MMC Activities..............1
MEMS-ONE Pj...............5
Column.......................6
Overseas Trends............7
Member’s Profiles .........8

MMC Activities

Activities of the Micromachine Center in Fiscal 2005
OVERVIEW
The Micromachine Center undertook the following activities
regarding research and studies into micromachines (MEMS andother nanoscale machines and systems), the collection andprovision of micromachine information, and exchange andcooperation with domestic and worldwide organizations. The
aim of these activities was to establish basic micromachinetechnologies and promote their industrialization, thus
contributing to the further development of Japan’s industrial
economy and to international society.

concerning the research system and development centers from a
policy viewpoint, considering refinement of the technologicalissues pursued and their results, and refinement of the common
elements of integration, with a view to initiating a national
project from 2006.
(4) As part of the research activities of the micro
analysis and production system project, centered on
the Association of Microscience Chip DB Systems(Microscience Research Association Contract),
we created a database of literature useful for research anddevelopment of microchip devices and systems. To this end, we
gathered information, provided data and other similar activities.

1. Research and Investigation of Micromachines
We carried out activities aimed at gaining a clear
understanding of the technological and industrial trends inmicromachines and MEMS as they become key manufacturing
technologies. At the same time, we pursued research into newtechnological issues regarding the fusion of micro - andnanotechnologies. We also made proposals for national
government and NEDO projects in fields where new technology
development is required.
(Governmental/NEDO project related activities)(1) In FY2005 the MEMS-ONE: MEMS Open Network
Engineering System of Design Tools Project (NEDOcommissioned project) carried out research anddevelopment into the production and verification of software
based on the research findings from the specification design
carried out as part of the system development completed theprevious year. Part of this research also involved obtaining
related knowledge and data. In addition, thermal and opticalnanoimprint analysis functions were introduced as adevelopment issue, and from October we carried out intensive
research and development on this theme. The various
committees oversaw the progress of development, making
changes as necessary following testing of the developed
functions. Progress went largely according to the initial plan.
(2) Investigation of methods of promoting MEMS-ONE(NEDO-commissioned project)
Following on from FY2005, we carried out research with
Mizuho Information & Research Institute and Nihon Unisys
Excelutions into efficient business models for improving thereach of MEMS-ONE, and assembling a consistent body of
specialized terminology relevant to the field. To further theseends, we held Exhibition MICROMACHINE to publicize anddemonstrate the interim findings of the MEMS-ONE Project, andto survey the attitudes of users.
(3) Committee to investigate next generation projects
Based on a proposal from 2004, we undertook deliberations

Internet Home Page : http://www.mmc.or.jp/(Survey, Research and Development of Micromachines)(5) Study of R&D trends in micromachine technology inJapan and abroad
We examined and analyzed the latest situation regarding
micromachine technologies and research trends that are
making notable progress in Japan and overseas, and maintained
a library of basic technological data that can contribute toadvances in micromachine technology.
(6) Joint survey research activities concerning theindustrialization of MEMS
In order to facilitate further industrialization of MEMS
which in recent years have rapidly been finding new application
fields, we have been tackling general issues such as accelerating
foundry services, and establishing cooperation with the MEMS
equipment and materials fields. At the same time, we continued
joint research with businesses that provide foundry services
from the previous year, investigating specific issues such asfact-finding at overseas foundries, standardization of processes,
establishing materials databases, and cooperation between
foundries.
(7) Research regarding standardization strategies for
MEMS (JMF-commissioned project)
In order to strengthen and maintain the productive capacityof MEMS and promote strategic international standardization
and regulation required as the foundation for international
development of MEMS, we carried out research into thetechnical needs of the MEMS industry. We analyzed Japan’scurrent position in the world, identifying the technologicalfactors crucial to future standardization and regulation, anddeveloped a proposal for a standardization roadmap.

2. Collection and Provision of Micromachine Information
We collected information and documents on micromachinesfrom universities, industry, and public organizations both inJapan and overseas, along with the results of surveys carriedout by MMC. These materials are freely available in the MMC
library, and have been disseminated widely, both domesticallyand internationally.

of cutting-edge micro/nano technology exchange forums fromthe previous year as a forum for information exchange and thedevelopment of joint research.

(1) Improved dissemination and exchange of information
through the MMC website
We have actively sought to disseminate and exchange
information through the MMC website. We have also improved
the contents provided to our supporting members.

