English:
[0001] This disclosure relates generally to electronic devices and, more particularly, to a device having a complementary metal oxide (CMOS) visual light (VL) and infrared (IR) imaging systems and methods thereof.
[0002] Unless otherwise indicated herein, the materials described in this section are not prior art to the claims in this application and are not admitted to the prior art by inclusion in this section.
[0003] A summary of certain embodiments disclosed herein is set forth below. It should be understood that these aspects are presented merely to provide the reader with a brief summary of these certain embodiments and that these aspects are not intended to limit the scope of this disclosure. Indeed, this disclosure may encompass a variety of aspects that may not be set forth below.
[0004] Embodiments of the disclosure related to a device having a complementary metal oxide (CMOS) visual light (VL) and infrared (IR) imaging systems and methods thereof. The device may be a security device, a surveillance device, a consumer digital device, an electronic device, a thin client, a thick client, an automotive device, an object detector, as well as any suitable devices.
[0005] In one aspect of the disclosure, the device comprises a camera having a dual VL and IR imaging sensors, a readout assembly communicatively coupled to the dual VL and IR imaging sensors, an user interface for displaying an image captured by the camera, a processor for processing the captured image, and a memory for storing the processed image is located remotely from the device, the memory in communication with at least one of the user interface or the processor. The readout assembly comprises a readout circuit vertically stacked on the dual VL and IR imaging sensors. The dual VL and IR imaging sensors comprises a plurality of visual light (VL) imaging pixels for capturing first image data in response to the visual light (VL) and an infrared (IR) imaging pixels for capturing second image data in response to IR wavelength ranges between 850 nm and 14000000 nm, one of the VL imaging pixels or the IR imaging pixels are read out by the vertically stacked readout circuit. The device further comprises a column readout assembly, wherein the IR imaging pixels are read out by the column readout assembly and wherein the VL imaging pixels are read out by the vertically stacked readout circuit. The device further comprises a controller configured to operate at least one of the VL imaging pixels and the IR imaging pixels and switching elements connected to the controller to switch the camera between an IR imaging mode and a VL imaging mode. When the camera in the IR imaging mode, the VL imaging pixels are deactivated. When the camera in the IR imaging mode, the IR imaging pixels are deactivated.
[0006] In another aspect of the disclosure, a device comprises a camera having a dual VL and IR imaging sensors and a readout assembly communicatively coupled to the dual VL and IR imaging sensors, the readout assembly comprising a first readout circuit and a second readout circuit, an user interface for displaying an image captured by the camera, a processor for processing the captured image, and a memory for storing the processed image. The dual VL and IR imaging sensors comprises a plurality of visual light (VL) imaging pixels for capturing first image data in response to the visual light (VL) and an infrared (IR) imaging pixels for capturing second image data in response to IR wavelength ranges between 850 nm and 14000000 nm. The first readout circuit is vertically stacked on the dual VL and IR imaging sensors, at least one of the VL imaging pixels or the IR imaging pixels are read out by the first readout circuit. The second readout circuit is a column readout circuit and one of the VL imaging pixels or the IR imaging pixels are read out by the second readout circuit. The device further comprises a controller configured to operate at least one of the VL imaging pixels and the IR imaging pixels and switching elements connected to the controller to switch the camera between an IR imaging mode or a VL imaging mode. When the camera in the IR imaging mode, the VL imaging pixels are deactivated. When the camera in the IR imaging mode, the IR imaging pixels are deactivated. The camera further comprises a housing and a carrier mechanically coupled to the housing for encapsulating the camera, defining a camera package.
[0007] These and other features, aspects, and advantages of this disclosure will become better understood when the following detailed description of certain exemplary embodiments is read with reference to the accompanying drawings in which like characters represent like arts throughout the drawings, wherein:
[0008] FIG. 1 is a diagram depicting an embodiment of a multi-spectral visual light (VL) and infrared (IR) imaging system.
[0010] FIG. 3 is a cross-sectional view depicting another embodiment of a super pixels imaging system.
