Office Action 1: Ex Parte Quayle Action (2024-10-30)

CLAIMS:
What is claimed is:

1\. An electrostatic chuck, comprising:
a ceramic dielectric substrate configured to have a process object placed thereon;
a base plate supporting the ceramic dielectric substrate, the base plate having an upper surface at the ceramic dielectric substrate side and a lower surface opposite to the upper surface, the base plate including a communicating path located between the upper surface and the lower surface, the communicating path having a spiral shape and being configured to allow a coolant to pass;
a first heater element including a plurality of first zones arranged in a radial direction and a circumferential direction, the first heater element including not less than twenty of the first zones; and
a plurality of first power feeding terminals feeding power to the plurality of first zones, each of the plurality of first zones including a first heater line emitting heat by allowing a current to flow, and
a pair of first power feeding portions feeding power to the first heater line, a number of the plurality of first power feeding terminals being not less than a number of the first zones, the pair of first power feeding portions being electrically connected to the plurality of first power feeding terminals, the plurality of first power feeding terminals including a first annular portion including a portion of first power feeding terminals among the plurality of first power feeding terminals, the portion of power feeding terminals included in the first annular portion being disposed on a first virtual circle, a number of the portion of first power feeding terminals included in the first annular portion being at least seven, and
a second annular portion including an other portion of first power feeding terminals among the plurality of first power feeding terminals, the second annular portion being positioned inward of the first annular portion, the other portion of first power feeding terminals included in the second annular portion being disposed on a second virtual circle, a number of the other portion of first power feeding terminals included in the second annular portion being at least seven, the communicating path including a first circumferential portion, the first circumferential portion surrounding the second annular portion between the first annular portion and the second annular portion when viewed along a stacking direction of the base plate and the ceramic dielectric substrate.

2\. The chuck according to claim 1, wherein the plurality of first zones includes a first annular zone region, the first annular zone region includes a portion of first zones among the plurality of first zones, the portion of first zones included in the first annular zone region is arranged in a circumferential direction, the portion of first power feeding terminals included in the first annular portion feeds power to the portion of first zones included in the first annular zone region, and
the number of the portion of first power feeding terminals included in the first annular portion is greater than 2xNlx0.6, where Ni is a number of the portion of first zones included in the first annular zone region.
3\. The chuck according to claim 1, wherein the plurality of first zones includes a first annular zone region, the first annular zone region includes a portion of first zones among the plurality of first zones, the portion of first zones included in the first annular zone region is arranged in the circumferential direction, the portion of first power feeding terminals included in the first annular portion feeds power to the portion of first zones included in the first annular zone region, and
a zone center of the first annular zone region is aligned with at least one of a first center of the first virtual circle or a second center of the second virtual circle.

4\. The chuck according to claim 3, wherein the at least one is the first center of the first virtual circle.

5\. The chuck according to claim 1, wherein the portion of first power feeding terminals included in the first annular portion are uniformly arranged in the circumferential direction.

6\. The chuck according to claim 1, further comprising:
a second heater element including a plurality of second zones arranged in at least the radial direction; and
a plurality of second power feeding terminals feeding power to the plurality of second zones, each of the plurality of second zones including a second heater line emitting heat by allowing a current to flow, and
a pair of second power feeding portions feeding power to the second heater line, a number of the plurality of second power feeding terminals being not less than a number of second zones, the pair of second power feeding portions being electrically connected to the plurality of second power feeding terminals, at least a portion of the plurality of second power feeding terminals overlapping at least one of the first virtual circle or the second virtual circle when viewed along the stacking direction.

7\. The chuck according to claim 6, wherein the number of the plurality of first zones is greater than the number of the plurality of second zones.

