REVISIONSLTR

DESCRIPTIONDATE (YR-MO-DA)APPROVEDA

Corrections to figure 1, case outline X. - drw

16-05-02

Charles F. Saffle

B

Update document paragraphs to current MIL-PRF-38535 requirements. - ro

22-09-07

James R. Eschmeyer

Revision Status of Sheets
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SHEET

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PMIC N/A

PREPARED BY

STANDARD
MICROCIRCUITDRAWINGDan Wonnell

DLA LAND AND MARITIMECOLUMBUS, OHIO 43218-3990
https://www.dla.mil/LandandMaritime

CHECKED BY
Rajesh Pithadia
APPROVED BY

THIS DRAWING IS AVAILABLEFOR USE BY ALL DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSEAMSC N/A

DSCC FORM 2233
APR 97

Robert M. Heber

MICROCIRCUIT, DIGITAL-LINEAR, 13-BIT,

DRAWING APPROVAL DATE

250 MSPS, ANALOG-TO-DIGITAL CONVERTER,
MONOLITHIC SILICON

07-10-25
REVISION LEVEL
B

SIZE
A

CAGE CODESHEET

1 OF 1767268

DISTRIBUTION STATEMENT A. Approved for public release. Distribution is unlimited.

5962-07207
5962-E420-22

1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device class Q) and space
application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying
Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962

-

07207

__________ _______
FederalRHA
supplydesignator
class(see 1.2.1)\\/
Drawing number

/

01

V

X

C

_______
Devicetype(see 1.2.2)_______
Deviceclass
designator(see 1.2.3)_________
Case
outline(see 1.2.4)________
Lead
finish(see 1.2.5)

1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and aremarked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type

Generic number

Circuit function

01

ADS5444M

A/D converter, 13-bit, 250 MSPS

1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows:
Device class

Device requirements documentation

Q or V

Certification and qualification to MIL-PRF-38535

1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter

Descriptive designator

Terminals

X

See figure 1

84

Package style
Quad flatpack with non-conductive tie bar

1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V.

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REVISION LEVELBSHEET 2

1.3 Absolute maximum ratings. 1/
Supply voltage :AVDD to GND ......................................................................................................... 6 V
DRVDD to GND ...................................................................................................... 5 V
Analog input to GND .................................................................................................. -0.3 V to AVDD + 0.3 V
Clock input to GND .................................................................................................... -0.3 V to AVDD + 0.3 V
CLK to CLK .............................................................................................................. ±2.5 V
Digital data output to GND ......................................................................................... -0.3 V to DRVDD + 0.3 V
Maximum junction temperature (TJ) ........................................................................... +150°C
Storage temperature range (TSTG) ............................................................................ -65°C to 150°C
Thermal resistance, junction-to-ambient (θJA) ........................................................... 21.813°C/W
Thermal resistance, junction-to-case (θJC) ................................................................ 0.849°C/W
1.4 Recommended operating conditions.
Supplies:
Analog supply voltage (AVDD) ............................................................................... 4.75 V to 5.25 V
Output driver supply voltage (DRVDD) ................................................................... 3 V to 3.6 V
Analog input:
Differential input range ........................................................................................... 2.2 VPP
Input common mode voltage (VCM) ....................................................................... 2.4 V
Clock input:
ADCLK input sample rate (sinewave) (1/tC) ........................................................... 10 MSPS to 250 MSPS
Clock amplitude, sine wave, differential ................................................................. 3 VPP
Clock duty cycle ..................................................................................................... 50 %Operating case temperature range (TC) ..................................................................... -55°C to +125°C
Estimated device life at elevated temperatures electromigration fail modes:________
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum
levels may degrade performance and affect reliability.

STANDARD
MICROCIRCUIT DRAWINGDLA LAND AND MARITIMECOLUMBUS, OHIO 43218-3990

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REVISION LEVELBSHEET 3

2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part ofthis drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in thesolicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONMIL-PRF-38535 -Integrated Circuits, Manufacturing, General Specification for.

