MBN52832 Data
Sheet

BLE Module

Revision History
Revision

Date

AuthorChange Description

0.1

06/03/2016

RF PD

Preliminary version

0.2

06/16/2016

RF PD

Modified the module block diagram.

0.3

8/25/2016

RF PD

Update test data points

0.4

8/27/2016

RF PD

Update module dimension and reference schematic

0.5

12/15/2016

RF PD

Applied model/type name MBN52832 to the datasheet

0.6

02/01/2017

RF PD

Update Table 2.1 and Figure 2.2

0.7

03/15/2017

RF PD

Add sleep current

0.8

05/26/2017

RF PD

Table 2.2 change pin 36, 37 pin 36 description to NC.
Add section 6.1 and 6.2, recommendation for host PCB landing andplacement.
Updated reference schematic.
Add section 9 and section 10, assembly and packaging information.
Add section 12 Notice.
Add section 13 Preconditions to use the module.

0.9

07/27/2017

RF PD

Add regulatory section

0.92

8/23/2017

RF PD

Update layout guidance for antenna connection; updated regulatory
information

1.0

10/06/2017

MurataUpdate the max height to 0.9mm, remove the sample part number.

1.1

06/14/2018

MurataRemove Section 17, support contact.

1.2

10/10/2018

MurataAdded FCC and IC certification update for portable application in section
11.6

1.3

11/13/18

MurataCorrected typos in section 7.

1.4

02/06/2020

MurataCorrected module height in figure 2.1
Reformatted the content of section 2.3
Add KC certificate information. Fig 10.7; table 11.1; add section 11.7

1.5

12/02/2020

MurataCorrected the TELEC ID in table 11.1

1.6

03/17/2022

MurataUpdate the ETSI EN300 328 standard version in section 11

1.7

08/02/2022

MurataCorrect EN300 328 version in section 11.5

Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2017
MBN52832 Data Sheet, v1.7, 08/02/2022

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Table of Contents
REVISION HISTORY .............................................................................................................................................................. 1
TABLE OF CONTENTS ......................................................................................................................................................... 2
1

INTRODUCTION ............................................................................................................................................................ 5
1.1
1.2
1.3
1.4
1.5

2

MECHANICAL SPECIFICATION .................................................................................................................................. 7
2.1
2.2
2.3
2.4

3

Features ..................................................................................................................................................................... 5
Applications ................................................................................................................................................................ 5
Block Diagram ............................................................................................................................................................ 6
Acronyms ................................................................................................................................................................... 6
References ................................................................................................................................................................. 6

Module Dimensions .................................................................................................................................................... 7
Top and Side View ..................................................................................................................................................... 7
PCB Footprint Top View............................................................................................................................................. 8
Pin Configuration ........................................................................................................................................................ 9

DC ELECTRICAL SPECIFICATION ............................................................................................................................ 12
3.1

Typical Power Consumption .................................................................................................................................... 124

RF SPECIFICATION .................................................................................................................................................... 125ENVIRONMENTAL SPECIFICATION ......................................................................................................................... 13
5.1
5.2

Absolute Maximum Rating ....................................................................................................................................... 13
Recommended Operating Condition ........................................................................................................................ 136

POWER SEQUENCE ................................................................................................................................................... 13

7

APPLICATION INFORMATION ................................................................................................................................... 14
7.1
7.2
7.3
7.4

Recommended PCB Landing Pattern ...................................................................................................................... 14
Host PCB Layout Recommendations ...................................................................................................................... 15
Layout Guidance for Using Internal PCB Antenna .................................................................................................. 16
Layout Guidance for Microstrip Design And External Antenna ................................................................................ 178

APPLICATION REFERENCE ...................................................................................................................................... 20

9ASSEMBLY INFORMATION ....................................................................................................................................... 21

10

PACKAGING AND MARKING INFORMATION .......................................................................................................... 2210.1 Dimensions of Tape (Plastic tape) ........................................................................................................................... 2210.2 Dimensions of Reel .................................................................................................................................................. 23
10.3 Taping Diagrams ...................................................................................................................................................... 24
10.4 Leader and Tail tape ................................................................................................................................................ 25
10.5 Peeling Force ........................................................................................................................................................... 26
10.6 PACKAGE (Humidity proof Packaging) ................................................................................................................... 26
10.7 Module Marking Information..................................................................................................................................... 27
10.8 Moisture Sensitivity Level......................................................................................................................................... 27

11

REGULATORY INFORMATION .................................................................................................................................. 28
11.1 FCC Notice (USA) .................................................................................................................................................... 28
11.2 FCC Labeling Requirements .................................................................................................................................... 29
11.3 IC Notice (Canada) .................................................................................................................................................. 29
11.4 IC Labeling Requirements........................................................................................................................................ 30
11.5 ESTI compliance (Europe) ....................................................................................................................................... 30
11.6 RF Exposure ............................................................................................................................................................ 30

