SML-S1x Series

Data Sheet■Features• Surface mount Lens LEDs
• Narrow directivity and high brightness• Availability of reverse mounting■Outline

■Size
Color
Type

3216（1206） size
3.2×1.6mm （t=1.85mm）

V

U

D

Y

M

P

E

B

■Dimensions■Recommended Solder Pattern

1.6

2.3

(1.6)

2.1

(1.8)
5.1
(4.6)

<Surface Mount〉<Surface
Mount><Reverse〈ReverseMount>
Mount〉

Tolerance : ±0.1

(unit : mm)(unit : mm)■Speciﬁcations
Absolute Maximum Ratings (Ta=25ºC)
Emitting

Part No.

Electrical and Optical Characteristics (Ta=25ºC)

Power Forward Peak Forward

Forward Voltage VF

Reverse Current IR

Color

Dissipation

Current

Current

PD(mW) IF(mA) IFP(mA) VR(V)

Topr(ºC)

Tstg(ºC)

Typ.

IF

Max.

VR

Min.*2 Typ. Max.*2

(V)

(mA)

(µA)

(V)

(nm)

(nm)

(nm)

625

630

635

160

450

615

620

625

400

700

602

605

608

587

590

593

569

572

575

SML-S13VTRed

SML-S13UTSML-S13DT

75

1.9

OrangeAlGaInP

SML-S13YT

Yellow

SML-S13MT

Yellowish green

78

30

100*1

5

-40〜+85-40〜+100

2

SML-S13PT

SMLS14BET

InGaN

Blue

117

20

10

5

IF

Min.

Typ.

IF

(mA) (mcd) (mcd) (mA)

630 1400
20

20
160

400
160

557

560

563

63

3.3

520

527

538

1800 3000

3.2

464

470

476

560.0 800

GreenSMLS14EET

Dominant Wavelength λD Luminous Intensity IV

Operating Temp. Storage Temp.

Chip Structure*1 : Duty 1/10, 1kHz, *2 : Measurement tolerance:±1nm＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿
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2017.11 - Rev.008

[SML-S1x series][Data Sheet]■Electrical Characteristics Curves
Fig.1 Forward Current- Forward Voltages
FORWARD CURRENT : IF [mA]100

Ta=25ºC

SML-S13VT
SML-S13UTSML-S13DT
SML-S13YT
SML-S13MT

10

1
1.6

1.8

2.0

2.2

RELATIVE LUMINOUS INTENSITY [a.u.]

Reference

FORWARD VOLTAGE : VF [V]Fig.2 Luminous Intensity Atmosphere Temperature
1.6

IF=20mA
1.4
1.2
1.0
0.8

0.4
0.2
-40

MAXIMUM FORWARD CURRENT : [mA]

RELATIVE LUMINOUS INTENSITY

Ta=25ºC

1.0

0.5
SML-S13VT
SML-S13UTSML-S13DT
SML-S13YT
SML-S13MT

5

10

15

20

25

FORWARD CURRENT : IF [mA]

0

20

40

60

80

100

Fig.4 Derating

1.5

0

-20

ATMOSPHERE TEMPERATURE : Ta [ºC]Fig.3 Luminous Intensity - Forward Current

0

SML-S13VT
SML-S13UTSML-S13DT
SML-S13YT
SML-S13MT

0.6

30

40

30

20

SML-S13VT
SML-S13UTSML-S13DT
SML-S13YT
SML-S13MT

10

0
-40

-20

0

20

40

60

80

100

AMBIENT TEMPERATURE : Ta [ºC]＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿
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2017.11 - Rev.008

[SML-S1x series][Data Sheet]■Electrical Characteristics Curves

Reference
Fig.2 Luminous Intensity Atmosphere Temperature
RELATIVE LUMINOUS INTENSITY [a.u.]

FORWARD CURRENT : IF [mA]

Fig.1 Forward Current- Forward Voltages
100
Ta=25ºC

SMLS14EET
SMLS14BET

10

1
2.0

2.5

3.0

3.5

4.0

FORWARD VOLTAGE : VF [V]MAXIMUM FORWARD CURRENT : [mA]

RELATIVE LUMINOUS INTENSITY

Ta=25ºC

1.0

0.5

0

5

10

15

20

25

FORWARD CURRENT : IF [mA]

1.2

1.0

0.8

0.6
-40

-20

0

20

40

60

80

100

Fig.4 Derating

1.5

0IF=20mA

SMLS14EET
SMLS14BETATMOSPHERE TEMPERATURE : Ta [ºC]Fig.3 Luminous Intensity - Forward Current

