English:
[0001] The present invention relates generally to computer hardware and more particularly to a system for cooling a heat-generating electronic device with increased air flow.
[0002] In recent years, the number of transistors packed into processors and the clock .0 speeds of these processors have dramatically increased. Consequently, today's processors generate greater amounts of heat that must be efficiently dissipated by a cooling system to prevent the processors from overheating during operation. Figure 1 illustrates a prior art cooling system 100 for cooling a heat-generating electronic device in a computer system, such as a graphics processor (GPU). This type of cooling system is 5 sometimes referred to as a "fansink." As shown, fansink 100 characteristically includes a fan 106, fins 109 and a bottom plate 111. Typically, fansink 100 is thermally coupled to the GPU, for example, using thermal adhesive or grease having thermal properties that facilitate transferring heat generated by the GPU to the bottom plate 111. Fansink 100 may also include a heat sink lid (not shown), which, among other things, prevents :0 particles and other contaminants from entering fan 106 and air blown from fan 106 from escaping fansink 100. The heat sink Nd, together with the fins 109 and the bottom plate 111 , define a plurality of air channels 108.
[0003] Fan 106 is configured to force air through air channels 108 over bottom plate 111 such that the heat generated by the GPU transfers to the air. The heated air then exits 5 heat sink assembly 104, as depicted by flow lines 114, thereby dissipating the heat generated by the GPU into the external environment. This process cools the GPU, preventing the device from overheating during operation. Persons skilled in the art will understand that air channels 108 typically are configured to direct air blown from fan 106 over bottom plate 111 and into the external environment in a manner that most efficiently removes heat from the GPU.
[0004] One drawback of this type of "fansink" cooling system is that air is able to enter the system only through the top part of the fan. Thus, the amount of air that can be forced through the air channels is limited, which retards the cooling efficiency of these types of cooling systems. Another related drawback is that the cooling efficiency limitations oftentimes render these types of cooling systems inadequate to meet the increased heat dissipation requirements of today's GPUs and other processors. Increasing the heat dissipation capabilities of these cooling systems requires design modifications such as employing a larger fan or utilizing multiple fans. However, the available space for cooling systems within computer systems is typically fixed or, in some cases, has been decreased. Thus, prior art fansink designs not only are sometimes unable to provide the necessary amount of cooling, in many cases, the designs cannot be scaled.
[0005] As the foregoing illustrates, what is needed in the art is a way to increase the cooling efficiency of fansink-type cooling systems that does not substantially increase the size or cost of these systems.
[0006] One embodiment of the present invention sets forth a system for cooling a heat- generating electronic device. The system includes a printed circuit board having one or more ventilation holes that is coupled to a first side of the heat-generating electronic device. The system also includes a fan assembly having a top side and a bottom side that is coupled to a second side of the heat-generating electronic device. The fan assembly is disposed relative to the printed circuit board to allow air to flow into the top side of the fan assembly and into the bottom side of the fan assembly through the one or more ventilation holes.
[0007] One advantage of the disclosed system is that it provides two inlet air flow paths through the fan assembly. The two flow paths enable a greater volume of air to be forced through the fan assembly, thereby increasing the cooling efficiency of the disclosed system relative to prior art cooling systems that provide only a single inlet air flow path.
[0008] So that the manner in which the above recited features of the present invention can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only typical embodiments of this invention and are therefore not to be considered limiting of its scope, for the invention may admit to other equally effective embodiments.
[0009] Figure 1 is an isometric view of a prior art cooling system for cooling a heat- generating electronic device.
[0010] Figure 2 is a side view of the cooling system of Figure 1 , depicting the single inlet air flow path through the cooling system during operation.
[0011] Figure 3A is a top view of a cooling system for cooling a heat-generating electronic device, according to one embodiment of the present invention.
[0012] Figure 3B is a bottom view of the cooling system of Figure 3A, according to one embodiment of the present invention.
[0013] Figure 4 is a side view of the cooling system of Figures 3A and 3B, depicting two inlet air flow paths through the cooling system during operation.
