# List of Intel manufacturing sites

Intel is an American multinational corporation and technology company headquartered in Santa Clara, California. Processors are manufactured in semiconductor fabrication plants called "fabs" which are then sent to assembly and testing sites before delivery to customers. Intel has stated that approximately 75% of their semiconductor fabrication is performed in the United States.
Since May 1990, Intel has made an effort to eliminate chlorofluorocarbon consumption for the Oregon, Puerto Rico and Ireland system factories.
Both Schumacher a division of Air Products & Chemicals and Intel developed chemical that reduce ozone emission using TRANS-LC or trans 1, 2-dichloroethylene to replace from TCA or 1,1,1-Trichloroethane to grow defect free silicon oxide surfaces.
The Oregon Governor's Award for Toxics Use Reduction recognising Intel's Hillsboro facility achievement in reducing the use of toxic substance and generation of hazardous wastes.

## Current fab sites

| Fab name | Fab location | Production start year | Process (wafer, node) |
| AFO | Aloha, Oregon, U.S. | 1976 | 300mm, Development |
| D1B | Hillsboro, Oregon, U.S. | 1996 | 300mm, Development |
| RB1 | Hillsboro, Oregon, U.S. | 2001 | 300mm, Development |
| D1C | Hillsboro, Oregon, U.S. | 2001 | 300mm, Development |
| RP1 | Hillsboro, Oregon, U.S. | 2001 | 300mm, Research |
| D1D | Hillsboro, Oregon, U.S. | 2003 | 300mm, Development |
| D1X | Hillsboro, Oregon, U.S. | 2013 | 300mm, Development |
| Fab 11X | Rio Rancho, New Mexico, U.S. | 1995 upgrade 2020/2021 with 22/14 | 300mm, 45 nm/32 nm, Packaging |
| Fab 12 | Chandler, Arizona, U.S. | 2006 | 300mm, 22 nm/14 nm/10 nm |
| Fab 22 | Chandler, Arizona, U.S. | 2002 | 300mm, 22 nm/14 nm/10 nm |
| Fab 24 | Leixlip, Ireland | 2006 | 300mm, 14 nm |
| Fab 28a | Kiryat Gat, Israel | 1996 | 300mm, 22 nm |
| Fab 28 | Kiryat Gat, Israel | (2023) | 300mm, 22nm/14nm/10nm |
| Fab 38 | Kiryat Gat, Israel | (2024) | 300mm, 22 nm |
| Fab 32 | Chandler, Arizona, U.S. | 2007 | 300mm, 22 nm/14 nm/10 nm |
| Fab 34 | Leixlip, Ireland | 2023 | 300mm, Intel 4 (previously node 7nm) |
| Fab 42 | Chandler, Arizona, U.S. | 2020 | 300mm, 10 nm/5 nm (2024) |
| Fab 52 | Chandler, Arizona, U.S. | (2024) | 300mm, 18A |
| Fab 62 | Chandler, Arizona, U.S. | (2024) | 300mm |
| Fab 27 | Licking County, Ohio, U.S. | (2030–2032) | 300mm, 14A |
| SC2 | Santa Clara, California, U.S. | | Reticle/Masks, Intel Mask Operations |
| Pelican | Penang, Malaysia | (2024) | 300mm, Packaging |
| Fab 29 | Magdeburg, Saxony-Anhalt, Germany | (2027) | |
| | Poland | (2025–2027) | 300mm, Packaging |

