OV-7604-C7
Application Manual

Application
Manual
OV-7604-C7

Low Power Clock Oscillator
32.768 kHz

August 2023

1/20

Rev. 1.4

Micro Crystal
Low Power Clock Oscillator 32.768 kHz

OV-7604-C7

TABLE OF CONTENTS
1.

OVERVIEW ..................................................................................................................................................... 3
1.1. GENERAL DESCRIPTION ......................................................................................................................... 3
1.2. APPLICATIONS ......................................................................................................................................... 3
1.3. ORDERING INFORMATION ...................................................................................................................... 42.

BLOCK DIAGRAM ......................................................................................................................................... 5
2.1. PINOUT ...................................................................................................................................................... 5
2.2. PIN DESCRIPTION .................................................................................................................................... 5
2.3. DEVICE PROTECTION DIAGRAM ........................................................................................................... 6

3.

ELECTRICAL SPECIFICATIONS .................................................................................................................. 7
3.1. ABSOLUTE MAXIMUM RATINGS ............................................................................................................ 7
3.2. OPERATING PARAMETERS .................................................................................................................... 7
3.3. TYPICAL CHARACTERISTICS ................................................................................................................. 8
3.4. TIMING WAVEFORMS .............................................................................................................................. 8
3.5. OSCILLATOR PARAMETERS .................................................................................................................. 9
3.5.1. XTAL FREQUENCY VS. TEMPERATURE CHARACTERISTICS ..................................................... 9

4.

PACKAGE .................................................................................................................................................... 10
4.1. DIMENSIONS AND SOLDER PAD LAYOUT .......................................................................................... 10
4.1.1. RECOMMENDED THERMAL RELIEF ............................................................................................. 10
4.2. MARKING AND PIN #1 INDEX ................................................................................................................ 115.

MATERIAL COMPOSITION DECLARATION & ENVIRONMENTAL INFORMATION ............................... 125.1. HOMOGENOUS MATERIAL COMPOSITION DECLARATION ............................................................. 125.2. MATERIAL ANALYSIS & TEST RESULTS ............................................................................................ 13
5.3. RECYCLING MATERIAL INFORMATION .............................................................................................. 14
5.4. ENVIRONMENTAL PROPERTIES & ABSOLUTE MAXIMUM RATINGS ............................................. 15

6.

APPLICATION INFORMATION ................................................................................................................... 16
6.1. OPERATING OV-7604-C7 ....................................................................................................................... 16
6.2. SOLDERING INFORMATION .................................................................................................................. 176.3. HANDLING PRECAUTIONS FOR MODULES WITH EMBEDDED CRYSTALS ................................... 18

7.

PACKING & SHIPPING INFORMATION ..................................................................................................... 19

8.

COMPLIANCE INFORMATION ................................................................................................................... 20

9.

DOCUMENT REVISION HISTORY .............................................................................................................. 20

August 2023

2/20

Rev. 1.4

Micro Crystal
Low Power Clock Oscillator 32.768 kHz

OV-7604-C7

OV-7604-C7
Low Power Clock Oscillator 32.768 kHz
1. OVERVIEW
•
•
•
•
•
•
•
•
•
•
•
•

Oscillator with built-in “Tuning Fork” crystal oscillating at 32.768 kHz
Very tight frequency tolerance: ±20 ppm
Excellent oscillator stability: < 1.5 ppm/VHigh shock and vibration resistanceWide operating voltage range: 1.2 V to 5.5 V
Very low power consumption: typ. 300 nA
Standard operating temperature range TA: -40 to +85°C
Extended operating temperature range TB: -40 to +125°C
Synchronized CLKOUT enable/disable
Low aging rate
Miniature ceramic SMD package, RoHS-compliant and 100% lead-free: 3.2 x 1.5 x 1.0 mm
Automotive qualification according to AEC-Q200 available

1.1. GENERAL DESCRIPTIONThe OV-7604-C7 combines an advanced very low power CMOS oscillator circuitry together with a 32.768 kHz“tuning-fork” crystal in a miniaturized ceramic package. No external components are required. The very low power
consumption over a wide supply voltage and temperature range is the key feature of this product.
The frequency output on CLKOUT pin can be enabled/disabled synchronous by the CLKOE pin. The CLKOUT
frequency is enabled when CLKOE pin is connected to VDD. When the CLKOE pin is tied to GND the frequency isdisabled and the CLKOUT pin is tied to Low State.
The OV-7604-C7 is also available in extended temperature range version (-40°C to +125°C).

