Poster Presentations
Transient light-induced refractive index change in nitroaniline-doped PMMA film made by laser microfabrication,
A. Yamasaki, S. Juodkazis, M. Watanabe, S. Matsuo, H. Misawa, Tokushima University, K. Kamada, K. Ohta, Osaka
National Research Institute (Japan)[4088-065]
Pulsed laser nitridation of InP surface, N. Aoki, K. Toyoda, Science University of Tokyo, Toshimitsu AkaneA, Koji
Sugioka, Katsumi Midorikawa, RIKEN (The Institute of Physical and Chemical Research)； J.J. Dubowski,. National
Research Council of Canada. （Japan）[4088-067]
Effects of laser pulse shape on jet-like plasma formation in laser ablation of metals under atmosphere at highfluence: observation by nanosecond imaging technique, S. Kiyoku, Y. Kurosaki, I. Oguro, S. Nakamura, Y. Ito,
Nagaoka University of Technology (Japan)[4088-069]
Molecular dynamics analysis on physical phenomena of metal with evaporation induced by laser irradiation, I.
Fukumoto, Japan Atomic Energy Research Institute; E. Ohmura, I. Miyamoto, Osaka University (Japan)[4088-070]
A Technique of Micromachining Suitable For Fabrication of Submillimeter Wave Components, W.Y. Liu, D.P.
Steenson, University of Leeds (UK)[4088-071]
Improving the Dimensional Accuracy of Laser Shaping by Using a High-resolution contact lithography byexcimer lasers, H. Huang, D. Lu, L. Du, Y. Zhao, C. Yuan, B. Jiang, R. Wang, Shanghai Institute of Optics and Fine
Mechanics, Chinese Academy of Sciences (China)[4088-073]
Inorganic-organic hybrid material for lithography, P. Lin, Y. Yan, G. Jin, M. Wu, State Key Laboratory of Precision
Measurement Technology and Instruments (China)[4088-074]
The etching characteristics of the PDP barrier rib pastes by focused Ar+ laser and Nd: YAG laser, C. Lee, K.C. Lee,
M.y. Ahn, H.g. Lee, IN-HA University (Korea)[4088-075]
Thermomecanical mechanisms of laser cleaning, V.P. Veico, E.A. Shakhno, S.V. Nikolaev, Saint-Petersburg Federal
Institute of Fine Mechanics and Optics, Technical University (Russia)[4088-076]
N2 laser stereo-lithography, S. Satoh, Saga University(Japan)[4088-077]

Through-hole drilling of glass substrates with slab waveguide CO2 laser, Y. Yoshida, Y. Kobayashi, T. Zhang,
Yamanashi University; H. Yajima, Y. Hashidate, H. Ogura, Matsushita Research Institute of Tokyo Inc.(Japan) [4088-078]
High repetition rate ArF excimer laser for miclolithography, O. Wakabayashi, Y. Itakura, T. Watanabe, T. Ohta, A.
Ohbu, H. Kubo, T. Suzuki, A. Sumitani, H. Mizoguchi, T. Enami, K. Ishii, K. Terashima, H. Tanaka, Komatsu Ltd. (Japan)[4088-080]
Thermodynamic analysis on the mechanism of bump formation in laser texturing, E. Ohmura, R. Murayama, I.
Miyamoto, Osaka University (Japan)[4088-082]
Laser surface annealing of Ni-base super alloy for enhancement of material performance in hydrogenenvironment, A. Hirose, L. Liufa, F.K. Kobayashi, Osaka University (Japan)[4088-084]
Mechanisms of laser Induced formation of silicon surface gratings, C.Y. Chen, C.C. Yang, National Taiwan
University; K.J. Ma, Y.S. Lin, C.L. Chao, Chung-Cheng Institute of Technology (Taiwan)[4088-085]
Surface grating of glass materials by excimer laser, I.T. Chen, K.J. Ma, C.L. Chao, D. S. Liu, Chung-Cheng Instituteof Technology (Taiwan)[4088-086]
Numerical simulation of temperature field during laser sintering of polymer-coated metal powder, P. Bai, North
China Institute of Technology (China)[4088-087]
New interferometric methods to measure the complete geometry of the key-hole, M. Muddassir, S. Gualini, H.
Steinbichler, Pakistan Institute of Lasers and Optics (Pakistan)[4088-089]
Plasma behaviors in laser cutting, H. Horisawa, M. Tamura, S. Kimura, Tokai University (Japan)[4088-090]

