GR101-03W

General Specification on Chemical Substances Ver. 24.0
1. Objective
NTT Innovative Devices Corporation has established the” General Specifications on Chemical Substances”
to clearly specify the requirements and to ensure the control of chemical substances specifications containedin products or used in process concerning the products delivered to us.

2. Application
The general specification shall apply for our procurement of materials*1).
*1) “Materials” hereunder shall correctly mean parts/ raw materials/ half-finished products/ units/ apparatuses /cables/ display material(ink, labels, etc.) that are incorporated in our products and packaging materials directly-contacting with them (trays, plastic bags,etc.), and packaging materials used for shipping of our products (boxes, trays, tapes, cushions, etc.).

3. Requirements
3-1. Specified control of chemicals and materials
No.

Requirements

Contents(1)

Not to use
Banned substances in process# “Banned substances” (used in process) means the substances
prohibited for use in process, assembling, mounting, fabricating,processing or forming.
(Defined in Separate Table 1 of Annex)(2)

Not to contain Bannedsubstances# “Banned substances” (contained) means the substances whichshould not be contained in parts, materials and packaging
materials.
(Defined in Separate Table 2 of Annex)* If it is contained, purchase is not implemented.
*If you note that delivered products contain banned substances,
you should inform to us with documents as soon as possible.
$ In the case of the content less than the limit level, if you know
its value, please disclose the content information.
*If you note mistakes in the content information, you should
inform to us with documents as soon as possible.

(3)

To properly manage
controlled substances# The substance should be controlled, and the information about
the amount of content should be known. (Defined in Separate
the Table 3 of Annex)*Please disclose the content information.
*If you note mistakes in the content information, you should
inform to us with documents as soon as possible.

#: Essential requirement/$: Essential requirement if applicable
3-2. Change management
If there are important changes concerning the material, parts and process, please inform us with documents
about the details of the changes concerning the above Section 3-1.

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GR101-03W

4. Submission of documents
We require suppliers to submit the below documents*2).
No.

Documents

Substances(a)“Non-containing Certification of Banned Substances”“Banned substances”(Form 1-1)(b)“Chemical Substances Survey Sheet” (Form 2-1),or“chemSHERPA*3)”“Banned substances”“Controlled substances”(c)“SVHC Survey Sheet” (Form 2-2)

“Controlled substances”(“SVHC”)(d)

List of Total Constructional Elements. (Form 3)*2) We may require other survey forms to comply with our customer request.
*3) Please submit the latest version of “chemSHERPA” downloaded at the following URL:
https://chemsherpa.net/chemSHERPA/english/

5. Operation of the General Specification-In case of applying this General Specification, this information will be stated in Individual procurement
specification (or purchase order).
-When this General Specification and Individual-procurement-specification conflict with each other, the latter
prevails.
-In case of noticing mistakes such as contents about the submitted reports to us on 4 (a) - (d), you should
correct the reports and re-submit them to us.

6. Special instructions
Even if we ask you in advance whether you can comply with our requirements about the “GeneralSpecification”, there is no commitment from us to place an order to you.

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GR101-03W

General Standard Chemical Substances Management Ver. 24.0 ANNEX
Table 1 Banned substances in production processes
The following substances are banned from being used in production process of the products. These correspondto the ozone depleting substances in IEC 62474 database.
No.

0-1

Substances GroupOzone-depleting substances
defined by Montreal
ProtocolSubstancesChlorofluorocarbons (CFCs)
1,1,1-Trichloroethane
Carbon tetrachloride
HalonsHBFCs
Methyl bromide
Bromochloromethane
HCFCs

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GR101-03W

Table 2 Banned substances
The following substances are banned from being contained in and/or being added to the products that deliveredto us. If they are unintentionally contained beyond threshold levels, purchase is not implemented. This
category includes some materials in IEC 62474 database and/or banned substances specified by NTT (NipponTelegraph and Telephone Corporation).
No.

