Office Action 1: Notice of Allowance (2025-03-03)

CLAIMS:
WHAT IS CLAIMED IS:

1\. A method of fabricating an integrated circuit (IC), the method comprising:
processing a lead semiconductor wafer in a process flow having a sequence of process steps including a targeted process step, wherein the targeted process step adds to or subtracts from a material layer over the lead semiconductor wafer, the targeted process step performed using a semiconductor fabrication tool;
capturing information relating to a user interaction at a computer platform integrated with the semiconductor fabrication tool, the user interaction involving selecting by an operator one or more menu options relative to operation of the semiconductor fabrication tool;
interrogating an event database based on at least a portion of the captured information relating to the user interaction;
responsive to determining that the at least a portion of the captured information matches a predetermined event condition defined in the event database, generating a notification to a server executing an action plan trigger module;
generating an action plan trigger by the action plan trigger module to actuate an out-of-control action plan (OCAP) module configured to determine a disposition action responsive to the action plan trigger;
adjusting one or more process parameters of the targeted process step in response to the disposition action; and
processing a subsequent semiconductor wafer containing the IC at an intermediate stage of formation.

2\. The method as recited in claim 1, wherein the process flow includes attaching packaged integrated circuits to a tape carrier.

3\. The method as recited in claim 1, wherein the process flow includes plasma etching the material layer.

4\. The method as recited in claim 1, wherein the process flow includes exposing a photoresist layer to optical radiation.

5\. The method as recited in claim 1, wherein the process flow includes chemical mechanical polishing.

6\. The method as recited in claim 1, wherein the information relating to the user interaction is captured by a script-based capture engine executing in a runtime environment executed on the computer platform of the semiconductor fabrication tool.

7\. The method as recited in claim 6, wherein the semiconductor fabrication tool communicates using a protocol other than a SEMI (Semiconductor Equipment and Materials International) Equipment Communications Standard (SECS)/Generic Equipment Model (GEM) communication protocol.

8\. The method as recited in claim 6, wherein the script-based capture engine is configured based on a scripting language comprising one of JavaScript, Python, Perl, Ruby, Lua, and Bash.

9\. The method as recited in claim 6, wherein the user interaction comprises interacting with the one or more menu options using at least one of a keyboard, a pointing device, a touchscreen, an audio input device, and a haptic interface.

10\. A method of fabricating articles of manufacture, the method comprising:
processing a lead article in a process flow having a sequence of process steps including a targeted process step performed by a manufacturing tool;
capturing information relating to a user interaction at a computer platform integrated with the manufacturing tool, the user interaction involving selecting by an operator one or more menu options relative to operation of the manufacturing tool;
interrogating an event database based on at least a portion of the captured information relating to the user interaction;
responsive to determining that the at least a portion of the captured information matches a predetermined event condition defined in the event database, generating an action plan trigger to actuate an out-of-control action plan (OCAP) module configured to determine a disposition action responsive to the action plan trigger;
adjusting one or more process parameters of the targeted process step in response to the disposition action; and
processing a subsequent article by the manufacturing tool after the adjusting.

11\. An apparatus, comprising:
a manufacturing tool configured to process an article at a targeted process step of a process flow having a sequence of process steps; and
a computer platform integrated with the manufacturing tool, the computer platform including a processor, a tool application software module and a script-based capture engine configured to perform;
capturing information relating to a user interaction at the computer platform, the user interaction involving selecting by an operator one or more menu options relative to operation of the manufacturing tool;
interrogating an event database based on at least a portion of the captured information relating to the user interaction; and
responsive to determining that the at least a portion of the captured information matches a predetermined event condition defined in the event database, generating a notification to a server executing an action plan trigger module, wherein the action plan trigger module is operable to generate an action plan trigger for actuating an out-of- control action plan (OCAP) module configured to determine a disposition action responsive to the action plan trigger.

12\. The apparatus as recited in claim 11, wherein the manufacturing tool comprises a tape-and-reel processing equipment, the targeted process step comprising a tape-and-reel assembly process, and the article comprising a carrier tape product containing a plurality of packaged semiconductor dies.

