21st Annual Meeting of Members
March 10, 2022

Agenda
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Call to Order
Activities of the Corporation: 21st Term in Review
Introduction to Candidates for Election by the Regular MembershipElection and BreakIt’s Not Enough to Be Smart: A User’s Perspective on Smart Process Instrumentation
and Networks
Industrial Automation 2030: A Discussion of Industry’s Next Steps
Looking Ahead to the 22nd Term
Adjourn

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2

21st Term in Review•••

Al Beydoun, President & Executive Director, ODVA
Adrienne Meyer, VP of Operations and Membership,
ODVA
Joakim Wiberg, CTO and Chair of TRB, HMS Networks

21st Term in Review•••

Overall Review of Activities• Organization and Board update• Key accomplishments• Key activities in specific regions
Membership Review• Current status• Planned updates
Technology Review

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2022 Industry Conference & 21st Annual Meeting
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4

Board and Organization Updates

Board of Directors

Dr. Rolf Birkhofer
Endress+Hauser

Mr. Jon DeSouza
HARTING

Mr. Thomas Petersen
Danfoss
General Session & Annual Meeting© 2022 ODVA, Inc.

Mr. Satoshi Kojima
OMRON

Mr. Brian Reynolds
Honeywell

Mr. David LagerstromTURCKMr. André Uhl
Schneider Electric2022 Industry Conference & 21st Annual Meeting
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Mr. Samuel Pasquier
Cisco Systems

Dr. Juergen Weinhofer
Rockwell Automation
6

Technical Review Board
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•

Mr. Raj Bandekar, Honeywell
Dr. Rudy Belliardi, Schneider Electric
Mr. Mirko Brcic, Endress+Hauser
Dr. Vivek Dave, HARTING
Mr. Paul Didier, Cisco
Mr. Gregory Majcher, Rockwell Automation
Mr. Shinji Murayama, Omron
Ms. Roxana Sudrijan, Molex
Mr. Joakim Wiberg, HMS Networks

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7Market Advisory Committee••••

ODVA’s Market Advisory Committee was established during the last term by
the Board of Directors to provide additional member input on the overall
direction of industry.
The MAC’s mission is to assess the state and future of ODVA technologies,
including their global and regional adoption and utilization. The MAC will
provide recommendations and advice to the Board.
A call for nominations was sent out to the Regular Membership in January
2021, and the Board of Directors appointed the initial slate ofrepresentatives in March 2021.
The MAC has been meeting regularly since May 2021 to review and advise
on ODVA technology growth.

General Session & Annual Meeting© 2022 ODVA, Inc.

2022 Industry Conference & 21st Annual Meeting
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8Market Advisory Committee
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Mr. Joe Bastone, Honeywell
Mr. Elango Ganesan, Cisco
Dr. Vivek Hajarnavis, Rockwell Automation
Mr. McKenzie Reed, HARTING
Mr. Ryo Shimizu, Omron
Mr. Tom Weingartner, Analog Devices
Ms. Tonya Wyatt, Micro Motion
Ms. Feiyan Zhao, Schneider Electric

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2022 Industry Conference & 21st Annual Meeting
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9

21st Term in Review
•
•
•
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Grew membership to over 365 members and welcomed HARTING as the newest
Principal Member of the association
Continued to enhance and expand ODVA’s technologies through 13 active working
groups, bringing over 80 specification enhancements in key areas like CIP Security,
Ethernet-APL, and in-cabinet and resource-constrained devices
Formed and launched the Market Advisory Committee to help advise the organization
on market trends
Promoted ODVA’s technologies at global virtual events and trade shows
Continued to grow adoption of ODVA’s technologies by offering virtual training during
the pandemic
Focused on growth in China through the standardization and translation of
EtherNet/IP to Chinese GB/T Standard

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10

21st Term in Review
•

•
•
•
•

Continued to develop support for EtherNet/IP over TSN within ODVA, withparticipation in the 60802 TSN Industrial Profile, by collaborating with industry
organizations to develop Conformance Specification for TSN Industrial Profiles, andthrough a committee of the TRB to refine the path forward
Recertified CIP Safety Volume 5 Edition 2.22 for Compliance with IEC 61784-3
Edition 4 with TÜV Rheinland.
Collaborated on device integration both with the FieldComm Group in establishingsupport for EtherNet/IP with FDI Device Package and FDI tools and with the FDTGroup in integrating EtherNet/IP with the FITS architectureContinued to expand the EtherNet/IP ecosystem to meet the needs of Industry 4.0
and IIOT through joint working groups to develop an OPC-UA companion
specification for EtherNet/IP
On-going progress to develop ODVA’s xDS next generation digital device descriptions

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11Thank you for your service to ODVA!
Congratulating on their retirement key member contributors who have been
instrumental to the success of ODVA and its technologies, including:• Kevin Knake, former chair of Roundtable• Ray Romito, original contributor to DeviceNet and many other roles• Steve Zuponcic, former chair of Distributed Motion SIG
We wish all ODVA Community members who retired this past term all the beston their next endeavors!

