Office Action 2: Final Rejection (2024-07-22)
Rejection types: 103 - Obviousness

CLAIMS:
Listing of Claims:
 Amendments to the Claims:

This listing of claims will replace all prior versions, and listings, of claims in the application:

1\. (Currently Amended) A method, comprising:
heating a material including silver particles within an ultra-violet (UV) curable resin to obtain the UV curable resin on sintered silver particles,wherein the silver particles are un-sintered prior to the heating, and
wherein at least a portion of the material is positioned between a chip and a submount; and
irradiating, with UV light, the UV curable resin to obtain a polymer on the sintered silver particles.
2\. (Original) The method of claim 1, wherein heating the material comprises sintering the silver particles within the UV curable resin, and
wherein sintering the silver particles within the UV curable resin pushes the UV curable resin toward an exterior surface of the material to obtain the UV curable resin on the sintered silver particles.
3\. (Original) The method of claim 1, wherein irradiating the UV curable resin comprises at least one of irradiating the UV curable resin for a continuous exposure period or irradiating the UV curable resin with pulses of the UV light.


4\. (Original) The method of claim 1, further comprising:
applying the material to at least one of the submount or the chip; and
positioning the chip on the submount.

5\. (Original) The method of claim 1, further comprising:
before irradiating the UV curable resin, cooling the UV curable resin on the sintered silver particles.

6\. (Original) The method of claim 1, wherein the sintered silver particles are sintered within the UV curable resin.

7\. (Canceled Herein)

8\. (Original) The method of claim 1, wherein a portion of the polymer forms a layer on an exterior surface of the sintered silver particles.

9\. (Original) The method of claim 8, wherein the layer is between 0.1 and 10 microns thick.

10\. (Original) The method of claim 8, wherein the layer is connected to a portion of one or more side surfaces of the chip and a top surface of the submount.

11\. (Currently Amended) A method, comprising:

the material including un-sintered silver particles and an ultra-violet (UV) curable resin;
heating the material to sinter the un-sintered silver particles within the UV curable resin to produce sintered silver particles; and
irradiating, with UV light, the UV curable resin to produce a polymer on the sintered silver particles.

12\. (Original) The method of claim 11, wherein irradiating the UV curable resin comprises at least one of irradiating the UV curable resin for a continuous exposure period or irradiating the UV curable resin with pulses of the UV light.

13\. (Original) The method of claim 11, further comprising:
before irradiating the UV curable resin, cooling the UV curable resin on the sintered silver particles.

14\. (Original) The method of claim 11, wherein the sintered silver particles have a density of 10.49 grams/centimeter3, and
wherein the UV curable resin has a density of 1.00 grams/centimeter3.

15\. (Original) The method of claim 11, wherein the sintered silver particles are formed from at least one of microparticles or nanoparticles.


16\. (Original) The method of claim 11, wherein the UV curable resin comprises at least one of an epoxy-based resin, an acrylate-based resin, or a silicone-based resin.

17\. (Currently Amended) The method of claim 11, wherein a ratio, by weight, of the UV curable resin to \[\[the\]\] silver particles is between 0.05 and 1, and
the ratio is selected such that, when cured, a layer of the polymer on the sintered silver particles has a thickness in a range from 0.1 microns to 10 microns.

18\. (Currently Amended) The method of claim 11, wherein sintering the un-sintered silver particles within the UV curable resin pushes the UV curable resin toward an exterior surface of the material to produce a layer of the UV curable resin on the sintered silver particles.

19\. (Original) The method of claim 18, wherein the layer is between 0.1 and 10 microns thick.

20\. (Original) The method of claim 18, wherein the layer is connected to a portion of one or more side surfaces of the chip and a top surface of the submount.

21\. (New) A method, comprising:
heating a material including silver particles within an ultra-violet (UV) curable resin to obtain the UV curable resin on sintered silver particles,wherein at least a portion of the material is positioned between a chip and a submount;
 the UV curable resin on the sintered silver particles; and
irradiating, with UV light and after the cooling, the UV curable resin to obtain a polymer on the sintered silver particles.

