Call for Papers

ASMP2015
Venue and Conference Date
Lombok Raya Hotel, Lombok Island, Indonesia

10-13 August 2015
Topics covered
Conference topics will be presented in oral and poster format. Oral sessions will
include plenary, invited and contributed papers. Topics include but not limited to: Advanced Materials
 Metals, Ceramics, Polymers and Composites
 Smart Materials and Structures, FunctionalMaterials
 Materials Processing, Forming, Casting andMachining Powder Metallurgy, Adhesion and Interface,
Welding and Bonding Nanofabrication and Nano / Micro / Meso
Manufacturing Processes Advanced Manufacturing Micro and Nano Technology in Materials andProcessing Mechanical Properties, Fracture and Reliability
 Dynamic Behavior of Materials and Structures
 Materials Characterization and Measurement

Techniques Non-Destructive

Testing and Evaluations,Monitoring and Sensing Technology
 Modeling, Analysis and Simulation in Materialsand Processing

Deadlines
Submission of Abstracts
Notification of Abstract Acceptance:28th February 2015
:14th March 2015

About ASMP2015
The 4th Asian Symposium on Materials & Processing, ASMP2015, will be held from August 10 to 13, 2015 inLombok, Indonesia. This is the 4th in the series of ASMP (past symposiums were held in Bangkok, Thailand (1st), inPenang, Malaysia (2nd) and in Chennai, India (3rd), respectively). The aim of the symposium is to enhance mutualcollaboration for higher research level and activity in the fields of Materials and Processing Engineering in Asian
region. The symposium will become a perfect platform to share, discuss and exchange ideas on the latest
development and recent findings in research studies related to advanced materials and processing amonginternational participants. We would like to cordially invite you to ASMP2015.

Registration Fee
Early Bird
(until 30th April 2015)

Normal(until 31st May 2015)

Late(until 30th June 2015)

Japanese

JPY45,000

JPY47,500

JPY52,500

Non-Japanese

USD450

USD475

USD525

Japanese Student

JPY37,500

JPY40,000

JPY45,000

Non-Japanese Student

USD375

USD400USD450Conference Website
http://www.jsme.or.jp/mpd/asmp2015/

Contact
ASMP2015 Secretariat, E-mail: secretary.asmp2015@gmail.com

Presentation
Oral and poster sessions are planned. In the event of a large number of accepted papers, some will be assigned toposter sessions. This determination will be made by the conference committee.

Submission of AbstractAuthors should submit an abstract NOT exceeding 300 words, no later than 28th February 2015 by e-mail tosecretary.asmp2015@gmail.com, including 1) Paper title, 2) Authors’ names, 3) Affiliation, 4) Job title, 5) Mailingaddress, 6) Phone and fax, 7) E-mail address, and 8) Five key words. Format of abstract can be downloaded fromthe conference website. After reviewing process by the conference committee, authors will be notified of acceptanceor rejection of their abstracts by 14th March 2015.

Preparation of Proceeding Papers (Extended Abstract)
Conference proceedings will be published by JSME and QiR. Authors should submit the proceeding paper (2 pagesincluding figures), no later than 15th April 2015, through the conference website. After reviewing process by theconference committee, authors will be notified of acceptance or modification of their papers. Accepted papers willappear on the ASMP2015 Conference Proceeding. Details will be available on the conference website.

Journal Publication
Participants of ASMP2015 can submit papers to the Special Issue on the Asian Symposium on Materials andProcessing (ASMP2015) of Mechanical Engineering Journal (JSME International Journal). The issue will be
published in April 2016.

Conference Committee Members
Symposium Chair:Prof. Hideshi Miura, Kyushu University, Japan
General Chair:Prof. Masaaki Otsu, University of Fukui, Japan
Dr. Gandjar Kiswanto University of Indonesia, Indonesia
Co-General Chair:Prof. Ming Yang, Tokyo Metropolitan University, Japan
Dr. Ario Sunar Baskoro, University of Indonesia, Indonesia
Scientific and Program Chair:Prof. Yukio Miyashita, Nagaoka University of Technology, Japan
Dr. Sugeng Supriadi, University of Indonesia, Indonesia

The 4th Asian Symposium on Materials & Processing (ASMP2015)
REGISTRATION FORM:
Name:
Affiliation:
Address:.
.
.
.

Title of Paper:.
.
.
DEAD LINE:.
28th February, 2015 .
(Submission of Abstract)

E-mail:Tel:
Fax:
Presentation:□Oral.

□Poster□Participant(Please check)