Wire-wound Metal Power Inductors MCOILTM LSBH series
for General Electronic Equipment for Consumer
Wire-wound Metal Power Inductors MCOILTM LSBH series (125℃ guaranteed product)for General Electronic Equipment for Consumer
Wire-wound Metal Power Inductors MCOILTM LLBH series
for Medical Devices classified as GHTF Classes A or B (Japan Classes I or II)
Wire-wound Metal Power Inductors MCOILTM LLBH series (125℃ guaranteed product)for Medical Devices classified as GHTF Classes A or B (Japan Classes I or II)■RELIABILITY DATA
1. Operating Temperature Range
Specified Value－40～＋105℃：LSBH/LLBH－40～＋125℃：LSBH/LLBH (125℃ guaranteed product)

Test Methods
and Remarks

Including self-generated heat

2. Storage Temperature Range
Specified Value－40～＋85℃

Test Methods
and Remarks

0 to 40℃ for the product with taping.

3. Rated current
Specified Value

Within the specified tolerance

4. InductanceSpecified Value

Within the specified tolerance

Test Methods
and Remarks

Measuring equipment
Measuring frequency: LCR Meter （HP 4285A or equivalent）: 1MHz、1V

5. DC ResistanceSpecified Value

Within the specified tolerance

Test Methods
and Remarks

Measuring equipment: DC ohmmeter （HIOKI 3227 or equivalent）

6. Self resonance frequency
Specified Value－7. Temperature characteristic
Specified Value

Inductance change : Within ±15%

Test Methods
and Remarks

LSBH/LLBH：
Measurement of inductance shall be taken at temperature range within －40℃～＋105℃.
With reference to inductance value at ＋20℃., change rate shall be calculated.
LSBH/LLBH (125℃ guaranteed product)：
Measurement of inductance shall be taken at temperature range within －40℃～＋125℃.
With reference to inductance value at ＋20℃., change rate shall be calculated.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MB_S_L_reli_e-E10R01

8. Resistance to flexure of substrate
Specified Value

Test Methods
and Remarks

No damageThe test samples shall be soldered to the test board by the reflow. As illustrated below, apply force in the direction of the arrow indicatinguntil deflection of the test board reaches to 2 mm.
Test board size
: 100×40×1.0 mm (1608 type：0.8mm)
Test board material: Glass epoxy-resin
Solder cream thickness: 0.1 mm

9. Insulation resistance : between wires
Specified Value－

10. Insulation resistance : between wire and core

Specified Value

LSBH/LLBH：
DC25V 100kΩ min
LSBH/LLBH (125℃ guaranteed product)：
DC50V 100kΩ min

11. Withstanding voltage : between wire and core
Specified Value－12. Adhesion of terminal electrodeSpecified ValueNo abnormality.

Test Methods andRemarksThe test samples shall be soldered to the test board by the reflow.
Applied force: 10N (1608 type：5N) to X and Y directions.
Duration: 5s.
Solder cream thickness: 0.1mm.

13. Resistance to vibration
Specified Value

Inductance change : Within ±10%No significant abnormality in appearance.

Test Methods
and Remarks

The test samples shall be soldered to the test board by the reflow.
Then it shall be submitted to below test conditions.
Frequency Range
10～55Hz
Total Amplitude
1.5mm (May not exceed acceleration 196m/s2)
Sweeping Method
10Hz to 55Hz to 10Hz for 1min.
XTimeYFor 2 hours on each X, Y, and Z axis.
ZRecovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.

14. Solderability
Specified ValueAt least 90％ of surface of terminal electrode is covered by new solder.

Test Methods andRemarks

The test samples shall be dipped in flux, and then immersed in molten solder as shown in below table.
Flux : Ethanol solution containing rosin 25%.
Solder Temperature
245±5℃
Immersing speed
25mm/sTime
5±0.5 sec.
※Immersion depth : All sides of mounting terminal shall be immersed.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MB_S_L_reli_e-E10R01

15. Resistance to soldering heatSpecified Value

Inductance change : Within ±10%No significant abnormality in appearance.

Test Methodsand Remarks

The test sample shall be exposed to reflow oven at 230℃ for 40 seconds, with peak temperature at 260＋0/－5℃ for 5 seconds, 3times.
Test board material: Glass epoxy-resin
Test board thickness: 1.0mm
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.

16. Thermal shockSpecified Value

Inductance change : Within ±10%No significant abnormality in appearance.

Test Methods
and Remarks

LSBH/LLBH：
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed at specified temperature for
specified time by step 1 to step 4 as shown in below table insequence. The temperature cycle shall be repeated 100 cycles.
Conditions of 1 cycle
StepTemperature (℃)
Duration (min)1－40±330±32
Room temperatureWithin 33＋85±230±34Room temperatureWithin 3Recovery : At least 2hrs of recovery under the standard condition
after the test, followed by the measurement within 48hrs.

LSBH/LLBH (125℃ guaranteed product)：
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed at specified temperature for
specified time by step 1 to step 4 as shown in below table insequence. The temperature cycle shall be repeated 100 cycles.
Conditions of 1 cycle
Step
Temperature (℃)
Duration (min)1－40±330±32
Room temperatureWithin 3
3＋125±230±34Room temperatureWithin 3
Recovery : At least 2hrs of recovery under the standard condition
after the test, followed by the measurement within 48hrs.

17. Damp heatSpecified Value

Test Methods
and Remarks

Inductance change : Within ±10%No significant abnormality in appearance.
LSBH/LLBH：
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at
specified temperature and humidity as shown in below table.
Temperature
60±2℃
Humidity
90～95%RH
Time
1000＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition
after the test, followed by the measurement within 48hrs.

LSBH/LLBH (125℃ guaranteed product)：
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at
specified temperature and humidity as shown in below table.
Temperature
85±2℃
Humidity
85%RHTime
1000＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition
after the test, followed by the measurement within 48hrs.

18. Loading under damp heatSpecified Value

Test Methods
and Remarks

Inductance change : Within ±10%No significant abnormality in appearance.
LSBH/LLBH：
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at
specified temperature and humidity and applied the rated current
continuously as shown in below table.
Temperature
60±2℃
Humidity
90～95％RH
Applied current
Rated current
Time
1000＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition
after the test, followed by the measurement within 48hrs.

LSBH/LLBH (125℃ guaranteed product)：
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at
specified temperature and humidity and applied the rated current
continuously as shown in below table.
Temperature
85±2℃
Humidity85％RH
Applied current
Rated current
Time
1000＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition
after the test, followed by the measurement within 48hrs.

19. Low temperature life test
Specified Value

Test Methods
and Remarks

Inductance change : Within ±10%No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shownin below table.
Temperature－40±2℃
Time
1000＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MB_S_L_reli_e-E10R01

20. High temperature life test
Specified Value

Test Methods
and Remarks

Inductance change : Within ±10%No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shownin below table.
Temperature
85±2℃
Time
1000＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.

21. Loading at high temperature life test
Specified Value－22. Standard condition

Specified Value

Standard test condition :Unless otherwise specified, temperature is 20±15℃ and 65±20％of relative humidity.
When there is any question concerning measurement result: In order to provide correlation data, the test shall be condition of 20±2℃ oftemperature, 65±5% relative humidity.
Inductance is in accordance with our measured value.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MB_S_L_reli_e-E10R01