Micro soldering using YAG laser, S. Nakahara, T. Kamata, K. Yoneda, S. Hisada, T. Fujita, Kansai University (Japan)[4088-091]
A fundamental study about molten metal of laser cutting, T. Fushimi, H. Nakajima, S. YamaguchiI, T. Fujioka, H.
Horisawa, N. Yasunaga, Tokai University (Japan)[4088-092]
Fundamental study of CO2 laser welding of titanium aluminide intermetallic compound, G. Kuwahara, S.
Yamaguchi, K. Nanri, M. Ootani, S. Seto, M. Arai, T. Fujioka, Tokai University (Japan)[4088-093]
Effect of nozzle shape on surface integrity in micro cutting with pulsed YAG laser, Y. Okamoto, Y. Uno, Departmentof Mechanical Engineering, Okayama University; N. Miyanagi, Hitachi Construction Machinery Co., Ltd. (Japan)[4088-094]−7−

A method to evaluate Nd: YAG laser microscopic spot welding process using reflected Laser power, S.J. Park, R.
Honma, I. Miyamoto, Osaka University (Japan)[4088-095]
Study of optical emission of plasmas in ultraviolet and infrared laser ablation of graphite by time-resolved
spectroscopy, T. Shinozaki, T. Ooie, T. Yano, M. Yoneda, Shikoku National Industrial Research Institute (Japan)[4088-096]
Three dimensional micro-assembling technique applying laser trapping, D. Sawaki, O. Horiuchi, Toyohashi
University of Technology; J. Ikeno, T. Kasai, Saitama University (Japan)[4088-097]
Optical diagnostics in laser-induced plasma-assisted ablation of fused quartz, M.H. Hong, Y.F. Lu, Laser
Microprocessing Laboratory, National University of Singapore (Singapore); K. Sugioka, K. Midorikawa, RIKEN (Instituteof Physical and Chemical Research) (Japan)[4088-098]
Photo-induced refractive index changes in filaments formed in glasses with femtosecond laser pulses, K.
Yamada, T. Toma, W. Watanabe, J. Nishii, K. Itoh, Osaka University (Japan)[4088-099]
In vivo results of corneal surface measurement with optical methods, M. Muddassir, S. Gualini, H. Steinbichler,
Pakistan Institute of Lasers and Optics (Pakistan)[4088-100]
Removal Process of Metal Thin Films during Laser Rear Patterning, T. Sano, I. Miyamoto, Osaka University (Japan)[4088-101]
Application of optic registration techniques of gas jet for a laser-plasma EUV source investigation, V.V. Askov,
S.V. Bobashev, T.G Kopitova, A.A. Schmidt, Z.A. Stepanova, G.K. Tumakaev, Ioffe Institute (Russia)[4088-102]
A laser method for marking bar codes on glass substrates, H. Hayakawa, YASKAWA Electric Corporation ResearchLaboratory (Japan)[4088-103]
Laser processing system for micro drilling of printed circuit boards, J. Nishimae, Y. Satoh, T. Kojima, T. Fukushima,
Mitsubishi Electric Corporation (Japan)[4088-104]
Development of the enhanced in-line concurrent inspection system for CO2 laser drilling machine, H. Nagatoshi,
K. Isaji, T. Sugiyama, H. Karasaki, Matsushita Industrial Equipment Co., Ltd.; M. Kato,Matsushita Electric IndustrialCo.,Ltd. (Japan)[4088-106]
Selective Laser Sintering with Heat of Formation by Using Reactive Materials, T. Kamitani, O. Yamada, Y. Marutani,
Osaka Sangyo University (Japan)[4088-107]
Compact tip/tilt laser scanner for material processing and biomedical applications, M. Hafez, T. Sidler, and R.P.
Salathe, Institute of Applied Optics (IOA) Swiss Federal institute of Technology (Switzerland)[4088-108]
Micro-cutting with pulsed fundamental mode Nd-YAG slab laser, T. Sidler, S. Favre, S. Benjamin, R.P. Salath, Swiss
Federal Institute of Technologies (Switzerland)[4088-109]
Laser micro processing unit and its application, K. Fukumitsu, T.Oie, Hamamatsu Photonics K.K (Japan) [4088-111]
Micro Materials Processing with High Power Diode Lasers, F. Bachmann, ROFIN-SINAR Laser GmbH,(Germany); R.
Takahashi, S. Fujishima, ROFIN-Marubeni Laser K.K.; (Japan)[4088-113]
Applications of pulsed lasers in low temperature thin film electronics fabrication, T.W., Sigmon, D, Toet、P.G.
Carey, P. M. Smith, P. Wickboldt , Lawrence Livermore National Laboratory (USA)[4088-014]
Research on Laser Texturing Process and Suface Quality Control, J. Jiang, School of Electronics & Information
Technology; Y. He, Y. Yan, Y. Xu, Technical Center of ShangHai BaoSteel Group Corp; W. Zhao, Halbin Institute ofTechnology (China)[4088-041]−8−