4. Promotion of Standardization of Micromachines
In the technological field of micromachine/MEMS,
standardization is being promoted as international initiatives
get underway.
(1)Standardization of fatigue testing methods for micronano materials (NEDO-commissioned project)
Continuing on from the previous year, we carried out
research into standard methods for fatigue testing to enablemeasurement and evaluation of the mechanical characteristics
of various thin film materials with widths of 10 µm and lengthsof 100 µm or less, with a view to international standardization.
Therefore we carried out fatigue testing with specimens about
1/1,000 the dimensions of earlier specimens in order toestablish the limits of application of fatigue testing methods
used for currently standardized millimeter-order specimens.
Fiscal 2005 was the last year of this 3-year project, and weincorporated the results of the project in the draft standard“Fatigue Testing Methods for Thin Film Materials”.

(2) Publication of a micromachine periodical
We publish a micromachine periodical entitled
Micromachine Index which gathers together abstracts ofimportant documents for distribution to supporting members
and related agencies.
(3) Publication of a newsletter
We distributed a monthly newsletter MMC Newsletter withinformation concerning research and governmental trends
related to micromachines to supporting members.
(4) Maintaining and upgrading the MMC library
We upgraded the library by gathering further technicaldocumentation and materials, and added this and otherinformation to our database.

(2) Standardization of tensile testing methods for thin film materials
Based on the results of “Standardization of Measurementand Evaluation Methods for the Characteristics ofMicromachine Materials” carried out as a NEDO-commissioned
project from FY1999 to 2001, we proposed it to IEC as aninternational standard in 2003. In 2004 a Committee Draft ofthe standard was recognized, and in 2005 we proposed a
Committee Draft for Vote and continued our activities towards
international standardization.

3. Exchange and Cooperation with MicromachineRelated Organizations Worldwide
In order to promote exchange with related organizations inand outside Japan, we participated in the Micromachine
Summit, held an international symposium, employed anddispatched researchers and experts, and undertook cooperation
with domestic and external agencies aimed at establishing a
micromachine foundry network.
(1) Participation in the 11th Micromachine Summit
We participated in the 11th Micromachine Summit held in
Dallas, where we discussed wide-ranging issues regarding
micromachine technology and worldwide trends in the fields ofmicromachine applications.

(3) Standardization of micromachine specialist terminology
The international standardization proposal for
micromachine specialist terminology that we made to the IEC in2002 was recognized by Committee Draft for Vote in 2004 via
the New Project stage. In 2005 it was prepared as a Final Draft
for International Standard as the final stage, and we continued
our activities towards international standardization.

(2) Hosting the 11 t h International Micromachine/
Nanotech Symposium (partially sponsored by theJapan Motorcycle Racing Organization)
We hosted the 11th International Micromachine/Nanotech
Symposium which focused on technological issues involved in
the merger of micromachines/MEMS technology andnanotechnology, and on the outlook for this field.

(4) Research and investigation of micromachine standardization
In order to continue to develop new strategic international
standards proposals, we prepared a roadmap for international
standardization and identified standardization proposal issues
in concert with the MEMS-ONE Project, the Reliability
Evaluation Committee and so on.

(3) International exchange and dispatch of researchers
We promoted exchanges with overseas universities andother micromachine-related research agencies, sending
researchers on missions overseas. They also participated ininternational symposia and academic conferences held overseas.
Furthermore we promoted exchanges by inviting experts from
Europe and America and dispatching Japanese experts andresearchers overseas.

5. Dissemination of information and education
concerning micromachines
We issued publications, held expositions, and conducted awide range of PR and educational activities regarding
micromachines.
(1) Besides publishing a regular public relations
magazine, we are disseminating information on the
MMC website.

(4) Building a MEMS foundry network system
In order to establish the foundries essential forindustrialization of MEMS, we promoted the establishment of asystem aimed at improving services through networking withbusinesses providing foundry services and the Foundry Service
Industry Committee formed by related companies.

(2) We exhibited leading-edge products andmanufacturing materials related to themicromachine/MEMS industry, and hosted the 16th
Exhibition MICROMACHINE as a forum forannouncing the latest research findings.

(5) Establishing a forum for the exchange of cuttingedge micro/nano technology
In order to promote the development of cutting-edge
micro/nano technology, a basic technology that is expected tofind applications in many fields, we continued holding meetings(3) As the organizer of the Federation of MicromachineTechnology, we worked to consolidate andstrengthen micromachine-related organizations.

