TX7316EVM Ultrasound Transmitter Evaluation
ModuleUser's Guide

Literature Number: SBOU224A
March 2019 – Revised May 2019

Contents
1
2
3
4

Trademarks .........................................................................................................................
EVM Hardware Overview .......................................................................................................
GUI Software Installation ......................................................................................................
Equipment Setup Overview ...................................................................................................

5
6
6
7

4.1

Power Supply ............................................................................................................. 8

4.2

USB Interface to PC ..................................................................................................... 8

5
Testing the EVM ................................................................................................................... 8
Appendix A TX7316EVM GUI Installation ....................................................................................... 14
A.1

TX7316EVM GUI Installation ........................................................................................ 14

Appendix B TX7316EVM GUI Features .......................................................................................... 24
B.1

Overview of the TX7316EVM GUI Features ....................................................................... 24

Appendix C Testing the EVM in 3-Level Mode ................................................................................ 36
C.1

Testing the EVM ....................................................................................................... 36

Appendix D Hardware Reference .................................................................................................. 43
D.1

TX7316EVM Hardware Overview ................................................................................... 43

D.2

TX7316EVM Testpoints .............................................................................................. 44

D.3

TX7316EVM Schematics ............................................................................................. 45

D.4

TX7316EVM Bill of Materials ........................................................................................ 53

Appendix E Measurement Techniques and Troubleshooting ........................................................... 57
E.1

Measurement Techniques ........................................................................................... 57

E.2

Troubleshooting ....................................................................................................... 57

Revision History .......................................................................................................................... 58

2

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General Texas Instruments High Voltage Evaluation (TI HV EMV) User Safety Guidelines

WARNING
Always follow TI's set-up and application instructions, including use of all interface components within theirrecommended electrical rated voltage and power limits. Always use electrical safety precautions to help
ensure your personal safety and those working around you. Contact TI's Product Information Center
http://ti.com/customer support for further information.
Save all warnings and instructions for future reference.

WARNING
Failure to follow warnings and instructions may result in personal injury,
property damage or death due to electrical shock and burn hazards.
The term TI HV EVM refers to an electronic device typically provided as an open framed, unenclosed
printed circuit board assembly. It is intended strictly for use in development laboratory environments,
solely for qualified professional users having training, expertise and knowledge of electrical safety risks indevelopment and application of high voltage electrical circuits. Any other use and/or application are strictly
prohibited by Texas Instruments. If you are not suitable qualified, you should immediately stop from further
use of the HV EVM.
1. Work Area Safety:
a. Keep work area clean and orderly.
b. Qualified observer(s) must be present anytime circuits are energized.
c. Effective barriers and signage must be present in the area where the TI HV EVM and its interface
electronics are energized, indicating operation of accessible high voltages may be present, for the
purpose of protecting inadvertent access.
d. All interface circuits, power supplies, evaluation modules, instruments, meters, scopes, and otherrelated apparatus used in a development environment exceeding 50Vrms/75VDC must be
electrically located within a protected Emergency Power Off EPO protected power strip.
e. Use stable and non-conductive work surface.
f. Use adequately insulated clamps and wires to attach measurement probes and instruments. No
freehand testing whenever possible.
2. Electrical Safety:
As a precautionary measure, it is always good engineering practice to assume that the entire EVM
may have fully accessible and active high voltages.
a. De-energize the TI HV EVM and all its inputs, outputs and electrical loads before performing any
electrical or other diagnostic measurements. Revalidate that TI HV EVM power has been safely
de-energized.
b. With the EVM confirmed de-energized, proceed with required electrical circuit configurations,wiring, measurement equipment hook-ups and other application needs, while still assuming the
EVM circuit and measuring instruments are electrically live.
c. Once EVM readiness is complete, energize the EVM as intended.

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WARNING
While the EVM is energized, never touch the EVM or its electricalcircuits, as they could be at high voltages capable of causing
electrical shock hazard.
3. Personal Safety
a. Wear personal protective equipment e.g. latex gloves or safety glasses with side shields or protect
EVM in an adequate lucent plastic box with interlocks from accidental touch.
Limitation for safe use:
EVMs are not to be used as all or part of a production unit.

4

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User's Guide
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TX7316EVM Evaluation ModuleThis user’s guide gives a general overview of the TX7316EVM evaluation module (EVM) and provides a
general description of the features and functions to be considered while using this module. The
TX7316EVM provides a platform for evaluating the transmitter under various drive strength, different
voltage levels and different modes of the device.
This user’s guide refers to software TX7316EVM GUI v.1.0.0 or higher and requires the Microsoft®
Windows 7® operating system or above to function.
For any further questions regarding the EVM, GUI or device, contact TI support.

WARNINGThe TX7316EVM evaluation module has high voltage DC supply
connected to it. Hence do not leave EVM powered when
unattended as it can result in potential injury.
The TX7316EVM evaluation module is intended strictly for
simulating ultrasound transducer interface development inelectrical instrumentation/laboratory development environment. To
minimize risk of possible electrical shock and/or radiation hazards,
attachment of actual ultrasonic transducers/receivers is prohibited.
1

Trademarks
Microsoft, Windows 7 are registered trademarks of Microsoft.
National Instruments is a registered trademark of National Instruments.
Python is a registered trademark of Python.
All other trademarks are the property of their respective owners.

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EVM Hardware Overview

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EVM Hardware Overview
The EVM received should resemble Figure 1. For more hardware details, refer to Appendix D.
The TX7316EVM kit contains the following items:
1. TX7316EVM
2. 1 mini-USB cable

Figure 1. TX7316EVM

3GUI Software Installation
The TX7316EVM requires a software to be installed to check the on-chip features of the device. Ensurethat no USB connection is made to the EVM until after the installation is complete. This user’s guide refers
to software TX7316EVM GUI V 1.0.0. For information on the installation of the TX7316EVM software GUI,
see Appendix A.

