U-SMD-650560A

U-SMD-650 SERIES 5630 LASER DIODE■ Features
1. 5630 Packaged
2. High temperature operation
3. single mode lasing
4. Standard optical power output：5mW (CW)■ Applications
1. Laser Module
2. Medical application■ External dimensions(Unit : mm)

5.60×3.00×0.80

Notes:
1. Drawings are not to scale
2. All dimensions are all in millimeter
3. All dimensions without tolerance are for reference only

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UNION OPTRONICS CORP.
No.156, Gaoshih Rd., Yangmei Dist., Taoyuan City 326, Taiwan
TEL : +886-3-4852687+886-3-2759468
FAX : +886-3-4754378
E-mail : sales@uocnet.com
Website : http://www.uocnet.com
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U-SMD-650 SERIES 5630 LASER DIODE■ Soldering Conditions(Reference Outline)

NOTE : All dimensions in mm tolerance is +/- 0.1mm unless otherwise noted.
The drawing above shows the recommended solder pad layout on Printed Circuit Board (PCB).
■ Emission direction
Laser beam

■ Absolute Maximum Ratings
Parameter

SymbolRating

UnitPo5mW

LD Reverse Voltage (Tc=25℃)

Vr_LD2V

Operating Temperature (Case)

Top-10～+60℃

Storage Temperature

Tstg-40～+85℃

Optical Output (Tc=25℃)

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U-SMD-650 SERIES 5630 LASER DIODE■ Electrical and Optical Characteristics(Tc=25℃)
Parameter

SymbolCondition

Min.

Typ.

Max.

Unit

Threshold Current

Ith

Po=1-4mW-

1225mA

Operating Current

Iop

Po=5mW-

1725mA

Operating Voltage

Vop

Po=5mW-2.2

2.5V

Slope Efficiency

ηPo=1-4mW

0.7

1-mW/mA

Beam Divergence

Parallelθ//

Po=5mW

57.5

12deg.

(FWHM)

Perpendicularθ⊥

Po=5mW

303642deg.

λPo=5mW

640

650660nm

Lasing Wavelength◎ θ// and θ⊥ are defined as the angle within which the intensity is 50% of the peak value.

■ Typical characteristic curves

Optical Output Power (mW)

Optical Output Power v.s. Forward Current
6oo
25oC 40 C 50 C 60oC

543210051015202530

Forward Current (mA)
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U-SMD-650 SERIES 5630 LASER DIODE

Forward Voltage (V)Forward Voltage v.s. Forward Current
2.7o25oC 40oC 50 C 60oC

2.42.11.81.5
1.2
0.9
0.6
0.3
0.0051015202530

Forward Current (mA)

Peak Wavelength (nm)Peak Wavelength v.s. Case Temperature
670665660655
650
2530354045505560oCase Temperature ( C)Far-Field Pattern
Relative Intensity

1.0

Po=5mWo
Tc=25 C

0.8
0.6
0.4

Perpendicular
0.2

Parallel
0.0-60-50-40-30-20-100102030

405060

Angle (degree)
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U-SMD-650 SERIES 5630 LASER DIODE

Slope Efficiency (mW/mA)

Slope Efficiency v.s. Case Temperature
1.41.2
1.00.80.6
0.40.20.02530354045505560

Case Temperature (oC)Threshold Current (mA)

Threshold Current v.s. Case Temperature
100102530354045505560

oCase Temperature ( C)Power v.s. Case TemperaturePower Ratio (%)

120.0
100.0
80.0
60.0
40.0
20.00.01015202530354045505560

oCase Temperature ( C)Ver.03

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U-SMD-650 SERIES 5630 LASER DIODE■ Radiation Pattern in Polar Coordinate Systemshort axis-20-1001020-3030-4040-5050-6060-70

70-80

80-9090long axis-20-10010-302030-4040-5050-6060-7070-80

80-9090

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U-SMD-650 SERIES 5630 LASER DIODE■ Packing Information- Embossed Tape Dimension

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U-SMD-650 SERIES 5630 LASER DIODE■ PrecautionsQUALITY ASSURANCE
After any processing of laser chip or laser diode SMD (LD) by the customer, the performance, yield andreliability of the product, in which the chip or LD is applied, are subject to change due to customer’s
handling, assembly, testing, and processing. Because laser chip and LD are strongly affected byenvironmental conditions, physical stress, and chemical stresses imposed by customer that are not in Union
Optronics Corp. (UOC) control and hence no guarantee on the characteristics and the reliability at all after
the shipment. Also, UOC does not have any responsibility for field failures in a customer product. Whenattaching a heat sink to laser chip or LD, be careful not to apply excessive force to the device in the process.
SAFETY PRECAUTIONS
Although Union Optronics Corp. (UOC) keeps improving quality and reliability of its laser chip and laser
diode SMD (LD), semiconductor devices in general can malfunction or fail due to their intrinsic
characteristics. Hence, it is required that the customer’s products are designed with full regard to safety byincorporating the redundancy, fire prevention, error prevention so that any problems or error with UOC laserchip or LD does not cause any accidents resulting in injury, death, fire, property damage, economic damage,or environmental damage. In case customer wants to use UOC laser chip or LD in the systems requiringhigh safety, customer is requested to confirm safety of entire systems with customer’s own testing.
SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE.
The information provided by Union Optronics Corp. (UOC), including but not limited to technicalspecifications, recommendations, and application notes relating to laser chip or laser diode SMD (LD) isbelieved to be reliable and accurate and is subject to change without notice. UOC reserves the right tochange its assembly, test, design, form, specification, control, or function without notice.

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