# List of Qualcomm Snapdragon systems on chips

This is a list of Qualcomm Snapdragon systems on chips (SoC) made by Qualcomm for use in smartphones, tablets, laptops, 2-in-1 PCs, smartwatches, and smartbooks devices.

## Before Snapdragon

SoC made by Qualcomm before it was renamed to Snapdragon.
* MSM (Mobile Station Modem)
* QSC (Qualcomm Single Chip)
| Model number | Fab | CPU | GPU (or Gfx Core) | Connectivity | Sampling availability |
| QSC1xxx ||||||
| QSC1100 | 65 nm | ARM926EJ-S @ 96/128 MHz | | CDMA | Q4 2007 |
| QSC1110 | 65 nm | ARM926EJ-S @ 96/128 MHz | | CDMA | |
| QSC1105 | 65 nm | ARM926EJ-S @ 211 MHz | | CDMA | 2010 |
| QSC1215 | 65 nm | ARM926EJ-S @ 211 MHz | | CDMA | Q3 2012 |
| QSC6xxx ||||||
| QSC6010 | | ARMv5TEJ ARM926EJ-S | No 3D, ARM 2D | CDMA | 2006 |
| QSC6020 | | ARMv5TEJ ARM926EJ-S | No 3D, ARM 2D | CDMA | 2006 |
| QSC6030 | | ARMv5TEJ ARM926EJ-S | No 3D, ARM 2D | CDMA | 2006 |
| QSC6055 | 65 nm | ARM926EJ-S @ 192 MHz | No 3D, ARM 2D | HSDPA, 1xEV-DO | Q1 2007 |
| QSC6065 | 65 nm | ARM926EJ-S @ 192 MHz | No 3D, ARM 2D | HSDPA, 1xEV-DO | Q2 2007 |
| QSC6075 | 65 nm | ARM926EJ-S @ 192 MHz | No 3D, ARM 2D | 1xEV-DO Rev.0 | Q2 2007 |
| QSC6085 | 65 nm | ARM926EJ-S @ 192 MHz | No 3D, ARM 2D | 1xEV-DO Rev.A | Q4 2007 |
| QSC6155 | 45 nm | ARM1136JF-S @ 480 MHz w/ L2 | HVGA @30fps | GSM, EDGE, HSPA+ EV-DO Rev.0/A/B | 2008 |
| QSC6165 | | ARM1136JF-S @ 480 MHz w/ L2 | HVGA @30fps | GSM, EDGE, HSPA+ EV-DO Rev.0/A/B | 2008 |
| QSC6175 | | ARM1136JF-S @ 480 MHz w/ L2 | HVGA @30fps | GSM, EDGE, HSPA+ EV-DO Rev.0/A/B | 2008 |
| QSC6185 | | ARM1136JF-S @ 480 MHz w/ L2 | HVGA @30fps | GSM, EDGE, HSPA+ EV-DO Rev.0/A/B | 2008 |
| QSC6195 | | ARM1136JF-S @ 480 MHz w/ L2 | HVGA @30fps | GSM, EDGE, HSPA+ EV-DO Rev.0/A/B | 2008 |
| QSC6240 (ESC6240) | 65 nm | ARM926EJ-S @ 184/230 MHz | No 3D, ARM 2D | HSDPA | Q3 2007 |
| QSC6245-1 | 65 nm | ARM926EJ-S @ 184/230 MHz | No 3D, ARM 2D | HSDPA | Q3 2007 |
| QSC6260-1 | 65 nm | ARM926EJ-S @ 184/230 MHz | No 3D, ARM 2D | GSM, GPRS, EDGE, HSDPA | Q3 2007 |
| QSC6270 (ESC6270) | 65 nm | ARM926EJ-S @ 184/230 MHz | No 3D, ARM 2D | GSM, GPRS, EDGE, HSDPA | Q3 2007 |
| QSC6290 | 45 nm | ARM926EJ-S @ 300 MHz | WQVGA @15fps | HSUPA, UMTS | 2009 |
| QSC6285 | 45 nm | ARM1136JF-S @ 480 MHz w/ L2 | aDSP @ 160 MHz | CDMA 2000, GSM, GPRS, EDGE, EV-DO Rel.0, BT 3.0 | 2009 |
| QSC6295 (ESC6295) | 45 nm | ARM1136JF-S @ 480 MHz w/ L2 | aDSP @ 160 MHz | CDMA 2000, GSM, GPRS, EDGE, EV-DO Rel.0, BT 3.0 | 2009 |
| QSC6695 | 45 nm | ARM1136JF-S @ 480 MHz w/ L2 | aDSP @ 160 MHz | CDMA 2000, GSM, GPRS, EDGE, EV-DO Rel.0, BT 3.0 | 2009 |
| MSM3xxx ||||||
| MSM3000 | 350 nm | ARM7TDMI | | CDMA | Feb 1998 |
| MSM3100 | 350 nm | ARM7TDMI | | CDMA | Feb 1999 |
| MSM3300 | 350 nm | ARM7TDMI | | CDMA | 2000 |
| MSM5xxx ||||||
| MSM5000 | | ARM7TDMI | | CDMA 2000 | 2000 |
| MSM5100 | | ARM7TDMI @ 50 MHz | | CDMA, AMPS, PCS | 2002 |
| MSM5105 | | ARM7TDMI @ 27 MHz | | | |
| MSM5500 | | ARM7TDMI @ 50 MHz | | | |
| MSM6xxx ||||||
| MSM6000 | | ARM7TDMI @ 20 MHz | | CDMA | 2005 |
| MSM6025 | | | | CDMA | 2005 |
| MSM6050 | | ARM7TDMI @ 40 MHz | | CDMA | 2005 |
| MSM6100 | | ARM926EJ-S @ 146 MHz | ARM-DSP 3D, ARM 2D | CDMA | 2006 |
| MSM6125 | | ARM926EJ-S @ 146 MHz | ARM-DSP 3D, ARM 2D | CDMA | 2006 |
| MSM6150 | | | Defender2 3D, ARM 2D | CDMA | 2006 |
| MSM6175 | | | Defender2 3D, ARM 2D | | 2006 |
| MSM6225 | | | No 3D, ARM 2D | HSDPA | |
| MSM6250 | | ARM926EJ-S @ 180 MHz | ARM-DSP 3D, ARM 2D | WCDMA | 2006 |
| MSM6250A | | ARM926EJ-S @ 180 MHz | No 3D, ARM 2D | WCDMA | 2006 |
| MSM6245 | | ARM926EJ-S @ 180 MHz | No 3D, ARM 2D | WEDGE | 2006 |
| MSM6255A | | | No 3D, ARM 2D | WEDGE | 2006 |
| MSM6260 | | ARMv5TEJ ARM926EJ-S @ 225 MHz | ARM-DSP 3D, ARM 2D | HSUPA | 2006 |
| MSM6275 | | | Defender2 3D, ARM 2D | HSUPA | |
| MSM6280 | | | Defender2 3D, ARM 2D | HSUPA | |
| MSM6280A | | | Stargate 3D, ARM 2D | HSUPA | 2007 |
| MSM6500 | 130 nm | ARMv5TEJ ARM926EJ-S @ 150 MHz | ARM-DSP 3D, ARM 2D | 1xEV-DO Rev.0 | 2006 |
| MSM6575 | | | Defender3 3D, ARM 2D | 1xEV-DO Rev.0 | 2006 |
| MSM6550 | | ARMv5TEJ ARM926EJ-S @ 225 MHz | Defender2 3D, ARM 2D | 1xEV-DO Rev.0 | 2006 |
| MSM6550A | | ARMv5TEJ ARM926EJ-S @ 225 MHz | Defender2 3D, ARM 2D | 1xEV-DO Rev.0 | 2006 |
| MSM6800 | | ARM926EJ-S @ 270 MHz | Defender3 3D, ARM 2D | 1xEV-DO Rev.A | 2007 |
| MSM6800A | | ARM926EJ-S @ 270 MHz | Defender3 3D, ARM 2D | 1xEV-DO Rev.A | 2007 |
| MSM7xxx ||||||
| MSM7200 | 90 nm | ARM1136J-S @ 400 MHz | Imageon 2D, 3D | HSUPA | 2006 |
| MSM7200A | 90 nm | ARM1136J-S @ 528 MHz | Imageon 2D, 3D | HSUPA | Q1 2007 |
| MSM7201 | 90 nm | ARM1136JF-S @ 528 MHz | GPU Adreno 130 | HSDPA, HSUPA | 2008 |
| MSM7201A | 65 nm | ARM1136JF-S @ 528 MHz | GPU Adreno 130 | HSDPA, HSUPA | 2008 |
| MSM7500 | 90 nm | ARM1136JF-S @ 528 MHz | Imageon 2D, 3D Q3Dimension | 1xEV-DO Rev.A | 2006 |
| MSM7500A | 65 nm | ARM1136JF-S @ 528 MHz | Imageon 2D, 3D Q3Dimension | 1xEV-DO Rev.A | Q4 2007 |
| MSM7600 | 90 nm | ARM1136J-S @ 528 MHz | Imageon 2D, 3D Q3Dimension | HSUPA, 1xEV-DO Rev.A | Q1 2007 |
| MSM7600A | 65 nm | ARM1136J-S @ 528 MHz | Imageon 2D, 3D Q3Dimension | HSUPA, 1xEV-DO Rev.A | Q1 2007 |
| MSM7850 | | | LT 3D, LT 2D | 1xEV-DO Rev.B | 2008 |

## Snapdragon S series
### Snapdragon S1

* Features of the Snapdragon S1 series
* Snapdragon S1 notable features over its predecessor (MSM7xxx):
* CPU features
* 1 core up to 1 GHz Scorpion or Cortex-A5 or ARM11
* Up to 256K L2 cache
* Up to 32K+32K L1 cache
* GPU features
* Adreno 200 (from Software rendered or Adreno 130)
* OpenGL ES 1.1
* OpenVG 1.0
* Direct3D Mobile
* Unified shader model 5-way VLIW
* DSP features
* Hexagon QDSP5 at 350 MHz or Hexagon QDSP6 600 MHz
* ISP features
* Up to 12 MP camera
* Modem and wireless features
* External Bluetooth 4.0 or external Bluetooth 2.0/2.1 on some models
* 45 or 65 nm manufacturing technology
| Model number | Fab | CPU (Core/Freq) | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Sampling availability |
| MSM7225 | 65 nm | 1 core up to 528 MHz ARM11 (ARMv6): 16K+16K L1, no L2 cache | Software- rendered 2D support (HVGA) | Hexagon QDSP5 320 MHz | Up to 5 MP camera | LPDDR Single-channel 166 MHz (1.33 GB/s) | UMTS (HSPA); GSM (GPRS, EDGE) | Bluetooth 2.1 (external BTS4025); 802.11b/g/n (external WCN1314); gpsOne Gen 7; USB 2.0 | 2007 |
| MSM7625 | 65 nm | 1 core up to 528 MHz ARM11 (ARMv6): 16K+16K L1, no L2 cache | Software- rendered 2D support (HVGA) | Hexagon QDSP5 320 MHz | Up to 5 MP camera | LPDDR Single-channel 166 MHz (1.33 GB/s) | CDMA (1× Rev. A, 1×EV-DO Rev. A); UMTS; GSM | Bluetooth 2.1 (external BTS4025); 802.11b/g/n (external WCN1314); gpsOne Gen 7; USB 2.0 | 2007 |
| MSM7227 | 65 nm | 1 core up to 800 MHz ARM11 (ARMv6): 16K+16K L1, 256K L2 cache | Adreno 200 226 MHz (FWVGA) | Hexagon QDSP5 320 MHz | Up to 8 MP camera | LPDDR Single-channel 166 MHz (1.33 GB/s) | UMTS; GSM | Bluetooth 2.1 (external BTS4025); 802.11b/g/n (external WCN1312); gpsOne Gen 7; USB 2.0 | 2008 |
| MSM7627 | 65 nm | 1 core up to 800 MHz ARM11 (ARMv6): 16K+16K L1, 256K L2 cache | Adreno 200 226 MHz (FWVGA) | Hexagon QDSP5 320 MHz | Up to 8 MP camera | LPDDR Single-channel 166 MHz (1.33 GB/s) | CDMA, UMTS; GSM | Bluetooth 2.1 (external BTS4025); 802.11b/g/n (external WCN1312); gpsOne Gen 7; USB 2.0 | 2008 |
| MSM7225A | 45 nm | 1 core up to 800 MHz Cortex-A5 (ARMv7): 32K+32K L1, 256K L2 cache | Adreno 200 245 MHz (HVGA) | Hexagon QDSP5 350 MHz | Up to 5 MP camera | LPDDR Single-channel 200 MHz (1.6 GB/s) | UMTS (HSDPA, HSUPA, W-CDMA), MBMS; GSM | Bluetooth 4.0 (external WCN2243); 802.11b/g/n (external AR6003/5, WCN1314); gpsOne Gen 7; USB 2.0 | Q4 2011 |
| MSM7625A | 45 nm | 1 core up to 800 MHz Cortex-A5 (ARMv7): 32K+32K L1, 256K L2 cache | Adreno 200 245 MHz (HVGA) | Hexagon QDSP5 350 MHz | Up to 5 MP camera | LPDDR Single-channel 200 MHz (1.6 GB/s) | CDMA2000 (1×RTT, 1×EV-DO Rel.0/Rev.A/Rev.B, 1×EV-DO MC Rev.A); UMTS, MBMS; GSM | Bluetooth 4.0 (external WCN2243); 802.11b/g/n (external AR6003/5, WCN1314); gpsOne Gen 7; USB 2.0 | Q4 2011 |
| MSM7227A | 45 nm | 1 core up to 1.0 GHz Cortex-A5 (ARMv7): 32K+32K L1, 256K L2 cache | Adreno 200 245 MHz (FWVGA) | Hexagon QDSP5 350 MHz | Up to 8 MP camera | LPDDR Single-channel 200 MHz (1.6 GB/s) | UMTS, MBMS; GSM | Bluetooth 4.0 (external WCN2243); 802.11b/g/n (external AR6003/5, WCN1314); gpsOne Gen 7; USB 2.0 | Q4 2011 |
| MSM7627A | 45 nm | 1 core up to 1.0 GHz Cortex-A5 (ARMv7): 32K+32K L1, 256K L2 cache | Adreno 200 245 MHz (FWVGA) | Hexagon QDSP5 350 MHz | Up to 8 MP camera | LPDDR Single-channel 200 MHz (1.6 GB/s) | CDMA2000, UMTS, MBMS; GSM | Bluetooth 4.0 (external WCN2243); 802.11b/g/n (external AR6003/5, WCN1314); gpsOne Gen 7; USB 2.0 | Q4 2011 |
| MSM7225AB | 45 nm | 1 core up to 1.0 GHz Cortex-A5 (ARMv7): 32K+32K L1, 256K L2 cache | Adreno 200 245 MHz (FWVGA) | Hexagon QDSP5 350 MHz | Up to 8 MP camera | LPDDR Single-channel 200 MHz (1.6 GB/s) | UMTS: up to 7.2 Mbit/s, MBMS; GSM | Bluetooth 4.0 (external WCN2243); 802.11b/g/n (external AR6003/5, WCN1314); gpsOne Gen 7; USB 2.0 | |
| QSD8250 | 65 nm | 1 core up to 1.0 GHz Scorpion (ARMv7): 32K+32K L1, 256K L2 cache | Adreno 200 226 MHz (WXGA) | Hexagon QDSP6 600 MHz | Up to 12 MP camera | LPDDR Single-channel 400 MHz | UMTS, MBMS; GSM | Bluetooth 2.1 (external BTS4025); 802.11b/g/n (external AR6003); gpsOne Gen 7; USB 2.0 | Q4 2008 |
| QSD8650 | 65 nm | 1 core up to 1.0 GHz Scorpion (ARMv7): 32K+32K L1, 256K L2 cache | Adreno 200 226 MHz (WXGA) | Hexagon QDSP6 600 MHz | Up to 12 MP camera | LPDDR Single-channel 400 MHz | CDMA2000, UMTS, MBMS; GSM | Bluetooth 2.1 (external BTS4025); 802.11b/g/n (external AR6003); gpsOne Gen 7; USB 2.0 | Q4 2008 |

### Snapdragon S2

* Features of the Snapdragon S2 series
* Snapdragon S2 notable features over its predecessor (Snapdragon S1):
* CPU feature
* 1 core up to 1.5 GHz Scorpion
* ARMv7 (from ARMv6 on some model)
* Up to 384K L2
* GPU features
* Adreno 205 (from Software rendered or Adreno 200)
* Up to 266 MHz
* Up to 2 times faster than Adreno 200
* up to ×2 relative performance on OpenGL ES 2.0 from Adreno 200
* Up to XGA
* OpenGL ES 2.0
* SVGT 1.2
* OpenVG 1.1
* Direct Draw
* GDI
* Concurrent CPU, DSP, graphics and MDP
* Memory features
* Up to LPDDR2 32-bit dual-channel 333 MHz (5.3 GB/s)
* DSP features
* Hexagon QDSP5 at 256 MHz
* 45 nm manufacturing technology
* 904 pins
| Model number | Fab | CPU (ARMv7) | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Sampling availability |
| MSM7230 | 45 nm | 1 core up to 800 MHz Scorpion: 32K+32K L1, 256K L2 | Adreno 205 266 MHz (XGA) | Hexagon QDSP5 256 MHz | Up to 12 MP camera | LPDDR2 32-bit dual-channel 333 MHz (5.3 GB/s) | GSM, GPRS, W-CDMA, UMTS, EDGE, MBMS, HSDPA, HSUPA, HSPA+ | Bluetooth 4.0 (external WCN2243) or Bluetooth 3.0 (external QTR8x00); 802.11b/g/n (external WCN1314); gpsOne Gen 8 with Glonass; USB 2.0 | Q2 2010 |
| MSM7630 | 45 nm | 1 core up to 800 MHz Scorpion: 32K+32K L1, 256K L2 | Adreno 205 266 MHz (XGA) | Hexagon QDSP5 256 MHz | Up to 12 MP camera | LPDDR2 32-bit dual-channel 333 MHz (5.3 GB/s) | CDMA2000 (1×Adv, 1×EV-DO Rel. 0/Rev. A/Rev. B, 1×EV-DO MC Rev.A, SV-DO); UMTS, MBMS; GSM | Bluetooth 4.0 (external WCN2243) or Bluetooth 3.0 (external QTR8x00); 802.11b/g/n (external WCN1314); gpsOne Gen 8 with Glonass; USB 2.0 | Q2 2010 |
| APQ8055 | 45 nm | 1 core up to 1.4 GHz Scorpion: 32K+32K L1, 384K L2 | Adreno 205 266 MHz (XGA) | Hexagon QDSP5 256 MHz | Up to 12 MP camera | LPDDR2 32-bit dual-channel 333 MHz (5.3 GB/s) | — | Bluetooth 4.0 (external WCN2243) or Bluetooth 3.0 (external QTR8x00); 802.11b/g/n (external WCN1314); gpsOne Gen 8 with Glonass; USB 2.0 | Q2 2010 |
| MSM8255 | 45 nm | 1 core up to 1.0 GHz Scorpion: 32K+32K L1, 384K L2 | Adreno 205 266 MHz (XGA) | Hexagon QDSP5 256 MHz | Up to 12 MP camera | LPDDR2 32-bit dual-channel 333 MHz (5.3 GB/s) | UMTS, MBMS; GSM | Bluetooth 4.0 (external WCN2243) or Bluetooth 3.0 (external QTR8x00); 802.11b/g/n (external WCN1314); gpsOne Gen 8 with Glonass; USB 2.0 | Q2 2010 |
| MSM8655 | 45 nm | 1 core up to 1.0 GHz Scorpion: 32K+32K L1, 384K L2 | Adreno 205 266 MHz (XGA) | Hexagon QDSP5 256 MHz | Up to 12 MP camera | LPDDR2 32-bit dual-channel 333 MHz (5.3 GB/s) | CDMA2000, UMTS, MBMS; GSM | Bluetooth 4.0 (external WCN2243) or Bluetooth 3.0 (external QTR8x00); 802.11b/g/n (external WCN1314); gpsOne Gen 8 with Glonass; USB 2.0 | Q2 2010 |
| MSM8255T | 45 nm | 1 core up to 1.5 GHz Scorpion: 32K+32K L1, 384K L2 | Adreno 205 266 MHz (XGA) | Hexagon QDSP5 256 MHz | Up to 12 MP camera | LPDDR2 32-bit dual-channel 333 MHz (5.3 GB/s) | UMTS, MBMS; GSM | Bluetooth 4.0 (external WCN2243) or Bluetooth 3.0 (external QTR8x00); 802.11b/g/n (external WCN1314); gpsOne Gen 8 with Glonass; USB 2.0 | Q2 2010 |
| MSM8655T | 45 nm | 1 core up to 1.5 GHz Scorpion: 32K+32K L1, 384K L2 | Adreno 205 266 MHz (XGA) | Hexagon QDSP5 256 MHz | Up to 12 MP camera | LPDDR2 32-bit dual-channel 333 MHz (5.3 GB/s) | CDMA2000, UMTS, MBMS; GSM | Bluetooth 4.0 (external WCN2243) or Bluetooth 3.0 (external QTR8x00); 802.11b/g/n (external WCN1314); gpsOne Gen 8 with Glonass; USB 2.0 | Q2 2010 |

### Snapdragon S3

* Features of the Snapdragon S3 series
* Snapdragon S3 notable features over its predecessor (Snapdragon S2):
* CPU feature
* 2 cores up to 1.7 GHz Scorpion
* 512 KB L2
* GPU features
* Adreno 220
* Up to 4 times faster than Adreno 200
* up to ×5 relative performance on OpenGL ES 2.0 from Adreno 200
* EGL 1.3 (from 1.2)
* 2× larger L2 cache (512 KB from 256 KB)
* Up to WXGA+
* DSP features
* Hexagon QDSP6 at 400 MHz (from Hexagon QDSP5 at 256 MHz)
* ISP features
* Up to 16 MP camera (from 12 MP)
* 45 nm manufacturing technology
| Model number | Fab | CPU (ARMv7) | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Sampling availability |
| APQ8060 | 45 nm | 2 cores up to 1.7 GHz Scorpion: 512 KB L2 | Adreno 220 266 MHz (WXGA+) | Hexagon QDSP6 400 MHz | Up to 16 MP camera | LPDDR2 Single- channel 333 MHz (2.67 GB/s) | — | Bluetooth 4.0 (external WCN2243); 802.11b/g/n (external WCN1314); gpsOne Gen 8 with Glonass; USB 2.0 | 2011 |
| MSM8260 | 45 nm | 2 cores up to 1.7 GHz Scorpion: 512 KB L2 | Adreno 220 266 MHz (WXGA+) | Hexagon QDSP6 400 MHz | Up to 16 MP camera | LPDDR2 Single- channel 333 MHz (2.67 GB/s) | GSM, GPRS, W-CDMA, UMTS, HSDPA, HSUPA, HSPA+, EDGE, MBMS | Bluetooth 4.0 (external WCN2243); 802.11b/g/n (external WCN1314); gpsOne Gen 8 with Glonass; USB 2.0 | Q3 2010 |
| MSM8660 | 45 nm | 2 cores up to 1.7 GHz Scorpion: 512 KB L2 | Adreno 220 266 MHz (WXGA+) | Hexagon QDSP6 400 MHz | Up to 16 MP camera | LPDDR2 Single- channel 333 MHz (2.67 GB/s) | CDMA2000 (1×Adv, 1×EV-DO Rel. 0/Rev. A/Rev. B, 1×EV-DO MC Rev.A); UMTS, MBMS; GSM | Bluetooth 4.0 (external WCN2243); 802.11b/g/n (external WCN1314); gpsOne Gen 8 with Glonass; USB 2.0 | Q3 2010 |

### Snapdragon S4

Snapdragon S4 was offered in three models: S4 Play for budget and entry-level devices, S4 Plus for mid-range devices and S4 Pro for high-end devices. It was launched in 2012. The Snapdragon S4 were succeeded by the Snapdragon 200/400 series (S4 Play) and 600/800 series (S4 Plus and S4 Pro).

