U.S. Patent No. 6,475,962B1 & 6,900,163B2U.S. Patent No. 6,475,962B1 6610635 & 6,900,163B2

MICRO-FAZE® A
Dry-to-touch Thermal Pad
Product Code: 52046

TECHNICAL DATA SHEETTHERMALLY CONDUCTIVE INTERFACE MATERIAL
Product Description
MICRO-FAZE® A is a dry-to-touch thermal interface
pad formulated with non-silicone thermal grease. It
was developed by AOS to offer the low thermal
resistance in a thermal interface without the mess ofgrease. MICRO-FAZE A is a die-cut aluminum foil
substrate coated on both sides with speciallyformulated thermal grease that is naturally tacky but dry
to the touch. MICRO-FAZE A is non-wax-based andoffers low pressure and temperature heat transferproperties.

Product Features & Benefits• MICRO-FAZE A retains all the unique advantages ofthermal grease but in the form of a thermal interface film.
• Minimum force (< 15 psi) is required to achieve totalinterface contact.
• MICRO-FAZE allows for total “wetting action” to fill all
microscopic surface voids without changing phase.
• Unlike phase change materials, heat transfer starts at25ºC or lower, making MICRO-FAZE A an excellent
choice for cold plate applications.
• Offers maximum heat transfer capability for powercomponents.
• Excellent replacement for phase change materials andsilicone pads.
• MICRO-FAZE A is a “drop-in-place” product that is easy
to use and handle in a manufacturing environment.
• Naturally tacky – no adhesive, fiberglass or other nonconductive material is used that may penalize thermalresistance.
• Thixotropic nature prevents run out.
• The material will withstand an operating temperature rangeof up to 200 oC for brief periods.

Available Configurations
MICRO-FAZE A is available in rolls and can be die-cut toexact specifications.

Major Applications
 Power modules, IGBTs, DC-DC converter modules, solidstate relays, diodes, power MOSFETs, RF components andthermoelectric modules.
 Microprocessors, multichip modules, ASICs and otherdigital components.
 Power amplifiers, large area applications for power supplies
and other custom enclosure heat dissipating surfaces.

Typical Properties
Physical Properties

A4

A6

SubstrateAluminum

Aluminum

Substrate Thickness

0.002in.

0.002in.

Compound Thickness (per side)

0.001in.

0.002in.

Total Thickness

0.004in.

0.006in.

Thermal Resistance @ 70 psi &36 oC

0.144 °C-in2 / W

0.183 °C-in2 / W

Thermal Conductivity @ 36 oC

3.0 W/m-K

2.8 W/m-K

Thermal Properties(ASTM D-5470-06)o

AOS Micro-faze® Thermal Resistance @ 55 C

0.30000.2500®

0.2000Micro-Faze A6

oC/W
0.15000.1000®

Micro-Faze A4
0.050022 Meridian Road, Suite 6, Eatontown, New Jersey 07724(732) 389-5514 • fax (732) 389-6380 • e-mail sales@aosco.com • web
http://www.aosco.com

0.000002040

psi

6080100120

Please know that customers are responsible for testing AOS Thermal Compounds materials for their proposed use. Any information furnished by AOS Thermal Compounds andits agents is believed to be reliable, but AOS Thermal Compounds does not guarantee the results to be accurate and makes no warranties as to the fitness, merchantability, or
suitability of any AOS material or product for any specific or general use and shall not be held liable for incidental or consequential damages of any kind.
(040206)