Extremely Accurate I2C-Integrated
RTC/TCXO/Crystal

DS3231

General Description

The DS3231 is a low-cost, extremely accurate I2C

real-time clock (RTC) with an integrated temperaturecompensated crystal oscillator (TCXO) and crystal.
The device incorporates a battery input, and maintains
accurate timekeeping when main power to the device
is interrupted. The integration of the crystal resonator
enhances the long-term accuracy of the device as well
as reduces the piece-part count in a manufacturing line.
The DS3231 is available in commercial and industrial
temperature ranges, and is offered in a 16-pin, 300-mil
SO package.
The RTC maintains seconds, minutes, hours, day, date,month, and year information. The date at the end of themonth is automatically adjusted for months with fewer
than 31 days, including corrections for leap year. The
clock operates in either the 24-hour or 12-hour format
with an AM/PM indicator. Two programmable time-of-day
alarms and a programmable square-wave output areprovided. Address and data are transferred seriallythrough an I2C bidirectional bus.
A precision temperature-compensated voltage reference
and comparator circuit monitors the status of VCC todetect power failures, to provide a reset output, and toautomatically switch to the backup supply when necessary.
Additionally, the RST pin is monitored as a pushbutton
input for generating a μP reset.

●● Underwriters Laboratories® (UL) Recognized

Applications●● Servers●● Telematics

RPU

VCC

SCL

SCL

INT/SQW

SDA

SDA

32kHz

RST

RST
PUSHBUTTON
RESET

N.C.

Underwriters Laboratories is a registered certification mark of
Underwriters Laboratories Inc.

DS3231

VBAT
N.C.
N.C.
N.C.

N.C.
N.C.
N.C.

19-5170; Rev 10; 3/15●● Operating Temperature Ranges: Commercial(0°C to +70°C) and Industrial (-40°C to +85°C)

VCC

VCC

RPU = tR/CB
RPU

P●● Highly Accurate RTC Completely Manages All
Timekeeping Functions• Real-Time Clock Counts Seconds, Minutes, Hours,
Date of the Month, Month, Day of the Week, andYear, with Leap-Year Compensation Valid Up to 2100
• Accuracy ±2ppm from 0°C to +40°C• Accuracy ±3.5ppm from -40°C to +85°C• Digital Temp Sensor Output: ±3°C Accuracy• Register for Aging Trim
• RST Output/Pushbutton Reset Debounce Input• Two Time-of-Day Alarms• Programmable Square-Wave Output Signal●● Simple Serial Interface Connects to Most
Microcontrollers• Fast (400kHz) I2C Interface●● Battery-Backup Input for Continuous Timekeeping• Low Power Operation Extends Battery-Backup
Run Time• 3.3V Operation●● Utility Power Meters●● GPS

Ordering Information and Pin Configuration appear at end of data
sheet.

Typical Operating Circuit
VCC

Benefits and Features

GND

N.C.

Extremely Accurate I2C-Integrated
RTC/TCXO/Crystal

DS3231

Absolute Maximum Ratings
Voltage Range on Any Pin Relative to Ground.....-0.3V to +6.0V
Junction-to-Ambient Thermal Resistance (θJA) (Note 1).73°C/W
Junction-to-Case Thermal Resistance (θJC) (Note 1).....23°C/W
Operating Temperature Range
DS3231S.............................................................0°C to +70°C
DS3231SN....................................................... -40°C to +85°C

Junction Temperature.......................................................+125°C
Storage Temperature Range............................... -40°C to +85°C
Lead Temperature (soldering, 10s).................................. +260°C
Soldering Temperature (reflow, 2 times max).................. +260°C(see the Handling, PCB Layout, and Assembly section)

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at theseor any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affectdevice reliability.

Recommended Operating Conditions(TA = TMIN to TMAX, unless otherwise noted.) (Notes 2, 3)
PARAMETERSYMBOL

MIN

TYP

MAX

UNITS

VCC

2.3

3.3

5.5

V

VBAT

2.3

3.0

5.5

V

Logic 1 Input SDA, SCL

VIH

0.7 x
VCC

VCC +
0.3

V

Logic 0 Input SDA, SCL

VIL

-0.3

0.3 x
VCC

V

Supply Voltage

CONDITIONSElectrical Characteristics(VCC = 2.3V to 5.5V, VCC = Active Supply (see Table 1), TA = TMIN to TMAX, unless otherwise noted.) (Typical values are at VCC =3.3V, VBAT = 3.0V, and TA = +25°C, unless otherwise noted.) (Notes 2, 3)
PARAMETERSYMBOL

CONDITIONS

MIN

TYP

MAX

VCC = 3.63V

200

Active Supply Current

ICCA(Notes 4, 5)

VCC = 5.5V

300

Standby Supply Current

ICCS

I2C bus inactive, 32kHz
VCC = 3.63V
output on, SQW output off
VCC = 5.5V
(Note 5)110

ICCSCONVVCC = 3.63V
I2C bus inactive, 32kHz
output on, SQW output off VCC = 5.5V

Temperature Conversion Current
Power-Fail Voltage

VPF

Logic 0 Output, 32kHz, INT/SQW,
SDA

VOL

Logic 0 Output, RST
Output Leakage Current 32kHz,
INT/SQW, SDA
Input Leakage SCL

575
650

µA

IOL = 3mA

0.4

V

VOL

IOL = 1mA

0.4

V

ILO

Output high impedance

-1

+1

µA

-1

+1

µA

RST high impedance (Note 6)

-200

+10

µA

100

nA

ILI

VBAT Leakage Current(VCC Active)

IBATLKG

2.575

µA

V

IOL

2.45

µA

2.70

RST Pin I/O Leakage

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170

UNITS

0

25

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DS3231

Electrical Characteristics (continued)(VCC = 2.3V to 5.5V, VCC = Active Supply (see Table 1), TA = TMIN to TMAX, unless otherwise noted.) (Typical values are at VCC =3.3V, VBAT = 3.0V, and TA = +25°C, unless otherwise noted.) (Notes 2, 3)
PARAMETERSYMBOL

CONDITIONS

MIN

TYP

MAX

Output Frequency

fOUT

VCC = 3.3V or VBAT = 3.3V

Frequency Stability vs.
Temperature (Commercial)

Δf/fOUTVCC = 3.3V or
VBAT = 3.3V,
aging offset = 00h

0°C to +40°C±2>40°C to +70°C±3.5

Frequency Stability vs.
Temperature (Industrial)

VCC = 3.3V or
VBAT = 3.3V,
aging offset = 00h-40°C to <0°C

±3.5

Δf/fOUT

Frequency Stability vs. Voltage
Trim Register Frequency
Sensitivity per LSB
Temperature Accuracy

32.768Δf/LSB±2>40°C to +85°C±3.5
1Specified at:

Temp

VCC = 3.3V or VBAT = 3.3V

Δf/fO

After reflow,
not production tested

Crystal Aging

kHz

0°C to +40°C

Δf/V
-40°C

0.7

+25°C

0.1

+70°C

0.4

+85°C

0.8
-3
±1.0

0–10 years

±5.0

ppm

ppm
ppm/V
ppm

+3

First year

UNITS

°C
ppm

Electrical Characteristics(VCC = 0V, VBAT = 2.3V to 5.5V, TA = TMIN to TMAX, unless otherwise noted.) (Note 2)
PARAMETERSYMBOL

CONDITIONS

MIN

IBATA

EOSC = 0, BBSQW = 0,
SCL = 400kHz (Note 5)

IBATT

EOSC = 0, BBSQW = 0,
VBAT = 3.63V
EN32kHz = 1,
SCL = SDA = 0V or
SCL = SDA = VBAT (Note 5) VBAT = 5.5V

Temperature Conversion Current

IBATTCEOSC = 0, BBSQW = 0,
SCL = SDA = 0V or
SCL = SDA = VBAT

Data-Retention Current

IBATTDR

EOSC = 1, SCL = SDA = 0V, +25°C

Active Battery Current

Timekeeping Battery Current

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TYP

VBAT = 3.63V

MAX
70

VBAT = 5.5V

150
0.84

3.0

1.0

3.5

UNITS
µA

µA

VBAT = 3.63V

575

VBAT = 5.5V

650
100

µA
nA

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DS3231AC Electrical Characteristics(VCC = VCC(MIN) to VCC(MAX) or VBAT = VBAT(MIN) to VBAT(MAX), VBAT > VCC, TA = TMIN to TMAX, unless otherwise noted.) (Note 2)
PARAMETERSYMBOLSCL Clock Frequency

fSCL

Bus Free Time Between STOP
and START Conditions

tBUF

Hold Time (Repeated) START
Condition (Note 7)

tHD:STA

Low Period of SCL ClocktLOWHigh Period of SCL ClocktHIGH

Data Hold Time (Notes 8, 9)

tHD:DAT

Data Setup Time (Note 10)

tSU:DATSTART Setup TimetSU:STA

CONDITIONS

MIN

TYP

MAX

Fast mode

100

400

Standard mode

0100

Fast mode

1.3

Standard mode

4.7

Fast mode

0.6

Standard mode

4.0

Fast mode

1.3

Standard mode

4.7

Fast mode

0.6

Standard mode

4.0

Fast mode0

0.9Standard mode

0

0.9

Fast mode

100

Standard mode

250

Fast mode

0.6

Standard mode

4.7

Fast mode

20 +
0.1CB

UNITS
kHz
µs
µs
µs
µs
µs
ns
µs

300

Rise Time of Both SDA and SCL
Signals (Note 11)tR

Fall Time of Both SDA and SCL
Signals (Note 11)

tF

Setup Time for STOP ConditiontSU:STO

Capacitive Load for Each Bus
Line

CB

Capacitance for SDA, SCL

CI/O

10

pF

Pulse Width of Spikes That Must
Be Suppressed by the Input Filter

tSP

30

ns

Pushbutton Debounce

PBDB

250

ms

250

ms

Reset Active Time
Oscillator Stop Flag (OSF) Delay
Temperature Conversion Time

tRST

tOSF

Standard mode
Fast mode
Fast mode

20 +
0.1CB
0.6

Standard mode

4.7

Standard mode

1000
300
300

400

(Note 12)nsµs

(Note 11)

100

tCONV

ns

pF

ms

125

200

ms

TYP

MAX

UNITS

Power-Switch Characteristics(TA = TMIN to TMAX)PARAMETERSYMBOL

CONDITIONSMINVCC Fall Time; VPF(MAX) to
VPF(MIN)

tVCCF

300

µs

VCC Rise Time; VPF(MIN) to
VPF(MAX)

tVCCR

0

µs

Recovery at Power-Up

tREC

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250

300

ms

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DS3231

Pushbutton Reset Timing
RST

PBDB

tRST

Power-Switch Timing

VCC
VPF(MAX)
VPF

VPF(MIN)

tVCCF

VPF

tVCCR

tREC
RST

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DS3231

Data Transfer on I2C Serial Bus

SDA
tBUF
tLOW

tR

tHD:STA

tF

tSP

SCL
tHD:STASTOP

tSU:STAtHIGHtSU:DATSTARTtHD:DATREPEATEDSTART

tSU:STOWARNING: Negative undershoots below -0.3V while the part is in battery-backed mode may cause loss of data.
Note 2: Limits at -40°C are guaranteed by design and not production tested.
Note 3: All voltages are referenced to ground.
Note 4: ICCA—SCL clocking at max frequency = 400kHz.
Note 5: Current is the averaged input current, which includes the temperature conversion current.
Note 6: The RST pin has an internal 50kΩ (nominal) pullup resistor to VCC.
Note 7: After this period, the first clock pulse is generated.
Note 8: A device must internally provide a hold time of at least 300ns for the SDA signal (referred to the VIH(MIN) of the SCL signal) to bridge the undefined region of the falling edge of SCL.
Note 9: The maximum tHD:DAT needs only to be met if the device does not stretch the low period (tLOW) of the SCL signal.
Note 10: A fast-mode device can be used in a standard-mode system, but the requirement tSU:DAT ≥ 250ns must then be met. Thisis automatically the case if the device does not stretch the low period of the SCL signal. If such a device does stretch the
low period of the SCL signal, it must output the next data bit to the SDA line tR(MAX) + tSU:DAT = 1000 + 250 = 1250ns
before the SCL line is released.
Note 11: CB—total capacitance of one bus line in pF.
Note 12: The parameter tOSF is the period of time the oscillator must be stopped for the OSF flag to be set over the voltage rangeof 0.0V ≤ VCC ≤ VCC(MAX) and 2.3V ≤ VBAT ≤ 3.4V.
Note 13: This delay applies only if the oscillator is enabled and running. If the EOSC bit is a 1, tREC is bypassed and RST immediately goes high. The state of RST does not affect the I2C interface, RTC, or TCXO.

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DS3231

Typical Operating Characteristics(VCC = +3.3V, TA = +25°C, unless otherwise noted.)

