Contact

SENJU METAL INDUSTRY CO., LTD.
HEADQUARTERS
Senju Hashido-cho 23, Adachi-ku, Tokyo 120-8555, Japan
Phone +81-3-3888-5151
URL www.senju.com/enAttention to counterfeit products.
Counterfeit flux cored and other inauthentic SMIC solder products have been distributed abroad.
Please purchase genuine SMIC products from SMIC subsidiaries or authaorized distributors.

SMIC Lead-Free Solder Preforms Catalogue© 2020 Senju Metal Industry Co., Ltd. All rights reserved.
975H-E042001K

Solder Preform is pre-forms of solid solder alloys with potential to change the future.
Combination of machining technologies such as rolling and pressing are used to process
the solder alloy into various shapes, allowing the solder to be used effectively.
With the evolution of the soldering process, SMIC has developed ECO SOLDERPREFORM that has various structures to help customer's innovation.

ContentsShape

3Structure

Flux Coated10

Solder Coated Metal

11

Single Layered

7

Double Layered

12

Ni Balls Contained

8

Solder Alloy Lineup

13

Flux Cored

9

Base Material Physical
Properties for Solder
Coated Metal

14Line up

Promote various synergies by selecting from 6 shapes as well as from solder alloy
composition and dimensions.

ShapeShape
Structure
Single Layered

Ni Balls Contained

Flux CoredRibbon

SquareDisc

Solder Coated Metal

Chip

Custom shapes and dimensions are available for customer requirements.

1Wire

Double Layered●●

ReelContainer

Tape &Reel

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Flux CoatedWasherPackaging

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ECO SOLDER PREFORM CATALOGUE

2

Soldering methods for each shape

ShapeRibbon

Wound in tape reels and can be cut into required lengths prior to mounting.

MountL

RibbonT

SquareA

Please ask about thisspecification.

Reel winding for easy automated cutting

SquareSIDE A

T Thickness

Min = 0.5 mm (0.020 in.)
Max = 100 mm (3.937 in.)

Min = 0.05 mm (0.002 in.)
Max = 2.5 mm (0.098 in.)Preform
Preform

Min = 0.5 mm (0.020 in.)
Max = 70 mm (2.756 in.)

TID

SIDE

A

OD Outer Diameter

T Thickness

Min = 0.3 mm (0.012 in.)
Max = 62 mm (2.441 in.)

Min = 0.05 mm (0.002 in.)
Max = 2.5 mm (0.098 in.)OD Outer Diameter

W WidthMin = 1.2 mm (0.047 in.)
Max = 40 mm (1.575 in.)

Min = 0.05 mm (0.002 in.)
Max = 2.5 mm (0.098 in.)

ID Inner Diameter

OD

Min = 0.6 mm (0.024 in.)
Max = 35 mm (1.378 in.)T
SIDE

Fixed amount of solder is supplied to components within a predetermined tolerance range.

SIDE B

B

OD

WasherSubstrate

Cut

T

DiscChip

Min = 0.5 mm (0.020 in.)
Max = 70 mm (2.756 in.)
Min = 0.05 mm (0.002 in.)
Max = 0.35 mm (0.014 in.)

TSIDE

L Length

T Thickness

W

SIDE

W WidthDie (Chip)

B

Enables identification by matching the padshapes of substrates and components.

Disc

Processed into shapes to fit the components.

•Processing condition: (OD–ID)÷2 ≧ T

SIDE AT Thickness

Min = 0.6 mm (0.024 in.)
Max = 3.2 mm (0.126 in.)

Min = 0.3 mm (0.012 in.)
Max = 1.6 mm (0.063 in.)

SIDE B

PreformWasher

Min = 0.3 mm (0.012 in.)
Max = 1.6 mm (0.063 in.)Feeding to where it's difficult to supply solder
paste and flux cored solder.

Reliable heat sealing for areas where paste printing is difficult, preventing uneven heating.
Metal PinWire

OD Outer DiameterOD

Other Shapes

Min = 0.3 mm (0.012 in.)
Max = 1 mm(0.039 in.)Preform

Please ask about thisspecification.

