InvenSense Inc.
1197 Borregas Ave, Sunnyvale, CA 94089 U.S.A.
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104
Website: www.invensense.com

Document Number: PS-MPU-6000A-00
Revision: 1.0
Release Date: 11/24/2010

MPU-6000 and MPU-6050
Product Specification
Revision 1.0

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MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 1.0
Release Date: 11/24/2010

CONTENTS
1REVISION HISTORY ...................................................................................................................................52

PURPOSE AND SCOPE .............................................................................................................................6

3

PRODUCT OVERVIEW ...............................................................................................................................64

APPLICATIONS...........................................................................................................................................7

5

FEATURES ..................................................................................................................................................8

6

7

5.1

GYROSCOPE FEATURES .......................................................................................................................8

5.2

ACCELEROMETER FEATURES ...............................................................................................................8

5.3

ADDITIONAL FEATURES ........................................................................................................................8

5.4

MOTION PROCESSING ..........................................................................................................................9

5.5

CLOCKING ...........................................................................................................................................9

ELECTRICAL CHARACTERISTICS .........................................................................................................10
6.1

GYROSCOPE SPECIFICATIONS ............................................................................................................10

6.2

ACCELEROMETER SPECIFICATIONS .....................................................................................................11

6.3

ELECTRICAL AND OTHER COMMON SPECIFICATIONS............................................................................12

6.4

ELECTRICAL SPECIFICATIONS, CONTINUED .........................................................................................13

6.5

ELECTRICAL SPECIFICATIONS, CONTINUED .........................................................................................14

6.6

ELECTRICAL SPECIFICATIONS, CONTINUED .........................................................................................15

6.7

I2C TIMING CHARACTERIZATION..........................................................................................................16

6.8

SPI TIMING CHARACTERIZATION (MPU-6000 ONLY) ...........................................................................17

6.9

ABSOLUTE MAXIMUM RATINGS ...........................................................................................................18

APPLICATIONS INFORMATION ..............................................................................................................19
7.1

PIN OUT AND SIGNAL DESCRIPTION ....................................................................................................19

7.2

TYPICAL OPERATING CIRCUIT.............................................................................................................20

7.3

BILL OF MATERIALS FOR EXTERNAL COMPONENTS ..............................................................................20

7.4

RECOMMENDED POWER-ON PROCEDURE ...........................................................................................21

7.5

BLOCK DIAGRAM ...............................................................................................................................22

7.6

OVERVIEW ........................................................................................................................................22

7.7

THREE-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING ................................23

7.8

THREE-AXIS MEMS ACCELEROMETER WITH 16-BIT ADCS AND SIGNAL CONDITIONING ........................23

7.9

DIGITAL MOTION PROCESSOR ............................................................................................................23

7.10

PRIMARY I2C AND SPI SERIAL COMMUNICATIONS INTERFACES ............................................................23

7.11

AUXILIARY I2C SERIAL INTERFACE ......................................................................................................24

7.12

SELF-TEST ........................................................................................................................................24

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Document Number: PS-MPU-6000A-00
Revision: 1.0
Release Date: 11/24/2010

7.13

MPU-60X0 SOLUTION FOR 9-AXIS SENSOR FUSION USING I2C INTERFACE ..........................................25

7.14

MPU-6000 USING SPI INTERFACE .....................................................................................................26

PROGRAMMABLE INTERRUPTS............................................................................................................27
8.1

FREE FALL, MOTION, AND ZERO MOTION SIGNAL PATHS .....................................................................28

8.2

FREE FALL INTERRUPT .......................................................................................................................28

8.3

MOTION INTERRUPT ...........................................................................................................................28

8.4

ZERO MOTION INTERRUPT..................................................................................................................29

CLOCKING ................................................................................................................................................30
9.1

INTERNAL CLOCK GENERATION ..........................................................................................................30

9.2

SENSOR DATA REGISTERS .................................................................................................................30

9.3

FIFO ................................................................................................................................................30

9.4

INTERRUPTS ......................................................................................................................................30

9.5

DIGITAL-OUTPUT TEMPERATURE SENSOR ..........................................................................................31

9.6

BIAS AND LDO ..................................................................................................................................31

9.7

CHARGE PUMP ..................................................................................................................................31

10 DIGITAL INTERFACE ...............................................................................................................................32
10.1

I2C AND SPI (MPU-6000 ONLY) SERIAL INTERFACES ..........................................................................32

10.2

I2C INTERFACE ..................................................................................................................................32

10.3

I2C COMMUNICATIONS PROTOCOL ......................................................................................................32

10.4

I2C TERMS ........................................................................................................................................35

10.5

SPI INTERFACE (MPU-6000 ONLY) ....................................................................................................36

11 SERIAL INTERFACE CONSIDERATIONS (MPU-6050) ..........................................................................37
11.1

MPU-6050 SUPPORTED INTERFACES .................................................................................................37

11.2

LOGIC LEVELS ...................................................................................................................................37

11.3

LOGIC LEVELS DIAGRAM FOR AUX_VDDIO = 0 ..................................................................................38

11.4

LOGIC LEVELS DIAGRAM FOR AUX_VDDIO = 1 ..................................................................................39

12 ASSEMBLY ...............................................................................................................................................40
12.1

ORIENTATION OF AXES ......................................................................................................................40

12.2

PACKAGE DIMENSIONS ......................................................................................................................41

12.3

PCB DESIGN GUIDELINES: .................................................................................................................42

12.4

ASSEMBLY PRECAUTIONS ..................................................................................................................43

12.4.1GYROSCOPE SURFACE MOUNT GUIDELINES ...................................................................................43

12.4.2EXPOSED DIE PAD PRECAUTIONS ..................................................................................................43

12.4.3

TRACE ROUTING ...........................................................................................................................44

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Document Number: PS-MPU-6000A-00
Revision: 1.0
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12.4.4COMPONENT PLACEMENT ..............................................................................................................44

12.4.5PCB MOUNTING AND CROSS-AXIS SENSITIVITY ..............................................................................44

12.4.6MEMS HANDLING INSTRUCTIONS ..................................................................................................45

12.4.7ESD CONSIDERATIONS .................................................................................................................45

12.4.8REFLOW SPECIFICATION ................................................................................................................45

12.4.9

STORAGE SPECIFICATIONS ............................................................................................................47

12.4.10GYRO REMOVAL FROM PCB ..........................................................................................................47

12.5

PACKAGE MARKING SPECIFICATION ....................................................................................................47

12.6

TAPE & REEL SPECIFICATION .............................................................................................................48

12.7

LABEL ...............................................................................................................................................50

12.8

PACKAGING .......................................................................................................................................50

13 RELIABILITY .............................................................................................................................................51
13.1

QUALIFICATION TEST POLICY .............................................................................................................51

13.2

QUALIFICATION TEST PLAN ................................................................................................................51

14 ENVIRONMENTAL COMPLIANCE...........................................................................................................52

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MPU-6000/MPU-6050 Product Specification

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Document Number: PS-MPU-6000A-00
Revision: 1.0
Release Date: 11/24/2010

Revision History

Revision
Date

Revision

11/24/2010

1.0

Description
First revision of MPU-60X0 Product Specification

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MPU-6000/MPU-6050 Product Specification

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Document Number: PS-MPU-6000A-00
Revision: 1.0
Release Date: 11/24/2010

Purpose and Scope

This product specification provides preliminary information regarding the electrical specification and design
related information for the MPU-6000™ and MPU-6050™, collectively called the MPU-60X0™ or MPU™.
Electrical characteristics are based upon design analysis and simulation results only. Specifications are
subject to change without notice. Final specifications will be updated based upon characterization of
production silicon. For references to register map and descriptions of individual registers, please refer to
MPU-6000 Register Map and Descriptions document.

3

Product Overview

The MPU-60X0 Motion Processing Unit (MPU™) is the world’s first motion processing solution withintegrated 9-axis sensor fusion for handset and tablet applications, game controllers, motion pointer remotecontrols, and other consumer devices. The MPU-60X0 has an embedded 3-axis MEMS gyroscope, 3-axis
MEMS accelerometer and Digital Motion Processor™ (DMP) hardware accelerator engine with an auxiliary
I2C port that interfaces to third party digital sensors, such as magnetometers. Interfacing with a 3-axis
magnetometer delivers a complete 9-axis sensor fusion output to the MPU’s primary I2C or SPI port. (SPI isavailable on MPU-6000 only). This combines acceleration and rotational motion plus heading information intoa single data stream for the application. This motion processing technology integration provides a smaller
footprint and has inherent cost advantages compared to discrete gyroscope plus accelerometer solutions.
The MPU-60X0 is also designed to interface with multiple non-inertial digital sensors, such as pressure
sensors, on its auxiliary I2C port. The MPU-60X0 is a second generation motion processor and is footprintcompatible with the MPU-30X0 family.
The MPU-60X0 features three 16-bit analog-to-digital converters (ADCs) for digitizing the gyroscope outputs
and three 16-bit ADCs for digitizing the accelerometer outputs. For precision tracking of both fast and slow
motions, the parts feature a user-programmable gyroscope full-scale range of ±250, ±500, ±1000, and±2000°/sec (dps) and a user-programmable accelerometer full-scale range of ±2g, ±4g, ±8g, and ±16g.
An on-chip 1024 Byte FIFO helps lower system power consumption by allowing the system processor toread the sensor data in bursts and then enter a low-power mode as the FIFO collects more data. With all thenecessary on-chip processing and sensor components required to support many motion-based use cases,
the MPU-60X0 uniquely supports a variety of advanced motion-based applications entirely on-chip andtherefore is instrumental in enabling low-power motion processing in portable applications with reduced
processing requirements for the system processor. By providing an integrated sensor fusion output, the DMP
in the MPU-60X0 offloads the intensive motion processing computation requirements from the systemprocessor, minimizing the need for frequent polling of the motion sensor output.
Communication with all registers of the device is performed using either I2C at 400kHz or SPI at 1MHz(MPU-6000 only). For applications requiring faster communications, reading of the sensor and interrupt
registers may be performed using SPI at 20MHz (MPU-6000 only). Additional features include an embedded
temperature sensor and an on-chip oscillator with ±1% variation over the operating temperature range.
By leveraging its patented and volume-proven Nasiri-Fabrication platform, which integrates MEMS wafers
with companion CMOS electronics through wafer-level bonding, InvenSense has driven the MPU-60X0
package size down to a revolutionary footprint of 4x4x0.9mm (QFN), while providing the highest
performance, lowest noise, and the lowest cost semiconductor packaging required for handheld consumer
electronic devices. The part features a robust 10,000g shock tolerance, and has programmable low-passfilters for the gyroscopes, accelerometers, and the on-chip temperature sensor.
For power supply flexibility, the MPU-60X0 operates from VDD power supply voltages of 2.5V±5%, 3.0V±5%,
or 3.3V±5%. Additionally, the MPU-6050 provides a VLOGIC reference pin (in addition to its analog supply
pin, VDD), which sets the logic levels of its I2C interface. The VLOGIC voltage may be 1.8V±5% or VDD.

