The 13th
MEMS Engineer Forum (MEF)
2022
SMART Society Driven by MEMS

Program Handout
April 20-21, 2022
KFC Hall, Ryogoku, Tokyo, Japan
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MEMS Engineer Forum 2022
SMART Society Driven by MEMS
MEMS Engineer Forum (MEF) 2022 will be held on April 20-21 at KFC Hall in Ryogoku,
Tokyo. This will be the first time in two years since 2019 that the event will be held in-person.
MEF is a unique venue operated by engineers among the key players in the field, bringing
together MEMS researchers, developers, and engineers from all over the world to look at thecurrent state of MEMS technology, which is considered as key technologies of the 21st century,and the future of the technology through the next decade. The MEF has been held its startin 2009 and regularly 850 participants visit the two-day event each year.
The worldwide fusion and creation of the new movement based on MEMS fundamental,
application, and interdisciplinary technology field as well as MEMS markets was followed up
by MEMS engineers via excellent vision and skills in the forum.
The 2020 event was abandoned in light of the COVID-19 infection, and the 2021 event washeld online. The 2022 event is scheduled to be held in-person at the KFC Hall in both countries,
with thorough COVID-19 infection control measures in place.
The MEF has invited 22 speakers from the world's top business management, researchers
and technical managers in charge of advanced technology development, government policy
makers, venture capitalists, etc. The MEF will hold a technical exhibition concurrently withthe lecture sessions.
The MEF will be a forum for engineers to share their unique perspectives and skills in thebasic technologies of MEMS and adjacent fields to create new forms and fuse them together.
Our mission is to verify the process of fusion and its completion on an international level.
The MEF is supported by exhibitors and sponsors. We would like to thank the 36 exhibitorsand 27 sponsors for their support.
The in-person MEF2022 will be held with sufficient COVID-19 measures. The seating in thevenue will be laid out with plenty of room to prevent droplet infection. Therefore, themaximum number of participants will be limited to less than 50% of the venue's capacity.
We would appreciate your cooperation in registering for this event, as priority will be given
to those who are able to come on two consecutive days. Please take note of the following
information regarding our management policy and the status of our visitor requests whenregistering.
MEMS Engineer Forum (MEF)は、21 世紀のコアテクノロジーとされる MEMS 技術の現状と、向こう 10 年までの技術の将来に迫る、この分野のキープレイヤーとなるエンジニアを中心に運営されるユニークな場です。世界中の MEMS 研究者、開発者、技術者が一堂に集う MEF は、2009 年 3 月の初開催
以降、回を重ね、MEF2022 で第 13 回を迎えます。
シンポジウムと同時に開催される技術展示会には 36 機関・企業の方のご出展、さらに 27 機関・企業の方にスポンサーとしてご支援を賜る予定です。オンラインの良さを生かして、バーチャルプラットフ
ォームで交流を展開していただけるよう、バーチャルブースツアー、参加者・出展者同士の Web アポイ
ントやメッセージ交換など、ネットワーキングツールをフルに活用します。
MEF は、シンポジウムと併設技術展示会の両輪で、MEMS に関する基礎技術ならびに隣接分野の技術において、エンジニアならではの視点と技量で、新しいカタチを形成し、そして融合させて参ります。さらに融合の過程や完成に向かう姿を国際的なレベルで検証することをミッションとしております。
今回も、世界のトップクラスのビジネスマネージメント、先端技術開発を司る研究者・技術管理職、ス
タートアップなどの講演者を招聘しております。講演セッション、技術展示、出展者プレゼンテーショ
ン、ネットワーキングレセプションなど、すべての機会を通して、技術ならびに事業展開の拡大の議論を深めて頂けますことを願っております。
多くの方々のご参加をお待ちしております。

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MEF Organizing Committee
MEF 組織委員会
委員長
副委員長
執行委員

委員

田中 秀治
三宅 亮
稲子 みどり
石田 博之
大高 剛一
田中 雅彦
赤羽 優子
安藤 妙子
早川 康男
日暮 栄治
飯田 淳
金森 義明
川原 伸章
古賀 章浩
小柳 治
三田 正弘
長畑 隆也
荻浦 美嗣
澤田 和明
積 知範
瀧本 貞治
蛸島 武尚
土屋 智由
山西 陽子
吉田 隆司

Chair
Shuji Tanaka
Vice Chair
Ryo Miyake
Executive Committee Member
Midori Inako
Hiroyuki Ishida
Koichi Ohtaka
Masahiko Tanaka
Committee
Yuko Akabane
Taeko Ando
Yasuo Hayakawa
Eiji Higurashi
Jun Iida
Yoshiaki Kanamori
Nobuaki Kawahara
Akihiro Koga
Osamu Koyanagi
Masahiro Mita
Takaya Nagahata
Mitsugu Ogiura
Kazuaki Sawada
Tomonori Seki
Sadaharu Takimoto
Takehisa Takoshima
Toshiyuki Tsuchiya
Yoko Yamanishi
Takashi Yoshida

東北大学
東京大学
HOLST Centre Japan
ズース・マイクロテック株式会社
東北大学
SPP テクノロジーズ株式会社
株式会社ティ・ディ・シー
立命館大学
アルプスアルパイン株式会社
東北大学
TDK 株式会社
東北大学
株式会社デンソー
キヤノンメディカルシステムズ株式会社
株式会社日本企業成長投資株式会社協同インターナショナル
ラピスセミコンダクタ株式会社
株式会社村田製作所
豊橋技術科学大学
オムロン株式会社
浜松ホトニクス株式会社
東北大学
京都大学
九州大学
横河電機株式会社
Tohoku University
The University of Tokyo
HOLST Centre JapanSUSS MicroTec KK
Tohoku University
SPP Technologies Co., Ltd.
TDC Corporation
Ritsumeikan University
ALPSALPINE Co., Ltd.
Tohoku University
TDK Corporation
Tohoku University
DENSO Corporation
Canon Medical Systems Corporation
Nippon Investment Company
Kyodo International Inc.
Lapis Semiconductor
Murata Manufacturing Co., Ltd
Toyohashi University of Technology
OMRON Corporation
Hamamatsu Photonics K.K.
Tohoku University
Kyoto University
Kyushu University
Yokogawa Electric Corporation
敬称略氏名 ABC 順

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MEF International Advisory Committee
MEF 国際諮問委員会
委員長
副委員長

委員

桑野
江刺
神永

博喜
正喜
晉

小林 直人
Jean-Christophe Eloy
WeiLeun Fang
Udo-Martin Gómez
Thomas Kenny
Xinxin Li
宮島 博志
野々村 裕
Kurt Petersen

Chair
Vice Chair

Hiroki Kuwano
Masayoshi Esashi
Susumu Kaminaga

Naoto Kobayashi
Committee Member
Jean-Christophe Eloy
WeiLeun Fang
Udo-Martin Gomez
Thomas Kenny
Xinxin Li
Hiroshi Miyajima
Yutaka Nonomura
Kurt Petersen

東北大学
東北大学
SPP テクノロジーズ株式会社/SK グローバルアドバイザーズ株式会社
早稲田大学
Yole Developpement
National Tsing Hua University
Robert Bosch
Stanford University
Shanghai Institute of Microsystem andInformation Technology
住友精密工業株式会社
元名城大学
Silicon Valley Band of Angels

Tohoku University
Tohoku University
SPP Technologies Co., Ltd./SK Global Advisers Co., Ltd.
Waseda University
Yole Developpement
National Tsing Hua University
Robert Bosch
Stanford University
Shanghai Institute of Microsystem andInformation Technology
SUMITOMO PRECISION PRODUCTS, Co., Ltd.
Formerly with Meijo University
Silicon Valley Band of Angels

敬称略 氏名 ABC 順

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MEF Organizing Committee
MEF2022 Working GroupMEF Organizing committee formed three working groups to enhance the activities.
The leaders and members of the following working group contributed to build up new
program schemes with the support from the global notable speakers, exhibitors, andsponsors.
<Program Working Group>
LeaderMember

田中
古賀
安藤
荻浦

雅彦
章浩
妙子
美嗣

SPP テクノロジーズ株式会社
キヤノンメディカルシステムズ株式会社
立命館大学
株式会社村田製作所<Business Working Group>
Co-leader
Co-leader
Member

石田
大高
早川
瀧本

博之
剛一
康男
貞治

ズース・マイクロテック株式会社
東北大学
アルプスアルパイン株式会社
浜松ホトニクス株式会社<Networking Working Group>
LeaderMember

稲子
赤羽
蛸島
三田

みどり
優子
武尚
正弘

HOLST Centre Japan
株式会社ティ・ディ・シー
東北大学
株式会社協同インターナショナル<Program Working Group>
LeaderMemberMasahiko Tanaka
Akihiro Koga
Taeko Ando
Mitsugu Ogiura

SPP Technologies Co., Ltd.
Canon Medical Systems Corporation
Ritsumeikan University
Murata Manufacturing Co., Ltd<Business Working Group>
Co-leader
Co-leader

Hiroyuki Ishida
Koichi Ohtaka
Yasuo Hayakawa
Sadaharu Takimoto

SUSS MicroTec KK
Tohoku University
ALPSALPINE Co., Ltd.
Hamamatsu Photonics K.K.

<Networking Working Group>
LeaderMemberMidori Inako
Yuko Akabane
Takehisa Takoshima
Masahiro Mita

HOLST Centre JapanTDC Corporation
Tohoku University
Kyodo International Inc.
敬称略

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Welcome to the 13th MEF
MEF 組織委員長/東北大学 教授 田中 秀治
Shuji Tanaka
MEF Organizing Committee Chair
Professor
Micro Electro Mechanical Systems Lab.
Tohoku University

Welcome to 13th MEMS Engineer Forum (MEF). MEF celebrated 10th anniversary in 2018 andis now recognized as one of the best business development conferences in the field of MEMS.
More than two years have passed since COVID-19 has spread all over the world. We needed tocancel MEF in 2020, and the last year’s MEF was held online. MEF 2021 was successful, collecting
941 registrations. However, it was unfortunate that there was less chances for networking becauseof the limitation of the online format. The benefits of MEF include a plenty of networking chancesamong attendees as well as lectures on hot topics by excellent invited speakers and theexhibitions of the latest technology by our sponsors/exhibitors. The organizing committee andthe international advisory committee continuously discussed how to organize this year’s MEF withcarefully watching the situation of the pandemic. Finally, we have decided to prepare for the onsite
meeting, expecting the progress of booster vaccination and its outcome.
When I am writing this welcome remark, COVID-19 situation is not as expected, and we are
not allowed to have MEF in the conventional complete manner. However, we will do the best to
create the time and place useful for both updating your knowledge and networking, taking careof disinfection. Please understand that we cannot have a reception party as usual. I sincerely
appreciate kind supports, contributions and efforts by our sponsors/exhibitors, speakers,
committee members and secretariat team. Without them, there is no success of MEF 2022 in sucha difficult situation. Thank you very much.
If you see the program, you can easily notice that there are so many attractive lectures also inthis year. I hope that you can feel the dynamism of strongly growing MEMS industry by attending
MEF. Please enjoy!
第 13 回 MEMS Engineer Forum（MEF）にご参加くださいまして、ありがとうございます。2018 年に10 周年を迎えた MEF は、お陰様で世界で最も充実した MEMS 関係のビジネスディベロップメント会議の 1
つになりました。
新型コロナウイルス感染症が世界を覆って、もう 2 年以上になります。2020 年の MEF は残念ながら中止せざるをえず、昨年、第 12 回 MEF はオンライン開催となりました。MEF 2021 は、941 名の方に登録頂き、
大きな成功を収めることができましたが、一方でオンラインゆえにネットワーキングの機会は少なかったという声も頂戴しました。MEF の提供する価値には、一流の招待講演者によるホットな話題の講演、スポンサー・
展示企業様による最新の技術展示はもちろんのこと、多様なネットワーキングの機会もあります。今回、MEF
2022 をどのような形で開催するのがよいか、組織委員会・国際アドバイザリ委員会の皆様と議論してきました。そして、3 回目のワクチン接種が進み、新型コロナウイルス感染症は落ち着いていくのではないかという希望のもと、現地開催の準備をしてきました。
この文章を書いている時点で、新型コロナウイルス感染症は収まったとは言えず、従来通りの現地開催とはいきませんが、感染予防対策をした上で、情報収取にもネットワーキングにも有益な場を作り出したいと思っています。このような状況ですので、恒例の懇親会は開催できないことをご了承下さい。このような困難な状況の中、MEF 2022 の開催に漕ぎつけられたのは、スポンサー・展示企業様、講師各位、MEF 委員各位、および事務局チーム各位の多大なるご支援・ご協力・ご努力のお陰です。この場を借りて、心より御礼申し上げます。
以下に今年の MEF の見どころをご説明します。今回も他ではなかなか聞けない魅力的な講演を集めました。
MEF 2022 に参加することで、力強く発展する MEMS 業界のダイナミズムを感じ取って頂けると確信しています。
【今年の見どころ】
MEMS 分野では、産業として確立したデバイス群が技術的にもビジネス的にも健全に成長を続けるとともに、スタートアップなどを通じてあらたな産業の種が次々として登場しています。これまでと同じように、今年のMEF でも MEMS 分野におけるこれら両方のダイナミズムをカバーします。また、MEMS のサプライチェーンや基盤技術の話題も取り揃えています。
6

〇MEMS のメインストリーム
慣性センサー、マイクロフォン、圧力センサーなどは代表的な MEMS で、しかも成長を続ける製品群です。
STMicroelectronics には新世代の慣性センサープラットフォームの話をして頂きます。本邦初公開です。また、最高性能のマイクロフォンを製造する Infineon Technologies にも講演をお願いしました。Yole
Développement からは今年も MEMS の市場動向を解説してもらいます。さらに、元立命館大学の木股雅章
先生にはパンデミックで注目される赤外線センサーについて解説して頂きます。スタンフォード大学のThomas Kenny 先生の講演もお楽しみに。
〇日本の MEMS
日本企業が MEMS 業界で活躍していることは言うまでもありません。多くのプレーヤーの中から、今回はMEMS 光干渉計やマイクロミラーを製造する浜松ホトニクス、光通信用 VOA（Variable Optical Attenuator）
や OCT（Optical Coherence Tomography）システムを製造する santec、およびメモリ用半導体プローブ
カードの大手である日本電子材料に講演をお願いしました。
〇スタートアップ
あらたなデバイスとアプリケーションを生み出す上で、スタートアップの役割はとても重要です。今年も選り
すぐりのスタートアップを招待しています。pMUT ベースのパーソナル超音波診断装置を開発する EXO、ボタンレススイッチを実現する超音波タッチセンサーの UltraSense Syetems、ポータブル水再生プラントのWOTA。これらの注目スタートアップの講演は、MEF 以外でなかなか聞くことができないはずです。また、
MEMS 分野のスタートアップを俯瞰した講演を、今年も MEMS 業界の重鎮である Kurt Petersen さんにして頂きますが、MEF 2022 を通じて最も注目すべき講演の 1 つになると思います。
〇MEMS ファウンドリMEMS スタートアップとペアになるのが MEMS ファウンドリです。
最近、MEMS ファウンドリは、
圧電 MEMSなどの新しいプラットフォーム技術を提供しています。今年は Robert Bosch と Vanguard International
Semiconductor に最新の MEMS プラットフォームを紹介して頂きます。
〇バイオ医療 MEMS
MEMS のバイオ医療分野への応用は着実に広がっています。今年は東京大学の佐久間一郎先生に手術支援ロ
ボットシステムに関する特別講演をお願いしています。また、ナノポア DNA シークエンサーを開発されている大阪大学の谷口正輝先生、およびハンドヘルド pMUT 診断装置を開発する EXO の創業者でもある Janusz
Bryzek さんの講演にも注目です。
〇基盤技術
プロセスツールは MEMS の基盤技術として最も重要なものの 1 つです。最近、接合技術が注目を集めていますが、接合装置の大手である EVG Group から最新技術を紹介してもらいます。また、SPTS Technologies
からは注目を集める圧電材料 ScAlN のドライエッチング技術について講演して頂きます。エッジコンピュー
ティングの 1 つとして、センサーに機械学習機能を搭載する動きが活発ですが、tiny ML Foundation による講演でその最新動向を掴んでください。産業界向けに新しい基盤技術を開発するオランダ・HOLST Center とフランス・CEA-Leti からの講演もお楽しみに。
〇SDG に関する特別講演
MEMS 業界を代表する企業である Robert Bosch の日本法人・ボッシュの Klaus Meder 社長から、同社における SDGs への対応についてお話をして頂きます。
〇パネルディスカッション
MEF 名物のパネルディスカッションを今年も開催します。例年、グランドフィナーレとしてパネルディスカ
ッションを行ってきましたが、海外からのパネラーにオンライン参加頂くことから、時差を考慮し、2 日目の午前中に行います。テーマは「What are the new areas for MEMS innovation and new MEMS Products?」です。モデレーターはおなじみの神永晉さん、パネラーは Kurt Petersen さん、Thomas Kenny 先生（スタンフォード大学）、Weileun Fang 先生（国立清華大学）、Klaus Meder さん（ボッシュ）、Gerog Bischopink
さん（Robert Bosch）です。乞うご期待！
〇展示会と Exhibitors' Presentation
出展企業による展示とプレゼンテーションは、講演と並ぶ MEF のメインディッシュです。このような難しい状況の中、今年も多くの企業に出展頂きました。Exhibitors' Presentation では、各企業が選りすぐりの情報を短時間にギュッと凝縮して発表しますので、効率よく最新の情報を収集できます。今年は質疑応答時間も確保していますので、プレゼンターと質問者のやり取りの中から、とっておきの話が聞けるかもしれません。

7

Venue Layout
3F: KFC Hall (Main seminar room) & Annex/Foyer (Exhibition)
Registration desk in Foyer

KFC Hall
Annex

Foyer

10F

Room 101-103 (Satellite seminar room)

Room 101-103

8

MEF 2022 SPONSORSMEMS Engineer Forum 2022 Organizing Committee andInternational Advisory Committee gratefully acknowledges
the following companies for their support.

★Gold Sponsor★Gold Sponsor

BMF Japan 株式会社BMF Japan Inc.

株式会社フルヤ金属

Furuya Metal Co., Ltd.

