RESTRICTED  WORLD TRADE  
ORGANIZATION  WT/ACC/SPEC/LTU/15/Add.1 
22 November 2000 
 (00-4978) 
Working Party on the 
Accession of Lithuania Original:   English 
 
 
 
DRAFT REPORT OF THE WORKING PARTY ON 
THE ACCESSION OF LITHUANIA 
TO THE WORLD TRADE ORGANIZATION 
 
Draft Schedule CL – Lithuania  
 
Addendum  
 
Table of Concordance of HS Nomenclatures 
 
 
 The Government of Lithuania has submitted the following explanatory note and table of concordance with the request the it be circ ulated to Members of the Working Party.
1 
 
_______________ 
 
 INTRODUCTION   For the purposes of the verification of th e commitments on goods made in process of 
Lithuania’s accession to the WTO, taking into acc ount the changes in the HS nomenclature, the 
Mission of Lithuania presented the table of concor dance between the HS nomenclature used in the 
Schedule CL - Lithuania (document WT/ACC/SPEC/ LTU/15), the replacements of it which are in 
force.   During the process of accession HS 96 was used and the commitments were taken using this 
nomenclature. The changes to it were made in 1997,  1998, 1999 and 2000.  This table of concordance 
is prepared for the purposes of consistency and upon  the request of some WTO members as well as 
the WTO Secretariat, seeking to identify these ch anges and the commitments to be implemented, 
using the HS nomenclature in force in Lithuania.    
 The table of concordance is divided into tw o parallel tables: 1) HS used in the document 
WT/ACC/SPEC/LTU/15 and the commitments thereof; 2) HS in force and the commitments to be implemented using this nomenclatu re.  Each section within the horizontal borders reflects the single 
replacement in the HS nomenclature or the single pa ckage of the replacements.  Only underlined tariff 
lines, subheadings and HS codes are subject to ch anges in the HS nomenclature.  Other headings, 
subheadings and tariff lines that are not underlin ed are used only for consistency reasons.  
                                                     
 
1In English only.  
 WT/ACC/SPEC/LTU/15/Add.1 
Page 2 HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
0603 Cut flowers and flower buds of a kind  0603 Cut flowers and flower buds of a kind   
 suitable for bouquets or for ornamental  suitable for bouquets or for ornamental  
 purposes, fresh, dried, dyed, bleached,  purposes, fresh, dried, dyed, bleached,  
 impregnated or otherwise prepared : impregnated or otherwise prepared :  
0603.10 - Fresh  0603.10 - Fresh :  
 -- From 1 June to 31 October :   
0603.10.11  --- Roses.  50 EC 0603.10.10  -- Roses :   
0603.10.13  --- Carnations.  40 EC 0603.10.10.1  --- From 1 June to 31 October.  50 EC 
0603.10.15  --- Orchids.  40 EC 0603.10.10.9  --- From 1 November to 31 May.  40 - 30 2004 EC 
0603.10.21  --- Gladioli.  30 EC 0603.10.20  -- Carnations :   
0603.10.25  --- Chrysanthemums.  30 EC 0603.10.20.1  --- From 1 June to 31 October.  40 EC 
0603.10.29  --- Other.  20 EC 0603.10.20.9  --- From 1 November to 31 May.  30 - 20 2004 EC 
 -- From 1 November to 31 May :  0603.10.30  -- Orchids :   
0603.10.51  --- Roses.  40 - 30 2004 EC 0603.10.30.1  --- From 1 June to 31 October.  40 EC 
0603.10.53  --- Carnations.  30 - 20 2004 EC 0603.10.30.9  --- From 1 November to 31 May.  30 EC 
0603.10.55  --- Orchids.  30 EC 0603.10.40  -- Gladioli :   
0603.10.61  --- Gladioli.  20 EC 0603.10.40.1  --- From 1 June to 31 October.  30 EC 
0603.10.65  --- Chrysanthemums.  30 EC 0603.10.40.9  --- From 1 November to 31 May.  20 EC 
0603.10.69  --- Other.  20 - 15 2004 EC 0603.10.50  -- Chrysanthemums.  30 EC 
 0603.10.80  -- Other.  20 EC 
 ex0603.10.80  From 1 November to 31 May.  20 - 15 2004 EC 
0603.90 - Other. 10 EC 0603.90 - Other. 10 EC 
0702.00  Tomatoes, fresh or chilled 070 2.00  Tomatoes, fresh or chilled:  
0702.00.15  - From 1 January to 31 March. 25 0702.00.00.1  - From 1 January to 31 March. 25  
0702.00.20  - From 1 to 30 April. 50 0702.00.00.2  - From 1 to 30 April. 50  
0702.00.25  - From 1 to 14 May. 50 0702.00.00.3  - From 1 to 14 May. 50  
0702.00.30  - From 15 to 31 May. 50 0702.00.00.4  - From 15 to 31 May. 50  
0702.00.35  - From 1 June to 30 September. 50 0702.00.00.5  - From 1 June to 30 September. 50  
0702.00.40  - From 1 to 31 October. 50 0702.00.00.6  - From 1 to 31 October. 50  
0702.00.45  - From 1 November to 20 December. 25 0702.00.00.7  - From 1 November to 20 December. 25  
0702.00.50  - From 21 to 31 December. 25 0702.00.00.8  - From 21 to 31 December. 25  
0707.00  Cucumbers and gherkins, fresh or 070 7.00  Cucumbers and gherkins, fresh or  
 chilled chilled  
 - Cucumbers : 0707.00.05 - Cucumbers :  
0707.00.10  -- From 1 January to end February. 30 0707.00.05.1  -- From 1 January to end February. 30   
  WT/ACC/SPEC/LTU/15/Add.1
 Page 3HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
0707.00.15  -- From 1 March to 30 April. 30 0707.00.05.2  -- From 1 March to 30 April. 30  
0707.00.20  -- From 1 to 15 May. 30 0707.00.05.3  -- From 1 to 15 May. 30  
0707.00.25  -- From 16 May to 30 September. 50 0707.00.05.4  -- From 16 May to 30 September. 50  
0707.00.30  -- From 1 to 31 October. 50 0707.00.05.5  -- From 1 to 31 October. 50  
0707.00.35  -- From 1 to 10 November. 30 0707.00.05.6  -- From 1 to 10 November. 30  
0707.00.40  -- From 11 November to 31 December. 30 0707.00.05.7  -- From 11 November to 31 December. 30  
0806 Grapes, fresh or dried : 0806 Grapes, fresh or dried :  
0806.10 - Fresh 0806.10 - Fresh  
 -- Table grapes : 0806.10.10  -- Table grapes. 10 US 
 --- From 1 January to 14 July :   
0806.10.21  ---- Of the variety Emperor (Vitis vinifera  10  
 cv.) from 1 to 31 January.   
0806.10.29  ---- Other  10 US  
0806.10.30  --- From 15 to 20 July.  10 US  
0806.10.40  --- From 21 July to 31 October.  10 US  
0806.10.50  --- From 1 to 20 November.  10 US  
 --- From 21 November to 31 December : ex0806.10.10  From 21 November to 31 December 5  
0806.10.61  ---- Of the variety Emperor (Vitis vinifera  5  
 cv.) from 1 to 31 December.   
0806.10.69  ---- Other.  5  
 -- Other : 0806.10.90  -- Other. 5  
0806.10.93  --- From 1 January to 14 July.  5  
0806.10.95  --- From 15 July to 31 October.  5  
0806.10.97  --- From 1 November to 31 December.  5  
0808  Apples, pears and quinces, fresh : 0808  Apples, pears and quinces, fresh :  
0808.10  - Apples : 0808.10  - Apples :  
0808.10.10 -- Cider apples, in bulk, from 16  20 NZ 0808.10.10 -- Cider apples, in bulk, from 16  20 NZ 
 September to 15 December. September to 15 December.  
 -- Other : -- Other :  
 --- From 1 January to 31 March :  0808.10.20  --- Of the variety Golden Delicious:   
0808.10.51  ---- Of the variety Golden Delicious.  20 NZ 0808.10.20.1  ---- From 1 January to 31 March.  20 NZ 
0808.10.53  ---- Of the variety Granny Smith.  20 NZ 0808.10.20.2  ---- From 1 April to 30 June.  0 NZ 
0808.10.59  ---- Other.  20 NZ 0808.10.20.3  ---- From 1 to 31 July.  0 NZ 
 --- From 1 April to 30 June :  0808.10.20.4  ---- From 1 August to 31 December.  20 NZ 
0808.10.61  ---- Of the variety Golden Delicious.  0 NZ 0808.10.50  --- Of the variety Granny Smith:    
 WT/ACC/SPEC/LTU/15/Add.1 
Page 4 HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
0808.10.63  ---- Of the variety Granny Smith.  0 NZ 0808.10.50.1  ---- From 1 January to 31 March.  20 NZ 
0808.10.69  ---- Other.  0 NZ 0808.10.50.2  ---- From 1 April to 30 June.  0 NZ 
 --- From 1 to 31 July :  0808.10.50.3  ---- From 1 to 31 July.  0 NZ 
0808.10.71  ---- Of the variety Golden Delicious.  0 NZ 0808.10.50.4  ---- From 1 August to 31 December.  20 NZ 
0808.10.73  ---- Of the variety Granny Smith.  0 NZ 0808.10.90  --- Other:   
0808.10.79  ---- Other.  0 NZ 0808.10.90.1  ---- From 1 January to 31 March.  20 NZ 
 --- From 1 August to 31 December :  0808.10.90.2  ---- From 1 April to 30 June.  0 NZ 
0808.10.92  ---- Of the variety Golden Delicious.  20 NZ 0808.10.90.3  ---- From 1 to 31 July.  0 NZ 
0808.10.94  ---- Of the variety Granny Smith.  20 NZ 0808.10.90.4  ---- From 1 August to 31 December.  20 NZ 
0808.10.98  ---- Other.  20 NZ  
0809.20  - Cherries  0809.20  - Cherries   
 -- From 1 January to 30 April :  0809.20.05  -- Sour cherries (Prunus cerasus):   
0809.20.11  --- Sour cherries (Prunus cerasus).  10 0809.20.05.8  --- From 1 May to 15 July.  15  
0809.20.19  --- Other.  10 0809.20.05.9  --- From 16 July to 30 April.  10  
 -- From 1 to 20 May :  0809.20.95  -- Other :   
0809.20.21  --- Sour cherries (Prunus cerasus).  15 0809.20.95.8  --- From 1 May to 15 July.  15  
0809.20.29  --- Other.  15 0809.20.95.9  --- From 16 July to 30 April.  10  
 -- From 21 to 31 May :   
0809.20.31  --- Sour cherries (Prunus cerasus).  15  
0809.20.39  --- Other.  15  
 -- From 1 June to 15 July :   
0809.20.41  --- Sour cherries (Prunus cerasus).  15  
0809.20.49  --- Other.  15  
 -- From 16 to 31 July :   
0809.20.51  --- Sour cherries (Prunus cerasus).  10  
0809.20.59  --- Other.  10  
 -- From 1 to 10 August :   
0809.20.61  --- Sour cherries (Prunus cerasus).  10  
0809.20.69  --- Other.  10  
 -- From 11 August to 31 December :   
0809.20.71  --- Sour cherries (Prunus cerasus).  10  
0809.20.79  --- Other.  10  
0810.10 - Strawberries : 0810.10 - Strawberries :  
0810.10.05  -- From 1 January to 30 April  10 0810.10.00.1  -- From 1 May to 31 July.  15  
0810.10.10  -- From 1 May to 31 July.  15 0810.10.00.9  -- From 1 August to 30 April  10   
  WT/ACC/SPEC/LTU/15/Add.1
 Page 5HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
0810.10.80  -- From 1 August to 31 December  10  
2710 .00 Petroleum oils and oils obtained from  271 0 .00 Petroleum oils and oils obtained from   
 from bituminous minerals, other than  from bituminous minerals, other than   
 crude; preparations not elsewhere  crude; preparations not elsewhere   
 specified or included, containing by  specified or included, containing by   
 weight 70 % or more of petroleum oils  weight 70 % or more of petroleum oils   
 or of oils obtained from bituminous  or of oils obtained from bituminous   
 minerals, these oils being the basic  minerals, these oils being the basic   
 constituents of the preparations: constituents of the preparations:  
 - Heavy oils : - Heavy oils :  
 -- Lubricating oils; other oils : -- Lubricating oils; other oils :  
 -- Lubricating oils; other oils : -- Lubricating oils; other oils :  
2710.00.81 --- For undergoing a specific process. 0 AU, CA, 
US 2710.00.81 --- For undergoing a specific process. 0 AU, CA, US 
2710.00.83 --- For undergoing chemical  0 AU, CA, US 2710.00.83 --- For undergoing chemical  0 AU, CA, US 
 transformation by a process other than  transformation by a process other than   
 those specified in respect of  those specified in respect of   
 subheading 2710 00 81. subheading 2710 00 81.  
2710.00.85  --- To be mixed in accordance with the  0 AU, CA, 
US  
 terms of additional note 6 to this   
 chapter.   
 --- For other purposes : --- For other purposes :  
2710.00.87 ---- Motor oils, co mpressor lube oils,  20 AU, CA, 
US 2710.00.87 ---- Motor oils, co mpressor lube oils,  20 AU, CA, 
US 
 turbine lube oils. turbine lube oils.  
2710.00.88 ---- Liquids for hydraulic purposes. 0 AU, CA, 
US 2710.00.88 ---- Liquids for hydraulic purposes. 0 AU, CA, US 
AU,  
CA, 2710.00.89 ---- White oils , liquid paraffin. 0 AU, CA, 
US 2710.00.89 ---- White oils , liquid paraffin. 0 
US 
2710.00.92 ---- Gear oils and reductor oils. 20 AU, CA, 
US 2710.00.92 ---- Gear oils and reductor oils. 20 AU, CA, 
US 
2710.00.94 ---- Metal-worki ng compounds, mould  0 AU, CA, 
US 2710.00.94 ---- Metal-worki ng compounds, mould  0 AU, CA, 
US 
 release oils, anti-corrosion oils. release oils, anti-corrosion oils.  
