Product Data Sheet

Industrial
M.2 PCIe SSD
N3000 M.2 Series
PCIe 4.0, 3D TLC
Industrial Temperature Grade
Date :
Re vi si o n:

Ma y 1 3, 20 2 4
1 .0 0Contents
1.

PRODUCT SUMMARY ............................................................................................................ 3

2.

PRODUCT FEATURES ............................................................................................................ 43.

SECURITY FEATURES ............................................................................................................ 4

4.

ORDERING INFORMATION ...................................................................................................... 55.

PRODUCT DESCRIPTION ......................................................................................................... 6
5.1 PERFORMANCE SPECIFICATIONS ...................................................................................................... 7
5.2 CURRENT CONSUMPTION ............................................................................................................ 7
5.3 ENVIRONMENTAL SPECIFICATIONS .................................................................................................. 8
5.4 REGULATORY COMPLIANCE ......................................................................................................... 9
5.5 MECHANICAL SPECIFICATIONS ...................................................................................................... 9
5.6 RELIABILITY AND ENDURANCE..................................................................................................... 10
5.7 DRIVE GEOMETRY SPECIFICATION .................................................................................................. 10

6.

ELECTRICAL INTERFACE ......................................................................................................... 11

7.

PACKAGE MECHANICAL ........................................................................................................ 13

8.

NVME COMMANDS ............................................................................................................. 15

9.

IDENTIFY DEVICE INFORMATION ...............................................................................................17

10. HEALTH MONITORING FUNCTIONALITY ....................................................................................... 20
11. PART NUMBER DECODER ...................................................................................................... 23
12. MARKING SPECIFICATION ..................................................................................................... 24
12.1 TOP VIEW ........................................................................................................................ 24
12.2 PRINT ON THE LABEL ............................................................................................................. 24
13. REVISION HISTORY ............................................................................................................. 25

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N3000 M.2 Series – Industrial M.2 PCIe SSD
240 GBytes up to 2 TBytes
1. Product Summary
Capacities: 240 GBytes, 480 GBytes, 960 GBytes, 1920 GBytes
Form Factor: PCI Express M.2 2242/2280 (42/80 mm x 22 mm x 3.8 mm)
Compliance1: PCI Express (PCIe) Base Specification Revision 4.0
Interface: Gen4 x 4 Laneso Drive operates in x1 mode in x1 M.2 PCIe slotso Drive operates in x2 mode in x2 M.2 PCIe slotso Drive operates in x4 mode in x4 M.2 PCIe slots
Command Sets: Supports NVMe 1.4
Target Performance:o Read Performance: Sequential Read up to 3,850 MBytes/s, Random Read 4K up to 455,3900 IOPSo Write Performance: Sequential Write up to 3,340 MBytes/s, Random Write 4K up to 457,000 IOPS
Operating Temperature Range2:o Industrial: -40 °C to 85 °C
Storage Temperature Range: -40 °C to 85 °C
Power:o Power States PS0, PS1, PS2, PS3 and PS4o Thermal Throttling supported
Data Retention3: 10 Years @ Life Begin; 1 Year @ Life End, @40°C
Shock/Vibration: 1,500 g / 50 g
High-Performance Processor with Integrated, Parallel Flash Interface Engines:o Triple-Level Cell (TLC) 3D NAND Flasho DDR4 DRAM based Controller architectureo 240 bit LDPC correction per 2 KByte
High Reliability:o Mean Time Between Failure (MTBF): > 3,000,000 hours
o Data Reliability: < 1 non-recoverable error per 1016 bits read1

To check the compatibility of the customer system and the storage device is part of the customer’s responsibility. Swissbit can provide
guidance and support on request.
2
Adequate airflow is required to ensure the temperature, as reported in the S.M.A.R.T. data, does not exceed 110°C (industrial
temperature drive).
3
NAND Flash suppliers refer to JEDEC JESD47 and JESD22 for Data Retention testing. Based on the information provided by the NAND Flashsuppliers, Data Retention is targeted as shown
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2. Product Features
•
•
•
•
•

