EPO-TEK® 353ND
Technical Data Sheet
For Reference OnlyHigh Temperature Epoxy

Date:
Rev:
No. of Components:
Mix Ratio by Weight:
Specific Gravity:
Pot Life:
Shelf Life- Bulk:
Shelf Life- Syringe:

September 2017
XXIXTwo
10 : 1
Part A: 1.20
Part B: 1.02
≤ 3 Hours
One year at room temperature
Six months at -40°C

Recommended Cure: 150°C / 1 Hour

Syringe: 1.18
Syringe: ≤ 2 Hours

Minimum Alternative Cure(s):May not achieve performance properties below
150°C / 1 Minute
120°C / 5 Minutes
100°C / 10 Minutes
80°C / 30 Minutes

NOTES:● Container(s) should be kept closed when not in use.
● Filled systems should be stirred thoroughly before mixing and prior to use.
● Performance properties (rheology, conductivity, others) of the product may vary from those stated on the data sheet when bi-pak/syringe packaging or
post-processing of any kind is performed. Epoxy’s warranties shall not apply to any products that have been reprocessed or repackaged from Epoxy’s
delivered status/container into any other containers of any kind, including but not limited to syringes, bi-paks, cartridges, pouches, tubes, capsules, films
or other packages.
● Syringe packaging will impact initial viscosity and effective pot life, potentially beyond stated parameters.
● If product crystalizes in storage, place container in warm oven until crystallization disappears. Please refer to Tech Tip #7 on website.
● TOTAL MASS SHOULD NOT EXCEED 25 GRAMS
Product Description: EPO-TEK® 353ND is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical
applications. It is one of the most popular EPO-TEK® brand products, and is known throughout the world for its performance and reliability. Also
available in single component frozen syringe.
Typical Properties: Cure condition: 150°C / 1 Hour
Different batches, conditions & applications yield differing results.
Data below is not guaranteed. To be used as a guide only, not as a specification. * denotes test on lot acceptance basis

PHYSICAL PROPERTIES:* Color (before cure):* Consistency:* Viscosity (23°C) @ 50 rpm:
Thixotropic Index:* Glass Transition Temp:
Coefficient of Thermal Expansion (CTE):
Below Tg:
Above Tg:
Shore D Hardness:Lap Shear @ 23°C:
Die Shear @ 23°C:
Degradation Temp:
Weight Loss:@ 200°C:@ 250°C:@ 300°C:
Suggested Operating Temperature:
Storage Modulus:
Ion Content:

Part A: Clear (Gardner < 5) Part B: Amber (Gardner < 18)
Pourable liquid
3,000 - 5,000 cPs
N/A≥ 90 °C (Dynamic Cure: 20-200°C/ISO 25 Min; Ramp -10-200°C @20°C/Min)

Cl-:
NH4+:

54206
85
> 2,000≥ 15412x 10-6 in/in°C
x 10-6 in/in°C

0.22
0.39
0.87
< 350508,298
329 ppm
409 ppm
N/A%%%°C (Intermittent)psi* Particle Size:
ELECTRICAL AND THERMAL PROPERTIES:
Thermal Conductivity:
N/A
Volume Resistivity @ 23°C:≥ 1.8 x 1013
Dielectric Constant (1KHz):
3.17
Dissipation Factor (1KHz):
0.005
OPTICAL PROPERTIES @ 23°C:
Spectral Transmission:≥ 50% @ 550≥ 95% @ 1100-1600≥ 98% @ 800-1000
Refractive Index (uncured):
1.5694 @589

psiKg
°C

5,334 psi

K+:

5 ppm

Ohm-cm

nm
nm
nm
nm

Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com

EPO-TEK® 353ND
Technical Data Sheet
For Reference OnlyHigh Temperature Epoxy

EPO-TEK® 353ND Advantages & Suggested Application Notes:● Reasonable pot-life that allows for low temperature curing to be realized. It has an ambercolor change upon cure.
● Passes NASA low outgassing standard ASTM E595 with proper cure http://outgassing.nasa.gov/● Semiconductor suggested applications: wafer-wafer bonding of CSP; fabrication of MEMs
devices; flip chip underfill.
● Hybrid suggested applications: providing near hermetic seals and UHV seals in sensor
devices, resisting high temperature packaging.
o Down-Hole petrochemical fiber optic sensors, resisting >200°C field conditions.
● Fiber optic adhesive designed to meet Telecordia 1221 - suggested applications:o Sealing fiber into ferrules, transmitting light in the optical pathway from 800- 1550
nm range.
o Fiber component packaging; adhesive for active alignment of optics, environmental
seal of opto-package, V-groove arrays.
● Electronics Assembly suggested applications:o Used as dielectric layer in the fabrication of capacitors; laminating PZTferroelectrics found in ultrasound or ink-jetting devices.
o Impregnating and insulating copper coil windings in motors and inductor
coils. Bonding ferrite cores and magnets.
o Structural grade epoxy found in hard-disk drive devices; bonding of SST metals,
kapton, and magnets.

Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com