2710.00.96 ---- Electrical  insulating oils. 0 AU, CA, 
US 2710.00.96 ---- Electrical  insulating oils. 0 AU, CA, 
US  
 WT/ACC/SPEC/LTU/15/Add.1 
Page 6 HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
2710.00.98  ---- Other lubricating o ils and other oils. 0 AU, CA, 
US 2710.00.97  ---- Other lubricating o ils and other oils. 0 AU, CA, 
US 
3917  Tubes, pipes and hoses, and fittings  3917  Tubes, pipes and hoses, and fittings   
 therefor (for example, joints, elbows, therefor (for example, joints, elbows,  
 flanges), of plastics : flanges), of plastics :  
 - Tubes, pipes and hoses, rigid : - Tubes, pipes and hoses, rigid :  
3917.29 -- Of other plastics : 3917.29 -- Of other plastics :  
 --- Seamless and of a lengt h exceeding --- Seamless a nd of a length exceeding  
 the maximum cross-sectional  the maximum cross-sectional   
 dimension, whether or not surface- dimension, whether or not surface-  
 worked, but not otherwise worked : worked, but not otherwise worked :  
 ---- Of condensation or rearrangement 3917.29.12  ---- Of condensation or rearrangement 6,5 US 
 polymerization products, whether or  polymerization products, whether or   
 not chemically modified : not chemically modified   
3917.29.11  ----- Of epoxide resins.  6,5 US  
3917.29.13  ----- Other.  6,5 US  
3917.32 -- Other, not reinforced or otherwise 391 7.32 -- Other, not reinforced or otherwise  
 combined with other materials, combined with other materials,  
 without fittings : without fittings :  
 --- Seamless and of a lengt h exceeding --- Seamless a nd of a length exceeding  
 the maximum cross-sectional  the maximum cross-sectional   
 dimension, whether or not surface- dimension, whether or not surface-  
 worked, but not otherwise worked : worked, but not otherwise worked :  
 ---- Of condensation or rearrangement  39.17.32.10  ---- Of condensation or rearrangement  6,5 US 
 polymerization products, whether or pol ymerization products, whether or   
 not chemically modified : not chemically modified   
3917.32.11  ----- Of epoxide resins.  6,5 US  
3917.32.19  ----- Other.  6,5 US  
3917.39 -- Other : 3917.39 -- Other :  
 --- Seamless and of a lengt h exceeding --- Seamless a nd of a length exceeding  
 the maximum cross-sectional  the maximum cross-sectional   
 dimension, whether or not surface- dimension, whether or not surface-  
 worked, but not otherwise worked : worked, but not otherwise worked :  
 ---- Of condensation or rearrangement  3917.39.12  ---- Of condensation or rearrangement  6,5 US 
 polymerization products, whether or pol ymerization products, whether or    
  WT/ACC/SPEC/LTU/15/Add.1
 Page 7HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
 not chemically modified : not chemically modified   
3917.39.11  ----- Of epoxide resins.  6,5 US  
3917.39.13  ----- Other.  6,5 US  
3920  Other plates, sheets, film, foil and strip, 3920  Other plates , sheets, film, foil and strip,  
 of plastics, non-cellular and not of plastics, non-cellular and not  
 reinforced, laminated, supported or reinforced, laminated, supported or  
 similarly combined with other similarly combined with other  
 materials : materials :  
3920.10 - Of polymers of ethylene : 3920.10 - Of polymers of ethylene :  
 -- Of a thickness not exceeding -- Of a thickness not exceeding  
 0,125 mm : 0,125 mm :  
 --- Of polyethylene having a specific  --- Of polyethylene having a specific   
 gravity of : gravity of :  
 ---- Less than 0,94: ---- Less than 0,94:  
3920.10.25  ----- Other 6,5 US ----- Other:  
 ------ Not printed :   
 3920.10.24  ------- Stretch film.  6,5 US 
 3920.10.26  ------- Other.  6,5 US 
 3920.10.27  ------ Printed.  6,5 US 
3920.99 -- Of other plastics : 3920.99 -- Of other plastics :  
 --- Of condensation or rearrangement  --- Of condensation or rearrangement   
 polymerization products, whether or polymerization products, whether or  
 not chemically modified : not chemically modified :  
3920.99.11  ---- Of epoxide resins.  6,5 US  
3920.99.21 ---- Polyimid sl abs and sticks covered  6,5 US 3920.99.21 ---- Po lyimide sheet and strip,  6,5 US 
 or not covered with plastic.  uncoated, or coated or covered solely   
 with plastic.   
3920.99.29  ----Other. 6,5 US 3920.99.28  ----Other. 6,5 US 
3921  Other plates, sheets, film, foil and strip, 3921  Other plates , sheets, film, foil and strip,  
 of plastics : of plastics :  
3921.90 - Other : 3921.90 - Other :  
 -- Of condensation or rearrangement  -- Of condensation or rearrangement   
 polymerisation products, whether or  polymerisation products, whether or   
 not chemically modified: not chemically modified:  
3921.90.20  --- Of epoxide resins.  6,5 US   
 WT/ACC/SPEC/LTU/15/Add.1 
Page 8 HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
3921.90.30 --- Of phenolic resins. 6,5 US 3921.90.30 --- Of phenolic resins. 6,5 US 
 --- Of amino-resins : --- Of amino-resins :  
 ---- Laminated : ---- Laminated :  
3921.90.41 ----- High pressure laminates with a 6,5 US 3921.90.41 ----- High pressure laminates with a 6,5 US 
 decorative surface on one or both decorative surface on one or both  
 sides. sides.  
3921.90.43 ----- Other : 392 1.90.43 ----- Other :  
3921.90.43.1 ------Laminates obtained in  6,5 US 392 1.90.43.1 ------Laminates obtained in  6,5 US 
 uninterrupted manner. uninterrupted manner.  
3921.90.43.9 ------Other 6,5 US 3921.90.43.9 ------Other 6,5 US 
3921.90.49 ---- Other. 6,5 US 3921.90.49 ---- Other. 6,5 US 
3921.90.50  --- Other. 6,5 US 3921.90.55  --- Other. 6,5 US 
4017.00  Hard rubber (for example, ebonite) in  401 7.00  Hard rubber (for example, ebonite) in   
 all forms, including waste and scrap; all forms, including waste and scrap;  
 articles of hard rubber : articles of hard rubber :  
 - Hard rubber (for example, ebonite) in 4017.00.10  - Hard rubber (for example, ebonite) in 15  
 any form, scrap and waste included : any form, scrap and waste included  
4017.00.11 -- In bulk or blocks, in plates, sheets or  15  
 strip, in rods, profile shapes or tubes.   
4017.00.19 -- Scrap, waste and powder of  15  
 hardened rubber.   
 - Articles of hard rubber : 4017.00.90  - Articles of hard rubber 15  
4017.00.91  -- Piping and tubing, with fittings 0 ex4017.00.90  Piping and tubing, with fittings 0  
 attached, suitable for conducting attached, suitable for conducting  
 gases or liquids, for use in civil aircraft. gases or liquids, for use in civil aircraft.  
4017.00.99  -- Other.  15  
4407  Wood sawn or chipped lengthwise, 4407  Wood sawn or chipped lengthwise,  
 sliced or peeled, whether or not  sliced or peeled, whether or not   
 planed, sanded or finger-jointed, of a  planed, sanded or finger-jointed, of a   
 thickness exceeding 6 mm  thickness exceeding 6 mm   
 - Other : - Other :  
4407.99  -- Other: 4407.99  -- Other:  
 --- Other: --- Other:  
 ---- Other : ---- Other :  
4407.99.91 ----- Of poplar. 0 US 4407.99.91 ----- Of poplar. 0 US  
  WT/ACC/SPEC/LTU/15/Add.1
 Page 9HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
4407.99.93  ----- Of walnut.  0 US  
 4407.99.94  ----- Of tropical wood.  0 US 
4407.99.98  ----- Other. 0 US 4407.99.97  ----- Other. 0 US 
4420  Wood marquetry and inlaid wood; 4420  Wood marquetry and inlaid wood;  
 caskets and cases for jewellery or caskets and cases for jewellery or  
 cutlery, and similar articles, of wood; cutlery, and similar articles, of wood;  
 statuettes and other ornaments, of statuettes and other ornaments, of  
 wood; wooden articles of furniture not wood; wooden articles of furniture not  
 falling in Chapter 94 : falling in Chapter 94 :  
4420.90  - Other  4420.90  - Other   
 -- Wood marquetry and inlaid wood : 4420.90.10  -- Wood marquetry and inlaid wood 10 US 
4420.90.11  --- Of tropical wood, as specified in  10 US  
 additional note 2 to this chapter.   
4420.90.19  --- Of other wood.  10 US  
7020.00  Other articles of glass : 7020.00  Other articles of glass :  
 7020.00.05  - Quartz reactor tubes and holders  0 US 
 designed for insertion into diffusion   
 and oxidation furnaces for production   
 of semiconductor materials   
 - Other:   
7020.00.10 - Of fused quartz or other fused silica. 15 7020.00.10 -- Of fused quartz or other fused silica. 15  
7020.00.30 - Of glass having a linear coefficient of 15 702 0.00.30 -- Of glass having a linear coefficient of 15  
 of expansion not exceeding 5 x 10-6 of expansion not exceeding 5 x 10-6  
 per Kelvin within a temperature range per Kelvin within a temperature range  
 of 0 degree C to 300 degree C. of 0 degree C to 300 degree C.  
7020.00.90  - Other. 15 7020.00.80  -- Other. 15  
ex7020.00.90  Quartz reactor tubes and holders  0 US  
 designed for insertion into diffusion   
 and oxidation furnaces for production   
 of semiconductor wafers.   
8411 Turbo-jets, turbo-propellers and other 841 1 Turbo-jets, turbo-propellers and other  
 gas turbines : gas turbines :  
 - Other gas turbines : - Other gas turbines :  
8411.82 -- Of a power exceeding 5 000 kW : 8411.82 -- Of a power exceeding 5 000 kW :  
 --- Other : --- Other :   
 WT/ACC/SPEC/LTU/15/Add.1 
Page 10 HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
8411.82.91  ---- Of a power exceeding 5 000 kW 10 JP  ---- Of a power exceeding 5 000 kW  
 but not exceeding 20 000 kW. but not exceeding 20 000 kW:  
 8411.82.81  ----- Of a power not exceeding 7000  10 JP 
 kW, for use in combined heat and   
 power stations   
 8411.82.89  ----- Other.  10 JP 
8414  Air or vacuum pumps, air or other gas 841 4  Air or vacuum pumps, air or other gas  
 compressors and fans; ventilating or compressors and fans; ventilating or  
 recycling hoods incorporating a fan, recycling hoods incorporating a fan,  
 whether or not fitted with filters : whether or not fitted with filters :  
8414.10 - Vacuum pumps : 8414.10 - Vacuum pumps :  
8414.10.10 -- For use in civil aircraft. 0 JP 8414.10.10 -- For use in civil aircraft. 0 JP 
 8414.10.20  -- For use in semiconductor production  15 JP 
 -- Other : -- Other :  
 --- Other : --- Other :  
8414.10.90  ---- Other. 15 JP 8414.10.80  ---- Other. 15 JP 
8419  Machinery, plant or laboratory 8419  Machinery, plant or laboratory  
 equipment, whether or not electrically  equipment, whether or not electrically   
 heated, for the treatment of materials  heated, for the treatment of materials   
 by a process involving a change of  by a process involving a change of   
 temperature such as heating, cooking,  temperature such as heating, cooking,   
 roasting, distilling, rectifying, sterilizing, roasting, distilling, rectifying, sterilizing,  
 pasteurizing, steaming, drying, pasteurizing, steaming, drying,  
 evaporating, vapourizing, condensing evaporating, vapourizing, condensing  
 or cooling, other than machinery or or cooling, other than machinery or  
 plant of a kind used for domestic plant of a kind used for domestic  
 purposes; instantaneous or storage purposes; instantaneous or storage  
 water heaters, non-electric : water heaters, non-electric :  
 - Other machinery, plant and  - Other machinery, plant and   
 equipment : equipment :  
8419.89 -- Other : 8419.89 -- Other :  
8419.89.10 --- Cooling towers and similar plant for 3 CA, JP 8419.89.10 --- Cooling towers and similar plant for 3 CA, JP 
 direct cooling (without a separating direct cooling (without a separating  
 wall) by means of recirculated water. wall) by means of recirculated water.   
  WT/ACC/SPEC/LTU/15/Add.1
 Page 11HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
8419.89.15 --- Apparatus for rapid heating of 
semiconductor wafers. 0 CA, JP, 
US 8419.89.15 --- Apparatus for rapid heating of 
semiconductor wafers. 0 CA, JP, 
US 
8419.89.20 --- Apparatus for chemical vapour 0 CA, JP, 
US 8419.89.20 --- Apparatus for chemical vapour 0 CA, JP, 
US 
 deposition on semiconductor wafers. deposition on semiconductor wafers.  
8419.89.25 --- Apparatus for physical vapour  0 CA, JP, 
US 8419.89.25 --- Apparatus for physical vapour  0 CA, JP, 
US 
 deposition by electronic beam or  deposition by electronic beam or   
 evaporation on semiconductor wafers. evaporation on semiconductor wafers.  
 8419.89.27  --- Apparatus for chemical vapour  3 CA, JP 
 deposition on LCD substrates.   
8419.89.30 --- Vacuum-vapour plant for the 3 CA, JP 8419.89.30 --- Vacuum-vapour plant for the 3 CA, JP 
 deposition of metal. deposition of metal.  
8419.89.95  --- Other. 3 CA, JP 8419.89.98  --- Other. 3 CA, JP 
8419.90 - Parts : 8419.90 - Parts :  
8419.90.10 -- Of heat exchange units, for use in 0 JP 8419.90.10 -- Of heat exchange units, for use in 0 JP 
 civil aircraft. civil aircraft.  
8419.90.20  -- Of subheading 8419 20 00.  0 JP  
 8419.90.25  -- Of sterilizers of subheading  0 JP, US 
 8419 20 00 and of apparatus of   
 subheading 8419 89 15, 8419 89 20   
 or 8419 89 25.   
 8419.90.50  -- Of apparatus of subheading  10 JP 
 8419 89 27   
8419.90.95  -- Other 10 JP 8419.90.80  -- Other 10 JP 
ex8419.90.95  Parts of chemical vapor deposition  0 JP, US  
 apparatus for semiconductor   
 production; parts for physical   
 deposition apparatus for   
 semiconductor production; parts for   
 apparatus for rapid heating of wafers.   
8421  Centrifuges, including centrifugal 8421  Centrifuges, including centrifugal  
 centrifugal dryers; filtering or purifying  centrifugal dryers; filtering or purifying   
 machinery and apparatus, for liquids  machinery and apparatus, for liquids   
 or gases: or gases:   
 WT/ACC/SPEC/LTU/15/Add.1 
Page 12 HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
 - Centrifuges, including centrifugal - Centrifuges, including centrifugal  
 dryers : dryers :  
8421.19 -- Other: 8421.19 -- Other:  
 --- Other : --- Other :  
8421.19.91 ---- Centrifuges of a kind used in 10 JP 8421.19.91 ---- Centrifuges of a kind used in 10 JP 
 laboratories. laboratories.  
