Introduction to the High Integration Composite MEMS Fabrication Technology (Fine MEMS) Development Project
MEMS gained through this research and development,and establishing a knowledge database to make it
widely available to Japanese industry.

1. Development aims
In recent years, MEMS (Micro Electro
Mechanical Systems) technology has contributed
significantly to miniaturizing and increasing theperformance of electronic equipment andcomponents, and they are expected to become key
devices in a range of fields such as telecoms,
medicine, biotechnology, and automobiles amongothers. In the new industrial strategy produced bythe Ministry of Economy, Trade and Industry in
FY05, and in the strategy for new economic growthissued in FY06, MEMS are positioned as one of thehigh-level component industries on which toconcentrate. Due to the necessity of reinforcing
Japan’s competitiveness in MEMS, which areexpected to see growth internationally too, thestrategy aims to achieve greater miniaturization,
power saving, higher performance, and higher
reliability through further improvements in MEMS
fabrication technology. The High Integration
Composite MEMS Fabrication Technology Project
was planned to address the important technicalissues of combining MEMS with nano-functions,integration with semiconductors, and bonding
between MEMS.

3. Period and scale of the Project
The Project will run for three years from FY2006 toFY2008, and yen 1.1 billion is budgeted for FY2006.
4. Development organizations and theapproach of the Micromachine Center
Eight corporations have been selected forsubsidized projects and eight organizations(universities and national research institutions) havebeen selected for mandated projects. The
Micromachine Center has been entrusted with 4)
Establishment of a database of high integration
composite MEMS knowledge.
The knowledge database must cover all the issues
involved in high integration composite MEMS
fabrication technologies, and therefore a fine MEMS
knowledge database committee will be organized tostrengthen cooperation within the Project to enable theresearch data from all the corporations and bodies
participating in the Project to be collected. Besides
considering effective means of allowing eachresearcher to enter knowledge easily, the Project will
invite university researchers with superior knowledgeof the relevant issue to supplement the knowledge data
relating to the subsidized project themes in particular.
In addition, the Micromachine Center will provide
management support for the Project overall. As
described above, the Project is a composite projectcomprising a number of issues and themes, involving
mandated and subsidized programs, therefore it will benecessary to carry out efficient management ofprogress and of the necessary liaison within andbetween the disciplines, and to provide a suitableenvironment for industrialization at the latter stage.
With this objective, a project liaison committee will beestablished for organizing periodic consultations andcoordination. The Micromachine Center will be
responsible for this role and, under the guidance of theProject Leader, the Center will take an active approachwith the aim of maximizing the results of the Project.

2. Project overview
The research and development issues are;1) MEMS/nano-function composite technology, 2)
MEMS/semiconductor integrated fabrication
technology, 3) MEMS/MEMS high integration
composite technology, 4) Establishment of adatabase of high integration composite MEMS
knowledge
In particular, issues 1) to 3) each consist basically offour technology themes as shown in Table 1. Eachtheme comprises technologically difficult aspects, andfactors linking them to industrial production.
Technologically sophisticated aspects will be mandated
to universities and national research institutions, whiledevelopment of applications will be conducted bycorporations under subsidies. Theme 4) involves
gathering technical knowledge and internal andexternal approaches to high integration composite
NEDO R&D Organization

Instructions & discussion

Fine MEMS Project Liaison Committee
Chairman: Prof. Shimoyama, Tokyo Univ.

Subsidized

MEMS - Nano

Fine MEMS Knowledge
DB Committee

MandatedCorporations

The University of Tokyo

Nanomachinery structures: Structure as minute as size of wavelength of light•

Selective biomodification: Biomimetic sensing•Selective nanomaterial modification : CNT etc.

•Nanofunction devices: Nanomodication device technology•

Monolithic process integration: CMOS integrated MEMS

New sensor principles: Through miniaturization of semiconductor sensors etc.

Vertical wiring: Leading-edge CMOS and MEMS multilayer fine-pitch wiring

Interposer: In-board Y-branch

Horizontal wiring: Leading edge CMOS and MEMS horizontal fine-pitch wiring

High-density, 3D surface wiring: High-density wiring including vertical step edges etc.

AISTHigh density packaging:High density packaging using self-organization

Tohoku University••AISTAIST
Mitsubishi Electric Corporation•

Hitachi, Ltd.

•Ritsumeikan University•Omron Corporation

Monolithic integration
High integration MEMS
analysis methods
High integration wiringtechnology

Fujikura Ltd.

•Multilayer integration of dissimilar materials : High precision Z direction assembly of wafers•

Multilayer build-up integration•Low stress dicing

MEMS - MEMS

Mandated

Fine MEMS Knowledge DB(Micromachine Center)

Universities &Natl. Research Institutes•MEMS Semiconductor

Admin. Office
Micromachine Center

Toshiba Corporation

Olympus Corporation: Adding manufacturing processes to sequential bonding Matsushita Electric Works, Ltd.

•Multilayer bonding technology•Multilayer integration technology

High-precision light chip integration : High precision incorporation of optical semiconductors in MEMS Yokogawa Electric Corporation
Osaka UniversityTohoku University: Multilayer dissimilar material wafers

High Integration Composite MEMS Fabrication Technology Development Project: Development Issues and Organization

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