INDEX
Qseven®10

COM-HPC®36

SOM-Q7-EHL

P. 11

SOM-COM-HPC-A-MTL

P. 37

SOM-Q7-MX8X

P. 11

SOM-COM-HPC-A-RPL

P. 38

SOM-Q7-MX8

P. 12

SOM-COM-HPC-A-ADL-P

P. 38

SOM-Q7-MX8M

P. 12

SOM-COM-HPC-A-TGL-H

P. 39

SOM-Q7-APL

P. 13

SOM-COM-HPC-A-TGL-UP3

P. 40

SOM-Q7-MX6

P. 13

DEV-KIT-COM-HPC-A

P. 41

SOM-Q7-BT-2

P. 14

SOM-Q7-BT

P. 14

SOM-uQ7-MX8M-Mini-Nano

P. 14

SOM-uQ7-BT

P. 15

SOM-uQ7-MX6-2

P. 15

SOM-uQ7-MX6

ETX®42
SOM-ETX-BT

P. 43

MYON MicroModule SOM

44

P. 15

SOM-Myon-I-410E

P. 45

Carrier-Q7-D59

P. 16

SOM-Myon-II-MX8M-Mini

P. 45

Carrier-Q7-D03

P. 16

Carrier-Myon-ConXM

P. 46

DEV-KIT-Q7-2.1

P. 16

DEV-KIT-Myon-i-PAN-M7

P. 46

SMARC18

TRIZEPS SODIMM SOM

48

P. 19

SOM-Trizeps-VIII-MX8M-Mini

P. 49

SOM-SMARC-MX93

P. 19

SOM-Trizeps-VIII-MX8M

P. 49

SOM-SMARC-QCS5430

P. 20

SOM-Trizeps-VIII-MX8M-PlusP. 50

SOM-SMARC-Genio510

P. 20

SOM-Trizeps-VII-MX6

P. 50

SOM-SMARC-QCS6490

P. 20

Carrier-Trizeps-ConXTP. 51

SOM-SMARC-Genio700

P. 21

Carrier-Trizeps-iP5-BaseP. 51

SOM-SMARC-ADL-NP. 21

Carrier-Trizeps-pConXS

P. 52

SOM-SMARC-EHL

P. 22

Carrier-Trizeps-pConXS-III

P. 52

SOM-SMARC-MX8M-Plus

P. 23

DEV-KIT-Trizeps-i-PAN-T7-II

P. 53

SOM-SMARC-MX8X

P. 23

DEV-KIT-Trizeps-i-PAN-7

P. 53

SOM-SMARC-MX8M

P. 24

SOM-SMARC-APL

P. 24

SBC54

DEV-KIT-SMARC

P. 24

SBC-3.5-RK3568

P. 55

SBC-3.5-TGL-UP3

P. 55

SBC-pITX-EHL

P. 56

SOM-SMARC-MX95

Com Express®26

SOM-COMe-BT7-ICL-D

P. 27

SBC-3.5-PX30

P. 56

SOM-COMe-BT7-E3000

P. 27

SBC-3.5-RV1000

P. 57

DEV-KIT-COMe-T7

P. 27

SBC-3.5-MX8M-Mini

P. 57

SOM-COMe-CT6-ASL

P. 28

SBC-3.5-MX8X

P. 58

SOM-COMe-BT6-MTL

P. 28

SBC-3.5-MX8

P. 58

SOM-COMe-BT6-RPL-P

P. 29

SBC-pITX-APL

P. 59

SOM-COMe-CT6-EHL

P. 29

SBC-3.5-RK3399

P. 59

SOM-COMe-CT6-TGL-U

P. 30

SBC-3.5-MX8M

P. 60

SOM-COMe-CT6-V2000

P. 30

SBC-eNUC-APL

P. 60

SOM-COMe-CT6-R1000

P. 31

SBC-eNUC-BSW

P. 61

SOM-COMe-CT6-WHL-U

P. 31

SBC-MX6

P. 61

SOM-COMe-CT6-APL

P. 31

SBC-pITX-BT

P. 61

SOM-COMe-BT6-CFL-H

P. 32

SBC-NALLINO-MX6ULL

P. 61

SOM-COMe-CT6-V1000

P. 32

SBC-SBCSOM-MX8M-Mini-Nano

P. 62

SOM-COMe-BT6-SKL/KL

P. 32

SBC-TANARO-MX8M-Mini

P. 62

SOM-COMe-CT6-MBPF

P. 32

SBC-SANTINOLT-MX6

P. 63

Carrier-COMe-T6-C30

P. 33

SBC-SANTINO-MX6

P. 63

Carrier-COMe-T6-E10

P. 33

SBC-SANTARO-MX6

P. 64

DEV-KIT-COMe-T6

P. 34

SBC-SANTOKA-MX6

P. 64

SBC-SANTVEND-MX6

P. 65

SENSE-ESP32

P. 65

UDOO BOLTP. 66

UDOO X86 II 

P. 67

UDOO VISION 

P. 67

UDOO KEY

P. 67

Fanless Embedded Computers68
Palladio 500 RPL

P. 69

Palladio 400 RPLP. 69

Modular Link MX93

P. 70

Titan 300 TGL-UP3 AI

P. 70

Titan 300 TGL-UP3

P. 71

Titan 290 EHLP. 71

Titan 220 APL MedP. 72

Titan 240 APLP. 72

Titan 235 APLP. 73

Titan 230 APL 

P. 73

Titan 250 APL IP65

P. 74

Titan 200 MX8

P. 74

Titan 225 RK3399

P. 75

Titan 220 RK3399

P. 75

Titan 210 MX8M

P. 76

EASY EDGE

P. 76

Embedded Computers

78

Krater RV1000

P. 79

Payment Systems

80

KarL4

P. 81

Modular HMI82

Modular Vision 7 MX93

P. 83

Modular Vision 10.1 MX8M-PlusP. 83

Modular Vision 15.6 EHLP. 84

Flexy Vision 7 APLP. 84

Flexy Vision 10.1 APLP. 85

Flexy Vision 13.3 RK3399

P. 85

Flexy Vision 13.3 APLP. 86

Flexy Vision 15.6 RK3399

P. 86

Flexy Vision 15.6 APLP. 87

Flexy Vision 21.5 APLP. 87

Simple Vision 10 MX6P. 88

Santino Vision 5 RM MX6P. 88

Santino Vision 5 FM MX6P. 88

Santino Vision 7 PM MX6P. 88

Santino Vision 7 RM MX6P. 89

Santaro Vision 7 RM MX6P. 89

Santaro Vision 10.1 FM MX6P. 89

Santaro Vision 10.1 PM MX6P. 89

Tanaro Vision 7 RM MX8M-Mini

P. 90

Tanaro Vision 7 PM MX8M-Mini

P. 90

Santoka Vision 10.1 FM MX6P. 90

Santoka Vision 10.1 PM MX6

P. 90

SECO in a snapshot

Who we are

A worldwide spread center of excellence,with top-tier capabilities

We are a tech company building solutions andtechnologies to enable a new generation of digital devices

900

10

Peopleall over the world

R&D centerworldwide~300
People working in R&D
of which ~180 in AI andsoftware development

From Edge Computing, to IoT, to AI, our comprehensive and modular offering suits
the needs of customers who are looking for a partner to maximize the potential of
their products and fully leverage new technological opportunities getting the mostout of their data.

5
Production
plantsAI
Energy &Utilities

Transportation

DigitalSignage

Industrial
Automation

Coffee &Vending

Smart Buildings& Smart Cities

MedicalSmart
Devices

Security &Surveillance

IoT
E
G
ED

Edge Computing
We build a wide range of edge computing
products for the most innovative projects:
from modules to complete solutions, withunmatched integration capabilities.

IoT
We provide standard, ready-to-use
platforms and infrastructures to enable fleet
and device management, field data analysis
and optimization, which can be integrated
with any hardware.

AI
IoT
GE
D
E

AI
We reshape industries with impactful AI
solutions and services that harness the fullpotential of data collected at the edge.

Edge

IoT

Edge computing systems and HMIs

Clea Software Suite

CustomSolutions
Highly customizable solutions
integrating HMI, module,
connectivity technologies
according to the mostdemanding customers’ needs

HMIs
User-ready, rugged andhigh-resolution, high brightness
HMIs with touch displays andintegrated boards.

Fanless
Embedded
Computers

Payment
System & loT
Telemetry

From SECO's experience in
integrating modules and boards
into complex systems, a line ofboxed applications developed
for Industrial loT to match thecustomers' flexibility andsecurity needs.

Highly integrated and rugged
cashless modules for quick, safe
and convenient payments, withtelemetry functionalities included.

Modules& SBCsClea is SECO’s
comprehensive
software suite forbuilding IoT
solutions thatharness fielddata.

Ready-to-use, standalone
solutions enabling a rapid andscalable prototyping (peripheral
data storage, processing power,
input/output interfaces) without
the need for additional modules.

Clea is a modular software stack
designed for developing robust
IoT infrastructures.
Open source andproduction-ready, it fulfills therequirements of even the mostdemanding IoT installations.

Clea provides a highly scalable
and cost-effective solution forharnessing field data, managing
devices, and for facilitating
development of value-added
services, advanced AI
applications, and more.

Device-Cloud
Data Hub

Device Manager
on Steroids

Extensible IoT
Front-End

IoT communication and data
orchestration module, facilitating
data management. It collects andorchestrates data and makes it
available via the cloud.

Device and fleet management
solution handling software andconfiguration updates, boosted
by advanced features such as
application and container
management at the edge.

Ready-made user interface
designed for IoT applications, withan extensible framework forvalue-added app integration andservice monetization.

Clea is natively
compatible with
SECO hardware

AI

Our Partners

Evolving businesses thanks to our AI services

We work together to build sustainable solutions anddevelop innovative business models

We develop artificial intelligencesolutions that harness the full potential ofdata collected at the edge.
Our dedicated AI team has strong expertise in
AI development and data science applications
tailored to our reference verticals.
We also guide our customer in implementing
new AI-enabled business models andprocesses, enabling them to ride the wave oftechnological innovation. Our experience inmeeting both technological and businessneeds is our guarantee of a targeted andpractical approach.

We are committed to offering our customers innovative solutions by leveraging
pioneering technologies. This is why we invest in strategic partnerships with the mostrenowned high-tech companies and take part in international standards andconsortia. Our tight relationship with leading technology providers means we arepart of most of their early access programs, allowing our customers to accesscutting-edge technologies while minimizing both time-to-market and execution risks
associated with their investments.

Technological Partners

Enhance customer
experienceand satisfaction

Unlock new possibilities
with StudioX and elevateyour business with
AI-powered solutions.

Elevateproduct quality
Optimize operational
productivity
Access AI-generated
knowledge
in real-timeStandards & Consortia

Ingest structured
or unstructured
data directly frommachinery
Add innovative
features toyour products

Solution Partners

Qseven®

Qseven®

Qseven®

Qseven® Rel. 2.1 module with Intel® Atom® X6000E,
Pentium® and Celeron® N and J Series SoCs (Codename: Elkhart
Lake) with Time Coordinated Computing

Qseven® Rel. 2.1 compliant module with NXP i.MX 8X
Applications Processors

High computing and graphics performancein Qseven® form factor

Highly-efficient architecture in a compact, safetycertifiable Qseven® module

SOM-Q7-EHL

SOM-Q7-MX8X

Qseven® Standard Advantages
Available in Industrial Temperature Range

Cost effective
solution for highvolume projects

Low power
consumption

Compact
form factor
Processor

Low profile
designExcellent for
Iot projects

High speed
MXM Edgeconnector

Design investment limited to the carrier board | Consolidated standard form factor | Scalable and future-proof
Long-term availability | Arm® and x86 cross-compatibility | Multi-vendor solution | Highly configurable
Innovative and upgradable | Accelerated time-to-market

MemoryVideo
Interfaces
Video
Resolution
Mass
Storage
Networking

USB

Qseven® Features Overview
70 mm - 2,76”

Qsevenx86

70 mm - 2,76”

Arm®

μQseven
40 mm - 1,57”®

SECO is one of thefounding members of
SGET and a co-founderof the Qseven® standard

Also available
in Industrial
temperature range,-40°C ÷ +85°C

NXP i.MX 8X family SoCs: Dual or Quad Arm Cortex®-A35 Cores + 1x
Cortex® M4F core for real-time processing
Processor

Max Cores
MemoryGraphics(*) TCC: Time Coordinated Computing

Graphics

Computer-On-Module Approach

Celeron® J6413 Quad Core @ 1.8GHz (3GHz Turbo) 10W TDP
Celeron® N6211 Dual Core @1.2GHz (3GHz Turbo) 6.5W TDPPentium® J6426 Quad Core @1.8GHz (3GHz Turbo) 10W TDPPentium® N6415 Quad Core @1.2GHz (3GHz Turbo) 6.5W TDP
Atom® x6211E Dual Core @1.2GHz (3GHz Turbo) 6W TDP, IBECC Industrial
Atom® x6413E Quad Core @1.5GHz (3GHz Turbo) 9W TDP, IBECC Industrial
Atom® x6425E Quad Core @1.8GHz (3GHz Turbo) 12W TDP, IBECC Industrial
Atom® x6212RE Dual Core @1.2GHz (no Turbo) 6W TDP, IBECC andTCC* – Industrial
Atom® x6414RE Quad Core @1.5GHz (no Turbo) 9W TDP, IBECC andTCC* – Industrial
Atom® x6425RE Quad Core @1.9GHz (no Turbo) 12W TDP, IBECC andTCC* – Industrial
Soldered down LPDDR4-3200 memory
Up to 16GB with IBECC supported only with Atom® Industrial SoCs
Speed: 4267MT/s single rank (1GB / 2GB / 4GB / 8GB), 3733MT/s dual
rank (16GB)
Up to 3 independent displays
Integrated Intel® Gen11 UHD Graphics controller with up to 32 EU
4K HW decoding and encoding of HEVC (H.265), H.264, VP8, VP9,
WMV9/VC1 (decoding only)
DirectX 12.1, OpenGL ES 3.1, OpenGL 4.5, OpenCL™ 1.2, Vulkan 1.0
1x eDP 1.3 or Single/Dual-Channel 18-/24-bit LVDS interface
1x DP++ 1.4 or HDMI® 1.4 interface
Up to 4096x2160 @60Hz
2x S-ATA Gen3 Channels
SDIO interface
Optional eMMC 5.1 drive soldered on-board
1x Gigabit Ethernet PHY with precision clock synchronization andsynchronous Ethernet clock output for IEEE 1588
6x USB 2.0 Host ports
2x SuperSpeed USB 10Gbps Host ports (*)(*) Second SuperSpeed USB 10Gbps Host port can be utilized only via Qseven®
Rel. 2.1 compliant carrier boards

PCI-e

4x PCI-e x1 Gen3 lanes

Audio

HD Audio interface

Serial Ports

2x UARTs

Other
Interfaces

SPI, I2C, I2S, CAN, SM Bus, Thermal Management, FAN management
Optional LPC bus
Optional TPM 2.0 on-board
Watchdog

Power Supply+5VDC and +5VSB (optional)

Operating
SystemOperatingTemperature*

Microsoft® Windows 10 IoT Enterprise
Yocto
0°C - +60°C (Commercial version)-40°C - +85°C (Industrial version)

Dimensions

70 x 70 mm (2.76” x 2.76”)*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

Video
Interfaces
Video
Resolution
Mass Storage
Networking
USB

NXP i.MX8 QuadXplus, 4x Arm Cortex®-A35 Cores + 1x Cortex® M4F
core for real-time processing
NXP i.MX8 DualXplus, 2x Arm Cortex®-A35 Cores + 1x Cortex® M4F
core for real-time processing
NXP i.MX8 DualX, 2x Arm Cortex®-A35 Cores
4+1
Soldered down LPDDR4 memory @ 1200MHz, 32-bit interface, up
to 4GB
Embedded GC7000Lite GPU
Supports OpenGL 3.0, 2.1, OpenGL ES 3.1, OpenCL 1.2 Full Profile and 1.1,
OpenVG 1.1, and Vulkan
Embedded VPU, supports HW decoding of HEVC/H.265, AVC/H.264,
MPEG-2, VC-1, RV10, VP8, H.263 and MPEG4.2t, HW encoding of
AVC/H.264
2 independent displays supported
Factory alternatives:
2x LVDS Single Channel / 1x LVDS Dual Channel 18-/24-bit interface
LVDS Single Channel 18-/24-bit interface + HMDI interfaceeDP 4-lane interface + LVDS single Channel 18-/24-bit interfaceeDP 4-lane interface + HMDI interface
MIPI-DSI, LVDS, eDP, HDMI:

Up to 1920 x 1080 @ 60Hz

Optional Soldered onboard eMMC 5.1 Drive, up to 64GB
SD 4-bit interface
QSPI NOR Flash soldered on-board
1 x Gigabit Ethernet interface
On-board WiFi 802.11 a/b/g/n + BT LE 5.0 module, optional
2 x USB 2.0 Host Ports
2 x USB 3.0 Host Ports

PCI-e

1x PCI-e 3.0 x1 port

Audio

1x I2S Audio interface

Serial Ports

1x 4-wires UARTCAN

1x CAN interfaces

Other
Interfaces

1x 4-lanes CSI camera interface
2x PWM
Up to 8x GPIOs
I2C bus
SM bus
SPI interface
Watchdog
Boot select signals
Power Management Signals

Power Supply+5VDC and +3.3V_RTC

Operating
SystemOperatingTemperature*

Linux
Android
0°C ÷ +60°C (Commercial version)-40°C ÷ +85°C (Industrial version)

Dimensions

70 x 70 mm (2.76” x 2.76”)*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

Display Port | PCI Express | USB | S-ATA | CAN | HDMI |SDIO | SuperSpeed USB | Audio | GBE

10

www.seco.com

Please visit www.seco.com to find the latest version of these datasheets

Please visit www.seco.com to find the latest version of these datasheets

www.seco.com

11

Qseven®

Qseven®

Qseven®

Qseven®

Qseven® Rel. 2.1 compliant module with NXP i.MX 8
Applications Processors

Qseven® Rel. 2.1 compliant module with NXP i.MX 8M
Applications Processors

Qseven® Rel. 2.1 compliant module with Intel® Atom® X Series, Intel®
Celeron® J / N Series and Intel® Pentium® N Series (Codename: Apollo
Lake) Processors

Qseven® standard module with NXP i.MX 6 Processor

Take advantage of the wide scalability offered by
Qseven® form factor and the i.MX 8 family

Qseven® solution for next generation embedded
systems

High graphics performance and extreme
temperature for low power designs

Optimal balance of performance and power

SOM-Q7-MX8

SOM-Q7-MX8M

SOM-Q7-APL

SOM-Q7-MX6

Available in Industrial Temperature Range

Available in Industrial Temperature Range

Processor

NXP i.MX 8 Family:i.MX 8QuadMax - 2x Cortex®-A72 cores @1.6GHz + 4x Cortex®-A53
cores @1.2GHz + 2x Cortex®-M4F cores @264MHz
i.MX 8QuadPlus - 1x Cortex®-A72 cores @1.6GHz + 4x Cortex®-A53
cores @1.2GHz + 2x Cortex®-M4F cores @264MHz

Processor

MemorySoldered Down LPDDR4-3200 memory, 64-bit interface , up to 8GB

MemoryIntegrated Graphics Processing Unit, supports 2 independent displays.
Embedded VPU, supports HW decoding of HEVC/H.265, AVC/H.264,
MPEG-2, VC-1, RV9, VP8, H.263 and MPEG4 part, HW encoding of
AVC/H.264
Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 3.x, DirectX 11
HDMI® 2.0a / DP 1.3 or eDP 1.4 interface, supporting HDCP 2.2
Dual Channel or 2 x Single Channel 18- / 24-bit LVDS interface (1 x
Single Channel in case of eDP interface available)
HDMI® / DP / eDP: resolution up to 4096x2160 @ 60Hz
LVDS:
resolution up to 1920x1080 @ 60Hz
1x SATA Gen3 interface
eMMC 5.1 drive soldered on-board
SD 4-bit interface
QSPI Flash soldered-on-board

Graphics

Video
Interfaces
Video
Resolution
Mass
Storage

Graphics

Video
Interfaces
Video
Resolution
Mass
Storage
Networking

NXP i.MX 8M Family based on Arm® Cortex®-A53 cores + general
purpose Cortex®-M4 processor:
i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU
Soldered Down DDR4-2400 memory, dual-channel 32-bit interface,
up to 4GB
Integrated Graphics Processing Unit, supports 2 independent displays.
Embedded VPU, supports HW decoding of HEVC,H.264, H.263, MPEG4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG (not for i.MX8M
QuadLite).
Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 2.x, DirectX 11
HDMI® 2.0a / Display Port 1.3 interface, supporting HDCP 2.2 and
HDCP 1.4/1.3
eDP interface or 18- / 24-bit Dual Channel LVDS interface
HDMI®/DP up to 4096 x 2160p60
LVDS/eDP up to 1920 x 1080 @ 60Hz
eMMC 5.0 drive soldered on-board, up to 64GB
Optional microSD slot on board
QSPI Flash soldered-onboard
1 x Gigabit Ethernet interface
Optional WiFi + BT LE module onboard
1 x USB 3.0 Host or Client Port
Up to 4 x USB 2.0 Host Ports

Networking

1 x Gigabit Ethernet interface

USB

4 x USB 2.0 Host Ports
1 x USB 3.0 Host Port
1 x USB 2.0 OTG port

USB
PCI-e

Up to 2 x PCI-e x1 Gen2 ports

PCI-e

2x PCI-e x1 Gen3 ports

Audio

I2S Audio Interface

Audio

I2S Audio Interface

OperatingTemperature*

1x UART Tx/Rx/RTS/CTS
1x CAN Bus (TTL level)
CSI camera connector
2x I2C Bus
SPI interface
8 x GPI/Os
Boot select signal
Power Management Signals
Watchdog+5VDC ±5%+3.3V_RTC
Linux
Yocto
Android
0°C ÷ +60°C (Commercial version)-40°C ÷ +85°C (Industrial version)

Dimensions

70 x 70 mm (2.76” x 2.76”)

Serial Ports

Other
Interfaces

Power Supply
Operating
System*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

OperatingTemperature*

1x UART Tx/Rx/RTS/CTS (Optional)
1x Debug UART
Optional CAN Bus interface (TTL Level)
I2C BusSM Bus
Optional SPI interface
8 x GPI/Os
UltraLow Power RTC
Power Management Signals
Watchdog+5VDC ±5% and +5VSB (optional)+3.3V_RTC
Linux
Yocto
Android
0°C ÷ +60°C (Commercial version)-40°C ÷ +85°C (Industrial version)

Dimensions

70 x 70 mm (2.76” x 2.76”)

Serial Ports

Other
Interfaces

Power Supply
Operating
System*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

Available in Industrial Temperature Range

Processor

Intel® Atom® x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2
Cache, 6.5W TDPIntel® Atom® x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2
Cache, 9.5W TDPIntel® Atom® x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2
Cache, 12W TDPIntel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2
Cache, 6W TDPIntel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2
Cache, 6W TDPIntel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), 2MB
L2Cache, 10W TDPIntel® Celeron® J3355, Dual Core @2.0GHz (Burst 2.5GHz), 2MB
L2Cache, 10W TDP

Max Cores

4

Max Thread

4

MemoryDual Channel Soldered Down DDR3L-1866 memory, up to 8GB

Graphics

Video
Interfaces
Video
Resolution
Mass
Storage
Networking

USB

PCI-e

Integrated Intel® HD Graphics 500 series controller with up to 18
Execution Units
Three Independent displays supported
HW decoding of HEVC(H.265), H.264, MVC, VP8, VP9, MPEG2, VC-1,
WMV9, JPEG/MJPEG formats
HW encoding of HEVC(H.265), H.264, MVC, VP8, VP9 and JPEG/MPEG
formatseDP interface or Single/Dual Channel 18/24bit LVDS interface
HDMI® or DP++ interfaceDP:
Up to 4096 x 2160 @60HZ
eDP:
Up to 3840 x 2160 @60Hz
HDMI®:Up to 3840 x 2160 @30Hz
LVDS, VGA:
Up to 1920 x 1200 @ 60Hz
Optional eMMC 5.0 drive soldered on-board
2 x external S-ATA Gen3 Channels
SD interface
Gigabit Ethernet interface
Intel® I210 or I211 Controller (MAC + PHY)
6 x USB 2.0 Host Ports
2 x USB 3.0 Host Ports (*)(*) Second USB 3.0 Host port can be exploited only using Qseven® Rel.
2.1 compliant Carrier boards
4 x PCI-e Root Ports (including the PCI-e port used for Gigabit
Ethernet controller)

Audio

HD Audio interface

Serial Ports

1 x UART, TTL interface

Other
Interfaces

I2C Bus
LPC BusSM Bus
SPI interface
Watch Dog Timer
Thermal / FAN management
Power Management Signals

Power Supply+5VDC and +5VSB (optional)

OperatingTemperature*

Microsoft® Windows 10 Enterprise (64 bit)
Microsoft® Windows 10 IoT CoreLinux
Yocto (64 bit)
0°C ÷ +60°C (Commercial version)-40°C ÷ +85°C (Industrial version)

Dimensions

70 x 70 mm (2.76” x 2.76”)

Operating
SystemAvailable in Industrial Temperature Range

Processor

NXP i.MX 6 Family, based on Arm® CORTEX-A9 processors
i.MX6S Solo - Single core up to 1GHz
i.MX6DL Dual Lite - Dual core up to 1GHz per core
i.MX6D Dual - Dual core up to 1GHz per core
i.MX6DP DualPlus - Dual core up to 1GHz per core
i.MX6Q Quad - Quad core up to 1GHz per core

Max Cores

4

MemoryUp to 4GB DDR3L on-board (up to 2GB with i.MX6S)

Graphics

Video
Interfaces
Video
Resolution
Mass
Storage

Dedicated 2D Hardware accelerator
Dedicated 3D Hardware accelerator, supports OpenGL® ES 2.0 3D
Dedicated Vector Graphics accelerator supports OpenVG™ (only
i.MX6D, i.MX6DP and i.MX6Q)
Enhanced 2D and 3D graphics with i.MX6DP
Supports up to 3 independent displays with i.MX6D, i.MX6DP and
i.MX6Q
Supports 2 independent displays with i.MX6DL and i.MX6S
1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit
interface
HDMI® Interface 1.4
Video Input Port / Camera Connector
LVDS, up to 1920x1200
HDMI®, up to 1080p
On-board eMMC drive, up to 32 GB
SD / MMC / SDIO interface
1 x μSD Card Slot on-board
1 x External SATA Channel (only available with i.MX6D and i.MX6Q)

Networking

Gigabit Ethernet interface

USB

1 x USB OTG interface
4 x USB 2.0 Host interfaces

PCI-e

1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)

Audio
Serial Ports
Other
Interfaces
Power Supply

AC’97 Audio interface
I2S
2 x Serial ports (TTL interface)
CAN port interface
I2C Bus
LPC BusSM BusPower Management Signals+5VDC ± 5%

OperatingTemperature*

Linux
Yocto
Microsoft® Windows Embedded Compact 7
0°C ÷ +60°C (Commercial version)-40°C ÷ +85°C (Industrial version)

Dimensions

70 x 70 mm (2.76” x 2.76”)

Operating
System*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

12

www.seco.com

Please visit www.seco.com to find the latest version of these datasheets

Please visit www.seco.com to find the latest version of these datasheets

www.seco.com

13

Qseven®

μQseven®

μQseven®

μQseven®

Qseven® Rel. 2.0 module with Intel® Atom® E3800 and Celeron®
(Codename: Bay Trail) Processors

μQseven® standard module with NXP i.MX 8M
Mini & NXP i.MX 8M Nano Processors

μQseven® Rel. 2.0 module with Intel® Atom® E3800 and Celeron®
(Codename: Bay Trail) Processors

μQseven® standard module with NXP i.MX 6 Processors

Mobile-oriented with eMMC and
Camera Interface

With NXP’s first MPU for more speed and improved
power efficiency

Smallest x86 standard module at
proprietary costs

Small, flexibile OTS module at
proprietary costs

SOM-Q7-BT-2

SOM-uQ7-MX8M-Mini-Nano

SOM-uQ7-BT

SOM-uQ7-MX6-2

Available in Industrial Temperature Range

Available in Industrial Temperature Range

CPUIntel® Atom® E3800 and Celeron® families
GRAPHICS
Integrated Intel® HD Graphics 4000 Series controller
CONNECTIVITY
6x USB 2.0; 1x USB 3.0; 3x PCI-e x1

Processor

MEMORY
up to 8GB Dual-Channel DDR3L 1333MHz

Max Cores

Qseven®

Qseven® Rel. 2.0 Compliant Module with Intel® Atom® E3800 and Celeron®
families (Codename: Bay Trail) Processors

MemoryGraphics

x86 performance on a low-power module
SOM-Q7-BT

Video
Interfaces
Video
Resolution
Mass
Storage
Networking
USB

CPUIntel® Atom® E3800 and Celeron® families of System-on-Chip
GRAPHICS
Integrated Intel® HD Graphics controller
CONNECTIVITY
6x USB 2.0; 1x USB 3.0; 3x PCI-e x1
MEMORY
up to 8GB Dual-Channel DDR3L 1333MHz

14

www.seco.com

Processor

Intel® Celeron® N2807, Dual Core @1.58GHz, 1MB Cache, 4.3W TDPIntel® Atom® E3815, Single Core @1.46GHz, 512KB Cache, 5W TDPIntel® Atom® E3825, Dual Core @1.33GHz, 1MB Cache, 6W TDP

Max Cores

2

Max Thread

2

GRAPHICS
2D/3D dedicated graphics processors

NXP i.MX 8M Nano Family based on Arm® Cortex®-A53 cores +general purpose Cortex®-M7 750MHz processor:
i.MX 8M Nano Quad - Full featured, 4x Cortex®-A53 cores up to 1.5GHz
i.MX 8M Nano Dual - Full featured, 2x Cortex®-A53 cores up to 1.5GHz
i.MX 8M Nano Solo - Full featured, 1x Cortex®-A53 cores up to 1.5GHz
i.MX 8M Nano Quad Lite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU
i.MX 8M Nano Dual Lite - 2x Cortex®-A53 cores up to 1.5GHz, no VPU
i.MX 8M Nano Solo Lite - 1x Cortex®-A53 cores up to 1.8GHz, no VPUMemorySoldered on-board DDR3L memory
E3825, E3815: up to 4GB Single-Channel DDR3L @ 1066MHz
N2807: up to 4GB Single-Channel DDR3L @ 1333MHzCONNECTIVITY
FastEthernet; GPI/Os

Graphics

Integrated Intel® HD Graphics 4000 series controller
Dual independent display support
HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats
HW encoding of H.264, MPEG2 and MVC formats

MEMORY
up to 1GB DDR3L on-board

4+1

Video
Interfaces

Multimode Display Port interface
18 / 24 bit dual channel LVDS interface

Video
Resolution

DP++ (HDMI® compatible):
LVDS interface:

Mass
Storage

2 x external SATA channels
SD interface
Optional eMMC drive soldered on-board

Networking

Gigabit Ethernet interface

USB

1 x USB 3.0 Host port
4 x USB 2.0 Host ports (one shared with USB 3.0 interface)PCI-e

3 x PCI-e x1 lanes Gen2

Audio

HD Audio interface

Serial Ports

1 x Serial port (TTL interface, Tx / Rx only)

Other
Interfaces

I2C Bus
LPC BusSM BusThermal / FAN management
Power Management Signals

Power
Supply+5VDC ± 5%

Operating
SystemMicrosoft® Windows 7
Microsoft® Windows 8.1
Microsoft® Windows 10
Microsoft® Windows 10 IoT
Microsoft® Windows Embedded Standard 7
Microsoft® Windows Embedded Compact 7
Linux
Yocto

OperatingTemperature*

0°C ÷ +60°C

Dimensions

40 x 70 mm (1.57” x 2.76”)

Soldered Down onboard DDR4 memory:
Up to 4GB of DDR4-2400, 32-bit bus memory(i.MX8M Mini)
Up to 2GB of DDR4-2400, 16-bit bus memory(i.MX8M Nano)i.MX 8M Mini Family of processors:
Vivante GC320 2D accelerator + GCNanoUltra 3D accelerator
OpenGL ES 2.0, OpenVG 1.1 support
i.MX 8M Nano Family of processors:
Vivante GC7000UL 2D/3D GPU
OpenGL ES 3.1, OpenCL1.2, Vulkan support
Only for i.MX 8M Mini Family, not for Lite processors, embedded VPUable to offer:
VP9, HEVC/H.265, AVC/H.264, VP8 HW Decoding
AVC/H.264, VP8 HW encoding
Single/Dual Channel 18/24 bit LVDS interface or eDP interface
Up to 1920 x 1080p
eMMC 5.1 drive on-board, up to 64GB
SD / MMC / SDIO interface
Optional QSPI Flash for booting
Gigabit Ethernet interface
Optional WiFi 802.11 a/b/g/n/ac +BT 5.0 NGFF module soldered onboard
5x USB 2.0 Host ports (i.MX 8M Mini)
4x USB 2.0 Host ports (i.MX 8M Nano)

PCI-e

1 x PCI Express x 1 lane (only with i.MX 8M Mini)

Audio

I2S Audio Interface

Serial Ports
Available in Industrial Temperature Range

NXP i.MX 8M Mini Family based on Arm® Cortex®-A53 cores +general purpose Cortex®-M4 400MHz processor:
i.MX 8M Mini Quad - Full featured, 4x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Dual - Full featured, 2x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Solo - Full featured, 1x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Quad Lite - 4x Cortex®-A53 cores up to 1.8GHz, no VPU
i.MX 8M Mini Dual Lite - 2x Cortex®-A53 cores up to 1.8GHz, no VPU
i.MX 8M Mini Solo Lite - 1x Cortex®-A53 cores up to 1.8GHz, no VPU

OtherInterfaces
Power Supply
Operating
SystemOperatingTemperature*
Dimensions

1x 4-wire UART + 1 x Debug UART
Optional CAN interface
SPI interface
Watchdog
8x GPIOSM BusI2C interface

Up to 2560x1600@60Hz
Up to 1920x1200@60Hz*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

+5VDC and +5VSB (optional)
Linux (Yocto)

μQseven®

μQseven® standard module with NXP i.MX 6 Processor

Optimal balance of performance and size
SOM-uQ7-MX6

Available in Industrial Temperature Range
CPU
Single-, Dual- and Quad- Core (Arm® Cortex® -A9 Cores)
GRAPHICS
2D/3D dedicated graphics processors

0°C ÷ +60 °C (commercial temp.)-30°C ÷ +85°C (extended temp.)
40 x 70 mm (μQseven, 1.57” x 2.76”)

CONNECTIVITY
4x USB 2.0; 2x Serial ports; CAN Bus*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

Please visit www.seco.com to find the latest version of these datasheets

CPU
Single and Dual Core Lite (Arm® Cortex®A9 Cores)

MEMORY
up to 2GB DDR3L on-board

Please visit www.seco.com to find the latest version of these datasheets

www.seco.com

15

Qseven®

Qseven®

CARRIER BOARDSDEVELOPMENT KIT

Carrier Board for Qseven® Rel. 2.0 / 2.1 Compliant Modules
in the 3.5” Form Factor

Cross Platform Starter Kit compatible with both x86 andArm Rel. 2.0 / 2.1 Qseven® modules

Wide range of interfaces for broad development
possibilities

Quickly “start” prototyping for short
time-to-market

Carrier-Q7-D59

DEV-KIT-Q7-2.1
Cross-compatible
platform with x86
and Arm® solutions

SCHEMATICS
PUBLICLY AVAILABLE

Available in Industrial Temperature Range
CPU
3.5" Form Factor Carrier Board for Qseven Module

Available in Industrial Temperature Range
FEATURES OF CQ7-D59

Video
Interfaces
Mass
Storage

GRAPHICS
Multiport Video Interfaces

Networking

CONNECTIVITY
Connectivity oriented
MEMORY
Embedded Industrial Interfaces

USB

Audio

Serial Ports

Qseven®

CARRIER BOARDS

Carrier Board for Qseven® and μQseven® Rev 2.1 Modules in embedded
NUC™ Form factor

Flexible Qseven compliant Carrier board in
embedded NUC™ Form factor
Carrier-Q7-D03

Other
Interfaces

Power
SupplyOperatingTemperature*
Dimensions

LVDS Single/Dual Channel 18-24-bit + HDMI® Connector or 2 x eDP
connectors + Multimode Display Port
1x SATA connector with HDD power connector
1x M.2 Socket 2 2242 Key B SSD slot
microSD Slot on combo microSD + SIM connector
2 x Gigabit Ethernet connectors
1 x M.2 Socket 2 2242/3042 Key B Slot for WWAN cellular modem
modules, connected to on-board miniSIM slot
2x Superspeed USB 5Gbp Host port on dual Type-A socket
1x USB 2.0 Host ports on double Type-A sockets
1x USB 2.0 Host on internal M.2 socket
1 x USB 2.0 OTG port on micro-AB socket (USB port shared with USB
2.0 lanes of 1 x USB 3.0)
Audio interface on internal pin header
4-wires RS-232 / RS-422 / RS-485 configurable serial port on DB9
male connector
2x RS-232 full-modem serial ports on internal header (need LPC
interface from Qseven® module)
CAN interface on PCB terminal block
SPI internal pin header
LPC Bus internal pin header
16x GPIO signals on pin header via a GPIO expander controlled via
SM Bus or I2C
Front panel header
1x 28 pin connector for additional features (I2C, ACPI signals, SMBus,
watchdog, thermal management)+12V tachometric FAN connector
Optional debug USB port on miniB socket
Optional MFG connector for JTAG programming of Qseven® module
24VDC ±5% through Micro-fit 2x2 power connector
Coin cell battery holder for powering CMOS and RTC-40°C ÷ +85°C (Industrial temperature range)
146 x 102 mm (5.75” x 4.02”)*All carrier board components must remain within the operating temperature at any andall times, including start-up; carrier operating temperature is independent of the module
installed. Please refer to the specific module for more details. Actual temperature will
widely depend on application, enclosure and/or environment. The customer must design a
product-specific cooling solution for their final system.

CPUembedded NUC TM Form factor for Qseven® and μQseven® Rev 2.1 Modules
GRAPHICS
Supports dual-channel 24-bit LVDS and HDMI® outputs, enabling high-quality visualdisplays.
CONNECTIVITY
Multiple USB ports, PCIe expansion slots, and a microSD slot, supporting diverse
peripheral connections.
MEMORY
Gigabit Ethernet connector and Mini-PCIe slot for WWAN, ensuring reliable network
connectivity.

