English:
[0003] FIG. 1 is a schematic view of an example electronic device.
[0004] FIG. 2 is a partial enlarged front view of the electronic device of FIG. 1.
[0005] FIG. 3 is a partial enlarged side view of the electronic device of FIG. 1.
[0006] FIG. 4 is a perspective view of an example computing device.
[0007] In the following discussion and in the claims, the "electronic device" or "device" may be any device operating under electrical power which may generate heat during operation, such as, a computing device, radios, televisions, portable audio players, electronic musical instruments, etc A "computing device" may be a desktop computer, laptop (or notebook) computer, workstation, tablet computer, mobile phone, smart phone, smart device, or any other device or equipment including a processor resource. A processing resource may include, for example, one processor or multiple processors included in a single computing device or distributed across multiple computing devices. A "processor" may be at least one of a central processing unit (CPU), a semiconductor-based microprocessor, a graphics processing unit (GPU), a field-programmable gate array (FPGA) to retrieve and execute instructions, other electronic circuitry suitable for the retrieval and execution of instructions stored on a machine-readable storage medium, or a combination thereof.
[0008] An electronic device may include components that generate heat. A heat dissipation system may be required to efficiently transfer the generated heat away from heat sensitive components. However, as electronic devices become smaller in size, the heat dissipation system may hinder the potential reduction in size. An electronic device may include audio systems to generate and emit sound. Users may seek electronic devices that provide good audio quality. However, as electronic devices become smaller in size, the components needed to provide a good quality audio system may hinder the potential reduction in size.
[0009] To address these issues, in the examples described herein, a heat and sound deflector may be disposed in a housing of a device including an audio system and a heat dissipation system. In examples, the heat and sound deflector is disposed to deflect sound and dissipated heat from the housing. In some examples, the deflected sound may be deflected up to 360 degrees around the device. In some examples, dissipated heat may be deflected up to 360 degrees around the device. In such examples, the heat dissipation system and audio system may be disposed to reduce the size of the electronic device.
[0010] Referring now to the drawings, FIG. 1 is a schematic view of an example electronic device 10. FIG. 2 is a partial enlarged front view of electronic device 10 of FIG. 1. FIG. 3 is a partial enlarged side view of electronic device 10 of FIG. 1. In the example of FIGs. 1 -3, electronic device 10 may include a housing 100 to house an audio system 120, a heat dissipation system 130, and a deflector 140.
[0011] In examples, housing 100 may include a side 101. In examples, side 101 may be a top side of device 10. Although depicted as a substantially triangular prism, housing 100 may be configured in any shape to alow an audio system, a heat dissipation system, and a deflector to be disposed therein. In examples, housing 100 may be composed of one or more of a metal, a plastic, a ceramic, a glass, a fabric, a composite, wood, etc.
[0012] In an example, audio system 120 may be a system to convert an electrical audio signal into a corresponding emitted sound. In some examples, audio system 120 may include one or more electroacoustic transducer or drivers to convert the electrical audio signal into sound. In such an example, audio system 120 may also include an amplifier to amplify the sound. In examples, audio system 120 may be disposed to generate or emit sound waves 105 towards side 101 of housing 100. In examples, various parameters of audio system 120 may be selected for the particular use and design of device 10. For examples, audio system 120 may include a transducer 125 to generate or emit sound waves 105. In such an example, transducer 125 may be disposed in housing 100 such that sound waves 105 are emitted toward deflector 140.
[0013] In an example, heat dissipation system 130 may be any system to dissipate heat from electronic device 10. In some examples, heat may be dissipated by any one of conduction, convection, or radiation. In examples, heat dissipation system 130 may include one or more of a heat sink, heat pipes, air moving devices, etc. to dissipate heat As used herein, "air moving devices" may include any device designed to move air in a system, such as fans, impellers, blowers, etc. In examples, heat dissipation system 130 may be configured to dissipate heat away from heat sensitive components in device 10. For example, in a computing device, heat dissipation system 130 may be configured to dissipate generated heat away from a processing resource. In examples, heat dissipation system 130 may be disposed to dissipate heat towards side 101 of housing 100. In examples, various parameters of heat dissipation system 130 may be selected for the particular use and design of device 10. For examples, heat dissipation system 130 may include air moving device 135 to move air through device 10. In such an example, heat dissipation system 130 may be disposed in housing 100 such that heated air or heat waves 107 are dissipated toward deflector 140. In examples, heat dissipation system 130 may be disposed to be offset from audio system 120 in housing 100. In such an example, heat dissipation system 130 and audio system 120 may be disposed to reduce the size of device 10.
