1000, 2000, 3000, 4000 & 8000
Very Low to Extremly Low Loss Materials
Laminate & Prepreg
The Meteorwave family of materials offer very advanced electrical performance and very high reliability. They areintended for use in next generation core routers, high speed switches, supercomputers and applications where low signal
attenuation, high reliability and high data transfer rates are critical. Meteorwave products are designed to facilitatehigh temperature lead-free assemblies and high layer count printed circuit board designs that require high reliability,
CAF resistance and low Z-axis expansion.

Key Features

Applications

Excellent Electrical Properties• 25 - 100 GHz Infrastructure- Low Dk

• Cloud Storage- Very low loss and ultra low loss Df electrical performance• Core Routers- Stable electrical properties versus frequency when tested over various
environmental conditions
Lead-Free Compatibility- Designed to withstand multiple lead-free assembly reflow cycles at 260°C
Highly CAF Resistant- CAF resistant materials after high temperature reflow
Thermal and Mechanical Properties• High Speed Switches• Servers• Supercomputers• RF/Microwave Applications• 5G- Very low Z-axis expansion for high reliability- Good peel strength- Excellent IST performance- Meets NASA ougassing specification
High-Tg FR-4 Processing- Processing similar to other high-Tg materials- 30 min press at 177°C plus 60 min press at 216°C and 390 psi
Available in a variety of constructions- Available in a wide variety of constructions, copper weights and glass styles, including ultra low profile copper,
standard copper and RTFOIL®
- Available as 2 mil core products that meet the specifications of a capacitive laminate- A rating of UL 94V-0 and 130oC MOT for the entire Meteorwave family of materials- Meets IPC-4101/102 specification- All of AGC Nelco’s PCB materials are RoHS compliant

UL file number: E36295

8000

High Speed / Extremely Low Loss
Laminate and Prepreg
Mechanical Properties

Meteorwave®
8000

U.S. Units

Meteorwave®
8000

MetricTest Method

Peel Strength - 1 oz. (35 micron) Cu
After Solder Float
At Elevated Temperature
After Exposure to Process Solutions
X / Y CTE [-40°C to +125°C]
Z Axis CTE Alpha 1 [50°C to Tg] 55% RC
Z Axis CTE Alpha 2 [Tg to 260°C] 55% RC
Z Axis Expansion [50°C to 260°C] 55% RC
Young’s Modulus (X / Y)
Poisson’s Ratios (X / Y)
Flexural Strength (X / Y)
Felxural Strength @ 150°C (X / Y)
Thermal Conductivity
Specific Heat

3.0
3.1
3.3
3.5
14 / 1635
185
2.5
2.9 / 2.7
0.177 / 0.163
44,989 / 55,199
34,000 / 22,000
0.51
0.943

lb / inchlb / inchlb / inchlb / inchppm / °C
ppm / °C
ppm / °C%psi x 106

0.52
0.54
0.58
0.61
14 / 1635
185
2.5
1.99 / 1.860.177 / 0.163
0.31 / 0.381
0.234 / 0.151
0.510.943

N / mmN / mmN / mmN / mmppm / °C
ppm / °C
ppm / °C%
GN / m2

IPC-TM-650.2.4.8
IPC-TM-650.2.4.8
IPC-TM-650.2.4.8.2a
IPC-TM-650.2.4.8
IPC-TM-650.2.4.41
IPC-TM-650.2.4.24
IPC-TM-650.2.4.24
IPC-TM-650.2.4.24
ASTM D3039
ASTM D3039
ASTM D3039
ASTM D3039
ASTM E1461
ASTM E1461

psi
psi`
W / mK.J / gK

GN / m2
GN / m2
W / mKJ / gK

Electrical Properties
Dielectric Constant (75% RC)@ 2 GHz (Stripline)@ 10 GHz (Stripline)
Dissipation Factor (75% RC)@ 2 GHz (Split Post Cavity)@ 10 GHz (Split Post Cavity)
Volume Resistivity
C - 96 / 35 / 90
E - 24 / 125
Surface Resistivity
C - 96 / 35 / 90
E - 24 / 125
Electric Strength
Dielectric Breakdown
Arc Resistance

