MMC Activities..............1
Fine MEMS Pj...............5
Column.......................6
Overseas Trends............7
Member’s Profiles .........8

MMC Activities

MicroNano 2007 Report
MicroNano 2007 was held from Wednesday, July 25 throughFriday, July 27, 2007, with the Tokyo International Exhibition
Center (Tokyo Big Sight) in Ariake, Tokyo as the main venue.
The exhibition was a resounding success, and the sponsors
would once again like to express their appreciation to all who
attended.
Like last year, MicroNano 2007 was a joint event in which
the exhibition, conference and other events were held
concurrently. This year’s events attracted more than 12,000
visitors, the highest attendance yet. One noteworthy change
from previous years was that the name of the exhibition waschanged from Exhibition Micromachine to Exhibition

Micromachine/MEMS and a new MEMS device zone wasprovided. The conference was centered on the 13th International
Micromachine / Nanotech Symposium, held in the “Iris” banquet
room at the Tokyo Bay Ariake Washington Hotel. The
conference events also included a MEMS Forum, held to
encourage the development of MEMS-related industries and theadoption of MEMS international standards, and a seminar toannounce the interim achievements of the Fine MEMS Project.
Each of these events attracted a, huge audience, leaving
standing room only. This response is indicative of the high level ofinterest in micro-nano fields that continues to increase each year.

18th Exhibition Micromachine/MEMS: A Resounding Success
For three days (July 25 - 27, 2007), the 18 th Exhibition
Micromachine/MEMS was held in the West Hall No. 3 and 4 at
the Tokyo International Exhibition Center (Tokyo Big Sight) in
Ariake, Tokyo. Although Japan’s hot, muggy summer was nearlyat its height, the event was favored by excellent weather, and it
was a resounding success.
Up until last year, the event was titled Exhibition

Micromachine. This year, the name was changed to Exhibition
Micromachine/MEMS to better reflect the content of the
products shown by exhibitors. Moreover, this year a special
MEMS Device Zone was set up to enable visitors to view the
many different devices that employ MEMS in a single location.
With the heightened interest in micromachine/MEMS
technologies, the exhibition has grown in scale each year. The
exhibitors at this year's event included 14 companies that aresupporting members of the Micromachine Center and fivecompanies that are associate members of the MEMS Industry
Forum. Other exhibitors included private companies,
universities, independent administrative agencies and so on.
The total number of exhibitors set a new record: 362
companies, organizations, universities and research institutions
in 484 booths. This total included 14 overseas companies.
Attendance during the three days of the exhibition was
more than 12,424, also a new record.

19th Exhibition Micromachine/MEMS (tentative)
Date/time : Wednesday, July 30 - Friday, August 1, 2008
V e n u e : West Hall No. 1 & 2, Tokyo International
Exhibition Center (Tokyo Big Sight),
Ariake, Tokyo

MEMS ForumThe MEMS Forum was held on July 25, 2007 at a special
venue set up within the West No. 3 Hall at Exhibition
Micromachine/MEMS. The purpose of the Forum was to achieve
an enhanced common recognition of issues involved in thedevelopment of MEMS-related industries.
At the MEMS Forum, case studies of activities were
presented from three perspectives: MEMS personnel
infrastructure, MEMS design infrastructure and MEMS
manufacturing infrastructure. All of these are issues that willlead to a strengthening of the MEMS industrial base. In
addition, a report on academic activities was also presented

Internet Home Page : http://www.mmc.or.jp/

from the perspective of industrial-academia collaboration,
which will support the growth of MEMS industries. A report on
research projects conducted by the Micromachine Center andthe MEMS Industry Forum was also presented.
In connection with efforts by the MEMS Industry Forum tobuild cooperative relationships with related overseas MEMS
organizations, this year the special focus was on Asia. An Asia
MEMS Forum session was held at which delegates from South
Korea, China and Taiwan reported on trends in MEMS industry
and technology in their countries.

(2) Workshop on 3D Integration Using Hetero Wafer Bonding
Tadatomo Suga (Professor, Graduate School, The University of Tokyo)(3) Organizations for Interdisciplinary / New Domain
Research Activities: Inauguration of DedicatedMicro/Nano Engineering Forum
Hidetoshi Kotera (Professor, Kyoto University)

The sessions, presentations and presenters making up thisyear’s MEMS Forum were as follows.

