TPS63060
TPS63061
SLVSA92A – DECEMBER 2011 – REVISED FEBRUARY 2012www.ti.com

HIGH INPUT VOLTAGE BUCK-BOOST CONVERTER WITH 2A SWITCH CURRENT
Check for Samples: TPS63060, TPS63061

FEATURES

1

•
•
•
2

•
•
•
•
•
•
•
•

•
•
•
•

Up to 93% Efficiency
2A/1A Output Current at 5V in Buck Mode
1.3A Output Current at 5V in Boost Mode
(VIN>4V)
Automatic Transition Between Step Down and
Boost Mode
Typical Device Quiescent Current less than
30μA
Input Voltage Range: 2.5V to 12V
Fixed and Adjustable Output Voltage Options
from 2.5V to 8V
Power Save Mode for Improved Efficiency at
Low Output Power
Forced Fixed Frequency Operation at 2.4MHz
and Synchronization Possible
Power Good Output
Buck-Boost Overlap Control™

Load Disconnect During Shutdown
Overtemperature Protection
Overvoltage Protection
Available in a 3-mm × 3-mm, SON-10 Package

APPLICATIONS
•
•
•
•
•
•
•

Dual LI-Ion Application
DSC's and Camcorders
Notebook Computer
Industrial Metering Equipment
Ultra Mobile PC's and Mobile Internet Devices
Personal Medical ProductsHigh Power LED's

DESCRIPTIONThe TPS6306x devices provide a power supply solution for products powered by either three-cell up to six-cellalkaline, NiCd or NiMH battery, or a one-cell or dual-cell Li-Ion or Li-polymer battery. Output currents can go as
high as 2A while using a dual-cell Li-Ion or Li-Polymer Battery, and discharge it down to 5V or lower. The
buck-boost converter is based on a fixed frequency, pulse-width-modulation (PWM) controller using synchronousrectification to obtain maximum efficiency. At low load currents, the converter enters Power Save mode tomaintain high efficiency over a wide load current range. The Power Save mode can be disabled, forcing theconverter to operate at a fixed switching frequency. The maximum average current in the switches is limited to atypical value of 2.25A. The output voltage is programmable using an external resistor divider, or is fixed internallyon the chip. The converter can be disabled to minimize battery drain. During shutdown, the load is disconnectedfrom the battery. The device is packaged in a 10-pin SON PowerPAD™ package measuring 3mm × 3mm (DSC).
L1
1µH

VIN
2.5 V to 12V

L1

L2

VIN

VOUT

C1

EN

FB

2X10µF

C3
0.1µF

VAUX

VOUT
5V /800mA

R1

R3

1MΩ

1MΩ

C2

3X22µF

PS/SYNC
PG
GND

PGND

TPS63060

R2
111kΩ

C4
10pF
Power Good
Output1

2

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Buck-Boost Overlap Control, PowerPAD are trademarks of Texas Instruments.

PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does notnecessarily include testing of all parameters.

Copyright © 2011–2012, Texas Instruments Incorporated

TPS63060
TPS63061
SLVSA92A – DECEMBER 2011 – REVISED FEBRUARY 2012www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

AVAILABLE DEVICE OPTIONS (1)OUTPUT VOLTAGE
DC/DC

TA
–40°C to 85°C
(1)
(2)

PACKAGE MARKING

Adjustable

QUJ

5V

QUK

PART NUMBER (2)PACKAGETPS63060DSC

10-Pin SON

TPS63061DSC

Contact the factory to check availability of other fixed output voltage versions.
For detailed ordering information please check the PACKAGE OPTION ADDENDUM section at the end of this data sheet.

ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
VALUE
MIN
Voltage range

UNIT
MAX

VIN, VOUT, PS/SYNC, EN, FB

–0.3

17

V

L1, L2-0.3

VIN+0.3

V

FB, VAUX

-0.3

7.5

V

Operating virtual junction temperature range, TJ

–40

150

°C

Storage temperature range Tstg

-65

150

°C

Human Body Model - (HBM)

3kV

Machine Model - (MM)200

V

Charge Device Model - (CDM)

1.5

kV

ESD rating (2)

(1)
(2)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.
ESD testing is performed according to the respective JESD22 JEDEC standard.

THERMAL INFORMATIONTPS63060,
TPS63061

THERMAL METRIC (1)UNITS

DSC (10 PINS)
θJA

Junction-to-ambient thermal resistance

48.7

θJC(TOP)

Junction-to-case(top) thermal resistance

54.8

θJB

Junction-to-board thermal resistance

19.8

ψJT

Junction-to-top characterization parameter

1.1

ψJB

Junction-to-board characterization parameter

19.6

θJC(BOTTOM)

Junction-to-case(bottom) thermal resistance

4.2

(1)

°C/W

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

RECOMMENDED OPERATING CONDITIONS
MINSupply voltage at VIN

2.5

Output Current Iout with VIN = 10V to 12V

NOM

MAX

UNIT

12

V

1

A

Operating free air temperature range, TA

–40

85

°C

Operating virtual junction temperature range, TJ Output Current Iout

–40

125

°C

2

Submit Documentation Feedback

Copyright © 2011–2012, Texas Instruments Incorporated

Product Folder Link(s): TPS63060 TPS63061

TPS63060
TPS63061
SLVSA92A – DECEMBER 2011 – REVISED FEBRUARY 2012www.ti.com

ELECTRICAL CHARACTERISTICS
over recommended free-air temperature range and over recommended input voltage range (typical at an ambient temperature
range of 25°C) (unless otherwise noted)
PARAMETERTEST CONDITIONS

