T E M E S C A L P R E C I S I O N C O AT I N G S O L U T I O N S

U N D ER S TA N D I N G T H E S CI E

A vapor cloud forms the heart of every electron beam

But these flux clouds can vary. They change because

evaporation system. Each material evaporated by an elec-of a variety of factors in the deposition process—liketron beam produces a unique, repeatable flux distribution

deposition material, deposition power, crucible size,

characteristic of radiation from a point source.

the use of a crucible liner and beam spot focus.

46.5°

With precision lift-off coating, the goal is an even, predict-

39.5°
35.0°

60.000SR 42.0

able deposition layer across a batch of wafers. Uniformity
masks are the conventional solution for managing the

48.00042.00035.87534.00029.37527.50021.37519.37517.50014.00010.000fluxcloud, trimming the heaviest zones of deposition tomatch that of the least flux zones’ collection.

1.000
0

n=1

EMBR ACEW W W.T E M E S C A L . N E T

N CE O F T H E VA P O R CLO U DFROM HARNESSING THE FIRST ELEC TRON BEAMS
The roots of a Temescal system run deep, back to labs in Berkeley in the 1950s where we pioneered the first electron
beam evaporation components and began patenting the first e-gun designs. Over the years, electron beam evaporation
has become a well-established method for thin film coating, so well established that some might believe that a system issimply the sum of a vacuum chamber, an electron beam gun, and a high-voltage power supply.

T O V O L U M E C O M P O U N D S E M I C O N D U C T O R M E TA L I Z AT I O NWith our long history in designing and building electron beam evaporation systems, we know that a system is morethan an assembly of parts. A precision tool for high-volume uniform coating is a symphony of specialized components,
operating in precise relationships with careful optimizations that harmonize the system with multi-step coatings and theheart of the entire process, the flux cloud..

W E B U I L D H I G H LY O P T I M I Z E D P R O D U C T I O N T O O L S
From our most basic systems designed for R&D or pilot production to our top-of-the-line lift-off coaters, every Temescal
system is designed for precision, efficiency and throughput. It’s one reason why the world’s leading compound semiconductor manufacturers depend upon Temescal systems, batch after batch, day after day.

W E E N G I N E E R P R O C E S S M AT E R I A L U N I F O R M I T Y
For us, the vapor cloud is the heart of every electron beam evaporation system. Each material evaporated by an electron
beam produces a unique cloud, a repeatable flux distribution characteristic of radiation from the point source. Coating
uniformity depends on the relationship between the wafer surface and the cloud. But the flux cloud isn’t static; it’sdynamically shaped by everything from deposition material, power, beam spot focus, crucible size—even factors likewhether you’re using a crucible liner. We engineer Temescal systems to manage these variations, to harmonize with thecloud and deliver unparalleled uniformity.

W E A R E E X P E R T S I N T H E S C I E N C E O F T H E VA P O R C LO U D
For over a decade, Temescal has been dedicated to mapping and better understanding the dynamics of the flux cloud.
Through extensive testing and research, we have collected hundreds of vapor cloud maps and used these maps toadvance and automate the process of Lift-off uniformity mask design. Now, Temescal systems incorporate this expertisein our Auratus deposition enhancement methodology, ensuring that your process is always harmonized to the cloud.

T HE CLO UD
W W W.T E M E S C A L . N E T

W HAT ’ S I NSI D E A

A TEMESCAL SYSTEM IS A PRODUC TION TOOL, DESIGNED FOR MAXIMUME F F I C I E N C Y, H I G H T H R O U G H P U T P R E C I S I O N C O AT I N G . T H I S G U I D I N G
P H I L O S O P H Y D I C TAT E S M A N Y O F T H E S Y S T E M D E S I G N D E C I S I O N S T H AT
RUN THROUGH OUR ENTIRE PRODUC T LINE.

Vacuum Pumping

TemEBeam EBC Integrated Controller

Nobody likes waiting for a system to pump down, but

Our TemEBeam EBC controller bundles all of the sophisti-

when it’s a production tool, waiting is expensive. That’scated sweep pattern and system management capabili-

why Temescal systems maximize the vacuum pumping

ties required to achieve ultimate uniformity into a single,

capacity, so you pump down fast instead of waiting.

easy-to-operate integrated platform.

