English:
[0001] This technology includes electronic devices for sensing conditions of a tire on a vehicle.
[0002] Electronic devices can be used to sense conditions of a tire on a vehicle. Such devices include air pressure and temperature sensors that are mounted inside the tire, and also include radio frequency transmitters for transmitting pressure and temperature signals from the tire to the vehicle.
[0003] An electronics assembly is provided for use with a tire. In a given example, the assembly includes a base and a plurality of modules. The base is mechanically attached to the tire and includes an electronic device. A plurality of mechanical attachment elements are arranged on the base in a circular array. Each module includes an electronic device and a mechanical attachment element. Each mechanical attachment element on a module is configured to releasably mechanically attach to any one of the mechanical attachment elements on the base. In this configuration, the modules are interchangeably mechanically attachable to the base in the circular array.
[0004] The base further includes a plurality of electrical terminals arranged in a circular array. Each module has an electrical terminal that is configured to releasably electrically connect with any one of the electrical terminals on the base, whereby the modules are interchangeably electrically connectable with the base in the circular array.
[0006] FIG. 2 is an exploded view of parts of the electronic assembly of FIG. 1.
[0008] FIG. 4 is a schematic sectional view showing the electronics assembly mounted on the tire.
[0009] The structures illustrated in the drawings include examples of the elements recited in the claims. The illustrated structures thus include examples of how a person of ordinary skill in the art can make and use the claimed invention. They are described here to provide enablement and best mode without imposing limitations that are not recited in the claims. One or more elements of one embodiment may be used in combination with, or as a substitute for, one or more elements of another embodiment as needed for any particular implementation of the invention.
[0010] As shown in FIG. 1, a pneumatic tire 10 includes a tread 12, bead portions 14, and sidewalls 16 interconnecting the tread 12 with the bead portions 14. An inner surface 18 of the tire 10 defines the periphery of a cavity 21 within the tire 10. The inner surface 18 in this example is provided by an innerliner 22 that reaches fully throughout the interior of the tread 12, the bead portions 14, and the sidewalls 16.
[0011] Also shown in FIG. 1 is an electronics assembly 30 mounted on the tire 10. The electronics assembly 30 in this example includes a base 32 and multiple modules 34. Each module 34 includes one or more electronic devices 36. The devices 36 in the modules 34 may include air pressure sensors, temperature sensors, power generation or storage devices, radio frequency transmitters, radio frequency receivers, and/or any other electronic devices suitable for obtaining and/or providing information relating to conditions of the tire 10.
[0012] The base 32 also includes one or more electronic devices 40. These may include an electronic device 40 configured to provide a unique identification signal for identifying the tire 10 in distinction from another tire on the same vehicle or a different vehicle. Other electronic devices 40 in the base 32 may be configured to receive and/or transmit signals between the devices 40 in the base, the devices 36 in the modules 34, and the vehicle. In each case, the electronic devices 36 and 40 shown schematically in the drawings can be configured in any suitable manner known in the art.
[0013] The base 32 of the electronics assembly 30 is attached to the tire at the interior of the tire 10. As shown in FIG. 2, the base 32 includes a housing 50 containing the electronic devices 40. Mechanical attachment elements 54 face upward from the housing 50.
[0015] The mechanical attachment elements 54 on the base 32 are arranged in radial alignment with the slots 64. Specifically, the housing has an annular wall 70 that is centered on the axis 55. The annular wall 70 is located at the recess 58 and reaches circumferentially beneath the open inner ends of the slots 64. Each mechanical attachment element 54 is defined by a respective portion of the annular wall 70 beneath the open inner end of a respective slot 64
[0016] The modules 34 of FIG. 1 include housings 100 (FIG. 2) containing the electronic devices 36. The housings also contain printed circuit boards 102 (shown schematically) upon which the electronic devices 36 are mounted. Each housing 100 is shaped as a board that generally corresponds to the shape of the printed circuit board 102 and is sized to fit closely within any one of the slots 64 in the base 32. Each housing 100 further has a notch 106 that is sized and shaped to fit closely over any one of the mechanical attachment elements 54 at the inner ends of the slots 64. In this configuration, the modules 34 are interchangeably mechanically attachable to the base 32 in circumferentially spaced-apart positions projecting radially outward in a circular array.
[0017] As further shown in FIG. 2, each slot 64 in the base 32 contains one or more electrical terminals 120. The electrical terminals 120 on the base 32 are located within the slots 64 at opposite sides of the slots 64. Each module 34 also has one or more electrical terminals 122. These electrical terminals 122, which are shown schematically, may comprise any suitable devices known in the art. The terminals on the modules 34 are located at opposite sides of the housings 100 so that the terminals 122 on each one of the modules 34 can releasably electrically connect with the terminals 120 in any one of the slots 64. Accordingly, the modules 34 are interchangeably electrically connectable with the base 32 in circumferentially spaced- apart positions projecting radially outward in a circular array. A cap 130 interlocks with the base 32 at the top of the assembly 30 to secure the modules 34 in place on the base 32, as shown in FIG. 3
[0018] As noted above, the base 32 is attached to the tire 10 at the interior of the tire 10. As shown in FIG. 4, the base 32 in the given example is mounted on a platform 140. The platform 140 is installed between the innerliner 22 and an attachment layer 142 adhered to innerliner 22. A locking device 144 projects upward from the platform 140 and comprises a twist-lock or other suitable device configured to interlock with the base 32.
