SM-560N-H

Low-Flow Prepreg(IPC-4101/130)

尚茂電子材料股份有限公司
ShineMore Technology Materials Co., Ltd.
Website: http://www.shinemore.com.tw
ANSI: FR-4.1
Version B

UL FILE: E199230

Updated: 05/23/2017

Green Material■ High Tg and Halogen Free Low-Flow Prepreg

SM-560N-H is specifically designed for rigid-flex PCB structure, multilayer FPC, as well as forCoreless Build-Up type for IC substrate manufacturing. Featured with characteristics of low-flow,
halogen free, good thickness uniformity and flatness, SM-560N-H prepreg consisting of optimal resin
flow also provides excellent bonding force with a variety of polyimide materials. Fully cured
SM-560N-H provides strong bonding force with PI coverlay in rigid-flex PCB product. In addition,
SM-560N-H performs well for multiple-layered rigid-flex bonding, sequential lamination, and fullycomplied with lead-free requirement. Aiming to be compatible with punch process, we intentionallyformulate SM-560N-H with minimized dust generation during PCB processes.
■ Performance And Processing Advantages

 Stable resin flow
 Low resin powder dust generation
 Halogen-free compatible
 Lead-Free compatible
 Reduced Z-axis thermal expansion
 Excellent bonding strength with polyimide materials
 Superior dimensional stability, thickness uniformity and flatness
 Good drilling processability
 Excellent through-hole and soldering reliability Compatible with AOI process, owing to designed-in UV-block function■ Industry Approvals

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UL Designation-ANSI GradeUL File NumberFlammability Rating
Maximum Operating Temperature

FR-4.1E199230
UL94 V-0130℃

■Standard Availability

Thickness: from 0.0012” (30μm) 1027 type × 1 ply to 0.0043” (110μm) 3313 GF × 1 ply

Availability: both in roll or panel form
SM-560N-H made of very fine glass fabrics of 1017 type might be available upon customer
needs and commercial-available GF resources
Prepregs with other glass fabrics type, resin content or resin flow-in scale may be available
upon customer request

Property of Cured SM-560N-H Prepreg
Test Items

Condition

Dielectric Constant (1GHz)--

Volume ResistivityMΩ -cmSurface ResistivityMΩC-96/35/90

Moisture absorption%

Peel strength (PI Side)

Dissipation Factor (1GHz)

ThermalPhysicalElectricalTest

Units--

3313

2.5.5.9

2.6.2.1

lb/in

As Received

7

2.4.8

Peel strength (0.5oz)

lb/in

As Received

7

2.4.8

Glass Transition Temp

℃

DSC

185

2.4.25Z-axis CTE--TMA (50-260℃)

2.2%

2.4.24

Thermal resistancemin.

TMA (T288℃)> 60

2.4.24.1

Decomposition Temp℃

ASTM D3850

370

2.4.24.6

Thermal stresssec

288℃ Solder dipping＞120

2.4.13.1

Flammability---A＆E-24/125

V-0UL9464±31078

2.5.5.9<0.21037
1067

0.015

(IPC-TM-650)

E-24/50+d-24/23R/C(%)

59±370±368±364±355±3

Flow In

C-96/35/90

4.5

Test Method

2.5.17.1

G/F

106

C-96/23/50

Typical Value> 109

Standard Prepreg Specification :1027

C-96/23/50

Based on 0.5 t H/H

(mil)

20～40
20～40
20～40
20～40
20～40
20～40

> 107

2.5.17.1

V/C(%)THK (μm)≦ 1.5

40 ± 10

≦ 1.5
≦ 1.5
≦ 1.5
≦ 1.5
≦ 1.5

30 ± 1050 ± 1060 ± 1080 ± 10110 ± 10Prepreg Press Condition
Hot Start Cycle for SM- 560N-H

For Multi-layered Rigid-Flex PCB,
A recommended press cycle is listed as follows,
1. Material heating ROR (Rate of Rise) 2–4℃/min﹐
2. Material cured temperature ≧ 180℃﹐Curing Time ≧ 90 min
3. Vacuum condition should be continued until over 140℃ (material temperature)

4. Pressure Profile: Start with kiss pressure of 100-150 psi for 5-15 minutes, and thenapply full pressure of around 400 psi (lamination pressure)Ordering Information：◎ Phone：+886-3-386-4289◎ Email：sales@shinemore.com.tw
NOTE:

1. Typical Property values are for information purposes only.

2. Any sale of these products will be governed by the terms and conditions of the agreement under which they are sold.

3. Press cycle shown above is a convenient example. The optimum press cycle still depends on product structure andactual situation in production line.