Office Action 4: Notice of Allowance (2025-03-04)

CLAIMS:
Amendments to the Claims:

This listing of claims will replace all prior versions and listings of claims in the application:

1\. (Currently Amended) A method of assembling a flipchip semiconductor package,
comprising:placing a semiconductor die having circuitry electrically coupled to bond pads having bumps with solder paste thereon onto bonding features of a package substrate; and
arc welding using a biased electrode having a tip spaced apart from the solder paste, wherein electrical current generated by the arc welding melts the solder paste to provide a solder connection, wherein an arc welding apparatus used includes a plurality of biased electrodes, and wherein a first biased electrode and a second biased electrode are \[\[is\]\] configured to form solder connections in a first plane and a third biased electrode and a fourth biased electrode are \[\[is\]\] configured to form solder connections in a second plane, perpendicular to the first plane.
2\. (Original) The method of claim 1, wherein the bumps comprise solder balls or pillars.
3\. (Original) The method of claim 1, wherein the method excludes a solder reflow step.
4\. (Original) The method of claim 1, further comprising flux washing after applying the electrical current.
5\. (Previously Presented) The method of claim 1, wherein the arc welding simultaneously forms a plurality of solder connections.
6\. (Original) The method of claim 1, wherein the package substrate comprises a leadframe,
and wherein the bonding features comprise leads.

7\. (Original) The method of claim 1, wherein the tip is positioned at an angle from 150 to 450 relative to a normal drawn from a top surface of the package substrate.
8\. (Original) The method of claim 1, wherein the bond pads are all positioned along a periphery of the semiconductor die.
9\. (Original) The method of claim 1, wherein the electrical current is in a range from 60 mA to 200 mA.

10\. (Original) The method of claim 1, wherein the electrical current is applied for a time between 0.5 msec and 1.3 msec.

11\. (Cancelled)

12\. (Original) The method of claim 1, wherein there is solder flux on the bonding features.

13\. (Currently Amended) A method of assembling a semiconductor package, comprising:placing a semiconductor die having circuitry electrically coupled to electrical contacts with solder paste thereon onto bonding features of a package substrate; and
arc welding using a biased electrode having a tip spaced apart from the solder paste, wherein electrical current generated by the arc welding melts the solder paste to provide a solder connection, wherein an arc welding apparatus used includes a plurality of biased electrodes, and wherein a first biased electrode and a second biased electrode are \[\[is\]\] configured to form solder connections in a first plane and a third biased electrode and a fourth biased electrode are \[\[is\]\] configured to form solder connections in a second plane, perpendicular to the first plane.

14\. (Original) The method of claim 13, wherein the package substrate comprises a leadframe, and wherein the bonding features comprise leads.

15\. (Original) The method of claim 13, wherein the tip is positioned at an angle from 150 to 450 relative to a normal drawn from a top surface of the package substrate.

16\. (Original) The method of claim 13, wherein the bond pads are all positioned along a periphery of the semiconductor die.

17\. (Original) The method of claim 13, wherein the electrical current is in a range from 60 mA to 200 mA.

18\. (Original) The method of claim 13, wherein the electrical current is applied for a time between 0.5 msec and 1.3 msec.

19\. (Previously Presented) The method of claim 13, wherein the electrical contacts comprise pillars.

20\. (Previously Presented) The method of claim 13, wherein the electrical contacts comprise solder balls.

21\. (Original) The method of claim 13, wherein the method excludes a solder reflow step.

22\. (Currently Amended) A method of assembling a semiconductor package, comprising:placing a semiconductor die having circuitry electrically coupled to electrical contacts with solder paste thereon onto bonding features of a package substrate; and
generating an arc using a biased electrode having a tip spaced apart from the solder paste to melt the solder paste to provide a solder connection, wherein an arc generating apparatus used includes a plurality of biased electrodes and wherein a first biased electrode and a second biased electrode are \[\[is\]\] configured to form solder connections in a first plane and a third biased electrode and a fourth biased electrode are \[\[is\]\] configured to form solder connections in a second plane, perpendicular to the first plane.

