# List of AMD mobile processors
## Features overview
### APUs

APU features table

## Initial platform (2003)

Launched in 2003, the initial platform for mobile AMD processors consists of:
| AMD mobile | Initial platform |
| Mobile processor | Processors – Socket 754 Mobile Sempron single-core 32-bit processor (codenamed Dublin, Sonora, Roma), or Mobile Athlon 64 single-core 64-bit processor (codenamed ClawHammer, Odessa, Oakville, Newark), or Turion 64 single-core 64-bit processor (codenamed Lancaster) |
| Mobile chipset | D-sub and HyperTransport 1.0 |

### Mobile Sempron
#### "Dublin" (Socket 754, CG, 130 nm, Desktop replacement)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit
| Model Number | Frequency | L2 Cache | HyperTransport | Mult. | Voltage | TDP | Release Date | Part Number(s) |
| Mobile Sempron 2600+ | 1600 MHz | 128 kB | 800 MHz | 8x | 0.95 – 1.4 V | 13 – 62 W | July 28, 2004 | SMN2600BIX2AY |
| Mobile Sempron 2800+ | 1600 MHz | 256 kB | 800 MHz | 8x | 0.95 – 1.4 V | 13 – 62 W | July 28, 2004 | SMN2800BIX3AY |
| Mobile Sempron 3000+ | 1800 MHz | 128 kB | 800 MHz | 9x | 0.95 – 1.4 V | 13 – 62 W | July 28, 2004 | SMN3000BIX2AY |

#### "Dublin" (Socket 754, CG, 130 nm, Low power)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit
| Model Number | Frequency | L2 Cache | HyperTransport | Mult. | Voltage | TDP | Release Date | Part Number(s) |
| Mobile Sempron 2600+ | 1600 MHz | 128 kB | 800 MHz | 8x | 0.975 – 1.25 V | 9 – 25 W | July 28, 2004 | SMS2600BOX2LA |
| Mobile Sempron 2800+ | 1600 MHz | 256 kB | 800 MHz | 8x | 0.975 – 1.25 V | 9 – 25 W | July 28, 2004 | SMS2800BOX3LA |

#### "Georgetown" (Socket 754, D0, 90 nm, Desktop replacement)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit
| Model Number | Frequency | L2 Cache | HyperTransport | Mult. | Voltage | TDP | Release Date | Part Number(s) |
| Mobile Sempron 2600+ | 1600 MHz | 128 kB | 800 MHz | 08x | 0.95 – 1.4 V | 62 W | July 2004 | SMN2600BIX2BA |
| Mobile Sempron 2800+ | 1600 MHz | 256 kB | 800 MHz | 08x | 0.95 – 1.4 V | 62 W | July 2004 | SMN2800BIX3BA |
| Mobile Sempron 3000+ | 1800 MHz | 128 kB | 800 MHz | 09x | 0.95 – 1.4 V | 62 W | July 2004 | SMN3000BIX2BA |
| Mobile Sempron 3100+ | 1800 MHz | 256 kB | 800 MHz | 09x | 0.95 – 1.4 V | 62 W | May 3, 2005 | SMN3100BIX3BA |
| Mobile Sempron 3300+ | 2000 MHz | 128 kB | 800 MHz | 10x | 0.95 – 1.4 V | 62 W | August 19, 2005 | SMN3300BIX2BA |

#### "Sonora" (Socket 754, D0, 90 nm, Low power)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit
| Model Number | Frequency | L2 Cache | HyperTransport | Mult. | Voltage | TDP | Release Date | Part Number(s) |
| Mobile Sempron 2600+ | 1600 MHz | 128 kB | 800 MHz | 8x | 0.975 – 1.25 V | 25 W | July 2004 | SMS2600BOX2LB |
| Mobile Sempron 2800+ | 1600 MHz | 256 kB | 800 MHz | 8x | 0.975 – 1.25 V | 25 W | July 2004 | SMS2800BOX3LB |
| Mobile Sempron 3000+ | 1800 MHz | 128 kB | 800 MHz | 9x | 0.975 – 1.25 V | 25 W | November 23, 2004 | SMS3000BOX2LB |
| Mobile Sempron 3100+ | 1800 MHz | 256 kB | 800 MHz | 9x | 0.975 – 1.25 V | 25 W | January 2005 | SMS3100BOX3LB |

#### "Albany" (Socket 754, E6, 90 nm, Desktop replacement)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit
| Model Number | Frequency | L2 Cache | HyperTransport | Mult. | Voltage | TDP | Release Date | Part Number(s) |
| Mobile Sempron 3000+ | 1800 MHz | 128 kB | 800 MHz | 9x | 0.95 – 1.4 V | 62 W | July 15, 2005 | SMN3000BIX2BX |
| Mobile Sempron 3100+ | 1800 MHz | 256 kB | 800 MHz | 9x | 0.95 – 1.4 V | 62 W | July 15, 2005 | SMN3100BIX3BX |
| Mobile Sempron 3300+ | 2000 MHz | 128 kB | 800 MHz | 10x | 0.95 – 1.4 V | 62 W | July 15, 2005 | SMN3300BIX2BX |
| Mobile Sempron 3400+ | 2000 MHz | 256 kB | 800 MHz | 10x | 0.95 – 1.4 V | 62 W | January 23, 2006 | SMN3400BIX3BX |
| Mobile Sempron 3600+ | 2200 MHz | 128 kB | 800 MHz | 11x | 0.95 – 1.4 V | 62 W | May 17, 2006 | SMN3600BIX2BX |

#### "Roma" (Socket 754, E6, 90 nm, Low power)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit
| Model Number | Frequency | L2 Cache | HyperTransport | Mult. | Voltage | TDP | Release Date | Part Number(s) |
| Mobile Sempron 2800+ | 1600 MHz | 256 kB | 800 MHz | 08x | 0.95 – 1.2 V | 25 W | July 15, 2005 | SMS2800BQX3LF |
| Mobile Sempron 3000+ | 1800 MHz | 128 kB | 800 MHz | 09x | 0.95 – 1.2 V | 25 W | July 15, 2005 | SMS3000BQX2LE SMS3000BQX2LF |
| Mobile Sempron 3100+ | 1800 MHz | 256 kB | 800 MHz | 09x | 0.95 – 1.2 V | 25 W | July 15, 2005 | SMS3100BQX3LE |
| Mobile Sempron 3300+ | 2000 MHz | 128 kB | 800 MHz | 10x | 0.95 – 1.2 V | 25 W | July 2005 | SMS3300BQX2LE |
| Mobile Sempron 3400+ | 2000 MHz | 256 kB | 800 MHz | 10x | 0.95 – 1.2 V | 25 W | May 17, 2006 | SMS3400BQX3LE |

### Mobile Athlon 64
#### "ClawHammer" (C0 & CG, 130 nm, Desktop replacement)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!
| Model Number | Frequency | L2 Cache | HT | Mult. | V$_{Core}$ | TDP | Socket | Release Date | Part Number(s) |
| Mobile Athlon 64 2700+ | 1600 MHz | 512 kB | 800 MHz | 8x | 1.50 V | 19 – 81.5 W | Socket 754 | May 2004 | AMA2700BEY4AP (C0) |
| Mobile Athlon 64 2800+ | 1600 MHz | 1024 kB | 800 MHz | 8x | 1.50 V | 19 – 81.5 W | Socket 754 | February 2004 | AMA2800BEX5AP (C0) AMA2800BEX5AR (CG) |
| Mobile Athlon 64 3000+ | 1800 MHz | 1024 kB | 800 MHz | 9x | 1.50 V | 19 – 81.5 W | Socket 754 | September 2003 | AMA3000BEX5AP (C0) AMA3000BEX5AR (CG) |
| Mobile Athlon 64 3200+ | 2000 MHz | 1024 kB | 800 MHz | 10x | 1.50 V | 19 – 81.5 W | Socket 754 | September 2003 | AMA3200BEX5AP (C0) AMA3200BEX5AR (CG) |
| Mobile Athlon 64 3400+ | 2200 MHz | 1024 kB | 800 MHz | 11x | 1.50 V | 19 – 81.5 W | Socket 754 | September 2003 | AMA3400BEX5AP (C0) AMA3400BEX5AR (CG) |
| Mobile Athlon 64 3700+ | 2400 MHz | 1024 kB | 800 MHz | 12x | 1.50 V | 19 – 81.5 W | Socket 754 | September 2003 | AMA3700BEX5AP (C0) AMA3700BEX5AR (CG) |

#### "ClawHammer" (C0 & CG, 130 nm, 62 W TDP)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!
| Model Number | Frequency | L2 Cache | HT | Mult. | V$_{Core}$ | TDP | Socket | Release Date | Part Number(s) |
| Mobile Athlon 64 2800+ | 1600 MHz | 1024 kB | 800 MHz | 8x | 1.40 V | 62 W | Socket 754 | September 2003 | AMN2800BIX5AP (C0) AMN2800BIX5AR (CG) |
| Mobile Athlon 64 3000+ | 1800 MHz | 1024 kB | 800 MHz | 9x | 1.40 V | 62 W | Socket 754 | September 2003 | AMN3000BIX5AP (C0) AMN3000BIX5AR (CG) |
| Mobile Athlon 64 3200+ | 2000 MHz | 1024 kB | 800 MHz | 10x | 1.40 V | 62 W | Socket 754 | September 2003 | AMN3200BIX5AP (C0) AMN3200BIX5AR (CG) |
| Mobile Athlon 64 3400+ | 2200 MHz | 1024 kB | 800 MHz | 11x | 1.40 V | 62 W | Socket 754 | February 2004 | AMN3400BIX5AR (CG) |

#### "ClawHammer" (CG, 130 nm, 35 W TDP)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!
| Model Number | Frequency | L2 Cache | HT | Mult. | V$_{Core}$ | TDP | Socket | Release Date | Part Number(s) |
| Mobile Athlon 64 2700+ | 1600 MHz | 512 kB | 800 MHz | 8x | 1.20 V | 35 W | Socket 754 | May 2004 | AMD2700BQX4AR |

#### "Odessa" (CG, 130 nm, Desktop replacement)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!
| Model Number | Frequency | L2 Cache | HT | Mult. | V$_{Core}$ | TDP | Socket | Release Date | Part Number(s) |
| Mobile Athlon 64 2800+ | 1800 MHz | 512 kB | 800 MHz | 8x | 1.50 V | 19 – 81.5 W | Socket 754 | April 2004 | AMA2800BEX4AX |

#### "Odessa" (CG, 130 nm, 35 W TDP)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!
| Model Number | Frequency | L2 Cache | HT | Mult. | V$_{Core}$ | TDP | Socket | Release Date | Part Number(s) |
| Mobile Athlon 64 2700+ | 1600 MHz | 512 kB | 800 MHz | 8× | 1.20 V | 35 W | Socket 754 | May 2004 | AMD2700BQX4AX |
| Mobile Athlon 64 2800+ | 1800 MHz | 512 kB | 800 MHz | 9× | 1.20 V | 35 W | Socket 754 | May 2004 | AMD2800BQX4AX |
| Mobile Athlon 64 3000+ | 2000 MHz | 512 kB | 800 MHz | 10× | 1.20 V | 35 W | Socket 754 | May 2004 | AMD3000BQX4AX |

#### "Oakville" (D0, 90 nm, 35 W TDP Low Power)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!
| Model Number | Frequency | L2 Cache | HT | Mult. | V$_{Core}$ | TDP | Socket | Release Date | Part Number(s) |
| Mobile Athlon 64 2700+ | 1600 MHz | 512 kB | 800 MHz | 8× | 1.35 V | 35 W | Socket 754 | August 17, 2004 | AMD2700BKX4LB |
| Mobile Athlon 64 2800+ | 1800 MHz | 512 kB | 800 MHz | 9× | 1.35 V | 35 W | Socket 754 | August 17, 2004 | AMD2800BKX4LB |
| Mobile Athlon 64 3000+ | 2000 MHz | 512 kB | 800 MHz | 10× | 1.35 V | 35 W | Socket 754 | August 17, 2004 | AMD3000BKX4LB |

#### "Newark" (E5, 90 nm, 62 W TDP)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!
| Model Number | Frequency | L2 Cache | HT | Mult. | V$_{Core}$ | TDP | Socket | Release Date | Part Number(s) |
| Mobile Athlon 64 3000+ | 1800 MHz | 1024 kB | 800 MHz | 09× | 1.35 V | 62 W | Socket 754 | April 14, 2005 | AMN3000BKX5BU |
| Mobile Athlon 64 3200+ | 2000 MHz | 1024 kB | 800 MHz | 10× | 1.35 V | 62 W | Socket 754 | April 14, 2005 | AMN3200BKX5BU |
| Mobile Athlon 64 3400+ | 2200 MHz | 1024 kB | 800 MHz | 11× | 1.35 V | 62 W | Socket 754 | April 14, 2005 | AMN3400BKX5BU |
| Mobile Athlon 64 3700+ | 2400 MHz | 1024 kB | 800 MHz | 12× | 1.35 V | 62 W | Socket 754 | April 14, 2005 | AMN3700BKX5BU |
| Mobile Athlon 64 4000+ | 2600 MHz | 1024 kB | 800 MHz | 13× | 1.35 V | 62 W | Socket 754 | August 16, 2005 | AMN4000BKX5BU |

### Turion 64
#### "Lancaster" (90 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!
| Model Number | Frequency | L2 Cache | HT | Mult. | Voltage | TDP | Socket | Release date | Order Part Number |
| Turion 64 ML-28 | 1600 MHz | 0512 kB | 800 MHz | 08x | 1.35 V | 35 W | Socket 754 | June 22, 2005 | TMDML28BKX4LD |
| Turion 64 ML-30 | 1600 MHz | 1024 kB | 800 MHz | 08x | 1.35 V | 35 W | Socket 754 | March 10, 2005 | TMDML30BKX5LD |
| Turion 64 ML-32 | 1800 MHz | 0512 kB | 800 MHz | 09x | 1.35 V | 35 W | Socket 754 | March 10, 2005 | TMDML32BKX4LD |
| Turion 64 ML-34 | 1800 MHz | 1024 kB | 800 MHz | 09x | 1.35 V | 35 W | Socket 754 | March 10, 2005 | TMDML34BKX5LD |
| Turion 64 ML-37 | 2000 MHz | 1024 kB | 800 MHz | 10x | 1.35 V | 35 W | Socket 754 | March 10, 2005 | TMDML37BKX5LD |
| Turion 64 ML-40 | 2200 MHz | 1024 kB | 800 MHz | 11x | 1.35 V | 35 W | Socket 754 | June 22, 2005 | TMDML40BKX5LD |
| Turion 64 ML-42 | 2400 MHz | 0512 kB | 800 MHz | 12x | 1.35 V | 35 W | Socket 754 | October 4, 2005 | TMDML42BKX4LD |
| Turion 64 ML-44 | 2400 MHz | 1024 kB | 800 MHz | 12x | 1.35 V | 35 W | Socket 754 | January 4, 2006 | TMDML44BKX5LD |
| Turion 64 MT-28 | 1600 MHz | 0512 kB | 800 MHz | 08x | 1.20 V | 25 W | Socket 754 | June 22, 2005 | TMSMT28BQX4LD |
| Turion 64 MT-30 | 1600 MHz | 1024 kB | 800 MHz | 08x | 1.20 V | 25 W | Socket 754 | March 10, 2005 | TMSMT30BQX5LD |
| Turion 64 MT-32 | 1800 MHz | 0512 kB | 800 MHz | 09x | 1.20 V | 25 W | Socket 754 | March 10, 2005 | TMSMT32BQX4LD |
| Turion 64 MT-34 | 1800 MHz | 1024 kB | 800 MHz | 09x | 1.20 V | 25 W | Socket 754 | March 10, 2005 | TMSMT34BQX5LD |
| Turion 64 MT-37 | 2000 MHz | 1024 kB | 800 MHz | 10x | 1.20 V | 25 W | Socket 754 | August 8, 2005 | TMSMT37BQX5LD |
| Turion 64 MT-40 | 2200 MHz | 1024 kB | 800 MHz | 11x | 1.20 V | 25 W | Socket 754 | August 8, 2005 | TMSMT40BQX5LD |

