GR101-02W

General Standard on Chemical Substances
Management(For suppliers)

Version 24.0

NTT Innovative Devices Corporation
Procurement Management Division
Quality Assurance DivisionGR101-02W

Index
1. Introduction..................................................................................................................................
2. Scope............................................................................................................................................
3. Definition of terms.......................................................................................................................
4. Requirements...............................................................................................................................
4.1 Specified control of chemical substances..................................................................................
4.2 Change management..................................................................................................................
5. Submission of documents............................................................................................................
6. Operation......................................................................................................................................
7. Establishment and revision history...............................................................................................

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1
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2
2
3
3
3

Ref. Main revised terms at 24th Ed.....................................................................................................

4

General Standard on Chemical Substances Management Ver.24.0 ANNEX......................................
Table 1 Banned substances in the production process.........................................................................
Table 2 Banned substances..................................................................................................................
Table 2a Substances banned by RoHS directive and their threshold levels........................................
Table 2b Exempted applications from RoHS directive.......................................................................
Table 2c Specific amines.....................................................................................................................
Table 3 Controlled Substances............................................................................................................

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GR101-02W

1. Introduction
NTT Innovative Devices Corporation intends to make clear our management criteria and strengthen
controls on procurement. This document presents our voluntary standard for the chemical substances;(1) Chemical substances contained in parts and materials incorporated into our products and theirpackaging materials, and packaging materials used for shipping of our products*1) and(2) Chemical substances used in production processes of our products.
We will not purchase any more, in principle, such parts, materials, packaging materials that contain"Banned substance" or use them in the production processes. When our requests for green purchasing
inquiry and information are not met, we may have to discontinue our business relationships. When theserequirements are met, we give priority to procurement of the products with reduced environmental
impact.
We would like to sincerely ask our suppliers to cooperate with our environmental conservation activities
on the basis of understanding the purport of our policy and this standard.
If you have questions or advisement, please apply to our contact.
*1) “Parts and materials, and packaging materials” hereunder shall correctly mean part/ raw materials/ half-finishedproducts/ units/ apparatus/ cable/ display material (ink, labels, etc.) that are incorporated in our products andpackaging materials directly-contacting with them (trays, plastic bags, etc.), and packaging materials used forshipping of our products (boxes, trays, tapes, cushions, etc.).

2. Scope
This standard shall be applied to parts and materials incorporated into our products and their packaging
materials, and packaging materials used for the shipping of our products.

3. Definition of terms
1) Banned substances in the production process_Mean the substances whose use should be banned in the production process of the supplies. These
correspond to the ozone depleting substances specified by IEC 62474 database*2). (Separate Table 1of Annex)2) Banned substances_Mean the substances that should not be intentionally contained in and/or added as contents of additive
to the supplies. If they are unintentionally contained beyond our designated levels, purchase is not
implemented. This category includes some materials in IEC 62474 database and/or banned substances
specified by NTT (Nippon Telegraph and Telephone Corporation). (Separate Table 2 of Annex)3) Controlled substances_Mean the substances whose contents, containing areas, and aims should be controlled. These
substances correspond to IEC 62474 database materials other than above banned substances andsubstances of very high concern (SVHC) in REACH regulation. (Separate Table 3 of Annex)4) Specific substances_Mean the substances contained in parts, materials and packaging materials or used in their production
processes, and which have a possibility of giving an environmental impact. Above (1)-(3) collectively
mean “Specific substances”.

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GR101-02W

5) Additional survey substances_Mean the substances specified by our customer, and whose contents, containing areas, and aims should
be controlled.
6) Content_Means the substances intentionally included as materials (components) or additives, or unintentionally
included as impurity and whose amount of content exceeds its threshold level.
7) Content information_Means the substance names, CAS number, amount of content, composition, main purpose, parts nameof specified chemical substances, and their masses.
*2) The IEC 62474 database is available at: http://std.iec.ch/iec62474.

4. Requirements
4-1. Specified control of chemicals and materials
No.

Requirements

Contents(1)

Not to use
Banned substances in process# “Banned substances” (used in process) means the substances
prohibited for use in process, assembling, mounting, fabricating,processing or forming.
(Defined in Separate Table 1 of Annex)(2)

Not to contain Banned
substances# “Banned substances” (contained) means the substances whichshould not be contained in parts, materials and packaging
materials.
(Defined in Separate Table 2 of Annex)*If it is contained, purchase is not implemented.
*If you note that delivered products contain banned substances,
you should inform to us with documents as soon as possible.
$ In the case of the content less than the limit level, if you know
its value, please disclose the content information.
*If you note mistakes in the content information, you should
inform to us with documents as soon as possible.

