RESTRICTED  
  
G/MA/TAR/RS/658  
 
16 August 2021  
(21-6215) Page: 1/10 
Committee on Market Access  Original: English  
 
 
 RECTIFICATIONS AND MODIFICATIONS OF SCHEDULES  
SCHEDULE LX - REPUBLIC OF KOREA  
 
The following communication, dated 19 July 2021 , is being circulated at the request of the delegation 
of the Republic of Korea . 
_______________  
Pursuant to the Procedures for the M odification and Rectification of Schedules of Tariff Concessions1, 
the Republic of Korea hereby notifies draft technical r ectifications to  its Schedule LX as set out in 
the attachment s2. 
During the transposition of Schedule LX – Republic of Korea into HS20 12, Korea  has identified  some  
errors and inconsistencies that resulted fr om the introduction of its commitments undertaken 
pursuant to the M inisterial Declaration on the Expansion of Trade in Information Technology Products  
(ITA Expansion )3. 
 
In order to correct these errors, and with the assistance of the WTO Secretariat, Korea has prepared  
this rectification which aims at:  
 
(i) Correcting the bound du ty for tariff line s 5911900000  and 6307909000 , which  were 
erroneously listed as fully duty -free in Korea's ITA  Expansion Schedule certified in document 
WT/Let/1195 .  
 
(ii) Deleting tariff line  8486409000 , which w as erroneously introduced in Korea's Schedule 
during  the HS2007 transposition and subsequently certified in document WT/Let/1099 .  As 
a result , the same  tariff line should also be deleted from Korea's ITA  Expansion Schedule 
certified in document WT/Let/1195 .  
 
 (iii) Correcting the bound dut ies for tariff lines 8529909630, 8529909640 and 8529909650 for 
which the  duty-free concession resulting from the  ITA Expansion and the bound duty of the 
remaining part of the tariff line s, which was not covered under the ITA Expansion,  were 
erroneously inverted in Korea's ITA  Expansion Schedule certified  in document WT/Let/1195 .  
 
 
Detailed explanatory notes are contained in Attachment  1.  The draft proposing the rectification  is 
contained in Attachment 2 .  The se proposed change s do not alter the scope of the concessions 
undertaken by Korea  pursuant to th e ITA Expansion and certified in document WT/Let/ 1195.  
 
_______________  
If no objection is notified to the Secretariat within three months from the date of this document, the 
rectifications and modifications  to Schedule LX – Republic of Korea will be deemed to be approved 
and will be formally certified.  
 
1 Decision of 26  March  1980 (BISD  27S/25) . 
2 In English only.  
3 WT/MIN(15)/25.   
  G/MA/TAR/RS/658  
 
- 2 - ATTACHMENT  1 – EXPLANATORY NOTE  
While  preparing its Harmonized System 20 12 (HS20 12) transposition file , the Republic of Korea has identified  some errors and inconsistencies in its 
Schedule that resulted from the introduction of tariff concessions  undertaken pursuant to the  ITA Expansion , and which were certified in document 
WT/Let/ 1195.  Korea , therefore,  proposes to rectify the relevant discrepancies as follows : 
(i) Correcting the b ound duty f or tariff line s 5911900000  and 6307909000 , which are partially covered under the ITA Expansion  
Korea's c oncession  for tariff line s 5911900000  and 6307909000 were not correctly reflected in its ITA  Expansion  Schedule which was certified 
in WT/Let/ 1195.  The duty -free concession was erroneously assigned to the entire subheading 5911.90  and 6307.90 , which are partially covered 
under the ITA Expansion . The products that are not covered by the ITA  Expansion  should maintain the  bound duty which was recorded  before 
the introduction of the ITA  Expansion commitments , i.e. 13 per cent.   Therefore, t he following c orrection is required in Korea's ITA Expansion  
Schedule to reflect the original commitment s of the products not covered by the ITA  Expansion .  
WT/Let/1 195  Proposed Rectification  
Existing HS 07 
code  Existing Product Description  Existing 
Final  
Bound 
Rate  Proposed 
HS07 code  Proposed Product Description  Proposed 
Final  
Bound Rate  
5911900000  Other  0  5911900000  Other  13 
5911900000  ex Self-adhesive circular polishing 
pads of a kind used for the 
manufacture of semiconductor 
wafers  0  5911900000  ex Self-adhesive circular polishing 
pads of a kind used for the 
manufacture of semiconductor 
wafers  0 
6307909000  Other  0  6307909000  Other  30 
6307909000  ex Self-adhesive circular polishing 
pads of a kind used for the 
manufacture of semiconductor 
wafers  0  6307909000  ex Self-adhesive circular polishing 
pads of a kind used for the 
manufacture of semiconductor 
wafers  0 
 
