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onsemi andand other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or
subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi
product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without
notice. The information herein is provided “as-is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality,or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all
liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws,
regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application
by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized
for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for
implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees,
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Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others.

NCV7702B
1 A Dual H-Bridge DriverThis dual full-bridge driver IC is intended for 14 V automotive
stepper and DC motor applications. Its four half-bridge outputs are
configured as two channels and are programmed by six TTL
compatible inputs, allowing flexible control of bridge operation. The
device operates in standby mode, run mode, or brake mode andtypically consumes less than 1 mA while in standby. In run mode,each half-bridge output can deliver load current in either direction.
Brake mode activates the low side transistors or high side transistors
at the selected outputs. On-chip recirculation diodes are provided,
and the IC has multiple fault protection modes. Overcurrent
detection protects against shorted loads between outputs and shorts
to supply or ground at each output. An overcurrent fault condition
activates an internal timer, which modulates faulted outputs at low
duty cycle. An overcurrent condition in one channel does not affectoperation in the other. Overvoltage and overtemperature detection
are also provided, and turn off all bridge outputs during these fault
conditions. Recovery from all fault conditions is automatic; the IC
will resume normal operation in its previously selected mode upon
fault resolution. Diagnostic ability is provided by two open-collector
STATUS outputs which report the fault status of each channel
independently during overcurrent faults, and together during
overvoltage or overtemperature faults.
Featureshttp://onsemi.com
SO-24LDW SUFFIX
CASE 751E

24
1

MARKING DIAGRAM
24
NCV7702BAWLYYWWG
1
A
WL
YY
WW
G

•Single 7 V-16 V Supply•Low Standby Current:= Assembly Location= Wafer Lot= Year= Work Week
= Pb-Free Device

PIN CONNECTIONS♦< 1.0 mA Typically

VB1
OUT1B
OUT1A
STATUS1
PGND
PGND
PGND
PGND
IN1A
IN1B
AGND
EN1

•3.3 V / 5 V Compatible Inputs•Independent Channel Enable•Channels Configurable as:♦Full-Bridge Drive♦Half-Bridge, High Side or Low Side Drive•On-Chip Recirculation Diodes•Fault Protection with Automatic Recovery for:♦Overcurrent

1

24

VB2
OUT2B
OUT2A
STATUS2
PGND
PGND
PGND
PGND
IN2A
IN2B
CT
EN2

♦Overvoltage♦Overtemperature•Fault Diagnostic STATUS Outputs•Internally Fused Leads in SO–24L Package•AEC Qualified•PPAP Capable•These are Pb-Free Devices*

ORDERING INFORMATION
DeviceApplications•Automotive and Industrial Driver for:

Package

Shipping†

NCV7702BDWG

SO-24L(Pb-Free)31 Units/Rail

NCV7702BDWR2G

SO-24L 1000 Tape & Reel
(Pb-Free)†For information on tape and reel specifications,
including part orientation and tape sizes, pleaserefer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.

♦DC or Stepper Motors♦Relays or Solenoids♦Unipolar or Bipolar Loads*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2007

October, 2007 - Rev. 1

1

Publication Order Number:
NCV7702B/D

NCV7702B
OUT1A

VB1

OUT1B

Bandgap
Regulator

OUT2A
Overvolt.

Overtemp.

OV

OT

VB2

OUT2B

STATUS2

VBG

OC

Half-Bridge Control

Half-Bridge Control

OC

Overcurrent
Duty Cycle

OC

Half-Bridge Control

VBG

Half-Bridge Control

STATUS1

OC

OV
OT

OV
OT

PGND PGND PGND PGND EN1 IN1A IN1B

CT

AGND

IN2B IN2A EN2 PGND PGND PGND PGND

Figure 1. Block Diagram
MAXIMUM RATINGS
Rating

Value

Unit

-0.5 to 30

V

60

V

-0.3 to 7.0

V

150

°C

Storage Temperature Range-65 to 150°C

Package Thermal Resistance:
Junction-to-Case, RqJC
Junction-to-Ambient, RqJA

9
55

°C/W
°C/W

2.0
200

kV
V

260 peak°C

3-Power Supply Voltage, VB
Peak Transient Voltage (46 V Load Dump @ VB = 14 V)
Logic Inputs & Status Outputs
Junction Temperature, TJ

ESD Capability

Human Body Model
Machine Model

Peak Reflow Soldering Temperature (60 to 150 seconds at 217°C) (Note 1)
Moisture Sensitivity Level (MSL)

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affectdevice reliability.
1. For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.