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4

Equipment Setup Overview
Figure 2 and Figure 3 show the equipment setup required to test the TX7316EVM in off-chip and on-chipmode, respectively.

±5-V Supply
TX7316
EVM

Oscilloscope±100-V Supply±50-V Supply

Figure 2. Off-chip Beamforming Setup
TX7316 EVM GUI

ComputerUSB±5-V Supply
TX7316
EVM

Oscilloscope±100-V Supply±50-V Supply

Figure 3. On-chip Beamforming Setup

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4.1

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Power Supply
The EVM uses a screw-based connector for power supply ports. The EVM requires a ±5-V supply and twohigh voltage ±100-V supply each with a 500-mA current range.

4.2

USB Interface to PC
USB connection from the TX7316EVM to the PC is used for communication between the GUI and theEVM. Both USB 2.0 and 3.0 ports are supported.

5

Testing the EVM
1. Power Supply: Ensure that the power supplies are turned off before connecting to the board. Apply ±5
V to connector J3 (set the current limit of both the supplies to 200 mA). Apply ±50 V to connecter J1
and ±100V to connector J2 (supply on both the connectors can be any value between ±1.5 to ±100 V;
however, J2 supplies must be higher than that of J1). Set the current limit to 30 mA.
2. Hardware reset: Press switch S1 to hardware reset the device. After hardware reset, the CPLD on
board starts emitting 1-kHz TR_BF_SYNC and TR_EN signals.

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Figure 4. Connectors and Switches of the EVM
3. Off-chip beamforming: To enable the off-chip beamforming mode of the device, press switch S2. The
switch triggers the CPLD on the board to start sending the input control signals required by the device.
After the switch is pressed, the device starts emitting pattern. Trigger the oscilloscope by probing pin 2of J7 connector (TR_BF_SYNC). Outputs can be observed on pins 3 to 10 of J7 connector. The output
pattern can be inverted by pressing switch S3.

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Voltage (50 V/div)

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Time (500 ns/div)

Frequency = 1.08 MHz; Peak-to-Peak = 196.5 mV

Voltage (50 V/div)

Figure 5. Output Pattern When Switch S2 is Pressed

Time (500 ns/div)

Frequency = 1.08 MHz; Peak-to-Peak = 196.5 mVFigure 6. Output Pattern When Switch S3 (invert) is Pressed
4. On-chip beamforming: To check on-chip functionality, first ensure that the power supplies are
powered off. Then, connect the USB cable to the board and open the GUI. Select 5-level mode in the
Select a Device Mode pop-up window.(See Figure 7). Turn on the power supplies once the GUI is
loaded. Click DUT HW Reset button on the Quick Setup tab (See Figure 8) to hardware reset thedevice and then click Reset Memory to 0 button to initialize the memory.

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Figure 7. Select a Device Pop-up Window

Figure 8. Quick Setup Page
a. Testing the B mode of device:i. Pulser output of the device can be checked by selecting the Internal: 1 MHz, 4 pulses option
under B-Mode. The CPLD on board generates the TR_BF_SYNC and TR_EN signals (1-kHz
pulse repetition frequency) control signals for the device. Trigger the oscilloscope by probing
pin 2 of J7 connector (TR_BF_SYNC). Pulser outputs can be observed on pins 3 to 10 of J7
connector.
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Voltage (50 V/div)

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Time (500 ns/div)

Frequency = 952.4 kHz; Peak-to-Peak = 196.5 mVFigure 9. Internal: 1 MHz, 4 Pulses

Voltage (20 mV/div)ii. TW switch glitch can be checked by enabling the TRSW glitch mode on the quick setup tab.
Trigger the oscilloscope by probing pin 2 of J7 connector (TR_BF_SYNC). TRSW glitch can beobserved on pins 3 to 10 of J5 connector (labelled as RX_IN).

Time (500 ns/div)

Peak-to-Peak = 58.7 mV

Voltage (20 mV/div)

Figure 10. TR Switch On Glitch

Time (500 ns/div)

Peak-to-Peak = 39.6 mV
Figure 11. TR Switch Off Glitch

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b. Testing the CW mode of the device:i. To check the CW mode of the device, reduce the ±50-V supply (connected to J1 connector) to±5 V. Current limit of all ±5-V supplies must be increased to 500 mA. The CW mode of thedevice can be enabled by clicking the CW mode enable on the GUI (clicking on this mode
gives a pop-up warning asking the user to ensure that the supply voltage is ±5 V as shown in
Figure 12; Click Continue button after reducing the supply voltage). Trigger the oscilloscope by
probing pin 2 of J7 connector (TR_BF_SYNC). Pulser CW outputs can be observed on pins 11
to 18 of J7 connector.

Voltage (2 V/div)

Figure 12. Pop-up Warning Given by the GUI When the CW Mode is Selected

Time (500 ns/div)

Frequency = 3.125 MHz; Peak-to-Peak = 8.08 V
Figure 13. CW-Mode Output of the Device

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Appendix A
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TX7316EVM GUI Installation
A.1

TX7316EVM GUI Installation
Download the TX7316EVM GUI from the mySecureSoftware folder athttps://www.ti.com/securesoftware/docs/securesoftwarehome.tsp
1. Unzip the saved file and run the installer executable as administrator by right clicking on the file andselecting Run as Administrator. In TX7322 Installer window, press the Next > button

Figure 14. TX7316EVM GUI Install (Begin Installation)
2. Read the Texas Instruments License Agreement. Select the I accept the agreement radio button, andthen press the Next > button.

