RS2228

High-Speed USB 2.0 (480-Mbps)
1:2 Multiplexer/Demultiplexer Switch
1 FEATURES

3 DESCRIPTIONS

-3dB Bandwidth: 550MHz

Supply Range: +1.8V to +5.5VRON is Typically 6Ω

Fast Switching Times:

The RS2228 is a high-speed, low-power doublepole/double-throw (DPDT) analog switch with single
Enable. It is designed to operate from 1.8 V to 5.5 V.
̅̅̅̅, that can
The RS2228 has a bus-switch enable pin, OE
place the signal paths in high impedance. This allows theuser to isolate the bus when it is not in use and consumeless current.

tON 20ns
tOFF 15nsBreak-Before-Make Switching

Low Power Consumption (1μA Maximum)

Rail-to-Rail Input and Output Operation

Extended Industrial Temperature Range:-40°C to +85°C

Micro Size Packages: UQFN1.4X1.8-10,

The RS2228 is a high-bandwidth switch speciallydesigned for the switching of high-speed USB2.0 signals
in handset and consumer applications, such as cellphones, digital cameras, and notebooks with hubs orcontrollers with limited USB I/Os.
The RS2228 is available UQFN1.4X1.8-10 and MSOP10package. It operates over an ambient temperature rangeof -40°C to +85°C.

MSOP102 APPLICATIONSRoutes Signals for USB 1.0, 1.1, and 2.0

MP3 and Other Personal Media Players

Portable Instrumentation

USB Switching

Digital Cameras



Set-Top Box

Cell Phones



PDAs

Device Information (1)PART NUMBER
RS2228(1)

PACKAGEBODY SIZE (NOM)UQFN1.4X1.8-10

1.80mm×1.40mm

MSOP103.00mm×3.00mm

For all available packages, see the orderable addendum at the endof the data sheet.

4 FUNCTIONAL BLOCK DIAGRAM
HSD1+D+HSD2+

HSD1–D–

HSD2–SOEREV C.2Control

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RS2228
Table of Contents
1 FEATURES ............................................................................................................................................................................... 12 APPLICATIONS ...................................................................................................................................................................... 13 DESCRIPTIONS ...................................................................................................................................................................... 14 FUNCTIONAL BLOCK DIAGRAM ..................................................................................................................................... 15 REVISION HISTORY ............................................................................................................................................................. 36 PACKAGE/ORDERING INFORMATION (1) ..................................................................................................................... 4
7 PIN CONFIGURATIONS ...................................................................................................................................................... 5
7.1 Pin Description ................................................................................................................................................................ 5
7.2 Function Table ................................................................................................................................................................. 58 SPECIFICATIONS ................................................................................................................................................................... 7
8.1 Absolute Maximum Ratings .......................................................................................................................................... 7
8.2 ESD Ratings ...................................................................................................................................................................... 7
8.3 Recommended Operating Conditions ......................................................................................................................... 7
8.4 Electrical Characteristics ................................................................................................................................................ 89 PARAMETER MEASUREMENT INFORMATION ........................................................................................................1010 APPLICATION NOTES .....................................................................................................................................................13
11 PACKAGE OUTLINE DIMENSIONS .............................................................................................................................1412 TAPE AND REEL INFORMATION .................................................................................................................................162 / 17

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RS2228
5 REVISION HISTORY
Note: Page numbers for previous revisions may different from page numbers in the current version.
VersionChange Date

Change Item

C.1

2021/07/06

C.1.1

2024/03/11

C.2

2024/05/10

Changed UQFN1.4X1.8-10 Package Marking in Page 5@B.4 Version
1. Added the TAPE AND REEL INFORMATION
2. Modify packaging naming
1. Add MSL on Page 6@RevC.1.1
2. Add Package thermal impedance on Page 5@RevC.1.1
3. Update PACKAGE note

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RS2228
6 PACKAGE/ORDERING INFORMATION (1)PRODUCTRS2228ORDERING
NUMBER
RS2228XN

TEMPERATURE
RANGE-40°C ~+85°C

RS2228XUTQK10-40°C ~+85°C

MSOP10PACKAGEMARKING (2)RS2228UQFN1.4X1.8-10

2228

PACKAGE LEAD

MSL (3)

PACKAGE OPTIONMSL3Tape and Reel, 4000

MSL3

Tape and Reel, 4000

NOTE:
(1) This information is the most current data available for the designated devices. This data is subject to change without notice and revisionof this document. For browser-based versions of this data sheet, refer to the right-hand navigation.
(2) There may be additional marking, which relates to the lot trace code information (data code and vendor code), the logo or theenvironmental category on the device.
(3) MSL, The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications.

