WORLD TRADE WT/MIN(96)/16
13December 1996
ORGANIZATION(96-5438)
MINISTERIAL CONFERENCE
Singapore, 9-13December 1996
MINISTERIAL DECLARATION ONTRADE IN
INFORMATION TECHNOLOGY PRODUCTS
SINGAPORE, 13DECEMBER 1996
Ministers,
Representing thefollowing Members oftheWorld Trade Organization (“WTO ”),andStates
orseparate customs territories intheprocess ofacceding totheWTO, which haveagreed inSingapore
ontheexpansion ofworld trade ininformation technology products andwhich account forwellover
80percentofworld trade inthese products ("parties"):
Australia Norway
Canada Separate Customs Territory ofTaiwan,
European Communities Penghu, Kinmen andMatsu
Hong Kong Singapore
Iceland Switzerland1
Indonesia Turkey
Japan United States
Korea
Considering thekeyroleoftrade ininformation technology products inthedevelopment of
information industries andinthedynamic expansion oftheworld economy,
Recognizing thegoals ofraising standards ofliving andexpanding theproduction ofandtrade
ingoods;
Desiring toachieve maximum freedom ofworld trade ininformation technology products;
Desiring toencourage thecontinued technological development oftheinformation technology
industry onaworld-wide basis;
Mindful ofthepositive contribution information technology makes toglobal economic growth
andwelfare;
1Onbehalf ofthecustoms union Switzerland andLiechtenstein.WT/MIN(96)/16
Page2
Having agreed toputintoeffect theresults ofthese negotiations which involve concessions
additionaltothoseincludedintheSchedulesattachedtotheMarrakeshProtocoltotheGeneralAgreement
onTariffs andTrade 1994, and
Recognizing thattheresults ofthese negotiations alsoinvolve some concessions offered in
negotiations leading totheestablishment ofSchedules annexed totheMarrakesh Protocol,
Declare asfollows:
1. Eachparty'straderegime should evolve inamanner thatenhances market access opportunities
forinformation technology products.
2. Pursuant tothemodalities setforthintheAnnex tothisDeclaration, eachparty shallbindand
eliminate customs duties andother duties andcharges ofanykind, within themeaning ofArticle II:1(b)
oftheGeneral Agreement onTariffs andTrade 1994, withrespect tothefollowing:
(a) allproducts classified (orclassifiable) withHarmonized System (1996) (“HS”)headings
listed inAttachment AtotheAnnex tothisDeclaration; and
(b) allproducts specified inAttachment BtotheAnnex tothisDeclaration, whether or
nottheyareincluded inAttachment A;
through equal ratereductions ofcustoms duties beginning in1997andconcluding in2000, recognizing
thatextended staging ofreductions and,before implementation, expansion ofproduct coverage may
benecessary inlimited circumstances.
3. Ministers express satisfaction about thelarge product coverage outlined intheAttachments
totheAnnex tothisDeclaration. They instruct theirrespective officials tomake good faithefforts
tofinalize plurilateral technical discussions inGeneva onthebasis ofthese modalities, andinstruct
these officials tocomplete thiswork by31January 1997, soastoensure theimplementation ofthis
Declaration bythelargest number ofparticipants.
4. Ministers invite theMinisters ofother Members oftheWTO, andStates orseparate customs
territories intheprocess ofacceding totheWTO, toprovide similar instructions totheirrespective
officials, sothattheymayparticipate inthetechnical discussions referred toinparagraph 3above and
participate fullyintheexpansion ofworld trade ininformation technology products.
Annex: Modalities andProduct Coverage
Attachment A:listofHSheadings
Attachment B:listofproductsWT/MIN(96)/16
Page3
ANNEX
Modalities andProduct Coverage
AnyMember oftheWorld Trade Organization, orState orseparate customs territory inthe
process ofacceding totheWTO, mayparticipate intheexpansion ofworld trade ininformation
technology products inaccordance withthefollowing modalities:
1. Each participant shallincorporate themeasures described inparagraph 2oftheDeclaration
intoitsschedule totheGeneral Agreement onTariffs andTrade 1994, and,inaddition, ateither its
owntariff linelevelortheHarmonized System (1996) (“HS”)6-digit levelineither itsofficial tariff
oranyother published versions ofthetariff schedule, whichever isordinarily usedbyimporters and
exporters. Each participant thatisnotaMember oftheWTO shallimplement these measures onan
autonomous basis, pending completion ofitsWTO accession, andshallincorporate these measures
intoitsWTO market access schedule forgoods.
