Datasheet SGP30
Sensirion Gas Platform Multi-pixel gas sensor for indoor air quality applications
 Outstanding long-term stability
 I2C interface with TVOC and CO2eq output signals
 Very small 6-pin DFN package: 2.45 x 2.45 x 0.9 mm3
 Low power consumption: 48 mA at 1.8V
 Tape and reel packaged, reflow solderable

Product Summary
The SGP30 is a digital multi-pixel gas sensor designed foreasy integration into air purifier, demand-controlled
ventilation, and IoT applications. Sensirion’s CMOSens®
technology offers a complete sensor system on a single
chip featuring a digital I2C interface, a temperature
controlled micro hotplate, and two preprocessed indoor air
quality signals. As the first metal-oxide gas sensor
featuring multiple sensing elements on one chip, the
SGP30 provides more detailed information about the air
quality.

The sensing element features an unmatched robustness
against contaminating gases present in real-world
applications enabling a unique long-term stability and low
drift. The very small 2.45 x 2.45 x 0.9 mm3 DFN package
enables applications in limited spaces. Sensirion’s
state-of-the-art production process guarantees highreproducibility and reliability. Tape and reel packaging,
together with suitability for standard SMD assembly
processes make the SGP30 predestined for high-volume
applications.

Block Diagram

Figure 1 Functional block diagram of the SGP30.

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1

Sensor Performance

1.1 Gas Sensing Performance
ParameterSignalValuesMeasurement
range1Ethanol signal

0 ppm to 1000 ppm

H2 signal

0 ppm to 1000 ppm

Specifiedmeasurement
range

Ethanol signal

0.3 ppm to 30 ppm

H2 signal

0.5 ppm to 10 ppm

Ethanol signal

see Figure 2
typ.: 15% of meas. value

Accuracy3Long-term
drift3,4

Resolution
Sampling
frequency

H2 signalsee Figure 3
typ.: 10% of meas. value

Ethanol signal

see Figure 4
typ.: 1.3% of meas. value

H2 signalsee Figure 5
typ.: 1.3% of meas. value

Ethanol signal
H2 signal
Ethanol signal
H2 signal

Comments

The specifications below are defined for this measurement
range2. The specified measurement range covers the gas
concentrations expected in indoor air quality applications.
Accuracy of the concentration cdetermined byln (𝑐⁄𝑐𝑟𝑒𝑓 ) =(𝑠𝑟𝑒𝑓 −𝑠𝑜𝑢𝑡 )cref = 0.4 ppm

𝑎a = 512
sout: EthOH/H2 signal output
at concentration csref: EthOH/H2 signal output
at 0.5 ppm H2

cref = 0.5 ppm

Change of accuracy over time: Siloxane accelerated lifetime
test5

0.2 % of meas. value

Resolution of Ethanol and H2 signal outputs in relativechange of the measured concentration

Max. 40 Hz

Compare with minimum measurement duration in Table 10

Table 1 Gas sensing performance. Specifications are at 25°C, 50% RH and typical VDD.

Accuracy ethanol signal

Accuracy H2 signal

Figure 2 Typical and maximum accuracy tolerance in % of
measured value at 25°C, 50% RH and typical VDD. The sensors
have been operated for at least 24h before the characterization.

Figure 3 Typical and maximum accuracy tolerance in % of
measured value at 25°C, 50% RH and typical VDD. The sensors
have been operated for at least 60h before the characterization.

1 Exposure to ethanol and H2 concentrations up to 1000 ppm have been tested. For applications requiring the measurement of higher gas

concentrations please contact Sensirion.
2 ppm: parts per million. 1 ppm = 1000 ppb (parts per billion)
3 90% of the sensors will be within the typical accuracy tolerance, >99% are within the maximum tolerance.
4 The long-term drift is stated as change of accuracy per year of operation.
5 Test conditions: operation in 250 ppm Decamethylcyclopentasiloxane (D5) for 200h simulating 10 years of operation in an indoor
environment.
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Long-term drift Ethanol signal

Long-term drift H2 signal

Figure 4 Typical and maximum long-term drift in % of measured
value at 25°C, 50% RH and typical VDD. The sensors have been
operated for at least 24h before the first characterization.