This is also why Temescal systems feature a load lock
separation between the process chamber and thesource chamber. This feature enables you to service
your process materials, then pump back down withoutloosing vacuum in your process chamber. Practicallyspeaking, what it means is faster process cycles, shorter
wait times and increased process throughput.

The Temescal Poptop Supersource
The Poptop gun is an electron beam source that has been

Fast Recovery Power Supply

uniquely optimized for processes that use multiple materials.

Temescal power supplies are exceptionally responsive with

With it’s pneumatically actuated Poptop crucible cover, thefast arc handling, low arc rates, consistent deposition rate

Poptop is able to seal inactive crucible pockets, eliminatingand high source utilization. These characteristics lead to across-contamination and improving process results.

more stable processes and better control of final thickness
and reduced batch-to-batch variation.

W W W.T E M E S C A L . N E T

T E M E S C A L S YS T E M?

Auratus Deposition Enhancement
Methodology
Our unique Auratus Deposition Enhancement
Methodology takes advantage of specializedcomponents, optimizations and features designed
to improve efficiency, maximize uniformity, andlower material consumption.

Temescal Control System
The Temescal Control System (TCS) provides fully
integrated, recipe-driven process and vacuum control.
Operating in any of three password-protected modes,
the TCS also offers process variable monitoring, process
and historical trend tracking, and process data logging.

Auratus Enhanced Uniformity Masks
TCS System Map During Deposition

We have built a comprehensive library of materials,
mapping the unique characteristics of their flux clouds,
and we’ve used this expertise to help us optimize oursystems for ultimate uniformity.

Auratus Enhanced Conic Chamber
Another enhancement available only on a Temescal is
our unique conical chamber design. The conical chamberoffers significant advantages over traditional box-shaped
chambers by eliminating wasted chamber space andsurface area, reducing pump down time, and decreasing
in-chamber debris accumulation.

HULA
One of the most significant elements in the Auratus
enhancement package is the patent-pending HighUniformity Lift-off Assembly (HULA) with a unique,magnetically-driven dome assembly. With its dual-axis
motion, the HULA ensures that all wafers spend equivalent periods in the high-density and low-density regionsof the vapor cloud.

W W W.T E M E S C A L . N E T

E XPER I EN CE AU R AT US— H

As shown in these uniformity curves,
each process material exhibits different
uniformity characteristics. This makes a
one-size-fits-all uniformity mask problematic. Auratus eliminates this problem,

Unprecedented Uniformity
The Auratus™ deposition process enhancement methodology
enables Temescal customers to coat wafers with near perfectuniformity, resulting in more consistent, better quality products
and fewer defects.

delivering consistent uniformity across allprocess materials.

Uniformity Before Auratus• Achieve near perfect uniformity• No new uniformity mask development whenchanging the process layers (film stack)Uniformity Comparison: Conventional Box Coaters vs UEFC-5700

Gold

79

196.97

15%

Au

UEFC-5700
Conventional Box Coater
10%

Platinum78

195.09Pt
Platinum

Range of Predicted Uniformity

Gold

5%

0%

–5%

–10%

Titanium
–15%

22

47.90

Ti

Titanium

W W W.T E M E S C A L . N E T

Inner Wafers

Outer Wafers

A R M O N Y W I T H T H E CLO U D
Dramatic Savings
With a revolutionary product chamber and a uniquesubstrate holder, an Auratus empowered system offers
significant reductions in material consumption. For
evaporants such as gold and platinum, this can meansavings of up to 40% in material costs.

Unique Chamber Design
Auratus is enhanced with a unique conical vacuum
chamber. This complex fabrication of stainless spunand conic elements offers significant advantages
over conventional box-shaped chambers. The conicalshape reduces volume and surface area, allowing fasterpumpdown times for large chamber volumes, increas-

Magnetically driven, non-contact, High Uniformity Lift-off
Assembly (HULA) without vapor shields

ing process throughput and providing real operationalsavings.