Session 1 : Strengthening the MEMS Industrial
Base(1) The Opening of the MEMS Industry
Tsuneyuki Miyake (Associate editor for Microdevices, Nikkei
Business Publications Inc.)(2) Case Study: Training of Personnel to Promote Applied
MEMS in the MOT Project Research
Kiyoshi Itao (Professor, Tokyo University of Science)(3) MEMS Personnel Training and Technologies forCommercial Application of MEMS
Ryutaro Maeda (Senior Researcher, Advanced Manufacturing Process
Department, National Institute of Advanced Industrial
Science and Technology [AIST])(4) Features of MemsONE (MEMS Design / Analysis Support
System) and Case Studies
Hidetoshi Kotera (Professor, Kyoto University)(5) Overview of Activities to Create a MEMS Foundry Network
Kazushi Tomii, Chair, Foundry Service Industry Committee,
MEMS Industry Forum(Matsushita Electric Works Ltd.)

Session 3 : Asia MEMS Forum(1) MEMS in China Mainland
Dong F.Wang (Senshu University, Ishinomaki, Japan)(2) Micro/Nano Technology in Korea
Young-Ho Cho (KIST, Korea)(3) MEMS & Nanotechnology in Taiwan
M. S. Lin (Industrial Technology Research Institute [ITRI])(4) MEMS Industry Forum (MIF) Towards Virtuous Cycle ofthe MEMS Industry Growth of Asia
Junji Adachi (Micromachine Center, Japan)

Session 4 : Research Results(1) MEMS Market Research Report
Shunichi Adegawa (General Manager, Industry Department,
Micromachine Center)(2) Report of Outcome Survey, Micromachine Project
Shinichi Tamura (Manager, Survey Research No. 2 Section,
Research Department,
Japan Technical Information Services Corporation)(3) BEANS (Toward the Achievement of 3rd Generation MEMS)
Junji Adachi (General Manager, Research Department,
Micromachine Center)

Session 2 : Industry-Academia Collaboration(1) Use of MEMS and Biochips Produced throughMicro/Nano Stereolighography
Shoji Maruo (Professor, Graduate School of Engineering,
Yokohama National University)

Fine MEMS Project Interim Achievements Seminar
As one of the events comprising MicroNano 2007, the Fine
MEMS Project Interim Achievements Seminar was held on
Friday, July 27 at a special venue set up within the West No. 3
Hall at the Tokyo International Exhibition Center (Tokyo Big
Sight). As its name implies, the seminar was held to announce
the interim achievements of the Highly Integrated / Complex
MEMS Manufacturing Technology Development Project (FineMEMS Project) commissioned and subsidized by the New
Energy and Industrial Technology Development Organization(NEDO). The seminar was sponsored by the Fine MEMS
Project Committee and the Micromachine Center, and cosponsored by NEDO, with assistance provided by the Ministryof Economy, Trade and Industry (METI).
The seminar opened with greetings from two invited guests:
Hiroaki Okahashi, Deputy Director of METI, and Masami
Takayasu, Director of NEDO. These greetings were followed bya presentation entitled “Overview of Fine MEMS Project” byIsao Shimoyama, Professor and Dean of the Graduate School ofInformation Science and Technology at the University of Tokyo.
Professor Shimoyama provided an overview of the project’s
achievements including grant activities. This was followed bydetailed reports of the latest consignment project achievementsin eight areas by the project supervisors, which triggered a
lively discussion. Following the conclusion of the seminar, atechnical consultation corner was set up at the NEDO Highly
Integrated / Complex MEMS booth at Exhibition
Micromachine/MEMS, affording visitors the opportunity to talkdirectly with research and development supervisors with theaim of facilitating the practical application of project
achievements.
At the seminar, the 130 seats that had been set up at the
special venue filled up just as the seminar was about to begin,so an additional 50 seats were hastily provided. However, these
also filled up immediately. Judging from the air of excitementthat permeated the venue from beginning to end, theexpectations for this project are extremely high. An opinion
survey was conducted for the 126 persons who attended theseminar and 219 persons who visited the exhibition booth. The
results will be analyzed and will serve to spur efforts aimed at
rapidly achieving practical applications for the manufacturing
technologies developed in the course of the project.