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11.6.1
Using on-board PCB antenna ..................................................................................................................... 30
11.6.2Using external antenna ............................................................................................................................... 30
11.7 KC Certificate Notice ................................................................................................................................................ 30
12

ROHS INFORMATION ................................................................................................................................................. 31

13

ORDERING INFORMATION ........................................................................................................................................ 31

14

NOTICE ........................................................................................................................................................................ 32
14.1 Storage Conditions ................................................................................................................................................... 32
14.2 Handling Conditions ................................................................................................................................................. 32
14.3 Standard PCB Design (Land Pattern and Dimensions) ........................................................................................... 32
14.4 Notice for Chip Placer .............................................................................................................................................. 32
14.5 Operational Environment Conditions ....................................................................................................................... 32
14.6 Input Power Capacity ............................................................................................................................................... 33

15

PRECONDITIONS TO USE MURATA PRODUCTS ................................................................................................... 34

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LIST OF FIGURES
Figure 1.1 Block Diagram ........................................................................................................................................................ 6
Figure 2.1 Module Top and Side View (Unit: mm) .................................................................................................................. 7
Figure 2.2 Module Footprint Top View (Unit: mm) .................................................................................................................. 8
Figure 2.3 Pinout Diagram Top View ...................................................................................................................................... 9
Figure 7.1 Recommended PCB Landing Pattern.................................................................................................................. 14
Figure 7.2 Host PCB Layout Recommendation, top view ..................................................................................................... 15
Figure 7.3 Layout Guide for Antenna Performance (1) ......................................................................................................... 16
Figure 7.4 Layout Guide for Antenna Performance (2) ......................................................................................................... 17
Figure 7.5 Layout Guide for External Antenna (1) ................................................................................................................ 18
Figure 7.6 Layout Guide for External Antenna (2) ................................................................................................................ 18
Figure 8.1 Reference Design ................................................................................................................................................ 20
Figure 9.1 Reflow Profile ....................................................................................................................................................... 21
Figure 10.1 Tape Dimensions (Unit in mm) .......................................................................................................................... 22
Figure 10.2 Reel Dimensions (Unit: mm) .............................................................................................................................. 23
Figure 10.3 Tape Diagram .................................................................................................................................................... 24
Figure 10.4 Tape Leader and Tail ......................................................................................................................................... 25
Figure 10.5 Peeling Force Diagram ...................................................................................................................................... 26
Figure 10.6 Packaging Diagram............................................................................................................................................ 26
Figure 10.7 Module Marking Diagram ................................................................................................................................... 27
LIST OF TABLES
Table 2.1: Module Dimensions ................................................................................................................................................ 7
Table 2.2 Pinouts .................................................................................................................................................................. 10
Table 3.1 Typical Power Consumption ................................................................................................................................. 12
Table 4.1 RF Characteristics ................................................................................................................................................. 12
Table 5.1 Absolute Maximum Rating .................................................................................................................................... 13
Table 5.2 Recommended Operating Condition ..................................................................................................................... 13
Table 11.1 Regulatory Standards Conformance................................................................................................................... 28
Table 11.2 External Antenna to comply with FCC and IC .................................................................................................... 28
Table 11.3 External Antenna to comply with IC .................................................................................................................... 29

Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2017
MBN52832 Data Sheet, v1.7, 08/02/2022
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1 Introduction
MBN52832 is a Bluetooth Low Energy module. It enables ultra-low power connectivity for data communication. The productintegrates Nordic Bluetooth Low Energy IC, RF front end, and crystal. This is an ideal solution for Internet of Things (IOT)
application.

1.1

Features•

Bluetooth® v5oHigher throughputoIncreased broadcast capacityo

Improved channel co-existence algorithm (SCA)•

ANT, NFC Tag•

Nordic nRF52832 Bluetooth Smart®

•

Built-in ARM Cortex M4 core with 64KB RAM and 512KB flash•

Dimension 7.4 x 7.0 x 0.9 mm•

Packaging: LGA•

Bluetooth/ANT Antenna Configuration:oOn-board PCB antennaoSupports external antenna from pin pad•

Maximum transmit power: +4dBm @ antenna port (LDO Mode)•

Receive sensitivity: -93dBm @ 1Mbps (LDO Mode)•

Power consumptiono

TX 7mA @ 3.5dBm (DCDC Mode)oRX 6mA (DCDC Mode)•

Host interface: UART, SPI•

Other interfaces: 20 GPIO, 5 ADC, UART, SPI (master and slave), I2C, PWM and Debug SWD•

Operating temperature range: -40 ºC to 85 ºC•

RoHS compliant•

MSL Level 3 in accordance with JEDEC J-STD-020•

Regulatory certificates: FCC, IC, ETSI (plan)

1.2

Applications•

Home Automation•

Proximity Services•

Building automation•

Medical/Healthcare•

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1.3

Block Diagram
BLE/ANT
Antenna

NFC Antenna(Optional)

