RS8837

RS8837 Low-Voltage H-Bridge Driver
1 FEATURES•

3 DESCRIPTIONS

H-Bridge Motor Driver

The RS8837 is an integrated H-bridge driver designed- DC Motor or Other Loads

for dc motors and coils bi-directional turning. Usually- DFN2X2-8: HS+LS 250mΩ

used for small current driving, such as camera, smart- SOP8: HS+LS 320mΩ

locks, toys, smart sweeper, electromagnetic valve, and•

1.8A Maximum Drive Current

other low-voltage or battery-powered motion control•

Separate Motor and Logic Supply Pins:

applications.

- Motor VM: 0 to 14V- Logic VCC: 2.5V to 7V

The RS8837 can drive one DC motor or other devices

Low-Power Sleep Mode With 0.1μA TYP
Sleep Current

like solenoids, supply up to 1.8A maximum output•

VCC Under-Voltage Lockout

power MOSFET configured as an H-bridge to drive the•Over-Current Protection

motor winding. An internal charge pump generates•

Thermal Shutdown Protectionneeded gate drive voltages.

•

Lead-Free Packages: DFN2X2-8, SOP8•

current. The output driver block consists of N-channel

The RS8837 operates on a motor power supply voltage
from 0 to 14V, and a device power supply voltage of

2 APPLICATIONS

2.5V to 7V. Also provide internal shutdown functions•

DSLR Lenses•

Cameras•Robotics•

Consumer Products, such as Toys, Smart
Locks

•

Medical Devices

for over-current protection, short-circuit protection,
under-voltage lockout and over-temperature.

Device Information (1)PART
NUMBER
RS8837

PACKAGEBODY SIZE (NOM)DFN2X2-8

2.00mm×2.00mm

SOP8

4.90mm×3.90mm(1) For all available packages, see the orderable addendum at the endof the data sheet.

4 Typical Application Circuit
2.5V to 7V
VC C

0 V to 14V
VM

PWM

nSLEEPREV A.2.1

RS8837
Brushed DC
Motor Driver

1 / 18

1.8 A

M

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RS8837
Table of Contents
1 FEATURES ............................................................................................................................................................................... 1
2 APPLICATIONS ...................................................................................................................................................................... 1
3 DESCRIPTIONS ...................................................................................................................................................................... 1
4 Typical Application Circuit .................................................................................................................................................. 1
5 Revision History ..................................................................................................................................................................... 3
6 PACKAGE/ORDERING INFORMATION (1) ..................................................................................................................... 4
7 PIN CONFIGURATIONS ...................................................................................................................................................... 5
8 SPECIFICATIONS ................................................................................................................................................................... 6
8.1 Absolute Maximum Ratings .......................................................................................................................................... 6
8.2 ESD Ratings ...................................................................................................................................................................... 6
8.3 Recommended Operating Conditions ......................................................................................................................... 6
8.4 Electrical Characteristics ................................................................................................................................................ 7
8.5 Timing Requirements ...................................................................................................................................................... 8
8.6 Typical Characteristics ................................................................................................................................................... 9
9 DETAILED DESCRIPTION .................................................................................................................................................10
9.1 Overview .........................................................................................................................................................................10
9.2 Functional Block Diagram............................................................................................................................................10
9.3 Feature Description ......................................................................................................................................................109.3.1 Bridge Control ........................................................................................................................................................109.3.2 Sleep Mode .............................................................................................................................................................119.3.3 Power Supplies and Input Pins............................................................................................................................11
9.3.4 Protection Circuits .................................................................................................................................................11
9.3.5 VCC Undervoltage Lockout .................................................................................................................................11
9.3.6 Overcurrent Protection ........................................................................................................................................11
9.3.7 Thermal Shutdown ................................................................................................................................................11
9.4 Device Functional Modes ............................................................................................................................................11
10 Application and Implementation ...................................................................................................................................1210.1 Application Information .............................................................................................................................................1210.2 Typical Application .....................................................................................................................................................1210.3 Design Requirements .................................................................................................................................................1210.4 Detailed Design Procedure .......................................................................................................................................1210.4.1 Motor Voltage ......................................................................................................................................................1210.4.2 Low-Power Operation........................................................................................................................................12
11 Power Supply Recommendations ..................................................................................................................................13
11.1 Bulk Capacitance .........................................................................................................................................................13
12 Layout ...................................................................................................................................................................................1412.1 Layout Guidelines .......................................................................................................................................................1412.2 Layout Example ...........................................................................................................................................................1412.3 Power Dissipation .......................................................................................................................................................14
13 PACKAGE OUTLINE DIMENSIONS .............................................................................................................................15
14 TAPE AND REEL INFORMATION .................................................................................................................................16
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RS8837
5 Revision History
Note: Page numbers for previous revisions may different from page numbers in the current version.
VERSION