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MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 1.0
Release Date: 11/24/2010

The MPU-6000 and MPU-6050 are identical, except that the MPU-6050 supports the I2C serial interface only,
and has a separate VLOGIC reference pin. The MPU-6000 supports both I2C and SPI interfaces and has asingle supply pin, VDD, which is both the device’s logic reference supply and the analog supply for the part.
The table below outlines these differences:
Primary Differences between MPU-6000 and MPU-6050
Part / ItemVDD
VLOGIC
Serial Interfaces Supported
Pin 8
Pin 9
Pin 23
Pin 24

4













MPU-6000
2.5V±5%, 3.0V±5%, or
3.3V±5%.
n/a
I2C, SPI/CS
AD0/SDO
SCL/SCLK
SDA/SDI

MPU-6050
2.5V±5%, 3.0V±5%, or
3.3V±5%.
1.71V to VDD
I2C
VLOGICAD0SCL
SDA

Applications
BlurFree™ technology (for Video/Still Image Stabilization)
AirSign™ technology (for Security/Authentication)
TouchAnywhere™ technology (for “no touch” UI Application Control/Navigation)
MotionCommand™ technology (for Gesture Short-cuts)
Motion-enabled game and application framework
InstantGesture™ iG™ gesture recognition
Location based services, points of interest, and dead reckoning
Handset and portable gaming
Motion-based game controllers
3D remote controls for Internet connected DTVs and set top boxes, 3D mice
Wearable sensors for health, fitness and sports
Toys

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5
5.1

Document Number: PS-MPU-6000A-00
Revision: 1.0
Release Date: 11/24/2010

Features
Gyroscope Features

The triple-axis MEMS gyroscope in the MPU-60X0 includes a wide range of features:











Digital-output X-, Y-, and Z-Axis angular rate sensors (gyroscopes) with a user-programmable fullscale range of ±250, ±500, ±1000, and ±2000°/sec
External sync signal connected to the FSYNC pin supports image, video and GPS synchronization
Integrated 16-bit ADCs provide simultaneous sampling of gyros
Enhanced bias and sensitivity temperature stability reduces the need for user calibration
Improved low-frequency noise performance
Digitally-programmable low-pass filter
Gyroscope operating current: 5mA
Standby current: 5µA
Factory calibrated sensitivity scale factor
User self-test
5.2

Accelerometer Features

The triple-axis MEMS accelerometer in MPU-60X0 includes a wide range of features:












Digital-output tri-axis accelerometer with a programmable full scale range of ±2g, ±4g, ±8g and ±16g
Integrated 16-bit ADCs provide simultaneous sampling of accelerometers while requiring no external
multiplexer
Accel normal operating current: 500µA
Low power accelerometer mode current: 40µA at 10 Hz
Orientation detection and signaling
Tap detection
User-programmable interrupts
Free-fall interrupt
High-G interrupt
Zero-motion/Motion interrupt
User self test
5.3

Additional Features

The MPU-60X0 includes the following additional features:













9-Axis sensor fusion via on-chip Digital Motion Processor (DMP)
Auxiliary master I2C bus for reading data from external sensors (e.g., magnetometer)
5.5mA operating current for all 6 axes
VDD supply voltages of 2.5V±5%, 3.0V±5%, 3.3V±5%
Flexible VLOGIC reference voltage allows for multiple I2C interface voltages (MPU-6050 only)
Smallest and thinnest package for portable devices: 4x4x0.9mm QFN
Minimal cross-axis sensitivity between the accelerometer and gyroscope axes
1024 byte FIFO reduces power consumption by allowing host processor to read the data in bursts
and then go into a low-power mode as the FIFO collects more data
Digital-output temperature sensor
User-programmable digital filters for gyroscope, accelerometer, and temp sensor
10,000 g shock tolerant
400kHz Fast Mode I2C for communicating with all registers

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MPU-6000/MPU-6050 Product Specification





5.4

Document Number: PS-MPU-6000A-00
Revision: 1.0
Release Date: 11/24/2010

1MHz SPI serial interface for communicating with all registers (MPU-6000 only)
20MHz SPI serial interface for reading of sensor and interrupt registers (MPU-6000 only)
MEMS structure hermetically sealed and bonded at wafer level
RoHS and Green compliant
Motion Processing









5.5

Internal Digital Motion Processing™ (DMP™) engine supports 3D motion processing and gesturerecognition algorithms
MPU-60X0 collects the gyroscope and accelerometer data while synchronizing data sampling at auser defined rate. The total data set obtained by the MPU-60X0 includes 3-axis gyroscope data and3-axis accelerometer data, and temperature data. The MPU calculated output can also include
compass data from a digital 3-axis third party magnetometer.
FIFO buffers the complete data set, reducing timing requirements on the system processor andsaving power by letting the processor burst read the FIFO data, and then enter a low-power sleep
mode while the MPU collects more data.
Programmable interrupt supports features such as gesture recognition, panning, zooming, scrolling,zero-motion detection, tap detection, and shake detection
Programmable low-pass filters.
Low-power pedometer functionality allows the host processor to sleep while the DMP maintains thestep count.
ClockingOn-chip timing generator ±1% frequency variation over full temperature range
Optional external clock inputs of 32.768kHz or 19.2MHz

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Document Number: PS-MPU-6000A-00
Revision: 1.0
Release Date: 11/24/2010

MPU-6000/MPU-6050 Product Specification

6
6.1

Electrical Characteristics
Gyroscope Specifications

VDD = 2.5V±5%, 3.0V±5%, or 3.3V±5%, VLOGIC (MPU-6050 only) = 1.8V±5% or VDD, TA = 25°C
PARAMETERGYROSCOPE SENSITIVITY
Full-Scale Range

Gyroscope ADC Word Length
Sensitivity Scale Factor

Sensitivity Scale Factor Tolerance
Sensitivity Scale Factor Variation Over
Temperature
Nonlinearity
Cross-Axis Sensitivity
GYROSCOPE ZERO-RATE OUTPUT (ZRO)
Initial ZRO Tolerance
ZRO Variation Over TemperaturePower-Supply Sensitivity (1-10Hz)
Power-Supply Sensitivity (10 - 250Hz)
Power-Supply Sensitivity (250Hz - 100kHz)
Linear Acceleration Sensitivity
GYROSCOPE NOISE PERFORMANCE
Total RMS Noise
Low-frequency RMS noise
Rate Noise Spectral Density

CONDITIONSMIN

FS_SEL=3
FS_SEL=2
FS_SEL=1
FS_SEL=0

TYP

MAX

±2000
±1000
±500
±250
16
131
65.5
32.8
16.4

UNITS

±2

º/s
º/s
º/s
º/s
Bits
LSB/(º/s)
LSB/(º/s)
LSB/(º/s)
LSB/(º/s)%%

Best fit straight line; 25°C

0.2
±2

%
%

25°C
-40°C to +85°C
Sine wave, 100mVpp; VDD=2.5V
Sine wave, 100mVpp; VDD=2.5V
Sine wave, 100mVpp; VDD=2.5V
Static
FS_SEL=0
DLPFCFG=2 (100Hz)
Bandwidth 1Hz to10Hz
At 10Hz

±20
±20
0.2
0.2
4
0.1

º/s
º/s
º/s
º/s
º/s
º/s/g

0.05
0.033
0.005

º/s-rmsº/s-rms

FS_SEL=0
FS_SEL=1
FS_SEL=2
FS_SEL=325°C-3GYROSCOPE MECHANICALFREQUENCIES
X-AxisY-AxisZ-AxisSELF TEST RESPONSE

30
27
24
X, Y, and Z axes

+3

33
30
27

º/s/√Hz

36
33
30

50

kHz
kHz
kHz
º/s

OUTPUT DATA RATEGYROSCOPE START-UP TIMEZRO Settling

Programmable
DLPFCFG=0
to ±1º/s of Final

4

8,000
30

10 of 53

Hz
ms

NOTES

Document Number: PS-MPU-6000A-00
Revision: 1.0
Release Date: 11/24/2010

MPU-6000/MPU-6050 Product Specification

6.2

Accelerometer Specifications

VDD = 2.5V±5%, 3.0V±5%, or 3.3V±5%, VLOGIC (MPU-6050 only) = 1.8V±5% or VDD, TA = 25°C
PARAMETERACCELEROMETER SENSITIVITY
Full-Scale Range

ADC Word Length
Sensitivity Scale Factor

Initial Calibration Tolerance
Sensitivity Change vs. Temperature
Nonlinearity
Cross-Axis Sensitivity
ZERO-G OUTPUT
Initial Calibration Tolerance
Zero-G Level Change vs. Temperature
SELF TEST RESPONSE
NOISE PERFORMANCEPower Spectral Density

CONDITIONS

MIN±2g mode±4g mode±8g mode±16g mode
Output in two’s complement format±2g mode±4g mode±8g mode±16g mode

