# List of AMD Ryzen processors

The Ryzen family is an x86-64 microprocessor family from AMD, based on the Zen microarchitecture. The Ryzen lineup includes Ryzen 3, Ryzen 5, Ryzen 7, Ryzen 9, and Ryzen Threadripper with up to 96 cores. All consumer desktop Ryzens (except PRO models) and all mobile processors with the HX suffix have an unlocked multiplier. In addition, all support Simultaneous Multithreading (SMT) except earlier Zen/Zen+ based desktop and mobile Ryzen 3, and some models of Zen 2 based mobile Ryzen.

## Desktop processors
### Ryzen 1000 series
#### Summit Ridge (1000 series, Zen based)

Common features of Ryzen 1000 desktop CPUs:
* Socket: AM4.
* All the CPUs support DDR4-2666 in dual-channel mode.
* All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
* No integrated graphics.
* L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
* L2 cache: 512 KB per core.
* Node/fabrication process: GlobalFoundries 14 LP.
| Branding and Model | Branding and Model | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | TDP | Core config | Release date | Launch price |
| Branding and Model | Branding and Model | Cores (threads) | Base | PBO 1–2 (≥3) | XFR 1–2 | L3 cache (total) | TDP | Core config | Release date | Launch price |
| Ryzen 7 | 1800X | 8 (16) | 3.6 | 4.0 (3.7) | 4.1 | 16 MB | 95 W | 2 × 4 | March 2, 2017 | US $499 |
| Ryzen 7 | PRO 1700X | 8 (16) | 3.4 | 3.8 (3.5) | 3.9 | 16 MB | 95 W | 2 × 4 | June 29, 2017 | OEM |
| Ryzen 7 | 1700X | 8 (16) | 3.4 | 3.8 (3.5) | 3.9 | 16 MB | 95 W | 2 × 4 | March 2, 2017 | US $399 |
| Ryzen 7 | PRO 1700 | 8 (16) | 3.0 | 3.7 (3.2) | 3.75 | 16 MB | 65 W | 2 × 4 | June 29, 2017 | OEM |
| Ryzen 7 | 1700 | 8 (16) | 3.0 | 3.7 (3.2) | 3.75 | 16 MB | 65 W | 2 × 4 | March 2, 2017 | US $329 |
| Ryzen 5 | 1600X | 6 (12) | 3.6 | 4.0 (3.7) | 4.1 | 16 MB | 95 W | 2 × 3 | April 11, 2017 | US $249 |
| Ryzen 5 | PRO 1600 | 6 (12) | 3.2 | 3.6 (3.4) | 3.7 | 16 MB | 65 W | 2 × 3 | June 29, 2017 | OEM |
| Ryzen 5 | 1600 | 6 (12) | 3.2 | 3.6 (3.4) | 3.7 | 16 MB | 65 W | 2 × 3 | April 11, 2017 | US $219 |
| Ryzen 5 | 1500X | 4 (8) | 3.5 | 3.7 (3.6) | 3.9 | 16 MB | 65 W | 2 × 2 | April 11, 2017 | US $189 |
| Ryzen 5 | PRO 1500 | 4 (8) | 3.5 | 3.7 (3.6) | 3.9 | 16 MB | 65 W | 2 × 2 | June 29, 2017 | OEM |
| Ryzen 5 | 1400 | 4 (8) | 3.2 | 3.4 (3.4) | 3.45 | 8 MB | 65 W | 2 × 2 | April 11, 2017 | US $169 |
| Ryzen 3 | 1300X | 4 (4) | 3.5 | 3.7 (3.5) | 3.9 | 8 MB | 65 W | 2 × 2 | July 27, 2017 | US $129 |
| Ryzen 3 | PRO 1300 | 4 (4) | 3.5 | 3.7 (3.5) | 3.9 | 8 MB | 65 W | 2 × 2 | June 29, 2017 | OEM |
| Ryzen 3 | PRO 1200 | 4 (4) | 3.1 | 3.4 (3.1) | 3.45 | 8 MB | 65 W | 2 × 2 | June 29, 2017 | OEM |
| Ryzen 3 | 1200 | 4 (4) | 3.1 | 3.4 (3.1) | 3.45 | 8 MB | 65 W | 2 × 2 | July 27, 2017 | US $109 |
* v
* t
* e
* ↑ Manufacturer suggested retail price at launch
* ↑ Core Complexes (CCX) × cores per CCX

#### Whitehaven (Threadripper 1000 series, Zen based)

Common features of Ryzen 1000 HEDT CPUs:
* Socket: TR4.
* All the CPUs support DDR4-2666 in quad-channel mode.
* All the CPUs support 64 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
* No integrated graphics.
* L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
* L2 cache: 512 KB per core.
* Node/fabrication process: GlobalFoundries 14LP.
| Branding and Model | Branding and Model | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | TDP | Chiplets | Core config | Release date | Launch price |
| Branding and Model | Branding and Model | Cores (threads) | Base | PBO 1–4 (≥5) | XFR 1–2 | L3 cache (total) | TDP | Chiplets | Core config | Release date | Launch price |
| Ryzen Threadripper | 1950X | 16 (32) | 3.4 | 4.0 (3.7) | 4.2 | 32 MB | 180 W | 2 × CCD | 4 × 4 | August 10, 2017 | US $999 |
| Ryzen Threadripper | 1920X | 12 (24) | 3.5 | 4.0 (3.7) | 4.2 | 32 MB | 180 W | 2 × CCD | 4 × 3 | August 10, 2017 | US $799 |
| Ryzen Threadripper | 1900X | 8 (16) | 3.8 | 4.0 (3.9) | 4.2 | 16 MB | 180 W | 2 × CCD | 2 × 4 | August 31, 2017 | US $549 |
* v
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* e
* ↑ Manufacturer suggested retail price at launch
* ↑ Core Complexes (CCX) × cores per CCX
* ↑ Processor package actually contains two additional inactive dies to provide structural support to the integrated heat spreader.

### Ryzen 2000 series
#### Raven Ridge (2000 series with Radeon Graphics, Zen/GCN5 based)

Common features of Ryzen 2000 desktop APUs:
* Socket: AM4.
* All the CPUs support DDR4-2933 in dual-channel mode.
* All the CPUs support 16 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
* Includes integrated GCN 5th generation GPU.
* L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
* L2 cache: 512 KB per core.
* Fabrication process: GlobalFoundries 14LP.
| Branding and Model | Branding and Model | CPU | CPU | CPU | CPU | GPU | GPU | GPU | GPU | TDP | Release date | Launch price |
| Branding and Model | Branding and Model | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | Model | Clock (GHz) | Config | Processing power (GFLOPS) | TDP | Release date | Launch price |
| Branding and Model | Branding and Model | Cores (threads) | Base | Boost | L3 cache (total) | Model | Clock (GHz) | Config | Processing power (GFLOPS) | TDP | Release date | Launch price |
| Ryzen 5 | 2400G | 4 (8) | 3.6 | 3.9 | 4 MB | RX Vega 11 | 1.25 | 704:44:16 11 CU | 1760 | 46–65 W | February 12, 2018 | US $169 |
| Ryzen 5 | 2400GE | 4 (8) | 3.2 | 3.8 | 4 MB | RX Vega 11 | 1.25 | 704:44:16 11 CU | 1760 | 35 W | April 19, 2018 | OEM |
| Ryzen 3 | 2200G | 4 (4) | 3.5 | 3.7 | 4 MB | Vega 8 | 1.1 | 512:32:16 8 CU | 1126 | 46–65 W | February 12, 2018 | US $99 |
| Ryzen 3 | 2200GE | 4 (4) | 3.2 | 3.6 | 4 MB | Vega 8 | 1.1 | 512:32:16 8 CU | 1126 | 35 W | April 19, 2018 | OEM |
| Ryzen 3 | PRO 2100GE | 2 (4) | 3.2 | — | 4 MB | Vega 3 | 1.0 | 192:12:4 3 CU | 384 | 35 W | 2019 | OEM |
* v
* t
* e
* ↑ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
* ↑ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
* ↑ Manufacturer suggested retail price at launch
* 1 2 3 4 Model also available as PRO version; 2200GE, 2200G, 2400GE, 2400G, released on May 14, 2018 for OEM only.

#### Pinnacle Ridge (2000 series, Zen+ based)

Common features of Ryzen 2000 desktop CPUs:
* Socket: AM4.
* All the CPUs support DDR4-2933 in dual-channel mode, except for R7 2700E, R5 2600E, R5 1600AF and R3 1200AF which support it at DDR4-2666 speeds.
* All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
* No integrated graphics.
* L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
* L2 cache: 512 KB per core.
* Fabrication process: GlobalFoundries 12LP (14LP+).
| Branding and Model | Branding and Model | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | TDP | Core config | Release date | Launch price |
| Branding and Model | Branding and Model | Cores (threads) | Base | PB2 | L3 cache (total) | TDP | Core config | Release date | Launch price |
| Ryzen 7 | 2700X | 8 (16) | 3.7 | 4.3 | 16 MB | 105 W | 2 × 4 | April 19, 2018 | US $329 |
| Ryzen 7 | 2700 | 8 (16) | 3.2 | 4.1 | 16 MB | 65 W | 2 × 4 | April 19, 2018 | US $299 |
| Ryzen 7 | 2700E | 8 (16) | 2.8 | 4.0 | 16 MB | 45 W | 2 × 4 | September 19, 2018 | OEM |
| Ryzen 5 | 2600X | 6 (12) | 3.6 | 4.2 | 16 MB | 95 W | 2 × 3 | April 19, 2018 | US $229 |
| Ryzen 5 | 2600 | 6 (12) | 3.4 | 3.9 | 16 MB | 65 W | 2 × 3 | April 19, 2018 | US $199 |
| Ryzen 5 | 2600E | 6 (12) | 3.1 | 4.0 | 16 MB | 45 W | 2 × 3 | September 19, 2018 | OEM |
| Ryzen 5 | 1600 (AF) | 6 (12) | 3.2 | 3.6 | 16 MB | 65 W | 2 × 3 | October 11, 2019 | US $85 |
| Ryzen 5 | 2500X | 4 (8) | 3.6 | 4.0 | 8 MB | 65 W | 1 × 4 | September 10, 2018 | OEM |
| Ryzen 3 | 2300X | 4 (4) | 3.5 | 4.0 | 8 MB | 65 W | 1 × 4 | September 10, 2018 | OEM |
| Ryzen 3 | 1200 (AF) | 4 (4) | 3.1 | 3.4 | 8 MB | 65 W | 1 × 4 | April 21, 2020 | US $60 |
* v
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* e
* ↑ Core Complexes (CCX) × cores per CCX
* ↑ Manufacturer suggested retail price at launch
* 1 2 3 Model also available as PRO version as 2600, 2700, 2700X, released on September 19, 2018.
* 1 2 AF models are 12 nm Zen+ refresh of 14 nm Zen models (1200 and 1600 with "AF" instead of "AE" in the part numbers).

#### Colfax (Threadripper 2000 series, Zen+ based)

Common features of Ryzen 2000 HEDT CPUs:
* Socket: TR4.
* All the CPUs support DDR4-2933 in quad-channel mode.
* All the CPUs support 64 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
* No integrated graphics.
* L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
* L2 cache: 512 KB per core.
* Fabrication process: GlobalFoundries 12LP (14LP+).
| Branding and Model | Branding and Model | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | TDP | Chiplets | Core config | Release date | Launch price |
| Branding and Model | Branding and Model | Cores (threads) | Base | PB2 | L3 cache (total) | TDP | Chiplets | Core config | Release date | Launch price |
| Ryzen Threadripper | 2990WX | 32 (64) | 3.0 | 4.2 | 64 MB | 250 W | 4 × CCD | 8 × 4 | Aug 13, 2018 | US $1799 |
| Ryzen Threadripper | 2970WX | 24 (48) | 3.0 | 4.2 | 64 MB | 250 W | 4 × CCD | 8 × 3 | Oct 2018 | US $1299 |
| Ryzen Threadripper | 2950X | 16 (32) | 3.5 | 4.4 | 32 MB | 180 W | 2 × CCD | 4 × 4 | Aug 31, 2018 | US $899 |
| Ryzen Threadripper | 2920X | 12 (24) | 3.5 | 4.3 | 32 MB | 180 W | 2 × CCD | 4 × 3 | Oct 2018 | US $649 |
* v
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* ↑ Manufacturer suggested retail price at launch
* ↑ Core Complexes (CCX) × cores per CCX

### Ryzen 3000 series
#### Picasso (3000 series with Radeon Graphics, Zen+/GCN5 based)

Common features of Ryzen 3000 desktop APUs:
* Socket: AM4.
* All the CPUs support DDR4-2933 in dual-channel mode.
* L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
* L2 cache: 512 KB per core.
* All the CPUs support 16 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
* Includes integrated GCN 5th generation GPU.
* Fabrication process: GlobalFoundries 12LP (14LP+).
| Branding and Model | Branding and Model | CPU | CPU | CPU | CPU | GPU | GPU | GPU | GPU | TDP | Release date | MSRP |
| Branding and Model | Branding and Model | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | Model | Clock (GHz) | Config | Processing power (GFLOPS) | TDP | Release date | MSRP |
| Branding and Model | Branding and Model | Cores (threads) | Base | Boost | L3 cache (total) | Model | Clock (GHz) | Config | Processing power (GFLOPS) | TDP | Release date | MSRP |
| Ryzen 5 | PRO 3400G | 4 (8) | 3.7 | 4.2 | 4 MB | Radeon RX Vega 11 | 1.4 | 704:44:8 11 CU | 1971.2 | 65 W | Sep 30, 2019 | OEM |
| Ryzen 5 | 3400G | 4 (8) | 3.7 | 4.2 | 4 MB | Radeon RX Vega 11 | 1.4 | 704:44:8 11 CU | 1971.2 | 65 W | Jul 7, 2019 | US $149 |
| Ryzen 5 | PRO 3400GE | 4 (8) | 3.3 | 4.0 | 4 MB | Radeon RX Vega 11 | 1.3 | 704:44:8 11 CU | 1830.4 | 35 W | Sep 30, 2019 | OEM |
| Ryzen 5 | PRO 3350G | 4 (8) | 3.6 | 4.0 | 4 MB | Radeon Vega 10 | 1.3 | 640:40:8 10 CU | 1664 | 65 W | Jul 21, 2020 | OEM |
| Ryzen 5 | PRO 3350GE | 4 (4) | 3.3 | 3.9 | 4 MB | Radeon Vega 10 | 1.2 | 640:40:8 10 CU | 1536 | 35 W | Jul 21, 2020 | OEM |
| Ryzen 3 | PRO 3200G | 4 (4) | 3.6 | 4.0 | 4 MB | Radeon Vega 8 | 1.25 | 512:32:8 8 CU | 1280 | 65 W | Sep 30, 2019 | OEM |
| Ryzen 3 | 3200G | 4 (4) | 3.6 | 4.0 | 4 MB | Radeon Vega 8 | 1.25 | 512:32:8 8 CU | 1280 | 65 W | Jul 7, 2019 | US $99 |
| Ryzen 3 | 3200GE | 4 (4) | 3.3 | 3.8 | 4 MB | Radeon Vega 8 | 1.2 | 512:32:8 8 CU | 1228.8 | 35 W | Jul 7, 2019 | OEM |
| Ryzen 3 | PRO 3200GE | 4 (4) | 3.3 | 3.8 | 4 MB | Radeon Vega 8 | 1.2 | 512:32:8 8 CU | 1228.8 | 35 W | Sep 30, 2019 | OEM |
* v
* t
* e
* ↑ Unified shaders : Texture mapping units : Render output units and Compute units (CU)
* ↑ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