2. Tothisend,asearlyaspossible andnolaterthan1March 1997eachparticipant shallprovide
allotherparticipants adocument containing (a)thedetails concerning howtheappropriate dutytreatment
willbeprovided initsWTO schedule ofconcessions, and(b)alistofthedetailed HSheadings involved
forproducts specified inAttachment B.These documents willbereviewed andapproved onaconsensus
basis andthisreview process shallbecompleted nolaterthan1April 1997. Assoonasthisreview
process hasbeencompleted foranysuchdocument, thatdocument shallbesubmitted asamodification
totheSchedule oftheparticipant concerned, inaccordance withtheDecision of26March 1980 on
Procedures forModification andRectification ofSchedules ofTariff Concessions (BISD 27S/25).
(a) Theconcessions tobeproposed byeachparticipant asmodifications toitsSchedule
shallbindandeliminate allcustoms duties andother duties andcharges ofanykind
oninformation technology products asfollows:
(i) elimination ofsuchcustoms duties shalltakeplace through ratereductions in
equal steps, except asmaybeotherwise agreed bytheparticipants. Unless
otherwise agreed bytheparticipants, eachparticipant shallbindalltariffs on
items listed intheAttachments nolaterthan1July1997, andshallmake the
firstsuchratereduction effective nolaterthan1July1997, thesecond such
ratereduction nolaterthan1January 1998, andthethirdsuchratereduction
nolaterthan1January 1999, andtheelimination ofcustoms duties shallbe
completed effective nolaterthan1January 2000. Theparticipants agree to
encourage autonomous elimination ofcustoms duties priortothesedates. The
reduced rateshould ineachstage berounded offtothefirstdecimal; and
(ii) elimination ofsuchother duties andcharges ofanykind, within themeaning
ofArticle II:1(b) oftheGeneral Agreement, shallbecompleted by1July1997,
except asmaybeotherwise specified intheparticipant ’sdocument provided
toother participants forreview.
(b) Themodifications toitsSchedule tobeproposed byaparticipant inorder toimplement
itsbinding andelimination ofcustoms duties oninformation technology products shall
achieve thisresult:
(i) inthecaseoftheHSheadings listed inAttachment A,bycreating ,where
appropriate ,sub-divisions initsSchedule atthenational tarifflinelevel; andWT/MIN(96)/16
Page4
(ii) inthecaseoftheproducts specified inAttachment B,byattaching anannex
toitsSchedule including allproducts inAttachment B,which istospecify the
detailed HSheadings forthose products ateither thenational tariff linelevel
ortheHS6-digit level.
Eachparticipant shallpromptly modify itsnational tariff schedule toreflect themodifications
ithasproposed, assoonastheyhaveentered intoeffect.
3. Participants shallmeetperiodically under theauspices oftheCouncil onTrade inGoods to
reviewtheproductcoveragespecifiedintheAttachments,withaviewtoagreeing,byconsensus,whether
inthelightoftechnological developments, experience inapplying thetariff concessions, orchanges
totheHSnomenclature, theAttachments should bemodified toincorporate additional products, and
toconsult onnon-tariff barriers totrade ininformation technology products. Suchconsultations shall
bewithout prejudice torights andobligations under theWTO Agreement.
4. Participants shallmeet assoonaspracticable andinanycasenolaterthan1April 1997 to
review thestate ofacceptances received andtoassess theconclusions tobedrawn therefrom.
ParticipantswillimplementtheactionsforeseenintheDeclarationprovidedthatparticipantsrepresenting
approximately 90percentofworld trade2ininformation technology products havebythennotified
theiracceptance, andprovided thatthestaging hasbeenagreed totheparticipants ’satisfaction. In
assessing whether toimplement actions foreseen intheDeclaration, ifthepercentage ofworld trade
represented byparticipants fallssomewhat shortof90percentofworld tradeininformation technology
products, participants maytakeintoaccount theextent oftheparticipation ofStates orseparate customs
territories representing forthemthesubstantial bulkoftheirowntradeinsuchproducts. Atthismeeting
theparticipants willestablish whether these criteria havebeenmet.
