New Year's Greetings / 1
Activities of the Micromachine Center / 2
Activities of the BEANS Laboratory / 6
Members' Profiles / 8

New Year’s Greetings
As we welcome in 2010, it gives me great pleasure to wish you all a happy New Yearand to offer some thoughts on this new beginning. First, I would like to express mygratitude to all who have given their cooperation and support to the Micromachine
Center and the BEANS Laboratory.
Last year I was appointed chairman of both entities at the joint board meeting held
on September 17 and assumed my duties on the following day. While I am deeply
honored to receive such an important responsibility, at the same time I fully realize themagnitude of these duties. As chairman I will strive to continue our efforts indeveloping micromachines, MEMS, and other micro/nano fields, and I shall be gratefulfor your support.
Hisao Sakuta,
Forgive me for starting out the New Year on a somber note, but as you know the
Chairmanstate of Japan’s economy remains dire due in part to the failure of Lehman Bros. theMicromachine Centeryear before last and the Dubai debt crisis this past fall. In order to break out of thisBEANS Laboratory
situation, it is essential that we intensify our efforts in technological development,
which is the key to keeping Japan’s industries internationally competitive. For thisreason, we must double our efforts in technological development related to MEMS and other micro/nano fields, now
considered important industrial technologies.
To do this, the BEANS Project to develop next-generation device manufacturing technologies that fuse different
fields, which was established to develop core process technologies required for creating innovative next-generation
devices and to build a platform for this development, has set its sights on developing applications in a wide range offields that include energy and the environment, safety and security, and health and medical care, as well as intraditional fields of application. We hope to increase and expand the market for micro/nano devices by creating new
devices to support Japan’s industry across diverse fields.
The BEANS Project is now entering its third year, which is the interim evaluation year. In 2010, the achievementsof the project will become more evident and will help us establish a roadmap for developing base technologies
required to produce innovative next-generation devices. Therefore, I would like to thank you all in advance for yourcontinued support and cooperation with regard to the activities of the BEANS Laboratory.
On another note, the Micromachine Center has entered its 18th year this January. However, after the three laws onreforming the public interest corporations system went into effect in December 2008, the Micromachine Center
decided to shift from its current public interest status to a general incorporated foundation in order to maintain alevel of freedom amid the rapidly fluctuating social environment and ensure a stable environment for conducting
operations. Accordingly, we have submitted an application to the Cabinet Office for making this change. In the eventthat our application is approved, we will reevaluate our roles and responsibilities as a general incorporated foundation
and will continue our activities in the hope of contributing to Japan’s international competitiveness in industry and tothe creation of a future affluent society.
In regard to the activities of the MEMS Industry Forum under the Micromachine Center, this year we will continue
working with all those involved in studies aimed at strengthening an infrastructure for the future creation of
nanotechnology R&D centers. We ask for your continued support and cooperation in this matter as well.
Finally, on behalf of the Micromachine Center and the BEANS Laboratory, I would like to offer you all mysincerest wishes for a fruitful year. Thank you and Happy New Year.
January 20101

Activities of the Micromachine Center

Research Studies and Standardization Activities
1. Study on Industrial Trends

2. S t a n d a r d i z a t i o n
Activities

MEMS technology is expected to progress from singlefunction devices produced through more advanced downsizing

The Subcommittee onof existing parts to multifunction devices produced through the

MEMS (SC47F) of the Technicalcombination of MEMS and nano-devices, the integrated

Committee on Semiconductor

formation of MEMS with semiconductors, and the highDevices (TC47) under the

integration of MEMS with other MEMS, as well as innovative

International Electrotechnicaldevices developed through the fusion of nano-bio technologies.

Commission(IEC)

is View of the Tel Aviv coastline

With this background, the Industrial Trends Study

responsible for reviewing MEMS international standardization.