(ii) Deleting tariff line 8486409000  in Korea's Schedule which was introduced during the HS2007 transposition  
Subheading 8486 40 relates to Machines  and apparatus specified in Note 9 (C) of chapter 84, i.e. machines and apparatus solely or principally 
of a kind used for :  
(i) the manufacture or repair of masks and reticles;  
(ii) assembling semiconductor devices or electronic integrated circuits; and  
(iii) lifting, handling, loading or unloading of boules, wafers, semiconductor devices, electronic  integrated circuits and flat panel displays.    
  G/MA/TAR/RS/658  
 
- 3 -  
Within that subheading, Korea's n ational header s refer to:  
⎯ 84864010 : Machines and apparatus for the manufacture or repair of masks and reticles ; 
⎯ 84864020 : Machines and apparatus for assembling semiconductor devices or electronic integrated circuits ; 
⎯ 84864030 : Machines and apparatus for lifting, handing, loading or unloading  of boules, wafers, semiconductor devices, electronic 
integrated circuits and flat panel displays ; and 
⎯ 84864040:  Microscopes  
 
Tariff line 8486409000 is therefore virtually empty and should be deleted from the Schedule.  Tariff line 8486409000  was erroneously introduced  
in Korea's Schedule during the HS2007 transposition  and certified in document WT/Let/1099 .  As a consequence , this tariff line also appears  in 
Korea's ITA  Expansion Schedule certified in document WT/Let/1195 .  Therefore, the followin g correction is required in both certified document s 
WT/Let/1099 and WT/Let/1195 . 
  
WT/Let/1099 and WT/Let/1195   Proposed Rectification  
Existing HS07 
code  Existing Product Description  Existing 
Final  
Bound 
Rate  Proposed 
HS07 code  Proposed Product Description  Proposed 
Final  
Bound Rate  
848640  Machines and apparatus specified in 
Note 9 (C) to this Chapter    848640  Machines and apparatus specified 
in Note 9 (C) to this Chapter   
84864010  Machines and apparatus for the 
manufacture or repair of masks and 
reticles    84864010  Machines and apparatus for the 
manufacture or repair of masks 
and reticles   
8486401010  Pattern generating apparatus of a 
kind used for producing masks or 
reticles from photoresist coated 
substrates  0  8486401010  Pattern generating apparatus of a 
kind used for producing masks or 
reticles from photoresist coated 
substrates  0 
8486401020  Focused ionic -beam milling 
machines for removing or repairing 
mask and reticle  0  8486401020  Focused ionic -beam milling 
machines for removing or repairing 
mask and reticle  0 
8486401030  Machines of coating and developing 
or stabilizing photoresist  0  8486401030  Machines of coating and 
developing or stabilizing 
photoresist  0 
8486401090  Other  0  8486401090  Other  0 
84864020  Machines and apparatus for 
assembling semiconductor devices 
or electronic integrated circuits    84864020  Machines and apparatus for 
assembling semiconductor devices 
or electronic integrated circuits    
  G/MA/TAR/RS/658  
 
