# List of Intel Core M processors

Intel Core M is a family of ultra low-voltage microprocessors belonging to the Intel Core series and designed specifically for ultrathin notebooks, 2-in-1 detachables, and other mobile devices. The thermal design power (TDP) of all Core M microprocessors is 5 watts or lower. Intel Core M microprocessors are generally used in fanless devices due to their low TDP.

## Broadwell microarchitecture (5th generation)
### "Broadwell-Y" (SoC, dual-core, 14 nm)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, Turbo Boost, AES-NI, Smart Cache.
* All models except M-5Y10a and M-5Y70 support Configurable TDP.
* M-5Y70 and M-5Y71 also support Intel vPro.
* GPU and memory controller (up to 2 × DDR3-1600) are integrated onto the processor die.
* Peripherals include 12 lanes of PCI Express 2.0, in x4, x2, and x1 configurations.
* Package size: 30 mm × 16.5 mm
* Transistors: 1.3 billion
* Die size: 82 mm²
| Model | sSpec number | Cores | Clock rate | Turbo | L2 cache | L3 cache | GPU model | GPU frequency | TDP | Socket | I/O bus | Release date | Part number(s) | Release price (USD) |
| Core M-5Y10 | SR217 (E0) | 2 | 800 MHz | 2 GHz | 2 × 256 KB | 4 MB | HD Graphics 5300 | 100–800 MHz | 4.5 W | BGA-1234 | DMI 2.0 | September 2014 | FH8065801879602 | $281 |
| Core M-5Y10a | SR218 (E0) | 2 | 800 MHz | 2 GHz | 2 × 256 KB | 4 MB | HD Graphics 5300 | 100–800 MHz | 4.5 W | BGA-1234 | DMI 2.0 | September 2014 | FH8065801988602 | $281 |
| Core M-5Y10c | SR23C (F0) | 2 | 800 MHz | 2 GHz | 2 × 256 KB | 4 MB | HD Graphics 5300 | 300–800 MHz | 4.5 W | BGA-1234 | DMI 2.0 | October 2014 | FH8065802062002 | $281 |
| Core M-5Y31 | SR23G (F0) | 2 | 900 MHz | 2.4 GHz | 2 × 256 KB | 4 MB | HD Graphics 5300 | 300–850 MHz | 4.5 W | BGA-1234 | DMI 2.0 | October 2014 | FH8065802061902 | $281 |
| Core M-5Y51 | SR23L (F0) | 2 | 1.1 GHz | 2.6 GHz | 2 × 256 KB | 4 MB | HD Graphics 5300 | 300–900 MHz | 4.5 W | BGA-1234 | DMI 2.0 | October 2014 | FH8065802061802 | $281 |
| Core M-5Y70 | SR216 (E0) | 2 | 1.1 GHz | 2.6 GHz | 2 × 256 KB | 4 MB | HD Graphics 5300 | 100–850 MHz | 4.5 W | BGA-1234 | DMI 2.0 | September 2014 | FH8065801875604 | $281 |
| Core M-5Y71 | SR23Q (F0) | 2 | 1.2 GHz | 2.9 GHz | 2 × 256 KB | 4 MB | HD Graphics 5300 | 300–900 MHz | 4.5 W | BGA-1234 | DMI 2.0 | October 2014 | FH8065802061602 | $281 |

## Skylake microarchitecture (6th generation)
### "Skylake-Y" (SoC, dual-core, 14 nm)

* All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, Turbo Boost, AES-NI, Smart Cache, Configurable TDP.
* m5-6Y57 and m7-6Y75 also support Intel vPro, Intel TXT.
* GPU and memory controller (up to 2 × DDR3-1866) are integrated onto the processor die.
* Peripherals include 10 lanes of PCI Express 3.0, in x4, x2, and x1 configurations.
* Package size: 20 mm × 16.5 mm
* Transistors: TBD
* Die size: TBD
| Model | sSpec number | Cores (threads) | Clock rate | Turbo | L2 cache | L3 cache | GPU model | GPU frequency | TDP | Socket | I/O bus | Release date | Part number(s) | Release price (USD) |
| Core m3-6Y30 | SR2EN (D1) | 2 (4) | 900 MHz | 2.2 GHz | 2 × 256 KB | 4 MB | HD Graphics 515 | 300–850 MHz | 4.5 W | BGA 1515 | DMI 3.0 | September 2015 | HE8066201930521 | $281 |
| Core m5-6Y54 | SR2EM (D1) | 2 (4) | 1.1 GHz | 2.7 GHz | 2 × 256 KB | 4 MB | HD Graphics 515 | 300–900 MHz | 4.5 W | BGA 1515 | DMI 3.0 | September 2015 | HE8066201930524 | $281 |
| Core m5-6Y57 | SR2EG (D1) | 2 (4) | 1.1 GHz | 2.8 GHz | 2 × 256 KB | 4 MB | HD Graphics 515 | 300–900 MHz | 4.5 W | BGA 1515 | DMI 3.0 | September 2015 | HE8066201922876 | $281 |
| Core m7-6Y75 | SR2EH (D1) | 2 (4) | 1.2 GHz | 3.1 GHz | 2 × 256 KB | 4 MB | HD Graphics 515 | 300–1000 MHz | 4.5 W | BGA 1515 | DMI 3.0 | September 2015 | HE8066201922875 | $393 |

## Kaby Lake microarchitecture (7th/8th generation)
### "Kaby Lake-Y" (SoC, dual-core, 14 nm)

Core m5 and Core m7 models were rebranded as Core i5 and Core i7.
* All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, SGX, MPX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, Turbo Boost, AES-NI, Smart Cache, Configurable TDP.
* GPU and memory controller (up to 2 × LPDDR3-1866) are integrated onto the processor die.
* Peripherals include 10 lanes of PCI Express 3.0, in x4, x2, and x1 configurations.
* Package size: 20 mm × 16.5 mm
* Transistors: TBD
* Die size: TBD
| Model | sSpec number | Cores (threads) | Clock rate | Turbo | L2 cache | L3 cache | GPU model | GPU frequency | TDP | Socket | I/O bus | Release date | Part number(s) | Release price (USD) |
| Core m3-7Y30 | SR2ZY (H0) SR347 (H0) | 2 (4) | 1 GHz | 2.6 GHz | 2 × 256 KB | 4 MB | HD Graphics 615 | 300–900 MHz | 4.5 W | BGA 1515 | DMI 3.0 | September 2016 | HE8067702739824 | $281 |
| Core m3-7Y32 | SR346 (H0) | 2 (4) | 1.1 GHz | 3.0 GHz | 2 × 256 KB | 4 MB | HD Graphics 615 | 300–900 MHz | 4.5 W | BGA 1515 | DMI 3.0 | April 2017 | HE8067702739830 | $281 |

### "Amber Lake-Y" (dual-core, 14 nm)

| Model | sSpec number | Cores (threads) | Clock rate | Turbo | L2 cache | L3 cache | GPU model | GPU frequency | TDP | Socket | I/O bus | Release date | Part number(s) | Release price (USD) |
| Core m3-8100Y | SRD23 (H0) | 2 (4) | 1.1 GHz | 3.4 GHz | 2 × 256 KB | 4 MB | HD Graphics 615 | 300–900 MHz | 5 W | BGA 1515 | DMI 3.0 | August 2018 | HE8067702739859 | $281 |