Data sheet

BMP180Digital pressure sensor
Bosch Sensortec

BMP180 Data sheet
Document revision

2.5

Document release date

5 April 2013

Document number

BST-BMP180-DS000-09

Technical reference code(s)0 273 300 244

Notes

Data in this document are subject to change without notice. Productphotos and pictures are for illustration purposes only and may differ fromthe real product’s appearance.

Data sheet
BMP180Page 2

BMP180
DIGITAL PRESSURE SENSOR
Key features
Pressure range:
Supply voltage:

300 ... 1100hPa (+9000m ... -500m relating to sea level)
1.8 ... 3.6V (VDD)
1.62V ... 3.6V (VDDIO)

Package:

LGA package with metal lid
Small footprint:
3.6mm x 3.8mm
Super-flat:
0.93mm height

Low power:

5µA at 1 sample / sec. in standard modeLow noise:

0.06hPa (0.5m) in ultra low power mode
0.02hPa (0.17m) advanced resolution mode

- Temperature measurement included- I2C interface- Fully calibrated- Pb-free, halogen-free and RoHS compliant,- MSL 1

Typical applications






Enhancement of GPS navigation (dead-reckoning, slope detection, etc.)
In- and out-door navigation
Leisure and sports
Weather forecast
Vertical velocity indication (rise/sink speed)

BST-BMP180-DS000-09 | Revision 2.5 | April 2013
Bosch Sensortec© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.

Data sheet
BMP180Page 3

BMP180 general description
The BMP180 is the function compatible successor of the BMP085, a new generation of highprecision digital pressure sensors for consumer applications.
The ultra-low power, low voltage electronics of the BMP180 is optimized for use in mobile phones,
PDAs, GPS navigation devices and outdoor equipment. With a low altitude noise of merely 0.25m at
fast conversion time, the BMP180 offers superior performance. The I2C interface allows for easy
system integration with a microcontroller.
The BMP180 is based on piezo-resistive technology for EMC robustness, high accuracy and linearity as
well as long term stability.
Robert Bosch is the world market leader for pressure sensors in automotive applications. Based on
the experience of over 400 million pressure sensors in the field, the BMP180 continues a newgeneration of micro-machined pressure sensors.

BST-BMP180-DS000-09 | Revision 2.5 | April 2013
Bosch Sensortec© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.

Data sheet
BMP180Page 4

Index of Contents
1. ELECTRICAL CHARACTERISTICS ................................................................................................. 6
2. ABSOLUTE MAXIMUM RATINGS.................................................................................................... 8
3. OPERATION ...................................................................................................................................... 9
3.1 GENERAL DESCRIPTION .............................................................................................................. 9
3.2 GENERAL FUNCTION AND APPLICATION SCHEMATICS ..................................................................... 9
3.3 MEASUREMENT OF PRESSURE AND TEMPERATURE ..................................................................... 11
3.3.1 Hardware pressure sampling accuracy modes ................................................................ 12
3.3.2 Software pressure sampling accuracy modes .................................................................. 13
3.4 CALIBRATION COEFFICIENTS...................................................................................................... 13
3.5 CALCULATING PRESSURE AND TEMPERATURE ............................................................................ 14
3.6 CALCULATING ABSOLUTE ALTITUDE............................................................................................ 16
3.7 CALCULATING PRESSURE AT SEA LEVEL ..................................................................................... 17
4. GLOBAL MEMORY MAP ................................................................................................................ 18
5. I2C INTERFACE ............................................................................................................................... 19
5.1 I2C SPECIFICATION.................................................................................................................... 19
5.2 DEVICE AND REGISTER ADDRESS ............................................................................................... 20
5.3 I2C PROTOCOL ......................................................................................................................... 20
5.4 START TEMPERATURE AND PRESSURE MEASUREMENT ................................................................ 21
5.5 READ A/D CONVERSION RESULT OR E2PROM DATA ................................................................... 22
6. PACKAGE ........................................................................................................................................ 23
6.1 PIN CONFIGURATION ................................................................................................................. 23
6.2 OUTLINE DIMENSIONS ............................................................................................................... 24
6.2.1 Bottom view ..................................................................................................................... 24
6.2.2 Top view .......................................................................................................................... 25
6.2.3 Side view ......................................................................................................................... 25
6.3 MOISTURE SENSITIVITY LEVEL AND SOLDERING........................................................................... 26
6.4 ROHS COMPLIANCY .................................................................................................................. 26
6.5 MOUNTING AND ASSEMBLY RECOMMENDATIONS ......................................................................... 26
7. LEGAL DISCLAIMER ...................................................................................................................... 27
BST-BMP180-DS000-09 | Revision 2.5 | April 2013
Bosch Sensortec© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.

