Thoughts on the New Year .....1
MMC Activities...................2
Study, Research and Dissemination Activities ..3
Project Update ...................4
Column............................5
Overseas Trends.................6
Member’s Profiles ..............8

Thoughts on the New YearAs we greet the year 2009, I would like to wish everyone a Happy New Year, and to share somethoughts at the beginning of this new year.
The past year was a turbulent one for the Japanese economy. Increases in the price of crude oil andrare materials, which had been a concern for the past few years, continued apace. This put pressure oncompany operations and people’s daily lives, and highlighted the all too well known fragility of theindustrial infrastructure and lifeline of Japan, a country with a dearth of energy resources and raw
materials. Then financial instability on a worldwide scale occurred, caused by the long-feared collapseof subprime loans in the United States. The resulting turbulence seems unlikely to be resolved easily.
Viewing these trends, what I feel anew is the peril posed by an economy that is not tethered to reality.
As an industry, Japan must have creative products with an appeal unrivaled by those of othercountries, constituting an economic foundation that is based on actual circumstances.
Tamotsu Nomakuchi
The Micromachine Center (MMC) conducts a variety of activities aimed at establishing key
technologies relating to micromachines, MEMS and other micro/nano fields and providing support for
Director,
the continued growth of the MEMS industry, as well as strengthening the international competitivenessMicromachine Centerof Japan’s domestic industry and contributing to the creation of the abundant society of the future.
The activities of the Micromachine Center during the past year as noted in the“Topics” section begin with the Project to Develop Next-generation Device
Manufacturing Technologies that Fuse Different Fields, otherwise known as the Bio
Electro-mechanical Autonomous Nano Systems (BEANS) Project. This major
project is being conducted for the next five years through collaboration amongindustry, academia and government, with the goal of developing the technicalinfrastructure needed to create third generation MEMS devices. 18 companies, 12
universities, two research institutes and three other organizations are participatingin the promotion of this project. An unprecedented research management
organization has been established with “integration” and “openness” as its
watchwords, in order to achieve what the Ministry of Economy, Trade and Industry
calls an “Innovation Superhighway.” In addition to future application fields, third
generation MEMS devices are expected to find applications in a wide range of fields including the environment and energy, safety andsecurity, and health and medical care. Third generation MEMS are expected to raise the level of the market and achieve market
expansion through the creation of new devices that will support a multitude of industrial fields in Japan.
This year’s annual combined exhibition, MicroNano 2008, was held July 29 to August 1 at Tokyo Big Sight. As in the case of last year’s
exhibition, the event attracted record attendance (14,000 attendees, a 13% increase over the previous year). This provides additional
evidence of the tremendous interest in this field from various sectors.
With regard to activities to promote standardization in the MEMS field, Working Group 4 (WG4) of Technical Committee 47 (TC47,
semiconductor devices) of the International Electrotechnical Commission (IEC), the organization charged with reviewing the issue of
MEMS standardization, was upgraded to a subcommittee (SC47F) last June, and Japan became the organizing country. This increased
the latitude for MEMS standardization activities at the IEC and established a climate that is expected to stimulate activity in this area.
Japan’s becoming the organizing country establishes the foundation that will enable the promotion of Japanese-led international
standardization activities.
In terms of public relations, a new MEMS Mall has been opened on the Micromachine Center’s website. The MEMS Mall introduces
activities by various companies in the micromachine and MEMS fields as well as new products and technologies, and is designed to help
stimulate business in these fields.
In addition to the examples noted above, the Micromachine Center has promoted a variety of successful projects. I would like toexpress my appreciation for your constant effort, cooperation and support, without which these achievements would not have beenpossible.
The Micromachine Center will continue to promote projects aimed at the establishment of key technologies and industries in the
micromachine and MEMS field. I hope we can count on your continued understanding and support, and I hope that this year will be a
rewarding one for you all.

Internet Home Page : http://www.mmc.or.jp/

MMC Activities

Activities of MEMS Foundry Service
Fumihiko Sato, Omron Corporation / Chair, MEMS Foundry Service Industry Committee, MEMS Industry Forum(1) Operating MEMS foundry service network

1. Introduction
Micro Electro Mechanical Systems (MEMS) are
expected to grow to become a market rivaled in size
only by the markets for flat panel displays (FPDs) andsemiconductors. In recent years, full-fledged adoptionof these systems in cellular phones and otherconsumer products has begun, and the scale of themarket is growing rapidly. As applications for thesesystems have expanded, the technology has become
increasingly diversified and Time To Market needs
have also increased. As a result, the role of MEMS
foundries in development and manufacture isbecoming increasingly important.
The MEMS Foundry Service Industry Committee
conducts activities to help expand the MEMS
industrial base and increase competitiveness throughthe creation of a foundry network in Japan.