2

Establishment and Activities of the MEMS Industry ForumMicro/nano/MEMS technologies are growing more and moreessential for the strengthening of Japan’s industrial
competitiveness. Against this background, the MEMS Industry
Forum (MIF) was established in April this year as a special councilof the Micromachine Center.
A party to commemorate the inauguration of the MEMS
Industry Forum was held on May 19 at the Shoko Kaikan Hall in
Kasumigaseki, Tokyo. The approximately 70 participants included
representatives of industry (full) members, associate members,
affiliated organizations, MEMS fellows (individuals), and Forum
advisers, and an enjoyable evening was had by all.
MEMS technology enables the creation of small, high-precision,high energy efficiency, high-performance devices; because thesecan be used as key devices in the expansion of various industrial
fields, and because government-industry-university cooperation
can be an effective means of developing MEMS technologies, party
participants expressed high expectations for the future endeavorsof the Forum as a core body promoting such development
activities.

industrial expansion, such as basic technologicaldevelopment, foundry networks, industry-university
cooperation, personnel training, formulation of regulation,
standardization, and overseas expansion.
(2) Industry-University Cooperation: The Forum will undertaketo strengthen (through information exchange, etc.)
communication and cooperation between study group
activities related to cutting-edge technology status andsecond-generation technology issues; activities of cuttingedge technology exchange forums aimed at furthering
industry-university exchange in the micro-nano field; andMEMS-related research organizations, societies, anduniversity research laboratories within Japan.
(3) Activities to Enhance the MEMS R&D Infrastructure: The
Forum will promote personnel training activities throughexpansion and strengthening of the foundry network,
diffusion and promotion of MEMS-ONE, implementation of
MEMS lecture activities, and internship support.
(4) MEMS Business Domestic/International Exchange
Activities: The Forum will host “Micro/Nano 2006,” ageneral event to promote business exchange at the Tokyo
Forum according to the following schedule.
Nov. 6

Nov. 7-9
Nov. 7
Nov. 8
Nov. 9The 2nd Workshop on Characterization ofMaterials for MEMS/MST Devices(Venue: Mitsubishi Building Conference Square)
17th Micromachine Exhibition
MEMS Forum
12th International Micromachine Nanotechnology
Symposium
MEMS-ONE Research Debriefing

The Forum will also establish an “MEMS Mall” that introduces
catalogues of new products – such as MEMS devices, foundries, andmanufacturing equipment – and new technologies in order tosupport the operation of the “MicroNano Net” as a forum for many
government-industry-university people involved in the micro/nano
field to come together on the Internet, as well as the invigoration of
MEMS business. Furthermore, as the permanent secretariat for theMicromachine Summit – a forum for the free discussion of thecurrent status and future expectations for education, technologicaltrends, policies, and other micromachine/MEMS-related topics invarious countries – the Forum will undertake a variety of activities topromote business exchange between companies, both within Japanand overseas, through participation in the Micromachine Summit
and other micro/nano-related events both in Japan and abroad.
Organization and implementation of MEMS Industry Forum
activities will be performed by three soon-to-be establishedcommittees – the Industrial Exchange Committee, International
Exchange Committee, and Foundry Service Industry Committee –under the guidance of the MEMS Industry Forum Promotion
Committee.

1. MEMS Industry Forum Activities
The MEMS Industry Forum comprises MEMS-relatedorganizations at its core. In continuing cooperation with affiliatedacademies, regional bases, and overseas organizations, the Forum
undertakes various activities – such as making MEMS policy
recommendations to government bodies and other relatedorganizations, industry-university cooperation, and industrial
exchange/invigoration – through which it aims to support thefurther development of the MEMS industry and thereby to thestrengthening of Japan’s industrial competitiveness on theinternational stage.
The Main Activities of the MEMS Industry Forum are as
follows.
(1) Policy recommendations: The Forum will makerecommendations to government bodies and other relatedorganizations concerning basic issues affecting MEMS

Special Council
Regional Affiliates

Government
METI NEO

Advisors

Formally established MEMS cluster

MEMS Industry Forum@MMC
Policy recommendation& industry exchange/invigoration activities
Industry Members
Businesses
Associate Members Groups
MEMS Fellows
Individuals

Academy Affiliates

Foreign Affiliates

University research laboratories
Research organizations Societies

Research organizations
Related groups

MicroNano Network

3

MEMS Industry Forum
Promotion Committee
Industrial Exchange
Committee
International Exchange
Committee
Foundry Service Industry
Committee

Introduction to the High Integration Composite MEMS Fabrication Technology (Fine MEMS) Development Project
MEMS gained through this research and development,
and establishing a knowledge database to make it
widely available to Japanese industry.