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12

Highlights of Key Activities:
Territory Alliance Groups (TAGs)
and Global OutreachMajor Trade Shows in Europe – Engaging Virtually•••

Hannover Messe Digital
2020 and 2021
SPS Connect 2020
ACHEMA Pulse 2021

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14

Education for Members and Vendors•••

EtherNet/IP Quick Start Training
CIP Safety Quick Start Training
Technology Update to the Membership

Special thanks to ODVA Members who have been on the training team:• Drew Baryenbruch, Real Time Automation• Chatrapathi, Utthunga• Jamie Gallant, Hilscher• Jim Grosskreuz, Rockwell Automation• Oliver Haya, Rockwell Automation• Vivek Hajarnavis, Rockwell Automation• Andreas Kramer, HMS Networks• Stefan Kraus, HMS Networks• Rob Lodesky, HMS Networks• Michael Schaffner, Rockwell Automation
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15

TAG China
•

•
•
•

CEC forum

September, 2020
200+ attendees
Interview

16

TAG China•

Automation seminar
Online promotion on
www.gongkong.com• Technical Blog
• Seminar Video• Q&A• Members’ interaction

17

TAG Japan•ODVA College 2020 Online[WEB page]

Event nameODVA College 2020 Online

Date / Number of participants
Nov 17 th,2020 Mar 16 th, 2021

Event name185

Date / Number ofparticipants

Implementer
SeminarDec 10th, 2020

29

Network
SeminarDec 4th, 2020

32

Implementer
SeminarFeb 4th, 2021

28

Implementer
SeminarFeb 5th, 2021

24

18

TAG Japan•IIFES 2022
[Real Exhibition]
Booth design thatwas planned to be
exhibited[Online Exhibition]

Event nameIIFES 2022 Real
Online1.ODVA activity introduction

Date / Number of page accesses

Jan 26 th - 28 th, 2022

Cancel641

Jan 26 th - Feb 25 th, 2022

2. EtherNet/IP product introduction 3.CIP Safety/CIP Security

19

TAG Japan•

Demonstration machine renewal– TAG Japan members have newly created "self-supporting mobile demo machines" foreach of the five categories.
– The created demonstration machine will be used in future TAG Japan exhibitions andseminars.

【DLR(Device Level Ring)】(W900xH800mm)

 Introducing the redundant system
configuration by DLR.
 Introducing connectivity with IOLink and remote maintenance.

【Multi Vendor】(W700xH600mm)

 Introducing the openness andabundant product lineup of
EtherNet/IP.

【Embedded for device
development】(W700xH600mm)

 Introducing embedded
devices that develop
EtherNet/IP devices.

【CIP Safety】(W700xH600mm)

 Introducing CIP Safety on
EtherNet/IP.

【Quick Connect】(W700xH600mm)

 Introducing high-speed
switching by the Quick
Connect function of
EtherNet/IP.
20

TAG Korea•

During the pandemic period (2020-2021), six Korean main magazine
companies published ODVA activity status monthly[1.ELECTRONICSCIENCE]•[2.MMOACI][3.ICN][4.CONTROL][5.CIT][6.AUTOMATION SYSTEMS]

From January 2020 to December 2021, the total number of technology
magazines that printed ODVA's promotional articles was 77 total issues.

21Membership Update

Growth over the 21st Term•

ODVA made progress in a virtual world– Membership grew by over 3.5%, andinterest in membership continues to be
solid– EtherNet/IP adoption increased over 90
new vendor IDs issued

Membership Level on
December 31, 2021

Number of Members

Principal

7

Regular

195

Associate165

Mix of Membership by Membership Class, as of December 31, 2021
23

Growth over the 21st Term
Country

Number ofMembers

United States146

UK and Ireland

14

Germany

62

Europe Other

43

Japan

50

Korea

14

China

14

Canada

11

Other

13

Mix of Membership by Principal Place of Business, as of December 31, 2021
24

Growth over the 21st Term•

ODVA made progress in a virtual world– First ever ODVA Member Survey was launched, and responses from members havehelped shape activities, including:
•
•
•
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•
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•
•

Market Advisory Committee was developed, approved, and launched
Vendor training events were offered for free and expanded
A virtual technology development update was organized to allow the TRB and SIG to keep
members informed and engaged
Members now receive the ODVA ToolBox for EtherNet/IP integrated learning environment freewith membership
Members received additional free listings on marketplace.odva.org to promote their products
EtherNet/IP and CIP Safety vendor education was expanded, and development of a CIP
Security course has begun
Test policy issues and solutions under review to ensure clear, consistent, and equitableapplications of tests
Expanded marketing reach to end users via new videos, advertising, and social media posts
25

