News Release

onsemi Launches MOSFETs With Innovative Top-Cool Packaging
Top-side cooling simplifies design and reduces cost for compact power solutions
MUNICH – Nov. 15, 2022 – onsemi (Nasdaq: ON), a leader in intelligent power and sensing technologies,
today announced a series of new MOSFET devices that feature innovative top-side cooling to assist
designers in challenging automotive applications, especially within motor control and DC/DC conversion.
The company is showing the new devices at its booth 101 in hall C4 at electronica, the world’s leading trade
fair and conference for electronics.
Housed in a TCPAK57 package measuring just 5mm x 7mm, the new Top Cool devices feature a 16.5mm 2
thermal pad on the top side. This allows heat to be dissipated directly into a heatsink rather than via atypical printed circuit board (PCB). By enabling the use of both sides of the PCB and decreasing the amountof heat going into it, the TCPAK57 provides increased power density. Improved reliability of the new design
adds to an overall extended system lifetime.

“Cooling is one of the greatest challenges in high power design and successfully addressing it is the key
enabler to reducing size and weight, which is critical in modern automotive design,” said Fabio Necco, vicepresident and general manager, Automotive Power Solutions at onsemi. “With excellent electrical efficiency
and having eliminated the PCB from the thermal path, the design is significantly simplified while reducing
size and cost.”
The devices deliver the electrical efficiency required in high power applications with R DS(ON) values as low
as 1mΩ. Additionally, the gate charge (Qg) is low (65 nC), reducing losses in high-speed switching
applications.
This solution leverages onsemi’s deep expertise in packaging to provide the highest power density solution
in the industry. TCPAK57 initial portfolio includes 40V, 60V and 80V. All devices are capable of operating
at junction temperatures (Tj) of 175°C and are AEC-Q101 qualified and PPAP capable. This, along with
their gull wings that allows inspection of solder joints and superior board level reliability, makes them ideallysuited to demanding automotive applications. The target applications are high/medium power motor
controls such as electric power steering and oil pumps.
Samples of the new devices are available now with full-scale manufacture planned in January 2023. Pleasecontact our sales office.

More information on the Single N-Channel Power MOSFETs on Top Cool Package can be found on
our website here.
###About onsemi
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on
automotive and industrial end-markets, the company is accelerating change in megatrends such asvehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloudinfrastructure. onsemi offers a highly differentiated and innovative product portfolio, delivering intelligent
power and sensing technologies that solve the world’s most complex challenges and leads the way tocreating a safer, cleaner, and smarter world. onsemi is recognized as a Fortune 500® company andincluded in the S&P 500® index. Learn more about onsemi at www.onsemi.com.
onsemi and the onsemi logo are trademarks of Semiconductor Components Industries, LLC. All otherbrand and product names appearing in this document are registered trademarks or trademarks of theirrespective holders.
Contacts
Stefanie Cuene
Head of Public Relations
onsemiStefanie.Cuene@onsemi.com
Parag Agarwal
Vice President - Investor Relations & Corporate Development
onsemi(602) 244-3437
investor@onsemi.com