SM-560N

Low-Flow Prepreg(IPC-4101/128)

尚茂電子材料股份有限公司
ShineMore Technology Materials Co., Ltd.
Website: http://www.shinemore.com.tw
ANSI: FR-4.1
Version H

UL FILE: E199230

Updated: 01/26/2017

Green Material■ Middle Tg and Halogen Free Low-Flow Prepreg

SM-560N is specifically designed for rigid-flex PCB structure, as well as for Coreless Build-Up typefor IC substrate manufacturing. Featured with characteristics of low-flow, halogen free, and goodthickness uniformity and flatness, SM-560N prepreg consisting of optimal resin flow also provides
excellent bonding force with a variety of polyimide materials. Fully cured SM-560N provides strong
bonding force with PI coverlay in rigid-flex PCB product. In addition, SM-560N performs well formultiple-layered rigid-flex bonding, sequential lamination, and fully complied with lead-freerequirement. Aiming to be compatible with punch process, we intentionally formulate SM-560N withminimized dust generation during PCB processes.
■ Performance And Processing Advantages

 Stable resin flow
 Low resin powder dust generation
 Halogen-free compatible
 Lead-Free compatible
 Excellent bonding strength with polyimide materials
 Superior dimensional stability, thickness uniformity and flatness
 Good drilling processability
 Excellent through-hole and soldering reliability Compatible with AOI process with UV-block function■ Industry Approvals

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UL Designation-ANSI GradeUL File Number
Flammability Rating
Maximum Operating Temperature

FR-4.1
E199230
UL94 V-0130℃

■Standard AvailabilityThickness: from 0.0012” (30μm) 1027 type × 1 ply to 0.0043” (110μm) 3313 GF × 1 ply

Availability: both in roll or panel form
SM-560N made of very fine glass fabrics of 1017 type might be available upon customer
needs and commercial-available GF resources
Prepregs with special glass fabrics or resin content may be available upon customer request

Property of Cured SM-560N Prepreg
TestUnits

Condition

Typical Value

Test Method(IPC-TM-650)

Dielectric Constant (1GHz)--

C-96/23/50

4.5

Dissipation Factor (1GHz)--

C-96/23/50

0.015

2.5.5.9

Volume ResistivityMΩ -cmC-96/35/90> 109

2.5.17.1

Surface ResistivityMΩC-96/35/90> 107

2.5.17.1

Moisture absorption%

E-24/50+d-24/23<0.2

2.6.2.1

Peel strength (PI Side)

lb/in

As Received

7

2.4.8

Peel strength (0.5oz)

lb/in

As Received

72.4.8Glass Transition Temp

℃

DSC

>150

2.4.25

Thermal resistancemin.

TMA (T288℃)> 60

2.4.24.1

Decomposition Temp℃

ASTM D3850

370

2.4.24.6

Thermal stresssec

288℃ Solder dipping＞120

2.4.13.1

Flammability---A＆E-24/125

V-0

UL94

ThermalPhysicalElectrical

Test Items

Based on 0.5 t H/HStandard Prepreg Specification :G/F

R/C(%)

1037

64±3

1027
10610671078
3313

59±370±368±364±355±3

Flow In(mil)

20～40
20～40
20～40
20～40
20～40
20～40

2.5.5.9

V/C(%)THK (μm)≦ 1.5

40 ± 10

≦ 1.5
≦ 1.5
≦ 1.5
≦ 1.5
≦ 1.5

30 ± 1050 ± 1060 ± 1080 ± 10110 ± 10Prepreg Press Condition
Hot Start Cycle for SM- 560N

For Multi-layered Rigid-Flex PCB,
A recommended press cycle is listed as follows,
1. Material heating ROR (Rate of Rise) 2–4℃/min﹐
2. Material cured temperature ≧ 160℃﹐Curing Time ≧ 70 min
3. Vacuum condition should be continued until over 140℃ (material temperature)

4. Pressure Profile: Start with kiss pressure of 100-150 psi for 5-15 minutes, and thenapply full pressure of around 400 psi (lamination pressure)Ordering Information：◎ Phone：+886-3-386-4289◎ Email：sales@shinemore.com.tw
NOTE:

1. Typical Property values are for information purposes only.

2. Any sale of these products will be governed by the terms and conditions of the agreement under which they are sold.

3. Press cycle shown above is a convenient example. The optimum press cycle still depends on product structure andactual situation in production line.