# Socket AM5

Socket AM5 (LGA 1718) is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by AMD that is used for AMD Ryzen microprocessors starting with the Zen 4 microarchitecture. AM5 was launched in September 2022 and is the successor to AM4.
The Ryzen 7000 series processors were the first AM5 processors. The 7000 series added support for PCI Express 5.0 and DDR5.

## Background

In March 2017, with the launch of its new Zen processors, AMD used the AM4 socket that they had previously used with their Bristol Ridge (derived from Excavator) powered Athlon X4 and some A-Series, a pin grid array (PGA) socket that they promised to support until 2020.

### Announcement

At CES 2022, AMD CEO Lisa Su unveiled the AM5 socket and the integrated heat spreader design for the upcoming Ryzen 7000 processors due in late 2022.
On May 23, 2022, AMD provided details about the AM5 socket, its corresponding motherboards, and Ryzen 7000 Series CPUs at Computex in Taipei, Taiwan. At Computex, motherboard vendors ASRock, Gigabyte and others debuted their new X670 motherboards featuring the AM5 socket.
AMD stated that it plans to support the AM5 socket for a number of years as it did with the AM4 socket. During the Ryzen 7000 series reveal on August 29, 2022, AMD confirmed that it would support the AM5 socket until at least 2025. At Computex 2024, AMD announced that this support period would then be extended through 2027.

## Features

* Supports DDR5 in dual-channel configuration. DDR4 is not supported, unlike Intel's LGA 1700 socket.
* Support for PCIe 5.0 lanes from the CPU on X870E, X870, X670E and B650E chipsets.
* Achieves 170 W TDP and a Package Power Tracking (PPT) limit up to 230 W.

## Heatsink

The AM5 socket specifies the 4 holes for fastening the heatsink to the motherboard to be placed at the corners of a rectangle with a lateral length of 54×90 mm, as well as UNC #6-32 screw threads for the backplate, identical to those of the preceding AM4 socket. Furthermore, the Z-height of the CPU package is kept the same as that of AM4, for backward compatibility of heatsinks.
Unlike AM4, the backplate on AM5 is not removable, as it also serves the purpose of securing the CPU retention mechanism for the LGA socket.
Not all existing CPU coolers from AM4 are compatible. In particular, coolers that use their own backplate mounting hardware, instead of the default motherboard-provided backplate, will not work. Some cooler manufacturers are offering upgrade kits to allow incompatible older coolers to be used on AM5.