2

13th International Micromachine / Nanotech Symposium- Introducing BEANS as the 3rd Generation of MEMS The 13th International Micromachine / Nanotech Symposium
was held Thursday, July 26, 2007 as one of the events ofMicroNano 2007. The symposium was held in the “Iris” banquet
room at the Tokyo Bay Ariake Washington Hotel. The subtitle ofthis year’s symposium was “MEMS Frontier: Innovative Devices
by Micro and Nano-Bio Fusion Create New Lifestyles.” Thirteen
invited guests – three from the United States, one from
Belgium, one from Italy and eight from Japan – gave
presentations on the latest research and development trends inthe fields of MEMS and nano-bio fusion (environment / energy,
comfort / security / safety and health care / welfare). The
symposium was attended by 255 people who also participatedin the spirited discussion.
One of the two keynote lectures, entitled “BEANS: HeteroFunctional Integrated Device Impacting the Society over the
Next 20 Years,” was given by Professor Hiroyuki Fujita of theInstitute of Industrial Science at The University of Tokyo.
Professor Fujita discussed Bio Electromechanical Autonomous
Nano Systems (BEANS), devices that represent a fusion ofdifferent fields and are expected to have a revolutionary impact
on society twenty years from now. Third generation MEMS are
defined as MEMS that fuse microtechnology with bio- andnanotechnologies to create devices and systems that willfunction in an autonomous and decentralized manner. In Japan,
it is said that semiconductors are the “rice” (in other words, thecore) of Japanese industry. In contrast, MEMS will be the“beans” of industry, providing it with protein as well as muscle
in the form of sensors and actuators to serve as eyes and ears
and the like. It is for this reason that the acronym BEANS was
adopted.
BEANS will focus market expansion efforts on those fields
that are presently the main markets for MEMS: automobile, IT,

health care, biotechnology, environment, energy, security,
safety and so on.
In order to make BEANS a reality, three processes will beessential:
1) Three-dimensional nanostructure formation
2) Biotechnology-fusing processing3) Large-area continuous processing
A FY 2008 budget request for BEANS has been submitted
by the Ministry of Economy, Trade and Industry. The budget
focuses on the development of manufacturing technologies fornext-generation devices that fuse different fields.
The other keynote lecture, entitled “Bio POETS for
Innovative Healthcare,” was presented by Professor Luke Lee of
the Berkeley Sensor & Actuator Center (BSAC) at the
University of California at Berkeley. BSAC is the center for
MEMS research and development at UC Berkeley. Professor
Lee spoke about the following research and development efforts
aimed at achieving bio-related applications for MEMS:•Cellular Biologic Application Specific Integrated Circuits(BioASICs)(devices in which microfluidic elements, sensors, control
circuits etc. are integrated)•Biologically-inspired Polymeric Opto-Electro Mechanical
Systems (BioPOEMs)(photoregulation, automation and imaging in bio-reactive
element arrays)•Quantum Nanoplasmonics for In-vivo Molecular Imaging(molecular imaging by means of Surface Enhanced Raman
Scattering [SERS] using nanocrescents)
The 14th Symposium will be held next year, once again aspart of MicroNano 2008.

3

MEMS Standardization Roadmaps
Recognizing the need for a mechanism to promoteinternational standardization activities in MEMS fields in a
strategic manner, the Micromachine Center has establishedroadmaps to serve as a guide for future international
standardization activities. Specifically, as the technologies
and products in MEMS fields are diverse, these have been
divided into two main categories – fundamental technologies
and MEMS devices – and for each category a roadmap for the
next 10 years has been prepared.

With regard to MEMS devices, the focus was on the two
major application fields of automobiles and information &communications (mobile devices). For each field, future
market trends and needs, standardization trends, and theitems needed for standardization were identified, and each
item was ranked in terms of priority to create the roadmap.
In the future, based on these MEMS standardization
roadmaps, the creation of international standards will bepromoted in a strategic manner, strengthening international
competitiveness in MEMS fields.

With regard to the fundamental technologies for MEMS,
technical fields were divided into three categories: processing
and process technologies, material technologies andfundamental compound technologies. For each of thesecategories, a technology map for standardization was
prepared, based on a study of technological andstandardization trends, and each standardization item was
ranked in terms of priority to create the roadmap.

MEMS Standardization Roadmap for Fundamental Technologies
2006

2011

2006

2016

Single functional device-Miniaturization and high integration of existing devices
Development of fine MEMS and multifunctional devices(High performance and high reliability)

Process Flow, Geometries, Photomask Drawing

Input and Operation Support
Information Accumulation and Output

Specification

Music player, One-segment TV, Computer Book, and Micro Hard Disk
Small and thin terminal, multi-band, and fuel cell

Environment andPersonal Information Sensing

Measurement of Camber &TorsionElectronic Paper

Self-power generation

Navigation, digital cash, biometrics, health careubiquitous communication

Acceleration, Corner Speed,
Terrestrial Magnetism Sensor

Fundamental
Units

SensorUnits, Measurement and Calibration Methods

TensileTest Specimen

IEC 62047-3
Aug., 2006

Standard Specimens for Calibration of Mechanical Properties

Sound Pressure Sensor
Pressure Sensor
Input and Attestation Sensor

Communication

Standard
Materials

2016

Camera, Video, Bar-code Reader, Portable Game, Voice Input, Motion Input, and Universal Design

