English:
[0001] Different types of devices, such as computing and other types of electronic devices, comprise components that generate thermal energy during operation (e.g., graphic cards, processors, etc.). If such devices are not sufficiently cooled, damage to and/or a reduced operating life of the device and/or components thereof can result. Fans and heat exchangers (sometimes in combination with heat pipes) disposed within the device have been used to dissipate thermal energy from within the device. However, because of the location and/or quantity of heat-generating components within the device, as well as space limitations within the device, connecting the heat-generating components to the heat-dissipating elements within the device is difficult.
[0003] FIGURE 1 is a diagram illustrating a device 10 in which an embodiment of a cooling system 12 is employed to advantage. In the embodiment illustrated in FIGURE 1, device 10 comprises a computing device in the form of a notebook computer 14 having a display member 16 rotatably coupled to a base member 18. However, it should be understood that device 10 may comprise other types of devices such as, but not limited to, a tablet computer, a desktop computer, a gaming device, a media player or any other type of portable or non-portable electronic device. In the embodiment illustrated in FIGURE 1, display member 16 and base member 18 each comprise a housing 20 and 22, respectively, formed from a number of walls. For example, in the embodiment illustrated in FIGURE 1, housing 22 comprises a front wall 30, a rear wall 32, a bottom wall 34, a top wall defining a working surface or keyboard deck 36, and a plurality of side walls 38 and 40.
[0004] In the embodiment illustrated in FIGURE 1, cooling system 12 comprises a heat pipe 40 disposed within housing 22 of base member 18 for dissipating thermal energy generated by heat-generating components 42 and 44 disposed within housing 22. However, it should be understood that heat pipe 40 may be otherwise located in device 10 (e.g., additionally or alternatively, in display member 16). Heat-generating components 42 and 44 may comprise any type of component of device 10 that generates thermal energy during operation thereof. For example, in some embodiments, heat-generating component 42 comprises a central processing unit (CPU) 50 and heat-generating component 44 comprises a graphics chipset 52. However, it should be understood that heat-generating components 42 and 44 may comprise other types of elements.
[0005] In FIGURE 1, cooling system 12 also comprises a fan 56 and a heat exchanger 58. In the embodiment illustrated in FIGURE 1, heat exchanger 58 comprises a plurality of spaced apart fins 60 for dissipating thermal energy in response to an air flow passing therethrough. For example, in the embodiment illustrated in FIGURE 1 , housing 22 comprises a vent 62 formed in bottom wall 34 of housing 22 disposed in alignment with fan 56, and a vent 64 disposed in side wall 38 of housing 22 located in alignment with heat exchanger 58. In operation, fan 56 draws an airflow inwardly through vent 62 and discharges and/or exhausts the airflow through fins 60 of heat exchanger 58 and outwardly from housing 22 through vent 64. However, it should be understood that the direction of the airflow generated by fan 56 may be otherwise configured (e.g., reversed in direction from vent 64 to vent 62). Further, it should be understood that the locations of vents 62 and/or 64 may be otherwise configured (e.g., vent 62 may be located in rear wall 32 instead of bottom wall 34).
[0006] In the embodiment illustrated in FIGURE 1, heat pipe 40 comprises a condenser portion 70 and at least two evaporator portions 72 and 74 for transferring thermal energy generated by heat-generating components 42 and 44 toward heat exchanger 58 where such thermal energy may be dissipated by heat exchanger 58. For example, in some embodiments, heat pipe 40 generally comprises a fluid disposed therein under vacuum that is vaporized in evaporator portions 72 and 74 and condensed in condenser portion 70. In some embodiments, heat pipe 40 generally comprises a wick or other type of element disposed therein for generating capillary-type movement of the vaporized fluid from evaporator portions 72 and 74 toward heat exchanger 58 and for transferring the condensed fluid from heat exchanger 58 toward evaporator portions 72 and 74. However, it should be understood that other types of heat pipes may be used. In the embodiment illustrated in FIGURE 1, heat pipe 40 comprises an intermediate portion 80 disposed between evaporator portion 72 and 74 and condenser portion 70. In FIGURE 1, evaporator portions 72 and 74 diverge from intermediate portion 80 to form two heat pipe branches 82 and 84 having respective terminating ends 86 and 88. In the embodiment illustrated in FIGURE 1, branches 82 and 84 diverge from intermediate portion 80 to form two separate and spaced apart evaporator portions 72 and 74. However, it should be understood that a greater number of branches and/or condenser portions may be formed on heat pipe 40. For example, in some embodiments, heat pipe 40 may be manufactured having additional branches diverging from intermediate portion 80. Further, in some embodiments, a particular branch 82 and/or 84 may further diverge to form additional branches.