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Figure 15. TX7316EVM GUI Install (TI License Agreement)
3. Read the National Instruments® License Agreement. Select the I accept the agreement radio button,
and then press the Next > button.

Figure 16. TX7316EVM GUI Install (National Instruments® License Agreement)
4. Read the PSF License Agreement for Python®. Select the I accept the agreement radio button, andthen press the Next > button
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Figure 17. TX7316EVM GUI Install (Python® License Agreement)
5. In the Installation Directory screen, press the Next > button to allow the software to be installed in thedefault location or browse to the desired location and then press the Next > button

Figure 18. TX7316EVM GUI Install (Install Directory)
6. In the Select Components screen, keep the default selections unchanged and click the Next > button.
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Figure 19. TX7316EVM GUI Install (Select Components)
7. In the Ready to Install screen, click the Next > button to allow the software to be installed:

Figure 20. TX7316EVM GUI Install (Installation Ready)8. The Installation is in progress... screen appears showing that the installation is in progress.

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Figure 21. TX7316EVM GUI Install (Installation Progress)
9. Python 2.7 Setup window displays. Select the Install for all users radio button and then click the Next >button.

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Figure 22. TX7316EVM GUI Install (Installation for Users)
10. Select Destination Directory window displays. Select the default path and click Next > button.

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Figure 23. TX7316EVM GUI Install (Select Destination Directory)
11.
A. If Python 2.7 is already installed:i. Python 2.7 setup window appears. Click No button to prevent the existing files from getting
overwritten.

Figure 24. TX7316EVM GUI Install (Python® is Already Installed)ii. Click Yes button to cancel the Python 2.7 installation.

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Figure 25. TX7316EVM GUI Install (Cancel Python® Installation)
B. If Python 2.7 is not installed:
i. In the Customize Python 2.7 Screen, select the desired customization and click Next > button.

Figure 26. TX7316EVM GUI Install (Customize Python®)ii. The Install Python 2.7 Screen appears.

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Figure 27. TX7316EVM GUI Install (Python® Installation Progress)iii. After the installation is complete, Completing the Python 2.7 Installer screen appears. Click theFinish button to complete the installation.
12. In the Completing the TX7316EVM Setup Wizard screen, Click the Finish button to complete theinstallation.

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Figure 28. TX7316EVM GUI Install (Finished)

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Appendix B
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TX7316EVM GUI Features
B.1

Overview of the TX7316EVM GUI Features
This section provides a quick overview of the features and functions of the TX7316EVM GUI. The GUI
allows the user to easily configure the various functions of the transmitter such as Pulser drive strength,
output waveform and so on.
Operations in the GUI should only be performed after the status at the bottom left-hand corner of the GUI
reads Idle.
Furthermore, hovering over a control within any of the GUI sub-tabs displays the function of that control
along with the register fields updated using that control. For example, as shown in Figure 29, in the Quick
Setup tab, if you hoover over DUT HW RESET button, a light yellow box, describing the function of DUT
HW RESET button is displayed.

Figure 29. TX7316EVM GUI
The 4 main tabs, their sub-tabs and fields are as follows:• Quick Setup– Reset and Initialize the device• DUT HW Reset• Reset Memory to 0
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•

•

•
B.1.1

– B Mode• Internal Pattern Generator• TR Switch glitch– CW mode
Device Configuration– General Settings• Reset Device• Device Settings• Pattern Settings• Global Power Settings• Delay Profile Select• CW Mode Settings• Pattern Profile Select– Power Down Settings• Channel Power Down
• TR Switch Control Using Device Pin / Registers
Profile Configuration– Pattern Profile– Delay Profile
Register Map Configuration
Quick Setup Tab

The Quick Setup tab has the following options:
1. Reset and initialize the device using the buttons DUT HW Reset and Reset Memory to 0.
2. Select Transmit mode or TR Switch glitch mode using the B Mode check-box menus.
3. Enable or disable CW mode using CW Mode enable checkbox.

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Figure 30. TX7316 Quick Setup Tab

B.1.2

Device Configuration Tab
This tab contains two sub-tabs: General Settings and Power Down Settings

B.1.2.1

General Settings

The General Settings sub-tab has the following options:
1. Reset the device using the Software Reset button.
2. Enable TX_BF_MODE, set the clock division factor and select the pattern invert for on-chip
beamforming using the options under PATTERN SETTING field.
3. Select the global power settings using the check boxes under GLOBAL POWER SETTINGS field.
4. Select and configure Delay and pattern profile using the options under DELAY PROFILE SELECT and
PATTERN PROFILE SELECT fields, respectively.
5. Enable and configure CW mode using the check boxes and options listed under CW MODE
SETTINGS field.
6. Configure the TR switch delay mode and delay value using the options under TR SWITCH field.

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Figure 31. Device Configuration - General Setting

B.1.2.2

Power Down Settings

The Power Down Settings sub-tab for the TX7316 has the following options:
1. Power down individual channels using CHANNEL POWER DOWN options.
2. Power down individual TR switch using T/R SWITCH CONTROL USING DEVICE PIN/REGISTERS.

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Figure 32. Device Configuration - Power Down Setting

B.1.3

Profile Configuration Tab
This tab contains two sub-tabs: Pattern Profile and Delay Profile.

B.1.3.1

Pattern Profile

The Pattern Profile sub-tab for the TX7316 has the following options:
1. Program the pattern profile of the device without caring about the exact register values.
2. Select the profile number and number of transition needed in the final waveform using the options
under PATTERN PROFILE CONFIGURATION field.
3. Set the required level and period for each transition in the table. You can verify the waveform in the
GUI plot.
4. Set the repeat and tail counts using the options under COMMON PATTERN SETTINGS field.
5. After all the settings are complete, you can use Write to Device button to configure the selected profileof the device.

