Power Semiconductor Machining Technology

SiC, GaN

Machining Technology
Exihibition 2025
Exhibition
Guideline

2025. March 5 [WED]

7 [FRI] MAKUHARI MESSE

www.sicgan-expo.jp

Introduction
The “SiC,GaN Machining Technology Exihibition 2025” will be held concurrently with “Grinding Technology Japan 2025,” an exhibition specializing in grinding technology.
To realize a carbon-neutral society by 2050, it is essential to promote electrification of the mobility industry (EV) as well as the usage of renewable energy as a main power source,
and the spread of highly-developed power electronics technology using advanced power semiconductors such as SiC and GaN has become the most important factor.
Therefore, mass production and cost reduction of advanced power semiconductor wafers are strongly desired. However, these materials are extremely hard and resistant to heatand chemicals. Processing them is extremely time-consuming, and reducing the high processing cost is an urgent issue.
“SiC,GaN Machining Technology Exihibition 2025” is an exhibition for engineers and technicians involved in the processing of these advanced power semiconductor wafers, aswell as for advanced power semiconductor researchers and those who wish to learn more about them. We believe that exhibitors will be able to provide the best answers withthe latest technology and knowledge to visitors with such issues. “SiC,GaN Machining Technology Exihibition 2025” will feature slicing, grinding, polishing, and CMP processing
technologies related to advanced power semiconductor wafer processing, as well as a variety of wafer evaluation technologies.
“SiC,GaN Machining Technology Exihibition 2025” will be participated in by the Japan Society for Abrasive Technology, which focuses its research on abrasive grain processing,and the Japan Society for Applied Physics Advanced Power Semiconductors, which focuses on advanced power semiconductors such as SiC, GaN, and diamond, as “specialcooperation” organizations.
There is no argument that in addition to technology and skills, theoretical underpinnings are important for advancing advanced power semiconductor wafer processing. At the“SiC,GaN Machining Technology Exihibition 2025,” the Japan Society for Abrasive Technology and other cooperating organizations will provide explanations of processing theory froman academic standpoint and talk about the future of semiconductor wafer processing technology.

Outline
Title
Organizers

SiC,GaN Machining Technology Exihibition 2025
JAPAN INDUSTRIAL PUBLISHING CO., LTD.
Sankei Shimbun Co., Ltd.

Date

March 5 (Wed.) - 7 (Fri.), 2025 (3 days held biennially)

Venue

Makuhari Messe, Hall 7-8

Admission
Collaborating Organization
Exhibition Subjects

Free for holders of invitation card or with pre-registration
The Japan Society for Abrasive Technology / The Japan Society for Applied Physics Advanced Power Semiconductors
SiC / GaN Ingot Slicing Machine, SiC / GaN Wafer Grinding Machine, SiC / GaN Grinding Stones, Wafer Beveling Machine,SiC / GaN Single/Double-Side Lapping Machine, SiC / GaN Chemical, Mechanical Polishing Machine, CMP Slurries for SiC / GaN,Wafer Cleaning System, Wafer Shape Measuring Machine

Visitors Categories

Engineer / Researcher of Bulk Single Crystal Growth for SiC/GaN,
Engineer / Researcher of Wafer Processing Technology for SiC/GaN,
Engineer / Researcher for Diamond Wafers, Engineer / Researcher of Wafer Evaluation Technology, Students etc.

Held at the same time
Exhibition Subjects

Grinding Technology Japan 2025G rinding machines, Polishing machines, Grinding wheels, Truing machines, Precision measuring devices, Peripheral devices, Tool Grinding machines, Cutting
tools, Cutting tools processing technologies, Cutting tools applicated technologies, Cutting oil, Cutting oil supply devices, Cutting oil filters, etc.

Visitors Categories

Engineers, Researchers, Manufacturers, Students and experts specialized in grinding and cutting tool processing technologies

SiC,GaN Machining Technology Exhibition Image
Wafer machining

Slicing

Wafer evaluation

Cleaning

CrystalgrowthPowerdevice
CMP

Grinding

PolishingApplication Deadline

September  30 th, 2024

Booth Specifications and Exhibition Fee
Booth specifications

Layout of booths

1 booth - unit (width 3 m × depth 3 m × height 2.7 m)

The booths can be arranged in five ways – row, block, island (double), island (triple), – to suit theexhibits, the method of installing the booths and special arrange booths.
1 - 9 booths can decorate the booth to a height of 4.0 m. (a one - meter setback from the passage
and from the basic panel can accommodate a decoration of up to 3.6 meters.)

2700

In addition, exhibitors who use an island booth consisting of at least 10 booths can decorate thebooth to a height of 5 m.