- 4 - WT/Let/1099 and WT/Let/1195   Proposed Rectification  
Existing HS07 
code  Existing Product Description  Existing 
Final  
Bound 
Rate  Proposed 
HS07 code  Proposed Product Description  Proposed 
Final  
Bound Rate  
8486402010  Die attach apparatus, tape 
automated bonders, and wire 
bonders for assembly of 
semiconductors  0  8486402010  Die attach apparatus, tape 
automated bonders, and wire 
bonders for assembly of 
semiconductors  0 
8486402020  Machines for inserting or removing 
semiconductor devices  0  8486402020  Machines for inserting or removing 
semiconductor devices  0 
848640203  Machines for molding  package or 
cutting and molding lead frame    848640203  Machines for molding package or 
cutting and molding lead frame   
8486402031  Encapsulation equipment for 
assembly of semiconductors  0  8486402031  Encapsulation equipment for 
assembly of semiconductors  0 
8486402039  Other  0  8486402039  Other  0 
8486402040  Machines to attach solder ball on 
semiconductor circuit board or 
ceramic board  0  8486402040  Machines to attach solder ball on 
semiconductor circuit board or 
ceramic board  0 
8486402050  Apparatus designed to bond or 
detach wafer on ceramic block in 
polish wafers  0  8486402050  Apparatus designed to bond or 
detach wafer on ceramic block in 
polish wafers  0 
848640206  Machinery for working rubber or 
plastics or for the manufacture of 
products from these material    848640206  Machinery for working rubber or 
plastics or for the manufacture of 
products from these material   
8486402061  Injection -moulding machines  0  8486402061  Injection -moulding machines  0 
8486402062  Vacuum moulding machines and 
other thermoforming machines  0  8486402062  Vacuum moulding machines and 
other thermoforming machines  0 
8486402063  Other machinery for moulding or 
otherwise forming, other than 
extruders, blow moulding machines 
and for moulding or retreading 
pneumatic tyres or for moulding or 
otherwise forming inner tubes  0  8486402063  Other machinery for moulding or 
otherwise forming, other than 
extruders, blow moulding 
machines and for moulding or 
retreading pneumatic tyres or for 
moulding or otherwise forming 
inner tubes  0 
8486402070  Moulds for rubber or plastics of 
injection or compression types  0  8486402070  Moulds for rubber or plastics of 
injection or compression types  0  
  G/MA/TAR/RS/658  
 
- 5 - WT/Let/1099 and WT/Let/1195   Proposed Rectification  
Existing HS07 
code  Existing Product Description  Existing 
Final  
Bound 
Rate  Proposed 
HS07 code  Proposed Product Description  Proposed 
Final  
Bound Rate  
8486402080  Machine for bonding semiconductor 
die, washing wafers, carrier or tube  0  8486402080  Machine for bonding 
semiconductor die, washing 
wafers, carrier or tube  0 
848640209  Other    848640209  Other   
8486402091  Machine -tools (including presses) 
for working metal by bending, 
folding, straightening, flattening, 
for semiconductor leads, whether or 
not numerically controlled  0  8486402091  Machine -tools (including presses) 
for working metal by bending, 
folding, straightening, flattening, 
for semiconductor leads, whether 
or not numerically controlled  0 
8486402092  Machine -tools (including presses) 
for working metal by bending, 
folding, straightening, flattening, 
other than semiconductor leads, 
whether or not numerically 
controlled  0  8486402092  Machine -tools (including presses) 
for working metal by bending, 
folding, straightening, flattening, 
other than semiconductor leads, 
whether or not numerically 
controlled  0 
8486402099  Other  0  8486402099  Other  0 
84864030  Machines and apparatus for lifting, 
handing, loading or unloading of 
boules, wafers, semiconductor 
devices, electronic integrated 
circuits and flat panel displays    84864030  Machines and apparatus for lifting, 
handing, loading or unloading of 
boules, wafers,  semiconductor 
devices, electronic integrated 
circuits and flat panel displays   
8486403010  Automated machines and apparatus 
for transport, handling and storage 
of semiconductor wafers, wafer 
cassettes, boxes and other material 
for semiconductor devices  0  8486403010  Automated machines and 
apparatus for transport, handling 
and storage of semiconductor 
wafers, wafer cassettes, boxes and 
other material for semiconductor 
devices  0 
8486403090  Other  0  8486403090  Other  0 
84864040  Microscopes    84864040  Microscopes   
848640401  Optical microscopes    848640401  Optical microscopes    
  G/MA/TAR/RS/658  
 
- 6 - WT/Let/1099 and WT/Let/1195   Proposed Rectification  
Existing HS07 
code  Existing Product Description  Existing 
Final  
Bound 
Rate  Proposed 
HS07 code  Proposed Product Description  Proposed 
Final  
Bound Rate  
8486404011  Stereoscopic microscopes, fitted 
with equipment specifically 
designed for the handling and 
transport of semiconductor wafers 
or reticles  0  8486404011  Stereoscopic microscopes, fitted 
with equipment specifically 
designed for the handling and 
transport of semiconductor wafers 
or reticles  0 
8486404012  Other microscopes for 
photomicrography, fitted with 
equipment specifically designed for 
the handling and transport of 
semiconductor wafers or reticles  0  8486404012  Other microscopes for 
photomicrography, fitted with 
equipment specifically designed for 
the handling and transport of 
semiconductor wafers or reticles  0 
8486404020  Electron beam microscopes, fitted 
with equipment specifically 
designed for the handling and 
transport of semiconductor wafers 
or reticles  0  8486404020  Electron beam microscopes, fitted 
with equipment specifically 
designed for the handling and 
transport of semiconductor wafers 
or reticles  0 
8486409000  Other  0  8486409000  Other   
 
