DOCUMENT : SR760000NH
REVISION

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SPECIFICATION FOR APPROVAL
1W, 7520, Low Resistance Chip Resistor (Lead free / Halogen Free)
1. Scope
This specification applies to 7.5mm x 2.0mm size 1W, fixed metal film low resistance value chipresistors rectangular type.
2. Type Designation
RL7520T– □□□□
(1)
(2)
Where
(1) Type and size□
(3)(2) Nominal Resistance value:
Four digits of number
Refer to paragraph 4-1
The“ R ”shall be used as a decimal point.
(3) Resistance tolerance:
Refer to paragraph 4-1

3. Construction and Physical Dimensions
LaaCodeLetterDimensions (mm)L

2.0 ± 0.2W

7.5 ± 0.3

t0.8 ± 0.2

a0.40 ± 0.2d0.40 ± 0.2

W

7520

① Resistive element : Metal film
(Under protection film)② Electrode : Solder Sn (on Cu)③ Protection film : Epoxy resin④ Substrate : Alumina
tdFigure 1. Construction and Dimensions

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SPECIFICATION FOR APPROVAL
4. Ratings
4-1 Nominal Resistance Value and Temperature Coefficient of ResistancePower Rating*1WResistance Value0.001Ω ~ 0.005Ω± 1%(F) , ± 2%(G) , ± 5%(J)Resistance Tolerance
Temperature Coefficient of Resistance±100ppm/℃

4-2 Rated Voltage
The rated voltage shall be determined by the following expression.
V = P×R
Where V：Rated voltage (V)R：Nominal resistance value (Ω)
P：Rated dissipation (W)4-3 Operating and Storage Temperature Range-55 to +125℃
5. Marking
Resistance value mark on a top surface use four or three digits by JIS.
White bars are Cyntec internal use only.
Example0.001Ω

0.010Ω ~ 0.020Ω

0.002Ω

0~200ppm/℃

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SPECIFICATION FOR APPROVAL
6. Characteristics
Test Item

Condition of TestRequirements∆R : ± (0.5%+0.0005Ω)
Without significant damage byflashover ( spark, arching ), burningor breakdown etc.

Short Time Overload

2.5 * Rated power for 5 seconds
Refer to JIS C 5201-1 4.13

Insulation Resistance

The resistor shall be cramped in theBetween Electrode and Protection
metal block and tested , as shown below. Film 100MΩ or over
Test voltage : 100 ± 15VDC for 1 minute Between Electrode and Substrate
Refer to JIS C 5201-1 4.6 Mounting
1,000MΩ or overcondition G.

Voltage Proof

The voltage : 100VAC (rms.) for 1 minute ∆R : ± (0.5%+0.0005Ω)
Refer to JIS C 5201-1 4.7
Without damage by flashover, fireor breakdown, as shown below.

Thermal Shock-55 ~125℃ 5 cycles, 15 min at eachextreme condition
Refer to JIS C 5201-1 4.19

∆R : ± (0.5%+0.0005Ω)
Without distinct damage inappearance

Low Temperature Storage

Kept at -55℃, 1,000 hours
Refer to JIS C 5201-1 4.23.4∆R : ± (1.0%+0.0005Ω)
Without distinct damage inappearance

High Temperature Exposure

Kept at 125℃ for 1,000 hours
Refer to JIS C 5201-1 4.23.2∆R : ± (1.0%+0.0005Ω)
Without distinct damage inappearance

Solderability

Temperature of Solder : 245 ± 5℃
Immersion Duration : 3 ± 0.5 second
Refer to JIS C 5201-1 4.17

Uniform coating of solder coverminimum of 95% surface being
immersed

Resistance to Soldering Heat

Dipped into solder at 270 ± 5℃
for 10 ± 1 seconds
Refer to JIS C 5201-1 4.18

∆R : ± (0.5%+0.0005Ω)
Without distinct deformation inappearance

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SPECIFICATION FOR APPROVAL

Test Item

Condition of Test

Requirements

Load Life

Rated voltage for 1.5 hours followed by apause 0.5 hour at 70 ± 2℃.
Cycle repeated 1000 hours
Refer to JIS C 5201-1 4.25

