EPO-TEK® T905BN-4
Technical Data Sheet
For Reference Only
Thermally Conductive Epoxy

Date:
Rev:
No. of Components:
Mix Ratio by Weight:
Specific Gravity:
Pot Life:
Shelf Life- Bulk:
Shelf Life- Syringe:

Recommended Cure: 80°C / 1 Hour

July 2019
IVTwo
100 : 25
Part A: 1.63
Part B: 1.16
1 Hour
One year at room temperature
Six months at -40°C

Minimum Alternative Cure(s):May not achieve performance properties listed below
23°C / 24 HoursNOTES:● Container(s) should be kept closed when not in use.
● Filled systems should be stirred thoroughly before mixing and prior to use.
● Performance properties (rheology, conductivity, others) of the product may vary from those stated on the data sheet when bi-pak/syringe packaging or
post-processing of any kind is performed. Epoxy’s warranties shall not apply to any products that have been reprocessed or repackaged from Epoxy’s
delivered status/container into any other containers of any kind, including but not limited to syringes, bi-paks, cartridges, pouches, tubes, capsules, films
or other packages.
● Syringe packaging will impact initial viscosity and effective pot life, potentially beyond stated parameters.

Product Description: EPO-TEK® T905BN-4 is a two component, room temperature cure, thermally conductive epoxy for generaladhesive bonding, sealing, potting and encapsulation applications.
Typical Properties: Cure condition: 80°C / 1 Hour
Different batches, conditions & applications yield differing results.
Data below is not guaranteed. To be used as a guide only, not as a specification. * denotes test on lot acceptance basis
PHYSICAL PROPERTIES:* Color (before cure):* Consistency:* Viscosity (23°C) @ 20 rpm:
Thixotropic Index:* Glass Transition Temp:
Coefficient of Thermal Expansion (CTE):
Below Tg:
Above Tg:
Shore D Hardness:
Lap Shear @ 23°C:
Die Shear @ 23°C:
Degradation Temp:
Weight Loss:@ 200°C:@ 250°C:@ 300°C:
Suggested Operating Temperature:
Storage Modulus:* Particle Size:

Part A: White
Granular paste
12,000-18,000
2.6
≥ 50

ELECTRICAL AND THERMAL PROPERTIES:
Thermal Conductivity:
Volume Resistivity @ 23°C:
Dielectric Constant (1KHz):
Dissipation Factor (1KHz):

24120791,412≥5350

Part B: Light mauve
cPs°C (Dynamic Cure: 20-200°C/ISO 25 Min; Ramp -40-200°C @20°C/Min)
x 10-6 in/in°C
x 10-6 in/in°C
psi
Kg°C

1,778 psi

0.18
0.64
1.44
< 3001,152,068≤ 300%%%°C (Intermittent)psimicrons

1.8≥ 4 x 1014
3.82
0.012

W/mK
Ohm-cmEpoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com

EPO-TEK® T905BN-4
Technical Data Sheet
For Reference Only
Thermally Conductive Epoxy

EPO-TEK® T905BN-4 Advantages & Suggested Application Notes:● A moderate viscosity resin with flowing properties enables potting of cavities, packages
and housings.
● Contains a coarse grade of filler, which needs to be taken into account in all bonding,sealing and potting applications. Contact techserv@epotek.com to review your choice.
● Pure white color after cure allows for easy inspection by operators on common electronic
packaging surfaces.
● Versatility in cure: 23ºC and 100ºC ambient, box oven or tunnel oven processes.
● Suggested Applications:o Hybrids: Thermally conductive adhesive bonding ceramics and metals.
o Electronics:▪ General PCB level potting and adhesive applications. Bonding metal andcomposite heat sinks to PCBs or SMDs.
▪ Transformers: potting of Cu coils, magnets, inductors and other SMDs into theirrespective casing.
o Medical Devices: Heat sinking of x-ray and ultrasound circuits via adhesive andpotting processes.

Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com