16

www.seco.com

Please visit www.seco.com to find the latest version of these datasheets

Please visit www.seco.com to find the latest version of these datasheets

www.seco.com

17SMARC

SMARC

SMARC

SMARC® Rel. 2.1.1 module with NXP i.MX 95 Applications Processors

SMARC® Rel. 2.1.1 module with NXP i.MX 9 Applications Processors

Optimized processing and advanced ML
acceleration for next-generation computing

NXP i.MX 93 in SMARC® module forlow power applications

SOM-SMARC-MX95

SOM-SMARC-MX93

SMARC Standard Advantages
Available in Industrial Temperature Range

Extremelow power
designUp to four
displayinterfaces

Low profile
designDedicated battery
management
signals

Dual
Ethernet

SMARC
compact
82×50 mm

Processor

NXP i.MX95 Applications Processors•
6x Arm® Cortex™-A55 @2GHz•
Arm® Cortex™-M33 @333Mhz•
Arm® Cortex®-M7 @800Mhz

System Memory

Up to 16GB LPDDR5 6.4GT/s (32-bit)

NPU

2.0 TOP/s Neural Network performance, up to 1.0 GHz

Video
Interfaces

2x LVDS single channel / 1xLVDS dual channel
Optional HDMI® interface
1x 4-lanes CSI camera interface
Optional 1x 2-lanes CSI camera interface (alternative to HDMI®
interface)Video
Resolution

LVDS, HDMI®: up to 1080p @60Hz

Graphics

GPU Arm Mali-G310 V2 with 2D/3D acceleration

Mass
StorageUp to 128GB eMMC 5.1 drive soldered on-board (boot device)
SD 4-bit interface (boot device)
Up to 2x Gigabit Ethernet interfaces
Optional Wi-Fi (802.11a/b/g/n/ac/ax) + BT/BLE 5.3 module soldered
on-board
SERDES (XGMII) interface for additional third Ethernet interface, up
to 10Gbps supported
Up to 5x USB 2.0 host ports
1x USB SuperSpeed 5Gbps port
Up to 1x USB 2.0 OTG port

Networking

Computer-On-Module Approach
Design investment limited to the carrier board | Consolidated standard form factor | Scalable and future-proof
Long-term availability | Arm® and x86 cross-compatibility | Multi-vendor solution | Highly configurable
Innovative and upgradable | Accelerated time-to-market

SMARC Supported Overview
System I/O interface# of interfaces

System I/O interface# of interfaces

PCI Express lanes

4

Secure Digital I/O 4-bit

1

Serial ATA channels

1

I²C Bus5

USB 2.0 ports

6

SPI Bus2

USB 3.0 ports

2

CAN Bus2

Watchdog Timer

1

Boot selection signals

3

GPIOs

12 (some with alternate functions)

System and Power
management signals

Reset out and Reset inPower button inPower source status
Module power state status
System management pins
Battery and battery charger management pins
Carrier Power On control

LVDS channels
embedded DisplayPort

2

DP++ / HDMI

1 dedicated DP++1 shared DP++ / HDMI

Camera interfaces

2 MIPI CSIHigh Definition Audio / I2S

1 I2S + 1 shared I2S / HD Audio

Ethernet 10/100/1000 Mbps

2

UARTs

2 x 4-Wire + 2 x 2-Wire

USB
PCI-e

Up to 2x PCI-e x1 Gen3 ports

Audio

1x I2S audio interface

Serial Ports

2x UART (4-wires)
2x UART (2-wires)

CAN Bus

2x CAN interfaces

Other
Interfaces

2x general purpose PWM
FAN Management Signals
Up to 12x GPIOs
1x general purpose I2C bus
1x power management I2C bus
1x general purpose SPI interface
1x QuadSPI interface or additional general purpose SPI interface
Watchdog
Boot select signals
Power management signals
JTAG Header
Optional TPM 2.0 soldered on-board

Power Supply+5VDC ± 5% and +3.3V_RTC

Operating
SystemOperatingTemperature*

Linux
Yocto
0 ÷ +60°C (Commercial Range)-40 ÷ +85°C (Industrial Range)

Dimensions

82 x 50 mm

Available in Industrial Temperature Range

VideoInterfaces
Video
Resolution
Mass
Storage

1-2x Arm® Cortex®-A55 @ 1.7 GHz
Arm® Cortex-M33 @ 250Mhz
Arm® Ethos™ U-65 microNPU
Soldered-down LPDDR4X/LPDDR4-3200 memory, up to 2GB
total, 16-bit interface
LVDS Single Channel
MIPI_DSI or eDP interface (factory alternatives)
MIPI-DSI: up to 1080p60
LVDS: up to 720p60
eMMC 5.1 Drive soldered on-board, up to 64GB (boot device)
SD 4-bit interface (boot device)

Networking

2x Gigabit Ethernet interfaces, opt. Wi-Fi + BT5.0

USB

1x USB 2.0 OTG port
up to 4x USB 2.0 using optional internal 2.0 HUB

Audio

1x I2S port

Serial Ports

2x UART (4-wires)
2x UART (2-wires)

Processor
MemoryCAN Bus

2x CAN interfaces

Other
Interfaces

12 x GPIOs
1x MIPI-CSI 2 Lanes Camera interface
1x General Purpose I2C Bus
2 x PWM ports

Security

TPM

EmbeddedController
Functionalities

Power management
Watchdog
Boot select signals
GP I/OPower Supply+5VDC ± 5% and +3.3V_RTC

Operating
SystemOperatingTemperature*

Linux
Yocto
0 ÷ +60°C (Commercial Range)-40 ÷ +85°C (Industrial Range)

Dimensions

82 x 50 mm*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

SECO is one of thefounding members of
SGET and a co-founderof the Qseven® standard

18

www.seco.com

Please visit www.seco.com to find the latest version of these datasheets

Please visit www.seco.com to find the latest version of these datasheets

www.seco.com

19SMARC

SMARC

SMARC

SMARC

SMARC® 2.1.1 module with Qualcomm® QCS5430 Processor

SMARC® 2.1.1 module powered by Qualcomm® QCS6490 Processor

SMARC® Rel. 2.1.1 module with MediaTek Genio 700
Applications Processors

SMARC® Rel. 2.1 compliant module with Intel® Atom® processors x7000E
Series, Intel® Core™ i3 processor, Intel® Processors N Series(Codename: Alder Lake-N)

SMARC® CoM for high performance low power
applications with QCS5430 processor

SMARC® CoM for high performance low power
applications with QCS6490 processor

High-performance multimedia Arm® processing
and AI acceleration

Power efficient deep learning inference and UHD
media processing within a small footprint

SOM-SMARC-QCS5430

SOM-SMARC-QCS6490

SOM-SMARC-Genio700

SOM-SMARC-ADL-N

Available in Industrial Temperature Range

Available in Industrial Temperature Range

CPU
QCS5430 processor

Processor

GRAPHICSFHD+ Qualcomm® Adreno™ 642L

Video
Interfaces
Video
Resolution

MemoryCONNECTIVITY
2x Gigabit Ethernet
MEMORYLPDDR5-6400 up to 12GB

Graphics

Qualcomm® Adreno™ 643L

Mass
StorageeMMC 5.1 drive soldered on-board, up to 64GB (boot device)
SD 4-bit interface (boot device) opt. UFS 2.x/3.1 flash
2x Gigabit Ethernet interfaces
Opt. Wi-Fi + BT5.0

Networking

SMARC
SMARC® Rel. 2.1.1 module with MediaTek Genio 510
Applications Processors

SMARC® Rel. 2.1.1 module with MediaTek Genio 510
Applications Processors
SOM-SMARC-Genio510

1x Arm® Cortex®-A78 @2.7 GHz, 3x Arm® Cortex®-A78 @2.4 GHz,and 4x Arm® Cortex®-A55 @1.8 GHz
Soldered-down LPDDR5-6400 memory, up to 12GB total, 32-bit
interface 2 channels
LVDS dual channel 18/24bit, eDP V1.4, MIPI DSI 4 lanes, Display Portthrough USB 3.1 Type C
Primary display: FHD+ @120 fps
Secondary display: up to 4k Ultra HD @60Hz

USB

1x USB 3.1, 1x USB 2.0 OTG, 1x USB 2.0 or 4x USB 2.0 (Hub option)

PCI-e

PCIe lanes Gen3: 2 ports x1 lanes, 1 port x2 lanes (QPS615)

CameraInterface

2x 4-Line MIPI CSI, with ISP support

Audio

2x I2S

Serial Ports

2x UART (RX/TX/RTS/CTS), 2x UART (RX/TX)CAN Bus

1xCAN via SPI

OtherInterfaces

I2C
Ultra Low Power RTC
2xPWM

Security

Processor

2x Arm® Cortex®-A78 @ 2.2 GHz
6x Arm® Cortex®-A55 @ 2.0 GHz
AI Accelerator: Cadence Tensilica VP6 with Mediatek APU3.0
System Companion Chip: MDSP RV55
DSP: Candence Tensilica HiFi5
Image Signal Processor (ISP)

MemorySoldered-down LPDDR4X-3733/LPDDR4-3200 memory, up to 8GB
total

Video
Interfaces

LVDS dual channel or eDP (factory alternatives)
HDMI®
DP

Video
Resolution

MIPI/eDP: up to 2560x1600p60
HDMI®/DP: up to 4K60

Mass
StorageeMMC 5.1 Drive soldered on-board, up to 64GB (boot device)
SDIO Interface

Graphics

Mali-G57 MC3 GPU

Networking

1x Gigabit Ethernet (RGMII)
1x 100Mbit Ethernet (USB)
Optional Wifi 802.11 a/b/g/n/ac 2x2 and BT 5.3 utilising onboard
module with M2.1216 standard form factor

USB

1x USB3.1
1x USB2.0 Host/Slave
4x USB2.0 Host

Audio

2x I2S port

Optional TPM 2.0 on-board

Serial Ports

EmbeddedController
Functionalities

FAN
Watchdog
Power Management
I/O Signals

2x UART (4-wires)
2x UART (2-wires)

CAN Bus

1x CAN interfaces (via SPI CAN Controller)

Power Supply

5V DC (+5V Standby opt)

Other
Interfaces

GPIOs
MIPI-CSI camera interface
General Purpose I2C Bus
PWM ports

Security

TPM

EmbeddedController
Functionalities

Power management
Watchdog
Boot select signals
GP I/OPower Supply+5VDC ± 5% and +3.3V_RTC

Operating
SystemLinux Yocto Kirkstone
Android T (13)OperatingTemperature*

0 ÷ +60°C (Commercial Range)-20 ÷ +85°C (Extended Commercial Range)-40 ÷ +85°C (Industrial Range)

Dimensions

82 x 50 mm

OperatingTemperature*

Microsoft Windows 11 IoT Enterprise
Yocto (Linux 64 Bit)
Android0 ÷ +60°C (Commercial Range)-30 ÷ +85°C (Industrial Range)

Dimensions

82 x 50 mm

Operating
System*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

Available in Industrial Temperature Range*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

CPU
MediaTek Genio 510
GRAPHICS
Mali G57 MC2 GPU
CONNECTIVITY
Up to 1x Gb Ethernet, 1x USB 3.1, 2x USB 2.0, 1x CAN, 4 x UART, opt Wi-Fi +BT 5.0, MIPI-CSI, 1x I2S

www.seco.com* Time Sensitive Network and Time Coordinate Computing

MemoryGraphics

Video
Interfaces
Video
Resolution
Mass
Storage

Networking

USB

PCI-e

Audio
Serial Ports

Other
Interfaces

Up to 16GB LPDDR5-4800 soldered down memory with IBECC (inband error correction code)
Integrated Intel® UHD Graphics driven by Intel® Xe architecture:•Intel® Atom® x7213E processors with 16 Execution Units•Intel® Atom® x7425E processors with 24 Execution Units•Intel® Atom® x7211E processors with 16 Execution Units•Intel® Core™ i3-N305 processors with 32 Execution Units•Intel® Processor N200 with 32 Execution Units•Intel® Processor N97 with 24 Execution Units•Intel® Processor N50 with 16 Execution Units
AVX256 & VNNI support for faster AI inference and media transcoding
Support with up to 3 independent 4K60 SDR displayseDP 1.3 or Dual Channel 18/24bit LVDS interface (factory alternatives)
2x DP++ multimode DP 1.4 / HDMI® 2.1 interface
2x MIPI CSI-2 inputs (1x 2-lanes and 1x 4-lanes)
Up to 4096x2160 @60Hz
1x external S-ATA Gen3.2 channel
Optional eMMC 5.1 drive soldered on-board
2x NBase-T Ethernet ports (2.5GbE supported) with Time-Sensitive
Networking functionality, implemented using as many Intel® i225
Gigabit Ethernet controllers, managed by two integrated PCH PCI-e
ports
Optional SERDES (SGMII) interface for additional third Gigabit Ethernet(factory option, alternative to fourth PCI-e lane)
6x USB 2.0 host ports
2x USB 3.2 Gen2 ports
4x PCIe Gen3 lanes
Possible channel aggregations:•
4 ports x1 lanes (4x1)•
1 port x2 lanes + 2 ports x1 lane (1x2 + 2x1) or SERDES in place offourth PCIe lane
HD Audio and Soundwire/i2S Audio interfaces
2x UARTs
2x HS-UARTs
Up to 14x GPIOs
SM busI2C bus1x SPI interface for boot1x General Purpose SPI or eSPI (factory alternatives)
Power management signals, watchdog

Power Supply+5VDC and +3VDC for RTC

Operating
SystemOperatingTemperature*

Microsoft® Windows 10
Linux Kernel LTS

Dimensions

50 x 82 mm

0°C to +60°C (Commercial version)*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

MEMORY
Soldered-down LPDDR4X-3733 memory, up to 8GB total

20

Processor

Intel® Atom® processors x7000E Series, Intel® Core™ i3 processor andIntel® Processors N Series (Codename: Alder Lake-N):•
Intel® Atom® x7213E, 2 Cores @1.7 GHz (3.2 GHz Turbo), 10W
TDP, with TSN and TCC*•
Intel® Atom® x7425E, 4 Cores @1.5 GHz (3.4 GHz Turbo), 12W
TDP, with TSN and TCC*•
Intel® Atom® x7211E, 2 Cores @1.0 GHz (3.2 GHz Turbo), 6W TDP,
with TSN and TCC*•
Intel® Core™ i3-N305, 8 Cores @1.8 GHz (3.8 GHz Turbo), 15W TDP•Intel® Processor N200, 4 Cores @1.0 GHz (3.7 GHz Turbo), 6W TDP•Intel® Processor N97, 4 Cores @2.0 GHz (3.6 GHz Turbo), 12W TDP•Intel® Processor N50, 2 Cores @1 GHz (3.4 GHz Turbo), 6W TDP

Please visit www.seco.com to find the latest version of these datasheets

Please visit www.seco.com to find the latest version of these datasheets

www.seco.com

21SMARC

SMARC

SMARC

SMARC® Rel 2.1.1 with Intel® Atom® x6000E Series and Intel® Pentium® and Celeron® N and J
Series processors (Codename: Elkhart Lake) for FuSa applications.

SMARC® Rel. 2.1.1 compliant module with NXP i.MX 8M Plus
Applications Processors

SMARC® Rel. 2.1.1 module with NXP i.MX 8X Applications Processors

The first SMARC module specifically designed for Functional Safety (FuSa)
of Safety-related systems

Low-power design for embedded applications ofmachine learning at higher levels

Safety-certifiable and efficient performance in
SMARC® Standard module

SOM-SMARC-MX8M-Plus

SOM-SMARC-MX8X

SOM-SMARC-EHL

Available in Industrial Temperature Range

Intel® Atom® x6000E CPUs certified for FuSa, compliant to IEC
61508 and ISO 13849 requirements for Functional Safety and Safety
Integrity Levels:
Atom® x6427FE Quad Core @1.9GHz (no Turbo) 12W TDP w/ IBECC,
IHS and TCC, FuSa Certified - Ind. Temp. Range
Atom® x6200FE Dual Core @1.0GHz (no Turbo) 4.5W TDP no Graphics
w/ IBECC, IHS and TCC, FuSa Certified- Ind. Temp. Range
Other Intel Atom® x6000E, Pentium® and Celeron® N and J Series
CPUs:
Celeron® J6413 Quad Core @ 1.8GHz (3.0GHZ Turbo) 10W TDP Comm. Temp. Range
Celeron® N6211 Dual Core @1.2GHz (3.0GHZ Turbo) 6.5W TDP Comm. Temp. Range
Pentium® J6426 Quad Core @2GHz (3.0GHZ Turbo) 10W TDP Comm. Temp. Range
Pentium® N6415 Quad Core @1.2GHz (3.0GHZ Turbo) 6.5W TDP Comm. Temp. Range
Atom® x6211E Dual Core @1.3GHz (3.0GHZ Turbo) 6W TDP w/ IBECC
and IHS - Ind. Temp. Range
Atom® x6413E Quad Core @1.5GHz (3.0GHZ Turbo) 9W TDP w/ IBECC
and IHS - Ind. Temp. Range
Atom® x6425E Quad Core @2GHz (3.0GHZ Turbo) 12W TDP w/ IBECC
and IHS - Ind. Temp. Range
Atom® x6212RE Dual Core @1.2GHz (no Turbo) 6W TDP w/ IBECC, IHS
and TCC - Ind. Temp. Range
Atom® x6414RE Quad Core @1.5GHz (no Turbo) 9W TDP w/ IBECC,
IHS and TCC - Ind. Temp. Range
Atom® x6425RE Quad Core @1.9GHz (no Turbo) 12W TDP w/ IBECC,
IHS and TCC - Ind. Temp. Range

Processor

Available in Industrial Temperature Range

Other
Interfaces

Up to 14x GPIOs
SM BusPower Management Signals
I2C Bus1x SPI interface for boot1x General Purpose SPI or eSPI (Factory Alternatives)

Video
Interfaces
Video
Resolution
Mass Storage

Networking

USB

22

Max Cores

4+1

Max Cores
MemoryPower Supply+5VDC and +3.3V_RTC

MemorySoldered down LPDDR4-4000 memory, 32-bit interface, up to 6GB

Operating
SystemOperatingTemperature*

Microsoft® Windows 10 Enterprise (64 bit)Linux Yocto 64-bit

NPU

2.3 TOPS Neural Network performance (not for Quad Lite)

Dimensions

50 x 82 mm-40°C ÷ +85°C (Industrial version)
Graphics*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.
Video
Interfaces
Video
Resolution

Integrated Graphics Processing Unit GC7000UL, supports 3
independent displays.
Embedded VPU, supports HW decoding of HEVC/H.265, AVC/H.264,
MPEG-4, MPEG-2, MVC, VC-1, RV, VP6, VP7, VP8, VP9, JPEG, HW
encoding of HEVC/H.265, AVC/H.264
Supports OpenVG 1.1, OpenGL ES 3.1, OpenCL 1.2 Full Profile andVulkanUp to 3 video display interfaces
HDMI® 2.0a interface, supporting HDCP 2.2 and HDCP 1.4/1.3
2xLVDS Single Channel / 1xLVDS Dual Channel or eDP + 1xLVDS Single
Channel (factory alternatives)
HDMI®, LVDS, eDP

NXP i.MX 8X family SoCs: Dual or Quad Arm® Cortex®-A35 Cores + 1x
Cortex® M4F core for real-time processing•

Graphics

Video
Interfaces

Up to 1920 x 1080p @60
Video
Resolution

PCI-e

Up to 1x PCI-e x1 Gen3 port

USB

Audio

2x I2S Audio interfaces

Serial Ports

2x 2-wires UART
2x 4-wires UARTCAN Bus

2x CAN interfaces

Up to 4096x2160 @60Hz

Other
Interfaces

1 x external S-ATA Gen3 Channel
SDIO interface
Optional eMMC 5.1 drive soldered on-board (Safety Related)
2x Gigabit Ethernet PHY with precision clock synchronization andsynchronous Ethernet clock output for IEEE 1588 (Safety Related –Black channel).
Optional SERDES (SGMII) Interface for additional third Gigabit
Ethernet (factory option, alternative to fourth PCI-e lane)
6 x USB 2.0 Host Ports
2 x USB 3.1 Gen2 Ports

1x 4-lanes CSI camera interface
1x 2-lanes CSI camera interface
2x PWM
Up to 14x GPIOs
I2C bus
SM bus
SPI interface
QuadSPI interface
Watchdog
Boot select signals
Power Management Signals

Power Supply+5VDC and +3.3V_RTC

Operating
SystemLinux
Android

Mass Storage
Networking
USB

PCI-e

Up to 4 x PCI-e Gen3 Lanes

OperatingTemperature*

0°C ÷ +60°C (Commercial version)-40°C ÷ +85°C (Industrial version)

Audio

HD Audio interface

Dimensions

50 x 82 mm (1.97” x 3.23”)

Serial Ports

2 x HS-UARTs (Safety Related)
2 x UARTs

CAN Bus2x

www.seco.com*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

Please visit www.seco.com to find the latest version of these datasheets

Please visit www.seco.com to find the latest version of these datasheets••

Soldered onboard eMMC 5.1 Drive, up to 64GB
SD 4-bit interface
Up to 2 x Gigabit Ethernet interfaces
Optional WiFi + BT LE module onboard
Up to 2 x USB 2.0 Host Ports
2 x USB 3.0 Host Ports
1 x USB 2.0 OTG port

32-bit LPDDR4x Soldered Down Memory
Up to 16GB Quad Channel with In-Band Error Correction Code(IBECC, Safety Related feature) supported
4GB Dual Channel, 8GB or 16GB Quad Channel supported
Speed: 4267MT/s single rank (1GB / 2GB / 4GB / 8GB), 3733MT/s dual
rank (16GB)
Up to 3 independent displays
Integrated Gen11 UHD Graphics controller with up to 32 EU
4K HW decoding and encoding of HEVC (H.265), H.264, VP8/VP9,
WMV9/VC1 (decoding only)
DirectX 12.1, OpenGL ES 3.1, OpenGL 4.5, OpenCL™ 1.2, Vulkan 1.0
eDP 1.3 or Dual Channel 18/24bit LVDS interface (factory options)
2 x DP++ 1.4 or 1x DP++ 1.4 and 1x HDMI® 1.4 interfaces

Graphics

Processor

Processor

FuSa Interface signals for IEC 61508 and ISO 13849

4

MemoryNXP i.MX 8M Plus family SoCs: Dual or Quad Arm® Cortex®-A53 Cores+ general purpose Cortex® M7 800MHz processor•
NXP i.MX 8M Plus Quad, 4x Arm® Cortex®-A53 Cores up to
1.8GHz•NXP i.MX 8M Plus Dual, 2x Arm® Cortex®-A53 Cores up to
1.8GHz•NXP i.MX 8M Plus Quad Lite, 4x Arm®Cortex®-A53 Cores up to
1.8GHz, no VPU / NPUFunctional
Safetyfeatures(*) IHS: Integrated Heatspreader; TCC: Time Coordinated Computing

Max Cores

Available in Industrial Temperature Range

Mass
Storage
Networking

NXP i.MX8 QuadXplus, 4x Arm® Cortex®-A35 Cores + 1x Cortex®
M4F core for real-time processing
NXP i.MX8 DualXplus, 2x Arm® Cortex®-A35 Cores + 1x Cortex®
M4F core for real-time processing
NXP i.MX8 DualX, 2x Arm® Cortex®-A35 Cores

4+1
Soldered down LPDDR4 memory @ 1200MHz, 32-bit interface, up
to 4GB
Embedded GC7000Lite GPU
Supports OpenGL 3.0, 2.1, OpenGL ES 3.1, OpenCL 1.2 Full Profile and1.1, OpenVG 1.1, and Vulkan
Embedded VPU, supports HW decoding of HEVC/H.265, AVC/H.264,
MPEG-2, VC-1, RV10, VP8, H.263 and MPEG4.2t, HW encoding of
AVC/H.264
2 independent displays supported
Factory alternatives:•
2x LVDS / Mipi-DSI Single Channel or 1xLVDS / Mipi-DSI Dual
Channel 18-/24-bit interface•
LVDS / Mipi-DSI Single Channel 18-/24-bit interface + HMDI
interface•eDP 4-lane interface + LVDS / Mipi-DSI single Channel 18-/24-bit
interface•eDP 4-lane interface + HMDI interface
MIPI-DSI, LVDS, eDP, HDMI® Up to 1920 x 1080 @ 60Hz
Optional Soldered onboard eMMC 5.1 Drive, up to 64GB
SD 4-bit interface
QSPI NOR Flash soldered on-board
Up to 2 x Gigabit Ethernet interfaces
On-board WiFi 802.11 a/b/g/n + BT LE 5.0 module, optional
Up to 3 x USB 2.0 Host Ports
2 x USB 3.0 Host Ports

PCI-e

1x PCI-e 3.0 x1 port

Audio

Up to 2x I2S Audio interfaces

Serial Ports

2x 2-wires UART
2x 4-wires UARTCAN Bus

2x CAN interfaces

Other
Interfaces

1x 4-lanes CSI camera interface
2x PWM
Up to 14x GPIOs
I2C bus
SM bus
SPI interface
QuadSPI interface
Watchdog
Boot select signals
Power Management Signals

Power
SupplyOperating
SystemOperatingTemperature*
Dimensions+5VDC and +3.3V_RTC
Linux
Android
0°C ÷ +60°C (Commercial version)-40°C ÷ +85°C (Industrial version)
50 x 82 mm (1.97” x 3.23”)*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

www.seco.com

23

SMARCSMARC

DEVELOPMENT KITSMARC® Rel. 2.1.1 module with NXP i.MX 8M Applications Processors

SMARC 2.0 / 2.1.1 Development Kit

Standard solution for next generation multimedia
applications

Cross Platform Philosophy Development Kit for
SMARC Rel. 2.0 / 2.1.1 compliant modules

SOM-SMARC-MX8M

DEV-KIT-SMARC
Cross-compatible
platform with x86
and Arm® solutions

SCHEMATICS
PUBLICLY AVAILABLE

Available in Industrial Temperature RangeCPU
NXP i.MX 8M Applications Processors
GRAPHICS
Integrated Graphics Processing Unit, supports 2 independent displays
CONNECTIVITY
WiFi + BT LE; CSI camera; QuadSPI interface; 14 x GPI/OsMEMORYUp to 4GB soldered down LPDDR4-3200 memory, 32-bit interface

SMARC
SMARC® Rel. 2.1.1 module with Intel® Atom® X Series, Intel® Celeron® J / N
Series and Intel® Pentium® N Series (Codename: Apollo Lake) Processors

High performance, low power and feature-rich

FEATURES OF CSM-B79

Video
Interfaces

LVDS/MIPI-DSI connector, interface shared with 2x eDP connectors
Backlight control + LCD selectable voltages dedicated connector
2xDP++ connectors
HDMI connector (can be used in alternative to 1xDP++)2x CSI Camera input interfaces

Mass
Storage

SATA M 7p connector with dedicated power connector, interface
shared with M.2 Socket 2 2230 / 2242 / 2260 Key B SSD slot
microSD Card Slot

Networking

Up to 2xDual RJ-45 Gigabit Ethernet connectors
M.2 Socket1 2230 Key E Slot for WiFi/BT Modules (interface shared with
PCI-e x 4 slot)
M.2 Socket2 2260 / 3042 Key B Slot for WWAN Modem Modules(interface shared with PCI-e x 4 slot), connected to on-board microSIM
slot

USB Ports

1 x USB 3.0 type A Socket
1 x USB 2.0 type A Socket
1 x USB OTG micro-AB Socket
1 x USB 3.1 Type-C Socket

PCI-e

PCI-e x4 slot, interface shared with M.2 Slots

Audio

TRSS Mic In + Line Out Audio Jack
Onboard I2S Audio Codec (TI TLV320AIC3204) + HD Audio Codec(Cirrus Logic CS4207)
I2S Audio header

Serial Ports

2 x CAN ports
2 x RS-232/RS-422/RS-485 configurable serial ports on internal pinheader
2 x Serial ports (Tx/Rx signals only, TTL level) on feature pin header

Other
InterfaceseSPI pin header + Flash Socket
SPI pin header + Flash Socket
I2C EEPROM Socket
4 x 7-segment LCD displays for POST codes
Feature pin header with 2 x Serial ports, I2C, SM Bus, Watchdog andPower Management Signals
GPIO / FuSa pin header
FAN connector
Optional Debug USB port on micro-B connector
Boot selection switches
JTAG connector
Selector for SMARC 2.0 / 2.1 pinout compatibility

PowerSupply9-24V through dedicated Mini-Fit Jr 2x2 power connector
6-17V through 2/3/4 Cell Smart Battery Connector
RTC Coin cell battery holder

SOM-SMARC-APL

Operating-40°C ÷ +85°C
Temperature*
Dimensions
Available in Industrial Temperature Range
CPUIntel® Atom® X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly
Apollo Lake) Processors

243.84 x 243.84mm (microATX)*All carrier board components must remain within the operating temperature at any andall times, including start-up; carrier operating temperature is independent of the module
installed. Please refer to the specific module for more details. Actual temperature will
widely depend on application, enclosure and/or environment. Upon customer to consider
specific cooling solutions for the final system.

GRAPHICSIntel® HD Graphics 500 series controller with up to 18 Execution Units
CONNECTIVITY
2x GbE; 2x USB 3.0; 6x USB 2.0; 4x PCI-e
MEMORY
Dual Channel Soldered Down LPDDR4-2400 memory24

www.seco.com

Please visit www.seco.com to find the latest version of these datasheets

Please visit www.seco.com to find the latest version of these datasheets

www.seco.com

25Com Express®

Com Express®

Com Express®

DEVELOPMENT KIT

COM Express® Rel.3.0 Basic Type 7 module, with the Intel® Xeon® D-1700
processors (Codename: Ice Lake- D)

Cross Platform Development Kit compatible with both x86 and Arm®
COM Express® Type 7 modules

COM Express® CoM with high performance Intel®
SoCs for secure IoT applications

Platform independent kit forfast Time-to-market

SOM-COMe-BT7-ICL-D

DEV-KIT-COMe-T7
Cross-compatible
platform with x86
and Arm® solutions

SCHEMATICS
PUBLICLY AVAILABLE

Com Express® Standard Advantages
Available in Industrial Temperature Range

Extremelow power
designFEATURES OF CCOMe-C79

CPUIntel® Xeon® D-1700 processors

Low profile
designNETWORKING
4x 10GBASE-KR interfaces + 1x 1GbE port with NC-SI
CONNECTIVITY
4x Superspeed USB 5Gbps; 16x PCI-e Gen4 lanes + 16x PCI-e Gen3 lanes
MEMORYUp to four DDR4 SO-DIMM Slots supporting DDR4-2933 memory with ECC,
up to 128GB

Up to four
displayinterfaces

Dualethernet

Mass
Storage

2x S-ATA 7p M connectorsµSD Card slot (interface multiplexed with GPIO header)

Networking

1x GbEthernet RJ-45 connector
4x 10Gbase-KR interfaces on OCP Type-C connector
4x MDIO I2C interfaces on internal pin header
4x SDP interfaces on SMA RF connectors

USB

4x USB 3.1 Host ports on Dual Type-A sockets

PCI-e

2x PCI-e x4 Slots
1x PCI-e x8 Slot
1x PCI-e x16 Slot

Serial Ports

2 x RS-232 ports on dedicated pin header (from module)

Other
Interfaces

BMC connector with SM Bus, I2C, LPC, 1x USB 2.0, 1x PCI-e x1, NCSI
signals
4 x GPI + 4 x GPO pin header (interface multiplexed with µSD slot)
SPI Flash Socket
Button / LEDs front panel header
4-pin tachometric FAN connector
I2C + SM Bus on feature Pin header
I2C Flash Socket
SM Bus Smart Battery Connector
4 x 7-segment LCD displays for POST codes
LPC/eSPI internal header
USB Overcurrent header
JTAG connector
FuSa header
SPI Flash header
BuzzerPower
SupplyATX 24 poles connector for carrier board working only
Auxiliary 12V connector for carrier board working only
12 VDC power in connector for COM Express module’s working
Cabled Coin-cell connector for RTC

OperatingTemperature*

0°C ÷ +60°C (Commercial version)

Dimensions

305x244mm (ATX form factor, 12” x 9.6”)

BASIC: 125X95 mm
COMPACT: 95X95 mm
Com Express®
COM Express® Rel.3.0 Basic Type 7 module with the AMD EPYC
Embedded 3000 Series of SoCs™

Computer-On-Module Approach

Scalable offerings with outstanding performanceand more connectivity

Design investment limited to the carrier board | Consolidated standard form factor | Scalable and future-proof
Long-term availability | Arm® and x86 cross-compatibility | Multi-vendor solution | Highly configurable
Innovative and upgradable | Accelerated time-to-market

SOM-COMe-BT7-E3000

Com Express® interfaces
Interface

26

Type 6 Type 7(Min / Max) (Min / Max)

Interface

Type 6 Type 7(Min / Max) (Min / Max)

Interface

Type 6 Type 7(Min / Max) (Min / Max)PCI Express Lanes 0 - 5

1/6

6/6

SATA Ports

1/4

0/2

Speaker Out

1*

1*

PCI Express Lanes 6 - 15

0/2

0 / 10HDA Digital Interface

0/1

N.A.

Carrier Board BIOS Flash Support

0/1

0/1

PCI Express Lanes 16 - 31

0 / 160 / 16

USB 2.0 Ports

4/8

4/4

Reset Functions

1*

1*

PCI Express Graphics (PEG)

0/1

NA

USB0 Client

0/1

0/1

Trusted Platform Module

0/1

0/1
0/1

10G LAN Ports 0 - 3

N.A.

0/4

USB7 Client

0/1

N.A.

Thermal Protection

0/1

NC-SI

N.A.

0/1

USB 3.0 Ports

0/4

0/4

Battery Low AlArm®

0/1

0/1

1Gb LAN Port 0

1*

1*

LPC Bus or eSPI

1*

1*

Suspend/Wake Signals

0/3

0/3

DDIs 1 - 3

0/3

N.A.

SPI (Devices)

1/2

1/2

Power Button Support

1*

1*

LVDS Channel A

0/1

N.A.

Rapid Shutdown

0/1

0/1

Power Good

1*

1*

LVDS Channel B

0/1

N.A.

SDIO (muxed on GPIO)

0/1

0/1

Sleep Input

0/1

0/1

eDP on LVDS 1st channel

0/1

N.A.

General Purpose I/O

8/8

8/8

Lid Input

0/1

0/1

VGA Port

0/1

N.A.

SMBus

1*

1*

Carrier Board Fan Control

0/1

0/1

Serial Ports

0/2

0/2

I2C

1*

1*

CAN interface on SER1

0/1

0/1

Watchdog Timer

0/1

0/1

www.seco.com*All carrier board components must remain within the operating temperature at any andall times, including start-up; carrier operating temperature is independent of the module
installed. Please refer to the specific module for more details. Actual temperature will
widely depend on application, enclosure and/or environment. Upon customer to consider
specific cooling solutions for the final system.

*Mandatory interface

Please visit www.seco.com to find the latest version of these datasheets

Available in Industrial Temperature Range
CPU
AMD EPYC™ Embedded 3000 family of SoCs
NETWORKING
4x 10GBASE-KR interfaces + 1x 1GbE port with NC-SI
CONNECTIVITY
4x USB 3.1; 24x PCI-e Gen3 lanes
MEMORY
Four DDR4 SO-DIMM Slots supporting DDR4-2666 Memory with ECC, up to 128GB

Please visit www.seco.com to find the latest version of these datasheets

www.seco.com

27

Com Express®

Com Express®

Com Express®

Com Express®

COM Express® 3.1 Type 6 Compact Module with Intel Atom® Processors
x7000E Series (Codename: Amston Lake and Alder Lake N)

COM Express® 3.1 Type 6 Basic Module with Intel® Core™ Ultra Processors
Family (Codename: Meteor Lake -H and -U)

COM Express® 3.1 Type 6 Basic Module with 13th Gen
Intel® Core™ processors (Raptor Lake-P)

COM Express® 3.1 Type 6 Compact Module with Intel® Atom® x6000E
Series, Intel® Pentium® and Celeron® N and J Series Processors (Codename:Elkhart Lake)Intel® Next Gen Atom® CPU in high-performance
COM Express® with rugged efficiency

Performance, adaptability, energy-efficiency
with Intel® Core™ Ultra CPU

Intensive video processing and AI-based analytics foredge devices in challenging environments

Cost-Effective, Low Power Computing with RealTime Options

SOM-COMe-CT6-ASL

SOM-COMe-BT6-MTL

SOM-COMe-BT6-RPL-P

SOM-COMe-CT6-EHL

Available in Industrial Temperature Range

Available in Industrial Temperature Range

Intel® Atom® Processors x7000RE (Codename: Amston Lake) Series:•Intel Atom® x7835RE Eight Core @ 1.3GHz (3.6GHz turbo) 12W
TDP w/ TSN and TCC, industrial•
Intel Atom® x7433RE Quad Core @ 1.5GHz (3.4GHz turbo) 9W
TDP w/ TSN and TCC, industrial•
Intel Atom® x7213RE Dual Core @ 2GHz (3.4GHz turbo) 9W TDP
w/ TSN and TCC, industrial•
Intel Atom® x7211RE Dual Core @ 1GHz (3.2GHz turbo) 6W TDP
w/ TSN and TCC, industrial
Intel Atom® Processors x7000E (Codename: Alder Lake N) Embedded
E Series•
Intel Atom® x7425E Quad Core @1.5GHz (3.4GHZ turbo) 12W
TDP w/ TSN and TCC, commercial•
Inte Atom® x7213E Dual Core @1.7GHz (3.2GHZ turbo) 10W TDP
w/ TSN and TCC, commercial•
Intel Atom® x7211E Dual Core @1GHz (3.2GHZ turbo) 6W TDP w/
TSN TCC, commercial
Intel® Core™ i3 Processors and Intel® Processor N Series (Codename:
Alder Lake N) PC Client Processors•
Intel® Core™ i3-N305 Eight Core @1GHz / 1.8GHz (3.8GHZ turbo)
9W/15W TDP w/o TSN and w/o TCC, commercial•
Intel® Processor N200 Quad Core @1GHz (3.7GHZ turbo) 6W
TDP w/o TSN and w/o TCC - commercial•
Intel® Processor N97 Quad Core @2GHz (3.6GHZ turbo) 12W
TDP w/o TSN and w/o TCC - commercial•
Intel® Processor N50 Dual Core @1GHz (3.4GHZ turbo) 6W TDP
w/o TSN and w/o TCC - commercial

Processor(*) TCC: Time Coordinated Computing

System Memory(**) TSN: Time Sensitive Networking

Video
Interfaces
Video
Resolution
Mass
Storage
Networking
USB
Audio

Graphics(*) IBECC: In-Band Error-Correcting Code memory

Video
Interfaces
Video
Resolution
Mass
Storage
Networking
USB
Audio
PCI-e

PCI-e

Up to 6x PCI-e Gen3 lanes

Serial Ports

2x UARTs

Other
Interfaces

SPI, 2x I2C, SM Bus, Thermal Management, FAN management
Optional eSPI or LPC bus (factory alternatives)
Optional TPM 1.2/2.0 on-board
LID#/SLEEP#/PWRBTN#, watchdog
4x GPI, 4x GPO
Optional 2x CSI camera interfaces

Other
Interfaces+12VDC ± 10%, +5VSB (optional), +3VRTC (optional)

Operating
System

Power
SupplyOperatingTemperature*

Microsoft® Windows 10 IoT Enterprise 2019 LTSC
Microsoft® Windows 10 IoT Enterprise 2021 LTSC
Edgehog OS (Yocto)
0°C ÷ +60°C (Commercial version)-40°C ÷ +85°C (Industrial version)

Dimensions

95 x 95 mm (COM Express® Compact Form factor, Type 6 pinout)

Operating
System*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

28

System Memory

One DDR5 SO-DIMM slot supporting DDR5-4800 IBECC modules, up
to 16GB
Integrated Intel® Gen12 UHD graphics controller with up to 32 EU
Support up to 3 independent displays
2x Digital Display Interfaces (DDIs), supporting DP, HDMI®, DP AltMode over Type-C
1x DDI Interface supporting DP / HDMI®
1x eDP or Single/Dual-Channel 18-/24-bit LVDS interface (factory
alternatives)
HDMI®: up to 4Kx2K @60Hz according to HDMI 2.0b
DP 1.4, eDP 1.4: 4096x2304@60 Hz
LVDS up to 1920x1200 @ 60Hz
Up to 2x S-ATA Gen3 channels
Optional eMMC 5.1 drive soldered on-board
1x NBase-T Ethernet interface with MaxLinear GPY211/215 GbE
controller, supporting 2.5GbE and TSN.
Up to 2x USB 10Gbps
Optional 3x USB 5Gbps
8x Hi-Speed USB ports
HD Audio interface
SoundWire Interface