Telecommunication andPower Supply

Devices

Processes

Innovative future devices

Measurements of Roughness & Profiles

2011

Ubiquitous Network Terminal Portable Multifunctional Information Terminal
Market Driver

MEMS
Scenarioin Japan

MEMS Standardization Road Map in Cellular Phone

Standard Specimens for Testing of Functions(Optical,Electrical, Magnetic Properties)

Filter
RF Switch
OscillatorPowersystemIEC 62047-6

Uni-axial Fatigue Test CD in March 2007

Pump Valve for Fuel Cell

Miniaturization of the above-mentioned Devices

Items of Standard

Materials

Statistical Analysis of Fatigue Life Data
Accelerating Life Test

Mechanical
Properties

Bonding Strength between Film and Substrate
IEC 62047-3
Aug., 2006

Analysis of Measured Properties

Tensil Test

Methods and Conditions of
Reliability Measurement

MEMS Devices Common Conditions

SensorMethods and Conditions ofSpecifications of Devices

SensorCommunication

Communication
Power system

SensorInterface and Packaging

SensorCommunication

Communication
Power system

Bending and Bulge Tests
Torsion Test
Reliability Test for Contact Resistance

MEMS Standardization Road Map in Automotive Application

Fatigue Durability andReliability of Thin Film2006

Measurement and Analysis of Charge Trap

Peculiar to
Devices

Wear-out Evaluation

Attendance in ach Standardization Project and International Standardization Committee.

OthersCorrespondence to Urgent Standardization Item Generation

2016

SafetyAir-bag

Stability Control

Air Pressure Monitoring

EFI

Environment
ITS

Navigation

FCEV

Reducing Collision Damage

Pedestrian Alarm System at Night

Acceleration
Pressure
Yaw Rate

Acceleration Sensor for StabilityNavigationDevices

After the Publication of IS

Personnel
training

Acceleration
Gyro
Pressure
Air Flow
Pedestrian Alarm
HydrogenItems of Standard

Management
and operation

2011
Car Electronics

Market Driver

Impact Test

Air-bag

Fundamental Compound

Analysis of Bonding Reliability

CommonTechnologies

4

Methods and Conditions of
Reliability Measurement

MEMS Devices Common Conditions

Methods and Conditions ofSpecifications of Devices

MEMS Devices Common Conditions

Interface and Packaging

MEMS Devices Common Conditions

MEMS - Semiconductor Process Integration Monolithic Manufacturing Technology(The Search for a New MEMS Sensing Principle)

Susumu Sugiyama, Professor, COE Promotion Organization, Ritsumeikan University
Toshiyuki Toriyama, Professor, Department of Micromachine Systems Engineering,
College of Science and Engineering, Ritsumeikan University

Yoshimasa Isono, Professor, Department of Micromachine Systems Engineering,
College of Science and Engineering, Ritsumeikan University
Forming components comprising semiconductor ICs andsensors, actuators, or other MEMS devices in an integrated
manner will make it possible to create more compact, more
highly functional and more reliable devices. The need for
improvement is particularly keen in areas such as automobile
components and medical sensors, in which advancement is amust.
In the case of MEMS semiconductor integration, thetechnical complexity increases along with the level ofintegration, due to the complexity of conducting the designusing different processes, the duplication of manufacturing
equipment and so on. Moreover, whereas the size of thetransistors making up the IC is in the sub-µm domain, the size ofthe elements making up the sensor are in the µm domain. As aresult, a size of several mm is needed to accommodate the entire
sensor, and this increases the size of the chip with which the IC
is integrated. In this way, the complexity of the technologies
used in the manufacturing process and the resulting lowered
yield and increased chip size reduce the yield constant, making
it impossible to maintain profitability in cost terms.
The purpose of this development project was to resolve thisproblem by developing a manufacturing technology for creating
MEMS and semiconductors in an integrated manner, thereby
providing higher added value and more advanced functions. The
ultimate goal was to increase the international competitivenessof Japan’s unique leading-edge technologies.
In particular, we aimed to create the advantages that would
be obtained from higher added value and more advanced
functions. We focused on the piezoelectric element that is one of
the basic sensor elements, working to determine its properties
at the sub-µm level and to find a sensing principle that would
lead to higher sensitivity.

