Topic / 1
Activities of the Micromachine Center / 2
Activities of the BEANS Laboratory / 6
Members' Profiles / 8

Topic

Developing an Infrastructure for the MEMS Industry
Keiichi Aoyagi, Executive Director of the Micromachine Center
The establishment of fundamental technologies in thefield of micro/nano technology, including micromachines
and Micro Electro Mechanical Systems (MEMS), would
further strengthen Japan’s industrial competitiveness,
which is currently reliant on advanced technologies. Thisaction might be just what Japan needs to ride out thecurrent economic downturn.
To this end, the Micromachine Center (MMC) is
focusing its 2009 projects and activities on further
reinforcing the infrastructure of the MEMS industry.
Specifically, we have been engaged in activities aimed atcontributing to Japan’s industrial development and to theinternational community as a whole. For example, wehave established micro/nano-related technology
development projects through collaboration amongindustry, government, and academia and haveendeavored to make the results of the fundamental
technologies developed in these programs widely
available. Beginning this year, we have also beendeveloping an administrative system capable of creating abetter environment for promoting the industrialization of
micro/nano devices. Our activities include conducting
investigative research, promoting standardization, andencouraging the dissemination of research findings, aswell as holding MEMS conferences to hear policy
recommendations and encourage industrial exchange andvitalization.
The Highly Integrated, Complex MEMS Production
Technology Development Project, more commonlyreferred to as the Fine MEMS Project, is a three-year
project that began in 2006 and was completed in the last
fiscal year. Since the original goals of the project wereachieved satisfactorily, this year we will focus on
disseminating and promoting the project’s achievements
related to the fine MEMS knowledge database and the
newly developed MEMS equivalent circuit generator andon creating a support system for commercializing theseachievements through continuous involvement in suchprojects. Further, we will actively move to develop an
outline for firmly establishing fine MEMS and otheradvanced MEMS in Japan’s industry and to write up
drafts and proposals for plans related to relevant R&D
projects.
The Project to Develop Next-Generation Device
Manufacturing Technologies that Fuse Different Fields,
more commonly referred to as the BEANS (Bio ElectroMechanical Autonomous Nano Systems) Project, is a fiveyear commissioned project that began in 2008. Though
only one year of the project has been completed, we are
already beginning to see solid achievements in the formof 27 academic presentations, 2 research papers, and 10
patent applications. In addition, the media has devoted
much coverage to the project’s accomplishments.
Beginning from this, the second year of the project,
the BEANS Laboratory will serve as the main association
responsible for implementing the project, with MMC
participating as a member of the association. In order toensure continued smooth implementation of the project,
MMC will work in concert with the BEANS Laboratory,
providing such support as human and financial resources.
MMC is also involved in developing a MEMS foundry
as a framework for supporting MEMS commercializationin Japan.
A milestone will be reached when Exhibition
Micromachine/MEMS is held for the 20th time in Tokyo in
2009. The 20 t h Exhibition Micromachine/MEMS isscheduled for three days on July 29–31, 2009 (Wed–Fri)
at Tokyo Big Sight, East Hall 5. MMC and the Beans
Laboratory are currently preparing visual aids for an
exhibit to outline the BEANS Project and describe its
achievements thus far.
Finally, I would like to ask for your continued andunwavering kindness toward MMC’s activities together
with your understanding and support for the BEANS
Laboratory, which launched its operations in April of thisyear.

MMC Director Tamotsu Nomakuchi speaking at an event to celebrate
the founding of the BEANS Laboratory (April 23, 2009)

Takeshi Yonemura, director of the Industrial Machinery
Division, METI speaking at the same event

Activities of the Micromachine Center

Overview of FY 2009 Project Planning
Micromachine Center
knowledge database according to the results of this analysis anddiscussing the role of MEMSPedia, which will serve as acomprehensive knowledge base for MEMS fields.
(3) Dissemination of the MEMS equivalent circuit generator
One of the products of development in the Fine MEMS
Project is the MEMS equivalent circuit generator. The generator
is scheduled for release at the end of May 2009 as a Web-based
service. There has been an increase in R&D activity on the
integration of MEMS and electric circuits and on integration
through combinations of different types of MEMS. As more andmore successful products emerge through this research, theMEMS equivalent circuit generator will play an important role
as a new design tool capable of compensating for the
shortcomings in the conventional design methods that focus
primarily on MEMS mechanical components. We recognize thatcreating a better environment for MEMS research through a
Web-based service capable of replacing MEMS with equivalent
electric circuits will be essential to the growth of fine MEMS.
Therefore, we are working hard to make this service available to
all MEMS researchers in Japan.
(4) Support for the BEANS ProjectWith the primary responsibility of the BEANS Project (FY
2008–2012) shifting to the BEANS Laboratory in 2009, MMC
will now participate as a member of the association. We will
provide personnel and financial resources and other suitablesupport for implementation of the BEANS Project in order toensure the project produces adequate results in the remaining
years.
(5) Examination of new projects for technologicaldevelopment
Since technological development on circuit integration andthe merging of dissimilar fields has recently gained momentum
in micro/nano-related fields through the Fine MEMS Project
and the BEANS Project, it will be necessary to establish centers
for MEMS research, development, and prototype manufacturing
to keep pace with this trend. In light of this, we will collaborate
with the relevant organizations and businesses to study
potential new projects for technological development.