#### Matisse (3000 series, Zen 2 based)

Common features of Ryzen 3000 desktop CPUs:
* Socket: AM4.
* All the CPUs support DDR4-3200 in dual-channel mode.
* L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
* L2 cache: 512 KB per core.
* All the CPUs support 24 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset.
* No integrated graphics.
* Fabrication process: TSMC 7FF.
| Branding and Model | Branding and Model | Cores (threads) | Thermal Solution | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | TDP | Chiplets | Core config | Release date | MSRP |
| Branding and Model | Branding and Model | Cores (threads) | Thermal Solution | Base | Boost | L3 cache (total) | TDP | Chiplets | Core config | Release date | MSRP |
| Ryzen 9 | 3950X | 16 (32) | N/A | 3.5 | 4.7 | 64 MB | 105 W | 2 × CCD 1 × I/OD | 4 × 4 | Nov 25, 2019 | US $749 |
| Ryzen 9 | 3900XT | 12 (24) | N/A | 3.8 | 4.7 | 64 MB | 105 W | 2 × CCD 1 × I/OD | 4 × 3 | Jul 7, 2020 | US $499 |
| Ryzen 9 | 3900X | 12 (24) | Wraith Prism | 3.8 | 4.6 | 64 MB | 105 W | 2 × CCD 1 × I/OD | 4 × 3 | Jul 7, 2019 | US $499 |
| Ryzen 9 | 3900 | 12 (24) | OEM | 3.1 | 4.3 | 64 MB | 65 W | 2 × CCD 1 × I/OD | 4 × 3 | Oct 8, 2019 | OEM |
| Ryzen 7 | 3800XT | 8 (16) | N/A | 3.9 | 4.7 | 32 MB | 105 W | 1 × CCD 1 × I/OD | 2 × 4 | Jul 7, 2020 | US $399 |
| Ryzen 7 | 3800X | 8 (16) | Wraith Prism | 3.9 | 4.5 | 32 MB | 105 W | 1 × CCD 1 × I/OD | 2 × 4 | Jul 7, 2019 | US $399 |
| Ryzen 7 | 3700X | 8 (16) | Wraith Prism | 3.6 | 4.4 | 32 MB | 065 W | 1 × CCD 1 × I/OD | 2 × 4 | Jul 7, 2019 | US $329 |
| Ryzen 5 | 3600XT | 6 (12) | N/A | 3.8 | 4.5 | 32 MB | 95 W | 1 × CCD 1 × I/OD | 2 × 3 | Jul 7, 2020 | US $249 |
| Ryzen 5 | 3600X | 6 (12) | Wraith Spire (non-LED) | 3.8 | 4.4 | 32 MB | 95 W | 1 × CCD 1 × I/OD | 2 × 3 | Jul 7, 2019 | US $249 |
| Ryzen 5 | 3600 | 6 (12) | Wraith Stealth | 3.6 | 4.2 | 32 MB | 65 W | 1 × CCD 1 × I/OD | 2 × 3 | Jul 7, 2019 | US $199 |
| Ryzen 5 | 3500X | 6 (6) | Wraith Stealth | 3.6 | 4.1 | 32 MB | 65 W | 1 × CCD 1 × I/OD | 2 × 3 | Oct 8, 2019 | China ¥1099 |
| Ryzen 5 | 3500 | 6 (6) | OEM | 3.6 | 4.1 | 16 MB | 65 W | 1 × CCD 1 × I/OD | 2 × 3 | Nov 15, 2019 | OEM (West) Japan ¥16000 |
| Ryzen 3 | 3300X | 4 (8) | Wraith Stealth | 3.8 | 4.3 | 16 MB | 65 W | 1 × CCD 1 × I/OD | 1 × 4 | Apr 21, 2020 | US $119 |
| Ryzen 3 | 3100 | 4 (8) | Wraith Stealth | 3.6 | 3.9 | 16 MB | 65 W | 1 × CCD 1 × I/OD | 2 × 2 | Apr 21, 2020 | US $99 |
* v
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* ↑ A Core Complex Die contain 1-2 Core Complexes (CCXs).
* ↑ Core Complexes (CCXs) × cores per CCX
* ↑ Ryzen 9 3900X and Ryzen 9 3950X may consume over 145 W under load.
* ↑ Ryzen 7 3700X may consume 90 W under load.
* 1 2 3 Model also available as PRO 3600, PRO 3700, PRO 3900, released on September 30, 2019 for OEMs.

#### Castle Peak (Threadripper 3000 series, Zen 2 based)

Common features of Ryzen 3000 HEDT/workstation CPUs:
* Socket: sTRX4 (Threadripper), sWRX8 (Threadripper PRO).
* Threadripper CPUs support DDR4-3200 in quad-channel mode while Threadripper PRO CPUs support DDR4-3200 in octa-channel mode.
* L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
* L2 cache: 512 KB per core.
* Threadripper CPUs support 64 PCIe 4.0 lanes while Threadripper PRO CPUs support 128 PCIe 4.0 lanes. 8 of the lanes are reserved as link to the chipset.
* No integrated graphics.
* Fabrication process: TSMC 7FF.
| Branding and Model | Branding and Model | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | TDP | Chiplets | Core config | Release date | MSRP |
| Branding and Model | Branding and Model | Cores (threads) | Base | Boost | L3 cache (total) | TDP | Chiplets | Core config | Release date | MSRP |
| Ryzen Threadripper PRO | 3995WX | 64 (128) | 2.7 | 4.2 | 256 MB | 280 W | 8 × CCD 1 × I/OD | 16 × 4 | Jul 14, 2020 | |
| Ryzen Threadripper PRO | 3975WX | 32 (64) | 3.5 | 4.2 | 128 MB | 280 W | 4 × CCD 1 × I/OD | 8 × 4 | Jul 14, 2020 | |
| Ryzen Threadripper PRO | 3955WX | 16 (32) | 3.9 | 4.3 | 64 MB | 280 W | 2 × CCD 1 × I/OD | 4 × 4 | Jul 14, 2020 | |
| Ryzen Threadripper PRO | 3945WX | 12 (24) | 4.0 | 4.3 | 64 MB | 280 W | 2 × CCD 1 × I/OD | 4 × 3 | Jul 14, 2020 | |
| Ryzen Threadripper | 3990X | 64 (128) | 2.9 | 4.3 | 256 MB | 280 W | 8 × CCD 1 × I/OD | 16 × 4 | Feb 7, 2020 | US $3990 |
| Ryzen Threadripper | 3970X | 32 (64) | 3.7 | 4.5 | 128 MB | 280 W | 4 × CCD 1 × I/OD | 8 × 4 | Nov 25, 2019 | US $1999 |
| Ryzen Threadripper | 3960X | 24 (48) | 3.8 | 4.5 | 128 MB | 280 W | 4 × CCD 1 × I/OD | 8 × 3 | Nov 25, 2019 | US $1399 |
* v
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* e
* ↑ Core Complexes (CCXs) × cores per CCX
* ↑ Ryzen Threadripper 3990X may consume over 490 W under load.

### Ryzen 4000 series
#### Renoir (4000 series, Zen 2 based)

Based on the Ryzen 4000G series APUs with the integrated GPU disabled. Common features of Ryzen 4000 desktop CPUs:
* Socket: AM4.
* All the CPUs support DDR4-3200 in dual-channel mode.
* L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
* L2 cache: 512 KB per core.
* All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
* No integrated graphics.
* Fabrication process: TSMC 7FF.
* Bundled with AMD Wraith Stealth
The AMD 4700S and 4800S desktop processors are part of a "desktop kit" that comes bundled with a motherboard and GDDR6 RAM. The CPU is soldered, and provides 4 PCIe 2.0 lanes. These are reportedly cut-down variants of the APUs found on the PlayStation 5 and Xbox Series X and S repurposed from defective chip stock.
| Branding and model | Branding and model | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | TDP | Core config | Release date | MSRP |
| Branding and model | Branding and model | Cores (threads) | Base | Boost | L3 cache (total) | TDP | Core config | Release date | MSRP |
| AMD | 4800S | 8 (16) | | 4.0 | 8 MB | | 2 × 4 | 2022 | bundled with desktop kit |
| AMD | 4700S | 8 (16) | 3.6 | 4.0 | 8 MB | 75 W | 2 × 4 | 2021 | bundled with desktop kit |
| Ryzen 5 | 4500 | 6 (12) | 3.6 | 4.1 | 8 MB | 65 W | 2 × 3 | Apr 4, 2022 | US $129 |
| Ryzen 3 | 4100 | 4 (8) | 3.8 | 4.0 | 4 MB | 65 W | 1 × 4 | Apr 4, 2022 | US $99 |
* v
* t
* e
* ↑ Core Complexes (CCX) × cores per CCX

#### Renoir (4000 series with Radeon Graphics, Zen 2/GCN5 based)

Common features of Ryzen 4000 desktop APUs:
* Socket: AM4.
* All the CPUs support DDR4-3200 in dual-channel mode.
* L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
* L2 cache: 512 KB per core.
* All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
* Includes integrated GCN 5th generation GPU.
* Fabrication process: TSMC 7FF.
| Branding and model | Branding and model | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | GPU | TDP | Release date | Release price |
| Branding and model | Branding and model | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | Core Config | Model | Clock (GHz) | Config | Processing power (GFLOPS) | TDP | Release date | Release price |
| Branding and model | Branding and model | Cores (threads) | Base | Boost | L3 cache (total) | Core Config | Model | Clock (GHz) | Config | Processing power (GFLOPS) | TDP | Release date | Release price |
| Ryzen 7 | 4700G | 8 (16) | 3.6 | 4.4 | 8 MB | 2 × 4 | Radeon Graphics | 2.1 | 512:32:16 8 CU | 2150.4 | 65 W | Jul 21, 2020 | OEM |
| Ryzen 7 | 4700GE | 8 (16) | 3.1 | 4.3 | 8 MB | 2 × 4 | Radeon Graphics | 2.0 | 512:32:16 8 CU | 2048 | 35 W | Jul 21, 2020 | OEM |
| Ryzen 5 | 4600G | 6 (12) | 3.7 | 4.2 | 8 MB | 2 × 3 | Radeon Graphics | 1.9 | 448:28:14 7 CU | 1702.4 | 65 W | Jul 21, 2020 (OEM) / Apr 4, 2022 (retail) | OEM / US $154 |
| Ryzen 5 | 4600GE | 6 (12) | 3.3 | 4.2 | 8 MB | 2 × 3 | Radeon Graphics | 1.9 | 448:28:14 7 CU | 1702.4 | 35 W | Jul 21, 2020 | OEM |
| Ryzen 3 | 4300G | 4 (8) | 3.8 | 4.0 | 4 MB | 1 × 4 | Radeon Graphics | 1.7 | 384:24:12 6 CU | 1305.6 | 65 W | Jul 21, 2020 | OEM |
| Ryzen 3 | 4300GE | 4 (8) | 3.5 | 4.0 | 4 MB | 1 × 4 | Radeon Graphics | 1.7 | 384:24:12 6 CU | 1305.6 | 35 W | Jul 21, 2020 | OEM |
* v
* t
* e
* ↑ Core complexes (CCXs) × cores per CCX
* ↑ Unified shaders : Texture mapping units : Render output units and Compute units (CU)
* ↑ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
* 1 2 3 4 5 6 Model also available as PRO version as 4350GE, 4350G, 4650GE, 4650G, 4750GE, 4750G, released on July 21, 2020 for OEM only.
* ↑ All of the iGPUs are branded as AMD Radeon Graphics.

### Ryzen 5000 series
#### Vermeer (5000 series, Zen 3 based)

Common features of Ryzen 5000 desktop CPUs:
* Socket: AM4.
* All the CPUs support DDR4-3200 in dual-channel mode.
* All the CPUs support 24 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset.
* No integrated graphics.
* L1 cache: 64 KB per core (32 KB data + 32 KB instruction).
* L2 cache: 512 KB per core.
* Fabrication process: TSMC 7FF.
| Branding and model | Branding and model | Cores (threads) | Thermal solution | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | TDP | Chiplets | Core config | Release date | MSRP |
| Branding and model | Branding and model | Cores (threads) | Thermal solution | Base | Boost | L3 cache (total) | TDP | Chiplets | Core config | Release date | MSRP |
| Ryzen 9 | 5950X | 16 (32) | — | 3.4 | 4.9 | 64 MB | 105 W | 2 × CCD 1 × I/OD | 2 × 8 | Nov 5, 2020 | US $799 |
| Ryzen 9 | 5900XT | 16 (32) | — | 3.3 | 4.8 | 64 MB | 105 W | 2 × CCD 1 × I/OD | 2 × 8 | Jul 31, 2024 | US $349 |
| Ryzen 9 | 5900X | 12 (24) | — | 3.7 | 4.8 | 64 MB | 105 W | 2 × CCD 1 × I/OD | 2 × 6 | Nov 5, 2020 | US $549 |
| Ryzen 9 | 5900 | 12 (24) | — | 3.0 | 4.7 | 64 MB | 65 W | 2 × CCD 1 × I/OD | 2 × 6 | Jan 12, 2021 | OEM |
| Ryzen 9 | PRO 5945 | 12 (24) | — | 3.0 | 4.7 | 64 MB | 65 W | 2 × CCD 1 × I/OD | 2 × 6 | Sep 2022 | OEM |
| Ryzen 7 | 5800X3D | 8 (16) | — | 3.4 | 4.5 | 96 MB | 105 W | 1 × CCD 1 × I/OD | 1 × 8 | Apr 20, 2022 | US $449 |
| Ryzen 7 | 5800XT | 8 (16) | Wraith Prism | 3.8 | 4.8 | 32 MB | 105 W | 1 × CCD 1 × I/OD | 1 × 8 | Jul 31, 2024 | US $249 |
| Ryzen 7 | 5800X | 8 (16) | — | 3.8 | 4.7 | 32 MB | 105 W | 1 × CCD 1 × I/OD | 1 × 8 | Nov 5, 2020 | US $449 |
| Ryzen 7 | 5800 | 8 (16) | — | 3.4 | 4.6 | 32 MB | 65 W | 1 × CCD 1 × I/OD | 1 × 8 | Jan 12, 2021 | OEM |
| Ryzen 7 | 5700X3D | 8 (16) | — | 3.0 | 4.1 | 96 MB | 105 W | 1 × CCD 1 × I/OD | 1 × 8 | Jan 31, 2024 | US $249 |
| Ryzen 7 | 5700X | 8 (16) | — | 3.4 | 4.6 | 32 MB | 65 W | 1 × CCD 1 × I/OD | 1 × 8 | Apr 4, 2022 | US $299 |
| Ryzen 7 | PRO 5845 | 8 (16) | — | 3.4 | 4.6 | 32 MB | 65 W | 1 × CCD 1 × I/OD | 1 × 8 | Sep 2022 | OEM |
| Ryzen 5 | 5600X3D | 6 (12) | — | 3.3 | 4.4 | 96 MB | 105 W | 1 × CCD 1 × I/OD | 1 × 6 | Jul 7, 2023 US Only | US $229 |
| Ryzen 5 | 5600XT | 6 (12) | Wraith Stealth | 3.7 | 4.7 | 32 MB | 65 W | 1 × CCD 1 × I/OD | 1 × 6 | Oct 31, 2024 | US $194 |
| Ryzen 5 | 5600X | 6 (12) | Wraith Stealth | 3.7 | 4.6 | 32 MB | 65 W | 1 × CCD 1 × I/OD | 1 × 6 | Nov 5, 2020 | US $299 |
| Ryzen 5 | 5600T | 6 (12) | Wraith Stealth | 3.5 | 4.5 | 32 MB | 65 W | 1 × CCD 1 × I/OD | 1 × 6 | Oct 31, 2024 | US $186 |
| Ryzen 5 | 5600 | 6 (12) | Wraith Stealth | 3.5 | 4.4 | 32 MB | 65 W | 1 × CCD 1 × I/OD | 1 × 6 | Apr 4, 2022 | US $199 |
| Ryzen 5 | PRO 5645 | 6 (12) | — | 3.7 | 4.6 | 32 MB | 65 W | 1 × CCD 1 × I/OD | 1 × 6 | Sep 2022 | OEM |
* v
* t
* e
* ↑ Core Complexes (CCX) × cores per CCX