•
•
•
•
•
•
•
•
•
•
•

Diagnostic features
Life end read only mode
RAID engine
Drive self-test
Data Care Managemento Active: Adaptive Read Refresho Passive: Background Media Scan
Active State Power Management (ASPM) Support
In-Field Firmware Update4
Adaptive Thermal control
DRAM-Buffer
Self-Monitoring, Analysis, and Reporting Technology (S.M.A.R.T., Telemetry)
SMBus5 (NVMe Management Interface Basic Management Command, NVMe-MI v1.2)
30 µinch (0.8 µm) Gold-Plated Connector (IPC-6012C Class 2 Compliant)End-to-End (E2E) Data Protection
Controlled “Locked” BOM
RoHS / REACH Compliant
Swissbit Device Manager Tool (SBDM)

3. Security features
•
•
•
•
•

AES256 encryption
TCG OPAL 2.0
Secure Boot
Crypto erase
IEEE 1667

4

The support of In-Field FW update capabilities on host systems is recommended.
SMBus commands are only processed in operational power states.
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4. Ordering Information
Table 1: Standard Product List
Capacity

Part Number

240 GBytes

SN3000Mx240GI-yMA2-zGB-STD

480 GBytes

SN3000Mx480GI-yMA2-zGB-STD

960 GBytes

SN3000Mx960GI-yMA2-zGB-STD

1920 GBytes

SN3000Mx1T92I-yMA2-zGB-STD

Numbersof Lanes

4

x = Form Factor; y = Product Generation; z= Firmware Revision

Table 2: Available Part Numbers
Capacity

Industrial Temperature
2242

2280

240 GBytes

SN3000MB240GI-1MA2-1GB-STD

SN3000MD240GI-1MA4-1GB-STD

480 GBytes

SN3000MB480GI-1MA2-1GB-STD

SN3000MD480GI-1MA2-1GB-STD

960 GBytes

SN3000MB960GI-1MA2-1GB-STD

SN3000MD960GI-1MA4-1GB-STD

1920 GBytes

SN3000MB1T92I-1MA2-1GB-STD

SN3000MD1T92I-1MA4-1GB-STD

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5. Product Description
The Swissbit® N3000 M.2 Solid State Drive (SSD) leverages the M.2 standard and NVMe standard to support a
PCIe electrical interface as well as AES encryption, E2E data protection and TCG Opal standards. The NVMe
controller and the newest 3D NAND flash technology provides robust, non-volatile storage solution for today’sembedded computing applications. A functional block diagram of the N3000 M.2 SSD is provided below in
Figure 1.
Figure 1: N3000 M.2 Functional Block Diagram

The N3000 M.2 SSD incorporates a 75-position edge connector with M key to support host read/write, control,
and power activity per the applicable JEDEC specification.
The on-board NVMe controller manages the interface between the host and the non-volatile NAND flash
memory array. The controller is designed to support PCIe interface speeds and utilizes a dual processing core,providing an optimum balance between read/write performance, Data Care Management, and power failprotection.
Swissbit’s N3000 M.2 SSDs deliver an impressive IOPS rate and highest endurance by combining 3D NAND flash
technology with a high-end controller architecture, firmware, and an optimized configuration. The SSDs aredesigned for applications requiring high data transfer rates (see Table 3: Read/Write Performance 2280). This
performance is achieved through a 4-channel flash controller and 4-lane PCIe interface.
An on-controller LDPC Error Correction Code (ECC) engine provides the N3000 M.2 hardware ECC, which iscapable of correcting up to 240 bits per 2 KByte page. This engine, combined with Swissbit’s Data CareManagement firmware, provides both passive and active data management strategies to ensure data integrityand extract the maximum possible endurance and reliability from the NAND flash array. These strategies
include, but are not limited to, Global Wear Leveling, Adaptive Read Refresh, and Dynamic Block Remapping.
Related Documentation• NVM Express - Revision 1.4, (https://nvmexpress.org/)• PCI Express M.2 standard – PCI Express M.2 Specification, Revision 3.0, June 26, 2019(https://pcisig.com)

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5.1 Performance Specifications
The N3000 M.2 read/write sequential and random CDM performance benchmarks are detailed in Table 3.
Table 3: Read/Write Performance 22806
Capacity

Sequential Read
(MBPS)

Sequential Write(MBPS)

Random Read 4k(IOPS)

Random Write 4k(IOPS)

