# Designing Modern Embedded Systems: Software, Hardware, and Applications

Stefan Henkler, Márcio Kreutz, Marco A. Wehrmeister, Marcelo Götz, Achim Rettberg

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Stefan Henkler, Márcio Kreutz, Marco A. Wehrmeister, Marcelo Götz, Achim Rettberg. Designing Modern Embedded Systems: Software, Hardware, and Applications. Springer Nature Switzerland, AICT-669, 2023, IFIP Advances in Information and Communication Technology, 978-3-031-34213-4. 10.1007/978-3-031-34214-1 . hal-04645295

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Editor-in-Chief

Kai Rannenberg, Goethe University Frankfurt, Germany

Editorial Board Members

TC 1 – Foundations of Computer Science
Luís Soares Barbosa①, University of Minho, Braga, Portugal

TC 2 – Software: Theory and Practice
Michael Goedicke, University of Duisburg-Essen, Germany

TC 3 – Education
Arthur Tatnall①, Victoria University, Melbourne, Australia

TC 5 – Information Technology Applications
Erich J. Neuhold, University of Vienna, Austria

TC 6 – Communication Systems
Burkhard Stiller, University of Zurich, Zürich, Switzerland

TC 7 – System Modeling and Optimization
Lukasz Stettner, Institute of Mathematics, Polish Academy of Sciences, Warsaw, Poland

TC 8 – Information Systems
Jan Pries-Heje, Roskilde University, Denmark

TC 9 – ICT and Society
David Kreps①, National University of Ireland, Galway, Ireland

TC 10 – Computer Systems Technology
Achim Rettberg, Hamm-Lippstadt University of Applied Sciences, Hamm, Germany

TC 11 – Security and Privacy Protection in Information Processing Systems
Steven Furnell①, Plymouth University, UK

TC 12 – Artificial Intelligence
Eunika Mercier-Laurent①, University of Reims Champagne-Ardenne, Reims, France

TC 13 – Human-Computer Interaction
Marco Winckler①, University of Nice Sophia Antipolis, France

TC 14 – Entertainment Computing
Rainer Malaka, University of Bremen, Germany
IFIP Advances in Information and Communication Technology

The IFIP AICT series publishes state-of-the-art results in the sciences and technologies of information and communication. The scope of the series includes: foundations of computer science; software theory and practice; education; computer applications in technology; communication systems; systems modeling and optimization; information systems; ICT and society; computer systems technology; security and protection in information processing systems; artificial intelligence; and human-computer interaction.

Edited volumes and proceedings of refereed international conferences in computer science and interdisciplinary fields are featured. These results often precede journal publication and represent the most current research.

The principal aim of the IFIP AICT series is to encourage education and the dissemination and exchange of information about all aspects of computing.

More information about this series at https://link.springer.com/bookseries/6102
Stefan Henkler · Márcio Kreutz ·
Marco A. Wehrmeister ·
Marcelo Götz · Achim Rettberg
Editors

Designing Modern
Embedded Systems:
Software, Hardware,
and Applications

7th IFIP TC 10 International
Embedded Systems Symposium, IESS 2022
Lippstadt, Germany, November 3–4, 2022
Proceedings

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Springer
Editors

Stefan Henkler
Hamm-Lippstadt University of Applied
Sciences
Hamm, Germany

Márcio Kreutz
Federal University of Rio Grande do Norte
Natal, Rio Grande do Norte, Brazil

Marco A. Wehrmeister
Federal University of Technology – Paraná
Curitiba, Paraná, Brazil

Marcelo Götz
Federal University of Rio Grande do Sul
Porto Alegre, Rio Grande do Sul, Brazil

Achim Rettberg
Hamm-Lippstadt University of Applied
Sciences
Hamm, Germany

ISSN 1868-4238

ISSN 1868-422X (electronic)

IFIP Advances in Information and Communication Technology

ISBN 978-3-031-34213-4

ISBN 978-3-031-34214-1 (eBook)

https://doi.org/10.1007/978-3-031-34214-1

© IFIP International Federation for Information Processing 2023

This work is subject to copyright. All rights are reserved by the Publisher, whether the whole or part of the material is concerned, specifically the rights of translation, reprinting, reuse of illustrations, recitation, broadcasting, reproduction on microfilms or in any other physical way, and transmission or information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed.

