Office Action 3: Non-Final Rejection (2024-11-14)
Rejection types: 103 - Obviousness, 112 - Written Description/Enablement

CLAIMS:
Listing of Claims:
 Amendments to the Claims:

This listing of claims will replace all prior versions, and listings, of claims in the application:

1\. (Currently Amended) A method, comprising:
heating a material including silver particles within an ultra-violet (UV) curable resin to obtain the UV curable resin on sintered silver particles without curing the UV curable resin,wherein the silver particles are un-sintered prior to the heating, and
wherein at least a portion of the material is positioned between a chip and a submount; and
irradiating, with UV light, the UV curable resin to cure the UV curable resin and obtain a polymer on the sintered silver particles.
2\. (Original) The method of claim 1, wherein heating the material comprises sintering the silver particles within the UV curable resin, and
wherein sintering the silver particles within the UV curable resin pushes the UV curable resin toward an exterior surface of the material to obtain the UV curable resin on the sintered silver particles.
3\. (Original) The method of claim 1, wherein irradiating the UV curable resin comprises at least one of irradiating the UV curable resin for a continuous exposure period or irradiating the UV curable resin with pulses of the UV light.


4\. (Original) The method of claim 1, further comprising:
applying the material to at least one of the submount or the chip; and
positioning the chip on the submount.

5\. (Original) The method of claim 1, further comprising:
before irradiating the UV curable resin, cooling the UV curable resin on the sintered silver particles.

6\. (Original) The method of claim 1, wherein the sintered silver particles are sintered within the UV curable resin.

7\. (Canceled)

8\. (Original) The method of claim 1, wherein a portion of the polymer forms a layer on an exterior surface of the sintered silver particles.

9\. (Original) The method of claim 8, wherein the layer is between 0.1 and 10 microns thick.

10\. (Original) The method of claim 8, wherein the layer is connected to a portion of one or more side surfaces of the chip and a top surface of the submount.

11\. (Currently Amended) A method, comprising:

the material including un-sintered silver particles and an ultra-violet (UV) curable resin;
heating the material to sinter the un-sintered silver particles within the UV curable resin to produce sintered silver particles without curing the UV curable resin; and
irradiating, with UV light, the UV curable resin to cure the UV curable resin and produce a polymer on the sintered silver particles.

12\. (Original) The method of claim 11, wherein irradiating the UV curable resin comprises at least one of irradiating the UV curable resin for a continuous exposure period or irradiating the UV curable resin with pulses of the UV light.

13\. (Original) The method of claim 11, further comprising:
before irradiating the UV curable resin, cooling the UV curable resin on the sintered silver particles.

14\. (Original) The method of claim 11, wherein the sintered silver particles have a density of 10.49 grams/centimeter3, and
wherein the UV curable resin has a density of 1.00 grams/centimeter3.

15\. (Original) The method of claim 11, wherein the sintered silver particles are formed from at least one of microparticles or nanoparticles.


16\. (Original) The method of claim 11, wherein the UV curable resin comprises at least one of an epoxy-based resin, an acrylate-based resin, or a silicone-based resin.

17\. (Previously Presented) The method of claim 11, wherein a ratio, by weight, of the UV curable resin to silver particles is between 0.05 and 1, and
the ratio is selected such that, when cured, a layer of the polymer on the sintered silver particles has a thickness in a range from 0.1 microns to 10 microns.

18\. (Previously Presented) The method of claim 11, wherein sintering the un-sintered silver particles within the UV curable resin pushes the UV curable resin toward an exterior surface of the material to produce a layer of the UV curable resin on the sintered silver particles.

19\. (Original) The method of claim 18, wherein the layer is between 0.1 and 10 microns thick.

20\. (Original) The method of claim 18, wherein the layer is connected to a portion of one or more side surfaces of the chip and a top surface of the submount.

21\. (Currently Amended) A method, comprising:
heating a material including silver particles within an ultra-violet (UV) curable resin to obtain the UV curable resin on sintered silver particles without curing the UV curable resin,wherein at least a portion of the material is positioned between a chip and a submount;
 the UV curable resin on the sintered silver particles; and
irradiating, with UV light and after the cooling, the UV curable resin to cure the UV curable resin and obtain a polymer on the sintered silver particles.

