EPO-TEK® 301-2FL
Technical Data Sheet
For Reference Only
Low Stress, Optical Epoxy

Date:
Rev:
No. of Components:
Mix Ratio by Weight:
Specific Gravity:
Pot Life:
Shelf Life- Bulk:
Shelf Life- Syringe:
NOTES:

Recommended Cure: 80°C / 3 Hours

July 2019
VIITwo100 : 35
Part A: 1.06
Part B: 0.89
10 Hours
One year at room temperature
Six months at -40°C

Minimum Alternative Cure(s):May not achieve performance properties listed below
23°C / 3 Days

● Container(s) should be kept closed when not in use.
● Filled systems should be stirred thoroughly before mixing and prior to use.
● Performance properties (rheology, conductivity, others) of the product may vary from those stated on the data sheet when bi-pak/syringe packaging or
post-processing of any kind is performed. Epoxy’s warranties shall not apply to any products that have been reprocessed or repackaged from Epoxy’s
delivered status/container into any other containers of any kind, including but not limited to syringes, bi-paks, cartridges, pouches, tubes, capsules, films
or other packages.
● If product crystalizes in storage, place container in warm oven until crystallization disappears. Please refer to Tech Tip #7 on website.

Product Description: EPO-TEK® 301-2FL is a two component optical and semiconductor grade epoxy resin. It is a more flexible
version of EPO-TEK® 301-2.
Typical Properties: Cure condition: 80°C / 3 Hours
Different batches, conditions & applications yield differing results.
Data below is not guaranteed. To be used as a guide only, not as a specification. * denotes test on lot acceptance basis
PHYSICAL PROPERTIES:* Color (before cure):* Consistency:* Viscosity (23°C) @ 100 rpm:
Thixotropic Index:* Glass Transition Temp:
Coefficient of Thermal Expansion (CTE):
Below Tg:
Above Tg:
Shore D Hardness:
Lap Shear @ 23°C:
Die Shear @ 23°C:
Degradation Temp:
Weight Loss:@ 200°C:@ 250°C:@ 300°C:
Suggested Operating Temperature:
Storage Modulus:
Ion Content:

Part A: Clear/Colorless
Part B: Clear/Colorless
Pourable liquid
100 - 200 cPs
N/A≥ 45 °C (Dynamic Cure: 20-200°C/ISO 25 Min; Ramp -10-200°C @20°C/Min)

Cl-:
NH4+:

Particle Size:
ELECTRICAL AND THERMAL PROPERTIES:
Thermal Conductivity:
Volume Resistivity @ 23°C:
Dielectric Constant (1KHz):
Dissipation Factor (1KHz):
OPTICAL PROPERTIES @ 23°C:
Spectral Transmission:
Refractive Index:

56
211
70> 2,000≥ 10325x 10-6 in/in°C
x 10-6 in/in°C

0.50
0.96
3.52
< 250
318,685
105 ppm
8 ppm
N/A

%
%%°C (Intermittent)psiNa+:
58 ppmK+:
19 ppm

N/A≥ 0.6 x 1012
3.540.013≥ 97% @ 1,000-1,600≥ 99% @ 400-1,000
1.5102 @ 589

psiKg
°C

3,556 psi

Ohm-cmnm
nm
nm

Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com

EPO-TEK® 301-2FL
Technical Data Sheet
For Reference Only
Low Stress, Optical Epoxy

EPO-TEK®301-2FL Advantages & Suggested Application Notes:● Suggested for LCD optical lamination and sealing of glass plates. The product can resist
yellowing over 17 days of continuous UV light exposure. Suitable for LED encapsulation.
● Ease of use: potting and casting, encapsulation, and adhesive.
● Semiconductor applications: underfill for flip chips, glob top encapsulation over wirebonds, spin coating at wafer level.
● Compliant adhesive that will be resistant to impact or vibrations. Low stress adhesive forbonding optics inside OEM / scientific instruments.
● Fiber optic adhesive; bundling fibers, terminating fiber into ferrule, adhesive for mounting
optics inside fiber components, bonding glass cover slip over V-groove; spectral
transmission of visible and IR light.
● Adhesion to glass, quartz, metals, wood and most plastics is very good.
● May also be used for impregnating wooden or porous objects for artifact restoration.
● Capable of both heat cure and room temperature cure.

Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com