1. Development aims
In recent years, MEMS (Micro Electro
Mechanical Systems) technology has contributed
significantly to miniaturizing and increasing theperformance of electronic equipment andcomponents, and they are expected to become key
devices in a range of fields such as telecoms,
medicine, biotechnology, and automobiles among
others. In the new industrial strategy produced by
the Ministry of Economy, Trade and Industry in
FY05, and in the strategy for new economic growthissued in FY06, MEMS are positioned as one of thehigh-level component industries on which toconcentrate. Due to the necessity of reinforcing
Japan’s competitiveness in MEMS, which are
expected to see growth internationally too, thestrategy aims to achieve greater miniaturization,
power saving, higher performance, and higher
reliability through further improvements in MEMS
fabrication technology. The High Integration
Composite MEMS Fabrication Technology Project
was planned to address the important technicalissues of combining MEMS with nano-functions,
integration with semiconductors, and bonding
between MEMS.

3. Period and scale of the Project
The Project will run for three years from FY2006 to
FY2008, and yen 1.1 billion is budgeted for FY2006.
4. Development organizations and theapproach of the Micromachine Center
Eight corporations have been selected forsubsidized projects and eight organizations(universities and national research institutions) havebeen selected for mandated projects. The
Micromachine Center has been entrusted with 4)
Establishment of a database of high integration
composite MEMS knowledge.
The knowledge database must cover all the issues
involved in high integration composite MEMS
fabrication technologies, and therefore a fine MEMS
knowledge database committee will be organized tostrengthen cooperation within the Project to enable theresearch data from all the corporations and bodies
participating in the Project to be collected. Besides
considering effective means of allowing eachresearcher to enter knowledge easily, the Project will
invite university researchers with superior knowledgeof the relevant issue to supplement the knowledge data
relating to the subsidized project themes in particular.
In addition, the Micromachine Center will provide
management support for the Project overall. As
described above, the Project is a composite projectcomprising a number of issues and themes, involving
mandated and subsidized programs, therefore it will benecessary to carry out efficient management ofprogress and of the necessary liaison within andbetween the disciplines, and to provide a suitableenvironment for industrialization at the latter stage.
With this objective, a project liaison committee will beestablished for organizing periodic consultations andcoordination. The Micromachine Center will be
responsible for this role and, under the guidance of the
Project Leader, the Center will take an active approachwith the aim of maximizing the results of the Project.

2. Project overview
The research and development issues are;1) MEMS/nano-function composite technology, 2)
MEMS/semiconductor integrated fabrication
technology, 3) MEMS/MEMS high integration
composite technology, 4) Establishment of adatabase of high integration composite MEMS
knowledge
In particular, issues 1) to 3) each consist basically offour technology themes as shown in Table 1. Eachtheme comprises technologically difficult aspects, andfactors linking them to industrial production.
Technologically sophisticated aspects will be mandated
to universities and national research institutions, whiledevelopment of applications will be conducted bycorporations under subsidies. Theme 4) involves
gathering technical knowledge and internal andexternal approaches to high integration composite
NEDO R&D Organization

Instructions & discussion

Fine MEMS Project Liaison Committee
Chairman: Prof. Shimoyama, Tokyo Univ.

Subsidized

MEMS - Nano

Fine MEMS Knowledge
DB Committee

Mandated
Corporations

The University of Tokyo

Nanomachinery structures: Structure as minute as size of wavelength of light•

Selective biomodification: Biomimetic sensing•

Selective nanomaterial modification : CNT etc.

•

Nanofunction devices: Nanomodication device technology•

Monolithic process integration: CMOS integrated MEMS

New sensor principles: Through miniaturization of semiconductor sensors etc.

Vertical wiring: Leading-edge CMOS and MEMS multilayer fine-pitch wiring

Interposer: In-board Y-branch

Horizontal wiring: Leading edge CMOS and MEMS horizontal fine-pitch wiring

High-density, 3D surface wiring: High-density wiring including vertical step edges etc.