SMLS14EET
SMLS14BET

1.4

30

40
SMLS14EET
SMLS14BET

30

20

10

0
-40

-20

0

20

40

60

80

100

AMBIENT TEMPERATURE : Ta [ºC]＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿
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2017.11 - Rev.008

[SML-S1x series][Data Sheet]■Viewing Angle

Reference

SCANNING ANGLE (deg)X - Y

ｽｷｬﾝ方向(Scanning Direction)

10

20

30

ｽｷｬﾝ方向(Scanning Direction)

30

50

50

40

50

60

70

80

80

90
100

90
100

90
100
X'

RELATIVE INTENSITY (%)

SCANNING ANGLE (deg)

60

70

80

50

50

60

70

ｽｷｬﾝ方向(Scanning Direction)

30

40

60

X - Y

20

30

40

0

10

20

40

50

70

80

0

50

90
100
Y'

50

RELATIVE INTENSITY (%)

Y

SCANNING ANGLE (deg)X' - Y'SMLS14EET
SMLS14BET

0
10

10

0
10

20

10

20

20

20

30

ｽｷｬﾝ方向(Scanning Direction)

30

30

30
40

40

40

40

50

50
50

50

60

60
60

60

70

70
70

70

80

80

90
100
Y

90
100

80

90
100
X

SML-S13VT
SML-S13UTSML-S13DT
SML-S13YT
SML-S13MT
SML-S13PT

0

10

20

X

SCANNING ANGLE (deg)X' - Y'

0
10

50

0

50

RELATIVE INTENSITY (%)

80

50

0

50

X'

90
100
Y'

RELATIVE INTENSITY (%)＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿
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2017.11 - Rev.008

[SML-S1x series]■Rank Reference of Brightness*

Red(V,U)[Data Sheet]*Measurement tolerance:±10%(Ta=25ºC, IF＝20mA)

Rank
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
W
X
Y
Z
Iv (mcd)
1.0～1.6 1.6～2.5 2.5～4.0 4.0～6.3 6.3～10 10～16 16～25 25～40 40～63 63～100 100～160 160～250 250～400 400～630 630～1000 1000～1600 1600～2500 2500～4000
SML-S13VT
SML-S13UTOrange(D)(Ta=25ºC, IF＝20mA)

Rank
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
W
X
Y
Z
Iv (mcd)
1.0～1.6 1.6～2.5 2.5～4.0 4.0～6.3 6.3～10 10～16 16～25 25～40 40～63 63～100 100～160 160～250 250～400 400～630 630～1000 1000～1600 1600～2500 2500～4000
SML-S13DT

Yellow(Y)(Ta=25ºC, IF＝20mA)

Rank
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
W
X
Y
Z
Iv (mcd)
1.0～1.6 1.6～2.5 2.5～4.0 4.0～6.3 6.3～10 10～16 16～25 25～40 40～63 63～100 100～160 160～250 250～400 400～630 630～1000 1000～1600 1600～2500 2500～4000
SML-S13YT

Yellowish Green(M), Green(P)(Ta=25ºC, IF＝20mA)

Rank
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
W
X
Y
Z
Iv (mcd)
1.0～1.6 1.6～2.5 2.5～4.0 4.0～6.3 6.3～10 10～16 16～25 25～40 40～63 63～100 100～160 160～250 250～400 400～630 630～1000 1000～1600 1600～2500 2500～4000
SML-S13MT
SML-S13PT

Green(E )(Ta=25ºC, IF＝20mA)

Rank
R1
R2
S1
S2
T1
T2
U1
U2
V1
V2
W1
W2
X1
X2
Y1
Y2
Z1
Z2
Z3
Iv (mcd)
56～71 71～90 90～110 110～140 140～180 180～220 220～280 280～360 360～450 450～560 560～710 710～900 900～1100 1100～1400 1400～1800 1800～2200 2200～2800 2800～3600 3600～4500
SML-S14EET

Blue(B)(Ta=25ºC, IF＝20mA)

Rank
R1
R2
S1
S2
T1
T2
U1
U2
V1
V2
W1
W2
X1
X2
Y1
Y2
Z1
Z2
Iv (mcd)
56～71 71～90 90～110 110～140 140～180 180～220 220～280 280～360 360～450 450～560 560～710 710～900 900～1100 1100～1400 1400～1800 1800～2200 2200～2800 2800～3600
SML-S14BET＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿
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[SML-S1x series][Data Sheet]■Taping（T86)0.25±0.05
1.75

4.0
← Ｂ
φ1.5 +0.1
0（Feeding holes）

4.0

(5°)

1.95

3.45 ±0.1↑
Ａ'(2.75)

↑
Ａ

8.0

3.5

(5°
)

2.0

1.7±0.05

0.5 ±0.1
(2.2)

← Ｂ'

1.8 ±0.01

Ｂ-Ｂ' cross sectional view
(5°)

Ａ-Ａ' cross sectional view
11.4 ±1

φ13

φ60

180

+1
0

0
-3

Unit:ｍｍNote)Tolerance is within ±0.2mm unlessotherwise specified.
Packing quantity
2,000pcs/reelPulldirection■Part No. Construction*"-"will be taken out for emitting color

Special Code will be applied for

Chromaticity rank

Rank sign

WB/B/E series.