13\. The apparatus as recited in claim 11, wherein the script-based capture engine is configured to be executed in a runtime environment for capturing the information relating to the user interaction with the manufacturing tool.

14\. The apparatus as recited in claim 11, wherein the manufacturing tool is configured to communicate with a networked host using protocol other than a SEMI (Semiconductor Equipment and Materials International) Equipment Communications Standard (SECS)/Generic Equipment Model (GEM) communication protocol.

15\. The apparatus as recited in claim 11, wherein the script-based capture engine is configured based on a scripting language comprising one of JavaScript, Python, Perl, Ruby, Lua, and Bash.

16\. The apparatus as recited in claim 11, wherein the user interaction comprises interacting with the one or more menu options using at least one of a keyboard, a pointing device, a touchscreen, an audio input device, and a haptic interface associated with the computer platform.

17\. A method of fabricating an integrated circuit (IC), the method comprising:
providing a plurality of integrated circuits to a tape-and-reel tool configured to perform a taping operation, each integrated circuit packaged in a corresponding one of a plurality of integrated circuit packages, the plurality of integrated circuit packages including a first integrated circuit package;
capturing information relating to a user interaction at a computer platform integrated with the tape-and-reel tool, the user interaction involving selecting by an operator one or more menu options relative to operation of the tape-and-reel tool with respect to the first integrated circuit package;
interrogating an event database based on at least a portion of the captured information relating to the user interaction;
responsive to determining that the at least a portion of the captured information matches a predetermined event condition defined in the event database, generating a notification to a server executing an action plan trigger module;
generating an action plan trigger by the action plan trigger module to actuate an out-of-control action plan (OCAP) module configured to determine a disposition action responsive to the action plan trigger;
implementing the disposition action including modifying one or more parameters of the taping operation; and
processing a subsequent integrated circuit package including an instance of the integrated circuit using the taping operation after the modifying.

18\. The method as recited in claim 17, wherein the tape-and-reel tool is configured to communicate with a networked host using a protocol other than a SEMI (Semiconductor Equipment and Materials International) Equipment Communications Standard (SECS)/Generic Equipment Model (GEM) communication protocol.

19\. The method as recited in claim 17, wherein the information relating to the user interaction is captured by a script-based capture engine executing in a runtime environment executed on the computer platform of the tape-and-reel tool.

20\. The method as recited in claim 19, wherein the script-based capture engine is configured based on a scripting language comprising one of JavaScript, Python, Perl, Ruby, Lua, and Bash.

21\. The method as recited in claim 17, wherein the user interaction comprises interacting with the one or more menu options using at least one of a keyboard, a pointing device, a touchscreen, an audio input device, and a haptic interface. 26 27 28 29 30 31 32

