CM8V-T1A 0.3
Product Documentation

ProductDocumentation
CM8V-T1A 0.3Quartz Crystal Unit
32.768 kHz

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Product Documentation

CM8V-T1A 0.3

2. Product Description
The CM8V-T1A 0.3 is a low frequency SMT Quartz Crystal Unit that incorporates a tuning fork Quartz Crystal
Resonator. The Quartz Crystal Resonator operates under vacuum condition in a hermetically sealed ceramic
package with metal lid.
Suitable oscillator-circuitries can operate the CM8V-T1A 0.3 Quartz Crystal Units in fundamental mode consumingvery low power. For technical assistance for optimizing oscillator-circuitries please contact Micro Crystal undersales@microcrystal.com

2.1. Application Examples
IoTIndustrial
Health Care
Smart Cards
Ultra Thin Devices
Wearables, Portables

2.2. Ordering Information
Example:CodeCM8V-T1A 0.3

32.768 kHz

CL: 12.5 pF-40 to +85°C

TB-40 to +125°C

TC-55 to +125°C

QC (Standard)

October 2017

TAQC

Operating temperature range

TA (Standard)

Code-20/+20ppm

Qualification
Commercial Grade2/12

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Product Documentation

CM8V-T1A 0.3

3. Electrical Characteristics
3.1. Equivalent Electrical Model
The Quartz Crystal Unit is a passive component with no polarity. The equivalent circuit of the quartz
crystal at its fundamental resonance frequency is represented by the Equivalent Electrical Model:
Electrical Symbol:

Equivalent Electrical Model:
L1

C1

R1

C0

L1
C1
R1

Motional Inductance
Motional Capacitance
Motional Resistance (ESR)

C0

Static Capacitance (Shunt capacitance)

3.2. Frequency vs Temperature Characteristics

20
T0 = 25°C (± 5°C)
0-20

∆f/f [ppm]-40-60-80-0.035 * (T-T0)2 ppm (±10%)-100-120-140-160-180-50-40-30-20-100102030405060708090

Temperature [°C]

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4. Mechanical Properties
4.1. Package Dimension

2,00,530,53TYP.

TYP.

0,08 REF.

max.0,35

1,20,08 REF.

Tolerances:
Drawing:

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unless otherwise specified ± 0.1mm
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Product Documentation

CM8V-T1A 0.3

4.2. Recommended Solderpad Layout

0,70,81,50,84.3. Product Marking

Product Marking:Laser Marking

M737A1M
Micro Crystal

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Product Documentation

CM8V-T1A 0.3

5. Material Composition Declaration & Environmental Information
5.1. Homogenous Material Composition Declaration
Homogenous material information according to IPC-1752 standard
Material Composition CM8V-T1A 0.3:452
1367(Symbolic drawing)
No.

Item
Component
Name

Sub ItemMaterial
Name

MaterialWeight(mg)(%)

12Resonator
Electrodes

Quartz Crystal
Cr+Au

0.16

34HousingMetal Lid

Ceramic
Kovar Lid

1.66

0.006

100%3%97%100%90%

Substance
Element
SiO2
Cr
Au
Al2O3
Fe53Ni29Co18

1.05
Ni-plating
Au-plating

5

Seal

Solder Preform

6

Terminations

Internal and externalterminals

0.32Gold bumps

0.007

Unit weight

3.38

7

Resonator
attachOctober 2017

0.18

9%
1%
80%
20%
80%
15%5%

Ni
Au

100%

Au

6/12

Au80 / Sn20
Mo
Ni
Au, 0.5 micron

CAS
Number

Fe:
Ni:
Co:
Ni:
Au:
Au:
Sn:
Mo:
Ni:
Au:

14808-60-7
7440-47-3
7440-57-5
1344-28-1
7439-89-6
7440-02-0
7440-48-4
7440-02-0
7440-57-5
7440-57-5
7440-31-5
7439-98-7
7440-02-0
7440-57-5

Comment

Metal Lid (Kovar)
Nickel platingGold plating
Premelted on
Metal LidMolybdenum
Nickel platingGold plating

