PACKAGE OUTLINE

DMM0022A

LSON-CLIP - 1.05 mm max height
SCALE 2.200

PLASTIC SMALL OUTLINE - NO LEAD
A

5.14.9B

PIN 1 INDEX AREA

6.1
5.9

2X (0.35)
3.329 0.1

EXPOSEDHEAT SLUG(0.701)2.284 0.1

(1.486)C

1.05 MAXSEATING PLANE
0.05
0.00

0.08 C

3.3 0.1
4X (1.9)

4X

2X (2)

0.48
0.38

4X (0.25)

2425

11124X (0.175)

EXPOSEDTHERMAL
PAD(0.2) TYP

2X (0.3)

2X
5PKG

27

5.4 0.1

120X 0.5
PIN 1 ID
(OPTIONAL)

2326

SYMM22X

220.55
0.45

22X

0.3
0.2
0.1
0.05

C ACB
4222731/B 07/2020

NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
4. Tie bar size and position may vary.

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EXAMPLE BOARD LAYOUT

DMM0022A

LSON-CLIP - 1.05 mm max height
PLASTIC SMALL OUTLINE - NO LEAD(3.3)
22X (0.7)

4X (2.115)
2623(R0.05) TYP

12222X (0.25)

21232020X (0.5)

4X(3.013)

27PKG

(5.4)
METAL UNDERSOLDER MASK
2X

6X
(1.32)SOLDER MASKOPENING
2X( 0.2) VIA
TYP

2X(1.13)
11(R0.05) TYP

1224

6X (1.4)25

SYMM
4X (0.375)(0.3) TYP

4X (0.43)(4.7)

LAND PATTERN EXAMPLESCALE:15X

0.05 MIN
ALL AROUND

0.05 MAXALL AROUNDSOLDER MASKOPENINGMETALMETAL UNDERSOLDER MASKNON SOLDER MASKDEFINED
PADS: 1, 2, 21-26
PAD 27: OPTIONALSOLDER MASKOPENINGSOLDER MASKDEFINED
PADS: 3-20
PAD 27: OPTIONALSOLDER MASK DETAILS
4222731/B 07/2020
NOTES: (continued)
5. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
6. Vias are optional depending on application, refer to device data sheet. If some or all are implemented, recommended via locations are shown.

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EXAMPLE STENCIL DESIGNDMM0022A

LSON-CLIP - 1.05 mm max heightPLASTIC SMALL OUTLINE - NO LEAD

SYMM
22X (0.7)

4X (2.115)
METALTYP

23268X (1.41)
2712222X (0.25)

22138X(1.12)

204X(3.013)

20X (0.5)

SYMM(0.66)
TYP(R0.05) TYP

METAL UNDERSOLDER MASK
2X(1.32)
TYP

1211(0.8) TYP

24
4X (0.375)25(0.3) TYP

4X (0.43)(4.7)

SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCILEXPOSED PAD 2371% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGESCALE:20X
4222731/B 07/2020

NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.

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