EPO-TEK® H35-175MP
Technical Data Sheet
For Reference Only
Electrically Conductive, Silver Epoxy

Date:
Rev:
No. of Components:
Mix Ratio by Weight:
Specific Gravity:
Pot Life:
Shelf Life- Bulk:

Recommended Cure: 180°C / 1 Hour

January 2020
XSingleN/A
3.07
28 Days
One year at -40°C

Minimum Alternative Cure(s):May not achieve performance properties listed below
165°C / 1.5 HoursNOTES:● Container(s) should be kept closed when not in use.
● Filled systems should be stirred thoroughly before mixing and prior to use.
● Performance properties (rheology, conductivity, others) of the product may vary from those stated on the data sheet when bi-pak/syringe packaging or
post-processing of any kind is performed. Epoxy’s warranties shall not apply to any products that have been reprocessed or repackaged from Epoxy’s
delivered status/container into any other containers of any kind, including but not limited to syringes, bi-paks, cartridges, pouches, tubes, capsules, films
or other packages.
● Complies with the requirements of MIL-STD 883/Method 5011.

Product Description: EPO-TEK® H35-175MP is a single component, silver-filled epoxy for hybrid die and component attach.
Typical Properties: Cure condition: 180°C / 1 Hour
Different batches, conditions & applications yield differing results.
Data below is not guaranteed. To be used as a guide only, not as a specification. * denotes test on lot acceptance basis
PHYSICAL PROPERTIES:* Color (before cure):* Consistency:* Viscosity (23°C) @ 10 rpm:
Thixotropic Index:* Glass Transition Temp:
Coefficient of Thermal Expansion (CTE):
Below Tg:
Above Tg:
Shore D Hardness:
Lap Shear @ 23°C:* Die Shear @ 23°C:Degradation Temp:
Weight Loss:* @ 200°C:@ 250°C:@ 300°C:
Suggested Operating Temperature:
Storage Modulus:* Ion Content:

Bright Silver
Smooth thixotropic paste
22,000-28,000 cPs
4.0≥ 100 °C (Dynamic Cure: 20-300°C/ISO 25 Min; Ramp -10-200°C @20°C/Min)
3197
83> 2,000≥ 10372

Cl-:
NH4+:

* Particle Size:
ELECTRICAL AND THERMAL PROPERTIES:
Thermal Conductivity:* Volume Resistivity @ 23°C:
Dielectric Constant (1KHz):
Dissipation Factor (1KHz):

0.13
0.14
0.28
< 3001,106,623< 200 ppm
39 ppm≤ 201.5≤ 0.0005
N/A
N/A

x 10-6 in/in°C
x 10-6 in/in°C
psiKg°C

3,556 psi%%%°C (Intermittent)psiNa+:< 50 ppm
K+:< 50 ppm
microns
W/mK
Ohm-cmEpoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com

EPO-TEK® H35-175MP
Technical Data Sheet
For Reference Only
Electrically Conductive, Silver Epoxy

EPO-TEK® H35-175MP Advantages & Suggested Application Notes:● Exhibits a smooth, flowing consistency that is adaptable to conventional processing
methods such as dispensing and screen printing. See Technical Paper #43 from our
website link for hints and best practices for high speed auger screw dispensing –http://www.epotek.com/technical-papers.asp.
● Performs exceptionally well as a die attach for small chips such as GaAs, LEDs anddiodes.
● Capable of resisting 260°C green reflow process, low outgassing in hermetic lid-sealprocesses near 300°C, and organic burn-in up to 150°C/1000 hours storage.
● Certified to MIL-STD 883/Test Method 5011 –yields low levels of water extractablemonovalent ions such as Chlorides.
● Passes NASA low outgassing standard ASTM E595 with proper cure http://outgassing.nasa.gov/.
● Capable of JEDEC Level II die-attach packaging on die-paddles and lead-frames.
● Widely used epoxy; popular choice for silver-filled epoxies; opto-packaging, hybrids, andmany types of substrates including kovar, ceramic and BT.
● Available in many different viscosity ranges – contact Technical Services attechserv@epotek.com for best recommendation.

Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com