IEC/NTT*1)

Threshold levels(Remarks)

1-1
1-2
1-3
1-4
1-5
1-6

IECIEC
IEC
IEC, N
IEC, N
IEC, N

1-7

IEC

1-8

IEC

1-9

IEC

1-10

IEC

1-11

IEC, N

1-12

IEC

1-13

IEC

Dibutyltin (DBT) compounds

1-14

IEC

Dioctyltin (DOT) compounds

1-15

IEC, N

Polychlorinated biphenyls (PCBs) and specific substitutes(Ugilec141, Ugilec121, Ugilec21, DBBT)

Intentionally added

1-16

IEC

Polychlorinated terphenyls (PCTs)

50 ppm

1-17

IEC, N

1-18

IEC, N

Substances

Cadmium/Cadmium compounds
Hexavalent chromium
Lead/Lead compounds
Mercury/Mercury compounds
Polybrominated biphenyls (PBBs)
Polybrominated diphenylethers (PBDEs)
Bis(2-ethylhexyl) phthalate (DEHP)(CAS No. 117-81-7)
Benzyl butyl phthalate (BBP)(CAS No. 85-68-7)
Dibutyl phthalate (DBP)(CAS No. 84-74-2)
Diisobutyl phthalate (DIBP)(CAS No. 84-69-5)
Bis(Tributyl tin) oxide (TBTO)(CAS No. 56-35-9)
Tri-substituted organostannic compounds (TBT and TPT,etc.)

Polychlorination naphthalenes (PCNs)(1 or more [ The number of chlorine ] )Short-chain chlorinated paraffins(carbon chain length 10-13)

Threshold levels andexempted applications areindicated in Tables 2a and2b, respectively.
(Substances banned byRoHS directive)

Intentionally added, or1000 ppm
Intentionally added, or1000 ppm
1000 ppm

Intentionally added
Intentionally added, or1000 ppm

1-19

IEC, N

Asbestos(Amosite, Crocidolite, Chrysotile, Actinolite, Anthophyllite,and Tremolite)

1-20

IEC

Azo compounds that produces specific amines (Table 2c) bydecomposition

1-21

IEC, N

Ozone-depleting substances (CFCs, 1,1,1-Trichloroethane,Carbon tetrachloride, Halons, HBFCs, Methyl bromide,Bromochloromethane, HCFCs)

Intentionally added

1-22

IEC

1-23

IEC, NRadioactive substances2-(2H-1,2,3-benzotriazol-2-yl)-4,6-di-tert-butylphenol(CASNo. 3846-71-7)

Intentionally added
Intentionally added, or1000 ppm

Intentionally added
30 ppmCopyright © 2023 NTT Innovative Devices Corporation All Rights Reserved.

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GR101-03W

1-24

IEC, N

Perfluorooctane sulfonate (PFOS/PFOSF)(C8F17SO2X; X=OH, O-M+, halide, amide, and otherderivatives including polymers)

1-25

IEC

Perfluorooctanoic acid (PFOA) and its salts, and PFOArelated substances1-26

IEC

Dimethyl fumarate (CAS No. 624-49-7)

1-27

IEC, N

Hexabromocyclododecane (HBCDD)

1-28

IEC

Phenol, isopropylated phosphate (PIP (3:1))(CAS No. 68937-41-7)

IEC

Perfluorocarboxylic acids with 9 to14 carbon atoms (C9C14 PFCAs) and their salts, and C9-C14 PFCA-relatedsubstances

1-29
1-30
1-31
1-32
1-33
1-34
1-35
1-36

NN
N
NN
N

1-37

N

1-38
1-39
1-40
1-41
1-42
1-43
1-44
1-45
1-46
1-47
1-48

NNNN
N
N
NN
N
NN

1-49

N

1-50
1-51
1-52
1-53
1-541-55
1-56
1-57
1-58
1-59
1-60
1-61

NN
NN
NNNNNNNNRed phosphorus (use in resin only)
Hexachlorobenzene (HCB)
AldrinDieldrinEndrin
DDT
Chlordanes (Heptachlor)
N,N-Ditolyl-p-phenylenediamine, N-Tolyl-N-xylyl -pphenylenediamine, and N,N-Dixylyl -p- phenylenediamine
2,4,6-Tri Tertiary Butyl Phenol
Toxaphene
Mylex
Yellow-phosphorus match
Benzidines
4-Aminodiphenyls
4-Nitrodiphenyls
Bis(chloromethyl)ether
Beta-naphthylamines
Rubber adhesive containing benzene beyond 5wt%
Cyanogen compounds
Organophosphorous compounds (Parathion, Methylparathion, Methyl-demeton, and EPN)
Polychlorinated dibenzofuran (PCDF)
Polychlorinated dibenzo-p-dioxin (PCDD)
Coplanar PCB (Co-PCB)
Kelthane or Dicofol
Hexachlorobuta-1,3-diene
Pentachlorobenzene
Alfa-hexachlorocyclohexane
Beta-hexachlorocyclohexane
Gamma-hexachlorocyclohexane/Lindane
Chlordecone
Endosulfan
Pentachlorophenol, and individual salts and esters