Preform
To make other shape, customers' design drawings and specifications will be required.
Please contact us for more details.

Minimum and maximum values may vary depending on the alloy composition.
3L Length

Reliable heat sealing.

PreformNote) Various shapes and sizes can be made according to customer requirements.
ECO SOLDER PREFORM CATALOGUE

4

Chip
チップ形状

Wire
チップ形状

Reinforces the area where the amount of solder
is insufficient

Makes low-cost, high-quality die bondinga reality•Unique pressing technique flattening all four bonding
faces of the chips•Automatic mounting possible with chip mounter•Joint reinforcement of pin thru-hole components using reflow• The wire method allowing soldering at a cheaper price thanthe preform method• Fewer surface scratches and oxide film combinedwith good wettability making flux-free soldering possible• Superb condition of the wire surface suppressing
the formation of voids

Unique pressing technique allows flattening of all four bonding faces of the chips

The wire method allowing soldering at a cheaper price than the preform method
Example of die bonding

AirGeneral 1005

In Reduction
Furnace

Air

Chip Solder

Flat surface ofChip Solder

SMIC 1005

Wire heating andsupply

Flat surface improves mounting
accuracy

Solder flaring

Chip mounting
and soldering

Wettability comparison（in reducing atmosphere）

Chip solder mounting

SMIC
products

ReflowLess scratches, oil, grease
and oxide film deposits

Without Chip Solder

Proper solder
amountComparison of voids
Void percentage:
Less than 2%

Chip Solder

Chip solder
Solder paste

Heating andsoldering

Preform method

Reflow

Component mounting

Joint reinforcement of pin thru-hole components using reflow
Pin throughholecomponent

Chip mounting

Wettability and voids
Surface condition ofwires（SEM）

Solder paste printing Component mounting

Preform supply

Wire method

Automatic mounting possible with chip mounter

Solder paste printing

In Reduction
Furnace

Excellent wettability

Suppresses theformation of voids
Void percentage:
Less than 5%

With Chip Solder

On-market
products

PWB
Reflow heating

5

ECO SOLDER PREFORM CATALOGUE

6

Ni Balls
ContainedSingle Layered

Solder Alloy Composition and Shapes for Customer's
Requirements

Shape• Consistent solder joint quality in mass production with fixed shapes and quantity.
• Allows for flux-free soldering in inert atmospheres.
• Solder alloys with difficult process properties, such as those containing Bi and Sb,
are available.

Ni Ball Spacer Function Improves Joint Reliability

Shape•Ensures standoff to prevent cracking due to concentrated thermal stress.
•Flat layered structure improves wire bonding accuracy.

Structure

Structure

Ni Balls Contained preform has nickel balls with a small particle size inside the preform. Whensoldering, it forms a standoff with the particle size of the Ni balls as the minimum to ensure theSingle Layered preform is the standard type of ECO SOLDER PREFORM. Can be appliedevenness of the soldering components.

in various soldering methods by selecting proper solder alloy composition depending on
requirements and processing into proper shapes. In addition, the product is processed withhigh dimensional accuracy, which contributes to mass production stability.

Applications

Applications

High-quality power modules
Bare chip

Ideal for die bonding

Heat sink A

Ideal for die bonding where it is difficult to feed the solder andNi balls
contained preform

expecting to eliminate voids.

Automotive DC/ACconverter

Power semiconductor soldering
using Ni balls contained preform

Heat sink B

Power module

Performance / Lineup

Spacer function of Ni balls

Without Ni balls

With Ni balls

Solder thickness [μm]200

Ni balls suppress variations insolder thickness

150
100
500

Without Ni balls

With Ni balls

Solder thickness at each measured location

7

ECO SOLDER PREFORM CATALOGUE

8

Flux Cored

Flux Coated

Synergistic Effect of Preform and Flux

Shape•Fixed shapes and quantity while adding the functions of flux.
•Ideal for thru-hole soldering of connectors, discrete and metal components.
•Reduces production costs by switching from selective flow soldering.