7440-57-5

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CM8V-T1A 0.3

5.2. Material Analysis & Test Results
Homogenous material information according to IPC-1752 standard
No.
Item
Sub Item
RoHS
Component
Material
Name
NameCdHg

Cr+6

PBB

PBDE

FCI

BrI

BBP

DBP

DEHP

DINP

Phthalates

PbHalogen

1Resonator

Quartz Crystalndndndndndndndndndndndndnd

nd2

Electrodes

Cr+Aundndndndndndndndndndndndndnd3

Housing

Ceramicndndndndndndndnd

ndndnd

nd

nd

nd

4

Metal Lid

Kovar Lid & Plating

ndndndndndndndndnd

nd

nd

nd

nd

nd

5

Seal

Solder Preformnd

ndnd

nd

nd

nd

nd

nd

ndnd

nd

nd

nd

nd

6

Terminations

Int. & ext. terminals

ndndndndndndndndnd

nd

nd

nd

nd

nd

7

Resonator
attachGold bumps

ndnd

ndnd

nd

nd

ndndndndndndnd

nd

MDL

Measurement Detection
Limit

2 ppm

5 ppm

50 ppm

0.003%ndTest methods:
RoHS
Test method with reference to IEC 62321-5: 2013
Halogen
Test method with reference to BS EN 14582:2007
Phthalates
Test method with reference to EN 14372

MDL:
MDL:
MDL:

0.01%

= not detectable2 ppm (PBB / PBDE: 5 ppm)
50 ppm
0.003 % (DINP 0.01%)

5.3. Recycling Material Information
Recycling material information according to IPC-1752 standard.
Element weight is accumulated and referenced to the unit weight of 3.38 mg.
Item
No.
Item
Material
Substance
Material
Component
WeightElementName
Name(mg)(%)
Quartz Crystal
ChromiumCeramicGold

Tin
Nickel
Molybdenum
Kovar

1232
45675466

Resonator
Electrodes
Housing
Electrodes
Metal Lid
Seal
Terminations
Resonator attach
Seal
Metal Lid (Plating)Terminations
Terminations

0.16
0.0002
1.66

4.65
0.01
49.11

SiO2
Cr
Al2O3

14808-60-7
7440-47-3
1344-28-1

0.18

5.42

Au

7440-57-5

0.04

1.06

Sn

Sn:

7440-31-5

0.14

4.22

Ni

Ni:

7440-02-0

0.25

7.57

Mo4

Metal Lid

0.95

27.96

Fe53Ni29Co18

Mo:
Fe:
Ni:
Co:

7439-98-7
7439-89-6
7440-02-0
7440-48-4

3.38

100Unit weight (total)

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CASNumber

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Comment

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Product Documentation

CM8V-T1A 0.3

5.4. Environmental Properties & Absolute Maximum Ratings
Package
Ceramic Package
Parameter
Product weight (total)
Storage temperature
Moisture sensitivity level (MSL)FIT / MTBF

Description
Hermetic ceramic-package, no-leads
DirectiveConditions

Value
3.38 mg-55 to +125°C
MSL 1
available on request

Store as bare product
IPC/JEDEC J-STD-020D

Terminal finish:

Molybdenum

3 µm

0.5 µmCeramicNickel
Gold

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CM8V-T1A 0.3

6. Application Information
6.1. Soldering Information
Maximum Reflow Conditions in accordance with IPC/JEDEC J-STD-020C “Pb-free”

tPTP

Critical Zone
TL to TP

TemperatureRamp-upTL

tLTsmax

Tsmin
Ramp-downtsPreheat25

t 25°C to Peak

Temperature Profile
Average ramp-up rate
Ramp down Rate
Time 25°C to Peak Temperature
PreheatTemperature min
Temperature max
Time Tsmin to Tsmax
Soldering above liquidus
Temperature liquidus
Time above liquidus
Peak temperature
Peak Temperature
Time within 5°C of peak temperature

October 2017

TimeSymbol(Tsmax to TP)
Tcool
Tto-peakCondition
3°C / second max
6°C / second max
8 minutes max

Unit°C / s°C / sminTsmin
Tsmax
ts

150
200
60 – 180°C°C
sec

TL
tL

217
60 – 150°C
sec

Tp
tp

260
20 – 40°C
sec

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6.2. Handling Instructions for Quartz Crystal Units
The built-in tuning-fork crystal consists of pure Silicon Dioxide in crystalline form. The cavity inside the package isevacuated and hermetically sealed in order for the crystal blank to function undisturbed from air molecules,
humidity and other influences.