OFFICE ACTION:
DETAILED ACTION
Notice of Pre-AIA  or AIA  Status
1.	The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Response to Arguments
2.       The following rejections are incorporated from the office action sent on 03/12/2024, and are republished here for convenience.
Claim Rejections - 35 USC § 103
3.	The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action:
A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made.
The factual inquiries for establishing a background for determining obviousness under 35 U.S.C. 103 are summarized as follows:
1. Determining the scope and contents of the prior art.
2. Ascertaining the differences between the prior art and the claims at issue.
3. Resolving the level of ordinary skill in the pertinent art.
4. Considering objective evidence present in the application indicating obviousness or non-obviousness.
4. 	Claims 1-6, 8-21, are rejected under 35 U.S.C. 103 as being un-patentable over Kajiwara et al., US 2011/0290863 A1, in view of Brodd et al., (US 2017/0267899 A1).
Claims 1, 2, 6, 8, 10-11. Kajiwara et al., disclose a method (such as the steps in fig. 2), comprising:
-heating a material including silver particles (this limitation would read through [0059], wherein is disclosed the sintering Ag paste is heated to 400.degree. C. in a non-oxidizing atmosphere, and makes metal Ag precipitate from the solution of the organic silver complex in the sintering Ag paste and sediment on a plated Ni face to form a metallizing Ag film 7 on the face);
-wherein the silver particles are un-sintered prior to the heating (this limitation would read through [0061] wherein is disclosed (structure is formed, in which the sintered Ag layer in contact with a plated Ni film is a layer formed from Ag which has precipitated from the solution of the organic silver complex and has sedimented on the plated Ni film (sintered layer of organic silver complex +Ag particles), as by definition the term “un-sintered is defined as essentially an impregnated coating that is not fully fused during the process”.
-wherein at least a portion of the material is positioned between a chip (item 3) and a sub-mount (item 1).
Kajiwara appears to not explicitly disclose that the heating process is done “within an ultra-violet (UV) curable resin to obtain the UV curable resin on sintered silver particles, and irradiating, with UV light, the UV curable resin to obtain a polymer on the sintered silver particles”.
However, [0015] of Brodd et al., discloses that the cured resin layer can be formed from a curable (e.g., polymerizable) resin capable of being coated onto the conductive network and supporting substrate, followed by curing to form the cured resin layer. Desirable properties of the cured resin layer include the ability to form a self-supporting (e.g., free-standing) film, flexibility, conformability, stretchability (i.e., the film is elastomeric), adhesion to the conductive network and PSA layer, transparency, and a non-tacky surface after curing. Preferred polymerizable resins are photocurable resins, e.g., resins having photo-initiators and curable using visible or UV wavelengths. It would have been obvious to a person of ordinary skill in the art at the time the invention was made to recognize that combining Kajiwara’s process with Brodd's invention would have been beneficial because it gives the practitioner flexibility in using available ultra-violet (UV) technologies.
Claim 3. Kajiwara with Brodd et al., disclose the method of claim 1, wherein irradiating the UV curable resin comprises at least one of irradiating the UV curable resin for a continuous exposure period or irradiating the UV curable resin with pulses of the UV light. This limitation would read through [0018] of Brodd et al., wherein is disclosed that the curing of the curable resin layer preferably is done using a photocurable resin and visible or UV irradiation.
Claim 4. Kajiwara with Brodd et al., disclose the method of claim 1, further comprising: applying the material to at least one of the sub-mount (item 1) or the chip (item 3); and positioning the chip on the sub-mount, as seen in the structure of fig. 2, step 2 of Kajiwara.
Claim 5. Kajiwara with Brodd et al., disclose the method of claim 1, further comprising: before irradiating the UV curable resin, cooling the UV curable resin on the sintered silver particles. This limitation would read through [0064] of Kajiwara at the step of reducing atmosphere from 400.degree to 250.degree. C. for 1 hour.
Claim 12. Kajiwara with Brodd et al., disclose the method of claim 11, wherein irradiating the UV curable resin comprises at least one of irradiating the UV curable resin for a continuous exposure period or irradiating the UV curable resin with pulses of the UV light. This limitation would read through [0018] of Brodd et al., wherein is disclosed that the curing of the curable resin layer preferably is done using a photocurable resin and visible or UV irradiation.
Claim 13. Kajiwara with Brodd et al., disclose the method of claim 11, further comprising: before irradiating the UV curable resin, cooling the UV curable resin on the sintered silver particles, as seen in the structure of fig. 2, step 2 of Kajiwara.
Claim 15. Kajiwara with Brodd et al., disclose the method of claim 11, wherein the sintered silver particles are formed from at least one of microparticles or nanoparticles. This limitation would read through [0018] of Kajiwara et al., wherein is disclosed that the Ag nano-particle can be bonded to Cu and Ni with a certain degree of strength if a load is applied to the Ag nano-particle and adhesion is secured.
Claim 16. Kajiwara with Brodd et al., disclose the method of claim 11, wherein the UV curable resin comprises at least one of an epoxy-based resin, an acrylate-based resin, or a silicone-based resin. This limitation would read through [0018] of Kajiwara et al., wherein is disclosed that curing of the curable resin layer preferably is done using a photocurable resin and visible or UV irradiation.
Claim 18. Kajiwara with Brodd et al., disclose the method of claim 11, wherein sintering the un-sintered silver particles within the UV curable resin pushes the UV curable resin toward an exterior surface of the material to produce a layer of the UV curable resin on the sintered silver particles; (this limitation would read through [0061] wherein is disclosed (structure is formed, in which the sintered Ag layer in contact with a plated Ni film is a layer formed from Ag which has precipitated from the solution of the organic silver complex and has sedimented on the plated Ni film (sintered layer of organic silver complex +Ag particles), as by definition the term “un-sintered is defined as essentially an impregnated coating that is not fully fused during the process”.