125

RST ACTIVE

1.0
IBAT (µA)

0.8

25

0.7

3.0

3.5

4.0

4.5

5.0

0.6

5.5

3.3

2.3

SUPPLY CURRENT
vs. TEMPERATUREFREQUENCY DEVIATION
vs. TEMPERATURE vs. AGING VALUEVCC = 0, EN32kHz = 1, BSY = 0,
SDA = SCL = VBAT OR GND

60

0.7

50

-128

40

-33

30
20

0

10
0
-10
-20

-15

10

35

60

-40

85

-15

-40

10

35

60

85

TEMPERATURE (°C)

TEMPERATURE (°C)

DELTA TIME AND FREQUENCY
vs. TEMPERATURE

DS3231 toc05

0

0-20 CRYSTAL+20ppm
-40
-60
-80
-100
-120
-140

TYPICAL CRYSTAL,
UNCOMPENSATEDCRYSTAL-20ppmDS3231
ACCURACY
BAND

-20
-40
-60

DELTA TIME (MIN/YEAR)

20

DELTA FREQUENCY (ppm)

32

127

-30

-40

5.3

VBAT (V)

0.8

0.6

4.3

VCC (V)

0.9
IBAT (µA)

EN32kHz = 0

DS3231 toc04

1.0

2.5

FREQUENCY DEVIATION (ppm)

2.0

EN32kHz = 1

0.9

50

DS3231 toc03

ICCS (µA)

75

0

VCC = 0V, BSY = 0,
SDA = SCL = VBAT OR VCC

1.1

100

DS3231 toc02

BSY = 0, SCL = SDA = VCC

SUPPLY CURRENT
vs. SUPPLY VOLTAGE

1.2

DS3231 toc01

150

STANDBY SUPPLY CURRENT
vs. SUPPLY VOLTAGE

-80

-160
-180
-200

-40 -30 -20 -10 0 10 20 30 40 50 60 70 80-100

TEMPERATURE (°C)

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DS3231

Block Diagram

X1

32kHz

OSCILLATOR AND
CAPACITOR ARRAYN
CONTROL LOGIC/DIVIDER

X2

VCC
VBAT
GND

SQUARE-WAVE BUFFER;
INT/SQW CONTROL
1Hz

N

ALARM, STATUS, AND
CONTROL REGISTERSTEMPERATURESENSOR

POWER CONTROL

1Hz
SCL

SDA

I2C INTERFACE AND
ADDRESS REGISTERDECODE

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CLOCK AND CALENDARREGISTERSUSER BUFFER(7 BYTES)

DS3231

INT/SQWVOLTAGE REFERENCE;
DEBOUNCE CIRCUIT;PUSHBUTTON RESET

VCC

RST
N

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DS3231

Pin Description
PIN

NAME

FUNCTION

1

32kHz

32kHz Output. This open-drain pin requires an external pullup resistor. When enabled, the output operates oneither power supply. It may be left open if not used.

2

VCC

DC Power Pin for Primary Power Supply. This pin should be decoupled using a 0.1µF to 1.0µF capacitor.
If not used, connect to ground.

3

Active-Low Interrupt or Square-Wave Output. This open-drain pin requires an external pullup resistor connected
to a supply at 5.5V or less. This multifunction pin is determined by the state of the INTCN bit in the Control
Register (0Eh). When INTCN is set to logic 0, this pin outputs a square wave and its frequency is determined by
INT/SQW RS2 and RS1 bits. When INTCN is set to logic 1, then a match between the timekeeping registers and either of
the alarm registers activates the INT/SQW pin (if the alarm is enabled). Because the INTCN bit is set to logic 1
when power is first applied, the pin defaults to an interrupt output with alarms disabled. The pullup voltage canbe up to 5.5V, regardless of the voltage on VCC. If not used, this pin can be left unconnected.

4

RST

Active-Low Reset. This pin is an open-drain input/output. It indicates the status of VCC relative to the
VPF specification. As VCC falls below VPF, the RST pin is driven low. When VCC exceeds VPF, for tRST, theRST pin is pulled high by the internal pullup resistor. The active-low, open-drain output is combined with adebounced pushbutton input function. This pin can be activated by a pushbutton reset request. It has an internal
50kΩ nominal value pullup resistor to VCC. No external pullup resistors should be connected. If the oscillator isdisabled, tREC is bypassed and RST immediately goes high.

5–12

N.C.

No Connection. Must be connected to ground.

13

GND

Ground14

VBAT

Backup Power-Supply Input. When using the device with the VBAT input as the primary power source, this pinshould be decoupled using a 0.1µF to 1.0µF low-leakage capacitor. When using the device with the VBAT input
as the backup power source, the capacitor is not required. If VBAT is not used, connect to ground. The device is
UL recognized to ensure against reverse charging when used with a primary lithium battery.
Go to www.maximintegrated.com/qa/info/ul.

15

SDA

Serial Data Input/Output. This pin is the data input/output for the I2C serial interface. This open-drain pin
requires an external pullup resistor. The pullup voltage can be up to 5.5V, regardless of the voltage on VCC.

16

SCL

Serial Clock Input. This pin is the clock input for the I2C serial interface and is used to synchronize data
movement on the serial interface. Up to 5.5V can be used for this pin, regardless of the voltage on VCC.

Detailed Description

The DS3231 is a serial RTC driven by a temperaturecompensated 32kHz crystal oscillator. The TCXO provides
a stable and accurate reference clock, and maintains the
RTC to within ±2 minutes per year accuracy from -40°C
to +85°C. The TCXO frequency output is available at the
32kHz pin. The RTC is a low-power clock/calendar withtwo programmable time-of-day alarms and a programmable square-wave output. The INT/SQW provides either aninterrupt signal due to alarm conditions or a square-wave
output. The clock/calendar provides seconds, minutes,
hours, day, date, month, and year information. The date at
the end of the month is automatically adjusted for months
with fewer than 31 days, including corrections for leap

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year. The clock operates in either the 24-hour or 12-hourformat with an AM/PM indicator. The internal registers areaccessible though an I2C bus interface.
A temperature-compensated voltage reference and comparator circuit monitors the level of VCC to detect power failures and to automatically switch to the backup supply whennecessary. The RST pin provides an external pushbutton
function and acts as an indicator of a power-fail event.

Operation

The block diagram shows the main elements of theDS3231. The eight blocks can be grouped into four functional groups: TCXO, power control, pushbutton function,
and RTC. Their operations are described separately in thefollowing sections.

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DS323132kHz TCXO

The temperature sensor, oscillator, and control logic form
the TCXO. The controller reads the output of the on-chiptemperature sensor and uses a lookup table to determine
the capacitance required, adds the aging correction in
AGE register, and then sets the capacitance selection registers. New values, including changes to the AGE register,
are loaded only when a change in the temperature value
occurs, or when a user-initiated temperature conversion
is completed. Temperature conversion occurs on initial
application of VCC and once every 64 seconds afterwards.

Power Control

This function is provided by a temperature-compensatedvoltage reference and a comparator circuit that monitors
the VCC level. When VCC is greater than VPF, the part is
powered by VCC. When VCC is less than VPF but greaterthan VBAT, the DS3231 is powered by VCC. If VCC is lessthan VPF and is less than VBAT, the device is powered by
VBAT. See Table 1.