MIN

TYP

MAX

UNIT

DC/DC STAGE
VIN

Input voltage range

VIIN

Minimum input voltage for startup

2.5

VOUT

TPS63060 output voltage range

2.5

Minimum duty cycle in step down
conversion
VFB

TPS63060 feedback voltage

PS/SYNC = VINTPS63061 output voltage
VFB
f

10%

Iq

IS

V

8

V

20%

495

500

505

mV

5.0

5.05

V

PS/SYNC = GND Referenced to 500mV

0.6%

TPS63061 output voltage

PS/SYNC = GND Referenced to 5V

0.6%

Frequency range for synchronization
ISW

V

4.95

TPS63060 feedback voltage
Oscillator frequency

12
2.5

5%
5%

2200

2400

2600

kHz

2200

2400

2600

kHz

2000

2250

2500

Average inductance current limit

VIN = 5V, TA = 25°C

High side switch on resistance

VIN = 5V90mΩ

Low side switch on resistance

VIN = 5V95mΩ

Line regulation

Power Save Mode disabled

0.5%

Load regulation

Power Save Mode disabled

0.5%

IO = 0 mA, VEN = VIN = 5V,
VOUT = 5V

30

60

7

15

TPS63061 FB input impedance

VEN = HIGH

1.5

Shutdown current

VEN = 0 V, VIN = 5V

0.3

Quiescent current

VIN
VOUT

mA

μA
μA
MΩ

2

μA
V

CONTROL STAGE
VAUX

Maximum bias voltage

IAUX

Load current at VAUXUVLOUnder voltage lockout threshold

VIN > VOUT

VIN

7

VIN < VOUT

VOUT

7

V

1

mA

VIN voltage decreasing

1.8

UVLO hysteresis

1.9

2.2

300

VIL

EN, PS/SYNC input low voltage

VIH

EN, PS/SYNC input high voltage

V
mV

0.4

V

1.2

V

EN, PS/SYNC input current

Clamped on GND or VIN

0.01

0.1

μA

PG output low voltage

VOUT = 5V, IPGL = 10 μA

0.04

0.4

V

0.01

0.1

μA

PG output leakage current
Output overvoltage protection

12

16

V

Overtemperature protection

140

°C

Overtemperature hysteresis

20°C

Copyright © 2011–2012, Texas Instruments Incorporated

Product Folder Link(s): TPS63060 TPS63061

Submit Documentation Feedback

3

TPS63060
TPS63061
SLVSA92A – DECEMBER 2011 – REVISED FEBRUARY 2012www.ti.com

PIN ASSIGNMENTS

rP
Po
we

L2
VOUT
FB
GND
VAUX

PGND
PGND
PGND
PGND

L1
VIN
EN
PS/SYNC
PG

ad

PGND
PGND
PGND
PGND

DSC PACKAGE(TOP VIEW)

Pin Functions
PIN

I/O

DESCRIPTION

NAME

NO.

EN

3

I

Enable input. (1 enabled, 0 disabled)

FB

8

I

Voltage feedback of adjustable versions, must be connected to VOUT on fixed output voltage
versions

GND

7

Control / logic ground

L1

1

I

Connection for Inductor

L2

10

I

Connection for Inductor

PS/SYNC

4

I

Enable / disable power save mode (1 disabled, 0 enabled, clock signal for synchronization)

PG

5

O

Output power good (1 good, 0 failure; open drain)

PGND

PowerPAD™

VIN

2

I

Supply voltage for power stage

VOUT

9

O

Buck-boost converter output

VAUX

6

PowerPAD™

4

Power ground

Connection for Capacitor
Must be soldered to achieve appropriate power dissipation. Must be connected to PGND.

Submit Documentation Feedback

Copyright © 2011–2012, Texas Instruments Incorporated

Product Folder Link(s): TPS63060 TPS63061

TPS63060
TPS63061
SLVSA92A – DECEMBER 2011 – REVISED FEBRUARY 2012www.ti.com

FUNCTIONAL BLOCK DIAGRAM (TPS63060)
L1

L2

VIN

VOUT
VIN

VOUT

Current
SensorBias
Regulator

VIN
VAUX
VOUT

VAUX

PGND

PGND

Gate
Control_

VAUX

Modulator

PG

+
_

+

Oscillator

EN

VREF

+
-

DeviceControl

PS/SYNC

FB

Temperature
Control

PGND

GND

PGND

FUNCTIONAL BLOCK DIAGRAM (TPS63061)
L1

L2

VIN

VOUT
VIN

VOUT

Bias
Regulator

Current
Sensor

VIN
VAUX
VOUT

VAUX

PGND
FB

_

VAUX

Modulator

PG

PS/SYNC

PGND
Gate
Control+

Oscillator
DeviceControl

+
_
+
-

VREF

EN

Temperature
Control

GND

PGND
PGND

Copyright © 2011–2012, Texas Instruments Incorporated

Product Folder Link(s): TPS63060 TPS63061

Submit Documentation Feedback

5

TPS63060
TPS63061
SLVSA92A – DECEMBER 2011 – REVISED FEBRUARY 2012www.ti.com

TYPICAL CHARACTERISTICS
TABLE OF GRAPHSDESCRIPTION
Maximum output current
Efficiency

Output voltage

Waveforms

6

FIGUREvs Input voltage (TPS63060, VOUT = 2.5 V / VOUT = 8 V)

1

vs Input voltage (TPS63061, VOUT = 5V)

2

vs Output current (TPS63060, Power Save Enabled, VOUT = 2.5 V / VOUT = 8 V)

3

vs Output current (TPS63060, Power Save Disabled, VOUT = 2.5V / VOUT = 8V)4

vs Output current (TPS63061, Power Save Disabled, VOUT = 5V)

5

vs Output current (TPS63061, Power Save Enabled, VOUT = 5V)

6

vs Input voltage (TPS63060, Power Save Enabled, VOUT = 2.5V, IOUT = {10; 500;
1000; 1300 mA})

7

vs Input voltage (TPS63060, Power Save Disabled, VOUT = 2.5V, IOUT = {10; 500;
1000; 1300 mA})

8

vs Input voltage (TPS63060, Power Save Enabled, VOUT = 8V, IOUT = {10; 500;
1000; 1300 mA})

9

vs Input voltage (TPS63060, Power Save Disabled, VOUT = 8V, IOUT = {10; 500;
1000; 1300 mA})

10

vs Input voltage (TPS63061, Power Save Enabled, VOUT = 5V, IOUT = {10; 500;
1000; 1300 mA})

11

vs Input voltage (TPS63061, Power Save Disabled, VOUT = 5V, IOUT = {10; 500;
1000; 1300 mA})

12

vs Output current (TPS63060, VOUT = 2.5 V)

13

vs Output current (TPS63061, VOUT = 5V)

14

vs Output current (TPS63060, VOUT = 8V)

15

Load Transient response ( TPS63061, Vin<Vout, Load Change from 600mA to 1A)

16

Load Transient response (TPS63061, Vin>Vout, Load change from 600mA to 1A)

