VRM = 200 V, IF(AV) = 2.0 A, trr = 50 ns
Fast Recovery DiodeSJPL-H2

Data Sheet

DescriptionPackage

The SJPL-H2 is a fast recovery diode of 200 V / 2.0 A.
The maximum trr of 50 ns is realized by optimizing alife-time control.

SJP

Cathode MarkFeatures● VRM---------------------------------------------------- 200 V● IF(AV)---------------------------------------------------- 2.0 A● VF ----------------------------------------------------- 0.98 V● trr1 ------------------------------------------------------- 50 ns● Bare Lead Frame: Pb-free (RoHS Compliant)● Flammability: Equivalent to UL94V-0● Suitable for High Reliability and Automotive
Requirement.

(2)

(1)

(1)

(2)

(1) Cathode(2) Anode
Not to scale

Applications● White Goods● Audiovisual Equipment● Lighting Equipment● Industrial Electronic Equipment(Communication Equipment and Factory Automation)● Secondary-side Rectifier Diode(Flyback Converter, LLC Converter, etc.)● Freewheel Diode(Offline Buck Converter, Offline Buck-boostConverter, etc.)

SJPL-H2-DSE Rev.1.2
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Sep. 14, 2020
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1SJPL-H2
Absolute Maximum Ratings
Unless otherwise specified, TA = 25 °C.
Parameter
SymbolNonrepetitive Peak Reverse Voltage
VRSM
Repetitive Peak Reverse Voltage
VRM
Average Forward Current
IF(AV)
Surge Forward Current

IFSM

I2t Limiting Value
Junction Temperature
Storage Temperature

I2tTJ
TSTG

Conditions

See Figure 2 and Figure 3
Half cycle sine wave,
positive side, 10 ms, 1 shot
1 ms ≤ t ≤ 10 ms

Rating2002002.0Unit
VVA

25A

3 .1
−40 to 150−40 to 150

A2s°C°C

Electrical Characteristics
Unless otherwise specified, TA = 25 °C.
Parameter
SymbolForward Voltage DropVF

Reverse Leakage Current
Reverse Leakage Current
under High Temperature

IRConditions
TJ = 25 °C, IF = 2.0 A
TJ = 100 °C, IF = 2.0 A
VR = VRM

H∙IR

VR = VRM, TJ = 150 °C

trr1
Reverse Recovery Time
trr2Thermal Resistance (1)IF = IRP = 100 mA,90% recovery point,
TJ = 25 °C
IF = 100 mA, IRP = 200 mA,
75% recovery point,
TJ = 25 °C

Rth(J-L)

Min.
—
——

Typ.
—
0.79
—

Max.
0.98
—
50Unit
V
V
µA

—

—

200µA

—

—

50ns

—

—

35ns

—

—

20°C/W

Mechanical Characteristics
Parameter
Package WeightConditions

1.6 mmTL
Device

Min.
―

Typ.
0.072

Max.
―

UnitgTA

Copper Area
2 mm
25 mm

2 mm

2 mm
Substrate

25 mm

Figure 1.

(1)

Lead Temperature Measurement Conditions

Rth (J-L) is thermal resistance between junction and lead. Lead temperature (TL) is measured near the root of pin (seeFigure 1).

SJPL-H2-DSE Rev.1.2
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2

SJPL-H2
Derating Curves
2.0

2.0

DC

Average Forward Current, IF(AV) (A)Average Forward Current, IF(AV) (A)

DCt/T = 1/2

1.5t/T = 1/3, sine wave

1.0t/T = 1/6

0.5t/T = 1/2

1.5t/T = 1/3, sine wave

1.0t/T = 1/60.5tt

TT

0.0

0.07510012515075IF(AV) vs. TL (TJ = 150 °C, VR = 0 V)

125150

Lead Temperature, TL (°C)

Lead Temperature, TL (°C)
Figure 2.

100Figure 3.

SJPL-H2-DSE Rev.1.2
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IF(AV) vs. TL ( TJ = 150 °C, VR = 200 V)

3SJPL-H2
Characteristic Curves

Maximum Reverse Power Dissipation, P R(MAX) (W)

Maximum Forward Power Dissipation, P F(MAX) (W)

0.04
3.0t
Tt/T = 1/6

2.0t/T = 1/3, sine wave

1.0t/T = 1/2DCtT

0.03
1−t/T = 5/6

0.02
1−t/T = 2/3
1−t/T = 1/2

0.01

Sine wave

00.0
00.5

1

1.5

02

PF(MAX) vs. IF(AV) (TJ = 150 °C)

Figure 5.

10150200PR(MAX) vs. VR (TJ = 150 °C)

1.E-04

Reverse Leakage Current, IR (A)

1.E-05

TJ = 150 °C

Forward Current, IF (A)100

Reverse Voltage, VR (V)Average Forward Current, IF(AV) (A)Figure 4.

501

1.E-06

0.1

TJ = 150 °C

1.E-07

TJ = 100 °C

TJ = 100 °C

1.E-080.01

1.E-09

TJ = 25 °C

0.001
0.2

0.4

0.6

0.8

1.0

1.2

1.4

TJ = 25 °C

1.E-100Forward Voltage Drop, VF (V)Figure 6.

Typical Characteristics: IF vs. VF

50

100

150200

Reverse Voltage, VR (V)Figure 7.

SJPL-H2-DSE Rev.1.2
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Typical Characteristics: IR vs. VR

4

SJPL-H2

Thermal Resistance (°C/W)

1000

Rth(J-A)
100
Rth(J-L)
1010.110m100m1

101001000

Pulse Width (s)Figure 8.

Typical Transient Thermal Resistance Characteristics

SJPL-H2-DSE Rev.1.2
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Sep. 14, 2020
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SJPL-H2
Physical Dimensions● SJP Package

2.15

0.05

+0.1
-0.2

+0.1
-0.05

2.6±0.2

4.5±0.2

1.3±0.4

2.0min.

1.5±0.2

1.3±0.4+0.4

5.0 -0.1

NOTES:- Dimensions in millimeters- Bare lead frame: Pb-free (RoHS compliant)- Moisture Sensitivity Level 1 (MSL 1)- When soldering the products, it is required to minimize the working time within the following limits:
Flow: 260 °C / 10 s, 1 time
Reflow:Preheat: 150 °C to 200 °C / 60 s to 120 s
Solder heating: 255 °C / 30s, 3 times (260 °C peak)
Soldering Iron: 350 °C / 3.5 s, 1 time
● SJP Land Pattern Example

2.0

2.0

4.0 to 4.2

NOTE:- Dimensions in millimeters

SJPL-H2-DSE Rev.1.2
SANKEN ELECTRIC CO., LTD.
Sep. 14, 2020
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6SJPL-H2
Marking Diagram
Cathode MarkSpecific Device Code (See Table 1)
YMDD
Lot Number:
Y is the last digit of the year of manufacture (0 to 9)
M is the month of the year (1 to 9, O, N, or D)
DD is the day of the month (01 to 31)

Table 1. Specific Device CodeSpecific Device CodePart Number

LH2

SJPL-H2SJPL-H2-DSE Rev.1.2
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7SJPL-H2
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DSGN-AEZ-16003

SJPL-H2-DSE Rev.1.2
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