DOCUMENT: SR110000NH

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SPECIFICATION FOR APPROVAL
1/16W, 0402 Low Resistance Chip Resistor (Lead / Halogen free)
1. Scope
This specification applies to 0.5mm x 1.0mm size 1/16W, fixed metal film chip resistors rectangulartype for use in electronic equipment.
2. Type Designation
RL 1005 — 1 — □□□□
(1)
(2)
(3)
Where
(1) Series No.
(2) Power rating
1 = 1/16W(3) Resistance value:
For example—R075 = 0.075 Ω
R100 = 0.1 Ω(4) Resistance tolerance:
F= ± 1%
G= ± 2%J= ± 5%□(4)

3. Construction and Physical DimensionsLaab

Figure 1.

W

Structure (No mark)tb

Code LetterDimensions (mm)L

1.00 ± 0.1

W0.50 ± 0.1

t0.35 −0.10

a0.25 ± 0.1

+0.15

b
0.25 ± 0.1
NOTE:① Resistive element( under protection film )② Electrode③ Protection film
④ Substrate

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SPECIFICATION FOR APPROVAL
4. Ratings
4-1 Specification
Power Rating*

1/16 W

Resistance Range

0.020Ω ~ <0.070Ω

0.070Ω ~ 1ΩResistance Tolerance±1% , ±2% , ±5%±1% , ±2% , ±5%0~500ppm/℃±100ppm/℃

Temperature Coefficient of Resistance
Note*:

Power Rating is based on continuous full load operation at rated ambient temperature of 70℃.
For resistors operated at ambient temperature in excess of 70℃, the maximum load shall bederated in accordance with the following curve.
%100Percentage of therated dissipation

500-55

70125

Ambient temperature
Figure 2

Derating Curve

4-2 Rated Voltage
The rated voltage shall be determined by the following expression.

V = P× R

Where V：Rated voltage (V)R：Nominal resistance value (Ω)
P：Rated dissipation (W)4-3 Operating and Storage Temperature Range-55 to +125℃℃

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SPECIFICATION FOR APPROVAL
5. Characteristics
Test Item

Condition of Test

Requirements∆R : ± (0.5%+0.0005Ω)
Without significant damage byflashover ( spark, arching ), burningor breakdown etc.

Short Time Overload

2.5 * Rated power for 5 seconds
Refer to JIS C 5201-1 4.13

Insulation Resistance

The resistor shall be cramped in theBetween Electrode and Protection
metal block and tested , as shown below. Film 100MΩ or over
Test voltage : 100 ± 15VDC for 1 minute Between Electrode and Substrate
Refer to JIS C 5201-1 4.6 Mounting
1,000MΩ or overcondition G.

Voltage Proof

The voltage : 100VAC (rms.) for 1 minute ∆R : ± (0.5%+0.0005Ω)
Refer to JIS C 5201-1 4.7
Without damage by flashover, fireor breakdown, as shown below.

Thermal Shock-55 ~125℃ 5 cycles, 15 min at eachextreme condition
Refer to JIS C 5201-1 4.19

∆R : ± (1.0%+0.0005Ω)
Without distinct damage inappearance

Low Temperature Storage

Kept at -55℃, 1,000 hours
Refer to JIS C 5201-1 4.23.4∆R : ± (1.0%+0.0005Ω)
Without distinct damage inappearance

High Temperature Exposure

Kept at 125℃ for 1,000 hours
Refer to JIS C 5201-1 4.23.2∆R : ± (1.0%+0.0005Ω)
Without distinct damage inappearance

Solderability

Temperature of Solder : 245 ± 5℃
Immersion Duration : 2 ± 0.5 second
Refer to JIS C 5201-1 4.17

Uniform coating of solder coverminimum of 95% surface being
immersed

Resistance to Soldering HeatDipped into solder at 270 ± 5℃
for 10 ± 1 seconds
Refer to JIS C 5201-1 4.18