17Line Transient response (TPS63061, Vout=5V, Iout=500mA)

18

Startup after enable (TPS63061, Vout=5V, Vin=4.5V, Iout=1A)

19

Start up after enable ( TPS63061, Vout=5V, Vin=8V, Iout=2A)

20

Load Transient response (TPS63060, Vin<Vout, Load change from 600mA to 1A)

21

Load Transient response, (TPS63060, Vin>Vout, Load change from 600mA to 1A)

22Line Transient response (TPS63060, Vout=8V, Iout=500mA)

23

Start up after enable (TPS63060, Vout=8V, Vin< Vout, Vin=5V, Iout=1A)

24

Startup after enable (TPS63060, Vout=8V, Vin=12V, Iout=1A)

25

Shutdown Current versus Input Voltage

26

Quiescent Current versus Input Voltage

27

Submit Documentation Feedback

Copyright © 2011–2012, Texas Instruments Incorporated

Product Folder Link(s): TPS63060 TPS63061

TPS63060
TPS63061
SLVSA92A – DECEMBER 2011 – REVISED FEBRUARY 2012www.ti.com

OUTPUT CURRENTvsINPUT VOLTAGE

MAXIMUM OUTPUT CURRENTvsINPUT VOLTAGE
3.5

3.2
TPS63060

TPS63061
VO = 2.5 V

3Maximum Output Current - A

Maximum Output Current - A

2.7

2.2

1.7
VO = 8 V
1.2

VO = 5 V
2.5

2

1.5

1

0.7

0.2
2.5

4.5

6.5
8.5
VI - Input Voltage - V

10.5

12.5

0.5
2.5

Figure 2.

EFFICIENCYvsOUTPUT CURRENTEFFICIENCYvsOUTPUT CURRENT

10.5

12.5

100
VI = 4.8 V VO = 8 V

90

90

80

80

70

VI = 4.8 V VO = 2.5 V

60

VI = 7.2 V VO = 2.5 V

50
40

VI= 4.8 V VO = 2.5 V
60
50

30

20

20

VI = 7.2 V VO = 2.5 V

10

TPS63060
Power Save Enabled
0.001

VI = 4.8 V VO = 8 V

40

30

0
0.0001

VI = 7.2 V VO = 8 V

70

VI = 7.2 V VO = 8 V

Efficiency - %Efficiency - %6.5
8.5
VI - Input Voltage - V

Figure 1.

100

10

4.5

0.01
0.1
IO - Output Current - A

1

10

0
0.0001

TPS63060
Power Save Disabled
0.001

Figure 3.

0.01
0.1
IO - Output Current - A

1

10

Figure 4.

Copyright © 2011–2012, Texas Instruments Incorporated

Product Folder Link(s): TPS63060 TPS63061

Submit Documentation Feedback

7

TPS63060
TPS63061
SLVSA92A – DECEMBER 2011 – REVISED FEBRUARY 2012www.ti.com

EFFICIENCYvsOUTPUT CURRENTEFFICIENCYvsOUTPUT CURRENT

100

100
VI = 4.8 V VO = 5 V
90

VI= 4.8 V VO = 5 V

80

80

70

70

Efficiency - %Efficiency - %90

VI = 7.2 V VO = 5 V

60
50
40

40

20

20
10

TPS63061
Power Save Disabled
0.001

0.01
0.1
IO - Output Current - A

1

EFFICIENCYvsINPUT VOLTAGE

EFFICIENCYvsINPUT VOLTAGE

1

10

100
IO = 500 mA

IO = 500 mA

90
80

IO = 1000 mA

70

Efficiency - %IO = 10 mA
IO = 1300 mA

60
50
40

IO = 1000 mA
IO = 1300 mA

60

50
40
IO = 10 mA

30

30
20

0
2.5

0.01
0.1
IO - Output Current - A

Figure 6.

80

10

0.001

Figure 5.

9070

TPS63061
Power Save Enabled

00.0001

10100Efficiency - %

50

30

0
0.0001

8

60

30

10

VI = 7.2 V VO = 5 V

20
TPS63060 VO = 2.5 V
Power Save Enabled
4.5

6.5

10
8.5

10.5

12.5

0
2.5

TPS63060 VO = 2.5 V
Power Save Disabled
4.5

6.5

8.5

VI - Input Voltage - V

VI - Input Voltage - V

Figure 7.

Figure 8.

Submit Documentation Feedback

10.5

12.5

Copyright © 2011–2012, Texas Instruments Incorporated

Product Folder Link(s): TPS63060 TPS63061

TPS63060
TPS63061
SLVSA92A – DECEMBER 2011 – REVISED FEBRUARY 2012www.ti.com

EFFICIENCYvsINPUT VOLTAGE
100

EFFICIENCYvsINPUT VOLTAGE
100

IO = 10 mA

80

IO = 1000 mA
IO = 1300 mA

60
50
40

60

40
30

20

20

TPS63060 VO = 8 V
Power Save Enabled

0
2.5

10
0

4.5

6.5

8.5

10.5

12.5

8.5

Figure 10.

EFFICIENCYvsINPUT VOLTAGE

EFFICIENCYvsINPUT VOLTAGE
100

10.5

12.5

IO = 500 mA

90

IO = 1300 mA

80

IO = 1000 mA

70

Efficiency - %

40

60
50

30

20

20

TPS63061 VO = 5 V
Power Save Enabled
6.5

10

8.5

10.5

12.5

IO = 10 mA

40

30

4.5

IO = 1300 mA
IO = 1000 mA

70

IO = 500 mA

50

0
2.5

6.5

Figure 9.

80

10

4.5

VI - Input Voltage - V

90Efficiency - %2.5

TPS63060 VO = 8 V
Power Save Disabled

VI - Input Voltage - V

IO = 10 mA

60

IO = 500 mA

IO = 10 mA

50

30

10

IO = 1000 mA

70

Efficiency - %Efficiency - %80

IO = 500 mA

70

100

IO = 1300 mA

90

90

0
2.5

TPS63061 VO = 5 V
Power Save Disabled
4.5

6.5

8.5

VI - Input Voltage - V

VI - Input Voltage - V

Figure 11.

Figure 12.

