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Chip Quik Smooth Flow Lead-Free Solder Paste SAC305 T4 50g Jar
Smooth FlowTM Technology Developed with a lower density flux vehicle for better shear spread and improved flow during heating Halogen Free test method) Alloy Flux Type Synthetic No-Clean Flux Classification ROL0 Metal Content 88.25% metal by weight. Particle Size T4 (20-38 microns) Melting Point Size 50g jar Shelf Life Refrigerated >6 months, unrefrigerated >2 months Stencil Life >8 hours @ 20-50% RH 22-28C >4 hours @ 50-70% RH 22-28C Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA

Price is $14.00

Price: $13.95