OFFICE ACTION:
DETAILED ACTION
Notice of Pre-AIA  or AIA  Status
1.	The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Continued Examination Un-der 37 CFR 1.114
2.          A request for continued examination under 37 CFR 1.114, including the fee set forth in 37 CFR 1.17(e), was filed in this application after final rejection. Since this application is eligible for continued examination under 37 CFR 1.114, and the fee set forth in 37 CFR 1.17(e) has been timely paid, the finality of the previous Office action has been withdrawn pursuant to 37 CFR 1.114. Applicant's submission filed on 09/20/2024 has been entered.
Claim Rejections - 35 USC § 112
3.	The following is a quotation of the first paragraph of 35 U.S.C. 112(a):
(a) IN GENERAL. The specification shall contain a written description of the invention, and of the manner and process of making and using it, in such full, clear, concise, and exact terms as to enable any person skilled in the art to which it pertains, or with which it is most nearly connected, to make and use the same, and shall set forth the best mode contemplated by the inventor or joint inventor of carrying out the invention.
The following is a quotation of the first paragraph of pre-AIA  35 U.S.C. 112:
The specification shall contain a written description of the invention, and of the manner and process of making and using it, in such full, clear, concise, and exact terms as to enable any person skilled in the art to which it pertains, or with which it is most nearly connected, to make and use the same, and shall set forth the best mode contemplated by the inventor of carrying out his invention.
4.       Claims 1-6, 8-21 are rejected under 35 U.S.C. 112(a) or 35 U.S.C. 112 (pre-AIA ), first paragraph, as failing to comply with the written description requirement.  The claim(s) contains subject matter which was not described in the specification in such a way as to reasonably convey to one skilled in the relevant art that the inventor or a joint inventor, or for pre-AIA  the inventor(s), at the time the application was filed, had possession of the claimed invention. For example, claims 1, 11, 21 recite “heating the material to sinter the un-sintered silver particles within the UV curable resin to produce sintered silver particles without curing the UV curable resin”. The specification does not enable any person skilled in the art to which it pertains, or with which it is most nearly connected, to practice the invention commensurate in scope with these claims. Specifically, “sintered silver particles without curing the UV curable resin”. As such, the applicant's specification does not disclose enough to enable one of ordinary skill in the art to determine the substantially level between within the UV curable resin and without curing the UV curable resin.
5.	The following is a quotation of 35 U.S.C. 112(b):
(b)  CONCLUSION. The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention.
The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph:
The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention.
6.       Claims 1-6, 8-21 are rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor, or for pre-AIA  the applicant regards as the invention.
For example, claims 1, 11, 21 recite “heating the material to sinter the un-sintered silver particles within the UV curable resin to produce sintered silver particles without curing the UV curable resin”. It is not clear how the step of heating the material would perform within the UV curable resin and without curing the UV curable resin at the same time.
For the purposes of examination, Examiner will treat the UV curable resins as materials that are polymerized and cured using ultraviolet irradiation devices.
Claim Rejections - 35 USC § 103
7.	The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action:
A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made.
The factual inquiries for establishing a background for determining obviousness under 35 U.S.C. 103 are summarized as follows:
1. Determining the scope and contents of the prior art.
2. Ascertaining the differences between the prior art and the claims at issue.
3. Resolving the level of ordinary skill in the pertinent art.
4. Considering objective evidence present in the application indicating obviousness or non-obviousness.
8. 	Claims 1-6, 8-21, are rejected under 35 U.S.C. 103 as being un-patentable over Kajiwara et al., US 2011/0290863 A1, in view of Brodd et al., (US 2017/0267899 A1), further in view of Gregory US 6,245,827 B1.
Claims 1, 2, 6, 8, 10-11. Kajiwara et al., disclose a method (such as the steps in fig. 2), comprising:
-heating a material including silver particles (this limitation would read through [0059], wherein is disclosed the sintering Ag paste is heated to 400.degree. C. in a non-oxidizing atmosphere, and makes metal Ag precipitate from the solution of the organic silver complex in the sintering Ag paste and sediment on a plated Ni face to form a metallizing Ag film 7 on the face);
-wherein the silver particles are un-sintered prior to the heating (this limitation would read through [0061] wherein is disclosed (structure is formed, in which the sintered Ag layer in contact with a plated Ni film is a layer formed from Ag which has precipitated from the solution of the organic silver complex and has sedimented on the plated Ni film (sintered layer of organic silver complex +Ag particles), as by definition the term “un-sintered is defined as essentially an impregnated coating that is not fully fused during the process”.
-wherein at least a portion of the material is positioned between a chip (item 3) and a sub-mount (item 1).
Kajiwara appears to not explicitly disclose that the heating process is done “within an ultra-violet (UV) curable resin to obtain the UV curable resin on sintered silver particles, and irradiating, with UV light, the UV curable resin to obtain a polymer on the sintered silver particles”.
However, [0015] of Brodd et al., discloses that the cured resin layer can be formed from a curable (e.g., polymerizable) resin capable of being coated onto the conductive network and supporting substrate, followed by curing to form the cured resin layer. Desirable properties of the cured resin layer include the ability to form a self-supporting (e.g., free-standing) film, flexibility, conformability, stretchability (i.e., the film is elastomeric), adhesion to the conductive network and PSA layer, transparency, and a non-tacky surface after curing. Preferred polymerizable resins are photocurable resins, e.g., resins having photo-initiators and curable using visible or UV wavelengths. It would have been obvious to a person of ordinary skill in the art at the time the invention was made to recognize that combining Kajiwara’s process with Brodd's invention would have been beneficial because it gives the practitioner flexibility in using available ultra-violet (UV) technologies.
With respect to the limitation “without curing the UV curable resin and irradiating, with UV light, the UV curable resin to cure the UV curable resin”. It is noted that col. 1, ln 42, step c) of Gregory indicates a complete cure throughout the entire volume of the resin composition upon application of ultraviolet light and without the necessity of on-site heating. Further, col. 2, ln 62+, of Gregory indicates the composition cures by exposure to ultraviolet radiation throughout its entire volume without the need for any other outside stimuli. It would have been obvious to a person of ordinary skill in the art at the time the invention was made to recognize that combining Kajiwara/Bodd’s process with Gregory's invention would have been beneficial because when using UV curable resin on sintered silver particles without curing the resin, the primary advantage is the ability to precisely manipulate and position the silver particles within the uncured resin due to its liquid state, allowing for fine control over the final structure and desired properties of the composite material, while still benefiting from the potential for rapid curing once UV light is applied when needed; this is particularly valuable for applications requiring intricate patterns or precise particle distribution.
Claim 3. Kajiwara with Brodd et al., disclose the method of claim 1, wherein irradiating the UV curable resin comprises at least one of irradiating the UV curable resin for a continuous exposure period or irradiating the UV curable resin with pulses of the UV light. This limitation would read through [0018] of Brodd et al., wherein is disclosed that the curing of the curable resin layer preferably is done using a photocurable resin and visible or UV irradiation.
