RS2259B

0.6Ω Quad SPST Analog Switch 4-Channel 1:1
Multiplexer – Demultiplexer
1 FEATURES

3 DESCRIPTIONSBandwidth: 30MHz

The RS2259B is a bidirectional 4-channel single-poleHigh Speed, Typically 50ns

single-throw (SPST) analog switch, which is designed toSupply Range: +1.8V to +5.5V

operate from 1.8V to 5.5V.



Low ON-State Resistance, 0.6Ω(TYP)Break-Before-Make Switching

The RS2259B device can handle both analog and digitalRail-to-Rail Operation

signals. It features bandwidth (30MHz) and low on-

TTL/CMOS Compatible

resistance (0.6Ω TYP).

Extended Industrial Temperature Range:
Applications include signal gating, chopping, modulation-40°C to +125°Cor demodulation (modem), and signal multiplexing for
analog-to-digital

2 APPLICATIONS

anddigital-to-analog

conversion

systems.

Video Switching

Relay Replacements

USB SwitchingBattery-Operated Equipment

Cell Phones

Device Information (1)PART NUMBER

PACKAGEBODY SIZE (NOM)

RS2259B

TSSOP165.00mm×4.40mm(1)

For all available packages, see the orderable addendum at the endof the data sheet.

4 FUNCTIONAL BLOCK DIAGRAM
IN1COM1NO1COM2NO2IN2IN3COM3NO3COM4NO4IN4REV C.31 / 15

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RS2259B
Table of Contents
1 FEATURES ............................................................................................................................................................................... 12 APPLICATIONS ...................................................................................................................................................................... 13 DESCRIPTIONS ...................................................................................................................................................................... 14 FUNCTIONAL BLOCK DIAGRAM ..................................................................................................................................... 15 REVISION HISTORY ............................................................................................................................................................. 36 PACKAGE/ORDERING INFORMATION (1) ..................................................................................................................... 47 PIN CONFIGURATIONS ...................................................................................................................................................... 5
7.1 Pin Description ................................................................................................................................................................ 5
7.2 Function Table ................................................................................................................................................................. 58 SPECIFICATIONS ................................................................................................................................................................... 6
8.1 Absolute Maximum Ratings .......................................................................................................................................... 6
8.2 ESD Ratings ...................................................................................................................................................................... 6
8.3 Recommended Operating Conditions ......................................................................................................................... 6
8.4 Electrical Characteristics ................................................................................................................................................ 78.5 Typical Characteristics ................................................................................................................................................... 99 PARAMETER MEASUREMENT INFORMATION ........................................................................................................1010 PACKAGE OUTLINE DIMENSIONS .............................................................................................................................1311 TAPE AND REEL INFORMATION .................................................................................................................................142 / 15

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RS2259B
5 REVISION HISTORY
Note: Page numbers for previous revisions may different from page numbers in the current version.
VERSION

Change Date

C.2.1

2024/03/07

C.3

2024/05/06

Change Item
1. Added the TAPE AND REEL INFORMATION
2. Change Thermal Information on Page 3@RevC.2
3. Modify packaging naming
1. Add MSL on Page 5@RevC.2.1
2. Add Package thermal impedance on Page 4@RevC.2.1
3. Update PACKAGE note

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RS2259B
6 PACKAGE/ORDERING INFORMATION (1)PRODUCT
RS2259B

ORDERING
NUMBER
RS2259BXTSS16

TEMPERATURE
RANGE-40°C ~125°C

PACKAGELEADTSSOP16

PACKAGEMARKING (2)RS2259B

MSL (3)

PACKAGE OPTIONMSL3Tape and Reel, 4000

NOTE:
(1) This information is the most current data available for the designated devices. This data is subject to change without notice and revisionof this document. For browser-based versions of this data sheet, refer to the right-hand navigation.
(2) There may be additional marking, which relates to the lot trace code information (data code and vendor code), the logo or theenvironmental category on the device.
(3) MSL, The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications.