High-Uniformity Lift-off Assembly (HULA)• Eliminates wasted chamber space & surface area
• Significantly reduces pumpdown time
• Reduces in-chamber debris accumulation

Auratus enhances the deposition process using a patentpending High-Uniformity Lift-off Assembly (HULA)
design. The unique, magnetically-driven dome assembly
produces rotational motion with zero metal-to-metal

The Auratus
Methodology

contact, minimizing the generation of particulates for
improved process quality and fewer defects.
UNIQUE CHAMBER DESIGN

Faster pump down
Optimized collection efficiency

With its dual-axis motion, the HULA ensures that all
wafers spend equivalent periods in the high-density andPATENTED SUBSTRATE CARRIER

Value Proposition

Optimized wafer path rotation
Maximized wafer collection efficiency

low-density regions of the vapor cloud. This complex
motion optimizes collection efficiency and also radicallyminimizes the size of the deposition mask. This enhance-

PROCESS DEVELOPMENT

Vapor flux mapping
Process variable optimization

POP TOP EBEAM GUN

ment enables operators to run processes with numerous
metals, deposited at varying rates using a universal mask,
while realizing minimal variations in film uniformities.

Superior magnetics
Zero cross contaminiation

EBC

Proprietary materials
Optimimized sweep patterns

EBEAM POWER SUPPLY

Process stability
1.5ms arc recovery

Temescal ExpertiseW W W.T E M E S C A L . N E T

E M P OW ER ED W I T H AU R AT US—T H E U LT

T H E U E F C- 5 7 0 0 W I T H A U R AT U S :Ultra-High Throughput Tool

U LT I M AT E T H R O U G H P U T F O R 15 0

The UEFC-5700 is the ultimate high-throughput coater for
lift-off processes. The Auratus methodology increases theO R 20 0 M M WA FER S

effective deposition rate, enabling customers to produce
wafers faster. Compared with conventional box coaters, the

The UEFC-5700

UEFC-5700 provides:

The UEFC-5700 is the first Temescal system to incorporate• Large capacity 42 x 150 mm wafers• 40% more wafers with no increase in footprint
or power consumption• Less than 10 minutes to 5E-07 Torr
• 44,000 L/sec pumping• Significantly less surface area and volume

the Auratus deposition process enhancement methodology, dramatically improving lift-off coating processes.
Experience near-perfect uniformity with minimal or no
uniformity masking while reducing material consumption
by as much as 40%.

UEFC-5700 vs Conventional Box Coater(150 mm)

UEFC-5700

Conventional Box Coater
44K

42

47%

20

150 mm Wafers
Coated (per batch)

18K

Pump Speed(L/sec)RelativeCollection
Efficiency

Conventional
Box Coater

UEFC-5700

Wafers per batch

20

42

Batches per day

15

20

Wafers per day

300

840

Performance

Operational Cost of Unreclaimable Gold*
Cost of lost gold per wafer

$9.64

$4.80

Cost per 100,000 wafers$964,000$480,000*Assuming Au cost of $55/gram and reclaim cost of 80%/wafer.

EMBR ACEW W W.T E M E S C A L . N E T

I M AT E L I F T- O FF M E TA L IZ AT I O N TO O L S

T H E U E F C- 4 9 0 0 W I T H A U R AT U S :The Ultimate Mid-sized Tool

U LT I M AT E U N I F O R M I T Y O P T I M I Z E D

The UEFC-4900 is the ultimate high-uniformity mid-sizedcoater for lift-off processes. The Auratus methodology

F O R 15 0 M M W A F E R S

increases the effective deposition rate, enabling customers
to produce wafers faster. Compared with conventional box

UEFC-4900

coaters, the UEFC-4900 provides:

The UEFC-4900 is the compact version of the UEFC-5700.

• Large capacity 25 x 150 mm wafers• 40% more wafers with no increase in footprint
or power consumption• Less than 15 minutes to 5E-07 Torr
• 36,500 L/sec pumping• Significantly less surface area and volume

This system features source-to-substrate and chamber
angles that have been optimized for 150mm wafer
production.

