EPO-TEK® T7109
Technical Data Sheet
For Reference Only
Thermally Conductive Epoxy

Date:
Rev:
No. of Components:
Mix Ratio by Weight:
Specific Gravity:
Pot Life:
Shelf Life- Bulk:
Shelf Life- Syringe:

Recommended Cure: 150°C / 1 Hour

July 2019
VITwo
10 : 1
Part A: 1.33
Part B: 1.02
4 Hours
One year at room temperature
Six months at -40°C

Minimum Alternative Cure(s):May not achieve performance properties listed below
150°C / 10 Minutes
100°C / 4 Hours
80°C / 8 HoursNOTES:● Container(s) should be kept closed when not in use.
● Filled systems should be stirred thoroughly before mixing and prior to use.
● Performance properties (rheology, conductivity, others) of the product may vary from those stated on the data sheet when bi-pak/syringe packaging or
post-processing of any kind is performed. Epoxy’s warranties shall not apply to any products that have been reprocessed or repackaged from Epoxy’s
delivered status/container into any other containers of any kind, including but not limited to syringes, bi-paks, cartridges, pouches, tubes, capsules, films
or other packages.
● Syringe packaging will impact initial viscosity and effective pot life, potentially beyond stated parameters.

Product Description: EPO-TEK® T7109 is a two component, thermally conductive epoxy designed for die attach and heat-sinking
applications found in the semiconductor, hybrid, medical and optical industries.
Typical Properties: Cure condition: 150°C / 1 Hour
Different batches, conditions & applications yield differing results.
Data below is not guaranteed. To be used as a guide only, not as a specification. * denotes test on lot acceptance basis
PHYSICAL PROPERTIES:* Color (before cure):* Consistency:* Viscosity (23°C) @ 20 rpm:
Thixotropic Index:* Glass Transition Temp:
Coefficient of Thermal Expansion (CTE):
Below Tg:
Above Tg:
Shore D Hardness:
Lap Shear @ 23°C:
Die Shear @ 23°C:
Degradation Temp:
Weight Loss:@ 200°C:@ 250°C:@ 300°C:
Suggested Operating Temperature:
Storage Modulus:* Particle Size:

Part A: White
Smooth paste
14,000-20,000
1.8
≥ 45

Part B: Amber

46239
83
> 2,000≥ 15377

x 10-6 in/in°C
x 10-6 in/in°C

0.02
0.250.98< 300258,593≤ 20%%%°C (Intermittent)psimicrons0.7≥ 8 x 1012
3.50
0.004

W/mK (40 mil);Ohm-cmELECTRICAL AND THERMAL PROPERTIES:
Thermal Conductivity:
Volume Resistivity @ 23°C:
Dielectric Constant (1KHz):
Dissipation Factor (1KHz):

cPs°C (Dynamic Cure: 20-200°C/ISO 25 Min; Ramp -10-200°C @20°C/Min)

psi
Kg
°C

5,334 psi

1.5 W/mK (3 mil)Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com

EPO-TEK® T7109
Technical Data Sheet
For Reference Only
Thermally Conductive Epoxy

EPO-TEK® T7109 Advantages & Suggested Application Notes:● Reliability report available describing its performance; see Technical Paper #42 http://www.epotek.com/technical-papers.asp
o Thermal resistance compared to three other epoxies.
o Thermal resistance and how it relates to overall thermal conductivity.
o Strength measurements plotted versus pot-life, versus Tcycles and damp heat
(85°C/85%RH).
● Thixotropic paste allows for application by automatic dispensers or screen printers. It
can also be applied by hand or spatula.
● Excellent adhesion to Aluminum, ferrous and non ferrous metals, and most plastics
including Kapton.
● Suggested applications:o Semiconductor - Thermally conductive underfill / Electrically non conductive dieattach, low stress for large die exceeding 500 mil x 500 mil.
o Hybrid Micro-electronics - Large die attach, adhesion to GaAs devices, ceramic
substrate attach to housing.
o Fiber Optic Packaging - Substrate attach of optical bench; TECooler attach; goodadhesion to Au, Kovar and ceramic; can be used for laser diode and photo-diodeattach.
o Liquid Crystal Displays - die-attach micro-LCDs onto flex circuits like Kapton, orrigid carriers like FR4, ceramic, or silicon● Low temperature cure between 80°C and 150°C allows use on lower cost plastics andtemperature sensitive devices.
● Can be suggested as a lower stress, more resilient alternative of EPO-TEK® 930-4.

Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com