# HiSilicon

HiSilicon (Chinese: 海思; pinyin: Hǎisī) is a Chinese fabless semiconductor company based in Shenzhen, Guangdong province and wholly owned by Huawei. HiSilicon purchases licenses for CPU designs from ARM Holdings, including the ARM Cortex-A9 MPCore, ARM Cortex-M3, ARM Cortex-A7 MPCore, ARM Cortex-A15 MPCore, ARM Cortex-A53, ARM Cortex-A57 and also for their Mali graphics cores. HiSilicon has also purchased licenses from Vivante Corporation for their GC4000 graphics core.
HiSilicon is reputed to be the largest domestic designer of integrated circuits in China. In 2020, the United States instituted rules that require any American firms providing equipment to HiSilicon or non-American firms who use American technologies or IPR (such as TSMC) that supply HiSilicon to have licenses as part of the ongoing trade dispute, and Huawei announced it will stop producing its Kirin chipsets from 15 September 2020 onwards due to this disruption of its supply chain. On 29 August 2023, Huawei announced the first fully domestically fabricated chip, the Kirin 9000S, which is used on its latest Mate 60 Pro phablet series of phones and MatePad 13.2 tablets.

## History

HiSilicon was Huawei's ASIC design center, which was founded in 1991.
* 2004– Shenzhen HiSilicon Semiconductor Co., Ltd. was registered and the company was formally established.
* 2016– HiSilicon's Kirin 960 chipset was rated one of the "best of Android 2016" in performance by Android Authority.
* 2019– Shanghai HiSilicon, a wholly-owned subsidiary of Huawei, was established.

## Smartphone application processors

HiSilicon develops SoCs based on the ARM architecture. Though not exclusive, these SoCs see preliminary use in handheld and tablet devices of its parent company Huawei.

### K3V2

The first well known product of HiSilicon is the K3V2 used in Huawei Ascend D Quad XL (U9510) smartphones and Huawei MediaPad 10 FHD7 tablets. This chipset is based on the ARM Cortex-A9 MPCore fabbed at 40 nm and uses a 16 core Vivante GC4000 GPU. The SoC supports LPDDR2-1066, but actual products are found with LPDDR-900 instead for lower power consumption.
| Model Number | Fab | CPU | CPU | CPU | CPU | GPU | GPU | Memory Technology | Memory Technology | Memory Technology | Nav | Wireless | Wireless | Wireless | Sampling availability | Devices using |
| Model Number | Fab | ISA | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Nav | Cellular | WLAN | PAN | Sampling availability | Devices using |
| K3V2 (Hi3620) | 40 nm | ARMv7 | Cortex-A9 L1: 32 KB instruction + 32 KB data, L2: 1 MB | 4 | 1.4 | Vivante GC4000 | 240 MHz (15.3GFlops) | LPDDR2 | 64-bit dual-channel | 7.2 (up to 8.5) | — | — | — | — | Q1 2012 | List Huawei MediaPad 10 FHD, Huawei Ascend D2 (U9510), Huawei Honor 2 (U9508), Huawei Ascend P6, Huawei Ascend P6S, Huawei Ascend P2, Huawei Ascend Mate, Lenovo A376, STREAM X (GSL07S) |

### K3V2E

This is a revised version of K3V2 SoC with improved support of Intel baseband. The SoC supports LPDDR2-1066, but actual products are found with LPDDR-900 instead for lower power consumption.
| Model Number | Fab | CPU | CPU | CPU | CPU | GPU | GPU | Memory Technology | Memory Technology | Memory Technology | Nav | Wireless | Wireless | Wireless | Sampling availability | Devices using |
| Model Number | Fab | ISA | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Nav | Cellular | WLAN | PAN | Sampling availability | Devices using |
| K3V2E (Hi3620) | 40 nm | ARMv7 | Cortex-A9 L1: 32 KB instruction + 32 KB data, L2: 1 MB | 4 | 1.5 | Vivante GC4000 | 240 MHz (15.3GFlops) | LPDDR2 | 64-bit dual-channel | 7.2 (up to 8.5) | — | — | — | — | 2013 | List Huawei Honor 3 |

### Kirin 620

* supports – USB 2.0 / 13 MP / 1080p video encode
| Model Number | Fab | CPU | CPU | CPU | CPU | GPU | GPU | Memory Technology | Memory Technology | Memory Technology | Nav | Wireless | Wireless | Wireless | Sampling availability | Devices using |
| Model Number | Fab | ISA | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Nav | Cellular | WLAN | PAN | Sampling availability | Devices using |
| Kirin 620 (Hi6220) | 28 nm | ARMv8-A | Cortex-A53 | 8 | 1.2 | Mali-450 MP4 | 500 MHz (32GFlops) | LPDDR3 (800 MHz) | 32-bit single-channel | 6.4 | — | Dual SIM LTE Cat.4 (150 Mbit/s) | — | — | Q1 2015 | List Huawei P8 Lite, Honor 4X, Honor 4C, Huawei G Play Mini, Honor Holly 3, Y6ll, 96Boards HiKey |

### Kirin 650, 655, 658, 659

| Model Number | Fab | CPU | CPU | CPU | CPU | GPU | GPU | Memory Technology | Memory Technology | Memory Technology | Nav | Wireless | Wireless | Wireless | Sampling availability | Devices using |
| Model Number | Fab | ISA | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Nav | Cellular | WLAN | PAN | Sampling availability | Devices using |
| Kirin 650 (Hi6250) | 16 nm FinFET+ | ARMv8-A | Cortex-A53 Cortex-A53 | 4+4 | 2.0 (4xA53) 1.7 (4xA53) | Mali-T830 MP2 | 900 MHz (40.8GFlops) | LPDDR3 (933 MHz) | 64-bit dual-channel (2x32bit) | | A-GPS, GLONASS | Dual SIM LTE Cat.6 (300 Mbit/s) | 802.11 b/g/n | Bluetooth v4.1 | Q2 2016 | List Huawei P9 Lite, Honor 5C |
| Kirin 655 | 16 nm FinFET+ | ARMv8-A | Cortex-A53 Cortex-A53 | 4+4 | 2.12 (4xA53) 1.7 (4xA53) | Mali-T830 MP2 | 900 MHz (40.8GFlops) | LPDDR3 (933 MHz) | 64-bit dual-channel (2x32bit) | | A-GPS, GLONASS | Dual SIM LTE Cat.6 (300 Mbit/s) | 802.11 b/g/n | Bluetooth v4.1 | Q4 2016 | List Huawei Mate9 Lite, Huawei Honor 6X, P8 Lite (2017), Honor 8 Lite |
| Kirin 658 | 16 nm FinFET+ | ARMv8-A | Cortex-A53 Cortex-A53 | 4+4 | 2.35 (4xA53) 1.7 (4xA53) | Mali-T830 MP2 | 900 MHz (40.8GFlops) | LPDDR3 (933 MHz) | 64-bit dual-channel (2x32bit) | | A-GPS, GLONASS | Dual SIM LTE Cat.6 (300 Mbit/s) | 802.11 b/g/n/ac | Bluetooth v4.1 | Q2 2017 | List P10 Lite |