★Silver Sponsor★Silver Sponsor

AAC Technologies

AAC Technologies

アルプスアルパイン株式会社

ALPSALPINE Co. Ltd.

Coventor, A Lam Research Company

Coventor, A Lam Research Company

イーヴィグループジャパン株式会社

EV Group Japan K.K.

浜松ホトニクス株式会社

Hamamatsu Photonics K.K.

イノテック株式会社

INNOTECH CORPORATION株式会社 KOKUSAI ELECTRIC

KOKUSAI ELECTRIC CORPORATION

長野計器株式会社

NAGANOKEIKI CO., LTD.

長瀬産業株式会社

NAGASE Co., Ltd.

オクメティックオーワイ

Okmetic Oy

TDK 株式会社

TDK

ウシオ電機株式会社

Ushio Inc.

横河電機株式会社

Yokogawa Electric Corporation★Bronze Sponsor★Bronze Sponsor

アルス株式会社

ARS Co., Ltd.

アユミ工業株式会社

AYUMI INDUSTRY CO., LTD

アズビル株式会社

Azbil Corporation

株式会社クレステック

Crestec Corportaion

株式会社ディスコDISCO Corporation

ダウ・東レ株式会社

Dow Toray Co., Ltd.

株式会社荏原製作所

Ebara Corporation

ハイデルベルグ・インストルメンツ株式会社

Heidelberg Instruments KK

仙台スマートマシーンズ株式会社

Sendai Smart Machines Co., Ltd.

SK グローバルアドバイザーズ株式会社

SK Global Advisers Co., Ltd.

住友精密工業株式会社

SUMITOMO PRECISION PRODUCTS,
CO.,LTD.

9MEF 2022 EXHIBITORSMEMS Engineer Forum 2022 Organizing Committee andInternational Advisory Committee gratefully acknowledges
the following companies for their excellent technology exhibits.

★Regular Exhibitors★Regular Exhibitors

Adeia (Xperi)
株式会社アドバンストテクノロジー
エーエスエムエル・ジャパン株式会社
株式会社クレステック
ハイデルベルグ・インストルメンツ株式会社
ハイソル株式会社
興研株式会社株式会社 KOKUSAI ELECTRIC
協同インターナショナル
丸紅情報システムズ株式会社
株式会社メムス・コア
株式会社ミライズテクノロジーズ
株式会社村田製作所
日清紡マイクロデバイス株式会社
ポリテックジャパン株式会社
ローム株式会社
坂口電熱株式会社
新光電気工業株式会社
SK グローバルアドバイザーズ株式会社
SPP テクノロジーズ株式会社
住友精密工業株式会社
ズース・マイクロテック株式会社/
兼松 PWS 株式会社株式会社ティ・デイ・シー
ウシオ電機株式会社

Adeia (Xperi)
ADVANCED TECHNOLOGIES CO., LTD.
ASML Japan Co., Ltd.
Crestec Corportaion
Heidelberg Instruments KK
HiSOL, Inc.
KOKEN LTD
KOKUSAI ELECTRIC CORPORATION
Kyodo International, Inc.

★Start-up Exhibitors
BMF Japan 株式会社
マイクロ化学技研株式会社
タッチエンス株式会社★Academia Exhibitors
4 大学ナノ・マイクロファブリケーションコンソーシアム
CEA-Leti
電気学会センサ・マイクロマシン部門
MEMS パークコンソーシアム(MEMS PC)
一般財団法人マイクロマシンセンター
一般社団法人エレクトロニクス実装学会
東京大学 三宅研究室
東北大学マイクロシステム融合研究開発センター(µSIC)
東北大学 田中（秀）研究室

MARUBENI INFORMATION SYSTEMS Co., Ltd.

MEMS CORE CO.,LtdMIRISE Technologies Corporation
Murata Manufacturing Co., LTD.
Nisshinbo Micro Devices Inc.
Polytec Japan
ROHM Co., Ltd.
SAKAGUCHI E.H VOC CORP.
SHINKO ELECTRIC INDUSTRIES CO., LTD.
SK Global Advisers Co., Ltd.
SPP Technologies Co., Ltd.
SUMITOMO PRECISION PRODUCTS, CO., LTD.

SUSS MicroTec KK/Kanematsu PWS LTD.
TDC Corporation
Ushio Inc.

★Start-up Exhibitors
BMF Japan Inc.
Instistute of Microchemical Technology
Touchence Inc.

★Academia Exhibitors
4-University Nano/Micro Fabrication
Consortium
CEA-Leti
IEEJ Sensors and Micromachines
MEMS PARK CONSORTIUM
Micromachine Center
The Japan Institute of Electronics Packaging
The University of Tokyo - Miyake Lab
Tohoku University - Micro System
Integration Center
Tohoku University Tanaka Shuji Laboratory
10

MEF 2022 Booth Location
Foyer(3F)

Booth ＃

Annex
(3F)

機関名

Affiliation

R-01

住友精密工業株式会社

SUMITOMO PRECISION PRODUCTS, CO.,LTD.

R-02

株式会社ミライズテクノロジーズ

MIRISE Technologies Corporation

R-03

株式会社アドバンストテクノロジー

ADVANCED TECHNOLOGIES CO.,LTD.

R-04

協同インターナショナル

Kyodo International, Inc.

R-05

丸紅情報システムズ株式会社

MARUBENI INFORMATION SYSTEMS Co., Ltd.

R-06

ハイソル株式会社

HiSOL, Inc.

R-07

興研株式会社

KOKEN LTD

R-08

ポリテックジャパン株式会社

Polytec Japan

R-09

ズース・マイクロテック株式会社 / 兼松PWS株式会社

SUSS MicroTec KK/Kanematsu PWS LTD.

R-10

エーエスエムエル・ジャパン株式会社

ASML Japan Co., Ltd.

R-11

株式会社クレステック

Crestec Corportaion

R-12

Adeia (Xperi)

Adeia (Xperi)

R-13

株式会社メムス・コア

MEMS CORE CO.,Ltd

R-14

株式会社KOKUSAI ELECTRIC

KOKUSAI ELECTRIC CORPORATION

R-15

新光電気工業株式会社

SHINKO ELECTRIC INDUSTRIES CO., LTD.

R-16

SKグローバルアドバイザーズ株式会社

SK Global Advisers Co., Ltd.

R-17

株式会社ティ・デイ・シー

TDC Corporation

R-18

株式会社村田製作所

Murata Manufacturing Co., LTD.

R-19

日清紡マイクロデバイス株式会社

Nisshinbo Micro Devices Inc.

R-20

ローム株式会社

ROHM Co., Ltd.

R-21

ハイデルベルグ・インストルメンツ株式会社

Heidelberg Instruments KK

R-22

坂口電熱株式会社

SAKAGUCHI E.H VOC CORP.

R-23

SPPテクノロジーズ株式会社

SPP Technologies Co., Ltd.

ウシオ電機株式会社

Ushio Inc.

V-1

タッチエンス株式会社

Touchence Inc.

V-2

BMF Japan株式会社

BMF Japan Inc.

V-3

マイクロ化学技研株式会社

Instistute of Microchemical Technology

A-1

4大学ナノ・マイクロファブリケーションコンソーシアム 4-University Nano/Micro Fabrication Consortium

A-2

東京大学 三宅研究室

The University of Tokyo - Miyake Lab

A-3

一般社団法人エレクトロニクス実装学会

The Japan Institute of Electronics Packaging

A-4（一財）マイクロマシンセンター

Micromachine Center

A-5

電気学会センサ・マイクロマシン部門

IEEJ Sensors and Micromachines

A-6

東北大学 田中（秀）研究室

Tohoku University Tanaka Shuji Laboratory

A-7

MEMSパークコンソーシアム(MEMS PC)

MEMS PARK CONSORTIUM

A-8

東北大学マイクロシステム融合研究開発センター(µSIC)

Tohoku University - Micro System Integration Center

A-9

CEA-Leti

CEA-Leti

11

MEF 2022 Program Schedule
Wednesday, April 20, 2022 (JST, UTC+0900)
09:10-09:20

Opening Remarks
Prof. Shuji Tanaka
Chairperson of MEF Executive Committee, Professor, Tohoku University

09:20-10:25

Session: New Areas for MEMS Innovation 1 - Biomedical Chaired by: Masahiko Tanaka/SPP Technologies Co., Ltd.

09:20-10:00

Keynote speech: Exponential Disruption of Medical Imaging
Dr. Janusz Bryzek, Co-Founder and Executive Board Chairman
EXO, USA

10:00-10:25

Invited Speech: Commercialization of an AI-nanopore Platform to
Revolutionize Inspection Systems
Prof. Masateru Taniguchi, Professor, SANKEN, Osaka University, Japan

10:25-10:35

Break

10:35-11:50

Session: Main Stream of MEMS 1
Chaired by: Mitsugu Ogiura/Murata Manufacturing Co., Ltd

10:35-11:00

Invited Speech: tinyML Solution for New Data Driven World
Dr. Evgeni Gousev, Senior Director, Qualcomm AI Researchand Chairman, Board of Directors, tinyML Foundation, USA

11:00-11:25

Invited Speech: Near-infrared spectrometer using MOEMS technology
Ms. Anna Yoshida, Section Chief, MEMS, Solid state division
Hamamatsu Photonics K.K., Japan

11:25-11:50

Invited Speech: Development of OCT products by using MEMS technology
Dr. Keiji Isamoto, Executive officer, President of OIS company
santec corporation, Japan

11:50-12:40

Lunch Break

12:40-13:40

Exhibitors' presentation & Exhibit Hour
Chaired by: Sadaharu Takimoto/Hamamatsu Photonics
TDC Corporation
ROHM Co., Ltd.
ADVANCED TECHNOLOGIES CO., LTD.
SUSS MicroTec KK/Kanematsu PWS LTD.
Adeia (Xperi)
BMF Japan

13:40-15:05

Exhibit Hour

15:05-15:55

Session: Main Stream of MEMS 2
Chaired by: Nobuaki Kawahara/Denso Corporation

15:05-15:30

Invited Speech: Bosch MEMS Foundry
Dr. Georg Bischopink, Vice President, Product Area Sensors and Sensor
Development, Robert Bosch GmbH, Germany

15:30-15:55

Invited Speech: MEMS Development and Fabrication During the Current
Challenging Time12

Dr. Rakesh Chand Tripathi, MTS-MEMS(TD)
Vanguard International Semiconductor Corporation, Singapore
15:55-16:05

Break

16:05-17:05

Exhibitors' Presentation & Exhibit Hour
Chaired by: Yasuo Hayakawa/AlpsAlpine
Touchence Inc.
Kyodo International, Inc.
SPP Technologies Co., Ltd.
MARUBENI INFORMATION SYSTEMS Co., Ltd.
Ushio Inc.

17:05-17:15

Break

17:15-18:30

Session: New Areas for MEMS Innovation 2
Chaired by: Hiroshi Miyajima/SUMITOMO PRECISION PRODUCTS, CO., LTD.

17:15-17:40

Invited Speech: What is the fuel that will propel the MEMS market growth?
Dr. Dimtros Damianos, Senior Analyst, Photonics & Sensing Division,
Yole Développement, France

17:40-18:05

Invited Speech: Large-Area Sensing Surfaces and Human MachineInterfaces Enabled by Hybrid Printed Electronics
Dr. Peter Zalar, HOLST Centre, The Netherlands

18:05-18:30

Invited Speech: MEMS technologies in an ever more demanding world
Dr. Samer Dagher, Research Engineer, Department of Silicon Components,
CEA-Leti, France

Thursday, April 21 (JST, UTC+9)
08:40-08:45

The 2nd Day Opening Remarks
Mr. Masahiko Tanaka, MEF Steering Committee
Program Working Group Leader
SPP Technologies Co., Ltd., Japan

08:45-09:50

Special Session: Environmental Technology
Chaired by: Masahiko Tanaka/SPP Technologies Co., Ltd.

08:45-09:25

Special Lecture: The climate neutral company - How Bosch has becomecarbon neutral by 2020 and where to go further
Mr. Klaus Meder, President and Representative Director
Bosch Corporation, Japan

09:25-09:50

Invited Speech: Application of Sensing Technology in Small-scale
Decentralized Water Recycling System
Mr. Shohei Okudera, Director, WOTA CORP., Japan

09:50-10:00

Break

13

10:00-11:05

Session: New Areas for MEMS Innovation 3 and Panel Discussion
Chaired by: Masahiko Tanaka/SPP Technologies Co., Ltd.

10:00-10:40

Keynote Speech: The Impact of Key New Technologies and Capabilities on
the Future of MEMS
Dr. Kurt Petersen, Silicon Valley Band of Angels, USA

10:40-11:05

Invited Speech: Lessons Learned from 10+ Years of Epi-Seal Fabrication
Runs at Stanford
Prof. Thomas Kenny, Professor, Stanford University, USA

11:05-12:05

Panel Discussion:
What are the New areas for MEMS Innovation and New MEMS
Products?
Moderator: Mr. Susumu Kaminaga, Executive Senior Advisor
SPP Technologies Co., Ltd., Japan
Panelists:
Dr. Kurt Petersen, Silicon Valley Band of Angels, USA
Prof. Thomas Kenny, Professor, Stanford University, USA
Prof. Weileun Fang, NTHU Chair Professor, Power Mech. Eng.
Department, National Tsing Hua University, Taiwan
Mr. Klaus Meder, President and Representative Director
Bosch Corporation, Japan
Dr. Georg Bischopink, Vice President, Product Area Sensors
and Sensor Development, Robert Bosch GmbH, Germany

12:05-12:50

Lunch Time

12:50-13:30

Special Session: Medical Robotics
Chaired by: Akihiro Koga/Canon Medical Systems Corporation

12:50-13:30

Special lecture: Integration of Bio-Mechatronics, Biomedical
Instrumentation, and Bioscience for Minimally Invasive Therapies
Prof. Ichiro Sakuma, Director, Research Institute for Biomedical Science andEngineering, Professor, Medical Device Development and Regulation
Research Center, Department of Bioengineering, Department of Precision
Engineering. School of Engineering, The University of Tokyo

13:30-13:55

Session: Main Stream of MEMS 3
Chaired by: Akihiro Koga/Canon Medical Systems Corporation

13:30-13:55

Invited Speech: AI Enabled Touch User Interface for Smart Surfaces
Mr. Mo Maghoudnia, Founder/CEO, UltraSense Systems Inc., USA

13:55-14:55

Exhibitors' presentation & Exhibit Hours
Chaired by: Hiroyuki Ishida/Suss Microtec
SAKAGUCHI E.H VOC CORP.
ASML Japan Co., Ltd.
Polytec Japan
Nisshinbo Micro Devices Inc.
SHINKO ELECTRIC INDUSTRIES CO., LTD.
SUMITOMO PRECISION PRODUCTS CO., LTD.
14

14:55-15:30

Exhibit Hour Exhibition ends at 15:30

15:30-16:45

Session: Main Stream of MEMS 4
Chaired by: Akihiro Koga/Canon Medical Systems Corporation andYasuo Hayakawa/AlpsAlpine

15:30-15:55

Invited Speech: Improving the performance of intelligent MEMS motion
sensors with ST's new Thelma Double technology
Mr. Giorgio Allegato, Technology Development Manager, Analog, MEMS &Sensors Group, STMicroelectronics, Italy

15:55-16:20

Invited Speech: Uncooled Infrared Focal Plane Arrays
Dr. Masafumi Kimata, Formerly Ritsumeikan University, Japan

16:20-16:45

Invited Speech: How context awareness can help to further extent battery
lifetime in TWS
Dr. Gunar Lorenz, Senior Director, Technical Marketing Sensor
Infineon Technologies AG, Germany

16:45-16:55

Break

16:55-18:15 Session: Core Equipment Technology for MEMS
Chaired by: Taeko Ando/Ritsumeikan University
16:55-17:20

Invited Speech: Probe cards with MEMS probes
Ms. Sachiko Hattori, Senior Specialist, MEMS DivisionJAPAN ELECTRONIC MATERIALS CORPORATION, Japan

17:20-17:45

Invited Speech: Wafer bonding for 3D/Heterogeneous integration
application
Mr. Hiroshi Yamamoto, Representative Director
EV Group Japan K.K., Japan

17:45-18:10

Invited Speech: Etch Challenges and Solutions for Highly Doped AlScN
Films used in PiezoMEMS Applications
Mrs. Joanne Carpenter, Senior Product Manager - Etch
SPTS Technologies Ltd., U.K.

18:10-18:15

Closing Ceremony

18:10-18:15

Closing Remarks
Prof. Ryo Miyake, Vice Chair of MEF Steering Committee
Professor, The University of Tokyo

15

MEF 2022 プログラムスケジュール
Wednesday, April 20, 2022 (JST, UTC+0900)
09:10-09:20

Opening Remarks
Prof. Shuji Tanaka
Chairperson of MEF Executive Committee, Professor, Tohoku University
開会の辞 MEF 組織委員会委員長
東北大学 大学院 工学研究科 ロボティクス専攻 教授 田中 秀治氏

09:20-10:25

Session: New Areas for MEMS Innovation 1 - Biomedical Chaired by: Masahiko Tanaka/SPP Technologies Co., Ltd.
田中 雅彦氏（SPP テクノロジーズ株式会社）

09:20-10:00

Keynote speech: Exponential Disruption of Medical Imaging
Dr. Janusz Bryzek, Co-Founder and Executive Board Chairman
EXO, USA

10:00-10:25

Invited Speech: Commercialization of an AI-nanopore Platform to
Revolutionize Inspection Systems
Prof. Masateru Taniguchi, Professor, SANKEN, Osaka University, Japan
検査システムを革新する AI ナノポアプラットフォームの事業化
大阪大学 産業科学研究所 教授 谷口 正輝氏

10:25-10:35

Break

10:35-11:50

Session: Main Stream of MEMS 1
Chaired by: Mitsugu Ogiura/Murata Manufacturing Co., Ltd
荻浦 美嗣氏（株式会社村田製作所）

10:35-11:00

Invited Speech: tinyML Solution for New Data Driven World
Dr. Evgeni Gousev, Senior Director, Qualcomm AI Researchand Chairman, Board of Directors, tinyML Foundation, USA

11:00-11:25

Invited Speech: Near-infrared spectrometer using MOEMS technology
Ms. Anna Yoshida, Section Chief, MEMS , Solid state division
Hamamatsu Photonics K.K., JapanMOEMS 技術を用いた近赤外分光器
浜松ホトニクス株式会社 固体事業部 MEMS 部 専任部員 吉田 杏奈氏

11:25-11:50

Invited Speech:Development of OCT products by using MEMS technology
Dr. Keiji Isamoto, Executive officer, President of OIS company
santec corporation, JapanMEMS 技術を用いた OCT 技術の開発
Santec 株式会社 執行役員、OIS カンパニー長 諫本 圭史氏

11:50-12:40

Lunch Break16

12:40-13:40

Exhibitors' presentation & Exhibit Hour
Chaired by: Sadaharu Takimoto/Hamamatsu Photonics
瀧本 貞治氏（浜松ホトニクス）
TDC Corporation 株式会社ティ・デイ・シー
ROHM Co., Ltd.