OFFICE ACTION:
Notice of Pre-AIA  or AIA  Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
1.	Claims 1-21 are presented for examination.
Allowable Subject Matter
2. 	Claims 1-21 are allowed.
The following is an examiner’s statement of reasons for allowance:
The allowability of the independent claims 1, 10-11 and 17 resides, at least in part, in that closest prior art of Pokorny et al. (US20030150908A1) discloses user interface for reporting event-based production information in product manufacturing. The display device for processing data stored in a database. The data include automatically collected event-based production information records in a manufacturing system wherein each record represents an event and includes a timestamp, an event code, and a measure of cost or production loss associated with the event. The operable in an intelligent manufacturing system including a process for converting raw materials to a product, a process control system including one or more sensors capable of generating an alarm in response to an event that results in one of waste, machine delay, or decrease product quality, a data logger associated with the process control system for obtaining event parameters associated with the event, a database on a server for recording event parameters obtained by the data logger, and a reporting system cooperatively associated with the database for reporting productivity parameters regarding the process derived at least in part from the event, for example, abstract,; Par. [0011]-[0016], Fig. Fig. 3, Fig. 7, Fig. 10A; however, the prior art does not disclose or suggest, alone or in combination, i an event database based on at least a portion of the captured information relating to the user interaction; responsive to determining that the at least a portion of the captured information matches a predetermined event condition defined in the event database, generating a notification to a server executing an action plan trigger module; an action plan trigger by the action plan trigger module to actuate an out-of-control action plan (OCAP) module configured to determine a disposition action responsive to the action plan trigger; adjusting one or more process parameters of the targeted process step in response to the disposition action; and processing a subsequent semiconductor wafer containing the IC at an intermediate stage of formation; in combination with the other elements and features of the claimed invention.
As claims 2-9, 12-16 and 18-21 are directly or indirectly dependent on claims 1, 10-11, and 17 those claims are also allowable at least by virtue of their dependency.
Citation Pertinent prior art
3.	 The prior art made of record and not relied upon is considered pertinent to applicant's disclosure.
Beffa et al. (US6208947B1) discloses manufacturing IC devices from semiconductor wafers includes providing the wafers and fabricating IC's on the wafers. At probe, a unique fuse ID is stored in each IC, and an electronic wafer map is electronically stored for each wafer indicating the locations of good and bad IC's on the wafer and the fuse ID's of the IC's on the wafer.
Kataria (US 2007/0185759 A1) disclose a system and method for managing the development and manufacturing process of a beverage is disclosed. The method comprises capturing and recording the development and manufacturing history of the beverage in order to generate a product history. The product history is stored on a computer and is searchable in multiple data dimensions in order to easily retrieve information. The system automatically provides compliance management procedures in order to comply with regulatory standards for the beverage industry.
Logsdon (US 6957114 B1) discloses Graphical user interface for compliance monitoring in semiconductor wafer fabrication and method of operation.
Elliot et al. (US20170116259A1) discloses captured via the data analyst's queries and user interaction with the user interfaces provided by the data analysis system. Data analysis paths may involve exploration of high-volume data sets, such as Internet proxy data, which may include trillions of rows of data.
Yousaf et al. (US20200118311A1) relate to a data analysis system that may receive data comprising a plurality of raw data items from one or more data sources, such as a monitoring agent located in a monitored network. The received data may be scored using one or more scoring rules and/or algorithms, with raw data items satisfying a score threshold designated as “data item leads”.
Conclusion
4.



