RS2588

Low Quiescent Current Power Distribution Switch
1 FEATURES

3 DESCRIPTIONS•

70mΩ (TYP) High-side P-Channel MOSFETThe RS2588 is an integrated 70mΩ(TYP) power switch•

Low Quiescent Current

for self-powered and bus-powered universal series bus•

Input Voltage from 2.5V to 5.5V

(USB) applications.

•Three Current Limit Levels
1.1A, 2.1A, 2.6A

The RS2588 is internally current limited and has thermal•

Maximum Shutdown Current ≤1μA

shutdown function to protect device and load from•

Soft-Start Function

over-current damage. Thermal shutdown shuts off the•Under-Voltage Lockout Protection for VIN

output MOSFET and asserts the flag pin output if the•

No Reversed Leakage Current

die•Thermal Shutdown Protection

temperature drops to 130°C.

•

Operation temperature from -40°C to 85°C•

Lead-Free Packages: SOT23-5

temperature

exceeds

150°C

until

the

die

The soft-start circuit can minimize inrush current inapplications

where

highlycapacitive

loads

are

employed.

2 APPLICATIONS•

Smart Phone & LCD TV•

Set-Top Boxes

•

VOIP

•

USB Bus/Self Powered Hubs/Peripherals•

Portable Consumer or Medical Products

The flag pin asserts low when during over-current andthermal conditions after a 13ms blanking time toprevent false reporting.
The RS2588 is available in SOT23-5 package. It is rated
over the -40°C to +85°C temperature range.

Device Information (1)PART
NUMBER
RS2588PACKAGEBODY SIZE (NOM)

SOT23-5

2.92mm×1.60mm(1) For all available packages, see the orderable addendum at the endof the data sheet.

4 Typical Application
Power
Supply

VIN
10k

10μF

0.1μF

Load

VOUT

RS2588

1μF

0.1μF

FLAG
ON

OFF

REV A.2

EN
GND

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RS2588
5 Functional Block Diagram
VIN
SwitchWell
1:K

ReverseUVLO
Driver

ThermalShutdown

Reference
Voltage

AMP
OCP

OUT
EN

Rset

OSC

EN

FLAG

Diglitch

GND

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RS2588
Table of Contents
1 FEATURES ............................................................................................................................................................................... 1
2 APPLICATIONS ...................................................................................................................................................................... 1
3 DESCRIPTIONS ...................................................................................................................................................................... 1
4 Typical Application ................................................................................................................................................................ 1
5 Functional Block Diagram .................................................................................................................................................... 2
6 Revision History ..................................................................................................................................................................... 4
7 PACKAGE/ORDERING INFORMATION (1) ..................................................................................................................... 5
8 PIN CONFIGURATIONS ...................................................................................................................................................... 6
9 SPECIFICATIONS ................................................................................................................................................................... 7
9.1 Absolute Maximum Ratings .......................................................................................................................................... 7
9.2 ESD Ratings ...................................................................................................................................................................... 7
9.3 Recommended Operating Conditions ......................................................................................................................... 7
9.4 Electrical Characteristics ................................................................................................................................................ 8
9.5 Typical Performance Characteristics ........................................................................................................................... 9
10 PARAMETER MEASUREMENT INFORMATION ......................................................................................................14
11 FUNCTIONAL DESCRIPTION ........................................................................................................................................15
11.1 Input and output .........................................................................................................................................................15
11.2 Thermal Shutdown .....................................................................................................................................................15
11.3 Soft-Start ......................................................................................................................................................................15
11.4 Current limiting and Short protection ....................................................................................................................15
11.5 Reverse-voltage protection ......................................................................................................................................15
11.6 FLAG output ................................................................................................................................................................15
11.7 Power dissipation ........................................................................................................................................................15
12 APPLICATION INFORMATION ....................................................................................................................................16
12.1 Supply filter capacitor ................................................................................................................................................16
12.2 Output filter capacitor ...............................................................................................................................................16
12.3 PCB layout guide .........................................................................................................................................................16
13 PACKAGE OUTLINE DIMENSIONS .............................................................................................................................17
14 TAPE AND REEL INFORMATION .................................................................................................................................18

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RS2588
6 Revision History
Note: Page numbers for previous revisions may different from page numbers in the current version.
VERSION

