# LGA 1700

LGA 1700 (Socket V) is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors Alder Lake and Raptor Lake, which was first released in November 2021.
LGA 1700 is designed as a replacement for LGA 1200 (known as Socket H5) and it has 1700 protruding pins to make contact with the pads on the processor. Compared to its predecessor, it has 500 more pins, which required a major change in socket and processor sizes; it is 7.5 mm longer. It is the first major change in Intel's LGA desktop CPU socket size since the introduction of LGA 775 in 2004, especially for consumer-grade CPU sockets. The larger size also required a change in the heatsink fastening holes configuration, making previously used cooling solutions incompatible with LGA 1700 motherboards and CPUs.

## Heatsink design

Since the introduction of land grid array (LGA)-based sockets in the consumer hardware space in 2004, the thermal solution hole pattern (the distance between centers of the screw-holes for the heatsink) has changed three times for Intel's mainstream platforms:
* For LGA 775, it is 72 mm × 72 mm
* For LGA 1156, LGA 1155, LGA 1150, LGA 1151 and LGA 1200 it is 75 mm × 75 mm
* For LGA 1700, LGA 1851, it is 78 mm × 78 mm
While some motherboards do offer additional mounting holes for using older coolers, e.g. for using an LGA115x cooler on an LGA1700 motherboard, differences in Z-height and the mounting pressure will result in worse than expected cooling performance. For best results it is recommended to either change the cooling solution to a model certified for this platform or request an updated mounting-kit for one of the higher-end solutions on the market. For heatsinks to be interchangeable, not only the hole pattern, but also the socket seating plane height, the maximum thermal solution center of gravity height from the IHS and the static total compressive minimum need to match.

## Issues

Even though some CPU cooler manufacturers are providing adapter kits (usually in the form of different screws) to go with existing LGA115x and LGA1200 retention brackets, there have been reports of the CPU bending or bowing due to uneven mounting pressure from the LGA 1700 integrated loading mechanism (ILM). This leads to the CPU having reduced contact with the cooler plate, which in turn leads to increased temperatures. LGA 1700 contact frames to replace the stock ILM have been released by Thermal Grizzly and Thermalright to ensure even CPU mounting pressure and cooler contact.

## Maximum RAM

Initially motherboards based on Alder Lake and Raptor Lake chipsets supported 32 GB memory modules but most known OEMs in 2023 updated BIOS'es to support 48 GB modules and in December 2023 support for 64 GB modules started to roll out first by MSI and ASRock. Users are advised to consult with their motherboards web support pages to check what memory modules can be installed.