CITED REFERENCE SUMMARIES: Ref US6208947B1: Claims:
A manufacturing process for redirecting one or more integrated circuit devices that have been identified as having undergone a process flow within the manufacturing process different from the process flow of their stored data, each integrated circuit device having a substantially unique identification code, the process comprising:
storing data and the identification code of said each integrated circuit device of the one or more integrated circuit devices, said data indicating a process flow within the manufacturing process for each integrated circuit device of the integrated circuit devices;
reading the identification code of each integrated circuit device of the integrated circuit devices;
accessing the data stored and the identification code of said each integrated circuit device of the one or more integrated circuit devices;
evaluating the data accessed for said each integrated circuit device of the one or more integrated circuit devices;
identifying integrated circuit devices having undergone a process flow within the manufacturing process different from the process flow of their stored data; and
redirecting said each integrated circuit device of the one or more integrated circuit devices identified as having undergone a process flow within the manufacturing process different from the process flow of their stored data.
The process of claim 1 , wherein storing data comprises storing the identification code of said each of the integrated circuit devices of the one or more integrated circuit devices and a die location on an electronically stored wafer map.
The process of claim 1 , wherein said storing data comprises storing data at a probe.
The process of claim 1 , wherein said storing data comprises storing data and the identification code of said each integrated circuit device of the one or more integrated circuit devices to indicate said each integrated circuit device of the one or more integrated circuit devices is one of a good integrated circuit device usable for assembly and back-end testing and a bad integrated circuit device suitable for being discarded.
The process of claim 1 , wherein said reading the identification code of said each integrated circuit device of the one or more integrated circuit devices comprises electrically retrieving a unique fuse identification programmed into said each integrated circuit device of the one or more integrated circuit devices.
The process of claim 1 , wherein said reading the identification code of said each integrated circuit device of the one or more integrated circuit devices comprises optically reading a unique identification code provided on said each integrated circuit device of the one or more integrated circuit devices.
The process of claim 6 , wherein said optically reading the unique identification code provided on said each integrated circuit device of the one or more integrated circuit devices comprises optically reading a unique laser fuse identification programmed into said each integrated circuit device of the one or more integrated circuit devices.
The process of claim 1 , wherein said reading the identification code of said each integrated circuit device of the one or more integrated circuit devices comprises reading the identification code of said each integrated circuit device of the one or more integrated circuit devices at an opens/shorts test in the manufacturing process.
The process of claim 1 , wherein said accessing the data stored and the identification code of said each integrated circuit device of the one or more integrated circuit devices comprises accessing the data stored and the identification code of said each integrated circuit device of the one or more integrated circuit devices at an opens/shorts test in the manufacturing process.
The process of claim 1 , wherein said evaluating the data comprises evaluating the data accessed for said each integrated circuit device of the one or more integrated circuit devices to identify any bad integrated circuit devices having undergone an assembly procedure within the manufacturing process.
The process of claim 1 , wherein said evaluating the data comprises evaluating the data at an opens/shorts test in the manufacturing process.
The process of claim 1 , wherein said redirecting any integrated circuit device identified as having been mis-processed comprises discarding any integrated circuit device identified as having been mis-processed.
The process of claim 1 , wherein said redirecting occurs before a back-end test procedure within the integrated circuit device manufacturing process.
The process of claim 1 , further comprising assembling the integrated circuit devices into packaged integrated circuit devices after storing data and before reading the identification code of said each of the integrated circuit devices of the one or more integrated circuit devices.
A method of manufacturing integrated circuit devices from semiconductor wafers, the method comprising:
providing a plurality of semiconductor wafers;
fabricating a plurality of integrated circuit devices on each wafer of the plurality of semiconductor wafers;
causing each integrated circuit device of the plurality of integrated circuit devices on said each wafer of the plurality of semiconductor wafers to store a substantially unique identification code;
storing data and the identification code of said each integrated circuit device of the plurality of integrated circuit devices indicating a manufacturing process flow for said each integrated circuit device of the plurality of integrated circuit devices;
separating each integrated circuit device of the integrated circuit devices on each wafer of the plurality of semiconductor wafers to form an integrated circuit device of a plurality of integrated circuit devices;
assembling said each integrated circuit device of the plurality of integrated circuit devices into an integrated circuit device assembly;
reading the identification code of said each integrated circuit device of the integrated circuit device assemblies;
accessing the data stored and the identification code associated with said each integrated circuit device of the integrated circuit device assemblies;
evaluating the data accessed for said each integrated circuit device of the integrated circuit device assemblies identifying any integrated circuit devices having undergone a manufacturing process flow different from the indicated manufacturing process flow of their stored data;
subjecting to further processing an integrated circuit device identified as having undergone a manufacturing process flow different from the indicated manufacturing process flow of its stored data; and