Change Date

Change Item

A.0

2023/03/09

A.1

2023/06/29

A.2

2023/08/23

A.2.1

2024/02/23

Initial version completed
1. Update VCC Operating Voltage
2. Update Electrical Characteristics
3. Update VM Operating Voltage
1. Update VM Operating Voltage
2. Update Electrical Characteristics
3. Update Typical Characteristics
Modify packaging naming

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RS8837
6 PACKAGE/ORDERING INFORMATION (1)PRODUCT
RS8837

ORDERING
NUMBERTEMPERATURE
RANGE

PACKAGE LEAD

PACKAGEMARKING (2)PACKAGE OPTION

RS8837YTDE8-40°C ~ +85°C

DFN2X2-8

8837

Tape and Reel,3000

RS8837YK-40°C ~ +85°C

SOP8

RS8837

Tape and Reel,4000

NOTE:(1) This information is the most current data available for the designated devices. This data is subject to change without notice and revisionof this document. For browser-based versions of this data sheet, refer to the right-hand navigation.
(2) There may be additional marking, which relates to the lot trace code information(include data code and vendor code)，the logo or theenvironmental category on the device.

4 / 18www.run-ic.com

RS8837
7 PIN CONFIGURATIONSTOP VIEWTOP VIEW
VCC

VM

1

OUT1

nSLEEP

OUT1

2

OUT2

IN1

OUT2
GND

IN2
SOP8

8

VCC

7

nSLEEP

3

6

IN1

4

5

IN2

ThermalPad

DFN2X2-8

Pin Description
NAME

PIN
SOP8/ DFN2X2-8

I/O (1)DESCRIPTION
Motor power supply
Bypass this pin to the GND pin with a 0.1μF ceramic capacitor rated for VM.

VM

1

I

OUT1

2

O

OUT2

3

O

Motor output
Connect these pins to the motor winding.

GND

4

-

Device ground (This pin must be connected to ground.)

IN2

5

I

IN2 input

IN1

6

I

nSLEEP

7

I

VCC

8

I

IN1 input
Sleep mode input. When this pin is in logic low, the device enters low-power
sleep mode. When this pin is logic high, the device operates normally.
Logic power supply
Bypass this pin to the GND pin with a 0.1μF ceramic capacitor rated for VCC.

(1)

I = Input, O = Output.

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RS88378 SPECIFICATIONS
8.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)(2)
MIN

MAX

VM

Motor power-supply voltage (3)

-0.3

16

VCC

Logic power-supply voltage

-0.3

7

nSLEEP

Control pin voltage

-0.5

7

IN1, IN2

Control pin voltage

-0.5

5.5

OUT1, OUT2Peak drive current

θJA

Package thermal impedance (4)Temperature
(1)

(2)
(3)
(4)
(5)

V

Internally limited 2.7A (TYP)DFN2X2-8

62

SOP8

UNIT

110.88Junction, TJ (5)

-40

150

Storage, Tstg

-60

150

A
°C/W
°C

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to the GND pin.
To protect the chip, the VM voltage should not exceed 16V under any operating conditions and the VM capacitance should be increased
to suppress spikes when using inductive loads.
The package thermal impedance is calculated in accordance with JESD-51.
The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (T J(MAX) - TA) / RθJA. All numbers apply for packages soldered directly onto a PCB.

