CTVS - Ceramic transient voltage suppressors
Multilayer varistors (MLVs), standard series

Series/Type:
Ordering code:

CT1206K30G_X1
B72520X1300K062

Date:
Version:2024-03-29
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CTVS - Ceramic transient voltage suppressors
Multilayer varistors (MLVs), standard series
B72520X1300K062
CT1206K30G_X1
PPD ML PD
2024-03-29
1
Dr. Hohl
Dr. Pecina
Mr. Mijocevic
Dr. Rom
New Typexxxxxxxx© TDK Electronics AG 2024. Reproduction, publication and dissemination of this publication, enclosures hereto and theinformation contained therein without TDK Electronics' prior express consent is prohibited.

CTVS - Ceramic transient voltage suppressors
Multilayer varistors (MLVs), standard series

B72520X1300K062
CT1206K30G_X1Features
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Reliable ESD protection up to 30 kV acc. to IEC 61000-4-2
High energy absorption capability
Low leakage current
No temperature derating up to 150 °C
High life time robustness
Stable protection level
RoHS-compatible, lead-free
Qualified based on AEC-Q200
PSpice simulation models availableDesignation system
CT1206
K30G

Chip with three-layer-termination (Ag/Ni/Sn)
Dimensions of the device 12 x 06 (length x width in 1/100 inch)
Tolerance of the varistor voltage (±10%)
Maximum RMS operating voltage
Taped version, blister tape, 7" reel (2000 pcs./reel)Electrical data
Maximum operating voltage
RMS voltage

VRMS= 30 V

DC voltage

VDC= 38 V

Varistor voltage (@ 1 mA, 25 °C)

VV= 42.3 … 51.7 V

Maximum clamping voltage (@ 5 A)

Vclamp,max = 77 V

Maximum leakage current (@ 38 V, 25 °C)

Ileak,max= 25 μA

Maximum surge current (8/20 µs)

Isurge,max= 1 x 200 A

Maximum average power dissipation

Pdiss,max= 8 mW

Capacitance (@ 1 kHz, 1 V, 25 °C; typical)

Ctyp= 500 pF

Response timetresp

= < 0.5 ns

Operating temperature
Storage temperature (mounted parts)

TopTstg= –55 ... +150°C= –55 ... +150°C

PPD ML PD
Please read Cautions and warnings andImportant notes at the end of this document.

2024-03-29
Page 2 of 11

CTVS - Ceramic transient voltage suppressors
Multilayer varistors (MLVs), standard series

B72520X1300K062
CT1206K30G_X1

Temperature derating
The specified ratings for Imax, Isurge,max and Pdiss,max are valid up to 150 °C.
For operation above 150 °C we recommend the below derating.

Dimensional drawing

Dimensions in mm
Case size1206l3.2 ±0.3w
1.6 ±0.20

h1.7 maxk
0.25 … 0.75

Recommended solder pad layout

Dimensions in mm
Case size
ABC

1206

1.20

2.10

1.80

PPD ML PD
Please read Cautions and warnings andImportant notes at the end of this document.

2024-03-29
Page 3 of 11

CTVS - Ceramic transient voltage suppressors
Multilayer varistors (MLVs), standard series

B72520X1300K062
CT1206K30G_X1

Recommended soldering profiles
Reflow soldering
Temperature ranges for reflow soldering acc. To IEC 60068-2-58 recommendations

Profile feature

Sn-Pb eutectic
assembly

Pb-free assembly

Tsmin
Tsmax
ts

100 °C
150 °C
60 … 120 s

150 °C
200 °C
60 … 120 s

Average ramp-up rate

Tsmax to Tp

3 °C/s max

3 °C/s max

Liquidous temperature
Time at liquidous

TLtL

183 °C
40 … 150 s

217 °C
40 … 150 s

Peak package body temperature

Tp1)

215 °C … 260 °C

235 °C … 260 °C

Time (tp) above (Tp -5 °C )tp

10 … 40 s

10 ... 40 s

Average ramp-down rate

Tp to Tsmax

6 °C/s max

6 °C/s max

maximum 8 min.

maximum 8 min.