Intentionally added, or1000 ppm
0.025 ppm
The total concentration ofPFOA-related substances:
1 ppm
0.1 ppm
Intentionally added, or1000 ppm
Intentionally added
0.025 ppmThe total concentration ofC9-C14 PFCA-related
substances: 0.26ppm
Intentionally added
Intentionally added(Banned substances
specified by NTT)

*1) IEC: Specific substances in IEC 62474 database, N: Banned substances specified by NTT.

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GR101-03W

Table 2a Substances banned by RoHS directive and threshold levels*2)
Substance nameThreshold level

Cadmium/Cadmium compounds
Hexavalent chromium
Lead/Lead compounds

100 ppm1000 ppm
1000 ppm

Mercury/Mercury compounds
Polybrominated biphenyls(PBBs)Polybrominated diphenylethers(PBDEs)Bis(2-ethylhexyl) phthalate(DEHP)
Benzyl butyl phthalate (BBP)
Dibutyl phthalate (DBP)
Diisobutyl phthalate (DIBP)The sum of theconcentrations of 4
substances in packaging
materials: 100 ppm

300 ppm (for vinyl chloride cables)1000 ppm
1000 ppm
1000 ppm
1000 ppm
1000 ppm
1000 ppm
1000 ppm*2) Concentration should be calculated based on the mass of each part uniformly containing above substances.

Table 2b Exempted applications from RoHS directive
Substance name

Exemption
code

Exempted application

Cadmium/Cadmiumcompounds

Cd-8(b)-I

Cadmium and its compounds in electrical contacts used in: (Expires on thedate decided by EU)- circuit breakers,- thermal sensing controls,- thermal motor protectors (excluding hermetic thermal motor protectors),- AC switches rated at:- 6 A and more at 250 V AC and more, or- 12 A and more at 125 V AC and more,- DC switches rated at 20 A and more at 18 V DC and more, and- switches for use at voltage supply frequency > 200 Hz.
Cadmium in striking optical filter glass types. (Expires on the date decidedby EU)
Cadmium in glazes used for reflectance standards. (Expires on the datedecided by EU)
Lead in glass of fluorescent tubes not exceeding 0.2 % by weight. (Expireson the date decided by EU)
Lead as an alloying element in steel for machining purposes containing up
to 0.35 % lead by weight and in batch hot dip galvanised steel components
containing up to 0.2 % lead by weight. (Expires on the date decided byEU)
Lead as an alloying element in aluminum for machining purposes with alead content up to 0.4 % by weight. (Expires on the date decided by EU)
Copper alloy containing up to 4 % lead by weight. (Expires on the datedecided by EU)
Lead in high melting temperature type solders (i.e. lead-based alloys
containing 85 % by weight or more lead). (Expires on the date decided byEU)
Electrical and electronic components containing lead in a glass or ceramicother than dielectric ceramic in capacitors, e.g. piezoelectronic devices, orin a glass or ceramic matrix compound. (Expires on the date decided byEU)
Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC orCd-13(b)-(II)Lead/Leadcompounds

Cd-13(b)(III)Pb-5(b)Pb-6(a)-I

Pb-6(b)-II
Pb-6(c)Pb-7(a)Pb-7(c)-I

Pb-7(c)-II

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GR101-03W

Pb-13(a)Pb-13(b)-(I)
Pb-13(b)(III)Pb-15(a)Pb-18(b)
Pb-24
Pb-29
Pb-32
Pb-34
Mercury/Mercury
compounds

