AMD Reference Configuration: Ansys on Lenovo
AMD Value Proposition for Ansys
Better Performance vs. Competition• Up to 33% faster1 for Ansys® Mechanical™
• Up to 119% faster2 for Ansys® LS-DYNA®
• Up to 118% faster3 for Ansys® CFX®
• Up to 68% faster4 for Ansys® Fluent®
Optimization Boost with AOCL
• Up to 212% gains1 for Ansys® Mechanical™

Why run Ansys applications on HPC systems?
To realize the full potential value of the widely used Ansys
applications, companies are investing in high-performancecomputing (HPC) infrastructure with the best performing
processors. This helps reduce constraints on the number, size,and complexity of simulation models while delivering faster time
to results. It also helps engineers improve design quality andprototype performance and can significantly reduce total cost ofownership (TCO) with fewer servers, reduced power, and loweremissions.5

Yet, challenges remain with HPC infrastructure
Up to 51% TCO Savings over 3 Years5

Sample Lenovo Configuration for Ansys

Even with modern systems, Ansys workloads are challenged by:• Inadequate processor frequency and/or core density,
requiring massive, expensive scale-out solutions for many
Ansys tasks• Insufficient memory capacity and bandwidth, and low
ratios of cache per core, hurt compute performance• Poorly optimized I/O• Lack of data security during computation.

Why AMD® for Ansys?
AMD EPYC™ processors help overcome the above challenges
and provide an optimal architecture for Ansys applications.
Analysis conducted by AMD suggests that manufacturers could
achieve up to an estimated 51% TCO savings over three years byupgrading to the latest AMD EPYC processors, while cutting thenumber of cores in half.5For example, Ansys LS-DYNA, CFX, and Fluent users benefit fromAMD EPYC processors with 3D V-Cache™ technology, providing
triple the L3 cache compared to the previous generation.
In addition, optimizing Ansys applications with AMD compilers and libraries can help enhance performance. For example,Ansys Mechanical was optimized with AOCL (AMD Optimizing CPU Libraries) for a geomean performance improvement ofup to 26% with estimated gains as much as up to 212% versus the competition.1

Expertly architected, optimized Lenovo® configurations with AMD EPYC processors for Ansys
Lenovo systems with high core count EPYC processors (Table 1) can deliver high throughput per node for Computational
Fluid Dynamics (CFD) applications like Fluent and CFX since they benefit from multicore parallelism.
For crash applications like Ansys LS-DYNA, LENOVO systems (Table 1) with medium-core count EPYC processors withhigh frequencies and high cache-per-core offer very high performance per core to help efficiently utilize per-core
software licenses.

Table 1: Sample Lenovo configurations for CFD (CFX, Fluent) and Explicit Finite Element Analysis(FEA): Ansys LS-DYNA

ServerBest Price /Performance
BestPerformance

ProcessorMemory• SR645 (1U)

• 2x AMD 7373X CPUs
• (16c/socket, 3.05GHz, 280W TDP)

• 256GB Total RAM 16x 16GB
DDR4 3200MHz 2R DIMMs• SR645 (1U)

• 2x AMD 7573X CPUs
• (32c/socket, 2.8GHz, 280W TDP)

• 256GB Total RAM 16x 16GB
DDR4 3200MHz 2R DIMMs

For structural analysis using implicit FEA, like Ansys Mechanical, LENOVO systems (Table 2) with low-core count
EPYC processors with high frequencies help efficiently utilize per-core software licenses and perform well on 3rdgeneration EPYC processors without 3D V-Cache technology.

Table 2: Sample Lenovo SR645 (1U) configurations for Structural Mechanics: Ansys Mechanical

StorageUpgraded internal
Storage• 1024GB Total
RAM 16x 64GB
DDR4 3200MHz
2R DIMMs• 2x 2.5”
1.6TB SAS
SSD

• 2x 3.5” Kioxia CM6-V
1.6TB NVMe PCIe 4.0• 1024GB Total
RAM 16x 64GB
DDR4 3200MHz
2R DIMMs• 2x 2.5”
1.6TB SAS
SSD

• 2x 3.5” Kioxia CM6-V
1.6TB NVMe PCIe 4.0

Problem Type

Processor

MemoryProblems withlimited scaling• 2x AMD 72F3 CPUs
• (16c/socket, 3.7GHz,180W TDP)

Problems withmore scaling• 2x AMD 7373X CPUs
• (32c/socket, 3.05GHz,280W TDP)In addition to CPU-based solutions, Ansys and AMD have collaborated to enable Ansys Mechanical on AMD
Instinct™ graphics processing unit (GPU) accelerators.6“Our customers are engineering experts, but
Benefits: AMD-based scalable Lenovo systems with Ansys that expertise doesn’t always stretch to HPC
cluster selection and deployment. We want to• Validated and optimized solution with compute, storage,
give our customers the best possible experience
software, services, and financial options
and, for that reason, we are working with• On-site install, start-up, and integration services delivered by
Lenovo, AMD, and business partners to provide
Lenovo or a certified Lenovo business partner
our customers an Ansys-optimized cluster• Remote management available with proactive monitoring andsolution designed for ease of procurement,
remediation of any Ansys operational issues.
deployment, and operation.”