#### Snapdragon S4 Play

| Model number | Fab | CPU (ARMv7) | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Sampling availability |
| MSM8225 | 45 nm | 2 cores up to 1.2 GHz Cortex-A5: 2x 32K+32K L1, 512K L2 | Adreno 203 320 MHz (FWVGA) | Hexagon | Up to 8 MP camera | LPDDR2 Single-channel 300 MHz | UMTS (HSPA); GSM (GPRS, EDGE) | Bluetooth 3.0 (external); 802.11b/g/n 2.4 GHz (external); GPS: IZat Gen 7; USB 2.0 | 1H 2012 |
| MSM8625 | 45 nm | 2 cores up to 1.2 GHz Cortex-A5: 2x 32K+32K L1, 512K L2 | Adreno 203 320 MHz (FWVGA) | Hexagon | Up to 8 MP camera | LPDDR2 Single-channel 300 MHz | CDMA (1×Rev. A, 1×EV-DO Rev. A/B); UMTS; GSM | Bluetooth 3.0 (external); 802.11b/g/n 2.4 GHz (external); GPS: IZat Gen 7; USB 2.0 | 1H 2012 |

#### Snapdragon S4 Plus

* Features of the Snapdragon S4 Plus series
* Snapdragon S4 Plus notable features over its predecessor (Snapdragon S3):
* CPU features
* 2x cores up to 1.7 GHz Krait 200
* 4+4 KB L0, 16+16 KB L1, 1 MB L2
* Out of Order Execution (from Partial Out of Order Execution on Scorpion)
* GPU features
* Adreno 225
* Up to 1080p screen
* Up to 6 times faster than Adreno 200
* Up to 32 ALU
* Direct3D feature level 9.0 (from 9.0)
* up to ×7.5 relative performance on OpenGL ES 2.0 from Adreno 200
* Adreno 305
* Up to 1080p screen (on 400 MHz)
* Up to 720p screen (on 320 MHz)
* Up to 24 ALU (from 32 on S3)
* Unified shader model Scalar instruction set (from unified shader model 5-way VLIW)
* up to ×8 relative performance on OpenGL ES 2.0 from Adreno 200
* DSP features
* Up to 20 MP or 13.5 MP camera
* ISP features
* Hexagon QDSP6
* Modem and wireless features
* Integrated Bluetooth 4.0
* IZat Gen8A (from IZat Gen 7)
* 28 nm manufacturing technology
| Model number | Fab | CPU (ARMv7) | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Sampling availability |
| MSM8227 | 28 nm | 2 cores up to 1.0 GHz Krait: 4+4 KB L0, 16+16 KB L1, 1 MB L2 | Adreno 305 320 MHz (FWVGA / 720p) | Hexagon QDSP6 | | LPDDR2 Single-channel 400 MHz | GSM (GPRS, EDGE), UMTS (DC-HSPA+, TD-SCDMA) | Bluetooth 4.0; 802.11b/g/n (2.4/5 GHz); GPS: IZat Gen 8A; USB 2.0 | 2H 2012 |
| MSM8627 | 28 nm | 2 cores up to 1.0 GHz Krait: 4+4 KB L0, 16+16 KB L1, 1 MB L2 | Adreno 305 320 MHz (FWVGA / 720p) | Hexagon QDSP6 | | LPDDR2 Single-channel 400 MHz | CDMA (1×Rev.A, 1×EV-DO Rev.A/B, SVDO-DB); UMTS; GSM | Bluetooth 4.0; 802.11b/g/n (2.4/5 GHz); GPS: IZat Gen 8A; USB 2.0 | 2H 2012 |
| APQ8030 | 28 nm | 2 cores up to 1.2 GHz Krait: 4+4 KB L0, 16+16 KB L1, 1 MB L2 | Adreno 305 400 MHz (qHD / 1080p) | Hexagon QDSP6 | Up to 13.5 MP camera | LPDDR2 Single-channel 533 MHz | — . | Bluetooth 4.0; 802.11b/g/n (2.4/5 GHz); GPS: IZat Gen 8A; USB 2.0 | 3Q 2012 |
| MSM8230 | 28 nm | 2 cores up to 1.2 GHz Krait: 4+4 KB L0, 16+16 KB L1, 1 MB L2 | Adreno 305 400 MHz (qHD / 1080p) | Hexagon QDSP6 | Up to 13.5 MP camera | LPDDR2 Single-channel 533 MHz | UMTS; GSM . | Bluetooth 4.0; 802.11b/g/n (2.4/5 GHz); GPS: IZat Gen 8A; USB 2.0 | 3Q 2012 |
| MSM8630 | 28 nm | 2 cores up to 1.2 GHz Krait: 4+4 KB L0, 16+16 KB L1, 1 MB L2 | Adreno 305 400 MHz (qHD / 1080p) | Hexagon QDSP6 | Up to 13.5 MP camera | LPDDR2 Single-channel 533 MHz | CDMA, UMTS; GSM | Bluetooth 4.0; 802.11b/g/n (2.4/5 GHz); GPS: IZat Gen 8A; USB 2.0 | 3Q 2012 |
| MSM8930 | 28 nm | 2 cores up to 1.2 GHz Krait: 4+4 KB L0, 16+16 KB L1, 1 MB L2 | Adreno 305 400 MHz (qHD / 1080p) | Hexagon QDSP6 | Up to 13.5 MP camera | LPDDR2 Single-channel 533 MHz | World Mode (LTE FDD/TDD Cat 3, SVLTE-DB, EGAL; CDMA, UMTS; GSM) | Bluetooth 4.0; 802.11b/g/n (2.4/5 GHz); GPS: IZat Gen 8A; USB 2.0 | 3Q 2012 |
| APQ8060A | 28 nm | 2 cores up to 1.5 GHz Krait: 4+4 KB L0, 16+16 KB L1, 1 MB L2 | Adreno 225 400 MHz (WUXGA / 1080p) | Hexagon QDSP6 | Up to 20 MP camera | LPDDR2 Dual-channel 500 MHz | — . | Bluetooth 4.0; 802.11b/g/n (2.4/5 GHz); GPS: IZat Gen 8A; USB 2.0 | 2H 2012 |
| MSM8260A | 28 nm | 2 cores up to 1.5 GHz Krait: 4+4 KB L0, 16+16 KB L1, 1 MB L2 | Adreno 225 400 MHz (WUXGA / 1080p) | Hexagon QDSP6 | Up to 20 MP camera | LPDDR2 Dual-channel 500 MHz | UMTS; GSM . | Bluetooth 4.0; 802.11b/g/n (2.4/5 GHz); GPS: IZat Gen 8A; USB 2.0 | Q1 2012 |
| MSM8660A | 28 nm | 2 cores up to 1.5 GHz Krait: 4+4 KB L0, 16+16 KB L1, 1 MB L2 | Adreno 225 400 MHz (WUXGA / 1080p) | Hexagon QDSP6 | Up to 20 MP camera | LPDDR2 Dual-channel 500 MHz | CDMA, UMTS; GSM | Bluetooth 4.0; 802.11b/g/n (2.4/5 GHz); GPS: IZat Gen 8A; USB 2.0 | Q1 2012 |
| MSM8960 | 28 nm | 2 cores up to 1.5 GHz Krait: 4+4 KB L0, 16+16 KB L1, 1 MB L2 | Adreno 225 400 MHz (WUXGA / 1080p) | Hexagon QDSP6 | Up to 20 MP camera | LPDDR2 Dual-channel 500 MHz | World Mode (LTE Cat 3) | Bluetooth 4.0; 802.11b/g/n (2.4/5 GHz); GPS: IZat Gen 8A; USB 2.0 | Q1 2012 |

#### Snapdragon S4 Pro and S4 Prime (2012)

* Features of the Snapdragon S4 Pro series
* Snapdragon S4 Pro notable features over its predecessor (Snapdragon S4 Play):
* CPU features
* up to 2 cores up to 1.7 GHz Krait 300 on to Snapdragon S4 Pro
* up to 4 cores up to 1.5 GHz Krait 300 on to Snapdragon S4 Prime
* 4+4 KB L0, 16+16 KB L1, 1 MB L2
* GPU features
* Adreno 320
* Support OpenGL ES 3.0
* Up to 1080p screen
* Up to 64 ALU (from 32 on S4 plus)
* up to ×23 relative performance on OpenGL ES 2.0 from Adreno 200
* DSP features
* Hexagon QDSP6
* ISP features
* Up to 20 MP camera
* Modem and wireless features
* LTE FDD/TDD Cat 3 or external on some models
* 28 nm LP manufacturing technology
* Up to eMMC 4.4/4.4.1
| Model number | Fab | CPU (ARMv7) | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Sampling availability |
| MSM8260A Pro | 28 nm (TSMC 28LP) | 2 cores up to 1.7 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 1 MB L2 | Adreno 320 400 MHz (WUXGA / 1080p) | Hexagon QDSP6 | Up to 20 MP camera | LPDDR2 Dual-channel 500 MHz | GSM (GPRS, EDGE), UMTS (DC-HSPA+, TD-SCDMA) | Bluetooth 4.0; 802.11b/g/n (2.4/5 GHz); GPS: IZat Gen8A; USB 2.0 | |
| MSM8960T | 28 nm (TSMC 28LP) | 2 cores up to 1.7 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 1 MB L2 | Adreno 320 400 MHz (WUXGA / 1080p) | Hexagon QDSP6 | Up to 20 MP camera | LPDDR2 Dual-channel 500 MHz | World Mode (LTE FDD/TDD Cat 3, SVLTE-DB, EGAL; CDMA: 1× Adv., 1× EV-DO Rev. A/B; UMTS; GSM) | Bluetooth 4.0; 802.11b/g/n (2.4/5 GHz); GPS: IZat Gen8A; USB 2.0 | Q2 2012 . |
| MSM8960T Pro (MSM8960AB) | 28 nm (TSMC 28LP) | 2 cores up to 1.7 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 1 MB L2 | Adreno 320 400 MHz (WUXGA / 1080p) | Hexagon QDSP6 | Up to 20 MP camera | LPDDR2 Dual-channel 500 MHz | World Mode (LTE FDD/TDD Cat 3, SVLTE-DB, EGAL; CDMA: 1× Adv., 1× EV-DO Rev. A/B; UMTS; GSM) | Bluetooth 4.0; 802.11b/g/n (2.4/5 GHz); GPS: IZat Gen8A; USB 2.0 | |
| MSM8960DT | 28 nm (TSMC 28LP) | 2 cores up to 1.7 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 1 MB L2 | Adreno 320 400 MHz (WUXGA / 1080p) | Hexagon QDSP6 | Up to 20 MP camera | LPDDR2 Dual-channel 500 MHz | World Mode (LTE FDD/TDD Cat 3, SVLTE-DB, EGAL; CDMA: 1× Adv., 1× EV-DO Rev. A/B; UMTS; GSM) | Bluetooth 4.0; 802.11b/g/n (2.4/5 GHz); GPS: IZat Gen8A; USB 2.0 | Q3 2013 |
| APQ8064 | 28 nm (TSMC 28LP) | 4 cores up to 1.5 GHz Krait: 4+4 KB L0, 16+16 KB L1, 2 MB L2 | Adreno 320 400 MHz (QXGA / 1080p) | Hexagon QDSP6 | Up to 20 MP camera | LPDDR2 Dual-channel 533 MHz | External | Bluetooth 4.0; 802.11b/g/n (2.4/5 GHz); GPS: IZat Gen8A; USB 2.0 | 2012 |
* ↑ Natural language processor and contextual processor

## Snapdragon 2 series

The Snapdragon 2 series is the entry-level SoC designed for low-end or ultra-budget smartphones. It replaces the MSM8225 S4 Play model as the lowest-end SoC in the entire Snapdragon lineup.

### Snapdragon 200 series (2013–2019)

| Model number | Product name | Fab | CPU | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Announcement Date | Sampling availability |
| MSM8225Q | Snapdragon 200 | 45 nm (TSMC 45LP) | 4 cores up to 1.4 GHz Cortex-A5 | Adreno 203 400 MHz (12.8 GFLOPS in FP32) | Hexagon QDSP5 | Up to 8 MP single camera | LPDDR2 Single-channel 333 MHz | Gobi 3G (UMTS: HSPA; GSM: GPRS/EDGE) | Bluetooth 4.1; 802.11b/g/n 2.4 GHz; GPS: IZat Gen8B; USB 2.0 | — | 2013 | 2013 |
| MSM8625Q | Snapdragon 200 | 45 nm (TSMC 45LP) | 4 cores up to 1.4 GHz Cortex-A5 | Adreno 203 400 MHz (12.8 GFLOPS in FP32) | Hexagon QDSP5 | Up to 8 MP single camera | LPDDR2 Single-channel 333 MHz | Gobi 3G (CDMA: 1×Rev.A, 1×EV-DO Rev.A/B; UMTS; GSM) | Bluetooth 4.1; 802.11b/g/n 2.4 GHz; GPS: IZat Gen8B; USB 2.0 | — | 2013 | 2013 |
| MSM8210 | Snapdragon 200 | 28 nm (TSMC 28LP) | 2 cores up to 1.2 GHz Cortex-A7 | Adreno 302 400 MHz (12.8 GFLOPS in FP32) | Hexagon QDSP6 | Up to 8 MP single camera | LPDDR2 Single-channel 333 MHz | Gobi 3G (UMTS; GSM) | Bluetooth 4.1; 802.11b/g/n 2.4 GHz; GPS: IZat Gen8B; USB 2.0 | — | 2013 | 2013 |
| MSM8610 | Snapdragon 200 | 28 nm (TSMC 28LP) | 2 cores up to 1.2 GHz Cortex-A7 | Adreno 302 400 MHz (12.8 GFLOPS in FP32) | Hexagon QDSP6 | Up to 8 MP single camera | LPDDR2 Single-channel 333 MHz | Gobi 3G (CDMA/UMTS; GSM) | Bluetooth 4.1; 802.11b/g/n 2.4 GHz; GPS: IZat Gen8B; USB 2.0 | — | 2013 | 2013 |
| MSM8212 | Snapdragon 200 | 28 nm (TSMC 28LP) | 4 cores up to 1.2 GHz Cortex-A7 | Adreno 302 400 MHz (12.8 GFLOPS in FP32) | Hexagon QDSP6 | Up to 8 MP single camera | LPDDR2 Single-channel 333 MHz | Gobi 3G (UMTS; GSM) | Bluetooth 4.1; 802.11b/g/n 2.4 GHz; GPS: IZat Gen8B; USB 2.0 | — | 2013 | 2013 |
| MSM8612 | Snapdragon 200 | 28 nm (TSMC 28LP) | 4 cores up to 1.2 GHz Cortex-A7 | Adreno 302 400 MHz (12.8 GFLOPS in FP32) | Hexagon QDSP6 | Up to 8 MP single camera | LPDDR2 Single-channel 333 MHz | Gobi 3G (CDMA/UMTS; GSM) | Bluetooth 4.1; 802.11b/g/n 2.4 GHz; GPS: IZat Gen8B; USB 2.0 | — | 2013 | 2013 |
| MSM8905 | Qualcomm 205 | 28 nm (TSMC 28LP) | 2 cores up to 1.1 GHz Cortex-A7 | Adreno 304 400 MHz (19.2 GFLOPS in FP32) | Hexagon 536 | Up to 3 MP single camera | LPDDR2/3 Single-channel 384 MHz | X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s) | Bluetooth 4.1 + BLE, 802.11n (2.4 GHz) | 4.0 | March 20, 2017 | 2017 |
| MSM8208 | Snapdragon 208 | 28 nm (TSMC 28LP) | 2 cores up to 1.1 GHz Cortex-A7 | Adreno 304 400 MHz (19.2 GFLOPS in FP32) | Hexagon 536 | Up to 5 MP single camera | LPDDR2/3 Single-channel 400 MHz | Gobi 3G (multimode CDMA/UMTS: download up to 42 Mbit/s; GSM) | Bluetooth 4.1 + BLE, 802.11n (2.4 GHz) | 2.0 | September 9, 2014 | 2014 |
| MSM8909 | Snapdragon 210 | 28 nm (TSMC 28LP) | 4 cores up to 1.1 GHz Cortex-A7 | Adreno 304 400 MHz (19.2 GFLOPS in FP32) | Hexagon 536 | Up to 8 MP single camera | LPDDR2/3 Single-channel 533 MHz | X5 LTE | Bluetooth 4.1 + BLE, 802.11n (2.4 GHz) | 2.0 | September 9, 2014 | 2014 |
| MSM8909AA | Snapdragon 212 | 28 nm (TSMC 28LP) | 4 cores up to 1.3 GHz Cortex-A7 | Adreno 304 400 MHz (19.2 GFLOPS in FP32) | Hexagon 536 | Up to 8 MP single camera | LPDDR2/3 Single-channel 533 MHz | X5 LTE | Bluetooth 4.1 + BLE, 802.11n (2.4 GHz) | 2.0 | July 28, 2015 | 2015 |
| QM215 | Qualcomm 215 | 28 nm (TSMC 28LP) | 4 cores up to 1.3 GHz Cortex-A53 | Adreno 308 485 MHz (23.3 GFLOPS in FP32) | Hexagon | Up to 13 MP single camera / 8 MP dual camera | LPDDR3 Single-channel 672 MHz 3 GB | X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s) | Bluetooth 4.2, NFC, 802.11ac Wi-Fi, Beidou, GPS, GLONASS, USB 2.0 | 1.0 | July 9, 2019 | Q3 2019 |

## Snapdragon 4 series

The Snapdragon 4 series is the entry-level SoC designed for the more upmarket entry-level segment, as opposed to the 2 series, which were aimed at ultra-budget segment. Similar to the 2 series, it is the successor of the S4 Play.

### Snapdragon 400 series (2013–2021)

| Model number | Product name | Fab | CPU | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Announcement date | Sampling availability |
| APQ8026 | Snapdragon 400 | 28 nm (TSMC 28LP) | 4 cores up to 1.2 GHz Cortex-A7: 32 KB L1, 512 KB L2 | Adreno 305 400 MHz (19.2 GFLOPS in FP32) | Hexagon QDSP6 | Up to 13.5 MP single camera | LPDDR2/3 Single-channel 533 MHz | — | Bluetooth 4.0, 802.11 b/g/n, Integrated IZat GNSS | 1.0 | 2013 | 2013 |
| MSM8226 | Snapdragon 400 | 28 nm (TSMC 28LP) | 4 cores up to 1.2 GHz Cortex-A7: 32 KB L1, 512 KB L2 | Adreno 305 400 MHz (19.2 GFLOPS in FP32) | Hexagon QDSP6 | Up to 13.5 MP single camera | LPDDR2/3 Single-channel 533 MHz | Gobi 3G (UMTS: HSPA+ up to 21 Mbit/s; GSM: GPRS/EDGE) | Bluetooth 4.0, 802.11 b/g/n, Integrated IZat GNSS | 1.0 | 2013 | 2013 |
| MSM8626 | Snapdragon 400 | 28 nm (TSMC 28LP) | 4 cores up to 1.2 GHz Cortex-A7: 32 KB L1, 512 KB L2 | Adreno 305 400 MHz (19.2 GFLOPS in FP32) | Hexagon QDSP6 | Up to 13.5 MP single camera | LPDDR2/3 Single-channel 533 MHz | Gobi 3G (CDMA/UMTS) | Bluetooth 4.0, 802.11 b/g/n, Integrated IZat GNSS | 1.0 | 2013 | 2013 |
| MSM8926 | Snapdragon 400 | 28 nm (TSMC 28LP) | 4 cores up to 1.2 GHz Cortex-A7: 32 KB L1, 512 KB L2 | Adreno 305 400 MHz (19.2 GFLOPS in FP32) | Hexagon QDSP6 | Up to 13.5 MP single camera | LPDDR2/3 Single-channel 533 MHz | Gobi 4G (LTE Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s) | Bluetooth 4.0, 802.11 b/g/n, Integrated IZat GNSS | 1.0 | 2013 | 2013 |
| APQ8028 | Snapdragon 400 | 28 nm (TSMC 28LP) | 4 cores up to 1.6 GHz Cortex-A7: 32 KB L1, 512 KB L2 | Adreno 305 450 MHz (21.6 GFLOPS in FP32) | Hexagon QDSP6 | Up to 13.5 MP single camera | LPDDR2/3 Single-channel 533 MHz | — | Bluetooth 4.0, 802.11 b/g/n, Integrated IZat GNSS | 1.0 | 2013 | 2013 |
| MSM8228 | Snapdragon 400 | 28 nm (TSMC 28LP) | 4 cores up to 1.6 GHz Cortex-A7: 32 KB L1, 512 KB L2 | Adreno 305 450 MHz (21.6 GFLOPS in FP32) | Hexagon QDSP6 | Up to 13.5 MP single camera | LPDDR2/3 Single-channel 533 MHz | Gobi 3G (UMTS) | Bluetooth 4.0, 802.11 b/g/n, Integrated IZat GNSS | 1.0 | 2013 | 2013 |
| MSM8628 | Snapdragon 400 | 28 nm (TSMC 28LP) | 4 cores up to 1.6 GHz Cortex-A7: 32 KB L1, 512 KB L2 | Adreno 305 450 MHz (21.6 GFLOPS in FP32) | Hexagon QDSP6 | Up to 13.5 MP single camera | LPDDR2/3 Single-channel 533 MHz | Gobi 3G (CDMA/UMTS) | Bluetooth 4.0, 802.11 b/g/n, Integrated IZat GNSS | 1.0 | 2013 | 2013 |
| MSM8928 | Snapdragon 400 | 28 nm (TSMC 28LP) | 4 cores up to 1.6 GHz Cortex-A7: 32 KB L1, 512 KB L2 | Adreno 305 450 MHz (21.6 GFLOPS in FP32) | Hexagon QDSP6 | Up to 13.5 MP single camera | LPDDR2/3 Single-channel 533 MHz | Gobi 4G (LTE Cat 4) | Bluetooth 4.0, 802.11 b/g/n, Integrated IZat GNSS | 1.0 | 2013 | 2013 |
| MSM8230 | Snapdragon 400 | 28 nm (TSMC 28LP) | 2 cores up to 1.2 GHz Krait 200: 32 KB L1, 1 MB L2 | Adreno 305 400 MHz (19.2 GFLOPS in FP32) | Hexagon QDSP6 | Up to 13.5 MP single camera | LPDDR2 Single-channel 533 MHz | Gobi 3G (UMTS) | Bluetooth 4.0, 802.11 b/g/n, Integrated IZat GNSS | 1.0 | 2013 | 2013 |
| MSM8630 | Snapdragon 400 | 28 nm (TSMC 28LP) | 2 cores up to 1.2 GHz Krait 200: 32 KB L1, 1 MB L2 | Adreno 305 400 MHz (19.2 GFLOPS in FP32) | Hexagon QDSP6 | Up to 13.5 MP single camera | LPDDR2 Single-channel 533 MHz | Gobi 3G (CDMA/UMTS) | Bluetooth 4.0, 802.11 b/g/n, Integrated IZat GNSS | 1.0 | 2013 | 2013 |
| MSM8930 | Snapdragon 400 | 28 nm (TSMC 28LP) | 2 cores up to 1.2 GHz Krait 200: 32 KB L1, 1 MB L2 | Adreno 305 400 MHz (19.2 GFLOPS in FP32) | Hexagon QDSP6 | Up to 13.5 MP single camera | LPDDR2 Single-channel 533 MHz | Gobi 4G (LTE Cat 4) | Bluetooth 4.0, 802.11 b/g/n, Integrated IZat GNSS | 1.0 | 2013 | 2013 |
| MSM8930AA | Snapdragon 400 | 28 nm (TSMC 28LP) | 2 cores up to 1.4 GHz Krait 300: 32 KB L1, 1 MB L2 | Adreno 305 400 MHz (19.2 GFLOPS in FP32) | Hexagon QDSP6 | Up to 13.5 MP single camera | LPDDR2 Single-channel 533 MHz | Gobi 4G (LTE Cat 4) | Bluetooth 4.0, 802.11 b/g/n, Integrated IZat GNSS | 1.0 | 2013 | 2013 |
| APQ8030AB | Snapdragon 400 | 28 nm (TSMC 28LP) | 2 cores up to 1.7 GHz Krait 300: 32 KB L1, 1 MB L2 | Adreno 305 450 MHz (21.6 GFLOPS in FP32) | Hexagon QDSP6 | Up to 13.5 MP single camera | LPDDR2 Single-channel 533 MHz | — | Bluetooth 4.0, 802.11 b/g/n, Integrated IZat GNSS | 1.0 | 2013 | 2013 |
| MSM8230AB | Snapdragon 400 | 28 nm (TSMC 28LP) | 2 cores up to 1.7 GHz Krait 300: 32 KB L1, 1 MB L2 | Adreno 305 450 MHz (21.6 GFLOPS in FP32) | Hexagon QDSP6 | Up to 13.5 MP single camera | LPDDR2 Single-channel 533 MHz | Gobi 3G (UMTS) | Bluetooth 4.0, 802.11 b/g/n, Integrated IZat GNSS | 1.0 | 2013 | 2013 |
| MSM8630AB | Snapdragon 400 | 28 nm (TSMC 28LP) | 2 cores up to 1.7 GHz Krait 300: 32 KB L1, 1 MB L2 | Adreno 305 450 MHz (21.6 GFLOPS in FP32) | Hexagon QDSP6 | Up to 13.5 MP single camera | LPDDR2 Single-channel 533 MHz | Gobi 3G (CDMA/UMTS) | Bluetooth 4.0, 802.11 b/g/n, Integrated IZat GNSS | 1.0 | 2013 | 2013 |
| MSM8930AB | Snapdragon 400 | 28 nm (TSMC 28LP) | 2 cores up to 1.7 GHz Krait 300: 32 KB L1, 1 MB L2 | Adreno 305 450 MHz (21.6 GFLOPS in FP32) | Hexagon QDSP6 | Up to 13.5 MP single camera | LPDDR2 Single-channel 533 MHz | Gobi 4G (LTE Cat 4) | Bluetooth 4.0, 802.11 b/g/n, Integrated IZat GNSS | 1.0 | 2013 | 2013 |
| APQ8016 | Snapdragon 410 | 28 nm (TSMC 28LP) / 28 nm (SMIC) | 4 cores up to 1.2 GHz Cortex-A53 | Adreno 306 400/450 MHz (19.2/21.6 GFLOPS in FP32) | Hexagon QDSP6 V5 | Up to 13.5 MP single camera | LPDDR2/3 Single-channel 32-bit 533 MHz (4.2 GB/s) | — | Bluetooth 4.0, 802.11n, NFC, GPS, GLONASS, BeiDou | 2.0 | December 9, 2013 | H1 2014 |
| MSM8916 | Snapdragon 410 | 28 nm (TSMC 28LP) / 28 nm (SMIC) | 4 cores up to 1.2 GHz Cortex-A53 | Adreno 306 400/450 MHz (19.2/21.6 GFLOPS in FP32) | Hexagon QDSP6 V5 | Up to 13.5 MP single camera | LPDDR2/3 Single-channel 32-bit 533 MHz (4.2 GB/s) | X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s) | Bluetooth 4.0, 802.11n, NFC, GPS, GLONASS, BeiDou | 2.0 | December 9, 2013 | H1 2014 |
| MSM8916 v2 | Snapdragon 412 | 28 nm (TSMC 28LP) | 4 cores up to 1.4 GHz Cortex-A53 | Adreno 306 450 MHz (21.6 GFLOPS in FP32) | Hexagon QDSP6 V5 | Up to 13.5 MP single camera | LPDDR2/3 Single-channel 32-bit 600 MHz (4.8 GB/s) | X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s) | Bluetooth 4.0, 802.11n, NFC, GPS, GLONASS, BeiDou | 2.0 | July 28, 2015 | H2 2015 |
| MSM8929 | Snapdragon 415 | 28 nm (TSMC 28LP) | 4 + 4 cores (1.4 GHz + 1.0 GHz Cortex-A53) | Adreno 405 465 MHz (44.6 GFLOPS in FP32) | Hexagon V50 | Up to 13 MP single camera | LPDDR3 Single-channel 32-bit 667 MHz (5.3 GB/s) | X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s) | Bluetooth 4.1 + BLE Bluetooth, 802.11ac (2.4/5.0 GHz) Multi-User MIMO (MU-MIMO) Wi-Fi, IZat Gen8C Lite GPS | 2.0 | February 18, 2015 | H1 2015 |
| MSM8917 | Snapdragon 425 | 28 nm (TSMC 28LP) | 4 cores up to 1.4 GHz Cortex-A53 | Adreno 308 598 MHz (28.7 GFLOPS in FP32) | Hexagon 536 | Up to 16 MP single camera | LPDDR3 Single-channel 32-bit 667 MHz (5.3 GB/s) | X6 LTE (download: Cat 4, up to 150 Mbit/s; upload: Cat 5, up to 75 Mbit/s) | Bluetooth v4.1, 802.11ac with Multi-User MIMO (MU-MIMO), IZat Gen8C | 2.0 | February 11, 2016 | Q3 2016 |
| MSM8920 | Snapdragon 427 | 28 nm (TSMC 28LP) | 4 cores up to 1.4 GHz Cortex-A53 | Adreno 308 598 MHz (28.7 GFLOPS in FP32) | Hexagon 536 | Up to 16 MP single camera | LPDDR3 Single-channel 32-bit 667 MHz (5.3 GB/s) | X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s) | Bluetooth v4.1, 802.11ac with Multi-User MIMO (MU-MIMO), IZat Gen8C | 3.0 | October 18, 2016 | Q1 2017 |
| MSM8937 | Snapdragon 430 | 28 nm (TSMC 28LP) | 4 + 4 cores (1.4 GHz + 1.1 GHz Cortex-A53) | Adreno 505 450 MHz (43.2 GFLOPS in FP32) | Hexagon 536 | Up to 21 MP single camera | LPDDR3 Single-channel 32-bit 800 MHz (6.4 GB/s) | X6 LTE | Bluetooth v4.1, 802.11ac with Multi-User MIMO (MU-MIMO), IZat Gen8C | 3.0 | September 15, 2015 | Q2 2016 |
| MSM8940 | Snapdragon 435 | 28 nm (TSMC 28LP) | 4 + 4 cores (1.4 GHz + 1.1 GHz Cortex-A53) | Adreno 505 450 MHz (43.2 GFLOPS in FP32) | Hexagon 536 | Up to 21 MP single camera | LPDDR3 Single-channel 32-bit 800 MHz (6.4 GB/s) | X9 LTE | Bluetooth v4.1, 802.11ac with Multi-User MIMO (MU-MIMO), IZat Gen8C | 3.0 | February 11, 2016 | Q4 2016 |
| SDM429 | Snapdragon 429 | 12 nm (TSMC 12FFC) | 4 cores up to 2.0 GHz Cortex-A53 | Adreno 504 320 MHz (30.7 GFLOPS in FP32) | Hexagon 536 | Up to 16 MP single camera / 8 MP dual camera | LPDDR3 Single-channel 32-bit 800 MHz (6.4 GB/s) | X6 LTE (download: Cat 4, up to 150 Mbit/s; upload: Cat 5, up to 75 Mbit/s) | Bluetooth 5, 802.11ac Wi-Fi up to 433 Mbit/s, USB 2.0 | 3.0 | June 26, 2018 | Q3 2018 |
| SDM439 | Snapdragon 439 | 12 nm (TSMC 12FFC) | 4 + 4 cores (2.0 GHz + 1.45 GHz Cortex-A53) | Adreno 505 650 MHz (62.4 GFLOPS in FP32) | Hexagon 536 | Up to 21 MP single camera / 8 MP dual camera | LPDDR3 Single-channel 32-bit 800 MHz (6.4 GB/s) | X6 LTE (download: Cat 4, up to 150 Mbit/s; upload: Cat 5, up to 75 Mbit/s) | Bluetooth 5, 802.11ac Wi-Fi up to 433 Mbit/s, USB 2.0 | 3.0 | June 26, 2018 | Q3 2018 |
| SDM450 | Snapdragon 450 | 14 nm (Samsung 14LPP) | 8 cores up to 1.8 GHz Cortex-A53 | Adreno 505 600 MHz (57.6 GFLOPS in FP32) | Hexagon 546 | Up to 24 MP single camera / 13 MP dual camera | LPDDR3 Single-channel 32-bit 933 MHz (7.5 GB/s) | X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s) | Bluetooth 4.1, 802.11ac Wi-Fi up to 433 Mbit/s, USB 3.0 | 3.0 | June 28, 2017 | Q3 2017 |
| SM4250-AA | Snapdragon 460 | 11 nm (Samsung 11LPP) | 4 + 4 cores (1.8 GHz Kryo 240 Gold – Cortex-A73 + 1.6 GHz Kryo 240 Silver – Cortex-A53) | Adreno 610 600 MHz (153.6 GFLOPS in FP32) | Hexagon 683 | Spectra 340 (48 MP single camera / 16 MP dual camera) | LPDDR3 up to 933 MHz or LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s) | X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s) | FastConnect 6100, Bluetooth 5.1, NFC, Wi-Fi 802.11a/b/g/n, 802.11ac Wave 2, 802.11ax-ready, NavIC, USB C | 3.0 | January 20, 2020 | Q1 2020 |
| SM4350 | Snapdragon 480 | 8 nm (Samsung 8LPP) | 2 + 6 cores (2.0 GHz Kryo 460 Gold – Cortex-A76 + 1.8 GHz Kryo 460 Silver – Cortex-A55) | Adreno 619 650 MHz (332.8 GFLOPS in FP32) | Hexagon 686 (3.3 TOPS) | Spectra 345 (64 MP single camera / 25+13 MP dual camera with ZSL / 13 MP triple camera with ZSL) | LPDDR4X Dual-channel 16-bit (32-bit), 2133 MHz (17.0 GB/s) | Internal X51 5G (5G NR Sub-6 & mmWave: download up to 2.5 Gbit/s, upload up to 660 Mbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s) | FastConnect 6200, Bluetooth 5.1, NFC, 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO), USB C | 4+ | January 4, 2021 | H1 2021 |
| SM4350-AC | Snapdragon 480+ | 8 nm (Samsung 8LPP) | 2 + 6 cores (2.2 GHz Kryo 460 Gold – Cortex-A76 + 1.9 GHz Kryo 460 Silver – Cortex-A55) | Adreno 619 650 MHz (332.8 GFLOPS in FP32) | Hexagon 686 (3.3 TOPS) | Spectra 345 (64 MP single camera / 25+13 MP dual camera with ZSL / 13 MP triple camera with ZSL) | LPDDR4X Dual-channel 16-bit (32-bit), 2133 MHz (17.0 GB/s) | Internal X51 5G (5G NR Sub-6 & mmWave: download up to 2.5 Gbit/s, upload up to 660 Mbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s) | FastConnect 6200, Bluetooth 5.2, NFC, 802.11a/b/g/n/ac 2x2 (MU-MIMO), USB C | 4+ | October 26, 2021 | Q4 2021 |

