DIGITAL PRESSURE SENSOR
AS77-02BA-04 DATASHEETDATASHEET
AS77-02BA-04

1 / 19Rev0.01
Feb/22/2021

DIGITAL PRESSURE SENSOR
AS77-02BA-04 DATASHEETHistory of Revision

Datasheet
Date
Rev.
00
Oct/12/2019
01
Feb/22/2021

Note
Draft

Released

2 / 19Rev0.01
Feb/22/2021

DIGITAL PRESSURE SENSOR
AS77-02BA-04 DATASHEET

3 / 19Rev0.01
Feb/22/2021

CONTENTS
1. OVERVIEW…………………………………………………………………………………………………4
1.1Features ……………………………………………………………………………………………………………………4
1.2Applications ……………………………………………………………………………………………………………….4
1.3Descriptions ………………………………………………………………………………………………………………4
1.4Block Diagram ……………………………………………………………………………………………………………5
2. Electrical Specifications …………………………………………………………………………………………………...5
2.1 Pressure and Temperature Characteristics ……………………………………………………………………5
2.2 Electrical Characteristics …………………………………………………………………………………………….6
2.3 Absolute Maximum Rating ……………………………………………………………………………………………7
3. Function Descriptions ……………………………………………………………………………………………………….7
3.1 General Description …………………………………………………………………………………………………….7
3.2 Factory Calibration …………………………………………………………………………………………………………7
3.3 Sensor Output Conversion …………………………………………………………………………………..…………..7
3.4 Serial Interface………………………………………………………………………………………………………………7
4. REGISTERS …………………………………………………………………………………………………………………….8
4.1. NORMAL REGISTERS ………………………………………………………………………………………………….8
4.2 OTP REGISTERS ………………………………………………………………………………………………………….9
5. High-Speed I²C Digital Output Interface ………………………………………………………………………………9

5.1 I²C Specification ……………………………………………………………………………………………………….…..95.2 I²C Device Address ………..………………………………………………………………………………………….…10
5.3 I²C Protocol………………………………………………………………………………………………………..….……11
6. SPI INTERFACE …………………………………………………………………………………………………………….13
6.1 INTERFACE SPECIFICATION ……………………………………………………………………………………….13
6.2 SPI Protocol………………………………………………………………………………………………………….……..14
7. Application Circuit ………………………………………………………………………………………………………………15
7.1 I²C Interface …………………………………………………………………………………………………………….15
7.2 SPI Interface ……………………………………………………………………………………………………………15
8. Package Outline and Pin Configuration………………………………………………………………………………….16
9. Recommended Pad Layout…………………………………………………………………………………………………16
10. Shipping Package……………………………………………………………………………………………………………17
11. Soldering Recommendation………………………………………………………………………………………………18
12. Legal Disclaimer……………………………………………………………………………………………19

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AS77-02BA-04 DATASHEET

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1. OVERVIEW

1.1 Features• High resolution module, 3 Pa
• Supply voltage: 1.8V to 5.5V
• Operating range:300 to 2000 mbar, -40 to +85℃
• Integrated digital pressure sensor (24-bit ADC)
• Excellent long-term stability• Standby current<0.2μA @ 25°C
• No external components (Internal oscillator)• High-speed I²C digital output interface• Size: 6.8 x 6.2 x 3.2 mm

1.2 Applications• Liquefied Petroleum Gas (LPG)Pressure
Measurement（Optional）• Compressed Nature Gas (CNG)Pressure
Measurement （Optional）• Water Proof Pressure Measurement• Adventure and Sports Equipment

1.3 Descriptions
The AS77-02BA-04 employs a MEMS pressure sensor with an I²C interface to provide accurate
temperature, pressure data. The sensor pressure and temperature outputs are digitized by a highresolution 24-bit ADC. Data compensation is integrated internally to save the effort of the external host
MCU system. Pressure output can be resolved with output in fractions of Pascal. Package is surface mountwith a stainless-steel cap and is RoHS compliant.

Sensor Performances (VDD = 3.3 V)
Pressure
Range

Min

Typ.