OFFICE ACTION:
Notice of Pre-AIA  or AIA  Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
This application is in condition for allowance except for the following formal matters:
Claim Objections
1.	Claim 1 is objected to because of the following informalities:
Claim 1, line 17, the term “each of the plurality of first zones” changes to “wherein each of the plurality of first zones”. Line 26, the term “the plurality of first power feeding terminals” changes to “wherein the plurality of first power feeding terminals”. Line 41, the term “the communicating path” changes to “wherein the communicating path”.
Appropriate correction is required.
Allowable Subject Matter
2.	Claims 1-7 are allowed over prior art of record.
The following is an examiner's statement of reasons for allowance:
The prior art of record neither anticipates nor renders obvious the claimed subject matter of the instant application as a whole either taken alone or in combination, in particular, prior art of record does not teach:
An electrostatic chuck, comprising:  the plurality of first power feeding terminals including a first annular portion including a portion of first power feeding terminals among the plurality of first power feeding terminals, the portion of power feeding terminals included in the first annular portion being disposed on a first virtual circle, a number of the portion of first power feeding terminals included in the first annular portion being at least seven, and a second annular portion including an other portion of first power feeding terminals among the plurality of first power feeding terminals, the second annular portion being positioned inward of the first annular portion, the other portion of first power feeding terminals included in the second annular portion being disposed on a second virtual circle, a number of the other portion of first power feeding terminals included in the second annular portion being at least seven, the communicating path including a first circumferential portion, the first circumferential portion surrounding the second annular portion between the first annular portion and the second annular portion when viewed along a stacking direction of the base plate and the ceramic dielectric substrate as recited in claim 1.
Claims 2-7 are also allowed as being directly or indirectly dependent of the allowed independent base claim.
Parkhe et al (USPN 2015/0340255) discloses an electrostatic chuck (200, see figure 2) , comprising: a ceramic dielectric substrate (202) configured to have a process object (110) placed thereon; a base plate supporting the ceramic dielectric substrate, the base plate (201) having an upper surface at the ceramic dielectric substrate side and a lower surface opposite to the upper surface, the base plate including a communicating path (205) located between the upper surface and the lower surface, the communicating path having a spiral shape (see figure 4) and being configured to allow a coolant to pass. However, Parkhe . does not disclose the aforementioned claimed limitations of claim 1.
Miwa (USPN 11,950,329) discloses an electrostatic chuck (see figure 2), comprising: a ceramic dielectric substrate (10) configured to have a process object (W) placed thereon; a base plate (20)  supporting the ceramic dielectric substrate, the base plate having an upper surface at the ceramic dielectric substrate side and a lower surface opposite to the upper surface, the base plate including a communicating path 21) located between the upper surface and the lower surface, configured to allow a coolant to pass;
a first heater element (50)including a plurality of first zones (such as SEb, see figure 3) arranged in a radial direction and a circumferential direction, the first heater element including not less than twenty of the first zones; and
a plurality of first power feeding terminals (72, see figure 4) feeding power to the plurality of first zones,
each of the plurality of first zones including
a first heater line (500)  emitting heat by allowing a current to flow, and
a pair of first power feeding portions (53) feeding power to the first heater line (500),
a number of the plurality of first power feeding terminals (72)  being not less than a number of the first zones (Seb) (see figure 4). However, Miwa does not disclose the aforementioned claimed limitations of claim 1.
Therefore, prior art of record neither anticipates not render obvious of the instant application claimed invention either taken alone or in combination.
Conclusion
3.	Prosecution on the merits is closed in accordance with the practice under Ex parte Quayle, 25 USPQ 74, 453 O.G. 213, (Comm’r Pat. 1935).
A shortened statutory period for reply to this action is set to expire TWO (2) MONTHS from the mailing date of this letter. Extensions of time may be granted under  37 CFR 1.136 but in no case can any extension carry the date for reply to this Office action beyond the maximum period of SIX MONTHS set by statute (35 U.S.C. 133).
4.

APPLICANT REBUTTAL: REMARKS
Claims 1-7 are pending in the current application. Claim 1 is objected to for informalities. Applicant thankfully acknowledges the Examiner's indication that claims 1-7 are allowed; and that this application is in condition for allowance except for formal matters related to claim objections. Reconsideration is respectfully requested in view of the remarks and amendments submitted herewith.
Amendments to the Claims
Claim 1 has amended as shown herein.
Independent claim 1 has been amended to recite
"wherein
each of the plurality of first zones" instead of "each of the plurality of first zones" at line 13 thereof; to recite
"wherein
the plurality of first power feeding terminals" instead of "the plurality of first power feeding terminals" at line 20 thereof; and to recite
"wherein
the communicating path" instead of "the communicating path" at line 32 thereof.
Support for these amendments may be found in the specification, figures and claims as originally filed. No subject matter has been disclaimed or abandoned and the amendment of certain claims is not to be construed as a dedication to the public of any of the subject matter of the claims as previously presented. Applicant respectfully submits that no new matter has been entered through these amendments and entry is respectfully requested.
Claim Ob
j
ections
As noted hereinabove, the Examiner objected to claim 1 for informalities. The objections are respectfully traversed.
Specifically, the Examiner takes the position that in claim 1, line 17 (as originally filed) the term "each of the plurality of first zones" changes to "wherein each of the plurality of first zones"; in line 26 thereof (as originally filed), the term "the plurality of first power feeding terminals" changes to "wherein the plurality of first power feeding terminals"; and in line 41 thereof (as originally filed), the term "the communicating path" changes to "wherein the
communicating path".
In this amendment, as suggested by the Examiner, claim 1 has been amended to recite
"wherein
each of the plurality of first zones" instead of "each of the plurality of first zones" at line 13 thereof; to recite
"wherein
the plurality of first power feeding terminals" instead of "the plurality of first power feeding terminals" at line 20 thereof; and to recite
"wherein
the communicating path" instead of "the communicating path" at line 32 thereof.
In view of the foregoing, Applicant respectfully submits that claim 1 can no longer be objected to for informalities. Withdrawal of the objections and a timely notice of allowance are respectfully requested.
Allowable Sub
j
ect Matter
As noted above, the Examiner indicated that claims 1-7 are allowed over prior art of record; and that this application is in condition for allowance except for formal matters.
Applicant thankfully acknowledges the Examiner's indication that claims 1-7 are allowed; and that this application is in condition for allowance. As discussed above, in this response, the formal matters have been addressed. Accordingly, a timely notice of allowance is respectfully requested.
Conclusion

