New Year's Greetings......1
MMC Activities..............2
MEMS-ONE Pj...............5
Column.......................6
Overseas Trends............7
Member’s Profiles .........8

New Year’s Greetings
I would like to take this opportunity to extend my best wishes to all for a happy
and prosperous 2007. I have no idea what kind of a year this will turn out to be, but I
hope to try and make it a good one.

Tamotsu Nomakuchi

Last year’s increases in the price of oil, materials, and parts have cast shadows
over the recovery of the Japanese economy, particularly in the manufacturingindustry, which had been gradually progressing supported by firm domestic
demand. At the same time, major defects damaging the product reliability of wellknown companies that are the face of Japan have occurred. These incidents areshaking Japan’s manufacturing industry to its core and possibly weakening andendangering the basic technology in design, production, and product evaluation thathas thus far supported the manufacturing industry.

Chairman
Newly elected Prime Minister Abe last year hammered out the Innovation 25
policy, saying that he intended to make Japan the world leader in innovation. This isa long-term strategy initiative aimed at 2025 that should lead to the creation of basic
technology innovations to support existing industries as well as innovation seeds in nano, bio, and other frontier
technologies.

Micromachine Center

The Micromachine Center promotes research and development in MEMS (Micro Electro Mechanical Systems).
MEMS are small, high-precision, low-cost, low-energy frontier technologies that are now being applied in a diversity ofindustrial fields such as information and telecommunications, automotives, biotechnology, and medicine, and theirmarket is gradually continuing to expand. MEMS technologies are attracting attention as basic technologies vital forstrengthening the international competitiveness of major areas within Japan’s manufacturing industry by increasing
differentiation and the added value of key parts. Against this background, the MEMS Industry Forum (MIF) wasestablished in April last year as a special committee within the MMC with the purpose of providing support for thefurther development of MEMS industries and contributing to the strengthening of the international competitivenessof Japanese industry. The Forum’s activities are broad-ranging - including the promotion of MEMS technology R&D, afoundry service network, industry-academia-government collaboration, researcher and engineer training, regulationand standardization, and overseas expansion – and the Forum’s member businesses take a central role in the
promotion of policy recommendations and industrial exchange/revitalization that concern fundamental issues for
MEMS industrial expansion.

In November 2006, the Micromachine Center hosted Micro/Nano 2006 at the Tokyo International Forum.
Comprising the MEMS Forum – the first public presentation of information by the MIF – Micromachine Exhibition,
MEMS International Standardization Workshop, International Micromachine/Nanotechnology Symposium, and theReport of MemsONE Project Achievements, this event provided an excellent opportunity for people to see all at one
time the latest technologies and industrial trends in the micromachine field and was extremely well received. In 2007
the event will move to Tokyo Big Sight and plans are for it to be held on an even grander scale than before. I hopethat you will kindly participate and cooperate in this event.
Through the generation of innovation, the Micromachine Center will continue with our activities aimed at
establishing basic technology for and the industrialization of micromachines and MEMS in order to contribute to themaintenance and further strengthening of the international competitiveness of Japan’s manufacturing industry.
In conclusion, I would like to ask for your continuing support and understanding of our efforts and again warmly
wish everyone a fruitful and prosperous 2007.

Internet Home Page : http://www.mmc.or.jp/

MMC Activities

The 2006 International Micromachine / Nanotech Symposium: Report
The International Micromachine/Nanotech Symposium(Micro/Nano 2006) and Micromachine Exhibition were held in2006 as a combined event for the first time at the Tokyo
International Forum (Yurakucho, Tokyo) and other venues.
The MEMS Standards Internationalization Workshop,
MEMS Forum, the 12th International Micromachine/Nanotech
Symposium, and Report on MEMS-ONE Project Achievements
were all held over the three days (November 6-9) of theMicro/Nano 2006, attendance at each event surpassing
expectations. The Micromachine Exhibition was held over twodays, November 7-9, with the record attendance surpassing theprevious record by 2,638 (9,098/11,736) visitors. The 10 th
Conference on Miniaturized Systems for Chemistry and Life
Sciences (µTAS2006) was also held concurrently (November 59, 2006) and the synergistic effect of this event also contributed
to the tremendous success of Micro/Nano 2006. Detailed
reports of each of these events follow. The organizers wish to
express their deep gratitude to all those who cooperated or
assisted in the organization and holding of Micro/Nano 2006.
(2006 International Micromachine / Nanotech Symposiumand Micromachine Exhibition Secretariat)