Copyright © 2011–2012, Texas Instruments Incorporated

Product Folder Link(s): TPS63060 TPS63061

10.5

12.5

Submit Documentation Feedback

9

TPS63060
TPS63061
SLVSA92A – DECEMBER 2011 – REVISED FEBRUARY 2012www.ti.com

OUTPUT VOLTAGEvsOUTPUT CURRENTOUTPUT VOLTAGEvsOUTPUT CURRENT

2.80

5.30
VI = 7.2 V PWM

2.75

VI = 7.2 V PFM

2.70

5.20

VO - Output Voltage - V

VO - Output Voltage - V

VI = 7.2 V PWM

5.25

VI = 7.2 V PFM

2.65
2.60
2.55
2.50

5.15
5.10
5.05
5.00

2.45

4.95
TPS63061

TPS63060 VO = 2.5 V

2.40
0.0001

0.001

0.01
0.1
IO - Output Current - A

1

10

4.90
0.0001

0.001

0.01
0.1
IO - Output Current - A

1

Figure 13.

Figure 14.

OUTPUT VOLTAGEvsOUTPUT CURRENTLOAD TRANSIENT RESPONSE

10

8.40

Vin=4.5V, Iload=600mA to 1A

VI = 7.2 V PWM

8.35

VI = 7.2 V PFM

Vout 200mV/div
Offset=5V

VO - Output Voltage - V

8.30

Iout 200mA/div
Offset=600mA

8.25
8.20
8.15
8.10
8.05

IL 1A/div

8.00
7.95
TPS63060, VO = 8 V
7.90
0.0001
0.001
0.01
0.1
IO - Output Current - A

TPS63061, Vo=5V
1

10

Figure 15.

10

Submit Documentation Feedback

100us/div

Figure 16.

Copyright © 2011–2012, Texas Instruments Incorporated

Product Folder Link(s): TPS63060 TPS63061

TPS63060
TPS63061
SLVSA92A – DECEMBER 2011 – REVISED FEBRUARY 2012www.ti.com

LOAD TRANSIENT RESPONSE

Vin=8V, Iload=600mA to 1A

LINE TRANSIENT RESPONSE

Vin=4.5V to 5.5V, Iout=500mA
Vout 200mV/div
Offset=5V

Input Voltage
500mV/div, Offset=4.5V

Iout 200mA/div
Offset=600mA

Output Voltage
50mV/div, Offset=5V

IL 1A/div

TPS63061, Vo=5V

TPS63061, Vo=5V

200us/div

200us/div

Figure 17.

Figure 18.

STARTUP AFTER ENABLE

STARTUP AFTER ENABLE

Enable 5V/div

Enable 5V/div
PG 5V/div

PG 5V/div

Output Voltage 2V/div

Output Voltage 2V/div

Inductor Current 1A/div

Inductor Current 1A/div

TPS63061, Vo=5V

100us/div

Vin=4.5V, Io=1A

TPS63061, Vo=5V

Figure 19.

100us/div

Vin=8V, Io=2A

Figure 20.

Copyright © 2011–2012, Texas Instruments Incorporated

Product Folder Link(s): TPS63060 TPS63061

Submit Documentation Feedback

11

TPS63060
TPS63061
SLVSA92A – DECEMBER 2011 – REVISED FEBRUARY 2012www.ti.com

LOAD TRANSIENT

Vin=5V,

LOAD TRANSIENT

Vin=12V,

Iload=600mA to 1A

Iload=600mA to 1A
Vout 200mV/div
Offset=8V

Vout 200mV/div
Offset=8V

TPS63060, Vo=8V

200us/div

Iout 200mA/div
Offset=600mA

Vout 200mA/div
Offset=600mA

IL 1A/div

IL 1A/div

TPS63060, Vo=8V

200us/div

Figure 21.

Figure 22.

LINE TRANSIENT

STARTUP AFTER ENABLE

Vin=8V to 8.6V, Iout=500mA

Enable5V/div
PG 5V/div

Input Voltage
200mV/div, offset=8V

Output Voltage 5V/div

OutputVoltage

50mV/div, offset=8V

TPS63060 Vo=8V

200us/div

Inductor Current 1A/div

TPS63060, Vo=8V

Figure 23.

12

Submit Documentation Feedback

100us/div

Vin=5V, Io=1A

Figure 24.

Copyright © 2011–2012, Texas Instruments Incorporated

Product Folder Link(s): TPS63060 TPS63061

TPS63060
TPS63061
SLVSA92A – DECEMBER 2011 – REVISED FEBRUARY 2012www.ti.com

STARTUP AFTER ENABLE

Shutdown Current versus Input Voltage
1

Enable 5V/div
PG 5V/div
Shutdown Current (µA)

0.9

Output Voltage 5V/div

Inductor Current 1A/div

0.8
0.7
0.6
0.5
0.4
0.3

TPS63060, Vo=8V

Vin=12V, Io=1A

100us/div

0.2
2

4

3

5

6

7

8

9

10

11

12

VI - Input Voltage - V

Figure 25.

Figure 26.
Quiescent Current versus Input Voltage

Quiescent Current (µA)

55

50

45

40

35
2

3

4

5

6

7

8

9

10

11

12

VI - Input Voltage - V
Figure 27.

Copyright © 2011–2012, Texas Instruments Incorporated

Product Folder Link(s): TPS63060 TPS63061

Submit Documentation Feedback

13

TPS63060
TPS63061
SLVSA92A – DECEMBER 2011 – REVISED FEBRUARY 2012www.ti.com

PARAMETER MEASUREMENT INFORMATION
L1
1µH

VIN
2.5 V to 12V

L1

L2

VIN

VOUT

C1

EN

FB

2X10µF

C3

VAUX

0.1µF

VOUT
5V /800mA

R1

R3

1MΩ

1MΩ

C2

3X22µF

PS/SYNC
PG
GND

PGND

R2

C4

111kΩ

10pF
Power Good
OutputTPS6306X

Table 1. List of Components
REFERENCEDESCRIPTIONMANUFACTURER

TPS63060 and TPS63061

Texas Instruments

L1

1μH, 3 mm x 3 mm x 1.5 mm

Coilcraft , XFL4020-102

C1

2 x 10 μF 16V, 0805, X5R ceramic

Taiyo Yuden, EMK212BJ

C2

3 × 22 μF 16V, 0805, X5R ceramic

Taiyo Yuden, LMK212BJ

C3

0.1 μF, X5R ceramic

C4

10pF, ceramic

R1, R2

Depending on the output voltage at TPS63060 and TPS63061: R1=0, C4 and R2 n.a.