Preheat and soak
- Temperature min- Temperature max- TimeTime 25 °C to peak temperature
1) Depending on package thickness.

Note: All temperatures refer to topside of the package, measured on the package body surface.
Number of reflow cycles: 3Iron soldering should be avoided, hot air methods are recommended for repair purposes.

PPD ML PD
Please read Cautions and warnings andImportant notes at the end of this document.

2024-03-29
Page 4 of 11

CTVS - Ceramic transient voltage suppressors
Multilayer varistors (MLVs), standard series

B72520X1300K062
CT1206K30G_X1

Wave soldering temperature profile
Temperature characteristic at component terminal with dual-wave soldering

Recommended solder
The use of no-clean solder products is recommended. In any case mild, non-activated fluxes should
be used. Flux residues after soldering should be minimized.
Storage conditions◼ In order to maintain solderability the components must be stored in a non-corrosive atmosphere.
Humidity, temperature, and container materials are critical factors.
◼ Do not store the components where they are exposed to heat or direct sunlight. Otherwise, thepacking material may be deformed, or the components may stick together, causing problems
during mounting. After opening the factory seals, such as polyvinyl-sealed packages, use thecomponents as soon as possible.
◼ The components should be left in their original packing. Touching the metallization of
unsoldered components may change their soldering properties.
◼ Storage temperature: -25 ... +45 °C◼ Relative humidity: < 75% annual average, < 95% on max. 30 days in a year, dew precipitation andwetness are inadmissible.
Solder the components listed in this data sheet after shipment from TDK within 12 months.

PPD ML PD
Please read Cautions and warnings andImportant notes at the end of this document.

2024-03-29
Page 5 of 11

CTVS - Ceramic transient voltage suppressors
Multilayer varistors (MLVs), standard series

B72520X1300K062
CT1206K30G_X1Taping and packaging
Tape and reel packing according to IEC 60286-3
Tape material: Blister
Dimensions and tolerances
Definition

SymbolTape widthW

Dimension
[mm]
8.00

Tolerance
[mm]
±0.30

Package: 8-mm tape
Packing
Packing material: Plastic
Reel dimensions:Definition

SymbolA

Dimension[mm]
180

Tolerance
[mm]
+0/-3

Reel diameter
Reel width (inside)

W1

8.4

+1.5/-0

Reel width (outside)

W2

14.4max

Packing unit: 2000 pcs./reel

PPD ML PD
Please read Cautions and warnings andImportant notes at the end of this document.

2024-03-29
Page 6 of 11

CTVS - Ceramic transient voltage suppressors
Multilayer varistors (MLVs), standard series

