Abstract
deadline:
Jan.12th,
2003
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supported by:Munich
June 21-24, 2003_________________________________.
2nd Announcement / Call for Abstracts .

The organization commitee is pleased to announce thekey dates of LPM 2003 in Munich, Germany.

Deadline for paper submission will be the first day of theconference.
The proceedings will be published by SPIE.

thThe 4 International Symposium on Laser Precision
stMicrofabrication is due to take place from June 21 toth24 , 2003, at the New Trade Fair Munich, and is directly
related to the WLT conference LIM – Lasers in Manufacturing. Also, Laser 2003: World of Photonics, one of
the largest international trade shows in lasers and optics,rdthtakes place on the same ground from June 23 to 26 .

Location
The symposium will take place in Munich (München),Germany, which is well known for large trade shows as
an area of industrial concentration and, of course, for the"Oktoberfest".

Call for Abstracts and Papers

The large city with many traditional and historic buildings
is located in the south of Germany, about 150 km fromthe Alps. Whether by road, rail or air, Munich is easy toreach and offers excellent travel connections:

Abstracts for LPM 2003 are due January 12th, 2003, andshouldbesubmitted
via
theLPMwebsite(www.wlt.de/lpm2003).
Alternatively, they may be submitted by mail to WLT c/o
ILT (Steinbachstr. 15, 52074 Aachen, Germany) or to
JLPS c/o Miyamoto Laboratory (Dep. of Manufacturing
Science, Osaka University, 2-1, Yamada-Oka, Suita,Osaka, 565-0871, Japan). In any case, all abstracts
thshould arrive by January 12 , 2003.

•••

Please include details on the main author (title, name,organization address, phone, fax, e-mail) and otherauthors (title, name, organization), a short abstract title,
the abstract itself (consisting of no more than 200 words)
and up to five keywords. Please add whether you preferan oral or a poster presentation.

by air – direct flights to Munich Airport available fromnumerous international and all European cities,by rail – high-speed trains (ICE, IC and EC) travellingin all directions operating to and from Munich at hourly
and half-hourly intervals,
by road – important east-west and north-south
connections via main European highways.

Accommodation
Arrangements have been made for reduced rates forhotel rooms during LPM 2003 and, if you wish, continuing
on for Laser 2003. The hotel is conveniently locatedwithin walking distance of the fair grounds. Moreinformation on accommodations will be submitted with theregistration forms.

The notification of accepted papers is scheduled for
February 13th, 2003.

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Co-Chairs:•Information andabstract submission:••

wlt.de/lpm2003

Program Committee:• David Ashkenasi (LMTB Berlin, Germany)• Dieter Baeuerle

Topics(Johannes Kepler University Linz, Austria)

The LPM 2003 focuses on reporting and discussing
progress in the field of lasers and their applications in precision microfabrication. All laboratories and industrial
development departments active in the field of laserbased microfabrication techniques are invited to present
oral and poster contributions.

• Boris Chichkov (Laser Zentrum Hannover, Germany)• Jan Dubowski (NRC, Canada)• Friedrich Dausinger (University of Stuttgart, Germany)• Corey Dunsky (Electro Scientific Industries, USA)• Gerd Esser (Bavarian Laser Zentrum, Germany)• Arnold Gillner (Fraunhofer ILT, Germany)• Malcolm Gower (Exitech Ltd., UK)• Peter Herman (University of Toronto, Canada)• Ingolf Hertel (Max-Born Institut Berlin, Germany)• James Horwitz (Naval Research Laboratories, USA)
• Hideo Hosono (Tokyo Institute of Technology, Japan)• Willem Hoving (Philips CFT, Netherlands)• Yoshiro Ito (Nagaoka University of Technology, Japan)• Kazuyoshi Itoh (Osaka University, Japan)• Takahisa Jitsuno (Osaka University, Japan)• Vitali Konov (GPI, Russia)• C. Lee (In-Ha University, Korea)• Y. F. Lu (University of Nebraska, USA)
• Hiroshi Masuhara (Osaka University, Japan)• Johan Meijer (University of Twente, Netherlands)• Simeon Metev (BIAS, Germany)• Michel Meunier

Topics to be covered are:
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fundamentals of laser-material interaction in micro-/nanomachining
modeling and simulation
ultra-short pulsed laser processing
laser micro-drilling and -cutting
laser patterning and texturinglaser micro-welding
laser micro-forming
laser cleaninglaser annealing
surface modification
laser trimminglaser-assisted chemical processing
micro devices and systems
thin-film deposition
medical and biological applications
laser optics, new laser devices and beam deliverysystems
UV, VUV and EUV sources and applications(Ecole Polytechnique Montreal, Canada)• Hiroaki Misawa (Tokushima University, Japan)• Hiroyuki Niino (AIST, Japan)• Jyunji Nishii (AIST-Kansai, Japan)• Etsuji Ohmura (Osaka University, Japan)• Tatsuo Okada (Kyushu University, Japan)• Toshihiko Ooie (AIST-Shikoku, Japan)• Raj Patel (IMRA America, USA)• Alan Petersen (Spectra Physics, USA)
• Juergen Reif (University of Cottbus, Germany)• Uwe Stamm (XTREME Technologies GmbH, Germany)• Michael Stuke (MPI, Germany)• Vadim Veiko (St. Petersburg Institute of Fine Mechanics

Special Session on EUV Lithography
A Special Session on EUV lithography is planned. The
submission of abstracts for this special session iswelcome.

and Optics, Russia)• Rui Vilar (University of Lisbon, Portugal)• Kunihiko Washio (NEC, Japan)• Xian Fan Xu (Purdue University, USA)
• Akehito Yoshida (Matsushita Electric Industrial, Japan)

Organization
The LPM 2003 will be organized by JLPS, WLT, RIKEN
and SPIE, and in association with the WLT conference
LIM – Lasers in Manufacturing 2003.