[0019] This written description sets for the best mode of carrying out the invention and describes the invention so as to enable a person of ordinary skill in the art to make and use the invention, by presenting examples of the elements recited in the claims. The detailed descriptions of those elements do not impose limitations that are not recited in the claims.

中文:
[0001]本技术包括用于感测车辆上的轮胎的状况的电子设备。
[0002]电子设备可用于感测车辆上的轮胎的状况。此类设备包括安装在轮胎内部的空气压力和温度传感器,并且还包括用于将来自轮胎的压力和温度信号发送至车辆的射频发射器。
[0003]提供了一种与轮胎一起使用的电子组件。在给定示例中,该组件包括基座和多个模块。该基座机械附接至轮胎并且包括电子设备。多个机械附接元件以圆形阵列布置在基座上。每个模块包括电子设备和机械附接元件。模块上的每个机械附接元件被配置为可释放地机械附接至基座上的机械附接元件中的任何一个机械附接元件。在这种配置中,模块能够以圆形阵列可互换地机械附接至基座。
[0004]该基座还包括以圆形阵列布置的多个电气端子。每个模块具有电气端子,该电气端子被配置为与基座上的电气端子中的任何一个电气端子可释放地电连接,由此模块能够以该圆形阵列与基座可互换地电连接。
[0006]图2是图1的电子组件的各部分的分解图。
[0008]图4是示出安装在轮胎上的电子组件的示意性截面图。
[0009]附图中所示的结构包括权利要求书中列举的元件的示例。因此,所示的结构包括本领域的普通技术人员如何制造和使用受权利要求书保护的本发明的示例。在此描述了它们以提供启用和最佳模式,而不会强加权利要求书中未列举的限制。根据本发明的任何特定具体实施的需要,一个实施方案的一个或多个元件可与另一实施方案的一个或多个元件组合使用或替代使用。
[0010]如图1所示,充气轮胎10包括胎面12、胎圈部分14和侧壁16,该侧壁将胎面12与胎圈部分14互连。轮胎10的内表面18限定轮胎10内的腔21的周边。此示例中的内表面18由内衬22提供,该内衬完全到达整个胎面12、胎圈部分14和侧壁16的内部。
[0011]在图1中还示出了安装在轮胎10上的电子组件30。此示例中的电子组件30包括基座32和多个模块34。每个模块34包括一个或多个电子设备36。模块34中的设备36可包括空气压力传感器、温度传感器、发电或存储设备、射频发射器、射频接收器、和/或适合于获得和/或提供与轮胎10的状况有关的信息的任何其它电子设备。
[0012]基座32还包括一个或多个电子设备40。这些电子设备可以包括电子设备40,该电子设备被配置为提供用于识别轮胎10的唯一识别信号以与同一车辆或不同车辆上的另一个轮胎区别开来。基座32中的其它电子设备40可被配置为在基座中的设备40、模块34中的设备36和车辆之间接收和/或发射信号。在每种情况下,在附图中示意性地示出的电子设备36和40可以以本领域中已知的任何合适方式配置。
[0013]电子组件30的基座32在轮胎10的内部处附接至轮胎。如图2所示,基座32包括壳体50,该壳体容纳电子设备40。机械附接元件54从壳体50面向上方。
[0015]基座32上的机械附接元件54被布置成与狭槽64径向对准。具体地,壳体具有环形壁70,该环形壁以该轴线55为中心。环形壁70位于凹部58处并且周向地到达狭槽64的开放内端下方。每个机械附接元件54由环形壁70的在相应狭槽64的开放内端下方的相应部分限定。
[0016]图1的模块34包括壳体100(图2),该壳体容纳电子设备36。壳体还容纳印刷电路板102(示意性地示出),在该印刷电路板上安装有电子设备36。每个壳体100被成形为板,该板通常对应于印刷电路板102的形状并且被定大小为紧密配合在基座32中的狭槽64中的任何一个狭槽内。每个壳体100进一步具有凹口106,该凹口被定大小和成形为在狭槽64的内端处紧密配合在机械附接元件54中的任何一个机械附接元件上方。在这种配置中,模块34能够以圆形阵列中径向向外突出的周向间隔开的位置可互换地机械附接至基座32。
[0017]进一步如图2所示,基座32中的每个狭槽64容纳一个或多个电气端子120。基座32上的电气端子120位于狭槽64内,在狭槽64的相对两侧处。每个模块34还具有一个或多个电气端子122。示意性地示出的这些电气端子122可包括本领域已知的任何合适的设备。模块34上的端子位于壳体100的相对两侧处,使得模块34中的每个模块上的端子122可与狭槽64中的任何一个狭槽中的端子120可释放地电连接。因此,模块34能够以在圆形阵列中径向向外突出的周向间隔开的位置可互换地与基座32电连接。如图3所示,盖130在组件30的顶部处与基座32互锁,以将模块34紧固在基座32上的合适位置。
[0018]如上所述,基座32在轮胎10的内部处附接至轮胎10。如图4所示,基座32在给定示例中安装在平台140上。平台140安装在内衬22与粘附至内衬22的附接层142之间。锁定设备144从平台140向上突出并且包括扭锁或其它合适的设备,该扭锁或其它合适的设备被配置为与基座32互锁。
[0019]该书面描述阐述了实施本发明的最佳模式并且描述了本发明,以便通过提供权利要求书中所列举的元件的示例使本领域的普通技术人员能够制造和使用本发明。这些元件的详细描述不会强加权利要求书中未列举的限制。