5. Participants shallmeetasoften asnecessary andnolaterthan30September 1997toconsider
anydivergence among theminclassifying information technology products, beginning withtheproducts
specified inAttachment B.Participants agree onthecommon objective ofachieving, where appropriate,
acommon classification forthese products within existing HSnomenclature, giving consideration to
interpretations andrulings oftheCustoms Co-operation Council (alsoknown astheWorld Customs
Organization or“WCO ”).Inanyinstance inwhich adivergence inclassification remains, participants
willconsider whether ajointsuggestion could bemade totheWCO withregard toupdating existing
HSnomenclature orresolving divergence ininterpretation oftheHSnomenclature.
6. TheparticipantsunderstandthatArticleXXIIIoftheGeneralAgreementwilladdressnullification
orimpairment ofbenefits accruing directly orindirectly toaWTO Member participant through the
implementation ofthisDeclaration asaresult oftheapplication byanother WTO Member participant
ofanymeasure, whether ornotthatmeasure conflicts withtheprovisions oftheGeneral Agreement.
7. Each participant shallafford sympathetic consideration toanyrequest forconsultation from
anyother participant concerning theundertakings setoutabove. Suchconsultations shallbewithout
prejudice torights andobligations under theWTO Agreement.
8. Participants acting under theauspices oftheCouncil forTrade inGoods shallinform other
Members oftheWTO andStates orseparate customs territories intheprocess ofacceding totheWTO
ofthesemodalities andinitiate consultations withaviewtofacilitate theirparticipation intheexpansion
oftrade ininformation technology products onthebasis oftheDeclaration.
2Thispercentage shall becalculated bytheWTO Secretariat onthebasis ofthemost recent dataavailable
atthetime ofthemeeting.WT/MIN(96)/16
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9. Asusedinthese modalities, theterm"participant" shallmean those Members oftheWTO,
orStatesorseparatecustomsterritoriesintheprocessofaccedingtotheWTO,thatprovidethedocument
described inparagraph 2nolaterthan1March 1997.
10. ThisAnnex shallbeopenforacceptance byallMembers oftheWTO andanyState orany
separate customs territory intheprocess ofacceding totheWTO. Acceptances shallbenotified in
writing totheDirector-General whoshallcommunicate them toallparticipants.WT/MIN(96)/16
Page6
There aretwoattachments totheAnnex.
Attachment AliststheHSheadings orparts thereof tobecovered.
Attachment Blistsspecific products tobecovered byanITAwherever theyareclassified inthe
HS.
Attachment A,Section 1
HS96 HSdescription
3818 Chemical elements doped foruseinelectronics, inform ofdiscs, wafers orsimilar
forms; chemical compounds doped foruseinelectronics
8469 11 Word processing machines
8470 Calculating machines and pocket-size data recording, reproducing and displaying
machines with acalculating function; accounting machines, postage franking machines,
ticket-issuing machines and similar machines, incorporating acalculating devices; cash
registers:
8470 10 Electronic calculators capable ofoperating without anexternal source ofelectric power and
pocket sizedata recording, reproducing anddisplaying machines with calculating functions
8470 21 Other electronic calculating machines incorporating aprinting device
8470 29 Other
8470 30 Other calculating machines
8470 40 Accounting machines
8470 50 Cash registers
8470 90 Other
8471 Automatic data processing machines and units thereof; magnetic oroptical readers,
machines fortranscribing data onto data media incoded form and machines for
processing such data, notelsewhere specified orincluded:
8471 10 Analogue orhybrid automatic data processing machines
8471 30 Portable digital automatic data processing machines, weighing nomore than 10kg,
consisting ofatleast acentral processing unit, akeyboard andadisplay
8471 41 Other digital automatic data processing machines comprising inthesame housing atleast a
central processing unitandaninput andoutput unit, whether ornotcombined
8471 49 Other digital automatic data processing machines presented intheform ofsystems
8471 50 Digital processing units other than those ofsubheading 8471 41and8471 49,whether or
notinthesame housing oneortwoofthefollowing types ofunits :storage units, input
units, output units
8471 60 Input oroutput units, whether ornotcontaining storage units inthesame housing