Claim 20. Kajiwara with Brodd et al., disclose the method of claim 18, wherein the layer is connected to a portion of one or more side surfaces of the chip and a top surface of the sub-mount (as seen in the structure of fig. 2).
Claims 9, 14, 17 and 19. Kajiwara et al., disclose the device of claims 8 and 15, above.
Kajiwara appears to not explicitly disclose “wherein the layer is between 0.1 and 10 microns thick”, as in claim 9; “wherein the sintered silver particles have a density of 10.49 grams/centimeter, and wherein the UV curable resin has a density of 1.00 grams/centimeter”, as in claim 14; “wherein a ratio, by weight, of the UV curable resin to the silver particles is between 0.05 and 1, and the ratio is selected such that, when cured, a layer of the polymer on the sintered silver particles has a thickness in a range from 0.1 microns to 10 microns”, as in claim 17; “wherein the layer is between 0.1 and 10 microns thick”, as in claim 19.
However, [0021] of Brodd et al., discloses that a pressure sensitive adhesive (3M Double Coated Tape 9019 available from 3M, St. Paul, Minn.) was next laminated to the UV resin coating using a GHQ-320 PR3 laminator at 300 mm/min., leaving the release liner attached on the exposed adhesive side of the PSA. The UV resin layer was cured in a Fusion UV curing system (Fusion UV Systems, Gaithersburg, Md.), H bulb, at 6 feet/minute, power approximately 0.207 J/cm2.
To manufacture conductive adhesive tapes for the use in packaging integrated circuit products, such as microprocessors, storage circuits, three-dimensional (3D) chips, it would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains to form the adhesive with material wherein silver particles have a density of 10.49 grams/centimeter, and wherein the UV curable resin has a density of 1.00 grams/centimeter, and wherein a ratio, by weight, of the UV curable resin to the silver particles is in a range from 0.05 to 1.
Claim 21. Kajiwara discloses a method (such as the steps in fig. 2), comprising:
-heating a material including silver particles within an ultra-violet (UV) curable resin to obtain the UV curable resin on sintered silver particles, (this limitation would read through [0059], wherein is disclosed the sintering Ag paste is heated to 400.degree. C. in a non-oxidizing atmosphere, and makes metal Ag precipitate from the solution of the organic silver complex in the sintering Ag paste and sediment on a plated Ni face to form a metallizing Ag film 7 on the face);
-wherein at least a portion of the material is positioned between a chip (item 3) and a sub-mount (item 1);
-cooling the UV curable resin on the sintered silver particles, this limitation would read through [0064] of Kajiwara at the step of reducing atmosphere from 400.degree to 250.degree. C. for 1 hour.
Kajiwara appears to not explicitly disclose that the heating process is done “within an ultra-violet (UV) curable resin to obtain the UV curable resin on sintered silver particles, and irradiating, with UV light, the UV curable resin to obtain a polymer on the sintered silver particles”.
However, [0015] of Brodd et al., discloses that the cured resin layer can be formed from a curable (e.g., polymerizable) resin capable of being coated onto the conductive network and supporting substrate, followed by curing to form the cured resin layer. Desirable properties of the cured resin layer include the ability to form a self-supporting (e.g., free-standing) film, flexibility, conformability, stretchability (i.e., the film is elastomeric), adhesion to the conductive network and PSA layer, transparency, and a non-tacky surface after curing. Preferred polymerizable resins are photocurable resins, e.g., resins having photo-initiators and curable using visible or UV wavelengths. It would have been obvious to a person of ordinary skill in the art at the time the invention was made to recognize that combining Kajiwara’s process with Brodd's invention would have been beneficial because it gives the practitioner flexibility in using available ultra-violet (UV) technologies.
Response to Arguments
5.      Applicant's arguments filed 06/11/2024 based on allowable subject matter of claims 5 and 13, during the interview on May 28, 1024 with the Examiner, have been fully considered but they are not persuasive.
However, after a careful review of the claim, it is noted that the limitation of claim 5 “before irradiating the UV curable resin, cooling the UV curable resin on the sintered silver particles”. This limitation could read through [0064] of Kajiwara at the step of reducing atmosphere from 400.degree to 250.degree. C. for 1 hour. This step would also consider as a cooling step from a higher temperature to a lower temperature.
Regarding claim 8, that recites “a portion of the polymer forms a layer on an exterior surface of the sintered silver particles”. This limitation could read through [0086] of Kajiwara, wherein is disclosed that a thermosetting type of a liquid resin is applied to one or two sides of a fillet on a part jointed by sintered Ag, and is heated to and kept at a temperature of 40 to 80 degree. C., and the liquid resin having lowered viscosity is impregnated into a porous sintered Ag layer by a capillary phenomenon. After that, the liquid resin is heated to a temperature of 180 to 230.degree. C. and is cured or semi-cured (step S308). As noted, by definition that “resin is a type of polymer”. Thus, Examiner believes that the combination of Kajiwara with Brodd et al., disclose the present invention.
Conclusion
THIS ACTION IS MADE FINAL.  Applicant is reminded of the extension of time policy as set forth in 37 CFR 1.136(a).
A shortened statutory period for reply to this final action is set to expire THREE MONTHS from the mailing date of this action.  In the event a first reply is filed within TWO MONTHS of the mailing date of this final action and the advisory action is not mailed until after the end of the THREE-MONTH shortened statutory period, then the shortened statutory period will expire on the date the advisory action is mailed, and any extension fee pursuant to 37 CFR 1.136(a) will be calculated from the mailing date of the advisory action.  In no event, however, will the statutory period for reply expire later than SIX MONTHS from the mailing date of this final action.

