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SPECIFICATION FOR APPROVAL
1/10W, 0201 Low Resistance Chip Resistor (Lead / Halogen free)
1. Scope
This specification applies to 0.3mm x 0.6mm size 1/10W, fixed metal film chip resistors
rectangular type for use in electronic equipment.
2. Type Designation
RL 0603(1)
Where—

C — □□□□
□
(2)
(3)
(4)
(1) Series No.
(2) Power ratingC = 1/10W(3) Resistance value:
For example—
R070 = 0.070 Ω
R100 = 0.1 Ω(4) Resistance tolerance:
F = ± 1%G = ± 2%
J = ± 5%

3. Construction and Physical Dimensions
LaW

bCode LetterDimensions (mm)L

0.6 ± 0.03

W

0.31 ± 0.04

t

0.27 ± 0.04

a0.14 ± 0.06

b0.14 ± 0.06

atb

Figure 1. Construction and Dimensions① Resistive element : Metal film
(Under protection film)② Electrode : Solder Sn (on Cu)
Sn 100% ( Lead free)③ Protection film : Epoxy resin④ Substrate : Alumina

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SPECIFICATION FOR APPROVAL
4. Electrical Specifications
4-1 Specification
Power Rating*

1/10 W

Resistance Range

0.020Ω~＜0.070Ω

0.070Ω ~ 1.0Ω

±1% , ±2% , ±5%

Resistance Tolerance
T.C.R.
(Temperature Coefficient of Resistance)

0~500 ppm/℃± 200ppm/℃

Note*:
Power Rating is based on continuous full load operation at rated ambient temperature of 70℃.
For resistors operated at ambient temperature in excess of 70℃, the maximum load shall bederated in accordance with the following curve.
%
100
Percentage of therated dissipation

500-55

70125

Ambient temperature
Figure 2

Derating Curve

4-2 Rated Voltage
The rated voltage shall be determined by the following expression.
V = P× R
Where V：Rated voltage (V)R：Nominal resistance value (Ω)
P：Rated dissipation (W)4-3 Operating and Storage Temperature Range-55 to +125℃℃

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SPECIFICATION FOR APPROVAL
5. Characteristics
Test Item

Condition of Test

Requirements∆R : ± (0.5%+0.0005Ω)
Without significant damage byflashover ( spark, arching ), burningor breakdown etc.

Short Time Overload

2.5 * Rated power for 5 seconds
Refer to JIS C 5201-1 4.13

Insulation Resistance

The resistor shall be cramped in theBetween Electrode and Protection
metal block and tested , as shown below. Film 100MΩ or over
Test voltage : 100 ± 15VDC for 1 minute Between Electrode and Substrate
Refer to JIS C 5201-1 4.6 Mounting
1,000MΩ or overcondition G.

Voltage Proof

The voltage : 100VAC (rms.) for 1 minute ∆R : ± (0.5%+0.0005Ω)
Refer to JIS C 5201-1 4.7
Without damage by flashover, fireor breakdown, as shown below.

Thermal Shock-55 ~125℃ 5 cycles, 15 min at eachextreme condition
Refer to JIS C 5201-1 4.19

∆R : ± (1.0%+0.0005Ω)
Without distinct damage inappearance

Low Temperature Storage

Kept at -55℃, 1,000 hours
Refer to JIS C 5201-1 4.23.4∆R : ± (1.0%+0.0005Ω)
Without distinct damage inappearance

High Temperature Exposure

Kept at 125℃ for 1,000 hours
Refer to JIS C 5201-1 4.23.2∆R : ± (1.0%+0.0005Ω)
Without distinct damage inappearance

Solderability

Temperature of Solder : 245 ± 5℃
Immersion Duration : 2 ± 0.5 second
Refer to JIS C 5201-1 4.17

Uniform coating of solder coverminimum of 95% surface being
immersed

Resistance to Soldering Heat

Dipped into solder at 270 ± 5℃
for 10 ± 1 seconds
Refer to JIS C 5201-1 4.18

∆R : ± (0.5%+0.0005Ω)
Without distinct deformation inappearance

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SPECIFICATION FOR APPROVAL

Test Item

Condition of Test

Requirements

Load Life

Rated voltage for 1.5 hours followed by apause 0.5 hour at 70 ± 2℃.
Cycle repeated 1000 hours
Refer to JIS C 5201-1 4.25

∆R : ± (1.0%+0.0005Ω)
Without distinct damage inappearance

Damp Heat with Load

40 ± 2℃ with relative humidity 90% to95%. D.C. rated voltage for 1.5 hours
ON and 30 minutes OFF. Cycle
repeated 1,000 hours
Refer to JIS C 5201-1 4.24

∆R : ± (1.0%+0.0005Ω)
Without distinct damage inappearance

Mechanical Shock

100 G’s for 6milliseconds. 5 pulses
Refer to JIS C 5201-1 4.21

∆R : ± (0.5%+0.0005Ω)
Without mechanical damage suchas break

Bending Test

Glass-Epoxy board thickness : 1.6mm
Bending width : 2mm
Between the fulcrums : 90mmRefer to JIS C 5201-1 4.33

∆R : ±(0.5%+0.0005Ω)
Without mechanical damage suchas breakDOCUMENT: SRFC0000NH

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SPECIFICATION FOR APPROVAL
6. Recommend Land Pattern Dimensions

AB

CA

0.3

B

1.0

C

0.3 ~ 0.7

Unit : mm

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SPECIFICATION FOR APPROVAL
7. Packaging
7-1 Dimensions
7-1-1 Tape packaging dimensions
0.38 ± 0.05

+0.1
1.5-0.0

Sprocket hole

4.0 ± 0.1

1.75 ±0.1

aCHIP

3.5 ± 0.05
8.0 ± 0.3

b0.49 max.

4.0 ± 0.1

Carrier cavity

2.0 ± 0.05
Pull Direction※Pre-emptied holes : 150 holes (or 30cm) or more.
Code letterabDimension

0.40 ± 0.05

0.7 ± 0.05

Unit : mm

7-1-2 Reel dimensions

2.0±0.560 ± 2.0

178 ± 2.0

13 ± 0.2

21 ± 0.8

9.0 ± 0.3
Unit : mm

11.4 ± 1.0

SPECIFICATION FOR APPROVAL
7-2 Peel force of top cover tape
The peel speed shall be about 300 mm/min.
The peel force of top cover tape shall be between 0.1 to 0.5 N.
Top Cover Tape

165 ~ 180°0.1~0.7 N

7-3 Numbers of taping
10,000 pieces/reel
7-4 Making
The following items shall be marked on the reel.
(1) Type designation(2) Quantity(3) Manufacturing date code(4) Manufacturer’s name(5) The country of origin

DOCUMENT: SRFC0000NH

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