Excellent Joints Even on Uneven Surfaces

Shape•Flux application is not necessary.
•Allows the paste to be applied to hard-to-apply uneven surfaces.

Structure

Structure

Flux Coated preform is the general-purpose preform which is evenly dry-coated with flux,

Flux Cored preform has flux inside the preform. In addition to eliminating the flux application

eliminating the need of manual fluxing.

process, storage and handling are also easier due to the solid stability. Customers can choosealloys and flux according to the requirements and purposes.

Applications

Applications

Assembling metal components

Selective heat soldering of heat-sensitive components

Components
Flux coated preform

PCBPreform
Soldering without
damaging the substrate orother components

Heat sinkThru-hole reflow soldering of inserted components
Solder paste printing

Prefixed components
Printing process

Preforms

Select coating flux according to the purpose

Components

Mount components and preforms
Mounting process

Solder with reflow heating
Gang soldering

Performance / Lineup
Please refer to ourContact us for more information about other products.

9product catalogue.

Cross-sectionof flux coredsolder preform

FluxFlux

Type

IPC classification

Applicable base material

SFC1R

ROL0

Ni/Au plating, Ag, Cu, etc.

SFC2

Halogen free

ROL0

Ni/Au plating, Ag, Cu, etc.

SFC3

RMA

ROL1

Ni/Au plating, Ag, Cu, etc.

SFC4

RA

ROL1

Ni, brass, Cu, Sn, etc.

SFC5RA

ROM1

Ni, brass, Cu, Sn, etc.

Please contact us about available flux types.

ECO SOLDER PREFORM CATALOGUE

10Solder Coated
Metal

Double Layered

Applying the Shapes, Dimensions, and Properties ofBase Metal to Soldering

Shape

Integrating Materials with Different Properties toDevelop New Joint Processing

Shape•Solder alloys with different properties are laminated.
•Two-step soldering utilizing different melting temperatures.
•Optimal joint for electrodes with different surface materials.

•Thick solder coating protects the base metal surface and ensures the solder feed.
•Base metal ensures the soldering standoff and improves its reliability.
•Molding technology enables supplying a variety of shapes.

Structure

Structure

Double layered preform is a multifunctional product where two solder alloys with different

Solder Coated Metal can be used as composite solder joining components by forming a solder

properties are roll cladded. Enables two-step joints by temperature and optimum composition

alloy layer on the surface of ferrous and non-ferrous base metals through a melt coating

solder joints with different materials and treatments by utilizing the difference in temperatures

process and shaping it according to the purpose.

and mechanical properties.

Applications

Applications

Joining with optimum solder composition forbonding surface conditions

Component for hermetically sealed devices

Surface treatment for identifying thecomposition of the surface

Surface treatment Aケース

Case

Solder plated materials

CaseComponent
Replenish

Solder plated materials

Solder composition A
Solder composition B

Component

Surface treatment B

Replenish

SolderCutoff fuses for temperature sensors
Reflow

Alloys with different compositions andmelting temperatures are made into a bimetal structure

Ensures sufficient solder

Solder alloy A

Performance

Ensures standoff andadds joint characteristics
Required
thickness

Uniformity of thesolder coating layer

Double layered preform

Component
Solder

Solder coating layer

Base metal

Base metal

Solder

Solder coating layer

Base metal can be used as a spacer

Solder alloy B

Maintains peel
resistance

Substrate

11Designatedsurface can beengraved

Forms 10 to 25 μm solder coating thickness

MountMolten solder coating layer
does not peel (JIS K5600:
Crosscut method)

Substrate

Reflow

High melting point material(Part of a circuit)Material with low melting
point (Soldering)

Substrate

Overcurrent(Heat)High melting point material
melts and cuts off electricity

SubstrateNote) All products are tailor made. Please contact us when considering these products.