(3)

To properly manage thecontrolled substances# The substance should be controlled, and the information about
the amount of content should be known. (Defined in Separate
Table 3 of Annex)*Please disclose the content information.
*If you note mistakes in the content information, you should
inform to us with documents as soon as possible.

#: Essential requirement/$: Essential requirement if applicable

4-2. Change management
If there are important changes concerning the material, parts and process, please inform us with
documents about the details of the changes concerning the above Section 4-1.

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GR101-02W

5. Submission of documents
We require suppliers to submit the below documents*3).
No.

Documents

Substances(a)“Non-containing Certification of Banned Substances” (Form 1“Banned substances”
1)(b)“Chemical Substances Survey Sheet” (Form 2-1),or“chemSHERPA*4)”“Banned substances”“Controlled substances”(“Additional survey substances”)(c)“SVHC Survey Sheet” (Form 2-2)

“Controlled substances”(“SVHC”)(d)

List of Total Constructional Elements. (Form 3)*3) We may require other survey forms to comply with our customer request.
*4) Please submit the latest version of “chemSHERPA” downloaded at the following URL:
https://chemsherpa.net/chemSHERPA/english/.

6. Operation
Each supplier is requested to follow the “General Standard on Chemical Substances Management” productby product for the purchase specifications or purchase order.

7. Establishment and revision history
1st edition: Established on Oct.21, 2003 / Enforced on Nov.10, 2003
2nd edition: Established on Mar.22, 2005 / Enforced on Apr.1, 2005
3rd edition: Established on Jan.20, 2006 / Enforced on Jan.23, 2006
4th edition: Established on May 22, 2006 / Enforced on Jun. 1, 2006
5th edition: Established on May 18, 2007 / Enforced on Jun. 1, 2007
6th edition: Established on Mar. 27, 2008 / Enforced on Apr. 1, 2008
7th edition: Established on Apr. 21, 2008 / Enforced on May 1, 2008
8th edition: Established on Nov. 30, 2009 / Enforced on Dec. 1, 2009
9th edition: Established on May 28, 2010 / Enforced on Jun. 1, 2010
10th edition: Established on Nov. 26, 2010 / Enforced on Dec. 1, 2010
11th edition: Established on May 11, 2011 / Enforced on Jun. 1, 2011
12th edition: Established on Sep. 21, 2012 / Enforced on Oct. 1, 2012
13th edition: Established on Sep. 13, 2013 / Enforced on Oct. 1, 2013
14th edition: Established on Sep. 12, 2014 / Enforced on Oct. 1, 2014
15th edition: Established on Sep. 11, 2015 / Enforced on Oct. 1, 2015
16th edition: Established on Sep. 16, 2016 / Enforced on Oct. 1, 2016
17th edition: Established on Sep. 13, 2017 / Enforced on Oct. 1, 201718th edition: Established on Jun. 15, 2018 / Enforced on Jul. 1, 2018
19th edition: Established on Mar. 20, 2019 / Enforced on Apr. 1, 2019
20th edition: Established on Oct. 18, 2019 / Enforced on Nov. 1, 2019
21st edition: Established on Mar. 19, 2021 / Enforced on Apr. 1, 2021
22nd edition: Established on Sep. 15, 2021 / Enforced on Oct. 1, 2021
23rd edition: Established on Sep. 16, 2022 / Enforced on Oct. 1, 2022
24th edition: Established on Sep. 12, 2023 / Enforced on Sep. 12, 2023
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GR101-02W

Ref. Main revised terms at 24th Ed
Name changed to NTT Innovative Devices Corporation

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GR101-02W

General Standard Chemical Substances Management Ver. 24.0 ANNEX
Table 1 Banned substances in production processes
The following substances are banned from being used in production process of the products. These correspondto the ozone depleting substances in IEC 62474 database.
No.

Substances Group

Substances

Chlorofluorocarbons (CFCs)
1,1,1-Trichloroethane
0-1

Ozone-depleting substances
defined by Montreal Protocol

Carbon tetrachloride
Halons
HBFCs
Methyl bromide
Bromochloromethane
HCFCs

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GR101-02W

Table 2 Banned substances
The following substances are banned from being contained in and/or being added to the products that delivered
to us. If they are unintentionally contained beyond threshold levels, purchase is not implemented. This
category includes some materials in IEC 62474 database and/or banned substances specified by NTT (Nippon
Telegraph and Telephone Corporation).
No.