Claim 4. Kajiwara with Brodd et al., disclose the method of claim 1, further comprising: applying the material to at least one of the sub-mount (item 1) or the chip (item 3); and positioning the chip on the sub-mount, as seen in the structure of fig. 2, step 2 of Kajiwara.
Claim 5. Kajiwara with Brodd et al., disclose the method of claim 1, further comprising: before irradiating the UV curable resin, cooling the UV curable resin on the sintered silver particles. This limitation would read through [0064] of Kajiwara at the step of reducing atmosphere from 400.degree to 250.degree. C. for 1 hour.
Claim 12. Kajiwara with Brodd et al., disclose the method of claim 11, wherein irradiating the UV curable resin comprises at least one of irradiating the UV curable resin for a continuous exposure period or irradiating the UV curable resin with pulses of the UV light. This limitation would read through [0018] of Brodd et al., wherein is disclosed that the curing of the curable resin layer preferably is done using a photocurable resin and visible or UV irradiation.
Claim 13. Kajiwara with Brodd et al., disclose the method of claim 11, further comprising: before irradiating the UV curable resin, cooling the UV curable resin on the sintered silver particles, as seen in the structure of fig. 2, step 2 of Kajiwara.
Claim 15. Kajiwara with Brodd et al., disclose the method of claim 11, wherein the sintered silver particles are formed from at least one of microparticles or nanoparticles. This limitation would read through [0018] of Kajiwara et al., wherein is disclosed that the Ag nano-particle can be bonded to Cu and Ni with a certain degree of strength if a load is applied to the Ag nano-particle and adhesion is secured.
Claim 16. Kajiwara with Brodd et al., disclose the method of claim 11, wherein the UV curable resin comprises at least one of an epoxy-based resin, an acrylate-based resin, or a silicone-based resin. This limitation would read through [0018] of Kajiwara et al., wherein is disclosed that curing of the curable resin layer preferably is done using a photocurable resin and visible or UV irradiation.
Claim 18. Kajiwara with Brodd et al., disclose the method of claim 11, wherein sintering the un-sintered silver particles within the UV curable resin pushes the UV curable resin toward an exterior surface of the material to produce a layer of the UV curable resin on the sintered silver particles; (this limitation would read through [0061] wherein is disclosed (structure is formed, in which the sintered Ag layer in contact with a plated Ni film is a layer formed from Ag which has precipitated from the solution of the organic silver complex and has sedimented on the plated Ni film (sintered layer of organic silver complex +Ag particles), as by definition the term “un-sintered is defined as essentially an impregnated coating that is not fully fused during the process”.
Claim 20. Kajiwara with Brodd et al., disclose the method of claim 18, wherein the layer is connected to a portion of one or more side surfaces of the chip and a top surface of the sub-mount (as seen in the structure of fig. 2).
Claims 9, 14, 17 and 19. Kajiwara et al., disclose the device of claims 8 and 15, above.
Kajiwara appears to not explicitly disclose “wherein the layer is between 0.1 and 10 microns thick”, as in claim 9; “wherein the sintered silver particles have a density of 10.49 grams/centimeter, and wherein the UV curable resin has a density of 1.00 grams/centimeter”, as in claim 14; “wherein a ratio, by weight, of the UV curable resin to the silver particles is between 0.05 and 1, and the ratio is selected such that, when cured, a layer of the polymer on the sintered silver particles has a thickness in a range from 0.1 microns to 10 microns”, as in claim 17; “wherein the layer is between 0.1 and 10 microns thick”, as in claim 19.
However, [0021] of Brodd et al., discloses that a pressure sensitive adhesive (3M Double Coated Tape 9019 available from 3M, St. Paul, Minn.) was next laminated to the UV resin coating using a GHQ-320 PR3 laminator at 300 mm/min., leaving the release liner attached on the exposed adhesive side of the PSA. The UV resin layer was cured in a Fusion UV curing system (Fusion UV Systems, Gaithersburg, Md.), H bulb, at 6 feet/minute, power approximately 0.207 J/cm2.
To manufacture conductive adhesive tapes for the use in packaging integrated circuit products, such as microprocessors, storage circuits, three-dimensional (3D) chips, it would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains to form the adhesive with material wherein silver particles have a density of 10.49 grams/centimeter, and wherein the UV curable resin has a density of 1.00 grams/centimeter, and wherein a ratio, by weight, of the UV curable resin to the silver particles is in a range from 0.05 to 1.
Claim 21. Kajiwara discloses a method (such as the steps in fig. 2), comprising:
-heating a material including silver particles within an ultra-violet (UV) curable resin to obtain the UV curable resin on sintered silver particles, (this limitation would read through [0059], wherein is disclosed the sintering Ag paste is heated to 400.degree. C. in a non-oxidizing atmosphere, and makes metal Ag precipitate from the solution of the organic silver complex in the sintering Ag paste and sediment on a plated Ni face to form a metallizing Ag film 7 on the face);
-wherein at least a portion of the material is positioned between a chip (item 3) and a sub-mount (item 1);
-cooling the UV curable resin on the sintered silver particles, this limitation would read through [0064] of Kajiwara at the step of reducing atmosphere from 400.degree to 250.degree. C. for 1 hour.
Kajiwara appears to not explicitly disclose that the heating process is done “within an ultra-violet (UV) curable resin to obtain the UV curable resin on sintered silver particles, and irradiating, with UV light, the UV curable resin to obtain a polymer on the sintered silver particles”.
However, [0015] of Brodd et al., discloses that the cured resin layer can be formed from a curable (e.g., polymerizable) resin capable of being coated onto the conductive network and supporting substrate, followed by curing to form the cured resin layer. Desirable properties of the cured resin layer include the ability to form a self-supporting (e.g., free-standing) film, flexibility, conformability, stretchability (i.e., the film is elastomeric), adhesion to the conductive network and PSA layer, transparency, and a non-tacky surface after curing. Preferred polymerizable resins are photocurable resins, e.g., resins having photo-initiators and curable using visible or UV wavelengths. It would have been obvious to a person of ordinary skill in the art at the time the invention was made to recognize that combining Kajiwara’s process with Brodd's invention would have been beneficial because it gives the practitioner flexibility in using available ultra-violet (UV) technologies.
With respect to the limitation “without curing the UV curable resin and irradiating, with UV light, the UV curable resin to cure the UV curable resin”. It is noted that col. 1, ln 42, step c) of Gregory indicates a complete cure throughout the entire volume of the resin composition upon application of ultraviolet light and without the necessity of on-site heating. Further, col. 2, ln 62+, of Gregory indicates the composition cures by exposure to ultraviolet radiation throughout its entire volume without the need for any other outside stimuli. It would have been obvious to a person of ordinary skill in the art at the time the invention was made to recognize that combining Kajiwara/Bodd’s process with Gregory's invention would have been beneficial because when using UV curable resin on sintered silver particles without curing the resin, the primary advantage is the ability to precisely manipulate and position the silver particles within the uncured resin due to its liquid state, allowing for fine control over the final structure and desired properties of the composite material, while still benefiting from the potential for rapid curing once UV light is applied when needed; this is particularly valuable for applications requiring intricate patterns or precise particle distribution.
Conclusion