The 2nd Workshop on Characterization of Materials for MEMS / MST Devices“MEMS Evaluation Methods and Standardization”

Used in many fields from sensors to man-machine interface
and medicine, the automobile industry to IT and AV, MEMS has
become a leading growth industry on a worldwide scale, yet the
MEMS industry has almost no universal standards, a fact which
is a significant impediment to industrial expansion.

• Dr Huh, KRISS (Korea Research Institute of Standards andScience), Korea• Professor Paul, University of Freiburg, Germany• Professor Muhlstein, Pennsylvania State University, USA• Professor Takashima, Kumamoto University, Japan• Professor Ritchie, University of California, Berkeley, USA

A workshop was thus held on November 6, 2006, at the
Mitsubishi Building in Tokyo with the purpose of having invitedresearchers – world leaders in the MEMS filed whose research
had produced outstanding results – speak on the very latest
MEMS-related micro/nano technologies and evaluation as wellas to provide a forum for the exchange of opinion anddeepening of mutual understanding between countries withrespect to the formulation of international standards.

Bringing together leading researchers whose work focuses
mainly on the characterization of materials for MEMS/MST
devices, this workshop provided many valuable opportunities;
the opportunity to exchange opinions about standardization
with the two researchers from Korea was particularly
meaningful from the standpoint of developing an international
network in the future.

The workshop began with an opening address by Organizing
Committee Chairman Higo (Professor, Tokyo Institute ofTechnology). This was followed by a total of eight presentations– Europe (3), North America (2), Korea (2), Japan (1) - divided
into two sections, “Frontline of MEMS Devices” and “MEMS
Evaluation Methods and Standardization”. The presentations
were listened to by a closely attentive audience ofapproximately 80 participants comprising representatives or
associates of businesses, universities, and research institutions.
In order of presentation, the speakers were as follows.

The fact that we were able to gain the understanding of theAmerican participants with regard to Japan’s promotion ofstandardization efforts was also a significant move forward,
providing an important pointer for international standardization
activities in the future.

“Frontline of MEMS Devices”• Professor Park, Kyunpook National University, Korea• Professor Hierold, ETH Zurich, Switzerland• Professor Brugger, EPFL, Switzerland

Photograph 1: Workshop in Photograph 2: Workshop speakers
progressand participants

The 17th Micromachine Exhibition Concludes in Success
The 17 th Micromachine was held over three days, from
November 7 to 9, 2006, at Tokyo International Forum (Yurakucho,
Tokyo); blessed with a great venue and excellent weather, theexhibition was a resounding success.

A record attendance of more than 11,736 people was achieved
over the three days of the exhibition, making the event a runaway
success. Next year the exhibition will be held at Tokyo Big Sight.

The 18th Micromachine / MEMS Exhibition will
be held at Tokyo Big Sight (Ariake, Tokyo)
from July 25 (Wed.) to 27 (Fri.), 2007.

The theme for this year’s exhibition was “International
Tradeshow for Micro/MEMS and Nanobio Technologies”.
In addition to 13 of supporting Micromachine Center member
organizations and 8 associate members of the MEMS Council,
willing and generous cooperation in the arrangement of exhibits
was also provided by private businesses, organizations,
universities, and independent public organizations. A record totalof 313 displays (429 booths) were exhibited by businesses,organizations, universities, and research institutions; 19
enterprises from abroad also presented exhibits.

2

MEMS FORUM
The MEMS Forum, the first public presentation of
information from the MEMS Industry Forum, was held in Hall Dof Tokyo International Forum on November 11, 2006. Due to thehigh expectations held for the expansion of MEMS applications
in a diversity of fields, attendance at the forum was far greaterthan venue capacity, with the hall packed with some 378
participants.