Table 1. Power Control
SUPPLY CONDITIONACTIVE SUPPLY

VCC < VPF, VCC < VBATVBAT

VCC < VPF, VCC > VBAT

VCC

VCC > VPF, VCC < VBAT

VCC

VCC > VPF, VCC > VBAT

VCC

To preserve the battery, the first time VBAT is applied
to the device, the oscillator will not start up until VCC
exceeds VPF, or until a valid I2C address is written to
the part. Typical oscillator startup time is less than one
second. Approximately 2 seconds after VCC is applied,or a valid I2C address is written, the device makes atemperature measurement and applies the calculated
correction to the oscillator. Once the oscillator is running,
it continues to run as long as a valid power source is available (VCC or VBAT), and the device continues to measure
the temperature and correct the oscillator frequency every
64 seconds.
On the first application of power (VCC) or when a valid I2C
address is written to the part (VBAT), the time and dateregisters are reset to 01/01/00 01 00:00:00 (DD/MM/YY
DOW HH:MM:SS).

VBAT Operation

There are several modes of operation that affect theamount of VBAT current that is drawn. While the device

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is powered by VBAT and the serial interface is active,
active battery current, IBATA, is drawn. When the serial interface is inactive, timekeeping current (IBATT),
which includes the averaged temperature conversion
current, IBATTC, is used (refer to Application Note 3644:
Power Considerations for Accurate Real-Time Clocks
for details). Temperature conversion current, IBATTC, is
specified since the system must be able to support theperiodic higher current pulse and still maintain a valid voltage level. Data retention current, IBATTDR, is the current
drawn by the part when the oscillator is stopped (EOSC= 1). This mode can be used to minimize battery requirements for times when maintaining time and date information is not necessary, e.g., while the end system is waiting
to be shipped to a customer.

Pushbutton Reset Function

The DS3231 provides for a pushbutton switch to be connected to the RST output pin. When the DS3231 is not ina reset cycle, it continuously monitors the RST signal fora low going edge. If an edge transition is detected, theDS3231 debounces the switch by pulling the RST low.
After the internal timer has expired (PBDB), the DS3231
continues to monitor the RST line. If the line is still low,the DS3231 continuously monitors the line looking for arising edge. Upon detecting release, the DS3231 forces
the RST pin low and holds it low for tRST.
RST is also used to indicate a power-fail condition. When
VCC is lower than VPF, an internal power-fail signal isgenerated, which forces the RST pin low. When VCC
returns to a level above VPF, the RST pin is held low for
approximately 250ms (tREC) to allow the power supply
to stabilize. If the oscillator is not running (see the Power
Control section) when VCC is applied, tREC is bypassed
and RST immediately goes high. Assertion of the RST
output, whether by pushbutton or power-fail detection,
does not affect the internal operation of the DS3231.

Real-Time ClockWith the clock source from the TCXO, the RTC provides
seconds, minutes, hours, day, date, month, and year
information. The date at the end of the month is automatically adjusted for months with fewer than 31 days, including corrections for leap year. The clock operates in either
the 24-hour or 12-hour format with an AM/PM indicator.
The clock provides two programmable time-of-day alarms
and a programmable square-wave output. The INT/SQW
pin either generates an interrupt due to alarm conditionor outputs a square-wave signal and the selection is controlled by the bit INTCN.

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DS3231ADDRESS

BIT 7
MSB

00h

0

10 Seconds

01h

0

10 Minutes

02h

0

12/24

03h

0

0

04h

0

0

05h

Century

0

BIT 6

06h

BIT 5

AM/PM
20 Hour

BIT 4

BIT 3

BIT 2

0

0

RANGE

Seconds

Seconds

00–59

Minutes

Minutes

00–59

Hour

Hours

1–12 + AM/PM
00–23

0

Day

1–7

Date

Day

Date

01–31

Month

Month/
Century

01–12 + Century

10 Date0

10 Month

BIT 0
LSB

FUNCTION

10 Hour

BIT 1

Year

Year

00–99

07h

A1M1

10 Year
10 Seconds

Seconds

Alarm 1 Seconds

00–59

08h

A1M2

10 Minutes

Minutes

Alarm 1 Minutes

00–59

Hour

Alarm 1 Hours

1–12 + AM/PM
00–23

Day

Alarm 1 Day

1–7

AM/PM

09h

A1M3

12/24

0Ah

A1M4

DY/DT

0Bh

A2M2

0Ch

A2M3

12/24

0Dh

A2M4

DY/DT

0Eh

EOSC

BBSQW

CONV

RS2

RS1

INTCN

A2IE

A1IE

0Fh

OSF

0

0

0

EN32kHz

BSY

A2F

10h

SIGN

DATA

DATA

DATA

DATA

DATA

11h

SIGN

DATA

DATA

DATA

DATA

12h

DATA

DATA

0

0

0

20 Hour

10 Hour

10 Date10 Minutes
AM/PM
20 Hour

Date

Alarm 1 Date

1–31

Minutes

Alarm 2 Minutes

00–59

Hour

Alarm 2 Hours

1–12 + AM/PM
00–23

Day

Alarm 2 Day

1–7

Alarm 2 Date

1–31

Control—

A1F

Control/Status

—

DATA

DATA

Aging Offset

—

DATA

DATA

DATA

MSB of Temp

—

0

0

0

LSB of Temp—

10 Hour

10 Date

Date

Figure 1. Timekeeping Registers
Note: Unless otherwise specified, the registers’ state is not defined when power is first applied.

Address Map

Figure 1 shows the address map for the DS3231 timekeeping registers. During a multibyte access, when theaddress pointer reaches the end of the register space(12h), it wraps around to location 00h. On an I2C STARTor address pointer incrementing to location 00h, the current time is transferred to a second set of registers. The
time information is read from these secondary registers,
while the clock may continue to run. This eliminates theneed to reread the registers in case the main registers
update during a read.

I2C Interface

The I2C interface is accessible whenever either VCC or
VBAT is at a valid level. If a microcontroller connected

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to the DS3231 resets because of a loss of VCC or otherevent, it is possible that the microcontroller and DS3231
I2C communications could become unsynchronized, e.g.,
the microcontroller resets while reading data from theDS3231. When the microcontroller resets, the DS3231
I2C interface may be placed into a known state by toggling SCL until SDA is observed to be at a high level. At
that point the microcontroller should pull SDA low while
SCL is high, generating a START condition.

