RS846XP

High-Slew Operational Amplifier
1 FEATURES

3 DESCRIPTIONS•Low Offset Voltage: ±0.3mV (TYP)

The RS846XP family of devices provide outstanding•

Low Offset Voltage Drift: ±3.4μV/°C

value for cost-sensitive applications, with features•

High Slew Rate: 24V/μs (TYP)

including low offset (±0.3mV, TYP), high slew rate (24•High Gain Bandwidth: 10MHz

V/μs). Integrated EMI and RF filters, and operation•

Output Short-Circuit Protection

across the full –40°C to 125°C enable the RS846XP•

Supply Voltage: 4.5V to 32V (±2.25V to ±16V)

devices to be used in the most rugged and demanding•

Extended Temperature: -40°C to 125°C

applications.

•

Micro Size Packages: SOT23-5, SOP8, SOP14

2 APPLICATIONS•

Solar Energy: String and Central Inverter•

Motor Drives: AC and Servo Drive Control

The RS846XP is available in Green SOT23-5, SOP8,
SOP14 packages. It operates over an ambient
temperature range of -40°C to 125°C.

Device Information (1)and Power Stage Modules•

Single Phase Online UPS•

Three Phase UPS•

Pro Audio Mixers•

Battery Test Equipment

REV A.4

PART NUMBER

PACKAGEBODY SIZE(NOM)

RS8461P

SOT23-5

2.92mm×1.62mm

RS8462P

SOP84.90mm x 3.90mm

RS8464P

SOP148.65mm x 3.90mm(1) For all available packages, see the orderable addendum at theend of the data sheet.

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RS846XP
Table of Contents
1 FEATURES ............................................................................................................................................................................... 1
2 APPLICATIONS ...................................................................................................................................................................... 1
3 DESCRIPTIONS ...................................................................................................................................................................... 1
4 REVISION HISTORY ............................................................................................................................................................. 3
5 PACKAGE/ORDERING INFORMATION (1) ..................................................................................................................... 4
6 PIN CONFIGURATION AND FUNCTIONS ..................................................................................................................... 5
7 SPECIFICATIONS ................................................................................................................................................................... 8
7.1 Absolute Maximum Ratings .......................................................................................................................................... 8
7.2 ESD Ratings ...................................................................................................................................................................... 8
7.3 Recommended Operating Conditions ......................................................................................................................... 8
7.4 Electrical Characteristics ................................................................................................................................................ 9
7.5 Typical Characteristics .................................................................................................................................................11
8 DETAILED DESCRIPTION .................................................................................................................................................13
8.1 Overview .........................................................................................................................................................................13
8.2 Power Supply Recommendations ..............................................................................................................................13
8.3 Slew Rate ........................................................................................................................................................................13
8.4 Device Functional Modes ............................................................................................................................................13
9 APPLICATION AND IMPLEMENTATION .....................................................................................................................14
9.1 Application Information ...............................................................................................................................................14
9.2 Inverting Amplifier Application...................................................................................................................................14
10 LAYOUTS ............................................................................................................................................................................15
10.1 Layout Guidelines .......................................................................................................................................................15
10.2 Layout Example ...........................................................................................................................................................15
11 PACKAGE OUTLINE DIMENSIONS .............................................................................................................................16
12 TAPE AND REEL INFORMATION .................................................................................................................................19

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RS846XP
4 REVISION HISTORY
Note: Page numbers for previous revisions may different from page numbers in the current version.
VersionChange Date

Change Item

A.1

2022/10/20

Initial version completed

A.2

2023/06/07

Add RS8461PXF Orderable Device

A.3

2023/06/14

Update PSRR PARAMETER

A.3.1

2024/03/01

A.4

2024/08/01

Modify packaging naming
1. Update PACKAGE/ORDERING INFORMATION
2. Update ESD Ratings
3. Delete 8.2 Test Circuit Diagram

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RS846XP
5 PACKAGE/ORDERING INFORMATION (1)Orderable
Device
RS8461PXF

SOT23-551-40°C ~125°C

DeviceMarking (2)
8461P

MSL3

Tape and Reel, 3000

RS8462PXK

SOP8

8

2

-40°C ~125°C

RS8462PMSL3

Tape and Reel, 4000

RS8464PXP

SOP14

14

4

-40°C ~125°C

RS8464P

MSL3

Tape and Reel, 4000

Package Type

Pin

ChannelOp Temp(°C)