[0014] Figure 5 is a computer system in which the cooling system of Figures 3A and 3B may be used for cooling one or more heat-generating electronic devices.
[0015] Figure 2 illustrates a side view of cooling system 100 of Figure 1 , depicting the single inlet air flow path through cooling system 100 during operation. As shown, cooling system 100 is coupled to a GPU 220, which is mounted on a printed circuit board (PCB) 210. As is well-known, a graphics card typically includes PCB 210, GPU 220 as well as other electronic components also coupled to PCB 210. During operation, air enters cooling system 100 through the top part of fan 106, as indicated by an inlet air flow path 230. Fan 106 forces this air through the air channels (not shown) of heat sink assembly 104, as depicted by an air flow line 231. As previously described, the heat generated by GPU 220 transfers to the air as the air flows through air channels 108 and over bottom plate 111. The heated air is then dissipated into the external environment, thereby cooling GPU 220.
[0016] Figure 3A illustrates a top view of a cooling system 300 for cooling a heat- generating electronic device, according to one embodiment of the present invention. As shown, cooling system 300 includes a PCB 320 and a fan assembly 310, which further includes a fan 305, fins 315 and a bottom plate 316. In one embodiment, fan 305 is a radial fan and is configured to blow air through air channels 317 formed in-part by fins 315 and bottom plate 316 to remove heat generated by heat-generating electronic device, such as a GPU. Similar to cooling system 100 of Figure 1 , air is able to enter fan assembly 310 through the top part of fan 305. However, as described in greater detail below in conjunction with Figure 3B, PCB 320 includes one or more ventilation holes that enable a second inlet air flow path through fan assembly 310. This second inlet air flow path allows fan 305 to blow a greater volume of air through air channels 317, thereby increasing the cooling efficiency of cooling system 300 relative to prior art fansink cooling systems like cooling system 100 of Figure 1.
[0017] Figure 3B illustrates a bottom view of cooling system 300 of Figure 3A, according to one embodiment of the present invention. As shown, PCB 320 may include one or more ventilation holes 330, 335 and 340, which provide a second inlet air flow path through PCB 320 into fan assembly 310 (not shown). As previously described herein, with the second inlet air flow path, air is able to enter into fan assembly 310 through both the top of fan 305 and the bottom of fan 305, thereby increasing the volume of air that can be blown through the air channels 317. Ventilation holes 330, 335 and 340 may have any shape and may be placed at any location on PCB 320, so long as a second inlet air flow path can be established that enables air to reach the blades of fan 305. In the embodiment depicted in Figure 3B, ventilation holes 330, 335 and 340 are substantially aligned with the circular path traversed by the blades of fan 305. Also, ventilation holes 330, 335 and 340 are preferably located on PCB 320 such that the positioning of the various electronic components coupled to PCB 320 is not interrupted.
[0018] Figure 4 illustrates a side view of cooling system 300 of Figures 3A and 3B, depicting two inlet air flow paths through cooling system 300 during operation. As shown, cooling system 300 is coupled to a GPU 420, which is mounted on printed PCB 320. During operation, air enters cooling system 300 through the top part of fan 305, as indicated by a first inlet air flow path 430, and through ventilation holes 330 and 335 and into the bottom part of fan 305, as indicated by a second inlet air flow path 440. Fan 305 forces this air through the air channels 317 (not shown) of fan assembly 310, as depicted by air flow lines 431. As previously described, the heat generated by GPU 420 transfers to the air as the air flows through air channels 317 and over bottom plate 316. The heated air is then dissipated into the external environment, thereby cooling GPU 420. Again, due to second inlet air flow path 440, fan 305 is able to blow a greater volume of air through air channels 317, thereby increasing the cooling efficiency of cooling system 300 relative to prior art cooling system 100, which provides only a single inlet air flow path. For example, experimental data has shown that a drop in operating temperature of about 10% results when a GPU operating at full power (approximately 75 Watts) is cooled using cooling system 300 instead of a cooling system similar to prior art cooling system 100.
