TECHNICAL NOTE
FabGuard® Tool Data Sensor for Equipment
Data Collection and Diagnostics
MANAGING TOOL DATA
To collect tool parametric information for better results andmanage it at system level, INFICON FabGuard Sensor
Integration and Analysis System uses the unique concept of
the Tool Data Sensor (TDS). TDS is a distinctive feature of
FabGuard that bundles tool SVIDs and organizes them bychamber. Once organized in this way, Tool Data Sensors
allow convenient viewing and analyzing of process recipes forindividual chambers. TDS also allows correlation of toolevents, tool parameters, and tool recipe setpoints for optional
add-on sensors.

2. Process Verification – monitors the proper execution ofprocess recipes;
3. Process Correlation – correlates process state tomeasurements made with add-on sensors, such as RGAs,
RF probes, and particle sensors.
Process and Recipe Verification monitor key aspects ofequipment operation during wafer processing. Thus, productwafers are protected from being misprocessed, because
expected process inputs do not match actual process
conditions.
SVIDs provide information about the execution of a process
recipe. Figure 2 shows data obtained by polling SVIDs for anoxide etch chamber. Some of these SVIDs represent
machine settings. When SVIDs are plotted versus time, they
can be considered representative of recipe setpoints. OtherSVIDs provide the output from each of the many sensors thatare built into the tool. By including other SVIDs, FabGuard
can monitor many other aspects of recipe execution.

Figure 1. System-wide deployment of Tool Data Sensors

Figure 1 shows a PVD cluster tool with each chamber configured
with a Tool Data Sensor. The toolbox icon indicates that SVIDs
specific to a chamber are being acquired and analyzed. For
each TDS, FabGuard uses a recipe table to determine what
process inputs are expected for each wafer process.
There are several benefits from collecting tool information:
1. Recipe Verification – determines if the tool loaded theproper recipe;

Figure 2. Etch chamber Status Variables for several wafers

CONFIRMING PROCESS RECIPES
Recipe Verification confirms that process recipe setpoints
match known setpoints for individual recipes. Since thecorrect process recipe is not always executed, this preventsaccidental or unauthorized changes in recipe setpoints that
result in wafer misprocessing.

VERIFYING THE PROCESSThe incorrect execution of process recipes, often undetected,
can be a costly event.
FabGuard Process Verification provides:
1. confirmation that actual process inputs match recipe
setpoints. This generally involves detecting problems
when system components (MFCs, power delivery, wafertemperature, etc.) are unable to execute properly.

A single Status Variable (SV), e.g., lamp current, is obtained
through SECS and plotted for two wafers undergoing degas
in preparation for metals deposition. In this case, lamps areused to heat the wafers under vacuum to remove adsorbed
contaminants. Degas recipes are frequently time-power
based. The plot on the left shows the expected recipe profile
for lamp current versus time. This particular recipe calls for
23 amps (40% power) for 15 seconds. FabGuard detected afault and alarmed on the wafer depicted on the right. The
reason for the fault is easily seen; the degas lamp power did
not increase above the 10 amp idle current.

FABGUARD PROTECTS FROM COSTLYPRODUCT LOSS

2. correlation of tool events to measurements made with
add-on sensors, e.g. RGA, particle sensors, OES, etc.
(See Smart Vacuum Diagnostics, FabGuard AnalysisExamples)

Figure 4. FabGuard Multi-Run Viewer; Wafer Degas Chamber

Figure 3. Process Verification: confirming expected process inputs.

Figure 3 illustrates how FabGuard Process Verification
capability can be implemented to safeguard wafers bydetecting simple, but costly, problems.

Since faults are rarely confined to a single wafer, a simple
problem becomes costly. Figure 4 shows the same degas
SVID for several lots. FabGuard detected the same fault forthree entire lots - no degas and, therefore, no surface preparation.
These lots proceeded to metals deposition chambers.

GLOBAL HEADQUARTERS:
Two Technology Place, East Syracuse, NY 13057 USA
Tel: +1.315.434.1100 Fax: +1.315.437.3803 E-mail: reachus@inficon.com
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