To simplify the process of approaching foundrycompanies for users who want to use MEMS foundries
but do not know where to go to initiate the process, theCommittee has established the MEMStation(http://fsic.mmc.or.jp) as a clearing-house for user
inquiries.
(2) MEMS Seminars and other educational and joint
publicity activities

To support the training of MEMS development
personnel, the Committee plans and holds MEMS
Seminars twice each year. Designed for novice andmidlevel MEMS engineers, these seminars have met witha very favorable response.
(3) Activities to expand the MEMS industrial baseFor many years, foundry companies have usedequipment for manufacturing their own products andexpand their business to users outside the company. As aresult, in many cases the prototyping and mass
production services that they are able to provide arelimited to their own specific processes and materials.
Investment in equipment and the development of custom
processes for each customer require both time andmoney. So, it is not easy for small, medium-sizedcompanies and venture firms to take university MEMS
research achievement to the mass production andpractical application stage.
The MEMS Foundry Service Industry Committee
promotes the following activities in an effort to facilitate
the use of foundries by users and expand the MEMS
industrial base.

2. Activities of the MEMS Foundry Service
Industry Committee
The MEMS Foundry Service Industry Committee
membership comprises 11 companies and organizations
relating to MEMS foundries, each with its own uniquecharacteristics (Fig. 1 and Fig. 2).

1. Expansion of the MEMS foundry network system

The Committee has studied the standard process
recipes that would enable even users with little
experience in or knowledge of MEMS manufacture toeasily manufacture the MEMS they need. These recipes
are ready-made processes that utilize the abundant
manufacturing experience of foundry companies. Using
these recipes for prototyping is expected to make itpossible for customers to save both time and costrequirements.
In the future, the Committee will work to promote
activities to expand the use of these standard process
recipes, and will also study the possibility of setting up
organization or centers for consulting and coordination of
MEMS development activities.

Fig. 1 MEMS Foundry Service Industry Committee Members
Design &Simulation

Testing &Prototyping

Product
Development

Mass
Production

Machining of various types of MEMS through a combination of dry etching,vapor deposition polymerization and dielectric film formation technologies

ULVAC, Inc.
Oki Semiconductor
Co., Ltd.

Silicon process integration MEMS

Omron Corporation

Technologies for creating original dies for various types of MEMS manufacture,primarily for bulk micromachining, as well as proprietary technologies; manufacture of lenses,
fine molds etc. using electroforming mass production technologies

Olympus Corporation

Has a wealth of accumulated knowledge relating to optical MEMS and bioMEMS and offers services
from design to mass production of various types of MEMS using precision bulk micromachining

Hitachi, Ltd.

MEMS processing and through wiring
on wafer level packages, silicon wafers, etc.

Fujikura, Ltd.
Panasonic Electric WorksCo., Ltd.
Mizuho Information &Research Institute, Inc.

Analysis services
Simulator development

UEL Corporation

Design / analysis support
Software development

Mathematical Systems,
Inc.

Simulator and ECAD tool
development and sale

National Institute of Advanced
Industrial Science and Technology (AIST)

2. Cooperative activities with public foundries andregional clusters in various locations

Assistance for research and development,
primarily relating to bulk micromachining

Working with domestic publicly-operated testing
entities, regional clusters and nanofabrication companies
the Committee is setting up an organic foundry network
as a framework for providing support for MEMS project
development and will promote activities aimed at
expanding the MEMS industrial base.

Sensors and actuators (silicon processes) / high-density packaging

MEMS device prototyping
Micronano fabrication(joint research only)

Fig. 2 Service Areas of Member Companies

2Study, Research and Dissemination Activities

Recent Trends in MEMS Standardization
MEMS international standardization will be essential to accelerate design and development, ensure compatibility and quality
and enable mass production. In Japan, the Micromachine Center is playing a leading role in promoting MEMS standardization.
Three international standards proposed by Japan have been published, and one more is currently under consideration. Recently
South Korea has also become actively involved in international standardization activities; so far, one standard proposed bySouth Korea has been published, four are currently under consideration and two have been submitted as proposals.
International standards in the MEMS field have been prepared by Working Group 4 (WG4) of Technical Committee
Meeting No. 47 (TC 47) (semiconductor devices) of the International Electrotechnical Commission (IEC). In October 2007,
Japan proposed that this working group be upgraded to a subcommittee (SC) and offered to serve as secretariat. The statusof activities of WG4 and Japan’s achievements and contributions up to now were evaluated by the other countries, and in
May 2008 the proposal was approved. Nine nations participated as regular members: China, Germany, France, Italy, Japan,
South Korea, the Netherlands, Russia and the United States. The Micromachine Center became the domestic consideration
organization for the new subcommittee, SC47F, and assumed the secretary.
The first international conference for SC47F was held October 28 - 30 at the Mita Kaigisho in Tokyo to coincide with theTC47 conference. The following table shows the status of individual documents, focusing on the content of the discussions
at this conference.
Document

Proposed Proposed By Level

IEC 62047-1;
Terms and definitions

StatusJuly 2002

Japan

IS

Published as an International Standard (IS) in September 2005.
Published as a Japanese Industrial Standard (JIS C 5630-1) in March 2008.

