Company Overview(Unit:
Billionsyen)(Unit:
Billions
ofofyen)Tokyo Electron operates worldwide as a leading company in semiconductor and flat panel display (FPD) production equipment. By
providing the Best Products and Best Technical Service, we are aiming for medium- to long-term profit expansion and continuous
corporate value enhancement. We are also practicing our Corporate Philosophy by contributing to developing a sustainable society
through our business.

Branch,Branch,OfficeOffice(including(including
Field Field
Service),
Service),
SalesSales
OfficeOffice

TokyoElectron
ElectronKorea
Korea
Tokyo

Overseas:
Worldwide total:

7
21
28

TELManufacturing
Manufacturingand
and
TEL
EngineeringofofAmerica
AmericaEngineering
TEL Manufacturing
TEL Manufacturing
and andEngineeringof America
Engineeringof America
TEL Manufacturing
TELTEL
Manufacturing
and and
TELTechnology
Technology
Engineering
Engineeringof America
ofAmerica
Center,America
Center,America
TEL Technology
TEL Technology
Center,America
Center,America
TELVenture
VentureCapital
CapitalTEL
TEL Technology
TEL Technology
Center,Center,America
America
TEL
VentureCapital
Tokyo
ElectronU.S.
Holdings
Tokyo Electron U.S. Holdings
TEL Venture CapitalTokyoElectron
ElectronAmerica
AmericaTokyo
TokyoElectron
U.S. Holdings
TEL Venture
TEL Venture
CapitalCapital
Tokyo
Electron
U.S. Holdings
Electron
AmericaTokyoTokyo
Electron
AmericaTokyo ElectronTokyo Electron
U.S. Holdings
U.S. Holdings
Tokyo ElectronTokyo Electron
America
AmericaTokyoElectron
ElectronIndia
India
Tokyo

companies atcompanies at

TokyoElectron
ElectronTaiwan
TaiwanElectronTokyoTokyo
Electron
India India Tokyo
TokyoElectron
Electron
Tokyo
Tokyo
ElectronTaiwan
Tokyo
ElectronTaiwan(Malaysia)(Malaysia)
Tokyo ElectronTokyo Electron
India India
ElectronTokyoTokyo
ElectronTokyo ElectronTokyo Electron
TaiwanTaiwan(Malaysia)(Malaysia)
Tokyo
Electron
Tokyo
ElectronTokyo Electron
Tokyo
Electron
Singapore(Malaysia)(Malaysia)
Singapore
ElectronTokyoTokyo
ElectronTokyoElectron
ElectronTechnology
Technology
Tokyo
Singapore
Singapore
Solutions
SolutionsElectron
Technology
Tokyo ElectronTokyo ElectronTokyoElectron
ElectronMiyagi
MiyagiTokyoTokyo
Electron
Technology
Tokyo
Singapore
Singapore
Solutions
SolutionsElectron
MiyagiTokyo ElectronTokyo Electron
Technology
Technology TokyoTokyo
Electron
MiyagiTokyoElectron
Electron(World(WorldHeadquarters)
Headquarters)Tokyo
Solutions
SolutionsTokyo ElectronTokyo Electron
MiyagiMiyagi
TokyoElectron(WorldHeadquarters)
Tokyo
Electron(WorldHeadquarters)
TokyoElectron
ElectronFE
FE
sites
Tokyo

26
50
76

companies atsites insites in

17
18

DigitalDigitalSinglechip
chipPersonal
SinglePersonal
Consumer
Consumer
MobilePhone
Phone
BigData
Data
MobileBig
DigitalMicroprocessor
ComputerMicroprocessor
Computer
DigitalElectronics
Electronics
SinglePersonal
Singlechip chip
Personal
Consumer
MobilePhone
Big Data
Consumer
MobilePhone
Big Data
Microprocessor
Computer
DigitalDigitalMicroprocessor
ComputerElectronics
Electronics
SingleSingle
chip Shiftingchip
Personal
Shiftingto
toaa Personal
Consumer
Consumer and newBig Data
PhoneAspiration
Phone
Big Data
AcceleratingMobileMobile
Aspirationtoward
towardinnovation
Accelerating
innovationand new
Microprocessor
Microprocessor
ComputerComputerElectronics
Electronics