ローム株式会社

ADVANCED TECHNOLOGIES CO.,LTD. 株式会社アドバンストテクノロジー
SUSS MicroTec KK/Kanematsu PWS LTD.
ズース・マイクロテック株式会社 / 兼松 PWS 株式会社
Adeia (Xperi)
BMF Japan
13:40-15:05

Exhibit Hour

15:05-15:55

Session: Main Stream of MEMS 2
Chaired by: Nobuaki Kawahara/Denso Corporation
川原 伸章氏（株式会社デンソー）

15:05-15:30

Invited Speech: Bosch MEMS Foundry
Dr. Georg Bischopink, Vice President, Product Area Sensors and Sensor
Development, Robert Bosch GmbH, Germany

15:30-15:55

Invited Speech: MEMS Development and Fabrication During the Current
Challenging Time
Dr. Rakesh Chand Tripathi, MTS-MEMS(TD)
Vanguard International Semiconductor Corporation, Singapore

15:55-16:05

Break

16:05-17:05

Exhibitors' Presentation & Exhibit Hour
Chaired by: Yasuo Hayakawa/AlpsAlpine
早川 康男氏（アルプスアルパイン）
Touchence Inc.

タッチエンス株式会社

Kyodo International, Inc.

協同インターナショナル

SPP Technologies Co., Ltd.

SPP テクノロジーズ株式会社

MARUBENI INFORMATION SYSTEMS Co., Ltd.
USHIO Inc.

丸紅情報システムズ株式会社

ウシオ電機株式会社

17:05-17:15

Break

17:15-18:30

Session: New Areas for MEMS Innovation 2
Chaired by: Hiroshi Miyajima/SUMITOMO PRECISION PRODUCTS, CO., LTD.
宮島 博志氏（住友精密工業株式会社）

17:15-17:40

Invited Speech: What is the fuel that will propel the MEMS market growth?
Dr. Dimtros Damianos, Senior Analyst, Photonics & Sensing Division,
Yole Développement, France

17:40-18:05

Invited Speech: Large-Area Sensing Surfaces and Human MachineInterfaces Enabled by Hybrid Printed Electronics
Dr. Peter Zalar, HOLST Centre, The Netherlands

18:05-18:30

Invited Speech: MEMS technologies in an ever more demanding world
Dr. Samer Dagher, Research Engineer, Department of Silicon Components,
CEA-Leti, France
17

Thursday, April 21 (JST, UTC+9)
08:40-08:45

The 2nd Day Opening Remarks
Mr. Masahiko Tanaka, MEF Steering Committee
Program Working Group Leader
SPP Technologies Co., Ltd., Japan田中 雅彦氏（SPP テクノロジーズ株式会社）
08:45-09:50 Special Session: Environmental Technology
Chaired by: Masahiko Tanaka/SPP Technologies Co., Ltd.
田中 雅彦氏（SPP テクノロジーズ株式会社）
08:45-09:25
Special Lecture: The climate neutral company - How Bosch has becomecarbon neutral by 2020 and where to go further
Mr. Klaus Meder, President and Representative Director
Bosch Corporation, Japan
09:25-09:50
Invited Speech: Application of Sensing Technology in Small-scale
Decentralized Water Recycling System
Mr. Shohei Okudera, Director, WOTA CORP., Japan
小規模分散型水循環システムにおけるセンシング技術の活用
WOTA 株式会社 取締役 奥寺 昇平氏
09:50-10:00

Break

10:00-11:05

Session: New Areas for MEMS Innovation 3 and Panel Discussion
Chaired by: Masahiko Tanaka/SPP Technologies Co., Ltd.

田中 雅彦氏（SPP テクノロジーズ株式会社）
10:00-10:40
Keynote Speech: The Impact of Key New Technologies and Capabilities on
the Future of MEMS
Dr. Kurt Petersen, Silicon Valley Band of Angels, USA
10:40-11:05
Invited Speech: Lessons Learned from 10+ Years of Epi-Seal Fabrication
Runs at Stanford.
Prof. Thomas Kenny, Professor, Stanford University, USA
11:05-12:05 Panel Discussion:
What are the New areas for MEMS Innovation and New MEMS
Products?
MEMS イノベーションのための新しい領域と新しい MEMS 製品は何か？
Moderator:
Mr. Susumu Kaminaga, Executive Senior Advisor
SPP Technologies Co., Ltd., JapanSPP テクノロジーズ株式会社エグゼキュティブシニアアドバイザー
神永 晉氏
Panelists:
Dr. Kurt Petersen, Silicon Valley Band of Angels, USA
Prof. Thomas Kenny, Professor, Stanford University, USA
Prof. Weileun Fang, NTHU Chair Professor, Power Mech. Eng.
Department, National Tsing Hua University, Taiwan
18Mr. Klaus Meder, President and Representative Director
Bosch Corporation, Japan
Dr. Georg Bischopink, Vice President, Product Area Sensors
and Sensor Development, Robert Bosch GmbH, Germany
12:05-12:50

Lunch Time

12:50-13:30

Special Session: Medical Robotics
Chaired by: Akihiro Koga/Canon Medical Systems Corporation

12:50-13:30

古賀 章浩氏（キヤノンメディカルシステムズ株式会社）Special Lecture: Integration of Bio-Mechatronics, Biomedical
Instrumentation, and Bioscience for Minimally Invasive Therapies
Prof. Ichiro Sakuma, Director, Research Institute for Biomedical Science andEngineering, Professor, Medical Device Development and Regulation
Research Center, Department of Bioengineering, Department of Precision
Engineering. School of Engineering, The University of Tokyo
低侵襲治療のためのバイオメカトロニクス，生体計測，生命科学の統合
東京大学 臨床生命医工学連携機構 機構長、大学院工学系研究科
医療福祉工学開発評価研究センター

13:30-13:55

教授 佐久間 一郎氏

Session: Main Stream of MEMS 3
Chaired by: Akihiro Koga/Canon Medical Systems Corporation

古賀 章浩氏（キヤノンメディカルシステムズ株式会社）
13:30-13:55
Invited Speech: AI Enabled Touch User Interface for Smart Surfaces
Mr. Mo Maghoudnia, Founder/CEO, UltraSense Systems Inc., USA
13:30-14:30 Exhibitors' presentation & Exhibit Hours
Chaired by: Hiroyuki Ishida/Suss Microtec
石田 博之氏（ズース・マイクロテック）
SAKAGUCHI E.H VOC CORP. 坂口電熱株式会社
ASML Japan Co., Ltd.

エーエスエムエル・ジャパン株式会社
Polytec Japan
ポリテックジャパン株式会社
Nisshinbo Micro Devices Inc. 日清紡マイクロデバイス株式会社
SHINKO ELECTRIC INDUSTRIES CO., LTD. 新光電気工業株式会社
SUMITOMO PRECISION PRODUCTS CO., LTD. 住友精密工業株式会社
14:30-15:30 Exhibit Hour Exhibition ends at 15:30
15:30-16:45 Session: Main Stream of MEMS 4
Chaired by: Akihiro Koga/Canon Medical Systems Corporation andYasuo Hayakawa/AlpsAlpine
古賀 章浩氏（キヤノンメディカルシステムズ株式会社）
早川 康男氏（アルプスアルパイン）
15:30-15:55
Invited Speech: Improving the performance of intelligent MEMS motion
sensors with ST's new Thelma Double technology
Mr. Giorgio Allegato, Technology Development Manager, Analog, MEMS &Sensors Group, STMicroelectronics, Italy

19

15:55-16:20

Invited Speech: Uncooled Infrared Focal Plane Arrays
Dr. Masafumi Kimata, Formerly Ritsumeikan University, Japan

非冷却赤外線イメージセンサ
元立命館大学 木股 雅章氏
16:20-16:45

Invited Speech: How context awareness can help to further extent battery
lifetime in TWS
Dr. Gunar Lorenz, Senior Director, Technical Marketing Sensor
Infineon Technologies AG, Germany

16:45-16:55

Break

16:55-18:15 Session: Core Equipment Technology for MEMS
Chaired by: Taeko Ando/Ritsumeikan University
16:55-17:20

安藤 妙子氏（立命館大学）
Invited Speech: Probe cards with MEMS probes
Ms. Sachiko Hattori, Senior Specialist, MEMS DivisionJAPAN ELECTRONIC MATERIALS CORPORATION, JapanMEMS プローブカード
日本電子材料株式会社 シニアスペシャリスト／MEMS 統括 服部 佐知子氏

17:20-17:45

Invited Speech: Wafer bonding for 3D/Heterogeneous integration
application
Mr. Hiroshi Yamamoto, Representative Director
EV Group Japan K.K., Japan

最新接合技術による 3D およびヘテロ集積化
イーヴィグループジャパン株式会社 代表取締役 山本 宏氏
17:45-18:10

Invited Speech: Etch Challenges and Solutions for Highly Doped AlScN
Films used in PiezoMEMS Applications
Mrs. Joanne Carpenter, Senior Product Manager - Etch
SPTS Technologies Ltd., U.K.

18:10-18:15

Closing Remarks
Prof. Ryo Miyake, Vice Chair of MEF Steering Committee
Professor, The University of Tokyo

閉会の辞 MEF 組織委員長副委員長
東京大学 大学院工学系研究科 バイオエンジニアリング専攻 教授 三宅 亮氏

20

MEF 2022 Exhibitor Presentation
Date/Time# Affiliation

April 20, 2022

Presentatioin Title

Exhibitors Presentation Session

Presenter

Chaired by: Sadaharu Takimoto/Hamamatsu Photonics

1 TDC Corporation

Ultra Precise Polishing Service ~Plasma-Assisted Polishing~

Chisato Maeda

2 ROHM Co., Ltd.

ROHM Group Technology Synergies Enable Innovative Products

Takashi Naiki

3 ADVANCED TECHNOLOGIES CO.,LTD.

Introduction of the latest case studies/trends of IntelliSuite, Total MEMS Solutions

Hirade Ryuichi

SUSS MicroTec KK/Kanematsu PWS

SUSS MICROTEC“GREEN” WAFER CLEANER AND INKJETPRINTER FOR MEMSLTD.

APPLICATIONS

12:40-13:40
45 Adeia (Xperi)

Abul Nuruzzaman

6 BMF Japan
April 20, 2022

Application of PμSL 3D Printing inResearch and Fabrication in Laboratory

Exhibitors Presentation Session

actile sensors based on MEMS technology

Polymer MEMS

3 SPP Technologies Co., Ltd.
MARUBENI INFORMATION SYSTEMS
Co., Ltd.

Exhibitors Presentation Session

Toshinori Ichijo

MEMS Manufacturing Equipment of SPP Technologies

Tsuyoshi Fujimura

Surface activated bonding system

Hirotaka Takeda

Full projection field aligner

5 Ushio Inc.
April 21, 2022

Naoya Maruyama

Introduction of MEMS foundry & Micro-Nanofabrication Prototyping service, and2 Kyodo International, Inc.

4

Junhui Lu (June)

Chaired by: Yasuo Hayakawa/AlpsAlpine

1 Touchence Inc.

16:05-17:05

Hiroyuki Ishida

Masato Kaneda

Introduction for UX-4 series
Chaired by: Hiroyuki Ishida/Suss Microtec

1 SAKAGUCHI E.H VOC CORP.

Atomic-Antialiasing Annealing Minimal Fab Tool

Kengo Hamada

2 ASML Japan Co., Ltd.

ASML products and services for MEMS market

Yuji Takai

3 Polytec Japan

Visualization of dynamic response of capped MEMSFrancois Bouteille

4 Nisshinbo Micro Devices Inc.

Smart sensing module design technologies of Nisshinbo Micro Devices

Takashi OMICHIIntroduction of Sensing Edge Device

Horiuchi Takuya"MEMS Solutions" in Sumitomo Precision Group

Hiroshi Miyajima

プレゼンテーションタイトル

プレゼンター

13:55-14:55

5
6

Date/TimeSHINKO ELECTRIC INDUSTRIES CO.,LTD.
SUMITOMO PRECISION PRODUCTS CO.,LTD.

# 所属機関名

April 20, 2022

Exhibitors Presentation Session

Chaired by: Sadaharu Takimoto/Hamamatsu Photonics

瀧本 貞治氏（浜松ホトニクス）

1 株式会社ティ・デイ・シー

超精密研磨加工～プラズマ援用研磨～

前田 知里

2 ローム株式会社

ROHM Group Technology Synergies Enable Innovative Products

内貴 崇

3 株式会社アドバンストテクノロジー

MEMS用統合解析ツールIntelliSuiteの最新事例と動向の紹介

平出 隆一

12:40-13:40
4

ズース・マイクロテック株式会社 /SUSS MICROTEC“GREEN” WAFER CLEANER AND INKJETPRINTER FOR

兼松PWS株式会社

MEMS APPLICATIONS

5 Adeia (Xperi)

Abul Nuruzzaman

6 BMF Japan
April 20, 2022

Application of PμSL 3D Printing inResearch and Fabrication in Laboratory

Exhibitors Presentation Session

Chaired by: Yasuo Hayakawa/AlpsAlpine

1 タッチエンス株式会社

April 21, 2022

Junhui Lu (June)

早川 康男氏（アルプスアルパイン）

MEMS技術による触覚センサ

丸山 尚哉

MEMSファウンドリ及びマイクロ・ナノファブリケーションサービス、及びポリ

2 協同インターナショナル
16:05-17:05

石田 博之

マーMEMSの紹介

一條

智義

3 SPPテクノロジーズ株式会社

SPPテクノロジーズのMEMS製造装置

藤村 剛

4 丸紅情報システムズ株式会社

表面活性化接合装置

武田 弘高

5 ウシオ電機株式会社

一括プロジェクション露光装置のご紹介（UX-4シリーズ）

金田 優人

Exhibitors Presentation Session

Chaired by: Hiroyuki Ishida/Suss Microtec

石田 博之氏（ズース・マイクロテック）

1 坂口電熱株式会社

原子レベルアンチエイリアス熱処理ミニマル装置

濱田 健吾

2 エーエスエムエル・ジャパン株式会社

エーエスエムエルの提供するMEMS市場向け製品とサービス

高井 雄司

3 ポリテックジャパン株式会社

SiパッケージングMEMSの3次元ダイナミクスの可視化

フランソワ ブテイ

4 日清紡マイクロデバイス株式会社

日清紡マイクロデバイスのスマートセンシング・モジュール設計技術

大道 貴志

5 新光電気工業株式会社

センシングエッジデバイス紹介

堀内 拓哉

6 住友精密工業株式会社

住友精密グループの「MEMSソリューション」

宮島 博志

13:55-14:55

21

The following program schedule by time zone only for your reference.

April 20, 2022
April 20, 2022 (JST, CST, MYT, SGT, CEST)/April 19-20, 2022(PDT, EDT)
JST

JST

Start

Ending

time

Time

9:10

9:20

LengthPresentation Title

0:10 Opening

Prefix 1st Name

Last Name

Affiliation

JST
UCT+9

CST/MYT/
SGT
UCT+8

USA(PDT)

USA(EDT)

CEST

UCT-7

UCT-4

UTC+2

Prof.

Shuji

TanakaTohoku University

9:10

8:10

17:10

20:10

2:10

Dr.

Janusz

Bryzek

EXO

9:20

8:20

17:20

20:20

2:20

Prof.

Masateru

Taniguchi

Osaka University

10:00

9:00

18:00

21:00

3:00

10:15

9:15

18:15

21:15

3:15

Session: New Areas for MEMS Innovation 1 - Biomedical 9:20

10:00

0:40 Exponential Disruption of Medical Imaging

10:00

10:25

0:25

10:25

10:35

0:10

Commercialization of an AI-nanopore Platform to Revolutionize
Inspection Systems

Session: Main Stream of MEMS 1
10:35

11:00

0:25 tinyML Solution for New Data Driven WorldDr.

Evgeni

Gousev

Qualcomm Technologies, Inc.

10:35

11:00

18:35

21:35

3:35

11:00

11:25

0:25 Near-infrared spectrometer using MOEMS technology

Ms.

Anna

YoshidaHamamatsu Photonics K.K.

11:00

10:00

19:00

22:00

4:00

11:25

11:50

0:25 Development of OCT products by using MEMS technology

Dr.

Keiji

Isamotosantec corporation

11:25

10:25

19:25

22:25

4:25

11:50

12:40

0:50

11:15

10:15

19:15

22:15

4:15

Exhibitors' Presentation & Exhibit Hour
12:40

13:40

1:00 Exhibitor Presentation

12:40

11:40

20:40

23:40

5:40

13:40

15:05

1:25 Exhibit Hour

13:40

12:40

21:40

0:40

6:40

15:05

Session: Main Stream of MEMS 2
15:05

15:30

15:30

15:55

15:55

16:05

0:25 Bosch MEMS Foundry
0:25

MEMS Development and Fabrication During the Current

Challenging Time
0:10 Break

Dr.

Georg

Bischopink

Robert Bosch GmbH, Germany

14:05

23:05

2:05

8:05

Dr.

Rakesh Chand

Tripathi

Vanguard International Semiconductor Corporation,
15:30 Singapore
14:30

23:30

2:30

8:30
8:15

15:15

14:15

23:15

2:15

16:05-16:55 Exhibitors' Presentation & Exhibit Hour
16:05

17:05

1:00 Exhibitor Presentation

16:05

15:05

0:05

3:05

9:05

17:05

17:15

0:10 Break

17:05

16:05

1:05

4:05

10:05

Session: New Areas for MEMS Innovation 2
17:15

17:40

0:25 What is the fuel that will propel the MEMS market growth?