Fig. 1 Stand-alone Si nanowire manufactured using Scanning Probe Nano Lithography (SPNL)

El

e

ro
ct

st

ic
at

e
rc
fo

Input

AC

DC

OutputFig. 2 Structure of Nanoelectromechanical system (NEMS) resonant device

Determining the piezoresistance effect of nanoscale silicon
The piezoresistant elements used as sensing elements inmechanical sensors are simple in terms of structure anddetection path. For this reason, they have been widely used inpressure sensors and acceleration sensors and so on. As shownin Fig. 3, when the width of the silicon piezoresistant element isreduced to the sub-µm level or below, the coefficient ofpiezoresistance, which affects sensor sensitivity, increases
greatly. We focused on this phenomenon in our efforts toincrease sensor sensitivity. First, we reduced the width of thesilicon piezoresistant element to 100 nm or below andconducted a theoretical analysis of piezoresistance based on the
low-dimensional band structure. Based on these analyticalpredictions, we plan to manufacture a silicon piezoresistantelement and determine the actual coefficient of piezoresistance.
It is thought that, if the prediction is correct, sensor sensitivity
will be increased anywhere from several times to nearly anorder of magnitude greater.

Achieving a nanomechanical structure and determining
nanoelastic properties
It is not yet clear whether the same mechanical properties
are maintained or different mechanical properties are exhibitedwhen a mechanical sensor mechanism is reduced to the sub-µm
scale or smaller. The purpose of this study was to measure thisexperimentally in the hope that the results would serve as
useful data for the design of highly integrated MEMS. Fig. 1
shows an autonomous silicon nanomechanical structure
manufactured by means of Scanning Probe Nano Lithography(SPNL). Fig. 2 shows the structure of a nanoelectromechanicalsystem (NEMS) resonant device. From these resonanceproperties, the mechanical properties were measured and theirapplication in sensors was studied. The planned width of the
nanowire and the gap between electrodes is less than 100 nm.

Fig. 3 Relationship between Si piezoresistance effect and section area5

Column

MEMS Frontier Devices“Blue Devices” That Provide Comfort, Safety and Security

Yoshiro Mita, Associate Professor of Electrical Engineering, Graduate School of Engineering, The University of Tokyo
create moving life-sized posters orsigns that offer simultaneousinterpretation services.
The technical issues common to all of these devices are
twofold: how to achieve the necessary degree ofminiaturization, and how to create large-area screens. Morespecifically, the following are thought to be essential:- Commodification of high-end devices, reducing costs,
achieving ease of assembly- Achieving large-area sheets, thinness and flexibility- Chemical applications for three-dimensional nanostructures
The following research and development topics will be
particularly important from this point on:- Technologies to integrate microcomponents over a large
poster-sized area
- Technologies that simplify assembly by completing a circuit
simply by using a sealing procedure to align and attach
modules (Technology that simplifies assembly processes(for example, configuring circuits by sticking modules
together in the same manner as using adhesive tape toattach things to one another)- Chemical applications for three-dimensional nanostructuresthat use the principle that the ratio of surface area tovolume increases when an object is made three-dimensional