[0014] In an example, deflector 140 may be configured to deflect sound and heat In examples, deflector 140 may be disposed in housing 100 to extend from a central opening of housing 100 to form a part of side 101. In an example, an upper surface of deflector 140 may form side 101. Various parameters of deflector 140 may be selected for the particular use and design of device 10. For example, the dimensions, orientation, and material choice of deflector 140 may be determined by the size of the device 10 and the particular use of device 10. In examples, deflector 140 may be cone or other three-dimensional shape to deflect heat and sound. Although depicted as a cone with a substantially triangular base which mirrors a cross-sectional shape of housing 100, deflector 140 is not limited thereto and deflector 140 may have a different shaped base from housing 100. In examples, deflector 140 may be composed of one or more of a metal, a plastic, a ceramic, a glass, a composite, wood, etc.
[0015] In examples, audio system 120 and heat dissipation system 130 may be disposed in housing 100 so that the sound waves 105 and heat waves 107 are deflected radially by deflector 140 around housing 100. In examples, sound waves 105 may be deflected radially in a range of 1 to 360 degrees around housing 100. For example, sound waves 105 may be deflected 360 degrees around housing 100 to provide a sound to users positioned anywhere around device 10. In other examples, sound waves 105 may be deflected up to 180 degrees around housing 100. In another example, sound waves 105 may be deflected up to 90 degrees around housing 100. In examples, heat waves 107 may be deflected radially in a range of 1 to 360 degrees around housing 100. For example, heat waves 107 may be deflected 360 degrees around housing 100. In other examples, heat waves 107 may be deflected less than 360 degrees to dissipate heat to a certain region around housing 100. In examples, the particular amount of deflection of sound waves 105 and/or heat waves 107 around housing 100 may be selected for the particular use and design of device 10. For examples, device 10 may be designed to emit sound and dissipate heat based on the planned usage location of device 10, for example, in the center of a room, a comer of a room, against a wall, etc.
[0016] FIG.4 is a perspective view of an example computing device 20. Computing device 20 may include housing 200 to house an audio system 220, a heat dissipation system 230, a deflector 240, a motherboard 250 including one or more processing resources, and a storage medium 260. Any storage medium described herein may be any of Random Access Memory (RAM), volatile memory, non-volatile memory, flash memory, a storage drive (e.g., a hard drive), a solid state drive, any type of storage disc (e.g., a compact disc, a DVD, etc.), and the like, or a combination thereof. Further, any storage medium described herein may be non-transitory.
[0017] In examples, housing 200 may include a side 201. In examples, side 201 may be a top side of device 20. In examples, housing 200 may include a central opening 202. Although depicted as a substantially triangular prism, housing 200 may be configured in any shape to allow audio system 220, heat dissipation system 230, deflector 240, motherboard 250, and storage medium 260 to be disposed therein. In examples, housing 200 may be substantially similar to housing 100 described with respect to FIGs. 1-3. In examples, audio system 220 may be substantially similar to audio system 120 described with respect to FIGs. 1-3. In examples, heat dissipation system 230 may be substantially similar to heat dissipation system 130 described with respect to FIGs. 1-3. In examples, deflector 240 may be substantially similar to deflector 140 described with respect to FIGs. 1-3.
[0018] In the example of FIG. 4, computing device 20 may include heat sensitive components on motherboard 250 and storage medium 260. In such an example, heat dissipation system 230 may dissipate heat generated by processing resources on motherboard 250 and storage medium 260 towards deflector 240 to be deflected outside housing 200. In examples, heat dissipation system 230 may include a number of components (not all shown) to dissipate generated heat including an air mover device to move hot air toward deflector 240 for deflection outside housing 200. In examples, deflector 240 may deflect emitted sound and dissipated heat radially from housing in a similar manner as shown in FIGs. 2-3.