8421.19.93  ---- Spinners for coating photographic  0 JP, US  
 emulsions on semiconductor wafers.   
 8421.19.94  ---- Centrifuges of a kind used in  0 JP, US 
 the manufacture of semiconductor   
 wafers.   
8421.19.98  ---- Other 10 JP  
ex8421.19.98  Spin dryers for semiconductor wafer  0 JP, US  
 processing.   
 8421.19.99  ---- Other 10 JP 
 - Parts : - Parts :  
8421.91 -- Of centrifuges, including centrifugal  10 JP  8421.91 -- Of centrifuges, including centrifugal   
 dryers dryers:  
ex8421.91  Parts of spin dryers for semiconductor  0 JP, US  
 wafer processing; parts for spinners   
 for coating photographic emulsions on   
 on semiconductor wafers.   
 8421.91.10  --- Of apparatus of subheading  0 JP, US 
 8421 19 94.   
 8421.91.30  --- Of spinners for coating  10 JP 
 photographic emulsions on LCD   
 substrates of subheading 8421 19 99   
 8421.91.90  --- Other.  10 JP 
8421.99 -- Other. 10 JP 8421.99 -- Other. 10 JP 
8424 Mechanical appliances (whether or not 842 4 Mechanical appliances (whether or not  
 hand-operated) for projecting, hand-operated) for projecting,  
 dispersing or spraying liquids or  dispersing or spraying liquids or   
 or powders; fire extinguishers, whether or powders; fire extinguishers, whether  
 or not charged; spray guns and similar  or not charged; spray guns and similar   
 appliances; steam or sand blasting  appliances; steam or sand blasting    
  WT/ACC/SPEC/LTU/15/Add.1
 Page 13HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
 blasting machines and similar jet  blasting machines and similar jet   
 projecting machines: projecting machines:  
 - Other appliances : - Other appliances :  
8424.89 -- Other : 8424.89 -- Other :  
8424.89.20 --- Spraying ap pliances for etching,  0 JP, US 8424.89.20 --- Spraying applia nces for etching,  0 JP, US 
 stripping or cleaning semiconductor stripping or cleaning semiconductor  
 wafers. wafers.  
JP,   8424.89.30  --- Deflash machines for cleaning the  0 
US 
 metal leads of semiconductor   
 packages prior to the electroplating   
 process.   
8424.89.80  --- Other 10 JP 8424.89.95  --- Other 10 JP 
ex8424.89.80  Deflash machines for cleaning and  0 JP, US  
 and removing contaminants from the   
 metal leads of semiconductor   
 packages prior to the electroplating   
 process.   
8424.90 - Parts 10 JP 8424.90 - Parts :  
ex8424.90  Parts of spraying appliances for  0 JP, US  
 etching, stripping or cleaning   
 semiconductor wafers.   
 8424.90.10  -- Of appliencies of subheading  0 JP, US 
 8424 89 20   
 8424.90.30  -- Of appliencies of subheading  0 JP, US 
 8424 89 30   
 8424.90.90  -- Other  10 JP 
8456  Machine-tools for working any  8456  Machine-tools for working any   
 material by removal of ma terial, by  materi al by removal of material, by   
 laser or other light or photon beam,  laser or other light or photon beam,   
 ultrasonic, electro-discharge, electro- ultrasonic, electro-discharge, electro-  
 chemical, electron beam, ionic-beam  chemical, electron beam, ionic-beam   
 or plasma arc processes  or plasma arc processes   
8456.10 - Operated by laser or other light or  0 JP 8456.10 - Operated by laser or other light or   
 photon beam processes photon beam processes:   
 WT/ACC/SPEC/LTU/15/Add.1 
Page 14 HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
ex8456.10  Machines for working any material by  0 JP, US  
 by removal of material, by laser or other   
 light or photo beam in the production of   
 light or photo beam in the production   
 production of semiconductor wafers;   
 lasercutters for cutting contacting   
 contacting tracks in semiconductor   
 production by laser beam.   
 8456.10.10  -- Of a kind used in the manufacture of  0 JP, US 
 semiconductor wafers or devices.   
 8456.10.90  -- Other  0 JP 
 - Other : - Other :  
8456.99 -- Other : 8456.99 -- Other :  
8456.99.10 --- Focused ion beam milling  0 JP, US 8456.99.10 --- Focused ion beam milling  0 JP, US 
 machines for producing or repairing  machines for producing or repairing   
 masks and reticles for patterns on  masks and reticles for patterns on   
 semiconductor devices. semiconductor devices.  
8456.99.30 --- Apparatus for stripping or cleaning  0 JP, US 8456.99.30 --- Apparatus for stripping or cleaning  0 JP, US 
 semiconductor wafers. semiconductor wafers.  
 8456.99.50  --- Apparatus for dry-etching patterns  15 JP 
 on LCD substrates   
8456.99.90  --- Other 15 JP 8456.99.80  --- Other 15 JP 
8462 Machine-tools (including presses) for  8462 Machine-tools (including presses) for   
 for working metal by forging,  for working metal by forging,   
 hammering or die-stamping; machine- hammering or die-stamping; machine-  
 tools (including presses) for working tools (including presses) for working  
 metal by bending, folding, metal by bending, folding,  
 straightening, flattening, shearing, straightening, flattening, shearing,  
 punching or notching; presses for  punching or notching; presses for   
 working metal or metal carbides, not working metal or metal carbides, not  
 specified above: specified above:  
 - Bending, folding, straightening or - Bending, folding, straightening or  
 flattening machines (including  flattening machines (including   
 presses) : presses) :  
8462.21  -- Numerically controlled : 8462.21  -- Numerically controlled :   
  WT/ACC/SPEC/LTU/15/Add.1
 Page 15HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
 8462.21.05  --- Of a kind used in the manufacture  0 JP, US 
 of semiconductor devices.   
 --- Other:   
8462.21.10 --- For working flat products. 15 JP 8462.21.10 ---- For working flat products. 15 JP 
8462.21.90  --- Other 15 JP 8462.21.80  ---- Other. 15 JP 
ex8462.21.90  Machines for bending, folding and  0 JP, US  
 straightening semiconductor leads.   
8462.29 -- Other : 8462.29 -- Other :  
 8462.29.05  --- Of a kind used in the manufacture  0 JP, US 
 of semiconductor devices.   
 --- Other:   
8462.29.10 --- For working flat products. 15 JP 8462.29.10 ---- For working flat products. 15 JP 
 --- Other: ---- Other:  
8462.29.91 ---- Hydraulic. 15 JP 8462.29.91 ----- Hydraulic. 15 JP 
8462.29.99 ---- Other  15 JP 8462.29.98  ----- Other. 15 JP 
ex8462.29.99  Machines for bending, folding and  0 JP, US  
 straightening semiconductor leads.   
8464  Machine-tools for working stone,  8464  Machine-tools for working stone,   
 ceramics, concrete, asbestos-cement  ceramics, concrete, asbestos-cement   
 or like mineral materials or for  or like mineral materials or for   
 cold working glass : cold working glass :  
8464.20 - Grinding or polishing machines : 8464.20 - Grinding or polishing machines :  
8464.20.05 -- For working semiconductor wafers. 0 JP, US 8464.20.05 -- For working semiconductor wafers. 0 JP, US 
 -- For working glass : -- For working glass :  
8464.20.11 --- Optical glass. 15 JP 8464.20.11 --- Optical glass. 15 JP 
8464.20.19 --- Other. 15 JP 8464.20.19 --- Other. 15 JP 
 8464.20.20  -- For working ceramics.  15 JP 
8464.20.80  -- Other. 15 JP 8464.20.95  -- Other. 15 JP 
8464.90 - Other : 8464.90 - Other :  
8464.90.10 -- For scribing or scoring  0 JP, US 8464.90.10 -- For scribing or scoring  0 JP, US 
 semiconductor wafers. semiconductor wafers.  
 8464.90.20  -- For working ceramics.  15 JP 
8464.90.90  -- Other. 15 JP 8464.90.80  -- Other. 15 JP 
8466  Parts and accessories suitable for use 846 6  Parts and accessories suitable for use  
 use solely or principally with the  use solely or principally with the    
 WT/ACC/SPEC/LTU/15/Add.1 
Page 16 HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
 machines of heading No. 8456 to machines of heading No. 8456 to  
 to 8465, including work or tool holders, to 8465, including work or tool holders,  
 self-opening dieheads, dividing heads self-opening dieheads, dividing heads  
 heads and other special attachments heads and other special attachments  
 for machine-tools; tool holders for any  for machine-tools; tool holders for any   
 any type  of tool for working in the hand: any type  of tool for working in the hand:  
 - Other : - Other :  
8466.91 -- For machines of heading No 8464 : 8466.91 -- For machines of heading No 8464 :  
 8466.91.15  --- For machines of subheading  0 JP, US 
 8464 10 10, 8464 20 05 or 8464 90 10.   
 --- Other:   
8466.91.20 --- Of cast iron or cast steel. 15 JP 846 6.91.20 ---- Of cast iron or cast steel. 15 JP 
8466.91.80  --- Other 15 JP 8466.91.95  ---- Other. 15 JP 
ex8466.91.80  Parts for machines for sawing  0 JP, US  
 monocrystal semiconductor boules   
 into slices, or wafers into chips; parts   
 of dicing machines for scribing or   
 scoring semiconductor wafers; parts   
 of grinding, polishing and lapping   
 machines for processing of   
 of semiconductor wafers; parts of   
 focused ion beam milling machines to   
 produce or repair masks and reticles   
 for patterns on semiconductor devices.   
8466.93 -- For machines of heading No. 8456 8466.93 -- For machines of heading No. 8456  
 to 8461: to 8461:  
 8466.93.15  --- For machines and apparatus of  0 CA, JP, 
US 
 subheading 8456 10 10, 8456 91 00,   
 8456 99 10 or 8456 99 30.   
8466.93.20  --- Of cast iron or cast steel.  0 CA, JP  
 8466.93.17  --- For apparatus of subheading  0 CA, JP 
 8456 99 50.   
8466.93.80  --- Other 0 CA, JP  
ex8466.93.80  Parts of lasercuters for cutting  0 CA, JP, US   
  WT/ACC/SPEC/LTU/15/Add.1
 Page 17HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
 contacting tracks in semiconductor   
 production by laser beam; parts of   
 machines for working any material by   
 removal of material , by laser or other   
 light or photo beam in the production   
 of semiconductor wafers; parts of   
 apparatus for stripping or cleaning   
 semiconductor wafers; parts of   
 machines for dry-etching patterns on   
 semiconductor materials.   
 8466.93.95  --- Other  0 CA, JP 
8466.94 -- For machines of heading No 8462  0 JP 8466.94 -- For machines of heading No 8462   
 or 8463 or 8463:  
ex8466.94  Parts of machines for bending, folding  0 JP, US 8466.94.10  --- For machines of subheading  0 JP, US 
 and straightening semiconductor  8462 21 05 or 8462 29 05.   
 leads.   
 8466.94.90  --- Other  0 JP 
8470 Calculating machines and pocket-size  8470 Calculating machines and pocket-size   
 data recording, reproducing and  data recording, reproducing and   
 displaying machines with calculating  displaying machines with calculating   
 functions; accounting machines,  functions; accounting machines,   
 postage-franking machines, ticket- postage-franking machines, ticket-  
 issuing machines and similar issuing machines and similar  
 machines, incorporating a calculating  machines, incorporating a calculating   
 device; cash registers: device; cash registers:  
JP,  8470.10 - Electronic calculators capable of  847 0.10 - Electronic calculators capable of  0 
US 
 of operation without an external source of operation without an external source  
 of electric power and pocket-size data  of electric power and pocket-size data   
 recording, reproducing and displaying recording, reproducing and displaying  
 machines with calculating functions: machines with calculating functions.  
8470.10.10  -- Electronic calculator capable of  0 JP, US  
 operation without an external source   
 of electric power.   
8470.10.90  -- Pocket-size data recording,  0 JP, US   
 WT/ACC/SPEC/LTU/15/Add.1 
Page 18 HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
 reproducing and displaying machines   
 with calculating functions.   
8471  Automatic data-processing machines  8471  Automatic dataprocessing machines  
 machines and units thereof; magnetic machines and units thereof; magnetic  
 or optical readers, machines for or optical readers, machines for  
 transcribing data onto data media in  transcribing data onto data media in   
 coded form and machines for coded form and machines for  
 processing such data, not elsewhere  processing such data, not elsewhere   
 specified or included : specified or included :  
8471.80 - Other units of automat ic data- 8471.80 - Other units of automatic data- 0 JP, US 
 processing machines : processing machines.  
8471.80.10  -- Peripheral units.  0 JP, US  
8471.80.90  -- Other.  0 JP, US  
8472  Other office machines (for example, 847 2  Other office machines (for example,  
 hectograph or stencil duplicating hectograph or stencil duplicating  
 machines, addressing machines, machines, a ddressing machines,  
 automatic banknote dispensers, coin- automatic banknote dispensers, coin-  
 sorting machines, coin-counting or sorting machines, coin-counting or  
 wrapping machines, pencil- wrapping machines, pencil-  
 sharpening machines, perforating or sharpening machines, perforating or  
 stapling machines) stapling machines)  
8472.90 - Other : 8472.90 - Other :  
8472.90.10 -- Coin-sorting, coin-counting or coin- 10 JP 8472.90.10 -- Coin-sorting, coin-counting or coin- 10 JP 
 wrapping machines. wrapping machines.  
 8472.90.30  -- Automatic teller machines.  0 JP, US 
8472.90.90  -- Other 10 JP 8472.90.80  -- Other. 10 JP 
ex8472.90.90  Automatic teller machines.  0 JP, US  
8473  Parts and accessories (other than  847 3  Parts and accessories (other than   
 covers, carrying cases and the like)  covers, carrying cases and the like)   
 suitable for use solely or principally suitable for use solely or principally  
 with machines of heading No. 8469 with machines of heading No. 8469  
 to 8472 : to 8472 :  
8473.10  - Parts and accessories of the  847 3.10  - Parts and accessories of the   
 machines of heading No 8469: machines of heading No 8469:  
8473.10.10  -- Electronic assemblies 10 JP -- Electronic assemblies :   
  WT/ACC/SPEC/LTU/15/Add.1
 Page 19HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
ex8473.10.10  Printed circuit assemblies.  0 JP, US 8473.10.11  --- Of machines of subheading  0 JP, US 
 8469 11 00.   