APPLICANT REBUTTAL: PATENT
REMARKS
Applicant addresses below the issues raised by the Office Action.
Statement Re
g
ardin
g
Substance o
f
I
nterview
Applicant submits that an interview occurred on January 29, 2025 with Applicant's
representative, Matthew Allen, and Examiner Jean Baptiste. Applicant appreciates the courtesies extended during the interview. During the interview, Applicant's representative discussed the claims, the rejections, the applied references, and proposed claim amendments. The Examiner agreed that the 112 rejections would be withdrawn and that proposed amendments, substantially included in this response, would lead to further search and consideration. The Examiner is also invited to call Applicant's representative to resolve any remaining issues if the Examiner believes the application is not in condition for allowance.
Initial Matter - Unaddressed A
rg
uments
Applicant respectfully requests that, should an Allowance not be forthcoming, any subsequent action should address Applicant's arguments which were made in Applicant's Response filed September 20, 2024, consideration of which was requested in Applicant's Request for Continued Examination filed October 22, 2024. For convenience, the remarks presented herein also include those made in Applicant's prior Response.
Rej
ection under 35 U
.S.
C.
$
112(a)
Claims 1-6 and 8-21 stand rejected under 35 U.S.C. § 112(a).
PATENT
As discussed during the Interview, support for the "silver particles within an ultra-violet
(UV) curable resin" and "heating the material...without curing the UV curable resin" may be found throughout Applicant's specification, including at paragraphs 0015, 0025, and 0035, as well as Fig. 1. Thus, claims 1-6 and 8-21 satisfy the written description requirement of 35 U.S.C. § 112(a).
Accordingly, Applicant respectfully requests that the Examiner reconsider and withdraw the rejection of claims 1-6 and 8-21 under 35 U.S.C. § 112(a).
Re
jection under 35 U
.S.
C.
$
112(b)
Claims 1-6 and 8-21 stand rejected under 35 U.S.C. § 112(b).
As discussed during the Interview, one of ordinary skill in the art would understand that "silver particles within an ultra-violet (UV) curable resin" means that the particles are physically located within the resin, while "heating the material...without curing the UV curable resin" means that heating the material does not cure the UV curable resin. Thus, claims 1-6 and 8-21 are definite under 35 U.S.C. § 112(b).
Accordingly, Applicant respectfully requests that the Examiner reconsider and withdraw the rejection of claims 1-6 and 8-21 under 35 U.S.C. § 112(b).
Rej
ection under 35 U
.
S.C.
$
103 based on KA
JI
WARA, BR
ODD, and GREGORY
Claims 1-6 and 8-21 stand rejected under 35 U.S.C. § 103 as allegedly being
unpatentable over KAJIWARA (U.S. Patent Application Publication No. 2011/0290863), BRODD (U.S. Patent Application Publication No. 2017/0267899), and GREGORY (U.S. Patent No. 6,245,827). Applicant respectfully traverses the rejection.
PATENT
Applicant respectfully submits the Office Action fails to set forth a proper rational for combining KAJIWARA with BRODD or GREGORY that would support a conclusion of obviousness.
MPEP § 2143.01 states that references may be combined "when there is some teaching, suggestion, or motivation to do so," and that "the proposed modification cannot change the principle of operation of a reference." Pages 3-4 of the Office Action alleges that "combining Kajiwara's process with Brodd's invention would have been beneficial because it gives the practitioner flexibility in using available ultra-violet (UV) technologies," and suggests modifying KAJIWARA to include the "photocurable resin" of BRODD or GREGORY.
Applicant respectfully asserts that, even assuming a person of ordinary skill in the art would or could replace the "organic solvent" of KAJIWARA with the "photocurable resin" of BRODD or GREGORY, which Applicant does not concede, this would clearly require substantial experimentation and redesign. Furthermore, the proposed combination would also change the principle of operation of KAJIWARA (e.g., where "the sintering Ag paste is heated to 4000 C... and makes metal Ag precipitate from the solution of the organic silver complex in the sintering Ag paste and sediment on a plated Ni face to form a metallizing Ag film 7 on the face" (KAJIWARA, para. 0059)) to a principle of operation without a metallizing Ag film, as changing the solution of the Ag paste to a photocurable resin is not taught to form a metallizing Ag film after heating. In other words, it is a significantly different principle of operation to go from using a solution that, when heated, has "volatized and dissipated" to form an Ag film, to a resin that is not taught to volatize and dissipate from a heating process that sinters silver, nor is there any indication that switching to the photocurable resin would result in formation of an Ag film after heating. This modification of KAJIWARA is impermissible, at least because the
PATENT
"suggested combination of references would require a substantial reconstruction and redesign of the elements shown in [the primary reference] as well as a change in the basic principle under which the [primary reference] construction was designed to operate" (MPEP § 2143.01(VI) quoting In re Ratti, 270 F.2d 810, 813, 123 USPQ 349, 352 (CCPA 1959)).
For at least the foregoing reasons, Applicant respectfully asserts that the Office Action fails to establish prima facie obviousness for failure to provide sufficient suggestion or motivation for the proposed combination of KAJIWARA and BRODD.
In addition, for at least the reasons presented in the interview and without acquiescing in the Examiner's rejection, the cited sections of the applied references, whether taken alone or in any reasonable combination, do not disclose at least "wherein, based at least in part on the heating, at least a portion of the UV curable resin is pushed toward a lateral exterior surface of the material during the heating," as recited in claim 1, as amended.
Furthermore, for at least the reasons presented in the interview and without acquiescing in the Examiner's rejection, the cited sections of the applied references, whether taken alone or in any reasonable combination, do not disclose at least "heating a material including silver particles within an ultra-violet (UV) curable resin to obtain the UV curable resin on sintered silver particles without curing the UV curable resin," as recited in claim 1, as amended. For example, KAJIWARA, BRODD and GREGORY are silent regarding heating a material that includes un-cured UV curable resin and un-sintered silver particles to sinter the silver particles.
In particular, Fig. 2 and 0059 of KAJIWARA disclose the following:
PATENT
(1) Supply sintering Ag paste to space between members to be bonded.
(2) Bake organic silver complex to metallize face of nonprecious metal with Ag.
[0059] In FIG. 2(2), the sintering Ag paste is heated to 4000 C. in a non- oxidizing atmosphere, and makes metal Ag precipitate from the solution of the
organic silver complex in the sintering Ag paste and sediment on a plated Ni face to form a metallizing Ag film 7 on the face. At this time, the organic solvent and the organic component which has been the organic silver complex and has been
separated from Ag are volatilized and dissipated.
The Office Action concedes that KAJIWARA does not disclose heating a UV curable resin to obtain the UV curable resin on sintered silver particles (Office Action, page 3), and the cited portions clearly indicate that the cited heating step is "to form a metallizing Ag film 7" and that "the organic solvent ... has been separated from Ag are volatized and dissipated." Thus, there is clearly no un-cured "UV curable resin on sintered silver particles," as recited in claim 1.
With respect to BRODD and GREGORY, the Office Action relies on BRODD and
GREGORY to allegedly disclose UV curable resin; however, cited paragraph 0015 of BRODD and corresponding Fig. 1 are reproduced below:
PATENT
FIG. 1
[0015] The electrically conductive network 20 is embedded in cured resin
layer (polymer matrix) 30 except for the surface of the conductive network attached to the sacrificial substrate, which will later be exposed and can be
generally coplanar with the surface of the cured resin layer. The cured resin layer
can be formed from a curable (e.g. polymerizable) resin capable of being coated
onto the conductive network and supporting substrate, followed by curing to form
the cured resin layer. Desirable properties of the cured resin layer include the
ability to form a self-supporting (e.g., free-standing) film, flexibility,
conformability, stretchability (i.e. the film is elastomeric), adhesion to the
conductive network and PSA layer, transparency, and a non-tacky surface after
curing. Preferred polymerizable resins are photocurable resins, e.g. resins having
photoinitiators and curable using visible or UV wavelengths. Acrylic and
methacrylic (collectively "(meth)acrylic") resins or combinations thereof, can be used to form the cured resin layer, an example of which is Unidic V 9510 acrylic resin (DIC Corp., Parsippany, N.J.). The thickness of the cured resin layer can be
less than 30 pm, less than 20 pm, or less than 10 pm.
The cited portions of GREGORY further provide:
(c) Rapid, deep and complete cure throughout the entire volume of the
resin composition upon application of ultraviolet light and without the necessity
of on-site heating.
The present invention is a resin composition which possesses an enhanced
shadow cure chemistry mechanism, i.e., the composition cures by exposure to
ultraviolet radiation throughout its entire volume without the need for any other
outside stimuli.
PATENT
Even assuming BRODD and/or GREGORY disclose a UV curable resin, which
Applicant does not concede, the mere recitation of "photocurable resins, e.g., resins having photo-initiators and curable using visible or UV wavelengths" or "a resin composition which ... cures by exposure to ultraviolet radiation... without the need for any other outside stimuli" alone or in combination with the cited portions of KAJIWARA, does not disclose or suggest "heating a material including silver particles within an ultra-violet (UV) curable resin to obtain the UV curable resin on sintered silver particles without curing the UV curable resin," as recited in claim
1. For example, KAJIWARA discloses a process, while the cited portions of BRODD and GREGORY disclose a material, and there is no teaching or suggestion that one of skill in the art would use the resin of BRODD or GREGORY in the process of KAJIWARA. Even if the resin disclosed by BRODD or GREGORY were used in the process of KAJIWARA, which Applicant does not concede, there is no teaching or suggestion regarding which how the resin would be used or in which part of the process. Thus, the proposed combination of KAJIWARE, BRODD, and GREGORY does not disclose or suggest "heating a material including silver particles within an ultra-violet (UV) curable resin to obtain the UV curable resin on sintered silver particles without curing the UV curable resin," as recited in claim 1.
Independent claims 11 and 21, as amended, recite similar features. Therefore,
independent claims 1, 11, and 21 and the claims that depend thereon, are patentable over the cited sections of the applied references, whether taken alone or in any reasonable combination.
Accordingly, Applicant respectfully requests that the Examiner reconsider and withdraw the rejection of claims 1-6 and 8-21 under 35 U.S.C. § 103 based on KAJIWARA, BRODD, and GREGORY.
PATENT
Conclusion