32MHz X’tal

VCC
SPI

To external or
on-board
antenna

Matching
circuit

NordicnRF52832

UART
SWD
GPIO/AIO

32KHz X’tal(for ANT only
Optional)Inductor for DC/DC(optional)

Figure 1.1 Block Diagram

1.4

Acronyms- AIO- GPIO- I2C- LPCOMP- SPI- UART

1.5

Analog Input / Output
General Purpose Input / Output
Inter-Integrated Circuit
Low Power Comparator
Serial Peripheral Interface
Universal Asynchronous Receiver Transmitter

References[1] Nordic Semiconductor, nRF52832 - Product Specification v1.3, 2017[2] Nordic Semiconductor, nRF52832-CIAA Pin assignment and mechanical dimensions, 2016

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2 Mechanical Specification
2.1

Module Dimensions
Table 2.1: Module Dimensions
Parameter
Dimension (L x W x H)

2.2

Typical7.4 ±0.2mm x 7.0 ±0.2mm x 0.9 (max)

Unit
mm

Top and Side View

7.4mm typ.

Pin 1

0.9mm
max.

7.0mm typ.

Figure 2.1 Module Top and Side View (Unit: mm)

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MBN52832 Data Sheet, v1.7, 08/02/2022
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2.3

PCB Footprint Top View

Figure 2.2 Module Footprint Top View (Unit: mm)

Mark
L

Dimensions
7.4±0.2

Mark
W

Dimensions
7.0±0.2

MarkT

Dimensions
0.9 MAXMark

Dimensions

a1

0.3±0.1

a2

0.3±0.1b1

0.3±0.2b2

0.425±0.2

b3

0.3±0.2c1

0.6±0.1c2

0.6±0.1e1

0.65±0.1e2

0.65±0.1g1

0.35±0.1

g2

0.5±0.1g3

0.35±0.1

g4

2.6±0.1m1

0.3±0.1m2

0.6±0.1m3

0.3±0.1m4

0.3±0.1m5

0.3±0.1m6

0.6±0.1s1

0.425±0.2

s2

0.3±0.2s3

0.475±0.1

s4

0.35±0.1

s5

0.825±0.1

s6

0.35±0.1

s7

0.5±0.1s8

0.5±0.1s9

0.4±0.1

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2.4

Pin Configuration

Figure 2.3 Pinout Diagram Top View

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Table 2.2 Pinouts

Pin # Pin Name
1
P0_09/NFC ANT
2
P0_06
P0_00/XL1
3
4
5
6
7

Nordic IC Pin
P0.09/NFC
P0.06
P0.00/XL1

I/O
I/O
I/O

I/O

Description
GPIO; NFC antenna connection.
GPIO
Connection for 32.768kHz crystal (LFXO);GPIOConnection for 32.768kHz crystal (LFXO);GPIO
GNDModule power supply
DC/DC converter output pin. *Refer toreference schematic.
1V3 regulator supply decoupling. Input from
DC/DC converter. Output from 1.3V LDO.
*Refer to reference schematic.
GPIO; SAADC/COMP/LPCOMP input
GPIO; SAADC/COMP/LPCOMP input
GPIO; SAADC/COMP/LPCOMP input
GPIO; SAADC/COMP/LPCOMP input
GPIO; SAADC/COMP/LPCOMP input
GPIO
GPIO
Serial Wire Debug I/O for debug andprogramming.
GPIO; Configurable as system RESET pin
Serial Wire Debug clock input for debug
and programming.
GND*Refer to reference schematic.
RF signal output. Connect to ANTIN for onboard antenna or to external antenna.
*Refer to reference schematic.
GPIO; Trace port output;

I/O

GPIO; Trace port output.

I/O

GPIO; Trace port output.

I/O

GPIO; Trace port output.

I/O
I/O
I/O
I/O

GPIO; NFC antenna connection.
GPIO
GPIO
GPIO
Ground.
Ground.
Ground.
Ground.

I/O

P0_01/XL2

P0.01/XL2

GND
VCC
DCC

VDD
DCC

DEC

DEC4

P0_02/AIN0
P0_05/AIN3
P0_03/AIN1
P0_04/AIN2
P0_29/AIN5
P0_07
P0_08
SWDIO

P0.02/AIN0
P0.05/AIN3
P0.03/AIN1
P0.04/AIN2
P0.29/AIN5
P0.07
P0.08
SWDIO

I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O

P0_21/RESETSWDCLK

P0.21/RESETSWDCLK

I/O
I/O

GND
ANTIN
ANTOUT

GND

P0_18/TRACE0

P0.18/TRACEDATA[0]P0.16/TRACEDATA[1]
P0.15/TRACEDATA[2]
P0.14/TRACEDATA[3]
P0.10/NFC
P0.20
P0.17
P0.13

I/O

8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33

P0_16/TRACE1
P0_15/TRACE2
P0_14/TRACE3
P0_10/NFC ANT
P0_20
P0_17
P0_13
GND
GND
GND
GND

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MBN52832 Data Sheet, v1.7, 08/02/2022
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Pin #
34
35
36
37