## Kite platform (2006)

Introduced in 2006, the Kite platform consists of:
| AMD mobile | Kite platform |
| Mobile processor | Processors – Socket S1 Mobile Sempron single-core 64-bit processor (codenamed Keene), or Turion 64 single-core 64-bit processor (codenamed Richmond), or Turion 64 X2 dual-core 64-bit processor (codenamed Taylor, Trinidad) |
| Mobile chipset | DVI and HyperTransport 1.0 DDR2-667 SO-DIMM |
| Mobile support | Wireless IEEE 802.11 b/g mini-PCI Express WiFi adapter |

### Mobile Sempron
#### "Keene" (Socket S1, F2, 90 nm, Low power)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!
| Model Number | Frequency | L2 Cache | HyperTransport | Mult. | Voltage | TDP | Release Date | Part Number(s) |
| Mobile Sempron 3200+ | 1600 MHz | 512 kB | 800 MHz | 08x | 0.950 – 1.125 V | 25 W | May 17, 2006 | SMS3200HAX4CM |
| Mobile Sempron 3400+ | 1800 MHz | 256 kB | 800 MHz | 09x | 0.950 – 1.125 V | 25 W | May 17, 2006 | SMS3400HAX3CM |
| Mobile Sempron 3500+ | 1800 MHz | 512 kB | 800 MHz | 09x | 0.950 – 1.125 V | 25 W | May 17, 2006 | SMS3500HAX4CM |
| Mobile Sempron 3600+ | 2000 MHz | 256 kB | 800 MHz | 10x | 0.950 – 1.125 V | 25 W | Oct 23, 2006 | SMS3600HAX3CM |

### Turion 64
#### "Richmond" (90 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
| Model Number | Frequency | L2 Cache | HT | Mult. | Voltage | TDP | Socket | Release date | Order Part Number |
| Turion 64 MK-36 | 2000 MHz | 512 kB | 800 MHz | 10x | 1.15 V | 31 W | Socket S1 | September 1, 2006 | TMDMK36HAX4CM |
| Turion 64 MK-38 | 2200 MHz | 512 kB | 800 MHz | 11x | 1.15 V | 31 W | Socket S1 | Q1 2007 | TMDMK38HAX4CM |

### Turion 64 X2
#### "Taylor" (90 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
| Model Number | Frequency | L2 Cache | HT | Mult. | Voltage | TDP | Socket | Release date | Order Part Number |
| Turion 64 X2 TL-50 | 1600 MHz | 2 × 256 kB | 800 MHz | 8x | 0.8 – 1.10 V | 31 W | Socket S1 | May 17, 2006 | TMDTL50HAX4CT |

#### "Trinidad" (90 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
| Model Number | Frequency | L2 Cache | HT | Mult. | Voltage | TDP | Socket | Release date | Order Part Number |
| Turion 64 X2 TL-52 | 1600 MHz | 2 × 512 kB | 800 MHz | 08x | 0.8 – 1.125 V | 31 W | Socket S1 | May 17, 2006 | TMDTL52HAX5CT |
| Turion 64 X2 TL-56 | 1800 MHz | 2 × 512 kB | 800 MHz | 09x | 0.8 – 1.125 V | 33 W | Socket S1 | May 17, 2006 | TMDTL56HAX5CT |
| Turion 64 X2 TL-60 | 2000 MHz | 2 × 512 kB | 800 MHz | 10x | 0.8 – 1.125 V | 35 W | Socket S1 | May 17, 2006 | TMDTL60HAX5CT |
| Turion 64 X2 TL-64 | 2200 MHz | 2 × 512 kB | 800 MHz | 11x | 0.8 – 1.125 V | 35 W | Socket S1 | January 30, 2007 | TMDTL64HAX5CT |

## Kite Refresh platform (2007)

AMD used Kite Refresh as the codenamed for the second-generation AMD mobile platform introduced in February 2007.
| AMD mobile | Kite Refresh platform |
| Mobile processor | Processors – Socket S1 Turion 64 X2 dual-core 64-bit Hawk family processor 65 nm (codenamed Tyler), or Mobile Sempron single-core 64-bit processor 65 nm (codenamed Sherman) |
| Mobile chipset | HDMI, HyperTransport 1.0 and PCI Express 1.0 DDR2-800 SO-DIMM |
| Mobile support | Wireless IEEE 802.11 a/b/g/draft-N support, mini-PCIe Wi-Fi adapter Hybrid hard drives Alert Standard Format (ASF) 2.0 (ASF page) Trusted Platform Module (TPM) |

### Mobile Sempron
#### "Sherman" (Socket S1, G1 & G2, 65 nm, Low power)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64
| Model Number | Frequency | L2 Cache | HyperTransport | Mult. | Voltage | TDP | Release Date | Part Number(s) |
| Sempron 2100+ fanless | 1000 MHz | 256 kB | 800 MHz | 5x | 0.950 – 1.125 V | 09 W | May 30, 2007 | SMF2100HAX3DQE (G1) |
| Mobile Sempron 3600+ | 2000 MHz | 256 kB | 800 MHz | 10x | | 25 W | | SMS3600HAX3DN (G2) |
| Mobile Sempron 3700+ | 2000 MHz | 512 kB | 800 MHz | 10x | | 25 W | | SMS3700HAX4DQE (G1) |
| Mobile Sempron 3800+ | 2200 MHz | 256 kB | 800 MHz | 11x | | 31 W | | SMD3800HAX3DN (G2) |
| Mobile Sempron 4000+ | 2200 MHz | 512 kB | 800 MHz | 11x | | 31 W | | SMD4000HAX4DN (G2) |

### Athlon 64 X2
#### "Tyler" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
| Model Number | Frequency | L2 Cache | HT | Mult. | Voltage | TDP | Socket | Release date | Order Part Number |
| Athlon 64 X2 TK-42 | 1600 MHz | 2 × 512 kB | 800 MHz | 8.0x | 1.075/1.10/1.125 V | 20 W | Socket S1 | | AMETK42HAX5DM |
| Athlon 64 X2 TK-53 | 1700 MHz | 2 × 256 kB | 800 MHz | 8.5x | 1.075/1.10/1.125 V | 31 W | Socket S1 | August 20, 2007 | AMDTK53HAX4DC |
| Athlon 64 X2 TK-55 | 1800 MHz | 2 × 256 kB | 800 MHz | 9.0x | 1.075/1.10/1.125 V | 31 W | Socket S1 | Aug 20 2007 | AMDTK55HAX4DC |
| Athlon 64 X2 TK-57 | 1900 MHz | 2 × 256 kB | 800 MHz | 9.5x | 1.075/1.10/1.125 V | 31 W | Socket S1 | 2008 | AMDTK57HAX4DM |

### Turion 64 X2
#### "Tyler" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
| Model Number | Frequency | L2 Cache | HT | Mult. | Voltage | TDP | Socket | Release date | Order Part Number |
| Turion 64 X2 TL-56 | 1800 MHz | 2 × 512 kB | 800 MHz | 09.0x | 1.075/1.10/1.125 V | 31 W | Socket S1 | May 7, 2007 | TMDTL56HAX5DC |
| Turion 64 X2 TL-58 | 1900 MHz | 2 × 512 kB | 800 MHz | 09.5x | 1.075/1.10/1.125 V | 31 W | Socket S1 | May 7, 2007 | TMDTL58HAX5DC |
| Turion 64 X2 TL-60 | 2000 MHz | 2 × 512 kB | 800 MHz | 10.0x | 1.075/1.10/1.125 V | 31 W | Socket S1 | May 7, 2007 | TMDTL60HAX5DC |
| Turion 64 X2 TL-62 | 2100 MHz | 2 × 512 kB | 800 MHz | 10.5x | 1.075/1.10/1.125 V | 35 W | Socket S1 | Jan 21 2008 | TMDTL62HAX5DM |
| Turion 64 X2 TL-64 | 2200 MHz | 2 × 512 kB | 800 MHz | 11.0x | 1.075/1.10/1.125 V | 35 W | Socket S1 | May 7, 2007 | TMDTL64HAX5DC |
| Turion 64 X2 TL-66 | 2300 MHz | 2 × 512 kB | 800 MHz | 11.5x | 1.075/1.10/1.125 V | 35 W | Socket S1 | May 7, 2007 Jul 10 2007 | TMDTL66HAX5DC TMDTL66HAX5DM |
| Turion 64 X2 TL-68 | 2400 MHz | 2 × 512 kB | 800 MHz | 12.0x | 1.075/1.10/1.125 V | 35 W | Socket S1 | December 19, 2007 | TMDTL68HAX5DM |

## Puma platform (2008)

The Puma platform introduced in 2008 with June 2008 availability for the third-generation AMD mobile platform consists of:
| AMD mobile | Initial platform |
| Mobile processor | Processors Dual-core 64-bit codenamed Griffin of processors, named "Turion X2 Ultra", or Mobile Sempron single-core 64-bit processor (codenamed Sable), with the following: Split-power planes and linked power management support Support for possible low voltage processors |
| Mobile chipset | AMD M780 series chipset Mobility Radeon HD 3000 series GPU on 55 nm process ATI Hybrid Graphics Hybrid CrossFire PowerXpress HyperFlash – memory modules on motherboard with ReadyBoost DisplayPort, HyperTransport 3.0 and PCI Express 2.0 support DDR2-800 SO-DIMM |
| Mobile support | Wireless IEEE 802.11 a/b/g/n mini-PCIe Wi-Fi adapter Hybrid hard drives Desktop and mobile Architecture for System Hardware (DASH) 1.0 support (DASH page) Trusted Platform Module (TPM) support |

### Mobile Sempron
#### "Sable" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!
| Model Number | Frequency | L2 Cache | HT | Mult. | Voltage | TDP | Socket | Release date | Order Part Number |
| Sempron SI-40 | 2000 MHz | 512 kB | 1800 MHz | 10.0x | 1.075 – 1.125 V | 25 W | Socket S1G2 | June 4, 2008 | SMSI40SAM12GG |
| Sempron SI-42 | 2100 MHz | 512 kB | 1800 MHz | 10.5x | 1.075 – 1.125 V | 25 W | Socket S1G2 | Q3 2008 | SMSI42SAM12GG |

### Athlon X2
#### "Lion" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
| Model Number | Frequency | L2 Cache | HT | Mult. | Voltage | TDP | Socket | Release date | Order Part Number |
| Athlon X2 QL-60 | 1900 MHz | 2 × 512 kB | 1800 MHz | 09.5x | 0.95 – 1.1 V | 35 W | Socket S1G2 | June 4, 2008 | AMQL60DAM22GG |
| Athlon X2 QL-62 | 2000 MHz | 2 × 512 kB | 1800 MHz | 10.0x | 0.95 – 1.1 V | 35 W | Socket S1G2 | Q3 2008 | AMQL62DAM22GG |
| Athlon X2 QL-64 | 2100 MHz | 2 × 512 kB | 1800 MHz | 10.5x | 0.95 – 1.1 V | 35 W | Socket S1G2 | Q4 2008 | AMQL64DAM22GG |
| Athlon X2 QL-65 | 2100 MHz | 2 × 512 kB | 2000 MHz | 10.5x | 0.95 – 1.1 V | 35 W | Socket S1G2 | Q4 2008 | AMQL65DAM22GG |
| Athlon X2 QL-66 | 2200 MHz | 2 × 512 kB | 1800 MHz | 11.0x | 0.95 – 1.1 V | 35 W | Socket S1G2 | Q4 2008 | AMQL66DAM22GG |
| Athlon X2 QL-67 | 2200 MHz | 2 × 512 kB | 2000 MHz | 11.0x | 0.95 – 1.1 V | 35 W | Socket S1G2 | Q4 2008 | AMQL67DAM22GG |

### Turion X2
#### "Lion" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
| Model Number | Frequency | L2 Cache | HT | Mult. | Voltage | TDP | Socket | Release date | Order Part Number |
| Turion X2 RM-70 | 2000 MHz | 2 × 512 kB | 1800 MHz | 10x | 0.75 – 1.2 V | 31 W | Socket S1G2 | June 4, 2008 | TMRM70DAM22GG |
| Turion X2 RM-72 | 2100 MHz | 2 × 512 kB | 1800 MHz | 10.5x | 0.75 – 1.2 V | 35 W | Socket S1G2 | Q3 2008 | TMRM72DAM22GG |
| Turion X2 RM-74 | 2200 MHz | 2 × 512 kB | 1800 MHz | 11.0x | 0.75 – 1.2 V | 35 W | Socket S1G2 | Q4 2008 | TMRM74DAM22GG |
| Turion X2 RM-75 | 2200 MHz | 2 × 512 kB | 2000 MHz | 11.0x | 0.75 – 1.2 V | 35 W | Socket S1G2 | Q4 2008 | TMRM75DAM22GG |
| Turion X2 RM-76 | 2300 MHz | 2 × 512 kB | 1800 MHz | 11.5x | 0.75 – 1.2 V | 35 W | Socket S1G2 | Q4 2008 | TMRM76DAM22GG |
| Turion X2 RM-77 | 2300 MHz | 2 × 512 kB | 2000 MHz | 11.5x | 0.75 – 1.2 V | 35 W | Socket S1G2 | Q4 2008 | TMRM77DAM22GG |

### Turion X2 Ultra
#### "Lion" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
| Model Number | Frequency | L2 Cache | HT | Mult. | Voltage | TDP | Socket | Release date | Order Part Number |
| Turion X2 Ultra ZM-80 | 2100 MHz | 2 × 1 MB | 1800 MHz | 10.5x | 0.75 – 1.2 V | 32 W | Socket S1G2 | June 4, 2008 | TMZM80DAM23GG |
| Turion X2 Ultra ZM-82 | 2200 MHz | 2 × 1 MB | 1800 MHz | 11.0x | 0.75 – 1.2 V | 35 W | Socket S1G2 | June 4, 2008 | TMZM82DAM23GG |
| Turion X2 Ultra ZM-84 | 2300 MHz | 2 × 1 MB | 1800 MHz | 11.5x | 0.75 – 1.2 V | 35 W | Socket S1G2 | Q3 2008 | TMZM84DAM23GG |
| Turion X2 Ultra ZM-85 | 2300 MHz | 2 × 1 MB | 2200 MHz | 11.5x | 0.75 – 1.2 V | 35 W | Socket S1G2 | Q3 2008 | TMZM85DAM23GG |
| Turion X2 Ultra ZM-86 | 2400 MHz | 2 × 1 MB | 1800 MHz | 12.0x | 0.75 – 1.2 V | 35 W | Socket S1G2 | June 4, 2008 | TMZM86DAM23GG |
| Turion X2 Ultra ZM-87 | 2400 MHz | 2 × 1 MB | 2200 MHz | 12.0x | 0.75 – 1.2 V | 35 W | Socket S1G2 | Q3 2008 | TMZM87DAM23GG |
| Turion X2 Ultra ZM-88 | 2500 MHz | 2 × 1 MB | 1800 MHz | 12.5x | 0.75 – 1.2 V | 35 W | Socket S1G2 | Q3 2008 | TMZM88DAM23GG |

## Yukon platform (2009)

The Yukon platform was introduced on January 8, 2009, with expected April availability for the first AMD Ultrathin Platform targeting the ultra-portable notebook market.
| AMD mobile | Initial platform |
| Mobile processor | Processors Single-core 64-bit codenamed Huron of processors, named "Athlon Neo", or Mobile Sempron single-core 64-bit processor (codenamed Huron), with the following: 27 mm (W) × 27 mm (D) × 2.5 mm (H) BGA package, named "ASB1" low voltage processors |
| Mobile chipset | AMD RS690E series chipset + SB600 southbridge Mobility Radeon HD 3000 series GPU on 55 nm process (as option) DDR2 SO-DIMM |
| Mobile support | Wireless connectivity with 3G (as option) Wireless IEEE 802.11 a/b/g/n mini-PCIe Wi-Fi adapter |

### Sempron
#### "Huron" (65 nm, Low power)

* Both models support: MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64
* Sempron 210U supports extra AMD-V
| Model Number | Frequency | L2 Cache | HT | Mult. | Voltage | TDP | Package/Socket | Release date | Order Part Number |
| Sempron 200U | 1000 MHz | 256 kB | 1600 MHz | 5x | 0.925 V | 8 W | Socket ASB1 | January 8, 2009 | SMF200UOAX3DV |
| Sempron 210U | 1500 MHz | 256 kB | 1600 MHz | 7.5x | 0.925 V | 15 W | Socket ASB1 | January 8, 2009 | SMG210UOAX3DX |