## Chipsets

| | | | Branding | Branding | Branding | Branding | Branding | Branding | Branding | Branding | Branding |
| | | | A620 | B650 | B650E | X670 | X670E | B840 | B850 | X870 | X870E |
| Platform features | PCIe 5.0 support | x16 slot | No | No | Yes | No | Yes | No | Optional | Yes | Yes |
| Platform features | PCIe 5.0 support | M.2 slot + 4× GPP | No | M.2 Optional | Yes | Yes | Yes | No | Yes | Yes | Yes |
| Platform features | x16 slot configurations | x16 slot configurations | 1×16 | 1×16 or 2×8 | 1×16 or 2×8 | 1×16 or 2×8 | 1×16 or 2×8 | 1×16 | 1×16 or 2×8 | 1×16 or 2×8 | 1×16 or 2×8 | 1×16 or 2×8 | 1×16 or 2×8 |
| Platform features | Multi-GPU | CrossFire | No | Yes | Yes | Yes | Yes | No | | Yes | Yes |
| Platform features | Multi-GPU | SLI | No | No | No | No | No | No | No | No | No |
| Platform features | USB4 Gen 3×2 (40 Gb/s) | USB4 Gen 3×2 (40 Gb/s) | Optional | Optional | Optional | Optional | Optional | Optional | Optional | Yes | Yes |
| Platform features | Wi-Fi version | Wi-Fi version | 6 | 6 | 6 | 6 | 6 | | | 7 | 7 |
| Platform features | Processor overclocking | Processor overclocking | No | Yes | Yes | Yes | Yes | No | Yes | Yes | Yes |
| Chipset specifications | PCIe lanes | Gen 4 | None | ×8 | ×8 | ×12 | ×12 | x10 | x12 | ×8 | ×12 |
| Chipset specifications | PCIe lanes | Gen 3 | Up to ×8 | Up to ×4 | Up to ×4 | Up to ×8 | Up to ×8 | Up to x4 | Up to ×4 | Up to ×8 |
| Chipset specifications | USB support | USB 2.0 | 6 | 6 | 6 | 12 | 12 | | | 6 | 12 |
| Chipset specifications | USB support | USB 3.2 Gen 1x1 (5 Gb/s) | 2 | None | None | None | None | | | None | None |
| Chipset specifications | USB support | USB 3.2 Gen 2x1 (10 Gb/s) | 2 | 4 | 4 | 8 | 8 | 2 | 6 | 4 | 8 |
| Chipset specifications | USB support | USB 3.2 Gen 2x2 (20 Gb/s) | None | 1 | 1 | 2 | 2 | None | 1 | 1 | 2 |
| Chipset specifications | Storage features | SATA III ports | Up to 4 | Up to 4 | Up to 4 | Up to 8 | Up to 8 | Up to 4 | Up to 4 | Up to 4 | Up to 8 |
| Chipset specifications | Storage features | RAID | 0, 1, 10 | 0, 1, 10 | 0, 1, 10 | 0, 1, 10 | 0, 1, 10 | 0, 1, 10 | 0, 1, 10 | 0, 1, 10 | 0, 1, 10 |
| Chipset specifications | Chipset TDP | Chipset TDP | ~4.5 W | ~7 W | ~7 W | ~14 W | ~14 W | | | ~7 W | ~14 W |
| Chipset specifications | Architecture | Architecture | Promontory 21 ×1 | Promontory 21 ×1 | Promontory 21 ×1 | Promontory 21 ×2 | Promontory 21 ×2 | | | Promontory 21 ×1 | Promontory 21 ×2 |
| Chipset specifications | Chipset links | To CPU | PCIe 4.0 ×4 | PCIe 4.0 ×4 | PCIe 4.0 ×4 | PCIe 4.0 ×4 | PCIe 4.0 ×4 | PCIe 4.0 ×4 | PCIe 4.0 ×4 | PCIe 4.0 ×4 | PCIe 4.0 ×4 |
| Chipset specifications | Chipset links | Interchipset | — | — | — | PCIe 4.0 ×4 | PCIe 4.0 ×4 | | | — | PCIe 4.0 ×4 |
| CPU support | CPU support | Zen 4 | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| CPU support | CPU support | Zen 5 | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Release date | Release date | Release date | Mar 31, 2023 | Oct 10, 2022 | Oct 10, 2022 | Sep 27, 2022 | Sep 27, 2022 | Jan 6, 2025 | Jan 6, 2025 | Sep 2024 | Sep 2024 |
| Reference(s) | Reference(s) | Reference(s) | | | | | | | | | |
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* ↑ Support for Gen5 speeds on lanes directly from CPU to expansion and M.2 slots, and general-purpose lanes.
* 1 2 Provided by a third-party controller.
* ↑ Motherboard makers may omit Wi-Fi on some models.
* ↑ PCIe lanes provided by the chipset. The CPU provides other PCIe 5.0 and/or 4.0 lanes.
* 1 2 The motherboard maker may configure the USB 3.2 provided by the chipset as 6× 3.2 Gen 2x1 and 0× 3.2 Gen 2x2 ports.
* 1 2 The motherboard maker may configure the USB 3.2 provided by the chipset as 10× 3.2 Gen 2x1 and 1× 3.2 Gen 2x2 ports, or 12× 3.2 Gen 2x1 and 0× 3.2 Gen 2x2 ports.
* 1 2 Two Promontory 21 chipsets are present, each having a TDP of ~7 W, giving a total TDP of ~14 W.