### Kirin 710

| Model Number | Fab | CPU | CPU | CPU | CPU | GPU | GPU | Memory Technology | Memory Technology | Memory Technology | Nav | Wireless | Wireless | Wireless | Sampling availability | Devices using |
| Model Number | Fab | ISA | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Nav | Cellular | WLAN | PAN | Sampling availability | Devices using |
| Kirin 710 (Hi6260) | TSMC 12 nm FinFET | ARMv8-A | Cortex-A73 Cortex-A53 | 4+4 | 2.2 (A73) 1.7 (A53) | Mali-G51 MP4 | 1000 MHz (64 GFLOPS in FP32) | LPDDR3 LPDDR4 | 32-bit | | A-GPS, GLONASS | Dual SIM LTE Cat.12 (600 Mbit/s) | 802.11 b/g/n | Bluetooth v4.2 | Q3 2018 | List Huawei Nova 3i, Honor 10 Lite, Huawei P Smart+, Huawei P Smart 2019, Huawei Mate 20 Lite, Honor 8X, Huawei Y9 (2019), Huawei P30 Lite，Huawei Y9 Prime 2019, Huawei Y9s, Huawei Mate 20 Lite, Honor 20i |
| Kirin 710F | TSMC 12 nm FinFET | ARMv8-A | Cortex-A73 Cortex-A53 | 4+4 | 2.2 (A73) 1.7 (A53) | Mali-G51 MP4 | 1000 MHz (64 GFLOPS in FP32) | LPDDR3 LPDDR4 | 32-bit | | A-GPS, GLONASS | Dual SIM LTE Cat.12 (600 Mbit/s) | 802.11 b/g/n | Bluetooth v4.2 | | List Honor 9X, Huawei P40 lite E, Huawei Y8p |
| Kirin 710A | SMIC 14 nm FinFET | ARMv8-A | Cortex-A73 Cortex-A53 | 4+4 | 2.0 (A73) 1.7 (A53) | Mali-G51 MP4 | 1000 MHz (64 GFLOPS in FP32) | LPDDR3 LPDDR4 | 32-bit | | A-GPS, GLONASS | Dual SIM LTE Cat.12 (600 Mbit/s) | 802.11 b/g/n | Bluetooth v4.2 | | List Honor Play 4T, Huawei P smart 2021, Huawei Nova Y70, Huawei Nova Y71, Huawei Nova Y72, Huawei MatePad SE 11 |

### Kirin 810 and 820

* DaVinci NPU based on Tensor Arithmetic Unit
* Kirin 820 supported 5G NSA & SA
| Model Number | Fab | CPU | CPU | CPU | CPU | GPU | GPU | Memory Technology | Memory Technology | Memory Technology | Nav | Wireless | Wireless | Wireless | Sampling availability | Devices using |
| Model Number | Fab | ISA | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Nav | Cellular | WLAN | PAN | Sampling availability | Devices using |
| Kirin 810 (Hi6280) | 7 nm FinFET | ARMv8.2-A | Cortex-A76 Cortex-A55 DynamIQ | 2+6 | 2.27 (2xA76) 1.9 (6xA55) | Mali-G52 MP6 | 820 MHz (157.4 GFLOPS in FP32) | LPDDR4X (2133 MHz) | 64-bit (16-bit quad-channel) | 31.78 | A-GPS, GLONASS, BDS | Dual SIM LTE Cat.12 (600 Mbit/s) | 802.11 b/g/n/ac | Bluetooth v5.0 | Q2 2019 | List Huawei Nova 5 Huawei Honor 9x Huawei Honor 9x Pro Huawei Mate 30 Lite Huawei P40 Lite Huawei Nova 7i Huawei nova 6 SE Huawei P smart Pro 2019 Huawei nova 5z Huawei nova 5i Pro Huawei Honor 20S Huawei MatePad 10.4 |
| Kirin 820 5G (Hi6290L V100) | 7 nm FinFET | ARMv8.2-A | Cortex-A76 Cortex-A55 DynamIQ | (1+3)+4 | 2.36 (1xA76 H) 2.22 (3xA76 L) 1.84 (4xA55) | Mali-G57 MP6 | | LPDDR4X (2133 MHz) | 64-bit (16-bit quad-channel) | 31.78 | A-GPS, GLONASS, BDS | Balong 5000 (Sub-6 GHz Only; NSA & SA) | | | Q1 2020 | List Honor 30S Honor X10 5G |
| Kirin 820E 5G | 7 nm FinFET | ARMv8.2-A | Cortex-A76 Cortex-A55 DynamIQ | 3+3 | 2.22 (4xA76 L) 1.84 (4xA55) | Mali-G57 MP6 | | LPDDR4X (2133 MHz) | 64-bit (16-bit quad-channel) | 31.78 | A-GPS, GLONASS, BDS | Balong 5000 (Sub-6 GHz Only; NSA & SA) | | | Q1 2021 | |

### Kirin 8000

HiSilicon Kirin 8000 is a mid-range Kirin 8 series chip not officially announced, however, it was released along with the announcement of Huawei nova 12.
| Model Number | Fab | CPU | CPU | CPU | CPU | GPU | GPU | Memory Technology | Memory Technology | Memory Technology | Nav | Wireless | Wireless | Wireless | Sampling availability | Devices using |
| Model Number | Fab | ISA | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Nav | Cellular | WLAN | PAN | Sampling availability | Devices using |
| Kirin 8000 (Hi6290V110) | SMIC N+2 7 nm FinFET | ARMv8.2-A | Cortex-A77 Cortex-A77 Cortex-A55 DynamIQ | 1+3+4 | 2.40 (1xA77 H) 2.19 (3xA77 L) 1.84 (4xA55) | Mali-G610 MP4 | 864 MHz | LPDDR4X-4266 | 64-bit (16-bit quad-channel) | 51.2 | GPS, A-GPS, GLONASS, BeiDou, Galileo, QZSS | Balong modem | Wi-Fi 6 (11ax) | Bluetooth v5.2 | Q2 2019 | List Huawei Nova 12 Huawei Nova 12 Pro Huawei Nova Flip |
| Kirin T80 (Hi6290V110) | SMIC N+2 7 nm FinFET | ARMv8.2-A | Cortex-A77 Cortex-A77 Cortex-A55 DynamIQ | 1+3+4 | 2.40 (1xA77 H) 2.19 (3xA77 L) 1.84 (4xA55) | Mali-G610 MP4 | 864 MHz | LPDDR4X-4266 | 64-bit (16-bit quad-channel) | 51.2 | GPS, A-GPS, GLONASS, BeiDou, Galileo, QZSS | Balong modem | Wi-Fi 6 (11ax) | Bluetooth v5.2 | Q1 2025 | Huawei MatePad 11.5 PaperMatte (2025) |

### Kirin 910 and 910T

| Model Number | Fab | CPU | CPU | CPU | CPU | GPU | GPU | Memory Technology | Memory Technology | Memory Technology | Nav | Wireless | Wireless | Wireless | Sampling availability | Devices using |
| Model Number | Fab | ISA | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Nav | Cellular | WLAN | PAN | Sampling availability | Devices using |
| Kirin 910 (Hi6620) | 28 nm HPM | ARMv7 | Cortex-A9 | 4 | 1.6 | Mali-450 MP4 | 533 MHz (32GFlops) | LPDDR3 | 32-bit single-channel | 6.4 | — | LTE Cat.4 | — | — | H1 2014 | List HP Slate 7 VoiceTab Ultra, Huawei MediaPad X1, Huawei P6 S, Huawei MediaPad M1, Huawei Honor 3C 4G |
| Kirin 910T | 28 nm HPM | ARMv7 | Cortex-A9 | 4 | 1.8 | Mali-450 MP4 | 700 MHz (41.8GFlops) | LPDDR3 | 32-bit single-channel | 6.4 | — | LTE Cat.4 | — | — | H1 2014 | List Huawei Ascend P7 |