### Snapdragon 4 (2022–2024)

| Model number | Product name | Fab | CPU | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Announcement Date | Sampling availability |
| SM4375 | Snapdragon 4 Gen 1 | 6 nm (TSMC N6) | 2 + 6 cores (2.0 GHz Kryo Gold – Cortex-A78 + 1.8 GHz Kryo Silver – Cortex-A55) | Adreno 619 700 MHz (358.4 GFLOPS in FP32) | Hexagon | Spectra (108 MP single camera / 25+13 MP dual camera with ZSL / 13 MP triple camera with ZSL) | LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) | Internal X51 5G (5G NR Sub-6: download up to 2.5 Gbit/s, upload up to 900 Mbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s) | FastConnect 6200, Bluetooth 5.2, 802.11a/b/g/n/ac 2x2 (MU-MIMO), USB 3.1 | 4+ | September 6, 2022 | Q3 2022 |
| SM4450 | Snapdragon 4 Gen 2 | 4 nm (Samsung 4LPX) | 2 + 6 cores (2.2 GHz Kryo Gold – Cortex-A78 + 1.95 GHz Kryo Silver – Cortex-A55) | Adreno 613 955 MHz (244.5 GFLOPS in FP32) | — | Spectra (108 MP single camera / 16 MP dual camera with ZSL) | LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) or LPDDR5 dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s) | Internal X61 5G (5G NR Sub-6: download up to 2.5 Gbit/s, upload up to 900 Mbit/s) | Bluetooth 5.1, 802.11a/b/g/n/ac 1x1, USB 3.2 Gen 1 | 4+ | June 26, 2023 | Q2 2023 |
| SM4450 | Snapdragon 4 Gen 2 Leading Edition | 4 nm (TSMC N4) | 2 + 6 cores (2.3 GHz Kryo Gold – Cortex-A78 + 1.95 GHz Kryo Silver – Cortex-A55) | Adreno 613 955 MHz (244.5 GFLOPS in FP32) | — | Spectra (108 MP single camera / 16 MP dual camera with ZSL) | LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) or LPDDR5 dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s) | Internal X61 5G (5G NR Sub-6: download up to 2.5 Gbit/s, upload up to 900 Mbit/s) | Bluetooth 5.1, 802.11a/b/g/n/ac 1x1, USB 3.2 Gen 1 | 4+ | May 17, 2024 | Q2 2024 |
| SM4635 | Snapdragon 4s Gen 2 | 4 nm (Samsung) | 2 + 6 cores (2.0 GHz Kryo Gold – Cortex-A78 + 1.8 GHz Kryo Silver – Cortex-A55) | Adreno 611 | — | Spectra (84 MP single camera / 16 MP dual camera with ZSL) | LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) | Internal (5G NR Sub-6: download up to 1 Gbit/s) | Bluetooth 5.1, 802.11a/b/g/n/ac 1x1, USB 3.2 Gen 1 | 4+ | July 30, 2024 | Q3 2024 |

## Snapdragon 6 series

The Snapdragon 6 series is the mid-range SoC primarily targeted at both the entry-level and mid-range segments, succeeding the S4 Plus. It is the most commonly used Snapdragon line-up, appearing in mainstream devices of various manufacturers.

### Snapdragon 600 series (2013–2023)

Unlike the later models of the 600 series, Snapdragon 600 was considered a high-end SoC similar to the Snapdragon 800, and was the direct successor of both the Snapdragon S4 Plus and S4 Pro. The Snapdragon 615 was Qualcomm's first octa-core SoC. Starting with the Snapdragon 610, the 600 series became a mid-range SoC lineup, as opposed to the original Snapdragon 600, which was a high-end model.
| Model number | Product name | Fab | CPU (Cores/Freq) | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Announcement Date | Sampling availability |
| APQ8064-1AA (DEB/FLO) | Snapdragon 600 (Advertised as S4 Pro) | 28 nm (TSMC 28LP) | 4 cores up to 1.5 GHz Krait 300 | Adreno 320 400 MHz (76.8 GFLOPS in FP32) | Hexagon QDSP6 V4 500 MHz | Up to 21 MP single camera; Video Capture: 1080p@30fps | DDR3L-1600 (12.8 GB/s) | External | Bluetooth 4.0, Wi-Fi 802.11ac (2.4/5 GHz), IZat Gen8A | 1.0 | January 8, 2013 | Q1 2013 |
| APQ8064M | Snapdragon 600 | 28 nm (TSMC 28LP) | 4 cores up to 1.7 GHz Krait 300 | Adreno 320 400 MHz (76.8 GFLOPS in FP32) | Hexagon QDSP6 V4 500 MHz | Up to 21 MP single camera; Video Capture: 1080p@30fps | LPDDR3 Dual-channel 32-bit (64-bit) 533 MHz (8.6 GB/s) | External | Bluetooth 4.0, Wi-Fi 802.11ac (2.4/5 GHz), IZat Gen8A | 1.0 | January 8, 2013 | Q1 2013 |
| APQ8064T | Snapdragon 600 | 28 nm (TSMC 28LP) | 4 cores up to 1.7 GHz Krait 300 | Adreno 320 400 MHz (76.8 GFLOPS in FP32) | Hexagon QDSP6 V4 500 MHz | Up to 21 MP single camera; Video Capture: 1080p@30fps | LPDDR3 Dual-channel 32-bit (64-bit) 600 MHz (9.6 GB/s) | External | Bluetooth 4.0, Wi-Fi 802.11ac (2.4/5 GHz), IZat Gen8A | 1.0 | January 8, 2013 | Q1 2013 |
| APQ8064AB | Snapdragon 600 | 28 nm (TSMC 28LP) | 4 cores up to 1.9 GHz Krait 300 | Adreno 320 450 MHz (86.4 GFLOPS in FP32) | Hexagon QDSP6 V4 500 MHz | Up to 21 MP single camera; Video Capture: 1080p@30fps | LPDDR3 Dual-channel 32-bit (64-bit) 600 MHz (9.6 GB/s) | External | Bluetooth 4.0, Wi-Fi 802.11ac (2.4/5 GHz), IZat Gen8A | 1.0 | January 8, 2013 | Q1 2013 |
| MSM8936 | Snapdragon 610 | 28 nm (TSMC 28LP) | 4 cores up to 1.7 GHz Cortex-A53 | Adreno 405 550 MHz (52.8 GFLOPS in FP32) | Hexagon V50 700 MHz | Up to 21 MP single camera; Video Capture: 1080p@30fps | LPDDR3 Single-channel 32-bit 800 MHz (6.4 GB/s) | X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s) | Bluetooth 4.0, Qualcomm VIVE, Wi-Fi 802.11ac, NFC, GPS, Glonass, BeiDou | 2.0 | February 24, 2014 | Q3 2014 |
| MSM8939 | Snapdragon 615 | 28 nm (TSMC 28LP) | 4 + 4 cores (1.7 GHz +  1.1 GHz) Cortex-A53 | Adreno 405 550 MHz (52.8 GFLOPS in FP32) | Hexagon V50 700 MHz | Up to 21 MP single camera; Video Capture: 1080p@30fps | LPDDR3 Single-channel 32-bit 800 MHz (6.4 GB/s) | X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s) | Bluetooth 4.0, Qualcomm VIVE, Wi-Fi 802.11ac, NFC, GPS, Glonass, BeiDou | 2.0 | February 24, 2014 | Q3 2014 |
| MSM8939 v2 | Snapdragon 616 | 28 nm (TSMC 28LP) | 4 + 4 cores (1.7 GHz +  1.2 GHz) Cortex-A53 | Adreno 405 550 MHz (52.8 GFLOPS in FP32) | Hexagon V50 700 MHz | Up to 21 MP single camera; Video Capture: 1080p@30fps | LPDDR3 Single-channel 32-bit 800 MHz (6.4 GB/s) | X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s) | Bluetooth 4.0, Qualcomm VIVE, Wi-Fi 802.11ac, NFC, GPS, Glonass, BeiDou | 2.0 | July 31, 2015 | Q3 2015 |
| MSM8952 | Snapdragon 617 | 28 nm (TSMC 28LP) | 4 + 4 cores (1.5 GHz +  1.2 GHz) Cortex-A53 | Adreno 405 550 MHz (52.8 GFLOPS in FP32) | Hexagon 546 | Up to 21 MP single camera; Video Capture: 1080p@30fps | LPDDR3 Single-channel 32-bit 933 MHz (7.5 GB/s) | X8 LTE (Cat 7: download up to 300 Mbit/s, upload up to 100 Mbit/s) | Bluetooth 4.1, VIVE 1-stream 802.11ac Wi-Fi, IZat Gen8C; USB 2.0 | 3.0 | September 15, 2015 | Q4 2015 |
| MSM8953 | Snapdragon 625 | 14 nm (Samsung 14LPP) | 8 cores up to 2.0 GHz Cortex-A53 | Adreno 506 650 MHz (62.4 GFLOPS in FP32) | Hexagon 546 | Up to 24 MP single camera; Video Capture: 4K@30fps | LPDDR3 Single-channel 32-bit 933 MHz (7.5 GB/s) | X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s) | Bluetooth 4.1, NFC, VIVE 1-stream Wi-Fi 802.11ac MU-MIMO, IZat Gen8C; USB 3.0 | 3.0 | February 11, 2016 | Q2 2016 |
| MSM8953 Pro | Snapdragon 626 | 14 nm (Samsung 14LPP) | 8 cores up to 2.2 GHz Cortex-A53 | Adreno 506 650 MHz (62.4 GFLOPS in FP32) | Hexagon 546 | Up to 24 MP single camera; Video Capture: 4K@30fps | LPDDR3 Single-channel 32-bit 933 MHz (7.5 GB/s) | X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s) | Bluetooth 4.1, NFC, VIVE 1-stream Wi-Fi 802.11ac MU-MIMO, IZat Gen8C; USB 3.0 | 3.0 | October 18, 2016 | Q4 2016 |
| SDM630 | Snapdragon 630 | 14 nm (Samsung 14LPP) | 4 + 4 cores (2.2 GHz +  1.8 GHz) Cortex-A53) | Adreno 508 650 MHz (124.8 GFLOPS in FP32) | Hexagon 642 | Spectra 160 (24 MP single camera / 13 MP dual camera; Video Capture: 4K@30fps) | LPDDR4 Dual-channel 16-bit (32-bit) 1333 MHz (10.66 GB/s) | X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s) | Bluetooth 5, 802.11ac Wi-Fi 1x1, NFC, USB 3.1 | 4.0 | May 8, 2017 | Q2 2017 |
| SDM632 | Snapdragon 632 | 14 nm (Samsung 14LPP) | 4 + 4 cores (1.8 GHz Kryo 250 Gold – Cortex-A73 + 1.8 GHz Kryo 250 Silver – Cortex-A53) | Adreno 506 725 MHz (69.6 GFLOPS in FP32) | Hexagon 546 | Up to 40 MP single camera, 13 MP dual camera; Video Capture: 4K@30fps | LPDDR3 Single-channel 32-bit 933 MHz (7.5 GB/s) | X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s) | Bluetooth 5, 802.11ac Wi-Fi 1x1, NFC, USB 3.1 | 3.0 | June 26, 2018 | Q3 2018 |
| SDM636 | Snapdragon 636 | 14 nm (Samsung 14LPP) | 4 + 4 cores (1.8 GHz Kryo 260 Gold – Cortex-A73 + 1.6 GHz Kryo 260 Silver – Cortex-A53) | Adreno 509 430 MHz (110.1 GFLOPS in FP32) | Hexagon 680 | Spectra 160 (24 MP single camera / 16 MP dual camera; Video Capture: 4K@30fps) | LPDDR4 Dual-channel 16-bit (32-bit) 1333 MHz (10.7 GB/s) | X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s) | Bluetooth 5, 802.11ac Wi-Fi 1x1, NFC, USB 3.1 | 4.0 | October 17, 2017 | Q4 2017 |
| MSM8956 | Snapdragon 650 | 28 nm (TSMC 28HPM) | 2 + 4 cores (1.8 GHz Cortex-A72 + 1.4 GHz Cortex-A53) | Adreno 510 600 MHz (153.6 GFLOPS in FP32) | Hexagon V56 | Up to 21 MP single camera; Video Capture: 4K@30fps | LPDDR3 Dual-channel 32-bit (64-bit) 933 MHz (14.9 GB/s) | X8 LTE (Cat 7: download up to 300 Mbit/s, upload up to 100 Mbit/s) | Bluetooth Smart 4.1, VIVE 1-stream 802.11ac Wi-Fi, IZat Gen8C GNSS; USB 2.0 | 3.0 | February 18, 2015 | Q1 2016 |
| MSM8976 | Snapdragon 652 | 28 nm (TSMC 28HPM) | 4 + 4 cores (1.8 GHz Cortex-A72 + 1.4 GHz Cortex-A53) | Adreno 510 600 MHz (153.6 GFLOPS in FP32) | Hexagon V56 | Up to 21 MP single camera; Video Capture: 4K@30fps | LPDDR3 Dual-channel 32-bit (64-bit) 933 MHz (14.9 GB/s) | X8 LTE (Cat 7: download up to 300 Mbit/s, upload up to 100 Mbit/s) | Bluetooth Smart 4.1, VIVE 1-stream 802.11ac Wi-Fi, IZat Gen8C GNSS; USB 2.0 | 3.0 | February 18, 2015 | Q1 2016 |
| MSM8976 Pro | Snapdragon 653 | 28 nm (TSMC 28HPM) | 4 + 4 cores (1.95 GHz Cortex-A72 + 1.4 GHz Cortex-A53) | Adreno 510 621 MHz (159 GFLOPS in FP32) | Hexagon V56 | Up to 21 MP single camera; Video Capture: 4K@30fps | LPDDR3 Dual-channel 32-bit (64-bit) 933 MHz (14.9 GB/s) | X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s) | Bluetooth Smart 4.1, VIVE 1-stream 802.11ac Wi-Fi, IZat Gen8C GNSS; USB 2.0 | 3.0 | October 18, 2016 | Q4 2016 |
| SDM660 | Snapdragon 660 | 14 nm (Samsung 14LPP) | 4 + 4 cores (2.2 GHz Kryo 260 Gold – Cortex-A73 + 1.84 GHz Kryo 260 Silver – Cortex-A53) | Adreno 512 647 MHz (165.6 GFLOPS in FP32) | Hexagon 680 | Spectra 160 (48 MP single camera / 16 MP dual camera; Video Capture: 4K@30fps) | LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s) | X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s) | Bluetooth 5, 802.11ac Wi-Fi, NFC, USB 3.1 | 4.0 | May 8, 2017 | Q2 2017 |
| SDA660 | Snapdragon 660 | 14 nm (Samsung 14LPP) | 4 + 4 cores (2.2 GHz Kryo 260 Gold – Cortex-A73 + 1.84 GHz Kryo 260 Silver – Cortex-A53) | Adreno 512 647 MHz (165.6 GFLOPS in FP32) | Hexagon 680 | Spectra 160 (48 MP single camera / 16 MP dual camera; Video Capture: 4K@30fps) | LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s) | Internal: no | Bluetooth 5, 802.11ac Wi-Fi, NFC, USB 3.1 | 4.0 | May 8, 2017 | Q2 2017 |
| SM6115 | Snapdragon 662 | 11 nm (Samsung 11LPP) | 4 + 4 cores (2.0 GHz Kryo 260 Gold – Cortex-A73 + 1.8 GHz Kryo 260 Silver – Cortex-A53) | Adreno 610 950 MHz (243.2 GFLOPS in FP32) | Hexagon 683 | Spectra 340T (48 MP single camera / 13 MP dual camera; Video Capture: 1080p@60fps) | LPDDR3 933 MHz LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s) | X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s) | FastConnect 6100, Bluetooth 5.1, NFC, Wi-Fi 802.11ac Wave 2, 802.11ax-ready, NavIC, USB C | 3.0 | January 20, 2020 | Q1 2020 |
| SM6125 | Snapdragon 665 | 11 nm (Samsung 11LPP) | 4 + 4 cores (2.0 GHz Kryo 260 Gold – Cortex-A73 + 1.8 GHz Kryo 260 Silver – Cortex-A53) | Adreno 610 950 MHz (243.2 GFLOPS in FP32) | Hexagon 686 (3.3 TOPS) | Spectra 165 (48 MP single camera / 16 MP dual camera; Video Capture: 4K@30fps) | LPDDR3 933 MHz LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s) | X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s) | Bluetooth 5.1, Wi-Fi 802.11ac, NFC, USB 3.1 | 3.0 | April 9, 2019 | Q2 2019 |
| SDM670 | Snapdragon 670 | 10 nm (Samsung 10LPP) | 2 + 6 cores (2.0 GHz Kryo 360 Gold – Cortex-A75 + 1.7 GHz Kryo 360 Silver – Cortex-A55) | Adreno 615 430 MHz (220.2 GFLOPS in FP32) | Hexagon 685 (3 TOPS) | Spectra 250 (192 MP single camera / 16 MP dual camera with ZSL; Video Capture: 4K@30fps) | LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s) | X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s) | Bluetooth 5, 802.11ac Wi-Fi, NFC, USB 3.1 | 4+ | August 8, 2018 | Q3 2018 |
| SM6150 | Snapdragon 675 | 11 nm (Samsung 11LPP) | 2 + 6 cores (2.0 GHz Kryo 460 Gold – Cortex-A76 + 1.7 GHz Kryo 460 Silver – Cortex-A55) | Adreno 612 845 MHz (216.3 GFLOPS in FP32) | Hexagon 685 (3 TOPS) | Spectra 250L (192 MP single camera / 16 MP dual camera with ZSL; Video Capture: 4K@30fps) | LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s) | X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s) | Bluetooth 5, 802.11ac Wi-Fi, NFC, USB 3.1 | 4+ | October 22, 2018 | Q1 2019 |
| SM6150- AC | Snapdragon 678 | 11 nm (Samsung 11LPP) | 2 + 6 cores (2.2 GHz Kryo 460 Gold – Cortex-A76 + 1.7 GHz Kryo 460 Silver – Cortex-A55) | Adreno 612 895 MHz (229.1 GFLOPS in FP32) | Hexagon 685 (3 TOPS) | Spectra 250L (192 MP single camera / 16 MP dual camera with ZSL; Video Capture: 4K@30fps) | LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s) | X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s) | Bluetooth 5, 802.11ac Wi-Fi, NFC, USB 3.1 | 4+ | December 15, 2020 | Q4 2020 |
| SM6225 | Snapdragon 680 | 6 nm (TSMC N6) | 4 + 4 cores (2.4 GHz Kryo 265 Gold – Cortex-A73 + 1.9 GHz Kryo 265 Silver – Cortex-A53) | Adreno 610 1114 MHz (285.2 GFLOPS in FP32) | Hexagon 686 (3.3 TOPS) | Spectra 346 (64 MP single camera / 16 MP dual camera with ZSL / 13+13+5 MP triple camera with ZSL; Video Capture: 1080p@60fps) | LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s) | X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s) | FastConnect 6100, Bluetooth 5.1, Wi-Fi 802.11ac Wave 2, NFC, NavIC, USB C | 3.0 | October 26, 2021 | Q4 2021 |
| SM6225- AD | Snapdragon 685 | 6 nm (TSMC N6) | 4 + 4 cores (2.8 GHz Kryo 265 Gold – Cortex-A73 + 1.9 GHz Kryo 265 Silver – Cortex-A53) | Adreno 610 1260 MHz (322.6 GFLOPS in FP32) | Hexagon 686 (3.3 TOPS) | Spectra (108 MP single camera / 16 MP dual camera with ZSL / 13+13+5 MP triple camera with ZSL; Video Capture: 1080p@60fps) | LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s) | X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s) | FastConnect 6200, Bluetooth 5.2, Wi-Fi 802.1ac 1x1, USB 3.1 | 3.0 | March 23, 2023 | Q1 2023 |
| SM6350 | Snapdragon 690 | 8 nm (Samsung 8LPP) | 2 + 6 cores (2.0 GHz Kryo 560 Gold – Cortex-A77 + 1.7 GHz Kryo 560 Silver – Cortex-A55) | Adreno 619L 565 MHz (289.3 GFLOPS in FP32) | Hexagon 692 (5 TOPS) | Spectra 355L (192 MP single camera / 32+16 MP dual camera with ZSL; Video Capture: 4K@30fps HDR) | LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s) | Internal X51 5G (5G NR Sub-6: download up to 2.5 Gbit/s, upload up to 900 Mbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) | FastConnect 6200, Bluetooth 5.1, 802.11ac/ax 2x2 (MU-MIMO), NFC, USB 3.1 | 4+ | June 16, 2020 | H2 2020 |
| SM6375 | Snapdragon 695 | 6 nm (TSMC N6) | 2 + 6 cores (2.2 GHz Kryo 660 Gold – Cortex-A78 + 1.8 GHz Kryo 660 Silver – Cortex-A55) | Adreno 619 840 MHz (430.1 GFLOPS in FP32) | Hexagon 686 (3.3 TOPS) | Spectra 346T (108 MP single camera / 25+13 MP dual camera with ZSL / 13 MP triple camera with ZSL; Video Capture: 1080p@60fps) | LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s) | Internal X51 5G (5G NR Sub-6 & mmWave: download up to 2.5 Gbit/s, upload up to 1.5 Gbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s) | FastConnect 6200, Bluetooth 5.2, 802.11ac 2x2 (MU-MIMO), NFC, USB C | 4+ | October 26, 2021 | Q4 2021 |

### Snapdragon 6 (2022–2024)

| Model number | Product name | Fab | CPU (Cores / Freq) | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Announcement Date | Sampling availability |
| SM6450 | Snapdragon 6 Gen 1 | 4 nm (Samsung 4LPX) | Kryo 4 + 4 cores (2.2 GHz Cortex-A78 + 1.8 GHz Cortex-A55) | Adreno 710 676 MHz (346.1 GFLOPS in FP32) | Hexagon | Spectra (200 MP Photo Capture / 48 MP single camera with ZSL / 25+16 MP dual camera with ZSL / 13 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) | LPDDR5 Dual-channel 16-bit (32-bit) 2750 MHz (22 GB/s) | Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) | FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 | 4+ | September 6, 2022 | Q1 2023 |
| SM6115-AC | Snapdragon 6s Gen 1 | 11 nm (Samsung 11LPP) | Kryo 4 + 4 cores (2.1 GHz Cortex-A73 + 2.0 GHz Cortex-A53) | Adreno 610 1050 MHz (268.8 GFLOPS in FP32) | Hexagon | Spectra (48 MP single camera / 13 MP dual camera with ZSL; Video Capture: 1080p@60fps) | LPDDR3 up to 933 MHz / LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s) | X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s) | FastConnect 6100, Bluetooth 5.1, Wi-Fi 802.11a/b/g/n, 802.11ac Wave 2, 802.11ax-ready, USB C | 3.0 | August 9, 2024 | Q3 2024 |
| SM6475-AB | Snapdragon 6 Gen 3 | 4 nm (Samsung 4LPX) | Kryo 4 + 4 cores (2.4 GHz Cortex-A78 + 1.8 GHz Cortex-A55) | Adreno 710 | Hexagon | Spectra (200 MP Photo Capture / 48 MP single camera with ZSL / 32+16 MP dual camera with ZSL / 16 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) | LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) or LPDDR5 dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s) | Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) | FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 | 4+ | August 31, 2024 | Q3 2024 |
| SM6375-AC | Snapdragon 6s Gen 3 | 6 nm (TSMC N6) | Kryo 2 + 6 cores (2.3 GHz Cortex-A78 + 2.0 GHz Cortex-A55) | Adreno 619 900 MHz (460.8 GFLOPS in FP32) | Hexagon | Spectra (108 MP single camera / 25+13 MP dual camera with ZSL / 13 MP triple camera with ZSL; Video Capture: 1080p@60fps) | LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s) | Internal X51 5G (5G NR Sub-6 & mmWave: download up to 2.5 Gbit/s, upload up to 1.5 Gbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s) | FastConnect 6200, Bluetooth 5.2, 802.11a/b/g/n/ac 2x2 (MU-MIMO), USB C | 4+ | June 6, 2024 | Q2 2024 |
| SM6650 | Snapdragon 6 Gen 4 | 4 nm (TSMC N4P) | Kryo (1× 2.3 GHz Cortex-A720 + 3× 2.2 GHz Cortex-A720 + 4× 1.8 GHz Cortex-A520) | Adreno 810 895 MHz (458.2 GFLOPS in FP32) | Hexagon | Spectra (200 MP Photo Capture / 64 MP single camera with ZSL / 32+16 MP dual camera with ZSL / 16 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) | LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) or LPDDR5 dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s) | Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) | FastConnect 6700; Bluetooth 5.4; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 | 4+ | February 12, 2025 | Q1 2025 |

## Snapdragon 7 series

On February 27, 2018, Qualcomm Introduced the Snapdragon 7 Mobile Platform Series. It is an upper mid-range SoC designed to bridge the gap between the 6 series and the 8 series, and primarily aimed at premium mid-range segment.