Pin Name
GND
GND
NC
NC

Nordic IC Pin

I/O

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MBN52832 Data Sheet, v1.7, 08/02/2022
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Description
Ground.
Ground.
NC
NC

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3 DC Electrical Specification
3.1

Typical Power Consumption
Table 3.1 Typical Power Consumption

TX Active @3.5dBm
RX Active
Sleep Mode

LDO mode
DCDC mode
LDO mode
DCDC mode
System Off
System On with internal RC
System On with external 32kHz crystal

Current
16
7
14
6
0.36
2.13
1.79

Unit
mA
mA
mA
mA
uA
uA
uA

4 RF Specification
Conditions: 25ºC, VCC=3.3V, Parameters measured at RF connector.
Table 4.1 RF Characteristics
RF Characteristics
Center frequency
Channel Spacing
Number of RF Channels
Max output power

LDO mode
DCDC mode

Modulation Characteristics
Δf1avgΔf2max (at 99.9%)
Δf2avg / Δf1avg
Carrier frequency offset and drift
1) Frequency offset: | fn – fTX |2) Frequency drift: | f0 – fn |3) Drift rate #0: | f1 – f0 |4) Drift rate #n: | fn – fn-5 |Receiver sensitivity (PER LDO mode
< 30.8%)DCDC mode
Maximum input signal level (PER < 30.8%)

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MBN52832 Data Sheet, v1.7, 08/02/2022
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Min.
2402
-

Specification
Max.
Typ.
2480
2
40
4.0
3.5

Unit
MHz
MHz
dBm
dBm

225
185
0.8

-

275
-

kHz
kHz
-

-

-93
-90
-

150
50
20
20
-70
-70
-

kHz
kHz
kHz
kHz
dBm
dBm
dBm

-10

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5 Environmental Specification
5.1

Absolute Maximum Rating
Table 5.1 Absolute Maximum Rating
Description
Storage temperature
Operating temperature
VCC
VIO, VDD ≤ 3.6 V
VIO, VDD > 3.6 V
NFC antenna pin current
RF input level

5.2

Min
-40
-40
-0.3
-0.3
-0.3

Max
+125
85
+3.9
VCC+0.3
3.9
80
10

Unit
°C
°C
V
V
V
mA
dBm

Recommended Operating Condition
Table 5.2 Recommended Operating Condition
Parameter
Operating Temperature Range
VCC
Supply rise time (0V to 1.7V)

Min
-40
1.7

Max
85
3.6
60

Unit
°C
V
ms

6 Power Sequence
For device start up sequence, please refer to Nordic Semiconductor, nRF52832 - Product Specification [1].

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7 Application Information
7.1

Recommended PCB Landing PatternFigure 7.1 Recommended PCB Landing Pattern

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7.2

Host PCB Layout Recommendations

Figure 7.2 Host PCB Layout Recommendation, top view

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7.3

Layout Guidance for Using Internal PCB Antenna

The MBN52832 module is certified with an internal PCB antenna physically located on the module. For optimum EIRP
(Effectively Isotropically Radiated Power) when use the on-board antenna, please follow the following recommendations in
the customer host circuit board design.
A. The module is recommended is be placed on top left corner of the host circuit board.
B. Around the antenna area, all layers of the customer circuit board should be free of any metal objects. Specifically,
there should be no ground plane, traces or metal shield case
C. Host circuit PCB length is longer than 40mm to get optimal performance by using ground plane.
D. Right side of antenna area also should be free of grounds.
E. Metal and plastic materials should be away from the module. (more than 3mm)

Figure 7.3 Layout Guide for Antenna Performance (1)F. To use this internal antenna, the integrator must provide a simple two-component matching circuit between pins 20
and 21 of the module. This circuit will connect the RF I/O of the module directly to the PCB antenna. The picture
below shows the location of pins 20 and 21.

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Figure 7.4 Layout Guide for Antenna Performance (2)The Integrator must place the matching circuit shown below between Pins 20 and 21 of the Module to duplicate thestructure used during FCC/IC testing of the MBN52832. Use the exact PNs provided for L1 and C2 to meet regulatory
requirements.
On the integrator’s support board, place L1 between Pin 20 and Pin 21 of the Module. Place C2 adjacent to Pin 21. The
other side of C2 should be attached to RF Ground.
Any technical implementation questions regarding the layout or design of this circuit should be directed to Murata module
technical support.

7.4

Layout Guidance for Microstrip Design And External Antenna

The MBN52832 module is certified with an internal PCB antenna and two external antennas; a 7 dBi omni antenna and a 6
dBi patch antenna.
Either patch or omni antenna should be connected to the MBN module using 50 ohm microstrip and a U.FL RF connector
as shown below. This microstrip and U.FL connector are placed on the customer’s PCB and are external to the MBN
module. The patch or omni antenna is then connected to this UFL Connector via a 50 ohm RF adapter cable.