[0011] FIG. 4 is a function block diagram depicting an embodiment of a device incorporating a visual light (VL) and infrared (IR) imaging system.
[0012] The following description is presented to enable any person skilled in the art to make and use the described embodiments, and is provided in the context of a particular application and its requirements. Various modifications to the described embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other embodiments and applications without departing from the spirit and scope of the described embodiments. Thus, the described embodiments are not limited to the embodiments shown, but are to be accorded the widest scope consistent with the principles and features disclosed herein.
[0013] Various operations may be described as multiple discrete actions or operations in turn, in a manner that is most helpful in understanding the claimed subject matter. However, the order of description should not be construed as to imply that these operations are necessarily order dependent. In particular, these operations may not be performed in the order of presentation. Operations described may be performed in a different order than the described embodiment. Various additional operations may be performed and/or described operations may be omitted in additional embodiments.
[0014] FIG. 1 is a complementary metal oxide semiconductor (CMOS) multi- spectral visual light (VL) and infrared (IR) imaging system 100. The system 100 comprises a plurality of super pixel groups 1 18 arranged in a two-dimensional array. Each super pixel group 1 18 in the plurality of super pixel groups comprises a first plurality of individual imaging sensors or pixels 108 that are sensitive to visible light (VL) and a second plurality of individual IR imaging sensors or pixels 106 that are sensitive to heat, IR, and/or near IR (NIR) in the range between 850 nm - 14000000 nm. Different information is carried at different wavelengths by the VL imaging sensors 108 and the IR imaging sensors 106. A carrier or a substrate 102 is provided for supporting the VL imaging sensors 108 and the IR imaging sensors 106. In one embodiment, the plurality of VL imaging sensors capture first image data in response to the visual light (VL) and the infrared (IR) imaging sensors capture second image data in response to heat, IR, and/or near IR (NIR). The IR imaging sensors configured to generate thermal signals after a presence of a target is detected and operate the CMOS imaging sensors. The target may be a person, an animal, or any suitable objects that radiate heat, IR, and/or near IR (NIR).
[0015] FIG. 2 is a functional block diagram depicting an embodiment of a super pixels imaging system 200 that is configured for simultaneous operation as a VL imaging device and as an IR imaging device. The super pixel imaging system 200 is one example implementation of a multi-spectral VL and infrared IR imaging system 100 depicted in FIG. 1. The illustrated embodiment of the super pixels imaging system 200 comprises a plurality of pixel elements 220 grouped together into 8x8 arrangements of super pixels 218. As used herein, the term "super pixel" refers to a group of individual pixels in the super pixels 220 where some pixels, such as pixels 206, operate as IR imaging sensors while the remaining pixels, such as pixels 208, operate as VL imaging sensors. Of course, the configuration of pixels depicted in FIG. 2 is merely illustrative of one example of pixel configurations. Alternative embodiments can use different arrangements of IR imaging sensor and VL imaging sensors other than the one example depicted in FIG. 2 without departing from the scope of the disclosure. The super pixel imaging system 200 further comprises a readout assembly 214 having a first column readout circuity 216a and a second column readout circuitry 216b. VL image data is readout by the first column readout circuity 216a and the IR image data is readout by the second column readout circuitry 216b. As illustrated, the first column readout circuity 216a coupled to the super pixels 220 readout a row of VL image data along readout column lines 210. The second column readout circuity 216b, located opposite from the first column readout circuitry 216a and is coupled to the super pixels 220 readout a row of IR image data along readout column lines 212.