300

Max

Unit

2000

mbar

ADC

24

bit

Resolution

3

Pa

Accuracy@25°C (500 to2000 mbar)

-0.2%

+0.2%

FS

Accuracy@0°C to 50°C (300 to 2000mbar)

-0.4%

+0.4%

FS

Response time@ OSR=1024

2.5

ms

Long term stability

±0.1%

FS/yr

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1.4 Block Diagram

Figure 1: Functional Block Diagram

2. Electrical Specifications
2.1 Pressure and Temperature Characteristics
Table1: Pressure Output Characteristics @ VDD = 3.3V, T = 25°C unless otherwise noted
Parameter

SymbolConditions

Min

Operating Pressure Range

PFS

Full Accuracy

Extended Pressure Range

Pext

Absolute Accuracy

Typ

Max

Unit

300

2000

mbar

Linear Range of ADC

10

2600

mbar

at 25°C, 500 to 2000 mbar
at 0..50°C, 300..2000 mbar

-0.2%
-0.4%

+0.2%
+0.4%

FS

3

Pa

±0.1%

FS/yr

Resolution RMS
Long Term Drift

After a period of 1 year

(1) The long-term stability is measured with non-soldered devices.
(2) Reflow soldering impact ±1.5 mbar.
(3) Recovering time after reflow (Time to recover at least 80% of the reflow impact) 5 days.
Table2: Temperature Output Characteristics @ VDD = 3.3V, T = 25°C unless otherwise noted
Parameter

SymbolOperation Temperature Range

TOP

Temperature Absolute Accuracy
Temperature Absolute Accuracy
Temperature Resolution of
Output Data

Conditions

Min

Typ

Max

Unit

-40

25

85

℃

25℃

-0.8

0.5

+0.8

℃

0℃ to +50℃

-2

1

+2

℃

-40℃ to + 85℃

-2.5

1.5

+2.5

℃

0.01

℃

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2.2 Electrical Characteristics
Table3: DC Characteristics @VDD=3.3 V, T=25℃ unless otherwise noted
Parameter

SymbolOperation Supply Voltage

Conditions

Min

Typ

Max

Unit

VDD

1.8

3.3

5.5

V

Operation Temperature

TOP

-40

85

℃

Supply Current @25°C on
during conversion

IBDD_pga on

PGA on (Gain>=4)
OSR

Conversion time

Tc

OSR

1.8

32768
16384
8192
4096
2048
1024
512
256
32768
16384
8192
4096
2048
1024
512
256

43.0
35.0
12.0
7.0
4.0
2.5
2.0
2.0
77.4
63.0
21.6
12.6
7.2
5.4
3.6
3.6

mA

ms

Supply current(1 sample per sec.)

Idd

Standby Supply Current

IDDSTB

At25℃

0.1

0.2

μA

Serial Data Clock Frequency

fSCLK

I2C protocol, pullup resistor of
4k7~10k

100

400

kHz

Digital Input High Voltage

VIH

Digital Input Low Voltage

VIL

Digital Output High Voltage

VOH

IO=0.5mA

Digital Output Low Voltage

VOL

IO=0.5mA

Input Capacitance

CIN（1）Standard Product. Could be customized.

uA

0.8

V
0.2

0.9

V
V

0.1
4.7

V
pF

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2.3 Absolute Maximum Rating
Table4: Absolute Maximum Rating
Parameter

SymbolConditions

Min

Typ

Max

Unit

10

bar

Overpressure

PMA

Supply Voltage

VDD

-0.3

5.5

V

Interface Voltage

VIF

-0.3

VDD+0.3

V

TSTG

-40

125

℃

250

℃

Storage Temperature
Range
Maximum Soldering
Temperature
ESD Rating

TMS

40 second maximum
Human body model

-2

+2

kV

At 85℃

-100

100

mA

Latch-up Current

Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. Thisis a stress rating only and functional operation of the device under these conditions is not implied. Exposure to
maximum rating conditions for extended periods may affect device reliability.

3. Function Descriptions
3.1 General Description
The AS77-02BA-04 consists of a piezo-resistive sensor and a sensor interface I²C. The main function of the I²C
is to convert the uncompensated analogue output voltage from the piezo-resistive pressure sensor to a 24-bit
digital value, as well as providing a 16-bit digital value for the temperature of the sensor, and compensates themby a patented algorithm. The fully-compensated values can be read out by external MCU.

3.2 Factory Calibration
Every sensor is individually factory calibrated for sensitivity and offset for both of the temperature and pressure
measurements, further calibrations are not necessary to be done by the user. The OTP registers are used to store
the configurations and calibration coefficients for the sensor.