AISTHigh density packaging:High density packaging using self-organization

Tohoku University

•

•

AIST
AIST
Mitsubishi Electric Corporation•

Hitachi, Ltd.

•

Ritsumeikan University•

Omron Corporation

Monolithic integration
High integration MEMS
analysis methods
High integration wiring
technology

Fujikura Ltd.

•

Multilayer integration of dissimilar materials : High precision Z direction assembly of wafers•

Multilayer build-up integration•

Low stress dicing

MEMS - MEMS

Mandated

Fine MEMS Knowledge DB(Micromachine Center)

Universities &Natl. Research Institutes•

MEMS Semiconductor

Admin. Office
Micromachine Center

Toshiba Corporation

Olympus Corporation: Adding manufacturing processes to sequential bonding Matsushita Electric Works, Ltd.

•

Multilayer bonding technology•

Multilayer integration technology

High-precision light chip integration : High precision incorporation of optical semiconductors in MEMS Yokogawa Electric Corporation
Osaka University
Tohoku University: Multilayer dissimilar material wafers

High Integration Composite MEMS Fabrication Technology Development Project: Development Issues and Organization

4

Expectations for MemsONE
Yusuke Ichinose, Project Manager, New Energy and Industrial Technology Development Organization
MEMS (Micro Electro Mechanical Systems) isdefined as a technology for creating fine, movable threedimensional structures using semiconductor processing
and other technologies, or the components
manufactured in this way. In Japan they are calledmicromachines while in Europe they are known as MST(Micro System Technology), and broadly speaking, theterms have been used to mean nearly the same thing.
MEMS differ from LSI circuits in that a wide range of
inputs and outputs are possible, such as electricalsignals, energy, mechanical displacement, physicalquantities, optical signals, chemical quantities and so on.
If machinery or systems are compared to humans,
circuits correspond to the brain, while MEMS
correspond to important parts such as the five senses
and muscles. Since a wide variety of inputs and outputs
are possible, MEMS can be applied in a range of fields
whether in telecoms, medicine and biotechnology,
automotive and so on, and since they use semiconductor
process technologies, it is possible to manufacture highvalue-added products that are small, high performance,and have superior energy saving characteristics.
The New Energy and Industrial Technology
Development Organization (hereafter, “NEDO”)
recognizes MEMS as an important field, and since
FY1991 NEDO has carried out the Micromachine Project
resulting in improvements in MEMS basic technology,
and commercialization of some developments. However,since MEMS requires expensive and large scaleequipment, NEDO has overseen the MEMS Project for
the last 3 years since FY2003 in order to reduce risk
from the viewpoint of capital investment, and to provide
facilities and infrastructure. This project has carried out
foundry improvements and has led to the developmentof high-level, three-dimensional process technologies.
Consequent to these circumstances, the Project forDevelopment of a Design and Analysis Support System
for MEMS (hereafter, “Mems-ONE Project” has been
underway since FY2004 based on a 3-year plan. This
project is focusing on development of a design andanalysis support system for MEMS. One of the reasons
why MEMS has not met its latent potential is that only
limited numbers of researchers and engineers havebeen involved in the development of MEMS. By using
this system, researchers and engineers from many otherfields will more easily be able to participate in MEMS,
and it will be possible to reduce the cost and time
involved for MEMS development by using simulations.
One of the features of this system is a built-in
database of knowledge such as MEMS terminology,
explanations of representative processes and devices,and examples of analysis so that engineers who do nothave much experience of MEMS can use it. At the sametime, providing the system with a full materials
database improves the accuracy of analysis, making it aworthwhile system for engineers who are alreadycurrently involved in MEMS development too.
When NEDO established this project, we designed
the system so that it could be used both by beginners
and experienced engineers. However, since MEMS is atechnology in a growth field where the environment ischanging significantly, we carried out a survey
regarding activities to promote the Design and Analysis
Support System for MEMS and its repercussion effects.
This survey was conducted in parallel with the FY2004
project. When we surveyed the technology trends andthe needs of society, we found that nanoimprint
technology was considered a promising MEMS
manufacturing technology, although in its startup
phase it was still thought to be a future technology.
Therefore using the NEDO system, we obtained a new
budget and from FY2005 we started development of a
Nanoimprint Process and Analysis System.
Furthermore, from FY2006, we are starting the new
High Integration Composite MEMS Fabrication
Technology Development Project based on a 3-year
plan. This project is scheduled to cover, (1)Development of MEMS/nano-function composite
technology, (2) Development of MEMS/semiconductor
integrated fabrication technology, and (3)MEMS/MEMS high integration composite technology.
In future MEMS support systems, analysis of MEMS
technology and semiconductor technology at the sametime will likely be required, therefore from FY2006, wehave been working on development of a circuit
integration MEMS simulator.
The Mems-ONE Project will finish this fiscal year.
However, the system developed as a result of the
NEDO project will still be promoted after the end of
the project, and we anticipate that the software will be
improved and the database updated on a selfsustaining basis. As part of the High Integration
Composite MEMS Fabrication Technology
Development Project, NEDO will establish a databaseof high integration composite MEMS knowledge andwill provide support so that the results are provided to
the Mems-ONE Project. In addition, we are planning astandardization project to promote international
standardization of technology developed by the MemsONE Project, and we expect that by going throughthese stages, improvement of the software and updatesof the database will ultimately become self-sustaining,
the results will be disseminated continuously, and the
MEMS industry will continue to grow.