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Figure 7.5 Layout Guide for External Antenna (1)The design of the 50 ohm microstrip on the customer’s PCB is crucially important. Compliant operation of the MBN isdependent on proper construction of this 50 ohm line and the following guidelines must be followed to ensure legal operationof the product.
The diagram below shows the required microstrip structure to be routed between module pin TP21 and the UFL connector.
The top PCB trace carries the RF energy from module to UFL connector. The Layer2 ground plane provides a return pathfor the circuit. The Dielectric material (along with the dimensions of the microstrip structures) determines the characteristic
impedance of the microstrip transmission line.

Figure 7.6 Layout Guide for External Antenna (2)Note the representative dimensions shown in the drawing above. It is imperative that the module customer (the integrator)
use the exact dimensions we recommend to ensure a 50-ohm impedance for this transmission line.
The following dimensions and/or ratios should be used to set the microstrip impedance to 50 ohms.
Dielectric (PCB) Material – We recommend standard FR-4 PCB material. Other dielectrics will work but will require
recalculation of microstrip dimensions. The following guidance is predicated on the use of FR-4 Dielectric. If FR-4 is not
used for PCB material, please contact Murata Electronics at (678) 684-2009 to determine new dimensions for microstrip
structure.
H (Dielectric Height) – this is the thickness of dielectric between the trace layer (layer 1) and the ground plane on layer 2.
Note that layer 2 must be electrical ground. We recommend a dielectric thickness of 8-15 mils. This range provides thecustomer with some flexibility in board construction.
t (trace thickness) – Microstrip impedance is not severely affected by the thickness dimension. Standard 1oz or 2oz copper
deposition is recommended. Equivalent thickness is 1-2 mils.
W (trace width) – this is the crucial dimension. This width must be set correctly to obtain the desired 50 ohms impedance.
When using FR-4 dielectric, the width (W) of the microstrip trace should be set to:

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W = H * 1.8
Where W is microstrip trace width and H is Dielectric height. Note that both values must be measured in identical units (milsor mm)
Example:H = 12 mils, W = 12 * 1.8 = 21.6 mils
H = 0.4 mm W = 0.4 * 1.8 = 0.72 mm
l (trace length) – the impedance of the microstrip line is not dependent on its length. However, regulatory and performance
limitations practically determine the actual length to be used by the customer (integrator). The length of this microstrip line
must be longer than 7 mm to mimic the length used during FCC/IC certification of the MBN52832 module. Lengths longer
than 7 mm are acceptable although additional signal loss will occur as a result. Given these restrictions, Murata recommends
microstrip trace lengths between 7 mm and 25 mm.
In any event, the microstrip line must operate over the same Dielectric-Ground Plane configuration shown above to act as
a 50 ohm transmission line. Do not run the microstrip trace through sections of PCB that do not have the Dielectric-Groundplane configuration shown above.
A reliable 50 ohm transmission line will be produced if the above guidance is closely followed. Any deviations from theguidance above may cause the module to operate in noncompliant manner. Any implementation questions or concerns
should be directed to Murata module technical support. .

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8 Application Reference

Notes:
Option #1: DC/DC converter: as it is
Option #2: LDO: remove L1 and L2

Figure 8.1 Reference Design

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9 Assembly Information
The recommendation conditions of soldering are as in the following figure.
When products are immersed in solvent after mounting, pay special attention to maintain the temperature difference within
100 °C. Soldering must be carried out by the above mentioned conditions to prevent products from damage. Set up thehighest temperature of reflow within 260 °C. Contact Murata before use if concerning other soldering conditions.
Reflow soldering standard conditions

Figure 9.1 Reflow Profile

Please use the reflow within 2 times.
Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less.
Since this Product is Moisture Sensitive, any cleaning is NOT permitted.

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10 Packaging and Marking Information
10.1 Dimensions of Tape (Plastic tape)Figure 10.1 Tape Dimensions (Unit in mm)

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10.2 Dimensions of Reel

Figure 10.2 Reel Dimensions (Unit: mm)

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10.3 Taping Diagrams[1] Feeding Hole :As specified in (1)[2] Hole for chip : As specified in (1)[3] Cover tape

: 62 um in thickness[4] Base tape

: As specified in (1)Feeding Hole
Feeding Direction
Pin 1 Marking
Chip

Figure 10.3 Tape Diagram

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10.4 Leader and Tail tape
Feeding
direction

Tail tape(No components)

Components

40 to 200mm

No components
150mm min.

Leader tape
(Cover tapealone)
250mm min.

Figure 10.4 Tape Leader and Tail

The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled toward the user.
The cover tape and base tape are not adhered at none components area for 250 mm min.
Tear off strength against pulling of cover tape: 5 N min.
Packaging unit: 1000 pcs./ reel
Material:- Base tape : Plastic- Reel : Plastic- Cover tape, cavity tape and reel are made the anti-static processing.

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10.5 Peeling Force
1.3 N max. in the direction of peeling as shown below.