Committee (chair: Isao Shimoyama, dean of the Graduate

On October 18–22, 2009, the SC47F was invited to the IEC

School of Information Science and Technology, the University

General Meeting held in Tel Aviv, Israel for TC47-relatedof Tokyo) under the Micromachine Center is conducting acommittee meetings and working group conferences.

research study on (1) trends in devices employing MEMS

Approximately one thousand

technology (MEMS applications) and products incorporating

people attended the opening

these devices (MEMS-Inside), and (2) the leading companies inceremony, which featured an

MEMS-related industries and their business profiles (company

address by the IEC president,

trends). This study is aimed at keeping track of developmentsasin devices with added value owing to MEMS technology,

entertainment imbued withindustrial fields employing such devices, and MEMS-enabledsound and lights, videos,

products (MEMS-Inside) and at developing a roadmap forsinging, and dancing.

well

as

spectacular

The opening ceremony

A total of twenty-six people attended the international

market expansion in the MEMS industry.
The study on MEMS-Inside is being conducted from two

conference for SC47F, including ten from Japan, twelve fromperspectives: trends from single-function MEMS toward highly

South Korea, and one each from China, Germany, the Unitedintegrated, complex MEMS, and trends in patent applications.

States, and Brazil. The main agenda for this conference was toBased on these perspectives, data on the future expansion ofreview the comments by all countries on the three approved

MEMS applications (MEMS-Inside) will be compiled into 13

New Work Item Proposals (NP) for which voting closed on

industry-specific fields, such as information and communication

October 9, 2009. The committee came to an agreement toequipment, automobiles, consumer electronics and appliances,

accept nearly all comments and to prepare a new Committee

and medical and welfare equipment.

Draft (CD) based on the results of this review. The approved
proposals are as follows.

The committee is also conducting a research study on(1) Test method of measuring adhesive strength for MEMS

sensor networks and service robots, two up-and-coming fields

structure (proposal from Japan)

currently expected to yield further expansion of MEMS

(2) Micropillar compression test for MEMS material (proposal

applications.

from South Korea)

The committee studies trends of companies involved in(3) Test method for linear thermal expansion coefficients of

MEMS-related industries by sorting all domestic companies

MEMS material (proposal from South Korea)

conducting MEMS business according to the type of businessand by determining the type of MEMS-related business or

Thereafter, South Korea submitted three NPs entitledactivities the company is conducting and the type of MEMS-“Forming limit measuring method of metallic film materials,”

related activities to which the company aspires. The committee“Test method for bond strength in PDMS/glass chip,” and “Testalso studies the organization of Japan’s leading MEMS-related

method for residualcompanies, the types of devices handled by MEMS device

stress measurement.”

manufacturers and their applications, and the state of MEMS

The

foundries in Japan based on data gathered from companies thatcommittee is currently

participate in the Exhibition Micromachine/MEMS and that

deliberating on Japan’s

apply for MEMS-related patents, and the Micromachine

voting position. Within

Center’s database of micro/nano-related documents.

the next six months,
Japan

The Industrial Trends Study Committee will summarize thedomestic

plans

to

propose the two NPs

current status and future outlook of MEMS-related industries in
The WG conference

the “FY2009 Report on Industrial Trends” in March 2010 to“Bending test methodof thin film materials” and “Standard data for assessing material

provide feedback for those involved in the MEMS industry.

characteristics.”

2

Recent Activities of the MEMS Industry Forumto business opportunities for the MMC’s supporting members
and contribute to the formation of TIA-NMEMS.

1. Overview of Plans for MicroNano 2010
The micromachine exposition MicroNano 2010 will be heldat Tokyo Big Sight on July 28–30, 2010. Having reached aconsensus on the basic concepts and goals for MicroNano 2010,
the Micromachine Center, which is sponsoring the event, andthe organizer Mesago Messe Frankfurt Corporation are now
working in concert on preparations for the event.
The turnout for MicroNano 2009 was heavily affected by thepoor economic conditions, and the event experienced its firstdecline in recent years in the numbers of exhibitors andvisitors. While the economic climate for fiscal year 2010 remains
uncertain, we hope to regain the momentum toward growthseen in previous years.
In an effort to attract more exhibitors and visitors, in 2010
the Exhibition Micromachine/MEMS will be held concurrently
with ROBOTECH, an exhibition on manufacturing technologies
for service robots utilizing MEMS sensors (an exhibition on
surface technology, SURTECH, will also be held concurrently).
The MEMS Industry Forum (MIF) is also considering adding
more concurrent events, such as a workshop on Nanoimprint
Technologies and a workshop for our international affiliates.
The MIF is conducting promotional activities leading up to
MicroNano 2010, including participation in the International
Robot Exhibition and addressing robot MEMS in our MEMS
workshops. We are also working on plans to enhance the MMC
concierge service at the Exhibition Micromachine/MEMS, aswell as to provide the most valuable technical information,business information, and business opportunities in one locationfor exhibitors and visitors. Please consider participating in
MicroNano 2010 as an exhibitor or visitor. This event is not tobe missed!