### Athlon Neo
#### "Huron" (65 nm, 15 W TDP)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!, AMD-V
| Model Number | Frequency | L2 Cache | HT | Mult. | V$_{Core}$ | TDP | Package | Release Date | Part Number(s) |
| Athlon Neo MV-40 | 1600 MHz | 512 kB | 800 MHz | 8x | 1.1 V | 15 W | Socket ASB1 | January 8, 2009 | AMGMV40OAX4DX |

#### "Sherman" (65 nm, 15 W TDP)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!
| Model Number | Frequency | L2 Cache | HT | Mult. | V$_{Core}$ | TDP | Package | Release Date | Part Number(s) |
| Athlon Neo TF-20 | 1600 MHz | 512 kB | 800 MHz | 8x | 1.0 V | 15 W | Socket S1 | January 8, 2009 | AMGTF20HAX4DN |

#### "Congo" (65 nm, 13 W TDP)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!
| Model Number | Frequency | L2 Cache | HT | Mult. | V$_{Core}$ | TDP | Package | Release Date | Part Number(s) |
| Athlon Mobile X2 L310 | 1200 MHz | 2 × 512 kB | 800 MHz | 6x | 0.925 V | 13 W | Socket S1 | January 8, 2009 | AMML310HAX5DM |

### Turion
#### "Congo" (65 nm, 20 W TDP)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!
| Model Number | Frequency | L2 Cache | HT | Mult. | V$_{Core}$ | TDP | Package | Release Date | Part Number(s) |
| Turion Mobile X2 L510 | 1600 MHz | 2 × 512 kB | 800 MHz | 8x | 0.925 V | 20 W | Socket S1 | January 8, 2009 | TMEL510HAX5DM |

## Congo platform (2009)

The Congo platform was introduced in September 2009, as the second AMD Ultrathin Platform targeting the ultra-portable notebook market.
| AMD mobile | Initial platform |
| Mobile processor | Processors Single or Dual-core 64-bit processors codenamed Conesus, with the following: made on 65 nm process 15 W (single-core) or 18 W (dual-core) TDP 27 mm (W) × 27 mm (D) × 2.5 mm (H) BGA package, named "ASB1" low voltage processors DDR2 SO-DIMM |
| Mobile chipset | AMD M780G(RS780M) series chipset + SB710 southbridge Mobility Radeon HD 3200 GPU on 55 nm process (as option) RV610 graphics core DirectX 10.0 UVD |

### Athlon Neo X2
#### "Conesus" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, AMD-V
| Model Number | Frequency | L2 Cache | HT | Mult. | Voltage | TDP | Socket | Release date | Order Part Number |
| Athlon Neo X2 L325 | 1500 MHz | 2 × 512 kB | 800 MHz | 7.5x | 0.925 V | 18 W | Socket ASB1 | August 10, 2009 | AMZL325OAX5DY |
| Athlon Neo X2 L335 | 1600 MHz | 2 × 512 kB | 800 MHz | 8.0x | 0.925 V | 18 W | Socket ASB1 | February 2010 | AMZL335OAX5DY |

### Turion Neo X2
#### "Conesus" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, AMD-V, PowerNow!
| Model Number | Frequency | L2 Cache | HT | Mult. | Voltage | TDP | Socket | Release date | Order Part Number |
| Turion Neo X2 L625 | 1600 MHz | 2 × 512 kB | 800 MHz | 8x | 0.925 V | 18 W | Socket ASB1 | August 10, 2009 | TMZL625OAX5DY |

## Tigris platform (2009)

The Tigris platform introduced in September 2009 for the AMD Mainstream Notebook Platform consists of:
| AMD mobile | Initial platform |
| Mobile processor | Processors Single or Dual-core 64-bit processors codenamed Caspian, with the following: made on 45 nm process 25 W (single-core) or 35 W (dual-core) TDP |
| Mobile chipset | AMD M785(RS880M) series chipset + SB710 southbridge Mobility Radeon HD 4200 GPU on 55 nm process RV620 graphics core DirectX 10.1 UVD 2 |

### Sempron
#### "Caspian" (45 nm)

Single-core mobile processor
MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
* view
* talk
| Model Number | Frequency | L2 Cache | FPU width | HT | Mult. | TDP | Socket | Release date | Order Part Number |
| Sempron M100 | 2000 MHz | 512 kB | 64-bit | 1600 MHz | 10.0x | 25 W | Socket S1G3 | September 10, 2009 | SMM100SBO12GQ |
| Sempron M120 | 2100 MHz | 512 kB | 64-bit | 1600 MHz | 10.5x | 25 W | Socket S1G3 | September 10, 2009 | SMM120SBO12GQ |
| Sempron M140 | 2200 MHz | 512 kB | 64-bit | 1600 MHz | 10.5x | 25 W | Socket S1G3 | April 2010 | SMM140SBO12GQ |

### Athlon II
#### "Caspian" (45 nm)

Dual-core mobile processor
MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
* view
* talk
| Model number | Frequency | L2 cache | FPU width | HT | Mult. | TDP | Socket | Release date | Part number |
| Athlon II M300 | 2.0 GHz | 2 × 512 kB | 64-bit | 1.6 GHz | 10× | 35 W | Socket S1G3 | September 10, 2009 | AMM300DBO22GQ |
| Athlon II M320 | 2.1 GHz | 2 × 512 kB | 64-bit | 1.6 GHz | 10.5× | 35 W | Socket S1G3 | September 10, 2009 | AMM320DBO22GQ |
| Athlon II M340 | 2.2 GHz | 2 × 512 kB | 64-bit | 1.6 GHz | 11× | 35 W | Socket S1G3 | September 10, 2009 | AMM340DBO22GQ |
| Athlon II M360 | 2.3 GHz | 2 × 512 kB | 64-bit | 1.6 GHz | 11× | 35 W | Socket S1G3 | May 2010 | AMM360DBO22GQ |

### Turion II
#### "Caspian" (45 nm)

Dual-core mobile processor
MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
* view
* talk
| Model number | Clock speed | L2 cache | FPU width | Hyper Transport | Multi | TDP | Socket | Release date | Part number |
| Turion II M500 | 2.2 GHz | 2 × 512 KB | 128-bit | 1.8 GHz | 11× | 35 W | Socket S1G3 | September 10, 2009 | TMM500DBO22GQ |
| Turion II M520 | 2.3 GHz | 2 × 512 KB | 128-bit | 1.8 GHz | 11.5× | 35 W | Socket S1G3 | September 10, 2009 | TMM520DBO22GQ |
| Turion II M540 | 2.4 GHz | 2 × 512 KB | 128-bit | 1.8 GHz | 12× | 35 W | Socket S1G3 | September 10, 2009 | TMM540DBO22GQ |
| Turion II M560 | 2.5 GHz | 2 × 512 KB | 128-bit | 1.8 GHz | 12× | 35 W | Socket S1G3 | April 2010 | TMM560DBO22GQ |

### Turion II (Ultra)
#### "Caspian" (45 nm)

Dual-core mobile processor
MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
* view
* talk
| Model number | Clock speed | L2 cache | FPU width | Hyper Transport | Multi | TDP | Socket | Release date | Part number |
| Turion II Ultra M600 | 2.4 GHz | 2 × 1 MB | 128-bit | 1.8 GHz | 12× | 35 W | Socket S1G3 | September 10, 2009 | TMM600DBO23GQ |
| Turion II Ultra M620 | 2.5 GHz | 2 × 1 MB | 128-bit | 1.8 GHz | 12.5× | 35 W | Socket S1G3 | September 10, 2009 | TMM620DBO23GQ |
| Turion II Ultra M640 | 2.6 GHz | 2 × 1 MB | 128-bit | 1.8 GHz | 13× | 35 W | Socket S1G3 | September 10, 2009 | TMM640DBO23GQ |
| Turion II Ultra M660 | 2.7 GHz | 2 × 1 MB | 128-bit | 1.8 GHz | 13.5× | 35 W | Socket S1G3 | September 10, 2009 | TMM660DBO23GQ |

## Nile platform (2010)

The Nile platform introduced on May 12, 2010, for the third AMD Ultrathin Platform consists of:
| AMD mobile | Initial platform |
| Mobile processor | Processors Single or Dual-core 64-bit processors codenamed Geneva, with the following: made on 45 nm process support for DDR3 memory 9 W, 12 W or 15 W TDP |
| Mobile chipset | AMD RS880 series chipset + SB850 southbridge Mobility Radeon HD 42xx GPU on 55 nm process RV620 graphics core DirectX 10.1 UVD 2 |
* MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
* Memory support: DDR3 SDRAM, DDR3L SDRAM (Up to 1066)

### V series
#### "Geneva" (45 nm)

Single-core mobile processor
* view
* talk
| Model number | Clock speed | L2 cache | FPU width | Hyper Transport | Multi | TDP | Socket | Release date | Part number |
| V105 | 1.2 GHz | 512 KB | 64-bit | 1.0 GHz | 6× | 9 W | ASB2 | May 12, 2010 | VMV105FDV12GM |

### Athlon II Neo
#### "Geneva" (45 nm)

Single-core mobile processor Single-core mobile processor
* view
* talk
| Model number | Frequency | L2 Cache | FPU width | HT | Mult. | TDP | Socket | Release date | Order Part Number |
| Athlon II Neo K125 | 1.7 GHz | 1 MB | 64-bit | 1.0 GHz | 8.5× | 12 W | ASB2 | May 12, 2010 | AMK125LAV13GM |
| Athlon II Neo K145 | 1.8 GHz | 1 MB | 64-bit | 1.0 GHz | 9× | 12 W | ASB2 | January 4, 2011 | AMK145LAV13GM |
Dual-core mobile processor
* view
* talk
| Model number | Frequency | L2 Cache | FPU width | HT | Mult. | TDP | Socket | Release date | Order Part Number |
| Athlon II Neo N36L | 1.3 GHz | 2 × 1 MB | 64-bit | 1.0 GHz | 6.5× | 12 W | ASB2 | April 26, 2010 | AEN36LLAV23GME |
| Athlon II Neo K325 | 1.3 GHz | 2 × 1 MB | 64-bit | 1.0 GHz | 6.5× | 12 W | ASB2 | May 12, 2010 | AMK325LAV23GM |
| Athlon II Neo K345 | 1.4 GHz | 2 × 1 MB | 64-bit | 1.0 GHz | 7× | 12 W | ASB2 | January 4, 2011 | AMK345LAV23GM |

### Turion II Neo
#### "Geneva" (45 nm)

Dual-core mobile processor
* view
* talk
| Model number | Clock speed | L2 cache | FPU width | Hyper Transport | Multi | TDP | Socket | Release date | Part number |
| Turion II Neo N40L | 1.5 GHz | 2 × 1 MB | 128-bit | 1.6 GHz | 7.5× | 15 W | Socket ASB2 | April 26, 2010 | TEN40LGAV23GME |
| Turion II K625 | 1.5 GHz | 2 × 1 MB | 128-bit | 1.6 GHz | 7.5× | 15 W | Socket ASB2 | May 12, 2010 | TMK625GAV23GM |
| Turion II K645 | 1.6 GHz | 2 × 1 MB | 128-bit | 1.6 GHz | 8× | 15 W | Socket ASB2 | January 4, 2011 | TMK645GAV23GM |
| Turion II K665 | 1.7 GHz | 2 × 1 MB | 128-bit | 1.6 GHz | 8.5× | 15 W | Socket ASB2 | May 12, 2010 | TMK665GAV23GM |
| Turion II K685 | 1.8 GHz | 2 × 1 MB | 128-bit | 1.6 GHz | 9× | 15 W | Socket ASB2 | January 4, 2011 | TMK685GAV23GM |
| Turion II Neo N54L | 2.2 GHz | 2 × 1 MB | 128-bit | 1.6 GHz | 11× | 25 W | Socket ASB2 | May 2010 | TEN54LSDV23GME |

## Danube platform (2010)

The Danube platform introduced on May 12, 2010, for the AMD Mainstream Notebook Platform consists of:
| AMD mobile | Initial platform |
| Mobile processor | Processors Single, Dual, Triple or Quad-core 64-bit processors codenamed Champlain, with the following: made on 45 nm process support for DDR3 memory 25, 35 or 45 W TDP |
| Mobile chipset | AMD RS880 series chipset + SB850 southbridge Mobility Radeon HD 42xx GPU on 55 nm process RV620 graphics core DirectX 10.1 UVD 2 |
* MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
* Memory support: DDR3 SDRAM, DDR3L SDRAM (Up to 1066 MHz)

### V series
#### Champlain (45 nm)

Single-core mobile processor
* view
* talk
| Model number | Clock speed | L2 cache | FPU width | Hyper Transport | Multi | TDP | Socket | Release date | Part number |
| V120 | 2.2 GHz | 512 KB | 64-bit | 1.6 GHz | 11× | 25 W | S1G4 | May 12, 2010 | VMV120SGR12GM |
| V140 | 2.3 GHz | 512 KB | 64-bit | 1.6 GHz | 11.5× | 25 W | S1G4 | October 4, 2010 | VMV140SGR12GM |
| V160 | 2.4 GHz | 512 KB | 64-bit | 1.6 GHz | 12× | 25 W | S1G4 | January 4, 2011 | VMV160SGR12GM |

### Athlon II
#### Champlain (45 nm)

Dual-core mobile processor
* view
* talk
| Model Number | Frequency | L2 cache | FPU width | HT | Mult. | TDP | Socket | Release date | Order Part Number |
| Athlon II P320 | 2.1 GHz | 2 × 512 KB | 64-bit | 1.6 GHz | 10.5× | 25 W | Socket S1G4 | May 12, 2010 | AMP320SGR22GM |
| Athlon II P340 | 2.2 GHz | 2 × 512 KB | 64-bit | 1.6 GHz | 11× | 25 W | Socket S1G4 | October 4, 2010 | AMP340SGR22GM |
| Athlon II P360 | 2.3 GHz | 2 × 512 KB | 64-bit | 1.6 GHz | 11.5× | 25 W | Socket S1G4 | January 4, 2011 | AMP360SGR22GM |
| Athlon II N330 | 2.3 GHz | 2 × 512 KB | 64-bit | 1.6 GHz | 11.5× | 35 W | Socket S1G4 | May 12, 2010 | AMN330DCR22GM |
| Athlon II N350 | 2.4 GHz | 2 × 512 KB | 64-bit | 1.6 GHz | 12× | 35 W | Socket S1G4 | October 4, 2010 | AMN350DCR22GM |
| Athlon II N370 | 2.5 GHz | 2 × 512 KB | 64-bit | 1.6 GHz | 12.5× | 35 W | Socket S1G4 | January 4, 2011 | AMN370DCR22GM |

### Turion II
#### Champlain (45 nm)

Dual-core mobile processor
* view
* talk
| Model number | Clock speed | L2 cache | FPU width | Hyper Transport | Multi | TDP | Socket | Release date | Part number |
| Turion II P520 | 2.3 GHz | 2 × 1 MB | 128-bit | 1.8 GHz | 11.5× | 25 W | Socket S1G4 | May 12, 2010 | TMP520SGR23GM |
| Turion II P540 | 2.4 GHz | 2 × 1 MB | 128-bit | 1.8 GHz | 12× | 25 W | Socket S1G4 | October 4, 2010 | TMP540SGR23GM |
| Turion II P560 | 2.5 GHz | 2 × 1 MB | 128-bit | 1.8 GHz | 12.5× | 25 W | Socket S1G4 | October 19, 2010 | TMP560SGR23GM |
| Turion II N530 | 2.5 GHz | 2 × 1 MB | 128-bit | 1.8 GHz | 12.5× | 35 W | Socket S1G4 | May 12, 2010 | TMN530DCR23GM |
| Turion II N550 | 2.6 GHz | 2 × 1 MB | 128-bit | 1.8 GHz | 13× | 35 W | Socket S1G4 | October 4, 2010 | TMN550DCR23GM |
| Turion II N570 | 2.7 GHz | 2 × 1 MB | 128-bit | 1.8 GHz | 13.5× | 35 W | Socket S1G4 | January 4, 2011 | TMN570DCR23GM |