#### Cezanne (5000 series, Zen 3 based)

Cezanne based CPUs that have the integrated GPU disabled. Common features of Ryzen 5000 (Cezanne) desktop CPUs:
* Socket: AM4.
* CPUs support DDR4-3200 in dual-channel mode.
* L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
* L2 cache: 512 KB per core.
* CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
* No integrated graphics.
* Fabrication process: TSMC 7FF.
| Branding and model | Branding and model | Cores (threads) | Thermal solution | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | TDP | Core config | Release date | MSRP (USD) |
| Branding and model | Branding and model | Cores (threads) | Thermal solution | Base | Boost | L3 cache (total) | TDP | Core config | Release date | MSRP (USD) |
| Ryzen 7 | 5700 | 8 (16) | Wraith Stealth | 3.7 | 4.6 | 16 MB | 65 W | 1 × 8 | Apr 4, 2022 (OEM), Dec 21, 2023 (retail) | $179 |
| Ryzen 5 | 5500 | 6 (12) | Wraith Stealth | 3.6 | 4.2 | 16 MB | 65 W | 1 × 6 | Apr 4, 2022 | $159 |
| Ryzen 3 | 5100 | 4 (8) | – | 3.8 | 4.2 | 8 MB | 65 W | 1 × 4 | 2023 | OEM |
* v
* t
* e
* ↑ Core Complexes (CCX) × cores per CCX

#### Cezanne (5000 series with Radeon Graphics, Zen 3/GCN5 based)

Common features of Ryzen 5000 desktop APUs:
* Socket: AM4.
* All the CPUs support DDR4-3200 in dual-channel mode.
* L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
* L2 cache: 512 KB per core.
* All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
* Includes integrated GCN 5th generation GPU.
* Fabrication process: TSMC 7FF.
| Branding and model | Branding and model | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | Thermal solution | TDP | Release date | MSRP |
| Branding and model | Branding and model | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | Core config | Clock (MHz) | Config | Processing power (GFLOPS) | Thermal solution | TDP | Release date | MSRP |
| Branding and model | Branding and model | Cores (threads) | Base | Boost | L3 cache (total) | Core config | Clock (MHz) | Config | Processing power (GFLOPS) | Thermal solution | TDP | Release date | MSRP |
| Ryzen 7 | 5705G | 8 (16) | 3.8 | 4.6 | 16 MB | 1 × 8 | 2000 | 512:32:8 8 CU | 2048 | — | 65 W | | |
| Ryzen 7 | 5700G | 8 (16) | 3.8 | 4.6 | 16 MB | 1 × 8 | 2000 | 512:32:8 8 CU | 2048 | Wraith Stealth | 65 W | Apr 13, 2021 (OEM), Aug 5, 2021 (retail) | US $359 |
| Ryzen 7 | 5705GE | 8 (16) | 3.2 | 4.6 | 16 MB | 1 × 8 | 2000 | 512:32:8 8 CU | 2048 | — | 35 W | | |
| Ryzen 7 | 5700GE | 8 (16) | 3.2 | 4.6 | 16 MB | 1 × 8 | 2000 | 512:32:8 8 CU | 2048 | Wraith Stealth | 35 W | Apr 13, 2021 | OEM |
| Ryzen 5 | 5600GT | 6 (12) | 3.6 | 4.6 | 16 MB | 1 × 6 | 1900 | 448:28:8 7 CU | 1702.4 | Wraith Stealth | 65 W | Jan 31, 2024 | US $140 |
| Ryzen 5 | 5605G | 6 (12) | 3.9 | 4.4 | 16 MB | 1 × 6 | 1900 | 448:28:8 7 CU | 1702.4 | — | 65 W | | |
| Ryzen 5 | 5600G | 6 (12) | 3.9 | 4.4 | 16 MB | 1 × 6 | 1900 | 448:28:8 7 CU | 1702.4 | Wraith Stealth | 65 W | Apr 13, 2021 (OEM), Aug 5, 2021 (retail) | US $259 |
| Ryzen 5 | 5605GE | 6 (12) | 3.4 | 4.4 | 16 MB | 1 × 6 | 1900 | 448:28:8 7 CU | 1702.4 | — | 35 W | | |
| Ryzen 5 | 5600GE | 6 (12) | 3.4 | 4.4 | 16 MB | 1 × 6 | 1900 | 448:28:8 7 CU | 1702.4 | Wraith Stealth | 35 W | Apr 13, 2021 | OEM |
| Ryzen 5 | 5500GT | 6 (12) | 3.6 | 4.4 | 16 MB | 1 × 6 | 1900 | 448:28:8 7 CU | 1702.4 | Wraith Stealth | 65 W | Jan 31, 2024 | US $125 |
| Ryzen 3 | 5305G | 4 (8) | 4.0 | 4.2 | 8 MB | 1 × 4 | 1700 | 384:24:8 6 CU | 1305.6 | — | 65 W | | |
| Ryzen 3 | 5300G | 4 (8) | 4.0 | 4.2 | 8 MB | 1 × 4 | 1700 | 384:24:8 6 CU | 1305.6 | OEM | 65 W | Apr 13, 2021 | OEM |
| Ryzen 3 | 5305GE | 4 (8) | 3.6 | 4.2 | 8 MB | 1 × 4 | 1700 | 384:24:8 6 CU | 1305.6 | — | 35 W | | |
| Ryzen 3 | 5300GE | 4 (8) | 3.6 | 4.2 | 8 MB | 1 × 4 | 1700 | 384:24:8 6 CU | 1305.6 | OEM | 35 W | Apr 13, 2021 | OEM |
* v
* t
* e
* ↑ Core Complexes (CCX) × cores per CCX
* ↑ Unified shaders : texture mapping units : render output units and compute units (CU)
* ↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
* ↑ All of the iGPUs are branded as AMD Radeon Graphics.
* 1 2 3 4 5 6 Model also available as PRO version as 5350GE, 5350G, 5650GE, 5650G, 5750GE, 5750G, released June 1, 2021.

#### Chagall (Threadripper 5000 series, Zen 3 based)

Common features of Ryzen 5000 workstation CPUs:
* Socket: sWRX8.
* All the CPUs support DDR4-3200 in octa-channel mode.
* L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
* L2 cache: 512 KB per core.
* All the CPUs support 128 PCIe 4.0 lanes. 8 of the lanes are reserved as link to the chipset.
* No integrated graphics.
* Fabrication process: TSMC 7FF.
| Branding and Model | Branding and Model | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | TDP | Chiplets | Core config | Release date | MSRP |
| Branding and Model | Branding and Model | Cores (threads) | Base | Boost | L3 cache (total) | TDP | Chiplets | Core config | Release date | MSRP |
| Ryzen Threadripper PRO | 5995WX | 64 (128) | 2.7 | 4.5 | 256 MB | 280 W | 8 × CCD 1 × I/OD | 8 × 8 | Mar 8, 2022 (OEM) / ? (retail) | OEM / US $6500 |
| Ryzen Threadripper PRO | 5975WX | 32 (64) | 3.6 | 4.5 | 128 MB | 280 W | 4 × CCD 1 × I/OD | 4 × 8 | Mar 8, 2022 (OEM) / ? (retail) | OEM / US $3300 |
| Ryzen Threadripper PRO | 5965WX | 24 (48) | 3.8 | 4.5 | 128 MB | 280 W | 4 × CCD 1 × I/OD | 4 × 6 | Mar 8, 2022 (OEM) / ? (retail) | OEM / US $2400 |
| Ryzen Threadripper PRO | 5955WX | 16 (32) | 4.0 | 4.5 | 64 MB | 280 W | 2 × CCD 1 × I/OD | 2 × 8 | Mar 8, 2022 | OEM |
| Ryzen Threadripper PRO | 5945WX | 12 (24) | 4.1 | 4.5 | 64 MB | 280 W | 2 × CCD 1 × I/OD | 2 × 6 | Mar 8, 2022 | OEM |
* v
* t
* e
* ↑ Core Complexes (CCX) × cores per CCX

### Ryzen 7000 series
#### Raphael (7000 series, Zen 4/RDNA2 based)

Common features of Ryzen 7000 desktop CPUs:
* Socket: AM5.
* All the CPUs support DDR5-5200 in dual-channel mode.
* L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
* L2 cache: 1 MB per core.
* All the CPUs support 28 PCIe 5.0 lanes. 4 of the lanes are reserved as link to the chipset.
* Includes integrated RDNA 2 GPU on the I/O die with 2 CUs and clock speeds of 400 MHz (base), 2.2 GHz (boost). Models with "F" suffixes are without iGPUs.
* Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O die).
| Branding and model | Branding and model | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | Thermal solution | Chiplets | Core config | TDP | Release date | MSRP |
| Branding and model | Branding and model | Cores (threads) | Base | Boost | L3 cache (total) | Thermal solution | Chiplets | Core config | TDP | Release date | MSRP |
| Ryzen 9 | 7950X3D | 16 (32) | 4.2 | 5.7 | 128 MB | — | 2 × CCD 1 × I/OD | 2 × 8 | 120 W | Feb 28, 2023 | US $699 |
| Ryzen 9 | 7950X | 16 (32) | 4.5 | 5.7 | 64 MB | — | 2 × CCD 1 × I/OD | 2 × 8 | 170 W | Sep 27, 2022 | US $699 |
| Ryzen 9 | 7900X3D | 12 (24) | 4.4 | 5.6 | 128 MB | — | 2 × CCD 1 × I/OD | 2 × 6 | 120 W | Feb 28, 2023 | US $599 |
| Ryzen 9 | 7900X | 12 (24) | 4.7 | 5.6 | 64 MB | — | 2 × CCD 1 × I/OD | 2 × 6 | 170 W | Sep 27, 2022 | US $549 |
| Ryzen 9 | 7900 | 12 (24) | 3.7 | 5.4 | 64 MB | Wraith Prism | 2 × CCD 1 × I/OD | 2 × 6 | 65 W | Jan 10, 2023 | US $429 |
| Ryzen 9 | PRO 7945 | 12 (24) | 3.7 | 5.4 | 64 MB | Wraith Spire | 2 × CCD 1 × I/OD | 2 × 6 | 65 W | Jun 13, 2023 | OEM |
| Ryzen 7 | 7800X3D | 8 (16) | 4.2 | 5.0 | 96 MB | — | 1 × CCD 1 × I/OD | 1 × 8 | 120 W | Apr 6, 2023 | US $449 |
| Ryzen 7 | 7700X | 8 (16) | 4.5 | 5.4 | 32 MB | — | 1 × CCD 1 × I/OD | 1 × 8 | 105 W | Sep 27, 2022 | US $399 |
| Ryzen 7 | 7700 | 8 (16) | 3.8 | 5.3 | 32 MB | Wraith Prism | 1 × CCD 1 × I/OD | 1 × 8 | 65 W | Jan 10, 2023 | US $329 |
| Ryzen 7 | PRO 7745 | 8 (16) | 3.8 | 5.3 | 32 MB | Wraith Spire | 1 × CCD 1 × I/OD | 1 × 8 | 65 W | Jun 13, 2023 | OEM |
| Ryzen 5 | 7600X3D | 6 (12) | 4.1 | 4.7 | 96 MB | — | 1 × CCD 1 × I/OD | 1 × 6 | 65 W | Aug 31, 2024 | US $299 |
| Ryzen 5 | 7600X | 6 (12) | 4.7 | 5.3 | 32 MB | — | 1 × CCD 1 × I/OD | 1 × 6 | 105 W | Sep 27, 2022 | US $299 |
| Ryzen 5 | 7600 | 6 (12) | 3.8 | 5.1 | 32 MB | Wraith Stealth | 1 × CCD 1 × I/OD | 1 × 6 | 65 W | Jan 10, 2023 | US $229 |
| Ryzen 5 | PRO 7645 | 6 (12) | 3.8 | 5.1 | 32 MB | Wraith Spire | 1 × CCD 1 × I/OD | 1 × 6 | 65 W | Jun 13, 2023 | OEM |
| Ryzen 5 | 7500F | 6 (12) | 3.7 | 5.0 | 32 MB | Wraith Stealth | 1 × CCD 1 × I/OD | 1 × 6 | 65 W | Jul 22, 2023 | US $179 |
| Ryzen 5 | 7400F | 6 (12) | 3.7 | 4.7 | 32 MB | Wraith Stealth | 1 × CCD 1 × I/OD | 1 × 6 | 65 W | Jan 9, 2025 | |
* v
* t
* e
* ↑ Self identifies as "AMD Radeon Graphics". See RDNA 2 § Integrated graphics processors (iGPs).
* ↑ Core Complexes (CCX) × cores per CCX
* 1 2 Only one of the two CCXes has additional 64 MB 3D V-Cache. Only the CCX without 3D V-Cache will be able to reach the maximum boost clocks. The CCX with 3D V-Cache will clock lower.
* ↑ Release date for US, where it is only sold though MicroCenter. In Europe it is only available in Germany, and only through MindFactory, which released it on September 5, 2024.