OFFICE ACTION:
DETAILED ACTION
Notice of Pre-AIA  or AIA  Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Information Disclosure Statement
The information disclosure statement (IDS) submitted on 04/27/2022 is in compliance with the provisions 37 CFR 1.97. Accordingly, the information disclosure statement is being considered by the examiner.
Response to Arguments
Applicant’s arguments, see pages 5-8 of argument, filed 02/05/2025, with respect to claims 1, 13 and 22 have been fully considered and are persuasive.  The previous rejection of claims 1 -10 and 12-22 has been withdrawn.
Allowable Subject Matter
Claims 1-10 and 12-22 are allowed. The following is an examiner’s statement of reasons for allowance: The prior art taken either singularly or in combination fails to anticipate or fairly suggest the limitations of the claims listed above in such a manner that a rejection under 35 U.S.C. 102 or 103 would be proper. See Applicant’s argument on page 5-8 on 02/05/2025.
The closest art is Teshima, Kouichi (US 6280858), Kato, Tetsuaki (US 20060069466) and Blankenship, George (US 20050133488). However, with respect to the newly amended claims 1, 13, and 22, the references fail to teach the limitations of independent claims 1, 13, and 22 either alone or in combination.
Teshima teaches a method of assembling a semiconductor package, having circuitry electrically coupled to bond pads, having bumps with solder paste thereon onto bonding features of a package substrate using arc welding wherein electrical current generated by the arc welding melts the solder paste to provide a solder connection, as disclosed in claims 1, 13, and 22. Teshima does not teach a device that includes a plurality of biased electrodes, wherein a first biased electrode and a second biased electrode are configured to form solder connections in a first plane, and a third biased electrode and a fourth biased electrode are configured to form solder connections in a second plane, perpendicular to the first plane.
Kato teaches an arc welding apparatus as disclosed in claims 1, 13, and 22. Kato does not teach that the device contains a plurality of biased electrodes, wherein a first biased electrode and a second biased electrode are configured to form solder connections in a first plane, and a third biased electrode and a fourth biased electrode are configured to form solder connections in a second plane, perpendicular to the first plane.
Blankenship teaches a biased electrode having a tip spaced apart from the workpiece and includes a plurality of biased electrodes that solder a workpiece in different planes. Blankenship does not teach that the plurality of biased electrodes, includes a first biased electrode and a second biased electrode configured to form solder connections in a first plane, and a third biased electrode and a fourth biased electrode are configured to form solder connections in a second plane, perpendicular to the first plane.
Though the combination of these references would create a functioning device, neither of the cited prior art contains a plurality of biased electrodes configured to form solder connections as disclosed by the Applicants limitations of claim 1, 13, and 22.
Therefore, claims 2-10 and 12 are allowable at least because they depend from allowed claim 1. And claims 14-21 are allowable at least because they depend from allowed claim 13.
Any comments considered necessary by applicant must be submitted no later than the payment of the issue fee and, to avoid processing delays, should preferably accompany the issue fee.  Such submissions should be clearly labeled “Comments on Statement of Reasons for Allowance.”
Conclusion