∆R : ± (1.0%+0.0005Ω)
Without distinct damage inappearance

Damp Heat with Load

40 ± 2℃ with relative humidity 90% to95%. D.C. rated voltage for 1.5 hours
ON and 30 minutes OFF. Cycle
repeated 1,000 hours
Refer to JIS C 5201-1 4.24

∆R : ± (1.0%+0.0005Ω)
Without distinct damage inappearance

Mechanical Shock

100 G’s for 6milliseconds. 5 pulses
Refer to JIS C 5201-1 4.21

∆R : ± (0.5%+0.0005Ω)
Without mechanical damage suchas break

Bending Test

Glass-Epoxy board thickness : 1.6mm
Bending width : 2mm
Between the fulcrums : 90mm
Refer to JIS C 5201-1 4.33

∆R : ±(0.5%+0.0005Ω)
Without mechanical damage suchas breakDOCUMENT : SR760000NH
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SPECIFICATION FOR APPROVAL
7. Recommended Solder Pad Dimensions
D7520

WLD

7.9

4.0

1.4

Unit : mmWCu Trace

Note : We recommend there is no circuit design
between pads to avoid circuit shortSensing TraceDOCUMENT : SR760000NH
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SPECIFICATION FOR APPROVAL
Mounting of the test sample onto the test board shall be either of following methods.
(1) Mounting by solder dipping
Epoxy based glue shall be applied in the middle of two lands of the test board. The resistor
shall be mounted in such a way that the electrodes of resistors will be evenly placed in theland area and then adhesive resin shall be cured. After applying the Resin Flux with 25
weight % Methyl Alcohol, the board shall be soldered by dipping into a molten solder bathwith 260 ± 5℃ for 3 to 5 seconds(2) Mounting by reflow soldering
Solder paste with approximate 300μm thickness shall be applied to the land of test board.
The resistor shall be mounted in such way that the electrodes of resistors will be evenly
placed in the land area and then shall be soldered under the circumstance that the surface
temperature of the board shall be raised 240 ±5℃(peak) for 3 to 5 seconds in an
upper-heater oven.

Test Board
Material : Glass Fabric Epoxy Resin
Board thickness : 1.6mm
Copper foil thickness : 0.035mm
Solder Resist Coating

4 271.2

7.9

1.3258.5

Solder Resist

Unit : mm

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SPECIFICATION FOR APPROVAL
8. Packaging
8-1 Dimensions
8-1-1 Tape packaging dimensions
P0P2D0E

T
F
B0B

WKA

A0P1

A

2.6 ± 0.2

D0φ1.55 ± 0.05

A02.3 ± 0.1

K1.4 ± 0.1

B8.2 ± 0.2

T0.3 ± 0.05

B08.0 ± 0.2

P04.0 ± 0.1

E1.75 ± 0.1

P14.0 ± 0.1

F

7.5 ± 0.1

P22.0 ± 0.2

W16.0 ± 0.3
Unit : mm

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SPECIFICATION FOR APPROVAL
8-1-2 Reel Dimensions±0.5

2.0 ± 0.2

2.5

20.5 ± 0.2

180.0 ± 1.0
62.0 ± 0.5

16.4 ± 1

13.0 ± 0.5

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SPECIFICATION FOR APPROVAL
8-2 Peel force of top cover tape
The peel speed shall be about 300 mm/min.
The peel force of top cover tape shall be between 0.1 to 0.7 N

Top Cover Tape

165 ~ 180°

0.1 ~ 0.7N

Carrier tape

8-3 Numbers of taping
2,000 pieces/reel
8-4 Making
The following items shall be marked on the reel.
(1) Type designation.
(2) Quantity(3) Manufacturing date code(4) Manufacturer’s name(5) The country of origin