1.2. APPLICATIONSThe OV-7604-C7 oscillator module combines very low power consumption with a very small ceramic package:• Smallest oscillator module (embedded XTAL) in a very small 3.2 x 1.5 x 1.0 mm lead-free ceramic package• Price competitive
The unique size and the competitive pricing make this product perfectly suitable for many applications:• Communication: IoT / Wearables / Wireless Sensors and Tags / Handsets• Automotive:
M2M / Navigation & Tracking Systems / Dashboard / Tachometers / Engine Controller
Car Audio & Entertainment Systems• Metering:
E-Meter / Heating Counter / Smart Meters / PV Converter / Utility metering• Outdoor:
ATM & POS systems / Surveillance & Safety systems / Ticketing Systems• Medical:
Glucose Meter / Health Monitoring Systems• Safety:
Security & Camera Systems / Door Lock & Access Control• Consumer:
Gambling Machines / TV & Set Top Boxes / White Goods• Automation:
PLC / Data Logger / Home & Factory Automation / Industrial and Consumer Electronics

August 2023

3/20

Rev. 1.4

Micro Crystal
Low Power Clock Oscillator 32.768 kHz

OV-7604-C7

1.3. ORDERING INFORMATION
Example:Code

OV-7604-C7-20/+20ppm

QC

Operating temperature range

TA (Standard)
TB-40 to +85°C-40 to +125°C

Code
QC (Standard)
QA
QM

TA

Qualification
Commercial Grade
Automotive Grade AEC-Q200
Medical Grade** See OV-7604-C7 Medical product.

August 2023

4/20

Rev. 1.4

Micro Crystal
Low Power Clock Oscillator 32.768 kHz

OV-7604-C7

2. BLOCK DIAGRAM

4

VDD

32.768 kHz
CRYSTAL

2

GND

OSC

1

CLKOUT

3

CLKOE

OUTPUT
CONTROL2.1. PINOUT
OV-7604-C7 Package: (top view)

#4

#3

7604
#1

#1

CLKOUT

#2

GND

#3

CLKOE

#4

VDD

#2

2.2. PIN DESCRIPTION
SymbolPin #CLKOUT

1

GND

2

CLKOE

3

VDD

4

August 2023

Description
Clock Output; push-pull; controlled by CLKOE. If CLKOE is HIGH (VDD), the CLKOUT pin drives thesquare wave of 32.768 kHz. When CLKOE is tied to Ground, the CLKOUT pin is LOW.
Ground.
Input to enable the CLKOUT pin. If CLKOE is HIGH, the CLKOUT pin is in output mode. When
CLKOE is tied to Ground, the CLKOUT pin is LOW.
Power Supply Voltage.

5/20

Rev. 1.4

Micro Crystal
Low Power Clock Oscillator 32.768 kHz

OV-7604-C7

2.3. DEVICE PROTECTION DIAGRAM

CLKOUT

GND

August 2023

1

4

2

3

6/20

VDD

CLKOE

Rev. 1.4

Micro Crystal
Low Power Clock Oscillator 32.768 kHz

OV-7604-C7

3. ELECTRICAL SPECIFICATIONS
3.1. ABSOLUTE MAXIMUM RATINGS
Absolute Maximum Ratings according to IEC 60134:
SYMBOL
VDD
VI
VO
PTOT
VESD
ILU
TOPRA
TOPRB
TSTO
TPEAK

PARAMETERCONDITIONSPower supply voltage
Input voltage
Output voltage
Total power dissipation
Electrostatic discharge Voltage
Latch-up current
Standard operating temperature TA
Extended operating temperature TB
Storage temperature
Maximum reflow condition

MIN

MAX

UNIT

-0.3
-0.3
-0.3

6.0
6.0
6.0
300
±2000
±100
85
125
125
265

V
V
V
mW
V
mA
°C
°C
°C
°C

(1)

HBM

(2)

-40
-40
-55

Stored as bare product
JEDEC J-STD-020C(1) HBM: Human Body Model, according to JESD22-A114.
(2) Latch-up testing, according to JESD78., Class I (room temperature), level A (100 mA).