5Column

Material failure at the MEMS scale- Size effects on fracture behavior -Kazuki Takashima, Professor, Kumamoto University Graduate School of Scienceand Technology, Materials Science and Engineering
where metal is used for parts in which bending (as seen incantilevers and hinges), and twisting stress is applied, this size
effect becomes important.
Incidentally, for the design and development of MEMS
devices with superior reliability and durability, it is very
important to evaluate the rupture characteristics of
microdimensional materials with high precision. Here I will
present a relevant example of a size effect. When uniform force
is applied to the material, stress is concentrated at the ends ofany scratches or cracks. However, if the stress at the end of acrack exceeds the yield stress, plastic deformation will occur. If
the size of the area where this plastic deformation occurs (inthe case of failure, the parameter related to characteristic
length) is very small compared to the ligament length (thelength from the end of the crack to the free surface beyond it)brittle fracture will occur. However, if the size of the area islarge, a size effect appears in which the fracture morphology ofthe material transitions from brittle fracture to ductile fracture.
In ductile materials, the characteristic length in this case is in
the order of millimeters or higher, so even if the size is reduced
to micron order, the material still tends towards ductile
fracture. However, in brittle materials, the fracture morphology
may make a transition according to the size. In our group, we
researched the fracture behavior from micro to macro sizes
using single crystals of Fe-3%Si alloy (a material in whichcleavage (brittle) fracture occurs at macro sizes, but with acharacteristic length in the order of 10 µm or more). From ourtests we discovered that although cleavage fracture occurs at
the macro size, the behavior changes to ductile fracture at the
micro size (Fig. 1).
In MEMS, in order to aim for higher performance it isconsidered necessary to use many materials such as metals,
ceramics, polymers and so on, and as well as silicon materials.
Furthermore, because there are many types of silicon andceramic that undergo brittle fracture at macro sizes, I believethat our results showing the effects of dimension on fracture
behavior will prove very important in designing MEMS devices
that are reliable and durable.

Since beginning research several years ago regarding
evaluation of mechanical properties of the micromaterials usedin MEMS, I have begun to dip a toe into the world of MEMS.
Whenever I make a presentation about evaluating themechanical properties of micro scale materials, I am always
asked, “What about the size effect?”. Size effect is generally
used to mean the changes in material properties compared withbulk materials when the dimensions of a material are madesmaller. But for those of us who have been involved mainly inmechanical characteristics, the question of how the mechanicalcharacteristics change is what seems to interest us.
Generally it is said that brittle materials (such as glass andceramic) increase in strength as their size gets smaller. Thisphenomenon is explained as being linked to the existing
probability of defects being present in the material. In otherwords, as the dimensions of the material get smaller, so thenumber of defects included in the material becomes fewer,
meaning that the starting points for failure are reduced, thereby
raising the strength. However, with MEMS materials, thedimensions are in the order of microns, so that various othersize effects come into play.
These size effects can be divided into intrinsic effects andextrinsic effects. Intrinsic effects are those where, as thedimensions become smaller, the deformation mechanisms of thematerials change, with the result that the mechanical properties
change. Extrinsic effects are those where the mechanicalproperties change due to exogenous elements such as thedefects mentioned above. With MEMS materials especially, evennanosize defects may be located in stress concentration zones,
causing the mechanical properties of the material to change
significantly. With the materials used for MEMS, the changes in
the mechanical properties caused in the manufacturing process
can be said to be extrinsic size effects since the form of defects
and their existing percentage depends on that process.
However, because both types of effect are typically present
together, size effects on mechanical properties are extremelycomplicated.
Incidentally, the dimension at which size effects begin toappear irrespective of mechanical characteristics is called the“characteristic length”. When electromagnetic properties orquantum effects are involved, characteristic lengths in thenanometer order are typical. However, among mechanicalcharacteristics there are some with a characteristic length in
the micron order which is the size of MEMS. For example,
tension tests of ductile materials (materials that show
significant plastic deformation until they break, like many metalmaterials) indicate that material strength largely does notdepend on the dimensions of the material down to the micronsize. However, if a stress gradient or strain gradient occurs suchas with bending or twisting, a size effect becomes apparent inwhich the strength increases as the dimensions of the material
decreases, as demonstrated experimentally and theoretically.
There are differences between the types of material,
particularly with metal materials. However when thecharacteristic length is in the micron order, in MEMS devices