Under the theme of “Aiming for Expansion into MEMSrelated Industries”, the forum featured presentations on policies
for raising foundry capacity, regional clusters, and regional public
facility testing activities – all from the standpoint ofstrengthening the MEMS industrial foundation, MEMS industrial
policies, and MEMS business perspectives – and presentations on
the future expansion of MEMS from the standpoint of building
and strengthening the MEMS technological base.

MEMS Forum Chairman Nomakuchi

Division Director Takahashi of METI

We were gratified to receive comments from participants
who said that they found the forum content very meaningful
because of the opportunity it presented to see all at once thecurrent situation and future outlook for MEMS policies,
business, and technology - thank you to all those who kindly
gave us feedback.

12th International Micromachine / Nanotech Symposium
The 12th International Micromachine/Nanotech Symposium
was held in Hall D7 of Tokyo International Forum on November
8 (Wednesday). This symposium was held as part of Micro/Nano
2006 and supported by METI and NEDO under the sponsorshipof the Japan Motorcycle Racing Organization. Under this year’s
subtitle, “Innovations on Nanotech/Integrated MEMS andForerunners of MEMS Business”, invited speakers from theUnited States (4), Germany (2), Belgium (1), and Japan (5)gave presentations on a wide range of topics, from the trends in
cutting-edge MEMS and micro/nano systems research to futurebusiness fields for which high expectations are held. The hall
was packed with 246 participants and the discussions were
lively.

Manufacturing Industries Bureau, METI), who spoke about thecurrent positioning of MEMS and expressed a hope that in the
future MEMS would contribute to the strengthening of Japan’sinternational competitiveness as a “seed of industry”.

The symposium was also addressed by a distinguished guest,
Taizo Takahashi (Director of the Industrial Machinery Division,

12th International Micromachine / Nanotech Symposium in progress

Report on MEMS-ONE Project Achievements
The Report on MemsONE Project Results was held on
November 9 (Thurs.), 2006 at Tokyo International Forum aspart of Micro/Nano 2006. The meeting was attended by two
distinguished guests, Mr. Hiroshi Tsuchiya (Deputy Director of
the Industrial Machinery Division, Manufacturing Industries
Bureau, METI), and Dr. Masami Takayasu (Executive Director,
NEDO) and Professor Isao Shimoyama (Graduate School ofInformation Science and Technology, University of Tokyo) ,Project Leader for the “High-integration Composite MEMS
Production Technology Development Project” (Fine MEMS),
who spoke about MEMS development in a network with
MemsONE at the center in a presentation entitled“Expectations from Fine MEMS to MemsONE”.

functions; Mr. Atsushi Sato, Promotion activity Committee
Chairman Atsushi Sato announced the  and  version releases;
and in conclusion, Micromachine Center Executive Director
Keiichi Aoyagi presented a report on the support center
framework. The meeting was attended by 250 participants,
vividly demonstrating the high expectations held for MemsONE.

Micro / Nano 2007 and 18th Micromachine /MEMS Exhibition
D a t e s : July 25 (Wed.) -27 (Fri.), 2007
Venue : East Hall, Tokyo Big Sight (Tokyo, Ariake)
Times : 10:00-17:00
Concurrent Events : 13th Micromachine/Nanotechnology
Symposium; Introduction of
National/NEDO Projects; MEMS
Forum, etc.

The MemsONE Project Leader, Professor Hiroyuki Fujita(Institute of Industrial Science, University of Tokyo) presented
the welcoming address on behalf of the organizers; Project SubLeader Professor Hidetoshi Kodera (Department ofMicroengineering, Graduate School of Engineering, Kyoto
University) gave an outline and demonstration of MemsONE

3

MEMS Foundry Service Industry Committee
Kazushi Tomii, Matsushita Electric Works
Chair, Foundry Service Industry Committee of the MEMS Industry(1) Managing the foundry service network

1. Overview

In order to enhance contact between users andmanufacturers, we have provided a help desk on the FSICWeb site entitled MEMStation for accepting inquiries
from users. Beginning services in July 2005, MEMStation
provides a relatively easy approach to choosing a suitablefoundry business.