IEC 62047-2;
July 2003
Tensile test method of thin film materials

Japan

IS

Published as an International Standard (IS) in August 2006.
Submitted as a draft Japanese Industrial Standard (JIS) to the Japan Standards Association in July 2008.

IEC 62047-3;
July 2003
Standard test piece for tensile tests

Japan

IS

Published as an International Standard (IS) in August 2006.
Submitted as a draft Japanese Industrial Standard (JIS) to the Japan Standards Association in July 2008.

IEC 62047-4;
Generic specification

July 2004

South
Korea

IS

Published as an International Standard (IS) in August 2008.

IEC 62047-5;
RF MEMS switches

December South
2005
Korea

CD

Following comment and review of the second Committee Draft (CD) by individual
countries, it was decided to prepare a third CD.

IEC 62047-6;
Thin film material fatigue test
methods

May 2006

Japan

CDV

The Committee Draft for Vote (CDV) was approved, and a Final Draft Industrial Standard(FDIS) reflecting the results of comment and review by individual countries was
submitted. Expected to be published as an International Standard in FY 2008.

IEC 62047-7;
FBAR filter

March
2007

South
Korea

CD

A review of the comments from individual countries regarding the Committee Draft (CD)was conducted, and it was decided to prepare a second CD.

IEC 62047-8;
Thin film bending test methods

March
2007

South
Korea

CD

A review of the comments from individual countries regarding the Committee Draft (CD)was conducted, and it was decided to prepare a second CD.

IEC 62047-9;
March
Wafer-to-wafer bonding strength 2007
measuverent

South
Korea

CD

A proposal from Japan to add a 3-point bending test method and a die shear test method to thetest methods in the South Korean proposal was approved, and Japan prepared a draft. At South
Korea's request, it was decided that Japan should also prepare the draft for the blister test.

IEC 62047-10;
Micropillar compression test

August
2008

South
Korea

NP

Currently on the ballot as a "New Work Item Proposal" (NP). Japan voted in favor of the
proposal, attaching a comment regarding the purpose, scope and content of the standard
based on the results of the domestic committee review.

IEC 62047-11;
August
Test methods for MEMS material 2008
coefficient of thermal expansion

South
Korea

NP

Currently on the ballot as a "New Work Item Proposal" (NP). During the committee meeting, Japan expressedthe view that consideration should be given to including other test methods for the coefficient of thermal
expansion in the draft, but the South Korean side wanted these to be proposed separately. Accordingly,
Japan voted in favor of the proposal on the condition that the document be given a narrowly focused title.

In addition, the draft international standards currently being prepared in Japan are shown in the table below. These will
be proposed as “New Work Item Proposals” (NPs) around the end of the development period.
Topic

Notes

Development Period

Thin film material life
acceleration test methods

FY 2006 - FY 2008 Establishes methods for life tests using resonant oscillation that are conducted for tiny mechanicalstructures used for micromachinesStandard materials forcalibration

FY 2006 - FY 2008 Establishes the standard materials used for calibrating weight displacement for the material testers
used to test microstructure materials

MEMS mechanism material
FY 2007 - FY 2008 Establishes methods for testing the strength of bonds between thin films and substrates between thebonding strength test methods
microstructures that will become constituent members
MEMS gyro and electronic
compass

FY 2008 - FY 2010 Defines (in matrix form) the passive and active sensitivity of tiny multi-axial gyros, and defines parameters for
performance requirements and standardizes the methods to represent and measure these parameters. Also
standardizes the properties and user interface (including coordinate system) for hexaxial electronic compasses.

3

Construction of a Fine MEMS Knowledge Database (DB)- Goal: utilization and dissemination as industrial infrastructure The Highly Integrated / Complex MEMS (Fine MEMS)
Manufacturing Technology Development Project is a three-year
project being conducted in FY 2006 - FY 2008. Commissioned
and subsidized by the New Energy and Industrial Technology
Development Organization (NEDO), this project aims toestablish the technology that will enable the manufacture ofhighly integrated and complex MEMS devices that are compact,conserve energy and offer high performance and high reliability.
The Fine MEMS Knowledge Database Construction Project isalso being promoted in connection with this project, with thegoal of organizing the achievements and knowledge gained
through research and development in the Fine MEMS Projectand information regarding international conferences and so on
in database form to provide an environment that can be
employed easily by researchers and engineers working todevelop and manufacture fine MEMS.
To ensure that users are able to use the knowledge
database easily, and to promote ongoing updating of theknowledge data in the database, it is essential to construct anenvironment that allows joint collaboration by multiple users at
the same time and does not require special applications or
knowledge of specialized nomenclature. As shown in Fig. 1, amajor feature of the database system, is the introduction of a
web browser / MediaWiki system – the same type of system as
the Wikipedia free online dictionary – as the infrastructure forachieving this database, enabling data to be viewed and updated
easily by anyone with an Internet connection. The basic