 8473.10.19  --- Other.  10 JP 
8473.10.90 -- Other. 10 JP 8473.10.90 -- Other. 10 JP 
8473.40 - Parts and accessories of the  847 3.40 - Parts and accessories of the   
 machines of heading No 8472: machines of heading No 8472:  
8473.40.10 -- Electronic assemblies 0 JP -- Electronic assemblies:  
ex8473.40.10  Printed circuit assemblies.  0 JP, US 8473.40.11 --- Of machines of subheading  0 JP, US 
 8472 90 30.  0 JP 
 8473.40.19 --- Other.   
8473.40.90 -- Other. 0 JP 8473.40.90 -- Other. 0 JP 
8477  Machinery for working rubber or 8477  Machinery for working rubber or  
 plastics or for the manufacture of plastics or for the manufacture of  
 products from these materials, not  products from these materials, not   
 specified or included elsewhere in specified or included elsewhere in  
 this chapter : this chapter :  
8477.10 - Injection-moulding machines 0 CA, JP 8477.10 - Injection-moulding machines :  
ex8477.10  Encapsulation equipment for  0 CA, 
JP,US 8477.10.10  -- Encapsulation equipment for  0 CA, 
JP,US 
 assembly of semiconductors.  assembly of semi conductor devices.   
 8477.10.90  -- Other.  0 CA, JP 
 - Other machinery for moulding or  - Other machinery for moulding or   
 otherwise forming : otherwise forming :  
8477.59 -- Other : 8477.59 -- Other :  
 8477.59.05  -- Encapsulation equipment for  0 JP, US 
 assembly of semi conductor devices.   
 --- Other:   
8477.59.10 --- Presses. 15 JP 8477.59.10 ---- Presses. 15 JP 
8477.59.90  --- Other 15 JP 8477.59.80  ---- Other. 15 JP 
ex8477.59.90  Encapsulation equipment for  0 JP, US  
 assembly of semiconductors.   
8477.90 - Parts : 8477.90 - Parts :  
 8477.90.05  -- For machines of subheadings  0 JP, US 
 8477 10 10 and 8477 59 05.   
 -- Other :    
 WT/ACC/SPEC/LTU/15/Add.1 
Page 20 HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
8477.90.10 -- Of cast iron or cast steel. 15 JP 8477.90.10 --- Of cast iron or cast steel. 15 JP 
8477.90.90  -- Other 15 JP 8477.90.80  --- Other 15 JP 
ex8477.90.90  Parts of encapsulation equipment.  0 JP, US  
8479 Machines and mechanical appliances  8479 Machines and mechanical appliances   
 having individual functions, not having individual functions, not  
 specified or included elsewhere in this  specified or included elsewhere in this   
 chapter : chapter :  
 - Other machines and mechanical - Other machines and mechanical  
 appliances : appliances :  
8479.89 -- Other : 8479.89 -- Other :  
 --- Other : --- Other :  
8479.89.30 ---- Mobile hydraulic powered mine  3 CA, JP 8479.89.30 ---- Mobile hydraulic powered mine  3 CA, JP 
 roof supports. roof supports.  
8479.89.60 ---- Central greasing systems. 3 CA, JP 8479.89.60 ---- Central greasing systems. 3 CA, JP 
8479.89.65 ---- Apparatus for growing or pulling  0 CA, JP, 
US 8479.89.65 ---- Apparatus for growing or pulling  0 CA, JP, 
US 
 monocrystal semiconductor boules. monocrystal semiconductor boules.  
8479.89.70 ---- Apparatus for epitaxial deposition  0 CA, JP, 
US 8479.89.70 ---- Apparatus for epitaxial deposition  0 CA, JP, 
US 
 on semiconductor wafers. on semiconductor wafers.  
 8479.89.73  ---- Apparatus for wet etching,  0 CA, JP, 
US 
 developing, striping or cleaning   
 semiconductor wafers or flat panel   
 display substrates.   
8479.89.75  ---- Apparatus for wet etching,  0 CA, JP, US  
 developing, striping or cleaning   
 semiconductor wafers.   
 8479.89.77  ---- Die attach apparatus and tape  0 CA, JP, 
US 
 automated bonders for assembly of   
 semiconductor devices.   
 8479.89.79  ---- Encapsulation equipment for  0 CA, JP, 
US 
 assembly of semi conductor devices.    
  WT/ACC/SPEC/LTU/15/Add.1
 Page 21HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
 8479.89.91  ---- Machines for glazing and  0 CA, JP 
 decorating ceramic products.   
8479.89.95  ---- Other 0 CA, JP  
ex8479.89.95  Apparatus for wet etching, developing,  0 CA, JP, US  
 striping or cleaning semiconductor   
 wafers and flat panel displays;   
 Apparatus for wet etching, developing,   
 striping or cleaning semiconductor   
 wafers and flat panel displays;   
 Encapsulation equipment for   
 assembly of semiconductors.   
 8479.89.98  ---- Other. 0 CA, JP 
8479.90 - Parts : 8479.90 - Parts :  
 -- Other : -- Other :  
 8479.90.50  --- Of machines of subheading  0 JP, US 
 8479 89 65, 8479 89 70, 8479 89 73,   
 8479 89 77 or 8479 89 79.   
 --- Other:   
8479.90.92 --- Of cast iron or cast steel. 0 JP, US 847 9.90.92 ---- Of cast iron or cast steel. 0 JP, US 
 8479.90.97  ---- Other. 0 JP, US 
8479.90.98  --- Other 0 JP, US  
ex8479.90.98  Parts for die attach apparatus, tape  0 JP, US  
 automated bounders, and wire   
 bounders for assembly of   
 semiconducters; parts of apparatus for   
 growing or pulling monocrystal   
 semiconductor boules; parts or   
 apparatus for wet etching, developing,   
 stripping or cleaning semiconductor   
 wafers and flat panel displays; parts of   
 encapsulation equipment for assembly   
 of semiconductors; parts of epitaxial   
 deposition machines for   
 semiconductor wafers; parts of   
 apparatus for wet etching, developing,    
 WT/ACC/SPEC/LTU/15/Add.1 
Page 22 HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
 stripping or cleaning semiconductor   
 wafers and flat panel displays.   
8480  Moulding boxes for metal foundry;  8480  Moulding boxes for metal foundry;   
 mould bases; moulding patterns; mould bases; moulding patterns;  
 moulds for metal (other than ingot moulds for metal (other than ingot  
 moulds), metal carbides, glass, moulds), metal carbides, glass,  
 mineral materials, rubber or plastics : mineral materials, rubber or plastics :  
 - Moulds for rubber or plastics : - Moulds for rubber or plastics :  
8480.71 -- Injection or compression types 0 JP 8480.71 -- Injection or compression types:  
ex8480.71  Injection and compression moulds for  0 JP, US 8480.71.10 --- Of kind used in the manufacture of  0 JP, US 
 the manufacture of semiconductor  semiconductor devices.   
 devices.   
 8480.71.90  --- Other.  0 JP 
8502  Electric generating sets and rotary  8502  Electric generating sets and rotary   
 converters: converters:  
 - Generating sets with compression- - Generating sets with compression-  
 ignition internal combustion piston ignition internal combustion piston  
 engines (diesel or semi-diesel engines (diesel or semi-diesel  
 engines) : engines) :  
8502.13 -- Of an output exceeding 375 kVA : 850 2.13 -- Of an output exceeding 375 kVA :  
 --- Other : --- Other :  
8502.13.91 ---- Of an output exceedin g 375 kVA 15 JP 8502.13.91 ---- Of an output exceeding 375 kVA 15 JP 
 but not exceeding 750 kVA. but not exceeding 750 kVA.  
 8502.13.93  ---- Of an output exceeding 750 kVA but 15 JP 
 not exceeding 2000 kVA.   
 8502.13.98  ---- Of an output exceeding 2000 kVA.  15 JP 
8502.13.99  ---- Of an output exceeding 750 kVA.  15 JP  
8502.20 - Generating sets with spark-ignition 850 2.20 - Generating sets with spark-ignition  
 internal combustion piston engines : internal combustion piston engines :  
 -- Other : -- Other :  
8502.20.91 --- Of an output not exceeding 7,5 kVA. 15 JP 8502.20.91 --- Of an output not exceeding 7,5 kVA. 15 JP 
 8502.20.92  --- Of an output exceeding 7,5 kVA but  15 JP 
 not exceeding 375 kVA.   
 8502.20.94  --- Of an output exceeding 375 kVA  15 JP 
 but not exceeding 750 kVA.    
  WT/ACC/SPEC/LTU/15/Add.1
 Page 23HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
 8502.20.98  --- Of an output exceeding 750 kVA.  15 JP 
8502.20.99  --- Of an output exceeding 7,5 kVA.  15 JP  
8504  Electrical transformers, static  850 4  Electrical transformers, static   
 converters (for example, rectifiers) and  converters (for example, rectifiers) and  
 inductors : inductors :  
8504.40 - Static converters : 850 4.40 - Static converters :  
 -- Other : -- Other :  
 8504.40.20  --- Of a kind used with  0 JP, US 
 telecommunication apparatus,   
 automatic data processing machines   
 and units thereof.   
8504.40.30  --- Power supply units of a kind used  15 JP  
 with automatic data-processing   
 machines.   
 JP --- Other :   
8504.40.50 --- Polycrysta lline semiconductors.  15 JP 8504.40.50 ---- Polycrystalline semiconductor  15 JP 
 rectifiers.   
 --- Other : ---- Other :  
8504.40.93 ---- Accumulator chargers. 15 JP 8504.40.93 ----- Accumulator chargers. 15 JP 
 ---- Other : ----- Other.  
8504.40.94 ----- Rectifiers. 15 JP 8504.40.94 ------ Rectifiers. 15 JP 
 ----- Inverters : ------ Inverters :  
8504.40.96 ------ Having a power handl ing  15 JP 8504.40.96 ------- Having a power handling  15 JP 
 capacity not exceeding 7,5 kVA. capacity not exceeding 7,5 kVA.  
 8504.40.97 ------ Having a power handling  15 JP  8504.40.97 ------- Having a power handling  15 JP 
 capacity exceeding 7,5 kVA. capacity exceeding 7,5 kVA.  
8504.40.99 ----- Other. 15 JP 8504.40.99 ------ Other. 15 JP 
ex8504.40.99  Static converters for automatic data  0 JP, US  
 processing machines and units   
 thereof, and  telecommunication   
 apparatus   
8504.50 - Other inductors : 8504.50 - Other inductors :  
8504.50.10 -- For use in civil aircraft. 0 JP 8504.50.10 -- For use in civil aircraft. 0 JP 
 -- Other   
 8504.50.30  --- Of a kind used with  0 JP, US  
 WT/ACC/SPEC/LTU/15/Add.1 
Page 24 HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
 telecommunication apparatus and   
 for power supplies for automatic data   
 processing machines and units   
 thereof.   
8504.50.90  -- Other 15 JP 8540.50.80 --- Other.  15 JP 
ex8504.50.90  Other inductors for power supplies for  0 JP, US  
 automatic data processing   
 machines and units thereof, and   
 telecommunication apparatus.   
8504.90 - Parts : 8504.90 - Parts :  
 -- Of transformers and inductors : -- Of transformers and inductors :  
 8504.90.05  --- Electronic assemblies of machines  0 JP, US 
 of subheading 8504 50 30.   
 --- Other:   
8504.90.11 --- Ferrite cores. 15 JP 8504.90.11 ---- Ferrite cores. 15 JP 
 8504.90.18  ---- Other. 15 JP 
8504.90.19  --- Other 15 JP  
ex8504.90.19  Printed circuit assemblies.  0 JP, US  
8504.90.90  -- Of static converters 15 JP --- Of static converters:  
 8504.90.91  ---- Electronic assemblies of  0 JP, US 
 machines of subheading 8504 40 20.   
ex8504.90.90  Printed circuit assemblies.  0 JP, US  
 8504.90.99  ---- Other.  15 JP 
8514 Industrial or laboratory electric 851 4 Industrial or laboratory electric  
 (including induction or dielectric) (including induction or dielectric)  
 furnaces and ovens; other industrial or furnaces and ovens; other industrial or  
 or laboratory induction or dielectric or laboratory induction or dielectric  
 heating equipment : heating equipment :  
8514.10 - Resistance heated furnaces and  851 4.10 - Resistance heated furnaces and   
 ovens : ovens :  
 8514.10.05  -- For the manufacture of  0 JP, US 
 semiconductor devices on   
 semiconductor wafers.   
 -- Other:   
8514.10.10 -- Bakery and biscuit ovens. 15 JP 8514.10.10 --- Bakery and biscuit ovens. 15 JP  
  WT/ACC/SPEC/LTU/15/Add.1
 Page 25HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
 8514.10.80  --- Other. 15 JP 
8514.10.90  -- Other 15 JP  
ex8514.10.90  Resistance heated furnaces and  0 JP, US  
 ovens for the manufacture of   
 semiconductor devices on   
 semiconductor wafers.   
8514.20 - Induction or dielectric furnaces and  851 4.20 - Induction or dielectric furnaces and   
 ovens : ovens :  
 8514.20.05 -- For the manufacture of  0 JP, US 
 semiconductor devices on   
 semiconductor wafers.   
 -- Other:   
8514.20.10 -- Induction furnaces and ovens. 15 JP 8514.20.10 --- Induction furnaces and ovens. 15 JP 
8514.20.90  -- Dielectric furnaces and ovens 15 JP 8514.20.80  --- Dielectric furnaces and ovens. 15 JP 
ex8514.20.90 Induct ance or dielectric furnaces and   
 ovens for the manufacture of  0 JP, US  
 semiconductor devices on   
 semiconductor wafers.   
8514.90 - Parts 0 JP 8514.90 - Parts  
ex8514.90  Parts of resistance heated furnaces  0 JP, US 8514.90.20  -- Of machines of subheading  0 JP, US 
 and owens for the manufacture of  8514 10 05, 8514 20 05, 8514 30 11   
 semiconductor devices on  or 8514 30 91.   
 semiconductor wafers; parts of   
 apparatus for rapid heating of wafers;   
 parts of furnaces and ovens of   
 Headings No 8514 10 to No 8514 30.   
