CM9V-T1A
Product Documentation

ProductDocumentation
CM9V-T1AQuartz Crystal Unit
32.768 kHz

July 2022

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Product Documentation

CM9V-T1A

2. Product Description
The CM9V-T1A is a low frequency SMD Quartz Crystal Unit that incorporates a tuning fork Quartz Crystal Resonator.
The Quartz Crystal Resonator operates under vacuum condition in a hermetically sealed ceramic package with metallid.
Suitable oscillator-circuitries can operate the CM9V-T1A Quartz Crystal Units in fundamental mode consuming verylow power. For technical assistance for optimizing oscillator-circuitries please contact Micro Crystal undersales@microcrystal.com

2.1. Application Examples
IoT
MeteringIndustrial
Automotive
Health Care
Wearables, Portables

2.2. Ordering Information
Example:CodeTA (Standard)
TBTC
Code
QC (Standard)
QA

July 2022

CM9V-T1A

32.768 kHz

CL: 12.5 pF-20/+20ppm

TA

QC

Operating temperature range-40 to +85°C-40 to +125°C-55 to +125°C
Qualification
Commercial Grade
Automotive Grade AEC-Q200

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3. Electrical Characteristics
3.1. Equivalent Electrical Model
The Quartz Crystal Unit is a passive component with no polarity. The equivalent circuit of the quartz
crystal at its fundamental resonance frequency is represented by the Equivalent Electrical Model:
Electrical Symbol:

Equivalent Electrical Model:
L1

C1

R1C0

L1
C1
R1

Motional Inductance
Motional Capacitance
Motional Resistance (ESR)

C0

Static Capacitance (Shunt capacitance)

3.2. Frequency vs Temperature Characteristics

20T0 = 25°C (± 5°C)
0-20

f/f [ppm]-40-60-80-0.035 * (T-T0)2 ppm (±10%)-100-120-140-160-180-50July 2022-40-30-20-10010203040
Temperature [°C]

3/125060708090

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4. Mechanical Properties
4.1. Package Dimension

1,60,470,47TYP.

TYP.

0,07 REF.

max.0,50

1,00,07 REF.

Dimensions:
Tolerances:
Drawing:

July 2022

4/12in mm
unless otherwise specified ± 0.1 mm
CM9V-T1A_Pack-drw_20180406

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CM9V-T1A

4.2. Recommended Solderpad Layout

0,60,6

Dimensions:in mm

1,20,64.3. Product Marking

Product Marking:Laser Marking

M637A1M
Micro Crystal

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CM9V-T1A

5. Material Composition Declaration & Environmental Information
5.1. Homogenous Material Composition Declaration
Homogenous material information according to IPC-1752 standard
Material Composition CM9V-T1A:
452
13
67(Symbolic drawing)
No.

Item
Component
Name

Sub ItemMaterial
Name

Material
Weight(mg)(%)

12Resonator
Electrodes

Quartz Crystal
Cr+Au

0.1234Housing
Metal Lid

Ceramic
Kovar Lid1.26

0.005

100%
3%
97%
100%
90%

Substance
Element
SiO2CrAu
Al2O3
Fe53Ni29Co18

0.74
Ni-plating
Au-plating

5

Seal

Solder Preform

6

Terminations

Internal and externalterminals

7

Resonator
attachGold bumps

Unit weight

July 2022

0.15
0.20
0.009

9%
1%
80%
20%
80%
15%
5%

Ni
Au

100%

Au

Au80 / Sn20
Mo
Ni
Au, 0.5 micron

CAS
Number

Fe:
Ni:
Co:
Ni:
Au:
Au:
Sn:
Mo:
Ni:
Au:

14808-60-7
7440-47-3
7440-57-5
1344-28-1
7439-89-6
7440-02-0
7440-48-4
7440-02-0
7440-57-5
7440-57-5
7440-31-5
7439-98-7
7440-02-0
7440-57-5

CommentMetal Lid (Kovar)
Nickel platingGold plating
Premelted on
Metal Lid
Molybdenum
Nickel platingGold plating

7440-57-5

2.48

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5.2. Material Analysis & Test Results

Hg

Cr(VI)

PBB

PBDE

FCI

Br

I

BBP

DBP

DEHP

DIBP

Phthalates

CdHalogens

Pb

Homogenous material information according to IPC-1752 standard
No.
Item
Sub Item
RoHS
Component
MaterialNameName1Resonator