240 GBytes

3,650

1,480

108,300

177,500

480 GBytes

3,790

2,820

210,000

298,800

960 GBytes

3,850

3,340

392,800

457,000

1920 GBytes

3,790

3,330

455,900

394,300

5.2 Current Consumption
The drive-level current consumption as a function of operating mode is shown in Table 4.
Table 4: Current Consumption7

6

Capacity

Sequential
Read

Sequential
Write

RandomRead 4k

RandomWrite 4k

240 GBytes

1,150

910

740

930

480 GBytes

1,180

1,230

870

1,150

960 GBytes

1,210

1,470

1,090

1,290

1920 GBytes

1,250

1,660

1,210

1,350

Idle8

PS38

PS48

Unit

49

9

1

mA

The values are measured using Crystal Disk Mark 8 with a file size of 1GiB. Performance depends on flash type and number, file/cluster
size, and burst speed.
All values are typical total values recorded at 25 °C and 3.3V power supply
8
Measured with enabled ASPM L1.2
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7

5.3 Environmental Specifications
Recommended Operating Conditions
The recommended operating conditions for the N3000 M.2 SSD are provided in Table 5.
Table 5: Recommended Operating Conditions9
Parameter
Industrial Operating Temperature

Value-40 °C to 85 °C
3.3 V ± 5%Power Supply VCC Voltage

Recommended Storage Conditions
The recommended storage conditions are listed in Table 6.
Table 6: Recommended Storage Conditions
Parameter
Industrial Storage Temperature

Value-40 °C to 85 °C

Shock, Vibration and Humidity
The maximum shock, vibration and humidity conditions are listed in Table 7.
Table 7: Shock, Vibration and Humidity
Parameter

9

Value

Non-Operating Shock

1,500 g, 0.5 ms pulse duration, half-sine wave
(IEC 60068-2-27 and JESD22-B110 cond. B)

Non-Operating Vibration

50 g, 80-2,000 Hz, 3 axes, 12 cycles(IEC 60068-2-6, MIL-STD-883 H Method 2007.3)

Humidity (Non-Condensing)

85% RH 85 °C, 1000 hrs, max. supply voltage(JESD22-A101B)

Adequate airflow is required to ensure the temperature, as reported in the S.M.A.R.T. data, does not exceed 110°C (industrial
temperature drive).
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5.4 Regulatory Compliance
The N3000 M.2 devices comply with the regulations / standards listed in Table 8.
Table 8: Regulatory Compliance
Abbreviation

Regulation/ Standard

EMC

CE - 2014/30/EU
FCC - 47 CFR Part 15
UKCA - S.I. 2016 No. 1091 and S.I. 2012 No. 3032

RoHS

2011/65/EU with 2015/863/EU and 2017/2102/EU

REACh

1907/2006/EU and 207/2011/EU

WEEE

2012/19/EU

5.5 Mechanical Specifications
Physical dimensions are detailed in Table 9. Figure 3 and Figure 4 on page 13 illustrates the N3000 M.2
dimensions.
Table 9: Physical Dimensions
Physical Dimensions

Unit

Length42.00/80.00±0.15

Width22.00±0.15

Thickness (nominal)

3.8

Weight (Max Capacity)≤ 9.0

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5.6 Reliability and Endurance
The Mean Time Between Failure (MTBF) is specified to exceed the value listed in Table 10. Data reliability witheffective error tolerance and data retention at the beginning and end of life is also provided.
Table 10: Reliability
Parameter

Value

MTBF (at 25 °C)> 3,000,000 hours

Data Reliability< 1 Non-Recoverable Error per 10 Bits Read

Data Retention

10 Years at Start (JESD47), 1 Year at EOL

16

Endurance represented as both TeraBytes Written (TBW) and full Drive Writes Per Day (DWPD) for different
application scenarios is provided in Table 11.
Table 11: Endurance10, 11
Capacity

Sequential

ClientEnterpriseTBW

DWPD12TBW

DWPD12TBW

DWPD12240 GBytes

856

3.26

271

1.03

207

0.79

480 GBytes

1,684

3.20

503

0.96

379

0.72

960 GBytes

3,334

3.17

903

0.86

699

0.66

1920 GBytes

6,774

3.22

1,399

0.67

1,620

0.77

5.7 Drive Geometry Specification
The N3000 M.2 drive geometry is set to report industry standard LBA settings per the IDEMA standard (LBA103). The values for each capacity are shown in Table 12.
Table 12: Drive Geometry10