(iii) Correcting the bound duties for tariff lines 8529909630, 8529909640 and 8529909650 in the ITA  Expansion  Schedule.   
Korea's concessions  for tariff lines 8529909630, 8529909640 and 8529909650  were not correctly reflected in its ITA  Expansion  Schedule which 
was certified in  WT/Let/ 1195.  For each of these tariff lines, there is a duty -free concession for the products covered by the ITA  Expansion  and 
a bound duty for the products not covered by the IT A-Expansion .  The duty -free concession and the bound d uty were inverted by mistake .  The 
products covered by the ITA  Expansion  should be duty -free and those not covered by the ITA  Expansion  should maintain their original  bound 
duty .  Therefore, t he following c orrection is required in Korea's ITA  Expansion  Schedule to reflect its original commitment s:  
WT/Let/1195   Proposed Rectification  
Existing HS 07 
code  Existing Product Description  Existing 
Final  
Bound 
Rate  Proposed HS 07 
code  Proposed Product 
Description  Proposed 
Final  
Bound Rate  
8529909630  Screen for video projector  0  8529909630  Screen for video projector  13  
  G/MA/TAR/RS/658  
 
- 7 - WT/Let/1195   Proposed Rectification  
Existing HS 07 
code  Existing Product Description  Existing 
Final  
Bound 
Rate  Proposed HS 07 
code  Proposed Product 
Description  Proposed 
Final  
Bound Rate  
8529909630  ex --Other, excluding organic light 
emitting diode modules and organic 
light emitting diode panels for the 
apparatus of subheadings 8528.72 
or 8528.73  13  8529909630  ex --Other, excluding organic light 
emitting diode modules and 
organic light emitting diode 
panels for the apparatus of 
subheadings 8528.72 or 
8528.73  0 
8529909640  Other parts for colour  0  8529909640  Other parts for colour  13 
8529909640  --Other, excluding organic light 
emitting diode modules and organic 
light emitting diode panels for the 
apparatus of subheadings 8528.72 
or 8528.73  13  8529909640  --Other, excluding organic light 
emitting diode modules and 
organic light emitting diode 
panels for the apparatus of 
subheadings 8528.72 or 
8528.73  0 
8529909640  -- MCOs  0  8529909640  -- MCOs  0 
8529909650  Other parts for black and white or 
monochrome  0  8529909650  Other parts for black and white 
or monochrome  13 
8529909650  ex --Other, excluding organic light 
emitting diode modules and organic 
light emitting diode panels for the 
apparatus of subheadings 8528.72 
or 8528.73  13  8529909650 ex  --Other, excluding organic light 
emitting diode modules and 
organic light emitting diode 
panels for the apparatus of 
subheadings 8528.72 or 
8528.73  0 
 
*Bold represents the proposed change  
_______________   
  G/MA/TAR/RS/658  
 
- 8 - ATTACHMENT 2 – DRAFT RECTIFICATION  
Schedule  LX - REPUBLIC OF KOREA  
This Schedule is authentic only in the English language  
 
PART I - MOST -FAVOURED NATION TARIFF  
SECTION II – Other Products  
 
Tariff item  
(HS2007)  Description of Products  Base rate  
 of duty  Bound rate  
of duty  Implementation 
period from/to  Initial 
Negotiating 
Right  Other duties 
and charges  
5911  Textile products and articles, for technical uses, specified in Note 7 
of this Chapter.       
5911900000  Other   13   0 
5911900000 ex  Self-adhesive circular polishing pads of a kind used for the 
manufacture of semiconductor wafers   0   0 
6307  Other made up articles, including dress patterns.       
6307909000  Other   30   0 
6307909000 ex  Self-adhesive circular polishing pads of a kind used for the 
manufacture of semiconductor wafers   0   0 
8486  Machines and apparatus of a kind used solely or principally for the 
manufacture of semiconductor boules or wafers, semiconductor 
devices, electronic integrated circuits or flat panel displays; 
machines and apparatus specified in Note 9 (C) to this Chapter; 
parts and accessories       
848640  Machines and apparatus specified in Note 9 (C) to this Chapter       
84864010  Machines and apparatus for the manufacture or repair of masks and 
reticles       
8486401010  Pattern generating apparatus of a kind used for producing masks or 
reticles from photoresist coated substrates   0   0 
8486401020  Focused ionic -beam milling machines for removing or repairing 
mask and reticle   0   0 
8486401030  Machines of coating and developing or stabilizing photoresist   0   0 
8486401090  Other   0   0 
84864020  Machines and apparatus for assembling semiconductor devices or 
electronic integrated circuits       
8486402010  Die attach apparatus, tape automated bonders, and wire bonders for 
assembly of semiconductors   0   0 
8486402020  Machines for inserting or removing semiconductor devices   0   0 
848640203  Machines for molding package or cutting and molding lead frame        
  G/MA/TAR/RS/658  
 