3.2. OPERATING PARAMETERS
For this Table, VDD = 3.0 V; GND = 0 V; TOPR = 25°C; unless otherwise indicated.
Operating Parameters:
SYMBOLPARAMETERCONDITIONS

MIN

TYP

MAX

UNIT

SupplyVDDPower supply voltage

VDDSR

VDD slew rateVDD Supply Current. CLKOUT(1)
disabled.

IDD

Input CLKOE
VI
Input voltage
VIL
LOW level input voltage
VIH
HIGH level input voltage
Output CLKOUT
VOH
HIGH level output voltage
VOL
LOW level output voltage
CL
Output load capacitancetrOutput rise timetf
Output fall time
Synchronized CLKOUT enable
tCKH
time (see following diagram)
Synchronized CLKOUT disable
tCKL
time (see following diagram)

TOPR = -30 to 125°C
TOPR = -40 to -30°C
VDD = 3.0 V, TOPR = 25°C
VDD = 5.0 V, TOPR = 25°C
VDD = 3.0 V, TA = -40 to 85°C
VDD = 5.0 V, TA = -40 to 85°C
VDD = 3.0 V, TB = -40 to 125°C
VDD = 5.0 V, TB = -40 to 125°C

August 2023

300
320

GND -0.3
GND
0.8 VDD
IOH = -1.0 mA
IOL = 1.0 mA
CMOS
CL = 10 pF, 10% to 90% VDD
CL = 10 pF, 10% to 90% VDD(1) When CLKOUT is enabled (CLKOE is HIGH) the additional Ve.g. ∆IDD = 10 pF x 3.0 V x 32’768 Hz = 980 nA

1.2
1.3

5.5
5.5
±0.5
500
550
1000
1100
1500
1650

V
V/ms

nA

VDD +0.3
0.2 VDD
VDD

V
VV

GND +0.4
15
100
100

V
V
pF
ns
ns

15.3

45.8

µs

0

15.3

µs

VDD – 0.47070

DD supply current ∆IDD can be calculated as follows: ∆I DD = CL x VDD x fOUT

7/20

Rev. 1.4

Micro Crystal
Low Power Clock Oscillator 32.768 kHz

OV-7604-C7

3.3. TYPICAL CHARACTERISTICS
Supply current IDD vs. Supply voltage VDD: TOPR = 25°C, CLKOUT disabled
500
450
400

IDD [nA]

350
300
250

200
150
100
50

0
0

1

2

4

3

5

6

VDD [V]3.4. TIMING WAVEFORMS
Synchronized CLKOUT enable/disable time:

32.768 kHz

CLKOE

CLKOUT
tCKL

tCKH

32.768 kHz

CLKOE

CLKOUTtCKH

August 2023

8/20

tCKL = 0

Rev. 1.4

Micro Crystal
Low Power Clock Oscillator 32.768 kHz

OV-7604-C7

3.5. OSCILLATOR PARAMETERS
For this Table, VDD = 3.0 V; GND = 0 V; TOPR = 25°C; unless otherwise indicated.
Oscillator Parameters:
SYMBOLPARAMETER

Xtal GeneralftSTART

Crystal Frequency
Oscillator start-up time

δCLKOUTCONDITIONSMINTOPR = -30 to 125°C
VDD = 1.2 to 5.5 V
TOPR = -40 to -30°C
VDD = 1.3 to 5.5 V

CLKOUT duty cycle

Xtal Frequency Characteristics
Δf/f
Frequency accuracy
Frequency vs. voltage
Δf/Vcharacteristics
Frequency vs. temperatureΔf/fTOPR
characteristics
T0
Turnover temperatureΔf/fAging first year max.