Data sheet
BMP180Page 5

7.1 ENGINEERING SAMPLES ............................................................................................................ 27
7.2 PRODUCT USE .......................................................................................................................... 27
7.3 APPLICATION EXAMPLES AND HINTS ........................................................................................... 27
8. DOCUMENT HISTORY AND MODIFICATION ............................................................................... 28

BST-BMP180-DS000-09 | Revision 2.5 | April 2013
Bosch Sensortec© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.

Data sheet
BMP180Page 6

1. Electrical characteristics
If not stated otherwise, the given values are ±3-Sigma values over temperature/voltage range in thegiven operation mode. All values represent the new parts specification; additional solder drift isshown separately.

Table 1: Operating conditions, output signal and mechanical characteristics
Parameter

SymbolOperating temperatureTA

Supply voltage

VDD

Supply current@ 1 sample / sec.
25°C

Peak current
Standby current

Relative accuracypressure
VDD = 3.3V

Absolute accuracypressure
VDD = 3.3V
Resolution of
output data

ConditionMin

operational

-40

+85

full accuracy

0+65

ripple max. 50mVpp

1.8

2.5

3.6

1.62

2.5

3.6

1

Max

Units
°C

V

IDDLOWultra low power mode

3

µA

IDDSTD

standard mode

5

µA

IDDHR

high resolution mode

7µA

IDDUHR

Ultra high res. mode

12

µA

IDDAR

Advanced res. mode

32

µA

Ipeak

during conversion

650

1000

µA

@ 25°C0.1

1µA

950 . . . 1050 hPa@ 25 °C

±0.12

hPa

±1.0

m

700 … 900hPa
25 . . . 40 °C

±0.12

hPa

±1.0

m

IDDSBM

4

300 . . . 1100 hPa
0 . . . +65 °C

-4.0

-1.0*

+2.0

hPa

300 . . . 1100 hPa-20 . . . 0 °C

-6.0

-1.0*

+4.5

hPa

pressure

0.01

hPa

temperature

0.1

°C

Noise in pressure
Absolute accuracy
temperature
VDD = 3.3VTypsee table on page 12-13@ 25 °C

-1.5

±0.5

+1.5

°C

0 . . . +65 °C

-2.0

±1.0

+2.0

°C

at 85°C

BST-BMP180-DS000-09 | Revision 2.5 | April 2013
Bosch Sensortec© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.

Data sheet
BMP180Page 7tc_p_low

ultra low power mode

3

4.5

ms

tc_p_std

standard mode

5

7.5

ms

tc_p_hrhigh resolution mode

9

13.5

ms

tc_p_luhr

ultra high res. mode

17

25.5

ms

tc_p_arAdvanced res. mode

51

76.5

ms

Conversion time
temperaturetC_tempstandard mode

3

4.5

ms

Serial data clock

fSCL

3.4

MHz

+2

hPa

Conversion timepressure

Solder drifts

Minimum solder
height 50µm

Long term stability**

12 months

-0.5
±1.0

hPa

* The typical value is: -1±1** Long term stability is specified in the full accuracy operating pressure range 0 … 65°C

BST-BMP180-DS000-09 | Revision 2.5 | April 2013
Bosch Sensortec© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.

Data sheet
BMP180Page 82. Absolute maximum ratings
Table 2: Absolute maximum ratings

Parameter

Condition

Storage temperature
Supply voltage
ESD rating

all pins
HBM, R = 1.5kΩ,
C = 100pF

Overpressure

The BMP180 has to be handled as

Min

Max

Units

-40

+85

°C

-0.3

+4.25

V

±2

kV

10,000hPa

Electrostatic Sensitive Device (ESD).

Figure 1: ESD

BST-BMP180-DS000-09 | Revision 2.5 | April 2013
Bosch Sensortec© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.

