www.r-theta.com

STANDARD
Products Catalog

ISO 9001 - 2000 REGISTERED

has been a global leader for over 25 years in thedesign and manufacturing of innovative thermal management
solutions serving a broad range of markets. Major markets
include telecommunications, computers, industrial controls,
power conversion, transportation, medical, alternative energy andaerospace.
R-Theta’s powerful software “R-Tools” provides on-line thermal
modeling of heat sinks for semiconductors in natural or forced
convection for air cooled, as well as, liquid-cooled cold plates.
The interface is friendly, with only minimal parameters needed to
be specified. Users can register free on-line for R-Tools on the RTheta web site www.r-theta.com .

Standard products offered in this catalog are Heat Sinks for board
level IC’s, Surface Mount and Thru-Hole Discrete semiconductor
packages, Extruded heat sinks, Fabfin and Aluminum Extrusion profiles. Thermal interface materials include silicone and non-silicone
Thermal Compounds, Sil-Pads and Adhesive tapes.
R-theta also offers a complete line of high performance patented,
aluminum alloy heat sinks without the use of glue and are available
through R-Theta’s extensive line. The company has developed leadingedge heat sink technology that eliminates volumetric constraints of
one-piece extrusions. By mechanically swaging the parts together
there is no deterioration in performwww.r-theta.com
ance compared to a solid block ofaluminum. R-Theta heat sinks mean
NAVIGATOR
greater thermal design flexibility by
The Navigational Tool For
offering the same co-efficient of
On-Line Heatsink Design
thermal expansion for the entire
heat sink. R-Theta heat sinks allow
you to maximize heat cooling bypushing the thermal envelope forgreater productivity.
Call and ask for your copy of theNavigator 1-800-388-5428 orcheck us out on the web atwww.r-theta.com

ISO 9001 - 2000 REGISTERED

www.r-theta.com

1
Table of Contents

Table of Contents

Heat sinks for IC Packages (Integrated Circuit )Board Level Heat Sinks
BGA
DIP

Pgs.
Pg.

2-4
4

Pg.

5

Pgs.
Pgs.
Pgs.

6-7
8 - 1112 - 13

Pg.
Pg.
Pg.

14
15
16

Mechanically Bonded (Swaged) Heat Sinks

Pg.

17

Thermal compound (silicone)
Thermal compound (non-silicone)
Sil-Pads
Adhesive Tapes

Pg.
Pg.
Pg.
Pg.

18
19
20
21

Pg.
Pg.

22
23

Index by Device Cooled

Pg.

24

Index By Part Number

Pg.

25

Surface Mount Discrete Semiconductor Packages
D-PAK TO-252, TO-263, TO-268

Thru-Hole Discrete Semiconductor Packages
TO-220 and TO-262
TO-220 and TO-202
TO-220, TO-218, TO-247 and Multiwatt

Extruded Heat Sinks for DC/DC Converters & Solid State Relays
High Power Semiconductor Packages
DC/DC converter Full-Brick
DC/DC converter Half-Brick
Solid State Relays (Fabfin)

Fabfin Heat Sinks for IGBT and High Power Devices
Polar Interface Materials

Aluminum Extrusion Profiles
Extrusion characteristics table
Extrusion Profiles

R-theta Thermal Solutions Inc. believes that information provided inthis product catalog is accurate as of publication date. Product testingfor proper performance in customer applications is recommended for
all component designs. The physical properties reported herein are
representative of performance values obtained by standard predictive
and testing methods. R-Theta is a manufacturer of heat dissipation
products and reserves the right to make changes to its products without notice to improve the design of performance characteristics.
Cat#600220

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Heat Sinks for IC Packages

2
Omnidirectional Pin Fin Heat Sink for 21 mm BGAs

The omnidirectional pin fin heatsink is available in four standard
heights. Add pressure sensitive adhesive
tape for easy and reliable attachment to
IC package. See page 21 for adhesive
tapes.
Part Number
RT5025B00000
RT5035B00000
RT5045B00000
RT5060B00000

Aluminum, Black Anodized

Base Dimensions mm ( in.) Sq.

Height “A” mm (In.)

21 (.827)
21 (.827)
21 (.827)
21 (.827)

6.4 (.250)
8.9 (.350)
11.4 (.450)
15.2 (.600)

Omnidirectional Pin Fin Heat Sink for 25 mm BGAs

The omnidirectional pin fin heatsink is available in four standard
heights. Add pressure sensitive adhesive
tape for easy and reliable attachment to
IC package. See page 21 for adhesive
tapes.
Part Number
RT5125B00000
RT5135B00000
RT5145B00000
RT5160B00000

Aluminum, Black Anodized

Base Dimensions mm ( in.) Sq.

Height “A” mm (In.)

25 (.984)
25 (.984)
25 (.984)
25 (.984)

6.4 (.250)
8.9 (.350)
11.4 (.450)
15.2 (.600)

Omnidirectional Pin Fin Heat Sink for 28 mm BGAs

The omnidirectional pin fin heatsink is available in four standard
heights. Add pressure sensitive adhesive
tape for easy and reliable attachment to
IC package. See page 21 for adhesive
tapes.
Part Number
RT5625B00000
RT5635B00000
RT5645B00000
RT5660B00000

Aluminum, Black Anodized

Base Dimensions mm ( in.) Sq.

Height “A” mm (In.)

27.9 (1.100)
27.9 (1.100)
27.9 (1.100)
27.9 (1.100)

6.4 (.250)
8.9 (.350)
11.4 (.450)
15.2 (.600)

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3

The omnidirectional pin fin heatsink is available in four standard
heights. Add pressure sensitive adhesive
tape for easy and reliable attachment to
IC package. See page 21 for adhesive
tapes.
Part Number
RT5325B00000
RT5335B00000
RT5345B00000
RT5360B00000

Heat Sinks for IC Packages

Omnidirectional Pin Fin Heat Sink for 35 mm BGAs

Aluminum, Black Anodized

Base Dimensions mm( in. Sq)

Height “A” mm (In.)

35 (1.378)
35 (1.378)
35 (1.378)
35 (1.378)

6.4 (.250)
8.9 (.350)
11.4 (.450)
15.2 (.600)

Omnidirectional Pin Fin Heat Sink for 40 mm BGAs

The omnidirectional pin fin heatsink is available in four standard
heights. Add pressure sensitive adhesive
tape for easy and reliable attachment to
IC package. See page 21 for adhesive
tapes.
Part Number
RT5526B00000
RT5553B00000

Aluminum, Black Anodized

Base Dimensions mm( in. Sq)

Height “A” mm (In.)