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2

NCV7702B
ELECTRICAL CHARACTERISTICS (7.0 V v VB v 16 V, -40°C v TJ v 125°C; unless otherwise specified.) Notes 2 and 3.
Test Conditions

Characteristic

Min

Typ

Max

Unit

-

1.0
-

10
40

mA
mA

General Characteristics
Quiescent Current

Standby Mode, VB ≤ 12.8 V
Run Mode, IOUT = 750 mA, Both Channels

Logic Inputs
High Level Input Voltage, VIH

-

2.0

-

-

V

Low Level Input Voltage, VIL

-

-

-

0.8

V

INX Input Current

VIN = 5.0 V
VIN = 0 V

-5.0

0
0

5.0
-

mA
mA

ENX Input Current

VIN = 5.0 V
VIN = 0 V

-5.0

130
0

200
5.0

mA
mA

ENX Delay, tPE

50% of ENX to 50% of OUTX; Note 4 Turn ON
Turn Off

-

-

25
60

ms

Saturation Voltage, VSLISTATUS = 4.0 mA

-

-

0.4

V

Leakage Current

VSTATUS = 5.0 V

-

-

10

mA

Total Output Saturation Voltage

IOUT = 750 mA, Each Channel

-

2.5

3.0

V

Output Saturation Voltage HighIOUT = 750 mA, VB - VOUT, Each Driver

-

1.25

1.6

V

Output Saturation Voltage Low

IOUT = 750 mA, VOUT - VPGND, Each Driver

-

1.25

1.6

V

Output Leakage

VOUT = VB
VOUT = VPGND

-5.0

0
0

5.0
-

mA
mA

Overcurrent Threshold, IOC

Low Side, Each ChannelHigh Side, Each Channel

0.9
0.775

1.25
0.900

1.6
1.10

A

Overcurrent Duty Cycle

470 pF ≤ CT ≤ 1500 pF; Note 5

3.0

4.0

6.0

%

Switching Delay, tPI
Sink to Source
Source to Sink

50% of INX to 60% of OUTX; Note 6
50% of INX to 40% of OUTX; Note 6

0.20
0.20

-

14
10

Dead Band Time, tDB

Note 6

0.10

-

10

ms

Recirculation Diode Forward Voltage

IDIODE = 750 mA

-

-

2.5

V

Status Outputs

Half-Bridge Driver Outputs

ms

Delay Timer
Charge Current, ICHG

-

-85

-65

-45

mA

Discharge Current, IDCH

-

1.25

2.0

3.25

mA

Input Threshold High, VCH

-

1.85

2.0

2.15

V

Input Threshold Low, VDC

-

200

300

400

mV

Global Fault Protection
Overtemperature Detection Threshold

Note 7

150

-

210

°C

Overtemperature Hysteresis

Note 7

-

15

-

°C

Overvoltage Detection Threshold

Note 8Overvoltage Hysteresis

-

26

28

30

V

500

850

1200

mV

2. Designed to meet these characteristics over the stated voltage and temperature recommended operating ranges, though may not be 100%
parametrically tested in production.
3. Operation is guaranteed down to VB = 6.0 V. Electrical characteristics may be outside the limits at that voltage.
4. See Figures 2 and 3; VB = 14 V, R = 100 W.
5. CT must remain in this range to guarantee proper operation, and to ensure part integrity, during hard short conditions.
6. See Figures 2 and 4; VB = 14 V, R = 100 W.
7. Guaranteed by design.
8. Consult factory for no overvoltage detection or lower overvoltage detection threshold options.

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3

NCV7702B
PACKAGE PIN DESCRIPTION
PACKAGE PIN #PIN SYMBOLFUNCTION

1

VB1

2

OUT1B

Half-bridge output controlled by IN1B.

3

OUT1A

Half-bridge output controlled by IN1A.

4STATUS1

Diagnostic output; reports channel #1 fault condition.

5

PGND

Power supply return.

6

PGND

Power supply return.

7

PGND

Power supply return.

8

PGND

Power supply return.

9

IN1A

Logic level input.

10

IN1B

Logic level input.

11

AGND

Analog supply return; reference for external CT capacitor, device substrate.

12

EN1

Enable for OUT1A and OUT1B.

13

EN2

Enable for OUT2A and OUT2B.

14

CT

External capacitor; sets overcurrent delay time and duty cycle.

15

IN2B

Logic level input.

16

IN2A

Logic level input.

17

PGND

Power supply return.

18

PGND

Power supply return.

19

PGND

Power supply return.

20

PGND

Power supply return.