Graphics

Processor

www.seco.com

Serial Ports

Power
SupplyIntel® Core™ Ultra Processors Family (Codename: Meteor Lake-H) 20/28/65W base power:•Intel® Core™ Ultra 7 processor 165H with vPRO, 6 P-Cores with
HT @1.4 GHz (turbo 5.0 GHz) + 8 E-Cores @0.9 GHz (turbo 3.8
GHz), 24M cache•Intel® Core™ Ultra 7 processor 155H, 6 P-Cores with HT @1.4 GHz(turbo 4.8 GHz) + 8 E-Cores @0.9 GHz (turbo 3.8 GHz), 24M cache•Intel® Core™ Ultra 5 processor 135H with vPRO, 4 P-Cores with
HT @1.7 GHz (turbo 4.6 GHz) + 8 E-Cores @1.2 GHz (turbo 3.6
GHz), 18M cache•Intel® Core™ Ultra 5 processor 125H, 4 P-Cores with HT @1.2 GHz(turbo 4.5 GHz) + 8 E-Cores @0.7 GHz (turbo 3.6 GHz), 18M cacheIntel® Core™ Ultra Processors Family (Codename: Meteor Lake- U) 12/15/28W Base Power:•Intel® Core™ Ultra 7 processor 165U with vPRO, 2 P-Cores with
HT @1.7 GHz (turbo 4.9 GHz) + 8 E-Cores @1.2 GHz (turbo 3.8
GHz), 12M cache•Intel® Core™ Ultra 7 processor 155U, 2 P-Cores with HT @1.7 GHz(turbo 4.8 GHz) + 8 E-Cores @1.2 GHz (turbo 3.8 GHz), 12M cache•Intel® Core™ Ultra 5 processor 135U with vPRO, 2 P-Cores with
HT @1.6 GHz (turbo 4.4 GHz) + 8 E-Cores @1.1 GHz (turbo 3.6
GHz), 12M cache•Intel® Core™ Ultra 5 processor 125U, 2 P-Cores with HT @1.3 GHz(turbo 4.3 GHz) + 8 E-Cores @0.8 GHz (turbo 3.6 GHz), 12M cache
Two DDR5 SO-DIMM slot supporting DDR5-5600 IBECC modules,
up to 64GB(*) IBECC: In-Band Error-Correcting Code Memory

Integrated Intel® Xe LPG graphics controller with up to 8 Xe cores (128 EU)
Support up to 4 independent displays
3x Digital Display Interfaces (DDIs), supporting DP, HDMI®
1x eDP or Single/Dual-Channel 18-/24-bit LVDS interface (factory
alternatives)
2x MIPI CSI channels with single on-board connector (factory option)
HDMI®: up to 8K60 according to HDMI® 2.1
DP 2.1: up to 8K60Hz / 5K120Hz
eDP 1.4b: up to 4K120Hz HDR
Max resolution 4x4K60Hz
Up to 2x S-ATA Gen3.2 channels (factory alternative to on-board
NVMe + 1 PEG x4)
Optional NVMe SSD (PCIE-e x4 interface) soldered on-board, up to
512GB
1x NBase-T Ethernet interface with Intel® I226 GbE controller,
supporting 2.5GbE and TSN
Up to 4x USB 10Gbps interfaces
Up to 8x Hi-Speed USB interfaces
HD AudioSoundwire Audio interfaces
1x PEG x8 Gen4 (with H series processors only)
1x PEG x4 Gen4 (factory alternative to 2x SATA)
8x PCI-e lanes Gen4 (allowed groupings x4, x2, x1)
2x UARTs
SPI, I2C, SM Bus, thermal management, FAN management
eSPI or LPC bus (factory alternatives)
TPM 2.0 on-board (factory option)
LID#/SLEEP#/PWRBTN#, watchdog
4 x GPI, 4 x GPO
Main: +8Vdc ÷ +20Vdc
Auxiliary: +5V_SBY, +3V_RTC
Microsoft® Windows 10 IoT Enterprise 2019 LTSC
Microsoft® Windows 10 IoT Enterprise 2021 LTSC
Yocto Kirkstone

OperatingTemperature*

0°C ÷ +60°C (Commercial version)

Dimensions

125 x 95 mm (COM Express® Basic Form factor, Type 6 pinout)

Available in Industrial Temperature Range

13th Gen Intel® Core™ processors (Raptor Lake U/P/H series) andIntel® Processor U300E

Processor

U series, up to
10C (2P+8E)

P series, up to
14C (6P+8E)

H series, up to
14C (6P+8E)

P-Core base/turbo

1.7/4.9GHz

1.9/4.8GHz

2.5/5.0GHz

E-Core base/turbo

1.2/3.7GHz

1.2/3.7GHz

1.8/4.0GHz

Cache

Up to 12M

Up to 24M

Up to 24M

TDP

15W

28W

45W

MemoryTwo DDR5 SO-DIMM slots supporting DDR5-4800, IBECC modules
memory, up to 64GB

Graphics

Intel® UHD Graphics/Intel® Iris® Xe Graphics architecture, up to 96 EU
Improved image (IPU6EP) and video processing (AV1/GNA 3.0)
Support up to 4 independent displays @ 4K

Video
Interfaces

Up to 3x Digital Display Interfaces (DDIs), supporting DVI, DP 1.4,
HDMI® 2.1
1x VGA (factory option)
1x eDP 1.3 or single/dual-channel 18-/24-bit LVDS interface (factory
alternatives)

Video
Resolution

HDMI® and DP up to 8K @ 60Hz via TCSS with Hayden BridgeeDP 1.4b up to 5K @ 120Hz (HBR3 with VDSC1.1)
LVDS up to 1920x1200 @ 60Hz

Mass
Storage

2x SATA Gen3 channels
Up to 128 GB on-board NVMe SSD (factory alternative to one PCIexpress Graphics (PEG) x4 Gen4)

Networking

1x NBase-T Ethernet interface with Intel® I225 GbE controller, with
TSN and 2.5GbE supportedUSB

Up to 2x USB 4 Gen2 host ports (depending on carrier board retimer
implementation)
4x USB 3.2 Gen2 (10Gbps) host ports (depending on carrier board
retimer implementation)
8x USB 2.0 host ports

PCI-e

Up to 8x PCI-e x1 Gen3 lanes
1x PCI-express Graphics (PEG) x8 Gen4
Up to 2x PCI-express Graphics (PEG) x4 Gen4

Audio

HD audio and Soundwire/i2S audio interfaces

Serial Ports

2x UARTs

Other
Interfaces

SPI, I2C, SM Bus, Thermal Management, FAN management
Optional eSPI or LPC bus (factory alternatives)
Optional TPM 2.0 on-board
LID#/SLEEP#/PWRBTN#, Watchdog
4 x GPI, 4 x GPO

Power
Supply+12VDC ± 10%, +5VSB (optional), +3VRTC (optional)

Operating
SystemMicrosoft® Windows 10
Linux Ubuntu

OperatingTemperature*

0°C to +60°C (commercial version)-40°C to +85°C (industrial version)

Dimensions

125 x 95 mm (COM Express® Basic Form factor, Type 6 pinout)*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

(*)IBECC: In-Band Error-Correcting Code memory(**)TCC: Time Coordinated Computing

MemoryTwo DDR4 SO-DIMM slots supporting DDR4-3200 IBECC modules
memory, up to 32GB

Graphics

Integrated Intel® Gen11 UHD Graphics controller with up to 32 EU
Support up to 3 independent displays

Video
Interfaces

Up to 2x Digital Display Interfaces (DDIs), supporting DVI, DP 1.4,
HDMI® 1.4
1x eDP 1.3 or Single/Dual-Channel 18-/24-bit LVDS interface (factory
alternatives)

Video
Resolution

DP 1.4 and HDMI® 1.4:
eDP 1.3:
LVDS:

Mass
Storage

2x S-ATA Gen3 channels
Optional eMMC 5.1 drive soldered on-board

Networking

1x NBase-T Ethernet interface with MaxLinear GPY211/215 GbE
controller, with 2.5GbE supportedUSB

Up to 4x USB 3.2 Gen 1 host ports
Up to 8x USB 2.0 host ports

PCI-e

Up to 6x PCI-e Gen3 lanes
Groupings:•#1 x4 + #2 x1•#2 x2 + #2 x1
•
#6 x1

Audio

HD audio interface

Serial Ports

Up to 2x UARTs
1x CAN (factory alternative to one UART)

OtherInterfaces

SPI, I2C, SM bus, thermal management, FAN management
Optional eSPI or LPC bus (factory alternatives)
Optional TPM 1.2/2.0 on-board
LID#/SLEEP#/PWRBTN#, watchdog
4x GPI, 4x GPO

Power
Supply8VDC ± 20VDC , +5VSB (optional), +3VRTC (optional)"

Operating
SystemMicrosoft® Windows 10 IoT Enterprise 2019 LTSC
Microsoft® Windows 10 IoT Enterprise 2021 LTSC
Yocto Kirkstone

OperatingTemperature*

0°C to +60°C (commercial version)-40°C to +85°C (industrial version)

Dimensions

95 x 95 mm (COM Express® Compact Form factor, Type 6 pinout)

up to 4096x2160@60 Hz
up to 4096x2160@60 Hz
up to 1920x1200 @60Hz*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

Please visit www.seco.com to find the latest version of these datasheets

Processor

Intel® Atom® x6000E Series, and Intel® Pentium® and Celeron® N and
J Series Processors:Intel® Celeron® J6413 Quad Core @ 1.8GHz (3GHz Turbo) 10W TDP, Com.
Intel® Pentium® J6426 Quad Core @2.0GHz (3GHz Turbo) 10W TDP, Com.
Intel® Celeron® N6211 Dual Core @1.2GHz (3GHz Turbo) 6.5W TDP, Com.
Intel® Pentium® N6415 Quad Core @1.2GHz (3GHz Turbo) 6.5W TDP, Com.
Intel® Atom® x6211E Dual Core @1.2GHz (3GHz Turbo) 6W TDP, IBECC, Ind.
Intel® Atom® x6413E Quad Core @1.5GHz (3GHz Turbo) 9W TDP,IBECC, Ind.
Intel® Atom® x6425E Quad Core @2.0GHz (3GHz Turbo) 12W TDP,IBECC, Ind.
Intel® Atom® x6212RE Dual Core @1.2GHz (no Turbo) 6W TDP, IBECC,
TCC, Ind.
Intel® Atom® x6414RE Quad Core @1.5GHz (no Turbo) 9W TDP, IBECC,
TCC, Ind.
Intel® Atom® x6425RE Quad Core @1.9GHz (no Turbo) 12W TDP, IBECC,
TCC, Ind.

Please visit www.seco.com to find the latest version of these datasheets

www.seco.com

29Com Express®

Com Express®

Com Express®

Com Express®

COM Express® Rel. 3.0 Compact Type 6 Module with
11th Gen Intel® CoreTM (Codename: Tiger Lake UP3) Processors

COM Express® 3.0 Type 6 Compact Module with AMD Ryzen™
Embedded V2000 SoCs

COM Express® Rel. 3.0 Compact Type 6 module with the AMD Ryzen™
Embedded R1000 family of SoCs

COM Express® 3.0 Compact Type 6 Module with Intel® Atom® X, Celeron®
J/N Series, Pentium® N Series (Codename: Apollo Lake) Processors

High-performance, responsive CPU and GPU
compute in COM Express® Compact form factor

High performance AMD Ryzen™ core for graphics
and compute demanding edge applications

Low-end AMD Ryzen™ on COM Express®
Type 6 Compact

Rugged solution for industrial environment

SOM-COMe-CT6-TGL-U

SOM-COMe-CT6-V2000

SOM-COMe-CT6-R1000

SOM-COMe-CT6-APL

Available in Industrial Temperature Range

Intel® Core™ i7-1185G7E, Quad Core @2.8GHz (4.4GHz Turbo Boost),
12MB Cache, 28W TDP (12W cTDP), with HyperthreadingIntel® Core™ i5-1145G7E, Quad Core @2.6GHz (4.1GHz Turbo Boost),
8MB Cache, 28W TDP (12W cTDP), with HyperthreadingIntel® Core™ i3-1115G4E, Dual Core @3.0GHz (3.9GHz Turbo Boost),
6MB Cache, 28W TDP (12W cTDP), with HyperthreadingIntel® Core™ i7-1185GRE, Quad Core @2.8GHz (4.4GHz Turbo Boost),
12MB Cache, with IBECC, 28W TDP (12W cTDP), with Hyperthreading- Industrial
Intel® Core™ i5-1145GRE, Quad Core @2.6GHz (4.1GHz Turbo Boost),
8MB Cache, with IBECC, 28W TDP (12W cTDP), with Hyperthreading- Industrial
Intel® Core™ i3-1115GRE, Dual Core @3.0GHz (3.9GHz Turbo Boost),
6MB Cache, with IBECC, 28W TDP (12W cTDP), with Hyperthreading- Industrial

Processor

ChipsetIntegrated Intel® PCH-LP

MemoryTwo DDR4 SO-DIMM slots supporting DDR4-3200 memory, up to
64GB
IBECC DDR4 memory modules supported only with Intel® Core™
Industrial SoCs

Graphics

Intel® Iris® Xe Graphics, up to 96 Execution Units
Up to 4 independent displays supported
Support DirectX 12, OpenGL 4.6, OpenCL 3.0 and Vulkan 1.2
HW accelerated video decode AVC/H.264, HEVC/H.265, VP81, VP9,AV1
HW accelerated video encode AVC/H.264, HEVC/H.265, VP81, VP9
Up to 3x Digital Display Interfaces (DDIs), supporting DP 1.2, eDP 1.4,
HDMI® 1.4, DVI
1 x eDP 1.4 or Single/Dual-Channel 18-/24-bit LVDS interface
1 x VGA interface

VideoInterfaces

eDP, DP:Video
Resolution

HDMI®:LVDS:
VGA:

up to 5120x3200 @60Hz 24bpp / 7680x4320 @60Hz
30bpp with DSC
up to 4096x2160 @24Hz, 24bpp
up to 1920x1200 @60Hz
up to 2048 x 1536 @50Hz

Available in Industrial Temperature Range

Processor

AMD Ryzen™ Embedded V2748 with AMD Radeon™ Graphics with 7
CU, Eight Core Dual Thread @ 2.9GHz (4.15 Boost), TDP 35-54W
AMD Ryzen™ Embedded V2718 with AMD Radeon™ Graphics with 7
CU, Eight Core Dual Thread @ 1.7GHz (4.15 Boost), TDP 10-25W
AMD Ryzen™ Embedded V2546 with AMD Radeon™ Graphics with
6 CU, Six Core Dual Thread @ 3GHz (3.95 Boost), TDP 35-54W
AMD Ryzen™ Embedded V2516 with AMD Radeon™ Graphics with 6
CU, Six Core Dual Thread @ 2.1GHz (3.95 Boost), TDP 10-25W

MemoryTwo DDR4 SO-DIMM Slots supporting DDR4-3200, ECC and nonECC memory, up to 64GB

Graphics

AMD Radeon™ Graphics GPU with up to 7 Compute Units
Up to 4 independent displays supported
Support DirectX 12, OpenGL 4.6, OpenCL 2.1 and Vulkan
HW accelerated video decode VP9 (8 and 10 bits), H.264/AVC (8bits),
H.265/HEVC (8 and 10 bits), JPEG
HW accelerated video encode H.264/AVC (8bits), H.265/HEVC (8 and10 bits), JPEG

Video
Interfaces

Up to 3 x Digital Display Interfaces (DDIs), supporting DVI, DP 1.4,
HDMI® 2.1
1 x eDP 1.3 or single/dual-channel 18-/24-bit LVDS interface

Video
Resolution

eDP, DP up to 4096x2160 @60Hz 10b with DSC 1.2 (HBR3)
HDMI® up to 4096x2160 @ 60Hz
LVDS up to 1920x1200 @ 60Hz

Mass
Storage

2 x S-ATA Gen3 Channels

Networking

Gigabit Ethernet interface with Intel® i21x GbE controller
Optional M.2 1216 Wi-Fi 802.11ac and BTLE 5.0 on-board

USB

1x SuperSpeed USB 10Gbps host port
3x SuperSpeed USB 5Gbps host ports
8x 2.0 host ports

PCI-e

8x PCI-e x1 Gen3 lanes
PCI-express Graphics (PEG) x8 Gen3

Audio

HD Audio interface

Serial Ports

2x UARTs

Other
Interfaces

SPI, I2C, SM Bus, thermal management, FAN management
LPC bus
Optional TPM 2.0 on-board
LID#/SLEEP#/PWRBTN#, Watchdog
4x general purpose input (GPI), 4x general purpose input (GPI)

Mass
Storage

2x SATA Gen3 channels
2x PCI-e x4 ports available for M.2 NVMe drives

Networking

Gigabit Ethernet interface
Intel® I225 GbE controllerUSB

4x SuperSpeed USB 5Gbps host ports
8x USB 2.0 Host ports

PCI-e

8x PCI-e x1 Gen3 lanes
PCI-express Graphics (PEG) x4 Gen4

Power
Supply8VDC ±20VDC, +5VSB (optional), +3VRTC (optional)

Audio

HD audio interface

Operating
SystemMicrosoft® Windows 10
Linux

Serial Ports

2x UARTs

0°C to +60°C (commercial version)

Other
Interfaces

SPI, I2C, SM bus, thermal management, FAN management
LPC bus
Optional TPM 2.0 on-board
LID#/SLEEP#/PWRBTN#, Watchdog
4x GPI, 4x GPO

OperatingTemperature*
Dimensions

95 x 95 mm (COM Express® Compact Form factor, Type 6 pinout)

Power
Supply8VDC ± 20VDC, +5VSB (optional), +3VRTC (optional)

Operating
SystemMicrosoft® Windows 10
Microsoft® Windows 10 IoT CoreLinux

OperatingTemperature*

0°C ÷ +60°C (Commercial)-40°C ÷ +85°C (Industrial)

Dimensions

95 x 95 mm (COM Express® Compact Form factor, Type 6 pinout)*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the packaged system to keep the heatspreader temperature in the range
indicated.

30

www.seco.com

GRAPHICS
AMD Radeon™ Vega GPU with 3 Compute Units

MEMORY
Two DDR4 SO-DIMM Slots supporting DDR4-2400 ECC Memory

4

Max Thread

4

MemoryCom Express®
Graphics

COM Express® 3.0 Compact Type 6 module with the 8th Gen Intel® Core
and Celeron™ U-series processors (Codename: Whiskey Lake)™

Low power multi-core Intel® architecture formobile applications

Video
Interfaces

SOM-COMe-CT6-WHL-U

Video
Resolution
Mass
Storage
Networking
USB

CPU
8th Gen Intel® Core™ and Celeron™ 4000 series processors (formerly Whiskey Lake)with 15W TDP
GRAPHICSIntel® UHD Graphics 620 / 610

MEMORY
Two DDR4 SO-DIMM Slots supporting DDR4-2400 Memory, up to 64GB

Please visit www.seco.com to find the latest version of these datasheets

Max Cores

CONNECTIVITY
4x USB 3.0; 8x USB 2.0; Up to 5x PCI-e x1; PEG x4 Gen3

CONNECTIVITY
4 x USB 3.1; 8 x USB 2.0, up to 8 x PCI-e x 1*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

Processor

Intel® Atom® x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2
Cache, 6.5W TDPIntel® Atom® x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2
Cache, 9.5W TDPIntel® Atom® x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2
Cache, 12W TDPIntel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2
Cache, 6W TDPIntel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2
Cache, 6W TDPIntel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), 2MB
L2Cache, 10W TDPIntel® Celeron® J3355, Dual Core @2.0GHz (Burst 2.5GHz), 2MB
L2Cache, 10W TDPCPU
AMD Ryzen™ Embedded R1000 processors

Please visit www.seco.com to find the latest version of these datasheets

Two DDR3L SO-DIMM Slots supporting DDR3L-1866 non-ECC
Memory, up to 8GB
Integrated Intel® HD Graphics 500 series controller with up to 18
Execution Units
Three Independent displays supported
HW decoding of HEVC(H.265), H.264, MVC, VP8, VP9, MPEG2, VC-1,
WMV9, JPEG/MJPEG formats
HW encoding of HEVC(H.265), H.264, MVC, VP8, VP9 and JPEG/MPEG
formats
Up to 2 x Digital Display Interfaces (DDIs), supporting DP 1.2, DVI andHDMI® 1.4beDP 1.3 or Single/Dual-Channel 18-/24- bit LVDS interface
optional VGA interface through a DP-to-VGA bridge
DP:eDP:
HDMI®:
LVDS, VGA:

Up to 4096 x 2160 @60HZ
Up to 3840 x 2160 @60Hz
Up to 3840 x 2160 @30Hz
Up to 1920 x 1200 @ 60Hz

Optional eMMC 5.0 drive soldered on-board
2 x external S-ATA Gen3 Channels
microSD Card Slot onboard
Optional Gigabit Ethernet interface
Intel® I210 or I211 GbE Controller (MAC + PHY)
Up to 4 x USB 3.0 Host ports
8 x USB 2.0 Host ports

PCI-e

Up to 5 x PCI-e x 1 Gen2 lanes

Audio

HD Audio Interface

Serial Ports

2x UARTs

Other
Interfaces

SPI, I2C, SM Bus, Thermal Management, FAN management
LPC bus
Optional TPM 2.0 on-board
LID#/SLEEP#/PWRBTN#, Watchdog
4x GPI, 4 x GPO

Power
Supply+12VDC ± 10% and +5VSB (optional)

OperatingTemperature*

Microsoft® Windows 10 Enterprise (64-bit)
Microsoft® Windows 10 IoT core
Wind River Linux (64 bit)
Yocto (64 bit)Android (planning)
0°C ÷ +60°C (Commercial version)-40°C ÷ +85°C (Industrial version)

Dimensions

95 x 95 mm (Com Express® Compact Form factor, Type 6 pinout)

Operating
System*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

www.seco.com

31Com Express®

Com Express®

COM Express® Basic Type 6 with Intel® 6th and 7th generation Core™ /Xeon® (Codename: Skylake and Kaby Lake) CPUs

Carrier Board for COM Express® Type 6 Modules on 3.5” form factor

Carrier Board for COM-Express® Rel. 3.1 Type 6 Modules for Development

Exceptional platform performance with up to six
cores for more processing power

When high graphics andHyper-threading matter

Most compact, I/O-rich COM Express® Type 6
carrier board

Connectivity and Flexibility to Accelerate
Development

SOM-COMe-BT6-CFL-H

SOM-COMe-BT6-SKL/KL

Carrier-COMe-T6-C30

Carrier-COMe-T6-E10

Com Express®

Com Express®

COM Express® Basic Type 6 with Intel® 8th and 9th Gen Core™/ Xeon® /Celeron® (Codename: Coffee Lake and Coffee Lake Refresh)CPU
8th Gen Core™/Xeon® (Coffee Lake) & 9th Gen Core™/Xeon® /Celeron® CPUs
(Coffee Lake Refresh)
GRAPHICSIntel® UHD Graphics 630/P630 architecture, up to 48 Execution Units
CONNECTIVITY
4x USB 3.0; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x16 Gen3
MEMORY
Two DDR4 SO-DIMM Slots supporting DDR4-2666 ECC Memory, up to 64GBCom Express®

CPUIntel® 6th and 7h generation Core™ / Xeon® CPUs
GRAPHICSIntel® HD Graphics 530 /P530/630/P630
CONNECTIVITY
4x USB 3.0; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x16 Gen3
MEMORY
2 x DDR4 So-DIMM slots

Com Express®

COM Express® Rel. 3.0 Compact Type 6 module with AMD Ryzen™
Embedded V1000 Processors

COM Express® Compact Type 6 with AMD 3rd gen. R-Series, G SoC-I or
G SoC-J Series (Codename: Merlin Falcon, Brown Falcon, Prairie Falcon)

Next Generation x86 “Zen” Core and elite GPU
performance

When scalable graphics performancemakes the difference

SOM-COMe-CT6-V1000

SOM-COMe-CT6-MBPF

CARRIER BOARDS

VideoInterfaces

3 x DP++ connectors or 1 x DP++ connector and 2 x USB4.0 Type-C
with Alternate-Mode
VGA connector
LVDS 24-bit Single/Dual ChanneleDP 4-lanes 40 poles VESA connector
Backlight control + LCD selectable voltages dedicated connector
LVDS External EDID flash socket

Mass
Storage

4x S-ATA 7p M connectorsµSD Card slot (interface multiplexed with GPIO header)

Networking

1x GbEthernet RJ-45 connector

PCI-e

2x PCI-e x4 Slots Gen4
1x PCI-e x16 Slot Gen4USB

2 x USB 4.0 on Type-C sockets with Alternate-Mode (factory
alternative to 2 x DP++ and 2 x USB 2.0)
4 x USB 3.2 Host ports on Type-A sockets
4 x USB 2.0 Host ports on Quad Type-A sockets

On-board HD Audio Codec (Realtek ALC262)
Mic In + Line Out internal pin header

Audio

Serial Ports

2 x RS-232 / RS-422 / RS-485 ports on internal pin header (fromcarrier board’s SuperI/O)
2 x RS-232 ports on feature pin header (from module)

On-board HD Audio Codec (Realtek ALC888S)
5.1 Audio Jack with S/PDIF Optical interface
Mic In + Line Out internal pin header

Serial Ports

Other
Interfaces

microSIM slot for M.2 modem
4 x GPI + 4 x GPO pin header (interface multiplexed with μSD slot)
Button / LEDs front panel header
3-pin tachometric FAN connector
I2C + SM Bus on feature Pin header
LPC internal header

2 x RS-232 / RS-422 / RS-485 ports on internal pin header (fromcarrier board’s LPC Dual UART controller)
2 x RS-232 ports on dedicated pin header (from module)

Other
Interfaces

4 x GPI + 4 x GPO pin header (interface multiplexed with µSD slot)
SPI Flash Socket
Button / LEDs front panel header
4-pin tachometric FAN connector
I2C + SM Bus on feature Pin header
I2C Flash Socket
SM Bus Smart Battery Connector
4 x 7-segment LCD displays for POST codes
LPC/eSPI internal header

Power
SupplyATX 24 poles connector for carrier board working only
Auxiliary 12V connector for carrier board working only
12 VDC power in connector for COM Express module’s working
Cabled Coin-cell connector for RTC

OperatingTemperature*

0°C ÷ +60°C (Commercial version)

Dimensions

305x244mm (ATXform factor, 12” x 9.6”)

VideoInterfaces

1 x DP++ connector
2 x miniDP++ connectors
LVDS 24-bit Single/Dual Channel
LVDS External EDID flash socketeDP 4-lanes 40 poles VESA connector

Mass
Storage

S-ATA 7p M connector + 4 pins power connector
M.2 Socket 2 2260 Key B slot for SSD
M.2 Socket 3 2280 Key M slot for PCI-e x4 SSDs
μSD Card slot (interface multiplexed with GPIO header)

Networking

Dual RJ-45 connector (1 port managed by COM Express Gigabit
Ethernet interface, 1 port managed by Carrier board’s Intel® I21x
GbEthernet controller)
M.2 Socket 2 2242 / 3042 Key B slot for WWAN modules (modem)
M.2 Socket 1 2230 Key E slot for WiFi / BT modules

USB

3 x USB 3.0 Host ports on Type-A sockets
2 x USB 2.0 Host ports on Type-A sockets
1 x USB 2.0 Host port on internal pin header

Audio

Power
Supply19÷24 VDC (only CPU modules with max 45W TDP supported)
Mega-Fit® 2x1 Power Connector
Cabled Coin-cell connector for RTC

OperatingTemperature*

0°C ÷ +50°C

Dimensions

146x102mm (3.5” form factor, 5.75” x 4.02”)*All carrier board components must remain within the operating temperature at any andall times, including start-up; carrier operating temperature is independent of the module
installed. Please refer to the specific module for more details. Actual temperature will
widely depend on application, enclosure and/or environment. Upon customer to consider
specific cooling solutions for the final system.

Available in Industrial Temperature Range

32*All carrier board components must remain within the operating temperature at any andall times, including start-up; carrier operating temperature is independent of the module
installed. Please refer to the specific module for more details. Actual temperature will
widely depend on application, enclosure and/or environment. Upon customer to consider
specific cooling solutions for the final system.

Available in Industrial Temperature Range

CPU
AMD Ryzen™ Embedded V1000 processors

CPU
AMD Embedded 3rd generation R-Series SOC or G-Series SOC-I

GRAPHICS
AMD Radeon™ Vega GPU with up to 11 Compute Units DirectX® 12 supported

GRAPHICS
AMD Radeon 3rd -Generation Graphics Core Next (GCN)

CONNECTIVITY
4x USB 3.0; 8x USB 2.0; 4x PCI-e x1 Gen 3, PEG x8 Gen3

CONNECTIVITY
4x USB 3.0; 8x USB 2.0; 3x PCI-e x1 Gen3

MEMORYUp to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory

MEMORY
Two SO-DIMM slots supporting DDR4 ECC and non-ECC modules

www.seco.com

CARRIER BOARDS

Please visit www.seco.com to find the latest version of these datasheets

Please visit www.seco.com to find the latest version of these datasheets

www.seco.com

33

Com Express®
DEVELOPMENT KIT

Cross Platform Development Kit compatible with both x86 and Arm® COM Express® Type 6 modules

Platform independent kit for fast Time-to-market
DEV-KIT-COMe-T6
Cross-compatible
platform with x86
and Arm® solutions

SCHEMATICS
PUBLICLY AVAILABLEFEATURES OF CCOMe-C96

34

Video
Interfaces

3 x DP++ connector
VGA connector
LVDS 24-bit Single/Dual ChanneleDP 4-lanes 40 poles VESA connector
LVDS External EDID flash socket

Mass
Storage

4x S-ATA 7p M connectorsµSD Card slot (interface multiplexed with GPIO header)

Networking

1x GbEthernet RJ-45 connector

USB

4x USB 3.1 Host ports on Type-A sockets
4 x USB 2.0 Host ports on Quad Type-A sockets

PCI-e

2x PCI-e x4 Slots
1x PCI-e x16 SlotAudio

On-board HD Audio Codec (Realtek ALC888S)
HD Audio Jacks
S/PDIF Out Optical connector
Mic In + Line Out internal pin header

Serial Ports

2 x RS-232 / RS-422 / RS-485 ports on internal pin header (fromcarrier board’s LPC Dual UART controller)
2 x RS-232 ports on dedicated pin header (from module)

www.seco.com

Other
Interfaces

4 x GPI + 4 x GPO pin header (interface multiplexed with µSD slot)
SPI Flash header
Button / LEDs front panel header
4-pin tachometric FAN connector
I2C + SM Bus on feature Pin header
FuSa Header
I2C Flash Socket
JTAG connector
LPC internal header
USB overcurrent header
SM Bus Smart Battery Connector
4 x 7-segment LCD displays for POST codes
LPC/eSPI internal header

Power
SupplyATX 24 poles connector for carrier board working only
Auxiliary 12V connector for carrier board working only
12 VDC power in connector for COM Express module’s working
Cabled Coin-cell connector for RTC

OperatingTemperature*

0°C ÷ +60°C (Commercial version)

Dimensions

305x244mm (ATXform factor, 12” x 9.6”)*All carrier board components must remain within the operating temperature at any andall times, including start-up; carrier operating temperature is independent of the module
installed. Please refer to the specific module for more details. Actual temperature will
widely depend on application, enclosure and/or environment. Upon customer to consider
specific cooling solutions for the final system.

Please visit www.seco.com to find the latest version of these datasheets

Please visit www.seco.com to find the latest version of these datasheets

www.seco.com

35

COM HPC®
COM-HPC® Size A Client Module with Intel® Core™ Ultra Processors Family(codename: Meteor Lake -H and -U)

Next-gen Intel® Core™ Ultra power, superior graphics, robust connectivity,and durability for demanding applications

COM-HPC®

SOM-COM-HPC-A-MTL

COM-HPC® Standard Advantages

Forhigh-end designs
and markets

High graphics
computing

Processor

Support for
high-speed
interfaces

Integrated videointerfaces“Client” and“Server”
versions

Computer-On-Module Approach

System Memory

Design investment limited to the carrier board | Consolidated standards | Scalable and future-proof solutions
Long-term availability | Arm and x86 compatibility | Multi-vendor solutions | Highly configurable
Innovative and updatable solutions | Reduced time-to-market

COM-HPC® Client
49x PCIe
2x MIPI-CSICOM-HPC® Server
65x PCIe

2x 25GbE KR
3x DDI

4x USB44x USB2.0

8x 25GbE KR

2x BaseT (up to 10 Gb)
2x SoundWire, I²S

COM-HPC® Client

BaseT (up to 10 Gb)

2x SATA36

www.seco.com

Two DDR5 SO-DIMM slot supporting DDR5-5600 IBECC* modules,
up to 64GB(*) IBECC: In-Band Error-Correcting Code Memory

Graphics

Video
Interfaces

2x Digital Display Interfaces (DDIs) supporting DP, HDMI®, DP AltMode over Type-C
1x DDI Interface supporting DP / HDMI® / eDP
1x eDP interface
HDMI®:
DP 2.1:eDP 1.4b:USB

2x USB 10Gbps interfaces
2x USB 20Gbps/40Gbps interfaces
8x Hi-Speed USB ports

PCI-e

Up to 7x PCI-e x1 Gen4 lanes (4x groupable)
Up to 3x PCI-e x4 Gen4 ports
1x PCI-e x8 Gen5 port (-H Series processors only)
Max 9 root ports supported

Audio

HD Audio interface
2x SoundWire Interface

Serial Ports

2x 4-wires UARTs

OtherInterfaces

Boot SPI + GP SPI, 2x I2C, SM Bus, thermal management, FAN
management
eSPI interface
Optional TPM 1.2/2.0 on-board
Power and system management signals
Watchdog
12x GPIO
2x MIPI-CSI-2 4-lane camera interfaces

Power Supply+12VDC ± 10%, +5VSB (optional), +3VRTC (optional)

Operating
SystemMicrosoft® Windows 11 IoT Enterprise 2019
Edgehog OS (Linux Yocto)

OperatingTemperature*

0°C ÷ +60°C (Commercial version)

Dimensions

120 x 95 mm (COM-HPC® Size A Form factor, Client pinout)*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

up to 8K60 according to HDMI® 2.1
up to 8K60Hz / 5K120Hz
up to 4K120Hz HDR

Max resolution 4x4K60Hz

COM-HPC® Server

Mass
Storage

2x external SATA Gen3 Channels
PCI-e x4 ports can be used to connect, on the carrier board, M.2
NVMe drives

Networking

Up to 2x NBase-T ethernet interfaces with Intel® I226 GbE controller,
supporting 2.5GbE and TSN.

2x USB4
2x USB3.2
4x USB2.0
2x SATAeSPI, 2x SPI, SMBeSPI, 2x SPI, SMB

2x I²C, 2x UART

2x I2C, 2x UART

12x GPIOIntel® Core™ Ultra Processors Family (codename: Meteor Lake-U) 12/15/28W Base Power:•Intel® Core™ Ultra 7 processor 165U with vPRO, 2 P-Cores
with HT @ 1.7GHz (turbo 4.9GHz) + 8 E-Cores @ 1.2GHz (turbo
3.8GHz), 12M Cache•
Intel® Core™ Ultra 7 processor 155U, 2 P-Cores with HT @1.7GHz (turbo 4.8GHz) + 8 E-Cores @ 1.2GHz (turbo 3.8GHz),
12M Cache•Intel® Core™ Ultra 5 processor 135U with vPRO, 2 P-Cores
with HT @ 1.6GHz (turbo 4.4GHz) + 8 E-Cores @ 1.1GHz (turbo
3.6GHz), 12M Cache•
Intel® Core™ Ultra 5 processor 125U, 2 P-Cores with HT @1.3GHz (turbo 4.3GHz) + 8 E-Cores @ 0.8GHz (turbo 3.6GHz),
12M Cache

Integrated Intel® Xe LPG graphics controller with up to 8 Xe cores(128 EU)
Support up to 4 independent displays

Video
Resolution

COM-HPC® supported features

Intel® Core™ Ultra Processors Family (codename: Meteor Lake-H) 20/28/65W base power:•Intel® Core™ Ultra 7 processor 165H with vPRO, 6 P-Cores
with HT @ 1.4GHz (turbo 5.0GHz) + 8 E-Cores @ 0.9GHz (turbo
3.8GHz), 24M Cache•
Intel® Core™ Ultra 7 processor 155H, 6 P-Cores with HT @1.4GHz (turbo 4.8GHz) + 8 E-Cores @ 0.9GHz (turbo 3.8GHz),
24M Cache•Intel® Core™ Ultra 5 processor 135H with vPRO, 4 P-Cores
with HT @ 1.7GHz (turbo 4.6GHz) + 8 E-Cores @ 1.2GHz (turbo
3.6GHz), 18M Cache•
Intel® Core™ Ultra 5 processor 125H, 4 P-Cores with HT @1.2GHz (turbo 4.5GHz) + 8 E-Cores @ 0.7GHz (turbo 3.6GHz),
18M Cache

12x GPIO

Please visit www.seco.com to find the latest version of these datasheets

Please visit www.seco.com to find the latest version of these datasheets

www.seco.com

37

COM HPC®

COM HPC®

COM HPC®

COM HPC® Client module Size A, with 13th Gen Intel® Core™ processors(Codename: Raptor Lake – H/P/U series)

COM HPC® Client module Size A, with 12th Gen Intel® Core™ processors(Codename: Alder Lake - P series)

COM-HPC® Client module Size A with the 11th Gen Intel® Xeon® W-11000E Series, Core™ vPro® and Celeron®
(Codename: Tiger Lake-H) Processors for FuSa applications

13th Gen Core-i processing with AI accelerator forhigh performance industrial grade edge applications

Immersive graphics, enhanced AI-performance andefficiency in a standard form factor

Processing power, high performance graphics and top class connectivity
in a COM-HPC® modular solution

SOM-COM-HPC-A-RPL

SOM-COM-HPC-A-ADL-P

SOM-COM-HPC-A-TGL-H

Available in Industrial Temperature Range

Processor

13th Gen Intel® Core™ processors, up to 14 cores & up to 20 threads,
up to 24MB cache, 15/45W TDP

Processor

12th Gen Intel® Core™ processors, up to 14 cores & up to 20 threads,
up to 24MB cache, 15/45W TDP

Memory2x DDR5-4800 SODIMM Slots, up to 64GB

SystemMemory2x DDR5-4800 SODIMM Slots, up to 64GB

Graphics

Integrated Iris® X Architecture, up to 96 Execution Units
Up to two video decode boxes (VDBoxes) for enhanced video stream
capabilities
Support for up to 48 simultaneous 1080p streams ingestion
Support for up to four independent displays at up to 4K60 HDR
resolution or one display at 8K resolution

Graphics

Integrated Iris® Xe Architecture, up to 96 Execution Units
Up to two video decode boxes (VDBoxes) for enhanced video stream
capabilities
Support for up to 48 simultaneous 1080p streams ingestion
Support for up to four independent displays at up to 4K60 HDR
resolution or one display at 8K resolution

Up to 3x DDI ports supporting DP 1.4, HDMI 2.0b (HDMI 2.1 via
LSPCON)
Up to 2x DP++ interfaces over USB 4.0 (Factory alternatives to 2x
DDI ports)
1x eDP 1.4b interface

VideoInterfaces

e

Video
Interfaces

DP
Video
Resolution

Up to 5120x3200 @60Hz 24bpp / 7680x4320@60Hz
30bpp with DSC
eDP:
Up to 5120x3200 @60Hz 24bpp / 5120x3200@120Hz
30bpp with DSC
HDMI® 1.4: Up to 4Kx2K 24-30Hz 24bpp
HDMI® 2.1: Up to 4Kx2K 48-60Hz 24bpp / 4Kx2K 48-60Hz 12bpc (needdedicated redriver on carrier board)

Video
Resolution

Up to 5120x3200 @60Hz 24bpp / 7680x4320@60Hz
30bpp with DSC
eDP:
Up to 5120x3200 @60Hz 24bpp / 5120x3200@120Hz
30bpp with DSC
HDMI® 1.4: Up to 4Kx2K 24-30Hz 24bpp
HDMI® 2.1: Up to 4Kx2K 48-60Hz 24bpp / 4Kx2K 48-60Hz 12bpc (needdedicated redriver on carrier board)

Mass
Storage

2x external SATA Gen3 Channels
PCI-e x4 ports can be used to connect, on the carrier board, M.2
NVMe drives

Mass
Storage

2x external SATA Gen3 Channels
PCI-e x4 ports can be used to connect, on the carrier board, M.2
NVMe drives

2x NBase-T Ethernet interfaces, supporting 2.5Gb Ethernet
connection, managed by as many Intel® i225 2.5GbE Controllers
Optional on-board M.2 1216 module, supporting WiFi 802.11ax (WiFi 6E)
MIMO 2x2 + MU-MIMO and BT 5.2, external antennas*

Networking

Networking

2x NBase-T Ethernet interfaces, supporting 2.5Gb Ethernet
connection, managed by as many Intel® i225 2.5GbE Controllers
Optional on-board M.2 1216 module, supporting WiFi 802.11ax (WiFi 6E)
MIMO 2x2 + MU-MIMO and BT 5.2, external antennas**Certification upon requestUSB

Up to 4 x USB 4.0 / USB 3.2 Host ports
4 x USB 2.0 Host port

USB

Up to 4 x USB 4.0 / USB 3.2 Host ports
4 x USB 2.0 Host port

PCI-e

Up to 8x PCIe x1 Gen3 lanes
1x PCIe x8 Gen5 port
2x PCIe x4 Gen4 ports

PCI-e

Up to 8x PCIe x1 Gen3 lanes
1x PCIe x8 Gen4 port
2x PCIe x4 Gen4 ports

Audio

SoundWire and I2S Audio Interface

Audio

SoundWire and I2S Audio Interface

Serial Ports

2 x UARTs

Serial Ports

2 x UARTs

Other
Interfaces

2x 4-lane CSI-2 interfaces
SPI, SM Bus, 2x I2C, Watchdog timer, Carrier board FAN Control
Management signals, ACPI signals, Safety Status signals
Deep Sleep / Battery support
Optional TPM 2.0 module on-board
12x GPIOs

Other
Interfaces

2x 4-lane CSI-2 interfaces
SPI, SM Bus, 2x I2C, Watchdog timer, Carrier board FAN Control
Management signals, ACPI signals, Safety Status signals
Deep Sleep / Battery support
Optional TPM 2.0 module on-board
12x GPIOs

Other

AI engine: Intel® Gaussian & Neural Accelerator 3.0 (Intel® GNA)
Can operate while the SOC is in lower power states

Other

AI engine: Intel® Gaussian & Neural Accelerator 3.0 (Intel® GNA)
Can operate while the SOC is in lower power states

Power Supply+8VDC .. +20VDC Main power supply+5V stand-by

Power Supply+8VDC .. +20VDC Main power supply+5V stand-by

Operating
SystemWindows 10 IoT Enterprise LTSC
Windows Server 2022
Wind River VxWorks 7.0
Linux Kernel LTS (Ubuntu)
Wind River Linux
Yocto
Android

Operating
SystemWindows 10 IoT Enterprise LTSC
Windows Server 2022
Wind River VxWorks 7.0
Linux Kernel LTS (Ubuntu)
Wind River Linux
Yocto
Android

OperatingTemperature*-40°C ÷ +85°C (Industrial)

OperatingTemperature*

0°C ÷ +60°C (Commercial version)

Dimensions

120 x 95 mm (COM-HPC® Size A Form factor, Client pinout)

Dimensions

120 x 95 mm (COM-HPC® Size A Form factor, Client pinout)*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

www.seco.com

Processor

DP:*Certification upon request

38

Up to 3x DDI ports supporting DP 1.4, HDMI® 2.0b (HDMI 2.1 via
LSPCON)
Up to 2x DP++ interfaces over USB 4.0 (Factory alternatives to 2x
DDI ports)
1x eDP 1.4b interface

11th Generation Intel® Xeon®, Core™ and Celeron® Processors, alsoavailable in industrial temperature range.
•
Intel® Core™ vPRO® i7-11850HE, Eight Core @ 2.6GHz (up to
4.7GHz in Turbo Boost) with HT, 24MB Cache L3, 45/35W cTDP•Intel® Core™ vPRO® i5-11500HE, Six Core @ 2.6GHz (up to
4.5GHz in Turbo Boost) with HT, 12MB L3 Cache, 45/35W cTDP•Intel® Core™ i3-11100HE, Quad Core @ 2.4GHz (up to 4.4GHz in
Turbo Boost) with HT, 8MB L3 Cache, 45/35W cTDP•Intel® Celeron® 6600HE, Dual Core @2.6GHz, 8MB L3 Cache,
35W TDP•Intel® Xeon® vPRO® W-11865MRE, Eight Core @ 2.6GHz (up to
4.7GHz in Turbo Boost) with HT, 24MB L3 Cache, with ECC and
TCC/TSN, 45/35W cTDP – Industrial (w/ Turbo OFF)•Intel® Xeon® vPRO® W-11555MRE, Six Core @ 2.6GHz (up to
4.5GHz in Turbo Boost) with HT, 12MB L3 Cache, with ECC and
TCC/TSN, 45/35W cTDP – Industrial (w/ Turbo OFF)•Intel® Xeon® W-11155MRE, Quad Core @ 2.4GHz (up to 4.4GHz
in Turbo Boost) with HT, 8MB L3 Cache, with ECC and TCC/
TSN, 45/35W cTDP – Industrial (w/ Turbo OFF)•Intel® Xeon® vPRO® W-11865MLE, Eight Core @ 1.5GHz (up to
4.5GHz in Turbo Boost) with HT, 24MB L3 Cache, with ECC and
TCC/TSN, 25W TDP•Intel® Xeon® vPRO® W-11555MLE, Six Core @ 1.9GHz (up to
4.4GHz in Turbo Boost) with HT, 24MB L3 Cache, with ECC and
TCC/TSN, 25W TDP•Intel® Xeon® W-11155MLE, Quad Core @ 1.8GHz (up to 3.1GHz in
Turbo Boost) with HT, 24MB L3 Cache, with ECC and TCC/TSN,
25W TDP B Cache, 28/15/12W cTDP - Industrial (w/ Turbo OFF)Max Cores

8

ChipsetIntel® RM590E, HM570E or QM580E PCH

Memory2x DDR4-3200 SODIMM Slots with ECC (In-Band Error CorrectionCode), up to 64GB supported

Graphics

Integrated Iris Xe Graphics Core Gen12 architecture, with up to 32
Execution Units and up to 2 VDbox
MPEG2, WMV9, AVC/H.264, JPEG/MJPEG, HEVC/H.265, VP9, AV1 HW
decoding, up to 8k60.
AVC/H.264, HEVC/H.265, JPEG, VP9 HW encoding, up to 8k30
Support up to 4 independent displays.