Row type2

e dim 970
ensio
n : 29(InsidBlock (double) booths
At least 4 booths

297030)(Inside dimension: 2930)

Floor : No carpeting

Island (double) booth
At least 10 booths

The basic booth shall be set up according to system panel specifications,and the rear and side walls shall be installed by the organizer.

Island (triple) booths
12, 15, or 18 booths
At least 12 booths

Special arrange booths
At least 20 booths(180m2)

Exhibition fee
418,000 yen (including tax)

Exhibition fee (per booth)Turnkey Booth PackageA simple and quick booth package plan is available
Parapet, reception counter, carpet, lighting (fluorescent 20 W × 1
light, spotlights 15W × 2 lamps), 1 foldable chair, business card
drop-box × 1, company name display, brochure stand (A4 size /12 shelf), electric power use up to 1 kW included (higher power
consumption charged separately) usage fees, outlet × 1.

Exhibition fee + 158,400 yen (including tax)

Exhibitor Presentation
Exhibitor Presentation provides exhibitors with opportunities to introduce their products and the latest technologies at the conference room provided
in the exhibition hall. Inviting your prospective customers to the presentation is obviously an excellent way of not only introducing your products ortechnologies, but also promoting your corporate image for many visitors.

Participation Fee : 1 session (45 minutes)

55,000 yen (including tax)

*For further details and application, please visit the official website.

Web BannerHighlight your presence beforehand with a Link Banner on our Official Website
Dates:

From February 5 to April 7, 2025 [TBC]

Publishing fee:

55,000 yen (including tax)

Banner size:

W200px × H40px GIF format (can be animated)

Data reception deadline:

January 17, 2025 ※ for final version data at the above size

ScheduleSptember 30 (Mon.), 2024

Application Deadline

Early December 2024

Release of the Floor Plan and Exhibitor Manual※The Exhibitor Manual includes application forms for display package equipment,electricity. etc.

During December 2024

Dispatch of Invitation cards※We will send the requested amount of Invitation cards for free(Invitation cards in English will be available in PDF only.)

Middle January 2025Deadline for diverse services (Electricity, Rental furniture, etc.)※All application forms will be enclosed in the Exhibitor Manual.

March 2 (Sun.)- March 4 (Tue.), 2025

Booth construction, decoration setting-up

March 5 (Wed.) - 7 (Fri.), 2025

Exhibition

March 7 (Fri.), 2025

Removal(17:00 - 21:00)

8 (Sat.)Removal(9:00 - 17:00)

May, 2025

Exhibition Report

AccessBy public transportation
By Train

MAKUHARI MESSE●Approx. 30 minutes from Tokyo Station or 12 minutes
from Soga Station to Kaihim Makuhari Station on the JR
Keiyo Line. 5 minutes walk to Makuhari Messe.
●Approx. 40 minutes from Akihabara Station to Makuhari
Hongo Station on the JR Sobu Line. 15 minutes by bus toMakuhari Messe.

2-1, Nakase, Mihama-ku, Chiba-shi, Chiba 261-8550, Japan
Phone : +81-43-296-0001

https://www.m-messe.co.jp/en/
MINAMI URAWA

JR MUSASHINO LINE

By Bus

SHIN-MATSUDO●Limousine Bus services from both Tokyo international
Airport (Haneda) and Narita International Airport areavailable.

JR TAKASAKI-LINE &TOHOKU-LINE
JR JOBAN-LINE

AKABANEIKEBUKURONISHIKOKUBUNJI

JR SOBU-LINE
EXPRESSJR YAMANOTE-LINE

NAKANONARITAAIRPORTKEISEI-LINEUENO

AKIHABARAOCHANOMIZUKINSHICHOSHINJUKU

JR SOBU-LINE
ICHIGAYATOKYOJR CHUO-LINEOSAKISHINKIBASHINAGAWA

JR KEIYO-LINE
MAIHAMAICHIKAWASHIOHAMANARITANISHIFUNABASHI
KEISEITSUDANUMATENNOZU ISLETOKYO MONORAIL

JR YOKOSUKA-LINE

HANEDAAIRPORT

MAKUHARIHONGOMINAMIFUNABASHI

RINKAI-LINE
OIMACHIJR SOBU-LINE

TSUDANUMA

KAIHINMAKUHARI

MAKUHARI MESSE
CHIBA
MINATOTOKYO BAY

YOKOHAMACHIBACHIBA URBAN
MONORAILCHIBACHUOSOGAKISARAZU

KEIKYU-LINE

Application/Inquiries

Sankei Shimbun Co., Ltd.
1-7-2 Otemachi, Chiyoda-ku, Tokyo 100-8125, Japan TEL: +81-3-3273-6180 FAX: +81-3-3241-4999 E-mail: sicgan@sankei.co.jp