### Snapdragon 700 series (2018–2022)

| Model number | Product name | Fab | CPU (ARMv8.2) | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Announcement Date | Sampling availability |
| SDM710 | Snapdragon 710 | 10 nm (Samsung 10LPP) | 2 + 6 cores (2.2 GHz Kryo 360 Gold – Cortex-A75 + 1.7 GHz Kryo 360 Silver – Cortex-A55) | Adreno 616 504 MHz (258 GFLOPS in FP32) | Hexagon 685 (3 TOPS) | Spectra 250 (192 MP single camera / 16 MP dual camera with ZSL; Video Capture: 4K@30fps) | LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s) | X15 LTE (download: Cat 15, up to 800 Mbit/s; upload: Cat 13, up to 150 Mbit/s) | Bluetooth 5.0; NFC; 802.11ac 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1 | 4 | May 23, 2018 | Q2 2018 |
| SDM712 | Snapdragon 712 | 10 nm (Samsung 10LPP) | 2 + 6 cores (2.3 GHz Kryo 360 Gold – Cortex-A75 + 1.7 GHz Kryo 360 Silver – Cortex-A55) | Adreno 616 610 MHz (312.3 GFLOPS in FP32) | Hexagon 685 (3 TOPS) | Spectra 250 (192 MP single camera / 16 MP dual camera with ZSL; Video Capture: 4K@30fps) | LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s) | X15 LTE (download: Cat 15, up to 800 Mbit/s; upload: Cat 13, up to 150 Mbit/s) | Bluetooth 5.0; NFC; 802.11ac 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1 | 4+ | February 6, 2019 | Q1 2019 |
| SM7125 | Snapdragon 720G | 8 nm (Samsung 8LPP) | 2 + 6 cores (2.3 GHz Kryo 465 Gold – Cortex-A76 + 1.8 GHz Kryo 465 Silver – Cortex-A55) | Adreno 618 750 MHz (384 GFLOPS in FP32) | Hexagon 692 (5 TOPS) | Spectra 350L (192 MP single camera / 16 MP dual camera with ZSL; Video Capture: 4K@30fps) | LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s) | X15 LTE (download: Cat 15, up to 800 Mbit/s; upload: Cat 13, up to 150 Mbit/s) | FastConnect 6200; Bluetooth 5.1; NFC; 802.11ac/ax 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NavIC; USB 3.1 | 4+ | January 20, 2020 | Q1 2020 |
| SM7150-AA | Snapdragon 730 | 8 nm (Samsung 8LPP) | 2 + 6 cores (2.2 GHz Kryo 470 Gold – Cortex-A76 + 1.8 GHz Kryo 470 Silver – Cortex-A55) | Adreno 618 610 MHz (312.3 GFLOPS in FP32) | Hexagon 688 (3.6 TOPs) | Spectra 350 (192 MP single camera / 22 MP dual camera with ZSL; Video Capture: 4K@30fps HDR) | LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s) | X15 LTE (download: Cat 15, up to 800 Mbit/s; upload: Cat 13, up to 150 Mbit/s) | FastConnect 6200; Bluetooth 5.0; NFC; 802.11ac/ax 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1 | 4+ | April 9, 2019 | Q2 2019 |
| SM7150-AB | Snapdragon 730G | 8 nm (Samsung 8LPP) | 2 + 6 cores (2.2 GHz Kryo 470 Gold – Cortex-A76 + 1.8 GHz Kryo 470 Silver – Cortex-A55) | Adreno 618 700 MHz (358.4 GFLOPS in FP32) | Hexagon 688 (3.6 TOPs) | Spectra 350 (192 MP single camera / 22 MP dual camera with ZSL; Video Capture: 4K@30fps HDR) | LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s) | X15 LTE (download: Cat 15, up to 800 Mbit/s; upload: Cat 13, up to 150 Mbit/s) | FastConnect 6200; Bluetooth 5.0; NFC; 802.11ac/ax 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1 | 4+ | April 9, 2019 | Q2 2019 |
| SM7150-AC | Snapdragon 732G | 8 nm (Samsung 8LPP) | 2 + 6 cores (2.3 GHz Kryo 470 Gold – Cortex-A76 + 1.8 GHz Kryo 470 Silver – Cortex-A55) | Adreno 618 800 MHz (409.6 GFLOPS in FP32) | Hexagon 688 (3.6 TOPs) | Spectra 350 (192 MP single camera / 22 MP dual camera with ZSL; Video Capture: 4K@30fps HDR) | LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s) | X15 LTE (download: Cat 15, up to 800 Mbit/s; upload: Cat 13, up to 150 Mbit/s) | FastConnect 6200; Bluetooth 5.1; NFC; 802.11ac/ax 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1 | 4+ | August 31, 2020 | Q3 2020 |
| SM7225 | Snapdragon 750G | 8 nm (Samsung 8LPP) | 2 + 6 cores (2.2 GHz Kryo 570 Gold – Cortex-A77 + 1.8 GHz Kryo 570 Silver – Cortex-A55) | Adreno 619 800 MHz (409.6 GFLOPS in FP32) | Hexagon 694 (4.7 TOPs) | Spectra 355L (192 MP single camera / 32+16 MP dual camera with ZSL; Video Capture: 4K@30fps HDR) | LPDDR4X Dual-channel 16-bit (32-bit), 2133 MHz (17 GB/s) | Internal X52 5G (5G NR Sub-6 & mmWave: download up to 3.7 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) | FastConnect 6200; Bluetooth 5.1; NFC; 802.11ac/ax-ready 2x2 (MU-MIMO); GPS, GLONASS, NavIC, Beidou, Galileo, QZSS, SBAS; USB 3.1 | 4+ | September 22, 2020 | Q4 2020 |
| SM7250-AA | Snapdragon 765 | 7 nm (Samsung 7LPP) | 1x 2.3 GHz Kryo 475 Prime (Cortex-A76) + 1x 2.2 GHz Kryo 475 Gold (Cortex-A76) + 6x 1.8 GHz Kryo 475 Silver (Cortex-A55) | Adreno 620 540 MHz (414.7 GFLOPS in FP32) | Hexagon 696 (5.4 TOPs) | Spectra 355 (192 MP Photo Capture / 36 MP single camera with ZSL / 22 MP dual camera with ZSL; Video Capture: 4K@30fps HDR) | LPDDR4X Dual-channel 16-bit (32-bit), 2133 MHz (17 GB/s) | Internal X52 5G (5G NR Sub-6 & mmWave: download up to 3.7 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) | FastConnect 6200; Bluetooth 5.0; NFC; 802.11ac/ax 2x2 (MU-MIMO) up to 867 Mbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS, SBAS; USB 3.1 | 4+ | December 4, 2019 | Q1 2020 |
| SM7250-AB | Snapdragon 765G | 7 nm (Samsung 7LPP) | 1x 2.4 GHz Kryo 475 Prime (Cortex-A76) + 1x 2.2 GHz Kryo 475 Gold (Cortex-A76) + 6x 1.8 GHz Kryo 475 Silver (Cortex-A55) | Adreno 620 625 MHz (480 GFLOPS in FP32) | Hexagon 696 (5.4 TOPs) | Spectra 355 (192 MP Photo Capture / 36 MP single camera with ZSL / 22 MP dual camera with ZSL; Video Capture: 4K@30fps HDR) | LPDDR4X Dual-channel 16-bit (32-bit), 2133 MHz (17 GB/s) | Internal X52 5G (5G NR Sub-6 & mmWave: download up to 3.7 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) | FastConnect 6200; Bluetooth 5.0; NFC; 802.11ac/ax 2x2 (MU-MIMO) up to 867 Mbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS, SBAS; USB 3.1 | 4+ | December 4, 2019 | Q1 2020 |
| SM7250-AC | Snapdragon 768G | 7 nm (Samsung 7LPP) | 1x 2.8 GHz Kryo 475 Prime (Cortex-A76) + 1x 2.4 GHz Kryo 475 Gold (Cortex-A76) + 6x 1.8 GHz Kryo 475 Silver (Cortex-A55) | Adreno 620 750 MHz (576 GFLOPS in FP32) | Hexagon 696 (5.4 TOPs) | Spectra 355 (192 MP Photo Capture / 36 MP single camera with ZSL / 22 MP dual camera with ZSL; Video Capture: 4K@30fps HDR) | LPDDR4X Dual-channel 16-bit (32-bit), 2133 MHz (17 GB/s) | Internal X52 5G (5G NR Sub-6 & mmWave: download up to 3.7 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) | FastConnect 6200; Bluetooth 5.2; NFC; 802.11ac/ax 2x2 (MU-MIMO) up to 867 Mbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS, SBAS; USB 3.1 | 4+ | May 10, 2020 | Q2 2020 |
| SM7325 | Snapdragon 778G | 6 nm (TSMC N6) | 1x 2.4 GHz Kryo 670 Prime (Cortex-A78) + 3x 2.4 GHz Kryo 670 Gold (Cortex-A78) + 4x 1.8 GHz Kryo 670 Silver (Cortex-A55) | Adreno 642L 550 MHz (563.2 GFLOPS in FP32) | Hexagon 770 (12 TOPs) | Spectra 570L (200 MP Photo Capture / 64 MP single camera with ZSL / 36+22 MP dual camera with ZSL / 22 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) | LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s) | Internal: X53 5G (5G NR Sub-6 & mmWave: download up to 3.7 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) | FastConnect 6700; Bluetooth 5.2; 802.11ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 | 4+ | May 19, 2021 | Q2 2021 |
| SM7325-AE | Snapdragon 778G+ | 6 nm (TSMC N6) | 1x 2.5 GHz Kryo 670 Prime (Cortex-A78) + 3x 2.4 GHz Kryo 670 Gold (Cortex-A78) + 4x 1.8 GHz Kryo 670 Silver (Cortex-A55) | Adreno 642L 608 MHz (622.6 GFLOPS in FP32) | Hexagon 770 (12 TOPs) | Spectra 570L (200 MP Photo Capture / 64 MP single camera with ZSL / 36+22 MP dual camera with ZSL / 22 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) | LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s) | Internal: X53 5G (5G NR Sub-6 & mmWave: download up to 3.7 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) | FastConnect 6700; Bluetooth 5.2; 802.11ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 | 4+ | October 26, 2021 | Q4 2021 |
| SM7350-AB | Snapdragon 780G | 5 nm (Samsung 5LPE) | 1x 2.4 GHz Kryo 670 Prime (Cortex-A78) + 3x 2.2 GHz Kryo 670 Gold (Cortex-A78) + 4x 1.9 GHz Kryo 670 Silver (Cortex-A55) | Adreno 642 490 MHz (752.6 GFLOPS in FP32) | Hexagon 770 (12 TOPs) | Spectra 570 (192 MP Photo Capture / 84 MP single camera with ZSL / 64+20 MP dual camera with ZSL / 25 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) | LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s) | Internal: X53 5G (5G NR Sub-6: download up to 3.3 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) | FastConnect 6900; Bluetooth 5.2; 802.11ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 | 4+ | March 25, 2021 | Q1 2021 |
| SM7325-AF | Snapdragon 782G | 6 nm (TSMC N6) | 1x 2.7 GHz Kryo 670 Prime (Cortex-A78) + 3x 2.4 GHz Kryo 670 Gold (Cortex-A78) + 4x 1.8 GHz Kryo 670 Silver (Cortex-A55) | Adreno 642L 719 MHz (736.3 GFLOPS in FP32) | Hexagon 770 (12 TOPs) | Spectra 570L (200 MP Photo Capture / 64 MP single camera with ZSL / 36+22 MP dual camera with ZSL / 22 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) | LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s) | Internal: X53 5G (5G NR Sub-6 & mmWave: download up to 3.7 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) | FastConnect 6700; Bluetooth 5.2; 802.11ac/ax (Wi-Fi 6) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 | 4+ | November 23, 2022 | Q4 2022 |

### Snapdragon 7 (2022–2024)

| Model number | Product name | Fab | CPU (Cores / Freq) | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Announcement Date | Sampling availability |
| SM7450-AB | Snapdragon 7 Gen 1 | 4 nm (Samsung 4LPX) | Kryo (1× 2.4 GHz {2.5 GHz Accelerated Edition} Cortex-A710 + 3× 2.36 GHz Cortex-A710 + 4× 1.8 GHz Cortex-A510) | Adreno 644 443 MHz (680.4 GFLOPS in FP32) | Hexagon | Spectra (200 MP Photo Capture / 84 MP single camera with ZSL / 64+20 MP dual camera with ZSL / 25 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) | LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s) | Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 4.4 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) | FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 | 4+ | May 20, 2022 | Q2 2022 |
| SM7475-AB | Snapdragon 7+ Gen 2 | 4 nm (TSMC N4) | Kryo (1× 2.91 GHz Cortex-X2 + 3× 2.49 GHz Cortex-A710 + 4× 1.8 GHz Cortex-A510) | Adreno 725 580 MHz (1187.8 GFLOPS in FP32) | Hexagon | Spectra (200 MP Photo Capture / 108 MP single camera with ZSL / 64+36 MP dual camera with ZSL / 32 MP triple camera with ZSL; Video Capture: 4K@60fps HDR) | LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s) | Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 4.4 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) | FastConnect 6900; Bluetooth 5.3; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 | 5 | March 17, 2023 | Q1 2023 |
| SM7435-AB | Snapdragon 7s Gen 2 | 4 nm (Samsung 4LPX) | Kryo 4 + 4 cores (2.4 GHz Cortex-A78 + 1.95 GHz Cortex-A55) | Adreno 710 940 MHz (481.3 GFLOPS in FP32) | Hexagon | Spectra (200 MP Photo Capture / 48 MP single camera with ZSL / 32+16 MP dual camera with ZSL / 16 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) | LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) or LPDDR5 dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s) | Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) | FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 | 4+ | September 15, 2023 | Q3 2023 |
| SM7550-AB | Snapdragon 7 Gen 3 | 4 nm (TSMC N4P) | Kryo (1× 2.63 GHz Cortex-A715 + 3× 2.4 GHz Cortex-A715 + 4× 1.8 GHz Cortex-A510) | Adreno 720 975 MHz (998.4 GFLOPS in FP32) | Hexagon | Spectra (200 MP Photo Capture / 64 MP single camera with ZSL / 32+21 MP dual camera with ZSL / 21 MP triple camera with ZSL; Video Capture: 4K@60fps HDR) | LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) or LPDDR5 dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s) | Internal: X63 5G (5G NR Sub-6 & mmWave: download up to 5 Gbit/s, upload up to 3.5 Gbit/s) | FastConnect 6700; Bluetooth 5.4; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 | 5 | November 17, 2023 | Q4 2023 |
| SM7675-AB | Snapdragon 7+ Gen 3 | 4 nm (TSMC N4P) | Kryo (1× 2.8 GHz Cortex-X4 + 4× 2.6 GHz Cortex-A720 + 3× 1.9 GHz Cortex-A520) | Adreno 732 950 MHz (1459.2 GFLOPS in FP32) | Hexagon | Spectra (200 MP Photo Capture / 108 MP single camera with ZSL / 64+36 MP dual camera with ZSL / 36 MP triple camera with ZSL; Video Capture: 4K@60fps HDR) | LPDDR5X quad-channel 16-bit (64-bit) 4200 MHz (67.2 GB/s) | Internal: X63 5G (5G NR Sub-6 & mmWave: download up to 5 Gbit/s, upload up to 3.5 Gbit/s) | FastConnect 7800; Bluetooth 5.4; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) 2x2 (MU-MIMO) up to 5.8 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 | 5 | March 21, 2024 | Q1 2024 |
| SM7635 | Snapdragon 7s Gen 3 | 4 nm (TSMC N4P) | Kryo (1× 2.5 GHz Cortex-A720 + 3× 2.4 GHz Cortex-A720 + 4× 1.8 GHz Cortex-A520) | Adreno 810 1050 MHz (537.6 GFLOPS in FP32) | Hexagon | Spectra (200 MP Photo Capture / 64 MP single camera with ZSL / 32+21 MP dual camera with ZSL / 21 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) | LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) or LPDDR5 dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s) | Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) | FastConnect 6700; Bluetooth 5.4; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 | 4+ | August 20, 2024 | Q3 2024 |

## Snapdragon 8 series

The Snapdragon 8 series is the high-end SoC and serves as Qualcomm's current flagship, succeeding the S4 Pro and the older S1/S2/S3 series.

