General Session & 18th Annual Meeting of Members
February 23, 2017

Activities of the Association
Report to the Membershipon the Affairs of the Company

Membership: February 23, 2017308 entities – stable and growing
General Session© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
All rights reserved.

www.odva.org

3

ODVA at Work

HQ Staff & local PR supporting
North & Latin America

HQ Staff & local
PR supporting European in-country
resources
RIC
Germany
RIC Italy

TAGKorea
TAG Japan
ODVA ATS withTAG China

HQ Staff supporting Asian
in-country resources

General Session© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
All rights reserved.

www.odva.org

4

A Community Driving the Stages of Diffusion
for the 4th Industrial Revolution
ODVA GUIDING PRINCIPLES FOR SUCCESS
1. Design for Integration of Heterogeneous Systems
2. Deploy ICT Standards to Achieve Interoperability
3. Optimize Performance-Cost Ratio with COTS
4. Blend the Best Technical Solutions of the Futurewith Proven Solutions of the Present
5. Architect and Automate for Diagnostics

6. Design for the Scalability of “THINGS”

General Session© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
All rights reserved.

Technology implementations and diffusionfrom suppliers to users will be particularly
impacted by common approaches
information models and cybersecurity.
www.odva.org

5The Ascent of EtherNet/IP
EtherNet/IP
has become acomprehensive
and proven

Device Profiles
CIP I/OCIP Energy

CIP Sync

CIP Security

CIP Motion

CIP Safety

Objects andServices

Objects andServices

Profile(s),Objects andServices

Profile(s) andAxis Objects

Profile(s),Objects andServices

SecuredConnections1

Motion I/OConnections

SafetyConnections

CIP
Services

platform forthe smart andsecureindustrialcontrol systemsof tomorrow.

Profile(s),Objects andServicesStandard
Connections (includes TCP and UDP)

CIP Application Layer (IPV4 migrating to IPv6, optional CoCo and TCL)
EtherNet/IP Layer 2 (options for high availability, QOS with or without TSN)
Ethernet Layer 1 (with 1 GbE)

NETWORK ARCHITECTURE FRAMEWORKGeneral Session© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
All rights reserved.

www.odva.org

6

Ascent of EtherNet/IP•What are industry analysts saying?

“Transition to industrial Ethernet is accelerating andEtherNet/IP accounted for approximately 25% of all new
Ethernet nodes shipped in 2015. The growth trend for
EtherNet/IP is expected to continue building on its strong
installed base, the transition from fieldbus to Ethernet
networks, and the fact that industrial Ethernet will provide
a fundamental component of connectivity necessary toenable smart manufacturing and IIOT solutions.”
Alex West, analyst for IHS Markit

New Connected Industrial Ethernet Nodes 2015
“Industrial Communications Report 2015”© IHS Markit.

General Session© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
All rights reserved.

www.odva.org

7

LeadershipMichael Höing
Weidmüller Interface

Masaru TakeuchiOmronGeneral Session© 2017 ODVA, Inc.

Fabrice Jadot
Schneider ElectricDr. Thomas Bürger
Bosch Rexroth2017 Industry Conference & 18th Annual Meeting
All rights reserved.

Dr. Jürgen Weinhofer
Rockwell Automation

Dr. Rolf Birkhofer
Endress+Hauser
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8Officers•

President and Executive Director – Katherine Voss•

Chief Technology Officer – Joakim Wiberg•

Secretary – Christopher Lynch•

Treasurer – Jürgen Weinhofer

General Session© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
All rights reserved.

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99

Welcome BackGeneral Session© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
All rights reserved.

www.odva.org

10

Industry Awareness
Exhibits at
Hannover Fair andSPS IPC Drives show inGermany. . .

General Session© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
All rights reserved.

. . . and Concurrent
Media Briefings

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11

Industry Awareness
Exhibits at
Systems Controls Fair. . .

. . . andIndustrial Open Net Fairin Japan

General Session© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
All rights reserved.

www.odva.org

12

Industry AwarenessLaunched refreshed
EtherNet/IP seminar, starting
in:• Barcelona, Spain• Detroit, Michigan, USA• Frankfurt, Germany• Parma, Italy

General Session© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
All rights reserved.

www.odva.org

13

Industry Awareness
Organization Ambassador toIOT Solutions World Congress

General Session© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
All rights reserved.

www.odva.org

14

Industry Awareness
Chinese Automation Association Forum
September 2016

General Session© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
All rights reserved.

www.odva.org

15

Industry AwarenessWestern China GongKong Forum
December 2016General Session© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
All rights reserved.

www.odva.org

16

Report on ODVA Technical Activities

Agenda•••••ODVA Technology Development Overview
Technical Review Board Roster
Special Interest Groups and Working Groups
Key Technical Accomplishments since last Annual Meeting
Key Planned Activities for Next Term

Technical Track© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
All rights reserved.

www.odva.org

18

ODVA Technology Development ProcessSpecial
SpecialSpecialSpecialInterest
InterestInterestInterestGroupGroupGroupGroup
EtherNet/IP
Roundtable

Set SIGWork Plans

Submit SEor TDETechnicalReview
Board

Strategic
Initiatives

Board ofDirectors

Approved
SE or TDE
ODVA

UpdateUpdate (TRB review)
Update(via Conformance Authority)

Specification
Set

Technical Track© 2017 ODVA, Inc.

