Second Announcement and Call for Papers

ICRP-11/GEC 2022
October 3 - 7, 2022
Sendai International Center
Sendai, Japan

11th International Conference on Reactive Plasmas /75th Annual Gaseous Electronics Conference /40th Symposium on Plasma Processing (SPP-40) /35th Symposium on Plasma Science for Materials (SPSM35)

Organized byInternational Organizing Committee of ICRP-11
GEC Executive Committee
Co-sponsored by
The Japan Society of Applied Physics
Supported by:American Physical Society
Plasma Electronics Division, The Japan Society of Applied Physics
https://www.ecei.tohoku.ac.jp/plasma/ICRP-11/

Cooperative Societies
Japan Welding Society
Smart Processing Society for Materials, Environment & Energy
The Chemical Society of JapanThe Electrochemical Society of JapanThe Institute of Electrical Engineers of JapanThe Institute of Electronics, Information and Communication Engineers
The Institute of Electrostatics JapanThe Institute of Engineers on Electrical Discharges in JapanThe Japan Society of Mechanical Engineers
The Japan Society of Plasma Science and Nuclear Fusion Research
The Japan Society of Vacuum and Surface Science
The Materials Research Society of JapanThe Physical Society of JapanThe Society of Chemical Engineers, JapanThe Surface Finishing Society of Japan

Contents
Cooperative Societies ................................................................ 1General Information ................................................................ 2
Scientific Program ................................................................... 3
Contributed Papers ................................................................... 7
Social Events ...............................................................8Committees .............................................................................. 9
Hotel Accommodation ...............................................................11Visas ..........................................................................................12
Further Information ............................................................ 12
Calendar of Events ..................................................................12Travel Information ................................................................... 13-1-General Information
The International Conference on Reactive Plasmas (ICRP) has taken place by the initiative of theDivision of Plasma Electronics, the Japan Society of Applied Physics since 1991. The 1st ICRP washeld in Nagoya, the 2nd in Yokohama (1994), the 3rd in Nara (1997), and the most recent conference(10th ICRP) in Sapporo (2019). Some former ICRPs were held as international joint conferences: the4th ICRP was with the Gaseous Electronics Conference (GEC) at Maui in 1998, the 5th was with
European Conference on the Atomic and Molecular Physics of Ionized Gases (ESCAMPIG) atGrenoble (2002), the 7th was with GEC at Paris in 2010, 9th was with GEC at Honolulu in 2015, and10th was with International Conference on Phenomena in Ionized Gases (ICPIG) at Sapporo in 2019.
The Symposium on Plasma Processing (SPP) is a domestic annual Japanese meeting that has been
held by the Division of Plasma Electronics since 1984. The joint ICRP and SPP conference aims togather researchers and engineers, involved in various aspects of reactive plasmas and theirapplications. The joint conference also aims to facilitate the exchange of information and ideas among
them within an international framework.
The subjects covered in this conference are the entire field of reactive plasmas and their applications
to various materials processing such as surface modification, etching and deposition with emphasison basic phenomena, technologies, and the underlying basic physics and chemistry. Furthermore, thesubjects have been extended to bio- and/or medical application of plasmas. This conference
particularly encourages papers dealing with basic properties of the plasma itself, its generation andcontrol, fundamental processes in the plasma, and plasma-solid/liquid interactions. Papers dealing
with specific results of processing should place emphasis on the related plasma characteristics inobtaining the results.
The 11th ICRP will take place in October 3-7, 2022, in Sendai, Japan, as a joint conference with the75th GEC. This conference will also be held as a joint conference with the 40th Symposium on Plasma
Processing and 35th Symposium on Plasma Science for Materials (SPSM35). The conference site
will be at Sendai International Center at Sendai.
The ICRP-11/GEC2022/SPP-40/SPSM35, a four-day conference, will consist of a series of oral
sessions (composed of both invited and contributed papers), poster sessions, award lectures, andarranged sessions on selected topics. Sessions will be organized around coherent subjects in order tofacilitate useful discussions and focus on appropriate solutions to problems.
The official language of the conference is English, and will be used for all presentations and printedmaterials.