Quartz Crystalndndndndndndndndndndndndndnd2Electrodes

Cr+Aundndndndndndndndndndndndndnd3

Housing

Ceramicndndndndndndnd

ndndndndndnd

nd4

Metal Lid

Kovar Lid & Platingndndndndndndndndndndndnd

nd

nd

5

Seal

Solder Preformnd

ndnd

ndndndndndndndnd

nd

nd

nd

6

Terminations

Int. & ext. terminals

ndndndndndndndndnd

ndnd

ndnd

nd

7

Resonator
attachGold bumps

ndndndndndndndnd

ndndndndndnd

MDL [ppm]

Method Detection Limit2

855050nd (not detected) = below “Method Detection Limit” (MDL)
Test methods:
RoHS Pb, Cd Hg
 Cr(VI) PBB / PBDE
Halogens
Phthalates

Test method with reference to:
IEC 62321-5:2013
IEC 62321-4:2013 + AMD1:2017
IEC 62321-7-2:2017
IEC 62321-6:2015
Test method with reference to BS EN 14582:2016
Test method with reference to IEC 62321-8:2017

MDL:
MDL:
MDL:
MDL:
MDL:
MDL:

2 ppm
2 ppm
8 ppm
5 ppm
50 ppm50 ppm

5.3. Recycling Material Information
Recycling material information according to IPC-1752 standard.
Element weight is accumulated and referenced to the unit weight of 2.48 mg.
Item
No.
Item
Material
Substance
Material
Component
WeightElementName
Name(mg)(%)
Quartz Crystal
Chromium
CeramicGold

Tin
Nickel
Molybdenum
Kovar

1232456754664

Resonator
Electrodes
Housing
Electrodes
Metal Lid
Seal
Terminations
Resonator attach
Seal
Metal Lid (Plating)Terminations
Terminations
Metal Lid

Unit weight (total)

July 2022

CAS
Number0.12
0.00015
1.26

4.83
0.006
50.72

SiO2
Cr
Al2O3

14808-60-7
7440-47-3
1344-28-1

0.15

6.09

Au

7440-57-5

0.03

1.21

Sn

Sn:

7440-31-5

0.0973.89

Ni

Ni:

7440-02-0

0.16

6.44

Mo

0.67

26.81

Fe53Ni29Co18

Mo:
Fe:
Ni:
Co:

7439-98-7
7439-89-6
7440-02-0
7440-48-4

2.48

100

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5.4. Environmental Properties & Absolute Maximum Ratings
Package
Ceramic Package
Parameter
Product weight (total)
Storage temperature
Moisture sensitivity level (MSL)FIT / MTBF

Description
Hermetic ceramic-package, no-leads
DirectiveConditions
Store as bare product

IPC/JEDEC J-STD-020D

Value
2.48 mg-55 to +125°C
MSL 1
available on request

Terminal finish:

NickelGold

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0.5 µmMolybdenum

3 µm

Ceramic

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CM9V-T1A

6. Application Information
6.1. Soldering Information
Maximum Reflow Conditions in accordance with IPC/JEDEC J-STD-020C “Pb-free”

tP

TP

Critical Zone
TL to TP

TemperatureRamp-upTL

tLTsmax

Tsmin
Ramp-downtsPreheat25t 25°C to Peak

Temperature Profile
Average ramp-up rate
Ramp down Rate
Time 25°C to Peak Temperature
PreheatTemperature min
Temperature max
Time Tsmin to Tsmax
Soldering above liquidus
Temperature liquidus
Time above liquidus
Peak temperature
Peak Temperature
Time within 5°C of peak temperature

July 2022

TimeSymbol(Tsmax to TP)
Tcool
Tto-peakCondition
3°C / second max
6°C / second max
8 minutes max

Unit°C / s°C / smin

Tsmin
Tsmax
ts

150
200
60 – 180°C°C
sec

TL
tL

217
60 – 150°C
sec

Tp
tp

260
20 – 40°C
sec

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6.2. Handling Instructions for Quartz Crystal Units
The built-in tuning-fork crystal consists of pure Silicon Dioxide in crystalline form. The cavity inside the package isevacuated and hermetically sealed in order for the crystal blank to function undisturbed from air molecules, humidity
and other influences.

Shock and vibration:
Keep the crystal / module from being exposed to excessive mechanical shock and vibration. Micro Crystal
guarantees that the crystal / module will bear a mechanical shock of 5000 g / 0.3 ms.
The following special situations may generate either shock or vibration:
Multiple PCB panels - Usually at the end of the pick & place process the single PCBs are cut out with a router.
These machines sometimes generate vibrations on the PCB that have a fundamental or harmonic frequency close
to 32.768 kHz. This might cause breakage of crystal blanks due to resonance. Router speed should be adjusted
to avoid resonant vibration.
Ultrasonic cleaning - Avoid cleaning processes using ultrasonic energy. These processes can damage thecrystals due to the mechanical resonance frequencies of the crystal blank.