APPLICANT REBUTTAL: REMARKS
The above-referenced patent application has been reviewed in light of the non-final office action dated November 25, 2024. Claims 1-10 and 12-22 are pending in the application. Claim 11 was cancelled. Claims 1, 13, and 22 were amended. The amendments are based at least on the originally filed claims and on Fig.2 and paragraph [0017] of the published application. No new matter is added.
Applicant believes that the present application is in condition for allowance in view of the amendments above and for at least the reasons outlined below; thus, a prompt and favorable action is respectfully requested.
Claim Rejections under 35 U.S.C. § 103
Claims 1, 3, 5-7, 9, 10, 13-15, 17, 18, 21, and 22 were rejected under 35 U.S.C. 103 as allegedly being unpatentable over Teshima, U.S. Patent No. 6280858 ("Teshima") in view of Kato et al., U.S. Patent Publication No. 2006/0069466 ("Kato") and Azzalina ("The Importance of Grounding While Welding") ("Azzalina") and further in view of Blankenship et al., U.S. Patent Publication No. 2005/0133488 ("Blankenship"). Claims 2, 19, and 20 were rejected under 35 U.S.C. 103 as allegedly being unpatentable over Teshima in view of Kato, Azzalina, and Blankenship and further in view of Ho et al., U.S. Patent Publication No. 2020/0350285 ("Ho"). Claim 4 was rejected under 35 U.S.C. 103 as allegedly being unpatentable over Teshima in view of Kato, Azzalina, and Blankenship and further in view of Shimizu et al., U.S. Patent Publication No. 2019/0335119 ("Shimizu"). Claims 8 and 16 were rejected under 35 U.S.C. 103 as allegedly being unpatentable over Teshima in view of Kato, Azzalina, and Blankenship and further in view of Matsuura et al., U.S. Patent Publication No. 2021/0111136 ("Matsuura"). Claim 12 was rejected under 35 U.S.C. 103 as allegedly being unpatentable over Teshima in view of Kato, Azzalina, and Blankenship and further in view of Bayot, U.S. Patent Publication No. 2005/0133573 ("Bayot"). Applicant respectfully traverses.
Claim 1 was amended to recite "a first biased electrode and a second biased electrode are configured to form solder connections in a first plane and a third biased electrode and a fourth biased electrode are configured to form solder connections in a second plane, perpendicular to the first plane." The office action on page 3 indicates that Blankenship discloses in paragraph [0023]
that the electrodes 12, 14, 16, and 18 move along the designated x-direction at a common speed to form weld joints in one plane, which is shown in Fig. 2 of Blankenship reproduced below, where the electrodes 12, 14, 16, and 18 form weld joints in the plane along the x-direction. The office action also indicates that paragraph [0026] of Blankenship discloses that the electrodes 12, 14, 16, and 18 have a z-direction (length A). However, there is no disclosure in Blankenship that two electrodes form solder connections in a first plane and two other electrodes form solder connections in a second plane that is perpendicular to the first plane. No matter which electrodes of Blankenship are considered as the first, second, third, and fourth electrode, no combination could result in forming solder connections in two perpendicular planes. Thus, Blankenship fails to disclose or suggest the above-referenced features of claim 1 as amended.
FOG. 2
Teshima, Kato, and Azzalina do not remedy the deficiency of Blankenship. At least because the cited references (Teshima, Kato, Azzalina, and Blankenship) fail to disclose all the features of claim 1 either alone or in combination, claim 1 as amended is patentable. Allowance of claim 1 is respectfully requested.
Claims 13 and 22 include similar features and are therefore patentable for at least the same reasons as outlined above.
Claims 3, 5-7, 9, 10, 14, 15, 17, 18, and 21 depend from claims 1 and 13 and are therefore patentable for at least the same reasons as outlined above.
Claims 2, 19, and 20 were rejected under 35 U.S.C. 103 as allegedly being unpatentable over Teshima in view of Kato, Azzalina, and Blankenship and further in view of Ho. Ho is cited to disclose solder balls and pillars, so Ho does not remedy the deficiency of Blankenship. Thus,
claims 1 and 13 are patentable over Teshima, Kato, Azzalina, Blankenship, and Ho. Claims 2, 19, and 20 depend from claims 1 and 13 and are therefore patentable for at least the same reasons as outlined above.
Claim 4 was rejected under 35 U.S.C. 103 as allegedly being unpatentable over Teshima in view of Kato, Azzalina, and Blankenship and further in view of Shimizu. Shimizu is cited to disclose flux washing, so Shimizu does not remedy the deficiency of Blankenship. Thus, claim 1 is patentable over Teshima, Kato, Azzalina, Blankenship, and Shimizu. Claim 4 depends from claim 1 and is therefore patentable for at least the same reasons as outlined above.
Claims 8 and 16 were rejected under 35 U.S.C. 103 as allegedly being unpatentable over Teshima in view of Kato, Azzalina, and Blankenship and further in view of Matsuura. Matsuura is cited to disclose positioning bond pads along the periphery of the die, so Matsuura does not remedy the deficiency of Blankenship. Thus, claims 1 and 13 are patentable over Teshima, Kato, Azzalina, Blankenship, and Matsuura. Claims 8 and 16 depend from claims 1 and 13 and are therefore patentable for at least the same reasons as outlined above.
Claim 12 was rejected under 35 U.S.C. 103 as allegedly being unpatentable over Teshima in view of Kato, Azzalina, and Blankenship and further in view of Bayot. Bayot is cited to disclose solder flux, so Bayot does not remedy the deficiency of Blankenship. Thus, claim 1 is patentable over Teshima, Kato, Azzalina, Blankenship, and Bayot. Claim 12 depends from claim 1 and is therefore patentable for at least the same reasons as outlined above.
CONCLUSION