-2-

Scientific Program
Conference Topics
General Sessions:
1 Atomic and molecular collisional and dynamical processes
1.1 Electron and photon collisions with atoms and molecules: excitation
1.2 Electron and photon collisions with atoms and molecules: ionization
1.3 Heavy-particle collisions
1.4 Dissociation, recombination and attachment
1.5 Distribution functions and transport coefficients for electrons and ions
1.6 Other atomic and molecular collision phenomena
2 Plasma science
2.1 Nonequilibrium kinetics of low-temperature plasmas
2.2 Basic plasma physics phenomena in low- temperature plasmas
2.3 Plasma boundaries: sheaths, boundary layers, others
2.4 Plasma-surface interactions
2.5 Plasma diagnostic techniques
2.6 Modeling and simulation: computational methods
2.7 Modeling and simulation: validation and verification
2.8 Modeling and simulation: plasma sources
2.9 Modeling and simulation: chemical reactions
2.10 Modeling and simulation: other2.11 Glows: dc, pulsed, microwave, others
2.12 Capacitively coupled plasmas
2.13 Inductively coupled plasmas
2.14 Magnetically-enhanced plasmas: ECR, helicon, magnetron, others
2.15 Atmospheric and high pressure plasmas: jets and gliding arcs
2.16 Atmospheric and high pressure plasmas: dielectric barrier and corona discharges
2.17 Atmospheric and high pressure plasmas: catalysis and chemical conversion
2.18 Thermal plasmas: arcs, jets, switches, others
2.19 Plasmas in liquids
2.20 Plasma on or contacting liquids
2.21 Plasmas and aerosols
2.22 Negative-ion and dust-particle-containing plasmas
2.23 Gas phase plasma chemistry
2.24 Other plasma science topics
3 Plasma applications
3.1 Plasmas for light production: laser media, glows, arcs, flat panels, and novel sources
3.2 Plasma etching
3.3 Plasma deposition
3.4 Plasma ion implantation
3.5 Green plasma technologies: environmental and energy applications
3.6 Plasma processing for photovoltaic applications
3.7 Biological, medical, and agricultural applications of plasmas
3.8 Plasma propulsion and aerodynamics
3.9 Plasmas for nanotechnologies, flexible electronics, and other emerging applications
3.10 Plasma for other materials processing and synthesis-3-Workshop:
1. Industrial plasma technologies
2. Plasma physics for space propulsion technologies
3. Functional surfaces in plasma elementary and process-applicable reactions
4. Catalytic effects in plasma-liquid interaction
Plenary and Invited Speakers (tentative)
Plenary:Will Allis Prize Talk
Makabe, Toshiaki (Keio University, Japan)“40 years with studies on radiofrequency plasma and related transport
theory”
The GEC Executive Committee is pleased to recognize Professor Emeritus Makabeas the recipient of the 2022 Will Allis Prize for the Study of Ionized Gases.

Reactive Plasma Award Talk
Hori, Masaru (Nagoya University, Japan)“Evolution of Reactive Plasma Processes by Radical Control” (tentative)
The International Organizing Committee of ICRP-11 is pleased to recognize
Professor Hori as the recipient of the 2022 Reactive Plasma Award.
General Sessions:
Adamovich, Igor
Agarwal, Sumit
Akatsuka, Hiroshi
Barrachina, Raul
Barret, Steven
Bourdon, Anne
Camata, RenatoCharles, Christine
Chang, Bingdong
Chiang, Wei-Hung
Choe, Wonho
Colgan, JamesCvelbar, Uros
Fontes, Christopher
Gans, Timo

Ohio State University, USA
Colorado School of Mines, USA
Tokyo Institute of Technology, Japan
Bariloche Atomic Centre, Argentina
Massachusetts Institute of Technology, USA
Ecole Polytechnique, France
University of Alabama at Birmingham, USA
The Australian National University, Australia
Technical University of Denmark, Denmark
National Taiwan University of Science and Technology, Taiwan
Korea Advanced Institute of Science and Technology, Korea
Los Alamos National Laboratory, USAJožef Stefan Institute, Slovenia
Los Alamos National Laboratory, USA
Dublin City University, Ireland-4-Gherardi, Matteo
Gibson, Andrew
Hamdan, AhmadHara, KentaroHaruyama, Tetsuya
Helmersson, Ulf
Hill, Christian
Hoshino, Masamitsu
Iqbal, Muzammil
Ishikawa, Kenji
Kadyrov, Alisher
Kamataki, Kunihiro
Kersten, Holger
Komuro, Atsushi
Lacoste, Deanna
Laroussi, Mounir
Levko, Dmitry
Likhanskii, Alexandre
Lietz, Amanda
Lim, Yegeon
Liu, Dingxin
Maguire, Paul
Mesbah, Ali
Nagashima, Yasuyuki
Namba, Shinichi
Nunomura, Shota
O'Connor, Robert
Oehrlein, Gottlieb
Ptasinska, Sylwia
Puac, Nevena
Ren, XueguangScheiner, BrettSchücke, Lars
Shigeta, Masaya
Shinoda, Kazunori
Smolyakov, Andrei
Sun, Jing-Yu
Suzuki, Haruka
Tachikawa, Masanori
Takashima, Keisuke
Trelles, Juan P.