Clock and Calendar

The time and calendar information is obtained by reading
the appropriate register bytes. Figure 1 illustrates the RTC
registers. The time and calendar data are set or initialized
by writing the appropriate register bytes. The contents ofthe time and calendar registers are in the binary-coded

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DS3231

Alarmsdecimal (BCD) format. The DS3231 can be run in either
12-hour or 24-hour mode. Bit 6 of the hours register isdefined as the 12- or 24-hour mode select bit. When high,the 12-hour mode is selected. In the 12-hour mode, bit 5is the AM/PM bit with logic-high being PM. In the 24-hour
mode, bit 5 is the 20-hour bit (20–23 hours). The century
bit (bit 7 of the month register) is toggled when the years
register overflows from 99 to 00.

The DS3231 contains two time-of-day/date alarms.
Alarm 1 can be set by writing to registers 07h to 0Ah.
Alarm 2 can be set by writing to registers 0Bh to 0Dh.
The alarms can be programmed (by the alarm enable
and INTCN bits of the control register) to activate the
INT/SQW output on an alarm match condition. Bit 7 ofeach of the time-of-day/date alarm registers are mask
bits (Table 2). When all the mask bits for each alarm
are logic 0, an alarm only occurs when the values inthe timekeeping registers match the corresponding values stored in the time-of-day/date alarm registers. The
alarms can also be programmed to repeat every second,
minute, hour, day, or date. Table 2 shows the possible
settings. Configurations not listed in the table will resultin illogical operation.

The day-of-week register increments at midnight. Values
that correspond to the day of week are user-defined but
must be sequential (i.e., if 1 equals Sunday, then 2 equals
Monday, and so on). Illogical time and date entries resultin undefined operation.
When reading or writing the time and date registers, secondary (user) buffers are used to prevent errors when theinternal registers update. When reading the time and dateregisters, the user buffers are synchronized to the internalregisters on any START and when the register pointerrolls over to zero. The time information is read from thesesecondary registers, while the clock continues to run. Thiseliminates the need to reread the registers in case themain registers update during a read.

The DY/DT bits (bit 6 of the alarm day/date registers)
control whether the alarm value stored in bits 0 to 5 ofthat register reflects the day of the week or the date of
the month. If DY/DT is written to logic 0, the alarm will be
the result of a match with date of the month. If DY/DT is
written to logic 1, the alarm will be the result of a matchwith day of the week.

The countdown chain is reset whenever the seconds
register is written. Write transfers occur on the acknowledge from the DS3231. Once the countdown chain isreset, to avoid rollover issues the remaining time anddate registers must be written within 1 second. The 1Hz
square-wave output, if enabled, transitions high 500ms
after the seconds data transfer, provided the oscillator isalready running.

When the RTC register values match alarm register settings, the corresponding Alarm Flag ‘A1F’ or ‘A2F’ bit is
set to logic 1. If the corresponding Alarm Interrupt Enable‘A1IE’ or ‘A2IE’ is also set to logic 1 and the INTCN bit
is set to logic 1, the alarm condition will activate the
INT/SQW signal. The match is tested on the once-persecond update of the time and date registers.

Table 2. Alarm Mask Bits
DY/DT

ALARM 1 REGISTER MASK BITS (BIT 7)

ALARM RATE

A1M4

A1M3

A1M2

A1M1

X

1

1

1

1

Alarm once per second

X

1

1

1

0

Alarm when seconds match

X

1

1

0

0

Alarm when minutes and seconds match

X

1

0

0

0

Alarm when hours, minutes, and seconds match

0

0

0

0

0

Alarm when date, hours, minutes, and seconds match

1

0

0

0

0

Alarm when day, hours, minutes, and seconds match

DY/DT

ALARM 2 REGISTER MASK BITS (BIT 7)

ALARM RATE

A2M4

A2M3

A2M2

X

1

1

1

Alarm once per minute (00 seconds of every minute)

X

1

1

0

Alarm when minutes match

X

1

0

0

Alarm when hours and minutes match

0

0

0

0

Alarm when date, hours, and minutes match

1

0

0

0

Alarm when day, hours, and minutes match

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DS3231

Control Register (0Eh)
BIT 7

BIT 6

BIT 5

BIT 4

BIT 3

BIT 2

BIT 1

BIT 0

NAME:

EOSC

BBSQW

CONV

RS2

RS1

INTCN

A2IE

A1IE

POR:

0

0

0

1

1

1

0

0

Special-Purpose Registers

The DS3231 has two additional registers (control and status) that control the real-time clock, alarms, and squarewave output.

the square wave has been enabled. The following tableshows the square-wave frequencies that can be selectedwith the RS bits. These bits are both set to logic 1(8.192kHz) when power is first applied.

Control Register (0Eh)

SQUARE-WAVE OUTPUT FREQUENCY

Bit 7: Enable Oscillator (EOSC). When set to logic 0,
the oscillator is started. When set to logic 1, the oscillator
is stopped when the DS3231 switches to VBAT. This bit
is clear (logic 0) when power is first applied. When theDS3231 is powered by VCC, the oscillator is always on
regardless of the status of the EOSC bit. When EOSC isdisabled, all register data is static.
Bit 6: Battery-Backed Square-Wave Enable (BBSQW).
When set to logic 1 with INTCN = 0 and VCC < VPF, thisbit enables the square wave. When BBSQW is logic 0,
the INT/SQW pin goes high impedance when VCC < VPF.
This bit is disabled (logic 0) when power is first applied.
Bit 5: Convert Temperature (CONV). Setting this bit to
1 forces the temperature sensor to convert the temperature into digital code and execute the TCXO algorithm toupdate the capacitance array to the oscillator. This canonly happen when a conversion is not already in progress. The user should check the status bit BSY before
forcing the controller to start a new TCXO execution. A
user-initiated temperature conversion does not affect theinternal 64-second update cycle.
A user-initiated temperature conversion does not affect
the BSY bit for approximately 2ms. The CONV bit remains
at a 1 from the time it is written until the conversion isfinished, at which time both CONV and BSY go to 0. The
CONV bit should be used when monitoring the status of auser-initiated conversion.
Bits 4 and 3: Rate Select (RS2 and RS1). These bits
control the frequency of the square-wave output whenwww.maximintegrated.com

SQUARE-WAVE OUTPUTFREQUENCY

RS2

RS1

0

0

1Hz

0

1

1.024kHz1

0

4.096kHz1

1

8.192kHzBit 2: Interrupt Control (INTCN). This bit controls the
INT/SQW signal. When the INTCN bit is set to logic 0,
a square wave is output on the INT/SQW pin. When the
INTCN bit is set to logic 1, then a match between the timekeeping registers and either of the alarm registers activates the INT/SQW output (if the alarm is also enabled).
The corresponding alarm flag is always set regardless ofthe state of the INTCN bit. The INTCN bit is set to logic 1
when power is first applied.
Bit 1: Alarm 2 Interrupt Enable (A2IE). When set tologic 1, this bit permits the alarm 2 flag (A2F) bit in thestatus register to assert INT/SQW (when INTCN = 1).
When the A2IE bit is set to logic 0 or INTCN is set to logic
0, the A2F bit does not initiate an interrupt signal. The
A2IE bit is disabled (logic 0) when power is first applied.
Bit 0: Alarm 1 Interrupt Enable (A1IE). When set tologic 1, this bit permits the alarm 1 flag (A1F) bit in thestatus register to assert INT/SQW (when INTCN = 1).
When the A1IE bit is set to logic 0 or INTCN is set to logic
0, the A1F bit does not initiate the INT/SQW signal. The
A1IE bit is disabled (logic 0) when power is first applied.