NEXT OFFICE ACTION: DETAILED ACTION
Notice of Pre-AIA  or AIA  Status
1.	The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Allowable Subject Matter
2.           Claims 1-6, 8-21, are allowed.
Reasons for Allowance
3.          The following is an examiner's statement of reasons for allowance:
4.           Regarding claims 1-6, 8-10, the prior art failed to disclose or reasonably wherein the silver particles are un-sintered prior to the heating, wherein, based at least in part on the heating, at least a portion of the UV curable resin is pushed toward a lateral exterior surface of the material during the heating, and wherein at least a portion of the material is positioned between a chip and a sub-mount; and irradiating, with UV light, the UV curable resin to cure the UV curable resin and obtain a polymer on the sintered silver particles.
5.           Regarding claims 11-20, the prior art failed to disclose or reasonably heating the material to sinter the un-sintered silver particles within the UV curable resin to produce sintered silver particles without curing the UV curable resin, wherein, based at least in part on the heating, at least a portion of the UV curable resin is pushed toward a lateral exterior surface of the material during the heating; and irradiating, with UV light, the UV curable resin to cure the UV curable resin and produce a polymer on the sintered silver particles..
6.           Regarding claim 21, the prior art failed to disclose or reasonably wherein at least a portion of the material is positioned between a chip and a sub-mount, wherein, based at least in part on the heating, at least a portion of the UV curable resin is pushed toward a lateral exterior surface of the material during the heating to produce a layer of the UV curable resin on the sintered silver particles; cooling the UV curable resin on the sintered silver particles; and irradiating, with UV light and after the cooling, the UV curable resin to cure the UV curable resin and obtain a polymer on the sintered silver particles.
Remarks:
7.    The closest prior art is Yamasaki et al., US 11,257,735 B2. However, the prior art failed to disclose or reasonably wherein at least a portion of the material is positioned between a chip and a sub-mount, wherein, based at least in part on the heating, at least a portion of the UV curable resin is pushed toward a lateral exterior surface of the material during the heating to produce a layer of the UV curable resin on the sintered silver particles; cooling the UV curable resin on the sintered silver particles; and irradiating, with UV light and after the cooling, the UV curable resin to cure the UV curable resin and obtain a polymer on the sintered silver particles, as in the claim.
Any comments considered necessary by applicant must be submitted no later than the payment of the issue fee and, to avoid processing delays, should preferably accompany the issue fee.  Such submissions should be clearly labeled “Comments on Statement of Reasons for Allowance.”
Conclusion