As micro-electro-mechanical systems (MEMS)
have gradually become more practical, a vast market
has begun to open up for MEMS devices. In recent
years, the role of foundry services has become
increasingly important in developing andmanufacturing MEMS devices. The MEMS Foundry
Service Industry Committee (FSIC) has been involvedin constructing a network of Japan’s foundry services.
This article outlines the activities of the FSIC.

(2) Instruction and joint public relations activities
through MEMS seminars

Since 2003 the FSIC has planned and conducted
MEMS seminars targeting MEMS engineers. Held twice ayear in Tokyo and Kyoto, for a total of seven times thus
far, the seminars have received favorable reviews. We
have also organized various joint seminars with exhibitors
at the Micromachine Exhibition in order to promote thefoundry network. Last year through the collaboration
with regional public research and testing institutions, wewere able to explain the services of various companies
offering foundry services to more than 100 people.

2. Activities of the FSIC
Formed within the Micromachine center in 2002, the
FSIC has regularly held conferences on issues shared by
MEMS foundries and has performed activities forpromoting services at MEMS foundries to potential users.
The membership of the committee is currently at elevenbusinesses and organizations involved with MEMS
foundries having varied strengths and specialties. Below
I will describe the committee’s primary activities andendeavors planned for the future.

(3) Dissemination of the MemsONE MEMS design andanalysis tool

The FSIC currently plans to participate in postproject dissemination activities for the NEDO projectcurrently underway to develop a design and analysis
support system for MEMS called MemsONE.
(4) Motion to expand the MEMS industry

Conventionally, MEMS has been more difficult tostandardize than semiconductors, with each company
developing their own designs and processes. As a result,more time is often needed to commercialize MEMS
devices, and small and medium sized companies using
research findings from universities and the like cannot
easily reach the stage of MEMS mass production andcommercialization. In light of these problems, we would
like to discuss and propose measures for enhancing thefoundry’s functions, such as creating design guidelinesand developing process menus, in order to promote useof the foundries.

Photo 1 Members of the MEMS Foundry Network

3. Conclusion
Beginning this year, the FSIC will operate within the
MEMS Industry Forum under the Micromachine Center.
Our objectives for this year include developing broader
intercourse with the industrial world and strengthening
the collaboration among industry, government, andacademia, while continuing to advance the constructionof the foundry network.

Photo 2 How the MEMStation works

4Initial Release of MemsONE
Kansai held in Osaka at INTEX Osaka, as well as aseminar to promote the products and technologies ofvarious exhibitors. These events offered large stages
to promote the features of MemsONE.

In November of last year, we began releasing anevaluation version (alpha version) of the MEMS design
and analysis software developed through a three-year
consignment project entitled the MEMS Open Network
Engineering System of Design Tools (MemsONE)
under the New Energy and Industrial Technology
Development Organization (NEDO). As of the end of
November, some 250 requests had been received forabout 600 licenses. We have been processing anddistributing these requests in the order received. We
expect to make needed revisions based on user
evaluations on the alpha version and release a version
for widespread (beta version), including allcomponents developed in the project by May 2007. It
is hoped that the software will be used by companies
for product development and / or design and by
universities for research and as a teaching tool.

We also gave a presentation on the achievements of
the MEMS Open Network Engineering System of
Design Tools at the 17th Exhibition MICROMACHINE
in November, drawing some 250 interested spectators.
At the same exhibition, we showed a video explaining
the MemsONE project and system in easy tounderstand terms. Approximately 1,000 pamphlets
describing the system were handed out at theexhibition and presentation, showing the large amountof interest in and expectations for MemsONE.

