Advances in CMP/polishing technologies for the manufacture of electronic devices /
Doi, Toshiro K.,1947-
Marinescu, Ioan D.
Kurokawa, Syuhei.
Oxford ; Waltham, MA : Elsevier,
2012.
CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components.  --P. 4 of cover.
CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components.  --P. 4 of cover.
Includes bibliographical references and index.
Grinding and polishing.
Chemical mechanical planarization.
Electrolytic polishing.