Data sheet
BMP180Page 9

3. Operation
3.1 General description
The BMP180 is designed to be connected directly to a microcontroller of a mobile device via the I2C
bus. The pressure and temperature data has to be compensated by the calibration data of theE2PROM of the BMP180.
3.2 General function and application schematics
The BMP180 consists of a piezo-resistive sensor, an analog to digital converter and a control unit
with E2PROM and a serial I2C interface. The BMP180 delivers the uncompensated value of pressure
and temperature. The E2PROM has stored 176 bit of individual calibration data. This is used tocompensate offset, temperature dependence and other parameters of the sensor.
 UP = pressure data (16 to 19 bit)
 UT = temperature data (16 bit)

BST-BMP180-DS000-09 | Revision 2.5 | April 2013
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parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.

Data sheet
BMP180Page 10Note:2(1) Pull-up resistors for I C bus, Rp = 2.2kΩ ... 10kΩ, typ. 4.7kΩ

Figure 2: Typical application circuit

BST-BMP180-DS000-09 | Revision 2.5 | April 2013
Bosch Sensortec© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.

Data sheet
BMP180Page 11

3.3 Measurement of pressure and temperature
For all calculations presented here an ANSI C code is available from Bosch Sensortec (“BMP180_API”).

The microcontroller sends a start sequence to start a pressure or temperature measurement. After
converting time, the result value (UP or UT, respectively) can be read via the I2C interface. For
calculating temperature in °C and pressure in hPa, the calibration data has to be used. These
constants can be read out from the BMP180 E2PROM via the I2C interface at software initialization.
The sampling rate can be increased up to 128 samples per second (standard mode) for dynamic
measurement. In this case, it is sufficient to measure the temperature only once per second and touse this value for all pressure measurements during the same period.

Start

Start temperature
measurement
wait 4.5 ms
Read UT

Start pressure
measurement
wait (depends on mode, see below)
Read UP

Calculate pressure andtemperature in physicalunits

Figure 3: Measurement flow BMP180

BST-BMP180-DS000-09 | Revision 2.5 | April 2013
Bosch Sensortec© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.

Data sheet
BMP180Page 123.3.1 Hardware pressure sampling accuracy modes
By using different modes the optimum compromise between power consumption, speed andresolution can be selected, see below table.

Table 3: Overview of BMP180 hardware accuracy modes, selected by driver software via thevariable oversampling_settingModeultra low power

RMS

RMS

noise

noise

typ.

typ.

[hPa]

[m]

3

0.06

0.5

Internal

Conversion time

Avg. current @Parameter

number ofpressure max.

1 sample/s typ.

oversampling_setting

samples

[ms]

[µA]

1

4.5

0

standard

1

2

7.5

5

0.05

0.4

high resolution

2

4

13.5

7

0.04

0.3

ultra high resolution

3

8

25.5

12

0.03

0.25

For further information on noise characteristics see the relevant application note “Noise in pressure
sensor applications”.
All modes can be performed at higher speeds, e.g. up to 128 times per second for standard mode,with the current consumption increasing proportionally to the sample rate.

BST-BMP180-DS000-09 | Revision 2.5 | April 2013
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parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.

Data sheet
BMP180Page 133.3.2 Software pressure sampling accuracy modes
For applications where a low noise level is critical, averaging is recommended if the lower bandwidthis acceptable. Oversampling can be enabled using the software API driver (with OSR = 3).

Table 4: Overview of BMP180 software accuracy mode, selected by driver software via the variable
software_oversampling_setting

Mode

Parameteroversampling_setting

software_Conversion

Avg. current

oversampl

time

@1

RMS noise

RMS noise

ing_settinpressure

sample/s

typ. [hPa]typ. [m]gmax. [ms]typ. [µA]

1

76.5

32

0.02

0.17

Advanced
resolution

3

3.4 Calibration coefficients
The 176 bit E2PROM is partitioned in 11 words of 16 bit each. These contain 11 calibration
coefficients. Every sensor module has individual coefficients. Before the first calculation oftemperature and pressure, the master reads out the E2PROM data.
The data communication can be checked by checking that none of the words has the value 0 or
0xFFFF.
Table 5: Calibration coefficients
BMP180 reg adr
Parameter

MSB

LSB

AC1

0xAA

0xAB

AC2

0xAC

0xAD

AC3

0xAE

0xAF

AC4

0xB0

0xB1

AC5

0xB2

0xB3

AC6

0xB4

0xB5

B1

0xB6

0xB7

B2

0xB8

0xB9

MB

0xBA

0xBB

MC

0xBC

0xBD

MD

0xBE

0xBF

BST-BMP180-DS000-09 | Revision 2.5 | April 2013
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parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.