Total LBA

User Addressable Bytes

Decimal(Unformatted)

240 GBytes

468,862,128

240,057,409,536

512 GBytes

480 GBytes

937,703,088

480,103,981,056

1024 GBytes

960 GBytes

1,875,385,008

960,197,124,096

2048 GBytes

1920 GBytes

3,750,748,848

1,920,383,410,176

Raw Capacity

User Capacity13

256 GBytes

Client and Enterprise workloads follow the JEDEC JESD219 standard. Enterprise workload values are measured based on 240 hours of
runtime. 1 TByte = 1012 bytes
11
According to JEDEC (JESD47I), the time to write the full TBW is a minimum of 18 months. Higher average daily data volume reduces the
specified TBW. The values listed are estimates and are subject to change without notice.
12
DWPD values are based on a service life of 3 years
13
1 GByte = 109 bytes
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6. Electrical Interface
This 75-position m.2 connector (Figure 2) incorporates M key for Socket 3 PCIe-based SSDs and follows theapplicable PCIe m.2 specification. The signal/pin assignments and descriptions are listed in the following Table
13.
Figure 2: N3000 M.2 Electrical Interface
TOP

BOTTOM

Table 13: Pin Assignment, Name and Description
Description

Assignment

Pin

Pin

Assignment

Description

Config_3

GND

1

2

+3.3V

3.3V Source

Ground

GND

3

4

+3.3V

3.3V Source

PCIe TX Differential Signal

PETn3*

5

6

NC

No Connect

PCIe TX Differential Signal

PETp3*

7

8

NC

No Connect

GroundGND

9

10DAS/DSS

DEVACT Device Activity Signal

PCIe RX Differential Signal

PERn3*

11

12

+3.3V

3.3V Source

PCIe RX Differential Signal

PERp3*

13

14

+3.3V

3.3V Source

Ground

GND

15

16

+3.3V

3.3V Source

PCIe TX Differential Signal

PETn2*

17

18

+3.3V

3.3V Source

PCIe TX Differential Signal

PETp2*

19

20

NC

No Connect

Config_0

GND

21

22

NC

No Connect

PCIe RX Differential Signal

PERn2*

23

24

NC

No Connect

PCIe RX Differential Signal

PERp2*

25

26

NC

No Connect

Ground

GND

27

28

NC

No Connect

PCIe TX Differential Signal

PETn1*

29

30

NC

No Connect

PCIe TX Differential Signal

PETp1*

31

32

NC

No Connect

Ground

GND

33

34

NC

No Connect

PCIe RX Differential Signal

PERn1*

35

36

NC

No Connect

PCIe RX Differential Signal

PERp1*

37

38

NC

No Connect

Ground

GND

39

40

SMB_CLK

SMBus Clock

PCIe TX Differential Signal

PETn0*

41

42

SMB_DATA

SMBus Data

PCIe TX Differential Signal

PETp0*

43

44

ALERT#

SMBus Alert Notification

Ground

GND

45

46

NC

No Connect

PCIe RX Differential Signal

PERn0*

47

48

NC

No Connect

PCIe RX Differential Signal

PERp0*

49

50

PERST#

PE-Reset (Functional Reset)

Ground

GND

51

52

CLKREQ#

Clock Request Signal; L1 PM

PCIe Reference Clock Signal

REFCLKn

53

54

NC

PCIe PME Wake

PCIe Reference Clock Signal

REFCLKp

55

56

NC

MFG Data

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Ground

GND

57

58

NC

MFG Clock

Mechanical Notch M

-

59-65

No Connect

NC

67

60-66

-

Mechanical Notch M

Config_1

NC

69

68

NC

32.768 kHz Clock Supply

Ground

GND

71

70

3.3V

Supply Pin, 3.3V

Ground

GND

73

72

3.3V

Supply Pin, 3.3V

Config_2

GND

75

74

3.3V

Supply Pin, 3.3V

*TX (transmit) and RX (receive) pins are labeled from the SSD view and must be connected with the reversed RX and TX
signals of the host (i.e., TX to RX and RX to TX).