40.6 (1.600)
40.6 (1.600)

6.6 (.260)
13.3 (.525)

Omnidirectional Pin Fin Heat Sink for 45 mm BGAs

The omnidirectional pin fin heatsink is available in three standard
heights. Add pressure sensitive adhesive
tape for easy and reliable attachment to
IC package. See page 21 for adhesive
tapes.
Part Number
RT5235B00000
RT5240B00000
RT5265B00000

Aluminum, Black Anodized

Base Dimensions mm( in. Sq)

Height “A” mm (In.)

44.5 (1.750) X 43.2 (1.700)
44.5 (1.750) X 43.2 (1.700)
44.5 (1.750) X 43.2 (1.700)

8.9 (.350)
10.2 (.400)
16.5 (.650)

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Heat Sinks for IC Packages

4
Unidirectional Fin Heat Sink for 35 mm BGAs

The omnidirectional pin fin heatsink is available in four standard
heights. Add pressure sensitive adhesive
tape for easy and reliable attachment to
IC package. See page 21 for adhesive
tapes.
Part Number
RT5425B00000
RT5435B00000
RT5445B00000
RT5460B00000

Aluminum, Black Anodized

Base Dimensions mm( in. Sq)

Height “A” mm (In.)

35 (1.378)
35 (1.378)
35 (1.378)
35 (1.378)

6.4 (.250)
8.9 (.350)
11.4 (.450)
15.2 (.600)

Unidirectional epoxy attach heat sink for 14 and 16 pin dip packages

Unidirectional epoxy attach fin toheat sink attaches to 14 and 16 pin
DIP packages quickly and easily. May be
added before or after final board
assembly, no additional board space isrequired. Available in two fin directions.
Part Number
RT5470B00000
RT5475B00000

RT5470B00000

RT5475B00000

Aluminum, Black Anodized

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5

Surface mount heat sink for D-PAK(TO-252) package semiconductors
remove the heat indirectly without contacting the device like traditional thru
hole heat sinks. The device and theheat sink are soldered directly to amodified drain pad creating a thermaltransfer path from package tab to theheat sink.

0.64 (0.025) Thick Copper, Tin PlatedPart Number
RT1750D00000

Surface mount heat sink for D2-PAK (TO-263) package semiconductors

Surface mount heat sink for D2-PAK(TO-263) package semiconductors
remove the heat indirectly without contacting the device like traditional thru
hole heat sinks. The device and the heatsink are soldered directly to a modified
drain pad creating a thermal transfer
path from package tab to the heat sink.

0.65 (0.026) Thick Copper, Tin PlatedPart Number
RT1755D00000

Surface mount heat sink for D3-PAK (TO-268) package semiconductors

Surface mount heat sink for D3-PAK(TO-268) package semiconductors
remove the heat indirectly without contacting the device like traditional thru
hole heat sinks. The device and the heatsink are soldered directly to a modified
drain pad creating a thermal transfer
path from package tab to the heat sink.

1.00 (0.039) Thick Copper, Tin PlatedPart Number
RT1760D00000

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Surface Mount Discrete Semiconductor Pkgs.

Surface mount heat sink for D-PAK (TO-252) package semiconductors

Thru Hole Discrete Semiconductor Packages

6
Plug In style heat sink with two self-locking clips for TO-220 & TO-262

Plug in style heat sink with two self
locking clips and mounting hole tofirmly hold the device to the heat sinkensuring maximum metal to metal thermal contact. Available with solderable
mounting tabs for both horizontal andvertical mounting to the PC board.

Description
Part Number
RT1000B00000 Slim plug in heat sink without tab
RT1000B03100 With single tab for horizontal mounting
RT1000B04000 With single tab for vertical mounting

Fig. A

Fig. B

Aluminum, Black Anodized

Dia. of PCB Plated
Fig. Thru hole for Tab
A
A
B

N/A
1.75 (0.069)
1.75 (0.069)

Plug In style heat sink featuring four self-locking clips for TO-220 and TO-262

Plug in style heat sink features
four self locking clips to firmly holdthe device to the heat sink ensuring
maximum metal to metal thermal contact. Available with solderable mountingtabs for both horizontal and verticalmounting to the PC board.

Description
Part Number
RT1002B00000 Slim plug in heat sink without tab
RT1002B03100 With single tab for horizontal mounting
RT1002B04000 With single tab for vertical mounting

Fig. A

Fig. B

Aluminum, Black Anodized

Dia. of PCB Plated
Fig. Thru hole for Tab
A
A
B

N/A
1.75 (0.069)
1.75 (0.069)

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7

Plug in style heat sink features two
self locking clips to firmly hold thedevice to the heat sink ensuring maximum thermal contact. Available withsolderable mounting tabs for both horizontal and vertical mounting to the PC
board.
Part Number
RT1050B00000
RT1050B03100
RT1050B04000

Description
Plug in style heat sink
With horizontal mounting tab
With vertical mounting tab

Fig. B

Fig. A
Aluminum, Black Anodized

Dia. of PCB Plated
Fig. Thru hole for Tabs
A
A
B

N/A
1.75 (0.069)
1.75 (0.069)

Channel style heat sink featuring twisted fins for TO-220

Channel style heat sink features
twisted fins for increased air turbulence for better cooling. Includes threedevice mounting options, hole, slot orclip and wave solderable tin plated tabs
for easy attachment to the PC board.

Part Number
RT1100B03400
RT1110B03400

Fig. B

Fig. A
Aluminum, Black Anodized

Fig.

Mounting

Dia. of PCB Plated
Thru hole for Tabs

A
B

Hole
Slot

2.36 (0.093)
2.36 (0.093)

Popular Option: Device Mounting Clip Part Number: RT1460U00000 (Order Separately)

Economy, narrow base, low profile channel style heat sink for TO-220

Economy, narrow base, low profile
channel style heat sink is perfect foruse on printed circuit boards with 0.500
inch centering. When mounted horizontally, the total height of the heat sink isjust 9.65 (0.380).

Aluminum, Black Anodized

Part Number
RT1300B00000

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Thru Hole Discrete Semiconductor Packages

Plug In style heat sink featuring two self-locking clips for TO-220 & TO-262

Thru Hole Discrete Semiconductor Packages

8
Channel style heat sink with three integrated tabs for a variety of devices

Channel style heat sink with three
integrated tabs for greater stability
and slotted mounting hole to accommodate a variety of device lead
lengths. Mounting tabs are designed
twisted to mount to PCB.