#### Storm Peak (Threadripper 7000 series, Zen 4 based)

Common features of Ryzen 7000 HEDT/workstation CPUs:
* Socket: sTR5.
* Threadripper CPUs support DDR5-5200 in quad-channel mode while Threadripper PRO CPUs support DDR5-5200 in octa-channel mode with ECC support.
* L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
* L2 cache: 1 MB per core.
* Threadripper CPUs support 48 PCIe 5.0 and 24 PCIe 4.0 lanes while Threadripper PRO CPUs support 128 PCIe 5.0 lanes. In addition, all processor models have 4 PCIe 4.0 lanes reserved as link to the chipset.
* No integrated graphics.
* Fabrication process: TSMC 5FF.
| Branding and model | Branding and model | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | TDP | Chiplets | Core config | Release date | MSRP |
| Branding and model | Branding and model | Cores (threads) | Base | Boost | L3 cache (total) | TDP | Chiplets | Core config | Release date | MSRP |
| Ryzen Threadripper PRO | 7995WX | 96 (192) | 2.5 | 5.1 | 384 MB | 350 W | 12 × CCD 1 × I/OD | 12 × 8 | Nov 21, 2023 | US $9999 |
| Ryzen Threadripper PRO | 7985WX | 64 (128) | 3.2 | 5.1 | 256 MB | 350 W | 8 × CCD 1 × I/OD | 8 × 8 | Nov 21, 2023 | US $7349 |
| Ryzen Threadripper PRO | 7975WX | 32 (64) | 4.0 | 5.3 | 128 MB | 350 W | 4 × CCD 1 × I/OD | 4 × 8 | Nov 21, 2023 | US $3899 |
| Ryzen Threadripper PRO | 7965WX | 24 (48) | 4.2 | 5.3 | 128 MB | 350 W | 4 × CCD 1 × I/OD | 4 × 6 | Nov 21, 2023 | US $2649 |
| Ryzen Threadripper PRO | 7955WX | 16 (32) | 4.5 | 5.3 | 64 MB | 350 W | 2 × CCD 1 × I/OD | 2 × 8 | Nov 21, 2023 | US $1899 |
| Ryzen Threadripper PRO | 7945WX | 12 (24) | 4.7 | 5.3 | 64 MB | 350 W | 2 × CCD 1 × I/OD | 2 × 6 | Nov 21, 2023 | US $1399 |
| Ryzen Threadripper | 7980X | 64 (128) | 3.2 | 5.1 | 256 MB | 350 W | 8 × CCD 1 × I/OD | 8 × 8 | Nov 21, 2023 | US $4999 |
| Ryzen Threadripper | 7970X | 32 (64) | 4.0 | 5.3 | 128 MB | 350 W | 4 × CCD 1 × I/OD | 4 × 8 | Nov 21, 2023 | US $2499 |
| Ryzen Threadripper | 7960X | 24 (48) | 4.2 | 5.3 | 128 MB | 350 W | 4 × CCD 1 × I/OD | 4 × 6 | Nov 21, 2023 | US $1499 |
* v
* t
* e
* ↑ Core Complexes (CCXs) × cores per CCX

### Ryzen 8000 series
#### Phoenix (8000 series, Zen 4 based)

Common features of Ryzen 8000 desktop CPUs:
* Socket: AM5.
* All the CPUs support DDR5-5200 RAM in dual-channel mode.
* L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
* L2 cache: 1 MB per core.
* All the CPUs support 20 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset.
* No integrated graphics.
* Fabrication process: TSMC 4 nm FinFET.
| Branding and model | Branding and model | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | NPU | Thermal solution | TDP | Core config | Release date | MSRP |
| Branding and model | Branding and model | Cores (threads) | Base | Boost | L3 cache (total) | NPU | Thermal solution | TDP | Core config | Release date | MSRP |
| Ryzen 7 | 8700F | 8 (16) | 4.1 | 5.0 | 16 MB | Partial | Wraith Stealth | 65 W | 1 × 8 | April 1, 2024 | OEM |
| Ryzen 5 | 8400F | 6 (12) | 4.2 | 4.7 | 16 MB | No | Wraith Stealth | 65 W | 1 × 6 | April 1, 2024 | OEM |
* v
* t
* e
* ↑ Core Complexes (CCX) × cores per CCX.
* ↑ Ryzen AI is only available when paired with a Radeon graphics card that features AI acceleration, such as the RX 7000 series.

#### Phoenix (8000 series with Radeon Graphics, Zen 4/RDNA3/XDNA based)

Common features of Ryzen 8000G desktop APUs:
* Socket: AM5.
* All the CPUs support DDR5-5200 RAM in dual-channel mode in 2x1R and 2x2R configuration, but only DDR5-3600 for 4x1R and 4x2R.
* L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
* L2 cache: 1 MB per core.
* Models with Zen 4c cores (codenamed Phoenix 2) support 14 PCIe 4.0 lanes, while models without them support 20 lanes. 4 of the lanes are reserved as link to the chipset.
* Includes integrated RDNA 3 GPU.
* Includes XDNA AI Engine (Ryzen AI) on models without Zen 4c cores.
* Fabrication process: TSMC 4 nm FinFET.
| Branding and model | Branding and model | CPU | CPU | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | NPU | Thermal solution | TDP | Release date | MSRP |
| Branding and model | Branding and model | Cores (threads) | Cores (threads) | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | Core config | Model | Core config | Clock (GHz) | NPU | Thermal solution | TDP | Release date | MSRP |
| Branding and model | Branding and model | Total | Zen 4 | Zen 4c | Base | Boost | L3 cache (total) | Core config | Model | Core config | Clock (GHz) | NPU | Thermal solution | TDP | Release date | MSRP |
| Ryzen 7 | 8700G | 8 (16) | 8 (16) | — | 4.2 | 5.1 | 16 MB | 1 × 8 | 780M | 12 CUs 768:48:24:12 | 2.9 | Ryzen AI Up to 16 TOPS | Wraith Spire | 65 W | Jan 31, 2024 | US $329 |
| Ryzen 7 | PRO 8700GE | 8 (16) | 8 (16) | — | 3.6 | 5.1 | 16 MB | 1 × 8 | 780M | 12 CUs 768:48:24:12 | 2.7 | Ryzen AI Up to 16 TOPS | — | 35 W | Apr 16, 2024 | US $299 |
| Ryzen 5 | 8600G | 6 (12) | 6 (12) | — | 4.3 | 5.0 | 16 MB | 1 × 6 | 760M | 8 CUs 512:32:16:8 | 2.8 | Ryzen AI Up to 16 TOPS | Wraith Stealth | 65 W | Jan 31, 2024 | US $229 |
| Ryzen 5 | PRO 8600GE | 6 (12) | 6 (12) | — | 3.9 | 5.0 | 16 MB | 1 × 6 | 760M | 8 CUs 512:32:16:8 | 2.6 | Ryzen AI Up to 16 TOPS | — | 35 W | Apr 16, 2024 | ?? |
| Ryzen 5 | 8500G | 6 (12) | 2 (4) | 4 (8) | 4.1 / 3.2 | 5.0 / 3.7 | 16 MB | 2 + 4 | 740M | 4 CUs 256:16:8:4 | 2.8 | No | Wraith Stealth | 65 W | Jan 31, 2024 | US $179 |
| Ryzen 5 | 8500GE | 6 (12) | 2 (4) | 4 (8) | 3.9 / 3.1 | 5.0 / 3.7 | 16 MB | 2 + 4 | 740M | 4 CUs 256:16:8:4 | 2.8 | No | — | 35 W | Apr 16, 2024 | ?? |
| Ryzen 3 | 8300G | 4 (8) | 1 (2) | 3 (6) | 4.0 / 3.2 | 4.9 / 3.6 | 8 MB | 1 + 3 | 740M | 4 CUs 256:16:8:4 | 2.6 | No | Wraith Stealth | 65 W | Jan 2024 (OEM) / Q1 2024 (retail) | OEM / TBA |
| Ryzen 3 | 8300GE | 4 (8) | 1 (2) | 3 (6) | 4.0 / 3.2 | 4.9 / 3.6 | 8 MB | 1 + 3 | 740M | 4 CUs 256:16:8:4 | 2.6 | No | — | 35 W | Apr 16, 2024 | ?? |
* v
* t
* e
* ↑ Core Complexes (CCX) × cores per CCX, or Zen 4 + Zen 4c cores
* ↑ Unified shaders : Texture mapping units : Render output units : Ray accelerators : AI accelerators and Compute units (CU)
* ↑ GPUs based on RDNA 3 have dual-issue stream processors so that up to two shader instructions can be executed per clock cycle under certain parallelism conditions.
* 1 2 3 4 5 6 Model also available as PRO version as 8300G, 8300GE, 8500G, 8500GE, 8600G, 8700G.
* 1 2 3 Zen 4 cores' base frequency / Zen 4c cores' base frequency
* 1 2 Zen 4 cores' boost frequency / Zen 4c cores' boost frequency

### Ryzen 9000 series
#### Granite Ridge (9000 series, Zen 5 based)

Common features of Ryzen 9000 desktop CPUs:
* Socket: AM5.
* All the CPUs support DDR5-5600 in dual-channel mode.
* All the CPUs support 28 PCIe 5.0 lanes. 4 of the lanes are reserved as link to the chipset.
* Includes integrated RDNA2 GPU with 2 CUs and base and boost clock speeds of 0.4 GHz and 2.2 GHz, respectively.
* L1 cache: 80 KB (48 KB data + 32 KB instruction) per core.
* L2 cache: 1 MB per core.
* Fabrication process: TSMC N4 FinFET (N6 FinFET for the I/O die).
| Branding and Model | Branding and Model | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | Thermal solution | TDP | Chiplets | Core config | Release date | Launch price |
| Branding and Model | Branding and Model | Cores (threads) | Base | Boost | L3 cache (total) | Thermal solution | TDP | Chiplets | Core config | Release date | Launch price |
| Ryzen 9 | 9950X3D | 16 (32) | 4.3 | 5.7 | 128 MB | — | 170 W | 2 × CCD 1 × I/OD | 2 × 8 | Q1 2025 | TBA |
| Ryzen 9 | 9950X | 16 (32) | 4.3 | 5.7 | 64 MB | — | 170 W | 2 × CCD 1 × I/OD | 2 × 8 | August 15, 2024 | US $649 |
| Ryzen 9 | 9900X3D | 12 (24) | 4.4 | 5.5 | 128 MB | — | 120 W | 2 × CCD 1 × I/OD | 2 × 6 | Q1 2025 | TBA |
| Ryzen 9 | 9900X | 12 (24) | 4.4 | 5.6 | 64 MB | — | 120 W | 2 × CCD 1 × I/OD | 2 × 6 | August 15, 2024 | US $499 |
| Ryzen 7 | 9800X3D | 8 (16) | 4.7 | 5.2 | 96 MB | — | 120 W | 1 × CCD 1 × I/OD | 1 × 8 | November 7, 2024 | US $479 |
| Ryzen 7 | 9700X | 8 (16) | 3.8 | 5.5 | 32 MB | — | 65 W | 1 × CCD 1 × I/OD | 1 × 8 | August 8, 2024 | US $359 |
| Ryzen 5 | 9600X | 6 (12) | 3.9 | 5.4 | 32 MB | — | 65 W | 1 × CCD 1 × I/OD | 1 × 6 | August 8, 2024 | US $279 |
| Ryzen 5 | 9600 | 6 (12) | 3.8 | 5.2 | 32 MB | Wraith Stealth | 65 W | 1 × CCD 1 × I/OD | 1 × 6 | TBA | TBA |
* v
* t
* e
* ↑ Manufacturer suggested retail price at launch
* ↑ TDP configurable to 105 W
* ↑ Core Complexes (CCX) × cores per CCX
* 1 2 Only one of the two CCXes has 3D V-Cache.

## Mobile processors
### Ryzen 2000 series
#### Raven Ridge (Zen/GCN5 based)

Common features of Ryzen 2000 notebook APUs:
* Socket: FP5.
* The U-series CPUs support DDR4-2400 in dual-channel mode, while the H-series CPUs support it at DDR4-3200 speeds.
* L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
* L2 cache: 512 KB per core.
* All the CPUs support 12 PCIe 3.0 lanes.
* Includes integrated GCN 5th generation GPU.
* Fabrication process: GlobalFoundries 14LP.
| Branding and Model | Branding and Model | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | GPU | TDP | Release date |
| Branding and Model | Branding and Model | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | Core config | Model | Clock (GHz) | Config | Processing power (GFLOPS) | TDP | Release date |
| Branding and Model | Branding and Model | Cores (threads) | Base | Boost | L3 cache (total) | Core config | Model | Clock (GHz) | Config | Processing power (GFLOPS) | TDP | Release date |
| Ryzen 7 | 2800H | 4 (8) | 3.3 | 3.8 | 4 MB | 1 × 4 | RX Vega 11 | 1.3 | 704:44:16 11 CUs | 1830.4 | 35–54 W | Sep 10, 2018 |
| Ryzen 7 | 2700U | 4 (8) | 2.2 | 3.8 | 4 MB | 1 × 4 | RX Vega 10 | 1.3 | 640:40:16 10 CUs | 1664 | 12–25 W | Oct 26, 2017 |
| Ryzen 5 | 2600H | 4 (8) | 3.2 | 3.6 | 4 MB | 1 × 4 | Vega 8 | 1.1 | 512:32:16 8 CUs | 1126.4 | 35–54 W | Sep 10, 2018 |
| Ryzen 5 | 2500U | 4 (8) | 2.0 | 3.6 | 4 MB | 1 × 4 | Vega 8 | 1.1 | 512:32:16 8 CUs | 1126.4 | 12–25 W | Oct 26, 2017 |
| Ryzen 3 | 2300U | 4 (4) | 2.0 | 3.4 | 4 MB | 1 × 4 | Vega 6 | 1.1 | 384:24:8 6 CUs | 844.8 | 12–25 W | Jan 8, 2018 |
| Ryzen 3 | 2200U | 2 (4) | 2.5 | 3.4 | 4 MB | 1 × 2 | Vega 3 | 1.1 | 192:12:4 3 CUs | 422.4 | 12–25 W | Jan 8, 2018 |
* v
* t
* e
* ↑ Core Complexes (CCX) × cores per CCX
* ↑ Unified shaders : Texture mapping units : Render output units and Compute units (CU)
* ↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
* ↑ Branded as Radeon Vega instead of Radeon RX Vega on the PRO CPUs.
* 1 2 3 Model also available as PRO version as 2300U, 2500U, 2700U, released on May 15, 2018.