1990s
1990s
1990s

2006
2006
2006
2007
2007
2007
2007
2007
2007

2015
20152015

1964
1964
1964
1964
19641964

1968
1968
1968
1968
19681968

3

1984
1984
1984
1984
19841984

1986
1986
1986
1986
19861986

TOKYO ELECTRON SUSTAINABILITY REPORT 202 1

1990
1990
1990
1990
1990
1990
1994
1994
1994
1994
19941994
1999
1999
1999
1999
19991999

2015
2015
2015
2015
20152015

2019
2019
2019
2019
2019
2019

WaferProcess
Process(Front-end)(Front-end)
Wafer
Wafer
Process
Assembly
andTestTest(Front-end)
Process(Back-end)(Back-end)
AssemblyandProcess
Wafer
Process(Front-end)
Assembly
Test
Process(Back-end)
Assembly
and and
Test
Process(Back-end)
Wafer
Wafer
Process
Process(Front-end)(Front-end)

Lithography
Lithography(Photoresistcoating,coating,
Development)(Photoresist
Development)
Lithography
Lithography(Photoresist
coating,
Development)(Photoresist
coating,
Development)
Lithography
Lithography(Photoresist(Photoresist
coating,
coating,
Development)
Development)

Etching
Etching

Cleaning
Cleaning

Etching
Etching

Cleaning
Cleaning
Cleaning
Cleaning

Etching
Etching

Coater/Developer
Coater/Developer
ThermalProcessing
Processing Single
PlasmaEtch
SingleWafer
PlasmaEtch
System Plasma
SingleWafer
Wafer
AtomicLayer
LayerDeposition
Deposition
Thermal
Etch
PlasmaEtch
SystemSingleWafer
AtomicCompleted
Completed
TMTM
TMTM
TMTM
SystemSystemTactras
SystemTactras
SystemCleaning
SystemDepositionSystem
System System
SystemCleaning
SystemDeposition
CLEAN
TRACK
LITHIUSPro
TRACK
LITHIUSPro
ZZ
Coater/Developer
ThermalProcessing
PlasmaEtch
PlasmaEtch System
Wafer
Wafer
AtomicDeposition CLEAN
Transistor
BeforeTransistor
BeforeCoater/Developer
Completed
TMTM
ThermalProcessing
PlasmaEtch
PlasmaEtch System
SingleSingle
Wafer
Single+Single
Wafer
AtomicLayerLayer
Deposition
TMTM
TM
TMTM
TMTM
TM
NT333
NT333
Completed+
EpisodeUL
EpisodeULTELINDY
PLUS
CELLESTA
TriasDeposition System SystemTM- - System
TELINDY
PLUS
CELLESTA
Trias
TM
TM
SystemTactrasTM
SystemCleaning
CLEAN
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LITHIUSTM
Wiring Before
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dioxidefilm
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TM
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NT333
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+ TM nitride
EpisodeEpisode
UL TM ULTELINDY
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SilicondioxideSiliconnitridefilm
Silicondioxidefilm film Silicon
nitride film
Photoresist
Photoresist
Wafer
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SiliconSilicon
dioxidedioxide
film filmSiliconSilicon
nitridenitride
film film
Oxide/Nitridefilm
film
deposition
Photoresistcoating
coating
Exposure
Development
Etching
Ashing/Cleaning
Photoresist
Etching
Ashing/Cleaning
Oxide/Nitride
deposition
Exposure
Development
Wafer
Wafer

1970s
1980s
1960s
1990s
2000s
2010s 2020s
2020s
1970s
1980s
1960s
1990s
2000s
2010s
1970s 1980s
1980s 1990s
1960s 1970s
1990s 2000s
2000s 2010s
2010s 2020s
2020s
1960s
1970s 1980s
1980s 1990s
1960s
1960s 1970s
1990s 2000s
2000s 2010s
2010s 2020s
2020s

structureJapanby,forforcodeofof
conduct
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14,47914,47914,47914,47914,47914,479

Semiconductor Manufacturing Process and Our Main Products

Deposition
Deposition

～
～
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1963
1978
1963
1978
specialized
specialized
trading
tradingcompany
company
Tokyo
Electron
Tokyo
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Tokyo
Electron
Tokyo
Electron
1963
1978
1963
1980
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Laboratories,
Inc.
isSectiontheTokyo
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Electron
ListedontheSecondTokyo
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1963
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establishedwithcapitalStock
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(57.3%)(57.3%)* Fractions* Fractions
smallersmaller
than 100thanmillion
100 million
yen areyen
truncated.
are truncated.

