Office Action 2: Notice of Allowance (2025-06-18)

CLAIMS:
AMENDMENTS TO THE CLAIMS

1-6. (Canceled)25

7\. (Currently amended) A method of making a light assembly of a string light, the method comprising:providing a first wire and a second wire;
stripping an end of each of the first wire and the second wire \[\[stripped\]\] of insulation to expose a portion of \[\[the\]\] copper strands of each of the first wire and the second wire;
soldering a first LED chip to the first wire and the second wire;
encapsulating the first LED chip with a colloid;
attaching a light head to the first wire and second wire after the first LED chip is encapsulated with a colloid; and
securing a decorative shell on the light head after the light head is attached to the first wire and second wire,
wherein the decorative shell and light head enclose \[\[enclosing\]\] the colloid encapsulating the first LED chip.

8\. (Original) The method of claim 7, further comprises placing a rear plug in a space between the first wire and the second wire where the first wire and the second wire diverge.

9\. (Original) The method of claim 7, wherein soldering the first LED chip to the first wire and the second wire comprises soldering an anode of the first LED chip to the exposed copper

strands of the first wire and soldering a cathode of the first LED chip to the exposed copper strands of the second wire.

10\. (Original) The method of claim 7, wherein the light head is assembled or made by foam injection.

11\. (Currently amended) The method of claim 7, wherein the colloid is formed over the first LED chip using injection molding, casting, \[\[and\]\]or foam injection.

12\. (Original) The method of claim 7, further comprises soldering a second LED chip to the exposed copper strands of the first wire and the second wire.

OFFICE ACTION:
ALLOWABILITY NOTICE
Notice of Pre-AIA  or AIA  Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Response to Amendment
Applicant's amendment filed on 4/11/2025 has been entered.  Claims 7 and 11 have been amended.  Claims 1-6 have been cancelled.  No claims have been added.  Claims 7-12 are still pending in this application, with claim 7 being independent.
The objection to Claim 7 has been withdrawn in view of the amendment.
The rejections of Claims 6-12 under 35 U.S.C. 112(b) have been withdrawn in view of the amendment.
EXAMINER'S AMENDMENT
An examiner’s amendment to the record appears below. Should the changes and/or additions be unacceptable to applicant, an amendment may be filed as provided by 37 CFR 1.312. To ensure consideration of such an amendment, it MUST be submitted no later than the payment of the issue fee.
Authorization for this examiner’s amendment was given in an interview with Kenneth Xie, Reg. #60,350 on 6/4/2025.
The application has been amended as follows:
Claim 7 (currently amended): A method of making a light assembly of a string light, the method comprising:
providing a first wire and a second wire;
stripping an end of each of the first wire and the second wire of insulation to expose a portion of copper strands of each of the first wire and the second wire;
encapsulating the first LED chip with a colloid;
attaching a light head to the first wire and the second wire after the first LED chip is encapsulated with the
securing a decorative shell on the light head after the light head is attached to the first wire and second wire,
wherein the decorative shell and the light head enclose the colloid encapsulating the first LED chip.
Allowable Subject Matter
Claims 7-12 are allowed.
The following is an examiner’s statement of reasons for allowance:
Regarding claim 7, the Prior Art taken as a whole fails to specifically disclose or suggest, in combination, “A method of making a light assembly of a string light, the method comprising providing a first wire and a second wire; stripping an end of each of the first wire and the second wire of insulation to expose a portion of copper strands of each of the first wire and the second wire; soldering a first LED chip to the first wire and the second wire; encapsulating the first LED chip with a colloid; attaching a light head to the first wire and second wire after the first LED chip is encapsulated with the colloid; and securing a decorative shell on the light head after the light head is attached to the first wire and second wire, wherein the decorative shell and light head enclose the colloid encapsulating the first LED chip” (emphasis added).
The closest Prior Art, Tsai (US 12,085,244), lacks the teaching of the light head being attached to the first and second wires after the first LED chip has been encapsulated with the colloid, and subsequently securing the decorative shell onto the light head after attaching the light head to the first and second wires, as required by amended Claim 7. Additionally, although Wang (US 10,823,376) teaches an LED light bar comprising a colloidal shell enclosing the LEDs, which is directly plugged into a light head/lamp holder after assembly of the encapsulated LED light bar to connect the LEDs to a wire in the light head, Wang also teaches the wire is already installed in the light head prior to the connection of the LED bar to the wires, rather than the first LED chip being soldered to the first and second wires prior to the LED chip being encapsulated by the colloid and then attaching the first and second wires attached to the light head, as required by amended Claim 7.
Accordingly, although methods of making a light assembly of a string light are known, as evidenced by the Prior Art already of record, no Prior Art was found teaching individually, or suggesting in combination, all the features of Applicant’s invention, in particular the above limitations in combination with the remaining features of the claim, and there would be no motivation, absent the Applicant’s own disclosure, to modify the references in the manner distinctly and specifically called for in the combination as claimed in amended Claim 7.
Claims 8-12 are allowable due to their dependence on allowable Claim 7.
Any comments considered necessary by applicant must be submitted no later than the payment of the issue fee and, to avoid processing delays, should preferably accompany the issue fee.  Such submissions should be clearly labeled “Comments on Statement of Reasons for Allowance.”
Conclusion
The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. Lu (US 2023/0128538) discloses an LED lamp string and method of making the LED lamp string comprising soldering a first LED chip to exposed contacts of first and second wires and encapsulating the first LED chip with an encapsulating material to form a lamp bead using injection molding, and Loomis et al. (US 2015/0211727) discloses an LED light string and method of making the LED light string comprising a first LED chip electrically connected without solder to a first wire and a second wire, encapsulating the first LED chip with a lens, attaching a light head to the first wire and the second wire, and securing a decorative shell on the light head after the light head is attached to the first and second wires, the decorative shell and the light head both enclosing the lens encapsulating the first LED chip.