3.3 Sensor Output Conversion
For each pressure measurement, customer used to send a conversion command to the sensor, read back theconversion data from the normal register to be stored from 0x06 to 0x0a, the pressure data is stored from 0x06
to 0x08, the highest bit is sign bit, the temperature data is stored from 0x09 to 0x0a, the highest bit is sign bit .
All the data are sent starting from the MSB.

3.4 Serial Interface
The AS77-02BA-04 provides both SPI and I²C interface for serial communication and ‘CSB’ pin is used to switch
between these two protocols. Pulling ‘CSB’ pin low selects the SPI interface, leaving ‘CSB’ pin float or puling ithigh selects the I²C interface.
PIN CSB
Float
Low

MODE
I2C
SPI

PIN USED
SDA, SCL
SDI, SDO, SCKNOTEDefault 3SPIDIGITAL PRESSURE SENSOR
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4. REGISTERS
All the registers can be departed into normal registers and OTP registers. The normal registers are used tosend a conversion command to the Sensor, read back the conversion data and perform the OTP blowing.
The OTP registers are used to store the configurations and calibration coefficients for the Sensor, whose
default values can be programmed by the inside OTP banks.
4.1. NORMAL REGISTERS
Table4.1 normal registers
Addr
0x00

Description
SPI _Ctrl

R/W
RW

0x01
0x02
0x06
0x07
0x08
0x09
0x0A
0x30

Part_ID
Status
DATA_MSBDATA_CSBDATA_LSB
TEMP_MSBTEMP_LSB
CMD

R
R
R
R
R
R
R
RW

Bit7
Bit6
SDO_ac LSB_fi
tive
rst
PartID
Error_code
Data out[23:16]
Data out[15:8]
Data out[7:0]Temp out[15:8]
Temp out[7:0]
Sleep_time[3:0]

Bit5
Softreset

Bit4

Bit3

Bit2
SoftresetBit1
LSB_firs

Bit0
SDO_active

1’b0

DRDY

Default
0x00
0x00

Sco

Measurement_ctrl]2:0]

0x00
0x00
0x00
0x00
0x00
0x00

Reg0x00
SDO_active: 1: 4-wire SPI, 0: 3-wire SPI
LSB_first: 1: LSB first for SPI interface, 0: MSB first for SPI interface
Soft_reset: 1: Reset all the NSA2300 registers (except ‘margin’), automatically come back to 0
after reset complete.
Reg0x01
PartID: OTP programmed 8 bits Part ID, corresponding to OTP register Reg0xA4. Read only fromthe address 0x01.
Reg0x02
DRDY：1, indicates once conversion complete, and the output data is ready for reading.
Error_code: When diagnostic function enabled, These bits stores the error information.
Error_code[3]: VINP short to VDD
Error_code[2]: VINP short to GND
Error_code[1]: VINN short to VDD
Error_code[0]: VINN short to GND
Reg0x06-Reg0x08
Data_out: 24 bits ADC output data when ‘raw_data_on’ = 0 with an LSB equals to(1/2^23)*(VEXT-PSW). 24 bits calibrated data when ‘raw_data_on’ = 1.
Reg0x09-Reg0x0a
Temp_out: Temperature output with an LSB equals to (1/256) °C
Reg0x30
Sleep_time[3:0]: 0000:0ms, 0001:62.5ms, 0010:125ms ... 1111: 1s, only active during sleep
mode conversion.
Measurement_control: 000b, indicate a single shot temperature signal conversion. 001b, indicate
a single shot sensor signal conversion. 010b: indicate a combined conversion (once temperature
conversion immediately followed by once sensor signal conversion). 011b: indicate a sleep mode
conversion (periodically perform once combined conversion with an interval time of ‘sleep_time’),100b: OTP programming mode, enter this mode to when programming OTP banks.
Sco: 1, Start of conversion, automatically come back to 0 after conversion ends (except sleep
mode conversion).