The use of general descriptive names, registered names, trademarks, service marks, etc. in this publication does not imply, even in the absence of a specific statement, that such names are exempt from the relevant protective laws and regulations and therefore free for general use.

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Preface

This book publishes the research and technical works presented at the International Embedded Systems Symposium (IESS) 2022. After a long period of very reduced personal contact due to the worldwide measures to fight the COVID-19 pandemic, we were pleased to hold the seventh edition of IESS as a presential event. We were very happy to once again gather our community together. Deep and fruitful discussions occurred during the event covering several topical aspects of embedded and cyber-physical systems. This book presents tendencies and solutions for problems tightly coupled to industry ranging from new methodologies to novel hardware designs, analysis approaches, engineering artificial intelligence into often-constrained embedded systems, and real-world application examples.

A broad discussion on the design, analysis, and verification of embedded and cyber-physical systems is presented in a complementary view throughout the chapters of this book. The presented research and technical works cover system-level design methods, algorithms, verification and validation techniques, estimation of system properties and characteristics, performance analysis, and real-time systems design. Also, the book presents industrial and real-world application case studies that discuss the challenges and realizations of modern embedded systems, especially when it comes to including artificial intelligence algorithms and techniques in embedded systems.

The technological advances over recent years have provided a resourceful infras-
tructure to embedded systems in terms of an enormous amount of processing and
storage capacity. Formerly external components are now integrated into a single
System-on-Chip that includes various hardware accelerators such as video decoders,
and artificial intelligence co-processors. This tendency results in a dramatic reduction in
the size and cost of embedded systems. Such a hardware infrastructure enables an
increasing number of provided services, allowing embedded systems to enter a lot of
application areas (including cyber-physical applications). As a unique technology, the
design of embedded systems is an essential element of many innovations.

Embedded systems meet their performance goals, including real-time constraints, by employing a combination of special-purpose hardware and software components tailored to the system requirements. Both the development of new features and the reuse of existing intellectual property components are essential to keeping up with ever-increasing customer requirements. Furthermore, design complexity is steadily growing, with an increasing number of components that must cooperate properly. Novel integrated co-design approaches are deemed necessary to further improve the design flow while reducing the project's overall cost.

Embedded system designers must cope with multiple goals and constraints simul-
taneously, including timing, power, reliability, dependability, maintenance, packaging,
and, last but not least, price. Safety, security, and privacy are mandatory requirements
for modern applications that also demand different levels of intelligence and autonomy.
The significance and importance of these constraints vary depending on the target
application area. Typical embedded applications include consumer electronics, auto-
motive, avionics, medical, industrial automation, robotics, communication devices,
autonomous transportation systems, and others.

The International Embedded Systems Symposium (IESS) is a unique forum to present novel ideas, exchange timely research results, and discuss the state of the art and future trends in the field of embedded systems. Contributors and participants from both industry and academia take an active part in this symposium. The IESS conference is organized by the Computer Systems Technology committee (TC10) of the International Federation for Information Processing (IFIP), especially the Working Group 10.2 "Embedded Systems".

IESS is a truly interdisciplinary conference on the design of embedded systems. Computer Science and Electrical Engineering are the predominant academic disciplines concerned with the topics covered in IESS, but many applications also involve civil, mechanical, aerospace, and automotive engineering, as well as various medical disciplines.

In 2005, IESS was held for the first time, in Manaus, Brazil. In this initial install-
ment, IESS 2005 was very successful with 30 accepted papers ranging from specifi-
cation to embedded systems applications. IESS 2007 was the second edition of the
symposium, held in Irvine (CA), USA with 35 accepted papers and 2 tutorials ranging
from analysis and design methodologies to case studies from automotive and medical
applications. IESS 2009 took place in the wonderful Schoß Montfort in Langenargen,
Germany with 28 accepted papers and 2 tutorials ranging from efficient modeling to
challenges for designers of fault-tolerant embedded systems. IESS 2013 was held in
Paderborn, Germany, at the Heinz Nixdorf Museums-Forum (HNF) with 22 full papers
and 8 short papers. IESS 2015 was held in Foz do Iguaçu, Brazil, close to the beautiful
Iguaçu Falls, with 12 full papers and 6 short papers. In 2019, IESS was held in
Friedrichshafen, Germany, with 16 full papers and 4 short papers selected and pre-
sented at the symposium.