IEC/
NTT*1)

Threshold levels(Remarks)

1-1
1-2
1-3
1-4
1-5
1-6

IEC
IEC
IEC
IEC, N
IEC, N
IEC, N

1-7

IEC

1-8

IEC

1-9

IEC

1-10

IEC

1-11

IEC, N

1-12

IEC

1-13

IEC

Dibutyltin (DBT) compounds

1-14

IEC

Dioctyltin (DOT) compounds

1-15

IEC, N

Polychlorinated biphenyls (PCBs) and specific substitutes(Ugilec141, Ugilec121, Ugilec21, DBBT)

Intentionally added

1-16

IEC

Polychlorinated terphenyls (PCTs)

50 ppm

1-17

IEC, N

1-18

IEC, N

1-19

IEC, N

Asbestos(Amosite, Crocidolite, Chrysotile, Actinolite, Anthophyllite,
and Tremolite)

1-20

IEC

Azo compounds that produces specific amines (Table 2c) bydecomposition

1-21

IEC, N

Ozone-depleting substances (CFCs, 1,1,1-Trichloroethane,
Carbon tetrachloride, Halons, HBFCs, Methyl bromide,
Bromochloromethane, HCFCs)

Intentionally added

1-22

IEC

Radioactive substances

Intentionally added

Substances

Cadmium/Cadmium compounds
Hexavalent chromium
Lead/Lead compounds
Mercury/Mercury compounds
Polybrominated biphenyls (PBBs)
Polybrominated diphenylethers (PBDEs)
Bis(2-ethylhexyl) phthalate (DEHP)(CAS No. 117-81-7)
Benzyl butyl phthalate (BBP)(CAS No. 85-68-7)
Dibutyl phthalate (DBP)(CAS No. 84-74-2)
Diisobutyl phthalate (DIBP)(CAS No. 84-69-5)
Bis(Tributyl tin) oxide (TBTO)(CAS No. 56-35-9)
Tri-substituted organostannic compounds (TBT and TPT,etc.)

Polychlorination naphthalenes (PCNs)(1 or more [ The number of chlorine ] )Short-chain chlorinated paraffins(carbon chain length 10-13)

Threshold levels andexempted applications areindicated in Tables 2a and2b, respectively.
(Substances banned by
RoHS directive)

Intentionally added, or1000 ppm
Intentionally added, or1000 ppm
1000 ppm

Intentionally added
Intentionally added, or1000 ppm
Intentionally added
30 ppm6
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GR101-02W

1-23

IEC, N

1-24

IEC, N

2-(2H-1,2,3-benzotriazol-2-yl)-4,6-di-tert-butylphenol(CASNo. 3846-71-7)
Perfluorooctane sulfonate (PFOS/PFOSF)(C8F17SO2X; X=OH, O-M+, halide, amide, and otherderivatives including polymers)

1-25

IEC

Perfluorooctanoic acid (PFOA) and its salts, and PFOArelated substances

1-26

IEC

Dimethyl fumarate (CAS No. 624-49-7)

1-27

IEC, N

Hexabromocyclododecane (HBCDD)

1-28

IEC

Phenol, isopropylated phosphate (PIP (3:1))(CAS No. 68937-41-7)

1-29

IEC

Perfluorocarboxylic acids with 9 to14 carbon atoms (C9-C14
PFCAs) and their salts, and C9-C14 PFCA-related
substances