premise of the system design is that, once information has been
disclosed publicly on the Internet, it will be added to theMemsONE knowledge database to enable efficient use anddissemination.
By FY 2007, more than 1000 items of knowledge data had
been registered to the MemsONE database, exceeding thetarget of 1,000 items. The stored data has been organizedaround four MemsONE categories (process, device, material
properties, analysis) using keywords developed in this study.
The knowledge data is also being augmented through theaddition of laid-open patent data and Western patent analysis
references corresponding to development topics. To enable
users to quickly locate the information they need, a full text
search function using a precision Japanese language searchengine and various types of ranking display functions that allow
visualization of the status of the data stored in the database
have been provided. In the remaining six months of thedatabase construction project, efforts have focused on
improving the quality of the registered data, updating patentdata, building a top page for general Web access and creating
terms of use and guidelines, and the work is progressing at afever pitch. The database will be made available on the Internet
at the beginning of FY 2009, and activities to encourage ongoing
improvement of the knowledge data will be conducted to enable
the database to be used as a part of Japan’s industrial
infrastructure.

An environment that can be created jointly by multiple users without the need for special applications
or knowledge of specialized nomenclature

Project achievements

Construction of a database system that users can freely add to and view on the Internet- Use of web browser and MediaWiki system as the infrastructure for the knowledge database- Wiki (collaborative work tool for people viewing the information) Blogs (individual informational exchange tool)

Latest informationfrom academic societies, etc.

To fine MEMS
knowledge database

Typical example of knowledge databasecreated by participants using a Wiki

Wikipedia(free online dictionary)Research & development
members

Wiki enables efficient data editing &accumulation and system construction

Fig. 1 Construction of an Internet-based Shared Collaboration Environment
知識データ入力画面（メインページ）

Accumulation and Organization of Knowledge Data

ファインMEMS分類キーワード
別の入力ランキング
入力データ例- No. of data items registered: 1,078(exceeding the target of 1,000)- Organization of knowledge data using keywords
in four categories(process, device, material properties, analysis)that were developed in this study

キーワード毎の入力ランキング- Includes laid-open patent data and Americanand European patent analysis references corresponding
to development themes / Full text search capability