Overheating, rework high temperature exposure:
Avoid overheating the package. The package is sealed with a seal ring consisting of 80% Gold and 20% Tin. The
eutectic melting temperature of this alloy is at 280°C. Heating the seal ring up to >280°C will cause melting of themetal seal which then, due to the vacuum, is sucked into the cavity forming an air duct. This happens when using
hot-air-gun set at temperatures >280°C.
Use the following methods for rework:
July 2022

Use a hot-air-gun set at 270°C.
Use 2 temperature controlled soldering irons, set at 270°C, with special-tips to contact all solder-joints fromboth sides of the package at the same time, remove part with tweezers when pad solder is liquid.

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7. Packing & Shipping Information
Reel: 7” = 178 mm
Ø 13min. 8.4

max. 133,5 ±0,05

2 ±0,05

0,31 ±0,05
0,25 ±0,02+0,3

8 -0,1

1,75 ±0,05

4 ±0,1

1,75 ±0,1Carrier Tape:
Material: Polycarbonate
Width: 8 mm
Tape Leader and Trailer: Minimum length 300 mm

4 ±0,1

1,35 ±0,050,06

0,63 ±0,05

Cover Tape

Direction of feedAll dimensions are in mm
CM9V-T1A_Tape-drw_20211223

Pressure Seal Cover Tape:
Polypropylene (PP)
3M™ Universal Cover Tape (UCT)
Synthetic polymer adhesive, pressure sensitive

Heat Seal Cover Tape:
Polyethylene Terephthalate (PET)
Synthetic polymer adhesive, heat activatedPeel Method: Medial section removal,
both lateral stripes remain on carrier

Peel Method: Removal of the entire cover tape

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CM9V-T1A

8. Compliance Information
Micro Crystal confirms that the standard product Quartz Crystal Unit CM9V-T1A is compliant with “EU RoHS
Directive” and “EU REACh Directives”.
Please find the actual Certificate of Conformance for Environmental Regulations on our website:
CoC_Environment_CC&CM-Series.pdf

9. Document Revision History
DateRevision #Revision Details

February 2017

1.0

April 2018

1.1

December 2021

1.2

July 2022

1.3

First release
Updated package drawing, 4.1.
Corrected recycling material weights, 5.3.
Updated carrier tape drawing, 7.
Changed term "SMT" to "SMD", 2.
Added "Dimensions: in mm", 4.1. and 4.2.
Adapted limit values and methods in accordance with the latest standards, 5.2.
Corrected text to "hot-air-gun set at temperatures >280°C.", 6.2.
Replaced Tape drawing with new version, 7.
Added specification for Heat Seal Cover Tape, 7.
Updated CoC Hyperlink, 8.
Added new disclaimer
Added automotive qualification, 2.1. and 2.2.

The information contained in this document is believed to be accurate and reliable. However, Micro Crystal
assumes no responsibility for any consequences resulting from the use of such information nor for any
infringement of patents or other rights of third parties, which may result from its use. In accordance with ourpolicy of continuous development and improvement, Micro Crystal reserves the right to modify
specifications mentioned in this publication without prior notice and as deemed necessary.
Any use of Products for the manufacture of arms is prohibited. Customer shall impose that same obligation
upon all third-party purchasers.
Without the express written approval of Micro Crystal, Products are not authorized for use as components
in safety and life supporting systems as well as in any implantable medical devices. The unauthorized useof Products in such systems / applications / equipment is solely at the risk of the customer and suchcustomer agrees to defend and hold Micro Crystal harmless from and against any and all claims, suits,
damages, cost, and expenses resulting from any unauthorized use of Products.
No licenses to patents or other intellectual property rights of Micro Crystal are granted in connection withthe sale of Micro Crystal products, neither expressly nor implicitly. In respect of the intended use of Micro
Crystal products by customer, customer is solely responsible for observing existing patents and otherintellectual property rights of third parties and for obtaining, as the case may be, the necessary licenses.

Micro Crystal AG
Muehlestrasse 14
CH-2540 Grenchen
Switzerland
July 2022

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Phone +41 32 655 82 82
sales@microcrystal.com
www.microcrystal.com

Rev. 1.3