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RS2228
7 PIN CONFIGURATIONS(TOP VIEW)

OE

8V+

9

HSD1-

HSD2-

76

LOGIC

S 10

12

HSD1+

HSD2+

5D-

4GND

3D+

UQFN1.4X1.8-107.1 Pin Description
NAME

PIN

FUNCTIONV+

9Power Supply

GND

4GroundS̅̅̅̅OE

10

Select Input

8Output Enable

HSD1+, HSD2+

1,2

HSD1-, HSD2-

7,6

D+, D-

3,5Data Port

7.2 Function Table
̅̅̅̅𝐎𝐄S

HSD1+, HSD1-

HSD2+, HSD2-

00

ON

OFF

01

OFFON

1X

OFFOFF

Note: X =Don’t care

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RS2228
PIN CONFIGURATIONSRS2228S

110 V+

HSD1+

29OE

HSD2+

38

HSD1-D+47

HSD2-

GND 56D-MSOP10Pin Description
NAME

PIN

FUNCTION

V+

10Power Supply

GND5GroundS̅̅̅̅OE

1Select Input

9Output Enable

HSD1+, HSD2+

2,3

HSD1-, HSD2-

8,7D+, D-

4,6

Data PortFunction Table
̅̅̅̅
𝐎𝐄

S

HSD1+, HSD1-

HSD2+, HSD2-00ONOFF01OFFON

1X

OFFOFF

Note: X =Don’t care

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RS22288 SPECIFICATIONS
8.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted) (1)SYMBOL
V+PARAMETER

MIN

MAX

Supply Voltage-0.3

6.0Analog, Digital Voltage Range (2)-0.3(V+)+0.3

Continuous Current HSDn or Dn-100+100IPEAK

Peak Current HSDn or Dn-150+150

θJAPackage thermal impedance (3)TJ

Junction Temperature (4)-40150Tstg

Storage temperature-65+150

MSOP10200

UQFN1.4X1.8-10115

UNIT
VmA°C/W°C(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond thosespecified is not implied.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3V beyond the supply rails should
be current-limited to 10mA or less.
(3) The package thermal impedance is calculated in accordance with JESD-51.
(4) The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX) - TA) / RθJA. All numbers apply for packages soldered directly onto a PCB.

8.2 ESD Ratings
The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only.

V(ESD)

Electrostatic discharge

VALUEUNIT

Human-Body Model (HBM)±3000

VMachine Model (MM)

±200

V

ESD SENSITIVITY CAUTION
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its publishedspecifications.

8.3 Recommended Operating Conditions
Over operating free-air temperature range (unless otherwise noted)
SYMBOLPARAMETERMINMAXUNITVCCSupply Voltage

1.85.5VTA

Operating temperature-40+85°C

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RS2228
8.4 Electrical Characteristics(V+ = +1.8V to +5.5V, GND = 0V, VIH = +1.5V, VIL = +0.5V, TA = -40°C to + 85°C. Typical values are at V+ = +3.3V, TA =+25°C, unless otherwise noted.)
PARAMETERANALOG SWITCH
Analog I/O Voltage(HSD1+, HSD1-, HSD2+,HSD2-)

SYMBOL

CONDITIONS

VIS-40°C to +85°C

On-ResistanceRON

V+ = 3.0V, VIS = 0V to 0.4V,
ID = 8mA, See Figure 1

On-Resistance Match
Between Channels

ΔRON

V+ = 3.0V, VIS = 0V to 0.4V,
ID = 8mA, See Figure 1

On-Resistance Flatness
Power Off Leakage Current(D+, D-)
Increase in I+ per Control
Voltage
Source Off Leakage Current
Channel On Leakage Current

TA

RFLAT(ON)

V+ = 3.0V, VIS = 0V to 1.0V,
ID = 8mA, See Figure 1

IOFF

MIN(2) TYP(3) MAX(2) UNIT

0+25°C

V+610-40°C to +85°C

10.5+25°C

0.15-40°C to +85°C+25°C

5VΩ0.6Ω1.6Ω7Ω-40°C to +85°C8V+ = 0V, VD = 0V to 3.6 V,
VS, VOE
̅̅̅̅ = 0V or 3.6 V-40°C to +85°C

1μA

ICCT

V+ = 3.6V, VS or V̅̅̅̅OE = 2.6 V-40°C to +85°C

40μA

IHSD2(OFF)IHSD1(OFF)IHSD2(ON)IHSD1(ON)

V+ = 3.6V, VIS = 3.3V/ 0.3V,
VD = 0.3V/ 3.3V
V+ = 3.6V, VIS = 3.3V/ 0.3V,
VD = 0.3V/ 3.3V or floating-40°C to +85°C

1

μA-40°C to +85°C

1μA

DIGITAL CONTROL INPUTS (1)Input High Voltage

VIH-40°C to +85°CInput Low Voltage

VIL-40°C to +85°C

0.5

V

Input Leakage Current

IIN-40°C to +85°C

1μA

V+ = 3.0V, VS, VOE̅̅̅̅ = 0V or V+

1.6

V(1) All unused digital inputs of the device must be held at VIO or GND to ensure proper device operation.
(2) Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlations using statisticalquality control (SQC) method.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may varyover time and will also depend on the application and configuration.