Figure 5 Typical and maximum long-term drift in % of measured
value at 25°C, 50% RH and typical VDD. The sensors have been
operated for at least 60h before the first characterization.

1.2 Air Quality Signals
Parameter
Output range

SignalValues

TVOC signal

0 ppb to 60000 ppb

CO2eq signal

400 ppm to 60000 ppm

Maximum possible output range. The gas
sensing performance is specified for themeasurement range as defined in Table 1

0 ppb - 2008 ppb

1 ppb

2008 ppb – 11110 ppb

6 ppb

11110 ppb – 60000 ppb

32 ppb400 ppm – 1479 ppm

1 ppm

1479 ppm – 5144 ppm

3 ppm

5144 ppm – 17597 ppm

9 ppm

17597 ppm – 60000 ppm

31 ppm

TVOC signal
Resolution
CO2eq signal

Sampling rate

Comments

TVOC signal

1 Hz

CO2eq signal

1 Hz

The on-chip baseline compensation algorithm
has been optimized for this sampling rate. The
sensor shows best performance when usedwith this sampling rate.

Table 2 Air quality signal specifications.

Figure 6 Simplified version of the functional block diagram (compare Figure 1) showing the signal
paths of the SGP30.

1.3 Recommended Operating Conditions
The sensor shows best performance when operated within recommended normal temperature and humidity range of5 – 55 °C and 4 –20 g/m3, respectively. Long-term exposure (operated and not operated) to conditions outside thewww.sensirion.com

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recommended range, especially at high humidity, may affect the sensor performance. Prolonged exposure to extreme
conditions may accelerate aging. To ensure stable operation of the gas sensor, the conditions described in the document SGP
Handling and Assembly Instructions regarding exposure to exceptionally high concentrations of some organic or inorganic
compounds have to be met, particularly during operation. Please also refer to the Design-in Guide for optimal integration of the
SGP30.

2

Electrical Specifications

Parameter

Min.

Typ.

Max.

Unit

Comments

Supply voltage VDD

1.62

1.8

1.98

V

Minimal voltage must be guaranteed also for the
maximum supply current specified in this table.

Hotplate supply voltage VDDH

1.62

1.8

1.98

V

Supply current in measurement mode6

48.2

Sleep current

2mA

The measurement mode is activated by sending
an “Init_air_quality” or “Measure_raw_signal”
command. Specified at 25°C and typical VDD.

10μA

The sleep mode is activated after power-up or
after a soft reset. Specified at 25°C and typical
VDD.

LOW-level input voltage-0.5

0.3*VDDV

HIGH-level input voltage

0.7*VDD

VDD+0.5

V

0.05*VDD

V

0.2*VDD

V

Vhys hysteresis of Schmitt trigger inputs
LOW-level output voltage
Communication(open-drain) at 2mA sink current

Digital 2-wire interface, I2C fast mode.

Table 3 Electrical specifications.

3Interface Specifications

The SGP30 comes in a 6-pin DFN package, see Table 4.
Pin

Name

Comments

1

VDD

Supply voltage

2

VSS

Ground1

3

SDA

Serial data, bidirectional

2

4

R

Connect to ground (no electrical function)

5

VDDH

Supply voltage, hotplate

6

SCL

Serial clock, bidirectional

3

S

GP

6
5

3
AX

0
4
89

Table 4 Pin assignment (transparent top view). Dashed lines are only visible from the bottom.

6 A 20% higher current is drawn during 5ms on VDDH after entering the measurement mode.

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Figure 7 Typical application circuit (for better clarity in the image, the positioning of the pins does
not reflect the positions on the real sensor).