### Phenom II

* MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
* Unlike desktop models, mobile Phenom II-based models do not have L3 cache
* Memory support: DDR3 SDRAM, DDR3L SDRAM (Up to 1333 MHz)

#### Champlain (45 nm)

Dual-core mobile processor
* view
* talk
| Model number | Clock speed | L2 cache | FPU width | Hyper Transport | Multi | TDP | Socket | Release date | Part number |
| Phenom II P650 | 2.6 GHz | 2 × 1 MB | 128-bit | 1.8 GHz | 13× | 25 W | Socket S1G4 | October 19, 2010 | HMP650SGR23GM |
| Phenom II N620 | 2.8 GHz | 2 × 1 MB | 128-bit | 1.8 GHz | 14× | 35 W | Socket S1G4 | May 12, 2010 | HMN620DCR23GM |
| Phenom II N640 | 2.9 GHz | 2 × 1 MB | 128-bit | 1.8 GHz | 14.5× | 35 W | Socket S1G4 | October 4, 2010 | HMN640DCR23GM |
| Phenom II N660 | 3.0 GHz | 2 × 1 MB | 128-bit | 1.8 GHz | 15× | 35 W | Socket S1G4 | January 4, 2011 | HMN660DCR23GM |
| Phenom II X620 BE | 3.1 GHz | 2 × 1 MB | 128-bit | 1.8 GHz | 15.5× | 45 W | Socket S1G4 | May 12, 2010 | HMX620HIR23GM |
| Phenom II X640 BE | 3.2 GHz | 2 × 1 MB | 128-bit | 1.8 GHz | 16× | 45 W | Socket S1G4 | May 10, 2011 | HMX640HIR23GM |
Triple-core mobile processors
* view
* talk
| Model number | Clock speed | L2 cache | FPU width | Hyper Transport | Multi | TDP | Socket | Release date | Part number |
| Phenom II P820 | 1.8 GHz | 3 × 512 KB | 128-bit | 1.8 GHz | 9× | 25 W | Socket S1G4 | May 12, 2010 | HMP820SGR32GM |
| Phenom II P840 | 1.9 GHz | 3 × 512 KB | 128-bit | 1.8 GHz | 9.5× | 25 W | Socket S1G4 | October 4, 2010 | HMP840SGR32GM |
| Phenom II P860 | 2.0 GHz | 3 × 512 KB | 128-bit | 1.8 GHz | 10× | 25 W | Socket S1G4 | October 4, 2010 | HMP860SGR32GM |
| Phenom II N830 | 2.1 GHz | 3 × 512 KB | 128-bit | 1.8 GHz | 10.5× | 35 W | Socket S1G4 | May 12, 2010 | HMN830DCR32GM |
| Phenom II N850 | 2.2 GHz | 3 × 512 KB | 128-bit | 1.8 GHz | 11× | 35 W | Socket S1G4 | October 4, 2010 | HMN850DCR32GM |
| Phenom II N870 | 2.3 GHz | 3 × 512 KB | 128-bit | 1.8 GHz | 11.5× | 35 W | Socket S1G4 | January 4, 2011 | HMN870DCR32GM |
Quad-core mobile processors
* view
* talk
| Model number | Clock speed | L2 cache | FPU width | Hyper Transport | Multi | TDP | Socket | Release date | Part number |
| Phenom II P920 | 1.6 GHz | 4 × 512 KB | 128-bit | 1.8 GHz | 8× | 25 W | Socket S1G4 | May 12, 2010 | HMP920SGR42GM |
| Phenom II P940 | 1.7 GHz | 4 × 512 KB | 128-bit | 1.8 GHz | 8.5× | 25 W | Socket S1G4 | October 4, 2010 | HMP940SGR42GM |
| Phenom II P960 | 1.8 GHz | 4 × 512 KB | 128-bit | 1.8 GHz | 9× | 25 W | Socket S1G4 | October 19, 2010 | HMP960SGR42GM |
| Phenom II N930 | 2.0 GHz | 4 × 512 KB | 128-bit | 1.8 GHz | 10× | 35 W | Socket S1G4 | May 12, 2010 | HMN930DCR42GM |
| Phenom II N950 | 2.1 GHz | 4 × 512 KB | 128-bit | 1.8 GHz | 10.5× | 35 W | Socket S1G4 | October 4, 2010 | HMN950DCR42GM |
| Phenom II N970 | 2.2 GHz | 4 × 512 KB | 128-bit | 1.8 GHz | 11× | 35 W | Socket S1G4 | January 4, 2011 | HMN970DCR42GM |
| Phenom II X920 BE | 2.3 GHz | 4 × 512 KB | 128-bit | 1.8 GHz | 11.5× | 45 W | Socket S1G4 | May 12, 2010 | HMX920HIR42GM |
| Phenom II X940 BE | 2.4 GHz | 4 × 512 KB | 128-bit | 1.8 GHz | 12× | 45 W | Socket S1G4 | January 4, 2011 | HMX940HIR42GM |

## Brazos platform (2011)

AMD Ultrathin Platform introduced on January 5, 2011, as the fourth AMD mobile platform targeting the ultra-portable notebook market. It features the 40 nm AMD Ontario (a 9-watt AMD APU for netbooks and small form factor desktops and devices) and Zacate (an 18-watt TDP APU for ultrathin, mainstream, and value notebooks as well as desktops and all-in-ones) APUs. Both low-power APU versions feature two Bobcat x86 cores and fully support DirectX11, DirectCompute (Microsoft programming interface for GPU computing) and OpenCL (cross-platform programming interface standard for multi-core x86 and accelerated GPU computing). Both also include UVD dedicated hardware acceleration for HD video including 1080p resolutions. This platform consists of:
| AMD mobile | Initial platform |
| Mobile processor | Processors Single or Dual-core 64-bit AMD APU codenamed Ontario, Zacate and with the following: Bobcat cores made on 40 nm CMOS process support for DDR3 1066 or 1333 MHz (E-450) memory 9 W or 18 W TDP Radeon HD 6xxx GPU on 40 nm process Cedar graphics core with 80 SP DirectX 11 UVD 3 |
| Mobile chipset | A50M (Hudson-M1) |

### "Ontario" (40 nm)

* SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, PowerNow!, AMD-V
* Memory support: DDR3 SDRAM, DDR3L SDRAM (Single-channel, up to 1066 MHz)
* 2.5 GT/s UMI.
* Config GPU are Unified shaders : Texture mapping units : Render output units
* Socket FT1 (BGA-413)
| Model Number | Step. | CPU | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | Memory Support | TDP | Released | Part Number | Info |
| Model Number | Step. | Cores | Freq. | Turbo | L2 Cache | Mult. | Voltage | Model | Config | Freq. | Memory Support | TDP | Released | Part Number | Info |
| C-30 | B0 | 1 | 1.2 GHz | — | 512 kB | 12× | 1.25 – 1.35 | HD 6250 | 80:8:4 | 276 MHz | DDR3-1066 | 9 W | January 4, 2011 | CMC30AFPB12GT | C-30 |
| C-50 | B0 | 2 | 1.0 GHz | — | 2 × 512 kB | 10× | 1.05 – 1.35 | HD 6250 | 80:8:4 | 277 MHz | DDR3-1066 | 9 W | January 4, 2011 | CMC50AFPB22GT | C-50 |
| C-60 | C0 | 2 | 1.0 GHz | 1.33 GHz | 2 × 512 kB | 10× | | HD 6290 | 80:8:4 | 276 – 400 MHz | DDR3-1066 | 9 W | August 22, 2011 | CMC60AFPB22GV | C-60 |

### "Zacate" (40 nm)

* SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, PowerNow!, AMD-V
* Memory support: DDR3 SDRAM, DDR3L SDRAM (Single-channel, up to 1066 MHz)
* 2.5 GT/s UMI.
* Config GPU are Unified shaders : Texture mapping units : Render output units
* Socket FT1 (BGA-413)
| Model Number | Step. | CPU | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | Memory Support | TDP | Released | Part Number | Info |
| Model Number | Step. | Cores | Freq. | Turbo | L2 Cache | Mult. | Voltage | Model | Config | Freq. | Memory Support | TDP | Released | Part Number | Info |
| E-240 | B0 | 1 | 1.5 GHz | — | 512 kB | 15× | 1.175 – 1.35 | HD 6310 | 80:8:4 | 500 MHz | DDR3-1066 | 18 W | January 4, 2011 | EME240GBB12GT | E-240 |
| E-300 | B0 | 2 | 1.3 GHz | — | 2 × 512 kB | 13× | | HD 6310 | 80:8:4 | 488 MHz | DDR3-1066 | 18 W | August 22, 2011 | EME300GBB22GV | E-300 |
| E-350 | B0 | 2 | 1.6 GHz | — | 2 × 512 kB | 16× | 1.25 – 1.35 | HD 6310 | 80:8:4 | 492 MHz | DDR3-1066 | 18 W | January 4, 2011 | EME350GBB22GT | E-350 |
| E-450 | B0 | 2 | 1.65 GHz | — | 2 × 512 kB | 16.5× | | HD 6320 | 80:8:4 | 508 – 600 MHz | DDR3-1333 | 18 W | August 22, 2011 | EME450GBB22GV | E-450 |

## Sabine (Fusion) platform (2011)

The Sabine platform introduced on June 30, 2011, for the AMD Mainstream Notebook Platform consists of:
| AMD mobile | Initial platform |
| Mobile processor | Processors Dual or Quad-core 64-bit AMD APU codenamed Llano, and with the following: made on 32 nm process support for DDR3 1600 MHz memory 35 W or 45 W TDP Radeon HD 6xxxG GPU on 32 nm process Sumo graphics core with up to 400 SP DirectX 11 UVD 3 |
| Mobile chipset | A60M, A70M (Hudson-M2, Hudson-M3) |

### "Llano" (32 nm)

* SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V, Turbo Core
* Memory support: 1.35 V DDR3L-1333 memory, in addition to regular 1.5 V DDR3 memory specified (Dual-channel)
* 2.5 GT/s UMI.
* Transistors: 1.148 billion
* Die size: 228 mm²
| Model Number | Step. | CPU | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | Memory Support | TDP | Socket | Release Date | Part Number(s) |
| Model Number | Step. | Cores | Freq. | Turbo | L2 Cache | Mult. | V$_{core}$ | Model | Config$^1$ | Freq. | Memory Support | TDP | Socket | Release Date | Part Number(s) |
| E2-3000M | B0 | 2 | 1.8 GHz | 2.4 GHz | 2 × 512 kB | 18x | 0.9125 – 1.4125 | HD 6380G | 160:8:4 | 400 MHz | DDR3-1333 | 35 W | FS1 | June 14, 2011 | EM3000DDX22GX |
| A4-3300M | B0 | 2 | 1.9 GHz | 2.5 GHz | 2 × 1 MB | 19x | 0.9125 – 1.4125 | HD 6480G | 240:12:4 | 444 MHz | DDR3-1333 | 35 W | FS1 | June 14, 2011 | AM3300DDX23GX |
| A4-3305M | B0 | 2 | 1.9 GHz | 2.5 GHz | 2 × 512 kB | 19x | 0.8750 – 1.4125 | HD 6480G | 160:8:4 | 593 MHz | DDR3-1333 | 35 W | FS1 | December 7, 2011 | AM3305DDX22GX |
| A4-3310MX | B0 | 2 | 2.1 GHz | 2.5 GHz | 2 × 1 MB | 21x | 0.9125 – 1.4125 | HD 6480G | 240:12:4 | 444 MHz | DDR3-1333 | 35 W | FS1 | June 14, 2011 | AM3310HLX23GX |
| A4-3320M | B0 | 2 | 2.0 GHz | 2.6 GHz | 2 × 1 MB | 20x | 0.9125 – 1.4125 | HD 6480G | 240:12:4 | 444 MHz | DDR3-1333 | 35 W | FS1 | December 7, 2011 | AM3320DDX23GX |
| A4-3330MX | B0 | 2 | 2.2 GHz | 2.6 GHz | 2 × 1 MB | 22x | 0.9125 – 1.4125 | HD 6480G | 240:12:4 | 444 MHz | DDR3-1600 | 45 W | FS1 | December 7, 2011 | AM3330HLX23GX |
| A6-3400M | B0 | 4 | 1.4 GHz | 2.3 GHz | 4 × 1 MB | 14x | 0.9125 – 1.4125 | HD 6520G | 320:16:8 | 400 MHz | DDR3-1333 | 35 W | FS1 | June 14, 2011 | AM3400DDX43GX |
| A6-3410MX | B0 | 4 | 1.6 GHz | 2.3 GHz | 4 × 1 MB | 16x | 0.9125 – 1.4125 | HD 6520G | 320:16:8 | 400 MHz | DDR3-1600 | 45 W | FS1 | June 14, 2011 | AM3410HLX43GX |
| A6-3420M | B0 | 4 | 1.5 GHz | 2.4 GHz | 4 × 1 MB | 15x | 0.9125 – 1.4125 | HD 6520G | 320:16:8 | 400 MHz | DDR3-1333 | 35 W | FS1 | December 7, 2011 | AM3420DDX43GX |
| A6-3430MX | B0 | 4 | 1.7 GHz | 2.4 GHz | 4 × 1 MB | 17x | 0.9125 – 1.4125 | HD 6520G | 320:16:8 | 400 MHz | DDR3-1600 | 45 W | FS1 | December 7, 2011 | AM3430HLX43GX |
| A8-3500M | B0 | 4 | 1.5 GHz | 2.4 GHz | 4 × 1 MB | 15x | 0.9125 – 1.4125 | HD 6620G | 400:20:8 | 444 MHz | DDR3-1333 | 35 W | FS1 | June 14, 2011 | AM3500DDX43GX |
| A8-3510MX | B0 | 4 | 1.8 GHz | 2.5 GHz | 4 × 1 MB | 18x | 0.9125 – 1.4125 | HD 6620G | 400:20:8 | 444 MHz | DDR3-1600 | 45 W | FS1 | June 14, 2011 | AM3510HLX43GX |
| A8-3520M | B0 | 4 | 1.6 GHz | 2.5 GHz | 4 × 1 MB | 16x | 0.9125 – 1.4125 | HD 6620G | 400:20:8 | 444 MHz | DDR3-1333 | 35 W | FS1 | December 7, 2011 | AM3520DDX43GX |
| A8-3530MX | B0 | 4 | 1.9 GHz | 2.6 GHz | 4 × 1 MB | 19x | 0.9125 – 1.4125 | HD 6620G | 400:20:8 | 444 MHz | DDR3-1600 | 45 W | FS1 | June 14, 2011 | AM3530HLX43GX |
| A8-3550MX | B0 | 4 | 2.0 GHz | 2.7 GHz | 4 × 1 MB | 20x | 0.9125 – 1.4125 | HD 6620G | 400:20:8 | 444 MHz | DDR3-1600 | 45 W | FS1 | December 7, 2011 | AM3550HLX43GX |
$^1$ Unified shaders : Texture mapping units : Render output units

## Brazos 2.0 platform (2012)

AMD Ultrathin Platform introduced on June 6, 2012, as the fourth AMD mobile platform targeting the ultra-portable notebook market. It will feature the 40 nm Zacate (an 18-watt TDP APU for ultrathin, mainstream, and value notebooks as well as desktops and all-in-ones) APUs. This platform consists of:
| AMD mobile | Initial platform |
| Mobile processor | Processors Dual-core 64-bit AMD APU codenamed Zacate and with the following: Bobcat cores made on 40 nm CMOS process support for DDR3 1333 MHz memory 18 W TDP Radeon HD 7xxx GPU on 40 nm process Cedar graphics core with 80 SP DirectX 11 UVD 3 |
| Mobile chipset | A68M (Hudson-M3L) |