17:40

18:05

0:25

18:05

18:30

0:25 MEMS technologies in an ever more demanding world

Large-Area Sensing Surfaces and Human Machine Interfaces
Enabled by Hybrid Printed Electronics

Dr.

DimtrosDamianosYole Développement

17:15

16:15

1:15

4:15

10:15

Dr.

Peter

Zalar

HOLST Centre

17:40

16:40

1:40

4:40

10:40

Dr.

Samer

Dagher

CEA-Leti

18:05

17:05

2:05

5:05

11:05

22

April 21, 2022
April 21, 2022 (JST, CST, MYT, SGT, CEST)/April 20-21, 2022(PDT, EDT)
JST

JST

Start

Endingtime

Time

LengthPresentation Title

Prefix 1st Name

Last Name

Affiliation

JST
UDT+9

CST/MYT/
SGT
UDT+8

USA(PDT)

USA(EDT)

CEST

UDT-7

UDT-4

UTC+2

Special Session: Environmental Technology
8:40

8:45

0:05 2nd Day Opening

8:45

9:25

0:40

9:25

9:50

0:25

9:50

10:00

The climate neutral company - How Bosch has become carbon
neutral by 2020 and where to go further
Application of Sensing Technology in Small-scale Decentralized

Water Recycling System
0:10 BreakMr.

Masahiko

TanakaSPP Technologies Co., Ltd., Japan

8:40

7:40

16:40

19:40

1:40

Mr.

Klaus

Meder

Bosch Corporation, Japan

8:45

7:45

16:45

19:45

1:45

Mr.

ShoheiOkuderaWOTA CORP.

9:25

8:25

17:25

20:25

2:25

Dr.

Kurt

Petersen

Silicon Valley Band of Angels

10:00

9:00

18:00

21:00

3:00

Dr.

ThomasKenny

Stanford University

10:40

9:40

18:40

21:40

3:40

11:05

10:05

19:05

22:05

4:05

Mr.

SusumuKaminaga

SPP Technologies Co., Ltd., Japan

Dr.

Kurt

Petersen

Silicon Valley Band of Angels

Prof.

ThomasKenny

Stanford University

Prof.

WeileunFang

National Tsing Hua University, Taiwan

Mr.

Klaus

Meder

Bosch Corporation in Japan

Dr.

Georg

Bischopink

Robert Bosch GmbH, Germany
12:05

11:05

20:05

23:05

5:05

Session: New Areas for MEMS Innovation 3 and Panel Discussion
10:00

10:40

0:40

10:40

11:05

0:25

11:05

12:05

1:00

12:05

12:50

The Impact of Key New Technologies and Capabilities on the
Future of MEMS
Lessons Learned from 10+ Years of Epi-Seal Fabrication Runs at
Stanford
What are the New areas for MEMS Innovation and New
MEMS Products?

0:45 Lunch Time

Special Session: Medical Robotics

12:50

13:30

0:40

Integration of Bio-Mechatronics, Biomedical Instrumentation, andBioscience for Minimally Invasive Therapies

Prof.

IchiroSakumaThe University of Tokyo

12:50

11:50

20:50

23:50

5:50

Mr.

Mo

Maghoudnia

UltraSense Systems Inc.

13:30

12:30

21:30

0:30

6:30

Session: Main Stream of MEMS 3
13:30

13:55

0:25 AI Enabled Touch User Interface for Smart Surfaces

Exhibitors' Presentation & Exhibit Hour
13:55

14:55

1:00 Exhibitor Presentation

13:55

12:55

21:55

0:55

6:55

14:55

15:30

0:35 Exhibit Hour

14:55

13:55

22:55

1:55

7:55

Session: Main Stream of MEMS 4
Improving the performance of intelligent MEMS motion sensors

15:30

15:55

0:25

15:55

16:20

0:25 Uncooled Infrared Focal Plane Arrays

16:20

16:45

0:25

16:45

16:55

0:10

with ST's new Thelma Double technology

How context awareness can help to further extent battery lifetime
in TWS

Mr.

Giorgio

Allegato

STMicroelectronics

15:30

15:55

23:30

2:30

8:30

Dr.

Masafumi

KimataFormerly with Ritsumeikan University

15:55

14:55

23:55

2:55

8:55

Dr.

Gunar

LorenzInfineon Technologies AG

16:20

16:45

0:20

3:20

9:20

Session: Core Equipment Technology for MEMS
16:55

17:20

0:25 Probe cards with MEMS probes

Ms.

Sachiko

HattoriJAPAN ELECTRONIC MATERIALS CORPORATION
16:55

15:55

0:55

3:55

9:55

17:20

17:45

0:25 Wafer bonding for 3D/Heterogeneous integration application

Mr.

Hiroshi

Yamamoto

EV Group Japan K.K.

17:20

16:20

1:20

4:20

10:20

17:45

18:10

0:25

Mrs.

JoanneCarpenter

SPTS Technologies Ltd.

17:45

16:45

1:45

4:45

10:45

18:10

18:15

0:05

Prof.

Ryo

MiyakeThe University of Tokyo

18:10

17:10

2:10

5:10

11:10

Etch Challenges and Solutions for Highly Doped AlScN Films usedin PiezoMEMS Applications

23

MEF 2022 Speakers
Wednesday, April 20, 2022 (JST, UTC+0900)
9:20-10:25

Session: New Areas for MEMS Innovation 1 – Biomedical -9:20- 10:00

Keynote speech:
Exponential Disruption of Medical Imaging
Dr. Janusz Bryzek, Co-Founder andExecutive Board Chairman
EXO, USA<Abstract>
This keynote talk will cover the following themes:-

Introduction to medical imaging market and its disruption by personal ultrasoundimagers.

-

Cost disruptive innovations:➢

Silicon ultrasound transducers, cMUTs and PMUTs, including pMUT process
evolution.

➢

Universal imager replacing multiple legacy probes.

-

Operator training elimination through AI to enable home use.

-

Image interpretation by AI eliminating need for trained sonographers.

-

Overview of disruptive applications for pMUTs.

<CV>
Serving as Exo’s Co-Founder and Executive Board Chairman, Janusz is a pioneer in thefields of micro-mechanical integrated systems (MEMS) and sensors. He has co-founded 11
Silicon Valley MEMS companies with products including MEMS sensors (pressure,acceleration, gyro), MEMS microstructures (mirrors), sensor-based systems-on-chip(wireless pressure sensors, motion sensors with embedded sensor fusion) and systems(optical switches, medical ultrasound imagers). Janusz has performed due diligence for toptier VC firms, including USVP (Irwin Federman), Mayfield, Benchmark, Morgenthaler, andPanorama. He also worked as an advisor or board member for 40+ startups.
Janusz has been the recipient of multiple awards, including “Entrepreneur of the Year” by
Arthur Young in 1989, and Lifetime Achievement Awards in 1994 and 2003 by Sensors
Magazine and MANCEF, respectively. In 2016, he was named Outstanding Polish Business
Executive by the Polish Embassy in the United States and subsequently received theIndustry Impact Award for Engineering Excellence from Sensors Expo in 2018.
He has published 250+ papers, wrote sections of four books, and has organized andchaired many international conferences. He is the author of 30 U.S. patents and multiple
patent applications and has initiated several sensor standardization efforts.
Janusz earned his M.S. in Electrical Engineering and Ph.D. from Warsaw Technical
University, Poland. He also completed the Executive Management Program at Stanford
University.
24

MEF 2022 Speakers
Wednesday, April 20, 2022 (JST, UTC+0900)
9:20-10:25

Session: New Areas for MEMS Innovation 1 – Biomedical -10:00-10:25

Invited Speech:
Commercialization of an AI-nanopore Platform to
Revolutionize Inspection Systems
Prof. Masateru Taniguchi, Professor, SANKEN, Osaka
University, Japan
検査システムを革新する AI ナノポアプラットフォームの事業化
大阪大学 産業科学研究所 教授 谷口 正輝氏<Abstract>
Digital platforms are becoming increasingly popular in the clinical laboratory market for
microbiological and biochemical tests. Digitized image and measurement data processing
enable advanced analysis using artificial intelligence (AI), which is expected to improve test
accuracy and speed. AI nanopore, a fusion of nanopore and AI, is a digital platform thatcan rapidly create microbiological testing systems by learning from bacterial and viralmeasurement data with AI. Nanopores are holes with diameters ranging from a few
micrometers to a few hundred nanometers that are fabricated using semiconductor
technology on a silicon substrate. Additionally, nanopores are integrated into flow channels
made of plastic, resulting in the evolution of the current A4-sized measuring device into a
palm-sized digital platform that can be connected to a smartphone via semiconductor and
MEMS technology. New testing systems are currently being developed. I will introduce thejourney toward commercializing AI nanopore by a university venture company and its
future prospects.
<CV>
Masateru Taniguchi, Ph.D., is a Professor of Bionanotechnology at SANKEN, Osaka
University. He obtained a Ph.D. from Kyoto University in 2001. He then became a postdoc
at the Institute of Scientific and Industrial Research at Osaka University. In 2002, hebecame an assistant professor at Osaka University. In 2007, he became a researcher for
PRESTO (Precursory Research for Embryonic Science and Technology), Japan Science andTechnology Agency. He worked as an associate professor at Osaka University (2008–2011).
His current research interests include single-molecule science and single-molecule
technologies. In 2013, he founded Quantum Biosystems Inc. to commercialize singlemolecule quantum sequencers and was a director of the company. In 2018, he also
founded Aipore Inc. and serves on the board of the company to commercialize AI
nanopores.

25

MEF 2022 Speakers
Wednesday, April 20, 2022 (JST, UTC+0900)
10:35-11:50

Session: Main Stream of MEMS 1

10:35-11:00

Invited Speech:
tinyML Solution for New Data Driven World
Dr. Evgeni Gousev, Senior Director,
Qualcomm AI Researchand Chairman, Board of Directors, tinyML Foundation,
USA<Abstract>
The presentation covers the following points:- tinyML Fundamentals- tinyML Markets, Examples and Applications- Qualcomm Always-On Computer Vision product- How to get involved:➢ tinyML Foundation and its global ecosystem, projects and events, educational
activities<CV>
Evgeni Gousev is a Senior Director of Engineering in Qualcomm Research. He leads HW
R&D org in the Silicon Valley Center and is also responsible for developing ultra low power
embedded computing platform, including always on machine vision AI technology. He has
been with Qualcomm Technologies, Inc. since 2005 after joining from IBM T.J. Watson
Research Center where he drove projects in the field of advanced silicon technologies. From1993 to 1998, Dr. Gousev held academic professorship appointments with Rutgers
University and Hiroshima University (1997). Evgeni holds a M.S. degree in Applied Physics
and a Ph.D. in Solid-State Physics. He has co-edited 24 books and published 163 papers
and is an inventor on more than 60 issued and filed patents.
.

26

MEF 2022 Speakers
Wednesday, April 20, 2022 (JST, UTC+0900)
10:35-11:50

Session: Main Stream of MEMS 1

11:00-11:25

Invited Speech:
Near-infrared spectrometer using MOEMS
technology
Ms. Anna Yoshida, Section Chief, MEMS,
Solid state division
Hamamatsu Photonics K.K., JapanMOEMS 技術を用いた近赤外分光器
浜松ホトニクス株式会社 固体事業部 MEMS 部 専任部員 吉田 杏奈氏<Abstract>
Hamamatsu Photonics K.K. has developed and is producing a wide variety of opticalsensors. By adding MOEMS technology to the opto-semiconductor devices, we have created
new values of compact optical modules with superior performances.
The demand for near-infrared spectroscopic analysis is increasing. Hamamatsu's MOEMS
spectrometers make near-infrared spectroscopy extremely accessible. With performancecomparable to a laboratory equipment, our compact, affordable and a wide variety of nearinfrared spectrometers can be integrated into handy instruments or manufacturing
equipment for real-time measurement in the field.
In this presentation, ultra-compact SWNIR spectral sensor, FTIR engine, and MEMS-FPI(Fabry-Perot Interferometer) spectrum sensor will be presented.
<CV>
Yoshida Anna received her master’s degree in Materials and Manufacturing Science fromthe Osaka University. In 2007, Ms. Yoshida joined the Hamamatsu Photonics K.K,
Hamamatsu, Shizuoka, Japan.
Since then, she has been engaged in the development and design of the MEMS
technologies, especially miniature spectrometers, combined with CMOS sensors, based on
diffraction gratings using nanoimprint technology.

27

MEF 2022 Speakers
Wednesday, April 20, 2022 (JST, UTC+0900)
10:35-11:50

Session: Main Stream of MEMS 1

11:25-11:50

Invited Speech:
Development of OCT products by using MEMS
technology
Dr. Keiji Isamoto, Executive officer, President of OIS
company
santec corporation, JapanMEMS 技術を用いた OCT 技術の開発
Santec 株式会社 執行役員、OIS カンパニー長諫本 圭史氏<Abstract>
OCT is a non-invasive technology to observe cross section view of the object. It is used forvariety of application, such as medical equipment or industrial inspection. Santec has beenworking for OCT for more than 15 years and will introduce latest results of OCT research byusing MEMS technologies. One of the key technology for next generation OCT is MEMS
based tunable VCSEL which enables deeper and faster imaging. Tunable VCSEL can also be
used for FMCW-Lidar. We will introduce latest research results with some demonstration
data in the presentation.
<CV>
Keiji Isamoto received his B.S. and M.S. degrees in Electrical and Engineering from
Toyohashi University of Technology, Aichi, Japan, in 1994 and 1996, respectively. He joined
Central R&D Laboratory of OMRON Co. in 1996 and was engaged in the development of
micro optics. He joined Santec Corporation, Japan, in 2001, and worked on several
subjects, including optical hybrid module, MEMS (microelectromechanical systems) based
Variable Optical Attenuator and High Speed swept Laser for Optical Coherence Tomography.
He received Ph.D. degree in electrical engineering from The University of Tokyo, Tokyo,
Japan, in 2016. Since 2018, he has been a President of Optical Imaging and Sensing
Company in Santec Corporation. His research interests include Optical MEMS and Optical
Coherence Tomography for medical and Industrial application.

28

.MEF 2022 Speakers
Wednesday, April 20, 2022 (JST, UTC+0900)
14:40-15:55

Session: Main Stream of MEMS 2

15:05-15:30

Invited Speech:
Bosch MEMS Foundry
Dr. Georg Bischopink, Vice President, Product Area
Sensors and Sensor Development, Robert Bosch
GmbH, Germany<Abstract>
The complexity of MEMS feedback loops process to product is higher than for ASICs.
Additionally, the diversity in existing MEMS processes is tremendous. Therefore, MEMS
foundry is based on specific process flows individually designed per customer. Ideally thecustomer-individual process is developed in a kind of partnership between customer andfoundry, based on one hand on customer specific needs and on the other hand on foundry
specific know-how, process- and tool-capabilities.
This MEMS specific approach drive other preconditions for a successful MEMS foundry:
1.) Flexible R+D willingness and capabilities.
2.) As much know-how in MEMS as possible, a broad tool park and numerous technology
building blocks.
3.) Professional production capability with respect to quality, reliability, high volumes, andlong-term delivery guarantee.
Bosch offers the broadest portfolio of MEMS technologies in the market. The available
technologies are intensively tested, deeply understood, and proven for mass production.
Bosch will increase its MEMS foundry activities and offers this existing MEMS portfolio in
combination with the ability to develop new building blocks, specifically for future
customers in long-term partnership.
This presentation highlights some of the key technologies and providing examples.
<CV>
Education
1983-1988
1988-1992

Master’s degree in Physics, University Paderborn, Germany
Ph.D. in Semiconductor Physics: Crystal Growth of (AlGa)Sb,
University Freiburg, Germany
Professional Experience
1992- today
Robert-Bosch GmbH, Germany
1992-1995
Quality Assurance, Hybrid and Sensors
1995-1996
Development, MEMS-Sensors
1996-2000
Section Manager, Development MEMS Sensor Products
2000-2008
Director, Borsch MEMS-Production
2008-09/2012 Director, Bosch Corporate Research Microsystem-Technology
10/2012-today Vice President, Bosch Engineering Sensors for External Customers and lead
Product Area Sensors Automotive
29

MEF 2022 Speakers
Wednesday, April 20, 2022 (JST, UTC+0900)
14:40-15:55

Session: Main Stream of MEMS 2

15:30-15:55

Invited Speech:
MEMS Development and Fabrication During theCurrent Challenging Time
Dr. Rakesh Chand Tripathi, MTS-MEMS(TD)
Vanguard International Semiconductor Corporation,
Singapore<Abstract>
Although MEMS technology development uses the CMOS micro fabrication processes but
developing and manufacturing the MEMS in CMOS fab is very challenging. This challenge isfurther compounded with the spread of COVD-19 and high rise in MEMS demand. To tackle
this challenge VIS worked on reducing the development time of MEMS devices bydeveloping and offering KEY MEMS technology platforms (IMU, PMUT, etc) and providing
customer design guideline during the tape out phase. These both key changes lead todrastic reduction in the development time. Device fabrication technology can be now
developed in less than 3 months (Mask in to wafer fab-out).
<CV>
He received. M.Tech. degree in Microelectronics from Indian Institute of Information
Technology in 2010. And PhD (Eng.) in 2015 from Department of Bioengineering andRobotics, Tohoku University, Japan. He was research fellow at Micro System Integration
Canter, Japan from April.2015 to Dec.2016. He joined VIS (formerly GF-Tampines) as
Principle engineer (MEMS) in Jan.2017. He is currently working as Member of TechnicalStaff at VS1 (VIS-Singapore) MEMS-TD. He is a recipient of GATE Scholarship (Govt. ofIndia) for pursuing masters in Microelectronics And Monbukagakusho (MEXT) Scholarshipby Minister of Education, Culture, Sports, Science and Technology, Government of Japan,
for pursuing research in engineering. His research interests include high temperature SiC
devices, SiC sensors, power MEMS, RF MEMS, Acoustic devices and MEMS packaging.