Workshop with LETIITRI signing

3. Study on a human resource development Program
While the economy is at a standstill due to the recession,
there is no doubt that the MEMS industry will continue to growin the long-term. With the market for MEMS expected to growto some 2 trillion yen, the need to develop skilled personnel toaccommodate this market scale has become urgent.
The MIF is studying a new education and training programin which the Micromachine Center would play a pivotal role.
While personnel training projects have been conducted at AIST
and at public institutes in northern Kyushu and the Kansai area,
this program is aimed at expanding the training projects
nationwide in the next fiscal year through a subsidy from the
Kanto Bureau of Economy, Trade and Industry. Entitled “theInnovative Micro/nano Personnel Training Program”(provisional title), the program would restructure and reformthe current curriculum, including the addition of new courses,
and would be aimed at developing not only experts infabrication processes and device design, but also personnel
capable of bridging the gap between technological seeds andmarket needs to produce commercial products.

4. Formation of the Tsukuba Nano-tech Innovation
Arena N-MEMS

2. Networking International Affiliates
The MIF actively pursues collaboration with its international
affiliates. In addition to transmitting information from Japan andcollecting the latest technical information from around the world,
information exchange with international affiliates is directly
linked to the concept of “open innovation” embodied in theformation of the Tsukuba Innovation Arena Nano (TIA-Nano).
In October 2009, a second joint workshop with CEA-LETI of
France was held at AIST Tsukuba, where both parties gained adeeper understanding of robot MEMS, sensor networks, and 3D
integration. We are currently exploring the possibilities forcontinued collaboration with LETI.
Taiwan’s Industrial Technology Research Institute (ITRI)
became our 19th international affiliate on November 25. At thesame time, we held a joint workshop at the University ofTokyo’s Komaba Campus to cultivate a better understanding
with the ITRI and explore the potential for future collaboration.
In addition to these workshops, the MIF shared information
with the Berkeley Sensor & Actuator Center (BSAC) and the
MEMS Industry Group (MIG) of the U.S. and IMEC of Belgium,and discussed possibilities for intercourse with Canada and theNetherlands. It is hoped that these activities will eventually lead

Creation of the Tsukuba Nano-tech Innovation Arena NMEMS is an endeavor aimed at the promotion of advanced
research requiring a high capital investment that individualcompanies generally cannot afford and the enhancement ofdesign and trial production capabilities needed for pioneering
MEMS applications. The endeavor has been gaining momentum
with the June establishment of an executive council and aseries of workshops held through the support of METI. The
Micromachine Center is studying a draft on a strategy andorganization aimed primarily at forming N-MEMS.
The BEANS Project and the research organization for
GMEMS (high-performance sensor networks and low
environmental impact fabrication processes), which has been
proposed for a supplementary budget or the budget for the next
fiscal year, are in position to make of the core of N-MEMS. We
will continue to propose strategies for using Japan’s strengths
to overcome our intense global competition and will conduct
studies in cooperation with the Micromachine Center’s
supporting members on forming N-MEMS.

3

Activities of the MEMS System Development Center
1. Subcommittee Meeting on the Fine MEMS
Project (Post-project Evaluation)

seminar was organized by the National Institute of Advanced

In order to bring the Fine MEMS Project to a close, a NEDO

prime senior researcher) and Peking University (Haixia “Alice”

research evaluation committee established to assess the R&D

Zhang, professor). A total of thirteen speeches were given at theIndustrial Science and Technology (AIST) (Dr. Ryutaro Maeda,

seminar, including seven from Japan and six from China.

stconducted over this three-year project held the 1 “Highly
Integrated, Complex MEMS Production Technology

Dr. Maeda described a general strategy for facility

Development Project” (Post-project Evaluation) Subcommittee

management in green MEMS, and discussed the importance ofMeeting at the WTC Conference Center on October 5, 2009.

such management and the effects it would have on applications
in MEMS networking. His speech drew questions and discussion