## Past fab sites

| Fab name | Fab location | Opened | Closed | Notes |
| Fab 1 | Mountain View, California, U.S. | 1968 | 1981 | Formerly located at 365 East Middlefield Road. |
| Fab 2 | Santa Clara, California, U.S. | 1968 | 2009 | Located in building SC1, at the corner of Bowers Ave. and Central Expressway |
| Fab 1A | Santa Clara, California, U.S. | 1980 | 1991 | Located on Mission College Boulevard |
| Fab 3 | Livermore, California, U.S. | 1973 | 1991 | Plant began making wafers in April 1973. First plant outside of the Santa Clara area, and is where the famous Bunny Suits were first introduced. Located on North Mines Road. |
| Fab 4 | Aloha, Oregon, U.S. | 1976 | 1996 (decommissioned) 2016 (demolished) | First wafer manufacturing plant outside of Silicon Valley and first facility in what is now known as Oregon's Silicon Forest. Production began for 3-inch wafers. |
| Fab 5 / D1 | Aloha, Oregon, U.S. | | | Previously a development facility, then production facility. Currently inactive. |
| Fab 6 | Chandler, Arizona, U.S. | 1980 | 2000 | First silicon wafer manufacturing facility in Arizona. Key architecture was the 286 microprocessor. |
| Fab 7 | Rio Rancho, New Mexico, U.S. | 1980 | 2002 2005 (converted to test facility) | Production focused on flash memory chips. By the time production stopped, plant was producing 0.35 micron-6 inch wafers. In 2005, $105 million was invested to temporarily turn Fab 7 into a testing facility. |
| Fab 8 | Jerusalem, Israel | 1985 | 2008 2009 (converted to die prep facility) | First Fab outside of the United States. Ended production with, what was at the time, the last 6-inch wafer fab. Building was converted into die prep facility to support nearby Fab 28. |
| Fab 9 | Rio Rancho, New Mexico, U.S. | 1987 | | Facility eventually expanded to merge with Fab 11 in 1999. |
| D2 | Santa Clara, California, U.S. | 1989 | 2009 (decommissioned) | Development for these EPROM, Flash memory and microcontroller technology. They expanded this location which was previously used for research and development. They were manufactured by using the eight-inch wafers. They have expanded up to 300,000 square foot complex and adding the 12,000 square feet of "Class-1" clean room bringing up to total of 37,000 square feet. After being decommissioned, was converted into a data center. |
| Fab 10 / IFO | Leixlip, Ireland | 1993 | | Pentium |
| Fab 11 | Rio Rancho, New Mexico, U.S. | | | (Merged into F11X) |
| Fab 14 | Leixlip, Ireland | | | |
| Fab 15 / D1A | Aloha, Oregon, U.S. | | 2003 (converted to assembly / test) | Previously a development Fab named D1A before construction began on D1B in 1994. |
| Fab 16 | Ft. Worth, Texas, U.S. | (never opened) | 2003 (canceled) | Planned to open in Ft. Worth, Texas, in 1999, but was eventually canceled in 2003. |
| Fab 17 | Hudson, Massachusetts, U.S. | 1998 (acquired from DEC) | 2014 | Facility used older technology and closed (along with Fab 11X) because site was not large enough to accommodate a leading-edge fab. Made specialty products on the trailing edge of chip technology, and was last to make chips on 200-millimeter silicon wafers. |
| Fab 20 / D1B | , Hillsboro, Oregon, U.S. | | | |
| Fab 23 | Colorado Springs, Colorado, U.S. | 2000 (acquired from Rockwell) | 2007 | Site originally purchased from Rockwell, but due to lack of demand and for financial reasons, Intel put it up for sale in 2007. It eventually sold in 2011 to the El Paso County government, who repurposed the offices. |
| Fab 68 | Dalian, Liaoning, China | 2010/2016 | 2021 | 3DNAND, 3DXPoint fab that was sold to SK Hynix |

## Assembly and test sites

* AFO, Aloha, Oregon, United States
* Chandler, Arizona, United States
* CD1, Chengdu, Sichuan, China
* CD6, Chengdu, Sichuan, China
* KMDSDP, Kulim, Malaysia
* KMO, Kulim, Malaysia
* KM5, Kulim, Malaysia
* PG8, Penang, Malaysia
* VNAT, Ho Chi Minh City, Vietnam
* Jerusalem, Israel
* CRAT, Heredia, Belén, Costa Rica (1997–2014; 2020 – present)
* Makati, Philippines – MN1-MN5 also known as A2/T11 (1974–2009)
* Cavite, Philippines – CV1-CV4 (1997–2009)
* Shanghai, China (former Assembly / Test Manufacturing)
* Las Piedras Puerto Rico 1991-2001 (assemble Pentium CPU/Motherboards)
* Wroclaw/Walbrzych, Poland - planned 2027 (former Assembly / Test Manufacturing)