[0019] In operation, audio system 220 may emit sound toward deflector 240 to be deflected around housing 200. In examples, audio system 220 may be disposed in housing 200 to be substantially aligned with central opening 202 of housing 200. In examples, heat dissipation system 230 may be disposed to be offset from audio system 220 in housing 200. In an example, deflector 240 may be disposed to extend from central opening 202 of housing 200 such that an upper surface of deflector 240 forms at least part of side 201. In such an example, deflector 240 may be substantially aligned with central opening 202 of housing 200.
[0020] In examples, various components of device 20, such as audio system 220, heat dissipation system 230, and deflector 240, etc., may be disposed in housing 200 to select a range of deflection for generated sound and dissipated heat. In examples, generated sound and dissipated heat may be deflected in a range of 1 to 360 degrees around housing 200. In other examples, generated sound and dissipate head may be deflected in different ranges from each other. For example, generated sound may be deflected up to 360 degrees around housing 200 and dissipated heat may be deflected up to 180 degrees around housing 200. In such an example, deflected sound waves and heat waves may interfere with each other for up to 180 degrees around housing 200. In another example, generated sound may be deflected up to 360 degrees around housing 200 and dissipated heat may be deflected up to 90 degrees around housing 200. In such an example, deflected sound waves and heat waves may interfere with each other for up to 90 degrees around housing 200.
[0021] In the various examples described herein, the use of a deflector to deflect sound and heat may allow for a more compact arrangement of components in a device. In such examples, the sound and heat may be radially deflected from the housing of the device. In examples, the amount of deflection of sound and heat around a housing may be selected to provide good quality audio and efficient heat dissipation. For example, in such a device, sound and dissipated heat may be deflected up to 360 degrees around the device.