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DS3231

Status Register (0Fh)
BIT 7

BIT 6

BIT 5

BIT 4

BIT 3

BIT 2

BIT 1

BIT 0

NAME:

OSF

0

0

0

EN32kHz

BSY

A2F

A1F

POR:

1

0

0

0

1

X

X

X

Status Register (0Fh)

A1IE bit is logic 1 and the INTCN bit is set to logic 1, the
INT/SQW pin is also asserted. A1F is cleared when written
to logic 0. This bit can only be written to logic 0. Attempting
to write to logic 1 leaves the value unchanged.

Bit 7: Oscillator Stop Flag (OSF). A logic 1 in this bit indicates that the oscillator either is stopped or was stopped
for some period and may be used to judge the validity ofthe timekeeping data. This bit is set to logic 1 any timethat the oscillator stops. The following are examples ofconditions that can cause the OSF bit to be set:

Aging Offset

The aging offset register takes a user-provided value to
add to or subtract from the codes in the capacitance arrayregisters. The code is encoded in two’s complement, withbit 7 representing the sign bit. One LSB represents one
small capacitor to be switched in or out of the capacitancearray at the crystal pins. The aging offset register capacitance value is added or subtracted from the capacitancevalue that the device calculates for each temperaturecompensation. The offset register is added to the capacitance array during a normal temperature conversion, if
the temperature changes from the previous conversion, or
during a manual user conversion (setting the CONV bit).
To see the effects of the aging register on the 32kHz output frequency immediately, a manual conversion should
be started after each aging register change.

1) The first time power is applied.
2) The voltages present on both VCC and VBAT are insufficient to support oscillation.
3) The EOSC bit is turned off in battery-backed mode.
4) External influences on the crystal (i.e., noise, leakage,etc.).
This bit remains at logic 1 until written to logic 0.
Bit 3: Enable 32kHz Output (EN32kHz). This bit controls the status of the 32kHz pin. When set to logic 1, the32kHz pin is enabled and outputs a 32.768kHz squarewave signal. When set to logic 0, the 32kHz pin goes to ahigh-impedance state. The initial power-up state of this bit
is logic 1, and a 32.768kHz square-wave signal appears
at the 32kHz pin after a power source is applied to theDS3231 (if the oscillator is running).

Positive aging values add capacitance to the array, slowing the oscillator frequency. Negative values remove
capacitance from the array, increasing the oscillator
frequency.

Bit 2: Busy (BSY). This bit indicates the device is busy
executing TCXO functions. It goes to logic 1 when the conversion signal to the temperature sensor is asserted andthen is cleared when the device is in the 1-minute idle state.

The change in ppm per LSB is different at different temperatures. The frequency vs. temperature curve is shiftedby the values used in this register. At +25°C, one LSB
typically provides about 0.1ppm change in frequency.

Bit 1: Alarm 2 Flag (A2F). A logic 1 in the alarm 2 flag bit
indicates that the time matched the alarm 2 registers. If theA2IE bit is logic 1 and the INTCN bit is set to logic 1, the
INT/SQW pin is also asserted. A2F is cleared when written
to logic 0. This bit can only be written to logic 0. Attempting
to write to logic 1 leaves the value unchanged.

Use of the aging register is not needed to achieve theaccuracy as defined in the EC tables, but could be used
to help compensate for aging at a given temperature.
See the Typical Operating Characteristics section for agraph showing the effect of the register on accuracy overtemperature.

Bit 0: Alarm 1 Flag (A1F). A logic 1 in the alarm 1 flag bit
indicates that the time matched the alarm 1 registers. If theAging Offset (10h)
BIT 7

BIT 6

BIT 5

BIT 4

BIT 3

BIT 2

BIT 1

BIT 0

NAME:

Sign

Data

Data

Data

Data

Data

Data

Data

POR:

0

0

0

0

0

0

0

0

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DS3231

Temperature Register (Upper Byte) (11h)
BIT 7

BIT 6

BIT 5

BIT 4

BIT 3

BIT 2

BIT 1

BIT 0

NAME:

Sign

Data

Data

Data

Data

Data

Data

Data

POR:

0

0

0

0

0

0

0

0

Temperature Register (Lower Byte) (12h)
BIT 7

BIT 6

BIT 5

BIT 4

BIT 3

BIT 2

BIT 1

BIT 0

NAME:

Data

Data

0

0

0

0

0

0

POR:

0

0

0

0

0

0

0

0

Temperature Registers (11h–12h)

Temperature is represented as a 10-bit code with aresolution of 0.25°C and is accessible at location 11h and
12h. The temperature is encoded in two’s complement
format. The upper 8 bits, the integer portion, are at location 11h and the lower 2 bits, the fractional portion, are in
the upper nibble at location 12h. For example, 00011001
01b = +25.25°C. Upon power reset, the registers are set
to a default temperature of 0°C and the controller starts
a temperature conversion. The temperature is read on
initial application of VCC or I2C access on VBAT and once
every 64 seconds afterwards. The temperature registers
are updated after each user-initiated conversion and on
every 64-second conversion. The temperature registers
are read-only.