Deposition

Tokyo
Electron
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Electron(WorldHeadquarters)
Headquarters)
Tokyo
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Tokyo
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countries and regions (consolidated)
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2015
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manufacturer
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group
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2015 of Tokyo

Japan
Japan
8,296
8,296
Japan
(57.3%)(57.3%)
8,296Japan
8,296(57.3%)(57.3%)
8,296
8,296

* Fractions
smallerthanmillion
100 million
yen
are truncated.
* Fractions
smallerthan 100
yen aretruncated.

Assembly
Assembly
and Testand Process
Test
Process(Back-end)(Back-end)
Deposition

countries and regions

History

specialized
tradingcompany
specializedcompany
Foundedas technicalFoundedastradingtechnical
specialized
tradingcompany
specialized
tradingcompany
FoundedFoundedas technicalas technical

398.4
541
398.4
541
ChinaChina (3.7%)
Europe(28.5%)(3.7%)(28.5%)
398.4
541Europe
398.4
541(28.5%)(3.7%)(28.5%)(3.7%)
398.4
398.4 North
541
541
NorthAmerica
America

Deposition
Deposition

Tokyo ElectronTokyo Electron
KyushuKyushu

Mainframe
Mainframe
ComputerComputer
Mainframe
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ComputerComputer
Mainframe
Mainframe
Foundedas
astechnicaltechnicalComputer
FoundedComputer

Japan
Japan
Number of Employees by Region (Consolidated)(Unit: People)(Unit: People)(28.5%)(28.5%)(3.7%)(3.7%)
63.5
63.5
North
North
America
1,796 America
1,796
63.5
63.5
North
North
America
America(12.4%)(12.4%)
152.0(10.9%)(10.9%)
152.0
1,796
1,796
North
North
America
America(12.4%)
152.0(10.9%)(12.4%)
152.0 (10.9%)
1,796
1,796
(12.4%)(12.4%)
152.0
152.0(10.9%)(10.9%)
JapanJapan
billionyenyenpeoplebillionpeopleJapanbillionyenpeople(fiscalyear
yearended
endedMarch
March
31,2021)2021)(fiscalyear
yearended
endedMarch
March
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(fiscal31,(fiscal31,31,2021)
Japanbillionyenpeople197.5(14.1%)(14.1%)
197.5
ended
March
31,
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ended
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Japan
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ended
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year year
ended
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31,people
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billionbillion
yen
yen
197.5
197.5 (14.1%)
Asia
SouthKorea
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(fiscal(fiscal
year ended
year ended
MarchMarch
31, 2021)
31, 2021)(fiscal(fiscal
year ended
year ended
MarchMarch
31, 2021)
31, 2021)
197.5
197.5
(14.1%)(14.1%)
TaiwanTaiwanSouth
Korea
Asia Asia
South
Korea
3,846
285.2
3,846
285.2
TaiwanTaiwan
Asia
Asia
South
South
KoreaKorea (26.6%)
249.7(17.9%)
249.7(17.9%)(26.6%)(20.4%)(20.4%)
3,846
285.2
3,846
285.2
TaiwanTaiwan249.7(17.9%)(26.6%)(20.4%)
249.7(17.9%)(20.4%)
3,846
3,846
285.2
285.2 (26.6%)* Fractionssmaller
smallerthan
than100
100million
millionyen
yenarearetruncated.
truncated.
* Fractions
249.7
249.7
(17.9%)(17.9%)(26.6%)(26.6%)(20.4%)(20.4%)

Repetition

Japan:

52.4(3.7%)
52.4(3.7%)Southeast
Southeast
Asia, andAsia,Others
and Others
52.4(3.7%)
EuropeEurope52.4(3.7%)
Europe52.4
52.4(3.7%)(3.7%)
Europe63.5(4.5%)
63.5(4.5%)