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7. Package MechanicalFigure 3: N3000 M.2 2242 dimensions in mm

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Figure 4: N3000 M.2 2280 dimensions in mm

Figure 5: M.2 Connector Dimensions in mm

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8. NVMe Commands
This section provides information on the NVMe commands supported by the SSD. The commands are issued byloading the DWords in the command block with the supplied parameter, and then writing the command code
to the register. See the following Table 14 for a list of NVMe commands the device supports. For details about
setting up the command registers, see the latest NVMe Specification.
Table 14: NVMe Command Set – Supported Commands
Command

Code

Admin Command Set
Delete I/O Submission Queue

00h

Create I/O Submission Queue

01h

Get Log Page

02h

Delete I/O Completion Queue

04h

Create I/O Completion Queue

05h

Identify

06h

Abort

08h

Set Features

09h

Get Features

0Ah

Asynchronous Event Request

0Ch

Firmware Commit

10h

Firmware Image Download

11h

Device Self-test

14h

Format NVM

80h

Sanitize84h

NVM Command Set
Flush

00h

Write

01h

Read

02h

Write Uncorrectable04h

Compare05h

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CommandCodeWrite Zeroes

08h

Dataset Management

09h

Table 15: NVMe Set/Get Features – Supported Features
FeatureFID

Arbitration

01h

Power Management

02h

LBA Range Type03h

Temperature Threshold

04h

Error Recovery

05hVolatile Write Cache

06h

Number of Queues

07hInterrupt Coalescing

08h

Interrupt Vector Configuration

09h

Write Atomicity Normal

0Ah

Asynchronous Event Configuration

0Bh

Autonomous Power State Transition

0Ch

Timestamp

0Eh

Host Controlled Thermal Management

10h

Non-Operational Power State Config

11h

Software Progress Marker

80h

Table 16: Supported Log Pages
Log Page

Log Identifier

Error Information

01h

SMART/Health Information

02h

Firmware Slot Information

03h

Commands Supported and Effects

05h

Device Self-Test Log

06h

Telemetry Host-Initiated07h

Telemetry Controller-Initiated08h

Endurance Group Information

09h

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9. Identify Device Information
The following table describes the 4096 bytes of data the drive returns for the Identify command (06h).
Table 17: Identify Namespace Data Structure (CNS 00h)
Byte(s)Default
Value

Data Field Type Information

0-7

XXXXh14

Namespace Size (NSZE)

8-15

14

XXXXh

Namespace Capacity (NCAP)

16-23

XXXXh14

Namespace Utilization (NUSE)

24

00h

Namespace Features (NSFEAT)

25

00h

Number of LBA Formats (NLBAF)

26

00h

Formatted LBA Size (FLBAS)

27

00h

Metadata Capabilities (MC)

28

00h

End-to -end Data Protection Capabilities (DPC)

29

00h

End-to -end Data Protection Type Settings (DPS)

30

00h

Namespace Multi-path I/O and Namespace Sharing Capabilities (NMIC)

31

00h

Reservation Capabilities (RESCAP)

32

80h

Format Progress Indicator (FPI)

33

01h

Deallocate Logical Block Features (DLFEAT)

34-35

0000h

Namespace Atomic Write Unit Normal (NAWUN)

36-37

0000h

Namespace Atomic Write Unit Power Fail (NAWUPF)

38-39

0000h

Namespace Atomic Compare & Write Unit (NACWU)

40-41

0000h

Namespace Atomic Boundary Size Normal (NABSN)

42-43

0000h

Namespace Atomic Boundary Offset (NABO)

44-45

0000h

Namespace Atomic Boundary Size Power Fail (NABSPF)

46-47

0000h

Namespace Optimal IO Boundary (NOIOB)

48-63

All 00h

NVM Capacity (NVMCAP)

64-65

0000h

Namespace Preferred Write Granularity (NPWG)

66-67

0000h

Namespace Preferred Write Alignment (NPWA)

68-69

0000h

Namespace Preferred Deallocate Granularity (NPDG)

70-71

0000h

Namespace Preferred Deallocate Alignment (NPDA)

72-73

0000h

Namespace Optimal Write Size (NOWS)

74-91

All 00h

Reserved

92-95

00000000h

ANA Group Identifier (ANAGRPID)

96-98

000000h

Reserved

9900h

Namespace Attributes (NSATTR)

100-1010000h

NVM Set Identifier (NVMSETID)

102-1030000h

Endurance Group Identifier (ENDGID)

104-119120-127537769737362
69748C6078X Namespace Globally Unique Identifier (NGUID)XXXXX0001h14
8C6078XXXXXXIEEE Extended Unique Identifier (EUI64)
0001h14128-13100090000h

LBA Format 0 Support (LBAF0)

132-191

All 00h

LBA Format 1 to 15 Support (LBAF1 - LBAF15)

14

Values depend on device configuration.

