VSB-S19212xxxAS8TxU-HTMSOP8-E000-Rev.1.0

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RELIABILITY TEST RESULT
Product name : S-19212xxxA-S8TxU
Package type : HTMSOP-8No.

Test item

Test Condition

1High-temperature operation2

Temperature humidity bias

3

Pressure cooker bias

4

Test Timer/nCriterion

Ta=150 °C, V=Vopr max.

2000 h0/22 Satisfies the product standard

Ta=85 °C, RH=85 %, V=Vopr max.

2000 h0/22 Satisfies the product standard

Ta=130 °C, RH=85 %, P=2.3×10 Pa
V=Vopr max.

96 h0/22 Satisfies the product standard

Storage in high temperature

Ta=150 °C

2000 h0/22 Satisfies the product standard

5Storage in low temperature

Ta=−65 °C

2000 h0/22 Satisfies the product standard

6Temperature Cycle (Gas phase)1000 cycles

0/22 Satisfies the product standard

7

Resistance to soldering heat-1#2(reflow soldering)

8
9

#1

5

#1

#1

T=260 °C ,10 s

3 times

0/22

Satisfies the product standard
No abnormality by appearances

Resistance to soldering heat-2#2(Soldering Iron)

T=380 °C , 5 s(Soldering iron tip temperature)
Object：terminal parts

2 times

0/22

Satisfies the product standard
No abnormality by appearances

Resistance to soldering heat - 3#2(Flow soldering)

T=260 °C ,10 s

1 time0/22

Satisfies the product standard
No abnormality by appearances

10 Solderability #3

11

Ta=150 °C ⇔ −65 °C
15 minutes for each

Whisker - 1(Temperature / Humidity Storage)

Whisker - 2(Temperature Cycling)
Whisker - 3
13 (High Temperature / HumidityStorage)

12

T=245 °C
Solder material：Sn-3.0Ag-0.5Cu

Zero cross time should be lessthan 3 seconds.
5s

0/11 Solder should be applied at 95% ormore of solderability judgmentarea.

Ta=30 °C, RH=60%

4000 h0/6

Whisker should be less than 40μｍ

Ta=85 °C ⇔ −40 °C

1500 cycles

0/6Whisker should be less than 45μｍ

Ta=55 °C, RH=85 %4000 h0/6

Whisker should be less than 40μｍ

After temperature cycle test, keep
0/22 strength for shear stress more than
the 50 ％ of initial mean value.

Solder Joint Reliability
14 (shear test) #3

Ta=125 °C ⇔ −40 °C
Solder material：Sn-3.0Ag-0.5Cu

15 Terminal Strength (Pull test)

Pull force：0.5 N

30 s

0/11 Terminal is not taken off

16 Terminal Strength (Bending test)

Load：0.25 N, 45 degree Bend a lead

2 times

0/11 Terminal is not taken off

17 ESD - 1 (Human Body Model)

V=±2000 V, C=100 pF, R=1.5 kΩ
Ground：V IN / Vss

5 pulses

0/5

Satisfies the product standard

18 ESD - 2 (Charged Device Model)

V=±500V charged, discharged

1 pulse

0/5

Satisfies the product standard±100 mA, V =Vopr max.

1 pulse0/5

No latch up

The overvoltage specified when
V = Vopr max.

1 pulse0/5

No latch up

Latch up 1(Pulsed current injection test)
Latch up 220(Vsupply overvoltage test)

192000 cycles

Remark：Vopr max. =Maximum operation voltage#1,2,3：Each test designated # is performed after Pre-Treatment finished.
Pre-Treatment consists of High Temperature Storage ,Temperature Humidity
Storage and Soldering Heat. (See the table below.)

ABLIC Inc.

VSB-S19212xxxAS8TxU-HTMSOP8-E000-Rev.1.0

Pre Treatment (#1)
High Temp.
Storage

Temperature
Humidity Storage

Soldering Heat

Ta=125 °C
t=24 hTa=85 °C
RH=85 %
t=168 hReflow 3 times
T=260 °C
t=10 sPre Treatment (#2)
High Temp.
Storage

TemperatureHumidity Storage

Soldering Heat

Ta=125 °C
t=24 hTa=85 °C
RH=85 %
t=168 h－Pre Treatment (#3)
High Temp.
Storage

Temperature
Humidity Storage

Soldering Heat－

Ta=105 °C
RH=100 %t=8 h－

ABLIC Inc.

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