# List of Intel Core processors

The following is a list of Intel Core processors. This includes Intel's original Core (Solo/Duo) mobile series based on the Enhanced Pentium M microarchitecture, as well as its Core 2- (Solo/Duo/Quad/Extreme), Core i3-, Core i5-, Core i7-, Core i9-, Core M- (m3/m5/m7/m9), Core 3-, Core 5-, and Core 7- Core 9-, branded processors.

## Desktop processors

Release timelineDesktop processors :
| 2008 | Nehalem microarchitecture (1st generation) |
| 2009 |
| 2010 | Westmere microarchitecture (1st generation) |
| 2011 | Sandy Bridge microarchitecture (2nd generation) |
| 2012 | Ivy Bridge microarchitecture (3rd generation) |
| 2013 | Haswell microarchitecture (4th generation) |
| 2014 |
| 2015 | Broadwell microarchitecture (5th generation) |
| 2015 | Skylake microarchitecture (6th generation) |
| 2016 |
| 2017 | Kaby Lake microarchitecture (7th generation) |
| 2017 | Coffee Lake microarchitecture (8th generation) |
| 2018 |
| 2019 |
| 2020 | Comet Lake microarchitecture (10th generation) |
| 2021 | Rocket Lake (11th generation) |
| 2022 | Alder Lake (12th generation) |
| 2023 | Raptor Lake (13th generation) |
| 2023 | Raptor Lake (14th generation) |
| 2024 | Lunar Lake (15th generation) |
| 2024 | Arrow Lake (15th generation) |

### Core 2
#### "Allendale" (65 nm, 800 MT/s)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)
* Die size: 111 mm$^2$
* Steppings: L2, M0, G0
| Model | sSpec number | Cores | Clock rate | L2 cache | FSB | Mult. | Voltage | TDP | Socket | Release date | Part number(s) | Release price (USD) |
| Core 2 Duo E4300 | SL9TB (L2) SLA99 (M0) SLA5G | 2 | 1.8 GHz | 2 MB | 800 MT/s | 9× | 0.85–1.5 V | 65 W | LGA 775 | January 2007 | HH80557PG0332M BX80557E4300 | $163 |
| Core 2 Duo E4400 | SLA3F (L2) SLA98 (M0) SLA5F | 2 | 2 GHz | 2 MB | 800 MT/s | 10× | 0.85–1.5 V | 65 W | LGA 775 | April 2007 | HH80557PG0412M BX80557E4400 | $133 |
| Core 2 Duo E4500 | SLA95 (M0) | 2 | 2.2 GHz | 2 MB | 800 MT/s | 11× | 0.85–1.5 V | 65 W | LGA 775 | July 2007 | HH80557PG0492M BX80557E4500 | $133 |
| Core 2 Duo E4600 | SLA94 (M0) | 2 | 2.4 GHz | 2 MB | 800 MT/s | 12× | 1.162–1.312 V | 65 W | LGA 775 | October 2007 | HH80557PG0562M BX80557E4600 | $133 |
| Core 2 Duo E4700 | SLALT (G0) | 2 | 2.6 GHz | 2 MB | 800 MT/s | 13× | 1.162–1.312 V | 65 W | LGA 775 | March 2008 | HH80557PG0642M BX80557E4700 | $133 |
^c Note: The M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W.
^d Note: The E4700 uses G0 Stepping which makes it a Conroe CPU.

#### "Conroe" (65 nm, 1066 MT/s)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)
* All models support: Intel VT-x
* Die size: 143 mm$^2$
* Steppings: B2, G0
| Model | sSpec number | Cores | Clock rate | L2 cache | FSB | Mult. | Voltage | TDP | Socket | Release date | Part number(s) | Release price (USD) |
| Core 2 Duo E6300 | SL9SA (B2) SL9TA (L2) SLA2L (?) SLA5E (?) | 2 | 1.87 GHz | 2 MB | 1066 MT/s | 7× | 0.85–1.5 V | 65 W | LGA 775 | July 2006 | HH80557PH0362M BX80557E6300 BX80557E6300T2 | $183 |
| Core 2 Duo E6320 | SLA4U (B2) | 2 | 1.87 GHz | 4 MB | 1066 MT/s | 7× | 0.85–1.5 V | 65 W | LGA 775 | April 2007 | HH80557PH0364M BX80557E6320 | $163 |
| Core 2 Duo E6400 | SL9S9 (B2) SLA5D (?) SL9T9 (L2) SLA97 (M0) | 2 | 2.13 GHz | 2 MB | 1066 MT/s | 8× | 0.85–1.5 V | 65 W | LGA 775 | July 2006 | HH80557PH0462M BX80557E6400 | $224 |
| Core 2 Duo E6420 | SLA4T (B2) | 2 | 2.13 GHz | 4 MB | 1066 MT/s | 8× | 0.85–1.5 V | 65 W | LGA 775 | April 2007 | HH80557PH0464M BX80557E6420 | $183 |
| Core 2 Duo E6600 | SL9S8 (B2) SL9ZL (B2) | 2 | 2.4 GHz | 4 MB | 1066 MT/s | 9× | 0.85–1.5 V | 65 W | LGA 775 | July 2006 | HH80557PH0564M BX80557E6600 | $316 |
| Core 2 Duo E6700 | SL9S7 (B2) SL9ZF (B2) | 2 | 2.67 GHz | 4 MB | 1066 MT/s | 10× | 0.85–1.5 V | 65 W | LGA 775 | July 2006 | HH80557PH0674M BX80557E6700 | $530 |
^a Note: of the E6000 series processors, only models E6550, E6750, and E6850 support Intel's Trusted Execution Technology (TXT).
^b Note: The L2 Stepping, and models with sSpec SL9ZL, SL9ZF, SLA4U, SLA4T, have better optimizations to lower idle power consumption from 22W to 12W.
^c Note: The M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W.

#### "Conroe" (65 nm, 1333 MT/s)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)
* All models support: Intel VT-x
* All E6x50 models support: Intel VT-x, Trusted Execution Technology (TXT)
* Die size: 143 mm$^2$
* Transistor count: 291 million
* Steppings: B2, G0
| Model | sSpec number | Cores | Clock rate | L2 cache | FSB | Mult. | Voltage | TDP | Socket | Release date | Part number(s) | Release price (USD) |
| Core 2 Duo E6540 | SLAA5 (G0) | 2 | 2.33 GHz | 4 MB | 1333 MT/s | 7× | 0.85–1.5 V | 65 W | LGA 775 | July 2007 | HH80557PJ0534M | $163 |
| Core 2 Duo E6550 | SLA9X (G0) SLAAT (?) | 2 | 2.33 GHz | 4 MB | 1333 MT/s | 7× | 0.85–1.5 V | 65 W | LGA 775 | July 2007 | HH80557PJ0534MG BX80557E6550 BX80557E6550R | $163 |
| Core 2 Duo E6750 | SLA9V (G0) SLAAR (?) | 2 | 2.67 GHz | 4 MB | 1333 MT/s | 8× | 0.85–1.5 V | 65 W | LGA 775 | July 2007 | HH80557PJ0674MG BX80557E6750 BX80557E6750R | $183 |
| Core 2 Duo E6850 | SLA9U (G0) | 2 | 3 GHz | 4 MB | 1333 MT/s | 9× | 0.85–1.5 V | 65 W | LGA 775 | July 2007 | HH80557PJ0804MG BX80557E6850 | $266 |
^a Note: of the E6000 series processors, only models E6550, E6750, and E6850 support Intel's Trusted Execution Technology (TXT).
^b Note: The L2 Stepping, and models with sSpec SL9ZL, SL9ZF, SLA4U, SLA4T, have better optimizations to lower idle power consumption from 22W to 12W.
^c Note: The M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W.

#### "Conroe-CL" (65 nm, 1066 MT/s)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
* Die size: 111 mm$^2$ (Conroe)
* Steppings: ?
| Model | sSpec number | Cores | Clock rate | L2 cache | FSB | Mult. | Voltage | TDP | Socket | Release date | Part number(s) | Release price (USD) |
| Core 2 Duo E6305 | SLAGF | 2 | 1.87 GHz | 2 MB | 1066 MT/s | 7× | | 65 W | LGA 771 | | HH80557KH036F | |
| Core 2 Duo E6405 | SLAGG | 2 | 2.13 GHz | 2 MB | 1066 MT/s | 8× | | 65 W | LGA 771 | | HH80557KH046F | |

#### "Conroe XE" (65 nm)

These models feature an unlocked clock multiplier
* All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
* Die size: 143 mm$^2$
* Steppings: B1, B2
* The X6900 was never publicly released.
| Model | sSpec number | Cores | Clock rate | L2 cache | FSB | Mult. | Voltage | TDP | Socket | Release date | Part number(s) | Release price (USD) |
| Core 2 Extreme X6800 | SL9S5 (B2) QPHV (B1) | 2 | 2.93 GHz | 4 MB | 1066 MT/s | 11× | 0.85–1.5 V | 75 W | LGA 775 | July 2006 | HH80557PH0677M BX80557X6800 | $999 |
| Core 2 Extreme X6900 | QTOM (B2) SL9S4 (B2) | 2 | 3.2 GHz | 4 MB | 1066 MT/s | 12× | 0.85–1.5 V | 75 W | LGA 775 | N/A | HH80557PH0884M | N/A |

#### "Kentsfield" (65 nm)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x
* Die size: 2 ×143 mm$^2$
* Steppings: B3, G0
| Model | sSpec number | Cores | Clock rate | L2 cache | FSB | Mult. | Voltage | TDP | Socket | Release date | Part number(s) | Release price (USD) |
| Core 2 Quad Q6400 | SL9UN (B3) | 4 | 2.13 GHz | 2 × 4 MB | 1066 MT/s | 8× | 0.8500–1.500 V | 105 W | LGA 775 | | HH80562PH0468M | OEM |
| Core 2 Quad Q6600 | SL9UM (B3) SLACR (G0) | 4 | 2.4 GHz | 2 × 4 MB | 1066 MT/s | 9× | 0.8500–1.500 V | 105 W 95 W | LGA 775 | January 2007 | HH80562PH0568M BX80562Q6600 BXC80562Q6600 | $851 |
| Core 2 Quad Q6700 | SLACQ (G0) | 4 | 2.67 GHz | 2 × 4 MB | 1066 MT/s | 10× | 0.8500–1.500 V | 95 W | LGA 775 | July 2007 | HH80562PH0678M BX80562Q6700 BXC80562Q6700 | $530 |

#### "Kentsfield XE" (65 nm)

These models feature an unlocked clock multiplier
* All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x
* Die size: 2 ×143 mm$^2$
* Steppings: B3, G0
| Model | sSpec number | Cores | Clock rate | L2 cache | FSB | Mult. | Voltage | TDP | Socket | Release date | Part number(s) | Release price (USD) |
| Core 2 Extreme QX6700 | SL9UL (B3) | 4 | 2.67 GHz | 2 × 4 MB | 1066 MT/s | 10× | 0.8500–1.500 V | 130 W | LGA 775 | November 2006 | HH80562PH0678M | $999 |
| Core 2 Extreme QX6800 | SL9UK (B3) SLACP (G0) | 4 | 2.93 GHz | 2 × 4 MB | 1066 MT/s | 11× | 0.8500–1.500 V | 130 W | LGA 775 | April 2007 | HH80562PH0778M HH80562XH0778M | $1199 |
| Core 2 Extreme QX6850 | SLAFN (G0) | 4 | 3 GHz | 2 × 4 MB | 1333 MT/s | 9× | 0.8500–1.500 V | 130 W | LGA 775 | July 2007 | HH80562XJ0808M | $999 |

#### "Wolfdale-3M" (45 nm, 1066 MT/s)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)
* Die size: 82 mm$^2$
* Transistor Count: 230 million
* Steppings: M0, R0
* Models with a part number ending in "ML" instead of "M" support Intel VT-x
| Model | sSpec number | Cores | Clock rate | L2 cache | FSB | Mult. | Voltage | TDP | Socket | Release date | Part number(s) | Release price (USD) |
| Core 2 Duo E7200 | SLAPC (M0) SLAVN (M0) SLB9W (?) | 2 | 2.53 GHz | 3 MB | 1066 MT/s | 9.5× | 0.85–1.3625 V | 65 W | LGA 775 | April 2008 | EU80571PH0613M BX80571E7200 | $133 |
| Core 2 Duo E7300 | SLAPB (M0) SLB9X (R0) SLGA9 (R0) | 2 | 2.67 GHz | 3 MB | 1066 MT/s | 10× | 0.85–1.3625 V | 65 W | LGA 775 | August 2008 | EU80571PH0673M AT80571PH0673M BX80571E7300 | $133 |
| Core 2 Duo E7400 | SLB9Y (R0) SLGQ8 (R0) SLGW3 (R0, with VT) | 2 | 2.8 GHz | 3 MB | 1066 MT/s | 10.5× | 0.85–1.3625 V | 65 W | LGA 775 | October 2008 | AT80571PH0723M AT80571PH0723ML BX80571E7400 | $133 |
| Core 2 Duo E7500 | SLB9Z (R0) SLGTE (R0, with VT) | 2 | 2.93 GHz | 3 MB | 1066 MT/s | 11× | 0.85–1.3625 V | 65 W | LGA 775 | January 2009 | AT80571PH0773M AT80571PH0773ML BX80571E7500 | $133 |
| Core 2 Duo E7600 | SLGTD (R0, with VT) | 2 | 3.07 GHz | 3 MB | 1066 MT/s | 11.5× | 0.85–1.3625 V | 65 W | LGA 775 | May 2009 | AT80571PH0833ML BX80571E7600 | $133 |

#### "Wolfdale" (45 nm, 1333 MT/s)

* All models(except E8190) support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), iAMT2 (Intel Active Management Technology), Intel VT-x, Intel VT-d, Trusted Execution Technology (TXT)
* Die size: 107 mm$^2$
* Transistor Count: 410 million
* Steppings: C0, E0
| Model | sSpec number | Cores | Clock rate | L2 cache | FSB | Mult. | Voltage | TDP | Socket | Release date | Part number(s) | Release price (USD) |
| Core 2 Duo E8190 | SLAQR (C0) | 2 | 2.67 GHz | 6 MB | 1333 MT/s | 8× | 0.85–1.3625 V | 65 W | LGA 775 | January 2008 | EU80570PJ0676MN | $163 |
| Core 2 Duo E8200 | SLAPP (C0) | 2 | 2.67 GHz | 6 MB | 1333 MT/s | 8× | 0.85–1.3625 V | 65 W | LGA 775 | January 2008 | EU80570PJ0676M BX80570E8200 | $163 |
| Core 2 Duo E8290 | SLAQQ (?) | 2 | 2.83 GHz | 6 MB | 1333 MT/s | 8.5× | 0.85–1.3625 V | 65 W | LGA 775 | ? | EU80570PJ0736MN | ? |
| Core 2 Duo E8300 | SLAPJ (C0) SLAPN (C0) | 2 | 2.83 GHz | 6 MB | 1333 MT/s | 8.5× | 0.85–1.3625 V | 65 W | LGA 775 | April 2008 | EU80570AJ0736M EU80570PJ0736M | $163 |
| Core 2 Duo E8400 | SLAPL (C0) SLB9J (E0) | 2 | 3 GHz | 6 MB | 1333 MT/s | 9× | 0.85–1.3625 V | 65 W | LGA 775 | January 2008 | EU80570PJ0806M AT80570PJ0806M BX80570E8400 | $183 |
| Core 2 Duo E8500 | SLAPK (C0) SLB9K (E0) | 2 | 3.17 GHz | 6 MB | 1333 MT/s | 9.5× | 0.85–1.3625 V | 65 W | LGA 775 | January 2008 | EU80570PJ0876M AT80570PJ0876M BX80570E8500 | $266 |
| Core 2 Duo E8600 | SLB9L (E0) | 2 | 3.33 GHz | 6 MB | 1333 MT/s | 10× | 0.85–1.3625 V | 65 W | LGA 775 | August 2008 | AT80570PJ0876M BX80570E8600 | $266 |
| Core 2 Duo E8700 | SLB9E (E0) | 2 | 3.5 GHz | 6 MB | 1333 MT/s | 10.5× | 0.85–1.3625 V | 65 W | LGA 775 | January 2009* | AT80570PJ1006M(OEM) | NA |
$^a$ Note: The E8190 and E8290 do not support Intel VT-d.
Note 2: E8700 is a very rare example in Intel's history where a model was yanked from Intel ARK without a recall notice and after a SSPEC was assigned. Working examples were seen, believed to have been released to OEM, but none was offered in retail PCs.
See also: Versions of the same Wolfdale core in an LGA 771 are available under the Dual-Core Xeon brand.

#### "Yorkfield-6M" (45 nm)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Intel VT-d, Trusted Execution Technology (TXT)
* Die size: 2 × 82 mm$^2$
* Steppings: M0, M1, R0
* All Q8xxx models are Yorkfield-6M MCMs with only 2 × 2 MB L2 cache enabled.
| Model | sSpec number | Cores | Clock rate | L2 cache | FSB | Mult. | Voltage | TDP | Socket | Release date | Part number(s) | Release price (USD) |
| Core 2 Quad Q8200 | SLB5M (M1) SLG9S (R0) | 4 | 2.33 GHz | 2 × 2 MB | 1333 MT/s | 7× | 0.85–1.3625 V | 95 W | LGA 775 | August 2008 | EU80580PJ0534MN AT80580PJ0534MN | $224 |
| Core 2 Quad Q8200S | SLG9T (R0) SLGSS (R0, with Intel VT-x) | 4 | 2.33 GHz | 2 × 2 MB | 1333 MT/s | 7× | 0.85–1.3625 V | 65 W | LGA 775 | January 2009 | AT80580AJ0534MN AT80580AJ0534ML | $245 |
| Core 2 Quad Q8300 | SLB5W (R0) SLGUR (R0, with Intel VT-x) | 4 | 2.5 GHz | 2 × 2 MB | 1333 MT/s | 7.5× | 0.85–1.3625 V | 95 W | LGA 775 | November 2008 | AT80580PJ0604MN AT80580PJ0604ML | $224 |
| Core 2 Quad Q8400 | SLGT6 (R0, with Intel VT-x) | 4 | 2.67 GHz | 2 × 2 MB | 1333 MT/s | 8× | 0.85–1.3625 V | 95 W | LGA 775 | April 2009 | AT80580PJ0674ML | $183 |
| Core 2 Quad Q8400S | SLGT7 (R0, with Intel VT-x) | 4 | 2.67 GHz | 2 × 2 MB | 1333 MT/s | 8× | 0.85–1.3625 V | 65 W | LGA 775 | April 2009 | AT80580AJ0674ML | $245 |
| Core 2 Quad Q9300 | SLAMX (M0) SLAWE (M1) | 4 | 2.5 GHz | 2 × 3 MB | 1333 MT/s | 7.5× | 0.85–1.3625 V | 95 W | LGA 775 | March 2008 | EU80580PJ0606M | $266 |
| Core 2 Quad Q9400 | SLB6B (R0) | 4 | 2.67 GHz | 2 × 3 MB | 1333 MT/s | 8× | 0.85–1.3625 V | 95 W | LGA 775 | August 2008 | AT80580PJ0676M | $266 |
| Core 2 Quad Q9400S | SLG9U (R0) | 4 | 2.67 GHz | 2 × 3 MB | 1333 MT/s | 8× | 0.85–1.3625 V | 65 W | LGA 775 | January 2009 | AT80580AJ0676M | $320 |
| Core 2 Quad Q9500 | SLGZ4 (R0) | 4 | 2.83 GHz | 2 × 3 MB | 1333 MT/s | 8.5× | 0.85–1.3625 V | 95 W | LGA 775 | January 2010 | AT80580PJ0736ML | $183 |
| Core 2 Quad Q9505 | SLGYY (R0) | 4 | 2.83 GHz | 2 × 3 MB | 1333 MT/s | 8.5× | 0.85–1.3625 V | 95 W | LGA 775 | August 2009 | AT80580PJ0736MG | $213 |
| Core 2 Quad Q9505S | SLGYZ (R0) | 4 | 2.83 GHz | 2 × 3 MB | 1333 MT/s | 8.5× | 0.85–1.3625 V | 65 W | LGA 775 | August 2009 | AT80580AJ0736MG | $277 |
$^a$ Note: Q8200, Q8200S, Q8300 SLB5W does not support Intel VT-x.
$^b$ Note: Q8200, Q8200S, Q8300, Q8400, Q8400S, Q9500 does not support Intel VT-d.
$^c$ Note: Q8200, Q8200S, Q8300, Q8400, Q8400S does not support TXT.

#### Yorkfield (45 nm)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Intel VT-d, Trusted Execution Technology (TXT)
* Die size: 2 × 107 mm$^2$
* The "S" suffix denotes to low power consumption specs with 65W TDP, equivalent to that of a standard Core 2 Duo. Supplied to OEM channels only and mostly seen as options for SFF platforms. The first batch of Q9550S has no "S" marking on lid, thus only differentiated by SSPEC.
* Steppings: C0, C1, E0
| Model | sSpec number | Cores | Clock rate | L2 cache | FSB | Mult. | Voltage | TDP | Socket | Release date | Part number(s) | Release price (USD) |
| Core 2 Quad Q9450 | SLAN6 (C0) SLAWR (C1) | 4 | 2.67 GHz | 2 × 6 MB | 1333 MT/s | 8× | 0.85–1.3625 V | 95 W | LGA 775 | March 2008 | EU80569PJ067N | $316 |
| Core 2 Quad Q9550 | SLAN4 (C0) SLAWQ (C1) SLB8V (E0) | 4 | 2.83 GHz | 2 × 6 MB | 1333 MT/s | 8.5× | 0.85–1.3625 V | 95 W | LGA 775 | March 2008 | EU80569PJ073N AT80569PJ073N | $530 |
| Core 2 Quad Q9550S* | SLGAE (E0) | 4 | 2.83 GHz | 2 × 6 MB | 1333 MT/s | 8.5× | 0.85–1.3625 V | 65 W | LGA 775 | January 2009 | AT80569AJ073N | $369 |
| Core 2 Quad Q9650 | SLB8W (E0) | 4 | 3 GHz | 2 × 6 MB | 1333 MT/s | 9× | 0.85–1.3625 V | 95 W | LGA 775 | August 2008 | AT80569PJ080N BX80569Q9650 | $530 |

#### "Yorkfield XE" (45 nm)

* These models feature an unlocked clock multiplier
* All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x
* I/O Acceleration Technology (Intel I/OAT) supported by: QX9775
* Intel VT-d supported by: QX9650
* Die size: 2 × 107 mm$^2$
* Steppings: C0, C1, E0
* The QX9750 was never publicly released. Engineering samples have surfaced along with claims that Intel gave them away to employees sometime in 2009.
| Model | sSpec number | Cores | Clock rate | L2 cache | FSB | Mult. | Voltage | TDP | Socket | Release date | Part number(s) | Release price (USD) |
| Core 2 Extreme QX9650 | SLAN3 (C0) SLAWN (C1) | 4 | 3 GHz | 2 × 6 MB | 1333 MT/s | 9× | 0.85–1.3625 V | 130 W | LGA 775 | November 2007 | EU80569XJ080NL BX80569QX9650 | $999 |
| Core 2 Extreme QX9750 | QJEE (E0) SLBBU (E0) | 4 | 3.17 GHz | 2 × 6 MB | 1333 MT/s | 9.5× | 0.85–1.3625 V | 130 W | LGA 775 | N/A | AT80569XL087NL | N/A |
| Core 2 Extreme QX9770 | SLAN2 (C0) SLAWM (C1) | 4 | 3.2 GHz | 2 × 6 MB | 1600 MT/s | 8× | 0.85–1.3625 V | 136 W | LGA 775 | March 2008 | EU80569XL088NL BX80569QX9770 | $1399 |
| Core 2 Extreme QX9775 | SLANY (C0) | 4 | 3.2 GHz | 2 × 6 MB | 1600 MT/s | 8× | 0.85–1.35 V | 150 W | LGA 771 | March 2008 | EU80574XL088N BX80574QX9775 | $1499 |

### Core i (1st gen)
#### Lynnfield

Common features:
* Socket: LGA 1156.
* All the CPUs support dual-channel DDR3 RAM at up to 1333 MT/s speed.
* All CPU models provide 16 lanes of PCIe 2.0.
* All CPUs feature a DMI 1.0 bus to the chipset (PCH).
* No integrated graphics.
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 45 nm.
* K-suffix processors have an unlocked multiplier and can be overclocked.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Smart Cache | TDP | Release date | MSRP |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Smart Cache | TDP | Release date | MSRP |
| Core i7 | 880 | 4 (8) | 3.06 | 3.73 | 8 MB | 95 W | May 2010 | US $583 |
| Core i7 | 875K | 4 (8) | 2.93 | 3.60 | 8 MB | 95 W | May 2010 | US $342 |
| Core i7 | 870 | 4 (8) | 2.93 | 3.60 | 8 MB | 95 W | September 2009 | US $562 |
| Core i7 | 870S | 4 (8) | 2.67 | 3.60 | 8 MB | 82 W | July 2010 | US $351 |
| Core i7 | 860 | 4 (8) | 2.80 | 3.46 | 8 MB | 95 W | September 2009 | US $284 |
| Core i7 | 860S | 4 (8) | 2.53 | 3.46 | 8 MB | 82 W | January 2010 | US $337 |
| Core i5 | 760 | 4 (4) | 2.80 | 3.33 | 8 MB | 95 W | July 2010 | US $205 |
| Core i5 | 750 | 4 (4) | 2.66 | 3.20 | 8 MB | 95 W | September 2009 | US $196 |
| Core i5 | 750S | 4 (4) | 2.40 | 3.20 | 8 MB | 82 W | January 2010 | US $259 |

#### Bloomfield

Common features:
* Socket: LGA 1366.
* All the CPUs support triple-channel DDR3 RAM, at up to 1066 MT/s speed.
* PCIe lanes are provided by the northbridge on the motherboard rather than by the CPU.
* All CPUs feature a QPI bus to the chipset (northbridge).
** Bus speed is 4.8 GT/s on all the processors except for the Extreme Edition models, which run at 6.4 GT/s.
* No integrated graphics.
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 45 nm.
* Extreme Edition processors have an unlocked multiplier and can be overclocked.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Smart Cache | TDP | Release date | MSRP |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Smart Cache | TDP | Release date | MSRP |
| Core i7 | 975 Extreme Edition | 4 (8) | 3.33 | 3.60 | 8 MB | 130 W | June 2009 | US $999 |
| Core i7 | 965 Extreme Edition | 4 (8) | 3.20 | 3.46 | 8 MB | 130 W | November 2008 | US $999 |
| Core i7 | 960 | 4 (8) | 3.20 | 3.46 | 8 MB | 130 W | October 2009 | US $562 |
| Core i7 | 950 | 4 (8) | 3.06 | 3.33 | 8 MB | 130 W | June 2009 | US $562 |
| Core i7 | 940 | 4 (8) | 2.93 | 3.20 | 8 MB | 130 W | November 2008 | US $562 |
| Core i7 | 930 | 4 (8) | 2.80 | 3.06 | 8 MB | 130 W | February 2010 | US $294 |
| Core i7 | 920 | 4 (8) | 2.66 | 2.93 | 8 MB | 130 W | November 2008 | US $284 |

#### Clarkdale

Common features:
* Socket: LGA 1156.
* All the CPUs support dual-channel DDR3 RAM, at up to 1333 MT/s speed.
* All CPU models provide 16 lanes of PCIe 2.0.
* All CPUs feature a DMI 1.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 32 nm.
* K-suffix processors have an unlocked multiplier and can be overclocked.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date | MSRP |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date | MSRP |
| Core i5 | 680 | 2 (4) | 3.60 | 3.86 | HD Graphics | 733 | 4 MB | 73 W | April 2010 | US $294 |
| Core i5 | 670 | 2 (4) | 3.46 | 3.73 | HD Graphics | 733 | 4 MB | 73 W | January 2010 | US $284 |
| Core i5 | 661 | 2 (4) | 3.33 | 3.60 | HD Graphics | 900 | 4 MB | 87 W | January 2010 | US $196 |
| Core i5 | 660 | 2 (4) | 3.33 | 3.60 | HD Graphics | 733 | 4 MB | 73 W | January 2010 | US $196 |
| Core i5 | 655K | 2 (4) | 3.20 | 3.46 | HD Graphics | 733 | 4 MB | 73 W | May 2010 | US $216 |
| Core i5 | 650 | 2 (4) | 3.20 | 3.46 | HD Graphics | 733 | 4 MB | 73 W | January 2010 | US $176 |
| Core i3 | 560 | 2 (4) | 3.33 | — | HD Graphics | 733 | 4 MB | 73 W | August 2010 | US $138 |
| Core i3 | 550 | 2 (4) | 3.20 | — | HD Graphics | 733 | 4 MB | 73 W | May 2010 | US $138 |
| Core i3 | 540 | 2 (4) | 3.06 | — | HD Graphics | 733 | 4 MB | 73 W | January 2010 | US $133 |
| Core i3 | 530 | 2 (4) | 2.93 | — | HD Graphics | 733 | 4 MB | 73 W | January 2010 | US $113 |

#### Gulftown

Common features:
* Socket: LGA 1366.
* All the CPUs support triple-channel DDR3 RAM, at up to 1066 MT/s speed.
* PCIe lanes are provided by the northbridge on the motherboard rather than by the CPU.
* All CPUs feature a QPI bus to the chipset (northbridge).
** Bus speed is 4.8 GT/s on all the processors except for the X-suffix models, which run at 6.4 GT/s.
* No integrated graphics.
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 32 nm.
* X-suffix processors have an unlocked multiplier and can be overclocked.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Smart Cache | TDP | Release date | MSRP |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Smart Cache | TDP | Release date | MSRP |
| Core i7 | 990X | 6 (12) | 3.46 | 3.73 | 12 MB | 130 W | February 2011 | US $999 |
| Core i7 | 980X | 6 (12) | 3.33 | 3.60 | 12 MB | 130 W | March 2010 | US $999 |
| Core i7 | 980 | 6 (12) | 3.33 | 3.60 | 12 MB | 130 W | June 2011 | US $583 |
| Core i7 | 970 | 6 (12) | 3.20 | 3.46 | 12 MB | 130 W | July 2010 | US $885 |

### Core i (2nd gen)
#### Sandy Bridge-DT

Common features:
* Socket: LGA 1155.
* All the CPUs support dual-channel DDR3 RAM, at up to 1333 MT/s speed.
* All CPU models provide 16 lanes of PCIe 2.0.
* All CPUs feature a DMI 2.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 32 nm.
* K-suffix processors have an unlocked multiplier and can be overclocked.
* i3-2120, i5-2400, and i7-2600 are available as embedded processors.
* The Core i3-2102, once upgraded via Intel Upgrade Service, operates at 3.6 GHz, has 3 MB L3 cache and is recognized as Core i3-2153.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date | MSRP |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date | MSRP |
| Core i7 | 2700K | 4 (8) | 3.5 | 3.9 | HD 3000 | 850–1350 | 8 MB | 95 W | October 2011 | US $332 |
| Core i7 | 2600K | 4 (8) | 3.4 | 3.8 | HD 3000 | 850–1350 | 8 MB | 95 W | January 2011 | US $317 |
| Core i7 | 2600 | 4 (8) | 3.4 | 3.8 | HD 2000 | 850–1350 | 8 MB | 95 W | January 2011 | US $294 |
| Core i7 | 2600S | 4 (8) | 2.8 | 3.8 | HD 2000 | 850–1350 | 8 MB | 65 W | January 2011 | US $306 |
| Core i5 | 2550K | 4 (4) | 3.4 | 3.8 | — | — | 6 MB | 95 W | January 2012 | US $225 |
| Core i5 | 2500K | 4 (4) | 3.3 | 3.7 | HD 3000 | 850–1100 | 6 MB | 95 W | January 2011 | US $216 |
| Core i5 | 2500 | 4 (4) | 3.3 | 3.7 | HD 2000 | 850–1100 | 6 MB | 95 W | January 2011 | US $205 |
| Core i5 | 2500S | 4 (4) | 2.7 | 3.7 | HD 2000 | 850–1100 | 6 MB | 65 W | January 2011 | US $216 |
| Core i5 | 2500T | 4 (4) | 2.3 | 3.3 | HD 2000 | 650–1250 | 6 MB | 45 W | January 2011 | US $216 |
| Core i5 | 2450P | 4 (4) | 3.2 | 3.5 | — | — | 6 MB | 95 W | January 2012 | US $195 |
| Core i5 | 2400 | 4 (4) | 3.1 | 3.4 | HD 2000 | 850–1100 | 6 MB | 95 W | January 2011 | US $184 |
| Core i5 | 2405S | 4 (4) | 2.5 | 3.3 | HD 3000 | 850–1100 | 6 MB | 65 W | May 2011 | US $205 |
| Core i5 | 2400S | 4 (4) | 2.5 | 3.3 | HD 2000 | 850–1100 | 6 MB | 65 W | January 2011 | US $195 |
| Core i5 | 2390T | 2 (4) | 2.7 | 3.5 | HD 2000 | 650–1100 | 3 MB | 35 W | February 2011 | US $195 |
| Core i5 | 2380P | 4 (4) | 3.1 | 3.4 | — | — | 6 MB | 95 W | January 2012 | US $177 |
| Core i5 | 2320 | 4 (4) | 3.0 | 3.3 | HD 2000 | 850–1100 | 6 MB | 95 W | September 2011 | US $177 |
| Core i5 | 2310 | 4 (4) | 2.9 | 3.2 | HD 2000 | 850–1100 | 6 MB | 95 W | May 2011 | US $177 |
| Core i5 | 2300 | 4 (4) | 2.8 | 3.1 | HD 2000 | 850–1100 | 6 MB | 95 W | January 2011 | US $177 |
| Core i3 | 2130 | 2 (4) | 3.4 | — | HD 2000 | 850–1100 | 3 MB | 65 W | September 2011 | US $138 |
| Core i3 | 2125 | 2 (4) | 3.3 | — | HD 3000 | 850–1100 | 3 MB | 65 W | September 2011 | US $134 |
| Core i3 | 2120 | 2 (4) | 3.3 | — | HD 2000 | 850–1100 | 3 MB | 65 W | February 2011 | US $138 |
| Core i3 | 2120T | 2 (4) | 2.6 | — | HD 2000 | 650–1100 | 3 MB | 35 W | February 2011 | US $127 |
| Core i3 | 2105 | 2 (4) | 3.1 | — | HD 3000 | 850–1100 | 3 MB | 65 W | May 2011 | US $134 |
| Core i3 | 2102 | 2 (4) | 3.1 | — | HD 2000 | 850–1100 | 3 MB | 65 W | Q2 2011 | US $127 |
| Core i3 | 2100 | 2 (4) | 3.1 | — | HD 2000 | 850–1100 | 3 MB | 65 W | February 2011 | US $117 |
| Core i3 | 2100T | 2 (4) | 2.5 | — | HD 2000 | 650–1100 | 3 MB | 35 W | February 2011 | US $127 |

### Core i (3rd gen)
#### Ivy Bridge-DT

Common features:
* Socket: LGA 1155.
* All the CPUs support dual-channel DDR3 RAM, at up to 1600 MT/s speed.
* All CPU models provide 16 lanes of PCIe. i5 and up models support it at PCIe 3.0 speeds while i3 models support it at PCIe 2.0 speeds.
* All CPUs feature a DMI 2.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 22 nm.
* K-suffix processors have an unlocked multiplier and can be overclocked.
* i3-3220, i5-3550S and i7-3770 are available as embedded processors.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date | MSRP |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date | MSRP |
| Core i7 | 3770K | 4 (8) | 3.5 | 3.9 | HD 4000 | 650–1150 | 8 MB | 77 W | April 2012 | US $342 |
| Core i7 | 3770 | 4 (8) | 3.4 | 3.9 | HD 4000 | 650–1150 | 8 MB | 77 W | April 2012 | US $305 |
| Core i7 | 3770S | 4 (8) | 3.1 | 3.9 | HD 4000 | 650–1150 | 8 MB | 65 W | April 2012 | US $305 |
| Core i7 | 3770T | 4 (8) | 2.5 | 3.7 | HD 4000 | 650–1150 | 8 MB | 45 W | April 2012 | US $294 |
| Core i5 | 3570K | 4 (4) | 3.4 | 3.8 | HD 4000 | 650–1150 | 6 MB | 77 W | April 2012 | US $225 |
| Core i5 | 3570 | 4 (4) | 3.4 | 3.8 | HD 2500 | 650–1150 | 6 MB | 77 W | June 2012 | US $205 |
| Core i5 | 3570S | 4 (4) | 3.1 | 3.8 | HD 2500 | 650–1150 | 6 MB | 65 W | June 2012 | US $205 |
| Core i5 | 3570T | 4 (4) | 2.3 | 3.3 | HD 2500 | 650–1150 | 6 MB | 45 W | April 2012 | US $205 |
| Core i5 | 3550 | 4 (4) | 3.3 | 3.7 | HD 2500 | 650–1150 | 6 MB | 77 W | April 2012 | US $205 |
| Core i5 | 3550S | 4 (4) | 3.0 | 3.7 | HD 2500 | 650–1150 | 6 MB | 65 W | April 2012 | US $205 |
| Core i5 | 3470 | 4 (4) | 3.2 | 3.6 | HD 2500 | 650–1100 | 6 MB | 77 W | June 2012 | US $184 |
| Core i5 | 3475S | 4 (4) | 2.9 | 3.6 | HD 4000 | 650–1100 | 6 MB | 65 W | June 2012 | US $201 |
| Core i5 | 3470S | 4 (4) | 2.9 | 3.6 | HD 2500 | 650–1100 | 6 MB | 65 W | June 2012 | US $184 |
| Core i5 | 3470T | 2 (4) | 2.9 | 3.6 | HD 2500 | 650–1100 | 3 MB | 35 W | June 2012 | US $184 |
| Core i5 | 3450 | 4 (4) | 3.1 | 3.5 | HD 2500 | 650–1100 | 6 MB | 77 W | April 2012 | US $184 |
| Core i5 | 3450S | 4 (4) | 2.8 | 3.5 | HD 2500 | 650–1100 | 6 MB | 65 W | April 2012 | US $184 |
| Core i5 | 3350P | 4 (4) | 3.1 | 3.3 | — | — | 6 MB | 69 W | September 2012 | US $177 |
| Core i5 | 3340 | 4 (4) | 3.1 | 3.3 | HD 2500 | 650–1050 | 6 MB | 77 W | September 2013 | US $182 |
| Core i5 | 3340S | 4 (4) | 2.8 | 3.3 | HD 2500 | 650–1050 | 6 MB | 65 W | September 2013 | US $182 |
| Core i5 | 3330 | 4 (4) | 3.0 | 3.2 | HD 2500 | 650–1050 | 6 MB | 77 W | September 2012 | US $182 |
| Core i5 | 3335S | 4 (4) | 2.7 | 3.2 | HD 4000 | 650–1050 | 6 MB | 65 W | September 2012 | US $194 |
| Core i5 | 3330S | 4 (4) | 2.7 | 3.2 | HD 2500 | 650–1050 | 6 MB | 65 W | September 2012 | US $177 |
| Core i3 | 3250 | 2 (4) | 3.5 | — | HD 2500 | 650–1050 | 3 MB | 55 W | June 2013 | US $138 |
| Core i3 | 3250T | 2 (4) | 3.0 | — | HD 2500 | 650–1050 | 3 MB | 35 W | June 2013 | US $138 |
| Core i3 | 3245 | 2 (4) | 3.4 | — | HD 4000 | 650–1050 | 3 MB | 55 W | June 2013 | US $134 |
| Core i3 | 3240 | 2 (4) | 3.4 | — | HD 2500 | 650–1050 | 3 MB | 55 W | September 2012 | US $138 |
| Core i3 | 3240T | 2 (4) | 2.9 | — | HD 2500 | 650–1050 | 3 MB | 35 W | September 2012 | US $138 |
| Core i3 | 3225 | 2 (4) | 3.3 | — | HD 4000 | 650–1050 | 3 MB | 55 W | September 2012 | US $134 |
| Core i3 | 3220 | 2 (4) | 3.3 | — | HD 2500 | 650–1050 | 3 MB | 55 W | September 2012 | US $117 |
| Core i3 | 3220T | 2 (4) | 2.8 | — | HD 2500 | 650–1050 | 3 MB | 35 W | September 2012 | US $117 |
| Core i3 | 3210 | 2 (4) | 3.2 | — | HD 2500 | 650–1050 | 3 MB | 55 W | January 2013 | US $117 |