Data sheet
BMP180Page 14

3.5 Calculating pressure and temperature
The mode (ultra low power, standard, high, ultra high resolution) can be selected by the variable
oversampling_setting (0, 1, 2, 3) in the C code.
Calculation of true temperature and pressure in steps of 1Pa (= 0.01hPa = 0.01mbar) andtemperature in steps of 0.1°C.
The following figure shows the detailed algorithm for pressure and temperature measurement.
This algorithm is available to customers as reference C source code (“BMP180_ API”) from Bosch
Sensortec and via its sales and distribution partners. Please contact your Bosch Sensortec
representative for details.

BST-BMP180-DS000-09 | Revision 2.5 | April 2013
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parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.

Data sheet
BMP180Page 15

Figure 4: Algorithm for pressure and temperature measurement

BST-BMP180-DS000-09 | Revision 2.5 | April 2013
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parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.

Data sheet
BMP180Page 16

3.6 Calculating absolute altitude
With the measured pressure p and the pressure at sea level p0 e.g. 1013.25hPa, the altitude inmeters can be calculated with the international barometric formula:1  p  5.255 
altitude  44330 *  1 -    p0 




9000
8000
7000
6000
5000
4000
3000
2000
1000
0
-1000

11
00

10
00

90
0

80
0

70
0

60
0

50
0

Altitude in standard
atmosphere

40
0

30
0

Altitude above sea level [m]Thus, a pressure change of ∆p = 1hPa corresponds to 8.43m at sea level.

Barometric pressure [hPa]

Figure 5: Transfer function: Altitude over sea level – Barometric pressure

BST-BMP180-DS000-09 | Revision 2.5 | April 2013
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parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.

Data sheet
BMP180Page 17

3.7 Calculating pressure at sea level
With the measured pressure p and the absolute altitude the pressure at sea level can be calculated:p0 p altitude 1 44330 

5.255

Thus, a difference in altitude of ∆altitude = 10m corresponds to 1.2hPa pressure change at sea level.

BST-BMP180-DS000-09 | Revision 2.5 | April 2013
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parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.

Data sheet
BMP180Page 18

4. Global Memory Map
The memory map below shows all externally accessible data registers which are needed to operate
BMP180. The left columns show the memory addresses. The columns in the middle depict thecontent of each register bit. The colors of the bits indicate whether they are read-only, write-only or
read- and writable. The memory is volatile so that the writable content has to be re-written after eachpower-on.
Not all register addresses are shown. These registers are reserved for further Bosch factory testing
and trimming.

Register Name

Register Adress

out_xlsb
out_lsb
out_msb
ctrl_meas
soft resetidcalib21 downto calib0

F8h
F7h
F6h
F4h
E0h
D0h
BFh down to AAh
Registers:

bit7

bit6

bit5

bit4

adc_out_xlsb<7:3>

oss<1:0>

Controlregisters
Type: read / write

Calibration
registers
read only

bit3

bit2

bit1

bit0

Reset state

0

0

0

00h
00h
80h
00h
00h
55h
n/a

adc_out_lsb<7:0>
adc_out_msb<7:0>
scomeasurement control
reset
id<7:0>calib21<7:0> down to calib0<7:0>
Dataregisters
read only

Fixed
read only

Figure 6: Memory map
Measurement control (register F4h <4:0>): Controls measurements. Refer to Figure 6 for usage
details.
Sco (register F4h <5>): Start of conversion. The value of this bit stays “1” during conversion and isreset to “0” after conversion is complete (data registers are filled).
Oss (register F4h <7:6>): controls the oversampling ratio of the pressure measurement (00b: single,
01b: 2 times, 10b: 4 times, 11b: 8 times).
Soft reset (register E0h): Write only register. If set to 0xB6, will perform the same sequence as
power on reset.
Chip-id (register D0h): This value is fixed to 0x55 and can be used to check whether
communication is functioning.
After conversion, data registers can be read out in any sequence (i.e. MSB first or LSB first). Using aburst read is not mandatory.

