English:
[0001] This disclosure relates generally to a method for flexible hybrid electronics (FHE) simultaneous printing of a plurality of electrical devices and, more particularly, to a method for FHE simultaneous printing of a plurality of electrical devices that includes drilling vias through a flexible substrate, printing circuit elements for a plurality of electrical devices on a top surface of the substrate using a conductive ink, and printing circuit elements for the plurality of electrical devices on a bottom surface of the substrate using the conductive ink, where printing the circuit elements on the top and bottom surfaces of the substrate causes the ink to flow through the vias to provide an electrical connection between the circuit elements on the top and bottom surfaces.
[0002] Flexible hybrid electronics (FHE) is a process for creating flexible, stretchable or conformable electrical devices. More specifically, an FHE process combines elements of the electronics industry with elements of the high-precision printing industry to combine the best of printed and conventional electronics. The FHE process includes printing conductive interconnects and as many electrical components as possible on a flexible substrate. Integrated circuits (IC) are produced separately using photolithography and then mounted to the substrate. The FHE process uses a hybrid of printed and placed functionality that provides the flexibility long associated with printed electronics, but with the processing capability of an integrated circuit. This combination of flexibility and processing capability is very desirable since it reduces weight and enables new form factors, while maintaining desirable functionality, such as data logging and Bluetooth connectivity. Improvements can be made to existing FHE processes to reduce cost and complexity and increase performance of electrical devices.
[0003] The following discussion discloses and describes a method for FHE simultaneous printing of a plurality of electrical devices. The method includes providing a flexible substrate having a top surface and a bottom surface and providing vias through the substrate for all of the plurality of electrical devices. The method also includes printing circuit elements for the plurality of devices on the top surface of the substrate using a conductive ink, and printing circuit elements for the plurality of devices on the bottom surface of the substrate using the conductive ink, where printing the circuit elements on the top and bottom surfaces of the substrate causes the ink to flow through the vias to provide an electrical connection between the circuit elements on the top and bottom surfaces.
[0005] Figure 1 is a top view of an RFID device assembly including RFID devices having antennas fabricated by an FHE process;
[0007] Figure 3 is a top view of another RFID device assembly including RFID devices having antennas fabricated by an FHE process;
[0008] Figure 4 is a flow diagram showing an FHE process for fabricating the assembly shown in figure 3;
[0009] Figure 5 is a flow diagram showing a process for forming vias in a substrate associated with the process shown in figure 4; and
[0010] Figure 6 is a top view of one of the RFID devices shown in figure 3 separated from the assembly.
[0011] The following discussion of the embodiments of the disclosure directed to a method for FHE simultaneous printing of a plurality of electrical devices is merely exemplary in nature, and is in no way intended to limit the disclosure or its applications or uses.
[0012] Figure 1 is a top view and figure 2 is a bottom view of an RFID device assembly 10 fabricated by an FHE process. The assembly 10 includes a plurality of RFID devices 12, here nine, each having an RFID antenna 14 including a wound conductive trace 16 printed on a top surface 18 of a flexible substrate 20, such as a polyester substrate, and an RFID antenna 22 including a wound conductive trace 24 printed on a bottom surface 26 of the flexible substrate 20. Opposing ends 28 and 30 of the trace 16 extend towards a center of the antenna 14 and opposing ends 32 and 34 of the trace 24 extend towards a center of the antenna 22, and each provide an electrical connection point for an electrical component (not shown), such as an RFID chip. A number of vias 36 are drilled through the substrate 20 prior to the traces 16 and 24 being printed using a conductive ink, such as a silver ink, so that when the traces 16 and 24 are printed, the conductive ink flows into the vias 36 and makes an electrical connection between the antennas 14 and 22 through the substrate 20. Once the RFID antennas 14 and 22 are fabricated and the components are attached to the ends 28 and 30 of the trace 16 and the ends 32 and 34 of the trace 24, the substrate 20 is diced to separate the RFID devices 12. The conductive traces 16 from one RFID antenna 14 to another RFID antenna 14 and likewise the conductive traces 24 from one RFID antenna 22 to another RFID antenna 22 are shown as having different widths, number of turns and trace spacing for illustrative purposes to show that the fabrication of different RFID devices operating at different frequencies and for different applications can be fabricated at the same time.