#### Sandy Bridge-E

Common features:
* Socket: LGA 2011.
* All the CPUs support quad-channel DDR3-1600 RAM.
* All CPU models provide 40 lanes of PCIe 2.0.
* All CPUs feature a DMI 2.0 bus to the chipset (PCH).
* No integrated graphics.
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 32 nm.
* K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Smart Cache | TDP | Release date | MSRP |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Smart Cache | TDP | Release date | MSRP |
| Core i7 | 3970X | 6 (12) | 3.5 | 4.0 | 15 MB | 150 W | November 2012 | US $999 |
| Core i7 | 3960X | 6 (12) | 3.3 | 3.9 | 15 MB | 130 W | November 2011 | US $999 |
| Core i7 | 3930K | 6 (12) | 3.2 | 3.8 | 12 MB | 130 W | November 2011 | US $583 |
| Core i7 | 3820 | 4 (8) | 3.6 | 3.8 | 10 MB | 130 W | February 2012 | US $294 |

### Core i (4th gen)
#### Haswell-DT

Common features:
* Socket: LGA 1150.
* All the CPUs support dual-channel DDR3 RAM at up to 1600 MT/s speed.
* All CPU models provide 16 lanes of PCIe 3.0.
* All CPUs feature a DMI 2.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 22 nm.
* K-suffix processors have an unlocked multiplier and can be overclocked.
* The following models are available as embedded processors: i3- 4330, 4350T, 4360, i5- 4570S, 4590T, 4590S, i7- 4770S, 4790S.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date | MSRP |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date | MSRP |
| Core i7 | 4790K | 4 (8) | 4.0 | 4.4 | HD 4600 | 350–1250 | 8 MB | 88 W | June 2014 | US $350 |
| Core i7 | 4790 | 4 (8) | 3.6 | 4.0 | HD 4600 | 350–1200 | 8 MB | 84 W | May 2014 | US $312 |
| Core i7 | 4790S | 4 (8) | 3.2 | 4.0 | HD 4600 | 350–1200 | 8 MB | 65 W | May 2014 | US $312 |
| Core i7 | 4790T | 4 (8) | 2.7 | 3.9 | HD 4600 | 350–1200 | 8 MB | 45 W | May 2014 | US $303 |
| Core i7 | 4785T | 4 (8) | 2.2 | 3.2 | HD 4600 | 350–1200 | 8 MB | 35 W | May 2014 | US $303 |
| Core i7 | 4770K | 4 (8) | 3.5 | 3.9 | HD 4600 | 350–1250 | 8 MB | 84 W | June 2013 | US $350 |
| Core i7 | 4771 | 4 (8) | 3.5 | 3.9 | HD 4600 | 350–1200 | 8 MB | 84 W | September 2013 | US $320 |
| Core i7 | 4770 | 4 (8) | 3.4 | 3.9 | HD 4600 | 350–1200 | 8 MB | 84 W | June 2013 | US $312 |
| Core i7 | 4770S | 4 (8) | 3.1 | 3.9 | HD 4600 | 350–1200 | 8 MB | 65 W | June 2013 | US $305 |
| Core i7 | 4770T | 4 (8) | 2.5 | 3.7 | HD 4600 | 350–1200 | 8 MB | 45 W | June 2013 | US $303 |
| Core i7 | 4765T | 4 (8) | 2.0 | 3.0 | HD 4600 | 350–1200 | 8 MB | 35 W | June 2013 | US $303 |
| Core i5 | 4690K | 4 (4) | 3.5 | 3.9 | HD 4600 | 350–1200 | 6 MB | 88 W | June 2014 | US $242 |
| Core i5 | 4690 | 4 (4) | 3.5 | 3.9 | HD 4600 | 350–1200 | 6 MB | 84 W | May 2014 | US $213 |
| Core i5 | 4690S | 4 (4) | 3.2 | 3.9 | HD 4600 | 350–1200 | 6 MB | 65 W | May 2014 | US $213 |
| Core i5 | 4690T | 4 (4) | 2.5 | 3.5 | HD 4600 | 350–1200 | 6 MB | 45 W | May 2014 | US $213 |
| Core i5 | 4670K | 4 (4) | 3.4 | 3.8 | HD 4600 | 350–1200 | 6 MB | 84 W | June 2013 | US $242 |
| Core i5 | 4670 | 4 (4) | 3.4 | 3.8 | HD 4600 | 350–1200 | 6 MB | 84 W | June 2013 | US $213 |
| Core i5 | 4670S | 4 (4) | 3.1 | 3.8 | HD 4600 | 350–1200 | 6 MB | 65 W | June 2013 | US $213 |
| Core i5 | 4670T | 4 (4) | 2.3 | 3.3 | HD 4600 | 350–1200 | 6 MB | 45 W | June 2013 | US $213 |
| Core i5 | 4590 | 4 (4) | 3.3 | 3.7 | HD 4600 | 350–1150 | 6 MB | 84 W | May 2014 | US $192 |
| Core i5 | 4590S | 4 (4) | 3.0 | 3.7 | HD 4600 | 350–1150 | 6 MB | 65 W | May 2014 | US $192 |
| Core i5 | 4590T | 4 (4) | 2.0 | 3.0 | HD 4600 | 350–1150 | 6 MB | 35 W | May 2014 | US $192 |
| Core i5 | 4570 | 4 (4) | 3.2 | 3.6 | HD 4600 | 350–1150 | 6 MB | 84 W | June 2013 | US $192 |
| Core i5 | 4570S | 4 (4) | 2.9 | 3.6 | HD 4600 | 350–1150 | 6 MB | 65 W | June 2013 | US $192 |
| Core i5 | 4570T | 2 (4) | 2.9 | 3.6 | HD 4600 | 200–1150 | 4 MB | 35 W | June 2013 | US $192 |
| Core i5 | 4470 | 4 (4) | 3.3 | 3.5 | HD 4600 | 350–1100 | 6 MB | 84 W | May 2014 | OEM |
| Core i5 | 4460 | 4 (4) | 3.2 | 3.4 | HD 4600 | 350–1100 | 6 MB | 84 W | May 2014 | US $182 |
| Core i5 | 4460S | 4 (4) | 2.9 | 3.4 | HD 4600 | 350–1100 | 6 MB | 65 W | May 2014 | US $182 |
| Core i5 | 4460T | 4 (4) | 1.9 | 2.7 | HD 4600 | 350–1100 | 6 MB | 35 W | March 2014 | US $182 |
| Core i5 | 4440 | 4 (4) | 3.1 | 3.3 | HD 4600 | 350–1100 | 6 MB | 84 W | September 2013 | US $182 |
| Core i5 | 4440S | 4 (4) | 2.8 | 3.3 | HD 4600 | 350–1100 | 6 MB | 65 W | September 2013 | US $182 |
| Core i5 | 4430 | 4 (4) | 3.0 | 3.2 | HD 4600 | 350–1100 | 6 MB | 84 W | June 2013 | US $182 |
| Core i5 | 4430S | 4 (4) | 2.7 | 3.2 | HD 4600 | 350–1100 | 6 MB | 65 W | June 2013 | US $182 |
| Core i3 | 4370 | 2 (4) | 3.8 | — | HD 4600 | 350–1150 | 4 MB | 54 W | July 2014 | US $149 |
| Core i3 | 4370T | 2 (4) | 3.3 | — | HD 4600 | 200–1150 | 4 MB | 35 W | March 2015 | US $138 |
| Core i3 | 4360 | 2 (4) | 3.7 | — | HD 4600 | 350–1150 | 4 MB | 54 W | May 2014 | US $149 |
| Core i3 | 4360T | 2 (4) | 3.2 | — | HD 4600 | 200–1150 | 4 MB | 35 W | July 2014 | US $138 |
| Core i3 | 4350 | 2 (4) | 3.6 | — | HD 4600 | 350–1150 | 4 MB | 54 W | May 2014 | US $138 |
| Core i3 | 4350T | 2 (4) | 3.1 | — | HD 4600 | 200–1150 | 4 MB | 35 W | May 2014 | US $138 |
| Core i3 | 4340 | 2 (4) | 3.6 | — | HD 4600 | 350–1150 | 4 MB | 54 W | September 2013 | US $149 |
| Core i3 | 4330 | 2 (4) | 3.5 | — | HD 4600 | 350–1150 | 4 MB | 54 W | September 2013 | US $138 |
| Core i3 | 4330T | 2 (4) | 3.0 | — | HD 4600 | 200–1150 | 4 MB | 35 W | September 2013 | US $138 |
| Core i3 | 4170 | 2 (4) | 3.7 | — | HD 4400 | 350–1150 | 3 MB | 54 W | March 2015 | US $117 |
| Core i3 | 4170T | 2 (4) | 3.2 | — | HD 4400 | 200–1150 | 3 MB | 35 W | March 2015 | US $117 |
| Core i3 | 4160 | 2 (4) | 3.6 | — | HD 4400 | 350–1150 | 3 MB | 54 W | July 2014 | US $117 |
| Core i3 | 4160T | 2 (4) | 3.1 | — | HD 4400 | 200–1150 | 3 MB | 35 W | July 2014 | US $117 |
| Core i3 | 4150 | 2 (4) | 3.5 | — | HD 4400 | 350–1150 | 3 MB | 54 W | May 2014 | US $117 |
| Core i3 | 4150T | 2 (4) | 3.0 | — | HD 4400 | 200–1150 | 3 MB | 35 W | May 2014 | US $117 |
| Core i3 | 4130 | 2 (4) | 3.4 | — | HD 4400 | 350–1150 | 3 MB | 54 W | September 2013 | US $122 |
| Core i3 | 4130T | 2 (4) | 2.9 | — | HD 4400 | 200–1150 | 3 MB | 35 W | September 2013 | US $122 |

#### Haswell-H

Common features:
* Socket: BGA 1364 (soldered).
* All the CPUs support dual-channel DDR3 RAM, at up to 1600 MT/s speed.
* All CPU models provide 16 lanes of PCIe 3.0.
* All CPUs feature a DMI 2.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* In addition to the Smart Cache (L3 cache), Haswell-H CPUs also contain 128 MB of eDRAM acting as L4 cache.
* Fabrication process: 22 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 4770R | 4 (8) | 3.2 | 3.9 | Iris Pro 5200 | 200–1300 | 6 MB | 65 W | June 2013 |
| Core i5 | 4670R | 4 (4) | 3.0 | 3.7 | Iris Pro 5200 | 200–1300 | 4 MB | 65 W | June 2013 |
| Core i5 | 4570R | 4 (4) | 2.7 | 3.2 | Iris Pro 5200 | 200–1150 | 4 MB | 65 W | June 2013 |

#### Ivy Bridge-E

Common features:
* Socket: LGA 2011.
* All the CPUs support quad-channel DDR3-1866 RAM.
* All CPU models provide 40 lanes of PCIe 3.0.
* All CPUs feature a DMI 2.0 bus to the chipset (PCH).
* No integrated graphics.
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 22 nm.
* K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Smart Cache | TDP | Release date | MSRP |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Smart Cache | TDP | Release date | MSRP |
| Core i7 | 4960X | 6 (12) | 3.6 | 4.0 | 15 MB | 130 W | September 2013 | US $990 |
| Core i7 | 4930K | 6 (12) | 3.4 | 3.9 | 12 MB | 130 W | September 2013 | US $555 |
| Core i7 | 4820K | 4 (8) | 3.7 | 3.9 | 10 MB | 130 W | September 2013 | US $310 |

### Core i (5th gen)
#### Broadwell-H

Common features:
* Socket: LGA 1150 for C-suffix processors, BGA 1364 soldered for R-suffix.
* All the CPUs support dual-channel DDR3 RAM. C-suffix processors support it at speeds up to 1600 MT/s, while R-suffix support it at 1866 MT/s.
* All CPU models provide 16 lanes of PCIe 3.0.
* All CPUs feature a DMI 2.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* In addition to the Smart Cache (L3 cache), Broadwell-H CPUs also contain 128 MB of eDRAM acting as L4 cache.
* Fabrication process: 14 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date | MSRP |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date | MSRP |
| Core i7 | 5775R | 4 (8) | 3.3 | 3.8 | Iris Pro 6200 | 300–1150 | 6 MB | 65 W | June 2015 | OEM |
| Core i7 | 5775C | 4 (8) | 3.3 | 3.7 | Iris Pro 6200 | 300–1150 | 6 MB | 65 W | June 2015 | US $366 |
| Core i5 | 5675R | 4 (4) | 3.1 | 3.6 | Iris Pro 6200 | 300–1100 | 4 MB | 65 W | June 2015 | OEM |
| Core i5 | 5675C | 4 (4) | 3.1 | 3.6 | Iris Pro 6200 | 300–1100 | 4 MB | 65 W | June 2015 | US $276 |
| Core i5 | 5575R | 4 (4) | 2.8 | 3.3 | Iris Pro 6200 | 300–1050 | 4 MB | 65 W | June 2015 | OEM |

#### Haswell-E

Common features:
* Socket: LGA 2011-3.
* All the CPUs support quad-channel DDR4-2133 RAM.
* i7-5820K provides 28 lanes of PCIe 3.0; i7-5930K and 5960X provide 40 lanes of PCIe 3.0.
* All CPUs feature a DMI 2.0 bus to the chipset (PCH).
* No integrated graphics.
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 22 nm.
* K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Smart Cache | TDP | Release date | MSRP |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Smart Cache | TDP | Release date | MSRP |
| Core i7 | 5960X | 8 (16) | 3.0 | 3.5 | 20 MB | 140 W | August 2014 | US $999 |
| Core i7 | 5930K | 6 (12) | 3.5 | 3.7 | 15 MB | 140 W | August 2014 | US $583 |
| Core i7 | 5820K | 6 (12) | 3.3 | 3.6 | 15 MB | 140 W | August 2014 | US $389 |

### Core i (6th gen)
#### Skylake-S

Common features:
* Socket: LGA 1151.
* All the CPUs support dual-channel DDR4-2133 or DDR3L-1600 RAM.
* All CPU models provide 16 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 14 nm.
* K-suffix processors have an unlocked multiplier and can be overclocked.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date | MSRP |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date | MSRP |
| Core i7 | 6700K | 4 (8) | 4.0 | 4.2 | HD 530 | 350–1150 | 8 MB | 91 W | August 2015 | US $339 |
| Core i7 | 6700 | 4 (8) | 3.4 | 4.0 | HD 530 | 350–1150 | 8 MB | 65 W | September 2015 | US $303 |
| Core i7 | 6700T | 4 (8) | 2.8 | 3.6 | HD 530 | 350–1100 | 8 MB | 35 W | September 2015 | US $303 |
| Core i5 | 6600K | 4 (4) | 3.5 | 3.9 | HD 530 | 350–1150 | 6 MB | 91 W | August 2015 | US $243 |
| Core i5 | 6600 | 4 (4) | 3.3 | 3.9 | HD 530 | 350–1150 | 6 MB | 65 W | September 2015 | US $213 |
| Core i5 | 6600T | 4 (4) | 2.7 | 3.5 | HD 530 | 350–1100 | 6 MB | 35 W | September 2015 | US $213 |
| Core i5 | 6500 | 4 (4) | 3.2 | 3.6 | HD 530 | 350–1050 | 6 MB | 65 W | September 2015 | US $192 |
| Core i5 | 6500T | 4 (4) | 2.5 | 3.1 | HD 530 | 350–1100 | 6 MB | 35 W | September 2015 | US $192 |
| Core i5 | 6402P | 4 (4) | 2.8 | 3.4 | HD 510 | 350–950 | 6 MB | 65 W | December 2015 | US $182 |
| Core i5 | 6400 | 4 (4) | 2.7 | 3.3 | HD 530 | 350–950 | 6 MB | 65 W | September 2015 | US $182 |
| Core i5 | 6400T | 4 (4) | 2.2 | 2.8 | HD 530 | 350–950 | 6 MB | 35 W | September 2015 | US $182 |
| Core i3 | 6320 | 2 (4) | 3.9 | — | HD 530 | 350–1150 | 4 MB | 51 W | September 2015 | US $148 |
| Core i3 | 6300 | 2 (4) | 3.8 | — | HD 530 | 350–1150 | 4 MB | 51 W | September 2015 | US $139 |
| Core i3 | 6300T | 2 (4) | 3.3 | — | HD 530 | 350–950 | 4 MB | 35 W | September 2015 | US $138 |
| Core i3 | 6100 | 2 (4) | 3.7 | — | HD 530 | 350–1050 | 3 MB | 51 W | September 2015 | US $117 |
| Core i3 | 6100T | 2 (4) | 3.2 | — | HD 530 | 350–950 | 3 MB | 35 W | September 2015 | US $117 |
| Core i3 | 6098P | 2 (4) | 3.6 | — | HD 510 | 350–1050 | 3 MB | 54 W | December 2015 | US $117 |

#### Skylake-H

Common features:
* Socket: BGA 1440 (soldered).
* All the CPUs support dual-channel DDR4-2133 or DDR3L-1600 RAM.
* All CPU models provide 16 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* In addition to the Smart Cache (L3 cache), Skylake-H CPUs also contain 128 MB of eDRAM acting as L4 cache.
* Fabrication process: 14 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 6785R | 4 (8) | 3.3 | 3.9 | Iris Pro 580 | 350–1150 | 8 MB | 65 W | May 2016 |
| Core i5 | 6685R | 4 (4) | 3.2 | 3.8 | Iris Pro 580 | 350–1150 | 6 MB | 65 W | May 2016 |
| Core i5 | 6585R | 4 (4) | 2.8 | 3.6 | Iris Pro 580 | 350–1100 | 6 MB | 65 W | May 2016 |

#### Broadwell-E

Common features:
* Socket: LGA 2011-3.
* All the CPUs support quad-channel DDR4-2400 RAM.
* i7-6800K provides 28 lanes of PCIe 3.0; all other models provide 40 lanes of PCIe 3.0.
* All CPUs feature a DMI 2.0 bus to the chipset (PCH).
* No integrated graphics.
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 14 nm.
* K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Smart Cache | TDP | Release date | MSRP |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Smart Cache | TDP | Release date | MSRP |
| Core i7 | 6950X | 10 (20) | 3.0 | 3.5 | 25 MB | 140 W | May 2016 | US $1723 |
| Core i7 | 6900K | 8 (16) | 3.2 | 3.7 | 20 MB | 140 W | May 2016 | US $1089 |
| Core i7 | 6850K | 6 (12) | 3.6 | 3.8 | 15 MB | 140 W | May 2016 | US $617 |
| Core i7 | 6800K | 6 (12) | 3.4 | 3.8 | 15 MB | 140 W | May 2016 | US $434 |

### Core i (7th gen)
#### Kaby Lake-S

Common features:
* Socket: LGA 1151.
* All the CPUs support dual-channel DDR4-2400 or DDR3L-1600 RAM.
* All CPU models provide 16 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 14 nm.
* K-suffix processors have an unlocked multiplier and can be overclocked.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date | MSRP |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date | MSRP |
| Core i7 | 7700K | 4 (8) | 4.2 | 4.5 | HD 630 | 350–1150 | 8 MB | 91 W | January 2017 | US $339 |
| Core i7 | 7700 | 4 (8) | 3.6 | 4.2 | HD 630 | 350–1150 | 8 MB | 65 W | January 2017 | US $303 |
| Core i7 | 7700T | 4 (8) | 2.9 | 3.8 | HD 630 | 350–1150 | 8 MB | 35 W | January 2017 | US $303 |
| Core i5 | 7600K | 4 (4) | 3.8 | 4.2 | HD 630 | 350–1150 | 6 MB | 91 W | January 2017 | US $242 |
| Core i5 | 7600 | 4 (4) | 3.5 | 4.1 | HD 630 | 350–1150 | 6 MB | 65 W | January 2017 | US $213 |
| Core i5 | 7600T | 4 (4) | 2.8 | 3.7 | HD 630 | 350–1100 | 6 MB | 35 W | January 2017 | US $213 |
| Core i5 | 7500 | 4 (4) | 3.4 | 3.8 | HD 630 | 350–1100 | 6 MB | 65 W | January 2017 | US $192 |
| Core i5 | 7500T | 4 (4) | 2.7 | 3.3 | HD 630 | 350–1100 | 6 MB | 35 W | January 2017 | US $192 |
| Core i5 | 7400 | 4 (4) | 3.0 | 3.5 | HD 630 | 350–1000 | 6 MB | 65 W | January 2017 | US $182 |
| Core i5 | 7400T | 4 (4) | 2.4 | 3.0 | HD 630 | 350–1000 | 6 MB | 35 W | January 2017 | US $182 |
| Core i3 | 7350K | 2 (4) | 4.2 | — | HD 630 | 350–1150 | 4 MB | 60 W | January 2017 | US $168 |
| Core i3 | 7320 | 2 (4) | 4.1 | — | HD 630 | 350–1150 | 4 MB | 51 W | January 2017 | US $157 |
| Core i3 | 7300 | 2 (4) | 4.0 | — | HD 630 | 350–1150 | 4 MB | 51 W | January 2017 | US $147 |
| Core i3 | 7300T | 2 (4) | 3.5 | — | HD 630 | 350–1100 | 4 MB | 35 W | January 2017 | US $147 |
| Core i3 | 7100 | 2 (4) | 3.9 | — | HD 630 | 350–1100 | 3 MB | 51 W | January 2017 | US $117 |
| Core i3 | 7100T | 2 (4) | 3.4 | — | HD 630 | 350–1100 | 3 MB | 35 W | January 2017 | US $117 |

#### Skylake-X

Common features:
* Socket: LGA 2066.
* All the CPUs support quad-channel DDR4-2400 RAM. Models i7-7820X and above support it up to 2666 MT/s speeds.
* i7 models provide 28 lanes of PCIe 3.0; i9 models provide 44 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* No integrated graphics.
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 14 nm.
* X-suffix, and XE-suffix processors have an unlocked multiplier and can be overclocked.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Clock rate (GHz) | Smart Cache | TDP | Release date | MSRP |
| Processor branding | Model | Cores (Threads) | Base | Turbo 2.0 | Turbo 3.0 | Smart Cache | TDP | Release date | MSRP |
| Core i9 | 7980XE | 18 (36) | 2.6 | 4.2 | 4.4 | 24.75 MB | 165 W | September 2017 | US $1999 |
| Core i9 | 7960X | 16 (32) | 2.8 | 4.2 | 4.4 | 22 MB | 165 W | September 2017 | US $1699 |
| Core i9 | 7940X | 14 (28) | 3.1 | 4.3 | 4.4 | 19.25 MB | 165 W | September 2017 | US $1399 |
| Core i9 | 7920X | 12 (24) | 2.9 | 4.3 | 4.4 | 16.5 MB | 140 W | August 2017 | US $1199 |
| Core i9 | 7900X | 10 (20) | 3.3 | 4.3 | 4.5 | 13.75 MB | 140 W | June 2017 | US $989 |
| Core i7 | 7820X | 8 (16) | 3.6 | 4.3 | 4.5 | 11 MB | 140 W | June 2017 | US $599 |
| Core i7 | 7800X | 6 (12) | 3.5 | 4.0 | — | 8.25 MB | 140 W | June 2017 | US $389 |

#### Kaby Lake-X

Common features:
* Socket: LGA 2066.
* All the CPUs support dual-channel DDR4-2666 RAM.
* All CPU models provide 16 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* No integrated graphics.
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 14 nm.
* X-suffix processors have an unlocked multiplier and can be overclocked.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Smart Cache | TDP | Release date | MSRP |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Smart Cache | TDP | Release date | MSRP |
| Core i7 | 7740X | 4 (8) | 4.3 | 4.5 | 8 MB | 112 W | June 2017 | US $339 |
| Core i5 | 7640X | 4 (4) | 4.0 | 4.2 | 6 MB | 112 W | June 2017 | US $242 |

### Core i (8th gen)
#### Coffee Lake-S

Common features:
* Socket: LGA 1151-2.
* All the CPUs support dual-channel DDR4 RAM at up to 2400 MT/s speed. Models i5 and up support it at up to 2666 MT/s speed.
* All CPU models provide 16 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 14 nm.
* K-suffix processors have an unlocked multiplier and can be overclocked.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date | MSRP |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date | MSRP |
| Core i7 | 8086K | 6 (12) | 4.0 | 5.0 | UHD 630 | 350–1200 | 12 MB | 95 W | June 2018 | US $425 |
| Core i7 | 8700K | 6 (12) | 3.7 | 4.7 | UHD 630 | 350–1200 | 12 MB | 95 W | October 2017 | US $359 |
| Core i7 | 8700 | 6 (12) | 3.2 | 4.6 | UHD 630 | 350–1200 | 12 MB | 65 W | October 2017 | US $303 |
| Core i7 | 8700T | 6 (12) | 2.4 | 4.0 | UHD 630 | 350–1200 | 12 MB | 35 W | April 2018 | US $303 |
| Core i5 | 8600K | 6 (6) | 3.6 | 4.3 | UHD 630 | 350–1150 | 9 MB | 95 W | October 2017 | US $257 |
| Core i5 | 8600 | 6 (6) | 3.1 | 4.3 | UHD 630 | 350–1150 | 9 MB | 65 W | April 2018 | US $213 |
| Core i5 | 8600T | 6 (6) | 2.3 | 3.7 | UHD 630 | 350–1150 | 9 MB | 35 W | April 2018 | US $213 |
| Core i5 | 8500 | 6 (6) | 3.0 | 4.1 | UHD 630 | 350–1100 | 9 MB | 65 W | April 2018 | US $192 |
| Core i5 | 8500T | 6 (6) | 2.1 | 3.5 | UHD 630 | 350–1100 | 9 MB | 35 W | April 2018 | US $192 |
| Core i5 | 8400 | 6 (6) | 2.8 | 4.0 | UHD 630 | 350–1050 | 9 MB | 65 W | October 2017 | US $182 |
| Core i5 | 8400T | 6 (6) | 1.7 | 3.3 | UHD 630 | 350–1050 | 9 MB | 35 W | April 2018 | US $182 |
| Core i3 | 8350K | 4 (4) | 4.0 | — | UHD 630 | 350–1150 | 8 MB | 91 W | October 2017 | US $168 |
| Core i3 | 8300 | 4 (4) | 3.7 | — | UHD 630 | 350–1150 | 8 MB | 62 W | April 2018 | US $138 |
| Core i3 | 8300T | 4 (4) | 3.2 | — | UHD 630 | 350–1100 | 8 MB | 35 W | April 2018 | US $138 |
| Core i3 | 8100 | 4 (4) | 3.6 | — | UHD 630 | 350–1100 | 6 MB | 65 W | October 2017 | US $117 |
| Core i3 | 8100F | 4 (4) | 3.6 | — | — | — | 6 MB | 65 W | January 2019 | US $117 |
| Core i3 | 8100T | 4 (4) | 3.1 | — | UHD 630 | 350–1100 | 6 MB | 35 W | April 2018 | US $117 |

### Core i (9th gen)
#### Coffee Lake-R

Common features:
* Socket: LGA 1151-2.
* All the CPUs support dual-channel DDR4 RAM at up to 2400 MT/s speed. Models i5 and up support it at up to 2666 MT/s speed.
* All CPU models provide 16 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 14 nm.
* K-suffix processors have an unlocked multiplier and can be overclocked.
* i9-9900KS has all-core boost clock of 5.0 GHz.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date | MSRP |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date | MSRP |
| Core i9 | 9900KS | 8 (16) | 4.0 | 5.0 | UHD 630 | 350–1200 | 16 MB | 127 W | October 2019 | US $524 |
| Core i9 | 9900K | 8 (16) | 3.6 | 5.0 | UHD 630 | 350–1200 | 16 MB | 95 W | October 2018 | US $488 |
| Core i9 | 9900KF | 8 (16) | 3.6 | 5.0 | — | — | 16 MB | 95 W | January 2019 | US $463 |
| Core i9 | 9900 | 8 (16) | 3.1 | 5.0 | UHD 630 | 350–1200 | 16 MB | 65 W | April 2019 | US $439 |
| Core i9 | 9900T | 8 (16) | 2.1 | 4.4 | UHD 630 | 350–1200 | 16 MB | 35 W | April 2019 | US $439 |
| Core i7 | 9700K | 8 (8) | 3.6 | 4.9 | UHD 630 | 350–1200 | 12 MB | 95 W | October 2018 | US $374 |
| Core i7 | 9700KF | 8 (8) | 3.6 | 4.9 | — | — | 12 MB | 95 W | January 2019 | US $374 |
| Core i7 | 9700 | 8 (8) | 3.0 | 4.7 | UHD 630 | 350–1200 | 12 MB | 65 W | April 2019 | US $323 |
| Core i7 | 9700F | 8 (8) | 3.0 | 4.7 | — | — | | 12 MB | 65 W | April 2019 | US $323 |
| Core i7 | 9700T | 8 (8) | 2.0 | 4.3 | UHD 630 | 350–1200 | 12 MB | 35 W | April 2019 | US $323 |
| Core i5 | 9600K | 6 (6) | 3.7 | 4.6 | UHD 630 | 350–1150 | 9 MB | 95 W | October 2018 | US $262 |
| Core i5 | 9600KF | 6 (6) | 3.7 | 4.6 | — | — | 9 MB | 95 W | January 2019 | US $263 |
| Core i5 | 9600 | 6 (6) | 3.1 | 4.6 | UHD 630 | 350–1150 | 9 MB | 65 W | April 2019 | US $213 |
| Core i5 | 9600T | 6 (6) | 2.3 | 3.9 | UHD 630 | 350–1150 | 9 MB | 35 W | April 2019 | US $213 |
| Core i5 | 9500 | 6 (6) | 3.0 | 4.2 | UHD 630 | 350–1100 | 9 MB | 65 W | April 2019 | US $192 |
| Core i5 | 9500F | 6 (6) | 3.0 | 4.2 | — | — | | 9 MB | 65 W | April 2019 | US $192 |
| Core i5 | 9500T | 6 (6) | 2.2 | 3.7 | UHD 630 | 350–1100 | 9 MB | 35 W | April 2019 | US $192 |
| Core i5 | 9400 | 6 (6) | 2.9 | 4.1 | UHD 630 | 350–1050 | 9 MB | 65 W | January 2019 | US $182 |
| Core i5 | 9400F | 6 (6) | 2.9 | 4.1 | — | — | | 9 MB | 65 W | January 2019 | US $182 |
| Core i5 | 9400T | 6 (6) | 1.8 | 3.4 | UHD 630 | 350–1050 | 9 MB | 35 W | April 2019 | US $182 |
| Core i3 | 9350K | 4 (4) | 4.0 | 4.6 | UHD 630 | 350–1150 | 8 MB | 91 W | April 2019 | US $173 |
| Core i3 | 9350KF | 4 (4) | 4.0 | 4.6 | — | — | 8 MB | 91 W | January 2019 | US $173 |
| Core i3 | 9320 | 4 (4) | 3.7 | 4.4 | UHD 630 | 350–1150 | 8 MB | 62 W | April 2019 | US $154 |
| Core i3 | 9300 | 4 (4) | 3.7 | 4.3 | UHD 630 | 350–1150 | 8 MB | 62 W | April 2019 | US $143 |
| Core i3 | 9300T | 4 (4) | 3.2 | 3.8 | UHD 630 | 350–1100 | 8 MB | 35 W | April 2019 | US $143 |
| Core i3 | 9100 | 4 (4) | 3.6 | 4.2 | UHD 630 | 350–1100 | 6 MB | 65 W | April 2019 | US $122 |
| Core i3 | 9100F | 4 (4) | 3.6 | 4.2 | — | — | | 6 MB | 65 W | April 2019 | US $122 |
| Core i3 | 9100T | 4 (4) | 3.1 | 3.7 | UHD 630 | 350–1100 | 6 MB | 35 W | April 2019 | US $122 |

#### Skylake-X (9xxx)

Common features:
* Socket: LGA 2066.
* All the CPUs support quad-channel DDR4-2666 RAM.
* All CPU models provide 44 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* No integrated graphics.
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 14 nm.
* X-suffix, and XE-suffix processors have an unlocked multiplier and can be overclocked.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Clock rate (GHz) | Smart Cache | TDP | Release date | MSRP |
| Processor branding | Model | Cores (Threads) | Base | Turbo 2.0 | Turbo 3.0 | Smart Cache | TDP | Release date | MSRP |
| Core i9 | 9990XE | 14 (28) | 4.0 | 5.0 | 5.0 | 19.25 MB | 255 W | January 2019 | OEM |
| Core i9 | 9980XE | 18 (36) | 3.0 | 4.4 | 4.5 | 24.75 MB | 165 W | Q4 2018 | US $1979 |
| Core i9 | 9960X | 16 (32) | 3.1 | 4.4 | 4.5 | 22 MB | 165 W | Q4 2018 | US $1684 |
| Core i9 | 9940X | 14 (28) | 3.3 | 4.4 | 4.5 | 19.25 MB | 165 W | Q4 2018 | US $1387 |
| Core i9 | 9920X | 12 (24) | 3.5 | 4.4 | 4.5 | 19.25 MB | 165 W | Q4 2018 | US $1189 |
| Core i9 | 9900X | 10 (20) | 3.5 | 4.4 | 4.5 | 19.25 MB | 165 W | Q4 2018 | US $989 |
| Core i9 | 9820X | 10 (20) | 3.3 | 4.1 | 4.2 | 16.5 MB | 165 W | Q4 2018 | US $889 |
| Core i7 | 9800X | 8 (16) | 3.8 | 4.4 | 4.5 | 16.5 MB | 165 W | November 2018 | US $589 |

### Core i (10th gen)
#### Comet Lake-S

Common features:
* Socket: LGA 1200.
* All the CPUs support dual-channel DDR4 RAM at up to 2666 MT/s speed. Models i7 and up support it at up to 2933 MT/s speed.
* All CPU models provide 16 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 4-lane bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 14 nm.
* K-suffix processors have an unlocked multiplier and can be overclocked.
* i9 and i7 models support Turbo Boost 3.0, while i5 and i3 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date | MSRP |
| Processor branding | Model | Cores (Threads) | Base | Turbo | TVB | Model | Clock (MHz) | Smart Cache | TDP | Release date | MSRP |
| Core i9 | 10900K | 10 (20) | 3.7 | 5.2 | 5.3 | UHD 630 | 350–1200 | 20 MB | 125 W | April 2020 | US $488 |
| Core i9 | 10900KF | 10 (20) | 3.7 | 5.2 | 5.3 | — | — | 20 MB | 125 W | April 2020 | US $472 |
| Core i9 | 10910 | 10 (20) | 3.6 | 5.0 | — | UHD 630 | 350–1200 | 20 MB | 125 W | Q3 2020 | OEM |
| Core i9 | 10900 | 10 (20) | 2.8 | 5.1 | 5.2 | UHD 630 | 350–1200 | 20 MB | 65 W | April 2020 | US $439 |
| Core i9 | 10900F | 10 (20) | 2.8 | 5.1 | 5.2 | — | — | 20 MB | 65 W | April 2020 | US $422 |
| Core i9 | 10900T | 10 (20) | 1.9 | 4.6 | — | UHD 630 | 350–1200 | 20 MB | 35 W | April 2020 | US $439 |
| Core i9 | 10850K | 10 (20) | 3.6 | 5.1 | 5.2 | UHD 630 | 350–1200 | 20 MB | 125 W | July 2020 | US $453 |
| Core i7 | 10700K | 8 (16) | 3.8 | 5.1 | — | UHD 630 | 350–1200 | 16 MB | 125 W | May 2020 | US $374 |
| Core i7 | 10700KF | 8 (16) | 3.8 | 5.1 | — | — | — | 16 MB | 125 W | May 2020 | US $349 |
| Core i7 | 10700 | 8 (16) | 2.9 | 4.8 | — | UHD 630 | 350–1200 | 16 MB | 65 W | May 2020 | US $323 |
| Core i7 | 10700F | 8 (16) | 2.9 | 4.8 | — | — | — | 16 MB | 65 W | May 2020 | US $298 |
| Core i7 | 10700T | 8 (16) | 2.0 | 4.5 | — | UHD 630 | 350–1200 | 16 MB | 35 W | May 2020 | US $325 |
| Core i5 | 10600K | 6 (12) | 4.1 | 4.8 | — | UHD 630 | 350–1200 | 12 MB | 125 W | April 2020 | US $262 |
| Core i5 | 10600KF | 6 (12) | 4.1 | 4.8 | — | — | — | 12 MB | 125 W | April 2020 | US $237 |
| Core i5 | 10600 | 6 (12) | 3.3 | 4.8 | — | UHD 630 | 350–1200 | 12 MB | 65 W | April 2020 | US $213 |
| Core i5 | 10600T | 6 (12) | 2.4 | 4.0 | — | UHD 630 | 350–1200 | 12 MB | 35 W | April 2020 | US $213 |
| Core i5 | 10500 | 6 (12) | 3.1 | 4.5 | — | UHD 630 | 350–1150 | 12 MB | 65 W | April 2020 | US $192 |
| Core i5 | 10500T | 6 (12) | 2.3 | 3.8 | — | UHD 630 | 350–1150 | 12 MB | 35 W | April 2020 | US $192 |
| Core i5 | 10400 | 6 (12) | 2.9 | 4.3 | — | UHD 630 | 350–1100 | 12 MB | 65 W | April 2020 | US $182 |
| Core i5 | 10400F | 6 (12) | 2.9 | 4.3 | — | — | — | 12 MB | 65 W | April 2020 | US $157 |
| Core i5 | 10400T | 6 (12) | 2.0 | 3.6 | — | UHD 630 | 350–1100 | 12 MB | 35 W | April 2020 | US $182 |
| Core i3 | 10320 | 4 (8) | 3.8 | 4.6 | — | UHD 630 | 350–1150 | 8 MB | 65 W | April 2020 | US $154 |
| Core i3 | 10300 | 4 (8) | 3.7 | 4.4 | — | UHD 630 | 350–1150 | 8 MB | 65 W | April 2020 | US $143 |
| Core i3 | 10300T | 4 (8) | 3.0 | 3.9 | — | UHD 630 | 350–1100 | 8 MB | 35 W | April 2020 | US $143 |
| Core i3 | 10100 | 4 (8) | 3.6 | 4.3 | — | UHD 630 | 350–1100 | 6 MB | 65 W | April 2020 | US $122 |
| Core i3 | 10100F | 4 (8) | 3.6 | 4.3 | — | — | — | 6 MB | 65 W | October 2020 | US $97 |
| Core i3 | 10100T | 4 (8) | 3.0 | 3.8 | — | UHD 630 | 350–1100 | 6 MB | 35 W | April 2020 | US $122 |