- 9 - Tariff item  
(HS2007)  Description of Products  Base rate  
 of duty  Bound rate  
of duty  Implementation 
period from/to  Initial 
Negotiating 
Right  Other duties 
and charges  
8486402031  Encapsulation equipment for assembly of semiconductors   0   0 
8486402039  Other   0   0 
8486402040  Machines to attach solder ball on semiconductor circuit board or 
ceramic board   0   0 
8486402050  Apparatus designed to bond or datach wafer on ceramic block in 
polish wafers   0   0 
848640206  Machinery for working rubber or plastics or for the manufacture of 
products from these material       
8486402061  Injection -moulding machines   0   0 
8486402062  Vacuum moulding machines and other thermoforming machines   0   0 
8486402063  Other machinery for moulding or otherwise forming, other than 
extruders, blow moulding machines and for moulding or retreading 
pneumatic tyres or for moulding or otherwise forming inner tubes   0   0 
8486402070  Moulds for rubber or plastics of injection or compression types   0   0 
8486402080  Machine for bonding semiconductor die, washing wafers, carrier or 
tube  0   0 
848640209  Other       
8486402091  Machine -tools (including presses) for working metal by bending, 
folding, straightening, flattening, for semiconductor leads, whether 
or not numerically controlled   0   0 
8486402092  Machine -tools (including presses) for working metal by bending, 
folding, straightening, flattening, other than semiconductor leads, 
whether or not numerically controlled   0   0 
8486402099  Other   0   0 
84864030  Machines and apparatus for lifting, handing, loading or unloading 
of boules, wafers,  semiconductor devices, electronic integrated 
circuits and flat panel displays       
8486403010  Automated machines and apparatus for transport, handling and 
storage of semiconductor wafers, wafer cassettes, boxes and other 
material for semiconductor devices   0   0 
8486403090  Other   0   0 
84864040  Microscopes       
848640401  Optical microscopes       
8486404011  Stereoscopic microscopes, fitted with equipment specifically 
designed for the handling and transport of semiconductor wafers or 
reticles   0   0  
  G/MA/TAR/RS/658  
 
- 10 - Tariff item  
(HS2007)  Description of Products  Base rate  
 of duty  Bound rate  
of duty  Implementation 
period from/to  Initial 
Negotiating 
Right  Other duties 
and charges  
8486404012  Other microscopes for photomicrography, fitted with equipment 
specifically designed for the handling and transport of 
semiconductor wafers or reticles   0   0 
8486404020  Electron beam microscopes, fitted with equipment specifically 
designed for the handling and transport of semiconductor wafers or 
reticles   0   0 
8529  Parts suitable for use solely or principally with the apparatus of 
headings 85.25 to 85.28.       
852990  - Other       
85299096  Of television receivers       
8529909630  Screen for video projector   13   0 
8529909630 ex  --Other, excluding organic light emitting diode modules and 
organic light emitting diode panels for the apparatus of 
subheadings 8528.72 or 8528.73   0   0 
8529909640  Other parts for colour   13   0 
8529909640 ex  --Other, excluding organic light emitting diode modules and 
organic light emitting diode panels for the apparatus of 
subheadings 8528.72 or 8528.73   0   0 
8529909640 ex  -- MCOs   0   0 
8529909650  Other parts for black and white or monochrome   13   0 
8529909650 ex  --Other, excluding organic light emitting diode modules and 
organic light emitting diode panels for the apparatus of 
subheadings 8528.72 or 8528.73   0   0 
 
 
__________