[0022] While certain implementations have been shown and described above, various changes in form and details may be made. For example, some features that have been described in relation to one implementation and/or process can be related to other implementations. In other words, processes, features, components, and/or properties described in relation to one implementation can be useful in other implementations. Furthermore, it should be understood that the systems, and apparatuses described herein can include various combinations and/or subcombinations of the components and/or features of the different implementations described. Thus, features described with reference to one or more implementations can be combined with other implementations described herein.
[0023] The above discussion is meant to be illustrative of the principles and various examples of the present disclosure. Numerous variations and modifications will become apparent to those skilled in the art once the above disclosure is fully appreciated. It is intended that the following claims be interpreted to embrace all such variations and modifications.

中文:
[0003]图1是示例性电子装置的示意图。
[0004]图2是图1的电子装置的局部放大前视图。
[0005]图3是图1的电子装置的局部放大侧视图。
[0006]图4是示例性计算装置的透视图。
[0007]在下面的论述和权利要求中,“电子装置”或“装置”可以是可在操作期间产生热的在电力下操作的任何装置,例如计算装置、收音机、电视、便携式音频播放器、电子乐器等。“计算装置”可以是台式计算机、膝上型(或笔记本)计算机、工作站、平板计算机、移动电话、智能电话、智能装置或者包括处理器资源的任何其他装置或设备。例如,处理资源可以包括包含在单个计算装置中或分布在多个计算装置上的一个处理器或多个处理器。“处理器”可以是中央处理单元(CPU)、基于半导体的微处理器、图形处理单元(GPU)、检索和执行指令的现场可编程门阵列(FPGA)、适于检索和执行存储在机器可读存储介质上的指令的其他电子电路或者它们的组合中的至少一个。
[0008]电子装置可以包括产生热的部件。可能需要散热系统来高效地将所产生的热从热敏部件转移走。然而,随着电子装置在尺寸上变小,散热系统可能阻碍在尺寸上的潜在减小。电子装置可以包括音频系统,以产生和发出声音。用户可以寻求提供高音频质量的电子装置。然而,随着电子装置在尺寸上变小,提供高质量音频系统所需的部件可能阻碍在尺寸上的潜在减小。
[0009]为了解决这些问题,在本文所描述的示例中,热和声音偏转器(heat and sounddeflector)可以被设置在包括音频系统和散热系统的装置的壳体中。在示例中,该热和声音偏转器被设置成使声音和散逸的热从壳体偏转。在一些示例中,偏转的声音可以围绕装置被偏转多达360度。在一些示例中,散逸的热可以围绕装置被偏转多达360度。在这样的示例中,散热系统和音频系统可以被设置成减小电子装置的尺寸。
[0010]现在参照附图,图1是示例性电子装置10的示意图。图2是图1的电子装置10的局部放大前视图。图3是图1的电子装置10的局部放大侧视图。在图1-3的示例中,电子装置10可以包括壳体100,其收容音频系统120、散热系统130和偏转器140。
[0011]在示例中,壳体100可包括侧面101。在示例中,侧面101可以是装置10的顶侧。尽管描绘为基本上三角形的棱柱,但是壳体100可以被构造成任何形状,以允许将音频系统、散热系统和偏转器设置在其中。在示例中,壳体100可以由金属、塑料、陶瓷、玻璃、织物、复合材料、木材等中的一种或多种构成。
[0012]在一个示例中,音频系统120可以是将电音频信号转换成相应的发出声音的系统。在一些示例中,音频系统120可以包括一个或多个电声换能器或驱动器,以将该电音频信号转换成声音。在这样的示例中,音频系统120还可以包括放大器以放大声音。在示例中,音频系统120可以被设置成朝向壳体100的侧面101产生或发射声波105。在示例中,可以为装置10的特定用途和设计选择音频系统120的各种参数。例如,音频系统120可以包括换能器125,以产生或发射声波105。在这样的示例中,换能器125可以被设置在壳体100中,使得声波105朝向偏转器140发射。
[0013]在一个示例中,散热系统130可以是从电子装置10散热的任何系统。在一些示例中,热可以通过传导、对流或辐射中的任何一种来消散。在示例中,散热系统130可包括散热器、热管、空气移动装置等中的一个或多个,以使热消散。如本文所用的,“空气移动装置”可包括设计成使空气在系统中移动的任何装置,例如风扇、叶轮、鼓风机等。在示例中,散热系统130可以被构造成使热远离装置10中的热敏部件消散。例如,在计算装置中,散热系统130可以被构造成使产生的热远离处理资源消散。在示例中,散热系统130可以被设置成朝向壳体100的侧面101散热。在示例中,可以为装置10的特定用途和设计选择散热系统130的各种参数。例如,散热系统130可包括空气移动装置135,以使空气移动通过装置10。在这样的示例中,散热系统130可以被设置在壳体100中,使得加热的空气或热波107朝向偏转器140散逸。在示例中,散热系统130可以被设置成在壳体100中与音频系统120偏置。在这样的示例中,散热系统130和音频系统120可以被设置成减小装置10的尺寸。
