English:
[0001] This technology includes electronic devices for sensing conditions of a tire on a vehicle.
[0002] Electronic devices can be used to sense conditions of a tire on a vehicle. Such devices include air pressure and temperature sensors that are mounted inside the tire, and also include radio frequency transmitters for transmitting pressure and temperature signals from the tire to the vehicle.
[0003] An electronics assembly is provided for use with a tire. In a given example, the assembly includes a base and a plurality of modules. The base is configured for mechanical attachment to the tire and includes an electronic device. The base also includes a mechanical attachment element. Each module includes an electronic device, a lower mechanical attachment element, and an upper mechanical attachment element.
[0004] The lower mechanical attachment element on each one of the modules is configured to attach to the upper mechanical attachment element on any other one of the modules. In this configuration, the modules are interchangeably mechanically attachable to each other in a stacked arrangement.
[0005] The lower mechanical attachment element on each one of the modules is also configured to attach to the mechanical attachment element on the base. The modules are thus mechanically attachable to the base interchangeably with each other, which enables any one of the modules to be installed as the lowermost module in the stacked arrangement.
[0006] Additionally, a lower electrical contact on each one of the modules is configured to electrically connect with an upper electrical contact on any other one of the modules. In this configuration, the modules are interchangeably electrically connectable with each other in the stacked arrangement. The lower electrical contact on each one of the modules is further configured to connect electrically with an electrical contact on the base, whereby the modules are interchangeably electrically connectable with the base as the lowermost module in the stacked arrangement.
[0009] FIG. 2 is an exploded view of parts of the electronic assembly of FIG. 1.
[0010] FIG. 3 is a schematic sectional view of an alternative embodiment of a tire and an electronics assembly for use with the tire.
[0011] FIG. 4 is a schematic sectional view of alternative embodiment of a tire and an electronics assembly for use with the tire.
[0012] FIG. 5 is a schematic sectional view of an alternative embodiment of a tire and an electronics assembly for use with the tire.
[0013] FIG. 6 is a schematic sectional view of an alternative embodiment of a tire and an electronics assembly for use with the tire.
[0014] FIG. 7 is a schematic sectional view of an alternative embodiment of a tire and an electronics assembly for use with the tire.
[0015] The structures illustrated in the drawings include examples of the elements recited in the claims. The illustrated structures thus include examples of how a person of ordinary skill in the art can make and use the claimed invention. They are described here to provide enablement and best mode without imposing limitations that are not recited in the claims. One or more elements of one embodiment may be used in combination with, or as a substitute for, one or more elements of another embodiment as needed for any particular implementation of the invention.
[0016] As shown in FIG. 1, a pneumatic tire 10 includes a tread 12, bead portions 14, and sidewalls 16 interconnecting the tread 12 with the bead portions 14. An inner surface 18 of the tire 10 defines the periphery of a cavity 21 within the tire 10. The inner surface 18 in this example is provided by an innerliner 22 that reaches fully throughout the interior of the tread 12, the bead portions 14, and the sidewalls 16.
[0017] Also shown in FIG. 1 is an electronics assembly 30 for use with the tire 10. The electronics assembly 30 in this example includes a base 32 and multiple modules 34. As shown schematically in FIG. 2, each module 34 includes one or more electronic devices 36. The devices 36 in the modules 34 may include air pressure sensors, temperature sensors, power generation or storage devices, radio frequency transmitters, radio frequency receivers, and/or any other electronic devices suitable for obtaining and/or providing information relating to conditions of the tire 10.
[0018] The base 32 also includes one or more electronic devices 40 (FIG. 2). These may include an electronic device 40 configured to provide a unique identification signal for identifying the tire 10 in distinction from another tire on the same vehicle or a different vehicle. Other electronic devices 40 in the base 32 may be configured to receive and/or transmit signals between the devices 40 in the base, the devices 36 in the modules 34, and the vehicle. In each case, the electronic devices 36 and 40 may be configured in any suitable manner known in the art.