The electrical specifications of the SGP30 are shown in Table 3. The power supply pins must be decoupled with a 100 nF
capacitor that shall be placed as close as possible to pin VDD – see Figure 7. The required decoupling depends on the power
supply network connected to the sensor. We also recommend VDD and VDDH pins to be shorted7.
SCL is used to synchronize the communication between the microcontroller and the sensor. The SDA pin is used to transfer
data to and from the sensor. For safe communication, the timing specifications defined in the I 2C manual8 must be met. BothSCL and SDA lines are open-drain I/Os with diodes to VDD and VSS. They should be connected to external pull-up resistors.
To avoid signal contention, the microcontroller must only drive SDA and SCL low. The external pull-up resistors(e.g. Rp = 10 kΩ) are required to pull the signal high. For dimensioning resistor sizes please take bus capacity andcommunication frequency into account (see for example Section 7.1 of NXPs I2C Manual for more details8). It should be notedthat pull-up resistors may be included in I/O circuits of microcontrollers.
The die pad or center pad is electrically connected to GND. Hence, electrical considerations do not impose constraints on thewiring of the die pad. However, for mechanical stability it is recommended to solder the center pad to the PCB.

4

Absolute Minimum and Maximum Ratings

Stress levels beyond those listed in Table 5 may cause permanent damage to the device. These are stress ratings only andfunctional operation of the device at these conditions cannot be guaranteed. Exposure to the absolute maximum rating
conditions for extended periods may affect the reliability of the device.
Parameter

RatingSupply voltage VDD-0.3 V to +2.16 V

Supply voltage VDDH

-0.3 V to +2.16 V

Storage temperature range-40 to +125°C

Operating temperature range-40 to +85°C

Humidity Range

10% - 95% (non-condensing)

ESD HBM

2 kV

ESD CDM

500 V

Latch up, JESD78 Class II, 125°C

100 mA

Table 5 Absolute minimum and maximum ratings.

Please contact Sensirion for storage, handling and assembly instructions.

7 If VDD and VDDH are not shorted, it is required that VDD is always powered when VDDH is powered. Otherwise, the sensor might bedamaged.
8 http://www.nxp.com/documents/user_manual/UM10204.pdf
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5

Timing Specifications

5.1 Sensor System Timings
The timings refer to the power up and reset of the ASIC part and do not reflect the usefulness of the readings.
Parameter

SymbolCondition

Min.

Typ.

Max.

Unit

Comments

Power-up timetPU

After hard reset, VDD ≥VPOR

-

0.4

0.6

ms

-

Soft reset timetSR

After soft reset

-

0.4

0.6

ms

-

Table 6 System timing specifications.

5.2 Communication Timings
Parameter

SymbolConditions

Min.

Typ.

Max.

Units

Comments

SCL clock frequency

fSCL

-

0

-

400

kHz

-

Hold time (repeated) START
condition

tHD;STA

After this period, thefirst clock pulse isgenerated

0.6

-

-

µs

-

LOW period of the SCL clock

tLOW

-

1.3

-

-

µs

-

HIGH period of the SCL clock

tHIGH

-

0.6

-

-

µs

-

Set-up time for a repeated
START conditiontSU;STA

-

0.6

-

-

µs

-

SDA hold time

tHD;DAT

-

0

-

-

ns

-

SDA set-up time

tSU;DAT

-

100

-

-

ns

-

SCL/SDA rise time

tR

-

-

-

300

ns

-

SCL/SDA fall time

tF

-

-

-

300

ns

-

SDA valid timetVD;DAT

-

-

-

0.9

µs

-

Set-up time for STOP conditiontSU;STO

-

0.6

-

-

µs

-

Capacitive load on bus line

CB

-

400

pF

-

Table 7 Communication timing specifications.
1/fSCL
tHIGH

tR

tLOW

tF
70%

SCL
tSU;DAT30%
tHD;DATDATA IN

70%

SDA

30%
tVD;DATDATA OUT

SDA

tF

tR
70%
30%

Figure 8 Timing diagram for digital input/output pads. SDA directions are seen from the sensor.
Bold SDA lines are controlled by the sensor; plain SDA lines are controlled by the micro-controller.
Note that SDA valid read time is triggered by falling edge of preceding toggle.