Aluminum, Black Anodized

Part Number
RT1500B00000

Channel style heat sink featuring device mounting hole/slot for a variety of devices

Channel style heat sink features
device mounting hole or slot toaccommodate a variety of device lead
lengths. Mounting tabs are Tin Finish
for soldering to PCB.

Fig. B

Fig. A
Aluminum, Black Anodized

Part Number
RT1550B03400
RT1560B03400

Fig. Mounting
A
B

Dia. of PCB Plated
Thru hole for Tabs

Slot
Hole

2.05 (0.081)
2.05 (0.081)

Thin profile space saving twisted fin heat sink for TO-220

Thin profile space savings twisted
fin heat sink for vertical mounting
TO-220 devices. Features staked on solderable mounting tabs for easy attachment to the PC board.
Part Number
RT1600B03400

Dia. of PCB Plated
Fig. Thru hole for Tabs
A

Aluminum, Black Anodized

2.39 (0.094)

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9
Thru Hole Discrete Semiconductor Packages

Lightweight, channel style heat sink featuring twisted fins for TO-220

Lightweight, channel style heatsink featuring twisted fins designed
for mounting horizontally or verticallyon a PC board.
Aluminum, Black Anodized

Part Number
RT1700B00000

Hat section style heat sink for TO-220

Hat section style heat sinks are low
profile and perfect for use on printed
circuit cards with 0.500 inch centering
between boards. For higher power
application the RT1200 hat can be
added to the RT1150 or RT1250 for
double sided cooling of a TO-220
device.

Part Number

Description

RT1150 - Figure A

RT1200 - Figure B

Fig.

Wide hat section
RT1150B00000 heat sinkA

Top mount hat heat
RT1200B00000 sink with cut out

B

Dual Device hat
RT1250B00000 section heat sinkC

RT1250 - Figure C

Aluminum, Black Anodized

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Thru Hole Discrete Semiconductor Packages

10
Extruded heat sink with large radial fins for TO-202 and TO-220

Extruded heat sink with large radial fins features equal channel widths
on both sides for single or dual device
mounting. Includes two solderable
mounting pins which permit verticalmounting and eliminate stress on device
leads. Available in four heights for TO202 and TO-220 devices.
Part Number
RT3410B02500
RT3415B02500
RT3420B02500
RT3425B02500

Aluminum, Black Anodized

Device“A” mm (In.)

Dia. of PCB Plated
Thru hole for Tabs

TO-202, TO-220
TO-202, TO-220
TO-202, TO-220
TO-202, TO-220

24.50 (1.00)
38.20 (1.50)
50.80 (2.00)
63.50 (2.50)

2.67 (0.105)
2.67 (0.105)
2.67 (0.105)
2.67 (0.105)

Compact low cost channel style heat sink for TO-220

Compact low cost channel styleheat sink is ideal where space andcost are limited. Available in three finheights with or without solderable
mounting tab.
Part Number
RT1350B00000
RT1360B00000
RT1360B04000
RT1370B00000
RT1370B04000

Aluminum, Black Anodized

Description“A” mm (In.)

Dia. of PCB Plated
Thru hole for Tab

Slim, low cost channel style heat sink
Slim, low cost channel style heat sink
With solderable tab
Slim, low cost channel style heat sink
With solderable tab

6.35 (0.250)
9.53 (0.375)
9.53 (0.375)
12.70 (0.500)
12.70 (0.500)

N/A
N/A
1.73 (0.068)
N/A
1.73 (0.068)

Compact low cost channel style heat sink for TO-202

Compact low cost channel styleheat sink is notched to accommodate
the TO-202 center tab packages.
Available in two fin heights.
Part Number
RT1400B00000
RT1410B00000

Aluminum, Black Anodized“A” mm (In.)
9.53 (0.375)
12.70 (0.500)

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11

Extruded heat sink with radial finsand notched base features equal
channel widths on both sides for single
or dual device mounting. Includes two
solderable mounting pins which permit
vertical mounting and eliminate stresson device leads. Available in fourheights for TO-202 and TO-220 devices.

DevicePart Number
RT3310B02500
RT3315B02500
RT3320B02500
RT3325B02500

Aluminum, Black Anodized

Dia. of PCB Plated“A” mm (In.) Thru hole for Tabs

TO-202, TO-220
TO-202, TO-220
TO-202, TO-220
TO-202, TO-220

24.50 (1.00)
38.20 (1.50)
50.80 (2.00)
63.50 (2.50)

2.67 (0.105)
2.67 (0.105)
2.67 (0.105)
2.67 (0.105)

Channel style heat sink with wide mounting surface for a variety of devices

Channel style heat sink with widemounting surface and selection oflengths to accept a variety of devices.
Models accommodate one or two
devices.

Fig. A

Fig. B

RT1650B00000

RT1660B00000, RT1670B00000

Aluminum, Black Anodized

Part Number

Fig. “A” Dim mm (In.) “B” Dim mm (In.) “C” Dim mm (In.)

RT1650B00000

A

18.03 (0.710)

12.32 (0.485)

N/A

RT1660B00000

B

29.97 (1.180)

11.68 (0.460)

N/A

RT1670B00000

B

29.97 (1.180)

12.19 (0.480)

10.16 (0.400)

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Thru Hole Discrete Semiconductor Packages

Extruded heat sink with radial fins and notched base for TO-202 and TO-220

Thru Hole Discrete Semiconductor Packages

12
Flat back extruded heat sink with solderable pins for TO-220 & TO-218

Flat back extruded heat sink features solderable pins which allow
vertical mounting without stress on thedevice leads. Available in three heights
for TO-220 and TO-218 devices.

Part Number
RT3210B02500
RT3211B02500
RT3215B02500
RT3216B02500
RT3220B02500
RT3221B02500

Aluminum, Black Anodized

Device“A” Dimmm (In.)“B” Dim Dia. of PCB Plated
mm (In.) Thru hole for Tabs

TO-220TO-218
TO-220TO-218
TO-220TO-21825.40 (1.00)
25.40 (1.00)
38.10 (1.50)
38.10 (1.50)
50.80 (2.00)
50.80 (2.00)

18.29 (0.720)
21.59 (0.850)
18.29 (0.720)
21.59 (0.850)
18.29 (0.720)
21.59 (0.850)

2.67 (0.105)
2.67 (0.105)
2.67 (0.105)
2.67 (0.105)
2.67 (0.105)
2.67 (0.105)

Extruded heat sink with radial fins for TO-220, TO-218 and TO-247

Extruded heat sink with radial finsfeature equal channel widths on
both sides for single or dual device
mounting. Includes two solderable
mounting pins which permit verticalmounting to eliminate stress on device
leads. Available in four heights for TO220, TO-218, and TO-247 devices.