[0019] As shown separately in FIG. 2, each of the modules 34 of FIG. 1 includes a panel shaped housing 50 containing the respective electronic devices 36. Upper mechanical attachment elements 52 face upward from each housing 50. Lower mechanical attachment elements 54 face downward from each housing 50. The lower mechanical attachment elements 54 on each one of the housings 50 are configured to releasably mechanically attach to the upper mechanical attachment elements 52 on any other one of the housings 50. Accordingly, the modules 34 are interchangeably mechanically attachable to each other in a stacked arrangement, as shown for example in FIG. 1. The mechanical attachment elements 52 and 54 shown schematically in the drawings can be configured to accomplish the releasable attachments in any suitable manner known in the art of interconnecting modular structures.
[0020] The base 32 of the electronics assembly 30 is attached to the tire 10 at the interior of the tire 10. As shown schematically in FIG. 2, the base 32 includes a panel-shaped housing 60 containing the electronic devices 40. The housing 60 has a lower side surface 62 adhered to the inner surface 18 of the tire 10. Mechanical attachment elements 64 face upward from the housing 60. The lower mechanical attachment elements 54 on any one of the modules 34 can releasably mechanically attach to the mechanical attachment elements 64 on the base 32. This enables any one of the modules 34 to be installed as the lowermost module 34 in the stack shown in FIG. 1.
[0021] In addition to the mechanical attachment elements 52 and 54, each module 34 also has upper electrical contacts 72 facing upward from the housing 50, and lower electrical contacts 74 facing downward from the housing 50. The lower electrical contacts 74 on each one of the modules 34 are configured to releasably electrically connect with the upper electrical contacts 72 on any other one of the housings 50. This enables the modules 34 to be interchangeably electrically connectable with each other in the stack of FIG. 1. The electrical contacts 72 and 74 shown schematically in the drawings can be provided as pin and socket connectors that also function as the mechanical attachment elements 52 and 54 described above. In other embodiments the electrical contacts 72 and 74 can be configured to accomplish the releasable electrical connections in any suitable manner known in the art of electrical contacts.
[0022] The base 32 has electrical contacts 76 facing upward from the housing 60. Like the electrical contacts 72 and 74 on the modules 34, the electrical contacts 76 on the base 32 can include pin and socket connectors that double as the mechanical attachment elements 64. The lower electrical contacts 74 on any one of the module housings 50 can releasably electrically connect with the electrical contacts 76 on the base 32. Any one of the modules 34 can thus function as the lowermost module 34 in the stack of FIG. 1.
[0023] As further shown schematically in FIG. 2, the electrical devices 36 in the modules 34 are mounted on printed circuit boards 80. Each printed circuit board 80 is configured to electrically connect the devices 36 in the respective module 34 in series with the devices 36 in any other two of the modules 34. Each printed circuit board 80 is further configured to electrically connect the devices 36 in the respective module 34 in series with the devices 40 in the base 32.
[0024] FIGS. 3-5 show alternative embodiments of a base for use with modules like the modules 34 of FIGS. 1 and 2. As shown in FIG. 3, a base 90 that is substantially the same as the base 32 is embedded within the body of the tire in the tread portion 92 of a tire 94. As shown in FIG. 4, a base 100 is attached to a tire 102 by fasteners 104 that are attached to an innerliner 106. As shown in FIG. 5, a support platform 110 is installed between layers 112 and 114 of a tire 116. The base 118 in this embodiment is mounted over the innermost layer 112 of the tire 116 and is retained in place by fasteners 120 proj ecting from the support platform 110 through the innermost layer 112.
[0025] In the alternative embodiment of FIG. 6, the modules 121 have upper mechanical attachment elements 122 and lower attachment elements 124. One of the lower mechanical attachment elements 124 on each module 121 is configured as a flexible hook for snapping into releasable interlocked engagement with one of the upper mechanical attachment elements 122 on any other one of the modules 121. Those lower attachment elements 124 can likewise snap into engagement with complimentary attachment element 128 on a base structure 130. The embodiment of FIG. 7 also has flexible mechanical attachment elements 140 for each module 142 to snap into engagement with any other module 142 or with the base structure 144.