 8514.90.80  -- Other.  0 JP 
8515  Electric (including electrically heated  851 5  Electric (including electrically heated   
 gas), laser or other light or photon gas), laser or other light or photon  
 beam, ultrasonic, electron beam, beam, ultrasonic, electron beam,  
 magnetic pulse or plasma arc magnetic pulse or plasma arc  
 soldering, brazing or welding soldering, brazing or welding  
 machines and apparatus, whether or machines and apparatus, whether or  
 not capable of cutting; electric not capable of cutting; electric  
 machines and apparatus for hot  machines and apparatus for hot    
 WT/ACC/SPEC/LTU/15/Add.1 
Page 26 HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
 spraying of metals or cerments: spraying of metals or cermets :  
8515.80 - Other machines and apparatus  8515.80 - Other machines and apparatus   
 8515.80.05  -- Wire bonders for a kind used for the  0 JP, US 
 manufacture of semiconductor   
 devices.   
 -- Other :   
 -- For treating of metals : --- For treating metals:  
8515.80.11 --- For welding. 15 JP 8515.80.11 ---- For welding. 15 JP 
8515.80.19 --- Other. 15 JP 8515.80.19 ---- Other. 15 JP 
 -- Other: --- Other :  
8515.80.91 --- For resistance welding of  plastics. 15 JP 8515.80.91 ---- For re sistance welding of plastics. 15 JP 
8515.80.99 --- Other 15 JP 8515.80.99 ---- Other. 15 JP 
ex8515.80.99  Die attach apparatus, tape automated  0 JP, US  
 bonders, and wire bonders for   
 assembly of semiconductors.   
8515.90 - Parts 0 JP 8515.90 - Parts:  
ex8515.90 Die attach apparatus, tape automated  0 JP, US 8515.90.10  -- For machines of subheading  0 JP, US 
 bonders, and wire bonders for  8515 80 05.   
 assembly of semiconductors.   
 8515.90.90  -- Other.  0 JP 
8518  Microphones and stands therefor; 851 8  Microphones and stands therefor;  
 loudspeakers, whether or not mounted  loudspeakers, whether or not mounted   
 in their enclosures; headphones, in their enclosures; headphones,  
 earphones and combined  earphones and combined   
 microphone/speaker sets; audio- microphone/speaker sets; audio-  
 frequency electric amplifiers; electric  frequency electric amplifiers; electric   
 sound amplifier sets : sound amplifier sets :  
8518.10  - Microphones and stands therefor : 851 8.10  - Microphones and stands therefor :  
8518.10.10 -- For use in civil aircraft. 0 JP 8518.10.10 -- For use in civil aircraft. 0 JP 
8518.10.90  -- Other. 8 JP -- Other :  
ex8518.10.90  Microphones having a frequency range  0 JP, US 8518.10.20  --- Microphones having a frequency  0 JP, US 
 of 300 Hz to 3.4 KHz with a diameter of  range of 300 Hz to 3.4 KHz, of a   
 not exceeding 10 mm and height not  diameter not exceeding 10 mm   
 exceeding 3 mm, for  and a height not exceeding 3 mm, of a   
 telecommunication use.  kind used for telecommunications.    
  WT/ACC/SPEC/LTU/15/Add.1
 Page 27HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
 8518.10.80  --- Other.  8 JP 
 - Loudspeakers, whether or not - Loudspeakers, whether or not  
 mounted in their enclosures : mounted in their enclosures :  
8518.29  -- Other : 8518.29  -- Other :  
8518.29.10 --- For use in civil aircraft. 0 JP 8518.29.10 --- For use in civil aircraft. 0 JP 
8518.29.90  --- Other. 8 JP --- Other:  
ex8518.29.90  Loudspeakers, without housing,  0 JP, US 8518.29.20  ---- Loudspeakers, having a frequency  0 JP, US 
 having a frequency range of 300 Hz to  range of 300 Hz to 3.4 KHz, of a   
 3.4 KHz with a diameter of not  diameter not exceeding 50 mm, of a   
 exceeding 50 mm, for  kind used for telecommunications.   
 telecommunication use.   
 8518.29.80  ---- Other.  8 JP 
8518.30  - Headphones, earphones and 851 8.30  - Headphones, earphones and  
 combined microphone/speaker sets : combined microphone/speaker sets :  
8518.30.10 -- For use in civil aircraft. 0 JP 8518.30.10 -- For use in civil aircraft. 0 JP 
8518.30.90  -- Other. 7 JP -- Other :  
ex8518.30.90  Line telephone handsets.  0 JP, US 8518.30.20  --- Line teleph one handsets.  0 JP, US 
 8518.30.80  --- Other.  7 JP 
8522 Parts and accessories suitable for use 852 2 Parts and accessories suitable for use  
 solely or principally with the apparatus solely or principally with the apparatus  
 of headings No. 8519 to 8521 : of headings No. 8519 to 8521 :  
8522.90 - Other : 8522.90 - Other :  
 -- Other : -- Other :  
 --- Other : --- Other :  
8522.90.91  ---- Electronic assemblies 10 JP ---- Electronic assemblies  
ex8522.90.91  Printed circuit assemblies.  0 JP, US 8522.90.51  ----- Of apparatus of subheading  0 JP, US 
 8520 20 00.   
 8522.90.59  ----- Other.  10 JP 
8522.90.93 ---- Single cassette-deck assemblies  10 JP 8522.90.93 ---- Single cassette-deck assemblies  10 JP 
 with a total thickness not exceeding 53 with a total thickness not exceeding 53  
 mm, of a kind used in the manufacture  mm, of a kind used in the manufacture   
 of sound recording and reproducing  of sound recording and reproducing   
 apparatus. apparatus.  
8522.90.98 ---- Other. 10 JP 8522.90.98 ---- Other. 10 JP 
8523  Prepared unrecorded media for sound  8523  Prepared unrecorded media for sound    
 WT/ACC/SPEC/LTU/15/Add.1 
Page 28 HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
 recording or similar recording of other recording or similar recording of other  
 phenomena, other than products of phenomena, other than products of  
 Chapter 37 : Chapter 37 :  
8523.20 - Magnetic discs : 8523.20 - Magnetic discs :  
 -- Rigid : 8523.20.10  -- Rigid. 0 JP, US 
8523.20.11  --- With a thin film metallic coating,  0 JP, US  
 having a coercivity exceeding 600   
 Oersted and an external diameter not   
 exceeding 231 mm.   
8523.20.19  --- Other.  0 JP, US  
8523.20.90 -- Other. 0 JP, US 8523.20.90 -- Other. 0 JP, US 
8524  Records, tapes and other recorded  852 4  Records, tapes and other recorded   
 media for sound or other similarly  media for sound or other similarly   
 recorded phenomena, including recorded phenomena, including  
 matrices and masters for the matrices and masters for the  
 production of records, but excluding production of records, but excluding  
 products of Chapter 37 : products of Chapter 37 :  
 - Discs for laser reading systems : - Discs for laser reading systems :  
8524.39 -- Other 0 JP 8524.39 -- Other :  
ex8524.39  Proprietary format storage devices.  0 JP, US 8524.39.10  --- For reproducing representations  0 JP, US 
 Other: for reproducing representations  of instructions, data, sound, and   
 of instructions, data, sound, and  image, recorded in a machine readable   
 image, recorded in a machine readable  binary form, and capable of being   
 binary form, and capable of being  manipulated or providing interactivity to  
 manipulated or providing interactivity to  a user, by means of an automatic data   
 a user, by means of an automatic data  processing machine.   
 processing machine.   
 8524.39.90  --- Other.  0 JP 
8524.40 - Magnetic tapes for reproducing 8524.40 - Magnetic tapes for reproducing 0 JP, US 
 phenomena other than sound or  phenomena other than sound or   
 image : image.  
8524.40.10  -- Bearing data or instructions of a kind  0 JP, US  
 used in automatic data-processing   
  machines.   
 -- Other :    
  WT/ACC/SPEC/LTU/15/Add.1
 Page 29HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
8524.40.91  --- Of a width exceeding 4 mm but not  0 JP, US  
 exceeding 6,5 mm.   
8524.40.99  --- Other.  0 JP, US  
 - Other : - Other :  
8524.91 -- For reproducing phenomena other  8524.91 -- For reproducing phenomena other  0 JP, US 
 than sound or image : than sound and image.  
8524.91.10  --- Bearing data or instructions of a  0 JP, US  
 kind used in automatic-data   
 processing machines.   
8524.91.90  --- Other.  0 JP, US  
8524.99 -- Other 0 JP 8524.99 -- Other :  
ex8524.99  Proprietary format storage devices.  0 JP, US 8524.99.10  --- For reproducing representations  0 JP, US 
 Other: for reproducing representations  of instructions, data, sound, and   
 of instructions, data, sound, and  image, recorded in a machine readable   
 image, recorded in a machine readable  binary form, and capable of being   
 binary form, and capable of being  manipulated or providing interactivity to  
 manipulated or providing interactivity to  a user, by means of an automatic data   
 a user, by means of an automatic data  processing machine.   
 processing machine.   
 8524.99.90  --- Other.  0 JP 
8525  Transmission apparatus for radio- 852 5  Transmission apparatus for radio-  
 telephony, radio-telegraphy, radio- telephony, radio-telegraphy, radio-  
 broadcasting or television, whether or broadcasting or television, whether or  
 not incorporating reception apparatus not incorporating reception apparatus  
 or sound recording or reproducing or sound recording or reproducing  
 apparatus; television cameras; still  apparatus; television cameras; still   
 image video cameras and other video  image video cameras and other video   
 camera recorders: camera recorders:  
8525.10  - Transmission apparatus : 8525.10  - Transmission apparatus :  
8525.10.10 -- Radio-telegraphic or radio- 0 CA, JP 8525.10.10 -- Radio-telegraphic or radio- 0 CA, JP 
 telephonic apparatus, for use in telephonic a pparatus, for use in  
 civil aircraft. civil aircraft.  
8525.10.90  -- Other. 0 CA, JP -- Other :  
ex8525.10.90  Transmission apparatus other than  0 CA, JP, 
US 8525.10.50  --- Radio-telegr aphic or radio-  0 CA, JP, 
US  
 WT/ACC/SPEC/LTU/15/Add.1 
Page 30 HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
 apparatus for radio-broadcasting or  telephonic apparatus.   
 television.   
 8525.10.80  --- Other.  0 CA, JP 
8525.40 - Still image video cameras and other  15 JP  8525.40 - Still image video cameras and other   
 video camera recorders. video camera recorders :  
 -- Still image video cameras:   
ex8525.40  Digital still image video cameras.  0 JP, US 8525.40.11  --- Digital.  0 JP, US 
 8525.40.19  --- Other.  15 JP 
 -- Other video camera recorders:   
 8525.40.91  --- Only able to record sound and  15 JP 
 images taken by the television camera.   
 8525.40.99  --- Other.  15 JP 
8527  Reception apparatus for radio- 852 7  Reception apparatus for radio-  
 telephony, radio-telegraphy or radio- telephony, radio-telegraphy or radio-  
 broadcasting, whether or not  broadcasting, whether or not   
 combined, in the same housing, with combined, in the same housing, with  
 sound recording or reproducing sound recording or reproducing  
 apparatus or a clock : apparatus or a clock :  
8527.90  - Other apparatus : 8527.90  - Other apparatus :  
 -- Other : -- Other :  
8527.90.91  --- Portable receivers for calling or  0 JP, US  
 paging   
ex8527.90.91  Paging alert devices. Portable  0 JP, US 8527.90.92  --- Portable receivers for calling,  0 JP, US 
 receivers for calling, alerting or paging.  alerting or paging.   
8527.90.99  --- Other.  0 JP, US  
 8527.90.98  --- Other.  0 JP, US 
8528  Reception apparatus for television,  852 8  Reception apparatus for television,   
 whether or not incorporating radio- whether or not incorporating radio-  
 broadcast receivers or sound or video broadcast receivers or sound or video  
 recording or reproducing apparatus; recording or reproducing apparatus;  
 video monitors and video projectors: video monitors and video projectors:  
 - Reception apparatus for television, - Reception apparatus for television,  
 whether or not incorporating radio- whether or not incorporating radio-  
 broadcast receivers or sound or video broadcast receivers or sound or video  
 recording or reproducing apparatus : recording or reproducing apparatus :   
  WT/ACC/SPEC/LTU/15/Add.1
 Page 31HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
8528.12  -- Colour : 8528.12  -- Colour :  
 --- Television projecti on equipment : 8528.12.10  --- Television projection equipment. 15 JP 
8528.12.14  ---- With scanning parameters not  15 JP  
 exceeding 625 lines.   
 ---- With scanning parameters   
 exceeding 625 lines :   
8528.12.16  ----- With a vertical resolution of less  15 JP  
 than 700 lines.   
8528.12.18  ----- With a vertical resolution of 700  15 JP  
 lines or more.   
 --- Apparatus incorporating a video  8528.12.20  --- Apparatus incorporating a video  15 JP 
 recorder or reproducer : recorder or reproducer.  
8528.12.22  ---- With a screen width/height ratio  15 JP  
 less than 1,5.   
8528.12.28  ---- Other.  15 JP  
 --- Other : --- Other :  
 ----Other ----Other  
 ----- Without screen : ----- Without screen :  
 ------ Video tuners: ------ Video tuners:  
 8528.12.90  ------- Electronic assemblies for  0 JP, US 
 incorporation into automatic data   
 processing machines.   
 ------- Other :   
8528.12.92  -------- Digital.  15 JP  
 8528.12.93  -------- Digital (including mixed digital  15 JP 
 and analogue).   
8528.12.94  -------Other  15 JP  
ex8528.12.94  Printed circuit assemblies.  0 JP, US  
 8528.12.95  -------- Other.  15 JP 
8528.12.98 ------ Other. 15 JP 8528.12.98 ------ Other. 15 JP 
8529  Parts suitable for use solely or 8529  Parts suitable for use solely or  
 principally with the apparatus of principally with the apparatus of  
 heading No. 8525 to 8528 : heading No. 8525 to 8528 :  
8529.10  - Aerials and aerial reflectors of all  0 JP, US 8529.10  - Aerials and aerial reflectors of all   
 kinds; parts suitable for use therewith : kinds; parts suitable for use therewith :   
 WT/ACC/SPEC/LTU/15/Add.1 
Page 32 HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
 -- Other :  
 --- Aerials :  
ex8529.10.90  Aerials or antennae of a kind used  0 JP, US 8529.10.15  ---- Aerials for radi o-telegraphic or  0 JP, US 
 used with apparatus for radio-  radio-telephonic apparatus.   
 telephony and radio-telegraphy.   
 8529.10.20  ---- Telescopic and whip-type aerials  0 JP, US 
 for portable apparatus or for apparatus   
 for fitting in motor vehicles.   
 ---- Outside aerials for radio or   
 television broadcast receivers:   
 8529.10.31  ----- For reception via satellite.  0 JP, US 
 8529.10.39  ----- Other.  0 JP, US 
 8529.10.40  ---- Inside aerials for radio or television  0 JP, US 
 broadcast receivers, including built-in   
 types.   