Aluminum, Black Anodized

DevicePart Number
RT3010B02500 TO-218, TO-247
RT3110B02500
TO-220
RT3015B02500 TO-218, TO-247
RT3115B02500
TO-220
RT3020B02500 TO-218, TO-247
RT3120B02500
TO-220
RT3025B02500 TO-218, TO-247
RT3125B02500
TO-220“A” Dimmm (In.)“B” Dimmm (In.)“C” Dimmm (In.)“D” Dimmm (In.)“E” Dimmm (In.)Dia. of PCB Plated
Thru hole for Tabs

25.40 (1.00)
25.40 (1.00)
38.10 (1.50)
38.10 (1.50)
50.80 (2.00)
50.80 (2.00)
63.50 (2.500)
63.50 (2.500)

21.59 (0.850)
18.29 (0.720)
21.59 (0.850)
18.29 (0.720)
21.59 (0.850)
18.29 (0.720)
21.59 (0.850)
18.29 (0.720)

3.66 (0.144)
3.17 (0.125)
3.66 (0.144)
3.17 (0.125)
3.66 (0.144)
3.17 (0.125)
3.66 (0.144)
3.17 (0.125)

17.02 (0.670)
15.88 (0.625)
17.02 (0.670)
15.88 (0.625)
17.02 (0.670)
15.88 (0.625)
17.02 (0.670)
15.88 (0.625)

13.72 (0.540)
11.10 (0.437)
13.72 (0.540)
11.10 (0.437)
13.72 (0.540)
11.10 (0.437)
13.72 (0.540)
11.10 (0.437)

2.67 (0.105)
2.67 (0.105)
2.67 (0.105)
2.67 (0.105)
2.67 (0.105)
2.67 (0.105)
2.67 (0.105)
2.67 (0.105)

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13

Extruded heat sink with large radial fins features equal channel widths
on both sides for single or dual device
mounting. Includes two solderable
mounting pins which permit verticalmounting and eliminates stress on
device leads. Available in four heights
for TO-220,TO-218 and TO-247 devices.

Note: Notch optional see chart below

Aluminum, Black Anodized

DevicePart Number“A” Dim mm (In.) “B” Dim mm (In.) Base Notch

Dia. of PCB Plated
Thru hole for Tabs

RT3609B02500

TO-22025.40 (1.00)

18.29 (0.720)

No Notch

2.67 (0.105)

RT3610B02500

TO-218, TO-247

25.40 (1.00)

21.59 (0.850)

No Notch

2.67 (0.105)

RT3710B02500

TO-218, TO-247

25.40 (1.00)

21.59 (0.850)

Notch

2.67 (0.105)

RT3615B02500

TO-218, TO-247

38.10 (1.50)

21.59 (0.850)

No Notch

2.67 (0.105)

RT3715B02500

TO-218, TO-247

38.10 (1.50)

21.59 (0.850)

Notch

2.67 (0.105)

RT3620B02500

TO-218, TO-247

50.80 (2.00)

21.59 (0.850)

No Notch

2.67 (0.105)

RT3720B02500

TO-218, TO-247

50.80 (2.00)

21.59 (0.850)

Notch

2.67 (0.105)

RT3625B02500

TO-218, TO-247

63.50 (2.50)

21.59 (0.850)

No Notch

2.67 (0.105)

RT3725B02500

TO-218, TO-247

63.50 (2.50)

21.59 (0.850)

Notch

2.67 (0.105)

High power extruded heat sink with large radial fins for TO-220 and Multiwatt

High power extruded heat sinkwith large radial fins and increased
fin count for additional cooling capacity.
Solderable pins allow vertical mounting
without stress on device leads. Available
in four heights for TO-220 and multiwatt devices.

Part Number
RT3810B02500
RT3815B02500
RT3820B02500
RT3825B02500

Aluminum, Black Anodized

Dia. of PCB Plated“A” Dim mm (In.) Thru hole for Tabs
25.40 (1.00)
38.10 (1.50)
50.80 (2.00)
63.50 (2.50)

2.67 (0.105)
2.67 (0.105)
2.67 (0.105)
2.67 (0.105)

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Thru Hole Discrete Semiconductor Packages

Extruded heat sink with large radial fins for TO-220, TO-218 and TO-247

Extruded Heat Sinks for DC/DC Converters

14
Heat sinks for “Full-Brick” DC/DC Converters
Heat sinks for “Full-Brick” DC/DC Converters
Standard mounting slots mate with Vicor DC/DC converters.
Optimized aluminum extruded fin construction transfers heat efficiently
and keeps converter modules cool in both forced and natural convection applications.
Three fin heights and two flow directions, vertical and horizontal areavailable.
Aluminum, Clear trivalent chromate finish is standard.
Polar Thermal interface materials are available. Contact the factory to
select the material for your application.

RT3830C00000

Figure A

RT3835C00000

Figure B

RT3840C00000

Figure C

RT3845C00000

Part Number Fig.
RT3830C00000 A
RT3835C00000 B
RT3840C00000 C
RT3845C00000 D

Figure D

Footprint Dimensions Height
Fin
Numbermm (in.)mm (in.) Orientation of fins
116.8 (4.60) x 61.0 (2.40) 22.9 (0.90)
61.0 (2.40) x 116.8 (4.60) 22.9 (0.90)
61.0 (2.40) x 116.8 (4.60) 17.8 (0.70)
61.0 (2.40) x 116.8 (4.60) 10.2 (0.40)

Horizontal
VerticalVerticalVerticalwww.r-theta.com

8
16
16
16

15
Heat sinks for “Half-Brick” DC/DC Converters
Standard mounting slots mate with Vicor and the majority of “halfbrick” DC/DC converters on the market.
Optimized aluminum extruded fin construction transfers heat efficiently
and keeps converter modules cool in both forced and natural convection applications.
Two fin heights and two flow directions, vertical and horizontal areavailable.
Aluminum, Clear trivalent chromate finish is standard.
Polar Thermal interface materials available. Contact the factory to
select the material for your application.