[0019] Figure 5 illustrates a computer system 500 in which cooling system 300 of Figures 3A and 3B may be used for cooling one or more heat-generating electronic devices. Computer system 500 may be any type of computer system, such as a desktop, laptop, server, mainframe, set-top box, and the like, within which one or more heat-generating electronic devices reside. As shown, computer system 500 includes a housing 501 and a motherboard 504. A central processing unit (CPU) 506, a cooling system 508 for cooling CPU 506, a system fan 511 for removing heat from computer system 500, and one or more peripheral component interface (PCI) cards 512 are mounted on motherboard 504. Each PCI card 512 interfaces with a slot located in the back part of housing 501.
[0020] Motherboard 504 also incorporates a graphics card 510 that includes PCB 320, a GPU 520 mounted to PCB 320 and other electronic components also mounted to PCB 320. Graphics card 510 enables computing system 500 to rapidly process graphics related data for graphics-intensive applications, such as gaming, video processing and other similar applications. As also shown, cooling system 300 of Figures 3A and 3B is used to cool GPU 520 during operation. More specifically, fan assembly 310 is coupled to GPU 520 on a side opposite to PCB 320. Again, since PCB 320 includes one or more ventilation holes, there are two inlet air flow paths through fan assembly 310 instead of one, enabling more efficient cooling of GPU 520.
[0021] Persons skilled in the art will recognize that cooling system 300 may be used to cool any heat-generating electronic device within a computer system, including, without limitation, a semiconductor device such as GPU 520 or CPU 506, one or more memory chips, or any combination of these devices. Cooling system 300 also may be used to cool any type of power supply subsystem within a computer system. In addition, although cooling system 300 is described herein within the context of graphics cards, persons skilled in the art will understand that cooling system 300 may comprise the motherboard of a computer system, where the motherboard includes the one or more ventilation holes that enable the second inlet air flow path through fan assembly 310.