[0007] In the embodiment illustrated in FIGURE 1 , evaporator portions 72 and 74 are thermally coupled to respective heat-generating components 42 and 44 (e.g., by respective thermally conductive plates 92 and 94 or otherwise). In FIGURE 1, heat-generating components 42 and 44 are coupled to an intermediate portion of respective evaporator portions 72 and 74. However, it should be understood that heat-generating °components 42 and/or 44 may be thermally coupled to respective evaporator portions 72 and 74 at other locations. Further, in the embodiment illustrated in FIGURE 1, evaporator portion 72 and 74 are each coupled to a separate heat-generating component (e.g., components 42 and 44, respectively). However, it should be understood that evaporator portion 72 and 74 may also be coupled to different portions of a single or same heat-generating component. Further, either or both of evaporator portions 72 and 74 may be coupled to more than one heat-generating component.
[0008] In the embodiment illustrated in FIGURE 1, intermediate portion 80 of heat pipe 40 comprises a reservoir portion 96 for receiving evaporative fluid input from evaporator portions 72 and/or 74 and for receiving condensed fluid input from condenser portion 70. For example, in operation, capillary movement of fluid within heat pipe 40 causes condensed fluid to travel in a direction from end 98 of heat pipe 40 toward ends 86 and 88 of heat pipe 40, and evaporated fluid to travel in a direction from ends 86 and 88 of heat pipe 40 toward end 98 of heat pipe 40. Thus, for example, fluid within heat pipe 40 is condensed at condenser portion 70 and travels within heat pipe 40 to reservoir portion 96 where such condensed fluid diverges to evaporator portions 72 and 74. Similarly, evaporated fluid within heat pipe 40 converges from evaporator portions 72 and 74 into reservoir portion 96 where such evaporated fluid is transferred toward heat exchanger 58 where the evaporated fluid is cooled by the air flow generated by fan 56 and passing through fins 60 of heat exchanger 58, thereby changing the state of the fluid.
[0009] In the embodiment illustrated in FIGURE 1, at least a portion of evaporator portion 72 and 74 are disposed parallel (parallel or substantially parallel) to each other. However, it should be understood that branches 82 and 84 of heat pipe 40 may be configured to diverge in different directions (e.g., parallel or non-parallel to each other). In the embodiment illustrated in FIGURE 1, heat pipe 40 is configured such that condenser portion 70 has a generally larger cross-sectional area than a cross-sectional area of evaporator portion 72 and/or 74 to accommodate a larger volume of fluid therein. However, it should be understood that in some embodiments, the configuration of heat pipe 40 may be different (e.g., condenser portion 70 may be formed having a greater length to accommodate a particular volume of fluid therein such that a cross-sectional area of condenser portion 70 may be equal to or less than a cross-sectional area of evaporator portions 72 and/or 74). Further, in the embodiment illustrated in FIGURE 1, evaporator portions 72 and 74 are illustrated as having a same size and/or cross- sectional area (the same or substantially the same size/shape). However, it should be understood that the shape and/or cross-sectional area of evaporator portions 72 and 74 may be different from each other.