## Alder Lake chipsets (600 series)

| | | | H610 | B660 | H670 | Q670 | Z690 | W680 |
| Overclocking | Overclocking | Overclocking | No | RAM; BCLK on some ASRock, ASUS and MSI motherboards | RAM only | No | Yes | Yes |
| Bus interface | Bus interface | Bus interface | DMI 4.0 ×4 | DMI 4.0 ×4 | DMI 4.0 ×8 | DMI 4.0 ×8 | DMI 4.0 ×8 | DMI 4.0 ×8 |
| CPU support | CPU support | CPU support | Alder Lake Raptor Lake (a BIOS update may be required) | Alder Lake Raptor Lake (a BIOS update may be required) | Alder Lake Raptor Lake (a BIOS update may be required) | Alder Lake Raptor Lake (a BIOS update may be required) | Alder Lake Raptor Lake (a BIOS update may be required) | Alder Lake Raptor Lake (a BIOS update may be required) |
| Memory capacity | Memory capacity | Memory capacity | Up to 64/128 GB | Up to 128/256 GB | Up to 128/256 GB | Up to 128/256 GB | Up to 128/256 GB | Up to 128/256 GB with ECC |
| Maximum DIMM slots | Maximum DIMM slots | Maximum DIMM slots | 2 | 4 | 4 | 4 | 4 | 4 |
| Maximum USB 2.0 ports | Maximum USB 2.0 ports | Maximum USB 2.0 ports | 10 | 12 | 14 | 14 | 14 | 14 |
| USB 3.2 ports configuration | Gen 1x1 | Gen 1x1 | Up to 4 | Up to 6 | Up to 8 | Up to 10 | Up to 10 | Up to 10 |
| USB 3.2 ports configuration | Gen 2 | ×1 | Up to 2 | Up to 4 | Up to 4 | Up to 8 | Up to 10 | Up to 10 |
| USB 3.2 ports configuration | Gen 2 | ×2 | None | Up to 2 | Up to 2 | Up to 4 | Up to 4 | Up to 4 |
| Maximum SATA 3.0 ports | Maximum SATA 3.0 ports | Maximum SATA 3.0 ports | 4 | 4 | 8 | 8 | 8 | 8 |
| Processor PCI Express configuration | Processor PCI Express configuration | 5.0 | 1×16 | 1×16 | 1×16 or 2×8 | 1×16 or 2×8 | 1×16 or 2×8 | 1×16 or 2×8 |
| Processor PCI Express configuration | Processor PCI Express configuration | 4.0 | None | 1×4 | 1×4 | 1×4 | 1×4 | 1×4 |
| PCH PCI Express configuration | PCH PCI Express configuration | 4.0 | None | 6 | 12 | 12 | 12 | 12 |
| PCH PCI Express configuration | PCH PCI Express configuration | 3.0 | 8 | 8 | 12 | 12 | 16 | 16 |
| Independent display support (digital ports/pipes) | Independent display support (digital ports/pipes) | Independent display support (digital ports/pipes) | 3 | 4 | 4 | 4 | 4 | 4 |
| Integrated wireless | Integrated wireless | Integrated wireless | suggested: Intel Wi-Fi 6E AX211 (802.11ax / Wi-Fi 6E / Bluetooth 5.3) | suggested: Intel Wi-Fi 6E AX211 (802.11ax / Wi-Fi 6E / Bluetooth 5.3) | suggested: Intel Wi-Fi 6E AX211 (802.11ax / Wi-Fi 6E / Bluetooth 5.3) | suggested: Intel Wi-Fi 6E AX211 (802.11ax / Wi-Fi 6E / Bluetooth 5.3) | suggested: Intel Wi-Fi 6E AX211 (802.11ax / Wi-Fi 6E / Bluetooth 5.3) | suggested: Intel Wi-Fi 6E AX211 (802.11ax / Wi-Fi 6E / Bluetooth 5.3) |
| PCIe RAID support | PCIe RAID support | PCIe RAID support | No | No | 0, 1, 5 | 0, 1, 5 | 0, 1, 5 | 0, 1, 5 |
| SATA RAID support | SATA RAID support | SATA RAID support | No | 0, 1, 5, 10 | 0, 1, 5, 10 | 0, 1, 5, 10 | 0, 1, 5, 10 | 0, 1, 5, 10 |
| Intel Optane memory support | Intel Optane memory support | Intel Optane memory support | No | Yes | Yes | Yes | Yes | Yes |
| Intel Smart Sound technology | Intel Smart Sound technology | Intel Smart Sound technology | Yes | Yes | Yes | Yes | Yes | Yes |
| Intel Active Management, Trusted Execution and vPro technology | Intel Active Management, Trusted Execution and vPro technology | Intel Active Management, Trusted Execution and vPro technology | No | No | No | Yes | No | Yes |
| Chipset TDP | Chipset TDP | Chipset TDP | 6 W | 6 W | 6 W | 6 W | 6 W | 6 W |
| Release date | Release date | Release date | Q1 2022 | Q1 2022 | Q1 2022 | Q1 2022 | Q4 2021 | Q2 2022 |
* 1 2 3 RAM capacity might be limited to the first number before a BIOS update
* ↑ Depends on OEM's implementation. OEMs include Wi-Fi chips as optional M.2 CNVio2 boards and can also choose from previous generations, such as the AX201 (Wi-Fi 6 / BT 5.2).