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Figure 33. Profile Configuration - Pattern Profile

B.1.3.2

Delay Profile

The Delay Profile sub-tab for the TX7316 has the following options:
1. Select the delay profile using the PROFILE NUMBER field.
2. Enter the individual channel delay using the field listed under DELAY PROFILE field.

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Figure 34. Profile Configuration - Delay Profile

B.1.4

Register Map Configuration Tab
The Register Map Configuration tab is a used to write and read specific registers using the SPI. The tab
contains multiple fields that allow you to configure the register map, select the update modes, and also to
update register values.
The Register Map Configuration tab has the following fields:
1. Register Map: Displays the details of all registers in the device such as the register name, address,
default value, etc.
2. Field View: Displays the field names and field values of the register selected in the Register Map field.
3. Register Description: Describes the functions and the settings of the register selected in the Register
Map field.
4. Update Mode: Allows you to update the contents of the registers in Immediate mode or Deferred
mode.

B.1.4.1

Register Map Setting

Clicking on a register name gives a list of the fields within that specific register. Clicking on a field namehighlights the bits within the register that correspond to that field. In Figure 35, Register 12 has been
clicked. All the fields within Register 12 come up in the Field View on the right-hand side of the GUI.

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Figure 35. Register Map Configuration – Field View

B.1.4.2

Update Modes

You can make register updates using the two options listed in the Update Mode drop-down, as shown in
Figure 36: (a) Immediate and (b) Deferred.

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Figure 36. Register Map Configuration – Update Mode
1. Immediate: The Immediate update mode allows user to change the values of any number of bits orfields within the registers, and these changes are immediately written to the device. When using
Immediate update mode, there are three options such as:a. Read Selected: Use this option to read from a selected register. In order to select a particularregister, click on any register under Register Name and then use Read Selected button to readfrom the selected register. The Address field displays the address of the selected register, and theValue field displays the value contained in that register as shown in Figure 36.
b. Write Selected: Use this option to write to a selected register. In order to select a particularregister, click on any register under Register Name and then use Write Selected button to write to
the selected register.
c. Read All: Use this option to read data from all the registers in the device. This option lets user read
all the registers irrespective of which register is selected in the Register Map field.

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Figure 37. Register Map Configuration – Update Mode (Immediate)
2. The Deferred update mode allows user to change the values of any the of bits or fields within theregisters, but these changes are not written to the device instantly. When a user changes the contents
of a register in Deferred mode, the GUI turns the changed register font a blue color. These blue-fontregisters indicate that a change has been made but not yet implemented. Note that unless the changes
are implemented, data cannot be read from the registers either. When using Deferred update mode,
there are three options such as:a. Read Selected: Use this option to read from a selected register. In order to select a particularregister, click on any register under Register Name and then use Read Selected button to readfrom the selected register. The Address field displays the address of the selected register, and theValue field displays the value contained in that register as shown in Figure 38
b. Write Selected: Use this option to write the for a selected register. In order to select a particularregister, click on any register under Register Name and then use Write Selected button to write to
the selected register.
c. Write Modified: If you have made changes to multiple registers in the register map, this option
allows user to write the changes within all modified registers to the device. After all changes are
written, there are no longer any blue-font registers, indicating that all the changes are
implemented.
d. Read All: Use this option to read data from all the registers in the device. This option lets you read
all the registers irrespective of which register is selected in the Register Map field.
NOTE: If any registers contains modified values that are not yet written, none of the Read options
can be used. User is prompted to either write the modified fields to the device or to discard
the changes.

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Figure 38. Register Map Configuration – Update Mode (Deferred)

B.1.4.3

Changing Register Values

As shown in Figure 39, user can use the Field View menu options to write to or to change the existingvalue in a register. After selecting the register in the Register Map field, use the Field Value drop-down tolist the available options for the corresponding entry in the Field Name. User can select the desired option
to write to or change and the change shows up in the register map. The value for a specific bit can also bechanged by clicking on the corresponding bit in the register map.

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Figure 39. Register Map Configuration – Changing Register ValueSBOU224A – March 2019 – Revised May 2019
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Appendix C
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Testing the EVM in 3-Level Mode
The TX7316 EVM can be reconfigured to be used in the 3-level mode of the device. Table 1 lists the
hardware changes required to configure the EVM to 3-level mode.
Table 1. Hardware changes to configure EVM to 3-level mode
Components to be
removedPurpose
Short A and B supply

C.1

Components to be added

Part number to be used

Value

R1, R4

ERJ-2GE0R00X

0Ω

LVL_3Z_5 change

R22

R23

ERJ-2GE0R00X

0Ω

Removing the TX shorts andplacing loads on B side

R66, R67, R78, R79, R91,
R92, R104, R105

R61, R64, R73, R76, R85,
R88, R99, R102

ERJ-2GE0R00X

0Ω
50 Ω

R31, R32, R33, R34, R35,
R128, R129, R130

R44, R46, R48, R50, R52,
R54, R57, R59

FC0402E50R0BST1

Removing the RX shorts andplacing loads on B side

C67, C69, C71, C73, C75,
C77, C79, C81

GRM1555C1E200JA01D

20 pF

Testing the EVM
1. Power Supply: Ensure that the power supplies are turned off before connecting to the board. Apply ±5
V to connector J3 (set the current limit of both the supplies to 200 mA). Apply ±100 V to connecter J1(supply can be any value between ±1.5 to ±100 V) and set the current limit to 30 mA.
2. Hardware reset: Press switch S1 to hardware reset the device. After hardware reset, the CPLD on
board starts emitting 1-kHz TR_BF_SYNC and TR_EN signals.