1. Basic Policy for Project Planning
The Highly Integrated, Complex MEMS Production
Technology Development Project, more commonly referred toas the Fine MEMS Project, is a three-year project that began in2006 and concluded in the last fiscal year having achieved its
original goals satisfactorily. Thus, in 2009 we have turned ourattention to promoting and disseminating the project’s
achievements. Further, as the BEANS Laboratory has now
assumed its new role as the primary association responsible forcontinuing implementation of the Project to Develop NextGeneration Device Manufacturing Technologies That Use
Different Fields, a five-year project initiated in 2008 and morecommonly referred to as the BEANS project, the MMC will now
serve as a member of this association and will continue toprovide human and financial resources and other support forthe project.
In light of the current troubling economic conditions, werecognize the importance of strengthening Japan’s industrial
competitiveness, which is currently reliant on advanced
technologies. Accordingly, we will step up our efforts to create
a better environment for further stimulating industrialization
and research in the MEMS field through activities of the MEMS
Industry Forum (MIF) founded in April 2006, which activities
will include policy recommendations and the encouragement ofindustrial exchange and vitalization. We also remain firmly
committed to continuing activities from the previous year;
namely, investigative research, and activities to promote
standardization and to encourage the dissemination of researchfindings.
2. Major Projects

1. National / NEDO projects
This year, MMC will aggressively continue activities topromote and disseminate MemsONE, a product of theMemsONE Project, and will begin vigorous promotion anddissemination of the fine MEMS knowledge database and the
new MEMS equivalent circuit generator developed in the Fine
MEMS Project. In addition, we will work to formulate aframework for bases from which we can firmly establish highly
integrated, complex MEMS in Japan’s industry, and to write up
drafts and proposals for plans related to relevant R&D projects.
(1) Promotion and dissemination of MemsONE
In 2009 MMC will work more closely with software vendors
to provide support for MemsONE and will carry out activities todisseminate MemsONE with an emphasis on stabilizing theinfrastructure for future sales and distribution. Part of thedissemination activities will involve discussions with theCommittee for the Promotion and Dissemination of MemsONE
regarding promotion and dissemination challenges andstrategies. We will also work to strengthen cooperation between
the MIF and the Foundry Service Industry Committee (FSIC).
(2) Compilation of MEMSPedia
In order to disseminate the knowledge database of highly
integrated, complex MEMS created as part of the Fine MEMS
Project and to promote further accumulation of knowledge,
MMC plans to make the database available to the general public
on the Internet and to use events such as this year’s Exhibition
Micromachine/MEMS as venues for introducing the database.
We will also be establishing a new MEMSPedia Compilation
Committee this year aimed at further upgrading and expanding
the database. The committee will function as a vehicle for
identifying and analyzing technical fields and knowledge ofinterest to users based on server activity at MMC andmanagement of user registration, and for exploring issues andoperations relevant to the highly integrated, complex MEMS

2. Investigative research and standardization
MMC will be conducting investigative research to get a clear
picture of technological and industrial trends in micromachine
and MEMS technologies, which are emerging as key
technologies in the manufacturing industry. We will also
investigate new issues in micro/nano technology that arise whenmerging nanotechnology with technologies in other fields. We
hope to demonstrate our initiative on the international stage
while promoting standardization in the fields of micromachines
and MEMS.
(1) Investigative research on strengthening production
centers for highly integrated MEMS
(2) Surveying of technological trends at home and abroad(3) Surveying of industrial trends(4) Upgrading of the micro/nano database(5) Joint research for the purpose of proposinginternational standards(6) Follow-up on the international standardization ofaccelerating life tests, bonding strength tests for
MEMS materials, and standard test pieces forcalibration conducted in 2006–2008 under the
project title “Measurement and evaluation of
mechanical properties of MEMS materials and theirstandardization” ; the project is referred to as apriority follow-up and has been consigned to JSA(7) Follow-up to a proposal of standards for testing2

a. Opening of the MEMS Mallb. Holding of the MicroNano 2009 general exhibitionc. Holding of Exhibition Micromachine/MEMS
d. Expansion of the international affiliate network
e. Participation in the 15th World Micromachine Summit
f. Participation as exhibitor as Hannover Messe
g. Dispatch of overseas fact-finding missions and exchangeof researchers