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RS2259B
7 PIN CONFIGURATIONS(TOP VIEW)
16 IN4

COM1 215 COM4

NO1 3N.C 4

GND 5
NO2 6
COM2 7RS2259B

IN1 1IN2 814 NO413 VCC
12 N.C
11 NO310 COM39 IN3TSSOP16

7.1 Pin Description
NAMEPIN

FUNCTION

VCC13Power Supply

GND

5GroundINx

1,8,9,16

Digital Control Pin

COMx

2,7,10,15

Common Terminal

NOx

3,6,11,14

Normally-Open Terminal

N.C

4,12

No internet connection

7.2 Function Table
INxNOx1All Channels ON0

All Channels OFF

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RS2259B
8 SPECIFICATIONS
8.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted) (1)SYMBOLPARAMETER

MIN

MAX

V+

Supply Voltage

-0.3

6VIN

Input Voltage (All inputs)-0.3(V+)+0.3

IIN

Continuous Current COM or NO-500+500

IPEAK

Peak Current COM or NO-800+800

θJAPackage thermal impedance (2)TJJunction Temperature (3)-40150Tstg

Storage temperature-65+150TSSOP1645UNIT
VmA°C/W°C(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond thosespecified is not implied.
(2) The package thermal impedance is calculated in accordance with JESD-51.
(3) The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (T J(MAX) - TA) / RθJA. All numbers apply for packages soldered directly onto a PCB.

8.2 ESD Ratings
The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only.

V(ESD)

Electrostatic discharge

VALUEUNIT

Human-Body Model (HBM)±1000

VMachine Model (MM)

±100

V

ESD SENSITIVITY CAUTION
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its publishedspecifications.

8.3 Recommended Operating Conditions
Over operating free-air temperature range (unless otherwise noted)
SYMBOLPARAMETER

MIN

MAX

UNIT

VCC

Supply Voltage

1.85.5VTA

Operating temperature-40+125°C

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RS2259B
8.4 Electrical Characteristics
VCC = 5.0 V, TA= -40°C to 125°C (unless otherwise noted)
PARAMETERSYMBOL

CONDITIONSVCCTAMIN(2) TYP(3) MAX(2) UNIT

ANALOG SWITCH
Analog Signal Range

On-Resistance

On-Resistance Match
Between Channels

On-Resistance Flatness

VCOM, VNO

RON

ΔRON

RFLAT(ON)NO, COM OFF
INO(OFF), ICOM(OFF)Leakage Current
NO, COM ON
INO(ON), ICOM(ON)Leakage Current
DIGITAL CONTROL INPUTS (1)Input High Voltage

VIH

Input Low Voltage

VIL

Input Leakage Current

IIN

FULL
VNO = VCC/2,
ICOM= -10mA, Switch ON,
See Figure 4

VNO = VCC/2,
ICOM = -10mA, Switch ON,
See Figure 40 ≤ (VNO) ≤VCC/2,
ICOM = -10mA, Switch ON,
See Figure 4
VCOM = 0.3V, VCC/2 VNO =VCC/2, 0.3V See Figure 5
VCOM = 0.3V, Open VNO =Open, 0.3V See Figure 6

VIN = VIO or 05V
3.3V
5V

0+25°C

0.6

FULL
+25°C

1.0

FULL
+25°C

0.04

FULL

1.0

Ω

1.2

Ω

1.5

Ω

1.7

Ω

0.1

Ω

0.12

Ω

0.1

Ω
Ω

0.3

Ω

0.4

Ω

0.7

Ω

FULL

0.8

Ω

1.8 to 5.5V

FULL

1

μA

1.8 to 5.5V

FULL

1

μA

5V

FULL

1.5

V

3.3V

FULL

1.3V

5V
3.3V

0.04

V

0.12

3.3V

+25°C

VCC

FULL
+25°C

0.18

FULL+25°C

0.545V

FULL

0.6V

3.3V

FULL

0.5V

1.8 to 5.5V

FULL

1μA

(1) All unused digital inputs of the device must be held at VIO or GND to ensure proper device operation.
(2) Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlations using statisticalquality control (SQC) method.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may varyover time and will also depend on the application and configuration.