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6

Operation and Communication

The SGP30 supports I2C fast mode. For detailed information on the I2C protocol, refer to NXP I2C-bus specification8. All
SGP30 commands and data are mapped to a 16-bit address space. Additionally, data and commands are protected with a
CRC checksum to increase the communication reliability. The 16-bit commands that are sent to the sensor already include a
3-bit CRC checksum. Data sent from and received by the sensor is always succeeded by an 8-bit CRC.
In write direction it is mandatory to transmit the checksum, since the SGP30 only accepts data if it is followed by the correct
checksum. In read direction it is up to the master to decide if it wants to read and process the checksum.
SGP30

Hex. CodeI2C address

0x58

Table 8 I2C device address.

The typical communication sequence between the I2C master (e.g., a microcontroller in a host device) and the sensor isdescribed as follows:
1. The sensor is powered up, communication is initialized
2. The I2C master periodically requests measurement and reads data, in the following sequence:a. I2C master sends a measurement command
b. I2C master waits until the measurement is finished, either by waiting for the maximum execution time or by
waiting for the expected duration and then poll data until the read header is acknowledged by the sensor(expected durations are listed in Table 10)
c. I2C master reads out the measurement result

6.1 Power-Up and Communication Start
The sensor starts powering-up after reaching the power-up threshold voltage VPOR specified in Table 6. After reaching thisthreshold voltage, the sensor needs the time tPU to enter the idle state. Once the idle state is entered it is ready to receive
commands from the master.
Each transmission sequence begins with a START condition (S) and ends with a STOP condition (P) as described in the I 2Cbus specification.

6.2 Measurement Communication Sequence
A measurement communication sequence consists of a START condition, the I2C write header (7-bit I2C device address plus 0
as the write bit) and a 16-bit measurement command. The proper reception of each byte is indicated by the sensor. It pulls the
SDA pin low (ACK bit) after the falling edge of the 8th SCL clock to indicate the reception. With the acknowledgement of themeasurement command, the SGP30 starts measuring.
When the measurement is in progress, no communication with the sensor is possible and the sensor aborts thecommunication with a XCK condition.
After the sensor has completed the measurement, the master can read the measurement results by sending a START
condition followed by an I2C read header. The sensor will acknowledge the reception of the read header and responds withdata. The response data length is listed in Table 10 and is structured in data words, where one word consists of two bytes ofdata followed by one byte CRC checksum. Each byte must be acknowledged by the microcontroller with an ACK condition forthe sensor to continue sending data. If the sensor does not receive an ACK from the master after any byte of data, it will notcontinue sending data.
After receiving the checksum for the last word of data, an XCK and STOP condition have to be sent (see Figure 9).
The I2C master can abort the read transfer with a XCK followed by a STOP condition after any data byte if it is not interested insubsequent data, e.g. the CRC byte or following data bytes, in order to save time. Note that the data cannot be read morethan once, and access to data beyond the specified amount will return a pattern of 1s.