Change Date

Change Item

A.0

2021/12/20

Initial version completed

A.1

2022/06/22

A.2

2024/04/07

Official version completed
1. Add MSL on Page 5@RevA.1
2. Update PACKAGE note

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RS2588
7 PACKAGE/ORDERING INFORMATION (1)PRODUCT
RS2588ORDERING
NUMBER
RS2588AYF5TEMPERATURE
RANGE-40°C ~+85°C

PACKAGELEAD
SOT23-5

PACKAGEMARKING (2)2588A

RS2588BYF5-40°C ~+85°C

SOT23-5

RS2588CYF5-40°C ~+85°C

SOT23-5

MSL (3)

PACKAGE OPTIONMSL3Tape and Reel, 3000

2588B

MSL3

Tape and Reel, 3000

2588C

MSL3

Tape and Reel, 3000

NOTE:
(1) This information is the most current data available for the designated devices. This data is subject to change without notice and revisionof this document. For browser-based versions of this data sheet, refer to the right-hand navigation.
(2) There may be additional marking, which relates to the lot trace code information (data code and vendor code), the logo or theenvironmental category on the device.
(3) MSL, The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications.

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RS2588
8 PIN CONFIGURATIONSTOP VIEW
VOUT

1

GND

2

FLAG

3

5

VIN

4

EN

SOT23-5

Pin Description
NAME

PIN

DESCRIPTION

VOUT

1

Switch Output. The P-Channel Drain of Switch, Which Typically Connects to Load.

GND

2

FLAG

3

EN

4

VIN

5

GroundFlag pin. Active low, open-drain output. Indicates over-current or thermal shutdown
conditions. Over-current condition must last longer than tD in order to assert Flag.
Enable Input. Logic Level Enable Input, Active high available.
Power Supply Input. The P-Channel Source of Switch, which also supplies IC’s internal
circuitry. Connect to Positive Supply.

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RS2588
9 SPECIFICATIONS
9.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)(2)
Characteristics

Symbol

MIN

MAX

UNIT

Supply Input Voltage

VIN

-0.3

6.0

V

Output Voltage

VOUT

-0.3

6.0

V

EN Input Voltage

VEN

-0.3

6.0

V

FLAG Output Voltage

VFLAG

-0.3

6.0

V

Package thermal impedance (3)

230

°C/W

Operating Junction Temperature

TJ

-40

+150

°C

Storage Temperature (4)

Tstg

-65

150

°C

Lead Temperature (Soldering, 10secs)

TL

260

°C

(1)
(2)
(3)
(4)

SOT23-5

θJA

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to the GND pin.
The package thermal impedance is calculated in accordance with JESD-51.
The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (T J(MAX) - TA) / RθJA. All numbers apply for packages soldered directly onto a PCB.

9.2 ESD Ratings
The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only.

V(ESD)

Electrostatic discharge

VALUE

UNIT

Human-Body Model (HBM)

±3000

V

Charge Device Model (CDM)

±1500

V

ESD SENSITIVITY CAUTION
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its publishedspecifications.

9.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Characteristics

Symbol

MIN

MAX

UNIT

Input Voltage

VIN

2.5

5.5

V

EN Voltage range

VEN

0

5.5

V

0

5.5

V

Operating Temperature Range

TA

-40

+85

°C

Operating Junction Temperature Range

TJ

-40

+125

°C

All other pins

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RS2588
9.4 Electrical Characteristics(At VIN=5V, TA = +25°C, unless otherwise noted.)
PARAMETERSYMBOL

CONDITIONS

2.5

5.5

V

30

50

μA

Switch off, VOUT = open

0.1

1.0

μA

Switch off, VOUT = 0V

0.1

1.0

μA

0.4

V

10

15

μA

520

600

kΩ

IOUT = 500mA

70

80

mΩ

RL =10Ω, CL =1μF, Figure 4,5

2

ms

tOFF

RL =10Ω, CL =1μF, Figure 6,720μs

RS2588A

Ramped load

0.99

1.1

1.21

A

RS2588B

Ramped load

1.89

2.1

2.31

A

RS2588C

Ramped load

2.34

2.6

2.86

A

1.9

2.3

V

Input Voltage

VIN

Quiescent Supply Current

IQ

Switch on, VOUT = open

Shutdown Supply Current

ISD

Leakage Current of VINILKG(VIN)
VIL

VIN =2.5V to 5.5V

VIH

VIN =2.5V to 5.5V

EN Input Current

IEN

VEN = 0V to 5.5V

EN Pin Pull-Down Resistance

RPULL_DOWN VEN = 2.5V to 5.5V

Switch ResistanceRDS(ON)