8471 70 Storage units, including central storage units, optical disk storage units, hard disk drives and
magnetic tape storage units
8471 80 Other units ofautomatic data processing machines
8471 90 Other
ex 8472 90 Automatic teller machines
8473 21 Parts andaccessories ofthemachines ofheading No8470 oftheelectronic calculating
machines ofsubheading 8470 10,8470 21and8470 29
8473 29 Parts andaccessories ofthemachines ofheading No8470 other than theelectronic
calculating machines ofsubheading 8470 10,8470 21and8470 29
8473 30 Parts andaccessories ofthemachines ofheading No8471WT/MIN(96)/16
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8473 50 Parts andaccessories equally suitable forusewith machines oftwoormore ofthe
headings Nos. 8469 to8472
ex 8504 40 Static converters forautomatic data processing machines andunits thereof, and
telecommunication apparatus
ex 8504 50 Other inductors forpower supplies forautomatic data processing machines andunits
thereof, andtelecommunication apparatus
8517 Electrical apparatus forlinetelephony orlinetelegraphy, including linetelephone sets
with cordless handsets and telecommunication apparatus for carrier-current line
systems orfordigital linesystems; videophones:
8517 11 Line telephone setswith cordless handsets
8517 19 Other telephone setsandvideophones
8517 21 Facsimile machines
8517 22 Teleprinters
8517 30 Telephonic ortelegraphic switching apparatus
8517 50 Other apparatus, forcarrier-current linesystems orfordigital linesystems
8517 80 Other apparatus including entry-phone systems
8517 90 Parts ofapparatus ofheading 8517
ex 8518 10 Microphones having afrequency range of300Hzto3,4KHz with adiameter ofnot
exceeding 10mm andaheight notexceeding 3mm, fortelecommunication use
ex 8518 30 Line telephone handsets
ex 8518 29 Loudspeakers, without housing, having afrequency range of300Hzto3,4KHz with a
diameter ofnotexceeding 50mm, fortelecommunication use
8520 20 Telephone answering machines
8523 11 Magnetic tapes ofawidth notexceeding 4mm
8523 12 Magnetic tapes ofawidth exceeding 4mm butnotexceeding 6,5mm
8523 13 Magnetic tapes ofawidth exceeding 6,5mm
8523 20 Magnetic discs
8523 90 Other
8524 31 Discs forlaser reading systems forreproducing phenomena other than sound orimage
ex 8524 39 Other :
-forreproducing representations ofinstructions, data, sound, andimage, recorded in
amachine readable binary form, andcapable ofbeing manipulated orproviding
interactivity toauser, bymeans ofanautomatic data processing machine
8524 40 Magnetic tapes forreproducing phenomena other than sound orimage
8524 91 Media forreproducing phenomena other than sound orimage
ex 8424 99 Other :
-forreproducing representations ofinstructions, data, sound, andimage, recorded in
amachine readable binary form, andcapable ofbeing manipulated orproviding
interactivity toauser, bymeans ofanautomatic data processing machine
ex 8525 10 Transmission apparatus other than apparatus forradio-broadcasting ortelevision
8525 20 Transmission apparatus incorporating reception apparatus
ex 8525 40 Digital stillimage video cameras
ex 8527 90 Portable receivers forcalling, alerting orpaging
ex 8529 10 Aerials orantennae ofakind used with apparatus forradio-telephony and
radio-telegraphyWT/MIN(96)/16
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ex 8529 90 Parts of:
transmission apparatus other than apparatus forradio-broadcasting ortelevision
transmission apparatus incorporating reception apparatus
digital stillimage video cameras,
portable receivers forcalling, alerting orpaging
8531 20 Indicator panels incorporating liquid crystal devices (LCD) orlight emitting diodes
(LED)
ex 8531 90 Parts ofapparatus ofsubheading 8531 20
8532 Electrical capacitors, fixed, variable oradjustable (pre-set):
8532 10 Fixed capacitors designed forusein50/60 Hzcircuits andhaving areactive power handling
capacity ofnotlessthan 0,5kvar (power capacitors)
8532 21 Tantalum fixed capacitors
8532 22 Aluminium electrolytic fixed capacitors
8532 23 Ceramic dielectric, single layer fixed capacitors
8532 24 Ceramic dielectric, multilayer fixed capacitors
8532 25 Dielectric fixed capacitors ofpaper orplastics
8532 29 Other fixed capacitors
8532 30 Variable oradjustable (pre-set) capacitors
8532 90 Parts
8533 Electrical resistors (including rheostats and potentiometers), other than heating
resistors:
8533 10 Fixed carbon resistors, composition orfilm types