36

Testing the EVM in 3-Level Mode

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Figure 40. Connectors and Switches of the EVM
3. Off-chip beamforming: To enable the off-chip beamforming mode of the device, press switch S2. The
switch triggers the CPLD on the board to start sending the input control signals required by the device.
After the switch is pressed, the device starts emitting pattern. Trigger the oscilloscope by probing pin 2of J7 connector (TR_BF_SYNC). Outputs can be observed on pins 3 to 18 of J7 connector. The output
pattern can be inverted by pressing switch S3.

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Testing the EVM

Voltage (50 V/div)

www.ti.com

Time (200 ns/div)

Frequency = 5 MHz; Peak-to-Peak = 196.5 mV, Rise Time = 20.8 ns; Fall Time = 21 ns

Voltage (50 V/div)

Figure 41. Output Pattern When Switch S2 is Pressed

Time (200 ns/div)

Frequency = 5 MHz; Peak to peak = 196.6 mV, Rise Time = 20.8 ns; Fall Time = 20.8 ns
Figure 42. Output Pattern When Switch S3 (invert) is Pressed
4. On-chip beamforming: To check on-chip functionality, first ensure that the power supplies are
powered off. Then, connect the USB cable to the board and open the GUI. Select 3-level mode in the
Select a Device Mode pop-up window(See Figure 43). Turn on the power supplies once the GUI is
loaded. Click DUT HW Reset button on the Quick Setup page (See Figure 44) to hardware reset thedevice and then click Reset Memory to 0 button to initialize the memory.

38

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Figure 43. Select a Device Mode Pop-up Window

Figure 44. Quick Setup Page

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Voltage (50 V/div)a. Testing the B mode of device:i. Pulser output of the device can be checked for the following two cases.
1. Internal: 1 MHz, 4 pulses
2. Internal: 5 MHz, 5 pulses
These modes can be enabled by selecting the respective mode in the Quick Setup tab of
the GUI. The CPLD on board generates the TR_BF_SYNC and TR_EN (1-kHz pulse
repetition frequency) control signals for the device. Trigger the oscilloscope by probing pin
2 of J7 connector (TR_BF_SYNC). Pulser outputs can be observed on pins 3 to 18 of J7
connector.

Time (1 µs/div)

Frequency = 1 MHz; Peak-to-Peak = 196 V, Rise Time = 21.9 ns; Fall Time = 21.9 ns

Voltage (50 V/div)

Figure 45. Internal: 1 MHz, 4 Pulses

Time (200 ns/div)

Frequency = 5 MHz; Peak-to-Peak = 195.5 V, Rise Time = 22.5 ns; Fall Time = 21.8 ns
Figure 46. Internal: 5 MHz, 5 Pulses

40

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Voltage (20 mV/div)ii. TW switch glitch can be checked by enabling the TRSW glitch mode on the quick setup tab.
Trigger the oscilloscope by probing pin 2 of J7 connector (TR_BF_SYNC). TRSW glitch can beobserved on pins 3 to 18 of J5 connector (labelled as RX_IN).

Time (1 µs/div)

Peak-to-Peak = 40.8 mV

Voltage (20 mV/div)

Figure 47. TR Switch On Glitch

Time (1 µs/div)

Peak-to-Peak = 59.3 mV
Figure 48. TR Switch Off Glitch
b. Testing the CW mode of the device:i. To check the CW mode of the device, reduce the ±100-V supply (connected to J1 connector)
to ±5 V. Current limit of all ±5-V supplies must be increased to 500 mA. The CW mode of thedevice can be enabled by clicking CW mode enable on the GUI (clicking on this mode gives a
pop-up warning asking the user to ensure that the supply voltage is ±5 V as shown in
Figure 49; Click Continue button after reducing the supply voltage). Trigger the oscilloscope by
probing pin 2 of J7 connector (TR_BF_SYNC). Pulser CW outputs can be observed on pins 3
to 18 of J7 connector.

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Voltage (2 V/div)

Figure 49. Pop-up Warning Given by the GUI When the CW Mode is Selected

Time (200 ns/div)

Frequency = 3.125 MHz; Peak to peak = 8.57 V, Rise Time = 12.0 ns; Fall Time = 12.5 ns
Figure 50. CW-mode output of the device

42

Testing the EVM in 3-Level Mode

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Appendix D
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Hardware Reference
D.1

TX7316EVM Hardware Overview
Figure 51 shows an overview of the EVM hardware

Figure 51. EVM Hardware Block Diagram

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TX7316EVM Testpoints

D.2

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TX7316EVM Testpoints
Table 2 lists the test points present on TX7316EVM.
Table 2. TX7316EVM Test Points

44

TEST POINT

CIRCUITLABELTEST-POINT DESCRIPTION

TP1Power supplies

V_1P8

1.8-V LDO output

TP2

Power supplies

V_3P3

3.3-V LDO output

TP3

Power supplies

V_2P5

2.5-V LDO output

TP4

Power supplies

VDDP_LV5+5-V supply input

TP5Power supplies

VDDM_LV5–5-V supply input

TP6-13

Power supplies

GND

Ground test points

TP14

DeviceSEN

SPI enable signal

TP15

DeviceReset_0

Reset signal from USB port

TP16

DeviceSDATA

SPI data signal

TP17

DeviceSCLK

SPI clock signal

TP18

CPLD

SYNC_TP

Sync signal generated by CPLD

TP19

DeviceBF_CLK_CMOS

Beamformer clock

TP20

CPLD

TR_EN1

TREN signal generated by CPLD

TP21

CPLD

CPLD_CLK

Clock given to CPLD

TP22

Device

BIAS_2P5

Internal bandgap voltage

Hardware Reference

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TX7316EVM Schematics

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D.3

TX7316EVM Schematics
Figure 52 through Figure 59 show the EVM schematics.