[0016] The super pixels imaging system 200 further comprises a controller 222 configured to operate the super pixels 220. The controller 222 is a control device that incorporates at least one of analog and digital control circuity to operate the super pixels imaging system 200. In some embodiments, the controller 222 is implemented using CMOS digital logic circuits that are physically integrated with the super pixels imaging system 200. In another embodiment, the controller 222 is a discrete control device that is operatively connected to the super pixels imaging system 200 either on a 3D stacked configuration system, mounted back-to-back configuration system, positioned side -by-side configuration system, or other suitable connection. During operation, the controller 222 is configured to operate the VL imaging sensor 208, the IR imaging sensor 206, or both the VL and IR imaging sensors. In one embodiment, the controller 222 operates switching elements in the pixels or super pixels within the imaging system to either switch the pixels or the system between an IR imaging mode and a VR imaging mode. In another embodiment, the controller 222 is connected to switching circuits for each pixel to control the operating mode of each pixel element. In yet another embodiment, the controller 222 is connected to switching circuits for each super pixel group to either activate or deactivate the VL imaging sensor and vice versa. In further yet another embodiment, based on the heat information detected by the IR imaging sensor, the controller 222 is connected to switching circuits for each super pixel group to either activate the VL imaging sensor when an object is presence and deactivate the VL imaging sensor when the object is not presence.
[0017] The super pixels imaging system 200 further comprises a processor for processing and evaluating sensor signals generated by the VL imaging sensor 208 and/or the IR imaging sensor 206 and an energy storage device 224 for providing energy power to operate the controller 222, the super pixels 220, and other components in the super pixels imaging system 200 when needed. The energy storage device 224 may be a battery, a super capacitor, or other suitable energy storage device. The super pixels imaging system 200 may be incorporate into security cameras, security devices, surveillance cameras, surveillance devices, consumer digital cameras, consumer digital devices, thin clients, thick clients, industrial machine vision systems, automotive cameras, home furnishing cameras, residential cameras, commercial cameras, object detectors, and so forth.
[0018] FIG. 3 is a cross-sectional view depicting another embodiment of a super pixels imaging system 300 that is configured for simultaneous operation as a VL imaging device and as an IR imaging device. Unlike from the super pixel imaging system 200, the super pixel imaging 300 comprises a readout assembly 314 either vertically mounted to or vertically stacked on a plurality of pixel elements grouped together into super pixels 320. In one embodiment, individual pixel 306, 308 can be read out by the readout assembly 314. In another embodiment, a plurality of the same pixel 306 or 308 as a group can be read out by the readout assembly 314. In yet another embodiment, a combination of pixels 306, 308 cab be read out by the readout assembly 314. Further yet another embodiment, the pixels 306, 308 can be read out by more than one readout circuit of the readout assembly 314. As illustrated, the readout assembly 314 comprises a first readout circuit 316a and a second readout circuit 316b. A plurality of IR pixels 306 share the same readout circuit 316b are vertically read out by the second readout circuit 316b whereas a plurality VL pixels 308 spared the same readout circuit 316a are vertically read out by the first readout circuit 316a. In alternate embodiment, combination of a column readout circuit and a vertical readout circuit, defines as a readout assembly, may be connected to a plurality of the super pixels 320. For example, the IR pixels 306 can be read out by the column readout circuit 216b illustrated in FIG. 2 whereas the VL pixels 308 can be read out by the vertical readout circuit 314. Vice versa, the IR pixels 306 can be read out by the vertical readout circuit 314 whereas the VL pixels 308 can be read out by the column readout circuit 216a illustrated FIG. 2.
[0019] Now back to FIG. 3, VL readout lines 310 coupled the readout assembly 314 to the super pixels 320 where image data are transmitted along the readout lines 310 are readout by the readout assembly 314. IR readout lines 312 coupled the readout assembly 314 to the super pixels 320 where image data are transmitted along the readout lines 312 are readout by the readout assembly 314.