MEMS wafer-to-wafer bonding strength(8) Investigative study on overseas standards
Conducted a study on Japan’s response to the escalating
number of proposals for MEMS standards in South Korea andother countries overseas (including standards related to RFMEMS and bending test methods).
(9) Adoption of thin film material tensile test method
standard as a JIS

3. MEMS Industry Forum projects (for policy
recommendations and industrial exchange andvitalization)

4. Dissemination and publicity projects
MMC will continue to publish and distribute newsletters, holdexhibitions, and otherwise disseminate information on
micromachines and MEMS to educate the public and make suchinformation widely available. We are collecting referencematerials and documentation related to micro/nano technologies
from universities, industrial circles, public organizations, andother sources in Japan and overseas. This documentation will beconsolidated with reference materials for surveys studies
conducted at MMC and will be made available at the MMC
archives for browsing and searching. Information will also be
provided internally and externally through MMC’s Web site.
We will continue to perform dissemination and publicity
activities in 2009, striving for efficiency and effectiveness. In
addition to our Web site and the quarterly magazine
MICRONANO, the MMC-MIF Monthly (Japanese only), and theMicro-Nano Express newsletter issued in collaboration with the
BEANS Laboratory, we will also jointly operate an exhibit with
the BEANS Laboratory at Exhibition Micromachine/MEMS.
The 20th Exhibition Micromachine/MEMS will be held at
Tokyo Big Sight as part of MicroNano 2009. The event isscheduled for July 29–31.

MIF was established as a special project committee with thegoals of supporting the further development of MEMS
industries and contributing to the international competitivenessof Japan’s industry. Membership in MIF is composed primarilyof companies in MEMS-related industries. MIF performs theactivities listed below in collaboration with affiliated academies,
regional centers, and overseas institutions. This year’s goals are
to improve its administrative function and further expand its
activities.
(1) Policy recommendations(2) Collaboration with industry and academia(3) Improvement of the infrastructure for MEMS
development
a. Expansion and upgrading of the MEMS foundry network systemb. Promotion and dissemination of MemsONE (mentioned earlier)c. Strengthening of collaboration among regional public
foundries and local clusters
d. Implementation of personnel training projects(4) Information exchange among businesses in MEMS
and other industries

Research Studies and Standardization Activities
1. Survey of Technological Trends at Home and Abroadfrom the above surveys were summarized in the FY 2008 Survey
Results for Field-Specific Trends.

This survey has been conducted every year since 1993 tocollect and analyze in detail the latest technological data in Japanand overseas in order to follow trends in technology. Recognizing
the growing importance of such trends in Asia, the MMC
conducted surveys of presentation categories and trends in fieldspecific presentations at APCOT 2008 in the first half of last fiscal
year. The same surveys were conducted in the second half of theyear for MEMS 2009, which is an annual focus of our surveys.
The Asia-Pacific Conference on Transducers and MicroNano Technology (APCOT) is an international conference heldin the Asia-Pacific region to present R&D findings in the MEMS
and nanotechnology fields. The conference has convened
biannually since 2002 when the first conference was held in
Xiamen, China. Since then, the conference has been held in
Sapporo, Japan in 2004, Singapore in 2006, and, most recently,
Tainan, Taiwan on June 22–25, 2008 (Sun-Wed). A total of 589
papers (compared to 571 at the previous conference) were
submitted for APCOT 2008, with 205 submissions from Taiwan(109 previously), 117 from Japan (66 previously), 111 from
China (137 previously), 51 from South Korea (48 previously),and 10 from Singapore (110 previously). Of the 589
submissions, 377 papers were accepted, resulting in an
acceptance ratio of 64.0%.
MEMS 2009, the 22nd IEEE international conference on
Micro Electro Mechanical Systems (MEMS) was held inSorrento, Italy on January 25–29, 2009 (Sun-Thu). A recordhigh 856 papers were submitted for the conference, withsubmissions from Asia accounting for more than half the total(405 papers, or 47%). Asia was followed by North America with
254 submissions and Europe with 197. As usual, the conference
organizers were very selective, choosing only 276 of thesubmitted papers for a mere 32% acceptance ratio. The findings