CITED REFERENCE SUMMARIES: Ref US20110290863A1: Claims:
A sintering silver paste material comprising approximately spherical silver particles and an organic silver complex kneaded together into a slurry state. 2. The sintering silver paste material according to claim 1, wherein the approximately spherical silver particles have an average particle size of 0.1 to 2.0 μm. 3. The sintering silver paste material according to claim 1, wherein the paste material further comprises an organic solvent which dissolves the organic silver complex and is kneaded into a slurry state. 4. The sintering silver paste material according to claim 3, wherein the paste material comprises 80 to 90 wt % of the approximately spherical silver particles having an average particle size of 0.1 to 2.0 μm; 5 to 20 wt % of the organic silver complex; and 0 to 10 wt % of the organic solvent having a boiling point of 150° C. or higher and comprising C, H and O. 5. The sintering silver paste material according to claim 3, wherein the organic silver complex is a solution containing a liquid fatty acid silver salt compound or a solid fatty acid silver salt dissolved in an organic solvent having a boiling point of 150° C. or higher and comprising C, H and O, and a silver content in the whole liquid component is 30 wt % or more. 6. The sintering silver paste material according to claim 1, wherein the paste material further comprises 0 to 10 wt % of highly electroconductive particles having an average particle size of 10 to 500 μm and is kneaded into a slurry state. 7. The sintering silver paste material according to claim 6, wherein the highly electroconductive particle comprises any of Ag, Cu, Al, Mg, Ni, Mo and W as a core particle, and the outermost surface of the core particle comprises any material of Ag, Au and Pd. 8. The sintering silver paste material according to claim 1, wherein the paste material comprises 0 to 2 wt % of resin particles having an average particle size of 10 to 500 μm and having a precious metal film formed on the surface and is kneaded into a slurry state. 9. A method for bonding a semiconductor chip for die-bonding a semiconductor chip to a die pad, comprising: supplying a sintering silver paste material comprising approximately spherical silver particles and an organic silver complex kneaded together into a slurry state, onto a die pad having an Ni surface; mounting a semiconductor chip on the sintering silver paste material while pushing the chip onto the paste material; heating the paste material to 300 to 500° C. in a reducing atmosphere; and heating the paste material to 180 to 300° C. in an oxidizing atmosphere. 10. The method for bonding a semiconductor chip according to claim 9, comprising: applying the organic silver complex onto the die pad having an Ni surface, and supplying the sintering silver paste material onto the organic silver complex. 11. A method for bonding a semiconductor chip for die-bonding a semiconductor chip to a die pad, comprising: supplying a sintering silver paste material comprising approximately spherical silver particles and an organic silver complex kneaded together into a slurry state, onto a die pad having a Cu surface; mounting a semiconductor chip on the sintering silver paste material while pushing the chip onto the paste material; heating the paste material to 300 to 500° C. in a reducing atmosphere; heating the paste material to 180 to 300° C. in an oxidizing atmosphere; and heating the paste material to 200 to 400° C. in a reducing atmosphere. 12. The method for bonding a semiconductor chip according to claim 11, comprising: applying the organic silver complex onto the die pad having a Cu surface, and supplying the sintering silver paste material onto the organic silver complex.
A sintering silver paste material comprising approximately spherical silver particles and an organic silver complex kneaded together into a slurry state.
The sintering silver paste material according to claim 1, wherein the approximately spherical silver particles have an average particle size of 0.1 to 2.0 μm.
The sintering silver paste material according to claim 1, wherein the paste material further comprises an organic solvent which dissolves the organic silver complex and is kneaded into a slurry state.
The sintering silver paste material according to claim 3, wherein the paste material comprises 80 to 90 wt % of the approximately spherical silver particles having an average particle size of 0.1 to 2.0 μm; 5 to 20 wt % of the organic silver complex; and 0 to 10 wt % of the organic solvent having a boiling point of 150° C. or higher and comprising C, H and O.
The sintering silver paste material according to claim 3, wherein the organic silver complex is a solution containing a liquid fatty acid silver salt compound or a solid fatty acid silver salt dissolved in an organic solvent having a boiling point of 150° C. or higher and comprising C, H and O, and a silver content in the whole liquid component is 30 wt % or more.
The sintering silver paste material according to claim 1, wherein the paste material further comprises 0 to 10 wt % of highly electroconductive particles having an average particle size of 10 to 500 μm and is kneaded into a slurry state.
The sintering silver paste material according to claim 6, wherein the highly electroconductive particle comprises any of Ag, Cu, Al, Mg, Ni, Mo and W as a core particle, and the outermost surface of the core particle comprises any material of Ag, Au and Pd.
The sintering silver paste material according to claim 1, wherein the paste material comprises 0 to 2 wt % of resin particles having an average particle size of 10 to 500 μm and having a precious metal film formed on the surface and is kneaded into a slurry state.
A method for bonding a semiconductor chip for die-bonding a semiconductor chip to a die pad, comprising: supplying a sintering silver paste material comprising approximately spherical silver particles and an organic silver complex kneaded together into a slurry state, onto a die pad having an Ni surface; mounting a semiconductor chip on the sintering silver paste material while pushing the chip onto the paste material; heating the paste material to 300 to 500° C. in a reducing atmosphere; and heating the paste material to 180 to 300° C. in an oxidizing atmosphere.
The method for bonding a semiconductor chip according to claim 9, comprising: applying the organic silver complex onto the die pad having an Ni surface, and supplying the sintering silver paste material onto the organic silver complex.