[0020] FIG. 4 is a functional block diagram depicting a device 450 having a camera 452 that is configured for simultaneous operation as a VL and IR imaging system. The camera 452 comprises a dual VL and imaging sensors 400, similar to those previously described sensors depicted in FIGs. 1 -3 and a readout assembly 414. In addition, the device 450 comprises a processor 454, a non-transitory computer- readable storage media or a memory 456, and a display 458 communicatively coupled to the rest of the modules 452, 454, 456 via a bus 460. Any other suitable computer modules such as an input/output (I/O), communication interface, and so forth may be communicatively coupled via the bus 460. Once an image is captured by the camera 452, the captured image is transmitted to the processor 454 for processing. The processor 454 may be a general or special purpose microprocessor operating under control of computer executable instructions, such as program modules, being executed by a client machine. Program modules generally include routines, programs, objects, components, data structure and the like that perform particular tasks or implement particular abstract types. In one embodiment, some or all of the sub-processors may be implemented as computer software tangibly stored in a memory to perform their respective functions when executed. In alternate embodiment, some or all of the sub-processors may be implemented in an ASIC. In some embodiments, the captured image may be transfer to an external electronic device, either wirelessly or wired for processing.
[0021] The processed image or the captured image can be either locally stored on the memory 456, remotely stored on a cloud, or both, temporary or permanently. The captured image or processed image may then be transmitted to the display 458 for display.
[0022] The embodiments described above have been shown by way of example, and it should be understood that these embodiments may be susceptible to various modifications and alternative forms. It should be further understood that the claims are not intended to be limited to the particular forms disclosed, but rather to cover all modifications, equivalents, and alternatives falling with the sprit and scope of this disclosure.