APPLICANT REBUTTAL: PATENT
REMARKS
Applicant addresses below the issues raised by the Office Action.
Statement Re
gar
din
g
Substance o
f
I
nte
r
view
Applicant submits that an interview occurred on May 28, 2024 with Applicant's
representative, Matthew Allen, and Examiner Jean Baptiste. Applicant appreciates the courtesies extended during the interview. During the interview, Applicant's representative discussed the claims, the rejection, the allowable subject matter, and proposed claim amendments. The Examiner agreed that the proposed amendments, substantially included in this response, should lead to allowance. The Examiner is also invited to call Applicant's representative to resolve any remaining issues if the Examiner believes the application is not in condition for allowance.
Allowable Sub
j
ect Matte
r
Applicant notes, with appreciation, the Examiner's indication that claims 5, 7, and 13 contain allowable subject matter.
Rej
ection under 35 U
.
S.C.
$
103 based on
KA
JIWARA and BRODD
Claims 1-4, 6, 8-12, and 14-20 stand rejected under 35 U.S.C. § 103 as allegedly being unpatentable over KAJIWARA and BRODD.
Claim 1 is being amended to incorporate the allowable subject matter of claim 7. For at least this reason, and the reasons presented in the interview and without acquiescing in the Examiner's rejection, the cited sections of the applied references, whether taken alone or in any reasonable combination, do not disclose at least "wherein the silver particles are un-sintered prior
PATENT
to the heating," as recited in claim 1, as amended. Independent claim 11, as amended, also recites features similar to the allowable subject matter of claim 7. Therefore, independent claims 1 and 11, and the claims that depend thereon, are patentable over the cited sections of the applied references, whether taken alone or in any reasonable combination.
Accordingly, Applicant respectfully requests that the Examiner reconsider and withdraw the rejection of claims 1-4, 6, 8-12, and 14-20 under 35 U.S.C. § 103 based on KAJIWARA and BRODD.
New Claim
New claim 21 recites the features of previously pending claim 1 and the allowable subject matter of claim 5. Therefore, new claim 21 is patentable for at least the inclusion of the allowable subject matter of claim 5.
Conclusion