事例入力初期設定画面

Fig. 2 Overview of Knowledge Database System and Upload Function

4

JP公開・US登録、欧米
PCT特許の分析データ

Column

MEMS in the Future: A Baby Boomer’s Symbiotic Relationship with MEMS
On a clear autumn day in the year 202X, an elderly baby boomer (let’s call him “Mr. A”) went to the nearby
botanical garden with digital camera in hand, intent on taking a seasonal photograph of autumn leaves to post on his
blog (which is entitled “Boomer Avenue”). Not only was strolling around the botanical garden pleasant, the negativeions emitted from the trees made it a healthy “forest bathing” experience. Mr. A had lived this lifestyle for the pastdozen years or so. Perhaps this was the reason that he remained in excellent health despite being almost in latter oldage; he took pride in contributing in some small way to reducing the nation’s overall medical care costs.
During the latter part of his career, Mr. A had been involved in the industrial development of MEMS (miniature
sensors and other electromechanical devices).
Accordingly, in addition to photographs of natural scenery, Mr. A’s blog also featured many posts on industrial
technology relating to MEMS. For the benefit of those who have not read them, here are a few of the interesting posts
on his blog.
(Date: _____)
More than a decade ago, around the beginning of the project to develop thetechnology to manufacture Bio Electro-mechanical Autonomous Nano Systems(BEANS), the MEMS of the future, a financial crisis precipitated by the U. S.
subprime loan debacle spread throughout the entire world in the blink of an eye.
This crisis dealt a major blow not only to the U. S., Great Britain and otherdeveloped countries but also to the economies of newly developing countries that up
to that time had experienced overheated economic growth. It was many years before
the world economy was once again stable.
Although the Japanese economy was of course affected, it did not sustain serious
damage. This was partly due to the fact that it was not the direct epicenter of the financial crisis. But I
feel it was also due to Japan’s outstanding industrial technology such as MEMS. We had learned thelessons from the collapse of the “bubble” economy, and most Japanese companies had conducted soundmanagement that placed great value on technology. The national government, too, had established aroadmap for industrial technology in key technical fields such as MEMS, nanotech materials,
biotechnology and robots, and had provided technical development assistance.
The subsequent course of events demonstrated the strong international competitiveness of Japan’s
manufacturing sector, based on its firm technological footing. The Japanese economy recovered
rapidly, and now other countries once again look to Japan to drive the world economy. As someone who
has been involved in promoting technical development projects and providing assistance forindustrialization in the MEMS field, this makes me very happy.
(Date: _____)The development of MEMS in recent years has been nothing short of remarkable. Great strides havebeen made in the creation of fine MEMS such as various types of sensors and RF-MEMS fortelecommunications. Vehicles, cell phones, information processing equipment and other units are now
chock-full of highly integrated MEMS devices with advanced functions, and they have dramatically
improved the convenience of our daily lives. Products equipped with fine MEMS devices bear a “MEMS
Inside” sticker, and “MEMS Inside” is now a synonym for high performance and high quality.
My trusty digital camera also has a “MEMS Inside” sticker. The lens and other optical systemcomponents of the digital camera are still the same as before. But as soon as the camera is turned
toward an object, all of the outstanding functions – blur prevention, autoface focus, macro photography
and so on – are fully automated through the power of MEMS. This allows me to take one outstanding
photo after another with next to no effort. As a result, even though I am older and not as steady as I used
to be, I can still easily post stunning photographs of the seasons on my blog. This is a blessing beyond
compare.
What’s more, many other products are increasingly incorporating MEMS technology recently. To
reduce energy consumption and environmental load in the product development process, the trend istoward the use of smaller and smaller electronic and mechanical components and three-dimensional IC
chips, and MEMS ultra-fine processing technologies are increasingly being employed in these industrial
fields as well.
Furthermore, the revolutionary BEANS technologies that were developed in the BEANS
manufacturing technology project and are designed to help create the MEMS of the future have been
provided by a patent pool agency administered by the MEMS Industry Forum. I understand thatcompanies in the health and medical care field and various other industries are vying with one
another to adapt BEANS technologies for product development. I can’t wait to see what kind of new
products appear in the months and years ahead. For me, the key thing will be to live as long as possible
so I’ll be around to see them.
After returning from his stroll in the botanical garden, Mr. A felt thoroughly refreshed in both body and spirit by
the two hours of “forest bathing.” But he was also a bit agitated. It was his custom to place his hand and ear against
the trunk of an enormous tree in the botanical garden, in an effort to communicate with the tree. But this time he had
felt as if he could actually hear some kind of message from the tree. Immediately he ordered a MEMS kit from the
MEMS Mall (an online store for MEMS products). The kit was designed to make special recordings and was equippedwith an automatic translation function. Using this kit would enable him to post his conversation with the tree on his
blog. In this way, Mr. A, the boomer, seems likely to continue his symbiotic relationship with MEMS forever.
By Boomer, B

5Overseas Trends

Overseas Mission from Micromachine Center / MEMS Industry Forum
Attends the MEMS Executive Congress and Visits Micro-Nano
Related Venture Firms in Silicon Valley
The MMC/MEMS Industry Forum dispatches overseas missions as one of its international interchange activities. At
the beginning of November, an overseas mission attended the MEMS Executive Congress that was held in Monterey,
California. The group also visited universities and companies in North America, particularly those in Silicon Valley in
the MEMS and nanotech fields, in order to conduct a survey of current trends. The following is an overview of theoverseas mission’s activities.
SDate:
November 2 (Sunday) - 9 (Sunday), 2008
SPurpose: To attend the MEMS Executive Congress in order to ascertain the latest trends in the MEMS field asviewed from a management standpoint and create a network of MEMS industry managers around theworld, and to use the time before and after the Congress to visit micro/nano related companies,
universities and other institutions in Silicon Valley in order to conduct a survey of technical trends andforge business relationships.
SItinerary:
SParticipants:
November 2 (Sunday)
Depart Japan; arrive San Francisco
Omron:
Sato, Takahashi
November 3 - 5 (afternoon) (Monday - Wednesday) Visit relevant organizations(Omron Silicon Valley)
November 5 (evening) - 7 (morning) (Wednesday - Friday)
Panasonic: Okamoto
Attend MIG MEMS Executive Congress
Lintec:NakataNovember 7 (Friday)
Visit relevant organizations
MMC:
AdachiNovember 8 (Saturday) Depart San Francisco
November 9 (Sunday)
Arrive Japan
Map showing North American locations visited

MEMS Executive Congress Dinnerat the Monterey Bay Aquarium
Overseas Mission at SiTime