[0026] This written description sets for the best mode of carrying out the invention and describes the invention so as to enable a person of ordinary skill in the art to make and use the invention, by presenting examples of the elements recited in the claims. The detailed descriptions of those elements do not impose limitations that are not recited in the claims.

中文:
[0001]本技术包括用于感测车辆上的轮胎的状况的电子设备。
[0002]电子设备可用于感测车辆上的轮胎的状况。此类设备包括安装在轮胎内部的空气压力和温度传感器,并且还包括用于将来自轮胎的压力和温度信号发送至车辆的射频发射器。
[0003]提供了一种与轮胎一起使用的电子组件。在给定示例中,该组件包括基座和多个模块。该基座被配置用于机械附接至轮胎并且包括电子设备。该基座还包括机械附接元件。每个模块包括电子设备、下部机械附接元件和上部机械附接元件。
[0004]模块中的每个模块上的下部机械附接元件被配置为附接至模块中的任何其它一个模块上的上部机械附接元件。在这种配置中,模块能够以堆叠布置可互换地机械附接至彼此。
[0005]模块中的每个模块上的下部机械附接元件还被配置为附接至该基座上的机械附接元件。因此,模块能够彼此可互换地机械附接至该基座,这使得模块中的任何一个模块能够作为该堆叠布置中的最下部模块安装。
[0006]另外,模块中的每个模块上的下部电接触件被配置为与模块中的任何其它一个模块上的上部电接触件电连接。在这种配置中,模块能够以堆叠布置可互换地与彼此机械连接。模块中的每个模块上的下部电接触件进一步被配置为与该基座上的电接触件电连接,由此这些模块能够可互换地作为堆叠布置中的最下部模块与该基座电连接。
[0009]图2是图1的电子组件的各部分的分解图。
[0010]图3是轮胎和与轮胎一起使用的电子组件的另选实施方案的示意性截面图。
[0011]图4是轮胎和与轮胎一起使用的电子组件的另选实施方案的示意性截面图。
[0012]图5是轮胎和与轮胎一起使用的电子组件的另选实施方案的示意性截面图。
[0013]图6是轮胎和与轮胎一起使用的电子组件的另选实施方案的示意性截面图。
[0014]图7是轮胎和与轮胎一起使用的电子组件的另选实施方案的示意性截面图。
[0015]附图中所示的结构包括权利要求书中列举的元件的示例。因此,所示的结构包括本领域的普通技术人员如何制造和使用受权利要求书保护的本发明的示例。在此描述了它们以提供启用和最佳模式,而不会强加权利要求书中未列举的限制。根据本发明的任何特定具体实施的需要,一个实施方案的一个或多个元件可与另一实施方案的一个或多个元件组合使用或替代使用。
[0016]如图1所示,充气轮胎10包括胎面12、胎圈部分14和侧壁16,该侧壁将胎面12与胎圈部分14互连。轮胎10的内表面18限定轮胎10内的腔21的周边。此示例中的内表面18由内衬22提供,该内衬完全到达整个胎面12、胎圈部分14和侧壁16的内部。
[0017]在图1中还示出了与轮胎10一起使用的电子组件30。此示例中的电子组件30包括基座32和多个模块34。如图2示意性所示,每个模块34包括一个或多个电子设备36。模块34中的设备36可包括空气压力传感器、温度传感器、发电或存储设备、射频发射器、射频接收器、和/或适合于获得和/或提供与轮胎10的状况有关的信息的任何其它电子设备。
[0018]基座32还包括一个或多个电子设备40(图2)。这些电子设备可以包括电子设备40,该电子设备被配置为提供用于识别轮胎10的唯一识别信号以与同一车辆或不同车辆上的另一个轮胎区别开来。基座32中的其它电子设备40可被配置为在基座中的设备40、模块34中的设备36和车辆之间接收和/或发射信号。在每种情况下,电子设备36和40可以以本领域中已知的任何合适方式配置。