[0022] Although the embodiment disclosed above, which incorporates the teaching of the present invention, has been shown and described in detail herein, those skilled in the art can readily devise other varied embodiments which still incorporate the teachings and do not depart from the spirit of the invention.

中文:
[0001]本发明一般涉及计算机硬件,且更确切地说涉及一种用增加的气流来冷却产生热的电子装置的系统。
[0002]近年来,处理器中所封装的晶体管数和这些处理器的时钟速度已显著增加。因此,如今的处理器产生更大量的热,必须通过冷却系统有效地耗散这些热以防止处理器在操作期间过热。图1说明现有技术的冷却系统100,此冷却系统100用于冷却计算机系统中产生热的电子装置,例如图形处理器(GPU)。此类型冷却系统有时称为“散热器”。如图示,散热器100特征性地包括风扇106、鳍片109和底板111。通常,例如使用具有促进GPU所产生的热传递到底板111的热特性的散热胶或散热膏,而将散热器100与GPU热耦合。散热器100还可包括散热片盖(未图示),此散热片盖尤其防止粒子和其它污染物进入风扇106,且防止风扇106吹出的空气从散热器100逸离。散热片盖与鳍片109和底板111一起限定多个空气通道108。
[0003]风扇106经配置以强制使空气通过空气通道108到达底板111上方,以使GPU所产生的热传递给空气。接着,经加热的空气离开散热片组合件104,如流线114所描绘,从而使GPU所产生的热耗散到外部环境中。此过程冷却GPU,从而防止装置在操作期间过热。所属领域的技术人员将理解,空气通道108通常经配置成以最有效地除去来自GPU的热的方式将风扇106吹出的空气引导到底板111上方并引导到外部环境中。
[0004]此类型的“散热器”冷却系统的一个缺点是,空气仅能够通过风扇的顶部部分进入系统。因而,限制了可被强制通过空气通道的空气量,此阻碍了这些类型的冷却系统的冷却效率。另一相关缺点是,冷却效率限制经常致使这些类型的冷却系统不能充分满足如今的GPU和其它处理器增加的热耗散要求。增加这些冷却系统的热耗散能力要求设计修改,例如采用较大的风扇或利用多个风扇。然而,在计算机系统内冷却系统的可利用空间通常是固定的,或者在一些情况下已减小。因而,现有技术的散热器设计不但有时不能提供必需的冷却量,在许多情况下设计不能进行调整。
[0005]如前述内容所说明,此项技术中需要一种大体上不增加散热器类型冷却系统的尺寸或成本的方法来增加这些系统的冷却效率。
[0006]本发明的一个实施例陈述一种用于冷却产生热的电子装置的系统。所述系统包括具有一个或一个以上通风孔的印刷电路板,所述印刷电路板耦合到所述产生热的电子装置的第一侧。所述系统还包括具有顶侧和底侧的风扇组合件,所述风扇组合件耦合到所述产生热的电子装置的第二侧。所述风扇组合件相对于所述印刷电路板而安置,以允许空气通过所述一个或一个以上通风孔流动到所述风扇组合件的顶侧中,并流动到所述风扇组合件的所述底侧中。
[0007]所揭示的系统的一个优点为,其提供两个通过所述风扇组合件的进入空气流动路径。所述两个流动路径使得能够强制使更大体积的空气通过所述风扇组合件,从而相对于只提供单个进入空气流动路径的现有技术冷却系统,增加了所揭示系统的冷却效率。
[0008]通过参考实施例可获得上文简要概述的本发明的更详细描述,以便可详细地理解上文叙述本发明的特征所采用的方式,其中一些实施例在所附图式中说明。然而,应注意,附图仅说明本发明的典型实施例,且因此不应认为限制本发明的范畴,因为本发明可承认其它同等有效的实施例。
[0009]图1为用于冷却产生热的电子装置的现有技术冷却系统的等角视图。
[0010]图2为图1的冷却系统的侧视图,其描绘操作期间通过冷却系统的单个进入空气流动路径。
[0011]图3A为根据本发明一个实施例的用于冷却产生热的电子装置的冷却系统的俯视图。
[0012]图3B为根据本发明一个实施例的图3A的冷却系统的仰视图。
[0013]图4为图3A和图3B的冷却系统的侧视图,其描绘操作期间通过冷却系统的两个进入空气流动路径。
[0014]图5为可使用图3A和图3B的冷却系统来冷却一个或一个以上产生热的电子装置的计算机系统。
[0015]图2说明图1的冷却系统100的侧视图,其描绘操作期间通过冷却系统100的单个进入空气流动路径。如图示,冷却系统100耦合到安装在印刷电路板(PCB)210上的GPU 220。众所周知,图形卡通常包括PCB 210、GPU 220以及也耦合到PCB 210的其它电子组件。操作期间,空气通过风扇106的顶部部分进入冷却系统100,如由进入空气流动路径230所指示。风扇106强制使此空气通过散热片组合件104的空气通道(未图示),如由空气流线231所描绘。如先前所描述,当空气流过空气通道108并越过底板111上方时,GPU 220所产生的热传递给空气。接着,经加热的空气耗散到外部环境中,从而冷却GPU 220。