RT3850C00000

Figure A

Footprint Dimensions Height
Fin
Numbermm (in.) Orientation of fins

mm (in.)Part Number Fig.
RT3850C00000 A
57.9 (2.28) x 61.0 (2.40)
RT3855C00000 B
61.0 (2.40) x 57.9 (2.28)
RT3860C00000 C
60.5 (2.38) x 57.4 (2.26)
RT3855C00000

Figure B

RT3860C00000

Figure C

22.9 (0.90)
22.9 (0.90)
10.7 (0.42)

Horizontal
VerticalVerticalwww.r-theta.com

88
8

Extruded Heat Sinks for DC/DC Converters

Heat sinks for “Half-Brick” DC/DC Converters

Standard Heat Sinks for Solid State Relays

16
Extruded Heat Sink for Solid State Relays
Extruded Heat Sink for Solid State Relays features
Four standard mounting slots accommodate easy assembly.
Two 8-32 threaded thru holes can accept one solid state relay with 1.875
center distance.
Fins on outerside of mounting channel optimizes heat transfer.
Thermal interface compounds and pad materials available see pages 18-20
or contact the factory to select the correct material for your application.
Aluminum, Clear trivalent chromate finish

Part Number
RT3975C00000

Footprint Dimensions
mm (in.)Heightmm (in.)139.7 (5.500) x 120.65 (4.75)

66.68(2.625 )Fabfin High Performance Heat Sink for Solid State Relays
Fabfin High Performance Heat sink for Solid State Relays features
Four standard mounting slots accommodate easy assembly.
Six 8-32 threaded thru holes can accept three solid state relay with 1.875
center distance.
High fin density construction provides excellent heat transfer characteristics.
Thermal interface compounds and pad materials available see pages 18-20
or contact the factory to select the correct material for your application.
Aluminum, Clear trivalent chromate finish

Part Number
RT3980C00000

Footprint Dimensions
mm (in.)Heightmm (in.)152.40 (6.00) x 149.10 (5.87)

88.39 (3.480)

www.r-theta.com

17
The R-Theta® range of stan- FFC SERIES WITH SIDE FASTENED LEGS AND FAN BRACKET
dard Fabfin® forced convection cooled heat sinks (FFC
series) was developed toincorporate standard 119mm
square axial fans. The fin
spacing of 8.51 mm wasselected to provide a 20:1
ratio, the practical heat transfer limit for cooling Power
Semiconductors in typicalambient conditions. The standard FFC series shown will
accept 1, 2, 3 or 4 (notshown) fans. Available inmany finishes.
The serrated fin thickness of
2.4mm provides near optimum performance whenusing industry standard axial
fans. If some level of performance de-rating is acceptable (approximately 20%)then we recommend that
corrugated fins be used.
These have a thickness of
1.5 mm and are designatedby ordering the ‘AC’ partnumbers. The use of corrugated fins provides a weightsavings of approximately
15% and will increase surface area by 7% comparedwith a straight fin of thesame height.
The push/pull (PP) option iscommon for applications
where fan redundancy isimportant. We recommend
the use of ball bearing fan(s),specifically for the “pull” end,in order to maximize the fanlife due to the elevated operating temperatures. The
additional weight of the fan
can be offset by using thecorrugated fins, if applicable.
The adjacent graphs provide
a performance guide for heatgenerating devices ranging insize from point source to
60% coverage.

25.4

158.9

158.9
127.1

3.2

SOURCE AREA

121

184.5

7.60
31.8

133.4

6.90

305
368.50TECHNICAL DATA
FFC305T13A14AS118B
MODAL #SERRATEDFIN STYLE
WT WITHOUT FAN
5.4
kg
BASE AREA
36,774mm2
TOTAL CSA
5,091
mm2
TOTAL PERIMETER
3,683
mm

25.4

FFC305T13A14AC118B
CORRUGATED
4.7
kg
36,774
mm2
4,242
mm2
3,749
mm

158.9

158.9
127.1

3.2

320.5

SOURCE AREA

257

7.60
31.8

133.4

6.90

305
368.50

MODAL #FIN STYLE
WT WITHOUT FAN
BASE AREATOTAL CSATOTAL PERIMETERTECHNICAL DATA
FFC305T13A30AS118BSERRATED
10.4
kg
78,387mm2
10,889
mm2
7,800
mm

25.4

FFC305T13A30AC118B
CORRUGATED
8.8
kg
78,387
mm2
8,981
mm2
7,929
mm

158.9

158.9
127.1

3.2

SOURCE AREA

393

456.5

7.60
31.8

133.4

305
368.50

MODAL #FIN STYLE
WT WITHOUT FAN
BASE AREATOTAL CSATOTAL PERIMETERTECHNICAL DATA
FFC305T13A46AS118BSERRATED
15.5
kg
119,865mm2
16,574mm2
11,991mm

6.90

FFC305T13A46AC118B
CORRUGATED
13.2
kg
119,865mm2
13,766mm2
12,578mm

www.r-theta.com

FABFIN Heat Sinks for IGBT and High Power Devices

FABFIN Standards - Various Widths Available in Serrated or Corrugated Fins

Polar Interface Materials

18
Polar Silicone Thermal Compound
Polar Silicone Thermal Compound
Polar RT7002 - RT7080 is a non-reactive, Silicone, Thermally Conductive Grease with a high thermal conductivity and low thermal resistance with a soft, non-flowable consistency. This product is formulated with specialty binding agents to achieve lowest amount of bleed andevaporation. It is designed for applications where a silicone thermal interface material is required.
Key Features
Good Thermal Conductivity (0.80 W/mok)
Low Interface Thermal Resistance - (0.05 oC-In 2/W)
Thin Bond lines to < 1 mil.
Low bleed and evaporation
Benefits
Non-Toxic.
Reworkable/Easy to Remove.
Easy to apply by dispensing or Screen printing/stencil.
Typical Applications
Applied to the base and mounting studs of transistors, diode and silicon controlled rectifiers.
Can be used as a high-voltage corona suppressant/non-flammable coating, in connections for fly back transformers locatedin TV sets and similar design applications.
Used in mounting semiconductor devices; thermoelectric modules; power transistors and diodes; coupling entire heat generatingassemblies to chassis; mounting power resistors; and for any devices where efficient cooling is required in major industries
including, electronic (computer, appliance, wireless, etc.) automotive and electrical.

