DATA SHEETQPICPACKAGING MODULEQPICPAC Developed

QPIC
Packaging Module

The QPICPAC multi-fibre Photonic Integrated Circuit (PIC) module is a standardized, hermetic, short lead time, costeffective, packaging solution with up to 8 fibres which can be used for both standard PICs or Quantum PICs (QPICs). It
is ideal for early PIC industrial trial and evaluation testing, full system testing, in addition to production volumes. These(Q)PIC packages are assembled using Alter Technology UK’s advanced techniques that employ high reliability telecoms
manufacturing processes to minimize size and maximize stability and reliability.
SENKO supplies low-loss cable assemblies to Alter for the (Q)PIC packages. Cables incorporate single-mode opticalfibre that is terminated at the (Q)PIC with SENKO’s Metallic PIC Connector (MPC) using CudoFormTM high-precision metalstamping. The cable is connectorized outside the hermetic package with SENKO’s low-loss MPO connectors or fanoutto FC/APC connectors. SENKO’s CudoFormTM MPC assemblies have been employed during the testing and developmentof the design template and offer advantages over traditional fibre arrays.
Options include up to 8 fibres using single-mode fibre or ribbon along with a wide choice of single or multi-channel
optical connectors. Process Design Kits (PDKs) are available from SENKO or Alter for planning the QPICs compatibility
with an MPC.

FEATURES• Hermetically sealed for high reliability applications withup to 8 channels using single or ribbon fiber(s)• Integrated TEC and temperature sensor for precisioncontrol in harsh environments• Manufactured using high reliability telecoms process

APPLICATIONS• Automotive LIDAR• Telecoms• Space• Quantum technology• PIC test and validation• Ultra low loss
• Templates available to simplify deployment• Compatible with most (Q)PIC designs• Use of SENKO’s CudoFormTM MPC technology• Short leadtime in industrial packages for in-situ
application testing a multi-channel PIC

KEY BENEFITS

Turn-key (Q)PIC solution
Support from industry leadersLow, medium and high production runs

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QPIC PACKAGING MODULEQPICPAC developed

QPICPAC DATA SHEETSpecification
Value
Wavelength
Typical 3 dB BandwidthC-band (60 nm), C-band-100 (>100 nm)

Fibre Connects

Up to 8 fibres

Channel Pitch

250 µm standard (≤ 8CH SENKO CudoFormTM FVA)

Fibre TypeSM (ribbon or singulated, connector dependent)

Optical Connectivity

SENKO CudoFormTM MPC (Metallic Pic Connector), or SENKO regular FVA

Fibre Lengths

1000 mm typicallyConnector

FC/APC or MPO typically (others on request – SC, LC etc.)

PIC CouplingHigh performance grating couplers
C-band or C-band-100

Insertion Loss

< 3 dB (C-band), < -4.5 dB (C-band-100) (device and design dependant)

RFTemperature Control

Up to 30 GHz – 8x signal pins available (4x GSGSG pin array)
TEC * and 10K thermistor built in

TEC Power

5.2 W (single TEC) *Drive Current< 5 Amps*

Operating Temperature Range*C-band (1530 – 1565 nm), C-band-100 (1500 – 1600 nm)-5 °C to +65 °C typicalThe IP rating was validated using a SENKO sourced cable and termination procedure. It is recommended to retest IP rating for any other cable types.

3QPIC PACKAGING MODULEQPICPAC developed

QPICPAC DATA SHEETQPICPAC Example ConfigurationOverall View

Side View
Note: 1. All dimensions are in mm
2. Specifications subject to change without notice
3. Fibers and Connectors hidden for clarity
4. PIC must be designed and fabricated with the Cornerstone Wave Photonics QPICPAC PDK, available for download upon request

Innovation through Collaboration

ORDERINGTYPE
QPICPAC

QPIC
Packaging Module

Note: The (Q)PIC must be designed and fabricatedwith the Cornerstone – Wave Photonics QPICPAC
PDK, available for download on request.

Contact QPICPAC@Senko.com
for availability and to learn more

Contact
SENKO

THIS PRODUCT MAY BE PROTECTED BY ONE OR MORE PATENTS. FOR FURTHER INFORMATION, PLEASE VISIT SENKO.COM/PATENTS

4QPIC PACKAGING MODULEQPICPAC developed

QPICPAC DATA SHEETQPICPAC MPC Connectivity OptionsMPC

MPO Front View
CH1-2 DARK

4.25
MPO Key

3.03

CH1 BLUE

3.2

CH3-10 FIBER

Scale 2:1
(Angle 8° polish)

CH11-12 DARKScale 4: 1

MPO ASSEMBLY
Hermetic
Feedthrough

MPC

Breakout CableC

20±5

Key Up900um white hytrel UL94-V0 loose tube
5Number Ring

FC/APC Assembly
HermeticFeedthrough

MPC

1FC/APC-12FC/APC-2

Fanout Kit……

C

20±5(5)(30)(5)7

FC/APC-78

FC/APC-8

400±5015±5(37)60±5Note: 1. All dimensions are in mm
2. Specifications subject to change without notice
3. Fibers and Connectors hidden for clarity
4. PIC must be designed and fabricated with the Cornerstone Wave Photonics QPICPAC PDK, available for download upon request

ORDERINGTYPE
QPICPAC

QPIC
Packaging Module

Note: The (Q)PIC must be designed and fabricatedwith the Cornerstone – Wave Photonics QPICPAC
PDK, available for download on request.

Contact QPICPAC@Senko.com
for availability and to learn more

Contact
SENKO

THIS PRODUCT MAY BE PROTECTED BY ONE OR MORE PATENTS. FOR FURTHER INFORMATION, PLEASE VISIT SENKO.COM/PATENTS

sales-americas@senko.com
1-858-623-3300
sales-europe@senko.com+44(0)1256-700880

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