APPLICANT REBUTTAL: REMARKSClaims 1-12 were pending. Claim 7 was objected to because of informalities. Claims 6- 12 were rejected under 35 U.S.C. 112(b) as being indefinite or failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor regards as the invention. Claims 1-12 were rejected under 35 U.S.C. 103 as being unpatentable over Tsai (U.S.Patent No. 12,085,244) in view of Chen (U.S. Patent Application Publication No.2018/0187840).With entry of this Amendment, claims 1-6 are canceled; and claims 7 and 11 is amended.Claim Obiection Claim 7 was objected to because of informalities. Claim 7 is amended in accordance with the Examiner's suggestion. As such, the objection should be withdrawn.Rejection under 35 U.S.C. 112(b) Claims 6-12 were rejected under 35 U.S.C. 112(b) as being indefinite or failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor regards as the invention.Claim 6 is canceled, rendering its rejection under 35 U.S.C. 112(b) moot.Claim 7 is amended in accordance with the Examiner's suggestion. As such, the rejection of claim 7 and its dependent claims 8-10 and 12 under 35 U.S.C. 112(b) should be withdrawn.Claim 11 is amended to recite, in part: "wherein the colloid is formed over the first LED chip using one of injection molding, casting, [[and]]or foam injection." In view of the amendment, the rejection of claim 11 under 35 U.S.C. 112(b) should be withdrawn.Rejection under 35 U.S.C. 103 Claims 1-12 were rejected under 35 U.S.C. 103 as being unpatentable over Tsai in view of Chen.Without conceding that the rejection of claims 1-6 under 35 U.S.C. 103 is proper and for the sole purpose of moving prosecution forward, Applicant hereby cancels claims 1-6, rendering moot the rejection of these claims under 35 U.S.C. 103.The present invention, as set forth in amended claim 7, is directed to a method of making a light assembly of a string light. The method includes:providing a first wire and a second wire;stripping an end of each of the first wire and the second wire [[stripped]] of insulation to expose a portion of [[the]] copper strands of each of the first wire and the second wire;soldering a first LED chip to the first wire and the second wire;encapsulating the first LED chip with a colloid;attaching a light head to the first wire and second wire after the first LED chip is encapsulated with a colloid; and securing a decorative shell on the light head after the light head is attached to the first wire and second wire, wherein the decorative shell and light head enclose [[enclosing]] the colloid encapsulating the first LED chip.In particular, claim 7 is amended to require, in part, "attaching a light head to the first wire and second wire after the first LED chip is encapsulated with a colloid; and securing a decorative shell on the light head after the light head is attached to the first wire and second wire." Support for the amendments can be found in, for example, paragraphs [0020]-[0022] and Figs. 3C-3E of the application. Because the light head is attached to the first wire and the second wire after the first LED chip is encapsulated with a colloid, "[t]he colloid 300 can be shaped into any form as needed" (i.e., not necessarily shaped by the light head). (See paragraph [0020] of the application) Having the steps in the required order also simplifies the manufacturing process.The Office Action cites the filler 116, housing 106, and light cap 104 of Tsai as the colloid, light head, and decorative shell of claim 7, respectively. Tsai's method comprises:filling a hollow of the light cap with epoxy, filling the housing with the epoxy, or a combination thereof. As a practical example, the method may be carried out by inserting the light assembly into the housing assembly through a wire aperture of the housing that is opposite the light aperture in the housing, such that the light emitter of the light emitting source extends into the filler in the light cap, at least a portion of the insulative projection of the spacer plug extends into the filler in the light cap, and the filler bonds the spacer plug and the light emitting source to the light cap.(Col. 17, Ins. 36-46 of Tsai, emphasis added) That is, Tsai fills the light cap/housing with epoxy before inserting the light assembly into the filler in the light cap. This process is also illustrated in Figs. 10 and 11A-11D. As such, Tsai's method is different from the claimed inventions in that it does not include "attaching a light head to the first wire and second wire after the first LED chip is encapsulated with a colloid; and securing a decorative shell on the light head after the light head is attached to the first wire and second wire." Tsai's method does not allow the epoxy to be shaped by any form needed. It is also more complicated to carry out than the method of claim 7.The Office Action cites Chen for disclosing enclosing "encapsulating the first LED chip with a colloid." (Office Action, at 11) However, Chen is also silent regarding the order in which the LED chip is encapsulated with a colloid, a light head is attached to the first and second wire, and a decorative shell is secured on the light head. As such, the combination of Tsai and Chen fails to disclose or suggest every recitation of amended claim 7.Because claims 8-12 depend from claim 7, claims 8-12 are patentable over the cited references for at least the same reasons discussed above. Accordingly, the rejection of claim 7-12 under 35 U.S.C. 103 should be withdrawn.Conclusion It is believed that all the outstanding objections and rejections made by the Examiner in the Office Action are adequately addressed by the above amendments and remarks. Favorable action on this application is therefore requested.Date: April 11, 2025    Respectfully submitted, By:   _/Kenneth X. Xie/ Kenneth X. Xie Registration No. 60350 Enable TP, P.C.222 N. Pacific Coast Hwy. Suite 2000 El Segundo, California 90245 Telephone: (323) 356-8882 Customer No. 194339