### Kirin 920, 925 and 928

* The Kirin 920 SoC also contains an image processor that supports up to 32-megapixel
| Model Number | Fab | CPU | CPU | CPU | CPU | GPU | GPU | Memory Technology | Memory Technology | Memory Technology | Nav | Wireless | Wireless | Wireless | Sampling availability | Devices using |
| Model Number | Fab | ISA | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Nav | Cellular | WLAN | PAN | Sampling availability | Devices using |
| Kirin 920 | 28 nm HPM | ARMv7 | Cortex-A15 Cortex-A7 big.LITTLE | 4+4 | 1.7 (A15) 1.3 (A7) | Mali-T628 MP4 | 600 MHz (76.8GFlops) | LPDDR3 (1600 MHz) | 64-bit dual-channel | 12.8 | — | LTE Cat.6 (300 Mbit/s) | — | — | H2 2014 | List Huawei Honor 6 |
| Kirin 925 (Hi3630) | 28 nm HPM | ARMv7 | Cortex-A15 Cortex-A7 big.LITTLE | 4+4 | 1.8 (A15) 1.3 (A7) | Mali-T628 MP4 | 600 MHz (76.8GFlops) | LPDDR3 (1600 MHz) | 64-bit dual-channel | 12.8 | — | LTE Cat.6 (300 Mbit/s) | — | — | Q3 2014 | List Huawei Ascend Mate7 Huawei Honor 6 Plus |
| Kirin 928 | 28 nm HPM | ARMv7 | Cortex-A15 Cortex-A7 big.LITTLE | 4+4 | 2.0 (A15) 1.3 (A7) | Mali-T628 MP4 | — | LPDDR3 (1600 MHz) | 64-bit dual-channel | 12.8 | — | LTE Cat.6 (300 Mbit/s) | — | — | | List Huawei Honor6 extreme Edition |

### Kirin 930 and 935

* supports – SD 3.0 (UHS-I) / eMMC 4.51 / Dual-band a/b/g/n Wi-Fi / Bluetooth 4.0 Low Energy / USB 2.0 / 32 MP ISP / 1080p video encode
| Model Number | Fab | CPU | CPU | CPU | CPU | GPU | GPU | Memory Technology | Memory Technology | Memory Technology | Nav | Wireless | Wireless | Wireless | Sampling availability | Devices using |
| Model Number | Fab | ISA | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Nav | Cellular | WLAN | PAN | Sampling availability | Devices using |
| Kirin 930 (Hi3635) | 28 nm HPC | ARMv8-A | Cortex-A53 Cortex-A53 | 4+4 | 2.0 (A53) 1.5 (A53) | Mali-T628 MP4 | 600 MHz (76.8GFlops) | LPDDR3 (1600 MHz) | 64-bit(2x32-bit) Dual-channel | 12.8 GB/s | — | Dual SIM LTE Cat.6 (DL:300 Mbit/s UP:50 Mbit/s) | — | — | Q1 2015 | List Huawei MediaPad X2, Huawei P8, Huawei MediaPad M2, |
| Kirin 935 | 28 nm HPC | ARMv8-A | Cortex-A53 Cortex-A53 | 4+4 | 2.2 (A53) 1.5 (A53) | Mali-T628 MP4 | 680 MHz (87GFlops) | LPDDR3 (1600 MHz) | 64-bit(2x32-bit) Dual-channel | 12.8 GB/s | — | Dual SIM LTE Cat.6 (DL:300 Mbit/s UP:50 Mbit/s) | — | — | Q1 2015 | List Huawei P8 MAX, Honor 7, Huawei Mate S |

### Kirin 950 and 955

* supports – SD 4.1 (UHS-II) / UFS 2.0 / eMMC 5.1 / MU-MIMO 802.11ac Wi-Fi / Bluetooth 4.2 Smart / USB 3.0 / NFS / Dual ISP (42 MP) / Native 10-bit 4K video encode / i5 coprocessor / Tensilica HiFi 4 DSP
| Model Number | Fab | CPU | CPU | CPU | CPU | GPU | GPU | Memory Technology | Memory Technology | Memory Technology | Nav | Wireless | Wireless | Wireless | Sampling availability | Devices using |
| Model Number | Fab | ISA | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Nav | Cellular | WLAN | PAN | Sampling availability | Devices using |
| Kirin 950 (Hi3650) | TSMC 16 nm FinFET+ | ARMv8-A | Cortex-A72 Cortex-A53 big.LITTLE | 4+4 | 2.3 (A72) 1.8 (A53) | Mali-T880 MP4 | 900 MHz (168 GFLOPS FP32) | LPDDR4 | 64-bit(2x32-bit) Dual-channel | 25.6 | — | Dual SIM LTE Cat.6 | — | — | Q4 2015 | List Huawei Mate 8, Huawei Honor V8 32 GB, Huawei Honor 8, Huawei Honor Magic, Huawei MediaPad M3 (BTV-W09) |
| Kirin 955 | TSMC 16 nm FinFET+ | ARMv8-A | Cortex-A72 Cortex-A53 big.LITTLE | 4+4 | 2.5 (A72) 1.8 (A53) | Mali-T880 MP4 | 900 MHz (168 GFLOPS FP32) | LPDDR3 (3 GB) LPDDR4 (4 GB) | 64-bit(2x32-bit) Dual-channel | 25.6 | — | Dual SIM LTE Cat.6 | — | — | Q2 2016 | List Huawei P9, Huawei P9 Plus, Honor Note 8, Honor V8 64 GB |

### Kirin 960

* Interconnect: ARM CCI-550, Storage: UFS 2.1, eMMC 5.1, Sensor Hub: i6
| Model Number | Fab | CPU | CPU | CPU | CPU | GPU | GPU | Memory Technology | Memory Technology | Memory Technology | Nav | Wireless | Wireless | Wireless | Sampling availability | Devices using |
| Model Number | Fab | ISA | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Nav | Cellular | WLAN | PAN | Sampling availability | Devices using |
| Kirin 960 (Hi3660) | TSMC 16 nm FFC | ARMv8-A | Cortex-A73 Cortex-A53 big.LITTLE | 4+4 | 2.36 (A73) 1.84 (A53) | Mali-G71 MP8 | 1037 MHz (199.1 GFLOPS in FP32) | LPDDR4-1600 | 64-bit(2x32-bit) Dual-channel | 28.8 | — | Dual SIM LTE Cat.12 LTE 4x CA, 4x4 MIMO | — | — | Q4 2016 | List Huawei Mate 9, Huawei Mate 9 Porsche Design, Huawei Mate 9 Pro, Huawei P10, Huawei P10 Plus, Huawei Nova 2s, Honor 8 Pro (Honor V9), Honor 9, Huawei MediaPad M5 |

### Kirin 970

* Interconnect: ARM CCI-550, Storage: UFS 2.1, Sensor Hub: i7
* Cadence Tensilica Vision P6 DSP.
* NPU made in collaboration with Cambricon Technologies. 1.92T FP16 OPS.
| Model Number | Fab | CPU | CPU | CPU | CPU | GPU | GPU | Memory Technology | Memory Technology | Memory Technology | Nav | Wireless | Wireless | Wireless | Sampling availability | Devices using |
| Model Number | Fab | ISA | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Nav | Cellular | WLAN | PAN | Sampling availability | Devices using |
| Kirin 970 (Hi3670) | TSMC 10 nm FinFET+ | ARMv8-A | Cortex-A73 Cortex-A53 big.LITTLE | 4+4 | 2.36 (A73) 1.84 (A53) | Mali-G72 MP12 | 746 MHz (214.8 GFLOPS in FP32) | LPDDR4X-1866 | 64-bit(4x16-bit) Quad-channel | 29.8 | Galileo | Dual SIM LTE Cat.18 LTE 5x CA, No 4x4 MIMO | — | — | Q4 2017 | List Huawei Nova 3 Huawei P20 Huawei P20 Pro Huawei Mate 10 Huawei Mate 10 Pro Huawei Mate 10 Porsche Design Huawei Mate RS Porsche Design Honor V10/ Honor View 10 Honor 10 Honor Note 10 Honor Play |