UEFC-4900 vs Conventional Box Coater

UEFC-4900

Conventional Box Coater
37K

25

57%

20

150 mm Wafers
Coated (per batch)

18K

Pump Speed(L/sec)Collection
Efficiency

Conventional
Box Coater

UEFC-4900

Wafers per batch

20

25

Batches per day

15

24

Wafers per day

300

600

Performance

Operational Cost of Unreclaimable Gold*
Cost of lost gold per wafer

$9.64

$5.73

Cost per 100,000 wafers$964,000$573,000*Assuming Au cost of $55/gram and reclaim cost of 80%/wafer.

T HE CLO UD
W W W.T E M E S C A L . N E T

T E M E S C A L CL A SSI C

W I T H A L E G A C Y O F E X C E P T I O N A L U N I F O R M I T Y, P R E C I S I O N A N D
R E L I A B I L I T Y, T H E W O R L D ’ S L E A D I N G C O M P O U N D S E M I C O N D U C T O R
FA B S A N D F O U N D R I E S H AV E B E E N D E P E N D I N G U P O N T E M E S C A LSYSTEMS FOR DECADES. TEMESCAL CLASSIC SYSTEMS REPRESENT OUR
T R A D I T I O N A L D E S I G N S T H AT M A N U F A C T U R E R S A N D S C I E N T I S T S T R U S T,
WITH WELL CHAR AC TERIZED PERFORMANCE, STRONG THROUGHPUTA N D H I G H U N I F O R M I T Y.

FC-4400 and FC-3800 Load-Lock Systems
Optimized for Lift-Off Applications(Gate, Ohmic, TFR)
The FC-3800 and FC-4400 are clean-room-compatibleload-locked systems designed for high-throughput
lift-off applications. Engineered for continuous, efficient
operation, these coaters provide high-uniformity
deposition at source-to-substrate distances ranging
from 34” (965 mm) in the FC-3800 to 42” (1067 mm) in
the FC-4400. Both systems can be configured for either
freestanding or through-the-wall clean room installation, and both support numerous combinations ofdeposition sources and feeding, heating, and cleaning
accessories.

W W W.T E M E S C A L . N E T

COAT I N G S YS T E M S

FC-2800 and BCD-2800
The FC-2800 and BCD-2800 are clean room-compatible
coaters that offer high-throughput efficiency and lift-off
capability at a source-to-substrate distance of either 34”(866 mm) or 42” (1067 mm). Both systems can be configured for either freestanding or through-the-wall clean
room installation, and both support numerous combinations of deposition sources plus a variety of substrate
fixtures and feeding, heating, and cleaning options.

FC-2000 and BJD-2000
Temescal’s FC-2000 and BJD-2000 are versatile evaporation systems that accept a variety of accessories to meetalmost any requirement. Engineered for efficient operationand clean room compatibility, these systems combine
maximum flexibility with ease of use. The FC-2000 is a fastcycle, load-locked system that allows the source to remain
under vacuum during substrate reloading. The BJD-2000 is
non-load-locked.

Convenient Maintenance
The offset pumping port, the hinged door panels, and the swing-out source tray are high-value maintenancefeatures in Temescal bell-jar systems. The offset pumping design reduces unscheduled downtime by minimizing the possibility of debris entering the pumping module. The hinged door panels open to the pumping
system and the vacuum chamber. The electric hoist and the swing-out source tray facilitate access for cleaning,
maintenance, and evaporant reloading. Access to the water manifold, the bellows-sealed high-vacuum valve,and other pumping system components is also simple and direct.

W W W.T E M E S C A L . N E T

CUS TO M IZ A B L E O P T I O NS A N D CO N FI GU R

Customized for Your Application
When you choose a Temescal system, you are selecting

And because your needs evolve over time, Temescal

a platform. While every Temescal system is designed

systems are built around our standard configurations

around our standard architecture, we offer a broad range

platform, making it possible for you to upgrade orof options that enable you to customize each system toreconfigure your system with some simple component

your unique application, process and budget requirements.

changes. This is just one reason why you’ll still find vintage

From crucible sizes and source configurations to chamber

Temescal systems actively working in production facilities

components and substrate carriers, Temescal systems canaround the world—our systems are built to last.

be mixed and matched to your custom requirements.