21

STATUS2

Diagnostic output; reports channel #2 fault condition.

22

OUT2A

Half-bridge output controlled by IN2A.

23

OUT2B

Half-bridge output controlled by IN2B.

24

VB2

Power supply input voltage; overvoltage detection occurs at this pin.

Power supply input voltage.

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4

NCV7702B
INPUT LOGIC TABLE
EN1 = EN2 = 0 = Standby Mode
Channel #1

Channel #2

EN1

IN1A

IN1B

OUT1A

OUT1B

Mode

EN2

IN2A

IN2B

OUT2A

OUT2B

Mode

1

0

0

Low

Low

Brake Low

1

0

0

Low

Low

Brake Low

1

0

1

Low

High

Run

1

0

1

Low

High

Run

1

1

0

High

Low

Run

1

1

0

High

Low

Run

1

1

1

High

High

Brake High

1

1

1

High

High

Brake High

0

X

X

|Z|

|Z|

Off

0

X

X

|Z|

|Z|

Off

NOTE:

X = Don't Care; |Z| = Output Off.

STATUS OUTPUT TABLESTATUS1STATUS2

Fault Diagnostic

1

1

No Fault.

0

1

Channel 1 Overcurrent; Note 910Channel 2 Overcurrent; Note 900Overvoltage, Overtemperature or Overcurrent in Both Channels; Notes 9 and 10

9. During overcurrent, the STATUS outputs will be modulated at the overcurrent duty cycle rate. See Figure 5.
10. During overtemperature, the STATUS outputs will be modulated by the thermal time constants.
+14 V

1

24

VB2

VB1
R
OUTX
R

OUT1B

OUT2B

OUT1A

OUT2A

STATUS1STATUS2
PGND

PGND

PGND
PGND
NCV7702B
PGND
PGND

INX

PGND

PGND

IN1A

IN2A

IN1B

IN2B

AGND

CT

EN1

EN2

12

ENX

13

Figure 2. Propagation Delay and Dead Band Timing Test Circuit

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5

NCV7702B

VIH
ENX

VIL
tPE
ON

OUTX
OFF
T

Figure 3. ENX Propagation Delay

VIH
INX

VIL
tPI

tPI
VSRC

OUTX

60%

½VB

40%

VSNK
tDB

tDB
T

Figure 4. OUTX Propagation Delay and Dead Band Timing

STATUSX

VSH
VSL
IOC
ION

OUTX
OFF
CT

VCH

tON

tOFF

VDC
0
T

Figure 5. Overcurrent, Status and Duty Cycle Timing

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6

NCV7702B
Functional Description
The NCV7702B is arranged as four half-bridge drivers in
two independent channels. Each channel can be operated asa full-bridge or half-bridge to drive multiple loadconfigurations. Separate ENable inputs are used to control
which channel is active. Each ENable input has a nominal
50 kW internal pull-down resistor to ensure that the outputs
remain off during power-up. The four INX control inputs
address each half-bridge output, and each output follows thestate of its input. When INX is at logic one, OUTX is sourcing
current from the VB supply; when INX is at logic zero,
OUTX is sinking current to the PGND return.

current IDCH. Upon detection of overcurrent, charging
current ICHG is switched on and the CT capacitor begins
charging from zero towards the timer's upper threshold(VDH.) When the capacitor voltage crosses VDH the faulted
channel's outputs are switched off and the channel's
STATUS output is switched from VSH to VSL (see Figure 5.)
The charging current is switched off, and the capacitor
voltage decreases toward the timer's lower (VDL) threshold.
Upon crossing the lower threshold, the channel's outputs are
switched on and the channel's STATUS output returns to its
VSH voltage. This behavior continues until the fault
condition is resolved. If the fault condition is resolved
before VDH is reached, the timer is reset and no modulationof the previously faulted channel's half-bridge or STATUS
outputs occurs.
After the timer's initial charge cycle, the output off timeis:
tOFF = CT (VCH - VDc)/ IDCH.
The output on time is: tON = CT (VCH - VDc)/ ICHG.
The timer period is:
T = tOFF + tON.
The value of the CT capacitor is required to be in the rangeof 470 to 1500 pF. Values below 470 pF may cause timer
mis-operation due to internal delays, while values above
1500 pF may cause excessive power dissipation.
Connecting the CT pin to ground will prevent operation of
the current limit function.