CITED REFERENCE SUMMARIES: Ref US9385098A1: [content unavailable]
Ref US20060069466: Claims:
1. A method for controlling a trajectory of a robot when a plurality of robots are operated by cooperative control, the plurality of robots including a leading robot having a work tool and at least one tracking robot holding a workpiece to be processed by the work tool, the method comprising: 
controlling the position and the orientation of the tracking robot corresponding to the change of the position and the orientation of the leading robot such that the position and the orientation of a first tool coordinate system set on the leading robot moves along a desired trajectory on a second tool coordinate system set on the tracking robot.
2. The method as set forth in claim 1, comprising: 
preparing a plurality of teaching points by teaching an operating position of each of the leading robot and the tracking robot;  calculating the interpolative position and the interpolative orientation of the first tool coordinate system of the leading robot by interpolating the position and the orientation of the first coordinate system at the teaching points of the leading robot at every interpolative time during a playback operation;  determining the relative position and the relative orientation of the first tool coordinate system of the leading robot to the second tool coordinate system of the tracking robot at every interpolative time by interpolating the relative position and the relative orientation of the first tool coordinate system at the teaching point;  calculating the interpolative position and the interpolative orientation of the second tool coordinate system of the tracking robot based on the interpolative position and the interpolative orientation of the first tool coordinate system of the leading robot and the relative position and the relative orientation of the first tool coordinate system of the leading robot at every interpolative time; and  controlling each joint of the leading robot and the tracking robot such that the positions and the orientations of the first and second coordinate systems are maintained.
3. The method as set forth in claim 1, comprising controlling the position and the orientation of the tracking robot such that the relative position and the relative orientation of the tracking robot, to the leading robot, are maintained when the position and the orientation of the leading robot is changed by manual feeding.
4. The method as set forth in claim 1, comprising manually feeding the tracking robot such that the second tool coordinate system is desirably translated and rotated on the first tool coordinate system.
5. The method as set forth in claim 1, comprising cooperatively operating a plurality of tracking robots relative to the motion of one leading robot.
6. The method as set forth in claim 1, comprising cooperatively controlling all of the leading robot and the tracking robot by using one control device.
7. The method as set forth in claim 1, comprising cooperatively controlling the leading robot and the tracking robot by using a plurality of control devices and by communicating between each of the control devices.
8. The method as set forth in claim 1, comprising: 
filtering a time-series of data representing the interpolative position and the interpolative orientation of the first tool cooperative system of the leading robot;  calculating the interpolative position and the interpolative orientation of the second tool coordinate system of the tracking robot based on the time-series of data before the filtering and the relative position and the relative orientation of the first coordinate system at every interpolative time; and  filtering a time-series of data representing the interpolative position and the interpolative orientation of the second tool coordinate system of the tracking robot after calculating the interpolative position and the interpolative orientation of the second tool coordinate system.
9. The method as set forth in claim 1, comprising: 
filtering a time-series of data representing the interpolative position and the interpolative orientation of the first tool cooperative system of the leading robot;  filtering a time-series of data representing the relative position and the relative orientation of the first tool coordinate system of the leading robot at every interpolative time; and  calculating the interpolative position and the interpolative orientation of the second tool coordinate system of the tracking robot based on the interpolative position and the interpolative orientation and the relative position and the relative orientation of the first tool coordinate system of the leading robot after the filtering.
Ref US20050133488: Claims:
1. A method for monitoring a tandem welding process employing a plurality of tandem electrodes, the method comprising: 
measuring a welding parameter for each tandem electrode;  shifting the measured welding parameters to a reference; and  combining the measured and shifted welding parameters of the tandem electrodes at the reference.