[0010] Thus, embodiments of cooling system 12 provide a dynamic heat- dissipating system that is responsiveness to different levels of heat generation of components within device 10. For example, in the embodiment illustrated in FIGURE 1, it should be understood that heat-generating components 42 and 44 may be generating different levels of thermal energy (or even different portions of a single heat-generating component may be generating different levels of thermal energy). In this example, the particular branch 82 or 84 corresponding to the heat-generating component generating greater levels of heat would experience greater fluid movement therethrough to dissipate the increased level of thermal energy. Thus, embodiments of cooling system 12 may be manufactured to enable heat to be received by at least two different evaporator portions and transferred to a single condenser portion 70 that is dynamically responsive to varying levels of heat generation by the corresponding heat-generating components.

中文:
[0001]诸如计算和其他类型的电子装置的不同类型的装置包括在运行期间产生热能的部件(例如图形卡、处理器等)。如果未充分地冷却这样的装置,则会导致对所述装置和/或其部件的损害和/或减少它们的工作寿命。在所述装置中布置的风扇和热交换器(有时与热管组合)已经用于耗散来自所述装置内的热能。但是,因为在所述装置内的热产生部件的位置和/或数量以及在所述装置内的空间限制,在所述装置内将所述热产生部件连接到热耗散元件是困难的。
[0003]图1是图解其中有利地使用冷却系统12的实施例的装置10的图。在图1中图解的实施例中,装置10包括以笔记本计算机14为形式的计算装置,其具有可旋转地耦合到底座构件18的显示构件16。但是,应当明白,装置10可以包括其他类型的装置,诸如但是不限于平板计算机、台式计算机、游戏装置、媒体播放器或者任何其他类型的便携或者非便携电子装置。在图1中图解的实施例中,显示构件16和底座构件18每个分别包括由若干壁形成的外壳20和22。例如,在图1中图解的实施例中,外壳22包括前壁30、后壁32、底壁34、限定工作表面或者键盘面板(deck)的顶壁36和多个侧壁38和40。
[0004]在图1中图解的实施例中,冷却系统12包括在底座构件18的外壳22内布置的热管40,用于耗散由在外壳22内布置的热产生部件42和44产生的热能。但是,应当明白,可以在装置10中以其他方式定位热管40(例如附加地或者可替代地,在显示构件16中定位热管40)。热产生部件42和44可以包括在其运行期间产生热能的装置10的任何类型的部件。例如,在一些实施例中,热产生部件42包括中央处理单元(CPU)50,并且热产生部件44包括图形芯片组52。但是,应当明白,热产生部件42和44可以包括其他类型的元件。
[0005]在图1中,冷却系统12也包括风扇56和热交换器58。在图1中图解的实施例中,热交换器58包括多个隔开的散热片(fin)60,用于响应于通过其中的空气流而耗散热能。例如,在图1中图解的实施例中,外壳22包括:在外壳22的底壁34中形成的与风扇56对齐布置的通风孔62;以及布置在外壳22的侧壁38中的与热交换器58对齐定位的通风孔64。在运行中,风扇56通过通风孔62向内吸入空气流,并且通过热交换器58的散热片60以及通过通风孔64从外壳22向外释放和/或排出该空气流。但是,应当明白,可以以其他方式配置由风扇56产生的空气流的方向(例如在方向上反向:从通风孔64到通风孔62)。而且,应当明白,可以以其他方式配置通风孔62和/或64的位置(例如可以在后壁32而不是在底壁34中定位通风孔62)。