Output Turn-On Delay TimetON

Output Turn-Off Delay Time

Enable Input Threshold

Current Limit Threshold

MIN(1) TYP(2) MAX(1) UNITS

Under-Voltage Lockout Threshold VUVLO
Under-Voltage Lockout Threshold
VUVLO_HY
Hysteresis
Over-Current FLAG Response
tD
Delay TimeILKG(FLAG)
Leakage Current of FLAG

10

1.6
450

VIN rising

V

0.15

V

Apply VOUT= 0 until FLAG is low

13ms

FLAG is HIGH

0.1

Flag Output Low Voltage

VFLAG-L

CIN=10uF, ISINK =2mA

VOUT Shutdown Discharge
Resistance

RDIS

Switch off

Thermal Shutdown Temperature

TSD

TJ Increasing

Thermal Shutdown Hysteresis

TSD_HY

250

300

1.0

μA

0.4

V

350

Ω

150

°C

30

°C

(1) Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlations using statisticalquality control (SQC) method.
(2) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may varyover time and will also depend on the application and configuration.

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RS2588
9.5 Typical Performance Characteristics
NOTE: The graphs and tables provided following this note are a statistical summary based on a limited number of samples
and are provided for informational purposes only.
VIN = 5V, TA = +25°C, unless otherwise noted.
3

COUT=1μF,RL=10Ω

2.5

Rise Time(ms)2.5

Rise Time(ms)3

VIN=5V,COUT=1μF,RL=10Ω

2
1.5
1
0.5

2
1.5
1
-40℃
25℃
85℃

0.5

0

0
-55

-35

-15

5

25

45

65

85

2.5

3

3.5

Temperature(℃)

Figure 1. Turn-On Rise Time vs Temperature

5

5.5

35
VIN=5V,COUT=1μF,RL=10Ω

50

COUT=1μF,RL=10Ω

30

40

Fall Time(μs)

Fall Time(μs)

4.5Figure 2. Turn-On Rise Time vs Input Voltage

60

30

20
10

25
20
15
10
5

0

0
-55

-35

-15

5

25

45

65

85

2.5

3

3.5

Temperature(℃)

4.5

5

5.5

Figure 4. Turn-Off Fall Time vs Input Voltage
Output Leakage Current(μA)

2.5
VIN Rising2
1.5
VIN Falling

1

4

Input Voltage(V)Figure 3. Turn-Off Fall Time vs Temperature

UVLO Threshold(V)4Input Voltage(V)

0.5
0

30
Switch Off
VIN =5V
VOUT=0V

25
20
15
10
5
0

-55

-35

-15

5

25

45

65

85

-55

Temperature(℃)

-35

-15

5

25

45

65

85

Temperature(℃)

Figure 5. UVLO Threshold vs Temperature

Figure 6. Output Leakage Current vs
Temperature

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RS2588
Typical Performance Characteristics (Continued)

0.4

Shutdown Supply Current(μA)

Shutdown Supply Current(μA)

NOTE: The graphs and tables provided following this note are a statistical summary based on a limited number of samples
and are provided for informational purposes only.
VIN = 5V, TA = +25°C, unless otherwise noted.