[0023] Embodiments within the scope of the disclosure may also include non- transitory computer-readable storage media or machine -readable medium for carrying or having computer-executable instructions or data structures stored thereon. Such non-transitory computer-readable storage media or machine -readable medium may be any available media that can be accessed by a general purpose or special purpose computer. By way of example, and not limitation, such non-transitory computer- readable storage media or machine-readable medium can comprise RAM, ROM, EEPROM, CD-ROM or other optical disk storage, magnetic disk storage, a cloud memory or other magnetic storage devices, or any other medium which can be used to carry or store desired program code means in the form of computer-executable instructions or data structures. Combinations of the above should also be included within the scope of the non-transitory computer-readable storage media or machine- readable medium.
[0024] Embodiments may also be practiced in distributed computing environments where tasks are performed by local and remote processing devices that are linked (either by hardwired links, wireless links, or by a combination thereof) through a communications network.
[0026] While the patent has been described with reference to various embodiments, it will be understood that these embodiments are illustrative and that the scope of the disclosure is not limited to them. Many variations, modifications, additions, and improvements are possible. More generally, embodiments in accordance with the patent have been described in the context or particular embodiments. Functionality may be separated or combined in blocks differently in various embodiments of the disclosure or described with different terminology. These and other variations, modifications, additions, and improvements may fall within the scope of the disclosure as defined in the claims that follow.

中文:
[0001]本公开总体上涉及电子设备,并且更具体地,涉及具有互补金属氧化物(CMOS)可见光(VL)和红外(IR)成像系统的设备及其方法。
[0002]除非本文中另有指示,否则本节中描述的材料不是本申请中权利要求的现有技术,并且不通过包含在本节中而被承认为现有技术。
[0003]下面阐明本文中公开的某些实施例的概述。应当理解,呈现这些方面仅仅是为了向读者提供这某些实施例的简要概述,并且这些方面不旨在限制本公开的范围。实际上,本公开可以涵盖下面可能没有阐明的各种方面。
[0004]本公开的实施例涉及具有互补金属氧化物(CMOS)可见光(VL)和红外(IR)成像系统的设备及其方法。该设备可以是安全设备、监视设备、消费者数字设备、电子设备、瘦客户端、胖客户端、汽车设备、对象检测器以及任何合适的设备。
[0005]在本公开的一个方面,该设备包括:相机,具有双VL和IR成像传感器、通信地耦合到双VL和IR成像传感器的读出组装件;用于显示由相机捕获的图像的用户接口;用于处理捕获的图像的处理器;以及用于存储经处理的图像的存储器,该存储器被定位成远离该设备,该存储器与用户接口或处理器中的至少一个通信。读出组装件包括垂直堆叠在双VL和IR成像传感器上的读出电路。双VL和IR成像传感器包括用于响应于可见光(VL)捕获第一图像数据的多个可见光(VL)成像像素以及用于响应于范围在850 nm和14000000 nm之间的IR波长捕获第二图像数据的红外(IR)成像像素,VL成像像素或IR成像像素中的一个由垂直堆叠的读出电路读出。该设备进一步包括列读出组装件,其中IR成像像素由列读出组装件读出,并且其中VL成像像素由垂直堆叠的读出电路读出。该设备进一步包括控制器和切换元件,控制器被配置成操作VL成像像素和IR成像像素中的至少一个,切换元件连接到控制器以在IR成像模式和VL成像模式之间切换相机。当相机处于IR成像模式时,VL成像像素被停用。当相机处于IR成像模式时,IR成像像素被停用。