A method for bonding a semiconductor chip for die-bonding a semiconductor chip to a die pad, comprising: supplying a sintering silver paste material comprising approximately spherical silver particles and an organic silver complex kneaded together into a slurry state, onto a die pad having a Cu surface; mounting a semiconductor chip on the sintering silver paste material while pushing the chip onto the paste material; heating the paste material to 300 to 500° C. in a reducing atmosphere; heating the paste material to 180 to 300° C. in an oxidizing atmosphere; and heating the paste material to 200 to 400° C. in a reducing atmosphere.
The method for bonding a semiconductor chip according to claim 11, comprising: applying the organic silver complex onto the die pad having a Cu surface, and supplying the sintering silver paste material onto the organic silver complex.
Ref US20170267899A1: Claims:
What is claimed is: 1. A process for preparing an electrically conductive, adhesive tape comprising: (a) providing an article comprising a substrate and a network of electrically conductive metal traces defining cells that are transparent to visible light on the substrate; (b) embedding the network of electrically conductive traces in a polymer matrix having a surface on which a pressure sensitive adhesive is deposited; and (c) removing the substrate to form the electrically conductive, adhesive tape. 2. The process of claim 1, comprising: (a) applying a UV-polymerizable composition onto the network of electrically conductive traces; (b) applying the pressure sensitive adhesive onto the UV-polymerizable composition; and (c) exposing the UV-polymerizable composition to ultraviolet radiation to polymerize the composition and form the polymer matrix in which the network of electrically conductive traces is embedded. 3. The process of claim 1, comprising: (a) applying a UV-polymerizable composition onto the network of electrically conductive traces; (b) exposing the UV-polymerizable composition to ultraviolet radiation to polymerize the composition and form the polymer matrix in which the network of electrically conductive traces is embedded; and (c) applying the pressure sensitive adhesive onto the polymer matrix in which the network of electrically conductive traces is embedded. 4. The process of claim 1, wherein the metal traces comprise a metal base and at least one electroplated or electrolessly plated metal layer over the metal base. 5. The process of claim 1, wherein the traces comprise at least partially joined metal nanoparticles. 6. An electrically conductive adhesive tape prepared according to the method of claim 1. 7. An electrically conductive adhesive tape comprising: (a) a polymer matrix having a first surface and a second surface; (b) a network of electrically conductive metal traces defining cells that are transparent to visible light embedded in the polymer matrix; and (c) a pressure sensitive adhesive deposited onto the second surface of the polymer matrix, wherein the network of electrically conductive metal traces is exposed on the first surface of the polymer matrix. 8. An electrically conductive adhesive tape according to claim 7 wherein the conductive metal traces comprise at least partially joined metal nanoparticles. 9. An electrically conductive adhesive tape according to claim 8 wherein the metal nanoparticles comprise silver nanoparticles. 10. An electrically conductive adhesive tape according to claim 7 wherein the polymer matrix comprises a cured (meth)acrylic resin. 11. An electrically conductive adhesive tape according to claim 7 wherein the visible light transmittance of the tape is greater than 60%. 12. An electrically conductive adhesive tape according to claim 7 wherein the visible light transmittance of the tape is greater than 70%. 13. An electrically conductive adhesive tape according to claim 7 wherein the visible light transmittance of the tape is greater than 75%. 14. An electrically conductive adhesive tape according to claim 7 wherein the sheet resistance of the tape is less than 10 Ohms/square. 15. An electrically conductive adhesive tape according to claim 7 wherein the sheet resistance of the tape is less than 1 Ohm/square. 16. An electrically conductive adhesive tape according to claim 7 wherein the sheet resistance of the tape is less than 0.1 Ohm/square. 17. An electrically conductive adhesive tape according to claim 7 wherein the overall thickness of the tape is less than 50 μm. 18. An electrically conductive adhesive tape according to claim 7 wherein the overall thickness of the tape is less than 30 μm. 19. An electrically conductive adhesive tape according to claim 7 wherein the overall thickness of the tape is less than 15 μm.
A process for preparing an electrically conductive, adhesive tape comprising: (a) providing an article comprising a substrate and a network of electrically conductive metal traces defining cells that are transparent to visible light on the substrate; (b) embedding the network of electrically conductive traces in a polymer matrix having a surface on which a pressure sensitive adhesive is deposited; and (c) removing the substrate to form the electrically conductive, adhesive tape.
The process of claim 1, comprising: (a) applying a UV-polymerizable composition onto the network of electrically conductive traces; (b) applying the pressure sensitive adhesive onto the UV-polymerizable composition; and (c) exposing the UV-polymerizable composition to ultraviolet radiation to polymerize the composition and form the polymer matrix in which the network of electrically conductive traces is embedded.
The process of claim 1, comprising: (a) applying a UV-polymerizable composition onto the network of electrically conductive traces; (b) exposing the UV-polymerizable composition to ultraviolet radiation to polymerize the composition and form the polymer matrix in which the network of electrically conductive traces is embedded; and (c) applying the pressure sensitive adhesive onto the polymer matrix in which the network of electrically conductive traces is embedded.
The process of claim 1, wherein the metal traces comprise a metal base and at least one electroplated or electrolessly plated metal layer over the metal base.
The process of claim 1, wherein the traces comprise at least partially joined metal nanoparticles.
An electrically conductive adhesive tape prepared according to the method of claim 1.