8.2 ESD Ratings
The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only.
VALUE
V(ESD)

Electrostatic discharge

Human-body model (HBM), MIL-STD-883K METHOD 3015.9±4000

Charged-device model (CDM), ANSI/ESDA/JEDEC JS-002-2018±1500

Machine Model (MM), JESD22-A115C (2010)

±200

UNIT
V

ESD SENSITIVITY CAUTION
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its publishedspecifications.

8.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) (1).
Characteristics

Symbol

MIN

NOM

MAX

UNIT

Motor power supply voltage

VM

0

14

V

Logic power supply voltage

VCC

2.5

7

V

Motor peak current

IOUT

0

1.8

A

Externally applied PWM frequency

fPWM

0

250

KHz

Logic level input voltage

VLOGIC

-0.5

5.5

V

Operating Temperature

TA

-40

85

°C

(1) Power dissipation and thermal limits must be observed.

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RS8837
8.4 Electrical Characteristics
TA = +25°C, over recommended operating condition unless otherwise noted. (1)SYMBOLPARAMETER

TYP(3)

MAX(2)
14

V

VM=5V, VCC=3V, No PWM
VM=5V, VCC=3V, 50kHz
PWM

150

600

μA

510

600

μA

VM=5V, VCC=3V, nSLEEP = 0

0.1

1

μA

7

V

TEST CONDITIONMIN(2)UNIT

POWER SUPPLIES (VM, VCC)
VM
IVM

VM Operating Voltage
VM Operating Supply Current

VCC

VM Sleep Mode Supply
Current
VCC Operating Voltage

IVCC

VCC Operating Supply Current

IVMQ

VCC Sleep Mode Supply
Current
CONTROL INPUTS (IN1, IN2, nSLEEP)
IVCCQ

0

2.5
VM=5V, VCC=3V, No PWM
VM=5V, VCC=3V, 50kHz
PWM

260

350

μA

280

350

μA

VM=5V, VCC=3V, nSLEEP = 0

0.1

1

μA

Input Logic-High Voltage
Rising ThresholdnSLEEP

1.3

IN1, IN2

0.7×VCC

VIL

Input Logic-Low Voltage
Falling ThresholdnSLEEP

0.8

V

IN1, IN2

0.3×VCCV

IIL

Input Logic Low Current

VIN=0V

1μA

IIH

Input Logic High Current

VIN=3.3V

RPD

Pulldown Resistance

VIH

MOTOR DRIVER OUTPUTS (OUT1, OUT2)
HS + LS FET On-ResistanceDFN2X2-8
RDS(ON)HS + LS FET On-Resistance
SOP8
IOFF
Off-State Leakage Current

V
V

30

VM=5V, VCC =3V, IO=0.8A,
TJ =25°C
VM=5V, VCC =3V, IO=0.8A,
TJ =25°C
VOUT = 0V

μA

100

110

kΩ

250

500

mΩ

320

500

mΩ

200

nA

-200

PROTECTION CIRCUITS
VUVLO
IOCP
tDEG
tRETRYTTSD
TRES

VCC Undervoltage Lockout
Overcurrent Protection Trip
Level
Overcurrent Deglitch Time
Overcurrent Retry Time
Thermal Shutdown
Temperature
Thermal Resume Temperature

VCC rising

2.2

V

VCC falling

2.0

V

2.7

A

VM=5V, VCC =3V

2.05

VM=5V, VCC =3V

1

μs

VM=5V, VCC =3V

1.2

ms

TJ temperature

160

°C

120

°C

NOTE:
(1) Electrical table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device.
(2) Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlations using statisticalquality control (SQC) method.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may varyover time and will also depend on the application and configuration.