B72520X1300K062
CT1206K30G_X1

Cautions and warnings
GeneralSome parts of this publication contain statements about the suitability of our ceramic transient voltage
suppressor (CTVS) components (multilayer varistors (MLVs)), CeraDiodes, ESD/EMI filters, leaded
transient voltage/ RFI suppressors (SHCV types) for certain areas of application, including
recommendations about incorporation/design-in of these products into customer applications. The
statements are based on our knowledge of typical requirements often made of our CTVS devices inthe particular areas. We nevertheless expressly point out that such statements cannot be regarded asbinding statements about the suitability of our CTVS components for a particular customer
application. As a rule, TDK Electronics is either unfamiliar with individual customer applications or lessfamiliar with them than the customers themselves. For these reasons, it is always incumbent on thecustomer to check and decide whether the CTVS devices with the properties described in the productspecification are suitable for use in a particular customer application.
◼ Do not use TDK Electronics CTVS components for purposes not identified in our specifications,application notes and data books.
◼ Ensure the suitability of a CTVS in particular by testing it for reliability during design-in. Always
evaluate a CTVS component under worst-case conditions.
◼ Pay special attention to the reliability of CTVS devices intended for use in safety-criticalapplications (e.g. medical equipment, automotive, spacecraft, nuclear power plant).
Design notes◼ Always connect a CTVS in parallel with the electronic circuit to be protected.
◼ Consider maximum rated power dissipation if a CTVS has insufficient time to cool down between
a number of pulses occurring within a specified isolated time period. Ensure that electricalcharacteristics do not degrade.
◼ Consider derating at higher operating temperatures. Choose the highest voltage class compatible
with derating at higher temperatures.
◼ Consider appropriate safety measures for measurement (e.g. high voltage) across the CTVS
components.
◼ Surge currents beyond specified values will puncture a CTVS. In extreme cases a CTVS willburst.
◼ If steep surge current edges are to be expected, make sure your design is as low-inductance aspossible.
◼ In some cases, the malfunctioning of passive electronic components or failure before the end of
their service life cannot be completely ruled out in the current state of the art, even if they areoperated as specified. In applications requiring a very high level of operational safety andespecially when the malfunction or failure of a passive electronic component could endanger
human life or health (e.g. in accident prevention, life-saving systems, or automotive battery line
applications such as clamp 30), ensure by suitable design of the application or other measures(e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained bythird parties in the event of such a malfunction or failure. Only use CTVS components from theautomotive series in safety-relevant applications.
◼ Specified values only apply to CTVS components that have not been subject to prior electrical,
mechanical, or thermal damage. For the use of MLVs in line-to-ground circuits we recommendthat the customer checks whether restrictions exist, or additional safety measures are requiredbased on various international and local standards.

PPD ML PD
Please read Cautions and warnings andImportant notes at the end of this document.

2024-03-29
Page 7 of 11

CTVS - Ceramic transient voltage suppressors
Multilayer varistors (MLVs), standard series

B72520X1300K062
CT1206K30G_X1

Storage◼ Only store CTVS in their original packaging. Do not open the package before storage.
◼ Storage conditions in original packaging: temperature −25 to +45 °C, relative humidity ≤ 75%
annual average, maximum 95%, dew precipitation is inadmissible.
◼ Do not store CTVS devices where they are exposed to heat or direct sunlight. Otherwise, thepackaging material may be deformed or CTVS may stick together, causing problems duringmounting.
◼ Avoid contamination of the CTVS surface during storage, handling, and processing.
◼ Avoid storing CTVS devices in harmful environments where they are exposed to corrosive gases
for example (SOx, Cl).
◼ Use CTVS as soon as possible after opening factory seals such as polyvinyl-sealed packages.
◼ Solder CTVS components after shipment from TDK Electronics within the time specified:- CTVS with Ni barrier termination, 12 months- CTVS with AgPt termination, 6 months- SHCV 24 monthsHandling◼
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Do not drop CTVS components and allow them to be chipped.
Do not touch CTVS with your bare hands - gloves are recommended.
Avoid contamination of the CTVS surface during handling.
Washing processes may damage the product due to the possible static or cyclic mechanical loads(e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts, whichmight lead to reduced reliability or lifetime.

Mounting◼
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When CTVS devices are encapsulated with sealing material or overmolded with plastic material,
electrical characteristics might be degraded and the lifetime reduced.
Make sure an electrode is not scratched before, during or after the mounting process.
Make sure contacts and housings used for assembly with CTVS components are clean beforemounting.
The surface temperature of an operating CTVS can be higher. Ensure that adjacent components
are placed at a sufficient distance from a CTVS to allow proper cooling.
Avoid contamination of the CTVS surface during processing.

Soldering◼

Complete removal of flux is recommended to avoid surface contamination that can result in an
instable and/or high leakage current.
◼ Use resin-type or non-activated flux.
◼ Bear in mind that insufficient preheating may cause ceramic cracks.
◼ Rapid cooling by dipping in solvent is not recommended, otherwise a component may crack.