On a recent business trip to France, I wrote an essay about
the fact that, up until around 20 years ago, the United Statesand Europe had seemed very far away. At that time, one of myformer teachers was living in the United States on a long-termbasis. He told me that, hungry for things written in the Japanese
language, he had read and reread all of the books that he hadbrought with him, even those that he would not ordinarily read.
The physical distance of around 10,000 kilometers between the
United States and Japan has not changed. But now, even when
we go to the other side of the world, we do not feel that we arevery far away. The reason, of course, is the dramatic progress incellular telephones and the means of transmitting information
typified by the Internet. Now, wherever you are in the world,
there is an infrastructure in place that allows you to“connect.”We have entered an age in which, using the same cell
phone you use at home, you can easily communicate withfriends and family wherever you are.
Even while I was writing these words, however, I was
excited and fidgety and unable to calm myself. The reason was
simple. During the summer I had been in France away from myfamily in Japan, and I knew that tonight I would be reunited
with my wife and eight-month-old son for the first time in 40
days. (I know that in Japan it is forbidden to bring up one’s
family in speeches of this kind, so I would ask you to apply theEuropean standard and forgive me.) Naturally my wife and I
called one another on the phone frequently, and in the
background I could hear my son’s voice. But telephones do nottransmit the feel of the skin and the warmth of the body, so it isdifferent from actually being there. When you think about it, theinformation and telecommunications technologies of the 20 th
century were successful at transmitting information over long
distances for only two of the five senses: seeing and hearing.
Even though we are now in our seventh year of the 21st century,
the transmission of information for the other three senses –smell, taste and touch – has not yet become viable. If we weresuccessful in transmitting these three senses, it would enablecommunication with a greater sense of actually being there.
Things would change from “home is so far away” to “home isalways nearby,” and it would undoubtedly have a revolutionary
impact on society.
In order for “blue devices” to enable people to have more
comfortable, more human lives, they must aim to create not only
sensors and actuators capable of transmitting information for all
five senses (not merely video and audio) but also “sixth
sense”devices – devices that offer not second sight or the “sixsenses” of Buddhism (the five senses + innermost feelings or“heart”) but that sense physical and chemical quantities thatcannot be detected with the five senses available to humanbeings, such as imaging by means of infrared rays and terahertz
waves.
Naturally, the applications for these devices would not belimited only to the transmission of information. They could also
serve as “food security” devices: through the use of sheet-liketags that record changes in temperature and humidity, they
could be used to ensure that the environment for gourmet fooditems has been properly controlled, and guarantee the quality offood not by means of mechanical “sell-by” dates but bymonitoring the food itself for damage and determining the dateby when it should be consumed. Or they could be used as“caregiver” devices for in-home care use, detecting changes invital signs and out-of-the-ordinary behavior and otherabnormalities and issuing alerts on the network. The expecteddevelopment of these and other devices in the future will help
to ensure both safety and peace of mind. (Fig. 1)
As shown in Fig. 2, there will be three mounting modes for blue
devices: tag type, mobile device type and large-area sheet type.
Each type will be used where its features are most appropriate.
- Tag type: Supermarket price tags or smaller configurations.
As in the example of the food security device, thesewill be attached to an object and will keep records
over a long period of time.
- Mobile device: Similar to present-day cellular telephones. The
components in cellular telephones will continue
to become smaller and smaller with each new
generation. However, from the standpoint ofusability, the terminal itself cannot get any
smaller. Accordingly, “blue devices” will be
integrated into the vacant space to function as“five sense” transmission devices.
- Large-area sheet type: Devices will be integrated into
posters or other display objects, orthe poster itself will be an electronic
device. These devices will be used to

In any age, what is most important is to create a world inwhich communication between people is smoother, and in whichpeople can live with one another in peace and harmony. This is
why I eagerly await the day that “blue devices” can play animportant role in creating comfortable lifestyles and a peacefuland safe society thanks to communications utilizing all five senses.
At the department store

Caregiver devices
High-function
tags

Quality assurance
Historical management

In the office

Five-sense communication

In thehome
The device reacts only whensomething is out of the ordinary"Blue Devices" Enrich Human Society
Integ ating sensors
Integrating
and display
tile
panels into tile,
carpet andlarge surfaces
other large

Recreating the sense of
smell and touch- Devices that make full use of all five senses- Large high-end monitoring devices become commodities- Devices that cover a large surface area, consume
little power and are easy to assemble become a reality

On street corners
Senses the number
deploof people and deploys
elevators to floors
elevators
Senses locations where
where
with a lot of people
people areare present
present andon a priority basis
heats only those areas
areas
Flat-panel screens provide information

Makes it easy to detect COand other hazardous
substances &environmental
substancesFig. 1 “Blue devices” have many different applications, from informationtransmission to historical monitoring to information-provision.
Tag type

Mobile devices

Chip / sheet
Data log
Environmental sensing

Five-sense communications
provide enhanced depth"Virtual secretary"
Security monitor

Large-area screen

Public bulletin board
Intelligent poster

Fig. 2 Three modes for “blue device” mounting
Table 1 “Blue Device” Working Group Members(in no particular order)
Yoshio Mita
Masakazu Sugiyama
Takao Someya
Masafumi Kimata
Susumu Sugiyama
Masaaki Ichiki
Masayoshi Higuchi
Yuji Saisho
Yasuro Irie
Shin ichi Izuo
Takaaki Hirata

6

The University of Tokyo
The University of Tokyo
The University of Tokyo
Ritsumeikan University
Ritsumeikan University
National Institute of Advanced Industrial Science andTechnology (AIST)

Omron Corporation
Matsushita Electric Works, Ltd.
Mizuho Information & Research Institute, Inc.
Mitsubishi Electric Corporation
Yokogawa Electric Corporation

