直接搬运 6轴机器人卡盘（可通过触摸面板操作）/PCB traveling by 6-axis robot with chuck (operable by touch panel)

助焊剂装置单元加压式喷雾单元（XY驱动)、
升降式雾气收集管道

Dimensions (L×W×H)

焊接卤素灯/Halogen lump (1.2kW × 6), 耐热玻璃/Heat-resistant glass带点焊宽度可调式喷嘴、焊锡槽100kg、
伺服电机式喷射泵、
耐腐蚀表面处理、使用Hot N₂
外气冷却风机/Cooling fan with air

Supports 100V

Mold unit for recovered solder

φ100 exhaust duct

Oxide exhaust outlet

Agitation unit

Touch panel + PLC Control

Solder bath capacity 12kg

选项
信号塔
周计时器

Signal tower
Weekly timer

防火阀
指定涂镀色

Fire damper
Custom color

Board dimensions
Transfer system
Fluxer unit

装置尺寸(L×W×H)

SDS2-5N

800 x 650 x 1,000 mm

浮渣最大处理量5kg

Soldering

処理时间
（大约）
*

15min [根据计时器的不同可在1～30min内调整/

Cooling unit电源Preheater unit

Point soldering nozzles for variable width, Solder bath: 100kg, Servo motor system for soldering pump, Corrosion-proof surface treatment, Using hot N₂
工件冷却简易铸模单元氧化物排出口触摸面板 + PLC控制

Utility

Pressurized spraying nozzle (XY Drive), Upward/downward-moving mist collection duct预热器单元Standard specifications

Equipment dimensions (LxWxH)

Maximum dross processing capacity
Dross processing time (approx.)

Adjustable from 1 to 30min using the timer]
100V, approx. 1.2kW, 15A, Single-phase

Power requirement*取决于浮渣状态、
温度、
重量及焊料组分。
/ Varies depending on the dross condition, temperature, weight and the solder condition.

19

20

ECO SOLDERECO SOLDER

焊锡材料

Soldering Materials

SMT用焊锡膏
追求易用性并提升散热性

List of Lead-free Solder Alloys

Solder paste for SMT ULT369

熔融温度（℃）

Achieved both usability and enhancement of heat dissipation

重新评估SMT工序，在提高了润湿性等基本性能的基础上，还要应对微型元器件的印刷性和薄型BGA的
Non-Wet-Open(NWO)，适用于今后越来越小型化的电子装置。

推荐合金 : M705

Revised latest SMT process and improved basic performance of wettability as well as printability for miniaturizedcomponents and compatibility with Non-Wet-Open (NWO) at slim BGA are the best for downsizing trend of electronic
devices.

Recommended alloy : M705产品形态

合成组成（wt%)

Melting temperature（℃）

Alloy composition（wt%)

固相线
峰值温度
液相线
Solidus line
Peak
Liquidus line

Form
BAR

CORE

BALL

PASTE

PREFORM

M-series: 熔融温度 Melting temperature 200 to 250ºC

削减废弃量

提升散热性

改善在印刷工序中发生的焊料粉末与助焊剂的反应。
延长网版上的使用寿命，削减（焊锡膏的）废弃量。

即使是热传导率低的，热密闭型QFN和QFP等，
也能排出气体层（空洞）。

M705

Sn-3.0Ag-0.5Cu

217

219

220

●

●

●

●

●

M30

Sn-3.5Ag

221

223

223

●

●

●

●

●

M31

Sn-3.5Ag-0.75Cu

217

219

219

●

●

●

●

●

M714

Sn-3.8Ag-0.7Cu

217

219

220

●

●

●

●

●

M715

Sn-3.9Ag-0.6Cu

217

219

226

●

●

●

●

●

M710

Sn-4.0Ag-0.5Cu

217

219

229

●

●

●

●

●

Sn-1.0Ag-0.5Cu

217

219

227

●

●

●

●

●

Reduction of waste

Enhancement of heat dissipation

M34

Protect reaction of solder powder and flux during printing.
Improve stencil life to reduce solder paste waste.

Void as gas layer with low thermal conductivity will bedischarged through heat-sealed QFN or QFP.