Emitting color WB/B/E series.

(for white LED）

(Brightness Rank)*

S

M

L

Series name

SML Chip LED

－

S

1

3

Package TypeChip typeV

T

Emitting Color

Resin Color

6

U

Taping Specification

0Standard Type

V

Red

T

Transparent Colorless

T86 Cathode at sprocket hole side(the back)E1 1.6x0.8 t=0.36mm

1

Low Current TypeURed

W Milkey White

T68 Cathode at sprocket hole side(the top)

D1 1.6x0.8 t=0.55mm

2High Brightness type

U2

Red

B

H1

3

D

Orange4

Y3

Yellow

01 3.0x2.0 t=1.3mm

5Y2

Yellow

3.5x2.8 t=1.9mm

6Y

Yellow

A1 1.6x1.15 t=0.55mm

7W

Yellow

3.4x1.25 t=1.1mm

8

M2 Yellowish green

Z1/ZN

81/82

2.0x1.25 t=0.8mm

Ultra High Brightness typeK1 4.5x2.0 t=0.6mm

M

Yellowish green

S1 3.2x1.6 t=1.85mm

F

Green

P2 1.0x1.0 t=0.2mm

P

Green

52 1.3x1.5 t=0.6mm

E

Green

Black

*Concerning the Brightness rank.
*Please refer to the rank chart above forluminous intensity classification.

P34

1.0x1.0 t=0.2mm

B

Blue

*Part name is individual for each rank.
*When shipped as sample,the part name willP36

1.5x1.0 t=0.2mm

WB

White

be a representative part name.

VN 3.5x2.8 t=0.6mm

T Phototransistors
RGB

Chip LED

8

P1 1.0x0.6 t=0.2mm

M1

SCM

T

01 3.0x1.5 t=2.2mm■Packing Speciﬁcation

Red/Green/Blue

General products are free of ranks.
Please contact sales if rank appointment
is needed.

ROHM LED products are being shipped with desiccant (silica gel) included in moisture-proof bags.
Pasting the moisture sensitive label on the outer surface of the moisture-proof bags
or enclosing the humidity indication card inside the bag is available upon request.
Please contact the nearest sales office or distributer if necessary.
＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿
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[SML-S1x series][Data Sheet]■Precaution (Surface Mount Device)
１．Storage
If the product is heated during the reflow under the condition of hygroscopic state,
it may vaporize and expand which will influence the performance of the product.
Therefore, the package is waterproof. Please use the product following the conditions:・Using Conditions
Classification Temperature
Humidity
Expiration Date
RemarkWithin 1 year
①Before using 5〜30℃
30〜70%RH
Storage with waterproof package
from Receiving②After opening
Please storing in the airtight container
5〜30℃ Below 70%RH
Within 168hpackagewith our desiccant (silica gel)・Baking
Bake the product in case of below:①The expiration date is passed.
②The color of indicator (silica gel) turned from blue to colorless or from green to pink.
(Even if the product is within the expiration date.)・Baking Conditions
Temperature
Time
Humidity
60±3℃
12〜24hBelow 20%RH
・Bake products in reel.
・Reel and embossed tape are easy to be deformed when baking,Remarkso please try not to apply stress on it.
・Recommend bake once.
２．Application Methods
２－１．Precaution for Drive System and Oﬀ Mode
Design the circuit without the electric load exceeding the ABSOLUTE MAXIMUM RATING thatapplies on the products. If drive by constant voltage, it may cause current deviation of the LED andresult in deviation of luminous intensity, so we recommend to drive by constant current.
(Deviation of VF Value will cause deviation of current in LED.) Furthermore, for off mode,
please do not apply voltage neither forward nor reverse. Especially, for the products with theAg-paste used in the die bonding, there’s high possibility to cause electro migration and resultin function failure.
２－２．Derating
The Derating Characteristics are based on the lifetime of luminous intensity and assumptionof degradation & color change of sealing resin or reflector. About its reliability,
please evaluate its using conditions and environment and use it after confirmed there is no problem.
２－３．Operation Life Span
There’s possibility for intensity of light drop according to working conditions and environments(applied current, surrounding temperature and humidity, corrosive gases), please call our Sales
staffs for inquiries about the concerned application below.
①Longtime intensity of light life
②On mode all the time
２－４．Applied Stress on ProductNo resin hardening agent such as filler is used in the sealing resin of the product.
Therefore, please pay attention to the overstress on it which may influence its reliability.
２－５．Usage
The Product is LED. We are not responsible for the usage as the diode such as Protection Chip,
Rectifier, Switching and so on.

＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿
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[SML-S1x series][Data Sheet]

３．Others
３－１．Surrounding Gas
Notice that if it is stored under the condition of acid gas (chlorine gas, sulfured gas) oralkali gas (ammonia), it may result in low soldering ability (caused by the change in quality ofthe plating surface ) or optical characteristics changes (light intensity, chrominance) and change
in quality of cause die bonding (Ag-paste) materials. All of the above will function failure of
the products.
Therefore, please pay attention to the storage environment for mounted product (concern thegenerated gas of the surrounding parts of the products and the atmospheric environment).
３－２．Electrostatic Damage
The product is part of semiconductor and electrostatic sensitive, there’s high possibility to be damagedby the electrostatic discharge. Please take appropriate measures to avoid the static electricity fromhuman body and earthing of production equipment. Especially, InGaN type LEDs have lower resistancevalue of electrostatic discharge and it is recommended to introduce the ESD protection circuit.
The resistance values of electrostatic discharge (actual values) vary with products, therefore,
please call our Sales staffs for inquiries.
３－３． Electromagnetic Wave
Applications with strong electromagnetic wave such as, IH cooker, will influence the reliability of LED,
therefore please evaluate before using it.

＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿
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[SML-S1x series][Data Sheet]

４．Mounting
４－１. Soldering
・No resin hardening agent such as ﬁller is used in the sealing resin of the product. Therefore, resin
expansion and moisture absorption at humidity will cause heat stress during soldering process andfinally has bad influence on the product’s reliability.
・The product is not guaranteed for ﬂow soldering.
・Do not expose the product in the environment of high temperature (over 100℃) or rapid temperature
shift (within 3℃/sec. of temperature gradient) during the flow soldering of surrounding parts.
In case of carrying out flow soldering of surrounding parts without recommended conditions, pleasecontact us for inquiries.
・Please set appropriate reﬂow temperature based on our product usage conditions and speciﬁcation.
・The max for reﬂowing is 2 times, please ﬁnish the second reﬂow soldering and ﬂow solderingwith other parts within the usage limitation after open the moistureproof package.
・Compare with N2 reﬂow, during air reﬂow, because of the heat and surrounding conditions,
it may cause the discoloration of the resin.
・For our product that has no solder resist, because of its solder amount and soldering conditions,one of its speciﬁc characteristics is that solder will penetrate into LED. Thus, there's high possibility
that will influence its reliability.Therefore, please be informed, concerning it before using it.
４－２. Automatic Mounting
４-２-１. Silicon Resin Sealing Product
The sealing resin of LED is very soft, so please select adsorption nozzle that would not apply stressdirectly on the sealing section.
４-２-２. Mini Package (Smaller than 1608 size)
・Vibration may result in low mounting rate since it will cause the static electricity of product andadhere to top cover tape. Therefore, the magnet should be set on parts feeder cassette of
the mounter to control the product stabilization. In addition, it is recommended to set ionizer
to prevent electrostatic charge.
４－３. Mounting Location
The stress like bending stress of circuit board dividing after mounting, may cause LED package crack
or damage of LED internal junction, therefore, please concern the mounting direction and position
to avoid bending or screwing with great stress of the circuit board.

Stress strength according tohe mounting position:
A＞B＞C＞D

2.1

1.6

2.3

(1.6)

４―４. Mechanical Stress after Mounting
The mechanical stress may damage the LED after Circuit Mounting,so please pay attention to the touch on product.
４－５．Soldering Pattern for Recommendation
We recommend the soldering pattern that shows on the right.
It will be different according to mounting situation of circuit board,
therefore, please concern before designing.

