# Overview

Resources with overviews of materials and their most prominent uses:
* Semiconductor materials
* Ioffe NSM data archive
* overview of microfabrication materials
* overview of microfabrication materials
* Semiconductor materials
* polymers

## Overview table of microfabrication materials

Microfabrication Materials Overview Table :
| Material | Typical use | Density [g/cm3] | Atm. Mass[g/mol] | Youngs Modulus[GPa] | Shear modulus [GPa] | El. Conductivity | Therm. Cond.[W·m$^{−1}$·K−1] | Melting point[K] | Notes |
| Aluminium | Leads | 2.70 | 26.98 | 70 | 26 | 26.50 nΩ·m | 237 | 933.47 K (660.32 °C) | Add notes |
| Gallium Arsenide | Light emitter | 5.3176 | 144.645 | youngs | bulk | el. | therm. | 1238°C (1511 K) | Bandgap 1.424 eV |
| Gallium Nitride | Blue Light emitter | 6.1 | 83.7297 | youngs | bulk | el. | therm. | K ( °C) | Add notes |
| Polysilicon | solar cells | den | amu | youngs | bulk | el. | therm. | K ( °C) | highly dependent on doping and annealing. Se detailed table in the silicon section |
| Silicon | Wafers, semiconductor | 2.33 | 28.0855(3) | 47 | bulk | el. | 149 | 1687 K (1414 °C) | highly dependent on doping. Se detailed table in the silicon section |
| Silicon dioxide, silica | insulator, light waveguide | den | amu | youngs | bulk | el. | therm. | K ( °C) | Add notes |
| Silicon nitride | insulator | den | amu | youngs | bulk | el. | therm. | K ( °C) | Add notes |
| Gold | Coating of leads | 19.3 | 196.966569 | 78 | 220 | 22.14 nΩ·m | 318 | 1337.33 K (1064.18 °C) | Add notes |
| Nickel | MEMS, leads | den | amu | youngs | bulk | el. | therm. | K ( °C) | Add notes |
| Platinum | Contact pads | den | amu | youngs | bulk | el. | therm. | K ( °C) | Add notes |
| PMMA | 1.19 | 50.000-950.000 | youngs | bulk | el. | therm. | 378 K (105°C) glass trans. | Refractive index 1.492 |
| SU8 polymer | den | amu | youngs | bulk | el. | therm. | K ( °C) | Add notes |
| Tungsten | den | amu | youngs | bulk | el. | therm. | K ( °C) | Add notes |
This table should be merged with the above...
Metal Material Properties :
| | | Mechanical | Mechanical | Mechanical | Mechanical | Thermal | Thermal | Thermal | Electrical | Electrical |
| | | Yield Str. | Youngs. | Pois. | Density | Th. Cond. | Th. Exp. | Melting | El. cond. | α |
| Highest Z | Material | GPa | GPa | ? | kg/m³ | (W/cmK) | (ppm/K) | K | Ωm | promille/K |
| Metals | |
| 34 | Al | 0.17 | 70 | 0.34 | 2698 | 2.36 | 23 | 660 | 26.5*10?? | 4.3 |
| 55 | Au | ? | 78-80 | 0.44-0.25 | 19281 | 3.12 | 14 | 1064 | 23-22.1*10?? | 3.7 |
| 66 | Cr | ? | ? | ? | 7194 | ? | ? | 1860 | ? | |
| 55 | Ti | 0.23 | 116 | 0.32 | 4508 | 0.2 | 8.5 | 1670 | 420*10?? | 3.8 |
| 80 | Pt | 0.12 | 168 | 0.38 | 21450 | 0.73 | 8.9 | 1772 | 0.0981? | 3.9 |
| 78 | W | 0.12 | 411 | 0.28 | 19254 | 1.8 | 4.5 | 3387 | 0.0489? | 4.8 |
| 65 | Ag | ? | ? | ? | ? | ? | ? | 960 | 15.9*10?? | |
| 56 | Fe | 12.6 | 196 | 0.29 | 7873 | 0.803 | 11.7-12 | 1540 | 89E | 6.6 |
| Semimetals | |
| 12 | Graphite | ? | ? | ? | 2266 | ? | ? | 3700 | 7-60E | -0.4 |
| Semiconductors | |
| 25 | Si intrinsic | 7 | 190 | ? | 2329 | 1.57 | 2.33 | 1410 | 2.5*10³ | |
| 25 | poly Si | ? | 150-170 | 0.3-0.066 | 2320 | 0.5-0.34 | 2.6 | ? | 22000 | |
| 25 | SiC | 21 | 700 | ? | 3200 | 3.5 | 3.3 | ? | ? | |
| 45 | InP | ? | 7.1E11 dyn cm-2 | ? | 4810 | 0.68 W cm-1 °C-1 | 4.60·10-6 °C-1 | 1060 | ? | |
| Insulators | |
| 12 | Diamond | 53 | 1035 | ? | 3500 | 20 | 1 | ? | 2.7 | |
| 34 | Al2O3 | 15.4 | 530 | ? | 4000 | 0.5 | 5.4 | ? | ? | |
| 25 | SiO2 (bulk) | 8.4 | 73 | ? | 25-2150 | 0.014 | 0.55 | ? | E-12 | |

### Units

* 1 g/cm3 = 1 kg/L = 1000 kg/m3
* g/mol = amu = Da

# Applications and Uses

* Microprocessors
* Transistors
* Lab-on-a-chip
* MEMS

# Product Life-Cycles

Cheap and disposable point-of-care microfluidic chips require very different materials compared to high performance microprocessors.

# Environmental Considerations

The environmental footprint of microfabriaction is not discussed very often. If anyone has knowledge about this I hope they will contribute!!

# Wafers and Substrates

Overview of wafer types, flats, cleaving planes etc.

# References

See also notes on editing this book about how to add references Microtechnology/About#How to Contribute.