CITED REFERENCE SUMMARIES: Ref US10823376B1: [content unavailable]
Ref US20230128538A1: Claims:
An LED lamp string, comprising a wire body and several LED light emitting patches, wherein anodes and cathodes of the LED light emitting patches are directly and electrically connected to an anode wire and a cathode wire in the wire body respectively, the LED light emitting patches, and a portion of the wire body located proximate to the LED light emitting patches are encapsulated by a lamp bead, and the LED light emitting patches each comprises at least one LED light emitting patch unit, wherein the LED lamp string is capable of forming a copper wire lamp, a silver wire lamp or a flexible wire lamp.
wherein the LED lamp string is capable of forming a copper wire lamp, a silver wire lamp or a flexible wire lamp.
The LED lamp string according to claim 1 , wherein the LED light emitting patches are each located at a corer portion of the anode wire and the cathode wire and arranged as an inverted U, and two sides of the anode wire and the cathode wire extend respectively to an outer side at a bottom of the lamp bead.
The LED lamp string according to claim 2 , wherein the LED light emitting patches are each located at a corner portion of the anode wire and the cathode wire.
The LED lamp string according to claim 3 , wherein several lamp beads cladded with LED light emitting patches are in a serial connection.
The LED lamp string according to claim 1 , wherein the wire body further comprises an address writing wire, and the address writing wire is in a side-by-side arrangement with respect to the anode wire and the cathode wire.
The LED lamp string according to claim 1 , wherein the wire body is one of a copper wire, a silver wire and a copper enameled wire.
The LED lamp string according to claim 1 , wherein the lamp bead has one or more shapes of a round head, an ellipse, a concave, a bullet, a straw hat, a diamond and a polygon.
The LED lamp string according to claim 1 , wherein a light emitting plate inside each of the LED light emitting patches faces toward a top end of the lamp bead.
The LED lamp string according to claim 1 , wherein an insulating layer covers an outer surface of the wire body.
The LED lamp string according to claim 9 , wherein the insulating layer is made of one of a resin, a plastic material and a silicon rubber.
The LED lamp string according to claim 10 , wherein the single lamp bead is used to clad two LED light emitting patch units.
The LED lamp string according to claim 10 , wherein the single lamp bead is used to clad three LED light emitting patch units.
A processing technique of an LED lamp string, comprising: S1: using a photoelectric color scanner to sort an LED light emitting patch unit and completing sorting for the LED light emitting patch unit in a corresponding color according to technical requirements; S2: mounting the LED light emitting patch unit in the corresponding color to a conductive portion on an anode wire, a cathode wire and an address writing wire inside a wire body through an LED mounting machine, thereby forming an electrical connection; S3: by combining the mounting machine in the step S2, completing smearing of a solder paste through a solder paste printer, and disposing several contact surfaces for the wire body through grinding or cutting, wherein the contact surfaces each is a conductive surface and the solder paste is smeared on the contact surface; S4: docking an anode contact surface and a cathode contact surface that are smeared with the solder paste to an anode end and a cathode end of the LED light emitting patch unit and heating to fusion of the solder paste and then performing cooling to enable the anode wire to be welded to the anode end of the LED light emitting patch unit for being fixed and the cathode wire to be welded to the cathode end of the LED light emitting patch unit for being fixed; and S5: after completing the welding, connecting a plurality of LED light emitting patch units on the anode wire and the cathode wire, the plurality of LED light emitting patch units being divided into several LED light emitting patches, then embedding a single LED or a plurality of light emitting patches and a portion of the wire body into a modeling chamber inside an injection mold; obtaining a modeling lamp bead through an injection, and completing encapsulating for a single LED light emitting patch and the anode wire and the cathode wire located proximate to two ends of the LED light emitting patch, thus obtaining an entire LED lamp string.
S1: using a photoelectric color scanner to sort an LED light emitting patch unit and completing sorting for the LED light emitting patch unit in a corresponding color according to technical requirements;
S2: mounting the LED light emitting patch unit in the corresponding color to a conductive portion on an anode wire, a cathode wire and an address writing wire inside a wire body through an LED mounting machine, thereby forming an electrical connection;