Seven committee members participated in thesubcommittee meeting, which was chaired by Kuniki Owada

on specific reductions for CO2 gases. Prof. Zhang described the(professor at the Department of Information Science, theMEMS-related market and business activities in China andFaculty of Science and Engineering, Teikyo University). At thediscussed the concept and importance of incorporating sensor

subcommittee meeting, the principal investigator Hajime

networks in these activities. She also described plans to

Inuzuka of the Machinery System Technology Development

construct a green clean room at Peking University in order to

Department (NEDO), which is overseeing the project,demonstrate its efficacy and reported that network sensors may

explained the significance and necessity of the project and thealso be useful from a safety perspective, and not just a green

R&D management implemented. Isao Shimoyama, professor atperspective, as in motion sensors and optical sensors for

the University of Tokyo and project leader, then gave an

monitoring human activity and RF and SIC pressure sensors,

overview of the R&D achievements and prospects forwhich are resistant to chemicals and high temperatures. Hercommercialization.

speech sparked several questions, such as whether particle

These presentations were followed by a private session insensors were also being considered for use as network sensors

which the heads of development for each company involved inin the clean room, and led to a more in-depth discussion thatthe project presented their research achievements in the eightillustrated the high level of interest in sensor networks.

subsidized projects. In the ensuing public session, Susumu

Toshihiro Ito of the AIST talked about a health monitoring

Sugiyama, a professor at Ritsumeikan University and Fine

system for chickens as one application of MEMS chips andMEMS Project subleader, gave a report on the R&D

sensor networks. Some felt that this would draw much interest

achievements for seven commissioned projects (excluding thefrom a marketing standpoint in China, since more than a billion

fine MEMS knowledge database and the integrated design

chickens are raised in this country.

platform projects). At the end of the public session, the MEMS

The China side also gave presentations on the environment

System Development Center of Micromachine Center presented

for MEMS technology. Dr. Li Gang of Suzhou Microsensing

the results of compiling the knowledge database and developing

Company reported on the climate for MEMS venture businesses

the integrated design platform.

in China, noting that the MEMS market is still underdeveloped,

At the subcommittee meeting, there was a lively question

there is no support from MEMS foundries, few engineers haveand answer session among the evaluation committee members

the necessary skills to develop MEMS, and MEMS industries are

and other involved parties. The committee members recognized

not growing. There was sentiment on the Japanese side thatthat the achievements produced in this project was some of thethis situation presents an opportunity for foundry services.

most original and cutting-edge in the world, and there were

Wang Hong of China Micro-Nano & Sensor Network Global

comments to the effect that the research results overall were

Innovation Perk reported on activities in Wuxi related to MEMS

outstanding.

and sensor networks. The city is trying to attract MEMS
businesses and, toward that end, is proactively developing the

The final evaluation of this project is expected to benecessary sites and infrastructure.

completed by the end of January 2010 after deliberation by theLastly, Prof. Renshi Sawada of Kyushu University informed

NEDO research evaluation committee.

the participants of plans to hold the fourth seminar in Hokkaido
the following August.

2. Report on the Third China & Japan Joint
Seminar on Green MEMS and Sensor Networks

In conclusion, the seminar featured a wide variety of

On November 24–25, 2009, Japan and China held a jointpresentations on efforts to integrate industry, academia, andseminar at the Millenium Hotel in Wuxi, China on MEMS sensor

government, the core technologies necessary for MEMS

networks, which are currently drawing attention as an area of

research, the environment in China for MEMS, and efforts toresearch that must be pursued to meet future needs for low

develop applications for MEMS sensors, and the event proved

environmental impact, safety, security, and comfort. The

to be of great interest to all participants.

4

Dissemination and Publicity Projects
Special Lecture II : “An introduction to the MEMS Equivalent

1. International Robot Exhibition 2009

Circuit Generator”; Gen Hashiguchi,

The International Robot Exhibition 2009 organized by theprofessor at Shizuoka University

Japan Robot Association and Nikkan Kogyo Shimbun, Ltd. wasCase Studies I

held November 25–28 at Tokyo Big Sight. The Micromachine: “Applying MemsONE circuit analysis to theCenter (MMC) participated in the exhibition to introduce

design of a rotary stepper motor”; Junji

MEMS technology and the Center’s activities.