Looking to the Future
Our focus for the 22nd term
– Expand information and education for members• Continue work to develop an online knowledgebase for vendors• Continue development of additional training and educational tools, including a focus on
hands-on training and deep technology dives• Expand language access of www.odva.org– Streamline processes for easier and better access by members• Select and integrate new customer management systems to ensure that members
receive accurate and prompt information with ease of access• Finalize review and create clear actions on test policies and procedures– Continue to expand ODVA Community opportunities and input• Investigate how ODVA can further support product development• Expand co-education, marketing, and member participation roles
26

Technology Review

SIG Work Summary•••

A total of 80 SEs and TDEs
Two publication cycles in 2020Three publication cycles in 2021 – extra to incorporate Ethernet-APL content•

A total of 27 volume revisions
–
–
–
–
–
–
–
–
–
–
–

Vol 1 – 4
Vol 2 – 4
Vol 3 – 1
Vol 4 – 1
Vol 5 – 3
Vol 6 – 1
Vol 7A – 1
Vol 7B – 1
Vol 7C – 2
Vol 8 – 4
Vol 9 – 3

TRB and SIG Updates© 2022 ODVA, Inc.

2022 Industry Conference & 21st Annual Meeting
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28

Key Accomplishments since last Annual Meeting•

Constrained EtherNet/IP devices––––

Protocol definitions for EtherNet/IP and CIP Security
Drives down the cost for end nodes
Foundation for the in-cabinet use case
EtherNet/IP down to the smallest devices• Profiles for push button and pilot light devices– Core technology for IIoT infrastructure• With CIP Routers the smallest sensors may be modeled• Together with the OPC UA Companion Specification for CIP an ideal vertical datatransport

TRB and SIG Updates© 2022 ODVA, Inc.

2022 Industry Conference & 21st Annual Meeting
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29

Key Accomplishments since last Annual Meeting•

OPC UA– Supporting the OPC Foundation Joint Workgroup for OPC Companion
Specification to the Common Industrial Protocol– Identity Object Alignment with OPC• Adds additional attributes to support additional properties of OPC Part 100: Devices

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2022 Industry Conference & 21st Annual Meeting
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30

Key Accomplishments since last Annual Meeting•

EtherNet/IP in Process Automation– Ethernet-APL support added to Volume 2, Chapter 8 specification– Device Type Revision• Provides a common way to report a revision for a Device Type/Profile definition

TRB and SIG Updates© 2022 ODVA, Inc.

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31

Key Accomplishments since last Annual Meeting•

Project xDS– Requirements analysis and proposals for key components••••

Conformance Information
Parameter Dependencies
Cybersecurity
Artifact Packaging– AutomationML Investigation• Sample AML models of xDS reference devices created

TRB and SIG Updates© 2022 ODVA, Inc.

2022 Industry Conference & 21st Annual Meeting
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32

Key Accomplishments since last Annual Meeting•

CIP Safety– Recertification of CIP Safety Volume 5 Edition 2.22 for Compliance with IEC
61784-3 Edition 4 by TÜV was completed

TRB and SIG Updates© 2022 ODVA, Inc.

2022 Industry Conference & 21st Annual Meeting
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33

Key Accomplishments since last Annual Meeting•

Time Sensitive Networking– High level approach for EtherNet/IP + TSN completed• Document major technical aspects and decision points• Define work packages for SIGs

– Early draft for 802.1AS-2020 as an optional Time Profile for CIP Sync
Object

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2022 Industry Conference & 21st Annual Meeting
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34

Key Accomplishments since last Annual Meeting•

Conformance– Developed detailed test plan for originator interoperability– Conformance Testware is up-to-date with 2021 PC2 CIP Networks Library

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35

Key Planned Activities for Next Term•

EtherNet/IP––––

Start looking at IPv6 - again
General purpose use of SPE
Gigabit Ethernet Physical Layer
Time Sensitive Networking• Synchronize with IEC/IEEE 60802 TSN Profile for Industrial Automation• Start developing specification material

TRB and SIG Updates© 2022 ODVA, Inc.

2022 Industry Conference & 21st Annual Meeting
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36

Key Planned Activities for Next Term•

Project xDS– Begin develop material for the formal specification– Continue development of an EZ-xDS prototype

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37

Key Planned Activities for Next Term•

OPC UA– Continue assist OPC Foundation JWG developing the OPC Companion
Specification for CIP– Seamless mapping of CIP data

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2022 Industry Conference & 21st Annual Meeting
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38

It’s Not Enough to be Smart
A User’s Perspective on Smart Process
Instrumentation and Networks
Paul R. Maurath
The Procter & Gamble Company

Brief Resume•••

B.S. / Ph.D. in Chemical
Engineering
36 years with Procter & Gamble
Focus areas– Process automation and control– Control loop performance andtuning– Process instrumentation– Community manager of the internal
P&G automation and control global
community.

