DIPIPM equipped with a SiC chip : Full SiC Super mini DIPIPM reliability test results

Table 1. Reliability test results
Test Items
試験項目
Resistance to soldering heat
はんだ耐熱性
Solderability
はんだ付け性
Temperature cycle
温度サイクルTerminal strength(pull)
端子強度（引張り）
Terminal strength(Bending)
端子強度（曲げ）Mounting torque
締付けトルクHigh temperature storage
高温保存Temperature humidity storage
高温高湿保存High-Temperature Reverse-Bias
高温逆バイアスIntermittent operating life
断続動作

Test conditions
試験条件
Solder temperature : 260℃
Time: 10seconds
Solder temperature : 250℃
Time: 10seconds-40℃～125℃
30minutes each
100cycles
Control terminal : Weight 5N
Power terminal : Weight 10N
10seconds
Control terminal : Weight 2.5N
Power terminal : Weight 5N
90deg. Bend
2timesMounting screw : M3
0.78N·m
Ta=125℃
1000hours
Ta=60℃
RH=90%
1000hours
Tch=125℃
VDS=0.85*VDSS
1000hours△Tj=100℃
5000cycles

Number of samples
試料数

Number of failures
故障数50505050505050

505050

Table 2. Failure criteria
Parameter
測定項目
IDSS
VSD(off)
VDS(on)VFID
IDBDielectricwithstandCriteria for failure
故障判定基準Lower Limit
Upper Limit下限上限

Measurement conditions
測定条件
VDS=Rated voltage-ID=Rated current
ID=Rated current, VD=VDB=18V, VIN=5V
IF=10mA including voltage drop by limiting resistor
VD=18V, VIN=0V
VD=VDB=18V, VIN=0V
1500Vrms, Sinusoidal, AC 1 minute,all connection pins to heat-sink plate－－－－－－Remarks
備考

U.S.L.×2.0
U.S.L.×1.2
U.S.L.×1.2
U.S.L.×1.2
U.S.L.×2.0
U.S.L.×2.0
Break down

Note : The reliability tests are performed the representative products for the product group.
The measurement items of each test are selected according to our standards.
The symbols in the table are as follows. U.S.L. : Upper Specification Limit

Publication Date : Nov. 2023
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DIPIPM equipped with a SiC chip : Full SiC Super mini DIPIPM reliability test results

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Publication Date : Nov. 2023
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