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RS8837
8.5 Timing Requirements
TA=25°C，VM=5V, VCC=3V，RL=20Ω between OUT1 and OUT2.
NUM

PARAMETER

1

t1

2

t2

3

t3

4

t4

5

t5

6

t6

tWake

tWake

MIN(2)TEST CONDITION
Output enable timeIN1 high and IN2 low to OUT1=0.97×VM
Output disable timeIN1 low and IN2 low to OUT2=0.9×VM
Delay time, INx high to OUTx highIN1 low IN2 high to OUT2=0.5×VM
Delay time, INx low to OUTx low
IN1 low IN2 low to OUT1=0.5×VM
Output rise time
OUT1=0.2×VM to OUT1=0.8×VM
Output fall time
OUT2=0.8×VM to OUT1=0.2×VM
Wake time, nSLEEP rising edge to part active

TYP(3)

MAX(2)

UNIT

285

ns

170

ns

125

ns

110

ns

165

ns

40

ns

9

us

IN

IN

nSLEEPnSLEEP
VM

VM

VCC

VCC

Figure 1. power-on sequence

Figure 2. power-down sequence

IN1

IN2
t1
Z

Z

OUT1

t4

t3 t2
Z

Z

OUT2

80%

80%

OUTx
20%

20%

t5

t6

Figure 3. Input and Output Timing for RS8837

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RS8837
8.6 Typical Characteristics
NOTE: The graphs and tables provided following this note are a statistical summary based on a limited number of samples
and are provided for informational purposes only.
At TA = +25℃, unless otherwise noted.
20

VM=3V
VM=5V
VM=11V

180
160
140

VCC Sleep Current (nA)

VM Sleep Current (nA)

200

120
100
80
60

40
20

VCC=3V
VCC=5V
VCC=7V

18
16
14
12
10
8
6

4
2

0

0
-40

-15

10

35

60

85

-40

-15

Temperature(℃)

Figure 4. 𝐈𝐕𝐌𝐐 vs Temperature

35

60

85

Figure 5. 𝐈𝐕𝐂𝐂𝐐 vs Temperature
10000

VCC Operating Current (uA)

10000

VM Operating Current (uA)10Temperature(℃)

1000

100

10

VM=3V
VM=5V
VM=11V

1
-40

-15

10

35

60

1000

100

10

VCC=3V
VCC=5V
VCC=7V1
85-40

Temperature(℃)

-15

10

35

60

85

Temperature(℃)

Figure 6. 𝐈𝐕𝐌 vs Temperature (50-kHz PWM)

Figure 7. 𝐈𝐕𝐂𝐂 vs Temperature (50-kHz PWM)

HS+LS Rds(on) (mΩ)

600
500
400
300
200

VM=2V,VCC=2.5V
VM=5V,VCC=3V
VM=11V,VCC=5V

100
0
-40

-15

10

35

60

85

Temperature(℃)

Figure 8. HS+LS 𝐑 𝐝𝐬(𝐨𝐧) vs Temperature
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RS8837
9 DETAILED DESCRIPTION
9.1 Overview
The RS8837 is an H-bridge driver that can drive one dc motor or other devices like solenoids. The outputs arecontrolled using either a PWM interface (IN1 and IN2). A low-power sleep mode is included, which can be
enabled using the nSLEEP pin.
These devices greatly reduce the component count of motor driver systems by integrating the necessary driver
FETs and FET control circuitry into a single device. In addition, the RS8837 adds protection features beyond
traditional discrete implementations: undervoltage lockout, overcurrent protection, and thermal shutdown.