Typical Properties
Viscosity:

RT7002 - RT7080
Thixotropic Paste

Specific Gravity, @ 25o C

2.2

Color:

White

Evaporation, @ 200oC, 24 Hrs., %/Wt.

0.6

Thermal Conductivity, (ASTM D5470)
W/m.oK

0.80

Thermal Resistance (oC-in2/W)

0.05

Electrical Properties:
Dielectric strength (ASTM D150)
0.05” gap, V/mil
Volume Resistivity (ASTM D257)
Ohm-cm.

390

Operating Temperature Range
Shelf Life

Part Number
RT7002U00000
RT7004U00000
RT7005U00000
RT7008U00000
RT7010U00000
RT7080U00000

2.8 x 1014
-55oC to 205oC
5 Years

Description

Package Size & TypeSilicone Compound
Silicone Compound
Silicone Compound
Silicone Compound
Silicone Compound
Silicone Compound

2 Oz. Jar
4 Gram Pack
5 Oz. Tube
8 Oz. Jar
10 CC Syringe
5 lb Quart Jar

www.r-theta.com

19
Polar Non-Silicone Thermal Compound
Polar RT7102 - RT7180 is grease-like Non-Silicone, non-migrating material heavily impregnated with heat-conductive metal oxides.
This formulation provides high thermal conductivity, low bleed and high temperature stability.
Non-Silicone offers advantages of no creep or migration over wide temperature range.
Low Interface Thermal Resistance - (0.03oC-in2/W)

Key Features

High Thermal Conductivity, High dielectric strength.
Exceptionally low bleed and evaporation.
Meets MIL-C-47113 & MIS-19846 specifications.

Polar RT7203 is grease-like Non-Silicone based reworkable, silver filled thermally and electrically conductive grease. Engineered withspecially selected pure silver particles to maximize particle-to-particle contact for most efficient heat transfer and low resistivity.
Key Features

Thermally and Electrically Conductive
Low Interface Thermal Resistance - (0.005oc-in2/W)
High Thermal Conductivity, (7.0 W/moK)
Low Resistivity, (< 0.01 Ohm-cm)
Exceptionally low bleed and evaporation.
Non-Silicone offers advantages of no creep or migration over wide temperature range.

Polar RT7280 is grease-like Non-Silicone, non-migrating material thickened with heat conductive fillers, low bleed and high temperaturestability.
Formulated with low viscosity for easy dispensing and screen printing/stencil, and automated dispensing.
Thin bond lines of 1-2 mil.
Non-Silicone offers advantages of no creep or migration over wide temperature range.
Low Interface Thermal Resistance - (0.03oC-in2/W)

Key Features

High Thermal Conductivity, High dielectric strength.
Exceptionally low bleed and evaporation.
Meets MIL-C-47113 & MIS-19846 specifications.
Benefits

Will not harden, dry out or melt.
Will not contaminate solder bath or other devices.
Non-toxic.
Reworkable and easy to apply, remove and dispense.

Typical Applications

Used in mounting semiconductor devices; thermoelectric modules; power transistors and diodes; mounting
power resistors; and for any devices where efficient cooling is required in major industries including, electronic(computer, appliance, wireless, etc.) automotive and electrical.

Typical Properties

RT7102-RT7180

Viscosity:

Thixotropic Paste

RT7203

RT7280Thixotropic Paste Thixotropic Paste

Specific Gravity, @ 25oC

2.7

4.0

2.4

Color:White

Silver/GrayBlue

Evaporation, @ 200oC, 24 Hrs.,%/Wt.

0.3

0.4

0.6

Thermal Conductivity, (ASTM D5470)
W/m.oK

1.0

7.0

0.80

Thermal Resistance (oC-in2/W)

0.03

0.005

0.03

Electrical Properties:
Dielectric strength (ASTM D150)
0.05” gap, V/mil

350

N/A

310

Volume Resistivity (ASTM D257)
Ohm-cm.
Operating Temperature Range

1.8 x 1014

<0.0101.54 x 1014

-55oC to 200oC-55oC to 200oC-55oC to 200oC

5 Years

5 Years

5 Years

Shelf Life
Part Number
RT7102U00000
RT7104U00000
RT7110U00000
RT7180U00000
RT7203U00000
RT7280U00000

Description

Package Size & Type

Non-Silicone Compound
Non-Silicone Compound
Non-Silicone Compound
Non-Silicone Compound
Non-Silicone Compound
Non-Silicone Compound LV

2 Oz. Jar
4 Oz. Tube
10 CC Syringe
5 lb Quart Jar
3 CC Syringe
5 lb Quart Jar

www.r-theta.com

Polar Interface Materials

Polar Non-Silicone Thermal Compound

Polar Interface Materials

20
Polar Thermally Conductive Sil-Pads
Polar Sil-Pad is a composite of silicone rubber and fiberglass. The material is specially formulated for use as a thermally conductive
insulator.
Key Features

Surfaces are pliable and allow complete surface contact with excellent heat dissipation. The reinforcing
fiberglass provides excellent cut-through resistance.

Benefits

Thermal impedance 1.13oC-in2/W(@50 psi)
Excellent mechanical and physical characteristics.
Flame retardant

Typical Applications

Used in power supplies, power semiconductors, automotive electronics, telecommunications and motor
controls.

Configurations Available are sheet form, die-cut parts, and roll form; with or without pressure sensitive adhesive.

Typical Properties

POLAR SIL-PAD

Color

Gray

Thickness, mm (in.).18 + .025 (.007 + .001)

Thermal Performance
TO-220 Test @ 50 psi oC/W
Thermal Impedance (oc-in2/W)

5.14
1.13

Thermal Conductivity, (W/m-k nominal)

0.9

Voltage Breakdown, (Vac)3500

Continuous Use Temperature (oc)

-60 to 180

Construction

Silicone / Fiberglass

Part
Number

TO Package“A” Dimmm (In.)“B” Dimmm (In.)“C” Dimmm (In.)