 8529.10.45  ---- Other.  0 JP, US 
 8529.10.70  --- Aerial filters and separators.  0 JP, US 
 8529.10.90  --- Other.  0 JP, US 
8529.90 - Other : 0 CA, JP, 
US 8529.90 - Other :  
 -- Other : -- Other :  
 8529.90.40  --- Parts of apparatus falling within  0 CA, JP, 
US 
 subheadings 8525 10 50, 8525 20 91,   
 8525 20 99, 8525 40 11 and   
 8527 90 92.   
 --- Other : --- Other :   
 ---- Cabinets and cases:   
 8529.90.51  ----- Of wood.  0 CA, JP, 
US 
 8529.90.59  ----- Of other materials.  0 CA, JP, 
US 
 8529.90.72  ---- Electronic assemblies.  0 CA, JP, 
US 
 ---- Other :   
 8529.90.81  ----- For television cameras of  0 CA, JP,   
  WT/ACC/SPEC/LTU/15/Add.1
 Page 33HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
    US 
 subheading 8525 30 and apparatus of   
 heading Nos 8527 and 8528.   
 8529.90.88  ----- Other. 0 CA, JP, 
US 
8529.90.89  ---- Other 0 CA, JP, US  
ex8529.90.89  Paging alert devices; printed circuit  0 CA, JP, US  
 assemblies. Parts of transmission   
 apparatus other than apparatus for   
 radio-broadcasting or television   
 transmission apparatus incorporating   
 reception apparatus digital still image   
 video cameras, portable receivers for   
 calling, alerting or paging.   
8531  Electric sound or visual signalling  8531  Electric sound or visual signalling   
 apparatus (for example, bells, sirens, apparatus (for example, bells, sirens,  
 indicator panels, burglar or fire  indicator panels, burglar or fire   
 alarms), other than those of heading  alarms), other than those of heading   
 No 8512 or 8530 : No 8512 or 8530 :  
8531.20  - Indicator panels incorporating liquid  853 1.20  - Indicator panels incorporating liquid   
 crystal devices (LCD) or light emitting  crystal devices (LCD) or light emitting   
 diodes (LED) : diodes (LED) :  
 -- Other : -- Other :  
 --- Incorporating liquid crystal devices  --- Incorporating liquid crystal devices   
 (LCD) : (LCD) :  
 ---- Incorporating active matrix liquid  8531.20.50  ---- Incorporating active matrix liquid  0 JP, US 
 crystal devices (LCD) : crystal devices (LCD).  
8531.20.51  ----- Colour.  0 JP, US  
8531.20.59  ----- Black and white or other  0 JP, US  
 monochrome.   
8531.20.80 ---- Other. 853 1.20.80 ---- Other.  
8531.80  - Other apparatus : 8531.80  - Other apparatus :  
8531.80.90  -- Other 0 JP, US -- Other  
ex8531.80.90  Projection type flat panel display units;  0 JP, US 8531.80.30  --- Flat panel display devices.  0 JP, US 
 flat panel displays.    
 WT/ACC/SPEC/LTU/15/Add.1 
Page 34 HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
 8531.80.80  --- Other.  0 JP, US 
8531.90  - Parts : 8531.90  - Parts :  
8531.90.10  -- Of apparatus of subheading  0 JP, US  
 8531 20.   
 8531.90.20  -- Of apparatus of subheadings  0 JP, US 
  8531 20 and 8531 80 30.   
 8531.90.80  -- Other. 0 JP, US 
8531.90.90  -- Other 0 JP, US  
ex8531.90.90  Flat panel displays; printed circuit  0 JP, US  
 assemblies.   
8532  Electrical capacitors, fixed, variable or  853 2  Electrical capacitors, fixed, variable or   
 adjustable (pre-set) : adjustable (pre-set) :  
8532.24 -- Ceramic dielectric, multilayer : 8532.24 -- Ceramic dielectric multilayer. 0 JP, US 
8532.24.10  --- With connecting leads.  0 JP, US  
8532.24.90  --- Other.  0 JP, US  
8536  Electrical apparatus for switching or 853 6  Electrical apparatus for switching or  
 protecting electrical circuits, or for  protecting electrical circuits, or for   
 making connections to or in electrical  making connections to or in electrical   
 electrical circuits (for example,  electrical circuits (for example,   
 switches, relays, fuses, surge  switches, relays, fuses, surge   
 suppressors, plugs, sockets, lamp- suppressors, plugs, sockets, lamp-  
 holders, junction boxes), for a voltage  holders, junction boxes), for a voltage   
 not exceeding 1000 V: not exceeding 1000 V:  
8536.50 - Other switches  15 JP  8536.50 - Other switches   
ex8536.50.90  Electronic AC switches consisting of  0 JP, US 8536.50.03  -- Electronic AC switches consisting of  0 JP, US 
 optically coupled input and output  optically coupled input and output   
 circuits (Insulated thyristor AC  circuits (insulated thyristor AC   
 switches); electronic switches,  switches).   
 including temperature protected  8536.50.05  -- Electronic switches, including  0 JP, US 
 electronic switches, consisting of a  temperature prot ected electronic   
 transistor and a logic chip (chip-on-  switches, consisting of a transistor   
 chip technology) for a voltage not  and a logic chip (chip-on-chip   
 exceeding 1000 volts;  technology).   
 electromechanical snap-action  8536.50.07  -- Electromechanical snap-action  0 JP, US 
 switches for a current not exceeding  switches for a current not exceeding    
  WT/ACC/SPEC/LTU/15/Add.1
 Page 35HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
 11 amps.  11 A.   
 -- Other :   
 --- For a voltage not exceeding 60 V:   
 8536.50.11  ---- Push-button switches.  15 JP 
 8536.50.15  ---- Rotary switches.  15 JP 
 8536.50.19  ---- Other.  15 JP 
 8536.50.80  --- Other.  15 JP 
8541  Diodes, transistors and similar  8541  Diodes, transistors and similar   
 semiconductor devices; photosensitive  semiconductor devices; photosensitive   
 semiconductor devices, including  semiconductor devices, including   
 photovoltaic cells whether or not  photovoltaic cells whether or not   
 assembled in modules or made up  assembled in modules or made up   
 into panels; light-emitting diodes;  into panels; light-emitting diodes;   
 mounted piezo-electric crystals : mounted piezo-electric crystals :  
8541.10 - Diodes, other than photosensi tive or  8541.10 - Diodes, other t han photosensitive or  0 JP, US 
 light-emitting diodes : light-emitting diodes.  
8541.10.10  -- Wafers not yet cut into chips.  0 JP, US  
 -- Other :   
8541.10.91  --- Power rectifier diodes.  0 JP, US  
8541.10.99  --- Other.  0 JP, US  
 - Transistors, other than  - Transistors, other than   
 photosensitive transistors : photosensitive transistors :  
8541.21 -- With a dissipation rate of less than  8541.21 -- With a dissipation rate of less than  0 JP, US 
 1 W : 1 W.  
8541.21.10  --- Wafers not yet cut into chips.  0 JP, US  
8541.21.90  --- Other.  0 JP, US  
8541.29 -- Other : 8541.29 -- Other. 0 JP, US 
8541.29.10  --- Wafers not yet cut into chips.  0 JP, US  
8541.29.20  --- PowerMOS field effective transistors.  0 JP, US  
8541.29.30  --- Insulated gate bipolar transistors  0 JP, US  
 (IGBTs).   
8541.29.80  --- Other.  0 JP, US  
8541.30 - Thyristors, diacs and triacs, other  8541.30 - Thyristors, diacs and triacs, other  0 JP, US 
 than photosensitive devices : than photosensitive devices.  
8541.30.10  -- Wafers not yet cut into chips.  0 JP, US   
 WT/ACC/SPEC/LTU/15/Add.1 
Page 36 HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
8541.30.90  -- Other.  0 JP, US  
8541.40 - Photosensitive semiconductor  854 1.40 - Photosensitive semiconductor   
 devices, including photovoltaic cells  devices, including photovoltaic cells   
 whether or not assembled in modules  whether or not assembled in modules   
 or made up into panels; light-emitting  or made up into panels; light-emitting   
 diodes : diodes :  
 -- Light-emitting diodes :  8541.40.10 -- Light-emitting diodes, including  0 JP, US 
8541.40.10 --- Laser diodes.  0 JP, US laser diodes.   
8541.40.19  --- Other.  0 JP, US  
 -- Other : 8541.40.90  -- Other. 0 JP, US 
8541.40.91  --- Solar cells whether or not  0 JP, US  
 assembled in modules or made up   
 into panels.   
8541.40.93  --- Photodiodes, phototransistors,  0 JP, US  
 photothyristors or photocouples.   
8541.40.99  --- Other.  0 JP, US  
8541.50 - Other semiconductor devices : 8541.50 - Other semiconductor devices.  0 JP, US 
8541.50.10 -- Wafers not yet cut into chips. 0 JP, US  
8541.50.90 -- Other. 0 JP, US  
8542  Electronic integrated circuits and  8542  Electronic integrated circuits and   
 microassemblies : microassemblies :  
 - Monolithic digital integrated circuits : - Monolithic digital integrated circuits :  
8542.13 -- Metal oxide semiconductors (MOS  8542.13 -- Metal oxide semiconductors (MOS   
 technology) : technology) :  
 --- Other : --- Other :  
 ---- Memories : ---- Memories :  
 ----- Static random-access memories  8542.13.20  ----- Static random-access memories  0 JP, US 
 (S-RAMs), including cache random- (S-RAMs), including cache random-  
 access memories (cache-RAMs) : access memories (cache-RAMs).  
8542.13.22  ------ With a storage capacity not  0 JP, US  
 exceeding 256 Kbits.   
8542.13.25  ------ With a storage capacity exceeding  0 JP, US  
 256 Kbits but not exceeding 1 Mbit.   
8542.13.27  ------ With a storage capacity  0 JP, US  
 exceeding 1 Mbit.    
  WT/ACC/SPEC/LTU/15/Add.1
 Page 37HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
 ----- UV erasable, progr ammable,  8542.13.30  ----- UV erasable, programmable,  0 JP, US 
 read only memories (EPROMs) : read only memories (EPROMs).  
8542.13.32  ------ With a storage capacity not  0 JP, US  
 exceeding 1 Mbit.   
8542.13.35  ------ With a storage capacity exceeding  0 JP, US  
 1 Mbit but not exceeding 4 Mbits.   
8542.13.37  ------ With a storage capacity exceeding  0 JP, US  
 4 Mbits.   
 ----- Electrically erasable,  ----- Electrically erasable,   
 programmable, read only memories  programmable, read only memories   
 (E2PROMs), including FLASH  (E2PROMs), including FLASH   
 E2PROMs: E2PROMs:  
 ------ FLASH E2PROMs: ------ FLASH E2PROMs:  
8542.13.41  ------- With a storage capacity not  0 JP, US  
 exceeding 1 Mbit.   
 8542.13.42  ------- With a storage capacity not  0 JP, US 
 exceeding 4 Mbits.   
8542.13.43  ------- With a storage capacity  0 JP, US  
 exceeding 1 Mbit but not exceeding   
 4 Mbits.   
 8542.13.46  ------- With a storage capacity  0 JP, US 
 exceeding 16 Mbits but not exceeding   
 32 Mbits.   
8542.13.47  ------- With a storage capacity  0 JP, US  
 exceeding 16 Mbits.   
 8542.13.48  ------- With a storage capacity  0 JP, US 
 exceeding 32 Mbits.   
8542.13.51  ----- Read only memories, non-   
 programmable (ROMs); content   
 addressable memories (CAMs); first-   
 in/first-out read/write memories   
 (FIFOs); last-in/first-out read/write   
 memories (LIFOs); ferroelectric   
 memories.  0 JP, US  
8542.13.53  ----- Other memories. 0 JP, US   
 WT/ACC/SPEC/LTU/15/Add.1 
Page 38 HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
 8542.13.54  ----- Other memories. 0 JP, US 
JP,  ---- Microcontrollers and microcomputers : 8542.13.60  ---- Microcontrollers and 
microcomputers. 0 
US 
8542.13.61  ----- With a processing capacity not  0 JP, US  
 exceeding 4 bits.   
8542.13.63  ----- With a processing capacity  0 JP, US  
 exceeding 4 bits but not exceeding   
 8 bits.   
8542.13.65  ----- With a processing capacity  0 JP, US  
 exceeding 8 bits but not exceeding   
 16 bits.   
8542.13.67  ----- With a processing capacity  0 JP, US  
 exceeding 16 bits but not exceeding 32 
bits  
8542.13.69  ----- With a processing capacity  0 JP, US  
 exceeding 32 bits.   
 ---- Other : ---- Other :  
8542.13.70 ----- Microperipherals. 0 JP, US 8542.13.70 ----- Microperipherals. 0 JP, US 
 ----- Other : 8542.13.80  ----- Other. 0 JP, US 
8542.13.72  ------ Full custom logic circuits.  0 JP, US  
8542.13.74  ------ Gate arrays.  0 JP, US  
8542.13.76  ------ Standard cells.  0 JP, US  
8542.13.82  ------ Programmable logic circuits.  0 JP, US  
8542.13.84  ------ Standard logic circuits.  0 JP, US  
 ------ Other :  0 JP, US  
8542.13.91  ------- Control circuits; interface circuits;  0 JP, US  
 interface circuits capable of   
 performing control functions.   
8542.13.99  ------- Other.  0 JP, US  
8542.14 -- Circuits obtained by bipolar  854 2.14 -- Circuits obtained by bipolar   
 technology : technology :  
 --- Other : --- Other :  
 ---- Memories : 8542.14.11  ---- Memories. 0 JP, US 
8542.14.10  ----- Dynamic random-access  0 JP, US  
 memories (D-RAMs).    
  WT/ACC/SPEC/LTU/15/Add.1
 Page 39HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
8542.14.15  ----- Static random-access memories  0 JP, US  
 (S-RAMs), including cache random-   
 access memories (cache RAMs); read   
 only memories, non programmable   
 (ROMs); content addressable   
 memories (CAMs); first-in/first-out   
 read/write memories (FIFOs); last-in/   
 first-out memories (LIFOs);   
 ferroelectric memories.  
8542.14.20  ----- Electrically erasable,  0 JP, US  
 programmable, read only memories   
 (E2PROMs), including FLASH   
 E2PROMs.   
8542.14.22  ------ EPROMs  0 JP, US  
8542.14.29  ------ Other  0 JP, US  
 ---- Microcontrollers and  8542.14.40 ---- Microcontrollers and  0 JP, US 
 microcomputers : microcomputers.  
