Environmental Report

Product-related Environmental Initiatives
TEL is eagerly executing Life Cycle Assessments (LCA) on an ongoing basis.

Design Working Group (WG) under the Product EHS Technical Committee

Reducing the Environmental Burden of Products
TEL has strived to incorporate suggestions from customers into its(see page 10), which is focusing on energy and resource conservation.

products and promoted the reduction of environmental burdens during

In terms of LCA, currently in each Business Unit (BU) and Division,

semiconductor production, as well as eliminated harmful substances

we are compiling data on the environmental burden of newly-developed

from materials used to make equipment. We respect and have placed

equipment and using findings to improve equipment or next-generation

great importance on the need for customers to know about the environ-machines. In addition, we have also established a Lead-Free Task Teammental burden of products throughout their life cycles. As a result, wewith the aim of implementing a lead-free policy from production in 2006.

work as quickly as possible to collect and compile data relating toIn addition to internal activities, we have also established a Greenthese impacts during each stage of a product’s lifecycle, manufac-Procurement WG, which has clarified TEL procurement standards —ture, use and disposal. Currently, by effectively applying the LCA data

based on the need to consider the environmental burden in purchas-and the product design data that we have accumulated, we haveing materials for equipment production — and conveyed these toreached the top position in our industry. Furthermore, we are constantlysuppliers.

striving to incorporate environmental considerations into our businessWe investigate the environmental approaches of our suppliers,

from all and any angles possible, such as our initiative to conserve

and, when necessary, provide them with environmental education toenergy by reducing heat released to the clean room.

support their environmental activities.
In TEL equipment, EHS related items have become required by customers, and it is an important task to integrate the EHS concept from theOrganization for Lowering Environmental Burden
TEL has clarified items that can be uniformly addressed as well as

development and design phase of the products at an early stage. Further-

listed priority items for the entire group in relation to reducing environmental

more, as the globalization of our company advances, adapting to local

burden in equipment, while at the same time striving to enhance perform-

legal systems in various countries is increasingly necessary. To respondance from an environmental perspective. We have also created an Eco

to these demands we are actively pushing ahead with Design For EHS.

TOPICS
Implementing LCA for Newly-Developed Equipment
We are carrying out LCA as a means of objectively evaluating the environmental burden of our products via the TEL.
The equipment that we are showing you here is the Trias™ SPA.
This is a wafer nitridation and oxidization film deposition systemthat was jointly developed with the support of Japan’s Ministry ofEconomy, Trade and Industry and Tohoku University. As the miniaturization of semiconductor processing advances, the damage
caused by conventional plasma processing can no longer beignored. Trias SPA employs SPA (Slot Plane Antenna) to perform
plasma processing without damaging the wafer while satisfying
the demands of producing high-density plasmas at low electrontemperatures. TEL performs LCA for equipment that uses newtechnology, such as this, and determines the environmental load

per life cycle. By feeding back these evaluation results into new, nextgeneration equipment development, we are striving to reduce the environmental burden. TEL was also awarded the Prime Minister’s Awardfor the Trias SPA at the second conference on promoting of IndustryAcademia-Government Collaboration held in Kyoto in June 2003.

Lifecycle CO2 Emission Rate(%)

CO2 emission rate

2.6%
0Material
manufacture

1.0%
Assembly

96.2%

0.1%
Equipment
transportEquipmentoperation0.1%
Disposal

CO2 Emission Rate During Operation(%)

CO2 Emission Rate
59.5%
32.9%

Trias SPA0Prime Minister’s Award certificate and plaqueTOKYO ELECTRON

16Electricity

Environmental Sustainability
Report 2004

Coolant water

3.9%

3.7%

ExaustN2 gasConserving Energy in Clean Rooms•A Shift in Heat Sources and Cooling Methods•Shifting to More Efficient Method of Heat Exchange

One of TEL’s main products, the Thermal Processing System, conducts

To realize better heat absorption efficiency than available via conven-film deposition on wafers during the manufacturing of semiconductors at

tional heat exchangers, we have adopted a plate-style device that is morevery high temperatures. In the clean rooms, where this process takes place,compact. As a result, the burden placed on the clean room by the heat

the amount of particles (microscopic dust, etc.), the temperature and thereleased from the heat exhaust pipes has been reduced.

humidity are controlled with a special air conditioner. The high temperatureprocessing in the clean room makes these air conditioners work extremely

Heat Exchanger Change

hard and consequently increases the consumption of the energy. In order toConventional
methodreduce energy consumption, TEL’s new product TELFORMULA™ uses aNew
methodAir innew method.