Hg-1

Hg-2(b)Hg-3

Hg-4(a)-I

Hg-4(b)250 V DC or higher. (Expires on the date decided by EU)
Lead in white glasses used for optical applications. (Expires on the datedecided by EU)
Lead in ion coloured optical filter glass types. (Expires on the date decidedby EU)
Lead in glazes used for reflectance standards. (Expires on the date decidedby EU)
Lead in solders to complete a viable electrical connection between thesemiconductor die and carrier within integrated circuit flip chip packages
where at least one of the following criteria applies: (Expires on the datedecided by EU)- a semiconductor technology node of 90 nm or larger;- a single die of 300 mm2 or larger in any semiconductor technology node;- stacked die packages with die of 300 mm2 or larger, or silicon interposersof 300 mm2 or larger.
Lead as activator in the fluorescent powder (1 % lead by weight or less) ofdischarge lamps when used as sun tanning lamps containing phosphorssuch as BSP (BaSi2O5:Pb). (Expires on the date decided by EU)
Lead in solders for the soldering to machined through hole discoidal andplanar array ceramic multilayer capacitors. (Expires on the date decided byEU)
Lead bound in crystal glass as defined in Annex I (Categories 1, 2, 3 and4) of Council Directive 69/493/EEC. (Expires on the date decided by EU)
Lead oxide in seal frit used for making window assemblies for Argon andKrypton laser tubes. (Expires on the date decided by EU)
Lead in cermet-based trimmer potentiometer elements. (Expires on thedate decided by EU)
Mercury in single capped (compact) fluorescent lamps not exceeding (perburner):(f)-I For lamps designed to emit mainly light in the ultraviolet spectrum: 5mg. (Expires on 24 February 2027)(f)-II For special purposes: 5 mg. (Expires on 24 February 2025)
Mercury in other fluorescent lamps not exceeding (per lamp):(3) Non-linear tri-band phosphor lamps with tube diameter > 17 mm (e.g.
T9): 10 mg. (Expires on 24 February 2025)(4)-I Lamps for other general lighting and special purposes (e.g. inductionlamps): 15 mg. (Expires on 24 February 2025)(4)-II Lamps emitting mainly light in the ultraviolet spectrum: 15 mg.
(Expires on 24 February 2027)(4)-III Emergency lamps: 15 mg. (Expires on 24 February 2027)
Mercury in cold cathode fluorescent lamps and external electrodefluorescent lamps (CCFL and EEFL) for special purposes used in EEE
placed on the market before 24 February 2022not exceeding (per lamp):(Expires on 24 February 2025)(a) Short length (< 500 mm): 3.5 mg.
(b) Medium length (> 500 mm and <1500 mm): 5 mg.
(c) Long length (>1500 mm): 13 mg.
Mercury in low pressure non-phosphor coated discharge lamps, where theapplication requires the main range of the lamp- spectral output to be in
the ultraviolet spectrum: up to 15 mg mercury may be used per lamp.
(Expires on 24 February 2027)
Mercury in High Pressure Sodium (vapour) lamps for general lighting
purposes not exceeding (per burner) in lamps with improved colour
rendering index Ra > 80: P ≤ 105 W: 16 mg may be used per burner.
(Expires on 24 February 2027)

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Hg-4(c)Hg-4(e)Hg-4(f)Mercury in other High Pressure Sodium (vapour) lamps for generallighting purposes not exceeding (per burner): (Expires on 24 February2027)(I) P < 155 W: 20 mg.
(II) 155 W < P < 405 W: 25 mg.
(III) P > 405 W: 25 mg.
Mercury in metal halide lamps (MH). (Expires on 24 February 2027)(I) Mercury in other discharge lamps for special purposes not specificallymentioned in the Annex of 2011/65/EU. (Expires on 24 February 2025)(II) Mercury in high pressure mercury vapour lamps used in projectors
where an output ≥ 2000 lumen ANSI is required. (Expires on 24 February
2027)(III) Mercury in high pressure sodium vapour lamps used for horticulture
lighting. (Expires on 24 February 2027)(IV) Mercury in lamps emitting light in the ultraviolet spectrum. (Expireson 24 February 2027)

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GR101-03W

Table 2c Specific amines
Substance Chemical

Biphenyl-4-ylamine
Benzidine
4-chloro-o-toluidine
2-naphthylamineo-aminoazotoluene
5-nitro-o-toluidine
4-chloroaniline
4-methoxy-m-phenylenediamine
4,4'-methylenedianiline
3,3'-dichlorobenzidine
3,3'-dimethoxybenzidine
3,3'-dimethylbenzidine
4,4'-methylenedi-o-toluidine
6-methoxy-m-toluidine
4,4'-methylene-bis(2-chloroaniline)
4,4'-oxydianiline
4,4'-thiodianiline
o-toluidine
4-methyl-m-phenylenediamine
2,4,5-trimethylaniline
o-anisidine
4-aminoazobenzene

CAS No.