6.3 Measurement Commands
The available measurement commands of the SGP30 are listed in Table 10.
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Air Quality Signals
The SGP30 uses a dynamic baseline compensation algorithm and on-chip calibration parameters to provide twocomplementary air quality signals. Based on the sensor signals a total VOC signal (TVOC) and a CO2 equivalent signal(CO2eq) are calculated. Sending an “Init_air_quality” command starts the air quality measurement. After the “Init_air_quality”
command, a “Measure_air_quality” command has to be sent in regular intervals of 1s to ensure proper operation of the
dynamic baseline compensation algorithm. The sensor responds with 2 data bytes (MSB first) and 1 CRC byte for each of thetwo preprocessed air quality signals in the order CO2eq (ppm) and TVOC (ppb). For the first 15s after the “Init_air_quality”
command the sensor is in an initialization phase during which a “Measure_air_quality” command returns fixed values of
400 ppm CO2eq and 0 ppb TVOC.
The SGP30 also provides the possibility to read and write the baseline values of the baseline correction algorithm. This featureis used to save the baseline in regular intervals on an external non-volatile memory and restore it after a new power-up or soft
reset of the sensor. The command “Get_baseline” returns the baseline values for the two air quality signals. The sensor
responds with 2 data bytes (MSB first) and 1 CRC byte for each of the two values in the order CO 2eq and TVOC. These twovalues should be stored on an external memory. After a power-up or soft reset, the baseline of the baseline correction
algorithm can be restored by sending first an “Init_air_quality” command followed by a “Set_baseline” command with the twobaseline values as parameters in the order as (TVOC, CO2eq). An example implementation of a generic driver for the baseline
algorithm can be found in the document SGP30_driver_integration_guide.
A new “Init_air_quality” command has to be sent after every power-up or soft reset.

Sensor Raw Signals
The command “Measure_raw_signals” is intended for part verification and testing purposes. It returns the sensor raw signals
which are used as inputs for the on-chip calibration and baseline compensation algorithms as shown in Figure 6. The
command performs a measurement to which the sensor responds with 2 data bytes (MSB first) and 1 CRC byte (see Figure9) for 2 sensor raw signals in the order H2_signal (sout_H2) and Ethanol_signal (sout_EthOH). Both signals can be used to calculate
gas concentrations c relative to a reference concentration cref by𝑠𝑟𝑒𝑓 − 𝑠𝑜𝑢𝑡ln (𝑐⁄𝑐𝑟𝑒𝑓 ) =𝑎with a = 512, sref the H2_signal or Ethanol_signal output at the reference concentration, and sout = sout_H2 or sout = sout_EthOH.

Humidity Compensation
The SGP30 features an on-chip humidity compensation for the air quality signals (CO 2eq and TVOC) and sensor raw signals(H2-signal and Ethanol_signal). To use the on-chip humidity compensation an absolute humidity value from an external
humidity sensor like the SHTxx is required. Using the “Set_humidity” command, a new humidity value can be written to the
SGP30 by sending 2 data bytes (MSB first) and 1 CRC byte. The 2 data bytes represent humidity values as a fixed-point 8.8bit
number with a minimum value of 0x0001 (=1/256 g/m3) and a maximum value of 0xFFFF (255 g/m3 + 255/256 g/m3). For
instance, sending a value of 0x0F80 corresponds to a humidity value of 15.50 g/m3 (15 g/m3 + 128/256 g/m3).
After setting a new humidity value, this value will be used by the on-chip humidity compensation algorithm until a new humidity
value is set using the “Set_humidity” command. Restarting the sensor (power-on or soft reset) or sending a value of 0x0000(= 0 g/m3) sets the humidity value used for compensation to its default value (0x0B92 = 11.57 g/m3) until a new humidity value
is sent. Sending a humidity value of 0x0000 can therefore be used to turn off the humidity compensation.

Feature Set
The SGP30 features a versioning system for the available set of measurement commands and on-chip algorithms. This socalled feature set version number can be read out by sending a “Get_feature_set_version” command. The sensor respondswith 2 data bytes (MSB first) and 1 CRC byte (see Table 9). This feature set version number is used to refer to acorresponding set of available measurement commands as listed in Table 10.
Most significant byte (MSB)
Bit

1

2
3
4
Product type
SGP30: 0

5
6
7
Reserved for
future use

Least significant byte (LSB)
8

9

0

10

11

12

13

14

15

16

Product version

Table 9 Structure of the SGP feature set number. Please note that the last 5 bits of the productversion (bits 12-16 of the LSB) are subject to change. This is used to track new features added to
the SGP multi-pixel platform.
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Measure Test
The command “Measure_test” which is included for integration and production line testing runs an on-chip self-test. In case ofa successful self-test the sensor returns the fixed data pattern 0xD400 (with correct CRC).
Feature Set

0x0020Command

Hex. CodeParameter length
including CRC [bytes]

Response length
including CRC [bytes]

Measurement
duration [ms]
Typ.