2. Standardization(1) IEC status
A Final Draft International Standard (FDIS) for Japan’s
proposal on fatigue testing methods of thin film materials wasreferred to the IEC, put to vote on March 20, and adopted as an
IEC international standard on April 7, becoming the fifthinternational standard related to MEMS and the fourthsubmitted by Japan. We also submitted a draft to the IEC in
February on fatigue testing methods using resonant vibration,
developed under METI’s activities for standards certification.
While committee drafts (CDs) on RF MEMS switches, FBAR
filters, bending test methods, and testing methods for wafer-towafer bonding strength proposed by South Korea are currently
under review, Japan has submitted many comments, which arebeing weighed to reflect Japan’s opinion. Japan has drafted
proposals on a die shear text, 3-point bending test, and blister
test as the primary testing methods for wafer-to-wafer bonding
strength. Testing methods for micro-pillar compression andthermal expansion coefficients recently proposed by South
Korea in August of last year were not approved, because thenumber of participating nations in the project remains at three,short of the required four.
(2) Research and development
METI has commissioned the MMC to perform researchstudies on standards certification for accelerating life tests(2006–08), standard test pieces for calibration (2006–08),
bonding strength tests for MEMS materials (2007–08), andmicro-gyroscopes and electronic compasses (2008–10). A draft
proposal for a standard on accelerating life tests has alreadybeen submitted to the IEC, while drafts on standard test pieces

3

for calibration and testing methods for bonding strength
reflecting the results of round-robin tests currently being
conducted at overseas research institutions are scheduled forsubmission to the IEC around June this year. The MMC has
completed an analysis of results for round-robin tests conductedon micro-gyroscopes at research institutions in Japan, as well asa study on standardization items for electronic compasses.
(3) Standardization topics in FY 2009
Three topics were proposed for METI’s 2009 collaborative
research and development project for international standards:
measuring methods and notation for MEMS shapes, bending
test methods for micro-cantilever beams, and bulging test
methods. Of these, measuring methods and notation for MEMS
shapes was adopted and submitted for public review. This is athree-year project to research measuring methods and notation
on parameters for shapes characteristic to MEMS devices, suchas side wall shapes, angles, and aspect ratios in threedimensional MEMS structures, and for writing up a draft
proposal for an international standard on measuring shapes of
MEMS devices, and submitting the draft proposal to the IEC. A
written proposal was submitted jointly with Kobe University.
(4) Establishment of the SC 47F national committee in the IEC
While the MMC has been carrying out activities for the IEC

for some years, a national mirror committee corresponding to
the IEC body was established at the MMC as the IEC assemblyin charge of reviewing MEMS standardization was upgradedfrom a working group to a subcommittee (SC 47F). It was
decided that the SC 47F national committee would beestablished in the IEC from 2009 based on the need fordeliberating bodies to clarify national and international stances.

IEC SC 47F plenary meeting held in Tokyo

Recent Activities of the MEMS Industry Forum(chair: Fumihiko Sato of Omron
Corporation) was held at theGrand Hotel Hamamatsu in
Hamamatsu, Japan. It was thefirst time held in the Tokai
region. The seminar mainly
targets beginners in MEMS field
and middle class engineers ofthe member companies.
The 12th MEMS Seminar
Entitled “MEMS Design andProcessing Techniques and Their Applications,” the seminar wascosponsored by the Organization for Hamamatsu Technopolis
and the Innovation and Joint Research Center of Shizuoka
University and was held concurrently with Hamamatsu Messe
2009 organized by the Organization for Hamamatsu Technopolis.
The “MEMS Design and Processing Techniques and Their
Applications” seminar covered a wide range of topics throughacademic lectures on advances in MEMS integration and fusionand expectations for the creation of new industries (Prof.
Susumu Sugiyama of Ritsumeikan University) and MEMS
design techniques using electric equivalent circuits (Prof. Gen
Hashiguchi of Shizuoka University); a lecture on stealth dicing(a fully dry process) gaining popularity in MEMS mass
production plants (Naoki Uchiyama of Hamamatsu Phototonics)
as an introduction to technologies used in MEMS businesses in
the Tokai region of Japan; lectures on MEMS devices,
processes, and simulations developed by member companies of
the FSIC; and talks on MEMS technology and trends, MEMS
foundries, and the MEMS Open Network Engineering System of
Design Tools (MemsONE).

The MEMS Industry Forum (MIF) was established with thegoals of supporting the further development of MEMS industries
and contributing to the international competitiveness of Japan’s
industry. Membership in the MIF is composed primarily ofcompanies in MEMS-related industries. The MIF conducts
various activities in collaboration with affiliated academies,
regional centers, and overseas institutions to encourage
exchange among and vitalization of MEMS-related industries.
This article describes some of the recent activities at the MIF.

