H262-P60

High-density ARM Server - DP 2U 4-NodeFeatures• 2U - 4 nodes rear access server system• Hardware-level root of trust support• Dual socket Ampere ® Altra® Max or Altra® Processors• 8-Channel RDIMM/LRDIMM DDR4, 64 x DIMMs• 8 x 1Gb/s LAN ports (Intel® I350-AM2)• 4 x Dedicated management ports• 1 x CMC global management port
• 24 x 2.5" SATA hot-swappable HDD/SSD bays
• 4 x M.2 with PCIe Gen4 x4 interface• 8 x Low profile PCIe Gen4 x16 expansion slots• 4 x OCP 3.0 Gen4 x16 mezzanine slots• 2200W (240V) 80 PLUS Platinum redundant PSU

SpecificationDimensions

2U 4 Nodes - Rear access (W440 x H87.5 x D840 mm)

Motherboard

MP62-HD0

CPUAmpere® Altra® Max or Altra® Processor
Dual processors, 7nm technology
Up to 128-core per processor
Total: 8 x LGA 4926 sockets

Chipset

System on Chip

Memory8-Channel DDR4 memory, total 64 x DIMM slots
RDIMM/LRDIMM modules up to 256GB supported
Up to 4TB of memory capacity supported per processor
Memory speed: Up to 3200 MHzLAN

8 x 1GbE LAN ports (Intel® I350-AM2)
4 x Dedicated management ports
1 x 10/100/1000 CMC global management port

VideoIntegrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Storage

Total: 24 x 2.5" SATA hot-swappable HDD/SSD bays

SAS

N/A

RAID

N/A

Expansion
Slots

8 x Half-length low-profile slot with PCIe x16 (Gen4 x16)
4 x OCP 3.0 mezzanine slot with PCIe Gen4 x8 or x16 bandwidth*
NOTE: Gen4 x16 available for Ampere Altra Max processor only
4 x M.2 slot: M-key, PCIe Gen4 x4, Supports NGFF-2280/22110

Front I/O-Rear I/O

Total: 8 x USB 3.0, 4 x Mini DP, 8 x RJ45, 4 x MLAN, 1 x CMC LAN

Backplane I/O

Total 24 x ports, each node handles 6 x ports
Speed and bandwidth: SATA 6Gb/s or SAS 12Gb/s per port

TPM

1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010

Power Supply

Dual 2200W 80 PLUS Platinum power supply
AC Input: 100-240V

SystemManagement

Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X)

OS
Compatibility

RHEL 8.3 / 8.5 (aarch64) or later
SLES 15 SP2 / 15 SP3 (aarch64) or later
Ubuntu 18.04.5 LTS / 20.04.1 LTS / 22.04 LTS (aarch64) or later
Fedora Server 33-1.2 / 35-1.2 (aarch64) or later
OracleLinux R8 U2 / R8 U5
Debian 10.9 (Buster) / 11.1

System Fans8 x 80x80x38mm (16,300rpm)

OperatingProperties

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

PackagingContent

1 x H262-P60
8 x CPU heatsinks
1 x Rail kit

ReferenceNumbers

Barebone package: 6NH262P60MR-00- Motherboard: 9MP62HD0NR-00- Rail kit: 25HB2-AN6103-K0R- CPU heatsink: 25ST1-45320B-A3R/25ST1-45320C-C1R- Power Supply: 25EP0-222003-D0S- C19 power cord 125V/15A (US): 25CP1-018000-Q0R (option)- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R (option)- Ring topology kit: 6NH262Z65SR-00-100 (option)

Learn more about GIGABYTE server solutions, visit www.gigabyte.com/Enterprise* All specifications are subject to change without notice. Please visit our website for the latest information.
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