MSL (3)

Package Qty

NOTE:(1) This information is the most current data available for the designated devices. This data is subject to change without notice and revisionof this document. For browser-based versions of this data sheet, refer to the right-hand navigation.
(2) There may be additional marking, which relates to the lot trace code information (data code and vendor code), the logo or theenvironmental category on the device.
(3) RUNIC classify the MSL level with using the common preconditioning setting in our assembly factory conforming to the JEDEC
industrial standard J-STD-20F, Please align with RUNIC if your end application is quite critical to the preconditioning setting or if you
have special requirement.

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RS846XP
6 PIN CONFIGURATION AND FUNCTIONS
RS8461P
OUT

1

V-

2

+IN

3

+

-

5

V+

4

-IN

SOT23-5
PIN DESCRIPTION
PIN
NAME

RS8461P

I/O (1)DESCRIPTION

SOT23-5

(1)

-IN

4

I

Negative (inverting) input

+IN

3

I

Positive (noninverting) input

OUT

1

O

OutputV-

2-

Negative (lowest) power supply

V+

5

-

Positive (highest) power supply

I = Input, O = Output.

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RS846XPPIN CONFIGURATION AND FUNCTIONS
RS8462P
OUT A

1

-IN A

2

+IN A

3

V-

4

+

A
B+

8

V+

7

OUTB

6

-IN B

5

+IN B

SOP8

PIN DESCRIPTION
NAME

PIN
SOP8

I/O (1)DESCRIPTION

-INA

2

I

Inverting input, channel A

+INA

3

I

Noninverting input, channel A

-INB

6

I

Inverting input, channel B

+INB

5

I

Noninverting input, channel B

OUTA

1

O

Output, channel A

OUTB

7

O

Output, channel B

V-

4

-

Negative (lowest) power supply or ground (for single supply operation)

V+

8

-

Positive (highest) power supply(1)

I = Input, O = Output.

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RS846XPPIN CONFIGURATION AND FUNCTIONS
RS8464P
14

OUT D

13

-IN D

3

12

+IN D

V+

4

11

V-

+IN B

5

10

+IN C

-IN B

6

9

-IN C

OUT B

7

8

OUT C

OUT A

1

-IN A

2

+IN A

-

-

A

B

+

+

D
+ -

+ C

SOP14

PIN DESCRIPTION
NAME

(1)

PIN
SOP14

I/O (1)DESCRIPTION

-INA

2

I

Inverting input, channel A

+INA

3

I

Noninverting input, channel A

-INB

6

I

Inverting input, channel B

+INB

5

I

Noninverting input, channel B

-INC

9

I

Inverting input, channel C

+INC

10

I

Noninverting input, channel C

-IND

13

I

Inverting input, channel D

+IND

12

I

Noninverting input, channel D

OUTA

1

O

Output, channel A

OUTB

7

O

Output, channel B

OUTC

8

O

Output, channel C

OUTD

14

O

Output, channel D

V-

11

-

Negative (lowest) power supply or ground (for single supply operation)

V+

4

-

Positive (highest) power supply

I = Input, O = Output.

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RS846XP
7 SPECIFICATIONS
7.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted) (1)
MIN

MAX

Supply, VS= (V+) - (V-)

Voltage
Current36

Signal input pin (2)(V-)-0.5Signal input pin (2)-10Output short-circuits (3)Package thermal impedance (4)θJA(V+) +0.5
10V
mA

Continuous
SOT23-5

230

SOP8

110

SOP14
Temperature

UNIT

°C/W

105

Operating range, TA

-40

125

Junction, TJ (5)

-40

150

Storage, Tstg

-65

150

°C

(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond thosespecified is not implied.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should
be current-limited to 10mA or less.
(3) Short-circuit to ground, one amplifier per package.
(4) The package thermal impedance is calculated in accordance with JESD-51.
(5) The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (T J(MAX) - TA) / RθJA. All numbers apply for packages soldered directly onto a PCB.