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40

Today’s Process Instrumentation “Network”•

Conventional I/O dominates•••

Discrete devices are simple ON/Off
HART is broadly available for analog devices but not highly leveraged
Ethernet is becoming more important•– Highly distributed– Ethernet backbone– Backbone of Remote I/O– Drives of all kinds– Complex / multivariable instruments• Coriolis flowmeters• pH transmitters

Typically on an isolated private network (192.168.1.xxx)

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41

PI Network Example

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42

Business and Technical Drivers••“Smarter” devices with more data
to shareMore systems want that data

•

–
–
–
–

– Maintenance– Data Analytics•

Continued penetration of Ethernet
farther down in the architecture

Key process industry needs havenot been met by mainstream IT
Ethernet technologies.

•

Multi-conductor fragile wiring
Long distance wiring (not fiber)
Loop powered devices
Electrically classified areas

New networking technologies– Advanced Physical Layer (APL)– IO Link

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43

Advanced Physical Layer (Ethernet-APL)
Emerging Single Pair Ethernet / 2-Wire Intrinsically Safe Ethernet Standard forProcess Automation Protocols

Process Industry Requirements
for Ethernet field devices• Twisted pair cabling• Deployable in electricallyclassified / hazardous areas• Reaching long distances• Easy to handle technology• Connectors for harshconditions• Loop-powered devices
General Session & Annual Meeting© 2022 ODVA, Inc.

Ethernet-APL is a 2-wire Ethernet(Physical Layer) for process
automation, based on• IEEE 802.3cg-2019, 10BASE-T1L• IEC standards (IEC60079,
IEC61158)• Communication protocol
independent

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44

Advanced Physical Layer (Ethernet-APL)
Possible Architecture

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45

P&G APL Demonstration Learning Objectives

1. Gain an understanding of the knowledge and skills required to implement andmaintain APL
2. Assess the potential benefits of APL for P&G

•
•
•
•

Basic installation and wiring ofswitches and instruments.
Instrument configuration andreplacement
Network and switch
configuration and management
Interoperability between
switches and instruments frommultiple vendors

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2022 Industry Conference & 21st Annual Meeting
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•
•
•
•

Instrument update rates andimpact of faster communications
vs. HART
Access to multiple variables anddiagnostic information
Potential impact of higher power
availability – conversion of 4wire devices to 2-wire
Functional comparison of APL
vs. other communications suchas 4-20 mA HART, IO-Link
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46

Smart Process Cell – “SPC”••

Located at P&G Corporate
Engineering Technology Lab(CETL) in West Chester, OH
Process Equipment– Four tank (500 kg and 375 kg)– Six pumps with flowmeters– Continuous and batch
operations (3 units)••

Process Fluid – water
Fully self-contained andremotely operated

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47

The SPC Automation Network (December 2019)

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48

The SPC Today

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49

Our APL Results – APL Works!

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50

Initial Benchtop Tests
Using EtherNet/IP

Largest barrier was assigning IP
addresses
Three devices were “bricked” and had
to be returned to their suppliers
Communications established with ourcontroller after importing EDS files
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51

Field Tests on the SPC
Straightforward wiring
Replaced existing 4-20 mA / HART
instruments
APL was completely “invisible” to thecontroller
Devices looked like any other
EtherNet/IP device
Parallel testing of multiple IO Link
devices.
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52

The SPC Today

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P&G APL Demonstration Learning Objectives

1. Gain an understanding of the knowledge and skills required to implement andmaintain APL
2. Assess the potential benefits of APL for P&G

•
•
•
•

Basic installation and wiring ofswitches and instruments.
Instrument configuration andreplacement
Network and switch
configuration and management
Interoperability between
switches and instruments frommultiple vendors

General Session & Annual Meeting© 2022 ODVA, Inc.

2022 Industry Conference & 21st Annual Meeting
All rights reserved.

•
•
•
•

Instrument update rates andimpact of faster communications
vs. HART
Access to multiple variables anddiagnostic information
Potential impact of higher power
availability – conversion of 4wire devices to 2-wire
Functional comparison of APL
vs. other communications suchas
4-20 mA HART, IO-Link
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54

What Do Users Need?

Hand tools

BootP

DVM
HART Communicator
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EDS Profiles
Data Model
DHCP
Firmware Rev
IODD

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55

The World of Logitech Mice for Windows

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57

Replacing a Mouse
The user . . .

Windows . . .

Removes old mouse
Connects new mouse
Wait
Uses new mouse
General Session & Annual Meeting© 2022 ODVA, Inc.

Loses connection to old device
Sees a new “pointing device”• Finds an appropriate driver, using the
network connection if it needs to.

Installs the new driver
Tells you it’s done.

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58

Replacing a Mouse
The user . . .

Windows . . .

Removes old mouse
Connects new mouse
Wait
Uses new mouse,
but no emojis.
General Session & Annual Meeting© 2022 ODVA, Inc.