∆R : ± (0.5%+0.0005Ω)
Without distinct deformation inappearance

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SPECIFICATION FOR APPROVAL

Test Item

Condition of Test

Requirements

Load Life

Rated voltage for 1.5 hours followed by apause 0.5 hour at 70 ± 2℃.
Cycle repeated 1000 hours
Refer to JIS C 5201-1 4.25

∆R : ± (1.0%+0.0005Ω)
Without distinct damage inappearance

Damp Heat with Load

60 ± 2℃ with relative humidity 90% to95%. D.C. rated voltage for 1.5 hours
ON and 30 minutes OFF. Cycle
repeated 1,000 hours
Refer to JIS C 5201-1 4.24

∆R : ± (1.0%+0.0005Ω)
Without distinct damage inappearance

Mechanical Shock

100 G’s for 6milliseconds. 5 pulses
Refer to JIS C 5201-1 4.21

∆R : ± (0.5%+0.0005Ω)
Without mechanical damage suchas break

Bending Test

Glass-Epoxy board thickness : 1.6mm
Bending width : 2mm
Between the fulcrums : 90mm
Refer to JIS C 5201-1 4.33

∆R : ±(0.5%+0.0005Ω)
Without mechanical damage suchas break

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SPECIFICATION FOR APPROVAL
Mounting of the test sample onto the test board shall be either of following methods.
(1) Mounting by solder dipping
Epoxy based glue shall be applied in the middle of two lands of the test board. Theresistor shall be mounted in such a way that the electrodes of resistors will be evenly
placed in the land area and then adhesive resin shall be cured. After applying the Resin
Flux with 25 weight % Methyl Alcohol, the board shall be soldered by dipping into amolten solder bath with 260 ± 5℃ for 3 to 5 seconds(2) Mounting by Reflow soldering
Solder paste with approximate 200μm thickness shall be applied to the land of test board.
The resistor shall be mounted in such way that the electrodes of resistors will be evenly
placed in the land area and then shall be soldered under the circumstance that the surface
temperature of the board shall be raised 245 ± 5℃(peak) for 5 to 10 seconds in an
upper-heater oven.
Material : Glass Fabric Epoxy Resin ( Refer to JIS C 6484 )Board thickness : 1.6mm
Copper foil thickness : 0.035mm
Solder Resist Coating
Test board A ( for substrate bending test)
bLandc4.540fa100abcf0.6

2.00.7(2.0)
Unit : mm

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SPECIFICATION FOR APPROVAL
Test board B ( for another test)
58.5

25.0

1.9

16.5

3.0

3.0

50.5

5.08
0.7

1.65
1.65

0.6

1.32
2.0

1.32

1.24

Unit : mm

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SPECIFICATION FOR APPROVAL
6. Packaging
6-1 Dimensions
6-1-1 Tape packaging dimensions+-0.42 ± 0.05

1.5 0.1
0.0

Sprocket hole

4.0 ± 0.1

1.75 ±0.1

ACHIP

3.5 ± 0.05
8.0 ± 0.3

B

0.48 ± 0.1

4.0 ± 0.1

Carrier cavity

2.0 ± 0.05
Pull Direction※ Pre-emptied holes : 150 holes (or 30cm) or more.
Code letterab

Unit : mm

0.68 ± 0.05 1.18 ± 0.05

Dimension

6-1-2 Reel Dimensions (Plastic reel : Correspond with EIAJ RRV08B)

13 ± 1.450105

213 ± 0.2+160-0

28 ± 0.8

R1+0180-3Label105 x 50

9 ± 0.3

Unit : mm

SPECIFICATION FOR APPROVAL
6-2 Peel force of top cover tape
The peel speed shall be about 300 mm / min.
The peel force of top cover tape shall be between 0.1 to 0.7 N.
Top Cover Tape

165 ~ 180°0.1~0.7 N

6-3 Numbers of taping
10,000 pieces / reel
6-4 Making
The following items shall be marked on the reel.
(1) Type designation
(2)
(3)
(4)
(5)

Quantity
Manufacturing date code
Manufacturer’s name
The country of origin

DOCUMENT: SR110000NH

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