### "Ontario", "Zacate" (40 nm)

* SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, PowerNow!, AMD-V
* Single-channel DDR3 SDRAM, DDR3L SDRAM
* 2.5 GT/s UMI.
* Config GPU are Unified shaders : Texture mapping units : Render output units
* Socket FT1 (BGA-413)
| Model Number | Step. | CPU | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | GPU | Memory Support | TDP | Release Date | Part Number |
| Model Number | Step. | Cores | Freq. | Turbo | L2 Cache | Mult. | V$_{core}$ | Model | Config | Freq. | Turbo | Memory Support | TDP | Release Date | Part Number |
| C-70 | C0 | 2 | 1.0 GHz | 1.33 GHz | 2 × 512 kB | 10× | | HD 7290 | 80:8:4 | 276 MHz | 400 MHz | DDR3-1066 | 09 W | September 27, 2012 | CMC70AFPB22GV |
| E1-1200 | B0 | 2 | 1.4 GHz | — | 2 × 512 kB | 14× | | HD 7310 | 80:8:4 | 500 MHz | — | DDR3-1066 | 18 W | June 6, 2012 | EM1200GBB22GV |
| E2-1500 | B0 | 2 | 1.48 GHz | — | 2 × 512 kB | | | HD 7310 | 80:8:4 | 529 MHz | — | DDR3-1066 | 18 W | January 7, 2013 | |
| E2-1800 | B0 | 2 | 1.7 GHz | — | 2 × 512 kB | 17× | | HD 7340 | 80:8:4 | 523 MHz | 680 MHz | DDR3-1333 | 18 W | June 6, 2012 | EM1800GBB22GV |
| E2-2000 | B0 | 2 | 1.75 GHz | — | 2 × 512 kB | | | HD 7340 | 80:8:4 | 538 MHz | 700 MHz | DDR3-1333 | 18 W | January 7, 2013 | |

## Comal (Fusion) platform (2012)

The Comal platform introduced on May 15, 2012, for the AMD Mainstream Notebook Platform consists of:
| AMD mobile | Initial platform |
| Mobile processor | Processors Dual or Quad-core 64-bit AMD APU codenamed Trinity, and with the following: Piledriver cores made on 32 nm process support for DDR3 1600 MHz memory 17 W, 25 W or 35 W TDP Radeon HD 7xxxG GPU on 32 nm process Devastator graphics core with up to 384 SP DirectX 11 UVD 3.2 |
| Mobile chipset | A70M (Hudson-M3) |

### "Trinity" (2012, 32 nm)

* MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, NX bit, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, CVT16, F16C, Turbo Core
* Memory support: 1.35 V DDR3L-1600 memory, in addition to regular 1.5 V DDR3 memory specified (Dual-channel)
* 2.5 GT/s UMI.
* Transistors: 1.303 billion
* Die size: 246 mm²
| Model Number | Step. | CPU | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | GPU | Memory Support | TDP | Socket | Release Date | Part Number(s) |
| Model Number | Step. | Cores | Freq. | Turbo | L2 Cache | Mult. | V$_{core}$ | Model | Config$^1$ | Freq. | Turbo | Memory Support | TDP | Socket | Release Date | Part Number(s) |
| standard power |||||||||||||||||
| A4-4300M | B0 | 2 | 2.5 GHz | 3.0 GHz | 1 MB | 25× | 0.8125 – 1.3 | HD 7420G | 128:8:4 | 480 MHz | 655 MHz | DDR3-1600 | 35 W | FS1r2 | May 2012 | AM4300DEC23HJ |
| A6-4400M | B0 | 2 | 2.7 GHz | 3.2 GHz | 1 MB | 27× | 0.8125 – 1.3 | HD 7520G | 192:12:4 | 496 MHz | 685 MHz | DDR3-1600 | 35 W | FS1r2 | May 15, 2012 | AM4400DEC23HJ |
| A8-4500M | B0 | 4 | 1.9 GHz | 2.8 GHz | 2 × 2 MB | 19× | 0.8125 – 1.3 | HD 7640G | 256:16:8 | 496 MHz | 685 MHz | DDR3-1600 | 35 W | FS1r2 | May 15, 2012 | AM4500DEC44HJ |
| A10-4600M | B0 | 4 | 2.3 GHz | 3.2 GHz | 2 × 2 MB | 23× | 0.8125 – 1.3 | HD 7660G | 384:24:8 | 496 MHz | 685 MHz | DDR3-1600 | 35 W | FS1r2 | May 15, 2012 | AM4600DEC44HJ |
| low power |||||||||||||||||
| A4-4355M | B0 | 2 | 1.9 GHz | 2.4 GHz | 1 MB | 21× | | HD 7400G | 192:12:4 | 327 MHz | 424 MHz | DDR3-1333 | 17 W | FP2 | September 27, 2012 | AM4355SHE23HJ |
| A6-4455M | B0 | 2 | 2.1 GHz | 2.6 GHz | 2 MB | 21× | 0.775 – 1.15 | HD 7500G | 256:16:8 | 327 MHz | 424 MHz | DDR3-1333 | 17 W | FP2 | May 15, 2012 | AM4455SHE24HJ |
| A8-4555M | B0 | 4 | 1.6 GHz | 2.4 GHz | 2 × 2 MB | 16× | | HD 7600G | 384:24:8 | 320 MHz | 424 MHz | DDR3-1333 | 19 W | FP2 | September 27, 2012 | AM4555SHE44HJ |
| A10-4655M | B0 | 4 | 2.0 GHz | 2.8 GHz | 2 × 2 MB | 20× | 0.85 – 1.2 | HD 7620G | 384:24:8 | 360 MHz | 496 MHz | DDR3-1333 | 25 W | FP2 | May 15, 2012 | AM4655SIE44HJ |
$^1$ Config GPU are Unified shaders : Texture mapping units : Render output units

### "Richland" (2013, 32 nm)

* Elite Performance APU.
* MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, NX bit, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, CVT16, F16C, Turbo Core
* Memory support: 1.35 V DDR3L-1600 memory, in addition to regular 1.5 V DDR3 memory specified (Dual-channel)
* 2.5 GT/s UMI.
* Transistors: 1.303 billion
* Die size: 246 mm²
| Model Number | Step. | CPU | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | GPU | Memory Support | TDP | Socket | Release Date | Part Number(s) |
| Model Number | Step. | Cores | Freq. | Turbo | L2 Cache | Mult. | V$_{core}$ | Model | Config | Freq. | Turbo | Memory Support | TDP | Socket | Release Date | Part Number(s) |
| standard power |||||||||||||||||
| A4-5150M | | 2 | 2.7 GHz | 3.3 GHz | 1 MB | | | HD 8350G | 128:8:4 | 533 MHz | 720 MHz | DDR3-1600 | 35 W | FS1r2 | Q1 2013 | AM5150DEC23HL |
| A6-5350M | | 2 | 2.9 GHz | 3.5 GHz | 1 MB | | | HD 8450G | 192:12:4 | 533 MHz | 720 MHz | DDR3-1600 | 35 W | FS1r2 | Q1 2013 | AM5350DEC23HL |
| A6-5357M | | 2 | 2.9 GHz | 3.5 GHz | 1 MB | | | HD 8450G | 192 | 533 MHz | 720 MHz | DDR3L-1600 | 35 W | FP2 (BGA) | May 2013 | AM5357DFE23HL |
| A8-5550M | | 4 | 2.1 GHz | 3.1 GHz | 2 × 2 MB | | | HD 8550G | 256:16:8 | 515 MHz | 720 MHz | DDR3-1600 | 35 W | FS1r2 | Q1 2013 | AM5550DEC44HL |
| A8-5557M | | 4 | 2.1 GHz | 3.1 GHz | 2 × 2 MB | | | HD 8550G | 256 | 554 MHz | 720 MHz | DDR3L-1600 | 35 W | FP2 (BGA) | May 2013 | AM5557DFE44HL |
| A10-5750M | | 4 | 2.5 GHz | 3.5 GHz | 2 × 2 MB | | | HD 8650G | 384:24:8 | 533 MHz | 720 MHz | DDR3-1866 | 35 W | FS1r2 | Q1 2013 | AM5750DEC44HL |
| A10-5757M | | 4 | 2.5 GHz | 3.5 GHz | 2 × 2 MB | | | HD 8650G | 384 | 600 MHz | 720 MHz | DDR3L-1600 | 35 W | FP2 (BGA) | May 2013 | AM5757DFE44HL |
| low power |||||||||||||||||
| A4-5145M | | 2 | 2.0 GHz | 2.6 GHz | 1 MB | | | HD 8310G | 128 | 424 MHz | 554 MHz | DDR3L-1333 | 17 W | FP2 (BGA) | May 2013 | AM5145SIE44HL? |
| A6-5345M | | 2 | 2.2 GHz | 2.8 GHz | 1 MB | | | HD 8410G | 192 | 450 MHz | 600 MHz | DDR3L-1333 | 17 W | FP2 (BGA) | May 2013 | AM5345SIE44HL? |
| A8-5545M | | 4 | 1.7 GHz | 2.7 GHz | 2 × 2 MB | | | HD 8510G | 384 | 450 MHz | 554 MHz | DDR3L-1333 | 19 W | FP2 (BGA) | May 2013 | AM5545SIE44HL |
| A10-5745M | | 4 | 2.1 GHz | 2.9 GHz | 2 × 2 MB | | | HD 8610G | 384 | 533 MHz | 626 MHz | DDR3L-1333 | 25 W | FP2 (BGA) | May 2013 | AM5745SIE44HL |
$^1$ Config GPU are Unified shaders : Texture mapping units : Render output units

## Jaguar (2013)

| AMD mobile | Initial platform |
| Mobile processor | Processors Dual-core or quad-core 64-bit AMD APU codenamed Kabini, Temash and with the following: Jaguar cores made on 28 nm CMOS process support for Single-channel DDR3 SDRAM and DDR3L SDRAM 1600 MHz memory 3.9 – 25 W TDP Radeon HD 8xxx GPU on 28 nm process Graphics core with 128 SP GPU based on Graphics Core Next architecture DirectX 11.1 Video Coding Engine Integrated FCH SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, CLMUL, AES, F16C, ABM, BMI1, NX bit, AMD64, PowerNow!, AMD-V Socket FT3 (BGA) Turbo Dock Technology, C6 and CC6 low power states |

### "Temash" (2013, 28 nm)

Elite Mobility APU:
| Model | Step. | CPU | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | GPU | Memory | TDP | Released | Part Number |
| Model | Step. | Cores | Freq. | Turbo | L2 Cache | Mult. | V$_{core}$ | Model | Config$^1$ | Freq. | Turbo | Memory | TDP | Released | Part Number |
| A4-1200 | B0 | 2 | 1.0 GHz | — | 1 MB | | | HD 8180 | 128:8:4 | 225 MHz | — | DDR3L-1066 | 3.9 W | May 2013 | AT1200IFJ23HM |
| A4-1250 | B0 | 2 | 1.0 GHz | — | 1 MB | | | HD 8210 | 128:8:4 | 300 MHz | — | DDR3L-1333 | 8 W | May 2013 | AT1250IDJ23HM |
| A6-1450 | B0 | 4 | 1.0 GHz | 1.4 GHz | 2 MB | | | HD 8250 | 128:8:4 | 300 MHz | 400 MHz | DDR3L-1066 | 8 W | May 2013 | AT1450IDJ44HM |
$^1$ Unified shaders : Texture mapping units : Render output units

### "Kabini" (2013, 28 nm)

Mainstream APU:
| Model | Step. | CPU | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | GPU | Memory | TDP | Released | Part Number |
| Model | Step. | Cores | Freq. | Turbo | L2 Cache | Mult. | V$_{core}$ | Model | Config$^1$ | Freq. | Turbo | Memory | TDP | Released | Part Number |
| E1-2100 | B0 | 2 | 1.00 GHz | — | 1 MB | | | HD 8210 | 128:8:4 | 300 MHz | — | DDR3L-1333 | 09 W | May 2013 | EM2100ICJ23HM |
| E1-2500 | B0 | 2 | 1.40 GHz | — | 1 MB | | | HD 8240 | 128:8:4 | 400 MHz | — | DDR3L-1333 | 15 W | May 2013 | EM2500IBJ23HM |
| E2-3000 | B0 | 2 | 1.65 GHz | — | 1 MB | | | HD 8280 | 128:8:4 | 450 MHz | — | DDR3L-1600 | 15 W | May 2013 | EM3000IBJ23HM |
| A4-5000 | B0 | 4 | 1.50 GHz | — | 2 MB | | | HD 8330 | 128:8:4 | 500 MHz | — | DDR3L-1600 | 15 W | May 2013 | AM5000IBJ44HM |
| A6-5200 | B0 | 4 | 2.00 GHz | — | 2 MB | | | HD 8400 | 128:8:4 | 600 MHz | — | DDR3L-1600 | 25 W | May 2013 | AM5200IAJ44HM |
$^1$ Unified shaders : Texture mapping units : Render output units

## Puma (2014)
### Mullins, Tablet/2-in-1 APU

| Model | Stepping | CPU | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | GPU | Memory support | TDP | Released | Part number |
| Model | Stepping | Cores | Frequency | Turbo | L2 Cache | Multi | V$_{core}$ | Model | Config | Frequency | Turbo | Memory support | TDP | Released | Part number |
| E1 Micro-6200T | | 2 | 1.0 GHz | 1.4 GHz | 1 MB | | 0.50 – 1.40 V | R2 | 128:8:4 | | 300 MHz | DDR3L-1066 | 3.95 W | Q2 2014 | EM620TIWJ23JB |
| A4 Micro-6400T | | 4 | 1.0 GHz | 1.6 GHz | 2 MB | | 0.50 – 1.40 V | R3 | 128:8:4 | | 350 MHz | DDR3L-1333 | 4.5 W | Q2 2014 | AM640TIVJ44JB |
| A10 Micro-6700T | | 4 | 1.2 GHz | 2.2 GHz | 2 MB | | 0.50 – 1.40 V | R6 | 128:8:4 | | 500 MHz | DDR3L-1333 | 4.5 W | Q2 2014 | AM670TIVJ44JB |

### Beema, Notebook APU

| Model | Stepping | CPU | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | GPU | Memory support | TDP | Released | Part number |
| Model | Stepping | Cores | Frequency | Turbo | L2 Cache | Multi | V$_{core}$ | Model | Config | Frequency | Turbo | Memory support | TDP | Released | Part number |
| E1-6010 | | 2 | 1.35 GHz | — | 1 MB | | 0.50 – 1.40 V | R2 | 128:8:4 | | 350 MHz | DDR3L-1333 | 10 W | Q2 2014 | EM6010IUJ23JB |
| E2-6110 | | 4 | 1.5 GHz | — | 2 MB | | 0.50 – 1.40 V | R2 | 128:8:4 | | 500 MHz | DDR3L-1600 | 15 W | Q2 2014 | EM6110ITJ44JB |
| A4-6210 | | 4 | 1.8 GHz | — | 2 MB | | 0.50 – 1.40 V | R3 | 128:8:4 | | 600 MHz | DDR3L-1600 | 15 W | Q2 2014 | AM6210ITJ44JB |
| A6-6310 | | 4 | 1.8 GHz | 2.4 GHz | 2 MB | | 0.50 – 1.40 V | R4 | 128:8:4 | | 800 MHz | DDR3L-1866 | 15 W | Q2 2014 | AM6310ITJ44JB |
| A8-6410 | | 4 | 2 GHz | 2.4 GHz | 2 MB | | 0.50 – 1.40 V | R5 | 128:8:4 | | 800 MHz | DDR3L-1866 | 15 W | Q2 2014 | AM6410ITJ44JB |