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4.2 OTP REGISTERS
Table4.2 OTP registers
Addr
0xa4
0xa5
0xa6
0xa7

Description
Part_ID

Sys_config
P_config
T_config

R/W
RW
RW

Bit7

Bit6

Bit5

Bit4

Bit3

Bit2

Bit1

Bit0

Default
OTP
OTP

DIAG_onRW

OTP

OSR_P[2:0]
OSR_T[2:0]

RW

OTP

Reg0xA4
PartID: OTP programmed 8 bits Part ID, also can be read from address 0x01.
Reg0xA5
Diag_on: 1, Enable diagnosis function.
Reg0xA6
OSR_P: set the over sampling ratio of the sensor signal conversion channel. 000:1024X,
001:2048X, 010:4096X, 011:8192X, 100:256X, 101:512X, 110:16384X, 111:32768X.
Reg0xA7
OSR_T: set the over sampling ratio of the temperature conversion channel. 000:1024X,
001:2048X, 010:4096X, 011:8192X, 100:256X, 101:512X, 110:16384X, 111:32768X.

5. High-Speed I²C Digital Output Interface
The I²C interface is fully compatible to the official I²C protocol specification.

5.1 I²C Specification
Table5: I²C Slave Timing Values
Parameter

SymbolConditions

I²C
Min

Typ

Max

Unit

Clock frequency

fBsclBSCL low pulse

tBLOWB

1.3

kHz
µs

SCL high pulse

tBHIGHB

0.6µs

SDA setup time

tBSUDATB

0.1µs

SDA hold time

tBHDDATB

0.0µstBSUSTAB

0.6µstBHDSTAB

0.6µstBSUSTOB

0.6µs

tBBUFB

1.3µs

Setup Time for arepeated start
condition
Hold time for a start
condition
Setup Time for a stop
condition
Time before a newtransmission can start

400

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Figure 2: I²C Timing Diagram
The I²C interface protocol has special bus signal conditions. Start (S), stop (P) and binary data conditions are shown
below. At start condition, SCL is high and SDA has a falling edge. Then the slave address is sent. After the 7 address bits,
the direction control bit R/W selects the read or write operation. When a slave device recognizes that it is being
addressed, it should acknowledge by pulling SDA low in the ninth SCL (ACK) cycle.
At stop condition, SCL is also high, but SDA has a rising edge. Data must be held stable at SDA when SCL is high. Data canchange value at SDA only when SCL is low.

Figure 3: I²C Protocol

5.2 I²C Device Address
The I²C device address is shown below. The LSB of the device address is corresponding to address 0XDA (write)
and 0XDB (read).

A7

A6

A5

A4

A3

A2

A1

W/R

1

1

0

1

1

0

SDO/ADDR

0/1

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5.3 I²C Protocol
5.3.1 P_Config

S

From master to slave

S

Start

A

ACK

From slave to master

P

Stop

N

NACK

SlaveAddr

0

ARegisterA

Config_Data

A

PRegister=0XA6
Config_Data:
Address

Description

R/W

0xA6

P_CONFIG

RW

Bit7

Bit6

Bit5

Bit4

Bit3

Bit2

No change

Bit1

Bit0

OSR_P<2:0>

default
OTP

OSR_P: set the over sampling ratio of the sensor signal conversion channel. 000:1024X, 001:2048X, 010:4096X,
011:8192X, 100:256X, 101:512X, 110: 16384X, 111:32768X.
5.3.2 T_Config

S

From master to slave

S

Start

A

ACK

From slave to master

P

Stop

N

NACK

SlaveAddr

0

ARegisterA

Config_Data

A

PRegister=0XA7
Config_Data:
Address

Description

R/W

0xA7

T_CONFIG

RW

Bit7

Bit6

Bit5

Bit4

Bit3

No change

Bit2

Bit1

Bit0

OSR_T<2:0>

default
OTP

OSR_T: set the over sampling ratio of the sensor signal conversion channel. 000:1024X, 001:2048X, 010:4096X,
011:8192X, 100:256X, 101:512X, 110: 16384X, 111:32768X.
5.3.3 Send Command

S

From master to slave

S

Start

A

ACK

From slave to master

P

Stop

N

NACK

A

CommandData

SlaveAddr

0

A

ComRegA

P

ComReg=0x30
CommandData:
Address

Description

R/W

Bit7

Bit6

0x30

CMD

RW

Sleep_time<3:0>

Bit5

Bit4

Bit3

Bit2

Bit1

Bit0

Sco

Measurement_ctrl<2:0>

default
OTP

Sleep_time<3:0>:0000:0ms, 0001:62.5ms,0010:125ms... 1111: 1s, only active during sleep mode
conversion.
Measurement_control<1:0>: 010b: indicate a combined conversion (once temperature conversion
immediately followed by once sensor signal conversion).
Sco: 1, Start of conversion, automatically come back to 0 after conversion ends (except sleep mode conversion).

