Multilayer Ceramic Capacitors■PRECAUTIONS
1. Circuit DesignPrecautions◆Verification of operating environment, electrical rating and performance
1. A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or havesevere social ramifications.
Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiatedfrom them used in general purpose applications.
◆Operating Voltage （Verification of Rated voltage）
1. The operating voltage for capacitors must always be their rated voltage or less.
If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less.
For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less.
2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency
AC voltage or a pulse voltage having rapid rise time is used in a circuit.

2. PCB DesignPrecautions◆Pattern configurations （Design of Land-patterns）
1. When capacitors are mounted on PCBs, the amount of solder used （size of fillet） can directly affect the capacitor performance.
Therefore, the following items must be carefully considered in the design of land patterns:（1）Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider
appropriate land-patterns for proper amount of solder.
（2）When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated bysolder-resist.
◆Pattern configurations （Capacitor layout on PCBs）
After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes （PCB
cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.）. For this reason, landpattern configurations and positions of capacitors shall be carefully considered to minimize stresses.
◆Pattern configurations （Design of Land-patterns）
The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts.
（1）Recommended land dimensions for typical chip capacitors
Land patterns for PCBs
●Multilayer Ceramic Capacitors : Recommended land dimensions（unit: mm）
Wave-soldering
Type1608
20123216
L
1.6
2.0
3.2
Size
W
0.8
1.25
1.6
A
0.8 to 1.0
1.0 to 1.4
1.8 to 2.5B
0.5 to 0.8
0.8 to 1.5
0.8 to 1.7
C0.6 to 0.8
0.9 to 1.2
1.2 to 1.6

Technicalconsiderations

Reflow-soldering
Type02010402
0603
1005
1608
20123216
L
0.25
0.4
0.6
1.0
1.6
2.0
3.2
SizeW
0.125
0.2
0.3
0.5
0.8
1.25
1.6
A
0.095～0.135 0.15～0.25 0.20～0.30 0.45～0.55
0.6～0.8
0.8～1.2
1.8～2.5B
0.085～0.125 0.10～0.20 0.20～0.30 0.40～0.50
0.6～0.8
0.8～1.2
1.0～1.5C
0.110～0.150 0.15～0.30 0.25～0.40 0.45～0.55
0.6～0.8
0.9～1.6
1.2～2.0
Note：Recommended land size might be different according to the allowance of the size of the product.

3225
3.2
2.5
1.8～2.5
1.0～1.5
1.8～3.24532
4.53.2
2.5～3.5
1.5～1.8
2.3～3.5●LWDC: Recommended land dimensions for reflow-soldering（unit: mm）
Type0510
0816
1220
L
0.52
0.8
1.25
Size
W
1.0
1.6
2.0
A
0.18～0.22
0.25～0.3
0.5～0.7B
0.2～0.25
0.3～0.4
0.4～0.5C
0.9～1.1
1.5～1.7
1.9～2.1▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E12R01

（2）Examples of good and bad solder application
Item

Not recommended

Recommended

Mixed mounting of SMD andleaded components

Component placement close
to the chassis

Hand-soldering of leaded
components near mounted
components

Horizontal component
placement◆Pattern configurations （Capacitor layout on PCBs）
1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any
stresses from board warp or deflection.
Items
Not recommended
Recommended

Deflection of board

possible mechanicalPlace the product at a rightangle to the direction of the
anticipated mechanicalstress.

1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below.

1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods
are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB,
split methods as well as chip location.
3. Mounting

Precautions◆Adjustment of mounting machine
1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them.
2. Maintenance and inspection of mounting machines shall be conducted periodically.
◆Selection of Adhesives
1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless thefollowing factors are appropriately checked : size of land patterns, type of adhesive, amount applied, hardening temperature andhardening period. Therefore, please contact us for further information.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E12R01

◆Adjustment of mounting machine
1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid
this, the following points shall be considerable.
（1）The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection.
（2）The pressure of nozzle shall be adjusted between 1 and 3 N static loads.
（3）To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shallbe used on the other side of the PCB. The following diagrams show some typical examples of good and bad pick-up nozzle
placement:
Item
Improper method
Proper method