ECO SOLDER PREFORM CATALOGUE

12Base Material Physical Properties for
Solder Coated Metal

Solder Alloy Lineup
Alloy
name

Alloy composition(wt%)

Melting temperature
range

Structure of products

Metalbasematerial℃

M705 Sn-3.0Ag-0.5Cu

217 – 220

●

●

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M30

Sn-3.5Ag

221 – 223

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M31

Sn-3.5Ag-0.75Cu

217 – 219●

M34

Sn-1.0Ag-0.5Cu

217 – 227

M20

Sn-0.75Cu

M40

●

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227 – 229

●

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Sn-1.0Ag-0.7Cu-Bi-In

211 – 222

●

●

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M10Sn-5.0Sb

240 – 243

●

●

●

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M14Sn-10Sb

245 – 266

●

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M794 Sn-3.4Ag-0.7Cu-Bi-Sb-Ni-x

210 – 221●

M725 Sn-0.7Cu-Ni-P

228 – 230●●

M731 Sn-3.9Ag-0.6Cu-3.0Sb

221 – 226●●

M716 Sn-3.5Ag-0.5Bi-8.0In

196 – 214

●

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L20

139 – 141●

Sn-58Bi

●

●

●

●

●

●

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NickelsilverMelting
temperature(℃)
Classification[(°F)]

Composition

O

1110[2030]

Zn-63Cu-18Ni

½H

1110
[2030]

Zn-63Cu-18Ni 440-570

H

1110[2030]

Zn-63Cu-18Ni

C7701

H

1055
[1931]

C1020

HC1100H

Metal No.
JISC7521

CopperTensile
Vickers Young's
Elongation
strengthhardness module(%)(N/mm²)
(Hv)
(GPa)
≧375

Coefficientof thermal
expansion(10-6/K)

ThermalSpecific Electrical
Specific
conductivity
gravity conductivity
heat
(20℃)
(g/cm³) (%IACS)(J/g/K)(W/m/K)≧20-125

16.2(30-300℃ )

8.73

633

0.377

≧5120-180

125

16.2(30-300℃ )

8.73

633

0.377

≧3

≧150

125

16.2(30-300℃ )

8.73

633

0.377

Zn-56Cu-18Ni 630-735≧4180-240

125

16.7(30-300℃ )

8.70

5.5

290.3771083[1981]≧Cu99.96%≧275

2-15

≧80

110-12817.0(20-100℃ )17.7(20-200℃ )8.94

1013490.38

1083[1981]≧Cu99.90%

≧275

2-15

≧80

110-12817.0(20-100℃ )17.7(20-200℃ )8.898.94

1013490.38≧540

The above values are for reference only. Please contact us about materials not listed above.

●Please contact us for more information about other alloy composition.

M705

3% Ag general-purpose alloy with morethan 20 years of experience

M20Ag-free, Cu based
general-purpose alloy

M794

Heat & fatigue-resistant alloy forautomotive applications

M10Sb based general-purpose alloy
with a high melting point

M731

Heat & fatigue-resistant general-purpose
alloy for automotive applications

L 20

Bi based general-purpose alloy
with a low melting point

Realization of fixed shape & quantity by
low-temperature, Bi-based solder preform

High-strength, Sb-based solder composition preforms
allow for secure soldering of electronic power devices

Typical composition

L20250Temp.

(Sn-58Bi)

139 – 141℃

Improving mass production
stability for low-temperaturesoldering and effective for solder
feeding methods to which solder
pastes are difficult to apply.

13

Typical composition

M14

300

Normal profile

200100

Saving energy

Reducing high heatresistant components

0245 – 266℃

Low-temperature,
short-time profile

50

Applicable to heatsensitive components(Sn-10Sb)

150

050

100TimeEnhance productivity

150

200

250

Supplying fixed quantity of high-strength
solder ensures reliable soldering thatcan withstand severe environments
such as those in automotive,industrial, and aerospace equipment.

Instruments
Power controlsystem

Power control system
Engine control system
Power control system
Drive control system

ECO SOLDER PREFORM CATALOGUE14