Switch Off,VOUT is floating

0.3
0.2

VIN=5V

0.1
0.0
VIN=3.3V

-0.1
-55

-35

-15

5

25

45

65

0.5

0.3
0.2
0.1
0.0
-0.1

85

2.5

3.0

Temperature(℃)

Quiescent Supply Current(μA)

Quiescent Supply Current(μA)

Switch On,VOUT is floating40
VIN=5V30
25
20

VIN=3.3V

15
10

-55

-35

-15

5

25

45

4.5

5.0

5.5

65

40
Switch On,VOUT is floating

35
30

25
20
15
10

-40℃

5

25℃
85℃

0

85

2.5

3

Temperature(℃)

3.5

4

4.5

5

5.5

Input Voltage(V)Figure 9. Quiescent Supply Current vs
Temperature

Figure 10. Quiescent Supply Current vs Input
Voltage

1.8

1.8
VIN=5V

1.6

VEN Rising

Enable Threshold(V)Enable Threshold(V)4.0

Figure 8. Shutdown Supply Current vs Input
Voltage

50

35

3.5

Input Voltage(V)Figure 7. Shutdown Supply Current vs
Temperature

45

-40℃
25℃
85℃

Switch Off,VOUT is
floating

0.4

1.4
1.2
1.0
0.8

VEN Falling

0.6
0.4

TA=+25°C

1.6
1.4

VEN Rising

1.2
1.0
0.8

VEN Falling

0.6
0.4

-55

-35

-15

5

25

45

65

85

2.5

Temperature(℃)

Figure 11. Enable Threshold vs Temperature

3

3.5

4

4.5

5

5.5

Input Voltage(V)Figure 12. Enable Threshold vs Input Voltage

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RS2588
Typical Performance Characteristics (Continued)
NOTE: The graphs and tables provided following this note are a statistical summary based on a limited number of samples
and are provided for informational purposes only.
VIN = 5V, TA = +25°C, unless otherwise noted.
180
IOUT=500mA

120

VIN=3.3V

100
80
60

VIN=5V40

IOUT=500mA

160

On Resistance(mΩ)

On Resistance(mΩ)

140

20

140

120
100
80
60
40

-40℃
25℃
85℃

20

0

0
-55

-35

-15

5

25

45

65

85

2.5

3

Temperature(℃)

FLAG Response Delay Time(ms)FLAG Response Delay Time(ms)18
VIN=3.3V

14
12
VIN=5V

8
6
4
-55

-35

-15

5

25

5

5.5

45

65

15
TA=+25°C

14
13
12
11
10
9
8

85

2.5

3

Temperature(℃)

3.5

4

4.5

5

5.5

Input Voltage(V)Figure 15. FLAG Response Delay Time vsTemperature

Figure 16. FLAG Response Delay Time vs Input
Voltage
1000

Short-Circuit Current Limit(mA)

1000

Short-Circuit Current Limit(mA)

4.5

Figure 14. On Resistance vs Input Voltage

20

10

4

Input Voltage(V)Figure 13. On Resistance vs Temperature

16

3.5

950
VIN=3.3V

900
850
800
VIN=5V

750
700
650
600
-55

-35

-15

5

25

45

65

85

900
850
800
750
700

-40℃

650

25℃
85℃

600
2.5

Temperature(℃)

Figure 17. Short-Circuit Current Limit vsTemperature

950

3

3.5

4

4.5

5

5.5

Input Voltage(V)Figure 18. Short-Circuit Current Limit vs Input
Voltage

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RS2588
Typical Performance Characteristics (Continued)
NOTE: The graphs and tables provided following this note are a statistical summary based on a limited number of samples
and are provided for informational purposes only.
VIN = 5V, TA = +25°C, unless otherwise noted.
1.3
VIN=5V

1.4

Current Limit Threshold(A)Current Limit Threshold(A)

1.5

1.3
1.2
1.1
1.0

0.9
0.8

TA=+25°C
1.2
1.1
1.0
0.9
0.8

-55

-35

-15

5

25

45

65

85

2.5

Temperature(℃)

2V/div

VOUT

EN

VIN

VOUT

2V/div

2V/div 2V/div 5V/div

FLAG

2V/div 2V/div 5V/div

VOUT

5.5

Time(20μs/div)
Figure 22. Turn-Off Response

Figure 21. Turn-On Response

VIN

5

2V/div

FLAG

Time(1ms/div)

FLAG

4.5

3V/div

2V/div

VOUT

4

Figure 20. Current Limit Threshold vs Input
Voltage

5V/div

EN

3.5

Input Voltage(V)Figure 19. Current Limit Threshold vs
Temperature

FLAG

3

Time(5ms/div)

Time(5ms/div)
Figure 23. UVLO at VIN Rising

Figure 24. UVLO at VIN Falling

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RS2588
Typical Performance Characteristics (Continued)