TYP

MAX

UNITS

±2
±4
±8
±16
16
0.06
0.12
0.24
0.49
±3
±0.02
0.5
±2

g
g
g
g
Bits
mg/LSB
mg/LSB
mg/LSB
mg/LSB
%
%/°C
%
%

±50
±1

mg
mg/°C

X, Y, and Z axes

0.5

g

@10Hz

350

g/√Hz(±2g)
Best Fit Straight LineLOW PASS FILTER RESPONSE
Programmable Range

5

250

Hz

Programmable Range

4

1,000

Hz

OUTPUT DATA RATE

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NOTESMPU-6000/MPU-6050 Product Specification

6.3

Document Number: PS-MPU-6000A-00
Revision: 1.0
Release Date: 11/24/2010

Electrical and Other Common Specifications

VDD = 2.5V±5%, 3.0V±5%, or 3.3V±5%, VLOGIC (MPU-6050 only) = 1.8V±5% or VDD, TA = 25°C
PARAMETERVDD POWER SUPPLY
Operating Voltages

CONDITIONSNormal Operating Current

Gyroscope + Accelerometer + DMP
Gyroscope + DMP(Accelerometer disabled)
Accelerometer only
(DMP & Gyroscope disabled)
10Hz update rate

Accelerometer Low Power Mode
Current
Full-Chip Idle Mode Supply Current
Power Supply Ramp RateVLOGIC REFERENCE VOLTAGE
Voltage Range
Power Supply Ramp Rate
Normal Operating Current
START-UP TIME FOR REGISTER
READ/WRITETEMPERATURE RANGE
Specified Temperature Range

SERIAL INTERFACESPI Operating Frequency, All
Registers Read/Write

SPI Operating Frequency, Sensor
and Interrupt Registers Read Only2
I C Operating Frequency

MIN

TYP

MAX

2.5±5%
3.0±5%
3.3±5%
5.5
5.0

V
V
V
mA
mA

500

µA

40

µA

5
Monotonic ramp. Ramp rate is 10%
to 90% of the final value
MPU-6050 only
VLOGIC must be ≤VDD at all times

1.71

Monotonic ramp. Ramp rate is 10%
to 90% of the final value
100
20

Performance parameters are notapplicable beyond Specified
Temperature Range
MPU-6000 only, Low Speed
Characterization
MPU-6000 only, High Speed
Characterization
MPU-6000 only
All registers, Fast-mode
All registers, Standard-mode

-40

100

µA
ms

VDD

V

3

ms

100

µA
ms

+85

°C

100 ±10%kHz

1 ±10%

MHz

20 ±10%

MHz
400
100

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Units

kHz
kHz

Notes

MPU-6000/MPU-6050 Product Specification

6.4

Document Number: PS-MPU-6000A-00
Revision: 1.0
Release Date: 11/24/2010

Electrical Specifications, Continued

VDD = 2.5V±5%, 3.0V±5%, or 3.3V±5%, VLOGIC (MPU-6050 only) = 1.8V±5% or VDD, TA = 25°C
PARAMETERTEMPERATURE SENSOR
Range
Sensitivity
Temperature Offset
Linearity
2

I C ADDRESSCONDITIONS

MIN

TYP

MAX

-40 to +85
325
-3079
±1

Untrimmedo
35 C
Best fit straight line (-40°C to+85°C)
AD0 = 0AD0 = 1Units
°C
LSB/ºC
LSB°C

1101000
1101001

DIGITAL INPUTS (SDI/SDA,
SDO/AD0, SCLK/SCL, FSYNC,/CS, CLKIN)
VIH, High Level Input Voltage
VIL, Low Level Input Voltage

MPU-6000
MPU-6050
MPU-6000

0.7*VDD
0.7*VLOGIC
0.3*VDD

MPU-6050

0.3*VLOGIC

CI, Input Capacitance
DIGITAL OUTPUT (INT)
VOH, High Level Output Voltage

VOL1, LOW-Level Output Voltage

<5

V
V
V
V
pF

RLOAD=1MΩ; MPU-6000

0.9*VDDV

RLOAD=1MΩ; MPU-6050

0.9*VLOGICV

RLOAD=1MΩ; MPU-6000

0.1*VDDV

RLOAD=1MΩ; MPU-6050

0.1*VLOGIC

V

0.1

V

Output Leakage Current

OPEN=1, 0.3mA sink
Current
OPEN=1

100

nA

tINT, INT Pulse Width

LATCH_INT_EN=050µsVOL.INT1, INT Low-Level Output
Voltage

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Notes

MPU-6000/MPU-6050 Product Specification

6.5

Document Number: PS-MPU-6000A-00
Revision: 1.0
Release Date: 11/24/2010

Electrical Specifications, Continued

Typical Operating Circuit of Section 7.2, VDD = 2.5V±5%, 3.0V±5%, or 3.3V±5%, VLOGIC (MPU-6050 only)= 1.8V±5% or VDD, TA = 25°C
Parameters

Conditions

TypicalUnits-0.5 to 0.3*VDD
0.7*VDD to VDD + 0.5V
0.1*VDD-0.5V to 0.3*VLOGIC
0.7*VLOGIC to VLOGIC + 0.5V
0.1*VLOGIC
0 to 0.4
35
100
20+0.1Cb to 250
< 10

V
V
V
V
V
V
V
mA
mA
nA
ns
pF

-0.5V to 0.3*VLOGIC
0.7*VLOGIC to
VLOGIC + 0.5V
0.1*VLOGIC
0 to 0.4
0 to 0.2*VLOGIC
1
1

V
V
V
V
V
mA
mA

100
20+0.1Cb to 250
< 10

nA
ns
pF

-0.5 to 0.3*VDD
0.7*VDD to VDD+0.5V
0.1*VDD
0 to 0.4
1
1

V
V
V
V
mA
mA

100
20+0.1Cb to 250
< 10

nA
ns
pF

2

Primary I C I/O (SCL, SDA)
VIL, LOW-Level Input Voltage
VIH, HIGH-Level Input Voltage
Vhys, Hysteresis
VIL, LOW Level Input Voltage
VIH, HIGH-Level Input Voltage
Vhys, Hystere sis
VOL1, LOW-Level Output Voltage
IOL, LOW-Level Output Current
Output Leakage Current
tof, Output Fall Time from VIHmax to VILmax
CI, Capacitance for Each I/O pin
2

Auxiliary I C I/O (AUX_CL, AUX_DA)
VIL, LOW-Level Input Voltage
VIH, HIGH-Level Input Voltage
Vhys, Hysteresis
VOL1, LOW-Level Output Voltage
VOL3, LOW-Level Output Voltage
IOL, LOW-Level Output Current
Output Leakage Current
tof, Output Fall Time from VIHmax to VILmax
CI, Capacitance for Each I/O pin
2

Auxiliary I C I/O (AUX_CL, AUX_DA)
VIL, LOW-Level Input Voltage
VIH, HIGH-Level Input Voltage
Vhys, Hysteresis
VOL1, LOW-Level Output Voltage
IOL, LOW-Level Output Current
Output Leakage Current
tof, Output Fall Time from VIHmax to VILmax
CI, Capacitance for Each I/O pin

MPU-6000
MPU-6000
MPU-6000
MPU-6050
MPU-6050
MPU-6050
3mA sink current
VOL = 0.4V
VOL = 0.6V
Cb bus capacitance in pF
MPU-6050: AUX_VDDIO=0

VLOGIC > 2V; 1mA sink current
VLOGIC < 2V; 1mA sink current
VOL = 0.4V
VOL = 0.6V
Cb bus capacitance in pF
MPU-6050: AUX_VDDIO=1;
MPU-6000

1mA sink current
VOL = 0.4V
VOL = 0.6V
Cb bus cap. in pF

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Notes

MPU-6000/MPU-6050 Product Specification

6.6

Document Number: PS-MPU-6000A-00
Revision: 1.0
Release Date: 11/24/2010

Electrical Specifications, Continued

Typical Operating Circuit of Section 7.2, VDD = 2.5V±5%, 3.0V±5%, or 3.3V±5%, VLOGIC (MPU-6050 only)= 1.8V±5% or VDD, TA = 25°C
Parameters

Conditions

Min

INTERNAL CLOCK SOURCE
Gyroscope Sample Rate, Fast

CLK_SEL=0,1,2,3
DLPFCFG=0
SAMPLERATEDIV = 0

Gyroscope Sample Rate, Slow

DLPFCFG=1,2,3,4,5, or 6
SAMPLERATEDIV = 0

Accelerometer Sample Rate
Reference Clock Output
Clock Frequency Initial Tolerance
Frequency Variation over Temperature
PLL Settling Time
EXTERNAL 32.768kHz CLOCK
External Clock Frequency
External Clock Allowable Jitter
Gyroscope Sample Rate, Fast
Gyroscope Sample Rate, Slow

CLKOUTEN = 1
CLK_SEL=0, 25°C
CLK_SEL=1,2,3; 25°C
CLK_SEL=0
CLK_SEL=1,2,3
CLK_SEL=1,2,3

Units
kHz

1

kHz

1

kHz

1.024

-15 to +10
±1
1

MHz
%
%
%
%
ms

32.7681 to 2
8.192

kHz
µs
kHz

1.024

kHz

1.024

kHz

1.0486
1

MHz
ms

+5
+1

CLK_SEL=4
Cycle-to-cycle rms
DLPFCFG=0
SAMPLERATEDIV = 0
DLPFCFG=1,2,3,4,5, or 6
SAMPLERATEDIV = 0

Reference Clock Output
PLL Settling Time

CLKOUTEN = 1

EXTERNAL 19.2MHz CLOCK
External Clock Frequency
Gyroscope Sample Rate
Gyroscope Sample Rate, Fast Mode

CLK_SEL=5
19.2
Full programmable range
DLPFCFG=0
SAMPLERATEDIV = 0
DLPFCFG=1,2,3,4,5, or 6
SAMPLERATEDIV = 0