Sone, associate professor at Tokyo
Polytechnic University

In order to illustrate MEMS technology to both people
Case Studies II

involved in robotics and the general public, the MMC set up a: “Advanced mesh generating techniqueswith MemsONE”; Yukihisa Maeda, UEL

trial corner for visitors to experience motion sensing. Here, an

Corporation

accelerometer and a gyroscope (angular velocity sensor),
practical examples of MEMS-based sensors, were incorporated

Demonstration on the features of version 3.0: the MemsONE

in a game controller. With many children and adults took turns

Support Center

trying out the controller throughout the exhibition, the trial
corner helped illustrate how MEMS devices are already working
for us in our everyday lives, as reflected in the expression“MEMS in your pocket.”In addition, the MMC booth featured presentations on the
MEMS Mall, a service for introducing MEMS products over theInternet, and examples of practical applications produced fromProf. Kotera of Kyoto
University

the METI’s Micromachine Project, which laid the foundation forProf. Hashiguchi of
Shizuoka University

Japan’s micromachine and MEMS technology in the 1990s. Bothpresentations were well received. We also announced the

3. Publicizing MemsONE Nationwide

upcoming event MicroNano 2010 to be held July 28–30, 2010.
The event, which is being sponsored by the MMC, will include

Previously, the MMC has disseminated information on

ROBOTECH, Exhibition on Service Robot Manufacturing

MemsONE through exhibits, lectures, seminars, and workshops

Technologies that is to be held concurrently with the Exhibition

primarily in metropolitan areas. However, recently we began

Micromachine/MEMS.

expanding our PR efforts through personnel training projects
being conducted throughout Japan.
The MMC manned an exhibit at the 13 t h Tohoku CAE
Konwakai held October 16 in Miyako City, Iwate. MemsONE
was also used as the teaching material in intensive analyticalcourses held concurrently with the Forum for CAE engineers.
To read more about the CAE Konwakai, please go to the Web
site http://www.cae21.org/.

The MMC booth

As part of the “Personnel training program for pioneering

The MEMS trial corner

new innovative projects related to micro/nano mass production
and applied device fabrication,” a personnel training projectnd

conducted in 2009 through industry-academia collaboration, the2. The 2 MemsONE Technology Forum in Tokyo
MemsONE Technology

National Institute of Advanced Industrial Science and Technology

Forum in Tokyo was held at the MMC’s Techno Salon. In an(AIST) organized a personnel training workshop entitled “MEMS

effort to publicize MemsONE to a wider group of people, thedesign and simulation techniques.” The workshop was held at

name of the forum was changed this year from the MemsONE

Techno Plaza Okaya in Okaya City, Nagano on October 26 andUser’s Group so as to accept not only users, but also anyone

featured MemsONE as the training material.

On November 27, 2009, the 2ndinterested in MemsONE, and participation in the forum wasfree. This year’s event attracted a total of twenty people,

Announcing the release of MemsONE Version 3.0!!

including speakers, users, and the general public and created a

More friendly (boundary element method andshape-defining function)

hot discussion.
The following is a list of the lectures given at the 2 n dMore powerfully (mesh generator, mask CAD)

MemsONE Technology Forum in Tokyo.
Special Lecture I

Improved material and knowledge databases: “R&D on microdevices for applications in

See http://www.mmc.or.jp/mems-one/ for more
information.