[0014]在一个示例中,偏转器140可以被构造成使声音和热偏转。在示例中,偏转器140可以被设置在壳体100中,以从壳体100的中央开口延伸以形成侧面101的一部分。在一个示例中,偏转器140的上表面可以形成侧面101。可以为装置10的特定用途和设计选择偏转器140的各种参数。例如,偏转器140的尺寸、定向和材料选择可以由装置10的尺寸和装置10的特定用途来确定。在示例中,偏转器140可以是锥体或其他三维形状,以使热和声音偏转。尽管描绘为具有基本上三角形的基部的锥体,该基本上三角形的基部反映了壳体100的剖面形状,但是偏转器140不限于此,并且偏转器140可以与壳体100具有不同形状的基部。在示例中,偏转器140可以由金属、塑料、陶瓷、玻璃、复合材料、木材等中的一种或多种构成。
[0015]在示例中,音频系统120和散热系统130可以被设置在壳体100中,使得声波105和热波107围绕壳体100被偏转器140径向偏转。在示例中,声波105可以围绕壳体100在1度至360度的范围内被径向偏转。例如,声波105可以围绕壳体100被偏转360度,以向位于装置10周围任何位置的用户提供声音。在其他示例中,声波105可以围绕壳体100被偏转多达180度。在另一示例中,声波105可以围绕壳体100被偏转多达90度。在示例中,热波107可以围绕壳体100在1度至360度的范围内被径向偏转。例如,热波107可以围绕壳体100被偏转360度。在其他示例中,热波107可以被偏转小于360度,以将热散逸到壳体100周围的特定区域。在示例中,可以为装置10的特定用途和设计选择声波105和/或热波107围绕壳体100的特定偏转量。例如,装置10可以被设计成基于装置10的计划使用位置来发出声音和散热,该计划使用位置例如在房间的中心、房间的角落、靠墙等。
[0016]图4是示例性计算装置20的透视图。计算装置20可以包括壳体200,其收容音频系统220、散热系统230、偏转器240、包括一个或多个处理资源的主板250以及存储介质260。本文所描述的任何存储介质可以是随机存取存储器(RAM)、易失性存储器、非易失性存储器、闪存、存储驱动器(例如,硬盘驱动器)、固态驱动器、任何类型的存储盘(例如,光盘、DVD等)等或者它们的组合中的任何一种。此外,本文所描述的任何存储介质都可以是非暂时性的。
[0017]在示例中,壳体200可包括侧面201。在示例中,侧面201可以是装置20的顶侧。在示例中,壳体200可包括中央开口202。尽管描绘为基本上三角形的棱柱,但是壳体200可以被构造成任何形状,以允许将音频系统220、散热系统230、偏转器240、主板250和存储介质260设置在其中。在示例中,壳体200可以基本上类似于关于图1-3所描述的壳体100。在示例中,音频系统220可以基本上类似于关于图1-3所描述的音频系统120。在示例中,散热系统230可以基本上类似于关于图1-3所描述的散热系统130。在示例中,偏转器240可以基本上类似于关于图1-3所描述的偏转器140。
[0018]在图4的示例中,计算装置20可以包括主板250和存储介质260上的热敏部件。在这样的示例中,散热系统230可以将主板250和存储介质260上的处理资源所产生的热朝向偏转器240散逸,以在壳体200外部偏转。在示例中,散热系统230可以包括使所产生的热消散的多个部件(未全部示出),包括空气移动器装置,该空气移动器装置使热空气朝向偏转器240移动以便在壳体200外部偏转。在示例中,偏转器240可以按与图2-3中所示类似的方式使发出的声音和散逸的热从壳体径向偏转。
[0019]在操作中,音频系统220可朝向偏转器240发出声音,以围绕壳体200被偏转。在示例中,音频系统220可以被设置在壳体200中,以与壳体200的中央开口202基本上对准。在示例中,散热系统230可以被设置成在壳体200中与音频系统220偏置。在一个示例中,偏转器240可以被设置成从壳体200的中央开口202延伸,使得偏转器240的上表面形成侧面201的至少一部分。在这样的示例中,偏转器240可以与壳体200的中央开口202基本上对准。
[0020]在示例中,装置20的各种部件,例如音频系统220、散热系统230和偏转器240等,可以被设置在壳体200中,以为产生的声音和散逸的热选择偏转的范围。在示例中,产生的声音和散逸的热可以围绕壳体200在1度至360度的范围内被偏转。在其他示例中,产生的声音和散逸的热可以在彼此不同的范围内被偏转。例如,产生的声音可以围绕壳体200被偏转多达360度,并且散逸的热可以围绕壳体200被偏转多达180度。在这样的示例中,偏转的声波和热波可围绕壳体200彼此干涉多达180度。在另一示例中,产生的声音可以围绕壳体200被偏转多达360度,并且散逸的热可以围绕壳体200被偏转多达90度。在这样的示例中,偏转的声波和热波可围绕壳体200彼此干涉多达90度。
[0021]在本文所描述的各种示例中,使用偏转器来使声音和热偏转可以允许装置中的部件的更紧凑的布置。在这样的示例中,声音和热可以从装置的壳体被径向偏转。在示例中,可以选择声音和热在壳体周围的偏转量,以提供高质量的音频和高效的散热。例如,在这样的装置中,声音和散逸的热可以在该装置周围被偏转多达360度。
[0022]虽然上面已示出和描述了某些实施方式,但是可以进行形式和细节上的各种改变。例如,已关于一种实施方式和/或过程描述的一些特征可以与其他实施方式相关。换句话说,关于一种实施方式所描述的过程、特征、部件和/或属性在其他实施方式中可以是有用的。此外,还应当理解的是,本文所描述的系统和设备可以包括所描述的不同实施方式的部件和/或特征的各种组合和/或子组合。因此,参考一种或多种实施方式所描述的特征可以与本文所描述的其他实施方式组合。
[0023]上述论述意在说明本公开的原理和各种示例。一旦完全理解上述公开内容,许多变型和修改对于本领域技术人员而言就将变得显而易见。所附权利要求意在被解释为包括所有这样的变型和修改。