SMEMS Executive Congress

The MEMS Executive Congress is an annual conference held by the MEMS Industry Group (MIG), a MEMS
Industry Forum overseas affiliate based in Pittsburgh, Pennsylvania. The conference is attended by executives of
MEMS-related firms from around the world.
This year, the MEMS Executive Congress was held at the Monterey Plaza Hotel & Spa in Monterey, California. The
133 Congress attendees included four from Japan:- Mr. Sekiguchi of Omron Corporation, an MIG member firm;- Professor Esashi of Tohoku University (who also served as a panelist);- Mr. Okamoto of Panasonic Electric Works Co., Ltd., one of the participating companies making up the overseas mission; and- Mr. Adachi of the Micromachine Center.
The Congress program included the keynote addresses and panel discussions listed below. One of the mostnoteworthy features of the MEMS Executive Congress seems to be the long lunch and other break times, designed toencourage networking and the exchange of information among attendees.
Keynote Addresses■ Sun Small Programmable Object Technology (Sun SPOTs)
Roger Meike Sun Microsystems Laboratories■ Towards New Paradigms of Sensing, Computing and Communication
Tapani Ryhanen Nokia Research Center
Panel Discussions■ Panel 1 : Convergence of MEMS in Consumer Electronics and Mobile Communications■ Panel 2 : MEMS Inside: Enabling Low Power, Energy Monitoring and Conservation■ Panel 3 : Investments in MEMS Leading to Liquidity Events – A VC Perspective■ Panel 4 : MEMS Emerging Technology Outlook■ Panel 5 : MEMS Market Analysis
Next year’s MEMS Executive Congress will be held November 4 - 6 in Sonoma, California.
SCompany and university visits
The following is an overview of the locations visited in North America.
■Cavendish Kinetics: Venture firm specializing in the development of CMOS-compatible MEMS
The goal of Cavendish Kinetics is to provide memory, sensors and switches using a 100% CMOS-compatible process.
The basic technical concept is to control silicon-to-silicon adhesion and form cantilever structures by means of a CMOS-compatible process,creating memory, sensors and switches solely by changing the mask designs. The company has a business model under which it utilizes SVTC
technologies in a fabless manner and licenses its technology.

6

■Kovio, Inc.: Venture firm specializing in nanoink and printed electronics
Kovio was founded in 2001 by Dr. Jacobson of the MIT Media Lab and has 51 employees. The company obtained USD $23.5 million in Series D
funding; Japanese companies Yasuda Enterprise Development Co., Ltd., Mitsui Ventures, Panasonic Venture Group and Toppan Forms Co.haveinvested in the company. Kovio currently specializes in the development of silicon ink (synthesized using the wet method) and silicon ink printing
technologies used for manufacturing RF-ID tag transistor circuits. The smallest circuit width is 10 µm with mobility of 70 - 80. These circuits havegreater mobility and durability as compared to organic semiconductors.

■Nanochip, Inc.:

Venture firm specializing in cantilever memory development

This fabless startup company, founded in 1996, developed prototype devices based on a concept similar to the Millipede project at the IBM
research lab in Zurich. Nanochip has received funding since 2004. This company introduced the concept of creating memory through the
combination of three layers: a CAP wafer (with a pocket for storing a magnet), a Mover wafer and a CMOS wafer. An electromagnetic system withhigh drive force in the X and Y directions is used to enable displacement of +- 100 µm, and an electrostatic system was adopted due to the low
cantilever displacement of 0.4 µm.

■NanoGram Corporation:

Venture firm specializing in nanoparticle / nanoink and solar cell development

Founded in Silicon Valley in 1996, this venture firm has received funding of USD $68.7 million from Yasuda Enterprise Development Co., Ltd.,
Mitsui Ventures, Inc, Nagase & Co., Ltd., Tokyo Electron Limited and other companies. It has 85 employees and offices in Japan and South Korea.
A core technology of the company is a process through which a precursor is thermally decomposed using a laser beam and condensed into
nanoparticles. Using this technology, NanoGram has generated numerous nanoparticles while maintaining control of particle size and composition.
Currently the company’s primary focus is on developing the technology to form multicrystal silicon foil (SilFoil) directly on substrates using thelaser reaction deposition method, with the aim of producing solar cells. As this method enables large-area film formation in a non-vacuum
environment, the cost is low as compared to conventional multicrystal silicon solar cells. Design of a 5 MW pilot line is currently underway.

■Qualcomm MEMS Technologies, Inc.:

MEMS display development company

Qualcomm MEMS Technologies is a 100% subsidiary of Qualcomm, a company famous for its achievements in 3G CDMA technology. Qualcomm
MEMS Technologies develops and manufactures reflective “IMOD” displays that reflect ambient light and output specific wavelengths. The
principle is to use surface micromachining to form resonant structures that move individual pixels through electrostatic drive, using lightinterference to reflect RGB wavelength light to an external location. A black and white display product developed for use in Chinese cellular
phones is being manufactured in Hsinchu, Taiwan. Development of a full color display for use as the display in MP3 music players is also
progressing, and the initial customers for this product have already been secured. As the device is a reflective one, the screen is easy to see even in
direct sunlight, and no backlight is required. Electrostatically driven hysteresis is used to maintain “off” status at low voltage, so power
consumption is much lower than that of a liquid crystal display. On the other hand, as the screen is dark in indoor locations, a front light is used to
improve visibility.