back-end testing integrated circuit devices not subjected to further processing.
The method of claim 15 , wherein said fabricating a plurality of integrated circuit devices on said each wafer of the plurality of semiconductor wafers comprises fabricating integrated circuit devices selected from a group comprising Dynamic Random Access Memory (DRAM) devices, Static Random Access Memory (SRAM) devices, Synchronous DRAM (SDRAM) devices, and processor devices.
The method of claim 15 , wherein said causing said each integrated circuit device of the plurality of integrated circuit devices on said each wafer of the plurality of semiconductor wafers to store a substantially unique identification code comprises programming said each integrated circuit device of the plurality of integrated circuit devices on said each wafer of the plurality of semiconductor wafers to permanently store a unique fuse identification.
The method of claim 17 , wherein said programming said each integrated circuit device of the plurality of integrated circuit devices on said each wafer of the plurality of semiconductor wafers to permanently store the unique fuse identification comprises programming at least one of the fuses and anti-fuses in said each integrated circuit device of the plurality of integrated circuit devices on said each wafer of the plurality of semiconductor wafers to permanently store the unique fuse identification.
The method of claim 15 , wherein said assembling said each integrated circuit device of the plurality of integrated circuit devices into an integrated circuit device comprises:
picking each integrated circuit device of the plurality of integrated circuit devices from its wafer;
placing said each integrated circuit device of the plurality of integrated circuit devices onto an epoxy coated bonding site of one of a plurality of lead frames;
curing the epoxy on the bonding site of each one of plurality of the lead frames;
wire bonding said each integrated circuit device of the plurality of integrated circuit devices to its associated lead frame;
injection molding said each integrated circuit device of the plurality of integrated circuit devices and the associated lead frame to form one of a plurality of integrated circuit device packages, each having projecting leads;
de-flashing the projecting leads of each integrated circuit device package of the plurality of integrated circuit device packages;
curing said each integrated circuit device package of the plurality of integrated circuit device packages;
electroplating the projecting leads of said each integrated circuit device package of the plurality of integrated circuit device packages;
singulating said each integrated circuit device package of the plurality of integrated circuit device packages into one of a plurality of discrete integrated circuit devices; and
testing said each integrated circuit device of the plurality of integrated circuit devices for opens and shorts.
The method of claim 15 , wherein said assembling said each integrated circuit device of the plurality of integrated circuit devices into an integrated circuit device comprises assembling said each integrated circuit device of the plurality of integrated circuit devices into an integrated circuit device selected from a group comprising a wire bond/lead frame integrated circuit device, a Chip-On-Board (COB) integrated circuit device, a flip-chip integrated circuit device, and a Tape-Automated Bonding (TAB) integrated circuit device.
A method of manufacturing Multi-Chip Modules from semiconductor wafers, the method comprising:
providing a plurality of integrated circuit devices on each wafer of a plurality of semiconductor wafers;
storing data and the identification code of said each integrated circuit device of the plurality of integrated circuit devices indicating a desired manufacturing process flow for said each integrated circuit device of the plurality of integrated circuit devices;
separating said each integrated circuit device of the plurality of integrated circuit devices on said each wafer of the plurality of semiconductor wafers from the wafer to form one of a plurality of integrated circuit devices;
assembling one or more integrated circuit devices of the plurality of integrated circuit devices into each of a plurality of multi-chip modules;
reading the identification code of said each integrated circuit device of the plurality of integrated circuit devices in said each of the plurality of multi-chip modules;
accessing the data stored and the identification code of said each integrated circuit device of the plurality of integrated circuit devices in said each of the plurality of multi-chip modules;
evaluating the data accessed for said each integrated circuit device of the plurality of integrated circuit devices in said each of the plurality of multi-chip modules identifying any multi-chip modules having integrated circuit devices having undergone a manufacturing process flow that is different from the desired manufacturing process flow;
redirecting any multi-chip modules identified as having integrated circuit devices having undergone a manufacturing process flow that is different from the desired manufacturing process flow; and
back-end testing any non-redirected multi-chip modules.
The method of claim 21 , wherein the plurality of multi-chip modules are selected from a group comprising Single In-Line Memory Modules (SIMM's) and Dual In-line Memory Modules (DIMM's).
A method of manufacturing integrated circuit devices from semiconductor wafers the method comprising:
electronically probing each integrated circuit device of the plurality of integrated circuit devices on said each wafer of the plurality of semiconductor wafers to identify good and defective integrated circuit devices on said each wafer of the plurality of semiconductor wafers;
programming said each integrated circuit device of the plurality of integrated circuit devices on said each wafer of the plurality of semiconductor wafers to store a unique fuse identification;
storing an electronic wafer map for said each wafer of the plurality of semiconductor wafers that identifies locations of good and defective integrated circuit devices on the wafer associating each integrated circuit device on the wafer with its fuse identification;
sawing said each integrated circuit device of the plurality of integrated circuit devices on said each wafer of the plurality of semiconductor wafers from its wafer to form one of a plurality of discrete integrated circuit devices;
automatically picking said each integrated circuit device of the plurality of integrated circuit devices from the wafer;