### Kirin 980 and Kirin 985 5G/4G

Kirin 980 is HiSilicon's first SoC based on 7 nm FinFET technology.
* Interconnect: ARM Mali G76-MP10, Storage: UFS 2.1, Sensor Hub: i8
* Dual NPU made in collaboration with Cambricon Technologies.
Kirin 985 5G is the second Hisilicon's 5G SoC based on 7 nm FinFET Technology.
* Interconnect: ARM Mali-G77 MP8, Storage UFS 3.0
* Big-Tiny Da Vinci NPU: 1x Da Vinci Lite + 1x Da Vinci Tiny
| Model Number | Fab | CPU | CPU | CPU | CPU | GPU | GPU | Memory Technology | Memory Technology | Memory Technology | Nav | Wireless | Wireless | Wireless | Sampling availability | Devices using |
| Model Number | Fab | ISA | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Nav | Cellular | WLAN | PAN | Sampling availability | Devices using |
| Kirin 980 | TSMC 7 nm FinFET | ARMv8.2-A | Cortex-A76 Cortex-A55 DynamIQ | (2+2)+4 | 2.6 (A76 H) 1.92 (A76 L) 1.8 (A55) | Mali-G76 MP10 | 720 MHz (345.6 GFLOPS in FP32) | LPDDR4X-2133 | 64-bit(4x16-bit) Quad-channel | 34.1 | Galileo | Dual SIM LTE Cat.21 LTE 5x CA, No 4x4 MIMO | — | — | Q4 2018 | List Huawei Mate 20Huawei Mate 20 ProHuawei Mate 20 RS Porsche DesignHuawei Mate 20 XHonor Magic 2Honor View 20/V20Honor 20Honor 20 ProHuawei P30Huawei P30 ProHuawei Nova 5 ProHuawei MediaPad M6Huawei Nova 5T |
| Kirin 985 5G/4G (Hi6290V110) | TSMC 7 nm FinFET | ARMv8.2-A | Cortex-A76 Cortex-A55 DynamIQ | (1+3)+4 | 2.58 (A76 H) 2.40 (A76 L) 1.84 (A55) | Mali-G77 MP8 | 700 MHz (358.4 GFLOPS in FP32) | LPDDR4X-2133 | 64-bit(4x16-bit) Quad-channel | 34.1 | Galileo | Balong 5000 (Sub-6 GHz only; NSA & SA), 4G version available | — | — | Q2 2020 | List Honor 30Honor V6Huawei nova 7 5GHuawei nova 7 Pro 5GHuawei nova 8 5GHuawei nova 8 Pro 5G |

### Kirin 990 4G, Kirin 990 5G and Kirin 990E 5G

Kirin 990 5G is HiSilicon's first 5G SoC based on N7 nm+ FinFET technology.
* Interconnect
** Kirin 990 4G: ARM Mali-G76 MP16
** Kirin 990 5G: ARM Mali-G76 MP16
** Kirin 990E 5G: ARM Mali-G76 MP14
* Da Vinci NPU.
** Kirin 990 4G: 1x Da Vinci Lite + 1x Da Vinci Tiny
** Kirin 990 5G: 2x Da Vinci Lite + 1x Da Vinci Tiny
** Kirin 990E 5G: 1x Da Vinci Lite + 1x Da Vinci Tiny
* Da Vinci Lite features 3D Cube Tensor Computing Engine (2048 FP16 MACs + 4096 INT8 MACs), Vector unit (1024bit INT8/FP16/FP32)
* Da Vinci Tiny features 3D Cube Tensor Computing Engine (256 FP16 MACs + 512 INT8 MACs), Vector unit (256bit INT8/FP16/FP32)
| Model Number | Fab | CPU | CPU | CPU | CPU | GPU | GPU | Memory Technology | Memory Technology | Memory Technology | Nav | Wireless | Wireless | Wireless | Sampling availability | Devices using |
| Model Number | Fab | ISA | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Nav | Cellular | WLAN | PAN | Sampling availability | Devices using |
| Kirin 990 4G | TSMC 7 nm FinFET (DUV) | ARMv8.2-A | Cortex-A76 Cortex-A55 DynamIQ | (2+2)+4 | 2.86 (A76 H) 2.09 (A76 L) 1.86 (A55) | Mali-G76 MP16 | 600 MHz (460.8 GFLOPS in FP32) | LPDDR4X-2133 | 64-bit(4x16-bit) Quad-channel | 34.1 | Beidou, Galileo, GLONASS | Balong 765 (LTE Cat.19) | — | — | Q4 2019 | List Huawei Mate 30 Huawei Mate 30 Pro Huawei P40 4G Huawei Nova 6 Huawei Nova 6 5G Honor V30 Honor Play4 Pro Huawei MatePad Pro (WiFi/4G) (2019–2020) |
| Kirin 990 5G | TSMC 7 nm+ FinFET (EUV) | ARMv8.2-A | Cortex-A76 Cortex-A55 DynamIQ | (2+2)+4 | 2.86 (A76 H) 2.36 (A76 L) 1.95 (A55) | Mali-G76 MP16 | 600 MHz (460.8 GFLOPS in FP32) | LPDDR4X-2133 | 64-bit(4x16-bit) Quad-channel | 34.1 | Beidou, Galileo, GLONASS | Balong 5000 (Sub-6-GHz only; NSA & SA) | — | — | Q4 2019 | List Huawei Mate 30 5GHuawei Mate 30 Pro 5GHuawei Mate 30 RS Porche DesignHuawei P40Huawei P40 ProHuawei P40 Pro+Honor V30 ProHuawei MatePad Pro 5G (2020)Honor 30 ProHonor 30 Pro+ |
| Kirin 990E 5G | Mali-G76 MP14 | ARMv8.2-A | Cortex-A76 Cortex-A55 DynamIQ | (2+2)+4 | 2.86 (A76 H) 2.36 (A76 L) 1.95 (A55) | 600 MHz (403.2 GFLOPS in FP32) | — | LPDDR4X-2133 | 64-bit(4x16-bit) Quad-channel | 34.1 | Beidou, Galileo, GLONASS | Balong 5000 (Sub-6-GHz only; NSA & SA) | — | Q4 2020 | List Huawei Mate 30E Pro 5GHuawei Mate 40E (4G/5G) |