92-67-1
92-87-5
95-69-2
91-59-8
97-56-3
99-55-8
106-47-8
615-05-4
101-77-9
91-94-1
119-90-4
119-93-7
838-88-0
120-71-8
101-14-4
101-80-4
139-65-1
95-53-4
95-80-7
137-17-7
90-04-0
60-09-3

Chemical FormulaC12H11N
C12H12N2
C7H8ClN
C10H9NC14H15N3C7H8N2O2
C6H6ClN
C7H10N2O
C13H14N2
C12H10Cl2N2
C14H16N2O2
C14H16N2C15H18N2
C8H11NO
C13H12Cl2N2
C12H12N2O
C12H12N2S
C7H9N
C7H10N2
C9H13NC7H9NOC12H11N3

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Table 3 Controlled substances
Substances with control mean that the content of the substances in the products should be confirmed andcontrolled appropriately. “Contained” means situations in which the substances are intentionally added to,blended with, or adheres to any parts of the supplies, or in which they are unintentionally contained beyond thethreshold levels. This category corresponds to IEC 62474 database materials other than banned substances
shown in Table 2 and substances of very high concern (SVHC) in REACH regulation. The concentration
should be calculated for each part of products.
No.

IEC*3)

2-1

IEC

2-2
2-3

IEC

2-4

IEC

2-5
2-6
2-7
2-8

IEC
IEC
IEC
IEC

2-9

IEC

2-10

IEC

2-11

IEC

2-12

IEC

2-13

IEC

2-14

IEC

2-15
2-16
2-17
2-18
2-19
2-20
To becont.

Threshold levels(Remarks)

Substances

Beryllium Oxide (BeO)(CAS No. 1304-56-9)
Nickel (external application only)
Polyvinyl Chloride (PVC) and PVC copolymers
Brominated flame retardants(except PBB, PBDE, and HBCDD)
Chlorinated flame retardants
Perchlorates
Fluorinated greenhouse gases (PFC, SF6, HFC)
Formaldehyde (CAS No. 50-00-0)
Diisononyl phthalate (DINP)(CAS No. 28553-12-0, CAS No. 68515-48-0)
Diisononyl phthalate (DIDP)(CAS No. 26761-40-0, CAS No. 68515-49-1)
Di-n-octyl phthalate (DNOP)(CAS No. 117-84-0)
Di-n-hexyl phthalate (DnHP)(CAS No. 84-75-3)
Polycyclic-aromatic hydrocarbons (PAH)
Benzo[a]pyrene (CAS No. 50-32-8)
Benzo[e]pyrene (CAS No. 192-97-2)
Benzo[a]anthracene (CAS No. 56-55-3)
Chrysen (CAS No. 218-01-9)
Benzo[b]fluoranthene (CAS No. 205-99-2)
Benzo[j]fluoranthene (CAS No. 205-82-3)
Benzo[k]fluoranthene (CAS No. 207-08-9)
Dibenzo[a,h]anthracene (CAS No. 53-70-3)
4,4'-isopropylidenediphenol (CAS No. 80-05-7)

1000 ppm
Intentionally added1000 ppm
1000 ppm
1000 ppm
0.006 ppm
Intentionally added
Intentionally added
Intentionally added, or1000 ppm
Intentionally added, or1000 ppm
Intentionally added, or1000 ppm
Intentionally added, or1000 ppm

1 ppm

Pentachlorothiophenol (CAS No. 133-49-3)
Antimony/Antimony compounds
Arsenic/Arsenic compounds
Other Beryllium/Beryllium compounds
Selenium/Selenium compounds

Intentionally added, or1000 ppm
1%1000 ppm
1000 ppm
1000 ppm
1000 ppm

SVHC in REACH regulation*4)1000 ppm*3) IEC: Specific substances in IEC 62474 database.
*4) When the European Chemical Agency (ECHA) has added some substances to the candidate list of Substances of VeryHigh Concern (SVHC), the substances are included in the list of “Controlled substances”.

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