BST-BMP180-DS000-09 | Revision 2.5 | April 2013
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parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.

Data sheet
BMP180Page 19

5. I2C Interface
 I2C is a digital two wire interface
 Clock frequencies up to 3.4Mbit/sec. (I2C standard, fast and high-speed mode supported) SCL and SDA needs a pull-up resistor, typ. 4.7kOhm to VDDIO(one resistor each for all the I2C bus)
The I2C bus is used to control the sensor, to read calibration data from the E2PROM and to read themeasurement data when A/D conversion is finished. SDA (serial data) and SCL (serial clock) haveopen-drain outputs.
For detailed I2C-bus specification please refer to:
http://www.nxp.com/acrobat_download/literature/9398/39340011.pdf
5.1 I2C specification
Table 6: Electrical parameters for the I2C interface
Parameter

SymbolClock input frequency

fSCL

Input-low level

VIL

Input-high level

VIH

Voltage output low level@ VDDIO = 1.62V, IOL = 3mA

VOL

SDA and SCL pull-up resistor

Rpull-up

SDA sink current@ VDDIO = 1.62V, VOL = 0.3V

ISDA_sink

Start-up time after power-up,
before first communication

tStart

Min.

Typ

Max.

Units

3.4

MHz

0

0.2 * VDDIO

V

0.8 * VDDIO

VDDIO

V

0.3

V

10

kOhm

2.2
9
10

mA
Ms

BST-BMP180-DS000-09 | Revision 2.5 | April 2013
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parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.

Data sheet
BMP180Page 20

5.2 Device and register address
The BMP180 module address is shown below. The LSB of the device address distinguishes
between read (1) and write (0) operation, corresponding to address 0xEF (read) and 0xEE (write).

Table 7: BMP180 addresses
A7
1

A6
1

A5
1

A4
0

A3
1

A2
1

A1
1

W/R
0/1

5.3 I2C protocol
The I2C interface protocol has special bus signal conditions. Start (S), stop (P) and binary data
conditions are shown below. At start condition, SCL is high and SDA has a falling edge. Then theslave address is sent. After the 7 address bits, the direction control bit R/W selects the read or write
operation. When a slave device recognizes that it is being addressed, it should acknowledge bypulling SDA low in the ninth SCL (ACK) cycle.
At stop condition, SCL is also high, but SDA has a rising edge. Data must be held stable at SDA
when SCL is high. Data can change value at SDA only when SCL is low.
Even though VDDIO can be powered on before VDD, there is a chance of excessive power
consumption (a few mA) if this sequence is used, and the state of the output pins is undefined sothat the bus can be locked. Therefore, VDD must be powered before VDDIO unless the limitations
above are understood and not critical.

Figure 7: I2C protocol

BST-BMP180-DS000-09 | Revision 2.5 | April 2013
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parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.

Data sheet
BMP180Page 21

5.4 Start temperature and pressure measurement
The timing diagrams to start the measurement of the temperature value UT and pressure value UP
are shown below. After start condition the master sends the device address write, the register
address and the control register data. The BMP180 sends an acknowledgement (ACKS) every 8
data bits when data is received. The master sends a stop condition after the last ACKS.

Figure 8: Timing diagram for starting pressure measurement

Abbreviations:
S
Start
P
Stop
ACKS
Acknowledge by Slave
ACKM
Acknowledge by Master
NACKM
Not Acknowledge by Master

Table 8: Control registers values for different internal oversampling_setting (oss)Measurement

Control register value(register address 0xF4)

Max. conversion time[ms]

Temperature

0x2E

4.5

Pressure(oss = 0)

0x34

4.5

Pressure(oss = 1)

0x74

7.5

Pressure(oss = 2)

0xB4

13.5

Pressure(oss = 3)

0xF4

25.5

BST-BMP180-DS000-09 | Revision 2.5 | April 2013
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Note: Specifications within this document are subject to change without notice.