DEPARTMENT OF DEFENSE STANDARDSMIL-STD-883
MIL-STD-1835-

Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.

DEPARTMENT OF DEFENSE HANDBOOKSMIL-HDBK-103
MIL-HDBK-780-

List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.

(Copies of these documents are available online at https://quicksearch.dla.mil/.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specificexemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF38535 as specified herein, or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM
plan shall not affect the form, fit, or function as described herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38535 and herein for device classes Q and V.
3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Block diagram. The block diagram shall be as specified on figure 3.
3.2.4 Timing diagram. The timing diagram shall be as specified on figure 4.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electricalperformance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case
operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electricaltests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also bemarked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has
the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked.
Marking for device classes Q and V shall be in accordance with MIL-PRF-38535.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535.

STANDARD
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REVISION LEVELBSHEET 4TABLE I. Electrical performance characteristics.
Test

SymbolConditions 1/-55°C ≤ TC ≤ +125°C
unless otherwise specified

Group A
subgroups

Devicetype

Limits

Unit

Min

Max

Internal reference voltages section
Reference voltage

VREF

1, 2, 3

01

2.38

2.42

V

Dynamic accuracy sectio n
Differential linearity
error
Integral linearity error

DNL

fIN = 100 MHz

1, 2, 3

01

-0.98

2

LSB

INL

fIN = 100 MHz

1, 2

01

-2.8

2.8

LSB

-4.8

4.8

3
Offset error

1, 2, 3

01

-0.6

0.6

%FS

Gain error

1, 2, 3

01

-5

5

%FS

1, 2, 3

01

410

mA

1, 2, 3

01

100

mA

1, 2, 3

01

2.29

W

4

01

Power supply section
Analog supply current

IAVDD

Output buffer supply
current

IDRVDDPower dissipationPD

scale, fIN = 170 MHz
FS = 250 MSPS, VIN = fullscale, fIN = 170 MHz

Dynamic AC characteristi cs section
Signal-to-noise ratio

FS = 250 MSPS, VIN = full

SNR

FS = 250 MSPS, VIN = fullscale, fIN = 170 MHz
fIN = 10 MHz

fIN = 100 MHz

fIN = 170 MHz

68

5

66.8

6

63.2

4

67.3

5

66.5

6

62.1

4

66.5

5

66.1

6

60.8

dBc

See footnotes at end of table.

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REVISION LEVELBSHEET 5TABLE I. Electrical performance characteristics – continued.
Test

SymbolConditions 1/-55°C ≤ TC ≤ +125°C

Group A
subgroups

Devicetype

unless otherwise specified

Limits

Min

Unit

Max

Dynamic AC characteris tics section – continued.
Spurious free dynamic

SFDR

4, 6

fIN = 10 MHz

range
fIN = 100 MHz

fIN = 170 MHz

Second harmonicHD2

fIN = 100 MHz

fIN = 170 MHz

Third harmonic

HD3

75

5

74

4

62

5

74.5

6

63

4

63

5

65

6

59

4

fIN = 10 MHz

01

01

75

5

74

6

76.5

4

62

5

76

6

63

4

63

5

65

6

59

dBc

78.5

fIN = 10 MHz

4, 5, 6fIN = 100 MHz

4

72

5

74.5

6

65

4

65

5

69

6

63

fIN = 170 MHz

01

dBc

dBc

See footnotes at end of table.

