# Development of a Wet-type Pad Contact Area Measurement Apparatus for Cu-CMP

Le Nam Quoc Huy, Yueh-Hsun Tsai, Le Ngoc Quynh Hoa, Chao-Chang

A.Chen

► To cite this version:

Le Nam Quoc Huy, Yueh-Hsun Tsai, Le Ngoc Quynh Hoa, Chao-Chang A.Chen. Development of a Wet-type Pad Contact Area Measurement Apparatus for Cu-CMP. International Conference on Planarization/CMP Technology, Oct 2023, Kanazawa, Japan. hal-04270313

HAL Id: hal-04270313

https://hal.science/hal-04270313v1

Submitted on 4 Nov 2023

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# Development of a Wet-type Pad Contact Area Measurement Apparatus for Cu-CMP

Le Nam Quoc Huy<fnref n="1" />, Yueh-Hsun Tsai<fnref n="2" />, Le Ngoc Quynh Hoa<fnref n="3" />, and Chao-Chang A. Chen<fnref n="4" />

## ABSTRACT

The chemical mechanical polishing (CMP) process plays an important role in fabrication of integrated circuits. Its primary objective involves flattening both the overall wafer surface and the specific patterns on the device. As a datum plane of CMP process, the polishing pad is a crucial component for evaluating the effectiveness of the process based on wafer surface finishing via the removal of material of wafer. In order to identify the material removal rate during CMP process, it is necessary to have a thorough understanding of both the complex mechanics of the interaction between wafer surface and asperity layer on polishing pad, as well as the processes of material dissolution in polishing slurry. This study revolves around the development of an in-situ measurement apparatus explicitly designed for monitoring the real contact area between wet-type of polishing pad and the wafer surface. Moreover, a calibration material removal model of copper thin film wafer is proposed with the volume wear by abrasive particles and the dissolution of copper thin film by chemical in CMP process. Results of this study not only offer a theoretical framework and research methodology for the optimization of CMP processes, but it is also verified by comparing with experimental results of copper CMP.

<footnote n="1">¹National Taiwan University of Science and Technology, D10903816@mail.ntust.edu.tw</footnote>

<footnote n="2">²National Taiwan University of Science and Technology, D10403001@mail.ntust.edu.tw</footnote>

<footnote n="3">³Nanyang Technological University, alex.le@ntu.edu.sg</footnote>

<footnote n="4">⁴CMP Innovation Center, artchen@mail.ntust.edu.tw</footnote>