### Snapdragon 800 series (2013–2021)

* Features of the Snapdragon 800 series
* The Snapdragon 800 was announced on January 8, 2013.
* CPU features
* 4 cores up to 2.36 GHz Krait 400
* 4 KiB + 4 KiB L0 cache, 16 KiB + 16 KiB L1 cache and 2 MiB L2 cache
* GPU features
* Adreno 330 GPU
* Up to 128 ALU (from 96 on Adreno 320)
* Up to 1024 KB On-chip graphics memory (from 512 KB on Adreno 320)
* up to ×30 relative performance on OpenGL ES 2.0 from Adreno 200
* Support OpenGL ES 3.0 (Over 2.0 Adreno Adreno 225)
* Unified shader model Scalar instruction set (from Unified shader model 5-way VLIW on 2xx Adreno series)
* DSP features
* H.264, VP8 UHD/30fps encoding/decoding (from 1080p60)
* ISP features
* Up to 21 megapixel, stereoscopic 3D 24dual image signal processor (supports HDRI)
* Throughput: 0.64 GP/sec
* Up to 320 MHz
* Modem and wireless features
* Wi-Fi 802.11ac wave 1 support
* Gobi 4G (LTE Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s), on some models
* SOC features
* eMMC 4.5 support
* USB 2.0 and 3.0
* Qualcomm Quick Charge 2.0
* 28 nm HPm (from 28 nm HP)
* Up to 1 billion transistors
* Die size: 118 mm$^2$
* The Snapdragon 801 was announced on February 24, 2014.
* CPU features
* 4 cores up to 2.45 GHz Krait 400
* DSP features
* H.265 HD/30fps software decoding
* ISP features
* Throughput: 1.0 GP/sec (from 0.64 GP/sec on S800)
* Up to 465 MHz (from 320 MHz on S800)
* eMMC 5.0 support (Up to 400 MB/s)
* DSDA
* The Snapdragon 805 was announced on November 20, 2013.
* CPU features
* 4 cores up to 2.7 GHz Krait 450
* Up to 128-bit wide LPDDR3 memory interface
* GPU features
* Adreno 420 GPU
* Up to 128 ALU
* Hardware dynamic tessellation support
* Support for hull, domain and geometry shaders
* Update with new dedicated connection to the memory controller(from shared bus with the video decoder and ISP)
* Up to 40% increase performance in shader hardware
* 1.5× larger L2 cache (1536 KB from 1024 KB)
* Better anisotropic filtering support
* Larger texture cache
* Full support Direct3D Feature Level 11_2 and OpenCL 1.2
* DSP features
* Improve H.265 support : UHD/30fps hardware decoding
* 1080p 120fps encoding and decoding
* ISP features
* Up to 55 megapixel
* Throughput: 1.0 GP/sec (from 0.64 GP/sec on SD800)
* Modem and wireless features
* External modem
* The Snapdragon 808 and 810 were announced on April 7, 2014.
* Snapdragon 808 notable features over its predecessor (805):
* CPU features
* ARM architecture#ARMv8-A 64-bit architecture (with Global Task Scheduling)
* 2 + 4 cores (1.82 GHz Cortex-A57 + 1.44 GHz Cortex-A53)
* Up to 48 KB Data + 32 KB Instr. L1 cache (from 16 KB + 16 KB)
* GPU features
* Up to 128 ALU
* Adreno 418 GPU with support for Vulkan 1.0
* Support OpenGL ES 3.1
* Full support Direct3D Feature Level 11_2 and OpenCL 1.2
* DSP features
* Hexagon V56 DSP
* ISP features
* 12-bit dual-ISP up to 21 MP
* SOC features
* 2 billion transistor
* Snapdragon 810 notable features over its lower-end version (808):
* CPU features
* 4 + 4 cores (2.0 GHz Cortex-A57 + 1.5 GHz Cortex-A53)
* GPU features
* Adreno 430 GPU with support for Vulkan 1.0
* Full support Direct3D Feature Level 11_2 and OpenCL 1.2
* 4K main display support
* Up to 192 ALU (from 128 on Adreno 330)
* ISP features
* 14-bit dual-ISP up to 55 MP
* Throughput: 1.2 GP/sec (from 1.0 GP/sec on SD805)
* ISP is clocked at 600 MHz
* DSP features
* H.264, H.265 UHD/30fps encoding and decoding
* Modem and wireless features
* Snapdragon X10 LTE modem
* Cat 9: download up to 450 Mbit/s
* Upload up to 50 Mbit/s
* Bluetooth 4.1
* SOC features
* 20 nm manufacturing technology
* 2.5 billion transistor
* The Snapdragon 820 was announced at the Mobile World Congress in March 2015, with the first phones featuring the SoC released in early 2016.
* Notable features over its predecessors (808 and 810):
* CPU features
* Custom Kryo quad-core CPU
* Per Core : L1: 32+32 KB, L2: 2 MB + 1 MB
* L3 cache shared between CPU cluster
* GPU features
* Adreno 530 GPU with support for Vulkan 1.0
* Less L2 GPU cache (1024 KB from 1536 KB)
* DirectX 12, OpenCL 2.0, OpenGL ES 3.2
* DSP features
* Hexagon 680 DSP 1st generation "AI engine"
* Down to 2-3 time power consumption (from SD808)
* New low power island (LPI) for sensor aware apps
* Hexagon Vector eXtensions
* All-Ways Aware Hub low power island
* Neural Processing Engine (NPE)
* Halide and TensorFlow support
* H.264, H.265 UHD/30fps encoding
* H.264, H.265 10-bit, VP9 UHD/60fps decoding
* ISP features
* Qualcomm Spectra ISP with Dual 14-bit ISPs
* 28 MP at 30fps single camera; 25 MP at 30fps single camera with ZSL; 13 MP Dual Camera with ZSL
* Video Capture: Up to 4K Ultra HD HEVC video capture @ 30FPS
* Video Playback: Up to 4K Ultra HD 10-bit HEVC video playback @ 60FPS, 1080p@ 240 FPS
* Throughput: 1.2GP/sec (Same as 810)
* Modem and wireless features
* Snapdragon X12 LTE modem
* Download: Cat 12 (up to 600 Mbit/s), 3x20 MHz CA; 64-QAM; 4x4 MIMO on 1C
* Upload: Cat 13 (up to 150 Mbit/s), 2x20 MHz CA; 64-QAM
* Support MIMO 4×4
* 802.11a/b/g/n/ac Wi-Fi connectivity
* Wi-Fi ad support with external chip
* SOC features
* 14 nm FinFET process
* eMMC 5.1/UFS 2.0
* Quick Charge 3.0
* 2.0 billion transistors
* Max 8 GB LPDDR4 Quad-channel 16-bit (64-bit) 1866 MHz (29.8 GB/s)
* The Snapdragon 821 was announced in July 2016. The 821 provides a 10% improvement in performance over the 820 due to a faster clocked CPU, but otherwise has similar features, with Qualcomm stating that the 821 is designed to complement rather than replace the 820.
* Notable features over its predecessor (820):
* CPU features
* Faster CPU (+10%)
* GPU features
* Faster GPU 650 MHz from 624 (+5%)
* Snapdragon VR-SDK.
* ISP features
* Support Dual PD (PDAF).
* Extended laser Auto-focus.
* The Snapdragon 835 was announced on November 17, 2016.
* Notable features over its predecessor (821):
* CPU features
* Samsung 10nm FinFET Low-Power Early fabrication, 3 billion transistors
* 4 Kryo 280 Gold (ARM Cortex-A73)
* L1 cache: 64 KB + 64 KB
* L2 cache: 2 MB
* 4 Kryo 280 Silver (ARM Cortex-A53)
* LPDDR4X in dual-channel mode, up to 1866 MHz
* GPU features
* Adreno 540 graphics with support for Vulkan 1.1, DirectX 12 (Feature level 12_1), OpenCL 2.0 and OpenGL ES 3.2
* Quad-Core GPU @ 710/670 MHz with 256 ALUs, 16 TMUs and 12 ROPs
* @ 710 MHz: 727.04 GFLOPs, 11.36 GTexels/s and 8.52 GPixels/s
* @ 670 MHz: 686.08 GFLOPs, 10.72 GTexels/s and 8.04 GPixels/s
* Qualcomm Q-Sync (Variable Refresh Rate) and Adreno Foveation (Foveated Rendering)
* DSP features
* Hexagon 682 DSP 2nd-generation "AI engine"
* Hexagon Vector eXtensions
* All-Ways Aware Hub low power island
* Neural Processing Engine (NPE)
* Halide and TensorFlow support
* H.264, H.265, VP9 UHD/30fps encoding and UHD/60fps 10-bit decoding
* High-dynamic-range video support (HDR10)/Ultra HD Premium (only Decoding)
* DSD and 32-bit/384 kHz PCM audio support with WCD9341 codec
* ISP features:
* Qualcomm Spectra 180 ISP with Dual 14-bit ISPs
* Single Camera, 30fps: Up to 32 MP
* 32 MP at 30fps single camera; 25 MP at 30fps single camera with ZSL; 16 MP Dual Camera with ZSL
* Video Capture: Up to 4K Ultra HD video capture @ 30FPS
* Video Playback: Up to 4K Ultra HD video playback
* Codec Support: H.265 (HEVC), H.264 (AVC), VP9
* Modem and wireless features
* Snapdragon X16 LTE modem
* Downlink: LTE Cat 16 up to 1 Gbit/s, 4x20 MHz carrier aggregation, up to 256-QAM
* Uplink: LTE Cat 13 up to 150 Mbit/s, Qualcomm Snapdragon Upload+ (2x20 MHz carrier aggregation, up to 64-QAM, uplink data compression)
* 802.11a/b/g/n/ac/ad Wi-Fi connectivity
* Bluetooth 5.0 (from Bluetooth 4.1)
* SOC features
* 10 nm FinFET (Samsung 10LPE)
* Die size: 72.3 mm$^2$
* 3 billion Transistors
* UFS 2.1, SD 3.0 (UHS-I)
* DisplayPort, HDMI 2.0, USB Type-C 3.1 with USB Power Delivery
* Qualcomm Quick Charge 4
* Up to 8 GB LPDDR4X Dual-channel 32-bit (64-bit) 1866 MHz (29.8 GB/s)
* The Snapdragon 845 was announced on December 7, 2017.
* Notable features over its predecessor (835):
* CPU features
* Samsung 10nm FinFET Low-Power Plus fabrication
* 4 Kryo 385 Gold (ARM Cortex-A75)
* L1 cache: 64 KB + 64 KB
* L2 cache: 256 KB
* 4 Kryo 385 Silver (ARM Cortex-A55)
* DynamIQ with 2 MiB L3 cache
* 3 MiB system-level cache for CPU, GPU, DSP...
* GPU features
* Adreno 630 graphics with support for Vulkan 1.1, DirectX 12 (Feature level 12_1), OpenCL 2.0, OpenGL ES 3.2 and DxNext eXtended Reality (XR)
* Dual-Core GPU @ 710 MHz with 512 ALUs, 24 TMUs and 16 ROPs (up from 256 ALUs, 16 TMUs and 12 ROPs)
* 727.04 GFLOPs, 17.04 GTexels/s and 11.36 GPixels/s
* Inside-out Room-Scale 6DoF with simultaneous localization and mapping (SLAM)
* Advanced visual inertial odometry (VIO) And Adreno Foveation
* Support for HDR10 and hybrid log–gamma (HLG)
* DisplayPort, HDMI 2.0, USB Type-C 3.1 with USB Power Delivery
* DSP features
* Hexagon 685 3rd generation "AI engine" with greater than 3 trillion operations per second (TOPS)
* Hexagon Vector eXtensions
* All-Ways Aware Hub low power island
* Neural Processing Engine (NPE)
* Caffe, Caffe2, Halide and TensorFlow support
* Up to 4K Ultra HD @ 60 FPS (from 4K30 Encode), 2x 2400x2400 @ 120 FPS (VR)
* Can record 240 FPS in 1080p and 480 FPS in 720p (Slow motion)
* 10-bit color depth (encoding and decoding) on H.264, H.265 and (decode only) VP9
* BT.2020 support on DSP and GPU
* ISP features:
* Qualcomm Spectra 280 ISP with Dual 14-bit ISPs
* 192 MP single camera; 48 MP single camera with MFNR; 32 MP at 30fps single camera with MFNR/ZSL; 16 MP at 60fps single camera with MFNR/ZSL; 16 MP at 30fps Dual Camera with MFNR/ZSL
* Modem and wireless features
* Downlink: 5x20 MHz carrier aggregation, up to 256-QAM, up to 4x4 MIMO on three carriers
* Uplink: 2x20 MHz carrier aggregation, up to 64-QAM
* Bluetooth enhancements
* Ultra-low power wireless earbuds
* Direct audio and aptX HD quality stereo broadcast to multiple wireless speakers
* Wi-Fi ad 60 GHz with external Module
* Improve GPS support : Glonass, Beidou, Galileo, QZSS and SBAS
* System on a chip features
* 10 nm FinFET (Samsung 10LPP)
* Die size: 94  mm$^2$
* (5.3) billion Transistors
* Secure Vault (SPU)
* Native DSD support, PCM up to 384 kHz/32bit
* Qualcomm Quick Charge 4+
* Up to 8 GB LPDDR4X Quad-channel 16-bit (64-bit) 1866 MHz (29.9 GB/s)
* The Snapdragon 855 was announced on December 5, 2018. The Snapdragon 855 is Qualcomm's first 7 nm FinFET chipset.
* Notable features over its predecessor (845):
* 7 nm (TSMC N7) process
* Die size: 73  mm$^2$ (8.48 mm × 8.64 mm)
* 6.7 billion transistors
* Support up to 16 GB LPDDR4X 2133 MHz support
* 4x 16-bit memory bus, (34.13 GB/s) up to 16 GB
* NVM Express 2x 3.0 (1x for external 5G modem)
* CPU features
* 1 Kryo 485 Prime (Cortex-A76), up to 2.84 GHz. Prime core with 512 KB pL2
* 3 Kryo 485 Gold (Cortex-A76), up 2.42 GHz. Performance cores with 256 KB pL2 each
* 4 Kryo 485 Silver (Cortex-A55), up 1.8 GHz. Efficiency cores with 128 KB pL2 each
* DynamIQ with 2 MB sL3 cache
* 3 MB system-level cache
* GPU features
* Adreno 640 GPU with support for Vulkan 1.1
* Up to 768 ALU (from 512 on Adreno 630)
* Tri-core GPU @ 585 MHz with 768 ALUs, 36 TMUs and 28 ROPs (up from 512 ALUs, 24 TMUs and 16 ROPs)
* 954.7 FP32 GFLOPs, 1853.3 FP16 GFLOPs, 28.1 bilinear GTexels/s, 9.4 GPixels/s and 300 GB/s effective memory bandwidth
* HDR gaming (10-bit color depth, Rec. 2020)
* 120 fps gaming
* Improvement on hardware-accelerated H.265 and VP9 decoder
* HDR playback codec support for HDR10+, HDR10, HLG and Dolby Vision
* Volumetric VR video playback
* 8K 360 VR video playback
* Quarterly GPU driver updates via Google Play Store
* Android GPU Inspector Tool
* DSP features
* Hexagon 690 4th generation "AI engine" with greater than 7 trillion operations per second (TOPS)
* Qualcomm Hexagon Vector Accelerator with Hexagon Vector eXtensions
* Qualcomm Hexagon Tensor Accelerator (HTA)
* Qualcomm Hexagon Voice Assistant
* All-Ways Aware Hub
* Caffe, Caffe2, Halide and TensorFlow support
* Vector/Scalar performance compared with Hexagon 680: doubled the HVX vector units and 20% increase in scalar performance
* ISP features:
* Qualcomm Spectra 380 with dual 14-bit CV-ISPs and hardware accelerator for computer vision
* Multi-frame noise reduction
* Hybrid AF
* 192 MP single camera; 48 MP at 30 fps single camera with MFNR/ZSL; 22 MP at 30 fps dual camera with MFNR/ZSL
* HEIF photo capture support
* Tri-core hardware CV functions including object detection & tracking, and stereo depth processing
* Advanced HDR solution including improved zzHDR and 3-exposure Quad Color Filter Array (QCFA) HDR
* 4K 60 FPS HDR video with real-time object segmentation (portrait mode, background swap) features HDR10, HDR10+ and HLG with Portrait Mode (bokeh), 10-bit color depth and Rec. 2020 color gamut
* Up to 1.32 Gpixel/s
* Video Capture Formats: HDR10, HLG
* Video Codec Support: H.265 (HEVC), H.264 (AVC), HLG, HDR10, HDR10+, VP8, VP9
* Modem and wireless features:
* Internal X24 LTE Modem
* Download: 2000 Mbit/s DL (Cat. 20), 7x20 MHz CA, 256-QAM, 4x4 MIMO
* Upload: 316 Mbit/s UL (Cat 20), 3x20 MHz CA, 256-QAM
* External Snapdragon X50 (5G Modem): 5000 Mbit/s DL
* Qualcomm Wi-Fi 6-ready mobile platform:
* Wi-Fi Standards: 802.11ax-ready, 802.11ac Wave 2, 802.11a/b/g, 802.11n
* Wi-Fi Spectral Bands: 2.4 GHz, 5 GHz• Channel Utilization: 20/40/80 MHz
* MIMO Configuration: 2x2 (2-stream) • MU-MIMO• Dual-band simultaneous (DBS)
* Key Features: 8x8 sounding (up to 2x improvement over 4x4 sounding devices), Target Wakeup Time for up to 67% better power efficiency, latest security with WPA3
* Qualcomm 60 GHz Wi-Fi mobile platform
* Wi-Fi Standards: 802.11ad, 802.11ay
* Wi-Fi Spectral Band: 60 GHz
* Peak speed: 10 Gbit/s
* The Snapdragon 855+ was announced on July 15, 2019. It is an overclocked version of the Snapdragon 855 providing 10% higher CPU and GPU performance.
* The Snapdragon 860 was announced on March 22, 2021. It is a pure rebranding of the Snapdragon 855+.
* The Snapdragon 865 was announced on December 4, 2019.
* Notable features over its predecessor (855):
* 2nd-generation 7 nm (N7P TSMC) process
* 10.3 billion transistors
* 83.54 mm2 (8.49 mm x 9.84 mm)
* Support up to 16 GB LPDDR5 2750 MHz or LPDDR4X 2133 MHz support
* 4x 16-bit memory bus, (or 34.13 GB/s) up to 16 GB
* NVM Express 2x 3.0 (1x for external 5G modem)
* Support Quick Charge 4+
* CPU features
* 1 Kryo 585 Prime (Cortex-A77), 2.84 GHz (3.1 GHz for 865+, 3.2 GHz for 870). Prime core with 512 KB pL2
* 3 Kryo 585 Gold (Cortex-A77), 2.42 GHz. Performance cores with 256 KB pL2 each
* 4 Kryo 585 Silver (Cortex-A55), 1.8 GHz. Efficiency cores with 128 KB pL2 each
* DynamIQ with 4 MB sL3,
* 25% performance uplift and 25% power efficiency improvement
* 3 MB system-level cache
* GPU features
* Adreno 650 GPU with support for Vulkan 1.1
* 25% faster graphics rendering and 35% more power efficient
* Quarterly GPU driver updates via Google Play Store
* Android GPU Inspector Tool
* Desktop Forward Rendering
* Up to 1029.1 GFLOPs FP32 (from 898.5 GFLOPs on SD855)
* DSP features
* Hexagon 698 5th generation "AI engine" capable of 15 trillion operations per second (TOPS)
* Quad-core Qualcomm Hexagon Tensor Accelerator (HTA)
* Deep learning bandwidth compression
* ISP features:
* Qualcomm Spectra 480 with dual 14-bit CV-ISPs and hardware accelerator for computer vision
* Multi-frame noise reduction
* Hybrid AF
* 200 MP single camera; 64 MP at 30 fps single camera with MFNR/ZSL; 25 MP at 30 fps dual camera with MFNR/ZSL
* 8K 30 FPS and 4K 120 FPS HDR video
* Up to 2 Gpixel/s
* Video capture formats: Dolby Vision, HDR10, HDR10+, HEVC
* Video codec support: Dolby Vision, H.265 (HEVC), HDR10+, HLG, HDR10, H.264 (AVC), VP8, VP9
* New functionalities to improve noise reduction and local contrast enhancements
* Modem and wireless features:
* External X55 5G Modem
* Modes: NSA, SA, TDD, FDD
* 5G mmWave: 800 MHz bandwidth, 8 carriers, 2×2 MIMO
* 5G sub-6 GHz: 200 MHz bandwidth, 4×4 MIMO
* 5G NR Sub-6 + mmWave download: 7000 Mbit/s DL
* 5G NR Sub-6 + mmWave upload: 3000 Mbit/s UL
* LTE download: 2500 Mbit/s DL (Cat. 24), 7x20 MHz CA, 1024-QAM, 4x4 MIMO
* LTE upload: 316 Mbit/s UL (Cat 22), 3x20 MHz CA, 256-QAM
* Dynamic Spectrum Sharing (DSS)
* Qualcomm Wi-Fi 6-ready mobile platform:
* Qualcomm FastConnect 6800 (for 865 and 870), 6900 (for 865+)
* Wi-Fi standards: 802.11ax-ready (Wi-Fi 6E for 865+), 802.11ac Wave 2, 802.11a/b/g, 802.11n
* Wi-Fi spectral bands: 2.4 GHz, 5 GHz (for 865 and 870), 2.4 GHz, 5 GHz, 6 GHz (for 865+) • channel utilization: 20/40/80 MHz (for 865 & 870), 20/40/80/160 MHz (for 865+)
* MIMO configuration: 2x2 (2 Spatial Stream) • MU-MIMO • Dual-band simultaneous (DBS)
* Key features: 8x8 sounding (up to 2x improvement over 4x4 sounding devices), Target Wakeup Time for up to 67% better power efficiency, latest security with WPA3
* Qualcomm 60 GHz Wi-Fi mobile platform
* Wi-Fi Standards: 802.11ad, 802.11ay
* Wi-Fi spectral band: 60 GHz
* Peak speed: 10 Gbit/s
* Other features:
* Secure Processing Unit (SPU) with integrated dual-SIM dual-standby support
* The Snapdragon 865+ was announced on July 8, 2020.
* The Snapdragon 870 was announced on January 19, 2021. The only difference between it and the Snapdragon 865+ is a minor 0.1 GHz increase in clock frequency on the prime core.
* The Snapdragon 888 was announced on December 1, 2020.
* Notable features over its predecessor (865):
* 5 nm (Samsung 5LPE) process
* ~10 billion transistors
* Support up to 16 GB LPDDR5 3200 MHz (51.2  GB/s)
* 4x 16-bit memory bus
* Quick Charge 5 (100 W+)
* Support UFS 3.1
* CPU features
* 1 Kryo 680 Prime (ARM Cortex-X1), up to 2.84 GHz. Prime core with 1 MB pL2 and 64 KB pL1
* 3 Kryo 680 Gold (ARM Cortex-A78), up 2.42 GHz. Performance cores with 512 KB pL2 each
* 4 Kryo 680 Silver (ARM Cortex-A55), up 1.8 GHz. Efficiency cores with 128 KB pL2 each
* Move to instruction set ARMv8.4-A (from ARMv8.2-A)
* DynamIQ with 4 MB sL3,
* 25% performance uplift and 25% power efficiency improvement
* 3 MB system-level cache
* GPU features
* Adreno 660 GPU with API Support: OpenGL ES 3.2, OpenCL 2.0 FP, Vulkan 1.1
* Up to 840 MHz (from 670 MHz on 865+ and 870)
* 35% faster graphics rendering and 20% more power efficient
* 73% AI performance boost (from 15 TOPS to 26 TOPS)
* Variable rate shading (VRS)
* Demura and subpixel rendering for OLED uniformity
* Up to 1720.3 GFLOPs FP32 (from 1202.1 GFLOPs on SD865)
* HDR video playback formats: HDR10, HDR10+, Dolby Vision, HLG
* HDR gaming (including 10-bit color depth, Rec. 2020 color gamut)
* On-device display: 4K@60 Hz, QHD+@144 Hz
* External display: 4K@60 Hz, 10-bit, Rec. 2020, HDR10, HDR10+
* DSP features
* Hexagon 780 with Fused AI Accelerator architecture 6th-generation "AI engine" capable of 26 trillion operations per second (TOPS), From 15 TOPS on 865.
* Hexagon Tensor Accelerator
* Hexagon Vector eXtensions
* Hexagon Scalar Accelerator
* Qualcomm Sensing Hub (2nd generation)
* New dedicated AI processor
* 80% task reduction offload from Hexagon DSP
* 5× moreprocessing power
* 16× larger shared memory
* 1,000× hand-off time improvement in certain use cases
* 50% faster scalar accelerator, 2x faster tensor accelerator
* Video codec playback support: H.264 (AVC), H.265 (HEVC), VP8, VP9
* ISP features:
* Qualcomm Spectra 580 with triple 14-bit CV-ISPs and hardware accelerator for computer vision
* Single camera: 1x 200 MP or 84 MP at 30 fps with MFNR/ZSL (Multi Frame Noise Reduction/Zero Shutter Lag)
* Dual camera: 64+25 MP at 30 fps with MFNR/ZSL
* Triple camera: 3x 28 MP at 30 fps with MFNR/ZSL
* 8K 30 FPS and 4K 120 FPS HDR video + 64 MP Photo
* Slo-mo video capture at 720p @ 960 FPS, 1080p @ 480 FPS
* HDR video capture formats: HEVC with HDR10, HDR10+, Dolby Vision, HLG
* HDR photo capture: 10-bit HDR HEIF
* Computational HDR photo and video capture, support for Multi-Frame and Staggered HDR sensors
* Real-time object classification, segmentation, and replacement
* AI-based auto-focus, auto-exposure and auto-white-balance
* Advanced HW-based face detection with deep learning filter
* New low-light architecture (capture photos in 0.1 lux)
* 2.7 Gigapixel per second ISP (+35% speed increase over S865)
* 120 photos at 12MP/s
* Modem and wireless features:
* Internal X60 5G Modem
* Modes: NSA, SA, TDD, FDD
* 5G mmWave: 800 MHz bandwidth, 8 carriers, 2×2 MIMO
* 5G sub-6 GHz: 200 MHz bandwidth, 4×4 MIMO
* 5G NR Sub-6 + mmWave download: 7500 Mbit/s DL
* 5G NR Sub-6 + mmWave upload: 3000 Mbit/s UL
* LTE download: 2500 Mbit/s DL (Cat. 24), 7x20 MHz CA, 1024-QAM, 4x4 MIMO
* LTE upload: 316 Mbit/s UL (Cat 22), 3x20 MHz CA, 256-QAM
* Dynamic Spectrum Sharing (DSS)
* Bluetooth 5.2
* Dual antennas
* Premium audio
* Qualcomm Wi-Fi 6-ready mobile platform:
* Qualcomm FastConnect 6900
* Wi-Fi standards: 802.11ax-ready (Wi-Fi 6E), 802.11ac Wave 2, 802.11a/b/g, 802.11n
* Wi-Fi spectral bands: 2.4 GHz, 5 GHz, 6 GHz • channel utilization: 20/40/80/160 MHz
* MIMO configuration: 2x2 (2 Spatial Stream) • MU-MIMO • Dual-band simultaneous (DBS) (2×2 + 2×2)
* Key features: 8x8 sounding (up to 2× improvement over 4x4 sounding devices), Target Wakeup Time for up to 67% better power efficiency, latest security with WPA3
* Other features:
* Secure Processing Unit (SPU) with integrated dual-SIM dual-standby support
* Adds compatibility with Content Authenticity Initiative
* The Snapdragon 888+ was announced on June 28, 2021.

#### Tables

| Model number | Product name | Fab | Die size | CPU | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
| APQ8074AA | Snapdragon 800 | 28 nm (TSMC 28HPM) | | 4 cores 2.26 GHz Krait 400 | Adreno 330 450 MHz (115.2 GFLOPS in FP32) | Hexagon QDSP6 V5 600 MHz | 21 MP single camera | LPDDR3 Dual-channel 32-bit 800 MHz (12.8 GB/s) | — | Bluetooth 4.0 802.11ac (2.4/5 GHz); IZat Gen8B | 2.0 | Q2 2013 |
| MSM8274AA | Snapdragon 800 | 28 nm (TSMC 28HPM) | | 4 cores 2.26 GHz Krait 400 | Adreno 330 450 MHz (115.2 GFLOPS in FP32) | Hexagon QDSP6 V5 600 MHz | 21 MP single camera | LPDDR3 Dual-channel 32-bit 800 MHz (12.8 GB/s) | Gobi 3G (UMTS) | Bluetooth 4.0 802.11ac (2.4/5 GHz); IZat Gen8B | 2.0 | Q2 2013 |
| MSM8674AA | Snapdragon 800 | 28 nm (TSMC 28HPM) | | 4 cores 2.26 GHz Krait 400 | Adreno 330 450 MHz (115.2 GFLOPS in FP32) | Hexagon QDSP6 V5 600 MHz | 21 MP single camera | LPDDR3 Dual-channel 32-bit 800 MHz (12.8 GB/s) | Gobi 3G (CDMA, UMTS) | Bluetooth 4.0 802.11ac (2.4/5 GHz); IZat Gen8B | 2.0 | Q2 2013 |
| MSM8974AA | Snapdragon 800 | 28 nm (TSMC 28HPM) | | 4 cores 2.26 GHz Krait 400 | Adreno 330 450 MHz (115.2 GFLOPS in FP32) | Hexagon QDSP6 V5 600 MHz | 21 MP single camera | LPDDR3 Dual-channel 32-bit 800 MHz (12.8 GB/s) | Gobi 4G (LTE Cat 4: download 150 Mbit/s, upload 50 Mbit/s | Bluetooth 4.0 802.11ac (2.4/5 GHz); IZat Gen8B | 2.0 | Q2 2013 |
| MSM8974AA v3 | Snapdragon 801 | 28 nm (TSMC 28HPM) | | 4 cores 2.26 GHz Krait 400 | Adreno 330 450 MHz (115.2 GFLOPS in FP32) | Hexagon QDSP6 V5 600 MHz | 21 MP single camera | LPDDR3 Dual-channel 32-bit 800 MHz (12.8 GB/s) | Gobi 4G (LTE Cat 4) | Bluetooth 4.0 802.11ac (2.4/5 GHz); IZat Gen8B | 2.0 | Q3 2014 |
| APQ8074AB v3 | Snapdragon 801 | 28 nm (TSMC 28HPM) | | 4 cores 2.36 GHz Krait 400 | Adreno 330 578 MHz (150 GFLOPS in FP32) | Hexagon QDSP6 V5 600 MHz | 21 MP single camera | LPDDR3 Dual-channel 32-bit 933 MHz (14.9 GB/s) | — | Bluetooth 4.0 802.11ac (2.4/5 GHz); IZat Gen8B | 2.0 | Q4 2013 |
| MSM8274AB | Snapdragon 800 | 28 nm (TSMC 28HPM) | | 4 cores 2.36 GHz Krait 400 | Adreno 330 578 MHz (150 GFLOPS in FP32) | Hexagon QDSP6 V5 600 MHz | 21 MP single camera | LPDDR3 Dual-channel 32-bit 933 MHz (14.9 GB/s) | Gobi 3G (UMTS) | Bluetooth 4.0 802.11ac (2.4/5 GHz); IZat Gen8B | 2.0 | Q4 2013 |
| MSM8674AB v3 | Snapdragon 801 | 28 nm (TSMC 28HPM) | | 4 cores 2.36 GHz Krait 400 | Adreno 330 578 MHz (150 GFLOPS in FP32) | Hexagon QDSP6 V5 600 MHz | 21 MP single camera | LPDDR3 Dual-channel 32-bit 933 MHz (14.9 GB/s) | Gobi 3G (CDMA, UMTS) | Bluetooth 4.0 802.11ac (2.4/5 GHz); IZat Gen8B | 2.0 | Q2 2013 |
| MSM8974AB v3 | Snapdragon 801 | 28 nm (TSMC 28HPM) | | 4 cores 2.36 GHz Krait 400 | Adreno 330 578 MHz (150 GFLOPS in FP32) | Hexagon QDSP6 V5 600 MHz | 21 MP single camera | LPDDR3 Dual-channel 32-bit 933 MHz (14.9 GB/s) | Gobi 4G (LTE Cat 4) | Bluetooth 4.0 802.11ac (2.4/5 GHz); IZat Gen8B | 2.0 | Q4 2013 |
| MSM8274AC v3 | Snapdragon 801 | 28 nm (TSMC 28HPM) | | 4 cores 2.45 GHz Krait 400 | Adreno 330 578 MHz (150 GFLOPS in FP32) | Hexagon QDSP6 V5 600 MHz | 21 MP single camera | LPDDR3 Dual-channel 32-bit 933 MHz (14.9 GB/s) | Gobi 3G (UMTS) | Bluetooth 4.0 802.11ac (2.4/5 GHz); IZat Gen8B | 2.0 | Q2 2014 |
| MSM8974AC v3 | Snapdragon 801 | 28 nm (TSMC 28HPM) | | 4 cores 2.45 GHz Krait 400 | Adreno 330 578 MHz (150 GFLOPS in FP32) | Hexagon QDSP6 V5 600 MHz | 21 MP single camera | LPDDR3 Dual-channel 32-bit 933 MHz (14.9 GB/s) | Gobi 4G (LTE Cat 4) | Bluetooth 4.0 802.11ac (2.4/5 GHz); IZat Gen8B | 2.0 | Q1 2014 |
| APQ8084 | Snapdragon 805 | 28 nm (TSMC 28HPM) | | 4 cores 2.7 GHz Krait 450 | Adreno 420 600 MHz (153.6 GFLOPS in FP32) | Hexagon V50 800 MHz | 55 MP single camera | LPDDR3 Dual-channel 64-bit 800 MHz (25.6 GB/s) | External | Bluetooth 4.1 802.11ac (2.4/5 GHz) IZat Gen8B | 2.0 | Q1 2014 |
| MSM8992 | Snapdragon 808 | 20 nm (TSMC) | | 2 + 4 cores (1.82 GHz Cortex-A57 + 1.44 GHz Cortex-A53) | Adreno 418 600 MHz (153.6 GFLOPS in FP32) | Hexagon V56 800 MHz | Up to 21 MP single camera | LPDDR3 Dual-channel 32-bit 933 MHz (14.9 GB/s) | X10 LTE (Cat 9: download 450 Mbit/s, upload 50 Mbit/s) | Bluetooth 4.1 802.11ac IZat Gen8C | 2.0 | Q3 2014 |
| MSM8994 v1 | Snapdragon 810 | 20 nm (TSMC) | | 4 + 4 cores (2.0 GHz Cortex-A57 + 1.5 GHz Cortex-A53) | Adreno 430 600 MHz (230.4 GFLOPS in FP32) | Hexagon V56 800 MHz | 55 MP single camera | LPDDR4 Dual-channel 32-bit 1600 MHz (25.6 GB/s) | X10 LTE (Cat 9: download 450 Mbit/s, upload 50 Mbit/s) | Bluetooth 4.1 802.11ac IZat Gen8C | 2.0 | Q3 2014 |
| MSM8994 v2 | Snapdragon 810 | 20 nm (TSMC) | | 4 + 4 cores (2.0 GHz Cortex-A57 + 1.5 GHz Cortex-A53) | Adreno 430 630 MHz (241.9 GFLOPS in FP32) | Hexagon V56 800 MHz | 55 MP single camera | LPDDR4 Dual-channel 32-bit 1600 MHz (25.6 GB/s) | X10 LTE (Cat 9: download 450 Mbit/s, upload 50 Mbit/s) | Bluetooth 4.1 802.11ac IZat Gen8C | 2.0 | 2015 |
| MSM8994 v2.1 | Snapdragon 810 | 20 nm (TSMC) | | 4 + 4 cores (2.0 GHz Cortex-A57 + 1.5 GHz Cortex-A53) | Adreno 430 630 MHz (241.9 GFLOPS in FP32) | Hexagon V56 800 MHz | 55 MP single camera | LPDDR4 Dual-channel 32-bit 1600 MHz (25.6 GB/s) | X10 LTE (Cat 9: download 450 Mbit/s, upload 50 Mbit/s) | Bluetooth 4.1 802.11ac IZat Gen8C | 2.0 | Q2 2015 |
| MSM8996 Lite | Snapdragon 820 | 14 nm FinFET (Samsung 14LPP) | 113.7 mm$^2$ | 2 + 2 cores Kryo (1.8 GHz + 1.36 GHz) | Adreno 530 510 MHz (261.1 GFLOPS in FP32) | Hexagon 680 1.0 GHz | Spectra | LPDDR4 Quad-channel 16-bit (64-bit) 1333 MHz (21.3 GB/s) | X12 LTE (download: Cat 12, 600 Mbit/s; 3x20 MHz CA; 64-QAM; 4x4 MIMO on 1C. upload: Cat 13, 150 Mbit/s; 2x20 MHz CA; 64-QAM.) | Bluetooth 4.1 802.11ac IZat Gen8C | 3.0 | Q1 2016 |
| MSM8996 | Snapdragon 820 | 14 nm FinFET (Samsung 14LPP) | 113.7 mm$^2$ | 2 + 2 cores Kryo (2.15 GHz + 1.593 GHz) | Adreno 530 624 MHz (319.5 GFLOPS in FP32) | Hexagon 680 1.0 GHz | Spectra | LPDDR4 Quad-channel 16-bit (64-bit) 1866 MHz (29.8 GB/s) | X12 LTE (download: Cat 12, 600 Mbit/s; 3x20 MHz CA; 64-QAM; 4x4 MIMO on 1C. upload: Cat 13, 150 Mbit/s; 2x20 MHz CA; 64-QAM.) | Bluetooth 4.1 802.11ac IZat Gen8C | 3.0 | Q4 2015 |
| MSM8996 Pro-AB | Snapdragon 821 | 14 nm FinFET (Samsung 14LPP) | 113.7 mm$^2$ | 2 + 2 cores Kryo (2.15 GHz + 1.593 GHz) | Adreno 530 624 MHz (319.5 GFLOPS in FP32) | Hexagon 680 1.0 GHz | Spectra | LPDDR4 Quad-channel 16-bit (64-bit) 1866 MHz (29.8 GB/s) | X12 LTE (download: Cat 12, 600 Mbit/s; 3x20 MHz CA; 64-QAM; 4x4 MIMO on 1C. upload: Cat 13, 150 Mbit/s; 2x20 MHz CA; 64-QAM.) | Bluetooth 4.1 802.11ac IZat Gen8C | 3.0 | Q3 2016 |
| MSM8996 Pro-AC | Snapdragon 821 | 14 nm FinFET (Samsung 14LPP) | 113.7 mm$^2$ | 2 + 2 cores Kryo (2.342 GHz + 1.6/2.188 GHz) | Adreno 530 653 MHz (334.3 GFLOPS in FP32) | Hexagon 680 1.0 GHz | Spectra | LPDDR4 Quad-channel 16-bit (64-bit) 1866 MHz (29.8 GB/s) | X12 LTE (download: Cat 12, 600 Mbit/s; 3x20 MHz CA; 64-QAM; 4x4 MIMO on 1C. upload: Cat 13, 150 Mbit/s; 2x20 MHz CA; 64-QAM.) | Bluetooth 4.1 802.11ac IZat Gen8C | 3.0 | Q3 2016 |
| MSM8998 | Snapdragon 835 | 10 nm FinFET (Samsung 10LPE) | 72.3 mm | 4 + 4 cores Kryo 280 (2.45 GHz Cortex-A73 + 1.9 GHz Cortex-A53) | Adreno 540 670/710 MHz (343/363.5 GFLOPS in FP32) | Hexagon 682 | Spectra 180 | LPDDR4X Dual-channel 32-bit (64-bit) 1866 MHz (29.8 GB/s) | X16 LTE (download: Cat 16, up to 1000 Mbit/s; 4x20 MHz CA; 256-QAM; 4x4 MIMO on 2C. upload: Cat 13, up to 150 Mbit/s) | Bluetooth 5.0; 802.11ac/ad; GPS, Glonass, Beidou, Galileo, QZSS, SBAS | 4.0 | Q2 2017 |
| SDM845 | Snapdragon 845 | 10 nm FinFET (Samsung 10LPP) | 95.0 mm | 4 + 4 cores Kryo 385 (2.8 GHz Cortex-A75 + 1.8 GHz Cortex-A55) | Adreno 630 710 MHz (727 GFLOPS in FP32) | Hexagon 685 (3 TOPs) | Spectra 280 | LPDDR4X Dual-channel 32-bit (64-bit) 1866 MHz (29.8 GB/s) | X20 LTE (download: Cat 18, @ 1200 Mbit/s; 5x20 MHz CA; 256-QAM; 4x4 MIMO on 3C. upload: Cat 13, @ 150 Mbit/s; 2x20 MHz CA; 64-QAM) | Bluetooth 5.0; 802.11ac/ad; GPS, Glonass, Beidou, Galileo, QZSS, SBAS | 4+ | Q1 2018 |
| SM8150 | Snapdragon 855 | 7 nm (TSMC N7) | 76.9 mm | 1 + 3 + 4 cores Kryo 485 (2.84 GHz Cortex-A76 + 2.42 GHz Cortex-A76 + 1.8 GHz Cortex-A55) | Adreno 640 585 MHz (898.6 GFLOPS in FP32) | Hexagon 690 (7 TOPs) | Spectra 380 | LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.13 GB/s) | Internal: X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20 MHz CA, 256-QAM) + External: X50 5G (5G NR Sub-6 & mmWave: download up to 5 Gbit/s) | Bluetooth 5.0; 802.11ax Wi-Fi; GPS, Glonass, Beidou, Galileo, QZSS, SBAS; USB 3.1 | 4+ | Q1 2019 |
| SM8150-AC | Snapdragon 855+ | 7 nm (TSMC N7) | 76.9 mm | 1 + 3 + 4 cores Kryo 485 (2.96 GHz Cortex-A76 + 2.42 GHz Cortex-A76 + 1.80 GHz Cortex-A55) | Adreno 640 675 MHz (1036.8 GFLOPS in FP32) | Hexagon 690 (7 TOPs) | Spectra 380 | LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.13 GB/s) | Internal: X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20 MHz CA, 256-QAM) + External: X50 5G (5G NR Sub-6 & mmWave: download up to 5 Gbit/s) | Bluetooth 5.0; 802.11ax Wi-Fi; GPS, Glonass, Beidou, Galileo, QZSS, SBAS; USB 3.1 | 4+ | Q3 2019 |
| SM8150-AC | Snapdragon 860 | 7 nm (TSMC N7) | 76.9 mm | 1 + 3 + 4 cores Kryo 485 (2.96 GHz Cortex-A76 + 2.42 GHz Cortex-A76 + 1.80 GHz Cortex-A55) | Adreno 640 675 MHz (1036.8 GFLOPS in FP32) | Hexagon 690 (7 TOPs) | Spectra 380 | LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.13 GB/s) | Internal: X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20 MHz CA, 256-QAM) + External: X50 5G (5G NR Sub-6 & mmWave: download up to 5 Gbit/s) | Bluetooth 5.0; 802.11ax Wi-Fi; GPS, Glonass, Beidou, Galileo, QZSS, SBAS; USB 3.1 | 4+ | Q1 2021 |
| SM8150P | Snapdragon 855+ | 7 nm (TSMC N7) | 76.9 mm | 1 + 3 + 4 cores Kryo 485 (2.96 GHz Cortex-A76 + 2.42 GHz Cortex-A76 + 1.80 GHz Cortex-A55) | Adreno 640 675 MHz (1036.8 GFLOPS in FP32) | Hexagon 690 (7 TOPs) | Spectra 380 | LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.13 GB/s) | Internal: no + External: X55 5G (5G NR Sub-6 & mmWave: download up to 7.5 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download @ 2.5 Gbit/s, upload @ 0.316 Gbit/s) | Bluetooth 5.0; 802.11ax Wi-Fi; GPS, Glonass, Beidou, Galileo, QZSS, SBAS; USB 3.1 | 4+ | Q3 2019 |
| SM8250 | Snapdragon 865 | 7 nm (TSMC N7P) | 86.8 mm | 1 + 3 + 4 cores Kryo 585 (2.84 GHz Cortex-A77 + 2.42 GHz Cortex-A77 + 1.80 GHz Cortex-A55) | Adreno 650 587 MHz (901.6 GFLOPS in FP32) | Hexagon 698 (15 TOPs) | Spectra 480 | LPDDR5 Quad-channel 16-bit (64-bit) 2750 MHz (44 GB/s) or LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.13 GB/s) | Internal: no + External: X55 5G (5G NR Sub-6 & mmWave: download @ 7.5 Gbit/s, upload @ 3 Gbit/s; LTE Cat 22: download @ 2.5 Gbit/s, upload @ 0.316 Gbit/s) | FastConnect 6800; Bluetooth 5.1; 802.11ax (Wi-Fi 6) @ 1.774 Gbit/s; 802.11ad/ay 60 GHz @ 10 Gbit/s; GPS, Glonass, NavIC, Beidou, Galileo, QZSS, SBAS; USB 3.1 | 4+ | Q1 2020 |
| SM8250-AB | Snapdragon 865+ | 7 nm (TSMC N7P) | 86.8 mm | 1 + 3 + 4 cores Kryo 585 (3.1 GHz Cortex-A77 + 2.42 GHz Cortex-A77 + 1.80 GHz Cortex-A55) | Adreno 650 670 MHz (1029.1 GFLOPS in FP32) | Hexagon 698 (15 TOPs) | Spectra 480 | LPDDR5 Quad-channel 16-bit (64-bit) 2750 MHz (44 GB/s) or LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.13 GB/s) | Internal: no + External: X55 5G (5G NR Sub-6 & mmWave: download @ 7.5 Gbit/s, upload @ 3 Gbit/s; LTE Cat 22: download @ 2.5 Gbit/s, upload @ 0.316 Gbit/s) | FastConnect 6900; Bluetooth 5.2; 802.11ax (Wi-Fi 6E) @ 3.6 Gbit/s; 802.11ad/ay 60 GHz @ 10 Gbit/s; GPS, Glonass, NavIC, Beidou, Galileo, QZSS, SBAS; USB 3.1 | 4+ | Q3 2020 |
| SM8250-AC | Snapdragon 870 | 7 nm (TSMC N7P) | 86.8 mm | 1 + 3 + 4 cores Kryo 585 (3.2 GHz Cortex-A77 + 2.42 GHz Cortex-A77 + 1.80 GHz Cortex-A55) | Adreno 650 670 MHz (1029.1 GFLOPS in FP32) | Hexagon 698 (15 TOPs) | Spectra 480 | LPDDR5 Quad-channel 16-bit (64-bit) 2750 MHz (44 GB/s) or LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.13 GB/s) | Internal: no + External: X55 5G (5G NR Sub-6 & mmWave: download @ 7.5 Gbit/s, upload @ 3 Gbit/s; LTE Cat 22: download @ 2.5 Gbit/s, upload @ 0.316 Gbit/s) | FastConnect 6800 Bluetooth 5.2 802.11ax (Wi-Fi 6) @ 1.774 Gbit/s; 802.11ad/ay 60 GHz @ 10 Gbit/s; GPS, Glonass, NavIC, Beidou, Galileo, QZSS, SBAS; USB 3.1 | 4+ | Q1 2021 |
| SM8350 | Snapdragon 888 | 5 nm (Samsung 5LPE) | 112.2 mm | 1 + 3 + 4 cores Kryo 680 (2.84 GHz Cortex-X1 + 2.42 GHz Cortex-A78 + 1.80 GHz Cortex-A55) | Adreno 660 840 MHz (1290.2 GFLOPS in FP32) | Hexagon 780 (26 TOPs) | Spectra 580 | LPDDR5 Quad-channel 16-bit (64-bit) 3200 MHz (51.2 GiB/s) | Internal: X60 5G (5G NR Sub-6 & mmWave: download 7.5 Gbit/s, upload 3 Gbit/s; LTE Cat 22: download 2.5 Gbit/s, upload 0.316 Gbit/s) | FastConnect 6900 Bluetooth 5.2 802.11ax (Wi-Fi 6E) @ 3.6 Gbit/s; GPS, Glonass, NavIC, Beidou, Galileo, QZSS; USB 3.1 | 5 | Q1 2021 |
| SM8350-AC | Snapdragon 888+ | 5 nm (Samsung 5LPE) | 112.2 mm | 1 + 3 + 4 cores Kryo 680 (3.0 GHz Cortex-X1 + 2.42 GHz Cortex-A78 + 1.80 GHz Cortex-A55) | Adreno 660 840 MHz (1290.2 GFLOPS in FP32) | Hexagon 780 (32 TOPs) | Spectra 580 | LPDDR5 Quad-channel 16-bit (64-bit) 3200 MHz (51.2 GiB/s) | Internal: X60 5G (5G NR Sub-6 & mmWave: download 7.5 Gbit/s, upload 3 Gbit/s; LTE Cat 22: download 2.5 Gbit/s, upload 0.316 Gbit/s) | FastConnect 6900 Bluetooth 5.2 802.11ax (Wi-Fi 6E) @ 3.6 Gbit/s; GPS, Glonass, NavIC, Beidou, Galileo, QZSS; USB 3.1 | 5 | Q3 2021 |