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RS2259B
Electrical Characteristics (continued)
VCC = 5.0 V, TA= -40°C to 125°C (unless otherwise noted)
PARAMETERSYMBOL

CONDITIONS

VCC

TAMIN

TYP MAX UNIT

DYNAMIC CHARACTERISTICS
5V

Turn-On TimetON

VNO = VCC, RL = 300Ω, CL = 35pF,
See Figure 7

Turn-Off TimetOFF

VNO = VCC, RL = 300Ω, CL = 35pF,
See Figure 7

3.3V

Break-Before-Make
Time DelaytBBM

VNO = 3V, RL = 300Ω, CL = 35pF,
See Figure 8

3.3V

Off Isolation

OISO

RL = 50Ω, Switch OFF,See Figure 10BW

Switch ON, RL = 50Ω
See Figure 9-3dB Bandwidth

3.3V
5V
5V

8 / 15ns1710+25°C

ns11-68

dB

f = 1MHz+25°C-86

dB+25°C

30MHz+25°C

80

pF

+25°C

350

pF

FULL
VIN = GND or VCC

15+25°C

+25°C

VCC
ICC

ns50

f = 10MHz

NO, COM OFF
CNO(OFF), CCOM(OFF) VNO=VCC/2 or GND, Switch OFF
Capacitance
NO, COM ON
CNO(ON), CCOM(ON) VNO=VCC/2 or GND, Switch ON
Capacitance
POWER REQUIREMENTS
Power Supply Range
Power SupplyCurrent

50+25°C5.5VFULL

1.8

5.5

V

1μA

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RS2259B
8.5 Typical Characteristics
NOTE: The graphs and tables provided following this note are a statistical summary based on a limited number of samples
and are provided for informational purposes only.
33

V+=3V

0

Gain(dB)Gain(dB)

0

V+=5V-3-6-3-6-90

110-9

100

Frequency(MHz)01

10Figure 1. Bandwidth vs Frequency

Figure 2. Bandwidth vs Frequency

10Ron(Ω)

100

Frequency(MHz)V+=5.5V
V+=4V
V+=3.3V
V+=2.5V
V+=1.8V
VIN = 0V to V+10.100.5

11.5

22.5

33.5

44.5

55.5

Input Voltage(V)Figure 3. Typical Ron as a Function of Input Voltage

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RS2259B
9 PARAMETER MEASUREMENT INFORMATION
V

ICOM
NOx

COMx

RON=V/ICOM
VNO

Figure 4. ON-State Resistance (RON)
V DD

VDD

VDD

VDD

INO (OFF)ICOM (OFF)

COM1

NO1

A

A

NO1

COM1

VCOM

VCOM VNOVNO

INO (OFF)ICOM (OFF)COM4NO4A

A

NO4COM4

VCOMVNO

VNO

VCOM
GND

GND

Figure 5. OFF-State Leakage Current (ICOM (OFF), INO (OFF))

VDD

VDD
VDD
N.C.

AA

VCOM

NO4COM4

COM1N.C.

NO4

COM4

N.C.

INO (ON)AA

VCOM

NO1VNOICOM (ON)
N.C.

VDD

INO (ON)ICOM (ON)COM1

NO1VNO
GND

GND

Figure 6. ON-State Leakage Current (ICOM (ON), INO (ON))

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RS2259B
VDD

0.1μ F
VDD
ADDRESStr < 5ns
DRIVE(V IN )

VDD

tf < 5ns

VIH

VIL

0V

NO1

V NO

COM1

OUTPUT
CL

RL
tON

tOFF
NO4

V NO

90%

COM4

IN1 - IN4OUTPUT
VIN

10%

OUTPUT
RL

CL

GND

0V

Figure 7. Turn-On (tON) and Turn-Off Time (tOFF)
0.1μ F
VDD

VDD

VIH

VIN

VIL0V
OUTPUT 2VNO
90%

NO1, NO4 COM1, COM4 OUTPUT 190%

RL0V
OUTPUT 1

VDD

90%

90%

tBBM10V
tBBM=min(tBBM1,tBBM2)

tBBM2

VNO

CL

NO2, NO3 COM2, COM3 OUTPUT 2RL

CLIN1 - IN4
GND

VIN

Figure 8. Break-Before-Make Time (tBBM)
V DD
0.1µF

VDD

VNO

NO

NETWORKANALYZER50ΩVSIGCOM

VOUT
RL50Ω

GND

Figure 9. Bandwidth (BW)11 / 15

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RS2259B
0.1µF

VDD

NETWORKANALYZER

VNO50ΩNO

VSIGCOM
VOUT
RL
50Ω

NOX/COMX
GND

RL50ΩOff Isolation=20*Log(VOUT/VNO)