### Ryzen 3000 series
#### Dalí (Zen/GCN5 based)

Common features of Ryzen 3000 notebook APUs:
* Socket: FP5.
* All the CPUs support DDR4-2400 in dual-channel mode.
* L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
* L2 cache: 512 KB per core.
* All the CPUs support 12 PCIe 3.0 lanes.
* Includes integrated GCN 5th generation GPU.
* Fabrication process: GlobalFoundries 14LP.
| Branding and Model | Branding and Model | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | GPU | TDP | Release date |
| Branding and Model | Branding and Model | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | Core config | Model | Clock (GHz) | Config | Processing power (GFLOPS) | TDP | Release date |
| Branding and Model | Branding and Model | Cores (threads) | Base | Boost | L3 cache (total) | Core config | Model | Clock (GHz) | Config | Processing power (GFLOPS) | TDP | Release date |
| Ryzen 3 | 3250U | 2 (4) | 2.6 | 3.5 | 4 MB | 1 × 2 | Vega 3 | 1.2 | 192:12:4 3 CUs | 460.8 | 12–25 W | Jan 6, 2020 |
| Ryzen 3 | 3250C | 2 (4) | 2.6 | 3.5 | 4 MB | 1 × 2 | Vega 3 | 1.2 | 192:12:4 3 CUs | 460.8 | 12–25 W | Sep 22, 2020 |
| Ryzen 3 | 3200U | 2 (4) | 2.6 | 3.5 | 4 MB | 1 × 2 | Vega 3 | 1.2 | 192:12:4 3 CUs | 460.8 | 12–25 W | Jan 6, 2019 |
* v
* t
* e
* ↑ Core Complexes (CCX) × cores per CCX
* ↑ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
* ↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

#### Picasso (Zen+/GCN5 based)

Common features of Ryzen 3000 notebook APUs:
* Socket: FP5.
* All the CPUs support DDR4-2400 in dual-channel mode.
* L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
* L2 cache: 512 KB per core.
* All the CPUs support 16 PCIe 3.0 lanes.
* Includes integrated GCN 5th generation GPU.
* Fabrication process: GlobalFoundries 12LP (14LP+).
| Branding and Model | Branding and Model | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | GPU | TDP | Release date |
| Branding and Model | Branding and Model | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | Core config | Model | Clock (GHz) | Config | Processing power (GFLOPS) | TDP | Release date |
| Branding and Model | Branding and Model | Cores (threads) | Base | Boost | L3 cache (total) | Core config | Model | Clock (GHz) | Config | Processing power (GFLOPS) | TDP | Release date |
| Ryzen 7 | 3780U | 4 (8) | 2.3 | 4.0 | 4 MB | 1 × 4 | RX Vega 11 | 1.4 | 704:44:16 11 CU | 1971.2 | 15 W | Oct 2019 |
| Ryzen 7 | 3750H | 4 (8) | 2.3 | 4.0 | 4 MB | 1 × 4 | RX Vega 10 | 1.4 | 640:40:16 10 CU | 1792.0 | 35 W | Jan 6, 2019 |
| Ryzen 7 | 3700C | 4 (8) | 2.3 | 4.0 | 4 MB | 1 × 4 | RX Vega 10 | 1.4 | 640:40:16 10 CU | 1792.0 | 15 W | Sep 22, 2020 |
| Ryzen 7 | 3700U | 4 (8) | 2.3 | 4.0 | 4 MB | 1 × 4 | RX Vega 10 | 1.4 | 640:40:16 10 CU | 1792.0 | 15 W | Jan 6, 2019 |
| Ryzen 5 | 3580U | 4 (8) | 2.1 | 3.7 | 4 MB | 1 × 4 | Vega 9 | 1.3 | 576:36:16 9 CU | 1497.6 | 15 W | Oct 2019 |
| Ryzen 5 | 3550H | 4 (8) | 2.1 | 3.7 | 4 MB | 1 × 4 | Vega 8 | 1.2 | 512:32:16 8 CU | 1228.8 | 35 W | Jan 6, 2019 |
| Ryzen 5 | 3500C | 4 (8) | 2.1 | 3.7 | 4 MB | 1 × 4 | Vega 8 | 1.2 | 512:32:16 8 CU | 1228.8 | 15 W | Sep 22, 2020 |
| Ryzen 5 | 3500U | 4 (8) | 2.1 | 3.7 | 4 MB | 1 × 4 | Vega 8 | 1.2 | 512:32:16 8 CU | 1228.8 | 15 W | Jan 6, 2019 |
| Ryzen 5 | 3450U | 4 (8) | 2.1 | 3.5 | 4 MB | 1 × 4 | Vega 8 | 1.2 | 512:32:16 8 CU | 1228.8 | 15 W | Jun 2020 |
| Ryzen 3 | 3350U | 4 (4) | 2.1 | 3.5 | 4 MB | 1 × 4 | Vega 6 | 1.2 | 384:24:8 6 CU | 921.6 | 15 W | Jan 6, 2019 |
| Ryzen 3 | 3300U | 4 (4) | 2.1 | 3.5 | 4 MB | 1 × 4 | Vega 6 | 1.2 | 384:24:8 6 CU | 921.6 | 15 W | Jan 6, 2019 |
* v
* t
* e
* ↑ Core Complexes (CCX) × cores per CCX
* ↑ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
* ↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
* 1 2 3 Model also available as PRO version, released April 8, 2019.

### Ryzen 4000 series
#### Renoir (Zen 2/GCN5 based)

Common features of Ryzen 4000 notebook APUs:
* Socket: FP6.
* All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode.
* L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
* L2 cache: 512 KB per core.
* All the CPUs support 16 PCIe 3.0 lanes.
* Includes integrated GCN 5th generation GPU.
* Fabrication process: TSMC 7FF.
| Branding and Model | Branding and Model | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | GPU | TDP | Release date |
| Branding and Model | Branding and Model | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | Core config | Model | Clock (GHz) | Config | Processing power (GFLOPS) | TDP | Release date |
| Branding and Model | Branding and Model | Cores (threads) | Base | Boost | L3 cache (total) | Core config | Model | Clock (GHz) | Config | Processing power (GFLOPS) | TDP | Release date |
| Ryzen 9 | 4900H | 8 (16) | 3.3 | 4.4 | 8 MB | 2 × 4 | Radeon Graphics | 1.75 | 512:32:8 8 CU | 1792 | 35–54 W | Mar 16, 2020 |
| Ryzen 9 | 4900HS | 8 (16) | 3.0 | 4.3 | 8 MB | 2 × 4 | Radeon Graphics | 1.75 | 512:32:8 8 CU | 1792 | 35 W | Mar 16, 2020 |
| Ryzen 7 | 4800H | 8 (16) | 2.9 | 4.2 | 8 MB | 2 × 4 | Radeon Graphics | 1.6 | 448:28:8 7 CU | 1433.6 | 35–54 W | Mar 16, 2020 |
| Ryzen 7 | 4800HS | 8 (16) | 2.9 | 4.2 | 8 MB | 2 × 4 | Radeon Graphics | 1.6 | 448:28:8 7 CU | 1433.6 | 35 W | Mar 16, 2020 |
| Ryzen 7 | 4980U | 8 (16) | 2.0 | 4.4 | 8 MB | 2 × 4 | Radeon Graphics | 1.95 | 512:32:8 8 CU | 1996.8 | 10–25 W | Apr 13, 2021 |
| Ryzen 7 | 4800U | 8 (16) | 1.8 | 4.2 | 8 MB | 2 × 4 | Radeon Graphics | 1.75 | 512:32:8 8 CU | 1792 | 10–25 W | Mar 16, 2020 |
| Ryzen 7 | 4700U | 8 (8) | 2.0 | 4.1 | 8 MB | 2 × 4 | Radeon Graphics | 1.6 | 448:28:8 7 CU | 1433.6 | 10–25 W | Mar 16, 2020 |
| Ryzen 5 | 4600H | 6 (12) | 3.0 | 4.0 | 8 MB | 2 × 3 | Radeon Graphics | 1.5 | 384:24:8 6 CU | 1152 | 35–54 W | Mar 16, 2020 |
| Ryzen 5 | 4600HS | 6 (12) | 3.0 | 4.0 | 8 MB | 2 × 3 | Radeon Graphics | 1.5 | 384:24:8 6 CU | 1152 | 35 W | Mar 16, 2020 |
| Ryzen 5 | 4680U | 6 (12) | 2.1 | 4.0 | 8 MB | 2 × 3 | Radeon Graphics | 1.5 | 448:28:8 7 CU | 1344 | 10–25 W | Apr 13, 2021 |
| Ryzen 5 | 4600U | 6 (12) | 2.1 | 4.0 | 8 MB | 2 × 3 | Radeon Graphics | 1.5 | 384:24:8 6 CU | 1152 | 10–25 W | Mar 16, 2020 |
| Ryzen 5 | 4500U | 6 (6) | 2.3 | 4.0 | 8 MB | 2 × 3 | Radeon Graphics | 1.5 | 384:24:8 6 CU | 1152 | 10–25 W | Mar 16, 2020 |
| Ryzen 3 | 4300U | 4 (4) | 2.7 | 3.7 | 4 MB | 1 × 4 | Radeon Graphics | 1.4 | 320:20:8 5 CU | 896 | 10–25 W | Mar 16, 2020 |
* v
* t
* e
* ↑ Core Complexes (CCX) × cores per CCX
* ↑ Unified shaders : texture mapping units : render output units and compute units (CU)
* ↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
* ↑ All of the iGPUs are branded as AMD Radeon Graphics.
* 1 2 Only found on the Microsoft Surface Laptop 4.
* 1 2 3 Model also available as PRO version as 4450U, 4650U, 4750U, released May 7, 2020.

### Ryzen 5000 series
#### Lucienne (Zen 2/GCN5 based)

Common features of Ryzen 5000 notebook APUs:
* Socket: FP6.
* All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode.
* L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
* L2 cache: 512 KB per core.
* All the CPUs support 16 PCIe 3.0 lanes.
* Includes integrated GCN 5th generation GPU.
* Fabrication process: TSMC 7FF.
| Branding and Model | Branding and Model | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | GPU | TDP | Release date |
| Branding and Model | Branding and Model | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | Core config | Model | Clock (GHz) | Config | Processing power (GFLOPS) | TDP | Release date |
| Branding and Model | Branding and Model | Cores (threads) | Base | Boost | L3 cache (total) | Core config | Model | Clock (GHz) | Config | Processing power (GFLOPS) | TDP | Release date |
| Ryzen 7 | 5700U | 8 (16) | 1.8 | 4.3 | 8 MB | 2 × 4 | Radeon Graphics | 1.9 | 512:32:8 8 CU | 1945.6 | 10–25 W | Jan 12, 2021 |
| Ryzen 5 | 5500U | 6 (12) | 2.1 | 4.0 | 8 MB | 2 × 3 | Radeon Graphics | 1.8 | 448:28:8 7 CU | 1612.8 | 10–25 W | Jan 12, 2021 |
| Ryzen 3 | 5300U | 4 (8) | 2.6 | 3.8 | 4 MB | 1 × 4 | Radeon Graphics | 1.5 | 384:24:8 6 CU | 1152 | 10–25 W | Jan 12, 2021 |
* v
* t
* e
* ↑ Core Complexes (CCX) × cores per CCX
* ↑ Unified shaders : texture mapping units : render output units and compute units (CU)
* ↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
* ↑ All of the iGPUs are branded as AMD Radeon Graphics.

#### Cezanne and Barceló (Zen 3/GCN5 based)

Cezanne (2021 models), Barceló (2022 models). Common features of Ryzen 5000 notebook APUs:
* Socket: FP6.
* All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode.
* L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
* L2 cache: 512 KB per core.
* All the CPUs support 16 PCIe 3.0 lanes.
* Includes integrated GCN 5th generation GPU.
* Fabrication process: TSMC 7FF.
| Branding and model | Branding and model | CPU | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | GPU | TDP | Release date |
| Branding and model | Branding and model | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | Core config | Model | Clock (GHz) | Config | Processing power (GFLOPS) | TDP | Release date |
| Branding and model | Branding and model | Cores (threads) | Base | Boost (Single Core) | Boost (All Core) | L3 cache (total) | Core config | Model | Clock (GHz) | Config | Processing power (GFLOPS) | TDP | Release date |
| Ryzen 9 | 5980HX | 8 (16) | 3.3 | 4.8 | 4.4 | 16 MB | 1 × 8 | Radeon Graphics | 2.1 | 512:32:8 8 CUs | 2150.4 | 35–54 W | Jan 12, 2021 |
| Ryzen 9 | 5980HS | 8 (16) | 3.0 | 4.8 | 4.0 | 16 MB | 1 × 8 | Radeon Graphics | 2.1 | 512:32:8 8 CUs | 2150.4 | 35 W | Jan 12, 2021 |
| Ryzen 9 | 5900HX | 8 (16) | 3.3 | 4.6 | 4.2 | 16 MB | 1 × 8 | Radeon Graphics | 2.1 | 512:32:8 8 CUs | 2150.4 | 35–54 W | Jan 12, 2021 |
| Ryzen 9 | 5900HS | 8 (16) | 3.0 | 4.6 | 4.0 | 16 MB | 1 × 8 | Radeon Graphics | 2.1 | 512:32:8 8 CUs | 2150.4 | 35 W | Jan 12, 2021 |
| Ryzen 7 | 5800H | 8 (16) | 3.2 | 4.4 | | 16 MB | 1 × 8 | Radeon Graphics | 2.0 | 512:32:8 8 CUs | 2048 | 35–54 W | Jan 12, 2021 |
| Ryzen 7 | 5800HS | 8 (16) | 2.8 | 4.4 | | 16 MB | 1 × 8 | Radeon Graphics | 2.0 | 512:32:8 8 CUs | 2048 | 35 W | Jan 12, 2021 |
| Ryzen 7 | 5825U | 8 (16) | 2.0 | 4.5 | | 16 MB | 1 × 8 | Radeon Graphics | 2.0 | 512:32:8 8 CUs | 2048 | 15 W | Jan 4, 2022 |
| Ryzen 7 | 5800U | 8 (16) | 1.9 | 4.4 | 3.4 | 16 MB | 1 × 8 | Radeon Graphics | 2.0 | 512:32:8 8 CUs | 2048 | 10–25 W | Jan 12, 2021 |
| Ryzen 5 | 5600H | 6 (12) | 3.3 | 4.2 | | 16 MB | 1 × 6 | Radeon Graphics | 1.8 | 448:28:8 7 CUs | 1612.8 | 35–54 W | Jan 12, 2021 |
| Ryzen 5 | 5600HS | 6 (12) | 3.0 | 4.2 | | 16 MB | 1 × 6 | Radeon Graphics | 1.8 | 448:28:8 7 CUs | 1612.8 | 35 W | Jan 12, 2021 |
| Ryzen 5 | 5625U | 6 (12) | 2.3 | 4.3 | 3.6 | 16 MB | 1 × 6 | Radeon Graphics | 1.8 | 448:28:8 7 CUs | 1612.8 | 15 W | Jan 4, 2022 |
| Ryzen 5 | 5600U | 6 (12) | 2.3 | 4.2 | 3.6 | 16 MB | 1 × 6 | Radeon Graphics | 1.8 | 448:28:8 7 CUs | 1612.8 | 10–25 W | Jan 12, 2021 |
| Ryzen 5 | 5560U | 6 (12) | 2.3 | 4.0 | | 8 MB | 1 × 6 | Radeon Graphics | 1.6 | 384:24:8 6 CUs | 1228.8 | 10–25 W | Jan 12, 2021 |
| Ryzen 5 | 5500H | 4 (8) | 3.3 | 4.2 | | 8 MB | 1 × 4 | Radeon Graphics | 1.8 | 384:24:8 6 CUs | 1382.4 | 35–54 W | Jun 23, 2023 |
| Ryzen 3 | 5425U | 4 (8) | 2.3 | 4.3 | 3.8 | 8 MB | 1 × 4 | Radeon Graphics | 1.6 | 384:24:8 6 CUs | 1228.8 | 15 W | Jan 4, 2022 |
| Ryzen 3 | 5400U | 4 (8) | 2.7 | 4.1 | 3.8 | 8 MB | 1 × 4 | Radeon Graphics | 1.6 | 384:24:8 6 CUs | 1228.8 | 10–25 W | Jan 12, 2021 |
| Ryzen 3 | 5125C | 2 (4) | 3.0 | — | — | 8 MB | 1 × 2 | Radeon Graphics | 1.2 | 192:12:8 3 CUs | 460.8 | 15 W | May 5, 2022 |
* v
* t
* e
* ↑ Core Complexes (CCX) × cores per CCX
* ↑ Unified shaders : texture mapping units : render output units and compute units (CU)
* ↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
* ↑ All of the iGPUs are branded as AMD Radeon Graphics.
* 1 2 3 4 5 6 Model also available as PRO version as 5450U, 5650U, 5850U, released on March 16, 2021 and as 5475U, 5675U, 5875U, released on April 19, 2022.
* 1 2 3 Model also available as Chromebook optimized version as 5425C, 5625C, 5825C, released on May 5, 2022.