The seventh edition, IESS 2022, was held in Lippstadt, Germany, in the modern and newly built Innovation Quarter Lippstadt. Currently, this area is attracting a considerable amount of investment for teaching and designing modern and disruptive embedded system applications for the automotive and agricultural sectors. The articles presented in this book are the result of a rigorous review process implemented by the technical program committee. All papers were comprehensively reviewed by three or four experts in the topics covered by each paper. The selection process resulted in 10 full papers and 2 short papers.

The technical program of IESS 2022 included sessions with complementary and interdisciplinary themes, e.g., design methods, model-driven engineering, hardware architectures for embedded systems, and engineering applications of artificial intelligence targeting embedded systems. The technical program included not only remarkably interesting keynotes on actual topics, such as the safe integration of learning in embedded systems, and models for smart cyber-physical systems of systems, but also an invited talk with an industrial focus on how connectivity contributes to smart farming. A very interesting and provocative panel discussion on the future of embedded systems took place and stimulate the attendees to discuss what are the current and future problems regarding embedded systems. Last but not least, the
scientific and technical papers were presented and stimulated a deep and insightful discussion between the presenters and the attendees.

First and foremost, we thank our sponsors IFIP WG 10.2 Embedded Systems, Gesellschaft für Informatik e.V. (GI), and Hamm-Lippstadt University of Applied Sciences for their generous financial support of this conference. Without these contributions, IESS 2022 would not have been possible in its current form. We would also like to thank IFIP as the organizational body for the promotion and support of the IESS conference.

Last but not least, we thank the authors for their interesting research contributions and the members of the technical program committee for their valuable time and effort in reviewing the articles. All the editors of this volume cited below, besides their formal roles in the IESS organization, have been involved in the discussions and decisions made about the analysis of review results, the book's organization in sessions, and editing of this preface. Since we are a small group that is involved in the organization of this conference, this has been usual in all previous, as well as for the current IESS edition.

In summary, excited about our strong technical program, we had a highly successful IESS 2022 conference with fruitful and lively discussions.

November 2022

Stefan Henkler

Márcio Kreutz

Marco A. Wehrmeister

Marcelo Götz

Achim Rettberg
# IFIP TC10 Working Conference: International Embedded Systems Symposium (IESS) November 3–4, 2022
Lippstadt, Germany

## General Chairs

<table><tr><td>Stefan Henkler</td><td>University of Applied Sciences Hamm-Lippstadt, Germany</td></tr><tr><td>Márcio Kreutz</td><td>Federal University of Rio Grande do Norte, Brazil</td></tr></table>

## Program Chair

<table><tr><td>Marco A. Wehrmeister</td><td>Federal University of Technology Parana, Brazil</td></tr></table>