8533 21 Other fixed resistors forapower handling capacity notexceeding 20W
8533 29 Other fixed resistors forapower handling capacity of20Wormore
8533 31 Wirewound variable resistors, including rheostats andpotentiometers, forapower handling
capacity notexceeding 20W
8533 39 Wirewound variable resistors, including rheostats andpotentiometers, forapower handling
capacity of20Wormore
8533 40 Other variable resistors, including rheostats andpotentiometers
8533 90 Parts
8534 Printed circuits
ex 8536 50 Electronic ACswitches consisting ofoptically coupled input andoutput circuits
(Insulated thyristor ACswitches)
ex 8536 50 Electronic switches, including temperature protected electronic switches, consisting ofa
transistor andalogic chip (chip-on-chip technology) foravoltage notexceeding 1000
volts
ex 8536 50 Electromechanical snap-action switches foracurrent notexceeding 11amps
ex 8536 69 Plugs andsockets forco-axial cables andprinted circuits
ex 8536 90 Connection andcontact elements forwires andcables
8541 Diodes, transistors and similar semiconductor devices; photosensitive semiconductor
devices, including photovoltaic cells whether ornotassembled inmodules ormade up
into panels; light-emitting diodes; mounted piezo-electric crystals:
8541 10 Diodes, other than photosensitive orlight-emitting diodes
8541 21 Transistors, other than photosensitive transistors, with adissipation rateoflessthan 1W
8541 29 Transistors, other than photosensitive transistors, with adissipation rateof1WormoreWT/MIN(96)/16
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8541 30 Thyristors, diacs andtriacs, other than photosensitive devices
8541 40 Photosensitive semiconductor devices, including photovoltaic cells whether ornotassembled
inmodules ormade upintopanels; light emitting diodes
8541 50 Other semiconductor devices
8541 60 Mounted piezo-electric crystals
8541 90 Parts
8542 Electronic integrated circuits andmicroassemblies
8542 12 Cards incorporating anelectronic integrated circuit ('smart 'cards)
8542 13 Metal oxide semiconductors (MOS technology)
8542 14 Circuits obtained bybipolar technology
8542 19 Other monolithic digital integrated circuits, including circuits obtained byacombination of
bipolar andMOS technologies (BIMOS technology)
8542 30 Other monolithic integrated circuits
8542 40 Hybrid integrated circuits
8542 50 Electronic microassemblies
8542 90 Part
8543 81 Proximity cards andtags
ex 8543 89 Electrical machines with translation ordictionary functions
ex 8544 41 Other electric conductors, foravoltage notexceeding 80V,fitted with connectors, ofa
kind used fortelecommunications
ex 8544 49 Other electric conductors, foravoltage notexceeding 80V,notfitted with connectors,
ofakind used fortelecommunications
ex 8544 51 Other electric conductors, foravoltage exceeding 80Vbutnotexceeding 1000 V,
fitted with connectors, ofakind used fortelecommunications
8544 70 Optical fibre cables
9009 11 Electrostatic photocopying apparatus, operating byreproducing theoriginal image
directly onto thecopy (direct process)]
9009 21 Other photocopying apparatus, incorporating anoptical system
9009 90 Parts andaccessories
9026 Instruments andapparatus formeasuring orchecking theflow, level, pressure orother
variables ofliquids orgases (for example, flow meters, level gauges, manometers, heat
meters), excluding instruments andapparatus ofheading No9014, 9015, 9028 or9032:
9026 10 Instruments formeasuring orchecking theflow orlevel ofliquids
9026 20 Instruments andapparatus formeasuring orchecking pressure
9026 80 Other instruments andapparatus formeasuring orchecking ofheading 9026
9026 90 Parts andaccessories ofinstruments andapparatus ofheading 9026
9027 20 Chromatographs andelectrophoresis instruments
9027 30 Spectrometers, spectrophotometers andspectrographs using optical radiations (UV,
visible, IR)
9027 50 Other instruments andapparatus using optical radiations (UV, visible, IR)ofheading
No9027
9027 80 Other instruments andapparatus ofheading No9027 (other than those ofheading No
9027 10)
ex 9027 90 Parts andaccessories ofproducts ofheading 9027, other than forgasorsmoke
analysis apparatus andmicrotomesWT/MIN(96)/16
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9030 40 Instruments andapparatus formeasuring andchecking, specially designed for
telecommunications (forexample, cross-talk meters, gain measuring instruments,
distorsion factor meters, psophometers)WT/MIN(96)/16