1. Initiation of MEMS Personnel Training Projects
The market for micro electro mechanical systems (MEMS)
is expected to grow to 1.17 trillion yen in 2010 and to 2.4 trillion
yen in 2015. In order to develop a sufficient number of skilled
personnel to accommodate this expansion in the MEMS market,
the MIF is examining ways to implement MEMS personnel
training programs aimed at improving in-house personnel
training at companies with the strategy of stepping up thenumber of MEMS skilled personnel in stages to meet expectedindustry needs, enhancing MEMS personnel training throughindustry-academia collaboration, and improving theenvironment to make MEMS fields more accessible to personnel
wishing to transfer from other fields.
The MIF is currently helping out with a personnel training
program spearheaded by the National Institute of Advanced
Industrial Science and Technology (AIST) entitled “Personnel
training program for pioneering new innovative projects related
to micro/nano mass production and applied device fabrication.”
The MIF has also begun a study in concert with regional
consortia on a tangible personnel project aimed at expanding
practical personnel training with industry-academia
collaboration and offering more MEMS lectures and training
courses for working people, as well as launching a Web site for
personnel training in MEMS fields. During 2009 the MIF plans
to work with regional consortia, public research institutes, anduniversities to build the foundation for integrated course
management with curricula structured around the local
characteristics of each region.

3. The 17th MEMS Advanced Technology ForumThe forum was established to encourage the exchange ofideas among industry and academia and to disseminate
information and raise awareness on micro/nano technologies. It
mainly targets skilled researchers and engineers of the member
companies. Held three times annually, the forum invites experts
from universities, the AIST, and other organizations to givelectures on cutting-edge technologies in the micro/nano and
MEMS fields.
The 17th MEMS Advanced Technology Forum was held on
February 17 (Tuesday) at the MMC Techno Salon, where the2. The 12th MEMS Seminar
On February 6, the 12th MEMS Seminar organized by the
MEMS Foundry Service Industry Committee (FSIC) of the MIF

4

MIF had the privilege of welcoming Prof. Shuichi Shoji of
Waseda University’s Faculty of Science and Engineering andAssociate Prof. Yoshio Mita of the University of Tokyo’s
Graduate School of Engineering.
Prof. Shoji introduced a case study entitled “MEMS devices
designed for cell function analysis” on applied MEMS devices
that enable a cell culture system, cell disruption, andbiomolecular separation and analysis for analyzing the functionsof specific cells. Associate Prof. Mita introduced an innovative
MEMS technology in his lecture entitled “Study on MEMS
integrated through an autonomous distributed micro-robot.” As
an example, he described a MEMS device that moves
autonomously over a water surface according to low-voltage

Prof. Shuichi Shoji of
Associate Prof. Yoshio Mita
Waseda Universityof the University of Tokyo
electrowetting-on-dielectrics (EWOD) droplet propulsion
employing a three-dimensional photodiode structure having adepth of 10µm and a width of 150 nm.

Dissemination and Publicity Projects
The Micromachine Center (MMC) publishes newsletters,
holds exhibitions, and distributes information on its Web site asa means of disseminating information on micromachines andMEMS to educate the general public and of making information
on its activities widely available. This article will describe someof the MMC’s recent activities.

present their latest research findings. Details of the event are
given below.
(1) 20th Exhibition Micromachine/MEMS
The world’s largest exhibition covering both themicromachine and MEMS industries, the 20 t h Exhibition
Micromachine/MEMS will be held July 29 –31, 2009. At Tokyo
Big Sight (Tokyo International Exhibition Center), East Hall.
Some special exhibits are planned for the event tocommemorate its 20th anniversary.
(2) Seminars and symposiums
This year, two special conference areas A and B will be set
up at the venue of Exhibition Micromachine/MEMS for holding
various presentations on micro/nano-related research activities.
The following table shows the schedule of events for these
conference areas.
Conference area A
Conference area B

1. Expansion of Participants in the MEMS Mall
The MEMS Mall was launched on October 1, 2008 on the
MMC Web site to provide information on products andtechnologies developed by MEMS-related companies. Whileparticipation in the mall was limited last year to members of the
MEMS Industry Forum (MIF), this year we have relaxed therequirements to include non-member companies.
In the past, a person wishing to collect information on
MEMS products had to access each company’s Web site
individually. The MEMS Mall is a site that brings all MEMS
product information together and provides online visitors amethod of accessing information, much like visiting booths at
the MMC-sponsored Exhibition Micromachine/MEMS. To
participate in the MEMS Mall, please visit the following Web site.
http://www.mmc.or.jp/mall/

7/29 (Wed)

10:25–16:45
11:00–12:20
The International
MEMS Industry Forum
Workshop on IndustryMicromachine/Nanotech
Academia Collaboration
Symposium
13:00–15:50– MEMS World –MEMS Packaging Forum2. MemsONE Sales and Distribution
Sales and distribution of the MEMS design and analysis
software MemsONE began in February this year. The software
was developed under the project entitled the MEMS OpenNetwork Engineering System of Design Tools and has been
receiving glowing reviews. An academic version of the softwarefor universities and public research institutions is distributed by
the MMC, while an enterprise version designed for generalcompany use is sold through software vendors.
See the table below for the schedule of MemsONE training
courses to be held in Tokyo and Osaka. For more informationon the training courses and features of the MemsONE software,please visit the following Web site.
http://mmc.la.coocan.jp/mems-one/
Schedule of training courses