Figure 52. TX7316EVM Schematic 1 of 8

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TX7316EVM Schematics

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Figure 53. TX7316EVM Schematic 2 of 8

46

Hardware Reference

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Figure 54. TX7316EVM Schematic 3 of 8

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TX7316EVM Schematics

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Figure 55. TX7316EVM Schematic 4 of 848

Hardware Reference

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Figure 56. TX7316EVM Schematic 5 of 8

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TX7316EVM Schematics

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Figure 57. TX7316EVM Schematic 6 of 8

50

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Figure 58. TX7316EVM Schematic 7 of 8

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TX7316EVM Schematics

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Figure 59. TX7316EVM Schematic 8 of 8

52

Hardware Reference

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TX7316EVM Bill of Materials

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D.4

TX7316EVM Bill of Materials
Table 3. Bill of Materials (1)Designator

Qty

Value

Description

Package
Reference

Manufacturer

!PCB1

1

MHR054Any

C1, C3, C5, C7

4

10uF

CAP, AL, 10 uF, 200 V, ±20%,
TH

RCAP_8x11.5m
m

200LLE10MEFC8X11.5

Rubycon

C2, C4, C6, C8

4

0.1uF

CAP, CERM, 0.1 uF, 200 V,±10%, X7R, 1206

1206

C1206C104K2RACTU

Kemet

C9, C20

2

10uF

CAP, AL, 10 uF, 35 V, ± 20%,
0.7 Ω, AEC-Q200 Grade 2,SMD

SMT Radial C

EEE-FK1V100R

Panasonic

C10, C14, C16,
C18, C21, C119

6

0.1uF

CAP, CERM, 0.1 uF, 16 V, ±10%, X7R, 0402

0402

0402YC104KAT2A

AVX

C11, C12, C13

3

4.7pF

CAP, CERM, 4.7 pF, 50 V, ±2%, C0G/NP0, 0402

0402

GJM1555C1H4R7BB01D

MuRataC15, C17, C19

3

4.7uF

CAP, CERM, 4.7 uF, 25 V, ±10%, X5R, 0805

0805

C0805C475K3PACTU

Kemet

C22, C23, C24,
C25, C26, C27,
C28, C29, C30,
C31, C32, C33,
C34, C35, C36,
C37

16

0.22uF

CAP, CERM, 0.22 µF, 10 V,±
10%, X7R, AEC-Q200 Grade1, 04020402

LMK105B7224KVHF

Taiyo Yuden

C38, C39, C40,
C41, C42, C43,
C44, C45, C54,
C55, C56, C57,
C58, C59, C60,
C61

16

0.1uF

CAP, CERM, 0.1 uF, 250 V,±
20%, X7T, 0805

0805

C2012X7T2E104M125AE

TDK

C46, C47, C48,
C49, C50, C51,
C52, C53, C62,
C63, C64, C65,
C99, C100,
C103, C104,
C105, C106,
C107, C108,
C109, C110,
C111, C112,
C113, C114,
C115, C116,
C117, C118,
C121, C122,
C123, C127,
C128

35

0.1uF

CAP, CERM, 0.1 µF, 10 V,±
10%, X7R, 0402

0402

C0402C104K8RACTU

Kemet

C66, C68, C70,
C72, C74, C76,
C78, C80

820pF

CAP, CERM, 20 pF, 50 V, ±5%, C0G/NP0, 0402

0402

C0402C200J5GACTU

Kemet

C82, C83, C84,
C85, C86, C87,
C88, C89, C91,
C92, C93, C94,
C95, C96, C97,
C98

16

220pF

CAP, CERM, 220 pF, 250 V, ±5%, C0G/NP0, 0603

0603

C1608C0G2E221J080AA

TDK

C101, C102

2

47pF

CAP, CERM, 47 pF, 50 V, ±5%, C0G/NP0, 0402

0402

885012005044

Wurth
Elektronik

C120

1

0.47uF

CAP, CERM, 0.47 uF, 6.3 V, ±10%, X5R, 0402

0402

04026D474KAT2A

AVX

C124, C125

20.01uF

CAP, CERM, 0.01 µF, 16 V,±
10%, X7R, 0402

0402

C0402C103K4RACTU

Kemet

(1)

Printed Circuit Board

Part Number

Unless otherwise noted in the Alternate Part Number or Alternate Manufacturer columns, all parts may be substituted withequivalents.

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TX7316EVM Bill of Materials

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Table 3. Bill of Materials (1) (continued)

54

Package
Reference

Part Number

Manufacturer

CAP, CERM, 10 µF, 6.3 V,±
20%, X5R, 0402

0402

GRM155R60J106ME47D

MuRata110V

Diode, Zener, 110 V, 200 mW,
SOD-323F

SOD-323FUDZLVTE-17110

Rohm

2

6V

Diode, Zener, 6 V, 500 mW,
SOD-123

SOD-123

MMSZ5233B-7-F

Diodes Inc.