Policies andProcedures

ConformanceTest

2017 Industry Conference & 18th Annual Meeting
All rights reserved.

www.odva.org

19Technical Review Board
•••
•
••
•
•

Joakim Wiberg, chairperson
Dave VanGompel
Dr. Ludwig Leurs
Rudy Belliardi
Paul Didier
Shinji Murayama
Dr. Jörg Hähniche
Eric Scott

Technical Track© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
All rights reserved.

www.odva.org

20

Active Special Interest Groups and Working Groups••••••••••••••••••

EtherNet/IP In Process Industry – Mirko Brcic (Endress+Hauser)
CIP Safety – Bruce Brown (Rockwell Automation)
Common Industrial Cloud Interface – Stephen Briant (Rockwell Automation) (new SIG)
IO-Link Integration – Frank Moritz (SICK)
DeviceNet of Things – Thomas Peter (Weidmueller)
Machinery Information – Beudert/Zuponcic/Leurs
EtherNet/IP Physical Layer – Bob Lounsbury (Rockwell Automation)
DeviceNet Physical Layer – Brad Woodman (Molex)
EtherNet/IP Infrastructure – George Ditzel (Schneider Electric)
EtherNet/IP System – Brian Batke (Rockwell Automation)
Distributed Motion and Time Synchronization – Steve Zuponcic (Rockwell Automation)
CompoNet – Tianbing Li (Omron)
Conformance – Qi Zeng (ODVA)
Modbus Integration – Todd Snide (Schneider Electric)
Motor Control and Circuit Breaker - John Caspers (Rockwell Automation) (new SIG)
CIP System – Dave VanGompel (Rockwell Automation)
Energy Applications – Rick Blair (Schneider Electric)
EtherNet/IP Roundtable – Kevin Knake (HMS Industrial Networks) US Track
Ulrich Kaemmerer (Schneider Electric) European Track

Technical Track© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
All rights reserved.

www.odva.org

21

Specification Enhancement Summary••

56 Specification Enhancements distributed over 3 publication cycles
2 Technical Documents

Specification Volume

PC 2016-1 to PC 2017-1

CIP Common (Vol 1)

16

EtherNet/IP (Vol 2)

8

CIP Safety (Vol 5)

7

CIP Security (Vol 8)

9CIP Motion (Vol 9)16Technical Track© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
All rights reserved.

www.odva.org

22

Key Accomplishments since last Annual Meeting
TopicSIGSummaryCIP Motion Reorganization

Motion & Time Sync

Reorganize all the current material into one
new volume

CIP Security

EtherNet/IP System

First prototypes available and twointeroperability tests

EtherNet/IP CT13 and CT14
DeviceNet CT27 and CT28

Conformance

Supporting slides

Roundtable DiagnosticActivities

Roundtable, CIP System,
EtherNet/IP System

First enhancements related to the ongoing
diagnostic activities

DLR Whitepaper

EtherNet/IP Infrastructure

New ODVA publication

Time Sensitive Networking

Motion & Time Sync

Supporting slides

Technical Track© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
All rights reserved.

www.odva.org

23Conformance Test Updates••

EtherNet/IP CT13 and CT14 released
DeviceNet CT27 and CT28 released•

Significant Enhancements to Common Object Tests••

Port, Energy and Power, PRP/HSR, TCP/IP, Ethernet, File, CoCoDiagnostic Counters•

From EtherNet/IP Roundtable initiative

Technical Track© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
All rights reserved.

www.odva.org

24

Distributed Motion & Time Synchronization SIG••

In November 2015 the SIG changed its name from: “The Distributed Motion
SIG” to “The Distributed Motion & Time Synchronization SIG”
Extended charter to include emerging standards and technologies,
including:– Time Sensitive Networking– Gigabit Ethernet•

Time Synchronization and TSN Activities– Analysis of Frame Preemption, Stream Reservation Protocols, Gigabit Ethernet,and Scheduling on overall Performance in the CIP Motion architecture

Technical Track© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
All rights reserved.

www.odva.org

25

Key Planned Activities for Next Term
Topic

SIG

SummaryProcess

EtherNet/IP for Process

Finalize HART mapping on CIP

CIP Security Phase 1.5 & 2

EtherNet/IP System

Certificate enrollment
CIP Authentication and Authorization

DeviceNet of Things

DeviceNet of Things, CIP System

Supporting slides

IO-Link

IO-Link Integration

Supporting slides

Roundtable Activities

Roundtable, CIP System,
EtherNet/IP System

Diagnostic project, LLDP investigation, CIP
Security, Interoperability

Technical Track© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
All rights reserved.

www.odva.org

26

DeviceNet of Things SIG•Proposed plans for next 12-18 months– Complete work on the Physical Layer Spec• Work on the Power Supply concept• Test specification– System integration in control / PLC system• Scanner enhancements– Profile description– System Tests

Technical Track© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
All rights reserved.

www.odva.org

27

IO-Link Integration SIG•

Proposed plans for next 12-18 months– Specification enhancements• Finalization• Publication in Volume 7B– Conformance Test Plan
• Setup and finalization

Technical Track© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
All rights reserved.

www.odva.org

28

THANK YOU