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Attachment A,Section 2
Semiconductor manufacturing andtesting equipment andparts thereof
HSCode Description Comments
ex 7017 10 Quartz reactor tubes andholders designed forinsertion intodiffusion and
oxidation furnaces forproduction ofsemiconductor wafersForAttachment B
ex 8419 89 Chemical vapor deposition apparatus forsemiconductor production ForAttachment B
ex 8419 90 Parts ofchemical vapor deposition apparatus forsemiconductor
productionForAttachment B
ex 8421 19 Spin dryers forsemiconductor wafer processing
ex 8421 91 Parts ofspin dryers forsemiconductor wafer processing
ex 8424 89 Deflash machines forcleaning andremoving contaminants from the
metal leads ofsemiconductor packages prior totheelectroplating process
ex 8424 89 Spraying appliances foretching, stripping orcleaning semiconductor
wafers
ex 8424 90 Parts ofspraying appliances foretching, stripping orcleaning
semiconductor wafers
ex 8456 10 Machines forworking anymaterial byremoval ofmaterial, bylaser or
other light orphoto beam intheproduction ofsemiconductor wafers
ex 8456 91 Apparatus forstripping orcleaning semiconductor wafers ForAttachment B
8456 91 Machines fordry-etching patterns onsemiconductor materials
ex 8456 99 Focused ionbeam milling machines toproduce orrepair masks and
reticles forpatterns onsemiconductor devices
ex 8456 99 Lasercutters forcutting contacting tracks insemiconductor production by
laser beamForAttachment B
ex 8464 10 Machines forsawing monocrystal semiconductor boules intoslices, or
wafers intochipsForAttachment B
ex 8464 20 Grinding, polishing andlapping machines forprocessing ofsemiconductor
wafers
ex 8464 90 Dicing machines forscribing orscoring semiconductor wafers
ex 8466 91 Parts formachines forsawing monocrystal semiconductor boules into
slices, orwafers intochipsForAttachment B
ex 8466 91 Parts ofdicing machines forscribing orscoring semiconductor wafers ForAttachment B
ex 8466 91 Parts ofgrinding, polishing andlapping machines forprocessing of
semiconductor wafers
ex 8466 93 Parts offocused ionbeam milling machines toproduce orrepair masks
andreticles forpatterns onsemiconductor devices
ex 8466 93 Parts oflasercutters forcutting contacting tracks insemiconductor
production bylaser beamForAttachment B
ex 8466 93 Parts ofmachines forworking anymaterial byremoval ofmaterial, by
laser orother light orphoto beam intheproduction ofsemiconductor
wafers
ex 8456 93 Parts ofapparatus forstripping orcleaning semiconductor wafers ForAttachment B
ex 8466 93 Parts ofmachines fordry-etching patterns onsemiconductor materials
ex 8477 10 Encapsulation equipment forassembly ofsemiconductors ForAttachment B
ex 8477 90 Parts ofencapsulation equipment ForAttachment BWT/MIN(96)/16
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ex 8479 50 Automated machines fortransport, handling andstorage ofsemiconductor
wafers, wafer cassettes, wafer boxes andother material forsemiconductor
devicesForAttachment B
ex 8479 89 Apparatus forgrowing orpulling monocrystal semiconductor boules
ex 8479 89 Apparatus forphysical deposition bysputtering onsemiconductor wafers ForAttachment B
ex 8479 89 Apparatus forwetetching, developing, stripping orcleaning
semiconductor wafers andflatpanel displaysForAttachment B
ex 8479 89 Dieattach apparatus, tape automated bonders, andwire bonders for
assembly ofsemiconductorsForAttachment B
ex 8479 89 Encapsulation equipment forassembly ofsemiconductors ForAttachment B
ex 8479 89 Epitaxial deposition machines forsemiconductor wafers
ex 8479 89 Machines forbending, folding andstraightening semiconductor leads ForAttachment B
ex 8479 89 Physical deposition apparatus forforsemiconductor production ForAttachment B
ex 8479 89 Spinners forcoating photographic emulsions onsemiconductor wafers ForAttachment B
ex 8479 90 Partofapparatus forphysical deposition bysputtering onsemiconductor
wafersForAttachment B
ex 8479 90 Parts fordieattach apparatus, tape automated bonders, andwire bonders
forassembly ofsemiconductorsForAttachment B
ex 8479 90 Parts forspinners forcoating photographic emulsions onsemiconductor
wafersForAttachment B
ex 8479 90 Parts ofapparatus forgrowing orpulling monocrystal semiconductor
boules
ex 8479 90 Parts ofapparatus forwetetching, developing, stripping orcleaning
semiconductor wafers andflatpanel displaysForAttachment B
