# Zen+

Zen+ is the name for a computer processor microarchitecture by AMD. It is the successor to the first gen Zen microarchitecture, and was first released in April 2018, powering the second generation of Ryzen processors, known as Ryzen 2000 for mainstream desktop systems, Threadripper 2000 for high-end desktop setups and Ryzen 3000G (instead of 2000G) for accelerated processing units (APUs).

## Features

Zen+ uses GlobalFoundries' 12 nm fabrication process, an optimization of the 14 nm process used for Zen, with only minor design rule changes. This means that the die sizes between Zen and Zen+ are identical as AMD chose to use the new smaller transistors to increase the amount of empty space, or "dark silicon", between the various features on the die. This was done to improve power efficiency & reduce thermal density to allow for higher clock speeds, rather than design an entirely new floorplan for a physically smaller die (which would have been significantly more work and thus more expensive). These process optimizations allowed 12 nm Zen+ to clock about +250 MHz (≈6%) higher, or to lower power consumption when at the same frequency by 10%, when compared to their prior 14 nm Zen products. Although conversely at the microarchitecture level, Zen+ had only minor revisions versus Zen. Known changes to the microarchitecture include improved clock speed regulation in response to workload ("Precision Boost 2"), reduced cache and memory latencies (some significantly so), increased cache bandwidth, and finally improved IMC performance allowing for better DDR4 memory support (officially JEDEC rated to support up to 2933 MHz compared to just 2666 MHz on the prior Zen core), and fixed many hardware bugs found on Zen 1, such as fTPM / PSP bugs on Zen 1, and SVM / SLAT bugs on Zen 1.
Zen+ also supports improvements in the per-core clocking features, based on core utilization and CPU temperatures. These changes to the core utilization, temperature, and power algorithms are branded as "Precision Boost 2" and "XFR2" ("eXtended Frequency Range 2"), evolutions of the first-generation technologies in Zen. On Zen, XFR gave an additional 50 to 200 MHz clock speed increase (in 25 MHz increments) over the maximum Precision Boost clocks. For Zen+, XFR2 is no longer listed as a separate clock modifier. Instead, the XFR temperature, power, and clock monitoring and logic feeds into the Precision Boost 2 algorithm to adjust clocks and power consumption opportunistically and dynamically.
Ultimately, the changes in Zen+ resulted in a 3% improvement in IPC over Zen; which in conjunction with 6% higher clock speeds resulted in up to 10% overall increase in performance.

