PR20231018_01_207

Press Release

Socionext Announces Collaboration with Arm and TSMC on 2nm MultiCore Leading CPU Chiplet Development
Next-Generation Compute Chiplet-based Proof-of-Concept Leverages Arm Neoverse
CSS Technology and TSMC Silicon Process Along with Advanced Packaging Technology[Yokohama, Japan October 18, 2023] --- Socionext today announced a collaboration with Arm and TSMC for
the development of an innovative power-optimized 32-core CPU chiplet in TSMCʼs 2nm silicon technology,
delivering scalable performance for hyperscale data center server, 5/6G infrastructure, DPU and edge-ofnetwork markets.
This advanced CPU chiplet proof-of-concept using Arm® Neoverse™ CSS technology is designed for single ormultiple instantiations within a single package, along with IO and application-specific custom chiplets to optimize
performance for a variety of end applications.
Leveraging CPU chiplets, and customized application-specific chiplets, multiple target applications can besupported. When new chiplets become available, a cost-effective package level upgrade path can be supported.
“Socionext is a leading provider of custom SoCs for global hyperscale data center, automotive and networking
customers. Driven by commercial and time-to-market benefits, there is a growing customer demand for granular
compute power. Leveraging silicon re-use to create multiple product platforms enables innovative systemarchitectures. With leading silicon node enablement and our partnership with Arm, we are designing anddelivering highly integrated large scale silicon solutions to global customers,” said Hisato Yoshida, Corporate
Executive Vice President and the Head of Global Development Group at Socionext. “This chiplet complements
our customersʼ current SoC designs and provides system architects new degrees of freedom to deliver many
platform variants for a product family.”“Arm Neoverse CSS is unlocking greater accessibility to custom silicon and driving innovation across the chipletecosystem,” said Mohamed Awad, senior vice president and general manager, Infrastructure Line of Business,
Arm. “The advanced chiplet proof-of-concept from Socionext is demonstrating what is possible through Arm
Total Design and will accelerate the path to custom, workload-optimized solutions for our broader ecosystem.”Harnessing the power of the ecosystem in the era of custom silicon on Arm
https://www.arm.com/company/news/2023/10/arm-total-design-ecosystem“TSMC is pleased to support Socionext and Armʼs flexible chiplet design with the outstanding performance, form
factor and energy efficiency offered by our 2nm technology, as well as our comprehensive ecosystem toaccelerate time-to-market of customer product innovations,” said Dr. Cliff Hou, Senior Vice President ofCorporate Research/Research and Development at TSMC. “We have worked with Socionext across many
generations of our leading-edge technology, and look forward to extending this collaboration into the 2nmgeneration.”

Press Inquiry:
Socionext Inc. https://www.socionext.com/en/contact/
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About Socionext Inc.
Socionext Inc. is a global SoC (System-on-Chip) supplier and a pioneer of a unique “Solution SoC” business modelthrough decades of industry experience and expertise. Socionext contributes to global innovation in advanced
technologies including automotive, data center, networking, and smart devices. As a trusted silicon partner, Socionext
delivers superior features, performance, and quality that differentiate its customers’ products and services from theircompetition.
Socionext Inc. is headquartered in Yokohama, and has offices in Japan, Asia, United States and Europe to lead its
development and sales activities. For more information, visit https://www.socionext.com/en/.

About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the worldʼs leading
dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers andpartners with the industryʼs leading process technologies and portfolio of design enablement solutions to unleash
innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America,TSMC serves as a committed corporate citizen around the world.
TSMC deployed 288 distinct process technologies and manufactured 12,698 products for 532 customers in 2022 byproviding broadest range of advanced, specialty, and advanced packaging technology services. The Company isheadquartered in Hsinchu, Taiwan. For more information, please visit https://www.tsmc.com.

All company or product names mentioned herein are trademarks or registered trademarks of their respective owners.
Information provided in this press release is accurate at time of publication and is subject to change without advance notice.

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