Organizing Committee:• Zhao-Gu Cheng (SIOFM, China)• Friedrich Dausinger (University of Stuttgart, Germany)• Gerd Esser (Bavarian Laser Zentrum, Germany)• Burkhard Fechner (Lambda Physik, Japan)• Jim Fieret (Exitech Ltd., UK)

General Chair:•

Andreas Ostendorf (Laser Zentrum Hannover,Germany)
Koji Sugioka (RIKEN, Japan)
Henry Helvajian (The Aerospace Corporation, USA)

Isamu Miyamoto(Osaka University, Japan)2• Enshi Fukumitsu (Hamamatsu Photonics, Japan)• Arnold Gillner (Fraunhofer ILT, Germany)• M. H. Hong (DSI, Singapore)• Tony Hoult (Coherent Inc, USA)
• Juergen Ihlemann• David Ashkenasi

LMTB Berlin (Germany):“NIK-Engineering”• Costas Fotakis
Foundation for Research & Technology-Hellas,
Institute of Electrical Structure and Laser (Greece):(to be announced)• Richard F. Haglund Jr.
Vanderbilt University (USA):“Materials and bio tissues processing using freeelectron Lasers”• Dieter Baeuerle
Johannes-Kepler-University (Austria):“Laser nanofabrication”• Takashi Yabe
Tokyo Institute of Technology, Dep. of Energy Sciences(Japan):(to be announced)• Hiroyuki Niino
Photoreaction Control Research Center, AIST (Japan):“Surface microstructuring of transparent materials bylaser-induced backside wet etching using excimer laser”• Michael Schmidt
Bayerisches Laserzentrum gGmbH (Germany):“Laser microwelding”• B. Rethfeld
University Essen (Germany):“Theorie-energy transfer”• A.A. Maznev, K.A. Nelson
MIT, Dept. of Chemistry (USA):“Laser-induced grating”• Joerg Kickelhain
LPKF Laser & Electronics AG (Germany):“Laser structuring of 3D-PCBs”• Rene Salathe
Applied Photonics Laboratory, EPFL Lausanne(Switzerland):(to be announced)• Naohisa Matsushita
Fujitsu Ltd. (Japan):“Development of surface shape correction technology ofmagnetic head slider by laser microbending”(Laser Laboratory Goettingen, Germany)• Narumi Inoue (National Defence Academy, Japan)• Takashi Ishide (Matsushita Heavy Industry, Japan)• Shinichi Ishizaka (Japan Steel Works, Japan)• Yoshiro Ito (Nagaoka University of Technology, Japan)• Takahisa Jitsuno (Osaka University, Japan)• Teruyoshi Kadoya (Trumph, Japan)• Kazuo Kamada (Matsushita Electric Works, Japan)• Hidehiko Karasaki(Matsushita Industrial Equipment, Japan)• Kojiro Kobayashi (Osaka University, Japan)• Christian Kulik (Laser Zentrum Hannover, Germany)• William P. Latham(Air Force Research Laboratories, USA)• J. M. Lee (Samsung Electronics, Korea)• Simeon Metev (BIAS, Germany)• Iroshi Miura (Shizuoka University, Japan)• Takashi Miyoshi (Osaka University, Japan)• Sumio Nakahara (Kansai University, Japan)• Hirokuni Namba (Sumitomo Electric Industry, Japan)• Hiroyuki Niino (AIST, Japan)• Satoru Nishio (Tohoku University, Japan)• Klaus Nowitzki (OptecNet Deutschland, Germany)• Etsuji Ohmura (Osaka University, Japan)• Toshihiko Ooie (AIST-Shikoku, Japan)• Alberto Pique (Naval Research Laboratories, USA)
• Juergen Reif (University of Cottbus, Germany)• Tomokazu Sano (Osaka University, Japan)• Masaaki Tanaka (Mistubishi Electric, Japan)• Osamu Wakabayashi (Gigaphoton, Japan)• Kunihiko Washio (NEC, Japan)• Takehiro Watanabe (Chiba University, Japan)

Invited Speakers (tentative):• V. Panchenko

IPLIT-RAN, Russian Academy of Science (Russia):“New developments on laser microstructuring inRussia”• Stephen ChouPrinceton University (USA):“New laser imprint process for silicon technology”• Isabelle Riant
Alcatel CIT Corporate Research Center (France):“Laser induced index change and its application tooptical devices”• Michael Fokine
ACREO (Sweden):“Laser induced phenomena in a oxide glasses”• Peter G. Kazansky
Optoelectronics Research Centre (UK):“Micro-machining with fs laser pulses, embeddedmirrors”• Andire Mysyrowicz
Laboratoire d'Optique Appliquee (France):“Micro-machining with fs laser pulses”

Invited Speakersof Special Session (tentative):• Akira Endo

GigaPhoton Inc. (Japan):“EUV national project in Japan”• Martin Schmidt
Groupe d'Applications des Plasmas, CEADSM/DRECAM/SPAM (France):“EUV-technology in Europe”• Uwe Stamm
Xtreme Technologies (Germany):“EUV-Technology development in Germany”• Malcolm C. Gower
Exitech Ltd. (UK):“EUV-Microstepper tool”

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