Data Sheet
2023.10PRELIMINARY

EDCC850DS-1100-X
850nm High Power Compact Size LED

Outline and Internal Circuit

land pattern for solder(Unit : mm)

Features Chip Material : AlGaAs
 Chip Dimension : 1mm * 1mm
 Number of Chips : 1pce
 Peak Wavelength : 850nm typ.
 Lead Frame Die : Ceramics
 Lens : Silicone Resin

Application

EDCC850DS-1100-X

Absolute Maximum Ratings (Tc=25°C)
Item

SymbolRatings

Unit

Power Dissipation

PD

4200

mW

Forward Current

IF1000mA

Pulse Forward Current

IFP

5000mA

Reverse Voltage

VR5V

Thermal ResistanceRthjs20K/W

Junction Temperature

Tj120°C

Operating TemperatureTopr-40 ~ +100°C

Storage Temperature

Tstg-40 ~ +100°C

Soldering Temperature

TSOL250°C‡Pulse Forward Current condition : Duty 1% and Pulse Width=10us.
‡Soldering condition : Refer to technical support information on the website.

Optical and Electrical Characteristics (Tc=25°C)
Parameter

SymbolMin

VF(*: 100% testing, **: reference value)

TypMax3.2

4.2

Forward Voltage

Unit

IF=1A*VVFP
Reverse Current

IRTotal Radiated PowerPO4.0

Radiant Intensity

IFP=3A**
10840uA

1200

IF=1A*3100

IFP=3A**

310

IF=1A**IE

Peak WavelengthpHalf WidthLongmW/sr

Short

840

IFP=3A**860

33±621/2

VR=5V*mW

820

Viewing Half Angle

Test Condition

±66

nm

IF=1A*

nm

IF=1A**

deg.

IF=100mA**

Rise Time

tr30

ns

IF=1A**

Fall Time

tf30

ns

IF=1A**‡Radiated Power is measured by S3584-08.
‡Radiant Intensity is measured by CIE127-2007 Condition B.

EDCC850DS-1100-X
Typical Characteristic Curves
Relative Radiant Intensity Forward Current

Forward Current - Forward Voltage
1041010101010(ta=25°C, tw=10 s, Duty=1%)

Relative Radiant Intensity (A.U.)

Forward Current (mA)

(ta=25°C, tw=10 s, Duty=1%)

32101A Standard
1

0.1

0.01

0.001

0.0001

2.0

2.4

2.8

3.2

3.6

4.0

4.4

4.8

1

Forward Voltage (V)41100

Allowable Forward Current (mA)

1200

87654
32

310 98
7654
310Hz

1kHz

100Hz

210kHzForward Current Ifp (mA)

1000

Allowable Forward Current Ambient Temperature

10 9

Rthjs=20K/W

1000
900
800
700
600
500
400
300
200
100

210100Forward Current (mA)

Forward Current - Pulse Duration

101000101102103104

Duration tw ( s)105106020406080

100

Ambient Temperature (°C)

EDCC850DS-1100-X

Forward Voltage Ambient Temperature

Relative Radiant Intensity Ambient Temperature

3.7

10

If=1A

Relative Radiant Intensity (A.U.)

3.6

Forward Voltage (V)

3.5
3.4
3.3
3.2
3.1
3.0
2.9
2.8

9876

If=1A

54
32

1

98765432

0.1

2.70204060801000206080

Ambient Temperature (°C)

Ambient Temperature (°C)

Peak Wavelength Ambient Temperature

Relative Spectral Emission

900

100

1.0

If=1A

Relative Radiant Intensity (A.U.)

890

Peak Wavelength (nm)

40880
870
860
850
840
830
820
810
800
0204060

80

Ambient Temperature (°C)

1000.9(ta=25°C)

0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
750

800

850

900

Wavelength (nm)950

EDCC850DS-1100-X

Radiation Characteristics
1.0Long-90deg.

Relative Radiant Intensity (A.U.)+90deg.

+90deg.
Short-90deg.

0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2

Long ±62
Short ±66

0.1
0.0-90-60-300306090Angle (deg.)

Radiation Characteristics-20-1001020-3030Angle (deg.)-4040-50

Long ±62
Short ±66
50-60

60-70

70-80

80-90

90
1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1

Relative Radiant Intensity (A.U.)

EDCC850DS-1100-X
Wrapping
Moisture barrier bag aluminum laminated film with a desiccant to keep out the moisture absorption
during the transportation and storage.

SMD LED storage and handling precautions
Storage Conditions before Opening a Moisture-Barrier Aluminum Bag


Before opening a moisture-barrier aluminum bag, please store it at <30ºC, <60%RH.



Please note that the maximum shelf life is 12 months under these conditions.

Storage Conditions after Opening a Moisture-Barrier Aluminum Bag


After opening a moisture-barrier aluminum bag, store the aluminum bag and silica gel in a desiccator.

After opening the bag, please solder the LEDs within 72 hours in a room with 5 - 30ºC, <50%RH.

Please put any unused, remaining LEDs and silica gel back in the same aluminum bag and thenvacuum-seal the bag.

It is recommended to keep the re-sealed bag in a desiccator at <30%RH.

The 72-hour- long floor life does not include the time while LEDs are stored in the moisture-barrier
aluminum bag. However, we strongly recommend to solder the LEDs as soon as possible after
opening the aluminum bag.

Notes about Re-sealing a Moisture-Barrier Aluminum Bag
When vacuum-sealing an opened aluminum bag, if you find the moisture-indicator of the silica gel
has changed to pink from blue (indicating a relative humidity of 30 % or more), please do not use
the unused LEDs, the aluminum bag, or the silica gel.

Notes about Opening a Re-sealed Moisture-Barrier Aluminum Bag
When opening a vacuumed and re-sealed aluminum bag in order to use the remaining LEDs
stored in the bag, if you find that the moisture-indicator of the silica has changed to pink, please donot use the LEDs.

EDCC850DS-1100-X

Disclaimer
Product specifications and data shown in this product catalog are subject to change without notice for thepurposes of improving product performance, reliability, design, or otherwise.
Product data and parameters in this catalog are typical values based on reasonably up-to-date measurements.
Product data and parameters may vary by user application and over time.
Products shown in this catalog are intended to be used for general electronic equipment.

Products are notguaranteed for applications where product malfunction or failure may cause personal injury or death, including
but not limited to life-supporting / saving devices, medical devices, safety devices, airplanes, aerospaceequipment, automobiles, traffic control systems, and nuclear reactor control systems.

Technical Support Information
https://www.ushio.co.jp/en/led/technology/index.html

www.ushio.co.jp

led-sales@ushio.co.jp
2310①-NP