#### Comet Lake-S (refresh)

Released on the same day as the 11th gen Rocket Lake-S desktop processors.
Common features:
* Socket: LGA 1200.
* All the CPUs support dual-channel DDR4-2666 RAM.
* All CPU models provide 16 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 4-lane bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 14 nm.
* All models support Turbo Boost 2.0.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date | MSRP |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date | MSRP |
| Core i5 | 10505 | 6 (12) | 3.2 | 4.6 | UHD 630 | 350–1200 | 12 MB | 65 W | March 2021 | US $192 |
| Core i3 | 10325 | 4 (8) | 3.9 | 4.7 | UHD 630 | 350–1150 | 8 MB | 65 W | March 2021 | US $154 |
| Core i3 | 10305 | 4 (8) | 3.8 | 4.5 | UHD 630 | 350–1150 | 8 MB | 65 W | March 2021 | US $143 |
| Core i3 | 10305T | 4 (8) | 3.0 | 4.0 | UHD 630 | 350–1100 | 8 MB | 35 W | March 2021 | US $143 |
| Core i3 | 10105 | 4 (8) | 3.7 | 4.4 | UHD 630 | 350–1100 | 6 MB | 65 W | March 2021 | US $122 |
| Core i3 | 10105F | 4 (8) | 3.7 | 4.4 | — | — | 6 MB | 65 W | March 2021 | US $97 |
| Core i3 | 10105T | 4 (8) | 3.0 | 3.9 | UHD 630 | 350–1100 | 6 MB | 35 W | March 2021 | US $122 |

#### Cascade Lake-X (10xxx)

Common features:
* Socket: LGA 2066.
* All the CPUs support quad-channel DDR4-2933 RAM.
* All CPU models provide 48 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* No integrated graphics.
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 14 nm.
* X-suffix, and XE-suffix processors have an unlocked multiplier and can be overclocked.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Clock rate (GHz) | Smart Cache | TDP | Release date | MSRP |
| Processor branding | Model | Cores (Threads) | Base | Turbo 2.0 | Turbo 3.0 | Smart Cache | TDP | Release date | MSRP |
| Core i9 | 10980XE | 18 (36) | 3.0 | 4.6 | 4.8 | 24.75 MB | 165 W | October 2019 | US $979 |
| Core i9 | 10940X | 14 (28) | 3.3 | 4.6 | 4.8 | 19.25 MB | 165 W | October 2019 | US $784 |
| Core i9 | 10920X | 12 (24) | 3.5 | 4.6 | 4.8 | 19.25 MB | 165 W | October 2019 | US $689 |
| Core i9 | 10900X | 10 (20) | 3.7 | 4.5 | 4.7 | 19.25 MB | 165 W | October 2019 | US $590 |

### Core i (11th gen)
#### Rocket Lake-S

Common features:
* Socket: LGA 1200.
* All the CPUs support dual-channel DDR4-3200 RAM. The Core i9 K/KF processors enable a 1:1 ratio of DRAM to memory controller by default at DDR4-3200, whereas the Core i9 non K/KF and all other CPUs listed below enable a 2:1 ratio of DRAM to memory controller by default at DDR4-3200 and a 1:1 ratio by default at DDR4-2933.
* All CPU models provide 20 lanes of PCIe 4.0.
* All CPUs feature a DMI 3.0 8-lane bus to the chipset (PCH).
* L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
* L2 cache: 512 KB per core.
* Fabrication process: 14 nm.
* K-suffix processors have an unlocked multiplier and can be overclocked.
* i9 and i7 models support Turbo Boost 3.0, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date | MSRP |
| Processor branding | Model | Cores (Threads) | Base | Turbo | TVB | Model | Clock (MHz) | Smart Cache | TDP | Release date | MSRP |
| Core i9 | 11900K | 8 (16) | 3.5 | 5.2 | 5.3 | UHD 750 | 350–1300 | 16 MB | 125 W | March 2021 | US $539 |
| Core i9 | 11900KF | 8 (16) | 3.5 | 5.2 | 5.3 | — | — | 16 MB | 125 W | March 2021 | US $513 |
| Core i9 | 11900 | 8 (16) | 2.5 | 5.1 | 5.2 | UHD 750 | 350–1300 | 16 MB | 65 W | March 2021 | US $439 |
| Core i9 | 11900F | 8 (16) | 2.5 | 5.1 | 5.2 | — | — | 16 MB | 65 W | March 2021 | US $422 |
| Core i9 | 11900T | 8 (16) | 1.5 | 4.9 | — | UHD 750 | 350–1300 | 16 MB | 35 W | March 2021 | US $439 |
| Core i7 | 11700K | 8 (16) | 3.6 | 5.0 | — | UHD 750 | 350–1300 | 16 MB | 125 W | March 2021 | US $399 |
| Core i7 | 11700KF | 8 (16) | 3.6 | 5.0 | — | — | — | 16 MB | 125 W | March 2021 | US $374 |
| Core i7 | 11700 | 8 (16) | 2.5 | 4.9 | — | UHD 750 | 350–1300 | 16 MB | 65 W | March 2021 | US $323 |
| Core i7 | 11700F | 8 (16) | 2.5 | 4.9 | — | — | — | 16 MB | 65 W | March 2021 | US $298 |
| Core i7 | 11700T | 8 (16) | 1.4 | 4.6 | — | UHD 750 | 350–1300 | 16 MB | 35 W | March 2021 | US $323 |
| Core i5 | 11600K | 6 (12) | 3.9 | 4.9 | — | UHD 750 | 350–1300 | 12 MB | 125 W | March 2021 | US $262 |
| Core i5 | 11600KF | 6 (12) | 3.9 | 4.9 | — | — | — | 12 MB | 125 W | March 2021 | US $237 |
| Core i5 | 11600 | 6 (12) | 2.8 | 4.8 | — | UHD 750 | 350–1300 | 12 MB | 65 W | March 2021 | US $213 |
| Core i5 | 11600T | 6 (12) | 1.7 | 4.1 | — | UHD 750 | 350–1300 | 12 MB | 35 W | March 2021 | US $213 |
| Core i5 | 11500 | 6 (12) | 2.7 | 4.6 | — | UHD 750 | 350–1300 | 12 MB | 65 W | March 2021 | US $192 |
| Core i5 | 11500T | 6 (12) | 1.5 | 3.9 | — | UHD 750 | 350–1200 | 12 MB | 35 W | March 2021 | US $192 |
| Core i5 | 11400 | 6 (12) | 2.6 | 4.4 | — | UHD 730 | 350–1300 | 12 MB | 65 W | March 2021 | US $182 |
| Core i5 | 11400F | 6 (12) | 2.6 | 4.4 | — | — | — | 12 MB | 65 W | March 2021 | US $157 |
| Core i5 | 11400T | 6 (12) | 1.3 | 3.7 | — | UHD 730 | 350–1200 | 12 MB | 35 W | March 2021 | US $182 |

#### Tiger Lake-B

Common features:
* Socket: BGA 1787 (soldered).
* All the CPUs support dual-channel DDR4-3200 RAM.
* All CPU models provide 20 lanes of PCIe 4.0.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
* L2 cache: 1.25 MB per core.
* Fabrication process: 10 nm.
* K-suffix processors have an unlocked multiplier and can be overclocked.
* These CPUs were sold to OEMs only.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i9 | 11900KB | 8 (16) | 3.3 | 4.9 | UHD Graphics (32 EU) | 350–1450 | 24 MB | 55–65 W | May 2021 |
| Core i7 | 11700B | 8 (16) | 3.2 | 4.8 | UHD Graphics (32 EU) | 350–1450 | 24 MB | 55–65 W | May 2021 |
| Core i5 | 11500B | 6 (12) | 3.3 | 4.6 | UHD Graphics (32 EU) | 350–1450 | 12 MB | 65 W | May 2021 |
| Core i3 | 11100B | 4 (8) | 3.6 | 4.4 | UHD Graphics (16 EU) | 350–1400 | 12 MB | 65 W | May 2021 |

### Core i (12th gen)
#### Alder Lake-S

Common features:
* Socket: LGA 1700.
* All the CPUs support dual-channel DDR4-3200 or DDR5-4800 RAM.
* All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
* All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
* L1 cache:
** P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
** E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
* L2 cache:
** P-cores: 1.25 MB per core.
** E-cores: 2 MB per E-core cluster (each "cluster" contains four cores)
* Fabrication process: Intel 7.
* K-suffix processors have an unlocked multiplier and can be overclocked.
* i9 and i7 models support Turbo Boost 3.0 on the P-cores, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.
| Processor branding | Model | P-core (performance) | P-core (performance) | P-core (performance) | P-core (performance) | E-core (efficiency) | E-core (efficiency) | E-core (efficiency) | Integrated GPU | Integrated GPU | Smart Cache | TDP | TDP | Release date | MSRP |
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Clock rate (GHz) | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date | MSRP |
| Processor branding | Model | Cores (Threads) | Base | Turbo | TVB | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date | MSRP |
| Core i9 | 12900KS | 8 (16) | 3.4 | 5.3 | 5.5 | 8 (8) | 2.5 | 4.0 | UHD 770 | 300–1550 | 30 MB | 150 W | 241 W | April 2022 | US $739 |
| Core i9 | 12900K | 8 (16) | 3.2 | 5.2 | — | 8 (8) | 2.4 | 3.9 | UHD 770 | 300–1550 | 30 MB | 125 W | 241 W | November 2021 | US $589 |
| Core i9 | 12900KF | 8 (16) | 3.2 | 5.2 | — | 8 (8) | 2.4 | 3.9 | — | — | 30 MB | 125 W | 241 W | November 2021 | US $564 |
| Core i9 | 12900 | 8 (16) | 2.4 | 5.1 | — | 8 (8) | 1.8 | 3.8 | UHD 770 | 300–1550 | 30 MB | 65 W | 202 W | January 2022 | US $489 |
| Core i9 | 12900F | 8 (16) | 2.4 | 5.1 | — | 8 (8) | 1.8 | 3.8 | — | — | 30 MB | 65 W | 202 W | January 2022 | US $464 |
| Core i9 | 12900T | 8 (16) | 1.4 | 4.9 | — | 8 (8) | 1.0 | 3.6 | UHD 770 | 300–1550 | 30 MB | 35 W | 106 W | January 2022 | US $489 |
| Core i7 | 12700K | 8 (16) | 3.6 | 5.0 | — | 4 (4) | 2.7 | 3.8 | UHD 770 | 300–1500 | 25 MB | 125 W | 190 W | November 2021 | US $409 |
| Core i7 | 12700KF | 8 (16) | 3.6 | 5.0 | — | 4 (4) | 2.7 | 3.8 | — | — | 25 MB | 125 W | 190 W | November 2021 | US $384 |
| Core i7 | 12700 | 8 (16) | 2.1 | 4.9 | — | 4 (4) | 1.6 | 3.6 | UHD 770 | 300–1500 | 25 MB | 65 W | 180 W | January 2022 | US $339 |
| Core i7 | 12700F | 8 (16) | 2.1 | 4.9 | — | 4 (4) | 1.6 | 3.6 | — | — | 25 MB | 65 W | 180 W | January 2022 | US $314 |
| Core i7 | 12700T | 8 (16) | 1.4 | 4.7 | — | 4 (4) | 1.0 | 3.4 | UHD 770 | 300–1500 | 25 MB | 35 W | 106 W | January 2022 | US $339 |
| Core i5 | 12600K | 6 (12) | 3.7 | 4.9 | — | 4 (4) | 2.8 | 3.6 | UHD 770 | 300–1450 | 20 MB | 125 W | 150 W | November 2021 | US $289 |
| Core i5 | 12600KF | 6 (12) | 3.7 | 4.9 | — | 4 (4) | 2.8 | 3.6 | — | — | 20 MB | 125 W | 150 W | November 2021 | US $264 |
| Core i5 | 12600 | 6 (12) | 3.3 | 4.8 | — | — | — | — | UHD 770 | 300–1450 | 18 MB | 65 W | 117 W | January 2022 | US $223 |
| Core i5 | 12600T | 6 (12) | 2.1 | 4.6 | — | — | — | — | UHD 770 | 300–1450 | 18 MB | 35 W | 74 W | January 2022 | US $223 |
| Core i5 | 12500 | 6 (12) | 3.0 | 4.6 | — | — | — | — | UHD 770 | 300–1450 | 18 MB | 65 W | 117 W | January 2022 | US $202 |
| Core i5 | 12500T | 6 (12) | 2.0 | 4.4 | — | — | — | — | UHD 770 | 300–1450 | 18 MB | 35 W | 74 W | January 2022 | US $202 |
| Core i5 | 12490F | 6 (12) | 3.0 | 4.6 | — | — | — | — | — | — | 20 MB | 65 W | 117 W | February 2022 | CN ¥1599 |
| Core i5 | 12400 | 6 (12) | 2.5 | 4.4 | — | — | — | — | UHD 730 | 300–1450 | 18 MB | 65 W | 117 W | January 2022 | US $202 |
| Core i5 | 12400F | 6 (12) | 2.5 | 4.4 | — | — | — | — | — | — | 18 MB | 65 W | 117 W | January 2022 | US $192 |
| Core i5 | 12400T | 6 (12) | 1.8 | 4.2 | — | — | — | — | UHD 730 | 350–1450 | 18 MB | 35 W | 74 W | January 2022 | US $202 |
| Core i3 | 12300 | 4 (8) | 3.5 | 4.4 | — | — | — | — | UHD 730 | 350–1450 | 12 MB | 60 W | 89 W | January 2022 | US $143 |
| Core i3 | 12300T | 4 (8) | 2.3 | 4.2 | — | — | — | — | UHD 730 | 350–1450 | 12 MB | 35 W | 69 W | January 2022 | US $143 |
| Core i3 | 12100 | 4 (8) | 3.3 | 4.3 | — | — | — | — | UHD 730 | 300–1400 | 12 MB | 60 W | 89 W | January 2022 | US $122 |
| Core i3 | 12100F | 4 (8) | 3.3 | 4.3 | — | — | — | — | — | — | 12 MB | 58 W | 89 W | January 2022 | US $97 |
| Core i3 | 12100T | 4 (8) | 2.2 | 4.1 | — | — | — | — | UHD 730 | 300–1400 | 12 MB | 35 W | 69 W | January 2022 | US $122 |

### Core i (13th gen)
#### Raptor Lake-S

Common features:
* Socket: LGA 1700.
* All the CPUs support dual-channel DDR4-3200 or DDR5-5600 RAM.
* All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
* All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
* L1 cache:
** P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
** E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
* L2 cache:
** P-cores: 2 MB per core on i5-13600K/KF and above models, 1.25 MB per core on 13600 and below models.
** E-cores: 4 MB per E-core cluster on i5-13600K/KF and above models, 2 MB per cluster on 13600 and below models (each "cluster" contains four cores).
* Fabrication process: Intel 7.
* K-suffix processors have an unlocked multiplier and can be overclocked.
* i9 and i7 models support Turbo Boost 3.0 on the P-cores, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.
| Processor branding | Model | P-core (performance) | P-core (performance) | P-core (performance) | P-core (performance) | E-core (efficiency) | E-core (efficiency) | E-core (efficiency) | Integrated GPU | Integrated GPU | Smart Cache | TDP | TDP | Release date | MSRP |
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Clock rate (GHz) | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date | MSRP |
| Processor branding | Model | Cores (Threads) | Base | Turbo | TVB | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date | MSRP |
| Core i9 | 13900KS | 8 (16) | 3.2 | 5.8 | 6.0 | 16 (16) | 2.4 | 4.3 | UHD 770 | 300–1650 | 36 MB | 150 W | 253 W | January 2023 | US $689 |
| Core i9 | 13900K | 8 (16) | 3.0 | 5.7 | 5.8 | 16 (16) | 2.2 | 4.3 | UHD 770 | 300–1650 | 36 MB | 125 W | 253 W | October 2022 | US $589 |
| Core i9 | 13900KF | 8 (16) | 3.0 | 5.7 | 5.8 | 16 (16) | 2.2 | 4.3 | — | — | 36 MB | 125 W | 253 W | October 2022 | US $564 |
| Core i9 | 13900 | 8 (16) | 2.0 | 5.5 | 5.6 | 16 (16) | 1.5 | 4.2 | UHD 770 | 300–1650 | 36 MB | 65 W | 219 W | January 2023 | US $549 |
| Core i9 | 13900F | 8 (16) | 2.0 | 5.5 | 5.6 | 16 (16) | 1.5 | 4.2 | — | — | 36 MB | 65 W | 219 W | January 2023 | US $524 |
| Core i9 | 13900T | 8 (16) | 1.1 | 5.3 | — | 16 (16) | 0.8 | 3.9 | UHD 770 | 300–1650 | 36 MB | 35 W | 106 W | January 2023 | US $549 |
| Core i7 | 13790F | 8 (16) | 2.1 | 5.2 | — | 8 (8) | 1.5 | 4.1 | — | — | 33 MB | 65 W | 219 W | February 2023 | CN ¥2999 |
| Core i7 | 13700K | 8 (16) | 3.4 | 5.4 | — | 8 (8) | 2.5 | 4.2 | UHD 770 | 300–1600 | 30 MB | 125 W | 253 W | October 2022 | US $409 |
| Core i7 | 13700KF | 8 (16) | 3.4 | 5.4 | — | 8 (8) | 2.5 | 4.2 | — | — | 30 MB | 125 W | 253 W | October 2022 | US $384 |
| Core i7 | 13700 | 8 (16) | 2.1 | 5.2 | — | 8 (8) | 1.5 | 4.1 | UHD 770 | 300–1600 | 30 MB | 65 W | 219 W | January 2023 | US $384 |
| Core i7 | 13700F | 8 (16) | 2.1 | 5.2 | — | 8 (8) | 1.5 | 4.1 | — | — | 30 MB | 65 W | 219 W | January 2023 | US $359 |
| Core i7 | 13700T | 8 (16) | 1.4 | 4.9 | — | 8 (8) | 1.0 | 3.6 | UHD 770 | 300–1600 | 30 MB | 35 W | 106 W | January 2023 | US $384 |
| Core i5 | 13600K | 6 (12) | 3.5 | 5.1 | — | 8 (8) | 2.6 | 3.9 | UHD 770 | 300–1500 | 24 MB | 125 W | 181 W | October 2022 | US $319 |
| Core i5 | 13600KF | 6 (12) | 3.5 | 5.1 | — | 8 (8) | 2.6 | 3.9 | — | — | 24 MB | 125 W | 181 W | October 2022 | US $294 |
| Core i5 | 13600 | 6 (12) | 2.7 | 5.0 | — | 8 (8) | 2.0 | 3.7 | UHD 770 | 300–1550 | 24 MB | 65 W | 154 W | January 2023 | US $255 |
| Core i5 | 13600T | 6 (12) | 1.8 | 4.8 | — | 8 (8) | 1.3 | 3.4 | UHD 770 | 300–1550 | 24 MB | 35 W | 92 W | January 2023 | US $255 |
| Core i5 | 13500 | 6 (12) | 2.5 | 4.8 | — | 8 (8) | 1.8 | 3.5 | UHD 770 | 300–1550 | 24 MB | 65 W | 154 W | January 2023 | US $232 |
| Core i5 | 13500T | 6 (12) | 1.6 | 4.6 | — | 8 (8) | 1.2 | 3.2 | UHD 770 | 300–1550 | 24 MB | 35 W | 92 W | January 2023 | US $232 |
| Core i5 | 13490F | 6 (12) | 2.5 | 4.8 | — | 4 (4) | 1.8 | 3.5 | — | — | 24 MB | 65 W | 148 W | February 2023 | CN ¥1599 |
| Core i5 | 13400 | 6 (12) | 2.5 | 4.6 | — | 4 (4) | 1.8 | 3.3 | UHD 730 | 300–1550 | 20 MB | 65 W | 154 W | January 2023 | US $221 |
| Core i5 | 13400F | 6 (12) | 2.5 | 4.6 | — | 4 (4) | 1.8 | 3.3 | — | — | 20 MB | 65 W | 148 W | January 2023 | US $196 |
| Core i5 | 13400T | 6 (12) | 1.3 | 4.4 | — | 4 (4) | 1.0 | 3.0 | UHD 730 | 300–1550 | 20 MB | 35 W | 82 W | January 2023 | US $221 |
| Core i3 | 13100 | 4 (8) | 3.4 | 4.5 | — | — | — | — | UHD 730 | 300–1500 | 12 MB | 60 W | 89 W | January 2023 | US $134 |
| Core i3 | 13100F | 4 (8) | 3.4 | 4.5 | — | — | — | — | — | — | 12 MB | 60 W | 89 W | January 2023 | US $109 |
| Core i3 | 13100T | 4 (8) | 2.5 | 4.2 | — | — | — | — | UHD 730 | 300–1500 | 12 MB | 35 W | 69 W | January 2023 | US $134 |

### Core i (14th gen)
#### Raptor Lake-S Refresh

Common features:
* Socket: LGA 1700.
* All the CPUs support dual-channel DDR4-3200 or DDR5-5600 RAM.
* All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
* All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
* L1 cache:
** P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
** E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
* L2 cache:
** P-cores: 2 MB per core on i5-14600/T/K/KF and above models, 1.25 MB per core on 14500 and below models.
** E-cores: 4 MB per E-core cluster on i5-14600/T/K/KF and above models, 2 MB per cluster on 14500 and below models (each "cluster" contains four cores).
* Fabrication process: Intel 7.
* K-suffix processors have an unlocked multiplier and can be overclocked.
* i9 and i7 models support Turbo Boost 3.0 on the P-cores, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.
| Processor branding | Model | P-core (performance) | P-core (performance) | P-core (performance) | P-core (performance) | E-core (efficiency) | E-core (efficiency) | E-core (efficiency) | Integrated GPU | Integrated GPU | Smart Cache | TDP | TDP | Release date | MSRP |
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Clock rate (GHz) | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date | MSRP |
| Processor branding | Model | Cores (Threads) | Base | Turbo | TVB | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date | MSRP |
| Core i9 | 14900KS | 8 (16) | 3.2 | 5.9 | 6.2 | 16 (16) | 2.4 | 4.5 | UHD 770 | 300–1650 | 36 MB | 150 W | 253 W | March 2024 | US $689 |
| Core i9 | 14900K | 8 (16) | 3.2 | 5.8 | 6.0 | 16 (16) | 2.4 | 4.4 | UHD 770 | 300–1650 | 36 MB | 125 W | 253 W | October 2023 | US $589 |
| Core i9 | 14900KF | 8 (16) | 3.2 | 5.8 | 6.0 | 16 (16) | 2.4 | 4.4 | — | — | 36 MB | 125 W | 253 W | October 2023 | US $564 |
| Core i9 | 14900 | 8 (16) | 2.0 | 5.6 | 5.8 | 16 (16) | 1.5 | 4.3 | UHD 770 | 300–1650 | 36 MB | 65 W | 219 W | January 2024 | US $549 |
| Core i9 | 14900F | 8 (16) | 2.0 | 5.6 | 5.8 | 16 (16) | 1.5 | 4.3 | — | — | 36 MB | 65 W | 219 W | January 2024 | US $524 |
| Core i9 | 14900T | 8 (16) | 1.1 | 5.5 | — | 16 (16) | 0.9 | 3.7 | UHD 770 | 300–1650 | 36 MB | 35 W | 106 W | January 2024 | US $549 |
| Core i7 | 14790F | 8 (16) | 2.1 | 5.4 | — | 8 (8) | 1.5 | 4.2 | — | — | 36 MB | 65 W | 219 W | January 2024 | China only |
| Core i7 | 14700K | 8 (16) | 3.4 | 5.6 | — | 12 (12) | 2.5 | 4.3 | UHD 770 | 300–1600 | 33 MB | 125 W | 253 W | October 2023 | US $409 |
| Core i7 | 14700KF | 8 (16) | 3.4 | 5.6 | — | 12 (12) | 2.5 | 4.3 | — | — | 33 MB | 125 W | 253 W | October 2023 | US $384 |
| Core i7 | 14700 | 8 (16) | 2.1 | 5.4 | — | 12 (12) | 1.5 | 4.2 | UHD 770 | 300–1600 | 33 MB | 65 W | 219 W | January 2024 | US $384 |
| Core i7 | 14700F | 8 (16) | 2.1 | 5.4 | — | 12 (12) | 1.5 | 4.2 | — | — | 33 MB | 65 W | 219 W | January 2024 | US $359 |
| Core i7 | 14700T | 8 (16) | 1.3 | 5.2 | — | 12 (12) | 0.9 | 3.7 | UHD 770 | 300–1600 | 33 MB | 35 W | 106 W | January 2024 | US $384 |
| Core i5 | 14600K | 6 (12) | 3.5 | 5.3 | — | 8 (8) | 2.6 | 4.0 | UHD 770 | 300–1550 | 24 MB | 125 W | 181 W | October 2023 | US $319 |
| Core i5 | 14600KF | 6 (12) | 3.5 | 5.3 | — | 8 (8) | 2.6 | 4.0 | — | — | 24 MB | 125 W | 181 W | October 2023 | US $294 |
| Core i5 | 14600 | 6 (12) | 2.7 | 5.2 | — | 8 (8) | 2.0 | 3.9 | UHD 770 | 300–1550 | 24 MB | 65 W | 154 W | January 2024 | US $255 |
| Core i5 | 14600T | 6 (12) | 1.8 | 5.1 | — | 8 (8) | 1.3 | 3.6 | UHD 770 | 300–1550 | 24 MB | 35 W | 92 W | January 2024 | US $255 |
| Core i5 | 14500 | 6 (12) | 2.6 | 5.0 | — | 8 (8) | 1.9 | 3.7 | UHD 770 | 300–1550 | 24 MB | 65 W | 154 W | January 2024 | US $232 |
| Core i5 | 14500T | 6 (12) | 1.7 | 4.8 | — | 8 (8) | 1.2 | 3.4 | UHD 770 | 300–1550 | 24 MB | 35 W | 92 W | January 2024 | US $232 |
| Core i5 | 14490F | 6 (12) | 2.8 | 4.9 | — | 4 (4) | 2.1 | 3.7 | — | — | 24 MB | 65 W | 148 W | January 2024 | China only |
| Core i5 | 14400 | 6 (12) | 2.5 | 4.7 | — | 4 (4) | 1.8 | 3.5 | UHD 730 | 300–1550 | 20 MB | 65 W | 148 W | January 2024 | US $221 |
| Core i5 | 14400F | 6 (12) | 2.5 | 4.7 | — | 4 (4) | 1.8 | 3.5 | — | — | 20 MB | 65 W | 148 W | January 2024 | US $196 |
| Core i5 | 14400T | 6 (12) | 1.5 | 4.5 | — | 4 (4) | 1.1 | 3.2 | UHD 730 | 300–1550 | 20 MB | 35 W | 82 W | January 2024 | US $221 |
| Core i3 | 14100 | 4 (8) | 3.5 | 4.7 | — | — | — | — | UHD 730 | 300–1500 | 12 MB | 60 W | 110 W | January 2024 | US $134 |
| Core i3 | 14100F | 4 (8) | 3.5 | 4.7 | — | — | — | — | — | — | 12 MB | 60 W | 110 W | January 2024 | US $109 |
| Core i3 | 14100T | 4 (8) | 2.7 | 4.4 | — | — | — | — | UHD 730 | 300–500 | 12 MB | 35 W | 69 W | January 2024 | US $134 |

### Core Ultra (Series 2)
#### Arrow Lake-S

Common features:
* Socket: LGA 1851.
* All the CPUs support up to dual-channel DDR5-5600 (UDIMM) or DDR5-6400 (CUDIMM) RAM.
* All the CPUs provide 20 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
* All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
* L1 cache:
** P-cores: 112 KB (48 KB (12-Way) data + 64 KB (16-Way) instructions) per core.
** E-cores: 96 KB (32 KB (8-Way) data + 64 KB (16-Way) instructions) per core.
* L2 cache:
** P-cores: 3 MB (12-Way) per core.
** E-cores: 4 MB (16-Way) per E-core cluster (each "cluster" contains four cores).
* Fabrication process: Compute Tile (Contains the CPU cores) TSMC's N3B node.
* K-suffix processors have an unlocked multiplier and can be overclocked.
* Core Ultra 9 and Core Ultra 7 models support Turbo Boost 3.0 on the P-cores, while Core Ultra 5 models only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.
| Processor branding | Model | P-core (performance) | P-core (performance) | P-core (performance) | P-core (performance) | E-core (efficiency) | E-core (efficiency) | E-core (efficiency) | Integrated GPU | Integrated GPU | Smart Cache | NPU (TOPS) | TDP | TDP | Release date | MSRP |
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Clock rate (GHz) | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Model | Clock (MHz) | Smart Cache | NPU (TOPS) | Base | Max. Turbo | Release date | MSRP |
| Processor branding | Model | Cores (Threads) | Base | Turbo | TVB | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | NPU (TOPS) | Base | Max. Turbo | Release date | MSRP |
| Core Ultra 9 | 285K | 8 (8) | 3.7 | 5.6 | 5.7 | 16 (16) | 3.2 | 4.6 | Intel Graphics (4 Xe-cores) | 300–2000 | 36 MB | 13 | 125 W | 250 W | October 2024 | US $589 |
| Core Ultra 9 | 285 | 8 (8) | 2.5 | 5.5 | 5.6 | 16 (16) | 1.9 | 4.6 | Intel Graphics (4 Xe-cores) | 300–2000 | 36 MB | 13 | 65 W | 182 W | January 2025 | US $549 |
| Core Ultra 9 | 285T | 8 (8) | 1.4 | 5.4 | — | 16 (16) | 1.2 | 4.6 | Intel Graphics (4 Xe-cores) | 300–2000 | 36 MB | 13 | 35 W | 112 W | January 2025 | US $549 |
| Core Ultra 7 | 265K | 8 (8) | 3.9 | 5.5 | — | 12 (12) | 3.3 | 4.6 | Intel Graphics (4 Xe-cores) | 300–2000 | 30 MB | 13 | 125 W | 250 W | October 2024 | US $394 |
| Core Ultra 7 | 265KF | 8 (8) | 3.9 | 5.5 | — | 12 (12) | 3.3 | 4.6 | — | — | 30 MB | 13 | 125 W | 250 W | October 2024 | US $379 |
| Core Ultra 7 | 265 | 8 (8) | 2.4 | 5.3 | — | 12 (12) | 1.8 | 4.6 | Intel Graphics (4 Xe-cores) | 300-1950 | 30 MB | 13 | 65 W | 182 W | January 2025 | US $384 |
| Core Ultra 7 | 265F | 8 (8) | 2.4 | 5.3 | — | 12 (12) | 1.8 | 4.6 | — | — | 30 MB | 13 | 65 W | 182 W | January 2025 | US $369 |
| Core Ultra 7 | 265T | 8 (8) | 1.5 | 5.3 | — | 12 (12) | 1.2 | 4.6 | Intel Graphics (4 Xe-cores) | 300-1950 | 30 MB | 13 | 35 W | 112 W | January 2025 | US $384 |
| Core Ultra 5 | 245K | 6 (6) | 4.2 | 5.2 | — | 8 (8) | 3.6 | 4.6 | Intel Graphics (4 Xe-cores) | 300–1900 | 24 MB | 13 | 125 W | 159 W | October 2024 | US $309 |
| Core Ultra 5 | 245KF | 6 (6) | 4.2 | 5.2 | — | 8 (8) | 3.6 | 4.6 | — | — | 24 MB | 13 | 125 W | 159 W | October 2024 | US $294 |
| Core Ultra 5 | 245 | 6 (6) | 3.5 | 5.1 | — | 8 (8) | 3.0 | 4.5 | Intel Graphics (4 Xe-cores) | 300–1900 | 24 MB | 13 | 65 W | 121 W | January 2025 | US $270 |
| Core Ultra 5 | 245T | 6 (6) | 2.2 | 5.1 | — | 8 (8) | 1.7 | 4.5 | Intel Graphics (4 Xe-cores) | 300–1900 | 24 MB | 13 | 35 W | 114 W | January 2025 | US $270 |
| Core Ultra 5 | 235 | 6 (6) | 3.4 | 5.0 | — | 8 (8) | 2.9 | 4.4 | Intel Graphics (3 Xe-cores) | 300–2000 | 24 MB | 13 | 65 W | 121 W | January 2025 | US $247 |
| Core Ultra 5 | 235T | 6 (6) | 2.2 | 5.0 | — | 8 (8) | 1.6 | 4.4 | Intel Graphics (3 Xe-cores) | 300–2000 | 24 MB | 13 | 35 W | 114 W | January 2025 | US $247 |
| Core Ultra 5 | 225 | 6 (6) | 3.3 | 4.9 | — | 4 (4) | 2.7 | 4.4 | Intel Graphics (2 Xe-cores) | 300–1800 | 20 MB | 13 | 65 W | 121 W | January 2025 | US $236 |
| Core Ultra 5 | 225F | 6 (6) | 3.3 | 4.9 | — | 4 (4) | 2.7 | 4.4 | — | — | 20 MB | 13 | 65 W | 121 W | January 2025 | US $221 |
| Core Ultra 5 | 225T | 6 (6) | 2.5 | 4.9 | — | 4 (4) | 1.9 | 4.4 | Intel Graphics (2 Xe-cores) | 300–1800 | 20 MB | 13 | 35 W | 114 W | January 2025 | ? |

## Mobile processors

Release timelineMobile processors :
| 2009 | Nehalem microarchitecture (1st generation) |
| 2010 | Westmere microarchitecture (1st generation) |
| 2011 | Sandy Bridge microarchitecture (2nd generation) |
| 2012 | Ivy Bridge microarchitecture (3rd generation) |
| 2013 | Haswell microarchitecture (4th generation) |
| 2014 |
| 2015 | Broadwell microarchitecture (5th generation) |
| 2015 | Skylake microarchitecture (6th generation) |
| 2016 |
| 2017 | Kaby Lake microarchitecture (7th/8th generation) |
| 2018 | Coffee Lake microarchitecture (8th generation) |
| 2019 | Comet Lake microarchitecture (10th generation) |
| 2019 | Ice Lake (10th generation) |
| 2020 | Tiger Lake (11th generation) |
| 2021 |
| 2022 | Alder Lake (12th generation) |
| 2023 | Raptor Lake (13th generation) |
| 2023 | Raptor Lake (14th generation) |

### Core
#### Yonah

| Model | Clock rate | L2 cache | FSB | Mult. | Voltage | TDP | Socket | Release date | Release price (USD) |
| Core Solo U1300 | 1.07 GHz | 2 MB | 533 MT/s | 8× | 0.95–1.05 V | 5.5 W | Socket 479/FC-μBGA | April 2006 | $241 |
| Core Solo U1400 | 1.2 GHz | 2 MB | 533 MT/s | 9× | 0.95–1.05 V | 5.5 W | Socket 479/FC-μBGA | April 2006 | $262 |
| Core Solo U1500 | 1.33 GHz | 2 MB | 533 MT/s | 10× | 0.85–1.1 V | 5.5 W | Socket 479/FC-μBGA | January 2007 | $262 |
| Core Duo U2400 | 1.07 GHz | 2 MB | 533 MT/s | 8× | 0.8–1.1 V | 9 W | Socket 479/FC-μBGA | June 2006 | $262 |
| Core Duo U2500 | 1.2 GHz | 2 MB | 533 MT/s | 9× | 0.8–1.1 V | 9 W | Socket 479/FC-μBGA | June 2006 | $289 |
| Core Duo L2300 | 1.5 GHz | 2 MB | 667 MT/s | 9× | 0.762–1.212 V | 15 W | Socket 479/FC-μBGA | January 2006 | $284 |
| Core Duo L2400 | 1.67 GHz | 2 MB | 667 MT/s | 10× | 0.762–1.212 V | 15 W | Socket 479/FC-μBGA | January 2006 | $316 |
| Core Duo L2500 | 1.83 GHz | 2 MB | 667 MT/s | 11× | 0.762–1.212 V | 15 W | Socket 479/FC-μBGA | September 2006 | $316 |
| Core Solo T1200 | 1.5 GHz | 2 MB | 667 MT/s | 9× | 0.7625–1.3 V | 27 W | Socket M | July 2006 | |
| Core Solo T1250 | 1.73 GHz | 2 MB | 533 MT/s | 13× | 0.7625–1.3 V | 31 W | Socket M | | |
| Core Solo T1300 | 1.67 GHz | 2 MB | 667 MT/s | 10× | 0.7625–1.3 V | 27 W | Socket 479/FC-μBGA Socket 479/FC-μBGA Socket M Socket M | January 2006 | $209 |
| Core Solo T1350 | 1.87 GHz | 2 MB | 533 MT/s | 14× | 0.7625–1.3 V | 31 W | Socket M | July 2006 | |
| Core Solo T1400 | 1.83 GHz | 2 MB | 667 MT/s | 11× | 0.7625–1.3 V | 27 W | Socket 479/FC-μBGA Socket 479/FC-μBGA Socket M Socket M | May 2006 | $209 |
| Core Solo T1500 | 2 GHz | 2 MB | 667 MT/s | 12× | 0.7625–1.3 V | 27 W | Socket 479/FC-μBGA Socket M | August 2006 | |
| Core Duo T2050 | 1.6 GHz | 2 MB | 533 MT/s | 12× | 0.762–1.3 V | 31 W | Socket M | May 2006 | $140 |
| Core Duo T2250 | 1.73 GHz | 2 MB | 533 MT/s | 13× | 0.762–1.3 V | 31 W | Socket M | May 2006 | OEM |
| Core Duo T2300 | 1.67 GHz | 2 MB | 667 MT/s | 10× | 0.762–1.3 V | 31 W | Socket M Socket M Socket 479/FC-μBGA Socket 479/FC-μBGA | January 2006 | $241 |
| Core Duo T2300E | 1.67 GHz | 2 MB | 667 MT/s | 10× | 0.762–1.3 V | 31 W | Socket M Socket M μFCBGA-479 μFCBGA-479 | May 2006 | $209 |
| Core Duo T2350 | 1.87 GHz | 2 MB | 533 MT/s | 14× | 0.762–1.3 V | 31 W | Socket M | | OEM |
| Core Duo T2400 | 1.83 GHz | 2 MB | 667 MT/s | 11× | 0.762–1.3 V | 31 W 31 W 27 W 27 W | Socket M Socket M Socket 479/FC-μBGA Socket 479/FC-μBGA | January 2006 | $294 |
| Core Duo T2450 | 2 GHz | 2 MB | 533 MT/s | 15× | 0.762–1.3 V | 31 W | Socket M | | OEM |
| Core Duo T2500 | 2 GHz | 2 MB | 667 MT/s | 12× | 0.762–1.3 V | 31 W | Socket M Socket M Socket 479/FC-μBGA Socket 479/FC-μBGA | January 2006 | $423 |
| Core Duo T2600 | 2.17 GHz | 2 MB | 667 MT/s | 13× | 0.762–1.3 V | 31 W | Socket M Socket M Socket 479/FC-μBGA Socket 479/FC-μBGA | January 2006 | $637 |
| Core Duo T2700 | 2.33 GHz | 2 MB | 667 MT/s | 14× | 0.762–1.3 V | 31 W | Socket M Socket 479/FC-μBGA | June 2006 | $637 |