D9, D10, D11,
D12, D135Red

LED, Red, SMD

2x1.25mm

CMD17-21SRC/TR8

VisualCommunications Company,
LLC

FB1

1

120 Ω

Ferrite Bead, 120 Ω @ 100
MHz, 3 A, 0603

0603

BLM18SG121TN1D

MuRataH1, H2, H3, H4

4Machine Screw, Round, #4-40
x 1/4, Nylon, Philips panhead

Screw

NY PMS 440 0025 PH

B&F FastenerSupplyH5, H6, H7, H8

4Standoff, Hex, 0.5"L #4-40
Nylon

Standoff

1902C

Keystone

J1, J2, J3

3Terminal Block, 3x1, 2.54 mm,
TH

Terminal Block,
3x1, 2.54 mm,
TH1725669

Phoenix
Contact

J4, J6, J8, J10

4

SMA Straight Jack, Gold, 50 Ω,TH

SMA Straight
Jack, TH901-144-8RFX

Amphenol RF

J5, J7

2

Receptacle, 100mil, 10x2,
Gold, TH

10x2 Receptacle

PPPC102LFBN-RC

Sullins
Connector
Solutions

J9

1

Connector, Receptacle, USB mini AB, R/A, SMD

Receptacle, 5Leads, Body
9.9x9mm, R/A

67803-8020

Molex

J11

1

Header, 2.54mm, 5x2, Gold,
Black, TH

Header,2.54mm, 5x2,
TH

TSW-105-07-F-D

Samtec

R2, R3, R5, R6

4

100k

RES, 100 k, 0.1%, 0.25 W,
AEC-Q200 Grade 1, 1206

1206

TNPW1206100KBEEA

Vishay-Dale

R7

1

5.1k

RES, 5.1 k, 5%, 0.063 W,
AEC-Q200 Grade 0, 0402

0402

CRCW04025K10JNEDVishay-Dale

R8

1

18k

RES, 18 k, 5%, 0.063 W, AECQ200 Grade 0, 0402

0402

CRCW040218K0JNEDVishay-Dale

R9

1

11k

RES, 11 k, 5%, 0.063 W, AECQ200 Grade 0, 0402

0402

CRCW040211K0JNEDVishay-Dale

R10, R11, R12,
R126, R127

5

10.0k

RES, 10.0 k, 1%, 0.2 W, AECQ200 Grade 0, 0402

0402

ERJPA2F1002X

Panasonic

R13, R110

2

1.0k

RES, 1.0 k, 5%, 0.063 W,
AEC-Q200 Grade 0, 0402

0402

CRCW04021K00JNEDVishay-Dale

R14, R15, R21

3

499

RES, 499, 1%, 0.063 W, AECQ200 Grade 0, 0402

0402

CRCW0402499RFKED

Vishay-Dale

R16, R17, R22,
R25, R26, R67

6

RES, 0, 5%, 0.1 W, AEC-Q200
Grade 0, 0402

0402

ERJ-2GE0R00X

Panasonic

R18, R19, R112,
R113, R115,
R120

6

100

RES, 100, 5%, 0.063 W, AECQ200 Grade 0, 0402

0402

CRCW0402100RJNEDVishay-Dale

R24, R28, R43,
R45, R47, R49,
R51, R53, R56,
R58

10

49.9

RES, 49.9, 1%, 0.063 W, 0402

0402

RC0402FR-0749R9L

Yageo America

R27

1

100

RES, 100, 1%, 0.063 W, AECQ200 Grade 0, 0402

0402

CRCW0402100RFKED

Vishay-Dale

R30

1

22k

RES, 22 k, 5%, 0.063 W, AECQ200 Grade 0, 0402

0402

CRCW040222K0JNEDVishay-Dale

Designator

Qty

Value

Description

C126

1

10uF

D1, D2, D3, D4,
D5, D6

6

D7, D8Hardware Reference

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Table 3. Bill of Materials (1) (continued)
Package
Reference

Part Number

Manufacturer

RES, 0, 5%, 0.1 W, AEC-Q200
Grade 0, 0402

0402

ERJ-2GE0R00X

Panasonic

49.9

RES, 49.9, 0.1%, 0.1 W, AECQ200 Grade 1, 0603

0603

TNPW060349R9BEEA

Vishay-Dale

16

1.02k

RES, 1.02 k, 1%, 0.25 W,
AEC-Q200 Grade 0, 1206

1206

CRCW12061K02FKEA

Vishay-Dale

R122, R123

2

56.2k

RES, 56.2 k, 1%, 0.063 W,
AEC-Q200 Grade 0, 0402

0402

CRCW040256K2FKED

Vishay-Dale

S1, S2, S3

3

Switch, SPST-NO, Off-Mom,
0.05 A, 12 VDC, SMD

6x3.5mm

EVQ-5PN04K

Panasonic

TP1, TP2, TP3,
TP4, TP5, TP22,
TP23

7

Test Point, Miniature, Red, TH

Red Miniature
Testpoint

5000

Keystone

TP6, TP7

2

Test Point, Miniature, Black,
TH

Black Miniature
Testpoint

5001

Keystone

U1, U2, U3

3

Single Output High PSRR
LDO, 200 mA, Adjustable 1.2
to 6.5 V Output, 2.7 to 6.5 V
Input, with Low IQ, 5-pin SOT(DDC), -40 to 85 degC, Green(RoHS & no Sb/Br)

DDC0005A

TPS79901DDCR

Texas
Instruments

U4

1

3-Level, 16-Channel or 5Level, 8-Channel Transmitterwith 2A Pulser, T/R Switch andIntegrated Transmit BeamFormer, ZCX0216A (BGA-216)

ZCX0216A

TX7316ZCX

Texas
Instruments

U5, U102

2 Gbps LVDS/LVPECL/CML to
LVDS
Buffer/Repeater/Translator,
DGK0008A (VSSOP-8)

DGK0008A

SN65LVDS100DGKR or
SN65LVDS100DGK

Texas
Instruments

U6

1High-Speed, Low-Power,
Robust EMC Quad-Channel
Digital Isolator, DW0016B(SOIC-16)

DW0016B

ISO7741DWR or
ISO7741DW

Texas
Instruments

U7

1

USB FIFO IC, 28SSOP

SSOP28

FT245RL

FTDI

U8

1

High-Speed, Low-Power,
Robust EMC Quad-Channel
Digital Isolator, DW0016B(SOIC-16)