Tokyo

Osaka

5/19 (Tue) : Basic operations
6/22 (Mon) : Analysis
9/18 (Fri) : Applications
10/21 (Wed) : Basic operations
11/18 (Wed) : Analysis
1/20 (Wed) : Applications

5/22 (Fri) : Basic operations
7/17 (Fri) : Analysis

7/30 (Thu)

7/31 (Fri)Japanese-German
Micro/Nano BusinessForum
10:30–16:15
MIF Forum

11:00–12:20
MEMS Industry Forum Workshop
on Industry-Academia Collaboration
13:15–17:00
BEANS Project Seminar
10:30–16:45
Presentation of Results fromthe Fine MEMS Project

For more information on the exhibition and visitor
registration, visit the Web site (http://www.micromachine.jp.)
The 19th Exhibition Micromachine/MEMS held in 2008

3. Micro/Nano 2009
The general exhibition Micro/Nano 2009 provides a venue
for businesses in the micromachine and MEMS industries toshowcase their leading-edge products and materials and to5

Activities of the BEANS Laboratory

Foundation and Overview of the BEANS Laboratoryof the association) on January 16, a meeting of promoters on
February 3, and an inaugural general meeting and council
meeting on February 20. The application submitted to the
Minister of Economy, Trade, and Industry on March 6 wasapproved on March 19, and the association was officiallyregistered on March 24. An extraordinary general meeting washeld on that very day to approve the project plans and budget
for fiscal year 2009, and operations of the association were off
to a smooth beginning on April 1.
Since the launch of operations, the association has joined
forces with the MMC under the direction of Director
Nomakuchi, with the goal of further expanding activities aimed
at encouraging growth in Japan’s MEMS industry.

The Bio Electro-mechanical Autonomous Nano Systems(BEANS) Project, which has been implemented under theMicromachine Center (MMC) since July 2008, has beentransferred to the control of the BEANS Laboratory, atechnology research association, in April 2009. After much
effort–though only a three-month period of preparation–thetechnology research association was officially established on
March 24 of this year. We are immensely grateful to all
association members and concerned parties for their support
and cooperation during this period.
Owing to the cooperation of the member companies, anapplication for approval of the technology research association
was prepared through a process that included a briefing session
with interested parties (preparatory meeting for establishment

Name

BEANS Technical Research Association (BEANS TRA), commonly referred to as the BEANS Laboratory

AddressMBR Building, 6th Floor, 67 Kanda-Sakumagashi, Chiyoda-ku, Tokyo 101-0026

Establishment
dates

February 20, 2009 (inaugural general meeting)March 19, 2009 (approval of establishment)
March 24, 2009 (official registration)

Chair

Tamotsu Nomakuchi

Members(18 organizations)

Omron Corporation
Olympus Corporation
Mathematical Systems Inc.
Seiko Instruments Inc.
Denso Corporation
Terumo Corporation
Fujikura Ltd.
Toshiba Corporation
Furukawa Electric Co., Ltd.
Fuji Electric Systems Co., Ltd.
Mizuho Information & Research Institute, Inc.
Panasonic Electric Works Co., Ltd.
Mitsubishi Chemical Medience Corporation
Mitsubishi Electric Corporation
Micromachine Center (MMC)
Lintec Corporation
Institute for Unmanned Space Experiment Free Flyer Foundation (USEF)
Japan Resources Observation System and Space Utilization Organization (JAROS)

Organizational Structureof the Association
Council
Executive Director

General Assembly

Chair
Managing Director

Auditor

Steering Committee

Head Office
President
Vice President
Secretariat
Secretary General
Department of General Affairs
Department of Research Management
Department of Research Support
Department of Research and Development
Office of Project Leader Support

Research Centers
Life BEANS Center
Life BEANS Center Kyushu
3D BEANS Center
3D BEANS Center Shiga
Macro BEANS Center
Center Directors

Committees
BEANS Project Promotion Committee
Technical Research Committee
Knowledge Database Compilation
Committee
Simulations CommitteeStandards CommitteeIntellectual Property Committee
Academia Committee

Visit the following Web site for more information: http://www.beanspj.org/lab/index.html