(b)

(a)
Notch

Crack Growth
Direction

[010]

[001]

5 m

500 m

Fig.1 Changes in fracture behavior in (a) a macro size
specimen, and (b) a micro size specimen of Fe3%Si single crystal. At macro sizes, cleavage(brittle) fracture occurs, but at micro sizes,
ductile fracture occurs. As this demonstrates,
the fracture behavior and morphology of asingle material differs when the dimensions of
the material change to a micro order.

6

Overseas Trends

Report on the 12th Micromachine Summit“Micro/nano technologies at Mitsubishi Electric
Corporation”.

The 12th Micromachine Summit was held over 3days, from April 27 to 29, 2006, at the yellow-sandhazed Jiu Hua Spa & Resort on the outskirts of Beijing,
China.

Tours of the beautifully illuminated Great Wall andTiananmen Square were arranged for the evenings
after the sessions concluded on both days, providing
opportunities for participants to deepen friendships
and rounding out two highly productive days.

The summit was hosted by Tsinghua University andwas attended by 88 delegates and observers from 17
countries and regions: Australia, Canada, China,
France, Germany, India, Japan, the Republic of Korea,
Singapore, Switzerland, Taiwan, the United Kingdom,
the United States, the Benelux countries (Belgium, theNetherlands, Luxembourg), the EU, the Mediterranean
region (Italy, Spain, Portugal, Greece), and the Nordic
countries (Denmark, Norway, Sweden, and Finland).
Japan was represented by a delegation of 16 – thelargest ever for a summit held overseas – led byProfessor Isao Shimoyama of the University of Tokyo
as Chief Delegate.

A technology tour was held on April 29. The tour
visited Tsinghua University and a bioventure businesssupported by Tsinghua University, Capital Biochip
Corporation, ending the summit on a successful note.
The 13th Micromachine Summit is to be held from
April 26 to 28 next year in Venice, Italy and Korea,
Canada, the United Kingdom, and India have all
expressed a desire to host summits in the future. High
expectations are held for the summit as a place forinternational exchange regarding MEMS andnanotechnology, and I believe we should fully utilize it
as such.

Held over two days, April 27 and 28, the summit
conference was chaired by Prof. Zhaoying Zhou of
Tsinghua University. Altogether, an impressive 54
presentations were made in the 6 sessions: (1)Country/Region Review; (2) Strategy & Cooperation;(3) Infrastructures & Education; (4) Market,
Industrialization & Standardization; (5) To NanoTechnology; and (6) Innovative Technology.
Japan made five presentations. The content of eachand every one of these was excellent and received
high praise from delegates of other countries; having
acted as secretariat for the summit for a long time
now, I am sure that there was renewed awarenessamong participating countries of Japan’s position. In
Session 1, Professor Shimoyama gave an outline of theIntegrated MEMS Technology Development Project,which began this year, in his presentation entitled“Fine MEMS – upcoming MEMS project”. In Session 4,
Micromachine Center Executive Director Keiichi
Aoyagi described the activities of the MEMS Industry
Forum, which was established in April this year, in apresentation entitled “Towards advancement of MEMS
industry in Japan”. In Session 5, various businesses
representatives described their companies’ activities
regarding MEMS and nanotechnology: Mr. Masaaki
Terada, Director and Senior Executive Managing
Officer of Olympus Corporation, spoke on “Nano-Bio
MEMS technology for Medical Application”; Koichi
Imanaka, Managing Officer and Senior General
Manager of Research & Development H.Q. of Omron
Corporation, spoke on “Micro and nano technology inJapan - example of OMRON Corporation–”; andKazuhiko Tsutsumi, Manager of Imaging Technology,
Mitsubishi Electric Corporation Advanced Technology
Research and Development Center, spoke about