Max.

Init_air_quality

0x2003

-

-

2

10

Measure_air_quality

0x2008

-

6

10

12

Get_baseline

0x2015

-

6

10

10

Set_baseline

0x201e

6

-

10

10

Set_humidity

0x20613

1

10

Measure_test90x2032

-

3

200

220

Get_feature_set_version

0x202f-3

1

2

Measure_raw_signals

0x2050

-

6

20

25

Table 10 Measurement commands.

6.4 Soft Reset
A sensor reset can be generated using the “General Call” mode according to I2C-bus specification. It is important tounderstand that a reset generated in this way is not device specific. All devices on the same I 2C bus that support the General
Call mode will perform a reset. The appropriate command consists of two bytes and is shown in Table 11.

9 The «Measure_Test» command is intended for production line testing and verification only. It should not be used after having issued an“Init_air_quality” command. For the duration of the «Measure_Test» command, the sensor is operated in measurement mode with a supply
current as specified in Table 3. After the command, the sensor is in sleep mode.
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Hex. Code

Address byte

0x00

Second byte

0x06

Reset Command using the General Call address

0x0006
2

3

4

5

6

7

8

9

1

ACK

1

S General Call Address

2

3

4

5

6

7

Reset Command

8

9

ACK

CommandGeneral Call 2nd byte

st

General Call 1 byte

Table 11 Reset through the General Call address (Clear blocks are controlled by the microcontroller, grey blocks by the sensor.).

6.5 Get Serial ID
The readout of the serial ID register can be used to identify the chip and verify the presence of the sensor. The appropriate
command structure is shown in Table 12. After issuing the measurement command and sending the ACK Bit the sensor
needs the time tIDLE = 0.5ms to respond to the I2C read header with an ACK Bit. Hence, it is recommended to wait tIDLE =0.5ms
before issuing the read header.
The get serial ID command returns 3 words, and every word is followed by an 8-bit CRC checksum. Together the 3 words
constitute a unique serial ID with a length of 48 bits.
The ID returned with this command are represented in the big endian (or MSB first) format.

Command

Hex. CodeGet Serial ID

0x3682
4

5

6

I2C Address

7

8

9

1

W

I2C write header

2

3

4

5

6

7

8

Command MSB

9

10 11 12 13 14 15 16 17 18

Command LSB

ACK

3

ACK

S

2

ACK

1

16-bit command

Table 12 Get serial ID command.

6.6 Checksum Calculation
The 8-bit CRC checksum transmitted after each data word is generated by a CRC algorithm. Its properties are displayed inTable 13. The CRC covers the contents of the two previously transmitted data bytes. To calculate the checksum only thesetwo previously transmitted data bytes are used.
Property

Value

Name

CRC-8

Width

8 bit

Protected Dataread and/or write data

Polynomial

0x31 (x8 + x5 + x4 + 1)

Initialization

0xFF

Reflect input

False

Reflect output

False

Final XOR

0x00

ExamplesCRC (0xBEEF) = 0x92

Table 13 I2C CRC properties.
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6.7 Communication Data Sequences

Figure 9 Communication sequence for starting a measurement and reading measurement results.

7

Quality

7.1 Environmental Stability
The qualification of the SGP30 will be performed based on the JEDEC JESD47 qualification test method.

7.2 Material Contents
The device is fully RoHS and WEEE compliant, e.g., free of Pb, Cd, and Hg.

8

Device Package

SGP30 sensors are provided in a DFN (dual flat no leads) package with an outline of 2.45 × 2.45 × 0.9 mm3 and a terminal
pitch of 0.8 mm. The circular sensor opening of maximally 1.6 mm diameter is centered on the top side of the package. The
sensor chip is assembled on a Ni/Pd/Au plated copper lead frame. Sensor chip and lead frame are over-molded by a black,
epoxy-based mold compound. Please note that the side walls of the package are diced and therefore the lead frame sidewall
surfaces are not plated.