[0016]图3A说明根据本发明一个实施例的用于冷却产生热的电子装置的冷却系统300的俯视图。如图示,冷却系统300包括PCB 320和风扇组合件310,风扇组合件310进一步包括风扇305、鳍片315和底板316。在一个实施例中,风扇305为径流式风扇且经配置以吹动空气通过由鳍片315和底板316部分形成的空气通道317,从而除去产生热的电子装置(例如GPU)所产生的热。与图1的冷却系统100类似,空气能够通过风扇305的顶部部分进入风扇组合件310。然而,如下文结合图3B更详细地描述,PCB 320包括一个或一个以上通风孔,其提供通过风扇组合件310的第二进入空气流动路径。此第二进入空气流动路径允许风扇305吹动更大量的空气通过空气通道317,从而相对于类似图1的冷却系统100的现有技术风扇散热冷却系统,增加了冷却系统300的冷却效率。
[0017]图3B说明根据本发明一个实施例的图3A的冷却系统300的仰视图。如图示,PCB320可包括一个或一个以上通风孔330、335和340,其提供通过PCB 320进入风扇组合件310(未图示)的第二进入空气流动路径。如本文先前所述,利用所述第二进入空气流动路径,空气能够通过风扇305的顶部和风扇305的底部进入风扇组合件310中,从而增加了可被吹动通过空气通道317的空气的量。通风孔330、335和340可具有任何形状且可置于PCB 320上任何位置处,只要可建立使空气能够到达风扇305的叶片的第二进入空气流动路径。在图3B所描绘的实施例中,通风孔330、335和340与风扇305的叶片所经过的圆形路径大体上对准。而且,通风孔330、335和340优选位于PCB 320上,以使得不妨碍与PCB 320耦合的各种电子组件的定位。
[0018]图4说明图3A和图3B的冷却系统300的侧视图,其描绘操作期间通过冷却系统300的两个进入空气流动路径。如图示,冷却系统300耦合到安装在印刷PCB 320上的GPU 420。操作期间,空气通过风扇305的顶部部分(如由第一进入空气流动路径430所指示)且通过通风孔330和335并进入风扇305的底部部分(如由第二进入空气流动路径440所指示)而进入冷却系统300。风扇305强制使此空气通过风扇组合件310的空气通道317(未图示),如由空气流线431所描绘。如先前所述,当空气流过空气通道317并越过底板316上方时,GPU 420所产生的热传递给空气。接着,经加热的空气耗散到外部环境中,从而冷却GPU 420。再次,归因于第二进入空气流动路径440,风扇305能够吹动更大量的空气通过空气通道317,从而相对于只提供单个进入空气流动路径的现有技术冷却系统100,增加了冷却系统300的冷却效率。举例来说,实验数据已显示,当使用冷却系统300以代替类似于现有技术冷却系统100的冷却系统,来冷却以全功率(约75瓦特)操作的GPU时,操作温度下降约10%。
[0019]图5说明可使用图3A和图3B的冷却系统300来冷却一个或一个以上产生热的电子装置的计算机系统500。计算机系统500可为任何类型的计算机系统,例如桌上型计算机、膝上型计算机、服务器、大型机、机顶盒和类似物,其内驻留有一个或一个以上产生热的电子装置。如图示,计算机系统500包括外壳501和主板504。中央处理单元(CPU)506、用于冷却CPU 506的冷却系统508、用于除去来自计算机系统500的热的系统风扇511和一个或一个以上外围组件接口(PCI)卡512安装在主板504上。每一PCI卡512与位于外壳501后部的插槽介接。
[0020]主板504还合并有图形卡510,图形卡510包括PCB 320、安装到PCB 320上的GPU 520和也安装到PCB 320上的其它电子组件。图形卡510使得计算系统500能够快速处理与图形有关的数据以用于图形密集型应用,例如游戏、视频处理和其它类似应用。同样如图示,图3A和图3B的冷却系统300用于在操作期间冷却GPU 520。更明确地说,风扇组合件310在与PCB 320相对的一侧上耦合到GPU 520。再次,由于PCB320包括一个或一个以上通风孔,因此存在通过风扇组合件310的两个进入空气流动路径而不是一个,从而使得能够更有效地冷却GPU 520。
[0021]所属领域的技术人员将认识到,冷却系统300可用于冷却计算机系统内的任何产生热的电子装置,包括(但不限于)例如GPU 520或CPU 506的半导体装置、一个或一个以上存储器芯片或这些装置的任何组合。冷却系统300还可用于冷却计算机系统内任何类型的电源子系统。另外,尽管本文在图形卡的情形下描述冷却系统300,但所属领域的技术人员将理解,冷却系统300可包含计算机系统的主板,其中主板包括提供通过风扇组合件310的第二进入空气流动路径的一个或一个以上通风孔。
[0022]尽管在本文中已展示并详细描述了合并有本发明的教示的上文所揭示的实施例,但所属领域的技术人员可易于设计仍合并有所述教示且不脱离本发明的精神的其它各种实施例。