3.29
3.28

3.29
3.28

0.00120.00160.00120.0016

IPC-TM-650.2.5.5.5
IPC-TM-650.2.5.5.5

4.2x106
8.8x107

MW - cm
MW - cm

4.2x106
8.8x107

MW - cm
MW - cm

IPC-TM-650.2.5.17.1
IPC-TM-650.2.5.17.13.1x105
3.6x1071500>50184

MW
MW
V / milkV
seconds

3.1x105
3.6x1075.9x104>50184

MWMW
V / mmkVseconds

IPC-TM-650.2.5.17.1
IPC-TM-650.2.5.17.1
IPC-TM-650.2.5.6.2
IPC-TM-650.2.5.6
IPC-TM-650.2.5

165
185
376
pass°C
°C
°C

165
185
376
pass°C°C°C>12040minutesminutes>12040minutesminutes

IPC-TM-650.2.4.24c
IPC-TM-650.2.4.24.3
IPC-TM-650.2.3.40
IPC-TM-650.2.6.16(modified)
IPC-TM-650.2.4.24.1
IPC-TM-650.2.4.24.1

0.01
0.21
1.85wt. %% wt. chg.
g / cm3

0.01
0.21
1.85

wt. %% wt. chg.
g / cm3

Thermal Properties*Glass Transition Temperature (Tg)
TMA (°C)
DMA (°C) (Tan d Peak)
Degradation Temp (TGA) (5% wt. loss)
Pressure Cooker-60 min then solder dip@288°C until failure (max 10 min.)
T288
T300

Chemical / Physical Properties
Moisture Absorption
Methylene Chloride ResistanceDensity [50% resin content]

IPC-TM-650.2.6.2.1
IPC-TM-650.2.3.4.3

All test data provided are typical values and not intended to be specification values. For review of critical specification tolerances, please contact a company representative directly.
*DMA is the preferred method for measuring Tg - other methods may be less accurate.

Americas +1.480.967.5600
Asia Pacific +65.686.17117 • Europe +33.562.985290
www.AGC-Nelco.com • info@agc-nelco.com

Rev 12-18

3000 Very Low Loss
4000 Ultra Low Loss
Laminate and Prepreg
Meteorwave
3000

Meteorwave
4000

U.S.
Units

Meteorwave Meteorwave Metric
3000
4000
Units

Test Method

5.5
4.4
5.0
10-1455260
2.1
2.6
3.9 / 3.5
0.163 /0.146
0.470.82

5.5
4.4
5.0
10-1455260
2.1
2.6
2.7 / 2.6
0.170 / 0.163
0.45
0.84

lb / inchlb / inchlb / inchppm / °C
ppm / °C
ppm / °C%%
psi x 106
W / mKJ / gK

1.00
0.77
0.88
10-1455260
2.1
2.6
26.9 / 24.1
0.163 /0.146
0.47
0.82

1.00
N / mm IPC-TM-650.2.4.80.77
N / mm IPC-TM-650.2.4.8.20.88
N / mm IPC-TM-650 2.4.8.2
10-14
ppm / °C IPC-TM-650.2.4.41
55
ppm / °C IPC-TM-650.2.4.24260ppm / °C IPC-TM-650.2.4.24
2.1%
IPC-TM-650.2.4.24
2.6%
IPC-TM-650.2.4.24
18.6 / 17.9 GN / m2 ASTM D3039
0.170 /0.163
ASTM D3039
0.45
W / mK ASTM E1461
0.84
J / gKASTM E1461

56.3 / 47.0
51.8 / 44.5

51.7 / 47.6
50.2 / 44.3

psi x 106
psi x 106

388 / 214
357 / 307

356 / 328
346 / 305

3.6
3.4

3.4
3.3

3.6
3.4

3.4
3.3

0.00310.00390.00190.00240.00310.00390.00190.00243.00x107
5.20x1084.70x106
5.20x108MΩ- cmMΩ- cm