Data sheet
BMP180Page 22

5.5 Read A/D conversion result or E2PROM data
To read out the temperature data word UT (16 bit), the pressure data word UP (16 to 19 bit) andthe E2PROM data proceed as follows:
After the start condition the master sends the module address write command and register address.
The register address selects the read register:E2PROM data registers 0xAA to 0xBF
Temperature or pressure value UT or UP 0xF6 (MSB), 0xF7 (LSB), optionally 0xF8 (XLSB)Then the master sends a restart condition followed by the module address read that will beacknowledged by the BMP180 (ACKS). The BMP180 sends first the 8 MSB, acknowledged by themaster (ACKM), then the 8 LSB. The master sends a "not acknowledge" (NACKM) and finally a stop
condition.
Optionally for ultra high resolution, the XLSB register with address 0xF8 can be read to extend the
16 bit word to up to 19 bits; refer to the application programming interface (API) software rev. 1.1(“BMP180_ API”, available from Bosch Sensortec).

SCL
SDA

PR
OM

Module address
write 0xEE
S

Module address
MSB e.g.
LSB e.g.
read
0xEF
ADC
result 0x96
e.g. 0xF6
ADC result 0x5C
NACKM PACKS Restart
ACKS
ACKM

Register address

ACKS

Figure 9: Timing diagram read 16 bit A/D conversion result

BST-BMP180-DS000-09 | Revision 2.5 | April 2013
Bosch Sensortec© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.

Data sheet
BMP180Page 23

6. Package
6.1 Pin configuration
Picture shows the device in top view. Device pins are shown here transparently only for orientation
purposes.

1

7

6

2

5

3

4

Figure 10: Layout pin configuration BMP180

Table 9: Pin configuration BMP180
in No

Name

Function

1

CSB*

Chip select2

VDD

Power supply

3

VDDIO

Digital power supply

4

SDO*

SPI output

5

SCL

I2C serial bus clock input

6

SDA

I2C serial bus data (or SPI input)

7

GND

Ground* A pin compatible product variant with SPI interface is possible upon customer’s request. For I2C(standard case) CSB and SDO are not used, they have to be left open.
All pins have to be soldered to the PCB for symmetrical stress input even though they are notconnected internally.

BST-BMP180-DS000-09 | Revision 2.5 | April 2013
Bosch Sensortec© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.

Data sheet
BMP180Page 24

6.2 Outline dimensions
The sensor housing is a 7Pin LGA package with metal lid. Its dimensions are 3.60mm (±0.1 mm) x
3.80mm (±0.1 mm) x 0.93mm (±0.07 mm).
Note: All dimensions are in mm.
6.2.1 Bottom view

0,50

0,60

Figure 11: Bottom view BMP180

BST-BMP180-DS000-09 | Revision 2.5 | April 2013
Bosch Sensortec© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.

Data sheet
BMP180Page 25

6.2.2 Top view

Figure 12: Top view BMP180
6.2.3 Side view

Figure 13: Side view BMP180

BST-BMP180-DS000-09 | Revision 2.5 | April 2013
Bosch Sensortec© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.

Data sheet
BMP180Page 26

6.3 Moisture sensitivity level and soldering
The BMP180 is classified MSL 1 (moisture sensitivity level) according to IPC/JEDEC standards JSTD-020D and J-STD-033A.
The device can be soldered Pb-free with a peak temperature of 260°C for 20 to 40 sec. The
minimum height of the solder after reflow shall be at least 50µm. This is required for goodmechanical decoupling between the sensor device and the printed circuit board (PCB).
To ensure good solder-ability, the devices shall be stored at room temperature (20°C).
The soldering process can lead to an offset shift.

6.4 RoHS compliancy
The BMP180 sensor meets the requirements of the EC directive "Restriction of hazardous
substances (RoHS)", please refer also to:"Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the
restriction of the use of certain hazardous substances in electrical and electronic equipment".
The BMP180 sensor is also halogen-free.

6.5 Mounting and assembly recommendations
In order to achieve the specified performance for you design, the following recommendations and the“Handling, soldering & mounting instructions BMP180” should be taken into consideration when
mounting a pressure sensor on a printed-circuit board (PCB):The clearance above the metal lid shall be 0.1mm at minimum.

For the device housing appropriate venting needs to be provided in case the ambientpressure shall be measured.



Liquids shall not come into direct contact with the device.