Loses connection to old device
Sees a new “pointing device”• Finds an appropriate driver, using the
network connection if it needs to.

Installs the new driver
Tells you it’s done.

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59

Replacing a Gaming Mouse
The user . . .

Windows . . .
Removes old mouse

Connects new mouse

Loses connection to old device
Sees a new “pointing device”• Finds an appropriate driver, using the
network connection if it needs to.

Wait

Uses new mouse, but
lost 15 button configurations
General Session & Annual Meeting© 2022 ODVA, Inc.

Installs the new driver
Tells you it’s done.

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60

Replacing a 4-20mA HART Pressure TransmitterIn the application / controller . . .

In the field
Remove oldtransmitter
Connect newtransmitter
Configure the range in
the new transmitter

Loses connection to old device
Valid connection to a new device
Check scaling
Valid signal

It probably works.
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61

Replacing A Smart Device (EtherNet/IP, IO Link, etc)
In the field

In the application / controller . . .
Remove oldtransmitter
Connect newtransmitter

Loses connection to old device
Does the new device communicate?
• New configuration file?
• Do I have to restart/reload the controller?

Configurecommunications

Is the data structure the same?

Does it work?

How long will it take to get back up?

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• Do I have to change application code?

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62

Where Do Users Need Help With Smart Devices
Communications•

IP Address Assignment
–
–
–
–

•
•

DHCP, BootP
Local displays
Dip switches
Selector wheels

Switch port based DHCP ?
Watch out for assumptions– 192.168.1.x– 10.10.x.x– ????

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63

Where Do Users Need Help With Smart Devices
Integration and Compatibility•

Configuration Files / Drivers– EDS files– IODD files•

Easy replacement of “like for like”
devices– Temperature– Pressure– Switches

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What skills will beneeded to troubleshootand repair our smart
systems?

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64

Where Do Users Need Help With Smart Devices
Configuration Confusion
How many ways are there to change theconfiguration of a smart process transmitter?
• Local display• Field communicator• Controller programming software• Asset management system• Web interface

Do they all show the same information?
Who has the “Master Copy”?
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65

Future Networks and Architectures?
•
•
•

•

Cloud
Less
controllercentric?
Different
protocols
Users willneedstandards

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66

Conclusions•••

Standards are great!
Please put the end users front and center when creating and managing
standards.
New technologies need to deliver functionality and simplicity.

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67Thank you for your attention

Industrial Automation 2030
A Discussion of Industry’s Next StepsMarch 10, 2022
Harry Forbes

Research Director
ARC Advisory Group
HForbes@ARCweb.com

Agenda•Why so slow?

•

The view of one leading, large (and pesky) manufacturer•

What is it that the automation industry not seeing?

•

The shape of (automation) things to come•“Would you like TSN with that?”

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70Agenda•Why so slow?

•

The view of one leading, large (and pesky) manufacturer•

What is it that the automation industry not seeing?

•

The shape of (automation) things to come•“Would you like TSN with that?”

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71

Innovation Cycles in Automation
Automation Architecture ca. 1995…

• Robust IPC and operator panel hardware
on machines (harsh environment)• Distributed throughout the plant – highmaintenance costs, many dissimilarsystems• Each IPC and panel uses its own database– “multiple versions of the truth”

VISION, EXPERIENCE, ANSWERS FOR INDUSTRY, INFRASTRUCTURE & CITIES© ARC Advisory Group • 72

Innovation Cycles in Automation
Automation architecture today…

• Robust IPC and operator panel hardware
on machines (harsh environment)• Distributed throughout the plant – highmaintenance costs, many dissimilarsystems• Each IPC and panel uses its own database– “multiple versions of the truth”

VISION, EXPERIENCE, ANSWERS FOR INDUSTRY, INFRASTRUCTURE & CITIES© ARC Advisory Group • 73

Speed of Innovation in Industry

VISION, EXPERIENCE, ANSWERS FOR INDUSTRY, INFRASTRUCTURE & CITIES© ARC Advisory Group • 74

• Why so slow?

 Cost of downtime and failure are high Reluctant players
 Long equipment lifecycles
 Certifications
 Lack of global standards
 ...

