2 0 1 9 T W I N P R O D U C T FA M I LY

Supermicro Twin Family
Leading Multi-node Architectures

Transform Your Data Center TCO
with Supermicro servers based onthe 2nd generation Intel® Xeon® Scalable processors

INNOVATIVE MULTI-NODE ARCHITECTURES WITH REDUCED TCO AND TCE

Twin Multi-node Architecture
Introduced by Supermicro, the innovative modular
computing Twin Architecture made its debut in 2006
with 2 independent system nodes enclosed in a 1U
chassis with shared infrastructure components. Also
known as the 1U Twin™ system, each node featured
dual CPU sockets for up to 16 cores and 32GB ofDDR2 memory, dual onboard Gigabit Ethernet
ports and a shared 91% efficiency power supply forincreased power efficiency and space savings.
Fast forward to 2016, Supermicro unveiled a newproduct line based on its 5th generation Twin
Architecture: the BigTwin™ SuperServer®. Featuring
the industry’s first full 24 DIMM slots per node for up
to 6TB of DDR4 memory in ½U space, complemented
by bleeding edge all NVMe storage capabilities andflexible SIOM onboard networking. By overcoming
the traditional design compromises and obstacles,the BigTwin is one of the most forward-thinking
and innovative server designs that reshaped ourimpressions about modular computing solutions.

Today the Twin family consists of four product lines•• The cost-effective 2U Twin™ family that started the Twin
Architecture by saving power and rack space by sharing the samechassis and power supplies•• The more powerful, efficient and flexible 1U and 2U TwinPro™
family with more I/O expansion options and doubles the memory
footprint of Twin•• The 2U BigTwin™, a breakthrough multi-node server system with amultitude of innovations and industry firsts, designed to support
highest performance CPUs, maximum memory capacity, flexible
networking, and all-flash NVMe support

BigTwin™ SuperServer®

•• Optimized for answering challenging business, finance or scientificresearch requirements, the 4U FatTwin™ that is configurable
for up to 8 nodes is built for advanced deployment scenarioswith a variety of memory capacities, storage technologies, PCI
alternatives, networking capabilities, and GPU support options

Twin

TwinPro™

BigTwin™

FatTwin™

INDUSTRY PROVEN DESIGN OF
MULTI-NODE COMPUTINGLEADING CAPABILITIES FORCLOUD, ENTERPRISE AND DATA CENTERFLAGSHIP PERFORMANCE FOR MOSTDEMANDING HCI AND STORAGE APPLICATIONSADVANCED I/O FOR BIG DATA
AND HPC APPLICATIONS

Two or four nodes in 2U

Two or four nodes in 1U or 2U

Two or four nodes in 2U

Four or eight nodes in 4U

8 DDR4 DIMM slots per node

16 DDR4 DIMM slots per node

24 DDR4 DIMM slots per node

16 DDR4 DIMM slots per node

3.5” SATA3 storage2.5” or 3.5” SAS3/SATA3 storage2.5” or 3.5” All-NVMe/Hybrid SAS3 storage

Rich I/O and high capacity storage

Onboard Gigabit Ethernet

Onboard flexible networking up to 100G

Onboard flexible networking up to 100G

Onboard flexible networking up to 100G

More models and specs
available on the web.

More models and specs
available on the web.

More models and specs
available on the web.

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More models and specs
available on the web.

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2U systems supporting two or four nodes with 24 DIMM slots
Flexible storage options including all NVMe and hybrid NVMe/SAS3/SATA3SIOM networking options including 10GbE, 25GbE, 100GbE and IBBigTwin™
FLAGSHIP PERFORMANCE FOR MOST DEMANDING HCI AND STORAGE APPLICATIONS

MIN

MAX%Flagship Performanceand Flexibility

2UBigTwin is the 5th generation in the Supermicro
Twin Family with a multitude of innovations andengineering breakthroughs.

4-Node All NVMe with U.2 Drives

6NVMe/SAS3/SATA3

Two sets of 12 or four sets of 6x 2.5”
drives; or two sets of 6 or four sets of 3x3.5” drives

All NVMe or SATA3 or hybrid NVMe/SAS3;
2 M.2 SATA3 RAID or 2 NVMe/SATA3
M.2 slots

STORAGE

2-SocketHistorically multi-node systems traded off featuresand capacity for higher density. They weredeployed for workloads that did not require thehighest performance or the highest memory
density on a single node.
The 2U BigTwin design can accommodate thehighest TDP CPUs, 24 DIMMs of DDR4 memory andup to six high speed NVMe drives per node, withadditional options for SAS3 storage, M.2 SATA RAID
and PCI-E expansions.

