PRODUCT SPECIFICATION
Part
NumberProduct
Description
Doc
Number

USB3075

DRev

Date

18/04/11

Micro USB Receptacle, Type B, 5 Pin, SMT, Horizontal, Bottom
Mount, without Peg, with Outer Shell Stakes

Page

1

USB3075

Approved

VJ

PreparedCMwww.gct.co

CheckedDRPRODUCT SPECIFICATION
Part
NumberProduct
Description
Doc
Number

USB3075

DRev

Date

18/04/11

Micro USB Receptacle, Type B, 5 Pin, SMT, Horizontal, Bottom
Mount, without Peg, with Outer Shell Stakes

Page

2

USB3075

Approved

VJ

PreparedCM

CheckedDR

1.0 SCOPE.
This specification covers performance, tests and quality requirements for the Micro USB
Receptacle USB3075 (Type B, 5-Pin, SMT, Horizontal).

2.0 PRODUCT NAME AND PART NUMBER.
Micro USB Receptacle, 5 Pin, Type B: USB3075.

3.0 PRODUCT SHAPE, DIMENSIONS AND MATERIAL.
Please refer to drawings.

4.0 RATINGS.
4.1 Current rating: Signal (Pins 2, 3, 4)

1.0A

Power (Pins1, 5).....

1.8A

4.2 Voltage rating ………………………

30V AC

4.3 Operating Temperature Range ……

-30°C to +85°C

5.0 TEST AND MEASUREMENT CONDITIONS.
Product is designed to meet electrical, mechanical and environmental performance requirements
specified in Paragraph 6.0. All tests are performed in ambient conditions unlessotherwise specified.

6.0 PERFORMANCE.
Item

Test Condition

Requirement

Examination of Product

Visual, dimensional and functional
inspection as per quality plan.

Product shall meet requirements
of product drawing andspecification.

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PRODUCT SPECIFICATION
Part
NumberProductDescription
Doc
Number

USB3075

DRev

Date

18/04/11

Micro USB Receptacle, Type B, 5 Pin, SMT, Horizontal, Bottom
Mount, without Peg, with Outer Shell Stakes

Page

3USB3075

Approved

VJ

PreparedCM

CheckedDR

6.1 Electrical Performance.
ItemTest Condition

Requirement

Low-signal Level
Contact ResistanceMate connectors, measure by dry circuit,
20 mV Max. In accordance withEIA-364-23.

30 mΩ Max.

Insulation ResistanceMate/Un-mate connectors, apply
100V DC for 1 minute at sea level
between adjacent terminal or ground. In
accordance with EIA-364-21.

1000 MΩ Min.

Dielectric Strength

Mate/Un-mate connectors, apply
100V AC for 1 minute at sea level. In
accordance with EIA-364-20.

No Breakdown.

6.2 Mechanical Performance.
Item

Test Condition

Requirement

Mating/Un-mating Force(initial)

Mate/Un-mated at a rate of 12.5mm/min.
In accordance with EIA-364-13.

Mating force: 35N Max.
Un-Mating force: 8N Min. to 25NMax.

Durability

Cycle rate, 500 cycles per hour if done
automatically and 200 if manual cycles. Inaccordance with EIA-364-09.

10,000 cycles.
Low Level Contact Resistance:30mΩ Max.

Vibration

Mechanical ShockMate connectors and subject to 5.35 Gs
RMS. For a period of 15 minutes in eachof the 3 mutually perpendicular axes.
In accordance with EIA-364-28
Test condition V test letter A.
Mate connectors and subject to thefollowing shock conditions, 3 shocks shallbe applied along 3 mutually perpendicularaxis, passing 100 mA current during thetest. (Total of 18 shocks) Test Pulse:
Half Sine Peak Value: 294 m/s² (30G)
Duration: 11ms.
In accordance with EIA-364-27.
Test condition H.

www.gct.coAppearance: No Damage.
Contact Resistance: 50 mΩ Max.
Discontinuity: 1.0 µ second Max.

Appearance: No Damage.
Contact Resistance: 10 mΩ Max.
change allowed.
Discontinuity: 1.0 µ second Max.