TYP

MAX

UNIT

32.768
250

500

kHz
ms

60

%

±20

ppm

±1.5

ppm/V

-0.035ppm/°C2 (TOPR-T0)2 ±10%

ppm

20

°C
ppm

40

±10
1.5 V ≤ VDD ≤ 5.5 V
TOPR = -40°C to +125°C
VDD = 3.0 V

30±3

3.5.1.XTAL FREQUENCY VS. TEMPERATURE CHARACTERISTICS
25

T0 = 25°C (± 5°C)

0
-25
-50
-75
-100

f/f [ppm]

-125
-150

f/f = -0.035 * (T-T0)2 ppm (±10%)

-175
-200
-225
-250
-275
-300
-325
-350
-50

August 2023

-40

-30

-20

-10

0

10 20 30 40
Temperature T [°C]

9/20

50

60

70

80

90

100 110 120 130

Rev. 1.4

Micro Crystal
Low Power Clock Oscillator 32.768 kHz

OV-7604-C7

4. PACKAGE
4.1. DIMENSIONS AND SOLDER PAD LAYOUT
OV-7604-C7 Package:
Package dimensions (bottom view):

Recommended solder pad layout:

3,2

0,55

1

2

4

3

1,0

0,8

0,75

1,7

0,125

1,0 max

0,8

1,5

0,4

0,75

0,55

1,0

Dimensions:
Tolerances:
Drawing:

in mmunless otherwise specified ±0.1 mm
OV-7604-C7_Pack-drw_20230814

4.1.1.RECOMMENDED THERMAL RELIEF
When connecting a pad to a copper plane, thermal relief is recommended.

BAD

GOOD

O

P
August 2023

10/20

Rev. 1.4

Micro Crystal
Low Power Clock Oscillator 32.768 kHz

OV-7604-C7

4.2. MARKING AND PIN #1 INDEX
Laser marking OV-7604-C7 Package: (top view)

Product Date Code#4

M039A1#3

M039A17604#1

M
Micro Crystal

0
Year

39
Week

A1
Batch

#2
Part Designation

Pin 1 Index

August 2023

11/20

Rev. 1.4

Micro Crystal
Low Power Clock Oscillator 32.768 kHz

OV-7604-C7

5. MATERIAL COMPOSITION DECLARATION & ENVIRONMENTAL INFORMATION
5.1. HOMOGENOUS MATERIAL COMPOSITION DECLARATION
Homogenous material information according to IPC-1752 standard
Material Composition OV-7604-C7:
4

5
2
1
8
9
3
6
7

(Symbolic drawing)
No.

Item
Component
Name

Sub ItemMaterial
Name

Material
Weight
(mg)
(%)

1
2

Resonator
Electrodes

Quartz Crystal
Cr+Au

0.27

3
4

Housing
Lid

Ceramic
Ceramic
Ni-plating
Au-plating
Solder Preform

6.30

5

Seal

6

Terminations

7

Conductive
adhesive

Internal and extrenal
terminals

0.005

4.65
0.38
0.33

Silver filled Silicone
glue

100%
6%
94%
100%
98.5%
1.0%
0.5%
80%
20%
80%
15%
5%
88%
12%

0.09
0%

8

CMOS IC9

Die attach

SiliconDie pad platingGold bumps

Unit weightAugust 2023

0.34
0.025

94%
6%
100%

Substance
Element
SiO2
Cr
Au
Al2O3
Al2O3
Ni
Au
Au80 / Sn20
Mo
Ni
Au 0.5 micron
Ag
Siloxanes andsilicones
Distillates, petroleumhydrotreated
Si
Au
Au

CAS
Number

Cr:
Au:

Ni:
Au:
Au:
Sn:
Mo:
Ni:
Au:
Ag:

14808-60-7
7440-47-3
7440-57-5
1344-28-1
1344-28-1
7440-02-0
7440-57-5
7440-57-5
7440-31-5
7439-98-7
7440-02-0
7440-57-5
7440-22-4
68083-19-2
64742-47-8

Si:
Au:
Au:

Comment

Ceramic Lid
Nickel platingGold plating

Molybdenum
Nickel platingGold plating
di-Me, vinyl groupterminatedDoes not appear infinished product7440-21-3
7440-57-5
7440-57-5

12.4

12/20

Rev. 1.4

Micro Crystal
Low Power Clock Oscillator 32.768 kHz

OV-7604-C7

5.2. MATERIAL ANALYSIS & TEST RESULTS
Homogenous material information according to IPC-1752 standard
No.
Item
Sub Item
RoHS
Component
Material
Name
Name

Cd

Hg

Cr(VI)

PBB

PBDE

F

CI

Br

I

BBP

DBP

DEHP

DIBP

Phthalates

Pb

Halogens

1

Resonator

Quartz Crystal

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

2

Electrodes

Cr+Au

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

3

Housing

Ceramic

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

4

Lid

Ceramic Lid & Plating

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

5

Seal

Solder Preform

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

6

Terminations

Int. & ext. terminals

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

7

Conductive
adhesive

Silver filled Silicone glue

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

8

CMOS IC

Silicon & Die pad plating

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

9

Die attachGold bumps

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

nd

MDL [ppm]

Method Detection Limit

2

8

5

50

50

nd (not detected) = below “Method Detection Limit” (MDL)
Test methods:
RoHS• Pb, Cd
• Hg
• Cr(VI)• PBB / PBDE
Halogens
Phthalates

August 2023

Test method with reference to:
IEC 62321-5:2013
IEC 62321-4:2013 + AMD1:2017
IEC 62321-7-2:2017
IEC 62321-6:2015
Test method with reference to BS EN 14582:2016
Test method with reference to IEC 62321-8:2017

13/20

MDL:
MDL:
MDL:
MDL:
MDL:
MDL:

2 ppm
2 ppm
8 ppm
5 ppm
50 ppm50 ppmRev. 1.4

Micro Crystal
Low Power Clock Oscillator 32.768 kHz

OV-7604-C7

5.3. RECYCLING MATERIAL INFORMATION
Recycling material information according to IPC-1752 standard.
Element weight is accumulated and referenced to the unit weight of 12.4 mg.
Item
No.
Item
Material
Substance
Material
Component
WeightElement
Name
Name
(mg)
(%)
Quartz Crystal
Chromium
CeramicGold

Tin
Nickel
Molybdenum
SilverSiloxanes andsilicones
Distillates

Silicon

1
2
3
4
2
4
5
6
8
9
5
4
6
6
7a
7b

Resonator
Electrodes
Housing
Lid
Electrodes
Lid
Seal
Terminations
CMOS ICDie attach
Seal
Lid
Terminations
Terminations
Conductive adhesive
Conductive adhesive

7cConductive adhesive

8

CMOS IC

Unit weight (total)

August 2023

CAS
Number

0.27
0.0003

2.18
0.002

SiO2
Cr

10.88

87.81

Al2O3

0.39

3.18

Au

Au:

7440-57-5

0.076

0.61

Sn

Sn:

7440-31-5

0.096

0.77

Ni

Ni:

7440-02-0

0.26
0.079

2.13
0.64

Mo:
Ag:

7439-98-7
7440-22-4

0.011

0.09

Mo
Ag
Siloxanes andsilicones

0

0

0.32

2.58

12.4

100

14/20

Cr:

14808-60-7
7440-47-3
1344-28-1

68083-19-2

DistillatesSi

Comment

64742-47-8
Si:

di-Me, vinyl groupterminatedhydrotreatedpetroleum, does notappear in finishedproducts

7440-21-3

Rev. 1.4

Micro Crystal
Low Power Clock Oscillator 32.768 kHz

OV-7604-C7

5.4. ENVIRONMENTAL PROPERTIES & ABSOLUTE MAXIMUM RATINGS
PackageSON-4 ceramic package
Parameter
Product weight (total)
Storage temperature
Moisture sensitivity level (MSL)FIT / MTBF

Description
Small Outline Non-leaded (SON), hermetically sealed ceramic package with ceramic lid.
Directive