Figure 10. OFF Isolation (OISO)VDDNETWORKANALYZER
VOUT

0.1µF

VDD

RL50Ω

VNO

NO1COM1NO2COM2RL50Ω
RL50 Ω50Ω

NOX/COMXVSIG = 200mVpp
VBIAS = V DD / 2RL50Ω

GND

Figure 11. Crosstalk (XTALK)
VDD

0.1 μ F

VDD
VDD
VIN
VNO

0V

COM1 OUTPUTVNO1OUT

CL

OutputVNO

QC= C L ×

VOUT

VOUTVNO

COM4 OUTPUTVNO4OUTIN1 - IN4VIN

CL

GND

Figure 12. Charge Injection (QC)12 / 15

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RS2259B
10 PACKAGE OUTLINE DIMENSIONSTSSOP16 (3)
eE1b

5.94

E

1.78
D

0.65

0.42

RECOMMENDED LAND PATTERN (Unit: mm)
A2

H

CA
A1

θ

L

SymbolDimensions In Millimeters

Dimensions In Inches

MinMin

Max

A (1)

Max

1.200

0.047

A1

0.050

0.150

0.002

0.006

A2

0.800

1.050

0.031

0.041

b0.190

0.300

0.007

0.012

c0.090

0.200

0.004

0.008

D (1)

4.860

5.100

0.191

0.201

E (1)

4.300

4.500

0.169

0.177

E1

6.200

6.600

0.244

0.260

0.650(BSC) (2)

eL

0.500

Hθ

0.026(BSC) (2)
0.700

0.02

0.250 TYP
1°

0.028
0.010 TYP

7°

1°7°

NOTE:
1. Plastic or metal protrusions of 0.15mm maximum per side are not included.
2. BSC (Basic Spacing between Centers), "Basic" spacing is nominal.
3. This drawing is subject to change without notice.

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RS2259B
11 TAPE AND REEL INFORMATIONREEL DIMENSIONSTAPE DIMENSION

ReelDiameter

Reel Width(W1)

DIRECTION OF FEEDNOTE: The picture is only for reference. Please make the object as the standard.

KEY PARAMETER LIST OF TAPE AND REEL
Package TypeTSSOP16

Reel
Diameter
13’’Reel
Width(mm)12.4

A0(mm)
6.90

B0(mm)
5.60

K0(mm)
1.20

P0(mm)
4.0

P1(mm)
8.0

P2(mm)
2.0W(mm)12.0

Pin1
Quadrant
Q1

NOTE:
1. All dimensions are nominal.
2. Plastic or metal protrusions of 0.15mm maximum per side are not included.

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RS2259B
IMPORTANT NOTICE AND DISCLAIMER
Jiangsu RUNIC Technology Co., Ltd. will accurately and reliably provide technical and reliability data (includingdata sheets), design resources (including reference designs), application or other design advice, WEB tools, safety
information and other resources, without warranty of any defect, and will not make any express or implied
warranty, including but not limited to the warranty of merchantability Implied warranty that it is suitable for a
specific purpose or does not infringe the intellectual property rights of any third party.
These resources are intended for skilled developers designing with RUNIC products You will be solely
responsible for: (1) Selecting the appropriate products for your application; (2) Designing, validating and testing
your application; (3) Ensuring your application meets applicable standards and any other safety, security or otherrequirements; (4) RUNIC and the RUNIC logo are registered trademarks of RUNIC INCORPORATED. All
trademarks are the property of their respective owners; (5) For change details, review the revision history
included in any revised document. The resources are subject to change without notice. Our company will not beliable for the use of this product and the infringement of patents or third-party intellectual property rights due
to its use.

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