VISION, EXPERIENCE, ANSWERS FOR INDUSTRY, INFRASTRUCTURE & CITIES© ARC Advisory Group • 75

Why so slow?
• Cost of downtime and failures

 Cost of unplanned downtime can be $millions/hour
 Equipment failure can harm people, environment and equipment• Reluctant players• Long Equipment Lifecycles

 Equipment is installed for 2 to 40 years
 During this period end users need:•••support/maintenancespare parts
compatibility• Certifications

 Necessary, but…
 Barrier to entry/protection of status quo Markets are highly competitive Certification processes are long, specialized, and expensive

Age of Equipment

 Automation companies: protective strategies (“proprietary-open”), need to cater all clients
 Machine builders: Small R&D teams, typical innovation cycles ~10 years, cost of equipment is critical EPCs: competence and pressure in projects, but little involvement in plant operations
 End users: care about costs over lifecycle, “need to run”
Lifecycle of Equipment
15%
10%
5%
0%

30 28 26 24 22 20 18 16 14 12 10 8

6

4

2

0

Years

• Lack of global standards

 Promotes “walled garden” product and business strategies Lack of scale and market fragmentation hampers innovation
VISION, EXPERIENCE, ANSWERS FOR INDUSTRY, INFRASTRUCTURE & CITIES© ARC Advisory Group • 76

Innovation Cycles in Automation
1995• Windows 95
introduced• PCs used in
production
environment

2000

2010

• Big Boom in
automation• PLCs become PACs
• IPCs increasingly used
• Ended by 2007/2009
financial crisis• Governments push
manufacturing(Industrie 4.0)
• Cloud platforms
introduced• Predix, Mindsphere,
AWS, Azure• Network
infrastructure basedon Ethernet

2020
•
•
•

Data models from plant
to officeContainerized
deployment of industry
softwareNew automationarchitectures challenge
Old Guard

IT / OT Convergence: use of technologies and concepts from IT in OT
VISION, EXPERIENCE, ANSWERS FOR INDUSTRY, INFRASTRUCTURE & CITIES© ARC Advisory Group • 77

Some End User Comments• “We are afraid that any new technology will just add complexity to our production.”• “We need to have a clear business case when we want to implement something new, inorder to get the approval from management.”• “We need clear and measurable KPIs for any new technology we introduce.”• “I buy only proven technology from market leaders, so I do nothing wrong.”• “We test for years to know how they behave in our industry.”• “We have the capabilities to just set up our own data center and do everythingourselves; we have the economies of scale.”• “Once installed, we do everything to keep the system running.”
VISION, EXPERIENCE, ANSWERS FOR INDUSTRY, INFRASTRUCTURE & CITIES© ARC Advisory Group • 78

Agenda•Why so slow?

•

The view of one leading, large (and pesky) manufacturer•

What is it that the automation industry not seeing?

•

The shape of (automation) things to come•“Would you like TSN with that?”

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79

A Different End User Comment

If I need a specific function...
Today:
I buya box thatprovides it.

ControlPC

FirewallSwitchLayer 2

SwitchLayer 3

PLC

Plant PC

Future:I buysoftware thatprovides it.

(I already have the box
because it is a standard
part.)

Process device

Industrial
PC

Process device

AUDI AGARC Industry Forum, 2020
VISION, EXPERIENCE, ANSWERS FOR INDUSTRY, INFRASTRUCTURE & CITIES© ARC Advisory Group • 80

From the same automotive manufacturing executive“Why do we need a virtualized/containerized software environment?
Because of the maintenance costs we have now in our factories.
As I said, [we have] 45,000 IPCs. Now imagine you want to do to an operating
system upgrade on 45,000 IPCs, which you cannot do remotely because every
single one of them has very specific tasks.
You must walk to each particular IPC. You have to do the upgrade. You have topray that the drivers still work for that specific task. Then move on to the next
IPC.
It’s an incredible amount of money we’re spending on doing this,and these upgrades won’t go away.”

VISION, EXPERIENCE, ANSWERS FOR INDUSTRY, INFRASTRUCTURE & CITIES© ARC Advisory Group • 81

Automation Paradigm Shift

Data Center

Data Center

Shop Floor
HardwareShop Floor HW
Shop Floor Function

Field IO

Specific

Universal

Field IOVISION, EXPERIENCE, ANSWERS FOR INDUSTRY, INFRASTRUCTURE & CITIESAudi AGARC Industry Forum, 2020

© ARC Advisory Group • 82

Here is what Audi envisions (in ARC’s opinion)• Thin, open source orchestration layer Provides for self-updates
 Provides for virtualization
 Has a public API for orchestration• Supports all types of applications

 Guest RTOS
 VMs
 Containerized apps
 Lightweight Kubernetes implementations

VISION, EXPERIENCE, ANSWERS FOR INDUSTRY, INFRASTRUCTURE & CITIES© ARC Advisory Group • 83

Agenda•Why so slow?

•

The view of one leading, large (and pesky) manufacturer•

What is it that the automation industry not seeing?

•

The shape of (automation) things to come•“Would you like TSN with that?”