2. The method as set forth in claim 1, wherein the shifting comprises: 
shifting a position coordinate of the measured welding parameter of each tandem electrode by a distance of the electrode from a reference position.
3. The method as set forth in claim 1, wherein the shifting comprises: 
shifting a position coordinate of the measured welding parameter of each tandem electrode by a distance of the electrode from a reference electrode.
4. The method as set forth in claim 1, wherein the shifting comprises: 
shifting a time coordinate of the measured welding parameter of each tandem electrode by a travel time during which the electrode travels to the reference position.
5. The method as set forth in claim 4, wherein the shifting of the time coordinate by a travel time comprises: 
determining the travel time based on a travel speed of the plurality of tandem electrodes and a position of the electrode relative to a lead electrode of the plurality of tandem electrodes, the lead electrode position defining the reference position.
6. The method as set forth in claim 1, wherein the measuring of a welding parameter for each tandem electrode comprises: 
computing at least one of a deposition rate welding parameter and a weld heat input welding parameter.
7. The method as set forth in claim 6, wherein the combining of the measured and shifted welding parameters comprises: 
summing the computed and shifted deposition rates of the tandem electrodes to produce a tandem electrodes deposition rate at the reference; and  summing the computed and shifted weld heat inputs of the tandem electrodes to produce a tandem electrodes weld heat input at the reference.
8. The method as set forth in claim 1, wherein the measuring of a welding parameter for each tandem electrode comprises: 
measuring a welding parameter as a function of time for each electrode.
9. The method as set forth in claim 8, wherein the measuring of a welding parameter as a function of time comprises: 
measuring the welding parameter at discrete times.
10. The method as set forth in claim 8, wherein the shifting comprises: 
transforming the welding parameter as a function of time to a welding parameter as a function of position based on a position of a lead electrode of the plurality of tandem electrodes, a distance of the electrode from the lead electrode, and a travel speed of the plurality of tandem electrodes.
11. The method as set forth in claim 10, wherein the combining of the measured and shifted welding parameters comprises: 
summing the welding parameters as a function of position to compute a welding parameter as a function of position for the plurality of tandem electrodes.
12. The method as set forth in claim 10, wherein the measuring of a welding parameter as a function of time for each electrode comprises: 
measuring at least one of a deposition rate and a heat input.
13. A tandem welding system comprising: 
a plurality of spaced apart electrodes arranged to travel at a common travel speed, the plurality of spaced apart electrodes cooperatively performing a weld;  a data storage medium storing measured data for each electrode during the performing of the weld; and  a processor performing a process comprising: 
for each electrode, recalling measured data corresponding to the electrode passing a reference position, and 
combining the recalled measured data of the plurality of spaced apart electrodes to compute a weld parameter of the tandem welding system at the reference position.
14. The tandem welding system as set forth in claim 13, wherein the electrodes are spaced apart linearly along a direction of travel, and the recalling of measured data corresponding to the electrode passing a reference position comprises: 
dividing a distance of the electrode from a reference electrode of the plurality of spaced apart electrodes by the common travel speed to determine a time shift between measured data of the reference electrode and measured data of the electrode.
15. The tandem welding system as set forth in claim 14, wherein the recalling of measured data corresponding to the electrode passing a reference position further comprises: 
determining a time at which the reference electrode passed the reference position by dividing a distance between the reference position and an initial position of the reference electrode by the common travel speed.
16. The tandem welding system as set forth in claim 14, wherein the recalling of measured data corresponding to the electrode passing a reference position further comprises: 
determining a time at which the reference electrode passed the reference position based on a travel position of the plurality of spaced apart electrodes arranged to travel at a common travel speed.
17. The tandem welding system as set forth in claim 13, further comprising: 