FLAG

IOUT

EN

VOUT

2A/div

VOUT

FLAG

5V/div

VIN

IOUT
Time(10ms/div)

Figure 25. No Load into Short-Circuit

IOUT

5V/div 5V/div 5V/div

VOUT

Time(10ms/div)

Figure 26. Device Enabled into Short-Circuit

5A/div

VIN
FLAG

500mA/div 2V/div 5V/div 5V/div

5V/div 5V/div

NOTE: The graphs and tables provided following this note are a statistical summary based on a limited number of samples
and are provided for informational purposes only.
VIN = 5V, TA = +25°C, unless otherwise noted.

Time(5μs/div)

Figure 27. Short-Circuit Response Time

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RS2588
10 PARAMETER MEASUREMENT INFORMATION

VEN

tON

tOFF

VOUT

tRISE

Figure 28. Switch Turn-On and Turn-Off Delay Times

VEN
Short-Circuit

VOUT
ILIMIT
IOUT
VFLAG

Chip into Thermal
Shutdown State

Soft
Start
tD

tD
Delay Time

Figure 29. Fault Timing: Output Reset by Toggling EN

VEN

Short-Circuit

VOUT
ILIMIT
IOUT

Load isRemovedSoft Start

Chip into Thermal
Shutdown State

VFLAG
tD
Delay Time

Figure 30. Fault Timing: Output Reset by Removing Load

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RS2588
11 FUNCTIONAL DESCRIPTION
11.1 Input and output
VIN is the power supply connection to the logic circuitry and the source of the P-channel MOSFET. VOUT is thedrain of the P-channel MOSFET. In a typical circuit, current flows from VIN to VOUT toward the load. The output
P-channel MOSFET and driver circuit are also designed to allow the MOSFET drain to be externally forced to ahigher voltage than the source (VOUT > VIN) when the switch is disabled.

11.2 Thermal Shutdown
Thermal shutdown is employed to protect device and load from damage. It shuts off the output MOSFET andasserts the FLAG output, if the die temperature exceeds 150°C until the die temperature drops to 130°C.

11.3 Soft-Start
In order to eliminate the upstream voltage sag caused by the large inrush current during hot-plug events, thesoft-start feature effectively isolates power supplies from such highly capacitive loads.

11.4 Current limiting and Short protection
The current limit circuit is designed to limit the output current to protect the upstream power supply. The typicalcurrent limit threshold is set by internally to approximately 1.1A, 2.1A and 2.6A. Under output short-circuit
condition, the typical current limit folded back 75%. If the chip keeps at over-current condition for a long time,
the junction temperature may exceed 150°C, and over-temperature protection will shut down the output until
temperature drops below 130°C or limit (short) condition is removed.

11.5 Reverse-voltage protection
The reverse-voltage protection feature turns off the P-MOSFET switch whenever the output voltage exceeds
the input voltage by 40mV.

11.6 FLAG output
The FLAG signal is an open-drain output pin. FLAG is asserted when an over-current or thermal shutdown
condition occurs, and active low output.
In the case of an over-current condition, FLAG will be asserted only after the response delay time (t D) has elapsed.
This ensures that FLAG is asserted only upon valid over-current conditions and that erroneous error reporting iseliminated.
For example, false over-current conditions can occur during hot-plug events when a highly capacitive load isconnected and causes a high transient inrush current that exceeds the current limit threshold for up to 1ms, The
FLAG response delay time tD is about 13ms.

11.7 Power dissipation
The device’s junction temperature depends on several factors such as the load, PCB layout, ambient temperature,and package type. Equations that can be used to calculate power dissipation and junction temperature are foundbelow:PD = RDS(ON) x IOUT2
To relate this to junction temperature, the following equation can be used:
TJ = PD x θJA + TA
Where:
TJ = junction temperature
TA = ambient temperature
θJA = the thermal resistance of the package

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RS2588
12 APPLICATION INFORMATION
12.1 Supply filter capacitor
In order to prevent the input voltage drooping during hot-plug events, connect a ceramic capacitor CIN from VIN
to GND. The CIN is positioned close to VIN and GND of the device. However, higher capacitor values could
reduce the voltage sag on the input further. Furthermore, an output short will cause ringing on the input without
the input capacitor. It could destroy the internal circuitry when the input transient exceeds 6V which is theabsolute maximum supply voltage even for a short duration.
If the upstream supply cable is long or the VIN transient exceeds 6V during the VOUT short, recommend adding
a second filter capacitor (not less than 47μF) at the upstream supply output terminal.