University of Bologn, Italy
Ruhr University Bochum, Germany
Université de Montréal, Canada
Stanford University, USA
Kyushu Institute of Technology, Japan
Linköping University, Sweden
Vienna International Centre, Austria
Sophia University, Japan
Korea Institute of Machinery and Materials, Korea
Nagoya University, Japan
Curtin University, Australia
Kyushu University, Japan
Kiel University, Germany
The University of Tokyo, Japan
King Abdullah University of Science and Technology, Saudi Arabia
Old Dominion University, USA
Esgee Technologies Inc., USA
Applied Materials, Inc., USA
North Carolina State University, USAKorea Advanced Institute of Science and Technology, Korea
Xi'an Jiaotong University, China
Ulster University, UK
University of California, Berkeley, USATokyo University of Science, Japan
Hiroshima University, Japan
National Institute of Advanced Industrial Science and Technology, Japan
Dublin City University, Ireland
University of Maryland, USA
University of Notre Dame, USA
Institute of Physics Belgrade, Serbia
Xi'an Jiaotong University, China
Los Alamos National Laboratory, USA
Ruhr-University Bochum, Germany
Tohoku University, Japan
Hitachi, Ltd., Japan
University of Saskatchewan, CanadaDalian University of Technology, China
Nagoya University, Japan
Yokohama City University, Japan
Tohoku University, Japan
University of Massachusetts Lowell, USA-5-Trieschmann, JanUchida, Giichiro
Veilleux, Jocelyn
Zhang, ChengZhang, Yuantao
Zheng, Bocong

Brandenburg University of Technology, Germany
Meijo University, Japan
Universite de Sherbrooke, Canada
Chinese Academy of Sciences, China
Shandong University, China
Fraunhofer USA Center Midwest, Michigan State University, USA

Workshops:
Industrial plasma technologies
Moriya, Tsuyoshi
Tokyo Electron Limited, JapanKim, Jaeho
Samsung Electronics, Korea
Lee, Dae Hoon
Korea Institute of Machinery and Materials, Korea
Kenney, Jason
Applied Materials, USA
Ohtake, Hiroto
Hitachi High Technologies America, USA
Tatsumi, Tetsuya
Sony Semiconductor Solutions Corporation, JapanPlasma physics for space propulsion technologies
Boswell, RodBoswell Technologies, Australia
Merino, Mario
Universidad Carlos III de Madrid, SpainLittle, Justin
University of Washington, USAFruchtman, Amnon
Holon Institute of Technology, Israel
Mazouffre, Stéphane CNRS - ICARE laboratory, France
Kawashima, Rei
Shibaura Institute of Technology, JapanCho, Shinatora
Japan Aerospace Exploration Agency, Japan
Functional surfaces in plasma elementary and process-applicable reactions
Kurahashi, Mitsunori National Institute for Material Science, Japan
Nakamura, Hiroaki
National Institute for Fusion Science, Japan
Ibano, Kenzo
Osaka University, Japan
Nozaki, Tomohiro
Tokyo Institute of Technology, JapanKim, June YoungSeoul National University, Korea
Stamate, Eugen
Technical University of Denmark, Denmark
Catalytic effects in plasma-liquid interaction
Zhou, Renwu
University of Sydney, Australia
Murakami, Tomoyuki Seikei University, Japan
Shimizu, Naohiro
Nagoya University, Japan
Bogaerts, Annemie
University of Antwerp, Belgium-6-