30

MEF 2022 Speakers
Wednesday, April 20, 2022 (JST, UTC+0900)
17:15-18:30

Session: New Areas for MEMS Innovation 2

17:15-17:40

Invited Speech:
What is the fuel that will propel the MEMS
market growth?
Dr. Dimtros Damianos, Senior Analyst, Photonics &Sensing Division, Yole Développement, France<Abstract>
Two years into the pandemic, the semiconductor industry has felt the ups and downs of acrisis, leading eventually to chip shortages which in turn cause delays of electronic systems
that incorporate them. Semiconductors have become a hot topic of paramount importance,
being a strategic asset of sovereign caliber. Due to that, heavy investments are being
poured into manufacturing capacities across all geographies.
MEMS devices, under the $500B+ semiconductor umbrella, are going through a growth
period. While the market was stable at $12B between 2019 and 2020, with no significant
effect felt from covid, in 2021 it grew by more than 11% reaching $13.4B due to rekindledconsumer sentiment boosting end-system demand that incorporate a multitude of MEMS
devices. In the next 4-5 years, we expect the market to reach north of $18B+ driven byvarious megatrends, such as audio sensing and voice HMI, including sensor-packed TWS
hearables, environmental sensing, ADAS and AV, AR/VR, etc. Of course, all releteddevelopments in the player landscape and the supply chain are not lacking. Join me in thepresentation to learn about the latest MEMS developments.
<CV>
Dimitrios Damianos, Ph.D., is a Senior Technology & Market Analyst, part of the Photonics &Sensing division at Yole Développement (Yole).
Based on solid technical expertise in imaging, sensing, and photonics, Dimitrios oversees
the day-to-day production of valuable technology & market reports and custom consulting
projects.
He also plays a key role in the expansion of Yole’s market & technical knowledge,
supporting the development of strategic projects and maintaining long-term relationships
with key accounts while ensuring their expectations are met.
Dimitrios regularly presents and delivers keynotes at international conferences andexhibitions. He has also authored and co-authored several technical & market reports aswell as scientific papers in international peer-reviewed journals.
Dimitrios holds a BSc in Physics and an MSc in Photonics, both from the University of Patras(Greece), and a Ph.D. in Optics & Microelectronics from the University of Grenoble-Alpes(France).

31

MEF 2022 Speakers
Wednesday, April 20, 2022 (JST, UTC+0900)
17:15-18:30

Session: New Areas for MEMS Innovation 2

17:40-18:05

Invited Speech:
Large-Area Sensing Surfaces and Human
Machine Interfaces Enabled by Hybrid Printed
Electronics
Dr. Peter Zalar, HOLST Centre, The Netherlands<Abstract>
Holst Centre is an applied research institute that has been focused for nearly two decadeson the development of flexible and thin electronic systems using industrially relevant
fabrication methods. The major goal is to make technological contributions toward theindustrialization of printed electronics systems so that future visions can become a reality.
The promise of implementing electronics into an ever increasing spectrum of form factors
necessitates the development of systems that simultaneously bear the qualities ofaccuracy, conformability, ruggedness, and light weight. This is demanded in applications
ranging from healthcare, automotive, and robotics. In these cases, traditional electronics
based on rigid printed circuit boards (PCBs) can simply fall short of expectations or becompletely unsuitable for a target application due to its rigidity.
In order to make progress toward this vision, Holst Centre has been active in thedevelopment of printable and flexible sensors that can be printed atop the complex
surfaces found in the applications named earlier; thus realizing “Large-Area Sensing
Surfaces”. In our vision, these surfaces largely consist of fully-printed circuitry and sensors
on an elastomeric or thermoplastic carrier. This enables the conformal contact of thesensors to a surface, improving the reliability and quality of data gathered by them without
being obtrusive. Additionally, in order to accommodate cases where a printed solution may
not be available, integrating components such as integrated circuits, temperature sensors,pressure sensors, or accelerometers is also possible.
With this unique toolbox, a variety of novel systems can be manufactured that can meet ahost of needs. In this presentation, we would like to introduce our approach and show how
we have applied our expertise towards developing the aforementioned “Sensing Surfaces”
for applications such as human machine interfaces and healthcare devices.
<CV>
Peter Zalar obtained his Ph.D. in chemistry from the University of California, Santa Barbara(UCSB) in 2014 under Prof. Thuc-Quyen Nguyen. His doctoral research focused on thecharacterization of the optical and electronic properties of novel π-conjugated polymers. He
then joined the group of Prof. Takao Someya at The University of Tokyo as a project
researcher. In that time, he worked on the development of optoelectronic devices based onorganic semiconductors for electronic skins and medical monitoring. In 2017, he joined
Holst Centre to continue his research in printed electronics. He is currently leading the“Large-Area Sensors” research program.

32

MEF 2022 Speakers
Wednesday, April 20, 2022 (JST, UTC+0900)
17:15-18:30

Session: New Areas for MEMS Innovation 2

18:05-18:30

Invited Speech:
MEMS technologies in an ever more demanding
world
Dr. Samer Dagher, Research Engineer, Department of
Silicon Components,
CEA-Leti, France<Abstract>
The presentation covers the following items:
MEMS: A Cornerstone of Tomorrow’s World
Inertial Sensors at Leti: A History of Innovation
M&NEMS: Breakthrough Multi-Sensor Platform➢ High Performance Gyroscope➢ High Frequency Gyroscope
NEMS Resonators for Mass Sensing
Opto-Mechanics on Chip
➢ Mass Sensors➢ Specific Biomarker Detection➢ An Emerging Ulti-Sensor Solution<CV>
Samer Dagher is a Research Engineer at CEA-Leti. His research focuses on acoustic
sensors, and nano-resonators for biological detection among others. He holds a PhD in
Acoustics from Le Mans University, France during which he developed a new architecture
for high-performance MEMS microphones with in-vacuum transduction. He also holds a
Master’s degree in Nano-Engineering from Ecole Centrale de Lyon, France and a Master’s
degree in History and Philosophy of Mathematics and Physics from Aix-Marseille University,
France.

33

MEF 2022 Speakers
Thursday, April 21, 2022 (JST, UTC+0900)
08:45-09:50

Special Session: Environmental Technology

08:45-09:25

Special Lecture:
The climate neutral company - How Boschhas become carbon neutral by 2020 andwhere to go further
Mr. Klaus Meder
President and Representative Director
Bosch Corporation, Japan<Abstract>
Since 2020, the Bosch Group with its more than 400 locations worldwide has been climate
neutral (scopes 1 and 2). An independent auditing company has officially confirmed this.
But that's not all: We want to shape climate action beyond our immediate sphere of
influence and also systematically reduce upstream and downstream emissions (scope 3),
which we aim to reduce by 15 percent by 2030.
Climate neutrality refers to the energy we generate ourselves and the volume we purchasefor manufacturing, development, and administration (scopes 1 and 2 of the Greenhouse
Gas Protocol, GHG). This is where we can directly influence the reduction of greenhousegases and make a big impact in a short time.
Upstream emissions in the Bosch value chain primarily concern purchased goods andservices as well as logistics. Downstream emissions are mainly caused by the use of our
products.
The presentation shows the status and the future targets. Several examples how to reachthe target will be shown.
<CV>
Klaus Meder has various and long experiences in engineering in Bosch. One of his
noteworthy experiences is that he resided in Japan for 5 years, when he was Vice President
in charge of Engineering, Quality and Manufacturing of Automotive Electronics Japan from1996 until 2000. After various positions with the division Chassis Systems, he became
President of Automotive Electronics of Robert Bosch GmbH in January 2012. Since July
2017 he has been President and Representative Director of Bosch Corporation in Japan.

34

MEF 2022 Speakers
Thursday, April 21, 2022 (JST, UTC+0900)
08:45-09:50

Special Session: Environmental Technology

09:25-09:50

Invited Speech:
Application of Sensing Technology in Small-scale
Decentralized Water Recycling System
Mr. Shohei Okudera, Director,
WOTA CORP., Japan

小規模分散型水循環システムにおけるセンシング技術の活用
WOTA 株式会社 取締役
奥寺 昇平氏<Abstract>
WOTA Corp. is a startup company and seeks "Structural Solutions to the World’s Water
Crisis". WOTA has developed a "small-scale decentralized water recycling system" and hascommercialized several products such as "WOSH," a water recycling handwashing stand,and "BOX," a portable water recycling plant. In this presentation, we will talk about the useof sensing technology to support the "Small-Scale Decentralized Water Recycling System".
<CV>
Shohei Okudera studied computer science at Tokyo Institute of Technology and the
University of Tokyo, where he researched technologies for building distributed processing
platforms for big data. He was a member of Director Kitsuregawa's laboratory at theInstitute of Industrial Science. In 2014, he co-founded Hotaru Corporation, the predecessorof WOTA.

35

MEF 2022 Speakers
Thursday, April 21, 2022 (JST, UTC+0900)
10:00-11:05

Session: New Areas for MEMS Innovation

10:00- 10:40

Keynote Address:
The Impact of Key New Technologies andCapabilities on the Future of MEMS
Dr. Kurt Petersen
Silicon Valley Band of Angels<Abstract>
Over the past 5 years or so, a number of novel, advanced process capabilities related to
MEMS have become commercially available. These newly developed processes are poised
to have enormous impact on new MEMS devices and on the future of the MEMS industry.
Some of the technologies we will discuss are: glass-processing, including through-glassvias and glass wafer bonding; processing of ultra-thin substrates, thinner than 50 µm;
recently-commercialized deposition and etching of AlN and PZT; DRIE etch-rates of over 25µm/min; the epi-seal process. And, more ! Examples of how these new capabilities are
impacting the development of novel, state-of-the-art MEMS products will be presented, as
well as implications for the future of MEMS.
<CV>
Kurt Petersen received his BS degree cum laude in EE from UC Berkeley in 1970. In 1975,
he received a PhD in EE from the Massachusetts Institute of Technology. Dr. Petersen
established a micromachining research group at IBM from 1975 to 1982, during which hewrote the review paper “Silicon as a Mechanical Material,” published in the IEEE
Proceedings (May 1982). This paper is the most frequently referenced work in the field of
micromachining and micro-electro-mechanical systems (MEMS).
Since 1982, Dr. Petersen has co-founded six companies in MEMS technology, Transensory
Devices Inc. in 1982, NovaSensor in 1985 (now owned by Amphenol), Cepheid in 1996
(acquired by Danaher in 2016), SiTime in 2004 (now listed as SITM on NASDAQ), Profusa
in 2008 (still private), and Verreon in 2009 (acquired by Qualcomm).
In 2011, Dr. Petersen joined the Silicon Valley Band of Angels, where he now co-chairs the
HardTech group. The Band is an angel investment group which mentors and invests inearly stage, high-tech, start-up companies. Today, he spends most of his time helping andmentoring such companies.
Dr. Petersen has published over 100 papers, and has been granted over 35 patents in thefield of MEMS. He was awarded the prestigious IEEE Medal of Honor in 2019 as well as theIEEE Simon Ramo Medal in 2001 for his contributions to MEMS. Dr. Petersen is a memberof the National Academy of Engineering and is a Life Fellow of the IEEE in recognition of his
contributions to “the commercialization of MEMS technology”.

36

MEF 2022 Speakers
Thursday, April 21, 2022 (JST, UTC+0900)
10:00-11:05

Session: New Areas for MEMS Innovation

10:40-11:05

Invited Speech:
Lessons Learned from 10+ Years of Epi-Seal
Fabrication Runs at Stanford.
Prof. Thomas Kenny, Professor, Stanford University,
USA<Abstract>
TBA<CV>
Kenny's group is researching fundamental issues and applications of micromechanicalstructures. These devices are usually fabricated from silicon wafers using integrated circuit
fabrication tools. Using these techniques, the group builds sensitive accelerometers,
infrared detectors, and force-sensing cantilevers. This research has many applications,
including integrated packaging, inertial navigation, fundamental force measurements,
experiments on bio-molecules, device cooling, bio-analytical instruments, and small robots.
Because this research field is multidisciplinary in nature, work in this group is characterized
by strong collaborations with other departments, as well as with local industry.

37

MEF 2022 Moderator for Panel Discussion
Thursday, April 21, 2022 (JST, UTC+0900)
11:05-12:05

The Grand Panel Discussion,“What are the New areas for MEMS Innovation and New MEMS
Products?”
MEMS イノベーションのための新しい領域と新しい MEMS 製品は何か？
Moderator:

Mr. Susumu Kaminaga, Executive Senior Advisor
SPP Technologies Co., Ltd., JapanSPP テクノロジーズ株式会社
エグゼグティブシニアアドバイザー
神永 晉氏<Abstract>
To discuss the New Areas for MEMS Innovation and New MEMS Products from the point ofview of expected contribution of MEMS to the society, Smart City. Amazing ideas from thevarious aspects to be discussed by the distinguished visionary panelists based on theirunique knowledge and experience.
<CV>
Susumu Kaminaga studied Mechanical Engineering at the University of Tokyo andgraduated in 1969. He joined Sumitomo Precision Products Co., Ltd. (SPP) and was
President of the company from 2004 to 2012. He is currently Executive Senior Adviser at
SPP Technologies Co., Ltd. as well as Representative Director & Chief Executive at SK
Global Advisers Co., Ltd. He lived in Germany in the 1980s and U.K. in 1990s. Having
been involved with MEMS activities since 1988, he played a major role to develop andcommercialize Deep Reactive Ion Etching (DRIE) technology based on Robert Boschpatented switching process at Surface Technology Systems (STS), UK, subsidiary of SPP.
STS under his initiative introduced the world first DRIE equipment into the market in 1995.
The DRIE has enabled MEMS world to expand rapidly in the last decades since then. The
DRIE and its associated processing technologies to support MEMS development have been
contributing to such emerging markets like smart phones, IoT, 5G, DX, CASE and MaaS.
Following his achievement to establish MEMS business with the processing technologies,
gyroscopes and wireless sensor network systems, he became a member of the organizing
committee of Trillion Sensors (TSensors) Summit to drive TSensors Initiative. He is Fellowof JSME (The Japan Society of Mechanical Engineers) and a member of JSAP (The Japan
Society of Applied Physics), IEE (The Institute of Electrical Engineers of Japan) and IEEE
(The Institute of Electrical and Electronic Engineers).

38

MEF 2022 Panelists
Thursday, April 21, 2022 (JST, UTC+0900)
11:05-12:05

The Grand Panel Discussion,“What are the New areas for MEMS Innovation and New MEMS
Products?”
Dr. Kurt Petersen, Silicon Valley Band of Angels, USA

Prof. Thomas Kenny, Professor, Stanford University, USA

Prof. Weileun Fang, NTHU Chair Professor/Power Mech. Eng. Department,
National Tsing Hua University, Taiwan<CV>
Prof. Fang has been working in the MEMS field for more than 20 years. He received his
Ph.D. degree from Carnegie Mellon University (Pittsburgh, PA) in 1995. He joined the
National Tsing Hua University (Taiwan) in 1996, where he is now a Chair Professor. He
became the IEEE Fellow in 2015 to recognize his contribution in MEMS area. Prof. Fang has
published ~500 refereed papers and granted ~120 patents. He is now the Chief Editor of
JMM, the Board Member of IEEE TDMR and Sensors and Materials, and the Associate Editorof IEEE Sensors J. He served as the General Chair or Program Chair for many importantinternational conferences: the World Micromachine Summit 2012, IEEE Sensors 2012, andTransducers 2017. He also served as the chair of International Steering Committee ofTransducers during 2017-2019. Moreover, he served as the Technical Program committee ofIEEE MEMS and Transducers for many years. So far more than 50 PhD and 70 Masterstudents have graduated from Prof. Fang’s group. Most of them are working in the MEMS
and micro sensors related companies. Thus, Prof. Fang has close relation with MEMS
industries, and is now the VP of MEMS and Sensors Committee of SEMI Taiwan.