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5.3.4 Read Status

S

From master to slave

S

Start

A

ACK

From slave to master

P

Stop

N

NACK

A

S

SlaveAddr

0

A

StatusReg

SlaveAddr

1

A

StatusA

P

StatusReg=0x02
Status:Address

Description

R/W

0x02

Status

R

Bit7

Bit6

Bit5

Bit4

Bit3

Bit2

Bit1

1’b0

Bit0
DRDY

DRDY：1, indicates once conversion complete, and the output data is ready for reading.
5.3.5 Read the Pressure & Temperature Values

S

From master to slave

S

Start

A

ACK

From slave to master

P

Stop

N

NACK

SlaveAddr

0

A

ComRegA

Read_T&P

A

P

1

A

Delay x ms waiting for conversion complete
S

SlaveAddr

0

AS

SlaveAddr

0 A

PressReg
A S
0x06

Send Read commond

StatusReg

A

S

SlaveAddr

SlaveAddr

Read Status

1 A

StatusA

P

PressData
PressData
PressData
TempData
TempData
A
A
A
A
N P
[23:16][15:8][7:0][15:8][7:0]

Judgement Status

Read Pressure & Temperature Data

Xms:
OSR_32768X_dl_ms 2*43
OSR_16384X_dl_ms 2*35
OSR_8192X_dl_ms 2*12
OSR_4096X_dl_ms 2*7
OSR_2048X_dl_ms 2*4
OSR_1024X_dl_ms 2*3
OSR_512X_dl_ms
2*2
OSR_256X_dl_ms
2*2
Pressure = PressData[23:0]/64;//Pa 1 bar productrange
1Bar 2Bar
6~10Bar11~20Bar 21~42Bar 43~83Bar
3、4、5Bar
divisor
64
32
16
8
4
2
1
If (TempData[15:0]&0x8000)//temperature<0{Temperature1 = (0x8000 - TempData[15:0]&0x7fff)/256;// Integral part ℃
Temperature2 = ((0x8000 - TempData[15:0]&0x7fff)&0xff)*100/256;// decimal part ℃}
Else //temperature>0{
Temperature1 = TempData[15:0]/256; // Integral part ℃
Temperature2 = (TempData[15:0]&0xff)*100/256; // decimal part ℃}

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6. SPI INTERFACE
provides both SPI and I2C interface for serial communication and ‘CSB’ pin is used to switch between these two
protocols. Pulling ‘CSB’ pin low selects the SPI interface, leaving ‘CSB’ pin float or puling it high selects the I2C
interface.
6.1. INTERFACE SPECIFICATION
Table 6.1 SPI interface specifications
SymbolParameter
Condition
Min
Max
Unit
fBsclkB
Clock frequency
Max load on SDIO or SDO = 25pF
10
MHz
tBsclk_lB
SLCK low pulse
20
Ns
tBsclk_hB
SLCK high pulse
20
TBsdi_setupB
SDI setup time
20
ns
TBsdi_holdB
SDI hold time
20
ns
TBsdo_odB
SDO/SDI output delay
Load = 25pF
30
ns
Load = 250pF
40
ns
TBcsb_setupB
CSB setup time
20
ns
TBcsb_holdB
CSB hold time
40
ns
The figure below shows the definition of the SPI timing given in table 5.1

Figure 6.1 SPI timing diagram
The falling edge of CSB, in conjunction with the rising edge of SCLK, determines the start of framing. Once thebeginning of the frame has been determined, timing is straightforward. The first phase of the transfer is the
instruction phase, which consists of 16 bits followed by data that can be of variable lengths in multiples of 8 bits.
If the device is configured with CSB tied low, framing begins with the first rising edge of SCLK. The instruction
phase is the first 16 bits transmitted. As shown in Figure 5.2, the instruction phase is divided into a number of bit
fields.

Figure6.2, Instruction Phase Bit Field.