1.3 N max.
165 to 180 °Cover tapeBase tapeFigure 10.5 Peeling Force Diagram

10.6 PACKAGE (Humidity proof Packaging)Label べル
表示ラDesiccant
乾燥剤

Humidity

湿度

Indicator
イ ン ジケ－タ

表示ラLabelベル

防湿梱包袋
Anti-humidity
Plastic Bag
Figure 10.6 Packaging Diagram

Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant and the humidity
indicator.

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10.7 Module Marking Information
Figure 10.7 shows the module marking. Dimensions are nominal, not absolute.

Figure 10.7 Module Marking Diagram

10.8 Moisture Sensitivity Level
The MBN52832 is planned to be qualified to moisture sensitivity level 3 in accordance with JEDEC J-STD-020.

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11 Regulatory Information
The table below shows the regulatory compliance status of the MBN52832 module.
Table 11.1 Regulatory Standards Conformance
Regulatory Body
FCC
IC
ETSI
TELEC
KC

BT SIG

Standard
Part 15
RSS-210
EN300 328, Ver. 2.2.2
ETSI EN301.489 - 17
Article 38-24 Paragraph 1of the Radio Law
Non-license based
wireless device technicalstandard (MSIT notice2019-105)
BT 5.0

Certificate ID
HSW2832
4492A-2832
Compliant
001-P01041
R-C-VPY-MBN52832

Declaration ID: D036210
QDID: 97989

MBN52832 also has been certified with following external antennae (see table below).
Table 11.2 External Antenna to comply with FCC and ICPart Number

VendorGain (dBi)Type

Connector

S2406PL

Cushcraft

6.0

Patch

U.FL

HG2407RD-RSP

L-Comm7.0

DipoleU.FL

Remarks
Necessary for FCC/IC
compliance only.
Necessary for FCC/IC
compliance only.

To be compliant with RED Directive while using MBN52832 module with external antenna, the total EIRP including theantenna gain should be less than or equal to 10dBm.

11.1 FCC Notice (USA)Warning: Changes or modifications to this device not expressly approved by Murata could void the user’s authority tooperate the equipment.
This device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions: (1) this device may
not cause harmful interference, and (2) this device must accept any interference received, including interference that may
cause undesired operation.
The FCC requires the OEM to be notified that any changes or modifications not expressly approved by Murata may void
the user’s authority to operate the equipment. While an application of the MBN52832 module in a product is not required toobtain a new FCC authorization for the module, this does not preclude the possibility that some other form of authorizationor testing may be required for that end product.
This device using the integrated antenna has been tested to comply with FCC CFR Part 15. The device meets therequirements for modular transmitter approval as detailed in the FCC 47 CFR 15.212.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the
FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used inaccordance with the instructions, may cause harmful interference to radio communications. However, there is no guaranteethat interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or

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television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct
the interference by one or more of the following measures:• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver.
• Is connected.
• Consult the dealer or an experienced radio/TV technician for help.

11.2 FCC Labeling Requirements
When integrating the MBN52832 into a product the FCC labeling requirements must be met. This includes a clearly visiblelabel on the outside of the finished product specifying the MBN52832 FCC identifier (FCC ID: HSW2832) as well as thenotice above. The exterior label can use wording such as “Contains Transmitter Module FCC ID: HSW2832” or “Contains
FCC ID: HSW2832” although any similar wording that expresses the same meaning may be used.

11.3 IC Notice (Canada)
The term “IC” before the certification/registration number only signifies that the Industry Canada technical specifications
were met.
Le terme “IC” devant le numéro de certification /d’enregistrement signifie seulement que les spécifications techniques
Industrie Canada ont été respectées.
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to
The following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference,
including interference that may cause undesired operation of the device.
Cet appareil est conforme avec Industrie Canada RSS standard exempts de licence (s). Son utilisation est soumise à Les
deux conditions suivantes: (1) cet appareil ne peut pas provoquer d'interférences et (2) cet appareil doit accepter Touteinterférence, y compris les interférences qui peuvent causer un mauvais fonctionnement du dispositif.
This device complies with Health Canada’s Safety Code 6 / IC RSS-210. The installer of this device should ensure that RF
radiation is not emitted in excess of the Health Canada’s requirement. Information can be obtained at: http://www.hcsc.gc.ca/ewh-semt/pubs/radiation/radio_guide-lignes_direct-eng.php
Cet appareil est conforme avec Santé Canada Code de sécurité 6 / IC RSS-210. Le programme d'installation de cet appareil
doit s'assurer que les rayonnements RF n'est pas émis au-delà de l'exigence de Santé Canada. Les informations peuventêtre obtenues: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/radio_guide-lignes_direct-eng.php
This radio transmitter MBN52832 has been approved by Industry Canada to operate with the antenna types listed below
with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum
gain indicated for that type, are strictly prohibited for use with this device.
Le présent émetteur radio (identifier le dispositif par son numéro de certification ou son numéro de modèle s'il fait partie dumatériel de catégorie I) a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés cidessous et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non
inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation
de l'émetteur.
Table 11.3 External Antenna to comply with ICPart Number