[0013] Figure 3 is a top view of another RFID device assembly 40 similar to the assembly 10, but including twelve RFID devices 42 fabricated on a flexible substrate 44. The RFID devices 42 each include an RFID antenna 46 having a printed conductive trace 48 and vias 50. Each RFID device 42 also includes printed graphics 52 within the antenna 46 that identifies the device 42.
[0014] Figure 4 is a flow diagram 60 of an FHE process for fabricating, for example, the assembly 40. The flexible substrate 44 is provided at box 62 and the graphics 52 are printed on the top surface and/or the bottom surface of the substrate 44 at box 64. The vias 50 are then provided through the substrate 44 at box 66. The antennas 46 are then printed on the top layer of the substrate 44 at box 68 and antennas (not shown) are printed on the bottom layer of the substrate 44 at box 70 so that the conductive ink flows into the vias 50 and makes an electrical connection between the antennas on the top and bottom surface of the substrate 44. The RFID devices 42 are then tested at box 72.
[0015] Figure 5 is a flow diagram 80 showing a process for providing the vias 50. The substrate 44 is placed on a drilling machine at box 82 and the vias 50 are drilled by the machine at box 84. The drill bit on the machine is inspected for damage and wear every certain number of drilling operations, such as ten, at box 86. The vias 50 are then cleaned of debris and inspected at box 88.
[0016] Once the RFID devices 42 have been tested, they are separated from each other by cutting or dicing the substrate 44. An RFID chip 90 or other integrated circuit is then connected, for example, manually connected, to ends 92 and 94 of the antenna 46, as shown in figure 6.
[0017] The foregoing discussion discloses and describes merely exemplary embodiments of the present disclosure. One skilled in the art will readily recognize from such discussion and from the accompanying drawings and claims that various changes, modifications and variations can be made therein without departing from the spirit and scope of the disclosure as defined in the following claims.

中文:
[0001]本公开总体上涉及一种用于柔性混合电子(FHE)同时印刷多个电子器件的方法,并且更具体地,涉及一种用于FHE同时印刷多个电子器件的方法,该方法包括穿过柔性基板钻通孔、使用导电油墨在基板的顶表面上印刷用于多个电子器件的电路元件,以及使用导电油墨在基板的底表面上印刷用于多个电子器件的电路元件,其中,将电路元件印刷在基板的顶表面和底表面上,使得油墨流过通孔,以在顶表面和底表面上的电路元件之间提供电连接。
[0002]柔性混合电子(FHE)是一种创建柔性、可拉伸或舒适的电子器件的过程。更具体地,FHE过程将电子行业的元件与高精度印刷行业的元件相结合,以将印刷电子产品和传统电子产品的优点结合起来。FHE过程包括在柔性基板上印刷导电互连件和尽可能多的电子部件。集成电路(IC)使用光刻技术单独生产,然后被安装到基板上。FHE过程采用混合的印刷和放置功能,不仅提供了与印刷电子器件长期相关的柔性,而且还具有集成电路的处理能力。这种柔性和处理能力的结合是非常理想的,因为它减轻了重量并实现了新的外形尺寸,同时保持了所需的功能,例如数据记录和蓝牙连接。可以对现有FHE过程进行改进,以降低成本和复杂性并提高电子器件的性能。
[0003]以下讨论公开并描述了用于FHE同时印刷多个电子器件的方法。该方法包括提供具有顶表面和底表面的柔性基板,以及为所有多个电子器件提供穿过基板的通孔。该方法还包括使用导电油墨在基板的顶表面上印刷用于多个器件的电路元件,以及使用导电油墨在基板的底表面上印刷用于多个器件的电路元件,其中,将电路元件印刷在基板的顶表面和底表面上,使得油墨流过通孔,以在顶表面和底表面上的电路元件之间提供电连接。
[0005]图1是包括具有通过FHE过程制造的天线的RFID器件的RFID器件组件的顶视图;
[0007]图3是包括具有通过FHE过程制造的天线的RFID器件的另一个RFID器件组件的顶视图;
[0008]图4是示出用于制造图3所示的组件的FHE过程的流程图;
[0009]图5是示出与图4所示的过程相关的用于在基板中形成通孔的过程的流程图;以及
[0010]图6是图3中所示的与组件分离的RFID器件之一的顶视图。
[0011]以下针对用于FHE同时印刷多个电子器件的方法的本公开实施例的讨论本质上仅仅是示例性的,并且决不旨在限制本公开或其应用或用途。
[0012]图1是通过FHE过程制造的RFID器件组件10的俯视图,图2是通过FHE过程制造的RFID器件组件10的仰视图。组件10包括多个RFID器件12,此处数量为九个,每个RFID器件具有RFID天线14和RFID天线22,RFID天线14包括印刷在柔性基板20的顶表面18上的缠绕导电迹线16,柔性基板20例如为聚酯基板,RFID天线22包括印刷在柔性基板20的底表面26上的缠绕导电迹线24。迹线16的相对端部28和30朝向天线14的中心延伸,迹线24的相对端部32和34朝向天线22的中心延伸,并且每个天线都为电子部件(未示出)提供电连接点,例如RFID芯片。在使用导电油墨、例如银油墨印刷迹线16和24之前,在基板20中钻出多个通孔36,使得当印刷迹线16和24时,导电油墨流入通孔36中并穿过基板20,以在天线14和22之间形成电连接。一旦制造了RFID天线14和22,并且将部件附接至迹线16的端部28和30以及迹线24的端部32和34,就将基板20切分以分离RFID器件12。导电迹线16从一个RFID天线14到另一个RFID天线14,导电迹线24同样地从一个RFID天线22到另一个RFID天线22,出于说明目的被示出为具有不同的宽度、匝数和迹线间距,以表明可以同时制造以不同频率工作并针对不同应用的不同RFID器件。
[0013]图3是类似于组件10的另一个RFID器件组件40的顶视图,但包括制造在柔性基板44上的十二个RFID器件42。每个RFID器件42包括具有印刷导电迹线48和通孔50的RFID天线46。每个RFID器件42还包括位于天线46内的印刷图形52,其用于识别器件42。
[0014]图4是用于制造、例如制造组件40的FHE过程的流程图60。在框62处提供柔性基板44,并且在框64处,图形52被印刷在基板44的顶表面和/或底表面上。然后在框66处提供穿过基板44的通孔50。然后在框68处,将天线46印刷在基板44的顶层上,并且在框70处,将天线(未示出)印刷在基板的底层上,使得导电油墨流入通孔50并在基板44的顶表面和底表面上的天线之间形成电连接。然后在框72处测试RFID器件42。
[0015]图5是示出用于提供通孔50的过程的流程图80。在框82处将基板44放置在钻孔机上,并且在框84处通过钻孔机钻出通孔50。在框86处,每隔一定次数的钻孔操作,例如十次,检查机器上的钻头是否损坏和磨损。然后在框88处清洁通孔50的碎屑并进行检查。
[0016]一旦已经测试了RFID器件42,就通过切割或切分基板44将RFID器件彼此分离。然后将RFID芯片90或其他集成电路连接、例如手动连接到天线46的端部92和94,如图6所示。
[0017]前述讨论仅公开并描述了本公开的示例性实施例。本领域技术人员从这样的讨论以及从附图和权利要求书将容易地认识到,在不脱离如所附权利要求书所限定的本公开的精神和范围的情况下,可以在其中做出各种改变、修改和变型。