9.2 Functional Block Diagram
0V to 1 4 V
VM
VM

VM

Gate
Drive

Charge
Pump

OUT1

OCP

2.5V to 7V
VCC

DCM
VM

VCC
Logic

Gate
Drive

OUT2

OCP

IN1

IN2

OverTemp

nSLEEP

Osc

GND

Figure 9. RS8837 Functional Block Diagram

9.3 Feature Description
9.3.1 Bridge Control
The RS8837 device is controlled using a PWM input interface, also called an IN-IN interface. Each output is
controlled by a corresponding input pin. Table 1 shows the logic for the RS8837 device.

Table 1. RS8837 Device LogicnSLEEP

IN1

IN2

OUT1

OUT2

FUNCTION (DC MOTOR)

0

X

X

Z

Z

Coast

1

0

0

Z

Z

Coast

1

0

1

L

H

Reverse

1

1

0

H

L

Forward

1

1

1

L

L

Brake

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RS8837
9.3.2 Sleep Mode
If the nSLEEP pin is brought to a logic-low state, the RS8837 enters a low-power sleep mode. In this state, allunnecessary internal circuitry is powered down.

9.3.3 Power Supplies and Input Pins
The input pins can be driven within the recommended operating conditions with or without the VCC, VM, orboth power supplies present. No leakage current path will exist to the supply. Each input pin has a weak pulldown
resistor (approximately 100 kΩ) to ground.
The VCC and VM supplies can be applied and removed in any order. When the VCC supply is removed, thedevice enters a low-power state and draws very little current from the VM supply. The VCC and VM pins can beconnected together if the supply voltage is between 2.5V and 7 V.
The VM voltage supply does not have any undervoltage-lockout protection (UVLO) so as long as VCC > 2.2 V;
the internal device logic remains active, which means that the VM pin voltage can drop to 0 V. However, theload cannot be sufficiently driven at low VM voltages.

9.3.4 Protection Circuits
The RS8837 is fully protected against VCC undervoltage, overcurrent, and overtemperature events.

9.3.5 VCC Undervoltage Lockout
If at any time the voltage on the VCC pin falls below the undervoltage lockout threshold voltage, all FETs in the
H-bridge are disabled. Operation resumes when the VCC pin voltage rises above the UVLO threshold.

9.3.6 Overcurrent Protection
An analog current-limit circuit on each FET limits the current through the FET by removing the gate drive. If thisanalog current limit persists for longer than tDEG, all FETs in the H-bridge are disabled. Operation resumes
automatically after tRETRY has elapsed. Overcurrent conditions are detected on both the high-side and low-side
FETs. A short to the VM pin, GND, or from the OUT1 pin to the OUT2 pin results in an overcurrent condition.

9.3.7 Thermal Shutdown
If the die temperature exceeds safe limits, all FETs in the H-bridge are disabled. After the die temperature falls
to a safe level, operation automatically resumes.

Table 2. Fault Behavior
FAULT

CONDITION

H-BRIDGERECOVERYVCC undervoltage

VCC < 2V

Disabled

VCC > 2.2V

Over current

IOUT >2.7A (TYP)

Disabled

tRETRY elapses

Thermal Shutdown

TJ > 160°C(TYP)

Disabled

TJ < 120°C

9.4 Device Functional Modes
The RS8837 is active unless the nSLEEP pin is brought logic low. In sleep mode, the H-bridge FETs are disabled
Hi-Z. The RS8837 is brought out of sleep mode automatically if nSLEEP is brought logic high.
The H-bridge outputs are disabled during undervoltage lockout, overcurrent, and overtemperature fault
conditions.

Table 3. Operation Modes
MODE

CONDITION

H-BRIDGE

OperatingnSLEEP pin=1

Operating

Sleep modenSLEEP pin=0

DisabledFault encountered

Any fault condition met

Disabled

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RS8837
10 Application and Implementation
Information in the following applications sections is not part of the RUNIC component specification, and RUNIC
does not warrant its accuracy or completeness. RUNIC’s customers are responsible for determining suitability ofcomponents for their purposes. Customers should validate and test their design implementation to confirm
system functionality.