## Raptor Lake chipsets (700 series)

| | | | B760 | H770 | Z790 |
| Overclocking | Overclocking | Overclocking | RAM; BCLK on some ASRock and MSI motherboards, 12th Gen CPUs only. 13th Gen disabled BCLK OC at CPU microcode level | RAM only | Yes |
| Bus Interface | Bus Interface | Bus Interface | DMI 4.0 ×4 | DMI 4.0 ×8 | DMI 4.0 ×8 |
| CPU support | CPU support | CPU support | Alder Lake and Raptor Lake | Alder Lake and Raptor Lake | Alder Lake and Raptor Lake |
| Memory capacity | Memory capacity | Memory capacity | Up to 128/256 GB | Up to 128/256 GB | Up to 128/256 GB |
| Maximum DIMM slots | Maximum DIMM slots | Maximum DIMM slots | 4 | 4 | 4 |
| Maximum USB 2.0 ports | Maximum USB 2.0 ports | Maximum USB 2.0 ports | 12 | 14 | 14 |
| USB 3.2 ports configuration | Gen 1x1 | Gen 1x1 | Up to 6 | Up to 8 | Up to 10 |
| USB 3.2 ports configuration | Gen 2 | ×1 | Up to 4 | Up to 4 | Up to 10 |
| USB 3.2 ports configuration | Gen 2 | ×2 | Up to 2 | Up to 2 | Up to 5 |
| Maximum SATA 3.0 ports | Maximum SATA 3.0 ports | Maximum SATA 3.0 ports | 4 | 8 | 8 |
| Processor PCI Express configuration | Processor PCI Express configuration | 5.0 | 1x16 | 1×16 or 2×8 | 1×16 or 2×8 |
| Processor PCI Express configuration | Processor PCI Express configuration | 4.0 (for M.2) | 1x4 | 1x4 | 1x4 |
| PCH PCI Express configuration | PCH PCI Express configuration | 4.0 | 10 | 16 | 20 |
| PCH PCI Express configuration | PCH PCI Express configuration | 3.0 | 4 | 8 | 8 |
| Independent display support (digital ports/pipes) | Independent display support (digital ports/pipes) | Independent display support (digital ports/pipes) | 4 | 4 | 4 |
| Integrated wireless | Integrated wireless | Integrated wireless | Intel Wi-Fi 6E AX211 (802.11ax / Wi-Fi 6E / Bluetooth 5.3) | Intel Wi-Fi 6E AX211 (802.11ax / Wi-Fi 6E / Bluetooth 5.3) | Intel Wi-Fi 6E AX211 (802.11ax / Wi-Fi 6E / Bluetooth 5.3) |
| PCIe RAID support | PCIe RAID support | PCIe RAID support | No | 0, 1, 5 | 0, 1, 5 |
| SATA RAID support | SATA RAID support | SATA RAID support | 0, 1, 5, 10 | 0, 1, 5, 10 | 0, 1, 5, 10 |
| Intel Optane memory support | Intel Optane memory support | Intel Optane memory support | Yes | Yes | Yes |
| Intel Smart Sound technology | Intel Smart Sound technology | Intel Smart Sound technology | Yes | Yes | Yes |
| Intel Active Management, Trusted Execution and vPro technology | Intel Active Management, Trusted Execution and vPro technology | Intel Active Management, Trusted Execution and vPro technology | No | No | No |
| Chipset TDP | Chipset TDP | Chipset TDP | 6 W | 6 W | 6 W |
| Release date | Release date | Release date | Q1 2023 | Q1 2023 | Q4 2022 |
* ↑ RAM capacity might be limited to the first number before a BIOS update
* ↑ depends on OEM's implementation