7.2 ESD Ratings
The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only.
VALUE
V(ESD)

Electrostatic
discharge

Human-Body Model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)±2000

Charged-Device Model (CDM), per ANSI/ESDA/JEDEC JS-002 (2)±1500

Machine Model (MM)

±200

UNIT
V

(1) JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process.

ESD SENSITIVITY CAUTION
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its publishedspecifications.

7.3 Recommended Operating Conditions
Over operating free-air temperature range (unless otherwise noted)
MIN
Supply voltage, VS= (V+) - (V-)

NOM

MAX

Single-supply

4.5

32

Dual-supply

±2.25

±16

-40

125

Operating range, TA

8 / 20UNIT
V°C

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RS846XP
7.4 Electrical Characteristics(At TA=+25°C, VS=4.5V to 32 V (±2.25V to ±16 V), RL=10kΩ connected to VS/2, VCM=VS/2 and VOUT=VS/2, Full (9) =-40°C to
125°C, unless otherwise noted.) (1)
PARAMETERSYMBOL

CONDITION

TEMP

MIN(2)

TYP(3)

MAX(2)

+25°C

-1

±0.3

1

UNIT

INPUT CHARACTERISTICS
Input Offset Voltage

VOS

Input Offset Voltage Average Drift

VOS TC

Input Bias Current (4) (5)IB

Input Offset Current (4)IOS

Power-Supply Rejection Ratio

PSRR

Input Common-Mode Voltage
Range

VCM

Common-Mode Rejection Ratio

CMRR

Open-Loop Voltage Gain

VS=±16V, VCM=VS/2

VS=5V~32V, VCM=VS/2

FULL

±0.36

FULL

±3.4

+25°C

±10

FULL

±600

+25°C

±10

FULL

±600

+25°C

83

FULL

mV
μV/°C

±60

pA
pA

±60

pA
pA

101

dB

100

FULL

(V-)

VS=32V,(V-) <VCM<(V+)-2V

+25°C

94

AOL

VS=32V, RL=10 KΩ
VO=(V-)+0.5V to (V+)-0.5V

+25°C
FULL

117

Input Voltage Noise

enp-p

f=0.1Hz to 10Hz

+25°C

8.5

μVPP

Input Voltage Noise Density (4)en

f=1KHz+25°C

40nV/√HzSlew Rate (8)

SR

+25°C

24

V/μs

Settling Time to 0.1%

tS

+25°C

1.2

μs

Gain-Bandwidth Product

GBP

G=+1, VS=32V
VS=32V, VPP=7V, G=+1
CL=100pF
VS=32V, VIN=50mVP-P

+25°C

10

MHz

Overload Recovery TimetOR

VIN × G ≥ VS

+25°C

0.35

μs

Phase Margin (4)φO

VOUT=100mVP-P, CL=70pF

+25°C

60

°

+25°C

90

150

+25°C

65

150

FULL

(V+)-2
110

dB

108
101

V

124

dB

NOISE PERFORMANCEDYNAMIC PERFORMANCEOUTPUT CHARACTERISTICS
Output Voltage Swing from Rail

VOH
VOL

Output Source Current (6) (7)ISOURCE

Output Sink Current (6) (7)ISINK

VS=±16V, RL=10 KΩ
VS=32V

+25°C

40

75

40

75

mV
mA

POWER SUPPLY
Operating Voltage Range

VS

FULL
VS=±2.5V, IOUT=0mA

Quiescent Current Per Amplifier

IQ
VS=±16V, IOUT=0mA

Turn-On Time

VS=32V

+25°C

32
2.2

FULL
+25°C

2.6

V

4.1
4.5

FULL
+25°C

9 / 20

4.5

4.6

mA

5.0
52

μs

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RS846XP
NOTE:(1) Electrical table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device.
(2) Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlations using statisticalquality control (SQC) method.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may varyover time and will also depend on the application and configuration.
(4) This parameter is ensured by design and/or characterization and is not tested in production.
(5) Positive current corresponds to current flowing into the device.
(6) The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (T J(MAX) - TA) / RθJA. All numbers apply for packages soldered directly onto a PCB.
(7) Short circuit test is a momentary test.
(8) Number specified is the slower of positive and negative slew rates.
(9) Specified by characterization only.