Repetition
Repetition
Repetition
Repetition
Repetition

ElectronTokyoTokyo
Electron
KoreaKorea

Tokyo ElectronTokyo Electron
Korea Korea
TEL Magnetic
SolutionsTokyo Electron (Shanghai)
TEL
Magnetic
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Electron(Shanghai)TokyoTokyo
Electron(Shanghai)
TEL
Magnetic
TEL
Magnetic
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EuropeTokyoElectron
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SolarServices
Services Tokyo
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Logistic
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Tokyo
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Tokyo
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EuropeEuropeTEL
Solar
ServicesTokyoTokyo
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TEL Solar
ServicesTokyo ElectronTokyo Electron(Shanghai)(Shanghai)
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IsraelTokyo
Tokyo ElectronTokyo Electron(Kunshan)(Kunshan)
TEL Solar
TELServices
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People)(Unit: (Unit:
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office(including
Branch,Office(includingField
FieldService),
Service),Sales
SalesOffice
OfficeBranch,OfficeHeadofficeBranch,Office(including
Service),
OfficeBranch,Office(including
FieldField
Service),
SalesSales
OfficeHeadHead
officeoffice

TELMagnetic
MagneticSolutions
Solutions
TEL(Unit:
People)(Unit:
People)(Unit: Billions(Unit:
Billionsof yen) of yen) Europe
China
EuropeChina

EuropeEurope(4.5%)(4.5%)
NorthAmerica
America
North
North
America(4.5%)(4.5%)
North
America

Number of Sites (As of March 31, 2021)

ElectronTokyoTokyo
ElectronIsraelIsrael

Billions(Unit: (Unit:
Billionsof yen)of yen)
China
China

SoutheastAsia,
andOthers
OthersSoutheast
andSales
byAsia,Region(Consolidated)
Southeastand Others
Southeast
Asia,Asia,and Others

Oxide/Nitride
film deposition
Oxide/Nitride
film deposition
Wafer Wafer

Photoresist
coating Exposure
Exposure
Photoresist
coating

Oxide/Nitride
Oxide/Nitride
film deposition
film deposition

Interconnectformation
formation
Interconnect
Interconnect
formation
Interconnect
formation
Interconnect
Interconnect
formationformation

Development
Development

Etching
Etching

Photoresist
Photoresist
coating
coating
Exposure
Exposure
Development
Development
Isolation
Formation/Gate
Formation
Isolation
Formation/Gate
Formation
Isolation
Formation/Gate
Formation
Isolation
Formation/Gate
Formation
Testing
Testing
Isolation
Isolation
Formation/Gate
Formation/Gate
Formation
Formation
Testing
Testing

Testing
Testing

Ashing/Cleaning
Ashing/CleaningGate
GateElectrode
Electrode

Packaging/Inspection
Packaging/Inspection
Packaging/Inspection
Packaging/Inspection

Electrode
GateGate
Electrode
Gate Electrode
Gate Electrode

Packaging/Inspection
Packaging/Inspection

Wafer
ProberSingleWafer
Deposition Plasma
PlasmaEtch
System
Wafer
ProberSingleWafer
Deposition
Etch
System
TMTM
TMTM
TMTM
PrecioSystem Wafer Deposition
Tactras/ Episode
PrecioSystemTactras/ EpisodeULUL
XLXL
PlasmaEtch System
WaferWafer
ProberProberSingleSingle
Deposition Plasma
Etch System+ TM
TM+WaferTriasSystem
Trias
TM
TM
TM
Tactras/ EpisodeTM
TM
TM
PrecioPrecio
SystemTactras/ Episode
UL UL
XL XL
Wafer Prober
Wafer ProberSingleWafer
SingleDeposition
Wafer Deposition
PlasmaPlasma
Etch System
Etch System
+ TM
+ TM
Trias Trias
TM
TM
TM
PrecioTMPrecio
SystemSystemTactrasTactras/ Episode/ Episode
UL TM ULXL TM XLIntermetal
Metal
film
Intermetal
Metal
film
+ TM
+ TM
Triasdielectric
Trias film
film
Intermetal
Metalfilm
film dielectric
Metal
Intermetal
MetalMetal
film film
dielectric
dielectric
film film
MetalMetal
film film
IntermetalIntermetal
Metal film
Metal film
dielectric
film film
Metal film
Metal film dielectric

