Control No. : ARP-481300- E 1

Product Information

Issued on August 26, 2020

Application : 3dB 90deg Hybrid Coupler for 2300-2700MHz
1. Type No.

RoHS Compliant Part

HMD813D-HYB2500
2. Dimension (Unit : mm)
2.00 +/- 0.20

on

0.70 +/- 0.10

mjkl
m
no

13

(Top view) 1.25 +/- 0.20

jkl

Terminal
Input
GND
Isolation
DirectGND
Coupled(Side view)
b c

Terminal Dimensions

dabcda(Bottom view)

0.19typ.
0.30 +/- 0.15
0.35 +/- 0.15
0.65 +/- 0.15

3. Electrical characteristics
Pass bandSpecification
2500
2300-270050
0.40 Max.
15 Min.
18 Min.
0.9 Max.
90+/-8fc (Center frequency)
Pass band frequency
Nominal impedanceInsertion Loss at 25degC.
Input Return LossIsolation
Amplitude balance
Phase balance

Typical
0.25
27.4
28.5
0.18
89.6

Unit
MHzMHz
ohm
dB
dB
dB
dBdeg

Remark

4. Note
4.1 Operating Temperature Range
4.2 Storage Temperature Range
4.3 Max Input Power
4.4 Standard Reel Quantity: -40 to +105 deg.C: -20 to +35 deg.C (In a Taping Package): 3W Avg/CW: 2,000 pcs (per reel, per bag)Approved by

Confirmed by

Y. Mizutani T. Hasegawa

SOSHIN ELECTRIC CO., LTD

Raised by

S. Suzuki

Control No. : ARP-481300- E 2

Product Information

Issued on August 26, 2020
Measured data

5.Representative characteristics

Frequency vs. Isolation

0.00-0.5-10Isolation (dB)

Insertion Loss (dB)Frequency vs. Insertion Loss

-1.0-1.5-2.0-2.5
2200 2300 2400 2500 2600 2700 2800

-30-40-50
2200 2300 2400 2500 2600 2700 2800

Frequency (MHz)Frequency (MHz)Frequency vs. Return Loss

Frequency vs. Phase Balance
100Phase Balance (deg)

0Return Loss (dB)-20-10-20-30-40-50
2200 2300 2400 2500 2600 2700 2800
Frequency (MHz)95908580
2200 2300 2400 2500 2600 2700 2800
Frequency (GHz)

Amplitude Balance (dB)Frequency vs. Amplitude Balance
2.5
2.0
1.5
1.0
0.5
0.0
2200 2300 2400 2500 2600 2700 2800
Frequency (MHz)SOSHIN ELECTRIC CO., LTD

Product Information

Control No. : ARP-481300- E 3
Issued on August 26, 2020

6.Recommendation Land Pattern (Unit:mm)*Land Pattern
(*1)

(*2)

(*1)

(*1)

(*2)

(*1)

*Resist Pattern

Through hole (φ0.4mm)*1 50 ohm impedance Line
*2 Ground PlaneSOSHIN ELECTRIC CO., LTD

Product Information

Control No. : ARP-481300- E 4
Issued on August 26, 2020

7. Packing method
7.1 Taping conditions are shown below. Refer to IEC60286-3(1) Tape must be wound clockwise with the feeding hole coming to the right hand side.
(2) Top cover tape must not cover feeding holes of carrier tape and/or show out of carrier tape.
(3) A blank section carrying no chips of a length of 160mm min. on ending section and 100mm
min. on leading section must be provided.
(4)A leading section of 400mm min. must be provided on top cover tape.

(5) To end tape winding, the leading section of top cover tape must be stuck on a sideof a reel with adhesive tape.
(6) Removing force of top cover tape in the unwinding with an angle of 170 degrees
between the removed side of a reel and carrier tape must be 0.1 to 1.0 N.
(7) A sticker carrying Soshin product №, quantity, lot №, inspection date is to be placedon the specified side of reels. And Lot No. means our production control number.
The shipment records are available if requested.
A ticker is placed on opposite side on
the feeding hole side of carrier tape

Sticker location

SOSHIN ELECTRIC CO., LTD

Control No. : ARP-481300- E 5

Product Information

Issued on August 26, 2020

(8) Product orientation must be consistent. Products must not be positioned out of themounting location.

mmlln

m

13k

lnon

mkjk

loon

mjjk

l

13on

13jk

13o13

j

Tapepulling direction(9) A taping reel must be sealed in a plastic bag, individually.
(10) Tape-packaged quantity
The quantity is 2,000 pcs per single tape-package as a rule.

4.0±0.1
2.00±0.05

Ø1.5+0.1/-0.0

3.50±0.05

0.20±0.05

Ø1.1±0.1
4.0±0.1

Top cover tape

1.05±0.05

1.55±0.10

2.3±0.1

8.0±0.2

1.75±0.10

7.2 Dimensions of the carrier tape (Unit : mm)

Carrier tape

Pulling Direction

7.3 Carrier tape reel dimensions (Unit : mm)

Φ60.0+1.0-0

Φ21.0±0.8

Φ180.0+0-1.5

Φ13.0±0.2

9.0+1.0-0
11.4±1.0

SOSHIN ELECTRIC CO., LTD

Product Information

Control No. : ARP-481300- E 6
Issued on August 26, 2020

8. Recommend operating conditions
8.1 Reflow-soldering conditions(For reference)(1) High temperature reflow-soldering conditions (No more than 2 flows allowed)
T1 : 150 deg C. , T2 : 180 deg C. , T3 : 230 deg C. , T4 : 260 deg C.
a： Preheating
T1～T2・・・ 60 to 120 seconds
b： Heating
T3・・・ 30 to 50 seconds
c： Peak temperature T4・・・ 260±5 deg C. ,5 to 10 seconds
d： Temperature rising slope
10 deg C.／1 second, MAX.
e： Temperature falling slope
8 deg C.／1 second, MAX.
8.2

Cleaning conditions(1) Cleaning agent(2) Dip cleaning(3) Vapor cleaning(4) Ultrasonic cleaning: Isopropyl alcohol: 30 minutes, MAX., at 40 deg C.
: 30 minutes, MAX.
: 1 minute, MAX., with a maximum power of 10W

8.3 Recommended Repair Soldering Conditions(1) Preheating Conditions
The temperature difference between soldering iron and device surface
must be under 100 deg C.
(2) Recommended Condition of Soldering Iron
1.Chip temperature: 290 deg C.MAX
2.Power: 20W MAX.
3.Dimension of iron chip: 1.0 mm dia. MAX.
4.Soldering time
: 3 seconds MAX.

SOSHIN ELECTRIC CO., LTD