NEXT OFFICE ACTION: Notice of Pre-AIA  or AIA  Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Allowable Subject Matter
Claims 1-7 are allowed over prior art of record.
The following is an examiner's statement of reasons for allowance:
The prior art of record neither anticipates nor renders obvious the claimed subject matter of the instant application as a whole either taken alone or in combination, in particular, prior art of record does not teach:
An electrostatic chuck, comprising: the plurality of first power feeding terminals including a first annular portion including a portion of first power feeding terminals among the plurality of first power feeding terminals, the portion of power feeding terminals included in the first annular portion being disposed on a first virtual circle, a number of the portion of first power feeding terminals included in the first annular portion being at least seven, and a second annular portion including an other portion of first power feeding terminals among the plurality of first power feeding terminals, the second annular portion being positioned inward of the first annular portion, the other portion of first power feeding terminals included in the second annular portion being disposed on a second virtual circle, a number of the other portion of first power feeding terminals included in the second annular portion being at least seven, wherein the communicating path including a first circumferential portion, the first circumferential portion surrounding the second annular portion between the first annular portion and the second annular portion when viewed along a stacking
direction of the base plate and the ceramic dielectric substrate as recited in claim 1.

CITED REFERENCE SUMMARIES: Ref US11950329B2: Claims:
A holding device comprising: a plate-shaped member having an approximately flat first surface approximately orthogonal to a first direction and a second surface opposite to the first surface; a base member having a third surface and a fourth surface opposite to the third surface, the base member being disposed such that the third surface faces the second surface of the plate-shaped member, the base member having a plurality of first through holes extending from the third surface to the fourth surface; a plurality of heating elements disposed in the plate-shaped member; a plurality of electricity supply terminals electrically connected to the respective heating elements; a bonding portion disposed between the second surface of the plate-shaped member and the third surface of the base member to bond the plate-shaped member and the base member together, the bonding portion having a plurality of second through holes which communicate with the respective first through holes of the base member and form, in cooperation with the first through holes, terminal holes for receiving the electricity supply terminals; and insulating members received in the respective terminal holes, the holding device holding an object on the first surface of the plate-shaped member, wherein the plurality of electricity supply terminals include N individual electricity supply terminals (N is an integer of 2 or more) electrically connected to respective N heating elements of the plurality of heating elements, and a common electricity supply terminal electrically connected to all the N heating elements; the N individual electricity supply terminals are received in a first one of the terminal holes and are insulated from one another by one of the insulating members, the first one of the terminal holes not receiving the common electricity supply terminal; and the common electricity supply terminal is received in a second one of the terminal holes, the second one of the terminal holes not receiving the individual electricity supply terminals.
a plate-shaped member having an approximately flat first surface approximately orthogonal to a first direction and a second surface opposite to the first surface;
a base member having a third surface and a fourth surface opposite to the third surface, the base member being disposed such that the third surface faces the second surface of the plate-shaped member, the base member having a plurality of first through holes extending from the third surface to the fourth surface;
a plurality of heating elements disposed in the plate-shaped member;
a plurality of electricity supply terminals electrically connected to the respective heating elements;
a bonding portion disposed between the second surface of the plate-shaped member and the third surface of the base member to bond the plate-shaped member and the base member together, the bonding portion having a plurality of second through holes which communicate with the respective first through holes of the base member and form, in cooperation with the first through holes, terminal holes for receiving the electricity supply terminals; and
insulating members received in the respective terminal holes,
the holding device holding an object on the first surface of the plate-shaped member, wherein
the plurality of electricity supply terminals include N individual electricity supply terminals (N is an integer of 2 or more) electrically connected to respective N heating elements of the plurality of heating elements, and a common electricity supply terminal electrically connected to all the N heating elements;