Half-Bridge Drivers
The half-bridge drivers of each OUTX are comprised of
an NPN Darlington driver on the low-side and a compound
PNP-NPN driver on the high-side. Each half-bridge driveris capable of 1 A (min) peak current and is overcurrent
protected against load and system faults. Cross conduction
currents within each half-bridge are suppressed by the useof a dead-band timer. Each INX input contains an
independent dead-band timer that is activated on eitheredge of the input transition.
Overcurrent detection circuitry is provided in both the
low-side and high-side drivers of each half-bridge output.
When activated, the overcurrent detectors trigger an internal
timer which causes both half-bridge drivers in the samechannel to be modulated at 4% (Typ.) duty cycle. The timer
also activates the channel's STATUS output, causing it to be
similarly modulated (see Figure 5.) Upon removal of thefault condition, the channel automatically resumes
operation in its previously programmed mode and its
STATUS output returns to a no-fault state.
Recirculation diodes at each OUTX clamp load transients
to either VB or PGND and help contain switching currents
within each load loop.

Overvoltage and Overtemperature Protection
Overvoltage detection circuitry is intended to allow
limited operation of the NCV7702B during double-battery
conditions. Detection is via the VB1 pin and causes bothchannels of the IC to be switched off when the detection
threshold is exceeded. Hysteresis is provided to improvenoise immunity of the overvoltage function.
Overtemperature detection circuitry monitors thejunction temperature internal to the IC and is intended toensure reliability by preventing excessive power
dissipation. The detection circuitry is centrally located on
the IC and causes both channels of the IC to be switched off
when the detection threshold is exceeded. Hysteresis isprovided to improve noise immunity of the overtemperaturefunction.
Both STATUS outputs are switched to the VSL state
during either overvoltage or overtemperature faults. Normal
operation of the IC is resumed automatically upon resolution
the fault, and the STATUS outputs return to the VSH State.

Overcurrent Duty Cycle Timer
A single timer for overcurrent duty cycle is common toboth channels. The timer is triggered when a half-bridge ineither channel has detected an overcurrent fault. An external
capacitor connected to the NCV7702B's CT pin is used toprogram the period of the timer, and the ratio of two
internally fixed currents programs the timer's duty cycle.
The capacitor voltage is normally kept at zero by discharge

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7

NCV7702B
33

2.54

31

2.52

29
2.50

25

VSAT (V)IVB (mA)

27
VB = 7 V

23
21

VB = 16 V

2.46
2.44

VB = 16 V

19

2.48

VB = 7 V

2.42

17
15
-50

0

50

100

2.40
-50

150

TEMPERATURE (°C)

050
TEMPERATURE (°C)

100

Figure 6. Run Mode Bias Current vs. Temperature

Figure 7. Total VSAT vs. Temperature

150

MBR2040LT31000 mF
50 V

47 nF

+

1

24

VB2

VB1

22 nF

OUT1B

OUT2B

OUT1A

OUT2A

STATUS1STATUS2

PGND

PGND

VIGN

PGND
PGND
NCV7702B
PGND
PGND
PGND

PGND

IN1A

IN2A

IN1B

IN2B

AGND

CT

NCV8501
VOUT

VIN

+

VBAT
7 V - 16 V

RESET ENABLE

12

FLAG

DELAY

MON

GND

13

EN1

EN2

CT
1.0 nF

Microcontroller

VDD
RST
I/O

+

Figure 8. Application Diagram
NOTE:

Both VB inputs must be connected to the power supply. All PGND pins must be connected to the power supply return (GND).
For best thermal performance, the PGND pins should be connected to a thermal plane (heat sink) on the PC board.

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8

NCV7702B
PACKAGE DIMENSIONS
SO-24LDW SUFFIX
CASE 751E-04
ISSUE E-A24

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBARPROTRUSION. ALLOWABLE DAMBARPROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.

13-B- 12X P
0.010 (0.25) M B M
1

12

24X

D

J

0.010 (0.25) M T A

S

B S
F
R X 45 _C-TSEATING
PLANE

M
22X

G

K

DIM
A
B
C
D
F
G
J
K
M
P
R

MILLIMETERS
MIN
MAX
15.25
15.54
7.40
7.60
2.35
2.65
0.35
0.49
0.41
0.90
1.27 BSC
0.23
0.32
0.13
0.29
0_
8_
10.05
10.55
0.25
0.75

INCHES
MIN
MAX
0.601
0.612
0.292
0.299
0.093
0.104
0.014
0.019
0.016
0.035
0.050 BSC
0.009
0.013
0.005
0.011
0_
8_
0.395
0.415
0.010
0.029

ON Semiconductor andare registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or deathassociated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

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Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada
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USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
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Phone: 81-3-5773-3850

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For additional information, please contact your local
Sales Representative

NCV7702B/D