DOCUMENT: SRK220000NH

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SPECIFICATION FOR APPROVAL
1/8W, 0402, Low Resistance Chip Resistor (Lead / Halogen Free)
1. Scope
This specification applies to1.0mm x 0.5mm size 1/8W, fixed thick film low resistance value chipresistors rectangular type.
2. Type Designation
RLT0510 - 2 - □□□□
(1) (2)(3)Where□(4)(1) Size No.
(2) Power Rating:2 = 1/8W(3) Resistance value:
For example -R075 = 0.075Ω
R100 = 0.100Ω
The “R” shall be used as a decimal point(4) Resistance tolerance:
F = ±1.0%, G= ±2%, J= ±5%

3. Outline Dimensions
LaaWtbCode LetterDimension

L

1.00 ± 0.10

W

0.50 ± 0.10t0.35 +0.15/-0.10

a0.25 ± 0.10

b0.30 ± 0.10
Unit : mm

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SPECIFICATION FOR APPROVAL
4. Ratings
4-1 Specification
Table 1
Power Rating*

1/8W

Resistance Tolerance

1%(F), 2%(G), 5%(J)Resistance Range
Temperature Coefficient ofResistance(ppm/℃)

0.065 ~ <0.60Ω

0.60 ~ 1.0Ω

±300±200

Operating Temperature Range-55℃ to 125℃

Note*:
Power Rating is based on continuous full load operation at rated ambient temperature of 70℃.
For resistor operated at ambient temperature in excess of 70℃,the maximum load
shall be derated in accordance with the following curve.

RATED LOAD(%)

1000-5570125AMBIENT TEMPERATURE(℃)

4-2 Rated Voltage
The d.c. or a.c. r.m.s. voltage shall be calculated from the following expression
V =P× R

Where V: Rated voltage (V)P : Rated power (W)R : Nominal resistance (Ω)
4-3 Operating and Storage Temperature Range-55 to +125℃

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SPECIFICATION FOR APPROVAL
5. Characteristics
5-1 Electrical
Item

Specification and Requirement

Test Method (JIS 5201)

Temperature Coefficient As follow table 1.
Room temperatureof Resistance (TCR)
Room temperature+100℃
Short Time Overload(1) Applied voltage: 2.5 x rated△ R:±1.0%
voltage
Without damage by flashover, spark,(2)
Test time: 5 seconds
arcing, burning or breakdown
Insulation Resistance

Voltage Proof(1) Setup as figure 1
Over 100 MΩ on Overcoat layer(2)
Test voltage: 100VDC±15VDC
face up(3) Test time: 60 + 10 / - 0 seconds
Over 1,000 MΩ on Substrate side
face upResistance range:±1.0%(1) Setup as figure 1
Without damage by flashover, spark, (2) Test voltage: 100VAC(rms.)
arcing, burning or breakdown(3) Test time: 60 + 10 / - 0 seconds

Pressure Rod(Metal)

Insulation Plate

Measurement Point A(R=0.5 mm)
SubstrateA

Over coat FilmB

SpringSample Electrode
Voltage Supply
Metal Block
Measurement Point B

Substrate SideFigure 1 : Measurment SetupDOCUMENT: SRK220000NH

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SPECIFICATION FOR APPROVAL
5-2 Mechanical
Item

Specification and Requirement

Test Method (JIS 5201)

Solderability

The surface of terminal immersed
shall be minimum of 95% covered
with a new coating of solder

Solder bath:
After immersing in flux, dip in
245 ± 5℃ molten solder bath for 2 ±0.5 seconds

Resistance to Solder
Heat△ R: ± 1.0%
Without distinct deformation inappearance

Bending Test

(1) Pre-heat: 100~110℃
for 30 seconds(2) Immersed at solder bath of270 ± 5℃ for 10 ± 1seconds(3) Measuring resistance 1
hour after test
Bending value: 3 mm for 30 ± 1△ R: ± 1.0%
Without mechanical damage such as seconds
break

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SPECIFICATION FOR APPROVAL
5-3 Endurance
Item

Specification and Requirement

Test Method (JIS 5201)