the N individual electricity supply terminals are received in a first one of the terminal holes and are insulated from one another by one of the insulating members, the first one of the terminal holes not receiving the common electricity supply terminal; and
the common electricity supply terminal is received in a second one of the terminal holes, the second one of the terminal holes not receiving the individual electricity supply terminals.
A holding device according to claim 1 , wherein at least part of the plate-shaped member is virtually divided into a plurality of segments arranged in directions orthogonal to the first direction; the plurality of heating elements are disposed in the respective segments; and N segments of the plurality of segments in which the respective N heating elements are disposed form one continuous upper level segment.
A holding device according to claim 2 , wherein, when the holding device is viewed in the first direction, the area of each segment in a first portion of the plate-shaped member is smaller than the area of each segment in a second portion of the plate-shaped member which is closer to the center of the plate-shaped member than the first portion.
A holding device according to claim 2 , wherein the segments included in the one upper level segment have respective surfaces included in the first surface; a first heating element of the plurality heating elements is disposed in a first one of the segments included in the one upper level segment; a second heating element of the plurality heating elements is disposed in a second one of the segments included in the one upper level segment; and the amount of heat generated by the first heating element per unit area of the surface of the first one of the segments is approximately the same as the amount of heat generated by the second heating element per unit area of the surface of the second one of the segments.
A holding device according to claim 4 , wherein, in the one upper level segment including the N segments having the respective surfaces included in the first surface, the amounts of heat generated by the heating elements disposed in the respective N segments per unit area of the respective surfaces of the N segments are approximately the same.
A holding device according to claim 1 , further comprising a power source which can be switched between a first state in which individually set voltages are applied to the respective N individual electricity supply terminals and a second state in which the same voltage is applied to the N individual electricity supply terminals.
A holding device according to claim 1 , wherein the plurality of electricity supply terminals include a plurality of the common electricity supply terminals received in the second one of the terminal holes.
wherein the plurality of electricity supply terminals include a plurality of the common electricity supply terminals received in the second one of the terminal holes.
A holding device according to claim 7 , wherein the plurality of electricity supply terminals include the common electricity supply terminals which are received in the second one of the terminal holes and the number of which is N.
Ref US20150340255A1: Claims:
An apparatus comprising: a puck to carry a substrate for fabrication processes; and a cooling plate fastened to and thermally coupled to the ceramic puck, the cooling plate having a plurality of different independent cooling channels to carry a heat transfer fluid to transfer heat from the cooling plate.
a puck to carry a substrate for fabrication processes; and
a cooling plate fastened to and thermally coupled to the ceramic puck, the cooling plate having a plurality of different independent cooling channels to carry a heat transfer fluid to transfer heat from the cooling plate.
The apparatus of claim 1 , wherein each cooling channel comprises a respective input and output port that is configured to be coupled to a different heat transfer fluid loop.
The apparatus of claim 1 , further comprising a base plate fastened to the cooling plate opposite the puck, and wherein the cooling channels are open to the base plate, the apparatus further comprising a plurality of seals to seal the cooling channels against the base plate.
The apparatus of claim 3 , wherein the base plate has a lower thermal conductivity than the cooling plate.
The apparatus of claim 1 , wherein the cooling plate comprises a discrete portion for each independent cooling channel and wherein each portion is physically isolated from each other portion.
The apparatus of claim 5 , wherein the cooling plate further comprises an air gap between each cooling plate portion to thermally isolate each cooling plate portion from each other cooling plate portion.
The apparatus of claim 5 , wherein the cooling plate further comprises an isolating gasket between the cooling plate portions.
The apparatus of claim 5 , wherein each cooling plate portion is annular with a common center.
The apparatus of claim 6 , further comprising a base plate fastened to the cooling plate opposite the puck, and wherein each cooling plate portion is independently fastened to the base plate.
The apparatus of claim 9 , wherein the cooling plate portions are attached to the base plate to form concentric rings.
The apparatus of claim 9 , wherein the cooling plate has higher thermal conductivity than the base plate.
The apparatus of claim 9 , wherein the base plate is formed of titanium.
