Medium-Term Business Plan: FV26
(Period: 2024-2026)© 2024 Micronics Japan Co., Ltd.

Disclaimer
The contents of this presentation were compiled based on
information readily available at the time of this presentation.
Outlooks and other forward-looking statements are subject tochange based on many uncertain worldwide factors including but
not limited to market conditions, competition as well as
semiconductor / LCD industry trends. Accordingly, please take
Note that the actual performance of the Company may varyconsiderably from the information and statements made in thispresentation.

© 2024 Micronics Japan Co., Ltd.

1Table of Contents
1. Review the MJC Future Vision
2. Future Prospect for the Probe Card Market
3. Key Performance Indicators
4. Probe Card Business5. TE Business6. Initiatives for Growth (Capital Expenditure)
7. Initiatives for Growth (Research & Development)
8. Addressing Societal Issues and Advancing Productivity© 2024 Micronics Japan Co., Ltd.

2

Review the MJC Future Vision•

In fiscal 2022, we achieved 12% market share in the probe card industry, and with the growth of the market, both our sales and operating income reachedunprecedented levels.

•The DRAM probe card business has achieved an overwhelming No. 1 market share and demonstrated a gap of approximately twice the size compared to theNo. 2 player.

•The NAND segment, sales revenue increased as the market expanded; however, there was a decrease in market share due to factors such as customer
investment rebalancing.

•The non-memory (logic) probe card business fell short of reaching the target revenue composition ratio of 40%. However, efforts were made to establish aconcentrated approach towards advanced probe cards, including discontinuation of domestic cantilever probe card production.
The TE business, we are concentrating our resources on the semiconductor inspection division and focusing on the development of new products.

The Trend in Revenue andThe Trend in PC Market Revenue

Operating Profit Marginand Market Share

5044

45

40

4040Revenue

35（billion yen）

•30

28

3040%

28
20.6%

20%
6.9%

5.2%

10%

8%

50%

0FY2017

FY2018Operating31%
Overall marketin 2017$1.557B
MJC
5%Profit Margin

10.6%
5.3%

Other

20.8%

2015Revenue
30%

25

1050%

FY2019FY2020

FY2021

29%

13%

12%

23%

Other30%
Overall market
in 2017$2.541B
5%
6%

23%
MJC
12%

FY202215-month fiscal year

© 2024 Micronics Japan Co., Ltd.

（Our company has created based on data from TechInsights）

3

Future Prospects for the Probe Card Market
From 2024 onwards, the probe card market is anticipated to experience.

•a growth rate higher than that of the semiconductor manufacturing equipment market.
We anticipate an increased demand for probe cards, driven by the expansion and enhanced functionality of semiconductor devices•

which result in extended testing durations.
•The proliferation of semiconductor devices integrated with chiplets has led to the emergence of new needs for wafer testing.

•We expect a continued demand for the development of high-performance probe cards due to the advancements in integration, speed,and energy efficiency of semiconductor devices.
1.3

1.3

Wafer Fab Equipment
market

1.2

1.1

1.0

0.9

0.8

Market Size in 2022
Wafer Fab Equipment: $100.6
billion USD

0.7
2022 2023 2024 2025 2026 2027
The graph was created by our company based on data calculated from Gartner Research.
Source: Gartner®, Forecast: Semiconductor Capital Spending, Wafer Fab Equipment andCapacity, Worldwide, 2Q23 Update, Bob Johnson et al., 4 July 2023.
Semiconductor Manufacturing Equipment Market, Total Wafer Fab Equipment.

Growth Index (Based on 2022）

Growth Index (Based on 2022)

1.2

probe card market

1.1

The advancement of AI technologies and the subsequent expansion of1.0

data center demands.
KGD

0.9

KGD

0.8

Market Size in 2022
Probe Card: $2.6 billion USD

KGD

0.72022 2023 2024 2025 2026 2027
Source:Probe Card Market: Our Company's Proprietary ForecastDieDieChipletDieDieDieDie
Die

Chiplet integration

Wafer Test

The increasing adoption of semiconductor devices integrated with chiplets.

GARTNER is a registered trademark and service mark of Gartner Inc. and/or its affiliates inthe U.S. and internationally and is used herein with permission. All rights reserved.

KGD: Known Good Die（Common name for bare chips that are guaranteed not to be defective）© 2024 Micronics Japan Co., Ltd.

4

Key Performance Indicators•

These are our KPIs. We aim for a revenue of 65 billion yen by the end of the fiscal year 2026 and strive for an averageannual growth rate of more than 20% from 2024 to 2026.

•With our proactive investment plan, we are targeting an operating income margin of 23% and an ROE of 20%.

Key Performance Indicators (FY2026, Final Year)

Revenue
Operating income
Operating profit margin
ROE

65 billion yen※1
15 billion yen
23%20%※1. Assumption: Assuming the probe card market grows at an annual average growth rate of 7% ('24-'26).
※2. Assuming USD to JPY exchange rate: 130 yen

Investment Plan (FY2023 to FY2026)
Capital investments

30 billion yen

R&D expenses

20 billion yen

Total amount

50 billion yen© 2024 Micronics Japan Co., Ltd.