FORM-FACTOR

Two or Four Nodes

Hybrid NVMe and SAS3 with 3.5” Drives

CPUInput/Output

Up to 2nd gen Intel® Xeon® Scalableprocessors; up to 205W TDP

I/OTitanium Level

24 DIMM Slots
MEMORY

4-Node Rear View
2-Node Rear View

Super I/O Module (SIOM) networking*with dedicated IPMI LAN port per node;
Additional 2 PCI-E 3.0 x16 LP slots

Up to 6TB DDR4-2933MHz ECC memory
per node; Intel® Optane™ DCPMM
support available

POWER SUPPLY

Up to redundant 2600W high-efficiency
digital power supplies* For more details, please refer to page 147

1U and 2U systems supporting two or four nodes with 16 DIMM slots
Hot-swappable 3.5” or 2.5” SAS3/SATA3 storage options
SIOM networking options including 10GbE, 25GbE, 100GbE and IB

TwinPro™
LEADING CAPABILITIES FOR CLOUD, ENTERPRISE AND DATA CENTER
Industry Proven Efficiencyand Flexibility

1U/2U

1U 2-Node Front View

The Supermicro TwinPro architecture is based on
the Supermicro proven Twin technology to provide
exceptional throughput, storage, networking, I/O,
memory and processing capabilities in 1U and 2U
form factors.
TwinPro systems are designed for simplified
deployment and maintenance, and assembled
with the highest quality to ensure continuous
operation even at maximum capacity. Customers
in high-end enterprise, data center, HPC and Cloud
Computing environments receive the greatest
competitive advantage from data center resources
with the Supermicro TwinPro.

8FORM-FACTOR

Two or Four Nodes

SAS3/SATA3

Two sets of 6 or four sets of 4x 2.5” drives;or four sets of 3x 3.5” drives

Hardware RAID SAS3 supported;
NVMe/SATA3 M.2 storage support
available

STORAGE

2-Socket
2U 4-Node 3.5” Front View

CPUInput/Output

Up to 2nd gen Intel® Xeon® Scalable
processors; up to 165W TDP

I/OTitanium Level

16 DIMM Slots
MEMORY

4-Node Rear View
2U 4-Node 2.5” Front View

Super I/O Module (SIOM) networking*with dedicated IPMI LAN port per node;
Up to 2 PCI-E 3.0 x16 LP slots

Up to 4TB DDR4-2933MHz ECC memoryper node; Intel® Optane™ DCPMM
support available

POWER SUPPLY

Up to redundant 2200W high-efficiency
digital power supplies* For more details, please refer to page 1492U systems supporting two or four nodes with 8 DIMM slots
Hot-swappable 3.5” SATA3 storage options
Onboard Gigabit Ethernet for optimized cost effectiveness

Twin
INDUSTRY PROVEN DESIGN OF MULTI-NODE COMPUTINGEnergy Efficiency andReliability

2UFORM-FACTORFirst introduced in 2006, Supermicro’s patented
Twin Architecture is the foundation of the mostenergy efficient and advanced server platforms inHPC, Data Center, Cloud Computing and Enterprise
IT applications.

SATA3

Two sets of 6 or four sets of 3x 3.5” drives

Up to 12 hot-swap 3.5” drive bays in 2U;
PCI-E M.2 support available

STORAGE2U 2 or 4-Node Front View

CPU

These high performance, high density systems
feature optimum airflow for energy efficientcooling, easy maintenance and high availabilitywith hot-swappable nodes and redundant power
supply modules.

2-Socket

Input/Output

Up to 2nd gen Intel® Xeon® Scalable
processors; up to 145W TDP

Dual onboard Gigabit Ethernet withdedicated IPMI LAN port; Up to 2 PCI-E
3.0 x8 or 1 PCI-E 3.0 x16 slot

I/O

Titanium Level

8 DIMM Slots
2U 4-Node Rear View

10Two or Four Nodes

2U 2-Node Rear View

MEMORYUp to 2TB DDR4-2933MHz ECC memory
per node

POWER SUPPLY

Up to redundant 1600W high-efficiency
digital power supplies

114U systems supporting four or eight nodes with up to 16 DIMM slots
Versatile storage options with up to 8 hot-swap 3.5” drives per node
Modular hot-swap architecture enabling high I/O flexibility and serviceability

FatTwin™
ADVANCED I/O FOR BIG DATA AND HPC APPLICATIONSHigh Density and High
Performance Computing

4U

The Supermicro FatTwin is optimized for criticalapplications including Big Data and HighPerformance Computing requiring advanced
I/O capacity and flexibilities, while reducing
Data Center TCO in order to help preserve theenvironment.