VendorGain (dBi)Type

Connector

S2406PL

Cushcraft

6.0

Patch

U.FL

HG2407RD-RSP

L-Comm7.0

DipoleU.FL

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Remarks
Necessary for FCC/IC
compliance only.
Necessary for FCC/IC
compliance only.

www.murata.com

11.4 IC Labeling Requirements
The host device should be properly labeled to identify the module within the host device. The Industry Canada certification
label of a module shall be clearly visible at all times when installed in the host device, otherwise the host device must belabeled to display the Industry Canada certification number of the module, preceded by the words “Contains transmittermodule”, or the word “Contains”, or similar wording expressing the same meaning, as follows:
Contains transmitter module IC: 4492A-2832, where 4492A-2832 is the module’s certification number.

11.5 ESTI compliance (Europe)
This device has been tested for use in the European Union. Both MBN52832 comply with the following regulation test.
ETSI EN300 328, Ver. 2.2.2
ETSI EN301.489 - 17
If this device is used in a product, the OEM has responsibility to verify compliance of the final product to the EU standards.
A Declaration of Conformity must be issued and kept on file as described in Annex II of the Radio and Telecommunications
Terminal Equipment Directive.

11.6 RF Exposure
11.6.1 Using on-board PCB antennaThis equipment complies with radiation exposure limits set forth for an uncontrolled environment. This equipment is in
direct contact with the body of the user under normal operating conditions. This transmitter must not be co-located or
operating in conjunction with any other antenna or transmitter.
Cet équipement est conforme aux limites d'exposition aux radiations dans un environnement non contrôlé. Cetéquipement est en contact direct avec le corps de l'utilisateur dans des conditions de fonctionnement normales. Cetémetteur ne doit pas être co-localisées ou opérant en conjonction avec tout autre antenne ou transmetteur.
11.6.2 Using external antennaThis equipment complies with radiation exposure limits set forth for an uncontrolled environment. This equipment should beinstalled and operated with minimum distance 20 cm between the radiator and your body. This transmitter must not be colocated or operating in conjunction with any other antenna or transmitter.
Cet équipement est conforme aux limites d'exposition aux radiations dans un environnement non contrôlé. Cet équipement
doit être installé et utilisé à distance minimum de 20 cm entre le radiateur et votre corps. Cet émetteur ne doit pas être colocalisées ou opérant en conjonction avec tout autre antenne ou transmetteur.
If the module will be used for portable applications, the device must undergo SAR testing.
The following statement must be included as a CAUTION statement in manuals for the products to alert users on FCC RF
exposure compliance:“WARNING: To satisfy FCC RF exposure requirements for mobile transmitting devices, a separation distance of 20 cm or
more should be maintained between the antenna of this device and persons during operation. To ensure compliance,
operations at closer distances than this are not recommended.”

11.7 KC Certificate Notice
Certification Number:
R-C-VPY-MBN52832
Name of the applicant:Murata Manufacturing Co., Ltd.
Name of the equipment name (written in the certification): Specific low power wireless device (wireless device for wirelessdata communication system)
Model name:
MBN52832

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Date of Certification:
Manufacturer/The country of origin:

February 2020
Murata Manufacturing Co., Ltd./ China

12 RoHS Information
The MBN52832 module is conformed to RoHS requirement.

13 Ordering Information
Product

Model Name

Murata Ordering Part Number

Standard Order
Increment

BLE Module

MBN52832

WSM-BL241-ADA-008

1000 pc

Development Kit

MBN52832DK

WSM-BL241-ADA-008DK

1 pcs

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14 Notice14.1 Storage Conditions
Please use this product within 6month after receipt.
- The product shall be stored without opening the packing under the ambient temperature from 5 to 35deg.C and humidityfrom 20 to 70%RH.
(Packing materials, in particular, may be deformed at the temperature over 40deg.C.)- The product left more than 6months after reception, it needs to be confirmed the solderbility before used.
- The product shall be stored in non-corrosive gas (Cl2, NH3, SO2, Nox, etc.).
- Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp object and dropping
the product, shall not be applied in order not to damage the packing materials.
This product is applicable to MSL3 (Based on JEDEC Standard J-STD-020)- After the packing opened, the product shall be stored at <30deg.C / <60%RH and the product shall be used within
168hours.
- When the color of the indicator in the packing changed, the product shall be baked before soldering.
Baking condition: 125+5/-0deg.C, 24hours, 1time
The products shall be baked on the heat-resistant tray because the material (Base Tape, Reel Tape and Cover Tape) are
not heat-resistant.

14.2 Handling Conditions
Be careful in handling or transporting products because excessive stress or mechanical shock may break products.
Handle with care if products may have cracks or damages on their terminals, the characteristics of products may change.
Do not touch products with bear hands that may result in poor solder ability and destroy by static electrical charge.