S3: by combining the mounting machine in the step S2, completing smearing of a solder paste through a solder paste printer, and disposing several contact surfaces for the wire body through grinding or cutting, wherein the contact surfaces each is a conductive surface and the solder paste is smeared on the contact surface;
S4: docking an anode contact surface and a cathode contact surface that are smeared with the solder paste to an anode end and a cathode end of the LED light emitting patch unit and heating to fusion of the solder paste and then performing cooling to enable the anode wire to be welded to the anode end of the LED light emitting patch unit for being fixed and the cathode wire to be welded to the cathode end of the LED light emitting patch unit for being fixed; and
S5: after completing the welding, connecting a plurality of LED light emitting patch units on the anode wire and the cathode wire, the plurality of LED light emitting patch units being divided into several LED light emitting patches, then embedding a single LED or a plurality of light emitting patches and a portion of the wire body into a modeling chamber inside an injection mold; obtaining a modeling lamp bead through an injection, and completing encapsulating for a single LED light emitting patch and the anode wire and the cathode wire located proximate to two ends of the LED light emitting patch, thus obtaining an entire LED lamp string.
Ref US20150211727A1: Claims:
A water-resistant LED capture device comprising: a base module; a cap module configured to assemble to the base module, wherein an internal cavity is formed by the cap module and the base module when the cap module is assembled to the base module, the internal cavity configured to receive a light-emitting device therein, the cap module providing light transmissivity from a received light-emitting device to an outside of the water-resistant LED capture device; and, a deformable sealing member that deforms as the cap module is assembled to the base module, wherein, when the cap module is assembled to the base module and the deformable sealing member is deformed, the deformable sealing member forms a water resistant seal between the cap module and the base module along a substantially annular path, wherein, an assembly comprising the cap module and the base module includes two lumens, each lumen configured to provide a pathway for an insulated conductor from the outside of the water-resistant LED capture device to the internal cavity to supply electrical energy to the light-emitting device therein, wherein assembling the cap module to the base module introduces a radial compression that reduces the mean cross-sectional area of each of the two lumens to form a water-resistant seal circumscribing each of the insulated conductors in the corresponding two lumens.
a cap module configured to assemble to the base module, wherein an internal cavity is formed by the cap module and the base module when the cap module is assembled to the base module, the internal cavity configured to receive a light-emitting device therein, the cap module providing light transmissivity from a received light-emitting device to an outside of the water-resistant LED capture device; and,
a deformable sealing member that deforms as the cap module is assembled to the base module, wherein, when the cap module is assembled to the base module and the deformable sealing member is deformed, the deformable sealing member forms a water resistant seal between the cap module and the base module along a substantially annular path,
wherein, an assembly comprising the cap module and the base module includes two lumens, each lumen configured to provide a pathway for an insulated conductor from the outside of the water-resistant LED capture device to the internal cavity to supply electrical energy to the light-emitting device therein,
wherein assembling the cap module to the base module introduces a radial compression that reduces the mean cross-sectional area of each of the two lumens to form a water-resistant seal circumscribing each of the insulated conductors in the corresponding two lumens.
The water-resistant LED capture device of claim 1 , further comprising a substantially annular groove in a surface of either the cap module or the base module, the annular groove configured to receive the deformable sealing member when the cap module is assembled to the base module.
The water-resistant LED capture device of claim 1 , further comprising a translucent or transparent lens cap having a sealing surface configured to engage a complementary sealing surface of the cap module to form a water-resistant seal therebetween.
The water-resistant LED capture device of claim 1 , wherein the cap module provides light transmissivity from the received light-emitting device to an outside of the water-resistant LED capture device via a translucent or transparent portion of the cap module.