5

Probe Card Business• For memory probe cards, we aim to maintain an overwhelming No.1 share through production capacity enhancement andnew technology development.
• For non-memory probe cards, we seek to expand our share through the introduction of new products,
particularly MEMS types.

New Product• We will enhance customer support and further enrich our services,while also building new relationships with potential customers.

Growth through the Introduction ofNew MEMS-Type Products

MEMS-V

Non-memory Probe Cards MEMS-SP

Achieving an Overwhelming
No.1 Position

Memory Probe Cards© 2024 Micronics Japan Co., Ltd.

SP-Probe（Flash）

PCB less
U-Probe（Flash）

PCB less
U-Probe（DRAM）

U-ProbeU-Probe（Flash） （DRAM）
6

TE business• While we secure a stable revenue stream through the growth of our contactor business• Creating new value and growth through new products for semiconductor testing• Enhancing customer services to generate a third source of income through field support (postsales)• By enhancing our services to customers, we aim to make field support (post-sales) a thirdsource of income.
Custom Tester
Model 708fT※Existing Products

Creating Value through
New Products

Growth Strategy

Contactor Business

Steady Revenue© 2024 Micronics Japan Co., Ltd.

Probe Unit

TesterField Support（FS）

Prober

ProberAccessories

Package Probe（Test Socket）
7

Initiatives for Growth (Capital Expenditure)
Construction of a new building at ourAomori plant•••

Expanding facilities in response to increased
demand for Probe Cards.
The new building will span approximately 9,200
square meters.
We plan to begin operations step by step startingfrom the first quarter of 2025.

Construction of a new plantfor MEK Co.,Ltd. in Korea•••

Expansion of production space to meet the growing
semiconductor demand.
Building area of 2,349 square meters.
Scheduled to commence operations inSeptember 2023.

new building【Image of new building at Aomori Plant】© 2024 Micronics Japan Co., Ltd.

【New MEK plant 】

8

Initiatives for Growth (Research & Development)
New Product Release 「MEMS-V」
We have commenced sales of the vertical MEMS probe cards for logic
semiconductors within the MEMS-V product range.

Long lifespanNew probes using MEMS manufacturing technology with proven trackrecord for memory and dual balance support using our original
substrate technology, etc., mainly for automobiles For logic devices, it
contributes to improving the quality of testing. This is one of the newcore products of the non-memory probe card business in ourMedium-Term Business Plan.

number of pins

40,000

MEMS-SP

12,000

NewProduct

Large
area

Dual
temperature

MEMS-V

10,000【New Product MEMS-V】

SP-Probe

4,000

Vertical~200μm~80μm
pin pitch© 2024 Micronics Japan Co., Ltd.

Multi-pin
compatibility~50μm

9Addressing Societal Issues and Advancing Productivity
Addressing sustainability.
In March 2023, we established a new division specifically focused onsustainability.
1. Sustainability Promotion Office.
2. Sustainability Advisory Committee as a consultative body to theBoard of Directors.
Advancing our commitment to sustainability through the dedicatedefforts of our Sustainability Promotion Office, complemented by theoversight of the Sustainability Advisory Committee.
•Response to climate change through initiatives such as TCFD* andCDP**•Initiatives related to human capital development, diversity,
employee engagement, and more.

Adapting to digital transformation.
Led by the DX Information Systems Department within the Corporate
Planning and Strategy Division.
In addition to strengthening our internal infrastructure and enhancing
information security, we are committed to leveraging a wide range ofdata using IT and digital technologies to improve operational efficiency
and productivity.

【Examples of DX Promotion Efforts】

We showcase initiatives for "Business Efficiency Enhancement andProductivity Improvement" on our internal portal site. We recognize
and award outstanding efforts that contribute to these goals.

【Sustainability Promotion Organization】
Board of Directors

Sustainability Advisory
Committee

Representative
Director
SustainabilityPromotion Office
Various departments
and local subsidiaries
TCFD* Task Force on Climate-related Financial Disclosures
CDP** Carbon Discloser Project© 2024 Micronics Japan Co., Ltd.

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Summary•

In conclusion, we aspire to realize the growth that outpaces market expansion with 2026 as our targeting year of our new Medium-Term Business Plan: FV26,
which is based upon the "MJC Future Vision“.

•We are committed to addressing our customers' needs and achieving mutual growth by actively investing in CAPEX and R&D.

•We will view the promotion of Sustainability Initiatives and DX as opportunities for growth and strengthen and promote human resource development andorganizational capabilities.

•We aim to elevate our corporate value by leveraging electronic testing technology while actively contributing to society.
© 2024 Micronics Japan Co., Ltd.

11

Technical information in this material is provided to explain normal
operations and application of our products, not for the purpose of warranty
of intellectual property rights and other rights of MJC and a third party orgrant of license of the same.

© 2024 Micronics Japan Co., Ltd.