### Ryzen 6000 series
#### Rembrandt (Zen 3+/RDNA2 based)

Common features of Ryzen 6000 notebook APUs:
* Socket: FP7, FP7r2.
* All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
* L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
* L2 cache: 512 KB per core.
* All the CPUs support 16 PCIe 4.0 lanes.
* Native USB 4 (40Gbps) Ports: 2
* Native USB 3.2 Gen 2 (10Gbps) Ports: 2
* Includes integrated RDNA 2 GPU.
* Fabrication process: TSMC N6 FinFET.
| Branding and model | Branding and model | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | GPU | TDP | Release date |
| Branding and model | Branding and model | Cores (threads) | Clock (GHz) | Clock (GHz) | L3 cache (total) | Core config | Model | Clock (GHz) | Config | Processing power (GFLOPS) | TDP | Release date |
| Branding and model | Branding and model | Cores (threads) | Base | Boost | L3 cache (total) | Core config | Model | Clock (GHz) | Config | Processing power (GFLOPS) | TDP | Release date |
| Ryzen 9 | 6980HX | 8 (16) | 3.3 | 5.0 | 16 MB | 1 × 8 | 680M | 2.4 | 768:48:8 12 CUs | 3686.4 | 45 W | Jan 4, 2022 |
| Ryzen 9 | 6980HS | 8 (16) | 3.3 | 5.0 | 16 MB | 1 × 8 | 680M | 2.4 | 768:48:8 12 CUs | 3686.4 | 35 W | Jan 4, 2022 |
| Ryzen 9 | 6900HX | 8 (16) | 3.3 | 4.9 | 16 MB | 1 × 8 | 680M | 2.4 | 768:48:8 12 CUs | 3686.4 | 45 W | Jan 4, 2022 |
| Ryzen 9 | 6900HS | 8 (16) | 3.3 | 4.9 | 16 MB | 1 × 8 | 680M | 2.4 | 768:48:8 12 CUs | 3686.4 | 35 W | Jan 4, 2022 |
| Ryzen 7 | 6800H | 8 (16) | 3.2 | 4.7 | 16 MB | 1 × 8 | 680M | 2.2 | 768:48:8 12 CUs | 3379.2 | 45 W | Jan 4, 2022 |
| Ryzen 7 | 6800HS | 8 (16) | 3.2 | 4.7 | 16 MB | 1 × 8 | 680M | 2.2 | 768:48:8 12 CUs | 3379.2 | 35 W | Jan 4, 2022 |
| Ryzen 7 | 6800U | 8 (16) | 2.7 | 4.7 | 16 MB | 1 × 8 | 680M | 2.2 | 768:48:8 12 CUs | 3379.2 | 15–28 W | Jan 4, 2022 |
| Ryzen 5 | 6600H | 6 (12) | 3.3 | 4.5 | 16 MB | 1 × 6 | 660M | 1.9 | 384:24:8 6 CUs | 1459.2 | 45 W | Jan 4, 2022 |
| Ryzen 5 | 6600HS | 6 (12) | 3.3 | 4.5 | 16 MB | 1 × 6 | 660M | 1.9 | 384:24:8 6 CUs | 1459.2 | 35 W | Jan 4, 2022 |
| Ryzen 5 | 6600U | 6 (12) | 2.9 | 4.5 | 16 MB | 1 × 6 | 660M | 1.9 | 384:24:8 6 CUs | 1459.2 | 15–28 W | Jan 4, 2022 |
* v
* t
* e
* ↑ Core Complexes (CCX) × cores per CCX
* ↑ Unified shaders : texture mapping units : render output units and compute units (CU)
* ↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
* 1 2 3 4 5 6 7 8 Model also available as PRO version (6650U, 6650H, 6650HS, 6850U, 6850H, 6850HS, 6950H, 6950HS), released on April 19, 2022.

### Ryzen 7000 series
#### Mendocino (7020 series, Zen 2/RDNA2 based)

Common features of Ryzen 7020 notebook APUs:
* Socket: FT6
* All the CPUs support LPDDR5-5500 in dual-channel mode.
* L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
* L2 cache: 512 KB per core.
* All the CPUs support 4 PCIe 3.0 lanes.
* Native USB 4 (40Gbps) Ports: 0
* Native USB 3.2 Gen 2 (10Gbps) Ports: 1
* Includes integrated RDNA 2 GPU.
* Fabrication process: TSMC N6 FinFET.
| Branding and Model | Branding and Model | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | TDP | Release date |
| Branding and Model | Branding and Model | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | Core config | Model | Clock (GHz) | Processing power (GFLOPS) | TDP | Release date |
| Branding and Model | Branding and Model | Cores (threads) | Base | Boost | L3 cache (total) | Core config | Model | Clock (GHz) | Processing power (GFLOPS) | TDP | Release date |
| Ryzen 5 | 7520U | 4 (8) | 2.8 | 4.3 | 4 MB | 1 × 4 | 610M 2 CU | 1.9 | 486.4 | 15 W | September 20, 2022 |
| Ryzen 3 | 7320U | 4 (8) | 2.4 | 4.1 | 4 MB | 1 × 4 | 610M 2 CU | 1.9 | 486.4 | 15 W | September 20, 2022 |
* v
* t
* e
* ↑ Core Complexes (CCX) × cores per CCX
* ↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
* 1 2 Model also available as Chromebook optimized version as 7520C and 7320C released on May 23, 2023

#### Barcelo-R (7030 series, Zen 3/GCN5 based)

Common features of Ryzen 7030 notebook APUs:
* Socket: FP6.
* All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode.
* L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
* L2 cache: 512 KB per core.
* All the CPUs support 16 PCIe 3.0 lanes.
* Native USB 4 (40Gbps) Ports: 0
* Native USB 3.2 Gen 2 (10Gbps) Ports: 2
* Includes integrated GCN 5th generation GPU.
* Fabrication process: TSMC N7 FinFET.
| Branding and Model | Branding and Model | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | TDP | Release date |
| Branding and Model | Branding and Model | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | Core config | Model | Clock (GHz) | Processing power (GFLOPS) | TDP | Release date |
| Branding and Model | Branding and Model | Cores (threads) | Base | Boost | L3 cache (total) | Core config | Model | Clock (GHz) | Processing power (GFLOPS) | TDP | Release date |
| Ryzen 7 | (PRO) 7730U | 8 (16) | 2.0 | 4.5 | 16 MB | 1 × 8 | Vega 8 CU | 2.0 | 2048 | 15 W | January 4, 2023 |
| Ryzen 5 | (PRO) 7530U | 6 (12) | 2.0 | 4.5 | 16 MB | 1 × 6 | Vega 7 CU | 2.0 | 1792 | 15 W | January 4, 2023 |
| Ryzen 5 | 7430U | 6 (12) | 2.3 | 4.3 | 16 MB | 1 × 6 | Vega 7 CU | 1.8 | 1612.8 | 15 W | Q4 2023 |
| Ryzen 3 | (PRO) 7330U | 4 (8) | 2.3 | 4.3 | 8 MB | 1 × 4 | Vega 6 CU | 1.8 | 1382.4 | 15 W | January 4, 2023 |
* v
* t
* e
* ↑ Core Complexes (CCX) × cores per CCX
* ↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

#### Rembrandt-R (7035 series, Zen 3+/RDNA2 based)

Common features of Ryzen 7035 notebook APUs:
* Socket: FP7, FP7r2.
* All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
* L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
* L2 cache: 512 KB per core.
* All the CPUs support 16 PCIe 4.0 lanes.
* Native USB 4 (40Gbps) Ports: 0
* Native USB 3.2 Gen 2 (10Gbps) Ports: 2
* Includes integrated RDNA 2 GPU.
* Fabrication process: TSMC N6 FinFET.
| Branding and model | Branding and model | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | TDP | Release date |
| Branding and model | Branding and model | Cores (threads) | Clock (GHz) | Clock (GHz) | L3 cache (total) | Core config | Model | Clock (GHz) | Processing power (GFLOPS) | TDP | Release date |
| Branding and model | Branding and model | Cores (threads) | Base | Boost | L3 cache (total) | Core config | Model | Clock (GHz) | Processing power (GFLOPS) | TDP | Release date |
| Ryzen 7 | 7735HS | 8 (16) | 3.2 | 4.75 | 16 MB | 1 × 8 | 680M 12 CU | 2.2 | 3379.2 | 35–54 W | April 30, 2023 |
| Ryzen 7 | 7735H | 8 (16) | 3.2 | 4.75 | 16 MB | 1 × 8 | 680M 12 CU | 2.2 | 3379.2 | 35–54 W | April 30, 2023 |
| Ryzen 7 | 7736U | 8 (16) | 2.7 | 4.7 | 16 MB | 1 × 8 | 680M 12 CU | 2.2 | 3379.2 | 15–28 W | January 4, 2023 |
| Ryzen 7 | 7735U | 8 (16) | 2.7 | 4.75 | 16 MB | 1 × 8 | 680M 12 CU | 2.2 | 3379.2 | 15–30 W | January 4, 2023 |
| Ryzen 7 | 7435HS | 8 (16) | 3.1 | 4.5 | 16 MB | 1 × 8 | — | — | — | 35–54 W | 2024 |
| Ryzen 7 | 7435H | 8 (16) | 3.1 | 4.5 | 16 MB | 1 × 8 | — | — | — | 35–54 W | 2024 |
| Ryzen 5 | 7535HS | 6 (12) | 3.3 | 4.55 | 16 MB | 1 × 6 | 660M 6 CU | 1.9 | 1459.2 | 35–54 W | April 30, 2023 |
| Ryzen 5 | 7535H | 6 (12) | 3.3 | 4.55 | 16 MB | 1 × 6 | 660M 6 CU | 1.9 | 1459.2 | 35–54 W | April 30, 2023 |
| Ryzen 5 | 7535U | 6 (12) | 2.9 | 4.55 | 16 MB | 1 × 6 | 660M 6 CU | 1.9 | 1459.2 | 15–30 W | January 4, 2023 |
| Ryzen 5 | 7235HS | 4 (8) | 3.2 | 4.2 | 8 MB | 1 × 4 | — | — | — | 35–53 W | 2024 |
| Ryzen 5 | 7235H | 4 (8) | 3.2 | 4.2 | 8 MB | 1 × 4 | — | — | — | 35–53 W | 2024 |
| Ryzen 3 | 7335U | 4 (8) | 3.0 | 4.3 | 8 MB | 1 × 4 | 660M 4 CU | 1.8 | 921.6 | 15–30 W | January 4, 2023 |
* v
* t
* e
* ↑ Core Complexes (CCX) × cores per CCX
* ↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

#### Phoenix (7040 series, Zen 4/RDNA3/XDNA based)

Common features of Ryzen 7040 notebook APUs:
* Socket: FP7, FP7r2, FP8.
* All the CPUs support DDR5-5600 or LPDDR5X-7500 in dual-channel mode.
* L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
* L2 cache: 1 MB per core.
* All models support AVX-512 using a half-width 256-bit FPU.
* PCIe 4.0 support.
* Native USB 4 (40Gbps) Ports: 2
* Native USB 3.2 Gen 2 (10Gbps) Ports: 2
* Includes integrated RDNA 3 GPU.
* Includes XDNA AI Engine (Ryzen AI).
* Fabrication process: TSMC N4 FinFET.
| Branding and model | Branding and model | CPU | CPU | CPU | CPU | CPU | CPU | CPU | GPU | GPU | NPU | PCIe (lanes) | TDP | Release date |
| Branding and model | Branding and model | Cores (threads) | Cores (threads) | Cores (threads) | Clock (GHz) | Clock (GHz) | L3 cache (total) | Core config | Model | Clock (GHz) | NPU | PCIe (lanes) | TDP | Release date |
| Branding and model | Branding and model | Total | Zen 4 | Zen 4c | Base | Boost | L3 cache (total) | Core config | Model | Clock (GHz) | NPU | PCIe (lanes) | TDP | Release date |
| Ryzen 9 | (PRO) 7940HS | 8 (16) | 8 (16) | — | 4.0 | 5.2 | 16 MB | 1 × 8 | 780M 12 CU | 2.8 | Ryzen AI Up to 10 TOPS | 20 | 35–54 W | April 30, 2023 |
| Ryzen 9 | 7940H | 8 (16) | 8 (16) | — | 4.0 | 5.2 | 16 MB | 1 × 8 | 780M 12 CU | 2.8 | Ryzen AI Up to 10 TOPS | 20 | 35–54 W | April 30, 2023 |
| Ryzen 7 | (PRO) 7840HS | 8 (16) | 8 (16) | — | 3.8 | 5.1 | 16 MB | 1 × 8 | 780M 12 CU | 2.7 | Ryzen AI Up to 10 TOPS | 20 | 35–54 W | April 30, 2023 |
| Ryzen 7 | 7840H | 8 (16) | 8 (16) | — | 3.8 | 5.1 | 16 MB | 1 × 8 | 780M 12 CU | 2.7 | Ryzen AI Up to 10 TOPS | 20 | 35–54 W | April 30, 2023 |
| Ryzen 7 | (PRO) 7840U | 8 (16) | 8 (16) | — | 3.3 | 5.1 | 16 MB | 1 × 8 | 780M 12 CU | 2.7 | Ryzen AI Up to 10 TOPS | 20 | 15–30 W | May 3, 2023 |
| Ryzen 5 | (PRO) 7640HS | 6 (12) | 6 (12) | — | 4.3 | 5.0 | 16 MB | 1 × 6 | 760M 8 CU | 2.6 | Ryzen AI Up to 10 TOPS | 20 | 35–54 W | April 30, 2023 |
| Ryzen 5 | 7640H | 6 (12) | 6 (12) | — | 4.3 | 5.0 | 16 MB | 1 × 6 | 760M 8 CU | 2.6 | Ryzen AI Up to 10 TOPS | 20 | 35–54 W | April 30, 2023 |
| Ryzen 5 | (PRO) 7640U | 6 (12) | 6 (12) | — | 3.5 | 4.9 | 16 MB | 1 × 6 | 760M 8 CU | 2.6 | Ryzen AI Up to 10 TOPS | 20 | 15–30 W | May 3, 2023 |
| Ryzen 5 | (PRO) 7545U | 6 (12) | 2 (4) | 4 (8) | 3.7 / 3.0 | 4.9 / 3.5 | 16 MB | 2 + 4 | 740M 4 CU | 2.8 | No | 14 | 15–30 W | November 2, 2023 |
| Ryzen 5 | (PRO) 7540U | 6 (12) | 6 (12) | — | 3.2 | 4.9 | 16 MB | 1 × 6 | 740M 4 CU | 2.5 | No | 14 | 15–30 W | May 3, 2023 |
| Ryzen 3 | 7440U | 4 (8) | 1 (2) | 3 (6) | 3.6 / 2.8 | 4.7 / 3.3 | 8 MB | 1 + 3 | 740M 4 CU | 2.5 | No | 14 | 15–30 W | May 3, 2023 |
* v
* t
* e
* ↑ Core Complexes (CCX) × cores per CCX or Zen 4 + Zen 4c cores
* 1 2 3 4 5 PRO versions launched on 13 June 2023.
* 1 2 3 China-only version of the HS SKU that lacks support for AMD EXPO and FreeSync technologies.
* 1 2 Zen 4 cores' base frequency / Zen 4c cores' base frequency
* 1 2 Zen 4 cores' boost frequency / Zen 4c cores' boost frequency