Video
Interfaces

1x eDP 1.4b or MIPI_DSI 1.3
Up to 3x DP++ interface, supporting Display Port 1.4a and HDMI® 2.0b
Up to 2x Display Port over Type-C (Alternate mode)DP, eDP:Video
Resolution

Mass Storage

MIPI-DSI:
HDMI® 1.4:
HDMI® 2.0b:

Networking

Up to 2x NBase-T Ethernet interfaces, supporting 2.5Gb Ethernet
connection, managed by as many Intel® i225 2.5GbE Controllers with
TSN

USB

2x USB4 ports
2x USB 3.2 Gen 2x2 ports
8 x USB 2.0 Host ports

PCI-e

1x PCI-e x4 Gen 4 port for NVME
16x PCI-e Gen4 lanes, can be used to support 1x PCI-e x16, 2x PCI-e
x8 or (1x PCI-e x8 +2x PCI-e x4) root ports
20x PCI-e Gen 3 lanes, groupable to support up to 12 root ports, max
allowed grouping PCI-e x4

Audio

SoundWire and I2S Audio Interface

Serial Ports

2x legacy UARTs, managed by the Embedded Controller

Other
Interfaces

2x 4-lane CSI-2 interfaces, optional
SPI, eSPI, SM Bus, 2x I2C, Watchdog timer, Carrier board FAN Control
Management signals, ACPI signals, Safety Status signals
Deep Sleep / Battery support
Optional TPM 2.0 module on-board
12x GPIOs

Power Supply+8VDC .. +20VDC Main power supply+5V stand-by

Operating
SystemWindows 10 IoT Enterprise LTSCLinux Kernel LTS
Yocto Project 3.0
WindRiver VxWorks 7.0
Android

OperatingTemperature*

0°C ÷ +60°C (Commercial version)-40°C ÷ +85°C (Industrial Range)

Dimensions

120 x 95 mm (COM-HPC® Size A Form factor, Client pinout)*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

Up to 5120x3200 @60Hz 24bpp / 7680x4320@60Hz
30bpp with DSC
Up to 3200x2000 @60Hz 24bpp, 5120x3200 @60Hz
24bpp with DSC
Up to 4Kx2K 24-30Hz 24bpp
Up to 4Kx2K 48-60Hz 24bpp / 4Kx2K 48-60Hz 12bpc(need dedicated redriver on carrier board)

2 x S-ATA Gen3 Channels
PCI-e x4 port can be used to connect, on the carrier board, M.2
NVMe drives*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

Please visit www.seco.com to find the latest version of these datasheets

Please visit www.seco.com to find the latest version of these datasheets

www.seco.com

39

COM HPC®

COM HPC®

DEVELOPMENT KIT

COM-HPC® Client module Size A with the 11th Gen Intel® Core™ and Celeron®
(Codename: Tiger Lake-UP3) Processors

Cross Platform Development Kit compatible with both x86 and Arm® COM-HPC® Client modules

11th Generation Intel® Core™ and Celeron® Processors
in brand-new COM-HPC® format

Development Kit for COM-HPC® Client Modules

SOM-COM-HPC-A-TGL-UP3

DEV-KIT-COM-HPC-A
Cross-compatible
platform with x86
and Arm® solutions

SCHEMATICS
PUBLICLY AVAILABLE

Available in Industrial Temperature Range

11th Generation Intel® Core™ and Celeron® Processors, also available
in industrial temperature range•
Intel® Core™ i7-1185G7E, Quad Core @ 2.8GHz (4.4GHz in
Turbo Boost) with HT, 12MB Cache, 28/15/12W cTDP•Intel® Core™ i5-1145G7E, Quad Core @ 2.6GHz (4.1GHz in Turbo
Boost) with HT, 8MB Cache, 28/15/12W cTDP•Intel® Core™ i3-1115G4E, Dual Core @ 3.0GHz (3.9GHz in Turbo
Boost) with HT, 6MB Cache, 28/15/12W cTDP•Intel® Celeron® 6305E, Dual Core @1.8GHz, 4MB Cache, 15W TDP•Intel® Core™ i7-1185GRE, Quad Core @ 2.8GHz (4.4GHz in
Turbo Boost) with HT, 12MB Cache, with IBECC, 28/15/12W cTDP
– Industrial (w/ Turbo OFF)•Intel® Core™ i5-1145GRE, Quad Core @ 2.6GHz (4.1GHz in Turbo
Boost) with HT, 8MB Cache, with IBECC, 28/15/12W cTDP Industrial (w/ Turbo OFF)•Intel® Core™ i3-1115GRE, Dual Core @ 3.0GHz (3.9GHz in Turbo
Boost) with HT, 6MB Cache, 28/15/12W cTDP - Industrial (w/Turbo OFF)

Audio

SoundWire and I2S Audio Interface

Serial Ports

2 x UARTs

Other
Interfaces

2x 4-lane CSI-2 interfaces, optional
SPI, SM Bus, 2x I2C, Watchdog timer, Carrier board FAN Control
Management signals, ACPI signals, Safety Status signals
Deep Sleep / Battery support
Optional TPM 2.0 module on-board
12x GPIOs

Power Supply

Max Cores

4

Memory2x DDR4-3200 SODIMM Slots with IBECC (In-Band Error CorrectionCode), up to 64GB supported

Graphics

Integrated Iris Xe Graphics Core Gen12 architecture, with up to 96
Execution Units
MPEG2, WMV9, AVC/H.264, JPEG/MJPEG, HEVC/H.265, VP9, AV1 HW
decoding, up to 8k @60.
AVC/H.264, HEVC/H.265, JPEG, VP9 HW encoding
Support up to 4 independent displays.

Video
Interfaces

1x eDP 1.4b or MIPI_DSI 1.3
Up to 3x DP++ interface, supporting Display Port 1.4a and HDMI® 2.0b
Up to 4x Display Port over Type-C (Alternate mode)

Processor

DP, eDP:Video
Resolution

40

MIPI-DSI:
HDMI® 1.4:
HDMI® 2.0b:

2 x S-ATA Gen3 Channels
PCI-e x4 port can be used to connect, on the carrier board, M.2
NVMe drives

Networking

Up to 2x NBase-T Ethernet interfaces, supporting 2.5Gb Ethernet
connection, managed by as many Intel® i225 2.5GbE Controllers
M.2 1216 SD Module supporting WiFi 802.11abgn+ac R2 MIMO 2x2 +MU-MIMO and BT 5.0

USB

Up to 4 x USB 4.0 / USB 3.2 Host ports
4 x USB 2.0 Host port

PCI-e

1x PCI-e x4 Gen 4 port
Up to 8x PCI-e Gen 3 lanes, groupable to support up to 4 root ports (5root ports without the second 2.5GbE controller)

www.seco.com

Video
Interfaces

1x 40-poles eDP/DSI connector
3x DP++ connectors
2x CSI Camera Input Connectors

Mass
Storage

2x S-ATA 7p M connectors
2x M.2 Socket 3 Key M slots for M.2 NVMe Drives

Networking

2x NBase-T Ethernet RJ-45 connectors
2x 10Gbase-KR interfaces on OCP Type-C connector+8VDC .. +20VDC Main power supply+5V stand-by

USB

Operating
SystemWindows 10 IoT Enterprise LTSCLinux Kernel LTS
Yocto
VxWorks 7.0
Android

4x USB 4.0 / USB 3.2 Gen2x2 ports on Standard Type-C sockets with
PD functionality
4x USB 2.0 Host ports on standard Quad Type-A Socket
USB Overcurrent pin header

PCI-e

2x PCI-e x4 Slots
2x PCI-e x4 interfaces on M.2 Socket 3 Key M Slots
2x PCI-e x16 Slot

OperatingTemperature*

0°C ÷ +60°C (Commercial version)-40°C ÷ +85°C (Industrial version)

Audio

Dimensions

120 x 95 mm (COM-HPC® Size A Form factor, Client pinout)

I2S Audio Codec
Line In, Line Out, Mic in Triple Audio jackMic In + Line Out internal pin header
I2S/Soundwire shared interface + Soundwire only interface oninternal pin header

Serial Ports

2 x RS-232/RS-422/RS-485 ports on dedicated pin header (frommodule)2 x RS-232/RS-422/RS-485 ports on dedicated pin header (fromeSPI Dual UART controller)

Other
Interfaces

BMC connector with SM Bus, I2C, eSPI, 1x USB 2.0, 1x PCI-e x1, 1 x
UART, 2x GPIO
12 GPIO pin header
Boot SPI Internal Header
Button / LEDs front panel header
4-pin tachometric FAN connector
Feature Pin header with 2xI2C, SM Bus, GP SPI, Management signals
I2C Flash Socket
SM Bus Smart Battery Connector
2x 7-segment LCD displays for POST codeseSPI internal header
Functional Safety (FuSa) internal pin header*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

Up to 5120x3200 @60Hz 24bpp / 7680x4320@60Hz
30bpp with DSC
Up to 3200x2000 @60Hz 24 bpp, 5120x3200 @60Hz
24bpp with DSC
Up to 4Kx2K 24-30Hz 24bpp
Up to 4Kx2K 48-60Hz 24bpp / 4Kx2K 48-60Hz 12bpc(need dedicated redriver on carrier board)

Mass
Storage

FEATURES OF CCHPC-C78-C

Please visit www.seco.com to find the latest version of these datasheets

Please visit www.seco.com to find the latest version of these datasheets

Power
SupplyATX 24 poles connector for carrier board working only
Auxiliary 12V PCI-e 6-pin power connector
Dedicated EPS CPU Power in connector (voltage range 8..20V) for
COM HPC Client module’s working
Cabled Coin-cell connector for RTC

OperatingTemperature*-40°C ÷ +85°C (Industrial Temperature range)

Dimensions

305x244mm (ATX form factor, 12” x 9.6”)*All carrier board components must remain within the operating temperature at any andall times, including start-up; carrier operating temperature is independent of the module
installed. Please refer to the specific module for more details. Actual temperature will
widely depend on application, enclosure and/or environment. Upon customer to consider
specific cooling solutions for the final system.

www.seco.com

41

ETX®
ETX® Module with the Intel® Atom® E3800 and Celeron® families (formerly Bay Trail) SoC

Update your legacy design

ETX®

SOM-ETX-BT

ETX® Standard Advantages

For legacy
designs

Extend the life ofexisting etx-based
projects

X86 based com

Proven andestablishedstandard

Isa bussupport

Processor

Intel® Atom® E3845, Quad Core @1.91GHz, 2MB Cache, 10W TDPIntel® Atom® E3827, Dual Core @1.75GHz, 1MB Cache, 8W TDPIntel® Atom® E3826, Dual Core @1.46GHz, 1MB Cache, 7W TDPIntel® Atom® E3825, Dual Core @1.33GHz, 1MB Cache, 6W TDPIntel® Atom® E3815, Single Core @1.46GHz, 512KB Cache, 5W TDPIntel® Celeron® J1900, Quad Core @2.0GHz, 2MB Cache, 10W TDPIntel® Celeron® N2930, Quad Core @1.83GHz, 2MB Cache, 7.5W TDPIntel® Celeron® N2807, Dual Core @1.58GHz, 1MB Cache, 4.3W TDP

Max Cores

4

Max Thread

4

MemoryDDR3L memory soldered on-board
E3845, E3827, J1900, N2930: up to 8GB Dual-Channel DDR3L 1333MHz
E3826: up to 8GB Dual-Channel DDR3L 1066MHz
N2807: up to 4GB Single-Channel DDR3L 1333MHz
E3825, E3815: up to 4GB Single-Channel DDR3L 1066MHz

Graphics

Integrated Intel® HD Graphics 4000 series controller
Dual independent display support
HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats
HW encoding of H.264, MPEG2 and MVC formats

Video
Interfaces

VGA standard analog video interface
18 / 24 bit single / dual channel LVDS interface (VESA and JEIDA color
mapping compatible)

Video
Resolution

CRT Interface:
LVDS interface:

Mass
Storage

Optional eMMC drive soldered on-board
2 x external SATA or 2 x PATA or 1 x PATA + 1 x SATA channels (factory
options)
μSD Card Slot

Networking

Gigabit Ethernet controller, makes available a 10 / 100Mbps Ethernet
interfaceUSB

4 x USB 2.0 Host ports

Audio

HD Audio codec, Realtek ALC262

Up to 2560 x 1600 @ 60Hz
Up to 1920 x 1200 @ 60Hz

Serial Ports

2 x Serial ports (TX / RX / RTS / CTS signals, TTL interface)

Other
Interfaces

PCI Bus rel. 2.3 compliant
ISA Bus
LPT interface shared with Floppy Drive interface
PS / 2 mouse and keyboard interface
I2C BusSM BusWatch Dog timer
Power Management Signals

Power
Supply+5VDC ± 5% and + 5VSB (optional)

Operating
SystemMicrosoft® Windows 7 (32 / 64 bit)
Microsoft® Windows 8.1 (32 / 64 bit)
Microsoft® Windows 10 (32 / 64 bit)
Microsoft® Windows 10 IoT
Microsoft® Windows Embedded Standard 7 (32 / 64 bit)
Microsoft® Windows Embedded Standard 8 (32 / 64 bit)
Microsoft® Windows Embedded Compact 7
Linux (32 / 64 bit)
Yocto

OperatingTemperature*

0°C ÷ +60°C (Commercial version)

Dimensions

114 x 95 mm (4.49” x 3.74”)*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

Computer-On-Module Approach
Design investment limited to the carrier board | Consolidated standard form factor | Scalable and future-proof
Long-term availability | Arm and x86 cross-compatibility | Multi-vendor solution | Highly configurable
Innovative and upgradable | Accelerated time-to-market

42

www.seco.com

Please visit www.seco.com to find the latest version of these datasheets

Please visit www.seco.com to find the latest version of these datasheets

www.seco.com

43

Myon

MYON

MYON

Micro CPU module with Snapdragon™ 410E

Micro CPU module with NXP i.MX 8M Mini & i.MX8M Nano
Applications Processors

Thanks to the compact form factor ideal for IoT
and battery-powered handheld devices

Ideal for IoT and battery-powered handheld
devices thanks to particularly compact form factor

SOM-Myon-I-410E

SOM-Myon-II-MX8M-Mini

Available in Industrial Temperature Range

Myon standard advantages

Compact form
factor

Ideal for IOT andbattery-operated
handheld devices

Design investment limited to the carrier board | Consolidated standard form factor | Scalable and future-proof
Long-term availability | Arm and x86 cross-compatibility | Multi-vendor solution | Highly configurable
Innovative and upgradable | Accelerated time-to-market

Available in Industrial Temperature Range

Processor

Qualcomm® SnapdragonTM 410E QuadCore ARM Cortex A53, up to
1.2GHz (APQ8016E), ARM Cortex M3

Memory1 GByte LPDDR3 -1066 (533MHz), 32Bit, 2 Gbyte on request (part of
EMCP)

Graphics

Qualcomm® AdrenoTM 306 400MHz GPU
OpenGL ES 3.0, OpenCL, DirectX

Video
Interfaces

LVDS or MIPI Display (4 channel)

Video
Resolution

LVDS, MIPI: 1080p @30

Mass
Storage

8 Gbyte eMMC, 16 Gbyte on request (part of EMCP)

Networking

Onboard WLAN 802.11 b/g/n 2.4 GHz, BT 4.1 (Onboard antennas or
UFL connectors)
Ethernet via USB possible

USB

USB 2.0 OTG

Audio

Audio Codec: Stereo Headphone output, Mono Speaker 8Ω, 3Microphone inputs

Other
Interfaces

SD/SDIO Card, MIPI Camera (2ch and 4Ch)
8 Ports configurable for different interfaces:
GPIO, UART, SPI, I2C, I2S

PowerSupplyLiPo 3 - 4.5V / typ. 3.3V / charger 5V

Operating
SystemWindows 10 IoT CoreLinux
Android

OperatingTemperature*-25 ÷ 85°C

VideoInterfaces
Video
Resolution
Mass
Storage

Dimensions

48 x 32 x 4.2 mm

Networking*All carrier board components must remain within the operating temperature at any andall times, including start-up; carrier operating temperature is independent of the module
installed. Please refer to the specific module for more details. Actual temperature will
widely depend on application, enclosure and/or environment. Upon customer to consider
specific cooling solutions for the final system.

Processor

MemoryGraphics

NXP i.MX 8M Mini Family based on ARM® Cortex®-A53 cores+ general purpose Cortex®-M4 400MHz processor:
i.MX 8M Mini Quad - Full featured, 4x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Dual - Full featured, 2x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Solo - Full featured, 1x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Quad Lite - 4x Cortex®-A53 cores up to 1.8GHz, no VPU
i.MX 8M Mini Dual Lite - 2x Cortex®-A53 cores up to 1.8GHz, no VPU
i.MX 8M Mini Solo Lite - 1x Cortex®-A53 cores up to 1.8GHz, no VPU
NXP i.MX 8M Nano Family based on ARM® Cortex®-A53 cores+ general purpose Cortex®-M7 750MHz processor:
i.MX 8M Nano Quad - Full featured, 4x Cortex®-A53 cores up to 1.5GHz
i.MX 8M Nano Dual - Full featured, 2x Cortex®-A53 cores up to 1.5GHz
i.MX 8M Nano Solo - Full featured, 1x Cortex®-A53 cores up to 1.5GHz
i.MX 8M Nano Quad Lite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU
i.MX 8M Nano Dual Lite - 2x Cortex®-A53 cores up to 1.5GHz, no VPU
i.MX 8M Nano Solo Lite - 1x Cortex®-A53 cores up to 1.5GHz, no VPUMyon II: Soldered down LPDDR4-3200 memory, 32-bit interface, up
to 8GB
Myon II Nano: Soldered down LPDDR4-3200 memory up to 4 GB,
16-bit interface
i.MX 8M Mini Family of processors:
Vivante GC320 2D accelerator + GCNanoUltra 3D
accelerator
OpenGL ES 2.0, OpenVG 1.1 support
i.MX 8M Nano Family of processors:
Vivante GC7000UL 2D/3D GPU
OpenGL ES 3.1, OpenCL1.2, Vulkan support
MIPI display (4 channel) / Single- or Dual-LVDS
LVDS, MIPI: Up to 1920 x 1080p @60
onboard 8 Bit wide eMMC
2x SDIO interface (e.g. for external SD cards)
1x GB Ethernet RGMII and SIOP interface (for Myon II)
External chipsets for wireless communication can be connected via
SDIO, PCIe or USB interfaces (for Myon II)

USB

2x USB 2.0 OTG

PCI-e

PCIe (for Myon II)

Audio

Audio Codec: Stereo Headphone output, Speaker output, Stereo
Line-In, Microphone inputs

Serial Ports

4x UART

Other
Interfaces

SPDIF In/Out
I2S
Multichannel Serial-Audio-Interface
2x I2C
SPI
QSPI
GPIOs
PWM
MIPI CSI (4 channel)

Power
Supply3.3 ÷ 5.0 VDC

Operating
SystemOperatingTemperature*
Dimensions

Linux Yocto
DebianAndroid
Windows 10 IoT-40 ÷ 85°C (industrial)-25 ÷ 85°C (Extended Consumer)0 ÷ 70°C (Consumer)
48.0 x 32.0 x 4.2 mm*All carrier board components must remain within the operating temperature at any andall times, including start-up; carrier operating temperature is independent of the module
installed. Please refer to the specific module for more details. Actual temperature will
widely depend on application, enclosure and/or environment. Upon customer to consider
specific cooling solutions for the final system.

44

www.seco.com

Please visit www.seco.com to find the latest version of these datasheets

Please visit www.seco.com to find the latest version of these datasheets

www.seco.com

45

MYON

DEVELOPMENT KIT

MicroModule Carrier Board for Myon SOMs

HMI for Myon MicroModule SOMs

Carrier Board for Myon I, Myon II andMyon II Nano SOMs

HMI with Myon MicroModule SOM technology
supporting Myon I, Myon II and Myon II Nano

Carrier-Myon-ConXM

DEV-KIT-Myon-i-PAN-M7

Processor

Defined by compatible Myon SOMs•
Qualcomm® SnapdragonTM 410E Cortex A53, QuadCore up to
1.2GHz on Myon I SOM•
NXP i.MX 8M Mini Arm® Cortex A53 up to 1.8 GHz, up to Quad
Core, integrated Arm® Cortex M4 on Myon II SOM•
NXP i.MX 8M Nano Arm® Cortex A53 up to 1.5 GHz, up to Quad
Core, integrated Arm® Cortex M7 on Myon II Nano SOM

Processor

Depends on compatible Myon SOMs•
Qualcomm® SnapdragonTM 410E Cortex A53, QuadCore up to
1.2GHz on Myon I SOM•
NXP i.MX 8M Mini Arm® Cortex A53 up to 1.8 GHz, up to Quad
Core, integrated Arm® Cortex M4 on Myon II SOM•
NXP i.MX 8M Nano Arm® Cortex A53 up to 1.5 GHz, up to Quad
Core, integrated ARM Cortex M7 on Myon II Nano SOM

VideoInterfaces

LVDS, HDMI®

Graphics

Depends on compatible Myon MicroModule SOMs

Mass
StorageμSD Card Socket

Video
Interfaces

MIPI-CSI Camera connector

Networking

10/100 Mbit Ethernet RJ45 Connector
WLAN 802.11 b/g/n 2.4GHz, BT via Myon I

Video
Resolution

7.0 inch LVDS Display, resolution 800 x 480, LED lifetime min. 30k
hours, typ. 430 cd/qm brightness, P-Cap (Projected Capacitive touch
screen)USB

USB2.0 Host, USB2.0 OTG
Footprint for one optional 16-pin analog expansion connector for
stereo headset/line-out, speaker and analog line-in

Mass
StorageμSD Card Socket

Audio

Networking

Serial Ports

UART (low speed expansion connector)

10/100 Mbit Ethernet RJ45 Connector
WLAN 802.11 b/g/n 2.4GHz, BT via Myon I

USB

USB 2.0 Host, μUSB 2.0 OTG / USB via i-MOD extension connector

Other
Interfaces

1x 40-pin low speed expansion connector (compatible to
DragonBoard 410c):
SPI, I2S, 2x I2C,12x GPIO, DC power
1x 60-pin high speed expansion connector (compatible to
DragonBoard 410c):
4L MIPI-DSI, USB, 2x I2C, 2L+4L MIPI-CSI

Audio

Solderpads for Speaker, Headphone, Microphone

Serial Ports

UART via i-MOD extension connector

Power
SupplyIndustrial +12 up to +24V supply, +5V (USB) / Lithium-ion, lithium-ionpolymer battery-charger / Coin-Cell charger (Myon I PMIC)

OtherInterfaces

Operating
SystemMicrosoft Windows 10 IoT CoreLinux
Android

I2C, CAN, Keys via i-MOD extension connectors
Realtime Clock with Backup Cap
LED
Powerfail Detection

Power
SupplyIndustrial +12 up to 24V supply / Power over Ethernet (POE) on
requestOperatingTemperature*-20 ÷ 85°C

Operating
SystemMicrosoft Windows 10 IoT
LinuxAndroid

Dimensions

100.0 mm x 90.0 mm x 18.0 mm

OperatingTemperature*-20 ÷ 70°C

Dimensions

176.0 x 108.5 x 28 mm (include housing)*All carrier board components must remain within the operating temperature at any andall times, including start-up; carrier operating temperature is independent of the module
installed. Please refer to the specific module for more details. Actual temperature will
widely depend on application, enclosure and/or environment. Upon customer to consider
specific cooling solutions for the final system.

46

MYON

CARRIER BOARDS

www.seco.com*All carrier board components must remain within the operating temperature at any andall times, including start-up; carrier operating temperature is independent of the module
installed. Please refer to the specific module for more details. Actual temperature will
widely depend on application, enclosure and/or environment. Upon customer to consider
specific cooling solutions for the final system.

Please visit www.seco.com to find the latest version of these datasheets

Please visit www.seco.com to find the latest version of these datasheets

www.seco.com

47

TRIZEPSTRIZEPSTRIZEPS

SODIMM-200 CPU-Module with NXP i.MX 8M Mini
Applications Processors

SODIMM-200 CPU-Module with NXP i.MX 8M
Applications Processors

High performance for high-level video, voice and audio
processing combined with low power consumption

Ideal for industrial/home automation, streamingaudio or advanced imaging applications

SOM-Trizeps-VIII-MX8M-Mini

SOM-Trizeps-VIII-MX8M

Available in Industrial Temperature Range

Processor

NXP i.MX 8M Mini Family based on Arm® Cortex®-A53 cores+ general purpose Cortex®-M4 400MHz processor:
i.MX 8M Mini Quad - Full featured, 4x Cortex®-A53 cores
up to 1.8GHz
i.MX 8M Mini Dual - Full featured, 2x Cortex®-A53 cores
up to 1.8GHz
i.MX 8M Mini Solo - Full featured, 1x Cortex®-A53 cores
up to 1.8GHz
i.MX 8M Mini Quad Lite - 4x Cortex®-A53 cores up to 1.8GHz, no VPU
i.MX 8M Mini Dual Lite - 2x Cortex®-A53 cores up to 1.8GHz, no VPU
i.MX 8M Mini Solo Lite - 1x Cortex®-A53 cores up to 1.8GHz, no VPU

Available in Industrial Temperature Range

Processor

Optional: NXP™ Kinetis V Arm® Cortex-M0+ up to 75 MHz / 8x 16 Bit
ADC, CAN, UART, SPI, GPIO
Optional: Programmable FPGA, up to 4300 LUTs to convert parallel
display/camera/data-streams to MIPI DSI/CSI
MemorySoldered down LPDDR4-3200 memory, 32-bit interface, up to 8GB

Graphics

Integrated Graphics Processing Unit, supports 2 independent
displays.
Embedded VPU, supports HW decoding of HEVC,H.264, H.263,
MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG (not for
i.MX8M QuadLite).
Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 2.x, DirectX 11

Video
Interfaces

HDMI® v2.0a, MIPI display (4ch), Single-, Dual-LVDS or LCD 24 Bit
RGB
Camera Interfaces: 8bit parallel, MIPI (4ch and additional 2ch)

Video
Resolution

HDMI®, MIPI: up to 4k resolution

Mass
StorageOnboard 4 Bit wide μSD Card Socket or onboard 8 Bit wide eMMC

Networking

Onboard 10/100MBit/1GBit RGMII PHY or SIOP interface
Optional: WiFi 802.11 a/b/g/n/ac 2x2 MU-MIMO / BT 4.2/5.0

USB

2x USB 3.0 OTG

PCI-e

1x PCIe

Audio

Audio Codec: Stereo Headphone output, Mono Speaker output,
Stereo Line-In, Microphone input

Serial Ports

4x UART

Other
Interfaces

SPDIF In/Out
I2S
Multichannel Serial-Audio-Interface
2x I2C
SPI
QSPI
GPIOs
PWM

Power
Supply3.3 VDC

Operating
SystemLinux Yocto
Linux DebianAndroid
Windows 10 IoT

OperatingTemperature*0 ÷ 70°C (Consumer)-25 ÷ 85°C (Extended Consumer)-40 ÷ 85°C (industrial)

Dimensions

67.6 x 36.7 x 6.4 mm

Optional: Programmable FPGA with up to 4300 LUTs to convert parallel
display/camera/data-streams to MIPI DSI/CSI

Trizeps standard advantages

Powerful

Space and costsaving

SODIMM 200
standard

Reduced development time with cost-effective production | High computing power with relatively small dimensions
Long availability for at least 10 years | Pin compatibility for successor products | ARM-based processors from NXP
SODIMM 200 connectors | High pin compatibility with each other
Available with Linux, Android and Microsoft Windows 10 IoT Core & Enterprise

MemorySoldered down LPDDR4-3200 memory up to 8GB, 32-bit interface

Graphics

i.MX 8M Mini Family of processors:
Vivante GC320 2D accelerator + GCNanoUltra 3D
accelerator
OpenGL ES 2.0, OpenVG 1.1 support

Video
Interfaces

MIPI display (4 channel) / Single- or Dual-LVDS, LCD 24 Bit RGB

Video
Resolution

LVDS, MIPI: Up to 1920 x 1080p @60

Mass
StorageOnboard 4 Bit wide μSD Card Socket or onboard 8 Bit wide eMMC

Networking

1x GB Ethernet RGMII PHY and SIOP interface
Optional: WiFi 802.11 a/b/g/n/ac 2x2 MU-MIMO / BT 4.2/5.0

USB

2x USB 2.0 OTG

PCI-e

PCIe

Audio

Audio Codec: Stereo Headphone output, Mono Speaker output, Stereo
Line-In, Microphone input

Serial Ports

4x UART

Other
Interfaces

4 Bit wide SDIO
SPDIF In/Out
I2S
Multichannel Serial-Audio-Interface
2x I2C
SPI
QSPI
GPIOs
PWM
MIPI CSI (4 channel)

Power
Supply3.3 VDC

Operating
SystemLinux Yocto
Linux DebianAndroid
Windows 10 IoT

0 ÷ 70°C (Consumer)
Operating-25 ÷ 85°C (Extended Consumer)
Temperature*-40 ÷ 85°C (industrial)
Dimensions

67.6 x 36.7 x 6.4 mm*All carrier board components must remain within the operating temperature at any andall times, including start-up; carrier operating temperature is independent of the module
installed. Please refer to the specific module for more details. Actual temperature will
widely depend on application, enclosure and/or environment. Upon customer to consider
specific cooling solutions for the final system.

48

www.seco.com

Please visit www.seco.com to find the latest version of these datasheets

Please visit www.seco.com to find the latest version of these datasheets

NXP i.MX 8M Family based on Arm® Cortex®-A53 cores + general
purpose Cortex®-M4 processor:•
i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz•
i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz•
i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU*All carrier board components must remain within the operating temperature at any andall times, including start-up; carrier operating temperature is independent of the module
installed. Please refer to the specific module for more details. Actual temperature will
widely depend on application, enclosure and/or environment. Upon customer to consider
specific cooling solutions for the final system.

www.seco.com

49

TRIZEPSTRIZEPS

SODIMM-200 CPU-Module with NXP i.MX 8M Plus
Applications Processors

TRIZEPSTRIZEPSCARRIER BOARDSCARRIER BOARDSSODIMM-200 CPU-Module with NXP i.MX6
Applications Processors

Carrier Board for Trizeps VII SOMs

Carrier Board for Trizeps SODIMM SOMs

Bringing artificial intelligence to Arm® embedded
edge solutions

High-performance i.MX6 CPU module withcompact dimensions

Multifunctional Carrier Board which supports thecomplete functions of the Trizeps VII SOMs

Carrier Board for Trizeps VII / VIII / VIII Mini /VIII Nano / VIII Plus SOMs

SOM-Trizeps-VIII-MX8M-Plus

SOM-Trizeps-VII-MX6

Carrier-Trizeps-ConXT

Carrier-Trizeps-iP5-Base

Available in Industrial Temperature Range

NXP i.MX 8M Plus family SoCs: Dual or Quad Arm® Cortex®-A53
Cores + general purpose Cortex® M7 800MHz processor•
NXP i.MX 8M Plus Quad, 4x Arm® Cortex®-A53 Cores up to
1.8GHz•NXP i.MX 8M Plus Dual, 2x Arm® Cortex®-A53 Cores up to
1.8GH•
NPU: 2.3 TOPS Neural Network performance (not for Quad Lite)
Optional: NXP™ Kinetis V Arm® Cortex-M0+ up to 75 MHz / 8x 16 Bit
ADC, UART, SPI, GPIO, I2C
Optional: Programmable FPGA, up to 4300 LUTs

Processor

MemorySoldered down LPDDR4-4000 memory, 32-bit interface, up to 8GB

Graphics

Integrated Graphics Processing Unit GC7000UL, supports 3
independent displays.
Embedded VPU, supports HW decoding of HEVC/H.265, AVC/H.264,
MPEG-4, MPEG-2, MVC, VC-1, RV, VP6, VP7, VP8, VP9, JPEG, HW
encoding of HEVC/H.265, AVC/H.264
Supports OpenVG 1.1, OpenGL ES 3.1, OpenCL 1.2 Full Profile andVulkanAvailable in Industrial Temperature Range

Processor

NXP i.MX M6 Family based on Arm® Cortex®-A9 cores•
i.MX 6Solo - 1x Cortex®-A9 core up to 1.0GHz•
i.MX 6DualLite - 2x Cortex®-A9 cores up to 1.0GHz•
i.MX 6Dual - 2x Cortex®-A9 cores up to 1.0GHz•
i.MX 8Quad - 4x Cortex®-A9 cores up to 1.0GHz

MemorySoldered down LPDDR3-1066 memory up to 2 GB, 64-bit interface

Graphics

Vivante GC3500 2D Hardware accelerator
Vivante GC2000 3D Hardware accelerator, supports OpenGL® ES
2.0 3D
Dedicated Vector Graphics accelerator, supports OpenVG™ (onlyi.MX 6Dual and i.MX 6Quad)
Supports up to 3 independent displays with i.MX 6Dual and i.MX
6Quad
Supports 2 independent displays with i.MX 6DualLite and i.MX 6Solo

Mass
StorageOnboard 4 Bit wide μSD Card Socket or onboard 8 Bit wide eMMC

OtherInterfaces

Networking

1x 100 Mbit Ethernet RGMII PHY or 1000 Mbit Ethernet RGMII interface
Optional: WiFi 802.11 a/b/g/n/e/i/h/d/k/r/w, BT 3.0+ EDR

2x CAN galvanic isolated, 12/24V IOs (4x inputs (3 with ADC), 4x
outputs), analog PAL camera (Cinch), UPS (Uninterruptible Power
Supply), RTC with battery, 2x LED, I2C, GPIOs

Power
SupplyIndustrial +12 up to +24V supply

Operating
SystemWindows Embedded Compact
Linux DebianWindows 10 IoT

OperatingTemperature*-20 ÷ 85°C

Dimensions

174 mm x 104 mm x 20 mm

Networking

2x Gigabit Ethernet (1x RGMII PHY and 1x RGMII interface)
Optional: WiFi 802.11 a/b/g/n/ac 2x2 MU-MIMO / BT 4.2/5.0

PCI-e

1 x PCI-e

2x USB 3.0 OTG

AudioAC‘97 Audio Codec with 4/5 wires res. Touch and 4x 12 Bit ADC (2xcomparator inputs for battery monitoring); Stereo: Line-in, Mic-in,
Speaker-out, Headphone out

OtherInterfaces

Power
Supply3.3 VDC

Operating
SystemLinux Yocto
Linux DebianAndroid
Windows 10 IoT

OperatingTemperature*0 ÷ 70°C (Consumer)-25 ÷ 85°C (Extended Consumer)-40 ÷ 85°C (industrial)

Dimensions

67.6 x 36.7 x 6.4 mm

USB2.0 Host, USB2.0 OTG

1x RS232, 1x RS232/422/485

1x USB 2.0 OTG and 1x USB 2.0 Host

3x 4 Bit wide SDIO 3.0
SPDIF In/Out
I2S
Multichannel Serial-Audio-Interface
2x I2C
SPI
QSPI
GPIOs
PWMs
2x CANUSB

Serial Ports

USB

4x UART

Networking

2x 10/100 Mbit Ethernet RJ45 Connector
Wireless functionalities depend on Trizeps SOM:•
Trizeps VII: Onboard WiFi BT Modul, IEEE 802.11 a/b/g/n/e/i/h/
d/k/r/w, +18 dBm, 72 Mbps (20 MHz) and up to 150 Mbps (40MHz), BT 3.0+ DER

LVDS, up to 1920x1200
HDMI®, up to 1080p

Onboard 4 Bit wide μSD Card Socket or onboard 8 Bit wide eMMC

Serial Ports

SD Card Socket

Video
Resolution

Mass
Storage

Audio

RGB, LVDS, Dual LVDS

Mass
Storage

Audio

HDMI®, LVDS, eDP: Up to 1920 x 1080p @60
Video-Decoder: 1080p60, h.265/4, VP9, VP8 / Video Encoder:
1080p60, h.265/4

Digital: 18x I2S TDM, DSD512, S/PDIF Tx + Rx, 8 channel PDM
Microphone input
Analog: Stereo Headphone output, Mono Speaker output, Stereo
Line-In, Microphone input

Video
Interfaces

2.6W Audio Amplifier (pin header)
Microphone (pin header)Video
Resolution

Up to 1x PCI-e x1 Gen3 port

Defined by compatible Trizeps SODIMM SOMs•
NXP i.MX 6 Quad, Dual, DualLite, Solo, SoloX Arm® Cortex A9
up to 1.0 GHz on Trizeps VII SOM

HDMI® v1.4, 2x LVDS, LCD 24 Bit RGB, MIPI

HDMI®, MIPI display (4 channel) / Single- or Dual-LVDS, LCD 24 Bit
RGB

PCI-e

Processor

Video
Interfaces

VideoInterfaces

USB

Available in Industrial Temperature Range

Serial Ports

3x UART

Other
Interfaces

2x FlexCAN
S-ATAII
2x 4 Bit wide SDIO
RTC
SPDIF
Adress-Data-Bus
2x I2C
2x SPIGPIOs
2x PWM

Power
Supply3.3 VDC

Operating
SystemLinux
Android
Windows Embedded Compact 7, 2013
Windows 10 IoT Core

OperatingTemperature*-40 ÷ 85°C (industrial)-20 ÷ 85°C (Extended Consumer)0 ÷ 70°C (Consumer)

Dimensions

67.6 x 36.7 x 6.4 mm*All carrier board components must remain within the operating temperature at any andall times, including start-up; carrier operating temperature is independent of the module
installed. Please refer to the specific module for more details. Actual temperature will
widely depend on application, enclosure and/or environment. Upon customer to consider
specific cooling solutions for the final system.