1-30
1-31
1-32
1-33
1-34
1-35
1-36

N
N
N
N
N
N

1-37

N

1-38
1-39
1-40
1-41
1-42
1-43
1-44
1-45
1-46
1-47
1-48

N
N
N
N
N
N
N
N
N
N
N

1-49

N

1-50
1-51
1-52
1-53
1-54
1-55
1-56
1-57
1-58
1-59
1-60
1-61

N
N
N
N
N
N
N
N
N
N
N
N

Red phosphorus (use in resin only)
Hexachlorobenzene (HCB)
AldrinDieldrin
EndrinDDTChlordanes (Heptachlor)
N,N-Ditolyl-p-phenylenediamine, N-Tolyl-N-xylyl -pphenylenediamine, and N,N-Dixylyl -p- phenylenediamine
2,4,6-Tri Tertiary Butyl Phenol
Toxaphene
Mylex
Yellow-phosphorus match
Benzidines
4-Aminodiphenyls
4-Nitrodiphenyls
Bis(chloromethyl)ether
Beta-naphthylamines
Rubber adhesive containing benzene beyond 5wt%
Cyanogen compounds
Organophosphorous compounds (Parathion, Methylparathion, Methyl-demeton, and EPN)
Polychlorinated dibenzofuran (PCDF)
Polychlorinated dibenzo-p-dioxin (PCDD)
Coplanar PCB (Co-PCB)
Kelthane or Dicofol
Hexachlorobuta-1,3-diene
Pentachlorobenzene
Alfa-hexachlorocyclohexane
Beta-hexachlorocyclohexane
Gamma-hexachlorocyclohexane/Lindane
Chlordecone
Endosulfan
Pentachlorophenol, and individual salts and esters

Intentionally added, or1000 ppm
Intentionally added, or1000 ppm
0.025 ppm
The total concentration of
PFOA-related substances:
1 ppm
0.1 ppm
Intentionally added, or1000 ppm
Intentionally added
0.025 ppm
The total concentration of
C9-C14 PFCA-related
substances: 0.26ppm
Intentionally added
Intentionally added(Banned substances
specified by NTT)

*1) IEC: Specific substances in IEC 62474 database, N: Banned substances specified by NTT.

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GR101-02W

Table 2a Substances banned by RoHS directive and threshold levels*2)
Substance nameThreshold level

Cadmium/Cadmium compounds
Hexavalent chromium
Lead/Lead compounds

100 ppm1000 ppm
1000 ppm

Mercury/Mercury compounds
Polybrominated biphenyls (PBBs)
Polybrominated diphenylethers(PBDEs)Bis(2-ethylhexyl) phthalate(DEHP)
Benzyl butyl phthalate (BBP)
Dibutyl phthalate (DBP)
Diisobutyl phthalate (DIBP)The sum of theconcentrations of 4
substances in packaging
materials: 100 ppm

300 ppm (for vinyl chloride cables)1000 ppm
1000 ppm
1000 ppm
1000 ppm
1000 ppm
1000 ppm
1000 ppm*2) Concentration should be calculated based on the mass of each part uniformly containing above substances.

Table 2b Exempted applications from RoHS directive
Substance name

Exemption
code

Exempted application

Cadmium/
Cadmiumcompounds

Cd-8(b)-I

Cadmium and its compounds in electrical contacts used in: (Expires on
the date decided by EU)- circuit breakers,- thermal sensing controls,- thermal motor protectors (excluding hermetic thermal motor
protectors),- AC switches rated at:- 6 A and more at 250 V AC and more, or- 12 A and more at 125 V AC and more,- DC switches rated at 20 A and more at 18 V DC and more, and- switches for use at voltage supply frequency > 200 Hz.
Cadmium in striking optical filter glass types. (Expires on the datedecided by EU)
Cadmium in glazes used for reflectance standards. (Expires on the datedecided by EU)
Lead in glass of fluorescent tubes not exceeding 0.2 % by weight.
(Expires on the date decided by EU)
Lead as an alloying element in steel for machining purposes containing
up to 0.35 % lead by weight and in batch hot dip galvanised steel
components containing up to 0.2 % lead by weight. (Expires on the datedecided by EU)
Lead as an alloying element in aluminum for machining purposes with alead content up to 0.4 % by weight. (Expires on the date decided by EU)
Copper alloy containing up to 4 % lead by weight. (Expires on the datedecided by EU)
Lead in high melting temperature type solders (i.e. lead-based alloys
containing 85 % by weight or more lead). (Expires on the date decided by
EU)Electrical and electronic components containing lead in a glass or
ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic
devices, or in a glass or ceramic matrix compound. (Expires on the date

Cd-13(b)-(II)Lead/Leadcompounds

Cd-13(b)(III)Pb-5(b)Pb-6(a)-I

Pb-6(b)-II
Pb-6(c)Pb-7(a)Pb-7(c)-I

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GR101-02W

Pb-7(c)-II
Pb-13(a)Pb-13(b)-(I)
Pb-13(b)-(III)Pb-15(a)Pb-18(b)
Pb-24
Pb-29
Pb-32
Pb-34
Mercury/
Mercury
compounds