### Kirin 9000 5G/4G and Kirin 9000E, Kirin 9000L

Kirin 9000 is HiSilicon's first SoC based on 5 nm+ FinFET (EUV) TSMC technology (N5 node) and the first 5 nm SoC to be launched on the international market. This octa-core system on a chip is based on the 9th Gen of the HiSilicon Kirin series and is equipped with 15.3 billion transistors in a 1+3+4 core configuration: 4 Arm Cortex-A77 CPU (1x 3.13 GHz and 3x 2.54 GHz), 4 Arm Cortex-A55 (4x 2.05 GHz) and a 24-core Mali-G78 GPU (22-core in the Kirin 9000E version) The Kirin 9000L uses a 1+2+3 core configuration: 3 Arm Cortex-A77 (1x 3.13 GHz and 2x 2.54 GHz), 3 Arm Cortex-A55 (3x 2.05 GHz) and a 22-core Mali-G78 GPU with Kirin Gaming+ 3.0 implementation.
The integrated quad pipeline NPU (Dual Big Core + 1 Tiny Core configuration) is equipped with the Kirin ISP 6.0 to support advanced computational photography. The Huawei Da Vinci Architecture 2.0 for AI supports 2x Ascend Lite + 1x Ascend Tiny (only 1 Lite in 9000E/L). The system cache is 8 MB and the SoC works with the new LPDDR5/4X memories (made by Samsung in the Huawei Mate 40 series). Due to the integrated 3rd generation 5G proprietary modem "Balong 5000", Kirin 9000 supports 2G, 3G, 4G and 5G SA & NSA Sub-6 GHz connectivity. The SoC's TDP is 6W.
The 2021 4G version of the Kirin 9000 has the Balong modem limited via software to comply with the ban imposed on Huawei by the US government for non-chinese 5G technologies. The Kirin 9006C is a rebranded variant of the Kirin 9000E for the Huawei Qingyun L420 and L540 laptops.
* GPU
** Kirin 9000L: ARM Mali-G78 MP22
** Kirin 9000E: ARM Mali-G78 MP22
** Kirin 9000: ARM Mali-G78 MP24
* Da Vinci NPU architecture 2.0
** Kirin 9000L: 1x Big Core + 1x Tiny Core
** Kirin 9000E: 1x Big Core + 1x Tiny Core
** Kirin 9000: 2x Big Cores + 1x Tiny Core
| Model Number | Fab | CPU | CPU | CPU | CPU | GPU | GPU | Memory Technology | Memory Technology | Memory Technology | Nav | Wireless | Wireless | Wireless | Sampling availability | Devices using |
| Model Number | Fab | ISA | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Nav | Cellular | WLAN | PAN | Sampling availability | Devices using |
| Kirin 9000L | TSMC 5 nm+ FinFET (EUV) | ARMv8.2-A | Cortex-A77 Cortex-A55 DynamIQ | (1+2)+3 | 3.13 (A77 H) 2.54 (A77 L) 2.05 (A55) | Mali-G78 MP22 | 759 MHz (1068.7 GFLOPS in FP32) | LPDDR4X-2133 LPDDR5-2750 | 64-bit(4x16-bit) Quad-channel | 34.1 (LPDDR4X) 44 (LPDDR5) | Beidou, Galileo, GLONASS | Balong 5000 (Sub-6-GHz only; NSA & SA) | Wi-Fi 6 | | Q4 2020 | Huawei Mate 40E Pro |
| Kirin 9000E | TSMC 5 nm+ FinFET (EUV) | ARMv8.2-A | Cortex-A77 Cortex-A55 DynamIQ | (1+3)+4 | 3.13 (A77 H) 2.54 (A77 L) 2.05 (A55) | Mali-G78 MP22 | 759 MHz (1068.7 GFLOPS in FP32) | LPDDR4X-2133 LPDDR5-2750 | 64-bit(4x16-bit) Quad-channel | 34.1 (LPDDR4X) 44 (LPDDR5) | Beidou, Galileo, GLONASS | Balong 5000 (Sub-6-GHz only; NSA & SA), 4G version available | — | — | Q4 2020 | List Huawei Mate 40 Huawei MatePad Pro 12.6 |
| Kirin 9000 (Hi36A0V101) | TSMC 5 nm+ FinFET (EUV) | ARMv8.2-A | Cortex-A77 Cortex-A55 DynamIQ | (1+3)+4 | 3.13 (A77 H) 2.54 (A77 L) 2.05 (A55) | Mali-G78 MP24 | 759 MHz (1165.8 GFLOPS in FP32) | LPDDR4X-2133 LPDDR5-2750 | 64-bit(4x16-bit) Quad-channel | 34.1 (LPDDR4X) 44 (LPDDR5) | Beidou, Galileo, GLONASS | Balong 5000 (Sub-6-GHz only; NSA & SA), 4G version available | Wi-Fi 6 | | Q4 2020 | List Huawei Mate 40 ProHuawei Mate 40 Pro+Huawei Mate 40 RS Porsche DesignHuawei P50 ProHuawei Mate X2 |

