WORLD TRADE
ORGANIZATIONG/IT/W/6/Rev.2
11 July 2003
(03-3761)
Committee of Participants on the Expansion of Trade in
Information Technology Products
CLASSIFICATION DIVERGENCES
Note by the Secretariat
Revision
In order to proceed with work on Classification Divergences, it was requested at the formal
meeting of 24 April 2003 that the Secretariat update these lists of products based on the latest report
from customs experts (Informal Meeting of Customs Experts from ITA Participants to Discuss
Classification Divergences,  G/IT/14/Rev.1/Add.1).
Thus, this document revises the information in G/IT/W/6 + Rev.1, and is based on the
information contained in G/IT/14/Rev.1/Add.1.
The lists are set out as follows:
(1A) those items where divergences were narrowed to one classification option,
(1B) those items where divergences were narrowed  to two or more possible classifications, and
agreement was reached with respect to these classifications
(2) those items where divergences were narrowed to two or more possible classifications, and there
was not agreement on the classifications
(3) those items which were to be sent to the World Customs Organization (WCO) Harmonized
System Committee (HSC)
(4) those items where no further progress could be achieved due to a number of circumstances, and(5) those items referred to this formal Committee to be addressed.
Participants may also wish to refer to doc uments G/IT/2 and G/IT/2/Add.1/Rev.1 which show
the classifications that they had notified in their schedules for each Attachment B item.
Classifications indicated in bold  were still outstanding issues noted by the Group.
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I (A). DIVERGENCES WERE NARROWED TO ONE CLASSIFICATION OPTION
1. 113- Quartz reactor tubes and holders designed for insertion into diffusion and oxidation
furnaces for production of  semiconductor wafers (702000)
2. 114- Chemical vapour deposition apparatus for semiconductor production (841989)
3. 115- Parts of chemical vapour deposition apparatus for semiconductor production (841990)4. 125- Lasercutters for cutting contacting tracks in semiconductor production by laser beam
(845610)
5. 126- Machines for sawing monocrystal semiconductor boules into slices, or wafers into chips
(846410)
6. 141- Apparatus for physical deposition by sputtering on semiconductor wafers (854389)
7. 147- Physical deposition apparatus for semiconductor production (854389)
8. 148- Spinners for coating photographic emulsions on semiconductor wafers (847989)9. 149- Part of apparatus for physical deposition by sputtering on semiconductor wafers
(854390)
10. 151- Parts for spinners for coating photographic emulsions on semiconductor wafers (847990)11. 158- Parts of physical deposition appa ratus for semiconductor production (854390)
12. 162- Apparatus for rapid heating of semiconductor wafers (851430)13. 164- Parts of apparatus for rapid heating of wafers (851490)14. 181- Pattern generating apparatus of a kind used for producing masks or reticles from
photoresist coated substrates (901720)
15. 182- Parts and accessories for pattern generating apparatus of a kind used for producing
masks or reticles from photoresist coated substrates (901790)
16. 183- Parts of such pattern generating apparatus (901790)17. 195- Monitors : display units of automatic data processing machines with a cathode ray tube
with a dot screen pitch smaller than 0,4 mm not capable of receiving and processing television
signals or other analogue or digitally processe d audio or video signals without assistance of a
central processing unit of a computer as defined in this agreement.  The agreement does not,therefore, cover televisions, includi ng high definition televisions. (847160)
18. 196- Optical disc storage units, for automatic data processing machines (including CD drives
and DVD-drives),  whether or not having the capability of writing/recording as well as
reading, whether or not in their own housings. (847170)G/IT/W/6/Rev.2
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I (B). DIVERGENCES WERE NARROWED TO TWO OR MORE POSSIBLE
CLASSIFICATIONS, AGREEMENT ON CLASSIFICATIONS REACHED
1. 142- Apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and
flat panel displays (842489, 846490, 847989)
2. 143- Die attach apparatus, tape automated bonders,  and wire bonders for assembly of
semiconductors (847989, 851580)
3. 146- Machines for bending, folding and straightening semiconductor leads (846221, 846229)4. 150- Parts for die attach apparatus, tape automated bonders, and wire bonders for assembly of
semiconductors (847990, 851590)
5. 168- Apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and
flat panel displays (842489, 846490, 847989)
6. 191- Computers: automatic data processing m achines capable of 1) storing the processing
program or programs and at least the data immediately necessary for the execution of the
program; 2) being freely programmed in accordance with the requirements of the user; 3)
performing arithmetical computations specified by the user; and 4) executing, without human
intervention, a processing program which requires them to modify their execution, by logicaldecision during the processing run.  The agreement covers such automatic data processing
machines whether or not they are able to receive and process with the assistance of central
processing unit telephony signals, television signals, or other analogue or digitally processed
audio or video signals.  Machines performing a specific function other than data processing,
or incorporating or working in conjunction with  an automatic data processing machine, and
not otherwise specified under Attachment A or B, are not covered by this agreement. (847110,
847130, 847141, 847149)
7. 194- Network equipment: Local Area Netw ork (LAN) and Wide Area Network (WAN)
apparatus, including those products dedicated for use solely or principally to permit the
interconnection of automatic data processing machines and units thereof for a network that is
used primarily for the sharing of resources such as central processor units, data storagedevices and input or output units - including adapters, hubs, in-line repeaters, converters,
concentrators, bridges and routers, and printed circuit assemblies for physical incorporation