1. Goal of the Project and Features of the System
The goal of the MemsONE project was to develop asystem capable of providing advanced MEMS-related
knowledge and data , not only for leading experts in
MEMS research, but also for newcomers ( engineers
and researchers in a wide variety of fields and ofvarious experience levels to the field of MEMS), withthe aim of furthering growth in the MEMS industry.
To develop the MemsONE system, three softwaredevelopment companies took on areas of theirrespective strengths. Five companies with experiencein MEMS devices used their experience andachievements to design specifications and planevaluations. Faculty members at thirteen universities
provided cutting-edge knowledge and wisdom. And
one research institute provided measuring techniques
fostered over many years. The net result was a systemcomprising not only a standardized analysis and design
tool, but also a unique inverse problem program fordesigning masks and processes based on the final
structure; a program for evaluating joining/packaging,which can be problematic in device development; aknowledge database containing a wealth of
information; and a material database containing
materials acquired on process lines.

Photo 1 Activity at the exhibition booth

2. Dissemination Activities
In 2006, we expanded our promotional activities
aimed at popularizing the MemsONE system. For
example, at the 23rd Sensor Symposium on Sensors,
Micromachine and Applied Systems held at Sunport
Takamatsu in Kagawa in October, we provided atechnology exhibit, and our project subleader(Hidetoshi Kotera, professor at Kyoto University) gavea presentation as a guest lecturer on the features ofthe MemsONE system. These activities enticed many
people to try out the evaluation version. In the samemonth of last year, we provided an exhibit at the 9th
Design Engineering and Manufacturing Solutions Expo

Photo 2 A MemsONE demonstration given by projectsubleader Hidetoshi Kotera

3. Future Plans
As we prepare to distribute the beta version of theMemsONE system in May this year, we will work
toward resolving all remaining development issues inthe system and incorporating the comments of people
who have been using the evaluation version tocomplete a user-friendly system. We would like toencourage all who have tried the alpha version, to fillin and submit the questionnaire.

5Column

Gen Hashiguchi Laboratory
Intelligent Formative Engineering Course, Faculty of Engineering, Kagawa University
Gen Hashiguchi, Professor, Kagawa University
I hope to work on developing a functionalized AFM
probe for use in a solution so as to be able to link thistechnology to biotechnology research. Recently AOIElectronics Co., Ltd. has begun manufacturing andselling MEMS tweezers. They have made innovations
not only in the MEMS part but in the control system aswell. This device can be used for sample transport intransmission electron microscopes and in the recovery
of foreign matter generated in manufacturing
processes. The AFM tweezers will also likely beincorporated in products in the near future. It is myhope that the use of MEMS tweezers in AFM devices
will become commonplace.

In my laboratory, we have been developing devices
for nanotechnology research that combine nanoprobeswith MEMS to produce new functions. My firstopportunity to study probes dates back to my earlyyears working at a company. The company had apolicy of proposing research topics to the junioremployees in their second year so I began researching
field emission displays, which was beginning to attract
attention in those days. Primarily, I was etchingsilicon by a wet etching process to manufacture arraysof silicon electron guns. While silicon electron guns
were normally manufactured by controlling the underetching time with a circular mask, I wondered if theelectron guns could not be produced without underetching. My idea was to combine local oxidation with
KOH etching. By performing anisotropic etching with
KOH on pattern edges to expose the crystal face andsubsequently protecting the face with an oxide film
and repeating this process three times, I could
produce an excellent needle shape with good
uniformity and reproducibility. Moreover, when using
the edges of the pattern, this process is not dependent
on the precision of lithography. While the siliconelectron guns formed through this technique had good
properties, ultimately silicon did not come to be used
for electron guns.

On a different subject, I read the transcript of a
nanotechnology talk given by the well known
physicist Richard Feynman in which he describes
miniaturization achieved by first creating a mechanism
on a scale of one-fourth and subsequently creating amechanism at a scale of one-fourth the firstmechanism, for an overall scale of one-sixteenth.
Through the development of scanning probe
microscopes, we are currently capable of manipulating
atoms and molecules with a probe. However, we mustalso deal with the so-called meso-spaces in whichantagonistic micromechanical forces such as
electromagnetic forces and meniscus forces are quite
complex. For example, it is possible to grip but notrelease some samples with AFM tweezers, and we are
currently laboring over this resolution.