Conditions
Store as bare product

IPC/JEDEC J-STD-020D

Value
12.4 mg-55 to +125°C
MSL1
available on request

Terminal finish:

NickelGold

August 2023

15/20

0.5 µmMolybdenum

5 µm

Ceramic

Rev. 1.4

Micro Crystal
Low Power Clock Oscillator 32.768 kHz

OV-7604-C7

6. APPLICATION INFORMATION
6.1. OPERATING OV-7604-C7
10 nF

1
VDD
CLKOE

VDD

VDD

GPIO

OV-7604-C7

MCU
GND

CLKOUT

2

GND

1
2

A 10 nF decoupling capacitor is recommended close to the device.
If CLKOE is HIGH (VDD), the CLKOUT pin drives the square wave of 32.768 kHz. When CLKOE is tied to
Ground, the CLKOUT pin is LOW.

August 2023

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Rev. 1.4

Micro Crystal
Low Power Clock Oscillator 32.768 kHz

OV-7604-C7

6.2. SOLDERING INFORMATION
Maximum Reflow Conditions in accordance with IPC/JEDEC J-STD-020C “Pb-free”

tP

TP

Critical Zone
TL to TP

TemperatureRamp-up

TL

tL

Tsmax

Tsmin
Ramp-downtsPreheat25

t 25°C to Peak

Temperature Profile
Average ramp-up rate
Ramp down Rate
Time 25°C to Peak Temperature
PreheatTemperature min
Temperature max
Time Tsmin to Tsmax
Soldering above liquidus
Temperature liquidus
Time above liquidus
Peak temperature
Peak Temperature
Time within 5°C of peak temperature

August 2023

Time
Symbol(Tsmax to TP)
Tcool
Tto-peakCondition
3°C / second max
6°C / second max
8 minutes max

Unit°C / s°C / s
min

Tsmin
Tsmax
ts

150
200
60 – 180

°C
°C
sec

TL
tL

217
60 – 150

°C
sec

Tp
tp

260
20 – 40

°C
sec

17/20

Rev. 1.4

Micro Crystal
Low Power Clock Oscillator 32.768 kHz

OV-7604-C7

6.3. HANDLING PRECAUTIONS FOR MODULES WITH EMBEDDED CRYSTALSThe built-in tuning-fork crystal consists of pure Silicon Dioxide in crystalline form. The cavity inside the package isevacuated and hermetically sealed in order for the crystal blank to function undisturbed from air molecules, humidity
and other influences.
Shock and vibration:
Keep the crystal / module from being exposed to excessive mechanical shock and vibration. Micro Crystal
guarantees that the crystal / module will bear a mechanical shock of 5000 g / 0.3 ms.
The following special situations may generate either shock or vibration:
Multiple PCB panels - Usually at the end of the pick & place process the single PCBs are cut out with a router.
These machines sometimes generate vibrations on the PCB that have a fundamental or harmonic frequency close
to 32.768 kHz. This might cause breakage of crystal blanks due to resonance. Router speed should be adjusted
to avoid resonant vibration.
Ultrasonic cleaning - Avoid cleaning processes using ultrasonic energy. These processes can damage thecrystals due to the mechanical resonance frequencies of the crystal blank.
Overheating, rework high temperature exposure:
Avoid overheating the package. The package is sealed with a seal ring consisting of 80% Gold and 20% Tin. The
eutectic melting temperature of this alloy is at 280°C. Heating the seal ring up to >280°C will cause melting of themetal seal which then, due to the vacuum, is sucked into the cavity forming an air duct. This happens when using
hot-air-gun set at temperatures >280°C.
Use the following methods for rework:••

Use a hot-air-gun set at 270°C.
Use 2 temperature controlled soldering irons, set at 270°C, with special-tips to contact all solder-joints fromboth sides of the package at the same time, remove part with tweezers when pad solder is liquid.