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84

What is missing from this viewpoint? The Linux Foundation• Software is eating the world, but…

 Open Source software is eating the software world• Today’s enterprise IT products are built on a foundation of Open Source projects
 Linux
 Docker (containers are made usable for normal people)
 Kubernetes (delivers containerized, reliable, scalable, distributed systems)
 Yocto, and many, many others…

• The Good News

 The Linux Foundation is dominating this landscape The Linux Foundation is delivering huge resources to open source software developers• The Bad News

 The Linux Foundation has so much influence that they “pick winners and losers”
 Major IT firms govern the Linux Foundation
VISION, EXPERIENCE, ANSWERS FOR INDUSTRY, INFRASTRUCTURE & CITIES© ARC Advisory Group • 85

The Linux Foundation – The Open Source Software Juggernaut• An Open Source Software “Borg”• $200 million/year revenue 200 headcount Only 2 developers on salary…
 Software Development work is done pro bono

• Governance:

By ALL IT leaders dand Hyperscalers• Shared expert services for OSS projects…
including legal services• “Up or Out” model for project maturity• Far more resources/influence than any competition
 Eclipse Foundation
 Apache Software Foundation

VISION, EXPERIENCE, ANSWERS FOR INDUSTRY, INFRASTRUCTURE & CITIES© ARC Advisory Group • 86

Where Linux Foundation Operates

VISION, EXPERIENCE, ANSWERS FOR INDUSTRY, INFRASTRUCTURE & CITIES© ARC Advisory Group • 87

Linux Foundation Component Projects for 5G

VISION, EXPERIENCE, ANSWERS FOR INDUSTRY, INFRASTRUCTURE & CITIES© ARC Advisory Group • 88

Linux Foundation Platinum and Gold Members

VISION, EXPERIENCE, ANSWERS FOR INDUSTRY, INFRASTRUCTURE & CITIES© ARC Advisory Group • 89

Issues with Open Source Software / Linux Foundation• Maintainer human resources Lack of activity/support for legacy
can be a major problem• Plethora of projects• Redundancy of projects

 Difficult to merge or terminate
 LF is not nearly as ruthless as VCs• Governance:

Influence of major IT firms

 vs. the traditional OSS developer culture• and…
• Automation firms, IE consortiums simply
do not comprehend any OSS businessmodel Is this a legacy of their hardware-oriented orsoftware licensing
business model?

VISION, EXPERIENCE, ANSWERS FOR INDUSTRY, INFRASTRUCTURE & CITIES© ARC Advisory Group • 90

Agenda•Why so slow?

•

The view of one leading, large (and pesky) manufacturer•

What is it that the automation industry not seeing?

•

The shape of (automation) things to come•“Would you like TSN with that?”

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The Shape of the Industrial Edge to Come!
Hyper-Converged Infrastructure (HCI)HCI: software-defined infrastructure that virtualizes all elements of conventional "hardware-defined"
systems.

• Virtualized computing• Software-defined storage• Virtualized networking (software-defined network)
This would require:• Virtualize real-time control (soft PLC)
• Virtualize industry software (MES, HMI, historian, analytics)• Virtualize industrial networks
Benefits• Simplicity: Eliminate complexity of managing different hardware components and infrastructure silos.
• Cost: Reduce capital hardware investments, improve cost and storage efficiency, leverage existing in-house technicalexpertise. Runs on commercial off-the-shelf servers.

• Agility: No vendor lock-in, on-demand scalability, support for legacy and modern applications
VISION, EXPERIENCE, ANSWERS FOR INDUSTRY, INFRASTRUCTURE & CITIES© ARC Advisory Group • 92

Product Examples: The Shape of the Industrial Edge to Come!
• Emerson (former GE Intelligent Platforms)• Bosch Rexroth• Rockwell• Beckhoff: Among the first movers
 Connection to GE Predix platform One Hypervised CPU
 PTC investment/alliance Investments in startup firm Zededa• Siemens

 CtrlX announced @ 2019 SMS
 New concept, new strategy
 Deep partnership with Canonical for Ubuntu(s) Partnership with AWS• TTTech 2021 acquisition of Nebbiolo, “Nerve” platform Integrated module for S7-1500
 Sinumerik Edge –extra module Pixeom acquisition• IPC focused suppliers (Advantech, Kontron) PLCnext - shift in portfolio strategy• Startups, startups, startups• Phoenix Contact:

 Leverage open HW to enable edge control
 Push CPU power in networks and distributed HW
 Most will be acquired

Edge controllers are either a clean break with or a careful expansionof supplier portfolio.
VISION, EXPERIENCE, ANSWERS FOR INDUSTRY, INFRASTRUCTURE & CITIES© ARC Advisory Group • 94

Agenda•Why so slow?

•

The view of one leading, large (and pesky) manufacturer•

What is it that the automation industry not seeing?

•

The shape of (automation) things to come•“Would you like TSN with that?”

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2022 Industry Conference & 21st Annual Meeting
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Do we need TSN to do this?