curing the epoxy on the bonding site of said each lead frame of the plurality of lead frames;
wire bonding said each integrated circuit device of the plurality of integrated circuit devices to an associated lead frame;
injection molding said each integrated circuit device of the plurality of integrated circuit devices and the associated lead frame forming one of a plurality of integrated circuit device packages, each package having projecting leads;
de-flashing the projecting leads of said each integrated circuit device package of the plurality of integrated circuit device packages;
singulating said each integrated circuit device package of the plurality of integrated circuit device packages into one of a plurality of discrete integrated circuit devices;
testing said each integrated circuit device of the plurality of integrated circuit devices for opens and shorts;
electrically retrieving the fuse identification associated with said each integrated circuit device of the plurality of integrated circuit devices;
accessing the wafer map stored in association with the fuse identification associated with each integrated circuit device of the plurality of integrated circuit devices;
evaluating the wafer map accessed for said each integrated circuit device of the plurality of integrated circuit devices identifying any defective integrated circuit device and any good integrated circuit device;
discarding any integrated circuit device identified as a defective integrated circuit device; and
back-end testing any integrated circuit device identified as a good integrated circuit device.
Ref US6957114B1: Claims:
A resource allocator operable to allocate a plurality of multi-function resources among a plurality of tasks within a process system in semiconductor wafer fabrication, said process system capable of executing at least one application process, said resource allocator comprising: a monitoring controller that monitors measurable characteristics associated with said at least one executing application process, said plurality of multi-function resources, and said plurality of tasks, wherein each of said measurable characteristics comprises one of: a status characteristic and a logistical characteristic; a model of said process system representing mathematically said plurality of multi-function resources and said plurality of tasks, and defining relationships among related ones thereof as a function of said at least one application process; a resource allocation controller that operates said model in response to ones of said monitored measurable characteristics to allocate ones of said plurality of multi-function resources among ones of said plurality of tasks within said process system to efficiently execute said at least one application process; and a compliance-monitoring viewer operable to display process system information to illustrate compliance.
a monitoring controller that monitors measurable characteristics associated with said at least one executing application process, said plurality of multi-function resources, and said plurality of tasks, wherein each of said measurable characteristics comprises one of: a status characteristic and a logistical characteristic;
a model of said process system representing mathematically said plurality of multi-function resources and said plurality of tasks, and defining relationships among related ones thereof as a function of said at least one application process;
a resource allocation controller that operates said model in response to ones of said monitored measurable characteristics to allocate ones of said plurality of multi-function resources among ones of said plurality of tasks within said process system to efficiently execute said at least one application process; and
a compliance-monitoring viewer operable to display process system information to illustrate compliance.
The resource allocator as set forth in claim 1 wherein said compliance-monitoring viewer is associated with a graphical user interface.
The resource allocator as set forth in claim 2 wherein said graphical user interface is operable to visualize data over a time period of days.
The resource allocator as set forth in claim 3 wherein said graphical user interface is further operable to visualize said data over a subset of said time period of days.
The resource allocator as set forth in claim 2 wherein said graphical user interface is operable to visualize data over a time period of hours.
The resource allocator as set forth in claim 5 wherein said graphical user interface is further operable to visualize said data over a subset of said time period of hours.
The resource allocator as set forth in claim 1 wherein said compliance-monitoring viewer is operable to visualize data over a time period of one of years, months, days, hours, seconds, and microseconds.
The resource allocator as set forth in claim 7 wherein said compliance-monitoring viewer is further operable to visualize said data over a subset of said time period.
A method of operating a resource allocator to allocate a plurality of multi-function resources among a plurality of tasks within a process system, said process system capable of executing at least one application process, said method of operating said resource allocator comprising the steps of: monitoring measurable characteristics with a monitoring controller, said measurable characteristics associated with said at least one executing application process, said plurality of multi-function resources, and said plurality of tasks, wherein each of said measurable characteristics comprises one of: a status characteristic and a logistical characteristic; representing mathematically said plurality of multi-function resources and said plurality of tasks within a model of said process system, and defining relationships among related ones thereof as a function of said at least one application process; operating said model in response to ones of said monitored measurable characteristics to allocate ones of said plurality of multi-function resources among ones of said plurality of tasks within said process system using an resource allocation controller to efficiently execute said at least one application process; and displaying process system information to illustrate compliance.
monitoring measurable characteristics with a monitoring controller, said measurable characteristics associated with said at least one executing application process, said plurality of multi-function resources, and said plurality of tasks, wherein each of said measurable characteristics com
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