8.1 Moisture Sensitivity Level
The Moisture Sensitivity Level classification of the SGP30 is MSL1, according to IPC/JEDEC J-STD-020.

8.2 Traceability
All SGP30 sensors are laser marked for simple identification and traceability. The marking on the sensor consists of the
product name and a 4-digit, alphanumeric tracking code. This code is used by Sensirion for batch-level tracking throughout
production, calibration, and testing. Detailed tracking data can be provided upon justified request. The pin-1 location isindicated by the keyhole pattern in the light-colored central area. See Figure 10 for illustration.
S

GP

3
AX

0
89

Figure 10 Laser marking on SGP30. The pin-1 location is indicated by the keyhole pattern in thelight-colored central area. The bottom line contains a 4-digit alphanumeric tracking codewww.sensirion.com

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8.3 Package Outline
2.45

0.3x45o

0.9

0.35

1.7

2.45

0.8

0.2*

0.4

1.25

Figure 11 Package outlines drawing of the SGP30 with nominal values. Dimensions are given in
millimeters. The die pad shows a small recess in the bottom left part. * These dimensions are notwell defined and given as a reference only.

8.4 Landing PatternFigure 12 shows the PCB landing pattern. The landing pattern is understood to be the metal layer on the PCB, onto which the
DFN pads are soldered. The solder mask is understood to be the insulating layer on top of the PCB covering the copper
traces. It is recommended to design the solder mask as a Non-Solder Mask Defined (NSMD) type. For solder paste printing it
is recommended to use a laser-cut, stainless steel stencil with electro-polished trapezoidal walls and with 0.125 to 0.150 mm
stencil thickness. The length of the stencil apertures for the I/O pads should be the same as the PCB pads. However, theposition of the stencil apertures should have an offset of 0.1 mm away from the package center, as indicated in Figure 12. The
die pad aperture should cover 70 – 90 % of the die pad area, resulting in a size of about 1.05 mm x 1.5 mm.
For information on the soldering process and further recommendation on the assembly process please contact Sensirion.

Figure 12 Recommended landing pattern.

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9

Tape & Reel Package
Ø1.5 +.1 /-0.0
4.00
2.00 ±.05 SEE Note 20.30 ±.05

Ø1.00 MIN
1.75 ±.1

4.00 SEE Note 1
A

5.50 ±.05
SEE NOTE 2

R 0.2 MAX.
B0
B

12.0 +0.3/-0.1
A

R 0.25 TYP.

K0
A0

A0 = 2.75
B0 = 2.75
K0 = 1.20

SECTION A - A

TOLERANCES - UNLESSNOTED 1PL ±.2 2PL ±.10
NOTES:
1. 10 SPROCKET HOLE PITCH CUMULATIVE TOLERANCE ±0.2
2. POCKET POSITION RELATIVE TO SPROCKET HOLE MEASURED
AS TRUE POSITION OF POCKET, NOT POCKET HOLE
3. A0 AND B0 ARE CALCULATED ON A PLANE AT A DISTANCE "R"ABOVE THE BOTTOM OF THE POCKETDETAIL B

Figure 13 Technical drawing of the packaging tape with sensor orientation in tape. Header tape isto the right and trailer tape to the left on this drawing. Dimensions are given in millimeters.