14.3 Standard PCB Design (Land Pattern and Dimensions)
All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern should be provided
between IN and OUT terminals. Please refer to the specifications for the standard land dimensions.
The recommended land pattern and dimensions is as Murata's standard. The characteristics of products may varydepending on the pattern drawing method, grounding method, land dimensions, land forming method of the NC terminals
and the PCB material and thickness. Therefore, be sure to verify the characteristics in the actual set. If use non-standard
lands, contact Murata beforehand.

14.4 Notice for Chip Placer
When placing products on the PCB, products may be stressed and broken by uneven forces from a worn-out chucking
locating claw or a suction nozzle. To prevent products from damages, be sure to follow the specifications for the
maintenance of the chip placer being used. For the positioning of products on the PCB, be aware that mechanicalchucking may damage products.

14.5 Operational Environment Conditions

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Products are designed to work for electronic products under normal environmental conditions (ambient temperature,humidity and pressure). Therefore, products have no problems to be used under the similar conditions to the abovementioned. However, if products are used under the following circumstances, it may damage products and leakage ofelectricity and abnormal temperature may occur.
- In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.).
- In an atmosphere containing combustible and volatile gases.
- Dusty place.
- Direct sunlight place.
- Water splashing place.
- Humid place where water condenses.
- Freezing place.
If there are possibilities for products to be used under the preceding clause, consult with Murata before actual use.
As it might be a cause of degradation or destruction to apply static electricity to products, do not apply static electricity orexcessive voltage while assembling and measuring.

14.6 Input Power Capacity
Products shall be used in the input power capacity as specified in this specification.
Inform Murata beforehand, in case that the components are used beyond such input power capacity range.

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15 PRECONDITIONS TO USE MURATA PRODUCTS
PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS.
Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the specificationsof our product when our product is mounted to your product.
All the items and parameters in this product specification/datasheet/catalog have been prescribed on the premise that our
product is used for the purpose, under the condition and in the environment specified in this specification. You are requested
not to use our product deviating from the condition and the environment specified in this specification.
Please note that the only warranty that we provide regarding the products is its conformance to the specifications provided
herein. Accordingly, we shall not be responsible for any defects in products or equipment incorporating such products, which
are caused under the conditions other than those specified in this specification.
WE HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED,INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THAT THEY ARE
DEFECT-FREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS.
The product shall not be used in any application listed below which requires especially high reliability for the prevention ofsuch defect as may directly cause damage to the third party's life, body or property. You acknowledge and agree that, if you
use our products in such applications, we will not be responsible for any failure to meet such requirements. Furthermore,
YOU AGREE TO INDEMNIFY AND DEFEND US AND OUR AFFILIATES AGAINST ALL CLAIMS, DAMAGES, COSTS,
AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT LIMITATION, ATTORNEY FEES AND COSTS, DUE
TO THE USE OF OUR PRODUCTS IN SUCH APPLICATIONS.
- Aircraft equipment.
- Aerospace equipment- Undersea equipment.
- Power plant control equipment - Medical equipment.
- Transportation equipment (vehicles, trains, ships, elevator, etc.).
- Traffic signal equipment.
- Disaster prevention / crime prevention equipment.
-Burning / explosion control equipment- Application of similar complexity and/ or reliability requirements to the applications listed in the above.
We expressly prohibit you from analyzing, breaking, reverse-engineering, remodeling altering, and reproducing our product.
Our product cannot be used for the product which is prohibited from being manufactured, used, and sold by the regulations
and laws in the world.
We do not warrant or represent that any license, either express or implied, is granted under any our patent right, copyright,
mask work right, or our other intellectual property right relating to any combination, machine, or process in which our
products or services are used. Information provided by us regarding third-party products or services does not constitute alicense from us to use such products or services or a warranty or endorsement thereof. Use of such information may requirea license from a third party under the patents or other intellectual property of the third party, or a license from us under ourpatents or other intellectual property.
Please do not use our products, our technical information and other data provided by us for the purpose of developing ofmass-destruction weapons and the purpose of military use.
Moreover, you must comply with "foreign exchange and foreign trade law", the "U.S. export administration regulations", etc.
Please note that we may discontinue the manufacture of our products, due to reasons such as end of supply of materials
and/or components from our suppliers.
By signing on specification sheet or approval sheet, you acknowledge that you are the legal representative for your company
and that you understand and accept the validity of the contents herein. When you are not able to return the signed versionof specification sheet or approval sheet within 30 days from receiving date of specification sheet or approval sheet, it shallbe deemed to be your consent on the content of specification sheet or approval sheet. Customer acknowledges thatengineering samples may deviate from specifications and may contain defects due to their development status. We reject
any liability or product warranty for engineering samples. In particular we disclaim liability for damages caused by- the use of the engineering sample other than for evaluation purposes, particularly the installation or integration in the
product to be sold by you,-deviation or lapse in function of engineering sample,-improper use of engineering samples.
We disclaim any liability for consequential and incidental damages.
If you can’t agree the above contents, you should inquire our sales.

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