10.1 Application Information
The RS8837 is device is used to drive one dc motor or other devices like solenoids. The following design
procedure can be used to configure the RS8837.

10.2 Typical Application
VM
1
2

3
4

M

VM
OUT1

OUT2

VCC
Thermal Pad

0.1 µFnSLEEP

IN1
IN2

GND

8
7

VCC
0.1 µF

6
5

Figure 10. Schematic of RS8837 Application

10.3 Design Requirements
Table 4 lists the required parameters for a typical usage case.

Table 4. System Design Requirements
DESIGN PARAMETERREFERENCE

EXAMPLE VALUE

Motor supply voltage

VM

9V

Logic supply voltage

VCC

3.3V

Target rms current

IOUT

0.8A

10.4 Detailed Design Procedure
10.4.1 Motor Voltage
The appropriate motor voltage depends on the ratings of the motor selected and the desired RPM. A higher
voltage spins a brushed dc motor faster with the same PWM duty cycle applied to the power FETs. A higher
voltage also increases the rate of current change through the inductive motor windings.

10.4.2 Low-Power Operation
When entering sleep mode, RUNIC recommends setting all inputs as a logic low to minimize system power.

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RS8837
11 Power Supply Recommendations
11.1 Bulk Capacitance
Having appropriate local bulk capacitance is an important factor in motor-drive system design. It is generally
beneficial to have more bulk capacitance, while the disadvantages are increased cost and physical size.
The amount of local capacitance needed depends on a variety of factors, including:⚫
The highest current required by the motor system⚫
The power-supply capacitance and ability to source current⚫
The amount of parasitic inductance between the power supply and motor system⚫
The acceptable voltage ripple⚫
The type of motor used (brushed dc, brushless dc, stepper)⚫
The motor braking method
The inductance between the power supply and motor drive system limits the rate at which current can change
from the power supply. If the local bulk capacitance is too small, the system responds to excessive current
demands or dumps from the motor with a change in voltage. When adequate bulk capacitance is used, the motor
voltage remains stable and high current can be quickly supplied.
The data sheet generally provides a recommended value, but system-level testing is required to determine theappropriate size of bulk capacitor.

Figure 11. Example Setup of Motor Drive System With External Power Supply
The voltage rating for bulk capacitors should be higher than the operating voltage, to provide margin for cases
when the motor transfers energy to the supply.

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RS8837
12 Layout12.1 Layout Guidelines
The VM and VCC pins should be bypassed to GND using low-ESR ceramic bypass capacitors with arecommended value of 0.1μF rated for VM and VCC. These capacitors should be placed as close to the VM and
VCC pins as possible with a thick trace or ground plane connection to the device GND pin.

12.2 Layout Example
0.1 µ F0.1 µ F

VM

VCC

OUT1

nSLEEP

OUT2

IN1

GND

IN2

Figure 12. Simplified Layout Example

12.3 Power Dissipation
Power dissipation in the RS8837 is dominated by the power dissipated in the output FET resistance, or RDS(on).
Use Equation 1 to estimate the average power dissipation when running a stepper motor.
PTOT = RDS(on) × (IOUT(RMS))2

(1)

where
⚫
PTOT is the total power dissipation⚫
RDS(on) is the resistance of the HS plus LS FETs⚫
IOUT(RMS) is the rms or dc output current being supplied to the load
The maximum amount of power that can be dissipated in the device is dependent on ambient temperature andheatsinking.
Note: The value of RDS(on) increases with temperature, so as the device heats, the power dissipation increases.
The RS8837 has thermal shutdown protection. If the die temperature exceeds approximately 160°C, the device
is disabled until the temperature drops to a safe level. Any tendency of the device to enter thermal shutdown isan indication of either excessive power dissipation, insufficient heatsinking, or too high an ambient temperature.