Overseas Trends

3rd Japan-Korea-China MEMS Standardization Workshop
In order to speed up the design and development process,ensure compatibility and make mass production possible,
MEMS international standardization will be crucial. In Japan,
the Micromachine Center has played a leading role in pursuinginternational standardization with the International
Electrotechnical Commission (IEC). So far three international
standards originating in Japan have been published: Terms anddefinitions, Tensile testing method of Thin film materials andThin film standard test piece for tensile testing. Anotherproposed standard, Thin Film Fatigue Test Methods, iscurrently under review as a Committee Draft Version (CDV).
Against this backdrop, the first Japan-Korea-China MEMS
Standardization Workshop was held in Tokyo in 2005 as a forum
for the exchange of information and the promotion of cooperationon the part of Japan, South Korea and China with regard to MEMS
standardization. Last year, a second workshop was held in
Gyeongju, South Korea. This
year, the third MEMS
Standardization Workshop
was held on June 28, 2007 tocoincide with the IEC TC47
Beijing Conference. Twospeakers each from Japan,
South Korea and China gavea total of six presentations on
the evaluation of material
properties for MEMS thinfilm materials. These
The Tian You Hotel (the venue
presentations were followed
for the Japan-Korea-China MEMS
Standardization Workshop)
by a spirited discussion.

bonding strength of MEMS
materials, a new project
aimed at standardization
has just been initiated inJapan as well, and thispresentation played amajor role in promoting
this project to South
Korea and China.
(4) Dr. C. S. Oh of the Kumoh National Institute of Technology
in South Korea gave a presentation on the measurement ofthermal expansion in thin film materials using laserinterferometry. This is an area in which not much researchhas been promoted in Japan, and thus the presentation wasof considerable interest. Moreover, as South Korea plans topropose this method of measuring thermal expansion as aninternational standard, it is one for which study will beneeded in Japan as well.
(5) Dr. Isono of Ritsumeikan University gave a presentation
centering on the results of bending tests of nanosize
thickness single-crystal silicon thin films. In particular, Dr.
Isono presented a great many test results to show that, withsubmicron thicknesses,
the silicon exhibits
plastic deformation evenat room temperature.
This is an extremely
important finding interms of applications for
MEMS/NEMS, and it
attracted a great deal ofattention.
(6) Dr. Ren of Tsinghua University gave a presentation focusing
on the progress of MEMS research at Tsinghua University.
His presentation communicated the enthusiasm with which
MEMS research is being conducted at Tsinghua University
as well.

The following is an overview of the presentations.
(1) J. H. Kim of the Korea Institute of Machinery and Materials(KIMM) gave a presentation on the preparation of test
specimens and test methods relating to compression testingof micro/nano pillar shaped test specimens fabricated fromthin films. Dr. Kim also presented the results ofmeasurement of polymer and metal thin films. South Korea
will propose this material test method as a standard
originating in South Korea.
(2) Dr. Zhao of the Chinese Academy of Sciences gave apresentation on the degree of elasticity and fracture
toughness of MEMS and bio-MEMS thin film materials. With
regard to the degree of elasticity, Dr. Zhao demonstrated
analytically that when the thickness of the thin film is lessthan an atomic layer of 100, a size effect becomes evident in
the Young’s modulus due to the surface energy of the material.
(3) Dr. Higo of the Tokyo Institute of Technology gave apresentation on the evaluation of bonding properties for
MEMS materials. Dr. Higo focused in particular on a
discussion of new phenomena that are the opposite of theordinary size effect – for example, with regard to the size
dependency for the bonding strength between polymer (SU8) and silicon boards, the strength is sometimes reduced
when the size is small – as well as the causes for these newphenomena. With regard to methods for measuring theThis is the third time the Japan-Korea-China MEMS
Standardization Workshop has been held. The majorachievement of the Workshop is its role in providing a forum forthe exchange of information regarding the current state of
MEMS standardization and future prospects in each country, as
well as enhancing the common recognition in these three
countries. It is crucial that these achievements be utilized in
MEMS standardization strategies in Japan. Moreover, most of
the presentations in the Workshops held up to now havefocused primarily on evaluating the properties of MEMS
materials. In the future, the workshop should function as aforum for the exchange of information among Japan, South
Korea and China regarding the standardization of MEMS
devices and their fields of application.
The 4th Japan-Korea-China MEMS Standardization Workshop
will be held in 2008, with Japan once again serving as host.

7

Members’ Profiles

Sumitomo Precision Products Co., Ltd.
1. Overview of business activities
In 1995, the British firm Surface Technology Systems(STS), an affiliate of Sumitomo Precision Products Co.,
Ltd., marketed the world’s first silicon deep etching unit.
Building on this unit and its technology, Sumitomo
Precision Products became the first Japanesemanufacturer to produce a silicon deep etching unit, theMUC-21 ASE, in 2001. In 2006, Sumitomo Precision
Products also began domestic manufacture of the silicon
dioxide film etching unit, which uses HF vapor, of the U.
S. firm Primaxx (which became funded by Sumitomo
Precision Products in June of this year), in order to better
respond to the MEMS needs of its customers.
Sumitomo Precision Products also handles a wide
range of MEMS processing units, including SiO2/SiN
etching units, SiC etching units, compound semiconductor
etching units, PE-CVD units, silicon sacrifice layer etchingunits and units for wafer thickness reduction.