14

Submit Documentation Feedback

Copyright © 2011–2012, Texas Instruments Incorporated

Product Folder Link(s): TPS63060 TPS63061

TPS63060
TPS63061
SLVSA92A – DECEMBER 2011 – REVISED FEBRUARY 2012www.ti.com

DETAILED DESCRIPTIONDETAILED DESCRIPTION
The controller circuit of the device is based on an average current mode topology. The controller also uses input
and output voltage feedforward. Changes of input and output voltage are monitored and immediately can change
the duty cycle in the modulator to achieve a fast response to those errors. The voltage error amplifier gets its
feedback input from the FB pin. At adjustable output voltages, a resistive voltage divider must be connected tothat pin. At fixed output voltages, FB must be connected to the output voltage to directly sense the voltage. Fixed
output voltage versions use a trimmed internal resistive divider. The feedback voltage will be compared with theinternal reference voltage to generate a stable and accurate output voltage.
The device uses 4 internal N-channel MOSFETs to maintain synchronous power conversion at all possible
operating conditions. This enables the device to keep high efficiency over a wide input voltage and output power
range. To avoid ground shift problems due to the high currents in the switches, two separate ground pins GND
and PGND are used. The reference for all control functions is the GND pin. The power switches are connected to
PGND. Both grounds must be connected on the PCB at only one point, ideally, close to the GND pin. Due to the
4-switch topology, the load is always disconnected from the input during shutdown of the converter. To protect
the device from overheating an internal temperature sensor is implemented.
Buck-Boost Operation
To regulate the output voltage at all possible input voltage conditions, the device automatically switches frombuck operation to boost operation and back as required. It always uses one active switch, one rectifying switch,
one switch permanently on, and one switch permanently off. Therefore, it operates as a step down converter(buck) when the input voltage is higher than the output voltage, and as a boost converter when the input voltage
is lower than the output voltage. There is no mode of operation in which all 4 switches are permanently
switching. Controlling the switches this way allows the converter to maintain high efficiency at the most important
point of operation, when the input voltage is close to the output voltage. The RMS current through the switches
and the inductor is kept at a minimum, to minimize switching and conduction losses.
Control Loop Description
The average inductor current is regulated by a fast current regulator loop which is controlled by a voltage control
loop. Figure 28 shows the control loop.
The non inverting input of the transconductance amplifier Gmc can be assumed to be constant. The output of
Gmv defines the average inductor current. The current through resistor RS, which represents the actual inductor
current, is compared to the desired value and the difference, or current error, is amplified and compared to thesawtooth ramp of either the Buck or the Boost.
The Buck-Boost Overlap Control™ makes sure that the classical buck-boost function, which would cause two
switches to be on every half a cycle, is avoided. Thanks to this block whenever all switches becomes active
during one clock cycle, the two ramps are shifted away from each other. However, when there is no switchingactivities because there is a gap between the ramps, the ramps are moved closer together. As a result the
number of classical buck-boost cycles or no switching is reduced to a minimum and high efficiency values areachieved.
Slope compensation is not required to avoid subharmonic oscillation which are otherwise observed when working
with peak current mode control with D>0.5.
Nevertheless the amplified inductor current downslope at one input of the PWM comparator must not exceed theoscillator ramp slope at the other comparator input. This purpose is reached limiting the gain of the current
amplifier.

Copyright © 2011–2012, Texas Instruments Incorporated

Product Folder Link(s): TPS63060 TPS63061

Submit Documentation Feedback

15

TPS63060
TPS63061
SLVSA92A – DECEMBER 2011 – REVISED FEBRUARY 2012www.ti.com

TM

Figure 28. Average Current Mode Control
Power-save mode and synchronization
The PS/SYNC pin can be used to select different operation modes. Power Save Mode is used to improve
efficiency at light load. To enable Power-Save, PS/SYNC must be set low. If PS/SYNC is set low then Power
Save Mode is entered when the average inductor current gets lower then about 100mA. At this point theconverter operates with reduced switching frequency and with a minimum quiescent current to maintain highefficiency.
During the Power Save Mode, the output voltage is monitored with a comparator by the threshold comp low andcomp high. When the device enters Power Save Mode, the converter stops operating and the output voltage
drops. The slope of the output voltage depends on the load and the value of output capacitance. As the output
voltage falls below the comp low threshold set to 2.5% typical above Vout, the device ramps up the output
voltage again, by starting operation using a programmed average inductor current higher than required by thecurrent load condition. Operation can last for one or several pulses. The converter continues these pulses until
the comp high threshold, set to typically 3.5% above Vout nominal, is reached and the average inductor current
gets lower than about 100mA. When the load increases above the minimum forced inductor current of about
100mA, the device will automatically switch to PWM mode.
The Power Save Mode can be disabled by programming the PS/SYNC high. Connecting a clock signal at
PS/SYNC forces the device to synchronize to the connected clock frequency.
Synchronization is done by a PLL to lower and higher frequencies compared to the internal clock. The PLL canalso tolerate missing clock pulses without the converter malfunctioning. The PS/SYNC input supports standard
logic thresholds.

16

Submit Documentation Feedback

Copyright © 2011–2012, Texas Instruments Incorporated

Product Folder Link(s): TPS63060 TPS63061

TPS63060
TPS63061
SLVSA92A – DECEMBER 2011 – REVISED FEBRUARY 2012www.ti.com

Heavy Load transient step
PFM mode at light load
current

3.5%

Comparator High3%

Comparator low

2.5%

Vo

PWM mode
Absolute Voltage dropwith positioning

Figure 29. Power-Save Mode Thresholds and Dynamic Voltage Positioning
Dynamic voltage positioning
As detailed in Figure 29, the output voltage is typically 3% above the nominal output voltage at light load
currents, as the device is in Power Save Mode. This gives additional headroom for the voltage drop during a loadtransient from light load to full load. This allows the converter to operate with a small output capacitor and still
have a low absolute voltage drop during heavy load transient changes. See Figure 29 for detailed operation of
the Power Save Mode
Dynamic Current limit
In order to keep the output voltage regulated when the power source becomes weaker the device has
implemented a dynamic current limit function. The maximum current allowed through the switch depends on thevoltage applied at the input terminal of the TPS6306X. The curve in Figure 30 shows this dependency, and the
ISW versus VIN. The dynamic current limit has its lowest value when reaching the minimum recommended supply
voltage at VIN.
Given the ISW value from Figure 30, is then possible to calculate the output current reached in boost mode using
Equation 1 and Equation 2 and in buck mode using Equation 3 and Equation 4.
Duty Cycle Boost