Rapid Change ofTemperature△ R:±1.0%
Without distinct damage inappearance

Moisture with Load

△ R: ±5.0%
Without distinct damage inappearance

Load Life△ R: ±5.0%
Without distinct
damage in appearance(1) Repeat 5 cycle as follow:(-55 ± 3℃,30minutes)→(Room temperature, 2~3minutes)→(+125 ± 2℃,30minutes)→(Room temperature 2~3minutes)(2) Measuring resistance
1 hour after test
(1) Environment condition:
40 ± 2℃,90~95% RH(2) Applied Voltage: rated voltage(3) Test period: (1.5 hour ON)→(0.5 hour OFF) cycled fortotal
1,000 + 48 / - 0 hours(4) Measuring resistance
1 hour after test
(1) Test temperature: 70 ± 3℃
(2) Applied Voltage: rated voltage(3) Test period: (1.5 hour ON)→(0.5 hour OFF) cycled fortotal
1,000 + 48 / - 0 hours(4) Measuring resistance
1 hour after test
(1) Store temperature:-55 ± 3℃ for total
1,000 + 48 / - 0 hours(2) Measuring resistance
1 hour after test
(1) Store temperature:+125 ± 2℃ for total
1,000 + 48 / - 0 hours(2) Measuring resistance
1 hour after test

Low Temperature Store △ R: ± 5.0%
Without distinct
damage in appearance

High Temperature Store △ R: ± 5.0%
Without distinct
damage in appearance

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SPECIFICATION FOR APPROVAL
6. Recommend Land Pattern Dimensions

ACA

0.6~1.0B

2.0~2.4

C

0.6~1.0
Unit : mmB

7. Construction Drawing
Resin coating(Epoxy)Dielectric coating
Thick film Resistor

Alumina substrate ( Al2O3 )Thin electrode film:NiCr+NiCu
Side Electrode: Cu+Ni+Sn plating

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SPECIFICATION FOR APPROVAL
8. Packaging
8-1 Dimensions
8-1-1 Tape packaging dimensions
0.42±0.05¯1.5±0.1

4.0±0.1

Sprocket hole2.0±0.05

CAB

Chip
0.48 ± 0.1

DA=0.68±0.05
B=1.18±0.05

4.0±0.1

Carrier cavity

Pulling direction

C=1.75±0.1
D=3.5±0.05

Unit : mm

Remark: Leader tape length≧30 cm( 150 Hollow carrier cavity)
Reel dimensions

2.0¯56.0±120min.

¯60.0+0/-1¯13.0±0.2¯180+0/-3

8-1-2

9.0±0.3

Unit : mm

13±1.48.0±0.3

SPECIFICATION FOR APPROVAL
8-2 Peel force of top cover tape
The peel speed shall be about 300 mm/min.
The peel force of top cover tape shall be between 0.1 to 0.7 N.
Top Cover Tape

165 ~ 180°0.1~0.7 N

8-3 Numbers of taping 10,000 pieces /reel
8-4 Label making
The following items shall be marked on the reel.
(1) Type designation.
(2) Quantity(3) Manufacturing date code(4) Manufacturer’s name

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DOCUMENT: SRK220000NH

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SPECIFICATION FOR APPROVAL
9. Carenote
9-1 Care note for storage(1) Chip resistor shall be stored in a room where temperature and humidity must be controlled.
(temperature 5 to 35℃, humidity 45 to 85% RH) However, a humidity keep it low, as it ispossible.
(2) Chip resistor shall be stored as direct sunshine doesn’t hit on it.
(3) Chip resistor shall be stored with no moisture, dust, a material that will make solderability
inferior, and a harmful gas (Chloridation hydrogen, sulfurous acid gas, and sulfurationhydrogen)
9-2 Carenote for operating and handling(1) It is necessary to protect the edge and protection coat of resistors from mechanical stress.
(2) Handle with care when printing circuit board (PCB) is divided or fixed on support body,
because bending of printing circuit board (PCB) mounting will make mechanical stress forresistors.
(3) Resistors shall be used with in rated range shown in specification. Especially, if voltage morethan specified value will be loaded to resistor, there is a case it will make damage for machine
because of temperature rise depending on generating of heat, and increase resistance value orbreaks.
(4) In case that resistor is loaded a rated voltage, it is necessary to confirms temperature of aresistor and to reduce a load power according to load reduction curve, because a temperaturerise of a resistor depends on influence of heat from mounting density and neighboring
element.
(5) Observe Limiting element voltage and maximum overload voltage specified in eachspecification(6) If there is possibility that a large voltage (pulse voltage, shock voltage) charge to resistor, it isnecessary that operating condition shall be set up before use.