Fig. 2 VPX-ASE Pegasus(3) APS (SiO2/SiC high-speed etching unit)
Released last year, the APS system employs the highly
reliable MUC-21 domestically produced platform andincludes a newly developed Advanced Physical Source(APS) plasma source. It enables high-speed etching with
SiO2 and SiC and is attracting particular attention for its
application in the SiC etching of LEDs, semiconductor
components and next-generation power devices. In the SiC
etching process, the APS achieves a high etching rate of
4.2 µm/minute or greater. In addition, the mask selection
ratio is high, and the side wall angle can also be controlled.

2. Domestic products designed for MEMS
mass production

Aspect Ratio(1) MUC-21 ASE Pegasus (new silicon deep etching unit)
The ASE Pegasus is Sumitomo Precision Products’
most advanced model and was released in December 2005.
It is based on the so-called Bosch switching process, aswell as the Advanced Silicon Etch (ASE) technology
established by STS by combining various proprietary
technologies. The resulting hardware module andprocessing software offer superior performance thatmaximizes such switching process features as high etchrate, high mask selection ratio and high aspect ratio
processing.
Specifically, the unit offers greatly improved etchingshape and in-plane distribution through the use of a newly
developed plasma module, as well as an improved plasma
matching system and a new type of gas introduction
system that includes an MFC capable of high-speed
switching processing. The result is a product that offers
world-class performance. Moreover, Sumitomo Precision
Products continues to focus on development in an effort
to achieve further improvements in the future.
180
160
140
120
100
80
60
40
20
0

Fig. 3 Example of SiC highspeed etching(4) SLE (Si oxide film sacrifice layer dry etching unit)
Removal of the sacrifice layer is a typical MEMS
process that involves extremely tiny moving parts.
Building on the basic concept of the MEMS-CET siliconoxide film etching unit (which uses HF vapor) producedby the American firm Primaxx, Sumitomo Precision
Products designed a domestically produced chamber andofficially released it domestically in 2006 under the name
SLE. The SLE system achieves a high-speed, stiction-freerelease configuration employing a silicon oxide film
sacrifice layer at a low cost. It also offers high selectivity
with regard to aluminum, enabling maskless etching evenwith wafers that have exposed aluminum pads.

HR
PEGASUS

Fig. 4 SOI sacrifice layer etching(in the case of a silicon
resonator)(Image provided by SiTime)Etching length : 116.2µm,
0.5

0.7

0.9
1.1
1.3
Top Width (um)

1.5

Top etch width : 0.80µm=> Aspect ratio : 145

Fig. 1 Example of silicon high aspect ratio etching(2) VPX-ASE Pegasus (platform for mass-production
factories)
In 2007, Sumitomo Precision Products released the
VPX-Pegasus cluster type ASE unit for users interested in
the mass production of MEMS devices.
In this system, the ASE-Pegasus source is mounted on acluster type conveyor system. Sumitomo Precision Products
is confident that this system will make a major contribution
to the production of various types of MEMS sensors, silicon
microphones, silicon oscillators and other components
already making the transition from the research anddevelopment stage to the mass-production stage.

3. A final word
Sumitomo Precision Products has a voluminous
process library accumulated over many years, centeringon silicon deep etching technology. The company isbuilding systems that can respond rapidly to theextremely diverse needs of any MEMS user company.
MEMS devices are now being are employed for an everwidening variety of purposes.
By developing a diverse array of applications andequipment, Sumitomo Precision Products will continue toprovide the means to respond rapidly to MEMS
development needs.
For more information about Sumitomo Precision
Products, access the SPP website at:
http://www.spp.co.jp

MICRONANO No. 61
MICRONANO is published quarterly by Micromachine Center (MMC) to promote the international exchange of
information related to micromachines, R&D and other technical topics, and is circulated free of change. Please send
your comments about MICRONANO to the publisher :Keiichi Aoyagi, Executive Director, Micromachine Center (MMC)
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Tel : +81-3-5835-1870, Fax : +81-3-5835-1873
Internet Home Page h t t p : / / w w w . m m c . o r . j p /Date of Issue : October 30, 2007

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