Medical Nanosystem Engineering

Fukushima Lab.

Dept. Mechanical Systems Engineering, Graduate School of Engineering＊Please contact us if you want to visit our lab.
In our laboratory, we can give students more opportunities to obtain the
deep knowledge and a great deal of experience through advanced
micro/nano-fabrication, integration, and assembly technologies incleanroom. Students who can positively address challenges by themselveswith logical thinking and never-give-up attitude are welcome.

Assoc. Prof.
Takafumi Fukushima

Presentation at international conferences are highly recommend.
The annual schedules of the conferences we often participate are as follows:・ May, IEEE Electronic Components and Technology Conference (ECTC)・ Aug.. IEEE International Flexible Electronics Technology Conference (IFETC)・ Sept., International Conference on Solid State Devices and Materials (SSDM)
・ Oct., IEEE International 3D System Integration Conference (3DIC)

We are working on specialized education and researches toward biomedical micro/nano integrated systems
based on electronic packaging called Jisso engineering that involves interdisciplinary fields between material,mechanical, and electrical engineering. Jisso engineering is an essential science for the development of smart
phones, wearable devices, humanoid robots, and so forth. Research activities of our laboratory aim to explore
technological innovation to realize upcoming Internet of Everything (IoE) societies. In particular, ourresearches focus on the technologies of new “flexible hybrid electronics (FHE)” based on wafer-levelpackaging and tiny chiplets embedded in biocompatible film substrates. The advanced FHE are optimallydesigned with 3D integrated circuit (3D-IC), MEMS, optics, bio chips, and high-density interconnections toconstruct highly integrated heterogeneous flexible systems. We collaborate with T. Tanaka/H. Kino Lab.
The followings are current projects (Lab. URL: http://www.lbc.mech.tohoku.ac.jp):
1. Flexible device system integration technology for biomedical/healthcare applications
2. Three-dimensionally integrated chip technology for advanced neuromorphic computing
3. Self-assembly technology of tiny devices and ultra-fine pitch interconnects for future IoE society

Flexible device system integration technology
We are fabricating 3D stacked retina prosthesis (3D imagesensor) on flexible substrates to restore visual sensation forblind patients. This flexible system has wireless power supply
components to achieve high QOL. We also developing flexible Siprobes to cure brain diseases or analysis brain functions. So far,
our laboratory has implemented multi-functional Si probes
having micro-channels to deliver chemicals/drugs and opticalwaveguides to stimulate deep brain with photo signal. Various
sensors will be assembled on the Si probes to createnext-generation brain-machine interfaces (BMI). We collaborate
with Faculty of Medicine and Graduate School of Information.

Three-dimensionally integrated chip technology
The human brain has 3D stacked structures that areelectrochemically contacted through synaptic connections withextremely low power consumption without heat generation. For

the next-generation brain computing chips, we are proceedingwith the researches for high-performance 3D stacked IC that is
electrically connected through 3D interconnects called TSV(Through-Silicon Via) with multi-functional polymer technologies.
Upcoming automatic driving systems and neuromorphic
computing will be produced with the 3D ICs.

Self-assembly nanotechnology of tiny devices
Self-assembly is an innovative process in which a disorderedsystem of pre-existing components forms an organized small
structure or micropatterns as a consequence of specific andlocal interactions among the components themselves without
external forces. We have successfully self-assembled tiny ICs
and optical chips within 100 nm in alignment accuracy using
liquid surface tension as a driving force. This research is toward
future wearable/implantable microsystems such as biomedical
sensors and innovative micro-LED display application etc.