HOTPAC: programs for thermal analysis including version 3.0 of the TXYZ program, TXYZ 30, and the thermal multilayer program, TML /
Albers, John.
National Institute of Standards and Technology (U.S.)
Gaithersburg, MD : U.S. Dept. of Commerce, National Institute of Standards and Technology Washington, DC : For sale by the Supt. of Docs., U.S. G.P.O.,
1995.
"August 1995."
Includes bibliographical references.
Semiconductors
Thermal analysis