one or more voltage measuring devices measuring a voltage as a function of time associated with each of the plurality of spaced apart electrodes; and  one or more current measuring devices measuring a current as a function of time associated with each of the plurality of spaced apart electrodes;  wherein the measured data stored in the data storage medium for each electrode includes at least the measured voltage and the measured current.
18. The tandem welding system as set forth in claim 17, wherein the measured data further includes a weld heat input for each electrode computed from the measured voltage and current, the combining of the recalled measured data of the plurality of spaced apart electrodes to compute a weld parameter of the tandem welding system at the reference position comprising: 
summing the recalled weld heat input of each electrode to compute a tandem weld heat input parameter of the tandem welding system at the reference position.
19. The tandem welding system as set forth in claim 17, wherein the measured data further includes at least a weld heat input for each electrode, the weld heat input being computed based on at least the measured voltage and current.
20. The tandem welding system as set forth in claim 17, wherein the combining of the recalled measured data of the plurality of spaced apart electrodes to compute a weld parameter of the tandem welding system at the reference position comprises: 
computing a weld heat input for each electrode from at least the recalled measured voltage and current for the electrode; and  summing the weld heat input of the electrodes to compute a tandem weld heat input of the tandem welding system at the reference position.
21. The tandem welding system as set forth in claim 13, further comprising: 
one or more wire feed speed controllers determining a wire feed speed associated with each of the plurality of spaced apart electrodes;  wherein the measured data stored in the data storage medium for each electrode includes at least the determined wire feed speed.
22. The tandem welding system as set forth in claim 21, wherein the measured data further includes a deposition rate for each electrode computed from at least the measured wire feed speed of the electrode, and the combining of the recalled measured data of the plurality of spaced apart electrodes to compute a weld parameter of the tandem welding system at the reference position comprises: 
summing the recalled deposition rate of each electrode to compute a tandem deposition rate parameter of the tandem welding system at the reference position.
23. The tandem welding system as set forth in claim 21, wherein the measured data further includes at least a deposition rate as a function of time for each electrode, the deposition rate being computed based on at least the measured wire feed speed.
24. The tandem welding system as set forth in claim 21, wherein the combining of the recalled measured data of the plurality of spaced apart electrodes to compute a weld parameter of the tandem welding system at the reference position comprises: 
computing a deposition rate for each electrode from the measured wire feed speed of the electrode; and  summing the deposition rates of the electrodes to compute a tandem deposition rate of the tandem welding system at the reference position.
25. The tandem welding system as set forth in claim 13, wherein the processor performs the process for a plurality of different reference positions to produce the weld parameter of the tandem welding system as a function of position, and the tandem welding system further comprises: 
a graphical user display providing a first window showing at least the weld parameter of the tandem welding system as a function of position.
26. The tandem welding system as set forth in claim 25, wherein the graphical user display provides a second window showing at least the measured data for each electrode as a function of position.
27. The tandem welding system as set forth in claim 26, wherein the graphical user display further providing a selector operable by an associated user to select between displaying the first and second windows.
28. The tandem welding system as set forth in claim 26, wherein the graphical user display provides the first and second windows displayed simultaneously.
29. The tandem welding system as set forth in claim 25, wherein the first window includes at least one user-manipulated cursor indicating the weld parameter at a position of the cursor.
30. The tandem welding system as set forth in claim 25, wherein the first window further includes at least two user-manipulated cursors and indicates a difference between the weld parameter values at the positions of the two cursors.
31. The tandem welding system as set forth in claim 13, further comprising: 
a display showing at least the weld parameter of the tandem welding system at the reference position.
32. The tandem welding system as set forth in claim 13, wherein the spacing of nearest-neighboring electrodes is not the same for each pair of nearest-neighboring electrodes.