### Core 2
#### "Merom-L" (65 nm)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
* Die size: 81 mm$^2$
* Steppings: A1
| Model | sSpec number | Cores | Clock rate | L2 cache | FSB | Mult. | Voltage | TDP | Socket | Release date | Part number(s) | Release price (USD) |
| ultra-low voltage ||||||||||||
| Core 2 Solo ULV U2100 | SLAGM (A1) | 1 | 1.07 GHz | 1 MB | 533 MT/s | 8× | 0.86–0.975 V | 5.5 W | Micro-FCBGA | September 2007 | LE80537UE0041M | $241 |
| Core 2 Solo ULV U2200 | SLAGL (A1) | 1 | 1.2 GHz | 1 MB | 533 MT/s | 9× | 0.86–0.975 V | 5.5 W | Micro-FCBGA | September 2007 | LE80537UE0091M | $262 |

#### "Merom", "Merom-2M" (standard-voltage, 65 nm)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)
* Model T7600G features an unlocked clock multiplier. Only sold OEM in the Dell XPS M1710.
* Intel VT-x: Supported by T5500 (L2), T5600 and all T7xxx
* Intel Dynamic Front Side Bus Frequency Switching: Supported by E1, G0, G2, M0 Steppings
* Socket P processors can throttle the front-side bus (FSB) anywhere between 400 and 800 MT/s as needed.
* Die size: 143 mm$^2$ (Merom), 111 mm$^2$ (Merom-2M)
* Steppings: B2, E1, G0, G2 (Merom), L2, M0 (Merom-2M)
* All models of stepping B2 released in July 2006, stepping L2 released in January 2007.
| Model | sSpec number | Cores | Clock rate | L2 cache | FSB | Mult. | Voltage | TDP | Socket | Release date | Part number(s) | Release price (USD) |
| Core 2 Duo T5200 | SL9VP (B2) | 2 | 1.6 GHz | 2 MB | 533 MT/s | 12× | 0.95–1.175 V | 34 W | Socket M | October 2006 | LF80537GE0252M | OEM |
| Core 2 Duo T5250 | SLA9S (M0) | 2 | 1.5 GHz | 2 MB | 667 MT/s | 9× | 0.95–1.175 V | 35 W | Socket P | Q2 2007 | LF80537GF0212M | OEM |
| Core 2 Duo T5270 | SLALK (M0) | 2 | 1.4 GHz | 2 MB | 800 MT/s | 7× | 0.95–1.175 V | 35 W | Socket P | October 2007 | LF80537GG0172M | OEM |
| Core 2 Duo T5300 | SL9WE (L2) | 2 | 1.73 GHz | 2 MB | 533 MT/s | 13× | 0.95–1.175 V | 34 W | Socket M | Q1 2007 | LF80537GE0302M | OEM |
| Core 2 Duo T5450 | SLA4F (M0) | 2 | 1.67 GHz | 2 MB | 667 MT/s | 10× | 0.95–1.175 V | 35 W | Socket P | Q2 2007 | LF80537GF0282MT | OEM |
| Core 2 Duo T5470 | SLAEB (M0) | 2 | 1.6 GHz | 2 MB | 800 MT/s | 8× | 0.95–1.175 V | 35 W | Socket P | July 2007 | LF80537GG0252M | OEM |
| Core 2 Duo T5500 | SL9SH (B2) SLGFK (G2) SL9U4 (L2) | 2 | 1.67 GHz | 2 MB | 667 MT/s | 10× | 0.95–1.175 V | 34 W | Socket M | August 28, 2006 | LF80537GF0282M | $209 |
| Core 2 Duo T5500 | SL9SQ (B2) SL9U8 (L2) | 2 | 1.67 GHz | 2 MB | 667 MT/s | 10× | 0.95–1.175 V | 34 W | BGA479 | August 2006 | LE80537GF0282M | $209 |
| Core 2 Duo T5550 | SLA4E (M0) | 2 | 1.83 GHz | 2 MB | 667 MT/s | 11× | 0.95–1.175 V | 35 W | Socket P | January 2008 | LF80537GF0342MT | OEM |
| Core 2 Duo T5600 | SL9SG (B2) SL9U3 (L2) | 2 | 1.83 GHz | 2 MB | 667 MT/s | 11× | 0.95–1.175 V | 34 W | Socket M | August 2006 | LF80537GF0342M | $241 |
| Core 2 Duo T5600 | SL9SP (B2) SL9U7 (L2) | 2 | 1.83 GHz | 2 MB | 667 MT/s | 11× | 0.95–1.175 V | 34 W | BGA479 | August 2006 | LE80537GF0342M | $241 |
| Core 2 Duo T5670 | SLAJ5 (M0) | 2 | 1.8 GHz | 2 MB | 800 MT/s | 9× | 0.95–1.175 V | 35 W | Socket P | Q2 2008 | LF80537GG0332MN | OEM |
| Core 2 Duo T5750 | SLA4D (M0) | 2 | 2 GHz | 2 MB | 667 MT/s | 12× | 0.95–1.175 V | 35 W | Socket P | January 2008 | LF80537GF0412M | OEM |
| Core 2 Duo T5800 | SLB6E (M0) | 2 | 2 GHz | 2 MB | 800 MT/s | 10× | 0.95–1.175 V | 35 W | Socket P | Q4 2008 | LF80537GG041F | OEM |
| Core 2 Duo T5850 | SLA4C (M0) | 2 | 2.17 GHz | 2 MB | 667 MT/s | 13× | 0.95–1.175 V | 35 W | Socket P | Q4 2008 | LF80537GF0482M | OEM |
| Core 2 Duo T5870 | SLAZR (M0) | 2 | 2 GHz | 2 MB | 800 MT/s | 10× | 0.95–1.175 V | 35 W | Socket P | 2008 | LF80537GG0412MN | OEM |
| Core 2 Duo T5900 | SLB6D (M0) | 2 | 2.2 GHz | 2 MB | 800 MT/s | 11× | 0.95–1.175 V | 35 W | Socket P | July 2008 | LF80537GG049F | OEM |
| Core 2 Duo T7100 | SLA4A (M0) | 2 | 1.8 GHz | 2 MB | 800 MT/s | 9× | 0.95–1.175 V | 35 W | Socket P | May 2007 | LF80537GG0332M | $209 |
| Core 2 Duo T7100 | SLA3U (M1) | 2 | 1.8 GHz | 2 MB | 800 MT/s | 9× | 0.95–1.175 V | 35 W | FCBGA6 | May 2007 | LE80537GG0332M | $209 |
| Core 2 Duo T7200 | SL9SF (B2) | 2 | 2 GHz | 4 MB | 667 MT/s | 12× | 0.95–1.175 V | 34 W | Socket M | August 2006 | LF80537GF0414M | $294 |
| Core 2 Duo T7200 | SL9SL (B2) | 2 | 2 GHz | 4 MB | 667 MT/s | 12× | 0.95–1.175 V | 34 W | FCBGA6 | August 2006 | LE80537GF0414M | $294 |
| Core 2 Duo T7250 | SLA49 (M0) SLAXH (M0) | 2 | 2 GHz | 2 MB | 800 MT/s | 10× | 0.95–1.175 V | 35 W | Socket P | September 2007 | LF80537GG0412M | $290 |
| Core 2 Duo T7250 | SLA3T (M1) | 2 | 2 GHz | 2 MB | 800 MT/s | 10× | 0.95–1.175 V | 35 W | FCBGA6 | September 2007 | LE80537GG0412M | $290 |
| Core 2 Duo T7300 | SLAMD (G0) SLA45 (E1) | 2 | 2 GHz | 4 MB | 800 MT/s | 10× | 0.95–1.175 V | 35 W | Socket P | May 2007 | LF80537GG0414M LF80537GG0414M | $241 |
| Core 2 Duo T7300 | SLA3P (E1) SLAMF (G0) | 2 | 2 GHz | 4 MB | 800 MT/s | 10× | 0.95–1.175 V | 35 W | FCBGA6 | May 2007 | LE80537GG0414M | $241 |
| Core 2 Duo T7400 | SL9SE (B2) SLGFJ (G2) | 2 | 2.17 GHz | 4 MB | 667 MT/s | 13× | 0.95–1.175 V | 34 W | Socket M | August 2006 | LF80537GF0484M | $423 |
| Core 2 Duo T7400 | SL9SK (B2) SLGFV (G2) | 2 | 2.17 GHz | 4 MB | 667 MT/s | 13× | 0.95–1.175 V | 34 W | FCBGA6 | August 2006 | LE80537GF0484M | $423 |
| Core 2 Duo T7500 | SLA44 (E1) SLAF8 (G0) | 2 | 2.2 GHz | 4 MB | 800 MT/s | 11× | 0.95–1.175 V | 35 W | Socket P | May 2007 | LF80537GG0494M | $316 |
| Core 2 Duo T7500 | SLA3N (E1) SLADM (G0) | 2 | 2.2 GHz | 4 MB | 800 MT/s | 11× | 0.95–1.175 V | 35 W | FCBGA6 | May 2007 | LE80537GG0494M | $316 |
| Core 2 Duo T7600 | SL9SD (B2) | 2 | 2.33 GHz | 4 MB | 667 MT/s | 14× | 0.95–1.175 V | 34 W | Socket M | August 2006 | LF80537GF0534M | $637 |
| Core 2 Duo T7600 | SL9SJ (B2) | 2 | 2.33 GHz | 4 MB | 667 MT/s | 14× | 0.95–1.175 V | 34 W | FCBGA6 | August 2006 | LE80537GF0534M | $637 |
| Core 2 Duo T7600G | SL9U5 (B2) | 2 | 2.33 GHz | 4 MB | 667 MT/s | 14× | 0.95–1.175 V | 34 W | Socket M | December 2006 | LF80537GF0534MU | |
| Core 2 Duo T7700 | SLA43 (E1) SLAF7 (G0) | 2 | 2.4 GHz | 4 MB | 800 MT/s | 12× | 0.95–1.175 V | 35 W | Socket P | May 2007 | LF80537GG0564M | $530 |
| Core 2 Duo T7700 | SLA3M (E1) SLADL (G0) | 2 | 2.4 GHz | 4 MB | 800 MT/s | 12× | 0.95–1.175 V | 35 W | FCBGA6 | May 2007 | LE80537GG0564M | $530 |
| Core 2 Duo T7800 | SLAF6 (G0) | 2 | 2.6 GHz | 4 MB | 800 MT/s | 13× | 0.95–1.175 V | 35 W | Socket P | September 2007 | LF80537GG0644ML | $530 |
| Core 2 Duo T7800 | SLA75 (G0) | 2 | 2.6 GHz | 4 MB | 800 MT/s | 13× | 0.95–1.175 V | 35 W | FCBGA6 | September 2007 | LE80537GG0644M | $530 |
See also: Versions of the same Merom-2M core with half the L2 cache disabled are available under the Pentium Dual-Core brand.

#### "Merom" (low-voltage, 65 nm)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
* Intel Dynamic Front Side Bus Frequency Switching: Supported by E1, G0, G2 Steppings
* Die size: 143 mm$^2$
* Steppings: B2, E1, G0, G2
| Model | sSpec number | Cores | Clock rate | L2 cache | FSB | Mult. | Voltage | TDP | Socket | Release date | Part number(s) | Release price (USD) |
| Core 2 Duo SL7100 | SLAJD SLAT4 | 2 | 1.2 GHz | 4 MB | 800 MT/s | 6× | | 12 W | μFC-BGA 956 | | SY80537LG0094M | OEM |
| Core 2 Duo L7200 | SL9SN (B2) | 2 | 1.33 GHz | 4 MB | 667 MT/s | 8× | 0.9–1.2 V | 17 W | FCBGA6 | Q1 2007 | LE80537LF0144M | $284 |
| Core 2 Duo L7300 | SLA3S (E1) | 2 | 1.4 GHz | 4 MB | 800 MT/s | 7× | 0.9–1.1 V | 17 W | FCBGA6 | May 2007 | LE80537LG0174M | $284 |
| Core 2 Duo L7400 | SL9SM (B2) SLGFX (G2) | 2 | 1.5 GHz | 4 MB | 667 MT/s | 9× | 0.9–1.2 V | 17 W | FCBGA6 | Q1 2007 | LE80537LF0214M | $316 |
| Core 2 Duo L7500 | SLA3R (E1) SLAET (G0) | 2 | 1.6 GHz | 4 MB | 800 MT/s | 8× | 0.9–1.1 V | 17 W | FCBGA6 | May 2007 | LE80537LG0254M | $316 |
| Core 2 Duo SP7500 | SLAT2 SLAEV | 2 | 1.6 GHz | 4 MB | 800 MT/s | 8× | 1.0–1.25 V | 20 W | μFC-BGA 956 | | SY80537GG0254M | OEM |
| Core 2 Duo L7700 | SLAES (G0) | 2 | 1.8 GHz | 4 MB | 800 MT/s | 9× | 0.9–1.1 V | 17 W | FCBGA6 | September 2007 | LE80537LG0334M | $316 |
| Core 2 Duo SP7700 | SLALQ SLALR SLASZ | 2 | 1.8 GHz | 4 MB | 800 MT/s | 9× | 1.0–1.25 V | 20 W | μFC-BGA 956 | | SY80537GG0334M SY80537GG0334ML | OEM |

#### "Merom-2M" (ultra-low-voltage, 65 nm)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x
* Die size: 111 mm$^2$
* Steppings: L2, M0
| Model | sSpec number | Cores | Clock rate | L2 cache | FSB | Mult. | Voltage | TDP | Socket | Release date | Part number(s) | Release price (USD) |
| Core 2 Duo U7500 | SLA2V (L2) SLAUT (M0) | 2 | 1.07 GHz | 2 MB | 533 MT/s | 8× | 0.8–0.975 V | 10 W | FCBGA6 (Socket M) | April 2007 | LE80537UE0042M | $262 |
| Core 2 Duo U7500 | SLV3X (M0) | 2 | 1.07 GHz | 2 MB | 533 MT/s | 8× | 0.8–0.975 V | 10 W | FCBGA6 (Socket P) | February 2008 | LE80537UE0042ML | $262 |
| Core 2 Duo U7600 | SLA2U (L2) SLAUS (M0) | 2 | 1.2 GHz | 2 MB | 533 MT/s | 9× | 0.8–0.975 V | 10 W | FCBGA6 (Socket M) | April 2007 | LE80537UE0092M | $289 |
| Core 2 Duo U7600 | SLV3W (M0) | 2 | 1.2 GHz | 2 MB | 533 MT/s | 9× | 0.8–0.975 V | 10 W | FCBGA6 (Socket P) | April 2007 | LE80537UE0092ML | $289 |
| Core 2 Duo U7700 | SLA6X (L2) SLAUR (M0) | 2 | 1.33 GHz | 2 MB | 533 MT/s | 10× | 0.8–0.975 V | 10 W | FCBGA6 (Socket M) | December 2007 | LE80537UE0142M | $289 |
| Core 2 Duo U7700 | SLV3V (M0) | 2 | 1.33 GHz | 2 MB | 533 MT/s | 10× | 0.8–0.975 V | 10 W | FCBGA6 (Socket P) | February 2008 | LE80537UE0142ML | $289 |

#### "Merom XE" (65 nm)

These models feature an unlocked clock multiplier
* All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Front Side Bus Frequency Switching
* Merom XE processors support Dynamic Front Side Bus Throttling between 400 and 800 MT/s.
* Die size: 143 mm$^2$
* Steppings: E1, G0
| Model | sSpec number | Cores | Clock rate | L2 cache | FSB | Mult. | Voltage | TDP | Socket | Release date | Part number(s) | Release price (USD) |
| Core 2 Extreme X7800 | SLA6Z (E1) | 2 | 2.6 GHz | 4 MB | 800 MT/s | 13× | 1.0375–1.3 V | 44 W | Socket P | July 2007 | LF80537GG0644M | $851 |
| Core 2 Extreme X7900 | SLA33 (E1) SLAF4 (G0) | 2 | 2.8 GHz | 4 MB | 800 MT/s | 14× | 1.0375–1.3 V | 44 W | Socket P | August 2007 | LF80537GG0724M | $851 |

#### "Penryn-L" (45 nm)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
* Socket P processors can throttle the front-side bus (FSB) anywhere between 400 and 800 MT/s as needed.
* Die size: 82 mm$^2$
* 228 million transistors
* Package size: 22 mm × 22 mm
* Steppings: M0, R0
| Model | sSpec number | Cores | Clock rate | L2 cache | FSB | Mult. | Voltage | TDP | Socket | Release date | Part number(s) | Release price (USD) |
| Small Form Factor, ultra-low voltage ||||||||||||
| Core 2 Solo SU3300 | SLGAR (M0) SLGAJ (R0) | 1 | 1.2 GHz | 3 MB | 800 MT/s | 6× | 1.05–1.15 V | 5.5 W | μFC-BGA 956 | May 2008 | AV80585UG0093M | $262 |
| Core 2 Solo SU3500 | SLGFM (R0) | 1 | 1.4 GHz | 3 MB | 800 MT/s | 7× | 1.05–1.15 V | 5.5 W | μFC-BGA 956 | Q2 2009 | AV80585UG0173M | $262 |

#### "Penryn" (Apple iMac specific, 45 nm)

* Die size: 107 mm$^2$
* The 2008 20" iMac used the E8135 and E8335 CPUs at a lower than specified clock frequency, explaining why the same model is used at different frequencies. This list shows the frequencies used by Apple.
* Steppings: C0, E0
| Model | sSpec number | Cores | Clock rate | L2 cache | FSB | Mult. | Voltage | TDP | Socket | Release date | Part number(s) |
| Core 2 Duo E8135 | SLAQA (C0) | 2 | 2.4 GHz | 6 MB | 1066 MT/s | 9× | | 44 W | Socket P | April 2008 | FF80576E8135 FF80576GH0676M |
| Core 2 Duo E8135 | SLG8W (E0) | 2 | 2.67 GHz | 6 MB | 1066 MT/s | 10× | | 44 W | Socket P | March 2009 | AW80576GH0676M AW80576E8135 |
| Core 2 Duo E8135 | SLGED (E0) | 2 | 2.67 GHz | 6 MB | 1066 MT/s | 10× | | 35 W | Socket P | March 2009 | AW80576GH0676M |
| Core 2 Duo E8235 | SLAQB (C0) | 2 | 2.8 GHz | 6 MB | 1066 MT/s | 10.5× | | 44 W | Socket P | April 2008 | FF80576GH0726M |
| Core 2 Duo E8335 | SLAQC (C0) | 2 | 2.93 GHz | 6 MB | 1066 MT/s | 11× | | 44 W | Socket P | April 2008 | FF80576GH0776M |
| Core 2 Duo E8335 | SLGEB (E0) | 2 | 2.93 GHz | 6 MB | 1066 MT/s | 11× | 1.0500–1.2250 V | 35 W | Socket P | March 2009 | AW80576GH0776M |
| Core 2 Duo E8435 | SLAQD (C0) | 2 | 3.07 GHz | 6 MB | 1066 MT/s | 11.5× | 1.0500–1.2375 V | 55 W | Socket P | April 2008 | FF80576GH0836M |
| Core 2 Duo E8435 | SLGEA (E0) | 2 | 3.07 GHz | 6 MB | 1066 MT/s | 11.5× | | 44 W | Socket P | March 2009 | AW80576GH0836M |

#### "Penryn", "Penryn-3M" (standard-voltage, 45 nm)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel Dynamic Acceleration (IDA)
* T6570, T6670, all T8xxx and T9xxx models support Intel VT-x
* All T9xxx models support Trusted Execution Technology (TXT)
* T6xxx models are Penryn-3M processors with 1 MB L2 cache disabled.
Note that models T8100, T8300, T9300, T9500 are Penryn processors designed for Santa Rosa Refresh platforms with maximum FSB of 800 MT/s, whereas the rest of the Penryn processors are designed for Montevina platforms that can go up to maximum FSB of 1066 MT/s.
Penryn processors support Dynamic Front Side Bus Throttling between 400–800MT/s.
* Die size: 107 mm$^2$ (Penryn), 82 mm$^2$ (Penryn-3M)
* Steppings: C0, E0 (Penryn) M0, R0 (Penryn-3M)
| Model | sSpec number | Cores | Clock rate | L2 cache | FSB | Mult. | Voltage | TDP | Socket | Release date | Part number(s) | Release price (USD) |
| Core 2 Duo T6400 | SLGJ4 (R0) | 2 | 2 GHz | 2 MB | 800 MT/s | 10× | 1.00–1.250 V | 35 W | Socket P | January 2009 | AW80577GG0412MA | OEM |
| Core 2 Duo T6500 | SLGF4 (R0) | 2 | 2.1 GHz | 2 MB | 800 MT/s | 10.5× | 1.00–1.250 V | 35 W | Socket P | January 2009 | AW80577GG0452ML AW80577GG0452MA | OEM |
| Core 2 Duo T6570 | SLGLL (R0) | 2 | 2.1 GHz | 2 MB | 800 MT/s | 10.5× | 1.00–1.250 V | 35 W | Socket P | Q3 2009 | AW80577GG0452MH | OEM |
| Core 2 Duo T6600 | SLGJ9 (R0) SLGF5 (R0) | 2 | 2.2 GHz | 2 MB | 800 MT/s | 11× | 1.00–1.250 V | 35 W | Socket P | January 2009 | AW80577GG0492MA AW80577GG0492ML | OEM |
| Core 2 Duo T6670 | SLGLK (R0) SLGLJ (R0) | 2 | 2.2 GHz | 2 MB | 800 MT/s | 11× | 1.00–1.250 V | 35 W | Socket P | Q3 2009 | AW80577GG0492MH | OEM |
| Core 2 Duo T6900 | SLGHZ (?) | 2 | 2.5 GHz | 2 MB | 800 MT/s | 12.5× | 1.00–1.250 V | 35 W | Socket P | ? | AW80577GG0602MA | OEM |
| Core 2 Duo T6970 | SLGLJ (R0) | 2 | 2.5 GHz | 2 MB | 800 MT/s | 12.5× | 1.00–1.250 V | 35 W | Socket P | ? | AW80577GG0602MH | OEM |
| Core 2 Duo T8100 | SLAP9 (M0) SLAVJ (M0) SLAYP (M0) SLAYZ (C0) SLAUU (C0) | 2 | 2.1 GHz | 3 MB | 800 MT/s | 10.5× | 1.000–1.250 V | 35 W | Socket P | January 2008 | FF80577GG0453M (M0) FF80577GG0453MN FF80576GG0453M (C0) BX80577T8100 | $209 |
| Core 2 Duo T8100 | SLAPS (M0) SLAXG (M0) SLAPT (C0) SLAZD (C0) | 2 | 2.1 GHz | 3 MB | 800 MT/s | 10.5× | 1.000–1.250 V | 35 W | FCBGA6 | January 2008 | EC80577GG0453M (M0) EC80576GG0453M (C0) | $209 |
| Core 2 Duo T8300 | SLAPA (M0) SLAYQ (M0) | 2 | 2.4 GHz | 3 MB | 800 MT/s | 12× | 1.00–1.250 V | 35 W | Socket P | January 2008 | FF80577GG0563M BX80577T8300 | $241 |
| Core 2 Duo T8300 | SLAPR (M0) SLAPU (C0) SLAZC (C0) | 2 | 2.4 GHz | 3 MB | 800 MT/s | 12× | 1.00–1.250 V | 35 W | FCBGA6 | January 2008 | EC80577GG0563M (M0) EC80576GG0563M (C0) | $241 |
| Core 2 Duo T9300 | SLAQG (C0) SLAYY (C0) | 2 | 2.5 GHz | 6 MB | 800 MT/s | 12.5× | 1.000–1.250 V | 35 W | Socket P | January 2008 | FF80576GG0606M | $316 |
| Core 2 Duo T9300 | SLAPV (C0) SLAZB (C0) | 2 | 2.5 GHz | 6 MB | 800 MT/s | 12.5× | 1.000–1.250 V | 35 W | FCBGA6 | January 2008 | EC80576GG0606M | $316 |
| Core 2 Duo T9400 | SLB46 (C0) SLB4D (C0) SLGE5 (E0) | 2 | 2.53 GHz | 6 MB | 1066 MT/s | 9.5× | 1.050–1.162 V | 35 W | Socket P | July 2008 | AW80576GH0616M | $316 |
| Core 2 Duo T9400 | SL3BX (C0) SLGEK (E0) | 2 | 2.53 GHz | 6 MB | 1066 MT/s | 9.5× | 1.050–1.162 V | 35 W | FCBGA6 | July 2008 | AV80576GH0616M | $316 |
| Core 2 Duo T9500 | SLAQH (C0) SLAYX (C0) | 2 | 2.6 GHz | 6 MB | 800 MT/s | 13× | 1.000–1.250 V | 35 W | Socket P | January 2008 | FF80576GG0646M | $530 |
| Core 2 Duo T9500 | SLAPW (C0) SLAZA (C0) SLB49 (C0) SLB4A (C0) | 2 | 2.6 GHz | 6 MB | 800 MT/s | 13× | 1.000–1.250 V | 35 W | FCBGA6 | January 2008 | EC80576GG0646M AV80576SH0616M | $530 |
| Core 2 Duo T9550 | SLGE4 (E0) | 2 | 2.67 GHz | 6 MB | 1066 MT/s | 10× | 1.050–1.212 V | 35 W | Socket P | December 2008 | AW80576GH0676MG | $316 |
| Core 2 Duo T9550 | SLGEL (E0) | 2 | 2.67 GHz | 6 MB | 1066 MT/s | 10× | 1.050–1.212 V | 35 W | FCBGA6 | December 2008 | AV80576GH0676MG | $316 |
| Core 2 Duo T9600 | SLB47 (C0) SLG8N (C0) SLG9F (E0) | 2 | 2.8 GHz | 6 MB | 1066 MT/s | 10.5× | 1.050–1.162 V | 35 W | Socket P | July 2008 | AW80576GH0726M | $530 |
| Core 2 Duo T9600 | SLB43 (C0) SLGEM (E0) | 2 | 2.8 GHz | 6 MB | 1066 MT/s | 10.5× | 1.050–1.162 V | 35 W | FCBGA6 | July 2008 | AV80576GH0726M | $530 |
| Core 2 Duo T9800 | SLGES (E0) | 2 | 2.93 GHz | 6 MB | 1066 MT/s | 11× | 1.050–1.212 V | 35 W | Socket P | December 2008 | AW80576GH0776MG | $530 |
| Core 2 Duo T9800 | SLGEP (E0) | 2 | 2.93 GHz | 6 MB | 1066 MT/s | 11× | 1.050–1.212 V | 35 W | FCBGA6 | December 2008 | AV80576GH0776MG | $530 |
| Core 2 Duo T9900 | SLGEE (E0) | 2 | 3.07 GHz | 6 MB | 1066 MT/s | 11.5× | 1.050–1.2125 V | 35 W | Socket P | April 2009 | AW80576GH0836MG | $530 |
| Core 2 Duo T9900 | SLGKH (E0) | 2 | 3.07 GHz | 6 MB | 1066 MT/s | 11.5× | 1.050–1.2125 V | 35 W | FCBGA6 | April 2009 | AV80576GH0836MG | $530 |

#### "Penryn", "Penryn-3M" (medium-voltage, 45 nm)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x (except the non-Mac P7350, P7450), Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
* Select Apple subsets of P7000 series processors support Intel VT-x.
* Penryn and Penryn-3M processors support Dynamic Front Side Bus Throttling between 533–1066MT/s.
* Die size: 107 mm$^2$ (Penryn), 82 mm$^2$ (Penryn-3M)
* Package size: 35 mm × 35 mm
* Transistors: 410 million
* Steppings: (Core microarchitecture 45nm steppings)
** C0, E0 (Penryn)
** M0, R0 (Penryn-3M)
** stepping C0/M0 is only used in the Intel Mobile 965 Express (Santa Rosa refresh) platform
** stepping E0/R0 adds two new instructions (XSAVE/XRSTOR) and supports the later Intel Mobile 4 Express (Montevina) platform
| Model | sSpec number | Cores | Clock rate | L2 cache | FSB | Mult. | Voltage | TDP | Socket | Release date | Part number(s) | Release price (USD) |
| Core 2 Duo P7350 | SLB44 (C0) SLB53 (M0) | 2 | 2 GHz | 3 MB | 1066 MT/s | 7.5× | 1.00–1.250 V | 25 W | Socket P | Mid 2008 | AW80576GH0413M AW80577SH0413M | OEM |
| Core 2 Duo P7350 | SLG8E (C0) SLGE3 (R0) | 2 | 2 GHz | 3 MB | 1066 MT/s | 7.5× | 1.00–1.250 V | 25 W | FC-BGA478 | Mid 2008 | | OEM |
| Core 2 Duo P7370 | SLG8X (R0) SLGF9 (R0) | 2 | 2 GHz | 3 MB | 1066 MT/s | 7.5× | 1.00–1.250 V | 25 W | Socket P | January 2009 | AW80577SH0413M AW80577SH0413ML | OEM |
| Core 2 Duo P7450 | SLB45 (C0) SLGF7 (R0) SLB54 (M0) SLB56 (M0) | 2 | 2.13 GHz | 3 MB | 1066 MT/s | 8× | 1.00–1.250 V | 25 W | Socket P | January 2009 | AW80577SH0463M AW80576GH0463M (C0) | OEM |
| Core 2 Duo P7450 | SLGFF (C0) | 2 | 2.13 GHz | 3 MB | 1066 MT/s | 8× | 1.00–1.250 V | 25 W | FC-BGA478 | January 2009 | AW80577P7450M (C0) | OEM |
| Core 2 Duo P7550 | SLGF8 (R0) | 2 | 2.27 GHz | 3 MB | 1066 MT/s | 8.5× | 1.00–1.250 V | 25 W | Socket P | June 2009 | AW80577SH0513MA | OEM |
| Core 2 Duo P7570 | SLGLW (R0) | 2 | 2.27 GHz | 3 MB | 1066 MT/s | 8.5× | 1.00–1.250 V | 25 W | Socket P | Q3 2009 | AW80577SH0513ML | OEM |
| Core 2 Duo P8400 | SLB3R (M0) SLB3Q (M0) SLB52 (M0) SLG8Z (M0) SLGCC (R0) SLGCQ (R0) SLGCF (R0) SLGFC (R0) SLGCL (R0) | 2 | 2.27 GHz | 3 MB | 1066 MT/s | 8.5× | 1.00–1.250 V | 25 W | Socket P | June 13, 2008 | AW80577SH0513M AW80577SH0513MN BX80577P8400 | $209 |
| Core 2 Duo P8400 | SLB4M (M0) | 2 | 2.27 GHz | 3 MB | 1066 MT/s | 8.5× | 1.00–1.250 V | 25 W | FC-BGA478 | June 2008 | AV80577SH0513M | $209 |
| Core 2 Duo P8600 | SLB3S (M0) SLGA4 (M0) SLGFD (R0) | 2 | 2.4 GHz | 3 MB | 1066 MT/s | 9× | 1.00–1.250 V | 25 W | Socket P | June 2008 | AW80577SH0563M BX80577P8600 | $241 |
| Core 2 Duo P8600 | SLB4N (M0) SLGDZ (R0) | 2 | 2.4 GHz | 3 MB | 1066 MT/s | 9× | 1.00–1.250 V | 25 W | FC-BGA478 | June 2008 | AV80577SH0563M | $241 |
| Core 2 Duo P8700 | SLGFE (R0) | 2 | 2.53 GHz | 3 MB | 1066 MT/s | 9.5× | 1.00–1.250 V | 25 W | Socket P | December 2008 | AW80577SH0613MG BX80577P8700 | $241 |
| Core 2 Duo P8700 | SLGFG (R0) | 2 | 2.53 GHz | 3 MB | 1066 MT/s | 9.5× | 1.00–1.250 V | 25 W | FC-BGA478 | December 2008 | AV80577SH0613MG | $241 |
| Core 2 Duo P8800 | SLGLR (R0) | 2 | 2.67 GHz | 3 MB | 1066 MT/s | 10× | 1.00–1.250 V | 25 W | Socket P | Q2 2009 | AW80577SH0673MG BX80577P8800 | $241 |
| Core 2 Duo P8800 | SLGLA (E0) | 2 | 2.67 GHz | 3 MB | 1066 MT/s | 10× | 1.00–1.250 V | 25 W | FC-BGA478 | Q2 2009 | AV80577SH0673MG | $241 |
| Core 2 Duo P9500 | SLB4E (C0) SLGE8 (E0) | 2 | 2.53 GHz | 6 MB | 1066 MT/s | 9.5× | 1.05–1.162 V | 25 W | Socket P | July 2008 | AW80576SH0616M AV80576SH0616M | $348 |
| Core 2 Duo P9600 | SLGE6 (E0) | 2 | 2.67 GHz | 6 MB | 1066 MT/s | 10× | 1.05–1.212 V | 25 W | Socket P | December 2008 | AW80576SH0676MG | $348 |
| Core 2 Duo P9700 | SLGQS (E0) | 2 | 2.8 GHz | 6 MB | 1066 MT/s | 10.5× | 1.012–1.175 V | 28 W | Socket P | June 2009 | AW80576SH0726MG | $348 |

#### "Penryn" (medium-voltage, 45 nm, Small Form Factor)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
* Die size: 107 mm$^2$
* Package size: 22 mm × 22 mm
* Steppings: C0, E0
| Model | sSpec number | Cores | Clock rate | L2 cache | FSB | Mult. | Voltage | TDP | Socket | Release date | Part number(s) | Release price (USD) |
| Core 2 Duo SP9300 | SLB63 (C0) | 2 | 2.27 GHz | 6 MB | 1066 MT/s | 8.5× | 0.900–1.225 V | 25 W | μFC-BGA 956 | July 2008 | AV80576SH0516M | $284 |
| Core 2 Duo SP9400 | SLB64 (C0) SLGHG (C0) SLGAA (E0) | 2 | 2.4 GHz | 6 MB | 1066 MT/s | 9× | 0.900–1.225 V | 25 W | μFC-BGA 956 | July 2008 | AV80576SH0566M | $284 |
| Core 2 Duo SP9600 | SLGER (E0) | 2 | 2.53 GHz | 6 MB | 1066 MT/s | 9.5× | 0.900–1.225 V | 25 W | μFC-BGA 956 | Q1 2009 | AV80576SH0516M AV80576SH0616M | $316 |

#### "Penryn" (low-voltage, 45 nm, Small Form Factor)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
* Die size: 107 mm$^2$
* Package size: 22 mm × 22 mm
* Steppings: C0, E0
| Model | sSpec number | Cores | Clock rate | L2 cache | FSB | Mult. | Voltage | TDP | Socket | Release date | Part number(s) | Release price (USD) |
| Core 2 Duo SL9300 | SLB65 (C0) SLGHC (C0) SLGAG (E0) | 2 | 1.6 GHz | 6 MB | 1066 MT/s | 6× | 1.050–1.150 V | 17 W | μFC-BGA 956 | September 2008 | AV80576LH0256M | $284 |
| Core 2 Duo SL9380 | SLGA2 (C0) SLGAD (E0) | 2 | 1.8 GHz | 6 MB | 800 MT/s | 9× | 1.050–1.150 V | 17 W | μFC-BGA 956 | September 2008 | AV80576LG0336M | $316 |
| Core 2 Duo SL9400 | SLB66 (C0) SLGHD (C0) SLGAB (E0) | 2 | 1.87 GHz | 6 MB | 1066 MT/s | 7× | 1.050–1.150 V | 17 W | μFC-BGA 956 | September 2008 | AV80576LH0366M | $316 |
| Core 2 Duo SL9600 | SLGEQ (E0) | 2 | 2.13 GHz | 6 MB | 1066 MT/s | 8× | 1.050–1.150 V | 17 W | μFC-BGA 956 | Q1'09 | AV80576LH0466M | $316 |

#### "Penryn-3M" (ultra-low-voltage, 45 nm, Small Form Factor)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT) (except SU7300), Intel Dynamic Acceleration (IDA)
* Die size: 107 mm$^2$
* Package size: 22 mm × 22 mm
* Steppings: M0, R0
| Model | sSpec number | Cores | Clock rate | L2 cache | FSB | Mult. | Voltage | TDP | Socket | Release date | Part number(s) | Release price (USD) |
| Core 2 Duo SU7300 | SLGS6 (R0) SLGYV (R0) | 2 | 1.3 GHz | 3 MB | 800 MT/s | 6.5× | 1.05–1.15 V | 10 W | μFC-BGA 956 | September 2009 | AV80577UG0133M AV80577UG0133ML | $289 |
| Core 2 Duo SU9300 | SLB5Q (M0) SLGAL (R0) | 2 | 1.2 GHz | 3 MB | 800 MT/s | 6× | 1.05–1.15 V | 10 W | μFC-BGA 956 | September 2008 | AV80577UG0093M | $262 |
| Core 2 Duo SU9400 | SLB5V (M0) SLGHN (M0) SLGAK (R0) | 2 | 1.4 GHz | 3 MB | 800 MT/s | 7× | 1.05–1.15 V | 10 W | μFC-BGA 956 | September 2008 | AV80577UG0173M | $289 |
| Core 2 Duo SU9600 | SLGEX (R0) SLGFN (R0) | 2 | 1.6 GHz | 3 MB | 800 MT/s | 8× | 1.05–1.15 V | 10 W | μFC-BGA 956 | Q1 2009 | AV80577UG0253M | $289 |