### Snapdragon 8/8+ Gen 1 (2022)

The Snapdragon 8 Gen 1 was announced on November 30, 2021.
* Features of the Snapdragon 8/8+ Gen 1 series
* Notable features over its predecessor (888):
* 4 nm (Samsung 4LPX) process
* ~ billion transistors
* Support up to 16 GB LPDDR5 3200 MHz
* Quick Charge 5 (100 W+)
* Support UFS 3.1
* CPU features
* 1x Kryo Prime (Cortex-X2), up to 3 GHz. Prime core
* 3x Kryo Gold (ARM Cortex-A710), up to 2.5 GHz. Performance cores
* 4x Kryo Silver (ARM Cortex-A510), up to 1.8 GHz. Efficiency cores
* Move to instruction set ARMv9 (from ARMv8.2-A)
* DynamIQ with 4 MB sL3,
* 20% performance uplift and 30% power efficiency improvement
* 6 MB L3 cache, 4 MB system-level cache
* GPU features
* Adreno 730 GPU with API Support: OpenGL ES 3.2, OpenCL 2.0 FP, Vulkan 1.1
* 30% faster graphics rendering and 25% more power efficient
* Up to 1024 ALU (from 768 on Adreno 660)
* Demura and subpixel rendering for OLED uniformity
* Variable Rate Shading Pro
* HDR video playback formats: HDR10, HDR10+, Dolby Vision, HLG
* HDR gaming (including 10-bit color depth, Rec. 2020 color gamut)
* On-device display: 4K@60 Hz, QHD+@144 Hz
* External display: 4K@60 Hz, 10-bit, Rec. 2020, HDR10, HDR10+
* DSP features
* Hexagon with Fused AI Accelerator, INT8 and INT16
* Hexagon Tensor Accelerator
* Hexagon Vector eXtensions
* Hexagon Scalar Accelerator
* Qualcomm Sensing Hub (3nd generation)
* New dedicated AI pro
* ISP features
* Qualcomm Spectra with triple 18-bit CV-ISPs and hardware accelerator for computer vision
* Single camera: 1x 200 MP or 108 MP at 30 fps with MFNR/ZSL (Multi Frame Noise Reduction/Zero Shutter Lag)
* Dual camera: 64+36 MP at 30 fps with MFNR/ZSL
* Triple camera: 3x 36 MP at 30 fps with MFNR/ZSL
* 8K 30 FPS and 4K 120 FPS HDR video + 64 MP Photo
* Slow-m 5G NR, LTE including CBRS
* WCDMA, HSPA, TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE
* 720p @ 960 FPS
* HDR video capture formats: HEVC with HDR10, HDR10+, Dolby Vision, HLG
* HDR photo capture: 10-bit HDR HEIF
* Computational HDR photo and video capture, support for Multi-Frame and Staggered HDR sensors
* Real-time object classification, segmentation, and replacement
* AI-based auto-focus, auto-exposure and auto-white-balance
* Modem and wireless features:
* Internal X65 5G Modem
* Modes: NSA, SA, TDD, FDD
* 5G mmWave
* 5G sub-6 GHz
* 5G NR Sub-6 + mmWave download: 10 Gbit/s
* 5G NR Sub-6 + mmWave upload: 3 Gbit/s (assumed)
* LTE download: 2.5 Gbit/s
* LTE upload: 0.316 Gbit/s
* Dynamic Spectrum Sharing (DSS)
* Bluetooth 5.3
* Qualcomm Aqstic audio codec (WCD9385)
* Provide lossless wireless audio with Qualcomm aptX Technology.
* Qualcomm Wi-Fi 6-ready mobile platform:
* Qualcomm FastConnect 6900
* Wi-Fi standards: 802.11ax-ready (Wi-Fi 6E), 802.11ac Wave 2, 802.11a/b/g, 802.11n
* Wi-Fi spectral bands: 2.4 GHz, 5 GHz, 6 GHz • channel utilization: 20/40/80/160 MHz
* MIMO configuration: 2x2 (2 Spatial Stream) • MU-MIMO • Dual-band simultaneous (DBS) (2×2 + 2×2)
* Peak speed: 3.6 Gbit/s
The Snapdragon 8+ Gen 1 was announced on May 20, 2022.
| Product name (Model number) | Fab | Die size | CPU (ARMv9) (Cores / Freq) | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Released |
| Snapdragon 8 Gen 1 (SM8450) | 4 nm (Samsung 4LPX) | 128.5 mm | Kryo (1x 3.0 GHz Cortex-X2 + 3x 2.5 GHz Cortex-A710 + 4x 1.8 GHz Cortex-A510) | Adreno 730 818 MHz (1675.3 GFLOPs in FP32) | Hexagon | Spectra (200 MP Photo Capture, 108 MP single camera @30fps ZSL, 64+36 MP dual camera @30fps ZSL, 36 MP triple camera @30fps ZSL; Video Capture: 8K@30fps HDR) | LPDDR5 Quad-channel 16-bit (64-bit) 3200 MHz (51.2 GiB/s) | Internal: X65 5G (5G NR Sub-6 & mmWave: download @ 10 Gbit/s, upload @ 3 Gbit/s; LTE Cat 22: download @ 2.5 Gbit/s, upload @ 0.316 Gbit/s) | FastConnect 6900; Bluetooth 5.3; 802.11ax (Wi-Fi 6E) @ 3.6 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 | 5 | Q4 2021 |
| Snapdragon 8+ Gen 1 (SM8475) | 4 nm (TSMC N4) | 102.6 mm | Kryo (1x 3.0 GHz Cortex-X2 + 3x 2.5 GHz Cortex-A710 + 4x 1.8 GHz Cortex-A510) | Adreno 730 900 MHz (1843.2 GFLOPS in FP32) | Hexagon | Spectra (200 MP Photo Capture, 108 MP single camera @30fps ZSL, 64+36 MP dual camera @30fps ZSL, 36 MP triple camera @30fps ZSL; Video Capture: 8K@30fps HDR) | LPDDR5 Quad-channel 16-bit (64-bit) 3200 MHz (51.2 GiB/s) | Internal: X65 5G (5G NR Sub-6 & mmWave: download @ 10 Gbit/s, upload @ 3 Gbit/s; LTE Cat 22: download @ 2.5 Gbit/s, upload @ 0.316 Gbit/s) | FastConnect 6900; Bluetooth 5.3; 802.11ax (Wi-Fi 6E) @ 3.6 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 | 5 | Q4 2022 |
| Snapdragon 8+ Gen 1 (SM8475) | 4 nm (TSMC N4) | 102.6 mm | Kryo (1x 3.2 GHz Cortex-X2 + 3x 2.75 GHz Cortex-A710 + 4x 2.0 GHz Cortex-A510) | Adreno 730 900 MHz (1843.2 GFLOPS in FP32) | Hexagon | Spectra (200 MP Photo Capture, 108 MP single camera @30fps ZSL, 64+36 MP dual camera @30fps ZSL, 36 MP triple camera @30fps ZSL; Video Capture: 8K@30fps HDR) | LPDDR5 Quad-channel 16-bit (64-bit) 3200 MHz (51.2 GiB/s) | Internal: X65 5G (5G NR Sub-6 & mmWave: download @ 10 Gbit/s, upload @ 3 Gbit/s; LTE Cat 22: download @ 2.5 Gbit/s, upload @ 0.316 Gbit/s) | FastConnect 6900; Bluetooth 5.3; 802.11ax (Wi-Fi 6E) @ 3.6 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 | 5 | Q2 2022 |
| Snapdragon 8+ Gen 1 4G (SM8425) | 4 nm (TSMC N4) | 102.6 mm | Kryo (1x 3.2 GHz Cortex-X2 + 3x 2.75 GHz Cortex-A710 + 4x 2.0 GHz Cortex-A510) | Adreno 730 900 MHz (1843.2 GFLOPS in FP32) | Hexagon | Spectra (200 MP Photo Capture, 108 MP single camera @30fps ZSL, 64+36 MP dual camera @30fps ZSL, 36 MP triple camera @30fps ZSL; Video Capture: 8K@30fps HDR) | LPDDR5 Quad-channel 16-bit (64-bit) 3200 MHz (51.2 GiB/s) | Internal: (LTE Cat 22: download @ 2.5 Gbit/s, upload @ 0.316 Gbit/s) | FastConnect 6900; Bluetooth 5.3; 802.11ax (Wi-Fi 6E) @ 3.6 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 | 5 | Q3 2022 |

### Snapdragon 8 Gen 2 (2023)

The Snapdragon 8 Gen 2 was announced on November 15, 2022.
Features of the Snapdragon 8 Gen 2 series :
| Notable features over its predecessor (8 Gen 1): 4 nm (TSMC N4) process Support up to 16 GB LPDDR5X 4200 MHz Support UFS 4.0 CPU features 1 Kryo Prime (ARM Cortex-X3), up to 3.19 GHz. Prime core 1 MB L2 cache Only 64-bit support 2 Kryo Gold (ARM Cortex-A715), up to 2.8 GHz. High Performance cores Only 64-bit support 2 Kryo Gold (ARM Cortex-A710), up to 2.8 GHz. Performance cores 32-bit and 64-bit support 3 Kryo Silver (ARM Cortex-A510), up to 2 GHz. Efficiency cores 32-bit and 64-bit support 35% performance uplift and 40% power efficiency improvement 8 MB L3 cache, 6 MB system-level cache GPU features Adreno 740 GPU with API support: OpenGL ES 3.2, OpenCL 2.0, Vulkan 1.3 25% faster graphics rendering and 45% more power efficient Up to 1536 ALU (from 1024 on Adreno 730) Real-time hardware-accelerated ray tracing ray-box and ray-triangle intersections Bounding Volume Hierarchical (BVH) Doubled bandwidth between ISP, Hexagon DSP, and Adreno GPU | DSP features Hexagon with Fused AI Accelerator Hexagon Tensor Accelerator Hexagon Vector eXtensions Hexagon Scalar Accelerator Mixed precision INT8/INT16 Add INT4 support INT4, INT8, INT16, FP16 support Hexagon Direct Link (ISP and Hexagon) Qualcomm Sensing Hub (4th generation) Add second AI processor x2 performance from last year Dedicated power delivery system 50% more memory ISP features Video capture up to 8K30 or 4K120 or 720p960 (HDR) Video playback up to 8K60 or 4K120 (HDR) H.264, H.265, VP9 and add AV1 decoding Photo is same as 8 Gen 1 Modem and wireless features: Similar as 8 Gen 1 Qualcomm FastConnect 7800 Internal X70 5G Modem 5G up to 10 Gbit/s down and 3.5 Gbit/s up Wi-Fi 7, Bluetooth 5.3 support, Dual Bluetooth radios |
| Product name (Model number) | Fab | Die size | CPU (ARMv9) (Cores / Freq) | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Released |
| Snapdragon 8 Gen 2 (SM8550-AB) | 4 nm (TSMC N4) | 118.4 mm | Kryo (1× 3.19 GHz Cortex-X3 + 4× 2.8 GHz {2×Cortex-A715, 2×Cortex-A710} + 3× 2.0 GHz Cortex-A510) | Adreno 740 680 MHz (2089 GFLOPS in FP32) | Hexagon | Spectra (200 MP Photo Capture, 108 MP single camera @30fps ZSL, 64+36 MP dual camera @30fps ZSL, 36 MP triple camera @30fps ZSL; Video Capture: 8K@30fps HDR) | LPDDR5X Quad-channel 16-bit (64-bit) 4200 MHz (67.2 GB/s) | Internal: X70 5G (5G NR Sub-6 & mmWave: download 10 Gbit/s, upload 3.5 Gbit/s) | FastConnect 7800; Bluetooth 5.3; 802.11ac/ax/be (Wi-Fi 7) @ 5.8 Gbit/s; GPS, Glonass, NavIC, Beidou, Galileo, QZSS; USB 3.1 or FastConnect 6900; Bluetooth 5.3; 802.11ac/ax (Wi-Fi 6E) @ 3.6 Gbit/s; GPS, Glonass, NavIC, Beidou, Galileo, QZSS; USB 3.1 | 5 | Q4 2022 |
| Snapdragon 8 Gen 2 for Galaxy (SM8550-AC) | 4 nm (TSMC N4) | 118.4 mm | Kryo (1× 3.36 GHz Cortex-X3 + 4× 2.8 GHz {2×Cortex-A715, 2×Cortex-A710} + 3× 2.0 GHz Cortex-A510) | Adreno 740 719 MHz (2208.8 GFLOPS in FP32) | Hexagon | Spectra (200 MP Photo Capture, 108 MP single camera @30fps ZSL, 64+36 MP dual camera @30fps ZSL, 36 MP triple camera @30fps ZSL; Video Capture: 8K@30fps HDR) | LPDDR5X Quad-channel 16-bit (64-bit) 4200 MHz (67.2 GB/s) | Internal: X70 5G (5G NR Sub-6 & mmWave: download 10 Gbit/s, upload 3.5 Gbit/s) | FastConnect 7800; Bluetooth 5.3; 802.11ac/ax/be (Wi-Fi 7) @ 5.8 Gbit/s; GPS, Glonass, NavIC, Beidou, Galileo, QZSS; USB 3.1 or FastConnect 6900; Bluetooth 5.3; 802.11ac/ax (Wi-Fi 6E) @ 3.6 Gbit/s; GPS, Glonass, NavIC, Beidou, Galileo, QZSS; USB 3.1 | 5 | Q1 2023 |
* ↑ Also known as "Leading Version".

### Snapdragon 8/8s Gen 3 (2024)

The Snapdragon 8 Gen 3 was announced on October 24, 2023.
* Features of the Snapdragon 8/8s Gen 3 series
* Notable features over its predecessor (8 Gen 2):
* Support for memory up to 4800 MHz (up from 4200 MHz)
* CPU features
* 1x Kryo Prime (ARM Cortex-X4), up to 3.3 GHz. Prime core
* 3x Kryo Gold (ARM Cortex-A720), up to 3.2 GHz. High Performance cores
* 2x Kryo Gold (ARM Cortex-A720), up to 3.0 GHz. Performance cores
* 2x Kryo Silver (ARM Cortex-A520), up to 2.3 GHz. Efficiency cores
* 30% performance uplift and 20% power efficiency improvement
* 12 MB L3 cache (up from 8 MB), 6 MB system-level cache
* GPU features
* Adreno 750 GPU with API support: OpenGL ES 3.2, OpenCL 2.0, Vulkan 1.3
* 25% faster graphics rendering and 25% more power efficient
* DSP features
* Hexagon NPU 98% faster performance and 40% improved performance-per-watt for sustained AI inferencing.
* ISP features
* Photo expansion
* Video Object Eraser
* Night Vision video capture
* Dolby HDR video capture
* Modem and wireless features:
* Internal X75 5G Modem
* Bluetooth 5.4 support
The Snapdragon 8s Gen 3 was announced on March 18, 2024.
| Product name (Model number) | Fab | Die size | CPU (ARMv9) ( Cores / Freq ) | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Released |
| Snapdragon 8 Gen 3 (SM8650-AB) | 4 nm (TSMC N4P) | 137.3 mm | Kryo (1× 3.3 GHz Cortex-X4 + 3× 3.15 GHz Cortex-A720 + 2× 2.96 GHz Cortex-A720 + 2× 2.27 GHz Cortex-A520) | Adreno 750 903 MHz (2774 GFLOPS in FP32) | Hexagon | Spectra (200 MP Photo Capture, 108 MP single camera @30fps ZSL, 64+36 MP dual camera @30fps ZSL, 36 MP triple camera @30fps ZSL; Video Capture: 8K@30fps HDR) | LPDDR5X quad-channel 16-bit (64-bit) 4800 MHz (76.8 GB/s) | Internal: X75 5G (5G NR Sub-6 & mmWave: download @ 10 Gbit/s, upload @ 3.5 Gbit/s) | FastConnect 7800; Bluetooth 5.4; 802.11ac/ax/be (Wi-Fi 7) @ 5.8 Gbit/s; GPS, Glonass, NavIC, Beidou, Galileo, QZSS; USB 3.1 | 5 | Q4 2023 |
| Snapdragon 8 Gen 3 (SM8650-AA) | 4 nm (TSMC N4P) | 137.3 mm | Kryo (1× 3.05 GHz Cortex-X4 + 5× 2.96 GHz Cortex-A720 + 2× 2.04 GHz Cortex-A520) | Adreno 750 903 MHz (2774 GFLOPS in FP32) | Hexagon | Spectra (200 MP Photo Capture, 108 MP single camera @30fps ZSL, 64+36 MP dual camera @30fps ZSL, 36 MP triple camera @30fps ZSL; Video Capture: 8K@30fps HDR) | LPDDR5X quad-channel 16-bit (64-bit) 4800 MHz (76.8 GB/s) | Internal: X75 5G (5G NR Sub-6 & mmWave: download @ 10 Gbit/s, upload @ 3.5 Gbit/s) | FastConnect 7800; Bluetooth 5.4; 802.11ac/ax/be (Wi-Fi 7) @ 5.8 Gbit/s; GPS, Glonass, NavIC, Beidou, Galileo, QZSS; USB 3.1 | 5 | Q4 2024 |
| Snapdragon 8 Gen 3 for Galaxy (SM8650-AC) | 4 nm (TSMC N4P) | 137.3 mm | Kryo (1× 3.4 GHz Cortex-X4 + 3× 3.15 GHz Cortex-A720 + 2× 2.96 GHz Cortex-A720 + 2× 2.27 GHz Cortex-A520) | Adreno 750 1000 MHz (3072 GFLOPS in FP32) | Hexagon | Spectra (200 MP Photo Capture, 108 MP single camera @30fps ZSL, 64+36 MP dual camera @30fps ZSL, 36 MP triple camera @30fps ZSL; Video Capture: 8K@30fps HDR) | LPDDR5X quad-channel 16-bit (64-bit) 4800 MHz (76.8 GB/s) | Internal: X75 5G (5G NR Sub-6 & mmWave: download @ 10 Gbit/s, upload @ 3.5 Gbit/s) | FastConnect 7800; Bluetooth 5.4; 802.11ac/ax/be (Wi-Fi 7) @ 5.8 Gbit/s; GPS, Glonass, NavIC, Beidou, Galileo, QZSS; USB 3.1 | 5 | Q1 2024 |
| Snapdragon 8s Gen 3 (SM8635) | 4 nm (TSMC N4P) | | Kryo (1× 3.0 GHz Cortex-X4 + 4× 2.8 GHz Cortex-A720 + 3× 2.0 GHz Cortex-A520) | Adreno 735 1100 MHz (1689.6 GFLOPS in FP32) | Hexagon | Spectra (200 MP Photo Capture, 108 MP single camera @30fps ZSL, 64+36 MP dual camera @30fps ZSL, 36 MP triple camera @30fps ZSL; Video Capture: 4K@60fps HDR) | LPDDR5X quad-channel 16-bit (64-bit) 4200 MHz (67.2 GB/s) | Internal: X70 5G (5G NR Sub-6 & mmWave: download @ 6.5 Gbit/s, upload @ 3.5 Gbit/s) | FastConnect 7800; Bluetooth 5.4; 802.11ac/ax/be (Wi-Fi 7) @ 5.8 Gbit/s; GPS, Glonass, NavIC, Beidou, Galileo, QZSS; USB 3.1 | 5 | Q1 2024 |
* ↑ Also known as "Leading Version".