Available in Industrial Temperature Range

Processor

Defined by compatible Trizeps SODIMM SOMs•
NXP i.MX 6 Quad, Dual, DualLite, Solo, SoloX Arm® Cortex A9
up to 1.0 GHz on Trizeps VII SOM•
NXP i.MX 8M Arm® Cortex A53 up to 1.5 GHz, up to Quad Core,
integrated Arm® Cortex M4 on Trizeps VIII SOM•
NXP i.MX 8M Mini Arm® Cortex A53 up to 1.8 GHz, up to Quad
Core, integrated Arm® Cortex M4 on Trizeps VIII Mini SOM•
NXP i.MX 8M Nano Arm® Cortex A53 up to 1.5 GHz, up to Quad
Core, integrated Arm® Cortex M7 on Trizeps VIII Nano SOM•
NXP i.MX 8M Plus Arm® Cortex A53 up to 1.8 GHz, up to Quad
Core, integrated Arm® Cortex M7 on Trizeps VIII Plus SOM

VideoInterfaces

RGB, LVDS, Dual LVDS, HDMI® (with Trizeps VII, Trizeps VIII, Trizeps
VIII Plus)

Mass
StorageµSD Card Socket

Networking

10/100 Mbit Ethernet RJ45 Connector
Wireless functionalities depend on Trizeps SOM:•
Trizeps VII: Onboard WiFi BT Modul, IEEE 802.11 a/b/g/n/e/i/h/
d/k/r/w, +18 dBm, 72 Mbps (20 MHz) and up to 150 Mbps (40MHz), BT 3.0+ EDR•
Trizeps VIII and Trizeps VIII Mini: Onboard WiFi-BT module, WiFi
2.4GHz/5Ghz, 802.11 a/b/g/n/ac 2x2 MU-MIMO / BT 5.0

USB

USB2.0 Host, USB2.0 OTG

Audio

SL2-40 pin header: stereo headphone (16R and 32R), speaker (Mono,
8R), LineIn, microphone

Serial Ports

RS232 and RS485 via D-SUB
SL2-40 pin header: 2x UART

OtherInterfaces

4 wire resistive touch interface, Realtime Clock with Backup Cap orbattery, LED, 3-Axis 12-bit/8-bit digital accelerometer, temp. sensor,
SATA II connector, I2C extension header, reset and user tactile
switch, powerfail detection, CAN
1x 40-pin extension connector:
GPIOs (1x with PWM), SPDIF (out and in), 2x CAN, SDIO, I2C, 3 x ADC

Power
SupplyIndustrial +12 up to +24V supply

Operating
SystemLinux Yocto
Linux DebianAndroid
Windows 10 IoT

OperatingTemperature*-20 ÷ 85°C

Dimensions

118.5 mm x 77.6 mm x 23.4 mm*All carrier board components must remain within the operating temperature at any andall times, including start-up; carrier operating temperature is independent of the module
installed. Please refer to the specific module for more details. Actual temperature will
widely depend on application, enclosure and/or environment. Upon customer to consider
specific cooling solutions for the final system.

*All carrier board components must remain within the operating temperature at any andall times, including start-up; carrier operating temperature is independent of the module
installed. Please refer to the specific module for more details. Actual temperature will
widely depend on application, enclosure and/or environment. Upon customer to consider
specific cooling solutions for the final system.

*All carrier board components must remain within the operating temperature at any andall times, including start-up; carrier operating temperature is independent of the module
installed. Please refer to the specific module for more details. Actual temperature will
widely depend on application, enclosure and/or environment. Upon customer to consider
specific cooling solutions for the final system.

50

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Please visit www.seco.com to find the latest version of these datasheets

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www.seco.com

51

TRIZEPSTRIZEPSTRIZEPSTRIZEPSCARRIER BOARDSCARRIER BOARDSDEVELOPMENT KIT

DEVELOPMENT KIT

Carrier Board for Trizeps SODIMM SOMs

SODIMM 200 Carrier Board for Trizeps SOMs

HMI for Trizeps SODIMM SOMs

HMI for Trizeps SODIMM SOMs

Carrier Board for Trizeps VII / VIII / VIII Mini /VIII Nano / VIII Plus SOMs

SODIMM 200 Carrier Board supporting Trizeps VII
and Trizeps VIII Nano/Mini/Plus SOMs

HMI with Trizeps SODIMM SOM technology which
supporting Trizeps CPU modules

HMI with Trizeps SODIMM SOM technology which
supporting Trizeps CPU modules

Carrier-Trizeps-pConXSCarrier-Trizeps-pConXS-III

DEV-KIT-Trizeps-i-PAN-T7-II

DEV-KIT-Trizeps-i-PAN-7

Available in Industrial Temperature Range

Available in Industrial Temperature Range

Defined by compatible Trizeps SODIMM SOMs•
NXP i.MX 6 Quad, Dual, DualLite, Solo, SoloX Arm® Cortex A9
up to 1.0 GHz on Trizeps VII SOM•
NXP i.MX 8M Arm® Cortex A53 up to 1.5 GHz, up to Quad Core,
integrated Arm® Cortex M4 on Trizeps VIII SOM•
NXP i.MX 8M Mini Arm® Cortex A53 up to 1.8 GHz, up to Quad
Core, integrated Arm® Cortex M4 on Trizeps VIII Mini SOM•
NXP i.MX 8M Nano Arm® Cortex A53 up to 1.5 GHz, up to Quad
Core, integrated Arm® Cortex M7 on Trizeps VIII Nano SOM•
NXP i.MX 8M Plus Arm® Cortex A53 up to 1.8 GHz, up to Quad
Core, integrated Arm® Cortex M7 on Trizeps VIII Plus SOM

Processor

Mass
Storage

SD Card Socket

Networking

10/100/1000 Mbit Ethernet RJ45 Connector
Wireless functionalities depend on Trizeps SOM:•
Trizeps VII: Onboard WiFi BT Modul, IEEE 802.11 a/b/g/n/e/i/h/
d/k/r/w, +18 dBm, 72 Mbps (20 MHz) and up to 150 Mbps (40MHz), BT 3.0+ EDR•
Trizeps VIII and Trizeps VIII Mini: Onboard WiFi-BT module, WiFi
2.4GHz/5Ghz, 802.11 a/b/g/n/ac 2x2 MU-MIMO / BT 5.0

Processor

Depends on compatible Trizeps SODIMM 200 SOMs•
NXP i.MX 6 Quad, Dual, DualLite, Solo, SoloX Arm®® Cortex A9
up to 1.0 GHz on Trizeps VII SOM•
NXP i.MX 8M Arm® Cortex A53 up to 1.5 GHz, up to Quad Core,
integrated Arm® Cortex M4 on Trizeps VIII SOM•
NXP i.MX 8M Mini Arm® Cortex A53 up to 1.8 GHz, up to Quad
Core, integrated Arm® Cortex M4 on Trizeps VIII Mini SOM•
NXP i.MX 8M Nano Arm® Cortex A53 up to 1.5 GHz, up to Quad
Core, integrated Arm® Cortex M7 on Trizeps VIII Nano SOM•
NXP i.MX 8M Plus Arm® Cortex A53 up to 1.8 GHz, up to Quad
Core, integrated Arm® Cortex M7 on Trizeps VIII Plus SOM

Processor

Mass
Storage

SD card socket

Graphics

Depends on compatible Trizeps SODIMM SOMs

Video
Interfaces

MIPI-CSI Camera interface connector

Networking

Wireless functionalities depend on Trizeps SOM:•
Trizeps VII: Onboard WiFi BT Modul, IEEE 802.11 a/b/g/n/e/i/h/
d/k/r/w, +18 dBm, 72 Mbps (20 MHz) and up to 150 Mbps (40MHz), BT 3.0+ EDR•
Trizeps VIII and Trizeps VIII Mini/Plus: Onboard WiFi-BT module,
WiFi 2.4GHz/5Ghz, 802.11 a/b/g/n/ac 2x2 MU-MIMO / BT 5.0

VideoResolution

7.0 inch LVDS Display, IPS technology, resolution 1024 x 600, LED
lifetime min. 30k hours, typ. 500 cd/qm brightness, P-Cap (Projected
Capacitive touch screen), Glass thickness 1.8 mm

USB

1x USB 3.0 OTG and 1x USB 2.0 Host via USB A connectors, 3x USB
2.0 Host via internal connectors

Mass
StorageμSD Card SocketUSB

USB2.0 Host, USB2.0 OTG, USB2.0 touch interface, USB2.0 Header

PCI-eMini PCIe Half-/Full Size card edge connector, combined with nano
SIM card slot

PCI-e

Mini PCIe Half-/Full Size card edge connector, combined with nano
SIM card slot

Video
Interfaces

RGB, LVDS, Dual LVDS, HDMI® (with Trizeps VII, Trizeps VIII, Trizeps
VIII Plus)

Video
Interfaces

Audio

3.5mm Stereo Jack, Digital Microphone Connector
SL2-40 pin header: stereo headphone (16R and 32R), speaker (Mono,
8R), LineIn, microphone

LVDS (KuK Modis Standard), Dual-LVDS, 18 Bit parallel RGB display
port, HDMI® (with Trizeps VII, Trizeps VIII, Trizeps VIII Plus), capacitive
touch, resistive touch

Audio

3.5 mm stereo audio head-phone jackSL2-40 pin header: stereo headphone (16R and 32R), speaker (Mono,
8R), LineIn, microphone

Serial Ports

RS232 D-Sub
i-MOD FFC connectors: UART
SL2-40 pin header: UART

OtherInterfaces

Realtime Clock with Backup Cap or battery
LED
3-Axis 12-bit/8-bit digital accelerometer
digital temperature sensor
reset and user tactile switch
powerfail detection
MIPI camera connector
analog BNC / Mini BNC parallel camera interface (optional)
2x CAN via i-MOD FFC connector or SL2-40 pin header
i-MOD FFC connectors: I2C, resistive Touch
SL2-40 pin header: Power, GPIOs (1x with PWM), SPDIF (out and in),
SDIO, I2C, 3x ADC

RS232 via D-SUB
SL2-40 pin header: 2x UART

Serial Ports

4 wire resistive touch interface, Realtime Clock with Backup Cap orbattery, LED, 3-Axis 12-bit/8-bit digital accelerometer, temp. sensor,
SATA II connector, I2C extension header, reset and user tactile
switch, powerfail detection, analog BNC / Mini BNC parallel camera
interface, MiPi camera connector
1x 40-pin extension connector:
GPIOs (1x with PWM), SPDIF (out and in), 2x CAN, SDIO, I2C, 3 x ADC

OtherInterfaces

Power
SupplyIndustrial +12 up to +24V supply

Operating
SystemLinux Yocto
Linux DebianAndroid
Windows 10 IoT

OperatingTemperature*-20 ÷ 85°C

Dimensions

118.5 mm x 84.0 mm x 43.0 mm*All carrier board components must remain within the operating temperature at any andall times, including start-up; carrier operating temperature is independent of the module
installed. Please refer to the specific module for more details. Actual temperature will
widely depend on application, enclosure and/or environment. Upon customer to consider
specific cooling solutions for the final system.

Available in Industrial Temperature Range

Power
SupplyIndustrial +12 up to +24V supply

Operating
SystemLinux Yocto
Linux DebianAndroid
Windows 10 IoT

OperatingTemperature*-20 ÷ 85°C

Dimensions

133.0 x 93.5 x 25.0 mm

Depends on compatible Trizeps SODIMM SOMs•
NXP i.MX 6 Quad, Dual, DualLite, Solo, SoloX Arm®® Cortex A9
up to 1.0 GHz on Trizeps VII SOM•
NXP i.MX 8M Arm® Cortex A53 up to 1.5 GHz, up to Quad Core,
integrated Arm® Cortex M4 on Trizeps VIII SOM•
NXP i.MX 8M Mini Arm® Cortex A53 up to 1.8 GHz, up to Quad
Core, integrated Arm® Cortex M4 on Trizeps VIII Mini SOM•
NXP i.MX 8M Nano Arm® Cortex A53 up to 1.5 GHz, up to Quad
Core, integrated Arm® Cortex M7 on Trizeps VIII Nano SOM•
NXP i.MX 8M Plus Arm® Cortex A53 up to 1.8 GHz, up to Quad
Core, integrated Arm® Cortex M7 on Trizeps VIII Plus SOM

Gigabit Ethernet RJ45 connector

Networking

Wireless functionalities depend on Trizeps SODIMM SOMs:•
Trizeps VII: Onboard WiFi BT Modul, IEEE 802.11 a/b/g/n/e/i/h/d/k/
r/w, +18 dBm, 72 Mbps (20 MHz) and up to 150 Mbps (40 MHz),BT 3.0+ EDR•
Trizeps VIII and Trizeps VIII Mini/Plus: Onboard WiFi-BT module,
WiFi 2.4GHz/5Ghz, 802.11 a/b/g/n/ac 2x2 MU-MIMO / BT 5.0

USB

USB 2.0 Host, μUSB 2.0 OTG / USB via i-MOD extension connector

Audio

3,5 mm Headset Jack for Microphone and Headphone
Solderpads for Speaker (2.6 W Audio Amplifier), Headphone,
Microphone

Serial Ports

UART via i-MOD extension connector

Other
Interfaces

I2C, CAN, Keys via i-MOD extension connectors
SPI via solderpads
Realtime Clock with Backup Cap
LED
Powerfail Detection

Power
SupplyIndustrial +12 up to 24V supply / Power over Ethernet (POE) on
requestOperating
SystemMicrosoft Windows 10 IoT
LinuxAndroid

OperatingTemperature*-20 ÷ 70°C

Dimensions

178.0 x 108.7 x 27.6 mm (include housing)

Available in Industrial Temperature Range

Processor

Depends on compatible Trizeps SODIMM SOMs, i.e.
•
NXP i.MX 6 Quad, Dual, DualLite, Solo, SoloX Arm® Cortex A9
up to 1.0 GHz on Trizeps VII SOM

Graphics

Depends on compatible Trizeps SODIMM SOMs

Video
Resolution

7.0 inch 18bpp Display, resolution 800 x 480

Mass
Storage

SD Card Socket

Networking

10/100 MBit Ethernet RJ45 connector
Wireless functionalities depend on Trizeps SODIMM SOMs

USB

USB 2.0 Host, USB 2.0 OTG

Audio

3,5 mm Headset Jack for Microphone and Headphone
Solderpads for Speaker (2.6 W Audio Amplifier), Headphone,
Microphone

Serial Ports

3x UART via extension connector

Other
Interfaces

Inputs/Outputs, I2C, CAN, SDIO, Stereo Headphone Output,
Microphone Input, LED, Realtime Clock, Powerfail Detection, GPIO

Power
SupplyIndustrial +12 up to 24V supply

Operating
SystemMicrosoft Windows Embedded Compact
Linux
Android

OperatingTemperature*‘0 ÷ 70°C / -20 ÷ 85°C on request

Dimensions

169.4 x 108.4 x 18.2 mm (include housing)*All carrier board components must remain within the operating temperature at any andall times, including start-up; carrier operating temperature is independent of the module
installed. Please refer to the specific module for more details. Actual temperature will
widely depend on application, enclosure and/or environment. Upon customer to consider
specific cooling solutions for the final system.

*All carrier board components must remain within the operating temperature at any andall times, including start-up; carrier operating temperature is independent of the module
installed. Please refer to the specific module for more details. Actual temperature will
widely depend on application, enclosure and/or environment. Upon customer to consider
specific cooling solutions for the final system.

*All carrier board components must remain within the operating temperature at any andall times, including start-up; carrier operating temperature is independent of the module
installed. Please refer to the specific module for more details. Actual temperature will
widely depend on application, enclosure and/or environment. Upon customer to consider
specific cooling solutions for the final system.

52

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Please visit www.seco.com to find the latest version of these datasheets

Please visit www.seco.com to find the latest version of these datasheets

www.seco.com

53

SBC

Single Board Computer advantages

Ready forsystems
integration

Best price point
for low volume
projects

Embedded NUC™

ReducedTime-to-market

Very lowengineering design
investment

3.5"

Pico-ITX

Off-the-shelfsolutionsother SBCs

SBC

SBC

3.5” SBC with Rockchip RK3568 SoC

3.5” SBC with the 11th Gen Intel® CoreTM and Intel® Celeron®
(Codename: Tiger Lake UP3) Processors

Up to 4K Multimedia Arm® Computing withWireless and Wired Connectivity

11th Gen Intel® Core™ Edge Compute withpower-efficient compute and graphics

SBC-3.5-RK3568

SBC-3.5-TGL-UP3

Processor

Rockchip RK3568 processor•
4x Cortex®-A55 cores, up to 2.0GHz, 64-bit architecture, with
Neural Processing Unit (NPU)

MemorySoldered-down DDR4-3200 memory, up to 4GB

Graphics

Mali-G52 1-Core-2EE GPU•
OpenGL ES 1.1/2.0/3.2•
Vulkan 1.0 and 1.1•
OpenCL 2.0 Full Profile
Embedded Video CODEC•
H.265/H.264/VP9 4K@60fps HW decoding•
VP8/VC1/MPEG-4/MPEG-2/MPEG-1 1080p @60fps HW
decoding•
H.265/H.264 1080p@60fps HW encoding
Supports 3 independent video outputs

Processor

Intel® Core™ i7-1185G7E, Quad Core @2.8GHz (4.4GHz Turbo) withHT, 12MB Cache, 28W TDP (12W cTDP)Intel® Core™ i5-1145G7E, Quad Core @2.6GHz (4.1GHz Turbo) withHT, 8MB Cache, 28W TDP (12W cTDP)Intel® Core™ i3-1115G4E, Dual Core @3.0GHz (3.9GHz Turbo) with HT,
6MB Cache, 28W TDP (12W cTDP)Intel® Celeron® 6305E, Dual Core @1.8GHz, 4MB Cache, 15W TDPIntel® Core™ i7-1185GRE, Quad Core @2.8GHz (4.4GHz Turbo) withHT, 12MB Cache, with IBECC, 28W TDP (12W cTDP) – Industrial
Intel® Core™ i5-1145GRE, Quad Core @2.6GHz (4.1GHz Turbo) withHT, 8MB Cache, with IBECC, 28W TDP (12W cTDP) - Industrial
Intel® Core™ i3-1115GRE, Dual Core @3.0GHz (3.9GHz Turbo) with HT,
6MB Cache, with IBECC, 28W TDP (12W cTDP) - Industrial

Memory2x DDR4-3200 SODIMM slots
Up to 64GB with IBECC supported only with Intel® Core™ Industrial
SoCs

Graphics

Up to two video decode boxes (VDBoxes) for enhanced video
stream capabilities
Support for up to 48 simultaneous 1080p streams ingestion
Support for up to four independent displays at up to 4K60 HDR
resolution or one display at 8K resolution
2x Multimode DisplayPort 1.4, on Dual DP++ connector
2x Multimode Display Port 1.4 on USB Type-C connectors (alternate
mode)
1x eDP 1.3 or Single/Dual-Channel 18-/24-bit LVDS interface

VideoInterfaces

HDMI®
LVDS single / dual channel interface
eDP 1.3 interface

Video
Resolution

HDMI®: up to 4K x 2K @60Hz
LVDS: up to 1920 x 1080 @60Hz
eDP:
up to 4096 x 2160 (4K)

Mass
StorageeMMC 5.1 drive soldered on-board, up to 64GB (first boot device)microSD slot (second boot device)
I2C flash
QSPI flash (factory option)

Video
Interfaces

Networking

2x Gigabit Ethernet ports, implemented using TI DP83867 Ethernet
PHY on RGMII interface coming from SoC
Optional on-boad M.2 1216 module WLAN 802.11 a/b/g/n/ac + BT 5.0
M.2 Socket 2 Key B for LTE module + microSIM card slot on-board

Video
Resolution

USB

2x USB 3.0 Type-A
1x USB 2.0 Type-A
1x USB 2.0 OTG micro-AB muxed with one USB 3.0 (used for Deep
Recovery)
1x USB 2.0 internal pin header
1x USB 2.0 internal pin header, dedicated to touch screen

Audio

TRRS combo audio jack (stereo mic in, stereo line out)
Mono speaker out (amplified 1.3Watt @8Ohm) on internal header
1x PDM signal ports on internal header

Serial Ports

1x debug UART
1x JTAG port
2x 4 wire RS-232 / RS-422 / RS-485 (multistandard transceivers) oninternal header
2x 2 wire TTL UART ports on internal header

Other
Interfaces

2x 2-lanes MIPI-CSI camera connector or 1x 4-lanes
M.2 Socket 2 Key M for AI accelerator modules
Dedicated connector for I2C touch screen controller
8x GPIOs or 4x GPIOs + 4 ADC (factory configuration alternatives)
2x CAN, 1x I2C, 1x SPI

Power
Supply+12VDC .. +24VDC range
RTC battery

Operating
SystemLinux Yocto
Android

OperatingTemperature*

0°C to +60°C (Commercial version)*

Dimensions

146 x 102 mm (3.5” form factor)* Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

DP, eDPUp to 5120x3200 @60Hz 24bpp / 7680x4320 @60Hz
30bpp with DSC

HDMI® 1.4 Up to 4Kx2K 24-30Hz 24bpp

Mass
Storage

M.2 SATA SSD slot (socket 2 Key B type 2242/3042) **M.2 NVMe slot (socket 3 Key M type 2280) PCIe Gen4 supported

Networking

2x NBase-T Ethernet interfaces, supporting 2.5Gb Ethernet
connection, managed by as many Intel® i225 2.5GbE controllers
M.2 WWAN slot (socket 2 Key B type 2242/3042) coupled to on-board
Micro-SIM slot. **M.2 WiFi/BT slot (socket 1 Key E type 2230)

USB

2x SuperSpeed USB 10Gbps ports on Dual type-A socket
2x SuperSpeed USB 20Gbps ports on USB type-C slots
2x USB 2.0 on pin header

Audio

HD audio codec / Cirrus Logic CS4207
Mic In, Line Out and S/PDIF Out, on pin header

Serial Ports

2x RS-232/RS-422/RS-485 UARTS software configurable, on pinheader

Other
Interfaces

2x Expansion M.2 slot (socket 3 Key M type 2280) with 4x PCIe Gen3
lanes
8x GPIOs, 2x I2C, SPI connectors
FAN connector
RST_BTN#, PWR_BTN# and activity LED signals on pin header
Optional TPM 2.0 on-board

Power
Supply+12VDC .. +24VDC range
Cabled coin cell battery for RTC

Operating
SystemMicrosoft® Windows 10 IoT Enterprise LTSC 2021
Linux (Kernel ≥ 5.4 version)OperatingTemperature*

0°C ÷ +60°C (Commercial version)-40°C÷ +85°C (Industrial version)

Dimensions

146 x 102 mm (3.5” form factor)*Measured at any point of SECO standard heatspreader for this product, during any andall times (including start-up). Actual temperature will depend on the application, enclosure,and/or environment. Each customer must consider application-specific cooling solutions
for the final system to keep the heatspreader temperature in the range indicated.
**SATA SSD and WWAN functionalities share the same slot and are therefore mutually
exclusive.

54

www.seco.com

Please visit www.seco.com to find the latest version of these datasheets

Please visit www.seco.com to find the latest version of these datasheets

www.seco.com

55

SBC

SBC

SBC

SBC

Pico-ITX SBC with the Intel® Atom® X6000E Series, Intel® Pentium® andCeleron® N and J Series (Codename: Elkhart Lake) SoCs

3.5” SBC with Rockchip PX30 SoC

3.5” SBC with AMD Ryzen™ Embedded R1000 / V1000 family of SOCs

3.5” SBC with NXP i.MX 8M Mini Processors

Compact Size & High Performance SBC with amulticore SoC

High-performance Android and Linux CPU
designed for digital multimedia applications

Full connectivity on powerful AMD Ryzen™
platform

Heterogeneous multi-core processing architecture
for edge node computing and multimedia

SBC-pITX-EHL

SBC-3.5-PX30

SBC-3.5-RV1000

SBC-3.5-MX8M-Mini

Available in Industrial Temperature Range

Intel® Celeron® J6413 Quad Core @ 1.8GHz (3GHz Turbo) 10W TDPIntel® Celeron® N6211 Dual Core @1.2GHz (3GHz Turbo) 6.5W TDPIntel® Pentium® J6426 Quad Core @2.0GHz (3GHz Turbo) 10W TDPIntel® Pentium® N6415 Quad Core @1.2GHz (3GHz Turbo) 6.5W TDPIntel® Atom® x6211E Dual Core @1.3GHz (3GHz Turbo) 6W TDP w/
IBECC and IHS - Industrial
Intel® Atom® x6413E Quad Core @1.5GHz (3GHz Turbo) 9W TDP w/
IBECC and IHS - Industrial
Intel® Atom® x6425E Quad Core @2.0GHz (3GHz Turbo) 12W TDP w/
IBECC and IHS - Industrial
Intel® Atom® x6212RE Dual Core @1.2GHz (no Turbo) 6W TDP w/
IBECC, IHS and TCC – Industrial
Intel® Atom® x6414RE Quad Core @1.5GHz (no Turbo) 9W TDP w/
IBECC, IHS and TCC – Industrial
Intel® Atom® x6425RE Quad Core @1.9GHz (no Turbo) 12W TDP w/
IBECC, IHS and TCC – Industrial

Processor(*) IHS: Integrated heat spreader; TCC: Time Coordinated Computing

MemorySoldered down LPDDR4-3200 memory, up to 16GB with IBECC
supported only with Atom® industrial SoCs
Speed: 4267MT/s single rank (1GB / 2GB / 4GB / 8GB), 3733MT/s dual
rank (16GB)

Graphics

Up to 3 independent displays
Integrated Intel® Gen11 UHD Graphics controller with up to 32 EU
4K HW decoding and encoding of HEVC (H.265), H.264, VP8, VP9,
WMV9/VC1 (decoding only)
DirectX 12.1, OpenGL ES 3.1, OpenGL 4.5, OpenCL™ 1.2, Vulkan 1.0

VideoInterfaces

2x Multimode DisplayPort 1.4, on Dual DP++ Connector
1x eDP 1.3 or Single/Dual-Channel 18-/24-bit LVDS interface

Video
Resolution

Up to 4096x2160 @60Hz

Mass
Storage

M.2 SATA SSD slot (Socket 2 Key B Type 2242/3042).**

Networking

M.2 WWAN Slot for Modems (Socket 2 Key B Type 2242/3042)
coupled to on-board Nano SIM slot. **USB

Dual SuperSpeed USB 10Gbps Standard-A connector
Dual USB 2.0 pin header

Audio

HD Audio codec / Cirrus Logic CS4207
Mic In, Line Out and S/PDIF Out, on pin header

Serial Ports

2x RS-232/RS-422/RS-485 UARTs (software configurable) on pinheader

Other
Interfaces

8x GPIOs, I2C, SPI connectors
2x CAN connector
Fan connector
RST_BTN#, PWR_BTN# and activity LED signals on pin header
Optional TPM 2.0 on-board

Power
Supply+12VDC
Cabled coin cell battery for RTC

Operating
SystemMicrosoft® Windows 10 IoT Enterprise
Linux
Yocto

OperatingTemperature*

0°C - +60°C (Commercial version)-40°C - +85°C (Industrial version)

Dimensions

100 x 72 mm (3,93” x 2,83”)* Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.
** SATA SSD and WWAN functionalities share the same slot and are therefore mutually
exclusive.

56

www.seco.com

Available in Industrial Temperature Range

Processor

Rockchip PX30 processor, 4x Cortex®-A35 cores

Max Cores

4

MemorySoldered-down DDR3L memory, up to 4GB total, 32-bit interface

Graphics

Mali-G31 GPU with High performance dedicated 2D processor
OpenGL ES 1.1 / 2.0 / 3.2, Vulkan 1.0, OpenCL 2.0, DX11 FL9_3
Embedded VPU, able to offer:• Multi-format 1080p 60fps video decoders(H.265, H.264, VC-1, MPEG-4, VP8)
• H.264 1080p@30fps HW encoding
Supports 2 independent video outputs

VideoInterfaces

LVDS Single / Dual Channel interface
HDMI® interface

Video
Resolution

HDMI®

Up to 1920x1080p

LVDS

Up to 1280x800

Mass
StorageeMMC 5.1 Drive soldered on-board, up to 64GB
Optional microSD Slot

Networking

1x 10/100 Ethernet port
Optional M.2 Socket 1 Key E Slot for WiFi/BT LE external modules
Optional miniPCI-e slot (USB interface only) for external modem
modules

USB

Audio

3x USB 2.0 Host ports on standard Type-A slots
USB Recovery internal connector
2x USB 2.0 ports on internal pin headers
PMIC embedded Audio Codec
Stereo audio out on internal header
TRRS combo jack for Headphone and Mic In Line Out audio jackor I2S Audio Class-D amplifier with stereo out available on internal
connector (factory alternatives)
Buzzer on-board

Serial Ports

1x TTL or RS-232 port (factory alternative)
1x Debug UART
1x TTL or RS-232 port (factory alternatives to microSD slot)
1x RS-485 port on internal connector
1x CAN port

Other
Interfaces

miniSIM Slot for USB Modem modules on miniPCI-e form factor
Optional CSI Camera connector
Ultra-low Power RTC
Trusted Secure Element
4-Channel LED Driver connector
Microcontroller Programmable Interfaces:
2x 4-Wire UARTs on internal connector
2x 2-Wire UARTs on internal connector
1x SPI connector
2x I2C on internal connector
8-channel timer connector
16x GPIs @3.3V (5V tolerant)
16x GPOs @3.3V

Power
Supply+12VDC ÷ +24 VDC
RTC battery

Operating
SystemLinux
Yocto
Android

Processor

Max Cores
MemoryGraphics
Video
Interfaces
Video
Resolution
Mass
Storage
Networking

USB

Audio
PCI-e
Serial Ports

Other
Interfaces

Power
SupplyOperating
SystemOperatingTemperature*

0°C ÷ +60°C (Commercial Temperature range)-20°C÷ +85°C (Extended Temperature range)

OperatingTemperature*

Dimensions

146 x 102 mm (3.5” form factor)

Dimensions*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

Please visit www.seco.com to find the latest version of these datasheets

AMD Ryzen™ Embedded V1000 family SoCs:
AMD Ryzen™ Embedded V1807B with AMD Radeon™ Vega 11
Graphics, Quad Core Dual Thread @ 3.35GHz (3.8 Boost), TDP 35-54W
AMD Ryzen™ Embedded V1756B with AMD Radeon™ Vega 8
Graphics, Quad Core Dual Thread @ 3.25GHz (3.6 Boost), TDP 35-54W
AMD Ryzen™ Embedded V1605B with GPU AMD Radeon™ Vega 8,
Quad Core Dual Thread @ 2.0GHz (3.6 Boost), TDP 12-25W
AMD Ryzen™ Embedded V1202B with GPU AMD Radeon™ Vega 3,
Dual Core Dual Thread @ 2.3GHz (3.2 Boost), TDP 12-25W

Processor

NXP i.MX 8M Mini Family based on Arm® Cortex®-A53 cores + general
purpose Cortex®-M4 400MHz processor:
i.MX 8M Mini Quad – Full featured, 4x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Dual – Full featured, 2x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Solo – Full featured, 1x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Quad Lite –4x Cortex®-A53 cores up to 1.8GHz, no VPU
i.MX 8M Mini Dual Lite –2x Cortex®-A53 cores up to 1.8GHz , no VPU
i.MX 8M Mini Solo Lite –1x Cortex®-A53 cores up to 1.8GHz, no VPU

AMD Ryzen™ Embedded R1000 family SoCs:
AMD Ryzen™ Embedded R1606G with GPU AMD Radeon™ Vega 3,
Dual Core Dual Thread @ 2.6GHz (3.5 Boost), TDP 12-25W
AMD Ryzen™ Embedded R1505G with GPU AMD Radeon™ Vega 3,
Dual Core Dual Thread @ 3.25GHz (3.6 Boost), TDP 12-25W

Max Cores

4+1

MemorySoldered-down LPDDR4 memory, up to 4GB total, 32-bit interface

4

Graphics

GC320 2D accelerator + GCNanoUltra 3D accelerator
Embedded VPU (not for Lite processors), able to offer:•
VP9, HEVC/H.265, AVC/H.264, VP8 HW Decoding•
AVC/H.264, VP8 HW encoding
OpenGL ES 2.0, OpenVG 1.1 support

Video
Interfaces

LVDS Single/Dual Channel connector or eDP connector(factory alternatives)
MIPI-CSI Camera interface connector

Video
Resolution

Up to 1920x1080p60, 24bpp

Mass
Storage

Optional eMMC 5.1 drive on-board, up to 64GB
MicroSD slot
2Kb I2C FlashQSPI Flash

Networking

2x GbEthernet interfaces (1 optional)
Optional shielded ultra-small dual Band WiFi 802.11 a/b/g/n/ac with
Bluetooth 5.0 module onboard
Optional soldered on-board LTE Cat 4 Modem with microSIM slot or
Telenor eSIM with 5MB BundleUSB

2x USB 2.0 Host ports on Type-A socket
2x USB 2.0 Host ports on internal pin header
1x USB Host or client port on micro-AB connector (interface sharedwith the optional on-board modem)

Audio

Digital Mic In connector (2x PDM inputs)
Amplified mono Speaker Output

Serial Ports

Up to 2x RS-232 or RS-485 or CAN Serial ports (factory options,shared with GPIOs and SPI interfaces)
2x Debug UARTS

OtherInterfaces

I/O Connectors with:•
2xPWM @3.3V•
GP I2C interface @3.3V•
1x Open Drain output (max 12V, 250mA)•
2x GPIOs @3.3V•
1xRS-232 or 1x RS-485 or 4x GPIOs / 1x UART or
1x CAN (factory options)•
1xRS-232 or 1x RS-485 or 4x GPIOs / 1x UART or
1x CAN + on-board ultra-low power RTC (factory options)
Watchdog
Dedicated connector for I2C Touch Screen Controller Support
Onboard Buzzer (Comm. temp. range only)
Optional Ultra Low Power RTC

Power
Supply+12VDC ÷ +24VDC

Operating
SystemYocto
Android (planned)

2x DDR4 ECC and non-ECC SODIMM Slots
Support DDR4-2400 memories (DDR4-3200 with V1807B and
V1756B), up to 32GB total
GPU AMD Radeon™ VEGA with up to 11 Compute Units
DirectX® 12 supported
H.265 (10-bit) decode and 8-bit video encode
VP9 decode
4 independent displays supported (3 with R1000 SoCs)
4x DP++ connectors (only 3 working with R1000 SoCs
DP++:

Up to 4096 x 2160

M.2 NVMe slot (Socket 2 Key M Type 2280), PCI-e x4 interface
microSD Card slot (combo with miniSIM slot)
2x SATA 7p M connectors w/ 1x power connector
Up to 2 x Gigabit Ethernet ports
M.2 WWAN slot (Socket 2 Key B Type 2242/3042) for Modems
M.2 Connectivity Slot (Socket 1 Key E Type 2230)
2 x USB 3.0 Host ports on USB 3.0 Type-A sockets
2 x USB 2.0 Host ports on internal pin header
1 x USB 3.0 (V1000 SoCs) / USB 2.0 (R1000 SoCs) Host port on WWAN
M.2 slot
1 x USB 2.0 Host port on M.2 Connectivity Slot
HD Audio codec
Line Out + Microphone + S/PDIF Out interfaces on internal pin header
1 x PCI-e x4 port on M.2 NVMe Slot
1 x PCI-e x1 port on M.2 WWAN Slot
1 x PCI-e x1 port on M.2 Connectivity Slot
2x PCI-e x1 on Gigabit Ethernet Controllers
2 x RS-232/RS-422/RS-485 UARTS, on internal Pin Header
miniSIM slot for M.2 modems (combo with microSD slot)
8 x GPI/Os connector
FAN connector
Switch / LED Front Header connector
2x I2C on internal pin header
Antitamper connector
Optional TPM 1.2 or 2.0 onboard+12VDC ÷ +24 VDC
RTC battery
Microsoft® Windows 10 (64-bit)
Linux
0°C ÷ +60°C (Commercial version)-40°C ÷ +85°C (Industrial version, only for future SoCs in extended
temperature range and with TDP ≤25W)
146 x 102 mm (3.5” form factor)*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

Please visit www.seco.com to find the latest version of these datasheets

0°C ÷ +60°C (Commercial version)Operating-40°C ÷ +85°C (industrial version, limited to -30°C ÷ +85°C with WiFi/BT
Temperature*module on-board)
Dimensions

146x102 mm (3.5” form factor)*Measured at any point of SECO standard heatsink for this product, during any and alltimes (including start-up). Actual temperature will widely depend on application, enclosure
and/or environment. Upon customer to consider application-specific cooling solutions forthe final system to keep the heatspreader temperature in the range indicated.