M771

Sn-1.0Ag-0.7Cu

217

219

224

●

●

●

●

●

M35

Sn-0.3Ag-0.7Cu

217

219

227

●

●

●

●

●

M20

Sn-0.75Cu

227

229

229

●

●

●

●

●

M24MT

Sn-0.7Cu-Ni-P-Ge

228

230

230

●

●

●

●

●

M24AP

Sn-0.6Cu-Ni-P-Ge

227

228

228

●

●

●

●

●

M805E

Sn-0.3Bi-0.7Cu-P

225

229

229

●

●

●

●

●

M40

Sn-1.0Ag-0.7Cu-Bi-In

211

222

222

●

●

●

●

M47

Sn-0.3Ag-0.7Cu-0.5Bi-Ni

216

228

228

●

●

●

●

●

M773

Sn-0.7Cu-0.5Bi-Ni

225

229

229

●

●

●

●

●

M794

Sn-3.4Ag-0.7Cu-Bi-Sb-Ni-x

210

221

221

●

●

●

●

M731

Sn-3.9Ag-0.6Cu-3.0Sb

221

224

226

●

●

●

●

M716

Sn-3.5Ag-0.5Bi-8.0In

196

208

214

●

●

M10

Sn-5.0Sb

240

243

243

M14

Sn-10Sb

245

248

M709

Sn-0.5Ag-6.0Cu

217

226

M760HT

Sn-5.0Cu-0.15Ni-x

228

M711

Sn-0.5Ag-4.0Cu

M770(PA·S)

K2-V

250

常规产品

ULT369ULT369Conventional product

粘度(Pa·s)
Viscosity (Pa·s)

230
210
190
170
150

Day 1

Day 3

Day 5

Day 7

连续使用天数
Days of continuous printing

基板用后期助焊剂 开发路线图 Post-flux roadmap for PCB● 重视作业性
High Productivity
ES-1061SP-2● 适用于低银焊锡
Supports low-silver solder

ES-0307LS● 低固体含量
Low Solids content

ES-1077

ESR-250● 适用于不含银的焊锡Supports silver-free solder

ES-1100● 低固体含量Low solid content

ES-1090● 重视可靠性
High Reliability● 低固体含量Low solid content

ES-1100C● 适用于双面基板
Supports double-sided PCBs

ESR-250T4● 适用于不含银的焊锡Supports silver-free solder

ESR-1100M● 低固体含量
Loe solid content● 无卤

Halogen-free

ES-Z-15
● 低残渣

●
●

●

●

●

●

266

●

●

●

●

●

378

●

229

365

●

217

226

344

●

Sn-2.0Ag-Cu-Ni

218

220

224

●

●

●

●

●

M758

Sn-3.0Ag-0.8Cu-Bi-Ni

205

215

215

●

●

●

●

M832

Sn-3.5Ag-0.8Cu-Bi-Ni

203

214

214

●

●

●

●

M807

Sn-3.5Ag-0.8Cu-Bi-Ni

214

219

219

●

●

●

●

M725

Sn-0.7Cu-Ni-P

228

230

230

●

●

●

●

M823

Sn-0.75Cu-1.5Bi-Ni-x

224

229

229

M705RK

Sn-3.0Ag-0.5Cu-x

219

221

221

●

M20RK

Sn-0.75Cu-x

227

229

229

●

M35RK

Sn-0.3Ag-0.7Cu-x

217

219

227

●

●

●

●

●

L20

Sn-58Bi

139

141

141

L29

Sn-58Bi-Sb-Ni

140

145

145

●

●

●

●

峰值温度；DSC曲线最大吸热量点的温度

Peak temp. : Max. endothermic reaction point on DSC curve

上述产品形态中，当产品尺寸、或产品等级特殊时，视合金成分可能无法提供。

For inquiries regarding alloy compositions not listed above, please contact our sales representatives
or contact us by e-mail (web@senju.com).

关于以上未记载的合金成分，请通过本司销售代表或在官网(web@senju.com)上进行咨询。

Low Residue无铅不纯物标准规格（单位：质量％） Lead-free product impurity standard (unit: percentage by mass)

ESR-01S
2000●

L-series: 熔融温度 低于200℃ Melting temperature : 200 ℃ or lower

ESR-2802010

2020
年/ Year21无铅焊锡合金 一览表

Sb

Cu

Bi

Zn

Fe

Al

As

Cｄ

Ag

In

Ni

Au

Pb

0.07

0.05

0.05

0.001

0.02

0.001

0.03

0.002

0.03

0.02

0.01

0.005

0.05

以下
or less

以下or less

以下or less

以下or less

以下or less

以下or less

以下or less

低于
Less than

以下or less

以下or less

以下or less

以下or less

低于
Less than22