■Silicon Clocks, Inc.:

Venture firm specializing in Si resonator and MEMS/CMOS integration

Dr. Howe of Stanford University serves as chief scientist for this startup firm. A new CEO has been brought on board to oversee a shift in thebusiness model from the previous emphasis on silicon oscillator product development to the licensing of element IP (“MEMS on CMOS” integration
process, wafer-level vacuum sealing, resonator and other device design, and analog circuit design). Silicon Clocks is currently seeking licensees andhas shown great interest in Japanese firms. The company integrates MEMS resonators on CMOS using LPCVD polysilicon-germanium.

■Silicon Microstructures, Inc.:

MEMS development division (pressure sensors) of the German firm Elmos Semiconductor AG

Founded in 1991, this company has 90 employees and is a specialty manufacturer of piezoresistance type MEMS pressure sensors (10 mbar - 10bar). In 2001, it was acquired by and became a 100% subsidiary of the German firm Elmos Semiconductor AG (a manufacturer of automotiveASIC). Since 2004, Silicon Microstructures has manufactured pressure sensors on 6” lines for automotive use (TPMS, etc.) and for the medical care(blood pressure meters, etc.), industry and consumer markets. Its product line also includes absolute pressure sensors that utilize vacuum sealing.

■SiTime Corporation:

Venture capital firm specializing in Si resonator development

The aim of this company is to create new markets by replacing crystal oscillators with its Si resonators, utilizing their properties of compact size,
low cost, high reliability and CMOS compatibility. The 4” crystal oscillator achieved through joint research between Bosch and Stanford University
professor Tom Kenny were expanded to an 8” process in 2005 by SVTC Technologies in order to shift to mass production. In the latter half of 2006,
the achievements were transferred to Jazz Semiconductor, and a mass production system was put in place in 2007. This year, production of 2.5
million units was achieved. Future goals are to achieve a market shift from crystal oscillators amounting to JPY 1.7 trillion yen, and to develop newmarkets for these devices. The MEMS division has been consigned to Jazz Semiconductor and the CMOS divisions to TSMC, with packaging
conducted through fabrication in Malaysia and Thailand.

■SVTC Technologies, LLC:

8” CMOS/MEMS process development foundryIn the SVTC business model, ideas from users and concept models developed at the university laboratory level are brought in, and customers
dispatch engineers to conduct process development using SVTC facilities (in some cases, the customer provides the equipment needed for processdevelopment). In this way, the company serves as a bridge to mass production. Major benefits include the fact that customers are able to use theprocess recipes accumulated by SVTC and own 100% of the intellectual property relating to the processes they develop. Fabrication is conductedusing the R & D facility of Cypress Semiconductor, and facilities are currently being expanded. This year, SVTC acquired a company with a large
fabrication plant in Texas, and the company also has a third center of operations in south San Jose that is dedicated to the fabrication of solar cells.
Process development is conducted by users or by SVTC based on agreements with users. SVTC also conducts consulting relating to processdevelopment and provides engineering services to meet user needs.

■MEMS research by Berkeley Sensor & Actuator Center (BSAC), University of California at Berkeley
SCase studies of nanotech research at BSAC presented by Dr. Javey- Printable nanowire- Nanocolumn GaAs solar cell
- High-strength adhesion by means of nanowire with polymer coating

SAdvanced MEMS Inc. – Endoscope equipped with MEMS mirror
This startup firm, founded by a U. C. Berkeley post-doctorate researcher, is developing the technology to integrate an electrostaticallydriven MEMS mirror and laser light source at the tip of an endoscope in order to obtain images of areas beneath the surface of the skinusing the light coherence tomography method. Information contained in 2mm2 sectional slices are continually obtained at a resolution of
10µm, making it possible to quickly detect cancer cells that previously were difficult to discover through surface observations.

At the places we visited, the worsening economy resulting from the financial crisis has made it difficult to secure
venture capital, even in Silicon Valley. As a result, some companies were switching from cost-intensive productmanufacture and sale to a business model based on licensing, and some have even been forced to lay off some of theiremployees due to cash flow problems. Yet some companies were still doing well; for example, this year SiTime
shipped 2.5 million MEMS resonators.
With attendance at an international conference and visits to 10 different companies in the space of five days, theoverseas mission had a very busy schedule. However, the companies were located near one another in Silicon Valley,
where MEMS related companies and universities are concentrated, and the weather was good. As a result, the trip
was a resounding success, and the Micromachine Center would like to express its appreciation to those who
participated.
The MEMS Industry Forum plans to dispatch overseas missions in the future as well. If there are any particularregions or companies that you think it would be instructive to visit, please let us know.