Accelerometer Sample Rate
Reference Clock Output
PLL Settling Time

Max

8

-5
-1

Accelerometer Sample Rate

Gyroscope Sample Rate, Slow Mode

Typical

CLKOUTEN = 1

15 of 53

8

MHz
Hz
kHz

1

kHz

1

kHz

1.024
1

MHz
ms

3.9

8000

Notes

MPU-6000/MPU-6050 Product Specification

6.7

Document Number: PS-MPU-6000A-00
Revision: 1.0
Release Date: 11/24/2010

I2C Timing Characterization

Typical Operating Circuit of Section 7.2, VDD = 2.5V±5%, 3.0V±5%, or 3.3V±5%, VLOGIC (MPU-6050 only)= 1.8V±5% or VDD, TA = 25°C
Parameters

Conditions

2

2

I C TIMINGfSCL, SCL Clock Frequency
tHD.STA, (Repeated) START Condition HoldTime
tLOW, SCL Low PeriodtHIGH, SCL High PeriodtSU.STA, Repeated START Condition Setup
Time
tHD.DAT, SDA Data Hold TimetSU.DAT, SDA Data Setup Timetr, SDA and SCL Rise Timetf, SDA and SCL Fall Time
tSU.STO, STOP Condition Setup TimeMin

Typical

Max

Units

400
0.6

kHz
µs

1.3
0.6
0.6

µs
µs
µs

0
100
20+0.1Cb
20+0.1Cb
0.6

µs
ns
ns
ns
µs

I C FAST-MODE

Cb bus cap. from 10 to 400pF
Cb bus cap. from 10 to 400pF

tBUF, Bus Free Time Between STOP and
START Condition
Cb, Capacitive Load for each Bus LinetVD.DAT, Data Valid Time
tVD.ACK, Data Valid Acknowledge Time

300
300

1.3

µs
< 400
0.9
0.9

I2C Bus Timing Diagram

16 of 53

pF
µs
µs

Notes

MPU-6000/MPU-6050 Product Specification

6.8

Document Number: PS-MPU-6000A-00
Revision: 1.0
Release Date: 11/24/2010

SPI Timing Characterization (MPU-6000 only)

Typical Operating Circuit of Section 7.2, VDD = 2.5V±5%, 3.0V±5%, or 3.3V±5%, VLOGIC (MPU-6050 only)= 1.8V±5% or VDD,TA = -40°C to +85°C, unless otherwise noted.
Parameters

Conditions

Min

Typical

Max

Units

1

MHz

SPI TIMINGfSCLK, SCLK Clock FrequencytLOW, SCLK Low Period

400

ns

tHIGH, SCLK High Period

400

ns

tSU.CS, CS Setup Time

8ns

tHD.CS, CS Hold Time

500

ns

tSU.SDI, SDI Setup Time

11

nstHD.SDI, SDI Hold Time

7

nstVD.SDO, SDO Valid Time

Cload = 20pF

tHD.SDO, SDO Hold Time

Cload = 20pF

100
4

tDIS.SDO, SDO Output Disable Time

10

SPI Bus Timing Diagram

17 of 53

ns
ns
ns

Notes

MPU-6000/MPU-6050 Product Specification

6.9

Document Number: PS-MPU-6000A-00
Revision: 1.0
Release Date: 11/24/2010

Absolute Maximum Ratings

Stress above those listed as “Absolute Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only and functional operation of the device at these conditions is not implied.
Exposure to the absolute maximum ratings conditions for extended periods may affect device reliability.
Parameter

RatingSupply Voltage, VDD-0.5V to +6V

VLOGIC Input Voltage Level (MPU-6050)-0.5V to VDD + 0.5V

REGOUT-0.5V to 2V

Input Voltage Level (CLKIN, AUX_DA, AD0, FSYNC, INT,
SCL, SDA)CPOUT (2.5V ≤ VDD ≤ 3.6V )-0.5V to VDD + 0.5V
-0.5V to 30V

Acceleration (Any Axis, unpowered)

10,000g for 0.3ms

Operating Temperature Range-40°C to +105°C

Storage Temperature Range-40°C to +125°C

Electrostatic Discharge (ESD) Protection

2kV (HBM);
200V (MM)

Latch-up

60mA @ 125°C
JEDEC Condition “B”

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MPU-6000/MPU-6050 Product Specification

7

Applications Information

7.1

Pin Out and Signal Description
MPU6000YYYY

Pin Number
1
6
7
8
8
9
9
10
11
12
13
18
19, 21
20
22
23
23
24
24
2, 3, 4, 5, 14,
15, 16, 17

MPU6050
Y
Y
Y
Y

Y
Y
Y
Y
Y
Y
Y
Y
Y
Y

Y
Y
Y
Y
Y
Y
Y
Y
Y

Y
Y
Y
Y

Y

Document Number: PS-MPU-6000A-00
Revision: 1.0
Release Date: 11/24/2010

Pin Name

Pin Description

CLKIN
AUX_DA
AUX_CL/CS
VLOGIC
AD0 / SDO
AD0
REGOUT
FSYNC
INT
VDD
GND
RESV
CPOUT
CLKOUTSCL / SCLKSCLSDA / SDI
SDA
NC

Optional external reference clock input. Connect to GND if unused.
2
I C master serial data, for connecting to external sensors
2
I C Master serial clock, for connecting to external sensors
SPI chip select (0=SPI mode)
Digital I/O supply voltage
2
I C Slave Address LSB (AD0); SPI serial data output (SDO)2
I C Slave Address LSB (AD0)Regulator filter capacitor connection
Frame synchronization digital inputInterrupt digital output (totem pole or open-drain)
Power supply voltage and Digital I/O supply voltage
Power supply groundReserved. Do not connect.
Charge pump capacitor connection
System clock output
2
I C serial clock (SCL); SPI serial clock (SCLK)2
I C serial clock (SCL)2
I C serial data (SDA); SPI serial data input (SDI)2
I C serial data (SDA)
Not internally connected. May be used for PCB trace routing.

Top View

Top View

RESV

CPOUT

RESV

SDA

SCL

CLKOUT

21

20

19

24

23

22

CLKIN

1

18

GND

NC

2

17

NC

3

NC

4

NC
AUX_DARESVCLKOUT
22RESV

SCL/SCLK
23

CPOUT

SDA/SDI
24

21

20

19

+Z

CLKIN

1

18

GND

NC

NC

2

17

NC

16

NC

NC

3

16

NC

15

NC

NC

4

15

NC

5

14

NC

NC

5

14

NC

6

13

VDD

AUX_DA613

VDD

MPU-6000

AUX_CL/CS

AD0/SDOREGOUT

FSYNC

INT

QFN Package
24-pin, 4mm x 4mm x 0.9mm

7

8

9

10

11

12
INT

12

FSYNC

11

REGOUT

10

AD0

9

VLOGIC8

AUX_CL7

MPU-6050

QFN Package
24-pin, 4mm x 4mm x 0.9mm

19 of 53

+Y+Z
M
MP PUU- 600
60
50 0

+X

+Y

+X

Orientation of Axes of Sensitivity andPolarity of Rotation

MPU-6000/MPU-6050 Product Specification

7.2

7.3

Document Number: PS-MPU-6000A-00
Revision: 1.0
Release Date: 11/24/2010

Typical Operating Circuit

Bill of Materials for External Components
Component

LabelSpecification

Quantity

Regulator Filter Capacitor (Pin 10)

C1

Ceramic, X7R, 0.1µF ±10%, 2V

1

VDD Bypass Capacitor (Pin 13)

C2

Ceramic, X7R, 0.1µF ±10%, 4V

1Charge Pump Capacitor (Pin 20)

C3

Ceramic, X7R, (10nF or 2.2nF**) ±10%, 50V

1

VLOGIC Bypass Capacitor (Pin 8)

C4*

Ceramic, X7R, 10nF ±10%, 4V

1* MPU-6050 Only.
** Currently, the part has been characterized only with 10nF capacitor. Characterization with a 2.2nF value is pending.

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MPU-6000/MPU-6050 Product Specification

7.4

Recommended Power-on Procedure

21 of 53

Document Number: PS-MPU-6000A-00
Revision: 1.0
Release Date: 11/24/2010

MPU-6000/MPU-6050 Product Specification

7.5

Document Number: PS-MPU-6000A-00
Revision: 1.0
Release Date: 11/24/2010

Block Diagram

7.6
Overview
The MPU-60X0 is comprised of the following key blocks and functions:














Three-axis MEMS rate gyroscope sensor with 16-bit ADCs and signal conditioning
Three-axis MEMS accelerometer sensor with 16-bit ADCs and signal conditioning
Digital Motion Processor (DMP) engine
Primary I2C and SPI (MPU-6000 only) serial communications interfaces
Auxiliary I2C serial interface for 3rd party magnetometer & other sensors
Clocking
Sensor Data Registers
FIFO
Interrupts
Digital-Output Temperature Sensor
Self-test
Bias and LDO
Charge Pump

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MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 1.0
Release Date: 11/24/2010

7.7
Three-Axis MEMS Gyroscope with 16-bit ADCs and Signal Conditioning
The MPU-60X0 consists of three independent vibratory MEMS rate gyroscopes, which detect rotation about
the X, Y, and Z axes. When the gyros are rotated about any of the sense axes, the Coriolis Effect causes a
vibration that is detected by a capacitive pickoff. The resulting signal is amplified, demodulated, and filteredto produce a voltage that is proportional to the angular rate. This voltage is digitized using individual on-chip
16-bit Analog-to-Digital Converters (ADCs) to sample each axis. The full-scale range of the gyro sensors
may be digitally programmed to ±250, ±500, ±1000, or ±2000 degrees per second (dps). The ADC sample
rate is programmable from 8,000 samples per second, down to 3.9 samples per second, and user-selectablelow-pass filters enable a wide range of cut-off frequencies.
7.8
Three-Axis MEMS Accelerometer with 16-bit ADCs and Signal Conditioning
The tri-axis accelerometer uses separate proof masses for each axis. Acceleration along a particular axis
induces displacement on the respective proof mass, and capacitive sensors detect the displacement
differentially. The architecture reduces the susceptibility to fabrication variations as well as to thermal drift.
When the device sits on a flat surface, it will measure 0g on the X- and Y-axes and +1g on the Z-axis.
Accelerometer scale factor is calibrated at the factory and is nominally independent of supply voltage. Eachsensor has a dedicated sigma-delta ADC for providing digital outputs. The full scale range of the digital
output can be adjusted to ±2g, ±4g, ±8g, or ±16g.
7.9Digital Motion Processor
The embedded Digital Motion Processor (DMP) is located within the MPU-60X0 and offloads computation of
motion processing algorithms from the host processor. The DMP acquires data from accelerometers,
gyroscopes, and additional sensors such as magnetometers, and processes the data. The resulting data canbe read from the DMP’s registers, or can be buffered in a FIFO. The DMP has access to one of the MPU’s
external pins, which can be used for generating interrupts.
The purpose of the DMP is to offload both timing requirements and processing power from the hostprocessor. Typically, motion processing algorithms should be run at a high rate, often around 200Hz, in orderto provide accurate results with low latency. This is required even if the application updates at a much lower
rate; for example, a low power user interface may update as slowly as 5Hz, but the motion processing shouldstill run at 200Hz. The DMP can be used as a tool in order to minimize power, simplify timing and thesoftware architecture, and save valuable MIPS on the host processor for use in the application.