ex 8479 90 Parts ofautomated machines fortransport, handling andstorage of
semiconductor wafers, wafer cassettes, wafer boxes andother material for
semiconductor devicesForAttachment B
ex 8479 90 Parts ofencapsulation equipment forassembly ofsemiconductors ForAttachment B
ex 8479 90 Parts ofepitaxial deposition machines forsemiconductor wafers
ex 8479 90 Parts ofmachines forbending, folding andstraightening semiconductor
leadsForAttachment B
ex 8479 90 Parts ofphysical deposition apparatus forforsemiconductor production ForAttachment B
ex 8480 71 Injection andcompression moulds forthemanufacture ofsemiconductor
devices
ex 8514 10 Resistance heated furnaces andovens forthemanufacture of
semiconductor devices onsemiconductor wafers
ex 8514 20 Inductance ordielectric furnaces andovens forthemanufacture of
semiconductor devices onsemiconductors wafers
ex 8514 30 Apparatus forrapid heating ofsemiconductor wafers ForAttachment B
ex 8514 30 Parts ofresistance heated furnaces andovens forthemanufacture of
semiconductor devices onsemiconductor wafers
ex 8514 90 Parts ofapparatus forrapid heating ofwafers ForAttachment B
ex 8514 90 Parts offurnaces andovens ofHeadings No8514 10toNo8514 30
ex 8536 90 Wafer probers ForAttachment B
8543 11 Ionimplanters fordoping semiconductor materials
ex 8543 30 Apparatus forwetetching, developing, stripping orcleaning
semiconductor wafers andflatpanel displaysForAttachment BWT/MIN(96)/16
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ex 8543 90 Parts ofapparatus forwetetching, developing, stripping orcleaning
semiconductor wafers andflatpanel displaysForAttachment B
ex 8543 90 Parts ofionimplanters fordoping semiconductor materials
9010 41to
9010 49Apparatus forprojection, drawing orplating circuit patterns onsensitized
semiconductor materials andflatpanel displays
ex 9010 90 Parts andaccessories oftheapparatus ofHeadings No9010 41to9010 49
ex 9011 10 Optical stereoscopic microscopes fitted with equipment specifically
designed forthehandling andtransport ofsemiconductor wafers or
reticlesForAttachment B
ex 9011 20 Photomicrographic microscopes fitted with equipment specifically
designed forthehandling andtransport ofsemiconductor wafers or
reticlesForAttachment B
ex 9011 90 Parts andaccessories ofoptical stereoscopic microscopes fitted with
equipment specifically designed forthehandling andtransport of
semiconductor wafers orreticlesForAttachment B
ex 9011 90 Parts andaccessories ofphotomicrographic microscopes fitted with
equipment specifically designed forthehandling andtransport of
semiconductor wafers orreticlesForAttachment B
ex 9012 10 Electron beam microscopes fitted with equipment specifically designed for
thehandling andtransport ofsemiconductor wafers orreticlesForAttachment B
ex 9012 90 Parts andaccessories ofelectron beam microscopes fitted with equipment
specifically designed forthehandling andtransport ofsemiconductor
wafers orreticlesForAttachment B
ex 9017 20 Pattern generating apparatus ofakind used forproducing masks or
reticles from photoresist coated substratesForAttachment B
ex 9017 90 Parts andaccessories forpattern generating apparatus ofakind used for
producing masks orreticles from photoresist coated substratesForAttachment B
ex 9017 90 Parts ofsuch pattern generating apparatus ForAttachment B
9030 82 Instruments andapparatus formeasuring orchecking semiconductor
wafers ordevices
ex 9030 90 Parts andaccessories ofinstruments andapparatus formeasuring or
checking semiconductor wafers ordevices
ex 9030 90 Parts ofinstruments andappliances formeasuring orchecking
semiconductor wafers ordevices
9031 41 Optical instruments andappliances forinspecting semiconductor wafers
ordevices orforinspecting masks, photomasks orreticles used in
manufacturing semiconductor devices
ex 9031 49 Optical instruments andappliances formeasuring surface particulate
contamination onsemiconductor wafers
ex 9031 90 Parts andaccessories ofoptical instruments andappliances forinspecting
semiconductor wafers ordevices orforinspecting masks, photomasks or
reticles used inmanufacturing semiconductor devices
ex 9031 90 Parts andaccessories ofoptical instruments andappliances formeasuring
surface particulate contamination onsemiconductor wafersWT/MIN(96)/16
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Attachment B
Positive listofspecific products tobecovered bythisagreement wherever they are
classified intheHS.