Mr. Klaus Meder, President and Representative Director
Bosch Corporation, Japan

Dr. Georg Bischopink, Vice President, Product Area Sensors
and Sensor Development, Robert Bosch GmbH, Germany

39

MEF 2022 Speakers
Thursday, April 21, 2022 (JST, UTC+0900)
12:50-13:30
12:50-13:30

Session: Medical Robotics
Special lecture: Integration of Bio-Mechatronics,
Biomedical Instrumentation, and Bioscience for
Minimally Invasive Therapies
Prof. Ichiro Sakuma, Director, Research Institute for
Biomedical Science and Engineering, Professor, Medical
Device Development and Regulation Research Center,
Department of Bioengineering, Department of Precision
Engineering. School of Engineering, The University of Tokyo
低侵襲治療のためのバイオメカトロニクス，生体計測，生命科学の統合
東京大学 臨床生命医工学連携機構 機構長、大学院工学系研究科
医療福祉工学開発評価研究センター 教授 佐久間 一郎氏<Abstract>
Minimally invasive therapy such as endoscopic surgery and catheter based intervention arebeing spread in many surgical intervention fields. Invasiveness of the procedures has been
reduced resulting in better outcomes such as improved survival, less complications, andearly discharge. The application of minimally invasive procedure requires new technologies
for dexterity enhancement and sensing augmentation. Engineering assistance is importantto realize safe and effective minimally invasive therapy. Computer Assisted Surgicalguidance such as surgical navigation is a representative technology. It is expected thatapplication of bio-mechatronic technology to minimally invasive surgery will provide thefollowing functions: (1) Precise manipulation of biological tissues and surgical instruments
in narrow and confined surgical field. (2) Precise and accurate localization and control oftherapeutic devices using various pre and intra-operative medical information. Fusion of
medical bio-mechatronics, biomedical instrumentation, bioscience is required for realizingthese functions. Information technologies such as signal processing, image processing, andpattern recognition (artificial intelligence) are also important for extraction of clinicallysignificant information from acquired biological data. Bioengineering, an interdisciplinary
field of engineering and biomedical sciences, will contribute to integrate pre-, intra- andpost-operative multi-dimensional anatomical and physiological information for optimizationof surgical/interventional procedures.
<CV>
Ichiro Sakuma graduated from Department of Precision Engineering, faculty of Engineering,and Graduate School of Engineering, The University of Tokyo in 1982 and 1984 respectively.
He received PhD in Engineering from The University of Tokyo in 1989. He worked as a
research associate in The university of Tokyo from 1984 to1987, and worked in Tokyo Denki
University from 1987 to 1998. Since 1998, he has been serving as a faculty member of the
University of Tokyo since 1998. He became professor in Graduate School of Frontier Sciencesin 2001, and professor in School of Engineering in 2006. He is currently professor of theMedical Device Development and Regulation Research Center, Department of Bioengineering,and Department of Precision Engineering, School of Engineering, and the Director, ResearchInstitute for Biomedical Science and Engineering, The University of Tokyo. He served as
Deputy Director for Medical Devices, Center for Product Evaluation Pharmaceuticals andMedical Devices Agency (PMDA) from 2012 to 2017, and president of Japanese Society for
Medical and Biological Engineering from 2014 to 2016.
His research interests include medical devices, medical imaging, computer aided surgery,medical robotics, and regulatory sciences. He is a fellow of the International Academy ofMedical and Biological Engineering.
40

MEF 2022 Speakers
Thursday, April 21, 2022 (JST, UTC+0900)
13:30-13:55

Session: Main Stream of MEMS 3

13:30-13:55

Invited Speech:
AI Enabled Touch User Interface for Smart
Surfaces
Mr. Mo Maghoudnia, Founder/CEO,
UltraSense Systems Inc., USA<Abstract>
UltraSense is ushering a new touch user interface technology that enables smart surfaces.
We have created the world’s smallest ultrasound system-on-a-chip that can be used astechnology platform for delivering our touch user interface in the smartphones, consumer
electronics, IoT, home appliances, medical and automotive markets. Our technology cansense through almost any material and virtually any material thickness to cost-effectively
turn any surface into a gesture. Metals, glass, plastic, wood can easily be turned into smart
surfaces.
Everywhere we look, objects and materials are becoming increasingly interactive. We
believe that we are only at the beginning of an evolution that will have a huge impact on
our day-to-day life. And the advent of smart surfaces will unquestionably speed up thisevolution.
We have a disruptive touch sensing technology platform that will enable the onset of smart
objects/surfaces easier and more cost effectively across myriad of use cases. It allows for
detection of intended vs accidental touch using Machine Learning. Not to mention that it isshipping today!
<CV>
Mo Maghsoudnia serves as Founder & CEO of ULTRASENSE Systems. Prior to ULTRASENSE,
Mo was the Vice President of Technology & Manufacturing at InvenSense where he was
responsible for all worldwide operations and Process Technology development. Previous toInvenSense, Mo was Vice President of Manufacturing at NetLogic MicroSystems where hesuccessfully managed the manufacturing operations of the company from a single productline to a highly diversified product portfolio. Mo holds MS in EE from Santa Clara University.
He Holds 10 patents and has filed numerous papers.

41

MEF 2022 Speakers
Thursday, April 21, 2022 (JST, UTC+0900)
15:30-16:45

Session: Main Stream of MEMS 4

15:30-15:55

Invited Speech:
Improving the performance of intelligent MEMS
motion sensors with ST's new Thelma Double
technology
Mr. Giorgio Allegato, Technology Development Manager,
Analog, MEMS & Sensors Group, STMicroelectronics,
Italy<Abstract>
In today's “onlife” world, the need for intelligent sensors with higher levels of integration is
growing along with the demand for higher performance and improved reliability.
To overcome these challenges, ST's new generation of its Thelma technology platform,
Thelma Double, shrinks the footprint of inertial sensors and improves their performance
without compromising mechanical robustness.
Discover how this new technology can help improve your designs while offering significant
cost and size benefits.
<CV>
After joining ST in 2004 as a Technology Engineer, Giorgio led the way to new technology
development and industrialization activities for several MEMS products including motion andenvironmental sensors and actuators. The author of several technological papers andpatents in the field of micromachining, characterization, and design, Giorgio enjoys helping
to advance MEMS technologies.

42

MEF 2022 Speakers
Thursday, April 21, 2022 (JST, UTC+0900)
15:30-16:45

Session: Main Stream of MEMS 4

15:55-16:20

Invited Speech:
Uncooled Infrared Focal Plane Arrays
Dr. Masafumi Kimata, Formerly Ritsumeikan University,
Japan

非冷却赤外線イメージセンサ
元立命館大学 木股 雅章氏<Abstract>
The uncooled infrared focal plane array (IRFPA) is one of the most successful integrated
MEMS devices. MEMS technology, which enables the manufacture of low thermal
conductance structures, has been contributing to uncooled IRFPA development by
increasing the sensitivity. As a result of active research and development, the uncooled
IRFPA technology has reached a plateau level, in which the pixel pitch is reduced to lessthan 12 µm and the array format is increased to a level compatible with HDTV. The cost of
uncooled IRFAPs has also been reduced. Reflecting this situation, the interest in infrared
imaging is shifting from technology to business. In this talk, the current state of uncooled
IRFPA technology and some of the hottest applications that have been gaining attention
lately will be discussed.
<CV>
Masafumi Kimata received the B.S. and M.S. degrees in electronic engineering from Nagoya
University in 1974 and 1976, respectively, and received the Ph. D. degree in faculty ofengineering science from Osaka University in 1992. He joined Mitsubishi Electric
Corporation in 1976, where he was involved in research and development of silicon-based
infrared focal plane arrays, including Schottky-barrier cooled infrared focal plane arrays and
SOI diode uncooled focal plane arrays. In 2004, he left Mitsubishi Electric, and became aprofessor of Ritsumeikai University, where he continues his research on MEMS-based
uncooled infrared focal plane arrays and type-II superlattice infrared focal plane arrays. He
retired from Ritsumeikan University in March 2022. He also served as a visiting researcher
of JAXA (Japan Aerospace Exploration Agency) by 2021. He was awarded the Prime
Minister Prize of the Japan National Invention Awards in 1993 for invention of highresolution Schottky-barrier infrared focal plane arrays. He is a fellow of SPIE.

43

MEF 2022 Speakers
Thursday, April 21, 2022 (JST, UTC+0900)
15:30-16:45

Session: Main Stream of MEMS 4

16:20-16:45

Invited Speech:
How context awareness can help to further
extent battery lifetime in TWS
Dr. Gunar Lorenz, Senior Director, TechnicalMarketing Sensor
Infineon Technologies AG, Germany<Abstract>
In the past years, the industry has managed a huge increase in the MEMS microphone
performance to a point where it starts to rival studio microphone quality. At the same time,current consumption has been reduced with each new generation paving the way towards
new audio use-cases such as noise cancelling earbuds (TWS) and audio-enabledwristbands. This trend will continue and require new strategies to feed the hunger towards
always higher performance at lower power. Intelligent performance management emerges
as a viable path to continue the trend. In a new world of “context awareness”, systemcomponents will only take the minimum amount of power needed to perform a given task.
The question is: which performance level is needed and when? Who manages and who getsmanaged? Or in other words: “How can context awareness help to extend the battery
lifetime of TWS?”<CV>
Dr. Gunar Lorenz is currently heading the technical marketing and application engineering
for consumer sensors at Infineon Technologies. Gunar joined Infineon in 2016 as systemproject manager responsible for Infineon's first open market MEMS microphone. Prior
joining to Infineon he worked as director of system-level simulation at Coventor, where heand his group invented and developed Coventor's MEMS/IC co-simulation design
environment MEMS+. The original ideas for MEMS+ are embodied in his PhD carried out at
Robert Bosch R&D Center in 1999. Gunar graduated in mechanical engineering at the TU
Braunschweig in Germany and received his PHD in electrical engineering from the TU
Bremen in 1999.

44

MEF 2022 Speakers
Thursday, April 21, 2022 (JST, UTC+0900)
16:55-18:15

Session: Core Equipment Technology for MEMS

16:55-17:20

Invited Speech:
Probe cards with MEMS probes
Ms. Sawako Hattori
Senior Specialist, MEMS DivisionJAPAN ELECTRONIC MATERIALS CORPORATION, JapanMEMS プローブカード
シニアスペシャリスト、MEMS 統括
日本電子材料株式会社 服部 佐知子氏

<Abstract>
The probe card using the MEMS probe is effective for the miniaturization of the electrodepad of the semiconductor chip and supports the production of many semiconductor devices
including the most tip. The MEMS probe cards will be discussed. And how the MEMS probe
movement & various electrical and mechanical tests will be discussed.
<CV>
Sachiko Hattori received the B.S. and M.S. degrees in applied fine chemistry from Osaka
University, in 1984, 1986, respectively.
She joined Mitsubishi Electric Corporation in 1986.She was engaged in lithography material
and process development and lithography integration including optical proximity correctionof memory, logic and sensor devices (0.8μm-90nm process).
Since the establishment of Renesas Technology Corporation and Renesas Electronics
Corporation, she was engaged in the same work (90-28nm process).
She joined JAPAN ELECTRONIC MATERIALS CORPORATION in 2014.She was engaged in theprocess development of spacetransformer, and now she is responsible for probes andspacetransformer development as a senior specialist after a chief manager in MEMS
Division.

45

MEF 2022 Speakers
Thursday, April 21, 2022 (JST, UTC+0900)
16:55-18:15

Session: Core Equipment Technology for MEMS

17:20-17:45

Invited Speech:
Wafer bonding for 3D/Heterogeneous
integration application
Mr. Hiroshi Yamamoto, Representative Director
EV Group Japan K.K., Japan

最新接合技術による 3D およびヘテロ集積化
イーヴィグループジャパン株式会社
代表取締役 山本 宏氏<Abstract>
As traditional 2D silicon scaling reaches its cost limits, the semiconductor industry isturning to heterogeneous integration — the manufacturing, assembly and packaging ofmultiple different components or dies with different feature sizes and materials onto asingle device or package in order to increase performance on new device generations.
Wafer bonding, which involves stacking and electrically connecting wafers from different
product lines, is a central process in 3D / heterogeneous integration, and is of growing
importance to chipmakers and system companies for new kind of designs andmanufacturing flexibility. Here we present EV Group’s novel wafer and die level bonding
technologies deliver improvements in chip performance, cost, and time-to-market.
<CV>
Hiroshi Yamamoto has over 25 years of experience in semiconductor manufacturing
equipment and process engineering. He joined in field service engineering at EV Group
Japan in 2002 and took up a post as EV Group’s Customer Support Director Asia in 2010.
He has been serving as Representative Director of EV Group Japan since 2012.

46

MEF 2022 Speakers
Thursday, April 21, 2022 (JST, UTC+0900)
16:55-18:15

Session: Core Equipment Technology for MEMS

17:45-18:10

Invited Speech:
Etch Challenges and Solutions for Highly Doped
AlScN Films used in PiezoMEMS Applications
Mrs. Joanne Carpenter,
Senior Product Manager - Etch
SPTS Technologies Ltd., U.K.

<Abstract>
In piezoMEMS devices, the coupling coefficient is of utmost importance to device
performance, and manufacturers look to maximize the coupling coefficient as much as
possible. In recent years, device manufacturers have been adding Sc to AlN as it has beenshown that AlScN films with up to 43at% Sc may have ~400% higher piezoelectric coupling
coefficient than AlN [1].
Unfortunately, increasing the Sc makes dry etching more problematic because of the low
volatility of scandium halides relative to those of Al and N.
This presentation focuses on the challenges faced when etching both AlN and AlScN andpresents solutions based on the use of an innovative high density plasma etch module. Etch
data will include performance comparisons with more mainstream ICP type reactors, andvarious Sc levels.
<CV>
Joanne Carpenter is a Senior Product Manager for Etch Products at SPTS and has over 18
years’ experience in the semiconductor and electronics manufacturing industries.
Joanne joined Surface Technology Systems (STS) in 2007 as an Etch Process Engineer.
When STS and Aviza merged in 2009 to form SPTS, she became a Senior Etch Engineer,
specializing in development of innovative etch process solutions and supporting SPTS
customers on critical advanced packaging technologies in China, Taiwan and North America.
Joanne was also closely involved in the development of SPTS’s plasma dicing technology,
before joining the Etch Product Management team in 2016, and is now responsible for theetch product solutions used in Piezo device applications.

47

MEF 2022 ADVERTISER INDEX
広告#

和文会社名

Affliation

AD-1

浜松ホトニクス株式会社

Hamamatsu Photonics K.K.

AD-2

オクメティックオーワイ

Okmetic Oy

AD-3

株式会社ティ・デイ・シー

TDC Corporation

AD-4

タッチエンス株式会社

Touchence Inc.

AD-5

ローム株式会社

ROHM Co., Ltd.

AD-6

アルプスアルパイン株式会社

ALPSALPINE Co. Ltd.

AD-7

イーヴィグループジャパン株式会社

EV Group Japan K.K.

AD-8

住友精密工業株式会社

SUMITOMO PRECISION PRODUCTS, CO.,LTD.

AD-9

株式会社ミライズテクノロジーズ

MIRISE Technologies Corporation

AD-10

株式会社アドバンストテクノロジー

ADVANCED TECHNOLOGIES CO.,LTD.

AD-11

AAC Technologies

AAC Technologies

AD-12

協同インターナショナル

Kyodo International, Inc.

AD-13

ダウ・東レ株式会社

Dow Toray Co., Ltd.

AD-14

坂口電熱株式会社

SAKAGUCHI E.H VOC CORP.

AD-15

株式会社荏原製作所

Ebara Corporation

AD-16

ハイデルベルグ・インストルメンツ株式会社

Heidelberg Instruments KK

AD-17

ウシオ電機株式会社

Ushio inc.

AD-18

SPP テクノロジーズ株式会社

SPP Technologies Co., Ltd.

AD-19

BMF Japan 株式会社BMF Japan Inc.

AD-20

株式会社ディスコDISCO Corporation

AD-21

丸紅情報システムズ株式会社

MARUBENI INFORMATION SYSTEMS Co., Ltd.

AD-22

エーエスエムエル・ジャパン株式会社

ASML Japan Co., Ltd.

AD-23

イノテック株式会社

INNOTECH CORPORATION

AD-24

ズース・マイクロテック株式会社

SUSS MicroTec KK/Kanematsu PWS LTD.

/ 兼松 PWS 株式会社
AD-25

ポリテックジャパン株式会社

Polytec JapanAD-26（一財）マイクロマシンセンター

Micromachine CenterAD-27

株式会社クレステック

Crestec Corportaion

AD-28

Coventor, A Lam Research Company

Coventor, A Lam Research Company

AD-29

アユミ工業株式会社

AYUMI INDUSTRY CO.,LTDAD-30

電気学会センサ・マイクロマシン部門

IEEJ Sensors and Micromachines

AD-31

東北大学マイクロシステム融合研究開発センター

Tohoku University - Micro System Integration(µSIC)

Center

AD-32

MEMS パークコンソーシアム(MEMS PC)

MEMS PARK CONSORTIUM

AD-33

東北大学 田中（秀）研究室

Tohoku University Tanaka Shuji Laboratory48

AD-34

日清紡マイクロデバイス株式会社

Nisshinbo Micro Devices Inc.

AD-35

興研株式会社

KOKEN LTDAD-36

TDK 株式会社

TDK

AD-37

横河電機株式会社

Yokogawa Electric Corporation

AD-38

Adeia (Xperi)

Adeia (Xperi)

AD-39

株式会社メムス・コア

MEMS CORE CO.,LtdAD-40

長瀬産業株式会社

NAGASE & Co., Ltd.

AD-41

マイクロ化学技研株式会社

Instistute of Microchemical Technology

AD-42

株式会社 KOKUSAI ELECTRIC

KOKUSAI ELECTRIC CORPORATION

AD-43

長野計器株式会社

NAGANOKEIKI CO.,LTD.

AD-44

株式会社フルヤ金属

Furuya Metal Co., Ltd.

AD-45

新光電気工業株式会社

SHINKO ELECTRIC INDUSTRIES CO., LTD.

AD-46

ハイソル株式会社

HiSOL, Inc.

AD-47

SK グローバルアドバイザーズ株式会社

SK Global Advisers Co., Ltd.

49

携帯型簡易分析向け分光器・分光センサ
環境計測機器・色計測機器・生産ラインなど、さまざまな機器に組み込み、現場でのリアルタイム計測を可能とした分光器/分光センサをラインアップしています。

浜松ホトニクスの携帯型簡易分析向け分光器 ・ 分光センサの位置付け
57.0 mm76.0 mmNEW
FTIRエンジン

49.0 mm(C15511-01 : 1100 〜 2500 nm)
87.0 mm[ FTIR エンジンの構造 ]16.8 mmサイズ

27.6 mm

VCSEL

Si PD

InGaAs PD

台形型ビームスプリッタ

ミニ分光器 MSシリーズ

13.0 mm

MEMSチップ(C10988MA-01 : 340 〜 750 nm)(C11708MA: 640 〜 1050 nm)

可動ミラー

測定対象光
分散補償板 (ガラス)
固定ミラー

20.12 mm12.5 mm10.12 mm

ミニ分光器 マイクロシリーズ(C12666MA : 340 〜 780 nm)(C12880MA : 340 〜 850 nm)

Φ9.14 mm

MEMS-FPI分光センサ
11.31 mm

ミニ分光器 SMDシリーズ

4.0 mm
3.1 mm(C14384MA-01 : 640 〜 1050 nm)(C14272: 1350 〜 1650 nm)(C13272-02 : 1550 〜 1850 nm): 1750 〜 2150 nm)(C14273

11.7 mm

VIS(640 nm)NIR(1050 nm)

NIR
(1700 nm)

NIR
(2500 nm)波長

用途 ( 現場でのリアルタイム測定 )インフラ診断 (トンネルなど)

プラスチック選別(リサイクル工場など)

畜産検査 (乳牛の乳房炎など)

農産物検査 (糖分など)

繊維分別 (古着リサイクルなど)

色分析 (車の塗装状態など)

材料受入検査土壌測定 (圃場)固体営業推進部 〒435-8558 浜松市東区市野町1126-1 TEL (053) 434-3311 FAX (053) 434-5184

AD-1

WORLD’S LEADING SUPPLIER OF ADVANCEDSILICON WAFERS FOR MEMS AND RF MARKETS
Okmetic, founded in 1985, is the leading supplier of advanced, high valueadded silicon wafers for the manufacture of MEMS, sensor, RF and powerdevices. Okmetic has the most extensive 150 to 200mm wafer portfolio
in the market comprising of comprehensive lines of Silicon-On-Insulator(SOI) wafers and High Resistivity RFSi® wafers as well as Patterned
wafers, SSP and DSP wafers, TSV wafers, Wafers for Power devices andWafers for GaN-on-Si applications.
Okmetic’s headquarters is located in Finland, where the majority of thecompany’s silicon wafers is manufactured. Worldwide sales organizationand technical support ensure quick local service, rapid prototyping andhighly optimized wafer solutions meeting your device and process needs.
Okmetic K.K. has been serving Japanese customers since 2006.