PRODUCT SPECIFICATION
Part
NumberProduct
DescriptionDoc
NumberUSB3075

DRev

Date

18/04/11

Micro USB Receptacle, Type B, 5 Pin, SMT, Horizontal, Bottom
Mount, without Peg, with Outer Shell Stakes

Page

4USB3075

Approved

VJ

PreparedCM

CheckedDR

6.3 Environmental Performance and Others.
Item

Test Condition

Requirement

Humidity Test

Subject mated connectors to Duration:
168 hours temperature between -25°C to+65°C with 90 to 95% RH.
In accordance with EIA-364-31.
Test condition A method III

Appearance: No Damage.
Contact Resistance: 10 mΩ Max.
change allowed.
Insulation Resistance:
1000 MΩ Min.
Dielectric Strength: No Breakdown.

Salt Spray

Subject mated/unmated connectors to 5%
salt-solution concentration, 35°C for 48
hours. In accordance with EIA-364-26,
Test Condition B.

Low Level Contact Resistance:50mΩ Max.
No visible rust

Temperature Life

Subject mated connectors to temperature
life at +85ºC for 96hours.
In accordance with EIA-364-17.
Test condition 2 Method A.

Contact Resistance: 10 mΩ Max.
change allowed.
Insulation Resist.: 1000 MΩ Min.
Shall meet visual requirement andshow no physical damage.

Temperature Rise

Mate connector and measure thetemperature rise of contact when themaximum rated current is passed and inaccordance with EIA-364-70.

+30°C Max. change allowed.

Thermal ShockMate module and subject to follow
condition for 10 cycles.
At -55°C to +85°C. In accordance withEIA-364-32, test condition I.

No Damage
10mΩ Max. change allowed.
Insulation Resist: 1000 MΩ Min.
Dielectric Strength: No Breakdown.

Solderability

Dip solder-tails in flux then immerse insolder bath at 245 ±5°C up to 0.5mm
from the bottom of the housing for 4~5
seconds. In accordance with EIA-364-52,
category 2.

95% of immersed area must show
no voids, pin holes.

Resistance to Soldering
Heat (Reflow Soldering)

Sample mounted on PCB and subject tosolder bath method,
Temperature:260°C for 10±1 sec(High Temp. Thermoplastic).
In accordance with EIA-364-56.

Without deformation of shell orexcessive looseness of theterminals (pin.)

Resistance to Soldering
Heat (Hand Soldering)

Sample mounted on PCB and subject tohand iron soldering,Temperature:350±10°C for 3±1 sec(High Temp. Thermoplastic).

Without deformation of shell orexcessive looseness of theterminals (pin.)www.gct.co

PRODUCT SPECIFICATIONPartNumber
Product
Description
Doc
Number

USB3075DRevDate

18/04/11

Micro USB Receptacle, Type B, 5 Pin, SMT, Horizontal, Bottom
Mount, without Peg, with Outer Shell Stakes

Page

5USB3075

Approved

VJCMPrepared

DRChecked

7.0 RESISTANCE TO INFRARED REFLOW SOLDERING HEAT
7.1 Lead Free Process: Reflow soldering cycles limited to two times
Temp 260ºC

TEMPERATURE ON BOARD PATTERN SIDE

Peak temp 260ºC
MAX.(10sec. Max）

200ºC Min
40 sec. Min

Slope<3ºC/Sec
230ºC Min
Pre-heat Hold time for 150~180ºC
Max. is 60~120sec.
8.0 PRODUCT QUALIFICATION AND TEST SEQUENCE
Test ItemTest GroupABCDEFGHIJK

1514151414161414131313

Low-signal Level Contact Resistance

225262525272525

Insulation Resistance3

Dielectric Withstanding Voltage

4

Examination of ProductMating / Unmating Forces

3849
3Durability

3Vibration

4

Mechanical Shock

3Humidity

3Salt Spray5

Temperature Life

3

Temperature Rise
Thermal Shock3
4

Solderability

2

Resistance to Reflow Soldering Heat

2

Resistance to Hand Soldering Heat2

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PRODUCT SPECIFICATIONPartNumberProduct
DescriptionDocNumberUSB3075

DRevDate

18/04/11

Micro USB Receptacle, Type B, 5 Pin, SMT, Horizontal, Bottom
Mount, without Peg, with Outer Shell Stakes

Page

6

USB3075

Approved

VJ

PreparedCM

CheckedDR

Revision details :Revision

Information

Page

Release DateA

Specification released.

-18/04/11

B

New current rating.

2

31/10/11

C

Specification revision.

-04/07/12

DThermal Shock & Mating/Umating Additional Info.

3, 4

10/06/13

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