## Kaveri (2014)

| Model number | CPU | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | GPU | Memory support | TDP | Socket | Released | Part number |
| Model number | Cores | Frequency | Turbo | L2 Cache | Multi | V$_{core}$ | Model | Config | Frequency | Turbo | Memory support | TDP | Socket | Released | Part number |
| low power ||||||||||||||||
| A6-7000 | 2 | 2.2 GHz | 3.0 GHz | 1 MB | 22× | | R4 | 192:12:4 | 494 MHz | 533 MHz | DDR3-1333 | 17W | FP3 | June 2014 | AM7000ECH23JA |
| A6 Pro-7050B | 2 | 2.2 GHz | 3.0 GHz | 1 MB | 22× | | R4 | 192:12:4 | 553 MHz | — | DDR3-1333 | 17W | FP3 | June 2014 | AM705BECH23JA |
| A8-7100 | 4 | 1.8 GHz | 3.0 GHz | 2× 2 MB | 18× | | R5 | 256:16:4 | 450 MHz | 514 MHz | DDR3-1600 | 19W | FP3 | June 2014 | AM7100ECH44JA |
| A8 Pro-7150B | 4 | 1.9 GHz | 3.2 GHz | 2× 2 MB | 19× | | R5 | 256:16:4 | 553 MHz | — | DDR3-1600 | 19W | FP3 | June 2014 | AM715BECH44JA |
| A10-7300 | 4 | 1.9 GHz | 3.2 GHz | 2× 2 MB | 19× | | R6 | 384:24:8 | 464 MHz | 533 MHz | DDR3-1600 | 19W | FP3 | June 2014 | AM7300ECH44JA |
| A10 Pro-7350B | 4 | 2.1 GHz | 3.3 GHz | 2× 2 MB | 21× | | R6 | 384:24:8 | 553 MHz | — | DDR3-1600 | 19W | FP3 | June 2014 | AM735BECH44JA |
| FX-7500 | 4 | 2.1 GHz | 3.3 GHz | 2× 2 MB | 21× | | R7 | 384:24:8 | 498 MHz | 533 MHz | DDR3-1600 | 19W | FP3 | June 2014 | FM7500ECH44JA |
| standard power ||||||||||||||||
| A8-7200P | 4 | 2.4 GHz | 3.3 GHz | 2× 2 MB | 24× | | R5 | 256:16:4 | 553 MHz | 626 MHz | DDR3-1866 | 35W | FP3 | June 2014 | AM740PDGH44JA |
| A10-7400P | 4 | 2.5 GHz | 3.4 GHz | 2× 2 MB | 25× | | R6 | 384:24:8 | 576 MHz | 654 MHz | DDR3-1866 | 35W | FP3 | June 2014 | AM740PDGH44JA |
| FX-7600P | 4 | 2.7 GHz | 3.6 GHz | 2× 2 MB | 27× | | R7 | 512:32:8 | 600 MHz | 686 MHz | DDR3-2133 | 35W | FP3 | June 2014 | FM760PDGH44JA |

## Carrizo-L (2015)

| Model | Stepping | CPU | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | GPU | Memory support | TDP | Released | Part number |
| Model | Stepping | Cores | Frequency | Turbo | L2 Cache | Multi | V$_{core}$ | Model | Config | Frequency | Turbo | Memory support | TDP | Released | Part number |
| E1-7010 | | 2 | 1.5 GHz | — | 1 MB | | 0.50 – 1.40 V | R2 | 128:8:4 | | 400 MHz | DDR3L-1333 | 10 W | May 2015 | EM7010IUJ23JB |
| E2-7110 | | 4 | 1.8 GHz | — | 2 MB | | 0.50 – 1.40 V | R2 | 128:8:4 | | 600 MHz | DDR3L-1600 | 12-25 W | May 2015 | EM7110ITJ44JB |
| A4-7210 | | 4 | 1.8 GHz | 2.2 GHz | 2 MB | | 0.50 – 1.40 V | R3 | 128:8:4 | | 686 MHz | DDR3L-1600 | 12-25 W | May 2015 | AM7210ITJ44JB |
| A6-7310 | | 4 | 2.0 GHz | 2.4 GHz | 2 MB | | 0.50 – 1.40 V | R4 | 128:8:4 | | 800 MHz | DDR3L-1866 | 12-25 W | May 2015 | AM7310ITJ44JB |
| A8-7410 | | 4 | 2.2 GHz | 2.5 GHz | 2 MB | | 0.50 – 1.40 V | R5 | 128:8:4 | | 847 MHz | DDR3L-1866 | 12-25 W | May 2015 | AM7410ITJ44JB |

## Carrizo (2015)

| Model number | CPU | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | GPU | Memory support | TDP | Socket | Released | Part number |
| Model number | Cores | Frequency | Turbo | L2 Cache | Multi | V$_{core}$ | Model | Config | Frequency | Turbo | Memory support | TDP | Socket | Released | Part number |
| standard power and low power (configurable TDP) ||||||||||||||||
| A6-8500P | 2 | 1.6 GHz | 3.0 GHz | 1 MB | 16× | | R5 | 256:16:4 | 800 MHz | — | DDR3-1600 | 12-35W | FP4 | June 2015 | AM850PAAY23KA |
| A6 PRO-8500B | 2 | 1.6 GHz | 3.0 GHz | 1 MB | 16× | | R5 | 256:16:4 | 800 MHz | — | DDR3-1600 | 12-35W | FP4 | June 2015 | AM850BAAY23KA |
| A8-8600P | 4 | 1.6 GHz | 3.0 GHz | 2× 1 MB | 16× | | R6 | 384:24:8 | 720 MHz | — | DDR3-2133 | 12-35W | FP4 | June 2015 | AM860PAAY43KA |
| A8 PRO-8600B | 4 | 1.6 GHz | 3.0 GHz | 2× 1 MB | 16× | | R6 | 384:24:8 | 720 MHz | — | DDR3-2133 | 12-35W | FP4 | June 2015 | AM860BAAY43KA |
| A10-8700P | 4 | 1.8 GHz | 3.2 GHz | 2× 1 MB | 18× | | R6 | 384:24:8 | 800 MHz | — | DDR3-2133 | 12-35W | FP4 | June 2015 | AM870PAAY43KA |
| A10 Pro-8700B | 4 | 1.8 GHz | 3.2 GHz | 2× 1 MB | 18× | | R6 | 384:24:8 | 800 MHz | — | DDR3-2133 | 12-35W | FP4 | June 2015 | AM870BAAY43KA |
| FX-8800P | 4 | 2.1 GHz | 3.4 GHz | 2× 1 MB | 21× | | R7 | 512:32:8 | 800 MHz | — | DDR3-2133 | 12-35W | FP4 | June 2015 | FM880PAAY43KA |
| A12 Pro-8800B | 4 | 2.1 GHz | 3.4 GHz | 2× 1 MB | 21× | | R7 | 512:32:8 | 800 MHz | — | DDR3-2133 | 12-35W | FP4 | June 2015 | FM880BAAY43KA |

## Bristol Ridge (2016)

| Model number | CPU | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | GPU | Memory support | TDP | Socket | Released | Part number |
| Model number | Cores | Frequency | Turbo | L2 Cache | Multi | V$_{core}$ | Model | Config | Frequency | Turbo | Memory support | TDP | Socket | Released | Part number |
| standard power and low power (configurable TDP) ||||||||||||||||
| A10-9600P | 4 | 2.4 GHz | 3.3 GHz | 2× 1 MB | | | R5 | 384:24:8 | 720 MHz | — | DDR4-1866 | 12–15W | FP4 | June 2016 | AM960PADY44AB |
| A10-9600B PRO | 4 | 2.4 GHz | 3.3 GHz | 2× 1 MB | | | R5 | 384:24:8 | 720 MHz | — | DDR4-1866 | 12–15W | FP4 | October 2016 | AM960BADY44AB |
| A10-9630P | 4 | 2.6 GHz | 3.3 GHz | 2× 1 MB | | | R5 | 384:24:8 | 800 MHz | — | DDR4-2400 | 25–45W | FP4 | June 2016 | AM963PAEY44AB |
| A10-9630B PRO | 4 | 2.6 GHz | 3.3 GHz | 2× 1 MB | | | R5 | 384:24:8 | 800 MHz | — | DDR4-2400 | 25–45W | FP4 | October 2016 | AM963BAEY44AB |
| A12-9700P | 4 | 2.5 GHz | 3.4 GHz | 2× 1 MB | | | R7 | 384:24:8 | 758 MHz | — | DDR4-1866 | 12–15W | FP4 | June 2016 | AM970PADY44AB |
| A12-9700B PRO | 4 | 2.5 GHz | 3.4 GHz | 2× 1 MB | | | R7 | 384:24:8 | 758 MHz | — | DDR4-1866 | 12–15W | FP4 | October 2016 | AM970BADY44AB |
| A12-9730P | 4 | 2.8 GHz | 3.5 GHz | 2× 1 MB | | | R7 | 384:24:8 | 900 MHz | — | DDR4-2400 | 25–45W | FP4 | June 2016 | AM973PAEY44AB |
| A12-9730B PRO | 4 | 2.8 GHz | 3.5 GHz | 2× 1 MB | | | R7 | 384:24:8 | 900 MHz | — | DDR4-2400 | 25–45W | FP4 | October 2016 | AM973BAEY44AB |
| FX-9800P | 4 | 2.7 GHz | 3.6 GHz | 2× 1 MB | | | R7 | 512:32:8 | 758 MHz | — | DDR4-1866 | 12–15W | FP4 | June 2016 | FM980PADY44AB |
| A12-9800B PRO | 4 | 2.7 GHz | 3.6 GHz | 2× 1 MB | | | R7 | 512:32:8 | 758 MHz | — | DDR4-1866 | 12–15W | FP4 | October 2016 | AM980BADY44AB |
| FX-9830P | 4 | 3.0 GHz | 3.7 GHz | 2× 1 MB | | | R7 | 512:32:8 | 900 MHz | — | DDR4-2400 | 25–45W | FP4 | June 2016 | FM983PAEY44AB |
| A12-9830B PRO | 4 | 3.0 GHz | 3.7 GHz | 2× 1 MB | | | R7 | 512:32:8 | 900 MHz | — | DDR4-2400 | 25–45W | FP4 | October 2016 | AM983BAEY44AB |

## "Raven Ridge" (2017)

| Model | Release date | Fab | CPU | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | GPU | Socket | PCIe lanes | Memory support | TDP |
| Model | Release date | Fab | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | Cache | Cache | Cache | Model | Config | Clock (MHz) | Processing power (GFLOPS) | Socket | PCIe lanes | Memory support | TDP |
| Model | Release date | Fab | Cores (threads) | Base | Boost | L1 | L2 | L3 | Model | Config | Clock (MHz) | Processing power (GFLOPS) | Socket | PCIe lanes | Memory support | TDP |
| Athlon Pro 200U | 2019 | GloFo 14LP | 2 (4) | 2.3 | 3.2 | 64 KB inst. 32 KB data per core | 512 KB per core | 4 MB | Radeon Vega 3 | 192:12:4 3 CU | 1000 | 384 | FP5 | 12 (8+4) | DDR4-2400 dual-channel | 12–25 W |
| Athlon 300U | Jan 6, 2019 | GloFo 14LP | 2 (4) | 2.4 | 3.3 | 64 KB inst. 32 KB data per core | 512 KB per core | 4 MB | Radeon Vega 3 | 192:12:4 3 CU | 1000 | 384 | FP5 | 12 (8+4) | DDR4-2400 dual-channel | 12–25 W |
| Ryzen 3 2200U | Jan 8, 2018 | GloFo 14LP | 2 (4) | 2.5 | 3.4 | 64 KB inst. 32 KB data per core | 512 KB per core | 4 MB | Radeon Vega 3 | 192:12:4 3 CU | 1100 | 422.4 | FP5 | 12 (8+4) | DDR4-2400 dual-channel | 12–25 W |
| Ryzen 3 3200U | Jan 6, 2019 | GloFo 14LP | 2 (4) | 2.6 | 3.5 | 64 KB inst. 32 KB data per core | 512 KB per core | 4 MB | Radeon Vega 3 | 192:12:4 3 CU | 1200 | 460.8 | FP5 | 12 (8+4) | DDR4-2400 dual-channel | 12–25 W |
| Ryzen 3 2300U | Jan 8, 2018 | GloFo 14LP | 4 (4) | 2.0 | 3.4 | 64 KB inst. 32 KB data per core | 512 KB per core | 4 MB | Radeon Vega 6 | 384:24:8 6 CU | 1100 | 844.8 | FP5 | 12 (8+4) | DDR4-2400 dual-channel | 12–25 W |
| Ryzen 3 Pro 2300U | May 15, 2018 | GloFo 14LP | 4 (4) | 2.0 | 3.4 | 64 KB inst. 32 KB data per core | 512 KB per core | 4 MB | Radeon Vega 6 | 384:24:8 6 CU | 1100 | 844.8 | FP5 | 12 (8+4) | DDR4-2400 dual-channel | 12–25 W |
| Ryzen 5 2500U | Oct 26, 2017 | GloFo 14LP | 4 (8) | 2.0 | 3.6 | 64 KB inst. 32 KB data per core | 512 KB per core | 4 MB | Radeon Vega 8 | 512:32:16 8 CU | 1100 | 1126.4 | FP5 | 12 (8+4) | DDR4-2400 dual-channel | 12–25 W |
| Ryzen 5 Pro 2500U | May 15, 2018 | GloFo 14LP | 4 (8) | 2.0 | 3.6 | 64 KB inst. 32 KB data per core | 512 KB per core | 4 MB | Radeon Vega 8 | 512:32:16 8 CU | 1100 | 1126.4 | FP5 | 12 (8+4) | DDR4-2400 dual-channel | 12–25 W |
| Ryzen 5 2600H | Sep 10, 2018 | GloFo 14LP | 4 (8) | 3.2 | 3.6 | 64 KB inst. 32 KB data per core | 512 KB per core | 4 MB | Radeon Vega 8 | 512:32:16 8 CU | 1100 | 1126.4 | FP5 | 12 (8+4) | DDR4-3200 dual-channel | 35–54 W |
| Ryzen 7 2700U | Oct 26, 2017 | GloFo 14LP | 4 (8) | 2.2 | 3.8 | 64 KB inst. 32 KB data per core | 512 KB per core | 4 MB | Radeon RX Vega 10 | 640:40:16 10 CU | 1300 | 1664 | FP5 | 12 (8+4) | DDR4-2400 dual-channel | 12–25 W |
| Ryzen 7 Pro 2700U | May 15, 2018 | GloFo 14LP | 4 (8) | 2.2 | 3.8 | 64 KB inst. 32 KB data per core | 512 KB per core | 4 MB | Radeon Vega 10 | 640:40:16 10 CU | 1300 | 1664 | FP5 | 12 (8+4) | DDR4-2400 dual-channel | 12–25 W |
| Ryzen 7 2800H | Sep 10, 2018 | GloFo 14LP | 4 (8) | 3.3 | 3.8 | 64 KB inst. 32 KB data per core | 512 KB per core | 4 MB | Radeon RX Vega 11 | 704:44:16 11 CU | 1300 | 1830.4 | FP5 | 12 (8+4) | DDR4-3200 dual-channel | 35–54 W |
* v
* t
* e
* ↑ Unified shaders : Texture mapping units : Render output units and Compute units (CU)
* ↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

## "Picasso" (2019)

Common features of Ryzen 3000 notebook APUs:
* Socket: FP5.
* All the CPUs support DDR4-2400 in dual-channel mode.
* L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
* L2 cache: 512 KB per core.
* All the CPUs support 16 PCIe 3.0 lanes.
* Includes integrated GCN 5th generation GPU.
* Fabrication process: GlobalFoundries 12LP (14LP+).
| Branding and Model | Branding and Model | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | GPU | TDP | Release date |
| Branding and Model | Branding and Model | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | Core config | Model | Clock (GHz) | Config | Processing power (GFLOPS) | TDP | Release date |
| Branding and Model | Branding and Model | Cores (threads) | Base | Boost | L3 cache (total) | Core config | Model | Clock (GHz) | Config | Processing power (GFLOPS) | TDP | Release date |
| Ryzen 7 | 3780U | 4 (8) | 2.3 | 4.0 | 4 MB | 1 × 4 | RX Vega 11 | 1.4 | 704:44:16 11 CU | 1971.2 | 15 W | Oct 2019 |
| Ryzen 7 | 3750H | 4 (8) | 2.3 | 4.0 | 4 MB | 1 × 4 | RX Vega 10 | 1.4 | 640:40:16 10 CU | 1792.0 | 35 W | Jan 6, 2019 |
| Ryzen 7 | 3700C | 4 (8) | 2.3 | 4.0 | 4 MB | 1 × 4 | RX Vega 10 | 1.4 | 640:40:16 10 CU | 1792.0 | 15 W | Sep 22, 2020 |
| Ryzen 7 | 3700U | 4 (8) | 2.3 | 4.0 | 4 MB | 1 × 4 | RX Vega 10 | 1.4 | 640:40:16 10 CU | 1792.0 | 15 W | Jan 6, 2019 |
| Ryzen 5 | 3580U | 4 (8) | 2.1 | 3.7 | 4 MB | 1 × 4 | Vega 9 | 1.3 | 576:36:16 9 CU | 1497.6 | 15 W | Oct 2019 |
| Ryzen 5 | 3550H | 4 (8) | 2.1 | 3.7 | 4 MB | 1 × 4 | Vega 8 | 1.2 | 512:32:16 8 CU | 1228.8 | 35 W | Jan 6, 2019 |
| Ryzen 5 | 3500C | 4 (8) | 2.1 | 3.7 | 4 MB | 1 × 4 | Vega 8 | 1.2 | 512:32:16 8 CU | 1228.8 | 15 W | Sep 22, 2020 |
| Ryzen 5 | 3500U | 4 (8) | 2.1 | 3.7 | 4 MB | 1 × 4 | Vega 8 | 1.2 | 512:32:16 8 CU | 1228.8 | 15 W | Jan 6, 2019 |
| Ryzen 5 | 3450U | 4 (8) | 2.1 | 3.5 | 4 MB | 1 × 4 | Vega 8 | 1.2 | 512:32:16 8 CU | 1228.8 | 15 W | Jun 2020 |
| Ryzen 3 | 3350U | 4 (4) | 2.1 | 3.5 | 4 MB | 1 × 4 | Vega 6 | 1.2 | 384:24:8 6 CU | 921.6 | 15 W | Jan 6, 2019 |
| Ryzen 3 | 3300U | 4 (4) | 2.1 | 3.5 | 4 MB | 1 × 4 | Vega 6 | 1.2 | 384:24:8 6 CU | 921.6 | 15 W | Jan 6, 2019 |
* v
* t
* e
* ↑ Core Complexes (CCX) × cores per CCX
* ↑ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
* ↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
* 1 2 3 Model also available as PRO version, released April 8, 2019.
* "AMD Ryzen 3 PRO 3300U Mobile Processor with Radeon Vega 6 Graphics".
* "AMD Ryzen 5 PRO 3500U Mobile Processor with Radeon Vega 8 Graphics".
* "AMD Ryzen 7 PRO 3700U Mobile Processor with Radeon Vega 10 Graphics".