Where parts arespecified, they aretobecovered inaccordance with HSNotes 2(b) to
Section XVI andChapter 90,respectively.
Computers: automatic dataprocessing machines capable of1)storing theprocessing program orprograms andat
least thedataimmediately necessary fortheexecution oftheprogram; 2)being freely programmed inaccordance
withtherequirements oftheuser; 3)performing arithmetical computations specified bytheuser; and4)executing,
without human intervention, aprocessing program which requires them tomodify their execution, bylogical
decision during theprocessing run.
Theagreement covers such automatic dataprocessing machines whether ornottheyareabletoreceive andprocess
withtheassistance ofcentral processing unittelephony signals, television signals, orother analogue ordigitally
processed audio orvideo signals. Machines performing aspecific function other thandataprocessing, or
incorporating orworking inconjunction withanautomatic dataprocessing machine, andnototherwise specified
under Attachment AorB,arenotcovered bythisagreement.
Electric amplifiers when used asrepeaters inlinetelephony products falling within thisagreement, andparts
thereof
Flat panel displays (including LCD, Electro Luminescence, Plasma andother technologies) forproducts falling
within thisagreement, andparts thereof.
Network equipment: Local Area Network (LAN) andWide Area Network (WAN) apparatus, including those
products dedicated forusesolely orprincipally topermit theinterconnection ofautomatic data processing machines
andunits thereof foranetwork thatisused primarily forthesharing ofresources such ascentral processor units,
data storage devices andinput oroutput units -including adapters, hubs, in-line repeaters, converters, concentrators,
bridges androuters, andprinted circuit assemblies forphysical incorporation intoautomatic data processing
machines andunits thereof.
Monitors :display units ofautomatic dataprocessing machines withacathode raytubewithadotscreen pitch
smaller than0,4mmnotcapable ofreceiving andprocessing television signals orother analogue ordigitally
processed audio orvideo signals without assistance ofacentral processing unitofacomputer asdefined inthis
agreement.
Theagreement does not,therefore, cover televisions, including high definition televisions.3
Optical discstorage units, forautomatic dataprocessing machines (including CDdrives andDVD-drives), whether
ornothaving thecapability ofwriting/recording aswell asreading, whether ornotintheir own housings.
Paging alert devices ,andparts thereof .
Plotters whether input oroutput units ofHSheading No8471 ordrawing ordrafting machines ofHSheading No
9017.
Printed Circuit Assemblies forproducts falling within thisagreement, including such assemblies forexternal
connections such ascards thatconform tothePCMCIA standard.
Such printed circuit assemblies consist ofoneormore printed circuits ofheading 8534 with oneormore active
elements assembled thereon, with orwithout passive elements "Active elements" means diodes, transistors, and
similar semiconductor devices, whether ornotphotosensitive, ofheading 8541, andintegrated circuits andmicro
assemblies ofheading 8542.
Projection type flatpanel display units used with automatic data processing machines which candisplay digital
information generated bythecentral processing unit.
3Participants willconduct areview ofthisproduct description inJanuary 1999 under theconsultation
provisions ofparagraph 3oftheDeclarationWT/MIN(96)/16
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Proprietary format storage devices including media therefor forautomatic data processing machines, with or
without removable media andwhether magnetic, optical orother technology, including Bernoulli Box, Syquest, or
Zipdrive cartridge storage units.
Multimedia upgrade kitsforautomatic data processing machines, andunits thereof, putupforretail sale,
consisting of,atleast, speakers and/or microphones aswell asaprinted circuit assembly thatenables theADP
machines andunits thereof toprocess audio signals (sound cards).
Settopboxes which have acommunication function :amicroprocessor-based device incorporating amodem for
gaining access totheInternet, andhaving afunction ofinteractive information exchange