regenerative medicine”; Hidetoshi Kotera,professor at Kyoto University

5Activities of the BEANS Laboratory

Achievements and Activities of the BEANS ProjectCenter, two by the 3D BEANS Center, and one by the Life
BEANS Center Kyushu, resulting in extensive publicity for the
BEANS Project. The significance of the research conducted at
the Life BEANS Center also received a boost in publicity when
researcher Nobuo Misawa received the Igarashi Award for his
presentation.
(1) Presentations by the Macro BEANS Center• Thin film deposition technologies on fibers by inkjet (Akio
Mimura senior researcher; Sensor Symposium)• High speed thin film coating process on fiber-type substrates
with die coater (Norihisa Shibayama, researcher; Sensor
Symposium)• Structual properties of Si films deposited by plasma enhanced
chemical transport method under atomospheric pressure(Takaaki Murakami, senior researcher; Sensor Symposium)• Ejection of microparticulate silicon using mist-jet technology(Yoshinori Yokoyama, senior researcher; Sensor Symposium)• Flexible sheet device by weaving functional fibers (Takeshi
Kobayashi, researcher; Micro-Nano Symposium)• Microfabrication process of cellular structures in hollow fibershaped substrates (Sohei Matsumoto, senior researcher;
Micro-Nano Symposium)(2) Presentations by the Life BEANS Center• A consideration on mechanisms of droplet formation in flow
focusing devices (Yukihito Suzuki, researcher; Sensor
Symposium)• Multichannel chemical sensors using cells expressing
olfactory receptors (Nobuo Misawa, researcher; Sensor
Symposium)• Subcutaneous implantable blood glucose sensors using
glucose responsive fluorescent gel beads (Hideaki Shibata,
researcher; Sensor Symposium)(3) Presentations by the 3D BEANS Center• Fabrication and control of InAlGaN quaternary quantum dotswith deep-UV emission (Takayoshi Takano, researcher;Sensor Symposium)• The analysis of a comb-drive actuator with the considerationof depletion layer (Shinji Ueki, researcher; Sensor
Symposium)(4) Presentations by the Life BEANS Center Kyushu• Thermal properties of nano-structured materials and thermal
measurements by MEMS (Koji Miyazaki, senior researcher;
Micro-Nano Symposium)

At its five research centers (Life BEANS Center, Life
BEANS Center Kyushu, 3D BEANS Center, 3D BEANS Center
Shiga, and Macro BEANS Center) and its head office, theBEANS Laboratory has been conducting R&D on process
technologies for integrating biomaterials, integrating organic
matter, fabricating 3D nanostructures, fabricating 3D
nanostructures for space applications, and large-area
continuous manufacturing of micro/nanostructures, and has
been building up of a knowledge database in heterogeneoustechnology convergence process development. In this fiscal
year, we have so far presented our research achievements atdomestic and overseas academic conferences, including the 26th
Symposium on Sensors, Micromachines & Applied Systems(hereinafter “Sensor Symposium”), through forty-four
presentations and eight paper submissions, and haveadditionally applied for sixteen patents. In order to further
publicize the achievements of the BEANS Project, we held
seminars at BEANS research centers (AIST on October 2 andthe University of Tokyo on November 25), promoted technology
exchange with LETI of France and ITRI of Taiwan, andparticipated in a panel discussion at the MEMS Executive
Congress (held on November 4–6 and organized by the MEMS
Industry Group) to introduce the activities of the BEANS
Project.
This article describes our participation in the 26 th Sensor
Symposium, where we gave various presentations on theachievements of the BEANS Project as part of our activities.

1. The 26th Sensor Symposium
Sponsored by the IEEJ Sensors and Micromachines Society,
the Sensor Symposium is the largest symposium in Japan on
sensors, MEMS, and micromachines. At the 25 t h Sensor
Symposium held in Okinawa in 2008, the first session on
BEANS was held together with the Professional Committee ofMicro-Nano Engineering of the Japan Society of MechanicalEngineers (JSME). However, a BEANS session was notincluded in the 26th Sensor Symposium, which was held October
15–16, 2009 at Tower Hall Funabori, Tokyo. Still, the 26th
Sensor Symposium, which was held jointly with the 1 s t
Symposium on Micro-Nano Engineering (hereinafter “MicroNano Symposium”) organized by the Professional Committee ofMicro-Nano Engineering of JSME and the Symposium on
Integrated MEMS Technology organized by the Study Group of
the Integrated MEMS of the Japan Society of Applied Physics(JSAP), lived up to its name as the largest symposium on
sensors, MEMS, and micromachines.
The BEANS Project selected these symposia as the primaryvenues for presenting the achievements of the Project, givingnine presentations at the 26th Sensor Symposium and three atthe Micro-Nano Symposium, for a total of twelve presentations.
Since the 26th Sensor Symposium featured 153 presentations inall, including invited lectures, and the Micro-Nano Symposium
56 presentations, the BEANS Project accounted for 5.9% and5.4% of the respective symposia, exceeding 5% overall.
Broken down by research center, six presentations were
given by the Macro BEANS Center, three by the Life BEANS

Nobuo Misawa receiving the Igarashi Award

6

Research Centers under the BEANS Project (Part II)
1. Life BEANS Center Kyushu (Kyushu University)