Single-sided mounting

Double-sided mounting

Technical
considerations

2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanicalimpact on the capacitors.
To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of
the pin shall be conducted periodically.
◆Selection of Adhesives
Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may resultin stresses on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affectcomponents. Therefore, the following precautions shall be noted in the application of adhesives.
（1）Required adhesive characteristics
a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive shall have sufficient strength at high temperatures.
c. The adhesive shall have good coating and thickness consistency.
d. The adhesive shall be used during its prescribed shelf life.
e. The adhesive shall harden rapidly.
f. The adhesive shall have corrosion resistance.
g. The adhesive shall have excellent insulation characteristics.
h. The adhesive shall have no emission of toxic gasses and no effect on the human body.
（2）The recommended amount of adhesives is as follows;
Amount adhesive
After capacitor are bonded［Recommended condition］
Figure2012/3216 case sizes as examples
a0.3mm minb
100 to 120μmc
Adhesives shall not contact land

4. Soldering

Precautions◆Selection of Flux
Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use;（1）Flux used shall be less than or equal to 0.1 wt%（ in Cl equivalent） of halogenated content. Flux having a strong acidity content shallnot be applied.
（2）When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level.
（3）When water-soluble flux is used, special care shall be taken to properly clean the boards.
◆Soldering
Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions.
Sn-Zn solder paste can adversely affect MLCC reliability.
Please contact us prior to usage of Sn-Zn solder.

Technicalconsiderations◆Selection of Flux
1-1. When too much halogenated substance（Chlorine, etc.） content is used to activate flux, or highly acidic flux is used, it may lead tocorrosion of terminal electrodes or degradation of insulation resistance on the surfaces of the capacitors.
1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted
and may adversely affect the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in highhumidity conditions may cause a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning methods▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E12R01

and the capability of the machines used shall also be considered carefully when water-soluble flux is used.
◆Soldering･ Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.
･ Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermalshock.
･ Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within
130℃.
･ Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100℃.
［Reflow soldering］【Recommended conditions for eutecticsoldering】【Recommended condition for Pb-freesoldering】

Caution①The ideal condition is to have solder mass（fillet）controlled to 1/2 to 1/3 of the thicknessof a capacitor.
②Because excessive dwell times can adversely affect solderability, soldering duration shallbe kept as close to recommended times as possible. soldering for 2 times.

［Wave soldering］【Recommended conditions for eutecticsoldering】【Recommended condition for Pb-freesoldering】

Caution①Wave soldering must not be applied to capacitors designated as for reflow soldering only. soldering for 1 times.

［Hand soldering］【Recommended conditions for eutecticsoldering】【Recommended condition for Pb-freesoldering】

3216type or less⊿T⊿T≦150℃

3225type or more

⊿T⊿T≦130℃

Caution①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm.
②The soldering iron shall not directly touch capacitors. soldering for 1 times.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E12R01

5. CleaningPrecautions◆Cleaning conditions
1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended useof the cleaning. （e.g. to remove soldering flux or other materials from the production process.）
2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affectcapacitor's characteristics.

Technical
considerations

1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate
their outer coating, resulting in a degradation of the capacitor's electrical properties （especially insulation resistance）.
2. Inappropriate cleaning conditions（ insufficient or excessive cleaning） may adversely affect the performance of the capacitors.
In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead to the cracking of
capacitors or the soldered portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall be carefullychecked;
Ultrasonic output :20 W/ℓ or les
Ultrasonic frequency :40 kHz or less
Ultrasonic washing period : 5 min. or less

6. Resin coating and mold

Precautions

1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or whileleft under normal storage conditions resulting in the deterioration of the capacitor's performance.
2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat
may lead to damage or destruction of capacitors.
The use of such resins, molding materials etc. is not recommended.

7. Handling

Precautions◆Splitting of PCB
1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to theboard.
2. Board separation shall not be done manually, but by using the appropriate devices.
◆Mechanical considerations
Be careful not to subject capacitors to excessive mechanical shocks.
（1）If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used.
（2）Please be careful that the mounted components do not come in contact with or bump against other boards or components.

8. Storage conditions

Precautions◆Storage
1. To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to controltemperature and humidity in the storage area. Humidity should especially be kept as low as possible.
・Recommended conditions
Ambient temperature : Below 30℃
Humidity : Below 70% RH
The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of capacitor is deteriorated astime passes, so capacitors shall be used within 6 months from the time of delivery.
・Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air.
2. The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time, so care shall be taken
to design circuits. Even if capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at 150℃
for 1hour.

Technical
considerations

If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidationand quality loss of taping/packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding
the above period, please check solderability before using the capacitors.

※RCR-2335B（Safety Application Guide for fixed ceramic capacitors for use in electronic equipment）is published by JEITA.
Please check the guide regarding precautions for deflection test, soldering by spot heat, and so on.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E12R01