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SPECIFICATION FOR APPROVAL
3W, 2512, SL Type Low Resistance Chip Resistor (Lead / Halogen Free)
1. Scope
This specification applies to 3.2mm x 6.4mm size 3W, fixed metal foil current sensing resistors usedin electronic equipment.
2. Type Designation
RL32640W – □□□□ – □(1)(2)(3)Where(1) Series No.
(2) Resistance value :For example :Four digits of number
R005 = 5mΩ
(3) Tolerance :Refer to paragraph 4
3. Dimensions and schematicLCodeLetter

R005WtaaDimensions (mm)3264

L

6.35 ± 0.25

W

3.15 ± 0.25

a0.95 ± 0.30

t0.80 ± 0.20

Note:Marking (No Direction)

Figure 1. Construction and Dimensions

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SPECIFICATION FOR APPROVAL
4. Specification
Characteristics

FeaturePower Rating*3W

Resistance Value
Temperature Coefficient of Resistance

2~4 mΩ

5~50 mΩ± 200 ppm/℃± 100 ppm/℃

Operation Temperature Range-55℃ ~ +170℃

Resistance Tolerance± 1%(F) , ± 2%(G) , ± 5%(J)Insulation ResistanceOver 100MΩ
( P*R)1/2

Maximum Working Voltage (V)RATED LOAD(%)

Note * :Power rating is based on continuous full load operation at rated ambient temperature of 70℃. For
resistors operated at ambient temperature in excess of 70℃, the maximum load shall be derated inaccordance with the following curve.

1000-5570170

AMBIENT TEMPERATURE(℃)

Figure 2.：Power Temperature Derating CurveDOCUMENT : SM0W0000NH
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SPECIFICATION FOR APPROVAL
5. Reliability Performance
Test Item
Short Time Overload

Condition of Test
5 x Rated power for 5 seconds
Refer to JIS C 5201-1 4.13

Thermal Shock

Requirements
ΔR：± 2.0%-55 ~125℃ 100 cycles, 15 min at each extreme
condition

ΔR：± 0.5%

Refer to JIS C 5201-1 4.19
Low Temperature Storage

Kept at -55℃, 1,000 hours
Refer to JIS C 5201-1 4.23.4

Resistance to Soldering Heat

ΔR：± 1.0%

Dipped into solder at 270 ± 5℃ for
20 ± 1 seconds

ΔR：± 0.5%

Refer to JIS C 5201-1 4.18
Load Life

Rated voltage for 1.5hours followed by a pause
0.5hour at 70 ± 3℃
Cycle repeated 1,000 hours

ΔR：± 2.0%

Refer to JIS C 5201-1 4.25
Damp Heat with Load

40 ± 2℃ with relative humidity 90% to 95%.
D.C. rated voltage for 1.5 hours ON 30
minutes OFF.

ΔR：± 1.0%

Cycle repeated 1,000 hours
Refer to JIS C 5201-1 4.24
High Temperature Exposure

Kept at 170℃ for 1,000 hours
Refer to JIS C 5201-1 4.23.2

Solderability

Mechanical ShockTemperature of Solder : 245 ± 5℃

Uniform coating of solder

Immersion Duration : 3 ± 0.5 second

cover minimum of 95%

Refer to JIS C 5201-1 4.17

surface being immersed

100 G’s for 6milliseconds. 5 pulses

ΔR：± 0.5%

Refer to JIS C 5201-1 4.21
Substrate Bending

ΔR：± 1.0%

Glass-Epoxy board thickness : 1.6mm
Bending width : 2mm
Between the fulcrums : 90mm
Refer to JIS C 5201-1 4.33

ΔR：± 1.0%

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SPECIFICATION FOR APPROVAL
6. Recommended Solder Pad Dimensions
LD3264W
L(mm) (mm)

D(mm)

t(μm)

4.00

3.35

105

8.00

t: Copper foil minimum thickness of PCB

W
Cu Trace
Sensing Trace

Note : We recommend there is no circuit design between pads to avoid circuit short

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SPECIFICATION FOR APPROVAL
7. Packaging
7-1 Dimensions
7-1-1 Tape packaging dimensions
0.3 max.

1.5+0.1-0.0

4.0 ± 0.1

Feed forward hole

2.0 ± 0.05

1.5 ± 0.1

1.75 ± 0.10

5.50 ± 0.05

B

12.0 ± 0.3

1.5 max.

ACavity

4.0 ± 0.1

Pulling direction

A = 3.60 ± 0.20

Unit : mm

B = 6.80 ± 0.20

7-1-2 Reel dimensions

13.0±0.5

4.00+0-0 .52.0±0.5

178.0±2.0
60.2±0.513.2±1.5

16.0±0.2
Unit : mm

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SPECIFICATION FOR APPROVAL
7-2 Peel Strength of Top Cover Tape
The peel speed shall be about 300mm/min.
The peel force of top cover tape shall between 0.1 to 0.7N

Top Cover Tape

165 ~ 180°

0.1 ~ 0.7N

Carrier tape

7-3 Number of Taping
2,000 pieces / reel
7-4 Label marking
The following items shall be marked on the reel.
(1) Type designation(2) Quantity(3) Manufacturing date code(4) Manufacturer’s name(5) The country of origin