NEXT OFFICE ACTION: DETAILED ACTION
Notice of Pre-AIA  or AIA  Status
1.	The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Continued Examination Un-der 37 CFR 1.114
2.          A request for continued examination under 37 CFR 1.114, including the fee set forth in 37 CFR 1.17(e), was filed in this application after final rejection. Since this application is eligible for continued examination under 37 CFR 1.114, and the fee set forth in 37 CFR 1.17(e) has been timely paid, the finality of the previous Office action has been withdrawn pursuant to 37 CFR 1.114. Applicant's submission filed on 09/20/2024 has been entered.
Claim Rejections - 35 USC § 112
3.	The following is a quotation of the first paragraph of 35 U.S.C. 112(a):
(a) IN GENERAL. The specification shall contain a written description of the invention, and of the manner and process of making and using it, in such full, clear, concise, and exact terms as to enable any person skilled in the art to which it pertains, or with which it is most nearly connected, to make and use the same, and shall set forth the best mode contemplated by the inventor or joint inventor of carrying out the invention.
The following is a quotation of the first paragraph of pre-AIA  35 U.S.C. 112:
The specification shall contain a written description of the invention, and of the manner and process of making and using it, in such full, clear, concise, and exact terms as to enable any person skilled in the art to which it pertains, or with which it is most nearly connected, to make and use the same, and shall set forth the best mode contemplated by the inventor of carrying out his invention.
4.       Claims 1-6, 8-21 are rejected under 35 U.S.C. 112(a) or 35 U.S.C. 112 (pre-AIA ), first paragraph, as failing to comply with the written description requirement.  The claim(s) contains subject matter which was not described in the specification in such a way as to reasonably convey to one skilled in the relevant art that the inventor or a joint inventor, or for pre-AIA  the inventor(s), at the time the application was filed, had possession of the claimed invention. For example, claims 1, 11, 21 recite “heating the material to sinter the un-sintered silver particles within the UV curable resin to produce sintered silver particles without curing the UV curable resin”. The specification does not enable any person skilled in the art to which it pertains, or with which it is most nearly connected, to practice the invention commensurate in scope with these claims. Specifically, “sintered silver particles without curing the UV curable resin”. As such, the applicant's specification does not disclose enough to enable one of ordinary skill in the art to determine the substantially level between within the UV curable resin and without curing the UV curable resin.
5.	The following is a quotation of 35 U.S.C. 112(b):
(b)  CONCLUSION. The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention.
The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph:
The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention.
6.       Claims 1-6, 8-21 are rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor, or for pre-AIA  the applicant regards as the invention.
For example, claims 1, 11, 21 recite “heating the material to sinter the un-sintered silver particles within the UV curable resin to produce sintered silver particles without curing the UV curable resin”. It is not clear how the step of heating the material would perform within the UV curable resin and without curing the UV curable resin at the same time.
For the purposes of examination, Examiner will treat the UV curable resins as materials that are polymerized and cured using ultraviolet irradiation devices.
Claim Rejections - 35 USC § 103
7.	The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action:
A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made.
The factual inquiries for establishing a background for determining obviousness under 35 U.S.C. 103 are summarized as follows:
1. Determining the scope and contents of the prior art.
2. Ascertaining the differences between the prior art and the claims at issue.
3. Resolving the level of ordinary skill in the pertinent art.
4. Considering objective evidence present in the application indicating obviousness or non-obviousness.
8. 	Claims 1-6, 8-21, are rejected under 35 U.S.C. 103 as being un-patentable over Kajiwara et al., US 2011/0290863 A1, in view of Brodd et al., (US 2017/0267899 A1), further in view of Gregory US 6,245,827 B1.
Claims 1, 2, 6, 8, 10-11. Kajiwara et al., disclose a method (such as the steps in fig. 2), comprising:
-heating a material including silver particles (this limitation would read through [0059], wherein is disclosed the sintering Ag paste is heated to 400.degree. C. in a non-oxidizing atmosphere, and makes metal Ag precipitate from the solution of the organic silver complex in the sintering Ag paste and sediment on a plated Ni face to form a metallizing Ag film 7 on the face);
-wherein the silver particles are un-sintered prior to the heating (this limitation would read through [0061] wherein is disclosed (structure is formed, in which the sintered Ag layer in contact with a plated Ni film is a layer formed from Ag which has precipitated from the solution of the organic silver complex and has sedimented on the plated Ni film (sintered layer of organic silver complex +Ag particles), as by definition the term “un-sintered is defined as essentially an impregnated coating that is not fully fused during the process”.
-wherein at least a portion of the material is positioned between a chip (item 3) and a sub-mount (item 1).
Kajiwara appears to not explicitly disclose that the heating process is done “within an ultra-violet (UV) curable resin to obtain the UV curable resin on sintered silver particles, and irradiating, with UV light, the UV curable resin to obtain a polymer on the sintered silver particles”.
However, [0015] of Brodd et al., discloses that the cured resin layer can be formed from a curable (e.g., polymerizable) resin capable of being coated onto the conductive network and supporting substrate, followed by curing to form the cured resin layer. Desirable properties of the cured resin layer include the ability to form a self-supporting (e.g., free-standing) film, flexibility, conformability, stretchability (i.e., the film is elastomeric), adhesion to the conductive network and PSA layer, transparency, and a non-tacky surface after curing. Preferred polymerizable resins are photocurable resins, e.g., resins having photo-initiators and curable using visible or UV wavelengths. It would have been obvious to a person of ordinary skill in the art at the time the invention was made to recognize that combining Kajiwara’s process with Brodd's invention would have been beneficial because it gives the practitioner flexibility in using available ultra-violet (UV) technologies.
With respect to the limitation “without curing the UV curable resin and irradiating, with UV light, the UV curable resin to cure the UV curable resin”. It is noted that col. 1, ln 42, step c) of Gregory indicates a complete cure throughout the entire volume of the resin composition upon application of ultraviolet light and without the necessity of on-site heating. Further, col. 2, ln 62+, of Gregory indicates the composition cures by exposure to ultraviolet radiation throughout its entire volume without the need for any other outside stimuli. It would have been obvious to a person of ordinary skill in the art at the time the invention was made to recognize that combining Kajiwara/Bodd’s process with Gregory's invention would have been beneficial because when using UV curable resin on sintered silver particles without curing the resin, the primary advantage is the ability to precisely manipulate and position the silver particles within the uncured resin due to its liquid state, allowing for fine control over the final structure and desired properties of the composite material, while still benefiting from the potential for rapid curing once UV light is applied when needed; this is particularly valuable for applications requiring intricate patterns or precise particle distribution.
Claim 3. Kajiwara with Brodd et al., disclose the method of claim 1, wherein irradiating the UV curable resin comprises at least one of irradiating the UV curable resin for a continuous exposure period or irradiating the UV curable resin with pulses of the UV light. This limitation would read through [0018] of Brodd et al., wherein is disclosed that the curing of the curable resin layer preferably is done using a photocurable resin and visible or UV irradiation.