### Kirin 9000S, Kirin 9010, Kirin 9020 series

The Kirin 9000S, Kirin 9000S1, and Kirin 9010 of the Kirin 9000 Hi36A0 family are the first HiSilicon-developed SoCs manufactured in high volumes in mainland China by SMIC. The SoC had its debut with the Huawei Mate 60 in late 2023 with the Kirin 9000S alongside overclocked enhancements of the Kirin 9000S1 and Kirin 9010 with the Huawei Pura 70 series in early 2024. According to Tom's Hardware, the Taishan V120 core, developed by HiSilicon, was roughly on par with AMD's Zen 3 cores from late 2020. Four of these cores were used in the 9000 series alongside four efficiency-focused Arm Cortex-A510 cores. The SoCs are based on SMIC's 7nm technology node, referred to as "N+2". It also includes 1 Da Vinci "big" NPU core and 1 Da Vinci "small" NPU core. Kirin 9000W, a Wi-Fi only SoC for the Huawei MatePad Pro 13.2 Wi-Fi only model, debuted in global markets in Q1 2024. The Kirin 9010 and Kirin 9000S1 debuted in Q2 2024, using a modified 2+6+4 core configuration with a new large Taishan core with the same configurations of medium and small cores from the Kirin 9000S with faster enhancements over the Kirin 9000S.
| Model Number | Fab | CPU | CPU | CPU | CPU | CPU | GPU | GPU | Memory Technology | Memory Technology | Memory Technology | Nav | Wireless | Wireless | Wireless | Sampling availability | Devices using |
| Model Number | Fab | ISA | Microarchitecture | Cores (Total) | Threads (Total) | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Nav | Cellular | WLAN | PAN | Sampling availability | Devices using |
| Kirin 9000S (Hi36A0V120) | SMIC 7 nm FinFET | ARMv8.x | HiSilicon Taishan microarchitecture, Cortex-A510 | 1+3+4 (8) | 2+6+4 (12) | 2.62 (TaishanV120) 2.15 (TaishanV120) 1.53 (Cortex-A510) | HiSilicon Maleoon 910 | 750 MHz | LPDDR5-6400 LPDDR5X-8533 | 64-bit (4x16-bit) Quad-channel | 51.2 (LPDDR5) 68.2 (LPDDR5X) | Beidou, Galileo, GLONASS | Balong 5000 5G 3GPP Rel. 15 (Sub-6-GHz) | Wi-Fi 6 (External Module) | Bluetooth 5.2, NearLink NFC | Q3 2023 | List Huawei Mate 60 Huawei Mate 60 Pro Huawei Mate 60 Pro+ Huawei Mate 60 RS Ultimate Design Huawei Mate X5 |
| Kirin 9000S1 (Hi36A0V120) | SMIC 7 nm FinFET | ARMv8.x | HiSilicon Taishan microarchitecture, Cortex-A510 | 1+3+4 (8) | 2+6+4 (12) | 2.49 (TaishanV120) 2.15 (TaishanV120) 1.53 (Cortex-A510) | HiSilicon Maleoon 910 | 750 MHz | LPDDR5-6400 LPDDR5X-8533 | 64-bit (4x16-bit) Quad-channel | 51.2 (LPDDR5) 68.2 (LPDDR5X) | Beidou, Galileo, GLONASS | Balong 5000 5G 3GPP Rel. 15 (Sub-6-GHz) | Wi-Fi 6 (External Module) | Bluetooth 5.2, NearLink NFC | Q1 2024 | Huawei Pura 70 |
| Kirin 9000W (Hi36A0V120) | SMIC 7 nm FinFET | ARMv8.x | HiSilicon Taishan microarchitecture, Cortex-A510 | 1+3+4 (8) | 2+6+4 (12) | 2.49 (TaishanV120) 2.15 (TaishanV120) 1.53 (Cortex-A510) | HiSilicon Maleoon 910 | 750 MHz | LPDDR5-6400 LPDDR5X-8533 | 64-bit (4x16-bit) Quad-channel | 51.2 (LPDDR5) 68.2 (LPDDR5X) | Beidou, Galileo, GLONASS | — | Wi-Fi 6 (External Module) | Bluetooth 5.2, NearLink NFC | Q4 2023 | List Huawei MatePad Pro 13.2 Huawei MatePad Air (2024) |
| Kirin 9000WL (Hi36A0V120) | SMIC 7 nm FinFET | ARMv8.x | HiSilicon Taishan microarchitecture, Cortex-A510 | 1+3+4 (8) | 2+6+4 (12) | 2.49 (TaishanV120) 2.15 (TaishanV120) 1.53 (Cortex-A510) | HiSilicon Maleoon 910 | 750 MHz | LPDDR5-6400 LPDDR5X-8533 | 64-bit (4x16-bit) Quad-channel | 51.2 (LPDDR5) 68.2 (LPDDR5X) | Beidou, Galileo, GLONASS | — | Wi-Fi 6 (External Module) | Bluetooth 5.2, NearLink NFC | Q2 2024 | Huawei MatePad 11.5 S PaperMatte Edition |
| Kirin 9000WE (Hi36A0V120) | SMIC 7 nm FinFET | ARMv8.x | HiSilicon Taishan microarchitecture, Cortex-A510 | 1+3+4 (8) | 2+6+4 (12) | 2.49 (TaishanV120) 2.15 (TaishanV120) 1.53 (Cortex-A510) | HiSilicon Maleoon 910 | 750 MHz | LPDDR5-6400 LPDDR5X-8533 | 64-bit (4x16-bit) Quad-channel | 51.2 (LPDDR5) 68.2 (LPDDR5X) | Beidou, Galileo, GLONASS | — | Wi-Fi 6 (External Module) | Bluetooth 5.2, NearLink NFC | Q2 2024 | Huawei MatePad 11.5 S (12GB RAM) |
| Kirin T90 (Hi36A0V120) | SMIC 7 nm FinFET | ARMv8.x | HiSilicon Taishan microarchitecture, Cortex-A510 | 1+3+4 (8) | 2+6+4 (12) | 2.49 (TaishanV120) 2.15 (TaishanV120) 1.53 (Cortex-A510) | HiSilicon Maleoon 910 | 750 MHz | LPDDR5-6400 LPDDR5X-8533 | 64-bit (4x16-bit) Quad-channel | 51.2 (LPDDR5) 68.2 (LPDDR5X) | Beidou, Galileo, GLONASS | — | Wi-Fi 6 (External Module) | Bluetooth 5.2, NearLink NFC | Q3 2024 | Huawei MatePad Air (2024) |
| Kirin T90A (Hi36A0V120) | SMIC 7 nm FinFET | ARMv8.x | HiSilicon Taishan microarchitecture, Cortex-A510 | 1+3+4 (8) | 2+6+4 (12) | 2.49 (TaishanV120) 2.15 (TaishanV120) 1.53 (Cortex-A510) | HiSilicon Maleoon 910 | 750 MHz | LPDDR5-6400 LPDDR5X-8533 | 64-bit (4x16-bit) Quad-channel | 51.2 (LPDDR5) 68.2 (LPDDR5X) | Beidou, Galileo, GLONASS | — | Wi-Fi 6 (External Module) | Bluetooth 5.2, NearLink NFC | Q3 2024 | Huawei MatePad 12 X |
| Kirin 9000SL (Hi36A0V120) | SMIC 7 nm FinFET | ARMv8.x | HiSilicon Taishan microarchitecture, Cortex-A510 | 1+2+3 (6) | 2+4+3 (9) | 2.35 (TaishanV120) 2.15 (TaishanV120) 1.53 (Cortex-A510) | HiSilicon Maleoon 910 | 750 MHz | LPDDR5-6400 LPDDR5X-8533 | 64-bit (4x16-bit) Quad-channel | 51.2 (LPDDR5) 68.2 (LPDDR5X) | Beidou, Galileo, GLONASS | Balong 5000 5G 3GPP Rel. 15 (Sub-6-GHz) | Wi-Fi 6 (External Module) | Bluetooth 5.2, NearLink NFC | Q4 2023 | Huawei Nova 12 Ultra |
| Kirin 9000WM (Hi36A0V120) | SMIC 7 nm FinFET | ARMv8.x | HiSilicon Taishan microarchitecture, Cortex-A510 | 1+2+3 (6) | 2+4+3 (9) | 2.35 (TaishanV120) 2.15 (TaishanV120) 1.53 (Cortex-A510) | HiSilicon Maleoon 910 | 750 MHz | LPDDR5-6400 LPDDR5X-8533 | 64-bit (4x16-bit) Quad-channel | 51.2 (LPDDR5) 68.2 (LPDDR5X) | Beidou, Galileo, GLONASS | — | Wi-Fi 6 (External Module) | Bluetooth 5.2, NearLink NFC | Q2 2024 | Huawei MatePad 11.5 S Smart Model |
| Kirin 9010 (Hi36A0V121) | SMIC 7 nm FinFET | ARMv8.x | HiSilicon Taishan microarchitecture, Cortex-A510 | 1+3+4 (8) | 2+6+4 (12) | 2.30 (TaishanV121) 2.18 (TaishanV120) 1.55 (Cortex-A510) | HiSilicon Maleoon 910 | 750 MHz | LPDDR5-6400 LPDDR5X-8533 | 64-bit (4x16-bit) Quad-channel | 51.2 (LPDDR5) 68.2 (LPDDR5X) | Beidou, Galileo, GLONASS | Balong 5000 5G 3GPP Rel. 15 (Sub-6-GHz) | Wi-Fi 6 (External Module) | Bluetooth 5.2, NearLink NFC | Q2 2024 | List Huawei Pura 70 Pro Huawei Pura 70 Pro+ Huawei Pura 70 Ultra Huawei Mate XT Ultimate Huawei Mate 70 |
| Kirin 9010E (Hi36A0V121) | SMIC 7 nm FinFET | ARMv8.x | HiSilicon Taishan microarchitecture, Cortex-A510 | 1+3+4 (8) | 2+6+4 (12) | 2.19 (TaishanV121) 2.18 (TaishanV120) 1.55 (Cortex-A510) | HiSilicon Maleoon 910 | 750 MHz | LPDDR5-6400 LPDDR5X-8533 | 64-bit (4x16-bit) Quad-channel | 51.2 (LPDDR5) 68.2 (LPDDR5X) | Beidou, Galileo, GLONASS | Balong 5000 5G 3GPP Rel. 15 (Sub-6-GHz) | Wi-Fi 6 (External Module) | Bluetooth 5.2, NearLink NFC | Q3 2024 | Huawei Nova Flip |
| Kirin 9010A (Hi36A0V121) | SMIC 7 nm FinFET | ARMv8.x | HiSilicon Taishan microarchitecture, Cortex-A510 | 1+3+4 (8) | 2+6+4 (12) | 2.19 (TaishanV121) 2.18 (TaishanV120) 1.55 (Cortex-A510) | HiSilicon Maleoon 910 | 750 MHz | LPDDR5-6400 LPDDR5X-8533 | 64-bit (4x16-bit) Quad-channel | 51.2 (LPDDR5) 68.2 (LPDDR5X) | Beidou, Galileo, GLONASS | | Wi-Fi 6 (External Module) | Bluetooth 5.2, NearLink NFC | Q3 2024 | |
| Kirin 9010W (Hi36A0V121) | SMIC 7 nm FinFET | ARMv8.x | HiSilicon Taishan microarchitecture, Cortex-A510 | 1+3+4 (8) | 2+6+4 (12) | 2.19 (TaishanV121) 2.18 (TaishanV120) 1.55 (Cortex-A510) | HiSilicon Maleoon 910 | 750 MHz | LPDDR5-6400 LPDDR5X-8533 | 64-bit (4x16-bit) Quad-channel | 51.2 (LPDDR5) 68.2 (LPDDR5X) | Beidou, Galileo, GLONASS | — | Wi-Fi 6 (External Module) | Bluetooth 5.2, NearLink NFC | Q3 2024 | |
| Kirin T91 (Hi36A0V121) | SMIC 7 nm FinFET | ARMv8.x | HiSilicon Taishan microarchitecture, Cortex-A510 | 1+3+4 (8) | 2+6+4 (12) | 2.19 (TaishanV121) 2.18 (TaishanV120) 1.55 (Cortex-A510) | HiSilicon Maleoon 910 | 750 MHz | LPDDR5-6400 LPDDR5X-8533 | 64-bit (4x16-bit) Quad-channel | 51.2 (LPDDR5) 68.2 (LPDDR5X) | Beidou, Galileo, GLONASS | — | Wi-Fi 6 (External Module) | Bluetooth 5.2, NearLink NFC | Q3 2024 | Huawei MatePad Pro 12.2 (2024) |
| Kirin 9010L (Hi36A0V121) | SMIC 7 nm FinFET | ARMv8.x | HiSilicon Taishan microarchitecture, Cortex-A510 | 1+2+3 (6) | 2+4+3 (9) | 2.19 (TaishanV121) 2.18 (TaishanV120) 1.40 (Cortex-A510) | HiSilicon Maleoon 910 | 750 MHz | LPDDR5-6400 LPDDR5X-8533 | 64-bit (4x16-bit) Quad-channel | 51.2 (LPDDR5) 68.2 (LPDDR5X) | Beidou, Galileo, GLONASS | Balong 5000 5G 3GPP Rel. 15 (Sub-6-GHz) | Wi-Fi 6 (External Module) | Bluetooth 5.2, NearLink NFC | Q2 2024 | Huawei Nova 12 Ultra Star Edition |
| Kirin 9020 (Hi36C0V110) | SMIC 7 nm FinFET | ARMv8.x | HiSilicon Taishan microarchitecture, Cortex-A510 | 1+3+4 (8) | 2+6+4 (12) | 2.50 (TaishanV121) 2.15 (TaishanV120) 1.60 (Taishan-Little) | HiSilicon Maleoon 920 | 840 MHz | LPDDR5-6400 LPDDR5X-8533 | 64-bit (4x16-bit) Quad-channel | 51.2 (LPDDR5) 68.2 (LPDDR5X) | Beidou, Galileo, GLONASS | Balong 6000 5G 3GPP Rel. 17 (Sub-6-GHz) | Wi-Fi 6 (External Module) | Bluetooth 5.2, NearLink NFC | Q4 2024 | List Huawei Mate 70 Pro Huawei Mate 70 Pro+ |
| Kirin T92 (Hi36C0V110) | SMIC 7 nm FinFET | ARMv8.x | HiSilicon Taishan microarchitecture, Cortex-A510 | 1+3+4 (8) | 2+6+4 (12) | 2.50 (TaishanV121) 2.15 (TaishanV120) 1.60 (Taishan-Little) | HiSilicon Maleoon 920 | 840 MHz | LPDDR5-6400 LPDDR5X-8533 | 64-bit (4x16-bit) Quad-channel | 51.2 (LPDDR5) 68.2 (LPDDR5X) | Beidou, Galileo, GLONASS | — | Wi-Fi 6 (External Module) | Bluetooth 5.2, NearLink NFC | Q4 2024 | Huawei MatePad Pro 13.2 (2025) |