### Snapdragon 8 Elite (2025)

The Snapdragon 8 Elite was announced on October 22, 2024.
* Features of the Snapdragon 8 Elite series
* Notable features over its predecessor (8 Gen 3):
* Support for memory up to 5333.5 MHz (up from 4800 MHz)
* CPU features
* 2 Oryon Prime cores up to 4.32 GHz
* 12 MB L2 cache
* 6 Oryon Performance cores up to 3.53 GHz
* 12 MB L2 cache
* 45% performance uplift and 44% power efficiency improvement
* 8 MB SLC, no L3 cache
* GPU features
* Adreno 830 GPU with API support: OpenGL ES 3.2, OpenCL 3.0, Vulkan 1.3
* Uses a sliced architecture, with 3 slices with 4 CUs per slice total 12 CU and 4 MB cache each in the Adreno 830.
* 40% faster graphics rendering and 40% more power efficient
* DSP features
* Hexagon NPU 45% AI performance improvement and 45% better performance per watt
* ISP features
* Limitless Segmentation
* Al Relighting
* Al Pet Suite
* Video Magic Eraser
* Modem and wireless features:
* Internal X80 5G Modem
* Qualcomm FastConnect 7900
* Bluetooth 6.0 support
| Product name (Model number) | Fab | Die size | CPU (Cores/Freq) | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Released |
| Snapdragon 8 Elite (SM8750-AB) | 3 nm (TSMC N3E) | 124.1 mm | Oryon 2 + 6 cores (4.32 GHz Prime cores + 3.53 GHz Performance core) | Adreno 830 1100 MHz (3379.2 GFLOPS in FP32) | Hexagon | Spectra (320 MP Photo Capture, 108 MP single camera @30fps ZSL, 48 MP triple camera @30fps ZSL; Video Capture: 8K@60fps HDR) | LPDDR5X dual-channel 32-bit (64-bit) 5333.5 MHz (85.3 GB/s) | Internal: X80 5G (5G NR Sub-6 & mmWave: download 10 Gbit/s, upload 3.5 Gbit/s) | FastConnect 7900, Bluetooth 6.0, 802.11ax/be (Wi-Fi 7) @ 5.8 Gbit/s, GPS, QZSS, Glonass, NavIC, Beidou, Galileo, USB 3.1 | 5 | Q4 2024 |
| Snapdragon 8 Elite (SM8750-3-AB) | 3 nm (TSMC N3E) | | Oryon 2 + 5 cores (4.32 GHz Prime cores + 3.53 GHz Performance core) | Adreno 830 1100 MHz (3379.2 GFLOPS in FP32) | Hexagon | Spectra (320 MP Photo Capture, 108 MP single camera @30fps ZSL, 48 MP triple camera @30fps ZSL; Video Capture: 8K@60fps HDR) | LPDDR5X dual-channel 32-bit (64-bit) 5333.5 MHz (85.3 GB/s) | Internal: X80 5G (5G NR Sub-6 & mmWave: download 10 Gbit/s, upload 3.5 Gbit/s) | FastConnect 7900, Bluetooth 6.0, 802.11ax/be (Wi-Fi 7) @ 5.8 Gbit/s, GPS, QZSS, Glonass, NavIC, Beidou, Galileo, USB 3.1 | 5 | Q1 2025 |
| Snapdragon 8 Elite for Galaxy (SM8750-AC) | 3 nm (TSMC N3E) | | Oryon 2 + 6 cores (4.47 GHz Prime cores + 3.53 GHz Performance core) | Adreno 830 1200 MHz (3686.4 GFLOPS in FP32) | Hexagon | Spectra (320 MP Photo Capture, 108 MP single camera @30fps ZSL, 48 MP triple camera @30fps ZSL; Video Capture: 8K@60fps HDR) | LPDDR5X dual-channel 32-bit (64-bit) 5333.5 MHz (85.3 GB/s) | Internal: X80 5G (5G NR Sub-6 & mmWave: download 10 Gbit/s, upload 3.5 Gbit/s) | FastConnect 7900, Bluetooth 6.0, 802.11ax/be (Wi-Fi 7) @ 5.8 Gbit/s, GPS, QZSS, Glonass, NavIC, Beidou, Galileo, USB 3.1 | 5 | Q1 2025 |

## Mobile Compute Platforms
### Snapdragon 835 and Snapdragon 850

The first and second generations of Qualcomm Compute Platforms for Windows PCs are based on mobile Snapdragon processors with PC specific modifications. The Snapdragon 835 Mobile PC Platform for Windows 10 PCs was announced on December 5, 2017. The Snapdragon 850 Mobile Compute Platform for Windows 10 PCs, was announced on June 4, 2018. It is essentially an over-clocked version of the Snapdragon 845.
| Product name (Model number) | Fab | CPU (ARMv8) | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
| Snapdragon 835 (MSM8998) | 10 nm (Samsung 10LPE) | Kryo 280 4 + 4 cores (2.6 GHz + 1.9 GHz) | Adreno 540 710 MHz (363.5 GFLOPS in FP32) | Hexagon 682 | Spectra 180 (Up to 32 MP camera / 16 MP dual) | LPDDR4X Dual-channel 32-bit (64-bit) 1866 MHz (29.9 GB/s) | X16 LTE (download: Cat 16, up to 1000 Mbit/s; 4x20 MHz CA; 256-QAM; 4x4 MIMO on 2C. upload: Cat 13, up to 150 Mbit/s) | Bluetooth 5; 802.11ac/ad Wave 2 (MU-MIMO); GPS, GLONASS, Beidou, Galileo, QZSS, SBAS | 4 | Q2 2018 |
| Snapdragon 850 (SDM850) | 10 nm (Samsung 10LPP) | Kryo 385 4 + 4 cores (2.96 GHz + 1.77 GHz) | Adreno 630 710 MHz (727 GFLOPS in FP32) | Hexagon 685 (3 TOPS) | Spectra 280 (192 MP single camera / 16 MP at 30fps Dual Camera with MFNR/ZSL) | LPDDR4X Quad-channel 16-bit (64-bit) 1866 MHz (29.9 GB/s) | X20 LTE (download: Cat 18, up to 1200 Mbit/s; 5x20 MHz CA; 256-QAM; 4x4 MIMO on 3C. upload: Cat 13, up to 150 Mbit/s; 2x20 MHz CA; 64-QAM) | Bluetooth 5; 802.11ac/ad Wave 2 (MU-MIMO); GPS, GLONASS, Beidou, Galileo, QZSS, SBAS | 4+ | Q3 2018 |

### Snapdragon 7c/7c+ Compute Platforms

The Snapdragon 7c Compute Platform for Windows 10 PCs was announced on December 5, 2019. The Snapdragon 7c Gen 2 Compute Platform for Windows 10 PCs was announced on May 24, 2021. The Snapdragon 7c+ Gen 3 Compute Platform for Windows 10 / 11 PCs was announced on December 1, 2021.
| Product name (Model number) | Fab | CPU (ARMv8) | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Sampling availability |
| Snapdragon 7c (SC7180) | 8 nm (Samsung 8LPP) | Kryo 468 2 + 6 cores (2.4 GHz) | Adreno 618 825 MHz (422.4 GFLOPS in FP32) | Hexagon 692 (5 TOPS) | Spectra 255 (32 MP camera, 16 MP dual) | LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.1 GB/s) | X15 LTE (download: Cat 15, @ 800 Mbit/s; upload: Cat 13, @ 150 Mbit/s) | Bluetooth 5; 802.11ax (Wi-Fi 6); GPS, Glonass, SBAS, Beidou, Galileo, QZSS, NavIC; USB 3.1; eMMC 5.1, UFS 3.0 | Q1 2020 |
| Snapdragon 7c Gen 2 (SC7180P) | 8 nm (Samsung 8LPP) | Kryo 468 2 + 6 cores (2.55 GHz) | Adreno 618 825 MHz (422.4 GFLOPS in FP32) | Hexagon 692 (5 TOPS) | Spectra 255 (32 MP camera, 16 MP dual) | LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.1 GB/s) | X15 LTE (download: Cat 15, @ 800 Mbit/s; upload: Cat 13, @ 150 Mbit/s) | Bluetooth 5; 802.11ax (Wi-Fi 6); GPS, Glonass, SBAS, Beidou, Galileo, QZSS, NavIC; USB 3.1; eMMC 5.1, UFS 3.0 | Q2 2021 |
| Snapdragon 7c+ Gen 3 (SC7280) | 6 nm (TSMC N6) | Kryo 4 Gold + 4 Silver cores (Cortex-A78 2.4 GHz) + Cortex-A55 | Adreno 618 825 MHz (422.4 GFLOPS in FP32) | Hexagon (6.5 TOPS) | Spectra (64 MP single camera, 36+22 MP dual camera) | LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.1 GB/s) LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s) | Internal: X53 5G/LTE (5G: download @ 3.7 Gbit/s, upload @ 2.9 Gbit/s; LTE Cat 24/22: download @ 1200 Mbit/s, upload @ 210 Mbit/s) | FastConnect 6700, Bluetooth 5.2; 802.11ax (Wi-Fi 6E) 2x2 (MU-MIMO) @ 3.6 Gbit/s; GPS, Glonass, BeiDou, Galileo, QZSS, SBAS, USB 3.1; eMMC 5.1, UFS 2.1, NVMe SSD | Q1 2022 |

### Snapdragon 8c Compute Platforms

The Snapdragon 8c Compute Platform for Windows 10 PCs was announced on December 5, 2019.
| Product name (Model number) | Fab | CPU (ARMv8) | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
| Snapdragon 8c (SC8180) | 7 nm (TSMC N7) | Kryo 490 4 + 4 cores (2.45 GHz + 1.80 GHz) | Adreno 675 590 MHz | Hexagon 690 (9 TOPS) | Spectra 390 (192MP single camera, 22MP at 30fps dual camera with MFNR / ZSL) | LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.1 GB/s) | Internal: X24 LTE (Cat 20: download @ 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload @ 316 Mbit/s, 3x20 MHz CA, 256-QAM) External: X55 5G/LTE (5G: download @ 7 Gbit/s, upload @ 3 Gbit/s; LTE Cat 22: download @ 2.5 Gbit/s, upload @ 316 Mbit/s) | Bluetooth 5.0; 802.11ac/ad; GPS, Glonass, SBAS, Beidou, Galileo, QZSS; USB 3.1; UFS 3.0, NVMe SSD | 4+ | Q1 2020 |

### Snapdragon 8cx Compute Platforms

The Snapdragon 8cx Compute Platform for Windows 10 PCs was announced on December 6, 2018. Notable features over the Snapdragon 855:
* 10 MB total cache (L3 + SLC)
* 8x 16-bit memory bus, (68.3 GB/s)
* NVM Express 4x
* 112.05 mm2 die size
The Snapdragon 8cx Gen 2 5G Compute Platform for Windows 10 PCs was announced on September 3, 2020. The Snapdragon 8cx Gen 3 Compute Platform for Windows 10 / 11 PCs was announced on December 1, 2021.
Notable features over the Snapdragon 888:
* 8 MB L3 cache & 6 MB SLC (14 MB total cache)
* 8x 16-bit memory bus, (68.3 GB/s)
* NVM Express 4x
* Built-in Microsoft Pluton TPM
| Product name (Model number) | Fab | CPU (ARMv8) | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
| Snapdragon 8cx (SC8180X) | 7 nm (TSMC N7) | Kryo 495 4 + 4 cores (2.84 GHz Cortex-A76 + 1.80 GHz Cortex-A55) | Adreno 680 585 MHz (1797.1 GFLOPS in FP32) | Hexagon 690 (9 TOPS) | Spectra 390 (32MP single camera, 16MP at 30fps dual camera with MFNR / ZSL) | LPDDR4X Octa-channel 16-bit (128-bit) 2133 MHz (68.3 GB/s) | No internal modem Optional external X24 LTE (Cat 20: download @ 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload @ 316 Mbit/s, 3x20 MHz CA, 256-QAM) | Bluetooth 5.0; 802.11ac/ad; GPS, Glonass, SBAS, Beidou, Galileo, QZSS; USB 3.1; UFS 3.0, NVMe SSD | 4+ | Q3 2019 |
| Snapdragon 8cx Gen 2 5G (SC8180XP) | 7 nm (TSMC N7) | Kryo 495 4 + 4 cores (3.15 GHz Cortex-A76 + 1.8 GHz Cortex-A55) | Adreno 690 660 MHz (2027.5 GFLOPS in FP32) | Hexagon 690 (9 TOPS) | Spectra 390 (32MP single camera, 16MP at 30fps dual camera with MFNR / ZSL) | LPDDR4X Octa-channel 16-bit (128-bit) 2133 MHz (68.3 GB/s) | No internal modem Optional external X24 LTE (Cat 20: download @ 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload @ 316 Mbit/s, 3x20 MHz CA, 256-QAM) or X55 5G/LTE (5G: download @ 7 Gbit/s, upload @ 3 Gbit/s; LTE Cat 22: download @ 2.5 Gbit/s, upload @ 316 Mbit/s) | Bluetooth 5.1; 802.11ax (Wi-Fi 6) 2x2 (MU-MIMO) @ 2.4 Gbit/s, NFC, GPS, Glonass, Beidou, Galileo, QZSS, SBAS, USB 3.1; UFS 3.0. NVMe SSD | 4+ | Q3 2020 |
| Snapdragon 8cx Gen 3 (SC8280) | 5 nm (Samsung 5LPE) | Kryo 4 + 4 cores (3.0 GHz Cortex-X1 + 2.40 GHz Cortex-A78) | Adreno 695 900 MHz (3686.4 GFLOPS in FP32) | Hexagon (15 TOPS) | Spectra (24 MP at 30fps single camera with MFNR/ZSL) | LPDDR4X Octa-channel 16-bit (128-bit) 2133 MHz (68.3 GB/s) | No internal modem Optional external X55 5G/LTE, X62 5G/LTE, X65 5G/LTE (5G: download @ 4.4/7.5/10 Gbit/s, upload @ 3 Gbit/s; LTE Cat 22: download @ 2.5 Gbit/s, upload @ 316 Mbit/s) | FastConnect 6900, Bluetooth 5.1; 802.11ax (Wi-Fi 6E) 2x2 (MU-MIMO) @ 3.6 Gbit/s; GPS, Glonass, BeiDou, Galileo, QZSS, SBAS, USB 3.1; UFS 3.1, NVMe SSD | | Q1 2022 |

### Microsoft SQ compute platforms

The Microsoft SQ1 was announced on October 2, 2019. Co-developed with Microsoft, it was exclusively designed for Microsoft's Surface Pro X. Technically, it's a Snapdragon 8cx SoC with faster Adreno 685 GPU core providing performance of 2100 GFLOPs. The Microsoft SQ2 was announced on October 1, 2020.
| Product name | Fab | CPU (ARMv8) | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
| Microsoft SQ1 | 7 nm (TSMC N7) | Kryo 495 4 + 4 cores (3 GHz Cortex-A76 + 1.80 GHz Cortex-A55) | Adreno 685 590 MHz (1812.5 GFLOPs in FP32) | Hexagon 690 (9 TOPS) | Spectra 390 (192 MP single camera / 22 MP at 30fps dual camera with MFNR/ZSL) | LPDDR4X Octa-channel 16-bit (128-bit) 2133 MHz (68.2 GB/s) | No internal modem Optional external X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20 MHz CA, 256-QAM) | Bluetooth 5.0; 802.11ac/ad; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1; UFS 3.0, NVMe SSD | 4+ | Q4 2019 |
| Microsoft SQ2 | 7 nm (TSMC N7) | Kryo 495 4 + 4 cores (3.15 GHz Cortex-A76 + 2.42 GHz Cortex-A55) | Adreno 690 680 MHz (2089 GFLOPs in FP32) | Hexagon 690 (9 TOPS) | Spectra 390 (192 MP single camera / 22 MP at 30fps dual camera with MFNR/ZSL) | LPDDR4X Octa-channel 16-bit (128-bit) 2133 MHz (68.2 GB/s) | No internal modem Optional external X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20 MHz CA, 256-QAM) | Bluetooth 5.0; 802.11ac/ad; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1; UFS 3.0, NVMe SSD | 4+ | Q4 2020 |
| Microsoft SQ3 | 5 nm (Samsung 5LPE) | Kryo 4 + 4 cores (3.0 GHz Cortex-X1 + 2.40 GHz Cortex-A78) | Adreno 695 900 MHz (3686.4 GFLOPS in FP32) | Hexagon (15 TOPS) | Spectra (24 MP at 30fps single camera with MFNR/ZSL) | LPDDR4X Octa-channel 16-bit (128-bit) 2133 MHz (68.2 GB/s) | No internal modem Optional external X62 5G/LTE, X55 5G/LTE, X65 5G/LTE (5G: download up to 4.4/7.5/10 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s) | FastConnect 6900, Bluetooth 5.1; 802.11ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) @ 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB 3.1; UFS 3.1, NVMe SSD | | Q3 2022 |

### Snapdragon X series

The Snapdragon X Elite for Windows 11 PCs was announced on October 24, 2023. The Snapdragon X Plus for Windows 11 PCs was announced on April 24, 2024. The Snapdragon X was announced on January 6, 2025.
| Product name (Model number) | Fab | Die size | CPU (Cores/Freq) | GPU | DSP/NPU | ISP | Memory technology | Modem | Connectivity | Sampling availability |
| Snapdragon X |||||||||||
| X1-26-100 | 4 nm (TSMC N4) | | Oryon 8 core (3.0 GHz) | Adreno X1-45 1107 MHz (1.7 TFLOPS) | Hexagon (45 TOPS) | Spectra (36 MP single camera) | LPDDR5X-8448 Octa-channel 16-bit (128-bit) @ 4224 MHz (135 GB/s) | No internal modem Optional external X65 5G/LTE (5G: download up to 10 Gbit/s, upload up to 3.5 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s) | No internal External: FastConnect 7800, Bluetooth 5.4; 802.11ac/ax/be (Wi-Fi 7) 2x2 (MU-MIMO) @ 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB 4.0; UFS 4.0, NVMe SSD | Q1 2025 |
| Snapdragon X Plus |||||||||||
| X1P-42-100 | 4 nm (TSMC N4) | | Oryon 8 core (3.2 GHz, single-core boost up to 3.4 GHz) | Adreno X1-45 1107 MHz (1.7 TFLOPS) | Hexagon (45 TOPS) | Spectra (36 MP single camera) | LPDDR5X-8448 Octa-channel 16-bit (128-bit) @ 4224 MHz (135 GB/s) | No internal modem Optional external X65 5G/LTE (5G: download up to 10 Gbit/s, upload up to 3.5 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s) | No internal External: FastConnect 7800, Bluetooth 5.4; 802.11ac/ax/be (Wi-Fi 7) 2x2 (MU-MIMO) @ 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB 4.0; UFS 4.0, NVMe SSD | Q2 2024 |
| X1P-46-100 | 4 nm (TSMC N4) | | Oryon 8 core (3.4 GHz, single-core boost up to 4.0 GHz) | Adreno X1-45 (2.1 TFLOPS) | Hexagon (45 TOPS) | Spectra (36 MP single camera) | LPDDR5X-8448 Octa-channel 16-bit (128-bit) @ 4224 MHz (135 GB/s) | No internal modem Optional external X65 5G/LTE (5G: download up to 10 Gbit/s, upload up to 3.5 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s) | No internal External: FastConnect 7800, Bluetooth 5.4; 802.11ac/ax/be (Wi-Fi 7) 2x2 (MU-MIMO) @ 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB 4.0; UFS 4.0, NVMe SSD | Q2 2024 |
| X1P-64-100 | 4 nm (TSMC N4) | 172.7 mm$^2$ | Oryon 10 core (3.4 GHz) | Adreno X1-85 1250 MHz (3.8 TFLOPS) | Hexagon (45 TOPS) | Spectra (64 MP single camera / 36 MP dual camera) | LPDDR5X-8448 Octa-channel 16-bit (128-bit) @ 4224 MHz (135 GB/s) | No internal modem Optional external X65 5G/LTE (5G: download up to 10 Gbit/s, upload up to 3.5 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s) | No internal External: FastConnect 7800, Bluetooth 5.4; 802.11ac/ax/be (Wi-Fi 7) 2x2 (MU-MIMO) @ 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB 4.0; UFS 4.0, NVMe SSD | Q2 2024 |
| X1P-66-100 | 4 nm (TSMC N4) | 172.7 mm$^2$ | Oryon 10 core (3.4 GHz, single-core boost up to 4.0 GHz) | Adreno X1-85 1250 MHz (3.8 TFLOPS) | Hexagon (45 TOPS) | Spectra (64 MP single camera / 36 MP dual camera) | LPDDR5X-8448 Octa-channel 16-bit (128-bit) @ 4224 MHz (135 GB/s) | No internal modem Optional external X65 5G/LTE (5G: download up to 10 Gbit/s, upload up to 3.5 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s) | No internal External: FastConnect 7800, Bluetooth 5.4; 802.11ac/ax/be (Wi-Fi 7) 2x2 (MU-MIMO) @ 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB 4.0; UFS 4.0, NVMe SSD | Q2 2024 |
| Snapdragon X Elite |||||||||||
| X1E-78-100 | 4 nm (TSMC N4) | 172.7 mm$^2$ | Oryon 12 core (3.4 GHz) | Adreno X1-85 1250 MHz (3.8 TFLOPS) | Hexagon (45 TOPS) | Spectra (64 MP single camera / 36 MP dual camera) | LPDDR5X-8448 Octa-channel 16-bit (128-bit) @ 4224 MHz (135 GB/s) | No internal modem Optional external X65 5G/LTE (5G: download up to 10 Gbit/s, upload up to 3.5 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s) | No internal External: FastConnect 7800, Bluetooth 5.4; 802.11ac/ax/be (Wi-Fi 7) 2x2 (MU-MIMO) @ 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB 4.0; UFS 4.0, NVMe SSD | Q2 2024 |
| X1E-80-100 | 4 nm (TSMC N4) | 172.7 mm$^2$ | Oryon 12 core (3.4 GHz, single and dual-core boost up to 4.0 GHz) | Adreno X1-85 1250 MHz (3.8 TFLOPS) | Hexagon (45 TOPS) | Spectra (64 MP single camera / 36 MP dual camera) | LPDDR5X-8448 Octa-channel 16-bit (128-bit) @ 4224 MHz (135 GB/s) | No internal modem Optional external X65 5G/LTE (5G: download up to 10 Gbit/s, upload up to 3.5 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s) | No internal External: FastConnect 7800, Bluetooth 5.4; 802.11ac/ax/be (Wi-Fi 7) 2x2 (MU-MIMO) @ 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB 4.0; UFS 4.0, NVMe SSD | Q2 2024 |
| X1E-84-100 | 4 nm (TSMC N4) | 172.7 mm$^2$ | Oryon 12 core (3.8 GHz, single and dual-core boost up to 4.2 GHz) | Adreno X1-85 1500 MHz (4.6 TFLOPS) | Hexagon (45 TOPS) | Spectra (64 MP single camera / 36 MP dual camera) | LPDDR5X-8448 Octa-channel 16-bit (128-bit) @ 4224 MHz (135 GB/s) | No internal modem Optional external X65 5G/LTE (5G: download up to 10 Gbit/s, upload up to 3.5 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s) | No internal External: FastConnect 7800, Bluetooth 5.4; 802.11ac/ax/be (Wi-Fi 7) 2x2 (MU-MIMO) @ 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB 4.0; UFS 4.0, NVMe SSD | Q2 2024 |
| X1E-00-1DE | 4 nm (TSMC N4) | 172.7 mm$^2$ | Oryon 12 core (3.8 GHz, single and dual-core boost up to 4.3 GHz) | Adreno X1-85 1500 MHz (4.6 TFLOPS) | Hexagon (45 TOPS) | Spectra (64 MP single camera / 36 MP dual camera) | LPDDR5X-8448 Octa-channel 16-bit (128-bit) @ 4224 MHz (135 GB/s) | No internal modem Optional external X65 5G/LTE (5G: download up to 10 Gbit/s, upload up to 3.5 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s) | No internal External: FastConnect 7800, Bluetooth 5.4; 802.11ac/ax/be (Wi-Fi 7) 2x2 (MU-MIMO) @ 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB 4.0; UFS 4.0, NVMe SSD | Q2 2024 |

## Hardware codec supported

See: Qualcomm Hexagon

## Wearable platforms

The Snapdragon Wear 1100 processor was announced May 30, 2016 for GNSS- and LTE-enabled fitness trackers and targeted purpose wearables like smart headsets, and wearable accessories.
The Snapdragon Wear 1200 processor was announced June 27, 2017 for GNSS- and LTE-narrowband-IoT-enabled targeted purpose wearables such as kid, pet, elderly, and fitness trackers.
The Snapdragon Wear 2100 processor was announced February 10, 2016 for smartwatches. It is available in both connected (4G/LTE and 3G) and tethered (Bluetooth and Wi-Fi) versions.
The Snapdragon Wear 2500 was announced on June 26, 2018. It is intended for the kid watch segment with special features over the Wear 2100 such as low-power always-on location tracking.
The Snapdragon Wear 3100 was announced on September 10, 2018. The upgrade over the Snapdragon Wear 2100 is the inclusion of the co-processor QCC1110 for low-power background applications such as heart rate tracking and always-on displays.
The Snapdragon Wear 4100 and 4100+ were announced on June 30, 2020. The difference between the two models is the inclusion of the co-processor QCC1110 in the 4100+.
The Snapdragon W5 and W5+ Gen 1 were announced on July 19, 2022. The difference between the two models is the inclusion of the co-processor QCC5100 in the W5+.
| Model number | Product name | Fab | CPU | Co-processor | GPU | DSP | Memory technology | Modem | Connectivity | Sampling availability |
| ? | Wear 1100 | 28 nm | 1 core up to 1.2 GHz Cortex-A7 (ARMv7) | — | Fixed Function GPU | | LPDDR2 | Integrated 2G/3G/LTE (Cat 1, up to 10/5 Mbit/s) | Bluetooth 4.1; 802.11a/b/g/n/ac; GPS, GLONASS, Galileo, BeiDou | Q2 2016 |
| ? | Wear 1200 | 28 nm | 1 core up to 1.3 GHz Cortex-A7 (ARMv7) | — | Fixed Function GPU | | LPDDR2 | Integrated 2G/LTE (Cat M1, up to 300/350 kbit/s) | Bluetooth 4.2; 802.11a/b/g/n/ac; GPS, GLONASS, Galileo, BeiDou | Q2 2017 |
| MSM8909w | Wear 2100 | 28 nm | 4 cores up to 1.2 GHz Cortex-A7 (ARMv7) | — | Adreno 304 | Hexagon | LPDDR3 400 MHz | X5 2G/3G/LTE (Cat 4, up to 150/50 Mbit/s) | Bluetooth 4.1; 802.11b/g/n; NFC; GPS, GLONASS, Galileo, BeiDou | Q1 2016 |
| MSM8909w | Wear 2500 | 28 nm | 4 cores up to 1.2 GHz Cortex-A7 (ARMv7) | — | Adreno 304 | Hexagon | LPDDR3 400 MHz | X5 2G/3G/LTE (Cat 4, up to 150/50 Mbit/s) | Bluetooth 4.1; 802.11b/g/n; NFC; GPS, GLONASS, Galileo, BeiDou | Q2 2018 |
| MSM8909w | Wear 3100 | 28 nm | 4 cores up to 1.2 GHz Cortex-A7 (ARMv7) | QCC1110 (1 core 50 MHz Cortex-M0) 3100 & 4100+ only | Adreno 304 | Hexagon | LPDDR3 400 MHz | X5 2G/3G/LTE (Cat 4, up to 150/50 Mbit/s) | Bluetooth 4.1; 802.11b/g/n; NFC; GPS, GLONASS, Galileo, BeiDou | Q3 2018 |
| SDM429w | Wear 4100 and 4100+ | 12 nm + 28 nm | 4 cores up to 2.0 GHz Cortex-A53 (ARMv8-A) | QCC1110 (1 core 50 MHz Cortex-M0) 3100 & 4100+ only | Adreno A504 320 MHz | Hexagon QDSP6 V56 | 1x32 bit LPDDR3 750 MHz | X5 2G/3G/LTE (Cat 4, up to 150/50 Mbit/s) | Bluetooth 5.0; 802.11a/b/g/n; NFC; GPS; GLONASS, Galileo, BeiDou | Q2 2020 |
| SW5100 | W5 and W5+ Gen 1 | 4 nm + 22 nm | 4 cores up to 1.7 GHz Cortex-A53 (ARMv8-A) | QCC5100 (1 core 250 MHz Cortex-M55 + Ethos-U55) W5+ only | Adreno A702 1 GHz | Hexagon DSP V66K | 1x16 bit LPDDR4 2133 MHz | Integrated 2G/3G/LTE (Cat 4, up to 150/50 Mbit/s) | Bluetooth 5.3; 802.11a/b/g/n; NFC; GPS; GLONASS, Galileo, BeiDou | Q3 2022 |
* ↑ Bluetooth 4.2 for Wear 3100