• It depends…
• If the real-time domain is limited

to one box and one I/O network,
then probably “no”

• Otherwise, probably “yes”

VISION, EXPERIENCE, ANSWERS FOR INDUSTRY, INFRASTRUCTURE & CITIES© ARC Advisory Group • 96

Dates in the Fieldbus Wars

VISION, EXPERIENCE, ANSWERS FOR INDUSTRY, INFRASTRUCTURE & CITIES© ARC Advisory Group • 97

Classification of Real-time Ethernet

VISION, EXPERIENCE, ANSWERS FOR INDUSTRY, INFRASTRUCTURE & CITIES© ARC Advisory Group • 98

List of TSN IEEE 802.x Standardization Projects

VISION, EXPERIENCE, ANSWERS FOR INDUSTRY, INFRASTRUCTURE & CITIES© ARC Advisory Group • 99

TSN Profiles and Classes of Industrial Network Traffic

VISION, EXPERIENCE, ANSWERS FOR INDUSTRY, INFRASTRUCTURE & CITIES© ARC Advisory Group • 100

Summary• Change in automation technology is slow for many reasons

 Some of them are good reasons• End users want to move to a standardized and manageable hw/sw platform But…this will need to include Open Source software• OSS is dominating software and the Linux Foundation is dominating OSS
 So watch out!
• The Automation industry does not have IT-like OSS business models
 …and denial is not a long-term strategy• TSN is very difficult
 Broad applicability across many industries
 Impact on many existing standards
 “Things take time”

VISION, EXPERIENCE, ANSWERS FOR INDUSTRY, INFRASTRUCTURE & CITIES© ARC Advisory Group • 101

Reference/Figure Credit• TSN Figures: Fedullo, T.; Morato, A.; Tramarin, F.; Rovati, L.; Vitturi, S. A Comprehensive Review on Time Sensitive

Networks with a Special Focus on Its Applicability to Industrial Smart and Distributed Measurement Systems. Sensors
2022, 22, 1638. https://doi.org/10.3390/s22041638

VISION, EXPERIENCE, ANSWERS FOR INDUSTRY, INFRASTRUCTURE & CITIES© ARC Advisory Group • 102

Thank you!
Harry Forbes
Research Director
ARC Advisory Group
HForbes@ARCweb.com

Looking Ahead to the 22nd Term•

Al Beydoun, President & Executive Director

Leadership in the 22nd Term
Board of Directors• Dr. Rolf Birkhofer• Mr. Jon DeSouza• Mr. Satoshi Kojima• Mr. David Lagerstrom• Mr. Davis Mathews• Mr. Samuel Pasquier• Mr. Thomas Petersen• Mr. Brian Reynolds• Mr. André Uhl• Dr. Jürgen Weinhofer

Technical Review Board• Mr. Raj Bandekar• Dr. Rudy Belliardi• Mr. Torben Bertelsen• Mr. Mirko Brcic• Dr. Vivek Dave• Mr. Paul Didier• Mr. Gregory Majcher• Mr. Kai Michel• Mr. Shinji Murayama• Mr. Joakim Wiberg

Market Advisory Committee• Mr. Joe Bastone• Mr. Elango Ganesan• Dr. Vivek Hajarnavis• Mr. Magnus Jansson• Mr. McKenzie Reed
• Mr. Ryo Shimizu• Ms. Tonya Wyatt• Ms. Feiyan Zhao

106

Looking Ahead to the 22nd Term
•
•
•
•
•
•
•
•
•
•

Continue to expand the EtherNet/IP ecosystem and support of Industry 4.0 and IIoT initiatives
Continue to grow our membership and adoption of CIP technologies through training, tools
development, marketing initiatives, and promotions
Continue to monitor emerging technologies in Industrial Automation working with the Market
Advisory Committee for integration into ODVA technologies
Collaborate with other organizations to expand and address the challenges of tomorrow inareas such as Security, TSN, Energy Management, Ethernet-APL maintenance, and more
Align our marketing and communication globally working with the TAGs
Continue adaptation of EtherNet/IP to the Process Industries: Establish conformancecertification for Ethernet-APL, and collaborate with industry organizations on Device
Information Models and Profiles
Develop specifications for xDS digital device description
Complete the translation of EtherNet/IP to GB/T Standard for China market
Collaborate with industry organizations to develop TSN Industrial Automation Conformance
specifications
And as always, continue to engage with the membership to understand and support theirneeds

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Be a Part of the ODVA Community!
Working Groups are Calling:• CIP System Architecture – Configuration data, message router fragmentation
service• EtherNet/IP System Architecture – TLS 1.3 support, CIP Authorization Profile,IPv6• EtherNet/IP Infrastructure – LLDP, TSN, SPE• EtherNet/IP Physical Layer – Gigabit, TSN, SPE guidance, PoE, PoDL,
Wireless• CIP Safety – safety concurrent connections• Distributed Motion and Time Synchronization – CIP Sync over DLR• xDS Digital Device Descriptions – Create specification and prototypes• Common Industrial Cloud Interface – OPC UA companion specification• EtherNet/IP In Process Industries – Device profiles for process industries• Conformance – Continued test improvement
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THANK YOU!