The water-resistant LED capture device of claim 1 , wherein the deformable sealing member comprises an annular or semi-annular ring.
The water-resistant LED capture device of claim 5 , wherein the annular or semi-annular ring is a raised ring of plastic projecting from a surface of either the base module or the cap module.
The water-resistant LED capture device of claim 5 , wherein the annual or semi-annular ring is an O-ring.
The water-resistant LED capture device of claim 1 , wherein the deformable sealing member comprises a screw thread.
The water-resistant LED capture device of claim 1 , wherein the base module is split along a plane that is substantially coplanar with an axis of each of the two lumens.
The water-resistant LED capture device of claim 1 , further comprising an epoxy in the cavity for providing water-resistant sealing.
The water-resistant LED capture device of claim 1 , wherein the base module is injection molded onto an insulated conductor.
The water-resistant LED capture device of claim 1 , further comprising the light-emitting device, wherein the light-emitting device is in electrical communication with the conductors when assembled.
The water-resistant LED capture device of claim 1 , wherein the light-emitting device has two wire leads, wherein when the light-emitting device is received into the cap module, one of the wire leads is aligned with an axis of the cap module and the other wire lead is electrically connected with a conductor that circumferentially surrounds the axially aligned wire lead.
The water-resistant LED capture device of claim 1 , wherein the cap module releasably assembles to the base module to permit replacement of the light-emitting device.
A water-resistant LED capture device comprising: a base module; a cap module configured to assemble to the base module, wherein an internal cavity is formed by the cap module and the base module when the cap module is assembled to the base module, the internal cavity configured to receive a light-emitting device therein, the cap module providing light transmissivity from a received light-emitting device to an outside of the water-resistant LED capture device; and, a deformable sealing member that deforms as the cap module is assembled to the base module, wherein, when the cap module is assembled to the base module and the deformable sealing member is deformed, the deformable sealing member forms a water resistant seal between the cap module and the base module along a substantially annular path, wherein, an assembly comprising the cap module and the base module includes two lumens, each lumen configured to provide a pathway for an insulated conductor from the outside of the water-resistant LED capture device to the internal cavity to supply electrical energy to a light-emitting device therein, wherein assembling the cap module to the base module introduces a radial compression that reduces the mean cross-sectional area of each of the two lumens to form a water-resistant seal circumscribing each of the insulated conductors in the corresponding two lumens, wherein the cap module has an aperture through which a lens of the light-emitting device projects when the light-emitting device is received in the internal cavity and the cap module is assembled to the base module.
wherein, an assembly comprising the cap module and the base module includes two lumens, each lumen configured to provide a pathway for an insulated conductor from the outside of the water-resistant LED capture device to the internal cavity to supply electrical energy to a light-emitting device therein,
wherein assembling the cap module to the base module introduces a radial compression that reduces the mean cross-sectional area of each of the two lumens to form a water-resistant seal circumscribing each of the insulated conductors in the corresponding two lumens,
wherein the cap module has an aperture through which a lens of the light-emitting device projects when the light-emitting device is received in the internal cavity and the cap module is assembled to the base module.
The water-resistant LED capture device of claim 15 , wherein, when the light-emitting device is received in the cavity and the cap module is assembled to the base module, the base module engages a base of the light-emitting device and forces the light-emitting device against an annular water-sealing surface of the cap module.
The water-resistant LED capture device of claim 15 , wherein the cap module has an annular sealing surface surrounding the aperture, the annular sealing surface having a raised circumferential crest and a lowered circumferential trough configured to engage a complementary trough and crest of a complementary sealing surface of a lens of the light-emitting device.
The water-resistant LED capture device of claim 15 , wherein the cap module has a conical sealing surface surrounding the aperture, the conical sealing surface engaging a conical surface of a lens of the light-emitting diode when assembled.