www.seco.com

57

SBC

SBC

SBC

SBC

3.5” SBC with NXP i.MX 8X Applications Processors

3.5” SBC with NXP i.MX8 Applications Processors

Pico-ITX SBC with the Intel® Atom® X Series, Intel® Celeron® J / N Series
and Intel® Pentium® N Series (Codename: Apollo Lake) Processors

3.5” SBC with Rockchip RK3399 SoC

Ideal for certified performance requirements andsafety efficientIndustrial Arm® solution for IoT edge computing
applications

x86 solution designed for IoT edge computing inharsh environments

The Right Balance of Graphic/Computing
Performance and Cost

SBC-3.5-MX8X

SBC-3.5-MX8

SBC-pITX-APL

SBC-3.5-RK3399

Available in Industrial Temperature Range

NXP i.MX 8X family SoCs: Dual or Quad Arm® Cortex®-A35 Cores + 1x
Cortex® M4F core for real-time processing•
NXP i.MX8 QuadXplus, 4x Arm® Cortex®-A35 Cores + 1x Cortex®
M4F core for real-time processing•
NXP i.MX8 DualXplus, 2x Arm® Cortex®-A35 Cores + 1x Cortex®
M4F core for real-time processing

Processor

Max Cores

4+1

MemorySoldered down LPDDR4 memory @ 1200MHz, 32-bit interface, up
to 4GB

Graphics

Embedded GC7000Lite GPU
Supports OpenGL 3.0, 2.1, OpenGL ES 3.1, OpenCL 1.2 Full Profile and1.1, OpenVG 1.1, and Vulkan
Embedded VPU, supports HW decoding of HEVC/H.265, AVC/H.264,
MPEG-2, VC-1, RV10, VP8, H.263 and MPEG4.2t, HW encoding of
AVC/H.264
2 independent displays supported

Video
Interfaces

Factory options:•eDP 4-lane interface + LVDS single Channel 18-/24-bit interface•
LVDS Dual Channel / 2 x LVDS Single Channel interface

Video
Resolution

Up to 1080p60

Mass
Storage

Soldered onboard eMMC 5.1 Drive, up to 64GBQSPI NOR Flash soldered on-board

Networking

Up to 2 x Gigabit Ethernet ports
On-board WiFi 802.11 a/b/g/n + BT 5.0 module, optionalUSB

1x USB 3.0 Host ports on USB 3.0 Type-A socket
1x USB OTG Port on micro-AB connector (interface shared with USB
2.0 interface of USB 3.0 Type-A socket)
2x USB 2.0 Host ports on Dual Type-A socket
1x USB 2.0 Host port on miniPCI-e Slot

Available in Industrial Temperature Range

Processor

NXP i.MX 8 Family:i.MX 8QuadMax: 2x Arm® Cortex®-A72 + 4x Arm® Cortex®-A53 + 2x
Cortex®-M4F
i.MX 8QuadPlus: 1x Arm® Cortex®-A72 + 4x Arm® Cortex®-A53 + 2x
Cortex®-M4F

Max Cores

8

MemorySoldered down LPDDR4 memory, 64-bit interface, 1600MHz.
Base configuration 2GB, up-scalable to 4GB, 6GB, 8GB

Graphics

2x Graphics accelerators Vivante GC7000 / XVSX or GC7000Lit /XVSX QuadMax and QuadPlus
1x embedded VPU, supporting H.265 (4K30) and H.264 (1080p60)
decoding and H.264 (1080p30) encoding
Supports 3 independent video outputs (total combined resolution 4K)

Video
Interfaces

HDMI® output (Micro) (HDMI® 2.0a Tx interface)
HDMI® input (HDMI® 2.0a Rx interface)Video
Resolution

HDMI®:
LVDS, eDP:

Mass
StorageeMMC 5.1 Drive soldered on-board, up to 64GB
1x S-ATA interface available on M.2 Socket 2 Key B Slot (interface
shared with PCI-e x1)
microSD Card Slot
4MB QuadSPI Flash NAND (boot device only)

Graphics

Networking

2x Gigabit Ethernet interfaces
Combo WiFi 802.11 a/b/g/n/ac + BT LE 4.2 module with ceramic SMT
antennas on-board
M.2 Socket 2 Key B Slot for M.2 Modems
M.2 Socket1 Key E Slot for WiFi + BT external modules

Video
Interfaces

USB

1 x USB 3.0 Host port on Type-A socket
1x USB 2.0 OTG port on micro-AB socket
1x USB 2.0 Host port on external Type-A socket
1x USB 2.0 Host port on internal connector
2 x USB 2.0 ports available on M.2 Key B and Key E slots

Up to UltraHD (4K)
up to 1080p

Audio

I2S Audio codec
Mic In + Hp-Out on TRRS combo connector
Line Out + 2x Mic-In interfaces on internal connector

PCI-e

2x PCI-e x1 ports, available on M.2 Socket 1 Key E and on M.2 Socket 2
Key B (pin shared with SATA interface) Slots

PCI-e

Optional mini PCI-e Slot

Audio

I2S Audio Codec
HP + MIC interfaces, available on a single combo TRRS connector

Serial Ports

1x UART on expansion connector, optionally with RS-232 interface
1x UART on expansion connector, optionally with RS-485 interface
1x CAN port, available at TTL Level on expansion connector or with
CAN transceiver on dedicated connector
2x Debug UARTs on dedicated connectors

Serial Ports

1x UART TTL
1x RS-232 / UART TTL configurable
1x RS-485 / RS-422 / UART TTL configurable
3x CAN interfaces

Other
Interfaces

Available on expansion connector:•
16x GPIOs•
I2C interface•
2x analog inputs•
1x PWM
Power and reset button input on dedicated connector

Other
Interfaces

4x Analog Inputs
6x GPIOs
SPI interface
I2C interface
Embedded additional RTC circuitry for lowest power consumption
SIM dedicated slot

Power
SupplyFactory option, +12VDC or +24 VDC input voltage
DC power jack or 2-poles PCB terminal block for voltage supply
RTC battery

Operating
SystemLinux

OperatingTemperature*-40°C ÷ +85°C (Industrial version)

Dimensions

146 x 102 mm (3.5” form factor)*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

Available in Industrial Temperature Range

Power
Supply+12VDC ± 10%

Operating
SystemWind River Linux
Yocto
Android

OperatingTemperature*

0°C ÷ +60°C (Commercial version)-40°C ÷ +85°C (Industrial version)

Dimensions

146 x 102 mm (5,75” x 4,02”)*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range
indicated.

Processor

Intel® Atom® x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2
Cache, 6.5W TDPIntel® Atom® x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2
Cache, 9.5W TDPIntel® Atom® x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2
Cache, 12W TDPIntel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2
Cache, 6W TDPIntel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2
Cache, 6W TDPIntel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), 2MB
L2Cache, 10W TDPIntel® Celeron® J3355, Dual Core @2.0GHz (Burst 2.5GHz), 2MB
L2Cache, 10W TDP

Max Cores

4

Max Thread

4

MemoryVideo
Resolution
Mass
Storage

Networking
USB
Audio
Serial Ports

32-bit Single-/Dual-/Quad-Channel LPDDR4 soldered on-board, up
to 2400 MT/s
Max memory size 8GB
Integrated Intel® HD Graphics 500 series controller with up to 18
Execution Units
Three Independent displays supported
HW decoding of HEVC(H.265), H.264, MVC, VP8, VP9, MPEG2, VC-1,
WMV9, JPEG/MJPEG formats
HW encoding of HEVC(H.265), H.264, MVC, VP8, VP9 and JPEG/MJPEG
formats
HDMI® connector
Optional DP++ connector (combo with HDMI®)LVDS connector
HDMI®:
up to 3840x2160 @ 30HzDP++:
up to 4096x2160 @ 60Hz
LVDS:
up to 1920x1200 @ 60Hz
Optional eMMC 5.0 drive on-board
SATA Gen3 7p M connector
SSD M.2 Socket 2 Key B lot, size 2260 / 3042 (excludes WWAN
modules)microSD Card slot (combo with miniSIM slot)
Up 2x Gigabit Ethernet connectors
WWAN (modem) M.2 Socket 2 Key B 2260 / 3042 slot (excludes SSD
interface)
Connectivity M.2 Socket 1 Key E 2230 Slot for WiFi+BTLE modules
USB 3.0 Dual Type-A connector
Internal USB 2.0 Dual pin header
HD Audio Codec
Line Out + Microphone + S/PDIF Out interfaces on internal pin header
2 x RS-232/RS-422/RS-485 Serial ports on internal pin header

OperatingTemperature*miniSIM slot for M.2 modems (combo with microSD slot)
8 x GPI/Os connector
FAN connector
Switch / LED Front Header connector
I2C + INT# + RST# signals for I2C Touch Screen controller on LVDS
connector
Optional TPM 2.0 on-board+12VDC
Cabled coin cell battery for RTC
Windows 10 Enterprise (64-bit)
Windows 10 IoT Core (32- / 64-bit)
WindRiver Linux 64-bit
Yocto (64-bit)
Android (planning)
0°C ÷ +60°C (Commercial version)-40°C ÷ +85°C (industrial version)

Dimensions

100 x 72 mm (3,93” x 2,83”)

OtherInterfaces

Power
SupplyOperating
SystemAvailable in Industrial Temperature Range

Processor

Rockchip RK3399 processor, 2x Cortex®-A72 MP cores + 4x
Cortex®-A53 MPCores, up to 1.8GHz, 64-bit architecture

Max Cores

2+4

MemorySoldered-down LPDDR4 memory, up to 4GB total, 64-bit interface

Graphics

4-Core Mali-T860MP4 GPU
OpenGL ES 1.1/2.0/3.0/3.1, OpenVG 1.1, OpenCL, DX11 support
Embedded VPU, able to offer:•
H.265 10-bit, H.264 10-bit, VP9 8-bit 4Kx2K@60fps HW Decoding•
MPEG-4/MPEG-2/VP8 1080p@60fps HW Decoding•
H.264, VP8 1080p@30fps HW encoding
Supports 2 independent video outputs

VideoInterfaces

LVDS Single / Dual Channel interface
eDP 1.3 interface
HDMI® 4K interface (HDMI® 4K interface)
DP 1.2 interface on USB Type-C connector (alternate mode)Video
Resolution

HDMI®, DP:
eDP:
LVDS:

Up to 4K x 2K @60Hz (HDMI® DP: Up to 4K x 2K
@60Hz)Up to 4096 x 2160 (4K)
Up to 1920 x 1080 @60Hz

Mass
Storage

SPI Flash (alternative to CAN Controller #1)
eMMC 5.1 Drive soldered on-board
microSD slot

Networking

Up to 2 x Gigabit Ethernet ports
Optional soldered on-board M.2 1216 WLAN 802.11 a/b/g/n/ac + BT
5.0 module
Optional on-board LTE Modem

USB

1 x USB 3.0 Type-C port (Alternate mode with DP)
1x USB 3.0 Host port on Type-A socket
2 x USB 2.0 Host ports on Dual Type-A socket
Up to 2 x USB 2.0 Host ports on internal pin header

Audio

Optional I2S Audio Codec w/ TRSS Jack (MicIn / Lineout)

Serial Ports

1x Debug UARTs
Up to 2x RS-232 (factory options)
Up to 2x RS-485 (factory options)
Up to 2x CAN ports (factory options).

Other
Interfaces

Optional 2x MIPI-CSI Camera connectors, 4-lanes CSI input eachone
miniSIM slot or eSIM for on-board optional modem
I/O Connector #1 with I2C interface + 1x Open-Drain + (RS-232 or
RS-485 - factory alternatives)
I/O Connector #2 with 3xGPIOs + 1x PWM + (RS-232 or RS-485 or
TTL UART - factory alternatives)
Dedicated connector for I2C Touch Screen Controller Support
Optional Ultra-low Power RTC (Alternative to CAN Controller #2)
Optional SPI external interface (alternative to CAN Controller #1)
Optional LED Driver
Optional Trust Secure Element on-board

Power
Supply+12VDC ÷ +24 VDC
RTC battery

Operating
SystemLinux Yocto
Android (under development)

OperatingTemperature*

0°C ÷ +60°C (Commercial Temperature range)-20°C ÷ +85°C (Extended Temperature range)

Dimensions

146 x 102 mm (3.5” form factor)*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range
indicated.

58

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Please visit www.seco.com to find the latest version of these datasheets

Please visit www.seco.com to find the latest version of these datasheets

www.seco.com

59

SBC

SBC

SBC

SBC

3.5” SBC with NXP i.MX 8M Applications Processors

embedded NUC™ SBC with Intel® Atom® X Series, Celeron® J/N Series,
Pentium® N Series (Codename: Apollo Lake) Processors

embedded NUC™ SBC with N-series Intel® Pentium® / Celeron® andx5-Series Atom® SOCs

Pico-ITX SBC with Intel® Atom® E3800 (Codename: Bay Trail)
Processors SoCs and ECC DDR3L memory

A new generation of cost effective solutions for
multimedia and industrial IoT applications

Flexible and expandable full industrial x86 eNUC
SBC

Multifunctional SBC on the eNUC form factor

Limitless Embedded applications

SBC-3.5-MX8M

SBC-eNUC-APL

SBC-eNUC-BSW

SBC-pITX-BT

Available in Industrial Temperature Range

Processor

NXP i.MX 8M Family, based on Arm® Cortex®-A53 MPCore +Cortex-M4 core platform:
i.MX 8M Quad - Quad core up to 1.5GHz
i.MX 8M QuadLite - Quad core up to 1.5 GHz per corei.MX 8M Dual - Dual core up to 1.5 GHz per core

MemorySoldered down DDR3L memory, up to 2GB

Graphics

Vivante GC7000Lite GPU, supporting OpenGL ES 1.1 / 2.0 / 3.0 / 3.1,
Open CL 1.2 and Vulkan
Dedicated VPU (not for QuadLite), supporting 4Kp60 HEVC/H.265
main and main 10 decoder, 4Kp60 VP9 decoder, 4Kp30 AVC/H.264
decoder, 1080p60 MPEG-2, MPEG-4p2, VC-1, VP8, RV9, AVS, MJPEG,
H.263 decoder
Dual Display support

Available in Industrial Temperature Range

Processor

Max Cores

4

Max Thread

4

MemoryQuad Channel soldered down LPDDR4 memory, up to 8GB

Video
Interfaces

embedded Display Port 1.4 connector (switched with HDMI®)
Optional LVDS interface
Optional HDMI® 1.4 / 2.0a interface (switched with eDP)
4-lane MIPI_CSI Camera interface

Video
Resolution

HDMI®, eDP:
LVDS:

Mass
Storage

Optional eMMC drive on-board, up to 16GB
microSD Card slot

Networking

Optional WiFi ac/a/b/g/n + BT 5 module with onboard U.FL antennaconnectors
Gigabit Ethernet port
M.2 Socket 2 2260 / 3042 Key B slot for WWAN modules (modem)

Video
Interfaces
Video
ResolutionUSB

USB Device on USB 2.0 micro-AB connector (interface shared withUSB 3.0 port)
USB 3.0 Type-A connector (interface shared with USB 2.0 micro-AB)
USB 2.0 Dual Type-A connector
Optional USB 2.0 internal T/S connector (excludes one USB 2.0
Type-A interface)

up to 4096x2160
up to 1920x1080

OperatingTemperature*

Integrated Intel® HD Graphics 500 series controller, with up to 18
Execution Units
4K HW decoding and encoding of HEVC(H.265), H.264, VP8, VP9, MVC
Three independent display support
Two DP++ 1.2 interfaces on miniDP connectors(supports HDMI® displays through external adapter)embedded Display Port (eDP) internal connector
LVDS through optional external adapterDP:
Up to 4096 x 2160 @60HZ
eDP:
Up to 3840 x 2160 @60Hz
HDMI®:Up to 3840 x 2160 @30Hz
LVDS:
Up to 1920 x 1200 @ 60Hz
Optional eMMC drive onboard
M.2 SATA SSD slot (Socket 2 Key B Type 3042/2260 **)microSD Card slot
SATA 7p M connector
2x Gbit LAN / Intel Gigabit Ethernet i21x family controller
M.2 WWAN Slot for Modems (Socket 2 Key B Type 3042/2260 **)M.2 WLAN Connectivity Slot for WiFi/BT (Socket 1 Key E type 2230)
2 x USB 3.0 Host ports on USB 3.0 Type-A sockets
2 x USB 2.0 Host ports on USB 2.0 Type-A sockets
2 x USB 2.0 Host ports on internal pin header
1 x USB 3.0 Host port on SSD/WWAN M.2 slot
1 x USB 2.0 Host port on WLAN M.2 Slot
1 x PCI-e x2 port on M.2 SSD/WWAN Slot
1 x PCI-e x1 port on WLAN M.2 Slot
HD Audio codec / Cirrus Logic CS4207
Mic In and Line Out Audio jacks
Amplified Speaker output on internal pin header
2 x RS-232/RS-422/RS-485 UARTS software configurable, on internal
Pin Header
2 x I2C + 8 x GPI/Os on Feature connector
Button / LED front panel header
CIR (Consumer InfraRed) sensor
microSIM slot for M.2 WWAN Modem
Optional TPM 2.0 on-board+18VDC ÷ +32 VDC recommended+15VDC ÷ +36 VDC absolute
RTC battery
Microsoft® Windows 10 Enterprise (64 bit)
Microsoft® Windows 10 IoT Core
Yocto (64 bit)Linux
0°C ÷ +60°C (Commercial version)-40°C ÷ +85°C (Industrial version)

Dimensions

101.6 x 101.6 mm (4” x 4”)

Graphics

Mass
Storage

Audio

I2S Audio Codec
Speaker + Microphone + Earphone interfaces on internal pin headersLine Out + Mic In combo TRRS audio jackOptional 10W for channel amplified Speaker connector

Networking

Serial Ports

RS-232 Serial port connector
Debug UART on internal pin header
CAN Port

USB

Other
Interfaces

microSIM slot for M.2 modems
SPI interface
I2C Touch Screen dedicated connector
8 x GPI/Os connector
SPI Connector

Power
Supply+12VDC
Coin cell battery for RTC

Operating
SystemLinux
Android

OperatingTemperature*

0°C ÷ +60°C (Commercial version)-40°C ÷ +85°C (industrial version, only boards without optional WiFi
module)Dimensions

101.6 x 147 mm (4” x 5.78”)*Measured at any point of SECO standard heatspreader for this product, during
any and all times (including start-up). Actual temperature will widely depend
on application, enclosure and/or environment. Upon customer to consider
application-specific cooling solutions for the final system to keep the heatspreader
temperature in the range indicated.

Intel® Atom® x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2
Cache, 6.5W TDPIntel® Atom® x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2
Cache, 9.5W TDPIntel® Atom® x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2
Cache, 12W TDPIntel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2
Cache, 6W TDPIntel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2
Cache, 6W TDPIntel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), 2MB
L2Cache, 10W TDPIntel® Celeron® J3355, Dual Core @2.0GHz (Burst 2.5GHz), 2MB
L2Cache, 10W TDP

PCI-e
Audio
Serial Ports
Other
Interfaces
Power
SupplyOperating
System* Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.
** SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive.

60

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Please visit www.seco.com to find the latest version of these datasheets

Available in Industrial Temperature Range
CPU
N-series Intel® Pentium® and Celeron® SOCs

CPU
Intel® Atom® E3800 family of System-on-Chip

GRAPHICS
Integrated Graphics, three independent display support

GRAPHICS
Integrated Intel® HD Graphics controller

CONNECTIVITY
2x GbE; CIR sensor; 8x GPI/Os

CONNECTIVITY
2x GbE; Half miniPCI-e slot; 8x GPI/OsMEMORY
2 x DDR3L SO-DIMM Slots with Dual Channel Support, up to 8GB DDR3L-1600

MEMORYUp to 8GB DDR3L ECC SO-DIMM

SBC

SBC

SBC with NXP i.MX 6 Processor

Single Board Computer (SBC) based on NXP i.MX6ULL processor

Flexible, Open-source, Industrial SBC

Optimized SBC for small sized HMI solutions

SBC-MX6

SBC-NALLINO-MX6ULL

Available in Industrial Temperature Range

Available in Industrial Temperature Range

CPU
Single-, Dual- and Quad- Core (Arm® Cortex® A9 Cores)CPU
NXP i.MX 6ULL

GRAPHICS
2D/3D dedicated graphics processors

CONNECTIVITY
1x 100MbE, 2x USB, RS232, RS485, CAN

CONNECTIVITY
Wi-Fi add-on module; up 28 GPI/Os; CAN BusMEMORY
Soldered on Board DDR3L memory

MEMORYUp to 2GB DDR3L on-board

Please visit www.seco.com to find the latest version of these datasheets

www.seco.com

61

SBC

SBC

SBC

SBC

Modular Single Board Computer with i.MX 8M Mini/NanoSingle Board Computer (SBC) based on NXP i.MX8M Mini processor

Single Board Computer (SBC) based on NXP i.MX6 processor

Single Board Computer (SBC) based on NXP i.MX6 processor

Modularly expandable ready to use Single Board
Computer (SBC)High performance with low power consumption
for edge computing

Optimized SBC for small sized HMI solutions

Optimized SBC for medium sized HMI solutions

SBC-SBCSOM-MX8M-Mini-Nano

SBC-TANARO-MX8M-Mini

SBC-SANTINOLT-MX6

SBC-SANTINO-MX6

NXP i.MX 8M Mini Family based on Arm® Cortex®-A53 cores + general
purpose Cortex®-M4 400MHz processor:
i.MX 8M Mini Quad – Full featured, 4x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Dual – Full featured, 2x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Solo – Full featured, 1x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Quad Lite Full featured, 4x Cortex®-A53 cores up to
1.8GHzi.MX 8M Mini Dual Lite – Full featured, 2x Cortex®-A53 cores up to
1.8GHzi.MX 8M Mini Solo Lite – Full featured, 1x Cortex®-A53 cores up to
1.8GHz

Processor

Memoryup tp 8 GB 32 bit LPDDR4Processor

NXP i.MX 8M Mini Family based on Arm® Cortex®-A53 cores + general
purpose Cortex®-M4 400MHz processor:
i.MX 8M Mini Quad – Full featured, 4x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Dual – Full featured, 2x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Solo – Full featured, 1x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Quad Lite Full featured, 4x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Dual Lite – Full featured, 2x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Solo Lite – Full featured, 1x Cortex®-A53 cores up to 1.8GHz

Video
Interfaces

24-bit parallel RGB interface

VideoInterfaces

18-bit parallel RGB interface

eMMC: 4 GB MLC
SD slot: 4 bit MMC/SDIO/SD/SDHC

Video
Interfaces

LVDS Single/Dual Channel connector
MIPI-CSI Camera interface connector

Networking

1x 100MbEthernet

Networking

1x 100MbEthernet

Video
Resolution

Up to 1920x1080p60, 24bpp

USB

1x USB 2.0 OTG micro-AB
1x USB 2.0 Type-A

USB

1x USB 2.0 OTG micro-AB
1x USB 2.0 Type-A

Mass
StorageeMMC: 4 GB MLC
SD slot: 4 bit MMC/SDIO/SD/SDHC

Audio

1x speaker (connector), 1 W RMS (8Ω) parallel to internal speaker

Audio

1x speaker (connector), 1 W RMS (8Ω) parallel to internal speaker

RS-232, RS-485

Serial Ports

2x RS-232, RS-485

Networking

1x GbEthernet interfaces
1x 100MbEthernetshielded single band WiFi 802.11 b/g/n with BT 4.0
mPCIe (half size) socket for modems

Serial Ports
Power
Supply9 ÷ 32 VDC

PowerSupply9 ÷ 32 VDC

Operating
SystemYocto

Operating
SystemYocto

CAN BusUSB

1x USB 2.0 Type-C
1x USB 2.0 Type-A

1x USB 2.0 OTG micro-AB
up to 2x USB 2.0 Type-A

Audio

1x speaker (connector), 1 W RMS (8Ω) parallel to internal speaker
Digital Mic In connector (2x PDM inputs)

Serial Ports

2x RS-232, RS-485

Power
Supply9 ÷ 32 VDC

Operating
SystemYocto

CAN Bus

1x CAN (ISO/DIS 11898)

95.0 x 73.0 x 20.0 mm

2D graphics accelerator
OpenGL® ES 2.0 3D graphics accelerator with a shader

Up to 1024 x 600, 18bpp

USB

Dimensions

Graphics

Mass
Storage

Networking-40°C ÷ 85°C (Industrial), -25°C ÷ 85°C (Extended Consumer), 0 ÷
70°C (Consumer)

2D graphics accelerator
OpenGL® ES 2.0 3D graphics accelerator with a shader

eMMC: 4 GB MLC
micro SD slot: 4 bit MMC/SDIO/SD/SDHC

1x GbEthernet interfaces
WLAN 2.4GHz/5Ghz, 802.11 a/b/g/n/ac 2x2 MU-MIMO / BT 5.0
mPCIe socket for modems

OperatingTemperature*

Graphics

Mass
StorageOnboard 4 Bit wide μSD Card Socket or onboard 8 Bit wide eMMC,
eMMC

Operating
System

1 GB 32 bit LPDDR4

Video
Resolution

Mass
Storage

Windows 10 IoT
Linux DebianLinux Yocto
Android

MemoryUp to 1024 x 600, 24bpp

Up to 1920x1080p60, 24bpp

12 ÷ 24 VDC

1 GB 32 bit DDR3L

Video
Resolution

Video
Resolution

Power
SupplyMemoryGC320 2D accelerator + GCNanoUltra 3D accelerator Embedded VPU(not for Lite processors), able to offer:
VP9, HEVC/H.265, AVC/H.264, VP8 HW Decoding
AVC/H.264, VP8 HW encoding
OpenGL ES 2.0, OpenVG 1.1 support

LVDS Single/Dual Channel connector
HDMI®

Other
Interfaces

NXP i.MX 6 Family, based on Arm® CORTEX-A9 processors:
i.MX6S Solo - Single core up to 1 GHz
i.MX6DL Dual Lite - Dual core up to 1 GHz per core

Graphics

Video
Interfaces

System Connector 1: Power-Supply, 2x UART or SPI, I2C, USB, SDIO,MIPI-DSI (4ch), MIPI-CSI (4ch), PCie, GPIO (24)System Connector 2: Power-Supply, 2x UART, QSPI, I2C, USB,
Speaker, Headphone, Line-In, Microphone, SPDIF, 12S, SIOP (Ethernet,
fiber), GPIO (42)FFC Connectors: i-MOD UART (RS232/485), i-MOD USB/I2C, KUKModis (LVDS/MIPI), MIPI-CSI, Camera, Speaker

Processor

1 GB 32 bit LPDDR4Graphics

Audio Codec

NXP i.MX 6 Family, based on Arm® CORTEX-A9 processors:
i.MX6S Solo - Single core up to 1 GHz
i.MX6DL Dual Lite - Dual core up to 1 GHz per core

MemoryGC320 2D accelerator + GCNanoUltra 3D accelerator Embedded
VPU (not for Lite processors), able to offer:
VP9, HEVC/H.265, AVC/H.264, VP8 HW Decoding
AVC/H.264, VP8 HW encoding
OpenGL ES 2.0, OpenVG 1.1 support

Audio

Processor

1x CAN (ISO/DIS 11898)

CAN Bus

1x CAN (ISO/DIS 11898)

OperatingTemperature*

0°C ÷ +60°C

OperatingTemperature*

0°C ÷ +60°C

Dimensions

113.0 x 18.0 x 47.0 mm

Dimensions

138.0 x 18.0 x 80.0 mm*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

Operating
0°C ÷ +60°C
Temperature*
Dimensions

159.0 x 18.0 x 80.0 mm*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

62

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Please visit www.seco.com to find the latest version of these datasheets

Please visit www.seco.com to find the latest version of these datasheets

www.seco.com

63

SBC

SBC

SBC

SBC

Single Board Computer (SBC) based on NXP i.MX6 processor

Single Board Computer (SBC) based on NXP i.MX6 processor

Single Board Computer (SBC) based on NXP i.MX6 processor

IoT Sensor to Cloud with ESP32-D0WDQ6 Processor

Flexible, powerful all-rounder for any
demanding applications

Our IOT solution: PCIe interface for wirelessconnectivity and two Ethernet ports

Vending / IOT platform with 3G / 4G modem and
MDB interfaces

From sensors to Cloud in a single step

SBC-SANTARO-MX6

SBC-SANTOKA-MX6

SBC-SANTVEND-MX6

SENSE-ESP32

Available in Industrial Temperature Range

NXP i.MX 6 Family based on Arm® Cortex®-A9 cores :i.MX 6 Quad – Full featured, 4x Cortex®-A9 cores up to 1.0GHz
i.MX 6 Dual – Full featured, 4x Cortex®-A9 cores up to 1.0GHz
i.MX 6 Single – Full featured, 4x Cortex®-A9 cores up to 1.0GHz

Processor

Memory1 GB 64 bit DDR3L

Graphics

Integrated Graphics, with up to 3 separate HW accelerators for 2D,
OpenGL® ES2.0 3D OpenVG™ accelerator
HW encoding of MPEG-4, H.263 V2, H.264, MJPEG
HW decoding of MPEG-2, VC1, MPEG-4 / XviD, H.263, H.264, DivX

Video
Interfaces

LVDS Single/Dual Channel connector
HDMI® interface

Video
Resolution

Up to 1920x1080p60, 24bpp

Mass
StorageeMMC: 4 GB MLC
SD slot: 4 bit MMC/SDIO/SD/SDHC

Networking

1x 100MbEthernet

USB

1x USB 2.0 OTG micro-AB
1x USB 2.0 Type-A

Audio

1x speaker (connector), 1 W RMS (8Ω) parallel to internal speaker

Serial Ports

2x RS-232, RS-485

Other
Interfaces

2x Digital Input, 2x Digital Output

Power
Supply9 ÷ 32 VDC

Operating
SystemYocto

CAN Bus

1x CAN (ISO/DIS 11898)

OperatingTemperature*

0°C ÷ +60°C

Dimensions

159.0 x 18.0 x 80.0 mm*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

64

www.seco.com

NXP i.MX 6 Family based on Arm® Cortex®-A9 cores :i.MX 6 Quad Plus – Full featured, 4x Cortex®-A9 cores up to 1.0GHz
i.MX 6 Quad – Full featured, 4x Cortex®-A9 cores up to 1.0GHz
i.MX 6 Dual – Full featured, 4x Cortex®-A9 cores up to 1.0GHz
i.MX 6 Single – Full featured, 4x Cortex®-A9 cores up to 1.0GHz

Processor

NXP i.MX 6 Dual up to 1 GHz; based on Arm® Cortex®-A9 cores

Processor

ESP32-DOWDQ6 processor, Dual Core Xtensa® 32-bit LX6
Microprocessor

Memory2 GB 32 bit DDR3L

MemoryInternal 520KB SRAM + 16KB SRAM in RTC

Memory1 GB 64 bit DDR3L

Graphics

Graphics

N.A.

Graphics

Integrated Graphics, with up to 3 separate HW accelerators for 2D,
OpenGL® ES2.0 3D OpenVG™ accelerator
HW encoding of MPEG-4, H.263 V2, H.264, MJPEG
HW decoding of MPEG-2, VC1, MPEG-4 / XviD, H.263, H.264, DivX

Integrated Graphics, with up to 3 separate HW accelerators for 2D,
OpenGL® ES2.0 3D OpenVG™ accelerator
HW encoding of MPEG-4, H.263 V2, H.264, MJPEG
HW decoding of MPEG-2, VC1, MPEG-4 / XviD, H.263, H.264, DivX

Mass
Storage

4MB SPI Flash
8MB PSRAM
Optional microSD slot (alternative to Expansion PCB-terminal block
#2)

Video
Interfaces

LVDS Single/Dual Channel connector
HDMI® interface

Video
Resolution

Up to 1920x1080p60, 24bpp

Mass
Storage
Networking

Processor

Video
Interfaces

LVDS Single/Dual Channel connector
HDMI® interface

Video
Resolution

Up to 1920x1080p60, 24bpp

Networking

Embedded WiFi (802.11 b/g/n) + BT 4.2/BT LE module with PCBantenna

Mass
StorageeMMC: 4 GB MLC
micro SD slot: 4 bit MMC/SDIO/SD/SDHC

Serial Ports

Optional 4-wire TTL port on 5-pin dedicated PCB Terminal Block
Optional CAN Port on 3-pin dedicated PCB Terminal Block

Networking

1x 100MbEthernet
2G/3G/4G GPS Modem
BT BLECAN

eMMC: 4 GB MLC
SD slot: 4 bit MMC/SDIO/SD/SDHC
2x 100MbEthernet
mPCIe (half size) socket for modems or Wifi/BT

USB

1x USB 2.0 Type-A

USB

1x USB 2.0 OTG micro-AB
up to 2x USB 2.0 Type-A

Audio

1x speaker (connector), 1 W RMS (8Ω)

Audio

1x speaker (connector), 1 W RMS (8Ω) parallel to internal speaker

Serial Ports

1x RS-232

Serial Ports

2x RS-232, RS-485

Power
Supply10 ÷ 42 VDC

OtherInterfaces

Power
Supply9 ÷ 32 VDC

Operating
SystemYocto

Operating
SystemYocto

CAN Bus

1x CAN (ISO/DIS 11898)

CAN Bus

1x CAN (ISO/DIS 11898)

OperatingTemperature*

0°C ÷ +60°C

Expansion 10-/11-pin PCB terminal block #1, able to manage:
Up to 9 digital GPIOs (5 managed in UltraLow Power States too)
Up to 5x analog Inputs
Up to 2x DAC outputs
SPI interface
Expansion 8-pin PCB terminal block #2 (alternative to microSD Slot),
able to manage:
Up to 6x digital GPIOs, all managed in UltraLow Power States too
Up to 6x analog Inputs
Up to 6x Capacitive Sensing GPIOs
SPI
JTAG interface
SD Host interface
SD Slave interface
3x Pushbuttons
Green LED for Power On Signaling
Blue LED for Edgehog network connection signaling
Yellow LED for WiFi/BT activity or other signaling

OperatingTemperature*

0°C ÷ +60°C

Dimensions

160.0 x 18.0 x 95.0 mm

PowerSupplyPCB Terminal Block+9VDC .. +24VDC

Dimensions

159.0 x 18.0 x 80.0 mm

OperatingTemperature-40°÷+85°C (Industrial Temperature range)

Dimensions

4x8 cm*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range
indicated.

Please visit www.seco.com to find the latest version of these datasheets*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

Please visit www.seco.com to find the latest version of these datasheets

www.seco.com

65

UDOO
BOARDSUDOO BOLTThe Most Powerful Maker Board Ever

UDOO X86 II
UDOO X86 II

UDOO X86 II is the New PC: the most powerful x86 maker board ever and an
Arduino™ Leonardo-compatible platform, all embedded on the same board.
On UDOO X86 II you can run all the software available for the PC world, fromgamingtoProcessors
CPU Cores
MemoryMassstorage

A true mobile supercomputer with reality-bending
graphics and an ultrafast processor that gives you power

UDOO VISION

deep neural networks, play the latest AAA games, build
robots, explore lifelike VR and AR worlds

HIGHLIGHTS

editors

toprofessional

2.24 GHz
Intel ® Celeron®
N3160

2.56 GHz
Intel ® Pentium®
N3710

4
4 GB
DDR3L Dual Channel
1600 mHz

8 GB
DDR3L Dual Channel
1600 mHz

SATA 3 connector - M.2 Key B 2260 SATA 3 SSD Slot(also X2 PCIex modules) - Micro SD card slot
eMMC 32 GB

UDOO VISIONUDOO Vision is the Computer Vision and Artificial
Intelligence mini PC based on Intel® AtomTM X

C

AMD Ryzen™
Embedded V1202B

AMD Ryzen™
Embedded V1605B

CPU Cores

Dual Core/Quad Thread Quad Core/Eight Thread@ 2.3GHz (3.2GHZ Boost) @ 2.0GHz (3.6GHZ Boost)

Graphics

AMD Radeon™ Vega 3
Graphics (3 GPU CU)®

HIGHLIGHTSYCMAMD Radeon™ Vega 8
Graphics (8 GPU CU)®

Series and Arduino-Leonardo microcontroller.

M

MY

Processors

Intel ®Atom™ x5-E3940

Intel ®Atom™ x7-E3950

CPU Cores

Quad Core @1.6GHz,
2MB L2 Cache, 9,5W TDP

Quad Core @1.6GHz,
2MB L2 Cache, 12W TDP

Memory4GB - 32-bit
Quad-Channel, LPDDR4

8GB - 32-bit
Quad-Channel, LPDDR4

Mass
storage

M.2 Key B Slot for optional SSD, SATA Gen3, Micro SD card slot

CY

CMY

®

DirectX 12, OpenCL™, OpenGL, The Vulkan API
H.265 Decode & Encode (8-bit), VP9 Decode

K

Raising the Maker World to the Next Level

UDOO BOLT

The World's Most Flexible AI Platform

The UDOO BOLT is a quantum leap compared to current

UDOO KEY is a fully programmable board combining

UDOO KEY

UDOO KEY

maker boards: a portable, breakthrough supercomputer

Raspberry Pi RP2040 and ESP32 into a single powerfulthat goes up to 3.6 GHz thanks to the AMD Ryzen™

solution. It allows you to use either RP2040, ESP32 or

Embedded V1000 SoC, a top-notch, multicore CPU with aboth to build any AI projects on your terms.

mobile GPU on par with GTX 950M and an integrated

HIGHLIGHTS

Arduino™-compatible platform, all wrapped into one.