3. Macro BEANS Center (AIST)The Life BEANS Center Kyushu is involved in thedevelopment of process technologies for integrating bio andorganic materials. Organic semiconductor has been recognized
as a key for developing the next generation of electronics.
These days it is expected to develop optic and electronic
devices with added value of flexibility and a large surface areawith high quality that are difficult to achieve with conventional
inorganic semiconductors. Our research team is developing
organic semiconductor fabrication processes that provide an
inexpensive solution to large-area nanostructure control, withthe goal of expanding into optoelectric and thermoelectricenergy conversion devices in the future.
The Life BEANS Center Kyushu collaborates with the
Kyushu Institute of Technology, Lintec Corporation, andPanasonic Electric Works and operates in close coordination
with research teams at the University of Tokyo and the National
Institute of Advanced Industrial Science and Technology(AIST). We are striving to integrate such dissimilar fields aselectronics, chemistry, and mechanics and are developing
process technologies for integrating new bio-organic materials.
A distinction of our Center is the large number of joint research
projects that we are conducting with other centers in the
BEANS Project, including a joint project with the 3D BEANS
Center on ultra low-damage dry etching using a neutral beam,
and a supercritical deposition technology. We have accelerated
research on the neutral beam etching technology after installing
equipment for etching organic film at the Life BEANS Center
Kyushu. Supercritical deposition is also being studied todevelop a technique for filling organic nanostructures fabricatedat our Center. At the Life BEANS Center Kyushu, we aremaking steady progress toward the BEANS objective of heterofunction integration which we hope will lead to thedevelopment of innovative devices.

Based at AIST Tsukuba East, the Macro BEANS Center isengaged in the development of micro/nanostructure large-area
continuous fabrication processes through collaboration among
researchers in an AIST-Macro BEANS collaborative researchgroup and researchers from Toshiba Machine Co.,LTD., The
Furukawa Electric Co., LTD. and Mitsubishi Electric
Corporation, and BEANS Laboratory.
We are working to produce meter-scale large-area energy
harvesting devices for use in the fields of environment andenergy and health and medical care at considerably lower cost
and with higher performance using micro/nanostructures. We
are also looking to develop new flexible sheet-like devices thatcan be mounted on a 3D free-form surface for use as wearable
power generators, jackets designed for safety and security, andsheet-like health monitoring devices. However, continuing toemploy fabrication techniques based on conventional
semiconductor equipment to manufacture such devices has
exposed problems such as limitations in the size of the vacuum
process equipment and the surface area of the substrates. In
order to reduce costs and increase performance of conventional
meter-scale large-area devices, we must develop new
fabrication process which deposits high-quality functional films
having micro/nanostructures on meter-scale substrates without
using vacuum process equipment. We must also develop a new
fabrication technology that realizes meter-scale flexible sheettype devices utilizing micromachining and weaving integrationof fiber substrates instead of micromachining of large
substrates.
To meet these needs, the Macro BEANS Center isconducting R&D on innovative next-generation non-vacuum
processes based on techniques for coating functional materials,
such as nano particles, that integrate a technique for activating
nano functional materials through local control of ambient gas
and temperature, and a technique for controlling the density
and arrangement of nano functional materials. With these nonvacuum processes, we hope to develop a technology for the
rapid and direct formation of high-quality functional films withmicro/nanostructures on meter-scale large-area substrates. We
are also conducting R&D on a technology for the continuous
rapid formation of high-quality functional films on fiber
substrates through a non-vacuum process, and a technology forincreasing the functionality and surface area of this fiber
substrate through a new weaving/integration process.

2. 3D BEANS Center Shiga (Ritsumeikan University)
The 3D BEANS Center Shiga is involved in R&D on
fabricating 3D nanostructures for space applications. Unlike theother research centers in the BEANS Project, 3D BEANS
Center Shiga conducts R&D with the goal of applying
micro/nanomachining to space applications. Based at the
Biwako-Kusatsu Campus of Ritsumeikan University,
Researchers from Ritsumeikan University, the Institute for
Unmanned Space Experiment Free Flyer Foundation (USEF),
the Japan Resources Observation System and Space Utilization
Organization (JAROS), and Mitsubishi Electric Corporation
conduct the research. The researches at the Center involve
developing a technology for simulating subwavelength opticalstructures, developing micro/nanomachining technologies
through anodic oxidation, developing optical and structural
evaluation techniques for filters with 3D nanostructuresdesigned for space applications, and studying an evaluationindex on the applicability of 3D nanostructures for space
applications.