## Feature tables
### APUs

APU features table

## Products
### Desktop CPUs

Common features of Ryzen 2000 desktop CPUs:
* Socket: AM4.
* All the CPUs support DDR4-2933 in dual-channel mode, except for R7 2700E, R5 2600E, R5 1600AF and R3 1200AF which support it at DDR4-2666 speeds.
* All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
* No integrated graphics.
* L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
* L2 cache: 512 KB per core.
* Fabrication process: GlobalFoundries 12LP (14LP+).
| Branding and Model | Branding and Model | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | TDP | Core config | Release date | Launch price |
| Branding and Model | Branding and Model | Cores (threads) | Base | PB2 | L3 cache (total) | TDP | Core config | Release date | Launch price |
| Ryzen 7 | 2700X | 8 (16) | 3.7 | 4.3 | 16 MB | 105 W | 2 × 4 | April 19, 2018 | US $329 |
| Ryzen 7 | 2700 | 8 (16) | 3.2 | 4.1 | 16 MB | 65 W | 2 × 4 | April 19, 2018 | US $299 |
| Ryzen 7 | 2700E | 8 (16) | 2.8 | 4.0 | 16 MB | 45 W | 2 × 4 | September 19, 2018 | OEM |
| Ryzen 5 | 2600X | 6 (12) | 3.6 | 4.2 | 16 MB | 95 W | 2 × 3 | April 19, 2018 | US $229 |
| Ryzen 5 | 2600 | 6 (12) | 3.4 | 3.9 | 16 MB | 65 W | 2 × 3 | April 19, 2018 | US $199 |
| Ryzen 5 | 2600E | 6 (12) | 3.1 | 4.0 | 16 MB | 45 W | 2 × 3 | September 19, 2018 | OEM |
| Ryzen 5 | 1600 (AF) | 6 (12) | 3.2 | 3.6 | 16 MB | 65 W | 2 × 3 | October 11, 2019 | US $85 |
| Ryzen 5 | 2500X | 4 (8) | 3.6 | 4.0 | 8 MB | 65 W | 1 × 4 | September 10, 2018 | OEM |
| Ryzen 3 | 2300X | 4 (4) | 3.5 | 4.0 | 8 MB | 65 W | 1 × 4 | September 10, 2018 | OEM |
| Ryzen 3 | 1200 (AF) | 4 (4) | 3.1 | 3.4 | 8 MB | 65 W | 1 × 4 | April 21, 2020 | US $60 |
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* ↑ Core Complexes (CCX) × cores per CCX
* ↑ Manufacturer suggested retail price at launch
* 1 2 3 Model also available as PRO version as 2600, 2700, 2700X, released on September 19, 2018.
* 1 2 AF models are 12 nm Zen+ refresh of 14 nm Zen models (1200 and 1600 with "AF" instead of "AE" in the part numbers).
* "AMD Ryzen 3 1200". AMD. Retrieved October 9, 2022.
* "AMD Ryzen 5 1600". AMD. Retrieved October 9, 2022.
Common features of Ryzen 2000 HEDT CPUs:
* Socket: TR4.
* All the CPUs support DDR4-2933 in quad-channel mode.
* All the CPUs support 64 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
* No integrated graphics.
* L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
* L2 cache: 512 KB per core.
* Fabrication process: GlobalFoundries 12LP (14LP+).
| Branding and Model | Branding and Model | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | TDP | Chiplets | Core config | Release date | Launch price |
| Branding and Model | Branding and Model | Cores (threads) | Base | PB2 | L3 cache (total) | TDP | Chiplets | Core config | Release date | Launch price |
| Ryzen Threadripper | 2990WX | 32 (64) | 3.0 | 4.2 | 64 MB | 250 W | 4 × CCD | 8 × 4 | Aug 13, 2018 | US $1799 |
| Ryzen Threadripper | 2970WX | 24 (48) | 3.0 | 4.2 | 64 MB | 250 W | 4 × CCD | 8 × 3 | Oct 2018 | US $1299 |
| Ryzen Threadripper | 2950X | 16 (32) | 3.5 | 4.4 | 32 MB | 180 W | 2 × CCD | 4 × 4 | Aug 31, 2018 | US $899 |
| Ryzen Threadripper | 2920X | 12 (24) | 3.5 | 4.3 | 32 MB | 180 W | 2 × CCD | 4 × 3 | Oct 2018 | US $649 |
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* ↑ Manufacturer suggested retail price at launch
* ↑ Core Complexes (CCX) × cores per CCX