During operation the sensor is sensitive to light, which can influence the accuracy of themeasurement (photo-current of silicon).



The BMP180 shall not the placed close the fast heating parts. In case of gradients > 3°C/sec.
it is recommended to follow Bosch Sensortec application note ANP015, "Correction of errors
induced by fast temperature changes". Please contact your Bosch Sensortec representativefor details.

BST-BMP180-DS000-09 | Revision 2.5 | April 2013
Bosch Sensortec© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.

Data sheet
BMP180Page 27

7. Legal disclaimer
7.1 Engineering samples
Engineering Samples are marked with an asterisk (*) or (e). Samples may vary from the valid
technical specifications of the product series contained in this data sheet. They are therefore notintended or fit for resale to third parties or for use in end products. Their sole purpose is internalclient testing. The testing of an engineering sample may in no way replace the testing of a productseries. Bosch Sensortec assumes no liability for the use of engineering samples. The Purchaser
shall indemnify Bosch Sensortec from all claims arising from the use of engineering samples.
7.2 Product use
Bosch Sensortec products are developed for the consumer goods industry. They may only be usedwithin the parameters of this product data sheet. They are not fit for use in life-sustaining or security
sensitive systems. Security sensitive systems are those for which a malfunction is expected to leadto bodily harm or significant property damage. In addition, they are not fit for use in products whichinteract with motor vehicle systems.
The resale and/or use of products are at the purchaser’s own risk and his own responsibility. The
examination of fitness for the intended use is the sole responsibility of the Purchaser.
The purchaser shall indemnify Bosch Sensortec from all third party claims arising from any productuse not covered by the parameters of this product data sheet or not approved by Bosch Sensortec
and reimburse Bosch Sensortec for all costs in connection with such claims.
The purchaser must monitor the market for the purchased products, particularly with regard to
product safety, and inform Bosch Sensortec without delay of all security relevant incidents.
7.3 Application examples and hints
With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Bosch Sensortec hereby disclaims any and all
warranties and liabilities of any kind, including without limitation warranties of non-infringement ofintellectual property rights or copyrights of any third party. The information given in this document
shall in no event be regarded as a guarantee of conditions or characteristics. They are provided forillustrative purposes only and no evaluation regarding infringement of intellectual property rights or
copyrights or regarding functionality, performance or error has been made.

BST-BMP180-DS000-09 | Revision 2.5 | April 2013
Bosch Sensortec© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.

Data sheet
BMP180Page 28

8. Document history and modificationRev. No Chapter Description of modifications/changes
DateFirst edition for description of serial production material
1.0– Preliminary version
1.1
5.1
New nomenclature of pin configuration
27 July 2010
1.2
5
Design change in package – hole in Lid and without slit 13 September 2010
- Standardizing pin naming over Bosch Sensortec
3.2
1.3
products – typical application circuit
15 December 2010
5.1
- Optimizing pin description, SPI description- Non-preliminary version
2.0
1
28 January 2011
- Verifying parameter through characterization
3.2- Declaration of SDO and CSB pins in the typicalapplication circuit4- Adding global memory map and bits description
2.1
1 April 2011
5.3
- Power-up sequence
6.1- Description of used interfaces
6.2.1- Dimension pin7
2.2
6.1
Correction of the pin configuration (editorial change)
14 April 2011
2.3
3.3
Optimizing noise performance
25 May 2011
6.3
Removed shelf-life constraints
page 2 Comparison removed
2.4
26 January 2012
5.1
Voltage output low level added
5.3
Power on sequence of VDD and VDDIO defined
Added max values for supply current for restricted
1
15 Feb 2013
version
Added max value for standby current for restricted1
version
2.5
Update of calculation of algorithm for pressure andFigure 4
5 Apr 2013
temperature measurement
Changed wording from “ultra high resolution mode” toPage 2“advanced resolution mode”

Bosch Sensortec GmbHGerhard-Kindler-Strasse 872770 Reutlingen / Germany
contact@bosch-sensortec.com
www.bosch-sensortec.com
Modifications reserved | Printed in Germany
Specifications are subject to change without notice
Revision_2.5_042013
Document number: BST-BMP180-DS000-09

BST-BMP180-DS000-09 | Revision 2.5 | April 2013
Bosch Sensortec© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.