8542.14.42  ----- With a processing capacity not  0 JP, US  
 exceeding 4 bits.   
8542.14.44  ----- With a processing capacity  0 JP, US  
 exceeding 4 bits.   
 ---- Other : ---- Other :  
8542.14.50 ----- Micoperipherals. 0 JP, US 8542.14.50 ----- Micoperipherals. 0 JP, US 
 ----- Other : 8542.14.90  ----- Other. 0 JP, US 
8542.14.60  ------ Full custom logic circuits.  0 JP, US  
8542.14.65  ------ Gate arrays.  0 JP, US  
8542.14.70  ------ Standard cells.  0 JP, US  
8542.14.75  ------ Programmable logic circuits.  0 JP, US  
8542.14.80  ------ Standard logic circuits.  0 JP, US  
 ------ Other :   
8542.14.91  ------- Control circuits; interface circuits;  0 JP, US  
 interface circuits capable of   
 performing control functions.   
8542.14.99  ------- Other.  0 JP, US  
8542.19 -- Other, including circuits obtained by  8542.19 -- Other, including circuits obtained by    
 WT/ACC/SPEC/LTU/15/Add.1 
Page 40 HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
 a combination of bipolar and MOS  a combination of bipolar and MOS   
 technologies (BIMOS technology) : technologies (BIMOS technology) :  
 --- Other : --- Other :  
 ---- Memories : 8542.19.40  ---- Memories. 0 JP, US 
8542.19.15  ----- Dynamic random-access  0 JP, US  
 memories (D-RAMs).   
 ----- Static random-access memories   
 (S-RAMs), including cache random-   
 access memories (cache-RAMs) :   
8542.19.22  ------ With a storage capacity not  0 JP, US  
 exceeding 256 Kbits.   
8542.19.25  ------ With a storage capacity exceeding  0 JP, US  
 256 Kbits but not exceeding 1 Mbit.   
8542.19.27  ------ With a storage capacity exceeding  0 JP, US  
 1 Mbit.   
8542.19.31  ----- UV erasable, programmable, read  0 JP, US  
 only memories (EPROMs).   
8542.19.35  ----- Electrically erasable,  0 JP, US  
 programmable, read only memories   
 (E2PROMs), including FLASH   
 E2PROMs.   
8542.19.41  ----- Read only memories, non-  0 JP, US  
 programmable (ROMs); content   
 addressable memories (CAMs); first   
 in/first out read/write memories   
 (FIFOs); last-in/first-out memories   
 (LIFOs); ferroelectric memories.   
8542.19.49  ----- Other memories.  0 JP, US   
  WT/ACC/SPEC/LTU/15/Add.1
 Page 41HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
 ---- Microcontrollers and microcomputers. 8542.19.66  ---- Microcontrollers and 
microcomputers. 0 JP,  
US 
8542.19.62  ----- With a processing capacity not  0 JP, US  
 exceeding 4 bits.   
8542.19.68  ----- With a processing capacity  0 JP, US  
 exceeding 4 bits.   
 ---- Other : ---- Other :  
8542.19.71 ----- Microperipherals. 0 JP, US 8542.19.71 ----- Microperipherals.  
 ----- Other : 8542.19.85  ----- Other. 0 JP, US 
8542.19.72  ------ Full custom logic circuits.  0 JP, US  
8542.19.74  ------ Gate arrays.  0 JP, US  
8542.19.76  ------ Standard cells.  0 JP, US  
8542.19.82  ------ Programmable logic circuits.  0 JP, US  
8542.19.84  ------ Standard logic circuits.  0 JP, US  
 ------ Other :   
8542.19.92  ------- Control circuits; interface circuits;  0 JP, US  
 interface circuits capable of   
 performing control functions.   
8542.19.98  ------- Other.  0 JP, US  
8542.30 - Other monolithic integrated circuits : 854 2.30 - Other monolithic integrated circuits :  
 --- Control circuits : 8542.30.60  --- Control circuits. 0 JP, US 
8542.30.61  ---- Smartpower circuits.  0 JP, US  
 ---- Other :   
8542.30.65  ----- Mixed analogue- digital circuits.  0 JP, US  
8542.30.69  ----- Other.  0 JP, US  
 --- Other : 8542.30.90  --- Other. 0 JP, US 
8542.30.91  ---- Smartpower circuits.  0 JP, US  
 ---- Other :   
8542.30.95  ----- Mixed analogue- digital circuits.  0 JP, US  
8542.30.99  ----- Other.  0 JP, US  
8542.40 - Hybrid integrated circuits : 8542. 40 - Hybrid integrated circuits. 0 JP, US 
8542.40.10  -- Microprocessors, microcontrollers  0 JP, US  
 and microcomputers.   
8542.40.30  -- Converters.  0 JP, US  
8542.40.50  -- Amplifiers.  0 JP, US   
 WT/ACC/SPEC/LTU/15/Add.1 
Page 42 HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
8542.40.90  -- Other.  0 JP, US  
 ---- Microcontrollers and  8542.13.60  ---- Microcontrollers and  0  JP, US 
 microcomputers : microcomputers.  
8542.13.61  ----- With a processing capacity not  0 JP, US  
 exceeding 4 bits.   
8542.13.63  ----- With a processing capacity  0 JP, US  
 exceeding 4 bits but not exceeding   
 8 bits.   
8542.13.65 ----- With a processing capacity  0 JP, US  
 exceeding 8 bits but not exceeding   
 16 bits.   
8542.13.67  ----- With a processing capacity  0 JP, US  
 exceeding 16 bits but not exceeding   
 32 bits.   
8542.13.69  ----- With a processing capacity  JP, US  
 exceeding 32 bits.   
8543  Electrical machines and apparatus,  854 3  Electrical machines and apparatus,   
 having individual functions, not  having individual functions, not   
 specified or included elsewhere in  specified or included elsewhere in   
 this chapter : this chapter :  
8543.30 - Machines and apparatus for  854 3.30 - Machines and apparatus for   
 electroplating, electrolysis or  electroplating, electrolysis or   
 electrophoresis : electrophoresis :  
8543.30.10  -- Apparatus for wet etching,  0 JP, US  
 developing, stripping or cleaning   
 semiconductor wafers.   
 8543.30.20  -- Apparatus for wet etching,  0 JP, US 
 developing, stripping or cleaning   
 semiconductor wafers or flat panel   
 display substrates.   
 8543.30.80  -- Other. 0 JP 
8543.30.90  -- Other 0 JP  
ex8543.30.90  -- Apparatus for wet etching,  0 JP, US  
 developing, stripping or cleaning   
 semiconductor wafers and flat panel    
  WT/ACC/SPEC/LTU/15/Add.1
 Page 43HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
 displays.   
 - Other machines and apparatus : - Other machines and apparatus :  
8543.89 -- Other : 8543.89 -- Other :  
8543.89.10 --- Flight recorders, for use in civil  0 JP 8543.89.10  --- Flight recorders, for use in civil  0 JP 
 aircraft. aircraft.  
 --- Other :   
 8543.89.15  ---- Electrical machines with  0 JP, US 
 translation or dictionary functions.   
8543.89.20 --- Aerial amplifiers. 10 JP 8543.89.20 ---- Aerial amplifiers. 10 JP 
 --- Sunbeds, sunlamps and similar  ---- Sunbeds, sunlamps and similar   
 suntanning equipment : suntanning equipment :  
 ---- For fluorescent tubes using  ----- For fluorescent tubes using   
 ultraviolet A rays : ultraviolet A rays :  
8543.89.51 ----- With a maximum tube length of  10 JP 8543.89.51 ------ With a maximum tube length of  10 JP 
 100 cm. 100 cm.  
8543.89.55 ----- Other. 10 JP 8543.89.55 ------ Other. 10 JP 
8543.89.59 ---- Other. 10 JP 8543.89.59 ----- Other. 10 JP 
 8543.89.65  ---- Apparatus for physical deposition  0 JP, US 
 on semiconductor wafers.   
8543.89.70  --- Apparatus for physical deposition  0 JP, US  
 by sputtering on semiconductor   
 wafers.   
 8543.89.73  ---- Encapsulation equipment for  0 JP, US 
 assembly of semi conductor devices.   
 8543.89.75  ---- Apparatus for physical deposition  10 JP 
 by sputtering on LCD substrates.   
 8543.89.79  ---- Apparatus enabling automatic data  0 JP, US 
 processing machines and units   
 thereof to process audio signals   
 (sound cards); upgrade kits, for   
 automatic data processing machines   
 and units thereof, put up for retail sale,   
 consisting of, at least, speakers and/or   
 microphone, and an electronic   
 assembly that enables the automatic    
 WT/ACC/SPEC/LTU/15/Add.1 
Page 44 HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
 data processing machine and units   
 thereof to process audio signals   
 (sound cards).   
8543.89.90  --- Other 10 JP 8543.89.95  ---- Other. 10 JP 
ex8543.89.90  Electrical machines with translation or  0 JP, US  
 or dictionary functions.  Physical   
 deposition apparatus for   
 semiconductor production;   
 Encapsulation equipment for assembly   
 of semiconductors; Apparatus enabling   
 automatic data processing machines   
 and units thereof to process audio   
 signals (sound cards); upgrade kits, for   
 automatic data processing machines   
 and units thereof, put up for retail sale,   
 consisting of, at least, speakers and/or   
 microphone, and an electronic   
 assembly that enables the automatic   
 data processing machine and units   
 thereof to process audio signals   
 (sound cards).   
8543.90 - Parts : 8543.90 - Parts :  
8543.90.10 -- Assemblies and sub-assemblies  0 JP 8543.90.10 -- Assemblies and sub-assemblies  0 JP 
 consisting of two or more parts or  consisting of two or more parts or   
 pieces fastened or joined together, for  pieces fastened or joined together, for   
 flight recorders, for use in  civil aircraft. flight recorder s, for use in civil aircraft.  
 8543.90.20  -- Electronic assemblies for  0 JP, US 
 incorporation into automatic data   
 processing machines.   
 8543.90.30  -- Of apparatus of subheadings  0 JP, US 
 8543 11 00, 8543 30 20, 8543 89 65   
 or 8543 89 73.   
 8543.90.40  -- Of apparatus of subheading  0 JP 
 8543 89 75.   
 8543.90.80  -- Other. 0 JP  
  WT/ACC/SPEC/LTU/15/Add.1
 Page 45HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
8543.90.90  -- Other 0 JP  
ex8543.90.90  Printed circuit assemblies; Parts of  0 JP, US  
 apparatus for physical deposition by   
 sputtering on semiconductor wafers;   
 parts of apparatus for wet etching,   
 developing, stripping or cleaning   
 semiconductor wafers and flat panel   
 displays; parts of encapsulation   
 equipment for assembly of   
 semiconductors; parts for physical   
 deposition apparatus for   
 semiconductor production; parts of   
 apparatus for wet etching, developing,   
 stripping or cleaning semiconductor   
 wafers and flat panel displays; parts   
 of ion implanters for doping   
 semiconductor materials.   
8544  Insulated (including enamelled or  8544  Insulated (including enamelled or   
 anodised) wire, cable (including anodised) wire, cable (including  
 coaxial cable) and other insulated  coaxial cable) and other insulated   
 electric conductors, whether or not  electric conductors, whether or not   
 fitted with connectors; optical fibre  fitted with connectors; optical fibre   
 cables, made up of individually  cables, made up of individually   
 sheathed fibres, whether or not  sheathed fibres, whether or not   
 assembled with electric conductors or assembled with electric conductors or  
  fitted with connectors:  fitted with connectors:  
 - Other electric conductors, for a  - Other electric conductors, for a   
 voltage exceeding 80 volts but not  voltage exceeding 80 volts but not   
 exceeding 1 000 volts : exceeding 1 000 volts :  
8544.51 -- Fitted with connectors. 15 JP 8544.51 -- Fitted with connectors :  
ex8544.51  Other electric conductors, for a voltage  0 JP, US 8544.51.10  --- Of a kind used for  0 JP, US 
 exceeding 80V, but not exceeding  telecommunications.   
 1000V, fitted with connectors, of a kind   
 used for telecommunications.   
 8544.51.90  --- Other.  15 JP  
 WT/ACC/SPEC/LTU/15/Add.1 
Page 46 HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
8548 Waste and scrap of primary cells,  854 8 Waste and scrap of primary cells,   
 primary batteries and electric  primary batteries and electric   
 accumulators; spent primary cells,  accumulators; spent primary cells,   
 spent primary batteries and spent  spent primary batteries and spent   
 electric accumulators; electrical parts  electric accumulators; electrical parts   
 of machinery or apparatus, not  of machinery or apparatus, not   
 specified or included elsewhere in  specified or included elsewhere in   
 this chapter: this chapter:  
8548.90 - Other 0 JP 8548.90 - Other :  
ex8548.90  Memories in mult icombinational forms  0 JP, US 8548.90.10  -- Memories in multicombinational  0 JP, US 
 such as stack D-RAMs and modulies.  forms such as stack D-RAMs and   
 modules.   
 8548.90.90  -- Other.  0 JP 
8803  Parts of goods of heading No 8801 or  880 3  Parts of goods of heading No 8801 or   
 8802: 8802:  
8803.90 - Other : 8803.90 - Other :  
8803.90.10 -- Of kites. 15 8803.90.10 -- Of kites. 15  
 8803.90.20  -- Of spacecraft (including satellites).  15  
 8803.90.30  -- Of suborbital and spacecraft launch  15  
 vehicles.   
 -- Other : -- Other :  
8803.90.91 --- For use in civil aircraft and gliders. 0 880 3.90.91 --- For use in civil aircraft and gliders. 0  
8803.90.99  --- Other. 15 8803.90.98  --- Other. 15  
9006  Photographic (other than  900 6  Photographic (other than   
 cinematographic) cameras;  cinematographic) cameras;   
 photographic flashlight apparatus and  photographic flashlight apparatus and   
 flashbulbs other than discharge lamps  flashbulbs other than discharge lamps   
 of heading No 8539 : of heading No 8539 :  
 - Parts and accessories : - Parts and accessories :  
9006.91 -- For cameras. 10 JP 9006.91 -- For cameras :  
 9006.91.10  --- Of apparatus of subheading  0 JP, US 
 9006 10 10.   
 9006.91.90  --- Other.  10 JP 
9006.99 -- Other 0 JP 9006.99 -- Other. 0 JP 
ex9006.99  Parts and accessories from pattern  0 JP, US   
  WT/ACC/SPEC/LTU/15/Add.1
 Page 47HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
 generating apparatus of a kind used   
 for producing masks or reticles from   
 photoresist coated substrates.   
