Office Action 2: Notice of Allowance (2025-05-01)

CLAIMS:
AMENDMENTS TO THE CLAIMS

This listing of claims will replace all prior versions, and listings of claims in the application.

Listing of Claims:

1\. (Currently Amended) A forming method of a semiconductor structure, comprising:
placing a target structure in a reaction chamber; and
forming a first oxide layer on the target structure, wherein the first oxide layer has a first thickness; and forming a second oxide layer under the first oxide layer, wherein the second oxide layer has a second thickness, and the first thickness is less than the second thickness;
wherein the first thickness is greater than 0.1 nm, and a sum of the first thickness and the second thickness is less than 3 nm.

2\. (Original) The forming method of a semiconductor structure according to claim 1, wherein the forming a first oxide layer on the target structure comprises:
adjusting a pressure in the reaction chamber to a first pressure; and
continuously heating the target structure for a first duration under the first pressure, to heat the target structure to a first temperature, and forming the first oxide layer on a surface of the target structure.

3\. (Original) The forming method of a semiconductor structure according to claim 2, wherein the forming a second oxide layer under the first oxide layer comprises:
adjusting the pressure in the reaction chamber to a second pressure; and
heating the target structure to a second temperature under the second pressure,
maintaining the second temperature for a preset duration, and forming the second oxide layer under the first oxide layer, wherein the target structure is heated to the second temperature and the second temperature is maintained for a second duration.

4\. (Original) The forming method of a semiconductor structure according to The forming method of a semiconductor structure according to
wherein the first pressure is greater than the second pressure, the first pressure is 3 atm to 20 atm, and the second pressure is 0.5 atm to 2 atm.

5\. (Original) The forming method of a semiconductor structure according to claim 3, wherein the first pressure and the second pressure are both 3 atm to 20 atm.

6\. (Original) The forming method of a semiconductor structure according to The forming method of a semiconductor structure according to
wherein the first pressure is less than the second pressure, the first pressure is 0.5 atm to 2 atm, and the second pressure is 3 atm to 20 atm.

7\. (Canceled)

8\. (Original) The forming method of a semiconductor structure according to claim 3, wherein a value of the first temperature is less than or equal to 1/2 of a value of the second temperature, the first temperature is 450°C to 550°C, and the second temperature is 950°C to 1100°C.

9\. (Original) The forming method of a semiconductor structure according to claim 3, the forming method further comprises:
injecting an oxygen-containing gas into the reaction chamber at a first flow rate; and
injecting a catalyst into the reaction chamber at a second flow rate, wherein the catalyst is a gas, and the catalyst comprises a halogen monomer or a halogen compound.

10\. (Original) The forming method of a semiconductor structure according to claim 9, the forming method further comprises:
performing thermal treatment on the target structure, and controlling the second flow rate to be positively correlated with a duration of the thermal treatment, wherein densities of the first oxide layer and the second oxide layer gradually increase from a top surface of the first oxide layer to a bottom surface of the second oxide layer;
or,

performing thermal treatment on the target structure, and controlling the second flow rate to be negatively correlated with a duration of the thermal treatment, wherein densities of the first oxide layer and the second oxide layer gradually decrease from a top surface of the first oxide layer to a bottom surface of the second oxide layer.

11\. (Original) The forming method of a semiconductor structure according to claim 9, the forming method further comprises:
injecting the oxygen-containing gas and the catalyst into the reaction chamber in the first duration; and stopping injecting the catalyst into the reaction chamber at an end of the first duration, such that a density of the first oxide layer is greater than that of the second oxide layer.

12\. (Original) The forming method of a semiconductor structure according to claim 9, the forming method further comprises:
injecting the oxygen-containing gas into the reaction chamber in the first duration and the second duration; and injecting the catalyst into the reaction chamber at a beginning of the second duration, such that a density of the second oxide layer is greater than that of the first oxide layer.

13\. (Original) The forming method of a semiconductor structure according to claim 9, wherein a ratio of the first flow rate to the second flow rate is greater than 10:1.