7.10 Primary I2C and SPI Serial Communications Interfaces
The MPU-60X0 communicates to a system processor using either SPI (MPU-6000 only) or I2C serialinterfaces, and the device always acts as a slave when communicating to the system processor. The logic
level for communications to the master is set by the voltage on the VLOGIC pin – (MPU-6050) or by VDD(MPU-6000). The LSB of the of the I2C slave address is set by pin 9 (AD0).

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MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 1.0
Release Date: 11/24/2010

7.11 Auxiliary I2C Serial Interface
The MPU-60X0 has an auxiliary I2C bus for communicating to an off-chip 3-axis digital output magnetometeror other sensors. This bus has two operating modes: I2C Master Mode, where the MPU-60X0 acts as amaster to an external sensor(s) connected to the auxiliary I2C bus; and Pass-Through Mode, where theMPU-60X0 directly connects the primary and auxiliary I2C buses together, to allow the system processor to
directly communicate with the external sensor(s).
Auxiliary I2C Bus Modes of Operation:


I2C Master Mode: allows the MPU-60X0 to directly access the data registers of external digitalsensors, such as a magnetometer. In this mode, the MPU-60X0 directly obtains data from auxiliary
sensors, allowing the on-chip DMP to generate sensor fusion data without intervention from thesystem applications processor.
For example, In I2C master mode, the MPU-60X0 can be configured to perform burst reads,
returning the following data from a magnetometer:

X magnetometer data (2 bytes)
Y magnetometer data (2 bytes)
Z magnetometer data (2 bytes)

The I2C master can be configured to read up to 24 bytes from up to 5 auxiliary sensors.
Pass-Through Mode: allows an external system processor to act as master and directly
communicate to the external sensor connected to the auxiliary I2C bus pins (AUX_DA and AUX_CL).
This is useful for configuring the external sensor, or for keeping the MPU-60X0 in a low-power mode,
when only the external sensor is to be used. In this mode, the auxiliary I2C bus control logic (thirdparty sensor interface block) of the MPU-60X0 is disabled, and the auxiliary I2C pins AUX_DA and
AUX_CL (Pins 6 and 7) are connected to the main I2C bus (Pins 23 and 24) through analog
switches.

Auxiliary I2C Bus IO Logic Levels
The logic level of the auxiliary I2C bus can be programmed to be either VDD or VLOGIC (VLOGIC on MPU6050 only). See Section 10.2 for a detailed description of this feature.

7.12 Self-Test
Self-test allows for the testing of the mechanical and electrical portions of the sensors. The self-test for eachmeasurement axis can be activated by controlling the bits of the GYRO_CONFIG and ACCEL_CONFIG
control registers. When self-test is activated, the electronics cause the sensors to be actuated and produce
an output signal. The sensor reading is determined by the sum of the sensor output and the self-test
response. The self-test response for each accelerometer axis is defined in the specification table to be
nominally 0.5g. Similarly, for the gyro axes, self test allows the proof masses to be moved equivalent to a
pre-defined Coriolis force, resulting in a change in sensor output. The self-test response for each gyroscope
axis is defined in the specification table to be nominally 50º/s.

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MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 1.0
Release Date: 11/24/2010

7.13 MPU-60X0 Solution for 9-axis Sensor Fusion Using I2C Interface
In the figure below, the system processor is an I2C master to the MPU-60X0. In addition, the MPU-60X0 is an
I2C master to the optional external compass sensor. The MPU-6000 has limited capabilities as an I2C
Master, and depends on the system processor to manage the initial configuration of any auxiliary sensors.
The MPU-6000 has an interface bypass multiplexer, which connects the system processor I2C bus pins 23
and 24 (SDA and SCL) directly to the auxiliary sensor I2C bus pins 6 and 7 (AUX_DA and AUX_CL).
Once the auxiliary sensors have been configured by the system processor, the interface bypass multiplexer
should be disabled so the MPU-6000 auxiliary I2C master can take control of the sensor I2C bus and gather
data from the auxiliary sensors.
I2C master control is discussed in more detail in Section 10.

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MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 1.0
Release Date: 11/24/2010

7.14 MPU-6000 Using SPI Interface
In the figure below, the system processor is an SPI master to the MPU-6000. Pins 8, 9, 23, and 24 are used
to support the /CS, SDO, SCLK, and SDI signals for SPI communications. Because these SPI pins areshared with the I2C slave pins (9, 23 and 24), the system processor cannot access the auxiliary I2C bus
through the interface bypass multiplexer, which connects the processor I2C interface pins to the sensor I2C
interface pins.
Since the MPU-6000 has limited capabilities as an I2C Master, and depends on the system processor to
manage the initial configuration of any auxiliary sensors, another method must be used for programming thesensors on the auxiliary sensor I2C bus pins 6 and 7 (AUX_DA and AUX_CL).
When using SPI communications between the MPU-6000 and the system processor, configuration ofdevices on the I2C sensor bus can be achieved by performing single byte read and write transactions on any
device and register on the auxiliary I2C bus by using I2C Slave 4 Control (see Registers 49 to 53). Once theexternal sensors are configured, the MPU-6000 has the capability to perform single or multi-byte reads using
the sensor I2C bus. The Slave 0 to Slave 3 controllers may have the read result written to the FIFO buffer aswell as to the sensor registers.

26 of 53

MPU-6000/MPU-6050 Product Specification

8

Document Number: PS-MPU-6000A-00
Revision: 1.0
Release Date: 11/24/2010

Programmable Interrupts

The MPU-60X0 has a programmable interrupt system which can generate an interrupt signal on the INT pin.
Status flags indicate the source of an interrupt. Interrupt sources may be enabled and disabled individually.
Table of Interrupt Sources
Interrupt Name

ModuleFree Fall Detection

Free Fall

Motion Detection

MotionZero Motion Detection

Zero Motion

FIFO Overflow

FIFO

PLL ReadyPLL

DMP Interrupt

DMP

Data ReadySensor Registers

I C Master errors: Lost Arbitration, NACKs

2

I C Master2

I C Master2
2

I C Slave 4Interrupts are described in the register description (Section 13) which provides more information about theirenable/disable register and flag register. Some interrupt sources are explained in detail below.

27 of 53

MPU-6000/MPU-6050 Product Specification

8.1

Document Number: PS-MPU-6000A-00
Revision: 1.0
Release Date: 11/24/2010

Free Fall, Motion, and Zero Motion Signal Paths

The diagram below shows the signal path for the gyroscope and accelerometer sensors. Note that each
digital low pass filter (DLPF) is configured identically, as is each sample rate divider and digital high passfilter (DHPF).

8.2

Free Fall Interrupt

Free fall is detected by checking if the accelerometer measurement from all three axes has an absolutevalue below a user-programmable threshold (acceleration threshold). For each sample where this conditionis true (a qualifying sample), a counter is incremented. For each sample where this condition is false (a nonqualifying sample), the counter is decremented. Once the counter reaches a user-programmable threshold(the counter threshold), the Free Fall interrupt is triggered, and a flag is set. The flag is cleared once thecounter has decremented to zero. The counter does not increment above the counter threshold or decrement
below zero.
The user is given several configuration parameters to fine tune Free Fall detection. Both, the accelerationthreshold and counter threshold, are user configurable. The FF_THR register allows the user to set a
threshold in steps of 1mg. The FF_DUR register allows the user to set duration in steps of 1 ms.
The decrement rate for non-qualifying samples may also be configured. The MOT_DETECT_CTRL register
allows the user to specify whether a non-qualifying sample makes the counter reset to zero, or decrement insteps of 1, 2, or 4.

The plots in the figure above show an example acceleration input signal (simplified to only show one axis),
qualifying sample counter, and Free Fall flag.
8.3

Motion Interrupt

The MPU-60X0 provides Motion detection capability that works in a similar manner to Free Fall detection.
Accelerometer measurements are passed through a configurable digital high pass filter (DHPF) in order toeliminate bias due to gravity. A qualifying motion sample is one where the high passed sample from any axis
has an absolute value exceeding a user-programmable threshold. A counter increments for each qualifying
sample, and decrements for each non-qualifying sample. Once the counter reaches a user-programmable

28 of 53

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 1.0
Release Date: 11/24/2010

counter threshold, a motion interrupt is triggered. The axis and polarity which caused the interrupt to be
triggered is flagged in the MOT_DETECT_STATUS register.
Like with Free Fall detection, Motion detection has a configurable acceleration threshold MOT_THR specifiedin steps of 1 mg. The counter threshold MOT_DUR is specified in steps of 1 ms. The decrement rate has thesame options as Free Fall detection, and is specified in the MOT_DETECT_CTRL register.
8.4

Zero Motion Interrupt

Zero Motion detection capability uses the digital high pass filter (DHPF) and a similar threshold scheme toFree Fall detection. Each axis of the high passed accelerometer measurement must have an absolute valueless than a threshold specified in the ZRMOT_THR register. This increments a counter, which generates aninterrupt when reaching the threshold specified in ZRMOT_DUR.
Unlike Free Fall or Motion detection, Zero Motion detection triggers an interrupt both when Zero Motion is
first detected and when Zero Motion is no longer detected. While Free Fall and Motion are indicated with aflag which clears after being read, reading the state of the Zero Motion detected from the
MOT_DETECT_STATUS register does not clear its status.

