The experts look ahead

Cramming more components
onto integrated circuits
With unit cost falling as the number of components per
circuit rises, by 1975 economics may dictate squeezing as
many as 65,000 components on a single silicon chip

By Gordon E. Moore
Director, Research and Development Laboratories, Fairchild Semiconductor
division of Fairchild Camera and Instrument Corp.

The future of integrated electronics is the future of electronics itself. The advantages of integration will bring about aproliferation of electronics, pushing this science into many
new areas.
Integrated circuits will lead to such wonders as homecomputersor at least terminals connected to a central computerautomatic controls for automobiles, and personalportable communications equipment. The electronic wristwatch needs only a display to be feasible today.
But the biggest potential lies in the production of large
systems. In telephone communications, integrated circuits
in digital filters will separate channels on multiplex equipment. Integrated circuits will also switch telephone circuits
and perform data processing.
Computers will be more powerful, and will be organizedin completely different ways. For example, memories builtof integrated electronics may be distributed throughout the
The author
Dr. Gordon E. Moore is one of
the new breed of electronicengineers, schooled in thephysical sciences rather than inelectronics. He earned a B.S.
degree in chemistry from the
University of California and a
Ph.D. degree in physicalchemistry from the California
Institute of Technology. He wasone of the founders of Fairchild
Semiconductor and has been
director of the research anddevelopment laboratories since
1959.

machine instead of being concentrated in a central unit. In
addition, the improved reliability made possible by integrated
circuits will allow the construction of larger processing units.
Machines similar to those in existence today will be built at
lower costs and with faster turn-around.
Present and future
By integrated electronics, I mean all the various technologies which are referred to as microelectronics today as
well as any additional ones that result in electronics functions supplied to the user as irreducible units. These technologies were first investigated in the late 1950s. The object was to miniaturize electronics equipment to include increasingly complex electronic functions in limited space withminimum weight. Several approaches evolved, including
microassembly techniques for individual components, thinfilm structures and semiconductor integrated circuits.
Each approach evolved rapidly and converged so thateach borrowed techniques from another. Many researchers
believe the way of the future to be a combination of the various approaches.
The advocates of semiconductor integrated circuitry are
already using the improved characteristics of thin-film resistors by applying such films directly to an active semiconductor substrate. Those advocating a technology based uponfilms are developing sophisticated techniques for the attachment of active semiconductor devices to the passive film arrays.
Both approaches have worked well and are being usedin equipment today.

Electronics, Volume 38, Number 8, April 19, 1965

equivalent piece of semiconductor in the equivalent package
containing more components. But as components are added,
decreased yields more than compensate for the increased
complexity, tending to raise the cost per component. Thus
there is a minimum cost at any given time in the evolution of
the technology. At present, it is reached when 50 components are used per circuit. But the minimum is rising rapidly
while the entire cost curve is falling (see graph below). If welook ahead five years, a plot of costs suggests that the minimum cost per component might be expected in circuits with
about 1,000 components per circuit (providing such circuit
functions can be produced in moderate quantities.) In 1970,
the manufacturing cost per component can be expected to be
only a tenth of the present cost.
The complexity for minimum component costs has increased at a rate of roughly a factor of two per year (seegraph on next page). Certainly over the short term this rate
can be expected to continue, if not to increase. Over the
longer term, the rate of increase is a bit more uncertain, although there is no reason to believe it will not remain nearly
constant for at least 10 years. That means by 1975, the number of components per integrated circuit for minimum cost
will be 65,000.
I believe that such a large circuit can be built on a single
wafer.
Two-mil squares
With the dimensional tolerances already being employed
in integrated circuits, isolated high-performance transistors
can be built on centers two thousandths of an inch apart. Such

105

1962
Relative Manufacturing Cost/Component

The establishment
Integrated electronics is established today. Its techniques
are almost mandatory for new military systems, since the reliability, size and weight required by some of them is achievable only with integration. Such programs as Apollo, formanned moon flight, have demonstrated the reliability of integrated electronics by showing that complete circuit functions are as free from failure as the best individual transistors.
Most companies in the commercial computer field havemachines in design or in early production employing integrated electronics. These machines cost less and performbetter than those which use conventional electronics.
Instruments of various sorts, especially the rapidly increasing numbers employing digital techniques, are starting
to use integration because it cuts costs of both manufactureand design.
The use of linear integrated circuitry is still restrictedprimarily to the military. Such integrated functions are expensive and not available in the variety required to satisfy amajor fraction of linear electronics. But the first applications are beginning to appear in commercial electronics, particularly in equipment which needs low-frequency amplifiers of small size.
Reliability counts
In almost every case, integrated electronics has demonstrated high reliability. Even at the present level of productionlow compared to that of discrete componentsit offers reduced systems cost, and in many systems improved
performance has been realized.
Integrated electronics will make electronic techniquesmore generally available throughout all of society, performing many functions that presently are done inadequately byother techniques or not done at all. The principal advantages
will be lower costs and greatly simplified designpayoffs
from a ready supply of low-cost functional packages.
For most applications, semiconductor integrated circuits
will predominate. Semiconductor devices are the only reasonable candidates presently in existence for the active elements of integrated circuits. Passive semiconductor elements
look attractive too, because of their potential for low costand high reliability, but they can be used only if precision is
not a prime requisite.
Silicon is likely to remain the basic material, althoughothers will be of use in specific applications. For example,
gallium arsenide will be important in integrated microwave
functions. But silicon will predominate at lower frequencies
because of the technology which has already evolved around
it and its oxide, and because it is an abundant and relatively
inexpensive starting material.
Costs and curves
Reduced cost is one of the big attractions of integrated
electronics, and the cost advantage continues to increase as
the technology evolves toward the production of larger andlarger circuit functions on a single semiconductor substrate.
For simple circuits, the cost per component is nearly inversely
proportional to the number of components, the result of the