## "Renoir" (2020)
### U

| Branding and model | Branding and model | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | GPU | TDP | Release date |
| Branding and model | Branding and model | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | Core config | Model | Clock (MHz) | Config | Processing power (GFLOPS) | TDP | Release date |
| Branding and model | Branding and model | Cores (threads) | Base | Boost | L3 cache (total) | Core config | Model | Clock (MHz) | Config | Processing power (GFLOPS) | TDP | Release date |
| Ryzen 7 | 4980U | 8 (16) | 2.0 | 4.4 | 8 MB | 2 × 4 | Radeon Graphics | 1950 | 512:32:8 8 CU | 1996.8 | 15 W | Apr 13, 2021 |
| Ryzen 7 | 4800U | 8 (16) | 1.8 | 4.2 | 8 MB | 2 × 4 | Radeon Graphics | 1750 | 512:32:8 8 CU | 1792 | 15 W | Mar 16, 2020 |
| Ryzen 7 | Pro 4750U | 8 (16) | 1.7 | 4.1 | 8 MB | 2 × 4 | Radeon Graphics | 1600 | 448:28:8 7 CU | 1433.6 | 15 W | May 7, 2020 |
| Ryzen 7 | 4700U | 8 (8) | 2.0 | 4.1 | 8 MB | 2 × 4 | Radeon Graphics | 1600 | 448:28:8 7 CU | 1433.6 | 15 W | Mar 16, 2020 |
| Ryzen 5 | 4680U | 6 (12) | 2.1 | 4.0 | 8 MB | 2 × 3 | Radeon Graphics | 1500 | 448:28:8 7 CU | 1344 | 15 W | Apr 13, 2021 |
| Ryzen 5 | Pro 4650U | 6 (12) | 2.1 | 4.0 | 8 MB | 2 × 3 | Radeon Graphics | 1500 | 384:24:8 6 CU | 1152 | 15 W | May 7, 2020 |
| Ryzen 5 | 4600U | 6 (12) | 2.1 | 4.0 | 8 MB | 2 × 3 | Radeon Graphics | 1500 | 384:24:8 6 CU | 1152 | 15 W | Mar 16, 2020 |
| Ryzen 5 | 4500U | 6 (6) | 2.3 | 4.0 | 8 MB | 2 × 3 | Radeon Graphics | 1500 | 384:24:8 6 CU | 1152 | 15 W | Mar 16, 2020 |
| Ryzen 3 | Pro 4450U | 4 (8) | 2.5 | 3.7 | 4 MB | 1 × 4 | Radeon Graphics | 1400 | 320:20:8 5 CU | 896 | 15 W | May 7, 2020 |
| Ryzen 3 | 4300U | 4 (4) | 2.7 | 3.7 | 4 MB | 1 × 4 | Radeon Graphics | 1400 | 320:20:8 5 CU | 896 | 15 W | Mar 16, 2020 |
* v
* t
* e
* ↑ All of the iGPUs are branded as AMD Radeon Graphics.
* ↑ Core Complexes (CCX) × cores per CCX
* ↑ Unified shaders : texture mapping units : render output units and compute units (CU)
* ↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

### H

| Branding and model | Branding and model | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | GPU | TDP | Release date |
| Branding and model | Branding and model | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | Core config | Model | Clock (MHz) | Config | Processing power (GFLOPS) | TDP | Release date |
| Branding and model | Branding and model | Cores (threads) | Base | Boost | L3 cache (total) | Core config | Model | Clock (MHz) | Config | Processing power (GFLOPS) | TDP | Release date |
| Ryzen 9 | 4900H | 8 (16) | 3.3 | 4.4 | 8 MB | 2 × 4 | Radeon Graphics | 1750 | 512:32:8 8 CU | 1792 | 45 W | Mar 16, 2020 |
| Ryzen 9 | 4900HS | 8 (16) | 3.0 | 4.3 | 8 MB | 2 × 4 | Radeon Graphics | 1750 | 512:32:8 8 CU | 1792 | 35 W | Mar 16, 2020 |
| Ryzen 7 | 4800H | 8 (16) | 2.9 | 4.2 | 8 MB | 2 × 4 | Radeon Graphics | 1600 | 448:28:8 7 CU | 1433.6 | 45 W | Mar 16, 2020 |
| Ryzen 7 | 4800HS | 8 (16) | 2.9 | 4.2 | 8 MB | 2 × 4 | Radeon Graphics | 1600 | 448:28:8 7 CU | 1433.6 | 45 W | Mar 16, 2020 |
| Ryzen 5 | 4600H | 6 (12) | 3.0 | 4.0 | 8 MB | 2 × 3 | Radeon Graphics | 1500 | 384:24:8 6 CU | 1152 | 45 W | Mar 16, 2020 |
| Ryzen 5 | 4600HS | 6 (12) | 3.0 | 4.0 | 8 MB | 2 × 3 | Radeon Graphics | 1500 | 384:24:8 6 CU | 1152 | 35 W | Mar 16, 2020 |
* v
* t
* e
* ↑ All of the iGPUs are branded as AMD Radeon Graphics.
* ↑ Core Complexes (CCX) × cores per CCX
* ↑ Unified shaders : texture mapping units : render output units and compute units (CU)
* ↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

## "Lucienne" (2021)

Common features of Ryzen 5000 notebook APUs:
* Socket: FP6.
* All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode.
* L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
* L2 cache: 512 KB per core.
* All the CPUs support 16 PCIe 3.0 lanes.
* Includes integrated GCN 5th generation GPU.
* Fabrication process: TSMC 7FF.
| Branding and Model | Branding and Model | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | GPU | TDP | Release date |
| Branding and Model | Branding and Model | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | Core config | Model | Clock (GHz) | Config | Processing power (GFLOPS) | TDP | Release date |
| Branding and Model | Branding and Model | Cores (threads) | Base | Boost | L3 cache (total) | Core config | Model | Clock (GHz) | Config | Processing power (GFLOPS) | TDP | Release date |
| Ryzen 7 | 5700U | 8 (16) | 1.8 | 4.3 | 8 MB | 2 × 4 | Radeon Graphics | 1.9 | 512:32:8 8 CU | 1945.6 | 10–25 W | Jan 12, 2021 |
| Ryzen 5 | 5500U | 6 (12) | 2.1 | 4.0 | 8 MB | 2 × 3 | Radeon Graphics | 1.8 | 448:28:8 7 CU | 1612.8 | 10–25 W | Jan 12, 2021 |
| Ryzen 3 | 5300U | 4 (8) | 2.6 | 3.8 | 4 MB | 1 × 4 | Radeon Graphics | 1.5 | 384:24:8 6 CU | 1152 | 10–25 W | Jan 12, 2021 |
* v
* t
* e
* ↑ Core Complexes (CCX) × cores per CCX
* ↑ Unified shaders : texture mapping units : render output units and compute units (CU)
* ↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
* ↑ All of the iGPUs are branded as AMD Radeon Graphics.

## "Cezanne" (2021)
### U

| Branding and model | Branding and model | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | GPU | TDP | Release date |
| Branding and model | Branding and model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | Core config | Model | Clock (GHz) | Config | Processing power (GFLOPS) | TDP | Release date |
| Branding and model | Branding and model | Cores (Threads) | Base | Boost | L3 cache (total) | Core config | Model | Clock (GHz) | Config | Processing power (GFLOPS) | TDP | Release date |
| Ryzen 7 | 5800U | 8 (16) | 1.9 | 4.4 | 16 MB | 1 × 8 | Radeon Graphics | 2.0 | 512:32:8 8 CUs | 2048 | 10–25 W | Jan 12, 2021 |
| Ryzen 5 | 5600U | 6 (12) | 2.3 | 4.2 | 16 MB | 1 × 6 | Radeon Graphics | 1.8 | 448:28:8 7 CUs | 1612.8 | 10–25 W | Jan 12, 2021 |
| Ryzen 5 | 5560U | 6 (12) | 2.3 | 4.0 | 8 MB | 1 × 6 | Radeon Graphics | 1.6 | 384:24:8 6 CUs | 1228.8 | 10–25 W | Jan 12, 2021 |
| Ryzen 3 | 5400U | 4 (8) | 2.7 | 4.1 | 8 MB | 1 × 4 | Radeon Graphics | 1.6 | 384:24:8 6 CUs | 1228.8 | 10–25 W | Jan 12, 2021 |
* v
* t
* e
* ↑ All of the iGPUs are branded as AMD Radeon Graphics.
* ↑ Core Complexes (CCX) × cores per CCX
* ↑ Unified shaders : texture mapping units : render output units and compute units (CU)
* ↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
* 1 2 3 Model also available as Pro version as 5450U, 5650U, 5850U, released on March 16, 2021.

### H

| Branding and model | Branding and model | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | GPU | TDP | Release date |
| Branding and model | Branding and model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | Core config | Model | Clock (GHz) | Config | Processing power (GFLOPS) | TDP | Release date |
| Branding and model | Branding and model | Cores (Threads) | Base | Boost | L3 cache (total) | Core config | Model | Clock (GHz) | Config | Processing power (GFLOPS) | TDP | Release date |
| Ryzen 9 | 5980HX | 8 (16) | 3.3 | 4.8 | 16 MB | 1 × 8 | Radeon Graphics | 2.1 | 512:32:8 8 CUs | 2150.4 | 35–54 W | Jan 12, 2021 |
| Ryzen 9 | 5980HS | 8 (16) | 3.0 | 4.8 | 16 MB | 1 × 8 | Radeon Graphics | 2.1 | 512:32:8 8 CUs | 2150.4 | 35 W | Jan 12, 2021 |
| Ryzen 9 | 5900HX | 8 (16) | 3.3 | 4.6 | 16 MB | 1 × 8 | Radeon Graphics | 2.1 | 512:32:8 8 CUs | 2150.4 | 35–54 W | Jan 12, 2021 |
| Ryzen 9 | 5900HS | 8 (16) | 3.0 | 4.6 | 16 MB | 1 × 8 | Radeon Graphics | 2.1 | 512:32:8 8 CUs | 2150.4 | 35 W | Jan 12, 2021 |
| Ryzen 7 | 5800H | 8 (16) | 3.2 | 4.4 | 16 MB | 1 × 8 | Radeon Graphics | 2.0 | 512:32:8 8 CUs | 2048 | 35–54 W | Jan 12, 2021 |
| Ryzen 7 | 5800HS | 8 (16) | 2.8 | 4.4 | 16 MB | 1 × 8 | Radeon Graphics | 2.0 | 512:32:8 8 CUs | 2048 | 35 W | Jan 12, 2021 |
| Ryzen 5 | 5600H | 6 (12) | 3.3 | 4.2 | 16 MB | 1 × 6 | Radeon Graphics | 1.8 | 448:28:8 7 CUs | 1612.8 | 35–54 W | Jan 12, 2021 |
| Ryzen 5 | 5600HS | 6 (12) | 3.0 | 4.2 | 16 MB | 1 × 6 | Radeon Graphics | 1.8 | 448:28:8 7 CUs | 1612.8 | 35 W | Jan 12, 2021 |
* v
* t
* e
* ↑ All of the iGPUs are branded as AMD Radeon Graphics.
* ↑ Core Complexes (CCX) × cores per CCX
* ↑ Unified shaders : texture mapping units : render output units and compute units (CU)
* ↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

## "Barceló" (2022)

| Branding and model | Branding and model | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | GPU | TDP | Release date |
| Branding and model | Branding and model | Cores (Threads) | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | Core config | Model | Clock (GHz) | Config | Processing power (GFLOPS) | TDP | Release date |
| Branding and model | Branding and model | Cores (Threads) | Base | Boost | L3 cache (total) | Core config | Model | Clock (GHz) | Config | Processing power (GFLOPS) | TDP | Release date |
| Ryzen 7 | 5825U | 8 (16) | 2.0 | 4.5 | 16 MB | 1 × 8 | Radeon Graphics | 2.0 | 512:32:8 8 CUs | 2048 | 15 W | Jan 4, 2022 |
| Ryzen 5 | 5625U | 6 (12) | 2.3 | 4.3 | 16 MB | 1 × 6 | Radeon Graphics | 1.8 | 448:28:8 7 CUs | 1612.8 | 15 W | Jan 4, 2022 |
| Ryzen 3 | 5125C | 2 (4) | 3.0 | — | 8 MB | 1 × 2 | Radeon Graphics | ? | 192:12:8 3 CU | ? | 15 W | May 5, 2022 |
* v
* t
* e
* ↑ All of the iGPUs are branded as AMD Radeon Graphics.
* ↑ Core Complexes (CCX) × cores per CCX
* ↑ Unified shaders : texture mapping units : render output units and compute units (CU)
* ↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
* 1 2 Model also available as Pro version as 5475U, 5675U, 5875U, released on April 19, 2022.
* 1 2 Model also available as Chromebook optimized version as 5425C, 5625C, 5825C, released on May 5, 2022.