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MPU-6000/MPU-6050 Product Specification

9

Document Number: PS-MPU-6000A-00
Revision: 1.0
Release Date: 11/24/2010

Clocking

9.1
Internal Clock Generation
The MPU-60X0 has a flexible clocking scheme, allowing for a variety of internal or external clock sources forthe internal synchronous circuitry. This synchronous circuitry includes the signal conditioning and ADCs, the
DMP, and various control circuits and registers. An on-chip PLL provides flexibility in the allowable inputs forgenerating this clock.
Allowable internal sources for generating the internal clock are:

An internal relaxation oscillator
Any of the X, Y, or Z gyros (MEMS oscillators with a variation of ±1% over temperature)

Allowable external clocking sources are:

32.768kHz square wave
19.2MHz square wave

Selection of source for generating the internal synchronous clock depends on the availability of externalsources and the requirements for power consumption and clock accuracy. Most likely, these requirements
will vary by mode of operation. For example, in one mode, where the biggest concern is power consumption,
one may wish to operate the Digital Motion Processor of the MPU-60X0 to process accelerometer data, while
keeping the gyros off. In this case, the internal relaxation oscillator is a good clock choice. However, in
another mode, where the gyros are active, selecting the gyros as the clock source provides for a moreaccurate clock source.
Clock accuracy is important, since timing errors directly affect the distance and angle calculations performedby the Digital Motion Processor (or by extension, by any processor).
There are also start-up conditions to consider. When the MPU-60X0 first starts up, the device uses its
internal clock until programmed to operate from another source. This allows the user, for example, to wait
for the MEMS oscillators to stabilize before they are selected as the clock source.
9.2
Sensor Data Registers
The sensor data registers contain the latest gyro, accelerometer, auxiliary sensor, and temperature data.
They are read-only registers, and are accessed via the serial interface. Data from these registers may beread anytime, however, the interrupt function may be used to determine when new data is available.
9.3
FIFO
The MPU-60X0 contains a 1024-byte FIFO register that is accessible via the Serial Interface. The FIFO
configuration register determines what data goes into it, with possible choices being gyro data,
accelerometer data, temperature readings, auxiliary sensor readings, and FSYNC input. A FIFO counter
keeps track of how many bytes of valid data are contained in the FIFO. The FIFO register supports burst
reads. The interrupt function may be used to determine when new data is available.
9.4
Interrupts
Interrupt functionality is configured via the Interrupt Configuration register. Items that are configurable include
the INT pin configuration, the interrupt latching and clearing method, and triggers for the interrupt. Items that
can trigger an interrupt are (1) Clock generator locked to new reference oscillator (used when switching clock
sources); (2) Digital Motion Processor Done (programmable function); (3) new data is available to be read(from the FIFO and Data registers); (4) accelerometer event interrupts; and (5) the MPU-60X0 did not

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receive an acknowledge from an auxiliary sensor on the secondary I2C bus. The interrupt status can be readfrom the Interrupt Status register.
9.5
Digital-Output Temperature Sensor
An on-chip temperature sensor and ADC are used to measure the MPU-60X0 die temperature.
readings from the ADC can be read from the FIFO or the Sensor Data registers.

The

9.6
Bias and LDO
The bias and LDO section generates the internal supply and the reference voltages and currents required by
the MPU-60X0. Its two inputs are an unregulated VDD of 2.1V to 3.6V and a VLOGIC logic reference supply
voltage of 1.71V to VDD (MPU-6050 only). The LDO output is bypassed by a capacitor at REGOUT. For
further details on the capacitor, please refer to the Bill of Materials for External Components section.
9.7
Charge Pump
An on-board charge pump generates the high voltage required for the MEMS oscillators. Its output is
bypassed by a capacitor at CPOUT. For further details on the capacitor, please refer to the Bill of Materials
for External Components section.

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Revision: 1.0
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10 Digital Interface2

10.1 I C and SPI (MPU-6000 only) Serial Interfaces
The internal registers and memory of the MPU-6000/MPU-6050 can be accessed using either I2C at 400 kHz
or SPI at 1MHz (MPU-6000 only). SPI operates in four-wire mode.
Serial Interface
Pin Number

MPU-6000

8

Y

8
9

Y

VLOGIC

Digital I/O supply voltage. VLOGIC must be ≤ VDD at all times.

AD0 / SDOI C Slave Address LSB (AD0); SPI serial data output (SDO)

/CS

Y
Y

23
24

Pin NameY

923

MPU-6050

SCL / SCLK
Y

Y

24

AD0
SCL
SDA / SDIY

SDA

Pin Description
SPI chip select (0=SPI enable)
2
2

I C Slave Address LSB
2

I C serial clock (SCL); SPI serial clock (SCLK)2

I C serial clock2

I C serial data (SDA); SPI serial data input (SDI)2

I C serial data

Note:
To prevent switching into I2C mode when using SPI (MPU-6000), the I2C interface should be disabled by
setting the I2C_IF_DIS configuration bit. Setting this bit should be performed immediately after waiting thetime specified by the “Start-Up Time for Register Read/Write” in Section 3.2.
10.2

I2C Interface

I2C is a two-wire interface comprised of the signals serial data (SDA) and serial clock (SCL). In general, thelines are open-drain and bi-directional. In a generalized I2C interface implementation, attached devices canbe a master or a slave. The master device puts the slave address on the bus, and the slave device with thematching address acknowledges the master.
The MPU-60X0 always operates as a slave device when communicating to the system processor, which thus
acts as the master. SDA and SCL lines typically need pull-up resistors to VDD. The maximum bus speed is
400 kHz.
The slave address of the MPU-60X0 is b110100X which is 7 bits long. The LSB bit of the 7 bit address isdetermined by the logic level on pin AD0. This allows two MPU-60X0s to be connected to the same I2C bus.
When used in this configuration, the address of the one of the devices should be b1101000 (pin AD0 is logiclow) and the address of the other should be b1101001 (pin AD0 is logic high).
10.3

I2C Communications Protocol

START (S) and STOP (P) Conditions
Communication on the I2C bus starts when the master puts the START condition (S) on the bus, which isdefined as a HIGH-to-LOW transition of the SDA line while SCL line is HIGH (see figure below). The bus isconsidered to be busy until the master puts a STOP condition (P) on the bus, which is defined as a LOW to
HIGH transition on the SDA line while SCL is HIGH (see figure below).

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Additionally, the bus remains busy if a repeated START (Sr) is generated instead of a STOP condition.

START and STOP Conditions

Data Format / Acknowledge
I2C data bytes are defined to be 8-bits long. There is no restriction to the number of bytes transmitted per
data transfer. Each byte transferred must be followed by an acknowledge (ACK) signal. The clock for the
acknowledge signal is generated by the master, while the receiver generates the actual acknowledge signal
by pulling down SDA and holding it low during the HIGH portion of the acknowledge clock pulse.
If a slave is busy and cannot transmit or receive another byte of data until some other task has been
performed, it can hold SCL LOW, thus forcing the master into a wait state. Normal data transfer resumes
when the slave is ready, and releases the clock line (refer to the following figure).

Acknowledge on the I2C Bus

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Communications
After beginning communications with the START condition (S), the master sends a 7-bit slave address
followed by an 8th bit, the read/write bit. The read/write bit indicates whether the master is receiving data fromor is writing to the slave device. Then, the master releases the SDA line and waits for the acknowledge
signal (ACK) from the slave device. Each byte transferred must be followed by an acknowledge bit. To
acknowledge, the slave device pulls the SDA line LOW and keeps it LOW for the high period of the SCL line.
Data transmission is always terminated by the master with a STOP condition (P), thus freeing thecommunications line. However, the master can generate a repeated START condition (Sr), and address
another slave without first generating a STOP condition (P). A LOW to HIGH transition on the SDA line while
SCL is HIGH defines the stop condition. All SDA changes should take place when SCL is low, with the
exception of start and stop conditions.

Complete I2C Data Transfer
To write the internal MPU-60X0 registers, the master transmits the start condition (S), followed by the I2C
address and the write bit (0). At the 9th clock cycle (when the clock is high), the MPU-60X0 acknowledges thetransfer. Then the master puts the register address (RA) on the bus. After the MPU-60X0 acknowledges thereception of the register address, the master puts the register data onto the bus. This is followed by the ACK
signal, and data transfer may be concluded by the stop condition (P). To write multiple bytes after the last
ACK signal, the master can continue outputting data rather than transmitting a stop signal. In this case, theMPU-60X0 automatically increments the register address and loads the data to the appropriate register. The
following figures show single and two-byte write sequences.

Single-Byte Write Sequence
Master

S

AD+W

Slave

RA
ACK

DATA
ACK

P
ACK

Burst Write Sequence
Master
Slave

S

AD+W

RA
ACK

DATA
ACK

DATA
ACK

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ACKDocument Number: PS-MPU-6000A-00
Revision: 1.0
Release Date: 11/24/2010

MPU-6000/MPU-6050 Product Specification

To read the internal MPU-60X0 registers, the master sends a start condition, followed by the I2C address anda write bit, and then the register address that is going to be read. Upon receiving the ACK signal from the
MPU-60X0, the master transmits a start signal followed by the slave address and read bit. As a result, theMPU-60X0 sends an ACK signal and the data. The communication ends with a not acknowledge (NACK)
signal and a stop bit from master. The NACK condition is defined such that the SDA line remains high at the
9th clock cycle. The following figures show single and two-byte read sequences.

