Product Information

Control No. : ARP-4271800-J 1
Issued on April 5, 2023

1. Type No.

RoHS Compliant Part

HMD2718A-30M0850
2. Dimension (Unit : mm)

jkl
m

6.35 +/ -0.25(Top view)jkG

5.08 +/- 0.25

m

l

G

(Side view)

Terminal Dimensions

GG

2.08 +/- 0.42

jiG

(Bottom view)hgfa bTerminal
Input
DirectDirect
Input
Isolation Coupled
Coupled Isolation
GNDGND

1.02 +/- 0.10
0.51 +/- 0.20
3.30 +/- 0.20
0.51 +/- 0.20
1.02 +/- 0.10
1.02 +/- 0.10
0.51 +/- 0.20
2.08 +/- 0.20
0.51 +/- 0.20
1.02 +/- 0.10

abcdefghijd ec

3. Electrical characteristics
Parameter
Frequency Range
Nominal impedance
Mean Coupling
Insertion Loss
VSWR
Directivity
Frequency Sensitivity
Group Delay
Terminal 1-2
Group Delay
Terminal 1-4

Band1Band2
Band3
Band4
Band5
700-800
869-894925-960
600-700
Specification 800-1000
5050505050
Specification
Specification 30.2 +/- 1.5 30.4 +/- 1.5 30.0 +/- 1.5 30.0 +/- 1.5 31.5 +/- 1.5
30.49
30.83
30.41
30.40
31.48
Typicalmax 0.10max 0.075
max 0.075
max 0.10
Specification max 0.10
0.056
0.046
0.049
0.056
0.044
TypicalSpecification max 1: 1.15 max 1: 1.22 max 1: 1.12 max 1: 1.12 max 1: 1.22
1.07
1.06
1.07
1.07
1.06
Typicalmin 20min 20min 20min 20min 20Specification
27.33
26.90
27.86
28.26
27.22
TypicalSpecification max +/- 0.40 max +/- 0.40 max +/- 0.10 max +/- 0.10 max +/- 0.80
0.10
0.25
0.01
0.01
0.40
TypicalSpecification 0.11 +/- 0.04 0.11 +/- 0.04 0.11 +/- 0.04 0.11 +/- 0.04 0.11 +/- 0.04
0.087 - 0.098 0.088 - 0.094 0.095 - 0.098 0.089 - 0.094 0.088 - 0.095
TypicalSpecification 0.23 +/- 0.04 0.23 +/- 0.04 0.23 +/- 0.04 0.23 +/- 0.04 0.20 +/- 0.04
0.215 - 0.225 0.211 - 0.217 0.215 - 0.218 0.218 - 0.225 0.192 - 0.212
TypicalUnit
MHzohm
dB
dB
dB
dB
nsns

4. Note
4.1 Operating Temperature Range
4.2 Storage Temperature Range
4.3 Max Input Power
4.4 Standard Reel Quantity: -55 to +105 degC.
: -20 to +35 degC. (In a Taping Package): 225 W Avg/CW (600-1000MHz, -55 to +105 degC.): 1,000 pcs (per reel, per bag)Approved by

Confirmed by

Raised by

Y. ImaiS.Suzuki

M.Kawano

SOSHIN ELECTRIC CO., LTD

Control No. : ARP-4271800-J 2

Product Information

Issued on April 5, 2023
Measured Data

5.Representative characteristics
Frequency vs. Insertion Loss

Frequency vs. Coupling

Insertion Loss (dB)

0.00

Coupling (dB)

-0.05
-0.10
-0.15
-0.20
-0.25
500

600

700

800

900-27-28-29-30-31-32-33-34-35

1000 1100500

600

Frequency (MHz)

800

900

1000 1100

Frequency (MHz)Frequency vs. Directivity

Frequency vs. Return Loss

00-10-10Return Loss (dB)Directivity (dB)

700-20-30-40-20-30-40-50-50
500

600

700

800

900

500

1000 1100

600

700

800

900

1000 1100

Frequency (MHz)Frequency (MHz)Frequency vs. Group Delay (S21)

Frequency vs. Group Delay (S41)
0.30

0.25

0.25

Group Delay (ns)Group Delay (ns)