7Members’ Profiles

Furukawa Electric Co., Ltd.
1. Business Profile of Furukawa ElectricCo., Ltd.
Founded in 1884 as a manufacturer of electric cables
and nonferrous metals, Furukawa Electric has
accumulated more than a century of expertise in thedevelopment of technologies and products aimed at
reinforcing the foundation of our society and industry.
Today companies in the Furukawa Group are active in suchdiverse industries as telecommunications, automobiles,
energy, electronics, and construction, utilizing thestrengths of a wide range of materials, including light,
metal, and plastic. The following is a description of some ofour signature products in these fields.
One of the core products in telecommunications is the
optical fiber cable, which is indispensable for building
optical communication networks that sustain ouradvanced information society. In 1974 Furukawa Electric
became the first company in the world to successfully
manufacture optical fiber cables. Today we are the world’s
second largest manufacturer of optical fiber cables andglobally provide total solutions for optical parts, opticalcommunication equipment, and optical systems essential
to our optical information-oriented society.
Steering roll connectors, a major product in theautomotive parts industry, function to transmit electric
signals for activating an airbag built into the steering
wheel of an automobile. Furukawa Electric has beendeveloping and manufacturing these connectors for morethan twenty years, bringing the company recognition for
its development capabilities and earning the products
praise for their low cost and reliability. Our connectors areused throughout the world, accounting for the highest
share of the global market.
As China continues to grow, the country has been
plagued with a chronic shortage of electric power.
Furukawa Electric has established production centers in
China for manufacturing ultra-high-voltage power cables
and related components, and optical fiber composite
overhead ground wires in order to supply these products
throughout China. We have received high praise for our
superior manufacturing capability and product quality andare the market leader in ultra-high-voltage power cables.
Furukawa Electric’s signature product in electronicrelated fields is the copper foil. Copper foils are used inprinted wiring boards incorporated in computers, cell
phones, and other communication equipment, collectors
for lithium ion batteries, and electromagnetic interference
shielding materials for plasma displays. From common tosophisticated foils, the company provides high-quality
products backed by more than thirty years experience inproducing electrodeposited copper foils.
By utilizing this wealth of material expertise andexploring the diverse applications, we will always strive to
be a more profitable, innovation-oriented business groupwith a dynamic global presence. We will continue todevelop technologies and products that enrich our society
and offer these products not only in Japan, but also incountries throughout North and South America, Europe,and Asia.

such as the optical fibers, electric cables, copper foils, andplastic sheets, these products are produced using ourcontinuous roll-to-roll processing technology. The
elemental technologies used in this process include athermal processing technique for maintaining an optimum
process temperature, a processing technique to performmolding and extrusion continuously, and a sensing
technique for monitoring product quality online. The
sophisticated materials in our products are testament to
how we have managed over the years to develop eachelemental technology into our own distinctive technology.
It would not be an exaggeration to say that the history of
our product innovation is inseparable from thedevelopment of our continuous processing technology.
Recently we have been working on developing new
products made distinctive by this production technology.

2.2 One-Dimensional Substrate Technology
Using proprietary techniques in optical fiber
manufacturing processes, Furukawa Electric is working on
a project aimed at transforming fabrication based on an
entirely new concept called .“one-dimensional substratetechnology.”
One dimensional substrate technology is the efficient,
low-cost manufacturing of electronic devices on long andnarrow film-like glass and metal substrates. A major
feature of this technology is its conduciveness tofabricating devices using our roll-to-roll processing
technique. Today displays, solar cells, and semiconductor
substrates are predominantly produced through vacuum
batch processes using two-dimensional silicon wafers andglass substrates. However, in order to increase the numberof devices that can be produced from a single substrate
and thus reduce costs, the size of the substrate has been
increased, leading to a need for larger manufacturing
equipment–an enormous investment. By using onedimensional substrates in device fabrication, theproduction method can be changed from the vacuum
batch process to an atmospheric-pressure continuous
process to achieve lower production costs. Since it is also
possible to localize the process area, we can employ morecompact equipment and increase the processing speed.
Hence, there is potential for transforming thesemiconductor industry from the traditional model ofincreasing scale to an approach aimed at increasing
processing speed.
Recognizing the potential for expanding onedimensional substrate technology into a wide range ofindustrial products and the advantages of incorporating
this technology as a new business, Furukawa Electric iscurrently engaged in development aimed at achieving
commercial viability as early as possible.

Capacitor
Signal
Trs 2
Trs 1

2. New Product Development
2.1. Furukawa
Electric’s
Production Technology

Distinctive

Since many of our products are long in dimension,

Output

Power

Gate

TFT circuit formed on a one-dimensional substrate

MICRONANO No. 66
MICRONANO is published quarterly by Micromachine Center (MMC) to promote the international exchange of
information related to micromachines, R&D and other technical topics, and is circulated free of change. Please send
your comments about MICRONANO to the publisher :Keiichi Aoyagi, Executive Director, Micromachine Center (MMC)
MBR99 Bldg., 6F., 67 Kanda Sakumagashi, Chiyoda-ku, Tokyo 101-0026, Japan
Tel : +81-3-5835-1870, Fax : +81-3-5835-1873
Internet Home Page h t t p : / / w w w . m m c . o r . j p /Date of Issue : January 23, 2009

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