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RS2228
Electrical Characteristics (continued)(V+ = +1.8V to +5.5V, GND = 0V, VIH = +1.5V, VIL = +0.5V, TA = -40°C to + 85°C. Typical values are at V+ = +3.3V, TA =+25°C, unless otherwise noted.)
PARAMETERSYMBOL

CONDITIONSTAMIN

TYP MAX UNIT

DYNAMIC CHARACTERISTICS
Turn-On TimetON

Turn-Off TimetOFF

Break-Before-Make Time DelaytD

Propagation DelaytPD

Off Isolation

OISO

Channel-to-Channel Crosstalk

XTALK-3dB Bandwidth

BW

Channel-to-Channel Skew
Charge Injection Select Input toCommon I/O
HSD+, HSD-, D+, D- ON
Capacitance
POWER REQUIREMENTStSKEWPower Supply Range

V+Power Supply Current

Q

VIS = 0.8V, RL = 50Ω,
CL = 10pF, See Figure 2
VIS = 0.8V, RL = 50Ω,
CL = 10pF, See Figure 3
RL = 50Ω, CL = 10pF
Signal = 0dBm, RL = 50Ω,
f = 250MHz, See Figure 4Signal = 0dBm, RL = 50Ω,
f = 250MHz, See Figure 5Signal = 0dBm, RL = 50Ω,
CL = 5pF, See Figure 6
RL = 50Ω, CL = 10pF
VG = GND, CL = 1.0nF, RG = 0Ω,
Q = CL x VOUT, See Figure 7

CON

I++25°C

20ns+25°C

15ns+25°C

4ns+25°C

0.35

ns+25°C-35

dB+25°C-40

dB+25°C

550

MHz+25°C

0.05

ns+25°C

11pC+25°C

7pF-40°C to +85°C
V+ = 3.0V, VS, VOE̅̅̅̅ = 0V or V+

9 / 17-40°C to +85°C

1.85.5V1μA

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RS2228
9 PARAMETER MEASUREMENT INFORMATION
V+VHSD1nHSD1n
VIS

Dn+

VHSD2nChannel ON

HSD2n

R ON

VSELIDS

VIS- VHSD1nI orVHSD2nΩ
D

VSEL = VIH or V IL+GND

Figure 1. ON-State Resistance (RON)

V+

V+

HSD1n

50%

50%
Dn

HSD2n

VOUT

0.1μF

VOH
RL
VS

90%

90%

CL

VOL

GND

tOFF

tON

Figure 2. Turn-On (tON) and Turn-Off Time (tOFF)

V+

HSD1n

V+

VS
Dn

HSD2n

VOUT

0.1μ F
RL

CL

VS

50%
00

GND

90% of VOH

VOUT

tD

Figure 3. Break-Before-Make Time (tD)

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RS2228
V+
0.1μF

V+

HSD1nDn

VOUT

HSD2nSource
SignalRL

S
GND

Figure 4. OFF Isolation (OISO)
V+

0.1μ F

V+
HSDn

Dn
RL

SourceSignal
HSDn

N.C.

Dn

VOUT
RL

S
GND

Channel To Channel Crosstalk = -20 × log

VHSDn
VOUT

Figure 5. Channel-to-Channel Crosstalk
0.1μF

V+

V+
HSDn
SourceSignal

Dn

VOUT

RL

S

CL

GND

Figure 6. -3dB Bandwidth

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RS2228

V+

HSD1n
RG
VG

0Dn
VOUT

HSD2n

CLS

Δ OUT

VOUT

GND

Q = ΔVOUT× CL

Figure 7. Charge Injection(Q)12 / 17

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RS2228
10 APPLICATION NOTESThere are many USB applications in which the USB hubs or controllers have a limited number of USB I/Os. TheRS2228 solution can effectively expand the limited USB I/Os by switching between multiple USB buses in order
to interface them to a single USB hub or controller. RS2228 can also be used to connect a single controller totwo USB connectors or controllers.
Design requirements of the USB 1.0, 1.1, and 2.0 standards should be followed. It is recommended that thedigital control pins S and ̅̅̅̅OE be pulled up to V+ or down to GND to avoid undesired switch positions that could
result from the floating pin.
V+

RS2228HSD1+
USB2.0Controller

D+
HSD1USB
Connector

Processor
D–HSD2+Controller

HSD2-Control

SOE

Figure 8. Application Diagram

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RS2228
11 PACKAGE OUTLINE DIMENSIONSMSOP10 (3)
be

E

4.65

E11.02
D0.50.31

RECOMMENDED LAND PATTERN (Unit: mm)

cA2

A

A1L

θ

Dimensions In Millimeters

Dimensions In Inches

MinMaxMinMaxA (1)

0.820

1.100

0.032

0.043

A10.020

0.150

0.001

0.006

A20.750

0.950

0.030

0.037

b0.180

0.280

0.007

0.011

c0.090

0.230

0.004

0.009

D (1)

2.900

3.100

0.114

0.122

Symbol0.500(BSC) (2)e0.020(BSC) (2)

E (1)

2.900

3.100

0.114

0.122

E1

4.750

5.050

0.187

0.199

L

0.400

0.800

0.016

0.031

θ

0°

6°

0°

6°

NOTE:
1. Plastic or metal protrusions of 0.15mm maximum per side are not included.
2. BSC (Basic Spacing between Centers), "Basic" spacing is nominal.
3. This drawing is subject to change without notice.

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UQFN1.4X1.8-10 (3)EL1ce

PIN #1 IDENTIFICATIONCHAMFER 0.350 × 45°(× 9)

DPIN #1 DOT
BY MARKING

dL2TOP VIEW

ba

BOTTOM VIEW
2.100

0.563

A

1.700

A2
A10.663
0.225

SIDE VIEW
0.20

0.40

RECOMMENDED LAND PATTERN

SymbolDimensions In Millimeters

Dimensions In Inches

MinMaxMin

MaxA (1)

0.500

0.600

0.020

0.024

A10.000

0.050

0.000

0.002

0.203 REF (2)A20.008 REF (2)a0.050

0.150

0.002

0.006

b0.150

0.250

0.006

0.010

c0.450

0.550

0.018

0.022

0.800 REF (2)d0.031 REF (2)

D (1)

1.350

1.450

0.053

0.057

E (1)

1.750

1.850

0.069

0.073

e0.400 TYP

0.016 TYP

L1

0.350

0.450

0.014

0.018

L2

0.450

0.550

0.018

0.022

NOTE:
1. Plastic or metal protrusions of 0.075mm maximum per side are not included.
2. REF is the abbreviation for Reference.
3. This drawing is subject to change without notice.

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RS2228
12 TAPE AND REEL INFORMATIONREEL DIMENSIONSTAPE DIMENSION

ReelDiameter

Reel Width(W1)

DIRECTION OF FEEDNOTE: The picture is only for reference. Please make the object as the standard.

KEY PARAMETER LIST OF TAPE AND REEL
MSOP10

Reel
Diameter
13’’

Reel Width(mm)12.4

A0(mm)
5.20

B0(mm)
3.30

K0(mm)
1.20

P0(mm)
4.0

P1(mm)
8.0

P2(mm)
2.0W(mm)12.0

Pin1
Quadrant
Q1

UQFN1.4X1.8-10

7’’

9.0

1.60

2.00

0.85

4.0

4.0

2.0

8.0

Q1

Package TypeNOTE:
1. All dimensions are nominal.
2. Plastic or metal protrusions of 0.15mm maximum per side are not included.

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RS2228
IMPORTANT NOTICE AND DISCLAIMER
Jiangsu RUNIC Technology Co., Ltd. will accurately and reliably provide technical and reliability data (includingdata sheets), design resources (including reference designs), application or other design advice, WEB tools, safety
information and other resources, without warranty of any defect, and will not make any express or implied
warranty, including but not limited to the warranty of merchantability Implied warranty that it is suitable for aspecific purpose or does not infringe the intellectual property rights of any third party.
These resources are intended for skilled developers designing with RUNIC products You will be solely
responsible for: (1) Selecting the appropriate products for your application; (2) Designing, validating and testing
your application; (3) Ensuring your application meets applicable standards and any other safety, security or otherrequirements; (4) RUNIC and the RUNIC logo are registered trademarks of RUNIC INCORPORATED. All
trademarks are the property of their respective owners; (5) For change details, review the revision history
included in any revised document. The resources are subject to change without notice. Our company will not beliable for the use of this product and the infringement of patents or third-party intellectual property rights due
to its use.

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