## Smartphone modems

HiSilicon develops smartphone modems which are primarily used in its parent company Huawei's handheld and tablet devices.

### Balong 700

The Balong 700 supports LTE TDD/FDD. Its specs:
* 3GPP R8 protocol
* LTE TDD and FDD
* 4x2/2x2 SU-MIMO

### Balong 710

At MWC 2012, HiSilicon released the Balong 710. It is a multi-mode chipset supporting 3GPP Release 9 and LTE Category 4 at GTI (Global TD-LTE Initiative). The Balong 710 was designed to be used with the K3V2 SoC. Its specs:
* LTE FDD mode : 150 Mbit/s downlink and 50 Mbit/s uplink.
* TD-LTE mode: up to 112 Mbit/s downlink and up to 30 Mbit/s uplink.
* WCDMA Dual Carrier with MIMO: 84 Mbit/s downlink and 23 Mbit/s uplink.

### Balong 720

The Balong 720 supports LTE Cat6 with 300 Mbit/s peak download rate. Its specs:
* TSMC 28 nm HPM process
* TD-LTE Cat.6 standard
* Dual-carrier aggregation for the 40 MHz bandwidth
* 5-mode LTE Cat6 Modem

### Balong 750

The Balong 750 supports LTE Cat 12/13, and it is first to support 4CC CA and 3.5 GHz. Its specs:
* LTE Cat.12 and Cat.13 UL network standards
* 2CC (dual-carrier) data aggregation
* 4x4 multiple-input multiple-output (MIMO)
* TSMC 16 nm FinFET+ process

### Balong 765

The Balong 765 supports 8×8 MIMO technology, LTE Cat.19 with downlink data-rate up to 1.6 Gbit/s in FDD network and up to 1.16 Gbit/s in the TD-LTE network. Its specs:
* 3GPP Rel.14
* LTE Cat.19 Peak data rate up to 1.6 Gbit/s
* 4CC CA + 4×4 MIMO/2CC CA + 8×8 MIMO
* DL 256QAM
* C-V2X

### Balong 5G01

The Balong 5G01 supports the 3GPP standard for 5G with downlink speeds of up to 2.3 Gbit/s. It supports 5G across all frequency bands including sub-6 GHz and millimeter wave (mmWave). Its specs:
* 3GPP Release 15
* Peak data rate up to 2.3 Gbit/s
* Sub-6 GHz and mmWave
* NSA/SA
* DL 256QAM

### Balong 5000

The Balong 5000 is the world's first 7 nm TSMC 5G multi-mode chipset (launched in Q1 2019), the world's first SA/NSA implementation, and the first smartphone chipset to support the full NR TDD/FDD spectrum. The modem has an advanced 2G, 3G, 4G, and 5G connectivity. Its specs:
* 2G/3G/4G/5G Multi Mode
* Fully compliant with 3GPP Release 15
* Sub-6 GHz: 100 MHz x 2CC CA
* Sub-6 GHz: Downlink up to 4.6 Gbit/s, Uplink up to 2.5 Gbit/s
* mmWave: Downlink up to 6.5 Gbit/s, Uplink up to 3.5 Gbit/s
* NR+LTE: Downlink up to 7.5 Gbit/s
* FDD & TDD Spectrum Access
* SA & NSA Fusion Network Architecture
* Supports 3GPP R14 V2X
* 3 GB LPDDR4X RAM

### Balong 6000

The Balong 6000 is an iteration of the HiSilicon Balong 5G baseband series and first appeared in the Huawei Mate 70 Pro, launched on November 26, 2024.
It‘s one of the first 3GPP Rel. 18 and therefore 5.5G/5G-Advanced supporting modem in the world alongside the Qualcomm Snapdragon X75/X80 and onwards series.
* 2G/3G/4G/5G Multi Mode
* Fully compliant with 3GPP Release 17, probably compliant with 3GPP Release 18
* Sub-6 GHz: 100 MHz x 4CC CA
* Sub-6 GHz: Downlink up to 4.6 Gbit/s, Uplink up to 2.5 Gbit/s
* mmWave: Downlink up to 12 Gbit/s, Uplink up to 3.5 Gbit/s
* NR+LTE: Downlink up to 10 Gbit/s
* FDD & TDD Spectrum Access
* SA & NSA Fusion Network Architecture

## Wearable SoCs

HiSilicon develops SoCs for wearables such as wireless earbuds, wireless headphones, neckband earbuds, smart speakers, smart eyewear, and smartwatches.