Single-Byte Read Sequence
Master

S

AD+W

Slave

RA
ACK

S

AD+R

ACK

NACK
ACK

P

DATA

Burst Read Sequence
Master

S

AD+W

Slave

10.4

RA
ACK

S
ACK

AD+R

ACK
ACK

DATA

I2C Terms

Signal
S
AD
W
R
ACK
NACK
RA
DATA
P

Description
Start Condition: SDA goes from high to low while SCL is highSlave I2C address
Write bit (0)Read bit (1)Acknowledge: SDA line is low while the SCL line is high at the
9th clock cycle
Not-Acknowledge: SDA line stays high at the 9th clock cycle
MPU-60X0 internal register address
Transmit or received data
Stop condition: SDA going from low to high while SCL is high35 of 53

NACK
DATA

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MPU-6000/MPU-6050 Product Specification

10.5

Document Number: PS-MPU-6000A-00
Revision: 1.0
Release Date: 11/24/2010

SPI Interface (MPU-6000 only)

SPI is a 4-wire synchronous serial interface that uses two control and two data lines. The MPU-6000 always
operates as a Slave device during standard Master-Slave SPI operation. With respect to the Master, theSerial Clock output (SCLK), the Data Output (SDO) and the Data Input (SDI) are shared among the Slave
devices. The Master generates an independent Chip Select (/CS) for each Slave device; /CS goes low at thestart of transmission and goes back high at the end. The Serial Data Output (SDO) line remains in a highimpedance (high-z) state when the device is not selected so it does not interfere with any active devices.
SPI Operational Features
1.
2.
3.
4.
5.

Data is delivered MSB first and LSB last
Data is latched on rising edge of SCLK
Data should be transitioned on the falling edge of SCLKSCLK frequency is 1MHz max
SPI read and write operations are completed in 16 or more clock cycles (two or more bytes). The
first byte contains the SPI Address, and the following byte(s) contain(s) the SPI data. The first
bit of the first byte contains the Read/Write bit and indicates the Read (1) or Write (0) operation.
The following 7 bits contain the Register Address. In cases of multiple-byte Read/Writes, data is
two or more bytes:
SPI Address format
MSB
R/W

A6

A5

A4

LSB
A3

A2

A1

SPI Data format
MSB
D7

D6

D5

A0

LSB
D4

D3

D2

D1

D0

6. Supports Single or Burst Read/Writes.

Each SPI slave requires its own Chip Select (/CS) line. SDO, SDI and SCLK lines are shared. Only one /CSline is active (low) at a time ensuring that only one slave is selected at a time. The /CS lines of other slaves
are held high which causes their respective SDO pins to be high-Z.

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11 Serial Interface Considerations (MPU-6050)
11.1 MPU-6050 Supported Interfaces
The MPU-6050 supports I2C communications on both its primary (microprocessor) serial interface and its
auxiliary interface.
11.2 Logic Levels
The MPU-6050 I/O logic levels are set to be either VDD or VLOGIC, as shown in the table below.
I/O Logic Levels vs. AUX_VDDIOMICROPROCESSOR LOGIC LEVELSAUXILLARY LOGIC LEVELS(Pins: SDA, SCL, AD0, CLKIN, INT)

(Pins: AUX_DA, AUX_CL)

0

VLOGICVLOGIC1

VLOGICVDD

AUX_VDDIO

Note: The power-on-reset value for AUX_VDDIO is 0.
VLOGIC may be set to be equal to VDD or to another voltage, such that at all times VLOGIC is ≤ VDD.
When AUX_VDDIO is set to 0 (its power-on-reset value), VLOGIC is the power supply voltage for both themicroprocessor system bus and the auxiliary I2C bus, as shown in the figure of Section 10.2.1. When
AUX_VDDIO is set to 1, VLOGIC is the power supply voltage for the microprocessor system bus and VDD is
the supply for the auxiliary I2C bus, as shown in the figure of Section 10.2.2.

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11.3

Document Number: PS-MPU-6000A-00
Revision: 1.0
Release Date: 11/24/2010

Logic Levels Diagram for AUX_VDDIO = 0

The figure below depicts a sample circuit with a third party magnetometer attached to the auxiliary I2C bus. It
shows logic levels and voltage connections for AUX_VDDIO = 0. Note: Actual configuration will depend on
the auxiliary sensors used.

I/O Levels and Connections for AUX_VDDIO = 0
Notes:
1. AUX_VDDIO determines the IO voltage levels of AUX_DA and AUX_CL(0 = set output levels relative to VLOGIC)
2. Other MPU-6050 logic IO is always referenced to VLOGIC.

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11.4

Document Number: PS-MPU-6000A-00
Revision: 1.0
Release Date: 11/24/2010

Logic Levels Diagram for AUX_VDDIO = 1

The figure below depicts a sample circuit with a third party magnetometer attached to the auxiliary I2C bus. It
shows logic levels and voltage connections for AUX_VDDIO = 1. This configuration is useful when theauxiliary sensor has only one supply for logic and power. Note: Actual configuration will depend on theauxiliary sensors used.

I/O Levels and Connections for Two Example Power Configurations (AUX_VDDIO = 1)
Notes:
1. AUX_VDDIO determines the IO voltage levels of AUX_DA and AUX_CL. AUX_VDDIO = 1 sets
output levels relative to VDD.
2. Other MPU-6050 logic IO is always referenced to VLOGIC.
3. Third-party auxiliary device logic levels are referenced to VDD. Setting INT1 and INT2 to open drain
configuration provides voltage compatibility when VDD ≠ VLOGIC. When VDD = VLOGIC, INT1 and
INT2 may be set to push-pull outputs, and external pull-up resistors are not needed.

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12 AssemblyThis section provides general guidelines for assembling InvenSense Micro Electro-Mechanical Systems(MEMS) gyros packaged in Quad Flat No leads package (QFN) surface mount integrated circuits.
12.1 Orientation of Axes
The diagram below shows the orientation of the axes of sensitivity and the polarity of rotation. Note the pin 1
identifier in the figure.

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12.2 Package Dimensions
I

PIN 1 IDENTIFIER IS A LASERMARKED FEATURE ON TOP
24c

PIN 1 IDENTIFIER

S1

19

1

19

18

24

18

I
1

S1

C 0.16

f
b

E

E2
e
13

6

13
7

D

L1 (12x)

12

A1

6

12

7

D2

L(12x)A

On 4 corner lead dim.

SS
R

SYMBOLS
A
A1
b
c
D
D2
E
E2
e
f (e-b)
L
L1
I
R
s
S1

DIMENSIONS IN MILLIMETERS
MIN
NOM
MAX
0.85
0.90
0.95
0.00
0.02
0.05
0.18
0.25
0.30
--0.20 REF.
--3.90
4.00
4.10
2.95
3.00
3.05
3.90
4.00
4.10
2.75
2.80
2.85
--0.50--0.20
0.25
0.32
0.30
0.35
0.40
0.35
0.40
0.45
0.20
0.25
0.30
0.05
--0.100.05--0.15
0.15
0.20
0.25

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12.3 PCB Design Guidelines:
The Pad Diagram is shown below using a JEDEC type extension with solder rising on the outer edge. The
Pad Dimensions Table shows pad sizing (mean dimensions) recommended for the MPU-60X0 product.

JEDEC type extension with solder rising on outer edge

D3
D
D2

PIN 1
IDENTIFIER
24

19

1

e

b

18

E2 E E3

c

6

13
7

12

L2
Tout
L

L3 L1

Tout

Tin
PCB Lay-out Diagram

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MPU-6000/MPU-6050 Product Specification

SYMBOLS

DIMENSIONS IN MILLIMETERS

Document Number: PS-MPU-6000A-00
Revision: 1.0
Release Date: 11/24/2010

NOM

Nominal Package I/O Pad Dimensionse

Pad Pitch

0.50b

Pad Width

0.25

L

Pad Length

0.35

L1

Pad Length

0.40

D

Package Width

4.00

E

Package Length

4.00

D2

Exposed Pad Width

3.00

E2

Exposed Pad Length

2.80

I/O Land Design Dimensions (Guidelines )D3

I/O Pad Extent Width

4.80

E3

I/O Pad Extent Length

4.80

c

Land Width

0.35

Tout

Outward Extension

0.40

Tin

Inward Extension

0.05

L2

Land Length

0.80

L3

Land Length

0.85

PCB Dimensions Table (for PCB Lay-out Diagram)
12.4 Assembly Precautions
12.4.1 Gyroscope Surface Mount Guidelines
InvenSense MEMS Gyros sense rate of rotation. In addition, gyroscopes sense mechanical stress comingfrom the PCB. This PCB stress is minimized with simple design rules:
When using MEMS gyroscope components in plastic packages, package stress due to PCB mounting andassembly could affect the output offset and its value over a wide range of temperatures. This is caused by
the mismatch between the Coefficient of Linear Thermal Expansion (CTE) of the package material and the
PCB. Care must be taken to avoid package stress due to mounting.
Traces connected to pads should be as much symmetric as possible. Symmetry and balance for pad
connection will help component self alignment and will lead to better control of solder paste reduction after
reflow.
Any material used in the surface mount assembly process of the MEMS gyroscope should be free ofrestricted RoHS elements or compounds. Pb-free solders should be used for assembly.
12.4.2 Exposed Die Pad Precautions
The MPU-60X0 has very low active and standby current consumption. The exposed die pad is not requiredfor heat sinking, and should not be soldered to the PCB since soldering to it contributes to performance

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changes due to package thermo-mechanical stress. There is no electrical connection between the pad andthe CMOS.
12.4.3 Trace Routing
Testing indicates that 3-Volt peak-to-peak signals run under the gyro package or directly on top of the
package of frequencies from DC to 1MHz do not affect the operation of the MEMS gyro. However, routing
traces or vias under the MEMS gyro package, such that they run under the exposed die pad, is prohibited.
12.4.4 Component Placement
Do not place large insertion components such as keyboard or similar buttons, connectors, or shielding boxes
at a distance of less than 6 mm from the MEMS gyro. Maintain generally accepted industry design practices
for component placement near the MPU-60X0 to prevent noise coupling and thermo-mechanical stress.
12.4.5 PCB Mounting and Cross-Axis Sensitivity
Orientation errors of the gyroscope mounted to the printed circuit board can cause cross-axis sensitivity inwhich one gyro responds to rotation about another axis, for example, the X-axis gyroscope responding torotation about the Y or Z axes. The orientation mounting errors are illustrated in the figure below.