Summit Participants: in front of the summit venue,
the Jiu Hua Spa & Resort

Japan’s Chief Delegate: Presentation by Professor
Isao Shimoyama of the University of Tokyo

http://www.mmc.or.jp/kokusai/summit/summit.html

7Members' Profiles

Yamatake Corporation
1. Microfabrication technology activities
With our measurement and control technology
fostered over many years, Yamatake Corporation iscontributing to society in the fields of building
automation, advanced automation (manufacturingindustry automation), and the life automation thatsurrounds us (automation that supports ourenvironment and amenities). The company became
involved in microfabrication technology in the early
1980s. Measurement of temperatures, humidity,
pressure, and flow rates is extremely important toYamatake, and we have given it a high priority in
our research. Technologies that we developed forcommercial applications from among the research
themes at that time are currently the subject offurther research at the Microdevice Center withthe goal of expanding the application within ourbusiness. Leading edge technology domains thatcannot be managed by the Microdevice Center are
handled by the Research and Development
Division Microsystems Group.
2. Micronano technology activities(1) Nanocrystal silicon ultrasonic elements
ULSI technology using silicon substrates is crucial
to the development of today’s industry. At quantum
size, the silicon expresses new optical, electronic,
thermal, and chemical properties that do not appear
in larger sizes. Together with the Koshida Laboratoryof the Tokyo University of Agriculture andTechnology, Yamatake developed a nanocrystal
silicon ultrasonic element using these thermal
properties. This new ultrasound source achieves flat
frequency characteristics that are difficult to obtainwith existing technology, and we are pursuingdevelopment to apply this characteristic to new
ultrasonic speakers, high-precision range sensors,and compact actuators. Nanosilicon technology holds
wide potential, and we plan to deploy this basic
technology in many products.

Microsystems Group Leader, Research and Development Division

Shuichi Tanaka(2) Spherical SAW gas sensor
The spherical SAW gas sensor uses thephenomenon in which surface acoustic waves(SAW) go around a sphere a number of times(discovered in 1999 by Professor Yamanaka of
Tohoku University). This is a sensor for measuringchanges in the concentration of gas on the surfaceof the sphere using the characteristic whereby acrystal sphere with as small as 1 mm diameter
exhibits longer propagation lengths (1 m or more).
This phenomenon is not seen in flat SAW devices.
Since it provides high sensitivity, the sensitive
membrane can be thinner allowing a high speed
response. The hydrogen sensor that we are
currently developing has succeeded in detecting ina wide range from extremely low concentrations(10 ppm) to high concentrations (100%). We areaiming to create a product that will offer safety andpeace of mind in the coming hydrogen society. The
sensor can also be made to detect other gases bychanging the sensitive membrane.

Fig. 2 Spherical SAW gas sensor

Fig. 1 A nanocrystal silicon ultrasonic element

3. Future activities
Nanotechnology products are the focus ofattention as sensing materials. We plan to probe
deeper in this area. We expect to find businesspossibilities in the life automation field at the end of
our research. Although life automation has adifferent flavor from our existing business domain,
we aim to expand our business in the life automation
field, and make bold new advances in that area.
MICRONANO No. 56

MICRONANO is published quarterly by Micromachine Center (MMC) to promote the international exchange of
information related to micromachines, R&D and other technical topics, and is circulated free of change. Please send
your comments about MICRONANO to the publisher :Keiichi Aoyagi, Executive Director, Micromachine Center (MMC)
MBR99 Bldg., 6F., 67 Kanda Sakumagashi, Chiyoda-ku, Tokyo 101-0026, Japan
Tel : +81-3-5835-1870, Fax : +81-3-5835-1873
Internet Home Page h t t p : / / w w w . m m c . o r . j p /Date of Issue : August 28, 2006

© All Copyrights Reserved by MMC