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Byte(s)Default
Value

Data Field Type Information

192-383

All 00h

Reserved

384-4095

All 00h

Vendor Specific (VS)

Table 18: Identify Controller Data Structure (CNS 01h)
Byte(s)Default
Value

Data Field Type Information

0-1

1DD4h

PCI Vendor ID (VID)

2-3

1DD4h

PCI Subsystem Vendor ID (SSVID)

4-23
24-63

14

Serial Number (SN)14

Model Number (MN)

14

XXXXh
XXXXh

64-71

XXXXh

Firmware Version (FR)

72

06h

Recommended Arbitration Burst (RAB)

73-75

8C6078h

IEEE OUI Identifier (IEEE)

76

00h

Controller Multi-Path I/O and Namespace Sharing Capabilities (CMIC)

77

06h

Maximum Data Transfer Size (MDTS)

78-79

0000h

Controller ID (CNTLID)

80-83

00010400h

Version (VER)

84-87

000186A0h

Runtime D3 Resume Latency (RTD3R)

88-91

004C4B40h

Runtime D3 Entry Latency (RTD3E)

92-95

00000200h

Optional Asynchronous Events Supported (OAES)

96-99

00000002h

Controller Attributes (CTRATT)

100-101

0000h

Read Recovery Levels Supported (RRLS)

102-110

All 00h

Reserved112-127

All 00h

FRU Globally Unique Identifier (FGUID)

128-1290000h

Command Retry Delay Time 1 (CRDT1)

130-1310000h

Command Retry Delay Time 2 (CRDT2)

132-1330000h

Command Retry Delay Time 3 (CRDT3)

134-255

All 00h

Reserved

256-2570017h

Optional Admin Command Support (OACS)

258

04h

Abort Command Limit (ACL)

259

07h

Asynchronous Event Request Limit (AERL)

260

14h

Firmware Updates (FRMW)

261

0Fh

Log Page Attributes (LPA)

262

FFh

Error Log Page Entries (ELPE)

263

04h

Number of Power States Supported (NPSS)

264

00h

Admin Vendor-Specific Command Configuration (AVSCC)

265

01h

Autonomous Power State Transition Attributes (APSTA)

266-267016Bh

Warning Composite Temperature Threshold in Degrees Kelvin (WCTEMP)

268-269

017Fh

Critical Composite Temperature Threshold in Degrees Kelvin (CCTEMP)

270-2710032h

Maximum Time for Firmware Activation (MTFA)

272-275

00000000h

Host Memory Buffer Preferred Size (HMPRE)

276-27900000000h

Host Memory Buffer Minimum Size (HMMIN)

280-295

All 00h

Total NVM Capacity (TNVMCAP)

296-311

All 00h

Unallocated NVM Capacity (UNVMCAP)

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Byte(s)Default
Value

Data Field Type Information

312-31500000000h

Replay Protected Memory Block Support (RPMBS)

316-3170005h

Extended Device Self-test Time (EDSTT)

318

01h

Device Self-test Options (DSTO)

319

00h

Firmware Update Granularity (FWUG)

320-3210000h

Keep Alive Support (KAS)322-3230001h

Host Controlled Thermal Management Attributes (HCTMA)

324-325

012Fh

Minimum Thermal Management Temperature (MNTMT)

326-3270175h

Maximum Thermal Management Temperature (MXTMT)

328-331

60000003h

Sanitize Capabilities (SANICAP)

332-335000000000h

Host Memory Buffer Minimum Descriptor Entry Size (HMMINDS)

336-3370000h

Host Memory Maximum Descriptors Entries (HMMAXD)

338-3390000h

NVM Set Identifier Maximum (NSETIDMAX)

340-3410000h

Endurance Group Identifier Maximum (ENDGIDMAX)