### Desktop APUs

Common features of Zen+ based desktop APUs:
* Socket: AM4.
* All the CPUs support DDR4-2933 in dual-channel mode, while Athlon Pro 300GE and Athlon Silver Pro 3125GE support only DDR4-2666.
* L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
* L2 cache: 512 KB per core.
* All the CPUs support 16 PCIe 3.0 lanes.
* Includes integrated GCN 5th generation GPU.
* Fabrication process: GlobalFoundries 12LP.
| Model | CPU | CPU | CPU | CPU | GPU | GPU | GPU | GPU | TDP | Release date | Release price |
| Model | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | Model | Config | Clock (MHz) | Processing power (GFLOPS) | TDP | Release date | Release price |
| Model | Cores (threads) | Base | Boost | L3 cache (total) | Model | Config | Clock (MHz) | Processing power (GFLOPS) | TDP | Release date | Release price |
| Athlon Pro 300GE | 2 (4) | 3.4 | — | 4 MB | Vega 3 | 192:12:4 3 CU | 1100 | 424.4 | 35 W | Sep 30, 2019 | OEM |
| Athlon Silver Pro 3125GE | 2 (4) | 3.4 | — | 4 MB | Radeon Graphics | 192:12:4 3 CU | 1100 | 424.4 | 35 W | Jul 21, 2020 | OEM |
| Athlon Gold 3150GE | 4 (4) | 3.3 | 3.8 | 4 MB | Radeon Graphics | 192:12:4 3 CU | 1100 | 424.4 | 35 W | Jul 21, 2020 | OEM |
| Athlon Gold Pro 3150GE | 4 (4) | 3.3 | 3.8 | 4 MB | Radeon Graphics | 192:12:4 3 CU | 1100 | 424.4 | 35 W | Jul 21, 2020 | OEM |
| Athlon Gold 3150G | 4 (4) | 3.5 | 3.9 | 4 MB | Radeon Graphics | 192:12:4 3 CU | 1100 | 424.4 | 65 W | Jul 21, 2020 | OEM |
| Athlon Gold Pro 3150G | 4 (4) | 3.5 | 3.9 | 4 MB | Radeon Graphics | 192:12:4 3 CU | 1100 | 424.4 | 65 W | Jul 21, 2020 | OEM |
| Ryzen 3 3200GE | 4 (4) | 3.3 | 3.8 | 4 MB | Vega 8 | 512:32:16 8 CU | 1200 | 1228.8 | 35 W | Jul 7, 2019 | OEM |
| Ryzen 3 Pro 3200GE | 4 (4) | 3.3 | 3.8 | 4 MB | Vega 8 | 512:32:16 8 CU | 1200 | 1228.8 | 35 W | Sep 30, 2019 | OEM |
| Ryzen 3 3200G | 4 (4) | 3.6 | 4.0 | 4 MB | Vega 8 | 512:32:16 8 CU | 1250 | 1280 | 65 W | Jul 7, 2019 | US $99 |
| Ryzen 3 Pro 3200G | 4 (4) | 3.6 | 4.0 | 4 MB | Vega 8 | 512:32:16 8 CU | 1250 | 1280 | 65 W | Sep 30, 2019 | OEM |
| Ryzen 5 Pro 3350GE | 4 (4) | 3.3 | 3.9 | 4 MB | Radeon Graphics | 640:40:16 10 CU | 1200 | 1536 | 35 W | Jul 21, 2020 | OEM |
| Ryzen 5 Pro 3350G | 4 (8) | 3.6 | 4.0 | 4 MB | Radeon Graphics | 640:40:16 10 CU | 1300 | 1830.4 | 65 W | Jul 21, 2020 | OEM |
| Ryzen 5 3400GE | 4 (8) | 3.3 | 4.0 | 4 MB | Vega 11 | 704:44:16 11 CU | 1300 | 1830.4 | 35 W | Jul 7, 2019 | OEM |
| Ryzen 5 Pro 3400GE | 4 (8) | 3.3 | 4.0 | 4 MB | Vega 11 | 704:44:16 11 CU | 1300 | 1830.4 | 35 W | Sep 30, 2019 | OEM |
| Ryzen 5 3400G | 4 (8) | 3.7 | 4.2 | 4 MB | RX Vega 11 | 704:44:16 11 CU | 1400 | 1971.2 | 65 W | Jul 7, 2019 | US $149 |
| Ryzen 5 Pro 3400G | 4 (8) | 3.7 | 4.2 | 4 MB | Vega 11 | 704:44:16 11 CU | 1400 | 1971.2 | 65 W | Sep 30, 2019 | OEM |
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* ↑ Starting with 2020 releases, AMD stopped referring to integrated graphics as "Vega", therefore all Vega based iGPUs are branded as AMD Radeon Graphics (instead Radeon Vega 3 or Radeon Vega 10).
* ↑ Unified shaders : Texture mapping units : Render output units and Compute units (CU)
* ↑ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

