Technical Information Bulletin
Powders and Products

CuLox Lead-Free - Solder Powder
CuLox Fines
2103, 2105, 2405
CuLox Intermediates
2110, 2120, 2410, 2420

Description

High purity, high density gas atomized powder made principally for the electrical and electronic industry.
High cooling rates eliminate micro-segregation commonly found in powders processed by traditional
ultrasonic methods. Lack of segregation as seen in the SEM images of powders improve sintering and reflow characteristics. Standard fluxes can be used in paste formulations without compromising re-flow
characteristics.

PurityOverall chemistry, and purity are tightly controlled as are oxygen levels which vary as function of size.
Typicalimpuritie
sSize and Properties

PPbSbZnCN

O2<0.001<0.005<0.005<0.009<0.005<0.0050.02-0.2

Physical Properties

21xx

24xx

Particle ShapeSphereSphereBy Size 3, 5, 10, 20
By Type 8, 7, 6, 5

By Size 5, 10, 20
By Type 7, 6, 5

Size Distribution

Narrow

Narrow

Surface Area (m2/g)

0.05-0.4 m2/g

0.05-0.4 m2/g

Med. Size (Micron)(Refer to Main Document)

Typical Distribution
Chart

Typical SEMs

Conventional
Powder - Shows
Micro-segregation

CuLox Powder Shows Lack ofMicro-segregations

CuLox Technologies, Inc.believes the information contained herein to be complete and reliable However, no guarantee or warranty of any kind express or implied is made with respect to the information contained herein. CuLox
assumes no responsibility for the results from the use of these products and processes. It is also not responsible for damages incurred from the use of the information in whole or in part. Statements and recommendations madeherein are not to be construed as inducements to infringe on any relevant patent in existence now or hereafter.

日本総代理店 ㈱ニューメタルス エンド ケミカルス コーポレーション
電子材料部/水戸 E-mail: mmito@newmetals.co.jp Tel:06-6202-5108 Fax:06-6223-0987

Technical Information Bulletin
Solder Powders Used in Electronics (Lead-Free)

Powders and Products

The trend in the electronic industry towards increased packaging density requires the use of solder pastes thatcan be deposited at fine pitch with greater dimensional control. This requirement dictates the size of powders tobe used for solder paste formulations. Physical attributes of powders such as its shape, morphology and size
distribution affect metal loading, paste rheology and its reflow characteristics. Control of chemical impurities
and oxygen content is required as these can adversely affect the metallurgical quality of the bond formed after
the reflow operation.
CuLox offers most commonly used lead-free solder powder compositions for paste formulations. Our powders
are spherical and practically satellite free. The size cuts for all the grades are sharp and narrow. Overallchemistry, and particularly, the oxygen content are tightly controlled at various stages of manufacturing. Specialcare is taken in packaging, storage and transportation.

Lead-Free Nominal Compositions (actual composition based upon customer specification)
Type 2100:
Type 2400:

Sn/ 3.0 Ag/ 0.5 Cu (SAC 305)
Sn/Bi-- (42Sn-58Bi)

Type 2400M:

Sn/Bi-- (60Sn-40Bi)

Size Distribution
Sieve analysis method of determining particle size distribution lacks the accuracy and precision that is required
to adequately characterize powders for solder paste applications. This is especially true as particle size getssmaller (45 micron and finer). CuLox uses a Laser Diffraction Technique (Microtrac analysis) to determine
powder particle size distribution.
The chart below shows CuLox designations based on median size (D50) for solder powders using Microtrac
analysis and the equivalent powder type per IPC standard J-STD-006A.
CuLox Designations Based on Powder Median Size
160
140130120110
Micron Range

Intermediate

Coarse150100
90FineSieve
Analysis

Microtrac Analysis:

Mesh Size:
T1: 100/200
T2: 200/325

D10 Bottom Line
D50 Middle Line
D90 Top Line

Powder Nomenclature
Powder designations arebased on the composition
type (XX) and median sizein micron (YY) byMicrotrac.

80
7060

XXYY
2 1 3 0 (example)

60

5040353021 = Sn/4.0 Ag/0.5 Cu
30 = median size in micron

30
2520

20

1015

100T1T2T3T4T505

T6

Equivalent Powder Type (IPC Designations)日本総代理店 ㈱ニューメタルス エンド ケミカルス コーポレーション
電子材料部/水戸 E-mail: mmito@newmetals.co.jp Tel:06-6202-5108 Fax:06-6223-0987