HIGHLIGHTS

www.seco.com

graphical

The Computer Vision and AI Mini PC

to watch 4K 60fps videos on multiple screens at once, run

66

from

HIGHLIGHTS

UDOO BOLT GEAR

Multimedia

streaming,

including all the sketches, libraries and the official Arduino™ Leonardo IDE

The Speed Force turned Mini PC

Processors

video

development platforms, plus all the software or the Arduino™ Leonardo world,

Processors

AMD Ryzen™
Embedded V1202B

AMD Ryzen™
Embedded V1605B

CPU Cores

Dual Core/Quad Thread@ 2.3GHz (3.2GHZ Boost)

Quad Core/Eight Thread@ 2.0GHz (3.6GHZ Boost)

Graphics

AMD Radeon™ Vega 3
Graphics (3 GPU CU)

AMD Radeon™ Vega 8
Graphics (8 GPU CU)

Multimedia®
DirectX®12, OpenCL™, OpenGL,The Vulkan® API
H.265 Decode & Encode (8-bit), VP9 Decode

Please visit www.seco.com to find the latest version of these datasheets

Microcontrollers

ESP32-WROVER-E

RP2040

Memory8 MB PSRAM

264 KB SRAM

Flash Storage

16 MB Internal flash, 64 M-bit External QSPI Flash

Connectivity

Wi-Fi/BT/BLE

UDOO BOARDS
Please visit www.seco.com to find the latest version of these datasheets

www.seco.com

67

Fanless Embedded Computers

SECO off-the-shelf solutions foreasier system integration

FANLESS EMBEDDED COMPUTERSFANLESS EMBEDDED COMPUTERS

Modular fanless embedded PC with 13th Gen Intel® Core™ processors

Modular fanless embedded PC with 13th Gen Intel® Core™ processors

Industrial PC with PCI express supporting GPUs
and AI accelerators for AI applications

Next-Gen industrial PC, enabling powerful AI
applications

Palladio 500 RPL

Palladio 400 RPL

Processor

13th Gen Intel® Core™ Processors (codename: Raptor Lake-P):•
Intel® Core™ i3-13100E, 3.3~4.4 GHz, 4 processor cores, 8 threads- 60 W TDP•Intel® Core™ i3-13100TE, 2.1~4.1 GHz, 4 processor cores, 8 Threads- 35 W TDP•Intel® Core™ i5-13500E, 2.4~4.6 GHz, 14 processor cores, 20
Threads - 65 W TDP•Intel® Core™ i5-13500TE, 1.3~4.5 GHz, 14 processor cores, 20
Threads - 35 W TDP•Intel® Core™ i7-13700E, 1.9~5.1 GHz, 16 processor cores, 24 Threads- 65 W TDP•Intel® Core™ i7-13700TE, 1.1~4.8 GHz, 16 processor cores, 24
Threads - 35 W TDP•Intel® Core™ i9-13900E, 1.8~5.2 GHz, 24 processor cores, 32
Threads - 65 W TDP•Intel® Core™ i9-13900TE, 1.0~5.0 GHz, 24 processor cores, 32
Threads - 35 W TDP

Processor

13th Gen Intel® Core™ Processors (codename: Raptor Lake-P):•
Intel® Core™ i3-13100E, 3.3~4.4 GHz, 4 processor cores, 8 threads- 60 W TDP•Intel® Core™ i3-13100TE, 2.1~4.1 GHz, 4 processor cores, 8 Threads- 35 W TDP•Intel® Core™ i5-13500E, 2.4~4.6 GHz, 14 processor cores, 20
Threads - 65 W TDP•Intel® Core™ i5-13500TE, 1.3~4.5 GHz, 14 processor cores, 20
Threads - 35 W TDP•Intel® Core™ i7-13700E, 1.9~5.1 GHz, 16 processor cores, 24 Threads- 65 W TDP•Intel® Core™ i7-13700TE, 1.1~4.8 GHz, 16 processor cores, 24
Threads - 35 W TDP•Intel® Core™ i9-13900E, 1.8~5.2 GHz, 24 processor cores, 32
Threads - 65 W TDP•Intel® Core™ i9-13900TE, 1.0~5.0 GHz, 24 processor cores, 32
Threads - 35 W TDP

MemoryUp to 32 GB SO-DIMM DDR4 2666​(optional)

MemoryUp to 32 GB SO-DIMM DDR4 2666​(Optional)

Graphics

Up to Intel® UHD graphics 770 (processor dependent)​

Graphics

Up to Intel® UHD graphics 770 (processor dependent)

VideoInterfaces

2x DisplayPort

Video
Resolution

Up to 4K @60 Hz

Mass
Storage

1x M.2 2280 (SATA)​
1x M.2 2280 (PCIe Gen 4 x4; SATA)​
2x SATA 2.5” drives (optional hot-swap)​
1x M.2 2280 (PCIe Gen 4 x4)

Networking

Intel® embedded M.2 2230 802.11ac Wi-Fi BT 5.1 card with cables​
Dual-band wireless 6.3” terminal PIFA antenna (optional)
2x 2.5 GbE LAN (2x PoE optional)USB

6x USB 3.2 Gen 2 ports

Audio

1x 3.5mm audio

Serial Ports

2x COM RS-232/422/485 ports

Other
Interfaces

5-Pin terminal block power input (12~48 VDC)​
2x ModBay expansion 7-9.5mm (optional)​
1x GPIO terminal block (DIO, CAN, Ext. Switch)​
2x 3FF Micro-SIM​
1x power button​
1x external fan connector​
2x 2.5” hot-swap drives (optional)

Optional
accessories

4x RJ45 GbE LAN add-on kit​
4x USB 3.0 add-on kit​
2x RS-232 COM add-on kit

PowerSupply12~48 VDC​
20~48 VDC (when configured with PCIe expansion 70W or above)

Operating
SystemCompatible with Linux, Windows

Security

PTT in BIOS​
TPM (optional)​
Watchdog timer

OperatingTemperature*-40 to 70°C (w/ 35W CPU)​-40 to 50°C (w/ 65W CPU)

Dimensions

240 x 82 x 267 mm

VideoInterfaces
Video
Resolution
Mass
Storage
Networking

Touch-display
solutions

Expertisein assembly
services

Mechanicaldesign2x DisplayPort
Up to 4K @60 Hz
1x M.2 2280 (SATA)​
1x M.2 2280 (PCIe Gen 4 x4; SATA)​
2x SATA 2.5” drives (optional hot-swap)​
1x M.2 2280 (PCIe Gen 4 x4)Intel® embedded M.2 2230 802.11ac Wi-Fi BT 5.1 card with cables​
Dual-band wireless 6.3” terminal PIFA antenna (optional)
2x 2.5 GbE LAN (2x PoE optional)USB

6x USB 3.2 Gen 2 ports

PCI-e

1x mPCIe (PCIe x1; USB 2.0)​
1x M.2 2230 E-key (PCIe x1; USB 2.0)​
1x M.2 2280 M-key (PCIe Gen 4 x4)​
1x M.2 2280 M-key (PCIe Gen 4 x4; SATA)​
1x M.2 3042/3052/2280 B-key (PCIe x2; USB 2.0; USB 3.0; SATA)​
1x PCIe Gen 4 x16 or 2x PCIe Gen 4 x8​(factory option)

Audio

1x 3.5mm audio

Serial Ports

2x COM RS-232/422/485 ports

Other
Interfaces

Optional
accessories
Power
SupplyOperating
SystemSecurity
OperatingTemperature*
Dimensions

5-Pin terminal block power Input (12~48 VDC)​
2x ModBay expansion 7-9.5mm (optional)​
1x GPIO terminal block (DIO, CAN, Ext. Switch)​
2x 3FF Micro-SIM​
1x power button​
1x external fan connector​
2x 2.5” hot-swap drives (optional)
4x RJ45 GbE LAN add-on kit​
4x USB 3.0 add-on kit​
2x RS-232 COM add-on kit
12~48 VDC​
20~48 VDC (when configured with PCIe expansion 70W or above)
Compatible with Linux, Windows
PTT in BIOS​
TPM (optional)​
Watchdog timer-40 to 70°C (w/ 35W CPU)​-40 to 50°C (w/ 65W CPU)
240 x 143 x 267 mm*Measured at any point of the heatspreader/heatsink during any and all times (including
start-up). Actual temperature will widely depend on application, enclosure and/or
environment. Upon customer to consider specific cooling solutions for the final system tokeep the heatspreader temperature in the range indicated.

68

www.seco.com

Please visit www.seco.com to find the latest version of these datasheets

Please visit www.seco.com to find the latest version of these datasheets*Measured at any point of the heatspreader/heatsink during any and all times (including
start-up). Actual temperature will widely depend on application, enclosure and/or
environment. Upon customer to consider specific cooling solutions for the final system tokeep the heatspreader temperature in the range indicated.

www.seco.com

69

FANLESS EMBEDDED COMPUTERSFANLESS EMBEDDED COMPUTERSFANLESS EMBEDDED COMPUTERSFANLESS EMBEDDED COMPUTERSDIN Mount Industrial Gateway with the NXP i.MX 93 SoC

Fanless embedded computer with the 11th Gen Intel® Core™ and Intel®
Celeron® SoCs (Codename: Tiger Lake UP3)

Fanless embedded computer with the 11th Gen Intel® Core™ and Intel®
Celeron® SoCs (Codename: Tiger Lake UP3)

Fanless embedded computer with the Intel® Atom® X6000E Series,Intel® Pentium® and Celeron® N and J Series (Codename: Elkhart Lake) SoCs

Fanless industrial PC with modular design andwireless connectivity for streamlined integration

Vision gateway with 11th Gen Intel® Core™
performance

Vision gateway with 11th Gen Intel® Core™
performance

Low power Atom®-based Box PC ready forindustrial automation and edge computing

Modular Link MX93

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3

Titan 290 EHL

Processor

NXP i.MX93•
2x Arm® Cortex®-A55 1.5GHz•
Arm® Cortex®-M33 @ 250Mhz•
Arm® Ethos™ U-65 microNPU

System Memory

Up to 2GB LPDDR4 3700MT/s

VideoInterfaces

Optional HDMI® interface on MiniHDMI® connector

Video
Resolution

Up to 1080p @60Hz

Mass
StorageUp to 32GB eMMC 5.1 drive soldered on-board
Up to 2x Gigabit Ethernet RJ45 connectors
Optional WiFi (802.11 ac / a / b / g / n) + BT5.0 module soldered on-board,
2x external antennas*
miniPCIe full-size card slot for optional LTE modem with nanoSIM slot, up
to 2x external antennas**

Networking*Certified**Certification upon request

USB

Dual USB 2.0 Type-A connector (one with OTG capability)

Serial Ports

1x RS-232/RS-422/RS-485 UART software configurable, on RJ12
connector
1x Debug UART on USB Type-C

Other
Interfaces

Optional terminal block connectors with the following I/O:•
2x digital outputs•
4x digital inputs
1x button software configurable
1x button hardware reset
3x LEDs: power presence, WWAN activity, 1x software configurable.
Other: TPM 2.0, RTC, watchdog
Expansion: custom connector for stacking Daughter systems exposing
I2C, SPI, GPIO, CAN, USB, UART interfaces and power

Mounting
Options••

DIN rail mount
Wall mountIntel® Core™ i7-1185G7E, Quad Core @ 2.8GHz (4.4GHz Turbo) withHT, 12MB cache, 28W TDP (12W cTDP)Intel® Core™ i5-1145G7E, Quad Core @ 2.6GHz (4.1GHz Turbo) withHT, 8MB cache, 28W TDP (12W cTDP)Intel® Core™ i3-1115G4E, Dual Core @ 3.0GHz (3.9GHz Turbo) with HT,
6MB cache, 28W TDP (12W cTDP)Intel® Celeron® 6305E, Dual Core @1.8GHz, 4MB cache, 15W TDPIntel® Core™ i7-1185GRE, Quad Core @ 2.8GHz (4.4GHz Turbo) withHT, 12MB cache, with IBECC, 28W TDP (12W cTDP) – Industrial
Intel® Core™ i5-1145GRE, Quad Core @ 2.6GHz (4.1GHz Turbo) withHT, 8MB cache, with IBECC, 28W TDP (12W cTDP) - Industrial
Intel® Core™ i3-1115GRE, Dual Core @ 3.0GHz (3.9GHz Turbo) with HT,
6MB cache, with IBECC, 28W TDP (12W cTDP) - Industrial

Processor

Memory2x DDR4-3200 SODIMM slots
Up to 64GB (IBECC supported only with Core™ industrial SoCs)

Memory2x DDR4-3200 SODIMM slots
Up to 64GB (IBECC supported only with Core™ industrial SoCs)

AI Chip

100+ TOPS inference power
Voyager SDK for effortless deployment of AI applications

Graphics

Up to two video decode boxes (VDBoxes) for enhanced video stream
capabilities
Support for up to four independent displays at up to 4K60 HDR
resolution or one display at 8K resolution

Graphics

Up to two video decode boxes (VDBoxes) for enhanced video stream
capabilities
Support for up to four independent displays at up to 4K60 HDR
resolution or one display at 8K resolution

Video
Interfaces

2x Multimode DisplayPort 1.4, on dual DP++ connector
2x Multimode Display Port 1.4 on USB Type-C connectors (alternate
mode)

Processor

Video
Resolution
Mass
Storage

Networking

DP:
HDMI® 1.4:

up to 5120x3200 @60Hz 24bpp / 7680x4320@60Hz
30bpp with DSC
up to 4Kx2K 24-30Hz 24bpp

2x 2.5 Gigabit Ethernet RJ45 connectors
Optional on-board M.2 Wi-Fi (802.11 ac / a / b / g / n) + BT 5.0 module,with dipole antennas included*
Optional on-board M.2 LTE modem with Mini-SIM slot, with dipole
antennas included*
2x Superspeed USB 10Gbps ports on Dual Type-A sockets
2x Superspeed USB 20Gbps on USB Type-C slots

Power
Supply+12÷36VDC

Serial Ports

2x RS-232/RS-422/RS-485 UARTS software configurable, on DB9
connector

Operating
SystemSECO Edgehog OS (Linux Yocto)

Audio

Lineout + MicIn combo TRRS Audio Jack

OperatingTemperature*-20°C ÷ +70°C

Dimensions

140 x 96 x 36 mm (5.5” x 3.8” x 1.4’’)

Other
Interfaces

Optional 2x 12 poles terminal block connectors with the following I/O:•
8x GPIOs•
1x I2C•
1x SPI•
1x 5V•
1x 3.3V•
1x 12V•
3x GNDPower ON Button
Optional TPM 1.2/2.0 module on-board*Measured at any point of the heatspreader/heatsink during any and all times (including
start-up). Actual temperature will widely depend on application, enclosure and/or
environment. Upon customer to consider specific cooling solutions for the final system tokeep the heatspreader temperature in the range indicated.

Power
Supply12VDC to 24VDC range, Mega-Fit 2p RA Connector
Coin cell battery for RTC On-Board

Operating
SystemMicrosoft® Windows 10 IoT Enterprise LTSC 2021
Linux (Kernel ≥ 5.4 version)OperatingTemperature

Commercial range:
0°C to +40°C, with 0.7m/s airflow**
Extended range:-30°C to +40°C, with 0.7m/s airflow****Up to 60°C with scaled down CPU TDP

Dimensions

Video
Resolution
Mass
Storage

On-Board NMVe Drive, up to 2 modules with global capacity up to 1TB*Certification upon request

USB

Video
Interfaces

Networking

Intel® Core™ i7-1185G7E, Quad Core @ 2.8GHz (4.4GHz Turbo) withHT, 12MB cache, 28W TDP (12W cTDP)Intel® Core™ i5-1145G7E, Quad Core @ 2.6GHz (4.1GHz Turbo) withHT, 8MB cache, 28W TDP (12W cTDP)Intel® Core™ i3-1115G4E, Dual Core @ 3.0GHz (3.9GHz Turbo) with HT,
6MB cache, 28W TDP (12W cTDP)Intel® Celeron® 6305E, Dual Core @1.8GHz, 4MB cache, 15W TDPIntel® Core™ i7-1185GRE, Quad Core @ 2.8GHz (4.4GHz Turbo) withHT, 12MB cache, with IBECC, 28W TDP (12W cTDP) – Industrial
Intel® Core™ i5-1145GRE, Quad Core @ 2.6GHz (4.1GHz Turbo) withHT, 8MB cache, with IBECC, 28W TDP (12W cTDP) - Industrial
Intel® Core™ i3-1115GRE, Dual Core @ 3.0GHz (3.9GHz Turbo) with HT,
6MB cache, with IBECC, 28W TDP (12W cTDP) - Industrial

2x Multimode DisplayPort 1.4, on dual DP++ connector
2x Multimode Display Port 1.4 on USB Type-C connectors (alternate
mode)
DP:
HDMI® 1.4:

up to 5120x3200 @60Hz 24bpp / 7680x4320@60Hz
30bpp with DSC
up to 4Kx2K 24-30Hz 24bpp

On-Board NMVe Drive, up to 2 modules with global capacity up to 1TB
2x 2.5 Gigabit Ethernet RJ45 connectors
Optional on-board M.2 Wi-Fi (802.11 ac / a / b / g / n) + BT 5.0 module,with dipole antennas included*
Optional on-board M.2 LTE modem with Mini-SIM slot, with dipole
antennas included*

Processor(*) HIS: Integrated Heatspreader; TCC: Time Coordinated Computing

MemorySoldered down LPDDR4-3200 memory, up to 16GB with IBECC
supported only with Atom® Industrial SoCs
Speed: 4267MT/s single rank (1GB / 2GB / 4GB / 8GB), 3733MT/s dual
rank (16GB)

Graphics

Integrated Intel® Gen11 UHD Graphics controller with up to 32 EU
4K HW decoding and encoding of HEVC (H.265), H.264, VP8, VP9,
WMV9/VC1 (decoding only)
DirectX 12.1, OpenGL ES 3.1, OpenGL 4.5, OpenCL™ 1.2, Vulkan 1.0

VideoInterfaces

2x Multimode DisplayPort 1.4, on Dual DP++ connector

Video
Resolution

Up to 4096x2160 @60Hz

Mass
Storage

Optional eMMC 5.1 drive soldered on-board
Optional on-board M.2 SATA SSD ***Certification upon requestUSB

2x Superspeed USB 10Gbps ports on Dual Type-A sockets
2x Superspeed USB 20Gbps on USB Type-C slots

Serial Ports

2x RS-232/RS-422/RS-485 UARTS software configurable, on DB9
connector

Audio

Lineout + MicIn combo TRRS Audio Jack

Other
Interfaces

Optional 2x 12 poles terminal block connectors with the following I/O:
8x GPIOs
1x I2C
1x SPI
1x 5V
1x 3.3V
1x 12V
3x GNDPower ON Button
Optional TPM 1.2/2.0 module on-board

Power
Supply12VDC to 24VDC range, Mega-Fit 2p RA Connector
Coin cell battery for RTC On-Board

Operating
SystemMicrosoft® Windows 10 IoT Enterprise LTSC 2021
Linux (Kernel ≥ 5.4 version)OperatingTemperature

Commercial range:
0°C to +40°C, with 0.7m/s airflow**
Extended range:-30°C to +40°C, with 0.7m/s airflow**

Networking

199 x 174 x 73 mm (7.83’’ x 6.85 “ x 2.87’’)
DIN-rail or Wall Mount brackets (Factory Alternatives)

199 x 174 x 73 mm (7.83’’ x 6.85 “ x 2.87’’)
DIN-rail or Wall Mount brackets (Factory Alternatives)

2x Gigabit Ethernet RJ45 connectors
Optional on-board M.2 Wi-Fi (802.11 ac / a / b / g / n) +BT 5.0 module,
external antennas*
Optional on-board M.2 LTE modem with nanoSIM slot, externalantennas* ***Certification upon request

USB

Dual USB 3.2 Gen1 Type-A connector

Serial Ports

2x RS-232/RS-422/RS-485 UARTS software configurable, on DB9
connector

Audio

Lineout + MicIn combo TRRS audio jack

Other
Interfaces

Optional 2x 12 poles terminal block connectors with the following I/O:•
2x CAN•
8x GPIOs / QEP / PWM / SPI•
2x I2C•
1x SPI•
1x 5V•
1x 3.3V•
1x 12V•
3x GNDPower ON button
nanoSIM slot soldered on-board for the modem
Optional TPM 1.2/2.0 module on-board
Optional 4x SMA connectors for external Wi-Fi / WWAN antennas

Power
Supply+12VDC
Cabled coin cell battery for RTC

Operating
SystemMicrosoft® Windows 10 Enterprise
Microsoft® Windows 10 IoT Core
Linux
Yocto

OperatingTemperature

0°C to +50°C

Dimensions

180 x 107 x 75 mm (7” x 4.2” x 3’’)**Up to 60°C with scaled down CPU TDP

Dimensions

Intel® Celeron® J6413 Quad Core @ 1.8GHz (3GHz Turbo) 10W TDPIntel® Celeron® N6211 Dual Core @1.2GHz (3GHz Turbo) 6.5W TDPIntel® Pentium® J6426 Quad Core @2.0GHz (3GHz Turbo) 10W TDPIntel® Pentium® N6415 Quad Core @1.2GHz (3GHz Turbo) 6.5W TDPIntel® Atom® x6211E Dual Core @1.3GHz (3GHz Turbo) 6W TDP w/
IBECC and HIS - Industrial
Intel® Atom® x6413E Quad Core @1.5GHz (3GHz Turbo) 9W TDP w/
IBECC and HIS - Industrial
Intel® Atom® x6425E Quad Core @2.0GHz (3GHz Turbo) 12W TDP w/
IBECC and IHS - Industrial
Intel® Atom® x6212RE Dual Core @1.2GHz (no Turbo) 6W TDP w/
IBECC, IHS and TCC – Industrial
Intel® Atom® x6414RE Quad Core @1.5GHz (no Turbo) 9W TDP w/
IBECC, IHS and TCC – Industrial
Intel® Atom® x6425RE Quad Core @1.9GHz (no Turbo) 12W TDP w/
IBECC, IHS and TCC – Industrial** SATA SSD and WWAN functionalities share the same slot and are therefore mutually
exclusive.

70

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Please visit www.seco.com to find the latest version of these datasheets

Please visit www.seco.com to find the latest version of these datasheets

www.seco.com

71

FANLESS EMBEDDED COMPUTERSFANLESS EMBEDDED COMPUTERSFANLESS EMBEDDED COMPUTERSFANLESS EMBEDDED COMPUTERS

Gateway for Medical applications with Intel® Atom® x5-E3930
Processors

Fanless embedded computer based on Intel® Atom® X Series, Intel®
Celeron® J / N Series and Intel® Pentium® N Series(Codename: Apollo Lake) Processors

Fanless embedded computer with Intel® Atom® X Series (Codename:
Apollo Lake) Processors

Fanless embedded computer with Intel® Celeron® J / N Series and Intel®
Pentium® N Series (Codename: Apollo Lake) Processors

IoT Gateway Solution certified for medical
environment

Fanless Industrial Edge Computing

Fanless, compact and versatile embedded box PC

Smart Edge Compute Unit, a multi-connectivity andmulti-protocol plug& play Industrial IoT gateway

Titan 220 APL Med

Titan 240 APL

Titan 235 APL

Titan 230 APL

Available in Industrial Temperature Range

Processor

Intel® Atom® x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2
Cache, 6.5W TDP

MemoryQuad Channel soldered down LPDDR4 memory, up to 8GB

Graphics

Integrated Intel® HD Graphics 500 series controller, with 12 Execution
Units
4K HW decoding and encoding of HEVC(H.265), H.264, VP8, SVC, MVC
Dual independent display

Video
Interfaces

Two multimode Display Port on miniDP++ connectors

Video
Resolution

Up to 4096 x 2160

Mass
StorageeMMC drive onboard, up to 64 GB
Optional SATA M.2 SSD module up to 512GB

Networking

2x Gigabit Ethernet ports
1x 4kV insulated Gigabit Ethernet port
M.2 Socket 2 Key B Slot for Modem modules (not provided by
SECO. To be used as alternative to M.2 SSD), connected to internal
microSIM Slot
M.2 Socket 1 Key E Slot for WiFi/BT modules

Processor

Intel® Atom® x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2
Cache, 6.5W TDPIntel® Atom® x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2
Cache, 9.5W TDPIntel® Atom® x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2
Cache, 12W TDPIntel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2
Cache, 6W TDPIntel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2
Cache, 6W TDP

System Memory

32-bit Single-/Dual-/Quad-Channel LPDDR4 soldered onboard, up to
2400 MT/s
Max memory size 8GB

Graphics

Integrated Intel® HD Graphics 500 series controller with up to 18
Execution Units
Two Independent displays supported
HW decoding of HEVC(H.265), H.264, MVC, VP8, VP9,MPEG2, VC-1, WMV9, JPEG/MJPEG formats
HW encoding of HEVC(H.265), H.264, MVC, VP8, VP9 and JPEG/MJPEG
formats

Video
Interfaces

Combo HDMI® + DP++ connector

Video
Resolution

Up to 4K

Mass
Storage

Optional eMMC 5.0 drive on-board, up to 64GB
Optional SATA SSD M.2 Socket 2 Key B, up to 512GB (excludes WWAN
module)microSD Card slot (combo with miniSIM slot)

Networking

2x Gigabit Ethernet RJ45 connectors with Gigabit Ethernet i210
controllers
M.2 Socket 1 Key E 2230 Slot for accessory WiFi + BTLE module
M.2 Socket 2 Key B Slot for accessory WWAN module (excludes SATA
SSD module)USB

2 x USB 3.0 Type-A sockets on Front Panel

Other
Interfaces

Power Button
Power On Status LED

Power
SupplyDC Power jack, with cable restraint,type DC-062-4-2.5-S214+18VDC ÷ +32 VDC recommended+15VDC ÷ +36 VDC absolute

Operating
SystemLinux
EDGEHOG (under development)

OperatingTemperature

0°C ÷ +40°C (in presence of air flow)

Optional
accessories

miniDP++ to HDMI® adapter
Customised bracket for VESA Panel mountUSB

USB 3.0 Dual Type-A connector

Dimensions

162.3 x 109.3 x 42.4 mm

Serial Ports

2 x RS-232/RS-422/RS-485 Serial ports on 2x DB9-M connectors

Compliancewith medical
standards

IEC 60601-1
IEC 60601-1-2
IEC 60601-1-6
IEC 62366

OtherInterfaces

Power ON Button with integrated LED
Optional TPM 2.0 on-board
miniSIM slot for M.2 modem (combo with microSD slot)
2x SMA connectors for external WiFi / WWAN antennas

Other

Optional VESA 100 bracket accessory

Power
Supply+12VDC, 5.7mm DC Power Jack connector
220mAh non-rechargeable Coin cell battery for RTC

Operating
SystemMicrosoft® Windows 10 IoT CoreLinux

OperatingTemperature*

0°C ÷ +50°C

Dimensions

181 x 109 x 79 mm

Processor

Intel® Atom® x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2
Cache, 12W TDPIntel® Atom® x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2
Cache, 9.5W TDPIntel® Atom® x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2
Cache, 6.5W TDP

MemoryQuad Channel soldered down LPDDR4 memory, up to 8GB

Graphics

Integrated Intel® HD Graphics 505 or 500 series controller, with up to
18 Execution Units
4K HW decoding and encoding of HEVC(H.265), H.264, VP8, SVC, MVC
Dual independent display

Video
Interfaces

Two multimode Display Port on miniDP++ connectors

Video
Resolution

Up to 4096 x 2160

Mass
Storage

Optional eMMC drive onboard
Optional SATA M.2 SSD module up to 512GB

Networking

2 x Gigabit Ethernet ports
M.2 Socket 2 Key B Slot for Modem modules (alternative to M.2 SSD),
connected to internal microSIM Slot
M.2 Socket 1 Key E Slot for WiFi/BT modules

Processor

Intel® Pentium® N4200 Quad Core @1.1GHz (burst 2.5GHz),
2MB L2 Cache, 6W TDPIntel® Celeron® N3350 Dual Core @1.1GHz (burst 2.4GHz),
2MB L2 Cache, 6W TDPIntel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz),
2MB L2Cache, 10W TDPIntel® Celeron® J3355, Dual Core @2.0GHz (Burst 2.5GHz),
2MB L2Cache, 10W TDP

MemoryQuad Channel soldered down LPDDR4 memory, up to 8GB

Graphics

Integrated Intel® HD Graphics 505 or 500 series controller, with up to
18 Execution Units
4K HW decoding and encoding of HEVC(H.265), H.264, VP8, SVC, MVC
Dual independent display

Video
Interfaces

Two multimode Display Port on miniDP++ connectors

Video
Resolution

Up to 4096 x 2160

Mass
Storage

Optional eMMC drive onboard
Optional SATA M.2 SSD module up to 512GB

Networking

2 x Gigabit Ethernet ports
M.2 Socket 2 Key B Slot for Modem modules (alternative to M.2 SSD),
connected to internal microSIM Slot
M.2 Socket 1 Key E Slot for WiFi/BT modules

USB

2 x USB 3.0 Type-A sockets on Front Panel
2 x USB 2.0 Type-A sockets on Rear Panel

Serial Ports

2x RS-232/RS-422/RS-485 ports, software configurable, DB9 maleconnectors

USB

2 x USB 3.0 Type-A sockets on Front Panel
2 x USB 2.0 Type-A sockets on Rear Panel

Audio

Internal HD Audio codec Cirrus Logic CS4207
Mic In and Line Out Audio jacks

AudioInternal HD Audio codec Cirrus Logic CS4207
Mic In and Line Out Audio jacks

Other
Interfaces

Power Button
Power On Status LED

OtherInterfaces

Power Button
Power On Status LED

Power
SupplyPCB terminal block, type Phoenix 1990973+18VDC ÷ +32 VDC recommended+15VDC ÷ +36 VDC absolute

Power
SupplyOperating
SystemPreinstalled OS (factory options):•
Microsoft Windows 10 IoT entry•
Linux 64-bit
Available on request:•
Wind River Linux (64-bit)•
Yocto (64-bit)•
Android (planning)

DC Power jack, with cable restraint,
type DC-062-4-2.5-S214+18VDC ÷ +32 VDC recommended+15VDC ÷ +36 VDC absolute
Min power required, 40W

Operating
SystemPreinstalled OS (factory options):•
Microsoft Windows 10 IoT Enterprise•Linux Ubuntu
Available on request:•
Yocto (64-bit)

OperatingTemperatureWith internal SSD,
0°C ÷ +60°C (in presence of air flow)*
Without internal SSD, -40°C ÷ +60°C (in presence of air flow)**

OperatingTemperature*

0°C ÷ +60°C (in presence of air flow)

Optional
accessories

miniDP++ to HDMI® adapter
Customised bracket for wall mount

Optional
accessories

miniDP++ to HDMI® adapter
Customised bracket for wall mount

Dimensions

162.3 x 109.3 x 52.4 mm

Dimensions

162.3 x 109.3 x 42.4 mm* Environment temperature measured near the heatsink ‘s fins. Upon costumer
to verify that the temperature remains within the admissible range.
** Temperature range below 0°C tested on the SBC only.

*Environment temperature measured near the heatsink ‘s fins. Upon costumer to verify
that the temperature remains within the ammissible range.

*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

72

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73

FANLESS EMBEDDED COMPUTERSFANLESS EMBEDDED COMPUTERSFANLESS EMBEDDED COMPUTERSFANLESS EMBEDDED COMPUTERS

Boxed IP65 solution based on Intel® Atom® x5 (Codename: Apollo Lake)
Applications Processor

Fanless embedded computer based on NXP i.MX 8
Applications Processors

Fanless embedded computer based on Rockchip RK3399
Applications Processor

IP20 boxed PC based on Rockchip RK3399 Applications Processor

High video quality in a boxed solution for
Industrial Automation and Edge IoT

NXP i.MX 8 processors in a boxed solution
for Edge Computing applications

The right match between performance andpower in a box PC

Enhanced graphics and computing performancefor high-end industrial applications

Titan 250 APL IP65

Titan 200 MX8

Titan 225 RK3399

Titan 220 RK3399

Available in Industrial Temperature Range

Processor

Intel® Atom® x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2
Cache, 6.5W TDP

Processor

i.MX 8 QuadMax: Dual A72-core, Quad A53-core, Dual M4F-corei.MX 8 QuadPlus: Single A72-core, Quad A53-core, Dual M4F-core

Processor

Rockchip RK3399 processor, 2x Cortex®-A72 MP cores + 4x
Cortex®-A53 MPCores, up to 1.8GHz, 64-bit architecture

Processor

Rockchip RK3399 processor, 2x Cortex®-A72 MP cores + 4x
Cortex®-A53 MP cores, up to 1.8GHz, 64-bit architecture

System Memory

Quad Channel soldered down LPDDR4 memory, 2GB

System Memory

64-bit soldered down LPDDR4-1600 memory, up to 8GB

System Memory

64-bit soldered down LPDDR4 memory, up to 4GB

System Memory

64-bit soldered down LPDDR4 memory, 2GB

Graphics

Integrated Intel® HD Graphics 500 series controller, 12 Execution Units
4K HW decoding and encoding of HEVC(H.265), H.264, VP8, SVC, MVC

VideoInterfaces

Graphics

1x multimode Display Port on miniDP++ connector

2x Graphics accelerators Vivante GC7000 / XVSX for QuadMax and
GC7000Lite / XVSX for QuadPlus
1x embedded VPU, supporting H.265 (4K30) and H.264 (1080p60)
decoding and H.264 (1080p30) encoding

Graphics

Video
Interfaces

Graphics

HDMI® output (Micro) (HDMI 2.0a Tx interface)Video
Resolution

4-Core Mali-T860MP4 GPU
OpenGL ES 1.1/2.0/3.0/3.1, OpenVG 1.1, OpenCL, DX11
support
Embedded VPU, able to offer:•
H.265 10-bit, H.264 10-bit, VP9 8-bit 4Kx2K@60fps HW Decoding•
MPEG-4/MPEG-2/VP8 1080p@60fps HW Decoding•
H.264, VP8 1080p@30fps HW encoding

Up to 4K

HDMI® connector (HDMI 1.4 / 2.0a)
DP interface on USB Type-C connector (Alternate mode)

Mass
Storage

Optional eMMC 5.1 drive on-board, up to 64GB
M.2 Key B slot for optional SSD drive, up to 512GB
microSD card slot (accessible from panel)

Video
Interfaces

4-Core Mali-T860MP4 GPU
OpenGL ES 1.1/2.0/3.0/3.1, OpenVG 1.1, OpenCL, DX11 support
Embedded VPU:•
H.265 10-bit, H.264 10-bit, VP9 8-bit 4Kx2K@60fps hardware
decoding•
MPEG-4/MPEG-2/VP8 1080p@60fps hardware decoding•
H.264, VP8 1080p@30fps hardware encoding•
Supports 2 independent video outputs

Video
Resolution

Up to 4K

Video
Interfaces

HDMI® connector (HDMI 1.4 / 2.0a)
DP interface on USB Type-C connector (Alternate mode)

Mass
Storage

Optional eMMC 5.1 drive on-board, up to 64GB

Video
Resolution

Up to 4K

Networking

2x Gigabit Ethernet RJ45 connectors
M.2 WLAN Connectivity Slot for optional accessory WiFi + BT external
module, external antennas
M.2 WWAN Connectivity Slot for optional accessory Modem modules(excludes SSD Drive), external antennas

Mass
StorageeMMC 5.1 drive on-board, 16GB

Networking

Networking

1x Gigabit Ethernet RJ45 connector
on-board WiFi (802.11 ac / a / b / g / n) + BT 5.0 module, externalantennas
on-board LTE Cat4 modem with microSIM slot, external antennas

USB

3x USB 2.0 Type-A connectors
1x USB 3.0 Type-A connector
1x USB 3.0 Type-C connector (alternate mode with DP)

Video
Resolution

Up to 4096 x 2160

Mass
StorageeMMC 5.0 drive on-board, 64GB
Optional SATA M.2 SSD module up to 512GB (alternative to M.2
Modem / optional 2x GbE)

Networking

2x Gigabit Ethernet RJ45 connectors
2x optional Gigabit Ethernet RJ45 connectors (alternative to M.2
Modem / SSD)
M.2 Socket 2 Key B Slot for cellular modem modules (alternative
to M.2 SSD / optional 2x GbE), M.2 Socket 1 Key E Slot for WiFi/BT
modules, external antennas

USB

2x USB 2.0 Type-A sockets

Serial Ports

2x RS-232/RS-485 ports, software configurable

USB

1 x USB 3.0 Host port on Type-A socket
1 x USB 2.0 Host port on Type-A socket
1 x USB 2.0 micro-AB connector (OTG)

OtherInterfaces

8x GPIOs
TPM 2.0 chip for encryption
MicroSIM slot soldered on-board for the cellular modem

Serial Ports

1 x RS-232 port on DB9-M connector
1 x multistandard RS-485 / RS-422 port on DB9-M connector

Audio

Line Out + Mic In combo TRRS audio jack

Other
Interfaces

Optional 2x 12 poles terminal block connectors with the following I/O:•
2x CAN•
4x GPIOs•
4x Analog Inputs•
1x SPI•
1x I2C•
1x 5V•
1x 3.3V•
1x 12V•
3x GNDPower ON Button with integrated LED
microSIM slot soldered on-board for the Modem
Coin cell battery holder for RTC
Optional 4x SMA connectors for external WiFi / WWAN antennas

Other

IP65 aluminium box enclosure
DIN standard mounting plate

Power
Supply+18VDC to +32 VDC recommended+15VDC to +36 VDC absolute

Operating
SystemPreinstalled OS (factory options):•
Microsoft Windows 10 IoT enterprise•Linux 64-bit

OperatingTemperatureWith internal SSD, 0°C to +60°C (in presence of air flow)*
Without internal SSD, -40°C to +60°C (in presence of air flow)**

Dimensions

218 x 218,5 x 115,6 mm* Environment temperature measured near the heatsink ‘s fins. Upon costumer to verify
that the temperature remains within the admissible range.
** Temperature range below 0°C tested on the internal single board computer only.
Other

Optional VESA 100 bracket accessory
Optional DIN standard mounting plate accessory

Power
Supply+12VDC, Mini-Fit Power connector

Operating
SystemLinux
Android (planned)

OperatingTemperature*
Dimensions

2x Gigabit Ethernet RJ45 connectors
Optional on-board WiFi (802.11 ac / a / b / g / n) +BT 5.0
module, external antennas*
Optional on-board LTE modem with miniSIM slot or eSIM,
external antennas**Certification upon requestUSB

2 x USB 2.0 on Dual Type-A socket
1 x USB 3.0 Type-C connector (alternate mode with DP)
1 x USB 3.0 Type-A connector

Serial Ports

2x RS-232 on DB9-M connectors

Serial Ports

2 x RS-232 or RS-485 ports (factory options) on DB9-M
connectors

Other
Interfaces

Secure Element
microSIM slot soldered on-board for the cellular modem

Audio

Lineout + MicIn combo TRRS Audio Jack

Other
Power
Supply12 VDC to 24 VDC, DC Power Jack

Operating
SystemLinux
Android

Other
Interfaces

Optional 2x 12 poles terminal block connectors with thefollowing I/O:•
2x CAN•
3x GPIOs•
1x Open Drain Output•
1x PWM•
1x I2C•
1x 5V•
1x 3.3V•
1x 12V•
3x GNDPower ON Button with integrated LED
miniSIM slot soldered on-board for the Modem
Optional 4x SMA connectors for external WiFi / WWAN antennas

IP20 steel box enclosure
Wall mounting brackets

OperatingTemperature*-20°C to +50°C

Dimensions

177 x 150 x 27 mm

Other

Optional VESA 100 bracket accessory
Optional DIN standard mounting plate accessory

0°C ÷ +50°C

PowerSupply+12VDC ÷ +24VDC, DC Power Jack

181 x 109 x 75 mm

Operating
SystemLinux
Yocto
Android (planned)

OperatingTemperature*

0°C ÷ +50°C

Dimensions

181 x 109 x 75 mm*Measured at any point of the heatspreader/heatsink during any and all times (including
start-up). Actual temperature will widely depend on application, enclosure and/or
environment. Upon customer to consider specific cooling solutions for the final system tokeep the heatspreader temperature in the range indicated.

* Measured at any point on the heatspreader/heatsink during any and all times(including start-up). Actual temperature will depend on the application, enclosure and/or
environment. The customer must consider specific cooling solutions for the final system tokeep the heatspreader temperature in the range indicated.

*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

74

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75

FANLESS EMBEDDED COMPUTERSFANLESS EMBEDDED COMPUTERS

Fanless embedded computer based on NXP i.MX 8M
Applications Processors

IoT Sensor to Cloud

Multicore processing and flexible connectivity for
multimedia and industrial IoT applications

From sensors to AI in a single step

Titan 210 MX8M

EASY EDGE

Processor

i.MX 8M Quad, Quad A53-core up to 1.5GHz, with GPU and VPUi.MX 8M QuadLite, Quad A53-core up to 1.5GHz, with GPU only
i.MX 8M Dual, Dual A53-core up to 1.5GHz, with GPU and VPU

System Memory

32-bit soldered down DDR3L memory, up to 2GB

Graphics

Vivante GC7000Lite GPU, supporting OpenGL ES 1.1 / 2.0 / 3.0 / 3.1,
Open CL 1.2 and Vulkan
Dedicated VPU (not for QuadLite), supporting 4Kp60 HEVC/H.265
main and main 10 decoder, 4Kp60 VP9 decoder, 4Kp30
AVC/H.264 decoder, 1080p60 MPEG-2, MPEG-4p2, VC-1, VP8,
RV9, AVS, MJPEG, H.263 decoder

Video
Interfaces

Optional HDMI® 1.4 / 2.0a interface

Video
Resolution

Up to 4K

Mass
Storage

Optional eMMC 5.0 drive on-board, up to 16GB

Processor

ESP32-D0WD-V3 Dual Core Xtensa® 32-bit LX6 Microprocessor

MemoryInternal 520KB SRAM + 16KB SRAM in RTC

Graphics

N.A.