STANDARD
MICROCIRCUIT DRAWINGDLA LAND AND MARITIMECOLUMBUS, OHIO 43218-3990

DSCC FORM 2234
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REVISION LEVELBSHEET 6

TABLE I. Electrical performance characteristics – continued.
Test

SymbolConditions 1/-55°C ≤ TC ≤ +125°C

Group A
subgroups

Devicetype

unless otherwise specified

Limits
Min

Unit

Max

Dynamic AC characteristics section – continued.
Worst otherHD

4fIN = 10 MHz

0180

harmonic/spur (other5

81

than HD2 and HD3)

6

75

4

74

5

78

6

69

4

70

5

78

6

64

fIN = 100 MHz

fIN = 170 MHz

Total harmonic

THD

4fIN = 10 MHz

distortionfIN = 100 MHz

fIN = 170 MHz

Signal-to-noise +SINAD

distortionfIN = 100 MHz

fIN = 170 MHz

74.5

5

73

6

74

4

61.5

5

73

6

60

4

62

5

63.5

6

58

4

fIN = 10 MHz

01

01

dBc

dBc

67.7

5

66.4

6

62.9

4

62.2

5

66.2

6

59.4

4

61.7

5

62.9

6

57.6

dBc

See footnotes at end of table.

STANDARD
MICROCIRCUIT DRAWINGDLA LAND AND MARITIMECOLUMBUS, OHIO 43218-3990

DSCC FORM 2234
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SIZE

5962-07207

A

REVISION LEVELBSHEET 7

TABLE I. Electrical performance characteristics – continued.
Test

SymbolConditions 1/-55°C ≤ TC ≤ +125°C

Group A
subgroups

Devicetype

unless otherwise specified

Limits

Unit

Min

Max

Dynamic AC characteris tics section – continued.
Effective number of

ENOB

4

fIN = 10 MHz

bits

fIN = 100 MHz

fIN = 170 MHz

01

10.9

5

10.7

6

10.1

4

10

5

10.7

6

9.5

4

9.9

5

10.1

6

9.2

Bits

Digital characteristics – LVDS digital outputs
Differential output
voltage

VDIFF

1, 2, 3

01

247

452

mV

Output offset voltage

VOFF

1, 2, 3

01

1.125

1.375

V

9, 10, 11

01

2.7

3.5

ns

Clock to data ready (DR Y) section
Clock rising 50% todata ready rising 50%

tC_DR

Data ready (DRY) / DAT A, over rang e (OVR) section 2/

1/

Data valid to DRY

tsu(DR)9, 10, 11

01

1.5

ns

DRY to invalid datath(DR)

9, 10, 11

01

0.9

ns

Unless otherwise specified, sampling rate = 250 MSPS, 50 % clock duty cycle, AVDD = 5 V, DRVDD = 3.3 V,-1 dBFS differential input, and 3 VPP differential sinusoidal clock.

2/

Data is updated with clock falling edge or DRY rising edge.

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REVISION LEVELBSHEET 8FIGURE 1. Case outline X.

STANDARD
MICROCIRCUIT DRAWINGDLA LAND AND MARITIMECOLUMBUS, OHIO 43218-3990

DSCC FORM 2234
APR 97

SIZE

5962-07207

A

REVISION LEVELBSHEET 9Symbol

Dimen sions
InchesMillimeters

Min

Max

Min

Max

A1

---

0.091

---

2.31

A2

---

0.115

---

2.92

A3

0.002

0.014

0.05

0.36

A4

0.03 BSC

0.762 BSC

b

0.006

0.013

0.15

0.33

c

0.004

0.009

0.10

0.23

D1/E1

0.740

0.760

18.80

19.30

D2/E2
D3/E3

0.500 BSC
1.196

12.7 BSC

1.222

30.38

31.04

D4/E4

0.629 BSC

15.98 BSCe

0.025 BSC

0.64 BSC

F

0.175

0.225

4.45

5.72

J

0.030

0.040

0.76

1.02

K

---

0.020

---

0.51

K1

---

0.018

---

L
L1

0.46

2.025
1.980

51.44

2.024

N

50.29

51.41

84

NOTES:
1. Controlling dimensions are inches, millimeter dimensions are given for reference only.
2. Ceramic quad flatpack with flat leads brazed to non-conductive tie bar carrier.
3. This package is hermetically sealed with a metal lid.
4. The leads are gold plated and can be solder dipped.
5. All leads are not shown for clarity purposes.
6. Lid and heat sink are connected to GND leads.