After taking up my new position at the University, I
continued studying probe devices based on thistechnique. Through similar processes, we haveproduced DNA tweezers (currently being studied in a
Japan Science and Technology Agency project on thedevelopment of systems and technology for advanced
measurement and analysis) for stretching and fixing
DNA, a nanoknife for cutting chromosomes, and AFM
tweezers (currently being studied by the Consortium
Research & Development for Regional Revitalization
under METI) for gripping and recovering
nanomaterial. Wet etching is advantageous for
producing nanostructures reliably and at a low cost,with good uniformity over a large surface area.

At this point, we have created micro-sized cutting
mechanisms and handling mechanisms through MEMS
aimed at applications in nano-spaces. While at last we
can see the “bottom” in terms of miniaturizing
mechanisms, I suspect we have a long battle ahead ofus before we can produce nano-mesomechanicalstructures with micro-mechanisms.

I have also focused on self-sensitive AFM probes
using the immittance properties of comb actuators.
This probe uses variations in a resonant frequency
produced when an atomic force is applied to a comb
actuator subjected to self-excited vibrations in acircuit similar to a crystal oscillator. Currently we areable to produce two-dimensional images with thisprobe. In addition to its application as an AFM probe,
this technology can also be used as a touch sensor orforce sensor by applying the same principles totweezers, and is being developed for such applications
as cell tweezers used to grip soft material. Eventually

AFM tweezers
Comb-drive
probe

Integrated analysis system

Cell tweezers
Multi-probe

Nanotechnolog
Nanotechnology
DNA tweezers

Biotechnology
Biotechnolog

Electron gun
Knife probe

Collaboration among industry,
academia, and government6Overseas Trends

MEMS Industry Forum Joint Fact-Finding Mission (USA, Canada)
As part of MEMS Industry Forum Global
Trends Research Mission activities, a fact-finding
mission comprising representatives of MEMSrelated organizations and MEMS member
businesses visited the United States and Canada
from October 9 (Monday) to 13 (Friday), 2006.
The mission visited 9 locations with the aim ofresearching the development of advanced devices
vital for the promotion of MEMS industrialization,
design support software, foundry service, andindustry-academia-government industrialization
support systems in North America – the leader inthese areas - and thereby contributing to theenhancement of MEMS-related industries in Japan.

Canada: Edmonton, Alberta• Micralyne• NINT (National Institute for Nano
Technologies)• University of Alberta

USA: Massachusetts• Analog Devices• Intellisense• MicroCHIPS• MIT : MEMS@MIT• Boston Univ : Fraunhofer Institute
USA CMI

USA: New York• Infotonics Technology Center

Mission Members (alphabetical order, titles omitted)
Junji ADACHIHiroshi FUKUMOTO
Kazuhisa KARAKIAtsushi SATO

(Micromachine Center)(Mitsubishi Electric Corporation)(Olympus Corporation)(Mizuho Information and Research Institute)Itinerary Outline
USA: New York• Infotonics Technology Center : a center with such capacities as industry-academia-government designcollaboration in the MEMS/photonics fields, manufacturing, packaging,testing/evaluation consulting, and foundry.
USA: Massachusetts• Analog Devices : One of the world’s leading MEMS businesses in the field of acceleration sensor development.
• Intellisense : Business that develops MEMS design software. In collaboration with Infotonics of New York, thecompany also conducts software training seminars and consultancy services.
• MicroCHIPS : An MIT-related venture business involved in the development of drug delivery devices. Microcavities are created in devices implanted internally using MEMS technology and drugs aredelivered by periodically dissolving the membrane electrothermally.
• MIT : One of the United States’ 3 major centers for MEMS research and development together with UC Berkley
and Michigan University.
• MEMS@MIT : An MIT-affiliated research center.
• Boston University (BU) : The mission visited the Photonics Center, Fraunhofer USA CMI, which conducts MEMSrelated research.
Canada: Edmonton, Alberta• Micralyne : A MEMS foundry with sales of $14 million (4th highest in theworld) specializing in low-quantity, high added value MEMS.
• NINT (National Institute for Nano Technologies) :Canada’s national nanotechnology research base. The
research facilities were completed in June 2006. The institutewas established with the purpose of promoting theindustrialization of university research results.
• University of Alberta : An institution central to MEMS research in
Canada. The university has a close collaborative
research relationship with Micralyne.