I2C Serial Data Bus

The DS3231 supports a bidirectional I2C bus and datatransmission protocol. A device that sends data onto thebus is defined as a transmitter and a device receiving data
is defined as a receiver. The device that controls the message is called a master. The devices that are controlled
by the master are slaves. The bus must be controlled bya master device that generates the serial clock (SCL),
controls the bus access, and generates the START and
STOP conditions. The DS3231 operates as a slave on the
I2C bus. Connections to the bus are made through the
SCL input and open-drain SDA I/O lines. Within the bus
specifications, a standard mode (100kHz maximum clockrate) and a fast mode (400kHz maximum clock rate) aredefined. The DS3231 works in both modes.
The following bus protocol has been defined (Figure 2):● Data transfer may be initiated only when the bus is notbusy.
● During data transfer, the data line must remain stablewhenever the clock line is high. Changes in the data

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line while the clock line is high are interpreted as control signals.
Accordingly, the following bus conditions have been
defined:Bus not busy: Both data and clock lines remain high.
START data transfer: A change in the state of thedata line from high to low, while the clock line is high,defines a START condition.
STOP data transfer: A change in the state of thedata line from low to high, while the clock line is high,defines a STOP condition.
Data valid: The state of the data line represents valid
data when, after a START condition, the data line isstable for the duration of the high period of the clock
signal. The data on the line must be changed during
the low period of the clock signal. There is one clock
pulse per bit of data.
Each data transfer is initiated with a START condition
and terminated with a STOP condition. The numberof data bytes transferred between the START and the
STOP conditions is not limited, and is determined by
the master device. The information is transferred bytewise and each receiver acknowledges with a ninth bit.
Acknowledge: Each receiving device, whenaddressed, is obliged to generate an acknowledge
after the reception of each byte. The master device
must generate an extra clock pulse, which is associated with this acknowledge bit.
A device that acknowledges must pull down the SDA
line during the acknowledge clock pulse in such a waythat the SDA line is stable low during the high period of
the acknowledge-related clock pulse. Of course, setup
and hold times must be taken into account. A mastermust signal an end of data to the slave by not generat-

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Extremely Accurate I2C-Integrated
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DS3231MSB FIRST

MSB

LSB

MSB

LSB

SDA
SLAVE
ADDRESS

R/W

ACK

1–7

8

9

SCL
IDLE

DATA

ACK

1–7

START
CONDITION

8

9

DATA

1–7

ACK/
NACK

8

9

REPEATED IF MORE BYTESARE TRANSFERREDSTOP CONDITIONREPEATED START

Figure 2. I2C Data Transfer Overview

ing an acknowledge bit on the last byte that has beenclocked out of the slave. In this case, the slave mustleave the data line high to enable the master to generate the STOP condition.

is the slave address. Next follows a number of databytes. The slave returns an acknowledge bit after each
received byte. Data is transferred with the most significant bit (MSB) first.

Figures 3 and 4 detail how data transfer is accomplishedon the I2C bus. Depending upon the state of the R/W bit,two types of data transfer are possible:

Data transfer from a slave transmitter to a masterreceiver. The first byte (the slave address) is transmitted by the master. The slave then returns an acknowledge bit. Next follows a number of data bytes transmitted by the slave to the master. The master returns an
acknowledge bit after all received bytes other than the

Data transfer from a master transmitter to a slave
receiver. The first byte transmitted by the master<SLAVEADDRESS>S

1101000

<R/W>
0

A

<WORD ADDRESS (n)>XXXXXXXXAS - STARTSLAVE TO MASTER
A - ACKNOWLEDGE (ACK)P - STOP
R/W - READ/WRITE OR DIRECTION BIT ADDRESS<DATA (n)>XXXXXXXX<DATA (n + 1)>
A

XXXXXXXX<DATA (n + X)A...

XXXXXXXX

A

P

A

P

MASTER TO SLAVEDATA TRANSFERRED(X + 1 BYTES + ACKNOWLEDGE)

Figure 3. Data Write—Slave Receiver ModeS

<SLAVEADDRESS><R/W><DATA (n)>1101000

1

XXXXXXXXA

MASTER TO SLAVES - STARTA - ACKNOWLEDGE (ACK)P - STOPA - NOT ACKNOWLEDGE (NACK)
R/W - READ/WRITE OR DIRECTION BIT ADDRESS<DATA (n + 1)>
A

XXXXXXXX<DATA (n + 2)>
A

XXXXXXXX<DATA (n + X)>A...

XXXXXXXXSLAVE TO MASTERDATA TRANSFERRED(X + 1 BYTES + ACKNOWLEDGE)
NOTE: LAST DATA BYTE IS FOLLOWED BY A NACK.

Figure 4. Data Read—Slave Transmitter Modewww.maximintegrated.com

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DS3231<SLAVEADDRESS><R/W>
S

1101000

0<DATA (n)>XXXXXXXX<WORD ADDRESS (n)> <SLAVE ADDRESS (n)><R/W>
A

XXXXXXXX<DATA (n + 1)>
A

XXXXXXXX

A

Sr

1101000

1

A<DATA (n + 2)>
A

XXXXXXXXS - STARTMASTER TO SLAVE
Sr - REPEATED START
A - ACKNOWLEDGE (ACK)P - STOPA - NOT ACKNOWLEDGE (NACK)
R/W - READ/WRITE OR DIRECTION BIT ADDRESS<DATA (n + X)>A...

XXXXXXXXAPSLAVE TO MASTERDATA TRANSFERRED(X + 1 BYTES + ACKNOWLEDGE)
NOTE: LAST DATA BYTE IS FOLLOWED BY A NACK.

Figure 5. Data Write/Read (Write Pointer, Then Read)—Slave Receive and Transmit

last byte. At the end of the last received byte, a not
acknowledge is returned.
The master device generates all the serial clock pulses
and the START and STOP conditions. A transfer
is ended with a STOP condition or with a repeated
START condition. Since a repeated START conditionis also the beginning of the next serial transfer, the bus
will not be released. Data is transferred with the mostsignificant bit (MSB) first.
The DS3231 can operate in the following two modes:
Slave receiver mode (DS3231 write mode): Serial
data and clock are received through SDA and SCL.
After each byte is received, an acknowledge bit istransmitted. START and STOP conditions are recognized as the beginning and end of a serial transfer.
Address recognition is performed by hardware after
reception of the slave address and direction bit. The
slave address byte is the first byte received after the
master generates the START condition. The slave
address byte contains the 7-bit DS3231 address,
which is 1101000, followed by the direction bit (R/W),
which is 0 for a write. After receiving and decoding theslave address byte, the DS3231 outputs an acknowledge on SDA. After the DS3231 acknowledges theslave address + write bit, the master transmits a word
address to the DS3231. This sets the register pointeron the DS3231, with the DS3231 acknowledging thewww.maximintegrated.com

transfer. The master may then transmit zero or morebytes of data, with the DS3231 acknowledging eachbyte received. The register pointer increments after
each data byte is transferred. The master generates a
STOP condition to terminate the data write.
Slave transmitter mode (DS3231 read mode): The
first byte is received and handled as in the slave
receiver mode. However, in this mode, the direction
bit indicates that the transfer direction is reversed.
Serial data is transmitted on SDA by the DS3231 while
the serial clock is input on SCL. START and STOP
conditions are recognized as the beginning and endof a serial transfer. Address recognition is performedby hardware after reception of the slave address anddirection bit. The slave address byte is the first byte
received after the master generates a START condition. The slave address byte contains the 7-bit DS3231
address, which is 1101000, followed by the direction
bit (R/W), which is 1 for a read. After receiving anddecoding the slave address byte, the DS3231 outputs
an acknowledge on SDA. The DS3231 then begins totransmit data starting with the register address pointed
to by the register pointer. If the register pointer is not
written to before the initiation of a read mode, the first
address that is read is the last one stored in the register pointer. The DS3231 must receive a not acknowledge to end a read.