6

An Overview of Projects Planned for 2009
The BEANS Laboratory will be implementing the following
R&D projects in 2009.
R&D Project 1: Development of processes for integrating
biomaterials and organic matter
1) Process technologies for nano-interface fusion
2) Process technologies for the formation of higher order
bio/organic structures
R&D Project 2: Development of processes for theformation of 3D nanostructures
1) Technologies for forming ultra-low damage/high-density
3D nanostructures
2) Technologies for forming hetero-functional integrated 3D
nanostructures

3) Technologies for forming 3D nanostructures for space applications
R&D Project 3: Development of micro/nanostructure largearea continuous manufacturing processes
1) Process technologies for large-area formation of high-grade
nanofunction membranes in a non-vacuum environment2) Process technologies for continuous micromachining andintegration of fibrous substrates
R&D Project 4: Development of a knowledge database fornext-generation device fabrication
technologies integrating dissimilar fields
We are also collecting information from dissimilar fields ontangible requirements for producing innovative devices that
may lead to new lifestyle improvements.

Entering the 2nd Year of the BEANS ProjectAtsushi Yusa, BEANS Project Leader
results will necessarily be produced thorough research
management. Therefore, all the managers of this project the
research directors and the project leader, must attempt toachieve balance in their management so as to anticipate adegree of uncertainty in the original plan and respect the
researchers’ independence and spontaneity, while guiding the
researchers in a direction that does not veer from the basic
plan. In this case, the implementation plan serves as thefulcrum of the balance and helps the managers determine thecorrect approach when research does not proceed as hoped.
Based on such determinations, the managers may revise or
modify the initial plan within the scope of the basic plan. More
important is that all researchers fully understand their goals
and share their results with other researchers and centers.
Cooperative relationships among research topics and membersof the BEANS Project will come about naturally as a result. I
realize that this approach was not adequately achieved in thefirst year of the project and feel strongly that these ideas can bebetter incorporated in our project management this year.
The next goal for the second year is to strengthen
collaboration among research centers, as mentioned earlier.
This year we will begin a new topic of integrated research
between the 3D BEANS Center and Life BEANS Center
Kyushu, which was suggested and planned based on
preliminary experimental results produced in the first year. By
applying low-damage etching technology, the core technology
at the 3D BEANS Center, to organic thin film formation
technology at Life BEANS Center Kyushu, we have begun tosee some potential for forming 3D structures of organic matterthat do not occur in the natural world. This is a research topic
appropriate for the BEANS Project, and I am confident that it
will be received as creative and revolutionary throughout theworld. We are also planning similar topics of integrated research
between the Macro BEANS Center and the Life BEANS Centerand between the 3D BEANS Center and the Life BEANS
Center. Hence, the second year of the project will be shiftingfrom the preparation stage to serious topics of integrated
research, and I anticipate that we will produce results worthy of
the BEANS Project that will attract much attention.
If we liken the first year of the BEANS Project to a period of
preparing for takeoff, then the second year will see us spread
our wings to lift off of the runway. With diligence and hard
work, we can skillfully catch an updraft and ride it to greatheights where the flying is smoother. In this I ask for yourcontinued support and cooperation.

The initial year of the BEANS Project spanned a shorterthan-usual nine-month term, which seemed to be over before it
began. Our work during this period could be describedsuccinctly as start-up activities for launching the project. For
example, we provided facilities at the University of Tokyo’s
Komaba Research Campus, the Kyushu University Center for
Future Chemistry, and the Tsukuba East Office of the National
Institute of Advanced Industrial Science and Technology withclean rooms, private sitting rooms, and labs for the exclusive
use of the BEANS Project. We also worked on equipping thelabs and enhancing the environment of the facilities by
installing large machinery and lab equipment during the earlystage of the project. At the same time, we naturally focused ourefforts on research tasks scheduled for the first year by taking
advantage of the university-owned research facilities. This
quickly resulted in some ingenious research results, that could
only have been made possible by the BEANS Project. Our
research findings were covered in academic publications andother media under the subject of MEMS and transducer
research, raising the profile of the BEANS Project.
By working to coordinate research centers and integrate
research tasks, which is a goal of the BEANS Project, we are
beginning to develop integration among research topics. Of
course, not all research projects go according to plan, andprogress can be erratic depending on the nature and degree ofdifficulty of the topic. However, I believe the project as a wholeis proceeding in the right direction.
After reviewing the results from the initial year, as well as
the problems or difficulties that were encountered, we have set
a primary objective for the second year to achieving smooth andefficient project implementation. From the first year, we havelearned the importance of establishing expected results andclear target values at the time of drafting the plan. Even when aplan is drafted, however, there are always unforeseen
circumstances that prevent research from proceeding as
anticipated. This is also the enjoyment and thrill of research.
Consequently, even though researchers go through the motionsof drafting a plan initially, they tend to feel that such a plan ispointless and neglect to conduct mid-year reviews of the planand to monitor progress. In other words, at times researchers
can become mired in research conducted for their own interests
or research that produces immediate results, losing sight of theoriginal goals. Of course, one cannot completely negate suchdigressions because they occasionally lead to importantdiscoveries and inventions. However, within the BEANS Project
research we cannot allow researchers to stray from the end goal
or expected achievements. We also cannot simply assume that7