### Kirin A1

The Kirin A1 (Hi1132) was announced on 6 September 2019. It features:
* BT/BLE dual-mode Bluetooth 5.1
* Isochronous Dual Channel transmission technology
* 356 MHz audio processor
* Cortex-M7 microprocessor

### Kirin A2

The Kirin A2 was announced on September 25, 2023. It features:
* Faster Transmission
* Stable signal with Polar code technology
* Increase of 50% in computing power performance
* Audio Vivid

## Server processors

HiSilicon develops server processor SoCs based on the ARM architecture.

### Hi1610

The Hi1610 is HiSilicon's first generation server processor announced in 2015. It features:
* 16x ARM Cortex-A57 at up to 2.1 GHz
* 48 KB L1-I, 32 KB L1-D, 1 MB L2/4 cores and 16 MB CCN L3
* TSMC 16 nm
* 2x DDR4-1866
* 16 PCIe 3.0

### Hi1612

The Hi1612 is HiSilicon's second generation server processor launched in 2016. It is the first chiplet-based Kunpeng with two computing dies. It features:
* 32x ARM Cortex-A57 at up to 2.1 GHz
* 48 KB L1-I, 32 KB L1-D, 1 MB L2/4 cores and 32 MB CCN L3
* TSMC 16 nm
* 4x DDR4-2133
* 16 PCIe 3.0

### Kunpeng 916 (formerly Hi1616)

The Kunpeng 916 (formerly known as Hi1616) is HiSilicon's third generation server processor launched in 2017. The Kunpeng 916 is used in Huawei's TaiShan 2280 Balanced Server, TaiShan 5280 Storage Server, TaiShan XR320 High-Density Server Node and TaiShan X6000 High-Density Server. It features:
* 32x ARM Cortex-A72 at up to 2.4 GHz
* 48 KB L1-I, 32 KB L1-D, 1 MB L2/4 cores and 32 MB CCN L3
* TSMC 16 nm
* 4x DDR4-2400
* 2-way Symmetric multiprocessing (SMP), Each socket has 2x ports with 96 Gbit/s per port (total of 192 Gbit/s per each socket interconnects)
* 46 PCIe 3.0 and 8x 10 Gigabit Ethernet
* 85 W

### Kunpeng 920 (formerly Hi1620)

The Kunpeng 920 (formerly known as Hi1620) is HiSilicon's fourth generation server processor announced in 2018, and launched in 2019. Huawei claims the Kunpeng 920 CPU scores more than an estimated 930 on SPECint_rate_base2006. The Kunpeng 920 is used in Huawei's TaiShan 2280 V2 Balanced Server, TaiShan 5280 V2 Storage Server, and TaiShan XA320 V2 High-Density Server Node. It features:
* 32 to 64x custom TaiShan V110 cores at up to 2.6 GHz.
* The TaiShan V110 core is a 4-way superscalar, out-of-order microarchitecture that implements the ARMv8.2-A ISA. Huawei reports the core supports almost all the ARMv8.4-A ISA features with a few exceptions, including the dot product and FP16 FML extensions.
* The TaiShan V110 cores are likely a new core not based on ARM designs
* 3x Simple ALUs, 1x Complex MDU, 2x BRUs (sharing ports with ALU2/3), 2x FSUs (ASIMD FPU), 2x LSUs
* 64 KB L1-I, 64 KB L1-D, 512 KB Private L2 and 1 MB L3/core Shared.
* TSMC 7 nm HPC
* 8x DDR4-3200
* 2-way and 4-way symmetric multiprocessing (SMP). Each socket has 3x Hydra ports with 240 Gbit/s per port (total of 720 Gbit/s per each socket interconnects)
* 40 PCIe 4.0 with CCIX support, 4x USB 3.0, 2x SATA 3.0, 8x SAS 3.0 and 2x 100 gigabit ethernet
* 100 to 200 W
* Compression engine (GZIP, LZS, LZ4) capable of up to 40 Git/s compress and 100 Gbit/s decompress
* Crypto offload engine (for AES, DES, 3DES, SHA1/2, etc..) capable of throughputs up to 100 Gbit/s

### Kunpeng 930 (formerly Hi1630)

The Kunpeng 930 (formerly known as Hi1630) is HiSilicon's fifth-generation server processor announced in 2019 and scheduled for launch in 2021. It features:
* 80 custom TaishanV120 cores at 3 GHz frequency, with support for simultaneous multithreading (SMT) and ARM's Scalable Vector Extension (SVE).
* 64 KB L1-I, 64 KB L1-D, 512 KB Private L2 and 1 MB L3/core Shared
* TSMC 5 nm
* 8x DDR5

### Kunpeng 950

The Kunpeng 950 is HiSilicon's sixth-generation server processor announced in 2019 and scheduled for launch in 2023.

## AI acceleration

HiSilicon also develops AI Acceleration chips.

### Da Vinci architecture

Each Da Vinci Max AI Core features a 3D Cube Tensor Computing Engine (4096 FP16 MACs + 8192 INT8 MACs), a vector unit (2048bit INT8/FP16/FP32), and a scalar unit. It includes a new AI framework called "MindSpore", a platform-as-a-service product called ModelArts, and a lower-level library called Compute Architecture for Neural Networks (CANN).

#### Ascend 310

The Ascend 310 is an AI inference SoC, it was codenamed Ascend-Mini. The Ascend 310 is capable of 16 TOPS@INT8 and 8 TOPS@FP16. The Ascend 310 features:
* 2x Da Vinci Max AI cores
* 8x ARM Cortex-A55 CPU cores
* 8 MB on-chip buffer
* 16 channel video decode – H.264/H.265
* 1 channel video encode – H.264/H.265
* TSMC 12 nm FFC process
* 8W TDP

#### Ascend 910

The Ascend 910 is an AI training SoC, it was codenamed Ascend-Max. which delivers 256 TFLOPS@FP16 and 512 TOPS@INT8. The Ascend 910 features:
* 32x Da Vinci Max AI cores arranged in 4 clusters
* 1024-bit NoC Mesh @ 2 GHz, with 128 GB/s bandwidth Read/Write per core
* 3x 240 Gbit/s HCCS ports for Numa connections
* 2x 100 Gbit/s RoCE interfaces for networking
* 4x HBM2E, 1.2 TB/s bandwidth
* 3D-SRAM stacked below AI SoC die
* 1228 mm$^2$ Total die size (456 mm$^2$ Virtuvian AI SoC, 168 mm$^2$ Nimbus V3 IO Die, 4x96 mm$^2$ HBM2E, 2x110 mm$^2$ Dummy Die)
* 32 MB on-chip buffer
* 128 channel video decode – H.264/H.265
* TSMC 7 nm EUV (N7+) process
* 350 W