Broadband
Internet

Ｍｕｌｔｉｌａｙｅｒ Ｃｏｍｐｏｎｅｎｔｓ
FDK supplies ‘Multi-layer Chip Inductor (AML Series)’ and ‘RF Component (AMB / A MS /ALP / ABP Ser ies)’ for high frequency circuit and high frequency module based on theoriginal material technology, simulation technology and high frequency circuit technology.
The ideal chip for compact designs such as 3rd or 4th generation cellular phone, RF moduleof mobile devices is supplied.
Basic Technologies
1. Material
2. Fine patterning/ laminating
3. CAE by super computer
4. High frequency circuit

Main ProductsInductor(1005,0603)
Multilayer BPF

All items ar e lead-free

RF-components
Balun(2015,1608)
Coupler(2012,1608)
LPF(1005),BPF(2012)

Lineup of Chip Inductor (AML series)
Ty pe

Size

Q range(mm)(1GHz)

L range (nH)110100

AML1005H

19 – 35

AML1005S>25

120-220<40

1-18

1.0×0.5

AML1005Q
AML0603Q

0.6×0.3

1000

1-100

17 – 21

1-22(-56)

Wide Induc tance and High Q of 1005 and 0603 typeLineup of RFRF -Components
Size
Ty pe(mm)

AMB20122.0×1.25

AMB1608

1.6×0.8

AMS20122.0×1.25

AMS1608

1.6×0.8

Low Pass Filter

ALP10051.0×0.5

Band Pass Filter

ABP2520

2.5×2.0Balun

CouplerFrequency (GHz)
12345

Under de velopment

Under de velopment

Under de velopment

The descriptions in this catalogue are subject to change without notice.

Copyright (c) 2002 FDK CORPORATION All Right Reserved

http://www.fdk.co.jp

Broadband
Internet

Ｍｕｌｔｉｌａｙｅｒ Ｃｏｍｐｏｎｅｎｔｓ
FDK supplies ‘Multi-layer Chip Inductor (AML Series)’ and ‘RF Component(AMB / AMS / ALP / ABP Series)’ for high frequency circuit and highfrequency module based on the or iginal material technology, simulation
technology and high frequency circuit technology. The ideal chip forcompact designs such as 3rd or 4th generation cellular phone, RF module ofmobile devices is supplied.

All items ar e lead-free

Multi-layer Chip Bulun
Item

Characteristics(ty p.)

Dimensions

2.0x1.25x0.95mm

Center Frequency (f o)

2450.0MHz

Frequency Range

f o ± 50MHz

Insertion Loss

0.5dB

NC
GND

IN

OUT2
OUT1

(at fo ± 50MHz)

Unbalance Impedance

50ohm(nominal)

Balance Impedance

100ohm(nominal)

Multi-layer Chip Coupler
Item
Dimensions

IN

Characteristics(ty p.)
2.0x1.25x0.95mm

GND

OUT

OUTTermi nat e

Center Frequency(f o)

2450.0MHz

Frequency Range

f o ± 50MHz

Insertion Loss

0.3dB max (at fo ± 50MHz)

Coupling14dB

Directiv ity

20dB

Multi-layer Chip Lo w-pass Filter
Item

Characteristics(ty p.)

Dimensions

2.5x2.0x t<1.0mm

Center Frequency (f o)

2450.0MHz (nominal)

Bandwidth (BW)f o ± 50MHz

Characteristic Impedance

50ohm

Insertion Loss in BW

GND
IN

OUT(nominal)

0.8dB

The descriptions in this catalogue are subject to change without notice.

Copyright (c) 2002 FDK CORPORATION All Right Reserved

http://www.fdk.co.jpBroadband
Internet
Multilayer Chip Low Pass FilterelPryarin
im

The World’s Smallest and Highest Quality LPF
FDK supplies ‘Multi-layer Chip Inductor (AML Series)’ and ‘RF Component(AMB / AMS / ALP / ABP Series)’ for high frequency circuit and highfrequency module based on the or iginal material technology, simulation
technology and high frequency circuit technology. The ideal chip forcompact designs such as 3rd or 4th generation cellular phone, RF module ofmobile devices is supplied.
Item

Specif ication(Example)

Dimensions

1.0x0.5x0.5mm

Center Frequency(f o)

2450.0MHz

Frequency Range

f o ± 50MHz

Insertion Loss

0.5dB max

ATT. 2F

20 dB

ATT. 3F15 dB

All items ar e lead-free
GNDIN

1. Shape & Dimension

OUT

0.5±0.1GND

1.0 ± 0.1

0.5±0.1

2. Characteristics

FO
[MHz]

BW
[MHz]

IL
VSWR
[dB Typ] [Typ]

GSM

897.5

Fo±17.50.4

DCS

1745.0 Fo±35.0

W-CDMA
Bluetooth

ATT(dB)[2×Fo][3×Fo]

1.5

20150.5

1.52015

1950.0 Fo±30.00.4

1.520152450.0 Fo±50.00.4

1.52015The descriptions in this catalogue are subject to change without notice.

Copyright (c) 2002 FDK CORPORATION All Right Reserved

http://www.fdk.co.jp