D=

V
-V
IN
OUT
V
OUT

Maximum Output Current Boost

Duty Cycle Buck

D=

(1)

I
=hxI
x (1 - D)
OUT
SW

(2)

V
OUT
V
IN

Maximum Output Current Buck

(3)
I
=I
OUT
SW

(4)

With,
η = Estimated converter efficiency (use the number from the efficiency curves or 0.80 as an assumption)
f = Converter switching frequency (typical 2.4 MHz)
L = Selected inductor value

Copyright © 2011–2012, Texas Instruments Incorporated

Product Folder Link(s): TPS63060 TPS63061

Submit Documentation Feedback

17

TPS63060
TPS63061
SLVSA92A – DECEMBER 2011 – REVISED FEBRUARY 2012www.ti.com

Average Inductance current (A)If the die temperature increases above the recommended maximum temperature, the dynamic current limit
becomes active. The current limit is reduced with temperature increasing.

3.2
3
2.8
2.5
2.2
2
1.8
1.5

2

3

4

5

6
7
8
Input Voltage (V)

9

10

11

12
G000

Figure 30. Average Inductance Current versus Input Voltage
Device Enable
The device is put into operation when EN is set high. It is put into a shutdown mode when EN is set to GND. In
shutdown mode, the regulator stops switching, all internal control circuitry is switched off, and the load is
disconnected from the input. This means that the output voltage can drop below the input voltage during
shutdown. During start-up of the converter, the duty cycle and the peak current are limited in order to avoid highpeak currents flowing from the input.
Power Good
The device has a built in power good function to indicate whether the output voltage is regulated properly. As
soon as the average inductor current gets limited to a value below the current the voltage regulator demands formaintaining the output voltage the power good output gets low impedance. The output is open drain, so its logic
function can be adjusted to any voltage level the connected logic is using, by connecting a pull up resistor to the
supply voltage of the logic. By monitoring the status of the current control loop, the power good output provides
the earliest indication possible for an output voltage break down and leaves the connected application amaximum time to safely react.
Softstart and Short Circuit Protection
After being enabled, the device starts operating. The average current limit ramps up from an initial 400mA
following the output voltage increasing. At an output voltage of about 1.2V, the current limit is at its nominal
value. If the output voltage does not increase, the current limit will not increase. There is no timer implemented.
Thus, the output voltage overshoot at startup, as well as the inrush current, is kept at a minimum. The device
ramps up the output voltage in a controlled manner even if a large capacitor is connected at the output. Whenthe output voltage does not increase above 1.2V, the device assumes a short circuit at the output, and keeps thecurrent limit low to protect itself and the application. At a short on the output during operation, the current limit isalso kept under 2A typically (minimum average inductance current).
Overvoltage Protection
If, for any reason, the output voltage is not fed back properly to the input of the voltage amplifier, control of theoutput voltage will not work anymore. Therefore, overvoltage protection is implemented to avoid the output
voltage exceeding critical values for the device and possibly for the system it is supplying. The implemented
overvoltage protection circuit monitors the output voltage internally as well. If it reaches the overvoltage
threshold, the voltage amplifier regulates the output voltage to this value.

18

Submit Documentation Feedback

Copyright © 2011–2012, Texas Instruments Incorporated

Product Folder Link(s): TPS63060 TPS63061

TPS63060
TPS63061
SLVSA92A – DECEMBER 2011 – REVISED FEBRUARY 2012www.ti.com

Undervoltage Lockout
An undervoltage lockout function prevents device start-up if the supply voltage on VIN is lower thanapproximately its threshold (see the Electrical Characteristics table). When in operation, the device automaticallyenters the shutdown mode if the voltage on VIN drops below the undervoltage lockout threshold. The device
automatically restarts if the input voltage recovers to the minimum operating input voltage.
Overtemperature Protection
The device has a built-in temperature sensor which monitors the internal IC temperature. If the temperature
exceeds the programmed threshold (see the Electrical Characteristics table) the device stops operating. As soon
as the IC temperature has decreased below the programmed threshold, it starts operating again. There is abuilt-in hysteresis to avoid unstable operation at IC temperatures at the overtemperature threshold.

Copyright © 2011–2012, Texas Instruments Incorporated

Product Folder Link(s): TPS63060 TPS63061

Submit Documentation Feedback

19

TPS63060
TPS63061
SLVSA92A – DECEMBER 2011 – REVISED FEBRUARY 2012www.ti.com

APPLICATION INFORMATIONDESIGN PROCEDURE
The TPS6306x series of buck-boost converter has internal loop compensation. Therefore, the external L-C filter
has to be selected to work with the internal compensation. When selecting the output filter a low limit for the
inductor value exists to avoid subharmonic oscillation which could be caused by a far too fast ramp up of theamplified inductor current. For the TPS6306x series, the minimum inductor value should be kept at 1µH.
Selecting a larger output capacitor value is less critical because the corner frequency moves to lower
frequencies. To simplify this process, Table 2 outlines possible inductor and capacitor value combinations.
Table 2. Output Filter Selection (Average Inductance current up to 2A)
OUTPUT CAPACITOR VALUE [µF] (2)INDUCTOR VALUE [µH] (1)

(1)
(2)
(3)

44

66

100

1.0

√

√ (3)

√

1.5

√

√

√

Inductor tolerance and current de-rating is anticipated. The effective inductance can vary by 20%
and –30%.
Capacitance tolerance and bias voltage de-rating is anticipated. The effective capacitance can vary by
20% and –50%.
Typical application. Other check mark indicates recommended filter combinations