(1.8)
5.1
(4.6)

※The product has adopted the electrode structure that it should solder
with back electrode of the product.
Thus, please be informed that the shape of electrode pin of<Reverse<Surface Mount〉〈ReverseMount>
Mount〉<Surface
Mount>
solder fillet formation is not guaranteed.
【Land pattern diagram】（Unit：mm）
The through hole on electrode surface is for conduction of front
andrear electrodes but not for formation of solder ﬁllet.
＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿
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2017.11 - Rev.008

[SML-S1x series][Data Sheet]

４－６．Reﬂow ProﬁleFor reﬂow proﬁle, please refer to the conditions below:(※)■Meaning of marks, Conditions
Mark
Tsmax
Tsmin
ts
TL
tL
TP
tP
ΔTR/ΔtΔTD/ΔtMeanings

Conditions
180℃
Minimum of pre-heating temperature
140℃
Time from Tsmin to Tsmax
Over 60sec.
Reference temperature
230〜260℃
Retention time for TL Within 40sec.
Peak temperature
260℃(Max)
Time for peak temperature Within 10sec.
Temperature rising rate Under 3℃/sec.
Temperature decreasing rate Over -3℃/sec.
Maximum of pre-heating temperature※Above conditions are for reference. Therefore, evaluate by customer’s own circuit boards andreflow furnaces before using, because stress from circuit boards and temperature variations of reflow
furnaces vary by customer’s own conditions.
４－７．Attention Points in Soldering Operation
This product was developed as a surface mount LED especially suitable for reflow soldering.
So reflow soldering is recommended. In case of implementing manual soldering,please take care of following points.
①SOLDER USED
Sn-Cu，Sn-Ag-Cu，Sn-Ag-Bi-Cu②HAND SOLDERING CONDITION
LED products do not contain reinforcement material such as a glass fillers.
So thermal stress by soldering greatly influence its reliability.
Please keep following points for manual soldering.
ITEM

a)
b)

RECOMMENDED CONDITION
Condition ) Temp. of iron top less than
350℃ within 3 sec.
Heating method
Heating on PCB pattern, not direct to theLED. (Fig-1)
Handling after Please handle after the part temp.
soldering goes down to room temp.

Fig.-1SOLDERINGSOLDERING

４－８．Cleaning after Soldering
Please follow the conditions below if the cleaning is necessary after soldering.
Solvent
We recommend to use alcohols solvent such as, isopropyl alcohols
Temperature
Under 30℃ within 3 minutes
Ultrasonic Cleaning
15W／Below 1 liter (capacity of tank)
DryingUnder 100℃ within 3 minutes＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿
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2017.11 - Rev.008

NoticeNotes1) The information contained herein is subject to change without notice.
2) Before you use our Products, please contact our sales representative and verify the latest specifications :3) Although ROHM is continuously working to improve product reliability and quality, semiconductors can break down and malfunction due to various factors.
Therefore, in order to prevent personal injury or fire arising from failure, please take safetymeasures such as complying with the derating characteristics, implementing redundant andfire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no
responsibility for any damages arising out of the use of our Poducts beyond the rating specified by
ROHM.
4) Examples of application circuits, circuit constants and any other information contained herein areprovided only to illustrate the standard usage and operations of the Products. The peripheral
conditions must be taken into account when designing circuits for mass production.
5) The technical information specified herein is intended only to show the typical functions of andexamples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly,
any license to use or exercise intellectual property or other rights held by ROHM or any otherparties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use ofsuch technical information.
6) The Products are intended for use in general electronic equipment (i.e. AV/OA devices, communication, consumer systems, gaming/entertainment sets) as well as the applications indicated inthis document.
7) The Products specified in this document are not designed to be radiation tolerant.
8) For use of our Products in applications requiring a high degree of reliability (as exemplified
below), please contact and consult with a ROHM representative : transportation equipment (i.e.
cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety
equipment, medical systems, servers, solar cells, and power transmission systems.
9) Do not use our Products in applications requiring extremely high reliability, such as aerospaceequipment, nuclear power control systems, and submarine repeaters.
10) ROHM shall have no responsibility for any damages or injury arising from non-compliance withthe recommended usage conditions and specifications contained herein.
11) ROHM has used reasonable care to ensur the accuracy of the information contained in thisdocument. However, ROHM does not warrants that such information is error-free, and ROHM
shall have no responsibility for any damages arising from any inaccuracy or misprint of suchinformation.
12) Please use the Products in accordance with any applicable environmental laws and regulations,such as the RoHS Directive. For more details, including RoHS compatibility, please contact a
ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting
non-compliance with any applicable laws or regulations.
13) When providing our Products and technologies contained in this document to other countries,
you must abide by the procedures and provisions stipulated in all applicable export laws andregulations, including without limitation the US Export Administration Regulations and the Foreign
Exchange and Foreign Trade Act.
14) This document, in part or in whole, may not be reprinted or reproduced without prior consent of
ROHM.

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R1102ADatasheet

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