RT7200U10000

TO-220 (Clip Mount)19.1(.750)

12.7(.500)

RT7210U10000

TO-22019.1(.750)

12.7(.500)

4.8(.187)

3.7(.147)

No

RT7220U10000

TO-22019.1(.750)

12.7(.500)

4.8(.187)

3.2(.125)

No

RT7230U10000

TO-21821.8(.860)

18.8(.740)

5.1(.200)4.1(.160)

No

RT7240U10000

TO-24725.4(1.000)

19.1(.750)

7.6(.300)

3.6(.140)

No

RT7250U10000

TO-24729.0(1.140)

20.6(.810)

9.0(.355)

3.7(.147)

No“D” Dimmm (In.)Adhesive on
one sideNo

Note: Contact R-Theta for other configurations and materials
www.r-theta.com

21
Ceramic or metal packages
T405 thermal tape consists of a high bond strength, pressure-sensitive acrylic adhesive, loaded with aluminum oxide and coated onto
a 0.050 mm (0.002 inch) aluminum foil carrier. The aluminum foil provides added thermal conductivity for applications where electrical isolation is not required.
T412 thermal tape consists of a high bond strength, pressure-sensitive acrylic adhesive, loaded with titanium diboride and applied toan expanded aluminum carrier. The combination of filler, expanded metal and embossed surface enhances both tape conformability andthermal performance.

Typical Properties
Carrier
Color
Thickness, mm (in.)
Thermal Impedance @<1 psi,
oc-in2/W (oc-cm2/W)
Thermal Conductivity, W/m-k
Voltage Breakdown, Vac
Volume Resistivity, ohm-cm
Flammability Rating (E140244)
Lap Shear Adhesion, psi (MPa)Die Shear Adhesion, psi (MPa)Aluminum 25oc
150oc
Aluminum Oxide Substrate 25oc
150oc
Creep Adhesion, days
25oc, 12 psi (0.083MPa)
150oc, 12 psi (0.083MPa)
Adhesive CTE, ppm/oc, -40 to +150oc

How to order

T405

T412

AluminumWhite
0.152 ( 0.006)

Expanded Al
Grey
0.229 (0.009)

0.5
(3.4)
0.50
N/A

0.25
(1.7)
1.40
N/A

N/A
V-O
135 (0.931)

1.3 x 10-2
Not Rated
70 (0.483)

125 (0.862)
55 (0.379)

135 (0.931)
25 (0.172)

145 (1.00)
60 (0.414)

125 (0.862)
40 (0.276)

>50
>50

>50
>50

400

400

Example P/N

Ordering CodeTape Option

05
10
11
12

T405
T410
T411
T412

RT5635B000 _ _ (Last two digits tape option)

1. Part Number RT5635B00000
2. Choose a tape option T405 (05), T410 (10), T411 (11) or T412 (12)
3. Then add the ordering code (05,10,11,12) to your part number (by replacing thelast two digits.)
For Example: To order tape option T410 (10) with the part number RT5635B00000
the completed part number to order would be RT5635B00010.

Plastic packages
T410 tape consists of a high bond strength, pressure sensitive acrylic adhesive loaded with aluminum oxide and coated onto a 0.05 mm(0.002 inch) aluminum foil carrier. The other side of the foil carrier has a silicone pressure sensitive adhesive which provides excellent
adhesion to silicone-contaminated plastics and other low energy surfaces.
T411 tape consists of a high bond strength pressure-sensitive adhesive with an expanded aluminum mesh carrier layer. The mesh carrier
allows the tape to conform to curved surfaces of plastic molded IC packages, providing a high adhesive strength attachment for heatsinks. The high performance silicone PSA allows adhesion to silicone-contaminated plastics and other low energy surfaces.

T410

T411

Carrier
Adhesive (to heat sink side)
Color (to heat sink side)
Adhesive (onto component side)
Color (to component side)
Thickness, mm (in.)
Thermal Impedance @<1 psi,
oc-in2/W (oc-cm2/W)

Typical Properties

Aluminum Foil
Acrylic
White
Silicone
Clear (Silver)
0.18 (0.007)

Aluminum Mesh
Silicone
Clear (Silver)
Silicone
Clear (Silver)
0.28 (0.011)

1.1
(7.1)

1.0
(6.5)

Operating Temperature Range, oc
Voltage Breakdown, Vac
Volume Resistivity, ohm-cm
Lap Shear Adhesion, psi (MPa)Die Shear Adhesion, psi (MPa)Steel/FR4 25oc

- 50 to +150
N/A
N/A
60 (0.414)- 50 to +150
N/A
N/A
14 (0.094)

170 (1.172)
40 (0.276)

80 (0.552)
20 (0.138)

125oc

www.r-theta.com

Polar Interface Materials

Polar Thermally Conductive Adhesive Tapes

Aluminum Extrusion Profiles

22
Extruded Aluminum Heat Sink Profiles
THE MULTI-PURPOSE ALLOY - 6063 -T56063 is a multi-purpose alloy that is most widely used for heat sinks and architectural hardware because it isextrudable into complex shapes and lends itself to anodized coating. The T5 temper provides sufficient hardnessfor ease of machinability. 6063-T5 is the aluminum extrusion most commonly used by R-Theta.
After entering the URL listed below, click on a part number to view an image of the Extrusion. Sort the table byclicking on the columns titles. Selected part number is displayed beside the send quote button.
http://www.r-theta.com/products_aircooled_extrusion_create.asp

R-THETA OFFERS A BROAD RANGE OF EXTRUSION PROFILES
If you cannot locate an extrusion profile that meets your requirements, contact the factory or web site for
additional profiles that have become available or alternatives. If a custom solution is required R-Theta willassist you to design a new profile that meets your requirements both mechanical and Thermal.

Six foot ( 72” ) lengths are standard; however, other lengths are available.

EXTRUSION CHARACTERISTICS TABLE
ProfileNumberPart Number To
Order (72”)

Perimeter
mm (in)WeightKg/m (lb/ft)

Thermal ResistanceoC/W/3”9000

RT9000U07200

927 (36.5)

4.0 (2.7)

1.8

9001

RT9001U07200

1,422 (56)

5.1 (3.4)

1.5

9002

RT9002U07200

2,487 (97.9)

13.8 (9.3)

0.7

9003

RT9003U07200

1,590 (62.6)

7.1 (4.8)

1.1

9004

RT9004U07200

1,854 (73.0)

10.4 (7.0)

1.0

9005

RT9005U07200

2,817 (110.9)

27.8 (18.7)

0.7

9006

RT9006U07200

1,979 (77.9)

7.6 (5.1)

0.9

9007

RT9007U07200

2,543 (100.1)

10.6 (7.1)

0.7

9008

RT9008U07200

1,481 (58.3)

3.6 (2.4)

1.2

9009

RT9009U07200

1,011 (39.8)

4.0 (2.7)

1.5

9010

RT9010U07200

2,339 (92.1)

24.4 (16.4)

0.8

9011

RT9011U07200

990 (39.0)

4.5 (3.0)