#### "Penryn XE" (45 nm)

* These models feature an unlocked clock multiplier
* All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
* Penryn XE processors support Dynamic Front Side Bus Throttling between 400–800 MT/s and 533–1066 MT/s.
* Die size: 107 mm$^2$
* Steppings: C0, E0
| Model | sSpec number | Cores | Clock rate | L2 cache | FSB | Mult. | Voltage | TDP | Socket | Release date | Part number(s) | Release price (USD) |
| Core 2 Extreme X9000 | SLAQJ (C0) SLAZ3 (C0) | 2 | 2.8 GHz | 6 MB | 800 MT/s | 14× | 1.062–1.150 V | 44 W | Socket P | January 2008 | FF80576ZG0726M | $851 |
| Core 2 Extreme X9100 | SLB48 (C0) SLG8M (C0) SLGE7 (E0) | 2 | 3.07 GHz | 6 MB | 1066 MT/s | 11.5× | 1.062–1.150 V | 44 W | Socket P | July 2008 | AW80576GH0836M | $851 |

#### "Penryn QC" (45 nm)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
* Can throttle the front-side bus (FSB) anywhere between 533 and 1066 MT/s as needed.
* Die size: 2 × 107 mm$^2$
* Steppings: E0
| Model | sSpec number | Cores | Clock rate | L2 cache | FSB | Mult. | Voltage | TDP | Socket | Release date | Part number(s) | Release price (USD) |
| Core 2 Quad Q9000 | SLGEJ (E0) | 4 | 2 GHz | 2 × 3 MB | 1066 MT/s | 7.5× | 1.050–1.175 V | 45 W | Socket P | December 2008 | AW80581GH0416M BX80581Q9000 | $348 |
| Core 2 Quad Q9100 | SLB5G (E0) | 4 | 2.27 GHz | 2 × 6 MB | 1066 MT/s | 8.5× | 1.050–1.175 V | 45 W | Socket P | August 2008 | AW80581GH051003 | $851 |

#### "Penryn QC XE" (45 nm)

* This model features an unlocked clock multiplier usually manipulated through the systems BIOS however some manufacturers (such as HP) do not have this feature enabled on their laptops that use this processor.
* All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
* Can throttle the front-side bus (FSB) anywhere between 533 and 1066 MT/s as needed.
* Package size: 35 mm × 35 mm
* Die size: 2 × 107 mm$^2$
* Steppings: E0
| Model | sSpec number | Cores | Clock rate | L2 cache | FSB | Mult. | Voltage | TDP | Socket | Release date | Part number(s) | Release price (USD) |
| Core 2 Extreme QX9300 | SLB5J (E0) | 4 | 2.53 GHz | 2 × 6 MiB | 1066 MT/s | 9.5× | 1.050–1.175 V | 45 W | Socket P | August 2008 | AW80581ZH061003 | $1038 |

### Core i (1st gen)
#### Clarksfield

Common features:
* Socket: G1.
* All the CPUs support dual-channel DDR3-1333 RAM.
* All CPU models provide 16 lanes of PCIe 2.0.
* All CPUs feature a DMI 1.0 bus to the chipset (PCH).
* No integrated graphics.
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 45 nm.
* XM-suffix processors have an unlocked multiplier and can be overclocked.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Smart Cache | TDP | Release date |
| Core i7 | 940XM | 4 (8) | 2.13 | 3.33 | 8 MB | 55 W | June 2010 |
| Core i7 | 920XM | 4 (8) | 2.00 | 3.20 | 8 MB | 55 W | September 2009 |
| Core i7 | 840QM | 4 (8) | 1.86 | 3.20 | 8 MB | 45 W | June 2010 |
| Core i7 | 820QM | 4 (8) | 1.73 | 3.06 | 8 MB | 45 W | September 2009 |
| Core i7 | 740QM | 4 (8) | 1.73 | 2.93 | 6 MB | 45 W | June 2010 |
| Core i7 | 720QM | 4 (8) | 1.60 | 2.80 | 6 MB | 45 W | September 2009 |

#### Arrandale

Common features:
* Socket: All models (except i3-380M) are available in BGA-1288; M-suffix (excluding UM- and LM-suffix) models are also available as Socket G1.
* All the CPUs support dual-channel DDR3 RAM. All models support it at 800 MT/s speeds while M- and LM-suffix models support up to 1066 MT/s speeds.
* All CPU models provide 16 lanes of PCIe 2.0.
* All CPUs feature a DMI 1.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 32 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 680UM | 2 (4) | 1.46 | 2.53 | HD Graphics | 166–500 | 4 MB | 18 W | September 2010 |
| Core i7 | 660LM | 2 (4) | 2.26 | 3.06 | HD Graphics | 266–566 | 4 MB | 25 W | September 2010 |
| Core i7 | 660UM | 2 (4) | 1.33 | 2.40 | HD Graphics | 166–500 | 4 MB | 18 W | May 2010 |
| Core i7 | 640M | 2 (4) | 2.80 | 3.46 | HD Graphics | 500–766 | 4 MB | 35 W | September 2010 |
| Core i7 | 640LM | 2 (4) | 2.13 | 2.93 | HD Graphics | 266–566 | 4 MB | 25 W | January 2010 |
| Core i7 | 640UM | 2 (4) | 1.20 | 2.27 | HD Graphics | 166–500 | 4 MB | 18 W | January 2010 |
| Core i7 | 620M | 2 (4) | 2.66 | 3.33 | HD Graphics | 500–766 | 4 MB | 35 W | January 2010 |
| Core i7 | 620LM | 2 (4) | 2.00 | 2.80 | HD Graphics | 266–566 | 4 MB | 25 W | January 2010 |
| Core i7 | 620UM | 2 (4) | 1.06 | 2.13 | HD Graphics | 166–500 | 4 MB | 18 W | January 2010 |
| Core i5 | 580M | 2 (4) | 2.66 | 3.33 | HD Graphics | 500–766 | 3 MB | 35 W | September 2010 |
| Core i5 | 560M | 2 (4) | 2.66 | 3.20 | HD Graphics | 500–766 | 3 MB | 35 W | September 2010 |
| Core i5 | 560UM | 2 (4) | 1.33 | 2.13 | HD Graphics | 166–500 | 3 MB | 18 W | September 2010 |
| Core i5 | 540M | 2 (4) | 2.53 | 3.07 | HD Graphics | 500–766 | 3 MB | 35 W | January 2010 |
| Core i5 | 540UM | 2 (4) | 1.20 | 2.00 | HD Graphics | 166–500 | 3 MB | 18 W | May 2010 |
| Core i5 | 520M | 2 (4) | 2.40 | 2.93 | HD Graphics | 500–766 | 3 MB | 35 W | January 2010 |
| Core i5 | 520UM | 2 (4) | 1.07 | 1.87 | HD Graphics | 166–500 | 3 MB | 18 W | January 2010 |
| Core i5 | 480M | 2 (4) | 2.66 | 2.93 | HD Graphics | 500–766 | 3 MB | 35 W | January 2011 |
| Core i5 | 470UM | 2 (4) | 1.33 | 1.86 | HD Graphics | 166–500 | 3 MB | 18 W | October 2010 |
| Core i5 | 460M | 2 (4) | 2.53 | 2.80 | HD Graphics | 500–766 | 3 MB | 35 W | September 2010 |
| Core i5 | 450M | 2 (4) | 2.40 | 2.66 | HD Graphics | 500–766 | 3 MB | 35 W | June 2010 |
| Core i5 | 430M | 2 (4) | 2.26 | 2.53 | HD Graphics | 500–766 | 3 MB | 35 W | January 2010 |
| Core i5 | 430UM | 2 (4) | 1.20 | 1.73 | HD Graphics | 166–500 | 3 MB | 18 W | May 2010 |
| Core i3 | 390M | 2 (4) | 2.66 | — | HD Graphics | 500–667 | 3 MB | 35 W | January 2011 |
| Core i3 | 380M | 2 (4) | 2.53 | — | HD Graphics | 500–667 | 3 MB | 35 W | September 2010 |
| Core i3 | 380UM | 2 (4) | 1.33 | — | HD Graphics | 166–500 | 3 MB | 18 W | October 2010 |
| Core i3 | 370M | 2 (4) | 2.40 | — | HD Graphics | 500–667 | 3 MB | 35 W | June 2010 |
| Core i3 | 350M | 2 (4) | 2.26 | — | HD Graphics | 500–667 | 3 MB | 35 W | January 2010 |
| Core i3 | 330M | 2 (4) | 2.13 | — | HD Graphics | 500–667 | 3 MB | 35 W | January 2010 |
| Core i3 | 330UM | 2 (4) | 1.20 | — | HD Graphics | 166–500 | 3 MB | 18 W | May 2010 |

### Core i (2nd gen)
#### Sandy Bridge-M

Common features:
* Socket: G2, BGA 1023 (dual-core models), BGA 1224 (quad-core models).
* All the CPUs support dual-channel DDR3 RAM. All models support it at 1333 MT/s speeds while i7-2720QM and above support up to 1600 MT/s speeds.
* All CPU models provide 16 lanes of PCIe 2.0.
* All CPUs feature a DMI 2.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 32 nm.
* XM-suffix models have an unlocked multiplier and can be overclocked.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 2960XM | 4 (8) | 2.7 | 3.7 | HD 3000 | 650–1300 | 8 MB | 55 W | September 2011 |
| Core i7 | 2920XM | 4 (8) | 2.5 | 3.5 | HD 3000 | 650–1300 | 8 MB | 55 W | January 2011 |
| Core i7 | 2860QM | 4 (8) | 2.5 | 3.6 | HD 3000 | 650–1300 | 8 MB | 45 W | September 2011 |
| Core i7 | 2820QM | 4 (8) | 2.3 | 3.4 | HD 3000 | 650–1300 | 8 MB | 45 W | January 2011 |
| Core i7 | 2760QM | 4 (8) | 2.4 | 3.5 | HD 3000 | 650–1300 | 6 MB | 45 W | September 2011 |
| Core i7 | 2720QM | 4 (8) | 2.2 | 3.3 | HD 3000 | 650–1300 | 6 MB | 45 W | January 2011 |
| Core i7 | 2675QM | 4 (8) | 2.2 | 3.1 | HD 3000 | 650–1200 | 6 MB | 45 W | October 2011 |
| Core i7 | 2670QM | 4 (8) | 2.2 | 3.1 | HD 3000 | 650–1100 | 6 MB | 45 W | October 2011 |
| Core i7 | 2635QM | 4 (8) | 2.0 | 2.9 | HD 3000 | 650–1200 | 6 MB | 45 W | January 2011 |
| Core i7 | 2630QM | 4 (8) | 2.0 | 2.9 | HD 3000 | 650–1100 | 6 MB | 45 W | January 2011 |
| Core i7 | 2677M | 2 (4) | 1.8 | 2.9 | HD 3000 | 350–1200 | 4 MB | 17 W | June 2011 |
| Core i7 | 2657M | 2 (4) | 1.6 | 2.7 | HD 3000 | 350–1000 | 4 MB | 17 W | February 2011 |
| Core i7 | 2640M | 2 (4) | 2.8 | 3.5 | HD 3000 | 650–1300 | 4 MB | 35 W | September 2011 |
| Core i7 | 2649M | 2 (4) | 2.3 | 3.2 | HD 3000 | 500–1100 | 4 MB | 25 W | February 2011 |
| Core i7 | 2637M | 2 (4) | 1.7 | 2.8 | HD 3000 | 350–1200 | 4 MB | 17 W | June 2011 |
| Core i7 | 2620M | 2 (4) | 2.7 | 3.4 | HD 3000 | 650–1300 | 4 MB | 35 W | February 2011 |
| Core i7 | 2629M | 2 (4) | 2.1 | 3.0 | HD 3000 | 500–1100 | 4 MB | 25 W | February 2011 |
| Core i7 | 2617M | 2 (4) | 1.5 | 2.6 | HD 3000 | 350–950 | 4 MB | 17 W | February 2011 |
| Core i5 | 2557M | 2 (4) | 1.7 | 2.7 | HD 3000 | 350–1200 | 3 MB | 17 W | June 2011 |
| Core i5 | 2540M | 2 (4) | 2.6 | 3.3 | HD 3000 | 650–1300 | 3 MB | 35 W | February 2011 |
| Core i5 | 2537M | 2 (4) | 1.4 | 2.3 | HD 3000 | 350–900 | 3 MB | 17 W | February 2011 |
| Core i5 | 2520M | 2 (4) | 2.5 | 3.2 | HD 3000 | 650–1300 | 3 MB | 35 W | February 2011 |
| Core i5 | 2467M | 2 (4) | 1.6 | 2.3 | HD 3000 | 350–1150 | 3 MB | 17 W | June 2011 |
| Core i5 | 2450M | 2 (4) | 2.5 | 3.1 | HD 3000 | 650–1300 | 3 MB | 35 W | January 2012 |
| Core i5 | 2435M | 2 (4) | 2.4 | 3.0 | HD 3000 | 650–1300 | 3 MB | 35 W | September 2011 |
| Core i5 | 2430M | 2 (4) | 2.4 | 3.0 | HD 3000 | 650–1200 | 3 MB | 35 W | October 2011 |
| Core i5 | 2415M | 2 (4) | 2.3 | 2.9 | HD 3000 | 650–1300 | 3 MB | 35 W | Q1 2011 |
| Core i5 | 2410M | 2 (4) | 2.3 | 2.9 | HD 3000 | 650–1200 | 3 MB | 35 W | February 2011 |
| Core i3 | 2370M | 2 (4) | 2.4 | — | HD 3000 | 650–1150 | 3 MB | 35 W | January 2012 |
| Core i3 | 2377M | 2 (4) | 1.5 | — | HD 3000 | 350–1000 | 3 MB | 17 W | September 2012 |
| Core i3 | 2375M | 2 (4) | 1.5 | — | HD 3000 | 350–1000 | 3 MB | 17 W | Q1 2013 |
| Core i3 | 2367M | 2 (4) | 1.4 | — | HD 3000 | 350–1000 | 3 MB | 17 W | October 2011 |
| Core i3 | 2365M | 2 (4) | 1.4 | — | HD 3000 | 350–1000 | 3 MB | 17 W | September 2012 |
| Core i3 | 2350M | 2 (4) | 2.3 | — | HD 3000 | 650–1150 | 3 MB | 35 W | October 2011 |
| Core i3 | 2357M | 2 (4) | 1.3 | — | HD 3000 | 350–950 | 3 MB | 17 W | June 2011 |
| Core i3 | 2348M | 2 (4) | 2.3 | — | HD 3000 | 650–1150 | 3 MB | 35 W | January 2013 |
| Core i3 | 2332M | 2 (4) | 2.2 | — | HD 3000 | 650–1100 | 3 MB | 35 W | September 2011 |
| Core i3 | 2330M | 2 (4) | 2.2 | — | HD 3000 | 650–1100 | 3 MB | 35 W | June 2011 |
| Core i3 | 2328M | 2 (4) | 2.2 | — | HD 3000 | 650–1100 | 3 MB | 35 W | September 2012 |
| Core i3 | 2312M | 2 (4) | 2.1 | — | HD 3000 | 650–1100 | 3 MB | 35 W | Q2 2011 |
| Core i3 | 2310M | 2 (4) | 2.1 | — | HD 3000 | 650–1100 | 3 MB | 35 W | February 2011 |
| Core i3 | 2308M | 2 (4) | 2.1 | — | HD 3000 | 650–1100 | 3 MB | 35 W | Q3 2012 |

### Core i (3rd gen)
#### Ivy Bridge

Common features:
* Socket: G2, BGA 1023 (dual-core models), BGA 1224 (quad-core models).
* All the CPUs support dual-channel DDR3 or DDR3L RAM, at up to 1600 MT/s speed.
* All CPU models provide 16 lanes of PCIe, except Y-suffix models which do not have PCIe support. i5 and i7 M-, QM- and XM-suffix models support it at PCIe 3.0 speeds, while all other models support it at PCIe 2.0 speeds.
* All CPUs feature a DMI 2.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 22 nm.
* XM-suffix models have an unlocked multiplier and can be overclocked.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 3940XM | 4 (8) | 3.0 | 3.9 | HD 4000 | 650–1350 | 8 MB | 55 W | September 2012 |
| Core i7 | 3920XM | 4 (8) | 2.9 | 3.8 | HD 4000 | 650–1300 | 8 MB | 55 W | April 2012 |
| Core i7 | 3840QM | 4 (8) | 2.8 | 3.8 | HD 4000 | 650–1300 | 8 MB | 45 W | September 2012 |
| Core i7 | 3820QM | 4 (8) | 2.7 | 3.7 | HD 4000 | 650–1250 | 8 MB | 45 W | April 2012 |
| Core i7 | 3740QM | 4 (8) | 2.7 | 3.7 | HD 4000 | 650–1300 | 6 MB | 45 W | September 2012 |
| Core i7 | 3720QM | 4 (8) | 2.6 | 3.6 | HD 4000 | 650–1250 | 6 MB | 45 W | April 2012 |
| Core i7 | 3635QM | 4 (8) | 2.4 | 3.4 | HD 4000 | 650–1200 | 6 MB | 45 W | September 2012 |
| Core i7 | 3630QM | 4 (8) | 2.4 | 3.4 | HD 4000 | 650–1150 | 6 MB | 45 W | September 2012 |
| Core i7 | 3632QM | 4 (8) | 2.2 | 3.2 | HD 4000 | 650–1150 | 6 MB | 35 W | October 2012 |
| Core i7 | 3615QM | 4 (8) | 2.3 | 3.3 | HD 4000 | 650–1200 | 6 MB | 45 W | April 2012 |
| Core i7 | 3610QM | 4 (8) | 2.3 | 3.3 | HD 4000 | 650–1100 | 6 MB | 45 W | April 2012 |
| Core i7 | 3612QM | 4 (8) | 2.1 | 3.1 | HD 4000 | 650–1100 | 6 MB | 35 W | April 2012 |
| Core i7 | 3687U | 2 (4) | 2.1 | 3.3 | HD 4000 | 350–1200 | 4 MB | 17 W | January 2013 |
| Core i7 | 3689Y | 2 (4) | 1.5 | 2.6 | HD 4000 | 350–850 | 4 MB | 13 W | January 2013 |
| Core i7 | 3667U | 2 (4) | 2.0 | 3.2 | HD 4000 | 350–1150 | 4 MB | 17 W | June 2012 |
| Core i7 | 3540M | 2 (4) | 3.0 | 3.7 | HD 4000 | 650–1300 | 4 MB | 35 W | January 2013 |
| Core i7 | 3537U | 2 (4) | 2.0 | 3.1 | HD 4000 | 350–1200 | 4 MB | 17 W | January 2013 |
| Core i7 | 3520M | 2 (4) | 2.9 | 3.6 | HD 4000 | 650–1250 | 4 MB | 35 W | June 2012 |
| Core i7 | 3517U | 2 (4) | 1.9 | 3.0 | HD 4000 | 350–1150 | 4 MB | 17 W | June 2012 |
| Core i5 | 3437U | 2 (4) | 1.9 | 2.9 | HD 4000 | 650–1200 | 3 MB | 17 W | January 2013 |
| Core i5 | 3439Y | 2 (4) | 1.5 | 2.3 | HD 4000 | 350–850 | 3 MB | 13 W | January 2013 |
| Core i5 | 3427U | 2 (4) | 1.8 | 2.8 | HD 4000 | 350–1150 | 3 MB | 17 W | June 2012 |
| Core i5 | 3380M | 2 (4) | 2.9 | 3.6 | HD 4000 | 650–1250 | 3 MB | 35 W | January 2013 |
| Core i5 | 3360M | 2 (4) | 2.8 | 3.5 | HD 4000 | 650–1200 | 3 MB | 35 W | June 2012 |
| Core i5 | 3340M | 2 (4) | 2.7 | 3.4 | HD 4000 | 650–1250 | 3 MB | 35 W | January 2013 |
| Core i5 | 3337U | 2 (4) | 1.8 | 2.7 | HD 4000 | 350–1100 | 3 MB | 17 W | January 2013 |
| Core i5 | 3339Y | 2 (4) | 1.5 | 2.0 | HD 4000 | 350–850 | 3 MB | 13 W | January 2013 |
| Core i5 | 3320M | 2 (4) | 2.6 | 3.3 | HD 4000 | 650–1200 | 3 MB | 35 W | June 2012 |
| Core i5 | 3317U | 2 (4) | 1.7 | 2.6 | HD 4000 | 350–1050 | 3 MB | 17 W | June 2012 |
| Core i5 | 3230M | 2 (4) | 2.6 | 3.2 | HD 4000 | 650–1100 | 3 MB | 35 W | January 2013 |
| Core i5 | 3210M | 2 (4) | 2.5 | 3.1 | HD 4000 | 650–1100 | 3 MB | 35 W | June 2012 |
| Core i3 | 3227U | 2 (4) | 1.9 | — | HD 4000 | 350–1100 | 3 MB | 17 W | January 2013 |
| Core i3 | 3229Y | 2 (4) | 1.4 | — | HD 4000 | 350–850 | 3 MB | 13 W | January 2013 |
| Core i3 | 3217U | 2 (4) | 1.8 | — | HD 4000 | 350–1050 | 3 MB | 17 W | June 2012 |
| Core i3 | 3130M | 2 (4) | 2.6 | — | HD 4000 | 650–1100 | 3 MB | 35 W | January 2013 |
| Core i3 | 3120M | 2 (4) | 2.5 | — | HD 4000 | 650–1100 | 3 MB | 35 W | September 2012 |
| Core i3 | 3110M | 2 (4) | 2.4 | — | HD 4000 | 650–1000 | 3 MB | 35 W | June 2012 |

### Core i (4th gen)
#### Haswell-MB

Common features:
* Socket: G3.
* All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed.
* All CPU models provide 16 lanes of PCIe. i5 and i7 models support it at PCIe 3.0 speeds, while i3 models support it at PCIe 2.0 speeds.
* All CPUs feature a DMI 2.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 22 nm.
* MX-suffix models have an unlocked multiplier and can be overclocked.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 4940MX | 4 (8) | 3.1 | 4.0 | HD 4600 | 400–1350 | 8 MB | 57 W | February 2014 |
| Core i7 | 4930MX | 4 (8) | 3.0 | 3.9 | HD 4600 | 400–1350 | 8 MB | 57 W | June 2013 |
| Core i7 | 4910MQ | 4 (8) | 2.9 | 3.9 | HD 4600 | 400–1300 | 8 MB | 47 W | February 2014 |
| Core i7 | 4900MQ | 4 (8) | 2.8 | 3.8 | HD 4600 | 400–1300 | 8 MB | 47 W | June 2013 |
| Core i7 | 4810MQ | 4 (8) | 2.8 | 3.8 | HD 4600 | 400–1300 | 6 MB | 47 W | February 2014 |
| Core i7 | 4800MQ | 4 (8) | 2.7 | 3.7 | HD 4600 | 400–1300 | 6 MB | 47 W | June 2013 |
| Core i7 | 4710MQ | 4 (8) | 2.5 | 3.5 | HD 4600 | 400–1150 | 6 MB | 47 W | April 2014 |
| Core i7 | 4712MQ | 4 (8) | 2.3 | 3.3 | HD 4600 | 400–1150 | 6 MB | 37 W | April 2014 |
| Core i7 | 4700MQ | 4 (8) | 2.4 | 3.4 | HD 4600 | 400–1150 | 6 MB | 47 W | June 2013 |
| Core i7 | 4702MQ | 4 (8) | 2.2 | 3.2 | HD 4600 | 400–1150 | 6 MB | 37 W | June 2013 |
| Core i7 | 4610M | 2 (4) | 3.0 | 3.7 | HD 4600 | 400–1300 | 4 MB | 37 W | February 2014 |
| Core i7 | 4600M | 2 (4) | 2.9 | 3.6 | HD 4600 | 400–1300 | 4 MB | 37 W | September 2013 |
| Core i5 | 4340M | 2 (4) | 2.9 | 3.6 | HD 4600 | 400–1250 | 3 MB | 37 W | February 2014 |
| Core i5 | 4330M | 2 (4) | 2.8 | 3.5 | HD 4600 | 400–1250 | 3 MB | 37 W | September 2013 |
| Core i5 | 4310M | 2 (4) | 2.7 | 3.4 | HD 4600 | 400–1250 | 3 MB | 37 W | February 2014 |
| Core i5 | 4300M | 2 (4) | 2.6 | 3.3 | HD 4600 | 400–1250 | 3 MB | 37 W | September 2013 |
| Core i5 | 4210M | 2 (4) | 2.6 | 3.2 | HD 4600 | 400–1150 | 3 MB | 37 W | April 2014 |
| Core i5 | 4200M | 2 (4) | 2.5 | 3.1 | HD 4600 | 400–1150 | 3 MB | 37 W | September 2013 |
| Core i3 | 4110M | 2 (4) | 2.6 | — | HD 4600 | 400–1100 | 3 MB | 37 W | April 2014 |
| Core i3 | 4100M | 2 (4) | 2.5 | — | HD 4600 | 400–1100 | 3 MB | 37 W | September 2013 |
| Core i3 | 4010M | 2 (4) | 2.5 | — | HD 4600 | 400–1100 | 3 MB | 37 W | Q3 2014 |
| Core i3 | 4000M | 2 (4) | 2.4 | — | HD 4600 | 400–1100 | 3 MB | 37 W | September 2013 |

#### Haswell-ULT

Common features:
* Socket: BGA 1168.
* All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1600 MT/s speed.
* All CPU models provide 12 lanes of PCIe 2.0 except i3-4xx5U models, which provide 10 lanes of PCIe 2.0.
* All CPUs feature a DMI 2.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 22 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 4650U | 2 (4) | 1.7 | 3.3 | HD 5000 | 200–1100 | 4 MB | 15 W | June 2013 |
| Core i7 | 4600U | 2 (4) | 2.1 | 3.3 | HD 4400 | 200–1100 | 4 MB | 15 W | September 2013 |
| Core i7 | 4578U | 2 (4) | 3.0 | 3.5 | Iris 5100 | 200–1200 | 4 MB | 28 W | July 2014 |
| Core i7 | 4558U | 2 (4) | 2.8 | 3.3 | Iris 5100 | 200–1200 | 4 MB | 28 W | June 2013 |
| Core i7 | 4550U | 2 (4) | 1.5 | 3.0 | HD 5000 | 200–1100 | 4 MB | 15 W | June 2013 |
| Core i7 | 4510U | 2 (4) | 2.0 | 3.1 | HD 4400 | 200–1100 | 4 MB | 15 W | April 2014 |
| Core i7 | 4500U | 2 (4) | 1.8 | 3.0 | HD 4400 | 200–1100 | 4 MB | 15 W | June 2013 |
| Core i5 | 4360U | 2 (4) | 1.5 | 3.0 | HD 5000 | 200–1100 | 3 MB | 15 W | February 2014 |
| Core i5 | 4350U | 2 (4) | 1.4 | 2.9 | HD 5000 | 200–1100 | 3 MB | 15 W | June 2013 |
| Core i5 | 4310U | 2 (4) | 2.0 | 3.0 | HD 4400 | 200–1100 | 3 MB | 15 W | February 2014 |
| Core i5 | 4308U | 2 (4) | 2.8 | 3.3 | Iris 5100 | 200–1200 | 3 MB | 28 W | July 2014 |
| Core i5 | 4300U | 2 (4) | 1.9 | 2.9 | HD 4400 | 200–1100 | 3 MB | 15 W | September 2013 |
| Core i5 | 4288U | 2 (4) | 2.6 | 3.1 | Iris 5100 | 200–1200 | 3 MB | 28 W | June 2013 |
| Core i5 | 4278U | 2 (4) | 2.6 | 3.1 | Iris 5100 | 200–1100 | 3 MB | 28 W | July 2014 |
| Core i5 | 4260U | 2 (4) | 1.4 | 2.7 | HD 5000 | 200–1000 | 3 MB | 15 W | April 2014 |
| Core i5 | 4258U | 2 (4) | 2.4 | 2.9 | Iris 5100 | 200–1100 | 3 MB | 28 W | June 2013 |
| Core i5 | 4250U | 2 (4) | 1.3 | 2.6 | HD 5000 | 200–1000 | 3 MB | 15 W | June 2013 |
| Core i5 | 4210U | 2 (4) | 1.7 | 2.7 | HD 4400 | 200–1000 | 3 MB | 15 W | April 2014 |
| Core i5 | 4200U | 2 (4) | 1.6 | 2.6 | HD 4400 | 200–1000 | 3 MB | 15 W | June 2013 |
| Core i3 | 4158U | 2 (4) | 2.0 | — | Iris 5100 | 200–1100 | 3 MB | 28 W | June 2013 |
| Core i3 | 4120U | 2 (4) | 2.0 | — | HD 4400 | 200–1000 | 3 MB | 15 W | April 2014 |
| Core i3 | 4100U | 2 (4) | 1.8 | — | HD 4400 | 200–1000 | 3 MB | 15 W | June 2013 |
| Core i3 | 4030U | 2 (4) | 1.9 | — | HD 4400 | 200–1000 | 3 MB | 15 W | April 2014 |
| Core i3 | 4025U | 2 (4) | 1.9 | — | HD 4400 | 200–950 | 3 MB | 15 W | April 2014 |
| Core i3 | 4010U | 2 (4) | 1.7 | — | HD 4400 | 200–1000 | 3 MB | 15 W | June 2013 |
| Core i3 | 4005U | 2 (4) | 1.7 | — | HD 4400 | 200–950 | 3 MB | 15 W | September 2013 |

#### Haswell-ULX

Common features:
* Socket: BGA 1168.
* All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1600 MT/s speed.
* All CPU models provide 12 lanes of PCIe 2.0.
* All CPUs feature a DMI 2.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 22 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 4610Y | 2 (4) | 1.7 | 2.9 | HD 4200 | 200–850 | 4 MB | 11.5 W | September 2013 |
| Core i5 | 4302Y | 2 (4) | 1.6 | 2.3 | HD 4200 | 200–850 | 3 MB | 11.5 W | September 2013 |
| Core i5 | 4300Y | 2 (4) | 1.6 | 2.3 | HD 4200 | 200–850 | 3 MB | 11.5 W | September 2013 |
| Core i5 | 4220Y | 2 (4) | 1.6 | 2.0 | HD 4200 | 200–850 | 3 MB | 11.5 W | April 2014 |
| Core i5 | 4210Y | 2 (4) | 1.5 | 1.9 | HD 4200 | 200–850 | 3 MB | 11.5 W | September 2013 |
| Core i5 | 4202Y | 2 (4) | 1.6 | 2.0 | HD 4200 | 200–850 | 3 MB | 11.5 W | September 2013 |
| Core i5 | 4200Y | 2 (4) | 1.4 | 1.9 | HD 4200 | 200–850 | 3 MB | 11.5 W | June 2013 |
| Core i3 | 4030Y | 2 (4) | 1.6 | — | HD 4200 | 200–850 | 3 MB | 11.5 W | April 2014 |
| Core i3 | 4020Y | 2 (4) | 1.5 | — | HD 4200 | 200–850 | 3 MB | 11.5 W | September 2013 |
| Core i3 | 4012Y | 2 (4) | 1.5 | — | HD 4200 | 200–850 | 3 MB | 11.5 W | September 2013 |
| Core i3 | 4010Y | 2 (4) | 1.3 | — | HD 4200 | 200–850 | 3 MB | 11.5 W | June 2013 |

#### Haswell-H

Common features:
* Socket: BGA 1364.
* All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed.
* All CPU models provide 16 lanes of PCIe 3.0.
* All CPUs feature a DMI 2.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Models with Iris Pro 5200 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
* Fabrication process: 22 nm.
* i7-4950HQ comes with an unlocked multiplier, allowing for users to overclock it beyond the factory set clock speed.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 4980HQ | 4 (8) | 2.8 | 4.0 | Iris Pro 5200 | 200–1300 | 6 MB | 47 W | July 2014 |
| Core i7 | 4960HQ | 4 (8) | 2.6 | 3.8 | Iris Pro 5200 | 200–1300 | 6 MB | 47 W | September 2013 |
| Core i7 | 4950HQ | 4 (8) | 2.4 | 3.6 | Iris Pro 5200 | 200–1300 | 6 MB | 47 W | June 2013 |
| Core i7 | 4870HQ | 4 (8) | 2.5 | 3.7 | Iris Pro 5200 | 200–1200 | 6 MB | 47 W | July 2014 |
| Core i7 | 4860HQ | 4 (8) | 2.4 | 3.6 | Iris Pro 5200 | 200–1200 | 6 MB | 47 W | February 2014 |
| Core i7 | 4850HQ | 4 (8) | 2.3 | 3.5 | Iris Pro 5200 | 200–1200 | 6 MB | 47 W | June 2013 |
| Core i7 | 4770HQ | 4 (8) | 2.2 | 3.4 | Iris Pro 5200 | 200–1200 | 6 MB | 47 W | July 2014 |
| Core i7 | 4760HQ | 4 (8) | 2.1 | 3.3 | Iris Pro 5200 | 200–1200 | 6 MB | 47 W | April 2014 |
| Core i7 | 4750HQ | 4 (8) | 2.0 | 3.2 | Iris Pro 5200 | 200–1200 | 6 MB | 47 W | June 2013 |
| Core i7 | 4720HQ | 4 (8) | 2.6 | 3.6 | HD 4600 | 400–1200 | 6 MB | 47 W | January 2015 |
| Core i7 | 4722HQ | 4 (8) | 2.4 | 3.4 | HD 4600 | 400–1150 | 6 MB | 37 W | January 2015 |
| Core i7 | 4710HQ | 4 (8) | 2.5 | 3.5 | HD 4600 | 400–1200 | 6 MB | 47 W | April 2014 |
| Core i7 | 4712HQ | 4 (8) | 2.3 | 3.3 | HD 4600 | 400–1150 | 6 MB | 37 W | April 2014 |
| Core i7 | 4700HQ | 4 (8) | 2.4 | 3.4 | HD 4600 | 400–1200 | 6 MB | 47 W | June 2013 |
| Core i7 | 4702HQ | 4 (8) | 2.2 | 3.2 | HD 4600 | 400–1150 | 6 MB | 37 W | June 2013 |
| Core i5 | 4210H | 2 (4) | 2.9 | 3.5 | HD 4600 | 400–1150 | 3 MB | 47 W | July 2014 |
| Core i5 | 4200H | 2 (4) | 2.8 | 3.4 | HD 4600 | 400–1150 | 3 MB | 47 W | September 2013 |

### Core i (5th gen)
#### Broadwell-U

Common features:
* Socket: BGA 1168.
* All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1600 MT/s speed. Models i5-5350U or above, along with all ix-5xx7 models, support LPDDR3 up to 1866 MT/s speed.
* All CPU models provide 12 lanes of PCIe 2.0.
* All CPUs feature a DMI 2.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 14 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 5650U | 2 (4) | 2.2 | 3.2 | HD 6000 | 300–1000 | 4 MB | 15 W | January 2015 |
| Core i7 | 5600U | 2 (4) | 2.6 | 3.2 | HD 5500 | 300–950 | 4 MB | 15 W | January 2015 |
| Core i7 | 5557U | 2 (4) | 3.1 | 3.4 | Iris 6100 | 300–1100 | 4 MB | 28 W | January 2015 |
| Core i7 | 5550U | 2 (4) | 2.0 | 3.0 | HD 6000 | 300–1000 | 4 MB | 15 W | January 2015 |
| Core i7 | 5500U | 2 (4) | 2.4 | 3.0 | HD 5500 | 300–950 | 4 MB | 15 W | January 2015 |
| Core i5 | 5350U | 2 (4) | 1.8 | 2.9 | HD 6000 | 300–1000 | 3 MB | 15 W | January 2015 |
| Core i5 | 5300U | 2 (4) | 2.3 | 2.9 | HD 5500 | 300–900 | 3 MB | 15 W | January 2015 |
| Core i5 | 5287U | 2 (4) | 2.9 | 3.3 | Iris 6100 | 300–1100 | 3 MB | 28 W | January 2015 |
| Core i5 | 5257U | 2 (4) | 2.7 | 3.1 | Iris 6100 | 300–1050 | 3 MB | 28 W | January 2015 |
| Core i5 | 5250U | 2 (4) | 1.6 | 2.7 | HD 6000 | 300–1000 | 3 MB | 15 W | January 2015 |
| Core i5 | 5200U | 2 (4) | 2.2 | 2.7 | HD 5500 | 300–900 | 3 MB | 15 W | January 2015 |
| Core i3 | 5157U | 2 (4) | 2.5 | — | Iris 6100 | 300–1000 | 3 MB | 28 W | January 2015 |
| Core i3 | 5020U | 2 (4) | 2.2 | — | HD 5500 | 300–900 | 3 MB | 15 W | March 2015 |
| Core i3 | 5015U | 2 (4) | 2.1 | — | HD 5500 | 300–850 | 3 MB | 15 W | March 2015 |
| Core i3 | 5010U | 2 (4) | 2.1 | — | HD 5500 | 300–900 | 3 MB | 15 W | January 2015 |
| Core i3 | 5005U | 2 (4) | 2.0 | — | HD 5500 | 300–850 | 3 MB | 15 W | January 2015 |

#### Broadwell-H

Common features:
* Socket: BGA 1364.
* All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1866 MT/s speed.
* All CPU models provide 16 lanes of PCIe 3.0.
* All CPUs feature a DMI 2.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Models with Iris Pro 6200 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
* Fabrication process: 14 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 5950HQ | 4 (8) | 2.9 | 3.7 | Iris Pro 6200 | 300–1150 | 6 MB | 47 W | June 2015 |
| Core i7 | 5850HQ | 4 (8) | 2.7 | 3.6 | Iris Pro 6200 | 300–1100 | 6 MB | 47 W | June 2015 |
| Core i7 | 5750HQ | 4 (8) | 2.5 | 3.4 | Iris Pro 6200 | 300–1050 | 6 MB | 47 W | June 2015 |
| Core i7 | 5700HQ | 4 (8) | 2.7 | 3.5 | HD 5600 | 300–1050 | 6 MB | 47 W | June 2015 |
| Core i5 | 5350H | 2 (4) | 3.1 | 3.5 | Iris Pro 6200 | 300–1050 | 4 MB | 47 W | June 2015 |