12.2 Output filter capacitor
Between VOUT and GND, connect a at least 1uF low-ESR ceramic capacitor is recommended. Standard bypass
methods should be used to minimize inductance and resistance between the bypass capacitor and the downstream connector. This will reduce EMI and improve the transient performance.

12.3 PCB layout guideFor best performance of the RS2588, the following guidelines must be strictly followed:
1) Keep all power line as short and wide as possible and use at least 1-ounce copper for all power line.
2) Dual low-ESR 10μF ceramic capacitors between VOUT and GND, VIN and GND.
3) Locate the output capacitor as close to the connectors as possible to lower impedance between the port andthe capacitor and improve transient performance.
4) Input and output capacitors should be placed closed to the chip and connected to ground plane to reducenoise coupling.
5) Locate the ceramic bypass capacitors as close as possible to the VIN pin and VOUT pin.

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RS2588
13 PACKAGE OUTLINE DIMENSIONSSOT23-5 (3)
D

1.90

b

2.59

E1

E
0.99

0.95

0.69
e
e1

RECOMMENDED LAND PATTERN (Unit: mm)

0.2
A A2

L

A1

SymbolcθDimensions In Millimeters

Dimensions In Inches

Min

Max

Min

Max

A (1)

1.050

1.250

0.041

0.049

A1

0.000

0.100

0.000

0.004

A2

1.050

1.150

0.041

0.045

b

0.300

0.500

0.012

0.020

c

0.100

0.200

0.004

0.008

D (1)

2.820

3.020

0.111

0.119

E (1)

1.500

1.700

0.059

0.067

E1

2.650

2.950

0.104

0.950 (BSC) (2)

e

0.116
0.037 (BSC) (2)

e1

1.800

2.000

0.071

0.079

L

0.300

0.600

0.012

0.024

θ

0°

8°

0°

8°

NOTE:
1. Plastic or metal protrusions of 0.15mm maximum per side are not included.
2. BSC (Basic Spacing between Centers), "Basic" spacing is nominal.
3. This drawing is subject to change without notice.

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RS2588
14 TAPE AND REEL INFORMATIONREEL DIMENSIONSTAPE DIMENSION

Reel
DiameterReel Width(W1)

DIRECTION OF FEEDNOTE: The picture is only for reference. Please make the object as the standard.

KEY PARAMETER LIST OF TAPE AND REEL
Package TypeSOT23-5

Reel
Diameter
7’’

Reel Width
(mm)
9.5

A0
(mm)
3.20

B0
(mm)
3.20

K0
(mm)
1.40

P0
(mm)
4.0

P1
(mm)
4.0

P2
(mm)
2.0

W
(mm)
8.0

Pin1
Quadrant
Q3

NOTE:
1. All dimensions are nominal.
2. Plastic or metal protrusions of 0.15mm maximum per side are not included.

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RS2588
IMPORTANT NOTICE AND DISCLAIMER
Jiangsu RUNIC Technology Co., Ltd. will accurately and reliably provide technical and reliability data (including
data sheets), design resources (including reference designs), application or other design advice, WEB tools, safety
information and other resources, without warranty of any defect, and will not make any express or implied
warranty, including but not limited to the warranty of merchantability Implied warranty that it is suitable for a
specific purpose or does not infringe the intellectual property rights of any third party.
These resources are intended for skilled developers designing with RUNIC products You will be solely
responsible for: (1) Selecting the appropriate products for your application; (2) Designing, validating and testing
your application; (3) Ensuring your application meets applicable standards and any other safety, security or otherrequirements; (4) RUNIC and the RUNIC logo are registered trademarks of RUNIC INCORPORATED. All
trademarks are the property of their respective owners; (5) For change details, review the revision history
included in any revised document. The resources are subject to change without notice. Our company will not beliable for the use of this product and the infringement of patents or third-party intellectual property rights due
to its use.

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