[0006]在本公开的另一个方面,一种设备包括:相机,具有双VL和IR成像传感器以及通信地耦合到双VL和IR成像传感器的读出组装件,该读出组装件包括第一读出电路和第二读出电路;用于显示由相机捕获的图像的用户接口;用于处理捕获的图像的处理器;以及用于存储经处理的图像的存储器。双VL和IR成像传感器包括用于响应于可见光(VL)捕获第一图像数据的多个可见光(VL)成像像素以及用于响应于范围在850 nm和14000000 nm之间的IR波长捕获第二图像数据的红外(IR)成像像素。第一读出电路垂直堆叠在双VL和IR成像传感器上,VL成像像素或IR成像像素中的至少一个由第一读出电路读出。第二读出电路是列读出电路,并且VL成像像素或IR成像像素中的一个由第二读出电路读出。该设备进一步包括被配置成操作VL成像像素和IR成像像素中的至少一个的控制器以及连接到控制器以在IR成像模式或VL成像模式之间切换相机的切换元件。当相机处于IR成像模式时,VL成像像素被停用。当相机处于IR成像模式时,IR成像像素被停用。相机进一步包括外壳和机械地耦合到外壳以用于封围相机、限定相机封装的载体。
[0007]当参考附图阅读以下对某些示例性实施例的详细描述时,本公开的这些和其他特征、方面和优点将变得更好理解,在附图中,同样的字符贯穿附图而表示同样的技术,其中:
[0008]图1是描绘多光谱可见光(VL)和红外(IR)成像系统的实施例的图解。
[0010]图3是描绘超像素成像系统的另一实施例的横截面视图。
[0011]图4是描绘并入可见光(VL)和红外(IR)成像系统的设备的实施例的功能框图。
[0012]呈现以下描述以使得本领域中任何技术人员能够制造和使用所描述的实施例,并且在特定应用及其要求的上下文中提供以下描述。对所描述的实施例的各种修改对于本领域技术人员而言将容易清楚,并且在不脱离所描述的实施例的精神和范围的情况下,本文中限定的一般原理可以应用于其他实施例和应用。因此,所描述的实施例不限于所示出的实施例,而是要符合与本文中公开的原理和特征相一致的最宽范围。
[0013]可以以最有助于理解所要求保护的主题的方式将各种操作依次描述为多个分立的动作或操作。然而,描述的次序不应当被解释为暗示这些操作必然是次序相关的。特别地,可以不按呈现的次序执行这些操作。可以按与所描述的实施例相比不同的次序来执行所描述的操作。在附加实施例中,可以执行各种附加操作和/或可以省略所描述的操作。
[0014]图1是互补金属氧化物半导体(CMOS)多光谱可见光(VL)和红外(IR)成像系统100。系统100包括以二维阵列布置的多个超像素组118。多个超像素组中的每个超像素组118包括对可视光(VL)敏感的第一多个单独的成像传感器或像素108,以及对850 nm - 14000000nm之间的范围内的热量、IR和/或近IR(NIR)敏感的第二多个单独的IR成像传感器或像素106。不同的信息由VL成像传感器108和IR成像传感器106以不同的波长承载。提供载体或基底102以用于支撑VL成像传感器108和IR成像传感器106。在一个实施例中,多个VL成像传感器响应于可见光(VL)捕获第一图像数据,并且红外(IR)成像传感器响应于热量、IR和/或近IR(NIR)捕获第二图像数据。IR成像传感器被配置成在检测到目标的存在之后生成热信号,并且操作CMOS成像传感器。目标可以是辐射热量、IR和/或近IR(NIR)的人、动物或任何合适的对象。
[0015]图2是描绘超像素成像系统200的实施例的功能框图,超像素成像系统200被配置用于作为VL成像设备和作为IR成像设备同时操作。超像素成像系统200是图1中所描绘的多光谱VL和红外IR成像系统100的一个示例实现。超像素成像系统200的图示实施例包括多个像素元件220,多个像素元件220被一起分组成超像素218的8×8布置。如本文中所使用的,术语“超像素”是指超像素220中的一组单独像素,其中诸如像素206的一些像素作为IR成像传感器操作,而诸如像素208的剩余像素作为VL成像传感器操作。当然,图2中描绘的像素配置仅仅是像素配置的一个示例的说明。在不脱离本公开的范围的情况下,替代实施例可以使用除了图2中描绘的一个示例之外的IR成像传感器和VL成像传感器的不同布置。超像素成像系统200进一步包括具有第一列读出电路216a和第二列读出电路216b的读出组装件214。VL图像数据由第一列读出电路216a读出,并且IR图像数据由第二列读出电路216b读出。如所图示的,耦合到超像素220的第一列读出电路216a沿着读出列线210读出VL图像数据行。与第一列读出电路216a相对定位并耦合到超像素220的第二列读出电路216b沿着读出列线212读出IR图像数据行。
[0016]超像素成像系统200进一步包括控制器222,控制器222被配置成操作超像素220。控制器222是并入模拟和数字控制电路中的至少一个来操作超像素成像系统200的控制设备。在一些实施例中,使用与超像素成像系统200物理地集成的CMOS数字逻辑电路来实现控制器222。在另一个实施例中,控制器222是如下分立控制设备:该分立控制设备通过3D堆叠的配置系统、背靠背安装的配置系统、并排地定位的配置系统或其他合适的连接的方式操作性地连接到超像素成像系统200。在操作期间,控制器222被配置成操作VL成像传感器208、IR成像传感器206或者VL和IR成像传感器两者。在一个实施例中,控制器222操作成像系统内的像素或超像素中的切换元件,以在IR成像模式和VR成像模式之间切换像素或系统。在另一个实施例中,控制器222连接到每个像素的切换电路,以控制每个像素元件的操作模式。在又一个实施例中,控制器222连接到每个超像素组的切换电路,以激活或停用VL成像传感器,并且反之亦然。在再又一个实施例中,基于IR成像传感器检测到的热量信息,控制器222连接到每个超像素组的切换电路,以在对象存在时激活VL成像传感器,并且在对象不存在时停用VL成像传感器。
