EPO-TEK® H77
Technical Data Sheet
For Reference Only
Thermally Conductive Epoxy

Date:
Rev:
No. of Components:
Mix Ratio by Weight:
Specific Gravity:
Pot Life:
Shelf Life- Bulk:
Shelf Life- Syringe:

Recommended Cure: 150°C / 1 Hour

July 2019
VITwo
100 : 15
Part A: 2.70
Part B: 1.22
6 Hours
One year at room temperature
Six months at -40°C

Minimum Alternative Cure(s):May not achieve performance properties listed below
2-Step Cure: 100°C / 1 Hour then 120°C / 2 HoursNOTES:● Container(s) should be kept closed when not in use.
● Filled systems should be stirred thoroughly before mixing and prior to use.
● Performance properties (rheology, conductivity, others) of the product may vary from those stated on the data sheet when bi-pak/syringe packaging or
post-processing of any kind is performed. Epoxy’s warranties shall not apply to any products that have been reprocessed or repackaged from Epoxy’s
delivered status/container into any other containers of any kind, including but not limited to syringes, bi-paks, cartridges, pouches, tubes, capsules, films
or other packages.
● Syringe packaging will impact initial viscosity and effective pot life, potentially beyond stated parameters.

Product Description: EPO-TEK® H77 is a two component, thermally conductive, electrically insulating epoxy system designed for lidsealing of hybrids found in hermetic packaging of micro-electronics. Lids can be ceramic, glass, aluminum or kovar. Package types
can be plastic, metal cases, or ceramic.
Typical Properties: Cure condition: 150°C / 1 Hour
Different batches, conditions & applications yield differing results.
Data below is not guaranteed. To be used as a guide only, not as a specification. * denotes test on lot acceptance basis
PHYSICAL PROPERTIES:* Color (before cure):* Consistency:* Viscosity (23°C) @ 20 rpm:
Thixotropic Index:* Glass Transition Temp:
Coefficient of Thermal Expansion (CTE):
Below Tg:
Above Tg:
Shore D Hardness:
Lap Shear @ 23°C:
Die Shear @ 23°C:
Degradation Temp:
Weight Loss:@ 200°C:@ 250°C:@ 300°C:
Suggested Operating Temperature:
Storage Modulus:* Particle Size:

Part A: Grey
Part B: Amber
Smooth pourable paste
6,000 - 12,000 cPs
1.4≥ 80 °C (Dynamic Cure: 20-200°C/ISO 25 Min; Ramp -10-200°C @20°C/Min)

ELECTRICAL AND THERMAL PROPERTIES:
Thermal Conductivity:
Volume Resistivity @ 23°C:
Dielectric Constant (1KHz):
Dissipation Factor (1KHz):

33130
90
1,523
≥5405

x 10-6 in/in°C
x 10-6 in/in°C
psi
Kg
°C

1,778 psi

0.15
0.38
1.47
< 350950,693≤ 50%%%°C (Intermittent)psimicrons0.7≥ 1 x 1013
5.64
0.006

W/mK
Ohm-cmEpoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com

EPO-TEK® H77
Technical Data Sheet
For Reference Only
Thermally Conductive Epoxy

EPO-TEK® H77 Advantages & Suggested Application Notes:● High temperature epoxy. Coatings on metals have been subjected to temperatures ashigh as 260°C without bond failure; can also resist >300°C processes found in ceramic or
hermetic packaging● Rheology provides a soft, smooth, flowing paste with excellent handling characteristics;
low viscosity allows it to be poured or cast into shape for potting applications; compatible
with automated dispense equipment, screen printing, or stamping techniques.
● Available in smaller particle size, if needed. Also available in higher viscosity for better
non-flow properties. Contact techserv@epotek.com for your best match.
● Excellent solvent and chemical resistance - ideal for harsh environments found in aircraft,under-hood automotive, medical, and petrochemical refineries such as down-holeapplications.
● Can provide near hermetic seals in the packaging of MEMs devices, like pressure
sensors or accelerometers, packaged in TO-cans.
● Passes NASA low outgassing standard ASTM E595 with proper cure http://outgassing.nasa.gov/.
● Suggested for ultra-high vacuum applications.
● It can also be used for sealing of optical filter windows found in scientific OEM or sensor
devices.

Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com