Air inIn conventional systems, the heat generated inside the equipment
while processing a wafer is released to the outside via coolant water runCoolant
water outning through pipes located on the outer rim of the heat generating area,

Coolant
water out

and thus heat is directly released
from the surface of the equipment

Coolant
water inCoolant
water into the clean room and controlled.
Air out

TELFORMULA is structured so that

Shifted to the plate style,which is more compact
with higher heatexchange efficiency.

Air out

the coolant water runs in layers

Heat Release Rate and Processing
Temperature vs. Electricity Consumption

and inside the top panel, improving
the heat absorption rate. With theConventional model(%)

New model

Heat release rateby electricity consumption

realization of this new method has
arisen the possibility that we cangreatly cut electricity consumption
in clean rooms.
TELFORMULA

12840

Change in Heat Source Cooling Method
Conventional
method16300

400

NewmethodCoolant water in

Cooling of
the top panel

Coolant water out

9001000 (ºC)•Coming Initiatives

Coolant water inInsulationmaterial

500
600
700
800
Processing temperature

Based on these new methods and system developments, we are con-sidering a closed system employing a quick cooling system as a means ofCooling ofside area

countering heat release for the next generation.

Coolant water out

Creating a Closed System with the Quick Cooling System
PresentOpen system

Coolant pipe

HeatsourceCoolant waterruns in layers

FutureClosed system

Heat release
Heatsource

Heatexchanger

Heatexchanger

BlowerBlowerTOKYO ELECTRON

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Environmental Sustainability
Report 2004

Environmental Report

Product-related Environmental Initiatives

Lead-free Initiative
The use of harmful materials such as lead, mercury and cad-solder. Specifically, in FY 2004 they investigated the current situation

mium in consumer electronic products will be banned come Junewith our suppliers. In FY 2005, we intend to clarify the major issues

2006 in the European Union (EU) under WEEE*1 and RoHS*2.

and tasks with suppliers, formulate technical standards, review intro-Although semiconductor production equipment does not fall under

ducing this methodology into the manufacturing processes, decide thethe scope of these directives, TEL endeavors to take preventive

items for the unit evaluation and execution, and to decide the assembly

measures against pollution and is forging ahead with efforts to realize

evaluation items and the unit, while responding as an organization.

lead-free processes.

*1 WEEE: Waste Electrical and Electronic Equipment*2 RoHS: Restriction of the use of certain Hazardous Substances in electrical and electronic equipment

TEL has established a Lead-free Task Team composed of representatives from each company, BU and Division to implement lead-free
Lead-free Implementation PlanFY 2004

Targets
Apr.

July

Oct.

FY 2005
Jan.

Apr.

July

Oct.

FY 2006
Jan.

Apr.

July

Oct.

FY 2007
Jan.

Apr.

July

Formation and launch of Lead-free Task Teamand its activities
Policy announcements (to suppliers)
Consideration of technology and materials to be adopted
Supplier survey, cooperation and action plan
Cooperation on countermeasures with OEM makers
Evaluations of module units, boards
Evaluation embedding modules, boards
Production preparation
ProductionTo beToimplemented
be executed after 2006

TOPICS
Large Reduction in Developing Solution Consumption
TEL focuses on reducing environmental burden as well as costs,
and we are making efforts to reduce the consumption of chemicalsolution used when operating equipment.
During the lithography process, a pattern is transfered onto the wafer
surface by applying an organic photosensitive chemical, known as photoresist; then, the developing process is performed. The most common
developing process uses TMAH (tetramethylammonium hydroxide) watersolution. Miniaturization of semiconductor technology tends to make thesurface of the photoresist more prone to shed water. The conventional
paddle developing method uses a larger amount of the developing solution due to the increased water-resistance of the photoresist surface.
TEL has invented a new nozzle
and a developing method that reduces
the developing solution consumption
to one-fifth of the conventional method,
regardless of the photoresist surface
water-resistance. We are currently
pushing ahead with plans to adapt
CLEAN TRACK LITHIUS

TOKYO ELECTRON

this method to our coater/developer technology for our main product line,
the CLEAN TRACK LITHIUS and CLEAN TRACK ACT™ series.