### Core M (5th gen)
#### Broadwell-Y

Common features:
* Socket: BGA 1234.
* All the CPUs support dual-channel DDR3L, DDR3L-RS or LPDDR3 RAM, at up to 1600 MT/s speed.
* All CPU models provide 12 lanes of PCIe 2.0.
* All CPUs feature a DMI 2.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 14 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core M | 5Y71 | 2 (4) | 1.2 | 2.9 | HD 5300 | 300–900 | 4 MB | 4.5 W | October 2014 |
| Core M | 5Y70 | 2 (4) | 1.1 | 2.6 | HD 5300 | 100–850 | 4 MB | 4.5 W | September 2014 |
| Core M | 5Y51 | 2 (4) | 1.1 | 2.6 | HD 5300 | 300–900 | 4 MB | 4.5 W | October 2014 |
| Core M | 5Y31 | 2 (4) | 0.9 | 2.4 | HD 5300 | 300–850 | 4 MB | 4.5 W | October 2014 |
| Core M | 5Y10c | 2 (4) | 0.8 | 2.0 | HD 5300 | 300–800 | 4 MB | 4.5 W | October 2014 |
| Core M | 5Y10a | 2 (4) | 0.8 | 2.0 | HD 5300 | 100–800 | 4 MB | 4.5 W | September 2014 |
| Core M | 5Y10 | 2 (4) | 0.8 | 2.0 | HD 5300 | 100–800 | 4 MB | 4.5 W | September 2014 |

### Core i (6th gen)
#### Skylake-U

Common features:
* Socket: BGA 1356.
* All the CPUs support dual-channel DDR4-2133, DDR3L-1600 or LPDDR3-1866 RAM.
* All CPU models provide 12 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 14 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 6660U | 2 (4) | 2.4 | 3.4 | Iris 540 | 300–1050 | 4 MB | 15 W | March 2016 |
| Core i7 | 6650U | 2 (4) | 2.2 | 3.4 | Iris 540 | 300–1050 | 4 MB | 15 W | September 2015 |
| Core i7 | 6600U | 2 (4) | 2.6 | 3.4 | HD 520 | 300–1050 | 4 MB | 15 W | September 2015 |
| Core i7 | 6567U | 2 (4) | 3.3 | 3.6 | Iris 550 | 300–1100 | 4 MB | 28 W | September 2015 |
| Core i7 | 6560U | 2 (4) | 2.2 | 3.2 | Iris 540 | 300–1050 | 4 MB | 15 W | September 2015 |
| Core i7 | 6500U | 2 (4) | 2.5 | 3.1 | HD 520 | 300–1050 | 4 MB | 15 W | September 2015 |
| Core i7 | 6498DU | 2 (4) | 2.5 | 3.1 | HD 510 | 300–1050 | 4 MB | 15 W | December 2015 |
| Core i5 | 6360U | 2 (4) | 2.0 | 3.1 | Iris 540 | 300–1000 | 3 MB | 15 W | September 2015 |
| Core i5 | 6300U | 2 (4) | 2.4 | 3.0 | HD 520 | 300–1000 | 3 MB | 15 W | September 2015 |
| Core i5 | 6287U | 2 (4) | 3.1 | 3.5 | Iris 550 | 300–1100 | 4 MB | 28 W | September 2015 |
| Core i5 | 6267U | 2 (4) | 2.9 | 3.3 | Iris 550 | 300–1050 | 4 MB | 28 W | September 2015 |
| Core i5 | 6260U | 2 (4) | 1.8 | 2.9 | Iris 540 | 300–950 | 4 MB | 15 W | September 2015 |
| Core i5 | 6200U | 2 (4) | 2.3 | 2.8 | HD 520 | 300–1000 | 3 MB | 15 W | September 2015 |
| Core i5 | 6198DU | 2 (4) | 2.3 | 2.8 | HD 510 | 300–1000 | 3 MB | 15 W | December 2015 |
| Core i3 | 6167U | 2 (4) | 2.7 | — | Iris 550 | 300–1000 | 3 MB | 28 W | December 2015 |
| Core i3 | 6157U | 2 (4) | 2.4 | — | Iris 550 | 300–1000 | 3 MB | 28 W | September 2016 |
| Core i3 | 6100U | 2 (4) | 2.3 | — | HD 520 | 300–1000 | 3 MB | 15 W | September 2015 |
| Core i3 | 6006U | 2 (4) | 2.0 | — | HD 520 | 300–900 | 3 MB | 15 W | November 2016 |

#### Skylake-H

Common features:
* Socket: BGA 1440.
* All the CPUs support dual-channel DDR4-2133, DDR3L-1600 or LPDDR3-1866 RAM.
* All CPU models provide 16 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Models with Iris Pro 580 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
* Fabrication process: 14 nm.
* K-suffix processors have an unlocked multiplier, allowing it to be overclocked.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 6970HQ | 4 (8) | 2.8 | 3.7 | Iris Pro 580 | 350–1050 | 8 MB | 45 W | January 2016 |
| Core i7 | 6920HQ | 4 (8) | 2.9 | 3.8 | HD 530 | 350–1050 | 8 MB | 45 W | September 2015 |
| Core i7 | 6870HQ | 4 (8) | 2.7 | 3.6 | Iris Pro 580 | 350–1000 | 8 MB | 45 W | January 2016 |
| Core i7 | 6820HQ | 4 (8) | 2.7 | 3.6 | HD 530 | 350–1050 | 8 MB | 45 W | September 2015 |
| Core i7 | 6820HK | 4 (8) | 2.7 | 3.6 | HD 530 | 350–1050 | 8 MB | 45 W | September 2015 |
| Core i7 | 6770HQ | 4 (8) | 2.6 | 3.5 | Iris Pro 580 | 350–950 | 6 MB | 45 W | January 2016 |
| Core i7 | 6700HQ | 4 (8) | 2.6 | 3.5 | HD 530 | 350–1050 | 6 MB | 45 W | September 2015 |
| Core i5 | 6440HQ | 4 (4) | 2.6 | 3.5 | HD 530 | 350–950 | 6 MB | 45 W | September 2015 |
| Core i5 | 6350HQ | 4 (4) | 2.3 | 3.2 | Iris Pro 580 | 350–900 | 6 MB | 45 W | February 2016 |
| Core i5 | 6300HQ | 4 (4) | 2.3 | 3.2 | HD 530 | 350–950 | 6 MB | 45 W | September 2015 |
| Core i3 | 6100H | 2 (4) | 2.7 | — | HD 530 | 350–900 | 3 MB | 35 W | September 2015 |

### Core M (6th gen)
#### Skylake-Y

Common features:
* Socket: BGA 1515.
* All the CPUs support dual-channel DDR3L-1600 or LPDDR3-1866 RAM.
* All CPU models provide 10 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 14 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core m7 | 6Y75 | 2 (4) | 1.2 | 3.1 | HD 515 | 300–1000 | 4 MB | 4.5 W | September 2015 |
| Core m5 | 6Y57 | 2 (4) | 1.1 | 2.8 | HD 515 | 300–900 | 4 MB | 4.5 W | September 2015 |
| Core m5 | 6Y54 | 2 (4) | 1.1 | 2.7 | HD 515 | 300–900 | 4 MB | 4.5 W | September 2015 |
| Core m3 | 6Y30 | 2 (4) | 0.9 | 2.2 | HD 515 | 300–850 | 4 MB | 4.5 W | September 2015 |

### Core i (7th gen)
#### Kaby Lake-U

Common features:
* Socket: BGA 1356.
* All the CPUs support dual-channel DDR4-2133, DDR3L-1600 or LPDDR3-1866 RAM.
* All CPU models provide 12 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 14 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 7660U | 2 (4) | 2.5 | 4.0 | Iris Plus 640 | 300–1100 | 4 MB | 15 W | January 2017 |
| Core i7 | 7600U | 2 (4) | 2.8 | 3.9 | HD 620 | 300–1150 | 4 MB | 15 W | January 2017 |
| Core i7 | 7567U | 2 (4) | 3.5 | 4.0 | Iris Plus 650 | 300–1150 | 4 MB | 28 W | January 2017 |
| Core i7 | 7560U | 2 (4) | 2.4 | 3.8 | Iris Plus 640 | 300–1050 | 4 MB | 15 W | January 2017 |
| Core i7 | 7500U | 2 (4) | 2.7 | 3.5 | HD 620 | 300–1050 | 4 MB | 15 W | September 2016 |
| Core i5 | 7360U | 2 (4) | 2.3 | 3.6 | Iris Plus 640 | 300–1000 | 4 MB | 15 W | January 2017 |
| Core i5 | 7300U | 2 (4) | 2.6 | 3.5 | HD 620 | 300–1100 | 3 MB | 15 W | January 2017 |
| Core i5 | 7287U | 2 (4) | 3.3 | 3.7 | Iris Plus 650 | 300–1100 | 4 MB | 28 W | January 2017 |
| Core i5 | 7267U | 2 (4) | 3.1 | 3.5 | Iris Plus 650 | 300–1050 | 4 MB | 28 W | January 2017 |
| Core i5 | 7260U | 2 (4) | 2.2 | 3.4 | Iris Plus 640 | 300–950 | 4 MB | 15 W | January 2017 |
| Core i5 | 7200U | 2 (4) | 2.5 | 3.1 | HD 620 | 300–1000 | 3 MB | 15 W | September 2016 |
| Core i3 | 7167U | 2 (4) | 2.8 | — | Iris Plus 650 | 300–1000 | 3 MB | 28 W | January 2017 |
| Core i3 | 7130U | 2 (4) | 2.7 | — | HD 620 | 300–1000 | 3 MB | 15 W | June 2017 |
| Core i3 | 7100U | 2 (4) | 2.4 | — | HD 620 | 300–1000 | 3 MB | 15 W | September 2016 |
| Core i3 | 7020U | 2 (4) | 2.3 | — | HD 620 | 300–1000 | 3 MB | 15 W | Q2 2018 |

#### Kaby Lake-H

Common features:
* Socket: BGA 1440.
* All the CPUs support dual-channel DDR4-2400, DDR3L-1600 or LPDDR3-2133 RAM.
* All CPU models provide 16 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 14 nm.
* K-suffix processors have an unlocked multiplier, allowing it to be overclocked.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 7920HQ | 4 (8) | 3.1 | 4.1 | HD 630 | 350–1100 | 8 MB | 45 W | January 2017 |
| Core i7 | 7820HK | 4 (8) | 2.9 | 3.9 | HD 630 | 350–1100 | 8 MB | 45 W | January 2017 |
| Core i7 | 7820HQ | 4 (8) | 2.9 | 3.9 | HD 630 | 350–1100 | 8 MB | 45 W | January 2017 |
| Core i7 | 7700HQ | 4 (8) | 2.8 | 3.8 | HD 630 | 350–1100 | 6 MB | 45 W | January 2017 |
| Core i5 | 7440HQ | 4 (4) | 2.8 | 3.8 | HD 630 | 300–1000 | 6 MB | 45 W | January 2017 |
| Core i5 | 7300HQ | 4 (4) | 2.5 | 3.5 | HD 630 | 300–1000 | 6 MB | 45 W | January 2017 |
| Core i3 | 7100H | 2 (4) | 3.0 | — | HD 630 | 300–950 | 3 MB | 35 W | January 2017 |

#### Kaby Lake-Y

Common features:
* Socket: BGA 1515.
* All the CPUs support dual-channel LPDDR3-1866 or DDR3L-1600 RAM.
* All CPU models provide 10 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 14 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 7Y75 | 2 (4) | 1.3 | 3.6 | HD 615 | 300–1050 | 4 MB | 4.5 W | September 2016 |
| Core i5 | 7Y57 | 2 (4) | 1.2 | 3.3 | HD 615 | 300–950 | 4 MB | 4.5 W | January 2017 |
| Core i5 | 7Y54 | 2 (4) | 1.2 | 3.2 | HD 615 | 300–950 | 4 MB | 4.5 W | September 2016 |

### Core M (7th gen)
#### Kaby Lake-Y

Core m5 and Core m7 models were rebranded as Core i5 and Core i7.
Common features:
* Socket: BGA 1515.
* All the CPUs support dual-channel DDR3L-1600 or LPDDR3-1866 RAM.
* All CPU models provide 10 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 14 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core m3 | 7Y32 | 2 (4) | 1.1 | 3.0 | HD 615 | 300–900 | 4 MB | 4.5 W | April 2017 |
| Core m3 | 7Y30 | 2 (4) | 1.0 | 2.6 | HD 615 | 300–900 | 4 MB | 4.5 W | September 2016 |

### Core i (8th gen)
#### Coffee Lake-U

Common features:
* Socket: BGA 1528.
* All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
* All CPU models provide 16 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 14 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 8569U | 4 (8) | 2.8 | 4.7 | Iris Plus 655 | 300–1200 | 8 MB | 28 W | May 2019 |
| Core i7 | 8559U | 4 (8) | 2.7 | 4.5 | Iris Plus 655 | 300–1200 | 8 MB | 28 W | April 2019 |
| Core i7 | 8557U | 4 (8) | 1.7 | 4.5 | Iris Plus 645 | 300–1150 | 8 MB | 15 W | July 2019 |
| Core i5 | 8279U | 4 (8) | 2.4 | 4.1 | Iris Plus 655 | 300–1150 | 6 MB | 28 W | May 2019 |
| Core i5 | 8269U | 4 (8) | 2.6 | 4.2 | Iris Plus 655 | 300–1100 | 6 MB | 28 W | April 2018 |
| Core i5 | 8260U | 4 (8) | 1.6 | 3.9 | UHD 620 | 300–1100 | 6 MB | 15 W | Q4 2019 |
| Core i5 | 8259U | 4 (8) | 2.3 | 3.8 | Iris Plus 655 | 300–1050 | 6 MB | 28 W | April 2018 |
| Core i5 | 8257U | 4 (8) | 1.4 | 3.9 | Iris Plus 645 | 300–1050 | 6 MB | 15 W | July 2019 |
| Core i3 | 8140U | 2 (4) | 2.1 | 3.9 | UHD 620 | 300–1000 | 4 MB | 15 W | Q4 2019 |
| Core i3 | 8109U | 2 (4) | 3.0 | 3.6 | Iris Plus 655 | 300–1050 | 4 MB | 28 W | April 2018 |

#### Coffee Lake-H

Common features:
* Socket: BGA 1440.
* All the CPUs support dual-channel DDR4-2666 RAM. Models i5-8300H and above also support LPDDR3-2133 RAM.
* All CPU models provide 16 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 14 nm.
* K-suffix processors have an unlocked multiplier, allowing it to be overclocked.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i9 | 8950HK | 6 (12) | 2.9 | 4.8 | UHD 630 | 350–1200 | 12 MB | 45 W | April 2018 |
| Core i7 | 8850H | 6 (12) | 2.6 | 4.3 | UHD 630 | 350–1150 | 9 MB | 45 W | April 2018 |
| Core i7 | 8750H | 6 (12) | 2.2 | 4.1 | UHD 630 | 350–1100 | 9 MB | 45 W | April 2018 |
| Core i5 | 8400H | 4 (8) | 2.5 | 4.2 | UHD 630 | 350–1100 | 8 MB | 45 W | April 2018 |
| Core i5 | 8300H | 4 (8) | 2.3 | 4.0 | UHD 630 | 350–1000 | 8 MB | 45 W | April 2018 |
| Core i3 | 8100H | 4 (4) | 3.0 | — | UHD 630 | 350–1000 | 6 MB | 45 W | July 2018 |

#### Coffee Lake-B

Common features:
* Socket: BGA 1440.
* All the CPUs support dual-channel DDR4-2666 RAM.
* All CPU models provide 16 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 14 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 8700B | 6 (12) | 3.2 | 4.6 | UHD 630 | 350–1200 | 12 MB | 65 W | April 2018 |
| Core i5 | 8500B | 6 (6) | 3.0 | 4.1 | UHD 630 | 350–1100 | 9 MB | 65 W | April 2018 |
| Core i5 | 8400B | 6 (6) | 2.8 | 4.0 | UHD 630 | 350–1050 | 9 MB | 65 W | April 2018 |
| Core i3 | 8100B | 4 (4) | 3.6 | — | UHD 630 | 350–1050 | 6 MB | 65 W | Q3 2018 |

#### Kaby Lake Refresh

Common features:
* Socket: BGA 1356.
* All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
* All CPU models provide 12 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 14 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 8650U | 4 (8) | 1.9 | 4.2 | UHD 620 | 300–1150 | 8 MB | 15 W | August 2017 |
| Core i7 | 8550U | 4 (8) | 1.8 | 4.0 | UHD 620 | 300–1150 | 8 MB | 15 W | August 2017 |
| Core i5 | 8350U | 4 (8) | 1.7 | 3.6 | UHD 620 | 300–1100 | 6 MB | 15 W | August 2017 |
| Core i5 | 8250U | 4 (8) | 1.6 | 3.4 | UHD 620 | 300–1100 | 6 MB | 15 W | August 2017 |
| Core i3 | 8130U | 2 (4) | 2.2 | 3.4 | UHD 620 | 300–1000 | 4 MB | 15 W | February 2018 |

#### Kaby Lake-G

Common features:
* Socket: BGA 2270.
* All the CPUs support dual-channel DDR4-2400 RAM.
* All CPU models provide 8 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* Kaby Lake-G CPUs have an embedded discrete Radeon RX Vega M GPU as listed in the table below, which have HBM2 VRAM also embedded on the CPU package.
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 14 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Embedded dGPU | Embedded dGPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 8809G | 4 (8) | 3.1 | 4.2 | HD 630 | 350–1100 | RX Vega M GH | 1063–1190 | 8 MB | 100 W | February 2018 |
| Core i7 | 8709G | 4 (8) | 3.1 | 4.1 | HD 630 | 350–1100 | RX Vega M GH | 1063–1190 | 8 MB | 100 W | February 2018 |
| Core i7 | 8706G | 4 (8) | 3.1 | 4.1 | HD 630 | 350–1100 | RX Vega M GL | 931–1011 | 8 MB | 65 W | February 2018 |
| Core i7 | 8705G | 4 (8) | 3.1 | 4.1 | HD 630 | 350–1100 | RX Vega M GL | 931–1011 | 8 MB | 65 W | February 2018 |
| Core i5 | 8305G | 4 (8) | 2.8 | 3.2 | HD 630 | 350–1000 | RX Vega M GL | 931–1011 | 6 MB | 65 W | February 2018 |

#### Amber Lake-Y

Common features:
* Socket: BGA 1515.
* All the CPUs support dual-channel LPDDR3-1866 or DDR3L-1600 RAM.
* All CPU models provide 10 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 14 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 8500Y | 2 (4) | 1.5 | 4.2 | UHD 615 | 300–1050 | 4 MB | 5 W | August 2018 |
| Core i5 | 8310Y | 2 (4) | 1.6 | 3.9 | UHD 617 | 300–1050 | 4 MB | 7 W | Q1 2019 |
| Core i5 | 8210Y | 2 (4) | 1.6 | 3.6 | UHD 617 | 300–1050 | 4 MB | 7 W | October 2018 |
| Core i5 | 8200Y | 2 (4) | 1.3 | 3.9 | UHD 615 | 300–950 | 4 MB | 5 W | August 2018 |

#### Whiskey Lake-U

Common features:
* Socket: BGA 1528.
* All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
* All CPU models provide 16 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 14 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 8665U | 4 (8) | 1.9 | 4.8 | UHD 620 | 300–1150 | 8 MB | 15 W | April 2019 |
| Core i7 | 8565U | 4 (8) | 1.8 | 4.6 | UHD 620 | 300–1150 | 8 MB | 15 W | August 2018 |
| Core i5 | 8365U | 4 (8) | 1.6 | 4.1 | UHD 620 | 300–1100 | 6 MB | 15 W | April 2019 |
| Core i5 | 8265U | 4 (8) | 1.6 | 3.9 | UHD 620 | 300–1100 | 6 MB | 15 W | August 2018 |
| Core i3 | 8145U | 2 (4) | 2.1 | 3.9 | UHD 620 | 300–1000 | 4 MB | 15 W | August 2018 |

#### Cannon Lake-U

Common features:
* Socket: BGA 1528.
* All the CPUs support dual-channel DDR4-2400 or LPDDR4(x)-2400 RAM.
* All CPU models provide 16 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 10 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i3 | 8121U | 2 (4) | 2.2 | 3.2 | — | — | 4 MB | 15 W | May 2018 |

### Core M (8th gen)
#### Amber Lake-Y

Core m5 and Core m7 models were rebranded as Core i5 and Core i7.
Common features:
* Socket: BGA 1515.
* All the CPUs support dual-channel DDR3L-1600 or LPDDR3-1866 RAM.
* All CPU models provide 10 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 14 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core m3 | 8100Y | 2 (4) | 1.1 | 3.4 | UHD 615 | 300–900 | 4 MB | 5 W | August 2018 |

### Core i (9th gen)
#### Coffee Lake-H (refresh)

Common features:
* Socket: BGA 1440.
* All the CPUs support dual-channel DDR4-2666 or LPDDR3-2133 RAM.
* All CPU models provide 16 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 14 nm.
* K-suffix processors have an unlocked multiplier, allowing it to be overclocked.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i9 | 9980HK | 8 (16) | 2.4 | 5.0 | UHD 630 | 350–1250 | 16 MB | 45 W | April 2019 |
| Core i9 | 9880H | 8 (16) | 2.3 | 4.8 | UHD 630 | 350–1200 | 16 MB | 45 W | April 2019 |
| Core i7 | 9850H | 6 (12) | 2.6 | 4.6 | UHD 630 | 350–1150 | 12 MB | 45 W | April 2019 |
| Core i7 | 9750H | 6 (12) | 2.6 | 4.5 | UHD 630 | 350–1150 | 12 MB | 45 W | April 2019 |
| Core i7 | 9750HF | 6 (12) | 2.6 | 4.5 | — | — | | 12 MB | 45 W | April 2019 |
| Core i5 | 9400H | 4 (8) | 2.5 | 4.3 | UHD 630 | 350–1100 | 8 MB | 45 W | April 2019 |
| Core i5 | 9300H | 4 (8) | 2.4 | 4.1 | UHD 630 | 350–1050 | 8 MB | 45 W | April 2019 |
| Core i5 | 9300HF | 4 (8) | 2.4 | 4.1 | — | — | | 8 MB | 45 W | April 2019 |

### Core i (10th gen)
#### Comet Lake-U

Common features:
* Socket: BGA 1528.
* All the CPUs support dual-channel DDR4-2666, LPDDR4-2933 or LPDDR3-2133 RAM.
* All CPU models provide 16 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 14 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 10810U | 6 (12) | 1.1 | 4.7 | UHD 620 | 300–1150 | 12 MB | 15 W | May 2020 |
| Core i7 | 10710U | 6 (12) | 1.1 | 4.7 | UHD 620 | 300–1150 | 12 MB | 15 W | August 2019 |
| Core i7 | 10610U | 4 (8) | 1.8 | 4.9 | UHD 620 | 300–1150 | 8 MB | 15 W | May 2020 |
| Core i7 | 10510U | 4 (8) | 1.8 | 4.9 | UHD 620 | 300–1150 | 8 MB | 15 W | August 2019 |
| Core i5 | 10310U | 4 (8) | 1.7 | 4.4 | UHD 620 | 300–1150 | 6 MB | 15 W | May 2020 |
| Core i5 | 10210U | 4 (8) | 1.6 | 4.2 | UHD 620 | 300–1100 | 6 MB | 15 W | August 2019 |
| Core i3 | 10110U | 2 (4) | 2.1 | 4.1 | UHD 620 | 300–1000 | 4 MB | 15 W | August 2019 |

#### Comet Lake-H

Common features:
* Socket: BGA 1440.
* All the CPUs support dual-channel DDR4 RAM, at up to 2933 MT/s speed.
* All CPU models provide 16 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 14 nm.
* K-suffix processors have an unlocked multiplier, allowing it to be overclocked.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | TVB | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i9 | 10980HK | 8 (16) | 2.4 | 5.1 | 5.3 | UHD 630 | 350–1250 | 16 MB | 45 W | April 2020 |
| Core i9 | 10885H | 8 (16) | 2.4 | 5.1 | 5.3 | UHD 630 | 350–1250 | 16 MB | 45 W | May 2020 |
| Core i7 | 10875H | 8 (16) | 2.3 | 4.9 | 5.1 | UHD 630 | 350–1200 | 16 MB | 45 W | April 2020 |
| Core i7 | 10870H | 8 (16) | 2.2 | 4.8 | 5.0 | UHD 630 | 350–1200 | 16 MB | 45 W | September 2020 |
| Core i7 | 10850H | 6 (12) | 2.7 | 4.9 | 5.1 | UHD 630 | 350–1150 | 12 MB | 45 W | April 2020 |
| Core i7 | 10750H | 6 (12) | 2.6 | 4.8 | 5.0 | UHD 630 | 350–1150 | 12 MB | 45 W | April 2020 |
| Core i5 | 10500H | 6 (12) | 2.5 | 4.5 | — | UHD 630 | 350–1050 | 12 MB | 45 W | December 2020 |
| Core i5 | 10400H | 4 (8) | 2.6 | 4.6 | — | UHD 630 | 350–1100 | 8 MB | 45 W | April 2020 |
| Core i5 | 10300H | 4 (8) | 2.5 | 4.5 | — | UHD 630 | 350–1050 | 8 MB | 45 W | April 2020 |
| Core i5 | 10200H | 4 (8) | 2.4 | 4.1 | — | UHD 630 | 350–1050 | 8 MB | 45 W | August 2020 |

#### Ice Lake-U

Common features:
* Socket: BGA 1526, except for models with 'N' in the name which use a smaller BGA 1344 package.
* All the CPUs support dual-channel DDR4-3200 or LPDDR4-3733 RAM.
* PCIe 3.0 support.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
* L2 cache: 512 KB per core.
* Fabrication process: 10 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 1068NG7 | 4 (8) | 2.3 | 4.1 | Iris Plus (G7) | 300–1100 | 8 MB | 28 W | May 2020 |
| Core i7 | 1068G7 | 4 (8) | 2.3 | 4.1 | Iris Plus (G7) | 300–1100 | 8 MB | 28 W | August 2019 |
| Core i7 | 1065G7 | 4 (8) | 1.3 | 3.9 | Iris Plus (G7) | 300–1100 | 8 MB | 15 W | August 2019 |
| Core i5 | 1038NG7 | 4 (8) | 2.0 | 3.8 | Iris Plus (G7) | 300–1050 | 6 MB | 28 W | May 2020 |
| Core i5 | 1035G7 | 4 (8) | 1.2 | 3.7 | Iris Plus (G7) | 300–1050 | 6 MB | 15 W | August 2019 |
| Core i5 | 1035G4 | 4 (8) | 1.1 | 3.7 | Iris Plus (G4) | 300–1050 | 6 MB | 15 W | August 2019 |
| Core i5 | 1035G1 | 4 (8) | 1.0 | 3.6 | UHD Graphics (G1) | 300–1050 | 6 MB | 15 W | August 2019 |
| Core i3 | 1005G1 | 2 (4) | 1.2 | 3.4 | UHD Graphics (G1) | 300–900 | 4 MB | 15 W | August 2019 |

#### Ice Lake-Y

Common features:
* Socket: BGA 1377, except for models with 'N' in the name which use a smaller BGA 1044 package.
* All the CPUs support dual-channel LPDDR4 RAM, at up to 3733 MT/s speed.
* PCIe 3.0 support.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
* L2 cache: 512 KB per core.
* Fabrication process: 10 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 1060G7 | 4 (8) | 1.0 | 3.8 | Iris Plus (G7) | 300–1100 | 8 MB | 9 W | Q3 2019 |
| Core i5 | 1030NG7 | 4 (8) | 1.1 | 3.5 | Iris Plus (G7) | 300–1050 | 6 MB | 10 W | Q2 2020 |
| Core i5 | 1030G7 | 4 (8) | 0.8 | 3.5 | Iris Plus (G7) | 300–1050 | 6 MB | 9 W | Q3 2019 |
| Core i5 | 1030G4 | 4 (8) | 0.7 | 3.5 | Iris Plus (G4) | 300–1050 | 6 MB | 9 W | Q3 2019 |
| Core i3 | 1000NG4 | 2 (4) | 1.1 | 3.2 | Iris Plus (G4) | 300–900 | 4 MB | 9 W | Q2 2020 |
| Core i3 | 1000G4 | 2 (4) | 1.1 | 3.2 | Iris Plus (G4) | 300–900 | 4 MB | 9 W | Q3 2019 |
| Core i3 | 1000G1 | 2 (4) | 1.1 | 3.2 | UHD Graphics (G1) | 300–900 | 4 MB | 9 W | Q3 2019 |

#### Amber Lake-Y (10xxx)

Common features:
* Socket: BGA 1377, except for i3-10100Y which uses a smaller BGA package of unknown name.
* All the CPUs support dual-channel DDR3L-1600 or LPDDR3-1866 RAM. Models i3-10110Y and up support LPDDR3 at up to 2133 MT/s speed.
* All CPU models provide 10 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 14 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 10510Y | 4 (8) | 1.2 | 4.5 | UHD 620 | 300–1150 | 8 MB | 7 W | August 2019 |
| Core i5 | 10310Y | 4 (8) | 1.1 | 4.1 | UHD 620 | 300–1050 | 6 MB | 7 W | August 2019 |
| Core i5 | 10210Y | 4 (8) | 1.0 | 4.0 | UHD 620 | 300–1050 | 6 MB | 7 W | August 2019 |
| Core i3 | 10110Y | 2 (4) | 1.0 | 4.0 | UHD 620 | 300–1000 | 4 MB | 7 W | August 2019 |
| Core i3 | 10100Y | 2 (4) | 1.3 | 3.9 | UHD 615 | 300–1000 | 4 MB | 5 W | January 2021 |

### Core i (11th gen)
#### Tiger Lake-UP3

Common features:
* Socket: BGA 1449.
* All the CPUs support dual-channel DDR4-3200 or LPDDR4X-3733 RAM. i5 models and up support LPDDR4X at up to 4266 MT/s speed.
* All CPU models provide 4 lanes of PCIe 4.0, in addition to PCIe 3.0 provided by the on-package PCH.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
* L2 cache: 1.25 MB per core.
* Fabrication process: 10 nm.
* The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 1195G7 | 4 (8) | 1.3–2.9 | 5.0 | Iris Xe (96 EU) | ?–1400 | 12 MB | 12–28 W | June 2021 |
| Core i7 | 1185G7 | 4 (8) | 1.2–3.0 | 4.8 | Iris Xe (96 EU) | ?–1350 | 12 MB | 12–28 W | September 2020 |
| Core i7 | 1165G7 | 4 (8) | 1.2–2.8 | 4.7 | Iris Xe (96 EU) | ?–1300 | 12 MB | 12–28 W | September 2020 |
| Core i5 | 1155G7 | 4 (8) | 1.0–2.5 | 4.5 | Iris Xe (80 EU) | ?–1350 | 8 MB | 12–28 W | June 2021 |
| Core i5 | 1145G7 | 4 (8) | 1.1–2.6 | 4.4 | Iris Xe (80 EU) | ?–1300 | 8 MB | 12–28 W | January 2021 |
| Core i5 | 1135G7 | 4 (8) | 0.9–2.4 | 4.2 | Iris Xe (80 EU) | ?–1300 | 8 MB | 12–28 W | September 2020 |
| Core i3 | 1125G4 | 4 (8) | 0.9–2.0 | 3.7 | UHD Graphics (48 EU) | ?–1250 | 8 MB | 12–28 W | Q1 2021 |
| Core i3 | 1115G4 | 2 (4) | 1.7–3.0 | 4.1 | UHD Graphics (48 EU) | ?–1250 | 6 MB | 12–28 W | September 2020 |

#### Tiger Lake-UP4

Common features:
* Socket: BGA 1598.
* All the CPUs support dual-channel LPDDR4X-4266 RAM.
* All CPU models provide 4 lanes of PCIe 4.0, in addition to PCIe 3.0 provided by the on-package PCH.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
* L2 cache: 1.25 MB per core.
* Fabrication process: 10 nm.
* The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 1180G7 | 4 (8) | 0.9–2.2 | 4.6 | Iris Xe (96 EU) | ?–1100 | 12 MB | 7–15 W | January 2021 |
| Core i7 | 1160G7 | 4 (8) | 0.9–2.1 | 4.4 | Iris Xe (96 EU) | ?–1100 | 12 MB | 7–15 W | September 2020 |
| Core i5 | 1140G7 | 4 (8) | 0.8–1.8 | 4.2 | Iris Xe (80 EU) | ?–1100 | 8 MB | 7–15 W | January 2021 |
| Core i5 | 1130G7 | 4 (8) | 0.8–1.8 | 4.0 | Iris Xe (80 EU) | ?–1100 | 8 MB | 7–15 W | September 2020 |
| Core i3 | 1120G4 | 4 (8) | 0.8–1.5 | 3.5 | UHD Graphics (48 EU) | ?–1100 | 8 MB | 7–15 W | Q1 2021 |
| Core i3 | 1110G4 | 2 (4) | 1.8 | 3.9 | UHD Graphics (48 EU) | ?–1100 | 6 MB | 7–15 W | September 2020 |

#### Tiger Lake-H

Common features:
* Socket: BGA 1598.
* All the CPUs support dual-channel DDR4-3200 RAM.
* All CPU models provide 20 lanes of PCIe 4.0, in addition to 24 lanes of PCIe 3.0 provided by the on-package PCH.
* All CPUs feature a DMI 3.0 8-lane bus to the chipset (PCH).
* L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
* L2 cache: 1.25 MB per core.
* Fabrication process: 10 nm.
* The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.
* K-suffix processors have an unlocked multiplier, allowing it to be overclocked.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i9 | 11980HK | 8 (16) | 2.6–3.3 | 5.0 | UHD Graphics (32 EU) | 350–1450 | 24 MB | 45–65 W | May 2021 |
| Core i9 | 11950H | 8 (16) | 2.1–2.6 | 5.0 | UHD Graphics (32 EU) | 350–1450 | 24 MB | 35–45 W | May 2021 |
| Core i9 | 11900H | 8 (16) | 2.1–2.5 | 4.9 | UHD Graphics (32 EU) | 350–1450 | 24 MB | 35–45 W | May 2021 |
| Core i7 | 11850H | 8 (16) | 2.1–2.5 | 4.8 | UHD Graphics (32 EU) | 350–1450 | 24 MB | 35–45 W | May 2021 |
| Core i7 | 11800H | 8 (16) | 1.9–2.3 | 4.6 | UHD Graphics (32 EU) | 350–1450 | 24 MB | 35–45 W | May 2021 |
| Core i7 | 11600H | 6 (12) | 2.5–2.9 | 4.6 | UHD Graphics (32 EU) | 350–1450 | 18 MB | 35–45 W | July 2021 |
| Core i5 | 11500H | 6 (12) | 2.4–2.9 | 4.6 | UHD Graphics (32 EU) | 350–1450 | 12 MB | 35–45 W | May 2021 |
| Core i5 | 11400H | 6 (12) | 2.2–2.7 | 4.5 | UHD Graphics (16 EU) | 350–1450 | 12 MB | 35–45 W | May 2021 |
| Core i5 | 11260H | 6 (12) | 2.1–2.6 | 4.4 | UHD Graphics (16 EU) | 350–1400 | 12 MB | 35–45 W | May 2021 |

#### Tiger Lake-H35

Common features:
* Socket: BGA 1449.
* All the CPUs support dual-channel DDR4-3200 or LPDDR4X-4266 RAM.
* PCIe 4.0 support; 12× PCIe lanes provided by on-package PCH are revision 3.0.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
* L2 cache: 1.25 MB per core.
* Fabrication process: 10 nm.
* The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 11390H | 4 (8) | 2.9–3.4 | 5.0 | Iris Xe (96 EU) | ?–1400 | 12 MB | 28–35 W | June 2021 |
| Core i7 | 11375H | 4 (8) | 3.0–3.3 | 5.0 | Iris Xe (96 EU) | ?–1350 | 12 MB | 28–35 W | January 2021 |
| Core i7 | 11370H | 4 (8) | 3.0–3.3 | 4.8 | Iris Xe (96 EU) | ?–1350 | 12 MB | 28–35 W | January 2021 |
| Core i5 | 11320H | 4 (8) | 2.5–3.2 | 4.5 | Iris Xe (96 EU) | ?–1350 | 8 MB | 28–35 W | June 2021 |
| Core i5 | 11300H | 4 (8) | 2.6–3.1 | 4.4 | Iris Xe (80 EU) | ?–1300 | 8 MB | 28–35 W | January 2021 |

### Core i (12th gen)
#### Alder Lake-U

Common features:
* Socket: BGA 1781 (ix-12x0U), BGA 1744 (ix-12x5U).
* All the CPUs support dual-channel LPDDR5-5200 or LPDDR4X-4266 RAM. ix-12x5U models also support dual-channel DDR5-4800 and DDR4-3200 RAM in addition.
* ix-12x0 models provide 4 lanes of PCIe 4.0 and 8 lanes of PCIe 3.0, while ix-12x5U models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
* All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
* L1 cache:
** P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
** E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
* L2 cache:
** P-cores: 1.25 MB per core.
** E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
* Fabrication process: Intel 7.
| Processor branding | Model | P-core (performance) | P-core (performance) | P-core (performance) | E-core (efficiency) | E-core (efficiency) | E-core (efficiency) | L3 Cache | Integrated GPU | Integrated GPU | Smart Cache | TDP | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | MB | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Cores (Threads) | Base | Turbo | | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Core i7 | 1265U | 2 (4) | 1.8 | 4.8 | 8 (8) | 1.3 | 3.6 | | Iris Xe (96 EU) | ?–1250 | 12 MB | 15 W | 55 W | February 2022 |
| Core i7 | 1260U | 2 (4) | 1.6 | 4.7 | 8 (8) | 0.8 | 3.5 | 12 | Iris Xe (96 EU) | ?–950 | 12 MB | 9 W | 29 W | February 2022 |
| Core i7 | 1255U | 2 (4) | 1.7 | 4.7 | 8 (8) | 1.2 | 3.5 | | Iris Xe (96 EU) | ?–1250 | 12 MB | 15 W | 55 W | February 2022 |
| Core i7 | 1250U | 2 (4) | 1.1 | 4.7 | 8 (8) | 0.8 | 3.5 | | Iris Xe (96 EU) | ?–950 | 12 MB | 9 W | 29 W | February 2022 |
| Core i5 | 1245U | 2 (4) | 1.6 | 4.4 | 8 (8) | 1.2 | 3.3 | | Iris Xe (80 EU) | ?–1200 | 12 MB | 15 W | 55 W | February 2022 |
| Core i5 | 1240U | 2 (4) | 1.1 | 4.4 | 8 (8) | 0.8 | 3.3 | | Iris Xe (80 EU) | ?–900 | 12 MB | 9 W | 29 W | February 2022 |
| Core i5 | 1235U | 2 (4) | 1.3 | 4.4 | 8 (8) | 0.9 | 3.3 | | Iris Xe (80 EU) | ?–1200 | 12 MB | 15 W | 55 W | February 2022 |
| Core i5 | 1230U | 2 (4) | 1.0 | 4.4 | 8 (8) | 0.7 | 3.3 | | Iris Xe (80 EU) | ?–850 | 12 MB | 9 W | 29 W | February 2022 |
| Core i3 | 1215U | 2 (4) | 1.2 | 4.4 | 4 (4) | 0.9 | 3.3 | | UHD Graphics (64 EU) | ?–1100 | 10 MB | 15 W | 55 W | February 2022 |
| Core i3 | 1210U | 2 (4) | 1.0 | 4.4 | 4 (4) | 0.7 | 3.3 | | UHD Graphics (64 EU) | ?–850 | 10 MB | 9 W | 29 W | February 2022 |