An electrically conductive adhesive tape comprising: (a) a polymer matrix having a first surface and a second surface; (b) a network of electrically conductive metal traces defining cells that are transparent to visible light embedded in the polymer matrix; and (c) a pressure sensitive adhesive deposited onto the second surface of the polymer matrix, wherein the network of electrically conductive metal traces is exposed on the first surface of the polymer matrix.
An electrically conductive adhesive tape comprising: (a) a polymer matrix having a first surface and a second surface; (b) a network of electrically conductive metal traces defining cells that are transparent to visible light embedded in the polymer matrix; and (c) a pressure sensitive adhesive deposited onto the second surface of the polymer matrix,
wherein the network of electrically conductive metal traces is exposed on the first surface of the polymer matrix.
An electrically conductive adhesive tape according to claim 7 wherein the conductive metal traces comprise at least partially joined metal nanoparticles.
An electrically conductive adhesive tape according to claim 8 wherein the metal nanoparticles comprise silver nanoparticles.
An electrically conductive adhesive tape according to claim 7 wherein the polymer matrix comprises a cured (meth)acrylic resin.
An electrically conductive adhesive tape according to claim 7 wherein the visible light transmittance of the tape is greater than 60%.
An electrically conductive adhesive tape according to claim 7 wherein the visible light transmittance of the tape is greater than 70%.
An electrically conductive adhesive tape according to claim 7 wherein the visible light transmittance of the tape is greater than 75%.
An electrically conductive adhesive tape according to claim 7 wherein the sheet resistance of the tape is less than 10 Ohms/square.
An electrically conductive adhesive tape according to claim 7 wherein the sheet resistance of the tape is less than 1 Ohm/square.
An electrically conductive adhesive tape according to claim 7 wherein the sheet resistance of the tape is less than 0.1 Ohm/square.
An electrically conductive adhesive tape according to claim 7 wherein the overall thickness of the tape is less than 50 μm.
An electrically conductive adhesive tape according to claim 7 wherein the overall thickness of the tape is less than 30 μm.
An electrically conductive adhesive tape according to claim 7 wherein the overall thickness of the tape is less than 15 μm.
Ref US6245827B1: Claims:
A liquid resin composition curable by ultraviolet light comprising:
a) from 25 to 95% by weight of a liquid resin selected from the group consisting of cycloaliphatic expoxides, vinyl ethers and mixtures thereof with epoxy polyolefins,
b) when component (a) contains a cycloaliphatic epoxide, from 1 to 70% by weight of a hydroxy-functional material that will react with the liquid resin of component a);
c) from 0.1 to 10% by weight of one or more iodonium salts that produce Lewis acid upon the application of ultraviolet light;
d) from 0.1 to 5.0% by weight of one or more alpha-hydroxy-ketones which sensitizes component c) to increase its reactivity and
e) from 0.2 to 5.0% by weight of an organic peroxide that has a ten hour half-life at about 65Â° C. to 110Â° C.
The composition of claim 1 wherein the resin of subparagraph a) is a cycloaliphatic expoxide.
The composition of claim 2 wherein the hydroxy-functional material of subparagraph b) has a hydroxyl functionality of at least 1.
The composition of claim 1 wherein the iodonium salt is diaryl iodonium hexafluoroantimonate.
The composition of claim 1 where the material of subparagraph d) is selected from the group consisting of 1-hydroxylcyclohexyl ketone (C 13 H 16 O 2 ) and 2-hydroxyl-2-methyl-phenyl-propane-1 ketone (C 10 H 12 O 2 ).
a) from 80 to 99.6% by weight of a liquid resin selected from the group of vinyl ethers and mixtures thereof with epoxy polyolefins,
b) from 0.1 to 10% by weight of one or more iodonium salts that produce Lewis acid upon the application of ultraviolet light;
c) from 0.1 to 5.0% by weight of one or more alpha-hydroxy-ketones which sensitizes component c) to increase its reactivity; and
d) from 0.2 to 5.0% by weight of an organic peroxide that has a ten hour half-life at about 65Â° C. to 110Â° C.
The composition of claim 6 wherein the cationic photoinitiator is diaryl iodonium hexafluorantimonate.
The composition of claim 6 where the of subparagraph c) is selected from the group consisting of 1-hydroxylcyclohexyl ketone (C 13 H 16 O 2 ) and 2-hydroxyl-2-methyl-phenyl-propane-1 ketone (C 10 H 12 O 2 ).
b) when component (a) contains a cycloaliphatic epoxide, from 1 to 70% by weight of a hydroxy-functional material that will react with the liquid resin of component a) selected from the group consisting of alkanols, monoalkyl ethers of polyoxyalkyleneglycols, monoalkyl ethers of alkylene-glycols, polycaprolactones and mixtures thereof;
c) from 0.1 to 10% by weight of one or more iodonium salts;
d) from 0.1 to 5.0% by weight of one or more alpha-hydroxy-ketones and
e) from 0.2 to 5.0% by weight of a peroxide selected from the group consisting of 1,1-di(t-butylperoxyl-cyclohexane) and 1,1-di(t-amyperoxyl-cyclohexane).
The composition of claim 9 wherein the resin of subparagraph a) is a cycloaliphatic expoxide.
The composition of claim 9 wherein the hydroxy-functional material of subparagraph b) has a hydroxyl functionality of at least 1.
The composition of claim 9 wherein the iodonium salt is diaryl iodonium hexafluoroantimonate.
The composition of claim 9 where the alpha-hydroxy ketone of subparagraph d) is selected from the group of 1-hydroxycyclohexyl ketone (C 13 H 16 O 2 ) and 2-hydroxyl-2-methyl-phenyl-propane-1 ketone (C 10 H 12 O 2 ).
A composition of matter comprising:
a) from 0.1 to 10% by weight of one or more iodonium salts that produce Lewis acid upon the application of ultraviolet light,
b) from 0.1 to 5.0% by weight of one or more alpha-hydroxy-ketones which sensitizes component c) to increase its reactivity and
c) from 0.2 to 5.0% by weight of an organic peroxide that has a ten hour half-life at about 65Â° C. to 110Â° C.
The composition of claim 14 wherein the iodonium salt is diaryl iodonium hexafluoroantimonate.
The composition of claim 14 where one of the alpha-hydroxy-ketones is selected from the group consisting of 1-hydroxycyclohexyl ketone (C 13 H 16 O 2 ) and 2-hydroxyl-2-methyl-phenyl-propane-1 ketone (C 10 H 12 O 2 ).
The composition of claim 14 wherein the organic peroxide of subparagraph c) is 1,1-di(t-butylperoxyl cyclohexane).