POSTCARD

Dr. Toshihiro. Takahashi
ISEIM2005 Secretariat
Central Research Institute of ElectricPower Industry,
2-6-1 Nagasaka, Yokosuka,
Kanagawa 240-0196, JapanStamp

ISEIM 2005 Organization:[]

I plan to attend the ISEIM2005 and will beaccompanied byperson(s).

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Honorary Chair
T. Tanaka (Waseda Univ.)
General Chair
T. Okamoto (CRIEPI)Vice Chair
M. Morooka（Kyushu Electric Power Co. Inc.)
Treasurer
K. Kimura（Kyushu Institute of Technology)
Local Arrangements
M. Hikita（Kyushu Institute of Technology)
Technical Program
Y. Miyashita (Mitsubishi Cable Industries, Ltd.)
Publications
H. Nishikawa (Shibaura Institute of Technology)
Asian Affairs
K. Uchida (Chubu Electric Power Company)
International Advisory Committee
Chair: A. Bulinski (Canada)
Members (Tentative):
T. Blackburn (Australia) J. C. Fothergill (UK)
U. Gäfvert (Sweden)
R. Gorur (USA)M. Iwamoto (Japan)
Ho-Gi Kim (Korea)
T. Okamoto (Japan)
C. Laurent (France)
J-U. Lee (Korea)
Y. H. Lee (Korea)
T. Mizutani (Japan)
G. C. Montanari (Italy)
M. Nagao (Japan)
Y. Ohki (Japan)
M. Onoda (Japan)
R. Patsch (Germany)
J. C. Paul (India)
S. Sangkasaad (Thailand)
Suwarno (Indonesia)
J. Smit (Netherlands)
G. Stone (Canada)
M. Taylor (UK)Z. Yan (China)
T. Tanaka (Japan)
M. Hikita (Japan)

2005 International Symposium on
Electrical Insulating Materials(ISEIM 2005)
June 5-9, 2005
The Kitakyushu International
Conference Center
Kitakyushu, Japan

CALL FOR
PAPERS
Sponsored by:
IEEJ Technical Committee on Dielectrics andElectrical Insulation
IEEE Dielectrics and Electrical Insulation Society

Secretariat
T. Takahashi (CRIEPI)Contacts:
A bs t r a c t S ubmi s s i on and Ge ne r a l I nqui r y
Dr. T. Takahashi, CRIEPI
Abstract Submission: iseim@criepi.denken.or.jp
General Inquiry: tosihiro@criepi.denken.or.jp
M a nus c r i pt S ubmi s s i on
Dr. Hiroyuki Nishikawa, Shibaura Institute of Technology
Manuscript Submission: iseim@criepi.denken.or.jp

Co-sponsored by:
Kyushu Institute of Technology
Waseda University
City of Kitakyushu
Supported by:IEEE Fukuoka DEI Chapter
IEEE Tokyo DEIS Chapter

Invitation

Language

ISEIM2005 at Kitakyushu, Japan will be held on June 5-9,
2005. The previous conferences were held in Tokyo, Japan(1995), Toyohashi, Japan (1998), and Himeji, Japan (2001).
The organizing committee cordially invites you to participate inthe conference.
About Kitakyushu
Located midway between Tokyo and Shanghai, Kitakyushu
has thrived as a gateway for trade with Asia since ancient times.
Today, Kitakyushu, population of one million, takes advantageof the proximity to the Asian continent, and is becoming one ofJapan's largest centers for international trade and industry.
Under its "Renaissance Plan", Kitakyushu has implementeda wide variety of projects to guide and globalize the city's focus
on making Kitakyushu "an international city of technology, richin waterfronts and greenery, with a warm and friendly
atmosphere." For further details please consult the following
website: http://www.city.kitakyushu.jp/~english/

Main Topics
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Electrical Conduction and Breakdown in Dielectrics
Space Charge, Surface and Interfacial Phenomena
Dielectric Phenomena and Their Applications
Electrical Insulation for Apparatus and Cables
Dielectric Materials for Electronics and Telecommunication
Nanotechnology for Dielectrics
Biodielectric Materials
New and Functional Dielectric and Electronic Materials
Eco-friendly Dielectric Materials and Recycling
Aging and Degradation, their Detection and Monitoring,and Asset Management
Test and Measurement Techniques
Insulation Design, Reliability, and Simulation

Papers on the following topics are particularly welcome:polymeric insulators and outdoor insulation, space charge
measurements, on-line monitoring and diagnostics of power
apparatus, GIS and cables, diagnosis of GIS, DC cables,development of polymeric cables and joints for higher electricfields, organic and inorganic thin films, new and functional
materials including biological and medical dielectrics, andferroelectric materials.

The working language of the symposium is English. All printed
matter will appear in English.

Submission of Papers
You are invited to submit an abstract of not more than 200
words to the Secretariat preferably via e-mail by October 29, 2004.
The abstract should include title, author's name(s) and affiliation(s)and the mailing and e-mail addresses, phone and fax numbers of thecorresponding author. Acceptance or rejection notices will bemailed by the end of November 2004 to the corresponding authors.
The authors of accepted papers will be requested to electronicallysubmit camera-ready manuscripts by January 10, 2005. Moreinformation on the manuscript submission will be provided on theISEIM2005 web site. Accepted papers will be published in theSymposium Proceedings.

Registration Fees
Registration fee including banquet fee is ¥35,000 (Japanese yen)for members of IEEJ, IEEE, CES, or KIEEME, ¥40,000 for
non-members, and ¥15,000 for students with valid IDs.

ISEIM 2005 Web Siteh t t p : / / www. wa s e d a . j p / a s s o c - I S E I M / I S E I M 2 0 0 5 /i n d e x. h t ml2005 International Symposium on ElectricalInsulating Materials
I am sending, without obligation, my name and address forkeeping me informed about future developments in theorganization of ISEIM2005.

□Prof. □Dr. □Mr. □Ms.
Family Name (Please print)
Given Name
Company
StreetTown, Zip
Country

Important Dates
Abstract Submission: Oct 29, 2004
Acceptance/Rejection Notices: Nov 30, 2004
Manuscript Submission: Jan 10, 2005
Conference Dates: June 5 -9, 2005

PhoneFax
E-mailConference Secretariat
Dr. Toshihiro. Takahashi
ISEIM2005 Secretariat
Central Research Institute of Electric Power Industry,
2-6-1 Nagasaka, Yokosuka,
Kanagawa 240-0196, Japan
E-mail: tosihiro@criepi.denken.or.jp