Wafer
Bonder/Debonder
Wafer/Dicing
Frame
Wafer
Bonder/Debonder
Wafer/Dicing
Frame
Completed
Completed
TMTM
SynapseProberSynapseProber
V/V/
Semiconductor
Semiconductor
Wafer
Bonder/Debonder
Wafer/Dicing
TM
TM
Completed
TMTM
Wafer
Bonder/Debonder
Wafer/Dicing
FrameFrame
WDF
Synapse
Plus
12DP+
WDF
Synapse
ZZ
Plus
12DP+
Completed
TM
Packaging
Packaging
SynapseV/
TM V/
SynapseProberProber
Semiconductor
TM
Semiconductor
TM Z Plus
WDF
Synapse
12DP+
TM
Wafer
Bonder/Debonder
Wafer
Bonder/Debonder
Wafer/Dicing
Wafer/Dicing
Frame
Frame
TM
Completed
Completed
WDF 12DP+
Synapse Z Plus
Packaging
Packaging
TM V/
TM V/
SynapseSynapse
Prober Prober
Semiconductor
Semiconductor
TM Z Plus
TM Z Plus
WDFTM WDF
SynapseSynapse
12DP+TM 12DP+

Packaging
PackagingInterconnect
Interconnect
CompletedIntegrated
Integrated
Completed
WaferProbe
ProbeTesting
Testing
Wafer
Formation
Formation
Circuit Integrated
CircuitInterconnect
Completed
Interconnect
Completed
Integrated
Contact
Formation
Wafer
Probe
Testing
Contact
Formation
Wafer
Probe
Testing
Formation
Circuit
Formation
CircuitInterconnect
Interconnect
Completed
Completed
Integrated
Integrated
Contact
Contact
Formation
Formation
WaferWafer
ProbeProbe
Testing
Testing
Formation
Formation
CircuitCircuitContactFormation
Formation
Contact

Ashing/Cleaning
Ashing/Cleaning

Etching
Etching

WaferBonding/
Bonding/
Wafer
Debonding
Debonding
Bonding/
WaferWafer
Bonding/
Debonding
DebondingWaferWafer
Bonding/
Bonding/
Debonding
DebondingInspection
Inspection
Inspection
Inspection
Inspection
Inspection

Packaging/
Packaging/
Assembly
Assembly
Packaging/
Packaging/
Assembly
Assembly
Packaging/
Packaging/
Assembly
Assembly

FPD Production Equipment

FPDCoater/Developer
Coater/Developer
FPD
TM
Exceliner
Exceliner
FPD TM
Coater/Developer
FPD
Coater/Developer

TM
TM
Exceliner
Exceliner
FPD Coater/Developer
FPD Coater/Developer
TM
Exceliner
ExcelinerTM

FPDPlasma
PlasmaEtch/Ash
Etch/AshSystem
SystemFPD
TMTM
Impressio
Impressio
FPD Plasma
Etch/Ash
SystemFPD
PlasmaEtch/Ash
SystemTM
TM
Impressio
Impressio
FPD Plasma
FPD Plasma
Etch/Ash
Etch/Ash
SystemSystemTM
Impressio
Impressio TM

FPDPlasma
PlasmaEtch/Ash
Etch/AshSystem
SystemFPD
BetelexBetelexFPDTMTM
PlasmaEtch/Ash
SystemFPD
PlasmaEtch/Ash
SystemTM
TM
BetelexBetelexFPD Plasma
FPD Plasma
Etch/Ash
Etch/Ash
SystemSystemTM
BetelexBetelexTM

InkjetPrinting
PrintingSystem
Systemfor
for
Inkjetmanufacturing
OLED
display
manufacturing
OLED
display
InkjetPrinting
Systemfor
InkjetPrinting
System
for
TMTM
Elius
Elius
manufacturing
OLED
display
manufacturing
OLED
display
InkjetInkjet
Printing
Printing
SystemSystemfor for
TM
TM
Elius
Elius
manufacturing
manufacturing
OLED OLED
display
display
TM
TM
Elius EliusTOKYO ELECTRON SUSTAINABILITY REPORT 202 1

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