Low Noise AmplifierMMIC
17-21 GHz and 27-31 GHz

ReliaSat
Product Datasheet

KKa-LNA-1929

GaAs PHEMT MMIC Low Noise Amplifier 17-21
GHz & 27-31 GHz.

Overview

KKa-LNA-1929 is a 3-stage MMIC low noise
amplifier that covers frequencies from 17 GHz to21 GHz and from 27 GHz to 31 GHz. This MMIC
provides up to 20 dB of stable gain, with a noise
figure of 2.5 dB from a 4 V supply voltage and41 mA current. By incorporating a self-biased
configuration the MMIC provides enhanced
temperature stability with no need for a negative
supply voltage.
The MMIC is fully passivated for additional
protection and has all bond pads and backside
gold plated. It is compatible with precision die
attach methods, as well as thermo-compression
and thermosonic wire bonding, making it ideal
for MCM and hybrid microcircuit applications.
All data shown is measured with the chip in a
50 Ohm environment, with 100 pF decoupling
capacitors on all DC connections and iscontacted using RF probes.

KKa-LNA-1929

Issue Date: 15/05/2023•••••

Features17-21 GHz & 27-31 GHz frequency
ranges
20 dB gain
2.5 dB noise figure
Unconditionally stable
No negative DC supply
requirement

Applications•••••

High speed data communications
Space communications
IOTSecurity
5G

DOC REV 4

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Information furnished by ReliaSat is believed to be accurate. No responsibility is assumed by ReliaSat for its use, nor for any infringements on the rights of other parties that may result for the useof the information herein. All specifications are subject to change without notice.

Low Noise Amplifier
MMIC

ReliaSat

17-21 GHz and 27-31 GHz

Product Datasheet

Specification Overview
ParameterMin

Operational Frequency Range

17TypGain

2121.6

Input Return Loss

1020dB

Output Return Loss

5.58dB

Noise Figure

2.5MaxUnit

21GHz

22.5dB

3.2dB

31GHz

24dB

Operational Frequency Range

27

Gain

1620

Input Return Loss

67dB

Output Return Loss

810dB

Noise Figure

2.5

3.5

dB

Drain Voltage

4VCurrent

41mA

The tests indicated have all been performed with 100pF de-coupling capacitors on
all bias pads. All tests are carried out at 25 °C.

Absolute Maximum Ratings
ParameterRating

Drain Voltage

6V

Drain Current

132 mA

RF Input Power

7 dBm

Storage Temperature-65 oC to +150 oC

Channel Temperature+150 oC

Operating Temperature-40 oC to +85 oC

ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards
can discharge without detection. Although this product features proprietary
protection circuitry, damage may occur on devices subjected to ESD. Proper
ESD precautions should be taken to avoid performance degradation or loss offunctionality.

KKa-LNA-1929

Issue Date: 15/05/2023

DOC REV 4Page 2 of 7

Information furnished by ReliaSat is believed to be accurate. No responsibility is assumed by ReliaSat for its use, nor for any infringements on the rights of other parties that may result for the useof the information herein. All specifications are subject to change without notice.

Low Noise AmplifierMMIC
17-21 GHz and 27-31 GHz

ReliaSat
Product Datasheet

Measured Performance DataGain

Noise Figure

KKa-LNA-1929

Issue Date: 15/05/2023

DOC REV 4

Page 3 of 7

Information furnished by ReliaSat is believed to be accurate. No responsibility is assumed by ReliaSat for its use, nor for any infringements on the rights of other parties that may result for the useof the information herein. All specifications are subject to change without notice.

Low Noise AmplifierMMIC
17-21 GHz and 27-31 GHzReliaSat
Product Datasheet

Input Return Loss

Output Return Loss

KKa-LNA-1929

Issue Date: 15/05/2023

DOC REV 4Page 4 of 7

Information furnished by ReliaSat is believed to be accurate. No responsibility is assumed by ReliaSat for its use, nor for any infringements on the rights of other parties that may result for the useof the information herein. All specifications are subject to change without notice.

Low Noise AmplifierMMIC
17-21 GHz and 27-31 GHzReliaSat
Product Datasheet

Outline drawing

Notes
1. All dimensions are in um
2. Typical DC bond pads are 80 um square
3. RF bond pads are 105 x 120 um
4. All pads have gold metallisation
5. Gold backside metallisation
6. Backside metal is ground
7. Connections are not required for unlabelled bond pads
8. Die thickness is 100 um
Die Packing Information
All die delivered using gel-packs unless otherwise requested.

KKa-LNA-1929

Issue Date: 15/05/2023

DOC REV 4

Page 5 of 7

Information furnished by ReliaSat is believed to be accurate. No responsibility is assumed by ReliaSat for its use, nor for any infringements on the rights of other parties that may result for the useof the information herein. All specifications are subject to change without notice.

Low Noise Amplifier
MMIC

ReliaSat

17-21 GHz and 27-31 GHz

Product Datasheet

Pad Descriptions
Name

Description

RFIN

Input RF pad. This pad is AC coupled

RFOUT

Output RF pad. This pad is AC coupled.

VCCx

Drain bias pad for stage x.

BOTTOM

The die backside must be connected to RF/DCground.

Connection Configurations(Not actual die – these rules are applied to all MMICs unless otherwise stated)

KKa-LNA-1929

Issue Date: 15/05/2023

DOC REV 4

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Information furnished by ReliaSat is believed to be accurate. No responsibility is assumed by ReliaSat for its use, nor for any infringements on the rights of other parties that may result for the useof the information herein. All specifications are subject to change without notice.

Low Noise AmplifierMMIC
17-21 GHz and 27-31 GHz

ReliaSat
Product Datasheet

General Notes On Assembly

Die should be mounted on conductive material such as gold-plated metal to providea good ground and suitable heat sink, if necessary.
1. Attaching the die using Au/Sn preforms is preferable. The Eutectic melt for
Au/Sn occurs at approximately 280oC so the die (plus mount and preform) is
initially heated up to 180oC and then it is heated for approximately 10 seconds
to 280oC using a nitrogen heat gun. The device will survive 10 seconds at thistemperature. The static breakdown for GaAs devices is approximately 330oC.
2. Pure, dry nitrogen should be used as the heat source.
3. If the devices cannot be lifted/ placed by a vacuum device, then ESD die-lifting
tweezers are preferable.
4. Supply lines should be decoupled with 100pF capacitors. Larger planar
capacitors could be used if available.
5. Aluminium wire must not be used.

Application Circuit

Evaluation boards are available on request.

Contact Information
ReliaSat European Offices
e: sales@reliasat.com
www.reliasat.com
KKa-LNA-1929

Issue Date: 15/05/2023

DOC REV 4

Page 7 of 7

Information furnished by ReliaSat is believed to be accurate. No responsibility is assumed by ReliaSat for its use, nor for any infringements on the rights of other parties that may result for the useof the information herein. All specifications are subject to change without notice.