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RS8837
13 PACKAGE OUTLINE DIMENSIONSSOP8 (3)
b

e

5.2

E

E1

2.2

D

1.27

0.6

RECOMMENDED LAND PATTERN (Unit: mm)

A2

c

A

A1

L

Symbolθ

Dimensions In Millimeters

Dimensions In Inches

Min

Max

Min

Max

A (1)

1.350

1.750

0.053

0.069

A1

0.100

0.250

0.004

0.010

A2

1.350

1.550

0.053

0.061

b

0.330

0.510

0.013

0.020

c

0.170

0.250

0.007

0.010

D (1)

4.800

5.000

0.189

0.197

1.270 (BSC) (2)e0.050 (BSC) (2)

E

5.800

6.200

0.228

0.244

E1 (1)

3.800

4.000

0.150

0.157

L

0.400

1.270

0.016

0.050

θ

0°

8°

0°

8°

NOTE:
1. Plastic or metal protrusions of 0.15mm maximum per side are not included.
2. BSC (Basic Spacing between Centers), "Basic" spacing is nominal.
3. This drawing is subject to change without notice.

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RS8837
DFN2X2-8 (2)
E

e

D

E1

L

b

D1

TOP VIEW

BOTTOM VIEW
0.50

0.70

A1

1.95

A2

A

0.65

0.24

1.20

SIDE VIEW

RECOMMENDED LAND PATTERN(Unit: mm)

Dimensions In Millimeters

Dimensions In Inches

Min

Max

Min

Max

A (1)

0.700

0.800

0.028

0.031

A1

0.000

0.050

0.000

0.002

SymbolA2

0.203(TYP)

0.008(TYP)

b

0.180

0.300

0.007

0.012

D (1)

1.900

2.100

0.075

0.083

D1

1.100

1.300

0.043

0.051

E (1)

1.900

2.100

0.075

0.083

E1

0.600

0.800

0.024

0.031

e
L

0.500(TYP)
0.250

0.020(TYP)
0.450

0.010

0.018

NOTE:
1. Plastic or metal protrusions of 0.075mm maximum per side are not included.
2. This drawing is subject to change without notice.

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RS8837
14 TAPE AND REEL INFORMATIONREEL DIMENSIONSTAPE DIMENSION

Reel
DiameterReel Width(W1)

DIRECTION OF FEEDNOTE: The picture is only for reference. Please make the object as the standard.

KEY PARAMETER LIST OF TAPE AND REEL
SOP8

Reel
Diameter
13’’

Reel Width
(mm)
12.4

A0
(mm)
6.40

B0
(mm)
5.40

K0
(mm)
2.10

P0
(mm)
4.0

P1
(mm)
8.0

P2
(mm)
2.0

W
(mm)
12.0

Pin1
Quadrant
Q1

DFN2X2-8

7’’

9.5

2.30

2.30

1.10

4.0

4.0

2.0

8.0

Q2

Package TypeNOTE:
1. All dimensions are nominal.
2. Plastic or metal protrusions of 0.15mm maximum per side are not included.

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RS8837
IMPORTANT NOTICE AND DISCLAIMER
Jiangsu RUNIC Technology Co., Ltd. will accurately and reliably provide technical and reliability data (including
data sheets), design resources (including reference designs), application or other design advice, WEB tools, safety
information and other resources, without warranty of any defect, and will not make any express or implied
warranty, including but not limited to the warranty of merchantability Implied warranty that it is suitable for a
specific purpose or does not infringe the intellectual property rights of any third party.
These resources are intended for skilled developers designing with RUNIC products You will be solely
responsible for: (1) Selecting the appropriate products for your application; (2) Designing, validating and testing
your application; (3) Ensuring your application meets applicable standards and any other safety, security or otherrequirements; (4) RUNIC and the RUNIC logo are registered trademarks of RUNIC INCORPORATED. All
trademarks are the property of their respective owners; (5) For change details, review the revision history
included in any revised document. The resources are subject to change without notice. Our company will not beliable for the use of this product and the infringement of patents or third-party intellectual property rights due
to its use.

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