Hg-1

Hg-2(b)Hg-3

Hg-4(a)-I

Hg-4(b)decided by EU)
Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC
or 250 V DC or higher. (Expires on the date decided by EU)
Lead in white glasses used for optical applications. (Expires on the datedecided by EU)
Lead in ion coloured optical filter glass types. (Expires on the datedecided by EU)
Lead in glazes used for reflectance standards. (Expires on the datedecided by EU)
Lead in solders to complete a viable electrical connection between thesemiconductor die and carrier within integrated circuit flip chip packages
where at least one of the following criteria applies: (Expires on the datedecided by EU)- a semiconductor technology node of 90 nm or larger;- a single die of 300 mm2 or larger in any semiconductor technology
node;- stacked die packages with die of 300 mm2 or larger, or siliconinterposers of 300 mm2 or larger.
Lead as activator in the fluorescent powder (1 % lead by weight or less)of discharge lamps when used as sun tanning lamps containing phosphorssuch as BSP (BaSi2O5:Pb). (Expires on the date decided by EU)
Lead in solders for the soldering to machined through hole discoidal andplanar array ceramic multilayer capacitors. (Expires on the date decided
by EU)
Lead bound in crystal glass as defined in Annex I (Categories 1, 2, 3 and
4) of Council Directive 69/493/EEC. (Expires on the date decided by EU)
Lead oxide in seal frit used for making window assemblies for Argon andKrypton laser tubes. (Expires on the date decided by EU)
Lead in cermet-based trimmer potentiometer elements. (Expires on thedate decided by EU)
Mercury in single capped (compact) fluorescent lamps not exceeding (perburner):(f)-I For lamps designed to emit mainly light in the ultraviolet spectrum:
5 mg. (Expires on 24 February 2027)(f)-II For special purposes: 5 mg. (Expires on 24 February 2025)
Mercury in other fluorescent lamps not exceeding (per lamp):(3) Non-linear tri-band phosphor lamps with tube diameter > 17 mm (e.g.
T9): 10 mg. (Expires on 24 February 2025)(4)-I Lamps for other general lighting and special purposes (e.g.
induction lamps): 15 mg. (Expires on 24 February 2025)(4)-II Lamps emitting mainly light in the ultraviolet spectrum: 15 mg.
(Expires on 24 February 2027)(4)-III Emergency lamps: 15 mg. (Expires on 24 February 2027)
Mercury in cold cathode fluorescent lamps and external electrodefluorescent lamps (CCFL and EEFL) for special purposes used in EEE
placed on the market before 24 February 2022not exceeding (per lamp):(a) Short length (< 500 mm): 3.5 mg. (Expires on 24 February 2025)(b) Medium length (> 500 mm and <1500 mm): 5 mg. (Expires on 24
February 2025)(c) Long length (>1500 mm): 13 mg. (Expires on 24 February 2025)
Mercury in low pressure non-phosphor coated discharge lamps, where
the application requires the main range of the lamp- spectral output to bein the ultraviolet spectrum: up to 15 mg mercury may be used per lamp.
(Expires on 24 February 2027)
Mercury in High Pressure Sodium (vapour) lamps for general lighting

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GR101-02W

Hg-4(c)Hg-4(e)Hg-4(f)purposes not exceeding (per burner) in lamps with improved colour
rendering index Ra > 80: P ≤ 105 W: 16 mg may be used per burner.
(Expires on 24 February 2027)
Mercury in other High Pressure Sodium (vapour) lamps for generallighting purposes not exceeding (per burner): (Expires on 24 February
2027)(I) P < 155 W: 20 mg.
(II) 155 W < P < 405 W: 25 mg.
(III) P > 405 W: 25 mg.
Mercury in metal halide lamps (MH). (Expires on 24 February 2027)(I) Mercury in other discharge lamps for special purposes not specificallymentioned in the Annex of 2011/65/EU. (Expires on 24 February 2025)(II) Mercury in high pressure mercury vapour lamps used in projectors
where an output ≥ 2000 lumen ANSI is required. (Expires on 24 February
2027)(III) Mercury in high pressure sodium vapour lamps used for horticulture
lighting. (Expires on 24 February 2027)(IV) Mercury in lamps emitting light in the ultraviolet spectrum. (Expires
on 24 February 2027)

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GR101-02W

Table 2c Specific amines
Substance Chemical

Biphenyl-4-ylamine
Benzidine
4-chloro-o-toluidine
2-naphthylamineo-aminoazotoluene
5-nitro-o-toluidine
4-chloroaniline
4-methoxy-m-phenylenediamine
4,4'-methylenedianiline
3,3'-dichlorobenzidine
3,3'-dimethoxybenzidine
3,3'-dimethylbenzidine
4,4'-methylenedi-o-toluidine
6-methoxy-m-toluidine
4,4'-methylene-bis(2-chloroaniline)
4,4'-oxydianiline
4,4'-thiodianiline
o-toluidine
4-methyl-m-phenylenediamine
2,4,5-trimethylaniline
o-anisidine
4-aminoazobenzene

CAS No.

