EPO-TEK® H20S
Technical Data Sheet
For Reference Only
Electrically Conductive, Silver Epoxy for Die Stamping

Date:
Rev:
No. of Components:
Mix Ratio by Weight:
Specific Gravity:
Pot Life:
Shelf Life- Bulk:

November 2019
XIIITwo
1:1
Part A: 1.74
Part B: 3.07
3 Days
One year at room temperature

Recommended Cure: 150°C / 1 Hour
Minimum Alternative Cure(s):May not achieve performance properties listed below
150°C / 5 Minutes
120°C / 15 Minutes
100°C / 45 Minutes
80°C / 90 Minutes

NOTES:● Container(s) should be kept closed when not in use.
● Filled systems should be stirred thoroughly before mixing and prior to use.
● Performance properties (rheology, conductivity, others) of the product may vary from those stated on the data sheet when bi-pak/syringe packaging or
post-processing of any kind is performed. Epoxy’s warranties shall not apply to any products that have been reprocessed or repackaged from Epoxy’s
delivered status/container into any other containers of any kind, including but not limited to syringes, bi-paks, cartridges, pouches, tubes, capsules, films
or other packages.

Product Description: EPO-TEK® H20S is a modified version of EPO-TEK® H20E, designed primarily for die stamping anddispensing techniques for chip bonding. EPO-TEK® H20S is a highly reliable, two component, silver-filled epoxy with a smooth,thixotropic consistency. In addition to the high electrical conductivity, the short curing cycles, the proven reliability, and the convenient
mix ratio, EPO-TEK® H20S is extremely simple to use.
Typical Properties: Cure condition: 150°C / 1 Hour
Different batches, conditions & applications yield differing results.
Data below is not guaranteed. To be used as a guide only, not as a specification. * denotes test on lot acceptance basis
PHYSICAL PROPERTIES:* Color (before cure):* Consistency:* Viscosity (23°C) @ 100 rpm:
Thixotropic Index:* Glass Transition Temp:
Coefficient of Thermal Expansion (CTE):
Below Tg:
Above Tg:
Shore D Hardness:
Lap Shear @ 23°C:
Die Shear @ 23°C:
Degradation Temp:
Weight Loss:@ 200°C:@ 250°C:@ 300°C:
Suggested Operating Temperature:
Storage Modulus:
Ion Content:

Part A: Silver
Part B: Silver
Smooth thixotropic paste
1,800 - 2,800 cPs
5.0≥ 80 °C (Dynamic Cure: 20-200°C/ISO 25 Min; Ramp -10-200°C @20°C/Min)
31120
64
1,240
≥5414

x 10-6 in/in°C
x 10-6 in/in°C
psiKg°C

1,778 psi

* Particle Size:

0.40
0.60
1.37
< 300339,720
162 ppm
282 ppm≤ 20%%%°C (Intermittent)
psi
Na+:
0 ppm
K+:
4 ppm
microns

ELECTRICAL AND THERMAL PROPERTIES:
Thermal Conductivity:* Volume Resistivity @ 23°C:

3.3≤ 0.0005

W/mK
Ohm-cmCl-:
NH4+:Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com

EPO-TEK® H20S
Technical Data Sheet
For Reference Only
Electrically Conductive, Silver Epoxy for Die Stamping

EPO-TEK® H20S Advantages & Suggested Application Notes:● Especially recommended for use in high speed epoxy chip bonding systems where fastcures are highly desirable.
● Suggested for JEDEC Level III and II plastic IC packaging.
● The low temperature cure makes it ideal for flex circuitry and other low stressapplications.
● It is used extensively for bonding quartz crystal oscillators and other stress sensitive
chips.
● Used for die and SMD bonding inside hybrid/hermetic packages such as DIP and TOCans; also EMI/Rf shielding of micro-electronics.
● Ideal for making ITO electrical contacts in LCD packaging; and suggested for LED dieattach.

Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com