Claim 4. Kajiwara with Brodd et al., disclose the method of claim 1, further comprising: applying the material to at least one of the sub-mount (item 1) or the chip (item 3); and positioning the chip on the sub-mount, as seen in the structure of fig. 2, step 2 of Kajiwara.
Claim 5. Kajiwara with Brodd et al., disclose the method of claim 1, further comprising: before irradiating the UV curable resin, cooling the UV curable resin on the sintered silver particles. This limitation would read through [0064] of Kajiwara at the step of reducing atmosphere from 400.degree to 250.degree. C. for 1 hour.
Claim 12. Kajiwara with Brodd et al., disclose the method of claim 11, wherein irradiating the UV curable resin comprises at least one of irradiating the UV curable resin for a continuous exposure period or irradiating the UV curable resin with pulses of the UV light. This limitation would read through [0018] of Brodd et al., wherein is disclosed that the curing of the curable resin layer preferably is done using a photocurable resin and visible or UV irradiation.
Claim 13. Kajiwara with Brodd et al., disclose the method of claim 11, further comprising: before irradiating the UV curable resin, cooling the UV curable resin on the sintered silver particles, as seen in the structure of fig. 2, step 2 of Kajiwara.
Claim 15. Kajiwara with Brodd et al., disclose the method of claim 11, wherein the sintered silver particles are formed from at least one of microparticles or nanoparticles. This limitation would read through [0018] of Kajiwara et al., wherein is disclosed that the Ag nano-particle can be bonded to Cu and Ni with a certain degree of strength if a load is applied to the Ag nano-particle and adhesion is secured.
Claim 16. Kajiwara with Brodd et al., disclose the method of claim 11, wherein the UV curable resin comprises at least one of an epoxy-based resin, an acrylate-based resin, or a silicone-based resin. This limitation would read through [0018] of Kajiwara et al., wherein is disclosed that curing of the curable resin layer preferably is done using a photocurable resin and visible or UV irradiation.
Claim 18. Kajiwara with Brodd et al., disclose the method of claim 11, wherein sintering the un-sintered silver particles within the UV curable resin pushes the UV curable resin toward an exterior surface of the material to produce a layer of the UV curable resin on the sintered silver particles; (this limitation would read through [0061] wherein is disclosed (structure is formed, in which the sintered Ag layer in contact with a plated Ni film is a layer formed from Ag which has precipitated from the solution of the organic silver complex and has sedimented on the plated Ni film (sintered layer of organic silver complex +Ag particles), as by definition the term “un-sintered is defined as essentially an impregnated coating that is not fully fused during the process”.
Claim 20. Kajiwara with Brodd et al., disclose the method of claim 18, wherein the layer is connected to a portion of one or more side surfaces of the chip and a top surface of the sub-mount (as seen in the structure of fig. 2).
Claims 9, 14, 17 and 19. Kajiwara et al., disclose the device of claims 8 and 15, above.
Kajiwara appears to not explicitly disclose “wherein the layer is between 0.1 and 10 microns thick”, as in claim 9; “wherein the sintered silver particles have a density of 10.49 grams/centimeter, and wherein the UV curable resin has a density of 1.00 grams/centimeter”, as in claim 14; “wherein a ratio, by weight, of the UV curable resin to the silver particles is between 0.05 and 1, and the ratio is selected such that, when cured, a layer of the polymer on the sintered silver particles has a thickness in a range from 0.1 microns to 10 microns”, as in claim 17; “wherein the layer is between 0.1 and 10 microns thick”, as in claim 19.
However, [0021] of Brodd et al., discloses that a pressure sensitive adhesive (3M Double Coated Tape 9019 available from 3M, St. Paul, Minn.) was next laminated to the UV resin coating using a GHQ-320 PR3 laminator at 300 mm/min., leaving the release liner attached on the exposed adhesive side of the PSA. The UV resin layer was cured in a Fusion UV curing system (Fusion UV Systems, Gaithersburg, Md.), H bulb, at 6 feet/minute, power approximately 0.207 J/cm2.
To manufacture conductive adhesive tapes for the use in packaging integrated circuit products, such as microprocessors, storage circuits, three-dimensional (3D) chips, it would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains to form the adhesive with material wherein silver particles have a density of 10.49 grams/centimeter, and wherein the UV curable resin has a density of 1.00 grams/centimeter, and wherein a ratio, by weight, of the UV curable resin to the silver particles is in a range from 0.05 to 1.
Claim 21. Kajiwara discloses a method (such as the steps in fig. 2), comprising:
-heating a material including silver particles within an ultra-violet (UV) curable resin to obtain the UV curable resin on sintered silver particles, (this limitation would read through [0059], wherein is disclosed the sintering Ag paste is heated to 400.degree. C. in a non-oxidizing atmosphere, and makes metal Ag precipitate from the solution of the organic silver complex in the sintering Ag paste and sediment on a plated Ni face to form a metallizing Ag film 7 on the face);
-wherein at least a portion of the material is positioned between a chip (item 3) and a sub-mount (item 1);
-cooling the UV curable resin on the sintered silver particles, this limitation would read through [0064] of Kajiwara at the step of reducing atmosphere from 400.degree to 250.degree. C. for 1 hour.
Kajiwara appears to not explicitly disclose that the heating process is done “within an ultra-violet (UV) curable resin to obtain the UV curable resin on sintered silver particles, and irradiating, with UV light, the UV curable resin to obtain a polymer on the sintered silver particles”.
However, [0015] of Brodd et al., discloses that the cured resin layer can be formed from a curable (e.g., polymerizable) resin capable of being coated onto the conductive network and supporting substrate, followed by curing to form the cured resin layer. Desirable properties of the cured resin layer include the ability to form a self-supporting (e.g., free-standing) film, flexibility, conformability, stretchability (i.e., the film is elastomeric), adhesion to the conductive network and PSA layer, transparency, and a non-tacky surface after curing. Preferred polymerizable resins are photocurable resins, e.g., resins having photo-initiators and curable using visible or UV wavelengths. It would have been obvious to a person of ordinary skill in the art at the time the invention was made to recognize that combining Kajiwara’s process with Brodd's invention would have been beneficial because it gives the practitioner flexibility in using available ultra-violet (UV) technologies.
With respect to the limitation “without curing the UV curable resin and irradiating, with UV light, the UV curable resin to cure the UV curable resin”. It is noted that col. 1, ln 42, step c) of Gregory indicates a complete cure throughout the entire volume of the resin composition upon application of ultraviolet light and without the necessity of on-site heating. Further, col. 2, ln 62+, of Gregory indicates the composition cures by exposure to ultraviolet radiation throughout its entire volume without the need for any other outside stimuli. It would have been obvious to a person of ordinary skill in the art at the time the invention was made to recognize that combining Kajiwara/Bodd’s process with Gregory's invention would have been beneficial because when using UV curable resin on sintered silver particles without curing the resin, the primary advantage is the ability to precisely manipulate and position the silver particles within the uncured resin due to its liquid state, allowing for fine control over the final structure and desired properties of the composite material, while still benefiting from the potential for rapid curing once UV light is applied when needed; this is particularly valuable for applications requiring intricate patterns or precise particle distribution.
Conclusion