342

00h

ANA Transition Time (ANATT)

343

00h

Asymmetric Namespace Access Capabilities (ANACAP)

344-34700000000h

ANA Group Identifier Maximum (ANAGRPMAX)

348-35100000000h

Number of ANA Group Identifiers (NANAGRPID)

352-355

00000000h

Persistent Event Log Size (PELS)

356-511

All 00h

Reserved

512

66h

Submission Queue Entry Size (SQES)

513

44h

Completion Queue Entry Size (CQES)

514-5150000h

Maximum Outstanding Commands (MAXCMD)

516-519000000001h

Number of Namespaces (NN)520-521005FhOptional NVM Command Support (ONCS)

522-5230000h

Fused Operation Support (FUSES)

524

04h

Format NVM Attributes (FNA)

525

01h

Volatile Write Cache (VWC)

526-5270001h

Atomic Write Unit Normal (AWUN)

528-5290001h

Atomic Write Unit Power Fail (AWUPF)

530

00h

NVM Vendor-Specific Command Configuration (NVSCC)

531

00h

Namespace Write Protection Capabilities (NWPC)

532-533

0000h

Atomic Compare and Write Unit (ACWU)

534-5350000h

Reserved

536-53900000000h

Scatter Gather List Support (SGLS)

540-54300000000h

Maximum Number of Allowed Namespaces (MNAN)

544-767

All 00h

Reserved

768-1023

14

XXXXh

NVM Subsystem NVMe Qualified Name (SUBNQN)

1024-2047

All 00h

Reserved

2048-2079

14

Power State 0 Descriptor

14Power State 1 Descriptor

14Power State 2 Descriptor

14Power State 3 Descriptor

14Power State 4 Descriptor

2080-2111
2112-2143
2144-2175
2176-2207

XXXXh
XXXXh
XXXXh
XXXXh
XXXXh

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Byte(s)Default
Value

Data Field Type Information

2208-3071

All 00hPower State 5 - 31 Descriptor (Not Applicable)

3072-4095-

Vendor Specific (VS)10. Health Monitoring Functionality
The N3000 M.2 SSDs support Self-Monitoring, Analysis, and Reporting Technology. The SSD supports log
information as defined in the NVMe specification.
See the following table for the 512-byte data structure of the SMART/Health Information log page:
Table 19: SMART/Health Information (Log Identifier 02h)
Byte(s)Description0

Critical warning: for the state of the controller•
Bit 0: If set to ‘1’, then the available spare capacity has fallen below the threshold•
Bit 1: If set to ‘1’, then a temperature is greater than or equal to an over temperaturethreshold; or less than or equal to an under temperature threshold•
Bit 2: If set to ‘1’, then the NVM subsystem reliability has been degraded due tosignificant media related errors or any internal error that degrades NVM subsystem
reliability.
•
Bit 3: If set to ‘1’, then all of the media has been placed in read only mode

1-2

Composite Temperature: in degrees Kelvin

3

Available Spare: as a percentage of remaining spare capacity

4

Available Spare Threshold5

Percentage Used: Estimate of the percentage of the NVM subsystem life left based on usage

6-31

Reserved

32-47

Data Units Read: Number of 512-byte sectors read by the host (in 1000 increments)

48-63

Data Units Written: Number of 512-byte sectors written by the host (in 1000 increments)

64-79

Host Read Commands: Number of Read commands completed by the controller

80-95

Host Write Commands: Number of Write commands completed by the controller

96-111

Controller Busy Time: Amount of time, in minutes, the controller was busy with I/O commands

112-127

Power Cycles: Number of power cycles that has occurred over the life of the drive

128-143

Power On Hours: Number of hours the device has been powered over the life of the drive (doesnot include the time the device is in low power state conditions)144-159

Unsafe Shutdowns: Number of shutdowns that occurred without a shutdown notification

160-175

Media and Data Integrity Errors: Number of unrecoverable errors, including UECC, CRC checksum
failures, and LBA mismatches, that occurred over the life of the drive

176-191

Number of Error Information Log Entries: Number of entries recorded in the Error Information log
over the life of the drive

192-195

Warning Composite Temperature Time: Amount of time, in minutes, the controller was operational
and the Composite Temperature was equal to or greater than the Warning Composite TemperatureThreshold (WCTEMP) but less than the Critical Composite Temperature Threshold (CCTEMP)