#### Alder Lake-P

Common features:
* Socket: BGA 1744.
* All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
* All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
* All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
* L1 cache:
** P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
** E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
* L2 cache:
** P-cores: 1.25 MB per core.
** E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
* Fabrication process: Intel 7.
* The following models are available with IPU (image processing unit): i5-1235U, i3-1215U. Specifications between them and the respective processor without IPU are completely identical, apart from the addition of the IPU.
| Processor branding | Model | P-core (performance) | P-core (performance) | P-core (performance) | E-core (efficiency) | E-core (efficiency) | E-core (efficiency) | Integrated GPU | Integrated GPU | Smart Cache | TDP | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Core i7 | 1280P | 6 (12) | 1.8 | 4.8 | 8 (8) | 1.3 | 3.6 | Iris Xe (96 EU) | ?–1450 | 24 MB | 28 W | 64 W | February 2022 |
| Core i7 | 1270P | 4 (8) | 2.2 | 4.8 | 8 (8) | 1.6 | 3.5 | Iris Xe (96 EU) | ?–1400 | 18 MB | 28 W | 64 W | February 2022 |
| Core i7 | 1260P | 4 (8) | 2.1 | 4.7 | 8 (8) | 1.5 | 3.4 | Iris Xe (96 EU) | ?–1400 | 18 MB | 28 W | 64 W | February 2022 |
| Core i5 | 1250P | 4 (8) | 1.7 | 4.4 | 8 (8) | 1.2 | 3.3 | Iris Xe (80 EU) | ?–1400 | 12 MB | 28 W | 64 W | February 2022 |
| Core i5 | 1240P | 4 (8) | 1.7 | 4.4 | 8 (8) | 1.2 | 3.3 | Iris Xe (80 EU) | ?–1300 | 12 MB | 28 W | 64 W | February 2022 |
| Core i3 | 1220P | 2 (4) | 1.5 | 4.4 | 8 (8) | 1.1 | 3.3 | UHD Graphics (64 EU) | ?–1100 | 12 MB | 28 W | 64 W | February 2022 |

#### Alder Lake-H

Common features:
* Socket: BGA 1744.
* All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
* All CPU models provide 16 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
* All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
* L1 cache:
** P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
** E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
* L2 cache:
** P-cores: 1.25 MB per core.
** E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
* Fabrication process: Intel 7.
* K-suffix processors have an unlocked multiplier, allowing it to be overclocked.
| Processor branding | Model | P-core (performance) | P-core (performance) | P-core (performance) | E-core (efficiency) | E-core (efficiency) | E-core (efficiency) | Integrated GPU | Integrated GPU | Smart Cache | TDP | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Core i9 | 12900HK | 6 (12) | 2.5 | 5.0 | 8 (8) | 1.8 | 3.8 | Iris Xe (96 EU) | ?–1450 | 24 MB | 45 W | 115 W | January 2022 |
| Core i9 | 12900H | 6 (12) | 2.5 | 5.0 | 8 (8) | 1.8 | 3.8 | Iris Xe (96 EU) | ?–1450 | 24 MB | 45 W | 115 W | January 2022 |
| Core i7 | 12800H | 6 (12) | 2.4 | 4.8 | 8 (8) | 1.8 | 3.7 | Iris Xe (96 EU) | ?–1400 | 24 MB | 45 W | 115 W | January 2022 |
| Core i7 | 12700H | 6 (12) | 2.3 | 4.7 | 8 (8) | 1.7 | 3.5 | Iris Xe (96 EU) | ?–1400 | 24 MB | 45 W | 115 W | January 2022 |
| Core i7 | 12650H | 6 (12) | 2.3 | 4.7 | 4 (4) | 1.7 | 3.5 | UHD Graphics (64 EU) | ?–1400 | 24 MB | 45 W | 115 W | January 2022 |
| Core i5 | 12600H | 4 (8) | 2.7 | 4.5 | 8 (8) | 2.0 | 3.3 | Iris Xe (80 EU) | ?–1400 | 18 MB | 45 W | 95 W | January 2022 |
| Core i5 | 12500H | 4 (8) | 2.5 | 4.5 | 8 (8) | 1.8 | 3.3 | Iris Xe (80 EU) | ?–1300 | 18 MB | 45 W | 95 W | January 2022 |
| Core i5 | 12450H | 4 (8) | 2.0 | 4.4 | 4 (4) | 1.5 | 3.3 | UHD Graphics (48 EU) | ?–1200 | 12 MB | 45 W | 95 W | January 2022 |

#### Alder Lake-HX

Common features:
* Socket: BGA 1964.
* All the CPUs support dual-channel DDR5-4800 or DDR4-3200 RAM.
* All CPU models provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, in addition to 16 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0 provided by the on-package PCH.
* All CPUs feature a DMI 4.0 8-lane bus to the on-package chipset (PCH).
* L1 cache:
** P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
** E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
* L2 cache:
** P-cores: 1.25 MB per core.
** E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
* Fabrication process: Intel 7.
* The i9 models have unlocked multipliers, allowing them to be overclocked.
| Processor branding | Model | P-core (performance) | P-core (performance) | P-core (performance) | E-core (efficiency) | E-core (efficiency) | E-core (efficiency) | Integrated GPU | Integrated GPU | Smart Cache | TDP | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Core i9 | 12950HX | 8 (16) | 2.3 | 5.0 | 8 (8) | 1.7 | 3.6 | UHD Graphics (32 EU) | ?–1550 | 30 MB | 55 W | 157 W | May 2022 |
| Core i9 | 12900HX | 8 (16) | 2.3 | 5.0 | 8 (8) | 1.7 | 3.6 | UHD Graphics (32 EU) | ?–1550 | 30 MB | 55 W | 157 W | May 2022 |
| Core i7 | 12850HX | 8 (16) | 2.1 | 4.8 | 8 (8) | 1.5 | 3.4 | UHD Graphics (32 EU) | ?–1450 | 25 MB | 55 W | 157 W | May 2022 |
| Core i7 | 12800HX | 8 (16) | 2.0 | 4.8 | 8 (8) | 1.5 | 3.4 | UHD Graphics (32 EU) | ?–1450 | 25 MB | 55 W | 157 W | May 2022 |
| Core i7 | 12650HX | 6 (12) | 2.0 | 4.7 | 8 (8) | 1.5 | 3.3 | UHD Graphics (32 EU) | ?–1450 | 24 MB | 55 W | 157 W | May 2022 |
| Core i5 | 12600HX | 4 (8) | 2.5 | 4.6 | 8 (8) | 1.8 | 3.3 | UHD Graphics (32 EU) | ?–1350 | 18 MB | 55 W | 157 W | May 2022 |
| Core i5 | 12450HX | 4 (8) | 2.4 | 4.4 | 4 (4) | 1.8 | 3.1 | UHD Graphics (16 EU) | ?–1300 | 12 MB | 55 W | 157 W | May 2022 |

#### Alder Lake-N

These are essentially "E-core-only" CPUs, utilizing the Gracemont architecture.
Common features:
* Socket: BGA 1264.
* All the CPUs support dual-channel DDR5-4800, DDR4-3200 or LPDDR5-4800 RAM.
* All CPU models provide 9 lanes of PCIe 3.0.
* All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
* L1 cache: 96 KB (64 KB data + 32 KB instructions) per core.
* L2 cache: 2 MB per cluster (each "cluster" contains four cores).
* Fabrication process: Intel 7.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Core i3 | N305 | 8 (8) | 1.8 | 3.8 | UHD Graphics (32 EU) | ?–1250 | 6 MB | 15 W | 35 W | January 2023 |
| Core i3 | N300 | 8 (8) | 0.8 | 3.8 | UHD Graphics (32 EU) | ?–1250 | 6 MB | 7 W | 25 W | January 2023 |

### Core i (13th gen)
#### Raptor Lake-U

Common features:
* Socket: BGA 1744.
* All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
* All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
* All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
* L1 cache:
** P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
** E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
* L2 cache:
** P-cores: 2 MB per core.
** E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
* Fabrication process: Intel 7.
* The i3-1315U is available with IPU (image processing unit). Specifications between it and the respective processor without IPU are completely identical, apart from the addition of the IPU.
| Processor branding | Model | P-core (performance) | P-core (performance) | P-core (performance) | E-core (efficiency) | E-core (efficiency) | E-core (efficiency) | Integrated GPU | Integrated GPU | Smart Cache | TDP | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Core i7 | 1365U | 2 (4) | 1.8 | 5.2 | 8 (8) | 1.3 | 3.9 | Iris Xe (96 EU) | ?–1300 | 12 MB | 15 W | 55 W | January 2023 |
| Core i7 | 1355U | 2 (4) | 1.7 | 5.0 | 8 (8) | 1.2 | 3.7 | Iris Xe (96 EU) | ?–1300 | 12 MB | 15 W | 55 W | January 2023 |
| Core i5 | 1345U | 2 (4) | 1.6 | 4.7 | 8 (8) | 1.2 | 3.5 | Iris Xe (80 EU) | ?–1250 | 12 MB | 15 W | 55 W | January 2023 |
| Core i5 | 1335U | 2 (4) | 1.3 | 4.6 | 8 (8) | 0.9 | 3.4 | Iris Xe (80 EU) | ?–1250 | 12 MB | 15 W | 55 W | January 2023 |
| Core i5 | 1334U | 2 (4) | 1.3 | 4.6 | 8 (8) | 0.9 | 3.4 | Iris Xe (80 EU) | ?–1250 | 12 MB | 15 W | 55 W | January 2023 |
| Core i3 | 1315U | 2 (4) | 1.2 | 4.5 | 4 (4) | 0.9 | 3.3 | UHD Graphics (64 EU) | ?–1250 | 10 MB | 15 W | 55 W | January 2023 |
| Core i3 | 1305U | 1 (2) | 1.6 | 4.5 | 4 (4) | 1.2 | 3.3 | UHD Graphics (64 EU) | ?–1250 | 10 MB | 15 W | 55 W | January 2023 |

#### Raptor Lake-P

Common features:
* Socket: BGA 1744.
* All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
* All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
* All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
* L1 cache:
** P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
** E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
* L2 cache:
** P-cores: 2 MB per core.
** E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
* Fabrication process: Intel 7.
| Processor branding | Model | P-core (performance) | P-core (performance) | P-core (performance) | E-core (efficiency) | E-core (efficiency) | E-core (efficiency) | Integrated GPU | Integrated GPU | Smart Cache | TDP | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Core i7 | 1370P | 6 (12) | 1.9 | 5.2 | 8 (8) | 1.4 | 3.9 | Iris Xe (96 EU) | ?–1500 | 24 MB | 28 W | 64 W | January 2023 |
| Core i7 | 1360P | 4 (8) | 2.2 | 5.0 | 8 (8) | 1.6 | 3.7 | Iris Xe (96 EU) | ?–1500 | 18 MB | 28 W | 64 W | January 2023 |
| Core i5 | 1350P | 4 (8) | 1.9 | 4.7 | 8 (8) | 1.4 | 3.5 | Iris Xe (80 EU) | ?–1500 | 12 MB | 28 W | 64 W | January 2023 |
| Core i5 | 1340P | 4 (8) | 1.9 | 4.6 | 8 (8) | 1.4 | 3.4 | Iris Xe (80 EU) | ?–1450 | 12 MB | 28 W | 64 W | January 2023 |

#### Raptor Lake-H

Common features:
* Socket: BGA 1744.
* All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
* All CPU models provide 8 lanes of PCIe 5.0 and 8 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
* All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
* L1 cache:
** P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
** E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
* L2 cache:
** P-cores: 2 MB per core.
** E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
* Fabrication process: Intel 7.
* K-suffix processors have an unlocked multiplier, allowing it to be overclocked.
* The i5-13500H is available with IPU (image processing unit). Specifications between it and the respective processor without IPU are completely identical, apart from the addition of the IPU.
| Processor branding | Model | P-core (performance) | P-core (performance) | P-core (performance) | E-core (efficiency) | E-core (efficiency) | E-core (efficiency) | Integrated GPU | Integrated GPU | Smart Cache | TDP | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Core i9 | 13900HK | 6 (12) | 2.6 | 5.4 | 8 (8) | 1.9 | 4.1 | Iris Xe (96 EU) | ?–1500 | 24 MB | 45 W | 115 W | January 2023 |
| Core i9 | 13900H | 6 (12) | 2.6 | 5.4 | 8 (8) | 1.9 | 4.1 | Iris Xe (96 EU) | ?–1500 | 24 MB | 45 W | 115 W | January 2023 |
| Core i7 | 13800H | 6 (12) | 2.5 | 5.2 | 8 (8) | 1.8 | 4.0 | Iris Xe (96 EU) | ?–1500 | 24 MB | 45 W | 115 W | January 2023 |
| Core i7 | 13700H | 6 (12) | 2.4 | 5.0 | 8 (8) | 1.8 | 3.7 | Iris Xe (96 EU) | ?–1500 | 24 MB | 45 W | 115 W | January 2023 |
| Core i7 | 13620H | 6 (12) | 2.4 | 4.9 | 4 (4) | 1.8 | 3.6 | UHD Graphics (64 EU) | ?–1500 | 24 MB | 45 W | 115 W | January 2023 |
| Core i5 | 13600H | 4 (8) | 2.8 | 4.8 | 8 (8) | 2.1 | 3.6 | Iris Xe (80 EU) | ?–1500 | 18 MB | 45 W | 95 W | January 2023 |
| Core i5 | 13500H | 4 (8) | 2.6 | 4.7 | 8 (8) | 1.9 | 3.5 | Iris Xe (80 EU) | ?–1450 | 18 MB | 45 W | 95 W | January 2023 |
| Core i5 | 13420H | 4 (8) | 2.1 | 4.6 | 4 (4) | 1.5 | 3.4 | UHD Graphics (48 EU) | ?–1400 | 12 MB | 45 W | 95 W | January 2023 |

#### Raptor Lake-PX

Common features:
* Socket: BGA 1792.
* All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
* All CPU models provide 8 lanes of PCIe 5.0 and 8 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
* All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
* L1 cache:
** P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
** E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
* L2 cache:
** P-cores: 2 MB per core.
** E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
* Fabrication process: Intel 7.
| Processor branding | Model | P-core (performance) | P-core (performance) | P-core (performance) | E-core (efficiency) | E-core (efficiency) | E-core (efficiency) | Integrated GPU | Integrated GPU | Smart Cache | TDP | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Core i9 | 13905H | 6 (12) | 2.6 | 5.4 | 8 (8) | 1.9 | 4.1 | Iris Xe (96 EU) | ?–1500 | 24 MB | 45 W | 115 W | January 2023 |
| Core i7 | 13705H | 6 (12) | 2.4 | 5.0 | 8 (8) | 1.8 | 3.7 | Iris Xe (96 EU) | ?–1500 | 24 MB | 45 W | 115 W | January 2023 |
| Core i5 | 13505H | 4 (8) | 2.6 | 4.7 | 8 (8) | 1.9 | 3.5 | Iris Xe (80 EU) | ?–1450 | 18 MB | 45 W | 115 W | January 2023 |

#### Raptor Lake-HX

Common features:
* Socket: BGA 1964.
* All the CPUs support dual-channel DDR5-4800 or DDR4-3200 RAM. Models i7-13850HX and up support DDR5 at up to 5600 MT/s speed.
* All CPU models provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, in addition to 16 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0 provided by the on-package PCH.
* All CPUs feature a DMI 4.0 8-lane bus to the on-package chipset (PCH).
* L1 cache:
** P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
** E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
* L2 cache:
** P-cores: 2 MB per core.
** E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
* Fabrication process: Intel 7.
* All models support CPU, iGPU, and memory overclocking.
* i9-13980HX features Thermal Velocity Boost. Without it enabled, the maximum boost clock speed is 0.1 GHz lower.
| Processor branding | Model | P-core (performance) | P-core (performance) | P-core (performance) | E-core (efficiency) | E-core (efficiency) | E-core (efficiency) | Integrated GPU | Integrated GPU | Smart Cache | TDP | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Core i9 | 13980HX | 8 (16) | 2.2 | 5.6 | 16 (16) | 1.6 | 4.0 | UHD Graphics (32 EU) | ?–1650 | 36 MB | 55 W | 157 W | January 2023 |
| Core i9 | 13950HX | 8 (16) | 2.2 | 5.5 | 16 (16) | 1.6 | 4.0 | UHD Graphics (32 EU) | ?–1650 | 36 MB | 55 W | 157 W | January 2023 |
| Core i9 | 13900HX | 8 (16) | 2.2 | 5.4 | 16 (16) | 1.6 | 3.9 | UHD Graphics (32 EU) | ?–1650 | 36 MB | 55 W | 157 W | January 2023 |
| Core i7 | 13850HX | 8 (16) | 2.1 | 5.1 | 12 (12) | 1.5 | 3.8 | UHD Graphics (32 EU) | ?–1600 | 30 MB | 55 W | 157 W | January 2023 |
| Core i7 | 13700HX | 8 (16) | 2.1 | 5.0 | 8 (8) | 1.5 | 3.6 | UHD Graphics (32 EU) | ?–1550 | 30 MB | 55 W | 157 W | January 2023 |
| Core i7 | 13650HX | 6 (12) | 2.6 | 4.9 | 8 (8) | 1.9 | 3.6 | UHD Graphics (16 EU) | ?–1550 | 24 MB | 55 W | 157 W | January 2023 |
| Core i5 | 13600HX | 6 (12) | 2.6 | 4.7 | 8 (8) | 1.9 | 3.6 | UHD Graphics (32 EU) | ?–1500 | 24 MB | 55 W | 157 W | January 2023 |
| Core i5 | 13500HX | 6 (12) | 2.5 | 4.6 | 8 (8) | 1.8 | 3.5 | UHD Graphics (32 EU) | ?–1500 | 24 MB | 55 W | 157 W | January 2023 |
| Core i5 | 13450HX | 6 (12) | 2.4 | 4.6 | 4 (4) | 1.8 | 3.4 | UHD Graphics (16 EU) | ?–1450 | 20 MB | 55 W | 157 W | January 2023 |

### Core i (14th gen)
#### Raptor Lake-HX Refresh

Common features:
* Socket: BGA 1964.
* All the CPUs support dual-channel DDR5-5600 or DDR4-3200 RAM.
* All CPU models provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, in addition to 16 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0 provided by the on-package PCH.
* All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
* L1 cache:
** P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
** E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
* L2 cache:
** P-cores: 2 MB per core.
** E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
* Fabrication process: Intel 7.
* All models support CPU, iGPU, and memory overclocking.
* i7-14650HX, i7-14700HX, and i9-14900HX feature Thermal Velocity Boost. Without it enabled, the maximum boost clock speed is 0.1 GHz lower.
* i7-14700HX, and i9-14900HX feature Intel Application Optimization.
| Processor branding | Model | P-core (performance) | P-core (performance) | P-core (performance) | E-core (efficiency) | E-core (efficiency) | E-core (efficiency) | Integrated GPU | Integrated GPU | Smart Cache | TDP | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Core i9 | 14900HX | 8 (16) | 2.2 | 5.8 | 16 (16) | 1.6 | 4.1 | UHD Graphics (32 EU) | ?–1650 | 36 MB | 55 W | 157 W | January 2024 |
| Core i7 | 14700HX | 8 (16) | 2.1 | 5.5 | 12 (12) | 1.5 | 3.9 | UHD Graphics (32 EU) | ?–1600 | 33 MB | 55 W | 157 W | January 2024 |
| Core i7 | 14650HX | 8 (16) | 2.2 | 5.2 | 8 (8) | 1.6 | 3.7 | UHD Graphics (16 EU) | ?–1600 | 30 MB | 55 W | 157 W | January 2024 |
| Core i5 | 14500HX | 6 (12) | 2.6 | 4.9 | 8 (8) | 1.9 | 3.5 | UHD Graphics (32 EU) | ?–1550 | 24 MB | 55 W | 157 W | January 2024 |
| Core i5 | 14450HX | 6 (12) | 2.4 | 4.8 | 4 (4) | 1.8 | 3.5 | UHD Graphics (16 EU) | ?–1500 | 20 MB | 55 W | 157 W | January 2024 |

### Core / Core Ultra 3/5/7/9 (Series 1)
#### Raptor Lake-U Refresh

Common features:
* Socket: BGA 1744.
* All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
* All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
* All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
* Includes integrated graphics based on Xe-LP architecture.
* L1 cache:
** P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
** E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
* L2 cache:
** P-cores: 2 MB per core.
** E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
* Fabrication process: Intel 7.
* The Core 3 100U is available with IPU (image processing unit). Specifications between it and the respective processor without IPU are completely identical, apart from the addition of the IPU.
| Processor branding | Model | P-core (performance) | P-core (performance) | P-core (performance) | E-core (efficiency) | E-core (efficiency) | E-core (efficiency) | Integrated GPU | Integrated GPU | Smart Cache | TDP | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Core 7 | 150U | 2 (4) | 1.8 | 5.4 | 8 (8) | 1.2 | 4.0 | Intel Graphics (96 EU) | ?–1300 | 12 MB | 15 W | 55 W | January 2024 |
| Core 5 | 120U | 2 (4) | 1.4 | 5.0 | 8 (8) | 0.9 | 3.8 | Intel Graphics (80 EU) | ?–1250 | 12 MB | 15 W | 55 W | January 2024 |
| Core 3 | 100U | 2 (4) | 1.2 | 4.7 | 4 (4) | 0.9 | 3.3 | Intel Graphics (64 EU) | ?–1250 | 10 MB | 15 W | 55 W | January 2024 |

#### Meteor Lake-U

Common features:
* Socket: BGA 2049.
* All the CPUs except 1x4U models support dual-channel DDR5-5600 or LPDDR5X-7466 RAM. 1x4U models support dual-channel LPDDR5(X)-6400.
* All CPU models provide 20 lanes of PCIe 4.0.
* All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
* Includes integrated graphics based on Alchemist architecture.
* L1 cache:
** P-cores: 112 KB (48 KB data + 64 KB instructions) per core.
** E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
* L2 cache:
** P-cores: 2 MB per core.
** E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
* All processor models also feature 2× "LP E-Cores" which are clocked at 0.7 GHz base (0.4 GHz on 1x4U models), 2.1 GHz boost and have 2 MB of L2 cache.
* Fabrication process: Intel 4 (compute tile).
* Configurable TDP (cTDP) of 12–28 W is featured on 1x5U models, and 9–15 W on 1x4U models.
| Processor branding | Model | P-core (performance) | P-core (performance) | P-core (performance) | E-core (efficiency) | E-core (efficiency) | E-core (efficiency) | Integrated GPU | Integrated GPU | Smart Cache | TDP | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Core Ultra 7 | 165U | 2 (4) | 1.7 | 4.9 | 8 (8) | 1.2 | 3.8 | Intel Graphics (4 Xe-cores) | ?–2000 | 12 MB | 15 W | 57 W | December 2023 |
| Core Ultra 7 | 164U | 2 (4) | 1.1 | 4.8 | 8 (8) | 0.7 | 3.8 | Intel Graphics (4 Xe-cores) | ?–1800 | 12 MB | 9 W | 30 W | December 2023 |
| Core Ultra 7 | 155U | 2 (4) | 1.7 | 4.8 | 8 (8) | 1.2 | 3.8 | Intel Graphics (4 Xe-cores) | ?–1950 | 12 MB | 15 W | 57 W | December 2023 |
| Core Ultra 5 | 135U | 2 (4) | 1.6 | 4.4 | 8 (8) | 1.1 | 3.6 | Intel Graphics (4 Xe-cores) | ?–1900 | 12 MB | 15 W | 57 W | December 2023 |
| Core Ultra 5 | 134U | 2 (4) | 0.7 | 4.4 | 8 (8) | 0.5 | 3.6 | Intel Graphics (4 Xe-cores) | ?–1750 | 12 MB | 9 W | 30 W | December 2023 |
| Core Ultra 5 | 125U | 2 (4) | 1.3 | 4.3 | 8 (8) | 0.8 | 3.6 | Intel Graphics (4 Xe-cores) | ?–1850 | 12 MB | 15 W | 57 W | December 2023 |
| Core Ultra 5 | 115U | 2 (4) | 1.5 | 4.2 | 4 (4) | 1.0 | 3.5 | Intel Graphics (3 Xe-cores) | ?–1800 | 10 MB | 15 W | 57 W | December 2023 |

#### Meteor Lake-H

Common features:
* Socket: BGA 2049.
* All the CPUs support dual-channel DDR5-5600 or LPDDR5X-7466 RAM.
* All CPU models provide 8 lanes of PCIe 5.0 and 20 lanes of PCIe 4.0.
* All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
* Includes integrated graphics based on Alchemist architecture.
* L1 cache:
** P-cores: 112 KB (48 KB data + 64 KB instructions) per core.
** E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
* L2 cache:
** P-cores: 2 MB per core.
** E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
* All processor models also feature 2× "LP E-Cores" which are clocked at 0.7 GHz base (1.0 GHz on Core Ultra 9 185H), 2.5 GHz boost and have 2 MB of L2 cache.
* Fabrication process: Intel 4 (compute tile).
* Configurable TDP (cTDP) of 35–65 W is featured on Core Ultra 9 185H, and 20–65 W on all other models.
| Processor branding | Model | P-core (performance) | P-core (performance) | P-core (performance) | E-core (efficiency) | E-core (efficiency) | E-core (efficiency) | Integrated GPU | Integrated GPU | Smart Cache | TDP | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Core Ultra 9 | 185H | 6 (12) | 2.3 | 5.1 | 8 (8) | 1.8 | 3.8 | Intel Arc (8 Xe-cores) | ?–2350 | 24 MB | 45 W | 115 W | December 2023 |
| Core Ultra 7 | 165H | 6 (12) | 1.4 | 5.0 | 8 (8) | 0.9 | 3.8 | Intel Arc (8 Xe-cores) | ?–2300 | 24 MB | 28 W | 115 W | December 2023 |
| Core Ultra 7 | 155H | 6 (12) | 1.4 | 4.8 | 8 (8) | 0.9 | 3.8 | Intel Arc (8 Xe-cores) | ?–2250 | 24 MB | 28 W | 115 W | December 2023 |
| Core Ultra 5 | 135H | 4 (8) | 1.7 | 4.6 | 8 (8) | 1.2 | 3.6 | Intel Arc (8 Xe-cores) | ?–2200 | 18 MB | 28 W | 115 W | December 2023 |
| Core Ultra 5 | 125H | 4 (8) | 1.2 | 4.5 | 8 (8) | 0.7 | 3.6 | Intel Arc (7 Xe-cores) | ?–2200 | 18 MB | 28 W | 115 W | December 2023 |

### Core Ultra 5/7/9 (Series 2)
#### Raptor Lake-U Refresh

| Processor branding | Model | P-core (performance) | P-core (performance) | P-core (performance) | E-core (efficiency) | E-core (efficiency) | E-core (efficiency) | Integrated GPU | Integrated GPU | Smart Cache | TDP | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Core 7 | 250U | 2 (4) | 1.8 | 5.4 | 8 (8) | 1.2 | 4.0 | Intel Graphics (96 EU) | ?–1300 | 12 MB | 15 W | 55 W | January 2025 |
| Core 5 | 220U | 2 (4) | 1.4 | 5.0 | 8 (8) | 0.9 | 3.8 | Intel Graphics (80 EU) | ?–1300 | 12 MB | 15 W | 55 W | January 2025 |

#### Arrow Lake-U

| Processor branding | Model | P-core (performance) | P-core (performance) | P-core (performance) | E-core (efficiency) | E-core (efficiency) | E-core (efficiency) | Integrated GPU | Integrated GPU | Smart Cache | TDP | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Core Ultra 7 | 265U | 2 (2) | 2.1 | 5.3 | 8 (8) | 1.7 | 4.2 | Intel Graphics (4 Xe-cores) | ?–2100 | 12 MB | 15 W | 57 W | January 2025 |
| Core Ultra 7 | 255U | 2 (2) | 2.0 | 5.2 | 8 (8) | 1.7 | 4.2 | Intel Graphics (4 Xe-cores) | ?–2100 | 12 MB | 15 W | 57 W | January 2025 |
| Core Ultra 5 | 235U | 2 (2) | 2.0 | 4.9 | 8 (8) | 1.6 | 4.1 | Intel Graphics (4 Xe-cores) | ?–2050 | 12 MB | 15 W | 57 W | January 2025 |
| Core Ultra 5 | 225U | 2 (2) | 1.5 | 4.8 | 8 (8) | 1.3 | 3.8 | Intel Graphics (4 Xe-cores) | ?–2000 | 12 MB | 15 W | 57 W | January 2025 |

#### Lunar Lake

Common features:
* Socket: BGA 2833.
* All the CPUs support dual-channel LPDDR5X-8533 RAM (on package).
* All CPU models provide 4 lanes of PCIe 5.0.
* L1 cache:
** P-cores: 112 KB (48 KB (12-Way) data + 64 KB (16-Way) instructions) per core.
** E-cores: 96 KB (32 KB (8-Way) data + 64 KB (16-Way) instructions) per core.
* L2 cache:
** P-cores: 2.5 MB (10-Way) per core.
** E-cores: 4 MB (16-Way) per E-core cluster (each "cluster" contains four cores).
* Fabrication process: Compute Tile (Contains the CPU cores) TSMC's N3B node.
| Processor branding | Model | P-core (performance) | P-core (performance) | P-core (performance) | E-core (efficiency) | E-core (efficiency) | E-core (efficiency) | Integrated GPU | Integrated GPU | Smart Cache | NPU | NPU | Integrated memory | Integrated memory | TDP | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Model | Clock (MHz) | Smart Cache | Neural computes engines | NPU AI TOPS | Memory speed | Memory capacity | Base | Max. Turbo | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | Neural computes engines | NPU AI TOPS | Memory speed | Memory capacity | Base | Max. Turbo | Release date |
| Core Ultra 9 | 288V | 4 (4) | 3.3 | 5.1 | 4 (4) | 3.3 | 3.7 | Intel Arc 140V (8 Xe-cores) | ?–2050 | 12 MB | 6x Gen4 | 48 | LPDDR5X 8533 MT/s | 32 GB | 30 W (Min:17 W) | 37 W | September 2024 |
| Core Ultra 7 | 268V | 4 (4) | 2.2 | 5.0 | 4 (4) | 2.2 | 3.7 | Intel Arc 140V (8 Xe-cores) | ?–2000 | 12 MB | 6x Gen4 | 48 | LPDDR5X 8533 MT/s | 32 GB | 17 W (Min:8 W) | 37 W | September 2024 |
| Core Ultra 7 | 266V | 4 (4) | 2.2 | 5.0 | 4 (4) | 2.2 | 3.7 | Intel Arc 140V (8 Xe-cores) | ?–2000 | 12 MB | 6x Gen4 | 48 | LPDDR5X 8533 MT/s | 16 GB | 17 W (Min:8 W) | 37 W | September 2024 |
| Core Ultra 7 | 258V | 4 (4) | 2.2 | 4.8 | 4 (4) | 2.2 | 3.7 | Intel Arc 140V (8 Xe-cores) | ?–1950 | 12 MB | 6x Gen4 | 47 | LPDDR5X 8533 MT/s | 32 GB | 17 W (Min:8 W) | 37 W | September 2024 |
| Core Ultra 7 | 256V | 4 (4) | 2.2 | 4.8 | 4 (4) | 2.2 | 3.7 | Intel Arc 140V (8 Xe-cores) | ?–1950 | 12 MB | 6x Gen4 | 47 | LPDDR5X 8533 MT/s | 16 GB | 17 W (Min:8 W) | 37 W | September 2024 |
| Core Ultra 5 | 238V | 4 (4) | 2.1 | 4.7 | 4 (4) | 2.1 | 3.5 | Intel Arc 130V (7 Xe-cores) | ?–1850 | 8 MB | 5x Gen4 | 40 | LPDDR5X 8533 MT/s | 32 GB | 17 W (Min:8 W) | 37 W | September 2024 |
| Core Ultra 5 | 236V | 4 (4) | 2.1 | 4.7 | 4 (4) | 2.1 | 3.5 | Intel Arc 130V (7 Xe-cores) | ?–1850 | 8 MB | 5x Gen4 | 40 | LPDDR5X 8533 MT/s | 16 GB | 17 W (Min:8 W) | 37 W | September 2024 |
| Core Ultra 5 | 228V | 4 (4) | 2.1 | 4.5 | 4 (4) | 2.1 | 3.5 | Intel Arc 130V (7 Xe-cores) | ?–1850 | 8 MB | 5x Gen4 | 40 | LPDDR5X 8533 MT/s | 32 GB | 17 W (Min:8 W) | 37 W | September 2024 |
| Core Ultra 5 | 226V | 4 (4) | 2.1 | 4.5 | 4 (4) | 2.1 | 3.5 | Intel Arc 130V (7 Xe-cores) | ?–1850 | 8 MB | 5x Gen4 | 40 | LPDDR5X 8533 MT/s | 16 GB | 17 W (Min:8 W) | 37 W | September 2024 |

#### Raptor Lake-H Refresh

| Processor branding | Model | P-core (performance) | P-core (performance) | P-core (performance) | E-core (efficiency) | E-core (efficiency) | E-core (efficiency) | Integrated GPU | Integrated GPU | Smart Cache | TDP | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Core 9 | 270H | 6 (12) | 2.7 | 5.8 | 8 (8) | 2.0 | 4.1 | Iris Xe (96 EU) | ?–1550 | 24 MB | 45 W | 115 W | December 2024 |
| Core 7 | 250H | 6 (12) | 2.5 | 5.4 | 8 (8) | 1.8 | 4.0 | Iris Xe (96 EU) | ?–1550 | 24 MB | 45 W | 115 W | December 2024 |
| Core 7 | 240H | 6 (12) | 2.5 | 5.2 | 4 (4) | 1.8 | 4.0 | UHD Graphics (64 EU) | ?–1550 | 24 MB | 45 W | 115 W | December 2024 |
| Core 5 | 220H | 4 (8) | 2.7 | 4.9 | 8 (8) | 2.0 | 3.7 | Iris Xe (80 EU) | ?–1500 | 18 MB | 45 W | 115 W | December 2024 |
| Core 5 | 210H | 4 (8) | 2.2 | 4.8 | 4 (4) | 1.6 | 3.6 | UHD Graphics (48 EU) | ?–1400 | 12 MB | 45 W | 115 W | December 2024 |

#### Arrow Lake-H

| Processor branding | Model | P-core (performance) | P-core (performance) | P-core (performance) | E-core (efficiency) | E-core (efficiency) | E-core (efficiency) | Integrated GPU | Integrated GPU | Smart Cache | NPU (TOPS) | TDP | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Model | Clock (MHz) | Smart Cache | NPU (TOPS) | Base | Max. Turbo | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | NPU (TOPS) | Base | Max. Turbo | Release date |
| Core Ultra 9 | 285H | 6 (6) | 2.9 | 5.4 | 8 (8) | 2.7 | 4.5 | Intel Arc 140T (8 Xe-cores) | ?–2350 | 24 MB | 13 | 45 W | 115 W | January 2025 |
| Core Ultra 7 | 265H | 6 (6) | 2.2 | 5.3 | 8 (8) | 1.7 | 4.5 | Intel Arc 140T (8 Xe-cores) | ?–2300 | 24 MB | 13 | 28 W | 115 W | January 2025 |
| Core Ultra 7 | 255H | 6 (6) | 2.0 | 5.1 | 8 (8) | 1.5 | 4.4 | Intel Arc 140T (8 Xe-cores) | ?–2250 | 24 MB | 13 | 28 W | 115 W | January 2025 |
| Core Ultra 5 | 235H | 4 (4) | 2.4 | 5.0 | 8 (8) | 1.8 | 4.4 | Intel Arc 140T (8 Xe-cores) | ?–2250 | 18 MB | 13 | 28 W | 115 W | January 2025 |
| Core Ultra 5 | 225H | 4 (4) | 1.7 | 4.9 | 8 (8) | 1.3 | 4.3 | Intel Arc 130T (7 Xe-cores) | ?–2200 | 18 MB | 13 | 28 W | 115 W | January 2025 |

#### Arrow Lake-HX

Common features:
* Core Ultra 9 285HX supports Intel vPro and related technologies.
| Processor branding | Model | P-core (performance) | P-core (performance) | P-core (performance) | E-core (efficiency) | E-core (efficiency) | E-core (efficiency) | Integrated GPU | Integrated GPU | Smart Cache | NPU (TOPS) | TDP | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Model | Clock (MHz) | Smart Cache | NPU (TOPS) | Base | Max. Turbo | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | NPU (TOPS) | Base | Max. Turbo | Release date |
| Core Ultra 9 | 285HX | 8 (8) | 2.8 | 5.5 | 16 (16) | 2.1 | 4.6 | Intel Arc (4 Xe-cores) | 300–2000 | 36 MB | 13 | 55 W | 160 W | January 2025 |
| Core Ultra 9 | 275HX | 8 (8) | 2.7 | 5.4 | 16 (16) | 2.1 | 4.6 | Intel Arc (4 Xe-cores) | 300–1900 | 36 MB | 13 | 55 W | 160 W | January 2025 |
| Core Ultra 7 | 265HX | 8 (8) | 2.6 | 5.3 | 12(12) | 2.3 | 4.6 | Intel Arc (4 Xe-cores) | 300–1900 | 30 MB | 13 | 55 W | 160 W | January 2025 |
| Core Ultra 7 | 255HX | 8 (8) | 2.4 | 5.2 | 12(12) | 1.8 | 4.5 | Intel Arc (4 Xe-cores) | 300–1850 | 30 MB | 13 | 55 W | 160 W | January 2025 |
| Core Ultra 5 | 245HX | 6 (6) | 3.1 | 5.1 | 8 (8) | 2.6 | 4.5 | Intel Arc (3 Xe-cores) | 300–1900 | 24 MB | 13 | 55 W | 160 W | January 2025 |
| Core Ultra 5 | 235HX | 6 (6) | 2.9 | 5.1 | 8 (8) | 2.6 | 4.5 | Intel Arc (3 Xe-cores) | 300–1900 | 24 MB | 13 | 55 W | 160 W | January 2025 |

#### Twin Lake-N

| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Core 3 | N355 | 8 (8) | 1.8 | 3.9 | UHD Graphics (32 EU) | ?–1350 | 6 MB | 15 W | 35 W | January 2025 |
| Core 3 | N350 | 8 (8) | 0.8 | 3.9 | UHD Graphics (32 EU) | ?–1350 | 6 MB | 7 W | 25 W | January 2025 |

## Embedded processors
### Core i (1st gen)
#### Arrandale

Common features:
* Socket: BGA 1288.
* All the CPUs support dual-channel DDR3 RAM. All models support it at 800 MT/s speeds while E- and LE-suffix models support up to 1066 MT/s speeds.
* All CPU models provide 16 lanes of PCIe 2.0.
* All CPUs feature a DMI 1.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 32 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 660UE | 2 (4) | 1.33 | 2.40 | HD Graphics | 166–500 | 4 MB | 18 W | August 2010 |
| Core i7 | 620LE | 2 (4) | 2.00 | 2.80 | HD Graphics | 266–566 | 4 MB | 25 W | January 2010 |
| Core i7 | 620UE | 2 (4) | 1.06 | 2.13 | HD Graphics | 166–500 | 4 MB | 18 W | January 2010 |
| Core i7 | 610E | 2 (4) | 2.53 | 3.20 | HD Graphics | 500–766 | 4 MB | 35 W | January 2010 |
| Core i5 | 520E | 2 (4) | 2.40 | 2.93 | HD Graphics | 500–766 | 3 MB | 35 W | January 2010 |
| Core i3 | 330E | 2 (4) | 2.13 | — | HD Graphics | 500–666 | 3 MB | 35 W | January 2010 |

### Core i (2nd gen)
#### Sandy Bridge-DT

The following models from the Sandy Bridge desktop range are available as embedded processors:
* Core i7-2600
* Core i5-2400
* Core i3-2120
See section Desktop processors § Sandy Bridge-DT for full info.