16MB SPI Flash
Mass Storage 8MB PSRAM
microSD slot
Networking

Embedded WiFi (802.11 b/g/n) + BT 4.2/BT LE module
Optional Modem with GNSS functionality:•
Quad Band GSM/GPRS Modem, SIMCOM SIM868•
Global-Band LTE CAT-M/NB-IoT modem, SIMCOM SIM7080G

Serial Ports

RS-232 / TTL UART (jumper selectable) port on 6-pin dedicatedconnector

CAN

CAN Port on 3-pin dedicated connector

Other
Interfaces

Accelerometer
Optional Trusted Secure Element
Expansion 8-pin connector, able to manage:•
Up to 3x Digital GPIOS, 2 of them managed also in UltraLow
Power States too•
Up to 2x analog Inputs•
I2C interface (fixed interface)•
Additional 2-Wire UART•
Second I2C interface•
Up to 2x PWM
1x Pushbutton
White LED for Power On Signaling
Green LED for Modem Activity Signaling
Blue LED for Edgehog network connection signaling
Yellow LED for WiFi/BT activity or other signalingeSIM or microSIM slot (factory options)
SMA connectors for WiFi/BT, Modem and GNNS (antennas notprovided)

Power
Supply2-pin micro-Fit Connector+9VDC .. +24VDC
Optional 2000mAh rechargeable battery, LIR18650

OperatingTemperature*0°÷+45°C

Dimensions

110 x 91 x31 mm (LxWxD)

MechanicalWall mount and DIN rail mount

1x Gigabit Ethernet RJ45 connector
Optional on-board WiFi (802.11 ac / a / b / g / n) +BT 5.0 module,
external antennas*
M.2 Socket 2 Key B Slot for optional accessory M.2 Modem, externalantennas*

Networking*Certification upon requestUSB

2 x USB 2.0 on Dual Type-A socket
1 x USB 3.0 Type-A socket
1 x USB 2.0 micro-AB connector (interface shared with USB 3.0 port)

Serial Ports

1 x RS-232 Serial port on DB9-M connector

Audio

Line Out + Mic In combo TRRS audio jackOptional Speaker connector, 10W per channel amplified

Other
Interfaceså

Optional 2x 12 poles terminal block connectors with the following I/O:•
1x CAN•
8x GPIOs•
1x SPI•
1x I2C•
1x 5V•
1x 3.3V•
1x 12V•
3x GNDPower ON Button with integrated LED
microSIM slot soldered on-board for the Modem
Coin cell battery holder for RTC
Optional 4x SMA connectors for external WiFi / WWAN antennas

Other

Optional VESA 100 bracket accessory
Optional DIN standard mounting plate accessory

Power
Supply+12VDC, Mini-Fit Power connector

Operating
SystemLinux
Android (planned)

OperatingTemperature*

0°C ÷ +50°C

Dimensions

181 x 109 x 75 mm*Measured inside the case, during any and all times (including start-up). Actual
temperature will widely depend on application and/or environment.

*Measured at any point of the heatspreader/heatsink during any and all times (including
start-up). Actual temperature will widely depend on application, enclosure and/or
environment. Upon customer to consider specific cooling solutions for the final system tokeep the heatspreader temperature in the range indicated.

76

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77EMBEDDED COMPUTERS
Fanless embedded computer for Digital Signage applications with AMD
Ryzen™ Embedded R1000 / V1000 family of SoCs

Multi-Display Digital Signage Solution

Embedded Computers

Krater RV1000

Processor

SECO off-the-shelf solutions foreasier system integration

Touch-display
solutions78

www.seco.com

Expertisein assembly
services

AMD Ryzen™ Embedded V1000 family SoCs:
AMD Ryzen™ Embedded V1605B with GPU AMD Radeon™ Vega 8,
Quad Core Dual Thread @ 2.0GHz (3.6 Boost), TDP 12-25W
AMD Ryzen™ Embedded V1202B with GPU AMD Radeon™ Vega 3,
Dual Core Dual Thread @ 2.3GHz (3.2 Boost), TDP 12-25W
AMD Ryzen™ Embedded R1000 family SoCs:
AMD Ryzen™ Embedded R1606G with GPU AMD Radeon™ Vega 3,
Dual Core Dual Thread @ 2.6GHz (3.5 Boost), TDP 12-25W
AMD Ryzen™ Embedded R1505G with GPU AMD Radeon™ Vega 3,
Dual Core Dual Thread @ 3.25GHz (3.6 Boost), TDP 12-25W

System Memory

Up to 2x DDR4 SODIMMs
Available memory sizes:
4GB, 8GB, 16GB Single Channel
8GB, 16GB, 32GB Dual Channel

Graphics

GPU AMD Radeon™ VEGA with up to 11 Compute Units
DirectX® 12 supported
H.265 (10-bit) decode and 8-bit video encode
VP9 decode
4 independent displays supported (3 with R1000 SoCs)

Video
Interfaces

4x DP++ connectors (only 3 working with R1000 SoCs)

Video
Resolution

Up to 4096 x 2160

Mass
Storage

Optional M.2 NVMe module (available sizes: 250GB, 500GB, 1TB, 2TB)
Optional SATA SSD (available sizes: 250GB, 500GB, 1TB, 2TB)

Networking

2 x Gigabit Ethernet ports
Internal M.2 WWAN slot (Socket 2 Key B Type 2242/3042) for Modems
Internal M.2 Connectivity Slot (Socket 1 Key E Type 2230) for WiFi / BT
modulesUSB

2 x USB 3.0 Type-A sockets on Rear Panel

Serial Ports

2x RS-232/RS-422/RS-485 ports on DB-9 connectors

Other
Interfaces

Externally accessible miniSIM Slot for the optional M.2 Modem
Power Button with Power On Status LED on Front Panel
Optional TPM 1.2 or 2.0 on-board

Power
Supply2-poles Mega-Fit connector+12VDC ÷ +24 VDC

Operating
SystemOptional preinstalled OS:
Microsoft® Windows 10 IoT Enterprise (64bit)
Linux

OperatingTemperature

0°C ÷ +50°C

Dimensions

179,4 (W) x 109 (D) x 57,8 (H) mm

Optional
accessories

VESA standard 100x100 Wall mount plate,dimensions 151 (W) x 111 (D) x 5,08 (H) mm

MechanicaldesignPlease visit www.seco.com to find the latest version of these datasheets

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79

PAYMENT SYSTEMS
Contactless payment terminal

Contactless payment made simple with KarL4

Payment Systems

KarL4

Networking

4G ModemService InterTwo switches for settings; red/green LED for status; buzzer
face

Fast and intuitive payment
without pin with KarL4

One point ofcontact for all
queries

Get started
instantly thanks
to plug & play80

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CustomerInterface

NFC Antenna with 4 green LED's

MachineInterfaces

MDB/IPC Level 02/03 (optional USB)

Power
Supply8.0 ÷ 42.5 VDC (typ. 130mA @ 13.8V)

Norms &
Standards

EMVCo Level 1
EMVCo Level 2 (Master/Visa)
EMVCo Level 3 (Master/Visa)
Girocard
ISO 18092 (NFC)
PCI PTS

Accessories

Roof antenna for LTE/GSM; 1 dBi; 700-960 MHz/1575-2700 MHz;lenght 200 cm
Patch antenna for LTE/GSM; 3 dBi; 700-960 MHz/1700-2700 MHz;
length 200 cm

Operating-25°C ÷ +70°C; Humidity up to 100%
Temperature*
Dimensions

Controller: 85.0 x 90.0 x 18.0 mm
NFC Antenna: 98.0 x 98.0 x 13.0 mm*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

Fast and flexible
installation

Complete
integration into
the device

LTE onboard

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81Modular HMI

SECO off-the-shelf solutions foreasier system integration

Touch-display
solutions

Expertisein assembly
services

MechanicaldesignMODULAR HMI SOLUTIONSMODULAR HMI SOLUTIONS

Entry level seven inch HMI based on NXP i.MX93

High end 10.1 inch HMI based on NXP i.MX8M Plus

Flexibility and expandability in a uniquemodular HMI concept

Flexibility and expandability in a uniquemodular HMI concept

Modular Vision 7 MX93

Modular Vision 10.1 MX8M-Plus

Processor

NXP i.MX93 Applications Processor
1-2x Arm® Cortex®-A55 @ 1.7 GHz
Arm® Cortex-M33 @ 250Mhz
Arm® Ethos™ U-65 microNPU

MemorySoldered-down LPDDR4X/LPDDR4-3200 memory, up to 2GB total,
16-bit interface

Graphics

The i.MX 93 supports a high efficiency 2D graphics engine PXP for
simple composition and acceleration for use by operating systems,
such as LinuxVideo
Resolution

7.0” display, resolution 1024 x 600, LED lifetime 50K hours, 400cd/m²
brightness
P-Cap (Projected Capacitive touch screen), with 3.0mm chemicallystrengthened cover glass

Mass
StorageeMMC 5.1 Drive soldered on-board, up to 64GB (boot device)
SD 4-bit interface (boot device)

Networking

1x Gigabit Ethernet interfaces, opt. Wi-Fi + BT5.0

USB

1x USB C Dual Role
1x USB 2.0 Type A

Processor

NXP i.MX 8M Plus family SoCs: Dual or Quad Arm® Cortex®-A53 Cores+ general purpose Cortex® M7 800MHz processor•
NXP i.MX 8M Plus Quad, 4x Arm® Cortex®-A53 Cores up to
1.8GHz•NXP i.MX 8M Plus Dual, 2x Arm® Cortex®-A53 Cores up to 1.8GHz•
NXP i.MX 8M Plus Quad Lite, 4x Arm® Cortex®-A53 Cores up to
1.8GHz, no VPU / NPU
NPU: 2.3 TOPS Neural Network performance (not for Quad Lite)

MemorySoldered down LPDDR4-4000 memory, 32-bit interface, up to 6GB
Integrated Graphics Processing Unit GC7000UL, supports 3
independent displays.

Graphics

Embedded VPU, supports HW decoding of HEVC/H.265, AVC/H.264,
MPEG-4, MPEG-2, MVC, VC-1, RV, VP6, VP7, VP8, VP9, JPEG, HW
encoding of HEVC/H.265, AVC/H.264
Supports OpenVG 1.1, OpenGL ES 3.1, OpenCL 1.2 Full Profile and Vulkan

Video
Resolution

10.1” display, resolution 1280 x 800, LED lifetime 50K hours, 400cd/m²
brightness
P-Cap (Projected Capacitive touch screen), with 3.0mm chemicallystrengthened cover glass

Serial Ports

2x RS-232, 1x RS-485

Other
Interfaces

1x I²C, SPI, 2x Digital In, 2x Digital Out

Power
SupplyMass
Storage

Soldered onboard eMMC 5.1 Drive, up to 64GB
SD 4-bit interface

9 VDC % 32 VDC

Networking

1x Gigabit Ethernet interfaces, opt. Wi-Fi + BT5.0

Operating
SystemEdgehog OS (Yocto)

USB

1x USB C Dual Role
1x USB 2.0 Type A

CAN Bus

1x CAN-FD

Serial Ports

2x RS-232, 1x RS-485

OperatingTemperature*0 ÷ 60 °C

OtherInterfaces

1x I²C, SPI, 2x Digital In, 2x Digital Out

Dimensions

146 x 102 mm

PowerSupply9 VDC % 32 VDC

Operating
SystemEdgehog OS (Yocto)

CAN Bus

1x CAN-FD

OperatingTemperature*0 ÷ 60 °C

Dimensions

146 x 102 mm*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

82

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Please visit www.seco.com to find the latest version of these datasheets

www.seco.com

83MODULAR HMI SOLUTIONSHigh end 15.6 inch HMI based on Intel® Atom® (formely Elkhart Lake)

Panel PC with 7.0” LCD display based on the Intel® Atom® X Series andIntel® Celeron® J / N Series (formerly Apollo Lake) Processors

Panel PC with 10.1” LCD display based on the Intel® Atom® X Series andIntel® Celeron J / N Series (formerly Apollo Lake) Processors

Panel PC with 13.3” LCD display based on Rockchip RK3399 SoC

Flexibility and expandability in a uniquemodular HMI concept

Flexibility Meets Style For Endless Visual Display
Applications

Flexibility Meets Style For Endless Visual Display
Applications

Flexibility Meets Style For Endless Visual Display
Applications

Modular Vision 15.6 EHL

Flexy Vision 7 APL

Flexy Vision 10.1 APL

Flexy Vision 13.3 RK3399

Processor(*) IHS: Integrated Heatspreader; TCC: Time Coordinated Computing(**) FuSa Certified: Atom® SKUs compliant to IEC 61508 and ISO 13849
requirements for Functional Safety and Safety Integrity levels

32-bit LPDDR4x Soldered Down Memory
Up to 16GB Quad Channel with In-Band Error Correction Code (IBECC,
Safety Related feature) supported
1GB or 2GB Single Channel, 4GB Dual Channel, 8GB or 16GB Quad
Channel supported
Speed: 4267MT/s single rank (1GB / 2GB / 4GB / 8GB), 3733MT/s dual
rank (16GB)

MemoryGraphics

Integrated Gen11 UHD Graphics controller with up to 32 EU
4K HW decoding and encoding of HEVC (H.265), H.264, VP8/VP9,
WMV9/VC1 (decoding only)
DirectX 12.1, OpenGL ES 3.1, OpenGL 4.5, OpenCL™ 1.2, Vulkan 1.0

VideoResolution

15.6” display, resolution 1920 x 1080, LED lifetime 50K hours, 400cd/m²
brightness
P-Cap (Projected Capacitive touch screen), with 3.0mm chemicallystrengthened cover glass

Mass
Storage

SDIO interface
eMMC 5.1 drive soldered on-board (Safety Related)

Networking

1x Gigabit Ethernet interfaces, opt. Wi-Fi + BT5.0

USB

1x USB C Dual Role
1x USB 2.0 Type A

Serial Ports

2x RS-232, 1x RS-485

Other
Interfaces

1x I²C, SPI, 2x Digital In, 2x Digital Out

Power
Supply9 VDC % 32 VDC

Operating
SystemEdgehog OS (Yocto)

CAN Bus

1x CAN-FD

OperatingTemperature*0 ÷ 60 °C

Intel® Atom® x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2
Cache, 6.5W TDPIntel® Atom® x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2
Cache, 9.5W TDPIntel® Atom® x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2
Cache, 12W TDPIntel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2
Cache, 6W TDPIntel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2
Cache, 6W TDPIntel® Celeron® J3455 Quad Core @1.5GHz (Burst 2.3GHz), 2MB
L2Cache, 10W TDPIntel® Celeron® J3355 Dual Core @2.0GHz (Burst 2.5GHz), 2MB
L2Cache, 10W TD

Processor

MemorySoldered-down LPDDR4 memory Dual/Quad Channel, up to 8GB total,
32-bit interface

MemorySoldered-down LPDDR4 memory Dual/Quad Channel, up to 8GB total,
32-bit interface

Embedded
Graphics

Integrated Intel® HD Graphics 500 series controller with up to 18
Execution Units
Three Independent displays supported
HW decoding of HEVC(H.265), H.264, MVC, VP8, VP9, MPEG2, VC-1,
WMV9, JPEG/MJPEG formats
HW encoding of HEVC(H.265), H.264, MVC, VP8, VP9 and JPEG/MJPEG
formats

Embedded
Graphics

Integrated Intel® HD Graphics 500 series controller with up to 18
Execution Units
Three Independent displays supported
HW decoding of HEVC(H.265), H.264, MVC, VP8, VP9, MPEG2, VC-1,
WMV9, JPEG/MJPEG formats
HW encoding of HEVC(H.265), H.264, MVC, VP8, VP9 and JPEG/MJPEG
formats

7.0” LVDS display, resolution 800x480, LED lifetime 50K hours life min,690cd/m2 min. brightness
P-Cap (Projected Capacitive touch screen), with 3.0mm glass cover
Glass Hardness IK07, Surface Hardness 7H

Video
Section

Video
Interfaces

HDMI® Connector
DP++ Connector

VideoInterfaces

HDMI® Connector
DP++ Connector

Mass
StorageeMMC 5.0 drive soldered on-board, up to 64GB
M.2 Key B slot for optional SSD drive, up to 512GB

Mass
StorageeMMC 5.0 drive soldered on-board, up to 64GB
M.2 Key B slot for optional SSD drive, up to 512GB

Networking

2x Gigabit Ethernet port
M.2 WWAN Connectivity Slot for accessory 4G modules (excludes SSD
Drive)
M.2 WLAN Connectivity Slot for accessory WiFi/BT module

Networking

2x Gigabit Ethernet port
M.2 WWAN Connectivity Slot for accessory 4G modules (excludes SSD
Drive)
M.2 WLAN Connectivity Slot for accessory WiFi/BT moduleUSB

2x USB 3.0 Host ports on Type-A sockets
2 x USB 2.0 Host ports on Dual Type-A socket

USB

2x USB 3.0 Host ports on Type-A sockets
2 x USB 2.0 Host ports on Dual Type-A socket

Serial Ports

2x multistandard RS-232 /RS-422/RS-485 ports on DB-9 connectors

Serial Ports

2x multistandard RS-232 /RS-422/RS-485 ports on DB-9 connectors

Other
Interfaces

Power ON Button with integrated LED
Optional TPM 2.0 onboard

Other
Interfaces

Power ON Button with integrated LED
Optional TPM 2.0 onboard

Power
SupplyMain Power: 12VDC
Power In connectors: DC Power Jack.

Power
SupplyMain Power: 12VDC
Power In connectors: DC Power Jack

Operating
SystemWindows 10 IOT
LinuxOperating
SystemWindows 10 IOT
LinuxOperatingTemperature*

0°C ÷ 50°C

OperatingTemperature*

0°C ÷ 50°C

Dimensions

202,1 x 133,9 x 58mm

Dimensions

269,5 x 188,1 x 58mm

Processor

Video
Section*Measured at any point of the heatspreader/heatsink during any and all times (including
start-up). Actual temperature will widely depend on application, enclosure and/or
environment. Upon customer to consider specific cooling solutions for the final system tokeep the heatspreader temperature in the range indicated.

Intel® Atom® x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2
Cache, 6.5W TDPIntel® Atom® x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2
Cache, 9.5W TDPIntel® Atom® x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2
Cache, 12W TDPIntel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2
Cache, 6W TDPIntel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2
Cache, 6W TDPIntel® Celeron® J3455 Quad Core @1.5GHz (Burst 2.3GHz), 2MB
L2Cache, 10W TDPIntel® Celeron® J3355 Dual Core @2.0GHz (Burst 2.5GHz), 2MB
L2Cache, 10W TD

10.1” LVDS display, resolution 1280x800, LED lifetime 50K hours life min,340cd/m2 min. brightness
P-Cap (Projected Capacitive touch screen), with 3.0mm glass cover
Glass Hardness IK07, Surface Hardness 7H

VESA Bracket
Mount Version

VESA Bracket
Mount Version

VESA Bracket
Mount Version

Intel® Atom® x6000E, Pentium® and Celeron® N and J Series “Elkhart
Lake” CPUs:•
Celeron® J6413 Quad Core @ 1.8GHz (3.0GHZ Turbo) 10W TDP Comm. Temp. Range•
Celeron® N6211 Dual Core @1.2GHz (3.0GHZ Turbo) 6.5W TDP Comm. Temp. Range•
Pentium® J6426 Quad Core @2GHz (3.0GHZ Turbo) 10W TDP Comm. Temp. Range•
Pentium® N6415 Quad Core @1.2GHz (3.0GHZ Turbo) 6.5W TDP Comm. Temp. Range•
Atom® x6211E Dual Core @1.3GHz (3.0GHZ Turbo) 6W TDP w/
IBECC and IHS - Ind. Temp. Range•
Atom® x6413E Quad Core @1.5GHz (3.0GHZ Turbo) 9W TDP w/
IBECC and IHS - Ind. Temp. Range•
Atom® x6425E Quad Core @2GHz (3.0GHZ Turbo) 12W TDP w/
IBECC and IHS - Ind. Temp. Range•
Atom® x6212RE Dual Core @1.2GHz (no Turbo) 6W TDP w/
IBECC, IHS and TCC - Ind. Temp. Range•
Atom® x6414RE Quad Core @1.5GHz (no Turbo) 9W TDP w/
IBECC, IHS and TCC - Ind. Temp. Range•
Atom® x6425RE Quad Core @1.9GHz (no Turbo) 12W TDP w/
IBECC, IHS and TCC - Ind. Temp. Range•
Atom® x6427FE Quad Core @1.9GHz (no Turbo) 12W TDP w/
IBECC, IHS and TCC, FuSa Certified - Ind. Temp. Range•
Atom® x6200FE Dual Core @1.0GHz (no Turbo) 4.5W TDP no
Graphics w/ IBECC, IHS and TCC, FuSa Certified - Ind. Temp.
Range

Panel Mount Version

MODULAR HMI SOLUTIONS

Panel Mount Version

MODULAR HMI SOLUTIONS

Panel Mount Version

MODULAR HMI SOLUTIONSCPU

Rockchip RK3399 processor, 2x Cortex®-A72 MP cores + 4x
Cortex®-A53 MPCores, up to 1.8GHz, 64-bit architecture

MemorySoldered-down LPDDR4 memory, up to 4GB total, 64-bit interface

Embedded
Graphics

4-Core Mali-T860MP4 GPU, supporting OpenGL ES 1.1/2.0/3.0/3.1,
OpenVG 1.1, OpenCL
Embedded VPU, able to offer:•
H.265 10-bit, H.264 10-bit, VP9 8-bit 4Kx2K@60fps HW Decoding•
MPEG-4/MPEG-2/VP8 1080p@60fps HW Decoding•
H.264, VP8 1080p@30fps HW encoding
Dual Display support

Video
Section13.3” LVDS display, resolution 1920x1080, LED lifetime 50K hours life min,260cd/m2 min. brightness
P-Cap (Projected Capacitive touch screen), with 3.0mm glass cover
Glass Hardness IK07, Surface Hardness 7H

Video
Interfaces

HDMI® 4K interface
DP 1.2 interface on USB Type-C connector (alternate mode)

Mass
StorageeMMC drive soldered on-board, up to 64GB
Optional SPI Flash

Networking

2x Gigabit Ethernet port
Soldered on-board M.2 1216 WLAN 802.11 a/b/g/n/ac + BT 5.0 module*
On-board LTE Modem**Certification upon request

USB

1x USB 3.0 Type-C port (Alternate mode with DP)
1x USB 3.0 Host port on Type-A socket
2 x USB 2.0 Host ports on Dual Type-A socket

Audio

TRRS Audio Jack (Combo MicIn + Lineout)

Serial Ports

2x RS-232 or RS-485 (factory option) on DB-9 connectors

Other
Interfaces

Power ON Button with integrated LED
Optional Ultra Low Power SPI RTC
Optional CAN ports (up to 2x)
Optional, 4x GPIOs

Power
SupplyMain Power: 12VDC .. 24VDC
Power In connectors: DC Power Jack.

Operating
SystemLinux

OperatingTemperature*

0°C ÷ 50°C

Dimensions

349,2 x 220,8 x 58 mm*Measured at any point of the heatspreader/heatsink during any and all times (including
start-up). Actual temperature will widely depend on application, enclosure and/or
environment. Upon customer to consider specific cooling solutions for the final system tokeep the heatspreader temperature in the range indicated.

*Measured at any point of the heatspreader/heatsink during any and all times (including
start-up). Actual temperature will widely depend on application, enclosure and/or
environment. Upon customer to consider specific cooling solutions for the final system tokeep the heatspreader temperature in the range indicated.

*Measured at any point of SECO standard heatspreader for this product, during any
and all times (including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider application-specific coolingsolutions for the final system to keep the heatspreader temperature in the range indicated.

84

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Please visit www.seco.com to find the latest version of these datasheets

Please visit www.seco.com to find the latest version of these datasheets

www.seco.com

85Panel PC with 13.3” LCD display based on the Intel® Atom® X Series andIntel® Celeron® J / N Series (Codename: Apollo Lake) Processors

Panel PC with 15.6” LCD display based on Rockchip RK3399 SoC

Panel PC with 15.6” LCD display based on the Intel® Atom® X Series andIntel® Celeron® J / N Series (formerly Apollo Lake) Processors

Panel PC with 21.5” LCD display based on Intel® Atom® X Series andIntel® Celeron® J / N Series (formerly Apollo Lake) Processors

Flexibility Meets Style For Endless Visual Display
Applications

Flexibility Meets Style For Endless Visual Display
Applications

Flexibility Meets Style For Endless Visual Display
Applications

Flexibility Meets Style For Endless Visual Display
Applications

Flexy Vision 13.3 APL

Flexy Vision 15.6 RK3399

Flexy Vision 15.6 APL

Flexy Vision 21.5 APL

Processor

MemorySoldered-down LPDDR4 memory Dual/Quad Channel, up to 8GB total,
32-bit interface

Embedded
Graphics

Integrated Intel® HD Graphics 500 series controller with up to 18
Execution Units
Three Independent displays supported
HW decoding of HEVC(H.265), H.264, MVC, VP8, VP9, MPEG2, VC-1,
WMV9, JPEG/MJPEG formats
HW encoding of HEVC(H.265), H.264, MVC, VP8, VP9 and JPEG/MJPEG
formats

Video
Section13.3” LVDS display, resolution 1920x1080, LED lifetime 50K hours life typ, 260cd/m2 min. brightness
P-Cap (Projected Capacitive touch screen), with 3.0mm glass cover
Glass Hardness IK07, Surface Hardness 7H

Video
Interfaces

HDMI® Connector
DP++ Connector

Mass
StorageeMMC 5.0 drive soldered on-board, up to 64GB
M.2 Key B slot for optional SSD drive, up to 512GB

Networking

2x Gigabit Ethernet port
M.2 WWAN Connectivity Slot for accessory 4G modules (excludes SSD
Drive)
M.2 WLAN Connectivity Slot for accessory WiFi/BT moduleUSB

2x USB 3.0 Host ports on Type-A sockets
2 x USB 2.0 Host ports on Dual Type-A socket

Serial Ports

2x multistandard RS-232 /RS-422/RS-485 ports on DB-9 connectors

Other
Interfaces

Power ON Button with integrated LED
Optional TPM 2.0 onboard

Power
SupplyMain Power: 12VDC
Power In connectors: DC Power Jack

Operating
SystemWindows 10 IOT
LinuxOperatingTemperature*

0°C ÷ 50°C

Dimensions

349,2 x 220,8 x 58mm

CPU

Rockchip RK3399 processor, 2x Cortex®-A72 MP cores + 4x
Cortex®-A53 MPCores, up to 1.8GHz, 64-bit architecture

MemorySoldered-down LPDDR4 memory, up to 4GB total, 64-bit interface

Embedded
Graphics

4-Core Mali-T860MP4 GPU, supporting OpenGL ES 1.1/2.0/3.0/3.1,
OpenVG 1.1, OpenCL
Embedded VPU, able to offer:•
H.265 10-bit, H.264 10-bit, VP9 8-bit 4Kx2K@60fps HW Decoding•
MPEG-4/MPEG-2/VP8 1080p@60fps HW Decoding•
H.264, VP8 1080p@30fps HW encoding
Dual Display support

Video
Section15.6” LVDS display, resolution 1920x1080, LED lifetime 50K hours min.,300cd/m2 min. brightness
P-Cap (Projected Capacitive touch screen), with 3.0mm glass cover
Glass Hardness IK07, Surface Hardness 7H

Video
Interfaces

HDMI® 4K interface
DP 1.2 interface on USB Type-C connector (alternate mode)

Mass
StorageeMMC drive soldered on-board, up to 64GB
Optional SPI Flash

Networking

2x Gigabit Ethernet port
Soldered on-board M.2 1216 WLAN 802.11 a/b/g/n/ac + BT 5.0 module*
On-board LTE Modem**Certification upon request

USB

1x USB 3.0 Type-C port (Alternate mode with DP)
1x USB 3.0 Host port on Type-A socket
2 x USB 2.0 Host ports on Dual Type-A socket

Audio

TRRS Audio Jack (Combo MicIn + Lineout)

Serial Ports

2x RS-232 or RS-485 (factory option) on DB-9 connectors

Other
Interfaces

Power ON Button with integrated LED
Optional Ultra Low Power SPI RTC
Optional CAN ports (up to 2x)
Optional, 4x GPIOs

Power
SupplyMain Power: 12VDC .. 24VDC
Power In connectors: DC Power Jack.

Operating
SystemLinux

OperatingTemperature*

0°C ÷ 50°C

Dimensions

403,6 x 253 x 58 mm*Measured at any point of the heatspreader/heatsink during any and all times (including
start-up). Actual temperature will widely depend on application, enclosure and/or
environment. Upon customer to consider specific cooling solutions for the final system tokeep the heatspreader temperature in the range indicated.

*Measured at any point of the heatspreader/heatsink during any and all times (including
start-up). Actual temperature will widely depend on application, enclosure and/or
environment. Upon customer to consider specific cooling solutions for the final system tokeep the heatspreader temperature in the range indicated.

86

www.seco.com

Processor

Intel® Atom® x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2
Cache, 6.5W TDPIntel® Atom® x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2
Cache, 9.5W TDPIntel® Atom® x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2
Cache, 12W TDPIntel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2
Cache, 6W TDPIntel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2
Cache, 6W TDPIntel® Celeron® J3455 Quad Core @1.5GHz (Burst 2.3GHz), 2MB
L2Cache, 10W TDPIntel® Celeron® J3355 Dual Core @2.0GHz (Burst 2.5GHz), 2MB
L2Cache, 10W TD

MemorySoldered-down LPDDR4 memory Dual/Quad Channel, up to 8GB total,
32-bit interface

Embedded
Graphics

Integrated Intel® HD Graphics 500 series controller with up to 18
Execution Units
Three Independent displays supported
HW decoding of HEVC(H.265), H.264, MVC, VP8, VP9, MPEG2, VC-1,
WMV9, JPEG/MJPEG formats
HW encoding of HEVC(H.265), H.264, MVC, VP8, VP9 and JPEG/MJPEG
formats

Video
Section15.6” LVDS display, resolution 1920x1080, LED lifetime 50K hours min.,300cd/m2 min. brightness
P-Cap (Projected Capacitive touch screen), with 3.0mm glass cover
Glass Hardness IK07, Surface Hardness 7H

Video
Interfaces

HDMI® Connector
DP++ Connector

Mass
StorageeMMC 5.0 drive soldered on-board, up to 64GB
M.2 Key B slot for optional SSD drive, up to 512GB

Networking

2x Gigabit Ethernet port
M.2 WWAN Connectivity Slot for accessory 4G modules (excludes SSD
Drive)
M.2 WLAN Connectivity Slot for accessory WiFi/BT moduleUSB

2x USB 3.0 Host ports on Type-A sockets
2 x USB 2.0 Host ports on Dual Type-A socket

Serial Ports

2x multistandard RS-232 /RS-422/RS-485 ports on DB-9 connectors

Other
Interfaces

Power ON Button with integrated LED
Optional TPM 2.0 onboard

Power
SupplyMain Power: 12VDC
Power In connectors: DC Power Jack

Operating
SystemWindows 10 IOT
UbuntuLinux

OperatingTemperature*

0°C ÷ 50°C

Dimensions

403,6 x 253 x 58mm

VESA Bracket
Mount Version

VESA Bracket
Mount Version

VESA Bracket
Mount Version

VESA Bracket
Mount Version

Intel® Atom® x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2
Cache, 6.5W TDPIntel® Atom® x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2
Cache, 9.5W TDPIntel® Atom® x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2
Cache, 12W TDPIntel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2
Cache, 6W TDPIntel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2
Cache, 6W TDPIntel® Celeron® J3455 Quad Core @1.5GHz (Burst 2.3GHz), 2MB
L2Cache, 10W TDPIntel® Celeron® J3355 Dual Core @2.0GHz (Burst 2.5GHz), 2MB
L2Cache, 10W TD

Panel Mount Version

MODULAR HMI SOLUTIONS

Panel Mount Version

MODULAR HMI SOLUTIONS

Panel Mount Version

MODULAR HMI SOLUTIONS

Panel Mount Version

MODULAR HMI SOLUTIONS

Processor

Intel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), 2MB
L2Cache, 10W TDPIntel® Atom® x5-E3940, Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2
Cache, 9.5W TDPIntel® Celeron® N3350, Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2
Cache, 6W TDP

MemoryDual/ Quad Channel soldered down LPDDR4 memory, up to 8GB

Embedded
Graphics

Integrated Intel® HD Graphics 500 series controller, with up to 18
Execution Units
4K HW decoding and encoding of HEVC(H.265), H.264, VP8, VP9, MVC

Video
Section21.5” LVDS display, resolution 1920x1080, 30K hours life
P-Cap (Projected Capacitive touch screen), with 1.8mm glass cover
Glass Hardness IK07, Surface Hardness 7H

Video
Interfaces

Two DP++ 1.2 interfaces on miniDP connectors

Mass
Storage

M.2 2260 SATA SSD Module, up to 512GB

Networking

Dual Gigabit Ethernet RJ45 connector with Gigabit Ethernet i210
controllers
M.2 WLAN Connectivity Slot for accessory WiFi/BT moduleUSB

2 x USB 3.0 Host ports on USB 3.0 Type-A sockets

Other
Interfaces

Power ON Button with integrated LED
TPM 2.0 on-board
2x SMA connectors for external WiFi antennas

Power
Supply+18VDC ÷ +32 VDC recommended+15VDC ÷ +36 VDC absolute
RTC battery

Operating
SystemMicrosoft® Windows 10 Enterprise (64 bit)
Microsoft® Windows 10 IoT Core
Yocto (64 bit)
Linux

OperatingTemperature*

0°C ÷ 50°C

Dimensions

537 x 328,5 x 53,5 mm*Measured at any point of the heatspreader/heatsink during any and all times (including
start-up). Actual temperature will widely depend on application, enclosure and/or
environment. Upon customer to consider specific cooling solutions for the final system tokeep the heatspreader temperature in the range indicated.

*Measured at any point of the heatspreader/heatsink during any and all times (including
start-up). Actual temperature will widely depend on application, enclosure and/or
environment. Upon customer to consider specific cooling solutions for the final system tokeep the heatspreader temperature in the range indicated.

Please visit www.seco.com to find the latest version of these datasheets

Please visit www.seco.com to find the latest version of these datasheets

www.seco.com

87MODULAR HMI SOLUTIONSMODULAR HMI SOLUTIONS

Embedded Panel with 10.1” LCD display based on the Multicore
NXP i.MX 6 SoC family

5.0 inch Flush Mount HMI based on NXP i.MX6 processor

7.0 inch Rear Mount HMI based on NXP i.MX6 processor

7.0 inch Outdoor Rear Mount HMI based on NXP i.MX6 processor

Flexible, Open-source, Industrial system

Maximum design flexibility with the usual quality

Optimal price-performance ratio combined withsophisticated design & easy installation

Ideal HMI solution for outdoor situations with highbrightness & particularly robust design

Simple Vision 10 MX6

Santino Vision 5 FM MX6

Santino Vision 7 RM MX6

Santaro Vision 10.1 FM MX6

Rear Mount

Flush Mount

CPU
Solo, Dual Lite and Quad- Core (Arm® Cortex® A9 Cores)CPU
NXP i.MX 6 FamilyCPU
NXP i.MX 6 FamilyCPU
NXP i.MX 6 Family

GRAPHICS
30K hours 10.1” LVDS display with projected capacitive touchscreen integrated

GRAPHICS
GC320 2D accelerator + GC880 3D accelerator

GRAPHICS
GC320 2D accelerator + GC880 3D accelerator

GRAPHICS
GC320 & GC355 2D accelerator + GC2000 3D accelerator

CONNECTIVITY
Wi-Fi add-on module; up 22 GPI/Os; CAN Bus

CONNECTIVITY
1x 100MbE, up to 2x USB, 2x RS232, RS485, CAN

CONNECTIVITY
1x 100MbE, up to 2x USB, 2x RS232, RS485, CAN

CONNECTIVITY
1x 100MbE, up to 2x USB, 2x RS232, RS485, CAN

MEMORYUp to 1GB DDR3L on-board

MEMORY
Soldered on Board DDR3L memory

MEMORY
Soldered on Board DDR3L memory

MEMORY
Soldered on Board DDR3L memory

MODULAR HMI SOLUTIONSMODULAR HMI SOLUTIONS

5.0 inch Rear Mount HMI based on NXP i.MX6 processor

7.0 inch Panel Mount HMI based on NXP i.MX6 processor

10.1 inch Flush Mount HMI based on NXP i.MX6 processor

10.1 inch Panel Mount HMI based on NXP i.MX6 processor

Ideal HMI solution for limited installation situations
with consistent quality

Fanless industrial PC impresses with simple
installation and good performance

Flexible, powerful all-rounder for any demanding
applications

Large high-resolution touch display

Santino Vision 5 RM MX6

Santino Vision 7 PM MX6

Santaro Vision 7 RM MX6

Santaro Vision 10.1 PM MX6

Flush Mount

Panel Mount

MODULAR HMI SOLUTIONS

Panel Mount

MODULAR HMI SOLUTIONS

Rear Mount

88

Rear Mount

MODULAR HMI SOLUTIONS

Panel Mount

MODULAR HMI SOLUTIONSCPU
NXP i.MX 6 FamilyCPU
NXP i.MX 6 FamilyCPU
NXP i.MX 6 FamilyCPU
NXP i.MX 6 Family

GRAPHICS
GC320 2D accelerator + GC880 3D accelerator

GRAPHICS
GC320 2D accelerator + GC880 3D accelerator

GRAPHICS
GC320 & GC355 2D accelerator + GC2000 3D accelerator

GRAPHICS
GC320 & GC355 2D accelerator + GC2000 3D accelerator

CONNECTIVITY
1x 100MbE, up to 2x USB, 2x RS232, RS485, CAN

CONNECTIVITY
1x 100MbE, up to 2x USB, 2x RS232, RS485, CAN

CONNECTIVITY
1x 100MbE, up to 2x USB, 2x RS232, RS485, CAN

CONNECTIVITY
1x 100MbE, up to 2x USB, 2x RS232, RS485, CAN

MEMORY
Soldered on Board DDR3L memory

MEMORY
Soldered on Board DDR3L memory

MEMORY
Soldered on Board DDR3L memory

MEMORY
Soldered on Board DDR3L memorywww.seco.com

Please visit www.seco.com to find the latest version of these datasheets

Please visit www.seco.com to find the latest version of these datasheets

www.seco.com

89

MODULAR HMI SOLUTIONS

7.0 inch Rear Mount HMI based on NXP i.MX8M Mini processor

10.1 inch Flush Mount HMI based on NXP i.MX6 processor

High performance, low power consumption,
integrated connectivity and multimedia interface

The SBC integrated in this HMI from the SANTOKA
series makes your product ready for IoT

Tanaro Vision 7 RM MX8M-Mini

Santoka Vision 10.1 FM MX6

Rear mount

Flush Mount

MODULAR HMI SOLUTIONSCPU
NXP i.MX 8M Mini FamilyCPU
NXP i.MX 6 Family

GRAPHICS
GC320 2D accelerator + GCNanoUltra 3D accelerator

GRAPHICS
GC320 & GC355 2D accelerator + GC2000 3D accelerator

CONNECTIVITY
Wifi/BT, 1x GbE, 1x 100MbE, up to 3x USB, 2x RS232, RS485, CAN

CONNECTIVITY
2x 100MbE, up to 3x USB, 2x RS232, RS485, CAN

MEMORY
Soldered on Board LPDDR4 memory

MEMORY
Soldered on Board DDR3L memory

7.0 inch Panel Mount HMI based on NXP i.MX8M Mini
processor

10.1 inch Panel Mount HMI based on NXP i.MX6 processor

High performance, low power consumption,
integrated connectivity and multimedia interface

Fanless industrial PC impresses with simple
installation, good performance and various interfaces

Tanaro Vision 7 PM MX8M-Mini

Santoka Vision 10.1 PM MX6

90

Panel Mount

MODULAR HMI SOLUTIONS

Panel Mount

MODULAR HMI SOLUTIONSCPU
NXP i.MX 8M Mini FamilyCPU
NXP i.MX 6 Family

GRAPHICS
GC320 2D accelerator + GCNanoUltra 3D accelerator

GRAPHICS
GC320 & GC355 2D accelerator + GC2000 3D accelerator

CONNECTIVITY
Wifi/BT, 1x GbE, 1x 100MbE, up to 3x USB, 2x RS232, RS485, CAN

CONNECTIVITY
2x 100MbE, up to 3x USB, 2x RS232, RS485, CAN

MEMORY
Soldered on Board LPDDR4 memory

MEMORY
Soldered on Board DDR3L memorywww.seco.com

Please visit www.seco.com to find the latest version of these datasheets

Please visit www.seco.com to find the latest version of these datasheets

www.seco.com

91039.23
Information subject to change.
Please visit www.seco.com to find the latest version of the SECO PRODUCT LINE datasheets.

www.seco.com