Inductor Selection
For high efficiencies, the inductor should have a low dc resistance to minimize conduction losses. Especially at
high-switching frequencies the core material has a higher impact on efficiency. When using small chip inductors,
the efficiency is reduced mainly due to higher inductor core losses. This needs to be considered when selecting
the appropriate inductor. The inductor value determines the inductor ripple current. The larger the inductor value,
the smaller the inductor ripple current and the lower the conduction losses of the converter. Conversely, larger
inductor values cause a slower load transient response. To avoid saturation of the inductor, with the chosen
inductance value, the peak current for the inductor in steady state operation can be calculated. Equation 1 andEquation 5 show how to calculate the peak current IPEAK. Only the equation which defines the switch current inboost mode is reported because this is providing the highest value of current and represents the critical current
value for selecting the right inductor.
IPEAK =Iout
Vin ´ D+
η ´ (1 - D)
2 ´ f ´ L

(5)

With,
D =Duty Cycle in Boost modef = Converter switching frequency (typical 2.4 MHz)
L = Selected inductor valueη = Estimated converter efficiency (use the number from the efficiency curves or 0.80 as an assumption)
Note: The calculation must be done for the minimum input voltage which is possible to have in boost mode
Consideration must be given to the load transients and error conditions that can cause higher inductor currents.
This must be taken into consideration when selecting an appropriate inductor. See Table 3 for typical inductors.
The size of the inductor can also affect the stability of the feedback loop. In particular the boost transfer function
exhibits a right half-plane zero, whose frequency is inverse proportional to the inductor value and the load
current. This means higher is the value of inductance and load current more possibilities has the right half planezero to be moved at lower frequency. This could degrade the phase margin of the feedback loop. It is
recommended to choose the inductor's value in order to have the frequency of the right half plane zero >400kHz.
The frequency of the RHPZ can be calculated using Equation 6.

(1 - D)2 ´ Voutf RHPZ =2p ´ Iout ´ L(6)Submit Documentation Feedback

Copyright © 2011–2012, Texas Instruments Incorporated

With,
20

Product Folder Link(s): TPS63060 TPS63061

TPS63060
TPS63061
SLVSA92A – DECEMBER 2011 – REVISED FEBRUARY 2012www.ti.com

D =Duty Cycle in Boost mode
Note: The calculation must be done for the minimum input voltage which is possible to have in boost mode
Table 3. Inductor Selection
INDUCTOR VALUECOMPONENT SUPLIERSIZE (LxWxH mm)

Isat/DCR

1 µH

Coilcraft XFL4020-102

4 x 4 x 2.1

5.1A/10.8 mΩ

1 µH

TOKO DEM2815 1226AS-H-1R0N

3 x 3.2 x 1.5

2.7A/27 mΩ

1.5µH

Coilcraft XFL4020-152

4 x 4 x 2.1

4.4A/ 14.40mΩ

Capacitor selection
Input Capacitor
At least a 20μF input capacitor is recommended to improve transient behavior of the regulator and EMI behaviorof the total power supply circuit. A ceramic capacitor placed as close as possible to the VIN and PGND pins of
the IC is recommended.
Output Capacitor
For the output capacitor, use of a small ceramic capacitors placed as close as possible to the VOUT and PGND
pins of the IC is recommended. If, for any reason, the application requires the use of large capacitors which can
not be placed close to the IC, use a smaller ceramic capacitor in parallel to the large capacitor. The small
capacitor should be placed as close as possible to the VOUT and PGND pins of the IC. The recommended
typical output capacitor value is 66µF with a variance as outlined in Table 2.
There is also no upper limit for the output capacitance value. Larger capacitors will cause lower output voltage
ripple as well as lower output voltage drop during load transients.
When choosing input and output capacitors, it needs to be kept in mind, that the value of capacitanceexperiences significant losses from their rated value depending on the operating temperature and the operating
DC voltage. It's not uncommon for a small surface mount ceramic capacitor to lose 50% and more of it's rated
capacitance. For this reason, it is important to use a larger value of capacitance or a capacitor with higher
voltage rating in order to ensure the required capacitance at the full operating voltage.
Bypass Capacitor
To make sure that the internal control circuits are supplied with a stable low noise supply voltage, a capacitor isconnected between VAUX and GND. Using a ceramic capacitor with a value of 0.1μF is recommended. The
capacitor needs to be placed close to the VAUX pin. The value of this capacitor should not be higher than
0.22μF.

Setting the Output Voltage
When the adjustable output voltage version TPS63060 is used, the output voltage is set by the external resistor
divider. The resistor divider must be connected between VOUT, FB and GND. When the output voltage isregulated properly, the typical value of the voltage at the FB pin is 500mV. The maximum recommended value
for the output voltage is 8V. The current through the resistive divider should be about 100 times greater than thecurrent into the FB pin. The typical current into the FB pin is 0.01μA, and the voltage across the resistor between
FB and GND, R2, is typically 500 mV. Based on these two values, the recommended value for R2 should belower than 500kΩ, in order to set the divider current at 3μA or higher. It is recommended to keep the value forthis resistor in the range of 200kΩ. From that, the value of the resistor connected between VOUT and FB, R1,
depending on the needed output voltage (VOUT), can be calculated using Equation 7:æVö
R1 = R2 × ç OUT - 1÷
V
è FB
ø

(7)

A small capacitor C4=10pF, in parallel with R2 needs to be placed when using the Power Save Mode and theadjustable version, to provide filtering and improve the efficiency at light load.

Copyright © 2011–2012, Texas Instruments Incorporated

Product Folder Link(s): TPS63060 TPS63061

Submit Documentation Feedback

21

TPS63060
TPS63061
SLVSA92A – DECEMBER 2011 – REVISED FEBRUARY 2012www.ti.com

LAYOUT CONSIDERATIONS
For all switching power supplies, the layout is an important step in the design, especially at high peak currents
and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems aswell as EMI problems. Therefore, use wide and short traces for the main current path and for the power groundtracks. The input capacitor, output capacitor, and the inductor should be placed as close as possible to the IC.
Use a common ground node for power ground and a different one for control ground to minimize the effects ofground noise. Connect these ground nodes at any place close to one of the ground pins of the IC.
The feedback divider should be placed as close as possible to the control ground pin of the IC. To lay out thecontrol ground, short traces are recommended as well, separation from the power ground traces. This avoids
ground shift problems, which can occur due to superimposition of power ground current and control groundcurrent.