3.00x107
5.20x1084.70x106
5.20x108MΩ- cmMΩ- cm

IPC-TM-650.2.5.17.1
IPC-TM-650.2.5.17.1

7.60x106
1.20x108
1300>50210

1.30x106
7.40x107
1800>50
210

MΩ
MΩ
V / milkV
seconds

7.60x106
1.20x1083.3x104>50
210

1.30x106
7.40x107
4.6x104
>50
210

MΩ
MΩ
V / mmkVseconds

IPC-TM-650.2.5.17.1
IPC-TM-650.2.5.17.1
IPC-TM-650.2.5.6.2
IPC-TM-650.2.5.6
IPC-TM-650.2.5.1

170
200
390
pass

170
200
390
pass

°C°C
°C

170200390pass

170200390
pass°C°C°C>120>120

minutes>120>120minutes

IPC-TM-650.2.4.24c
IPC-TM-650.2.4.24.3
IPC-TM-650.2.3.40
IPC-TM-650.2.6.16(modified)
IPC-TM-650.2.4.24.1

0.12
0.27
2.08

0.12
0.27
1.95

wt. %
% wt. chg.
g / cm3

0.12
0.27
2.08

0.12
0.27
1.95

wt. %
IPC-TM-650.2.6.2.1% wt. chg. IPC-TM-650.2.3.4.3
g / cm3 Internal Method

Mechanical Properties
Peel Strength - 1 oz. (35 micron) Cu
After Solder Float
At Elevated Temperature
After Exposure to Process SolutionsX / Y CTE [-40°C to +125°C]
Z Axis CTE Alpha 1 [50°C to Tg] 55% RC
Z Axis CTE Alpha 2 [Tg to 260°C] 55% RC
Z Axis Expansion [50°C to 260°C] 43% RC
Z Axis Expansion [50°C to 260°C] 55% RC
Young’s Modulus (X / Y)
Poisson’s Ratios (X / Y)
Thermal Conductivity
Specific Heat
Flexural Strength@125°C (W/F)@150°F (W/F)

GN / m2
GN / m2

IPC-TM-650.2.4.4.1
IPC-TM-650.2.4.4.1

Electrical Properties
Dielectric Constant (Typical 65% RC)@ 2 GHz (Stripline)@ 10 GHz (Stripline)
Dissipation Factor (Typical 65% RC)@ 2 GHz (Split Post Cavity)@ 10 GHz (Split Post Cavity)
Volume Resistivity
C - 96 / 35 / 90
E - 24 / 125
Surface Resistivity
C - 96 / 35 / 90
E - 24 / 125
Electric Strength
Dielectric Breakdown
Arc Resistance

IPC-TM-650.2.5.5.5
IPC-TM-650.2.5.5.5

Thermal Properties*Glass Transition Temperature (Tg)
TMA (°C)
DMA (°C) (Tan d Peak)
Degradation Temp (TGA) (5% wt. loss)
Pressure Cooker-60 min then solder dip@288°C until failure (max 10 min.)
T300

Chemical / Physical Properties
Moisture Absorption
Methylene Chloride ResistanceDensity [50% resin content]

All test data provided are typical values and not intended to be specification values. For review of critical specification tolerances, please contact a company representative directly.
*DMA is the preferred method for measuring Tg - other methods may be less accurate.

Rev 12-18

1000 Very Low Loss
2000 Ultra Low Loss
Laminate and Prepreg
Meteorwave
1000

Meteorwave
2000

U.S.
Units

Meteorwave Meteorwave Metric1000
2000
Units

Test Method

6.6
5.6
5.3
10-1455260
1.5
1.9
3.6 / 3.20.148 / 0.132
0.46
0.92

6.6
5.6
5.3
10-14
55
260
1.5
1.9
2.7 / 2.5
0.166 / 0.169
0.43
0.97

lb / inchlb / inchlb / inchppm / °C
ppm / °C
ppm / °C%%
psi x 106

1.16
1.16
0.98
0.98
0.93
0.93
10-14
10-14
55
55
260
260
1.5
1.5
1.9
1.9
24.4 / 21.7
18.3 / 17.0
0.148 / 0.132 0.166 / 0.169
0.46
0.43
0.92
0.97