The apparatus of claim 1 , wherein the puck is dielectric, the puck further comprising electrodes to electrostatically grip the substrate during the fabrication processes.
A semiconductor processing system comprising: a vacuum chamber; a wafer chuck within the vacuum chamber, the wafer chuck having a top puck to carry a semiconductor wafer, a cooling plate fastened to the top puck, the cooling plate having a plurality of independent cooling channels to carry a heat transfer fluid to transfer heat from the semiconductor wafer that is carried by the top puck, and a base plate fastened to the cooling plate opposite the puck; and a plurality of heat exchangers each coupled to a respective independent cooling channel to receive the thermal fluid from an output of the respective cooling channel, to cool the thermal fluid, and to supply the thermal fluid to an inlet of the respective cooling channel.
a vacuum chamber;
a wafer chuck within the vacuum chamber, the wafer chuck having a top puck to carry a semiconductor wafer, a cooling plate fastened to the top puck, the cooling plate having a plurality of independent cooling channels to carry a heat transfer fluid to transfer heat from the semiconductor wafer that is carried by the top puck, and a base plate fastened to the cooling plate opposite the puck; and
a plurality of heat exchangers each coupled to a respective independent cooling channel to receive the thermal fluid from an output of the respective cooling channel, to cool the thermal fluid, and to supply the thermal fluid to an inlet of the respective cooling channel.
The system of claim 14 , further comprising a temperature controller to control the heat exchangers to control the temperature set point used by each heat exchanger.
The system of claim 14 , wherein the cooling plate has three concentric portions, each with a different coolant channel, each portion being independently fastened to the base plate so that the portions are isolated from each other by an air gap.
A method for controlling the temperature of an electrostatic chuck, the method comprising: heating a dielectric puck using a plurality of heater traces, the dielectric puck being for electrostatically gripping a silicon wafer; cooling the dielectric puck using a plurality of coolant chambers of the electrostatic chuck, the dielectric puck being thermally coupled to the plurality of coolant chambers; and adjusting the flow of coolant in the coolant chambers of the electrostatic chuck.
heating a dielectric puck using a plurality of heater traces, the dielectric puck being for electrostatically gripping a silicon wafer;
cooling the dielectric puck using a plurality of coolant chambers of the electrostatic chuck, the dielectric puck being thermally coupled to the plurality of coolant chambers; and
adjusting the flow of coolant in the coolant chambers of the electrostatic chuck.
The method of claim 17 , further comprising detecting temperature in the electrostatic chuck using embedded temperature sensors and adjusting the flow of coolant based on the detected temperature.
The method of claim 18 , wherein detecting heat comprises determining a temperature level at different areas of the dielectric puck, the different areas corresponding to different coolant chambers.
The method of claim 17 , wherein the plurality of coolant chambers are concentric and wherein cooling comprises individually adjusting the temperature of each chamber to obtain a desired inner and outer temperature of the electrostatic chuck.
Ref US20150340255: Claims:
What is claimed is: 1. An apparatus comprising: a puck to carry a substrate for fabrication processes; and a cooling plate fastened to and thermally coupled to the ceramic puck, the cooling plate having a plurality of different independent cooling channels to carry a heat transfer fluid to transfer heat from the cooling plate. 2. The apparatus of claim 1, wherein each cooling channel comprises a respective input and output port that is configured to be coupled to a different heat transfer fluid loop. 3. The apparatus of claim 1, further comprising a base plate fastened to the cooling plate opposite the puck, and wherein the cooling channels are open to the base plate, the apparatus further comprising a plurality of seals to seal the cooling channels against the base plate. 4. The apparatus of claim 3, wherein the base plate has a lower thermal conductivity than the cooling plate. 5. The apparatus of claim 1, wherein the cooling plate comprises a discrete portion for each independent cooling channel and wherein each portion is physically isolated from each other portion. 6. The apparatus of claim 5, wherein the cooling plate further comprises an air gap between each cooling plate portion to thermally isolate each cooling plate portion from each other cooling plate portion. 7. The apparatus of claim 5, wherein the cooling plate further comprises an isolating gasket between the cooling plate portions. 8. The apparatus of claim 5, wherein each cooling plate portion is annular with a common center. 9. The apparatus of claim 6, further comprising a base plate fastened to the cooling plate opposite the puck, and wherein each cooling plate portion is independently fastened to the base plate. 10. The apparatus of claim 9, wherein the cooling plate portions are attached to the base plate to form concentric rings. 11. The apparatus of claim 9, wherein the cooling plate has higher thermal conductivity than the base plate. 