## Steering Committee

<table><tr><td>Michael Amann</td><td>ZF Friedrichshafen, Germany</td></tr><tr><td>Jürgen Becker</td><td>University of Karlsruhe, Germany</td></tr><tr><td>Christophe Bobda</td><td>University of Florida, USA</td></tr><tr><td>Luigi Carro</td><td>Federal University of Rio Grande do Sul, Brazil</td></tr><tr><td>Florian Dittmann</td><td>Stabil Group International GmbH, Germany</td></tr><tr><td>Rainer Doemer</td><td>University of California at Irvine, USA</td></tr><tr><td>Michel Dos Santos Soares</td><td>Federal University of Sergipe, Brazil</td></tr><tr><td>Edison P. de Freitas</td><td>Federal University of Rio Grande do Sul, Brazil</td></tr><tr><td>Masahiro Fujita</td><td>University of Tokyo, Japan</td></tr><tr><td>Marcelo Götz</td><td>Federal University of Rio Grande do Sul, Brazil</td></tr><tr><td>Andreas Gerstlauer</td><td>University of Texas at Austin, USA</td></tr><tr><td>Kim Grüttner</td><td>OFFIS, Germany</td></tr><tr><td>Stefan Henkler</td><td>University of Applied Science Dortmund, Germany</td></tr><tr><td>Paula Herber</td><td>University of Münster, Germany</td></tr><tr><td>Carsten Homburg</td><td>dSPACE, Germany</td></tr><tr><td>Uwe Honekamp</td><td>Vector Informatik, Germany</td></tr><tr><td>Michael Huebner</td><td>Ruhr-University Bochum, Germany</td></tr><tr><td>Márcio Kreutz</td><td>Federal University of Rio Grande do Norte, Brazil</td></tr><tr><td>Thomas Lehmann</td><td>HAW Hamburg, Germany</td></tr><tr><td>Jose Lima</td><td>Polytechnic Institute of Braganca, Portugal</td></tr><tr><td>Monica Magalhães Pereira</td><td>Federal University of Rio Grande do Norte, Brazil</td></tr><tr><td>Marcio Oyamada</td><td>UNIOESTE, Brazil</td></tr><tr><td>Carlos E. Pereira</td><td>Federal University of Rio Grande do Sul, Brazil</td></tr><tr><td>Andy Pimentel</td><td>University of Amsterdam, The Netherlands</td></tr><tr><td>Achim Rettberg</td><td>University of Applied Sciences Hamm-Lippstadt, Germany</td></tr></table>
Hiroyuki Tomiyama

Ritsumeikan University, Japan

Kristian Rother

University of Applied Sciences Hamm-Lippstadt,
Germany

Antonio Carlos Schneider
Beck Filho

Federal University of Rio Grande do Sul, Brazil

Wolfgang
Schröder-Preikschat

Friedrich-Alexander-Universität Erlangen-Nürnberg,
Germany

Charles Steinmetz

University of Applied Sciences Hamm-Lippstadt,
Germany

Flavio Rech Wagner

Federal University of Rio Grande do Sul, Brazil

Marco A. Wehrmeister

Federal University of Technology Parana, Brazil

Cesar Albenes Zeferino

University of Vale do Itajaí, Brazil

## Co-organizing Institution

IFIP TC 10, WG 10.2
# Contents

## Design Methods and Model-Driven Engineering

Evaluating the Perceptual Properties of Crosscutting Concerns Occurrence Points Specifications in Embedded Software. 3
Marco A. Wehrmeister, Rodrigo S. C. Oliveira, and Douglas B. Renaux

Simulation of Timing Attacks and Challenges for Early Side-Channel Security Analysis 16
Marcel Schoppmeier and Paula Herber

Adaptation for Energy Saving in Time-Triggered Systems Using Meta-scheduling with Sample Points 28
Pascal Muoka, Oghenemaro Umuomo, Daniel Onwuchekwa, and Roman Obermaisser

Communication Layer Architecture for a Production Line Digital Twin Using Hierarchical Colored Petri Nets 41
Adam Sulak, Charles Steinmetz, and Achim Rettberg

## Hardware Architectures for Embedded Systems

Exploiting Heterogeneity in PIM Architectures for Data-Intensive Applications. 53
Rafael Fão de Moura and Luigi Carro

Demonstrating Scalability of the Checkerboard GPC with SystemC TLM-2.0 65
Yutong Wang, Arya Daroui, and Rainer Dömer

MAFAT: Memory-Aware Fusing and Tiling of Neural Networks for Accelerated Edge Inference. 78
Jackson Farley and Andreas Gerstlauer

Memristor-only LSTM Acceleration with Non-linear Activation Functions. 89
Rafael Fão de Moura, João Paulo C. de Lima, and Luigi Carro

Minimizing Memory Contention in an APNG Encoder Using a Grid of Processing Cells 101
Vivek Govindasamy, Emad Arasteh, and Rainer Dömer
Engineering Applications of Artificial Intelligence Targeting
Embedded Systems

Analysing the Characteristics of Neural Networks for the Recognition
of Sugar Beets

Luca Brodo, Stefan Henkler, and Kristian Rother

Synthetic Data for Machine Learning on Embedded Systems in Precision
Agriculture

Olaniyi Bayonle Alao, Kristian Rother, and Stefan Henkler

Using Network Architecture Search for Optimizing Tensor Compression

Arunachalam Thirunavukkarasu and Domenik Helms

Author Index

151