SYSTEM OPTIONSSYSTEM

UEFC-5700

FC-4400

UEFC-4900

FC-2800

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Sources
Additional fixed e-beam source
Additional turret e-beam source
Single or dual wire feeders
Up to three resistance sources
Ion source: MKII HC or Filament•

Ion source: MKI Filament

SystemProcess gas control for up to three gases
Throttling for PC cryopumps
Residual gas analyzer
Substrate heaters
Chamber temperature monitoring
Product chamber hot water circulation
Soft roughing and venting under TCS control
A second deposition controller & EBC to support
co-deposition
Upgrade to a larger-capacity mechanical pump
SECS/GEM interface to the TCS
Process development and film characterization
TCS simulator for off-line training and processdevelopment
Additional uniformity (shadow) masks
Source extension Collar:
increase source-to-substrate distance

W W W.T E M E S C A L . N E T

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AT I O NS FO R YO U R PR O CE SS R E Q U I R E M EN T S

Custom Uniformity Masks
A Temescal system is more than simply the hardware thatuniformity masks for your system and process, ensuring

your process runs on. When you select a Temescal system,that your Temescal system delivers exceptional uniformity,

we work with you to understand your process. Using ourday in and day out.

library of materials characteristics, we craft custom

Deposition Rates of Various Materials from Temescal Sources*
1000

Au from Liner

Deposition Rate (Å/Sec.)

Mo
Al2O3

Sn from Liner

100

V
Si

Cu from
Liner

SiO2
Cr

Ti

Ge

Ni

Ag

Ta2O5
Co
10
0

Pt
Cu
Zr

Au
Nb
Ta
0
*25-cc pockets used in all tests.
Source-to-substrate distance: 250 mm

To help our customers maximize uniformity and throughput while minimizing
material waste, Temescal offers unparalleled process support, including:• Scientific design of customized uniformity masks• Advanced vapor cloud modeling for any conventional metal or binary compound• Minimization of carrier-imposed effects (e.g., edge exclusion, framing, shadowing)• Compensation for variations in substrate size and shape (e.g., concavity, chord height)• Analysis of problematic material characteristics (e.g., adsorption/desorption, heat limits)• Solutions for coating-stack issues, including stoichiometry and layer and film criteria(e.g., maximum thickness tolerance, uniformity, adhesion, spectral performance, color AB,
pinholes, abrasion resistance, and chemical durability)

W W W.T E M E S C A L . N E T

SYSTEM

UEFC-5700

FC-4400

UEFC-4900

FC-2800

FC-2000

BJD-2000

Ultimate
Uniformity
Production:
150 & 200mm

Production:
150 & 200mm

Ultimate
Uniformity
Production:
150 mmProduction:
100mm

University, R&D,
Pilot Production

University, R&D,
Pilot Production

Product Chamber Type

conic

box

conic

box

bell jarbell jar

Load Lock to isolate Product Chamber

yes

yes

yes

yes

yes

Cryopump water L/sec

44,00044,00036,50021,500

4,000

4,000

Pump down time:

1E-06< 10mins

1E-06< 10mins

1E-06< 10mins

1E-06< 20mins

1E-06< 10mins

1E-06< 15mins

E-gun (max pkg)

2 6x25cc
PopTops + 1
fixed pocket

2 6x25cc
PopTops + 1
fixed pocket

2 6x25cc
PopTops + 1
fixed pocket

4x25ccPopTop + 1
fixed pocket

4x25ccPopTop + 1
fixed pocket

4x25ccPopTop + 1
fixed pocket

E-gun Power Supply

6, 12, or 15 kW

6, 12, or 15 kW

6, 12, or 15 kW

6 or 12 kW

6 or 12 kW

6 or 12 kW

Ion gun

MKII HCMKII HCMKII HCMKII filament

MKI filament

MKI filament

Max wafer count: Lift off

42x150mm,
21x200MM30x150mm,
15x200MM25x150mm

25x100mm,
12x150mm

42x2",
13x100mm

42x2",
13x100mm

Source to Substrate: std

43"

38"

35.5”

34"

19.5"

19.5"

42"

27.5"

27.5"

Source to Substrate: ext

42"

System Control
Temescal Control System (TCS), with Auto, Manualmodes plus process datalogging