FIGURE 1. Case outline X – continued.

STANDARD
MICROCIRCUIT DRAWINGDLA LAND AND MARITIMECOLUMBUS, OHIO 43218-3990

DSCC FORM 2234
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REVISION LEVELBSHEET 10

Device type

01

Case
outlineX

Terminal
numberTerminal
symbolTerminal
numberTerminal
symbolTerminal
numberTerminal
symbolTerminal
numberTerminal
symbol

1

GND

22

GND

43

GND

64

GND

2

DVDD

23

AVDD

44

OVR

65

D5

3

GND

24

GND

45

OVR

66

D5

4

AVDD

25

AVDD

46

NC

67

D6

5

NC

26

GND

47

NC

68

D6

6

NC

27

AVDD

48

NC

69

GND

7

VREF

28

GND

49

NC

70

DVDD

8

GND

29

AVDD

50

NC

71

D7

9

AVDD

30

GND

51

NC

72

D7

10

GND

31

NC

52

D0

73

D8

11

CLK

32

GND

53

D0

74

D8

12

CLK

33

AVDD

54

DVDD

75

D9

13

GND

34

GND

55

GND

76

D9

14

AVDD

35

NC

56

D1

77

D10

15

AVDD

36

GND

57

D1

78

D10

16

GND

37

AVDD

58

D2

79

D11

17

AIN

38

GND

59

D2

80

D11

18

AIN

39

AVDD

60

D3

81

D12

19

GND

40

GND

61

D3

82

D12

20

AVDD

41

AVDD

62

D4

83

DRY

21

GND

42

GND

63

D4

84

DRY

FIGURE 2. Terminal connections.

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REVISION LEVELBSHEET 11

Terminal symbol

Description

AVDD

Analog power supply

DVDD

Output driver power supply

GND

GroundVREF

Reference voltage

CLK

Differential input clock (positive). Conversion Initiated on
rising edge

CLK

Differential input clock (negative)

AIN

Differential input signal (positive)

AIN

Differential input signal (negative)

OVR, OVR
D0, D0Over range indicator LVDS output. A logic high signals ananalog input in excess of the full-scale range.
LVDS digital output pair, least significant bit (LSB)

D1-D4, D1 - D4

LVDS digital output pairs

D5-D6, D5 - D6

LVDS digital output pairs

D7-D11, D7 - D11

LVDS digital output pairs

D12, D12

LVDS digital output pair, most significant bit (MSB)

DRY, DRY

Data ready LVDS output pairNC

No connect

FIGURE 2. Terminal connections – continued.

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REVISION LEVELBSHEET 12

FIGURE 3. Block diagram.

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REVISION LEVELBSHEET 13

FIGURE 4. Timing waveforms.

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REVISION LEVELBSHEET 14

3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). The certificate of compliancesubmitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the
manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 in
MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
4. VERIFICATION
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shallnot affect the form, fit, or function as described herein.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on
all devices prior to qualification and technology conformance inspection.
4.2.1 Additional criteria for device classes Q and V.
a.

The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device
manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document
revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 andshall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs,
biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883.

b.

Interim and final electrical test parameters shall be as specified in table IIA herein.

c.

Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535,
appendix B.

4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be inaccordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A,
B, C, D, and E inspections (see 4.4.1 through 4.4.4).
4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with
MIL-PRF-38535 including groups A, B, C, D, and E inspections, and as specified herein.
4.4.1 Group A inspection.
a.

Tests shall be as specified in table IIA herein.

b.

Subgroups 7 and 8 in table I, method 5005 of MIL-STD-883 shall be omitted.

4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein.
4.4.2.1 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, orapproved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The test circuit
shall be maintained under document revision level control by the device manufacturer's TRB in accordance with MIL-PRF-38535 andshall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases,
and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883.
4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein.

