First Announcement

ICRP-11 / GEC 2022
11th International Conference
on Reactive Plasmas /2022 Gaseous Electronics Conference /40th Symposiumon Plasma Processing (SPP-40) /35th Symposium on Plasma Sciencefor Materials (SPSM35)

October 3-7, 2022
Sendai International Center
Sendai, Japan

Organized byInternational Organizing Committee of ICRP-11
GEC Executive Committee
Sponsored byAmerican Physical Society
Co-sponsored by
The Japan Society of Applied Physics
ICRP-11 Supported by:

Division of Plasma Electronics, The Japan Societyof Applied Physics
https://www.ecei.tohoku.ac.jp/plasma/ICRP-11/

General Information

Conference Topics

The International Conference on Reactive Plasmas (ICRP)
has taken place by the initiative of the Division of Plasma
Electronics, the Japan Society of Applied Physics since1991. The 1st ICRP was held in Nagoya, the 2nd inYokohama (1994), the 3rd in Nara (1997), and the mostrecent conference (10th ICRP) in Sapporo (2019). Some
former ICRPs were held as international joint conferences:the 4th ICRP was with the Gaseous Electronics Conference(GEC) at Maui in 1998, the 5th was with ESCAMPIG atGrenoble (2002), the 7th was with GEC at Paris in 2010,
9th was with GEC at Honolulu in 2015, and 10th was withInternational Conference on Phenomena in Ionized Gases(ICPIG) at Sapporo in 2019. The Symposium on Plasma
Processing (SPP) is a domestic annual Japanese meetingthat has been held by the Division of Plasma Electronics
since 1984. The joint ICRP and SPP conference aims togather researchers and engineers, involved in various
aspects of reactive plasmas and their applications. The joint
conference also aims to facilitate the exchange ofinformation and ideas among them within an internationalframework. The subjects covered in this conference are theentire field of reactive plasmas and their applications tovarious materials processing such as surface modification,etching and deposition with emphasis on basic phenomena,technologies, and the underlying basic physics andchemistry. Furthermore, the subjects have been extended tobio- and/or medical application of plasmas. This conference
particularly encourages papers dealing with basic propertiesof the plasma itself, its generation and control, fundamental
processes in the plasma, and plasma-solid/liquidinteractions. Papers dealing with specific results ofprocessing should place emphasis on the related plasma
characteristics in obtaining the results. The 11th ICRP willtake place in October 3-7, 2022, in Sendai, Japan, as a joint
conference with the 75th GEC. This conference will also beheld as a joint conference with the 40th Symposium onPlasma Processing and 35th Symposium on Plasma
Science for Materials (SPSM35). The conference site will
be at Sendai International Center at Sendai.

1 Atomic and molecular collisional and dynamical processes
1.1 Electron and photon collisions with atoms and molecules:
excitation
1.2 Electron and photon collisions with atoms and molecules:
ionization
1.3 Heavy-particle collisions
1.4 Dissociation, recombination and attachment
1.5 Distribution functions and transport coefficients for electrons
and ions
1.6 Other atomic and molecular collision phenomena

TopicsThe ICRP-11 / GEC 2022 will consist of a series of oral
sessions (composed of both invited and contributedpapers), poster sessions, and several arranged sessions on
selected topics. Sessions will be organized aroundcoherent subjects in order to facilitate useful discussions
and focus on appropriate solutions to problems.