## Automotive platforms

The Snapdragon 602A, for application in the motor industry, was announced on January 6, 2014. The Snapdragon 820A was announced on January 6, 2016.
| Snapdragon Automotive Cockpit platform SA4150P SA4155P SA6145P SA6150P SA6155 SA6155P • | SA7255P SA8145P SA8150P SA8155 SA8155P • SA8195P • SA8255P • SA8295P • | Snapdragon Ride & Ride Flex platform SA8540P SA8620P SA8650P SA8770P SA8775P SA9000P • AI Accelerator | Snapdragon Cockpit Elite Snapdragon Digital Chassis Snapdragon Ride Elite Qualcomm Oryon CPU |
| Product name (Model number) | Fab | CPU (Core / Freq) | GPU | DSP | Memory technology | Modem | Connectivity | Sampling availability |
| Snapdragon 602A (APQ8064-AU) | 28 nm (TSMC 28LP) | Krait 300 4 cores 1.51 GHz (ARMv7) | Adreno 320 400 MHz (76.8 GFLOPs) (2048x1536 + 1080p external display) | Hexagon QDSP6 V4 500 MHz | LPDDR3 Dual-channel 32-bit 533 MHz (8.5 GB/s) | External: Gobi MDM9615 LTE: FDD/TDD Cat3 CDMA: EV-DOrB/rA 1x UMTS: TD-SCDMA, DC-HSPA+/HSPA GSM: EDGE/GPRS | Bluetooth 4.1 + BLE Qualcomm VIVE QCA6574 802.11ac (Wi-Fi 5) 2x2 (MU-MIMO) | Q1 2014 |
| Snapdragon 820AM (APQ8096AU/ MSM8996AU) | 14 nm (Samsung 14LPP) | Kryo 2 + 2 cores 2.15 GHz Gold + 1.59 GHz Silver (ARMv8) | Adreno 530 624 MHz (319.4 GFLOPs) | Hexagon 680 1.0 GHz | LPDDR4X Dual-channel 32-bit (64-bit) 1866 MHz (29.9 GB/s) | Internal: APQ: no MSM: X12 LTE Download: Cat 12, 600 Mbit/s Upload: Cat 13, 150 Mbit/s | Bluetooth 4.1 802.11ac (Wi-Fi 5) IZat Gen8C | Q1 2016 |
| SA6155P | 11 nm (Samsung 11LPP) | Kryo 460 2 + 6 cores (2.0 GHz Gold + 1.6 GHz Silver) | Adreno 608/612 (110 GFLOPs) | Hexagon 685 V6 DSP, Spectra 230 ISP | LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) | Internal: no | Bluetooth 5.0 802.11ac (Wi-Fi 5) GPS, Glonass, Beidou, Galileo, QZSS, SBAS | Q1 2019 |
| Snapdragon 855A (SA8155P) | 7 nm (TSMC N7) | Kryo 485 1 + 3 + 4 cores 2.96 GHz Prime + 2.42 GHz Gold + 1.79 GHz Silver | Adreno 640 675 MHz (1036.8 GFLOPs) | Hexagon 690 (10 TOPS) | LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.1 GB/s) | X24 LTE Modem FDD·TDD Cat.20 2Gbps/316Mbps 7·3CA / VoLTE, 3G GSM, CDMA 2000, TD-SCDMA, 2G GSM/CDMA | Bluetooth 5.0 802.11ax (Wi-Fi 6) GPS, Glonass, Beidou, Galileo, QZSS, SBAS | Q1 2021 |
| SA8195P | 7 nm (TSMC N7) | Kryo 495 4 + 4 cores Cortex-A76 + Cortex-A55 | Adreno 680 600 MHz (1843.2 GFLOPs) | Hexagon | LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.1 GB/s) | Internal: no | Bluetooth 5.0 802.11ax (Wi-Fi 6) GPS, Glonass, Beidou, Galileo, QZSS, SBAS | |
| SA8255P | 5 nm (Samsung 5LPE) | Kryo 4 + 4 cores 2.35 GHz Prime + 2.35 GHz Gold | Adreno 663 | Hexagon | LPDDR5 Hexa-channel 16-bit (96-bit) 3200 MHz (76.8 GB/s) | Internal: no | Bluetooth 5.2 802.11ax (Wi-Fi 6) GPS, Glonass, Beidou, Galileo, QZSS, SBAS | |
| SA8295P | 5 nm (Samsung 5LPE) | Kryo 695 4 + 4 cores 2.56 GHz Cortex-X1 + 2.05 GHz Cortex-A78 | Adreno 695 | Hexagon (30 TOPS) | LPDDR4X Octa-channel 16-bit (128-bit) 2133 MHz (68.2 GB/s) | Internal: no | Bluetooth 5.2 802.11ax (Wi-Fi 6) 2x2 (MU-MIMO) @ 1.7 Gbit/s GPS, Glonass, Beidou, Galileo, QZSS, SBAS | 2023 |

## Embedded platforms

The Snapdragon 410E Embedded and Snapdragon 600E Embedded were announced on September 28, 2016. The Snapdragon 800 for Embedded The Snapdragon 810 for Embedded The Snapdragon 820E Embedded was announced on February 21, 2018.
| Product name (Model number) | Fab | CPU (Cores/Freq) | GPU | DSP | ISP | Memory technology | Modem | Connectivity |
| Snapdragon 410E (APQ8016E) | 28 nm (TSMC 28LP) | 4 cores up to 1.2 GHz Cortex-A53 (ARMv8) | Adreno 306 | Hexagon QDSP6 V5 691 MHz | Up to 13 MP camera | LPDDR2/3 Single-channel 32-bit 533 MHz (4.2 GB/s) | none | Bluetooth 4.0, 802.11n, GPS |
| Snapdragon 600E (APQ8064E) | 28 nm (TSMC 28LP) | 4 cores up to 1.5 GHz Krait 300 (ARMv7) | Adreno 320 400 MHz | Hexagon QDSP6 V4 500 MHz | Up to 21 MP camera | DDR3/DDR3L Dual-channel 533 MHz | none | Bluetooth 4.0, 802.11a/b/g/n/ac (2.4/5 GHz), IZat Gen8A |
| Snapdragon 800E (APQ8074) | 28 nm (TSMC 28HPM) | 4 cores up to 2.3 GHz Krait 400 (ARMv7) | Adreno 330 | Hexagon QDSP6 V5 | Up to 55 MP camera | LPDDR3 Dual-channel 32-bit 800 MHz (12.8 GB/s) | none | Bluetooth 4.1; 802.11n/ac (2.4/5 GHz); IZat Gen8B; NFC, Gigabit Ethernet, HDMI, DisplayPort, SATA, SDIO, UART, I2C, GPIOs, JTAG; USB 3.0/2.0 |
| Snapdragon 810E (APQ8094) | 20 nm (TSMC 20SoC) | 4 + 4 cores 2.0 GHz Cortex-A57 + 1.55 GHz Cortex-A53 (ARMv8) | Adreno 430 650 MHz | Hexagon V56 800 MHz | Up to 55 MP camera | LPDDR4 Dual-channel 32-bit 1600 MHz (25.6 GB/s) | none | Bluetooth 4.1; 802.11ac; IZat Gen8C |
| Snapdragon 820E (APQ8096) | 14 nm FinFET (Samsung 14LPP) | 2 + 2 cores (2.15 GHz + 1.6 GHz) Kryo (ARMv8) | Adreno 530 | Hexagon 680 825 MHz | Up to 28 MP camera | LPDDR4 Quad-channel 16-bit (64-bit) 1866 MHz (29.8 GB/s) | none | Bluetooth 4.1; 802.11ac/ad; IZat Gen8C |

## Vision Intelligence Platform

The Qualcomm Vision Intelligence Platform was announced on April 11, 2018. The Qualcomm Vision Intelligence Platform is purpose built to bring powerful visual computing and edge computing for machine learning to a wide range of IoT devices.
| Model number | Fab | CPU (ARMv8) | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
| QCS603 | 10 nm (Samsung 10LPP) | 2 + 2 cores (1.6 GHz Kryo 360 Gold + 1.7 GHz Kryo 360 Silver) | Adreno 615 (Quad HD + 4K Ultra HD external display) | Hexagon 685 | Spectra 270 (Up to 24 MP camera / 16 MP dual) | LPDDR4X 16-bit 1866 MHz | none | Bluetooth 5.0, NFC, 802.11ac 1x1 (MU-MIMO) Wi-Fi up to 433 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1 | 4+ | |
| QCS605 | 10 nm (Samsung 10LPP) | 8 cores up to 2.5 GHz Kryo 300 | Adreno 615 (Quad HD + 4K Ultra HD external display) | Hexagon 685 | Spectra 270 (Up to 32 MP camera / 16 MP dual) | LPDDR4X 16-bit 1866 MHz | none | Bluetooth 5.0, NFC, 802.11ac 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1 | 4+ | |

## Home Hub and Smart Audio platforms

The Qualcomm Smart Audio Platform (APQ8009 and APQ8017) was announced on June 14, 2017. The Qualcomm 212 Home Hub (APQ8009) and Qualcomm 624 Home Hub (APQ8053) were announced on January 9, 2018.
The QCS400 Series was announced March 19, 2019.
| Model number | Fab | CPU (Cores/Freq) | GPU | DSP | ISP | Audio | Memory technology | Modem | Connectivity | Sampling availability |
| APQ8009 (SDA212) | 28 nm (TSMC 28LP) | 4 cores up to 1.3 GHz Cortex-A7 (ARMv7) | Adreno 304 (HD) | Hexagon 536 | Up to 16 MP camera | | LPDDR2/3 Single-channel 533 MHz | none | Bluetooth 4.2 + BLE, 802.11ac (2.4/5GHz) Wi-Fi | |
| APQ8017 | 28 nm (TSMC 28LP) | 4 cores up to 1.4 GHz Cortex-A53 (ARMv8) | Adreno 308 (Full HD) | Hexagon 536 | | | LPDDR3 Single-channel 667 MHz | none | Bluetooth 4.2 + BLE, 802.11ac (2.4/5GHz) Wi-Fi | |
| APQ8053 (SDA624) | 14 nm (Samsung 14LPP) | 8 cores up to 1.8 GHz Cortex-A53 (ARMv8) | Adreno 506 (Full HD+) | Hexagon 546 | Up to 24 MP camera, 13 MP dual | | LPDDR3 | none | Bluetooth 4.2 + BLE, 802.11ac (2.4/5GHz) Wi-Fi | |
| QCS403 | | Dual-core CPU | none | 2x Hexagon V66 | | 12× audio channels supported | | none | Bluetooth 5.1; 802.11ax-ready, 802.11ac, 4x4 (MIMO); Zigbee/15.4 | Q1 2019 |
| QCS404 | | Quad-core CPU | none | 2x Hexagon V66 | | 12× audio channels supported | | none | Bluetooth 5.1; 802.11ax-ready, 802.11ac, 4x4 (MIMO); Zigbee/15.4 | Q1 2019 |
| QCS405 | | Quad-core CPU | Adreno 306 (Full HD+) | 2x Hexagon V66 | | 12× audio channels supported | | none | Bluetooth 5.1; 802.11ax-ready, 802.11ac, 4x4 (MIMO); Zigbee/15.4 | Q1 2019 |
| QCS407 | | Quad-core CPU | Adreno 306 (Full HD+) | 2x Hexagon V66 | | 32× audio channels supported | | none | Bluetooth 5.1; 802.11ax-ready, 802.11ac, 4x4 (MIMO); Zigbee/15.4 | Q1 2019 |

## Mixed Reality (MR) platforms
### Snapdragon XR series

* Snapdragon XR1 was announced in May 2018, is designed for Augmented reality, Virtual reality and mixed reality.
* Snapdragon XR2 was announced in December 2019, and is a derivative of the Snapdragon 865.
    It is used in the Meta Quest 2, the HTC Vive Focus 3 and the Pico 4.
* Snapdragon XR2+ Gen 1 was announced on October 11, 2022, and is used in the Meta Quest Pro.
* Snapdragon XR2 Gen 2 is announced in September 2023. Qualcomm claims improved performance compared to its predecessor XR2 5G.
    The SoC can handle up to 10 concurrent sensors & cameras, per-eye resolution of 3K x 3K and 12ms full-color video pass-through.
    It supports Wi-Fi 7 network. It is integrated into Meta Quest 3.
* Snapdragon XR2+ Gen 2 is an overclocked version of the XR2 Gen 2.
| Product name | Fab | CPU (ARMv8) | GPU | DSP | ISP | Memory technology | Tracking | Connectivity | Sampling availability |
| XR1 | 10 nm (Samsung 10LPP) | 4x Kryo 385 Gold + 4x Kryo 385 Silver | Adreno 615 | Hexagon 685 | Spectra | LPDDR4X | 3DoF and 6DoF head and controller tracking | Wi-Fi 5 Bluetooth 5 | Q1 2019 |
| XR2 | 7 nm (TSMC N7+) | 1x Kryo 585 Prime + 3x Kryo 585 Gold + 4x Kryo 585 Silver | Adreno 650 (up to 2x 3K displays at 90 Hz) | Hexagon 698 | Spectra (input from up to 7 cameras) | LPDDR4X | Full 6DoF head and controller tracking, as well as hand and finger tracking | Wi-Fi 6 Bluetooth 5 5G | Q1 2020 |
| XR2+ (Gen 1) | 7 nm (TSMC N7+) | 1x Kryo 585 Prime + 3x Kryo 585 Gold + 4x Kryo 585 Silver | Adreno 650 (up to 2x 3K displays at 90 Hz) | Hexagon 698 | Spectra (input from up to 7 cameras) | LPDDR5 | Full 6DoF head and controller tracking, as well as hand and finger tracking | Wi-Fi 6E Bluetooth 5.2 5G | Q4 2022 |
| XR2 (Gen 2) | 4 nm (Samsung 4LPX) | 1x Kryo Prime (Cortex-X3, 2.36 GHz) + 2x Kryo Gold (Cortex-A715, 2.36 GHz) + 3x Kryo Silver (Cortex-A510, 2.05GHz) | Adreno 740 (up to 2x 3K displays at 90 Hz) | Hexagon | Spectra (input from up to 10 cameras) | LPDDR5X | | Wi-Fi 7 Bluetooth 5.3 5G | Q4 2023 |
| XR2+ (Gen 2) | 4 nm (Samsung 4LPX) | 1x Kryo Prime (Cortex-X3) + 2x Kryo Gold (Cortex-A715) + 3x Kryo Silver (Cortex-A510) | Adreno 740 (up to 2x 4.3K displays at 90 Hz) | Hexagon | Spectra (input from up to 12 cameras) | LPDDR5X | | Wi-Fi 7 Bluetooth 5.3 5G | Q1 2024 |

### Snapdragon AR series

The Qualcomm Snapdragon AR2 Gen 1 Platform was announced November 17, 2022. It is intended for use in smart glasses. On September 27, 2023 Qualcomm announced the Snapdragon AR1 Gen 1 Platform for slim and light AR glasses. It is designed to enable personal assistants, audio quality enhancement, visual search, and real-time translation using on-device AI acceleration. The platform supports binocular displays with up to 1280 x 1280 resolution for heads-up information and also content consumption. The new 14-bit ISP can capture 12MP photos and 6MP video recording & live-streaming. Head tracking is limited to 3DoF (three degrees of freedom).

## Gaming platforms
### Snapdragon G series

In December 2021, Qualcomm announced the Snapdragon G3x Gen 1 Gaming Platform.
    The Razer Edge is the first device to use the platform.
The G3x Gen 1 is based on the Snapdragon 888+ as it has the same motherboard code name (Lahaina), the same CPU clusters
    with higher clock speeds, and the same GPU with a higher clockspeed. Connectivity options also seem in line.
In August 2023, Qualcomm announced the Snapdragon G series platform designed for handheld gaming devices.
| Product name | Fab | CPU (Cores/Freq) | GPU | Modem | Connectivity | Display | Sampling availability |
| G1 (Gen 1) | Un­known | Kryo (8 core) | Adreno A11 | — | Wi-Fi 5, Bluetooth 5.0 | HD at 60 fps | Q4 2023 |
| G2 (Gen 1) | Un­known | Kryo (8 core) | Adreno A21 | X62 5G/LTE | Wi-Fi 6/6E, Bluetooth 5.0 | FHD+ up to 144 fps | Q4 2023 |
| G3x (Gen 1) | 5 nm (Samsung 5LPE) | 1x 3.0 GHz Kryo 680 Prime (Cortex-X1) + 3x 2.42 GHz Kryo 680 Gold (Cortex-A78) + 4x 1.80 GHz Kryo 680 Silver Cortex-A55) | Adreno 660 900 MHz (1382.4 GFLOPs in FP32) | X60 5G (5G NR Sub-6 & mmWave: download up to 7.5 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 0.316 Gbit/s) | FastConnect 6900; Bluetooth 5.2; 802.11ac/ax (Wi-Fi 6E) up to 3.6 Gbit/s | FHD+ up to 144 fps | Q1 2023 |
| G3x (Gen 2) | 4 nm (TSMC N4) | 1× 3.36 GHz Kryo Prime (Cortex-X3) + 4× 2.8 GHz Kryo Gold (2× Cortex-A715, 2× Cortex-A710) + 3× 2.02 GHz Kryo Silver (Cortex-A510) | Adreno A32 1000 MHz (3072 GFLOPS in FP32) | X70 5G (5G NR Sub-6 & mmWave: download up to 10 Gbit/s, upload up to 3.5 Gbit/s) | FastConnect 7800; Bluetooth 5.3; 802.11ac/ax/be (Wi-Fi 7) up to 5.8 Gbit/s | FHD+ up to 144 fps | Q4 2023 |

## Bluetooth SoC platforms

Following Qualcomm's acquisition of CSR in 2015, Qualcomm designs ultra-low-power Bluetooth SoCs under the CSR, QCA and QCC brands for wireless headphones and earbuds. Qualcomm has worked with both Amazon and Google on reference designs to help manufacturers develop headsets with support for Alexa, Google Assistant and Google Fast Pair. Qualcomm announced the QCC5100 Series at CES 2018.
On January 28, 2020, the QCC304x and QCC514x SoCs were published as Bluetooth 5.2 certified by the Bluetooth SIG. On the previous day Qualcomm published a blog post on LE Audio, referring to the QCC5100 series. On March 25, 2020, the BLE Audio QCC304x and QCC514x SoCs were officially announced.

### Qualcomm QCC300x Series Bluetooth audio SoCs

| Model number | CPU | DSP | Bluetooth | Technologies support | DAC output / Digital microphone input |
| QCC3001 | RISC application processor (Up to 80 MHz) | Single core Qualcomm Kalimba DSP (Up to 80 MHz) | Bluetooth 5.0 Dual-mode Bluetooth | TrueWireless Stereo cVc audio | Mono / 2-mic |
| QCC3002 | RISC application processor (Up to 80 MHz) | Single core Qualcomm Kalimba DSP (Up to 80 MHz) | Bluetooth 5.0 Dual-mode Bluetooth | TrueWireless Stereo aptX Classic/HD/LL cVc audio | Mono / 2-mic |
| QCC3003 | RISC application processor (Up to 80 MHz) | Single core Qualcomm Kalimba DSP (Up to 80 MHz) | Bluetooth 5.0 Dual-mode Bluetooth | cVc audio | Stereo / 1-mic |
| QCC3004 | RISC application processor (Up to 80 MHz) | Single core Qualcomm Kalimba DSP (Up to 80 MHz) | Bluetooth 5.0 Dual-mode Bluetooth | cVc audio | Stereo / 2-mic |
| QCC3005 | RISC application processor (Up to 80 MHz) | Single core Qualcomm Kalimba DSP (Up to 80 MHz) | Bluetooth 5.0 Dual-mode Bluetooth | aptX Classic/HD/LL cVc audio | Stereo / 2-mic |

### Qualcomm QCC30xx Series Bluetooth audio SoCs

| Model number | CPU | DSP | Bluetooth | Technologies support | Power consumption | DAC output / Digital microphone input | Digital assistant activation | Sampling availability |
| QCC3020 | Dual core 32-bit application processor (Up to 80 MHz) | Single core Qualcomm Kalimba DSP (Up to 120 MHz) | Bluetooth 5.0 Bluetooth Low Energy sensor hub, Dual-mode Bluetooth Bluetooth Speed: 2 Mbit/s | aptX Classic/HD/LL TrueWireless Stereo Plus cVc audio | ~6mA (2DP streaming) | Mono / 2-mic | Button press | H1 2017 |
| QCC3021 | Dual core 32-bit application processor (Up to 80 MHz) | Single core Qualcomm Kalimba DSP (Up to 120 MHz) | Bluetooth 5.0 Bluetooth Low Energy sensor hub, Dual-mode Bluetooth Bluetooth Speed: 2 Mbit/s | aptX Classic/HD/LL TrueWireless Stereo Plus cVc audio | ~6mA (2DP streaming) | Stereo / 1-mic | Button press | H1 2017 |
| QCC3024 | Dual core 32-bit application processor (Up to 80 MHz) | Single core Qualcomm Kalimba DSP (Up to 120 MHz) | Bluetooth 5.0 Bluetooth Low Energy sensor hub, Dual-mode Bluetooth Bluetooth Speed: 2 Mbit/s | cVc audio Google Fast Pair | ~6mA (2DP streaming) | Stereo / 2-mic | Button press | H1 2017 |
| QCC3026 | Dual core 32-bit application processor (Up to 80 MHz) | Single core Qualcomm Kalimba DSP (Up to 120 MHz) | Bluetooth 5.0 Bluetooth Low Energy sensor hub, Dual-mode Bluetooth Bluetooth Speed: 2 Mbit/s | aptX Classic/HD/LL TrueWireless Stereo Plus cVc audio | ~6mA (2DP streaming) | Mono / 2-mic | Button press | H1 2017 |
| QCC3031 | Dual core 32-bit application processor (Up to 80 MHz) | Single core Qualcomm Kalimba DSP (Up to 120 MHz) | Bluetooth 5.0 Bluetooth Low Energy sensor hub, Dual-mode Bluetooth Bluetooth Speed: 2 Mbit/s | aptX Classic/HD/LL TrueWireless Stereo Plus cVc audio | ~6mA (2DP streaming) | Stereo / 1-mic | Button press | H1 2017 |
| QCC3034 | Dual core 32-bit application processor (Up to 80 MHz) | Single core Qualcomm Kalimba DSP (Up to 120 MHz) | Bluetooth 5.0 Bluetooth Low Energy sensor hub, Dual-mode Bluetooth Bluetooth Speed: 2 Mbit/s | aptX Classic/HD/LL cVc audio Google Fast Pair | ~6mA (2DP streaming) | Mono / 2-mic | Button press | H1 2017 |
| QCC3040 | Dual core 32-bit application processor (Up to 80 MHz) | Single core Qualcomm Kalimba DSP (Up to 120 MHz) | Bluetooth 5.2 BLE Audio, Bluetooth Low Energy sensor hub, Bluetooth Low Energy, Dual-mode Bluetooth Bluetooth speed: 2 Mbit/s | aptX Classic/HD TrueWireless mirroring ANC (Feedforward/feedback and hybrid) cVc audio Google Fast Pair | <5 mA | Stereo / 2-mic | Button press | H1 2020 |
| QCC3046 | Dual core 32-bit application processor (Up to 80 MHz) | Single core Qualcomm Kalimba DSP (Up to 120 MHz) | Bluetooth 5.2 BLE Audio, Bluetooth Low Energy sensor hub, Bluetooth Low Energy, Dual-mode Bluetooth Bluetooth speed: 2 Mbit/s | aptX Classic/HD TrueWireless mirroring ANC (Feedforward/feedback and hybrid) cVc audio Google Fast Pair | <5 mA | Stereo / 2-mic | Button press | H1 2020 |

### Qualcomm QCC510x Series Bluetooth audio SoCs

| Model number | CPU | DSP | Bluetooth | Technologies support | Power consumption | Digital assistant activation | Sampling availability |
| QCC5120 | Dual core 32-bit application processor (Up to 80 MHz) | Dual core Qualcomm Kalimba DSP (Up to 120 MHz) | Bluetooth 5.0 Bluetooth Low Energy, Bluetooth Low Energy sensor hub, Dual-mode Bluetooth Bluetooth Speed: 2 Mbit/s | aptX Classic/HD/LL eXtension program TrueWireless Stereo Plus ANC (FeedForward/Feedback and Hybrid) cVc audio Google Fast Pair | ~6mA (2DP streaming) ~7mA HFP Narrow Band, 1 Digital MIC cVc | Button press Qualcomm Voice Activation | H1 2018 |
| QCC5121 | Dual core 32-bit application processor (Up to 80 MHz) | Dual core Qualcomm Kalimba DSP (Up to 120 MHz) | Bluetooth 5.0 Bluetooth Low Energy, Bluetooth Low Energy sensor hub, Dual-mode Bluetooth Bluetooth Speed: 2 Mbit/s | aptX Classic/HD/LL eXtension program TrueWireless Stereo Plus ANC (FeedForward/Feedback and Hybrid) cVc audio Google Fast Pair | ~6mA (2DP streaming) ~7mA HFP Narrow Band, 1 Digital MIC cVc | Button press Qualcomm Voice Activation | H1 2018 |
| QCC5124 | Dual core 32-bit application processor (Up to 80 MHz) | Dual core Qualcomm Kalimba DSP (Up to 120 MHz) | Bluetooth 5.0 Bluetooth Low Energy, Bluetooth Low Energy sensor hub, Dual-mode Bluetooth Bluetooth Speed: 2 Mbit/s | aptX Classic/HD/LL eXtension program TrueWireless Stereo Plus ANC (FeedForward/Feedback and Hybrid) cVc audio Google Fast Pair | ~6mA (2DP streaming) ~7mA HFP Narrow Band, 1 Digital MIC cVc | Button press Qualcomm Voice Activation | H1 2018 |
| QCC5125 | Dual core 32-bit application processor (Up to 80 MHz) | Single core Qualcomm Kalimba DSP (Up to 120 MHz) | Bluetooth 5.0 Bluetooth Low Energy, Bluetooth Low Energy sensor hub, Dual-mode Bluetooth Bluetooth Speed: 2 Mbit/s | aptX Classic/HD/LL eXtension program TrueWireless Stereo Plus ANC (FeedForward/Feedback) cVc audio Google Fast Pair | ~10mA (2DP streaming) ~10mA HFP Narrow Band, 1 Digital MIC cVc | Button press | H1 2018 |
| QCC5141 | Dual core 32-bit application processor (Up to 80 MHz) | Dual core Qualcomm Kalimba DSP (Up to 120 MHz) | Bluetooth 5.2 BLE Audio, Bluetooth Low Energy sensor hub, Bluetooth Low Energy, Dual-mode Bluetooth Speed: 2 Mbit/s | aptX Adaptive eXtension program TrueWireless Mirroring ANC (FeedForward/Feedback) cVc audio Google Fast Pair | ~5mA A2DP stream | Button press Qualcomm Voice Activation | H1 2020 |
| QCC5144 | Dual core 32-bit application processor (Up to 80 MHz) | Dual core Qualcomm Kalimba DSP (Up to 120 MHz) | Bluetooth 5.2 BLE Audio, Bluetooth Low Energy sensor hub, Bluetooth Low Energy, Dual-mode Bluetooth Speed: 2 Mbit/s | aptX Adaptive eXtension program TrueWireless Mirroring ANC (FeedForward/Feedback) cVc audio Google Fast Pair | ~5mA A2DP stream | Button press Qualcomm Voice Activation | H1 2020 |