PPD ML PD
Please read Cautions and warnings andImportant notes at the end of this document.

2024-03-29
Page 8 of 11

CTVS - Ceramic transient voltage suppressors
Multilayer varistors (MLVs), standard series

B72520X1300K062
CT1206K30G_X1Operation◼
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Use CTVS only within the specified operating temperature range.
Use CTVS only within specified voltage and current ranges.
Environmental conditions must not harm a CTVS. Only use them in normal atmosphericconditions. Reducing the atmosphere (e.g. hydrogen or nitrogen atmosphere) is prohibited.
Prevent a CTVS from contacting liquids and solvents. Make sure that no water enters a CTVS
(e.g. through plug terminals).
Avoid dewing and condensation.
TDK Electronics CTVS components are mainly designed for encased applications. Under all
circumstances avoid exposure to:- direct sunlight- rain or condensation- steam, saline spray- corrosive gases- atmosphere with reduced oxygen content
TDK Electronics CTVS devices are not suitable for switching applications or voltage stabilization
where static power dissipation is required.

This listing does not claim to be complete, but merely reflects the experience of TDK Electronics AG.

Display of ordering codes for TDK Electronics products
The ordering code for one and the same product can be represented differently in data sheets, data books,
other publications, on the company website, or in order-related documents such as shipping notes, orderconfirmations and product labels. The varying representations of the ordering codes are due to different
processes employed and do not affect the specifications of the respective products. Detailed
information can be found on the Internet at www.tdk-electronics.tdk.com/orderingcodes.

PPD ML PD
Please read Cautions and warnings andImportant notes at the end of this document.

2024-03-29
Page 9 of 11

Important notes

The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products forcertain areas of application. These statements are based on our knowledge of typicalrequirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application. As arule, we are either unfamiliar with individual customer applications or less familiar with them thanthe customers themselves. For these reasons, it is always ultimately incumbent on the customer tocheck and decide whether a product with the properties described in the product specification issuitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or failure
before the end of their usual service life cannot be completely ruled out in the current stateof the art, even if they are operated as specified. In customer applications requiring a very highlevel of operational safety and especially in customer applications in which the malfunction or failureof an electronic component could endanger human life or health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by means of suitable design of the customer
application or other action taken by the customer (e.g. installation of protective circuitry orredundancy) that no injury or damage is sustained by third parties in the event of malfunction or
failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in thispublication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our Material
Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any moredetailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in thispublication may change from time to time. The same is true of the corresponding productspecifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products. Consequently,
we cannot guarantee that all products named in this publication will always be available.
The aforementioned does not apply in the case of individual agreements deviating from theforegoing for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms andConditions of Supply.
7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard.
The IATF certifications confirm our compliance with requirements regarding the quality
management system in the automotive industry. Referring to customer requirements and customer
specific requirements (“CSR”) TDK always has and will continue to have the policy of respecting
individual agreements. Even if IATF 16949 may appear to support the acceptance of unilateralrequirements, we hereby like to emphasize that only requirements mutually agreed upon canand will be implemented in our Quality Management System. For clarification purposes we liketo point out that obligations from IATF 16949 shall only become legally binding if individually agreed
upon.

Page 10 of 11

Important notes

8. The trade names EPCOS, CarXield, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas,CSMP, CTVS, DeltaCap, DigiSiMic, FilterCap, FormFit, InsuGate, LeaXield, MediPlas, MiniBlue,MiniCell, MKD, MKK, ModCap, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap,
PiezoBrush, PlasmaBrush, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap,SIMDAD, SiMic, SIMID, SineFormer, SIOV, SurfIND, ThermoFuse, WindCap, XieldCap aretrademarks registered or pending in Europe and in other countries. Further information will befound on the Internet at www.tdk-electronics.tdk.com/trademarks.
Release 2024-02

Page 11 of 11