DOCUMENT : SR230000NH
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SPECIFICATION FOR APPROVAL
1/4W, 0603, Low Resistance Chip Resistor (Lead / Halogen free)
1. Scope
This specification applies to 0.8mm x 1.6mm size 1/4W, fixed metal film chip resistors rectangular typefor use in electronic equipment.
2. Type Designation
RL 0816 — 3 — □□□□ — □
(1)
(2)
(3)
(4)
Where
(1) Series No.
(2) Power rating
3 = 1/4W(3) Resistance value:
For example—R010 = 0.01 Ω(4) Resistance tolerance:
F= ± 1%
G= ± 2%
J= ± 5%
3. Construction and Physical Dimensions
LWtbbFigure 1. Structure (No mark)Code Letter

Dimensions (mm)L

1.6 ± 0.2W

0.8 ± 0.2t

0.4 ± 0.15

a0.35 ± 0.15

b0.35 ± 0.15
NOTE:
① Resistive element( under protection film )② Electrode③ Protection film
④ Substrate

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SPECIFICATION FOR APPROVAL
4. Ratings
4-1 Specification
Power Rating*

1/4 W

Resistance Range

0.010Ω~0.020Ω

0.021Ω ~ 0.050Ω

±1% , ±2% , ±5%

Resistance ToleranceTemperature Coefficient ofResistance

0~350ppm/℃0~250ppm/℃

Note*:
Power Rating is based on continuous full load operation at rated ambient temperature of 70℃.
For resistors operated at ambient temperature in excess of 70℃, the maximum load shall bederated in accordance with the following curve.
%
100
Percentage of therated dissipation

500-55

70125

Ambient temperature
Figure 2

Derating Curve

4-2 Rated Voltage
The rated voltage shall be determined by the following expression.
V = P× R
Where V：Rated voltage (V)R：Nominal resistance value (Ω)
P：Rated dissipation (W)4-3 Operating and Storage Temperature Range-55 to +125℃℃

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SPECIFICATION FOR APPROVAL
5. Characteristics
Test Item

Condition of Test

Requirements
ΔR : ± (0.5%+0.0005Ω)Without significant damage byflashover ( spark, arching ), burningor breakdown etc.

Short Time Overload

2.5 * Rated power for 5 seconds

Insulation Resistance

The resistor shall be cramped in the
Between Electrode and Protection
metal block and tested , as shown below. Film 100MΩ or over
Test voltage : 100 ± 15VDC for 1 minute Between Electrode and Substrate
Refer to JIS C 5201-1 4.6 Mounting
1,000MΩ or overcondition G.

Voltage Proof

The voltage : 100VAC (rms.) for 1 minute ΔR : ± (0.5%+0.0005Ω)Refer to JIS C 5201-1 4.7
Without damage by flashover, fireor breakdown, as shown below.

Thermal Shock-55 ~125℃ 5 cycles, 15 min at eachextreme condition
Refer to JIS C 5201-1 4.19

ΔR : ± (0.5%+0.0005Ω)Without distinct damage inappearance

Low Temperature Storage

Kept at -55℃, 1,000 hours
Refer to JIS C 5201-1 4.23.4

ΔR : ± (1.0%+0.0005Ω)Without distinct damage inappearance

High Temperature Exposure

Kept at 125℃ for 1,000 hours
Refer to JIS C 5201-1 4.23.2

ΔR : ± (1.0%+0.0005Ω)Without distinct damage inappearance

Solderability

Temperature of Solder : 245 ± 5℃
Immersion Duration : 3 ± 0.5 second
Refer to JIS C 5201-1 4.17

Uniform coating of solder coverminimum of 95% surface being
immersed

Resistance to Soldering Heat

Dipped into solder at 270 ± 5℃
for 10 ± 1 seconds
Refer to JIS C 5201-1 4.18

ΔR : ± (0.5%+0.0005Ω)Without distinct deformation inappearance

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SPECIFICATION FOR APPROVAL

Test Item

Condition of Test

Requirements

Load Life

Rated voltage for 1.5 hours followed by apause 0.5 hour at 70 ± 2℃.
Cycle repeated 1000 hours
Refer to JIS C 5201-1 4.25

ΔR : ± (1.0%+0.0005Ω)Without distinct damage inappearance

Damp Heat with Load

40 ± 2℃ with relative humidity 90% to95%. D.C. rated voltage for 1.5 hours
ON and 30 minutes OFF. Cycle
repeated 1,000 hours
Refer to JIS C 5201-1 4.24

ΔR : ± (1.0%+0.0005Ω)Without distinct damage inappearance

Mechanical Shock

100 G’s for 6milliseconds. 5 pulses
Refer to JIS C 5201-1 4.21

ΔR : ± (0.5%+0.0005Ω)Without mechanical damage suchas break

Bending Test

Glass-Epoxy board thickness : 1.6mm
Bending width : 2mm
Between the fulcrums : 90mm
Refer to JIS C 5201-1 4.33

ΔR : ±(0.5%+0.0005Ω)Without mechanical damage suchas breakDOCUMENT : SR230000NH
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SPECIFICATION FOR APPROVAL
6. Recommend Land Pattern Dimensions

AB

CA0.8

B

2.2

C

0.6~1.0
Unit : mm

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SPECIFICATION FOR APPROVALPackaging
7-1 Dimensions
7-1-1 Tape packaging dimensions+-1.5 0.1
0.0

0.6 ± 0.05

2.0 ± 0.05

PSprocket hole
1.75 ± 0.1

A

Chip

3.5 ± 0.05

B

0.65 ± 0.1

8.0 ± 0.3

A = 1.1 ± 0.1
B = 1.9 ± 0.1
P(PITCH) = 4.0 ± 0.1

Carries cavity

P

Unit : mm

7-1-2 Reel Dimensions
13 ± 1.41052 ± 0.5
13 ± 0.2

21 ± 0.8+160-07.

R1178 ± 2.0

9 ± 0.3

Unit : mm

DOCUMENT : SR230000NH

SPECIFICATION FOR APPROVAL
7-2 Peel force of top cover tape
The peel speed shall be about 300 mm / min.
The peel force of top cover tape shall be between 0.1 to 0.7 N.
Top Cover Tape

165 ~ 180°0.1~0.7 N

7-3 Numbers of taping
5,000 pieces / reel
7-4 Making
The following items shall be marked on the reel.
(1) Type designation(2) Quantity(3) Manufacturing date code(4) Manufacturer’s name(5) The country of origin

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