WWW.OKMETIC.COM

AD-2

丁寧なものづくりで 喜びと、感動を

超精密研磨加工
超精密ラップ加工技術により各種ご希望精度を実現

金属､セラミックス､ガラス､半導体､新素材などあらゆる材質に対応
切削、研削、研磨、ポリッシュ等の加工を組み合わせる事によりお客様のご要望に総合的なソリューションを提供します

株式会社ティ・ディ・シー
https://www.mirror-polish.com
tdc@mirror-polish.com

本社・ 工場〒981-0113
宮城県宮城郡利府町飯土井字長者前24-15
TEL 022-356-3131 FAX..022-356-3578

AD-3

MEMS触覚センサシリーズ

ショッカクチップ＆ショッカクプローブ

薄型・小型のMEMS６軸センサ
ショッカクチップ
オールインワンで指先サイズを実現した
世界最小の多軸触覚センサ
圧縮方向の力(Fz)とせん断力(Fx/Fy)の3軸力に加え各軸のモーメント(Mx/My/Mz)を合わせた6軸力を同時計測

手触り感検出に特化した触覚センサ
ショッカクプローブ
世界初、『手触り』を計測する触覚センサ
人の指紋に近い構造で手触りの数値化を実現
表面微細凹凸と摩擦力変化を同時検出可能

AD-4

AD-5

AD-6

SOLUTIONS FOR
MEMS PROCESSESEVG is the first semiconductor equipment supplierever to receive Preferred Supplier status by
Bosch. According to Bosch, the most efficient
suppliers to the company are appointed as
preferred suppliers. These suppliers participate toa greater extent in new projects and are involved
in development projects at an early stage.
EVG received this accolade for its equipment aswell as its comprehensive customer support.

Photo ©BoschEV Group Japan K.K.
Marketing+CommunicationsJapan@EVGroup.com
TEL: 045-348-0665

AD-7

www.EVGroup.com

開発報告
業界きっての技術力を持つ

住友精密工業 が開 発 し た
ノ ー ス フ ァ イ ン ダ ー™
姿 勢 方 位 基 準 装 置 (AHRS)

GCAH-12

概要
 MEMS技術により、 小型・高耐久・低価格を実現
 GPSなしでリアルタイム姿勢方位を出力
 初期静定は簡単、コマンドひとつだけ 慣性センサ出力をもとに自動演算

重量: <400g

⻑さ: 258mm

詳細はこちら www.spp.co.jp/mems
Copyright © SUMITOMO PRECISION PRODUCTS Co., Ltd. All rights reserved.

AD-8

AD-9

専門技術間のシームレスなデータ連携を実現するソフトウェア設計環境
MEMS概略設計

マスク、プロセス設計

等価回路要素による高速設計機能
MEMS,電気,論理,デジタル回路要素による混成モデルに対応
３Dモデル,他に出力対応

MEMS構造設計者向けデザインルールチェック
Dry,Wetエッチングシミュレーション
プロセスフロー設計
各種マスクデータ形式に対応

デバイス設計システム解析

Optical,Piezo,Sensor,RF,Bio,他の各種MEMSに対応
３次元、複合物理場によるデバイス性能設計機能
構造, 電場, 静電場,流体,流体減衰効果,
熱弾性減衰効果, 溶質,インピーダンス,
電磁駆動,他に対応

ASIC設計との連携機能
ユーザー設計環境に対応

v9.0追加機能

DEEP-RIEシミュレーションでのマイクロローディング効果の反映●

PZTデバイスマクロモデル解析の拡張●

エッチング解析のサファイア/InP対応● Dryエッチング解析/Cariblation機能の改良

Raytheon/TIRF switch
Non-linear contact analysis

Draper vibratory gyroElectrostatic drive

Lockheed inertial device
Squeeze film analysis

Rotary ring gyro
Rate/Coriolis analysis

AD-10

Introduction to AAC MEMS
AAC is a major and global supplier of advanced MEMS microphones, MEMS sensors and RF products. The
MEMS business unit has strong capabilities in R&D, manufacturing and global sales for the high performance
MEMS microphone and also MEMS speakers, RF products for better user experience.
Total Shipment of AAC MEMS microphones

Microphone Shipments

5,024,000,000+

Top 3 Globally

Manufacturing

R&D

8

100+

R&D centres
Shenzhen, Wuhan, Hong Kong,
Taipei, Singapore, Edinburgh
Nanjing, Irvine

Ph.D and master
degrees

900+

3

Production bases

Patents

18,100M

150M/month

Production Capacity

Plant area

Shenzhen, Nanning, JohorClass 100
andClass 1000
cleanrooms

MEMS Microphone
AAC’s digital and analog MEMS microphone with high SNR (up to 70dB) and very low
distortion for consumer bring a studio-quality experience. We now also offer highperformance ultrasonic microphone, VPU microphone, smart microphone and A2B
microphone module for applications in consumer, industrial and automotive markets.

MEMS Chip

ASIC Chip

A2B Module

MEMS Speaker
AAC owns IP and technologies on key MEMS chip development, and also AAC has very deep accumulation on packaging and testing. AAC
provides an advanced solution of speaker with full-range Hi-Fi sound quality for wearable devices such as TWS, smart glasses, etc.
MEMS speakerSpeaker Module(TWS)• Size: Φ6mm X 1mm;
• SPL : ≥105dB @6kHz~20kHz;• THD : ≤5% @6kHz~20kHz;• Loudness consistency : ±0.5dB;• Power consumption : 10mW(MEMS+IC);• Dynamic Speaker （ Customizable ）• MEMS speaker （ Customizable ）• Size: Φ11mm X 3.6mm

MEMS RFAAC will start from RF MEMS technologies and expand to all RF front-end devices based on our own IP and technologies, international
R&D team and local implementation capability. AAC device and solution could apply on consumer electronics, wearable, IoT devices
and other wide application scenarios.
RFC

SP4T Die
RF1

RF4

RF2

RF3

ESD

MEMS Switch & Tuner

RF SOI Device

CMOS Controller

FBAR Filter

CTL1

CTL2

VDD

Low insertion loss, High isolation, High power

FOM =12 /Revolutionary improvement of IL and ISO

High Q, Low insertion loss High roll-off / small size

handling, High linearity• MEMS switches - Own IP• Extremely low FOM, revolutionary improvement of IL and ISO• Reliability lifetime up to 1b, high reliability• FBAR filter design – Own IP• Stable MP process• High Q, low insertion loss, high roll-off, small size

• Advanced Process of RF SOI• Small size, low insertion loss, high pressure resistance, high linearity• Comprehensive RFFE product roadmap

MEMS Inertial Devices
The Integration of independent design capabilities, precision manufacturing capabilities, and testing& calibration capabilities help
achieve high-precision and high-reliability for vibration monitoring, attitude detection and dead reckoning in various application scenarios. Our goal is to provide a complete solution from inertial chip level to module level.

IMU Module for Automotive navigation＞L3 self-driving inertial module

High precision, providing more accurate navigation position information;
High robustness, module output being environmental vibration immune;

Inertial chips~0.1°/hr high performance
Gyro MEMS chip








~
 ±~
 
±








 ± 
±

High precision, providing more reliable vibration monitoring, posture detection, and dead reckoning ;Completely localized supply chain, with independent and controllable design, packaging and testing capabilities;

About AAC Technologies
Founded in 1993 and listed on the Hong Kong Stock Exchange in 2005 (Ticker Symbol: HK2018), AAC Technologies is a world-leading solution provider for smart devices. The company
boasts the cutting-edge technologies in material R&D, simulation, algorithm, design, automation and manufacturing process development, which enables us to provide most advanced
miniature technological solutions in fields like acoustics, optics, EM Drives, Precision Processing, MEMs, Wireless RF and antenna. For more information, please visit our official website:
AD-11
www.aactechnologies.com

AD-12

シリコーン 技術でサステナブルな社会に貢献

ダウグループの一員として、化学の可能性を無限に広げ、イノベーティブなシリコーン技術と製品をベースにお客様のニーズや業界が抱える課題解決に貢献する
ダウ・東レ。

ホーム・アンド・パーソナルケア用途、
エレクトロニクス、
商業建築や高機能建築、
消費財、
シリコーンエラストマー
や化学業界などにおける、ソリューションや原料を提供します。
ダウ・東レ株式会社〒140-8617東京都品川区東品川2丁目2番24号
天王洲セントラルタワー03-5460-4380（代表）www.dow.com/dow-toray
Images: dow_41267764247, dow_43184174388, dow_40458048627, dow_40681827476, dow_41959188183,
dow_57557400369®™：ザ・ダウ・ケミカル・カンパニーまたはその関連会社の登録商標。
DOW TORAYの商標のTORAYの部分は、使用許諾のもとで使用している東レ㈱の商標です。
© 2021 The Dow Chemical Company. All rights reserved.
2000009402 Form No. 01-4676-42-0321 S2D

AD-13

東北大学 金森義明教授・産総研・（一社）ミニマルファブ推進機構との共同開発
水素アニール技術を基盤とした新技術を搭載

原子レベルアンチエイリアス熱処理ミニマル装置（ミニマルレーザ水素アニール装置）

シリコン微細構造の原子レベルでの平滑化と丸め制御により、様々な分野・用途における MEMS デバイスの高性能・高信頼性を実現
シリコン微細構造断面（レーザ水素アニール処理）
処理前

R=1.6μm

処理前Si
スキャロップ

1μm

Si

127nm

（スキャロップ）Si✔ クリーンルーム不要✔ クリーン水素処理を可能とする
超高真空対応（5×10 -5 Pa 以下）

平滑化

RMS1nm 未満
400nm✔ コンパクトな筐体（幅約 30cm）✔ 低消費電力（定格 AC100V 10A）

処理後

高さ

側面部

平成 30 年度
～令和 2 年度
戦略的基盤技術
高度化支援事業（サポイン事業）✔ φ12.5mm ウェハ（枚葉処理）

丸め
1μm

Atomic-Antialiasing Annealing

特長

処理後

角部

Atomic-Antialiasing Annealing✔ 急速昇降温（1100℃まで 2.5 秒）
Si

400nm

用途例：【 MEMS ミラー】

・自動車用 LiDAR のセンシング範囲の拡大
・スマホ用の至近距離・広角プロジェクタとしての活用 など

坂口電熱の主要製品✔ 安定した温度制御（1100℃±0.5℃）（σ/Ave.）✔ 均一温度分布（ばらつき0.5%）

加熱試験のご相談も承ります

温調器 SCR-SHQ-A2

セラミックヒーター

超高速・高精度・高性能。超高速
サンプリング ��ms（�.�� 秒）を実現しました。持ち運びができ、移動用としてもお使いいただけます。幅広い温度管理に最適です。

セラミック基板に発熱体を高精度印刷した小型のヒーター。
自己制御タイプもあります。

マイクロケーブルエアーヒーター

エックス・レーザー・ライト

マイクロヒーターを特殊な形状

超高速な昇温降温が可能なレーザー
平面瞬間加熱装置。�.� インチ基板を � ショットで均一に加熱します。
雰囲気を加熱しないため省エネです。プロセスに合った温度制御が可能です。真空度・ウェハサイズ・導入ガス等カスタマイズも承ります。

に加工し、SUSのパイプに挿入・組込んだ製品。空気・窒素ガス等を加熱するのに最適です。
断熱材

エミファイン ジャケットヒーター
弊社独自の製法のガラス繊維を使用した、軽量で保温効果の高い断熱材料。従来品比 ��％省
エネ・��％軽量です。

お問い合わせ先︓
坂口電熱株式会社 www.sakaguchi.com
営業本部 TEL︓03-5624-5054

AD-14

AD-15VPG+ ȦȏȉȉScholar

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AD-18

AD-19AD-20▲▲

詳細は製品 WEB サイトで！

https://www.marubeni-sys.com/bondtech/

製造ソリューション事業本部 デザインファクトリー部 ファクトリーソリューション課
本社：169-0072 東京都新宿区大久保三丁目 8 番 2 号 新宿ガーデンタワー

bondtech@marubeni-sys.com
https://www.marubeni-sys.com/
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AD-25マイクロナノ・オープンイノベーションセンター

MNOIC: MicroNano Open Innovation Center

最先端MEMSラインによる研究支援・工程受託サービス
MNOICでは、産総研が蓄積した最先端MEMSの研究成果と、産業界から日本を代表する半導体、MEMSの製造企業出身の技術者による応用技術を合体させ、幅広いニーズに応える研
究開発支援や工程受託などの多様なサービスを提供します。

MNOIC微細加工事例

Si深掘エッチャ
(12”)

深溝加工
（幅:5μm, 深さ:
200μm）

深溝加工（幅:20μm, 深さ:
400μm）

12”SiウェハX線ミラー加工例【お問合せ先】

一般財団法人マイクロマシンセンター

MNOIC研究企画部 Tel. 03-5835-1870
MNOIC開発センター（産総研つくば東事業所内） Tel. 029-886-3471
Mail: mnoic@mmc.or.jp
URL: http://mnoic.nanomicro.biz/
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The Highest acceleration voltage in the world!

Electron Beam Lithography System

超 ポイントビーム電子線描画装置

130kV

CABL - UH Series
Next Generation High Performance Electron
Beam Lithography Systems and Process
Technology Solutions into the Future!

● <1.6nm Beam diameter● <7nm fine line
● Single step acceleration● 110keV, 90keVmodels available● Ultra stable due to Double thermal control● Double Permalloy shields
Application● Creation of new materials● Quantum, effect devices● nano-devices● Sub 5nm gaps

株式会社クレステック〒192-0045 東京都八王子市大和田町 1 丁目 9 番 2 号
TEL: 042-660-1195(General) FAX: 042-660-1198
ＥＭＡＩＬ : sales@crestec8.co.jp

CRESTEC CORPORATION. Head quarter
Address: 1-9-2, Owada-machi, Hachioji-shi, Tokyo 192-0045 Japan
TEL: +81-42-660-1195(General) FAX: +81-42-660-1198
ＥＭＡＩＬ sales@crestec8.co.jp

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Accelerate product development with CoventorMP ®
The industry-leading MEMS design automation platform

Parametric
Design Entry

Modeling& Simulation

Layout

MEMS+®

Optimization& Integration

Compact FEA

DeviceLevel
SystemLevel

CoventorWare®

Materials,
Process

FEM/BEM Field Solvers

Accelerometers

Gyroscopes

Microphones

CircuitLevel

Micro Mirrors

And many more MEMS devices...
MEMS+ and CoventorWare work seamlessly together in the CoventorMP framework. They provide adesign platform that enables MEMS designers to simulate critical end-product performance specs suchas sensitivity, linearity, frequency response, signal-to-noise ratio, temperature stability or actuation time.
These software tools are ideal for MEMS devices that employ mechanical, electrostatic, piezo-electric,
piezo-resistive, or thermal effects for sensing or actuation.

www.coventor.com
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Advanced Packaging Technology
R&D and mass-production machines are available
Wafer Bonding Machine

Si-Si RT Bonding※Measured by IR light

Room Temperature Bonding(SAB), Direct bonding,
Eutectic bonding, Adhesive
bonding and Anodic
bonding are available.
Everything of wafer bonding
is possible even 1000 degree
C temperature used.

No Void Bonding

Flux-free Reflow System

Metal bonding

Void free reflow and solder
connection is available with fluxfree reflow system for powerelectronics, LED, high density
solder connection.
Formic acid can remove oxidation
layer from metal surface.