[0006]在图1中图解的实施例中,热管40包括冷凝器部分70和至少两个蒸发器部分72和74,用于朝向热交换器58传送由热产生部件42和44产生的热能,在热交换器58,这样的热能可以被热交换器58耗散。例如,在一些实施例中,热管40一般包括在真空下布置在其中的流体,该流体在蒸发器部分72和74中被汽化,并且在冷凝器部分70中冷凝。在一些实施例中,热管40一般包括布置在其中的管芯(wick)或者其他类型的元件,用于产生汽化的流体从蒸发器部分72和74朝向热交换器58的毛细管类型的移动,并且用于从热交换器58向蒸发器部分72和74传送冷凝的流体。但是,应当明白,可以使用其他类型的热管。在图1中图解的实施例中,热管40包括在蒸发器部分72和74以及冷凝器部分70之间布置的中间部分80。在图1中,蒸发器部分72和74从中间部分80分叉以形成具有相应的终接端86和88的两个热管分支82和84。在图1中图解的实施例中,分支82和84从中间部分80分叉以形成两个分离且隔开的蒸发器部分72和74。但是,应当明白,可以在热管40上形成更大数量的分支和/或冷凝器部分。例如,在一些实施例中,热管40可以被制造成具有从中间部分80分叉的附加分支。而且,在一些实施例中,特定分支82和/或84可以进一步分叉以形成附加的分支。
[0007]在图1中图解的实施例中,蒸发器部分72和74热耦合到相应的热产生部件42和44(例如通过相应的导热板92和94或以其他方式)。在图1中,热产生部件42和44耦合到相应的蒸发器部分72和74的中间部分。但是,应当明白,热产生部件42和/或44可以在其他位置热耦合到相应的蒸发器部分72和74。而且,在图1中图解的实施例中,蒸发器部分72和74每个都耦合到分离的热产生部件(例如分别是部件42和44)。但是,应当明白,蒸发器部分72和74也可以耦合到单个或者同一热产生部件的不同部分。而且,蒸发器部分72和74的任何一个或者两者可以耦合到不止一个热产生部件。
[0008]在图1中图解的实施例中,热管40的中间部分80包括贮存器部分96,用于容纳从蒸发器部分72和/或74输入的蒸发(evaporative)流体,并且用于容纳从冷凝器部分70输入的冷凝流体。例如,在运行中,在热管40内的流体的毛细管移动使得冷凝流体在从热管40的端部98朝向热管40的端部86和88的方向上行进,并且使得蒸发的(evaporated)流体在从热管40的端部86和88朝向热管40的端部98的方向上行进。因此,例如,在热管40内的流体在冷凝器部分70冷凝,并且在热管40内行进到贮存器部分96,在贮存器部分96,这样的冷凝流体分叉到蒸发器部分72和74。类似地,在热管40内的蒸发的流体从蒸发器部分72和74汇聚到贮存器部分96中,在贮存器部分96,向热交换器58传送这种蒸发的流体,在热交换器58处,通过由风扇56产生的且通过热交换器58的散热片60的空气流来冷却蒸发的流体,由此改变流体的状态。
[0009]在图1中图解的实施例中,蒸发器部分72和74的至少一部分彼此平行地(平行或者基本上平行地)布置。但是,应当明白,热管40的分支82和84可以被配置为以不同方向分叉(例如彼此平行或者不平行)。在图1中图解的实施例中,热管40被配置成使得冷凝器部分70具有通常比蒸发器部分72和/或74的横截面面积更大的横截面面积,以在其中容纳更大体积的流体。但是,应当明白,在一些实施例中,热管40的配置可以不同(例如,可以形成具有更大长度的冷凝器部分70,以在其中容纳特定体积的流体,使得冷凝器部分70的横截面面积可以等于或者小于蒸发器部分72和/或74的横截面面积)。而且,在图1中图解的实施例中,蒸发器部分72和74被图解为具有相同的尺寸和/或横截面面积(相同或者基本上相同的尺寸/形状)。但是,应当明白,蒸发器部分72和74的形状和/或横截面面积可以彼此不同。
[0010]因此,冷却系统12的实施例提供了动态的热耗散系统,其响应于在装置10内的部件的不同热产生水平。例如,在图1中图解的实施例中,应当明白,热产生部件42和44可以产生不同水平的热能(或者甚至单个热产生部件的不同部分可以产生不同水平的热能)。在这个示例中,对应于产生更大水平热量的热产生部件的特定分支82或者84将经历通过其中的更大的流体移动,以耗散所增加水平的热能。因此,冷却系统12的实施例可以被制造为使得能够通过至少两个不同的蒸发器部分接收热量并且向单个冷凝器部分70传导热量,所述单个冷凝器部分70动态地响应于对应的热产生部件的变化的热产生水平。