Key Contacts

Ramesh Joginpalli
Global Lead - HPC, Manufacturing

rjoginpalli@Lenovo.com
www.Lenovo.com

Wim Slagter
Strategic Partnerships Director, Ansys

DISCLAIMER:
The information contained herein is for informational purposes only and is subject to change without notice. While every precaution has
been taken in the preparation of this document, it may contain technical inaccuracies, omissions and typographical errors, and AMD is under
no obligation to update or otherwise correct this information. Advanced Micro Devices, Inc. makes no representations or warranties withrespect to the accuracy or completeness of the contents of this document, and assumes no liability of any kind, including the impliedwarranties with respect to the operation or use of AMD hardware, software or other products described herein. No license, including impliedor arising by estoppel, to any intellectual property rights is granted by this document, Terms and limitations applicable to the purchase oruse of AMD’s products are as set forth in a signed agreement between the parties or in AMD’s Standard Terms and Conditions of SaleCOPYRIGHT NOTICE©2022 Advanced Micro Devices, Inc. All rights reserved. AMD Arrow logo, EPYC, and combinations thereof are trademarks of AdvancedMicro Devices, Inc. Ansys, CFX, Fluent, LS-DYNA, Mechanical, and any and all Ansys, Inc. brand, product, service and feature names, logosand slogans are registered trademarks or trademarks of Ansys, Inc. or its subsidiaries in the United States or other countries under license.
PCIe is a registered trademark of PCI-SIG Corporation. Other product names used in this publication are for identification purpose only andmay be trademarks of their respective companies.

1MLN-130A (https://www.amd.com/en/claims/epyc#faq-MLN130A): ANSYS® Mechanical® 2021 R2 comparison based on
AMD internal testing as of 09/27/2021 measuring the averageof all Release 2019 R2 test case simulations using a server with
2x AMD EPYC 75F3 versus 2x Intel Xeon Platinum 8362. Steadystate thermal analysis of a power supply module 5.3M (cg1) ismax result. Results may vary.
2MLNX-009A (https://www.amd.com/en/claims/epyc3x#faqMLNX-009A): ANSYS® LS-DYNA® 2022.1 comparison based on
AMD internal testing as of 09/27/2021 measuring the time torun the 3Cars, Car2Car, odb10m-short, and Neon test casesimulations. Configurations: 2x 64C AMD EPYC 7773X with AMD
3D V-Cache Technology (“Milan-X”) versus 2x 40C Intel Xeon
Platinum 8380. 3cars is the max result. Results may vary basedon factors including silicon version, hardware and software
configuration and driver versions.
3MLNX-010A (https://www.amd.com/en/claims/epyc3x#faqMLNX-010A): ANSYS® CFX® 2022.1 comparison based on AMD
internal testing as of 02/14/2022 measuring the average time
to run the cfx_10, cfx_50, cfx_100, cfx_lmans, and cfx_pump
test case simulations. Configurations: 2x 32C AMD EPYC™
7573X with AMD 3D V-Cache technology™ versus 2x 32C Intel

Xeon Platinum 8362. Cfx_10 is the max result. Results may vary
based on factors including silicon version, hardware andsoftware configuration and driver versions.
4MLNX-014 (https://www.amd.com/en/claims/epyc3x#faqMLNX-014): ANSYS® FLUENT® 2022.1 comparison based on
AMD internal testing as of 02/14/2022 measuring the rating of
the Release 19 R1 test case test case simulations.
Configurations: 2x 32C AMD EPYC™ 7573X with AMD 3D VCache™ versus 2x 32C Intel Xeon Platinum 8362. Pump2 is themax result. Results may vary based on factors including siliconversion, hardware and software configuration and driverversions.
5
Based on a comparison of a 2P AMD EPYC 7573X-powered
server running Ansys cfx-50 vs. a similarly configured 2P Intel
Xeon Platinum 8362-based server to deliver 4,600 jobs per day.
Detailed results and TCO calculations are provided in MLNXTCO001 in the AMD EPYC family claim information endnotes.
See AMD EPYC claim MLNXTCO-001
at www.amd.com/en/claims/epyc3x.
6Ansys and AMD Collaborate to Speed Simulation of Large
Structural Mechanical Models Up to 6x Faster