Shock and vibration:
Keep the crystal / module from being exposed to excessive mechanical shock and vibration. Micro Crystal
guarantees that the crystal / module will bear a mechanical shock of 5000 g / 0.3 ms.
The following special situations may generate either shock or vibration:
Multiple PCB panels - Usually at the end of the pick & place process the single PCBs are cut out with a router.
These machines sometimes generate vibrations on the PCB that have a fundamental or harmonic frequency
close to 32.768 kHz. This might cause breakage of crystal blanks due to resonance. Router speed should be
adjusted to avoid resonant vibration.
Ultrasonic cleaning - Avoid cleaning processes using ultrasonic energy. These processes can damages
crystals due to mechanical resonance of the crystal blank.

Overheating, rework high temperature exposure:
Avoid overheating the package. The package is sealed with a seal ring consisting of 80% Gold and 20% Tin. The
eutectic melting temperature of this alloy is at 280°C. Heating the seal ring up to >280°C will cause melting of themetal seal which then, due to the vacuum, is sucked into the cavity forming an air duct. This happens when using
hot-air-gun set at temperatures >300°C.
Use the following methods for rework:Use a hot-air- gun set at 270°C.
Use 2 temperature controlled soldering irons, set at 270°C, with special-tips to contact all solder-joints fromboth sides of the package at the same time,

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Product DocumentationCM8V-T1A 0.3

7. Packing & Shipping Information
Reel: 7” = 178 mm

Ø 13Ø 61,5min. 8.4

60°
60°

1,8Ø 178

Product La
32,7bel68kHzmax. 13

0,311 ±0,05
0,25 ±0,02+0,3

8 -0,1

1,75 ±0,1

3,5 ±0,05

0,1

Ø1,5 +

2 ±0,05

Ø0,6 ±

2,25 ±0,05

4 ±0,10,05

Carrier Tape:
Material: Polycarbonate, conductive
Width: 8 mm
Tape Leader and Trailer: Minimum length 300 mm

1,43 ±0,05

4 ±0,10,061

0,54 ±0,05

Cover Tape

Direction of feed

All dimensions are in mm
CM8V-T1A_03_Tape-drw_20161219

Cover Tape:
Tape: Polypropylene, 3M™ Universal Cover Tape (UCT)
Adhesive Type: Pressure sensitive, Synthetic Polymer
Thickness: 0.061 mm
Peel Method:Medial section removal, both lateral stripes remain on carrier

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CM8V-T1A 0.3

8. Compliance Information
Micro Crystal confirms that the standard product Quartz Crystal Unit CM8V-T1A 0.3 is compliant with “EU RoHS
Directive” and “EU REACh Directives”.
Please find the actual Certificate of Conformance for Environmental Regulations on our website:
CoC_Environment_CC&CM-Series.pdf

9. Document Revision History
Date

Revision #Revision Details

October 2017

1.0

First release

Information furnished is believed to be accurate and reliable. However, Micro Crystal assumes noresponsibility for the consequences of use of such information nor for any infringement of patents or otherrights of third parties which may result from its use . In accordance with our policy of continuous
development and improvement, Micro Crystal reserves the right to modify specifications mentioned in thispublication without prior notice. This product is not authorized for use as critical component in life support
devices or systems.

Micro Crystal AG
Muehlestrasse 14
CH-2540 Grenchen
Switzerland
October 201712/12

Phone +41 32 655 82 82
Fax+41 32 655 82 83
sales@microcrystal.com
www.microcrystal.com
Rev. 1.0