0.30

0.20

0.20

0.15

0.15

0.10

0.10

0.05

0.05

0.00

0.00
500

600

700

800

900

Frequency (MHz)1000 1100

500

600

700

800

900

Frequency (MHz)SOSHIN ELECTRIC CO., LTD

1000 1100

Control No. : ARP-4271800-J 3

Product Information

Issued on April 5, 2023

6.Recommended Land Pattern (Unit:mm)
Land Pattern

(*1)

(*2)

3.20

(*1)

(*1) 50 ohm impedance line(*2) Ground Plane

1.93

0.61

(*1)

(*1)

Resist Pattern

7.08

0.61

1.93

Solder Resist

3.20

8.35

7.Power Derating CurveSOSHIN ELECTRIC CO., LTD

Control No. : ARP-4271800-J 4

Product Information

Issued on April 5, 2023

7. Tape packaging method
7.1 Tape packaging must conform to the following specifications. Refer toIEC-286-3 for items which are not included in them.
(1) Tape must be wound clockwise with the feeding hole coming to the right hand side
when the tape end is pulled out towards an operator.
(2) Top cover tape must not cover feeding holes of carrier tape and/or show out ofcarrier tape.
(3) A blank section carrying no chips of a length of 160mm min. on ending section and 100mm
min. on leading section must be provided.
(4) A leading section of 400mm min. must be provided on top cover tape.
160MIN
Ending section

Chips located100MIN
Leading section (no chips)400MIN
Leader tape
（Unit:mm)(5) To end tape winding, the leading section of top cover tape must be stuck on a sideof a reel with adhesive tape.
(6) Removing force of top cover tape in the unwinding with an angle of 170 degrees
between the removed side of a reel and carrier tape must be 0.1 to 1.0 N.
(7) A sticker carrying Soshin product No., quantity, lot No. is to be placed on thespecified side of reels.
A sticker is placed on
opposite side on the feedinghole side of carrier tape .

Sticker location

SOSHIN ELECTRIC CO., LTDControl No. : ARP-4271800-J 5

Product Information

Issued on April 5, 2023

(8) Product orientation must be consistent. Products must not be positioned out of themounting location.

GGGG

G

Tapepulling direction(9) Tape-packaged quantity
The quantity is 1,000 pieces per single tape-package as a rule.

Ø1.5+0.1/-0.0

2.00±0.10

4.0±0.1

8.0±0.1

5.45±0.10

2.5±0.1

Top cover tape0.30±0.05

6.75±0.10

5.50±0.10

12.0+0.3/-0.4

1.75±0.10

7.2 Dimensions of the carrier tape (Unit : mm)

Carrier tape

Pulling Direction

7.3 Carrier tape reel dimensions (Unit : mm)Material
Polyester +LDPE +PSresin+
Conductive coat

Carrier tape
ReelPS+Carbon
PS+Carbon

Φ100±1

Φ21.0±0.8

Φ254±2

Φ13.0±0.2

Cover tape13.4±1.0
17.4±1.0

SOSHIN ELECTRIC CO., LTD

Product Information
8. Recommended use conditions
Reflow soldering conditions

Control No. : ARP-4271800-J 6
Issued on April 5, 2023

cTemp.

dT1eT2
T3baTime(1) High temperature reflow conditions (Products may be put through reflow oven 2 timesmaximum.)T1: 230deg C, T2: 180deg C, T3: 150deg C
a: Preheating for 60 - 120 seconds,
b: Heating for 30 - 50 seconds,
c: Peak temperature 260±5deg C, 5 - 10 seconds
d: Temperature ramp-up slope – 10deg C, max./1 sec.
e: Temperature ramp-down slope – 8deg C, max./1 sec.

*Solder build-up
Formation of a solder fillet measuring 0.3 mm or up to a half of the product thickness (t) at edges ofexternal electrode must be ascertained. Solder build-up which is shorter or greater than thisdimension may cause detrimental effects on the mechanical strength and/or variation in electricalperformance.
SolderLandComponentｔ

0.3～t/2ｍｍ

PCBExample) When a 0.3 mm thick solder mask is used, fillets will be about 0.95 mm

SOSHIN ELECTRIC CO., LTD