9009  Photocopying apparatus in corporating  9009  Photocopyi ng apparatus incorporating   
 an optical system or of the contact type  an optical system or of the contact type  
 and thermo-copying apparatus : and thermo-copying apparatus :  
9009.90 - Parts and accessories : 9009.90 - Parts and accessories. 0 JP, US 
9009.90.10  -- Of electrostatic photocopying  0 JP, US  
 apparatus or other photocopying   
 apparatus incorporating an optical   
 system.   
9009.90.90  -- Other.  0 JP, US  
9010  Apparatus and equipment for  901 0  Apparatus and equipment for   
 photographic (including  photographic (including   
 cinematographic) laboratories  cinematographic) laboratories   
 (including apparatus for the projection (including apparatus for the projection  
 or drawing of circuit patterns on  or drawing of circuit patterns on   
 sensitized semi-conductor materials),  sensitized semi-conductor materials),   
 not specified or included elsewhere in not specified or included elsewhere in  
 this chapter; negatoscopes; projection  this chapter; negatoscopes; projection   
 screens: screens:  
9010.50 - Other apparatus and equipment for  0 CA, JP 9010.50 - Other apparatus and equipment for   
 photographic (including  photographic (including   
 cinematographic) laboratories;  cinematographic) laboratories;   
 negatoscopes negatoscopes :  
ex9010.50  Apparatus for projection, drawing or  0 CA, JP, 
US 9010.50.10  -- Apparatus for the projection of   0 CA, JP, 
US 
 plating circuit patterns on sensitized  drawing of circuit patterns on sensitized  
 semiconductor materials and flat  flat panel display substrates.   
 panel displays.   
 9010.50.90  -- Other.  0 CA, JP 
9010.90 - Parts and accessories 0 CA, JP 9010.90 - Parts and accessories :  
ex9010.90  Parts and accessories of the  0 CA, JP, 
US 9010.90.10  -- Of apparatus of subheading  0 CA, JP, 
US 
 apparatus of Headings No 9010 41 to  9010 41 00, 9010 42 00, 9010 49 00    
 WT/ACC/SPEC/LTU/15/Add.1 
Page 48 HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
 9010 49.  or 9010 50 10.   
 9010.90.90  -- Other. 0 CA, JP 
9011  Compound optical microscopes,  9011  Compound optical microscopes,   
 including those for photomicrography, including those for photomicrography,  
 cinephoto- micrography or  cinephotomicrography or  
 microprojection : microprojection :  
9011.10 - Stereoscopic microscopes 0 JP 9011.10 - Stereoscopic microscopes :  
ex9011.10  Optical stereoscopic microscopes  0 JP, US 9011.10.10  -- Fitted with equipment specifically  0 JP, 
US 
 fitted with equipment specifically  designed for the handling and   
 designed for the handling and  transport of semiconductor wafers or   
 transport of semiconductor wafers or  reticles.   
 reticles.    
 9011.10.90  -- Other.  0 JP 
9011.20 - Other microscopes, for  0 JP  9011.20 - Other microscopes, for   
 photomicrography,  photomicrography,   
 cinephotomicrography or micro-  cinephotomicrography or  
 projection. microprojection :  
ex9011.20  Photomicrographic microscopes fitted  0 JP, US 9011.20.10  -- Photomicrographic microscopes  0 JP, US 
 with equipment specifically designed  fitted with equipment specifically   
 for the handling and transport of  designed for the handling and   
 semiconductor wafers or reticles.  transport of semiconductor wafers   
 or reticles.   
 9011.20.90  -- Other.  0 JP 
9011.90 - Parts and accessories 0 JP 9011.90 - Parts and accessories :  
ex9011.90  Parts and accessories of optical  0 JP, US 9011.90.10  -- Of apparatus of subheading  0 JP, US 
 stereoscopic and photomicrographic  9011 10 10 or 9011 20 10.   
 microscopes fitted with equipment   
 specifically designed for the handling   
 and transport of semiconductor wafers   
 or reticles.   
 9011.90.90  -- Other.  0 JP 
9012  Microscopes other than optical  9012  Microscopes other than optical   
 microscopes; diffraction apparatus : microscopes; diffraction apparatus :  
9012.10 - Microscopes other than optical  0 JP  9012.10 - Microscopes other than optical    
  WT/ACC/SPEC/LTU/15/Add.1
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HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
 microscopes and diffraction apparatus microscopes and diffraction apparatus:  
ex9012.10  Electron beam microscopes fitted with  0 JP, US 9012.10.10 -- Electron microscopes fitted with  0 JP, US 
 equipment specifically designed for the  equipment specifically designed for the   
 handling and transport of  handling and transport of   
 semiconductor wafers or reticles.  semiconductor wafers or reticles.   
 9012.10.90 -- Other.  0 JP 
9012.90 - Parts and accessories 0 JP 9012.90 - Parts and accessories :  
ex9012.90  Parts and accesories of electron beam  0 JP, US 9012.90.10  -- Of apparatus of subheading  0 JP, US 
 microscopes fitted with equipment  9012 10 10.   
 specifically designed for the handling   
 and transport of semiconductor wafers   
 or reticles.   
 9012.90.90  -- Other.  0 JP 
9013  Liquid crystal devices not constituting  901 3  Liquid crystal devi ces not constituting   
 articles provided for more specifically articles provided for more specifically  
 in other headings; lasers, other than  in other headings; lasers, other than   
 laser diodes; other optical appliances  laser diodes; other optical appliances   
 and instruments, not specified or  and instruments, not specified or   
 included elsewhere in this chapter: included elsewhere in this chapter:  
9013.80 - Other devices, appliances and  901 3.80 - Other devices, appliances and   
 instruments : instruments :  
 -- Liquid crystal devices : -- Liquid crystal devices :  
 --- Active matrix liquid crystal devices : 9013.80.20  --- Active matrix liquid crystal devices. 0 JP, US 
9013.80.11  ---- Colour.  0 JP, US  
9013.80.19  ---- Black and white or other  0 JP, US  
 monochrome.   
9017  Drawing, marking-out or mathematical  901 7  Drawing, marking-out or mathematical   
 calculating instruments (for example,  calculating instruments (for example,   
 drafting machines, pantographs,  drafting machines, pantographs,   
 protractors, drawing sets, slide rules,  protractors, drawing sets, slide rules,   
 disc calculators); instruments for  disc calculators); instruments for   
 measuring length, for use in the hand  measuring length, for use in the hand   
 (for example, measuring rods and  (for example, measuring rods and   
 tapes, micrometers, callipers), not  tapes, micrometers, callipers), not   
 specified or included else-where in  specified or included elsewhere in   
 WT/ACC/SPEC/LTU/15/Add.1 
Page 50 HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
 this chapter: this chapter:  
9017.10 - Drafting tables and machines,  0 JP, US 9017.10 - Drafting tables and machines,   
 whether or not automatic wh ether or not automatic :  
ex9017.10  Plotters.  0 JP, US 9017.10.10  -- Plotters.  0 JP, US 
 9017.10.90  -- Other.  0 JP, US 
9017.20 - Other drawing, marking-out or  901 7.20 - Other drawing, marking-out or   
 mathematical calculating instruments: mathematical calculating instruments:  
 9017.20.05  -- Plotters.  0 JP, US 
 -- Drawing instruments :  -- Other drawing instruments:   
9017.20.11 --- Drawing sets. 10 JP 9017.20.11 --- Drawing sets. 10 JP 
9017.20.19 --- Other 10 JP 9017.20.19 --- Other. 10 JP 
ex9017.20.19  Plotters.  0 JP, US  
9017.90 - Parts and accessories 0 JP 9017.90 - Parts and accessories :  
ex9017.90  Parts and accessories from pattern  0 JP, US 9017.90.10  -- For apparatus of subheading  0 JP, US 
 generating apparatus of a kind used  9017 20 31.   
 for producing masks or reticles from   
 photoresist coated substrates; parts of   
 such pattern generating apparatus.   
 9017.90.90  -- Other.  0 JP 
9027  Instruments and apparatus for physical  9027  Instruments and apparatus for physical  
 or chemical analysis (for example,  or chemical analysis (for example,   
 polarimeters, refractometers,  polarimeters, refractometers,   
 spectrometers, gas or smoke analysis  spectrometers, gas or smoke analysis   
 apparatus); instruments and apparatus  apparatus); instrum ents and apparatus  
 for measuring or checking viscosity,  for measuring or checking viscosity,   
 porosity, expansion, surface tension or  porosity, expansion, surface tension or   
 the like; instruments and apparatus for  the like; instruments and apparatus for   
 measuring or checking quantities of  measuring or checking quantities of   
 heat, sound or light (including exposure  heat, sound or light (including exposure  
 meters); micromates: meters); micromates:  
9027.20 - Chromatographs and electrophoresis  9027.20 - Chromatographs and electrophoresis  0 JP, US 
 instruments : instruments.  
9027.20.10  -- Chromatographs.  0 JP, US  
9027.20.90  -- Electrophoresis instruments.  0 JP, US  
9027.80 - Other instruments and apparatus : 9027.80 - Other in struments and apparatus :   
  WT/ACC/SPEC/LTU/15/Add.1
 Page 51HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
 -- Electronic : -- Electronic :  
9027.80.11 --- pH meters, rH meters and other  0 JP, US 9027.80.11 --- pH meters, rH meters and other  0 JP, US 
 apparatus for measuring conductivity. apparatus for measuring conductivity.  
 9027.80.13 --- Apparatus for performing  0 JP, US 
 measurements of the physical   
 properties of semiconductor materials   
 or of LCD substrates or associated   
 insulating and conducting layers during  
 the semiconductor wafer production   
 process or the LCD production process   
9027.80.15  --- Apparatus for performing  0 JP, US  
 measurements of the physical   
 properties of semiconductor materials   
 or associated insulating and   
 and conducting layers during the   
 semiconductor wafer production   
 process.   
9027.80.18  --- Other. 0 JP, US 9027.80.17  --- Other. 0 JP, US 
 -- Other : -- Other :  
9027.80.91 --- Viscometers, porosimeters and  0 JP, US 9027.80.91 --- Viscometers, porosimeters and  0 JP, US 
 expansion meters. expansion meters.  
 9027.80.93 --- Apparatus for performing  0 JP, US 
 measurements of the physical   
 properties of semiconductor materials   
 or of LCD substrates or associated   
 insulating and conducting layers during  
 the semiconductor wafer production   
 process or the LCD production process   
9027.80.95  --- Apparatus for performing  0 JP, US  
 measurements of the physical   
 properties of semiconductor materials   
 or associated insulating and   
 and conducting layers during the   
 semiconductor wafer production   
 process.    
 WT/ACC/SPEC/LTU/15/Add.1 
Page 52 HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
9027.80.98  --- Other. 0 JP, US 9027.80.97  --- Other. 0 JP, US 
9027.90  - Microtomes; parts and accessories : 902 7.90  - Microtomes; parts and accessories :  
9027.90.10 -- Microtomes. 10 JP 9027.90.10 -- Microtomes. 10 JP 
 -- Parts and accessories:  
 9027.90.50  --- Of apparatus of subheadings  0 JP, US 
 9027 20 to 9027 80.   
 9027.90.80  --- Of microtomes or of gas or smoke  10 JP 
 analysis apparatus.   
9027.90.90  -- Parts and accessories 10 JP  
ex9027.90.90  Printed circuit assemblies. Portable  0 JP, US  
 receivers for calling, alerting or   
 paging.   
9030  Oscilloscopes, spectrum analysers  903 0  Oscilloscopes, spectrum analysers   
 and other instruments and apparatus  and other instruments and apparatus   
 for measuring or checking electrical  for measuring or checking electrical   
 quantities, excluding meters of heading quantities, excluding meters of heading  
 No 9028; instruments and apparatus  No 9028; instruments and apparatus   
 for measuring or detecting alpha, beta,  for measuring or detecting alpha, beta,  
 gamma, X-ray, cosmic or other  gamma, X-ray, cosmic or other   
 ionizing radiations: ionizing radiations:  
9030.90  - Parts and accessories : 9030.90  - Parts and accessories :  
9030.90.10 -- For use in civil aircraft. 0 JP 9030.90.10 -- For use in civil aircraft. 0 JP 
 -- Other  
JP,  9030.90.20  --- For apparatus of subheading  0 
US 
 9030 82 00.   
 9030.90.80  --- Other.  0 JP 
9030.90.90  -- Other 0 JP  
ex9030.90.90  Parts and accessories of instruments  0 JP, US  
 and apparatus for measuring or   
 checking semiconductor wafers or   
 devices; printed circuit assemblies.   
9031  Measuring or checking instruments,  903 1  Measuring or checking instruments,   
 appliances and machines, not  appliances and machines, not   
 specified or included elsewhere in this  specified or included elsewhere in this    
  WT/ACC/SPEC/LTU/15/Add.1
 Page 53HS used in the document WT/ACC/SPEC/LTU/15     HS in force      
  
HS Description  Bound  Implemen- INR HS  Description  Bound  Implemen- INR 
 rate  tation  rate tation   
 chapter; profile projectors : chapter; profile projectors :  
 - Other optical instruments and  - Other optical instruments and   
 appliances : appliances :  
9031.49 -- Other  0 JP 9031.49 -- Other. 0 JP, US 
9031.49.10  --- For measuring surface particulate  0 JP, US  
 contamination on semiconductor   
 wafers.   
9031.90 - Parts and accessories : 9031.90 - Parts and accessories :  
9031.90.10 -- Of instruments, appliances and  0 JP 9031.90.10 -- Of instruments, appliances and  0 JP 
 machines of subheading 9031.80, for  machines of subheading 9031.80, for   
 use in civil aircraft. use in civil aircraft.  
 -- Other :   
 9031.90.20  --- For apparatus of subheading  0 JP, US 
 9031 41 00 or for optical instruments   
 and appliances for measuring surface   
 particulate contamination on   
 semiconductor wafers of   
 subheading 9031 49 00.   
 9031.90.30  --- For apparatus of subheading  0 JP, US 
 9031 80 32.   
 9031.90.80  --- Other.  0 JP 
9031.90.90  -- Other 0 JP  
ex9031.90.90  Parts and accessories of optical  0 JP, US  
 instruments and appliances for   
 inspecting semiconductor wafers or   
 devices or for inspecting masks,   
 photomasks or reticles used in   
 manufacturing semiconductor devices;   
 parts and accessories of optical   
 instruments and appliances for   
 measuring surface particulate   
 contamination on semiconductor   
 wafers.   
 
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