DW0016B

ISO7740FDWR or
ISO7740FDW

Texas
Instruments

U9

1

IC CPLD 440MC, TQFP-100

14x14mm

5M570ZT100A5N

AlteraU11

1Single LVDS Receiver,
DBV0005A (SOT-23-5)

DBV0005A

SN65LVDT2DBVR or
SN65LVDT2DBVT

Texas
Instruments

Designator

Qty

Value

Description

R31, R32, R33,
R34, R35, R37,
R60, R62, R63,
R65, R66, R72,
R74, R75, R77,
R78, R79, R84,
R86, R87, R89,
R91, R92, R98,
R100, R101,
R103, R104,
R105, R116,
R117, R118,
R119, R125,
R128, R129,
R130

37

0

R36, R97, R111

3

R68, R69, R70,
R71, R80, R81,
R82, R83, R93,
R94, R95, R96,
R106, R107,
R108, R109

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Table 3. Bill of Materials (1) (continued)

56

Package
Reference

Part Number

Manufacturer

Single Positive-Edge-Triggered
D-Type Flip-Flop With Clear
and Preset, RSE0008A(UQFN-8)

RSE0008A

SN74LVC1G74RSER

Texas
Instruments

Crystal Oscillator, 200 MHz,
LVDS, 2.5 to 3.3 V, SMD

3.2x2.5mm

SG3225VAN
200.000000M-KEGA3

Epson

20pF

CAP, CERM, 20 pF, 50 V, ±5%, C0G/NP0, 0402

0402

C0402C200J5GACTU

Kemet

5pF

CAP, CERM, 5 pF, 100 V, ±5%, C0G/NP0, 0603

0603

GRM1885C2A5R0CA01D

MuRata0

Fiducial mark. There is nothing
to buy or mount.

N/A

N/A

N/A

R1, R4, R20,
R23, R29, R38,
R41

0

RES, 0, 5%, 0.1 W, AEC-Q200
Grade 0, 0402

0402

ERJ-2GE0R00X

Panasonic

R40, R61, R64,
R73, R76, R85,
R88, R99, R102,
R114, R121,
R124

0

0

RES, 0, 5%, 0.1 W, AEC-Q200
Grade 0, 0402

0402

ERJ-2GE0R00X

Panasonic

R44, R46, R48,
R50, R52, R54,
R57, R59

0

49.9

RES, 49.9, 1%, 0.063 W, 0402

0402

RC0402FR-0749R9L

Yageo America

R55

0

49.9

RES, 49.9, 0.1%, 0.1 W, AECQ200 Grade 1, 0603

0603

TNPW060349R9BEEA

Vishay-Dale

R90

0

1.02k

RES, 1.02 k, 1%, 0.25 W,
AEC-Q200 Grade 0, 1206

1206

CRCW12061K02FKEA

Vishay-Dale

TP8, TP90

Test Point, Miniature, Black,
TH

Black Miniature
Testpoint

5001

Keystone

Designator

Qty

U12, U13

2

Y1

1

C67, C69, C71,
C73, C75, C77,
C79, C81

0

C90

0

FID1, FID2,
FID3, FID4,
FID5, FID6

Value

Description

Hardware Reference

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Appendix E
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Measurement Techniques and Troubleshooting
E.1

Measurement Techniques
The following sub-sections describe the measurement techniques to be used while testing the device.

E.1.1

Rise and Fall Times
Rise and fall times of the device must be measured from 10% to 90% of the peak to peak output voltage.
For example, for a ±100-V output swing, the thresholds used for the measurement must be ±80 V.

E.1.2

Linearity
Linearity is a very important parameter of the device; it can be measured by following these steps:
1. Configure the device in the required output pattern.
2. Capture the device output on the oscilloscope by triggering TR_BF_SYNC signal (pin 2 of J6
connector).
3. Invert the output pattern.
4. Again capture the device output on the oscilloscope by triggering TR_BF_SYNC signal.
5. Post process the data for pulse cancellation and take the FFT to check the linearity.

E.2

Troubleshooting
The following steps describe the ways to debug, if the EVM does not perform as expected.
1. Power supplies: Check all the power supplies and LDO voltages at their test point (See Table 2) andensure they are as expected.
2. Clock: Check the BF_CLK_CMOS test point and ensure that 200-MHz clock is present.
3. CPLD: Check the SYNC_TP test point and ensure that 1-kHz signal is present.
4. Thermal shutdown: If the temperature of the device exceeds 110°C, device enters thermal shutdown,
and the device functionality is disabled. TSHUT pin of the device is pulled low when this happens. Thispin is connected to LED D12, and this LED glows if the device enters thermal shutdown. Reset thedevice to bring it out of thermal shutdown.

SBOU224A – March 2019 – Revised May 2019
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Measurement Techniques and Troubleshooting
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57

Revision History

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Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
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Deleted Warning. .......................................................................................................................... 5
Changed the position of list of Items. ................................................................................................... 6
Changed GUI Software Installation section. ........................................................................................... 6
Changed USB Interface to PC section. ................................................................................................ 8
Changed Testing the EVM section. ..................................................................................................... 8
Deleted IN and TR_EN control signals from Off-chip beamforming. ............................................................... 9
Changed Select a Device Pop-up Window figure. .................................................................................. 11
Changed from Pulsar to Pulser across the document. ............................................................................. 11
Changed Pop-up Warning Given by the GUI When the CW Mode is Selected figure. ......................................... 13
Added Appendix C section.............................................................................................................. 36

Revision History

SBOU224A – March 2019 – Revised May 2019
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