CITED REFERENCE SUMMARIES: Ref US20050045855A1: Claims:
A thermal interface composition comprising a blend of a polymer matrix, at least one micron-sized filler, and electrically conductive nanoparticles, wherein the thermal interface composition is electrically non-conducting.
A thermal interface composition as in claim 1 , wherein the polymer matrix comprises a curable polymeric composition.
A thermal interface composition as in claim 2 , wherein the curable polymeric composition is selected from the group consisting of epoxy resins, acrylate resins, organopolysiloxane resins, polyimide resins, polyimide resins, fluorocarbon resins, benzocyclobutene resins, and fluorinated polyallyl ethers, polyamide resins, polyimidoamide resins, cyanate ester resins, phenol resol resins, aromatic polyester resins, polyphenylene ether (PPE) resins, bismaleimide triazine resins, and fluororesins.
A thermal interface composition as in claim 1 wherein the micron-sized filler is selected from the group consisting of fumed silica, fused silica, finely divided quartz powder, amorphous silicas, carbon black, graphite, diamond, aluminum hydrates, metal nitrides, metal oxides, and combinations thereof.
A thermal interface composition as in claim 1 wherein the micron-sized filler comprises between about 10 weight % and about 95 weight % of the total composition.
A thermal interface composition as in claim 1 wherein the micron-sized filler comprises particles of a size ranging from about 1 to about 100 microns.
A thermal interface composition as in claim 1 , wherein the electrically conductive nanoparticles are selected from the group consisting of copper, silver, platinum, palladium, gold, graphite, aluminum, doped silicon and silicon carbide.
A thermal interface composition as in claim 1 wherein the electrically conductive nanoparticles comprise between about 3 weight % and about 50 weight % of the total composition.
A thermal interface composition as in claim 1 wherein the electrically conductive nanoparticles comprise between about 1% and about 25% by volume of the total composition.
A thermal interface composition as in claim 1 , wherein the electrically conductive nanoparticles are of a size ranging from about 1 to about 250 nanometers.
A thermal interface composition as in claim 1 , further comprising organo-functionalized nanoparticles.
A thermal interface composition as in claim 11 , wherein the organo-functionalized nanoparticles comprise an organoalkoxysilane, vinyl, allyl, styrenic, silyl or siloxyl of the formula (R 1 ) a Si(OR 2 ) 4-a wherein R 1 is independently at each occurrence a C 1-18 monovalent hydrocarbon radical optionally further functionalized with alkyl acrylate, alkyl methacrylate, epoxide, vinyl, allyl, styrenic, silyl or siloxyl groups or C 6-14 aryl radical; R 2 is independently at each occurrence a C 1-18 monovalent hydrocarbon radical or a hydrogen radical; and “a” is a whole number equal to 1 to 3 inclusive.
A thermal interface composition as in claim 1 having a thickness ranging from about 10 to about 150 microns.
A method of increasing heat transfer comprising: positioning a heat producing component in contact with an electrically non-conducting thermal interface composition comprising a blend of a polymer matrix, at least one micron-sized filler, and electrically conductive nanoparticles; and positioning a heat sink in contact with the thermal interface composition.
positioning a heat producing component in contact with an electrically non-conducting thermal interface composition comprising a blend of a polymer matrix, at least one micron-sized filler, and electrically conductive nanoparticles; and
positioning a heat sink in contact with the thermal interface composition.
A method as in claim 14 wherein the step of positioning the heat producing component in contact with the thermal interface composition comprises selecting at least one micron-sized filler from the group consisting of fumed silica, fused silica, finely divided quartz powder, amorphous silicas, carbon black, graphite, diamond, aluminum hydrates, metal nitrides, metal oxides, and combinations thereof for use in the thermal interface composition.
A method as in claim 14 wherein the step of positioning the heat producing component in contact with the thermal interface composition comprises selecting electrically conductive nanoparticles from the group consisting of copper, silver, platinum, palladium, gold, graphite, aluminum, doped silicon and silicon carbide for use in the thermal interface composition.
A method as in claim 14 further comprising the step of curing the thermal interface composition.
A method as in claim 14 wherein the step of positioning the heat producing component in contact with the thermal interface composition comprises positioning a pre-formed pad made from the thermal interface composition in contact with the heat producing component.
An electronic component comprising: a heat producing component; a heat sink; and an electrically non-conducting thermal interface composition interposed between the heat producing component and the heat sink, the electrically non-conducting thermal interface composition comprising a blend of a polymer matrix, at least one micron-sized filler, and electrically conductive nanoparticles.
a heat producing component;
a heat sink; and
an electrically non-conducting thermal interface composition interposed between the heat producing component and the heat sink, the electrically non-conducting thermal interface composition comprising a blend of a polymer matrix, at least one micron-sized filler, and electrically conductive nanoparticles.
An electronic component as in claim 19 , wherein the heat producing component is a semiconductor chip.
An electronic component as in claim 19 , wherein the heat producing component includes a heat producing semiconductor chip.
An electronic component as in claim 21 , wherein the heat producing component is selected from the group consisting of chip carriers, area array packages, chip scale packages or other semiconductor packaging structures.
An electronic component as in claim 19 , wherein the polymer matrix comprises a curable polymer.
An electronic component as in claim 23 , wherein the polymer matrix is selected from the group consisting of epoxy resins, acrylate resins, organopolysiloxane resins, polyimide resins, fluorocarbon resins, benzocyclobutene resins, fluorinated polyallyl ethers, polyamide resins, acrylic resins, polyimidoamide resins, phenol resol resins, aromatic polyester resins, polyphenylene ether (PPE) resins, bismaleimide triazine resins, and fluororesins.
An electronic component as in claim 19 , wherein the micron-sized filler is selected from the group consisting of fumed silica, fused silica, finely divided quartz powder, amorphous silicas, carbon black, graphite, diamond, aluminum hydrates, metal nitrides, metal oxides, and combinations thereof.
An electronic component as in claim 19 , wherein the electrically conductive nanoparticles are selected from the group consisting of copper, silver, platinum, palladium, gold, graphite, aluminum, doped silicon and silicon carbide.
An electronic component as in claim 19 , wherein the thermal interface composition further comprises organo-functionalized nanoparticles.
An electronic component as in claim 27 , wherein the organo-functionalized nanoparticles comprise an organoalkoxysilane, vinyl, allyl, styrenic, silyl or siloxyl of the formula (R 1 ) a Si(OR 2 ) 4-a wherein R 1 is independently at each occurrence a C 1-18 monovalent hydrocarbon radical optionally further functionalized with alkyl acrylate, alkyl methacrylate, epoxide, vinyl, allyl, styrenic, silyl or siloxyl groups or C 6-14 aryl radical; R 2 is independently at each occurrence a C 1-18 monovalent hydrocarbon radical or a hydrogen radical; and “a” is a whole number equal to 1 to 3 inclusive.
An electronic component as in claim 19 , wherein the thermal interface composition comprises a pre-formed pad.
A method of slowing phase separation of a polymer composition filled with a micron-sized filler comprising: providing a polymer matrix; blending a micron-sized filler with the polymer matrix to form the polymer composition; and blending electrically conductive nanoparticles with the polymer composition.
providing a polymer matrix;
blending a micron-sized filler with the polymer matrix to form the polymer composition; and
blending electrically conductive nanoparticles with the polymer composition.
A method as in claim 30 wherein the polymer composition is electrically non-conducting.
A method of increasing heat transfer comprising: positioning a heat producing component in contact with a printed circuit board; contacting the component to at least one electrical contact of the printed circuit board to form an electrical connection; and applying a thermal interface composition comprising a blend of a polymer matrix, at least one micron-sized filler and electrically conductive nanoparticles between the component and the print circuit board, wherein the thermal interface composition encapsulates the at least one electrical connection.
positioning a heat producing component in contact with a printed circuit board;
contacting the component to at least one electrical contact of the printed circuit board to form an electrical connection; and
applying a thermal interface composition comprising a blend of a polymer matrix, at least one micron-sized filler and electrically conductive nanoparticles between the component and the print circuit board,
wherein the thermal interface composition encapsulates the at least one electrical connection.
The method of claim 32 , wherein the step of applying a thermal interface composition comprises applying a composition containing a polymer matrix selected from the group consisting of epoxy resins, acrylate resins, organopolysiloxane resins, polyimide resins, polyimide resins, fluorocarbon resins, benzocyclobutene resins, and fluorinated polyallyl ethers, polyamide resins, polyimidoamide resins, cyanate ester resins, phenol resol resins, aromatic polyester resins, polyphenylene ether (PPE) resins, bismaleimide triazine resins, and fluororesins.