FORM-FACTOR

4U 4-Node Rear I/O

Up to 8 hot-swap 3.5” or 12 fixed 2.5”
drives; PCI-E M.2 support available

STORAGE

Input/Output

Up to 2nd gen Intel® Xeon® Scalable
processors; up to 165W TDPI/OMEMORY

4U 4-Node Rear I/ORich PCI-E expansion options including
GPU support; Super I/O Module (SIOM)
networking* with dedicated IPMI LAN
port per node

Titanium Level

12 DIMM Slots
4U 8-Node Front I/O

12NVMe/SAS3/SATA3

Available in front or rear I/O models

2-SocketCPU

Available in four or eight node in 4U, withfront or rear I/O configurations, its advancedflexibilities allow the FatTwin to be optimized
for many different environments includingEnterprise, Data Center, Cloud Computing, HPC,Finance, Science and Engineering.

Four or Eight Nodes

Up to 3TB DDR4-2933MHz ECC memory
per node; Intel® Optane™ DCPMM
support available

POWER SUPPLY

Up to redundant 2200W high-efficiency
digital power supplies* For more details, please refer to page 1413

Supermicro SIOM

Better. Faster. Greener.

CHOOSE YOUR ONBOARD I/OExpect Better Data Center Performance, TCO & Impact on the Environment

The Supermicro® Super I/O Module (SIOM) delivers up to 50% of I/O cost savings and freedom to selectnetworking options from 1Gb/s to 100Gb/s through a Supermicro optimized form factor that is easy toscale, service and manage across a broad range of Supermicro server and storage systems. The SIOM
also enables a higher degree of system integration and increased capacity by saving PCI-E slots thatare traditionally reserved for add on cards.
For more product information and technical specifications, please visit supermicro.com

2x GbE RJ45

4x GbE RJ45

2x 10GbE SFP+

4x 10GbE SFP+

2x 10GbE RJ454x 10GbE RJ45

AOC-MGP-i2M

AOC-MGP-i4M

AOC-MTGN-i2SM

AOC-MTG-i4SM

AOC-MTG-i2TM

AOC-MTG-i4TM

2x 25GbE SFP28 & 2x GbE RJ45

AOC-MH25G-b2S2GM

14

2x 25GbE SFP28 & 2x 10GbE RJ45

AOC-MH25G-m2S2TM

2x FDR IB QSFP & 2x GbE RJ45

AOC-MHIBF-m2Q2GM

1x FDR IB QSFP & 2x GbE RJ45

AOC-MHIBF-m1Q2GM

1x EDR IB/100GbE QSFP28 & 1x GbE RJ45

AOC-MHIBE-m1CGM

Systems featuring 2nd generation Intel® Xeon® Scalable processors
Supermicro offers the broadest and deepest
portfolio of advanced technology server andstorage systems in the IT industry. This offers
several advantages to our customers. First,

customers can readily select the most optimized
solutions to satisfy their business requirements,
helping them to reduce their costs and improve
the quality and time-to-market (TTM) of

their offerings. Additionally, the breadth anddepth of Supermicro’s product line provides
the efficiency, cost, and reduced complexity
advantages of one-stop shopping.
15Supermicro®, the leading innovator in high-performance, high-efficiency server technology is a premier provider of advanced server Building Block Solutions® for Data Center, Cloud Computing, Enterprise IT, Hadoop/Big Data, HPCand Embedded Systems worldwide. Supermicro is committed to protecting the environment through its “We Keep IT Green®” initiative and provides customers with the most energy-efficient, environmentally-friendly solutions
available on the market.
Learn more at www.supermicro.com
Supermicro, the Supermicro logo, Building Block Solutions, We Keep IT Green, SuperServer, Twin, BigTwin, TwinPro, TwinPro², SuperDoctor are trademarks and/or registered trademarks of Super Micro Computer, Inc.
Intel, the Intel logo, and Xeon are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries. All other brands names and trademarks are the property of their respective owners.
All pictures shown are for illustration purpose only. Actual product may vary due to product enhancement.
© Copyright Super Micro Computer, Inc. All rights reserved.
Printed in USA

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