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RS846XP
7.5 Typical Characteristics
NOTE: The graphs and tables provided following this note are a statistical summary based on a limited number of samples
and are provided for informational purposes only.
At TA= +25°C, VS= ±16V, unless otherwise noted.

Quiescent Current Per Amplifier(mA)

Quiescent Current Per Amplifier
(mA)

5
4
3
2
1
0
4

8

12

16

20

24

28

3.5
3
2.5
2
1.5
1
0.5
0
-40 -25 -10 5

32

Temperature(°C)

Supply Voltage(V)Figure 2. Quiescent Current vs Temperature

100

2

80

1.5

Input Offset Voltage(mV)

Output Current(mA)

Figure 1. Supply Voltage vs Quiescent Current

60
40

ISource

20
0
-20

ISink

-40

20 35 50 65 80 95 110 125

-60
-80

1
0.5
0
-0.5
-1
-1.5
-2

-100
4

8

12

16

20

24

28

-40 -25 -10 532

20 35 50 65 80 95 110 125

Temperature(°C)

Supply Voltage(V)Figure 4. Input Offset Voltage vs Temperature

4

4

3

3

Input Offset Voltage(mV)

Input Offset Voltage(mV)Figure 3. Supply Voltage vs Output Current

2
1
0
-1
-2
-3

2
1
0
-1
-2
-3
-4

-4
0

5

10

15

20

25

4

30

8

12

16

20

24

28

32

Supply Voltage(V)Input Common Mode Voltage(V)Figure 5. Input Offset Voltage vs Input Common
Mode Voltage

Figure 6. Input Offset Voltage vs Supply Voltage

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RS846XP
Typical Characteristics

130

Power-Supply Rejection Ratio(dB)Common-Mode Rejection Ratio(dB)

NOTE: The graphs and tables provided following this note are a statistical summary based on a limited number of samples
and are provided for informational purposes only.
At TA= +25°C, VS= ±16V, unless otherwise noted.

125
120
115
110
105

100
95
90
-40 -25 -10 5

120
115
110
105
100
95
90

20 35 50 65 80 95 110 125-40 -25 -10 5

Temperature(°C)

20 35 50 65 80 95 110 125

Temperature(°C)

Figure 7. Common-Mode Rejection Ratio vsTemperature

Figure 8. Power-Supply Rejection Ratio vsTemperature

135
130

2μV/div

Open-LooP Voltage Gain(dB)

140

125
120
115
110
105
100
-40 -25 -10 5Time(1s/div)

20 35 50 65 80 95 110 125

Temperature(°C)

CL=100pF
VS=±16V
G=1

VIN

2V/div

20mV/div

VOUT

Figure 10. 0.1-Hz to 10-Hz NoiseVOUT

2V/div

VIN

20mV/div

Figure 9. Open-Loop Voltage Gain vs
Temperature

CL=100pF
VS=±16V
G=1

Time(5μs/div)
Figure 12. Large-Signal Step ResponseTime(2μs/div)
Figure 11. Small-Signal Step Response
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RS846XP
8 DETAILED DESCRIPTION
8.1 Overview
The RS846XP is the next-generation family of the industry standard RS845X high-voltage general purpose
amplifiers. These devices provide outstanding value for cost-sensitive applications requiring high slew rate withhigh voltage signals, such as motor drive and inverter systems.
A robust MUX-friendly input stage enhances flexibility in design, with common-mode voltage range extending
to the negative rail as well as improved settling time in multi-channel applications. Low offset voltage (±0.3mV,TYP) and low offset voltage drift (±3.4μV/°C) allows the RS846XP family to be used in rugged applications
requiring precision current and voltage sensing. High voltage operation (up to 36 V) and high slew rate (24V/μs)
make the RS846XP family a premier choice for high-voltage applications with fast transients.

8.2 Power Supply Recommendations
Supply voltages larger than 32 V for a single-supply or outside the range of ±16 V for a dual-supply canpermanently damage the device. Place 0.1μF bypass capacitors close to the power-supply pins to reduce errors
coupling in from noisy or high impedance power supplies.

8.3 Slew Rate
The slew rate is the rate at which an operational amplifier can change its output when there is a change on the
input. These devices have a 24V/μs slew rate.

8.4 Device Functional Modes
These devices are powered on when the supply is connected. This device can be operated as a single-supply
operational amplifier or dual-supply amplifier depending on the application.

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RS846XP
9 APPLICATION AND IMPLEMENTATION
Information in the following applications sections is not part of the RUNIC component specification, and RUNIC
does not warrant its accuracy or completeness. RUNIC’s customers are responsible for determining suitability ofcomponents for their purposes. Customers should validate and test their design implementation to confirm
system functionality.

9.1 Application Information
The RS846XP series of operational amplifiers can be used in countless applications. The few applications in thissection show principles used in all applications of these parts.

9.2 Inverting Amplifier Application
A typical application for an operational amplifier in an inverting amplifier. This amplifier takes a positive voltage
on the input, and makes it a negative voltage of the same magnitude. In the same manner, it also makes negative
voltages positive.
RF

RI

VIN

Vsup+

+

VOUT

Vsup-

Figure 13. Schematic for Inverting Amplifier Application

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RS846XP
10 LAYOUTS
10.1 Layout Guidelines
For best operational performance of the device, use good PCB layout practices, including:⚫
Noise can propagate into analog circuitry through the power pins of the circuit as a whole and operational
amplifier itself. Bypass capacitors are used to reduce the coupled noise by providing low-impedance
power sources local to the analog circuitry.
– Connect low-ESR, 0.1µ F ceramic bypass capacitors between each supply pin and ground, placed as close
to the device as possible. A single bypass capacitor from V+ to ground is applicable for single supply
applications.
⚫
Separate grounding for analog and digital portions of circuitry is one of the simplest and most-effective
methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to groundplanes. A ground plane helps distribute heat and reduces EMI noise pickup. Make sure to physicallyseparate digital and analog grounds paying attention to the flow of the ground current.
⚫
To reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible.
If these traces cannot be kept separate, crossing the sensitive trace perpendicular is much better as
opposed to in parallel with the noisy trace.
⚫
Place the external components as close to the device as possible. As shown in Figure 15, keeping RF and
RG close to the inverting input minimizes parasitic capacitance.
⚫
Keep the length of input traces as short as possible. Always remember that the input traces are the mostsensitive part of the circuit.
⚫
Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly
reduce leakage currents from nearby traces that are at different potentials.

10.2 Layout Example
+

VIN A

+

VIN B
VOUT ARG

VOUT B

RG

RF

RF

Figure 14. Schematic Representation
Place components
clos e to device and toeach other to reduceparasitic errors.

OUT A

Us e low-ESR,
ceramic bypass
capacitor. Place asclos e to the device
as possible.

VS+

OUT A

V+

-IN A

OUT B

+IN A

-IN B

GND

RF

OUT B

GND
RG
VIN A

+IN B

Ground (GND) plane on another layer
GND

GND
RG

V-

Us e low-ESR,
ceramic bypass
capacitor. Place asclos e to the device
as possible.

RF

VS-

VIN B

Keep in put traces shortand ru n the input traces
as far away fromthe supply lines
as possible.

Figure 15. Layout Recommendation
NOTE: Layout Recommendations have been shown for dual op-amp only, follow similar precautions for Single and four.

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RS846XP
11 PACKAGE OUTLINE DIMENSIONSSOT23-5 (3)
D

1.90

b

2.59

E1

E
0.99
0.69

0.95

e
e1

RECOMMENDED LAND PATTERN (Unit: mm)

0.2
A A2

L

A1

SymbolcθDimensions In Millimeters

Dimensions In Inches

Min

Max

Min

Max

A (1)

1.050

1.250

0.041

0.049

A1

0.000

0.100

0.000

0.004

A2

1.050

1.150

0.041

0.045

b

0.300

0.500

0.012

0.020

c

0.100

0.200

0.004

0.008

D (1)

2.820

3.020

0.111

0.119

E (1)

1.500

1.700

0.059

0.067

E1

2.650

2.950

0.104

0.950(BSC) (2)

e

0.116
0.037(BSC) (2)

e1

1.800

2.000

0.071

0.079

L

0.300

0.600

0.012

0.024

θ

0°

8°

0°

8°

NOTE:
1. Plastic or metal protrusions of 0.15mm maximum per side are not included.
2. BSC (Basic Spacing between Centers), "Basic" spacing is nominal.
3. This drawing is subject to change without notice.

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RS846XP
SOP8 (3)
b

e

5.2
E

E1

2.2

D

1.27

0.6

RECOMMENDED LAND PATTERN (Unit: mm)

A2

c

A

A1

L

Symbolθ

Dimensions In Millimeters

Dimensions In Inches

Min

Max

Min

Max

A (1)

1.350

1.750

0.053

0.069

A1

0.100

0.250

0.004

0.010

A2

1.350

1.550

0.053

0.061

b

0.330

0.510

0.013

0.020

c

0.170

0.250

0.007

0.010

D (1)

4.800

5.000

0.189

1.270(BSC) (2)

e

0.197
0.050(BSC) (2)

E

5.800

6.200

0.228

0.244

E1 (1)

3.800

4.000

0.150

0.157

L

0.400

1.270

0.016

0.050

θ

0°

8°

0°

8°

NOTE:
1. Plastic or metal protrusions of 0.15mm maximum per side are not included.
2. BSC (Basic Spacing between Centers), "Basic" spacing is nominal.
3. This drawing is subject to change without notice.

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RS846XP
SOP14 (3)
e

E

b

5.2

E1

1.27

0.6

D
1.27

RECOMMENDED LAND PATTERN (Unit: mm)

A2

c

A

θ

A1
L

Dimensions In Millimeters

Dimensions In Inches

Min

Max

Min

Max

A (1)

1.350

1.750

0.053

0.069

A1

0.100

0.250

0.004

0.010

A2

1.350

1.550

0.053

0.061

b

0.310

0.510

0.012

0.020

c

0.100

0.250

0.004

0.010

D (1)

8.450

8.850

0.333

0.348

Symbol1.270(BSC) (2)e0.050(BSC) (2)

E

5.800

6.200

0.228

0.244

E1 (1)

3.800

4.000

0.150

0.157

L

0.400

1.270

0.016

0.050

θ

0°

8°

0°

8°

NOTE:
1. Plastic or metal protrusions of 0.15mm maximum per side are not included.
2. BSC (Basic Spacing between Centers), "Basic" spacing is nominal.
3. This drawing is subject to change without notice.

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RS846XP
12 TAPE AND REEL INFORMATIONREEL DIMENSIONSTAPE DIMENSION

Reel
DiameterReel Width(W1)

DIRECTION OF FEEDNOTE: The picture is only for reference. Please make the object as the standard.

KEY PARAMETER LIST OF TAPE AND REEL
SOT23-5

Reel
Diameter
7’’

Reel Width
W1(mm)
9.5

A0
(mm)
3.20

B0
(mm)
3.20

K0
(mm)
1.40

P0
(mm)
4.0

P1
(mm)
4.0

P2
(mm)
2.0

W
(mm)
8.0

Pin1
Quadrant
Q3

SOP8

13’’

12.4

6.40

5.40

2.10

4.0

8.0

2.0

12.0

Q1

SOP14

13’’

16.4

6.60

9.30

2.10

4.0

8.0

2.0

16.0

Q1

Package TypeNOTE:
1. All dimensions are nominal.
2. Plastic or metal protrusions of 0.15mm maximum per side are not included.

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RS846XPIMPORTANT NOTICE AND DISCLAIMER
Jiangsu RUNIC Technology Co., Ltd. will accurately and reliably provide technical and reliability data (including
data sheets), design resources (including reference designs), application or other design advice, WEB tools, safety
information and other resources, without warranty of any defect, and will not make any express or implied
warranty, including but not limited to the warranty of merchantability Implied warranty that it is suitable for a
specific purpose or does not infringe the intellectual property rights of any third party.
These resources are intended for skilled developers designing with RUNIC products You will be solely
responsible for: (1) Selecting the appropriate products for your application; (2) Designing, validating and testing
your application; (3) Ensuring your application meets applicable standards and any other safety, security or otherrequirements; (4) RUNIC and the RUNIC logo are registered trademarks of RUNIC INCORPORATED. All
trademarks are the property of their respective owners; (5) For change details, review the revision history
included in any revised document. The resources are subject to change without notice. Our company will not beliable for the use of this product and the infringement of patents or third-party intellectual property rights due
to its use.

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