12. The apparatus of claim 9, wherein the base plate is formed of titanium. 13. The apparatus of claim 1, wherein the puck is dielectric, the puck further comprising electrodes to electrostatically grip the substrate during the fabrication processes. 14. A semiconductor processing system comprising: a vacuum chamber; a wafer chuck within the vacuum chamber, the wafer chuck having a top puck to carry a semiconductor wafer, a cooling plate fastened to the top puck, the cooling plate having a plurality of independent cooling channels to carry a heat transfer fluid to transfer heat from the semiconductor wafer that is carried by the top puck, and a base plate fastened to the cooling plate opposite the puck; and a plurality of heat exchangers each coupled to a respective independent cooling channel to receive the thermal fluid from an output of the respective cooling channel, to cool the thermal fluid, and to supply the thermal fluid to an inlet of the respective cooling channel. 15. The system of claim 14, further comprising a temperature controller to control the heat exchangers to control the temperature set point used by each heat exchanger. 16. The system of claim 14, wherein the cooling plate has three concentric portions, each with a different coolant channel, each portion being independently fastened to the base plate so that the portions are isolated from each other by an air gap. 17. A method for controlling the temperature of an electrostatic chuck, the method comprising: heating a dielectric puck using a plurality of heater traces, the dielectric puck being for electrostatically gripping a silicon wafer; cooling the dielectric puck using a plurality of coolant chambers of the electrostatic chuck, the dielectric puck being thermally coupled to the plurality of coolant chambers; and adjusting the flow of coolant in the coolant chambers of the electrostatic chuck. 18. The method of claim 17, further comprising detecting temperature in the electrostatic chuck using embedded temperature sensors and adjusting the flow of coolant based on the detected temperature. 19. The method of claim 18, wherein detecting heat comprises determining a temperature level at different areas of the dielectric puck, the different areas corresponding to different coolant chambers. 20. The method of claim 17, wherein the plurality of coolant chambers are concentric and wherein cooling comprises individually adjusting the temperature of each chamber to obtain a desired inner and outer temperature of the electrostatic chuck.
An apparatus comprising: a puck to carry a substrate for fabrication processes; and a cooling plate fastened to and thermally coupled to the ceramic puck, the cooling plate having a plurality of different independent cooling channels to carry a heat transfer fluid to transfer heat from the cooling plate.
The apparatus of claim 1, wherein each cooling channel comprises a respective input and output port that is configured to be coupled to a different heat transfer fluid loop.
The apparatus of claim 1, further comprising a base plate fastened to the cooling plate opposite the puck, and wherein the cooling channels are open to the base plate, the apparatus further comprising a plurality of seals to seal the cooling channels against the base plate.
The apparatus of claim 3, wherein the base plate has a lower thermal conductivity than the cooling plate.
The apparatus of claim 1, wherein the cooling plate comprises a discrete portion for each independent cooling channel and wherein each portion is physically isolated from each other portion.
The apparatus of claim 5, wherein the cooling plate further comprises an air gap between each cooling plate portion to thermally isolate each cooling plate portion from each other cooling plate portion.
The apparatus of claim 5, wherein the cooling plate further comprises an isolating gasket between the cooling plate portions.
The apparatus of claim 5, wherein each cooling plate portion is annular with a common center.
The apparatus of claim 6, further comprising a base plate fastened to the cooling plate opposite the puck, and wherein each cooling plate portion is independently fastened to the base plate.
The apparatus of claim 9, wherein the cooling plate portions are attached to the base plate to form concentric rings.
The apparatus of claim 9, wherein the cooling plate has higher thermal conductivity than the base plate.
The apparatus of claim 9, wherein the base plate is formed of titanium.
The apparatus of claim 1, wherein the puck is dielectric, the puck further comprising electrodes to electrostatically grip the substrate during the fabrication processes.
A semiconductor processing system comprising: a vacuum chamber; a wafer chuck within the vacuum chamber, the wafer chuck having a top puck to carry a semiconductor wafer, a cooling plate fastened to the top puck, the cooling plate having a plurality of independent cooling channels to carry a heat transfer fluid to transfer heat from the semiconductor wafer that is carried by the top puck, and a base plate fastened to the cooling plate opposite the puck; and a plurality of heat exchangers each coupled to a respective independent cooling channel to receive the thermal fluid from an output of the respective cooling channel, to cool the thermal fluid, and to supply the thermal fluid to a
[Truncated to input limit]