2 Plasma science
2.1 Nonequilibrium kinetics of low-temperature plasmas
2.2 Basic plasma physics phenomena in low- temperature plasmas2.3 Plasma boundaries: sheaths, boundary layers, others
2.4 Plasma-surface interactions
2.5 Plasma diagnostic techniques
2.6 Modeling and simulation: computational methods
2.7 Modeling and simulation: validation and verification
2.8 Modeling and simulation: plasma sources
2.9 Modeling and simulation: chemical reactions
2.10 Modeling and simulation: other2.11 Glows: dc, pulsed, microwave, others
2.12 Capacitively coupled plasmas
2.13 Inductively coupled plasmas
2.14 Magnetically-enhanced plasmas: ECR, helicon, magnetron,
others2.15 Atmospheric and high pressure plasmas: jets and gliding arcs
2.16 Atmospheric and high pressure plasmas: dielectric barrier andcorona discharges
2.17 Atmospheric and high pressure plasmas: catalysis and chemicalconversion
2.18 Thermal plasmas: arcs, jets, switches, others
2.19 Plasmas in liquids
2.20 Plasma on or contacting liquids
2.21 Plasmas and aerosols
2.22 Negative-ion and dust-particle-containing plasmas
2.23 Gas phase plasma chemistry
2.24 Other plasma science topics
3 Plasma applications
3.1 Plasmas for light production: laser media, glows, arcs,
flat panels, and novel sources
3.2 Plasma etching
3.3 Plasma deposition
3.4 Plasma ion implantation
3.5 Green plasma technologies: environmental and energy applications
3.6 Plasma processing for photovoltaic applications
3.7 Biological, medical, and agricultural applications of plasmas
3.8 Plasma propulsion and aerodynamics
3.9 Plasmas for nanotechnologies, flexible electronics, and otheremerging applications
3.10 Plasma for other materials processing and synthesis

Contributed Papers

Second Announcement

Contributed papers will be presented as 15-minute oral
talks or in poster sessions. Authors are requested to submit
a GEC-style abstract to the AIP website by June10, 2022.
A preference for oral/poster may be indicated. The final
decision will be communicated to the corresponding
author. In addition to GEC abstract submission, authors are
required to submit a manuscript (up to two pages) for ICRP
proceedings volume (in a two-column, camera-ready form)
no later than June10, 2022. Further details will be given in
the second announcement.

The second announcement will contain more details, such as
the scientific program, registration procedure, accommodation,transportation, visa information, and guidelines for preparing
abstracts. It will be issued in April/May 2022.

Abstracts and Proceedings
Regular participants will be available both the GEC
abstracts and the ICRP conference proceedings, whichcontain invited and contributed papers.

JJAP Special Issue
Papers published in the ICRP conference proceedings may
also be submitted to a special issue “Plasma Processing” of
the Japanese Journal of Applied Physics (JJAP).

Language
The official language of the conference is English. All
presentations and printed materials should be prepared inthe official language.

Conference Site
The conference will be held at the Sendai International
Center in Sendai, Japan. Other site information, such asaccommodations around the conference site, will be
provided at our web site:
https://www.ecei.tohoku.ac.jp/plasma/ICRP-11/index.html

Accommodation
Please visit our web site for more details.

https://www.ecei.tohoku.ac.jp/plasma/ICRP-11/
travel.html#hotel

Calendar of EventsFirst announcement
Feb 2022
Second announcement
April/May 2022
GEC abstract deadline
June 10, 2022
Paper deadline for a ICPR proceedings(up to two pages, a two-column, camera-redy form) June 10, 2022
Deadline for student travel support
June 10, 2022
Registration starts
July, 2022
Notification of acceptanceAugust 2022
Final announcement/program
September 2022
ICRP-11 / GEC 2022
October 3-7, 2022
Papers deadline for JJAP special issue
November 2022

Organizing Committee
F. Tochikubo（Chair）, Tokyo Metropolitan University
W. Choe（Vice-Chair）, KAIST
E. Stamate（Vice-Chair）, Technical University of Denmark
N. Babaeva, Joint Institute for High Temperatures
A. Bourdon, École Polytechnique
K. Hensel, Comenius University
M. Hiramatsu, Meijo University
K. Ishikawa, Nagoya University
T. Kaneko, Tohoku University
J. Kenney, Applied Materials
A. Kumada, The University of Tokyo
K. Kurihara, KIOXIA
H. J. Lee, Pusan National University
D. Liu, Xi’an Jiaotong University
I. Murakami, NIFS
S. Nijdam, Eindhoven University of Technology
D. O'Connell, Dublin City University
T. Ohta, Meijo University
O. Sakai, The University of Shiga Prefecture
Y. Sentoku, Osaka University
Y. Setsuhara, Osaka University

M.-J. Wang, National Taiwan University of Science and Technology
T. Watanabe, Kyushu University
R. White, James Cook University
H. Yoneda, The University of Electro-Communications

ICRP-11 Office
Congress Secretariat
E-mail：icrp-11@grp.tohoku.ac.jp