OtherMembers’ Profiles

Nippon Avionics Co., Ltd.
1. Company Profile

3. Sealing Product Lineup

Since 1963, Nippon Avionics has been assistingcustomers through the development of resistance welders
primarily for use with electronic parts, and such joining
technologies as microsoldering, thermocompression, andbonding. In 1966 the company adopted parallel seam
sealing as a highly reliable hermitic sealing method for
optical devices and hybrid integrated circuits. The
applications for this parallel seam sealing technology
expanded with the surface mounting of crystal oscillators
and SAW filters in the early 1980s. When vacuum seals
became necessary for the miniaturization of crystal
oscillators around 2003, we quickly introduced a vacuum
seam welder that is still the primary sealing method today.
Recently there has been an increase in the use of seam
sealing for MEMS devices, such as accelerometers,
gyroscopes, and infrared sensors and our sales of seam
welders has reached more than 800 units.

As a specialist in welding, Nippon Avionics exploredthe most suitable control technologies for seam sealing
and developed a dedicated power supply to install in its
sealing equipment. The company has manufactured
sophisticated, high-performance equipment using its own
software, and mechanical, image-recognition, andapplication technologies and has held the top market
share since its product lineup was first introduced.
We have a wide array of products ranging frommanually operated units for research or low-volume
production to automated inline units for mass production.
Our products also perform constant pressure control andare capable of sealing vibration devices such as
accelerometers in helium or other inert gases when thedevices must be accommodated in a constant internalpressure environment to maintain a uniform vibratingstate.

2. Parallel Seam Sealing
The principle of parallel seam sealing is to supply
electricity to a lid, a seal ring, or a metal package, thereby
applying Joule heating to melt a brazing filler materialpreset between the lid and the package. The melted filler
material fills the gaps and forms a mechanical bond
between the lid and the package.
As shown in Fig. 1, tapered roller electrodes areprovided on the left and right edges of a device so as toapply a moderate load to the device. As the device is
moved at a constant speed, a welding current flows
intermittently between the electrodes, generating heat tomelt the filler material around the lid.
Since parallel seam sealing can produce a hightemperature instantaneously, the seal can be formed withnickel, which is very reliable but has a high melting point.
Nickel also has a very high cooling rate, producing a dense
filler composition when solidified and, thus, a highbonding strength. Further, parallel seam sealing uses
localized heating and, therefore, generates only a small
heat-affected zone. Accordingly, this technique canproduce a hollow structure that is strong and reliable.

Fig.1 Principle of seam sealing

Fig.2 Full Automatic Vacuum Sealing
Equipment NAW–1265A

4. Future Endeavors
In addition to the seam welding method introduced inthis article, Nippon Avionics possesses a joining
technology employing heating units to implement a pulse
heating method. Pulse heating adjusts the temperature
through feedback control to reproduce a specified
temperature profile accurately. This feature canconceivably be applied to batch sealing and die bonding in
MEMS devices using filler material with a low melting
point.
By refining the conventional seam welders, we offeruser-friendly equipment that achieves higher yields. As apioneer in micro-joining technology, the company supplies
pulse heating units suitable for use in MEMS devices. We
are confident that you will find this equipment
advantageous when developing or fabricating such MEMS
devices.
For a more detailed description of our products,
please refer to our Web site at http://www.avio.co.jp.

Note:With the launch of the BEANS Project in April this year, the format for this issue (No. 67) of the MICRONANO magazine has been
updated to include information in the micro/nano fields distributed by both the Micromachine Center and the BEANS Laboratory,
which is the association overseeing the BEANS Project. Thus, in addition to including a description of activities performed at theMicromachine Center, future issues of the magazine will also include activities and achievements by the BEANS Laboratory.

MICRONANO No. 67
MICRONANO is published quarterly by Micromachine Center (MMC), BEANS Technical Research Association(BEANS . TRA) to promote the international exchange of information related to micromachines, R&D and othertechnical topics, and is circulated free of change. Please send your comments about MICRONANO to the publisher :Keiichi Aoyagi, Executive Director, Micromachine Center (MMC)
MBR99 Bldg., 6F., 67 Kanda Sakumagashi, Chiyoda-ku, Tokyo 101-0026, Japan
Tel : +81-3-5835-1870, Fax : +81-3-5835-1873
Internet Home Page h t t p : / / w w w . m m c . o r . j p /Date of Issue : May 15, 2009