A water-resistant LED capture device comprising: a base module; a cap module configured to assemble to the base module, wherein an internal cavity is formed by the cap module and the base module when the cap module is assembled to the base module, the internal cavity configured to receive a light-emitting device therein, the cap module providing light transmissivity from a received light-emitting device to an outside of the water-resistant LED capture device; means for sealing the cap module to the base module in a water-resistant manner when assembled; and, means for sealing the periphery of insulated conductors in a water-resistant manner when assembled.
a cap module configured to assemble to the base module, wherein an internal cavity is formed by the cap module and the base module when the cap module is assembled to the base module, the internal cavity configured to receive a light-emitting device therein, the cap module providing light transmissivity from a received light-emitting device to an outside of the water-resistant LED capture device;
means for sealing the cap module to the base module in a water-resistant manner when assembled; and,
means for sealing the periphery of insulated conductors in a water-resistant manner when assembled.
The water-resistant LED capture device of claim 19 , further comprising the light-emitting device that is in electrical communication with the conductors when assembled.
Ref US20230128538: Claims:
1. An LED lamp string, comprising a wire body and several LED light emitting patches, wherein anodes and cathodes of the LED light emitting patches are directly and electrically connected to an anode wire and a cathode wire in the wire body respectively, the LED light emitting patches, and a portion of the wire body located proximate to the LED light emitting patches are encapsulated by a lamp bead, and the LED light emitting patches each comprises at least one LED light emitting patch unit,
wherein the LED lamp string is capable of forming a copper wire lamp, a silver wire lamp or a flexible wire lamp.
2. The LED lamp string according to claim 1, wherein the LED light emitting patches are each located at a corer portion of the anode wire and the cathode wire and arranged as an inverted U, and two sides of the anode wire and the cathode wire extend respectively to an outer side at a bottom of the lamp bead.
3. The LED lamp string according to claim 2, wherein the LED light emitting patches are each located at a corner portion of the anode wire and the cathode wire.
4. The LED lamp string according to claim 3, wherein several lamp beads cladded with LED light emitting patches are in a serial connection.
5. The LED lamp string according to claim 1, wherein the wire body further comprises an address writing wire, and the address writing wire is in a side-by-side arrangement with respect to the anode wire and the cathode wire.
6. The LED lamp string according to claim 1, wherein the wire body is one of a copper wire, a silver wire and a copper enameled wire.
7. The LED lamp string according to claim 1, wherein the lamp bead has one or more shapes of a round head, an ellipse, a concave, a bullet, a straw hat, a diamond and a polygon.
8. The LED lamp string according to claim 1, wherein a light emitting plate inside each of the LED light emitting patches faces toward a top end of the lamp bead.
9. The LED lamp string according to claim 1, wherein an insulating layer covers an outer surface of the wire body.
10. The LED lamp string according to claim 9, wherein the insulating layer is made of one of a resin, a plastic material and a silicon rubber.
11. The LED lamp string according to claim 10, wherein the single lamp bead is used to clad two LED light emitting patch units.
12. The LED lamp string according to claim 10, wherein the single lamp bead is used to clad three LED light emitting patch units.
13. A processing technique of an LED lamp string, comprising:
S1: using a photoelectric color scanner to sort an LED light emitting patch unit and completing sorting for the LED light emitting patch unit in a corresponding color according to technical requirements; S2: mounting the LED light emitting patch unit in the corresponding color to a conductive portion on an anode wire, a cathode wire and an address writing wire inside a wire body through an LED mounting machine, thereby forming an electrical connection; S3: by combining the mounting machine in the step S2, completing smearing of a solder paste through a solder paste printer, and disposing several contact surfaces for the wire body through grinding or cutting, wherein the contact surfaces each is a conductive surface and the solder paste is smeared on the contact surface; S4: docking an anode contact surface and a cathode contact surface that are smeared with the solder paste to an anode end and a cathode end of the LED light emitting patch unit and heating to fusion of the solder paste and then performing cooling to enable the anode w
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