The table below shows the cross-axis sensitivity as a percentage of the specified gyroscope’s sensitivity for agiven orientation error.
Cross-Axis Sensitivity vs. Orientation Error
Orientation Error

Cross-Axis Sensitivity(θ or Φ)(sinθ or sinΦ)

0º

0%

0.5º

0.87%

1º

1.75%

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The specification for cross-axis sensitivity in Section 3 includes the effect of the die orientation error withrespect to the package.
12.4.6 MEMS Handling Instructions
MEMS (Micro Electro-Mechanical Systems) are a time-proven, robust technology used in hundreds ofmillions of consumer, automotive and industrial products. MEMS devices consist of microscopic moving
mechanical structures. They differ from conventional IC products, even though they can be found in similar
packages. Therefore, MEMS devices require different handling precautions than conventional ICs prior tomounting onto printed circuit boards (PCBs).
The MPU-60X0 gyroscope has been qualified to a shock tolerance of 10,000g. InvenSense packages its
gyroscopes as it deems proper for protection against normal handling and shipping. It recommends thefollowing handling precautions to prevent potential damage.


Do not drop individually packaged gyroscopes, or trays of gyroscopes onto hard surfaces. Components
placed in trays could be subject to g-forces in excess of 10,000g if dropped.

Printed circuit boards that incorporate mounted gyroscopes should not be separated by manuallysnapping apart. This could also create g-forces in excess of 10,000g.

12.4.7 ESD Considerations
Establish and use ESD-safe handling precautions when unpacking and handling ESD-sensitive devices.
Store ESD sensitive devices in ESD safe containers until ready for use. The Tape-and-Reel moisturesealed bag is an ESD approved barrier. The best practice is to keep the units in the original moisturesealed bags until ready for assembly.

Restrict all device handling to ESD protected work areas that measure less than 200V static charge. Ensurethat all workstations and personnel are properly grounded to prevent ESD.
12.4.8 Reflow Specification
Qualification Reflow: The MPU-60X0 gyroscope was qualified in accordance with IPC/JEDEC J-STD020D.01. This standard classifies proper packaging, storage and handling to avoid subsequent thermal andmechanical damage during assembly solder reflow attachment. Classification specifies a sequence
consisting of a bake cycle, a moisture soak cycle in a temperature humidity oven, followed by three solder
reflow cycles and functional testing for qualification. All temperatures refer to the topside of the QFN
package, as measured on the package body surface. The peak solder reflow classification temperature
requirement is (260 +5/-0°C) for lead-free soldering of components measuring less than 1.6 mm thick.
Production Reflow: Check the recommendations of your solder manufacturer. For optimum results,
production solder reflow processes should reduce exposure to high temperatures, and use lower ramp-up
and ramp-down rates than those used in the component qualification profile shown for reference below.
Production reflow should never exceed the maximum constraints listed in the table and shown in the figure
below that were used for the qualification profile, as these represent the maximum tolerable ratings for thedevice.

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Approved IR/Convection Solder Reflow Curve
Temperature Set Points for IR / Convection Reflow Corresponding to Figure Above
CONSTRAINTS
Step

Setting

Temp
(°C)

A

Troom

25

B

TSmin

150

C

TSmax

200

D

TLiquidus

217

r(TLiquidus-TPmax) < 3

ETPmin [255°C, 260°C]

255

r(TLiquidus-TPmax) < 3

FTPmax [ 260°C, 265°C]

260

tAF < 480r(TLiquidus-TPmax) < 3

GTPmin [255°C, 260°C]

255

10< tEG < 30r(TPmax-TLiquidus) < 4

HTLiquidus

217

60 < tDH < 120

I

Troom

25

Time (sec)Rate (°C/sec)

60 < tBC < 120

Note: TPmax must not exceed the Classification temperature (260°C).
For suppliers TPmax must equal or exceed the classification temperature.

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12.4.9 Storage Specifications
The storage specification of the MPU-60X0 gyroscope conforms to IPC/JEDEC J-STD-020D.01 MoistureSensitivity Level (MSL) 3.

Calculated shelf-life in moisture-sealed bag

12 months -- Storage conditions: <40°C and <90% RH

After opening moisture-sealed bag

168 hours -- Storage conditions: ambient ≤30°C at 60%RH

12.4.10 Gyro Removal from PCB
Never apply high mechanical force while removing MEMS gyros from PCB. Otherwise, the QFN package
leads can be removed and failure analysis of the gyro unit will be impossible. Tweezers are practical.
Do not apply a pulling force upward. Instead apply a gentle force sideward while heating. When sufficientheat has been applied, the unit will start to slide sideways and can now be pulled gently upwards with thetweezers.
In any case, mechanical or thermo-mechanical overstress during manual handling and soldering, (especiallycontact between the soldering iron or hot air gun and the package) has to be avoided.
If safe removal of the suspected component is not possible or deemed too risky, send the whole PCB or thepart of the PCB containing the defective component back to InvenSense. If requested, we will return the PCB
after we have removed the gyro.
12.5 Package Marking Specification

Package Marking Specification

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12.6 Tape & Reel Specification

Tape Dimensions

Reel Outline Drawing
Reel Dimensions and Package Size
PKG
SIZE

REEL (mm)L

V

W

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Document Number: PS-MPU-6000A-00
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MPU-6000/MPU-6050 Product Specification

4x4

330

100

13.2

2.2

User Direction of
Feed

Package Orientation

Cover Tape
(Anti Static)
Carrier Tape

Label

Pin 1

(Anti Static)
Terminal Tape
Reel
Tape and Reel Specification

Reel Specifications
Quantity Per Reel

5,000

Reels per Box

1

Boxes Per Carton (max)

3 full pizza boxes packed in the center of the
carton, buffered by two empty pizza boxes (front
and back).

Pcs/Carton (max)

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12.7 Label

Location of Label

12.8 Packaging

Anti-static Label
Moisture-Sensitive
Caution LabelTape & Reel Label

Moisture Barrier Bag

Moisture-Sensitive Caution LabelWith Labels

Reel in Box

Box with Tape & Reel Label

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Revision: 1.0
Release Date: 11/24/2010

13 Reliability
13.1 Qualification Test Policy
InvenSense’s products complete a Qualification Test Plan before being released to production. The
Qualification Test Plan for the MPU-60X0 followed the JEDEC 47G.01 Standards, “Stress-Test-Driven
Qualification of Integrated Circuits,” with the individual tests described below.
13.2 Qualification Test Plan
Accelerated Life Tests
TEST

Method/Condition

Lot
Quantity

Sample/ Lot

Acc /RejectCriteria

High Temperature
Operating Life(HTOL/LFR)JEDEC JESD22-A108C, Dynamic,
3.63V biased, Tj>125°C[read-points 168, 500, 1000 hours]

3

77

(0/1)

Highly Accelerated Stress
Test (1) (HAST)JEDEC JESD22-A118
Condition A, 130°C, 85%RH, 33.3 psia.,
unbiased, [read-point 96 hours]

3

77

(0/1)

High Temperature
Storage Life (HTS)JEDEC JESD22-A103C, Cond. A, 125°C,
Non-Biased Bake
[read-points 168, 500, 1000 hours]

3

77

(0/1)

Lot
Quantity

Sample/ Lot

Acc /RejectCriteria

Device Component Level Tests
TEST

Method/Condition

ESD-HBMJEDEC JESD22-A114F, (1.5KV)

1

3

(0/1)

ESD-MMJEDEC JESD22-A115-A, (200V)

1

3

(0/1)

Latch UpJEDEC JESD78B Level 2, 125C, +/- 60mA

1

6

(0/1)

Mechanical ShockJEDEC JESD22-B104C,
Mil-Std-883H, method 2002.5,
Cond. E, 10,000g’s, 0.2ms,±X, Y, Z – 6 directions, 5 times/direction

3

5

(0/1)

Vibration

JEDEC JESD22-B103B, Variable Frequency(random), Cond. B, 5-500Hz,
X, Y, Z – 4 times/direction

3

5

(0/1)

Temperature Cycling (TC) (1)

JEDEC JESD22-A104D Condition N,[-40°C to +85°C], Soak Mode 2 [5’], 100 cycles

3

77

(0/1)

Lot
Quantity

Sample/ Lot

Acc /RejectCriteria

Board Level Tests
TEST

Method/Condition

Board Mechanical ShockJEDEC JESD22-B104C,
Mil-Std-883H, method 2002.5,
Cond. E, 10000g’s, 0.2ms,+-X, Y, Z – 6 directions, 5 times/direction

1

5

(0/1)

Board
Temperature Cycling (TC) (1)

JEDEC JESD22-A104D Condition N,[ -40°C to +85°C], Soak Mode 2 [5’], 100 cycles

1

40

(0/1)

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MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 1.0
Release Date: 11/24/2010(1) Tests are preceded by MSL3 Preconditioning in accordance with JEDEC JESD22-A113F

14 Environmental Compliance
The MPU-60X0 is RoHS and Green compliant.
The MPU-60X0 is in full environmental compliance as evidenced in report HS-MPU-6000A, Materials
Declaration Data Sheet.
Environmental Declaration Disclaimer:
InvenSense believes this environmental information to be correct but cannot guarantee accuracy or completeness. Conformity
documents for the above component constitutes are on file. InvenSense subcontracts manufacturing and the information contained
herein is based on data received from vendors and suppliers, which has not been validated by InvenSense.

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MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 1.0
Release Date: 11/24/2010

This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense
for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject tochange without notice. InvenSense reserves the right to make changes to this product, including its circuits and software, in order toimprove its design and/or performance, without prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding
the information and specifications contained in this document. InvenSense assumes no responsibility for any claims or damages arisingfrom information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited
to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights.

Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by
implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information
previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors
should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or for
any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,
transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime
prevention equipment.
TM

TM

TM

TM

InvenSense® is a registered trademark of InvenSense, Inc. MPU , MPU-6000 , MPU-6050 , MPU-60X0 , Motion Processing Unit
TM
TM
, Digital Motion Processing , and DMP are trademarks of InvenSense, Inc.

TM

©2010 InvenSense, Inc. All rights reserved.

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