196-199

Critical Composite Temperature Time: Amount of time, in minutes, the controller was operational
and the Composite Temperature was equal to or greater than the Critical Composite TemperatureThreshold (CCTEMP)

200-201

Temperature Sensor 1: Current controller Tjunction temperature, in degrees Kelvin202-203

Temperature Sensor 2: Current composite temperature, in degrees Kelvin204-205

Temperature Sensor 3: Current maximum NAND temperature, in degrees Kelvin

206-215

Not used

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216-219

Thermal Management Temperature 1 Transition Count: number of times the controller transitioned
to lower power active power states or performed vendor specific thermal management actions
while minimizing the impact on performance220-223

Thermal Management Temperature 2 Transition Count: number of times the controller transitioned
to lower power active power states or performed vendor specific thermal management actions
regardless of the impact on performance224-227

Total Time For Thermal Management Temperature 1: number of seconds
that the controller had transitioned to lower power active power states or performed vendor
specific thermal management actions while minimizing the impact on performance

228-231

Total Time For Thermal Management Temperature 2: number of seconds that the controller had
transitioned to lower power active power states or performed vendor specific thermal management
actions regardless of the impact on performance232-511

Reserved

The following data structure is applied to both Telemetry Host-Initiated log and Telemetry Controller-Initiatedlog:
Table 20: Telemetry Log (Log Identifier 07h)
Byte(s)Description

Telemetry Header
0

Log Identifier: This field shall be 07h

1-4

Reserved

5-7IEEE OUI Identifier (IEEE):

4

Telemetry Host-Initiated Data Area 1 Last Block: This field shall be 0001h

10-381

Reserved

382

Telemetry Controller-Initiated Data Available

383

Telemetry Controller-Initiated Data Generation Number

384-511

Reserved

Telemetry Data Block 1
528-529

Minimum Temperature, in degrees Kelvin530-531

Current Temperature, in degrees Kelvin532-533

Maximum Temperature, in degrees Kelvin560-561

Number of valid spare blocks

562-563

Number of initial spare blocks

564-565

Run Time Bad Block Count

596-599

Maximum Erase Count on system blocks

604-607

Average Erase Count on system blocks

612-615

Maximum Erase Count on data storage blocks

620-623

Average Erase Count on data storage blocks

624-627

Rated Erase Count on system blocks

636-639

Rated Erase Count on data storage blocks

640

Remaining Life Percentage on system blocks based on P/E

641

Remaining Life Percentage based on spare blocks

646

Remaining Life Percentage on data storage blocks based on P/E

647

Cap Health Status

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772-776

NVMe/PCIe Reset Count

804-807

PCIe Gen1 Link Speed Count

808-811

PCIe Gen2 Link Speed Count

812-815

PCIe Gen3 Link Speed Count

816-823

PCIe ECRC Event Count

824-831

PCIe LCRC Event Count

873

PCIe Power On Link Speed

876

PCIe Current Link Speed

877

PCIe Current Link Width932-935

PCIe x1 Link Width Count

936-939

PCIe x2 Link Width Count

940-943

PCIe x4 Link Width Count

944-951

PCIe L1 Event Count

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11. Part Number Decoder
S

N3000 MD

1T92

I - 1

MA4 - 1

Swissbit

GB - STD

Option
STD: Standard

Series
N3000 (w/o PLP)

Firmware variant
GB: Standard

Form factor
MD: M.2, 2280
MB: M.2, 2242

Firmware revision
NAND flash config.

Density
240G: 240GB
480G: 480GB
960G: 960GB
1T92: 1.92TB

Hardware generation

Temp. Grade
I: -40 ° to 85 °C

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12.

Marking Specification

12.1 Top View
Figure 6: N3000 M.2 top view

12.2 Print on the label
Figure 7: N3000 M.2 label details

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13. Revision History
Table 21: Document Revision History
Date

Revision

Description

Revision Details

24-10-2023

0.90

Preliminary releaseDoc. req. no. 6642

11-01-2024

0.91

PN UpdateDoc. req. no. 6809

20-03-2024

0.92

Figure 1 Update

Doc. req. no. 6968

13-05-2024

1.00

Initial releaseDoc. req. no. 7079

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