Contributed Papers
Call for Contributed Papers
Abstracts:
Those who intend to contribute a paper are requested to submit a GEC abstract through the GEC
website (http://www.apsgec.org/gec2022/abstracts.php). The due date for receipt of abstracts is June10, 4 pm US Central Time (9 pm GMT), 2022. The length for the text of the abstract is limited to1300 characters. The title, author(s), and their institutional affiliation(s) are needed for the abstractsubmission. It is essential that abstracts state concisely, but informatively, the objectives, methods,
principal findings, and significance of the work to be presented. The abstracts will be refereed by theGEC Committee, and the authors will be notified of the acceptance of their papers for presentation inAugust, 2022, along with the assignment to specific oral and poster sessions. Post-deadline papers
are NOT acceptable.
Proceedings:
The authors are strongly recommended to submit a paper (up to two-page) for the ICRP proceedings
volume (a two-column, camera-ready form) by June 10, 4 pm US Central Time (9 pm GMT), 2022,
preparedaccordingtoinstructions
thoseappearintheICRP
webpage(https://www.ecei.tohoku.ac.jp/plasma/ICRP-11/submissions_step2.html#page). The conference
proceedings containing invited and contributed papers will be available and are included in theregistration fee. Please be noted that, before the ICRP proceedings paper submission, completion ofGEC abstract submission and acquisition of log number of GEC abstract through the GEC
abstract submission are required.
JJAP Special Issue:
Invited speakers
The invited speakers are invited to submit a manuscript for the special issue of Japanese Journal ofApplied Physics (JJAP) published by IOP Publishing. JJAP accepts original full papers (regularpapers) as well as reviews (progress reviews, recommended). JJAP recognizes speakers in satellite
workshops as invited speakers and accepts their manuscripts. All accepted papers in the special issueof JJAP will be freely available to public for one year.
Contributed presenters
The presenters of contributed for oral or poster presentations are invited to submit an original full
paper for the special issue of JJAP. All accepted papers in the special issue of JJAP will be freely
available to public for one year.
Submission site will be opened at 14 September 2022 (tentative)
Deadline for submissions 31 January 2023
Information of the special issue of JJAP
Authors are requested to read the policy on "Submission of original JJAP papers based on contents
already published in conference proceedings, extended abstracts, or the likes" carefully before paper
submission.
https://journals.jsap.jp/wp-content/uploads/policy.pdf
The link for the template (both for regular paper and progress review):
https://journals.jsap.jp/wp-content/uploads/template-RP.docx-7-Manuscript types in the special issue of JJAP
Progress Reviews: Progress Reviews provide concise, efficient overviews covering the latest
progresses in a specific research area of applied physics. It can include or be largely based on therecent results from the author(s). Manuscripts should be written as concisely as possible although nolimitation on length is specified. Abstract should be no more than 150 words.
Regular Papers: A Regular Paper is an original paper with comprehensive, detailed descriptions of
the research work, presenting a fully developed discussion on the results obtained in relevant fields
of applied physics. It must provide sufficient and self-contained information to ensure therepeatability of experiments and analyses by readers. There is no length limit. The expected numberof references is approximately more than 30. No upper or lower limit is specified.

Social Events
Welcome Reception:
Monday, October 3, 2022.
Banquet:Thursday, October 6, 2022.
Closing Ceremony:
Friday, October 7, 2022.

-8-ICRP Committees
International Organizing Committee
D. LiuI. Murakami

Xi’an Jiaotong University
NIFS

S. Nijdam

Eindhoven University ofTechnology
Dublin City University

A. Bourdon
K. Hensel

Tokyo Metropolitan University
Korea Advanced Institute of
Science and Technology
Technical University ofDenmark
Joint Institute for High
Temperatures
École Polytechnique
Comenius University

M. Hiramatsu
K. Ishikawa
T. Kaneko

Meijo University
Nagoya University
Tohoku University

Y. Sentoku
Y. Setsuhara
M.-J. WangJ. Kenney
A. KumadaK. Kurihara

Applied Materials
The University of TokyoKIOXIA

T. Watanabe
R. White
H. Yoneda

H. J. LeePusan National University

F. Tochikubo（Chair）
W. Choe（Vice-Chair）
E. Stamate（Vice-Chair）
N. Babaeva

D. O'Connell
T. Ohta
O. Sakai

Advisory Committee
U. Czarnetzki
A. Fridman
M. Hori
Y-K. Pu
M. Shiratani
H. Toyoda

Ruhr-Universität Bochum
Drexel University
Nagoya University
Tsinghua University
Kyushu University
Nagoya University

Program Committee
O. Sakai（Chair）
A. ItoT. ItoK. Kamataki
J. Kenney
K. Kurihara
D. LiuI. Murakami
D. O'Connell
T. Ohta
K. Sasaki
E. Stamate
K. Takahashi
H. Tanaka
Y. Tanaka
K. Tomita

University of Shiga Prefecture
National Institute for Fusion Science
The University of Tokyo
Kyushu University
Applied Materials
KIOXIA
Xi’an Jiaotong University
National Institute for Fusion ScienceDublin City University
Meijo University
Hokkaido University
Technical University of Denmark
Tohoku University
Nagoya University
Kanazawa University
Hokkaido University-9-Meijo University
The University of Shiga
Prefecture
Osaka University
Osaka University
National Taiwan Universityof Science and Technology
Kyushu University
James Cook University
The University of ElectroCommunications