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1970

10

1
1

10

102

103

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Number of Components Per Integrated Circuit

Electronics, Volume 38, Number 8, April 19, 1965

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16
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Log2 of the Number of Components
Per Integrated Function

a two-mil square can also contain several kilohms of resistance or a few diodes. This allows at least 500 components
per linear inch or a quarter million per square inch. Thus,
65,000 components need occupy only about one-fourth asquare inch.
On the silicon wafer currently used, usually an inch or
more in diameter, there is ample room for such a structure if
the components can be closely packed with no space wasted
for interconnection patterns. This is realistic, since efforts toachieve a level of complexity above the presently available
integrated circuits are already underway using multilayer
metalization patterns separated by dielectric films. Such adensity of components can be achieved by present opticaltechniques and does not require the more exotic techniques,
such as electron beam operations, which are being studied tomake even smaller structures.
Increasing the yield
There is no fundamental obstacle to achieving device
yields of 100%. At present, packaging costs so far exceed
the cost of the semiconductor structure itself that there is no
incentive to improve yields, but they can be raised as high as

is economically justified. No barrier exists comparable tothe thermodynamic equilibrium considerations that often limit
yields in chemical reactions; it is not even necessary to do
any fundamental research or to replace present processes.
Only the engineering effort is needed.
In the early days of integrated circuitry, when yields were
extremely low, there was such incentive. Today ordinary integrated circuits are made with yields comparable with thoseobtained for individual semiconductor devices. The same
pattern will make larger arrays economical, if other considerations make such arrays desirable.
Heat problem
Will it be possible to remove the heat generated by tensof thousands of components in a single silicon chip?
If we could shrink the volume of a standard high-speed
digital computer to that required for the components themselves, we would expect it to glow brightly with present power
dissipation. But it wont happen with integrated circuits.
Since integrated electronic structures are two-dimensional,
they have a surface available for cooling close to each centerof heat generation. In addition, power is needed primarily todrive the various lines and capacitances associated with thesystem. As long as a function is confined to a small area ona wafer, the amount of capacitance which must be driven is
distinctly limited. In fact, shrinking dimensions on an integrated structure makes it possible to operate the structure athigher speed for the same power per unit area.
Day of reckoning
Clearly, we will be able to build such componentcrammed equipment. Next, we ask under what circumstances
we should do it. The total cost of making a particular system
function must be minimized. To do so, we could amortize
the engineering over several identical items, or evolve flexible techniques for the engineering of large functions so thatno disproportionate expense need be borne by a particulararray. Perhaps newly devised design automation procedures
could translate from logic diagram to technological realization without any special engineering.
It may prove to be more economical to build large

Electronics, Volume 38, Number 8, April 19, 1965

systems out of smaller functions, which are separately packaged and interconnected. The availability of large functions,combined with functional design and construction, should
allow the manufacturer of large systems to design and construct a considerable variety of equipment both rapidly andeconomically.
Linear circuitry
Integration will not change linear systems as radicallyas digital systems. Still, a considerable degree of integration
will be achieved with linear circuits. The lack of large-value
capacitors and inductors is the greatest fundamental limitations to integrated electronics in the linear area.
By their very nature, such elements require the storageof energy in a volume. For high Q it is necessary that thevolume be large. The incompatibility of large volume andintegrated electronics is obvious from the terms themselves.
Certain resonance phenomena, such as those in piezoelectric
crystals, can be expected to have some applications for tuning functions, but inductors and capacitors will be with us
for some time.
The integrated r-f amplifier of the future might well con-sist of integrated stages of gain, giving high performance atminimum cost, interspersed with relatively large tuning elements.
Other linear functions will be changed considerably. The
matching and tracking of similar components in integrated
structures will allow the design of differential amplifiers ofgreatly improved performance. The use of thermal feedback
effects to stabilize integrated structures to a small fraction ofa degree will allow the construction of oscillators with crystal stability.
Even in the microwave area, structures included in thedefinition of integrated electronics will become increasingly
important. The ability to make and assemble components
small compared with the wavelengths involved will allow
the use of lumped parameter design, at least at the lower frequencies. It is difficult to predict at the present time just how
extensive the invasion of the microwave area by integrated
electronics will be. The successful realization of such items
as phased-array antennas, for example, using a multiplicity
of integrated microwave power sources, could completely
revolutionize radar.