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Temescal 4- or 6-pocket Standard or PopTop turretsource

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Temescal model CV-6SLX or CV-12SLX e-beam power
supply (Simba option available)

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Security code-based access for multiple classes of users
TCS-based process variable monitoring (PVM), allowinguser to set tolerance alarms for critical process variables
17" high resolution color touch screen interface

E-BeamTemEBeam Contoller: Sweep, Index, Gun & HV

Substrate
HULA: High Uniformity Lift-off Assembly
Lift-off dome or dome frame with segments
Step coverage High Speed Planatary
Flip tooling: allows for two sided or edge coating
VAP: Variable Angle Planatary

Vacuum Pumping & Control
Market leading dry roughing pump
>60 cfm (102 m3/h)
CTI On-Board Cryopumps
Cryopump temperature monitoring
Active Inverted Magnetron gauges and Pirani
controllers, monitored and controlled by the TCS

W W W.T E M E S C A L . N E T

SYSTEM

UEFC-5700

FC-4400

UEFC-4900

FC-2800

FC-2000

BJD-2000

Ultimate
Uniformity
Production:
150 & 200mm

Production:
150 & 200mm

Ultimate
Uniformity
Production:
150 mmProduction:
100mm

University, R&D,
Pilot Production

University, R&D,
Pilot Production

57 conic

23.52x44H

49 conic283

20 bell jar

20 bell jar

Dual CT-400
35,000 L/Sec

Dual CT-400
35,000 L/Sec

CT-50030,000 L/Sec

CT-40017,500 L/Sec

CT-40017,500 L/Sec

Water cooled product chamber walls

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Two sets of product chamber evaporation shields

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Wide-angle viewport on front of system

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Product Chamber
Dimensions in inches
Product chamber cryopump

Maskless uniformity
One fixed uniformity mask
Spare port(s) for RGA or alternate access10” and 12.75” diameter side ports for
optional components

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Source Chamber
Source-isolation valve allows product chamber accesswhile source chamber remains under vacuum

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CT-10
(9,000 L/Sec)

CT-10
9,000 L/Sec

CT-10
9,000 L/Sec

CT-8
4,000 L/Sec

CT-8
4,000 L/Sec

CT-8
4,000 L/Sec

Source Tray Dimensions in inches

25.5

25.5

20

20

20

18

Drop-down, swing-out source tray, accessible fromeither clean room or chase side of vacuum cubicle

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Stainless steel manifold provides cooling water forsource and product chamber components

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Separate product chamber circuit for cold and optional
hot water

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Source chamber cryopump

Wide-angle 4” viewport
Removable stainless-steel source shields

Water & Air System

PLC-controlled air manifold

System Wide
3 EMO switches
Standard 19” wide electronics rack on casters
Surfaces exposed to high vacuum are made of 304 SST

W W W.T E M E S C A L . N E T

UNITED STATESTemescal Headquarters4569-C Las Positas Road
Livermore, CA 94551
Tel: 800-522-1215 (Toll Free)
Tel: 925-371-4170
Fax: 925-449-4096

EUROPEAN HEAQUARTERS
Ferrotec GmbH
Seerosenstrasse 1
72669 Unterensingen
Germany+49 7022 9270 0+49 7022 9270 10

JAPAN
Ferrotec Corporation
Nihonbashi Plaza Building
2-3-4 Nihonbashi
Chuo-ku, Tokyo 103-0027
Tel: 03(3281)8808
Fax: 03(3281)8848

CHINA
Micro-Power
Semiconductor Ltd
Room 2101
Xinghuo Science Building
No.2 Fufeng Road, Fengtai District,
Beijing 100070, PRC+86 10 88 893350/51, ext. 8010
+86 10 88 893310

KOREA
Zeus Co, Ltd
729 Jubuk-Ri,
Yangji-Myeon, Cheoin-Gu
Yongin-Si, Kyeonggi-Do
449-882 Korea+82 70 8685 5299
+82 31 322 5544 5

TAIWAN
Junsun Tech Company, Ltd
7F, 659, Chung-Cheng Rd.
Hsin-Chuang City
Taipei County 242
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