CONDUCTIVE POLYMER HYBRID ALUMINUM ELECTROLYTIC CAPACITORSRECOMMENDED SOLDERING CONDITIONS◆SURFACE MOUNT TYPE
The following conditions are recommended for air or infrared reflow soldering on the SMD products onto a glass epoxy circuit board of
90×50×0.8mm (with resist) by cream solder. The temperatures shown are the surface temperature values on the top of the can andtemperature of capacitor terminal.
Reflow should be performed twice or less.
Please ensure that the capacitor became cold enough to the room temperature (5 to 35℃) before the second reflow.
Temperature on the top of capacitor (℃)
andTemperature of capacitor terminal (℃)● Recommended soldering heat conditions

Peak temp.

Peak230Size CodeMax. period of time over 230℃

217

Max. period of time over 217℃
PreheatPreheat

E61, F61,
150 to 180℃
F80
120 sec. max.
HA0 to JH0Time maintained Time maintained
Peak temp. Reflow number
above 217℃
above 230℃
50 sec. max.

40 sec.max.

260℃ max. 2-cycles allowed

50 sec. max.

40 sec.max.

260℃ max. 1-cycle only
245℃ max. 2-cycles allowedTime (sec.)● Recommended Solder Land on PC Board
Size codecbab

Solder land on PC board

E61
F61, F80
HA0JA0JC5
JH0

Terminal code：Aabc
1.4
3.0
1.6
1.9
3.5
1.6
3.1
4.2
2.2
4.5
4.4
2.2
4.5
4.4
2.2
4.0
4.7
2.5

[mm]
Terminal code：Gabc
1.9
3.1
4.5
4.5
4.0

3.5
4.2
4.4
4.4
4.7

3.3
3.5
3.5
3.5
3.8

◆RADIAL LEAD TYPE
● Recommended soldering heat conditions
Preheat ：150℃ 120 seconds max.
Flow soldering ：260+5℃ max. 10+1 seconds max. (Or 380±10°C max. 3±0.5 seconds max.: hand soldering)◆PRECAUTIONS FOR USERS
Soldering method

SMD type have no capability to withstand such dip or wave soldering as
totally immersing components into a solder bath.

Reflow soldering

Reflow the capacitors within Recommended Reflow Soldering Conditions.
Verify there is no temperature stress to the capacitors because the following differences might degrade capacitors electrically and mechanically.
Please consult with us if other reflow conditions are employed.
1.Location of components : Temperature increases at the edge of PC
board more than the center.
2.Population of PC board : The lower the component population is, themore temperature rises.
3.Material of PC board : A ceramic-made board needs more heat than aglass epoxy-made board. The heat increase may cause damage to thecapacitors.
4.Thickness of PC board : A thicker board needs more heat than a thinnerboard. The heat may damage the capacitors.
5.Size of PC board : A larger board needs more heat than a smaller board.
The heat may damage the capacitors.
6.Solder thickness
If very thin cream solder paste is to be used for SMD types, please
consult with us.
7.Location of infrared ray lamps : IR reflow as well as hot plate reflow
heats only on the reverse side of the PC board to lessen heat stress tothe capacitors.
8.Case leakage current will increase (～mA) after the reflow process, theleakage current which rose gradually decreases when voltage is applied.
9.Please consult us about vapor phase soldering (VPS).

Mechanical stress

Do not grab the capacitors to lift the PC board and give stress to thecapacitor. Avoid bending the PC board. This may damage the capacitors.

Cleaning assembly board

Immediately after solvent cleaning, remove residual solvent with an airknife for at least 10 minutes. If the solvent is insufficiently dry, the capacitors may corrode.

Coating on assembly board

1.Before curing coating material, remove the cleaning solvents from theassembly board.
2.Before conformal coating, a chloride free pre-coat material is recommended
to decrease the stress on the capacitors.

Molding with resin

Internal chemical reaction gradually produces gas in the capacitor;
increasing internal pressure. If the end seal of the capacitor is completely
coverd by resin the gas will be unable to escape causing a potentially
dangerous situation. The chlorine in resin will penetrate the end seal, reachthe element, and damage of the capacitor.

Glue

The followings are requirements for glue.
1.A low curing temperature over a short period of time
2.Strong adhension and heat resistance after curing
3.Long shelf life
4.No corrosion

OthersRefer to PRECAUTIONS AND GUIDELINES(Conductive Polymer Hybrid).

Rework of soldering

Use a soldering iron for rework. Do not exceed an iron tip temperature of
380±10°C and an exposure time of 3±0.5 seconds.

Product specifications in this catalog are subject to change without notice.Request our product specifications before purchase and/or use. Please use our products based on the information contained in this catalog and product specifications.

CAT. No. E1001Y 2024