#### Sandy Bridge-M

Common features:
* Socket: G2 (2xx0E and 2xx0QE models except i3-2310E), BGA 1023 (all other models).
* All the CPUs support dual-channel DDR3 RAM. All models support it at 1333 MT/s speeds while i7-2720QM and above support up to 1600 MT/s speeds.
* All CPU models provide 16 lanes of PCIe 2.0.
* All CPUs feature a DMI 2.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 32 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 2715QE | 4 (8) | 2.1 | 3.0 | HD 3000 | 650–1200 | 6 MB | 45 W | January 2011 |
| Core i7 | 2710QE | 4 (8) | 2.1 | 3.0 | HD 3000 | 650–1200 | 6 MB | 45 W | January 2011 |
| Core i7 | 2655LE | 2 (4) | 2.2 | 2.9 | HD 3000 | 650–1000 | 4 MB | 25 W | February 2011 |
| Core i7 | 2610UE | 2 (4) | 1.5 | 2.4 | HD 3000 | 350–850 | 4 MB | 17 W | February 2011 |
| Core i5 | 2515E | 2 (4) | 2.5 | 3.1 | HD 3000 | 650–1100 | 3 MB | 35 W | February 2011 |
| Core i5 | 2510E | 2 (4) | 2.5 | 3.1 | HD 3000 | 650–1100 | 3 MB | 35 W | February 2011 |
| Core i3 | 2340UE | 2 (4) | 1.3 | — | HD 3000 | 350–800 | 3 MB | 17 W | June 2011 |
| Core i3 | 2330E | 2 (4) | 2.2 | — | HD 3000 | 650–1050 | 3 MB | 35 W | June 2011 |
| Core i3 | 2310E | 2 (4) | 2.1 | — | HD 3000 | 650–1050 | 3 MB | 35 W | February 2011 |

#### Gladden

Common features:
* Socket: BGA 1284.
* All the CPUs support dual-channel DDR3-1333 RAM.
* All CPU models provide 16 lanes of PCIe 2.0.
* All CPUs feature a DMI 2.0 bus to the chipset (PCH).
* No integrated graphics.
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 32 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Smart Cache | TDP | Release date |
| Core i3 | 2115C | 2 (4) | 2.0 | — | 3 MB | 25 W | Q2 2012 |

### Core i (3rd gen)
#### Ivy Bridge-DT

The following models from the Ivy Bridge desktop range are available as embedded processors:
* Core i7-3770
* Core i5-3550S
* Core i3-3220
See section Desktop processors § Ivy Bridge-DT for full info.

#### Ivy Bridge-M

Common features:
* Socket: G2 (3xx0ME/QE models only), BGA 1023 (all other models and also i5-3610ME, i3-3120ME).
* All the CPUs support dual-channel DDR3 and DDR3L RAM, at up to 1600 MT/s speed.
* i7 models provide 16 lanes of PCIe 3.0, while i5 models provide 1 lane of PCIe 3.0 and i3 models provide 1 lane of PCIe 2.0.
* All CPUs feature a DMI 2.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 32 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 3615QE | 4 (8) | 2.3 | 3.3 | HD 4000 | 650–1000 | 6 MB | 45 W | April 2012 |
| Core i7 | 3610QE | 4 (8) | 2.3 | 3.3 | HD 4000 | 650–1000 | 6 MB | 45 W | April 2012 |
| Core i7 | 3612QE | 4 (8) | 2.1 | 3.1 | HD 4000 | 650–1000 | 6 MB | 35 W | April 2012 |
| Core i7 | 3555LE | 2 (4) | 2.5 | 3.2 | HD 4000 | 550–1000 | 4 MB | 25 W | June 2012 |
| Core i7 | 3517UE | 2 (4) | 1.7 | 2.8 | HD 4000 | 350–1000 | 4 MB | 17 W | June 2012 |
| Core i5 | 3610ME | 2 (4) | 2.7 | 3.3 | HD 4000 | 650–950 | 3 MB | 35 W | June 2012 |
| Core i3 | 3217UE | 2 (4) | 1.6 | — | HD 4000 | 350–900 | 3 MB | 17 W | August 2012 |
| Core i3 | 3120ME | 2 (4) | 2.4 | — | HD 4000 | 650–900 | 3 MB | 35 W | August 2012 |

#### Gladden

Common features:
* Socket: BGA 1284.
* All the CPUs support dual-channel DDR3 and DDR3L 1333 MT/s RAM.
* All CPU models provide 20 lanes of PCIe 3.0.
* All CPUs feature a DMI 2.0 bus to the chipset (PCH).
* No integrated graphics.
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 22 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Smart Cache | TDP | Release date |
| Core i3 | 3115C | 2 (4) | 2.5 | — | 4 MB | 25 W | Q3 2013 |

### Core i (4th gen)
#### Haswell-DT

Common features:
* Socket: LGA 1150.
* All the CPUs support dual-channel DDR3 RAM, at up to 1600 MT/s speed.
* All CPU models provide 16 lanes of PCIe 3.0.
* All CPUs feature a DMI 2.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 22 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 4770TE | 4 (8) | 2.3 | 3.3 | HD 4600 | 350–1000 | 8 MB | 45 W | June 2013 |
| Core i5 | 4570TE | 2 (4) | 2.7 | 3.3 | HD 4600 | 350–1000 | 4 MB | 35 W | June 2013 |
| Core i3 | 4340TE | 2 (4) | 2.6 | — | HD 4600 | 350–1000 | 4 MB | 35 W | May 2014 |
| Core i3 | 4330TE | 2 (4) | 2.4 | — | HD 4600 | 350–1000 | 4 MB | 35 W | September 2013 |
The following models from the Haswell-DT desktop range are also available as embedded processors:
* Core i7-4790S
* Core i7-4770S
* Core i5-4590S
* Core i5-4590T
* Core i5-4570S
* Core i3-4360
* Core i3-4350T
* Core i3-4330
See section Desktop processors § Haswell-DT for full info.

#### Haswell-H

Common features:
* Socket: BGA 1364.
* All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed.
* All CPU models provide 16 lanes of PCIe 3.0.
* All CPUs feature a DMI 2.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Models with Iris Pro 5200 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
* Fabrication process: 22 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 4860EQ | 4 (8) | 1.8 | 3.2 | Iris Pro 5200 | 750–1000 | 6 MB | 47 W | August 2013 |
| Core i7 | 4850EQ | 4 (8) | 1.6 | 3.2 | Iris Pro 5200 | 650–1000 | 6 MB | 47 W | August 2013 |
| Core i7 | 4701EQ | 4 (8) | 2.4 | 3.4 | HD 4600 | 400–1000 | 6 MB | 47 W | Q3 2013 |
| Core i7 | 4700EQ | 4 (8) | 2.4 | 3.4 | HD 4600 | 400–1000 | 6 MB | 47 W | June 2013 |
| Core i7 | 4700EC | 4 (8) | 2.7 | — | — | — | 8 MB | 43 W | March 2014 |
| Core i7 | 4702EC | 4 (8) | 2.0 | — | — | — | 8 MB | 27 W | March 2014 |
| Core i5 | 4422E | 2 (4) | 1.8 | 2.9 | HD 4600 | 400–900 | 3 MB | 25 W | April 2014 |
| Core i5 | 4410E | 2 (4) | 2.9 | — | HD 4600 | 400–1000 | 3 MB | 37 W | April 2014 |
| Core i5 | 4400E | 2 (4) | 2.7 | 3.3 | HD 4600 | 400–1000 | 3 MB | 37 W | September 2013 |
| Core i5 | 4402E | 2 (4) | 1.6 | 2.7 | HD 4600 | 400–900 | 3 MB | 25 W | September 2013 |
| Core i5 | 4402EC | 2 (4) | 2.5 | — | — | — | 4 MB | 27 W | March 2014 |
| Core i3 | 4110E | 2 (4) | 2.6 | — | HD 4600 | 400–900 | 3 MB | 37 W | April 2014 |
| Core i3 | 4112E | 2 (4) | 1.8 | — | HD 4600 | 400–900 | 3 MB | 25 W | April 2014 |
| Core i3 | 4100E | 2 (4) | 2.4 | — | HD 4600 | 400–900 | 3 MB | 37 W | September 2013 |
| Core i3 | 4102E | 2 (4) | 1.6 | — | HD 4600 | 400–900 | 3 MB | 25 W | September 2013 |

### Core i (5th gen)
#### Broadwell-H

Common features:
* Socket: BGA 1364.
* All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed.
* All CPU models provide 16 lanes of PCIe 3.0.
* All CPUs feature a DMI 2.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Models with Iris Pro 6200 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
* Fabrication process: 14 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 5850EQ | 4 (8) | 2.7 | 3.4 | Iris Pro 6200 | 300–1000 | 6 MB | 47 W | June 2015 |
| Core i7 | 5700EQ | 4 (8) | 2.6 | 3.4 | HD 5600 | 300–1000 | 6 MB | 47 W | June 2015 |

### Core i (6th gen)
#### Skylake-S

Common features:
* Socket: LGA 1151.
* All the CPUs support dual-channel DDR4-2133 or DDR3L-1600 RAM.
* All CPU models provide 16 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 14 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 6700TE | 4 (8) | 2.4 | 3.4 | HD 530 | 350–1000 | 8 MB | 35 W | September 2015 |
| Core i5 | 6500TE | 4 (4) | 2.3 | 3.3 | HD 530 | 350–1000 | 6 MB | 35 W | September 2015 |
| Core i3 | 6100TE | 2 (4) | 2.7 | — | HD 530 | 350–1000 | 4 MB | 35 W | Q4 2015 |

#### Skylake-H

Common features:
* Socket: BGA 1440.
* All the CPUs support dual-channel DDR4-2133, DDR3L-1600 or LPDDR3-1866 RAM.
* All CPU models provide 16 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Models with Iris Pro 580 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
* Fabrication process: 14 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 6820EQ | 4 (8) | 2.8 | 3.5 | HD 530 | 350–1000 | 8 MB | 45 W | October 2015 |
| Core i7 | 6822EQ | 4 (8) | 2.0 | 2.8 | HD 530 | 350–1000 | 8 MB | 25 W | October 2015 |
| Core i5 | 6440EQ | 4 (4) | 2.7 | 3.4 | HD 530 | 350–1000 | 6 MB | 45 W | October 2015 |
| Core i5 | 6442EQ | 4 (4) | 1.9 | 2.7 | HD 530 | 350–1000 | 6 MB | 25 W | October 2015 |
| Core i3 | 6100E | 2 (4) | 2.7 | — | HD 530 | 350–950 | 3 MB | 35 W | October 2015 |
| Core i3 | 6102E | 2 (4) | 1.9 | — | HD 530 | 350–950 | 3 MB | 25 W | October 2015 |

### Core i (7th gen)
#### Kaby Lake-S

Common features:
* Socket: LGA 1151.
* All the CPUs support dual-channel DDR4-2400 or DDR3L-1600 RAM.
* All CPU models provide 16 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 14 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i3 | 7101E | 2 (4) | 3.9 | — | HD 610 | 350–1100 | 3 MB | 54 W | January 2017 |
| Core i3 | 7101TE | 2 (4) | 3.4 | — | HD 610 | 350–1100 | 3 MB | 35 W | January 2017 |

#### Kaby Lake-H

Common features:
* Socket: BGA 1440.
* All the CPUs support dual-channel DDR4-2400 RAM.
* All CPU models provide 16 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 14 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 7820EQ | 4 (8) | 3.0 | 3.7 | HD 630 | 350–1000 | 8 MB | 45 W | January 2017 |
| Core i5 | 7440EQ | 4 (4) | 2.9 | 3.6 | HD 630 | 350–1000 | 6 MB | 45 W | January 2017 |
| Core i5 | 7442EQ | 4 (4) | 2.1 | 2.9 | HD 630 | 350–1000 | 6 MB | 25 W | January 2017 |
| Core i3 | 7100E | 2 (4) | 2.9 | — | HD 630 | 350–950 | 3 MB | 35 W | January 2017 |
| Core i3 | 7102E | 2 (4) | 2.1 | — | HD 630 | 350–950 | 3 MB | 25 W | January 2017 |

### Core i (8th gen)
#### Whiskey Lake-U

Common features:
* Socket: BGA 1528.
* All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
* All CPU models provide 16 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 14 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 8665UE | 4 (8) | 1.7 | 4.4 | UHD 620 | 300–1150 | 8 MB | 15 W | April 2019 |
| Core i5 | 8365UE | 4 (8) | 1.6 | 4.1 | UHD 620 | 300–1050 | 6 MB | 15 W | June 2019 |
| Core i3 | 8145UE | 2 (4) | 2.2 | 3.9 | UHD 620 | 300–1000 | 4 MB | 15 W | June 2019 |

### Core i (9th gen)
#### Coffee Lake-R

Common features:
* Socket: LGA 1151-2.
* All the CPUs support dual-channel DDR4-2400 RAM. i5 models and up support it at up to 2666 MT/s speeds.
* All CPU models provide 16 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 14 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 9700E | 8 (8) | 2.6 | 4.4 | UHD 630 | 350–1150 | 12 MB | 65 W | June 2019 |
| Core i7 | 9700TE | 8 (8) | 1.8 | 3.8 | UHD 630 | 350–1150 | 12 MB | 35 W | June 2019 |
| Core i5 | 9500E | 6 (6) | 3.0 | 4.2 | UHD 630 | 350–1100 | 9 MB | 65 W | June 2019 |
| Core i5 | 9500TE | 6 (6) | 2.2 | 3.6 | UHD 630 | 350–1100 | 9 MB | 35 W | June 2019 |
| Core i3 | 9100E | 4 (4) | 3.1 | 3.7 | UHD 630 | 350–1050 | 6 MB | 65 W | June 2019 |
| Core i3 | 9100TE | 4 (4) | 2.2 | 3.2 | UHD 630 | 350–1050 | 6 MB | 35 W | June 2019 |

#### Coffee Lake-H (refresh)

Common features:
* Socket: BGA 1440.
* All the CPUs support dual-channel DDR4-2666 RAM.
* All CPU models provide 16 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 14 nm.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 9850HE | 6 (12) | 2.7 | 4.4 | UHD 630 | 350–1150 | 9 MB | 45 W | June 2019 |
| Core i7 | 9850HL | 6 (12) | 1.9 | 4.1 | UHD 630 | 350–1150 | 9 MB | 25 W | June 2019 |
| Core i3 | 9100HL | 4 (4) | 1.6 | 2.9 | UHD 630 | 350–1100 | 6 MB | 25 W | June 2019 |

### Core i (10th gen)
#### Comet Lake-S

Common features:
* Socket: LGA 1200.
* All the CPUs support dual-channel DDR4-2666 RAM. i7 models and higher support it at up to 2933 MT/s speeds.
* All CPU models provide 16 lanes of PCIe 3.0.
* All CPUs feature a DMI 3.0 4-lane bus to the chipset (PCH).
* L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
* L2 cache: 256 KB per core.
* Fabrication process: 14 nm.
* i9-10900E features Thermal Velocity Boost.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i9 | 10900E | 10 (20) | 2.8 | 4.7 | UHD 630 | 350–1200 | 20 MB | 65 W | April 2020 |
| Core i9 | 10900TE | 10 (20) | 1.8 | 4.5 | UHD 630 | 350–1200 | 20 MB | 35 W | April 2020 |
| Core i7 | 10700E | 8 (16) | 2.9 | 4.5 | UHD 630 | 350–1150 | 16 MB | 65 W | May 2020 |
| Core i7 | 10700TE | 8 (16) | 2.0 | 4.4 | UHD 630 | 350–1150 | 16 MB | 35 W | May 2020 |
| Core i5 | 10500E | 6 (12) | 3.1 | 4.2 | UHD 630 | 350–1150 | 12 MB | 65 W | April 2020 |
| Core i5 | 10500TE | 6 (12) | 2.3 | 3.7 | UHD 630 | 350–1150 | 12 MB | 35 W | April 2020 |
| Core i3 | 10100E | 4 (8) | 3.2 | 3.8 | UHD 630 | 350–1100 | 6 MB | 65 W | April 2020 |
| Core i3 | 10100TE | 4 (8) | 2.3 | 3.6 | UHD 630 | 350–1100 | 6 MB | 35 W | April 2020 |

### Core i (11th gen)
#### Tiger Lake-UP3

Common features:
* Socket: BGA 1449.
* All the CPUs support dual-channel DDR4-3200 or LPDDR4X-3733 RAM. i5 models and up support LPDDR4X at up to 4266 MT/s speed.
* All CPU models provide 4 lanes of PCIe 4.0, in addition to PCIe 3.0 provided by the on-package PCH.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
* L2 cache: 1.25 MB per core.
* Fabrication process: 10 nm.
* All models have configurable TDP (cTDP), which can be set from a minimum of 12 W to 28 W. Base clocks shown are at 15 W TDP; they will be different depending on the cTDP setting chosen.
* -GRE suffix models have a minimum operating temperature of -40°C as opposed to 0°C for the normal models, and also feature "in-band ECC" for memory.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 1185GRE | 4 (8) | 1.8 | 4.4 | Iris Xe (96 EU) | ?–1350 | 12 MB | 15 W | September 2020 |
| Core i7 | 1185G7E | 4 (8) | 1.8 | 4.4 | Iris Xe (96 EU) | ?–1350 | 12 MB | 15 W | September 2020 |
| Core i5 | 1145GRE | 4 (8) | 1.5 | 4.1 | Iris Xe (80 EU) | ?–1300 | 8 MB | 15 W | September 2020 |
| Core i5 | 1145G7E | 4 (8) | 1.5 | 4.1 | Iris Xe (80 EU) | ?–1300 | 8 MB | 15 W | September 2020 |
| Core i3 | 1115GRE | 2 (4) | 2.2 | 3.9 | UHD Graphics (48 EU) | ?–1250 | 6 MB | 15 W | September 2020 |
| Core i3 | 1115G4E | 2 (4) | 2.2 | 3.9 | UHD Graphics (48 EU) | ?–1250 | 6 MB | 15 W | September 2020 |

#### Tiger Lake-H

Common features:
* Socket: BGA 1598.
* All the CPUs support dual-channel DDR4-3200 RAM.
* All CPU models provide 20 lanes of PCIe 4.0, in addition to 24 lanes of PCIe 3.0 provided by the on-package PCH.
* All CPUs feature a DMI 3.0 bus to the chipset (PCH).
* L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
* L2 cache: 1.25 MB per core.
* Fabrication process: 10 nm.
* The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.
* Minimum operating temperature: 0°C.
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i7 | 11850HE | 8 (16) | 2.1–2.6 | 4.7 | UHD Graphics (32 EU) | 350–1350 | 24 MB | 35–45 W | August 2021 |
| Core i5 | 11500HE | 6 (12) | 2.1–2.6 | 4.5 | UHD Graphics (32 EU) | 350–1350 | 12 MB | 35–45 W | August 2021 |
| Core i3 | 11100HE | 4 (8) | 1.9–2.4 | 4.4 | UHD Graphics (16 EU) | 350–1250 | 8 MB | 35–45 W | August 2021 |

### Core i (12th gen)
#### Alder Lake-S

Common features:
* Socket: LGA 1700.
* All the CPUs support dual-channel DDR4-3200 or DDR5-4800 RAM
* All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
* All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
* L1 cache:
** P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
** E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
* L2 cache:
** P-cores: 1.25 MB per core.
** E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
* Fabrication process: Intel 7.
* Turbo Boost version is 2.0.
| Processor branding | Model | P-core (performance) | P-core (performance) | P-core (performance) | E-core (efficiency) | E-core (efficiency) | E-core (efficiency) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i9 | 12900E | 8 (16) | 2.3 | 5.0 | 8 (8) | 1.7 | 3.8 | UHD 770 | 300–1550 | 30 MB | 65 W | January 2022 |
| Core i9 | 12900TE | 8 (16) | 1.1 | 4.8 | 8 (8) | 1.0 | 3.6 | UHD 770 | 300–1550 | 30 MB | 35 W | January 2022 |
| Core i7 | 12700E | 8 (16) | 2.1 | 4.8 | 4 (4) | 1.6 | 3.6 | UHD 770 | 300–1500 | 25 MB | 65 W | January 2022 |
| Core i7 | 12700TE | 8 (16) | 1.4 | 4.6 | 4 (4) | 1.0 | 3.4 | UHD 770 | 300–1500 | 25 MB | 35 W | January 2022 |
| Core i5 | 12500E | 6 (12) | 2.9 | 4.5 | — | — | — | UHD 770 | 300–1450 | 18 MB | 65 W | January 2022 |
| Core i5 | 12500TE | 6 (12) | 1.9 | 4.3 | — | — | — | UHD 770 | 300–1450 | 18 MB | 35 W | January 2022 |
| Core i3 | 12100E | 4 (8) | 3.2 | 4.2 | — | — | — | UHD 730 | 300–1400 | 12 MB | 60 W | January 2022 |
| Core i3 | 12100TE | 4 (8) | 2.1 | 4.0 | — | — | — | UHD 730 | 300–1400 | 12 MB | 35 W | January 2022 |

#### Alder Lake-U

Common features:
* Socket: BGA 1744.
* All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
* All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
* All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
* L1 cache:
** P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
** E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
* L2 cache:
** P-cores: 1.25 MB per core.
** E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
* Fabrication process: Intel 7.
| Processor branding | Model | P-core (performance) | P-core (performance) | P-core (performance) | E-core (efficiency) | E-core (efficiency) | E-core (efficiency) | Integrated GPU | Integrated GPU | Smart Cache | TDP | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Core i7 | 1265UE | 2 (4) | ? | 4.7 | 8 (8) | ? | 3.5 | Iris Xe (96 EU) | ?–1250 | 12 MB | 15 W | 55 W | February 2022 |
| Core i5 | 1245UE | 2 (4) | ? | 4.4 | 8 (8) | ? | 3.3 | Iris Xe (80 EU) | ?–1200 | 12 MB | 15 W | 55 W | February 2022 |
| Core i3 | 1215UE | 2 (4) | ? | 4.4 | 4 (4) | ? | 3.3 | UHD Graphics (64 EU) | ?–1100 | 10 MB | 15 W | 55 W | February 2022 |

#### Alder Lake-P

Common features:
* Socket: BGA 1744.
* All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
* All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
* All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
* L1 cache:
** P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
** E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
* L2 cache:
** P-cores: 1.25 MB per core.
** E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
* Fabrication process: Intel 7.
| Processor branding | Model | P-core (performance) | P-core (performance) | P-core (performance) | E-core (efficiency) | E-core (efficiency) | E-core (efficiency) | Integrated GPU | Integrated GPU | Smart Cache | TDP | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Core i7 | 1270PE | 4 (8) | ? | 4.5 | 8 (8) | ? | 3.3 | Iris Xe (96 EU) | ?–1350 | 18 MB | 28 W | 64 W | February 2022 |
| Core i5 | 1250PE | 4 (8) | ? | 4.4 | 8 (8) | ? | 3.2 | Iris Xe (80 EU) | ?–1300 | 12 MB | 28 W | 64 W | February 2022 |
| Core i3 | 1220PE | 4 (8) | ? | 4.2 | 4 (4) | ? | 3.1 | UHD Graphics (48 EU) | ?–1250 | 12 MB | 28 W | 64 W | Q1 2022 |

#### Alder Lake-PS

Common features:
* Socket: LGA 1700. While sharing the same socket as Alder Lake-S and Raptor Lake-S, this revision of LGA 1700 is electrically incompatible with other 12th and 13th generation Intel Core desktop processors.
* All the CPUs support dual-channel DDR5-4800 or DDR4-3200 RAM.
* All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
* All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
* L1 cache:
** P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
** E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
* L2 cache:
** P-cores: 1.25 MB per core.
** E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
* Fabrication process: Intel 7.
| Processor branding | Model | P-core (performance) | P-core (performance) | P-core (performance) | E-core (efficiency) | E-core (efficiency) | E-core (efficiency) | Integrated GPU | Integrated GPU | Smart Cache | TDP | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Core i7 | 12800HL | 6 (12) | 2.4 | 4.8 | 8 (8) | 1.8 | 3.7 | Iris Xe (96 EU) | ?–1400 | 24 MB | 45 W | 65 W | Q3 2022 |
| Core i7 | 12700HL | 6 (12) | 2.3 | 4.7 | 8 (8) | 1.7 | 3.5 | Iris Xe (96 EU) | ?–1400 | 24 MB | 45 W | 65 W | Q3 2022 |
| Core i7 | 1265UL | 2 (4) | 1.8 | 4.8 | 8 (8) | 1.3 | 2.7 | Iris Xe (96 EU) | ?–1250 | 12 MB | 15 W | 28 W | Q3 2022 |
| Core i7 | 1255UL | 2 (4) | 1.7 | 4.7 | 8 (8) | 1.2 | 2.6 | Iris Xe (96 EU) | ?–1250 | 12 MB | 15 W | 28 W | Q3 2022 |
| Core i5 | 12600HL | 4 (8) | 2.7 | 4.5 | 8 (8) | 2.0 | 3.3 | Iris Xe (80 EU) | ?–1400 | 18 MB | 45 W | 65 W | Q3 2022 |
| Core i5 | 12500HL | 4 (8) | 2.5 | 4.5 | 8 (8) | 1.8 | 3.3 | Iris Xe (80 EU) | ?–1400 | 18 MB | 45 W | 65 W | Q3 2022 |
| Core i5 | 1245UL | 2 (4) | 1.6 | 4.4 | 8 (8) | 1.2 | 2.5 | Iris Xe (80 EU) | ?–1250 | 12 MB | 15 W | 28 W | Q3 2022 |
| Core i5 | 1235UL | 2 (4) | 1.3 | 4.4 | 8 (8) | 1.1 | 2.5 | Iris Xe (80 EU) | ?–1200 | 12 MB | 15 W | 28 W | Q3 2022 |
| Core i3 | 12300HL | 4 (8) | 2.0 | 4.4 | 4 (4) | 1.5 | 3.3 | UHD Graphics (48 EU) | ?–1400 | 12 MB | 45 W | 65 W | Q3 2022 |
| Core i3 | 1215UL | 2 (4) | 1.2 | 4.4 | 4 (4) | 0.9 | 2.5 | UHD Graphics (64 EU) | ?–1100 | 10 MB | 15 W | 28 W | Q3 2022 |

#### Alder Lake-H

Common features:
* Socket: BGA 1744.
* All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
* All CPU models provide 16 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
* All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
* L1 cache:
** P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
** E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
* L2 cache:
** P-cores: 1.25 MB per core.
** E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
* Fabrication process: Intel 7.
| Processor branding | Model | P-core (performance) | P-core (performance) | P-core (performance) | E-core (efficiency) | E-core (efficiency) | E-core (efficiency) | Integrated GPU | Integrated GPU | Smart Cache | TDP | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Core i7 | 12800HE | 6 (12) | 2.4 | 4.6 | 8 (8) | 1.8 | 3.5 | Iris Xe (96 EU) | ?–1350 | 24 MB | 45 W | 115 W | January 2022 |
| Core i5 | 12600HE | 4 (8) | 2.5 | 4.5 | 8 (8) | 1.8 | 3.3 | Iris Xe (80 EU) | ?–1300 | 18 MB | 45 W | 115 W | January 2022 |
| Core i3 | 12300HE | 4 (8) | 1.9 | 4.3 | 4 (4) | 1.5 | 3.3 | UHD Graphics (48 EU) | ?–1150 | 12 MB | 45 W | 115 W | January 2022 |

### Core i (13th gen)
#### Raptor Lake-S

Common features:
* Socket: LGA 1700.
* All the CPUs support dual-channel DDR4-3200 or DDR5-5600 RAM.
* All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
* All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
* L1 cache:
** P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
** E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
* L2 cache:
** P-cores: 2 MB per core on i7 and above models, 1.25 MB per core on i5 and below models.
** E-cores: 4 MB per E-core cluster on i7 and above models, 2 MB per cluster on i5 and below models (each "cluster" contains four cores).
* Fabrication process: Intel 7.
* Turbo Boost version is 2.0.
| Processor branding | Model | P-core (performance) | P-core (performance) | P-core (performance) | E-core (efficiency) | E-core (efficiency) | E-core (efficiency) | Integrated GPU | Integrated GPU | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | TDP | Release date |
| Core i9 | 13900E | 8 (16) | 1.8 | 5.2 | 16 (16) | 1.3 | 4.0 | UHD 770 | 300–1650 | 36 MB | 65 W | January 2023 |
| Core i9 | 13900TE | 8 (16) | 1.0 | 5.0 | 16 (16) | 0.8 | 3.9 | UHD 770 | 300–1650 | 36 MB | 35 W | January 2023 |
| Core i7 | 13700E | 8 (16) | 1.9 | 5.1 | 8 (8) | 1.3 | 3.9 | UHD 770 | 300–1600 | 30 MB | 65 W | January 2023 |
| Core i7 | 13700TE | 8 (16) | 1.1 | 4.8 | 8 (8) | 0.8 | 3.6 | UHD 770 | 300–1600 | 30 MB | 35 W | January 2023 |
| Core i5 | 13500E | 6 (12) | 2.4 | 4.6 | 8 (8) | 1.5 | 3.3 | UHD 770 | 300–1550 | 24 MB | 65 W | January 2023 |
| Core i5 | 13500TE | 6 (12) | 1.3 | 4.5 | 8 (8) | 1.1 | 3.1 | UHD 770 | 300–1550 | 24 MB | 35 W | January 2023 |
| Core i5 | 13400E | 6 (12) | 2.4 | 4.6 | 4 (4) | 1.5 | 3.3 | UHD 770 | 300–1550 | 20 MB | 65 W | January 2023 |
| Core i3 | 13100E | 4 (8) | 3.3 | 4.4 | — | — | — | UHD 730 | 300–1500 | 12 MB | 60 W | January 2023 |
| Core i3 | 13100TE | 4 (8) | 2.4 | 4.1 | — | — | — | UHD 730 | 300–1500 | 12 MB | 35 W | January 2023 |

#### Raptor Lake-U

Common features:
* Socket: BGA 1744.
* All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
* All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
* All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
* L1 cache:
** P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
** E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
* L2 cache:
** P-cores: 2 MB per core.
** E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
* Fabrication process: Intel 7.
| Processor branding | Model | P-core (performance) | P-core (performance) | P-core (performance) | E-core (efficiency) | E-core (efficiency) | E-core (efficiency) | Integrated GPU | Integrated GPU | Smart Cache | TDP | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Core i7 | 1365UE | 2 (4) | 1.7 | 4.9 | 8 (8) | 1.3 | 3.7 | Iris Xe (96 EU) | ?–1300 | 12 MB | 15 W | 55 W | January 2023 |
| Core i5 | 1345UE | 2 (4) | 1.4 | 4.6 | 8 (8) | 1.2 | 3.4 | Iris Xe (80 EU) | ?–1250 | 12 MB | 15 W | 55 W | January 2023 |
| Core i5 | 1335UE | 2 (4) | 1.3 | 4.5 | 8 (8) | 0.9 | 3.3 | Iris Xe (80 EU) | ?–1250 | 12 MB | 15 W | 55 W | January 2023 |
| Core i3 | 1315UE | 2 (4) | 1.2 | 4.5 | 4 (4) | 0.9 | 3.3 | UHD Graphics (64 EU) | ?–1200 | 10 MB | 15 W | 55 W | January 2023 |

#### Raptor Lake-P

Common features:
* Socket: BGA 1744.
* All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
* All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
* All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
* L1 cache:
** P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
** E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
* L2 cache:
** P-cores: 2 MB per core.
** E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
* Fabrication process: Intel 7.
| Processor branding | Model | P-core (performance) | P-core (performance) | P-core (performance) | E-core (efficiency) | E-core (efficiency) | E-core (efficiency) | Integrated GPU | Integrated GPU | Smart Cache | TDP | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Core i7 | 1370PE | 6 (12) | 1.9 | 4.8 | 8 (8) | ? | 3.7 | Iris Xe (96 EU) | ?–1400 | 24 MB | 28 W | 64 W | January 2023 |
| Core i5 | 1350PE | 4 (8) | 1.8 | 4.6 | 8 (8) | ? | 3.4 | Iris Xe (80 EU) | ?–1400 | 12 MB | 28 W | 64 W | January 2023 |
| Core i5 | 1340PE | 4 (8) | 1.8 | 4.5 | 8 (8) | ? | 3.3 | Iris Xe (80 EU) | ?–1350 | 12 MB | 28 W | 64 W | January 2023 |
| Core i3 | 1320PE | 4 (8) | 1.7 | 4.5 | 4 (4) | ? | 3.3 | UHD Graphics (48 EU) | ?–1200 | 12 MB | 28 W | 64 W | January 2023 |

#### Raptor Lake-H

Common features:
* Socket: BGA 1744.
* All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
* All CPU models provide 8 lanes of PCIe 5.0 and 8 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
* All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
* L1 cache:
** P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
** E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
* L2 cache:
** P-cores: 2 MB per core.
** E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
* Fabrication process: Intel 7.
| Processor branding | Model | P-core (performance) | P-core (performance) | P-core (performance) | E-core (efficiency) | E-core (efficiency) | E-core (efficiency) | Integrated GPU | Integrated GPU | Smart Cache | TDP | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Core i7 | 13800HE | 6 (12) | 2.5 | 5.0 | 8 (8) | 1.8 | 4.0 | Iris Xe (96 EU) | ?–1400 | 24 MB | 45 W | 115 W | January 2023 |
| Core i5 | 13600HE | 4 (8) | 2.7 | 4.8 | 8 (8) | 2.1 | 3.6 | Iris Xe (80 EU) | ?–1400 | 18 MB | 45 W | 115 W | January 2023 |
| Core i3 | 13300HE | 4 (8) | 2.1 | 4.6 | 4 (4) | 1.9 | 3.4 | UHD Graphics (48 EU) | ?–1300 | 12 MB | 45 W | 115 W | January 2023 |

### Core / Core Ultra 3/5/7/9 (Series 1)
#### Meteor Lake-PS

Common features:
* Socket: LGA 1851 (electrically incompatible with the socket used by non-embedded processors such as Arrow Lake-S).
* All the CPUs support dual-channel DDR5-5600 RAM.
* All CPU models provide 20 lanes of PCIe 4.0.
* All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
* Includes integrated graphics based on Alchemist architecture.
* L1 cache:
** P-cores: 112 KB (48 KB data + 64 KB instructions) per core.
** E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
* L2 cache:
** P-cores: 2 MB per core.
** E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
* All processor models also feature 2× "LP E-Cores" which are clocked at 0.7 GHz base, 2.1 GHz boost (2.5 GHz on HL-suffix models) and have 2 MB of L2 cache.
* Fabrication process: Intel 4 (compute tile).
* Configurable TDP (cTDP) of 12–28 W is featured on UL-suffix models, and 20–65 W on HL-suffix models.
| Processor branding | Model | P-core (performance) | P-core (performance) | P-core (performance) | E-core (efficiency) | E-core (efficiency) | E-core (efficiency) | Integrated GPU | Integrated GPU | Smart Cache | TDP | TDP | Release date |
| Processor branding | Model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Processor branding | Model | Cores (Threads) | Base | Turbo | Cores (Threads) | Base | Turbo | Model | Clock (MHz) | Smart Cache | Base | Max. Turbo | Release date |
| Core Ultra 7 | 165HL | 6 (12) | 1.4 | 5.0 | 8 (8) | 0.9 | 3.8 | Intel Arc (8 Xe-cores) | ?–2300 | 24 MB | 45 W | 115 W | April 2024 |
| Core Ultra 7 | 155HL | 6 (12) | 1.4 | 4.8 | 8 (8) | 0.9 | 3.8 | Intel Arc (8 Xe-cores) | ?–2250 | 24 MB | 45 W | 115 W | April 2024 |
| Core Ultra 7 | 165UL | 2 (4) | 1.7 | 4.9 | 8 (8) | 1.2 | 3.8 | Intel Graphics (4 Xe-cores) | ?–2000 | 12 MB | 15 W | 57 W | April 2024 |
| Core Ultra 7 | 155UL | 2 (4) | 1.7 | 4.8 | 8 (8) | 1.2 | 3.8 | Intel Graphics (4 Xe-cores) | ?–1950 | 12 MB | 15 W | 57 W | April 2024 |
| Core Ultra 5 | 135HL | 4 (8) | 1.7 | 4.6 | 8 (8) | 1.2 | 3.6 | Intel Arc (8 Xe-cores) | ?–2200 | 18 MB | 45 W | 115 W | April 2024 |
| Core Ultra 5 | 125HL | 4 (8) | 1.2 | 4.5 | 8 (8) | 0.7 | 3.6 | Intel Arc (7 Xe-cores) | ?–2200 | 18 MB | 45 W | 115 W | April 2024 |
| Core Ultra 5 | 135UL | 2 (4) | 1.6 | 4.4 | 8 (8) | 1.1 | 3.6 | Intel Graphics (4 Xe-cores) | ?–1900 | 12 MB | 15 W | 57 W | April 2024 |
| Core Ultra 5 | 125UL | 2 (4) | 1.3 | 4.3 | 8 (8) | 0.8 | 3.6 | Intel Graphics (4 Xe-cores) | ?–1850 | 12 MB | 15 W | 57 W | April 2024 |
| Core Ultra 3 | 105UL | 2 (4) | 1.5 | 4.2 | 4 (4) | 1.0 | 3.5 | Intel Graphics (3 Xe-cores) | ?–1800 | 10 MB | 15 W | 57 W | April 2024 |