Developing Solution Consumption
The graph indicates the developing solution consumption needed for onewafer (one developing). Currently, the most advanced process uses ArF photolithography and more developing solution is consumed than with the conventional KrF method. This tendency is expected to continue to the F2-laser
photolithography, which is being considered for the next generation.
Developing solution consumption
Photoresist surface contact degree(degree)018

Photoresist surface
contact degree

Developing solution
consumption

(ml)

KrF
ArF
F2
Conventional method

Environmental Sustainability
Report 2004

KrF
ArF
F2
New method0Our Stance on Green Procurement
suppliers that meet certain environmental

We procure raw materials and parts from outside TEL to be usedin our main products — semiconductor and FPD production

standards.

equipment. In order to reduce the environmental burden of TEL’s* Green Procurement Guideline: Standards
and targets for chemicals and energy conservation, packaging, resource conservation, recycling, and information disclosure.

business activities, the procured parts and the raw materials need tobe produced with the environment in mind. For that reason, TEL procures materials from suppliers that are actively engaged in activities
to reduce the environmental burden based on the green procurement
guideline*. In the future, we plan to limit our procurement only to theGreen Procurement Guideline

Green Procurement Action PlanThemeFY 2004

FY 2005

FY 2006

FY 2007

FY 2008

Green procurement for equipment and parts
Supplier surveys and instruction in improving
environmental management

Survey/Improvement guidance

Reviewing supplier relationships
Compose lists of materials prohibited from use in products

Survey/Improvement guidance

Survey/Improvement guidance

Survey/Improvement guidance

Survey/Improvement guidance

Reviewing supplier relationships
List composition

Collect data and request cooperation on materials
prohibited from use in products

Data collection/Establish master parts registration

Replace parts containing prohibited materials

Promote designs that do not use materials prohibited from use in products

Clarifying Materials Prohibited or to be Reduced inProducts

Results of FY 2004
We evaluated our suppliers on a four-tiered scale of environ-

TEL has formulated a list of materials contained in product parts

mental consciousness in FY 2004 and worked with the suppliers thatand materials beyond those chemicals regulated by law, while clari-needed to make improvements. As a result, the number of D rank

fying which substances are being used and promoting the reductionsuppliers (those that need to be more environmentally considerate)or substitution of chemicals with our Guidelines for Chemicals Ban-has decreased. We will continue to work with our suppliers andned from Use in Products or to be Reduced. We have begun survey-

reduce the environmental burden by integrating the green procure-ing our suppliers to determine whether they are using any of thesement evaluation results into the supplier quality evaluation.

substances. We also plan to build a system where all chemical sub-Suppliers’ Environmental Activities Survey Results

stances contained in parts and materials are registered in an integra-(%)

end of FY 2004

FY 2002

ted database so that a search of the product or check at the time of93%

ordering will yield all necessary information.
68%

List of Materials Prohibited from Use in Products
Material groups
Asbestos

Hydrogen fluoride and its water-soluble salt

Cadmium and its compounds

Beryllium and its compounds

Hexavalent Chromium compounds

PCB’s (polychlorinated biphenyls)

CyanidesOzone depleting substances

Mercury and its compounds

Halogen fire retardants

Organotin compounds

Specific bromine fire retardants (PBB, PBDE, etc.)

Selenium and its compounds

Polychlorinated naphthalenes (more than three chlorines)

Dioxins

Organic chlorine-based substances

Arsenic and its compounds

PFOS* and its homologs

32%

7%0A-C rank* PFOS: Perfluorooctane sulfonate
PFOS is an intermediate used to create the final compounds

TOKYO ELECTRON

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Environmental Sustainability
Report 2004

D rank