The method of claim 32 , wherein the step of applying a thermal interface composition comprises applying a composition containing a micron-sized filler selected from the group consisting of fumed silica, fused silica, finely divided quartz powder, amorphous silicas, carbon black, graphite, diamond, aluminum hydrates, metal nitrides, metal oxides, and combinations thereof.
The method of claim 32 , wherein the step of applying a thermal interface composition comprises applying a composition containing electrically conductive nanoparticles selected from the group consisting of copper, silver, platinum, palladium, gold, graphite, aluminum, doped silicon and silicon carbide.
A method of increasing heat transfer comprising: applying a thermal interface composition comprising a blend of a polymer matrix, at least one micron-sized filler and electrically conductive nanoparticles to a semiconductor wafer containing a plurality of die sites, said die sites containing a plurality of electrical contacts; disposing at least one solder sphere onto said plurality of contacts; partially curing the thermal interface composition such that a top of the at least one solder sphere is exposed; sawing the wafer into individual semiconductor chips; positioning at least one semiconductor chip onto a printed circuit board such that the at least one solder sphere is aligned to form at least one electrical connection with at least one electrical contact of the printed circuit board; heating the at least one semiconductor chip and board to concurrently melt the solder sphere and cure the thermal interface composition; and cooling the at least one semiconductor chip and board to solidify the solder sphere and set the thermal interface composition so that the thermal interface composition encapsulates the at least one electrical connection.
applying a thermal interface composition comprising a blend of a polymer matrix, at least one micron-sized filler and electrically conductive nanoparticles to a semiconductor wafer containing a plurality of die sites, said die sites containing a plurality of electrical contacts;
disposing at least one solder sphere onto said plurality of contacts;
partially curing the thermal interface composition such that a top of the at least one solder sphere is exposed;
sawing the wafer into individual semiconductor chips;
positioning at least one semiconductor chip onto a printed circuit board such that the at least one solder sphere is aligned to form at least one electrical connection with at least one electrical contact of the printed circuit board;
heating the at least one semiconductor chip and board to concurrently melt the solder sphere and cure the thermal interface composition; and
cooling the at least one semiconductor chip and board to solidify the solder sphere and set the thermal interface composition so that the thermal interface composition encapsulates the at least one electrical connection.
The method of claim 36 , wherein the step of applying a thermal interface composition comprises applying a composition containing a polymer matrix selected from the group consisting of epoxy resins, acrylate resins, organopolysiloxane resins, polyimide resins, polyimide resins, fluorocarbon resins, benzocyclobutene resins, and fluorinated polyallyl ethers, polyamide resins, polyimidoamide resins, cyanate ester resins, phenol resol resins, aromatic polyester resins, polyphenylene ether (PPE) resins, bismaleimide triazine resins, and fluororesins.
The method of claim 36 , wherein the step of applying a thermal interface composition comprises applying a composition containing a micron-sized filler selected from the group consisting of fumed silica, fused silica, finely divided quartz powder, amorphous silicas, carbon black, graphite, diamond, aluminum hydrates, metal nitrides, metal oxides, and combinations thereof.
The method of claim 36 , wherein the step of applying a thermal interface composition comprises applying a composition containing electrically conductive nanoparticles selected from the group consisting of copper, silver, platinum, palladium, gold, graphite, aluminum, doped silicon and silicon carbide.
A method of increasing heat transfer comprising: applying a thermal interface composition comprising a blend of a polymer matrix and electrically conductive nanoparticles onto a printed circuit board; positioning a heat producing component containing at least one electrical contact with at least one solder sphere onto the printed circuit board, such that at least one solder sphere is aligned to at least one electrical contact of the printed circuit board forming at least one electrical connection; heating the component and board to concurrently melt the solder sphere and cure the thermal interface composition; and cooling the component and board to solidify the solder sphere and set the thermal interface composition so that the thermal interface composition encapsulates the at least one electrical connection.
applying a thermal interface composition comprising a blend of a polymer matrix and electrically conductive nanoparticles onto a printed circuit board;
positioning a heat producing component containing at least one electrical contact with at least one solder sphere onto the printed circuit board, such that at least one solder sphere is aligned to at least one electrical contact of the printed circuit board forming at least one electrical connection;
heating the component and board to concurrently melt the solder sphere and cure the thermal interface composition; and
cooling the component and board to solidify the solder sphere and set the thermal interface composition so that the thermal interface composition encapsulates the at least one electrical connection.
The method of claim 40 , wherein the step of applying a thermal interface composition comprises applying a composition containing a polymer matrix selected from the group consisting of epoxy resins, acrylate resins, organopolysiloxane resins, polyimide resins, polyimide resins, fluorocarbon resins, benzocyclobutene resins, and fluorinated polyallyl ethers, polyamide resins, polyimidoamide resins, cyanate ester resins, phenol resol resins, aromatic polyester resins, polyphenylene ether (PPE) resins, bismaleimide triazine resins, and fluororesins.
The method of claim 40 , wherein the step of applying a thermal interface composition comprises applying a composition containing electrically conductive nanoparticles selected from the group consisting of copper, silver, platinum, palladium, gold, graphite, aluminum, doped silicon and silicon carbide.
An electronic component comprising: a heat producing component; a printed circuit board; and a thermal interface composition interposed between the heat producing component and the printed circuit board, the thermal interface composition comprising a blend of a polymer matrix and electrically conductive nanoparticles.
a printed circuit board; and
a thermal interface composition interposed between the heat producing component and the printed circuit board, the thermal interface composition comprising a blend of a polymer matrix and electrically conductive nanoparticles.
The electronic component of claim 43 , wherein the polymer matrix is selected from the group consisting of epoxy resins, acrylate resins, organopolysiloxane resins, polyimide resins, polyimide resins, fluorocarbon resins, benzocyclobutene resins, and fluorinated polyallyl ethers, polyamide resins, polyimidoamide resins, cyanate ester resins, phenol resol resins, aromatic polyester resins, polyphenylene ether (PPE) resins, bismaleimide triazine resins, and fluororesins.
The electronic component of claim 43 , wherein the electrically conductive nanoparticles are selected from the group consisting of copper, silver, platinum, palladium, gold, graphite, aluminum, doped silicon and silicon carbide.
An underfill composition comprising a blend of a polymer matrix and electrically conductive nanoparticles, wherein the underfill composition is electrically non-conducting.
An underfill composition as in claim 46 , wherein the polymer matrix comprises a curable polymeric composition.
An underfill composition as in claim 46 , wherein the curable polymeric composition is selected from the group consisting of epoxy resins, acrylate resins, organopolysiloxane resins, polyimide resins, polyimide resins, fluorocarbon resins, benzocyclobutene resins, and fluorinated polyallyl ethers, polyamide resins, polyimidoamide resins, cyanate ester resins, phenol resol resins, aromatic polyester resins, polyphenylene ether (PPE) resins, bismaleimide triazine resins, and fluororesins.
An underfill composition as in claim 46 , wherein the electrically conductive nanoparticles are selected from the group consisting of copper, silver, platinum, palladium, gold, graphite, aluminum, doped silicon and silicon carbide.
An underfill composition as in claim 46 wherein the electrically conductive nanoparticles comprise between about 10 weight % and about 85 weight % of the total composition.
An underfill composition as in claim 46 , wherein the electrically conductive nanoparticles are of a size ranging from about 1 to about 250 nanometers.
Ref US20110290863A1: Claims:
A sintering silver paste material comprising approximately spherical silver particles and an organic silver complex kneaded together into a slurry state. 2. The sintering silver paste material according to claim 1, wherein the approximately spherical silver particles have an average particle size of 0.1 to 2.0 μm. 3. The sintering silver paste material according to claim 1, wherein the paste material further comprises an organic solvent which dissolves the organic silver complex and is kneaded into 
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