#### Dragon Range (7045 series, Zen 4/RDNA2 based)

Common features of Ryzen 7045 notebook CPUs:
* Socket: FL1.
* All the CPUs support DDR5-5200 in dual-channel mode.
* L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
* L2 cache: 1 MB per core.
* All the CPUs support 28 PCIe 5.0 lanes.
* Native USB 4 (40Gbps) Ports: 0
* Native USB 3.2 Gen 2 (10Gbps) Ports: 4
* Includes integrated RDNA 2 GPU on the I/O die with 2 CUs and clock speeds of 400 MHz (base), 2.2 GHz (boost).
* Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O and graphics die).
| Branding and model | Branding and model | Cores (threads) | Clock (GHz) | Clock (GHz) | L3 cache (total) | Chiplets | Core config | TDP | Release date |
| Branding and model | Branding and model | Cores (threads) | Base | Boost | L3 cache (total) | Chiplets | Core config | TDP | Release date |
| Ryzen 9 | 7945HX3D | 16 (32) | 2.3 | 5.4 | 128 MB | 2 × CCD 1 × I/OD | 2 × 8 | 55–75 W | July 27, 2023 |
| Ryzen 9 | 7945HX | 16 (32) | 2.5 | 5.4 | 64 MB | 2 × CCD 1 × I/OD | 2 × 8 | 55–75 W | February 28, 2023 |
| Ryzen 9 | 7940HX | 16 (32) | 2.4 | 5.2 | 64 MB | 2 × CCD 1 × I/OD | 2 × 8 | 55–75 W | January 17, 2024 |
| Ryzen 9 | 7845HX | 12 (24) | 3.0 | 5.2 | 64 MB | 2 × CCD 1 × I/OD | 2 × 6 | 45–75 W | February 28, 2023 |
| Ryzen 7 | 7840HX | 12 (24) | 2.9 | 5.1 | 64 MB | 2 × CCD 1 × I/OD | 2 × 6 | 45–75 W | January 17, 2024 |
| Ryzen 7 | 7745HX | 8 (16) | 3.6 | 5.1 | 32 MB | 1 × CCD 1 × I/OD | 1 × 8 | 45–75 W | February 28, 2023 |
| Ryzen 5 | 7645HX | 6 (12) | 4.0 | 5.0 | 32 MB | 1 × CCD 1 × I/OD | 1 × 6 | 45–75 W | February 28, 2023 |
* v
* t
* e
* ↑ Core Complexes (CCX) × cores per CCX
* ↑ Self identifies as "AMD Radeon 610M". See RDNA 2 § Integrated graphics processors (iGPs).
* ↑ Only one of the two CCXes has additional 64 MB of 3D V-Cache. Only the CCX without 3D V-Cache will be able to reach the maximum boost clocks. The CCX with 3D V-Cache will clock lower.

### Ryzen 8000 series
#### Hawk Point (8040 series, Zen 4/RDNA3/XDNA based)

Key features of Ryzen 8040 notebook APUs:
* Socket: BGA (FP7, FP7r2 or FP8 type packages).
* All models support DDR5-5600 or LPDDR5X-7500 in 128-bit "dual-channel" mode.
* CPU uses Zen4 cores (Phoenix) or a combination of Zen4 and Zen4c cores (Phoenix2).
* GPU uses the RDNA 3 (Navi 3) architecture.
* Some models include first generation Ryzen AI NPU (XDNA).
* All models support AVX-512 using a half-width 256-bit FPU.
* PCIe 4.0 support.
* Native USB 4 (40Gbps) Ports: 2
* Native USB 3.2 Gen 2 (10Gbps) Ports: 2
* Fabrication process: TSMC N4 FinFET.
| Branding and model | Branding and model | CPU | CPU | CPU | CPU | CPU | CPU | CPU | GPU | GPU | NPU | PCIe (lanes) | TDP | Release date |
| Branding and model | Branding and model | Cores (threads) | Cores (threads) | Cores (threads) | Clock (GHz) | Clock (GHz) | L3 cache (total) | Core config | Model | Clock (GHz) | NPU | PCIe (lanes) | TDP | Release date |
| Branding and model | Branding and model | Total | Zen 4 | Zen 4c | Base | Boost | L3 cache (total) | Core config | Model | Clock (GHz) | NPU | PCIe (lanes) | TDP | Release date |
| Ryzen 9 | 8945HS | 8 (16) | 8 (16) | — | 4.0 | 5.2 | 16 MB | 1 × 8 | Radeon 780M 12 CU | 2.8 | Ryzen AI up to 16 TOPS | 20 | 35-54 W | December 6, 2023 |
| Ryzen 7 | 8845HS | 8 (16) | 8 (16) | — | 3.8 | 5.1 | 16 MB | 1 × 8 | Radeon 780M 12 CU | 2.7 | Ryzen AI up to 16 TOPS | 20 | 35-54 W | December 6, 2023 |
| Ryzen 7 | 8840HS | 8 (16) | 8 (16) | — | 3.3 | 5.1 | 16 MB | 1 × 8 | Radeon 780M 12 CU | 2.7 | Ryzen AI up to 16 TOPS | 20 | 20-30 W | December 6, 2023 |
| Ryzen 7 | 8840U | 8 (16) | 8 (16) | — | 3.3 | 5.1 | 16 MB | 1 × 8 | Radeon 780M 12 CU | 2.7 | Ryzen AI up to 16 TOPS | 20 | 15-30 W | December 6, 2023 |
| Ryzen 5 | 8645HS | 6 (12) | 6 (12) | — | 4.3 | 5.0 | 16 MB | 1 × 6 | Radeon 760M 8 CU | 2.6 | Ryzen AI up to 16 TOPS | 20 | 35-54 W | December 6, 2023 |
| Ryzen 5 | 8640HS | 6 (12) | 6 (12) | — | 3.5 | 4.9 | 16 MB | 1 × 6 | Radeon 760M 8 CU | 2.6 | Ryzen AI up to 16 TOPS | 20 | 20-30 W | December 6, 2023 |
| Ryzen 5 | 8640U | 6 (12) | 6 (12) | — | 3.5 | 4.9 | 16 MB | 1 × 6 | Radeon 760M 8 CU | 2.6 | Ryzen AI up to 16 TOPS | 20 | 15-30 W | December 6, 2023 |
| Ryzen 5 | 8540U | 6 (12) | 2 (4) | 4 (8) | 3.7 / 3.0 | 4.9 / 3.5 | 16 MB | 2 + 4 | Radeon 740M 4 CU | 2.8 | No | 14 | 15-30 W | December 6, 2023 |
| Ryzen 3 | 8440U | 4 (8) | 1 (2) | 3 (6) | 3.6 / 2.8 | 4.7 / 3.3 | 8 MB | 1 + 3 | Radeon 740M 4 CU | 2.5 | No | 14 | 15-30 W | December 6, 2023 |
* v
* t
* e
* ↑ Core Complexes (CCX) × cores per CCX or Zen 4 + Zen 4c cores
* 1 2 Zen 4 cores' base frequency / Zen 4c cores' base frequency
* 1 2 Zen 4 cores' boost frequency / Zen 4c cores' boost frequency

### Ryzen 200 series
#### Hawk Point Refresh (200 series, Zen 4/RDNA3/XDNA based)

| Branding and Model | Branding and Model | CPU | CPU | CPU | CPU | CPU | CPU | CPU | GPU | GPU | NPU (Ryzen AI) | TDP | Release date |
| Branding and Model | Branding and Model | Cores (threads) | Cores (threads) | Cores (threads) | Clock (GHz) | Clock (GHz) | L3 cache (total) | Core config | Model | Clock (GHz) | NPU (Ryzen AI) | TDP | Release date |
| Branding and Model | Branding and Model | Total | Zen 4 | Zen 4c | Base | Boost | L3 cache (total) | Core config | Model | Clock (GHz) | NPU (Ryzen AI) | TDP | Release date |
| Ryzen 9 | 270 | 8 (16) | 8 (16) | — | 4.0 | 5.2 | 16 MB | 1 × 8 | 780M 12 CU | 2.8 | 16 TOPS | 35–54 W | Q2 2025 |
| Ryzen 7 | 260 | 8 (16) | 8 (16) | — | 3.8 | 5.1 | 16 MB | 1 × 8 | 780M 12 CU | 2.7 | 16 TOPS | 35–54 W | Q2 2025 |
| Ryzen 7 | (PRO) 250 | 8 (16) | 8 (16) | — | 3.3 | 5.1 | 16 MB | 1 × 8 | 780M 12 CU | 2.7 | 16 TOPS | 15–30 W | Q2 2025 |
| Ryzen 5 | 240 | 6 (12) | 6 (12) | — | 4.3 | 5.0 | 16 MB | 1 × 6 | 760M 8 CU | 2.6 | 16 TOPS | 35–54 W | Q2 2025 |
| Ryzen 5 | (PRO) 230 | 6 (12) | 6 (12) | — | 3.5 | 4.9 | 16 MB | 1 × 6 | 760M 8 CU | 2.6 | 16 TOPS | 15–30 W | Q2 2025 |
| Ryzen 5 | (PRO) 220 | 6 (12) | 2 (4) | 4 (8) | 3.7 / 3.0 | 4.9 / 3.5 | 16 MB | 2 + 4 | 740M 4 CU | 2.8 | — | 15–30 W | Q2 2025 |
| Ryzen 3 | (PRO) 210 | 4 (8) | 1 (2) | 3 (6) | 3.6 / 2.8 | 4.7 / 3.3 | 8 MB | 1 + 3 | 740M 4 CU | 2.5 | — | 15–30 W | Q2 2025 |

### Ryzen AI 300 series
#### Strix Point and Krackan Point (Zen 5/RDNA3.5/XDNA2 based)

Common features of Ryzen AI 300 notebook APUs:
* Socket: BGA, FP8 package type.
* All models support DDR5-5600 or LPDDR5X-7500 in dual-channel mode.
* All models support 16 PCIe 4.0 lanes.
* Native USB 4 (40Gbps) Ports: 2
* Native USB 3.2 Gen 2 (10Gbps) Ports: 2
* iGPU uses the RDNA 3.5 microarchitecture.
* NPU uses the XDNA 2 AI Engine (Ryzen AI).
* Both Zen5 and Zen5c cores support AVX-512 using a half-width 256-bit FPU.
* L1 cache: 80 KB (48 KB data + 32 KB instruction) per core.
* L2 cache: 1 MB per core.
* Fabrication process: TSMC N4P FinFET.
| Branding and model | Branding and model | CPU | CPU | CPU | CPU | CPU | CPU | GPU | GPU | NPU (Ryzen AI) | TDP | Release date |
| Branding and model | Branding and model | Cores (threads) | Cores (threads) | Cores (threads) | Clock (GHz) | Clock (GHz) | L3 cache (total) | Model | Clock (GHz) | NPU (Ryzen AI) | TDP | Release date |
| Branding and model | Branding and model | Total | Zen 5 | Zen 5c | Base | Boost | L3 cache (total) | Model | Clock (GHz) | NPU (Ryzen AI) | TDP | Release date |
| Ryzen AI 9 | (PRO) HX 375 | 12 (24) | 4 (8) | 8 (16) | 2.0 | 5.1 | 24 MB | 890M 16 CUs | 2.9 | 55 TOPS | 15–54 W | June 2, 2024 |
| Ryzen AI 9 | (PRO) HX 370 | 12 (24) | 4 (8) | 8 (16) | 2.0 | 5.1 | 24 MB | 890M 16 CUs | 2.9 | 50 TOPS | 15–54 W | June 2, 2024 |
| Ryzen AI 9 | 365 | 10 (20) | 4 (8) | 6 (12) | 2.0 | 5.0 | 24 MB | 880M 12 CUs | 2.9 | 50 TOPS | 15–54 W | June 2, 2024 |
| Ryzen AI 7 | PRO 360 | 8 (16) | 3 (6) | 5 (10) | 2.0 | 5.0 | 16 MB | 880M 12 CUs | 2.9 | 50 TOPS | 15–54 W | October 10, 2024 |
| Ryzen AI 7 | (PRO) 350 | 8 (16) | 4 (8) | 4 (8) | 2.0 | 5.0 | 16 MB | 860M 8 CU | 3.0 | 50 TOPS | 15–54 W | Q1 2025 |
| Ryzen AI 5 | (PRO) 340 | 6 (12) | 3 (6) | 3 (6) | 2.0 | 4.8 | 16 MB | 840M 4 CU | 2.9 | 50 TOPS | 15–54 W | Q1 2025 |
* v
* t
* e
* ↑ This is the maximum frequency for Zen 5 cores. Zen 5c cores boost to 3.3GHz.

#### Strix Halo (Zen 5/RDNA3.5/XDNA2 based)

| Branding and Model | Branding and Model | CPU | CPU | CPU | CPU | GPU | GPU | NPU (Ryzen AI) | Chiplets | Core config | TDP | Release date |
| Branding and Model | Branding and Model | Cores (threads) | Clock (GHz) | Clock (GHz) | L3 cache (total) | Model | Clock (GHz) | NPU (Ryzen AI) | Chiplets | Core config | TDP | Release date |
| Branding and Model | Branding and Model | Cores (threads) | Base | Boost | L3 cache (total) | Model | Clock (GHz) | NPU (Ryzen AI) | Chiplets | Core config | TDP | Release date |
| Ryzen AI MAX+ | (PRO) 395 | 16 (32) | 3.0 | 5.1 | 64 MB | 8060S 40 CUs | 2.9 | 50 TOPS | 2 × CCD 1 × I/OD with GPU | 2 × 8 | 45–120 W | Q1 2025 |
| Ryzen AI MAX | (PRO) 390 | 12 (24) | 3.2 | 5.0 | 64 MB | 8050S 32 CUs | 2.8 | 50 TOPS | 2 × CCD 1 × I/OD with GPU | 2 × 6 | 45–120 W | Q1 2025 |
| Ryzen AI MAX | (PRO) 385 | 8 (16) | 3.6 | 5.0 | 32 MB | 8050S 32 CUs | 2.8 | 50 TOPS | 1 × CCD 1 × I/OD with GPU | 1 × 8 | 45–120 W | Q1 2025 |
| Ryzen AI MAX | PRO 380 | 6 (12) | 3.6 | 4.9 | 16 MB | 8040S 16 CUs | 2.8 | 50 TOPS | 1 × CCD 1 × I/OD with GPU | 1 × 6 | 45–120 W | Q1 2025 |

### Ryzen 9000 series
#### Fire Range (Zen 5/RDNA2 based)

| Branding and Model | Branding and Model | Cores (threads) | Clock (GHz) | Clock (GHz) | L3 cache (total) | Chiplets | Core config | TDP | Release date |
| Branding and Model | Branding and Model | Cores (threads) | Base | Boost | L3 cache (total) | Chiplets | Core config | TDP | Release date |
| Ryzen 9 | 9955HX3D | 16 (32) | 2.3 | 5.4 | 128 MB | 2 × CCD 1 × I/OD | 2 × 8 | 54 W | 1H 2025 |
| Ryzen 9 | 9955HX | 16 (32) | 2.5 | 5.4 | 64 MB | 2 × CCD 1 × I/OD | 2 × 8 | 54 W | 1H 2025 |
| Ryzen 9 | 9850HX | 12 (24) | 3.0 | 5.2 | 64 MB | 2 × CCD 1 × I/OD | 2 × 6 | 54 W | 1H 2025 |