14\. (Original) The forming method of a semiconductor structure according to claim 9, wherein the first flow rate is 200 sccm to 500 sccm; and the second flow rate is 10 sccm to 50 sccm.

15\. (Original) The forming method of a semiconductor structure according to claim 9, wherein a gaseous mixture of the oxygen-containing gas and the catalyst is injected into the reaction chamber;
or,
the oxygen-containing gas and the catalyst are injected into the reaction chamber alternately by pulses.

16\. (Original) The forming method of a semiconductor structure according to claim 2, wherein the target structure comprises a doped region, dopant ions are implanted in the doped region, and a temperature at which the dopant ions are activated and escape from the target structure is greater than the first temperature.

17\. (Currently Amended) A semiconductor structure, comprising:
a doped region, wherein the doped region comprises dopant ions;
a first oxide layer, wherein the first oxide layer covers a surface of the semiconductor structure, and the first oxide layer has a first thickness; and
a second oxide layer, wherein the second oxide layer is located under the first oxide layer, the second oxide layer has a second thickness, and the first thickness is less than the second thickness;
wherein the first thickness is greater than 0.1 nm, and a sum of the first thickness and the second thickness is less than 3 nm.

18\. (Canceled)

19\. (Original) The semiconductor structure according to claim 17, wherein a density of the first oxide layer is greater than that of the second oxide layer;
or,
a density of the first oxide layer is less than that of the second oxide layer.

20\. (Original) The semiconductor structure according to claim 17, wherein densities of the first oxide layer and the second oxide layer increase gradually from a top surface of the first oxide layer to a bottom surface of the second oxide layer;
or,
densities of the first oxide layer and the second oxide layer decrease gradually from a top surface of the first oxide layer to a bottom surface of the second oxide layer.

OFFICE ACTION:
DETAILED ACTION
Notice of Pre-AIA  or AIA  Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Response to Arguments
Applicant’s explanation of the instant invention in pointing the difference with the cited prior art was found to be persuasive.
Allowable Subject Matter
Claims 1 – 6, 8 – 17, 19 and 20 are now allowed.
The following is an examiner’s statement of reasons for allowance:
The reasons for allowing these claims are provide in the Applicant’s Arguments/Remarks (pages 6 and 7) filed February 09, 2025  The novel features of the claims are limitations wherein the first oxide layer has a first thickness and forming a second oxide layer under the first oxide layer, wherein the second oxide layer has a second thickness, and the first thickness is less than the second thickness wherein the first thickness is greater than 0.1 nm, and a sum of the first thickness and the second thickness is less than 3 nm. Furthermore, the art of record does not disclose or anticipate the above limitation in combination with other claim elements nor would it be obvious to modify the art of record so as to form a device including the above limitation.
Conclusion
Any comments considered necessary by applicant must be submitted no later than the payment of the issue fee and, to avoid processing delays, should preferably accompany the issue fee.  Such submissions should be clearly labeled “Comments on Statement of Reasons for Allowance.”

APPLICANT REBUTTAL: REMARKS/ARGUMENTS
Upon entry of the present amendment, claims 1-6, 8-17, 19, and 20 will be pending in this application. Claims 1 and 17 have been amended, and claims 7 and 18 have been canceled. No new matter is added. Based on the following remarks, Applicant respectfully requests reconsideration and allowance of the pending claims.
Claim Re
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ections
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35 U
.S.
C.
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Claim 1 is rejected under 35 U.S.C. § 103 as allegedly being unpatentable over Thakur (US 5,360,769).
Claims 2-3 and 16-17 are rejected under 35 U.S.C. § 103 as allegedly being unpatentable over Thakur.
In an effort to advance prosecution and without conceding to the merits of the rejection, Applicant has amended
claim 1
to incorporate the elements recited in the
allowable claim 7.
Thus, claim 1 and its dependent claims are in condition for allowance.
Likewise, in an effort to advance prosecution and without conceding to the merits of the rejection, Applicant has amended
claim 17
to incorporate the elements recited in the
allowable claim 18.
Thus, claim 17 and its dependent claims are in condition for allowance.
CONCLUSION