### Mobile APUs

Common features of Ryzen 3000 notebook APUs:
* Socket: FP5.
* All the CPUs support DDR4-2400 in dual-channel mode.
* L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
* L2 cache: 512 KB per core.
* All the CPUs support 16 PCIe 3.0 lanes.
* Includes integrated GCN 5th generation GPU.
* Fabrication process: GlobalFoundries 12LP (14LP+).
| Branding and Model | Branding and Model | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | GPU | TDP | Release date |
| Branding and Model | Branding and Model | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | Core config | Model | Clock (GHz) | Config | Processing power (GFLOPS) | TDP | Release date |
| Branding and Model | Branding and Model | Cores (threads) | Base | Boost | L3 cache (total) | Core config | Model | Clock (GHz) | Config | Processing power (GFLOPS) | TDP | Release date |
| Ryzen 7 | 3780U | 4 (8) | 2.3 | 4.0 | 4 MB | 1 × 4 | RX Vega 11 | 1.4 | 704:44:16 11 CU | 1971.2 | 15 W | Oct 2019 |
| Ryzen 7 | 3750H | 4 (8) | 2.3 | 4.0 | 4 MB | 1 × 4 | RX Vega 10 | 1.4 | 640:40:16 10 CU | 1792.0 | 35 W | Jan 6, 2019 |
| Ryzen 7 | 3700C | 4 (8) | 2.3 | 4.0 | 4 MB | 1 × 4 | RX Vega 10 | 1.4 | 640:40:16 10 CU | 1792.0 | 15 W | Sep 22, 2020 |
| Ryzen 7 | 3700U | 4 (8) | 2.3 | 4.0 | 4 MB | 1 × 4 | RX Vega 10 | 1.4 | 640:40:16 10 CU | 1792.0 | 15 W | Jan 6, 2019 |
| Ryzen 5 | 3580U | 4 (8) | 2.1 | 3.7 | 4 MB | 1 × 4 | Vega 9 | 1.3 | 576:36:16 9 CU | 1497.6 | 15 W | Oct 2019 |
| Ryzen 5 | 3550H | 4 (8) | 2.1 | 3.7 | 4 MB | 1 × 4 | Vega 8 | 1.2 | 512:32:16 8 CU | 1228.8 | 35 W | Jan 6, 2019 |
| Ryzen 5 | 3500C | 4 (8) | 2.1 | 3.7 | 4 MB | 1 × 4 | Vega 8 | 1.2 | 512:32:16 8 CU | 1228.8 | 15 W | Sep 22, 2020 |
| Ryzen 5 | 3500U | 4 (8) | 2.1 | 3.7 | 4 MB | 1 × 4 | Vega 8 | 1.2 | 512:32:16 8 CU | 1228.8 | 15 W | Jan 6, 2019 |
| Ryzen 5 | 3450U | 4 (8) | 2.1 | 3.5 | 4 MB | 1 × 4 | Vega 8 | 1.2 | 512:32:16 8 CU | 1228.8 | 15 W | Jun 2020 |
| Ryzen 3 | 3350U | 4 (4) | 2.1 | 3.5 | 4 MB | 1 × 4 | Vega 6 | 1.2 | 384:24:8 6 CU | 921.6 | 15 W | Jan 6, 2019 |
| Ryzen 3 | 3300U | 4 (4) | 2.1 | 3.5 | 4 MB | 1 × 4 | Vega 6 | 1.2 | 384:24:8 6 CU | 921.6 | 15 W | Jan 6, 2019 |
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* ↑ Core Complexes (CCX) × cores per CCX
* ↑ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
* ↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
* 1 2 3 Model also available as PRO version, released April 8, 2019.
* "AMD Ryzen 3 PRO 3300U Mobile Processor with Radeon Vega 6 Graphics".
* "AMD Ryzen 5 PRO 3500U Mobile Processor with Radeon Vega 8 Graphics".
* "AMD Ryzen 7 PRO 3700U Mobile Processor with Radeon Vega 10 Graphics".

### Embedded APUs

In 2022, AMD announced the R2000 series of embedded APUs.
| Model | Release date | Fab | CPU | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | GPU | Socket | PCIe support | Memory support | TDP |
| Model | Release date | Fab | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | Cache | Cache | Cache | Archi- tecture | Config | Clock (GHz) | Processing power (GFLOPS) | Socket | PCIe support | Memory support | TDP |
| Model | Release date | Fab | Cores (threads) | Base | Boost | L1 | L2 | L3 | Archi- tecture | Config | Clock (GHz) | Processing power (GFLOPS) | Socket | PCIe support | Memory support | TDP |
| R2312 | June 7, 2022 | GloFo 12LP | 2 (4) | 2.7 | 3.5 | 64 KB inst. 32 KB data per core | 512 KB per core | 4 MB | GCN 5 | 192:12:4 3 CU | 1.2 | 460.8 | FP5 | 8 lanes Gen 3 | DDR4-2400 dual-channel ECC | 10–25 W |
| R2314 | June 7, 2022 | GloFo 12LP | 4 (4) | 2.1 | 3.5 | 64 KB inst. 32 KB data per core | 512 KB per core | 4 MB | GCN 5 | 384:24:8 6 CU | 1.2 | 921.6 | FP5 | 16 lanes Gen 3 | DDR4-2666 dual-channel ECC | 10–35 W |
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* ↑ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
* ↑ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.