AEC/APC Symposium Asia 2023 SPONSORSHIP
November 2, 2023, Tokyo, Japan
Hidetaka Nishimura
Chairman, AEC/APC Symposium Asia 2023 Executive Committee
Renesas Electronics Corporation
Hidenori Kakinuma
Chairman, AEC/APC Symposium Asia 2023 Program Committee
KIOXIA Corporation
It is our great pleasure to announce that The 9th annual AEC/APC Symposium Asia 2023 will be held on
November 2, 2023 at National Center of Sciences Building (Gakujutsu Sogo Center), Tokyo which issponsored by ISSM (International Symposium on Semiconductor Manufacturing).
The program is consist of keynote speech, tutorial speeches, oral speeches, poster presentations andsupplier exhibition. This year, the symposium puts the subtitle” Towards unraveling the complexity, share
best practices in data science”.
AEC/APC Symposium Asia continues to contribute to the growth of the semiconductor industry through its
infrastructure for networking, discussion, and information sharing among the world's professionals. We
would like you to cooperate with us by supporting the AEC/APC Symposium Asia 2023.
Please see the benefit of AEC/APC Symposium Asia 2023 sponsorship.
Conference Overview
November 2, 2023
National Center of Sciences Building (Gakujutsu Sogo Center)2-1-2 Hitotsubashi Chiyoda-ku, Tokyo 101-0003, Japan
Tel: +81 3 4212-3900
Fax: +81 3 4212-3910
Sponsored by:International Symposium on Semiconductor Manufacturing (ISSM)
Supported by:
Japan Electronics and Information Technology Industries Association
Semiconductor Equipment Association of Japan (SEAJ)
Semiconductor Equipment and Materials International (SEMI)
In conjunction with: Dry Process Symposium (DPS)

Date:
Location:

About AEC/APC Symposium
AEC/APC symposium calls its annual conference in North America, Europe, and Asia. The suppliersof the device, the equipment, the material, the software, the sensor, and the metrology shall meet,and discuss the more intelligent and the higher productive manufacturing system in the conferences.
The conference is held in Taiwan and Japan every other year. AEC/APC is called the core of thescientific manufacturing technology. The technology has created the extensive progress of theproductivity improvement and the yield improvement in the semiconductor manufacturing area. The
technology discussed in the conferences has been applied and used in the process technology ofLCD,PV and Battery.
In Japan, the 9th conference is called in this year. Since 2007, the conference has discussed thescientific manufacturing technology using the data which can monitor the manufacturing equipment
and the process conditions.
The symposium is a very good chance among the technical authorities from Japan and from out ofJapan to share their knowledge and technologies in AEC/APC area. The symposium can also be avery good chance for the professionals of the process control industry such as semiconductor to meetand discuss.
Today, this area already forms the core part of the manufacturing engineering technology.
The role of this symposium is very important, since people can share the information and thedirections of the process control improvement, the equipment productivity improvement, and thematerial source reduction for the future.
*AEC: Advanced Equipment Control, APC: Advanced Process Control

Organization
Japan Executive Committee
Chair

Hidetaka Nishimura

Renesas Electronics Corporation

Japan Program Committee
Chair

Hidenori Kakinuma

Kioxia CorporationVice-Chair

Sumika Arima

University of Tsukuba

Takashi Kurosawa

Azbil Corporation

Masahiko Senzaki

Azbil Corporation

Akira Kagoshima

Hitachi High-Tech Corporation

Osamu Ohishi

IBM Japan Digital Services Company

Koh Horimoto

IBM Japan Digital Services Company

Hirofumi Tsuchiyama INFICON Co.,LtdMembers

Senichi Nishibe

KLA-Tencor Japan Ltd.

Toshiya Hirai

KOKUSAI ELECTRIC CORPORATION

Kenji Miyake

Office Miyake

Tsuyoshi Miyatake

Renesas Electronics CorporationShunichi Shibuki

Sony Semiconductor Manufacturing Corporation

Koichi Sakamoto

Tokyo Electron Ltd.

Hisato Tanaka

Tokyo Electron Ltd.

Kazutaka Nagashima Toshiba Electronic Devices & Storage Corporation
Tomoya Tanaka

Tower Partners Semiconductor Co., Ltd.

Takahiro Tsuchiya

United Semiconductor Japan Co., Ltd.

AEC/APC Symposium Asia AdvisorAdvisor

Koji Maekawa

Addison Clear Wave Coatings Inc.

AEC/APC Symposium Asia 2023 Sponsorship
Application Form
https://www.semiconportal.com/r/69/registration.php

Sponsorship Fee

PlatinumGold

SilverBronze¥800,000¥500,000¥300,000¥80,000

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AEC/APC Symposium Asia Invitation (Free)
Free ticket(s) for AEC/APC Symposium Asia
127(Tutorial session excluded)
AEC/APC Symposium Asia Website
Company logo placed on homepage
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Yes
Company logo placed on right-hand side ofwebsite

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AEC/APC Symposium Asia Proceedings (Download) & Brochure
Recognition of sponsorship in meeting
Upper
MiddleLowermaterials along withcompany logo and link to corporatewebsite (User wouldneed to have Internet access whenviewing the proceedings)
Company logo printed in color on thebrochure on site

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AEC/APC Symposium Asia Screen at site
Company logo on the screen of interval
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MiddleCompany logo poster at the Symposium
Room

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Registrant List (Name, Affiliation, email.
Only who accepted to provide to thesponsors.)〇LowerList

AEC/APC Symposium Asia 2023 Exhibition
Exhibition (with Sponsorship)¥100,000

Exhibition Only¥120,000

Contact:
AEC/APC Symposium Asia 2023 Office
C/O Semiconductor Portal, Inc.
E-mail: aecapc_2023@semiconportal.com