## "Rembrandt" (2022)

Common features of Ryzen 6000 notebook APUs:
* Socket: FP7, FP7r2.
* All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
* L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
* L2 cache: 512 KB per core.
* All the CPUs support 16 PCIe 4.0 lanes.
* Includes integrated RDNA 2 GPU.
* Fabrication process: TSMC N6 FinFET.
| Branding and model | Branding and model | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | GPU | TDP | Release date |
| Branding and model | Branding and model | Cores (threads) | Clock (GHz) | Clock (GHz) | L3 cache (total) | Core config | Model | Clock (GHz) | Config | Processing power (GFLOPS) | TDP | Release date |
| Branding and model | Branding and model | Cores (threads) | Base | Boost | L3 cache (total) | Core config | Model | Clock (GHz) | Config | Processing power (GFLOPS) | TDP | Release date |
| Ryzen 9 | 6980HX | 8 (16) | 3.3 | 5.0 | 16 MB | 1 × 8 | 680M | 2.4 | 768:48:8 12 CUs | 3686.4 | 45 W | Jan 4, 2022 |
| Ryzen 9 | 6980HS | 8 (16) | 3.3 | 5.0 | 16 MB | 1 × 8 | 680M | 2.4 | 768:48:8 12 CUs | 3686.4 | 35 W | Jan 4, 2022 |
| Ryzen 9 | 6900HX | 8 (16) | 3.3 | 4.9 | 16 MB | 1 × 8 | 680M | 2.4 | 768:48:8 12 CUs | 3686.4 | 45 W | Jan 4, 2022 |
| Ryzen 9 | 6900HS | 8 (16) | 3.3 | 4.9 | 16 MB | 1 × 8 | 680M | 2.4 | 768:48:8 12 CUs | 3686.4 | 35 W | Jan 4, 2022 |
| Ryzen 7 | 6800H | 8 (16) | 3.2 | 4.7 | 16 MB | 1 × 8 | 680M | 2.2 | 768:48:8 12 CUs | 3379.2 | 45 W | Jan 4, 2022 |
| Ryzen 7 | 6800HS | 8 (16) | 3.2 | 4.7 | 16 MB | 1 × 8 | 680M | 2.2 | 768:48:8 12 CUs | 3379.2 | 35 W | Jan 4, 2022 |
| Ryzen 7 | 6800U | 8 (16) | 2.7 | 4.7 | 16 MB | 1 × 8 | 680M | 2.2 | 768:48:8 12 CUs | 3379.2 | 15–28 W | Jan 4, 2022 |
| Ryzen 5 | 6600H | 6 (12) | 3.3 | 4.5 | 16 MB | 1 × 6 | 660M | 1.9 | 384:24:8 6 CUs | 1459.2 | 45 W | Jan 4, 2022 |
| Ryzen 5 | 6600HS | 6 (12) | 3.3 | 4.5 | 16 MB | 1 × 6 | 660M | 1.9 | 384:24:8 6 CUs | 1459.2 | 35 W | Jan 4, 2022 |
| Ryzen 5 | 6600U | 6 (12) | 2.9 | 4.5 | 16 MB | 1 × 6 | 660M | 1.9 | 384:24:8 6 CUs | 1459.2 | 15–28 W | Jan 4, 2022 |
* v
* t
* e
* ↑ Core Complexes (CCX) × cores per CCX
* ↑ Unified shaders : texture mapping units : render output units and compute units (CU)
* ↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
* 1 2 3 4 5 6 7 8 Model also available as PRO version (6650U, 6650H, 6650HS, 6850U, 6850H, 6850HS, 6950H, 6950HS), released on April 19, 2022.
* "AMD Ryzen 5 PRO 6650U". AMD.
* "AMD Ryzen 5 PRO 6650H". AMD.
* "AMD Ryzen 5 PRO 6650HS". AMD.
* "AMD Ryzen 7 PRO 6850U". AMD.
* "AMD Ryzen 7 PRO 6850H". AMD.
* "AMD Ryzen 7 PRO 6850HS". AMD.
* "AMD Ryzen 9 PRO 6950H". AMD.
* "AMD Ryzen 9 PRO 6950HS". AMD.

## Mendocino (7020 series, Zen2/RDNA2 based)

Common features of Ryzen 7020 notebook APUs:
* Socket: FT6
* All the CPUs support LPDDR5-5500 in dual-channel mode.
* L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
* L2 cache: 512 KB per core.
* All the CPUs support 4 PCIe 3.0 lanes.
* Includes integrated RDNA 2 GPU.
* Fabrication process: TSMC N6 FinFET.
| Branding and Model | Branding and Model | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | TDP | Release date |
| Branding and Model | Branding and Model | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | Core config | Model | Clock (GHz) | Processing power (GFLOPS) | TDP | Release date |
| Branding and Model | Branding and Model | Cores (threads) | Base | Boost | L3 cache (total) | Core config | Model | Clock (GHz) | Processing power (GFLOPS) | TDP | Release date |
| Ryzen 5 | 7520U | 4 (8) | 2.8 | 4.3 | 4 MB | 1 × 4 | 610M 2 CU | 1.9 | 486.4 | 15 W | September 20, 2022 |
| Ryzen 3 | 7320U | 4 (8) | 2.4 | 4.1 | 4 MB | 1 × 4 | 610M 2 CU | 1.9 | 486.4 | 15 W | September 20, 2022 |
* v
* t
* e
* ↑ Core Complexes (CCX) × cores per CCX
* ↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
* 1 2 Model also available as Chromebook optimized version as 7520C and 7320C released on May 23, 2023
* "AMD Ryzen 5 7520C". AMD.
* "AMD Ryzen 3 7320C". AMD.

## Barcelo-R (7030 series, Zen3/GCN5 based)

Common features of Ryzen 7030 notebook APUs:
* Socket: FP6.
* All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode.
* L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
* L2 cache: 512 KB per core.
* All the CPUs support 16 PCIe 3.0 lanes.
* Includes integrated GCN 5th generation GPU.
* Fabrication process: TSMC N7 FinFET.
| Branding and Model | Branding and Model | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | TDP | Release date |
| Branding and Model | Branding and Model | Cores (threads) | Clock rate (GHz) | Clock rate (GHz) | L3 cache (total) | Core config | Model | Clock (GHz) | Processing power (GFLOPS) | TDP | Release date |
| Branding and Model | Branding and Model | Cores (threads) | Base | Boost | L3 cache (total) | Core config | Model | Clock (GHz) | Processing power (GFLOPS) | TDP | Release date |
| Ryzen 7 | (PRO) 7730U | 8 (16) | 2.0 | 4.5 | 16 MB | 1 × 8 | Vega 8 CU | 2.0 | 2048 | 15 W | January 4, 2023 |
| Ryzen 5 | (PRO) 7530U | 6 (12) | 2.0 | 4.5 | 16 MB | 1 × 6 | Vega 7 CU | 2.0 | 1792 | 15 W | January 4, 2023 |
| Ryzen 3 | (PRO) 7330U | 4 (8) | 2.3 | 4.3 | 8 MB | 1 × 4 | Vega 6 CU | 1.8 | 1382.4 | 15 W | January 4, 2023 |
* v
* t
* e
* ↑ Core Complexes (CCX) × cores per CCX
* ↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

## Rembrandt-R (7035 series, Zen3+/RDNA2 based)

Common features of Ryzen 7035 notebook APUs:
* Socket: FP7, FP7r2.
* All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
* L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
* L2 cache: 512 KB per core.
* All the CPUs support 16 PCIe 4.0 lanes.
* Includes integrated RDNA 2 GPU.
* Fabrication process: TSMC N6 FinFET.
| Branding and model | Branding and model | CPU | CPU | CPU | CPU | CPU | GPU | GPU | GPU | TDP | Release date |
| Branding and model | Branding and model | Cores (threads) | Clock (GHz) | Clock (GHz) | L3 cache (total) | Core config | Model | Clock (GHz) | Processing power (GFLOPS) | TDP | Release date |
| Branding and model | Branding and model | Cores (threads) | Base | Boost | L3 cache (total) | Core config | Model | Clock (GHz) | Processing power (GFLOPS) | TDP | Release date |
| Ryzen 7 | 7735HS | 8 (16) | 3.2 | 4.75 | 16 MB | 1 × 8 | 680M 12 CU | 2.2 | 3379.2 | 35–54 W | April 30, 2023 |
| Ryzen 7 | 7735H | 8 (16) | 3.2 | 4.75 | 16 MB | 1 × 8 | 680M 12 CU | 2.2 | 3379.2 | 35–54 W | April 30, 2023 |
| Ryzen 7 | 7736U | 8 (16) | 2.7 | 4.7 | 16 MB | 1 × 8 | 680M 12 CU | 2.2 | 3379.2 | 15–28 W | January 4, 2023 |
| Ryzen 7 | 7735U | 8 (16) | 2.7 | 4.75 | 16 MB | 1 × 8 | 680M 12 CU | 2.2 | 3379.2 | 15–30 W | January 4, 2023 |
| Ryzen 7 | 7435HS | 8 (16) | 3.1 | 4.5 | 16 MB | 1 × 8 | — | — | — | 35–54 W | 2024 |
| Ryzen 7 | 7435H | 8 (16) | 3.1 | 4.5 | 16 MB | 1 × 8 | — | — | — | 35–54 W | 2024 |
| Ryzen 5 | 7535HS | 6 (12) | 3.3 | 4.55 | 16 MB | 1 × 6 | 660M 6 CU | 1.9 | 1459.2 | 35–54 W | April 30, 2023 |
| Ryzen 5 | 7535H | 6 (12) | 3.3 | 4.55 | 16 MB | 1 × 6 | 660M 6 CU | 1.9 | 1459.2 | 35–54 W | April 30, 2023 |
| Ryzen 5 | 7535U | 6 (12) | 2.9 | 4.55 | 16 MB | 1 × 6 | 660M 6 CU | 1.9 | 1459.2 | 15–30 W | January 4, 2023 |
| Ryzen 5 | 7235HS | 4 (8) | 3.2 | 4.2 | 8 MB | 1 × 4 | — | — | — | 35–53 W | 2024 |
| Ryzen 5 | 7235H | 4 (8) | 3.2 | 4.2 | 8 MB | 1 × 4 | — | — | — | 35–53 W | 2024 |
| Ryzen 3 | 7335U | 4 (8) | 3.0 | 4.3 | 8 MB | 1 × 4 | 660M 4 CU | 1.8 | 921.6 | 15–30 W | January 4, 2023 |
* v
* t
* e
* ↑ Core Complexes (CCX) × cores per CCX
* ↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

## Phoenix (7040 series, Zen4/RDNA3 based)

Common features of Ryzen 7040 notebook APUs:
* Socket: FP7, FP7r2, FP8.
* All the CPUs support DDR5-5600 or LPDDR5X-7500 in dual-channel mode.
* L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
* L2 cache: 1 MB per core.
* PCIe 4.0 support.
* Includes integrated RDNA 3 GPU.
* Includes XDNA AI Engine (Ryzen AI).
* Fabrication process: TSMC N4 FinFET.
| Branding and model | Branding and model | CPU | CPU | CPU | CPU | CPU | CPU | CPU | GPU | GPU | NPU | PCIe (lanes) | TDP | Release date |
| Branding and model | Branding and model | Cores (threads) | Cores (threads) | Cores (threads) | Clock (GHz) | Clock (GHz) | L3 cache (total) | Core config | Model | Clock (GHz) | NPU | PCIe (lanes) | TDP | Release date |
| Branding and model | Branding and model | Total | Zen 4 | Zen 4c | Base | Boost | L3 cache (total) | Core config | Model | Clock (GHz) | NPU | PCIe (lanes) | TDP | Release date |
| Ryzen 9 | (PRO) 7940HS | 8 (16) | 8 (16) | — | 4.0 | 5.2 | 16 MB | 1 × 8 | 780M 12 CU | 2.8 | Ryzen AI Up to 10 TOPS | 20 | 35–54 W | April 30, 2023 |
| Ryzen 9 | 7940H | 8 (16) | 8 (16) | — | 4.0 | 5.2 | 16 MB | 1 × 8 | 780M 12 CU | 2.8 | Ryzen AI Up to 10 TOPS | 20 | 35–54 W | April 30, 2023 |
| Ryzen 7 | (PRO) 7840HS | 8 (16) | 8 (16) | — | 3.8 | 5.1 | 16 MB | 1 × 8 | 780M 12 CU | 2.7 | Ryzen AI Up to 10 TOPS | 20 | 35–54 W | April 30, 2023 |
| Ryzen 7 | 7840H | 8 (16) | 8 (16) | — | 3.8 | 5.1 | 16 MB | 1 × 8 | 780M 12 CU | 2.7 | Ryzen AI Up to 10 TOPS | 20 | 35–54 W | April 30, 2023 |
| Ryzen 7 | (PRO) 7840U | 8 (16) | 8 (16) | — | 3.3 | 5.1 | 16 MB | 1 × 8 | 780M 12 CU | 2.7 | Ryzen AI Up to 10 TOPS | 20 | 15–30 W | May 3, 2023 |
| Ryzen 5 | (PRO) 7640HS | 6 (12) | 6 (12) | — | 4.3 | 5.0 | 16 MB | 1 × 6 | 760M 8 CU | 2.6 | Ryzen AI Up to 10 TOPS | 20 | 35–54 W | April 30, 2023 |
| Ryzen 5 | 7640H | 6 (12) | 6 (12) | — | 4.3 | 5.0 | 16 MB | 1 × 6 | 760M 8 CU | 2.6 | Ryzen AI Up to 10 TOPS | 20 | 35–54 W | April 30, 2023 |
| Ryzen 5 | (PRO) 7640U | 6 (12) | 6 (12) | — | 3.5 | 4.9 | 16 MB | 1 × 6 | 760M 8 CU | 2.6 | Ryzen AI Up to 10 TOPS | 20 | 15–30 W | May 3, 2023 |
| Ryzen 5 | (PRO) 7545U | 6 (12) | 2 (4) | 4 (8) | 3.7 / 3.0 | 4.9 / 3.5 | 16 MB | 2 + 4 | 740M 4 CU | 2.8 | No | 14 | 15–30 W | November 2, 2023 |
| Ryzen 5 | (PRO) 7540U | 6 (12) | 6 (12) | — | 3.2 | 4.9 | 16 MB | 1 × 6 | 740M 4 CU | 2.5 | No | 14 | 15–30 W | May 3, 2023 |
| Ryzen 3 | 7440U | 4 (8) | 1 (2) | 3 (6) | 3.6 / 2.8 | 4.7 / 3.3 | 8 MB | 1 + 3 | 740M 4 CU | 2.5 | No | 14 | 15–30 W | May 3, 2023 |
* v
* t
* e
* ↑ Core Complexes (CCX) × cores per CCX or Zen 4 + Zen 4c cores
* 1 2 3 4 5 PRO versions launched on 13 June 2023.
* 1 2 3 China-only version of the HS SKU that lacks support for AMD EXPO and FreeSync technologies.
* 1 2 Zen 4 cores' base frequency / Zen 4c cores' base frequency
* 1 2 Zen 4 cores' boost frequency / Zen 4c cores' boost frequency

## Dragon Range (7045 series, Zen4/RDNA2 based)

Common features of Ryzen 7045 notebook CPUs:
* Socket: FL1.
* All the CPUs support DDR5-5200 in dual-channel mode.
* L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
* L2 cache: 1 MB per core.
* All the CPUs support 28 PCIe 5.0 lanes.
* Includes integrated RDNA 2 GPU on the I/O die with 2 CUs and clock speeds of 400 MHz (base), 2.2 GHz (boost).
* Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O and graphics die).
| Branding and model | Branding and model | Cores (threads) | Clock (GHz) | Clock (GHz) | L3 cache (total) | Chiplets | Core config | TDP | Release date |
| Branding and model | Branding and model | Cores (threads) | Base | Boost | L3 cache (total) | Chiplets | Core config | TDP | Release date |
| Ryzen 9 | 7945HX3D | 16 (32) | 2.3 | 5.4 | 128 MB | 2 × CCD 1 × I/OD | 2 × 8 | 55–75 W | July 27, 2023 |
| Ryzen 9 | 7945HX | 16 (32) | 2.5 | 5.4 | 64 MB | 2 × CCD 1 × I/OD | 2 × 8 | 55–75 W | February 28, 2023 |
| Ryzen 9 | 7940HX | 16 (32) | 2.4 | 5.2 | 64 MB | 2 × CCD 1 × I/OD | 2 × 8 | 55–75 W | February 28, 2023 |
| Ryzen 9 | 7845HX | 12 (24) | 3.0 | 5.2 | 64 MB | 2 × CCD 1 × I/OD | 2 × 6 | 45–75 W | February 28, 2023 |
| Ryzen 7 | 7745HX | 8 (16) | 3.6 | 5.1 | 32 MB | 1 × CCD 1 × I/OD | 1 × 8 | 45–75 W | February 28, 2023 |
| Ryzen 5 | 7645HX | 6 (12) | 4.0 | 5.0 | 32 MB | 1 × CCD 1 × I/OD | 1 × 6 | 45–75 W | February 28, 2023 |
* v
* t
* e
* ↑ Core Complexes (CCX) × cores per CCX
* ↑ Self identifies as "AMD Radeon 610M". See RDNA 2 § Integrated graphics processors (iGPs).
* ↑ Only one of the two CCXes has additional 64 MB of 3D V-Cache. Only the CCX without 3D V-Cache will be able to reach the maximum boost clocks. The CCX with 3D V-Cache will clock lower.