[0019]如单独在图2中所示,图1的模块34中的每个模块包括板状壳体50,该板状壳体容纳相应的电子设备36。上部机械附接元件52从每个壳体50面向上方。下部机械附接元件54从每个壳体50面向下方。壳体50中的每个壳体上的下部机械附接元件54被配置为可释放地机械附接至壳体50中的任何其它一个壳体上的上部机械附接元件52。因此,如例如在图1中所示,模块34能够以堆叠布置可互换地机械附接至彼此。在附图中示意性地示出的机械附接元件52和54可被配置为以互连模块化结构领域中已知的任何合适方式实现可释放的附接。
[0020]电子组件30的基座32在轮胎10的内部处附接至轮胎10。如图2示意性所示,基座32包括板状壳体60,该板状壳体容纳电子设备40。壳体60具有下侧表面62,该下侧表面粘附至轮胎10的内表面18。机械附接元件64从壳体60面向上方。模块34中的任何一个模块上的下部机械附接元件54可以可释放地机械附接至基座32上的机械附接元件64。这使得模块34中的任何一个模块能够作为图1所示的堆叠中的最下部模块34安装。
[0021]除了机械附接元件52和54之外,每个模块34还具有从壳体50面向上的上部电接触件72和从壳体50面向下的下部电接触件74。模块34中的每个模块上的下部电接触件74被配置为与壳体50中的任何其它一个壳体上的上部电接触件72可释放地电连接。这使得模块34能够以图1的堆叠彼此可互换地电连接。在附图中示意性地示出的电接触件72和74可以作为管脚和插座连接器提供,该管脚和插座连接器也用作如上所述的机械附接元件52和54。在其它实施方案中,电接触件72和74可被配置为以电接触件领域中已知的任何合适的方式实现可释放的电连接。
[0022]基座32具有电接触件76,这些电接触件从壳体60面向上。类似于模块34上的电接触件72和74,基座32上的电接触件76可包括引脚和插座连接器,该引脚和插座连接器兼作机械附接元件64。模块壳体50中的任何一个模块壳体上的下部电接触件74可与基座32上的电接触件76可释放地电连接。因此,模块34中的任何一个模块可用作图1的堆叠中的最下部模块34。
[0023]如进一步在图2中示意性所示,模块34中的电气设备36安装在印刷电路板80上。每个印刷电路板80被配置为将相应模块34中的设备36与模块34中的任何其它两个模块中的设备36串联地电连接。每个印刷电路板80被进一步配置为将相应模块34中的设备36与基座32中的设备40串联地电连接。
[0024]图3至图5示出了用于与模块(如图1和图2的模块34)一起使用的基座的另选实施方案。如图3所示,与基座32基本上相同的基座90嵌入在轮胎94的胎面部分92中的轮胎主体内。如图4所示,基座100通过紧固件104附接至轮胎102,该紧固件附接至内衬106。如图5所示,支撑平台110安装在轮胎116的层112与114之间。此实施方案中的基座118安装在轮胎116的最内层112上方,并且通过紧固件120保持在适当位置,该紧固件从支撑平台110穿过最内层112突出。
[0025]在图6的替代实施方案中,模块121具有上部机械附接元件122和下部附接元件124。每个模块121上的下部机械附接元件124中的一个下部机械附接元件被配置作为柔性钩,以用于卡扣成与模块121中的任何其它一个模块上的上部机械附接元件122中的一个上部机械附接元件可释放互锁接合。那些下部附接元件124可同样卡扣成与基座结构130上的互补附接元件128接合。图7的实施方案还具有用于每个模块142的柔性机械附接元件140,该柔性机械附接元件卡扣成与任何其它模块142或与基座结构144接合。
[0026]该书面描述阐述了实施本发明的最佳模式并且描述了本发明,以便通过提供权利要求书中所列举的元件的示例使本领域的普通技术人员能够制造和使用本发明。这些元件的详细描述不会强加权利要求书中未列举的限制。