7Members' Profiles

KOA Corporation
1. Endeavors in Ceramic Packages
KOA Corporation has specialized in the manufacturingof electrical resistors for more than sixty years since its
foundation and is a world leader in the types andproduction of electrical resistors through its worldwide
sales network. Utilizing our base technologies in thinfilms, thick films, electroplating, and ceramics andinnovative production activities, our objective is tocontribute to production that respects humanity, reduces
environmental impact, and enriches our lives.
Since 2001 we have been developing andmanufacturing LTCC (Low Temperature Co-fired
Ceramics) multilayer substrates as one of our newest
endeavors, incorporating base technologies developed
through the production of electrical resistors and various
other electronic parts. The LTCC multilayer substrate isformed of a material that supports electronic devices,which continue to be made faster, smaller, lighter, andthinner, with more advanced functions. Moreover, KOA
LTCC substrates not only have the excellent properties
characteristic of ceramic substrates, but also have thecapacity to respond flexibly to special shapes. There isalso expectation that, in addition to electronic devices,
these substrates will be developed as packages for use in
MEMS technology.

General Manager, LTCC Business Center

Takuo Hayasi
3. Features of KOAs LTCC
Through KOA’s own shrinkage control technology andmultilayer technology, LTCC substrates can be produced_ 0.05% the design specifications.
with a high accuracy of +These technologies also make it possible to form thickfilms, thin films, and fine patterns using inkjet technology
and to form resistive elements in surface layers and inner
layers. By adding a green sheet layer with a cutout
portion, cavities, hollow structures, and other complex
shapes can be produced accurately. While LTCCs arewidely used as substrates for small modules, the excellent
properties possessed by LTCC materials suggest thatapplications for these substrates could be expanded
through processes using the latest technologies.

2. LTCC Multilayer Substrates
LTCC is a ceramics technology in which glass material
is added to alumina, enabling the alumina to be fired at a“low temperature” of 900 ; or less and can be used for
simultaneously firing Ag as a conductor. In addition totheir excellent heat resistance and humidity resistance,
ceramic substrates also have excellent frequency
characteristics (low loss) in high frequency circuits.
Employing KOA’s multilayering technique facilitates theformation of wiring patterns in surface layers and inner
layers, making it possible to produce three-dimensional
multilayer wiring at a high density. Since the LTCC
substrates have a thermal expansion coefficient closer tosilicon than do other organic substrates and ceramic
substrates, less stress is produced during mounting, giving
the LTCC substrates broad applications in high-frequency,
multi-chip modules and circuit boards for semiconductor
packages.

Photo 1 Cavity package

Photo 2 One example of a special shape in which(squarecolumns have been formed in a cavity)

4. Endeavors in MEMS Packages
While LTCC substrates have been primarily used inhigh frequency modules, development is currently
underway on other applications for these substrates, suchas in MEMS packages.
We are working to provide high-precision packages
that draw out maximum performance in MEMS devices
developed by our customers, such as ultrafine, high-levelsensors and functional components. By further improving
the LTCC technology for high-precision, high-density
wiring and producing packages having a higher added
value, KOA believes it can contribute to MEMS
development and product commercialization. It is ourhope that customers see the advantages of LTCC andincorporate these substrates in various applications.

MICRONANO No. 58
MICRONANO is published quarterly by Micromachine Center (MMC) to promote the international exchange of
information related to micromachines, R&D and other technical topics, and is circulated free of change. Please send
your comments about MICRONANO to the publisher :Keiichi Aoyagi, Executive Director, Micromachine Center (MMC)
MBR99 Bldg., 6F., 67 Kanda Sakumagashi, Chiyoda-ku, Tokyo 101-0026, Japan
Tel : +81-3-5835-1870, Fax : +81-3-5835-1873
Internet Home Page h t t p : / / w w w . m m c . o r . j p /Date of Issue : February 14, 2006

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