Low temperature metal bonding canbe processed by using formic acidtreatment
Cu-Cu bonding cut view
Cu
Bonding Surface
Cu
Cristal grows through bonding surface

Narrow pitch solder
connection

Cu bonding strength
Base Metal
Cu bump
Cu

High density bump
reflow

A chip
B chipPealing test after bonding

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Break at UBM, Bonding
surface is strongセンサ・マイクロマシン部門（E 部門）
電気学会とは
電気学会は，1888 年に創設された学者技術者で構成される会員組織の学術法人です。すでに 1 世紀以上の歴史を有する
伝統ある学会ですが，絶えず革新を求め，事業活動の活性化に努めています。第一線の研究者・技術者から，学生に至るまで幅広い方々の参加・支持を得ています。
https://www.iee.jp

センサ・マイクロマシン部門 (Ｅ部門 ) とは
電気学会センサ・マイクロマシン部門（Ｅ部門）は，1995 年に設立された最も新しい部門です。これまでの電気学会の枠にとらわれず，計測工学・物性工学・精密工学・情報科学・ライ
フサイエンスなど，センサとマイクロマシンに関連する分野の技術者や研究者の参画を広く得て，21 世紀の新たな基盤技術を作り出すために，協同・協力して研究開発をすすめる交流の場となることを目指しています。
https://www.iee.jp/smas

部門大会「センサ・マイクロマシンと応用システム」シンポジウム
部門大会である「センサ・マイクロマシンと応用システム」シンポジウムは，センサ，マイクロマ
シン，MEMS などに関する我が国最大の講演会です。今年は Future Technologies from TOKUSHIMA
として，合同シンポジウムを開催します。センサ，
マイクロマシン技術のさらなる発展を目標に，学協会を超えた研究グループ間の情報交換，研究成果およびアイデアの討議の場として開催されます。

発表申込締切2022 年 6 月 15 日 ( 水 ) 正午
同時開催シンポジウム
第 13 回「マイクロ・ナノ工学シンポジウム」
第 14 回「集積化 MEMS シンポジウム」
化学とマイクロ・ナノシステム学会 第 46 回研究会

総合研究会
本会は，センサ・マイクロマシン部門にあるマイクロマシン・センサシステム，ケミカルセンサ，
バイオマイクロシステムの各分野を軸として，本部門における研究会を総合的に行うものであり，部門内の交流，若手の育成，発展に寄与することを開催趣旨としています。
本年は，2022 年 6 月 7 〜 8 日に金沢商工会議所
にて開催します。皆さまの積極的なご参加をお願いいたします。
発表申込締切 2022 年 4 月 8 日 ( 金 )https://www.iee.jp/blog/esoken2022/

電気学会論文誌 E
電気学会論文誌 E（センサ・マ
イクロマシン部門誌，E 部門誌）
は国内唯一のセンサ・マイクロマシン専門誌として 20 年以上の歴史を持っています。一般論文に加え解説，特集号，研究室紹介，国際会議報告，特別記事，
座談会など魅力的なコンテンツを掲載しています。皆さまの投稿をお待ちしています。
https://www.iee.jp/smas/publication/magazine/
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東北大学

試 作コインランドリ
Hands-On-Access Fabrication Facility

時間単位でご利用いただける、MEMS・微細加工のための共用施設
idea

ー An open facility for every MEMS engineer ー
1,800m2の大型クリーンルーム
東北大学西澤潤一記念研究センター

企業、大学等から試作品、製品
加工・評価
機器

加工条件
ノウハウ

スタッフの
サポート

結果のフィードバック

大学の
研究成果
•
•
•
•
•
•
•
•

100台以上の微細加工・評価機器をご利用いただけます。
単工程からセンサなどのデバイスの試作開発まで可能です。
大学に蓄積された技術、ノウハウをご利用いただけます。
15名の専属スタッフが設計から試作、評価まで支援します。
機器、技術支援は時間単位でご利用可能で、1時間あたり1,000円～25,000円程度です。
一定の条件のもとで製品の製作も可能です。また、機器利用だけでなく、共同研究など多様な使い方も可能です。
2010年の開始以降、これまでに約300社が利用しています。年間10,000件以上の機器利用の実績があります。
圧力センサ、波長可変光源、血液分析チップなどの製品化事例があります。

試作コインランドリHP

http://www.mu-sic.tohoku.ac.jp/coin
AD-31

ＭＥＭＳパークコンソーシアム
産学官の連携により、国内外の企業、研究機関、支援組織等とのネットワークを構築し、MEMSを中心としたマイクロデバイス分野の研究開発・産業化促進を行っています。

■第第20回
回MEMS集集 中 講 義 in 香川
日時 : 2022年8月8日(月) ～ 8月10日(水)場所 8日、9日

10日

かがわ国際会議場（YouTubeライブ配信あり）

香川大学 創造工学部3101教室（YouTubeライブ配信あり）

主催 : 東北大学マイクロシステム融合研究開発センター、MEMSパークコンソーシアム、香川大学微細構造デバイス統合研究センター
参加無料。プログラム等の詳細を、MEMSパークコンソーシアムHPに後日掲載します。

■International Contest of InnovAtioN (iCAN)
MEMS等のデバイスを活用して、役立つアプリケーションを製作し、発表する学生向けのコンテス
トです。MEMSパークコンソーシアムが日本予選を毎年開催し、上位チームを世界大会に派遣しています。オムロン、日本信号、アルプスアルパインからMEMSデバイスを提供いただいています。
気圧センサ

赤外線センサ

第5回世界大会（仙台） 2014年7月

2015年1月 ラスベガス CESに出展

2014 世界1位 郡山北工業高 防災・防犯ロボット
第6回ものづくり日本大賞（内閣総理大臣賞）
2015.112015 世界1位：NPO natural science、東北大、大阪大 茶道のお点前点数化

2011 世界第1位 京都大
指文字翻訳機2016 国内第2位 郡山北工業高
尿糖値センサ2009 世界第2位 京都大
LEDアレイを搭載したブーメラン

2016 国内第3位 郡山北工業高
赤ちゃんのうつぶせ寝検知

2017 世界第1位 東北学院大/東北
大 スマホ・PC操作時の姿勢矯正

2017 国内第1位 東北大
リハビリを補助するけん玉

iCANに協賛いただける企業を募集しています。

■人
人材育成事業
MEMSの試作を通じて、設計・加工・評価のノウハウを提供します！
受講される方が、作りたいデバイスを東北大学試作コインランドリに持ち込んでいただく「オーダーメード型」です。MEMSは標準化が困難で、デバイス毎に形状や作製プロセスが異なるので、多くのノウハウを習得する必要があります。そのため、とくに初めてMEMSに取り組まれる場合、実際にデバイスを試作しながら技術を学んでいただくことが最も効果的と考えています。
受講者の募集：随時（通年）。
事前相談：御希望に応じた受講内容を相談、提案いたします。
実習内容：企画、設計、試作、評価まで1～3か月で実施します。設計のみ等、柔軟に対応します。

MEMSパークコンソーシアムでは入会を随時受け付けております。http://www.memspc.jp/
AD-32東北大学 大学院工学研究科 ロボティクス専攻（秀）研究室田中

ナノシステム講座 スマートシステム集積学分野
http://www.mems.mech.tohoku.ac.jp/index.html

教 授

田中 秀治

シニアリサーチフェロー

門田 道雄

准教授

塚本 貴城

准教授（µSIC）

Jörg Frömel

講師（μSIC）

鈴木 裕輝夫

助教

助教

山田 駿介 Andrea Vergara

客員准教授

室山 真徳

客員准教授

吉田 慎哉

材料からシステムまで、MEMS・マイクロシステムの研究開発

MEMS（Micro Electro Mechanical Systems）は人間と機械との間をつなぐ入出力システムとして広く利用されていますが、それを発展させた新しいマイクロシステムを創出しています。たとえば、ロボットやVRシステムに用いられる高性能ジャイロスコープや触覚センサ、情報通信や無線センサの要となる周波数選択・制御デバイス、安心・安全、健康、あるいは省エネルギーのための各種センサなどがあります。これらのマイクロシステムは、これまでにない機能や性能を発揮するために、集積回路との一体化、機能性材料の利用、新しいパッケージングなどを必要とします。そのため、異種要素をウェハレベルで集積化するヘテロ集積化技術、ウェハレベル・パッケージング技術、機能性材料の成膜技術などの基盤技術も開発しています。また、企業との共同研究、技術支援、研究機器の公開、および国際連携にも力を入れています。

図1 システムレベル・デバイスレベルで高性能化したMEMSジャイロスコープ

図2 ロボットハンド * に実装した集積*東京都立産業技術高等専門学校
化触覚センサ
深谷直樹准教授提供

図3 MEMS-LSI集積化プラットフォーム（TSV付きLSIによる気密封止）ロボット，自動運転車，スマートフォン，ヘ
ルスケア機器などのための高性能センサー

無線通信をつながりやすく、高速にするための周波数選択・制御デバイス

MEMS と LSI に 代 表 さ れ る 異 要 素 の 集 積 化 技 術 、MEMSをウェハーレベルで真空封止するためのパッケージン
グ技術などを開発しています（図3）。これらは、マイクロデバイスの小形化や高機能化に必要な共通基盤技術であると同時に、多くのノウハウを必要とする差別化技術でもあります。また、原子層堆積（ALD）装置、ウェハーボン
ダーなどのプロセスツールも開発しています。

【お問合せ先】
東北大学 大学院工学研究科 ロボティクス専攻
教授 田中 秀治
TEL: 022-795-6934
E-mail: tanaka@mems.mech.tohoku.ac.jp※いつでも技術相談を受け付けています。

スマートフォンに代表される携帯情報端末の普及とコンテ
自動運転やロボット制御のため、従来のMEMSジャイロ
ンツの充実によって、周波数資源がひっ迫しています。無スコープを格段に高性能する研究を行っています（図1）。
ロボットの体表を覆うバスネットワーク型触覚センサーを、 線通信の根幹を担う周波数制御機能は、実は機械的に力センサーと信号処理・通信用集積回路が一体化された 振動するマイクロデバイスによって実現されています。通信形で開発しています（図2）。また、ジェスチャー認識や位 のさらなる高密度化と高周波化に対応するために、Q値と置制御のための超音波レンジファインダー、光素子の制御 温度安定の高い弾性波デバイス（SAW・BAWデバイス）、集積化高周波MEMSスイッチなどを開発しています。
に用いるマイクロアクチュエーターなども開発しています。
また、圧電薄膜材料や圧電デバイスの開発にも力を入れています。
ウェハレベル・パッケージング／集積化技術

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AD-34࣮࢜ࣉࣥࢡ࣮ࣜࣥ࣋ࣥࢳ

ἘὊἨἽἅὊἓ
KOACH T 500-Fɭမஇɥኢỉฌ෋ࡇửૠҗᅺỂ࢟঺ฌ෋ࡇầɧ‫ܭܤ‬ễẶẟỂ‫ڂ‬૗ẲẺẮểỊẝụộẶỮẦẇ
ỼὊἩὅἁἼὊὅἉἋἘἲ ᵩᵭᵟᵡᵦίἅὊἓὸầ࢟঺ẴỦฌ෋ᆰ᧓ỊɭမஇɥኢỉᵧᵧᵱᵭἁἻἋᵏỂẴẇ᭗ẟฌ෋ࡇử࣏ᙲểẴỦ˺ಅỆờჺ଺᧓ỂἾἋἯὅἋᑣẪ‫ࣖݣ‬ỂẨộẴẇ

‫׊‬ỪễẟẦỤ˺ಅầẲởẴẟ
৖ΨẻẬỂễẪɥᢿở‫ͨښ‬ử‫׊‬ạẮểễẪฌ෋ᆰ᧓ử࢟঺ẲộẴẇỼὊἩὅễỉỂཋửЈẲλủẴỦѣẨỆờ࠮ฏẲộẶỮẇ᫋ࣇᦟỉᚇ‫˺ݑ‬ಅờಏỆᘍảộẴẇἅὅἑἱἜὅἚửእଔẪ੎ЈỂẨỦỉỂฌ෋ࡇỉዜਤሥྸờቇҥỂẴẇ‫׊‬ỪễẟẮểỆợụἅ̅ẟẺẟ‫ئ‬৑ỂἋὊἣὊἁἼὊὅử࢟঺ἁἼὊὅἽὊἲỉɶẻẬỂễẪẆ୍െấ̅ẟỉதỉɥờἋὊἣὊἁἼὊὅ҄ỂẨộẴẇ
ᆆѣờỂẨẆ̅Ừễẟ଺Ị༾˄ẬỤủỦỉỂἋἬὊἋửஊј෇ဇỂẨộẴẇ

ࢡ࣮ࣜࣥࠊ࣊ࣝࢫࠊࢭ࣮ࣇࢸ࢕࡛♫఍࡟

䛈102-8459 ᮾி㒔༓௦⏣༊ᅄ␒⏫䠓␒ᆅ
䠰䠡䠨 03䠄5276䠅1931 䠢䠝䠴 03䠄3265䠅1976

AD-35

㻷㻻㻭㻯㻴

᳨⣴
⣴

AD-36

AD-37

XPERI IP BUSINESS IS NOW ADEIA[ AHH-dee - uh ]Adeia turns
ideas into
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Our name may be new, but our roots
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Adeia invented and pioneered
Direct and Hybrid Bonding
DBI Ultra

DBI

ZiBondDie-to-Wafer
Hybrid Bonding

Wafer-to-Wafer
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Wafer-to-Wafer
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adeia.com

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Better Entertainment.

AD-38

MEMS Foundr y Service

Core Technology◆ Patter ning

◆ Si DEEP RIE◆ Feed Through◆ Sacrificial◆ Thermopile
layer etching

MEMS CORECo., Ltd.

Sites: Head office and Izumi Factory
Izumi industry park, Sendai City, Miyagi Prefecture
Tel: 022-777-8717, Fax: 022-777-8718
Web：https://www.mems-core.com/
AD-39

センサー加工プロセスに最適な

NAGASE のフォトレジスト
リフトオフプロセス
汎用エッチングプロセス
金属成膜

レジスト
パターニングエッチング

剥離

4 steps
リフトオフプロセス
レジスト
パターニング

金属積層

剥離

3 steps

製品ラインナップ
リフトオフプロセス用2層レジスト
BLX シリーズ

2.5D 露光用レジスト
GDX シリーズ

１.5um L/S パターン

リフトオフプロセス用単層レジスト
UCZ シリーズ

Profile Control
5um 直径パターン

ウェットエッチング用レジスト
GRX シリーズ

1um L/S パターン10um L/S パターンx

Durability
絶縁層形成用レジスト
RDX シリーズ

高耐熱性用途用レジスト
PNS シリーズ

170’C
ベーク

270’C
UV キュアベーク

20um C/H パターン

【お問合せ窓口】
⾧瀬産業株式会社 精密加工材料事業部 営業担当/三宅Tel: 06-6535-2415 E-mail: daisuke.miyake@nagase.co.jp
AD-40

カスタムメイドマイクロ化学チップ
ガラスを中心として、エッチング、切削、モールディングなど、多種な工法を用いてカスタムチップを1枚より作製いたします。

マイクロフルイディクス用周辺機器

空圧ポンプ、流量計、バルブなど
マイクロフルイディクス専用周辺機器を各種取り扱っております。

〒212-0032 川崎市幸区新川崎7-7
新川崎・創造のもり地区内産学交流・研究開発施設（AIRBIC） A-19

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□ SEMICON̲KOKUSAI̲ELECTRIC

A1サイズ W594×H841（7tDM・アルミフレーム付）×1set

scale=1/1

バッチサーマルプロセス装置
200mm Batch Thermal Process System

VERTEX Revolution

に
ス
セ
ロ
プ
ス
イ
バ
デ
ウェーハ

径

小
全ての

※VERTEXは(株)KOKUSAI ELECTRICの登録商標です。
VERTEX is a registered trademark of KOKUSAI ELECTRIC CORPORATION.

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一芸を極めて世界に挑戦（圧力計測技術で様々な産業を支える）

安 全・安 心 の 圧 力 計 測

ワイヤレス製品シリーズ

室内監視計測シリーズ

水素関連製品シリーズ

半導体産業用圧力センサ

東京本社

上田計測機器工場

丸子電子機器工場

製品ショールームを兼ねた東京本社。

機械式の圧力計・圧力スイッチをメインに生産。

微圧から高圧までのセンサ素子を利 用した 各 種 圧 力センサをメインに生産。

長野計器テクニカル・
ソリューションズ・センター

高度なセンサ技術を支える研究開発拠点。

長野計器株式会社
本社／〒143-8544 東京都大田区東馬込一丁目30 番 4 号 TEL.03（3776）5311 FAX.03（3776）5320
お問い合せはフリーコール 0120-10-8790
http://www.naganokeiki.co.jp/
AD-43Furuya Metal Co., Ltd.
Aiming to be the leader of the world in ruthenium and iridium

Sputtering Targets

FURUYA METAL provides wide variety of sputtering targets for various applications.
FURUYA develops materials which is attuned to customer’s needs, making ourtechnologies of precious metals having been accumulated for many years.
Especially for Ruthenium and Iridium, our capacity and refining technology are theone of the finest in the market and we dedicated to develop new alloy materials as
well, with our corporate philosophy of "contributing to the development of scientifictechnology and the prosperity of society"

Production/R&D
Sputtering services/Material design

Recovery and refining scraps■Applications
Ir
Ru
Pt
APC
Al alloy

MEMS、MRAM、ReRAM、FeRAM、etc.
HDD、Interconnectors、Magnetic devices, EUV Mask blanks.
MEMS、MRAM、etc.
MEMS mirror、LED、OLED、Quartz crystal unit、IGBT、etc.
AlSc、AlMgX
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Sensing Edge Device(SED)
Liquid Concentration Sensor
非非接触式液体濃度センサモジュール■センサを最適化することで、様々な液体濃度測定に対応■リアルタイム(1回/1秒)データ取得が可能■温度変化による濃度補正アルゴリズムを搭載

センサ部

データ処理部

測定電極
センサ回路

信号処理回路アルゴリズムPC

ブロック図

水の硬度測定センサ部
サイズ [mm]

Φ87 × t11.3

重量 [g]18.6

機能液体濃度センサ
温度センサ

通信方法(センサ - データ処理部間)

カスタム通信

測定電極

データ処理部
サイズ [mm]

17 × 15 × t5

重量 [g]

1.5

部品数

54個

機能

信号処理
温度補正アルゴリズム

通信方法(データ処理部 - PC間)

USB接続(UART)

新光電気工業株式会社

SHINKO ELECTRIC INDUSTRIES CO., LTD.

〒381-2287 長野県長野市小島田町80

80 Oshimada-machi, Nagano-shi, Nagano 381-2287 JAPAN

お問い合わせは当社Webサイトからお願いいたします。
https://www.shinko.co.jp/product/inquiry/form/index.php

Please contact us via inquiry form on the web.
https://www.shinko.co.jp/english/product/inquiry/form/index.php© 2022 SHINKO ELECTRIC INDUSTRIES CO., LTD.
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モデル &5;<=

エポキシダイボンダー

軸マニピュレーターを標準装備□PPのチップ、Φ0.06mmのハンダボール、Φ0.015mmのワイヤーなどを容易にハンドリングすることが可能です。
ペースト配線、スタンピング、ケガキなどに対応した高精度マニュピレーターです。

モデル 'ウエッジワイヤーボンダー

金線、アルミ線、銅線、3W線等のワイヤーボンディングが可能
金ブロック実装と組み合わせることで、0(06デバイスを含めた様々なデバイスに対して、容易にボンディングを行うことが可能です。

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MEMS Engineer Forum［MEF］

April 20-21, 2022
KFC Hall, Ryogoku, Tokyo, Japan

Gold Sponsors

Silver Sponsors

Bronze Sponsors

SPONSORSMEMS Engineer Forum［MEF］

April 20-21, 2022
KFC Hall, Ryogoku, Tokyo, Japan

REGURAR EXHIBITORSSTART-UP EXHIBITORSACADEMIA EXHIBITORSEXHIBITORSANNOUCEMENT of Future MEF

The 14th
MEMS Engineer Forum (MEF) 2023

Wednesday, April 19, 2023&
Thursday, April 20, 2023

Contact:
MEMS Engineer Forum (MEF) Secretariat
Semiconductor Portal, Inc.
mef_2022@semiconportal.com
Tel: +81-3-6807-3970

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