1.6

9012

RT9012U07200

2,941 (115.8)

17.6 (11.8)

0.5

9013

RT9013U07200

3,400 (133.8)

13.1 (8.8)

0.8

9014

RT9014U07200

1,278 (50.3)

6.1 (4.1)

1.4

9015

RT9015U07200

2,042 (80.4)

10.0 (6.7)

0.9

9016

RT9016U07200

2,223 (87.5)

11.0 (7.4)

0.8

9017

RT9017U07200

2,954 (116.3)

11.3 (7.6)

0.5

9018

RT9018U07200

2,316 (91.2)

16.5 (11.1)

0.8

9019

RT9019U07200

2,804 (110.4)

17.6 (11.8)

0.6

9020

RT9020U07200

2,286 (90.0)

16.1 (10.8)

0.9

9021

RT9021U07200

1,344 (52.9)

5.3 (3.6)

1.4

9022

RT9022U07200

1,886 (74.3)

6.1 (4.1)

0.8

9023

RT9023U07200

399 (15.7)

1.7 (1.2)

4.1

9024

RT9024U07200

2,736 (107.7)

8.8 (5.9)

1.2

9025

RT9025U07200

1,711 (67.4)

7.7 (5.2)

0.8

9026

RT9026U07200

1,503 (59.2)

6.6 (4.4)

0.9

9027

RT9027U07200

1,094 (43.1)

6.8 (4.6)

1.6

Note: There are many more sizes and styles available. Consult the website for a complete listing.

www.r-theta.com

23
9023

9011

9009

9000

9027

9022

9014

9001

9013

9002

9026

9006

9003

9017

9025

9024

9007

9015

9020

9010

9019

9012

9004

9005

9008

9018

9021

9016

REFER TO TABLE ON PAGE 22
5 EASY STEPS TO CONFIGURE EXTRUSIONSTEP 1: LOG ONTO www.r-theta.com
STEP 2: SELECT “PRODUCTS” ON MENU BAR
STEP 3: SELECT “AIRCOOLED” ON DROP DOWN MENUSTEP 4: SELECT “CREATE AN EXTRUSION”
STEP 5: SELECT “EXTRUSION CONFIGUATOR”
Select Extrusion to obtain detailed section information
Thermal Modeling of any “comb” Extrusion can be simulated at http://r-tools.r-theta.com

www.r-theta.com

Aluminum Extrusion Profiles

Extruded Aluminum Heat Sink Profiles

Index by Device Cooled

24
Index by Device Cooled
DC/DC Converters

Solid State Relays

R-Theta No. Page No.

R-Theta No. Page No.

Full-Brick

RT3975C00000
RT3980C00000

RT3830C00000
RT3835C00000
RT3840C00000
RT3845C00000

14
14
14
14

TO-202
R-Theta No. Page No.

Half-Brick
RT3850C00000
RT3855C00000
RT3860C00000

15
15
15

DIPS
R-Theta No. Page No.
RT5470B00000
RT5475B00000

16
16

4
4

RT3310B02500
RT3315B02500
RT3320B02500
RT3325B02500
RT3410B02500
RT3415B02500
RT3420B02500
RT3425B02500

11
11
11
11
10
10
10
10

TO-218
R-Theta No. Page No.

IC Packages, BGAs
R-Theta No. Page No.
RT5025B00000
RT5035B00000
RT5045B00000
RT5060B00000
RT5125B00000
RT5135B00000
RT5145B00000
RT5160B00000
RT5235B00000
RT5240B00000
RT5265B00000
RT5325B00000
RT5335B00000
RT5345B00000
RT5360B00000
RT5425B00000
RT5435B00000
RT5445B00000
RT5460B00000
RT5526B00000
RT5553B00000
RT5625B00000
RT5635B00000
RT5645B00000
RT5660B00000

2
2
2
2
2
2
2
2
3
3
3
3
3
3
3
4
4
4
4
3
3
2
2
2
2

R-Theta No. Page No.

R-Theta No. Page No.
13
13
13
13

SMT
R-Theta No.

Page No.

D-Pak TO-252
RT1750D00000

5D2 Pak TO-263
RT1755D00000

5D3 Pak TO-268
RT1760D00000

11
11
12
12
12
12
12
12
12
13
13
13
13
13
13
13
13

TO-220Multiwatt
RT3810B02500
RT3815B02500
RT3820B02500
RT3825B02500

RT1660B00000
RT1670B00000
RT3010B02500
RT3015B02500
RT3020B02500
RT3025B02500
RT3211B02500
RT3216B02500
RT3221B02500
RT3610B02500
RT3615B02500
RT3620B02500
RT3625B02500
RT3710B02500
RT3715B02500
RT3720B02500
RT3725B02500

RT1000B00000
RT1000B03100
RT1000B04000
RT1002B00000
RT1002B03100
RT1002B04000
RT1050B00000
RT1050B03100
RT1050B04000
RT1100B03400
RT1110B03400
RT1150B00000
RT1200B00000
RT1250B00000
RT1300B00000
RT1350B00000
RT1360B00000
RT1360B04000
RT1370B00000
RT1370B04000
RT1400B00000
RT1410B00000
RT1500B00000
RT1550B03400
RT1560B03400
RT1600B03400
RT1650B00000

6
6
6
6
6
6
7
7
7
7
7
9
9
9
7
10
10
10
10
10
10
10
8
8
8
8
11

TO-220 (Continued)
R-Theta No. Page No.
RT1660B00000
RT1670B00000
RT1700B00000
RT3110B02500
RT3115B02500
RT3120B02500
RT3125B02500
RT3210B02500
RT3215B02500
RT3220B02500
RT3310B02500
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www.r-theta.com

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Other Products Available From R-Theta Thermal Solutions Inc.
www.r-theta.com

Hypercool

NAVIGATORThe Navigational Tool For
On-Line Heatsink Design

FabFinMixed Metals

FabFinHollowfin

Aquasink
ISO 9001 - 2000 REGISTERED

R-theta also offers a complete line ofhigh performance , aluminum and copper
alloy heat sinks and AC/DC fans.
Consult R-theta for more details.

AC/DC Fanswww.r-theta.com

Index by Part Number

Index by Part Number

STANDARD
Products Catalog
ISO 9001 - 2000

REGISTERED

www.r-theta.com
voice 905.795.0077

6220 Kestrel Rd., Mississauga, ON CANADA L5T 1Y9
fax 905.795.2508 toll free 1.800.388.5428 website www.r-theta.com