into automatic data processing machines and units thereof. (847180, 851750)
8. 198- Plotters whether input or output units of HS heading No 8471 or drawing or drafting
machines of HS heading No 9017. (847160, 901710, 901720)
9. 200
- Projection type flat panel display units used with automatic data processing machines
which can display digital information generated by the central processing unit. (847160,
852830)G/IT/W/6/Rev.2
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II. DIVERGENCES WERE NARROWED TO TWO OR MORE POSSIBLE
CLASSIFICATIONS, NO AGREEMENT ON CLASSIFICATIONS REACHED
1. 137- Encapsulation equipment for assembly of semiconductors (847710, 847740, 847759,
847989)
2. 138- Parts of encapsulation equipment (847790, 847990)3. 144- Encapsulation equipment for assembly of semiconductors (847710, 847740, 847759,
847989)
4. 155- Parts of encapsulation equipment for assembly of semiconductors (847790, 847990)5. 192- Electric amplifiers when used as repeaters in line telephony products falling within this
agreement, and parts thereof (851750, 851780, 851790, 851840, 851890)G/IT/W/6/Rev.2
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III. ITEMS TO BE SENT TO THE WCO HSC
1. 203- Set top boxes which have a communication function:  a microprocessor-based device
incorporating a modem for gaining access to the Internet, and having a function of interactive
information exchange. (851750, 852510, 852520, 852812)G/IT/W/6/Rev.2
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IV. ITEMS WHERE NO FURTHER PROGRESS COULD BE ACHIEVED DUE TO A
NUMBER OF CIRCUMSTANCES
1. 175- Optical stereoscopic microscopes fitted with equipment specifically designed for the
handling and transport of semiconductor wafers or reticles
2. 176- Photomicrographic microscopes fitted with equipment specifically designed for the
handling and transport of semiconductor wafers or reticles
3. 177- Parts and accessories  of optical stereoscopic microscopes fitted with equipment
specifically designed for the handling and transport of semiconductor wafers or reticles
4. 178- Parts and accessories of photomicrographic microscopes fitted with equipment
specifically designed for the handling and transport of semiconductor wafers or reticles
5. 179- Electron beam microscopes fitted with equipment specifically designed for the handling
and transport of semiconductor wafers or reticles
6. 180- Parts and accessories of electron beam microscopes fitted with equipment specifically
designed for the handling and transport of  semiconductor wafers or reticles
7. 202 - Multimedia upgrade kits for automatic data processing machines, and units thereof, put
up for retail sale, consisting of, at least, speakers and/or microphones as well as a printed
circuit assembly that enables the ADP machines and units thereof to process audio signals
(sound cards). (847180, 847330 )G/IT/W/6/Rev.2
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V. ITEMS REFERRED TO THIS FORMAL COMMITTEE TO BE ADDRESSED
1. 122- Apparatus for stripping or cleaning semiconductor wafers ( 845691 , 845699, 847989)
2. 129- Parts for machines for sawing monocrystal semiconductor boules into slices, or wafers
into chips (846691, 846610 , 846620 , 846630 )
3. 130- Parts of dicing machines for scribing or scoring semiconductor wafers (846691, 846610 ,
846620 , 846630 )
4. 133- Parts of lasercutters for cutting contacting tracks in semiconductor production by laser
beam (846693, 846610 , 846620 , 846630 )
5. 135- Parts of apparatus for stripping or cleaning semiconductor wafers (846693, 847990,
846620 , 846630 )
6. 139- Automated machines for transport, handling and storage of semiconductor wafers, wafer
cassettes, wafer boxes and other material for semiconductor devices (842839, 842890,
847950, 847989)
7. 153- Parts of apparatus for wet etching, developing, stripping or cleaning semiconductor
wafers and flat panel displays (842490, 846691, 847990, 846620 , 846630 )
8. 154- Parts of automated machines for transport, handling and storage of semiconductor
wafers, wafer cassettes, wafer boxes and other material for semiconductor devices (843139,
847990) (depends on the outcome of # 139)
9. 157- Parts of machines for bending, folding and straightening semiconductor leads (846694,
846610 , 846620 , 846630 )
10. 166- Wafer probers (853690, 903082)11. 169- Parts of apparatus for wet etching, de veloping, stripping or cleaning semiconductor
wafers and flat panel displays (842490, 846691, 847990, 846620 , 846630 )
12. 193- Flat panel display devices (including LCD, Electro Luminescence, Plasma, Vacuum-
Fluorescence and other technologies) for products falling within this agreement, and parts
thereof. (847149, 847160, 847330, 853120, 853180, 853190, 854389, 854390, 854890,901380, 901390)
13. 197- Paging alert devices, and parts thereof ( 852520 , 852790, 852910, 852990)
14. 199- Printed Circuit Assemblies for products falling within this agreement, including such
assemblies for external connections such as cards that conform to the PCMCIA standard.
Such printed circuit assemblies consist of one or more printed circuits of heading 8534 with
one or more active elements assembled thereon, with or without passive elements "Active
elements" means diodes, transistors, and similar semiconductor devices, whether or not
photosensitive, of heading 8541, and integrated circuits and micro assemblies of heading8542. (841990, 842191, 842490, 843139, 846691, 846693, 846694, 847150, 847180, 847310,
847321, 847329, 847330, 847340, 847350, 847790, 847990, 850490, 851440, 851490,
851590, 851750, 851780, 851790, 851890, 852290, 852390, 852491, 852812, 852990,
853190, 853890, 854389, 854390, 854890, 900990, 901090, 901190, 901290, 901390,
901790, 902690, 902790, 903090, 903190)G/IT/W/6/Rev.2
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15. 201-  Proprietary format storage devices including media therefor for automatic data
processing machines, with or without remo vable media and whether magnetic, optical or
other technology, including Bernoulli Box, Syquest, or Zipdrive cartridge storage units
(847170, 852311, 852312, 852313, 852320, 852390, 852431, 852439, 852440, 852491,852499)
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