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REVISION LEVELBSHEET 15

TABLE IIA. Electrical test requirements.
Test requirements

Interim electricalparameters (see 4.2)
Final electricalparameters (see 4.2)
Group A test
requirements (see 4.4)
Group C end-point electricalparameters (see 4.4)
Group D end-point electricalparameters (see 4.4)
Group E end-point electricalparameters (see 4.4)

Subgroups(in accordance with
MIL-PRF-38535, table III)
DeviceDeviceclass Q
class V
1, 9

1, 9

1, 2, 3, 4, 1/
5, 6, 9, 10, 11
1, 2, 3, 4, 5, 6,
9, 10, 11

1, 2, 3, 4, 1/, 2/5, 6, 9, 10, 11
1, 2, 3, 4, 5, 6,
9,10,11

1, 4

1, 4 2/

1, 4

1, 4
---

---

1/ PDA applies to subgroup 1.
2/ Delta limits as specified in table IIB shall be required where specified,
and the delta limits shall be computed with reference to the zero hourelectrical parameters.
TABLE IIB. Burn-in and operating life test. Delta parameters (+25°C).
Parameters 1/

Delta limits

VREF, Reference voltage±10 mVIDRVDD, Output buffer supply
current±2 mA

1/ These parameters shall be recorded before and after the required
burn-in and life test to determine delta limits.
4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see
3.5 herein).
a.

End-point electrical parameters shall be as specified in table IIA herein.

b.

For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified
in MIL-PRF-38535 for the RHA level being tested. All device classes must meet the postirradiation end-point electricalparameter limits as defined in table I at TA = +25°C ±5°C, after exposure, to the subgroups specified in table IIA herein.

5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q
and V.

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REVISION LEVELBSHEET 16

6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original
equipment), design applications, and logistics purposes.
6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor preparedspecification or drawing.
6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for theindividual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal, or emailcommunication.
6.3 Record of users. Military and industrial users should inform DLA Land and Maritime when a system application requires
configuration control and which SMD's are applicable to that system. DLA Land and Maritime will maintain a record of users and thislist will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices(FSC 5962) should contact DLA Land and Maritime-VA, telephone (614) 692-8108.
6.4 Comments. Comments on this drawing should be directed to DLA Land and Maritime-VA, Columbus, Ohio 43218-3990, or
telephone (614) 692-0591.
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-38535 and MIL-HDBK-1331.
6.6 Sources of supply.
6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in MIL-HDBK-103
and QML-38535. The vendors listed in MIL-HDBK-103 and QML-38535 have submitted a certificate of compliance (see 3.6 herein)
to DLA Land and Maritime-VA and have agreed to this drawing.

STANDARD
MICROCIRCUIT DRAWINGDLA LAND AND MARITIMECOLUMBUS, OHIO 43218-3990

DSCC FORM 2234
APR 97

SIZE

5962-07207

A

REVISION LEVELBSHEET 17

STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 22-09-07
Approved sources of supply for SMD 5962-07207 are listed below for immediate acquisition information only andshall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will berevised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and acertificate of compliance has been submitted to and accepted by DLA Land and Maritime-VA. This information
bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DLA Land and Maritime
maintains an online database of all current sources of supply at https://landandmaritimeapps.dla.mil/programs/smcr/.

Standard
microcircuit drawing
PIN 1/

VendorCAGE
numberVendorsimilar
PIN 2/

5962-0720701VXC

01295

ADS5444MHFG-V

1/ The lead finish shown for each PIN representing
a hermetic package is the most readily available
from the manufacturer listed for that part. If thedesired lead finish is not listed contact the vendor
to determine its availability.
2/ Caution. Do not use this number for item
acquisition. Items acquired to this number may notsatisfy the performance requirements of this drawing.

Vendor CAGE
number01295

Vendor nameand address
Texas Instruments, Inc.
Semiconductor Group
8505 Forest Ln.
PO Box 660199
Dallas, TX 75243

The information contained herein is disseminated for convenience only and theGovernment assumes no liability whatsoever for any inaccuracies in theinformation bulletin.