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The first bit in the stream is the read/write indicator bit (R/W). When this bit is high, a read is being requested,otherwise indicates it is a write operation. W1 and W0 represent the number of data bytes to transfer for either
read or write (Table 5.2). If the number of bytes to transfer is three or less (00, 01, or 10), CSB can stall high onbyte boundaries. Stalling on a nonbyte boundary terminates the communications cycle. If these bits are 11, data
can be transferred until CSB transitions high.
CSB is not allowed to stall during the streaming process. The remaining 13 bits represent the starting address ofthe data sent. If more than one word is being sent, sequential addressing is used, starting with the one specified,and it either increments (LSB first) or decrements (MSB first) based on the mode setting.
Table6.2. W1 and W0 settings
W1:W0
ActionCSB stalling00
1 byte of data can be transferred.
Optional
01
2 bytes of data can be transferred.
Optional
10
3 bytes of data can be transferred.
Optional
11
4 or more bytes of data can be transferred. CSB must be held low
Nofor entire sequence; otherwise, the cycle is terminated.
Table6.2. W1 and W0 settings
Data follows the instruction phase. The amount of data sent is determined by the word length (Bit W0 and Bit W1).
This can be one or more bytes of data. All data is composed of 8-bit words. Data can be sent in either MSB-firstmode or LSB-first mode (by setting ‘LSB_first’ bit). On power up, MSB-first mode is the default. This can be changed
by programming the configuration register. In MSB-first mode, the serial exchange starts with the highest-order
bit and ends with the LSB. In LSB-first mode, the order is reversed. (Figure 5.3)

Figure6.3: MSB First and LSB First Instruction and Data Phases
Register bit ‘SDO_active’ is responsible for activating SDO on devices. If this bit is cleared, then SDO is inactive
and read data is routed to the SDIO pin. If this bit is set, read data is placed on the SDO pin. The default for this
bit is low, making SDO inactive.
6.2. SPI Protocol

6.2.1 SPI Write one byte
CMD:0X00
6.2.2 SPI Read one byte
CMD:0X80
6.2.3 SPI Read Sensor (Pressure and Temperature)
Send Read cmd(0x00)(0x30)(0x0A)

A WaitADC Read 0x06 Read 0x07 Read 0x08 Read 0x09 Read 0x0A

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7. Application Circuit
7.1 I²C Interface

7.2 SPI Interface

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8. Package Outline and Pin Configuration(unit：mm)

Figure 5: Package Outlines

Pin

Name

Type

Function

1

GND

G

Power Ground

2

VDD

P

Positive supply voltage

3

CSB

I

Chip select

4

ADR/SD0

I/O

Serial data output in 4-wire SPI mode
Address select in I²C mode
Serial data input/output in I2C mode (SDA)5

SDA/SDI/SDIO

I/O

Serial data input in 4-wire SPI mode (SDI)
Serial data input/output in 3-wire SPI mode (SDIO)

6

SCL

I

Serial data clock

Figure6: Pin Configuration and Description

9. Recommended Pad Layout (unit: mm)

Figure7: Pad layout

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10. Shipping Package(Tube)(Tape&Reel)

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11. Soldering Recommendation（IPC/JEDEC J-STD-020D）

IPC/JEDEC J-STD-020D

Pb-Free Assembly

Average Ramp-up rate（ TL-Tp）

3℃/s（Max.）

Preheat–Temperature Min. (Tsmin)–Temperature Max. (Tsmax)–Time (Min. to Max. ) (ts)

150℃
200℃
60-180 seconds

Tsmax to TL –Tp

3℃/s（Max.）

Time maintained above:–Temperature (TL)
–Time (tL)

217℃ above
60-150 seconds

Peak temperature (Tp)

240 ℃~245℃

Time of Real peak temperature within 5℃ (tp)

40 seconds

Average Ramp-down rate（ Tp-TL）

6℃/s（Max.）

Time 25℃ to peak temperature

8min.（Max.）

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12.LEGAL DISCLAIMER
1. For the export of products which are controlled items subject to foreign and domestic export laws andregulations, you must obtain approval and/or follow the formalities of such laws and regulations.
2. Products must not be used for military and/or antisocial purposes such as terrorism, and shallnot be supplied
to any party intending to use the products for such purposes.
3. Unless provided otherwise, the products have been designed and manufactured for application toequipment and devices which are sold to end-users in the market.

4. Before using products which were not specifically designed for use in automotive applications,please contact
an AIOT sales representative.
5. This specification is subject to change without notice.

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