August 2023

18/20

Rev. 1.4

Micro Crystal
Low Power Clock Oscillator 32.768 kHz

OV-7604-C7

7. PACKING & SHIPPING INFORMATION
Reel: 7” = 178 mm
Ø 13min. 12.4

max. 170,254 ±0,02+0 ,32 ±0,05

0,314 ±0,05

7604

7604

1,75 ±0,05

4 ±0,1(0,06)

12 -0,1

5,5 ±0,05

3,45 ±0,05

4 ±0,1

1,75 ±0,1

Carrier Tape:
Material: Polycarbonate, conductive
Width: 12 mm
Tape Leader and Trailer: Minimum length 300 mm

1,05 ±0,05

Cover Tape

Direction of feed

All dimensions are in mm
OV-7604-C7_Tape-drw_20230814

Cover Tape:
Tape: Polypropylene, 3M™ Universal Cover Tape (UCT)
Adhesive Type: Pressure sensitive, Synthetic Polymer
Thickness: 0.06 mm
Peel Method:Medial section removal, both lateral stripes remain on carrier

August 2023

19/20

Rev. 1.4

Micro Crystal
Low Power Clock Oscillator 32.768 kHz

OV-7604-C7

8. COMPLIANCE INFORMATION
Micro Crystal confirms that the standard product Low Power Clock Oscillator OV-7604-C7 is compliant with “EU
RoHS Directive” and “EU REACh Directives”.
Please find the actual Certificate of Conformance for Environmental Regulations on our website:
CoC_Environment_OV_OM-Series.pdf

9. DOCUMENT REVISION HISTORY
Date

Revision #Revision Details

May 2016

1.0First release

June 2017

1.1

June 2019

1.2

March 2021

1.3

August 2023

1.4

Added Ordering Information, 1.3.
Added Recommended Thermal Relief, 4.1.1.
Added Material Composition Declaration & Environmental Information, 5.
Added Compliance Information, 8.
Complemented Operating Parameters, 3.2.
Specified Oscillator Parameters up to +125°C, 3.5.
Removed Medical Implantable, 1.
Applied more precise terms: TOPR and TB, 3.
Added Product Date Code definition, 4.2.
Changed package designation from SON-4 to DFN-4, 5.4.
Corrected tape drawing, 7.
Added new disclaimer
Added reference to product OV-7604-C7 Medical, 1.3.
Improved Block Diagram, 2.
Corrected tSTART (TYP / MAX) from 0.4 s / 0.8 s to 250 ms / 500 ms, 3.5.
Added "Δf/f = " at formula and "T" at X axis, 3.5.1.
Updated package drawing and added "Dimensions: in mm", 4.1.
Adapted limit values and methods in accordance with the latest standards, 5.2.
Changed back package designation from DFN-4 to SON-4, 5.4.
Corrected text to "hot-air-gun set at temperatures >280°C.", 6.3.
Replaced Tape drawing with new version, 7.

The information contained in this document is believed to be accurate and reliable. However, Micro Crystal
assumes no responsibility for any consequences resulting from the use of such information nor for any
infringement of patents or other rights of third parties, which may result from its use. In accordance with ourpolicy of continuous development and improvement, Micro Crystal reserves the right to modify
specifications mentioned in this publication without prior notice and as deemed necessary.
Any use of Products for the manufacture of arms is prohibited. Customer shall impose that same obligation
upon all third-party purchasers.
Without the express written approval of Micro Crystal, Products are not authorized for use as components
in safety and life supporting systems as well as in any implantable medical devices. The unauthorized useof Products in such systems / applications / equipment is solely at the risk of the customer and suchcustomer agrees to defend and hold Micro Crystal harmless from and against any and all claims, suits,
damages, cost, and expenses resulting from any unauthorized use of Products.
No licenses to patents or other intellectual property rights of Micro Crystal are granted in connection withthe sale of Micro Crystal products, neither expressly nor implicitly. In respect of the intended use of Micro
Crystal products by customer, customer is solely responsible for observing existing patents and otherintellectual property rights of third parties and for obtaining, as the case may be, the necessary licenses.

Micro Crystal AG
Muehlestrasse 14
CH-2540 Grenchen
Switzerland
August 2023

20/20

Phone +41 32 655 82 82
sales@microcrystal.com
www.microcrystal.com

Rev. 1.4