IPC-TM-650.2.4.8
IPC-TM-650.2.4.8.2a
IPC-TM-650.2.4.8
IPC-TM-650.2.4.41
IPC-TM-650.2.4.24
IPC-TM-650.2.4.24
IPC-TM-650.2.4.24
IPC-TM-650.2.4.24
ASTM D3039
ASTM D3039
ASTM E1461
ASTM E1461

3.5
3.4

3.3
3.2

3.5
3.4

3.3
3.2

0.00380.00470.00270.00340.00380.00470.00270.0034

1.93x1083.22x1083.60x107
2.60x108

MW - cm
MW - cm

1.93x1083.22x1083.60x107
2.60x108

MW - cm IPC-TM-650.2.5.17.1
MW - cm IPC-TM-650.2.5.17.1

6.12x107
9.34x1071667>50157

2.10x106
1.10x108
1800>50157

MWMW
V / milkVseconds

6.12x107
9.34x107
4.2x104>501572.10x106
1.10x1084.6x104>50157

MWMW
V / mmkVseconds

IPC-TM-650.2.5.17.1
IPC-TM-650.2.5.17.1
IPC-TM-650.2.5.6.2
IPC-TM-650.2.5.6
IPC-TM-650.2.5.1

215
240
390
pass

215
240
390
pass

°C
°C
°C

215
240
390
pass

215
240
390
pass

°C
°C
°C

>120>120minutes>120>120minutes

IPC-TM-650.2.4.24c
IPC-TM-650.2.4.24.3
IPC-TM-650.2.3.40
IPC-TM-650.2.6.16(modified)
IPC-TM-650.2.4.24.1

0.12
0.27
1.83

0.12
0.27
1.76

wt. %
% wt. chg.
g / cm30.12
0.27
1.83

0.12
0.27
1.76

wt. %
IPC-TM-650.2.6.2.1% wt. chg. IPC-TM-650.2.3.4.3
g / cm3

Mechanical Properties
Peel Strength - 1 oz. (35 micron) Cu
After Solder Float
At Elevated Temperature
After Exposure to Process Solutions
X / Y CTE [-40°C to +125°C]
Z Axis CTE Alpha 1 [50°C to Tg] 55% RC
Z Axis CTE Alpha 2 [Tg to 260°C] 55% RC
Z Axis Expansion [50°C to 260°C] 43% RC
Z Axis Expansion [50°C to 260°C] 55% RC
Young’s Modulus (X / Y)
Poisson’s Ratios (X / Y)
Thermal Conductivity
Specific Heat

W / mKJ / gKN / mmN / mmN / mmppm / °C
ppm / °C
ppm / °C%%
GN / m2
W / mKJ / gK

Electrical Properties
Dielectric Constant (Typical 65% RC)@ 2 GHz (Stripline)@ 10 GHz (Stripline)
Dissipation Factor (Typical 65% RC)@ 2 GHz (Split Post Cavity)@ 10 GHz (Split Post Cavity)
Volume Resistivity
C - 96 / 35 / 90
E - 24 / 125
Surface Resistivity
C - 96 / 35 / 90
E - 24 / 125
Electric Strength
Dielectric Breakdown
Arc Resistance

IPC-TM-650.2.5.5.5IPC-TM-650.2.5.5.5

Thermal Properties*Glass Transition Temperature (Tg)
TMA (°C)
DMA (°C) (Tan d Peak)
Degradation Temp (TGA) (5% wt. loss)
Pressure Cooker-60 min then solder dip@288°C until failure (max 10 min.)
T300

Chemical / Physical Properties
Moisture Absorption
Methylene Chloride ResistanceDensity [50% resin content]

All test data provided are typical values and not intended to be specification values. For review of critical specification tolerances, please contact a company representative directly.
*DMA is the preferred method for measuring Tg - other methods may be less accurate.

Rev 12-18