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DS3231

Handling, PCB Layout, and Assembly

The DS3231 package contains a quartz tuning-fork
crystal. Pick-and-place equipment can be used, but
precautions should be taken to ensure that
excessive shocks are avoided. Ultrasonic cleaning should be
avoided to prevent damage to the crystal.

signal line. All N.C. (no connect) pins must be connected
to ground.

Avoid running signal traces under the package, unlessa ground plane is placed between the package and theMoisture-sensitive packages are shipped from thefactory dry packed. Handling instructions listed on the
package label must be followed to prevent damage during
reflow. Refer to the IPC/JEDEC J-STD-020 standard formoisture-sensitive device (MSD) classifications and reflow
profiles. Exposure to reflow is limited to 2 times maximum.

Pin Configuration

Ordering InformationPART

TOP VIEW
32kHz 116 SCLVCC 2

15 SDA

INT/SQW 3

14 VBATRST 4

DS323113 GND

N.C. 5

12 N.C.

N.C. 6

11 N.C.

N.C. 7

10 N.C.

N.C. 8

9

N.C.

SO

Chip Information

SUBSTRATE CONNECTED TO GROUNDTEMP RANGE

PIN-PACKAGE

DS3231S#

0°C to +70°C

16 SO

DS3231SN#-40°C to +85°C

16 SO#Denotes an RoHS-compliant device that may include lead(Pb) that is exempt under RoHS requirements. The lead finish
is JESD97 category e3, and is compatible with both lead-based
and lead-free soldering processes. A “#” anywhere on the top
mark denotes an RoHS-compliant device.

Package Information

For the latest package outline information and land patterns(footprints), go to www.maximintegrated.com/packages. Notethat a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
PACKAGETYPE

PACKAGECODEOUTLINENO.

LAND
PATTERN NO.

16 SO

W16#H221-004290-0107

PROCESS: CMOS

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DS3231

Revision History
REVISIONNUMBERREVISION
DATE

0

1/05

1

2

3

4

5

2/05

6/05

11/05

10/06

4/08

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PAGES
CHANGEDDESCRIPTION
Initial release.

—

Changed Digital Temp Sensor Output from ±2°C to ±3°C.

1, 3Updated Typical Operating Circuit.

1

Changed TA = -40°C to +85°C to TA = TMIN to TMAX.

2, 3, 4

Updated Block Diagram.

8

Added “UL Recognized” to Features; added lead-free packages and removed S from top
mark info in Ordering Information table; added ground connections to the N.C. pin in the
Typical Operating Circuit.

1

Added “noncondensing” to operating temperature range; changed VPF MIN from 2.35V to
2.45V.

2

Added aging offset specification.

3

Relabeled TOC4.

7

Added arrow showing input on X1 in the Block Diagram.

8

Updated pin descriptions for VCC and VBAT.

9

Added the I2C Interface section.

10

Figure 1: Added sign bit to aging and temperature registers; added MSB and LSB.

11

Corrected title for rate select bits frequency table.

13

Added note that frequency stability over temperature spec is with aging offset register =00h; changed bit 7 from Data to Sign (Crystal Aging Offset Register).

14

Changed bit 7 from Data to Sign (Temperature Register); correct pin definitions in I2C
Serial Data Bus section.

15

Modified the Handing, PC Board Layout, and Assembly section to refer to
J-STD-020 for reflow profiles for lead-free and leaded packages.

17

Changed lead-free packages to RoHS-compliant packages.

1

Changed RST and UL bullets in Features.

1

Changed EC condition “VCC > VBAT” to “VCC = Active Supply (see Table 1).”2, 3

Modified Note 12 to correct tREC operation.

6

Added various conditions text to TOCs 1, 2, and 3.

7

Added text to pin descriptions for 32kHz, VCC, and RST.

9

Table 1: Changed column heading “Powered By” to “Active Supply”; changed “applied” to“exceeds VPF” in the Power Control section.

10

Indicated BBSQW applies to both SQW and interrupts; simplified temp convert
description (bit 5); added “output” to INT/SQW (bit 2).

13

Changed the Crystal Aging section to the Aging Offset section; changed “this bit
indicates” to “this bit controls” for the enable 32kHz output bit.

14

Added Warning note to EC table notes; updated Note 12.

6Updated the Typical Operating Characteristics graphs.

7

In the Power Control section, added information about the POR state of the time and dateregisters; in the Real-Time Clock section, added to the description of the RST function.

10

In Figure 1, corrected the months date range for 04h from 00–31 to 01–31.

11

Maxim Integrated │ 19

Extremely Accurate I2C-Integrated
RTC/TCXO/Crystal

DS3231

Revision History (continued)
REVISIONNUMBER

6

REVISION
DATE

10/08

PAGES
CHANGEDDESCRIPTION
Updated the Typical Operating Circuit.

1

Removed the VPU parameter from the Recommended DC Operating Conditions table
and added verbiage about the pullup to the Pin Description table for INT/SQW, SDA, and
SCL.

2, 9

Added the Delta Time and Frequency vs. Temperature graph in the Typical Operating
Characteristics section.

7

Updated the Block Diagram.

8

Added the VBAT Operation section, improved some sections of text for the 32kHz TCXO
and Pushbutton Reset Function sections.

10

Added the register bit POR values to the register tables.

13, 14, 15

Updated the Aging Offset and Temperature Registers (11h–12h) sections.

14, 15

Updated the I2C timing diagrams (Figures 3, 4, and 5).

16, 17

3/10

Removed the “S” from the top mark in the Ordering Information table and the Pin
Configuration to match the packaging engineering marking specification.

1, 18

7/10

Updated the Typical Operating Circuit; removed the “Top Mark” column from the Ordering
Information; in the Absolute Maximum Ratings section, added the theta-JA and thetaJC thermal resistances and Note 1, and changed the soldering temperature to +260°C(lead(Pb)-free) and +240°C (leaded); updated the functional description of the VBAT pinin the Pin Description; changed the timekeeping registers 02h, 09h, and 0Ch to “20 Hour”
in Bit 5 of Figure 1; updated the BBSQW bit description in the Control Register (0Eh)section; added the land pattern no. to the Package Information table.

9

1/13

Updated Absolute Maximum Ratings, and last paragraph in Power Control section

10

3/15

Revised Benefits and Features section.

7

8

1, 2, 3, 4, 6, 9,
11, 12, 13, 18

2, 10
1

For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim Integrated’s website at www.maximintegrated.com.
Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses
are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits)shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.

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© 2015 Maxim Integrated Products, Inc. │ 20