92-67-1
92-87-5
95-69-2
91-59-8
97-56-3
99-55-8
106-47-8
615-05-4
101-77-9
91-94-1
119-90-4
119-93-7
838-88-0
120-71-8
101-14-4
101-80-4
139-65-1
95-53-4
95-80-7
137-17-7
90-04-0
60-09-3

Chemical FormulaC12H11N
C12H12N2
C7H8ClN
C10H9NC14H15N3C7H8N2O2
C6H6ClN
C7H10N2O
C13H14N2
C12H10Cl2N2
C14H16N2O2
C14H16N2
C15H18N2
C8H11NO
C13H12Cl2N2
C12H12N2O
C12H12N2S
C7H9N
C7H10N2
C9H13NC7H9NOC12H11N3

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Table 3 Controlled substances
Substances with control mean that the content of the substances in the products should be confirmed andcontrolled appropriately. “Contained” means situations in which the substances are intentionally added to,blended with, or adheres to any parts of the supplies, or in which they are unintentionally contained beyond thethreshold levels. This category corresponds to IEC 62474 database materials other than banned substances
shown in Table 2 and substances of very high concern (SVHC) in REACH regulation. The concentration
should be calculated for each part of products.
No.

IEC*3)

2-1

IEC

2-2
2-3

IEC

2-4

IEC

2-5
2-6
2-7
2-8

IEC
IEC
IEC
IEC

2-9

IEC

2-10

IEC

2-11

IEC

2-12

IEC

2-13

IEC

2-14

IEC

2-15
2-16
2-17
2-18
2-19
2-20
To be
cont.

Threshold levels(Remarks)

Substances

Beryllium Oxide (BeO)(CAS No. 1304-56-9)
Nickel (external application only)
Polyvinyl Chloride (PVC) and PVC copolymers
Brominated flame retardants(except PBB, PBDE, and HBCDD)
Chlorinated flame retardants
Perchlorates
Fluorinated greenhouse gases (PFC, SF6, HFC)
Formaldehyde (CAS No. 50-00-0)
Diisononyl phthalate (DINP)(CAS No. 28553-12-0, CAS No. 68515-48-0)
Diisononyl phthalate (DIDP)(CAS No. 26761-40-0, CAS No. 68515-49-1)
Di-n-octyl phthalate (DNOP)(CAS No. 117-84-0)
Di-n-hexyl phthalate (DnHP)(CAS No. 84-75-3)
Polycyclic-aromatic hydrocarbons (PAH)
Benzo[a]pyrene (CAS No. 50-32-8)
Benzo[e]pyrene (CAS No. 192-97-2)
Benzo[a]anthracene (CAS No. 56-55-3)
Chrysen (CAS No. 218-01-9)
Benzo[b]fluoranthene (CAS No. 205-99-2)
Benzo[j]fluoranthene (CAS No. 205-82-3)
Benzo[k]fluoranthene (CAS No. 207-08-9)
Dibenzo[a,h]anthracene (CAS No. 53-70-3)
4,4'-isopropylidenediphenol (CAS No. 80-05-7)

1000 ppm
Intentionally added1000 ppm
1000 ppm
1000 ppm
0.006 ppm
Intentionally added
Intentionally added
Intentionally added, or1000 ppm
Intentionally added, or1000 ppm
Intentionally added, or1000 ppm
Intentionally added, or1000 ppm

1 ppm

Pentachlorothiophenol (CAS No. 133-49-3)
Antimony/Antimony compounds
Arsenic/Arsenic compounds
Other Beryllium/Beryllium compounds
Selenium/Selenium compounds

Intentionally added, or1000 ppm
1%1000 ppm
1000 ppm
1000 ppm
1000 ppm

SVHC in REACH regulation*4)1000 ppm*3) IEC: Specific substances in IEC 62474 database.
*4) When the European Chemical Agency (ECHA) has added some substances to the candidate list of Substances ofVery High Concern (SVHC), the substances are included in the list of “Controlled substances”.

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