10 Ordering Information
Use the part names and product numbers shown in the following table when ordering the SGP30 multi-pixel gas sensor. For
the latest product information and local distributors, visit www.sensirion.com.
Part Name

Tape & Reel Size

Product Number

SGP30, TAPE ON REEL, 2500 PCS

2500

1-101646-01

SGP30, TAPE ON REEL, 10000 PCS

10000

1-101632-01

Table 14 SGP30 ordering options

www.sensirion.com

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11 Important Notices
11.1 Warning, Personal Injury
Do not use this product as safety or emergency stop devices or in any other application where failure of the product could result in personal
injury. Do not use this product for applications other than its intended and authorized use. Before installing, handling, using or servicing thisproduct, please consult the data sheet and application notes. Failure to comply with these instructions could result in death or serious injury.
If the Buyer shall purchase or use SENSIRION products for any unintended or unauthorized application, Buyer shall defend, indemnify and hold harmless
SENSIRION and its officers, employees, subsidiaries, affiliates and distributors against all claims, costs, damages and expenses, and reasonable attorneyfees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if SENSIRION
shall be allegedly negligent with respect to the design or the manufacture of the product.

11.2 ESD Precautions
The inherent design of this component causes it to be sensitive to electrostatic discharge (ESD). To prevent ESD-induced damage and/or degradation,
take customary and statutory ESD precautions when handling this product.
See application note “ESD, Latchup and EMC” for more information.

11.3 Warranty
SENSIRION warrants solely to the original purchaser of this product for a period of 12 months (one year) from the date of delivery that this product shall beof the quality, material and workmanship defined in SENSIRION’s published specifications of the product. Within such period, if proven to be defective,
SENSIRION shall repair and/or replace this product, in SENSIRION’s discretion, free of charge to the Buyer, provided that:
notice in writing describing the defects shall be given to SENSIRION within fourteen (14) days after their appearance;such defects shall be found, to SENSIRION’s reasonable satisfaction, to have arisen from SENSIRION’s faulty design, material, or workmanship;the defective product shall be returned to SENSIRION’s factory at the Buyer’s expense; and
the warranty period for any repaired or replaced product shall be limited to the unexpired portion of the original period.
This warranty does not apply to any equipment which has not been installed and used within the specifications recommended by SENSIRION for theintended and proper use of the equipment. EXCEPT FOR THE WARRANTIES EXPRESSLY SET FORTH HEREIN, SENSIRION MAKES NO
WARRANTIES, EITHER EXPRESS OR IMPLIED, WITH RESPECT TO THE PRODUCT. ANY AND ALL WARRANTIES, INCLUDING WITHOUT
LIMITATION, WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE, ARE EXPRESSLY EXCLUDED AND DECLINED.
SENSIRION is only liable for defects of this product arising under the conditions of operation provided for in the data sheet and proper use of the goods.
SENSIRION explicitly disclaims all warranties, express or implied, for any period during which the goods are operated or stored not in accordance with thetechnical specifications.
SENSIRION does not assume any liability arising out of any application or use of any product or circuit and specifically disclaims any and all liability,
including without limitation consequential or incidental damages. All operating parameters, including without limitation recommended parameters, must be
validated for each customer’s applications by customer’s technical experts. Recommended parameters can and do vary in different applications.
SENSIRION reserves the right, without further notice, (i) to change the product specifications and/or the information in this document and (ii) to improvereliability, functions and design of this product.

Copyright © 2017 by SENSIRION.
CMOSens® is a trademark of Sensirion.
All rights reserved.

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12

Headquarters and Subsidiaries

Sensirion AG
Laubisruetistr. 50
CH-8712 Staefa ZH
Switzerland

Sensirion Inc., USA
phone: +1 312 690 5858
info-us@sensirion.com
www.sensirion.com

Sensirion Korea Co. Ltd.
phone: +82 31 337 7700~3
info-kr@sensirion.com
www.sensirion.co.kr

phone: +41 44 306 40 00
fax:+41 44 306 40 30
info@sensirion.com
www.sensirion.com

Sensirion Japan Co. Ltd.
phone: +81 3 3444 4940
info-jp@sensirion.com
www.sensirion.co.jp

Sensirion China Co. Ltd.
phone: +86 755 8252 1501
info-cn@sensirion.com
www.sensirion.com.cn

Sensirion Taiwan Co. Ltd
phone: +886 3 5506701
info@sensirion.com
www.sensirion.com

To find your local representative, please visit www.sensirion.com/distributors

www.sensirion.com

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