Electronics, Volume 38, Number 8, April 19, 1965

Video Transcript

Excerpts from A Conversation
with Gordon Moore: Moore’s Law
Moore’s Law
Gordon Moore: The original Moore’s Law came out of an article I published in 1965 this was theearly days of the integrated circuit, we were just learning to put a few components on a chip. I was
given the chore of predicting what would happen in silicon components in the next 10 years for the
35th anniversary edition of “Electronic Magazine”. So I looked at what we were doing in integrated
circuits at that time, and we made a few circuits and gotten up to 30 circuits on the most complex
chips that were out there in the laboratory, we were working on with about 60, and I looked andsaid gee in fact from the days of the original planar transistor, which was 1959, we had about
doubled every year the amount of components we could put on a chip. So I took that ﬁrst few
points, up to 60 components on a chip in 1965 and blindly extrapolated for about 10 years andsaid okay, in 1975 we’ll have about 60 thousand components on a chip. Now what was I trying
to do was to get across the idea that this was the way electronics was going to become cheap.
It wasn’t true of the early integrated circuits, they cost more than the bits and pieces that you
could assemble cost, but from where I was in the laboratory, you could see the changes thatwere coming, make the yields go up, and get the cost per transistors down dramatically. I had
no idea this was going to be an accurate prediction, but amazingly enough instead of ten doubling,
we got 9 over the 10 years, but still followed pretty well along the curve. And one of my friends,
Dr. Carver Mead, a Professor at Cal Tech, dubbed this Moore’s Law.
So the original one was doubling every year in complexity now in 1975, I had to go back andrevisit this... and I noticed we were losing one of the key factors that let us make this remarkablerate of progress... and it was one that was contributing about half of the advances were making.
So then I changed it to looking forward, we’d only be doubling every couple of years, and that was
really the two predictions I made. Now the one that gets quoted is doubling every 18 months…
I think it was Dave House, who used to work here at Intel, did that, he decided that the complexity
was doubling every two years and the transistors were getting faster, that computer performance
was going to double every 18 months... but that’s what got on Intel’s Website... and everythingelse. I never said 18 months that’s the way it often gets quoted.
Interviewer: So just to be accurate, it’s two years?
Gordon Moore: Two years in this day in age, and we’re doing a little better than that.
Interviewer: 40 years later? Be true?
Gordon Moore: Of course, that was my plan from the beginning, no you can never see that far
down the road in this sort of thing. When Intel was founded the entire semiconductor businessworldwide was about two billion dollars... now it’s kind of 200 billion dollars. The entire market has
grown about 100 fold in that time. There was no way we could predict very far down the road what
was going to happen. It was just a lucky guess, I guess on my part... lucky extrapolation.

Interviewer: What are your thoughts now, knowing
its signiﬁcance?

Past and futureInterviewer: Reﬂect on 36 years... Thoughts as look backGordon Moore: It’s important to certainly change. Initially,
just an observation an attempt to predict this was a way tocheap electronics... but the industry made it a self-fulﬁlling
prophesy now, the industry road maps are based on that
continued rate of improvement, various technology nodes
come along on a regular basis to keep us on that curve, so
all the participants in the business recognize that if they don’t
move that fast they fall behind technology, so essentially frombeing just a measure of what has happened, it’s become adriver of what is going to happen. Something I never wouldon entire career? Founding greatest companies in the world?
Gordon Moore: It sure is nice to be at the right place at
the right time. I was very fortunate to get into the semiconductor industry in its infancy. And I had an opportunity to growfrom the time where we couldn’t make a single silicon transistor to the time where we put 1.7 billion of them on one chip!
It’s been a phenomenal ride... if you measure the industry interms of the number of transistors it makes which I like to
do occasionally, there’s no industry that I can identify that ishave imagined initially.

remotely comparable in how it’s expanded over that period

Interviewer: How long can it continue?

of a lot more in our output.

of time. We’ve grown a lot in dollars but we’ve grown a heckGordon Moore: I think Moore’s Law will continue as longas Moore does anyhow! Ha ha ha... I’m periodically amazedat how we’re able to make progress. Several times along theway, I thought we reached the end of the line, things taper off,
and our creative engineers come up with ways around them.
I can think of at least 3-4 things that seemed like formidable
barriers that we just blew past without any hesitation and in

Message to employees
Gordon Moore: First of all, I thank them for the contributions
they made because really it is our employees who got us
where we are today... and are going to take us where we want
to go in the future.

fact, the board meeting we came up I saw pictures that go acouple of generations beyond anything I had seen previously
in regards to the highest transistors we can build... so I think
we’ve got quite a bit of life yet. I’ve never been able to see
beyond the next three generations of technology. Three
generations of technology is about 6-8 years and I can seethat far now, things haven’t really changed. Eventually they’regoing to have to. Materials are made of atoms, and we’regetting suspiciously close to some of the atomic dimensions
with these new structures, but I’m sure we’ll ﬁnd ways tosqueeze even further than we think we presently can.

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