Researchers at the Macro BEANS Center

7

OtherMembers’ Profiles

Toshiba Machine Co., Ltd.
Press

1. Company Profile

Transparent moldFounded as a machine tool manufacturer in 1938,
Toshiba Machine has since developed and produced a wide
variety of product lines in response to the demands of thetimes. Now operating as the Toshiba Machine Group, thecompany is involved in the production and sale of diverse
equipment including injection molding machines, diecasting machines, plastic extrusion machines, industrial
robots, nanoimprint machines, high-precision machines,
machine tools, and hydraulic equipment.

Release moldUV light exposure for curing resin

UV curable resin
Substrate

UV nanoimprint lithography

2. Nanoimprint Machines
Toshiba Machine entered the field of nanoimprint
machines in 2004 to develop and manufacture press-type
and roll-to-roll nanoimprint machines. In 2009 the highprecision machine business was consolidated with a new
Nano Processing System Division launched to synergize
nanoimprint lithography with ultraprecision machining.
(1) Application of Nanoimprint Lithography to MEMS
While semiconductor integrated circuit and LIGA
fabrication technologies are generally used whenmanufacturing MEMS, equipment and running costs forthese processes rise sharply as the pattern size becomes
smaller. Nanoimprint lithography is a simple process fortransferring a mold pattern onto a substrate and is thought
to have great potential for reducing MEMS fabrication costs.
(2) Press-type Nanoimprint Machines
Toshiba Machine has developed a press-type nanoimprint
machine (model No. ST50) with a maximum force of 50 kN.
This machine supports UV imprinting, thermal imprinting,room-temperature imprinting, and micro-contact printing(soft lithography). Since it is necessary in nanoimprint
lithography to provide flexible support for a wide variety ofmolds, patterns, and pattern-forming methods, we customize
our machines for each customer to suit their desired imprint
methods and mold structures.
A large number of the ST50 nanoimprint machines arebeing used in diverse research and development
applications, including optical devices, storage media,
biomedical applications, semiconductors, MEMS, anddisplay devices. Recently we are developing nanoimprint
machines capable of supporting mass production for suchmarkets as high-brightness LEDs and discrete track media
type hard disk drives.

Press-type
nanoimprint machine
ST50

Pattern transferred by a nanoimprint machine(3) Roll-to-Roll Nanoimprint Machine
One obstacle in making nanoimprinting commercially
viable is the need to support large-area applications.
Toshiba Machine has developed and produced a roll-to-roll
UV nanoimprint machine designed primarily for optical film
applications. This machine applies the roll technology usedin extrusion and printing systems, employing a gravure rollto mold UV curable resin coated on film. The applications of
this machine are diverse and include optical sheets for flatpanel displays, biotechnological applications, solar cells,
electronic paper, and wire-grid polarizers.

Roll-to-roll UV nanoimprint machine and transferred film

3. Toward the Mass Production of Nanodevices
Recently our customers’ views toward nanoimprinting
have changed from simply being content with goodprecision to wanting to perform prototype testing for the
purpose of reducing costs in device mass production andenhancing the durability of the mold and mold-release layer.
It is evident that the day is not far off when our system andmachines will be used in production lines for a range of
devices.
To realize device mass production with nanoimprint
machines, it will be necessary not only to improve
performance, but also to perfect the overall technology,
including the mold, resin material, process design, andinspection required for implementing the entire
manufacturing sequence. We are working tirelessly todevelop these technologies as a total solution for ourcustomers.

MICRONANO No. 70
MICRONANO is published quarterly by Micromachine Center (MMC), BEANS Technical Research Association(BEANS . TRA) to promote the international exchange of information related to micromachines, R&D and othertechnical topics, and is circulated free of change. Please send your comments about MICRONANO to the publisher :Keiichi Aoyagi, Executive Director, Micromachine Center (MMC)
MBR99 Bldg., 6F., 67 Kanda Sakumagashi, Chiyoda-ku, Tokyo 101-0026, Japan
Tel : +81-3-5835-1870, Fax : +81-3-5835-1873
Internet Home Page h t t p : / / w w w . m m c . o r . j p /Date of Issue : February 22, 2010