Publication Committee
T. Ohta（Chair）
K. Kurihara
S. Nunomura

Meijo University
KIOXIA
National Institute of Advanced Industrial Science and Technology

T. ItoT. Ishijima
K. Takeda
K. Takenaka
A. Ogino
H. Kurita
S. Uchida
N. Kuboi

The University of Tokyo
Kanazawa University
Meijo University
Osaka University
Shizuoka University
Toyohashi University of Technology
Tokyo Metropolitan University
Sony Corporation

Local Organizing Committee
T. Kaneko（Chair）
A. AndoT. SatoN. Ohnishi
M. Shigeta
T. KatoK. Takahashi
T. Okada
H. TakanaK. Takashima
S. Sasaki
K. Ishikawa
H. Komen

Tohoku University
Tohoku University
Tohoku UniversityTohoku University
Tohoku University
Tohoku University
Tohoku UniversityTohoku University
Tohoku University
Tohoku University
Tohoku University
Nagoya University
Osaka University

GEC Committees
GEC Executive Committee Members
J. Schulze (Chair)
S. Rauf (Chair elect)
G. Xu (Past secretary)
T. Kaneko (Secretary)
S. Baalrud (Secretary elect)
A. Derzsi (Treasurer)
K. BeraM. Koepke
M. KushnerS. Quintanilla
S. Reuter
T. Shimizu

University of Bochum
Applied Materials Inc.
University of Alabama in Huntsville
Tohoku University
University of Michigan
Wigner Research Centre for Physics, Hungary
Applied Materials Inc.
West Virginia University
University of Michigan
University of North Texas
Ecole Polytechnique de MontrealNational Institute of Advanced Industrial Science and Technology- 10 -

Hotel Accommodation
There are many hotels in Sendai. We recommend that you make your own reservations at the hotel
reservation websites listed below.

Expedia

Booking.com

TrivagoMap of Hotels:
List of Hotels :List of Hotels :Printed version of map and list of hotels:
https://www.sentia-sendai.jp/conventionnavi-en/wpcontent/themes/theme_convnavi_child/pdf/w2022-sendai_hotels_list-en_202202.pdf*Please note the above map and list of hotels are based on information as of Nov.2021.
- 11 -

VisasFirstly, please complete the advanced registration. Check the "Guide to Japanese VISA" through theURL below.
Ministry of Foreign Affairs of Japan (http://www.mofa.go.jp/j_info/visit/visa/index.html)
Please fill in the necessary documents for your VISA application and send by e-mail to the ICRP-11
Congress Secretariat(E-mail：icrp11@senkyo.co.jp ).
We will complete the documents and send back to you by mail.

Further Information
Details of the scientific program and daily schedule will be given in the third announcement, which
will be posted on ICRP website around September. All questions for further information regarding
this conference should be directed to the Conference Chair.
Also available is the ICRP-11/GEC2022 URL:
https://www.ecei.tohoku.ac.jp/plasma/ICRP-11/index.html
If you know of individuals who may have a paper to contribute and have not received this Second
Announcement and Call for Papers, please bring it to their attention.

Calendar of Events
GEC abstract deadline
Paper deadline for a ICPR proceedings(up to two pages, a two-column, camera-ready form)
Deadline for student travel support
Registration startsNotification of acceptance
Final announcement/program
ICRP-11 / GEC 2022
Papers deadline for JJAP special issue- 12 -June 10, 2022
June 10, 2022
June 10, 2022
July, 2022
August 2022
September 2022
October 3-7, 2022
January, 2023

Travel Information
Tokyo has two international airports, Haneda and Narita, with many international flights, making it
easy to get to Japan from anywhere in the world. There are two daily direct flights from Narita
airport to Sendai. It takes 30 minutes by train from Sendai Airport to downtown Sendai. On theother hand, if you are traveling by train from Narita or Haneda airports, you can take theShinkansen (bullet train) from the respective airports to Sendai via Tokyo Station. It takes 90
minutes from Tokyo Station to Sendai Station by Shinkansen.
Access 1: form Tokyo Airports (Narita/Haneda) to Sendai Station

Access 2: form Sendai Station to the venue- 13 -ICRP-11 Office
Congress Secretariat
E-mail：icrp-11@grp.tohoku.ac.jp
URL：https://www.ecei.tohoku.ac.jp/plasma/ICRP-11/- 14 -