## Handheld gaming PC processors
### Ryzen Z1 series (Zen 4/RDNA3 based)

Common features of Ryzen Z1 handheld APUs:
* Socket: FP7, FP7r2, FP8.
* All the CPUs support DDR5-5600 or LPDDR5X-7500 in dual-channel mode.
* L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
* L2 cache: 1 MB per core.
* All the CPUs support 20 PCIe 4.0 lanes.
* Includes integrated RDNA 3 GPU.
* Fabrication process: TSMC 4 nm FinFET.
| Branding and model | Branding and model | CPU | CPU | CPU | CPU | CPU | CPU | CPU | GPU | GPU | TDP | Release date |
| Branding and model | Branding and model | Cores (threads) | Cores (threads) | Cores (threads) | Clock (GHz) | Clock (GHz) | L3 cache (total) | Core config | Model | Clock (GHz) | TDP | Release date |
| Branding and model | Branding and model | Total | Zen 4 | Zen 4c | Base | Boost | L3 cache (total) | Core config | Model | Clock (GHz) | TDP | Release date |
| Ryzen | Z1 Extreme | 8 (16) | 8 (16) | — | 3.3 | 5.1 | 16 MB | 1 × 8 | 780M 12 CU | 2.7 | 9–30 W | May 2023 |
| Ryzen | Z1 | 6 (12) | 2 (4) | 4 (8) | 3.2 | 4.9 | 16 MB | 2 + 4 | 740M 4 CU | 2.5 | 9–30 W | May 2023 |
* v
* t
* e
* ↑ Core Complexes (CCX) × cores per CCX or Zen 4 + Zen 4c cores

### Ryzen Z2 series (Zen (3+/4/5)/RDNA(2/3/3.5) based)

| Branding and Model | Branding and Model | CPU | CPU | CPU | CPU | CPU | CPU | CPU | GPU | GPU | TDP | Release date |
| Branding and Model | Branding and Model | Cores (threads) | Cores (threads) | Cores (threads) | Clock (GHz) | Clock (GHz) | L3 cache (total) | Core config | Model | Clock (GHz) | TDP | Release date |
| Branding and Model | Branding and Model | Total | Zen 3+/4/5 | Zen 5c | Base | Boost | L3 cache (total) | Core config | Model | Clock (GHz) | TDP | Release date |
| Ryzen | Z2 Extreme | 8 (16) | 3 (6) (Zen 5) | 5 (10) (Zen 5c) | 2.0 | 5.0 | 16 MB | 3 + 5 | 890M 16 CU | | 15–35 W | Q1 2025 |
| Ryzen | Z2 | 8 (16) | 8 (16) (Zen 4) | — | 3.3 | 5.1 | 16 MB | 1 × 8 | 780M 12 CU | | 15–30 W | Q1 2025 |
| Ryzen | Z2 Go | 4 (8) | 4 (8) (Zen 3+) | — | 3.0 | 4.3 | 8 MB | 1 × 4 | 680M 12 CU | | 15–30 W | Q1 2025 |

## Embedded processors
### 1000 series
#### Great Horned Owl (V1000 series, Zen/GCN5 based)

| Model | Release date | Fab | CPU | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | GPU | Memory support | TDP | Junction temp. range (°C) |
| Model | Release date | Fab | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | Cache | Cache | Cache | Model | Config | Clock (GHz) | Processing power (GFLOPS) | Memory support | TDP | Junction temp. range (°C) |
| Model | Release date | Fab | Cores (threads) | Base | Boost | L1 | L2 | L3 | Model | Config | Clock (GHz) | Processing power (GFLOPS) | Memory support | TDP | Junction temp. range (°C) |
| V1202B | February 2018 | GloFo 14LP | 2 (4) | 2.3 | 3.2 | 64 KB inst. 32 KB data per core | 512 KB per core | 4 MB | Vega 3 | 192:12:16 3 CU | 1.0 | 384 | DDR4-2400 dual-channel | 12–25 W | 0–105 |
| V1404I | December 2018 | GloFo 14LP | 4 (8) | 2.0 | 3.6 | 64 KB inst. 32 KB data per core | 512 KB per core | 4 MB | Vega 8 | 512:32:16 8 CU | 1.1 | 1126.4 | DDR4-2400 dual-channel | 12–25 W | -40–105 |
| V1500B | December 2018 | GloFo 14LP | 4 (8) | 2.2 | — | 64 KB inst. 32 KB data per core | 512 KB per core | 4 MB | — | — | — | — | DDR4-2400 dual-channel | 12–25 W | 0–105 |
| V1605B | February 2018 | GloFo 14LP | 4 (8) | 2.0 | 3.6 | 64 KB inst. 32 KB data per core | 512 KB per core | 4 MB | Vega 8 | 512:32:16 8 CU | 1.1 | 1126.4 | DDR4-2400 dual-channel | 12–25 W | 0–105 |
| V1756B | February 2018 | GloFo 14LP | 4 (8) | 3.25 | 3.6 | 64 KB inst. 32 KB data per core | 512 KB per core | 4 MB | Vega 8 | 512:32:16 8 CU | 1.1 | 1126.4 | DDR4-3200 dual-channel | 35–54 W | 0–105 |
| V1780B | December 2018 | GloFo 14LP | 4 (8) | 3.35 | 3.6 | 64 KB inst. 32 KB data per core | 512 KB per core | 4 MB | — | — | — | — | | | | DDR4-3200 dual-channel | 35–54 W | 0–105 |
| V1807B | February 2018 | GloFo 14LP | 4 (8) | 3.35 | 3.8 | 64 KB inst. 32 KB data per core | 512 KB per core | 4 MB | Vega 11 | 704:44:16 11 CU | 1.3 | 1830.4 | DDR4-3200 dual-channel | 35–54 W | 0–105 |
* v
* t
* e
* ↑ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
* ↑ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

#### Banded Kestrel (R1000 series, Zen/GCN5 based)

| Model | Release date | Fab | CPU | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | GPU | Memory support | TDP |
| Model | Release date | Fab | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | Cache | Cache | Cache | Model | Config | Clock (GHz) | Processing power (GFLOPS) | Memory support | TDP |
| Model | Release date | Fab | Cores (threads) | Base | Boost | L1 | L2 | L3 | Model | Config | Clock (GHz) | Processing power (GFLOPS) | Memory support | TDP |
| R1102G | February 25, 2020 | GloFo 14LP | 2 (2) | 1.2 | 2.6 | 64 KB inst. 32 KB data per core | 512 KB per core | 4 MB | Vega 3 | 192:12:4 3 CU | 1.0 | 384 | DDR4-2400 single-channel | 6 W |
| R1305G | February 25, 2020 | GloFo 14LP | 2 (4) | 1.5 | 2.8 | 64 KB inst. 32 KB data per core | 512 KB per core | 4 MB | Vega 3 | 192:12:4 3 CU | 1.0 | 384 | DDR4-2400 dual-channel | 8-10 W |
| R1505G | April 16, 2019 | GloFo 14LP | 2 (4) | 2.4 | 3.3 | 64 KB inst. 32 KB data per core | 512 KB per core | 4 MB | Vega 3 | 192:12:4 3 CU | 1.0 | 384 | DDR4-2400 dual-channel | 12–25 W |
| R1606G | April 16, 2019 | GloFo 14LP | 2 (4) | 2.6 | 3.5 | 64 KB inst. 32 KB data per core | 512 KB per core | 4 MB | Vega 3 | 192:12:4 3 CU | 1.2 | 460.8 | DDR4-2400 dual-channel | 12–25 W |
* v
* t
* e
* ↑ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
* ↑ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

### 2000 series
#### Grey Hawk (V2000 series, Zen 2/GCN5 based)

| Model | Release date | Fab | CPU | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | GPU | Socket | PCIe support | Memory support | TDP |
| Model | Release date | Fab | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | Cache | Cache | Cache | Archi- tecture | Config | Clock (GHz) | Processing power (GFLOPS) | Socket | PCIe support | Memory support | TDP |
| Model | Release date | Fab | Cores (threads) | Base | Boost | L1 | L2 | L3 | Archi- tecture | Config | Clock (GHz) | Processing power (GFLOPS) | Socket | PCIe support | Memory support | TDP |
| V2516 | November 10, 2020 | TSMC 7FF | 6 (12) | 2.1 | 3.95 | 32 KB inst. 32 KB data per core | 512 KB per core | 8 MB | GCN 5 | 384:24:8 6 CU | 1.5 | 1152 | FP6 | 20 (8+4+4+4) PCIe 3.0 | DDR4-3200 dual-channel LPDDR4X-4266 quad-channel | 10–25 W |
| V2546 | November 10, 2020 | TSMC 7FF | 6 (12) | 3.0 | 3.95 | 32 KB inst. 32 KB data per core | 512 KB per core | 8 MB | GCN 5 | 384:24:8 6 CU | 1.5 | 1152 | FP6 | 20 (8+4+4+4) PCIe 3.0 | DDR4-3200 dual-channel LPDDR4X-4266 quad-channel | 35–54 W |
| V2718 | November 10, 2020 | TSMC 7FF | 8 (16) | 1.7 | 4.15 | 32 KB inst. 32 KB data per core | 512 KB per core | 8 MB | GCN 5 | 448:28:8 7 CU | 1.6 | 1433.6 | FP6 | 20 (8+4+4+4) PCIe 3.0 | DDR4-3200 dual-channel LPDDR4X-4266 quad-channel | 10–25 W |
| V2748 | November 10, 2020 | TSMC 7FF | 8 (16) | 2.9 | 4.25 | 32 KB inst. 32 KB data per core | 512 KB per core | 8 MB | GCN 5 | 448:28:8 7 CU | 1.6 | 1433.6 | FP6 | 20 (8+4+4+4) PCIe 3.0 | DDR4-3200 dual-channel LPDDR4X-4266 quad-channel | 35–54 W |
* v
* t
* e
* ↑ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
* ↑ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

#### River Hawk (R2000 series, Zen+ based)

| Model | Release date | Fab | CPU | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | GPU | Socket | PCIe support | Memory support | TDP |
| Model | Release date | Fab | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | Cache | Cache | Cache | Archi- tecture | Config | Clock (GHz) | Processing power (GFLOPS) | Socket | PCIe support | Memory support | TDP |
| Model | Release date | Fab | Cores (threads) | Base | Boost | L1 | L2 | L3 | Archi- tecture | Config | Clock (GHz) | Processing power (GFLOPS) | Socket | PCIe support | Memory support | TDP |
| R2312 | June 7, 2022 | GloFo 12LP | 2 (4) | 2.7 | 3.5 | 64 KB inst. 32 KB data per core | 512 KB per core | 4 MB | GCN 5 | 192:12:4 3 CU | 1.2 | 460.8 | FP5 | 8 lanes Gen 3 | DDR4-2400 dual-channel ECC | 10–25 W |
| R2314 | June 7, 2022 | GloFo 12LP | 4 (4) | 2.1 | 3.5 | 64 KB inst. 32 KB data per core | 512 KB per core | 4 MB | GCN 5 | 384:24:8 6 CU | 1.2 | 921.6 | FP5 | 16 lanes Gen 3 | DDR4-2666 dual-channel ECC | 10–35 W |
* v
* t
* e
* ↑ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
* ↑ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

### 3000 series
#### (V3000 series, Zen 3 based)

| Model | Release date | Fab | CPU | CPU | CPU | CPU | CPU | CPU | Socket | PCIe support | Memory support | TDP |
| Model | Release date | Fab | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | Cache | Cache | Cache | | | Socket | PCIe support | Memory support | TDP |
| Model | Release date | Fab | Cores (threads) | Base | Boost | L1 | L2 | L3 | Socket | PCIe support | Memory support | TDP |
| V3C14 | September 27, 2022 | TSMC 7FF | 4 (8) | 2.3 | 3.8 | 32 KB inst. 32 KB data per core | 512 KB per core | 8 MB | FP7r2 | 20 (8+4+4+4) PCIe 4.0 | DDR5-4800 dual-channel | 15 W |
| V3C44 | September 27, 2022 | TSMC 7FF | 4 (8) | 3.5 | 3.8 | 32 KB inst. 32 KB data per core | 512 KB per core | 8 MB | FP7r2 | 20 (8+4+4+4) PCIe 4.0 | DDR5-4800 dual-channel | 45 W |
| V3C16 | September 27, 2022 | TSMC 7FF | 6 (12) | 2.0 | 3.8 | 32 KB inst. 32 KB data per core | 512 KB per core | 16 MB | FP7r2 | 20 (8+4+4+4) PCIe 4.0 | DDR5-4800 dual-channel | 15 W |
| V3C18I | September 27, 2022 | TSMC 7FF | 8 (16) | 1.9 | 3.8 | 32 KB inst. 32 KB data per core | 512 KB per core | 16 MB | FP7r2 | 20 (8+4+4+4) PCIe 4.0 | DDR5-4800 dual-channel | 15 W |
| V3C48 | September 27, 2022 | TSMC 7FF | 8 (16) | 3.3 | 3.8 | 32 KB inst. 32 KB data per core | 512 KB per core | 16 MB | FP7r2 | 20 (8+4+4+4) PCIe 4.0 | DDR5-4800 dual-channel | 45 W |
* v
* t
* e

### 7000 series
#### (Ryzen Embedded 7000 series, Zen 4/RDNA2 based)

Common features of Ryzen Embedded 7000 series CPUs:
* Socket: AM5.
* All the CPUs support ECC DDR5-5200 dual-channel mode.
* L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
* L2 cache: 1 MB per core.
* All the CPUs support 28 PCIe 5.0 lanes. 4 of the lanes are reserved as link to the chipset.
* Includes integrated RDNA 2 GPU with 2 CUs and boost clock speeds of 2200 MHz.
* Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O die).
| Processor branding | Model | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | Chiplets | Core config | TDP | Release date |
| Processor branding | Model | Cores (threads) | Base | Boost | L3 cache (total) | Chiplets | Core config | TDP | Release date |
| Ryzen Embedded | 7945 | 12 (24) | 3.7 | 5.4 | 64 MB | 2 × CCD 1 × I/OD | 2 × 6 | 65 W | Nov 14, 2023 |
| Ryzen Embedded | 7745 | 8 (16) | 3.8 | 5.3 | 32 MB | 1 × CCD 1 × I/OD | 1 × 8 | 65 W | Nov 14, 2023 |
| Ryzen Embedded | 7700X | 8 (16) | 4.5 | 5.4 | 32 MB | 1 × CCD 1 × I/OD | 1 × 8 | 105 W | Nov 14, 2023 |
| Ryzen Embedded | 7645 | 6 (12) | 3.8 | 5.1 | 32 MB | 1 × CCD 1 × I/OD | 1 × 6 | 65 W | Nov 14, 2023 |
| Ryzen Embedded | 7600X | 6 (12) | 4.7 | 5.3 | 32 MB | 1 × CCD 1 × I/OD | 1 × 6 | 105 W | Nov 14, 2023 |
* v
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* ↑ Core Complexes (CCX) × cores per CCX