[0017]超像素成像系统200进一步包括:处理器,用于处理和评估由VL成像传感器208和/或IR成像传感器206生成的传感器信号;以及能量存储设备224,用于在需要时提供能量功率以操作控制器222、超像素220和超像素成像系统200中的其他组件。能量存储设备224可以是电池、超级电容器或其他合适的能量存储设备。超像素成像系统200可以被并入到安全相机、安全设备、监视相机、监视设备、消费者数字相机、消费者数字设备、瘦客户端、胖客户端、工业机器视觉系统、汽车相机、家居相机、住宅相机、商业相机、对象检测器等等中。
[0018]图3是描绘超像素成像系统300的另一个实施例的横截面视图,超像素成像系统300被配置用于作为VL成像设备和作为IR成像设备同时操作。与超像素成像系统200不同,超像素成像300包括读出组装件314,读出组装件314垂直安装到被一起分组成超像素320的多个像素元件或垂直堆叠在该多个像素元件上。在一个实施例中,单独的像素306、308可以由读出组装件314读出。在另一个实施例中,作为一组的多个相同的像素306或308可以由读出组装件314读出。在又一个实施例中,像素306、308的组合可以由读出组装件314读出。再又一个实施例,像素306、308可以由读出组装件314的多于一个读出电路读出。如所图示的,读出组装件314包括第一读出电路316a和第二读出电路316b。共享相同读出电路316b的多个IR像素306由第二读出电路316b垂直读出,而分让相同读出电路316a的多个VL像素308由第一读出电路316a垂直读出。在替代实施例中,限定为读出组装件的列读出电路和垂直读出电路的组合可以连接到多个超像素320。例如,IR像素306可以由图2中所图示的列读出电路216b读出,而VL像素308可以由垂直读出电路314读出。反之亦然,IR像素306可以由垂直读出电路314读出,而VL像素308可以由图2所图示的列读出电路216a读出。
[0019]现在回到图3,VL读出线310将读出组装件314耦合到超像素320,其中沿着读出线310传输的图像数据由读出组装件314读出。IR读出线312将读出组装件314耦合到超像素320,其中沿着读出线312传输的图像数据由读出组装件314读出。
[0020]图4是描绘具有相机452的设备450的功能框图,相机452被配置用于作为VL和IR成像系统同时操作。相机452包括双VL和成像传感器400(类似于图1-3中描绘的那些先前描述的传感器)和读出组装件414。此外,设备450包括处理器454、非暂时性计算机可读存储介质或存储器456以及经由总线460通信地耦合到其余模块452、454、456的显示器458。可以经由总线460通信地耦合诸如输入/输出(I/O)、通信接口等等任何其他合适的计算机模块。一旦图像被相机452捕获,捕获的图像就被传输到处理器454以供处理。处理器454可以是在由客户机执行的计算机可执行指令(诸如程序模块)的控制下操作的通用或专用微处理器。程序模块一般包括执行特定任务或实现特定抽象类型的例程、程序、对象、组件、数据结构等。在一个实施例中,子处理器中的一些或全部可以被实现为有形地存储在存储器中的计算机软件,以在被执行时执行它们的相应功能。在替代实施例中,可以在ASIC中实现子处理器中的一些或全部。在一些实施例中,捕获的图像可以无线或有线传送到外部电子设备以供处理。
[0021]经处理的图像或捕获的图像可以临时或永久地本地存储在存储器456上、远程存储在云上或者两者。捕获的图像或经处理的图像然后可以被传输到显示器458以供显示。
[0022]已经作为举例示出了以上描述的实施例,并且应当理解,这些实施例可以容许各种修改和替代形式。应当进一步理解,权利要求不旨在限制于所公开的特定形式,而是覆盖落入本公开的精神和范围内的所有修改、等同物和替代物。
[0023]本公开范围内的实施例还可以包括用于承载或其上存储有计算机可执行指令或数据结构的非暂时性计算机可读存储介质或机器可读介质。这样的非暂时性计算机可读存储介质或机器可读介质可以是通用或专用计算机可以访问的任何可用介质。作为举例而非限制,这样的非暂时性计算机可读存储介质或机器可读介质可以包括RAM、ROM、EEPROM、CD-ROM或其他光盘存储装置、磁盘存储装置、云存储器或其他磁存储设备,或者可以用于以计算机可执行指令或数据结构的形式承载或存储所期望的程序代码单元的任何其他介质。上述的组合也应当包括在非暂时性计算机可读存储介质或机器可读介质的范围内。
[0024]实施例也可以在分布式计算环境中实施,在分布式计算环境中,任务由通过通信网络链接(通过硬连线链接、无线链接,或者通过其组合)的本地和远程处理设备来执行。
[0026]虽然已经参考各种实施例描述了本专利,但是将理解,这些实施例是说明性的,并且本公开的范围不限于它们。许多变型、修改、添加和改进是可能的。更一般地,已经在上下文或特定实施例中描述了根据本专利的实施例。功能性在本公开的各种实施例中可以以不同方式按块分离或组合,或者以不同的术语描述。这些和其他变型、修改、添加和改进可以落入如所附的权利要求中所限定的本公开的范围内。