33. A tandem welding method comprising: 
performing a tandem welding process using a plurality of electrodes arranged at fixed relative positions to one another and cooperatively forming a weld;  measuring a welding parameter of each of the plurality of electrodes during the welding process;  determining welding parameter values for each electrode that correspond to the electrode welding at a selected position; and  computing a tandem welding parameter of the tandem welding process at the selected position based on the determined welding parameter values of the plurality of electrodes.
34. The tandem welding method as set forth in claim. 33, wherein the measuring of a welding parameter of each of the plurality of electrodes comprises: 
measuring at least one parameter associated with each electrode; and  computing the welding parameter value for each electrode based on the measured at least one parameter associated with that electrode.
35. The tandem welding method as set forth in claim 33, wherein the measuring of a welding parameter of each of the plurality of electrodes comprises: 
measuring at least a voltage, a current, and a wire feed speed associated with each electrode; and  computing at least a deposition rate welding parameter value and a weld heat input welding parameter value for each electrode based on the measured at least one parameter associated with that electrode.
36. The tandem welding method as set forth in claim 35, wherein the computing of a tandem welding parameter of the tandem welding process at the selected position based on the determined welding parameter values of the plurality of electrodes comprises: 
summing the deposition rate welding parameter values of the plurality of electrodes to compute a deposition rate tandem welding parameter; and  summing the weld heat input welding parameter values of the plurality of electrodes to compute a weld heat input tandem welding parameter.
37. The tandem welding method as set forth in claim 33, wherein: 
the measured welding parameter of each of the plurality of electrodes includes at least a voltage parameter, a current parameter, and a wire feed speed parameter; and  the tandem welding parameter includes at least a deposition rate and a weld heat input.
38. The tandem welding method as set forth in claim 37, wherein the computing of a tandem welding parameter of the tandem welding process at the selected position based on the determined welding parameter values of the plurality of electrodes comprises: 
computing deposition rate and weld heat input values for each electrode based on the determined voltage, current, and wire feed speed parameters of that electrode;  summing the deposition rate values of the plurality of electrodes to compute a deposition rate tandem welding parameter; and  summing the weld heat input values of the plurality of electrodes to compute a weld heat input tandem welding parameter.
Ref US6280858: Claims:
1. A substrate for mounting an electronic part, comprising:
an electrically conductive bonding member provided on a substrate; and
a bonding portion which is formed of a solder alloy on the electrically conductive bonding member, in which the solder alloy comprises a zinc component and a tin component and has a first layer at the interface of the electrically conductive bonding member and the bonding portion, and the content of the zinc component of the first layer is concentrated to approximately 70% by weight or more, wherein the content of an oxygen component of the solder alloy is 100 ppm or less.
2. The substrate according to claim 1, wherein the first layer has a thickness of approximately 1 μm.
3. The substrate according to claim 1, wherein the content of the zinc component of the first layer is 95% by weight or more.
4. The substrate according to claim 1, wherein the solder alloy has a second layer being adjacent to the first layer, and the content of the zinc component of the second layer is 5.8 to 11.7% by weight.
5. The substrate according to claim 1, wherein said zinc component is present from about 3% to about 12% of the solder composition.
6. The substrate according to claim 1, wherein the content of the zinc layer of the first layer is 88% by weight or more.
7. The substrate according to claim 1, wherein the electrically conductive bonding member has a surface comprising a metal selected from the group consisting of copper, silver, nickel, gold, palladium, platinum and iridium.
8. The substrate according to claim 1, wherein the electrically conductive bonding member comprises a plurality of bumps or leads provided in a high density mounting with an interval of 1 mm or less.
9. The substrate according to claim 1, wherein the bonding portion bonds to the electrically conductive bonding member at a bonding strength of 3.5 kgf/mm2 or more.
10. The substrate according to claim 1, wherein the bonding portion bonds to the electrically conductive bonding member at a bonding strength of 5 kgf
[Truncated to input limit]