THERMAL INFORMATION
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect thepower-dissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below.
• Improving the power dissipation capability of the PCB design• Improving the thermal coupling of the component to the PCB by soldering the PowerPAD™
• Introducing airflow in the system
For more details on how to use the thermal parameters in the dissipation ratings table please check the Thermal
Characteristics Application Note (SZZA017) and the IC Package Thermal Metrics Application Note (SPRA953).

22

Submit Documentation Feedback

Copyright © 2011–2012, Texas Instruments Incorporated

Product Folder Link(s): TPS63060 TPS63061

TPS63060
TPS63061
SLVSA92A – DECEMBER 2011 – REVISED FEBRUARY 2012www.ti.com

TYPICAL APPLICATION
L1
1µH

VIN
2.5 V to 12V

L1

L2

VIN

VOUT

C1

EN

FB

2X10µF

C3

VAUX

0.1µF

VOUT
5V /500mA

R1

R3

1MΩ

1MΩ

C2

2X22µF

PS/SYNC
PG
GND

PGND

R2
111kΩ

C4
10pF
Power Good
OutputTPS6306X

Figure 31. 5V and 500mA from 1 or 2 cell Li-Ion
L1
1.5 µHVIN
4.5 V to 12V

L1

L2

VIN

VOUT

C1

EN

FB

2X10µF

C3

VAUX

0.1µF

VOUT
5V /1A

R1

R3

1MΩ

1MΩ

C2

3X22µF

PS/SYNC
PG
GND

PGND

R2
111kΩ

C4
10pF
Power Good
OutputTPS63060

Figure 32. 5V and 1A from Input Voltage up to 12VL1
1.5 µHVIN
7 V to 10V
C1
2X10µF

C3

L1

L2

VIN

VOUT

EN

FB

VAUX

0.1µF

VOUT
8V /1.3A

R1

R3

1MΩ

1MΩ

C2

3X22µF

PS/SYNC
PG
GND

PGND

R2
66.5kΩC4
10pF

TPS63060

Power Good
OutputFigure 33. 8V and 1.3A from 2 cell Li-Ion

Copyright © 2011–2012, Texas Instruments Incorporated

Product Folder Link(s): TPS63060 TPS63061

Submit Documentation Feedback

23

TPS63060
TPS63061
SLVSA92A – DECEMBER 2011 – REVISED FEBRUARY 2012www.ti.com

L1
1µH

VIN
2.5 V to 12V

L1

L2

VIN

VOUT

C1

EN

2X10µF

C3
0.1µF

VOUT
5V /800mA

R3
1MΩ

PG

VAUX

C2

3X22µF

PS/SYNC

GND

PGND

Power Good
OutputTPS63061

Figure 34. TPS63061 5V Fixed Output Voltage

24

Submit Documentation Feedback

Copyright © 2011–2012, Texas Instruments Incorporated

Product Folder Link(s): TPS63060 TPS63061

PACKAGE OPTION ADDENDUM

www.ti.com

10-Feb-2012

PACKAGING INFORMATION
Orderable Device

Status(1)

Package Type Package
Drawing

Pins

Package Qty

Eco Plan

TPS63060DSCRACTIVESON

TPS63060DSCTACTIVE

TPS63061DSCRTPS63061DSCT

(2)

Lead/
Ball Finish

DSC

10

3000

Green (RoHS& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR

SON

DSC

10

250

Green (RoHS& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR

ACTIVE

SON

DSC

10

3000

Green (RoHS& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR

ACTIVE

SON

DSC

10

250

Green (RoHS& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEARMSL Peak Temp

(3)

Samples(Requires Login)(1)

The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weightin homogeneous material)(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE MATERIALS INFORMATION
www.ti.com

14-Jul-2012

TAPE AND REEL INFORMATION*All dimensions are nominal

DevicePackage Package Pins
Type Drawing

TPS63060DSCR

SON

DSC

10

SPQ

Reel
Reel
A0
Diameter Width (mm)(mm) W1 (mm)

B0
(mm)

K0
(mm)

P1
(mm)

W
Pin1
(mm) Quadrant

3000

330.0

12.4

3.3

3.3

1.1

8.0

12.0

Q2

TPS63060DSCT

SON

DSC

10

250

180.0

12.4

3.3

3.3

1.1

8.0

12.0

Q2

TPS63061DSCR

SON

DSC

10

3000

330.0

12.4

3.3

3.3

1.1

8.0

12.0

Q2

TPS63061DSCT

SON

DSC

10

250

180.0

12.4

3.3

3.3

1.1

8.0

12.0

Q2

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION
www.ti.com

14-Jul-2012*All dimensions are nominal

DevicePackage Type

Package Drawing

Pins

SPQ

Length (mm)Width (mm)Height (mm)TPS63060DSCR

SON

DSC

10

3000

367.0

367.0

35.0

TPS63060DSCT

SON

DSC

10

250

210.0

185.0

35.0

TPS63061DSCR

SON

DSC

10

3000

367.0

367.0

35.0

TPS63061DSCT

SON

DSC

10

250

210.0

185.0

35.0

Pack Materials-Page 2

IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and otherchanges to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the timeof order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products andapplications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, orother intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of thethird party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alterationand is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altereddocumentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards whichanticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the useof any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is tohelp enable customers to design and create their own end-product solutions that meet applicable functional safety standards andrequirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use inmilitary/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal andregulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components whichhave not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of suchcomponents to meet such requirements.
Products

Applications

Audio

www.ti.com/audio

Automotive and Transportation www.ti.com/automotive

Amplifiers

amplifier.ti.com

Communications and Telecom www.ti.com/communications

Data Converters

dataconverter.ti.com

Computers and Peripherals

www.ti.com/computers

DLP® Products

www.dlp.com

Consumer Electronics

www.ti.com/consumer-apps

DSP

dsp.ti.com

Energy and Lighting

www.ti.com/energy

Clocks and Timers

www.ti.com/clocks

Industrial

www.ti.com/industrial

Interfaceinterface.ti.com

Medicalwww.ti.com/medical

Logic

logic.ti.com

Security

www.ti.com/security

Power Mgmt

power.ti.com

Space, Avionics and Defense

www.ti.com/space-avionics-defense

Microcontrollers

microcontroller.ti.com

Video and Imaging

www.ti.com/video

RFID

www.ti-rfid.com

OMAP Mobile Processors

www.ti.com/omap

TI E2E Community

e2e.ti.com

Wireless Connectivity

www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated